WO2025204743A1 - Substrate holding device - Google Patents

Abstract

Provided is a substrate holding device which enables a substrate to be securely suction-attached to a stage. Specifically, the substrate holding device 10 comprises: a stage 11 which has a flat surface 12 on which a substrate W1 is mounted and to which the substrate W1 can be suction-attached; a plurality of support pins 15 which are disposed in a portion 13 of the stage 11 having the flat surface 12 and which have a tip end on which the substrate W1 is mounted; a plurality of outer guide pins 18 which are disposed in a portion of the stage 11 around the flat surface 12; and a pressing member 25 which is capable of descending from a retracted position above the flat surface 12. The support pins 15 can be displaced between an upper position in which the tip end projects upward from the flat surface 12 and a lower position where the tip end is lower than the flat surface 12. The outer guide pins 18 are disposed so as to be capable of contacting the outer peripheral edge of the substrate W1, which is mounted on the support pins 15 displaced to the lower position, from a plurality of directions. The pressing member 25 descends from the retracted position and pushes the substrate W1 onto the flat surface 12.

Description

Substrate holding device

The present invention relates to a substrate holding device.

In the manufacturing process of various substrates, such as substrates for semiconductor wafers, display substrates, or color filters, the substrates are subjected to various processes, such as a coating process in which a liquid is applied to the substrate. In these processes, the substrate may be held on a stage. For example, Patent Document 1 discloses a coating device that applies a liquid to a substrate. This coating device has a device that holds the substrate for the coating process.

JP 2012-69833 A

The device for holding the substrate has a stage on which the substrate is placed. The stage can hold the substrate along the flat surface (top surface) of the stage by adsorbing the substrate. Then, for example, a liquid ejected from a coating head of the coating device is applied to the top surface of the substrate.
Here, if the substrate is warped (warping deformation), even if the substrate is placed on the flat surface of the stage, it may not conform to the flat surface and the substrate may not be held securely.

The present invention therefore aims to provide a substrate holding device that can reliably hold a substrate on a stage by suction.

The substrate holding device of the present invention comprises a stage having a flat surface on which a substrate is placed and capable of adsorbing the substrate; a plurality of support pins arranged on the portion of the stage having the flat surface and having tips on which the substrate rests; a plurality of outer guide pins arranged on the portion of the stage surrounding the flat surface; and a presser member that can be lowered from a retracted position above the flat surface, wherein the support pins are movable between an upper position where their tips protrude above the flat surface and a lower position where their tips are below the flat surface, and the plurality of outer guide pins are positioned so that they can contact the outer edge of the substrate, which rests on the support pins that are displaced to the lower position, from multiple directions; and the presser member descends from the retracted position and presses the substrate against the flat surface with the support pins in the lower position.

With the substrate holding device of the present invention, even if the substrate is warped, the warp is corrected by the pressing member, and the stage sucks and holds the substrate. The substrate is securely sucked and held on the stage.

FIG. 1 is an explanatory diagram of a coating apparatus having a substrate holding device of the present invention. FIG. 2 is a plan view showing an example of a substrate holding device. FIG. 3 is a cross-sectional view of the substrate holding device shown in FIG. 1 as seen from the side. FIG. 4 is an explanatory diagram of the operation of the substrate holding device. FIG. 5 is an explanatory diagram of the operation of the substrate holding device. FIG. 6 is an explanatory diagram of the operation of the substrate holding device. FIG. 7 is a plan view showing a state in which the substrate holding device holds the first substrate. FIG. 8 is a plan view showing a state in which the substrate holding device holds the second substrate. FIG. 9 is an explanatory diagram showing how the second substrate is placed on the stage. FIG. 10 is an explanatory diagram showing a state in which the second substrate is pressed against the mounting surface by the second pressing member. FIG. 11A is an explanatory diagram of a convex portion of the first pressing member shown in FIGS. 2 and 3. FIG. FIG. 11B is an explanatory diagram showing a first modified example of the protrusion. FIG. 11C is an explanatory diagram showing a second modified example of the protrusion. FIG. 11D is an explanatory diagram showing a third modified example of the protrusion. FIG. 12A is an explanatory diagram of a pressing member that can press along the edge of a substrate over a wide range. FIG. 12B is an explanatory diagram showing a first modified example of the pressing member. FIG. 12C is an explanatory diagram showing a second modified example of the pressing member. FIG. 12D is an explanatory diagram showing a third modified example of the pressing member. FIG. 13 is an explanatory diagram showing a state in which the pressing member presses the substrate against the stage.

<Outline of the embodiment of the present invention>
Hereinafter, an outline of an embodiment of the present invention will be listed and described.
(1) A substrate holding device of the present invention comprises a stage having a flat surface on which a substrate is placed and capable of adsorbing the substrate; a plurality of support pins arranged on the portion of the stage having the flat surface and having tips on which the substrate is placed; a plurality of outer guide pins arranged on the portion of the stage surrounding the flat surface; and a pressing member that can be lowered from a retracted position above the flat surface, wherein the support pins are displaceable between an upper position in which the tips protrude above the flat surface and a lower position in which the tips are below the flat surface, and the plurality of outer guide pins are arranged so as to be able to contact, from multiple directions, the outer edge of the substrate placed on the support pins that are displaced to the lower position, and the pressing member descends from the retracted position to press the substrate against the flat surface while the support pins are in the lower position.

In the substrate holding device, the substrate is placed on the tips of the support pins. When the support pins are displaced to the lower position, the outer periphery of the substrate can contact the outer guide pins from multiple directions, and the substrate is lowered while being positioned by the outer guide pins.
When the support pins reach their lower positions, the substrate rests on the flat surface of the stage. When the pressing members descend, they press the substrate onto the flat surface. At this time, the support pins are in their lower positions. Even if the substrate is warped, the warping is corrected by the pressing members, and the stage sucks and holds the substrate. As a result, the substrate is securely sucked and held on the stage.

(2) The substrate holding device of (1) further includes a plurality of inner guide pins arranged closer to the center of the flat surface than the plurality of outer guide pins, and a second pressing member that can be lowered from a retracted position above the flat surface, wherein the plurality of support pins are arranged in the portion having the flat surface so as to be able to support a second substrate that is smaller than the first substrate, the plurality of inner guide pins are displaceable between an upper position in which their tips protrude above the flat surface and a lower position in which their tips are below the flat surface, the plurality of inner guide pins are arranged so as to be able to contact, from multiple directions, the outer edge of the second substrate that rests on the support pins that are displaced to the lower position, and the second pressing member is lowered from the retracted position to press the second substrate against the flat surface with the support pins in the lower position.

In the case of a substrate holding device having the above configuration, in addition to the substrate (1) (first substrate), it is possible to hold a second substrate that is smaller than the first substrate on the stage. As with the substrate (1), the second substrate is supported by the support pins and, when lowered, is positioned by the inner guide pins. Even if the second substrate is warped, it is corrected by the second pressing member, and the stage adsorbs and holds the second substrate. The substrate holding device can be used for two types of substrates with different outline sizes.

(3) In the substrate holding device of (1) or (2), the outer guide pin has a tapered tip.
Even if the substrate placed on the support pins displaced to the lower position comes into contact with the tip of the outer guide pin, the substrate slides along the tapered tip and moves toward the stage along the outer guide pin, where it is positioned.

(4) In the substrate holding device of (2), the inner guide pin has a tapered tip.
Even if the second substrate placed on the support pin displaced to the lower position comes into contact with the tip of the inner guide pin, the second substrate slides along the tapered tip and moves toward the stage along the inner guide pin, where it is positioned.

(5) In the substrate holding device according to any one of (1) to (4), the pressing member has a protrusion for partially contacting the substrate.
The portion of the pressing member that comes into contact with the substrate is a convex portion, which makes it possible to reduce the contact area of the pressing member with the substrate.

(6) In the substrate holding device of (5), the convex portion has a cross-sectional contour shape that becomes smaller toward the substrate.
The portion where the pressing member comes into contact with the substrate is the tip (lower end) of the convex portion, which makes it possible to further reduce the contact area of the pressing member with the substrate.
This is preferred when it is desirable to avoid the substrate coming into contact with other items as much as possible.

(7) Alternatively, depending on the type of warping of the substrate, it may be preferable for the pressing member to press over a wide area along the edge of the substrate. In this case, in any one of the substrate holding devices (1) to (4) above, the pressing member has a linear portion that contacts the edge of the substrate.

(8) In any one of the substrate holding devices (1) to (7), the outer guide pin is displaceable between an upper position in which its tip protrudes above the flat surface and a lower position in which its tip is below the flat surface.
When processing (e.g., coating processing) the substrate held on the stage, and when the substrate is removed from the stage after the processing, the outer guide pins are in the lower position so that they do not get in the way.

<Details of the embodiment of the present invention>
Hereinafter, the details of the embodiments of the present invention will be described.
[Overall configuration of the substrate holding device]
Fig. 1 is an explanatory diagram of a coating apparatus having a substrate holding device of the present invention. The coating apparatus 5 shown in Fig. 1 has a substrate holding device 10, a coating head 7 that ejects a liquid, and a drive device 8 that moves a stage 11 of the substrate holding device 10 relative to the coating head 7. The substrate holding device 10 suction-holds a substrate W1 (W2). The substrate holding device 10 of this embodiment can hold either a first substrate W1 or a second substrate W2, which have different sizes.

While the stage 11 of the substrate holding device 10 and the coating head 7 are moved relative to each other by the drive device 8, the liquid ejected from the coating head 7 is applied to the upper surface of the substrate W1 (W2) held by the substrate holding device 10 (stage 11). As a result, a coating film having a predetermined shape is formed on the substrate W1 (W2).
The substrate W1 (W2) is, for example, a substrate for a semiconductor wafer, a substrate for a display, or a substrate for a color filter.

Fig. 2 is a plan view showing an example of the substrate holding device 10. Fig. 3 is a cross-sectional view of the substrate holding device 10 shown in Fig. 1 as seen from the side. Figs. 4, 5, and 6 are explanatory views of the operation of the substrate holding device 10.
The substrate holding device 10 of this embodiment includes a stage 11, a plurality of support pins 15, a plurality of outer guide pins 18, a plurality of inner guide pins 22, a first pressing member 25, and a second pressing member 27. The substrate holding device 10 further includes a suction device 41 (see FIG. 2).

[About Stage 11]
The stage 11 has, as its upper surface, a flat surface (mounting surface) 12 on which the substrate W1 is placed. Although not shown, the stage 11 has a number of through holes opening on the flat surface 12. Alternatively, the stage 11 has porous holes. The suction device 41 has air flow paths 42 connecting to the many through holes (or porous holes). The suction device 41 has, for example, a suction pump 411. The suction pump 411 sucks air on the flat surface 12 through the through holes (or porous holes) and the air flow paths 42. This allows the stage 11 to adsorb the substrate W1 placed on the flat surface 12 (see FIGS. 5 and 6).

[Regarding the support pin 15]
The plurality of support pins 15 are arranged on a portion 13 of the stage 11 that has a flat surface 12. In the present embodiment (see FIG. 2), five support pins 15 are arranged separately on the stage 11. The support pins 15 are needle-shaped (thin columnar) members that are long in the vertical direction.
The stage 11 has a portion 13 having a flat surface 12, and is provided with holes 131 in the same number as the support pins 15 (see FIG. 3). One support pin 15 is provided in each hole 131.

Each of the multiple support pins 15 can be raised and lowered in the hole 131. The substrate holding device 10 has an actuator (not shown) that raises and lowers the multiple support pins 15. The actuator is located below the stage 11. The multiple support pins 15 rise and lower in synchronization. The actuator is configured, for example, with a lifting member and a motor that moves the lifting member up and down.

Each of the multiple support pins 15 has a tip 16 on which the substrate W1 rests. Hereinafter, the tip 16 of the support pin 15 may be referred to as the "support pin tip 16." The support pin tip 16 has a tapered shape that narrows toward the top.

The support pin 15 is displaceable between an upper position Pu (see FIG. 3) and a lower position Pd (see FIGS. 4, 5, and 6). The upper position Pu is a position where the support pin tip 16 protrudes above the flat surface 12. The lower position Pd is a position where the support pin tip 16 is below the flat surface 12. This displacement is performed by the actuator (not shown) for the support pin 15.
With the support pins 15 in the upper position Pu (see FIG. 3), a transport robot (not shown) carries the first substrate W1 onto the stage 11 and places it on the support pins 15.

Figure 7 is a plan view showing the state in which the substrate holding device 10 is holding a first substrate W1. The substrates that the stage 11 can hold include not only the first substrate W1 but also a second substrate W2, which has a different contour size. Figure 8 is a plan view showing the state in which the substrate holding device 10 is holding a second substrate W2. The second substrate W2 is smaller than the substrate W1. On the stage 11 (flat surface 12), the second substrate W2 is placed inside the range in which the first substrate W1 is placed.

Like the first substrate W1, the second substrate W2 can also be placed on the tips 16 of multiple support pins 15. In other words, the multiple support pins 15 are arranged in a portion 13 having a flat surface 12 so as to be able to support the second substrate W2 (see Figure 8). On the stage 11 (flat surface 12), the multiple support pins 15 are arranged within the range in which the second substrate W2 will be placed.

In this embodiment, five support pins 15 are arranged on the stage 11, but this number can be changed and may be four. The square sides of the rectangular substrate W1 (W2) are supported from below by four support pins 15. When there are five support pins 15, the center of the substrate W1 (W2) is supported by one support pin 15. Note that the number of support pins 15 is not limited to four or five.

As shown in Figures 3 and 4, when the first substrate W1 is placed on the tip 16 of the support pin and the support pin 15 is displaced from the upper position Pu to the lower position Pd, the first substrate W1 is placed on the flat surface 12 of the stage 11.
In this embodiment, the first substrate W1 is warped (warpage deformation), and is placed on a plurality of support pins 15 (FIG. 3), and the warped first substrate W1 is placed on the flat surface 12 (FIG. 4). The operation of placing the second substrate W2 on the flat surface 12 is the same as that for the first substrate W1.

[Regarding the outer guide pin 18]
The plurality of outer guide pins 18 are arranged in a peripheral portion 14 of the flat surface 12 of the stage 11. The upper surface of the peripheral portion 14 of the flat surface 12 forms a common plane with the flat surface 12. In the present embodiment (see FIG. 2), eight outer guide pins 18 are arranged separately on the stage 11. The outer guide pins 18 are columnar members that are long in the vertical direction.
The stage 11 has holes 132 in the peripheral portion 14 of the flat surface 12, the number of which is the same as the number of outer guide pins 18 (see FIG. 3). One outer guide pin 18 is provided in one hole 132.

Each of the multiple outer guide pins 18 can be raised and lowered in the hole 132. The substrate holding device 10 has an actuator (not shown) that raises and lowers the multiple outer guide pins 18. The actuator is located below the stage 11. The multiple outer guide pins 18 rise and lower in synchronization. The actuator is configured, for example, with a lifting member and a motor that moves the lifting member up and down.

Each of the outer guide pins 18 has a tapered tip 19. Hereinafter, the tip 19 of the outer guide pin 18 may be referred to as the "outer pin tip 19." The outer pin tip 19 has a tapered shape that narrows toward the top.
The outer guide pin 18 is displaceable between an upper position Qu (see FIGS. 3, 4, and 5) and a lower position Qd (see FIG. 6). The upper position Qu is a position where the outer pin tip 19 protrudes above the flat surface 12. The lower position Qd is a position where the outer pin tip 19 is below the flat surface 12. This displacement is performed by the actuator (not shown) for the outer guide pin 18.

The outer guide pins 18 are arranged on both sides of each corner E1 of the rectangular first substrate W1 (see Figure 7). For this reason, eight outer guide pins 18 are provided on the stage 11. Two outer guide pins 18 can come into contact with one side of the first substrate W1.

The outer guide pins 18 have a columnar shape with a circular cross section. Therefore, the outer guide pins 18 can come into point contact with part of the outer peripheral edge W1e of the first substrate W1. In other words, the outer guide pins 18 have contact points 181 on their side surfaces that can come into contact with part of the outer peripheral edge W1e of the first substrate W1.
In a plan view, the range of the rectangle connecting the contact points 181 of the eight outer guide pins 18 is slightly larger than the outline shape of the first substrate W1.

As described above, the multiple (eight) outer guide pins 18 are positioned so that they can contact the outer peripheral edge W1e of the first substrate W1, which is placed on the support pins 15 (support pin tips 16) that are displaced from the upper position Pu to the lower position Pd, from multiple directions, as shown in Figures 3 and 4.

In this embodiment (see FIG. 7), the outer guide pins 18 are arranged so as to be able to come into contact with the outer periphery W1e of the first substrate W1 from four directions, i.e., front, rear, left and right.
However, as described above, the range of the rectangle connecting the contact points 181 of the eight outer guide pins 18 is slightly larger than the outline shape of the first substrate W1, and therefore, not all eight outer guide pins 18 come into contact with the descending first substrate W1, but rather only some of the eight outer guide pins 18. The outer guide pins 18 may come into contact with the outer peripheral edge W1e of the first substrate W1 from two of the four directions, front, back, left, and right (for example, from the front and right).

In this way, when the support pins 15 are displaced to the lower position Pd, the outer peripheral edge W1e of the first substrate W1 placed on the support pins 15 can come into contact with the eight outer guide pins 18 from multiple directions (for example, from the front and right), and the first substrate W1 descends while being positioned by these outer guide pins 18. The first substrate W1 is positioned so that it fits within the area inside the eight outer guide pins 18. When the support pins 15 reach the lower position Pd, the substrate W1 rests on the flat surface 12 of the stage 11 (see Figure 4).

As mentioned above, the outer guide pins 18 have tapered outer pin tips 19. Therefore, even if the first substrate W1 placed on the support pins 15 displaced to the lower position Pd comes into contact with the outer pin tips 19, the first substrate W1 will slide along the tapered outer pin tips 19 and move along the outer guide pins 18 toward the stage 11, where it will be positioned.

[Regarding the inner guide pin 22]
The multiple inner guide pins 22 function to position the second substrate W2, which is smaller than the first substrate W1. Fig. 9 is an explanatory diagram showing how the second substrate W2 placed on the support pin tips 16 is placed on the stage 11 (flat surface 12) by the lowering of the support pins 15.

The multiple inner guide pins 22 are arranged in the portion 13 of the stage 11 that has the flat surface 12. To explain this arrangement more specifically (see Figure 2), the multiple inner guide pins 22 are arranged closer to the center of the flat surface 12 than the multiple (8) outer guide pins 18. The multiple inner guide pins 22 are arranged closer to the outer guide pins 18 than the multiple (5) support pins 15.

In this embodiment (see FIG. 2), eight inner guide pins 22 are arranged separately on the stage 11. The inner guide pins 22 are columnar members that are long in the vertical direction.
The stage 11 has a portion 13 having a flat surface 12, and is provided with holes 133 in the same number as the inner guide pins 22 (see FIGS. 3 and 9). One inner guide pin 22 is provided in one hole 133.

Each of the multiple inner guide pins 22 can be raised and lowered in the hole 133. The substrate holding device 10 has an actuator (not shown) that raises and lowers the multiple inner guide pins 22. The actuator is located below the stage 11. The multiple inner guide pins 22 rise and lower in synchronization. The actuator is configured, for example, with a lifting member and a motor that moves the lifting member up and down.

Each of the multiple inner guide pins 22 has a tapered tip 23. Hereinafter, the tip 23 of the inner guide pin 22 may be referred to as the "inner pin tip 23." The inner pin tip 23 has a tapered shape that narrows toward the top.
The inner guide pin 22 is displaceable between an upper position Ru (see FIG. 9) and a lower position Rd (see FIGS. 3, 4, 5, and 6). The upper position Ru is a position where the inner pin tip 23 protrudes above the flat surface 12. The lower position Rd is a position where the inner pin tip 23 is below the flat surface 12. This displacement is performed by the actuator (not shown) for the inner guide pin 22.

The inner guide pins 22 are arranged on both sides of each corner E2 of the rectangular second substrate W2 (see Figure 8). For this purpose, eight inner guide pins 22 are provided on the stage 11. Two inner guide pins 22 can come into contact with one side of the second substrate W2.

The inner guide pin 22 has a columnar shape with a circular cross section. Therefore, the inner guide pin 22 can come into point contact with a part of the outer circumferential edge W2e of the second substrate W2. In other words, the inner guide pin 22 has a contact point 221 on its side surface that can come into contact with a part of the outer circumferential edge W2e of the second substrate W2.
In a plan view, the range of a rectangle connecting the contact points 221 of the eight inner guide pins 22 is slightly larger than the outline shape of the second substrate W2.

As described above, the multiple (eight) inner guide pins 22 are arranged so as to be able to contact the outer edge W2e of the second substrate W2 placed on the support pin 15 (support pin tip 16) displacing from the upper position Pu to the lower position Pd from multiple directions, as shown in Figures 9 and 10.
FIG. 10 is an explanatory diagram showing a state in which the second substrate W2 placed on the flat surface 12 is pressed onto the flat surface 12 by a second pressing member 27, which will be described later.

In this embodiment (see FIG. 8), the inner guide pins 22 are arranged so as to be able to come into contact with the outer periphery W2e of the second substrate W2 from four directions, i.e., front, rear, left and right.
However, as described above, the range of the rectangle connecting the contact points 221 of the eight inner guide pins 22 is slightly larger than the outline shape of the second substrate W2, and therefore, the descending second substrate W2 does not come into contact with all eight inner guide pins 22, but rather with some of the eight inner guide pins 22. The inner guide pins 22 may come into contact with the outer peripheral edge W2e of the second substrate W2 from two of the four directions, front, back, left, and right (for example, from the front and right).

In this way, when the support pins 15 are displaced to the lower position Pd, the outer peripheral edge W2e of the second substrate W2 placed on the support pins 15 can come into contact with the eight inner guide pins 22 from multiple directions (for example, from the front and right), and the second substrate W2 descends while being positioned by these inner guide pins 22. The second substrate W2 is positioned so that it fits within the area inside the eight inner guide pins 22. When the support pins 15 reach the lower position Pd, the substrate W2 rests on the flat surface 12 of the stage 11 (see Figure 9).

As mentioned above, the inner guide pin 22 has a tapered inner pin tip 23. Therefore, even if the second substrate W2 placed on the support pin 15 displaced to the lower position Pd comes into contact with the inner pin tip 23, the second substrate W2 will slide along the tapered inner pin tip 23 and move along the inner guide pin 22 toward the stage 11, where it will be positioned.

[Regarding the first pressing member 25]
The first pressing member 25 is provided on the flat surface 12 of the stage 11 and is movable up and down (see FIGS. 3 and 5). The substrate holding device 10 has an actuator (not shown) that raises and lowers the first pressing member 25. The actuator is located above the stage 11. The actuator is configured to include, for example, a lifting member and a motor that moves the lifting member up and down. The first pressing member 25 is attached to the lifting member via a first lifting rod 61.

The first pressing member 25 is movable between a retracted position S1 (see Figure 3) above the flat surface 12 and a pressing position D1 (see Figure 5). The retracted position S1 is a position where the first pressing member 25 is away from the stage 11 (flat surface 12). The pressing position D1 is a position where the first pressing member 25 is close to the stage 11 (flat surface 12). The pressing position D1 is a position where the first substrate W1 is pressed against the stage 11 (flat surface 12) from above. The first pressing member 25 is capable of descending from the retracted position S1 above the flat surface 12 to the pressing position D1.

As shown in Figures 4 and 5, the first pressing member 25 descends from the retracted position S1 and presses the first substrate W1 on the stage 11 onto the flat surface 12. At this time, the support pins 15 and inner guide pins 22 are in their lower positions. As a result, the warped first substrate W1 (Figure 4) is corrected to a flat shape that conforms to the flat surface 12 (Figure 5). Then, with the first pressing member 25 pressing the first substrate W1 against the flat surface 12, the stage 11 adsorbs the first substrate W1.

[Regarding the second pressing member 27]
The second pressing member 27 is provided on the flat surface 12 of the stage 11 and is movable up and down (see FIGS. 9 and 10). The substrate holding device 10 has an actuator (not shown) that moves the second pressing member 27 up and down. The actuator is located above the stage 11. The actuator includes, for example, a lifting member and a motor that moves the lifting member up and down. The second pressing member 27 is attached to the lifting member via a second lifting rod 62.

The second pressing member 27 is movable between a retracted position S2 (see Figure 9) above the flat surface 12 and a pressing position D2 (see Figure 10). The retracted position S2 is a position where the second pressing member 27 is away from the stage 11 (flat surface 12). The pressing position D2 is a position where the second pressing member 27 is close to the stage 11 (flat surface 12). The pressing position D2 is a position where the second substrate W2 is pressed against the stage 11 (flat surface 12) from above. The second pressing member 27 is capable of descending from the retracted position S2 above the flat surface 12 to the pressing position D2.

As shown in Figures 9 and 10, the second pressing member 25 descends from the retracted position S2 and presses the second substrate W2 on the stage 11 onto the flat surface 12. At this time, the support pins 15 are in the lower position Pd. As a result, the warped second substrate W2 (Figure 9) is corrected to a flat shape that conforms to the flat surface 12 (Figure 10). Then, with the second pressing member 27 pressing the second substrate W2 against the flat surface 12, the stage 11 adsorbs the second substrate W2.

[Regarding the first pressing member 25 and the second pressing member 27]
As shown in FIGS. 2 and 3, the first pressing member 25 of this embodiment has a plurality of protrusions 29 for partially contacting the substrate W1.
The first presser member 25 (see FIG. 2) has a first frame 51 having a shape substantially the same as the contour of the outer periphery of the first substrate W1. The first frame 51 is formed by combining four straight beam members 511, forming a rectangle as a whole. The area surrounded by the four beam members 511 is open. The lifting rod 61 is attached to the first frame 51.

A plurality of protrusions 29 are attached to the bottom of the first frame 51. In the embodiment shown in Fig. 2, a protrusion 29 is attached to each of the four corners of the first frame 51. When the first pressing member 25 is in the pressing position D1, which is the lower position (see Fig. 5), the square protrusions 29 press the four corners of the first substrate W1. In the present embodiment, a protrusion 29 is also provided at the center in the longitudinal direction of one beam member 511, and these protrusions 29 also press the first substrate W1.
The protrusions 29 may be arranged in accordance with the type of warpage of the first substrate W1.

If the first pressing member 25 has a convex portion 29, the portion where the first pressing member 25 comes into contact with the first substrate W1 will be the convex portion 29. This reduces the contact area of the first pressing member 25 with the first substrate W1.

As shown in FIGS. 2 and 9, the second pressing member 25 of this embodiment has a plurality of protrusions 39 for partially contacting the substrate W2.
The second pressing member 27 is configured to be smaller in size than the first pressing member 25. The second pressing member 27 can pass through the opening of the first frame 51.

The second pressing member 27 (see Figure 2) has a second frame 52 that has a shape that is roughly the same as the outer contour shape of the second substrate W2. The second frame 52 is made up of four straight beam members 521, forming a rectangle overall. The area surrounded by the four beam members 521 is open. The lifting rod 62 is attached to the second frame 52.

The plurality of protrusions 39 are attached to the bottom of the second frame 52. In the embodiment shown in Fig. 2, the protrusions 39 are attached to each of the four corners of the second frame 52. When the second pressing member 27 is in the pressing position D2 (see Fig. 10), which is the lower position, the four protrusions 39 press the four corners of the second substrate W2. The protrusions 39 may also be provided at the center of one beam member 521 in the longitudinal direction.
The protrusions 39 may be arranged depending on the type of warpage of the second substrate W2.

If the second pressing member 27 has a convex portion 39, the portion where the second pressing member 27 comes into contact with the second substrate W2 will be the convex portion 39. This reduces the contact area of the second pressing member 27 with the second substrate W2.

The convex portion 29 of the first pressing member 25 and the convex portion 39 of the second pressing member 27 may have the same shape. Below, the specific configuration will be explained using the convex portion 29 of the first pressing member 25 as an example.

Fig. 11A is an explanatory diagram of the protrusion 29 of the first pressing member 25 shown in Fig. 2 and Fig. 3. The lower diagram of Fig. 11A is a side view of the protrusion 29, and the upper diagram of Fig. 11A is a cross-sectional view taken along the arrow A in the lower diagram of Fig. 11A.
The protrusion 29 has a columnar portion 291 that is short in the axial direction, and a tip portion 292 that is continuous with the columnar portion 291 and has a cross-sectional contour that becomes smaller toward the bottom. The tip portion 292 has a shape that follows a spherical surface.

Figure 11B is an explanatory diagram showing a first modified example of the convex portion 29. The bottom view of Figure 11B is a side view of the convex portion 29, and the top view of Figure 11A is a cross-sectional view taken along arrow B in the bottom view of Figure 11A. The convex portion 29 has a cylindrical portion 291 that is short in the axial direction, and a tip portion 292 that is continuous with the cylindrical portion 291 and whose cross-sectional contour shape becomes smaller as it extends downward. The tip portion 292 has a shape that follows the shape of a conical surface.

FIG. 11C is an explanatory diagram showing a second modified example of the protrusion 29. The bottom view of FIG. 11C is a side view of the protrusion 29, and the top view of FIG. 11C is a cross-sectional view taken along arrow C in the bottom view of FIG. 11C. The protrusion 29 has a truncated cone shape.

11A, 11B, and 11C have a cross-sectional contour that gradually decreases downward toward the substrate W1 side. In this configuration, the portion where the pressing member 25 comes into contact with the substrate W1 is the tip of the pressing member 25, making it possible to further reduce the contact area of the pressing member 25 with the substrate W1.
11A or 11B is particularly preferable, as the contact mode of the pressing member 25 (protrusion 29) with the substrate W1 becomes close to point contact, making it possible to further reduce the contact area.

Fig. 11D is an explanatory diagram showing a third modified example of the protrusion 29. The lower view of Fig. 11D is a side view of the protrusion 29, and the upper view of Fig. 11D is a cross-sectional view taken along arrow D in the lower view of Fig. 11D. The protrusion 29 has a cylindrical shape that is short in the axial direction.
11A, 11B, 11C, and 11D, the contact area of the pressing member 25 with the substrate W1 can be reduced. This configuration is suitable when it is desirable to avoid contact of the substrate W1 with other articles as much as possible.

Alternatively, depending on the type of warpage of the first substrate W1, it may be preferable for the first pressing member 25 to press the first substrate W1 over a wide range along the edge of the first substrate W1.
Similarly, depending on the type of warpage of the second substrate W2, it may be preferable for the second pressing member 27 to press over a wide area along the edge of the second substrate W2.

When pressing the substrate against its edge over a wide area, the first pressing member 25 and the second pressing member 27 can have the same configuration (however, the size of the outer periphery contour will differ). The specific configuration will be explained below using the first pressing member 25 as an example.

12A, 12B, 12C, and 12D are explanatory diagrams of the first pressing member 25 that can press the first substrate W1 over a wide area along the edge of the substrate W1. These diagrams show the first pressing member 25 as viewed from above. In each diagram, the substrate W1 is indicated by a two-dot chain line.
FIG. 13 is an explanatory diagram showing a state in which the first pressing member 25 presses the substrate W1 against the stage 11 (flat surface 12).

12A has a frame structure having substantially the same shape as the outer peripheral contour of the first substrate W1. The first pressing member 25 is formed by combining four linear portions 30 to form a rectangle as a whole. The area surrounded by the four linear portions 30 is open.
12A, the first pressing member 25 shown in Fig. 12B has four linear portions 30. However, these linear portions 30 are discontinuous. The lifting rod 61 (see Fig. 13) is attached to each of the linear portions 30.
In the case of the first pressing member 25 shown in FIGS. 12A and 12B, it is possible to press the substrate W1 along the entire periphery.

The first pressing member 25 shown in each of Figures 12C and 12D has two linear portions 30. The two linear portions 30 are arranged in parallel.
The linear portions 30 are arranged according to the type of warpage of the first substrate W1. That is, when the substrate W1 is warped and both left and right edge portions thereof are raised above the flat surface 12, the first pressing member 25 shown in Fig. 12C is employed. This configuration is preferable because it makes it possible to press down the raised edge portions on both left and right sides of the substrate W1.

12D is employed when the substrate W1 is warped and both edge portions in the front-rear direction are raised above the flat surface 12. This configuration is preferable because it makes it possible to press down the raised edge portions in the front-rear direction of the substrate W1.
As described above, the pressing members 25 shown in each of FIGS. 12A, 12B, 12C, and 12D have linear portions 30 that come into contact with the edge (side) of the substrate W1.

[Operation of the substrate holding device 10]
The substrate holding operation performed by the substrate holding device 10 having the above configuration will now be described.
A case will be described in which the substrate holding device 10 holds a first substrate W1, which is warped.
With the support pins 15 in the upper position Pu (see FIG. 3), a transport robot (not shown) carries the first substrate W1 onto the stage 11 and places it on the support pins 15. The first substrate W1 is placed on the tips 16 of the support pins.

When the support pins 15 are displaced to the lower position Pd, the outer peripheral edge W1e of the first substrate W1 can come into contact with the multiple outer guide pins 18 from multiple directions, and the first substrate W1 descends while being positioned by the multiple outer guide pins 18. When the support pins 15 reach the lower position Pd (see Figure 4), the first substrate W1 rests on the flat surface 12 of the stage 11. In this state, the warping of the first substrate W1 has not been eliminated.

As shown in Figure 5, when the first pressing member 25 descends from the retracted position S1, the first pressing member 25 presses the first substrate W1 onto the flat surface 12. At this time, the support pins 15 and inner guide pins 22 are in the lower position. Any warping that has occurred in the first substrate W1 is corrected by the first pressing member 25. The stage 11 suction-holds the first substrate W1. As a result, the first substrate W1 is securely suction-held on the stage 11.

Various processes are performed on the first substrate W1 while the substrate holding device 10 holds the first substrate W1. In the present embodiment (see FIG. 1 ), the first substrate W1 (stage 11) and the coating head 7 move relative to each other, and liquid is ejected from the coating head 7 to coat the first substrate W1 with the liquid.
When the coating process is completed, suction of the first substrate W1 on the stage 11 is stopped. The support pins 15 move from the lower position Pd to the upper position Pu. The coated (processed) first substrate W1 placed on the support pins 15 is carried out of the substrate holding device 10 by a transport robot (not shown).

When processing (e.g., coating) the first substrate W1 held on the stage 11, and when the first substrate W1 is removed from the stage 11 after the processing, the outer guide pins 18 are in the lower position Qd (see Figure 6), so they do not get in the way.

A case will be described in which the substrate holding device 10 holds a second substrate W2, which is warped.
As in the case of the first substrate W1 (see FIG. 3), with the support pins 15 in the upper position Pu, a transport robot (not shown) loads the second substrate W2 onto the stage 11 and places it on the support pins 15. The second substrate W2 is placed on the tips 16 of the support pins.

9, the inner guide pin 22 is in the upper position Ru, and the outer guide pin 18 is in the lower position Qd.
When the support pins 15 are displaced to the lower position Pd, the outer circumferential edge W2e of the second substrate W2 can come into contact with the inner guide pins 22 from multiple directions, and the second substrate W2 descends while being positioned by the inner guide pins 22. When the support pins 15 reach the lower position Pd (see FIG. 9), the second substrate W2 rests on the flat surface 12 of the stage 11. In this state, the warpage of the second substrate W2 has not been eliminated.

As shown in Figure 10, when the second pressing member 27 descends from the retracted position S1, the second pressing member 27 presses the second substrate W2 onto the flat surface 12. At this time, the support pins 15 are in the lower position Pd. Any warping that has occurred in the second substrate W2 is corrected by the second pressing member 27. The stage 11 suctions and holds the second substrate W2. As a result, the second substrate W2 is securely suctioned and held on the stage 11.

Various processes are performed on the second substrate W2 while the substrate holding device 10 holds the second substrate W2. In the present embodiment (see FIG. 1 ), the second substrate W2 (stage 11) and the coating head 7 move relative to each other, and liquid is ejected from the coating head 7 to coat the second substrate W2 with the liquid.
When the coating process is completed, suction of the second substrate W2 on the stage 11 is stopped. The support pins 15 move from the lower position Pd to the upper position Pu. The coated (processed) second substrate W2 placed on the support pins 15 is carried out of the substrate holding device 10 by a transport robot (not shown).

When processing (e.g., coating) the second substrate W2 held on the stage 11, and when removing the second substrate W2 from the stage 11 after the processing, the inner guide pin 22 and outer guide pin 18 are in a lower position (not shown), so that the inner guide pin 22 and outer guide pin 18 do not get in the way.

[Regarding the substrate holding device 10 of this embodiment]
The substrate holding device 10 of this embodiment is capable of holding, on the stage 11, not only the first substrate W1 but also a second substrate W2 that is smaller than the first substrate W1. As with the first substrate W1, the second substrate W2 is supported by the support pins 15 and lowered, and is then positioned by the inner guide pins 22 (see FIG. 9). Even if the second substrate W2 is warped, it is corrected by the second pressing member 27 (see FIG. 10), and the stage 11 suction-holds the second substrate W2. The substrate holding device 10 can be used for two types of substrates with different contour sizes.

〔others〕
The substrate holding device 10 of this embodiment is used for two types of substrates (W1, W2) having different contour sizes as described above, but may be configured to hold only one type of substrate.
The substrate holding device of the present invention is not limited to being provided in the coating device 5, but can also be applied to other devices.

The embodiments disclosed herein are illustrative in all respects and are not restrictive. The technical scope of the present invention is not limited to the above-described embodiments, and includes all modifications within the scope of equivalents to the configurations described in the claims.

10 Substrate holding device 11 Stage 12 Flat surface 13 Portion having flat surface 14 Portion surrounding flat surface 15 Support pin 16 Tip (support pin tip)
18 outer guide pin 19 tip (outer pin tip)
22 Inner guide pin 23 Tip (inner pin tip)
25 First pressing member 27 Second pressing member 29 Convex portion 30 Linear portion 39 Convex portion W1 First substrate W1e Outer periphery W2 Second substrate W2e Outer periphery S1 Retracted position D1 Pressing position S2 Retracted position D2 Pressing position Pu Upper position of support pin Pd Lower position of support pin Qu Upper position of outer guide pin Qd Lower position of outer guide pin Ru Upper position of inner guide pin Rd Lower position of inner guide pin

Claims (8)

a stage having a flat surface on which a substrate can be placed and capable of adsorbing the substrate;
a plurality of support pins arranged in the portion of the stage having the flat surface and having tips on which the substrate rests;
a plurality of outer guide pins arranged around the flat surface of the stage;
a pressing member that can be lowered from a retracted position above the flat surface;
and
the support pin is displaceable between an upper position where the tip protrudes above the flat surface and a lower position where the tip is below the flat surface,
the plurality of outer guide pins are arranged so as to be able to contact, from a plurality of directions, the outer periphery of the substrate placed on the support pins displaced to the lower position;
the pressing member descends from the retracted position and presses the substrate against the flat surface with the support pins in the lower position;
Substrate holding device. a plurality of inner guide pins arranged in a portion closer to the center of the flat surface than the plurality of outer guide pins;
a second pressing member that can be lowered from a retracted position above the flat surface;
and
the plurality of support pins are arranged in the portion having the flat surface so as to be able to support a second substrate smaller than the substrate;
the plurality of inner guide pins are displaceable between an upper position where their tips protrude above the flat surface and a lower position where their tips are below the flat surface,
the plurality of inner guide pins are arranged so as to be able to contact, from a plurality of directions, an outer circumferential edge of the second substrate placed on the support pins displaced to the lower position;
the second pressing member descends from the retracted position and presses the second substrate against the flat surface with the support pins in the lower position;
The substrate holding device according to claim 1 . The outer guide pin has a tapered tip.
3. The substrate holding device according to claim 1 or 2. The inner guide pin has a tapered tip.
The substrate holding device according to claim 2 . The pressing member has a protrusion for partially contacting the substrate.
3. The substrate holding device according to claim 1 or 2. The convex portion has a cross-sectional contour shape that becomes smaller toward the substrate side.
The substrate holding device according to claim 5 . The pressing member has a linear portion that contacts the edge of the substrate.
3. The substrate holding device according to claim 1 or 2. The outer guide pin is displaceable between an upper position where its tip protrudes above the flat surface and a lower position where its tip is below the flat surface.
3. The substrate holding device according to claim 1 or 2.