WO2025203769A1 - Power conversion device - Google Patents

Abstract

This power conversion device comprises a wiring board, a half-bridge circuit module, a drive circuit module, and an inductor module. The wiring board has a first main surface and a second main surface. The half-bridge circuit module is mounted on the first main surface. The drive circuit module is mounted on the first main surface. The inductor module includes a conductor member and a magnetic core. A first end of the conductor member is connected to the second main surface. The wiring board further includes a plurality of terminals connected to the half-bridge circuit module and the drive circuit module. The plurality of terminals are disposed on one lateral surface of the wiring board. A second end of the conductor member is aligned with the plurality of terminals in the thickness direction of the wiring board when viewed from the direction along the longitudinal direction of the one lateral surface.

Description

Power Conversion Device

This disclosure relates generally to power conversion devices, and more specifically to power conversion devices having wiring boards.

Patent Document 1 discloses a power supply module for a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The power supply module in Patent Document 1 has a sandwich structure that integrates an inductor, power switch, and driver.

US Patent Application Publication No. 2022/0295635

Power supply modules (power conversion devices) for processors such as CPUs and GPUs are increasingly being placed on the backside of the processor board to prevent increases in wiring loss.

A power conversion device according to one aspect of the present disclosure comprises a wiring board, a plurality of half-bridge circuit modules, a plurality of drive circuit modules, and an inductor module. The wiring board has a first main surface and a second main surface opposite the first main surface. The plurality of half-bridge circuit modules are mounted on the first main surface of the wiring board. The plurality of half-bridge circuit modules each include a half-bridge circuit having a plurality of switching elements. The plurality of drive circuit modules are mounted on the first main surface of the wiring board. The plurality of drive circuit modules correspond one-to-one to the plurality of half-bridge circuit modules and control the plurality of switching elements of the corresponding half-bridge circuit module. The inductor module has a plurality of inductors connected to midpoints of each of the plurality of half-bridge circuits. The inductor module includes a plurality of conductor members and a magnetic core. The plurality of conductor members correspond one-to-one to the plurality of inductors. The magnetic core covers the plurality of conductor members. Each of the plurality of conductor members has a first end and a second end. The first end of each of the plurality of conductor members is connected to the second main surface of the wiring board. The wiring board further has a plurality of terminals connected to the plurality of half-bridge circuit modules and the plurality of drive circuit modules. The plurality of terminals of the wiring board are arranged on one side surface of the wiring board. The second end of each of the plurality of conductor members is aligned with the plurality of terminals in the thickness direction of the wiring board when viewed from the direction along the longitudinal direction of the one side surface of the wiring board.

A power conversion device according to one aspect of the present disclosure comprises a first substrate which is a wiring substrate, a first half-bridge circuit module, a first drive circuit module, a second substrate which is a wiring substrate, a second half-bridge circuit module, a second drive circuit module, and an inductor module. The first substrate has a first main surface and a second main surface opposite to each other. The second substrate has a first main surface and a second main surface opposite to each other. The first half-bridge circuit module is mounted on the first main surface of the first substrate. The first half-bridge circuit module includes a first half-bridge circuit having a plurality of switching elements. The first drive circuit module is mounted on the first main surface of the first substrate. The first drive circuit module controls the plurality of switching elements of the first half-bridge circuit module. The second half-bridge circuit module is mounted on the first main surface of the second substrate. The second half-bridge circuit module includes a second half-bridge circuit having a plurality of switching elements. The second drive circuit module is mounted on the first main surface of the second substrate. The second drive circuit module controls the multiple switching elements of the second half-bridge circuit module. The inductor module includes a first inductor connected to a midpoint of each of the first half-bridge circuits and a second inductor connected to a midpoint of each of the second half-bridge circuits. The inductor module includes a first conductor member corresponding to the first inductor, a second conductor member corresponding to the second inductor, and a magnetic core covering the first conductor member and the second conductor member. The first conductor member and the second conductor member each have a first end and a second end. The first end of the first conductor member is connected to the second main surface of the first substrate. The first end of the second conductor member is connected to the second main surface of the second substrate. The first substrate further includes multiple first terminals connected to the first half-bridge circuit module and the first drive circuit module. The multiple first terminals of the first substrate are arranged on one side of the first substrate. The second substrate further includes multiple second terminals connected to the second half-bridge circuit module and the second drive circuit module. The second terminals of the second substrate are arranged on one side of the second substrate. The second ends of the first and second conductive members are aligned with the first and second terminals in the thickness direction of the first substrate when viewed from the longitudinal direction of the one side of the first substrate.

A power conversion device according to one aspect of the present disclosure comprises a wiring board, a half-bridge circuit module, a drive circuit module, and an inductor module. The wiring board has a first main surface and a second main surface opposite the first main surface. The half-bridge circuit module is mounted on the first main surface of the wiring board. The half-bridge circuit module includes a half-bridge circuit having a plurality of switching elements. The drive circuit module is mounted on the first main surface of the wiring board. The drive circuit module controls the plurality of switching elements of the half-bridge circuit module. The inductor module has a conductor member connected to a midpoint of the half-bridge circuit, and a magnetic core covering the conductor member. The conductor member has a first end and a second end. The first end of the conductor member is connected to the second main surface of the wiring board. The wiring board further comprises a plurality of terminals connected to the half-bridge circuit module and the drive circuit module. The plurality of terminals of the wiring board are arranged on one side of the wiring board. The second end of the conductor member is aligned with the terminals in the thickness direction of the wiring board when viewed from the direction along the longitudinal direction of the one side surface of the wiring board.

This disclosure makes it possible to reduce the height of power conversion devices.

FIG. 1 is a perspective view illustrating a configuration of a power conversion device according to a first embodiment. FIG. 2 is a front view of the power converter. FIG. 3 is a rear view of the power converter. FIG. 4 is a side view of the power converter. FIG. 5 is a plan view of the power converter. FIG. 6 is a cross-sectional view of the power converter shown in FIG. 4 taken along line AA. FIG. 7 is a cross-sectional view of the power converter shown in FIG. 4 taken along line BB. FIG. 8 is a cross-sectional view of the power converter shown in FIG. 5 taken along line CC. FIG. 9 is a circuit diagram showing a part of the circuit of the power conversion device. FIG. 10 is a side view showing the configuration of a first modification of the power conversion device. FIG. 11 is a side view showing the configuration of a second modification of the power conversion device. FIG. 12 is a side view showing the configuration of a third modification of the power converter of the first embodiment. FIG. 13 is a side view showing the configuration of a fourth modification of the power converter of the first embodiment. FIG. 14 is a perspective view illustrating the configuration of a power conversion device according to the second embodiment. FIG. 15 is a front view showing the configuration of the power conversion device. FIG. 16 is a rear view showing the configuration of the power conversion device. FIG. 17 is a side view showing the configuration of the power conversion device. FIG. 18 is a plan view showing the configuration of the power conversion device of the same. FIG. 19 is a cross-sectional view of the power converter shown in FIG. 17 taken along line DD. FIG. 20 is a side view showing the configuration of a first modification of the power conversion device. FIG. 21 is a side view showing the configuration of a second modification of the power conversion device. FIG. 22 is a front view illustrating the configuration of a power conversion device according to the third embodiment. FIG. 23 is a rear view showing the configuration of the power conversion device. FIG. 24 is a side view showing the configuration of the power conversion device. FIG. 25 is a plan view showing the configuration of the power conversion device of the same. FIG. 26 is a side view showing a main part of the power converter. FIG. 27 is a plan view showing a main part of the power conversion device. 28 is a cross-sectional view of the power converter shown in FIG. 26 taken along line EE. FIG. 29 is a front view illustrating the configuration of a power conversion device according to the fourth embodiment. 30 is a cross-sectional view of the power converter shown in FIG. 29 taken along line FF. 31 is a cross-sectional view of the power converter shown in FIG. 29 taken along line GG. FIG. 32 is a front view illustrating the configuration of a power conversion device according to the fifth embodiment. FIG. 33 is a circuit diagram showing a circuit of the power conversion device of the above embodiment. FIG. 34 is a front view showing the configuration of a power conversion device according to the sixth embodiment. FIG. 35 is a side view illustrating the configuration of a power conversion device according to the seventh embodiment. FIG. 36 is a schematic diagram showing an example of the arrangement of power conversion devices.

Preferred embodiments of the present disclosure will be described in detail below with reference to the drawings. Note that common elements in the embodiments described below are assigned the same reference numerals, and duplicate descriptions of common elements may be omitted. Note that the following embodiments and variations are only a portion of the various embodiments of the present disclosure. Furthermore, each of the following embodiments and variations can be modified in various ways depending on the design, etc., as long as the object of the present disclosure can be achieved. Furthermore, the configurations of each variation can be combined as appropriate.

The figures described in this disclosure are schematic diagrams, and the ratios of size and thickness of each component in each figure do not necessarily reflect the actual dimensional ratios. The arrows indicating each direction in the figures are merely examples and are not intended to define the directions in which the power conversion device 100 should be used. Furthermore, the arrows indicating each direction in the figures are merely for explanatory purposes and have no substance.

In addition, in this disclosure, "orthogonal (perpendicular)" does not only refer to a state in which the angle between two things is exactly 90 degrees, but also includes a state in which two things intersect within a certain range of difference. In other words, the angle between two orthogonal things is within a certain range of difference from 90 degrees (for example, 10 degrees or less). In other words, in this disclosure, "orthogonal" includes cases in which the angle between two things is between 80 degrees and 100 degrees. Similarly, in this disclosure, "parallel" includes not only a state in which two things do not strictly intersect, but also a state in which two things are lined up within a certain range of difference. For example, in this disclosure, "parallel" includes cases in which one thing is inclined at an angle of 10 degrees or less relative to the other. In other words, in this disclosure, "parallel" includes cases in which the angle between one thing and the other is between -10 degrees and 10 degrees.

(Embodiment 1)
(1) Overview First, an overview of the power conversion device 100 according to the first embodiment will be described with reference to FIGS. 1 and 36. FIG.

As shown in FIG. 36, the power conversion device 100 is mounted on a system board 200 on which a processor 300 such as a CPU or GPU is mounted. The power conversion device 100 is mounted on the main surface of the system board 200 opposite the main surface on which the processor 300 is mounted. In other words, the power conversion device 100 is mounted on the back side of the processor 300. The power conversion device 100 supplies power to the processor 300. Note that while FIG. 36 shows one power conversion device 100 mounted on the system board 200, multiple power conversion devices 100 may also be mounted on the system board 200.

As shown in FIG. 1, the power conversion device 100 includes a wiring board 3, multiple (two in the example of FIG. 1) half-bridge circuit modules 4, multiple (two in the example of FIG. 1) drive circuit modules 5, and an inductor module 7.

The wiring board 3 has a first main surface 31 and a second main surface 32 (see Figure 4) opposite the first main surface 31. The first main surface 31 and second main surface 32 of the wiring board 3 are arranged in the thickness direction (first direction D1).

The multiple half-bridge circuit modules 4 are mounted on the first main surface 31 of the wiring board 3. Each of the multiple half-bridge circuit modules 4 includes a half-bridge circuit 40 having multiple switching elements 411, 412 (see Figure 9).

The multiple drive circuit modules 5 are mounted on the first main surface 31 of the wiring board 3. The multiple drive circuit modules 5 correspond one-to-one to the multiple half-bridge circuit modules 4, and control the multiple switching elements 411, 412 of the corresponding half-bridge circuit modules 4.

The inductor module 7 has multiple inductors connected to the midpoint 40N1 of each of the multiple half-bridge circuits 40. The inductor module 7 includes multiple (two in the example of Figure 1) conductor members 9 and a magnetic core 8. The multiple conductor members 9 correspond one-to-one to the multiple inductors. The magnetic core 8 covers the multiple conductor members 9. Each of the multiple conductor members 9 has a first end and a second end. The first end of each of the multiple conductor members 9 is connected to the second main surface 32 of the wiring board 3.

The wiring board 3 further has a plurality of terminals 30 connected to the plurality of half-bridge circuit modules 4 and the plurality of drive circuit modules 5. The plurality of terminals 30 of the wiring board 3 are arranged on one side surface 33 of the wiring board 3 (see Figure 4). The one side surface 33 of the wiring board 3 extends along the longitudinal direction (third direction D3).

When viewed from a direction along the longitudinal direction (third direction D3) of one side surface 33 of the wiring board 3, the second end of each of the multiple conductor members 9 is aligned with the multiple terminals 30 in the thickness direction (first direction D1) of the wiring board 3. In other words, the multiple terminals 30 of the wiring board 3 and the second ends of each of the multiple conductor members 9 are on the same imaginary plane. That is, the second end of each of the multiple conductor members 9 has a portion that overlaps with the multiple terminals 30 when viewed in the thickness direction (first direction D1) of the wiring board 3. Furthermore, the second end of each of the multiple conductor members 9 has a portion that overlaps with at least one of the multiple terminals 30 when viewed in the first direction D1, and does not necessarily overlap with other terminals 30.

Power conversion devices for processors such as CPUs and GPUs are increasingly being placed on the backside of processor boards to prevent increases in wiring loss. However, the space on the backside of a processor board is limited, and standards for processor boards installed in servers, etc., limit the height of the power conversion device mounted on the backside of the processor board.

Here, in the power conversion device 100 of embodiment 1, the multiple terminals 30 of the wiring board 3 and the second ends of each of the multiple conductor members 9 are terminals (electrodes) that can be surface-mounted on another substrate, such as the system board 200. The thickness direction (first direction D1) of the wiring board 3 is perpendicular to the thickness direction (second direction D2) of the other substrate, such as the system board 200. In the power conversion device 100 of embodiment 1, the wiring board 3 and the inductor module 7 are aligned in a direction (first direction D1) that is perpendicular to the thickness direction (second direction D2) of the other substrate, such as the system board 200, on which the power conversion device 100 is surface-mounted. This allows the power conversion device 100 to have a low profile in the thickness direction of the other substrate, such as the system board 200, on which the power conversion device 100 is surface-mounted.

(2) Details The detailed configuration of the power conversion device 100 according to the first embodiment will be described below with reference to FIGS. 1 to 9. In the present disclosure, the thickness direction of the wiring substrate 3, i.e., the normal direction to the first main surface 31 and the second main surface 32 of the wiring substrate 3, is defined as a first direction D1. The normal direction to one side surface 33 of the wiring substrate 3 is defined as a second direction D2. The first direction D1 and the second direction D2 are orthogonal to each other. The direction orthogonal to both the first direction D1 and the second direction D2 is defined as a third direction D3.

As shown in FIG. 1, the power conversion device 100 of embodiment 1 includes a power conversion unit 1 and a base substrate 10.

(2.1) Base Substrate The base substrate 10 is a multilayer substrate. The base substrate 10 has a first main surface 101 that faces the wiring substrate 3 and the inductor module 7, and a second main surface 102 (see FIG. 2 ) opposite the first main surface 101 of the base substrate 10. The first main surface 101 of the base substrate 10 is electrically connected to the multiple terminals 30 of the wiring substrate 3 and the second ends of the multiple conductor members 9 (i.e., the second end 914 of the first conductor member 91 and the second end 924 of the second conductor member 92). The second main surface 102 of the base substrate 10 has external electrodes 103 (see FIG. 2 ) that can be surface-mounted on a substrate other than the wiring substrate 3.

The other substrate is, for example, a system substrate 200 (see Figure 36). That is, in the power conversion device 100 of embodiment 1, the power conversion unit 1 and the system substrate 200 are electrically connected via the base substrate 10. When the base substrate 10 is surface-mounted on the system substrate 200, the thickness direction of the base substrate 10 and the thickness direction of the system substrate 200 are both parallel to the second direction D2. As described above, the base substrate 10 is a multilayer substrate. This allows for greater flexibility in the connection pattern between the power conversion unit 1 (or the power conversion device 100) and the system substrate 200.

(2.2) Power Conversion Unit As shown in FIG. 1, the power conversion unit 1 of the first embodiment includes a substrate unit 2 and an inductor module 7.

(2.3) Substrate Unit The substrate unit 2 includes a wiring substrate 3, a first half-bridge circuit module 41, a second half-bridge circuit module 42, a first drive circuit module 51, and a second drive circuit module 52. In the following description, when the first half-bridge circuit module 41 and the second half-bridge circuit module 42 are not distinguished from each other, each of the first half-bridge circuit module 41 and the second half-bridge circuit module 42 may be simply referred to as a "half-bridge circuit module 4." Furthermore, when the first drive circuit module 51 and the second drive circuit module 52 are not distinguished from each other, each of the first drive circuit module 51 and the second drive circuit module 52 may be simply referred to as a "drive circuit module 5." In other words, the substrate unit 2 of embodiment 1 includes a wiring substrate 3, a plurality (two) half-bridge circuit modules 4, and a plurality (two) drive circuit modules 5.

The wiring board 3 has a first main surface 31 and a second main surface 32 opposite the first main surface 31. The normal directions of the first main surface 31 and the second main surface 32 are parallel to the first direction D1. The second main surface 32 faces the inductor module 7.

The wiring board 3 also has one side surface 33 that is perpendicular to both the first main surface 31 and the second main surface 32. The one side surface 33 of the wiring board 3 is connected to the first main surface 31 and the second main surface 32. The one side surface 33 faces the first main surface 101 of the base substrate 10. The normal direction of the one side surface 33 is along the second direction D2. The wiring board 3 is a multilayer substrate, and a plurality of terminals 30 are provided on the one side surface 33. The multiple terminals 30 are connected to the first main surface 101 of the base substrate 10.

The first half-bridge circuit module 41 is mounted on the first main surface 31 of the wiring board 3. The first half-bridge circuit module 41 and the first drive circuit module 51 are aligned in the second direction D2. In the second direction D2, the first half-bridge circuit module 41 is positioned farther from the base substrate 10 than the first drive circuit module 51.

As shown in FIG. 9, the first half-bridge circuit module 41 includes a half-bridge circuit 40 (first half-bridge circuit) having multiple (two in the example of FIG. 2) switching elements 411, 412. The number of switching elements included in the half-bridge circuit 40 may be three or more. The two switching elements 411, 412 are, for example, IGBTs (Insulated Gate Bipolar Transistors), Si-MOSFETs (Metal-Oxide-Semiconductor Field Effect Transistors), GaN transistors, or SiC transistors. The two switching elements 411, 412 are controlled by gate drivers 511, 512 of the first drive circuit module 51, respectively. The two switching elements 411, 412 are connected in series to each other at the midpoint 40N1, which is the connection point. A first inductor (inductor L1) is connected to the connection point between the two switching elements 411, 412 of the first half-bridge circuit. In other words, the first inductor is connected to the midpoint 40N1 of the first half-bridge circuit.

As shown in FIG. 1, the second half-bridge circuit module 42 is mounted on the first main surface 31 of the wiring board 3. The second half-bridge circuit module 42 and the first half-bridge circuit module 41 are aligned in the third direction D3. The second half-bridge circuit module 42 and the second drive circuit module 52 are aligned in the second direction D2. In the second direction D2, the second half-bridge circuit module 42 is positioned farther from the base substrate 10 than the second drive circuit module 52.

Like the first half-bridge circuit module 41, the second half-bridge circuit module 42 includes a half-bridge circuit 40 (second half-bridge circuit) having two switching elements 411, 412. In embodiment 1, the half-bridge circuit 40 (first half-bridge circuit) of the first half-bridge circuit module 41 and the half-bridge circuit 40 (second half-bridge circuit) of the second half-bridge circuit module 42 have the same configuration. The two switching elements 411, 412 of the second half-bridge circuit are connected in series to each other at a connection point, i.e., a midpoint (midpoint 40N1). A second inductor (inductor L1) is connected to the connection point between the two switching elements 411, 412 of the second half-bridge circuit. In other words, the second inductor is connected to the midpoint (midpoint 40N1) of the second half-bridge circuit.

The first drive circuit module 51 is mounted on the first main surface 31 of the wiring board 3. The first drive circuit module 51 includes a drive circuit 50 (see FIG. 9) corresponding to the first half-bridge circuit module 41. The drive circuit 50 (first drive circuit) controls the two switching elements 411, 412 of the first half-bridge circuit module 41. More specifically, as shown in FIG. 9, the drive circuit 50 includes two gate drivers 511, 512. The gate driver 511 drives the switching element 411. The gate driver 512 drives the switching element 412. The two gate drivers 511, 512 are electrically connected to multiple terminals 30 of the wiring board 3. Control signals are input to the two gate drivers 511, 512 via the multiple terminals 30 of the wiring board 3.

As shown in FIG. 1, the second drive circuit module 52 is mounted on the first main surface 31 of the wiring board 3. The second drive circuit module 52 includes a drive circuit 50 corresponding to the second half-bridge circuit module 42. The drive circuit 50 (second drive circuit) controls the two switching elements 411, 412 of the second half-bridge circuit module 42. In embodiment 1, the drive circuit 50 (first drive circuit) of the first drive circuit module 51 and the drive circuit 50 (second drive circuit) of the second drive circuit module 52 have the same configuration.

(2.4) Inductor Module As shown in FIG. 1 , the inductor module 7 is mounted on the second main surface 32 (see FIG. 4 ) of the wiring board 3. The inductor module 7 includes a first inductor and a second inductor. The two switching elements 411, 412 of each of the first half-bridge circuits are connected in series to each other at a connection point, i.e., a midpoint 40N1. The first inductor is connected to the connection point between the two switching elements 411, 412 of each of the first half-bridge circuits. In other words, the first inductor is connected to the midpoint 40N1 of the first half-bridge circuit. The two switching elements 411, 412 of each of the second half-bridge circuits are connected in series to each other at a connection point, i.e., a midpoint 40N1. The second inductor is connected to the connection point between the two switching elements 411, 412 of each of the second half-bridge circuits. In other words, the second inductor is connected to the midpoint (midpoint 40N1) of the second half-bridge circuit. In the following description, when the first inductor and the second inductor are not particularly distinguished from each other, each of the first inductor and the second inductor may be simply referred to as "inductor L1" (see FIG. 9).

The inductor module 7 includes a first conductor member 91 corresponding to the first inductor, a second conductor member 92 corresponding to the second inductor, and a magnetic core 8 covering the first conductor member 91 and the second conductor member 92. In the following description, when there is no particular distinction between the first conductor member 91 and the second conductor member 92, each of the first conductor member 91 and the second conductor member 92 may be simply referred to as the "conductor member 9."

The first conductor member 91 is made of, for example, copper. When viewed from the side (see Figure 4), the first conductor member 91 has an L-shape. The first conductor member 91 has a first portion 911 and a second portion 912. The first portion 911 and the second portion 912 are rectangular parallelepiped shapes. The first portion 911 and the second portion 912 are continuous and perpendicular to each other, so that the first conductor member 91 has an L-shape. In the example of Figure 1, the first conductor member 91 is arranged so that the longitudinal direction of the first portion 911 is aligned with the first direction D1 and the longitudinal direction of the second portion 912 is aligned with the second direction D2.

The first conductor member 91 has a first end 913 and a second end 914. The first end 913 is an end of the first portion 911, and the second end 914 is an end of the second portion 912. The first end 913 is connected to the second main surface 32 of the wiring board 3, and the second end 914 is connected to the first main surface 101 of the base substrate 10. More specifically, the first end 913 is connected to the connection point between the two switching elements 411, 412 of the first half-bridge circuit module 41. In other words, the first end 913 is connected to the midpoint 40N1 of the first half-bridge circuit. The first conductor member 91 and the magnetic core 8 form a first inductor.

The second conductor member 92 is formed, for example, from copper. In a side view (see FIG. 4), the second conductor member 92 has an L-shape. The second conductor member 92 and the first conductor member 91 have the same size and shape, and in a side view, the second conductor member 92 and the first conductor member 91 overlap. The second conductor member 92 has a first portion 921 and a second portion 922. The first portion 921 and the second portion 922 are shaped like a rectangular parallelepiped. The first portion 921 and the second portion 922 are continuous and perpendicular to each other, so that the second conductor member 92 has an L-shape. In the example of FIG. 1, the second conductor member 92 is arranged so that the longitudinal direction of the first portion 921 is aligned with the first direction D1 and the longitudinal direction of the second portion 922 is aligned with the second direction D2.

The second conductor member 92 has a first end 923 and a second end 924. The first end 923 is an end of the first portion 921, and the second end 924 is an end of the second portion 922. The first end 923 is connected to the second main surface 32 of the wiring board 3, and the second end 924 is connected to the first main surface 101 of the base substrate 10. More specifically, the first end 923 is connected to the connection point between the two switching elements 411, 412 of the second half-bridge circuit module 42. In other words, the first end 923 is connected to the midpoint (midpoint 40N1) of the second half-bridge circuit. The second conductor member 92 and the magnetic core 8 form a second inductor.

The magnetic core 8 covers the first conductor member 91 and the second conductor member 92. Note that in this disclosure, "cover" is intended to include not only cases where one object completely surrounds another object, but also cases where one object surrounds another object so that a portion of the other object is exposed from the first object. In embodiment 1, the first end 913 and second portion 912 of the first conductor member 91 and the first end 923 and second portion 922 of the second conductor member 92 are exposed from the magnetic core 8.

The magnetic core 8 is formed of iron, for example. The magnetic core 8 may also be formed of silicon steel, permalloy, ferrite, or the like. The magnetic core 8 is shaped like a rectangular parallelepiped. The first surface 801 of the magnetic core 8, from which the first end 913 of the first conductor member 91 and the first end 923 of the second conductor member 92 are exposed, faces the second main surface 32 of the wiring board 3 in the first direction D1. The normal direction of the first surface 801 of the magnetic core 8 is parallel to the normal direction of the second main surface 32 of the wiring board 3. The second surface 802, opposite the first surface 801, exposes the second portion 912 of the first conductor member 91 and the second portion 922 of the second conductor member 92. The second portion 912 of the first conductor member 91 and the second portion 922 of the second conductor member 92 are arranged along the second surface 802 of the magnetic core 8.

(3) Effects As described above, the multiple terminals 30 of the wiring board 3, the second portion 912 of the first conductor member 91, and the second portion 922 of the second conductor member 92 are on the same imaginary plane. The multiple terminals 30 of the wiring board 3, the second portion 912 of the first conductor member 91, and the second portion 922 of the second conductor member 92 are terminals (electrodes) that can be surface-mounted on another substrate, such as the base substrate 10 or the system substrate 200. In the power conversion device 100 of the first embodiment, the first direction D1 in which the second main surface 32 of the wiring board 3 and the first surface of the inductor module 7 face each other is perpendicular to the thickness direction of the system substrate 200. This allows the power conversion device 100 to be reduced in height in the thickness direction of the system substrate 200 on which the power conversion device 100 is surface-mounted.

(4) Modifications Modifications of the first embodiment are listed below.

(4.1) Modification 1
The power conversion device 100 of the first modification will be described with reference to FIG.

The power conversion device 100 of variant 1 further includes a first heat dissipation member 11A and second heat dissipation members 121 and 122 that are electrically insulating.

The first heat dissipation member 11A is made of a metal such as copper, iron, or aluminum. The thermal conductivity of the first heat dissipation member 11A is much higher than that of air. The first heat dissipation member 11A of variant 1 is L-shaped in side view. The first heat dissipation member 11A has a first portion 111 and a second portion 112. The first portion 111 and the second portion 112 are rectangular plate-like. The first portion 111 and the second portion 112 are continuous and perpendicular to each other so that the first heat dissipation member 11A has an L-shaped shape in side view. In the example of Figure 10, the normal direction of the main surface of the first portion 111 is parallel to the second direction D2 (see Figure 1), and the normal direction of the main surface of the second portion 112 is parallel to the first direction D1 (see Figure 1).

The first portion 111 faces the power conversion unit 1 and the first main surface 101 of the base substrate 10 in the second direction D2. In a plan view from the second direction D2, a portion of the first portion 111 overlaps the entire inductor module 7. The second portion 112 faces the first main surface 31 of the wiring substrate 3, the multiple half-bridge circuit modules 4, and the multiple drive circuit modules 5 in the first direction D1. In a plan view from the first direction D1, a portion of the second portion 112 overlaps the entire first main surface 31 of the wiring substrate 3. An end of the second portion 112 is in contact with the first main surface 101 of the base substrate 10. However, the end of the second portion 112 and the first main surface 101 of the base substrate 10 may not be in contact.

The second heat dissipation members 121, 122 are, for example, heat dissipation sheets. The second heat dissipation members 121, 122 are electrically insulating. Furthermore, the second heat dissipation members 121, 122 are formed from a material that is less hard than the first heat dissipation member 11A. The thermal conductivity of the second heat dissipation members 121, 122 is much higher than the thermal conductivity of air. The second heat dissipation members 121, 122 may also be a heat dissipation gel formed from a gel-like or viscous material.

The second heat dissipation members 121, 122 are rectangular in shape. The second heat dissipation member 121 is in contact with the magnetic core 8 of the inductor module 7 in the second direction D2. In a planar view from the second direction D2, a portion of the second heat dissipation member 121 overlaps the entire inductor module 7. The second heat dissipation member 122 is in contact with the multiple half-bridge circuit modules 4 and the multiple drive circuit modules 5 in the first direction D1. In a planar view from the first direction D1, a portion of the second heat dissipation member 122 overlaps the entire multiple half-bridge circuit modules 4 and the entire multiple drive circuit modules 5.

Furthermore, the second heat dissipation member 121 is in contact with the first portion 111 of the first heat dissipation member 11A in the second direction D2. Further, the second heat dissipation member 122 is in contact with the second portion 112 of the first heat dissipation member 11A in the first direction D1. In other words, the first heat dissipation member 11A is thermally coupled to each of the multiple half-bridge circuit modules 4, the multiple drive circuit modules 5, and the magnetic core 8 of the inductor module 7 via the second heat dissipation members 121, 122.

This allows heat to be efficiently dissipated from each of the heat-generating half-bridge circuit modules 4, the drive circuit modules 5, and the magnetic core 8 of the inductor module 7, improving the heat dissipation performance of the power conversion device 100.

(4.2) Modification 2
The power conversion device 100 of the second modification will be described with reference to FIG.

The first heat dissipation member 11B of Modification 2 has a U-shape when viewed from the side. Compared to the first heat dissipation member 11A of Modification 1, the first heat dissipation member 11B further has a third portion 113.

The third portion 113 is shaped like a rectangular plate. The first portion 111, the second portion 112, and the third portion 113 are continuous and perpendicular to each other, so that the first heat dissipation member 11B has a U-shape. In the example of Figure 11, the normal direction of the main surface of the third portion 113 is parallel to the first direction D1 (see Figure 1).

The third portion 113 faces the second surface 802 of the magnetic core 8 of the inductor module 7, the second portion 912 of the first conductor member 91, and the second portion 922 of the second conductor member 92 in the first direction D1. In a plan view from the first direction D1, a portion of the third portion 113 overlaps the entire second surface 802 of the magnetic core 8 of the inductor module 7. An end of the third portion 113 is in contact with the first main surface 101 of the base substrate 10. However, the end of the third portion 113 may not be in contact with the first main surface 101 of the base substrate 10.

Furthermore, the power conversion device 100 of variant 2 further includes a second heat dissipation member 123 in addition to the second heat dissipation members 121 and 122.

The second heat dissipation member 123 faces the second portion 912 of the first conductor member 91 and the second portion 922 of the second conductor member 92 in the first direction D1. In a plan view from the first direction D1, a portion of the second heat dissipation member 123 overlaps the entire second portion 912 of the first conductor member 91 and the entire second portion 922 of the second conductor member 92.

Furthermore, the second heat dissipation member 123 is in contact with the second portion 912 of the first conductor member 91 and the second portion 922 of the second conductor member 92 in the first direction D1. The second heat dissipation member 123 is also in contact with the third portion 113 of the first heat dissipation member 11B. In other words, the first heat dissipation member 11B is thermally coupled to each of the multiple half-bridge circuit modules 4, the multiple drive circuit modules 5, the magnetic core 8 of the inductor module 7, and the multiple conductor members 9 of the inductor module 7 via the second heat dissipation members 121, 122, and 123.

This allows heat to be efficiently dissipated from each of the heat-generating components: the multiple half-bridge circuit modules 4, the multiple drive circuit modules 5, the magnetic core 8 of the inductor module 7, and the multiple conductor members 9 of the inductor module 7, further improving the heat dissipation performance of the power conversion device 100.

(4.3) Modification 3
The power conversion device 100 of the third modification will be described with reference to FIG.

Compared to the power conversion device 100 of variant 1, the power conversion device 100 of variant 3 further includes an adhesive 131. The adhesive 131 is electrically conductive. However, it is not essential that the adhesive 131 be electrically conductive, and the adhesive 131 may be a non-conductive adhesive.

In variant 3, the end of the second portion 112 of the first heat dissipation member 11A is mechanically connected to the base substrate 10 (another substrate) via adhesive 131.

This improves the physical stability of the first heat dissipation member 11A.

(4.4) Modification 4
The power conversion device 100 of the fourth modification will be described with reference to FIG.

Compared to the power conversion device 100 of variant 2, the power conversion device 100 of variant 4 further includes adhesives 131 and 132. The adhesives 131 and 132 are conductive. However, it is not essential that the adhesives 131 and 132 are conductive; the adhesives 131 and 132 may be non-conductive adhesives.

The end of the second portion 112 of the first heat dissipation member 11B of variant 4 is mechanically connected to the base substrate 10 (another substrate) via adhesive 131. Furthermore, the end of the third portion 113 of the first heat dissipation member 11B of variant 4 is mechanically connected to the base substrate 10 via adhesive 132.

This improves the physical stability of the first heat dissipation member 11B.

(4.5) Other Modifications Although the power conversion device 100 of the first embodiment includes the base substrate 10, it is not essential that the power conversion device 100 include the base substrate 10. As described above, the terminals 30 of the wiring substrate 3, the second end 914 of the first conductor member 91, and the second end 924 of the second conductor member 92 are on the same imaginary plane. The terminals 30 of the wiring substrate 3, the second end 914 of the first conductor member 91, and the second end 924 of the second conductor member 92 are terminals (electrodes) that can be surface-mounted on the system substrate 200. In other words, the power conversion device 100 (i.e., the power conversion unit 1) that does not include the base substrate 10 may be directly mounted on the system substrate 200. This allows the power conversion device 100 to be further reduced in height in the thickness direction (second direction D2) of the system substrate 200. Furthermore, since the base substrate 10 is not used, the distance between the power conversion unit 1 and the processor 300 is shorter, which allows the length of the control wiring and power supply wiring to be shortened, thereby enabling faster operation.

The power conversion device 100 may include three or more half-bridge circuit modules 4. Similarly, the power conversion device 100 may include three or more drive circuit modules 5. Similarly, the power conversion device 100 may include an inductor module 7 having three conductor members 9 and a magnetic core 8 covering the three conductor members 9.

(Embodiment 2)
A power conversion device 100 according to the second embodiment will be described with reference to FIGS.

The power conversion device 100 of embodiment 2 includes a power conversion unit 1 and a base substrate 10. The power conversion unit 1 of embodiment 2 includes a first substrate unit 2A, a second substrate unit 2B, and an inductor module 7.

The first substrate unit 2A comprises a first substrate 3A, which is a wiring substrate, a first half-bridge circuit module 41, and a first drive circuit module 51. The second substrate unit 2B comprises a second substrate 3B, which is a wiring substrate, a second half-bridge circuit module 42, and a second drive circuit module 52.

The first substrate 3A has a first main surface 31A and a second main surface 32A opposite the first main surface 31A. The normal directions of the first main surface 31A and the second main surface 32A are parallel to the first direction D1. The second main surface 32A faces the inductor module 7. More specifically, the second main surface 32A faces the first surface 801 of the magnetic core 8 of the inductor module 7.

The first substrate 3A is a multi-layer substrate. The first substrate 3A further has a plurality of first terminals 30A connected to the first half-bridge circuit module 41 and the first drive circuit module 51. The plurality of first terminals 30A of the first substrate 3A are arranged on one side surface 33A of the first substrate 3A.

The second substrate 3B has a first main surface 31B and a second main surface 32B opposite the first main surface 31B. The normal directions of the first main surface 31B and the second main surface 32B are parallel to the first direction D1. The second main surface 32B faces the inductor module 7. More specifically, the second main surface 32B faces the second surface 802 of the magnetic core 8 of the inductor module 7.

The second substrate 3B is a multi-layer substrate. The second substrate 3B further has a plurality of second terminals 30B connected to the second half-bridge circuit module 42 and the second drive circuit module 52. The plurality of second terminals 30B of the second substrate 3B are arranged on one side surface 33B of the second substrate 3B.

The first half-bridge circuit module 41 is mounted on the first main surface 31A of the first substrate 3A. The basic configuration of the first half-bridge circuit module 41 of embodiment 2 is the same as that of the first half-bridge circuit module 41 of embodiment 1.

The first half-bridge circuit module 41 of embodiment 2 includes a first half-bridge circuit (half-bridge circuit 40) having two switching elements 411 and 412 (see Figure 9).

The first drive circuit module 51 is mounted on the first main surface 31A of the first substrate 3A. The basic configuration of the first drive circuit module 51 of embodiment 2 is the same as that of the first drive circuit module 51 of embodiment 1.

The first drive circuit module 51 of embodiment 2 controls the two switching elements 411, 412 of the first half-bridge circuit module 41.

The second half-bridge circuit module 42 is mounted on the first main surface 31B of the second substrate 3B. The basic configuration of the second half-bridge circuit module 42 of embodiment 2 is the same as that of the second half-bridge circuit module 42 of embodiment 1.

The second half-bridge circuit module 42 of embodiment 2 includes a second half-bridge circuit (half-bridge circuit 40) having two switching elements 411 and 412.

The second drive circuit module 52 of embodiment 2 is mounted on the first main surface 31B of the second substrate 3B. The basic configuration of the second drive circuit module 52 of embodiment 2 is the same as that of the second drive circuit module 52 of embodiment 1.

The second drive circuit module of embodiment 2 controls the two switching elements 411 and 412 of the second half-bridge circuit module.

The inductor module 7 has a first inductor connected to the connection point between the two switching elements 411, 412 of each of the first half-bridge circuits, and a second inductor connected to the connection point between the two switching elements 411, 412 of each of the second half-bridge circuits. In other words, the inductor module 7 has a first inductor connected to the midpoint 40N1 of the first half-bridge circuit, and a second inductor connected to the midpoint (midpoint 40N1) of the second half-bridge circuit.

The inductor module 7 includes a first conductor member 91A corresponding to the first inductor, a second conductor member 92A corresponding to the second inductor, and a magnetic core 8 covering the first conductor member 91A and the second conductor member 92A.

In embodiment 2, the first conductor member 91A and the second conductor member 92A are L-shaped in side view (see Figure 17). The first conductor member 91A and the second conductor member 92A are the same size and shape. In embodiment 2, the first conductor member 91A and the second conductor member 92A are arranged so that they are inverted relative to each other in side view (left-right reversed in Figure 17).

The first conductor member 91A and the second conductor member 92A each have a first end and a second end. More specifically, the first conductor member 91A has a first end 913 and a second end 914, and the second conductor member 92A has a first end 923 and a second end 924. The first end 913 of the first conductor member 91A is exposed from the first surface 801 of the magnetic core 8. The second portion 912 of the first conductor member 91A is exposed from the second surface 802 of the magnetic core 8 and is disposed along the second surface 802 of the magnetic core 8. Furthermore, the first end 923 of the second conductor member 91B is exposed from the second surface 802 of the magnetic core 8. The second portion 922 of the second conductor member 91B is exposed from the first surface 801 of the magnetic core 8 and is disposed along the first surface 801 of the magnetic core 8.

As shown in FIG. 17, the inductor module 7 is mounted on the second main surface 32A opposite the first main surface 31A of the first substrate 3A, and on the second main surface 32B opposite the first main surface 31B of the second substrate 3B.

The first end 913 of the first conductor member 91A is connected to the second main surface 32A of the first substrate 3A. The first end 923 of the second conductor member 92A is connected to the second main surface 32B of the second substrate 3B.

When viewed from a direction along the longitudinal direction (third direction D3) of one side surface 33A of the first substrate 3A, the second end 914 of the first conductor member 91A and the second end 924 of the second conductor member 92A are aligned with the multiple first terminals 30A and multiple second terminals 30B in the thickness direction (first direction D1) of the first substrate 3A. That is, the second end 914 of the first conductor member 91A has portions that overlap with the multiple first terminals 30A when viewed in the thickness direction (first direction D1) of the first substrate 3A. Similarly, the second end 924 of the second conductor member 92A has portions that overlap with the multiple second terminals 30B when viewed in the first direction D1. Furthermore, the second end 914 of the first conductor member 91A has a portion that overlaps with at least one first terminal 30A of the multiple first terminals 30A when viewed in the first direction D1, and does not necessarily overlap with other first terminals 30A. Similarly, the second end 924 of the second conductor member 92A has a portion that overlaps with at least one of the multiple second terminals 30B when viewed in the first direction D1, and does not necessarily overlap with the other second terminals 30B.

In other words, the multiple first terminals 30A of the first substrate 3A, the multiple second terminals 30B of the second substrate 3B, the second end 914 of the first conductor member 91A, and the second end 924 of the second conductor member 92A are all on the same imaginary plane. The multiple first terminals 30A of the first substrate 3A, the multiple second terminals 30B of the second substrate 3B, the second end 914 of the first conductor member 91A, and the second end 924 of the second conductor member 92A are terminals (electrodes) that can be surface-mounted on another substrate, such as the base substrate 10 or the system substrate 200. In the power conversion device 100 of embodiment 2, the first direction D1 in which the first substrate 3A, the second substrate 3B, and the inductor module 7 are aligned is perpendicular to the thickness direction of the system substrate 200. This allows the power conversion device 100 to be reduced in height in the thickness direction of the system substrate 200 on which the power conversion device 100 is surface-mounted.

Furthermore, in the power conversion device 100 of embodiment 2, the first main surface 101 of the base substrate 10 is electrically connected to a plurality of first terminals 30A of the first substrate 3A, a plurality of second terminals 30B of the second substrate 3B, a second end 914 of the first conductor member 91A, and a second end 924 of the second conductor member 92A. The second main surface 102 of the base substrate 10 has external electrodes 103 that can be surface-mounted to a substrate other than the first substrate 3A and the second substrate 3B.

The other substrate is, for example, a system substrate 200 (see Figure 36). That is, in the power conversion device 100 of embodiment 2, the power conversion unit 1 and the system substrate 200 are electrically connected via the base substrate 10. When the base substrate 10 is surface-mounted on the system substrate 200, the thickness direction of the base substrate 10 and the thickness direction of the system substrate 200 are both parallel to the second direction D2. As in embodiment 1, the base substrate 10 is a multilayer substrate. This allows for greater flexibility in the connection pattern between the power conversion unit 1 (or the power conversion device 100) and the system substrate 200.

Furthermore, in the power conversion device 100 of embodiment 2, as shown in FIG. 19, the first conductor member 91A and the second conductor member 92A are aligned in the longitudinal direction (third direction D3) of one side surface of the first substrate 3A. The directions of current flowing through the first conductor member 91A and the second conductor member 92A are opposite to each other.

The magnetic fluxes of the first conductor member 91A and the second conductor member 92A are cancelled out by the current flowing in the first conductor member 91A and the current flowing in the second conductor member 92A being in opposite directions. This reduces the effective inductance of the first conductor member 91A and the second conductor member 92A, enabling the power conversion device 100 to respond more quickly.

(Variation 1)
A power conversion device 100 according to a first modification of the second embodiment will be described with reference to FIG.

The power conversion device 100 of embodiment 2 further includes a first heat dissipation member 11C and electrically insulating second heat dissipation members 121, 122, and 123.

The shape of the first heat dissipation member 11C is the same as the shape of the first heat dissipation member 11B in Variant 2 of Embodiment 1. In other words, the shape of the first heat dissipation member 11C is U-shaped in side view.

The first portion 111 of the first heat dissipation member 11C faces the power conversion unit 1 and the first main surface 101 of the base substrate 10 in the second direction D2. In a planar view from the second direction D2, a portion of the first portion 111 overlaps the entire inductor module 7. The second portion 112 of the first heat dissipation member 11C faces the first main surface 31A of the first substrate 3A, the first half-bridge circuit module 41, and the first drive circuit module 51 in the first direction D1. In a planar view from the first direction D1, a portion of the second portion 112 overlaps the entire first main surface 31A of the first substrate 3A. An end of the second portion 112 is in contact with the first main surface 101 of the base substrate 10. However, the end of the second portion 112 may not be in contact with the first main surface 101 of the base substrate 10. The third portion 113 of the first heat dissipation member 11C faces the first main surface 31B of the second substrate 3B, the second half-bridge circuit module 42, and the second drive circuit module 52 in the first direction D1. In a plan view from the first direction D1, a portion of the second portion 112 overlaps the entire first main surface 31B of the second substrate 3B. An end of the third portion 113 is in contact with the first main surface 101 of the base substrate 10. However, the end of the third portion 113 may not be in contact with the first main surface 101 of the base substrate 10.

The second heat dissipation member 121 is in contact with the magnetic core 8 of the inductor module 7 in the second direction D2. In a plan view from the second direction D2, a portion of the second heat dissipation member 121 overlaps the entire inductor module 7. The second heat dissipation member 122 is in contact with the first half-bridge circuit module 41 and the first drive circuit module 51 in the first direction D1. In a plan view from the first direction D1, a portion of the second heat dissipation member 122 overlaps the entire first half-bridge circuit module 41 and the entire first drive circuit module 51. The second heat dissipation member 123 is in contact with the second half-bridge circuit module 42 and the second drive circuit module 52 in the first direction D1. In a plan view from the first direction D1, a portion of the second heat dissipation member 123 overlaps the entire second half-bridge circuit module 42 and the entire second drive circuit module 52.

Furthermore, the second heat dissipation member 121 is in contact with the first portion 111 of the first heat dissipation member 11C in the second direction D2. Further, the second heat dissipation member 122 is in contact with the second portion 112 of the first heat dissipation member 11C in the first direction D1. Further, the second heat dissipation member 123 is in contact with the third portion 113 of the first heat dissipation member 11C in the first direction D1. In other words, the first heat dissipation member 11C is thermally coupled to each of the first half-bridge circuit module 41, the second half-bridge circuit module 42, the first drive circuit module 51, the second drive circuit module 52, and the magnetic core 8 of the inductor module 7 via the second heat dissipation member.

This allows heat to be efficiently dissipated from each of the heat-generating half-bridge circuit modules 4, the drive circuit modules 5, and the magnetic core 8 of the inductor module 7, improving the heat dissipation performance of the power conversion device 100.

(Variation 2)
A power conversion device 100 according to a second modification of the second embodiment will be described with reference to FIG.

Compared to the power conversion device 100 of variant 1, the power conversion device 100 of variant 2 further includes adhesives 131 and 132. The adhesives 131 and 132 are conductive. However, it is not essential that the adhesives 131 and 132 are conductive; the adhesives 131 and 132 may be non-conductive adhesives.

The end of the second portion 112 of the first heat dissipation member 11C of variant 2 is mechanically connected to the base substrate 10 (another substrate) via adhesive 131. The end of the third portion 113 of the first heat dissipation member 11C of variant 2 is mechanically connected to the base substrate 10 via adhesive 132.

This improves the physical stability of the first heat dissipation member 11C.

(Embodiment 3)
A power conversion device 100 according to the third embodiment will be described with reference to FIGS.

In the power conversion device 100 of embodiment 3, the shapes of the first conductor member 93 and second conductor member 94 provided in the inductor module 7 differ from the shapes of the first conductor member 91 and second conductor member 92 provided in the inductor module 7 of embodiment 1. Note that the configuration of the power conversion device 100 of embodiment 3, other than the shapes of the first conductor member 93 and second conductor member 94, is the same as that of the power conversion device 100 of embodiment 1.

The first conductor member 93 corresponds to the first conductor member 91 of embodiment 1. As shown in FIG. 25, the first conductor member 93 has a first portion 931 and a second portion 932. The first portion 931 corresponds to the first portion 911 of embodiment 1, and the second portion 932 corresponds to the second portion 912 of embodiment 1.

The first conductor member 93 has a first end 933 and a second end 934. The first end 933 is an end of the first portion 931, and the second end 934 is an end of the second portion 932. The first end 933 is connected to the second main surface 32 of the wiring board 3, and the second end 934 is connected to the first main surface 101 of the base substrate 10. More specifically, the first end 933 is connected to the connection point between the two switching elements 411, 412 of the first half-bridge circuit module 41. In other words, the first end 933 is connected to the midpoint 40N1 of the first half-bridge circuit. The first conductor member 93 and the magnetic core 8 form a first inductor (inductor L1).

The first portion 931 differs from the first portion 911 of embodiment 1 in that it has a shape wound along the third direction D3 so as to have a portion that is annular in side view. In other words, the first portion 931 of embodiment 3 differs from the first portion 911 of embodiment 1 in that it has a spring-shaped portion whose winding axis is along the third direction D3.

The second conductor member 94 corresponds to the second conductor member 92 of embodiment 1. As shown in FIG. 25, the second conductor member 94 has a first portion 941 and a second portion 942. The first portion 941 corresponds to the first portion 921 of embodiment 1, and the second portion 942 corresponds to the second portion 922 of embodiment 1.

The second conductor member 94 has a first end 943 and a second end 944. The first end 943 is an end of the first portion 941, and the second end 944 is an end of the second portion 942. The first end 943 is connected to the second main surface 32 of the wiring board 3, and the second end 944 is connected to the first main surface 101 of the base substrate 10. More specifically, the first end 943 is connected to the connection point between the two switching elements 411, 412 of the second half-bridge circuit module 42. In other words, the first end 943 is connected to the midpoint (midpoint 40N1) of the second half-bridge circuit. The second conductor member 94 and the magnetic core 8 form a first inductor (inductor L1).

The first portion 941 differs from the first portion 921 of embodiment 1 in that it has a shape wound along the third direction D3 so as to have a portion that is annular in side view. In other words, the first portion 941 of embodiment 3 differs from the first portion 921 of embodiment 1 in that it has a spring-shaped portion whose winding axis is along the third direction D3.

(Embodiment 4)
A power conversion device 100 according to the fourth embodiment will be described with reference to FIGS. 29 to 31. FIG.

The power conversion device 100 of embodiment 4 differs from the power conversion device 100 of embodiment 1 in that the power conversion device 100 includes one half-bridge circuit module 4, one drive circuit module 5, and one conductor member 9.

The power conversion device 100 includes a power conversion unit 1 and a base substrate 10. The power conversion unit 1 includes a substrate unit 2C and an inductor module 7. The substrate unit 2C includes a wiring board 3C, a half-bridge circuit module 4, and a drive circuit module 5.

The wiring board 3C has a first main surface 31C and a second main surface 32C opposite the first main surface 31C. The wiring board 3C further has a plurality of terminals 30 connected to the half-bridge circuit module 4 and the drive circuit module 5. The plurality of terminals 30 of the wiring board 3C are arranged on one side surface 33C of the wiring board 3C.

The half-bridge circuit module 4 is mounted on the first main surface 31C of the wiring board 3C. The half-bridge circuit module 4 includes a half-bridge circuit 40 having two switching elements 411, 412.

The drive circuit module 5 is mounted on the first main surface 31C of the wiring board 3C. The drive circuit module 5 controls the two switching elements 411, 412 of the half-bridge circuit module 4.

The inductor module 7 is mounted on the second main surface of the wiring board. The inductor module 7 has a conductor member 9 connected to the connection point between the two switching elements 411, 412 of the half-bridge circuit 40 (the midpoint 40N1 of the half-bridge circuit 40), and a magnetic core 8 covering the conductor member 9.

The conductor member 9 has a first portion 901 and a second portion 902. The first portion 901 and the second portion 902 are rectangular parallelepiped in shape. The first portion 901 and the second portion 902 are continuous and perpendicular to each other, so that the conductor member 9 has an L-shape.

The conductor member 9 has a first end 903 and a second end 904. The first end 903 is an end of the first portion 901, and the second end 904 is an end of the second portion 902. The first end 903 of the conductor member 9 is connected to the second main surface 32C of the wiring board 3C. The second end 904 of the conductor member 9 is aligned with the multiple terminals 30 in the thickness direction (first direction D1) of the wiring board 3C when viewed from the longitudinal direction (third direction D3) of one side surface 33C of the wiring board 3C. In other words, the second end 904 of the conductor member 9 has a portion that overlaps with the multiple terminals 30 when viewed in the thickness direction (first direction D1) of the wiring board 3C. Furthermore, the second end 904 of the conductor member 9 has a portion that overlaps with at least one of the multiple terminals 30 when viewed in the first direction D1, and does not necessarily overlap with other terminals 30.

In the power conversion device 100 of embodiment 4, the first direction D1 in which the second main surface 32C of the wiring board 3C and the first surface of the inductor module 7 face each other is perpendicular to the thickness direction of the system board 200. This makes it possible to reduce the height of the power conversion device 100 in the thickness direction of the system board 200 on which the power conversion device 100 is surface-mounted.

Like the power conversion device 100 of Variant 1 of Embodiment 1, the power conversion device 100 of Embodiment 4 may also further include a first heat dissipation member 11A and electrically insulating second heat dissipation members 121 and 122. When the power conversion device 100 of Embodiment 4 includes the first heat dissipation member 11A and the second heat dissipation members 121 and 122, the first heat dissipation member 11A is thermally coupled to each of the half-bridge circuit module 4, the drive circuit module 5, and the magnetic core 8 of the inductor module 7 via the second heat dissipation members 121 and 122.

Furthermore, like the power conversion device 100 of Modification 2 of Embodiment 1, the power conversion device 100 of Embodiment 4 may also further include a first heat dissipation member 11B and electrically insulating second heat dissipation members 121, 122, and 123.

(Embodiment 5)
A power conversion device 100 according to the fifth embodiment will be described with reference to FIGS.

The power conversion device 100 of embodiment 5 differs from the power conversion device 100 of embodiment 1 in that multiple capacitors 14 are mounted on the first main surface 31D of the wiring board 3D.

The power conversion device 100 includes a power conversion unit 1 and a base substrate 10. The power conversion unit 1 includes a substrate unit 2D and an inductor module 7. The substrate unit 2D includes a wiring board 3D, multiple half-bridge circuit modules 4, multiple drive circuit modules 5, and multiple capacitors 14.

The multiple capacitors 14 are mounted on the first main surface 31C of the wiring board 3C. As shown in FIG. 33, the multiple capacitors 14 function as input capacitors C1 (decoupling capacitors) of the power conversion unit 1.

(Embodiment 6)
A power conversion device 100 according to the sixth embodiment will be described with reference to FIG.

The power conversion device 100 of embodiment 6 differs from the power conversion device 100 of embodiment 1 in that a first composite circuit module 151 and a second composite circuit module 152 are mounted on the first main surface 31E of the wiring board 3E.

The power conversion device 100 includes a power conversion unit 1 and a base substrate 10. The power conversion unit 1 includes a substrate unit 2E and an inductor module 7. The substrate unit 2E includes a wiring board 3E, a first composite circuit module 151, and a second composite circuit module 152.

The first composite circuit module 151 corresponds to the first half-bridge circuit module 41 and the first drive circuit module 51 in embodiment 1. In other words, the first composite circuit module 151 has the functions of the first half-bridge circuit module 41 and the first drive circuit module 51.

The second composite circuit module 152 corresponds to the second half-bridge circuit module 42 and the second drive circuit module 52 in embodiment 1. In other words, the second composite circuit module 152 has the functions of the second half-bridge circuit module 42 and the second drive circuit module 52.

(Embodiment 7)
A power conversion device 100 according to the seventh embodiment will be described with reference to FIG.

The power conversion device 100 of embodiment 7 differs from the power conversion device 100 of embodiment 1 in that it includes an inductor module 7A instead of the inductor module 7.

The inductor module 7A includes multiple conductor members 9 and a magnetic core 8A covering the multiple conductor members 9.

The magnetic core 8A has a structure in which a first magnetic core 81 and a second magnetic core 82 (i.e., multiple magnetic cores) are combined via a gap 16.

(summary)
As is apparent from the above-described embodiment and modified examples, the power conversion device (100) according to the first aspect includes a wiring board (3), a plurality of half-bridge circuit modules (4), a plurality of drive circuit modules (5), and an inductor module (7). The wiring board (3) has a first main surface (31) and a second main surface (32) opposite to the first main surface (31). The plurality of half-bridge circuit modules (4) are mounted on the first main surface (31) of the wiring board (3). The plurality of half-bridge circuit modules (4) each include a half-bridge circuit (40) having a plurality of switching elements (411, 412). The plurality of drive circuit modules (5) are mounted on the first main surface (31) of the wiring board (3). The plurality of drive circuit modules (5) correspond one-to-one to the plurality of half-bridge circuit modules (4) and control the plurality of switching elements (411, 412) of the corresponding half-bridge circuit module (4). The inductor module (7) has a plurality of inductors (L1) connected to the midpoints (40N1) of each of the plurality of half-bridge circuits (40). The inductor module (7) includes a plurality of conductor members (9) and a magnetic core (8). The plurality of conductor members (9) correspond one-to-one to the plurality of inductors (L1). The magnetic core (8) covers the plurality of conductor members (9). Each of the plurality of conductor members (9) has a first end (913, 923) and a second end (914, 924). The first ends (913, 923) of each of the plurality of conductor members (9) are connected to a second main surface (32) of the wiring board (3). The wiring board (3) further has a plurality of terminals (30) connected to the plurality of half-bridge circuit modules (4) and the plurality of drive circuit modules (5). The plurality of terminals (30) of the wiring board (3) are arranged on one side (33) of the wiring board (3). The second ends (914, 924) of each of the plurality of conductor members (9) are aligned with the plurality of terminals (30) in the thickness direction of the wiring board (3) when viewed from a direction along the longitudinal direction of one side surface (33) of the wiring board (3).

This embodiment allows the power conversion device (100) to have a low profile.

The power conversion device (100) according to the second aspect is the same as that according to the first aspect, but further includes a base substrate (10), which is a multilayer substrate. The base substrate (10) has a first main surface (101) facing the wiring board (3) and the inductor module (7), and a second main surface (102) opposite the first main surface (101) of the base substrate (10). The multiple terminals (30) of the wiring board (3) and the second ends (914, 924) of each of the multiple conductor members (9) are electrically connected to the first main surface (101) of the base substrate (10). The second main surface (102) of the base substrate (10) has external electrodes (103) that can be surface-mounted on a substrate other than the wiring board (3).

This embodiment allows for greater flexibility in the connection pattern between the power conversion device (100) and the system board (200).

The power conversion device (100) according to the third aspect is the same as that according to the first or second aspect, and further includes a first heat dissipation member (11A) and an electrically insulating second heat dissipation member (121, 122). The first heat dissipation member (11A) is thermally coupled to each of the multiple half-bridge circuit modules (4), the multiple drive circuit modules (5), and the magnetic core (8) of the inductor module (7) via the second heat dissipation members (121, 122).

This embodiment improves the heat dissipation performance of the power conversion device (100).

In the power conversion device (100) of the fourth aspect, the multiple terminals (30) of the wiring board (3) and the second ends (914, 924) of each of the multiple conductor members (9) of the third aspect are electrically connected to the main surface (first main surface 101) of a substrate (base substrate 10) separate from the wiring board (3). The end of the first heat dissipation member (11A) is mechanically connected to the separate substrate via an adhesive (131).

This embodiment improves the physical stability of the first heat dissipation member (11A).

The power conversion device (100) according to the fifth aspect comprises a first substrate (3A) that is a wiring substrate (3), a first half-bridge circuit module (41), a first drive circuit module (51), a second substrate (3B) that is also a wiring substrate (3), a second half-bridge circuit module (42), a second drive circuit module (52), and an inductor module (7). The first substrate (3A) has a first main surface (31A) and a second main surface (32A) that are opposite to each other. The second substrate (3B) has a first main surface (31B) and a second main surface (32B) that are opposite to each other. The first half-bridge circuit module (41) is mounted on the first main surface (31A) of the first substrate (3A). The first half-bridge circuit module (41) includes a first half-bridge circuit (half-bridge circuit 40) that has a plurality of switching elements (411, 412). The first drive circuit module (51) is mounted on the first main surface (31A) of the first substrate (3A). The first drive circuit module (51) controls a plurality of switching elements (411, 412) of the first half-bridge circuit module (41). The second half-bridge circuit module (42) is mounted on the first main surface (31B) of the second substrate (3B). The second half-bridge circuit module (42) includes a second half-bridge circuit (half-bridge circuit 40) having a plurality of switching elements (411, 412). The second drive circuit module (52) is mounted on the first main surface (31B) of the second substrate (3B). The second drive circuit module (52) controls the plurality of switching elements (411, 412) of the second half-bridge circuit module (42). The inductor module (7) includes a first inductor (inductor L1) connected to the midpoint (40N1) of each of the first half-bridge circuits and a second inductor (inductor L1) connected to the midpoint (40N1) of each of the second half-bridge circuits. The inductor module (7) includes a first conductor member (91A) corresponding to the first inductor, a second conductor member (92A) corresponding to the second inductor, and a magnetic core (8) covering the first conductor member (91A) and the second conductor member (92A). Each of the first conductor member (91A) and the second conductor member (92A) has a first end (913, 923) and a second end (914, 924). The first end (913) of the first conductor member (91A) is connected to the second main surface (32A) of the first substrate (3A). A first end (913) of the second conductor member (92A) is connected to the second main surface (32B) of the second substrate (3B). The first substrate (3A) further has a plurality of first terminals (30A) connected to the first half-bridge circuit module (41) and the first drive circuit module (51). The plurality of first terminals (30A) of the first substrate (3A) are arranged on one side surface (33A) of the first substrate (3A). The second substrate (3B) further has a plurality of second terminals (30B) connected to the second half-bridge circuit module (42) and the second drive circuit module (52). The plurality of second terminals (30B) of the second substrate (3B) are arranged on one side surface of the second substrate (3B). The second end (914) of the first conductor member (91A) is aligned with the multiple first terminals (30A) in the thickness direction of the first substrate (3A) when viewed from the longitudinal direction of one side surface (33A) of the first substrate (3A). The second end (924) of the second conductor member (92A) is aligned with the multiple second terminals (30B) in the thickness direction of the first substrate (3A) when viewed from the longitudinal direction of one side surface (33A) of the first substrate (3A).

This embodiment allows the power conversion device (100) to have a low profile.

In the power conversion device (100) of the sixth aspect, the first conductor member (91A) and the second conductor member (92A) are aligned in the longitudinal direction of one side surface (33) of the first substrate (3A). The directions of current flowing through the first conductor member (91A) and the second conductor member (92A) are opposite to each other.

This aspect enables the power conversion device (100) to achieve faster response.

The power conversion device (100) according to the seventh aspect is the fifth or sixth aspect, further comprising a first heat dissipation member (11C) and an electrically insulating second heat dissipation member (121, 122, 123). The first heat dissipation member (11C) is thermally coupled to each of the first half-bridge circuit module (41), the second half-bridge circuit module (42), the first drive circuit module (51), the second drive circuit module (52), and the magnetic core (8) of the inductor module (7) via the second heat dissipation member.

This embodiment improves the heat dissipation performance of the power conversion device (100).

In the power conversion device (100) of the eighth aspect, in the seventh aspect, the multiple first terminals (30A) of the first substrate (3A), the multiple second terminals (30B) of the second substrate (3B), and the second ends (914, 924) of the first conductor member (91A) and the second conductor member (92A) are electrically connected to the main surface (first main surface 101) of a substrate (base substrate 10) separate from the first substrate (3A) and the second substrate (3B). The end of the first heat dissipation member (11C) is mechanically connected to the separate substrate via an adhesive.

This embodiment improves the physical stability of the first heat dissipation member (11C).

The power conversion device (100) according to the ninth aspect comprises a wiring board (3C), a half-bridge circuit module (4), a drive circuit module (5), and an inductor module (7). The wiring board (3C) has a first main surface (31C) and a second main surface (32C) opposite the first main surface (31C). The half-bridge circuit module (4) is mounted on the first main surface (31C) of the wiring board (3C). The half-bridge circuit module (4) includes a half-bridge circuit (40) having a plurality of switching elements (411, 412). The drive circuit module (5) is mounted on the first main surface (31C) of the wiring board (3C). The drive circuit module (5) controls the plurality of switching elements (411, 412) of the half-bridge circuit module (4). The inductor module (7) includes a conductor member (9) connected to the midpoint (40N1) of the half-bridge circuit (40) and a magnetic core (8) covering the conductor member (9). The conductor member (9) has a first end (903) and a second end (904). The first end (903) of the conductor member (9) is connected to a second main surface (32C) of a wiring board (3C). The wiring board (3C) further includes a plurality of terminals (30) connected to the half-bridge circuit module (4) and the drive circuit module (5). The plurality of terminals (30) of the wiring board (3C) are arranged on one side surface (33C) of the wiring board (3C). The second end (904) of the conductor member (9) is aligned with the plurality of terminals (30) in the thickness direction of the wiring board (3C) when viewed along the longitudinal direction of the one side surface (33C) of the wiring board (3C).

This embodiment allows the power conversion device (100) to have a low profile.

The power conversion device (100) according to the tenth aspect is the same as the ninth aspect, but further includes a first heat dissipation member (11A) and an electrically insulating second heat dissipation member (121, 122). The first heat dissipation member (11A) is thermally coupled to each of the half-bridge circuit module (4), the drive circuit module (5), and the magnetic core (8) of the inductor module (7) via the second heat dissipation members (121, 122).

This embodiment improves the heat dissipation performance of the power conversion device (100).

100 Power conversion device 10 Base substrate 101 First main surface 102 Second main surface 103 External electrodes 3, 3C Wiring substrate 3A First substrate 3B Second substrate 30 Terminal 30A First terminal 30B Second terminal 31, 31A, 31B, 31C First main surface 32, 32A, 32B, 32C Second main surface 33, 33A, 33B, 33C One side surface 4 Half-bridge circuit module 40 Half-bridge circuit (first half-bridge circuit, second half-bridge circuit)
41 First half-bridge circuit module 42 Second half-bridge circuit modules 411, 412 Switching element 5 Drive circuit module 51 First drive circuit module 52 Second drive circuit module 7 Inductor module 8 Magnetic core 9 Conductor members 91, 91A First conductor members 92, 92A Second conductor members 903, 913, 923 First ends 904, 914, 924 Second ends 11A, 11B, 11C First heat dissipation members 121, 122, 123 Second heat dissipation member L1 Inductor (first inductor, second inductor)

Claims (10)

a wiring substrate having a first main surface and a second main surface opposite to the first main surface;
a plurality of half-bridge circuit modules mounted on the first main surface of the wiring board, each including a half-bridge circuit having a plurality of switching elements;
a plurality of drive circuit modules mounted on the first main surface of the wiring board, corresponding one-to-one to the plurality of half-bridge circuit modules, and controlling the plurality of switching elements of the corresponding half-bridge circuit modules;
an inductor module having a plurality of inductors connected to midpoints of the plurality of half-bridge circuits;
Equipped with
The inductor module includes:
a plurality of conductor members corresponding one-to-one to the plurality of inductors;
a magnetic core covering the plurality of conductor members;
Each of the plurality of conductive members has a first end and a second end;
the first end of each of the plurality of conductor members is connected to the second main surface of the wiring substrate;
the wiring board further includes a plurality of terminals connected to the plurality of half-bridge circuit modules and the plurality of drive circuit modules;
the plurality of terminals of the wiring board are arranged on one side surface of the wiring board,
the second ends of the plurality of conductor members are aligned with the plurality of terminals in the thickness direction of the wiring board when viewed from the direction along the longitudinal direction of the one side surface;
Power conversion device. Further provided is a base substrate which is a multilayer substrate,
the base substrate has a first main surface facing the wiring board and the inductor module, and a second main surface opposite to the first main surface of the base substrate;
the second ends of the terminals of the wiring board and the second ends of the conductor members are electrically connected to the first main surface of the base substrate;
the second main surface of the base substrate has external electrodes that can be surface-mounted on a substrate other than the wiring substrate;
The power conversion device according to claim 1 . A first heat dissipation member;
a second heat dissipation member having electrical insulation properties;
Further provided with
the first heat dissipation member is thermally coupled to each of the magnetic cores of the plurality of half-bridge circuit modules, the plurality of drive circuit modules, and the inductor module via the second heat dissipation member;
The power conversion device according to claim 1 . the second ends of the terminals of the wiring board and the second ends of the conductor members are electrically connected to a main surface of a substrate other than the wiring board;
an end portion of the first heat dissipation member is mechanically connected to the other substrate via an adhesive;
The power conversion device according to claim 3 . a first substrate that is a wiring substrate having a first main surface and a second main surface opposite to each other;
a first half-bridge circuit module mounted on the first main surface of the first substrate and including a first half-bridge circuit having a plurality of switching elements;
a first drive circuit module mounted on the first main surface of the first substrate and configured to control the plurality of switching elements of the first half-bridge circuit module;
a second substrate that is a wiring substrate having a first main surface and a second main surface opposite to each other;
a second half-bridge circuit module mounted on the first main surface of the second substrate and including a second half-bridge circuit having a plurality of switching elements;
a second drive circuit module mounted on the first main surface of the second substrate and configured to control the plurality of switching elements of the second half-bridge circuit module;
an inductor module including a first inductor connected to a midpoint of each of the first half-bridge circuits and a second inductor connected to a midpoint of each of the second half-bridge circuits;
Equipped with
The inductor module includes:
a first conductor member corresponding to the first inductor;
a second conductor member corresponding to the second inductor;
a magnetic core covering the first conductor member and the second conductor member,
each of the first conductive member and the second conductive member having a first end and a second end;
the first end of the first conductor member is connected to the second main surface of the first substrate,
the first end of the second conductor member is connected to the second main surface of the second substrate;
the first substrate further includes a plurality of first terminals connected to the first half-bridge circuit module and the first drive circuit module;
the plurality of first terminals of the first substrate are arranged on one side surface of the first substrate,
the second substrate further includes a plurality of second terminals connected to the second half-bridge circuit module and the second drive circuit module;
the second terminals of the second substrate are arranged on one side surface of the second substrate,
the second end of the first conductor member is aligned with the plurality of first terminals in a thickness direction of the first substrate when viewed from a direction along the longitudinal direction of the one side surface of the first substrate,
the second end of the second conductor member is aligned with the plurality of second terminals in the thickness direction of the first substrate when viewed from the direction along the longitudinal direction of the one side surface of the first substrate;
Power conversion device. the first conductor member and the second conductor member are aligned in the longitudinal direction,
The direction of the current flowing through the first conductor member and the second conductor member is opposite to each other.
The power conversion device according to claim 5 . A first heat dissipation member;
a second heat dissipation member having electrical insulation properties;
Further provided with
the first heat dissipation member is thermally coupled to each of the magnetic cores of the first half-bridge circuit module, the second half-bridge circuit module, the first drive circuit module, the second drive circuit module, and the inductor module via the second heat dissipation member;
The power conversion device according to claim 6. the plurality of first terminals of the first substrate, the plurality of second terminals of the second substrate, and the second ends of the first conductor member and the second conductor member are electrically connected to a main surface of a substrate other than the first substrate and the second substrate;
an end portion of the first heat dissipation member is mechanically connected to the other substrate via an adhesive;
The power conversion device according to claim 7. a wiring substrate having a first main surface and a second main surface opposite to the first main surface;
a half-bridge circuit module mounted on the first main surface of the wiring board and including a half-bridge circuit having a plurality of switching elements;
a drive circuit module mounted on the first main surface of the wiring board and controlling the plurality of switching elements of the half-bridge circuit module;
an inductor module having a conductor member connected to a midpoint of the half-bridge circuit and a magnetic core covering the conductor member;
Equipped with
the conductive member has a first end and a second end;
the first end of the conductor member is connected to the second main surface of the wiring board,
the wiring board further includes a plurality of terminals connected to the half-bridge circuit module and the drive circuit module;
the plurality of terminals of the wiring board are arranged on one side surface of the wiring board,
the second end of the conductor member is aligned with the plurality of terminals in the thickness direction of the wiring board when viewed from the direction along the longitudinal direction of the one side surface;
Power conversion device. A first heat dissipation member;
a second heat dissipation member having electrical insulation properties;
Further provided with
The first heat dissipation member includes the half-bridge circuit module, the drive circuit module,
and thermally coupled to each of the magnetic cores of the inductor module via the second heat dissipation member.
The power conversion device according to claim 9.