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WO2025230337A1 - Carte de circuit imprimé fournissant une structure de dissipation de chaleur et dispositif électronique la comprenant - Google Patents

Carte de circuit imprimé fournissant une structure de dissipation de chaleur et dispositif électronique la comprenant

Info

Publication number
WO2025230337A1
WO2025230337A1 PCT/KR2025/005925 KR2025005925W WO2025230337A1 WO 2025230337 A1 WO2025230337 A1 WO 2025230337A1 KR 2025005925 W KR2025005925 W KR 2025005925W WO 2025230337 A1 WO2025230337 A1 WO 2025230337A1
Authority
WO
WIPO (PCT)
Prior art keywords
resist layer
circuit board
implemented
electronic device
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/KR2025/005925
Other languages
English (en)
Korean (ko)
Inventor
정연경
이해진
안요섭
예재흥
이영선
조현
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020240088022A external-priority patent/KR20250158579A/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2025230337A1 publication Critical patent/WO2025230337A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • Embodiments of the present disclosure relate to electronic devices, for example, circuit boards and electronic devices including the same.
  • Electronic devices can refer to devices that perform specific functions based on the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio/video devices, desktop/laptop computers, or car navigation systems. For example, these electronic devices can output stored information as audio or video.
  • a single electronic device such as a mobile communication terminal, can now be equipped with a variety of functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller and more portable for users.
  • a circuit board may include an upper resist layer, a lower resist layer, and a plurality of insulating layers and a plurality of wiring layers alternately stacked between the upper resist layer and the lower resist layer.
  • an insulating layer and a wiring layer closest to the upper resist layer or the lower resist layer may be implemented by resin coated copper.
  • an electronic device may include a housing including a first plate and a second plate arranged facing in an opposite direction of the first plate, a circuit board arranged between the first plate and the second plate, the circuit board being as described above or as described below, and an electrical/electronic component arranged on the circuit board.
  • a circuit board may include an upper resist layer comprising an aluminum (Al)-based filler of 73% or more and 82% or less or a magnesium (Mg)-based filler of 73% or more and 82% or less, a lower resist layer comprising an aluminum (Al)-based filler of 73% or more and 82% or less or a magnesium (Mg)-based filler of 73% or more and 82% or less, and a plurality of insulating layers and a plurality of wiring layers alternately stacked between the upper resist layer and the lower resist layer.
  • an upper resist layer comprising an aluminum (Al)-based filler of 73% or more and 82% or less or a magnesium (Mg)-based filler of 73% or more and 82% or less
  • Mg magnesium
  • an insulating layer and a wiring layer closest to the upper resist layer or the lower resist layer may be implemented by RCC.
  • an insulating layer implemented by RCC may not include glass fiber.
  • FIG. 1 is a block diagram illustrating an electronic device within a network environment according to one embodiment of the present disclosure.
  • FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment of the present disclosure.
  • FIG. 3 is a perspective view showing the rear side of the electronic device illustrated in FIG. 2 according to one embodiment of the present disclosure.
  • FIG. 4 is an exploded perspective view showing the front side of an electronic device according to one embodiment of the present disclosure.
  • FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment of the present disclosure.
  • FIG. 6 is a drawing showing a circuit board according to one embodiment of the present disclosure.
  • FIG. 7 is a drawing showing a circuit board according to one embodiment of the present disclosure.
  • FIG. 8 is a cross-sectional view showing a portion of an electronic device along line A-A' of FIG. 3, according to one embodiment of the present disclosure.
  • the operating environment within electronic devices may become more challenging.
  • electrical/electronic components such as processors or communication modules, may generate heat during operation, and it may be difficult to dissipate this heat to the outside within the confined internal space.
  • the heat accumulated within the electronic device can further deteriorate the operating environment of the electrical/electronic components.
  • heat dissipation structures that disperse or dissipate heat, such as vapor chambers or heat pipes, are used to suppress the deterioration of the internal operating environment of electronic devices, the improvement in heat dissipation performance is sluggish compared to the degree of performance improvement of the electrical/electronic components.
  • One embodiment of the present disclosure is intended to at least resolve the above-described problems and/or disadvantages and provide at least the advantages described below, and may provide a circuit board providing a heat dissipation structure and/or an electronic device including the same.
  • One embodiment of the present disclosure can provide an electronic device with improved internal operating environment without affecting the actual size or shape by implementing a heat dissipation structure using an already arranged circuit board.
  • FIG. 1 is a block diagram of an electronic device (1001) within a network environment (1000) according to one embodiment of the present disclosure.
  • the electronic device (1001) may communicate with the electronic device (1002) via a first network (1098) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (1004) or the server (1008) via a second network (1099) (e.g., a long-range wireless communication network).
  • the electronic device (1001) may communicate with the electronic device (1004) via the server (1008).
  • the electronic device (1001) may include a processor (1020), a memory (1030), an input module (1050), an audio output module (1055), a display module (1060), an audio module (1070), a sensor module (1076), an interface (1077), a connection terminal (1078), a haptic module (1079), a camera module (1080), a power management module (1088), a battery (1089), a communication module (1090), a subscriber identification module (1096), or an antenna module (1097).
  • the electronic device (1001) may omit at least one of these components (e.g., the connection terminal (1078)), or may have one or more other components added. In one embodiment, some of these components (e.g., sensor module (1076), camera module (1080), or antenna module (1097)) may be integrated into one component (e.g., display module (1060)).
  • the processor (1020) may, for example, execute software (e.g., a program (1040)) to control at least one other component (e.g., a hardware or software component) of the electronic device (1001) connected to the processor (1020) and perform various data processing or operations.
  • the processor (1020) may store commands or data received from other components (e.g., a sensor module (1076) or a communication module (1090)) in the volatile memory (1032), process the commands or data stored in the volatile memory (1032), and store result data in the non-volatile memory (1034).
  • the processor (1020) may include a main processor (1021) (e.g., a central processing unit or an application processor), or an auxiliary processor (1023) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1021).
  • a main processor (1021) e.g., a central processing unit or an application processor
  • an auxiliary processor (1023) e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor
  • the auxiliary processor (1023) may be configured to use less power than the main processor (1021) or to be specialized for a given function.
  • the auxiliary processor (1023) may be implemented separately from the main processor (1021) or as a part thereof.
  • the auxiliary processor (1023) may control at least a portion of functions or states associated with at least one component (e.g., the display module (1060), the sensor module (1076), or the communication module (1090)) of the electronic device (1001), for example, on behalf of the main processor (1021) while the main processor (1021) is in an inactive (e.g., sleep) state, or together with the main processor (1021) while the main processor (1021) is in an active (e.g., application execution) state.
  • the auxiliary processor (1023) e.g., an image signal processor or a communication processor
  • the auxiliary processor (1023) may include a hardware structure specialized for processing artificial intelligence models.
  • the artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (1001) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1008)).
  • the learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above.
  • the artificial intelligence model can include a plurality of artificial neural network layers.
  • the artificial neural network can be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the examples described above.
  • the artificial intelligence model can additionally or alternatively include a software structure.
  • the memory (1030) can store various data used by at least one component (e.g., the processor (1020) or the sensor module (1076)) of the electronic device (1001).
  • the data can include, for example, software (e.g., the program (1040)) and input data or output data for commands related thereto.
  • the memory (1030) can include volatile memory (1032) or non-volatile memory (1034).
  • the program (1040) may be stored as software in memory (1030) and may include, for example, an operating system (1042), middleware (1044), or an application (1046).
  • the input module (1050) can receive commands or data to be used in a component of the electronic device (1001) (e.g., a processor (1020)) from an external source (e.g., a user) of the electronic device (1001).
  • the input module (1050) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).
  • the audio output module (1055) can output audio signals to the outside of the electronic device (1001).
  • the audio output module (1055) can include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes, such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.
  • the display module (1060) can visually provide information to an external party (e.g., a user) of the electronic device (1001).
  • the display module (1060) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device.
  • the display module (1060) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module (1070) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (1070) can acquire sound through the input module (1050), output sound through the sound output module (1055), or an external electronic device (e.g., electronic device (1002)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1001).
  • an external electronic device e.g., electronic device (1002)
  • an external electronic device e.g., electronic device (1002)
  • speaker or headphone directly or wirelessly connected to the electronic device (1001).
  • the sensor module (1076) can detect the operating status (e.g., power or temperature) of the electronic device (1001) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status.
  • the sensor module (1076) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface (1077) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1001) to an external electronic device (e.g., the electronic device (1002)).
  • the interface (1077) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • connection terminal (1078) may include a connector through which the electronic device (1001) may be physically connected to an external electronic device (e.g., electronic device (1002)).
  • the connection terminal (1078) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).
  • the haptic module (1079) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations.
  • the haptic module (1079) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module (1080) can capture still images and videos.
  • the camera module (1080) may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module (1088) can manage power supplied to the electronic device (1001).
  • the power management module (1088) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • a battery (1089) may power at least one component of the electronic device (1001).
  • the battery (1089) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • the communication module (1090) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1001) and an external electronic device (e.g., electronic device (1002), electronic device (1004), or server (1008)), and the performance of communication through the established communication channel.
  • the communication module (1090) may operate independently from the processor (1020) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • the communication module (1090) may include a wireless communication module (1092) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1094) (e.g., a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module (1092) e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • a wired communication module (1094) e.g., a local area network (LAN) communication module, or a power line communication module.
  • the corresponding communication module can communicate with an external electronic device via a first network (1098) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1099) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)).
  • a first network e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network (1099) e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)
  • a computer network
  • the wireless communication module (1092) can verify or authenticate the electronic device (1001) within a communication network such as the first network (1098) or the second network (1099) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1096).
  • subscriber information e.g., an international mobile subscriber identity (IMSI)
  • the wireless communication module (1092) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology).
  • NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimizing terminal power and connecting multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency communications
  • the wireless communication module (1092) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate.
  • a high-frequency band e.g., mmWave band
  • the wireless communication module (1092) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module (1092) may support various requirements specified in the electronic device (1001), an external electronic device (e.g., the electronic device (1004)), or a network system (e.g., the second network (1099)).
  • the wireless communication module (1092) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.
  • a peak data rate e.g., 20 Gbps or more
  • a loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip
  • the antenna module (1097) can transmit or receive signals or power to or from an external device (e.g., an external electronic device).
  • the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB).
  • the antenna module (1097) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1098) or the second network (1099), may be selected from the plurality of antennas by, for example, the communication module (1090). A signal or power may be transmitted or received between the communication module (1090) and an external electronic device via the selected at least one antenna.
  • another component e.g., a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module (1097) may form a mmWave antenna module.
  • the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.
  • a first side e.g., a bottom side
  • a plurality of antennas e.g., an array antenna
  • At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).
  • peripheral devices e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).
  • commands or data may be transmitted or received between the electronic device (1001) and an external electronic device (1004) via a server (1008) connected to a second network (1099).
  • Each of the external electronic devices (1002 or 1004) may be the same or a different type of device as the electronic device (1001).
  • all or part of the operations executed in the electronic device (1001) may be executed in one or more of the external electronic devices (1002, 1004, or 1008). For example, when the electronic device (1001) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1001) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service.
  • One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1001).
  • the electronic device (1001) may process the result as is or additionally and provide it as at least a portion of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example.
  • the electronic device (1001) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example.
  • the external electronic device (1004) may include an Internet of Things (IoT) device.
  • the server (1008) may be an intelligent server utilizing machine learning and/or a neural network.
  • the external electronic device (1004) or the server (1008) may be included in the second network (1099).
  • the electronic device (1001) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • Electronic devices may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to embodiments of the present disclosure are not limited to the aforementioned devices.
  • first,” “second,” or “first” or “second” may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order).
  • a component e.g., a first component
  • another component e.g., a second component
  • functionally e.g., a third component
  • module used in various embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit.
  • a module may be an integrally formed component, or a minimum unit or part of such a component that performs one or more functions.
  • a module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present disclosure may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device).
  • a processor e.g., a processor
  • the machine may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one instruction called.
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the machine-readable storage medium may be provided in the form of a non-transitory storage medium.
  • non-transitory only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily in the storage medium.
  • a signal e.g., electromagnetic waves
  • the method according to various embodiments of the present disclosure may be provided as included in a computer program product.
  • the computer program product may be traded as a product between a seller and a buyer.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store TM ) or directly between two user devices (e.g., smartphones).
  • an application store e.g., Play Store TM
  • at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.
  • each component e.g., a module or a program of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components.
  • one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added.
  • a plurality of components e.g., a module or a program
  • the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration.
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.
  • the longitudinal direction, the width direction, and/or the thickness direction of the electronic device may be mentioned, and the longitudinal direction may be defined as the 'Y-axis direction', the width direction as the 'X-axis direction', and/or the thickness direction as the 'Z-axis direction'.
  • 'negative/positive (-/+)' may be mentioned together with the rectangular coordinate system illustrated in the drawings.
  • the front of the electronic device and/or the housing may be defined as the 'side facing the +Z direction', and the back side may be defined as the 'side facing the -Z direction'.
  • the side of the electronic device and/or the housing may include a region facing the +X direction, a region facing the +Y direction, a region facing the -X direction, and/or a region facing the -Y direction.
  • the 'X-axis direction' may mean both the '-X direction' and the '+X direction'. It should be noted that this is based on the rectangular coordinate system illustrated in the drawings for the sake of brevity of description, and that the description of these directions or components does not limit the embodiment(s) of the present disclosure. For example, depending on the design specifications of the electronic device or the user's usage habits, the orthogonal coordinate system may be defined differently from that in the present disclosure.
  • FIG. 2 is a perspective view showing the front side of an electronic device (100) according to one embodiment of the present disclosure.
  • FIG. 3 is a perspective view showing the rear side of the electronic device (100) illustrated in FIG. 2 according to one embodiment of the present disclosure.
  • an electronic device (100) may include a housing (110) that includes a first side (or front side) (110A), a second side (or back side) (110B), and a side surface (110C) that surrounds a space between the first side (110A) and the second side (110B).
  • the housing (110) may also refer to a structure that forms a portion of the first side (110A) of FIG. 2, the second side (110B) of FIG. 3, and the side surface (110C).
  • the first side (110A) may be formed by a front plate (102) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers).
  • the second side (110B) may be formed by a substantially opaque back plate (111).
  • the back plate (111) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.
  • the side surface (110C) may be formed by a side structure (or “side bezel structure”) (118) that is joined to the front plate (102) and the back plate (111) and comprises a metal and/or a polymer.
  • the back plate (111) and the side structure (118) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).
  • the front plate (102) may include a seamlessly extending region(s) that curves toward the rear plate (111) at least along a portion of an edge.
  • the front plate (102) (or the rear plate (111)) may include only one of the curved and extending regions toward the rear plate (111) (or the front plate (102)) at one edge of the first surface (110A).
  • the front plate (102) or the rear plate (111) may be substantially flat.
  • the curved and extending region may not be included.
  • the thickness of the electronic device (100) in the portion that includes the curved and extending region may be smaller than that of other portions.
  • the electronic device (100) may include at least one of a display (101), an audio module (e.g., a microphone hole (103), an external speaker hole (107), a call receiver hole (114)), a sensor module (e.g., a first sensor module (104), a second sensor module (not shown), a third sensor module (119)), a camera module (e.g., a first camera device (105), a second camera device (112), a flash (113)), a key input device (117), a light-emitting element (106), and a connector hole (e.g., a first connector hole (108), a second connector hole (109)).
  • the electronic device (100) may omit at least one of the components (e.g., the key input device (117) or the light-emitting element (106)) or may additionally include another component.
  • the display (101) may output a screen or be visually exposed, for example, through a significant portion of the first surface (110A) (e.g., the front plate (102)). In one embodiment, at least a portion of the display (101) may be visually exposed through the front plate (102) forming the first surface (110A) or through a portion of a side surface (110C). In one embodiment, the corners of the display (101) may be formed to be substantially the same as the adjacent outer shape of the front plate (102). In one embodiment (not shown), in order to expand the area where the display (101) is visually exposed, the gap between the outer edge of the display (101) and the outer edge of the front plate (102) may be formed to be substantially the same.
  • a recess or opening may be formed in a part of a screen display area of the display (101), and at least one or more of an audio module (e.g., a call receiver hole (114)), a sensor module (e.g., a first sensor module (104)), a camera module (e.g., a first camera device (105)), and a light-emitting element (106) may be included aligned with the recess or opening.
  • an audio module e.g., a call receiver hole (114)
  • a sensor module e.g., a first sensor module (104)
  • a camera module e.g., a first camera device (105)
  • a light-emitting element (106) may be included aligned with the recess or opening.
  • an audio module e.g., a call receiver hole (114)
  • a sensor module e.g., a first sensor module (104)
  • a camera module e.g., a first camera device (105)
  • a fingerprint sensor not shown
  • a light-emitting element may be included on the back surface of the screen display area of the display (101).
  • the display (101) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer capable of detecting a magnetic field-type stylus pen.
  • the front plate (102) or the rear plate (111) includes a curved and extended area(s)
  • at least a portion of the sensor module e.g., the first sensor module (104), the third sensor module (119)
  • at least a portion of the key input device (117) may be disposed in the curved and extended area(s).
  • the audio module (103, 107, 114) may include a microphone hole (103) and a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)).
  • the microphone hole (103) may have a microphone disposed inside to acquire external sound, and in one embodiment, multiple microphones may be disposed to detect the direction of the sound.
  • the speaker hole may include an external speaker hole (107) and a call receiver hole (114).
  • the speaker hole e.g., an external speaker hole (107), a call receiver hole (114)
  • the microphone hole (103) may be implemented as a single hole, or a speaker may be included (e.g., a piezo speaker) without a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114)).
  • the sensor module can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (100) or an external environmental state.
  • the sensor module may include, for example, a first sensor module (104) (e.g., a proximity sensor) and/or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (110A) of the housing (110), and/or a third sensor module (119) disposed on a second surface (110B) of the housing (110).
  • the second sensor module (not shown) (e.g., a fingerprint sensor) may be disposed on not only the first surface (110A) (e.g., the display (101)) of the housing (110), but also the second surface (110B) or the side surface (110C).
  • the electronic device (100) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the camera module may include a first camera device (105) disposed on a first surface (110A) of the electronic device (100), a second camera device (112) disposed on a second surface (110B), and/or a flash (113).
  • the camera devices e.g., the first camera device (105), the second camera device (112)
  • the flash (113) may include, for example, a light-emitting diode or a xenon lamp.
  • one or more lenses an infrared camera, a wide-angle lens, and a telephoto lens
  • image sensors may be disposed on one surface of the electronic device (100).
  • the flash (113) may emit infrared light, and infrared light emitted by the flash (113) and reflected by a subject may be received via the third sensor module (119).
  • the electronic device (100) or the processor of the electronic device (100) e.g., the processor (1020) of FIG. 1 can detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module (119).
  • the key input device (117) may be disposed on a side surface (110C) of the housing (110).
  • the electronic device (100) may not include some or all of the above-mentioned key input devices (117), and the key input devices (117) that are not included may be implemented in other forms, such as soft keys, on the display (101).
  • the key input device may include a sensor module disposed on a second surface (110B) of the housing (110).
  • the light emitting element (106) may be disposed, for example, on the first surface (110A) of the housing (110).
  • the light emitting element (106) may provide, for example, status information of the electronic device (100) in the form of light.
  • the light emitting element (106) may provide a light source that is linked to the operation of, for example, a camera module (e.g., the first camera device (105)).
  • the light emitting element (106) may include, for example, a light emitting diode (LED), an infrared LED, and a xenon lamp.
  • the connector hole may include a first connector hole (108) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and/or data with an external electronic device (e.g., the electronic device (1002) of FIG. 1), and/or a second connector hole (e.g., an earphone jack) (109) that can accommodate a connector for transmitting and receiving audio signals with the external electronic device.
  • a connector e.g., a USB connector
  • an external electronic device e.g., the electronic device (1002) of FIG. 1
  • a second connector hole e.g., an earphone jack
  • FIG. 4 is an exploded perspective view showing a front side of an electronic device (200) (e.g., the electronic device (100) illustrated in FIG. 2) according to one embodiment of the present disclosure.
  • FIG. 5 is an exploded perspective view showing a rear side of an electronic device (200) (e.g., the electronic device (100) illustrated in FIG. 2) according to one embodiment of the present disclosure.
  • the electronic device (200) may include a side structure (210), a first support member (211) (e.g., a bracket), a front plate (220) (e.g., the front plate (102) of FIG. 1), a display (230) (e.g., the display (101) of FIG. 1), a printed circuit board (or board assembly) (240), a battery (250), a second support member (260) (e.g., a rear case), an antenna (not shown) (e.g., the antenna module (1097) of FIG.
  • the electronic device (200) may omit at least one of the components (e.g., the first support member (211) or the second support member (260)) or may additionally include another component. At least one of the components of the electronic device (200) may be identical or similar to at least one of the components of the electronic device (100) of FIG. 2 or FIG. 3, and any redundant description will be omitted below.
  • the first support member (211) may be disposed inside the electronic device (200) and connected to the side structure (210), or may be formed integrally with the side structure (210).
  • the first support member (211) may be formed of, for example, a metallic material and/or a non-metallic (e.g., polymer) material. When formed at least partially of a metallic material, the side structure (210) or a portion of the first support member (211) may function as an antenna.
  • the first support member (211) may be, for example, plate-shaped and may support a plate-shaped structure or component.
  • a display (230) may be coupled to one surface of the first support member (211) and a printed circuit board (240) may be disposed on the other surface.
  • a printed circuit board (240) may be equipped with a processor (e.g., processor (1020) of FIG. 1), a memory (e.g., memory (1030) of FIG. 1), and/or an interface (e.g., interface (1077) of FIG. 1).
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the processor and/or memory may refer to one of circuit devices mounted on an electrical/electronic component such as an integrated circuit chip.
  • the first support member (211) and the side structure (210) may be combined to be referred to as a front case or housing (201).
  • the housing (201) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (240) or a battery (250).
  • the housing (201) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (200), for example, a side structure (210), a front plate (220), and/or a rear plate (280).
  • the 'front or rear surface of the housing (201)' may refer to the first surface (110A) of FIG. 2 or the second surface (110B) of FIG. 3.
  • the first support member (211) is positioned between the front plate (220) (e.g., the first side (110A) of FIG. 2) and the back plate (280) (e.g., the second side (110B) of FIG. 3) and may function as a structure for positioning electrical/electronic components such as a printed circuit board (240) or a camera assembly (207).
  • the display (230) may include a display panel (231) and a flexible printed circuit board (233) extending from the display panel (231).
  • the flexible printed circuit board (233) may be understood to be electrically connected to the display panel (231) while being disposed, for example, at least partially on the rear surface of the display panel (231).
  • reference numeral '231' may be understood to be a protective sheet disposed on the rear surface of the display panel.
  • the protective sheet may be understood to be a part of the display panel (231).
  • the protective sheet may function as a buffer structure (e.g., a low-density elastomer such as a sponge) that absorbs external force or an electromagnetic shielding structure (e.g., a copper sheet (CU sheet)).
  • the display (230) may be disposed on the inner surface of the front plate (220) and may output a screen through at least a portion of the first surface (110A) or the front plate (220) of FIG. 2 by including a light-emitting layer. As mentioned above, the display (230) may output a screen through substantially the entire area of the first surface (110A) or the front plate (220) of FIG. 2.
  • the memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device (200) to an external electronic device, for example, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the second support member (260) may include, for example, an upper support member (260a) and a lower support member (260b).
  • the upper support member (260a) may be arranged to surround the printed circuit board (240) together with a portion of the first support member (211).
  • the printed circuit board (240) may be substantially disposed between the first support member (211) and the second support member (260) (e.g., the upper support member (260a).
  • a circuit device implemented in the form of an integrated circuit chip e.g., a processor, a communication module, or a memory
  • various electrical/electronic components may be disposed on the printed circuit board (240).
  • the electrical/electronic components and/or the printed circuit board (240) may be provided with an electromagnetic shielding environment from the upper support member (260a).
  • at least one shield can (249) may be disposed on the printed circuit board (240).
  • the shield can (249) may provide an electromagnetic shielding environment to a portion or space on the printed circuit board (240).
  • the shield can (249) may be disposed to surround at least a portion of an integrated circuit chip on which a processor, a memory, and/or a communication module are mounted.
  • the shield The can (249) and/or electrical/electronic components may be understood as part of a printed circuit board (240).
  • the lower support member (260b) can be utilized as a structure for arranging electrical/electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card/MMC connector, or an audio connector).
  • electrical/electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card/MMC connector, or an audio connector) can be arranged on an additional printed circuit board (not shown).
  • the lower support member (260b) can be arranged to surround the additional printed circuit board together with another portion of the first support member (211).
  • a speaker module or interface arranged on an additional printed circuit board or lower support member (260b) not shown may be arranged corresponding to an audio module (e.g., a microphone hole (103) or a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114))) or a connector hole (e.g., a first connector hole (108), a second connector hole (109)) of FIG. 2.
  • an audio module e.g., a microphone hole (103) or a speaker hole (e.g., an external speaker hole (107), a call receiver hole (114))
  • a connector hole e.g., a first connector hole (108), a second connector hole (109)
  • the battery (250) is a device for supplying power to at least one component of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit board (240). The battery (250) may be disposed integrally within the electronic device (200), or may be disposed detachably from the electronic device (200).
  • the antenna may include a conductive pattern implemented on the surface of the first support member (211) and/or the surface of the second support member (260), for example, through a laser direct structuring (LDS) process.
  • the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (280) and the battery (250).
  • the antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.
  • another antenna structure may be formed by the side structure (210) and/or a portion of the first support member (211), or a combination thereof.
  • the camera assembly (207) may include at least one camera module. Within the electronic device (200), the camera assembly (207) may receive at least a portion of light incident through optical holes or camera windows (212a, 212b, 212c, 213, 219). In one embodiment, the camera assembly (207) may be disposed on the first support member (211) at a location adjacent to the printed circuit board (240). In one embodiment, the camera module(s) of the camera assembly (207) may be generally aligned with any one of the camera windows (212a, 212b, 212c, 213, 219) and may be at least partially wrapped around the second support member (260) (e.g., the upper support member (260a)).
  • the configuration of the electronic devices (1001, 1002, 1004, 100, 200) described above may be referred to. Even if not directly mentioned, the configuration of the embodiments described above may be similarly applied to the embodiments described below.
  • FIG. 6 is a drawing showing a circuit board (360a) according to one embodiment of the present disclosure.
  • a circuit board (360a) according to one embodiment of the present disclosure is illustrated in a cross-sectional view, and may be provided, for example, as the printed circuit board (240) of FIG. 4 or FIG. 5.
  • the circuit board (360a) may be a multi-layered circuit board in which a plurality of insulating layers (361n) and a plurality of wiring layers (363n) are alternately stacked.
  • the plurality of wiring layers (363n) are illustrated in the form of continuous lines (or plates) in the horizontal direction, but it should be noted that the embodiment(s) of the present disclosure are not limited thereto.
  • Each of the plurality of wiring layers (363n) may include a plurality of signal lines formed of an electrically conductive material, and it will be readily understood by those skilled in the art that, depending on the cut position, a form in which different signal lines are discontinuously arranged in one wiring layer (363n) or a form in which different portions of one signal line are discontinuously arranged may be illustrated.
  • the circuit board (360a) may include an upper resist layer (365a), a lower resist layer (365b), at least one insulating layer (361n), and at least one wiring layer (363n).
  • the circuit board (360a) may include a plurality of insulating layers (361n) and a plurality of wiring layers (363n) alternately arranged between the upper resist layer (365a) and the lower resist layer (365b).
  • the upper resist layer (365a) or the lower resist layer (365b) may be formed by a photo solder resist.
  • the upper resist layer (365a) and/or the lower resist layer (365b) can be provided by applying and/or curing a liquid solder resist to the surface of the outermost wiring layer (363n), or by laminating a film provided with a photosensitive solder resist to the surface of the outermost wiring layer (363n).
  • the upper resist layer (365a) or the lower resist layer (365b) can substantially isolate or protect the wiring layer (363n) provided therein or the wiring layer (363n) in direct contact therewith from the external environment.
  • the upper resist layer (365a) or the lower resist layer (365b) can be partially removed so that a portion of the wiring layer (363n) is exposed to the external space of the circuit board (360a).
  • other electrical/electronic components e.g., the electrical/electronic component (431) of FIG. 8 can electrically contact or couple to the circuit board (360a).
  • the upper resist layer (356a) or the lower resist layer (365b) may be formed of a resin, such as melamine or epoxy, and may include an aluminum (Al)-based filler and/or a magnesium (Mg)-based filler.
  • Al aluminum
  • Mg magnesium
  • the thermal conductivity of the upper resist layer (365a) or the lower resist layer (365b) may vary.
  • the upper resist layer (365a) or the lower resist layer (365b) may have a thermal conductivity of approximately 0.2 W/mK.
  • the upper resist layer (365a) or the lower resist layer (365b) when including an aluminum-based filler and/or a magnesium-based filler, may have a thermal conductivity of approximately 1.1 W/mK or more and 2.2 W/mK or less.
  • the circuit board (360a) when the upper resist layer (365a) or the lower resist layer (365b) includes an aluminum-based filler and/or a magnesium-based filler, the circuit board (360a) may function as a structure that moves, distributes, and/or releases heat.
  • the aluminum-based filler, such as Al 2 O 3 , in the upper resist layer (365a) or the lower resist layer (365b) may be greater than or equal to about 73% and less than or equal to about 82%.
  • the magnesium-based filler, such as MgO, in the upper resist layer (365a) or the lower resist layer (365b) may be greater than or equal to about 73% and less than or equal to about 82%.
  • the thermal conductivity of the upper resist layer (365a) or the lower resist layer (365b) may be greater than or equal to about 1.3 W/mK and less than or equal to about 2.1 W/mK.
  • the heat dissipation performance of the circuit board (360a) may be low.
  • the filler content is less than about 73%
  • the degree of improvement in thermal conductivity of the upper resist layer (365a) or the lower resist layer (365b) may be small compared to a resist layer that does not include the filler.
  • the thermal conductivity may be further increased.
  • the process of forming an opening in the upper resist layer (365a) or the lower resist layer (365b) may be difficult.
  • the filler content exceeds approximately 82%, it may be difficult to implement an opening or pattern of the designed shape in a process of partially removing the upper resist layer (365a) or the lower resist layer (365b) to expose a portion of the wiring layer (363n).
  • a circuit board (360a) that provides a heat dissipation structure while meeting the design specifications can be implemented.
  • the upper resist layer (365a) when including an aluminum-based (or magnesium-based) filler, the upper resist layer (365a) (or the lower resist layer (365b)) may be black, white, or gray in color. In one embodiment, when including an aluminum-based (or magnesium-based) filler, the upper resist layer (365a) (or the lower resist layer (365b)) may be gray in color, and as the content of the filler increases, the color may become more black-based. In one embodiment, when including an aluminum-based (or magnesium-based) filler, the glossiness of the upper resist layer (365a) (or the lower resist layer (365b)) may be lowered.
  • the gloss of the upper resist layer (365a) (or the lower resist layer (365b)) may be about 3 or more and about 10 or less as measured by a 60-degree gloss meter in Japanese Industrial Standards (JIS).
  • JIS Japanese Industrial Standards
  • the mechanical strength of the upper resist layer (365a) (or the lower resist layer (365b)) and/or the circuit board (360a) can be improved.
  • the pencil hardness of the upper resist layer (365a) (or the lower resist layer (365b)) was approximately 7 to 8H.
  • the circuit board (360a) according to the embodiment(s) of the present disclosure has an elastic modulus improved by approximately 2.5 GPa and a rigidity (e.g., yield strength) improved by approximately 20% or more.
  • the insulating layer (361n)(s) may be implemented as a prepreg based on, for example, glass fiber.
  • the insulating layer (361n)(s) may be manufactured in the shape of a sheet, plate, or film by impregnating glass fiber with a resin binder such as epoxy, and a wiring layer (363n) formed of a conductive material may be provided on at least one surface.
  • a resin binder such as epoxy
  • a wiring layer (363n) formed of a conductive material may be provided on at least one surface.
  • at least one of the insulating layers (361n) may be implemented as a resin that does not include glass fiber.
  • at least one insulating layer (361n) implemented as a prepreg may be disposed between the upper resist layer (365a) and the lower resist layer (365b). The number and thickness of the insulating layers (361n) may vary depending on the specifications of the electronic device to be actually manufactured.
  • the wiring layer (363n)(s) may be disposed on the surface of any one of the insulating layers (361n), or between two adjacent insulating layers (361n).
  • the wiring layer (363n)(s) may be implemented by plating, depositing, printing, and/or laminating a conductive material (or conductive film) onto the surface of the insulating layer (361n)(s).
  • the wiring layer (363n)(s) may, for example, provide signal lines of a specified shape or trajectory, and may be electrically connected to other wiring layers (363n)(s) provided on the circuit board (360a) via via conductors (not shown).
  • FIG. 7 is a drawing showing a circuit board (360b) according to one embodiment of the present disclosure.
  • a circuit board (360b) according to one embodiment of the present disclosure is illustrated in a cross-sectional view and may be provided, for example, as the printed circuit board (240) of FIG. 4 or FIG. 5.
  • the circuit board (360b) may be a multi-layered circuit board in which a plurality of insulating layers (361n, 367a) and a plurality of wiring layers (363n, 367b) are alternately stacked.
  • the plurality of wiring layers (363n, 367b) are illustrated in the form of continuous lines (or plates) in the horizontal direction, but it should be noted that the embodiment(s) of the present disclosure are not limited thereto.
  • Each of the plurality of wiring layers (363n, 367b) may include a plurality of signal lines formed of an electrically conductive material, and it will be readily understood by those skilled in the art that, depending on the cut position, different signal lines may be arranged discontinuously in one wiring layer (363n, 367b) or different portions of one signal line may be arranged discontinuously.
  • the circuit board (360b) may include an upper resist layer (365a), a lower resist layer (365b), at least one insulating layer (361n, 367a), and at least one wiring layer (363n, 367b).
  • the circuit board (360b) may include a plurality of insulating layers (361n, 367a) and a plurality of wiring layers (363n, 367b) alternately arranged between the upper resist layer (365a) and the lower resist layer (365b).
  • the upper resist layer (365a) or the lower resist layer (365b) may be formed by a photo solder resist.
  • the upper resist layer (365a) and/or the lower resist layer (365b) can be provided by applying and/or curing a liquid solder resist to the surface of the outermost wiring layer (363n, 367b), or by laminating a film provided with a photosensitive solder resist to the surface of the outermost wiring layer (363n, 367b).
  • the upper resist layer (365a) or the lower resist layer (365b) can substantially isolate or protect the wiring layer (363n, 367b) provided therein or the wiring layer (363n, 367b) in direct contact therewith from the external environment.
  • the upper resist layer (365a) or the lower resist layer (365b) can be partially removed so that a portion of the wiring layer (363n, 367b) is exposed to the external space of the circuit board.
  • the wiring layer (363n, 367b) exposed by the partial removal of the upper resist layer (365a) or the lower resist layer (365b) can be the wiring layer indicated as '367b'.
  • electrical/electronic components e.g., electrical/electronic components (431) of FIG. 8 can electrically contact or be coupled to the circuit board (360b).
  • the upper resist layer (365a) or the lower resist layer (365b) may be formed of a resin, such as melamine or epoxy, and may include an aluminum-based filler and/or a magnesium-based filler.
  • the thermal conductivity of the upper resist layer (365a) or the lower resist layer (365b) may vary depending on the content of the filler. For example, when the filler is not included, the upper resist layer (365a) or the lower resist layer (365b) may have a thermal conductivity of approximately 0.2 W/mK.
  • the upper resist layer (365a) or the lower resist layer (365b) may have a thermal conductivity of approximately 1.1 W/mK or more and 2.2 W/mK or less.
  • the circuit board (360b) can function as a structure that moves, disperses, and/or releases heat by including an aluminum-based filler and/or a magnesium-based filler in the upper resist layer (365a) or the lower resist layer (365b).
  • the aluminum-based filler, such as Al 2 O 3 , in the upper resist layer (365a) or the lower resist layer (365b) may be greater than or equal to about 73% and less than or equal to about 82%.
  • the magnesium-based filler, such as MgO, in the upper resist layer (365a) or the lower resist layer (365b) may be greater than or equal to about 73% and less than or equal to about 82%.
  • the thermal conductivity of the upper resist layer (365a) or the lower resist layer (365b) may be greater than or equal to about 1.3 W/mK and less than or equal to about 2.1 W/mK.
  • the heat dissipation performance of the circuit board may be low.
  • the filler content is less than about 73%, the degree of improvement in the thermal conductivity of the upper resist layer (365a) or the lower resist layer (365b) may be small compared to a resist layer that does not include the filler.
  • the thermal conductivity may be further increased.
  • the process of forming an opening in the upper resist layer (365a) or the lower resist layer (365b) may be difficult.
  • the filler content exceeds approximately 82%, it may be difficult to implement an opening or pattern of a designed shape in a process of partially removing the upper resist layer (365a) or the lower resist layer (365b) to expose a portion of the wiring layer (363n, 367b).
  • a circuit board (360b) that provides a heat dissipation structure while meeting the design specifications can be implemented.
  • the upper resist layer (365a) when including an aluminum-based (or magnesium-based) filler, the upper resist layer (365a) (or the lower resist layer (365b)) may be black, white, or gray in color. In one embodiment, when including an aluminum-based (or magnesium-based) filler, the upper resist layer (365a) (or the lower resist layer (365b)) may be gray in color, and as the content of the filler increases, the color may become more black-based. In one embodiment, when including an aluminum-based (or magnesium-based) filler, the glossiness of the upper resist layer (365a) (or the lower resist layer (365b)) may be lowered.
  • the gloss of the upper resist layer (365a) (or the lower resist layer (365b)) may be about 3 or more and about 10 or less in Japanese Industrial Standards (JIS) measured with a 60-degree gloss meter.
  • JIS Japanese Industrial Standards
  • the mechanical strength of the upper resist layer (365a) (or the lower resist layer (365b)) and/or the circuit board (360b) can be improved.
  • the pencil hardness of the upper resist layer (365a) (or the lower resist layer (365b)) was approximately 7 to 8H.
  • the circuit board (360b) according to the embodiment(s) of the present disclosure has an elastic modulus improved by approximately 2.5 GPa and a rigidity (e.g., yield strength) improved by approximately 20% or more.
  • the insulating layer (361n, 367a)(s), for example, the insulating layer indicated as '361n', may be implemented with a prepreg based on glass fiber.
  • the insulating layer (361n)(s) may be manufactured in the shape of a sheet, plate, or film by impregnating glass fiber with a resin binder such as epoxy, and a wiring layer (363n, 367b) formed of a conductive material may be provided on at least one surface.
  • at least one insulating layer (361n) implemented with a prepreg may be disposed between the upper resist layer (365a) and the lower resist layer (365b).
  • the number and thickness of the insulating layers (361n, 367a) may be implemented in various ways depending on the specifications of the electronic device to be actually manufactured.
  • the wiring layers (363n, 367n)(s) may be disposed on the surface of any one of the insulating layers (361n, 367a), or between two adjacent insulating layers (361n, 367a).
  • the wiring layers (363n, 367b)(s) may be implemented by plating, depositing, printing, and/or laminating a conductive material (or conductive film) onto the surface of the insulating layers (361n, 367a)(s).
  • the wiring layers (363n, 367b)(s) may provide, for example, signal lines of a specified shape or trajectory, and may be electrically connected to other wiring layers (363n, 367b)(s) provided on the circuit board (360b) via via conductors (not shown).
  • the circuit board (360b) of FIG. 7, compared to the circuit board (360a) of FIG. 6, may be implemented by a resin coated copper (RCC) (367) in which the insulating layer (367a) and the wiring layer (367b) closest to the upper resist layer (365a) among the plurality of insulating layers (361n, 367a) and the plurality of wiring layers (363n, 367b) are made of an insulating layer (367a) and a wiring layer (367b).
  • RRC resin coated copper
  • the insulating layer (367a) implemented by the RCC (367) among the plurality of insulating layers (361n, 367a) may not include glass fiber (or glass component), and the remaining insulating layers (361n)(s) may be implemented by a prepreg based on glass fiber.
  • the insulating layer (367a) implemented by the RCC (367) may include a filler of a specified content.
  • the heat dissipation performance of the circuit board (360b) may be improved compared to the circuit board (360a) of FIG. 6.
  • the insulating layer (367a) closest to the upper resist layer (365) among the plurality of insulating layers (361n, 367a) is implemented by RCC (367)
  • the insulating layer (361n)(s) disposed between the insulating layer (367a) implemented by RCC (367) and the lower resist layer (365b) may be implemented by prepreg.
  • the insulating layer (361n)(s) disposed between the insulating layer (367a) implemented by RCC (367) and the upper resist layer (365a) may be implemented by prepreg.
  • At least one insulating layer (361n)(s) disposed between the insulating layers (367a) implemented by the RCC (367) may be implemented by a prepreg.
  • either one of the wiring layers (363n, 367b) may be disposed between the insulating layer (367a) implemented by the RCC (367) and the insulating layer (361n) implemented by the prepreg.
  • the insulating layer (367a) implemented by RCC may be a coating layer formed by a resin that does not include a glass component, for example, glass fiber.
  • the insulating layer (367a) implemented by RCC (367) may have increased thermal conductivity by including an aluminum-based (or magnesium-based) filler.
  • the thermal conductivity may be about 2.2 W/mK or more and about 3.0 W/mK or less.
  • the thermal conductivity when the insulating layer (367a) implemented by the RCC (367) includes an aluminum series (or magnesium series) filler of about 80% or more and about 88% or less, the thermal conductivity may be about 2.3 W/mK or more and about 2.8 W/mK or less.
  • the resist layer (365a, 365b) including the filler and the insulating layer (367a) and the wiring layer (367b) closest thereto are implemented as the RCC (367)
  • the thermal conductivity of the combination of the resist layer (365a, 365b) and the RCC (367) may be about 2.5 W/mK or more and about 3.0 W/mK or less.
  • the filler contained in the insulating layer (367a) implemented by the RCC (367) when the filler contained in the insulating layer (367a) implemented by the RCC (367) is less than about 80%, the degree of improvement in thermal conductivity may be low. In one embodiment, when the filler contained in the insulating layer implemented by the RCC is greater than about 88%, the thermal conductivity may be further improved, but the subsequent process may not be smooth.
  • the 'subsequent process' may be, for example, a process of forming a via hole by partially removing the insulating layer implemented by the RCC.
  • the content of the filler in the insulating layer (367a) implemented by the RCC (367) may be appropriately selected in consideration of the increase or decrease in manufacturing cost due to the addition of the filler, the degree of improvement in thermal conductivity, and/or the subsequent process.
  • the insulation layer (367a) and the wiring layer (367b) implemented by the RCC (367) can additionally replace other insulation layers (e.g., the insulation layer implemented by the prepreg) of FIG. 7.
  • the more insulation layers and wiring layers implemented by the RCC (367) that include fillers the more the thermal conductivity of the circuit board can be improved.
  • thermally conductive materials such as wiring layers or via conductors are already arranged inside the circuit board, even if the internal insulation layers implemented by the prepreg are replaced with insulation layers implemented by the RCC (367), the degree of improvement in thermal conductivity may be low. Therefore, similar to determining or selecting the content of the filler, the number and positions of the insulation layers to be implemented by the RCC (367) can be appropriately selected in consideration of the manufacturing cost or the degree of improvement in thermal conductivity.
  • an electronic device to be actually manufactured e.g., electronic devices (1001, 1002, 1004, 100, 200, 400) of FIGS. 1 to 5 and/or FIG. 8 described below
  • electrical/electronic components e.g., electrical/electronic components (431) of FIG. 8
  • the operating state before and after application of a circuit board e.g., printed circuit board (240) of FIG. 4 or circuit boards (360a, 360b) of FIGS. 6 to 7
  • a circuit board e.g., printed circuit board (240) of FIG. 4 or circuit boards (360a, 360b) of FIGS. 6 to 7
  • the 'operating state' may refer to the temperature of an electrical/electronic component (431) equipped with a processor, and was measured while executing the same command(s).
  • the operating temperature of the electric/electronic component (431) can be improved by approximately 2 to 2.5 degrees in a structure in which the resist layers (365a, 365b) include fillers of an aluminum series (or magnesium series).
  • the operating temperature can be improved by approximately 2.5 to 2.9 degrees in a structure in which the resist layers (365a, 365b) include fillers and the insulating layer and wiring layer closest to the resist layers (365a, 365b) are implemented as RCC (367).
  • FIG. 8 is a cross-sectional view showing a portion of an electronic device (400) along line A-A' of FIG. 3, according to one embodiment of the present disclosure.
  • a support member (411) e.g., a first support member (211) of FIG. 4 or 5) and/or a side structure (210) of FIG. 5 may function as a separate heat dissipation structure from a printed circuit board (240) (e.g., a circuit board (360a, 360b) of FIG. 6 or 7).
  • the electronic device (400) and/or the heat dissipation structure may include a support member (411) and a heat dissipation member (420) provided within a housing (e.g., a housing (110, 201) of FIGS.
  • the heat dissipation member (420) may include, for example, a vapor chamber or a heat pipe.
  • the heat dissipation member (420) includes a chamber portion (421) and a flange portion (423) provided on at least a portion of an edge of the chamber portion (421), and the flange portion (423) is attached or welded onto the support member (411), thereby stably fixing the heat dissipation member (420) to the support member (411).
  • the flange portion (423) may be omitted and the chamber portion (421) may be directly attached or welded onto the support member (411).
  • the heat dissipation member (420) may be fixed to the support member (411) by a bonding material (or bonding member) such as a double-sided tape.
  • a bonding material or bonding member
  • the heat dissipation member (420) and the support member (411) can be fixed more firmly, and heat absorbed by the heat dissipation member (420) can be quickly transferred or diffused to the support member (411).
  • heat generated in an electric/electronic component (431) such as an integrated circuit chip having a processor, can be more quickly moved, dispersed, or released over a wider area. This can suppress local temperature rise within the electronic device (400) and prevent the operating environment of the electronic/electronic component from becoming worse.
  • the support member (411) (e.g., the first support member (211) of FIG. 4 or 5) may have a substantially flat plate shape and may be disposed at least partially in a space between a first plate (e.g., the front plate or display (230)) and a second plate (e.g., the back plate (280) of FIG. 4 or 5).
  • a first plate e.g., the front plate or display (230)
  • a second plate e.g., the back plate (280) of FIG. 4 or 5
  • the support member (411) may provide a penetration region(s) penetrating both surfaces.
  • the heat dissipation member (420) when the heat dissipation member (420) is disposed on the support member (411) on a side facing the +Z direction, a portion of the heat dissipation member (420) (e.g., the chamber portion (421)) may be visually exposed to a region or space on the -Z side with respect to the support member (411). In one embodiment, it may be understood that a portion of the heat dissipation member (420) is accommodated in the penetration region of the support member (411). In one embodiment, the printed circuit board (240) or the electrical/electronic component (431) may be disposed in an area or space on the -Z direction side with respect to the support member (411).
  • the electrical/electronic component (431) may be disposed facing a heat dissipation member (420) (e.g., a vapor chamber or a heat pipe) with the support member (411) therebetween.
  • a heat dissipation member (420) e.g., a vapor chamber or a heat pipe
  • the support member (411) and/or the electronic device (400) may include an accommodating hole (413a) (or accommodating recess) for accommodating a portion of the heat dissipation member (420) (e.g., the chamber portion (421)), and a seating recess (413b) provided around the periphery of the accommodating hole (413a).
  • the seating recess (413b) may be provided around the entire periphery of the accommodating hole (413a) on, for example, one surface of the support member (411) (e.g., the surface facing the +Z direction) to form a closed curve, and a plurality of seating recesses (413b) may be arranged along the periphery of the accommodating recess (413a).
  • the accommodating hole (413a) may be provided to penetrate from one surface of the support member (411) to the other surface, and thus may be understood as the aforementioned penetration region.
  • the receiving hole (413a) may be provided in the form of a recess that does not substantially penetrate the support member (411).
  • a portion of the receiving hole (413a) may be provided in a structure that penetrates the support member (411), and another portion may be provided in the form of a recess.
  • the securing groove (413b) is provided around the receiving hole (413a) on one side of the support member (411), and it may be understood that the receiving hole (413a) or the receiving groove is formed deeper than the securing groove (413b) from one side of the support member (411).
  • the securing groove (413b) may be understood to be formed on a side of the support member (411) facing the +Z direction.
  • the receiving hole (413a) may be provided so as to generally penetrate the support member (411), but the embodiment(s) of the present disclosure are not limited thereto.
  • the receiving hole (413a) and the securing groove (413b) may be formed at different depths on one side of the support member (411), and at least a portion of the receiving hole (413a) may be a closed structure on the other side of the support member (411).
  • the heat dissipation member (420) may include, for example, a heat pipe or a vapor chamber. In one embodiment, the heat dissipation member (420) may further include a contact thermal interface material (TIM) (433) protruding to the outside of the electrical/electronic component (431).
  • the contact thermal interface material (TIM) (433) may be manufactured, for example, by coating or plating a metallic material on a nano-foam.
  • the contact thermal interface material (433) may be configured to transfer heat between the electrical/electronic component (431) and the heat dissipation member (420) by contacting another structure, for example, a shielding sheet (435), a thermally conductive block (429), and/or the heat dissipation member (420), on the outside of the electromagnetic shielding member (e.g., the shield can (249) of FIG. 4).
  • the shielding sheet (435) can suppress the deterioration of electromagnetic shielding performance, for example, when the shield can (249) is partially opened in a structure in which a contact-type heat-conducting material (433) is arranged.
  • the temperature of the electric/electronic component (431) may become higher than room temperature or the body temperature of the user during operation of the electronic device (400).
  • the printed circuit board (240) may be implemented by the circuit board (360a, 360b) of FIG. 6 or FIG. 7 described above, thereby moving, dispersing, or releasing heat generated in the electric/electronic component (431).
  • the printed circuit board (240) may suppress the deterioration of the operating environment of the electric/electronic component (431) by providing an additional heat dissipation structure in a different path or area than the heat dissipation member (420).
  • the electronic device may include a heat dissipation structure or heat dissipation structure separate from a heat dissipation member (e.g., the heat dissipation member (420) of FIG. 8) such as a vapor chamber or a heat pipe, thereby suppressing deterioration of the operating environment of the electric/electronic component (e.g., the electric/electronic component (431) of FIG. 8).
  • a heat dissipation member e.g., the heat dissipation member (420) of FIG. 8
  • a vapor chamber or a heat pipe such as a vapor chamber or a heat pipe
  • the added heat dissipation structure may be implemented using a circuit board (e.g., the printed circuit board (240) of FIG. 4 or the circuit boards (360a, 360b) of FIGS. 6 to 7) already disposed in the electronic device, and thus may not affect the actual size or shape of the electronic device.
  • a circuit board e.g., the printed circuit board (240) of FIG. 4 or the circuit boards (360a, 360b) of FIGS. 6 to 7
  • a circuit board e.g., the printed circuit board (240) of FIG. 4 or the circuit boards (360a, 360b) of FIGS. 6 to 7) already disposed in the electronic device, and thus may not affect the actual size or shape of the electronic device.
  • a circuit board e.g., the printed circuit board (240) of FIG. 4 or the circuit boards (360a, 360b) of FIGS. 6 to 7
  • an electronic device including a circuit board according to the embodiment(s) of the present disclosure can provide improved operating performance or a comfortable user
  • a circuit board (e.g., a printed circuit board (240) of FIG. 4 or a circuit board (360a, 360b) of FIGS. 6 to 7) may include an upper resist layer (e.g., an upper resist layer (365a) of FIGS. 6 to 7), a lower resist layer (e.g., an upper resist layer (365b) of FIGS. 6 to 7), and a plurality of insulating layers (e.g., an insulating layer (361n, 367a) of FIGS. 6 to 7) and a plurality of wiring layers (e.g., a wiring layer (363n, 367b) of FIGS. 6 to 7) alternately stacked between the upper resist layer and the lower resist layer.
  • an upper resist layer e.g., an upper resist layer (365a) of FIGS. 6 to 7
  • a lower resist layer e.g., an upper resist layer (365b) of FIGS. 6 to 7
  • a plurality of insulating layers e.g.
  • the insulating layer e.g., the insulating layer indicated by '367a' in FIG. 7
  • the wiring layer e.g., the wiring layer indicated by '367b' in FIG. 7
  • 'RCC' resin coated copper
  • the remaining insulation layers e.g., the insulation layer indicated by '361n' in FIG. 7 except for the insulation layer implemented by RCC among the plurality of insulation layers may be implemented by a prepreg based on glass fiber.
  • the upper resist layer or the lower resist layer may include 73% or more and 82% or less of an aluminum (Al) series filler or 73% or more and 82% or less of a magnesium (Mg) series filler.
  • the upper resist layer or the lower resist layer may have a thermal conductivity of 1.1 W/mK or more and 2.2 W/mK or less.
  • the insulation layer implemented by RCC among the plurality of insulation layers may include an aluminum (Al) series filler of 80% or more and 88% or less, or a magnesium (Mg) series filler of 80% or more and 88% or less, without including glass fiber.
  • Al aluminum
  • Mg magnesium
  • the insulation layer implemented by RCC among the plurality of insulation layers may have a thermal conductivity of 2.2 W/mK or more and 3.0 W/mK or less.
  • the insulating layer and wiring layer closest to the upper resist layer may be implemented by RCC
  • the insulating layer and wiring layer closest to the lower resist layer may be implemented by RCC.
  • at least one of the plurality of insulating layers may be implemented by a prepreg based on glass fiber and may be disposed between the insulating layers implemented by RCC among the plurality of insulating layers.
  • one of the plurality of wiring layers may be disposed between an insulation layer implemented by RCC and an insulation layer implemented by prepreg among the plurality of insulating layers.
  • the upper resist layer or the lower resist layer may be black, white or gray in color.
  • an electronic device (e.g., an electronic device (1001, 1002, 1004, 100, 200, 400) of FIGS. 1 to 5 and/or 8) comprises a housing (e.g., a housing (201) of FIG. 4 or 5) including a first plate (e.g., a front plate (220) of FIG. 4 or a display (230) of FIG. 8) and a second plate (e.g., a rear plate (280) of FIG. 4 or 5) disposed opposite to the first plate, a circuit board (e.g., a printed circuit board (240) of FIG. 4 or a circuit board (360a, 360b) of FIGS.
  • a housing e.g., a housing (201) of FIG. 4 or 5
  • a first plate e.g., a front plate (220) of FIG. 4 or a display (230) of FIG.
  • a second plate e.g., a rear plate (280) of FIG. 4 or 5
  • a circuit board e.g
  • an electric/electronic component e.g., an electric/electronic component of FIG. 8 disposed on the circuit board. It may include parts (431)).
  • the electronic device as described above may further include a plate-shaped support member (e.g., the first support member (211) of FIG. 4 or the support member (411) of FIG. 8) disposed between the first plate and the circuit board, and a vapor chamber or a heat pipe (e.g., the heat dissipation member (420) of FIG. 8) disposed between the first plate and the support member.
  • a plate-shaped support member e.g., the first support member (211) of FIG. 4 or the support member (411) of FIG. 8
  • a vapor chamber or a heat pipe e.g., the heat dissipation member (420) of FIG. 8
  • at least a portion of the electric/electronic components may be disposed to face the vapor chamber or the heat pipe with the support member interposed therebetween.
  • the electronic device as described above may further include an electromagnetic shielding member (e.g., a shield can (249) of FIG. 4 or FIG. 8) arranged on the circuit board and configured to accommodate at least a portion of the electrical/electronic components.
  • an electromagnetic shielding member e.g., a shield can (249) of FIG. 4 or FIG. 8 arranged on the circuit board and configured to accommodate at least a portion of the electrical/electronic components.
  • a circuit board (e.g., a printed circuit board (240) of FIG. 4 or a circuit board (360a, 360b) of FIGS. 6 to 7) comprises an upper resist layer (e.g., an upper resist layer (365a) of FIGS. 6 to 7) comprising 73% or more and 82% or less of an aluminum (Al)-based filler or 73% or more and 82% or less of a magnesium (Mg)-based filler, a lower resist layer (e.g., a lower resist layer (365b) of FIGS.
  • an upper resist layer e.g., an upper resist layer (365a) of FIGS. 6 to 7
  • Al aluminum
  • Mg magnesium
  • insulating layers e.g., a plurality of insulating layers (365b) of FIGS. 6 to 7) alternately stacked between the upper resist layer and the lower resist layer. It may include an insulating layer (361n, 367a) and a plurality of wiring layers (e.g., wiring layers (363n, 367b) of FIGS. 6 to 7).
  • the insulating layer e.g., the insulating layer indicated by '367a' of FIG.
  • the wiring layer (e.g., the wiring layer indicated by '367b' of FIG. 7) closest to the upper resist layer or the lower resist layer among the plurality of insulating layers and the plurality of wiring layers may be implemented by RCC (e.g., the RCC (367) of FIG. 7).
  • the insulating layer implemented by RCC among the plurality of insulating layers may not include glass fiber.
  • the remaining insulation layers e.g., the insulation layer indicated by '361n' in FIG. 7
  • the insulation layer implemented by RCC among the plurality of insulation layers can be implemented by a prepreg based on glass fiber.
  • the upper resist layer or the lower resist layer may have a thermal conductivity of 1.1 W/mK or more and 2.2 W/mK or less.
  • the insulation layer implemented by RCC among the plurality of insulation layers may have a thermal conductivity of 2.2 W/mK or more and 3.0 W/mK or less.
  • the insulating layer and wiring layer closest to the upper resist layer may be implemented by RCC
  • the insulating layer and wiring layer closest to the lower resist layer may be implemented by RCC.
  • at least one of the plurality of insulating layers may be implemented by a prepreg based on glass fiber and may be disposed between the insulating layers implemented by RCC among the plurality of insulating layers.
  • one of the plurality of wiring layers may be disposed between an insulation layer implemented by RCC and an insulation layer implemented by prepreg among the plurality of insulating layers.
  • the upper resist layer or the lower resist layer may be black, white or gray in color.
  • the circuit board as described above may further include an electrical/electronic component disposed on one surface (e.g., an electrical/electronic component (431) of FIG. 8), and an electromagnetic shielding member disposed on the one surface and configured to accommodate at least a portion of the electrical/electronic component (e.g., a shield can (249) of FIG. 4 or FIG. 8).
  • an electrical/electronic component disposed on one surface
  • an electromagnetic shielding member disposed on the one surface and configured to accommodate at least a portion of the electrical/electronic component (e.g., a shield can (249) of FIG. 4 or FIG. 8).

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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
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Abstract

Selon un mode de réalisation divulgué ici, une carte de circuit imprimé et/ou un dispositif électronique le comprenant peuvent comprendre : une couche de réserve supérieure ; une couche de réserve inférieure ; et une pluralité de couches isolantes et une pluralité de couches de câblage empilées en alternance entre la couche de réserve supérieure et la couche de réserve inférieure. Dans un mode de réalisation, la couche isolante et la couche de câblage la plus proche de la couche de réserve supérieure ou de la couche de réserve inférieure parmi la pluralité de couches isolantes et la pluralité de couches de câblage peuvent être formées par du cuivre revêtu de résine. L'invention permet aussi divers autres modes de réalisation.
PCT/KR2025/005925 2024-04-30 2025-04-30 Carte de circuit imprimé fournissant une structure de dissipation de chaleur et dispositif électronique la comprenant Pending WO2025230337A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2024-0058170 2024-04-30
KR20240058170 2024-04-30
KR1020240088022A KR20250158579A (ko) 2024-04-30 2024-07-04 방열 구조를 제공하는 회로 기판 및 그를 포함하는 전자 장치
KR10-2024-0088022 2024-07-04

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WO2025230337A1 true WO2025230337A1 (fr) 2025-11-06

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140118218A (ko) * 2013-03-28 2014-10-08 주식회사 엘 앤 에프 열전도율이 향상된 솔더 레지스트 조성물
JP2014236140A (ja) * 2013-06-04 2014-12-15 株式会社京写 ソルダーレジスト用インキ、及びその硬化物並びにそれを用いたプリント配線板
KR20150025245A (ko) * 2013-08-28 2015-03-10 삼성전기주식회사 인쇄회로기판용 동박 적층판 및 그의 제조방법
KR20210115486A (ko) * 2020-03-13 2021-09-27 엘지이노텍 주식회사 회로기판
KR20210155981A (ko) * 2020-06-17 2021-12-24 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140118218A (ko) * 2013-03-28 2014-10-08 주식회사 엘 앤 에프 열전도율이 향상된 솔더 레지스트 조성물
JP2014236140A (ja) * 2013-06-04 2014-12-15 株式会社京写 ソルダーレジスト用インキ、及びその硬化物並びにそれを用いたプリント配線板
KR20150025245A (ko) * 2013-08-28 2015-03-10 삼성전기주식회사 인쇄회로기판용 동박 적층판 및 그의 제조방법
KR20210115486A (ko) * 2020-03-13 2021-09-27 엘지이노텍 주식회사 회로기판
KR20210155981A (ko) * 2020-06-17 2021-12-24 엘지이노텍 주식회사 인쇄회로기판 및 이의 제조 방법

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