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WO2025237543A1 - Pâte de production d'une liaison articulée, utilisation de ladite pâte, et procédé d'établissement d'une liaison articulée - Google Patents

Pâte de production d'une liaison articulée, utilisation de ladite pâte, et procédé d'établissement d'une liaison articulée

Info

Publication number
WO2025237543A1
WO2025237543A1 PCT/EP2024/081317 EP2024081317W WO2025237543A1 WO 2025237543 A1 WO2025237543 A1 WO 2025237543A1 EP 2024081317 W EP2024081317 W EP 2024081317W WO 2025237543 A1 WO2025237543 A1 WO 2025237543A1
Authority
WO
WIPO (PCT)
Prior art keywords
paste
oxide particles
metal oxide
reducing agent
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/EP2024/081317
Other languages
German (de)
English (en)
Inventor
Andreas SY
Sven Mönninghoff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stannol GmbH and Co KG
Original Assignee
Stannol GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stannol GmbH and Co KG filed Critical Stannol GmbH and Co KG
Publication of WO2025237543A1 publication Critical patent/WO2025237543A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
    • B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/34—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material comprising compounds which yield metals when heated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
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    • C04B37/025—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of glass or ceramic material
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    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
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    • H—ELECTRICITY
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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Definitions

  • Paste for creating a joining joint as well as the use of this paste and methods for creating a joining joint
  • the invention relates to a paste for creating a bond, a use of this paste, and a joining method.
  • the bond makes it possible to join electronic components as well as components with metallic surfaces, but also those made of ceramic or glass, of various sizes and dimensions, such as pipes, plates, electronic components, etc.
  • Soldering is a well-established and proven method for electrically connecting electronic components, dating back decades. Over the years, the demands placed on such soldered connections, particularly regarding durability, have steadily increased. These demands are especially high in modern high-performance electronics, offshore applications, electric vehicles, and similar fields. These electronics often feature very fine structures, must withstand harsh environmental conditions, and/or exhibit exceptional durability and a long service life.
  • solder a sintering paste containing metallic particles is used. During the sintering process, not the entire contact between the components and the solder melts as it does in soldering; instead, only the surfaces of the particles in the sintering paste melt and, upon solidification, fuse together with each other and with the surfaces being joined.
  • EP 4 324 578 Al and WO 2022/214228 Al describe pastes for sintering electronic components.
  • the metallic component is silver in the form of silver flakes and silver particles coated with a special material. Aliphatic solvents are also included.
  • a disadvantage of using silver sintering pastes is the high price of silver, which then also This makes the sintering process expensive.
  • the sintering process often has to take place under a protective gas atmosphere, usually consisting of nitrogen and/or formic acid.
  • the components to be joined are also subjected to increased pressure during the sintering process. Therefore, the required equipment is also complex and expensive.
  • Another option for a paste is to use copper as the metallic material. This is less expensive than silver, but also less noble. To prevent corrosion or oxidation of the copper and thus a poorer sintering result, the sintering process must also take place under a protective atmosphere, for example, under a nitrogen and/or formic acid atmosphere and increased pressure. This also makes the sintering process complex and expensive.
  • EP 2 799 164 Al describes a paste that can contain metal particles made of different metals or alloys thereof, namely copper, silver, gold, nickel, palladium, platinum, or aluminum. These metal particles may also be partially oxidized, for example, surface-oxidized. The oxygen content of these metal particles is preferably in the range of 0.01 to 0.15 wt% based on the total weight of the metal particles. Furthermore, the metal particles have a coating consisting of one or more aliphatic compounds. However, the coating of the metal particles represents an additional manufacturing step, which increases the cost of producing the paste. A pressureless sintering process is also described. However, the time required for this pressureless process is very long, at one hour, which also makes the process expensive.
  • EP 4 306 234 Al describes a process for producing a sintering paste from elemental copper, a binder, copper formate, and a complexing agent. To create a sintered joint using the sintering paste thus produced, increased pressure is applied to the components to be joined, and a protective atmosphere of nitrogen or a similar substance is required. A nitrogen-formic acid mixture is necessary, which makes the process expensive here as well, as already described.
  • US Patent 2008/0237851 describes, among other things, a process for manufacturing a semiconductor device in which an electrode of a semiconductor element is connected to a conductor.
  • a bonding material containing copper oxide and a reducing agent is applied to the surface of the semiconductor device to be connected and then heated under a reducing atmosphere, such as hydrogen, to create a conductive connection.
  • a nitrogen atmosphere is used for cooling.
  • this process is complex and expensive to implement using the necessary equipment.
  • German patent DE 10 2011 083 893 Al describes a starting material for a sintered compound. This consists of sinterable particles of a metal or a metal compound such as a metal oxide and a flux, which simultaneously acts as a solvent and a reducing agent. Additional inert solvents are explicitly not used. However, this has the disadvantage that reduction of the metal oxide can occur even before the sintering process, and the starting material may therefore have a limited lifespan.
  • the object of the invention is therefore to avoid the aforementioned disadvantages and to provide a paste that is more cost-effective to produce and in which the joining process can be carried out under normal atmospheric conditions and without increased pressure, whereby, in addition to joining connections on metallic surfaces, joining connections with ceramic materials and with glass can also be produced. Furthermore, it is an object of the invention to provide a use for such a paste and to develop a method for joining the aforementioned components.
  • the metallic component used is metal oxide particles and/or mixed metal oxide particles and/or a mixture of metal oxide particles. These are already oxidized and can therefore be processed under normal atmosphere; a protective atmosphere is not required.
  • An inert polyether serves as the solvent for the paste according to the invention. This also includes a mixture of different polyethers, which is expressly encompassed by the invention. The addition of the polyether reduces the paste's susceptibility to oxygen. To regenerate elemental metal from the metal oxide, mixed metal oxide, or mixture of metal oxide particles, which forms an electrical, mechanical, and/or thermal connection between the components, at least one reducing agent is added to the paste.
  • this reducing agent reduces the metal oxide, mixed metal oxide, or mixture of metal oxide particles, so that elemental metal is regenerated.
  • the reducing agent itself has such a low boiling point that it at least partially evaporates during joining. This allows for the simple and cost-effective creation of an electrical, mechanical, and/or thermal connection between the components or joining partners.
  • the paste is also significantly less expensive to produce than, for example, a silver sintering paste. This makes it economically viable to join larger components using the paste according to the invention.
  • the reducing agent evaporates completely during the joining process, leaving no residue. Additional cleaning of the joint is then unnecessary, further reducing the cost of the process.
  • an aromatic compound is used as the reducing agent; more preferably, a 1,3,4-substituted aromatic compound is used; and most preferably, the reducing agent is selected from the group of benzoic acid derivatives and/or benzaldehyde derivatives. Mixtures of different substances are also possible. Furthermore, the reducing agent can be selected to be harmless to health and the environment, which offers advantages for operators and the environment.
  • the metal oxide particles and/or mixed metal oxide particles are nanostructured and/or nanoporous. This allows for a particularly good and uniform distribution of the particles in the paste, resulting in a particularly good and uniform joining effect.
  • copper(II) oxide particles are used as the metal oxide particles.
  • the resulting compound exhibits good thermal and electrical properties. This is particularly advantageous for the fabrication of connections between electronic components, especially for high-performance electronics.
  • PEG polyethylene glycol
  • PEG polyethylene glycol
  • the proportion of metal oxide particles and/or mixed metal oxide particles and/or the mixture of metal oxide particles in the paste is 30 wt% to 70 wt%, preferably in the range of 50 wt% to 60 wt%.
  • the proportion of reducing agent is preferably approximately 20%.
  • the remainder of the paste consists of the polyether and, optionally, additives.
  • the metal oxides or mixed metal oxides or mixtures of metal oxide particles that can be used include, but are not limited to, the oxides of copper, zinc, iron, magnesium, cobalt, nickel, manganese, tin, gallium, chromium, gold, silver, antimony, aluminum, as well as platinum, palladium, and their alloys.
  • Metal oxides and mixed metal oxides containing 30 wt% to 100 wt% copper oxide and/or 30 wt% to 100 wt% silver oxide are particularly preferred.
  • the reducing agent is applied externally to the metal oxide particles and/or mixed metal oxide particles and/or the mixture of metal oxide particles and/or is embedded in the pores of the particles.
  • the metal oxide particles and/or mixed metal oxide particles and/or the mixture of metal oxide particles then serve as a binder for the reducing agent. This results in a particularly good and uniform distribution of the reducing agent within the paste.
  • the invention also encompasses the use of a paste according to the invention for joining components.
  • a paste according to the invention for joining components.
  • two or more components are electrically, mechanically, and/or thermally joined to one another by a sintering process.
  • Another use of the paste is to create a conductive structure on a substrate, such as a ceramic substrate or similar material. This allows, for example, the production of printed circuit boards and similar objects for contacting electronic components.
  • the invention comprises an additional solution tailored to the paste, namely a sinter flux.
  • This contains ascorbic acid and/or Adipic acid in aqueous or alcoholic solution enables the joining of a wider range of materials, such as metals or their alloys, including copper, iron, brass, aluminum and their alloys, as well as glass and ceramics. This opens up further fields of application for the paste and process according to the invention.
  • the invention also includes a method for producing a joining connection between at least two components using the paste according to the invention described above.
  • the method steps comprise:
  • the paste can be printed onto at least one of the components.
  • Pad printing and/or screen printing are particularly common methods, but other printing processes are also possible.
  • other methods of applying the paste to the component are conceivable, especially, but not exclusively, dispensing, jetting, pin transfer, and/or spraying.
  • the joining process creates a connection between the components that is suitable for any type of structure, both very large and very fine, and provides a secure and long-lasting electrical, mechanical and/or thermal contact.
  • the components are subjected to a thermal treatment for a certain period of time to reduce the metal oxide, mixed metal oxide, or mixture of metal oxide particles, thereby creating the bond.
  • the temperature can be approximately 250 °C.
  • the duration of this treatment can be between 5 and 10 minutes, preferably 8 minutes. This results in a good reduction of the metal oxide or mixed metal oxide or the mixture of metal oxides instead, and the remaining reducing agent as well as other products that arise from the reduction of the oxide evaporate.
  • the paste is heated before being applied to the surface of a joining partner, thus eliminating the need for thermal treatment of the components.
  • the paste can be contained in a cartridge that can be heated, at least partially, and applied directly to the surface of the component to be joined. This saves on the costs of thermal treatment.
  • the components are protected because they do not have to be exposed to high temperatures, which is a significant advantage, especially for electronic components.
  • some or all of the surfaces to be joined can be pre-treated, either partially or completely, with a sintering flux.
  • the sintering flux can be sprayed onto the surface in question. This can then be followed by a drying process. If the sintering flux is an alcoholic solution, this drying process can be faster than with an aqueous solution.
  • the embodiments presented here are merely exemplary configurations of the invention.
  • the invention is not limited to these. Further modifications and adaptations are possible.
  • a different reducing agent can be selected.
  • the paste can also contain additional additives beyond those mentioned here.
  • the invention encompasses the use of metal oxides and/or mixed metal oxides and a suitable reducing agent to create a bond between at least two joining partners. These partners can have virtually any shape and size. It is possible to join joining partners made of the same material as well as those made of different materials. ...

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  • Organic Chemistry (AREA)
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Abstract

L'invention concerne une pâte pour établir une liaison articulée entre des pièces ou des partenaires d'assemblage, comprenant au moins un composant métallique. Selon l'invention, des particules d'oxyde métallique et/ou des particules d'oxyde mixte métallique et/ou un mélange de particules d'oxyde métallique sont utilisés en tant que composant métallique, un polyéther inerte est fourni en tant que solvant, et un agent réducteur est contenu, ce qui réduit les particules d'oxyde métallique et/ou les particules d'oxyde mixte métallique et/ou le mélange de particules d'oxyde métallique pendant le chauffage et s'échappe au moins partiellement. L'invention concerne en outre l'utilisation d'une pâte selon l'invention pour relier électriquement, mécaniquement et/ou thermiquement au moins deux pièces ou partenaires d'assemblage au moyen d'un procédé de frittage. Enfin, le concept de l'invention comprend également un procédé comprenant au moins les étapes suivantes : - l'application de la pâte sur au moins une première pièce, - la mise en place d'au moins une autre pièce de sorte que la pâte appliquée soit disposée entre les deux pièces sur leurs surfaces à relier.
PCT/EP2024/081317 2024-05-16 2024-11-06 Pâte de production d'une liaison articulée, utilisation de ladite pâte, et procédé d'établissement d'une liaison articulée Pending WO2025237543A1 (fr)

Applications Claiming Priority (2)

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DE102024113821.1A DE102024113821A1 (de) 2024-05-16 2024-05-16 Paste zum Herstellen einer Fügeverbindung sowie Verwendung dieser Paste und Verfahren zur Herstellung einer Fügeverbindung
DE102024113821.1 2024-05-16

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Citations (7)

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US20080237851A1 (en) 2007-03-28 2008-10-02 Toshiaki Morita Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof
DE102011083893A1 (de) 2011-09-30 2013-04-04 Robert Bosch Gmbh Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung
EP2799164A1 (fr) 2013-05-03 2014-11-05 Heraeus Materials Technology GmbH & Co. KG Pâte de frittage améliorée dotée de particules métalliques partiellement oxydées
WO2022214228A1 (fr) 2021-04-09 2022-10-13 Heraeus Deutschland GmbH & Co. KG Préparation de frittage d'argent et son utilisation pour la connexion de composants électroniques
EP4306234A1 (fr) 2022-07-15 2024-01-17 Technische Hochschule Ingolstadt Pâte de frittage et procédé de production d'une pâte de frittage
US20240033860A1 (en) * 2020-12-16 2024-02-01 Heraeus Deutschland GmbH & Co. KG Sintering paste and use thereof for connecting components
EP4324578A1 (fr) 2022-08-17 2024-02-21 Heraeus Electronics GmbH & Co. KG Pâte de frittage d'argent et son utilisation pour relier des composants

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Publication number Priority date Publication date Assignee Title
US11027374B2 (en) 2015-11-20 2021-06-08 Sekisui Chemical Co., Ltd. Particles, connecting material and connection structure
US20210162551A1 (en) 2017-12-18 2021-06-03 Dic Corporation Copper fine particle sintered body
US20240300055A1 (en) 2021-07-06 2024-09-12 Resonac Corporation Metal paste for joining, joint, and manufacturing method therefor

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Publication number Priority date Publication date Assignee Title
US20080237851A1 (en) 2007-03-28 2008-10-02 Toshiaki Morita Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof
DE102011083893A1 (de) 2011-09-30 2013-04-04 Robert Bosch Gmbh Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung
EP2799164A1 (fr) 2013-05-03 2014-11-05 Heraeus Materials Technology GmbH & Co. KG Pâte de frittage améliorée dotée de particules métalliques partiellement oxydées
US20240033860A1 (en) * 2020-12-16 2024-02-01 Heraeus Deutschland GmbH & Co. KG Sintering paste and use thereof for connecting components
WO2022214228A1 (fr) 2021-04-09 2022-10-13 Heraeus Deutschland GmbH & Co. KG Préparation de frittage d'argent et son utilisation pour la connexion de composants électroniques
EP4306234A1 (fr) 2022-07-15 2024-01-17 Technische Hochschule Ingolstadt Pâte de frittage et procédé de production d'une pâte de frittage
EP4324578A1 (fr) 2022-08-17 2024-02-21 Heraeus Electronics GmbH & Co. KG Pâte de frittage d'argent et son utilisation pour relier des composants

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