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WO2025216329A1 - Cadre de montage de substrat, corps assemblé de cadre et vision del - Google Patents

Cadre de montage de substrat, corps assemblé de cadre et vision del

Info

Publication number
WO2025216329A1
WO2025216329A1 PCT/JP2025/014696 JP2025014696W WO2025216329A1 WO 2025216329 A1 WO2025216329 A1 WO 2025216329A1 JP 2025014696 W JP2025014696 W JP 2025014696W WO 2025216329 A1 WO2025216329 A1 WO 2025216329A1
Authority
WO
WIPO (PCT)
Prior art keywords
board mounting
frame
mounting frame
foam layer
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2025/014696
Other languages
English (en)
Japanese (ja)
Inventor
敦 遊佐
学 能勢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maxell Ltd filed Critical Maxell Ltd
Publication of WO2025216329A1 publication Critical patent/WO2025216329A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/40—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character is selected from a number of characters arranged one beside the other, e.g. on a common carrier plate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]

Definitions

  • This disclosure relates to a synthetic resin board mounting frame for mounting LED module boards for LED vision displays.
  • LED visions LED walls
  • LEDs light-emitting diodes
  • LED screens are formed by connecting multiple units vertically or horizontally.
  • each unit consists of an LED module board, which is a collection of LED elements, and a board mounting frame that serves as the base for the LED module board. They measure approximately 50 cm high and 50 cm wide or larger. Because the units do not have a surrounding frame, connecting multiple units together can create a large, seamless display. By adjusting the number of connected units, the size and aspect ratio of the display can be changed to suit the purpose. Furthermore, the ability to replace parts on a unit-by-unit basis also offers the advantage of easy maintenance. Furthermore, LED screens are highly bright, providing excellent visibility even during the day or from a distance, making them highly appealing to consumers. Waterproof LED screens are also available. For this reason, LED screens are widely used in storefronts, outdoor advertising on building rooftops, interior spaces in commercial facilities, and events.
  • Conventional board mounting frames are made of metals such as aluminum. As a result, the units themselves are heavy. This means that transporting, connecting, and dismantling connected units is not very efficient. In particular, LED vision screens used at event and concert venues need to be set up at each venue, so there is a need to improve the efficiency of transporting, connecting, and dismantling units. In order to improve the efficiency of transporting, connecting, and dismantling units, it is necessary to reduce the weight of the board mounting frame. However, simply making the board mounting frame thinner to reduce weight could result in the board mounting frame being unable to withstand the load when multiple units are connected, and there is a risk of the board mounting frame being damaged.
  • the objective of this disclosure is to provide a board mounting frame that is lightweight while maintaining a certain level of mechanical strength against the load when units are connected.
  • the board mounting frame of the present disclosure is a board mounting frame for mounting an LED module board for an LED vision.
  • the board mounting frame is made of synthetic resin. At least a portion of the board mounting frame includes a foam layer, a first non-foam layer laminated in front of the foam layer, and a second non-foam layer laminated behind the foam layer.
  • the board mounting frame disclosed herein can be made lighter while maintaining a certain level of mechanical strength.
  • FIG. 1 is a perspective view of the appearance of a board mounting frame according to a first embodiment.
  • FIG. 2 is a cross-sectional view of the thick portion shown in FIG.
  • FIG. 3 is a perspective view showing the appearance of the frame assembly according to this embodiment.
  • FIG. 4 is a perspective view of the appearance of a frame assembly in which a movement restricting portion is formed.
  • FIG. 5 is an enlarged perspective view of the frame assembly shown in FIG.
  • FIG. 6 is a perspective view showing a modified example of the board mounting frame.
  • FIG. 7 is an enlarged perspective view showing the connection state of the board mounting frame shown in FIG.
  • FIG. 8 is a diagram showing a schematic view of an LED vision screen constructed by mounting an LED module board on a board mounting frame.
  • FIG. 9 is a perspective view of the appearance of a board mounting frame according to the second embodiment.
  • FIG. 10 is a cross-sectional view taken along line XX in FIG.
  • the inventors In order to reduce the weight of the board mounting frame, the inventors first considered forming the board mounting frame from synthetic resin, and then increasing the thickness of the board mounting frame made of synthetic resin to obtain the required mechanical strength. However, simply increasing the thickness of the board mounting frame would result in warpage or sink marks (surface depressions) after resin molding, such as injection molding, significantly reducing the dimensional accuracy of the board mounting frame. For these reasons, board mounting frames made of synthetic resin have not previously been proposed.
  • foam molding at least a portion of the board mounting frame can reduce weight while increasing the thickness of the board mounting frame and improving mechanical strength.
  • the inventors also discovered that increasing the thickness of the board mounting frame through foam molding can suppress warpage, and that excellent dimensional accuracy can be achieved by pressing the surface of the non-foamed layer formed on the outer surface of the board mounting frame against the mold as the foam layer formed inside the board mounting frame foams, thereby suppressing the occurrence of sink marks.
  • the board mounting frame disclosed herein was completed by the inventors based on these findings.
  • a board mounting frame is a board mounting frame for mounting an LED module board for an LED vision.
  • the board mounting frame is made of synthetic resin. At least a portion of the board mounting frame includes a foam layer, a first non-foam layer laminated in front of the foam layer, and a second non-foam layer laminated behind the foam layer.
  • the board mounting frame may have a lower frame portion, a left frame portion, and a right frame portion, and may have a rectangular frame shape formed by these frame portions. At least four corners of the board mounting frame may include the foam layer, the first non-foam layer, and the second non-foam layer. This allows the weight of the board mounting frame to be reduced while improving the mechanical strength of the four corners that are subject to the greatest load when the LED module board is attached. This allows the weight of the board mounting frame to be reduced while more effectively ensuring the mechanical strength of the board mounting frame.
  • the board mounting frame may further include a vertical bar connecting the upper frame portion and the lower frame portion.
  • the vertical bar may include the foam layer, the first non-foam layer, and the second non-foam layer. This allows the board mounting frame to be made lighter while further improving the mechanical strength of the board mounting frame in the vertical direction.
  • the board mounting frame may further include a plate-shaped portion connected to at least two of the upper frame portion, the lower frame portion, the left frame portion, and the right frame portion.
  • the plate-shaped portion may include the foam layer, the first non-foam layer, and the second non-foam layer. This allows the plate-shaped portion to improve the rigidity of the board mounting frame. This allows the board mounting frame to be made lighter while further improving its mechanical strength.
  • the board mounting frame may include the foam layer, the first non-foam layer, and the second non-foam layer, and may have a thick portion having a thickness of 7 mm or more in the front-to-rear direction.
  • the foam layer may have a thickness in the thick portion that is 50% or more but less than 98% of the total thickness of the board mounting frame in the front-to-rear direction. This more effectively ensures the mechanical strength of the board mounting frame while reducing its weight. Furthermore, it more effectively suppresses the occurrence of warpage and sink marks.
  • the mounting surface of the LED module board located in front of the board mounting frame may have a flatness of 0.3 mm or less.
  • the flatness of the mounting surface of the LED module board can be reduced.
  • the synthetic resin may contain a filler, thereby more effectively ensuring the mechanical strength of the board mounting frame.
  • the synthetic resin may include polycarbonate.
  • Polycarbonate is available at low cost and has excellent moldability and strength, making it suitable for use as a resin material for the board mounting frame.
  • the board mounting frame may have a rectangular frame shape including an upper frame portion, a lower frame portion, a left frame portion, and a right frame portion.
  • the amount of deformation of the upper frame portion may be 0.4 mm or less.
  • a pair of adjacent board mounting frames may be connected so that their respective joint surfaces face each other.
  • One of the pair of board mounting frames may have a mating portion on the joint surface facing the other board mounting frame.
  • the other board mounting frame may have a mated portion into which the mating portion can be mated.
  • the pair of board mounting frames are connected by mating the mating portion with the mated portion. This makes it possible to easily connect one board mounting frame to the other board mounting frame by mating the mating portion with the mated portion.
  • the board mounting frames are made of synthetic resin, the mating portion and the mated portion can be easily formed by resin molding.
  • the mounting surface of one board mounting frame to which the LED module is attached and the mounting surface of the other board mounting frame to which the LED module is attached may be flush with each other when the one board mounting frame and the other board mounting frame are connected. This makes it possible to prevent misalignment between the LED module board attached to the mounting surface and other LED module boards attached to other board mounting frames when the LED module board is attached to the mounting surface, thereby ensuring visibility of the LED vision.
  • At least one of the joint surfaces of the one board mounting frame and the other board mounting frame may have a movement restraint portion for restraining movement of the one board mounting frame and the other board mounting frame relative to each other in the front-rear and left-right directions while they are connected. This makes it possible to restrain movement of the board mounting frames relative to each other in the front-rear and left-right directions, suppressing misalignment and gaps between the board mounting frames and ensuring visibility of the LED vision.
  • the engaging portion and the engaged portion may be configured so that one of the engaging portion and the engaged portion slides relative to one another in the front-to-rear direction and is engaged, and so that the one board mounting frame and the other board mounting frame are prevented from moving relative to each other in the up-down and left-right directions when they are connected. This prevents the connected board mounting frames from moving relative to each other in the up-down and left-right directions. This prevents misalignment and gaps between adjacent board mounting frames, ensuring the visibility of the LED vision.
  • the mating portion is a protrusion that protrudes from the mating surface of the other board mounting frame.
  • the mated portion is a recess that is recessed on the mating surface of the one board mounting frame so that the mating portion is mated with and fixed vertically relative to the mated portion. This allows the frame assembly of Configuration 13 to be configured.
  • a gap formed between the joint surface of one board mounting frame and the joint surface of the other board mounting frame may be 0.3 mm or less in a temperature range of ⁇ 30° C. to 60° C. This reduces the gap between the board mounting frames and ensures visibility of the LED vision in an environment where the LED vision is used or where the LED module board is generating heat.
  • the LED vision screen includes a board mounting frame according to any one of configurations 1 to 9 and an LED module board mounted on the board mounting frame. This allows the board mounting frame to be easily connected to other adjacent board mounting frames. This makes it easy to assemble the LED vision screen. Furthermore, because the board mounting frame that supports the LED module board is one that can be made lighter while maintaining mechanical strength, an LED vision screen that can be made lighter while maintaining mechanical strength can be realized.
  • the board mounting frame 1 is made of synthetic resin. As shown in FIG. 1 , the board mounting frame 1 has an outer frame 2 and an inner frame 3. As shown in FIGS. 1 and 2 , the board mounting frame 1 also has a thick portion 4, a foam layer 5, a non-foamed layer 6 (first non-foamed layer), a non-foamed layer 7 (second non-foamed layer), and a mounting surface 8. Note that FIG. 2 is a cross-sectional view showing a cross section of a portion of the thick portion 4 shown in FIG. 1 , cut in the front-to-rear direction so as to include the foam layer 5. The board mounting frame 1 also has a mating portion 9 and a mated portion 10 for connecting to another board mounting frame 1; these mating portion 9 and mated portion 10 will be described in detail in the description of the frame assembly 100, which will be described later.
  • the outer frame 2 has a rectangular frame shape including an upper frame portion 21, a lower frame portion 22, a left frame portion 23, and a right frame portion 24.
  • the outer frame 2 has mating portions 9 and mated portions 10 on its outer periphery for connecting to other board mounting frames 1.
  • the shape of the outer frame 2 is not limited to a rectangular frame shape, and is not particularly limited as long as it can be connected to other board mounting frames 1 with as few gaps as possible.
  • the dimension of one side of the rectangular outer frame 2, i.e., the length of each of the upper frame portion 21, lower frame portion 22, left frame portion 23, and right frame portion 24, is not particularly limited, but is preferably between 30 cm and 200 cm from the perspective of ease of transporting, connecting, and disassembling the board mounting frame 1.
  • the inner frame 3 is formed to connect opposing or adjacent sides of the outer frame 2.
  • the inner frame 3 is composed of a vertical bar 31 located in the left-right center of the outer frame 2 and connecting the upper frame portion 21 and the lower frame portion 22, and a horizontal bar 32 located in the up-down center of the outer frame 2 and connecting the left frame portion 23 and the right frame portion 24.
  • the inner frame 3 may have various shapes, such as a lattice pattern or a diagonal lattice pattern.
  • the inner frame 3 may have multiple vertical bars 31 and multiple horizontal bars 32.
  • the vertical bars 31 may be located in a position other than the left-right center of the outer frame 2.
  • the horizontal bars 32 may be located in a position other than the up-down center of the outer frame 2.
  • the inner frame 3 may not have vertical bars 31.
  • the inner frame 3 may not have horizontal bars 32.
  • the thick portion 4 may be included in the outer frame 2.
  • the thick portion 4 has a thickness T1 in the front-to-rear direction that is greater than the thickness T1 of the board mounting frame 1 other than the thick portion 4.
  • the thick portion 4 is formed in the corners (four corners) of the outer frame 2, the upper frame portion 21, the lower frame portion 22, the left frame portion 23, and the right frame portion 24 between the corners of the outer frame 2, and the inner frame 3.
  • the thick portion 4 is the portion of the outer frame 2 and the inner frame 3 that includes the area indicated by the dashed lines in FIG. 1 (the foam layer 5 described below).
  • the thick portion 4 may be selectively provided in a portion of at least one of the outer frame 2 and the inner frame 3, or may be distributed in multiple locations on at least one of the outer frame 2 and the inner frame 3, like the foam portion 20 and non-foam portion 30 described below.
  • the thick portion 4 may be provided only in the four corners of the outer frame 2.
  • the thick portion 4 may also be provided in a portion of the inner frame 3.
  • the thickened portions 4 may be provided only on the vertical bars 31 of the inner frame 3.
  • the thickened portions 4 may be provided only on the outer frame 2 and the inner frame 3 in areas that are subject to a greater load than other areas when the LED module board M (see Figure 3) is attached to the board mounting frame 1.
  • the four corners include the connection parts of the outer frame 2 between the upper frame part 21 and the left frame part 23, the connection parts between the upper frame part 21 and the right frame part 24, the connection parts between the lower frame part 22 and the left frame part 23, and the connection parts between the lower frame part 22 and the right frame part 24.
  • the four corners also include parts adjacent to these connection parts and parts that are subjected to a greater load than other parts of the outer frame 2 when the LED module board M is attached to the board mounting frame 1.
  • the thick portion 4 includes a foam layer 5, a non-foam layer 6, and a non-foam layer 7.
  • the foam layer 5 is foam-molded and is also referred to as a core layer. Numerous air bubbles are formed within the foam layer 5.
  • the non-foam layer 6 and the non-foam layer 7 are not foam-molded and are also referred to as skin layers.
  • the foam layer 5 is positioned between the non-foam layer 6, which is laminated in front of the foam layer 5, and the non-foam layer 7, which is laminated behind the foam layer 5, in the front-rear direction.
  • the foam layer 5 refers to a region in a longitudinal cross section of the board mounting frame 1 cut along the front-rear direction (plane B-F in FIG. 1 ), where the proportion of the area of air bubbles having a cell diameter of 5 ⁇ m or more per 1 cm2 is 5% or more.
  • the non-foam layer 6 and the non-foam layer 7 can be said to be regions where the area of the air bubbles is less than 5%.
  • the expansion ratio of the thick-walled portion 4 can be 1.1 times or more and less than 3.0 times. If the expansion ratio is too small, the thickness T1 of the thick-walled portion 4 will be small, making it difficult to achieve the specified mechanical strength and also the density of the thick-walled portion 4 will be high, making it difficult to achieve weight reduction. On the other hand, if the expansion ratio is too large, although the thickness T1 will be large, the density of the thick-walled portion 4 will decrease and the mechanical strength will tend to decrease. Therefore, from the perspective of achieving weight reduction while ensuring the specified mechanical strength of the outer frame 2, the lower limit of the expansion ratio of the thick-walled portion 4 should be 1.1 times or more, preferably 1.2 times or more, and more preferably 1.5 times or more.
  • the upper limit of the expansion ratio of the thick-walled portion 4 should be less than 3.0 times, preferably 2.8 times or less, and more preferably 2.5 times or less.
  • the expansion ratio of the thick-walled portion 4 should be 1.1 times or more and less than 3.0 times, preferably 1.2 times or more and 2.8 times or less, and more preferably 1.5 times or more and 2.5 times or less.
  • the thickness of the board mounting frame 1 in the front-to-rear direction can be increased to ensure mechanical strength, while weight can be reduced through foam molding. Furthermore, as mentioned above, increasing the thickness of the board mounting frame 1 through foam molding suppresses warpage deformation after resin molding, and foam molding also suppresses the occurrence of sink marks. This improves the dimensional accuracy of the board mounting frame 1.
  • the thick-walled portion 4 preferably has a thickness T1 of 7 mm or more in the front-to-rear direction.
  • the thick-walled portion 4 preferably has a thickness T1 of 100 mm or less in the front-to-rear direction. In other words, if the thickness T1 of the thick-walled portion 4 is too large, the weight of the board mounting frame 1 increases, reducing the benefits of forming the board mounting frame 1 from synthetic resin.
  • the thick-walled portion 4 is formed by conventional injection molding, sink marks are likely to occur, resulting in poor appearance. Furthermore, if the thickness T1 is increased by relatively increasing the foaming ratio of the thick-walled portion 4, the density of the thick-walled portion 4 decreases, making it difficult to ensure the predetermined mechanical strength of the board mounting frame 1. Therefore, from the perspective of suppressing the occurrence of warpage and sink marks while ensuring a predetermined mechanical strength, the lower limit of the thickness T1 of the thick portion 4 in the front-to-rear direction should be 7 mm or more, preferably 10 mm or more, and more preferably 30 mm or more.
  • the upper limit of the thickness T1 of the thick portion 4 in the front-to-rear direction should be 100 mm or less, preferably 80 mm or less, and more preferably 60 mm or less.
  • the thickness T1 of the thick portion 4 should be 7 mm to 100 mm, preferably 10 mm to 80 mm, and more preferably 30 mm to 60 mm.
  • the foam layer 5 can have a thickness T2 that is 50% or more and less than 98% of the total thickness of the board mounting frame 1 in the front-to-rear direction at the thick-walled portion 4, i.e., the thickness T1 of the thick-walled portion 4.
  • the thickness T2 of the foam layer 5 is 98% or more of the thickness T1 of the thick-walled portion 4, it becomes difficult to achieve the desired mechanical strength in the board mounting frame 1.
  • the thickness T2 of the foam layer 5 should be 50% or more, preferably 60% or more, more preferably 70% or more, less than 98%, preferably 95% or less, and more preferably 90% or less of the thickness T1 of the thick portion 4.
  • the thickness T2 of the foam layer 5 should be 50% or more but less than 98%, preferably 60% to 95%, and more preferably 70% to 90% of the thickness T1 of the thick portion 4.
  • the average cell diameter of the bubbles contained in the foam layer 5 can be 5 ⁇ m or more and less than 300 ⁇ m. If the average cell diameter of the bubbles is too small, it will be difficult to reduce the weight of the board mounting frame 1. If the average cell diameter of the bubbles is too large, it will be difficult to ensure the mechanical strength of the board mounting frame 1. From this perspective, the average cell diameter of the bubbles contained in the foam layer 5 should be less than 300 ⁇ m, preferably 200 ⁇ m or less, and more preferably 100 ⁇ m or less.
  • the board mounting frame 1 can have a foamed section 20 and a non-foamed section 30.
  • the foamed section 20 is a foam-molded portion of the board mounting frame 1.
  • the thick section 4 described above is a foam-molded portion, and therefore corresponds to the foamed section 20.
  • the foamed section 20 is a portion including the foamed layer 5 indicated by the dashed line and the non-foamed layers 6 and 7 laminated in the front-to-rear direction of the foamed layer 5.
  • the non-foamed section 30 is a portion that is not foam-molded.
  • the non-foamed section 30 is a portion of the board mounting frame 1 other than the foamed section 20.
  • the foamed section 20 is formed at the corners (four corners) of the outer frame 2, between the mating sections 9 or mated sections 10 on each side of the outer frame 2, and on the inner frame 3.
  • the board mounting frame 1 may include the foamed section 20 and the non-foamed section 30.
  • the entire board mounting frame 1 may also be formed from the foamed section 20.
  • the foam sections 20 may be formed on the outer frame 2 or the inner frame 3. The number and size of the foam sections 20 can be changed depending on the size of the board mounting frame 1.
  • the mounting surface 8 is the surface of the board mounting frame 1 for mounting the LED module board M (see Figure 3). As shown in Figure 1, the mounting surface 8 can be said to be the surface located in front of the board mounting frame 1. From the perspective of mounting the LED module board M, the mounting surface 8 should be as flat as possible, i.e., its flatness should be as small as possible. If the flatness of the mounting surface 8 is too great, misalignment will occur between the LED module boards M mounted on each board mounting frame 1 when the board mounting frames 1 are connected, which may reduce the visibility of the LED vision. Therefore, the flatness of the mounting surface 8 should be 0.3 mm or less, preferably 0.2 mm or less, and more preferably 0.1 mm or less. The flatness can be measured, for example, using a 3D scanner (Keyence Corporation, model number "V-700").
  • the resin material for the board mounting frame 1 is not particularly limited, but the following resins are preferred from the perspective of ensuring mechanical strength, durability, and low water absorption.
  • Thermoplastic resins are preferred for the board mounting frame 1 from the perspective of moldability into complex shapes.
  • non-crystalline resins are particularly preferred from the perspective of improving dimensional accuracy.
  • crystalline resins include PBT (polybutylene terephthalate), PPS (polyphenylene sulfide), HIPS (high impact PS), and liquid crystal polymer (LCP).
  • amorphous resins examples include PC (polycarbonate), m-PPE (modified polyphenylene ether), PPO (polyphenylene oxide), PPE (polyphenylene ether), PSU (polysulfone), PPSU (polyphenylsulfone), and PEI (polyetherimide).
  • PC polycarbonate
  • m-PPE modified polyphenylene ether
  • PPO polyphenylene oxide
  • PPE polyphenylene ether
  • PSU polysulfone
  • PPSU polyphenylsulfone
  • PEI polyetherimide
  • a copolymer of polycarbonate and silicone, or an alloy or copolymer of PBT and a specified resin may also be used as the resin material for the board mounting frame 1.
  • the resin material of the board mounting frame 1 may contain a filler to improve mechanical strength, suppress thermal expansion, and reduce water absorption.
  • fillers include carbon fiber, glass fiber, talc, and minerals.
  • glass fiber is preferred for cost reduction, and flat glass fiber may be used for the filler to suppress warpage and reduce the linear expansion coefficient.
  • the resin material of the board mounting frame 1 contains a fibrous filler such as carbon fiber, glass fiber, or flat glass fiber, the fibrous filler is oriented along the flow direction of the molten resin during molding of the board mounting frame 1. This makes it easier for anisotropy to develop in the strength and linear expansion coefficient of the board mounting frame 1 in the flow direction of the molten resin and in directions perpendicular to that flow direction. However, this anisotropy can be mitigated by including flat fillers in the resin material or by molding the board mounting frame 1 using core-back foaming, as described below.
  • the deformation amount of the upper frame portion 21 may be 0.4 mm or less.
  • foam molding the foam portion 20 (thick portion 4) as described above the deformation amount of the upper frame portion 21 can be reduced. This results in a board mounting frame 1 that has excellent dimensional accuracy and can be made lightweight while maintaining a predetermined mechanical strength.
  • the deformation amount of the upper frame portion 21 should be 0.4 mm or less, preferably 0.2 mm or less, and more preferably 0.1 mm or less.
  • the board mounting frame 1 can be formed, for example, by a core-back molding method, from the perspective of forming a foam layer 5 with a uniform thickness.
  • the core-back molding method is a method of foam-molding a resin material by injecting molten resin containing a foaming agent into the interior of a mold and then moving a portion of the mold outward to expand the volume within the mold. This allows the thick-walled portion 4 (foamed portion 20) to be formed.
  • the non-foamed portion 30 is molded without moving a portion of the mold. This allows the non-foamed portion 30 to be formed.
  • the foamed portion 20 can be formed in the portion where the portion of the mold is moved, and the non-foamed portion 30 can be formed in the portion where the mold is not moved.
  • the thick-walled portion 4 is foam-molded by moving a portion of the mold backward.
  • the foaming agent can be, for example, a physical foaming agent. Using a physical foaming agent makes it easier to foam high-strength or high-heat-resistant resin materials containing fillers, thereby reducing environmental impact.
  • Molding methods using the physical foaming agent may include high-pressure molding using a supercritical fluid (MuCell (registered trademark)) or low-pressure molding using a low-pressure gas without using a pressure booster.
  • the manufacturing method for the board mounting frame 1 is not limited to these, and any other method may be used as long as it can form the thick portion 4 (foam portion 20) including the foam layer 5 so as to reduce the weight of the board mounting frame 1 while maintaining a predetermined mechanical strength.
  • the frame assembly 100 is formed by connecting one board mounting frame 1 (lower in the figure) to the other board mounting frame 1 (upper in the figure).
  • One of the board mounting frames 1 has fitting portions 9 on its outer peripheral surface (in this embodiment, for example, the upper end surface of the upper frame portion 21 and the right end surface of the right frame portion 24 (see Figure 1)).
  • the fitting portions 9 are convex portions that protrude upward from the upper end surface of the upper frame portion 21 and to the right from the right end surface of the right frame portion 24, and multiple fitting portions 9 are provided on each of the upper end surface of the upper frame portion 21 and the right end surface of the right frame portion 24.
  • the convex portion of the fitting portion 9 has a cylindrical base end portion 91 extending from the outer peripheral surface and a truncated cone-shaped tip end portion 92 extending from the base end portion 91.
  • the convex portion has a tapered shape from the upper end of the base end portion 91 to the tip of the tip end portion 92.
  • the other board mounting frame 1 has mating portions 10 on its outer peripheral surface (the lower end surface of the lower frame portion 22 and the left end surface of the left frame portion 23) into which the mating portions 9 can be mated.
  • the mating portions 10 are recesses into which the protrusions of the mating portions 9 can be fitted, and multiple mating portions 10 are provided on the lower end surface of the lower frame portion 22 and the left end surface of the left frame portion 23 to correspond to the mating portions 9.
  • One board mounting frame 1 and the other board mounting frame 1 can be easily connected by fitting the mating portion 9 into the mated portion 10. Furthermore, because the tip 92 of the convex portion of the mating portion 9 has a tapered shape, it is easier to position the mating portion 9 relative to the mated portion 10 when starting to fit it into the mated portion 10, improving the efficiency of connecting board mounting frames 1 together.
  • the size or shape of the mating portion 9 and the mated portion 10 corresponding to the mating portion 9 are not particularly limited, and may be cylindrical, polygonal prism, conical, or the like.
  • Figures 3 and 4 show a configuration in which the mating portion 9 is formed on the upper end surface of the upper frame portion 21 of one board mounting frame 1, and the mated portion 10 is formed on the lower end surface of the lower frame portion of the other board mounting frame 1.
  • the mated portion 10 may be formed on the upper end surface of the upper frame portion 21 of one board mounting frame 1
  • the mating portion 9 may be formed on the lower end surface of the lower frame portion 22 of the other board mounting frame 1.
  • each of the first and second board mounting frames 1 has a mating portion 9 on the upper end surface of the upper frame portion 21 and the right end surface of the right frame portion 24, and a mated portion 10 on the lower end surface of the lower frame portion 22 and the left end surface of the left frame portion 23. This allows multiple board mounting frames 1 to be connected in at least one of the vertical and horizontal directions.
  • the mounting surface 8 of the LED module board M on one board mounting frame 1 and the mounting surface 8 of the LED module board M on the other board mounting frame 1 can be made flush with each other when the one board mounting frame 1 and the other board mounting frame 1 are connected. This prevents misalignment between the LED module boards M mounted on each board mounting frame 1 when the board mounting frames 1 are connected to each other. This ensures the visibility of the LED vision.
  • connecting the board mounting frames 1 in the left-right direction is basically the same as connecting them in the up-down direction, so a detailed explanation will be omitted.
  • the frame assembly 100 may have a movement restriction portion 101, as shown in Figures 4 and 5.
  • the movement restriction portion 101 has a convex restriction portion 101a and a concave restriction portion 101b.
  • the convex stopping portion 101a is formed on the upper end surface of the upper frame portion 21 of one board mounting frame 1, i.e., on the joint surface that connects to the other board mounting frame 1.
  • the convex stopping portion 101a is formed by arranging small, quadrangular pyramidal protrusions, smaller than the above-mentioned mating portion 9, in a continuous, planar manner in the front-to-back and left-to-right directions.
  • the height by which the convex stopping portion 101a protrudes from the upper end surface of the upper frame portion 21 of one board mounting frame 1 is not particularly limited, but can be, for example, 0.5 mm to 5 mm.
  • each small protrusion in the convex stopping portion 101a is not limited to a quadrangular pyramid, and may be a polygonal pyramid shape other than a quadrangular pyramid, a cone shape, a hemisphere, or the like.
  • the recessed stopping portion 101b is formed on the lower end surface of the lower frame portion 22 of the other board mounting frame 1, i.e., on the joint surface that connects to one of the board mounting frames 1.
  • the recessed stopping portion 101b is formed by arranging small recesses that are smaller than the above-mentioned mating portion 10 in a continuous line in the front-to-back and left-to-right directions in a planar manner so that they correspond to the small protrusions of the protruding stopping portion 101a.
  • the convex restraining portion 101a and the concave restraining portion 101b fit together, thereby preventing relative movement in the front-to-back and left-to-right directions between the one board mounting frame 1 and the other board mounting frame 1. Therefore, by providing the movement restraining portion 101, relative movement in the front-to-back and left-to-right directions between the one board mounting frame 1 and the other board mounting frame 1 can be further prevented.
  • the movement preventing portions 101 may be provided at multiple locations on the joining surface of one board mounting frame 1 and the joining surface of the other board mounting frame 1. For example, as shown in Figures 4 and 5, the movement preventing portions 101 are provided at multiple locations on the joining surface of one board mounting frame 1 and the joining surface of the other board mounting frame 1 so as to avoid the mating portions 9 and mated portions 10 that come into contact with each other.
  • the movement restraint portion 101 is not limited to this configuration, and may be formed, for example, by applying a fine embossing process to either the joining surface of one board mounting frame 1 or the joining surface of the other board mounting frame 1, as long as it does not affect the flatness of the joining surfaces of the one board mounting frame 1 and the other board mounting frame 1. Furthermore, a concave restraint portion 101b may be provided on one board mounting frame 1, and a convex restraint portion 101a may be provided on the other board mounting frame 1. Furthermore, the movement restraint portion 101 may be provided on the left end face or the right end face of the board mounting frame 1.
  • the mating portion 190 and the mated portion 110 may be configured to prevent relative movement of the board mounting frames 1 in the vertical direction by sliding one of the mating portion 190 and the mated portion 110 in the forward/backward direction relative to the other and fitting them together to connect one board mounting frame 1 to the other board mounting frame 1.
  • the mating portion 190 is a convex portion having a wedge shape. That is, the convex portion of the mating portion 190 has an inverted trapezoidal shape when viewed from the front or rear, and its width gradually increases toward the top.
  • the mating portion 190 is provided so as to protrude from the upper end surface of the other board mounting frame 1.
  • the mating portion 110 is a recess into which the mating portion 190 can be slid from the front or rear and fitted.
  • the recess of the mating portion 110 has an inverted trapezoidal shape when viewed from the front or rear, and its width gradually increases from side to side as it goes upward.
  • the mating portion 110 is recessed into the lower end surface of one of the board mounting frames 1.
  • the mating portion 110 is recessed on the joint surface of the other board mounting frame 1 so that the mating portion 190 fits into it and is fixed vertically relative to the mating portion 110.
  • the mating portion 190 is fitted into the mating portion 110 by sliding the other board mounting frame 1 from rear to front relative to the one board mounting frame 1.
  • the mating portion 190 has a tapered shape that tapers toward the rear. This makes it easier to position one board mounting frame 1 relative to the other board mounting frame 1 when starting to fit the mating portion 190 into the mated portion 110, improving the efficiency of the work of connecting one board mounting frame 1 to the other board mounting frame 1.
  • the mating portion 190 also has a stopper 93 extending in the left-right direction on its front side. This prevents the other board mounting frame 1 from moving forward relative to the first board mounting frame 1. In this way, a guide may be provided to make it easier to fit the mating portion 190 and the mated portion 110.
  • a removable fastener may be attached to secure the rear side of the first board mounting frame 1 to the rear side of the other board mounting frame 1. This also prevents the rearward relative movement of one board mounting frame 1 and the other board mounting frame 1.
  • the shapes of the mating portion and mated portion are not limited to the above configuration, and other shapes are acceptable as long as they prevent relative vertical movement between the first board mounting frame 1 and the second board mounting frame 1.
  • the frame portions of the first board mounting frame 1 and the second board mounting frame 1 that are connected may each have through holes as mated portions, and pins as mating portions may be inserted through these through holes to connect the first board mounting frame 1 and the second board mounting frame 1.
  • the pin may be, for example, a bolt.
  • the retaining member may be a nut.
  • the retainer may have any configuration as long as it is capable of preventing the pin from coming out.
  • the mating portion and mated portion may be formed on the left frame portion 23 and the right frame portion 24.
  • the shapes of the mating portions 9, 190, mated portions 10, 110, and movement restricting portion 101 described above can be easily formed because the board mounting frame 1 is made of resin.
  • the movement restricting portion 101 which has a fine shape, can be easily molded from resin.
  • the gap formed between the upper end surface of the upper frame portion 21 of one board mounting frame 1, i.e., the joint surface with the other board mounting frame 1, and the lower end surface of the lower frame portion 22 of the other board mounting frame 1, i.e., the joint surface with the one board mounting frame 1, be as small as possible.
  • This gap should be 0.3 mm or less, and preferably 0.2 mm or less.
  • reducing the gap between the connected board mounting frames 1 can reduce the gap between the LED module boards M. This ensures the visibility of the LED vision.
  • FIG. 8 is a diagram schematically illustrating how the LED vision 1000 is constructed by attaching the LED module board M to the board mounting frame 1.
  • the LED vision 1000 has a board mounting frame 1 and an LED module board M.
  • the board mounting frame 1 may be connected to other board mounting frames 1 to form the frame assembly 100 described above.
  • the LED vision 1000 has the frame assembly 100 and multiple LED module boards M.
  • a board mounting frame 1 having the configuration of this embodiment a pair of adjacent board mounting frames 1 can be easily connected. This makes it easy to assemble the LED vision 1000.
  • the board mounting frame 1 that can be made lightweight while maintaining mechanical strength is used as the board mounting frame that supports the LED module boards M, an LED vision 1000 that can be made lightweight while maintaining mechanical strength can be realized.
  • Figure 9 is a perspective view showing a schematic configuration of a board mounting frame 201 according to embodiment 2.
  • Figure 10 is a cross-sectional view taken along line X-X in Figure 9.
  • board mounting frame 201 differs from board mounting frame 1 of embodiment 1 in that it has a plate-shaped portion 233.
  • components similar to those of embodiment 1 are given the same reference numerals and their description will be omitted, and only components different from embodiment 1 will be described.
  • the board mounting frame 201 has an outer frame 202 and an inner frame 203.
  • the board mounting frame 201 also has a foam layer 205, a non-foam layer 206 (first non-foam layer), a non-foam layer 207 (second non-foam layer), and a mounting surface 208.
  • the board mounting frame 201 may have a thick portion, similar to the board mounting frame 1 of embodiment 1. In this case, the foam layer 205, the non-foam layer 206, and the non-foam layer 207 may be provided only on the thick portion.
  • the outer frame 202 has a rectangular frame shape including an upper frame portion 221, a lower frame portion 222, a left frame portion 223, and a right frame portion 224. Although not specifically shown, the outer frame 202 has mating portions and mated portions on its outer periphery for connecting to other board mounting frames 201.
  • the shape of the outer frame 202 is not limited to a rectangular frame shape, and is not particularly limited as long as it can be connected to other board mounting frames 201 with as few gaps as possible.
  • the dimension of one side of the rectangular outer frame 202 i.e., the length of each of the upper frame portion 221, lower frame portion 222, left frame portion 223, and right frame portion 224, is not particularly limited.
  • the inner frame 203 is formed to connect opposing or adjacent sides of the outer frame 202.
  • the inner frame 203 has a vertical beam 231 located in the left-right center of the outer frame 202 and connecting the upper frame portion 221 and the lower frame portion 222, a horizontal beam 232 located in the up-down center of the outer frame 202 and connecting the left frame portion 223 and the right frame portion 224, and a plate-shaped portion 233 connected to the outer frame 202, the vertical beam 231, and the horizontal beam 232.
  • the plate-shaped portion 233 is located rearward relative to the space surrounded by the outer frame 202 and the vertical and horizontal bars 231 and 232.
  • the plate-shaped portion 233 may be located at any position in the front-to-rear direction relative to the outer frame 202, vertical and horizontal bars 231 and 232, as long as it is connected to the outer frame 202, vertical and horizontal bars 231 and 232.
  • the plate-shaped portion 233 may be integrated with the outer frame 202, vertical and horizontal bars 231 and 232, or may be a separate member from the outer frame 202, vertical and horizontal bars 231 and 232.
  • the plate-shaped portion 233 may be connected to at least two of the upper frame portion 221, lower frame portion 222, left frame portion 223 and right frame portion 224 of the outer frame 202.
  • the rigidity of the inner frame 203 can be improved.
  • the mechanical strength of the board mounting frame 201 can be improved.
  • the inner frame 203 may have various shapes, such as a lattice pattern or a diagonal lattice pattern.
  • the inner frame 203 may have multiple vertical bars 231 and multiple horizontal bars 232.
  • the vertical bars 231 may be located at a position other than the center in the left-right direction of the outer frame 202.
  • the horizontal bars 232 may be located at a position other than the center in the up-down direction of the outer frame 202.
  • Foam layer 205 is positioned between non-foam layer 206, which is laminated in front of foam layer 205, and non-foam layer 207, which is laminated behind foam layer 205, in the front-to-rear direction.
  • the configurations of foam layer 205, non-foam layer 206, and non-foam layer 207 are the same as those of foam layer 5, non-foam layer 6, and non-foam layer 7 in embodiment 1, and therefore detailed description will be omitted.
  • Figure 9 shows an example of the configuration of the board mounting frame 201, in which the foam layer 205 is provided over the entire outer frame 202 and inner frame 203.
  • the foam layer 205 may also be provided on only a portion of the board mounting frame 201.
  • the foam layer 205 may also be provided only on portions of the outer frame 202 that are subject to a relatively large load when the LED module board is attached to the board mounting frame 201.
  • the foam layer 205 may be provided, for example, on the corners (four corners) of the rectangular outer frame 202, or on the vertical bars 231 of the inner frame 203.
  • the foam layer 205 is preferably provided to avoid the mating portion or the mated portion.
  • Mounting surface 208 is the surface of board mounting frame 201 for mounting the LED module board. Mounting surface 208 can also be said to be the surface located in front of board mounting frame 201. The configuration of mounting surface 208 is similar to that of mounting surface 8 in embodiment 1, so a detailed description will be omitted.
  • the board mounting frame 201 of this embodiment which has the plate-shaped portion 233, has higher mechanical strength than the board mounting frame 1 of embodiment 1. Therefore, the board mounting frame 201 can more reliably support the LED module board for a long period of time.
  • the manufacturing method for the board mounting frame 201 is the same as the manufacturing method for the board mounting frame 1 in embodiment 1. Therefore, a detailed description of the manufacturing method for the board mounting frame 201 will be omitted.
  • a frame assembly is formed, similar to the board mounting frame 1 of embodiment 1.
  • the frame assembly formed by connecting board mounting frames 201 together is the same as embodiment 1 except that board mounting frame 201 is used instead of board mounting frame 1. Therefore, a detailed description of the frame assembly will be omitted.
  • the frame assembly formed by connecting board mounting frames 201 together may also have a movement prevention portion 101, similar to the frame assembly 100 of embodiment 1.
  • the board mounting frame 1, 201, frame assembly 100, and LED vision 1000 include a foam layer that is foam-molded. This allows for a reduction in the amount of resin used in the board mounting frame 1, 201, frame assembly 100, and LED vision 1000. As a result, the board mounting frame 1, 201, frame assembly 100, and LED vision 1000 can contribute to improving resource utilization efficiency, reducing transportation burdens, and reducing energy consumption and CO2 emissions.
  • Providing the board mounting frame 1, 201, frame assembly 100, and LED vision 1000 to society can contribute to achieving Goal 7 (Affordable and Clean Energy), Goal 9 (Industry, Innovation, and Infrastructure), and Goal 11 (Sustainable Cities and communities) of the 17 Sustainable Development Goals (SDGs) established by the United Nations. Furthermore, because the board mounting frame 1 and frame assembly 100 according to this embodiment can be melted and reused, they can contribute to the achievement of Goal 12 (Responsible Consumption and Production).
  • Example Based on the conditions shown in Table 1, specimens of Examples 1 to 5 and Comparative Examples 1 and 2 as shown in FIG. 1 were prepared, and tests were conducted to measure the flatness of the mounting surface, the amount of deformation of the upper frame when a load was applied, and the amount of gap when the board mounting frames were connected together.
  • Example 1 The specimen for Example 1 was the board mounting frame shown in Figure 1.
  • the outer frame had a square shape when viewed from the front, with one side of the frame 500 mm long.
  • the maximum thickness of the thick wall in the front-to-rear direction was 40 mm.
  • the specimen for Example 1 was molded by a core-back molding method using the low-pressure gas physical foam molding method described in Patent Document 6,136,038.
  • the resin material for the specimen for Example 1 was a 40% glass fiber reinforced polycarbonate (LUPOY GN2403FT, manufactured by LG Chemical Corporation).
  • Example 1 The process for preparing the specimen of Example 1 will now be described in detail.
  • the resin material in the cylinder was plasticized and melted using a screw with screw flights suitable for promoting a starvation state.
  • nitrogen gas extracted from a nitrogen cylinder and reduced to 8 MPa using a pressure reducing valve, was injected into the starvation zone.
  • the nitrogen-infused molten resin was then injected into a mold, where core-back foaming was performed.
  • Core-back foaming is a foam molding method in which a resin material is injected into a pre-narrowed mold space, pressure is applied to temporarily eliminate air bubbles, and then part of the mold is moved outward to expand the space within the mold, thereby expanding the expanded volume.
  • Core-back foaming is suitable for uniformly molding a foam layer with a relatively high expansion ratio inside a resin molded body.
  • part of the movable mold was locked to the fixed mold with a magnet at part of the outer frame, i.e., the part forming the mating and mated portions.
  • only the movable core plate which was in close contact with the movable mold and guided by a solid lubricant, was opened in response to the mold opening. In this way, a specimen of Example 1 having a foamed portion and a non-foamed portion was produced.
  • the outer peripheral surface of the board mounting frame i.e., the bonding surface with respect to other board mounting frames, is perpendicular to the mounting surface of the LED module board, it is not possible to form the draft angle required when releasing the board mounting frame backward (towards the core back) after molding. For this reason, the board mounting frame was released from the mold by sliding its outer peripheral surface against the inner surface of the mold.
  • the thickness of the thick portion was increased to 40 mm by core-back foaming from 25 mm to 15 mm.
  • the foaming ratio of the thick portion was 1.6 times (a 37% reduction in density).
  • the thickness of the foam layer in the front-to-rear direction was approximately 34-36 mm, and the thicknesses of the first non-foamed layer and second non-foamed layer were each 2-3 mm. In other words, the thickness of the foam layer was 80-90% of the total thickness of the thick portion.
  • the flatness of the mounting surface was 0.15 mm.
  • a jig was placed in the center of the upper frame of the specimen, and when a load of 30 kg in total weight was applied, the deformation of the center of the upper frame was 0.1 mm, as measured with a dial gauge.
  • Example 1 Furthermore, two specimens from Example 1 were connected together, restrained at their upper ends, and left in thermostatic chambers at 60°C and -30°C for one hour, then removed. The gap formed between the two specimens was measured under a microscope and found to be 0.2 mm. The mass of the specimen from Example 1 was 25% less than that of an equivalent aluminum frame.
  • Example 2 The specimen of Example 2 was produced using the same mold as in Example 1, with a thick portion having a thickness of 7.5 mm, achieved by core-back foaming from 3.5 mm to 4 mm.
  • the thickness of the specimen of Example 2 was smaller than that of Example 1.
  • the thickness of the non-foamed layer in the specimen of Example 2 was relatively large, and the thickness of the foamed layer was 60 to 68% of the total thickness of the thick portion.
  • the flatness, deformation, and gap of the specimen of Example 2 were slightly worse than those of the specimen of Example 1.
  • Example 3 The basic conditions for the specimens of Example 3 were the same as those of Example 1, but the specimens were fixed together with bolts without providing a mating portion and a mated portion. When the specimens of Example 3 and Example 1 were compared, there was no change in the flatness or deformation amount between the two, but the specimen of Example 3 had a slightly worse gap compared to the specimen of Example 1. In this way, it was found that the gap amount was reduced by mating and connecting the mating portion and mated portion as in Example 1.
  • Example 4 The basic conditions for the specimen of Example 4 were the same as those for Example 1, but unlike Example 1, a movement restriction portion as shown in Figure 5 above was formed. Note that in the specimen of Example 4, a plurality of small convex portions with a height of 2 mm and small concave portions with a depth of 2 mm were arranged to form the movement restriction portion. As a result, the specimen of Example 4 was able to have a smaller gap than Example 1.
  • Example 5 The specimen of Example 5 was basically the same as that of Example 1, but the mating portion and mated portion were formed to have a wedge shape as shown in Figures 6 and 7. The specimen of Example 5 was able to achieve a significantly smaller gap than the other examples.
  • Example 6 In the specimen of Example 6, similar to Example 1, the thickness of the thick portion was adjusted to 40 mm by core-back foaming from 25 mm to 15 mm. However, in the specimen of Example 6, the expansion ratio of the thick portion was 1.3 times, i.e., the ratio of the foam layer thickness to the total thickness of the thick portion was 35 to 45%. The flatness of the mounting surface was 0.40 mm, the deformation under load was 0.12 mm, and the gap was 0.4 mm. In the specimen of Example 6, the thickness ratio of the foam layer 5 was less than 50%. Therefore, although the flatness and gap of the specimen of Example 6 were slightly inferior to those of Example 1, the deformation under load of the specimen of Example 6 was approximately equivalent to those of Examples 1 to 5.
  • Example 7 The specimen of Example 7 was fabricated using the same mold as in Example 1, with a core-back foaming process from 3 mm to 3 mm, resulting in a thicker portion with a thickness of 6.0 mm. Compared to Comparative Example 1 (described later), the specimen of Example 7 is lighter due to the foamed layer. Furthermore, despite its smaller thickness compared to Comparative Example 1 (described later), the specimen of Example 7 was able to reduce the gap, albeit with a slightly lower deformation under load. Therefore, it can be said that the specimen of Example 7 was able to achieve a reduced weight while maintaining a predetermined mechanical strength.
  • Example 7 Compared to Example 2 (where the thicker portion was 7.5 mm thick), the specimen of Example 7 was slightly inferior in terms of flatness, deformation under load, and gap. Therefore, it was found that in order to more effectively ensure the mechanical strength of the board mounting frame while reducing flatness and ensuring visibility of the LED vision screen, it is best to set the thickness of the thicker portion to 7 mm or more, preferably 40 mm or more.
  • Comparative Example 1 The specimen of Comparative Example 1 was formed by normal injection molding without core-back foaming, and the thickness of the thick portion was 40 mm, the same as in Example 1.
  • the specimen of Comparative Example 2 suffered from warpage deformation after molding, and also had large sink marks. As a result, the flatness significantly increased, and the visibility of the LED vision screen deteriorated.
  • 1,201 Board mounting frame 2,202 Outer frame, 21,221 Upper frame portion, 22,222 Lower frame portion, 23,223 Left frame portion, 24,224 Right frame portion, 3,203 Inner frame, 31,231 Vertical crosspiece, 32,232 Horizontal crosspiece, 233 Plate-shaped portion, 4 Thick portion, 5,205 Foam layer, 6,206 Non-foam layer, 7,207 Non-foam layer, 8,208 mounting surface, 9,190 mating portion, 91 base end, 92 tip end, 93 stopper, 10,110 mated portion, 100 frame assembly, 101 movement control portion, 101a convex control portion, 101b concave control portion, 1000 LED vision, M LED module board, T1 thickness of thick portion, T2 thickness of foam layer

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

La présente invention concerne un cadre de montage de substrat qui peut permettre une réduction du poids tout en assurant une résistance mécanique. Un cadre de montage de substrat 1 est constitué d'une résine synthétique, comprend une couche de mousse 5 qui est disposée dans une partie, une couche non de mousse 6 qui est stratifiée sur le côté avant de la couche de mousse 5, et une couche non de mousse 7 qui est stratifiée sur le côté arrière de la couche de mousse 5, et a une partie épaisse 4 dont l'épaisseur n'est pas inférieure à 7 mm dans la direction avant-arrière. Dans la partie épaisse 4, la couche de mousse 5 a une épaisseur T2 supérieure ou égale à 50% mais inférieure à 98% de l'épaisseur T1 (épaisseur totale) du cadre de montage de substrat 1 (partie épaisse 4) dans la direction avant-arrière. En raison du fait que l'épaisseur T1 de la partie épaisse 4 est ainsi relativement épaisse et que l'épaisseur de la couche de mousse 5 est relativement augmentée, une réduction du poids est obtenue tout en assurant la résistance mécanique.
PCT/JP2025/014696 2024-04-12 2025-04-14 Cadre de montage de substrat, corps assemblé de cadre et vision del Pending WO2025216329A1 (fr)

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