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WO2025209912A1 - Dispositif de détection physiologique intraluminale avec traces d'encre résistive à adaptation d'impédance - Google Patents

Dispositif de détection physiologique intraluminale avec traces d'encre résistive à adaptation d'impédance

Info

Publication number
WO2025209912A1
WO2025209912A1 PCT/EP2025/058375 EP2025058375W WO2025209912A1 WO 2025209912 A1 WO2025209912 A1 WO 2025209912A1 EP 2025058375 W EP2025058375 W EP 2025058375W WO 2025209912 A1 WO2025209912 A1 WO 2025209912A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive ink
intravascular
electrical
sensor
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/EP2025/058375
Other languages
English (en)
Inventor
Blake CORNELL
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV filed Critical Koninklijke Philips NV
Publication of WO2025209912A1 publication Critical patent/WO2025209912A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61M—DEVICES FOR INTRODUCING MEDIA INTO, OR ONTO, THE BODY; DEVICES FOR TRANSDUCING BODY MEDIA OR FOR TAKING MEDIA FROM THE BODY; DEVICES FOR PRODUCING OR ENDING SLEEP OR STUPOR
    • A61M25/00—Catheters; Hollow probes
    • A61M25/01—Introducing, guiding, advancing, emplacing or holding catheters
    • A61M25/09—Guide wires
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
    • A61B5/021—Measuring pressure in heart or blood vessels
    • A61B5/02141—Details of apparatus construction, e.g. pump units or housings therefor, cuff pressurising systems, arrangements of fluid conduits or circuits
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
    • A61B5/021—Measuring pressure in heart or blood vessels
    • A61B5/0215—Measuring pressure in heart or blood vessels by means inserted into the body
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/02—Detecting, measuring or recording for evaluating the cardiovascular system, e.g. pulse, heart rate, blood pressure or blood flow
    • A61B5/026—Measuring blood flow
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6846—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive
    • A61B5/6847—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be brought in contact with an internal body part, i.e. invasive mounted on an invasive device
    • A61B5/6851—Guide wires

Definitions

  • intravascular catheter or guidewires can with impedance-matching resistive inks in an electrical signal pathway for intravascular data signals (e.g., pressure, blood flow, temperature).
  • intravascular data signals e.g., pressure, blood flow, temperature
  • Intraluminal physiology sensing devices may be introduced into a body lumen of a patient, and may for example include physiological sensors at a distal end of a catheter or guidewire.
  • Small-diameter medical devices such as intraluminal (e.g., intravascular) catheters and guidewires may incorporate sensors (e.g., pressure, temperature, flow, or imaging sensors) whose power and communications occur through metal wires or filars, flat metal ribbons, or conductive ink traces.
  • intraluminal physiology sensing devices e.g., intravascular catheter or guidewire with, e.g., pressure sensor, flow sensor, temperature sensor
  • intraluminal physiology sensing devices e.g., intravascular catheter or guidewire with, e.g., pressure sensor, flow sensor, temperature sensor
  • printed ink conductor and resistor assemblies e.g., printed ink conductor and resistor assemblies.
  • a conductive metal ink can be used (e g., printed, deposited, applied as a liquid coating and then sintered into solid metallic traces).
  • some components of the intraluminal device e.g., a sensor
  • the conductive wires or filars, flattened ribbon wires, etc. have low impedances.
  • the resulting electrical impedance mismatch can reduce the electrical efficiency for electrical signal transmission (control signals, data signals, etc.) and acoustic performance of the intraluminal device.
  • printed resistive ink e.g., conductive ink with a higher impedance than pure metallic inks
  • electrical impedance can be gradually transitioned between the components and thus increase electrical efficiency. This can result in higher acoustic performance, allowing either a reduction in required input power from the patient interface monitor or patient interface module (PIM), or enabling new device design decisions that benefit from the improved acoustic performance.
  • the printed ink conductor-resistor assembly disclosed herein has particular, but not exclusive, utility for intraluminal medical catheters and guidewires.
  • Figure l is a diagrammatic side view of an intravascular sensing system that includes an intravascular device comprising conductive members and conductive ribbons, in accordance with at least one embodiment of the present disclosure.
  • Figure l is a diagrammatic side view of another type of intravascular device, in accordance with at least one embodiment of the present disclosure.
  • Figure 3 is a diagrammatic cross-sectional view of an example sensor assembly 251, which may for example be included in the intravascular device 102 of Figure 1 or Figure 2, in accordance with at least one embodiment of the present disclosure.
  • Figure 4 is a schematic view of an intravascular device during measurement of a flow velocity inside a blood vessel with blood vessel walls, in accordance with at least one embodiment of the present disclosure.
  • Figure 5A is a graph showing an electrical impedance mismatch, in accordance with at least one embodiment of the present disclosure.
  • Figure 8B is a is a lateral cross-sectional representation of a coated conductive ink trace taken at cut line 8B-8B of Figure 8A, in accordance with at least one embodiment of the present disclosure.
  • Figure 9 is a longitudinal cross-sectional representation of a distal portion of an example intravascular device incorporating coated ink traces of varying electrical impedance, in accordance with at least one embodiment of the present disclosure.
  • Figure 10A is a is a longitudinal cross-sectional representation taken at section line 10A-10A of Figure 9, in accordance with at least one embodiment of the present disclosure.
  • Figure 10B is a is a longitudinal cross-sectional representation taken at section line 10B-10B of Figure 9, just distal of Figure 10A, in accordance with at least one embodiment of the present disclosure.
  • Figure 10C is a is a longitudinal cross-sectional representation taken at section line 10C-10C of Figure 9, just distal of Figure 10B, in accordance with at least one embodiment of the present disclosure.
  • Figure 10D is a is a longitudinal cross-sectional representation taken at section line 10D-10D of Figure 9, just distal of Figure 10C and just proximal of the sensor, in accordance with at least one embodiment of the present disclosure.
  • Figure 11 is a longitudinal cross-sectional representation of a distal portion of an example intravascular device incorporating coated ink traces of varying electrical impedance, in accordance with at least one embodiment of the present disclosure.
  • Figure 12 is a schematic diagram of a processor circuit, in accordance with at least one embodiment of the present disclosure.
  • a printed ink conductor-resistor assembly can provide a single-layer or multilayer application of conductive metal ink traces which permit improved electrical/mechanical performance and reduce or eliminate manufacturing issues associated with conductive filars or ribbons.
  • Using nano-metal ink traces enables the use of conductive materials with lower tensile strengths and larger conductor cross-sections or surface areas. This may provide for lower electrical resistance/impedance along the length of the electro-mechanical device, as well as improving the straightness and torque response of intraluminal devices, while reducing manufacturing defects and reducing the complexity of the intraluminal device manufacturing process.
  • some components of the intraluminal device can have high electrical impedances, whereas the conductive fdars, ribbons, or traces have low impedances. Where these materials contact one another, the resulting electrical impedance mismatch can cause partial signal reflections that reduce the electrical efficiency and acoustic performance of the intraluminal device.
  • printed resistive ink e.g., conductive ink with a higher resistance than pure metallic inks
  • electrical impedance can be matched between the components and thus increase electrical efficiency. This can result in higher acoustic performance, allowing either a reduction in required input power from the patient interface monitor or patient interface module (PIM), or enabling new device design decisions that benefit from the improved acoustic performance.
  • a printed ink conductor-resistor assembly that provides an ability to create conductive traces with desired impedances, e g., in between the impedance of a PZT element and a purely conductive trace.
  • a conductive ink e g., nano-metal ink
  • a conductive ink can applied directly onto an insulating polymer layer as a liquid, and then sintered into a substantially solid metal with material properties equivalent to bulk materials. Where resistive materials are incorporated into the metal
  • electrical impedance mismatching can cause a certain percentage of each signal traveling down a conductor (e.g., a transmit signal transmitted from the PIM to the flow sensor (e.g., ultrasound transducer) or a receive signal traveling from the flow sensor (e.g., ultrasound transducer) to the PIM) to be reflected at the impedance-mismatched interface.
  • a conductor e.g., a transmit signal transmitted from the PIM to the flow sensor (e.g., ultrasound transducer) or a receive signal traveling from the flow sensor (e.g., ultrasound transducer) to the PIM
  • the PIM in existing intraluminal measurement systems has needed to grow in size and thermal complexity to compensate for the additional input power required by the intraluminal device.
  • printed resistive inks incorporated into the electrical pathway, can reduce or eliminate impedance mismatches between the components and thus increase electrical efficiency. This can result in higher acoustic performance, allowing either a reduction in required input power from the patient interface monitor (PIM) or enabling new device designs that benefit from the improved acoustic performance.
  • PIM patient interface monitor
  • the resistance of a resistive ink trace may, for example, be a function of both its composition and its length.
  • Example materials for a conductive ink trace include silver and gold metal inks.
  • Example materials for a resistive (e.g., partially conductive) ink trace include metal inks doped with carbon or other dielectric materials.
  • resistive portions may be placed somewhere in the middle of an otherwise-conductive trace, e.g., for mechanical, geometrical, or manufacturing reasons.
  • resistive and conductive inks can be mixed or blended, to create an electrical trace (or portion thereof) that has a specific impedance or impedances matched to the other components to which the trace connects.
  • Resistive ink traces may for example be placed between conductive ink traces and metal wires, between conductive ink traces and piezoelectric transducer materials, between wires or printed traces of different impedance (e.g., due to different composition or cross- sectional area), between metal wires and piezoelectric transducer materials, or in any other location where an impedance mismatch between adjacent materials causes unwanted signal loss.
  • Example intraluminal devices incorporating a multi-filar conductor bundle and/or conductive ribbons include intraluminal medical guidewire devices as described for example in U.S. Patent No. 10,595,820 B2, U.S. Patent No. 10,791,991 B2, and U.S. Patent No. 10,441,754 B2, and Publication No. 2016/0058977 (filed 27 August 2015), and, and in U.S. Provisional Patent Application No. 62/552,993 (filed 31 August 2017), each of which is incorporated by reference in its entirety as though fully set forth herein.
  • Example intraluminal devices incorporating conductive ink traces in place of filars or ribbons can be found for example in U.S. Provisional Patent No 63/051,927 (filed 15 July 2020), International Patent Publication No. WO2022/013266 (Filed 20 January 2022), U.S.
  • FIG 1 is a diagrammatic side view of an intraluminal (e.g., intravascular) sensing system 100 that includes an intravascular device 102 comprising conductive members 230 (e.g., a multi-filar electrical conductor bundle) and conductive ribbons 260, in accordance with at least one embodiment of the present disclosure.
  • the intravascular device 102 can be an intravascular guidewire sized and shaped for positioning within a vessel of a patient.
  • the intravascular device 102 includes a distal tip 108 and an electronic component 112.
  • the intravascular device 102 comprises a distal subassembly and a proximal subassembly that are electrically and mechanically joined together, which creates an electrical communication between the electronic component 112 and the conductive portions 132, 134.
  • flow data obtained by the electronic component 112 can be transmitted to the conductive portions 132, 134.
  • the flow sensor 112 is a single ultrasound transducer element such as a crystal of piezoelectric lead zirconate titanate (PZT) material with activating electrodes to either apply an electric field to compress the material or to receive an electric field given off by the material as it is compressed by an external force.
  • PZT piezoelectric lead zirconate titanate
  • Control signals from a processing system 306 e.g., a processor circuit of the processing system 306) in communication with the intravascular device 102 can be transmitted to the electronic component 112 via a connector 314 that attached to the conductive portions 132, 134.
  • the distal subassembly can include the distal core 210.
  • the distal subassembly can also include the electronic component 112, the conductive members 230, and/or one or more layers of insulative polymer/plastic 240 surrounding the conductive members 230 and the core 210.
  • the polymer/plastic layer(s) can insulate and protect the conductive members of the multi-filar cable or conductor bundle 230.
  • the proximal subassembly can include the proximal core 220.
  • the proximal subassembly can also include one or more polymer layers 250 (hereinafter polymer layer 250) surrounding the proximal core 220 and/or conductive ribbons 260 embedded within the one or more insulative and/or protective polymer layer 250.
  • the proximal subassembly and the distal subassembly are separately manufactured.
  • the proximal subassembly and the distal subassembly can be electrically and mechanically joined together.
  • flexible elongate member can refer to one or more components along the entire length of the intravascular device 102, one or more components of the proximal subassembly (e.g., including the proximal core 220, etc.), and/or one or more components the distal subassembly 410 (e.g., including the distal core 210, etc ). Accordingly, flexible elongate member may refer to the combined proximal and distal subassemblies described above. The joint between the proximal core 220 and distal core 210 is surrounded by the hypotube 215. [0040] In various embodiments, the intravascular device 102 can include one, two, three, or more core wires extending along its length.
  • the conductive members 230 can be one or more electrical wires that are directly in communication with the electronic component 112. In some instances, the conductive members 230 are electrically and mechanically coupled to the electronic component 112 by, e.g., soldering. In some instances, the conductor bundle 230 comprises two or three electrical wires (e g., a bifilar cable or a trifilar cable). An individual electrical wire can include a bare metallic conductor surrounded by one or more insulating layers.
  • the conductive members 230 can extend along the length of the distal core 210. For example, at least a portion of the conductive members 230 can be spirally wrapped around the distal core 210, minimizing or eliminating whipping of the distal core within tortuous anatomy.
  • the intravascular device 102 can include one or more conductive ribbons 260 at the proximal portion of the flexible elongate member 106.
  • the conductive ribbons 260 may be embedded within polymer layer 250.
  • the conductive ribbons 260 are directly in communication with the conductive portions 132 and/or 134.
  • a multi-filar conductor bundle 230 is electrically and mechanically coupled to the electronic component 112 by, e g., soldering.
  • the conductive portions 132 and/or 134 comprise conductive ink (e.g., metallic nano-ink, such as copper, silver, gold, or aluminum nano-ink) that is deposited or printed directed over the conductive ribbons 260.
  • the intravascular device 102 includes a locking section 118 and a retention section 120. To form locking section 118, a machining process is used to remove polymer layer 250 and conductive ribbons 260 in locking section 118 and to shape proximal core 220 in locking section 118 to the desired shape.
  • locking section 118 includes a reduced diameter while retention section 120 has a diameter substantially similar to that of proximal core 220 in the connection portion 114.
  • an insulation layer 158 is formed over the proximal end portion of the connection portion 114 to insulate the exposed conductive ribbons 260.
  • a connector 314 provides electrical connectivity between the conductive portions 132, 134 and a patient interface monitor 304.
  • the Patient Interface Monitor 304 may in some cases connect to a console or processing system 306, which includes or is in communication with a display 308.
  • the PIM 304 transfers the received signals to the processing system 306 where the information is processed and displayed (e.g., as physiology data in graphical, symbolic, or alphanumeric form) on the display 308.
  • the console or processing system 306 can include a processor and a memory.
  • the processing system 306 may be operable to facilitate the features of the intravascular sensing system 100 described herein.
  • the processor can execute computer readable instructions stored on the non-transitory tangible computer readable medium.
  • the PIM 304 facilitates communication of signals between the processing system 306 and the intraluminal device 102.
  • the PIM 304 can be communicatively positioned between the processing system 306 and the intraluminal device 102.
  • the PIM 304 performs preliminary processing of data prior to relaying the data to the processing system 306.
  • the PIM 304 performs amplification, filtering, and/or aggregating of the data.
  • the PIM 304 also supplies high- and low-voltage DC power to support operation of the intraluminal device 102 via the conductive members 230.
  • Communication, if any, along the multi -filar conductor bundle 230 may be through numerous methods or protocols, including serial, parallel, and otherwise, wherein one or more filars of the bundle 230 carry signals.
  • One or more filars of the multi-filar conductor bundle 230 may also carry direct current (DC) power, alternating current (AC) power, or serve as a ground connection.
  • proximal and/or distal core wire do not carry electrical signals, and in some aspects, proximal and/or distal core wire do not carry data signals (control signals, pressure signals, flow/echo signals).
  • the core wire could provide electrical ground, or could be electrically isolated from the other components.
  • Figure 2 is a side view of another type of intravascular device 102, in accordance with at least one embodiment of the present disclosure.
  • the intravascular device 102 can be an intravascular guidewire sized and shaped for positioning within a vessel of a patient.
  • the intravascular device 102 can include an electronic component 112.
  • the electronic component 112 can be a pressure sensor configured to measure a pressure of blood flow within the vessel of the patient, or another type of sensor. Pressure data obtained by a pressure sensor may for example be used to calculate a physiological pressure ratio (e.g., FFR, iFR, Pd/Pa, or any other suitable pressure ratio).
  • the device 102 may be used in any suitable anatomical structure or body lumen including a blood vessel, blood vessel lumen, an esophagus, eustachian tube, urethra, fallopian tube, intestine, colon, and/or any other suitable anatomical structure or body lumen.
  • the intravascular device 102 includes a flexible elongate member 106, such as a guidewire.
  • the electronic component 112 is disposed at the distal portion 107 of the flexible elongate member 106.
  • the electronic component 112 can be mounted at the distal portion 107 within a housing 280 in some embodiments.
  • a flexible tip coil 290 extends between the housing 280 and the distal end 108.
  • the connection portion 114 is disposed at the proximal portion of the flexible elongate member 106.
  • the connection portion includes the conductive portions 132, 134, 136.
  • the conductive portions 132, 134, 136 can be conductive ink that is printed and/or deposited around the flexible elongate member.
  • the conductive portions 132, 134, 136 are conductive, metallic rings or bands that are positioned around the flexible elongate member.
  • the locking section 118 and retention section 120 are disposed at the proximal portion of the flexible elongate member 106.
  • the intravascular device 102 comprises a distal subassembly 410 and a proximal subassembly 400 that are electrically and mechanically coupled, which provides for electrical communication between the electronic component 112 and the conductive portions 132, 134, 136.
  • pressure data obtained by the electronic component 112 can be transmitted to the conductive portions 132, 134, 136.
  • Control signals from a processing system in communication with the intravascular device 102 can be transmitted to the electronic component 112 via the conductive portions 132, 134, 136.
  • the distal subassembly 410 can include the distal core 210.
  • the distal subassembly 410 can also include the electronic component 112, the conductive members 230, and/or one or more layers of polymer/plastic 240 surrounding the conductive members 230 and the core 210.
  • the polymer/plastic layer(s) can protect the conductive members 230.
  • the proximal subassembly 400 can include the proximal core 220.
  • the proximal subassembly 400 can also include one or more polymer layers 250 surrounding the proximal core 220 and/or conductive ribbons 260 embedded within the one or more polymer layers 250.
  • the proximal subassembly 400 and the distal subassembly 410 can be separately manufactured.
  • proximal subassembly 400 and the distal subassembly 410 can be electrically and mechanically joined together, and the joint can be enclosed in a hypotube 215.
  • flexible elongate member can refer to one or more components along the entire length of the intravascular device 102, one or more components of the proximal subassembly 400 (e.g., including the proximal core 220, etc.), and/or one or more components the distal subassembly 410 (e.g., including the distal core 210, etc .).
  • the intravascular device 102 can include one, two, three, or more core wires extending along its length.
  • a single core wire can extend substantially along the entire length of the flexible elongate member 106.
  • a locking section 118 and a retention section 120 can be integrally formed at the proximal portion of the single core wire.
  • the electronic component 112 can be secured at the distal portion of the single core wire.
  • the locking section 118 and the retention section 120 can be integrally formed at the proximal portion of the proximal core 220.
  • the electronic component 112 can be secured at the distal portion of the distal core 210.
  • the intravascular device 102 includes one or more conductive members 230 in communication with the electronic component 112.
  • the conductive members 230 can be one or more electrical wires that are directly in communication with the electronic component 112.
  • the intravascular device 102 includes one or more conductive ribbons 260 at the proximal portion of the flexible elongate member 106.
  • the conductive ribbons 260 are embedded within polymer layer(s) 250.
  • the conductive ribbons 260 are directly in communication with the conductive portions 132, 134, and/or 136.
  • the conductive members 230 are electrically and mechanically coupled to the electronic component 112 by, e.g., soldering, welding, terminals, clamps, conductive adhesive, or other appropriate methods.
  • the conductive portions 132, 134, and/or 136 comprise conductive ink (e.g., metallic nano-ink, such as silver or gold nano-ink) and/or resistive ink (e g., carbon-doped metallic nano-ink) that is deposited or printed directed over the conductive ribbons 260.
  • conductive ink e.g., metallic nano-ink, such as silver or gold nano-ink
  • resistive ink e g., carbon-doped metallic nano-ink
  • the resistive ink conducts electricity, but has a higher resistance or impedance than the conductive ink.
  • electrical communication between the conductive members 230 and the conductive ribbons 260 can be established at the connection region 265 of the flexible elongate member 106.
  • the conductive portions 132, 134, 136 can be in electrically communication with the electronic component 112.
  • the machining process that forms locking section 118 may remove of the conductive ribbons 260, proximal ends of the conductive ribbons 260 would be exposed to moisture and/or liquids, such as blood, saline solutions, disinfectants, and/or enzyme cleaner solutions.
  • an insulation layer 158 can be formed over the proximal end portion of the connection portion 114 to insulate the exposed conductive ribbons 260.
  • Figure 3 is a diagrammatic cross-sectional view of an example sensor assembly 251, which may for example be included in the intravascular device 102 of Figure 1 or Figure 2, in accordance with at least one embodiment of the present disclosure. More specifically, Figure 3 illustrates a sensor assembly 251 that includes a sensing component 112, a housing 280, and an acoustic matching layer 252. As indicated by the positions of the sensing component 112 and the housing 280 illustrated in Figure 1, the sensor assembly 251 may be included in a distal portion of the intravascular device 102 such that the surface 272 of the sensing component 112 faces distally.
  • one or more filars of the multi-filar conductor bundle 230 may couple to an element, such as a transducer (e.g., an ultrasound transducer), of the sensing component 112 and may provide power, control signals, an electrical ground or signal return, and/or the like to the element.
  • an element such as a transducer (e.g., an ultrasound transducer), of the sensing component 112 and may provide power, control signals, an electrical ground or signal return, and/or the like to the element.
  • an element may be positioned on the distal surface 272 of the sensor.
  • one or more filars of the multi-filar conductor bundle 230 may extend through a cutout or hole in the sensing component 112 (e.g., in at least the proximal surface 270) to establish electrical communication with an element on the distal surface 272 of the sensor.
  • the acoustic matching layer 252 may provide acoustic matching with the sensing component 112 via one or more dimensions of the acoustic matching layer 252.
  • the sensor assembly 251 may include an atraumatic tip, such as the distal tip 108 illustrated in Figure 1.
  • the distal tip 108 may include the same material as the acoustic matching layer 252.
  • the distal tip may include a different material than the acoustic matching layer 252.
  • the distal tip 108 may be formed from one or more layers of materials. The layers may include different materials and/or different configurations (e.g., shape and/or profile, thickness, and/or the like). Further, the distal tip 108 may be arranged to cover the distal surface 272 of the sensing component 112.
  • the multi-filar conductor cable 230 may be replaced with coated conductive traces, as described below.
  • FIG 4 is a schematic view of an intravascular device 102 (e.g., a flow-sensing guidewire 350) during measurement of a flow velocity 380 inside a blood vessel 320 with blood vessel walls 340, in accordance with at least one embodiment of the present disclosure.
  • the sensor 112 e.g., an ultrasound transducer 360
  • the tip of the flexible elongate member is shown to emit ultrasound waves 370 that are backscattered as reflections 375 by flowing cells 390 in the blood and sensed by the transducer 360.
  • the backscattered reflections 375 have a longer wavelength and lower frequency than the ultrasound waves 370, due to the Doppler effect. If the blood cells 390 were flowing toward the sensor 112, then the backscattered reflections 375 would have a shorter wavelength and higher frequency than the ultrasound waves 370.
  • Figure 5A is a graph 500 showing an electrical impedance mismatch 510, in accordance with at least one embodiment of the present disclosure.
  • the graph 500 shows electrical impedance on the Y-axis and distance from the sensor on the X-axis.
  • the sensor 112 has a high electrical impedance (e.g., greater than 100 Ohms, e g., between 100 and 200 Ohms), whereas the conductive wires or filars 230 connected to the sensor 112 have a much lower impedance (e.g., zero to 4 Ohms).
  • the resulting impedance mismatch 510 is a step, e.g., a sudden discontinuity in the impedance of the system.
  • impedance is a function not only of the resistivity of a material but also its length, cross-sectional area, and the frequency of the signal.
  • a certain percentage of an electrical signal may tend to reflect from the impedance mismatch 510, with the amount of reflection being proportional to the difference in impedance from one side of the mismatch 510 to the other (e.g., the difference in impedance between the sensor 112 and the filars 230) at the frequency of the signal.
  • the amount of reflection may be different for transmit signals than for receive signals.
  • one or more control signals are sent from the console or processing system 306 to the PIM 304 (see Figure 1), and then from the PIM to the proximal connection portion 114, along the length of the filars 230 to the flow sensor/ultrasound transducer 112.
  • the control signals then activate or excite the transducer to emit ultrasound energy (e g., as pulses at a given frequency).
  • Figure 5B is a graph 520 showing a graduated electrical impedance transition, in accordance with at least one embodiment of the present disclosure.
  • the graph 520 of Figure 5B shows electrical impedance on the Y-axis and distance from the sensor on the X-axis, and the sensor 112 has the same high electrical impedance (e.g., > 100 Ohms).
  • the conductive wires or filars 230 have been replaced with electrical traces made from electrically conductive inks of different impedances, in order to reduce impedance mismatch, minimize signal loss, and improve the performance and efficiency of the intravascular sensing system 100 (see Figure 1).
  • first resistive ink 530 e.g., an electrically conductive ink with an impedance that is lower than that of the sensor 112, but substantially higher than that of the wires or filars 230.
  • the first resistive ink 530 may have an electrical impedance of between 15 and 50 Ohms (e.g., selected to minimize - ), and can thus be used as an resistance 1+resistance 2 impedance-matching component positioned between a conductive ink trace of low or zero impedance and a high-electrical-impedance component such as the sensor 112.
  • the impedance mismatch 540 between the sensor 112 and the first resistive ink 530 may be about 90 Ohms, rather than 100 Ohms, to minimize total reflection between the 1 Ohm/10 Ohm interface and the 10 Ohm/100 Ohm interface.
  • the first resistive ink 530 is a second resistive ink 550, with a moderate impedance that is lower than the impedance of the first resistive ink 530, and may for example be between 2 and 10 Ohms, resulting in an impedance mismatch 560 of between 5 and 60 Ohms between the first resistive ink 530 and the second resistive ink 550.
  • the second resistive ink 550 is a conductive ink 570, with a very low impedance that is less than the impedance of the second resistive ink 550, and may for example be between 0 and 2 Ohms, resulting in an impedance mismatch 580 of between 0 and 10 Ohms between the second resistive ink 550 and the conductive ink 570.
  • each of the three impedance mismatches 540, 560, and 580 of Figure 5B collectively add up to roughly the same impedance drop as the single impedance mismatch 510 of Figure 5A, each of the three impedance mismatches 540, 560, and 580 is substantially smaller than the impedance mismatch 510.
  • the resulting reflections are therefore milder, and the total signal transmission may, for example, be 2-3 times as much in Figure 5B as in Figure 5A. In an example, where the sensor resistance is 100 Ohms and the conductor resistance is 1 Ohm, total reflection is 98.0%.
  • the conductive inks described herein may for example be or include solutions or colloidal suspensions of conductive nanoparticles (e.g., metallic particles such as, such as copper, silver, gold, or aluminum) in an evaporable carrier medium.
  • conductive nanoparticles e.g., metallic particles such as, such as copper, silver, gold, or aluminum
  • the resistivity of a given ink can be adjusted through the addition of different amounts of resistive materials such as carbon (e.g., adding more carbon will increase the resistivity, while less carbon will decrease the resistivity)
  • the impedance of an electrical trace is, in part, a function of the resistivity of the material from which it’s made.
  • resistive ink is simply a conductive ink with an resistance significantly above zero.
  • resistive inks such as ink 530 will be referred to as high-impedance conductive inks
  • resistive inks such as ink 550 will be referred to as moderate impedance conductive inks
  • conductive inks such as ink 570 will be referred to as low-impedance or zero-impedance conductive inks.
  • the high impedance for the ink 530 can be impedance that is relatively higher than the moderate impedance of ink 550, which is relatively higher than the low impedance of ink 570.
  • the high impedance for the ink 530 is relatively lower than the impedance for the sensor 112.
  • the transition between different resistance levels can be smooth, graduated, and/or a combination thereof.
  • resistive ink can be provided in discrete, well defined segments for a graduated transition in resistance.
  • the amount of resistive ink that is provided and/or that is blended with conductive inks can be smoothly varied along a length of the trace, to provide a smooth transition in resistance.
  • Figure 6 is a diagrammatic side view of the intravascular device 102 of Figure 2, wherein the multi -filar electrical conductor bundle 230 and conductive ribbons 260 have been replaced with coated longitudinal traces 1560, in accordance with at least one embodiment of the present disclosure.
  • the coated longitudinal traces 1560 may be straight (as opposed to being spiraled around the core wire as in Figure 2), and may connect the electronic component or sensor 112 with electrical the conductive regions 132 and 134 (e.g., one coated longitudinal trace 1560 connects to conductive region 132 but not 134, and another coated longitudinal trace 1560 connects to conductive region 134 but not 132).
  • the coated longitudinal traces 1560 include a region that passes through the coil 290 and then follows the distal core wire 210, and is overcoated with an insulative or protective polymer coating 240.
  • the coated longitudinal traces 1560 additionally include a region that passes through the hypotube 215. Between the hypotube 215 and the conductive regions 132, 134, the conductive traces 1560 are overcoated with a polymer coating 250.
  • Placement of the coated conductive traces 1560 in these regions does not require tensioning, with attendant risk of unwanted elongation and/or necking, and may therefore represent an improvement over the use of multi-filar conductor bundles.
  • the coated longitudinal traces 1560 include a first region 630 where the longitudinal traces 1560 are made of a first conductive ink 530 with a high electrical impedance (e.g., midway between the electrical impedance of the sensor 112 and that of the second conductive ink 550).
  • the coated longitudinal traces 1560 include a second region 650 where the longitudinal traces 1560 are made of a second conductive ink 550 with a moderate electrical impedance (e.g., midway between the electrical impedance of the first conductive ink 530 and that of the third conductive ink 570).
  • the coated longitudinal traces 1560 may for example be made from a coated, conductive ink, such as a nano-metallic ink as described above, which conforms to the curve of the core wire 220 and the insulator 250. This may permit the coated longitudinal traces 1560 to be wider and have a larger cross-sectional area (and therefore greater current carrying capacity) than wires, filars, or ribbons of comparable height. Furthermore, because the coated longitudinal traces 1560 conform to the shape of the core wire 220, they do not add as much stiffness to the proximal core wire assembly 400, and therefore improve the durability and fatigue resistance of the insulator 250.
  • the coated longitudinal traces 1560 are coated or deposited rather than wrapped or tensioned, they can for example be made of mechanically weak conductor materials such as pure metallic copper, without the risk of elongation or necking during the manufacturing process. Additionally, the coated longitudinal traces 1560 conform to the shape or curvature of the wire, which can serve to reduce the cross-sectional size or profile of the device 102. Conductive nano-metal inks (as described above) may be employed for this production process. The conductive nano-metal ink can be applied in many ways, including but not limited to inkjet printing, aerosol -jet printing, felt/foam pad applicator, or dip coating.
  • the material is cured or dried, and the traces are formed from the cured or dried material.
  • the coated material is sintered, e.g., heated until the small metal particles in the coated ink melt together. Sintering can be accomplished with an oven, a laser, a torch, or by other means. Once cured, sintered, or otherwise turned into a solid metal, the coated metal layer or layers can be individuated via laser ablation, mechanical cutting/skiving or any other methods capable of removing metal and/or polymer material in a precise manner. This process can be implemented on continuous reel to reel type combination coater/oven equipment.
  • ink application is performed with an ink-impregnated pad made of felt or foam, and individuation is performed by mechanical cutting.
  • ink application is performed with an ink-impregnated felt or foam pad, and individuation is performed via laser ablation.
  • the ink application is performed by dip coating. This printed ink conductor-resistor assembly could be applied to any product that employs electrical conductors embedded into composite subassemblies.
  • a coil 290 that terminates with an electronic device 112 that may be fully or partially enclosed within a housing 280. Also visible is a reinforced multi-filar conductor bundle 230 that includes conductive filars 310 and 330.
  • the electronic device or sensor 112 may be located at a proximal end of the coil 290 instead of being at a distal end of the coil 290. In such embodiments, the coated conductive traces 710 and 730 would not extend into the coil 290 and rather terminate proximal of the coil 290, at the electronic device 112.
  • one electronic device 112 can be at the distal end of the intravascular device 102, and a different electronic device 112 can be spaced from the distal end.
  • the coated conductive traces 710 and 730 each have a first region 740 made of a first conductive ink 530 with a high resistivity as described above in Figures 5B and 6, and a second region 750 made of a second conductive ink 550 with a moderate resistivity as described above in Figures 5B and 6, in order to form an impedance matching structure 780 between the electronic component or sensor 112 and the conductive filars 310, 330.
  • the coated conductive traces 710 and 730 respectively connect to the filars 310 and 330 at electrical contacts 720.
  • the coated conductive traces 710 and 730 and the conductive filars 310 and 330 connect the electronic component 112 with electrical contacts 1010 formed on the conductive traces 660 (e.g., metallic ribbons) that make electrical contact with the conductive regions 132 and 134.
  • the device 102 can include any suitable quantity of coated conductive traces, including two, three, four, five, or more.
  • the device 102 can include any suitable quantity of conductors in the bundle 230, include two, three, four, five, or more.
  • the device 102 can include any suitable quantity of conductive traces 660, include two, three, four, five, or more.
  • the device 102 includes the same quantity of coated traces as conductors in the bundle 230 and conductive traces 660. In some embodiments, the quantity of coated traces and/or conductors in the bundle 230 is greater than or less than the quantity of conductive traces 660.
  • the device 102 can include any suitable number of conductive regions 132 and 134, include two, three, four, five or more. In some embodiments, the device 102 includes the same quantity of conductive traces 660 as conductive regions 132 and 134.
  • the electrical contacts 1010 can be omitted, and the conductive ink pathways 710, 730 can extend further proximally and can be respectively coupled to conductive portions 132, 134 (e.g., as shown above in Figure 6).
  • the quantity of conductive ink sections of different impedance sections can be one, two, three, four or more.
  • the relative length of each resistive ink/conductive inks section can be longer or shorter than shown herein, and may be equal or unequal to one another.
  • the conductive filars 230 can be omitted, so that the conductive ink 730, conductive ink 710, and ribbons 660 are used for electrical communication pathway.
  • the conductive inks 710 and/or 730 can extend along the distal core, such that the conductive ink 710 can be coupled to the ribbons 660.
  • Other arrangements or combinations of conductive wires, filars, ribbons, and coated conductive traces may be used instead of or in addition to those described herein, without departing from the spirit of the present disclosure.
  • Figure 8A is a longitudinal cross-sectional representation of a coated conductive ink trace 810, in accordance with at least one embodiment of the present disclosure.
  • the coated conductive ink trace 810 has a length L, a height H, and a resistivity per unit volume R. More specifically, resistivity is a function of cross-sectional area of the trace, and of the distance between two conductors and their position relative to each other around the center axis.
  • the total impedance of the coated conductive ink trace 810 is a function of H, L, and R.
  • the impedance of the trace 810 can be increased by reducing H while leaving L and R constant, by increasing L while leaving H and R constant, or by increasing R while leaving L and H constant, or combinations thereof.
  • the impedance of the trace 810 can be decreased by increasing H while leaving L, W, and R constant, by increasing W while leaving L, H, and R constant, by decreasing L while leaving W, H and R constant, or by decreasing R while leaving L, W, and H constant, or combinations thereof.
  • different materials can provide different resistivity per unit volume or unit area, while different quantities or concentrations of the same material can provide different resistivity per unit volume or unit area.
  • Figure 9 is a longitudinal cross-sectional representation of a distal portion of an example intravascular device 102 incorporating coated ink traces 710 and 730 of varying impedance, in accordance with at least one embodiment of the present disclosure.
  • coated trace 710 connects to the proximal face of sensor 112
  • coated trace 730 connects to the distal face of sensor 112.
  • Each coated trace 710 includes a region of high-impedance conductive ink 530 in contact with the sensor 112 and a region of moderate-impedance conductive ink 550 in contact with the high-impedance conductive ink 530.
  • direct contact between the high- impedance conductive ink 530 and the sensor/transducer 112 could be anywhere (distal/proximal faces, lateral side surfaces, etc., depending on where the electrical contacts of the sensor/transducer are located.
  • the sensor housing 280 and distal tip 108 are also visible.
  • either or both of the housing 280 or the distal tip 108 may include an acoustic impedance matching layer.
  • the inks 530, 550 can still provide an impedancematching structure or function, provided the embedded wires or conductive traces 1110 and 1130 cover only a short distance (e.g., a fraction of the wavelength of the signal) between the high-impedance conductive ink 530 and the higher-impedance material (e.g., lead zirconate titanate or PZT) of the sensor 112.
  • a short distance e.g., a fraction of the wavelength of the signal
  • sensor housings that include embedded conductors are described for example in U.S. Application No. 63/328,355, filed April 7, 2022, and titled “MultiComponent Housing For Sensor In Intraluminal Device”.
  • Sensor housings produced by, for example, additive manufacturing could include conductive pathways incorporating any desired level of resistive material and thus of any desired electrical impedance, which may for example fall within the ranges described herein, or other ranges, depending on the implementation.
  • FIG. 12 is a schematic diagram of a processor circuit 1250, according to at least one embodiment of the present disclosure.
  • the processor circuit 1250 may be implemented in the intravascular sensing system 100 (e.g., the processing system 306) or other devices or workstations (e.g., third-party workstations, network routers, etc.), or on a cloud processor or other remote processing unit, as necessary to implement the method.
  • the processor circuit 1250 may include a processor 1260, a memory 1264, and a communication module 1268. These elements may be in direct or indirect communication with each other, for example via one or more buses.
  • the processor 1260 may include a central processing unit (CPU), a digital signal processor (DSP), an ASIC, a controller, or any combination of general-purpose computing devices, reduced instruction set computing (RISC) devices, application-specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), or other related logic devices, including mechanical and quantum computers.
  • the processor 1260 may also comprise another hardware device, a firmware device, or any combination thereof configured to perform the operations described herein.
  • the processor 1260 may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.
  • the memory 1264 may include a cache memory (e.g., a cache memory of the processor 1260), random access memory (RAM), magnetoresistive RAM (MRAM), readonly memory (ROM), programmable read-only memory (PROM), erasable programmable read only memory (EPROM), electrically erasable programmable read only memory (EEPROM), flash memory, solid state memory device, hard disk drives, other forms of volatile and non-volatile memory, or a combination of different types of memory.
  • the memory 1264 includes a non-transitory computer-readable medium.
  • the memory 1264 may store instructions 1266.
  • the instructions 1266 may include instructions that, when executed by the processor 1260, cause the processor 1260 to perform the operations described herein.
  • Instructions 1266 may also be referred to as code.
  • the terms “instructions” and “code” should be interpreted broadly to include any type of computer- readable statement(s).
  • the terms “instructions” and “code” may refer to one or more programs, routines, sub-routines, functions, procedures, etc.
  • “Instructions” and “code” may include a single computer-readable statement or many computer-readable statements.
  • the communication module 1268 can include any electronic circuitry and/or logic circuitry to facilitate direct or indirect communication of data between the processor circuit 1250, and other processors or devices. In that regard, the communication module 1268 can be an input/output (I/O) device.
  • I/O input/output
  • the communication module 1268 facilitates direct or indirect communication between various elements of the processor circuit 1250 and/or the intravascular measurement system 100.
  • the communication module 1268 may communicate within the processor circuit 1250 through numerous methods or protocols.
  • Serial communication protocols may include but are not limited to United States Serial Protocol Interface (US SPI), Inter-Integrated Circuit (I 2 C), Recommended Standard 232 (RS- 232), RS-485, Controller Area Network (CAN), Ethernet, Aeronautical Radio, Incorporated 429 (ARINC 429), MODBUS, Military Standard 1553 (MIL-STD-1553), or any other suitable method or protocol.
  • Parallel protocols include but are not limited to Industry Standard Architecture (ISA), Advanced Technology Attachment (ATA), Small Computer System Interface (SCSI), Peripheral Component Interconnect (PCI), Institute of Electrical and Electronics Engineers 488 (IEEE-488), IEEE-1284, and other suitable protocols.
  • serial and parallel communications may be bridged by a Universal Asynchronous Receiver Transmitter (UART), Universal Synchronous Receiver Transmitter (USART), or other appropriate subsystem.
  • UART Universal Asynchronous Receiver Transmitter
  • USBART Universal Synchronous Receiver Transmitter
  • External communication may be accomplished using any suitable wireless or wired communication technology, such as a cable interface such as a universal serial bus (USB), micro USB, Lightning, or FireWire interface, Bluetooth, Wi-Fi, ZigBee, Li-Fi, or cellular data connections such as 2G/GSM (global system for mobiles) , 3G/UMTS (universal mobile telecommunications system), 4G, long term evolution (LTE), WiMax, or 5G.
  • a Bluetooth Low Energy (BLE) radio can be used to establish connectivity with a cloud service, for transmission of data, and for receipt of software patches.
  • BLE Bluetooth Low Energy
  • the controller may be configured to communicate with a remote server, or a local device such as a laptop, tablet, or handheld device, or may include a display capable of showing status variables and other information. Information may also be transferred on physical media such as a USB flash drive or memory stick.
  • the apparatus includes an intravascular guidewire configured to be positioned within a blood vessel of a patient, where the intravascular guidewire may include: an intravascular sensor positioned at a distal portion of the guidewire and configured to obtain intravascular data while the intravascular guidewire is positioned within the blood vessel; a connection portion positioned at a proximal portion of the intravascular guidewire and configured to transmit and receive electrical signals associated with the intravascular sensor; and an electrical communication pathway between the intravascular sensor and the connection portion for the electrical signals.
  • the electrical communication pathway may include: a first conductive ink extending along a first length of the intravascular guidewire; and a second conductive ink extending along a second length of the intravascular guidewire.
  • the electrical impedances of the first conductive ink, the second conductive ink, and the intravascular sensor are different from one another such that the electrical communication pathway provides an electrical impedance transition between the intravascular sensor and the connection portion.
  • the intravascular sensor may include at least one of a pressure sensor, a blood flow sensor, or a temperature sensor.
  • the first conductive ink may include a first electrical impedance
  • the second conductive ink may include a second electrical impedance
  • the intravascular sensor may include a third electrical impedance, where the third electrical impedance of the intravascular sensor is greater than the first electrical impedance of the first conductive ink and the second electrical impedance of the second conductive ink, where the first electrical impedance of the first conductive ink is greater than the second electrical impedance of the second conductive ink.
  • the first electrical impedance of the first conductive ink is between 2 and 50 ohms
  • the second electrical impedance of the second conductive ink is between 0 and 10 ohms
  • the third electrical impedance of the intravascular sensor is between 100 and 200 ohms.
  • the first conductive ink is in direct physical and electrical contact with the intravascular sensor.
  • the first conductive ink and the second conductive ink are in direct physical and electrical contact with each other.
  • a proximal end of the first conductive ink is positioned over a distal end of the second conductive ink; or the distal end of the second conductive ink is positioned over the proximal end of the first conductive ink.
  • the second conductive ink is in direct physical and electrical contact with the conductive portion.
  • the first conductive ink and the second conductive ink are positioned only at the distal portion of the intravascular guidewire.
  • at least one of the first conductive ink or the second conductive ink is positioned at the proximal portion of the intravascular guidewire.
  • the first conductive ink and the second conductive ink are formed of differential materials.
  • the first conductive ink and the second conductive ink are formed of different quantities of a same material.
  • the electrical communication pathway may include at least one of an electrical filar or a flattened ribbon wire extending a third length of the intravascular guidewire, where the second conductive ink is coupled to at least one of the electrical filar or the flattened ribbon wire.
  • the intravascular guidewire may include: a core wire configured to provide structural support for the intravascular guidewire; and an insulative coating positioned over the core wire; where the first conductive ink and the second conductive ink are positioned on the insulative coating.
  • the apparatus includes an intravascular guidewire configured to be positioned within a blood vessel of a patient, where the intravascular guidewire may include: an intravascular sensor positioned at a distal portion of the guidewire and configured to obtain intravascular data while the intravascular guidewire is positioned within the blood vessel.
  • the apparatus also includes a connection portion positioned at a proximal portion of the intravascular guidewire and configured to transmit and receive electrical signals associated with the intravascular sensor.
  • the apparatus also includes a core wire configured to provide structural support for intravascular guidewire.
  • the apparatus also includes an insulative coating positioned over the core wire.
  • the apparatus also includes a first conductive ink positioned over the insulative coating and positioned relatively closer to the intravascular sensor.
  • the printed ink conductor-resistor assembly advantageously reduces reflection losses between the sensor and wires of an intraluminal ultrasonic sensor, by providing conformally-coated electrical traces with electrical impedances that step down gradually between the high impedance of the sensor material and the low impedance of electrical wires used elsewhere in the system. Aspects of the printed ink conductor-resistor assembly can be observed by tearing down and analyzing the electrical pathway of a device. If insulation is stripped off the physiology wire, resistance testing could be performed along the length of the wire to detect any sections of the wire with purposeful levels of resistance. The present disclosure also creates detectable material transition layers in the areas where individuation occurs.
  • the printed ink conductor-resistor assembly could be applied to any product that involves electrical conductors to embedded into composite subassemblies along with high- electrical-impedance components. Examples include, but are not limited to, other types of medical or non-medical devices that employ flexible elongate members whose diameters are severely restricted by the environment of use.
  • All directional references e.g., upper, lower, inner, outer, upward, downward, left, right, lateral, front, back, top, bottom, above, below, vertical, horizontal, clockwise, counterclockwise, proximal, and distal are only used for identification purposes to aid the reader’s understanding of the claimed subject matter, and do not create limitations, particularly as to the position, orientation, or use of the printed ink conductor-resistor assembly.
  • Connection references e.g., attached, coupled, connected, and joined are to be construed broadly and may include intermediate members between a collection of elements and relative movement between elements unless otherwise indicated. As such, connection references do not necessarily imply that two elements are directly connected and in fixed relation to each other.

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Abstract

Selon l'invention, un appareil comprend un fil-guide intravasculaire conçu pour être positionné à l'intérieur d'un vaisseau sanguin d'un patient. Le fil-guide intravasculaire comprend : un capteur intravasculaire positionné à la partie distale du fil-guide et configuré pour obtenir des données intravasculaires ; une partie de connexion positionnée à la partie proximale du fil-guide intravasculaire et configurée pour émettre et recevoir des signaux électriques associés au capteur ; et une voie de communication électrique entre le capteur et la partie de connexion pour les signaux électriques. La voie de communication électrique comprend : une première encre conductrice s'étendant le long d'une première longueur du fil-guide ; et une seconde encre conductrice s'étendant le long d'une seconde longueur du fil-guide. Les impédances électriques des première et seconde encres conductrices et du capteur intravasculaire sont toutes différentes les unes des autres de sorte que la voie de communication électrique assure une transition d'impédance électrique entre le capteur intravasculaire et la partie de connexion.
PCT/EP2025/058375 2024-04-03 2025-03-27 Dispositif de détection physiologique intraluminale avec traces d'encre résistive à adaptation d'impédance Pending WO2025209912A1 (fr)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1169749B1 (fr) * 1999-04-15 2010-05-26 Surgi-Vision Sonde a fil-guide pour l'imagerie par resonance magnetique
US20160058977A1 (en) 2014-08-28 2016-03-03 Volcano Corporation Intravascular devices, systems, and methods having an adhesive filled distal tip element
US10441754B2 (en) 2014-03-26 2019-10-15 Volcano Corporation Intravascular devices, systems, and methods having a core wire formed of multiple materials
US10595820B2 (en) 2012-12-20 2020-03-24 Philips Image Guided Therapy Corporation Smooth transition catheters
WO2020082091A1 (fr) * 2018-10-19 2020-04-23 Ozgur Kocaturk Dispositifs compatibles à l'irm
US10791991B2 (en) 2012-12-31 2020-10-06 Philips Image Guided Therapy Corporation Intravascular devices, systems, and methods
WO2022013266A1 (fr) 2020-07-15 2022-01-20 Koninklijke Philips N.V. Dispositif de détection physiologique intraluminal avec conducteurs enrobant intégrés

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1169749B1 (fr) * 1999-04-15 2010-05-26 Surgi-Vision Sonde a fil-guide pour l'imagerie par resonance magnetique
US10595820B2 (en) 2012-12-20 2020-03-24 Philips Image Guided Therapy Corporation Smooth transition catheters
US10791991B2 (en) 2012-12-31 2020-10-06 Philips Image Guided Therapy Corporation Intravascular devices, systems, and methods
US10441754B2 (en) 2014-03-26 2019-10-15 Volcano Corporation Intravascular devices, systems, and methods having a core wire formed of multiple materials
US20160058977A1 (en) 2014-08-28 2016-03-03 Volcano Corporation Intravascular devices, systems, and methods having an adhesive filled distal tip element
WO2020082091A1 (fr) * 2018-10-19 2020-04-23 Ozgur Kocaturk Dispositifs compatibles à l'irm
WO2022013266A1 (fr) 2020-07-15 2022-01-20 Koninklijke Philips N.V. Dispositif de détection physiologique intraluminal avec conducteurs enrobant intégrés

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