WO2025205369A1 - Semiconductor laser module, light source device, and optical fiber laser - Google Patents
Semiconductor laser module, light source device, and optical fiber laserInfo
- Publication number
- WO2025205369A1 WO2025205369A1 PCT/JP2025/010814 JP2025010814W WO2025205369A1 WO 2025205369 A1 WO2025205369 A1 WO 2025205369A1 JP 2025010814 W JP2025010814 W JP 2025010814W WO 2025205369 A1 WO2025205369 A1 WO 2025205369A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- semiconductor laser
- optical fiber
- laser
- reflecting mirror
- output
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
- H01S3/06—Construction or shape of active medium
- H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
- H01S3/067—Fibre lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
- H01S5/0687—Stabilising the frequency of the laser
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/14—External cavity lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
Definitions
- the present invention relates to a semiconductor laser module, a light source device, and an optical fiber laser.
- semiconductor laser modules have been known in which laser light output from multiple light-emitting elements is directed to the end of an optical fiber via multiple optical components (see, for example, Patent Document 1).
- one of the objectives of the present invention is to provide an improved new semiconductor laser module, light source device, and optical fiber laser that can, for example, output laser light in a desired wavelength band while reducing unnecessary energy consumption.
- the semiconductor laser module of the present invention includes, for example, a plurality of semiconductor laser elements each outputting multimode laser light as laser light and having substantially the same fast axis direction and slow axis direction; a first optical component that arranges the laser light output from the plurality of semiconductor laser elements at intervals in the fast axis direction; a reflecting mirror that reflects components of a specific wavelength band from the light output from the semiconductor laser elements and arranged at intervals in the fast axis direction, and forms an external resonator between the plurality of semiconductor laser elements; an aperture provided within the external resonator that limits the width of the laser light in the slow axis direction so as to remove higher-order mode components of the multimode laser light from the laser light arranged at intervals in the fast axis direction; and a focusing lens that couples the laser light output from the external resonator to an output optical fiber.
- the aperture may be located between the reflecting mirror and the first optical component.
- the front surface reflectivity of the semiconductor laser element may be 2% or less.
- the front surface reflectivity of the semiconductor laser element may be 0.5% or less.
- the aperture and the reflecting mirror may be integrated.
- FIG. 1 is an exemplary schematic plan view of a semiconductor laser module according to the first embodiment.
- FIG. 2 is an exemplary schematic perspective view of the semiconductor laser module of the first embodiment.
- FIG. 3 is a graph showing an example of the absorptance as a function of wavelength of a Yb-doped double clad fiber included in an optical fiber laser.
- FIG. 4 is an exemplary schematic perspective view of an aperture included in the semiconductor laser module of the first embodiment.
- FIG. 5 is an exemplary schematic plan view showing an enlarged portion of the semiconductor laser module of the first embodiment.
- FIG. 6 is a graph illustrating the relationship between the coupling efficiency of light emitted from the semiconductor laser element of the semiconductor laser module of the first embodiment to the reflecting mirror and the threshold carrier density as the amount of current required for laser oscillation of the semiconductor laser module.
- FIG. 7 is a graph showing an example of the relationship between the slope efficiency and the front surface reflectance of the semiconductor laser element in the semiconductor laser module of the first embodiment.
- FIG. 8 is an exemplary schematic perspective view of an aperture included in the semiconductor laser module of the second embodiment.
- FIG. 9 is an exemplary schematic plan view of a part of the semiconductor laser module according to the third embodiment.
- the X direction is represented by arrow X
- the Y direction is represented by arrow Y
- the Z direction is represented by arrow Z.
- the X, Y, and Z directions intersect and are perpendicular to each other.
- the direction behind arrow X is referred to as the opposite direction of the X direction
- the direction behind arrow Y is referred to as the opposite direction of the Y direction
- the direction behind arrow Z is referred to as the opposite direction of the Z direction.
- each figure is schematic, and the shape, dimensions, proportions, etc. of each part may differ from the actual ones.
- FIG. 1 is a plan view of a semiconductor laser module 10 according to a first embodiment
- FIG. 2 is a perspective view of the semiconductor laser module 10.
- the semiconductor laser module 10 comprises a base 24, a plurality of semiconductor laser elements 12, an optical system 14 provided corresponding to each of the semiconductor laser elements 12, an output section 18, and a terminal section 20.
- the output section 18 supports an optical fiber 68 that transmits the output light.
- the terminal section 20 is a connection terminal to which a wiring conductor that supplies power from an external power source to the semiconductor laser element 12 is electrically connected.
- the optical fiber 68 is an example of an output optical fiber.
- the base 24 supports each component included in the semiconductor laser module 10.
- the base 24 can also be referred to as a support member or a mounted member.
- the base 24 has a stepped portion 38.
- the stepped portion 38 has a plurality of step surfaces 40 that are shifted at equal intervals in the Z direction as they move in the opposite direction to the Y direction.
- the step surfaces 40 are generally flat, all facing the Z direction, and intersect with and are perpendicular to the Z direction.
- collimating lenses 58, 60 and a mirror 62 are mounted on each step surface 40.
- the laser light output from the semiconductor laser element 12 travels in the X direction, is first collimated in the fast axis direction by the collimating lens 58, then collimated in the slow axis direction by the collimating lens 60, and travels to the mirror 62.
- the mirrors 62 each reflect the laser light traveling in the X direction and redirect it in the Y direction.
- the fast axis direction does not change, but the slow axis direction changes from the Y direction and the opposite direction of the Y direction to the X direction and the opposite direction of the X direction.
- the laser light reflected by each mirror 62 and traveling in the Y direction is coupled to the end of the optical fiber 68 via the aperture 111, reflecting mirror 511, and focusing lenses 64 and 65.
- the focusing lens 64 focuses the laser light in the fast axis direction (Z direction and the direction opposite to the Z direction), and the focusing lens 65 focuses the laser light in the slow axis direction (X direction and the direction opposite to the X direction).
- the reflecting mirror 511 and aperture 111 will be described in more detail later.
- the multiple step surfaces 40 are offset at a predetermined interval in the Z direction, in other words, their positions in the Z direction are different, so that the multiple laser beams reflected by the mirror 62 and traveling in the Y direction are aligned at intervals in the Z direction before being input to the reflecting mirror 511.
- the step portion 38 (step surface 40), the multiple semiconductor laser elements 12, the collimating lenses 58, 60, and the mirror 62 are arranged so that the multiple laser beams input to the reflecting mirror 511 are aligned at intervals in the Z direction.
- the collimating lenses 58, 60 and the mirror 62 interposed between the semiconductor laser element 12 and the reflecting mirror 511 are referred to as the optical system 14.
- Each optical component included in the optical system 14 is an example of a first optical component.
- the configurations of the step portion 38, step surface 40, and optical system 14 are not limited to those illustrated in Figures 1 and 2, and may be any configuration that allows multiple laser beams input to the reflecting mirror 511 to be aligned at intervals in the Z direction.
- the semiconductor laser module 10 may include multiple parallel configurations including the step portion 38, step surface 40, and optical system 14, and the multiple laser beams input to the reflecting mirror 511 from these multiple configurations may be aligned at intervals in the Z direction. Note that "multiple laser beams aligned at intervals" means that the optical axes of the multiple laser beams are aligned at intervals.
- Figure 3 is a graph showing an example of the absorption rate as a function of wavelength of a Yb-doped double-clad fiber included in an optical fiber laser.
- the semiconductor laser module 10 outputs laser light that mainly contains components in wavelength band B: ⁇ c ⁇ 3 nm with a center wavelength ⁇ c of 976 nm in Figure 3, for example, the semiconductor laser module 10 can be used as part of the excitation light source to increase the output efficiency of an optical fiber laser that includes a Yb-doped double-clad fiber as an amplification fiber.
- the semiconductor laser module 10 is therefore provided with a reflective mirror 511, such as a VBG element (VBG: volume Bragg grating), that selectively reflects components of a specific wavelength band, i.e., components of the above-mentioned wavelength band B, and an external resonator is formed between the semiconductor laser element 12 and the reflective mirror 511.
- VBG volume Bragg grating
- the beam divergence angle, particularly in the slow axis direction, of the laser light output from the external resonator structure and coupled to the optical fiber 68 via the condenser lenses 64 and 65 increases as the driving power of the semiconductor laser element 12 increases.
- the inventors discovered that by inserting an aperture 111 that removes higher-order mode components contained in multimode laser light into the external resonator and configuring the aperture 111 to remove the higher-order mode components of the multimode laser light, it is possible to limit the divergence angle of the laser light in the slow axis direction while suppressing the output reduction caused by the aperture 111.
- the aperture 111 is inserted inside the external resonator, i.e., between the reflecting mirror 511 and the multiple semiconductor laser elements 12.
- multiple laser beams spaced apart in the Z direction pass through the aperture 111. That is, the aperture 111 limits the width of the slow axis direction of each of the laser beams spaced apart in the Z direction so as to remove higher-order components of the multimode laser beam.
- Reference Example 1 A configuration in which no aperture 111 is provided
- Reference Example 2 A configuration in which the aperture 111 is provided outside the external resonator, i.e., between the reflecting mirror 511 and the condenser lens 64, instead of being provided inside the external resonator.
- This embodiment A configuration in which the aperture 111 is provided inside the external resonator.
- the reduction rate of the laser light output in the configuration of this embodiment relative to the laser light output in the configuration of Reference Example 1 was 0 to 6%.
- FIG. 4 is a perspective view showing a specific configuration example of the aperture 111A (111).
- the aperture 111A has a rectangular, plate-like shape extending in the Z direction, with a substantially constant thickness and width in the X direction.
- the aperture 111A has two shielding portions 111a extending parallel to each other at equal intervals in the Z direction, and a U-shaped, notched opening O that opens in the Z direction is provided between the two shielding portions 111a.
- multiple laser beams arranged at intervals in the Z direction pass through the opening O.
- the position and width Ws of the opening O in the X direction are constant regardless of the position in the Z direction.
- the width Ws of the opening O in the slow-axis direction of the aperture 111A, i.e., in the X direction, is set to a size that can remove high-order components of multimode laser beams.
- 5 is an enlarged plan view of a portion of the semiconductor laser module 10. As shown in FIG.
- the width Ws can be expressed as, for example, Ws ⁇ h+2f ⁇ tan( ⁇ /2)
- the shielding portion 111a removes higher-order components of the multimode laser beam by partially blocking the laser beam at the end portions in the X direction and the opposite direction to the X direction of the passage region that intersects with the Y direction of the laser beam.
- aperture 111A can remove higher-order components of multimode laser light from both the laser light traveling from the semiconductor laser element 12 to the reflecting mirror 511 and the laser light traveling from the reflecting mirror 511 to the semiconductor laser element 12. This makes it possible to more reliably remove higher-order components of multimode laser light.
- the effective reflectance R eff is given by the following equation (1).
- R f is the front surface reflectance of the semiconductor laser element 12
- C is the coupling efficiency of the light emitted from the front surface (emitting end face) of the semiconductor laser element 12 to the reflecting mirror 511
- R VBG is the reflectance of the reflecting mirror 511 .
- the gain g of the semiconductor laser element 12 can be expressed as the following equation (2).
- ⁇ i is the transparentizing carrier density
- L is the cavity length of the semiconductor laser element 12
- R HR is the rear surface reflectance of the semiconductor laser element 12.
- the threshold carrier density N th in the external resonator can be expressed as the following equation (3).
- N tr is the transparent carrier density
- ⁇ is the active layer confinement coefficient
- G 0 is the gain coefficient.
- the threshold carrier density N th in equation (3) is the amount of current required for laser oscillation, and the larger this value is, the more difficult it is to oscillate the laser, i.e., the lower the laser light output (output efficiency) relative to the supplied current is.
- FIG. 6 is a graph showing the relationship between the coupling efficiency C and the threshold carrier density Nth for two examples of the front surface reflectivity Rf .
- the lower the front surface reflectivity Rf the higher the threshold carrier density Nth , i.e., the more difficult it is for the semiconductor laser device 12 to oscillate.
- the coupling efficiency C of the higher-order mode component is estimated to be approximately 0 to 0.2.
- oscillation can be achieved while removing the higher-order mode component in the resonator (external resonator) using the aperture 111, so the current supply can be reduced accordingly, and it is estimated that this can increase the output efficiency.
- the slope efficiency SE of the semiconductor laser device 12 can be expressed by the following equation (6).
- ⁇ i is the internal quantum efficiency
- ⁇ m is the mirror loss in the system.
- FIG. 7 is a graph showing the relationship between the slope efficiency SE and the front surface reflectivity Rf of the semiconductor laser element 12 based on equation (6).
- the coupling efficiency C is set to 1
- the reflectivity R VBG of the reflecting mirror 511 is set to 10%. Since the higher the reflectivity of the reflecting mirror 511, the greater the mirror loss and the lower the optical output, so a value of about 10% is generally used. It can be seen from FIG. 7 that the smaller the front surface reflectivity Rf , the higher the slope efficiency SE.
- the slope efficiency SE tends to increase when the front surface reflectivity of the semiconductor laser element 12 is 2% or less.
- the front surface reflectance of the semiconductor laser element 12 is preferably 2% or less, and more preferably 0.5% or less.
- the front surface reflectance is set to 0.01% or more.
- the reflectance of the reflecting mirror 511 constituting such an external resonator is preferably 4% or more. This is to ensure wavelength selectivity.
- the semiconductor laser module 10 of this embodiment is capable of outputting laser light in a desired wavelength band, while limiting the divergence angle in the slow axis direction and increasing output efficiency, i.e., reducing unnecessary energy consumption.
- the aperture 111 and the reflecting mirror 511 are spaced apart from each other.
- This configuration has the advantage that, for example, the installation position and attitude (angle) of the aperture 111 can be adjusted separately from the reflecting mirror 511.
- Second Embodiment 8 is a perspective view showing the aperture 111B (111) included in the semiconductor laser module 10 of the second embodiment.
- the aperture 111B can be provided in place of the aperture 111A of the semiconductor laser module 10 of the first embodiment, and the effect of providing the aperture 111 can be obtained even in this configuration.
- the two shielding portions 111a are configured as separate bodies.
- the advantage is that the output characteristics of the semiconductor laser module 10 can be adjusted by fine-tuning the width Ws of the gap G between the two shielding portions 111a.
- FIG. 9 is a plan view of a portion of the semiconductor laser module 10 of the third embodiment.
- the configuration shown in FIG. 9 can be provided in place of the semiconductor laser module 10 of the first embodiment, and the effect of providing the aperture 111 can also be obtained with this configuration.
- the aperture 111 is integrated with the reflecting mirror 511.
- the effort and cost required to manufacture the semiconductor laser module 10 may be reduced compared to when the aperture 111 and reflecting mirror 511 are separately attached to the base 24.
- only the aperture 111 of the subassembly of the aperture 111 and reflecting mirror 511 may be fixed to the base 24, or only the reflecting mirror 511 of the subassembly may be fixed to the base 24.
- the aperture 111 or reflecting mirror 511 is fixed to the base 24 via a bonding material such as an ultraviolet-curing adhesive.
- [Fourth embodiment] 10 is an exemplary schematic diagram showing the plurality of semiconductor laser elements 12, a reflecting mirror 511, and two condenser lenses 64 and 65 of the semiconductor laser module 10 of the fourth embodiment as viewed in the slow-axis direction.
- an external resonator is configured between one reflecting mirror 511 and the plurality of semiconductor laser elements 12 positioned at different positions in the Z direction.
- the reflecting mirror 511 is preferably disposed so as to have a constant thickness in the Y direction and be perpendicular to the Y direction.
- the plurality of laser beams dispersed in the Z direction travel parallel to each other in the Y direction, are incident on the reflecting mirror 511 at approximately right angles, and are reflected in the opposite direction to the Y direction.
- Figure 11 is a schematic diagram of a reference example including a condenser lens 64R configured as a spherical lens (cylindrical lens) viewed in the slow axis direction.
- a condenser lens 64R configured as a spherical lens (cylindrical lens) viewed in the slow axis direction.
- the condenser lens 64R is configured as a spherical lens
- the aberration of the condenser lens 64R makes it possible to obtain the desired coupling efficiency for laser light that is radially incident on the reflecting mirror 511. In other words, it becomes difficult to obtain the desired coupling efficiency for multiple laser light beams that are incident on the reflecting mirror 511 at approximately right angles.
- the optical fiber laser 94 includes a light source device 80, a pump combiner 96, a rare-earth doped optical fiber 98, an output optical fiber 100, a high-reflection FBG 102 (fiber bragg grating (FBG)), and a low-reflection FBG 104.
- FBG fiber bragg grating
- the light source device 80 functions as an excitation light source for the optical fiber laser 94 and has multiple semiconductor laser modules 10 of the above embodiment arranged in parallel.
- the output ends of the optical fibers 68 that transmit the laser light output from each semiconductor laser module 10 are respectively coupled to multiple input ports of a multiple-input, single-output pump combiner 96.
- the output port of the pump combiner 96 is connected to the input end of a rare-earth-doped optical fiber 98.
- the output end of the rare-earth-doped optical fiber 98 is connected to the input end of an output optical fiber 100.
- optical fibers 68 corresponding to the semiconductor laser modules 10 can be arranged side by side, and the laser light output from the multiple optical fibers 68 can be input to the input end of the rare-earth-doped optical fiber 98 using an input section such as an optical system including a lens.
- the optical fiber laser 94 that serves as an excitation light source for the light source device 80 of this embodiment is configured.
- the propagating pump light is absorbed by the rare-earth element doped in the core, causing a population inversion between the ground state and metastable state, resulting in the emission of light.
- the emitted light undergoes laser oscillation due to the optical amplification action of the rare-earth-doped optical fiber 98 and the action of the resonator formed by the high-reflection FBG 102 and the low-reflection FBG 104.
- laser oscillation generates laser light in the optical fiber laser 94.
- the generated laser light is output from the output end of the output optical fiber 100 connected to the output end of the rare-earth-doped optical fiber 98.
- the rare-earth-doped optical fiber 98 is, for example, an Yb-doped double-clad fiber, and is an example of an amplification fiber.
- the present invention can be used in semiconductor laser modules, light source devices, and optical fiber lasers.
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Abstract
Description
本発明は、半導体レーザモジュール、光源装置、および光ファイバレーザに関する。 The present invention relates to a semiconductor laser module, a light source device, and an optical fiber laser.
従来、複数の発光素子から出力されたレーザ光を複数の光学部品を介して光ファイバの;:端部に導く半導体レーザモジュールが知られている(例えば、特許文献1)。 Conventionally, semiconductor laser modules have been known in which laser light output from multiple light-emitting elements is directed to the end of an optical fiber via multiple optical components (see, for example, Patent Document 1).
この種の半導体レーザモジュールでは、所望の波長帯域のレーザ光を出力可能であるとともに、無駄なエネルギ消費の少ない半導体レーザモジュールが得られれば、有益である。 It would be beneficial if this type of semiconductor laser module could output laser light in the desired wavelength band while consuming minimal energy.
そこで、本発明の課題の一つは、例えば、所望の波長帯域のレーザ光を出力可能でありかつ無駄なエネルギ消費の少なくすることが可能となるような、改善された新規な半導体レーザモジュール、光源装置、および光ファイバレーザを得ること、である。 Therefore, one of the objectives of the present invention is to provide an improved new semiconductor laser module, light source device, and optical fiber laser that can, for example, output laser light in a desired wavelength band while reducing unnecessary energy consumption.
本発明の半導体レーザモジュールは、例えば、それぞれレーザ光としてマルチモードレーザ光を出力し速軸方向同士および遅軸方向同士が略同じである複数の半導体レーザ素子と、前記複数の半導体レーザ素子から出力されたレーザ光を前記速軸方向に間隔をあけて並べる第一光学部品と、前記半導体レーザ素子から出力され前記速軸方向に間隔をあけて並んだ光のうち特定の波長帯域の成分を反射し、前記複数の半導体レーザ素子との間で外部共振器を構成する反射ミラーと、前記外部共振器内に設けられ、前記速軸方向に間隔をあけて並んだレーザ光からマルチモードレーザ光の高次モード成分を除去するよう、当該レーザ光の前記遅軸方向の幅を制限するアパーチャと、前記外部共振器から出力されたレーザ光を出力光ファイバに結合する集光レンズと、を備える。 The semiconductor laser module of the present invention includes, for example, a plurality of semiconductor laser elements each outputting multimode laser light as laser light and having substantially the same fast axis direction and slow axis direction; a first optical component that arranges the laser light output from the plurality of semiconductor laser elements at intervals in the fast axis direction; a reflecting mirror that reflects components of a specific wavelength band from the light output from the semiconductor laser elements and arranged at intervals in the fast axis direction, and forms an external resonator between the plurality of semiconductor laser elements; an aperture provided within the external resonator that limits the width of the laser light in the slow axis direction so as to remove higher-order mode components of the multimode laser light from the laser light arranged at intervals in the fast axis direction; and a focusing lens that couples the laser light output from the external resonator to an output optical fiber.
前記半導体レーザモジュールでは、前記アパーチャは、前記反射ミラーと前記第一光学部品との間に位置してもよい。 In the semiconductor laser module, the aperture may be located between the reflecting mirror and the first optical component.
前記半導体レーザモジュールでは、前記半導体レーザ素子の前面反射率が2[%]以下であってもよい。 In the semiconductor laser module, the front surface reflectivity of the semiconductor laser element may be 2% or less.
前記半導体レーザモジュールでは、前記半導体レーザ素子の前面反射率が0.5[%]以下であってもよい。 In the semiconductor laser module, the front surface reflectivity of the semiconductor laser element may be 0.5% or less.
前記半導体レーザモジュールでは、前記反射ミラーの反射率が4[%]以上であってもよい。 In the semiconductor laser module, the reflectance of the reflecting mirror may be 4% or more.
前記半導体レーザモジュールでは、前記アパーチャと前記反射ミラーとが離隔していてもよい。 In the semiconductor laser module, the aperture and the reflecting mirror may be spaced apart.
前記半導体レーザモジュールでは、前記アパーチャと前記反射ミラーとが一体化されていてもよい。 In the semiconductor laser module, the aperture and the reflecting mirror may be integrated.
前記半導体レーザモジュールでは、前記集光レンズは、前記速軸方向に分散された複数の平行なレーザ光を前記出力光ファイバの端部の収束点に集光する非球面レンズとしての第一レンズを含み、前記反射ミラーは、前記複数の平行なレーザ光を前記複数の半導体レーザ素子に反射してもよい。 In the semiconductor laser module, the focusing lens may include a first lens as an aspherical lens that focuses the multiple parallel laser beams dispersed in the fast axis direction to a convergence point at the end of the output optical fiber, and the reflecting mirror may reflect the multiple parallel laser beams to the multiple semiconductor laser elements.
本発明の光源装置は、例えば、前記半導体レーザモジュールを備える。 The light source device of the present invention includes, for example, the semiconductor laser module.
本発明の光ファイバレーザは、例えば、前記光源装置と、増幅用光ファイバと、前記光源装置から出力されたレーザ光を前記増幅用光ファイバに導く光学部品と、を備える。 The optical fiber laser of the present invention comprises, for example, the light source device, an amplification optical fiber, and an optical component that guides the laser light output from the light source device to the amplification optical fiber.
前記光ファイバレーザでは、前記反射ミラーは、Ybドープダブルクラッドファイバの吸収スペクトルが高い波長を略中心に含む波長帯域の成分を反射してもよい。 In the optical fiber laser, the reflecting mirror may reflect components of a wavelength band that includes, approximately at the center, a wavelength at which the absorption spectrum of the Yb-doped double-clad fiber is high.
本発明によれば、より改善された新規な構成を備えた半導体レーザモジュール、光源装置、および光ファイバレーザを得ることができる。 The present invention makes it possible to obtain a semiconductor laser module, a light source device, and an optical fiber laser with a more improved and novel configuration.
以下、本発明の例示的な実施形態が開示される。以下に示される実施形態の構成、ならびに当該構成によってもたらされる作用および結果(効果)は、一例である。本発明は、以下の実施形態に開示される構成以外によっても実現可能である。また、本発明によれば、構成によって得られる種々の効果(派生的な効果も含む)のうち少なくとも一つを得ることが可能である。 Below, exemplary embodiments of the present invention are disclosed. The configurations of the embodiments shown below, as well as the actions and results (effects) brought about by said configurations, are merely examples. The present invention can also be realized with configurations other than those disclosed in the following embodiments. Furthermore, according to the present invention, it is possible to obtain at least one of the various effects (including derivative effects) obtained by the configurations.
以下に示される複数の実施形態は、同様の構成を備えている。よって、各実施形態の構成によれば、当該同様の構成に基づく同様の作用および効果が得られる。また、以下では、それら同様の構成には同様の符号が付与されるとともに、重複する説明が省略される場合がある。 The multiple embodiments described below have similar configurations. Therefore, according to the configuration of each embodiment, similar actions and effects based on the similar configurations can be obtained. Furthermore, below, similar configurations will be assigned similar reference numerals, and duplicate explanations may be omitted.
本明細書において、序数は、部品や、部材、部位、方向、光等を区別するために便宜上付与されうるものである。なお、序数は、優先順位や順番を示すものではないし、数を特定するものでもない。 In this specification, ordinal numbers may be assigned for convenience to distinguish between parts, members, locations, directions, lights, etc. Note that ordinal numbers do not indicate priority or order, nor do they specify a number.
各図において、X方向を矢印Xで表し、Y方向を矢印Yで表し、Z方向を矢印Zで表す。X方向、Y方向、およびZ方向は、互いに交差するとともに互いに直交している。矢印Xの後方を、X方向の反対方向と称し、矢印Yの後方を、Y方向の反対方向と称し、矢印Zの後方を、Z方向の反対方向と称する。また、各図は模式的なものであり、各部の形状や、寸法、比率等は、実際とは異なる場合がある。 In each figure, the X direction is represented by arrow X, the Y direction is represented by arrow Y, and the Z direction is represented by arrow Z. The X, Y, and Z directions intersect and are perpendicular to each other. The direction behind arrow X is referred to as the opposite direction of the X direction, the direction behind arrow Y is referred to as the opposite direction of the Y direction, and the direction behind arrow Z is referred to as the opposite direction of the Z direction. Furthermore, each figure is schematic, and the shape, dimensions, proportions, etc. of each part may differ from the actual ones.
[第1実施形態]
図1は、第1実施形態の半導体レーザモジュール10の平面図である。また、図2は、半導体レーザモジュール10の斜視図である。
[First embodiment]
1 is a plan view of a semiconductor laser module 10 according to a first embodiment, and FIG. 2 is a perspective view of the semiconductor laser module 10.
半導体レーザモジュール10は、ベース24と、複数の半導体レーザ素子12と、半導体レーザ素子12のそれぞれに対応して設けられた光学系14と、出力部18と、端子部20と、を備えている。 The semiconductor laser module 10 comprises a base 24, a plurality of semiconductor laser elements 12, an optical system 14 provided corresponding to each of the semiconductor laser elements 12, an output section 18, and a terminal section 20.
出力部18は、出力光を伝送する光ファイバ68を支持している。また、端子部20は、外部電源からの電力を半導体レーザ素子12へ供給する配線の導体が電気的に接続される接続端子である。光ファイバ68は、出力光ファイバの一例である。 The output section 18 supports an optical fiber 68 that transmits the output light. The terminal section 20 is a connection terminal to which a wiring conductor that supplies power from an external power source to the semiconductor laser element 12 is electrically connected. The optical fiber 68 is an example of an output optical fiber.
図1,2に示されるように、ベース24は、半導体レーザモジュール10に含まれる各部品を支持している。ベース24は、支持部材や被実装部材とも称されうる。 As shown in Figures 1 and 2, the base 24 supports each component included in the semiconductor laser module 10. The base 24 can also be referred to as a support member or a mounted member.
図2に示されるように、ベース24は、階段状の段差部38を有している。段差部38は、Y方向の反対方向に向かうにつれてZ方向に等間隔でずれる複数の段差面40を有している。段差面40は、略平面であり、いずれもZ方向を向き、Z方向と交差するとともに直交している。 As shown in FIG. 2, the base 24 has a stepped portion 38. The stepped portion 38 has a plurality of step surfaces 40 that are shifted at equal intervals in the Z direction as they move in the opposite direction to the Y direction. The step surfaces 40 are generally flat, all facing the Z direction, and intersect with and are perpendicular to the Z direction.
各段差面40上には、同じスペックの半導体レーザ素子12が実装されている。複数の半導体レーザ素子12は、いずれも、Z方向およびZ方向の反対方向を速軸方向とし、Y方向およびY方向の反対方向を遅軸方向とするレーザ光を、出力する。言い換えると、複数の半導体レーザ素子12の速軸方向同士は略同じであり、遅軸方向同士は略同じである。また、本実施形態では、半導体レーザ素子12は、いずれも、レーザ光としてマルチモードレーザ光を出力する。なお、本実施形態では、半導体レーザ素子12は、サブマウント42上に実装され、チップオンサブマウントを構成しているが、これには限定されず、例えば、ケース内に収容され、ユニット化されたものであってもよい。 Semiconductor laser elements 12 with the same specifications are mounted on each step surface 40. Each of the multiple semiconductor laser elements 12 outputs laser light whose fast axis direction is in the Z direction and the direction opposite to the Z direction, and whose slow axis direction is in the Y direction and the direction opposite to the Y direction. In other words, the fast axis directions of the multiple semiconductor laser elements 12 are substantially the same, and their slow axis directions are substantially the same. In this embodiment, each of the semiconductor laser elements 12 outputs multimode laser light as laser light. In this embodiment, the semiconductor laser element 12 is mounted on a submount 42 to form a chip-on-submount, but this is not limited to this and may be housed in a case and unitized, for example.
また、各段差面40上には、コリメートレンズ58,60、およびミラー62が実装されている。各段差面40上で、半導体レーザ素子12から出力されたレーザ光はX方向に進み、まずはコリメートレンズ58で速軸方向にコリメートされ、続いてコリメートレンズ60で遅軸方向にコリメートされ、ミラー62へ進む。 Furthermore, collimating lenses 58, 60 and a mirror 62 are mounted on each step surface 40. On each step surface 40, the laser light output from the semiconductor laser element 12 travels in the X direction, is first collimated in the fast axis direction by the collimating lens 58, then collimated in the slow axis direction by the collimating lens 60, and travels to the mirror 62.
ミラー62は、それぞれ、X方向に向かうレーザ光を反射して、Y方向へ向かわせる。なお、ミラー62でのレーザ光の反射において、速軸方向は変化しないものの、遅軸方向は、Y方向およびY方向の反対方向から、X方向およびX方向の反対方向に変化する。 The mirrors 62 each reflect the laser light traveling in the X direction and redirect it in the Y direction. When the laser light is reflected by the mirrors 62, the fast axis direction does not change, but the slow axis direction changes from the Y direction and the opposite direction of the Y direction to the X direction and the opposite direction of the X direction.
各ミラー62で反射され、Y方向へ向かうレーザ光は、アパーチャ111、反射ミラー511、および集光レンズ64,65を経由して、光ファイバ68の端部に結合する。集光レンズ64は、速軸方向(Z方向およびZ方向の反対方向)にレーザ光を収束し、集光レンズ65は、遅軸方向(X方向およびX方向の反対方向)にレーザ光を収束する。反射ミラー511およびアパーチャ111については、後に詳しく述べる。 The laser light reflected by each mirror 62 and traveling in the Y direction is coupled to the end of the optical fiber 68 via the aperture 111, reflecting mirror 511, and focusing lenses 64 and 65. The focusing lens 64 focuses the laser light in the fast axis direction (Z direction and the direction opposite to the Z direction), and the focusing lens 65 focuses the laser light in the slow axis direction (X direction and the direction opposite to the X direction). The reflecting mirror 511 and aperture 111 will be described in more detail later.
上述した構成において、複数の段差面40は、Z方向における所定間隔でずれているため、言い換えるとZ方向における位置が異なるため、ミラー62で反射されY方向へ進む複数のレーザ光は、反射ミラー511へ入力される前の段階で、Z方向に間隔をあけて並ぶことになる。言い換えると、段差部38(段差面40)、複数の半導体レーザ素子12、コリメートレンズ58,60、およびミラー62は、反射ミラー511へ入力される複数のレーザ光が、Z方向に間隔をあけて並ぶように、設けられている。本実施形態では、半導体レーザ素子12と反射ミラー511との間に介在するコリメートレンズ58,60およびミラー62を、光学系14と称する。光学系14に含まれる各光学部品は、第一光学部品の一例である。なお、段差部38、段差面40、および光学系14の構成は、図1,2に例示されたものには限定されず、反射ミラー511へ入力される複数のレーザ光が、Z方向に間隔をあけて並ぶことを可能とする構成であれば、どのようなものであってもよい。また、半導体レーザモジュール10は、段差部38、段差面40、および光学系14を含む並列な複数の構成を備え、当該複数の構成から反射ミラー511へ入力される複数のレーザ光がZ方向に間隔をあけて並んでもよい。なお、複数のレーザ光が間隔をあけて並ぶとは、複数のレーザ光の光軸が間隔をあけて並んでいることを意味する。 In the above-described configuration, the multiple step surfaces 40 are offset at a predetermined interval in the Z direction, in other words, their positions in the Z direction are different, so that the multiple laser beams reflected by the mirror 62 and traveling in the Y direction are aligned at intervals in the Z direction before being input to the reflecting mirror 511. In other words, the step portion 38 (step surface 40), the multiple semiconductor laser elements 12, the collimating lenses 58, 60, and the mirror 62 are arranged so that the multiple laser beams input to the reflecting mirror 511 are aligned at intervals in the Z direction. In this embodiment, the collimating lenses 58, 60 and the mirror 62 interposed between the semiconductor laser element 12 and the reflecting mirror 511 are referred to as the optical system 14. Each optical component included in the optical system 14 is an example of a first optical component. The configurations of the step portion 38, step surface 40, and optical system 14 are not limited to those illustrated in Figures 1 and 2, and may be any configuration that allows multiple laser beams input to the reflecting mirror 511 to be aligned at intervals in the Z direction. Furthermore, the semiconductor laser module 10 may include multiple parallel configurations including the step portion 38, step surface 40, and optical system 14, and the multiple laser beams input to the reflecting mirror 511 from these multiple configurations may be aligned at intervals in the Z direction. Note that "multiple laser beams aligned at intervals" means that the optical axes of the multiple laser beams are aligned at intervals.
図3は、光ファイバレーザに含まれるYbドープダブルクラッドファイバの波長に応じた吸収率の一例を示すグラフである。半導体レーザモジュール10が、主として、例えば、図3中の、中心波長λc:976[nm]の波長帯域B:λc±3[nm]の成分を含むレーザ光を出力する場合、当該半導体レーザモジュール10を励起光源の一部とし、増幅用ファイバとしてYbドープダブルクラッドファイバを含んで構成される光ファイバレーザの出力効率を、高めることができる。しかしながら、半導体レーザ素子12の通常のレーザ発振のみによって、主として当該波長帯域Bのレーザ光を出力するのは難しい。 Figure 3 is a graph showing an example of the absorption rate as a function of wavelength of a Yb-doped double-clad fiber included in an optical fiber laser. When the semiconductor laser module 10 outputs laser light that mainly contains components in wavelength band B: λc ± 3 nm with a center wavelength λc of 976 nm in Figure 3, for example, the semiconductor laser module 10 can be used as part of the excitation light source to increase the output efficiency of an optical fiber laser that includes a Yb-doped double-clad fiber as an amplification fiber. However, it is difficult to output laser light mainly in wavelength band B using only normal laser oscillation of the semiconductor laser element 12.
そこで、半導体レーザモジュール10では、VBG素子 (VBG:volume bragg grating)のような、特定の波長帯域の成分、すなわち上記波長帯域Bの成分を選択的に反射する反射ミラー511を設け、半導体レーザ素子12と反射ミラー511との間で外部共振器を構成する。これにより、主として、半導体レーザ素子12の発振波長とは異なる波長帯域Bのレーザ光を出力する、半導体レーザモジュール10を構成することができる。 The semiconductor laser module 10 is therefore provided with a reflective mirror 511, such as a VBG element (VBG: volume Bragg grating), that selectively reflects components of a specific wavelength band, i.e., components of the above-mentioned wavelength band B, and an external resonator is formed between the semiconductor laser element 12 and the reflective mirror 511. This makes it possible to configure a semiconductor laser module 10 that mainly outputs laser light of wavelength band B, which is different from the oscillation wavelength of the semiconductor laser element 12.
ただし、当該構成にあっては、外部共振器構造から出力され集光レンズ64,65を経由して光ファイバ68に結合されるレーザ光において、半導体レーザ素子12の駆動電力が大きくなるのに応じて、特に遅軸方向におけるビーム拡がり角が増大してしまうことが判明している。この場合、遅軸方向の拡がり角を物理的に制限するアパーチャを設けることが考えられるが、外部共振器構造から出力されたレーザ光に対して、遅軸方向の拡がり角を制限すると、当該制限された分により半導体レーザモジュール10からのレーザ光の出力が低下してしまう。 However, with this configuration, it has been found that the beam divergence angle, particularly in the slow axis direction, of the laser light output from the external resonator structure and coupled to the optical fiber 68 via the condenser lenses 64 and 65 increases as the driving power of the semiconductor laser element 12 increases. In this case, it is possible to provide an aperture that physically limits the divergence angle in the slow axis direction, but if the divergence angle in the slow axis direction of the laser light output from the external resonator structure is limited, the output of the laser light from the semiconductor laser module 10 will decrease by that amount.
そこで、発明者らは、鋭意研究を重ねた結果、マルチモードレーザ光に含まれる高次モード成分を除去するアパーチャ111を、外部共振器内に挿入し、当該アパーチャ111によってマルチモードレーザ光の高次モード成分を除去するよう構成することにより、アパーチャ111による出力低下を抑制しながら、レーザ光の遅軸方向の拡がり角を制限できることを見出すに至った。 As a result of extensive research, the inventors discovered that by inserting an aperture 111 that removes higher-order mode components contained in multimode laser light into the external resonator and configuring the aperture 111 to remove the higher-order mode components of the multimode laser light, it is possible to limit the divergence angle of the laser light in the slow axis direction while suppressing the output reduction caused by the aperture 111.
すなわち、本実施形態では、図1,2に示されるように、アパーチャ111は、外部共振器内、すなわち反射ミラー511と複数の半導体レーザ素子12との間に挿入されている。この場合、アパーチャ111においては、Z方向に間隔をあけて並んだ複数のレーザ光が通過する。すなわち、アパーチャ111は、当該Z方向に間隔をあけて並ぶレーザ光のそれぞれに対して、マルチモードレーザ光の高次成分を除去するよう、当該レーザ光の遅軸方向の幅を制限する。 In other words, in this embodiment, as shown in Figures 1 and 2, the aperture 111 is inserted inside the external resonator, i.e., between the reflecting mirror 511 and the multiple semiconductor laser elements 12. In this case, multiple laser beams spaced apart in the Z direction pass through the aperture 111. That is, the aperture 111 limits the width of the slow axis direction of each of the laser beams spaced apart in the Z direction so as to remove higher-order components of the multimode laser beam.
発明者らは、実験的な研究により、半導体レーザモジュール10に供給する同じ供給電流(2~15[A])の大きさに対するレーザ光の出力を、以下の(1)~(3)の三つの構成、すなわち、
(1)参考例1:アパーチャ111を全く備えない構成、
(2)参考例2:アパーチャ111を外部共振器内に替えて外部共振器外、すなわち反射ミラー511と集光レンズ64との間に、備えた構成、
(3)本実施形態:アパーチャ111を外部共振器内に備えた構成、
について比較した。
すると、参考例2の構成におけるレーザ光の出力の、参考例1の構成におけるレーザ光の出力に対する減少率は、2~18[%]であった。これに対し、本実施形態の構成におけるレーザ光の出力の、参考例1の構成におけるレーザ光の出力に対する減少率は、0~6[%]であった。このように、アパーチャ111を、参考例2のように外部共振器外ではなく、本実施形態のように外部共振器内に設けることにより、アパーチャ111を全く備えない構成(参考例1)に対する出力低下を、大幅に抑制できることを確認できた。
Through experimental research, the inventors have found that the laser light output for the same magnitude of supply current (2 to 15 A) supplied to the semiconductor laser module 10 can be improved by using the following three configurations (1) to (3):
(1) Reference Example 1: A configuration in which no aperture 111 is provided,
(2) Reference Example 2: A configuration in which the aperture 111 is provided outside the external resonator, i.e., between the reflecting mirror 511 and the condenser lens 64, instead of being provided inside the external resonator.
(3) This embodiment: A configuration in which the aperture 111 is provided inside the external resonator.
We compared the following.
As a result, the reduction rate of the laser light output in the configuration of Reference Example 2 relative to the laser light output in the configuration of Reference Example 1 was 2 to 18%. In contrast, the reduction rate of the laser light output in the configuration of this embodiment relative to the laser light output in the configuration of Reference Example 1 was 0 to 6%. In this way, it was confirmed that by providing the aperture 111 inside the external resonator as in this embodiment, rather than outside the external resonator as in Reference Example 2, it is possible to significantly suppress the reduction in output compared to the configuration (Reference Example 1) that does not include the aperture 111 at all.
図4は、アパーチャ111A(111)の具体的な構成例を示す斜視図である。アパーチャ111Aは、X方向における略一定の厚さおよびX方向における略一定の幅を有しZ方向に延びた矩形状かつ板状の形状を有する。当該アパーチャ111Aは、互いに平行に等間隔でZ方向に延びた二つの遮蔽部111aを有しており、当該二つの遮蔽部111a間に、Z方向に開放されたU字状かつ切欠状の開口Oが設けられている。アパーチャ111Aにおいて、Z方向に間隔をあけて並ぶ複数のレーザ光は、当該開口Oを通過する。当該複数のレーザ光がZ方向に間隔をあけて通る範囲において、X方向における開口Oの位置および幅Ws(遮蔽部111a間の間隔)は、Z方向の位置によらず一定である。そして、アパーチャ111Aにおける遅軸方向すなわちX方向における開口Oの幅Wsは、マルチモードレーザ光の高次成分を除去できる大きさに設定されている。図5は、半導体レーザモジュール10の一部を拡大して示す平面図である。図5に示されるように、半導体レーザ素子12の遅軸方向における発光幅をh、最大発散角をθ、さらに遅軸方向におけるコリメートレンズ60の焦点距離をfとした場合に、幅Wsを、例えば、
Ws<h+2f・tan(θ/2)
を満たすように設定する。当該構成において、遮蔽部111aは、レーザ光のY方向と交差した通過領域のX方向およびX方向の反対方向の端部においてレーザ光を部分的に遮ることにより、マルチモードレーザ光の高次成分を除去する。
FIG. 4 is a perspective view showing a specific configuration example of the aperture 111A (111). The aperture 111A has a rectangular, plate-like shape extending in the Z direction, with a substantially constant thickness and width in the X direction. The aperture 111A has two shielding portions 111a extending parallel to each other at equal intervals in the Z direction, and a U-shaped, notched opening O that opens in the Z direction is provided between the two shielding portions 111a. In the aperture 111A, multiple laser beams arranged at intervals in the Z direction pass through the opening O. Within the range through which the multiple laser beams pass at intervals in the Z direction, the position and width Ws of the opening O in the X direction (the interval between the shielding portions 111a) are constant regardless of the position in the Z direction. The width Ws of the opening O in the slow-axis direction of the aperture 111A, i.e., in the X direction, is set to a size that can remove high-order components of multimode laser beams. 5 is an enlarged plan view of a portion of the semiconductor laser module 10. As shown in FIG. 5, when the emission width in the slow axis direction of the semiconductor laser element 12 is h, the maximum divergence angle is θ, and the focal length in the slow axis direction of the collimator lens 60 is f, the width Ws can be expressed as, for example,
Ws<h+2f・tan(θ/2)
In this configuration, the shielding portion 111a removes higher-order components of the multimode laser beam by partially blocking the laser beam at the end portions in the X direction and the opposite direction to the X direction of the passage region that intersects with the Y direction of the laser beam.
また、アパーチャ111Aは、外部共振器構造において、半導体レーザ素子12から反射ミラー511へ向かうレーザ光、および反射ミラー511から半導体レーザ素子12へ向かうレーザ光の双方に対して、マルチモードレーザ光の高次成分を除去することができる。これにより、マルチモードレーザ光の高次成分を、より確実に除去することができる。 Furthermore, in the external resonator structure, aperture 111A can remove higher-order components of multimode laser light from both the laser light traveling from the semiconductor laser element 12 to the reflecting mirror 511 and the laser light traveling from the reflecting mirror 511 to the semiconductor laser element 12. This makes it possible to more reliably remove higher-order components of multimode laser light.
さらに、本実施形態のようにアパーチャ111が外部共振器内に設けられた構成についての発明者らの鋭意研究により、半導体レーザ素子12の前面反射率が低いほど、供給電流に対するレーザ光の出力効率をより高められることが判明した。これについて考察する。 Furthermore, through extensive research by the inventors into a configuration in which the aperture 111 is provided inside the external resonator, as in this embodiment, it was discovered that the lower the front surface reflectivity of the semiconductor laser element 12, the higher the laser light output efficiency relative to the supplied current. This will be considered below.
まず、反射ミラー511と半導体レーザ素子12の前面とを一つのミラーに置き換えた場合の実行反射率Reffは、次の式(1)のようになる。
式(1)から、半導体レーザ素子12のゲインgは、次の式(2)のように表せる。
式(2)から、外部共振器における閾値キャリア密度Nthは、次の式(3)のように表せる。
式(3)の閾値キャリア密度Nthは、レーザ発振に必要な電流量であり、この値が大きいほど、レーザ発振し難いこと、すなわち供給電流に対するレーザ光の出力(出力効率)が低いことを示す。
First, when the reflecting mirror 511 and the front surface of the semiconductor laser element 12 are replaced with one mirror, the effective reflectance R eff is given by the following equation (1).
From equation (1), the gain g of the semiconductor laser element 12 can be expressed as the following equation (2).
From equation (2), the threshold carrier density N th in the external resonator can be expressed as the following equation (3).
The threshold carrier density N th in equation (3) is the amount of current required for laser oscillation, and the larger this value is, the more difficult it is to oscillate the laser, i.e., the lower the laser light output (output efficiency) relative to the supplied current is.
図6は、結合効率Cと閾値キャリア密度Nthとの関係を、前面反射率Rfの二つの例について示したグラフである。図6から、前面反射率Rfが低いほど、閾値キャリア密度Nthが高くなる、すなわち、半導体レーザ素子12がより発振し難くなることがわかる。 6 is a graph showing the relationship between the coupling efficiency C and the threshold carrier density Nth for two examples of the front surface reflectivity Rf . As can be seen from FIG. 6, the lower the front surface reflectivity Rf , the higher the threshold carrier density Nth , i.e., the more difficult it is for the semiconductor laser device 12 to oscillate.
また、高次モード成分の結合効率Cは、0~0.2程度であると推定されるが、外部共振器内で当該高次モード成分を含む状態で、すなわちC=0~0.2となる成分を含んで発振しようとすると、図6から、より高い電力が必要となることがわかる。これに対し、本実施形態によれば、共振器(外部共振器)内でアパーチャ111によって高次モード成分を除去しながら発振することができるため、その分の電流の供給を低減することができ、これにより出力効率を高めることができるものと推定される。さらに、C=0~0.2となる成分での閾値キャリア密度Nthは、前面反射率Rfが低いほど増加傾向にあり、上述した高次モード成分除去による効果は、前面反射率Rfが低い半導体レーザ素子12において、より顕著に現れるものと推定される。 Furthermore, the coupling efficiency C of the higher-order mode component is estimated to be approximately 0 to 0.2. However, if oscillation is attempted in a state in which the higher-order mode component is included in the external resonator, i.e., when the component where C = 0 to 0.2 is included, as shown in Figure 6, a higher power is required. In contrast, according to this embodiment, oscillation can be achieved while removing the higher-order mode component in the resonator (external resonator) using the aperture 111, so the current supply can be reduced accordingly, and it is estimated that this can increase the output efficiency. Furthermore, the threshold carrier density Nth for the component where C = 0 to 0.2 tends to increase as the front surface reflectivity Rf decreases, and it is estimated that the effect of removing the above-mentioned higher-order mode component is more pronounced in semiconductor laser elements 12 with low front surface reflectivity Rf .
次に、反射ミラー511と半導体レーザ素子12の前面とを一つのミラーに置き換えた場合の光出力について考える。系前面からの光出力をPf、系後面からの光出力をPbとし、半導体レーザ素子12の出射端面手前での前進光をP’f、半導体レーザ素子12の背面手前での後退光をP’bとすると、P’bとP’fの関係は次の式(4)のように表せる。
そして、半導体レーザ素子12のスロープ効率SEは、次の式(6)のように表せる。
図7は、スロープ効率SEと半導体レーザ素子12の前面反射率Rfの関係を、式(6)に基づいて示したグラフである。ここでは、結合効率C=1、反射ミラー511の反射率RVBG=10[%]としている。反射ミラー511の反射率は大きくなるほど、ミラー損失が増加し光出力が低下するため、10[%]程度の値を採用することが一般的である。図7から、前面反射率Rfが小さくなるほど、スロープ効率SEが高くなることがわかる。さらに、スロープ効率SEは、半導体レーザ素子12の前面反射率が2[%]以下の領域で、より増加傾向になることがわかる。
実験およびシミュレーションによる発明者らの鋭意研究により、上述したような観点から、半導体レーザ素子12の前面反射率は、2[%]以下であるのが好ましく、0.5[%]以下であるのがより好ましいことが判明した。また、当該前面反射率は、0.01[%]以上に設定される。さらに、このような外部共振器を構成する反射ミラー511の反射率は、4[%]以上であるのが好ましいことが判明した。これは、波長選択性を担保するためである。
Next, consider the optical output when the reflecting mirror 511 and the front surface of the semiconductor laser element 12 are replaced with a single mirror. If the optical output from the front surface of the system is Pf , the optical output from the rear surface of the system is Pb , the forward light just before the emission end surface of the semiconductor laser element 12 is P'f , and the backward light just before the rear surface of the semiconductor laser element 12 is P'b , the relationship between P'b and P'f can be expressed by the following equation (4):
The slope efficiency SE of the semiconductor laser device 12 can be expressed by the following equation (6).
FIG. 7 is a graph showing the relationship between the slope efficiency SE and the front surface reflectivity Rf of the semiconductor laser element 12 based on equation (6). Here, the coupling efficiency C is set to 1, and the reflectivity R VBG of the reflecting mirror 511 is set to 10%. Since the higher the reflectivity of the reflecting mirror 511, the greater the mirror loss and the lower the optical output, so a value of about 10% is generally used. It can be seen from FIG. 7 that the smaller the front surface reflectivity Rf , the higher the slope efficiency SE. Furthermore, it can be seen that the slope efficiency SE tends to increase when the front surface reflectivity of the semiconductor laser element 12 is 2% or less.
Through extensive research by the inventors through experiments and simulations, it has been found that, from the above-mentioned perspective, the front surface reflectance of the semiconductor laser element 12 is preferably 2% or less, and more preferably 0.5% or less. Furthermore, the front surface reflectance is set to 0.01% or more. Furthermore, it has been found that the reflectance of the reflecting mirror 511 constituting such an external resonator is preferably 4% or more. This is to ensure wavelength selectivity.
以上、説明したように、本実施形態の半導体レーザモジュール10によれば、所望の波長帯域のレーザ光を出力可能であるとともに、遅軸方向の拡がり角を制限しながら、かつ出力効率を高めることが可能となる、すなわち、無駄なエネルギ消費の少なくすることが可能となる。 As explained above, the semiconductor laser module 10 of this embodiment is capable of outputting laser light in a desired wavelength band, while limiting the divergence angle in the slow axis direction and increasing output efficiency, i.e., reducing unnecessary energy consumption.
また、本実施形態では、アパーチャ111と反射ミラー511とは互いに離隔している。当該構成によれば、例えば、アパーチャ111の設置位置や姿勢(角度)を反射ミラー511とは別個に調整することができるという利点が得られる。 Furthermore, in this embodiment, the aperture 111 and the reflecting mirror 511 are spaced apart from each other. This configuration has the advantage that, for example, the installation position and attitude (angle) of the aperture 111 can be adjusted separately from the reflecting mirror 511.
[第2実施形態]
図8は、第2実施形態の半導体レーザモジュール10に含まれるアパーチャ111B(111)を示す斜視図である。当該アパーチャ111Bは、上記第1実施形態の半導体レーザモジュール10のアパーチャ111Aに替えて設けることができ、当該構成においても、アパーチャ111を備えたことによる効果が得られる。
Second Embodiment
8 is a perspective view showing the aperture 111B (111) included in the semiconductor laser module 10 of the second embodiment. The aperture 111B can be provided in place of the aperture 111A of the semiconductor laser module 10 of the first embodiment, and the effect of providing the aperture 111 can be obtained even in this configuration.
ただし、本実施形態のアパーチャ111Bでは、二つの遮蔽部111aが互いに別体として構成されている。この場合、二つの遮蔽部111a間の隙間Gの幅Wsを微調整することにより、半導体レーザモジュール10の出力特性の調整が可能になるという利点が得られる。 However, in the aperture 111B of this embodiment, the two shielding portions 111a are configured as separate bodies. In this case, the advantage is that the output characteristics of the semiconductor laser module 10 can be adjusted by fine-tuning the width Ws of the gap G between the two shielding portions 111a.
[第3実施形態]
図9は、第3実施形態の半導体レーザモジュール10の一部の平面図である。図9に示される構成は、上記第1実施形態の半導体レーザモジュール10において置き換えて設けることができ、当該構成においても、アパーチャ111を備えたことによる効果が得られる。
[Third embodiment]
9 is a plan view of a portion of the semiconductor laser module 10 of the third embodiment. The configuration shown in FIG. 9 can be provided in place of the semiconductor laser module 10 of the first embodiment, and the effect of providing the aperture 111 can also be obtained with this configuration.
ただし、本実施形態のアパーチャ111は、反射ミラー511と一体化されている。この場合、アパーチャ111および反射ミラー511を別個にベース24に装着する場合に比べて、半導体レーザモジュール10の製造に要する手間やコストを低減できる場合がある。この場合、ベース24には、アパーチャ111および反射ミラー511のサブアセンブリのうちアパーチャ111のみがベース24と固定されてもよいし、サブアセンブリのうち反射ミラー511のみがベース24と固定されてもよい。なお、アパーチャ111または反射ミラー511は、例えば、紫外線硬化性の接着剤のような接合材を介してベース24上に固定される。 However, in this embodiment, the aperture 111 is integrated with the reflecting mirror 511. In this case, the effort and cost required to manufacture the semiconductor laser module 10 may be reduced compared to when the aperture 111 and reflecting mirror 511 are separately attached to the base 24. In this case, only the aperture 111 of the subassembly of the aperture 111 and reflecting mirror 511 may be fixed to the base 24, or only the reflecting mirror 511 of the subassembly may be fixed to the base 24. The aperture 111 or reflecting mirror 511 is fixed to the base 24 via a bonding material such as an ultraviolet-curing adhesive.
[第4実施形態]
図10は、第4実施形態の半導体レーザモジュール10の遅軸方向に見た複数の半導体レーザ素子12、反射ミラー511、および二つの集光レンズ64,65を示す例示的な模式図である。本実施形態でも、第1実施形態と同様に、一つの反射ミラー511と、Z方向の位置が異なる複数の半導体レーザ素子12との間に、外部共振器が構成される。当該構成にあっては、図10に示されるように、反射ミラー511は、Y方向における厚さが一定でY方向と直交するように設けられ、Z方向に分散された複数のレーザ光が、互いに平行な状態でY方向に進み、当該反射ミラー511に略直角に入射し、Y方向の反対方向に反射されるのが好ましい。ここで、集光レンズ64に入射するレーザ光が互いに平行な状態でY方向に進む際に、当該複数のレーザ光の光ファイバ68への結合効率が最大になる状態について、考察する。
[Fourth embodiment]
10 is an exemplary schematic diagram showing the plurality of semiconductor laser elements 12, a reflecting mirror 511, and two condenser lenses 64 and 65 of the semiconductor laser module 10 of the fourth embodiment as viewed in the slow-axis direction. In this embodiment, as in the first embodiment, an external resonator is configured between one reflecting mirror 511 and the plurality of semiconductor laser elements 12 positioned at different positions in the Z direction. In this configuration, as shown in FIG. 10 , the reflecting mirror 511 is preferably disposed so as to have a constant thickness in the Y direction and be perpendicular to the Y direction. Preferably, the plurality of laser beams dispersed in the Z direction travel parallel to each other in the Y direction, are incident on the reflecting mirror 511 at approximately right angles, and are reflected in the opposite direction to the Y direction. Here, we consider a state in which the coupling efficiency of the plurality of laser beams to the optical fiber 68 is maximized when the laser beams incident on the condenser lens 64 travel parallel to each other in the Y direction.
図11は、球面レンズ(円柱面レンズ)として構成された集光レンズ64Rを含む場合の参考例を遅軸方向に見た模式図である。図11に示されるように、集光レンズ64Rが球面レンズとして構成された場合にあっては、当該集光レンズ64Rの収差のため、反射ミラー511に放射状に入射されるレーザ光に対して、所望の結合効率が得られる。言い換えると、反射ミラー511に略直角に入射する複数のレーザ光に対しては、所望の結合効率が得られ難くなる。 Figure 11 is a schematic diagram of a reference example including a condenser lens 64R configured as a spherical lens (cylindrical lens) viewed in the slow axis direction. As shown in Figure 11, when the condenser lens 64R is configured as a spherical lens, the aberration of the condenser lens 64R makes it possible to obtain the desired coupling efficiency for laser light that is radially incident on the reflecting mirror 511. In other words, it becomes difficult to obtain the desired coupling efficiency for multiple laser light beams that are incident on the reflecting mirror 511 at approximately right angles.
そこで、本実施形態では、集光レンズ64を非球面(非円柱面)のシリンドリカルレンズとすることで、図10の状態を実現している。これにより、一つの反射ミラー511と、Z方向の位置が異なる複数の半導体レーザ素子12との間に外部共振器を構成するとともに、各外部共振器からの複数のレーザ光を、一つの光ファイバ68の端部の収束点に集光し、所望の結合効率で結合することができる。集光レンズ64は、第一レンズの一例である。 In this embodiment, the state shown in Figure 10 is achieved by using an aspherical (non-cylindrical) cylindrical lens as the focusing lens 64. This allows an external resonator to be formed between one reflecting mirror 511 and multiple semiconductor laser elements 12 positioned at different positions in the Z direction, and multiple laser beams from each external resonator can be focused onto a convergence point at the end of one optical fiber 68 and combined with the desired coupling efficiency. The focusing lens 64 is an example of a first lens.
[第5実施形態]
図12は、第5実施形態の光ファイバレーザ94の例示的な概略構成図である。光ファイバレーザ94は、光源装置80、ポンプコンバイナ96、希土類添加光ファイバ98、出力光ファイバ100、高反射FBG102(FBG:fiber bragg grating)、および低反射FBG104を備えている。
Fifth Embodiment
12 is an exemplary schematic diagram of an optical fiber laser 94 according to the fifth embodiment. The optical fiber laser 94 includes a light source device 80, a pump combiner 96, a rare-earth doped optical fiber 98, an output optical fiber 100, a high-reflection FBG 102 (fiber bragg grating (FBG)), and a low-reflection FBG 104.
光源装置80は、光ファイバレーザ94の励起光源として機能するものであり、複数の上記実施形態の半導体レーザモジュール10を並列に有している。各半導体レーザモジュール10から出力されるレーザ光を伝送する光ファイバ68の出力端は、複数入力1出力のポンプコンバイナ96の複数の入力ポートに、それぞれ結合されている。ポンプコンバイナ96の出力ポートには、希土類添加光ファイバ98の入力端が接続されている。希土類添加光ファイバ98の出力端には、出力光ファイバ100の入力端が接続されている。なお、複数の半導体レーザモジュール10から出力されるレーザ光を希土類添加光ファイバ98に入力する入力部としては、ポンプコンバイナ96に代えて他の構成を用いることもできる。例えば、半導体レーザモジュール10に対応した光ファイバ68を並べて配置し、複数の光ファイバ68から出力されたレーザ光を、レンズを含む光学系等の入射部を用いて、希土類添加光ファイバ98の入力端に入射させるように構成してもよい。このようにして、本実施形態の光源装置80を励起光源する光ファイバレーザ94が構成されている。 The light source device 80 functions as an excitation light source for the optical fiber laser 94 and has multiple semiconductor laser modules 10 of the above embodiment arranged in parallel. The output ends of the optical fibers 68 that transmit the laser light output from each semiconductor laser module 10 are respectively coupled to multiple input ports of a multiple-input, single-output pump combiner 96. The output port of the pump combiner 96 is connected to the input end of a rare-earth-doped optical fiber 98. The output end of the rare-earth-doped optical fiber 98 is connected to the input end of an output optical fiber 100. Note that instead of the pump combiner 96, other configurations can be used as the input section that inputs the laser light output from the multiple semiconductor laser modules 10 into the rare-earth-doped optical fiber 98. For example, optical fibers 68 corresponding to the semiconductor laser modules 10 can be arranged side by side, and the laser light output from the multiple optical fibers 68 can be input to the input end of the rare-earth-doped optical fiber 98 using an input section such as an optical system including a lens. In this manner, the optical fiber laser 94 that serves as an excitation light source for the light source device 80 of this embodiment is configured.
光ファイバレーザ94において、半導体レーザモジュール10のそれぞれから出力されたレーザ光は、光ファイバ68を経由してポンプコンバイナ96により結合され、その出力ポートから出力される。入力部としてのポンプコンバイナ96は、その出力ポートから出力された励起光としてのレーザ光を、希土類添加光ファイバ98の入力端に入力する。光ファイバレーザ94においては、希土類添加光ファイバ98、高反射FBG102、および低反射FBG104によって、共振器が構成されている。光ファイバ68およびポンプコンバイナ96は、光学部品の一例である。 In the optical fiber laser 94, the laser light output from each of the semiconductor laser modules 10 is combined by the pump combiner 96 via the optical fiber 68 and output from its output port. The pump combiner 96, which serves as an input section, inputs the laser light output from its output port as excitation light to the input end of the rare-earth doped optical fiber 98. In the optical fiber laser 94, a resonator is formed by the rare-earth doped optical fiber 98, the high-reflection FBG 102, and the low-reflection FBG 104. The optical fiber 68 and pump combiner 96 are examples of optical components.
希土類添加光ファイバ98では、伝搬する励起光が、コアにドープされた希土類元素に吸収されて、基底準位と準安定準位との間に反転分布が生じて光が放出される。こうして放出された光は、希土類添加光ファイバ98の光増幅作用と高反射FBG102および低反射FBG104とともに構成される共振器の作用とによってレーザ発振する。こうして、光ファイバレーザ94において、レーザ発振によりレーザ光が生じる。生じたレーザ光は、希土類添加光ファイバ98の出力端に接続された出力光ファイバ100の出力端から出力される。希土類添加光ファイバ98は、例えば、Ybドープダブルクラッドファイバであり、増幅用ファイバの一例である。 In the rare-earth-doped optical fiber 98, the propagating pump light is absorbed by the rare-earth element doped in the core, causing a population inversion between the ground state and metastable state, resulting in the emission of light. The emitted light undergoes laser oscillation due to the optical amplification action of the rare-earth-doped optical fiber 98 and the action of the resonator formed by the high-reflection FBG 102 and the low-reflection FBG 104. In this way, laser oscillation generates laser light in the optical fiber laser 94. The generated laser light is output from the output end of the output optical fiber 100 connected to the output end of the rare-earth-doped optical fiber 98. The rare-earth-doped optical fiber 98 is, for example, an Yb-doped double-clad fiber, and is an example of an amplification fiber.
以上、本発明の実施形態が例示されたが、上記実施形態は一例であって、発明の範囲を限定することは意図していない。上記実施形態は、その他の様々な形態で実施されることが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、組み合わせ、変更を行うことができる。また、各構成や、形状、等のスペック(構造や、種類、方向、型式、大きさ、長さ、幅、厚さ、高さ、数、配置、位置、材質等)は、適宜に変更して実施することができる。 The above describes exemplary embodiments of the present invention, but the above embodiments are merely examples and are not intended to limit the scope of the invention. The above embodiments can be implemented in a variety of other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the spirit of the invention. Furthermore, the specifications of each configuration, shape, and the like (structure, type, direction, model, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be modified as appropriate.
本発明は、半導体レーザモジュール、光源装置、および光ファイバレーザに利用することができる。 The present invention can be used in semiconductor laser modules, light source devices, and optical fiber lasers.
10…半導体レーザモジュール
12…半導体レーザ素子
14…光学系
18…出力部
20…端子部
24…ベース
38…段差部
40…段差面
42…サブマウント
58…コリメートレンズ(第一光学部品)
60…コリメートレンズ(第一光学部品)
62…ミラー(第一光学部品)
64…集光レンズ(第一レンズ)
64R…集光レンズ
65…集光レンズ
68…光ファイバ(出力光ファイバ、光学部品)
80…光源装置
94…光ファイバレーザ
96…ポンプコンバイナ(光学部品)
98…希土類添加光ファイバ(増幅用光ファイバ)
100…出力光ファイバ
102…高反射FBG
104…低反射FBG
111,111A,111B…アパーチャ
111a…遮蔽部
511…反射ミラー
B…波長帯域
G…隙間
O…開口
Ws…幅
X…方向
Y…方向
Z…方向
λc…中心波長
10... Semiconductor laser module 12... Semiconductor laser element 14... Optical system 18... Output section 20... Terminal section 24... Base 38... Step section 40... Step surface 42... Submount 58... Collimating lens (first optical component)
60...Collimating lens (first optical component)
62...Mirror (first optical component)
64...Condenser lens (first lens)
64R... condenser lens 65... condenser lens 68... optical fiber (output optical fiber, optical component)
80...light source device 94...optical fiber laser 96...pump combiner (optical component)
98...Rare earth doped optical fiber (optical fiber for amplification)
100... output optical fiber 102... high-reflection FBG
104...Low reflection FBG
111, 111A, 111B... aperture 111a... shielding portion 511... reflecting mirror B... wavelength band G... gap O... opening Ws... width X... direction Y... direction Z... direction λc... center wavelength
Claims (11)
前記複数の半導体レーザ素子から出力されたレーザ光を前記速軸方向に間隔をあけて並べる第一光学部品と、
前記半導体レーザ素子から出力され前記速軸方向に間隔をあけて並んだ光のうち特定の波長帯域の成分を反射し、前記複数の半導体レーザ素子との間で外部共振器を構成する反射ミラーと、
前記外部共振器内に設けられ、前記速軸方向に間隔をあけて並んだレーザ光からマルチモードレーザ光の高次モード成分を除去するよう、当該レーザ光の前記遅軸方向の幅を制限するアパーチャと、
前記外部共振器から出力されたレーザ光を出力光ファイバに結合する集光レンズと、
を備えた、半導体レーザモジュール。 a plurality of semiconductor laser elements each outputting multimode laser light as laser light and having fast axis directions and slow axis directions that are substantially the same;
a first optical component that arranges the laser beams output from the plurality of semiconductor laser elements at intervals in the fast axis direction;
a reflecting mirror that reflects components of a specific wavelength band among the light beams output from the semiconductor laser elements and arranged at intervals in the fast axis direction, and that forms an external resonator between itself and the plurality of semiconductor laser elements;
an aperture provided in the external resonator and configured to limit a width of the laser beam in the slow axis direction so as to remove higher-order mode components of multimode laser beams from the laser beams arranged at intervals in the fast axis direction;
a focusing lens that couples the laser light output from the external resonator into an output optical fiber;
A semiconductor laser module comprising:
前記反射ミラーは、前記複数の平行なレーザ光を前記複数の半導体レーザ素子に反射する、請求項1に記載の半導体レーザモジュール。 the condensing lens includes a first lens as an aspherical lens that condenses the plurality of parallel laser beams dispersed in the fast axis direction to a convergence point at an end of the output optical fiber,
2. The semiconductor laser module according to claim 1, wherein the reflecting mirror reflects the plurality of parallel laser beams toward the plurality of semiconductor laser elements.
増幅用光ファイバと、
前記光源装置から出力されたレーザ光を前記増幅用光ファイバに導く光学部品と、
を備えた、光ファイバレーザ。 The light source device according to claim 9 ;
an amplifying optical fiber;
an optical component that guides the laser light output from the light source device to the amplification optical fiber;
An optical fiber laser comprising:
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