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WO2025224511A1 - Composites de mousse de silicone contenant des microsphères et leurs procédés de fabrication - Google Patents

Composites de mousse de silicone contenant des microsphères et leurs procédés de fabrication

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Publication number
WO2025224511A1
WO2025224511A1 PCT/IB2025/051486 IB2025051486W WO2025224511A1 WO 2025224511 A1 WO2025224511 A1 WO 2025224511A1 IB 2025051486 W IB2025051486 W IB 2025051486W WO 2025224511 A1 WO2025224511 A1 WO 2025224511A1
Authority
WO
WIPO (PCT)
Prior art keywords
microsphere
silicone foam
containing silicone
foam composite
groups
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/IB2025/051486
Other languages
English (en)
Inventor
James M. Nelson
Aaron R. BEABER
Jeffrey P. KALISH
David A. GRIES
David Scott Thompson
Pierre R. Bieber
Thomas APELDORN
Michael Kempf
Jean A. Tangeman
Roman Konietzny
Eike H. KLÜNKER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
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Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of WO2025224511A1 publication Critical patent/WO2025224511A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/0061—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof characterized by the use of several polymeric components
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/02—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by the reacting monomers or modifying agents during the preparation or modification of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/40—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2383/04—Polysiloxanes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the present disclosure relates to silicone foams containing both gas-filled cavities and hollow inorganic microspheres. Methods of making such microsphere-containing silicone foam composites and their uses are also described. SUMMARY [0002] Briefly, in one aspect, the present disclosure provides methods of making a microsphere- containing silicone foam composite.
  • the methods comprise blending a component A with a component B to a form a blend, wherein component A comprises at least one first poly(organosiloxane) having a plurality of alkenyl groups and component B comprises at least one second poly(organosiloxane) having a plurality of Si-H groups, wherein at least one of component A and component B further comprises a plurality of hollow inorganic microspheres; foaming the blend by a reaction between Si-H groups of the second poly(organosiloxane) and a compound comprising at least one hydroxyl containing moiety; and addition curing the first poly(organosiloxane) and the second poly(organosiloxane) in the presence of a catalyst to form a cured silicone foam comprising a plurality of gas filled cavities surrounded by a cured silicone resin.
  • the cured silicone foam comprises from 10 to 50 volume percent of the hollow inorganic microspheres based on the total volume of the microsphere-containing silicone foam composite.
  • the present disclosure provides microsphere-containing silicone foam composites.
  • the microsphere-containing silicone foam composites comprise a foamed silicone comprising the reaction product of at least one first poly(organosiloxane) having a plurality of alkenyl groups and at least one second poly(organosiloxane) having a plurality of Si-H groups, wherein the foamed silicone comprises a plurality of gas filled cavities surrounded by a cured silicone resin and 10 to 50 volume percent of hollow inorganic microspheres based on the total volume of the microsphere- containing silicone foam composite.
  • FIG.1 illustrates an exemplary battery module assembly according to one aspect of the present disclosure.
  • FIGS.2A-D are optical microscope images of cross sections of various microsphere- containing silicone foam composites.
  • FIG.3A illustrates an exemplary battery module with vent seals prior to rupture.
  • FIG.3B illustrates the battery module of FIG.3A after rupture DETAILED DESCRIPTION
  • Batteries can be broadly classified into primary and secondary batteries. Primary batteries are intended to be used until depleted, after which they are simply replaced with one or more new batteries. Secondary batteries, more commonly referred to as rechargeable batteries, are capable of being repeatedly recharged and reused.
  • secondary batteries examples include nickel-cadmium batteries, nickel-metal hybrid batteries, nickel-hydrogen batteries, and lithium batteries.
  • secondary batteries Due to their high potential, high energy, power densities, and good lifetimes, secondary batteries are now the preferred battery technology. For example, in the automotive industry different sizes and shapes of lithium-ion battery cells are being manufactured and are subsequently assembled into modules (or packs) of different configurations.
  • An automotive secondary battery module typically consists of many battery cells, sometimes several hundreds or even thousands, to meet desired power and capacity needs.
  • the chemistries used in rechargeable batteries are less stable than those used in primary cells. For example, lithium-ion cells are susceptible to thermal run-away which can occur when elevated temperatures trigger exothermic reactions, raising the temperature even further.
  • thermal energy rapidly released from one cell can lead to increased temperatures of adjacent cells ultimately propagating the effect throughout the battery module. This can disrupt battery performance and, left unimpeded, result in significant damage including combustion of the battery and extensive damage to the surrounding area.
  • Thermal barriers positioned between and around cells can help inhibit the rate and extent of thermal transfer from one cell to the next.
  • the highest temperatures and abrasive wear may be experienced around vent ports within the cell because they represent areas with a decreased resistance to gas flow that allows overheated gases to converge to that location.
  • the vent port gives the runaway cell a controllable direction to discharge its pressure, heat, and debris during failure.
  • Silicone-based foams with functional fillers in particular thermally-insulating polymeric foam layers, are described for use as a venting sealant in automotive battery modules.
  • the polymeric foam layers are intended to provide good compressibility and thermal insulation during normal use and controllably fail in one uncompressed direction (e.g., its thickness or z- direction) while providing a high degree of thermal insulation and structural support in the other xy- directions.
  • These polymeric foam layers allow for easier cell assembly over liquid sealants because they do not require application equipment.
  • these polymeric foam layers provide another barrier between neighboring battery cells and can be placed over venting ports, which experience the highest temperature and pressure during battery cell failure, so that the polymeric foam layer ruptures easily in the thickness direction and allows gases to escape without additional weakening of the material (such as slits, and cuts), reducing internal pressure within the cell and/or module.
  • Secondary battery cells also change dimensions (expand and contract) during charging and discharging cycles and swell over the lifetime of the battery. It has been noted that if these batteries swell unconstrained, the lifetime of the battery is shortened. By providing resistance to swelling in the form of a cushioning pad between battery cells, the battery lifetime can be improved.
  • Patent Number 10,501,597 B2 (“Secondary Battery Pack with Improved Thermal Management”) describes the drawbacks of using chemically or physically foamed materials in battery pack applications. Instead, this patent describes the use of silicone rubber syntactic foams comprising a liquid silicone rubber binder and hollow glass beads. The stiffness and resilience of syntactic foams may be dominated by the mechanical properties of the silicone rubber binder. In fact, the addition of rigid glass microspheres may lead to increases in syntactic foam rigidity at higher compressive strains. [0014]
  • U.S. Patent Number 5,162,397 (“Silicone Foams”) describes the need for foams having a low density and good mechanical properties for applications where fire resistance is desirable.
  • the patent describes the incorporation of chemically treated hollow glass spheres in a foamed silicone.
  • the resulting foams are described as “rather rigid” and are said to “display a good resistance to compression, tension and deflection.”
  • the rigid hollow glass spheres are said to contribute to the strength of the cured foam.
  • glass bubbles are taught to contribute to Young’s compressive modulus in proportion to their volume fraction in the composite.
  • foams with improved thermal barrier properties while providing softer foams with the desired compression performance, e.g., for use in secondary battery packs in automotive applications.
  • Thermal Barrier Performance As discussed above, an individual cell of a secondary battery such as lithium-ion battery can reach an elevated temperature triggering an exothermic reaction.
  • the heat generated can be transferred to adjacent cells leading to a cascading effect where the temperature increase initiated within a single cell propagates throughout the entire battery module resulting in extensive damage.
  • the microsphere-containing silicone foam composites of the present invention can be used as thermal barriers, inhibiting the rate of heat transfer between adjacent cells.
  • the following Hot-Side Cold-Side test method (“HSCS” described in more detail in the Examples) can be used to determine the thermal barrier performance of the composites. In this test method, heat is applied to one side of the composite (i.e., the hot side) at a reference temperature, e.g., 600 °C.
  • the silicone foam composites of the present disclosure have a thermal barrier performance on the hot-side cold-side test at 300 seconds of no greater than 600 °C ⁇ mm when measured according to the HSCS test (i.e., TBP @ Tref 600 °C and 300 s of 600 °C ⁇ mm or less).
  • the silicone foam composite of the present disclosure has a TBP @ Tref 600 °C and 300 s of 500 °C ⁇ mm or less.
  • a test time of 600 seconds may be used for a more challenging thermal barrier target.
  • the silicone foam composites of the present disclosure have a thermal barrier performance on the hot- side cold-side test at 600 seconds of no greater than 850 °C ⁇ mm when measured according to HSCS- test (i.e., TBP @ Tref 600 °C and 600 s of 850 °C ⁇ mm or less).
  • TBP @ Tref 600 °C and 600 s of 850 °C ⁇ mm or less the silicone foam composite of the present disclosure has a TBP @ Tref 600 °C and 600 s of no greater than 800, 700, 600, or even 550 °C ⁇ mm.
  • the thickness of the composite may be selected to increase the time provided by the composite to maintain a temperature below a target cold side temperature, e.g., 150 °C.
  • a target TBP value may be identified to increase the time provided by the composite to maintain a temperature below a target cold side temperature, e.g., 150 °C.
  • the thickness and TBP may be selected to provide at least 400 seconds before the cold side temperature reaches 150 °C as measured according to the HSCS test.
  • the thickness and TBP may be selected to provide at least 500, at least 600, at least 700 or even at least 800 seconds before the cold side temperature reaches 150 °C.
  • the thermal conductivity of the composites may be useful in identifying suitable composites. However, the thermal conductivity should be measured under compressed conditions comparable to what might occur in a battery cell application. In some cases, the thermal conductivity of the composites when measured according to ASTM D5470 at 100 kPa is no greater than 0.15 W/m ⁇ K, e.g., no greater than 0.12, 0.1, 0.095 or even no greater than 0.08 W/m ⁇ K.
  • the thermal conductivity of the composites when measured according to ASTM D5470 at 100 kPa is from 0.04 to 0.12 W/m ⁇ K, e.g., 0.04 to 0.1, 0.05 to 0.095, or even 0.05 to 0.08 W/m ⁇ K.
  • Compression Performance is from 0.04 to 0.12 W/m ⁇ K, e.g., 0.04 to 0.1, 0.05 to 0.095, or even 0.05 to 0.08 W/m ⁇ K.
  • Compression Performance In addition to thermal barrier properties, the microsphere- containing silicone foam composites of the present invention provide mechanical properties adapted to accommodate changes in dimensions of the cells during charging and discharging cycles and swell over the lifetime of the battery. Generally, there is a desire to have “soft” foams, i.e., foams that exhibit low compressive forces at high compressive strains.
  • the composites of the present disclosure have a compressive force of no greater than 250 kPa at compressive strains of up to 50%.
  • the compressive force is no greater than 200, no greater than 100 kPa, or even no greater than 50 kPa at 50% compressive strain.
  • 50% compressive strain may be adequate in some applications, others may require low compressive forces at even higher strains, e.g., at compressive strains of 75%.
  • the composites of the present disclosure have a compressive force of no greater than 800 kPa at compressive strains of up to 75%. In some cases, the compressive force is no greater than 500, or even no greater than 300 kPa at 75% compressive strain.
  • the foam composites should have good resilience as indicated by a low compression set.
  • the addition of hollow glass microspheres to a foamed silicone matrix can enable improved thermal barrier properties in combination with low compression forces at high compressive strains.
  • the microsphere-containing silicone foam composites of the present disclosure are based on a foamed silicone matrix derived from a curable composition comprising poly(organosiloxane)s.
  • a poly(organosiloxane) is an oligomer or polymer having a plurality of repeating groups represented by the general formula h erein: each R 6 w independently represents or R 7 independently represents alkyl, aryl, or H; p is an integer greater than or equal to 2; and each asterisk indicates the connection site of the repeat unit to another group.
  • the foamed silicone matrix is derived from (A) at least one poly(organosiloxane) having a plurality of alkenyl groups, (B) at least one poly(organosiloxane) having a plurality of Si-H groups, (C) at least one hydroxyl containing compound, and (D) an effective amount of curing catalyst.
  • each R 3 represents an alkenyl group having from 1 to 20, preferably from 1 to 5, carbon atoms.
  • suitable alkenyl groups include vinyl, allyl, hexenyl, decenyl, or tetradecenyl.
  • R 3 represents a vinyl group.
  • Each R 4 independently represents an alkyl or fluoroalkyl group having from 1 to 30 carbon atoms or phenyl.
  • each R 4 independently represents an alkyl group having from 1 to 8 carbon atoms, or an alkyl group having from 1 to 4 carbon atoms, or phenyl. Methyl and ethyl groups may be preferred.
  • the subscript d represents an integer greater than or equal to zero, e.g., in some cases at least 5, at least 10, at least 20, at least 30, or even at least 40). The subscript d should not be so large as to inhibit the handling (for example, mixing) of the components.
  • the subscript e represents an integer greater than or equal to zero. In some cases, e is zero. In some cases, the subscript e may be selected to introduce additional alkenyl (e.g., vinyl) functional groups in the backbone to control reactivity or adjust physical properties.
  • Component B Component B.
  • Exemplary poly(organosiloxane)s having a plurality of Si-H groups can be represented by the formula 1 wherein each R independently represents an group 1 to 18 carbon atoms or phenyl. In some embodiments, each R 1 independently represents an alkyl group having from 1 to 8 carbon atoms, or from 1 to 4 carbon atoms, or a phenyl. Methyl and ethyl groups may be preferred.
  • Each X independently represents hydrogen (i.e., H) or R 1 wherein R 1 is as previously defined.
  • the subscript a represents an integer greater than or equal to zero. In some cases, subscript a is zero, in which case both X groups represent H.
  • subscript a is at least 5, at least 10, at least 20, at least 30, or even at least 40. Typically, a is less than 100, e.g., less than 50, although this is not a requirement.
  • the subscript b represents an integer greater than or equal to two. In some cases, subscript b is at least 5, at least 10, at least 20, at least 30, or even at least 40. Typically, b is less than 100, e.g., less than 50, although this is not a requirement.
  • Examples of such poly(organosiloxane)s include trimethylsilyl-terminated methylhydrosiloxane-dimethylsiloxane copolymers marketed, for example, by: Gelest Inc., Morrisville, Pennsylvania (e.g., product codes: HMS-013, HMS-031, HMS-053, HMS-064, HMS-071, HMS-082, HMS-151, HMS-301, HMS-501, HMS-993); SiSiB Silanes and Silicones, Nanjing, China (e.g., under the trade designations SISIB HF2050 in grades 100H75, 15H75, 55H55, 22H55, 60H36, 15H36, 15H100, 60H120,15H43, 115H41, 21H20, 70H18, 20H11, and HF2050); and Dow Corning, Midland, Michigan (e.g., under the trade designation SYL-OFF 7678).
  • SYL-OFF 7678
  • Examples of such poly(organosiloxane)s also include: trimethylsilyl-terminated poly(methylhydrosiloxane), for example, as marketed by Genesee Polymers Corp., Burton, Michigan, under the trade designations GP-499, GP-535, GP-536, and GP-678 and from SiSiB Silanes and Silicones, Hanjing, China under the trade designation PF2020; trimethylsilyl-terminated poly(ethylhydrosiloxane), for example, as marketed by SiSiB Silanes and Silicones under the trade designation HF2025; hydrogen-terminated polydimethylsiloxane as marketed by SiSiB Silanes and Silicones under the trade designation HF2030 in grades M134, M400, M1250, M200, M400, M7500, M10000, M17500, M28000, and M62000; hydrogen terminated-polydiphenylsiloxane, for example, as marketed by Gene
  • suitable poly(organosiloxane)s having a plurality of Si-H groups have a number average molecular weight (M n ) of 400 to 100,000 grams/mole, often 500 to 50,000 grams/mole or even 600 to 10,000 grams/mole, although higher and lower molecular weights may also be used.
  • Component C Generally, when combined, the poly(organosiloxane) having a plurality of Si-H groups (Component B) and the at least one hydroxyl containing compound (Component C) undergo a condensation reaction leading to the generation of a gas (e.g., hydrogen gas) and the formation of a plurality of cavities in the silicone resin.
  • a gas e.g., hydrogen gas
  • the hydroxyl containing compound comprises at least one hydroxyl group, e.g., at least two hydroxyl groups.
  • exemplary compounds containing at least one hydroxyl group include alcohols (e.g., C1 to C12 organic alcohols), polyols (in particular polyols having 3 to 12 carbon atoms and having an average of at least two hydroxyl groups per molecule), silanols, silanol containing poly(organosiloxane)s, silanol containing silanes, water, and any combinations or mixtures thereof.
  • the hydroxyl containing compound is a poly(organosiloxane) having a plurality of Si-OH groups represented by the formula wherein each R 2 independently represents an group 1 to 18 carbon atoms or phenyl.
  • suitable alkyl groups include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, decyl, dodecyl, hexadecyl, and octadecyl.
  • each R 2 independently represents an alkyl group having from 1 to 8 carbon atoms, or an alkyl group having from 1 to 4 carbon atoms, or phenyl.
  • Methyl and ethyl groups may be preferred.
  • the subscript c represents an integer greater than or equal to two. In some cases, the subscript c is at least 5, at least 10, at least 20, at least 30, or even at least 40. Typically, c is less than 100, e.g., less than 50, although this is not a requirement.
  • Examples of suitable poly(organosiloxane)s that include hydroxy-terminated poly(dimethylsiloxane)s are marketed, for example, by Gelest under the product numbers of DMS-S31, DMS-S32, DMS-S35, DMS-S42, DMS-S45, and DMS-S51; by Dow Corning under the trade designation OHX4070; by Genesee Polymer Corp. under the trade designation GP-426 ; by MilliporeSigma, Saint Louis, Missouri, under the product numbers 481939, 481955, 432997, 432989, 481963, 482005, 482161; and from SiSiB Silanes and Silicones under the trade designation OF0025.
  • Component D Component D.
  • a curing catalyst is selected to facilitate the addition cure of the poly(organosiloxane)s.
  • the curing catalyst is preferably a hydrosilylation catalyst. Suitable hydrosilylation catalysts can contain at least one of the following elements: Pt, Rh, Ru, Pd, Ni (e.g., Raney Nickel), and their combinations.
  • Exemplary catalysts include Karstedt’s catalyst shown in U.S. Pat. No.3,715,334 (Karstedt) or other platinum or rhodium catalysts known to those in the art.
  • Suitable catalysts also include microencapsulated hydrosilylation catalysts for example those known in the art such as seen in U.S. Pat. No.5,009,957 (Lee et al.).
  • the catalyst may be coupled to an inert or active support.
  • preferred catalysts include platinum type catalysts such as chloroplatinic acid, alcohol solutions of chloroplatinic acid, complexes of platinum and olefins, complexes of platinum and 1,3-divinyl-1,1,3,3-tetramethyldisiloxane and powders on which platinum is supported.
  • platinum catalysts are fully described in the literature. Mention may in particular be made of the complexes of platinum and of an organic product described in U.S. Pat.
  • an inhibitor may be added to the curable silicone composition to slow the cure of the compounded silicone matrix if needed.
  • Cure rate controllers are well known in the art.
  • U.S. Pat. No.3,923,705 refers to the use of vinyl contained cyclic siloxanes.
  • U.S. Pat. No. 3,445,420 describes the use of acetylenic alcohols.
  • U.S. Pat. No.3,188,299 shows the effectiveness of heterocyclic amines.
  • U.S. Pat. No.4,256,870 describes alkyl maleates used to control cure. Olefinic siloxanes can also be used as described in U.S. Pat. No.3,989,667.
  • Polydiorganosiloxanes containing vinyl radicals have also been used and this art can be seen in U.S. Pat. Nos.3,498,945, 4,256,870, and 4,347, 346.
  • Preferred inhibitors for this composition are methylvinylcyclosiloxanes, 3-methyl-1-butyn-3- ol, and 1-ethynyl-1-cyclohexanol with the most preferred being the 1,3,5,7-tetramethyl-1,3,5,7-tetravinyl- cyclotetrasiloxane in amounts from 0.002% to 1.00% of the silicone compound depending on the cure rate desired.
  • the preferred inhibitors include: 1,3,5,7-tetramethyl-1,3,5,7-tetravinyl-cyclotetrasiloxane; 3- methyl-1-butyn-3-ol; and 1-ethynyl-1-cyclohexanol.
  • Si-H silicon-bonded hydrogen groups
  • Suitable curable silicone foam resins include room temperature vulcanizing (RTV) silicones that are sold in a 2-part format that, upon mixing, cure to form the silicone foam resin.
  • Part A contains the poly(organosiloxane)s having a plurality of alkenyl groups (Component A) as well as the hydroxyl containing compound (Component C) and an addition cure catalyst (Component D).
  • Part B contains the poly(organosiloxane)s having a plurality of Si-H groups (Component B). In some cases, Part B may also contain poly(organosiloxane)s having a plurality of alkenyl groups such that a portion of Component A may be present in both parts of the two part system.
  • Exemplary 2-part silicone foam kits are available commercially and are sold under the trade designation RTF 8510 by Momentive Performance Materials Inc.
  • the foam composites of the present disclosure also include a plurality of hollow inorganic microspheres sometimes referred to as bubbles. Generally, these hollow microspheres comprise a thin inorganic shell surrounding a hollow core. Suitable inorganic microspheres include hollow glass microspheres and hollow ceramic microspheres.
  • Microspheres have been treated with, e.g., silanes and polysiloxanes to introduce reactive functional groups at their surfaces.
  • reactive functional group refers to moieties reactive with one or more of the poly(organosiloxane)s, e.g., vinyl groups and silicon-bonded hydrogen atoms.
  • the presence of such reactive functional groups could lead to additional crosslinking and an undesirable increase in the modulus and compressive force required for a given compressive strain. Therefore, in some cases, no greater than 10% by weight of the hollow inorganic microspheres are pretreated to provide reactive functional groups.
  • no greater than 5 wt.%, no greater than 1 wt.% or even 0 wt.% of the of the microspheres are pretreated with reactive functional groups.
  • non-reactive functional groups at their surfaces, i.e., moieties that do not react with the poly(organosiloxane)s, e.g., alkyl groups.
  • the introduction of such groups may improve compatibility of the microspheres with the selected resins.
  • Exemplary hollow glass microspheres include those marketed by 3M Co. (St. Paul, MN) under the trade designation “3M GLASS BUBBLES” (e.g., grades – K1, K15, S32, K37, S38, S38HS, S38XHS, K46, D32/4500, H50/10000, S60, S60HS, and iM30K); glass bubbles marketed by Potters Industries, Valley Forge, PA, (an affiliate of PQ Corporation) under the trade designations “Q- CEL HOLLOW SPHERES” and “SPHERICEL HOLLOW GLASS SPHERES” and hollow glass particles marketed by Silbrico Corp., Hodgkins, IL under the trade designation “SIL-CELL”.
  • 3M GLASS BUBBLES e.g., grades – K1, K15, S32, K37, S38, S38HS, S38XHS, K46, D32/4500, H50/10000, S60, S60HS, and iM30
  • Exemplary hollow ceramic particles include aluminosilicate particles extracted from pulverized fuel ash collected from coal-fired power stations (i.e., cenospheres).
  • Useful cenospheres include those marketed by Sphere One, Inc., Chattanooga, TN, under the trade designation “EXTENDOSPHERES HOLLOW SPHERES” (e.g., grades SG, MG, CG, TG, HA, SLG, SL-150, 300/600, 350 and FM-1); and those marketed by 3M Company under the trade designation “3M HOLLOW CERAMIC MICROSPHERES” (e.g., grades G-3125, G-3150, and G-3500).
  • EXTENDOSPHERES HOLLOW SPHERES e.g., grades SG, MG, CG, TG, HA, SLG, SL-150, 300/600, 350 and FM-1
  • 3M HOLLOW CERAMIC MICROSPHERES e.g.,
  • the core of the hollow microspheres comprises at least 50, 60, 70, 80, or even 90% of the diameter of the hollow microspheres.
  • the hollow inorganic microspheres have an average diameter of no greater than 500 micrometers, e.g., no greater than 400 micrometers.
  • the microspheres have an average diameter of no greater than 250 micrometers, for example, no greater than 150, no greater than 100 micrometers, or even no greater than 50 micrometers.
  • the microspheres have an average diameter of at least 10 or 20 micrometers.
  • the microspheres have an average diameter of 10 to 400 micrometers, e.g., 10- 300, 20 to 250, 20 to 150 or even 20 to 70 micrometers.
  • lower density hollow microspheres may be selected to lower the thermal conductivity and improve the thermal barrier properties pf the foam composites.
  • the microspheres have an average true density of no greater than 1 gram per cubic centimeter. However, even lower densities are preferred, for example, no greater than 0.8, 0.6 or even no greater than 0.4 grams per cubic centimeter.
  • Exemplary hollow glass microspheres have an average true density of 0.1 to 0.8, 0.1 to 0.6, 0.1 to 0.5 or 0.2 to 0.5 grams per cubic centimeter. [0057] It is important to distinguish the average true density from the bulk density, as bulk density includes air between the microspheres and provides an artificially lower value.
  • the term "average true density" is the quotient obtained by dividing the mass of a sample of hollow particles by the true volume of that mass of hollow particles as measured by a gas pycnometer.
  • the "true volume” is the aggregate total volume of the hollow particles, not the bulk volume.
  • the average true density may be measured using a pycnometer according to ASTM D2840- 69, "Average True Particle Density of Hollow Microspheres”.
  • the pycnometer may be obtained, for example, under the trade designation "ACCUPYC 1330 PYCNOMETER” from Micromeritics, Norcross, Georgia.
  • Average true density can typically be measured with an accuracy of 0.001 g/cc.
  • the microsphere-containing silicone composites contain at least 10 vol.%, e.g., at least 15 vol.% of the hollow inorganic microspheres based on the total volume of the foam.
  • the microsphere-containing silicone composites comprises 10 to 50 vol.%, 15 to 45 wt.%, or even 25 to 35 vol.% of the hollow inorganic microspheres based on the total volume of the foam.
  • the hollow inorganic microspheres are at least partially embedded in the silicone foam matrix. That is, the microspheres are located in the silicone resin walls surrounding the gas- filled cavities as opposed to being located within the cavities themselves. Depending on the size of the microspheres and the thickness of the cavity walls, the microspheres may be partially or fully embedded in the silicone. For example, some of the microspheres will be minimally embedded, for example attached to the walls.
  • a larger portion of the microspheres may be surrounded by the silicone, up to and including the microspheres fully surrounded by the silicone.
  • at least 70 wt.% of the hollow inorganic microspheres are at least partially embedded in the silicone foam matrix.
  • at least 80 wt.%, at least 90 wt.% or even at least 95 wt.% of the hollow inorganic microspheres are at least partially embedded in the silicone foam matrix.
  • additional additives may be incorporated into the composite.
  • the hollow inorganic microsphere-containing silicone foam composites of the present disclosure may be used as a thermal barrier in industrial applications, including, e.g., the automotive industry.
  • the silicone foam composites can be used a thermal barrier (e.g., a thermal runaway barrier) in a rechargeable electrical energy storage system, e.g., a battery module.
  • the silicone composites disclosed herein can be used as a thermal barrier spacer (e.g., a thermal runaway barrier spacer) between the battery cells in a rechargeable electrical energy storage system.
  • the composites may be placed between adjacent cells in lithium ion battery.
  • FIG.1 An exemplary assembled battery module according to one aspect of the present disclosure is illustrated in FIG.1.
  • Battery module 15 comprises a plurality of adjacent battery cells 16 separated from each other by a gap.
  • Silicone foam composite 17 is positioned in the gap between adjacent battery cells 16.
  • battery module 15 may include base plate 19 upon which is positioned thermally conductive gap filler 18.
  • Exemplary battery modules, battery subunits and methods of manufacturing thereof for use herein are known and include those described in U.S. Pat.
  • One method of manufacturing such a battery module comprises the steps of: (a) providing a plurality of battery cells separated from each other by a gap; and (b) positioning a microsphere-containing silicone foam composite of the present disclosure in the gap between the battery cells.
  • the battery cells may be held in fixtures during assembly to maintain gaps between the cells to aid in positioning the microsphere-containing silicone foam composites. During later assembly, the gaps may be reduced under a compressive force to place at least parts of the microsphere-containing silicone foam composites into compressive strain.
  • FIG.3A Another exemplary assembled battery module according to one aspect of the present disclosure is illustrated in FIG.3A.
  • battery module 300 has cell walls 310 and a variety of battery cells (320(a), 320(b), and 320(c). Each battery cell has at least one corresponding vent port 330.
  • Thermally-insulating polymeric foam layer 340 is between the venting ports and the adjacent cell wall. The silicone foam can be immediately adjacent with the venting ports or can include an adhesive layer to enhance the adhesion between the foam and the battery.
  • Battery module 300 is illustrated in FIG.3B after cell 320(b) suffered an adverse event and hot gases 350 were released through the venting port 330 and through the seal provided by the polymeric foam layer 340 in that region, which has ruptured in the thickness direction, z, but which has maintained structural integrity in the x-y plane, thereby protecting neighboring cells 320(a) and 320(c).
  • the microsphere containing silicone foam composites may be shaped to the desired size prior to inserting them between the battery cells.
  • Table 1 Summary of materials used in the preparation of the examples. Name Description Trade Name and Source S IL-I-A Part A of a 2-part silicone foam kit BLUESIL 3242A and BLUESIL 3242B (foam Shore 00 hardness of 40) S IL-I-B Part B of a 2-part silicone foam kit from Elkem ASA, Norway.
  • SIL-I and SIL-II are two-part silicone foam kits.
  • Part A comprises Component A (at least one poly(organosiloxane) having a plurality of alkenyl groups, which are vinyl groups) as well as Components C (at least one hydroxyl containing compound) and D (an effective amount of curing catalyst).
  • Part B comprises Component B (at least one poly(organosiloxane) having a plurality of Si-H groups) and is also believed to contain at least one poly(organosiloxane) having a plurality of alkenyl groups (i.e., an additional portion of Component A).
  • CFD Test Method Compression Force Displacement (CFD) was measured as follows. Samples 50.8 mm in diameter were prepared. A single layer of samples was loaded between parallel platens in an Instron Model 5581 with a 5kN load cell. The test followed ASTM D3574 (2017) with a modified preload of 725 Pa.
  • Thermal conductivity results are generally reported as an average of the platen temperatures, so 60 °C in the case of an upper platen temperature of 75 °C and a lower platen temperature of 45 °C.
  • Compression Set Compressions et was determined according to ASTM D3547-17, Test D. The test specimens were compressed by 50% and held at 70 °C for twenty-two hours.
  • Hot-side Cold-Side Test (HSCS). A hot-side cold-side test was performed using a tensile/compression tester from Zwick in a compression mode. The compression tester was equipped with two plates: a cold (room temperature) bottom plate equipped with a thermocouple to record temperature and a hot upper plate heated to maintain a constant temperature of 600 °C.
  • Part A and Part B including fillers.
  • Various fillers were independently compounded into Parts A and B of the 2- part silicone foam kits using a DAC 600 SpeedMixer (Flacktek, Landrum, S.C.) at 2000 rpm for 1-2 minutes to provide a well-dispersed resin blend. The fillers were weighed into the speedmix cup and wetted by the silicone fluid prior to mixing.
  • Table 2 Compositions of samples of Part A and Part B with fillers.
  • Sample Silicone filler Wt. % Wt.% silicone filler A0 SIL-II-A -- 100 0 B0 SIL-II-B -- 100 0 A1 SIL-II-A HGM-1 85 15 B1 SIL-II-B HGM-1 85 15 A2 SIL-II-A HGM-3 77 23 B2 SIL-II-B HGM-3 77 23 A3 SIL-II-A HGM-4 80 20 B3 SIL-II-B HGM-4 80 20 A4 SIL-II-A HGM-5 81 19 B4 SIL-II-B HGM-5 81 19 A5 SIL-II-A HGM-1 80 20 B5 SIL-II-B HGM-1 80 20 A6 SIL-I-A -- 100 0 B6 SIL-I-B -- 100 0 A7 SIL-I-A HGM-1 85 15 B7 SIL-I-B HGM-1
  • Table 6 Samples prepared from SIL-II at an A:B weight ratio of 2:1 with various diameter (micron) hollow glass microspheres. S IL-II Hollow Glass Microspheres CFD (kPa) @ % strain Part Part Avg. Vol. Example A B Type Diam.
  • FIG.2A is a cross section of Example 3 (32 Vol.% HGM-1 (40 micron) in SIL-II.);
  • FIG.2B is a cross section of Example 15 (32 Vol.% HGM-3 (135 micron) in SIL-II.);
  • FIG.2C is a cross section of Example 16 (32 Vol.% HGM-4 (240 micron) in SIL-II.);
  • FIG.2D is a cross section of Example 17 (32 Vol.% HGM-5 (365 micron) in SIL-II.).
  • the foams comprise gas filled cavities surrounded by the cured silicone resin. [0085]
  • the hollow glass microspheres are primarily present in the silicone walls surrounding these cavities.
  • the location of the microspheres in the walls rather than in the cavities contributes to the surprising combination of properties provided by the claimed compositions.
  • the location of the microspheres in the walls is believed to contribute to the reduction in both the density and thermal conductivity, and the independence of compression force from bubble size, especially at high compressive strains.

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  • Chemical Kinetics & Catalysis (AREA)
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  • Organic Chemistry (AREA)
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  • Materials Engineering (AREA)
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Abstract

L'invention concerne une silicone expansée comprenant des microsphères inorganiques creuses et une pluralité de cavités remplies de gaz entourées par une résine de silicone durcie. La silicone expansée est le produit durci par addition d'au moins un premier poly(organosiloxane) comportant une pluralité de groupes alcényle et d'au moins un deuxième poly(organosiloxane) comportant une pluralité de groupes Si-H. L'invention concerne en outre des procédés de fabrication de tels composites de mousse de silicone contenant des microsphères.
PCT/IB2025/051486 2024-04-25 2025-02-12 Composites de mousse de silicone contenant des microsphères et leurs procédés de fabrication Pending WO2025224511A1 (fr)

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EP0188978A1 (fr) 1984-12-20 1986-07-30 Rhone-Poulenc Chimie Complexe platine-triene comme catalyseur de réaction d'hydrosilylation et son procédé de préparation
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US10501597B2 (en) 2017-02-08 2019-12-10 Elkem Silicones USA Corp. Secondary battery pack with improved thermal management
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* Cited by examiner, † Cited by third party
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US3159602A (en) 1962-06-07 1964-12-01 Olin Mathieson Preparation of polymeric phosphates
US3159601A (en) 1962-07-02 1964-12-01 Gen Electric Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes
US3220972A (en) 1962-07-02 1965-11-30 Gen Electric Organosilicon process using a chloroplatinic acid reaction product as the catalyst
US3188299A (en) 1963-02-28 1965-06-08 Gen Electric Preparation of stable mixtures of organosilicon compositions in the presence of a nitrogen-containing ligand
US3377432A (en) 1964-07-31 1968-04-09 Bell Telephone Labor Inc Telephone switching system
US3419593A (en) 1965-05-17 1968-12-31 Dow Corning Catalysts for the reaction of = sih with organic compounds containing aliphatic unsaturation
US3445420A (en) 1966-06-23 1969-05-20 Dow Corning Acetylenic inhibited platinum catalyzed organopolysiloxane composition
US3498945A (en) 1966-08-16 1970-03-03 Rhone Poulenc Sa Linear organopolysiloxanes their preparation and their use
US3814730A (en) 1970-08-06 1974-06-04 Gen Electric Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes
US3715334A (en) 1970-11-27 1973-02-06 Gen Electric Platinum-vinylsiloxanes
US3775452A (en) 1971-04-28 1973-11-27 Gen Electric Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes
US3923705A (en) 1974-10-30 1975-12-02 Dow Corning Method of preparing fire retardant siloxane foams and foams prepared therefrom
US3989667A (en) 1974-12-02 1976-11-02 Dow Corning Corporation Olefinic siloxanes as platinum inhibitors
US4256870A (en) 1979-05-17 1981-03-17 General Electric Company Solventless release compositions, methods and articles of manufacture
EP0057459A1 (fr) 1981-02-02 1982-08-11 SWS Silicones Corporation Complexes de platine-styrène comme catalyseurs pour des réactions de hydrosilation et procédé pour leur préparation
US4347346A (en) 1981-04-02 1982-08-31 General Electric Company Silicone release coatings and inhibitors
EP0188978A1 (fr) 1984-12-20 1986-07-30 Rhone-Poulenc Chimie Complexe platine-triene comme catalyseur de réaction d'hydrosilylation et son procédé de préparation
EP0190530A1 (fr) 1984-12-20 1986-08-13 Rhone-Poulenc Chimie Complexe platine-alcénylcyclohexène comme catalyseur de réaction d'hydrosilylation et son procédé de préparation
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US5162397A (en) 1991-04-02 1992-11-10 Dow Corning S.A. Silicone foams
EP0733672B1 (fr) * 1995-03-22 1997-09-03 ERNST SONDERHOFF GmbH & Co. KG Méthode pour préparer un mousse molle élastique silicone élastomérique, particulièrement pour joints d'étanchéité
US11171370B2 (en) 2017-01-19 2021-11-09 3M Innovative Properties Company Aziridino-functional polyether thermally-conductive gap filler
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WO2023216073A1 (fr) * 2022-05-09 2023-11-16 Dow Silicones Corporation Composition d'organopolysiloxane avec microsphères céramiques

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