WO2025204887A1 - Laser processing device and laser processing method - Google Patents

Abstract

Provided are a laser processing device and a laser processing method which are capable of performing processing by accurately irradiating a target position with laser light. Specifically, this laser processing device 100 comprises: a laser light irradiation unit 10 that irradiates a wiring pattern 2, which is an object, with laser light L; a visible light imaging unit 20 that acquires a visible light image 50v by imaging a visualization member 50 that generates visible light Lv for position identification at the position irradiated with the laser light L; and a control unit 60 that, on the basis of the position of the visible light Lv for position identification captured in the visible light image 50v, adjusts the relative positions between the irradiation position of the laser light L and the wiring pattern 2 so that the wiring pattern 2 is irradiated with the laser light L, and laser processing is performed on the wiring pattern 2.

Description

Laser processing device and laser processing method

This invention relates to a laser processing device and a laser processing method, and in particular to a laser processing device and a laser processing method that adjusts the irradiation position of laser light based on a visible light image.

Conventionally, a laser processing device and a laser processing method are known that adjust the irradiation position of laser light based on a visible light image (see, for example, Patent Document 1).

Patent Document 1 discloses a laser processing device that forms a processing groove on a wafer by irradiating it with laser light along the street, which is the target position for processing. Patent Document 1 uses UV (ultraviolet light) with a wavelength of 400 nm or less, outside the visible light range, as the laser used for processing. The laser processing device in Patent Document 1 also performs alignment detection by capturing an image of the wafer with a digital camera and detecting the position of the street, which is the target position, based on the captured visible light observation image. The laser processing device in Patent Document 1 then uses the alignment detection results obtained based on the visible light observation image to align the optical axis of the focusing lens with one end of the street to be processed, thereby aligning the processing position where the laser light is irradiated.

Japanese Patent Application Laid-Open No. 2022-17863

As described above, Patent Document 1 discloses a configuration in which alignment detection results obtained based on a visible light observation image are used to align the optical axis of a focusing lens with one end of a street on a workpiece to align the processing position where laser light is irradiated. However, the irradiation position of the laser irradiation light can change over time and due to changes in ambient temperature, which can cause the actual irradiation position of the laser light to deviate from the target irradiation position. In this case, if the laser processing device aligns the processing position by laser light irradiation using alignment detection results obtained based on a visible light observation image, as in Patent Document 1, it is thought that it will not be able to detect changes in the irradiation position of laser light, such as infrared laser light, which does not appear in visible light images. Therefore, if alignment is performed without taking changes in the irradiation position of the laser light into consideration, the laser light may not be irradiated at the target irradiation position, particularly when the workpiece is very small, resulting in insufficient processing of the workpiece. Therefore, there is a need for a laser processing device and laser processing method that can accurately irradiate infrared laser light at the target position to process the workpiece.

This invention was made to solve the above-mentioned problems, and one object of this invention is to provide a laser processing device and laser processing method that can accurately irradiate infrared laser light onto a target position to perform processing.

In order to achieve the above object, a laser processing device according to a first aspect of the present invention comprises a laser light irradiation unit that irradiates an object with infrared laser light; a visible light imaging unit that acquires a visible light image by imaging a visualization member that generates position-identifying visible light at the position irradiated with the infrared laser light; and a control unit that performs laser processing on the object by adjusting the relative position of the infrared laser light irradiation position and the object based on the position of the position-identifying visible light captured in the visible light image so that the object is irradiated with infrared laser light.

A laser processing device according to a first aspect of the present invention is equipped with a control unit that performs laser processing of an object by adjusting the relative position between the infrared laser light irradiation position and the object so that the infrared laser light is irradiated on the object based on the position of the position-identifying visible light shown in the visible light image. This makes it possible to confirm the infrared laser light irradiation position, which normally cannot be imaged by the visible light imaging unit, using the position-identifying visible light, and then adjust the relative position between the infrared laser light irradiation position and the object to an appropriate position. As a result, it is possible to accurately irradiate the infrared laser light at the target position and perform processing.

In the laser processing device according to the above aspect, the control unit is preferably configured to acquire the positional relationship between the target position to be irradiated with the infrared laser light and the actual irradiation position based on the position of the position-identifying visible light shown in the visible light image, and thereby adjust the relative position of the irradiation position of the infrared laser light and the object so that the infrared laser light is irradiated onto the object. With this configuration, the position of the infrared laser light, which cannot normally be captured by the visible light imaging unit, can be acquired using the position-identifying visible light, and the positional relationship, such as the deviation from the target position, can be acquired. As a result, information on how much the position should be adjusted can be acquired based on the positional relationship, and the relative position of the irradiation position of the infrared laser light and the object can be adjusted so that the object is appropriately irradiated with the infrared laser light.

In this case, the control unit is preferably configured to acquire the positional relationship based on the position of the position-identifying visible light shown in the visible light image and a reference position set in the visible light image. This configuration makes it possible to easily acquire the positional relationship between the actual irradiation position of the infrared laser light and the reference position through image processing. As a result, it is possible to easily adjust the relative position of the irradiation position of the infrared laser light and the target object.

In a laser processing device that acquires a positional relationship based on the position of the position-identifying visible light shown in the visible light image and a reference position set in the visible light image, the control unit is preferably configured to acquire corrected processing position information by correcting processing position information set for processing the object based on the positional relationship, and to adjust the relative position between the infrared laser light irradiation position and the object based on the acquired corrected processing position information so that the object is irradiated with infrared laser light. This configuration makes it possible to acquire corrected processing position information by correcting the processing position information set for processing the object based on the position-identifying visible light that indicates the laser light irradiation position. As a result, even if the laser light irradiating unit is unable to irradiate the infrared laser light at the target position, the infrared laser light can be appropriately irradiated onto the object at the target position based on the corrected processing position information.

The laser processing device according to the above aspect preferably further includes a stage on which the object and visualization member are placed, and which moves the relative positions of the visible light imaging unit and the visualization member; when acquiring a visible light image, the control unit moves the stage so that the visualization member is positioned so that it appears in the visible light imaging unit, and when irradiating the object with infrared laser light, moves the stage so that the object is positioned so that it can be irradiated with infrared laser light. With this configuration, since the visualization member is also placed on the stage on which the object is placed, correction processing for position adjustment and laser processing of the object can be carried out smoothly.

The laser processing device according to the above aspect preferably further includes an alignment camera that captures an image of the object to confirm the processing position on the object, and the alignment camera also serves as a visible light image capture unit. With this configuration, it is possible to use the alignment camera for confirming the processing position to acquire a visible light image for adjusting the relative position between the infrared laser light irradiation position and the object, without providing a separate camera for adjusting the infrared laser light irradiation position. As a result, the device can be made more compact.

The laser processing method according to this second aspect includes a visible light image acquisition step of acquiring a visible light image by capturing an image of a visualization member that generates position-identifying visible light at the position irradiated with infrared laser light; an adjustment step of adjusting the relative position between the irradiation position of the infrared laser light and the object based on the position of the position-identifying visible light captured in the visible light image so that the object is irradiated with infrared laser light; and a processing step of processing the object by irradiating it with infrared laser light.

As described above, the laser processing method according to the second aspect comprises an adjustment step of adjusting the relative position between the infrared laser light irradiation position and the object so that the infrared laser light is irradiated onto the object based on the position of the position-identifying visible light shown in the visible light image, and a processing step of processing the object by irradiating it with infrared laser light. This makes it possible to confirm the infrared laser light irradiation position, which normally cannot be imaged by the visible light imaging unit, using the position-identifying visible light, and then adjust the relative position between the infrared laser light irradiation position and the object to an appropriate position. As a result, it is possible to provide a laser processing method that can accurately irradiate laser light onto a target position to process an object.

As described above, the present invention provides a laser processing device and a laser processing method that can accurately irradiate a target position with infrared laser light.

1 is a diagram showing a configuration of a laser processing apparatus according to an embodiment; FIG. 2 is a diagram illustrating an object on a wafer according to an embodiment. 1 is a flowchart illustrating a process of a laser processing method according to an embodiment. 10A and 10B are diagrams for explaining a visualization member imaged by an alignment camera according to an embodiment.

Below, one embodiment of the present invention will be described with reference to the drawings.

[Embodiment]
The configuration of a laser processing apparatus 100 according to this embodiment will be described with reference to FIG.

(Configuration of laser processing device)
1, the laser processing apparatus 100 includes a laser light irradiation unit 10, a mirror 11, a visible light camera 20, a mirror 21, a visible light illuminator 30, a mirror 31, a stage 40, a moving mechanism 41, a visualization member 50, and a control unit 60. In the drawing, the left-right direction of the laser processing apparatus 100 (one direction in a horizontal plane) is defined as the X direction. The up-down direction (vertical direction) of the laser processing apparatus 100 is defined as the Z direction. The direction perpendicular to the X and Z directions of the laser processing apparatus 100 (the other direction in a horizontal plane) is defined as the Y direction.

The laser light irradiation unit 10 is a light source that emits laser light L with a near-infrared wavelength (near-infrared light), for example, a wavelength of 780 nm or more and less than 2500 nm, and is configured to irradiate the laser light L onto the wiring pattern 2 on the wafer 1, which is the object to be processed. Note that the laser light L cannot be captured by a visible light imaging system such as the visible light camera 20. The laser light irradiation unit 10 is controlled by the control unit 60 and is configured to emit the laser light L intermittently so that the irradiation time intervals are uniform. The spot diameter of the laser light L irradiated onto the wiring pattern 2 provided on the wafer 1, which is the object, is, for example, 3 μm. The laser light L is an example of "infrared laser light" in the claims.

Mirror 11 is, for example, a half mirror capable of reflecting and transmitting light with wavelengths in the infrared region, and has the function of reflecting part of the laser light L and transmitting part of it. Mirror 11 is also positioned so that it can reflect the laser light L so that its direction of travel is changed by 90°. As a result, laser light L emitted from laser light emitting unit 10 in the X2 direction is reflected by mirror 11 and irradiated in the Z2 direction. Furthermore, part of the laser light L reflected in the Z1 direction by reflecting mirror 70 is transmitted through mirror 11 in the Z1 direction. In this embodiment, the positional relationship and angle between laser light emitting unit 10 and mirror 11 are fixed.

The visible light camera 20 is, for example, a digital camera, and is capable of capturing magnified images of the wafer 1 and wiring pattern 2. The visible light camera 20 has an internal imaging element (not shown) that is sensitive to light of visible wavelengths. The visible light camera 20 is also equipped with an infrared filter (not shown) to prevent laser light L from entering the lens. This allows the visible light camera 20 to capture images of the wafer 1, etc. reflected by the mirror 21, and obtain visible light images 50v (see Figure 4) showing the visualization member 50. The visible light camera 20 is also used to perform alignment detection to confirm the processing position of the wiring pattern 2 to be processed. The visible light camera 20 is an example of the "visible light imaging unit" and "alignment camera" in the claims.

Mirror 21 is positioned so that reflected light from wafer 1, etc., is incident on visible light camera 20. Mirror 21 is, for example, a dichroic mirror that transmits light with wavelengths in the infrared region and reflects light with wavelengths in the visible region. Therefore, mirror 21 transmits laser light L irradiated from the Z1 direction and can reflect visible light reflected from the Z2 direction so that the direction of travel of the reflected light changes by 90° in the Y direction.

The visible light illuminator 30 is a lighting device that emits light of at least visible wavelengths. The visible light illuminator 30 is configured to emit visible light continuously. The mirror 31 is, for example, a dichroic mirror that transmits light with wavelengths in the infrared region and reflects light with wavelengths in the visible region. The mirror 31 is also a half mirror for visible light, and has the function of reflecting part of the visible light and transmitting part of it. Therefore, the mirror 31 transmits the laser light L emitted from the Z1 direction in the Z2 direction, reflects the visible light emitted by the visible light illuminator 30 from the X1 direction so as to change the direction of travel to the Z2 direction, and allows the reflected visible light reflected from the Z2 direction to transmit in the Z1 direction.

The stage 40 has a flat top plate on which the wafer 1 can be placed. A visualization member 50 is fixed to the side of the stage 40 by a fastening member (not shown). The stage 40 also includes a movement mechanism 41, and is configured to be movable in at least the X and Y directions. This allows the movement mechanism 41, controlled by the control unit 60, to move the relative position of the laser light L and the wafer 1 placed on the top plate of the stage 40.

The visualization member 50 generates position-identifying visible light Lv (see Figure 4) at the position irradiated with the laser light L in order to identify the position irradiated with the laser light L. The visualization member 50 is configured to absorb and retain the light energy as electrons using the principle of electron trapping by irradiating the paint applied to the surface with short-wavelength light such as visible light. The visualization member 50 is also configured to excite the retained electrons and emit them as visible light by irradiating it with light such as near-infrared light, which has a longer wavelength than visible light. As a result, when irradiated with laser light L, the visualization member 50 emits position-identifying visible light Lv (see Figure 4) at the irradiation position Lc (see Figure 4). The visualization member 50 also reflects the laser light L without transmitting it. The visualization member 50 is replaceable if deterioration such as surface burn-in occurs due to irradiation with laser light L, and is replaced after a specified irradiation time, a specified number of irradiations, or periodically.

The control unit 60 includes, for example, a processor such as a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), and GPU (Graphics Processing Unit). The control unit 60 is configured to execute a program (software) to perform various controls of the laser light irradiation unit 10, visible light camera 20, and movement mechanism 41 in accordance with the laser processing process flow (see Figure 3) described below. Details of the control performed by the control unit 60 will be described later.

(Laser processing method)
Next, a laser processing method in this embodiment for irradiating a target position with laser light L with high precision will be described with reference to Figures 1 to 4. The following description will be given in accordance with the process flow of the laser processing method shown in Figure 3, which is executed by the control unit 60. In this embodiment, the series of steps S1 to S5 described above is performed, for example, every time the wafer 1 to be processed is replaced.

In this embodiment, as shown in Figure 2, which shows an enlarged view of the wafer 1 placed on the stage 40, the wafer 1 includes a wiring pattern 2 on its surface. The wiring pattern 2 is an electrically connected pattern, for example, with a width of 10 μm in the X direction and 1 μm in the Y direction. Depending on the circuit configured on the surface of the wafer 1, it may be desirable to cut the wiring pattern 2. In this case, the control unit 60 stores the coordinates of a target point P, which is the center of gravity of the wiring pattern 2, acquired in advance as processing position information for irradiating the wiring pattern 2 with laser light L to perform laser processing to cut the wiring pattern 2. The wafer 1 includes multiple wiring patterns 2 (not shown), and the control unit 60 stores the coordinates of multiple target points P in advance as laser processing position information.

When the control unit 60 receives an input operation from the operator to start laser processing, the following process is executed. First, as the movement process of step S1, the control unit 60 controls the movement mechanism 41 to move the stage 40 so that the laser light L emitted from the laser light emission unit 10 is irradiated onto the visualization member 50. At this time, the visualization member 50 is positioned so that the laser light L reflected by the mirror 11 and emitted in the Z2 direction is irradiated onto the center position (reference position) of the visualization member 50. Note that at this point, the laser light emission unit 10 is not emitting laser light L. Then, the process proceeds to step S2.

Next, in the visible light image acquisition process of step S2, the control unit 60 acquires a visible light image 50v and acquires the position of the position-identifying visible light Lv. Specifically, the control unit 60 first turns on the visible light illuminator 30 and starts emitting laser light L using the laser light irradiation unit 10. Note that the irradiation power (output) of the laser light L in step S2 is, for example, approximately 10% of the irradiation power used when actually processing the wiring pattern 2. At this time, the control unit 60 also uses the visible light camera 20 to capture the position-identifying visible light Lv emitted by the visualization member 50 via the mirror 31, and acquires a visible light image 50v as shown in FIG. 4. Note that in this embodiment, the control unit 60 acquires the visible light image 50v so that the center of the visualization member 50 coincides with the center of the visible light image 50v. Then, the process proceeds to step S4.

In the positional relationship acquisition process of step S3, the control unit 60 acquires the positional relationship of the irradiation position Lc of the laser light L relative to the imaging area of the visible light camera 20. Here, when the laser light irradiation unit 10 irradiates the laser light L at the center position of the visualization member 50 as intended, the irradiation position Lc, which is the center of the position-identifying visible light Lv, is displayed at the position of center point c1, which indicates the center position of the visualization member 50 and is located at the center of the visible light image 50v captured by the visible light camera 20. On the other hand, for example, if the laser light L irradiated by the laser light irradiation unit 10 shifts due to ambient temperature or the passage of time, as shown in FIG. 4, the irradiation position Lc, which is the center of the position-identifying visible light Lv in the visible light image 50v, is displayed at the position of coordinates (xa, ya) with center point c1 as the reference. In other words, the laser light L is irradiated with a shift of xa in the X direction and ya in the Y direction relative to the target irradiation position (center point c1). Note that xa is a negative value and ya is a positive value. At this time, the control unit 60 acquires this amount of deviation as positional relationship information. Then, the process proceeds to step S4.

In the processing position information correction process of step S4, the control unit 60 corrects the coordinates of multiple target points P stored as laser processing position information based on the positional relationship information, and acquires corrected processing position information. Specifically, if the coordinates of target point P stored as laser processing position information are (Px, Py), the control unit 60 acquires corrected coordinates (Px-xa, Py-ya) as corrected laser processing position information. Note that if there is multiple pieces of laser processing position information stored, the above correction is made to each coordinate. Note that this processing position information correction process is an example of an "adjustment process" in the claims. Then, the process proceeds to step S5.

In the processing step of step S5, the control unit 60 controls the laser light irradiation unit 10 and the movement mechanism 41 to move the stage 40 so that the target point P of the wiring pattern 2 is positioned at the corrected coordinates (Px-xa, Py-ya) acquired as the corrected processing position information. The control unit 60 also performs laser processing by irradiating the wiring pattern 2 with laser light L, cutting the wiring pattern 2. This completes the laser processing process.

(Effects of this embodiment)
Next, the effects of this embodiment will be described.

The laser processing device 100 of the above embodiment is equipped with a control unit 60 that adjusts the relative position between the irradiation position Lc of the laser light L and the wiring pattern 2 so that the laser light L is irradiated onto the wiring pattern 2 based on the position of the position-identifying visible light Lv reflected in the visible light image 50v, thereby performing laser processing of the wiring pattern 2. This makes it possible to confirm the irradiation position Lc of the laser light L, which normally cannot be captured by the visible light camera 20, using the position-identifying visible light Lv, and then adjust the relative position between the irradiation position Lc of the laser light L and the wiring pattern 2 to an appropriate position. As a result, the laser light L can be accurately irradiated onto the target position to perform processing.

In the above embodiment, the control unit 60 is configured to obtain the positional relationship between the target position to be irradiated with the laser light L and the actual irradiation position Lc based on the position of the position-identifying visible light Lv captured in the visible light image 50v, and adjust the irradiation position Lc of the laser light L so that the laser light L is irradiated onto the wiring pattern 2. This makes it possible to obtain the irradiation position Lc of the laser light L, which normally cannot be captured by the visible light camera 20, using the position-identifying visible light Lv, and to obtain the positional relationship, such as the deviation from the target position. As a result, information on how much the position should be adjusted can be obtained based on the positional relationship, and the relative position of the irradiation position Lc of the laser light L and the wiring pattern 2 can be adjusted so that the laser light L is appropriately irradiated onto the wiring pattern 2.

Furthermore, in the above embodiment, the control unit 60 is configured to obtain the positional relationship based on the position of the position-identifying visible light Lv shown in the visible light image 50v and the center point c1, which is a reference position set in the visible light image 50v. This makes it possible to easily obtain the positional relationship between the actual irradiation position Lc of the laser light L and the center point c1, which is the reference position, through image processing. As a result, the relative position between the irradiation position Lc of the laser light L and the wiring pattern 2 can be easily adjusted.

In addition, in the above embodiment, the control unit 60 is configured to acquire corrected processing position information obtained by correcting the processing position information set for processing the wiring pattern 2 based on the positional relationship, and to adjust the irradiation position Lc of the laser light L based on the acquired corrected processing position information so that the laser light L is irradiated onto the wiring pattern 2. This makes it possible to acquire corrected processing position information obtained by correcting the processing position information set for processing the wiring pattern 2 based on the position-identifying visible light Lv that indicates the irradiation position Lc of the laser light L. As a result, even if the laser light irradiation unit 10 is unable to irradiate the infrared laser light at the target position, the laser light L can be appropriately irradiated onto the object at the target position based on the corrected processing position information.

The above embodiment also includes a stage 40 on which the wiring pattern 2 and visualization member 50 are disposed and which moves the positions of the visible light camera 20 and the visualization member 50 relative to one another; when acquiring a visible light image 50v, the control unit 60 moves the stage 40 so that the visualization member 50 is positioned so that it appears on the visible light camera 20; and when irradiating the wiring pattern 2 with laser light L, the control unit 60 moves the stage 40 so that the wiring pattern 2 is positioned so that it can be irradiated with laser light L. With this configuration, the visualization member 50 is also disposed on the stage 40 on which the wafer 1 including the wiring pattern 2 is placed, so that correction processing for position adjustment and laser processing of the wiring pattern 2 can be carried out smoothly.

Furthermore, in the above embodiment, the visible light camera 20 that captures an image of the wiring pattern 2 in order to confirm the processing position of the wafer 1 including the wiring pattern 2 also serves as the visible light imaging unit. With this configuration, it is possible to acquire a visible light image 50v for adjusting the irradiation position Lc of the laser light L using the visible light camera 20 for confirming the processing position, without providing a separate camera for positioning the irradiation position Lc of the laser light L. As a result, the laser processing device 100 can be made more compact.

[Modification]
It should be noted that the embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims rather than the description of the above embodiments, and further includes all modifications (variations) within the meaning and scope equivalent to the claims.

For example, in the above embodiment, the control unit 60 acquires the positional relationship between the target position to be irradiated with the laser light L and the actual irradiation position Lc based on the position of the position-identifying visible light Lv shown in the visible light image 50v, and thereby adjusts the relative position of the irradiation position Lc of the laser light L and the wiring pattern 2 so that the laser light L is irradiated onto the wiring pattern 2. However, the present invention is not limited to this. In the present invention, for example, the positional relationship between the position of the position-identifying visible light Lv shown in the visible light image 50v and a mark provided on the visualization member 50 may be acquired, and the irradiation position Lc of the laser light L may be adjusted based on this positional relationship so that the laser light L is irradiated onto the wiring pattern 2.

In addition, in the above embodiment, an example was shown in which the control unit 60 was configured to obtain the positional relationship based on the position of the position-identifying visible light Lv captured in the visible light image 50v and a reference position, the center point c1, set at the center of the visible light image 50v, but the present invention is not limited to this. In the present invention, the reference position set in the visible light image 50v does not have to be the center point c1; the reference position can be set anywhere as long as the coordinates can be identified.

In addition, in the above embodiment, the control unit 60 acquires corrected processing position information by correcting the processing position information set for processing the wiring pattern 2 based on the positional relationship, and adjusts the irradiation position Lc of the laser light L so that the laser light L is irradiated onto the wiring pattern 2 based on the acquired corrected processing position information, but the present invention is not limited to this. In the present invention, for example, when processing is performed at a position confirmed in the visible light image 50v without setting processing position information, such as when there are few processing locations, the control unit 60 may irradiate the laser light L at a position adjusted to correspond to the positional relationship acquired by confirming the visible light image 50v, without acquiring corrected processing position information.

In addition, in the above embodiment, an example was shown in which the stage 40 on which the wiring pattern 2 and visualization member 50 are disposed is further provided, and which moves the positions of the visible light camera 20 and the visualization member 50 relative to one another; when acquiring the visible light image 50v, the control unit 60 moves the stage 40 so that the visualization member 50 is positioned so that it is visible to the visible light camera 20; and when irradiating the wiring pattern 2 with laser light L, the control unit 60 moves the stage 40 so that the wiring pattern 2 is positioned so that it can be irradiated with the laser light L; however, the present invention is not limited to this. In the present invention, for example, the visualization member 50 may be provided separately from the stage 40, and may be positioned so that it can be imaged by the visible light camera 20 when acquiring the visible light image 50v.

Furthermore, in the above embodiment, an example was shown in which the visible light camera 20, which captures an image of the wiring pattern 2 in order to confirm the processing position of the wafer 1 including the wiring pattern 2, is also used as the visible light imaging unit, but the present invention is not limited to this. In the present invention, an imaging device may be provided separately from the visible light camera 20.

Furthermore, in the above embodiment, an example was shown in which the processing position information for the wiring pattern 2 provided on the wafer 1 is corrected each time the wafer 1 is replaced, but the present invention is not limited to this. In the present invention, the processing position information may be corrected at any timing, for example, at predetermined intervals or each time the control unit 60 is started. Furthermore, the object to be processed by the laser processing device 100 is not limited to the wiring pattern 2 provided on the wafer 1, and may be any material that can be melted by the energy of the laser light L.

In addition, in the above embodiment, an example was shown in which the position of the laser light emitting unit 10 was fixed and the position of the stage 40 was changed by the movement mechanism 41 to change the irradiation position Lc of the laser light L, but the present invention is not limited to this. For example, the present invention may be configured such that a galvanometer control system consisting of a galvanometer mirror and an fθ lens is provided on the optical axis of the laser light L emitted from the laser light emitting unit 10, and the irradiation position Lc of the laser light L may be changed by changing the orientation (angle) of the galvanometer mirror.

Furthermore, in the above embodiment, an example was shown in which the laser light L emitted from the laser light irradiation unit 10 was near-infrared light, but the present invention is not limited to this. In the present invention, the laser light L emitted from the laser light irradiation unit 10 may be mid-infrared light with a wavelength of 2500 or more and less than 4000 nm, or far-infrared light with a wavelength of 4000 nm or more.

Furthermore, in the above embodiment, an example was shown in which the visible light image 50v was acquired so that the center of the visualization member 50 coincided with the center of the visible light image 50v, but the present invention is not limited to this. In the present invention, it is sufficient that the visualization member 50 appears in the visible light image 50v. If the center of the visible light image 50v and the center of the visualization member 50 do not coincide, the positional relationship information may be corrected, for example, by adding a mark to the visualization member 50 for acquiring the positional relationship and acquiring the positional relationship of the irradiation position Lc of the laser light L relative to the mark added to the visualization member 50.

1 Wafer 2 Wiring (object)
10 Laser light irradiation unit 20 Alignment camera (visible light imaging unit)
30 Visible light illumination 40 Stage 50 Visualization member 50v Visible light image 60 Control unit L Laser light (infrared laser light)
Lc: Irradiation position of infrared laser light Lv: Visible light for position identification P: Target point

Claims (7)

a laser light irradiation unit that irradiates an infrared laser light toward an object;
a visible light imaging unit that captures an image of a visualization member that generates position-identifying visible light at a position irradiated with the infrared laser light, thereby acquiring a visible light image;
and a control unit that adjusts the relative position of the infrared laser light irradiation position and the object so that the infrared laser light is irradiated onto the object based on the position of the position-identifying visible light that appears in the visible light image, thereby performing laser processing of the object. The laser processing device of claim 1, wherein the control unit is configured to acquire the positional relationship between the target position to be irradiated with the infrared laser light and the actual irradiation position based on the position of the position-identifying visible light reflected in the visible light image, and thereby adjust the relative position between the irradiation position of the infrared laser light and the object so that the infrared laser light is irradiated onto the object. The laser processing device of claim 2, wherein the control unit is configured to acquire the positional relationship based on the position of the position-identifying visible light reflected in the visible light image and a reference position set in the visible light image. The laser processing device of claim 3, wherein the control unit is configured to acquire corrected processing position information by correcting processing position information set for processing the object based on the positional relationship, and to adjust the relative position between the irradiation position of the infrared laser light and the object based on the acquired corrected processing position information so that the infrared laser light is irradiated onto the object. a stage on which the object and the visualization member are placed and which moves the positions of the visible light imaging unit and the visualization member relative to one another;
2. The laser processing apparatus according to claim 1, wherein, when acquiring the visible light image, the control unit moves the stage so that the visualization member is positioned so that it appears in the visible light imaging unit, and, when irradiating the object with the infrared laser light, moves the stage so that the object is positioned so that it can be irradiated with the infrared laser light. The laser processing device of claim 1, further comprising an alignment camera that captures an image of the object to confirm the processing position of the object, the alignment camera also serving as the visible light imaging unit. a visible light image acquisition step of acquiring a visible light image by capturing an image of a visualization member that generates visible light for position identification at a position irradiated with the infrared laser light;
an adjusting step of adjusting a relative position between the irradiation position of the infrared laser light and the object based on a position of the position-identifying visible light shown in the visible light image so that the infrared laser light is irradiated onto the object;
a processing step of processing the object by irradiating the object with the infrared laser light.