WO2025227277A1

WO2025227277A1 - Device comprising a heat dissipation device with a flexible wick

Info

Publication number: WO2025227277A1
Application number: PCT/CN2024/090300
Authority: WO
Inventors: Feihu YE; Wei Tang; Hui He; Yan Cao
Original assignee: Qualcomm Inc
Current assignee: Qualcomm Inc
Priority date: 2024-04-28
Filing date: 2024-04-28
Publication date: 2025-11-06
Anticipated expiration: 2026-10-28

Abstract

A device comprising a first device frame; a second device frame; a first hinge coupled to the first device frame and the second device frame; a second hinge coupled to the first device frame and the second device frame; a heat dissipation device located in at least part of the first device frame, wherein the heat dissipation device includes a wick that extends to the second device frame.

Description

DEVICE COMPRISING A HEAT DISSIPATION DEVICE WITH A FLEXIBLE WICK

Field

Various features relate to devices with a heat dissipation with a flexible wick.

Background

A device may include many components. Some of these components, such as integrated devices may generate heat when in operation. This heat can build up in the device, which can result in sub optimal performances in the device and/or its components. There is an ongoing need to provide better performing devices, including having improved thermal performances, while keeping the device and its components as compact as possible.

SUMMARY

One example provides a device comprising a frame; a first temple coupled to the frame through a first hinge; a second temple coupled to the frame through a second hinge; and a heat dissipation device located in at least part of the first temple, wherein the heat dissipation device includes a wick that extends to the frame.

Another example provides a device comprising a first device frame; a second device frame; a first hinge coupled to the first device frame and the second device frame; a second hinge coupled to the first device frame and the second device frame; and a heat dissipation device located in at least part of the first device frame, wherein the heat dissipation device includes a wick that extends to the second device frame.

BRIEF DESCRIPTION OF THE DRAWINGS

Various features, nature and advantages may become apparent from the detailed description set forth below when taken in conjunction with the drawings in which like reference characters identify correspondingly throughout.

FIG. 1 illustrates an exemplary device comprising a heat pipe with an exemplary flexible wick.

FIG. 2 illustrates an exemplary device comprising a heat pipe with an exemplary flexible wick.

FIG. 3 illustrates an exemplary device comprising a heat pipe with an exemplary flexible wick.

FIG. 4 illustrates an exemplary view of a portion of a device comprising a heat pipe with an exemplary flexible wick.

FIG. 5 illustrates an exemplary device comprising a heat pipe with an exemplary flexible wick.

FIG. 6 illustrates an exemplary temperature map of a device comprising a heat pipe with a flexible wick.

FIG. 7 illustrates an exemplary junction temperature map of a device without a heat pipe with an exemplary flexible wick.

FIG. 8 illustrates an exemplary junction temperature map of a device comprising a heat pipe with an exemplary flexible wick.

FIG. 9 illustrates an exemplary laptop device comprising a heat pipe with an exemplary flexible wick.

FIG. 10 illustrates an exemplary phone device comprising a heat pipe with an exemplary flexible wick.

FIG. 11 illustrates an exemplary heat pipe with a flexible wick.

FIG. 12 illustrates an exemplary vapor chamber with a flexible wick.

FIG. 13 illustrates an exemplary heat pipe with a flexible wick.

FIGS. 14A–14B illustrate an exemplary sequence for fabricating a heat pipe with an exemplary flexible wick.

DETAILED DESCRIPTION

In the following description, specific details are given to provide a thorough understanding of the various aspects of the disclosure. However, it will be understood by one of ordinary skill in the art that the aspects may be practiced without these specific details. For example, circuits may be shown in block diagrams in order to avoid obscuring the aspects in unnecessary detail. In other instances, well-known circuits, structures and techniques may not be shown in detail in order not to obscure the aspects of the disclosure.

The present disclosure a device comprising a frame; a first temple coupled to the frame through a first hinge; a second temple coupled to the frame through a second hinge; and a heat dissipation device located in at least part of the first temple, wherein the heat dissipation device includes a wick that extends to the frame. The device may be an eye wear device. The use of the heat pipe that is embedded in the device, helps provide a device that is more efficient and effective at dissipating heat, which helps improve the thermal performance of the components in the device.

Exemplary Device Comprising a Heat Pipe With a Flexible Wick

FIG. 1 illustrates a view of a device 100 that includes a heat pipe with a flexible wick. The device 100 may be an eye wear device. For example, the device 100 may be augmented reality eye wear device. In some implementations, the device 100 may be a virtual reality eye wear device. The device 100 includes a frame 102, a first temple 104a, a second temple 104b, a first hinge 105a, a second hinge 105b, a heat dissipation device 106, an integrated device 110, a heat dissipation device 106, a first camera 150 and a second camera 152. The frame 102 may be an eye wear frame. The first temple 104a may be a first eye wear temple. The second temple 104b may be a second eye wear temple. The device 100 may include other components, such as one or more lenses, one or more nose pads. The frame 102 may include a bridge. The frame 102 may include at least one rim. The first temple 104a may include a first temple tip. The second temple 104b may include a second temple tip. The device 100 may include buttons that are located in the frame 102, the first temple 104a and/or the second temple 104b.

The first temple 104a is coupled to the frame 102 through the first hinge 105a. The first hinge 105a is configured to allow the first temple 104a to rotate relative to a first portion of the frame 102. The second temple 104b is coupled to the frame 102 through the second hinge 105b. The second hinge 105b is configured to allow the second temple 104b to rotate relative to a second portion of the frame 102. The first camera 150 is located and/or embedded in the frame 102. The second camera 152 is located and/or embedded in the frame 102. The integrated device 110 is located in the first temple 104a. The integrated device 110 is configured to be electrically coupled to the first camera 150 and the second camera 152. The device 100 may include other components, such as one or more energy storage devices (e.g., battery) , one or more microphones, one or more infrared devices, one or more speakers, and/or other integrated devices. The one or more energy storage devices (e.g., battery) , the one or more microphones, the one or more infrared devices, the one or more speakers, one or more sensors and/or the other integrated devices may be located in the frame 102, the first temple 104a and/or the second temple 104b. In some implementations, the frame 102 may be a first device frame for an eye wear device. In some implementations, the first temple 104a may be a second device frame for an eye wear device. In some implementations, the second temple 104b may be a third device frame for an eye wear device. When the device 100 is an augmented reality eye wear device and/or a virtual reality eye wear device, the device 100 may include one or more displays that are part of the frame 102 and/or embedded in the frame 102. The displays may be located in a region that one or more lens may be located in.

The heat dissipation device 106 includes a first heat pipe 160, a wick 162 and a second heat pipe 164. The heat dissipation device 106 is located in the first temple 104a and the frame 102. The first heat pipe 160 is coupled to the second heat pipe 164 through the wick 162. A first part of the wick 162 may be embedded in the first heat pipe 160 and a second part of wick 162 may be embedded in the second heat pipe 164. In one example, the first heat pipe 160 may be located at least partially in the first temple 104a, and a second heat pipe 164 may be located at least partially in the frame 102. The wick 162 may be located at least partially in the first temple 104a and the frame 102. The wick 162 may extend through and/or about the first hinge 105a. The wick 162 may be a flexible wick that is bendable. The wick 162 may bend and/or fold as the first temple 104a is folded and/or rotated about the first hinge 105a. Different implementations may include a different wick. The wick 162 may include a mesh. For example, the wick 162 may include a metal mesh (e.g., copper mesh) . The mesh may be a flexible mesh (e.g., flexible metal mesh, flexible copper mesh) . A more detailed example of a heat pipe and a flexible wick is further illustrated and described below in at least FIG. 13. The wick 162 may represent a single wick or several wicks.

The heat dissipation device 106 may be coupled to and touching the integrated device 110. For example, the first heat pipe 160 may be coupled to and touch the integrated device 110. In some implementations, the heat dissipation device 106 is coupled to the integrated device 110 through a thermal interface material (TIM) . For example, the first heat pipe 160 may be coupled to the integrated device 110 through a thermal interface material. The heat dissipation device 106 may be coupled to other components located in the first temple 104a. The heat dissipation device 106 may be coupled to and touch the first temple 104a. The heat dissipation device 106 may be coupled to and touch the frame 102. The heat dissipation device 106 may be coupled to and/or touch components located in the frame 102. The wick 162 and/or the second heat pipe 164 may be coupled to and/or touch components of the frame 102. In some implementations, the wick 162 and/or the second heat pipe 164 may be coupled to components of the frame 102 through a thermal interface material (TIM) .

The heat dissipation device 106 is configured to allow heat to dissipate through the frame 102. For example, heat that is generated by a heat source (e.g., integrated device 110) in the first temple 104a may dissipate through the first temple 104a and the frame 102. By allowing heat to dissipate through a greater area of the device 100 (instead of being limited to the area of the first temple 104a) , heat can be more efficiently and/or effectively dissipated from the heat source, allowing components of the first temple 104a, such as the integrated device 110, to perform better and/or faster. Thus, the heat dissipation device 106 results in less buildup of energy and/or heat in the first temple 104a of the device 100, resulting in an overall lower temperature of the device 100. This will result in the user and/or wearer of the device 100 to be more comfortable with the device 100, while the integrated device 110 (and/or other components) in/are in operation.

FIG. 1 illustrates that the heat dissipation device 106 includes a first heat pipe, a flexible wick and a second heat pipe. However, in some implementations, a heat dissipation device may include a heat pipe and a flexible wick. Thus, the second heat pipe may be optional and/or may be replaced with another component. In some implementations, a heat dissipation device may include a heat pipe, a flexible wick and a heat sink. In some implementations, a heat dissipation device may include a heat pipe, a flexible wick and a vapor chamber. In some implementations, a heat dissipation device may include a vapor chamber, a flexible wick and a heat sink. In some implementations, a heat dissipation device may include a vapor chamber, a flexible wick and a heat pipe. In some implementations, a heat dissipation device may include a first vapor chamber, a flexible wick and a second vapor chamber. Different implementations may include a heat pipe and/or a wick with different sizes, different shapes, and/or different materials. A vapor chamber may be a flattened heat pipe.

In some implementations, the heat dissipation device 106 or another heat dissipation device may be located at least partially in the second temple 104b and the frame 102. The other heat dissipation device may be similar or different to the heat dissipation device 106. Different implementations may have a heat dissipation device 106 with different shapes, different sizes and/or different materials.

FIG. 2 illustrates another view of the device 100. The device 100 is shown with the first temple 104a and the second temple 104b in an unfolded configuration of the device 100. The first temple 104a is unfolded away from the frame 102 through the first hinge 105a. The second temple 104b is unfolded away from the frame 102 through the second hinge 105b. When the device 100 is in an unfolded configuration, the wick 162 may be in contracted configuration.

FIG. 3 illustrates another view of the device 100. The device 100 is shown with the first temple 104a and the second temple 104b in a folded configuration of the device 100. The first temple 104a is folded towards the frame 102 through the first hinge 105a. The second temple 104b is folded towards the frame 102 through the second hinge 105b. When the device 100 is in a folded configuration, the wick 162 may be in extended configuration and/or stretched configuration.

FIG. 4 illustrates a close up view of a hinge of the device 400. The device 400 includes the first temple 104a, the frame 102 and the hinge 405. The device 400 may be similar to the device 100, and may include the same components as described for the device 100. FIG. 4 illustrates an example of a hinge that may be used in the device 400. However, it is noted that the device 100 and/or the device 400 may include different hinges and/or different types of hinges. The first temple 104a is coupled to the frame 102 through the hinge 405. The hinge 405 may represent the first hinge 105a and/or the second hinge 105b. The wick 162 may extend through the hinge 405, be located adjacent to the hinge 405 and/or be located in the hinge 405. A hinge may have different shapes and/or sizes. The hinge 405 is merely an example of a hinge that may be used with and/or in a device. The hinge 405 may be implemented in any of the devices described in the disclosure. However, other hinges and/or other types of hinges may be used in any of the devices described in the disclosure.

FIG. 5 illustrates the device 500 that includes the first temple 104a, the frame 102, the first camera 150, a heat dissipation device 506 and the first hinge 105a. The device 500 may be a representation of the device 100 and/or the device 400, or any of the devices described in the disclosure. The first temple 104a is coupled to the frame 102 through the first hinge 105a. The first camera 150 is located at least partially in the frame 102. The heat dissipation device 506 includes a heat pipe 560, a wick 562 and a heat sink 564. The heat pipe 560 is coupled to the heat sink 564 through the wick 562. A thermal interface material may be used to couple the wick 562 to the heat sink 564. The heat sink 564 may include a metal material (e.g., copper, aluminum) . A part of the wick 562 may be embedded in the heat pipe 560. The heat pipe 560 may be located in the first temple 104a. The heat sink 564 may be located in the frame 102. The wick 562 may be a flexible wick. The wick 562 may include a mesh (e.g., flexible mesh) . The wick 562 may include a flexible metal mesh (e.g., flexible copper mesh) . The wick 562 may be located at least partially in the first temple 104a, the first hinge 105a and the frame 102. The heat pipe 560 may be coupled to a component (e.g., integrated device 110) in the first temple 104a through a thermal interface material (TIM) .

FIG. 6 illustrates an example of a temperature map 600 for the device 500. The temperature map 600 may be an example of various temperatures along the device 500, when the device 500 includes the heat dissipation device 506. Since the heat dissipation device 506 can be located in the first temple 104a and the frame 102, heat from a heat source is more efficiently and/or effectively dissipated in the device 500, resulting in an overall lower temperature in the device 500. The point 602 in the temperature map 600 may correspond to the heat sink 564.

FIG. 7 illustrates an example of a junction temperature map 700 of various components of a device without a heat dissipation device comprising a flexible wick. The junction temperature map 700 includes a point 702 and a point 704. The point 702 may correspond to a junction temperature of a first integrated device located in the first temple of a device. The point 704 may correspond to a junction temperature of a second integrated device located in the first temple of a device.

FIG. 8 illustrates an example of a junction temperature map 800 of various components of a device 500 with a heat dissipation device comprising a flexible wick. The junction temperature map 800 includes a point 802 and the point 804. The point 802 may correspond to a junction temperature of a first integrated device located in the first temple 104a of the device 500. The point 804 may correspond to a junction temperature of a second integrated device located in the first temple 104a of the device 500. The temperature at the point 802 is less than the temperature at the point 702. For example, the junction temperature at the point 702 is about 55 degrees Celsius, and the junction temperature at the point 802 is about 48 degrees Celsius. The temperature at the point 804 is less than the temperature at the point 704. For example, the junction temperature at the point 704 is about 53 degrees Celsius, and the junction temperature at the point 804 is about 47 degrees Celsius. FIGS. 7–8 illustrate how a heat dissipation device with a flexible wick can help reduce hotspots in a device, which can lead to improved performance of the device 500 and a more comfortable experience for a user and/or wearer of the device 500. It is noted that FIGS. 7–8 are merely examples of junction temperature maps for a device. Different implementations may have different junction temperature maps for a device.

FIG. 9 illustrates a laptop device 900 (e.g., laptop) that includes a heat dissipation device 906. The laptop device 900 includes a first device frame 910 (e.g., first device portion) , a second device frame 920 (e.g., second device portion) and at least one hinge 905. The first device frame 910 may be a first portion of the laptop device 900, and the second frame 920 may be a second portion of the laptop device 900. The first device frame 910 may include a keyboard, a touch pad and speakers. The first device frame 910 may include at least one integrated device and an energy storage device (e.g., battery) . The first device frame 910 may include a cover, a case, a board, and/or a laptop assembly. The second device frame 920 may include a display. The second device frame 920 may include a cover, a case, a panel, and/or a laptop assembly. The first device frame 910 may be coupled to the second device frame 920 through the at least one hinge 905. The at least one hinge 905 may include a first hinge 905a and a second hinge 905b. The heat dissipation device 906 may include a first vapor chamber 960, at least one wick 962 and a second vapor chamber 964. The first vapor chamber 960 may be coupled to the second vapor chamber 964 through the at least one wick 962. The at least one wick 962 may include a flexible wick. The at least one wick 962 may be a mesh (e.g., a flexible mesh, a metal mesh, a flexible metal mesh) . A part of the at least one wick 962 may be embedded in the first vapor chamber 960. Another part of the at least one wick 962 may be embedded in the second vapor chamber 964.

The heat dissipation device 906 may be located at least partially in the laptop device 900. The first vapor chamber 960 may be located at least partially in the first device frame 910. The first vapor chamber 960 may be coupled to one or more heat generating component (e.g., integrated device) in the first device frame 910. The second vapor chamber 964 may be located at least partially in the second device frame 920. The at least one wick 962 may extend through the at least one hinge 905 of the laptop device 900. For example, a first wick 962a may extend through the first hinge 905a, and a second wick 962b may extend through the second hinge 905b. It is noted that instead of and/or in conjunction with a vapor chamber, the laptop device 900 may include one or more heat pipes and/or one or more heat sinks.

FIG. 10 illustrates a foldable phone device 1000 (e.g., foldable phone) that includes a heat dissipation device 1006. The foldable phone device 1000 includes a first device frame 1010 (e.g., first device portion) , a second device frame 1020 (e.g., second device portion) and at least one hinge 1005. The first device frame 1010 may be a first portion of the foldable phone device 1000, and the second frame 1020 may be a second portion of the foldable phone device 1000. The first device frame 1010 may include a first display. The first device frame 1010 may include at least one integrated device and an energy storage device (e.g., battery) . The second device frame 1020 may include a second display. The second display and the first display may be part of the same display that is foldable. Thus, the first display may be a first portion of a foldable display, and a second display may be a second portion of the foldable display. The second device frame 1020 may include at least one other integrated device and another energy storage device (e.g., battery) . The first device frame 1010 may be coupled to the second device frame 1020 through the at least one hinge 1005. The heat dissipation device 1006 may include a first heat pipe 1060, at least one wick 1062 and a second heat pipe 1064. The first heat pipe 1060 may be coupled to the second heat pipe 1064 through the at least one wick 1062. The at least one wick 1062 may be a flexible wick. The at least one wick 1062 may be a mesh (e.g., a flexible mesh, a metal mesh, a flexible metal mesh) . A part of the at least one wick 1062 may be embedded in the first heat pipe 1060. Another part of the at least one wick 1062 may be embedded in the second heat pipe 1064.

The heat dissipation device 1006 may be located at least partially in the foldable phone device 1000. The first heat pipe 1060 may be located at least partially in the first device frame 1010. The first heat pipe 1060 may be coupled to one or more heat generating component (e.g., integrated device) in the first device frame 1010. The second heat pipe 1064 may be located at least partially in the second device frame 1020. The at least one wick 1062 may be coupled to and/or extend through the at least one hinge 1005. It is noted that instead of and/or in conjunction with a heat pipe, the foldable phone device 1000 may include one or more vapor chambers and/or one or more heat sinks.

Different implementations may use different heat dissipation devices. FIGS. 11 and 12 illustrate examples of heat dissipation devices. FIG. 11 illustrates a heat dissipation device 1100 that includes two heat pipes. The heat dissipation device 1100 includes a first heat pipe 1110, a wick 1120 and a second heat pipe 1130. The wick 1120 is coupled to the first heat pipe 1110 and the second heat pipe 1130. A part of the wick 1120 may be located in the first heat pipe 1110. Another part of the wick 1120 may be located in the second heat pipe 1130. The wick 1120 may include a flexible wick. The wick 1120 may include a mesh (e.g., flexible mesh, metal mesh, flexible metal mesh) . The heat dissipation device 1100 may include a first sealing plug 1112 and a second sealing plug 1132. The first sealing plug 1112 is coupled to the first heat pipe 1110 and a part of the wick 1120. The second sealing plug 1132 is coupled to the second heat pipe 1130 and another part of the wick 1120. The wick 1120 may be one wick or several wicks.

FIG. 12 illustrates a heat dissipation device 1200 that includes two vapor chambers. The heat dissipation device 1200 includes a first vapor chamber 1210, a wick 1220 and a second vapor chamber 1230. The wick 1220 is coupled to the first vapor chamber 1210 and the second vapor chamber 1230. A part of the wick 1220 may be located in the first vapor chamber 1210. Another part of the wick 1220 may be located in the second vapor chamber 1230. The wick 1220 may include a flexible wick. The wick 1220 may include a mesh (e.g., flexible mesh, metal mesh, flexible metal mesh) . The heat dissipation device 1200 may include a first sealing plug 1212 and a second sealing plug 1232. The first sealing plug 1212 is coupled to the first vapor chamber 1210 and a part of the wick 1220. The second sealing plug 1232 is coupled to the second vapor chamber 1230 and another part of the wick 1220. The wick 1220 may be one wick or several wicks.

In some implementations, a heat dissipation device may be a combination of a heat pipe, a wick and a vapor chamber. In some implementations, a heat dissipation device may be a combination of a heat pipe, a wick and a heat sink. In some implementations, a heat dissipation device may be a combination of a vapor chamber, a wick and a heat sink. It is noted that a heat pipe may be replaced and/or substituted with a vapor chamber. Thus, a heat pipe may be used instead of a vapor chamber. Similarly, a vapor chamber may be used instead of a heat pipe. In some implementations, the second heat pipe and/or the second vapor chamber may be optional. Thus, in some implementations, the heat dissipation device may include one heat pipe and a flexible wick or one vapor chamber and a flexible wick. The heat dissipation device may be directly or indirectly coupled to any components in a device. In some implementations, a thermal interface material (TIM) may be used to couple the heat dissipation device to one or more components in a device. The thermal interface material (TIM) may touch a heat pipe, a wick and/or a vapor chamber.

FIG. 13 illustrates an example of how a heat pipe 1306 may function to provide heat dissipation. The heat pipe 1306 may be part of a heat dissipation device (e.g., 106, 506, 1100) . The heat pipe 1306 may be a representation of any of the heat pipes (e.g., 160, 164, 560) in the disclosure. The heat pipe 1306 may be a two phase heat dissipation device. The heat pipe 1306 has a straight shape. However, the heat pipe 1306 may include other shapes that include curves, turns and/or bends. The heat pipe 1306 includes a casing 1300, a wick 1301, a cavity 1302, a fluid 1303 and a sealing plug 1310. The wick 1301 is located along the casing 1300. The cavity 1302 may be defined by the wick 1301. The fluid 1303 is located in the heat pipe 1306. The fluid 1303 may have different phases depending on the temperatures in the heat pipe 1306. Different implementations may use different fluids for the fluid 1303. A part of the wick 1301 may be located in the casing 1300. Another part of the wick 1301 may be located outside of the casing 1300. The wick 1301 may include a flexible wick (e.g., flexible mesh, flexible metal mesh) . The sealing plug 1310 may seal the casing 1300, ensuring the fluid 1303 stays within the casing 1300.

In one implementation, a part of the heat pipe 1306 may be located in/near a higher temperature environment A. In one example, the higher temperature environment A may be near an integrated device. Another part of the heat pipe 1306 may be located in/near a lower temperature environment B. In one example, the lower temperature environment B may be near a heat sink, another heat pipe, and/or a vapor chamber. At stage 1 of FIG. 13, the liquid of the fluid 1303 in the wick 1301 evaporates into vapor, which absorbs the thermal energy of the higher temperature environment A. At stage 2 of FIG. 13, the vapor of the fluid 1303 then migrates along the cavity 1302 towards the lower temperature environment B. At stage 3 of FIG. 13, the vapor of the fluid 1303 condenses back to a liquid and is absorbed by the wick 1301, releasing the thermal energy in the lower temperature environment B. The liquid of the fluid 1303 flows through the wick 1301 towards the higher temperature environment A. It is noted that fluid 1303 may have different phases while inside the heat pipe 1306. Thus, in some implementations, some of the fluid 1303 may be in a liquid state and some of the fluid 1303 may be in a vapor state.

In some implementations, environment A may be a lower temperature environment, and environment B may be a higher temperature environment. In such cases, the flow of the thermal energy, the flow of vapor and/or the flow of the liquid may be opposite to how it is described above in FIG. 13. A vapor chamber may operate in a similar manner as described for the heat pipe in FIG. 13.

An integrated device (e.g., 110) may include a die (e.g., semiconductor bare die) . The integrated device may include a power management integrated circuit (PMIC) . The integrated device may include an application processor. The integrated device may include a modem. The integrated device may include a radio frequency (RF) device, a passive device, a filter, a capacitor, an inductor, an antenna, a transmitter, a receiver, a gallium arsenide (GaAs) based integrated device, a surface acoustic wave (SAW) filter, a bulk acoustic wave (BAW) filter, a light emitting diode (LED) integrated device, a silicon (Si) based integrated device, a silicon carbide (SiC) based integrated device, a memory, power management processor, and/or combinations thereof. An integrated device may include at least one electronic circuit (e.g., first electronic circuit, second electronic circuit, etc…) . An integrated device may include an input/output (I/O) hub. An integrated device may include transistors. An integrated device may be an example of an electrical component and/or electrical device.

In some implementations, an integrated device may be a chiplet. A chiplet may be fabricated using a process that provides better yields compared to other processes used to fabricate other types of integrated devices, which can lower the overall cost of fabricating a chiplet. Different chiplets may have different sizes and/or shapes. Different chiplets may be configured to provide different functions. Different chiplets may have different interconnect densities (e.g., interconnects with different width and/or spacing) . In some implementations, several chiplets may be used to perform the functionalities of one or more chips (e.g., one more integrated devices) . As mentioned above, using several chiplets that perform several functions may reduce the overall cost of a package relative to using a single chip to perform all of the functions of a package. In some implementations, one or more of the chiplets and/or one of more of integrated devices (e.g., 110) described in the disclosure may be fabricated using the same technology node or two or more different technology nodes. For example, an integrated device may be fabricated using a first technology node, and a chiplet may be fabricated using a second technology node that is not as advanced as the first technology node. In such an example, the integrated device may include components (e.g., interconnects, transistors) that have a first minimum size, and the chiplet may include components (e.g., interconnects, transistors) that have a second minimum size, where the second minimum size is greater than the first minimum size. In some implementations, a first integrated device and a second integrated device of a package, may be fabricated using the same technology node or different technology nodes. In some implementations, a chiplet and another chiplet of a package, may be fabricated using the same technology node or different technology nodes.

A technology node may refer to a specific fabrication process and/or technology that is used to fabricate an integrated device and/or a chiplet. A technology node may specify the smallest possible size (e.g., minimum size) that can be fabricated (e.g., size of a transistor, width of trace, gap with between two transistors) . Different technology nodes may have different yield loss. Different technology nodes may have different costs. Technology nodes that produce components (e.g., trace, transistors) with fine details are more expensive and may have higher yield loss, than a technology node that produces components (e.g., trace, transistors) with details that are less fine. Thus, more advanced technology nodes may be more expensive and may have higher yield loss, than less advanced technology nodes. When all of the functions of a package are implemented in single integrated devices, the same technology node is used to fabricate the entire integrated device, even if some of the functions of the integrated devices do not need to be fabricated using that particular technology node. Thus, the integrated device is locked into one technology node. To optimize the cost of a package, some of the functions can be implemented in different integrated devices and/or chiplets, where different integrated devices and/or chiplets may be fabricated using different technology nodes to reduce overall costs. For example, functions that require the use of the most advanced technology node may be implemented in an integrated device, and functions that can be implemented using a less advanced technology node can be implemented in another integrated device and/or one or more chiplets. One example, would be an integrated device, fabricated using a first technology node (e.g., most advanced technology node) , that is configured to provide compute applications, and at least one chiplet, that is fabricated using a second technology node, that is configured to provide other functionalities, where the second technology node is not as costly as the first technology node, and where the second technology node fabricates components with minimum sizes that are greater than the minimum sizes of components fabricated using the first technology node. Examples of compute applications may include high performance computing and/or high performance processing, which may be achieved by fabricating and packing in as many transistors as possible in an integrated device, which is why an integrated device that is configured for compute applications may be fabricated using the most advanced technology node available, while other chiplets may be fabricated using less advanced technology nodes, since those chiplets may not require as many transistors to be fabricated in the chiplets. Thus, the combination of using different technology nodes (which may have different associated yield loss) for different integrated devices and/or chiplets, can reduce the overall cost of a package, compared to using a single integrated device to perform all the functions of the package.

Another advantage of splitting the functions into several integrated devices and/or chiplets, is that it allows improvements in the performance of the package without having to redesign every single integrated device and/or chiplet. For example, if a configuration of a package uses a first integrated device and a first chiplet, it may be possible to improve the performance of the package by changing the design of the first integrated device, while keeping the design of the first chiplet the same. Thus, the first chiplet could be reused with the improved and/or different configured first integrated device. This saves cost by not having to redesign the first chiplet, when packages with improved integrated devices are fabricated.

Exemplary Sequence for Fabricating a Heat Dissipation Device Package Comprising an Embedded Heat Pipe

In some implementations, fabricating a heat dissipation device includes several processes. FIGS. 14A–14B illustrate an exemplary sequence for providing or fabricating a heat dissipation device. In some implementations, the sequence of FIGS. 14A–14B may be used to provide or fabricate the heat dissipation device 106. However, the process of FIGS. 14A–14B may be used to fabricate any of the heat dissipation device (e.g., 106, 506) described in the disclosure. For example, the process of FIGS. 14A–14B may be used to fabricate a heat dissipation device that includes a vapor chamber.

It should be noted that the sequence of FIGS. 14A–14B may combine one or more stages in order to simplify and/or clarify the sequence for providing or fabricating a package. In some implementations, the order of the processes may be changed or modified. In some implementations, one or more of processes may be replaced or substituted without departing from the scope of the disclosure.

Stage 1, as shown in FIG. 14A, illustrates a state after a casing 1300 is provided. The casing 1300 may include a cavity. The casing 1300 may be a first casing. The casing 1300 may include a metal. The casing 1300 may be an external wall for a heat pipe. Although not shown, another casing may be provided. The other casing may be a second casing. The other casing may be similar to the casing 1300.

Stage 2 illustrates a state a wick 1301 is provided in the casing 1300. The wick 1301 may include a mesh. The wick 1301 may also be provided in another casing that is similar to the casing 1300. Thus, in some implementations, one part of the wick 1301 is provided in the casing 1300 and another part of the wick 1301 is provided in another casing (e.g., 1300b) . A cavity 1302 may be located in the casing 1300.

Stage 3, as shown in FIG. 14B, illustrates a state after a sealing plug 1310 is coupled to the casing 1300. In some implementations, before the sealing plug 1310 is coupled to the casing 1300, a fluid 1303 may be provided in the casing 1300. The sealing plug 1310 may seal and/or close the casing 1300. Stage 3 of FIG. 14A may illustrate a heat pipe 1306 (e.g., first heat pipe) . The heat pipe 1306 may represent the first heat pipe 1110.

Stage 4 illustrates a state after a sealing plug 1310b is coupled to the casing 1300b. In some implementations, before the sealing plug 1310b is coupled to the casing 1300b, a fluid 1303 may be provided in the casing 1300b. The sealing plug 1310b may seal and/or close the casing 1300b. Stage 4 of FIG. 14B may illustrate a second heat pipe 1306b. The second heat pipe 1306b may represent the second heat pipe 1130. The wick 1301 is coupled to the heat pipe 1306 and the second heat pipe 1306b. The portion of the wick 1301 that is exterior to the casing 1300 and exterior to the casing 1300b may be a flexible wick.

One or more of the components, processes, features, and/or functions illustrated in FIGS. 1–6, 8–13 and 14A–14B may be rearranged and/or combined into a single component, process, feature or function or embodied in several components, processes, or functions. Additional elements, components, processes, and/or functions may also be added without departing from the disclosure. It should also be noted FIGS. 1–6, 8–13 and 14A–14B and its corresponding description in the present disclosure is not limited to dies and/or ICs. In some implementations, FIGS. 1–6, 8–13 and 14A–14B and its corresponding description may be used to manufacture, create, provide, and/or produce devices and/or integrated devices. In some implementations, a device may include a die, an integrated device, an integrated passive device (IPD) , a die package, an integrated circuit (IC) device, a device package, an integrated circuit (IC) package, a wafer, a semiconductor device, a package-on-package (PoP) device, a heat dissipating device and/or an interposer.

It is noted that the figures in the disclosure may represent actual representations and/or conceptual representations of various parts, components, objects, devices, packages, integrated devices, integrated circuits, and/or transistors. In some instances, the figures may not be to scale. In some instances, for purpose of clarity, not all components and/or parts may be shown. In some instances, the position, the location, the sizes, and/or the shapes of various parts and/or components in the figures may be exemplary. In some implementations, various components and/or parts in the figures may be optional.

The word “exemplary” is used herein to mean “serving as an example, instance, or illustration. ” Any implementation or aspect described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects of the disclosure. Likewise, the term “aspects” does not require that all aspects of the disclosure include the discussed feature, advantage or mode of operation. The term “coupled” is used herein to refer to the direct or indirect coupling (e.g., mechanical coupling) between two objects. For example, if object A physically touches object B, and object B touches object C, then objects A and C may still be considered coupled to one another-even if they do not directly physically touch each other. An object A, that is coupled to an object B, may be coupled to at least part of object B. The term “electrically coupled” may mean that two objects are directly or indirectly coupled together such that an electrical current (e.g., signal, power, ground) may travel between the two objects. Two objects that are electrically coupled may or may not have an electrical current traveling between the two objects. The use of the terms “first” , “second” , “third” and “fourth” (and/or anything above fourth) is arbitrary. Any of the components described may be the first component, the second component, the third component or the fourth component. For example, a component that is referred to a second component, may be the first component, the second component, the third component or the fourth component. The terms “encapsulate” , “encapsulating” and/or any derivation means that the object may partially encapsulate or completely encapsulate another object. The terms “top” and “bottom” are arbitrary. A component that is located on top may be located over a component that is located on a bottom. A top component may be considered a bottom component, and vice versa. As described in the disclosure, a first component that is located “over” a second component may mean that the first component is located above or below the second component, depending on how a bottom or top is arbitrarily defined. In another example, a first component may be located over (e.g., above) a first surface of the second component, and a third component may be located over (e.g., below) a second surface of the second component, where the second surface is opposite to the first surface. It is further noted that the term “over” as used in the present application in the context of one component located over another component, may be used to mean a component that is on another component and/or in another component (e.g., on a surface of a component or embedded in a component) . Thus, for example, a first component that is over the second component may mean that (1) the first component is over the second component, but not directly touching the second component, (2) the first component is on (e.g., on a surface of) the second component, and/or (3) the first component is in (e.g., embedded in) the second component. A first component that is located “in” a second component may be partially located in the second component or completely located in the second component. A value that is about X–XX, may mean a value that is between X and XX, inclusive of X and XX. The value (s) between X and XX may be discrete or continuous. The term “about ‘value X’ ” , or “approximately value X” , as used in the disclosure means within 10 percent of the ‘value X’ . For example, a value of about 1 or approximately 1, would mean a value in a range of 0.9–1.1. A “plurality” of components may include all the possible components or only some of the components from all of the possible components. For example, if a device includes ten components, the use of the term “the plurality of components” may refer to all ten components or only some of the components from the ten components.

In some implementations, an interconnect is an element or component of a device or package that allows or facilitates an electrical connection between two points, elements and/or components. In some implementations, an interconnect may include a trace (e.g., trace interconnect) , a via (e.g., via interconnect) , a pad (e.g., pad interconnect) , a pillar, a metallization layer, a redistribution layer, and/or an under bump metallization (UBM) layer /interconnect. In some implementations, an interconnect may include an electrically conductive material that may be configured to provide an electrical path for a signal (e.g., a data signal) , ground and/or power. An interconnect may include more than one element or component. An interconnect may be defined by one or more interconnects. An interconnect may include one or more metal layers. An interconnect may be part of a circuit. Different implementations may use different processes and/or sequences for forming the interconnects. In some implementations, a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, a sputtering process, a spray coating, and/or a plating process may be used to form the interconnects.

Also, it is noted that various disclosures contained herein may be described as a process that is depicted as a flowchart, a flow diagram, a structure diagram, or a block diagram. Although a flowchart may describe the operations as a sequential process, many of the operations can be performed in parallel or concurrently. In addition, the order of the operations may be re-arranged. A process is terminated when its operations are completed.

In the following, further examples are described to facilitate the understanding of the invention.

Aspect 1: A device comprising a frame; a first temple coupled to the frame through a first hinge; a second temple coupled to the frame through a second hinge; and a heat dissipation device located in at least part of the first temple, wherein the heat dissipation device includes a wick that extends to the frame.

Aspect 2: The device of aspect 1, further comprising a heat sink located in at least part of the frame.

Aspect 3: The device of aspect 2, wherein the heat sink is coupled to the wick.

Aspect 4: The device of aspect 1, further comprising a heat pipe located in at least part of the frame.

Aspect 5: The device of aspect 4, wherein the heat pipe is coupled to the wick.

Aspect 6: The device of aspects 1 through 5, wherein the wick comprises a mesh.

Aspect 7: The device of aspects 1 through 6, wherein the heat dissipation device includes a heat pipe or a vapor chamber.

Aspect 8: The device of aspects 1 through 7, wherein the heat dissipation device includes a sealant component.

Aspect 9: The device of aspects 1 through 8, the wick is a flexible wick that extends through the first hinge.

Aspect 10: The device of aspects 1 through 9, wherein the device is an eye wear device.

Aspect 11: A device comprising a first device frame; a second device frame; a first hinge coupled to the first device frame and the second device frame; a second hinge coupled to the first device frame and the second device frame; and a heat dissipation device located in at least part of the first device frame, wherein the heat dissipation device includes a wick that extends to the second device frame.

Aspect 12: The device of aspect 11, wherein the heat dissipation device includes a heat pipe or a vapor chamber.

Aspect 13: The device of aspects 11 through 12, further comprising a second heat dissipation device located in at least part of the second device frame, wherein the wick extends to the second heat dissipation device.

Aspect 14: The device of aspect 13, wherein the second heat dissipation device includes a heat pipe, a vapor chamber or a heat sink.

Aspect 15: The device of aspects 11 through 14, wherein the wick extends through the first hinge.

Aspect 16: The device of aspect 15, wherein the wick extends through the second hinge.

Aspect 17: The device of aspects 11 through 16, wherein the device includes an eye wear device, a laptop and/or a foldable phone.

Aspect 18: The device of aspects 11 through 17, wherein the first device frame includes an integrated device.

Aspect 19: The device of aspect 18, wherein the first device frame includes a display.

Aspect 20: The device of aspect 18, wherein the second device frame includes a display.

The various features of the disclosure described herein can be implemented in different systems without departing from the disclosure. It should be noted that the foregoing aspects of the disclosure are merely examples and are not to be construed as limiting the disclosure. The description of the aspects of the present disclosure is intended to be illustrative, and not to limit the scope of the claims. As such, the present teachings can be readily applied to other types of apparatuses and many alternatives, modifications, and variations will be apparent to those skilled in the art.

Claims

A device comprising:

a frame;

a first temple coupled to the frame through a first hinge;

a second temple coupled to the frame through a second hinge; and

a heat dissipation device located in at least part of the first temple, wherein the heat dissipation device includes a wick that extends to the frame.
The device of claim 1, further comprising a heat sink located in at least part of the frame.
The device of claim 2, wherein the heat sink is coupled to the wick.
The device of claim 1, further comprising a heat pipe located in at least part of the frame.
The device of claim 4, wherein the heat pipe is coupled to the wick.
The device of claim 1, wherein the wick comprises a mesh.
The device of claim 1, wherein the heat dissipation device includes a heat pipe or a vapor chamber.
The device of claim 1, wherein the heat dissipation device includes a sealant component.
The device of claim 1, the wick is a flexible wick that extends through the first hinge.
The device of claim 1, wherein the device is an eye wear device.
A device comprising:

a first device frame;

a second device frame;

a first hinge coupled to the first device frame and the second device frame;

a second hinge coupled to the first device frame and the second device frame; and

a heat dissipation device located in at least part of the first device frame, wherein the heat dissipation device includes a wick that extends to the second device frame.
The device of claim 11, wherein the heat dissipation device includes a heat pipe or a vapor chamber.
The device of claim 11, further comprising a second heat dissipation device located in at least part of the second device frame, wherein the wick extends to the second heat dissipation device.
The device of claim 13, wherein the second heat dissipation device includes a heat pipe, a vapor chamber or a heat sink.
The device of claim 11, wherein the wick extends through the first hinge.
The device of claim 15, wherein the wick extends through the second hinge.
The device of claim 11, wherein the device includes an eye wear device, a laptop and/or a foldable phone.
The device of claim 11, wherein the first device frame includes an integrated device.
The device of claim 18, wherein the first device frame includes a display.
The device of claim 18, wherein the second device frame includes a display.