WO2025207704A1

WO2025207704A1 - Apparatus and process for packaging a product

Info

Publication number: WO2025207704A1
Application number: PCT/US2025/021443
Authority: WO
Inventors: Riccardo Palumbo
Original assignee: Cryovac LLC
Current assignee: Cryovac LLC
Priority date: 2024-03-29
Filing date: 2025-03-26
Publication date: 2025-10-02
Anticipated expiration: 2026-09-29

Abstract

An apparatus for packaging a product on a support includes a packaging assembly that receives film from a film supply assembly. The packaging assembly includes a lower tool that has a seat for the support, an upper tool, and a heating mechanism. The packaging assembly can operate in one operative condition where the lower and upper tools are spaced apart and another operative condition where the lower and upper tools form a packaging chamber. The packaging assembly heats a portion of the film with the heating mechanism, closes the lower and upper tool to form the packaging chamber, draws a vacuum in the packaging chamber, raises the seat, product and/or the support contacts the heated portion of the film, revents the packaging chamber to form a package with the product sealed between the support and the film, and then opens to permit the package to be removed.

Description

APPARATUS AND PROCESS FOR PACKAGING A PRODUCT

SPECIFICATION

BACKGROUND

[0001] The present disclosure is in the technical Field of packaging oF a product. More particularly, the present disclosure is directed to packaging a product under vacuum For obtaining a vacuum skin package.

[0002] Vacuum skin packaging is a known process For the packaging oF Food products which involves placing a product on a support, For example a tray or a Flat cardboard support. In the state oF the art, the support containing the product is moved towards a packaging assembly. The packaging assembly has a lower tool For receiving the support with the product arranged thereon and an upper tool For receiving a packaging Film. In detail, the Film is positioned at the upper tool and above the product placed on the support. Once received the Film and the support, the lower tool and the upper tool move one towards the other to define and close a packaging chamber around the support and the product. Then, the film is drawn upward against a heated dome oF the upper tool, so that the film is Formed and heated while held by suction in contact with the heated surface oF the dome. Then, vacuum is applied to the packaging chamber below the film and all around the supported product. Once the pressure in the packaging chamber reaches a pressure level suitable For packaging, the suction applied to the film is released and the film is pulled downwards to drape over the contours oF the product and in contact with the support. The film is thus welded to the support and Forms a tight skin around the product.

[0003] ThereFore, vacuum skin packaging is basically a thermoForming process where the film is Formed inside a dome above the support and the product. In order to be able to support the suction inside the dome and the consequent Forming around the contours oF the product, the film needs to show an elastic return. A drawback oF the prior art system is the need of using a film showing elastic return capabilities, often resulting in the need of using cross-linked films.

[0004] Also, when the forming of the film inside the dome takes place, it is not uncommon to obtain breakages of the film due to inadequate heating, excessive forming, or inappropriate mechanical and chemical properties of the film.

SUMMARY

[0005] This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This summary is not intended to identify key features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

[0006] In a first embodiment, an apparatus for packaging a product arranged on a support includes a film supply assembly configured to supply a film and a packaging assembly configured to receive the film and to couple the film to the support. The packaging assembly includes a lower tool having a main body and a seat, an upper tool having a main body, a heating mechanism located within the main body of the upper tool and configured to heat a portion of the film that has been received by the packaging assembly, and a controller. The packaging assembly is configured to receive the support with the product arranged thereon to the seat. The packaging assembly is configured to operate in a first operative condition and in a second operative condition. In the first operative condition, the main body of the lower tool and main body of the upper tool are distanced from each other. In the second operative condition, the lower tool and the upper tool are closed to form a packaging chamber. The controller is configured to: after the packaging assembly receives the support with the product arranged thereon, cause one or both of the lower and upper tool to move such that the packaging assembly transitions from the first operative condition to the second operative condition and the lower and upper tool form the packaging chamber with the support and product therein; cause a vacuum to be drawn in the packaging chamber; cause the seat to be raised so that the heated portion of the film is contacted by one or both of the product and the support; cause the packaging chamber to be revented so that a package is formed with the product sealed between the support and the film; and, after the package is formed, cause one or both of the lower and upper tools to move such that the packaging assembly transitions from the second operative condition to the first operative condition to permit the package to be removed from the packaging assembly.

[0007] In a second embodiment, the packaging assembly of the preceding embodiment is configured to receive the film such that the film passes beneath the main body of the upper tool and spans across a width of the main body of the upper tool.

[0008] In a third embodiment, the heating mechanism of any of the preceding embodiments is movable vertically within the main body of the upper tool and the heating mechanism is biased downward toward the film.

[0009] In a fourth embodiment, the heating mechanism of the preceding embodiment is biased downward toward the film by gravity .

[0010] In a fifth embodiment, the lower tool of any of the third to fourth embodiments further includes a base capable of relative movement with respect to the main body of the lower tool and a biasing mechanism configured to bias the base away from the main body of the lower tool. When the packaging assembly is in the second operative condition, the controller is configured to cause a force to be applied to the base to overcome a force of the biasing mechanism such that the base moves toward the main body of the lower tool.

[0011] In a sixth embodiment, the lower tool of the preceding embodiment further includes a pusher fixedly coupled to the base. The movement of the base toward the main body causes the pusher to be inserted into the upper tool and push the heating mechanism away from the film.

[0012] In a seventh embodiment, the movement of the base of any of the fifth to sixth embodiments toward the main body further causes the seat to be raised to cause one or both of the product and the support to contact the heated portion of the film.

[0013] In an eighth embodiment, the packaging assembly⁷ of any of the preceding embodiments is configured to receive the film such that the film passes through two sides of the main body of the upper tool and spans across a width of the main body of the upper tool.

[0014] In a ninth embodiment, the heating mechanism of the preceding embodiment is movable vertically within the main body of the upper tool and the controller is configured to cause the heating mechanism to move downward toward the portion of the film before the portion of the film is heated.

[0015] In a tenth embodiment, the controller of the preceding embodiment is further configured to cause the heating mechanism to move upward away from the portion of the film before the heated portion of the film is contacted by one or both of the product and the support.

[0016] In an eleventh embodiment, the controller of any of the preceding embodiments is configured to cause the heating mechanism to be activated to cause the heating of the portion of the film.

[0017] In a twelfth embodiment, during the heating of the portion of the film, the controller of the preceding embodiment is configured to control one or more of a temperature of the heating mechanism or an amount of time that the heating mechanism is activated.

[0018] In a thirteenth embodiment, during the heating of the portion of the film, the controller of the preceding embodiment is configured to control the heating mechanism based on signals indicative of at least one of a temperature inside of the main body of the upper tool or a temperature of the heating mechanism.

[0019] In a fourteenth embodiment, the controller of any of the preceding embodiments is configured to cause the packaging chamber to be revented through the main body of the upper tool so that the heated portion of the film is forced downward around the product and against portions of the support around the product.

[0020] In a fifteenth embodiment, the film of any of the preceding embodiments is either a low-crosslinked film or a non-crosslinked film.

[0021] In a sixteenth embodiment, the upper tool of any of the preceding embodiments further includes a cutting mechanism configured to cut the film around the support after the reventing of the packaging chamber to form the package.

[0022] In a seventeenth embodiment, the upper tool of the preceding embodiment further includes a base capable of relative movement with respect to the main body of the upper tool and a biasing mechanism configured to bias the base away from the main body of the lower tool. The cutting mechanism is fixedly coupled to the base. [0023] In an eighteenth embodiment, after the package has been formed, the controller of the preceding embodiment is configured to cause a force to be applied to the lower tool to overcome a force of the biasing mechanism such that the main body of the upper tool moves toward the base and the cutting mechanism cuts the film.

[0024] In a nineteenth embodiment, a method of forming a package uses an apparatus that includes a film supply assembly configured to supply a film and a packaging assembly configured to receive the film and to couple the film to a support. The packaging assembly incudes a lower tool having a main body and a seat, an upper tool having a main body, and a heating mechanism located within the main body of the upper tool. The method includes receiving, by the packaging assembly, the film from the film supply assembly and receiving, by the packaging assembly while the packaging assembly is in a first operative condition, a support with a product arranged thereon to the seat. When the packaging assembly is in the first operative condition, the main body of the low er tool and the main body of the upper tool are distanced from each other. The method further includes heating, by the heating mechanism, a portion of the film that has been received by the packaging assembly and, after the packaging assembly receives the support with the product arranged thereon, causing one or both of the lower and upper tool to move such that the packaging assembly transitions from the first operative condition to a second operative condition. When the packaging assembly is in the second operative condition, the lower tool and the upper tool are closed to form a packaging chamber. The method further includes drawing a vacuum in the packaging chamber, raising the seat so that the heated portion of the film is contacted by one or both of the product and the support, reventing the packaging chamber so that a package is formed with the product sealed betw een the support and the film, and, after the package is formed, moving one or both of the low er and upper tool such that the packaging assembly transitions from the second operative condition to the first operative condition to permit the package to be removed from the packaging assembly.

[0025] In a twentieth embodiment, the film of the preceding embodiments is either a low-crosslinked film or a non-crosslinked film.

[0026] In a twenty-first embodiment, reventing the packaging chamber of any of the nineteenth to twentieth embodiments includes reventing the packaging chamber through the main body of the upper tool so that the heated portion of the film is forced downward around the product and against portions of the support around the product.

[0027] In a twenty-second embodiment, the heating of the portion of the film of any of the nineteenth to twenty-first embodiments occurs while the film is substantially flat.

[0028] In a twenty-third embodiment, when the product of the preceding embodiment is on the support, the product protrudes above the support such that, when the seat is raised, the product makes initial contact with the heated portion of the film that is substantially flat, and wherein further raising of the seat after the initial contact causes the heated portion of the film to deflect so the heated portion of the film is no longer substantially flat.

[0029] In a twenty -fourth embodiment, wherein drawing the vacuum in the packaging chamber of any of the nineteenth to twenty -third embodiments occurs while the heated portion of the film is substantially flat.

BRIEF DESCRIPTION OF THE DRAWING

[0030] The foregoing aspects and many of the attendant advantages of the disclosed subject matter will become more readily appreciated as the same become better understood by reference to the following detailed description, when taken in conjunction with the accompanying drawings, wherein:

[0031] Fig. 1 depicts an embodiment of an apparatus for packaging a product arranged on a support, in accordance with the embodiments described herein;

[0032] Figs. 2A to 2F depict instances of an embodiment of a method of the apparatus shown in Fig. 1 forming a package around a product, in accordance with the embodiments described herein;

[0033] Fig. 3 depicts the system shown in Fig. 1 further including a controller configured to control operation of elements of the system, in accordance with the embodiments described herein;

[0034] Fig. 4 depicts an embodiment of an apparatus for packaging a product arranged on a support, in accordance with the embodiments described herein; [0035] Figs. 5A to 5M depict instances of an embodiment of a method of the apparatus shown in Fig. 4 forming a package around a product, in accordance with the embodiments described herein;

[0036] Fig. 6 depicts the system shown in Fig. 4 further including a controller configured to control operation of elements of the system, in accordance with the embodiments described herein;

[0037] Fig. 7 depicts an example embodiment of a system that may be used to implement some or all of the embodiments described herein; and

[0038] Fig. 8 depicts a block diagram of an embodiment of a computing device, in accordance w ith the embodiments described herein.

DETAILED DESCRIPTION

[0039] As used herein, the term “product” means an article or a composite of articles of any kind. For example, the product may be of a foodstuff type and be in solid, liquid or gel form. In the food sector, the product may include: meat, fish, cheese, treated meats, prepared and frozen meals of various kinds.

[0040] The packaging systems described herein include a controller configured to perform the steps of the process for making a package. The control unit can clearly be only one or be formed by a plurality of different controllers according to the design choices and the operational needs. The term “controller” means an electronic component which can comprise at least one of: a digital processor (for example comprising at least one selected from the group of: CPU, GPU, GPGPU), a memory (or memories), an analog circuit, or a combination of one or more digital processing units with one or more analog circuits. The controller can be configured (e.g., programmed) to perform some steps. Such configuration can be done in practice by any means that allows configuring or programming the control unit. For example, in the case of a control unit comprising one or more CPUs and one or more memories, one or more programs can be stored in appropriate memory banks connected to the CPU or to the CPUs; the program or programs contain instructions which, when executed by the CPU or the CPUs, program or configure the control unit to perform the operations described in relation to the control unit. Alternatively, if the controller is or includes analog circuitry, then the control unit circuit may be designed to include circuitry' configured, in use, for processing electrical signals so as to perform the steps related to control unit. The controller may comprise one or more digital units, for example of the microprocessor type, or one or more analog units, or a suitable combination of digital and analog units; the control unit can be configured for coordinating all the actions necessary' for executing an instruction and instruction sets.

[0041] As used herein, the term “support’" may be any substrate that supports a product. For example, a support can be the form of a tray having a base wall, side wall and optionally a top rim radially’ emerging from the side wall. In another example, the support may be flat (e.g., a board). In some embodiments, the support may have a rectangular shape or any other suitable shape, such as round, square, elliptical, or any other shape. In some embodiments, a support can be manufactured by thermoforming, injection molding, extrusion, co-extrusion, lamination, and the like. In some embodiments, the manufacturing of a support can include cutting the support to size after formation. A support can be formed from paper material (e.g., paper or cardboard), a single layer polymeric material, a multi-layer polymeric material, any other suitable material, or any combination thereof.

[0042] In some cases, the embodiment of packages disclosed herein are capable of being formed with a recyclable support and a recyclable film. In some cases, the methods of forming packages disclosed herein enable the packages to be formed with a recyclable support and a recyclable film. In some cases, the methods of forming packages disclosed are capable of forming packages with a reduced error rate by reducing the rate of breakage of films. In some cases, the embodiment of packages disclosed herein are capable of being formed with a large variety’ of film materials, including low-crosslinked films or n on-crosslinked films.

[0043] In some embodiments, crosslinking of polymer films can occur when the film is exposed to ionizing radiation. The exposure to ionizing radiation causes affects polymer bonds in the film. For example, the ionizing radiation can break bonds in the polymer chains and form new' bonds between chains, resulting in increased physical properties. In other embodiments, chemical crosslinking processes can form crosslinked films with increased physical properties. In the past, crosslinked films were desirable for vacuum packaging because the increased physical properties of the crosslinked films decreased the failure rate of the film during the vacuum packaging process. However, crosslinked films are also disadvantageous in many instances because high-crosslinked films are difficult or impractical to recycle. It would be advantageous to use non-crosslinked films or low-crosslinked films in a vacuum packaging process if the high failure rate of non-crosslinked films and low- crosslinked films in vacuum packaging can be overcome.

[0044] As used herein, the term '‘low-crosslinked” film means a polymer film that meets any one of the following criteria: (1) the film has been exposed to ionizing radiation less than or equal to 50 kGy, (2) the gel content of the film is less than or equal to 10%. In the case of the gel content criteria, the gel content can be determined in accordance with ASTM D2765.

[0045] As used herein, the term “non-crosslinked” film means a polymer film that is substantially free from any crosslinking. For example, a film that has not been exposed to ionizing radiation or any chemical crosslinking is a non-crosslinked film.

[0046] Fig. 1 depicts an embodiment of an apparatus 100 for packaging a product arranged on a support. The apparatus 100 includes a packaging assembly 102 and a film supply assembly 104 that is configured to supply a film 106 to the packaging apparatus 102. In the depicted embodiment, the film supply assembly 104 includes a roll of the film 106. In some embodiments the film supply assembly 104 can include an unwind mechanism configured to unwind the film 106 from the roll.

[0047] The film 106 may be a packaging film. The film 106 can be applied to a support to form a lid on the support or a skin associated to the support. In some embodiments, the film 106 is flexible and capable of matching contours of a product and/or a support. The film 106 may be a single layer material or a flexible multilayer material that include at least a first outer heat-sealable layer, an optional inner gas barrier layer, and a second outer heat-resistant layer. The film 106 may also comprise other layers such as adhesive layers or bulk layers to increase a thickness of the film 106 and/or to improve its abuse properties. Any layer in the film 106 may contain additives. In some embodiments, any of the following additives may be added to any layer of the film 106: slip and anti-black agents, antioxidants, stabilizers, plasticizers, fillers, pigments, dyes, cross-linking inhibitors, cross-linking enhancers, UV absorbers, odor absorbers, oxygen scavengers, bactericides, antistatic agents, and the like. One or more layers of the film 106 may be cross-linked to improve the strength of the film and/or its heat resistance. However, it may be advantageous for the film 106 to be a low -crosslinked film or a non-crosslinked film (e.g., for the film 106 to be recyclable).

[0048] The packaging assembly includes a lower tool 108 and an upper tool 110 configured to cooperate with each other. In particular, the lower tool 108 and the upper tool 110 are configured to cooperate with each other to define a packaging chamber around the product and the support. In some embodiments, the low er tool 108 includes a main body 112 and the upper tool 110 incudes a main body 114. When the main body 112 of the low er tool 108 and the main body 114 of the upper tool 110 are in contact with each other, the main bodies 112 and 114 form the packaging chamber. At least one of the lower and upper tools 108 and 110 is configured to move towards and away from the other. In some embodiments, both of the lower and upper tools 108 and 110 are configured to move tow ards and aw ay from the other. In other words, the upper tool 110 may be movable towards and away from the low er tool 108 when the lower tool 108 is stationary, or the lower tool 108 may be movable towards and away from the upper tool 110 when the upper tool 110 is stationary, or both the lower and upper tools 108 and 110 may be movable tow ards and away from each other.

[0049] The packaging assembly 102 of the apparatus 100 is configured to receive the film 106 from the film supply assembly 104 and to couple the film 106 to a support. In the depicted embodiment, the film 106 is received by the upper tool 110. In particular, the film 106 passes through two sides of the main body 114 of the upper tool 110 so that the film 106 spans across a width of the main body 114 of the upper tool 110. In other embodiments, the packaging assembly 102 can receive the film 106 by the film 106 passing between the low er and upper tools 108 and 110. In the depicted embodiment, the film supply assembly 104 includes a feed roller 116 configured to feed the film 106 to the packaging assembly 102 at a consistent angle regardless of how much of the film 106 remains on the roll of the film 106, as indicated by the dashed line.

[0050] In the depicted embodiment, the lower tool 108 has a seat 1 18 arranged to receive a support with a product arranged thereon. In other embodiments, the lower tool 108 may have a plurality of seats, each of w hich is configured to receive a respective support with a product arranged thereon. In some embodiments, the lower tool 108 may be configured to receive the support with the product thereon to the seat 118 from an infeed conveyor or any other conveyance mechanism that supplies the support with the product thereon to the low er tool conveyor or conveyance mechanism may be configured to supply multiple supports, each of which has a product thereon, to the multiple seats of the lower tool 108.

[0051] In the depicted embodiment, the lower tool 108 also has a lifting mechanism 120 arranged to lift the seat 118. A stem of the seat 118 passes through a stem of the lifting mechanism 120. An upper portion of the lifting mechanism 120 is located beneath an upper portion of the seat 118 and above a bottom of the main body 112 of the lower tool 108. A lower portion of the lifting mechanism 120 is located beneath a bottom of the main body 112 of the lower tool 108 and above a lower portion of the seat 118. The seat 1 18 can move vertically with respect to each of the main body 1 12 and the lifting mechanism 120 until any of the contacts: the lower portion of the seat 118 contacts the lower portion of the lifting mechanism 120, or the upper portion of the seat 118 contacts the upper portion of the lifting mechanism 120. The lifting mechanism 120 can move vertically with respect to each of the main body 112 and the seat 118 until any of the following contacts: the lower portion of the lifting mechanism 120 contacts the lower portion of the seat 118, the lower portion of the lifting mechanism 120 contacts the bottom of the main body 112, the upper portion of the lifting mechanism 120 contacts the bottom of the main body 112, or the upper portion of the lifting mechanism 120 contacts the upper portion of the seat 118.

[0052] The upper tool 110 includes a cutting mechanism 122 that is configured to cut the film 106. It will be apparent that, in other embodiments, the cutting mechanism 122 could be in the lower tool 108. In some embodiments, the cutting mechanism 122 may include a blade, a set of blades, a knife, a set of knifes, any other cutting mechanism, or any combination thereof. In the depicted embodiment, the cutting mechanism 122 is withdrawn from the film 122 and is capable of being moved selectively downward to contact the film 106 and cut the film 106. In some embodiments, the cutting mechanism 122 is biased toward the position shown in Fig. 1 and is capable of being pushed downward against the biasing force to cut the film 106.

[0053] The upper tool 110 also includes a heating mechanism 124. The heating mechanism 124 is configured to move vertically with respect to the main body 114 of the upper tool 110. In particular, the heating mechanism 124 is configured to move between the top of the main body 114 and the film 106. When the heating mechanism 124 is positioned near a portion of the film 106, the heating mechanism 124 can heat that portion of the film 106. For example, the heating mechanism 124 can heat that portion of the film 106 by thermal conduction, thermal convection, or thermal radiation. In the case of thermal conduction, the heating mechanism 124 may contact that portion of the film 106 to permit the conduction. In the case of convection or radiation, the heating mechanism 124 may be positioned in proximity⁷ to the portion of film 106 to permit the convection or the radiation. Optionally, in the case of convection or radiation heating, the position of the heating mechanism 124 may be fixed with respect to the main body 114 of the upper tool 1 10. In some embodiments the heating mechanism 124 can include electrical resistors that generate the heat to heat the portion of the film 106.

[0054] The apparatus 100 can be used to form a package around a product. Figs. 2 A to 2F depict instances of an embodiment of a method of the apparatus 100 forming a package around a product. Fig. 2A depicts a first instance of the method of the apparatus 100 forming a package around a product. In the first instance, the packaging assembly 102 is in the same operative condition shown in Fig. 1. In particular, the packaging assembly 102 is in a first operative condition in which the upper and lower tools 108 and 110 are retracted from each other so that the packaging assembly 102 is open. In the open position of the depicted embodiment, the lower portion of the seat 118 abuts a surface, the lower portion of the lifting mechanism 120 abuts the lower portion of the seat 118, and the bottom of the main body 112 abuts the lower portion of the lifting mechanism 120. In this arrangement, the upper portion of the seat 118 is at or above the top of the main body 112.

[0055] Fig. 2A also depicts a support 150 that has been positioned on the top of the seat 118 and a product 152 has been arranged on the support 150. In some embodiments, when the packaging assembly 102 is in the first operating position, the lower tool 108 is capable of receiving the support 150 with the product 152 thereon to the seat 118. For example, the support 150 with the product 152 thereon can be received from an infeed conveyor or any other conveyance mechanism. In the depicted embodiment, the support 150 is in the form of a tray with a base, sidewalls, and a rim extending from the sidewalls. In other embodiment, the support 150 can be flat (e g., a board), another form of a tray, or any other form of a support. The product 152 can be any type of product, such as a food product. [0056] Fig. 2B depicts a second instance of the method of the apparatus 100 forming a package around a product. From the first instance to the second instance, an upward force has been applied to the main body 112 of the lower tool 108. This upward force has lifted the main body 112 of the lower tool 108 until the main body 1 12 of the lower tool 108 has come into contact with the main body 114 of the upper tool 110. In this arrangement, the packaging assembly 102 is in a second operative condition in which the upper and lower tools 108 and 110 form a packaging chamber 126 in which the support 150 and the product 152 are located. The lifting of the main body 112 has also raised the lifting mechanism 120 so that the sides of the lifting mechanism 120 have come into contact with the bottom sides of the horizontal rims of the support 150. In this position, the sides of the lifting mechanism 120 can support the horizontal rims when any downward pressure is applied to the horizontal rims, such as during the sealing of the film 106 to the support 150 and the cutting of the film 106 described below.

[0057] In some embodiments, the packaging chamber 126 around the support 150 and the product 152 permits the product 152 to be packaged in a reduced pressure and oxygen environment to package the product 152 in a vacuum package or vacuum skin package. At the second instance shown in Fig. 2B, a vacuum can be drawn inside of the packaging chamber 126 to lower the pressure in the packaging chamber 126 below the pressure of the external environment and to reduce the oxygen content in the packaging chamber 126 below' the level of oxygen content in the external environment. In some embodiments, the packaging assembly 102 can continue to draw the vacuum in the packaging chamber 126 until the pressure inside of the packaging chamber 126 has reached a predetermined pressure.

[0058] In addition, from the first instance to the second instance a downward force has been applied to the heating mechanism 124 so that the heating mechanism 124 has moved downw ard into proximity with the film 106. The heating mechanism 124 can be activated to generate heat while the heating mechanism 124 is in proximity with the film 106 so that the heating mechanism 124 heats the portion of the film that is above the support 150 and the product 152. The packaging assembly 102 can hold the heating mechanism 124 in proximity with the film 106 for a time while the film 106 is heated. In some examples, the packaging assembly 102 can hold the heating mechanism 124 in proximity' with the film 106 for a predetermined amount of time. In other examples, the packaging assembly 102 can hold the heating mechanism 124 in proximity with the film 106 until the film 106 reached a predetermined temperature. In some embodiments, the packaging assembly 102 can further include a temperature sensor (e.g.. a temperature sensor inside of the main body 114 of the upper tool 1 10, a temperature sensor associated with the heating mechanism 124, etc.) which can provide a signal indicative of a temperature and the heating mechanism 124 can be controlled based on signals from the temperature sensor.

[0059] Fig. 2C depicts a third instance of the method of the apparatus 100 forming a package around a product. From the second instance to the third instance, the heating mechanism 124 has been lifted upward away from the film 106. In the depicted embodiment, the heating mechanism 124 has been lifted up until the heating mechanism 124 is in proximity with the top of the main body 114. In addition, from the second instance to the third instance, a force has been exerted on the lifting mechanism 120 to lift the lifting mechanism 120, which lifts the seat 118, the support 150, and the product 152 upward. In the depicted embodiment, the lifting mechanism 120 has been lifted until the lower portion of the lifting mechanism 120 has come in contact with the bottom of the main body 112.

[0060] In the depicted embodiment, the lifting of the lifting mechanism 120 has caused the product 152 to come into contact with the heated portion of the film 106. The product 152 has caused the film 106 to deflect from the earlier planar form. In particular, the film 106 has begun to conform to the contour of the product 152. The prior heating of the film 106 by the heating mechanism 124 greatly reduces the possibility that the conforming of the film 106 to the shape of the product 152 will rupture the film 106 or otherwise render the film 106 unsuitable for forming a vacuum package or vacuum skin package around the product 152. In the depicted embodiment, the support 150 has been lifted to the point that the horizontal rims of the support 150 are still below the original plane of the film 106. In other embodiments, the support 150 can be raised until the horizontal rims of the support 150 come into contact with the film 106.

[0061] Fig. 2D depicts a fourth instance of the method of the apparatus 100 forming a package around a product. From the third instance to the fourth instance, the upper portion of the packaging chamber 126 (i.e.. the portion of the packaging chamber 126 above the film 106) has been revented with gas (e.g.. air) at the pressure of the external environment. For example, the main body 114 of the upper tool 110 can have a valve that is opened to cause the reventing of the upper portion of the packaging chamber 126 with air at atmospheric pressure. In other examples, the packaging chamber 126 can be revented with pressurized gas. The reventing of the upper portion of the packaging chamber 126 has forced the fdm 106 downward around the product 152 and against portions of the support 150 around the product 152. In this way, the product 152 has been sealed between the film 106 and the support 150 in an environment that has a low amount of oxygen which can extend the life of the product 152. The prior heating of the film 106 by the heating mechanism 124 greatly reduces the possibility that the conforming of the film 106 to the shape of the product 152 and/or the shape of the support 150 will rupture the film 106 or otherwise render the film 106 unsuitable for forming a vacuum package or vacuum skin package around the product 152. In the case where the film 106 is a low-crosslinked film or a non-crosslinked film, it may be beneficial to revent the packaging chamber with compressed gas because low- and noncrosslinked films cannot be heated to as high of a temperature than high-crosslinked film, which could cause poor sealing, but the higher pressure of the reventing can increase the likelihood of proper sealing of the film 106 to the support 150.

[0062] Fig. 2E depicts a fifth instance of the method of the apparatus 100 forming a package around a product. From the fourth instance to the fifth instance, the cutting mechanism 122 has been activated to cut the film 106 on the sides of the support 150. The cutting by the cutting mechanism 122 separated the package 154 of the product 152 on the support 150 from the film 106. The cutting has also generated a piece of film scrap 107 from the film 106.

[0063] Fig. 2F depicts a sixth instance of the method of the apparatus 100 forming a package around a product. From the fifth instance to the sixth instance, the lower and upper tools 108 and 1 10 have been moved away from each other so that the packaging assembly 102 has been opened and has returned to the first operative condition shown in Fig. 2 A. The package 154 remains on the seat 118. With the lowering of the main body 112 and the lifting mechanism 120, the package 154 on the seat 118 is located above the main body 112. From the point shown in Fig. 2F, the packaging assembly 102 is in the first operating position and the lower tool 108 is capable of delivering the package 154 with the product 152 sealed therein. For example, the package 154 with the product 152 sealed therein can be deliver on an outfeed conveyor or any other conveyance mechanism. [0064] After the sixth instance shown in Fig. 2F, the package 154 can be delivered out of the packaging assembly 102 and the film scrap 107 can be removed from the packaging assembly. The film 106 can then be drawn from the position shown in Fig. 2F across the width of the upper tool 1 10 until the film is back into the position shown in Fig. 2 A. In some embodiments, the film scrap 107 is still connected to the film 106 (in areas not visible in Fig. 2F) which can be useful to advance the film 106 by pulling on the film scrap 107 before the next package is formed. After the film scrap 107 is pulled from the packaging assembly 102 and the film 106 has been advanced to span the width of the upper tool 110 for the forming of a new package, the film scrap 107 can be cut from the film 106, wound on a scrap rewinding apparatus, or otherwise removed from the operation of the packaging assembly 102. In addition, a new support with a product loaded thereon can be received by the packaging assembly 102. At that point, the entire process depicted in Figs. 2A-2F can be repeated to form another package.

[0065] The process described in Figs. 2A to 2F can be either partially or fully automated with the implementation of a controller. Fig. 3 depicts the apparatus 100 that further includes a controller 128 configured to control operation of elements of the apparatus 100. The apparatus 100 includes one or more actuators 130 configured to move one or both of the main body 112 of the lower tool 108 and the main body 114 of the upper tool 110 toward and away from each other. The apparatus 100 further includes one or more actuators 132 configured to move the lifting mechanism 120 w ith respect to the main body 112 of the low er tool 108. The apparatus 100 further includes one or more actuators 134 configured to move and/or activate the heating mechanism 124. The apparatus 100 further includes one or more actuators 136 configured to move the cutting mechanism 122 with respect to the main body 114 of the upper tool 110. The system further includes one or more actuators 138 configured to advance or retract the film 106 from the film supply assembly 104.

[0066] It will be understood that any of the actuators described herein can be any type of actuator. For example, any actuator configured to move an element may be an electrical actuator (e.g., a solenoid, an electric motor, etc.), a pneumatic actuator, a hydraulic actuator, or any other type of movement actuator. In other examples, an actuator configured to activate an element may include a powder regulation unit configured to control an amount of power supplied to an element (e.g., an amount of electrical current supplied to the heating mechanism 124) to activate or deactivate the element. Any other type of actuator can be used.

[0067] The controller can be configured to cause the method shown in Figs. 2A to 2F. For example, between the first and second instances, the controller 128 can cause the main body 112 of the lower tool 108 to move from the first operative position to the second operative position by sending a corresponding signal to one or more actuators 130. Similarly, the controller 128 can cause the heating mechanism 124 to move toward the film 106 and to activate by sending a corresponding signal to the one or more actuators 134. The controller 128 can be configured to cause all of the other movements and actions of the apparatus 100 described above with respect to Figs. 2A-2F by sending appropriate signals to each of the one or more actuators 130, 132, 134, 136, and/or 138.

[0068] Fig. 4 depicts an embodiment of an apparatus 200 for packaging a product arranged on a support. The apparatus 200 includes a packaging assembly 202 and a film supply assembly 204 that is configured to supply a film 206 to the packaging apparatus 202. In the depicted embodiment, the film supply assembly 204 includes a roll of the film 206. In some embodiments the film supply assembly 204 can include an unwind mechanism configured to unwind the film 206 from the roll.

[0069] The film 206 may be a packaging film. The film 206 can be applied to a support to form a lid on the support or a skin associated to the support. In some embodiments, the film 206 is flexible and capable of matching contours of a product and/or a support. The film 206 may be a single layer material or a flexible multilayer material that include at least a first outer heat-sealable layer, an optional inner gas barrier layer, and a second outer heat-resistant layer. The film 206 may also comprise other layers such as adhesive layers or bulk layers to increase a thickness of the film 206 and/or to improve its abuse properties. Any layer in the film 206 may contain additives. In some embodiments, any of the following additives may be added to any layer of the film 206: slip and anti-black agents, antioxidants, stabilizers, plasticizers, fillers, pigments, dyes, cross-linking inhibitors, cross-linking enhancers, UV absorbers, odor absorbers, oxygen scavengers, bactericides, antistatic agents, and the like. One or more layers of the film 206 may be cross-linked to improve the strength of the film and/or its heat resistance. However, it may be advantageous for the film 206 to be a low-crosslinked film or a non-crosslinked film (e.g., for the film 206 to be recyclable). [0070] The packaging assembly includes a lower tool 208 and an upper tool 210 configured to cooperate with each other. In particular, the lower tool 208 and the upper tool 210 are configured to cooperate with each other to define a packaging chamber around the product and the support. In some embodiments, the lower tool 208 includes a main body 212 and the upper tool 210 incudes a main body 214. When the main body 212 of the lower tool 208 and the main body 214 of the upper tool 210 are in contact with each other, the main bodies 212 and 214 form the packaging chamber. At least one of the lower and upper tools 208 and 210 is configured to move towards and away from the other. In some embodiments, both of the lower and upper tools 208 and 210 are configured to move towards and away from the other. In other words, the upper tool 210 may be movable towards and away from the lower tool 208 when the lower tool 208 is stationary, or the lower tool 208 may be movable towards and away from the upper tool 210 when the upper tool 210 is stationary, or both the lower and upper tools 208 and 210 may be movable towards and away from each other.

[0071] The packaging assembly 202 of the apparatus 200 is configured to receive the film 206 from the film supply assembly 204 and to couple the film 206 to a support. In the depicted embodiment, the film 206 is received by the upper tool 210. In particular, the film 206 passes beneath the main body 214 of the upper tool 210 so that the film 206 spans across a width of the main body 214 of the upper tool 210. In particular, the packaging assembly 202 receives the film 206 by the film 206 passing between the lower and upper tools 208 and 210. In the depicted embodiment, the film supply assembly 204 includes a feed roller 216 configured to feed the film 206 to the packaging assembly 202 at a consistent angle regardless of how much of the film 206 remains on the roll of the film 206. as indicated by the dashed line.

[0072] In the depicted embodiment, the lower tool 208 has a seat 218 arranged to receive a support with a product arranged thereon. In other embodiments, the lower tool 208 may have a plurality of seats, each of which is configured to receive a respective support with a product arranged thereon. In some embodiments, the lower tool 208 may be configured to receive the support with the product thereon to the seat 218 from an infeed conveyor or any other conveyance mechanism that supplies the support with the product thereon to the lower tool 208 of the apparatus 200. In the case that the lower tool 208 has multiple seats, the infeed conveyor or conveyance mechanism may be configured to supply multiple supports, each of which has a product thereon, to the multiple seats of the lower tool 208.

[0073] In the depicted embodiment, the lower tool 208 also has a lifting mechanism 220 arranged to lift the seat 218. A stem of the seat 218 passes through a stem of the lifting mechanism 220. An upper portion of the lifting mechanism 220 is located beneath an upper portion of the seat 218 and above a bottom of the main body 212 of the lower tool 208. A lower portion of the lifting mechanism 220 is located beneath a bottom of the main body 212 of the lower tool 208 and above a lower portion of the seat 218. The lower tool 208 further includes a base 240 located below the main body 212. In the depicted embodiment, the seat 218 and a lower portion of the lifting mechanism 220 pass through the base 240. Similarly, in the depicted embodiment, the base 240 is positioned on a surface and a lower portion of the seat 218 passes through the base 240 to so that the low er portion of the seat 217 is also in contact with the surface.

[0074] The seat 218 can move vertically with respect to each of the main body 212, the lifting mechanism 220, and the base 240 until any of the following contacts: the lower portion of the seat 218 contacts the surface, or a low er portion of the seat 218 contacts a lower portion of the lifting mechanism 220, or the upper portion of the seat 218 contacts the upper portion of the lifting mechanism 220. The lifting mechanism 220 can move vertically with respect to each of the main body 212, the seat 218, and the base 240 until any of the following contacts: the lower portion of the lifting mechanism 220 contacts the lower portion of the seat 218, a collar of the lifting mechanism 220 contacts either the bottom of the main body 212 or the base 240, the upper portion of the lifting mechanism 220 contacts the bottom of the main body 212, or the upper portion of the lifting mechanism 220 contacts the upper portion of the seat 218.

[0075] The base 240 includes a pusher 242 that extends upward through the main body 212. The pusher 242 is fixedly coupled to the base 240 and the pusher 242 is slidably movable with respect to the main body 212. As discussed in greater detail below, the pusher 242 can passively permit proper movements of elements in the upper tool 210.

[0076] In some embodiments, the low er tool 208 further includes a biasing mechanism 244 configured to bias the main body 212 away from the base 240. In the depicted embodiment, the biasing mechanism 244 is a compression spring. The biasing mechanism 244 is configured to bias the main body 212 away from the base 240 into the position shown in Fig. 4. Force can be applied to one or both of the main body 212 and the base 240 to overcome the biasing force of the biasing mechanism 244 and cause respective movement of the main body 212 and the base 240 toward each other.

[0077] The upper tool 210 includes a cutting mechanism 222 that is configured to cut the film 206. It will be apparent that, in other embodiments, the cutting mechanism 222 could be in the low er tool 208. In some embodiments, the cutting mechanism 222 may include a blade, a set of blades, a knife, a set of knifes, any other cutting mechanism, or any combination thereof. In the depicted embodiment, the cutting mechanism 222 is withdrawn from the film 206 and is capable of being moved selectively downward to contact the film 206 and cut the film 206. In the depicted embodiment, the upper tool 110 includes a base 246 and the cutting mechanism 222 is fixedly coupled to the base 246. The upper tool 210 further includes a biasing mechanism 248 configured to bias the main body 214 away from the base 246 to the position shown in Fig. 4. In the depicted embodiment, the biasing mechanism 244 is a compression spring. Force can be applied to one or both of the main body 214 and the base 246 to overcome the biasing force of the biasing mechanism 248 and cause respective movement of the main body 214 and the base 246 toward each other. Movement of the base 246 toward the main body 214 will cause the cutting mechanism 222 to move toward the film 206.

[0078] The upper tool 210 also includes a heating mechanism 224. The heating mechanism 224 is configured to move vertically with respect to the main body 214 of the upper tool 210. In particular, the heating mechanism 224 is biased down to the position shown in Fig. 4 bygravity and the heating mechanism 224 is configured to be selectively pushed upward within the main body 214. While the depicted embodiment shows the heating mechanism 224 biased downward by gravity, the heating mechanism 224 can, in other embodiments, be biased downward by a spring, a solenoid, or any other biasing mechanism. When the heating mechanism 224 is positioned near a portion of the film 206. the heating mechanism 224 can heat that portion of the film 206. For example, the heating mechanism 224 can heat that portion of the film 206 by thermal conduction, thermal convection, or thermal radiation. In the case of thermal conduction, the heating mechanism 224 may contact that portion of the film 206 to permit the conduction. In the case of convection or radiation, the heating mechanism 224 may be positioned in proximity to the portion of film 206 to permit the convention or the radiation. Optionally, in the case of convection or radiation heating, the position of the heating mechanism 224 may be fixed with respect to the main body 214 of the upper tool 210. In some embodiments the heating mechanism 224 can include electrical resistors that generate the heat to heat the portion of the film 206.

[0079] The apparatus 200 can be used to form a package around a product. Figs. 5 A to 5M depict instances of an embodiment of a method of the apparatus 200 forming a package around a product. Fig. 5A depicts a first instance of the method of the apparatus 200 forming a package around a product. In the first instance, the packaging assembly 202 is in the same operative condition shown in Fig. 4. In particular, the packaging assembly 202 is in a first operative condition in which the upper and lower tools 208 and 210 are retracted from each other so that the packaging assembly 202 is open. In the open position of the depicted embodiment, the base 240 is located on the surface, the lower portion of the seat 218 is in contact with the surface, the lower portion of the lifting mechanism 220 abuts the lower portion of the seat 218, and the bottom of the main body 212 rests on the collar of the lifting mechanism 220. In this arrangement, the upper portion of the seat 218 in proximity with the top of the main body 212.

[0080] Fig. 5 A also depicts a support 250 that has been positioned on the top of the seat 218 and a product 252 has been arranged on the support 250. In some embodiments, when the packaging assembly 202 is in the first operating position, the lower tool 208 is capable of receiving the support 250 with the product 252 thereon to the seat 218. For example, the support 250 with the product 252 thereon can be received from an infeed conveyor or any other conveyance mechanism. In the depicted embodiment, the support 250 is in the form of a tray with a base, sidewalls, and a rim extending from the sidewalls. In other embodiment, the support 250 can be flat (e.g., a board), another form of a tray, or any other form of a support. The product 252 can be any type of product, such as a food product.

[0081] Fig. 5B depicts a second instance of the method of the apparatus 200 forming a package around a product. From the first instance to the second instance, an upward force has been applied to the base 240 of the lower tool 208. The force on the base has caused the base 240 to be lifted off of the surface. In the depicted embodiment, the base 240 has been raised until the base 240 has come into contact with the collar of the lifting mechanism. The biasing mechanism 244 has maintained the respective distance of the base 240 and the main body 212 such that the lifting of the base 240 has also caused a lifting of the main body 212 of the lower tool 208. The lower portion of the seat 218 has remained in contact with the surface and the lower portion of the lifting mechanism 220 remains in contact with the lower portion of the seat 218.

[0082] Fig. 5C depicts a third instance of the method of the apparatus 200 forming a package around a product. From the second instance to the third instance, an upward force has been further applied to the base 240 of the lower tool 208 to further raise the base 240. The biasing mechanism 244 has maintained the respective distance of the base 240 and the main body 212 such that the lifting of the base 240 has also caused a lifting of the main body 212 of the lower tool 208. The interaction of the base 240 with the collar of the lifting mechanism 220 has also caused the lifting device 220 to be lifted such that that lower portion of the lifting device 220 is no longer in contact with the lower portion of the seat 218.

[0083] In the depicted embodiment, at the third instance the base 240 has been raised to the point that the lifting mechanism 220 is as high as possible with respect to the seat 218 while the seat 21 remains in contact with the surface. In the depicted embodiment, the upper portion of the lifting mechanism 220 in the third instance is in contact with the lower sides of the rims of the support 250. Between the second and third instances, the lower tool 208 has been brought closer to the upper tool 210, but the lower and upper tools 208 and 210 are not yet in a closed position.

[0084] Fig. 5D depicts a fourth instance of the method of the apparatus 200 forming a package around a product. From the third instance to the fourth instance, an upward force has been further applied to the base 240 of the lower tool 208 to further raise the base 240 and the rest of the lower tool 208. In particular, the lower portion of the seat 218 has been lifted off of the surface. Similarly, the upward force has lifted the lower tool 208 until the main body 212 of the lower tool 208 has come into contact with the main body 214 of the upper tool 210. In this arrangement, the packaging assembly 202 is in a second operative condition in which the upper and lower tools 208 and 210 form a packaging chamber 226 in which the support 250 and the product 252 are located. In some embodiments, the packaging chamber 226 around the support 250 and the product 252 permit the product 252 to be packaged in a reduced pressure and oxygen environment to package the product 252 in a vacuum package or vacuum skin package. In addition, the pusher 242 of the base 240 has been lifted until the top of the pusher 242 is positioned immediately below the heating mechanism 224. In some embodiments, the top of the pusher 242 is in contact with the heating mechanism 224 at the fourth instance shown in Fig. 2D.

[0085] During the first through fourth instances, the heating mechanism 224 has remained in proximity with the film 206. At any interval between the first and fourth instances, the heating mechanism 224 can be activated to generate heat. In some embodiments, the heating mechanism 224 can be kept active at any time that the packaging assembly 102 is operating, in which case the heating mechanism 224 would be active for the entirety of the first through fourth instances. The heat generated by the heating mechanism 224 heats the portion of the film 206 that is above the support 250 and the product 252. The temperature of the heating mechanism 224 and/or the amount of time that the heating mechanism 224 is activated while in proximity with the film 206 can be controlled to provide a desired heating of the film 206. In some embodiments, the packaging assembly 202 can further include a temperature sensor (e.g., a temperature sensor inside of the main body 214 of the upper tool 210, a temperature sensor associated with the heating mechanism 224, etc.) which can provide a signal indicative of a temperature and the heating mechanism 224 can be controlled based on signals from the temperature sensor.

[0086] Fig. 5E depicts a fifth instance of the method of the apparatus 200 forming a package around a product. From the fourth instance to the fifth instance, a vacuum has been drawn in the packaging chamber 226 to lower the pressure in the packaging chamber 226 below the pressure of the external environment and to reduce the oxygen content in the packaging chamber 226 below the level of oxygen content in the external environment. In some embodiments, the packaging assembly 202 can continue to draw the vacuum in the packaging chamber 226 until the pressure inside of the packaging chamber 226 has reached a predetermined pressure.

[0087] Fig. 5F depicts a sixth instance of the method of the apparatus 200 forming a package around a product. From the fifth instance to the sixth instance, the vacuum has continued to be drawn in the packaging chamber 226. An upward force has been applied to the base 240 while the upper tool 210 is held in place with respect to the lower tool 208. The upward force on the base 240 has overcome the force of the biasing mechanism 244 to cause the base 240 to move upward until the base 240 is in contact with the lower side of the main body 212. This respective movement of the base 240 and the main body 212 has resulted in the pusher 242 being inserted into the upper tool 210 and pushing the heating mechanism 224 upward wi th respect to the main body 214 of the upper tool 210. Similarly, due to the interaction of the collar of the lifting mechanism 220 and the base 240, the respective movement of the base 240 and the main body 212 has resulted in the seat 218, the support 250, and the product 252 being moved upward.

[0088] In the depicted embodiment, the lifting of the lifting mechanism 220 has caused the product 252 to come into contact with the heated portion of the film 206. The product 252 has caused the film 206 to deflect from the earlier planar form. In particular, the film 206 has begun to conform to the contour of the product 252. The prior heating of the film 206 by the heating mechanism 224 greatly reduces the possibility that the conforming of the film 206 to the shape of the product 252 will rupture the film 206 or otherwise render the film 206 unsuitable for forming a vacuum package or vacuum skin package around the product 252. In the depicted embodiment, the support 250 has been lifted to the point that the horizontal rims of the support 250 are in line with the original plane of the film 206. In particular, the support 250 has been raised until the horizontal rims of the support 250 have come into contact with the film 206.

[0089] In embodiments where the horizontal rims of the support 250 come into contact with the film 206, such as in the case of the sixth instance shown in Fig. 5F, a vacuum drawn in the lower tool 208 can be stopped during the reventing that occurs through the upper tool 210. Alternatively, the vacuum drawn in the lower tool 208 may continue during the reventing that occurs through the upper tool 210 without further removing air between the support 250 and the film 206. In some embodiments, the timing of stopping the vacuum drawn in the low er tool 208 may be selected in a range from the start of the reventing of the upper tool 210 to the time at which the film 206 is cut to form the package.

[0090] Fig. 5G depicts a seventh instance of the method of the apparatus 200 forming a package around a product. From the sixth instance to the seventh instance, the upper portion of the packaging chamber 226 (i.e., the portion of the packaging chamber 226 above the film 206) has been revented with gas (e.g.. air) at the pressure of the external environment. For example, the main body 214 of the upper tool 210 can have a valve that is opened to cause the reventing of the upper portion of the packaging chamber 226 with air at atmospheric pressure. In other examples, the packaging chamber 226 can be revented with pressurized gas. The reventing of the upper portion of the packaging chamber 226 has forced the fdm 206 downward around the product 252 and against portions of the support 250 around the product 252. In this way, the product 252 has been sealed between the film 206 and the support 250 in an environment that has a low amount of oxygen which can extend the life of the product 252. The prior heating of the film 206 by the heating mechanism 224 greatly reduces the possibility that the conforming of the film 206 to the shape of the product 252 and/or the shape of the support 250 will rupture the film 206 or otherwise render the film 206 unsuitable for forming a vacuum package or vacuum skin package around the product 252.

[0091] Fig. 5H depicts an eighth instance of the method of the apparatus 200 forming a package around a product. From the seventh instance to the eighth instance, a further upward force has been exerted on the base 240 of the lower tool 208 while the base 246 of the upper tool has been held in place. The further upward force on the base 240 has overcome the force of the biasing mechanism 248 to cause the main body 214 to move tow ard the base 246 . This respective movement of the base 246 and the main body 214 has resulted in the cutting mechanism 222 moving downward with respect to the main body 214 and the film 206 to cut the film 206 around the support 250. The cutting by the cutting mechanism 222 has separated the package 254 of the product 252 on the support 250 from the film 206. The cutting has also generated a piece of film scrap 207 from the film 206.

[0092] Fig. 51 depicts a ninth instance of the method of the apparatus 200 forming a package around a product. From the eighth instance to the ninth instance, the further upward force on the base 240 has stopped so that the force of the biasing mechanism 248 has pushed the main body 214 away from the base 246 back to the relative positions of the base 246 and the mam body 214 show n in Fig. 5 A to 5G. The relative movements of the base 246 with respect to the main body 214 has caused the cutting mechanism 222 to retract from the film 206.

[0093] Fig. 5 J depicts a tenth instance of the method of the apparatus 200 forming a package around a product. From the ninth instance to the tenth instance, the upward force on the base 240 has been reduced so that the force of the biasing mechanism 244 has lowered the base 240 with respect to the main body 212 back to the relative positions of the base 240 and the main body 212 show n in Fig. 5 A to 5E. The relative movements of the base 240 with respect to the main body 212 has caused the lifting mechanism 220, the seat 118, and the package 254 to be lowered to the point that the package is located entirely within the main body 212 of the lower tool 208.

[0094] Fig. 5K depicts an eleventh instance of the method of the apparatus 200 forming a package around a product. From the tenth instance to the eleventh instance, the upward force on the base 240 has been reduced to the point that the lower portion of the seat 218 is in contact with the surface. In addition, the packaging assembly 202 is no longer in the second operative condition because the lower tool 208 is no longer in contact with the upper tool 210.

[0095] Fig. 5L depicts a twelfth instance of the method of the apparatus 200 forming a package around a product. From the eleventh instance to the twelfth instance, the upward force on the base 240 has been reduced to the point that the lower portion of the lifting mechanism 220 is in contact w ith the low er portion of the seat 218. This movement of the lifting mechanism 220 and the main body 212 w ith respect to the seat 218 has also caused the package to begin emerging through the top of the main body 212.

[0096] Fig. 5M depicts a thirteenth instance of the method of the apparatus 200 forming a package around a product. From the twelfth instance to the thirteenth instance, the upward force on the base 240 has been reduced to the point that the base 240 is again in contact with the surface. This results in the low er and upper tools 208 and 210 having been moved aw ay from each other so that the packaging assembly 202 has been opened and has returned to the first operative condition shown in Fig. 5 A. The package 254 remains on the seat 218. With the low ering of the main body 212 and the lifting mechanism 220, the package 254 on the seat 218 is located above the main body 212. From the point shown in Fig. 5M, the packaging assembly 202 is in the first operating position, the lower tool 208 is capable of delivering the package 254 with the product 252 sealed therein. For example, the package 254 with the product 252 sealed therein can be deliver on an outfeed conveyor or any other conveyance mechanism.

[0097] After the thirteenth instance shown in Fig. 5M, the package 254 can be delivered out of the packaging assembly 202 and the film scrap 207 can be removed from the packaging assembly. The film 206 can then be drawn from the position shown in Fig. 5M across the width of the upper tool 210 until the film is back into the position shown in Fig. 5A. In some embodiments, the film scrap 207 is still connected to the film 206 (in areas not visible in Fig. 5M) which can be useful to advance the film 206 by pulling on the film scrap 207 before the next package is formed. After the film scrap 207 is pulled from the packaging assembly 202 and the film 206 has been advanced to span the width of the upper tool 21 for the forming of a new package, the film scrap 207 can be cut from the film 206, wound on a scrap rewinding apparatus, or otherwise removed from the operation of the packaging assembly 202. In addition, a new support with a product loaded thereon can be received by the packaging assembly 202. At that point, the entire process depicted in Figs. 5 A to 5M can be repeated to form another package.

[0098] The process described in Figs. 5A to 5M can be either partially or fully automated with the implementation of a controller. Fig. 6 depicts the apparatus 200 that further includes a controller 228 configured to control operation of elements of the apparatus 200. The apparatus 200 includes one or more actuators 230 configured to exert a force on the base 240 of the lower tool 208. The apparatus 200 further includes one or more actuators 232 configured to exert a force on the base 246 of the low er tool 208. The apparatus 200 further includes one or more actuators 234 configured to activate the heating mechanism 224. The system further includes one or more actuators 238 configured to advance or retract the film 206 from the film supply assembly 204.

[0099] It will be understood that any of the actuators described herein can be any type of actuator. For example, any actuator configured to move an element may be an electrical actuator (e.g., a solenoid, an electric motor, etc.), a pneumatic actuator, a hydraulic actuator, or any other type of movement actuator. In other examples, an actuator configured to activate an element may include a power regulation unit configured to control an amount of power supplied to an element (e.g., an amount of electrical current supplied to the heating mechanism 224) to activate or deactivate the element. Any other type of actuator can be used.

[0100] The controller can be configured to cause the method shown in Figs. 5A to 5M. For example, between the first and second instances, the controller 228 can cause the base 240 of the lower tool 208 to move upward by sending a corresponding signal to one or more actuators 230 to exert an upward force on the base 240. Similarly, the controller 228 can cause the heating mechanism 224 to activate and begin heating the film 206 by sending a corresponding signal to the one or more actuators 234 to supply power to a heating element in the heating mechanism 224. The controller 228 can be configured to cause all of the other movements and actions of the apparatus 200 described above with respect to Figs. 5A to 5M by sending appropriate signals to each of the one or more actuators 230, 232, 234, and/or 238.

[0101] Fig. 7 depicts an example embodiment of a system 310 that may be used to implement some or all of the embodiments described herein. In the depicted embodiment, the system 310 includes computing devices 320i, 3202, 320s, and 3204 (collectively computing devices 320). In the depicted embodiment, the computing device 320i is a tablet, the computing device 3202 is a mobile phone, the computing device 320s is a desktop computer, and the computing device 3204 is a laptop computer. In other embodiments, the computing devices 320 include one or more of a desktop computer, a mobile phone, a tablet, a phablet, a notebook computer, a laptop computer, a distributed system, a gaming console (e.g., Xbox, Play Station, Wii), a watch, a pair of glasses, a key fob, a radio frequency identification (RFID) tag, an ear piece, a scanner, a television, a dongle, a camera, a wristband, a wearable item, a kiosk, an input terminal, a server, a server network, a blade, a gateway, a switch, a processing device, a processing entity, a set-top box, a relay, a router, a network access point, a base station, any other device configured to perform the functions, operations, and/or processes described herein, or any combination thereof.

[0102] The computing devices 320 are communicatively coupled to each other via one or more networks 330 and 332. Each of the networks 330 and 332 may include one or more wired or wireless networks (e.g., a 3G network, the Internet, an internal network, a proprietary network, a secured network). The computing devices 320 are capable of communicating with each other and/or any other computing devices via one or more wired or wireless networks. While the particular system 310 in Fig. 7 depicts that the computing devices 320 communicatively coupled via the network 330 include four computing devices, any number of computing devices may be communicatively coupled via the netw ork 330.

[0103] In the depicted embodiment, the computing device 320s is communicatively coupled with a peripheral device 340 via the network 332. In the depicted embodiment, the peripheral device 340 is a scanner, such as a barcode scanner, an optical scanner, a computer vision device, and the like. In some embodiments, the network 332 is a wired network (e.g., a direct wired connection betw een the peripheral device 340 and the computing device 320?). a wireless network (e.g., a Bluetooth connection or a WiFi connection), or a combination of wired and wireless networks (e.g., a Bluetooth connection between the peripheral device 340 and a cradle of the peripheral device 340 and a wired connection between the peripheral device 340 and the computing device 320s). In some embodiments, the peripheral device 340 is itself a computing device (sometimes called a “smart” device). In other embodiments, the peripheral device 340 is not a computing device (sometimes called a “dumb” device).

[0104] Depicted in Fig. 8 is a block diagram of an embodiment of a computing device 400. Any of the computing devices 320 and/or any other computing device described herein may include some or all of the components and features of the computing device 400. In some embodiments, the computing device 400 is one or more of a desktop computer, a mobile phone, a tablet, a phablet, a notebook computer, a laptop computer, a distributed system, a gaming console (e.g., an Xbox, a Play Station, a Wii). a watch, a pair of glasses, a key fob, a radio frequency identification (RFID) tag. an ear piece, a scanner, a television, a dongle, a camera, a wristband, a wearable item, a kiosk, an input terminal, a server, a server network, a blade, a gateway, a switch, a processing device, a processing entity, a set-top box, a relay, a router, a network access point, a base station, any other device configured to perform the functions, operations, and/or processes described herein, or any combination thereof. Such functions, operations, and/or processes may include, for example, transmitting, receiving, operating on, processing, displaying, storing, determining, creating/generating, monitoring, evaluating, comparing, and/or similar terms used herein. In one embodiment, these functions, operations, and/or processes can be performed on data, content, information, and/or similar terms used herein.

[0105] In the depicted embodiment, the computing device 400 includes a processing element 405, memory 410, a user interface 415, and a communications interface 420. The processing element 405, memory 410, a user interface 415, and a communications interface 420 are capable of communicating via a communication bus 425 by reading data from and/or writing data to the communication bus 425. The computing device 400 may include other components that are capable of communicating via the communication bus 425. In other embodiments, the computing device does not include the communication bus 425 and the components of the computing device 400 are capable of communicating with each other in some other way. [0106] The processing element 405 (also referred to as one or more processors, processing circuitry, and/or similar terms used herein) is capable of performing operations on some external data source. For example, the processing element may perform operations on data in the memory 410, data receives via the user interface 415, and/or data received via the communications interface 420. As will be understood, the processing element 405 may be embodied in a number of different ways. In some embodiments, the processing element 405 includes one or more complex programmable logic devices (CPLDs). microprocessors, multicore processors, co processing entities, application-specific instruction-set processors (ASIPs), microcontrollers, controllers, integrated circuits, application specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), programmable logic arrays (PLAs), hardware accelerators, any other circuitry, or any combination thereof. The term circuitry may refer to an entirely hardware embodiment or a combination of hardware and computer program products. In some embodiments, the processing element 405 is configured for a particular use or configured to execute instructions stored in volatile or nonvolatile media or otherwise accessible to the processing element 405. As such, whether configured byhardware or computer program products, or by a combination thereof, the processing element 405 may be capable of performing steps or operations when configured accordingly.

[0107] The memory 410 in the computing device 400 is configured to store data, computerexecutable instructions, and/or any other information. In some embodiments, the memory 410 includes volatile memory' (also referred to as volatile storage, volatile media, volatile memory circuitry-, and the like), non-volatile memory (also referred to as non-volatile storage, non-volatile media, non-volatile memory circuitry, and the like), or some combination thereof.

[0108] In some embodiments, volatile memory includes one or more of random access memory (RAM), dynamic random access memory' (DRAM), static random access memory (SRAM), fast page mode dynamic random access memory' (FPM DRAM), extended data-out dynamic random access memory (EDO DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory- (DDR SDRAM), double data rate type two synchronous dynamic random access memory' (DDR2 SDRAM), double data rate type three synchronous dynamic random access memory (DDR3 SDRAM), Rambus dynamic random access memory- (RDRAM), Twin Transistor RAM (TTRAM), Thyristor RAM (T-RAM), Zero-capacitor (Z-RAM), Rambus in-line memory⁷ module (RIMM), dual in-line memory module (DIMM), single in-line memory module (SIMM), video random access memory (VRAM), cache memory (including various levels), flash memory, any other memory that requires power to store information, or any combination thereof.

[0109] In some embodiments, non-volatile memory includes one or more of hard disks, floppy disks, flexible disks, solid-state storage (SSS) (e.g., a solid state drive (SSD)), solid state cards (SSC), solid state modules (SSM), enterprise flash drives, magnetic tapes, any other non-transitory magnetic media, compact disc read only memory⁷ (CD ROM), compact disc-rewritable (CD-RW), digital versatile disc (DVD), Blu-ray disc (BD), any other non- transitory optical media, read-only memory (ROM), programmable read-only memory⁷ (PROM), erasable programmable read-only memory⁷ (EPROM), electrically erasable programmable read-only memory (EEPROM), flash memory (e.g., Serial, NAND, NOR, and/or the like), multimedia memory⁷ cards (MMC), secure digital (SD) memory cards, Memory Sticks, conductive-bridging random access memory (CBRAM), phase-change random access memory⁷ (PRAM), ferroelectric random-access memory (FeRAM), nonvolatile random access memory (NVRAM), magneto-resistive random access memory (MRAM), resistive random-access memory (RRAM). Silicon Oxide-Nitride-Oxide-Silicon memory (SONOS), floating junction gate random access memory⁷ (FJG RAM), Millipede memory⁷, racetrack memory⁷, any other memory⁷ that does not require poyver to store information, or any combination thereof.

[0110] In some embodiments, memory⁷ 410 is capable of storing one or more of databases, database instances, database management systems, data, applications, programs, program modules, scripts, source code, object code, byte code, compiled code, interpreted code, machine code, executable instructions, or any other information. The term database, database instance, database management system, and/or similar terms used herein may refer to a collection of records or data that is stored in a computer-readable storage medium using one or more database models, such as a hierarchical database model, network model, relational model, entity relationship model, object model, document model, semantic model, graph model, or any other model. [0111] The user interface 415 of the computing device 400 is in communication with one or more input or output devices that are capable of receiving inputs into and/or outputting any outputs from the computing device 400. Embodiments of input devices include a keyboard, a mouse, a touchscreen display, a touch sensitive pad, a motion input device, movement input device, an audio input, a pointing device input, a joystick input, a keypad input, peripheral device 340, foot switch, and the like. Embodiments of output devices include an audio output device, a video output, a display device, a motion output device, a movement output device, a printing device, and the like. In some embodiments, the user interface 415 includes hardware that is configured to communicate with one or more input devices and/or output devices via wired and/or wireless connections.

[0112] The communications interface 420 is capable of communicating with various computing devices and/or networks. In some embodiments, the communications interface 420 is capable of communicating data, content, and/or any other information, that can be transmitted, received, operated on, processed, displayed, stored, and the like. Communication via the communications interface 420 may be executed using a wired data transmission protocol, such as fiber distributed data interface (FDDI), digital subscriber line (DSL), Ethernet, asynchronous transfer mode (ATM), frame relay, data over cable service interface specification (DOCSIS), or any other wired transmission protocol. Similarly, communication via the communications interface 420 may be executed using a wireless data transmission protocol, such as general packet radio service (GPRS), Universal Mobile Telecommunications System (UMTS), Code Division Multiple Access 2000 (CDMA2000), CDMA2000 IX (IxRTT), Wideband Code Division Multiple Access (WCDMA), Global System for Mobile Communications (GSM), Enhanced Data rates for GSM Evolution (EDGE), Time Division-Synchronous Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), Evolved Universal Terrestrial Radio Access Network (E-UTRAN), Evolution-Data Optimized (EVDO). High Speed Packet Access (HSPA). High-Speed Downlink Packet Access (HSDPA), IEEE 802.11 (WiFi), WiFi Direct, 802.16 (WiMAX), ultra wideband (UWB), infrared (IR) protocols, near field communication (NFC) protocols, Wibree, Bluetooth protocols, wireless universal serial bus (USB) protocols, or any other wireless protocol. [0113] As will be appreciated by those skilled in the art, one or more components of the computing device 400 may be located remotely from other components of the computing device 400 components, such as in a distributed system. Furthermore, one or more of the components may be combined and additional components performing functions described herein may be included in the computing device 400. Thus, the computing device 400 can be adapted to accommodate a variety of needs and circumstances. The depicted and described architectures and descriptions are provided for exemplary purposes only and are not limiting to the various embodiments described herein.

[0114] Embodiments described herein may be implemented in various ways, including as computer program products that comprise articles of manufacture. A computer program product may include a non-transitory computer-readable storage medium storing applications, programs, program modules, scripts, source code, program code, object code, byte code, compiled code, interpreted code, machine code, executable instructions, and/or the like (also referred to herein as executable instructions, instructions for execution, computer program products, program code, and/or similar terms used herein interchangeably). Such non- transitory computer-readable storage media include all computer-readable media (including volatile and non-volatile media).

[0115] As should be appreciated, various embodiments of the embodiments described herein may also be implemented as methods, apparatus, systems, computing devices, and the like. As such, embodiments described herein may take the form of an apparatus, system, computing device, and the like executing instructions stored on a computer readable storage medium to perform certain steps or operations. Thus, embodiments described herein may be implemented entirely in hardware, entirely in a computer program product, or in an embodiment that comprises combination of computer program products and hardware performing certain steps or operations.

[0116] Embodiments described herein may be made with reference to block diagrams and flowchart illustrations. Thus, it should be understood that blocks of a block diagram and flowchart illustrations may be implemented in the form of a computer program product, in an entirely hardware embodiment, in a combination of hardware and computer program products, or in apparatus, systems, computing devices, and the like carrying out instructions, operations, or steps. Such instructions, operations, or steps may be stored on a computer readable storage medium for execution buy a processing element in a computing device. For example, retrieval, loading, and execution of code may be performed sequentially such that one instruction is retrieved, loaded, and executed at a time. In some exemplary embodiments, retrieval, loading, and/or execution may be performed in parallel such that multiple instructions are retrieved, loaded, and/or executed together. Thus, such embodiments can produce specifically configured machines performing the steps or operations specified in the block diagrams and flowchart illustrations. Accordingly, the block diagrams and flowchart illustrations support various combinations of embodiments for performing the specified instructions, operations, or steps.

[0117] For purposes of this disclosure, terminology such as “upper,” “lower,” “vertical,” “horizontal,” “inwardly,” “outwardly,” “inner,” “outer,” “front,” “rear,” and the like, should be construed as descriptive and not limiting the scope of the claimed subject matter. Further, the use of “including,” “comprising.” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless limited otherwise, the terms “connected,” “coupled,” and “mounted” and variations thereof herein are used broadly and encompass direct and indirect connections, couplings, and mountings. Unless stated otherwise, the terms “substantially,” “approximately,” and the like are used to mean within 5% of a target value.

[0118] The principles, representative embodiments, and modes of operation of the present disclosure have been described in the foregoing description. However, aspects of the present disclosure which are intended to be protected are not to be construed as limited to the particular embodiments disclosed. Further, the embodiments described herein are to be regarded as illustrative rather than restrictive. It will be appreciated that variations and changes may be made by others, and equivalents employed, without departing from the spirit of the present disclosure. Accordingly, it is expressly intended that all such variations, changes, and equivalents fall within the spirit and scope of the present disclosure, as claimed.

Claims

CLAIMS What is claimed is:

1 . An apparatus for packaging a product arranged on a support, the apparatus comprising: a film supply assembly configured to supply a film; and a packaging assembly configured to receive the film and to couple the film to the support, the packaging assembly comprising: a lower tool having a main body and a seat, wherein the packaging assembly is configured to receive the support with the product arranged thereon to the seat, an upper tool having a main body, a heating mechanism located within the main body of the upper tool and configured to heat a portion of the film that has been received by the packaging assembly, and a controller; wherein the packaging assembly is configured to operate in a first operative condition and in a second operative condition; w herein, in the first operative condition, the main body of the low er tool and main body of the upper tool are distanced from each other; wherein, in the second operative condition, the lower tool and the upper tool are closed to form a packaging chamber; wherein the controller is configured to: after the packaging assembly receives the support with the product arranged thereon, cause one or both of the low er and upper tool to move such that the packaging assembly transitions from the first operative condition to the second operative condition and the lower and upper tool form the packaging chamber w ith the support and product therein, cause a vacuum to be drawn in the packaging chamber, cause the seat to be raised so that the heated portion of the film is contacted by one or both of the product and the support, cause the packaging chamber to be revented so that a package is formed with the product sealed between the support and the film, and after the package is formed, cause one or both of the lower and upper tools to move such that the packaging assembly transitions from the second operative condition to the first operative condition to permit the package to be removed from the packaging assembly.

2. The apparatus of claim 1, wherein the packaging assembly is configured to receive the film such that the film passes beneath the main body of the upper tool and spans across a width of the main body of the upper tool.

3. The apparatus of claim 2, wherein the heating mechanism is movable vertically within the main body of the upper tool and wherein the heating mechanism is biased downward toward the film.

4. The apparatus of claim 3, wherein the heating mechanism is biased downward toward the film by gravity.

5. The apparatus of claim 3, wherein the lower tool further comprises: a base capable of relative movement with respect to the main body of the lower tool; and a biasing mechanism configured to bias the base away from the main body of the lower tool; wherein, when the packaging assembly is in the second operative condition, the controller is configured to cause a force to be applied to the base to overcome a force of the biasing mechanism such that the base moves toward the main body of the lower tool.

6. The apparatus of claim 5, wherein the lower tool further comprises a pusher fixedly coupled to the base, and wherein the movement of the base toward the main body causes the pusher to be inserted into the upper tool and push the heating mechanism away from the film.

7. The apparatus of claim 5, wherein the movement of the base toward the main body further causes the seat to be raised to cause one or both of the product and the support to contact the heated portion of the film.

8. The apparatus of claim 1, wherein the packaging assembly is configured to receive the film such that the film passes through two sides of the main body of the upper tool and spans across a width of the main body of the upper tool.

9. The apparatus of claim 8, wherein the heating mechanism is movable vertically within the main body of the upper tool, and wherein controller is configured to cause the heating mechanism to move downward toward the portion of the film before the portion of the film is heated.

10. The apparatus of claim 9, wherein the controller is further configured to cause the heating mechanism to move upward away from the portion of the film before the heated portion of the film is contacted by one or both of the product and the support

11. The apparatus of claim 1 , wherein the controller is configured to cause the heating mechanism to be activated to cause the heating of the portion of the film.

12. The apparatus of claim 11, wherein, during the heating of the portion of the film, the controller is configured to control one or more of a temperature of the heating mechanism or an amount of time that the heating mechanism is activated.

13. The apparatus of claim 11, wherein, during the heating of the portion of the film, the controller is configured to control the heating mechanism based on signals indicative of at least one of a temperature inside of the main body of the upper tool or a temperature of the heating mechanism.

14. The apparatus of claim 1, wherein the controller is configured to cause the packaging chamber to be revented through the main body of the upper tool so that the heated portion of the film is forced downward around the product and against portions of the support around the product.

15. The apparatus of claim 1, wherein the film is either a low-crosslinked film or a non-crosslinked film.

16. The apparatus of claim 1, wherein the upper tool further includes a cutting mechanism configured to cut the film around the support after the reventing of the packaging chamber to form the package.

17. The apparatus of claim 16, wherein the upper tool further includes: a base capable of relative movement with respect to the main body of the upper tool; and a biasing mechanism configured to bias the base away from the main body of the lower tool; wherein the cutting mechanism is fixedly coupled to the base.

18. The apparatus of claim 17, wherein, after the package has been formed, the controller is configured to cause a force to be applied to the lower tool to overcome a force of the biasing mechanism such that the main body of the upper tool moves toward the base and the cutting mechanism cuts the film.

19. A method of forming a package using an apparatus that includes a film supply assembly configured to supply a film and a packaging assembly configured to receive the film and to couple the film to a support, wherein the packaging assembly incudes a lower tool having a main body and a seat, an upper tool having a main body, and a heating mechanism located within the main body of the upper tool, wherein the method comprises: receiving, by the packaging assembly, the film from the film supply assembly; receiving, by the packaging assembly while the packaging assembly is in a first operative condition, a support with a product arranged thereon to the seat, wherein, when the packaging assembly is in the first operative condition, the main body of the lower tool and the main body of the upper tool are distanced from each other; heating, by the heating mechanism, a portion of the film that has been received by the packaging assembly; after the packaging assembly receives the support with the product arranged thereon, causing one or both of the lower and upper tool to move such that the packaging assembly transitions from the first operative condition to a second operative condition, wherein, when the packaging assembly is in the second operative condition, the lower tool and the upper tool are closed to form a packaging chamber; drawing a vacuum in the packaging chamber; raising the seat so that the heated portion of the film is contacted by one or both of the product and the support; reventing the packaging chamber so that a package is formed with the product sealed between the support and the film; and after the package is formed, moving one or both of the lower and upper tool such that the packaging assembly transitions from the second operative condition to the first operative condition to permit the package to be removed from the packaging assembly.

20. The method of claim 19, wherein the film is either a low-crosslinked film or a non-crosslinked film.

21. The method of claim 19, wherein reventing the packaging chamber comprises reventing the packaging chamber through the main body of the upper tool so that the heated portion of the film is forced downward around the product and against portions of the support around the product.

22. The method of claim 19. wherein the heating of the portion of the film occurs while the film is substantially flat.

23. The method of claim 22, wherein, when the product is on the support, the product protrudes above the support such that, when the seat is raised, the product makes initial contact with the heated portion of the film that is substantially flat, and wherein further raising of the seat after the initial contact causes the heated portion of the film to deflect so the heated portion of the film is no longer substantially flat.

24. The method of claim 19, wherein drawing the vacuum in the packaging chamber occurs while the heated portion of the film is substantially flat.