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WO2025206380A1 - Superabrasive grain vitrified grindstone having large diameter pores, manufacturing method therefor, and cup-type grindstone wheel - Google Patents

Superabrasive grain vitrified grindstone having large diameter pores, manufacturing method therefor, and cup-type grindstone wheel

Info

Publication number
WO2025206380A1
WO2025206380A1 PCT/JP2025/012989 JP2025012989W WO2025206380A1 WO 2025206380 A1 WO2025206380 A1 WO 2025206380A1 JP 2025012989 W JP2025012989 W JP 2025012989W WO 2025206380 A1 WO2025206380 A1 WO 2025206380A1
Authority
WO
WIPO (PCT)
Prior art keywords
superabrasive
grinding wheel
vitrified
pores
hollow granules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2025/012989
Other languages
French (fr)
Japanese (ja)
Inventor
紘史 大山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noritake Co Ltd
Original Assignee
Noritake Co Ltd
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Filing date
Publication date
Application filed by Noritake Co Ltd filed Critical Noritake Co Ltd
Publication of WO2025206380A1 publication Critical patent/WO2025206380A1/en
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/14Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
    • B24D3/18Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings for porous or cellular structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the superabrasive vitrified grinding wheels described in Patent Documents 1 and 2 use a resin pore-forming material to create large pores, and the large pores are formed by eliminating the resin pore-forming material during the firing process.
  • the resin pore-forming material has a smooth surface and a large difference in density from the abrasive grains and vitrified bond, which means that even when kneaded, the resin pore-forming material tends to become uneven, causing large pores to be distributed ubiquitously and making the wheels prone to cracking.
  • the superabrasive vitrified grinding wheel described in Patent Document 3 is manufactured by mixing superabrasive grains, vitrified bond, gelling agent, water, and surfactant to obtain a meringue-like foam material, then cooling the foam material in a molding die to create a molded body, which is then dried and baked, and then immersed in liquid resin to coat the bond bridge, which is the outer shell surrounding the pores, with a resin coating layer to increase its strength.
  • the molded body shrinks, making it difficult to produce products with a stable shape.
  • the superabrasive vitrified grinding wheel described in Patent Document 4 is obtained by placing a molded body with frozen particles formed inside it under vacuum, causing the frozen particles inside the molded body to sublimate, forming large pores in the areas after sublimation, and then firing the molded body.
  • a molded body with frozen particles formed inside it under vacuum
  • the frozen particles inside the molded body to sublimate, forming large pores in the areas after sublimation, and then firing the molded body.
  • drawbacks in that it is difficult to adjust the grinding wheel's formulation, and the pore size is likely to differ between the surface and interior of the grinding wheel.
  • Patent No. 5414706 JP 2017-1185575 A Patent No. 4769488 Patent No. 6737975
  • the gist of the second invention is that, in the first invention, the ratio of the shell thickness to the outer diameter of the hollow granule is 0.1 to 0.4.
  • the gist of the fourth invention is that, in the first or second invention, the superabrasive grains are 10 ⁇ m diameter or less, and the hollow granules have an outer shell with a thickness of 5 to 10 ⁇ m and an outer diameter of 10 to 100 ⁇ m.
  • the gist of the fifth invention is that the superabrasive vitrified grinding wheel with large pores of the first invention is a cup-shaped grinding wheel in which the large pore-containing superabrasive vitrified grinding wheel is fixed to the outer periphery of a metal base metal in a series at predetermined radial intervals.
  • the superabrasive grains contain hollow granules with an outer shell bound by a vitrified bond, and the inner cavities of these hollow granules form the large pores within the porous structure of the superabrasive vitrified grinding wheel.
  • the hollow granules are uniformly mixed in the mixed material with little uneven distribution, resulting in a superabrasive vitrified grinding wheel with large pores that is less likely to crack, can be manufactured stably, and has no bias in pore size, allowing for easy wheel blend adjustment.
  • the ratio of the shell thickness to the outer diameter of the hollow granules is 0.1 to 0.4. This ensures that the hollow structure of the hollow granules is maintained appropriately during press molding. If the ratio of the shell thickness to the outer diameter of the hollow granules is less than 0.1, the strength of the hollow granules decreases and the hollow structure is destroyed. If the ratio of the shell thickness to the outer diameter of the hollow granules exceeds 0.4, the hollow structure deforms during the spray drying process, resulting in the formation of defective granules with no internal cavity, making it difficult to obtain a superabrasive vitrified grinding wheel with large pores within its porous structure.
  • the porous structure contains pores with an average pore diameter of 5 to 60 ⁇ m. This results in a superabrasive vitrified grinding wheel with large pores that has high grinding performance.
  • the superabrasive grains are 10 ⁇ m diameter or less, and the hollow granules have an outer shell 5 to 10 ⁇ m thick and an outer diameter of 10 to 100 ⁇ m. This results in a superabrasive vitrified grinding wheel with large pores that is less prone to cracking, can be manufactured stably, has no bias in pore diameter, and can be easily adjusted for grinding wheel blending.
  • the superabrasive vitrified grinding wheels with large pores of the first invention are fixed in a row at predetermined intervals in the radial direction to the outer periphery of the metal base, allowing for the effective use of expensive superabrasive grains.
  • the sixth invention of the method for producing a superabrasive vitrified grinding wheel with large pores includes a slurry preparation process in which a slurry containing superabrasive grains, a vitrified bond, and a binder is prepared; a spray-drying granulation process in which the slurry is sprayed in a dryer and dried in air to produce hollow granules from the slurry droplets; a molding process in which the hollow granules are press-molded in a mold to produce a green body; and a firing process in which the green body is fired to produce a superabrasive vitrified grinding wheel with large pores within a porous structure in which the superabrasive grains are bonded by the vitrified bond.
  • the spray-drying granulation process allows for the preferable production of hollow granules from the slurry droplets by spraying a slurry containing superabrasive grains, a vitrified bond, and a binder in a dryer and drying it in air. Hollow granules produced in this manner have a relatively uniform particle size and a sharp particle size distribution, resulting in less variation and bias in the pores within the grinding wheel and less cracking.
  • FIG. 1 is a perspective view showing a cup-shaped grinding wheel equipped with a superabrasive vitrified grinding stone having large-diameter pores according to an embodiment of the present invention.
  • 2 is an optical microscope photograph showing an enlarged view of the surface of the superabrasive vitrified grinding wheel having large pores shown in FIG. 1.
  • 3 is an SEM photograph showing an enlarged view of hollow granules contained in a vitrified bond in the superabrasive vitrified grinding wheel of FIG. 2.
  • FIG. 2 is a diagram illustrating a method for measuring the shell thickness and outer diameter of hollow granules.
  • 2 is a process diagram illustrating a manufacturing process of the superabrasive vitrified grinding wheel having large pores shown in FIG. 1.
  • FIG. 1 is a perspective view showing a cup-shaped grinding wheel equipped with a superabrasive vitrified grinding stone having large-diameter pores according to an embodiment of the present invention.
  • 2 is an optical microscope photograph showing an enlarged view of the surface of the supera
  • FIG. 6 is a diagram illustrating the mechanism of formation of hollow granules in the spray-drying granulation process of FIG. 5.
  • FIG. 1 is a process diagram illustrating a method for manufacturing a superabrasive vitrified grinding wheel that does not use hollow granules.
  • 1 is a table showing mixing amounts and grinding test results in grinding test 1.
  • 10 is a table showing mixing amounts and grinding test results in grinding test 2.
  • FIG. 1 is a perspective view showing a cup-shaped grinding wheel 10 according to one embodiment of the present invention.
  • the cup-shaped grinding wheel 10 comprises a disk-shaped base metal 12 made of metal, for example, aluminum, and a plurality of segment grinding stones 14 fixedly attached at predetermined intervals in a ring-like arrangement along the outer periphery of the underside of the base metal 12.
  • Each segment grinding stone 14 has a grinding surface 16 that is continuous in a ring-like arrangement along the outer periphery of the underside of the base metal 12.
  • the base metal 12 is a disk made of metal, and is attached to the main shaft of a grinding device (not shown), which rotates the cup-shaped grinding wheel 10.
  • the cup-shaped grinding wheel 10 has an outer diameter of, for example, about 250 mm
  • the segment grinding wheel 14 is an arc-shaped plate with a thickness of, for example, about 3 mm.
  • the grinding surface 16 of the segment grinding wheel 14 slides against the workpiece, such as a semiconductor wafer such as SiC, grinding or polishing the workpiece into a flat surface.
  • the segmented grinding wheel 14 corresponds to the superabrasive vitrified grinding wheel having large-diameter pores 22 of the present invention.
  • the segmented grinding wheel 14 is composed of a porous structure including superabrasive grains, such as diamond abrasive grains 18, hollow granules 20, a vitrified bond that bonds the diamond abrasive grains 18 and hollow granules 20, and pores 24 containing the large-diameter pores 22.
  • the inner cavities of the hollow granules 20 form the large-diameter pores 22.
  • the composition of the segmented grinding wheel 14 is, for example, 19-26 vol% diamond abrasive grains 18, 9-12 vol% vitrified bond, and 60-72 vol% pores 24.
  • the average pore diameter of all pores 24, including the large pores 22 in the porous structure that makes up the segment grinding wheel 14, is, for example, 5 to 60 ⁇ m, and preferably 8 to 51 ⁇ m, as the average value when the maximum diameter of the pores 24 is measured at 30 or more consecutive points using image measurement under a microscope.
  • the particle size of the diamond abrasive grains 18 can be selected depending on the required surface roughness, but is, for example, 10 ⁇ m or less, preferably an average particle size of 0.6 ⁇ m.
  • the vitrified bond is made of well-known borosilicate glass or borosilicate zinc glass.
  • the glass composition is, for example, 10 to 60 wt% SiO 2 , 10 to 30 wt% B 2 O 3 , 0 to 65 wt% ZnO, 0 to 10 wt% RO, and 0 to 10 wt% R 2 O.
  • the hollow granules 20 are composed of diamond abrasive grains 18, a vitrified bond that bonds the diamond abrasive grains 18, a spherical outer shell 26 made up of a porous structure including pores 24, and large pores 22 that are internal cavities surrounded by the outer shell 26. It is preferable that the hollow granules 20 have an outer diameter D of 10 to 100 ⁇ m. If the outer diameter D is less than 10 ⁇ m, there will be more solid granules, and if it exceeds 100 ⁇ m, defects such as depressions will be more likely to occur.
  • the outer diameter D of the hollow granules 20 and the thickness T of the outer shell 26 are measured as shown in Figure 4.
  • the segment grinding wheel 14 is ground using a fixed abrasive polishing pad to expose the internal surface, and the exposed surface is observed using an optical microscope or SEM.
  • the hollow granules 20 are extracted from the observed image, and their outer diameter D and thickness T of the outer shell 26 are measured using the image. These measurements are then taken for 30 hollow granules 20 in the image, and the average values are calculated.
  • the thickness T of the outer shell 26 of the hollow granules 20 is, for example, 5 to 10 ⁇ m, preferably 8.2 to 9.6 ⁇ m
  • the outer diameter D of the hollow granules 20 is, for example, 10 to 100 ⁇ m, preferably 22 to 82 ⁇ m
  • the ratio T/D of the thickness T of the outer shell 26 of the hollow granules 20 to the outer diameter D of the hollow granules 20 is, for example, 0.1 to 0.4, preferably 0.1 to 0.37.
  • the hollow granules 20 obtained in the spray-drying granulation step P2 are filled into a press die and pressed at a molding pressure of, for example, 100 to 400 kgf/cm 2 .
  • the segmented grinding wheel (superabrasive vitrified grinding wheel with large pores) 14 of this embodiment includes hollow granules 20 with an outer shell 26 in which diamond abrasive grains (superabrasive grains) 18 are bonded with a vitrified bond, and the inner cavity of these hollow granules 20 forms large pores 22 within the porous structure of the segmented grinding wheel 14.
  • the hollow granules 20 are uniformly mixed in the mixed material with little uneven distribution, resulting in a segmented grinding wheel 14 that is less likely to crack, can be manufactured stably, and has no bias in pore size, allowing for easy grinding wheel blend adjustment.
  • the diamond abrasive grains 18 are 10 ⁇ m diameter or less, and the hollow granules 20 have an outer shell 26 with a thickness T of 5 to 10 ⁇ m, preferably 8.2 to 9.6 ⁇ m, and an outer diameter D of 10 to 100 ⁇ m, preferably 22 to 82 ⁇ m.
  • the cup-shaped grinding wheel 10 is constructed by fastening the segment grinding stones 14 to the outer periphery of the metal base metal 12 in a row at predetermined intervals in the radial direction. This allows the expensive diamond abrasive grains 18 to be used effectively.
  • the manufacturing method for the segmented grinding wheel 14 of this embodiment includes a slurry preparation process P1 in which a slurry containing diamond abrasive grains 18, a vitrified bond, and a binder is prepared; a spray-dry granulation process P2 in which the slurry is sprayed in a dryer and dried in air to obtain hollow granules 20 from the slurry droplets; a molding process P3 in which the hollow granules 20 are press-molded in a mold to obtain a green body; and a firing process P4 in which the green body is fired to obtain the segmented grinding wheel 14 in a porous structure in which the diamond abrasive grains 18 are bonded by the vitrified bond.
  • a slurry containing diamond abrasive grains 18, a vitrified bond, and a binder is sprayed in a dryer and dried in air, thereby enabling the hollow granules 20 to be suitably obtained from the slurry droplets.
  • the hollow granules 20 granulated in this manner have a relatively uniform particle size and a sharp particle size distribution, which reduces the variation and bias of the pores 24 within the segment grinding wheel 14 and makes cracks less likely to occur.
  • diamond abrasive grains 18 were used, but other superabrasive grains, such as CBN abrasive grains, may also be used.
  • a cup-shaped grinding wheel 10 was used in which multiple segment grinding stones 14 formed into thick, arc-shaped plates were fixed to the outer periphery of the base metal 12, but the segment grinding stones 14 may also be grinding stones of other shapes. For example, they may be cup-shaped or disc-shaped vitrified grinding wheels having a predetermined thickness.
  • the segment grinding wheel 14 may have a two-layer structure in which the surface layer is made of a super-abrasive vitrified grinding wheel containing diamond abrasive grains 18, and the lower layer is made of aggregate (general abrasive grains or inorganic powder) bonded with a vitrified bond.
  • Cup-shaped grinding wheel 12 Base metal 14: Segment grinding wheel (super abrasive vitrified grinding wheel with large pores) 18: Diamond abrasive grains (super abrasive grains) 20: Hollow granule 22: Large diameter pore 24: Pore 26: Outer shell T: Thickness (thickness of outer shell) D: Outer diameter (outer diameter of hollow granules)

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

Provided is a superabrasive grain vitrified grindstone having large diameter pores with which grindstone preparation adjustment can be performed easily because cracks do not readily form, stable manufacturing is possible, and there is no uneven distribution of pore diameters. This segment grindstone (superabrasive grain vitrified grindstone having large diameter pores) 14 includes hollow granulated bodies 20 having outer shells 26 to which diamond abrasive grains (superabrasive grains) 18 are bonded by a vitrified bond, wherein the inner cavities of the hollow granulated bodies 20 form large diameter pores 22 in a multi-pore structure of the segment grindstone 14. As a result, the hollow granulated bodies 20 are uniformly mixed with little unevenness in a kneading material to be used for molding, and thus a segment grindstone 14 is obtained in which grindstone preparation adjustment can be performed easily because cracks do not readily form, stable manufacturing is possible, and there is no uneven distribution of pore diameters.

Description

大径気孔を有する超砥粒ビトリファイド砥石、その製造方法、及びカップ型砥石ホイールSuperabrasive vitrified grinding wheel with large pores, its manufacturing method, and cup-type grinding wheel

 本発明は、ビトリファイドボンドを用いて超砥粒を結合した大径気孔を有する超砥粒ビトリファイド砥石、その製造方法、及びカップ型砥石ホイールに関するものである。 The present invention relates to a superabrasive vitrified grinding wheel with large pores, in which superabrasive grains are bonded using a vitrified bond, a method for manufacturing the same, and a cup-shaped grinding wheel.

 一般に、SiC等の半導体を平面研削するに際しては、ダイヤモンド等の超砥粒をビトリファイドボンドを用いて結合して砥粒保持力を高め、砥粒の切れ刃自生作用を好適に発生させるために大径気孔を含む多気孔の超砥粒ビトリファイド砥石が提案されている。このような超砥粒ビトリファイド砥石は、砥石強度を確保することができるので充分な研削圧力で研削することができ、研削性能が得られる。例えば、特許文献1、特許文献2、特許文献3、特許文献4に記載された超砥粒ビトリファイド砥石がそれである。 Generally, when surface grinding semiconductors such as SiC, superabrasive grains such as diamond are bonded using a vitrified bond to increase grain retention and favorably generate self-sharpening cutting edges. This type of superabrasive grain vitrified grinding wheel is proposed, with many large pores included. Because such superabrasive grain vitrified grinding wheels ensure sufficient grinding strength, they can be used for grinding with sufficient grinding pressure, resulting in good grinding performance. Examples of such superabrasive grain vitrified grinding wheels are those described in Patent Documents 1, 2, 3, and 4.

 特許文献1、特許文献2に記載されている超砥粒ビトリファイド砥石は、大径気孔を形成するための樹脂製気孔形成材を用い、焼成過程で樹脂製気孔形成材を消失させることで、大径気孔が形成されている。しかし、樹脂製気孔形成材は表面が滑らかで砥粒やビトリファイドボンドとの密度差が大きく、混練しても樹脂製気孔形成材の偏りが発生して大径気孔が遍在し易く、クラックが生じやすいという欠点があった。 The superabrasive vitrified grinding wheels described in Patent Documents 1 and 2 use a resin pore-forming material to create large pores, and the large pores are formed by eliminating the resin pore-forming material during the firing process. However, the resin pore-forming material has a smooth surface and a large difference in density from the abrasive grains and vitrified bond, which means that even when kneaded, the resin pore-forming material tends to become uneven, causing large pores to be distributed ubiquitously and making the wheels prone to cracking.

 特許文献3に記載されている超砥粒ビトリファイド砥石は、超砥粒、ビトリファイドボンド、ゲル化剤、水及び界面活性剤を混合してメレンゲ状の発泡材料を得た後、その発泡材料を成形金型内で冷却して成形体を作成し、その後に乾燥した成形体を焼成し、さらに液状樹脂に浸漬して気孔を囲む外殻であるボンドブリッジに樹脂被覆層をコーティングして強度を高めることで、製造されている。しかし、このような製造方法を用いて超砥粒ビトリファイド砥石を製造するとき、成形体が収縮して安定した形状の製品を製造することが困難であった。 The superabrasive vitrified grinding wheel described in Patent Document 3 is manufactured by mixing superabrasive grains, vitrified bond, gelling agent, water, and surfactant to obtain a meringue-like foam material, then cooling the foam material in a molding die to create a molded body, which is then dried and baked, and then immersed in liquid resin to coat the bond bridge, which is the outer shell surrounding the pores, with a resin coating layer to increase its strength. However, when manufacturing superabrasive vitrified grinding wheels using this manufacturing method, the molded body shrinks, making it difficult to produce products with a stable shape.

 特許文献4に記載されている超砥粒ビトリファイド砥石は、氷結粒子が内部に形成された成形体が真空下におかれることで、成形体内の氷結粒子が昇華させられ、その昇華後の部位に大径気孔が形成され、この成形体が焼成されることで得られる。しかし、砥石の調合変更の調整が難しく、気孔径が砥石の表層と内部との間で差が生じやすいという欠点があった。 The superabrasive vitrified grinding wheel described in Patent Document 4 is obtained by placing a molded body with frozen particles formed inside it under vacuum, causing the frozen particles inside the molded body to sublimate, forming large pores in the areas after sublimation, and then firing the molded body. However, there are drawbacks in that it is difficult to adjust the grinding wheel's formulation, and the pore size is likely to differ between the surface and interior of the grinding wheel.

特許第5414706号公報Patent No. 5414706 特開2017-1185575号公報JP 2017-1185575 A 特許第4769488号公報Patent No. 4769488 特許第6737975号公報Patent No. 6737975

 本発明は以上の事情を背景として為されたものであり、その目的とするところは、クラックが生じ難く、安定製造が可能で、気孔径に偏りがなく容易に砥石調合調整が可能な大径気孔を有する超砥粒ビトリファイド砥石を提供することにある。 The present invention was made against the backdrop of the above circumstances, and its purpose is to provide a superabrasive vitrified grinding wheel that is less susceptible to cracking, can be manufactured stably, and has large pores with no bias in pore size, allowing for easy wheel blend adjustment.

 本発明者等は、上記事情を背景として種々検討を重ねた結果、超砥粒、ビトリファイドボンド、バインダー等を含むスラリーをスプレードライヤー内で噴霧して空中で乾燥させることで、密に集合した中空の造粒体が安定して得られることを見出した。そして、分級した中空造粒体をプレス成形し、焼成すると、クラックが生じ難く、安定製造が可能で、気孔径に偏りがなく容易に砥石調合調整が可能な大径気孔を有する超砥粒ビトリファイド砥石が得られることを見出した。本発明は、このような知見に基づいて為されたものである。 As a result of extensive research conducted against the background of the above circumstances, the inventors discovered that densely packed hollow granules can be reliably obtained by spraying a slurry containing superabrasive grains, vitrified bond, binder, etc. in a spray dryer and drying it in air. They then discovered that by press-molding the classified hollow granules and sintering them, a superabrasive vitrified grinding wheel with large pores that is less likely to crack, can be manufactured stably, and has no bias in pore size, allowing for easy wheel blend adjustment. The present invention was made based on these findings.

 すなわち、第1発明の要旨とするところは、(a)超砥粒がビトリファイドボンドにより結合された多気孔組織内に大径気孔を有する超砥粒ビトリファイド砥石であって、(b)前記超砥粒が前記ビトリファイドボンドで結合された外殻を有する中空造粒体を含み、前記中空造粒体の内腔が前記大径気孔を形成していることにある。 In other words, the gist of the first invention is (a) a superabrasive vitrified grinding wheel in which superabrasive grains are bonded together with a vitrified bond and have large-diameter pores within a porous structure, and (b) the superabrasive grains include hollow granules having an outer shell bonded together with the vitrified bond, and the inner cavity of the hollow granules forms the large-diameter pores.

 第2発明の要旨とするところは、第1発明において、前記中空造粒体は、前記外殻の厚みと前記中空造粒体の外径との比の値が、0.1~0.4であることにある。 The gist of the second invention is that, in the first invention, the ratio of the shell thickness to the outer diameter of the hollow granule is 0.1 to 0.4.

 第3発明の要旨とするところは、第1発明において、前記多気孔組織は、平均気孔径が5~60μmの気孔を含むことにある。 The gist of the third invention is that, in the first invention, the porous structure contains pores with an average pore diameter of 5 to 60 μm.

 第4発明の要旨とするところは、第1発明又は第2発明において、前記超砥粒は10μmφ以下であり、前記中空造粒体は、5~10μmの厚みの前記外殻と、10~100μmの外径とを有することにある。 The gist of the fourth invention is that, in the first or second invention, the superabrasive grains are 10 μm diameter or less, and the hollow granules have an outer shell with a thickness of 5 to 10 μm and an outer diameter of 10 to 100 μm.

 第5発明の要旨とするところは、第1発明の大径気孔を有する超砥粒ビトリファイド砥石が、金属製の台金の外周部に、径方向に所定間隔で連ねて固着されたカップ型砥石ホイールであることにある。 The gist of the fifth invention is that the superabrasive vitrified grinding wheel with large pores of the first invention is a cup-shaped grinding wheel in which the large pore-containing superabrasive vitrified grinding wheel is fixed to the outer periphery of a metal base metal in a series at predetermined radial intervals.

 第6発明の要旨とするところは、超砥粒がビトリファイドボンドにより結合された多気孔組織内に大径気孔を有する超砥粒ビトリファイド砥石の製造方法であって、前記超砥粒、前記ビトリファイドボンド、及びバインダーを含むスラリーを調整するスラリー調整工程と、前記スラリーを乾燥機内で噴霧して空中で乾燥させることで前記スラリーの液滴から中空造粒体を得るスプレードライ造粒工程と、前記スプレードライ造粒工程で得られた前記中空造粒体を金型内でプレス成形して成形体を得る成形工程と、前記成形体を焼成することで、前記超砥粒が前記ビトリファイドボンドにより結合された前記多気孔組織内に前記大径気孔を有する超砥粒ビトリファイド砥石を得る焼成工程と、を含むことにある。 The gist of the sixth invention is a method for manufacturing a superabrasive vitrified grinding wheel in which superabrasive grains are bonded together with a vitrified bond and the superabrasive grains have large pores within their porous structure, and the method includes: a slurry preparation step for preparing a slurry containing the superabrasive grains, the vitrified bond, and a binder; a spray-dry granulation step for spraying the slurry in a dryer and drying it in air to obtain hollow granules from the slurry droplets; a molding step for press-molding the hollow granules obtained in the spray-dry granulation step in a mold to obtain a green body; and a firing step for firing the green body to obtain a superabrasive vitrified grinding wheel in which the superabrasive grains are bonded together with the vitrified bond and the superabrasive grains have large pores within their porous structure.

 第1発明の大径気孔を有する超砥粒ビトリファイド砥石によれば、超砥粒がビトリファイドボンドで結合された外殻を有する中空造粒体を含み、その中空造粒体の内腔が超砥粒ビトリファイド砥石の多気孔組織内の大径気孔を形成している。これにより、混練材料中において中空造粒体の遍在が少なく均一に混在するので、クラックが生じ難く、安定製造が可能で、気孔径に偏りがなく容易に砥石調合調整が可能な大径気孔を有する超砥粒ビトリファイド砥石が得られる。 In the superabrasive vitrified grinding wheel with large pores of the first invention, the superabrasive grains contain hollow granules with an outer shell bound by a vitrified bond, and the inner cavities of these hollow granules form the large pores within the porous structure of the superabrasive vitrified grinding wheel. As a result, the hollow granules are uniformly mixed in the mixed material with little uneven distribution, resulting in a superabrasive vitrified grinding wheel with large pores that is less likely to crack, can be manufactured stably, and has no bias in pore size, allowing for easy wheel blend adjustment.

 第2発明の大径気孔を有する超砥粒ビトリファイド砥石によれば、中空造粒体は、外殻の厚みと中空造粒体の外径との比の値が、0.1~0.4である。これにより、プレス成形時において中空造粒体の中空構造が好適に維持される。外殻の厚みと中空造粒体の外径との比の値が0.1未満であると、中空造粒体の強度が低下して中空構造が破壊される。外殻の厚みと中空造粒体の外径との比の値が0.4を超えると、スプレードライ過程で中空構造が変形して内腔が形成されない欠陥造粒体が形成されて、多気孔組織内に大径気孔を有する超砥粒ビトリファイド砥石が得られ難くなる。 In the superabrasive vitrified grinding wheel with large pores of the second invention, the ratio of the shell thickness to the outer diameter of the hollow granules is 0.1 to 0.4. This ensures that the hollow structure of the hollow granules is maintained appropriately during press molding. If the ratio of the shell thickness to the outer diameter of the hollow granules is less than 0.1, the strength of the hollow granules decreases and the hollow structure is destroyed. If the ratio of the shell thickness to the outer diameter of the hollow granules exceeds 0.4, the hollow structure deforms during the spray drying process, resulting in the formation of defective granules with no internal cavity, making it difficult to obtain a superabrasive vitrified grinding wheel with large pores within its porous structure.

 第3発明の大径気孔を有する超砥粒ビトリファイド砥石によれば、多気孔組織は、平均気孔径が5~60μmの気孔を含む。これにより、研削性能の高い大径気孔を有する超砥粒ビトリファイド砥石が得られる。 In the superabrasive vitrified grinding wheel with large pores of the third invention, the porous structure contains pores with an average pore diameter of 5 to 60 μm. This results in a superabrasive vitrified grinding wheel with large pores that has high grinding performance.

 第4発明の大径気孔を有する超砥粒ビトリファイド砥石によれば、超砥粒は10μmφ以下であり、中空造粒体は、5~10μmの厚みの外殻と、10~100μmの外径とを有する。これにより、クラックが生じ難く、安定製造が可能で、気孔径に偏りがなく容易に砥石調合調整が可能な大径気孔を有する超砥粒ビトリファイド砥石が得られる。 In the superabrasive vitrified grinding wheel with large pores of the fourth invention, the superabrasive grains are 10 μm diameter or less, and the hollow granules have an outer shell 5 to 10 μm thick and an outer diameter of 10 to 100 μm. This results in a superabrasive vitrified grinding wheel with large pores that is less prone to cracking, can be manufactured stably, has no bias in pore diameter, and can be easily adjusted for grinding wheel blending.

 第5発明のカップ型砥石ホイールによれば、第1発明の大径気孔を有する超砥粒ビトリファイド砥石が、金属製の台金の外周部に、径方向に所定間隔で連ねて固着されているので、高価な超砥粒を有効に用いることができる。 In the cup-shaped grinding wheel of the fifth invention, the superabrasive vitrified grinding wheels with large pores of the first invention are fixed in a row at predetermined intervals in the radial direction to the outer periphery of the metal base, allowing for the effective use of expensive superabrasive grains.

 第6発明の大径気孔を有する超砥粒ビトリファイド砥石の製造方法によれば、超砥粒、ビトリファイドボンド、及びバインダーを含むスラリーを調整するスラリー調整工程と、スラリーを乾燥機内で噴霧して空中で乾燥させることでスラリーの液滴から中空造粒体を得るスプレードライ造粒工程と、中空造粒体を金型内でプレス成形して成形体を得る成形工程と、成形体を焼成することで、超砥粒がビトリファイドボンドにより結合された多気孔組織内に大径気孔を有する超砥粒ビトリファイド砥石を得る焼成工程と、を含む。スプレードライ造粒工程により、超砥粒、ビトリファイドボンド、及びバインダーを含むスラリーを、乾燥機内で噴霧して空中で乾燥させることでスラリーの液滴から中空造粒体を好適に得ることができる。このように造粒された中空造粒体は、比較的造粒径を揃えやすく粒度分布がシャープとなるため、砥石内の気孔のバラツキや偏りが少なくなり、クラックも生じ難くなる。 The sixth invention of the method for producing a superabrasive vitrified grinding wheel with large pores includes a slurry preparation process in which a slurry containing superabrasive grains, a vitrified bond, and a binder is prepared; a spray-drying granulation process in which the slurry is sprayed in a dryer and dried in air to produce hollow granules from the slurry droplets; a molding process in which the hollow granules are press-molded in a mold to produce a green body; and a firing process in which the green body is fired to produce a superabrasive vitrified grinding wheel with large pores within a porous structure in which the superabrasive grains are bonded by the vitrified bond. The spray-drying granulation process allows for the preferable production of hollow granules from the slurry droplets by spraying a slurry containing superabrasive grains, a vitrified bond, and a binder in a dryer and drying it in air. Hollow granules produced in this manner have a relatively uniform particle size and a sharp particle size distribution, resulting in less variation and bias in the pores within the grinding wheel and less cracking.

本実施例の大径気孔を有する超砥粒ビトリファイド砥石を備えたカップ型砥石ホイールを示す斜視図である。FIG. 1 is a perspective view showing a cup-shaped grinding wheel equipped with a superabrasive vitrified grinding stone having large-diameter pores according to an embodiment of the present invention. 図1の大径気孔を有する超砥粒ビトリファイド砥石の表面を拡大して示す光学顕微鏡写真である。2 is an optical microscope photograph showing an enlarged view of the surface of the superabrasive vitrified grinding wheel having large pores shown in FIG. 1. 図2の超砥粒ビトリファイド砥石において、ビトリファイドボンドに含まれる中空造粒体を拡大して示すSEM写真である。3 is an SEM photograph showing an enlarged view of hollow granules contained in a vitrified bond in the superabrasive vitrified grinding wheel of FIG. 2. 中空造粒体の外殻の厚み、外径の測定方法を説明する図である。FIG. 2 is a diagram illustrating a method for measuring the shell thickness and outer diameter of hollow granules. 図1の大径気孔を有する超砥粒ビトリファイド砥石の製造工程を説明する工程図である。2 is a process diagram illustrating a manufacturing process of the superabrasive vitrified grinding wheel having large pores shown in FIG. 1. 図5のスプレードライ造粒工程において、中空造粒体の形成メカニズムを説明する図である。FIG. 6 is a diagram illustrating the mechanism of formation of hollow granules in the spray-drying granulation process of FIG. 5. 中空造粒体を用いない超砥粒ビトリファイド砥石の製造方法を説明する工程図である。FIG. 1 is a process diagram illustrating a method for manufacturing a superabrasive vitrified grinding wheel that does not use hollow granules. 研削試験1の調合量と研削試験結果とを示す図表である。1 is a table showing mixing amounts and grinding test results in grinding test 1. 研削試験2の調合量と研削試験結果とを示す図表である。10 is a table showing mixing amounts and grinding test results in grinding test 2.

 以下、本発明の一実施例を図面を参照して詳細に説明する。なお、以下の実施例において図は適宜簡略化或いは変形されており、各部の寸法比および形状等は必ずしも正確に描かれていない。 Below, one embodiment of the present invention will be described in detail with reference to the drawings. Note that in the following embodiment, the drawings have been simplified or modified as appropriate, and the dimensional ratios and shapes of each part are not necessarily drawn accurately.

 図1は、本発明の一実施例のカップ型砥石ホイール10を示す斜視図である。カップ型砥石ホイール10は、金属製たとえばアルミニウム製の円盤状の台金12と、台金12の下面の外周縁に沿って円環状に所定間隔で連ねて固着された複数個のセグメント砥石14とを備えている。セグメント砥石14は、台金12の下面の外周部において円環状に連なる研削面16をそれぞれ備えている。 Figure 1 is a perspective view showing a cup-shaped grinding wheel 10 according to one embodiment of the present invention. The cup-shaped grinding wheel 10 comprises a disk-shaped base metal 12 made of metal, for example, aluminum, and a plurality of segment grinding stones 14 fixedly attached at predetermined intervals in a ring-like arrangement along the outer periphery of the underside of the base metal 12. Each segment grinding stone 14 has a grinding surface 16 that is continuous in a ring-like arrangement along the outer periphery of the underside of the base metal 12.

 台金12は、金属製の円盤状を成し、図示しない研削装置の主軸に取り付けられることにより、カップ型砥石ホイール10が回転駆動される。カップ型砥石ホイール10は、たとえば250mm程度の外径を有し、セグメント砥石14は、たとえば3mm程度の厚みを有する円弧状板を成している。セグメント砥石14は、台金12の回転に伴って研削面16を被削材たとえばSiC等の半導体ウエハに摺接させ、その被削材を平面状に研削或いは平面研磨する。 The base metal 12 is a disk made of metal, and is attached to the main shaft of a grinding device (not shown), which rotates the cup-shaped grinding wheel 10. The cup-shaped grinding wheel 10 has an outer diameter of, for example, about 250 mm, and the segment grinding wheel 14 is an arc-shaped plate with a thickness of, for example, about 3 mm. As the base metal 12 rotates, the grinding surface 16 of the segment grinding wheel 14 slides against the workpiece, such as a semiconductor wafer such as SiC, grinding or polishing the workpiece into a flat surface.

 セグメント砥石14は、本発明の、大径気孔22を有する超砥粒ビトリファイド砥石に対応する。セグメント砥石14は、図2の200倍の光学顕微鏡写真に示すように、超砥粒、たとえばダイヤモンド砥粒18と、中空造粒体20と、ダイヤモンド砥粒18及び中空造粒体20を結合するビトリファイドボンドと、大径気孔22を含む気孔24と、を含む多気孔組織から構成されている。中空造粒体20の内腔が大径気孔22を形成している。セグメント砥石14の組成は、たとえば、ダイヤモンド砥粒18が19~26vol%、ビトリファイドボンドが9~12vol%、気孔24が60~72vol%、である。 The segmented grinding wheel 14 corresponds to the superabrasive vitrified grinding wheel having large-diameter pores 22 of the present invention. As shown in the 200x optical microscope photograph in Figure 2, the segmented grinding wheel 14 is composed of a porous structure including superabrasive grains, such as diamond abrasive grains 18, hollow granules 20, a vitrified bond that bonds the diamond abrasive grains 18 and hollow granules 20, and pores 24 containing the large-diameter pores 22. The inner cavities of the hollow granules 20 form the large-diameter pores 22. The composition of the segmented grinding wheel 14 is, for example, 19-26 vol% diamond abrasive grains 18, 9-12 vol% vitrified bond, and 60-72 vol% pores 24.

 セグメント砥石14を構成する多気孔組織の大径気孔22を含む全気孔24の平均気孔径は、顕微鏡観察による画像測定を用いて気孔24部分の最大径を30点以上継続したときの平均値でいうと、たとえば5~60μm、好適には8~51μmである。 The average pore diameter of all pores 24, including the large pores 22 in the porous structure that makes up the segment grinding wheel 14, is, for example, 5 to 60 μm, and preferably 8 to 51 μm, as the average value when the maximum diameter of the pores 24 is measured at 30 or more consecutive points using image measurement under a microscope.

 ダイヤモンド砥粒18の粒径は、要求される表面粗さに応じて選択され得るが、たとえば10μm以下、好適には平均粒径が0.6μmの大きさである。ビトリファイドボンドは、よく知られたホウケイ酸ガラス或いはホウケイ酸亜鉛ガラスから構成される。そのガラス組成は、たとえば、10~60wt%のSiO、10~30wt%のB、0~65wt%のZnO、0~10wt%のRO、0~10wt%のROである。 The particle size of the diamond abrasive grains 18 can be selected depending on the required surface roughness, but is, for example, 10 μm or less, preferably an average particle size of 0.6 μm. The vitrified bond is made of well-known borosilicate glass or borosilicate zinc glass. The glass composition is, for example, 10 to 60 wt% SiO 2 , 10 to 30 wt% B 2 O 3 , 0 to 65 wt% ZnO, 0 to 10 wt% RO, and 0 to 10 wt% R 2 O.

 中空造粒体20は、図3の1000倍のSEM(走査型電子顕微鏡)写真に示すように、ダイヤモンド砥粒18と、ダイヤモンド砥粒18を結合するビトリファイドボンドと、気孔24と、を含む多気孔組織から構成された球状の外殻26と、外殻26で囲まれた内腔である大径気孔22とから構成されている。中空造粒体20は、10~100μmの外径Dを有するものが好ましい。外径Dが10μmより小さいと中実造粒体が多くなり、100μmを超えると、陥没などの欠陥が生じやすくなるからである。 As shown in the 1000x SEM (scanning electron microscope) photograph in Figure 3, the hollow granules 20 are composed of diamond abrasive grains 18, a vitrified bond that bonds the diamond abrasive grains 18, a spherical outer shell 26 made up of a porous structure including pores 24, and large pores 22 that are internal cavities surrounded by the outer shell 26. It is preferable that the hollow granules 20 have an outer diameter D of 10 to 100 μm. If the outer diameter D is less than 10 μm, there will be more solid granules, and if it exceeds 100 μm, defects such as depressions will be more likely to occur.

 中空造粒体20の外径D及び外殻26の厚みTは、図4に示すように測定される。先ず、セグメント砥石14を固定砥粒研磨パッドを用いて研削して内部の面を露出させた後、光学顕微鏡或いはSEMを用いて露出面を観察し、次に、観察画像から中空造粒体20を抽出し、その外径D及び外殻26の厚みTを画像測定する。そして、その計測を画像中の30点の中空造粒体20について計測し、平均値を算出する。 The outer diameter D of the hollow granules 20 and the thickness T of the outer shell 26 are measured as shown in Figure 4. First, the segment grinding wheel 14 is ground using a fixed abrasive polishing pad to expose the internal surface, and the exposed surface is observed using an optical microscope or SEM. Next, the hollow granules 20 are extracted from the observed image, and their outer diameter D and thickness T of the outer shell 26 are measured using the image. These measurements are then taken for 30 hollow granules 20 in the image, and the average values are calculated.

 中空造粒体20の外殻26の厚みTは、たとえば5~10μm、好適には8.2~9.6μmであり、中空造粒体20の外径Dは、たとえば10~100μm、好適には22~82μmであり、中空造粒体20の外殻26の厚みTと中空造粒体20の外径Dとの比の値T/Dは、たとえば0.1~0.4、好適には0.1~0.37である。 The thickness T of the outer shell 26 of the hollow granules 20 is, for example, 5 to 10 μm, preferably 8.2 to 9.6 μm, the outer diameter D of the hollow granules 20 is, for example, 10 to 100 μm, preferably 22 to 82 μm, and the ratio T/D of the thickness T of the outer shell 26 of the hollow granules 20 to the outer diameter D of the hollow granules 20 is, for example, 0.1 to 0.4, preferably 0.1 to 0.37.

 図5は、セグメント砥石14の製造工程の要部を説明する工程図である。図5のスラリー調整工程P1では、中空造粒体20を造粒する材料であるスラリーが調整される。すなわち、ダイヤモンド砥粒18、ビトリファイドボンド、PVA、アクリル樹脂、及びワックスなどのバインダーが、所定割合で均一に混合されてスラリーが調整される。バインダーは成形助剤であって、その添加割合は、後述の成形工程P3におけるプレス成形圧が100~400kgf/cmとなるように予め実験的に調整される。成形圧が100kgf/cmよりも小さいと中空造粒体20同士の接着が弱く、成形圧が400kgf/cmを超えると中空造粒体20の変形や破壊が発生するからである。 FIG. 5 is a process diagram illustrating the main steps of the manufacturing process for the segment grinding wheel 14. In the slurry preparation step P1 in FIG. 5, a slurry, which is the material for granulating the hollow granules 20, is prepared. That is, the slurry is prepared by uniformly mixing diamond abrasive grains 18, vitrified bond, PVA, acrylic resin, and a binder such as wax in a predetermined ratio. The binder is a molding aid, and its addition ratio is experimentally adjusted in advance so that the press molding pressure in the molding step P3 described below is 100 to 400 kgf/ cm² . This is because if the molding pressure is less than 100 kgf/ cm² , the adhesion between the hollow granules 20 will be weak, and if the molding pressure exceeds 400 kgf/ cm² , the hollow granules 20 will deform or break.

 スプレードライ造粒工程P2では、スプレードライヤーの乾燥炉内で上記スラリーが噴霧されることで液滴状態のスラリーが空中で乾燥され、中空造粒体20が造粒される。図6に示すように、液滴状のスラリーは、乾燥過程で、ダイヤモンド砥粒18及びビトリファイドボンドの粒子が外側へ向かって移動する一方で、内腔が広がると同時に外径Dが収縮して外殻26が形成され、たとえば図3に示す中空造粒体20が造粒される。中空造粒体20は、必要に応じて分級される。上記スラリーの噴霧方式は、2流体ノズル方式、高圧ノズル方式、回転円板方式などから選択される。 In the spray-drying granulation process P2, the slurry is sprayed inside the drying furnace of the spray dryer, causing the droplets of the slurry to dry in the air and form hollow granules 20. As shown in Figure 6, during the drying process, the diamond abrasive grains 18 and vitrified bond particles of the droplet-like slurry move outward, while the inner cavity expands and the outer diameter D contracts, forming an outer shell 26, resulting in the formation of hollow granules 20, such as those shown in Figure 3. The hollow granules 20 are classified as necessary. The method for spraying the slurry is selected from a two-fluid nozzle method, a high-pressure nozzle method, a rotating disk method, etc.

 次に、成形工程P3では、スプレードライ造粒工程P2で得られた中空造粒体20がプレス金型内に充填され、たとえば100~400kgf/cmのプレス成形圧でプレスされる。 Next, in the molding step P3, the hollow granules 20 obtained in the spray-drying granulation step P2 are filled into a press die and pressed at a molding pressure of, for example, 100 to 400 kgf/cm 2 .

 焼成工程P4では、成形工程P3で成形された成形体を、ビトリファイドボンドが溶融する温度たとえば800℃で焼成することで、セグメント砥石14が得られる。そして、接着・仕上げ工程P5では、複数個のセグメント砥石14が台金12に接着され、ドレッサを用いて仕上げ加工が行なわれることで、図1に示すカップ型砥石ホイール10が得られる。 In the firing process P4, the compact formed in the molding process P3 is fired at a temperature at which the vitrified bond melts, such as 800°C, to obtain the segmented grinding wheels 14. Then, in the bonding and finishing process P5, multiple segmented grinding wheels 14 are bonded to the base metal 12 and finished using a dresser to obtain the cup-shaped grinding wheel 10 shown in Figure 1.

(研削試験の説明)
 次に、以下に示す研削(研磨)条件を用いて本発明者等が行なった研削試験1及び2の内容とそれら研削試験1及び2の結果とを、以下に説明する。
(Grinding test explanation)
Next, the details of grinding tests 1 and 2 conducted by the present inventors using the grinding (polishing) conditions shown below and the results of these grinding tests 1 and 2 will be described below.

 研削試験1では、図8の図表に示す比較例品1、及び実施例品1~4が用いられた。実施例品1~4は、図8に示す組成で製造された、中空造粒体20を含むことで大径気孔22を有する超砥粒ビトリファイド砥石であり、図8に示すように組成が相違する。比較例品1は、図8に示す組成を用いて、図7に示す製造工程で製造された中空造粒体20を含まない超砥粒ビトリファイド砥石である。図7に示す製造工程において、スラリー調整工程P11では、ダイヤモンド砥粒18、ビトリファイドボンド、及び、PVA、アクリル樹脂、ワックスなどのバインダーが所定割合で均一に混合されてスラリーが調整される。次いで、乾燥・攪拌工程P12では、スラリーが電動乳鉢装置を用いて乾燥且つ攪拌され、篩にかけられることで造粒される。成形工程P13、焼成工程P14、接着・仕上げ工程P15では、図5の成形工程P3、焼成工程P4、接着・仕上げ工程P5と同様に、成形され、焼成され、接着・仕上げされる。 In grinding test 1, comparative example 1 and example examples 1 to 4 shown in the table in Figure 8 were used. Example examples 1 to 4 are superabrasive vitrified grinding wheels manufactured with the composition shown in Figure 8, and have large-diameter pores 22 due to the inclusion of hollow granules 20, and have different compositions as shown in Figure 8. Comparative example 1 is a superabrasive vitrified grinding wheel that does not contain hollow granules 20, manufactured using the composition shown in Figure 8 and the manufacturing process shown in Figure 7. In the manufacturing process shown in Figure 7, in the slurry preparation process P11, diamond abrasive grains 18, vitrified bond, and binders such as PVA, acrylic resin, and wax are uniformly mixed in a predetermined ratio to prepare a slurry. Next, in the drying and stirring process P12, the slurry is dried and stirred using an electric mortar and pestle device, and granulated by sieving. In the molding process P13, firing process P14, and bonding/finishing process P15, molding, firing, bonding, and finishing are carried out in the same manner as in the molding process P3, firing process P4, and bonding/finishing process P5 in Figure 5.

 研削試験2では、図9の図表に示す比較例品2、及び実施例品5~6が用いられた。実施例品5~6は、図9に示す組成で図5に示す工程で製造された、中空造粒体20を含むことで大径気孔22を有する超砥粒ビトリファイド砥石であり、図9に示すように組成が相違する。比較例品2は、図9に示す組成を用いて、図7に示す製造工程で製造された中空造粒体20を含まない超砥粒ビトリファイド砥石である。 In grinding test 2, comparative example 2 and example examples 5-6 shown in the diagram in Figure 9 were used. Example examples 5-6 are superabrasive vitrified grinding wheels with large pores 22 due to the inclusion of hollow granules 20, manufactured using the composition shown in Figure 9 and the process shown in Figure 5, and have different compositions as shown in Figure 9. Comparative example 2 is a superabrasive vitrified grinding wheel without hollow granules 20, manufactured using the composition shown in Figure 9 and the manufacturing process shown in Figure 7.

(研削試験1の研削条件)
研削盤:縦型平面研削盤
被削材:4インチSiCウエハのC面
砥石回転数:2400rpm
テーブル回転数:150rpm
砥石軸送り速度:0.4μm/sec
ウエハの取り代:8μm
研削液: 水
(Grinding conditions for grinding test 1)
Grinding machine: vertical surface grinding machine Workpiece: C-face grinding wheel for 4-inch SiC wafers Rotation speed: 2400 rpm
Table rotation speed: 150 rpm
Grinding wheel spindle feed speed: 0.4 μm/sec
Wafer removal allowance: 8 μm
Grinding fluid: Water

(研削試験2の研削条件)
研削盤:縦型平面研削盤
被削材:6インチSiCウエハのC面
砥石回転数:2500rpm
テーブル回転数:311rpm
砥石軸送り速度:0.6μm/sec
ウエハの取り代:20μm
研削液: 水
(Grinding conditions for grinding test 2)
Grinding machine: vertical surface grinding machine Workpiece: C-face grinding wheel for 6-inch SiC wafers Rotation speed: 2500 rpm
Table rotation speed: 311 rpm
Grinding wheel spindle feed speed: 0.6 μm/sec
Wafer removal allowance: 20 μm
Grinding fluid: Water

 研削試験1では、図8に示すように、実施例品1~4は、比較例品1に対して、電流値(A)については有意な差は存在しないが、摩耗量(μm)については、明らかに少なく、砥石性能すなわち研削効率が高いという結果が得られた。これは、中空造粒体20が形成する大径気孔22の存在により、砥粒保持力が高く、目詰まりが抑制されるため、砥粒の切れ刃自生作用が好適に得られたものと推定される。実施例品1~4は、超砥粒ビトリファイド砥石内に含まれる中空造粒体20の形状を変化させたものである。 In Grinding Test 1, as shown in Figure 8, Examples 1 to 4 did not show a significant difference in current value (A) compared to Comparative Example 1, but the amount of wear (μm) was clearly less, resulting in high grinding wheel performance, i.e., high grinding efficiency. This is presumably because the presence of large-diameter pores 22 formed by the hollow granules 20 increases abrasive grain retention and suppresses clogging, thereby favorably achieving the self-sharpening action of the abrasive grains. Examples 1 to 4 have different shapes of the hollow granules 20 contained within the superabrasive vitrified grinding wheel.

 図8に示すように、実施例品1~4の中空造粒体20が含まれている組成については、比較例品1に対して、砥粒体積率及びビトリファイドボンド体積率は小さく、平均気孔径は大きい。実施例品1~4は、砥粒体積率が19.3~24.4vol%、ビトリファイドボンド体積率が9.6~12.0vol%、平均気孔径が8~45μm、中空造粒体20の外径Dが22~82μmである。また、実施例品1~4に含まれる中空造粒体20の外殻26の厚みTと外径Dとの比の値T/Dは、0.1~0.37である。 As shown in Figure 8, the compositions containing hollow granules 20 in Examples 1 to 4 have smaller abrasive grain volume fractions and vitrified bond volume fractions, and larger average pore diameters, compared to Comparative Example 1. Examples 1 to 4 have abrasive grain volume fractions of 19.3 to 24.4 vol%, vitrified bond volume fractions of 9.6 to 12.0 vol%, average pore diameters of 8 to 45 μm, and hollow granule 20 outer diameters D of 22 to 82 μm. Furthermore, the ratio T/D of the thickness T of the outer shell 26 of the hollow granules 20 contained in Examples 1 to 4 to the outer diameter D is 0.1 to 0.37.

 実施例品1~4のなかで、実施例品1の中空造粒体20の外殻26の厚みTと中空造粒体20の外径Dとの比の値T/Dは、0.37で、他の実施例品2~4に比較して摩耗量が2.3倍以上である。実施例品1は、他の実施例品2~4に比較して、平均気孔径が小さく、且つ、上記の比の値T/Dが大きいことから、充分な大径気孔構造が少ないためと考えられる。 Among Examples 1 to 4, Example 1 has a ratio T/D of the thickness T of the outer shell 26 of the hollow granules 20 to the outer diameter D of the hollow granules 20 of 0.37, which means that the amount of wear is 2.3 times greater than that of Examples 2 to 4. Compared to Examples 2 to 4, Example 1 has a smaller average pore diameter and a larger T/D ratio, which is thought to be due to the lack of a sufficiently large pore structure.

 研削試験2では、図9に示すように、実施例品5~6は、比較例品2に対して、研削試験1と同様に、電流値(A)については有意な差は存在しないが、摩耗量(μm)については、大幅に少なく、砥石性能すなわち研削効率が高いという結果が得られた。これも、中空造粒体20が形成する大径気孔22の存在により、砥粒保持力が高く、目詰まりが抑制されるため、砥粒の切れ刃自生作用が好適に得られたものと推定される。 In Grinding Test 2, as shown in Figure 9, there was no significant difference in current value (A) between Examples 5 and 6 and Comparative Example 2, just as in Grinding Test 1. However, the amount of wear (μm) was significantly less, resulting in high grinding wheel performance, i.e., high grinding efficiency. This is also presumably due to the presence of large-diameter pores 22 formed by the hollow granules 20, which provide high abrasive grain retention and suppress clogging, thereby enabling the abrasive grains to effectively self-sharpen their cutting edges.

 図9に示すように、実施例品5~6の中空造粒体20が含まれている組成については、比較例品2に対して、砥粒体積率及びビトリファイドボンド体積率はそれほどの差はないが、平均気孔径は大きい。実施例品5~6の砥粒体積率は、実施例品1~4よりも大きいが、ビトリファイドボンド体積率、平均気孔径は、それほどの差はない。中空造粒体20の外殻26の厚みTと外径Dとの比の値T/Dは、実施例品1~4の範囲内である。 As shown in Figure 9, for the compositions containing hollow granules 20 in Examples 5 and 6, there is not much difference in the abrasive grain volume ratio and vitrified bond volume ratio compared to Comparative Example 2, but the average pore diameter is larger. The abrasive grain volume ratio of Examples 5 and 6 is larger than that of Examples 1 to 4, but there is not much difference in the vitrified bond volume ratio and average pore diameter. The ratio T/D, which is the thickness T of the outer shell 26 of the hollow granules 20 to the outer diameter D, is within the range of Examples 1 to 4.

 実施例品1~6では、結局、砥粒体積率が19.3~25.9vol%、ビトリファイドボンド体積率が9.3~12.0vol%、平均気孔径が8~51μm、中空造粒体20の外径Dが22~82μmである。 In Examples 1 to 6, the abrasive grain volume fraction was 19.3 to 25.9 vol%, the vitrified bond volume fraction was 9.3 to 12.0 vol%, the average pore diameter was 8 to 51 μm, and the outer diameter D of the hollow granules 20 was 22 to 82 μm.

 上述のように、本実施例のセグメント砥石(大径気孔を有する超砥粒ビトリファイド砥石)14は、ダイヤモンド砥粒(超砥粒)18がビトリファイドボンドで結合された外殻26を有する中空造粒体20を含み、その中空造粒体20の内腔がセグメント砥石14の多気孔組織内の大径気孔22を形成している。これにより、混練材料中において中空造粒体20の遍在が少なく均一に混在するので、クラックが生じ難く、安定製造が可能で、気孔径に偏りがなく容易に砥石調合調整が可能なセグメント砥石14が得られる。 As described above, the segmented grinding wheel (superabrasive vitrified grinding wheel with large pores) 14 of this embodiment includes hollow granules 20 with an outer shell 26 in which diamond abrasive grains (superabrasive grains) 18 are bonded with a vitrified bond, and the inner cavity of these hollow granules 20 forms large pores 22 within the porous structure of the segmented grinding wheel 14. As a result, the hollow granules 20 are uniformly mixed in the mixed material with little uneven distribution, resulting in a segmented grinding wheel 14 that is less likely to crack, can be manufactured stably, and has no bias in pore size, allowing for easy grinding wheel blend adjustment.

 また、本実施例のセグメント砥石14によれば、中空造粒体20は、外殻26の厚みTと中空造粒体20の外径Dとの比の値(=T/D)が、0.1~0.4好適には0.1~0.37である。これにより、プレス成形時において中空造粒体20の中空構造が好適に維持される。外殻26の厚みTと中空造粒体20の外径Dとの比の値(=T/D)が0.1未満であると、中空造粒体20の強度が低下して中空構造が破壊される。外殻26の厚みTと中空造粒体20の外径Dとの比の値(=T/D)が0.37を超えると、スプレードライ過程で中空構造が変形して内腔が形成されない欠陥造粒体が形成されて、多気孔組織内にセグメント砥石14が得られ難くなる。 Furthermore, with the segmented grinding wheel 14 of this embodiment, the hollow granules 20 have a ratio (=T/D) of the thickness T of the outer shell 26 to the outer diameter D of the hollow granules 20 of 0.1 to 0.4, preferably 0.1 to 0.37. This ensures that the hollow structure of the hollow granules 20 is maintained appropriately during press molding. If the ratio (=T/D) of the thickness T of the outer shell 26 to the outer diameter D of the hollow granules 20 is less than 0.1, the strength of the hollow granules 20 will decrease and the hollow structure will be destroyed. If the ratio (=T/D) of the thickness T of the outer shell 26 to the outer diameter D of the hollow granules 20 exceeds 0.37, the hollow structure will deform during the spray drying process, resulting in the formation of defective granules with no internal cavity, making it difficult to obtain a segmented grinding wheel 14 within a porous structure.

また、本実施例のセグメント砥石14によれば、多気孔組織は、平均気孔径が5~60μm好適には8~51μmの気孔24を含む。これにより、研削性能の高いセグメント砥石14が得られる。 Furthermore, according to the segment grinding wheel 14 of this embodiment, the porous structure contains pores 24 with an average pore diameter of 5 to 60 μm, preferably 8 to 51 μm. This results in a segment grinding wheel 14 with high grinding performance.

 また、本実施例のセグメント砥石14によれば、ダイヤモンド砥粒18は10μmφ以下であり、中空造粒体20は、5~10μm好適には8.2~9.6μmの厚みTの外殻26と、10~100μm好適には22~82μmの外径Dとを有する。これにより、クラックが生じ難く、安定製造が可能で、気孔径に偏りがなく容易に砥石調合調整が可能な大径気孔を有するセグメント砥石(超砥粒ビトリファイド砥石)14が得られる。 Furthermore, in the segmented grinding wheel 14 of this embodiment, the diamond abrasive grains 18 are 10 μm diameter or less, and the hollow granules 20 have an outer shell 26 with a thickness T of 5 to 10 μm, preferably 8.2 to 9.6 μm, and an outer diameter D of 10 to 100 μm, preferably 22 to 82 μm. This results in a segmented grinding wheel (super abrasive vitrified grinding wheel) 14 that is less prone to cracking, can be manufactured stably, and has large-diameter pores with no bias in pore diameter, allowing for easy grinding wheel blend adjustment.

 また、本実施例では、セグメント砥石14が、金属製の台金12の外周部に、径方向に所定間隔で連ねて固着されることで、カップ型砥石ホイール10が構成されている。これにより、高価なダイヤモンド砥粒18を有効に用いることができる。 In addition, in this embodiment, the cup-shaped grinding wheel 10 is constructed by fastening the segment grinding stones 14 to the outer periphery of the metal base metal 12 in a row at predetermined intervals in the radial direction. This allows the expensive diamond abrasive grains 18 to be used effectively.

 また、本実施例のセグメント砥石14の製造方法によれば、ダイヤモンド砥粒18、ビトリファイドボンド、及びバインダーを含むスラリーを調整するスラリー調整工程P1と、スラリーを乾燥機内で噴霧して空中で乾燥させることでスラリーの液滴から中空造粒体20を得るスプレードライ造粒工程P2と、中空造粒体20を金型内でプレス成形して成形体を得る成形工程P3と、成形体を焼成することで、ダイヤモンド砥粒18がビトリファイドボンドにより結合された多気孔組織内にセグメント砥石14を得る焼成工程P4と、を含む。スプレードライ造粒工程P2により、ダイヤモンド砥粒18、ビトリファイドボンド、及びバインダーを含むスラリーを、乾燥機内で噴霧して空中で乾燥させることでスラリーの液滴から中空造粒体20を好適に得ることができる。このように造粒された中空造粒体20は、比較的造粒径を揃えやすく粒度分布がシャープとなるため、セグメント砥石14内の気孔24のバラツキや偏りが少なくなり、クラックも生じ難くなる。 Furthermore, the manufacturing method for the segmented grinding wheel 14 of this embodiment includes a slurry preparation process P1 in which a slurry containing diamond abrasive grains 18, a vitrified bond, and a binder is prepared; a spray-dry granulation process P2 in which the slurry is sprayed in a dryer and dried in air to obtain hollow granules 20 from the slurry droplets; a molding process P3 in which the hollow granules 20 are press-molded in a mold to obtain a green body; and a firing process P4 in which the green body is fired to obtain the segmented grinding wheel 14 in a porous structure in which the diamond abrasive grains 18 are bonded by the vitrified bond. In the spray-dry granulation process P2, a slurry containing diamond abrasive grains 18, a vitrified bond, and a binder is sprayed in a dryer and dried in air, thereby enabling the hollow granules 20 to be suitably obtained from the slurry droplets. The hollow granules 20 granulated in this manner have a relatively uniform particle size and a sharp particle size distribution, which reduces the variation and bias of the pores 24 within the segment grinding wheel 14 and makes cracks less likely to occur.

 以上、本発明の一実施例を図面を参照して詳細に説明したが、本発明はこの実施例に限定されるものではなく、別の態様でも実施され得る。 The above describes in detail one embodiment of the present invention with reference to the drawings, but the present invention is not limited to this embodiment and may be implemented in other forms.

 たとえば、前述の実施例では、ダイヤモンド砥粒18が用いられていたが、他の超砥粒たとえばCBN砥粒が用いられても差し支えない。 For example, in the above-described embodiment, diamond abrasive grains 18 were used, but other superabrasive grains, such as CBN abrasive grains, may also be used.

 また、前述の実施例では、厚肉円弧状板に成形された複数個のセグメント砥石14が台金12の外周部に固定されたカップ型砥石ホイール10が用いられていたが、セグメント砥石14は他の形状の砥石であってもよい。たとえば、所定の厚みを有するカップ型或いは円板状のビトリファイド研削ホイールであってもよい。 Furthermore, in the above-described embodiment, a cup-shaped grinding wheel 10 was used in which multiple segment grinding stones 14 formed into thick, arc-shaped plates were fixed to the outer periphery of the base metal 12, but the segment grinding stones 14 may also be grinding stones of other shapes. For example, they may be cup-shaped or disc-shaped vitrified grinding wheels having a predetermined thickness.

 また、セグメント砥石14のうちの表層がダイヤモンド砥粒18を含む超砥粒ビトリファイド砥石から構成され、下層が骨材(一般砥粒や無機粉体)をビトリファイドボンドで結合した2層構造のものであってもよい。 Alternatively, the segment grinding wheel 14 may have a two-layer structure in which the surface layer is made of a super-abrasive vitrified grinding wheel containing diamond abrasive grains 18, and the lower layer is made of aggregate (general abrasive grains or inorganic powder) bonded with a vitrified bond.

 なお、上述したのはあくまでも一実施形態であり、その他一々例示はしないが、本発明は、その主旨を逸脱しない範囲で当業者の知識に基づいて種々変更、改良を加えた態様で実施することができる。 Note that the above is merely one embodiment, and although other examples will not be provided, the present invention can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art, as long as they do not deviate from the spirit of the invention.

10:カップ型砥石ホイール
12:台金
14:セグメント砥石(大径気孔を有する超砥粒ビトリファイド砥石)
18:ダイヤモンド砥粒(超砥粒)
20:中空造粒体
22:大径気孔
24:気孔
26:外殻
T:厚み(外殻の厚み)
D:外径(中空造粒体の外径)
10: Cup-shaped grinding wheel 12: Base metal 14: Segment grinding wheel (super abrasive vitrified grinding wheel with large pores)
18: Diamond abrasive grains (super abrasive grains)
20: Hollow granule 22: Large diameter pore 24: Pore 26: Outer shell T: Thickness (thickness of outer shell)
D: Outer diameter (outer diameter of hollow granules)

Claims (6)

 超砥粒がビトリファイドボンドにより結合された多気孔組織内に大径気孔を有する超砥粒ビトリファイド砥石であって、
 前記超砥粒が前記ビトリファイドボンドで結合された外殻を有する中空造粒体を含み、
 前記中空造粒体の内腔が前記大径気孔を形成している
 ことを特徴とする大径気孔を有する超砥粒ビトリファイド砥石。
A superabrasive vitrified grinding wheel having large pores in a porous structure in which superabrasive grains are bonded by a vitrified bond,
the superabrasive grains include hollow granules having an outer shell bound by the vitrified bond,
The large-diameter pores are formed in the inner cavities of the hollow granules.
 前記中空造粒体は、前記外殻の厚みと前記中空造粒体の外径との比の値が、0.1~0.4である
 ことを特徴とする請求項1の大径気孔を有する超砥粒ビトリファイド砥石。
2. The superabrasive vitrified grinding wheel having large pores, according to claim 1, wherein the ratio of the thickness of the outer shell to the outer diameter of the hollow granules is 0.1 to 0.4.
 前記多気孔組織は、平均気孔径が5~60μmの気孔を含む
 ことを特徴とする請求項1の大径気孔を有する超砥粒ビトリファイド砥石。
2. The superabrasive vitrified grinding wheel having large pores according to claim 1, wherein the porous structure contains pores having an average pore diameter of 5 to 60 μm.
 前記超砥粒は10μmφ以下であり、
 前記中空造粒体は、5~10μmの厚みの前記外殻と、10~100μmの外径とを有する
 ことを特徴とする請求項1又は2の大径気孔を有する超砥粒ビトリファイド砥石。
The superabrasive grains have a diameter of 10 μm or less,
3. The vitrified superabrasive grinding wheel having large pores, characterized in that the hollow granules have a shell thickness of 5 to 10 μm and an outer diameter of 10 to 100 μm.
 請求項1の大径気孔を有する超砥粒ビトリファイド砥石が、金属製の台金の外周部に、径方向に所定間隔で連ねて固着されている
 ことを特徴とするカップ型砥石ホイール。
10. A cup-type grinding wheel, comprising: a superabrasive vitrified grinding wheel having large pores according to claim 1, fixed to the outer periphery of a metal base metal in a row at predetermined intervals in the radial direction.
 超砥粒がビトリファイドボンドにより結合された多気孔組織内に大径気孔を有する超砥粒ビトリファイド砥石の製造方法であって、
 前記超砥粒、前記ビトリファイドボンド、及びバインダーを含むスラリーを調整するスラリー調整工程と、
 前記スラリーを乾燥機内で噴霧して空中で乾燥させることで前記スラリーの液滴から中空造粒体を得るスプレードライ造粒工程と、
 前記スプレードライ造粒工程で得られた前記中空造粒体を金型内でプレス成形して成形体を得る成形工程と、
 前記成形体を焼成することで、前記超砥粒が前記ビトリファイドボンドにより結合された前記多気孔組織内に前記大径気孔を有する超砥粒ビトリファイド砥石を得る焼成工程と
、を含む
 ことを特徴とする大径気孔を有する超砥粒ビトリファイド砥石の製造方法。
A method for manufacturing a superabrasive vitrified grinding wheel having large pores in a porous structure in which superabrasive grains are bonded by a vitrified bond, comprising:
a slurry preparation step of preparing a slurry containing the superabrasive grains, the vitrified bond, and a binder;
a spray-drying granulation step in which the slurry is sprayed in a dryer and dried in air to obtain hollow granules from droplets of the slurry;
a molding step of press-molding the hollow granules obtained in the spray-drying granulation step in a mold to obtain a molded body;
and a firing step of firing the compact to obtain a superabrasive vitrified grinding wheel having the large-diameter pores within the porous structure in which the superabrasive grains are bonded by the vitrified bond.
PCT/JP2025/012989 2024-03-28 2025-03-28 Superabrasive grain vitrified grindstone having large diameter pores, manufacturing method therefor, and cup-type grindstone wheel Pending WO2025206380A1 (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10146764A (en) * 1996-11-12 1998-06-02 Mitsubishi Materials Corp Whetstone for precision grinding and manufacturing method thereof
JPH11285975A (en) * 1998-04-02 1999-10-19 Mitsui Kensaku Toishi Kk Vitrified grinding wheel including inorganic hollow pieces and its manufacture
JP2000317844A (en) * 1999-05-11 2000-11-21 Noritake Co Ltd Vitrified grinding wheel and manufacture thereof
JP2001260034A (en) * 2000-03-22 2001-09-25 Noritake Co Ltd Porous epoxy grinding wheel and manufacturing method for the same
US20030157868A1 (en) * 2000-08-23 2003-08-21 Axel Krupp Honing tool
JP2021126753A (en) * 2020-02-17 2021-09-02 株式会社東京ダイヤモンド工具製作所 Hollow body, porous grinding wheel, and method for manufacturing the same
WO2021199509A1 (en) * 2020-03-30 2021-10-07 株式会社ノリタケカンパニーリミテド Method for producing high-porosity vitrified grinding stone

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10146764A (en) * 1996-11-12 1998-06-02 Mitsubishi Materials Corp Whetstone for precision grinding and manufacturing method thereof
JPH11285975A (en) * 1998-04-02 1999-10-19 Mitsui Kensaku Toishi Kk Vitrified grinding wheel including inorganic hollow pieces and its manufacture
JP2000317844A (en) * 1999-05-11 2000-11-21 Noritake Co Ltd Vitrified grinding wheel and manufacture thereof
JP2001260034A (en) * 2000-03-22 2001-09-25 Noritake Co Ltd Porous epoxy grinding wheel and manufacturing method for the same
US20030157868A1 (en) * 2000-08-23 2003-08-21 Axel Krupp Honing tool
JP2021126753A (en) * 2020-02-17 2021-09-02 株式会社東京ダイヤモンド工具製作所 Hollow body, porous grinding wheel, and method for manufacturing the same
WO2021199509A1 (en) * 2020-03-30 2021-10-07 株式会社ノリタケカンパニーリミテド Method for producing high-porosity vitrified grinding stone

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