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WO2025203395A1 - Shape measurement system, structure manufacturing method, structure manufacturing system, and shape measurement method - Google Patents

Shape measurement system, structure manufacturing method, structure manufacturing system, and shape measurement method

Info

Publication number
WO2025203395A1
WO2025203395A1 PCT/JP2024/012508 JP2024012508W WO2025203395A1 WO 2025203395 A1 WO2025203395 A1 WO 2025203395A1 JP 2024012508 W JP2024012508 W JP 2024012508W WO 2025203395 A1 WO2025203395 A1 WO 2025203395A1
Authority
WO
WIPO (PCT)
Prior art keywords
illumination
light
test object
imaging
illumination light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2024/012508
Other languages
French (fr)
Japanese (ja)
Inventor
陽介 宮▲崎▼
大介 二階
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to PCT/JP2024/012508 priority Critical patent/WO2025203395A1/en
Publication of WO2025203395A1 publication Critical patent/WO2025203395A1/en
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/25Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object

Definitions

  • the present invention relates to a shape measurement system, a structure manufacturing method, a structure manufacturing system, and a shape measurement method.
  • a shape measurement system includes a projection device having a first projection device that projects illumination light onto a first illumination area and a second projection device that projects illumination light onto a second illumination area different from the first illumination area; a first imaging device that captures images of the illumination light projected onto the first illumination area and the second illumination area that are formed on the test object; and a calculation device that calculates the shape of the test object based on the images of the first illumination area and the second illumination area captured by the first imaging device.
  • a shape measurement system includes a projection device that projects illumination light onto a first illumination area and a second illumination area that is located differently from the first illumination area, a first imaging device that captures images of the illumination light projected onto the first illumination area and the second illumination area that are formed on the test object, and a calculation device that calculates the shape of the test object based on the images of the first illumination area and the second illumination area captured by the first imaging device.
  • a method for manufacturing a structure includes a design process for creating design information regarding the shape of the structure, a molding process for manufacturing the structure based on the design information, a measurement process for measuring the shape of the manufactured structure using the shape measurement system, and an inspection process for comparing the shape information obtained in the measurement process with the design information.
  • a structure manufacturing system includes a design device that creates design information regarding the shape of a structure, a molding device that manufactures the structure based on the design device, a shape measurement system that measures the shape of the manufactured structure, and a control device that compares the shape information regarding the shape of the structure obtained by the shape measurement system with the design information.
  • a shape measurement method includes projecting illumination light onto a first illumination area using a first projection device, projecting illumination light onto a second illumination area different from the first illumination area using a second projection device, capturing images of the illumination light projected onto the first illumination area and the second illumination area formed on the test object, and calculating the shape of the test object based on the captured images of the first illumination area and the second illumination area.
  • a shape measurement method includes projecting illumination light onto a first illumination area and a second illumination area located differently from the first illumination area using a projection device; capturing images of the illumination light projected onto the first illumination area and the second illumination area formed on the test object; and calculating the shape of the test object based on the images of the first illumination area and the second illumination area captured by the first imaging device.
  • FIG. 1 is a schematic perspective view of a shape measurement system according to an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of the imaging unit as viewed from the Z direction.
  • FIG. 2 is a schematic diagram illustrating the configuration of optical members included in the imaging unit.
  • FIG. 10 is a schematic diagram showing the position of the projection device when viewed from the Z direction.
  • FIG. 2 is a schematic diagram illustrating the configuration of optical members of the projection device.
  • FIG. 1 is a schematic perspective view of an optical element.
  • FIG. 2 is a schematic diagram of the optical element as viewed from the Y direction.
  • FIG. 4 is a schematic diagram illustrating an example of an irradiation area.
  • FIG. 1 is a block diagram of a shape system according to an embodiment of the present invention.
  • FIG. 1 is a block diagram of a shape system according to an embodiment of the present invention.
  • the shape measurement system 1 is a schematic perspective view of a shape measurement system according to this embodiment.
  • the shape measurement system 1 is a system that captures an image of an imaging range that includes at least a portion of a test object A placed on a mounting surface ST of a stage, and measures the shape of the test object.
  • the captured image of the test object A is used, for example, to measure the dimensions and shape of the test object.
  • the shape measurement system 1 includes an imaging unit 11, a support device 12, an operation device 13, a display device 14, a drive device 15, a memory 17, a communication device 18, a calculation device 19, and a projection device 60.
  • the mounting surface ST is disposed on a base member B.
  • the base member B is disposed on a vibration isolation mechanism 126.
  • the vibration isolation mechanism 126 includes an elastic member.
  • the elastic member of the vibration isolation mechanism 126 is a plate-shaped member made of rubber.
  • the support device 12 is configured to movably support the imaging unit 11, and includes an X-axis 121X, a Y-axis 121Y, and a Z-axis 121Z. Each axis is formed from a metal such as cast iron.
  • the X-axis 121X supports the Y-axis 121Y and, together with the Y-axis 121Y, moves the imaging unit 11 in the X direction along the mounting surface ST.
  • the Y-axis 121Y supports the Z-axis 121Z and, together with the Z-axis 121Z, moves the imaging unit 11 in the Y direction along the mounting surface ST and perpendicular to the X direction.
  • a cable guide 125A is connected to the X axis 121X to guide the cable that supplies power to move the Y axis 121Y and the Z axis 121Z
  • a cable guide 125B (not shown) is connected to the Y axis 121Y to guide the cable that supplies power to move the Z axis 121Z
  • a cable guide 125C is arranged on the Z axis 121Z to guide the cable that supplies power to the imaging unit 11.
  • the support device 12 also has a position measurement unit 122.
  • the position measurement unit 122 is configured to measure displacement of the imaging unit 11 in the X, Y, and Z directions from a reference position, and includes, for example, a linear encoder.
  • the position measurement units 122 are arranged on the X-axis 121X, Y-axis 121Y, and Z-axis 121Z, respectively.
  • the position measurement unit 122 for the Z-axis 121Z is preferably located above the imaging unit 11, overlapping with the optical axis.
  • the position of the position measurement unit 122 may be any position, and in practice the position should be determined taking into consideration ease of maintenance and anti-fouling properties.
  • the driving device 15 is a device that drives the shape measurement system 1. Specifically, the driving device 15 moves the Y-axis 121Y, the Z-axis 121Z, and the imaging unit 11 in the X direction, moves the Z-axis 121Z and the imaging unit 11 in the Y direction, and moves the imaging unit 11 in the Z direction. The driving device 15 also uses the Z-axis motor 124 to move the illumination device 50 (described below) in the Z direction relative to the lens barrel 20 (described below).
  • the driving device 15 includes a power source for driving the shape measurement system 1.
  • the imaging unit 11 captures images while moving in the Y direction. That is, the scanning direction of the imaging unit 11 can be said to be the Y direction. More specifically, the scanning direction in this embodiment is the +Y direction. However, this is not limited to this, and the scanning direction may be the -Y direction. The imaging unit 11 may capture images while moving in the Y direction, or may capture images after moving a predetermined distance in the Y direction and then stopping. Although the scanning direction is the Y direction in this embodiment, scanning in the X direction may also be used. Furthermore, multiple scanning directions may be used. For example, scanning in the Y direction up to a predetermined position and then changing the scanning direction to the X direction may also be used.
  • FIG. 2 is a schematic diagram of the imaging unit when viewed from the Z direction.
  • the imaging unit 11 has a lens barrel 20, a second imaging device 30, a first imaging device 40, an illumination device 50, a projection device 60, an epi-illumination device 70, and a base 123.
  • the lens barrel 20 is a casing that houses various components such as the second imaging device 30.
  • the lens barrel 20 may have any shape, but in this embodiment, it is a cylindrical component with its longitudinal direction in the Z direction.
  • the second imaging device 30 is a device that images the test object A.
  • the second imaging device 30 images the image of illumination light La (described below) projected onto the test object A by at least one of the illumination device 50 and the epi-illumination device 70 as the two-dimensional shape of the test object A.
  • the second imaging device 30 is housed within the lens barrel 20.
  • the second imaging device 30 is housed within the lens barrel 20 so that the optical axis AX1 is aligned with the Z direction.
  • the first imaging device 40 is a device that captures an image of the illumination light Lb (described below) projected onto the test object A by the projection device 60.
  • the first imaging device 40 is arranged on the side in a direction perpendicular to the Z direction with respect to the lens barrel 20 (the optical axis AX1 of the second imaging device 30 arranged within the lens barrel 20).
  • the first imaging device 40 is arranged on the -Y direction side of the lens barrel 20 (optical axis AX1).
  • the position at which the first imaging device 40 is provided in other words, the relative position of the first imaging device 40 with respect to the lens barrel 20 (optical axis AX1), is not limited to this and may be arbitrary.
  • the projection device 60 is arranged on the side perpendicular to the Z direction relative to the lens barrel 20 (optical axis AX1).
  • the projection device 60 is arranged on the X direction side of the lens barrel 20 (optical axis AX1), in other words, on the side perpendicular to the Y direction, which is the scanning direction.
  • a first projection device 60a and a second projection device 60b are provided as the projection device 60.
  • the first projection device 60a is arranged on the -X direction side of the lens barrel 20 (optical axis AX1)
  • the second projection device 60b is arranged on the +X direction side of the lens barrel 20 (optical axis AX1).
  • the incident-light illumination device 70 is a device that irradiates illumination light La onto the installation area ST.
  • the incident-light illumination device 70 irradiates illumination light La in a direction along the optical axis AX1 of the second image capture device 30.
  • the incident-light illumination device 70 is arranged on the side of the lens barrel 20 (optical axis AX1) in a direction perpendicular to the Z direction.
  • the incident-light illumination device 70 is arranged in a direction between the +X direction and the +Y direction (first diagonal direction) with respect to the lens barrel 20 (optical axis AX1 of the second image capture device 30) when viewed from the Z direction.
  • the incident-light illumination device 70 is arranged on the first diagonal direction side that is higher than 0° and less than 90° with respect to the lens barrel 20 (optical axis AX1).
  • the epi-illumination device 70 may be disposed on the first diagonal direction side at an angle of 45° with respect to the lens barrel 20 (optical axis AX1).
  • the illumination device 50 is a device that irradiates illumination light La onto the installation area ST.
  • the illumination device 50 irradiates illumination light La in a direction intersecting the optical axis AX1 of the second imaging device 30.
  • the illumination device 50 is an annular illumination device that is provided around the outer peripheral surface of the end of the lens barrel 20 on the Z direction side.
  • the illumination light La from the illumination device 50 illuminates the imaging range of the second imaging device 30.
  • the illumination device 50 irradiates illumination light La radially inward.
  • Multiple light source units of the illumination device 50 that irradiate radially inward of the illumination device 50 are arranged in the Z direction, and the positions at which the light source units are arranged vary depending on the position in the Z direction.
  • the distance between the light source unit and the optical axis AX1 becomes shorter as one moves away from the test object A, and illumination light La is irradiated obliquely from each light source unit onto the test object A.
  • the illumination device 50 is not required and need not be provided. The detailed arrangement position of the illumination device 50 will be described later.
  • base 120A is attached to Z-axis 121Z so that its position in the Y direction relative to Z-axis 121Z is fixed, and Z-axis 121Z to which base 120A is attached is attached to Y-axis 121Y by base 123 so that it can move in the Y direction. Therefore, it can be said that base 120A attaches imaging unit 11 to Y-axis 121Y so that it can move in the Y direction relative to Y-axis 121Y (first axis member). In other words, base 120A is attached to Y-axis 121Y so that its position in the Y direction relative to Y-axis 121Y can change.
  • Y-axis 121Y is attached to X-axis 121X so that it can move in the X direction. Therefore, it can be said that base 120A attaches imaging unit 11 to X-axis 121X so that it can move in the X direction relative to X-axis 121X. In other words, the base 120A is attached to the X-axis 121X so that its position in the X direction relative to the X-axis 121X can be changed.
  • the base 120A is positioned on the side of the lens barrel 20 (optical axis AX1) that intersects with the Z direction (orthogonal in this example).
  • the base 120A is positioned between the first image capture device 40 and the projection device 60 (first projection device 60a) in the circumferential direction (the circumferential direction when the Z direction (direction along the optical axis AX1) is the axial direction). That is, in this embodiment, the base 120A is positioned in a third direction between the -X direction (first direction) and the -Y direction (second direction) with respect to the lens barrel 20 (optical axis AX1) when viewed from the Z direction.
  • the base 120A when viewed from the Z direction, if the direction along the -X direction from the center (optical axis AX1) of the lens barrel 20 is defined as 0° and the direction along the -Y direction from the center (optical axis AX1) of the lens barrel 20 is defined as 90°, the base 120A is positioned on the third direction side that is higher than 0° but less than 90° with respect to the lens barrel 20 (optical axis AX1). For example, base 120A may be positioned 45° toward the third direction relative to lens barrel 20 (optical axis AX1).
  • the angle between the direction passing through the center of lens barrel 20 (optical axis AX1) and along the -X direction and the direction passing through the center of lens barrel 20 (optical axis AX1) and along the third direction is the tilt angle of the third direction.
  • the third direction is tilted toward the -Y direction relative to the -X direction, and the tilt angle of the third direction is greater than 0° and less than 90°, with 45° being preferable.
  • the base 120A has a shape in which its end on the +X direction is attached to the lens barrel 20, extends in the third direction from the end on the +X direction to the end on the -X direction, and has its end on the -X direction attached to the Z axis 121Z.
  • the bases 123, 121Z, and 120A are arranged in a third direction between the -X and -Y directions. This allows the lens barrel 20 (optical axis AX1) to be positioned closer to the Y axis 121Y. Furthermore, the lens barrel 20 can be moved appropriately in the -Y direction during imaging.
  • the positions at which the bases 123, 121Z, and 120A are provided in other words, the relative positions of the bases 123, 121Z, and 120A to the lens barrel 20 (optical axis AX1), are not limited to this and may be arbitrary.
  • an illumination device 50 is provided around the outer circumferential surface of the end portion 20A of the lens barrel 20 on the Z-direction side.
  • the illumination device 50 is a device that irradiates illumination light La toward the installation area ST.
  • the illumination light La is, for example, light in a wavelength band of 400 nm to 700 nm.
  • the illumination light La may be, for example, light in a wavelength band of 435 nm to 700 nm.
  • the illumination device 50 is attached to the outer circumferential surface of the end portion 20A via an attachment portion 51.
  • the illumination device 50 includes a base portion 50A and a light source portion 50B.
  • the base portion 50A is an annular member attached to the outer circumferential surface of the end portion 20A via the attachment portion 51.
  • the inner circumferential surface of the base portion 50A includes an inner circumferential surface 50A1 and an inner circumferential surface 50A2.
  • the inner circumferential surface 50A1 is the surface of the entire inner circumferential surface of the base portion 50A that is located on the opposite side of the Z-direction.
  • the inner circumferential surface 50A1 is, for example, a surface with a constant diameter.
  • the inner circumferential surface 50A2 is connected to the inner circumferential surface 50A1 and is located on the Z-direction side of the inner circumferential surface 50A1 within the entire inner circumferential surface of the base 50A.
  • the inner circumferential surface 50A2 has a shape in which the diameter increases in the Z-direction. In other words, the inner circumferential surface 50A2 is inclined radially outward in the Z-direction.
  • the light source unit 50B is provided on this inner circumferential surface 50A2.
  • the light source unit 50B is configured to emit illumination light La and includes a light source such as an LED (Light Emitting Diode) and a control circuit.
  • the control circuit controls the light source to emit light of different brightness levels using PWM (Pulse Width Modulation) control or the like.
  • PWM Pulse Width Modulation
  • a slit may be formed in the base 50A of the lighting device 50, through which the illumination light Lb from the projection device 60 disposed outside the lighting device 50 can pass.
  • the projection devices 60 are devices that project (irradiate) illumination light Lb onto the installation area ST.
  • the illumination light Lb is light in a wavelength band different from that of the illumination light La (illumination light La1 and illumination light La2 described below), for example, light in a wavelength band of 500 nm or more and 650 nm or less.
  • the illumination light Lb is not limited to this, and may be light in the same wavelength band as the illumination light La.
  • a second image capturing device 30, a first image capturing device 40, an epi-illumination device 70, a polarizer 201, an optical splitter 202, a focusing optical system 203, a quarter-wave plate 204, an imaging optical system 205, a polarizer 206, and an optical splitter 207 are provided inside the lens barrel 20.
  • These components may be arranged at any position inside the lens barrel 20, but an example of arrangement in this embodiment will be described below.
  • the second imaging device 30 is a device that captures an image of the illumination light La projected onto the test object A as the test object A.
  • the second imaging device 30 is an imaging element that generates an image based on an image formed on a light receiving surface.
  • the second imaging device 30 may be, for example, a CMOS (Complementary Metal Oxide Semiconductor) or CCD (Charge Coupled Device) type image sensor.
  • the epi-illumination device 70 is a device that irradiates illumination light La toward the installation area ST.
  • the epi-illumination device 70 is configured to irradiate illumination light La and includes a light source such as an LED (Light Emitting Diode) and a control circuit.
  • the control circuit controls the light source to irradiate light of different brightness levels using PWM (Pulse Width Modulation) control or the like.
  • the light collecting optical system 203 irradiates the test object A placed on the mounting surface ST with illumination light La1 emitted from the epi-illumination device 70 and directed toward the mounting surface ST (Z direction) by the light splitter 202.
  • the light collecting optical system 203 also collects light reflected by the test object A (i.e., the reflected light of the illumination light La and illumination light Lb irradiated on the test object A).
  • the light collecting optical system 203 has a first lens group 203a and a first diaphragm 203b.
  • the first lens group 203a is disposed between the epi-illumination device 70 and the mounting surface ST in the Z direction, more specifically, between the light splitter 202 and the mounting surface ST.
  • the first lens group 203a is disposed so that its optical axis is aligned with the Z direction (the optical axis AX1 of the second image capture device 30).
  • the first lens group 203a constitutes a telecentric optical system in which the chief ray of illumination light La that is emitted from the epi-illumination device 70 and passes through the first lens group 203a toward the mounting surface ST is parallel to the optical axis.
  • the first aperture 203b is disposed between the epi-illumination device 70 and the optical splitter 202, and is configured to adjust the numerical aperture of the focusing optical system 203.
  • the quarter-wave plate 204 is a flat optical member disposed between the first lens group 203a and the mounting surface ST, and changes the polarization state of light passing through it.
  • the quarter-wave plate 204 converts the linearly polarized illumination light La1 that has passed through the polarizer 201 and the first lens group 203a into circularly polarized light and transmits the light.
  • the quarter-wave plate 204 also converts the circularly polarized light reflected by the test object A (i.e., the illumination light La projected onto the test object A) into linearly polarized light having a polarization plane perpendicular to the polarization plane of the light that has passed through the polarizer 201 and transmits the light.
  • the quarter-wave plate 204 is positioned at a predetermined acute angle relative to the object plane of the focusing optical system 203, i.e., the plane perpendicular to the optical axis of the first lens group 203a. This makes it difficult for light reflected by the quarter-wave plate 204 to enter the imaging optical system 205.
  • the imaging optical system 205 forms an image of light reflected by the test object A (i.e., reflected light of the illumination light La and illumination light Lb irradiated on the test object A).
  • the imaging optical system 205 has a second lens group 205a and a second diaphragm 205b.
  • the second lens group 205a is disposed between the first image capturing device 40 (second image capturing device 30) and the mounting surface ST in the Z direction, more specifically, between the optical splitter 202 and the first image capturing device 40 (second image capturing device 30).
  • the second lens group 205a is disposed such that its optical axis is aligned with the optical axis of the first lens group 203a (in this example, the Z direction).
  • the second lens group 205a forms an image of the light reflected by the test object A and passing through the first lens group 203a and the optical splitter 202 on the light receiving surfaces of the first image capturing device 40 and the second image capturing device 30.
  • the second diaphragm 205b is a component for adjusting the numerical aperture of the imaging optical system 205.
  • the second diaphragm 205b and the first diaphragm 203b are disposed at optically equivalent positions with respect to the optical splitter 202. For example, the distance between the second diaphragm 205b and the optical splitter 202 is equal to the distance between the first diaphragm 203b and the optical splitter 202.
  • the polarizer 206 is disposed between the second lens group 205a and the first image capturing device 40 (second image capturing device 30).
  • the polarizer 206 is disposed so as to be in a crossed Nicol state with the polarizer 201. That is, the polarizer 206 transmits only linearly polarized light having a polarization plane orthogonal to the polarization plane of the light transmitted through the polarizer 201, and blocks light having other polarization components.
  • the polarizer 206 Since the light that reaches the polarizer 206 without transmitting through the quarter-wave plate 204 is linearly polarized light having a polarization plane aligned with the direction of the transmission axis of the polarizer 201, the polarizer 206 makes it difficult for light reflected by areas other than the test object A to reach the first image capturing device 40 and the second image capturing device 30.
  • the splitter 207 is disposed on the optical axis of the second lens group 205a, between the polarizer 206 and the first imaging device 40 (second imaging device 30).
  • the splitter 207 reflects a portion of the light reflected by the test object A and guides it to the first imaging device 40, and transmits the remaining portion and guides it to the second imaging device 30.
  • the splitter 207 transmits light in the wavelength band of the illumination light La and reflects light in the wavelength band of the illumination light Lb. Therefore, in this embodiment, the splitter 207 reflects the illumination light Lb reflected by the test object A and guides it to the first imaging device 40, and transmits the illumination light La reflected by the test object A and guides it to the second imaging device 30.
  • illumination light La1 emitted from the epi-illumination device 70 travels in a direction perpendicular to the Z direction (the ⁇ X direction in FIG. 3 ), passes through the polarizer 201, is reflected by the optical splitter 202, and travels in the Z direction.
  • the illumination light La1 reflected by the optical splitter 202 and traveling in the Z direction passes through the first lens group 203a and the quarter-wave plate 204, is emitted from the end 20A of the lens barrel 20 to the outside of the lens barrel 20, and is irradiated onto the test object A placed on the mounting surface ST.
  • the optical axis AX3 of the epi-illumination device 70 runs along a direction perpendicular to the optical axis AX1 (Z direction) of the second imaging device 30 (the first oblique direction in this example) in the section from the epi-illumination device 70 to the optical splitter 202, and is coaxial with the optical axis AX1 in the section from the optical splitter 202 to the mounting surface ST (test object A).
  • the end 20A of the lens barrel 20 is capable of passing the illumination lights La and Lb, and may be provided with a member that is transparent to the illumination lights La and Lb, or may be an opening without any member.
  • the illumination light La2 emitted from the illumination device 50 is irradiated onto the test object A placed on the placement surface ST.
  • the illumination light La (illumination light La1 and La2) irradiated onto the test object A is reflected by the test object A and enters the tube 20 from the end 20A of the tube 20.
  • the reflected light of the illumination light La that entered the tube 20 travels in the opposite direction to the Z direction, passes through the quarter-wave plate 204, the first lens group 203a, the optical splitter 202, the second lens group 205a, the polarizer 206, and the splitter 207, and enters the second imaging device 30.
  • the second imaging device 30 captures the reflected light of the incident illumination light La as an image of the test object A (an image of the illumination light La projected onto the test object A). Therefore, the optical axis AX1 of the second imaging device 30 is along the Z direction.
  • illumination light La In a configuration in which illumination light La is not emitted, light other than illumination light La and illumination light Lb reflected by the test object A (natural light and light from other light sources) enters the lens barrel 20, passes through the quarter-wave plate 204, the first lens group 203a, the optical splitter 202, the second lens group 205a, the polarizer 206, and the splitter 207, and enters the first imaging device 40.
  • the first imaging device 40 captures the light other than illumination light La and illumination light Lb reflected by the test object A as an image of the test object A (an image of light projected onto the test object A).
  • the illumination light Lb emitted from the projection device 60 is irradiated onto the test object A placed on the mounting surface ST.
  • the illumination light Lb irradiated onto the test object A is reflected by the test object A and enters the lens barrel 20 from the end 20A of the lens barrel 20.
  • the illumination light Lb irradiated onto the test object A may be scattered by the test object A and enter the lens barrel 20 from the end 20A.
  • the reflected light of the illumination light Lb that enters the lens barrel 20 travels in the direction opposite to the Z direction, passes through the quarter-wave plate 204, the first lens group 203a, the optical splitter 202, the second lens group 205a, and the polarizer 206, and enters the splitter 207.
  • Fig. 4 is a schematic diagram showing the position of the projection device when viewed from the Z direction.
  • the central axis AX4 of the first projection device 60a when viewed from the Z direction (the optical axis of the first light source device 601A in the section from the first light source device 601A to the first lens group 602A, which will be described later) and the central axis AX4 of the second projection device 60b when viewed from the Z direction (the optical axis of the first light source device 601A in the section from the first light source device 601A to the first lens group 602A, which will be described later) are offset in the Y direction.
  • the central axis AX4 of the first projection device 60a is located on one side in the Y direction with respect to the optical axis AX1 of the lens barrel 20, and the central axis AX4 of the second projection device 60b is located on the other side in the Y direction with respect to the optical axis AX1 of the lens barrel 20.
  • the central axis AX4 of the first projection device 60a is located on the -Y side of the optical axis AX1
  • the central axis AX4 of the second projection device 60b is located on the +Y side of the optical axis AX1.
  • the central axis AX4 of the first projection device 60a may be located on the +Y side of the optical axis AX1
  • the central axis AX4 of the second projection device 60b may be located on the -Y side of the optical axis AX1. Note that when viewed from the Z direction, it is preferable that the first projection device 60a and the second projection device 60b do not protrude from the outer circumferential surface of the lens barrel 20 in the Y direction.
  • the first projection device 60a and the second projection device 60b are located between the position 20Y1 on the outer circumferential surface of the lens barrel 20 that is closest to the +Y direction and the position 20Y2 on the outer circumferential surface of the lens barrel 20 that is closest to the -Y direction.
  • the positions of the irradiation area of the illumination light Lb from the first projection device 60a onto the mounting surface ST (test object A) and the irradiation area of the illumination light Lb from the second projection device 60b onto the mounting surface ST (test object A) can be appropriately shifted in the Y direction.
  • the irradiation areas will be described later.
  • FIG. 5 is a schematic diagram illustrating the configuration of the optical members of the projection device.
  • the structure of the projection device 60 will be described using the first projection device 60a as an example, but the second projection device 60b also has a similar structure to the first projection device 60a.
  • the second projection device 60b when viewed from the Y direction, has a structure that is line-symmetrical with respect to a line extending in the Z direction between the first projection device 60a and the second projection device 60b.
  • FIG. 5 is a schematic diagram illustrating the configuration of the optical members of the projection device.
  • the structure of the projection device 60 will be described using the first projection device 60a as an example, but the second projection device 60b also has a similar structure to the first projection device 60a.
  • the second projection device 60b when viewed from the Y direction, has a structure that is line-symmetrical with respect to a line extending in the Z direction between the first projection device 60a and the second projection device 60b.
  • the second light source device 601B, second lens group 602B, second optical element 603B, and half-wave plate 604 (described later) of the first projection device 60a are located on the ⁇ X direction side with respect to the first light source device 601A (described later), while the second light source device 601B, second lens group 602B, second optical element 603B, and half-wave plate 604 of the second projection device 60b are located on the +X direction side with respect to the first light source device 601A.
  • the projection device 60 also has a first lens group 602A corresponding to the first light source device 601A and a second lens group 602B corresponding to the second light source device 601B as the lens group 602, and a first optical element 603A corresponding to the first light source device 601A and a second optical element 603B corresponding to the second light source device 601B as the optical element 603.
  • the number of light source devices 601 that the projection device 60 has is not limited to two, and may be three or more, or may be one. If the projection device 60 has one light source device 601, it is preferable that the number of projection devices 60 is two or more. This allows the illumination light Lb to be irradiated onto different irradiation areas.
  • the illumination light Lb emitted from the light source device 601, more specifically, the illumination light Lb in the section between the light source device 601 and the lens group 602 has a half-value angle (directivity angle) indicating the angle at which the illumination light Lb spreads in the first alignment direction that is larger than the half-value angle indicating the angle at which the illumination light Lb spreads in the second alignment direction.
  • the half-value angle of the illumination light Lb is not limited to being nonuniform in this manner; for example, the half-value angle in the first alignment direction and the half-value angle in the second alignment direction may be the same.
  • the illumination light Lb emitted by the first light source device 601A when distinguishing between the illumination light Lb emitted by the first light source device 601A and the illumination light Lb emitted by the second light source device 601B, the illumination light Lb emitted by the first light source device 601A will be referred to as illumination light Lb1, and the illumination light Lb emitted by the second light source device 601B will be referred to as illumination light Lb2.
  • the wavelengths of the first light source device 601A and the second light source device 601B are the same. However, the wavelengths of the first light source device 601A and the second light source device 601B may be different.
  • the first light source device 601A is arranged so that the optical axis in the section from the first light source device 601A to the first lens group 602A is along the Z direction, i.e., so that the illumination light Lb1 is emitted in the Z direction.
  • the first light source device 601A is also arranged so that the first orientation direction in which the half-value angle is large is the X direction.
  • the second light source device 601B is arranged so that the optical axis in the section from the second light source device 601B to the second lens group 602B is along a direction perpendicular to the Z direction, i.e., so that the illumination light Lb2 is emitted in a direction perpendicular to the Z direction.
  • the second light source device 601B is arranged so that the optical axis is along the +X direction.
  • the first light source device 601A is also arranged so that the first orientation direction in which the half-value angle is large is the Z direction.
  • the lens group 602 is disposed between the light source device 601 and the optical element 603.
  • the lens group 602 is composed of a plurality of lenses arranged in the optical axis direction.
  • the lens group 602 expands the illumination light Lb emitted from the light source device 601 in a direction perpendicular to the optical axis.
  • the lens group 602 expands the illumination light Lb emitted from the light source device 601 more toward the first alignment direction than toward the second alignment direction. That is, the lens group 602 expands the illumination light Lb toward an angle with a larger half-value angle of the illumination light Lb (i.e., toward the first alignment direction).
  • the lens group 602 does not expand the illumination light Lb toward the second alignment direction, but may also expand the illumination light Lb toward the second alignment direction.
  • the lens group 602 narrows the illumination light Lb, which has been spread toward the first alignment direction, to become parallel light. Therefore, the full width at half maximum of the illumination light Lb emitted from the lens group 602 in the first alignment direction is longer than the full width at half maximum in the second alignment direction.
  • the concave lens 602b expands the illumination light Lb emitted from the light source device 601 toward an angle larger than the half-value angle of the illumination light Lb (i.e., toward the first orientation direction).
  • the convex lens 602c is located further away from the light source device 601 than the concave lens 602b, and focuses the illumination light Lb emitted from the concave lens 602b to form parallel light.
  • the configuration of the lens group 602 is not limited to this, and any configuration that expands the illumination light Lb toward an angle greater than the half-value angle of the illumination light Lb may be used.
  • the first lens group 602A expands the illumination light Lb1 emitted from the first light source device 601A toward the first alignment direction (X direction in this example), narrows the illumination light Lb1 expanded toward the first alignment direction (X direction in this example), and emits the illumination light Lb1 in the Z direction as parallel light whose full width at half maximum in the first alignment direction (X direction in this example) is longer than the full width at half maximum in the second alignment direction (Y direction in this example).
  • the second lens group 602B is disposed between the second light source device 601B and the second optical element 603B.
  • the second lens group 602B includes a convex lens 602a, a concave lens 602b, and a convex lens 602c aligned along the optical axis (+X direction) of the second light source device 601B.
  • Fig. 6 is a schematic perspective view of the optical element
  • Fig. 7 is a schematic view of the optical element as viewed from the Y direction.
  • the optical element 603 is provided between the light source device 601 and the combining unit 605, more specifically, between the lens group 602 and the combining unit 605.
  • the optical element 603 (more specifically, a diffraction grating 603a described below) is disposed at a position conjugate with the test object A (mounting surface ST) with respect to the diaphragm unit 606B described below.
  • the diffraction gratings 603Aa and 603B are the same. For example, if a pattern is arranged on the diffraction grating, the pattern period is the same for the diffraction gratings 603a and 603b. Note that the diffraction gratings 603Aa and 603B may be different. For example, if a pattern is arranged on the diffraction grating, the pattern period is different for the diffraction gratings 603a and 603b.
  • the opening OP may have any shape, but in this embodiment, it is set to a shape that matches the desired shape of the irradiation area (described below) on the test object A (mounting surface ST) onto which the illumination light Lb1 is irradiated.
  • the irradiation area has a horizontally elongated shape with one direction longer than the other direction perpendicular to that direction.
  • the opening OP has a horizontally elongated shape with one direction longer than the other direction perpendicular to that one direction.
  • the length of the opening OP in the first orientation direction (the direction in which the illumination light Lb is spread) is longer than the length in the second orientation direction.
  • the opening OP is a rectangle that is long in the first orientation direction, but is not limited to a rectangle and may be any shape, such as an ellipse, a rectangle with curved corners, or a polygon.
  • Mask portion 603b is provided on the surface of diffraction grating 603a opposite the light source device 601 side.
  • the position at which mask portion 603b is provided is not limited to this.
  • mask portion 603b may be provided at a position away from diffraction grating 603a on the opposite side from light source device 601 side.
  • mask portion 603b may be provided on the surface of diffraction grating 603a facing the light source device 601, or at a position away from diffraction grating 603a on the light source device 601 side.
  • the illumination light Lb incident on the optical element 603 is separated into first diffracted light and second diffracted light by the diffraction grating 603a, and a portion of the first diffracted light and second diffracted light passes through the opening OP and exits the optical element 603.
  • the illumination light Lb1 incident on the first optical element 603A is separated by the diffraction grating 603Aa into illumination light Lb1a, which is the first diffracted light, and illumination light Lb1b, which is the second diffracted light. Portions of the illumination light Lb1a and illumination light Lb1b pass through the opening OP and are emitted from the first optical element 603A in the Z direction. Illumination light Lb1a and illumination light Lb1b travel along different optical paths in the Z direction.
  • the second optical element 603B is provided between the second light source device 601B and the combining unit 605, more specifically between the second lens group 602B and the combining unit 605.
  • the second optical element 603B has a diffraction grating 603Ba as the diffraction grating 603a and a mask unit 603Bb as the mask unit 603b.
  • the length of the opening OP of the mask unit 603Bb in the Z direction, which is the first alignment direction, is longer than the length in the Y direction, which is the second alignment direction.
  • the illumination light Lb2 incident on the second optical element 603B is separated by the diffraction grating 603Ba into illumination light Lb2a, which is the first diffracted light, and illumination light Lb2b, which is the second diffracted light. Portions of the illumination light Lb2a and illumination light Lb2b pass through the opening OP and are emitted from the second optical element 603B in the +X direction. Illumination light Lb2a and illumination light Lb2b travel in the +X direction along different optical paths.
  • Diffraction grating 603Ba may also emit diffracted light other than the first diffracted light (illumination light Lb2a) and the second diffracted light (illumination light Lb2b), but this diffracted light is blocked by diaphragm section 606B, which will be described later.
  • the opening OP of the second optical element 603B (mask portion 603Bb) is located at a different position in the Y direction (scanning direction) relative to the opening OP of the first optical element 603A (mask portion 603Ab). Furthermore, the virtual locus formed by projecting the periphery of the opening OP of the second optical element 603B in the +X direction does not overlap with the virtual locus formed by projecting the periphery of the opening OP of the first optical element 603A in the Z direction. In the examples of Figures 6 and 7, the opening OP of the second optical element 603B is located on the -Y direction side of the opening OP of the first optical element 603A.
  • the end of the opening OP of the second optical element 603B closest to the +Y direction is located on the -Y direction side of the end of the opening OP of the first optical element 603A closest to the -Y direction.
  • the opening OP of the second optical element 603B and the opening OP of the first optical element 603A are spaced apart in the Y direction.
  • the positional relationship may be reversed; for example, the opening OP of the second optical element 603B may be located on the +Y direction side of the opening OP of the first optical element 603A.
  • the optical paths of the illumination lights Lb1a and Lb1b that pass through the opening OP of the first optical element 603A and the optical paths of the illumination lights Lb2a and Lb2b that pass through the opening OP of the second optical element 603B can be shifted in the Y direction.
  • the optical paths of the illumination lights Lb2a and Lb2b are located on the -Y direction side of the optical paths of the illumination lights Lb1a and Lb1b.
  • the half-wave plate 604 is provided between the second optical element 603B and the combining unit 605.
  • the half-wave plate 604 is a flat optical element that changes the polarization state of transmitted light. More specifically, it rotates the polarization direction of linearly polarized light before transmitting it.
  • the illumination light beams Lb2a and Lb2b emitted from the second optical element 603B are emitted from the half-wave plate 604 with their polarization direction rotated by the half-wave plate 604.
  • the half-wave plate 604 By providing the half-wave plate 604 between the second optical element 603B and the combining unit 605 in this manner, the illumination light beams Lb2a and Lb2b can be appropriately reflected in the subsequent combining unit 605, thereby preventing a decrease in the intensity of the illumination light beams Lb2a and Lb2b irradiated onto the test object A.
  • the half-wave plate 604 does not necessarily have to be provided between the second optical element 603B and the combining unit 605.
  • the half-wave plate 604 may be disposed anywhere between the second light source device 601B and the combining unit 605.
  • the half-wave plate 604 may be disposed between the second optical element 603B and the second light source device 602B.
  • the half-wave plate 604 may be disposed between the convex lens 602a and the concave lens 602b.
  • the half-wave plate 604 may be disposed on the first light source device 601A side.
  • the half-wave plate 604 may be disposed anywhere between the first light source device 601A and the combining unit 605.
  • the half-wave plate 604 may be disposed between the first optical element 603A and the first light source device 601A.
  • the half-wave plate 604 may be disposed between the convex lens 602a and the concave lens 602b.
  • the half-wave plate does not need to be provided.
  • the combining unit 605 emits the illumination light Lb1 (illumination light Lb1a, Lb1b) and the illumination light Lb2 (illumination light Lb2a, Lb2b) in the Z direction.
  • the combining unit 605 transmits illumination light Lb1 (illumination light Lb1a, Lb1b) traveling in the Z direction and emits it in the Z direction, and reflects illumination light Lb2 (illumination light Lb2a, Lb2b) traveling in the +X direction and emits it in the Z direction.
  • the combining unit 605 is a polarizing beam splitter (PBS).
  • the projection optical system 606 is provided between the combining unit 605 and the placement surface ST.
  • the projection optical system 606 projects the light combined by the combining unit 605, i.e., the illumination lights Lb1a, Lb1b, Lb2a, and Lb2b emitted from the combining unit 605, onto the test object A on the placement surface ST.
  • the projection optical system 606 has a condenser 606A, an aperture unit 606B, a condenser 606C, a reflector 606D, and a half-wave plate 606E.
  • the condenser 606A, the aperture unit 606B, the condenser 606C, the reflector 606D, and the half-wave plate 606E are arranged side by side in the Z direction.
  • the light-collecting unit 606A collects (narrows) the illumination light Lb1a, Lb1b, Lb2a, and Lb2b emitted from the combining unit 605, and emits the collected illumination light Lb1a, Lb1b, Lb2a, and Lb2b in the Z direction.
  • the light-collecting unit 606A is, for example, a convex lens.
  • Aperture section 606B is positioned on the Z-direction side of condenser section 606A.
  • Aperture section 606B is provided at the focal position of the light emitted from condenser section 606A.
  • Aperture section 606B transmits only illumination light Lb1a, Lb1b, Lb2a, and Lb2b out of the light emitted from condenser section 606A.
  • aperture section 606B blocks light of orders other than illumination light Lb1a, Lb1b, Lb2a, and Lb2b.
  • Aperture section 606B blocks light of diffraction angles other than illumination light Lb1a, Lb1b, Lb2a, and Lb2b.
  • the diffraction grating 603b may emit diffracted light other than the first diffracted light (illumination light Lb1a, Lb2a) and the second diffracted light (illumination light Lb1b, Lb2b), and the diaphragm unit 606B blocks this diffracted light and transmits only the illumination light Lb1a, Lb1b, Lb2a, and Lb2b.
  • the position where the illumination light from the first light source device 601A is condensed and the position where the illumination light from the second light source device 601B is condensed are different in the Y direction of the diaphragm unit 606B, as shown in FIG. 5 .
  • the light from the diaphragm unit 606B is reflected by the reflector 606D and guided to the test object A (mounting surface ST).
  • the illumination light from the first light source device 601A and the illumination light from the second light source device 601B are irradiated onto the reflector 606D from different positions in the Y direction in the aperture section 606B, resulting in different angles of incidence on the test object A (mounting surface ST).
  • the diffraction gratings 603a and 603b are the same, and the spacing between their light and dark patterns is the same.
  • the angles of incidence on the test object A (mounting surface ST) of the illumination light from the first light source device 601A and the illumination light from the second light source device 601B are different, allowing the spacing between the light and dark patterns irradiated onto the test object A to be different.
  • Different diffraction gratings may be used for the diffraction gratings 603a and 603b, and focal positions may be set at different positions in the Y direction of the aperture section 606B.
  • Different diffraction gratings may be used for the diffraction gratings 603a and 603b, and focal positions may be set at the same position in the Y direction of the aperture section 606B.
  • the light-collecting unit 606C is arranged on the Z-direction side of the aperture unit 606B.
  • the light-collecting unit 606C collects (stops down) the illumination light Lb1a, Lb1b, Lb2a, and Lb2b emitted from the aperture unit 606B, and emits the collected illumination light Lb1a, Lb1b, Lb2a, and Lb2b in the Z direction.
  • the light-collecting unit 606C is, for example, a convex lens.
  • the illumination light Lb1a, Lb1b and the illumination light Lb2a, Lb2b are combined by the combining unit 605 and travel in the Z direction.
  • the illumination light Lb1a, Lb1b, Lb2a, and Lb2b traveling in the Z direction pass through the focusing section 606A, the aperture section 606B, and the focusing section 606C, are reflected by the reflecting section 606D, and are irradiated (projected) onto the test object A placed on the mounting surface ST.
  • the illumination lights Lb1a and Lb1b reflected by the reflecting unit 606D are combined and irradiated onto the same irradiation area on the test object A.
  • the illumination lights Lb1a and Lb1b interfere with each other and are projected onto the same irradiation area on the test object A as structured illumination light having a light-dark pattern (stripes) whose brightness or intensity varies in the X direction.
  • the illumination lights Lb2a and Lb2b reflected by the reflecting unit 606D are combined and irradiated onto the same irradiation area on the test object A.
  • the illumination lights Lb2a and Lb2b interfere with each other and are projected onto the same irradiation area on the test object A as structured illumination light having a light-dark pattern whose brightness or intensity varies in the X direction.
  • the structured illumination light of illumination lights Lb1a and Lb1b projected (irradiated) onto the test object A and the structured illumination light of illumination lights Lb2a and Lb2b are scattered by the test object A, enter the lens barrel 20 from the end 20A of the lens barrel 20, and are then incident on the first imaging device 40.
  • the first imaging device 40 captures an image of the illumination lights Lb1a and Lb1b (structured illumination light) projected onto the test object A and an image of the illumination lights Lb2a and Lb2b (structured illumination light) projected onto the test object A.
  • Fig. 8 is a schematic diagram for explaining an example of the irradiation area.
  • Fig. 8 shows an example of the irradiation area when viewed from the Z direction.
  • the projection device 60 irradiates the same irradiation area on the test object A (mounting surface ST) with structured illumination light obtained by combining the illumination lights Lb1a and Lb1b as the illumination light Lb, and irradiates the same irradiation area on the test object A (mounting surface ST) with structured illumination light obtained by combining the illumination lights Lb2a and Lb2b as the illumination light Lb.
  • the illumination area irradiated with the illumination lights Lb2a and Lb2b (the area onto which the images of the illumination lights Lb2a and Lb2b are projected), in other words, the illumination area irradiated with the illumination lights Lb2a and Lb2b that have passed through the opening OP of the second optical element 603B, is referred to as the illumination area ARB.
  • the orientation of the stripes of the light and dark pattern formed by the structured illumination light projected onto the illumination area ARA is inclined with respect to the Y direction (scanning direction).
  • the orientation of the stripes of the light and dark pattern formed by the structured illumination light projected onto the illumination area ARA is determined by the orientation of the pattern of the diffraction grating 603a.
  • Illumination area ARA and illumination area ARB are located in different positions.
  • the projection device 60 irradiates illumination light Lb onto illumination area ARA (first illumination area) and illumination area ARB (second illumination area) different from illumination area ARA.
  • the opening OP of the first optical element 603A through which illumination light Lb1a and Lb1 passes and the opening OP of the second optical element 603B through which illumination light Lb2a and Lb2 pass are formed in different positions, so that illumination area ARA and illumination area ARB are also located in different positions.
  • the opening OP of the first optical element 603A through which the illumination lights Lb1a and Lb1 pass and the opening OP of the second optical element 603B through which the illumination lights Lb2a and Lb2 pass are located at different positions in the Y direction. Therefore, the irradiation areas ARA and ARB are also located at different positions in the Y direction (first direction; scanning direction). In other words, the irradiation areas ARA and ARB are aligned in the Y direction on the test object A (mounting surface ST). In this embodiment, the irradiation area ARB is located on the -Y direction side of the irradiation area ARA.
  • the opening OP of the first optical element 603A and the opening OP of the second optical element 603B through which the illumination lights Lb2a and Lb2 pass are spaced apart in the Y direction. Therefore, the irradiation areas ARA and ARB are formed at positions spaced apart in the Y direction on the test object A (mounting surface ST).
  • the illumination light Lb from the projection device 60 is irradiated onto the test object A (mounting surface ST) in a direction tilted from the optical axis AX2 of the first imaging device 40.
  • This can cause the illumination light Lb to be blurred, potentially resulting in the irradiation areas ARA and ARB becoming larger than expected.
  • by setting the irradiation areas ARA and ARB at positions separated in the Y direction it is possible to prevent the irradiation areas ARA and ARB from overlapping.
  • the length D2A of the irradiation area ARA in the X direction is longer than the length D1A in the Y direction.
  • the length D2B of the irradiation area ARB in the X direction is longer than the length D1B in the Y direction. That is, the irradiation areas ARA and ARB have a horizontally elongated shape that is longer in the X direction than in the Y direction.
  • the irradiation areas ARA and ARB are rectangular with their long sides in the X direction when the surface of the test object A (mounting surface ST) onto which the image of the illumination light Lb is projected is a plane perpendicular to the Z direction.
  • this is not limited to rectangular shapes, and they may be any shape, such as an ellipse, a rectangle with curved corners, or a polygon.
  • the irradiation areas ARA and ARB in the Y direction scanning direction
  • the three-dimensional shape of the test object A can be measured with high accuracy while maintaining the frame rate within an appropriate range.
  • the three-dimensional shape of a wide area can be measured with a single irradiation of the illumination light Lb.
  • the length D2A of the irradiation area ARA and the length D2B of the irradiation area ARB are the same.
  • the length D1A of the irradiation area ARA and the length D1B of the irradiation area ARB are the same.
  • the lengths of the irradiation areas ARA and ARB in the X and Y directions are the same, so that the shape of the test object A can be calculated appropriately.
  • this is not limited to this, and the length D2A and the length D2B may be different, or the length D1A and the length D1B may be different.
  • distance D3A is shorter than the lengths D2A and D2B of irradiation areas ARA and ARB.
  • Distance D3A is also shorter than the lengths D1A and D1B of irradiation areas ARA and ARB.
  • the projection device 60 includes a first projection device 60a and a second projection device 60b.
  • the first projection device 60a and the second projection device 60b irradiate the test object A (mounting surface ST) with illumination light from different directions.
  • the first projection device 60a is provided on the +X direction side of the lens barrel 20 (the optical axis AX2 of the first image pickup device 40) and irradiates the test object A (mounting surface ST) with illumination light from the +X direction side.
  • the irradiation area of the illumination light Lb (structured illumination light) emitted from the first projection device 60a and the irradiation area of the illumination light Lb (structured illumination light) emitted from the second projection device 60b are located in different positions.
  • the projection device 60 has a first projection device 60a that projects illumination light Lb onto a first irradiation area, and a second projection device 60b that projects illumination light Lb onto a second irradiation area different from the first irradiation area.
  • the first projection device 60a and the second projection device 60b are arranged in different positions, so that the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b are located in different positions.
  • the first projection device 60a and the second projection device 60b are located at different positions in the Y direction. Therefore, the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b are also located at different positions in the Y direction (first direction; scanning direction). In other words, the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b are aligned in the Y direction on the test object A (mounting surface ST). In this embodiment, the irradiation area of the second projection device 60b is located on the -Y direction side of the irradiation area of the first projection device 60a. Furthermore, the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b are formed at positions separated in the Y direction on the test object A (mounting surface ST).
  • the configuration for positioning the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b at different or distant positions is not limited to shifting the positions of the first projection device 60a and the second projection device 60b.
  • the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b may be positioned at different or distant positions by shifting the position of the opening OP of the optical element 603 of the first projection device 60a and the opening OP of the optical element 603 of the second projection device 60b, or by shifting the position of the light source device 601 of the first projection device 60a and the light source device 601 of the second projection device 60b.
  • the illumination light Lb from the second projection device 60b can be projected onto that portion, allowing for appropriate measurement of the three-dimensional shape. Furthermore, by positioning the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b at different positions, the illumination light Lb projected from different directions can be simultaneously projected onto different areas on the test object A, allowing for appropriate measurement of the three-dimensional shape of the test object A.
  • the lengths in the X direction of the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b are the same.
  • the lengths in the Y direction of the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b are the same.
  • the lengths in the X direction and the Y direction of the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b are the same, so that the shape of the test object A can be appropriately calculated.
  • this is not limited to this, and the lengths in the X direction and the Y direction of the irradiation areas may be different.
  • the distance in the Y direction between the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b (the distance between the irradiation area ARAa of the first projection device 60a and the irradiation area ARAb of the second projection device 60b, and the distance between the irradiation area ARBa of the first projection device 60a and the irradiation area ARBb of the second projection device 60b) is defined as distance D3B.
  • distance D3B is shorter than the length in the X direction of the irradiation areas of the first projection device 60a and the second projection device 60b.
  • Distance D3B is also shorter than the length in the Y direction of the irradiation areas of the first projection device 60a and the second projection device 60b. By shortening the length of distance D3B in this way, it is possible to prevent the total length of multiple irradiation areas in a single irradiation of illumination light from becoming too long in the Y direction, and the three-dimensional shape of test object A can be measured with high accuracy while maintaining the frame rate within an appropriate range.
  • the first projection device 60a and the second projection device 60b each project illumination light onto the irradiation area ARA and the irradiation area ARB. That is, the first projection device 60a projects an image of illumination light Lb1a and Lb1b onto the irradiation area ARAa, and projects an image of illumination light Lb2a and Lb2b onto the irradiation area ARBa. Similarly, the second projection device 60b projects an image of illumination light Lb1a and Lb1b onto the irradiation area ARAb, and projects an image of illumination light Lb2a and Lb2b onto the irradiation area ARBb.
  • the illumination areas ARAa, ARBa, ARAb, and ARBb are aligned in the Y direction and are spaced apart from each other in the Y direction.
  • the irradiation areas ARAa, ARBa, ARAb, and ARBb are arranged in this order in the -Y direction.
  • the irradiation areas ARAa, ARBa, ARAb, and ARBb are positioned so as not to overlap with the optical axis AX2 of the first imaging device 40 when viewed from the Z direction. More specifically, the optical axis AX2 is located between the irradiation areas ARBa and ARAb when viewed from the Z direction.
  • each irradiation area can be evenly arranged around the optical axis AX2, so that each irradiation area can be properly imaged.
  • the irradiation areas ARAa, ARBa, ARAb, and ARBb are arranged in this order in the -Y direction, but this is not limited thereto.
  • the order in the -Y direction may be irradiation area ARAa, irradiation area ARBa, irradiation area ARBb, and irradiation area ARAb.
  • length D4 is shorter than the length in the X direction of the irradiation area (lengths D2A and D2B in this embodiment). This prevents the entire irradiation area from becoming too long in the Y direction, allowing the three-dimensional shape of test object A to be measured with high accuracy while maintaining the frame rate within an appropriate range.
  • length D4 refers to the length in the Y direction from the end of the irradiation area located furthest in the -Y direction on the -Y side to the end of the irradiation area located furthest in the +Y direction on the +Y side. That is, in this embodiment, length D4 refers to the length from the end of irradiation area ARBb furthest in the -Y direction to the end of irradiation area ARAa furthest in the +Y direction on the +Y side.
  • the imaging area of the first imaging device 40 is referred to as imaging area AR0.
  • the imaging area AR0 is the range (imaging range) imaged by the first imaging device 40 in one imaging.
  • all of the irradiation areas onto which the illumination light Lb is projected by the projection device 60 in one irradiation are located within the imaging area AR0. That is, in this embodiment, the entire irradiation areas ARAa, ARBa, ARAb, and ARBb are located within the imaging area AR0.
  • the imaging area of the second imaging device 30 coincides with the imaging area AR0 of the first imaging device 40, but this is not limited to this.
  • part of the imaging area of the second imaging device 30 may be located outside the imaging area AR0 of the first imaging device 40, or part of the imaging area AR0 of the first imaging device 40 may be located outside the imaging area of the second imaging device 30.
  • the first projection device 60a and the second projection device 60b each project illumination light onto the irradiation area ARA and the irradiation area ARB, but this is not limited to this.
  • the first projection device 60a and the second projection device 60b may project illumination light onto only one of the irradiation area ARA and the irradiation area ARB.
  • only one projection device 60 may be provided, and the single projection device 60 may project illumination light onto the irradiation area ARA and the irradiation area ARB.
  • Fig. 9 is a block diagram of the shape system according to this embodiment
  • Fig. 10 is a functional block diagram of the arithmetic device according to this embodiment.
  • the shape measurement system 1 according to this embodiment includes the imaging unit 11, the support device 12, the operation device 13, the display device 14, the drive device 15, the memory 17, the communication device 18, the arithmetic device 19, and the projection device 60, as described above.
  • the calculation device 19 calculates the shape of the test object A based on the image of the first irradiation area and the image of the second irradiation area captured by the first imaging device 40. In this embodiment, since an image of the illumination light Lb having a light and dark pattern is projected onto the first irradiation area and the second irradiation area, the calculation device 19 calculates the three-dimensional shape of the test object A by a phase shift method using the image of the illumination light Lb captured by the first imaging device 40.
  • the arithmetic unit 19 executes the loaded computer program 171.
  • logical functional blocks are realized within the arithmetic unit 19 for executing the processing to be performed by the shape measurement system 1 (for example, the processing to calculate the three-dimensional shape of the test object A described below).
  • the arithmetic unit 19, together with the memory 17 etc. in which the computer program 171 is recorded can function as a controller or computer for realizing logical functional blocks for executing the processing to be performed by the shape measurement system 1.
  • the shape measurement system 1 is configured to perform the processing (for example, the processing to calculate the three-dimensional shape of the test object A described below) provided by the memory 17 etc. together with at least one processor provided in the arithmetic unit 31.
  • the arithmetic device 19 includes a drive control unit 191, an irradiation control unit 192, an imaging control unit 193, a synthesis unit 194, and an estimation unit 195.
  • the arithmetic device 19 realizes the drive control unit 191, the irradiation control unit 192, the imaging control unit 193, the synthesis unit 194, and the estimation unit 195 by reading and executing a computer program 171 (software) from the memory 17.
  • the drive control unit 191 controls the drive device 15 to start control to move the imaging unit 11 relative to the specimen A (mounting surface ST) in the Y direction (+Y direction in this example) (step S10).
  • the drive control unit 191 supplies a control signal to the drive device 15 to move the imaging unit 11 in the Y direction at a predetermined speed.
  • the imaging control unit 193 also acquires information indicating the position of the imaging unit 11 at the time of imaging from the position measurement unit 122.
  • the imaging control unit 193 stores the information about the imaging unit 11 in association with the captured image in the memory 17.
  • the illumination control unit 192 controls at least one of the illumination device 50 and the epi-illumination device 70 to stop the emission of illumination light La from the illumination device 50 and the epi-illumination device 70.
  • the illumination control unit 192 controls the first projection device 60a and the second projection device 60b to simultaneously irradiate the illumination light Lb onto the illumination area ARAa, the illumination area ARBa, the illumination area ARAb, and the illumination area ARBb.
  • images of illumination light Lb (structured illumination light) having a light and dark pattern are simultaneously projected onto illumination areas ARAa, ARBa, ARAb, and ARBb.
  • step S20 If the 3D imaging time has not arrived (step S20; No), the imaging control unit 193 returns to step S20 and waits until the 3D imaging time arrives.
  • the imaging control unit 193 controls the first imaging device 40 to image the imaging area AR0 of the first imaging device 40 while the imaging unit 11 is moving (Step S22).
  • the imaging control unit 193 controls the first imaging device 40 to image the imaging area AR0 of the first imaging device 40 multiple times while the imaging unit 11 is moving.
  • the imaging control unit 193 supplies a control signal to the first imaging device 40, causing the first imaging device 40 to generate a pattern image (an image obtained by capturing an image of the illumination light Lb (structured illumination light) projected onto the test object A).
  • the imaging control unit 193 acquires multiple pattern images from the first imaging device 40 and stores them in memory 17 in association with the imaging times.
  • the imaging control unit 193 also stores the position of the imaging unit 11 at the imaging time of each pattern image in memory 17 in association with the pattern image.
  • the first imaging device 40 captures images multiple times while moving together with the projection device 60.
  • the orientation of the structured illumination light pattern is inclined with respect to the Y direction (scanning direction).
  • multiple pattern images are generated in which light beams with mutually different phases are irradiated at specific positions on the test object A.
  • the three-dimensional shape of the test object A can be estimated based on the multiple pattern images generated in this manner. Therefore, in order to estimate the three-dimensional shape of the test object A, it is not necessary to change the light-dark phase of the structured illumination light emitted by the projection device 60.
  • a diffraction grating is used to create a light-dark pattern, but the method for creating a light-dark pattern is not limited to this.
  • a projector that projects a light-dark pattern may also be used. When using a projector that projects a light-dark pattern, for example, multiple projectors may be used in the first projection device 60a, or multiple patterns may be projected by a single projector.
  • the drive control unit 191 determines whether the imaging unit 11 has reached the end in the Y direction (step S24). For example, the drive control unit 191 determines that the imaging unit 11 has reached the end in the Y direction when the time required for the imaging unit 11 to reach from one end to the other in the Y direction has elapsed. The drive control unit 191 may also determine whether the imaging unit 11 has reached the end in the Y direction by obtaining information indicating the position of the imaging unit 11 from the position measurement unit 122.
  • step S24 If the imaging unit 11 has not reached the end in the Y direction (step S24; No), the calculation device 19 stops the imaging by the first imaging device 40 and the irradiation by the projection device 60, returns to step S12, and continues control.
  • the calculation device 19 stops the imaging of the first imaging device 40 and the irradiation of the projection device 60, and controls the drive device 15 to stop the imaging unit 11 (step S26).
  • the drive control unit 191 supplies a control signal to the drive device 15 to stop the imaging unit 11.
  • the drive control unit 191 determines whether the imaging unit 11 has reached the end in the X direction and all imaging has been completed (step S28). If the imaging unit 11 has not reached the end in the X direction (step S28; No), the drive control unit 191 moves the imaging unit 11 in the X direction (step S30) and returns to step S10 to continue processing.
  • the drive control unit 191 supplies a control signal to the drive device 15 to move the imaging unit 11 in the X direction. Note that in this case, since the imaging unit 11 has reached the end in the +Y direction, the drive control unit 191 may move the imaging unit 11 in the -Y direction in step S12. Alternatively, the drive control unit 191 may move the imaging unit 11 in the X direction and to the end in the -Y direction in step S30, and continue processing in step S10.
  • step S28 If the imaging unit 11 reaches the end in the X direction (step S28; Yes), the calculation device 19 ends the imaging process.
  • the time of imaging can be based on the time of imaging at a specified position.
  • the time of imaging the starting position for imaging the test object A is used as the reference time to manage the imaging time.
  • the synthesis unit 194 acquires multiple captured images captured by the second imaging device 30 and information (position information) indicating the position of the imaging unit 11 at the time of capture for each captured image, which are stored in the memory 17.
  • the synthesis unit 194 synthesizes the multiple captured images based on the multiple captured images and the position information to generate a composite image.
  • the composite image is a two-dimensional image of a region of the test object A that is imaged while the second imaging device 30 is moving.
  • FIG. 12 is a flowchart illustrating the composite image generation process.
  • the flow shown in FIG. 12 (processing for generating a composite image) is executed by the arithmetic unit 19. More specifically, in this embodiment, the flow shown in FIG. 12 is executed by the arithmetic unit 19 reading and executing the computer program 171 (software), in other words, by the synthesis unit 194, which is a logical functional block. As described above, at least a portion of the functional block may be executed by hardware, and therefore the process of FIG. 12 may be executed by hardware or by a combination of hardware and the computer program 171 (software).
  • the flow shown in FIG. 12 may also be executed by a processor dedicated to image processing, such as an ASIC.
  • the process for generating a composite image is executed in parallel with the imaging process each time a captured image is stored in memory 17 in step S16 of the imaging process.
  • this is not limited to this, and the process for generating a composite image may be executed after the imaging process is completed.
  • the composition unit 194 acquires the captured image stored in the memory 17 in step S16 of the imaging process (step S40).
  • the composition unit 194 may correct the acquired captured image based on, for example, the ambient temperature of the imaging unit 11.
  • the composition unit 194 determines whether there are any captured images to be linked to the composite image generated in the most recent composite image generation process (step S42). If the captured image acquired in the most recent step S40 is an image captured at the third or subsequent imaging time after the imaging unit 11 began moving in the Y direction, then the composite image generated in the most recent step S44 (an image generated by linking captured images) and the composite image generated in the immediately preceding step S44 exist. The composite image generated in the immediately preceding step S44 is the image to be linked to the composite image generated in the most recent step S44. Therefore, if the captured image acquired in the most recent step S40 is an image captured at the third or subsequent imaging time after the imaging unit 11 began moving in the Y direction, the composition unit 194 determines that there are any captured images to be linked.
  • step S42 If there are no images to be combined (step S42: No), the composition unit 194 returns to step S40 and continues processing.
  • step S42 If there are images to be linked (step S42: Yes), the compositing unit 194 stitches the composite image generated in the most recent step S44 to the images to be linked (step S44). The compositing unit 194 stitches the composite images based on their positional relationships.
  • the composition unit 194 determines whether all captured images to be generated in the imaging process have been acquired (step S46). For example, the composition unit 194 determines that all captured images to be generated in the imaging process have been acquired when a predetermined number of captured images have been acquired.
  • step S46 If not all captured images have been acquired (step S46; No), the synthesis unit 194 returns to step S40 and continues processing.
  • FIG. 13 is a flowchart illustrating the calculation process of the shape of the test object A.
  • the flow shown in FIG. 13 (calculation process of the shape of the test object A) is executed by the arithmetic unit 19. More specifically, in this embodiment, the flow shown in FIG. 13 is executed by the arithmetic unit 19 reading and executing the computer program 171 (software), in other words, by the estimation unit 195, which is a logical functional block. As described above, at least a portion of the functional block may be executed by hardware. Therefore, the process of FIG.
  • the calculation process of the shape of the test object A is executed in parallel with the imaging process every time a pattern image is stored in the memory 17 in step S22 of the imaging process.
  • this is not limited thereto, and the calculation process of the shape of the test object A may be executed after the imaging process is completed.
  • the estimation unit 195 acquires multiple pattern images stored in the memory 17 in step S22 of the imaging process (step S50).
  • the estimation unit 195 may correct the acquired pattern images based on, for example, the environmental temperature of the imaging unit 11.
  • the estimation unit 195 estimates the shape of the test object A based on the calculated positional relationship and the brightness values of multiple pixels included in each of the multiple pattern captured images (step S54). For example, the estimation unit 195 estimates the three-dimensional shape of the test object A using a phase shift method. In this case, the estimation unit 195 identifies an area in each pattern image where the captured areas AR0 of all pattern images overlap based on the calculated positional relationship. The estimation unit 195 acquires the brightness values of each of the multiple pixels included in the identified area from each pattern image. The estimation unit 195 estimates the three-dimensional shape of the test object by calculating the height of the test object A at the position of each pixel based on the combination of the acquired brightness values. The relationship between the combination of brightness values and the height of the test object A may be stored in advance in the memory 17, or may be calculated according to a predetermined formula.
  • the estimation unit 195 outputs information about the calculated shape of the test object A (step S56). For example, the estimation unit 195 outputs the information by transmitting it to another device via the communication device 18. The synthesis unit 194 may output the information from the estimation unit 195 by displaying it on the display device 14. This completes the estimation process.
  • FIG. 14 is a schematic timing chart illustrating the relationship between the imaging time at which an image is generated and the three-dimensional imaging time at which a pattern image is generated.
  • the second imaging device 30 images the test object A and generates an image during period T1.
  • the generated image is stored in memory 17 during period T2.
  • a synthesis process is performed on the stored image.
  • the three-dimensional imaging time arrives, and in period T3, the first imaging device 40 images the test object multiple times and generates multiple pattern images.
  • the generated multiple pattern images are stored in memory 17 during period T4.
  • an estimation process is performed on the stored multiple pattern images. Once the multiple pattern images have been stored in memory 17, the imaging time arrives again, and in period T5, the second imaging device 30 images the test object and generates an image.
  • the first imaging device 40 captures an image of the test object A and generates a pattern image while the captured image generated by the second imaging device 30 is being stored in memory 17 or while a synthesis process is being performed on the captured image.
  • the time required to generate a captured image is shorter than the time required for the imaging unit 11 to move, so there is a period of time between imaging times when no imaging is performed.
  • the shape measurement system 1 makes it possible to efficiently estimate the three-dimensional structure of the test object.
  • the shape measurement system 1 controls the projection device 60 to emit illumination light Lb while the imaging unit 11 is moving and during times when illumination light La is not being emitted, and controls the first imaging device 40 to capture images while illumination light Lb is being emitted, thereby acquiring multiple pattern images for each region of the test object A and estimating the three-dimensional shape of the test object A based on the multiple pattern images for each region. This enables the shape measurement system 1 to estimate the three-dimensional structure of the test object in a short period of time.
  • the safety cover 150 is provided with an interlock 153 that opens and closes only when a laser is not being emitted. That is, the interlock 153 locks the safety cover 150 so that it cannot be opened (exposing the shape measurement system 1 inside) while a laser is being emitted. The interlock 153 also unlocks the safety cover 150 while a laser is not being emitted.
  • the safety cover 150 may also be provided with a transport window 152 for transporting the test object A from the outside into the safety cover 150.
  • the transport window 152 may be provided with an opening/closing mechanism that switches the opening and closing of the transport window 152, and the transport window 152 may be opened when transporting the test object A and closed after transport.
  • FIG 16 is a diagram showing an example of a shape measurement system.
  • the shape measurement system 1 may be provided with an operation device 13, a display device 14, a memory 17, a communication device 18, and a calculation device 19.
  • FIG. 17 is a schematic diagram showing the configuration of a system including a shape measurement system.
  • the manufacturing system 300 includes multiple shape measurement systems 1 (three in FIG. 17 ) and a program creation device 302.
  • the shape measurement systems 1 and the program creation device 302 are connected via a wired or wireless communication line.
  • the program creation device 302 creates various settings and programs to be created by the arithmetic device 19 of the shape measurement system 1.
  • the program creation device 302 outputs the created programs and the shape measurement system 1.
  • the shape measurement system 1 acquires area and range information and shape measurement programs from the program creation device 302 and performs processing using the acquired data and programs.
  • the manufacturing system 300 performs shape measurement using the shape measurement system 1 using the data and programs created by the program creation device 302, thereby making effective use of the created data and programs.
  • FIG. 18 is a block diagram of the manufacturing system.
  • the manufacturing system 200 of this embodiment includes the shape measurement system 1 described in the above embodiment, a design device 202, a manufacturing device 204, and a repair device 206.
  • the design device 202 creates design information regarding the shape and composition of the test object A and transmits the created design information to the manufacturing device 204.
  • the repair device 206 repairs the defective portion of the test object A based on the information indicating the defective portion and the information indicating the repair details received from the shape measurement system 1.
  • step S105 determines that the created test object A is a non-defective product (step S105; Yes). If the shape measurement system 1 determines that the created test object A is not a non-defective product (step S105; No), it determines whether the created test object A can be repaired (step S106).
  • step S106 If the manufacturing system 200 determines that the created specimen A can be repaired (Yes in step S106), the repair device 206 repairs the specimen A (step S107), and the process returns to step S103. If the manufacturing system 200 determines that the created specimen A cannot be repaired (No in step S106), the process ends and the defective product is collected. With this, the manufacturing system 200 ends the process of the flowchart shown in FIG. 19.
  • repair process performed by the repair device 206 in this embodiment may be replaced by a process in which the manufacturing device 204 re-executes the manufacturing process. In that case, if the shape measurement system 1 determines that the product can be repaired, the manufacturing device 204 re-executes the manufacturing process.
  • a shape measurement system 1 includes a projection device 60 having a first projection device 60a that projects illumination light Lb onto a first irradiation area and a second projection device 60b that projects illumination light Lb onto a second irradiation area different from the first irradiation area, a first imaging device 40 that captures images of the illumination light Lb projected onto the first irradiation area and the second irradiation area formed on the test object A, and a calculation device 19 that calculates the shape of the test object A based on the images of the first irradiation area and the second irradiation area captured by the first imaging device 40.
  • the shape of the test object A can be appropriately calculated by capturing images of the illumination light Lb projected onto different irradiation areas.
  • the optical axis AX2 of the first imaging device 40 is located between the first projection device 60a and the second projection device 60b. According to the present disclosure, the first projection device 60a and the second projection device 60b emit illumination light Lb from different directions, allowing the shape of the test object A to be calculated appropriately.
  • the shape measurement system 1 comprises a projection device 60 that projects illumination light Lb onto a first irradiation area (irradiation area ARA) and a second irradiation area (irradiation area ARB) that is located differently from the first irradiation area; a first imaging device 40 that captures images of the illumination light Lb projected onto the first irradiation area and the second irradiation area formed on the test object A; and a calculation device 19 that calculates the shape of the test object A based on the images of the first irradiation area and the second irradiation area captured by the first imaging device 40.
  • the shape of the test object A can be appropriately calculated by capturing images of the illumination light Lb projected onto different irradiation areas.
  • Projection device 60 includes a first light source device 601A, a first optical element 603A having a first opening (opening OP) formed therein that transmits a portion of the light from first light source device 601A, a second light source device 601B, a second optical element 603B having a second opening (opening OP) formed therein that transmits a portion of the light from second light source device 601B, a combining unit 605 that combines the light that has passed through the first opening and the light that has passed through the second opening, and a projection optical system 606 that projects the light combined by the combining unit 605.
  • Projection optical system 606 projects the light that has passed through the first opening (illumination light Lb1a, Lb1b) of the light combined by the combining unit onto a first illumination region, and projects the light that has passed through the second opening (illumination light Lb2a, Lb2b) of the light combined by the combining unit onto a second illumination region.
  • an image of illumination light Lb can be appropriately projected at different positions.
  • the first optical element 603A and the second optical element 603B include a diffraction grating 603a that separates the incident light into a first diffracted light and a second diffracted light.
  • the illumination light Lb can be properly separated, and the three-dimensional shape of the test object A can be properly calculated.
  • a lens is provided between first light source device 601A and first optical element 603A, which expands the light emitted from first light source device 601A toward the angle with the larger half-value angle of that light
  • a lens is provided between second light source device 601B and second optical element 603B, which expands the light emitted from second light source device 601B toward the angle with the larger half-value angle of that light.
  • by expanding the light from light source device 601 toward the angle with the larger half-value angle it is possible to appropriately set, for example, a horizontally elongated (long in the X direction) illumination area by utilizing the original light expansion angle.
  • the shape measurement system 1 is set so that the first illumination area and the second illumination area are aligned in the first direction (Y direction). According to the present disclosure, the shape of the test object A can be appropriately calculated by capturing images of the illumination light Lb projected onto different illumination areas in the Y direction.
  • the first and second irradiation areas are set apart in the first direction (Y direction). According to the present disclosure, it is possible to prevent the first and second irradiation areas from overlapping, thereby enabling the shape of the test object A to be calculated appropriately.
  • the projection device 60 projects the illumination light Lb so that the distance between the first and second illumination areas is shorter than the length of the first and second illumination areas in the first direction (Y direction). According to the present disclosure, it is possible to prevent the entire area including multiple illumination areas from becoming too long in the Y direction.
  • the lengths of the first and second irradiation areas in the second direction (X direction) are the same. According to the present disclosure, the shape of the test object A can be calculated appropriately.
  • the lengths of the first and second irradiation areas in the second direction (X direction) are the same as the length of one of the imaging areas AR0 of the first imaging device 40. According to the present disclosure, the first and second irradiation areas can be properly imaged at the same time.
  • the shape measurement system 1 further includes a second imaging device 30 that captures an image of the test object A, and the calculation device 19 calculates the shape of the test object A based on the image of the test object A captured by the second imaging device 30. According to the present disclosure, the shape of the test object A can be calculated appropriately.
  • the method for manufacturing a structure comprises a design process for creating design information regarding the shape of the structure (test object A), a molding process for manufacturing the structure based on the design information, a measurement process for measuring the shape of the manufactured structure using shape measurement system 1, and an inspection process for comparing the shape information obtained in the measurement process with the design information.
  • structures can be manufactured appropriately.
  • the manufacturing system 200 includes a design device 202 that creates design information regarding the shape of a structure (subject A), a molding device 204 that creates the structure based on the design device 202, a shape measurement system 1 that measures the shape of the created structure, and a control device (arithmetic device 19) that compares the shape information regarding the shape of the structure obtained by the shape measurement system 1 with the design information.
  • a design device 202 that creates design information regarding the shape of a structure (subject A)
  • a molding device 204 that creates the structure based on the design device 202
  • a shape measurement system 1 that measures the shape of the created structure
  • a control device (arithmetic device 19) that compares the shape information regarding the shape of the structure obtained by the shape measurement system 1 with the design information.
  • structures can be appropriately manufactured.

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Abstract

The present invention makes it possible to appropriately measure the shape of a subject. A shape measurement system (1) is provided with: a projection device (60) having a first projection device (60a) that projects illumination light onto a first irradiation region and a second projection device (60b) that projects illumination light onto a second irradiation region, which is different from the first irradiation region; a first imaging device that captures images of the illumination light projected onto the first irradiation region and the second irradiation region, the images being formed on a subject (A); and a computation device that calculates the shape of the subject (A) on the basis of the images of the first irradiation region and the second irradiation region, the images being captured by the first imaging device.

Description

形状測定システム、構造物の製造方法、構造物製造システム、及び形状測定方法Shape measurement system, structure manufacturing method, structure manufacturing system, and shape measurement method

 本発明は、形状測定システム、構造物の製造方法、構造物製造システム、及び形状測定方法に関する。 The present invention relates to a shape measurement system, a structure manufacturing method, a structure manufacturing system, and a shape measurement method.

 従来、ステージ上の被検物を撮影して被検物の測定対象箇所の寸法値を求める寸法測定装置が知られている(例えば、特許文献1参照)。 Conventionally, dimension measurement devices are known that capture an image of a test object placed on a stage and determine the dimensional values of the measurement target portion of the test object (see, for example, Patent Document 1).

米国特許公開2019/0139247号明細書US Patent Publication No. 2019/0139247

 本開示の第1の態様によれば、形状測定システムは、第1照射領域に照明光を投影する第1投影装置と、前記第1照射領域とは異なる第2照射領域に照明光を投影する第2投影装置と、を有する投影装置と、被検物に形成される、前記第1照射領域及び前記第2照射領域に投影された前記照明光の像を撮像する第1撮像装置と、前記第1撮像装置で撮像される前記第1照射領域及び前記第2照射領域の像に基づいて、前記被検物の形状を算出する演算装置と、を備える。 According to a first aspect of the present disclosure, a shape measurement system includes a projection device having a first projection device that projects illumination light onto a first illumination area and a second projection device that projects illumination light onto a second illumination area different from the first illumination area; a first imaging device that captures images of the illumination light projected onto the first illumination area and the second illumination area that are formed on the test object; and a calculation device that calculates the shape of the test object based on the images of the first illumination area and the second illumination area captured by the first imaging device.

 本開示の第2の態様によれば、形状測定システムは、第1照射領域と、前記第1照射領域とは異なる位置の第2照射領域に照明光を投影する投影装置と、被検物に形成される、前記第1照射領域及び前記第2照射領域に投影された前記照明光の像を撮像する第1撮像装置と、前記第1撮像装置で撮像される前記第1照射領域及び前記第2照射領域の像に基づいて、前記被検物の形状を算出する演算装置と、を備える。 According to a second aspect of the present disclosure, a shape measurement system includes a projection device that projects illumination light onto a first illumination area and a second illumination area that is located differently from the first illumination area, a first imaging device that captures images of the illumination light projected onto the first illumination area and the second illumination area that are formed on the test object, and a calculation device that calculates the shape of the test object based on the images of the first illumination area and the second illumination area captured by the first imaging device.

 本開示の第3の態様によれば、構造物の製造方法は、構造物の形状に関する設計情報を作成する設計工程と、前記設計情報に基づいて前記構造物を作製する成形工程と、作製された前記構造物の形状を前記形状測定システムを用いて計測する計測工程と、前記計測工程で得られた形状情報と前記設計情報とを比較する検査工程と、を有する。 According to a third aspect of the present disclosure, a method for manufacturing a structure includes a design process for creating design information regarding the shape of the structure, a molding process for manufacturing the structure based on the design information, a measurement process for measuring the shape of the manufactured structure using the shape measurement system, and an inspection process for comparing the shape information obtained in the measurement process with the design information.

 本開示の第4態様によれば、構造物製造システムは、構造物の形状に関する設計情報を作成する設計装置と、前記設計装置に基づいて前記構造物を作製する成形装置と、作製された前記構造物の形状を測定する前記形状測定システムと、前記形状測定システムによって得られた前記構造物の形状に関する形状情報と前記設計情報とを比較する制御装置と、を含む。 According to a fourth aspect of the present disclosure, a structure manufacturing system includes a design device that creates design information regarding the shape of a structure, a molding device that manufactures the structure based on the design device, a shape measurement system that measures the shape of the manufactured structure, and a control device that compares the shape information regarding the shape of the structure obtained by the shape measurement system with the design information.

 本開示の第5の態様によれば、形状測定方法は、第1投影装置で第1照射領域に照明光を投影することと、第2投影装置で前記第1照射領域とは異なる第2照射領域に照明光を投影することと、被検物に形成される、前記第1照射領域及び前記第2照射領域に投影された前記照明光の像を撮像することと、撮像される前記第1照射領域及び前記第2照射領域の像に基づいて、前記被検物の形状を算出することと、を含む。 According to a fifth aspect of the present disclosure, a shape measurement method includes projecting illumination light onto a first illumination area using a first projection device, projecting illumination light onto a second illumination area different from the first illumination area using a second projection device, capturing images of the illumination light projected onto the first illumination area and the second illumination area formed on the test object, and calculating the shape of the test object based on the captured images of the first illumination area and the second illumination area.

 本開示の第6の態様によれば、形状測定方法は、投影装置により、第1照射領域と、前記第1照射領域とは異なる位置の第2照射領域に照明光を投影することと、被検物に形成される、前記第1照射領域及び前記第2照射領域に投影された前記照明光の像を撮像することと、前記第1撮像装置で撮像される前記第1照射領域及び前記第2照射領域の像に基づいて、前記被検物の形状を算出することと、を含む。 According to a sixth aspect of the present disclosure, a shape measurement method includes projecting illumination light onto a first illumination area and a second illumination area located differently from the first illumination area using a projection device; capturing images of the illumination light projected onto the first illumination area and the second illumination area formed on the test object; and calculating the shape of the test object based on the images of the first illumination area and the second illumination area captured by the first imaging device.

本実施形態に係る形状測定システムの模式的な斜視図である。1 is a schematic perspective view of a shape measurement system according to an embodiment of the present invention. 撮像ユニットをZ方向から見た場合の模式図である。FIG. 2 is a schematic diagram of the imaging unit as viewed from the Z direction. 撮像ユニットが有する光学部材の構成を示す模式図である。FIG. 2 is a schematic diagram illustrating the configuration of optical members included in the imaging unit. Z方向から見た際の投影装置の位置を示す模式図である。FIG. 10 is a schematic diagram showing the position of the projection device when viewed from the Z direction. 投影装置の光学部材の構成を説明する模式図である。FIG. 2 is a schematic diagram illustrating the configuration of optical members of the projection device. 光学素子の模式図な斜視図である。FIG. 1 is a schematic perspective view of an optical element. 光学素子をY方向から見た際の模式図である。FIG. 2 is a schematic diagram of the optical element as viewed from the Y direction. 照射領域の一例を説明する模式図である。FIG. 4 is a schematic diagram illustrating an example of an irradiation area. 本実施形態に係る形状システムのブロック図である。FIG. 1 is a block diagram of a shape system according to an embodiment of the present invention. 本実施形態に係る演算装置の機能ブロック図である。FIG. 2 is a functional block diagram of a computing device according to the present embodiment. 形状測定システムの制御処理を説明するフローチャートである。10 is a flowchart illustrating a control process of the shape measurement system. 合成画像生成処理を説明するフローチャートである。10 is a flowchart illustrating a composite image generation process. 被検物の形状の算出処理を説明するフローチャートである。10 is a flowchart illustrating a process of calculating the shape of a test object. 撮像画像が生成される撮像時刻とパターン画像が生成される3次元撮像時刻との関係について説明するための模式的なタイミングチャートである。10 is a schematic timing chart for explaining the relationship between the imaging time at which a captured image is generated and the three-dimensional imaging time at which a pattern image is generated. 形状測定システムの一例を示す図である。FIG. 1 illustrates an example of a shape measurement system. 形状測定システムの一例を示す図である。FIG. 1 illustrates an example of a shape measurement system. 形状測定システムを有するシステムの構成を示す模式図である。FIG. 1 is a schematic diagram illustrating a configuration of a system having a shape measurement system. 製造システムのブロック構成図である。FIG. 1 is a block diagram of a manufacturing system. 製造システムによる処理の流れを示したフローチャートである。10 is a flowchart showing a processing flow by the manufacturing system.

 以下、本開示の実施形態について、図面を参照しつつ詳細に説明する。また、下記実施形態における構成要素には、当業者が容易に想定できるもの、実質的に同一のもの、いわゆる均等の範囲のものが含まれる。さらに、下記実施形態で開示した構成要素は適宜組み合わせることが可能である。 Embodiments of the present disclosure will be described in detail below with reference to the drawings. The components in the following embodiments include those that would be easily conceivable to a person skilled in the art, those that are substantially identical, and those that fall within the scope of what is known as equivalents. Furthermore, the components disclosed in the following embodiments can be combined as appropriate.

 (形状測定システム)
 図1は、本実施形態に係る形状測定システムの模式的な斜視図である。形状測定システム1は、ステージの載置面STに設置された被検物Aの少なくとも一部を含む撮像範囲を撮像して、被検物の形状を測定するシステムである。被検物Aを撮像した画像は、例えば、被検物の寸法や形状を測定するために用いられる。形状測定システム1は、撮像ユニット11、支持装置12、操作装置13、表示装置14、駆動装置15、メモリ17、通信装置18、演算装置19、及び投影装置60を有する。
(shape measurement system)
1 is a schematic perspective view of a shape measurement system according to this embodiment. The shape measurement system 1 is a system that captures an image of an imaging range that includes at least a portion of a test object A placed on a mounting surface ST of a stage, and measures the shape of the test object. The captured image of the test object A is used, for example, to measure the dimensions and shape of the test object. The shape measurement system 1 includes an imaging unit 11, a support device 12, an operation device 13, a display device 14, a drive device 15, a memory 17, a communication device 18, a calculation device 19, and a projection device 60.

 撮像ユニット11は、載置面STに設置された被検物Aを撮像する装置である。撮像ユニット11の構成の詳細は後述する。 The imaging unit 11 is a device that captures an image of the specimen A placed on the placement surface ST. The configuration of the imaging unit 11 will be described in detail below.

 載置面STは、ベース部材Bの上に配置されている。ベース部材Bは、除震機構126の上に配置されている。除震機構126には、弾性部材が含まれている。本実施形態においては、除震機構126の弾性部材は、ゴムから作成される板状部材である。 The mounting surface ST is disposed on a base member B. The base member B is disposed on a vibration isolation mechanism 126. The vibration isolation mechanism 126 includes an elastic member. In this embodiment, the elastic member of the vibration isolation mechanism 126 is a plate-shaped member made of rubber.

 支持装置12は、撮像ユニット11を移動可能に支持するための構成であり、X軸121X、Y軸121YおよびZ軸121Zを備える。各軸は、鋳鉄等の金属により形成される。X軸121Xは、Y軸121Yを支持し、Y軸121Yとともに撮像ユニット11を、載置面STに沿ったX方向に移動させる。Y軸121Yは、Z軸121Zを支持し、Z軸121Zとともに撮像ユニット11を、載置面STに沿い、かつX方向に垂直なY方向に移動させる。Z軸121Zは、撮像ユニット11を支持して、撮像ユニット11を載置面STに垂直なZ方向に移動させる。なお、以降において、なお、X方向のうちの一方に向かう方向を+X方向とし、X方向のうちの他方に向かう方向(+X方向と反対方向)を、-X方向とする。同様に、Y方向のうちの一方に向かう方向を+Y方向とし、Y方向のうちの他方に向かう方向(+Y方向と反対方向)を、-Y方向とする。X軸121Xには、Y軸121Y、Z軸121Zを移動させる電力を供給するケーブルをガイドするための、ケーブルガイド125Aが接続され、Y軸121YにはZ軸121Zを移動させる電力を供給するケーブルをガイドするための、不図示のケーブルガイド125Bが接続され、Z軸121Zには撮像ユニット11へ電力を供給するケーブルをガイドするための、ケーブルガイド125Cが配置される。 The support device 12 is configured to movably support the imaging unit 11, and includes an X-axis 121X, a Y-axis 121Y, and a Z-axis 121Z. Each axis is formed from a metal such as cast iron. The X-axis 121X supports the Y-axis 121Y and, together with the Y-axis 121Y, moves the imaging unit 11 in the X direction along the mounting surface ST. The Y-axis 121Y supports the Z-axis 121Z and, together with the Z-axis 121Z, moves the imaging unit 11 in the Y direction along the mounting surface ST and perpendicular to the X direction. The Z-axis 121Z supports the imaging unit 11 and moves the imaging unit 11 in the Z direction perpendicular to the mounting surface ST. Note that hereinafter, the direction toward one of the X directions will be referred to as the +X direction, and the direction toward the other of the X directions (the direction opposite to the +X direction) will be referred to as the -X direction. Similarly, the direction toward one side of the Y direction is the +Y direction, and the direction toward the other side of the Y direction (the opposite direction to the +Y direction) is the -Y direction. A cable guide 125A is connected to the X axis 121X to guide the cable that supplies power to move the Y axis 121Y and the Z axis 121Z, a cable guide 125B (not shown) is connected to the Y axis 121Y to guide the cable that supplies power to move the Z axis 121Z, and a cable guide 125C is arranged on the Z axis 121Z to guide the cable that supplies power to the imaging unit 11.

 また、支持装置12は、位置測定部122を有する。位置測定部122は、撮像ユニット11の基準位置からのX方向、Y方向およびZ方向への変位を測定するための構成であり、例えばリニアエンコーダを備える。位置測定部122は、X軸121X、Y軸121YおよびZ軸121Zにそれぞれ配置される。 The support device 12 also has a position measurement unit 122. The position measurement unit 122 is configured to measure displacement of the imaging unit 11 in the X, Y, and Z directions from a reference position, and includes, for example, a linear encoder. The position measurement units 122 are arranged on the X-axis 121X, Y-axis 121Y, and Z-axis 121Z, respectively.

 位置測定部122は、X軸121X、Y軸121YおよびZ軸121Zのそれぞれにおいて、その軸の表面に板バネにより保持されたスケールを測定する。なお、各軸の表面もしくはスケールに低摩擦部材を用いても構わない。例えば、各軸の表面に配置された低摩擦部材の静止摩擦係数は、各軸の静止摩擦係数よりも小さいことが好ましい。これにより、各軸が温度変化により膨張または収縮したことに伴って位置測定部122のスケールが膨張または収縮することが防止される。低摩擦部材は、例えばPTFE(polytetrafluoroethylene)等の樹脂である。低摩擦部材は、各軸をめっき処理することにより各軸の表面に配置された金属層でもよい。X軸121XおよびY軸121Yの位置測定部122の位置は、ステージSTに近い方が精度面で好ましく、Z軸121Zの位置測定部122は撮像ユニット11の光軸に近い方が精度面で好ましい。すなわちX軸121Xの位置測定部122は、ステージSTに面するX軸121Xの側面が好ましく、Y軸121Yの位置測定部122は、Y軸121Yの下面が好ましい。Z軸121Zの位置測定部122は撮像ユニット11の上部で光軸に重なる位置が好ましい。位置測定部122の位置は任意の位置であっても良く、実施においてはメンテナンス性や防汚性を考慮して位置が決定されるべきである。 The position measurement unit 122 measures the scales held by leaf springs on the surfaces of each of the X-axis 121X, Y-axis 121Y, and Z-axis 121Z. A low-friction material may be used for the surface or scale of each axis. For example, it is preferable that the static friction coefficient of the low-friction material placed on the surface of each axis be smaller than the static friction coefficient of each axis. This prevents the scale of the position measurement unit 122 from expanding or contracting due to temperature changes in each axis. The low-friction material is, for example, a resin such as PTFE (polytetrafluoroethylene). The low-friction material may also be a metal layer placed on the surface of each axis by plating the axis. In terms of accuracy, the position of the position measurement unit 122 for the X-axis 121X and Y-axis 121Y is preferably closer to the stage ST, and the position measurement unit 122 for the Z-axis 121Z is preferably closer to the optical axis of the imaging unit 11. That is, the position measurement unit 122 for the X-axis 121X is preferably on the side of the X-axis 121X facing the stage ST, and the position measurement unit 122 for the Y-axis 121Y is preferably on the bottom surface of the Y-axis 121Y. The position measurement unit 122 for the Z-axis 121Z is preferably located above the imaging unit 11, overlapping with the optical axis. The position of the position measurement unit 122 may be any position, and in practice the position should be determined taking into consideration ease of maintenance and anti-fouling properties.

 操作装置13は、形状測定システム1に対する操作を受け付けるための構成であり、例えばキーボードおよびマウス等を備える。操作装置13は、受け付けた操作に応じた信号を生成する。なお、操作装置13は、例えばタッチパネルであってもよい。 The operation device 13 is configured to accept operations for the shape measurement system 1, and includes, for example, a keyboard and a mouse. The operation device 13 generates a signal in response to the accepted operation. The operation device 13 may also be, for example, a touch panel.

 表示装置14は、画像を表示するための構成であり、例えば液晶ディスプレイ、または有機EL(Electro-Luminescence)ディスプレイ等を備える。表示装置14は、供給された画像データに応じた画像を表示する。 The display device 14 is configured to display images and includes, for example, a liquid crystal display or an organic EL (Electro-Luminescence) display. The display device 14 displays images according to the supplied image data.

 駆動装置15は、形状測定システム1を駆動させる装置である。具体的には、駆動装置15は、Y軸121Y、Z軸121Z及び撮像ユニット11をX方向に移動させ、Z軸121Z及び撮像ユニット11をY方向に移動させ、撮像ユニット11をZ方向に移動させる。また、駆動装置15は、Z軸モータ124により、後述の照明装置50を、後述の鏡筒20に対してZ方向に相対移動させる。駆動装置15は、形状測定システム1を駆動させるための電源を含む。 The driving device 15 is a device that drives the shape measurement system 1. Specifically, the driving device 15 moves the Y-axis 121Y, the Z-axis 121Z, and the imaging unit 11 in the X direction, moves the Z-axis 121Z and the imaging unit 11 in the Y direction, and moves the imaging unit 11 in the Z direction. The driving device 15 also uses the Z-axis motor 124 to move the illumination device 50 (described below) in the Z direction relative to the lens barrel 20 (described below). The driving device 15 includes a power source for driving the shape measurement system 1.

 メモリ17は、記憶部の一例であり、データおよびプログラムを記憶する装置である。メモリ17は、例えば半導体メモリを備える。メモリ17は、演算装置19による処理に用いられるオペレーティングシステムプログラム、ドライバプログラム、アプリケーションプログラム、データ等を記憶する。演算装置19により実行させるプログラムは、CD-ROM(Compact Disc Read Only Memory)、DVD-ROM(Digital Versatile Disc Read Only Memory)等のコンピュータ読み取り可能かつ非一時的な可搬型記憶媒体からメモリ17にインストールされる。 Memory 17 is an example of a storage unit, and is a device that stores data and programs. Memory 17 comprises, for example, semiconductor memory. Memory 17 stores operating system programs, driver programs, application programs, data, etc. used for processing by computing unit 19. Programs executed by computing unit 19 are installed into memory 17 from computer-readable, non-transitory, portable storage media such as CD-ROM (Compact Disc Read Only Memory) and DVD-ROM (Digital Versatile Disc Read Only Memory).

 通信装置18は、形状測定システム1を他の装置と通信可能にするための構成であり、通信インタフェース回路を備える。通信インタフェース回路は、無線LAN(Local Area Network)、有線LAN等の通信インタフェース回路である。形状測定システム1は、他の装置から送信されたデータを演算装置19に供給するとともに、演算装置19から供給されたデータを他の装置に送信する。 The communication device 18 is configured to enable the shape measurement system 1 to communicate with other devices, and includes a communication interface circuit. The communication interface circuit is a communication interface circuit for a wireless LAN (Local Area Network), a wired LAN, or the like. The shape measurement system 1 supplies data transmitted from other devices to the calculation device 19, and transmits data transmitted from the calculation device 19 to other devices.

 演算装置19は、形状測定システム1の動作を統括的に制御する装置である。演算装置19は、例えばCPU(Central Processing Unit)を備える。演算装置19は、DSP(Digital Signal Processor)、LSI(Large Scale Integration)、ASIC(Application Specific Integrated Circuit)、FPGA(Field Programmable Gate Array)等を備えてもよい。演算装置19は、メモリ17に記憶されているプログラムに基づいて各種の処理を実行する。演算装置19が実行する処理の詳細については後述する。 The arithmetic unit 19 is a device that controls the overall operation of the shape measurement system 1. The arithmetic unit 19 includes, for example, a CPU (Central Processing Unit). The arithmetic unit 19 may also include a DSP (Digital Signal Processor), an LSI (Large Scale Integration), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), etc. The arithmetic unit 19 executes various processes based on programs stored in memory 17. Details of the processes executed by the arithmetic unit 19 will be described later.

 (撮像ユニット)
 撮像ユニット11は、Y方向に移動している期間中に、撮像を実行する。すなわち、撮像ユニット11のスキャン方向は、Y方向といえる。より詳しくは、本実施形態におけるスキャン方向は、+Y方向である。ただしそれに限られず、スキャン方向を-Y方向としてもよい。なお、撮像ユニット11は、Y方向に移動しながら撮像を実行してもよいし、Y方向に所定距離移動してから停止した状態で、撮像を実行してもよい。なお、本実施形態においては、Y方向をスキャン方向としたが、X方向にスキャンしても構わない。また、スキャン方向は複数でも構わない。例えば、所定の位置までY方向にスキャンし、その後に、X方向にスキャン方向を変えても構わない。
(imaging unit)
The imaging unit 11 captures images while moving in the Y direction. That is, the scanning direction of the imaging unit 11 can be said to be the Y direction. More specifically, the scanning direction in this embodiment is the +Y direction. However, this is not limited to this, and the scanning direction may be the -Y direction. The imaging unit 11 may capture images while moving in the Y direction, or may capture images after moving a predetermined distance in the Y direction and then stopping. Although the scanning direction is the Y direction in this embodiment, scanning in the X direction may also be used. Furthermore, multiple scanning directions may be used. For example, scanning in the Y direction up to a predetermined position and then changing the scanning direction to the X direction may also be used.

 図2は、撮像ユニットをZ方向から見た場合の模式図である。図2に示すように、撮像ユニット11は、鏡筒20と、第2撮像装置30と、第1撮像装置40と、照明装置50と、投影装置60と、落射照明装置70と、基部123と、を有する。 FIG. 2 is a schematic diagram of the imaging unit when viewed from the Z direction. As shown in FIG. 2, the imaging unit 11 has a lens barrel 20, a second imaging device 30, a first imaging device 40, an illumination device 50, a projection device 60, an epi-illumination device 70, and a base 123.

 鏡筒20は、第2撮像装置30などの各種部材を収納するケーシングである。鏡筒20の形状は任意であってよいが、本実施形態では、Z方向が長手方向となる筒状の部材である。 The lens barrel 20 is a casing that houses various components such as the second imaging device 30. The lens barrel 20 may have any shape, but in this embodiment, it is a cylindrical component with its longitudinal direction in the Z direction.

 第2撮像装置30は、被検物Aを撮像する装置である。第2撮像装置30は、照明装置50及び落射照明装置70の少なくとも一方によって被検物A上に投影された照明光La(後述)の像を、被検物Aの二次元形状として撮像する。第2撮像装置30は、鏡筒20内に収納される。第2撮像装置30は、光軸AX1がZ方向に沿うように、鏡筒20内に収納される。 The second imaging device 30 is a device that images the test object A. The second imaging device 30 images the image of illumination light La (described below) projected onto the test object A by at least one of the illumination device 50 and the epi-illumination device 70 as the two-dimensional shape of the test object A. The second imaging device 30 is housed within the lens barrel 20. The second imaging device 30 is housed within the lens barrel 20 so that the optical axis AX1 is aligned with the Z direction.

 第1撮像装置40は、投影装置60によって被検物A上に投影された照明光Lb(後述)の像を撮像する装置である。第1撮像装置40は、鏡筒20(鏡筒20内に配置された第2撮像装置30の光軸AX1)に対して、Z方向に直交する方向側に配置される。本実施形態では、第1撮像装置40は、鏡筒20(光軸AX1)の-Y方向側に配置される。ただし、第1撮像装置40が設けられる位置は、言い換えれば、第1撮像装置40の鏡筒20(光軸AX1)に対する相対位置は、これに限られず任意であってよい。 The first imaging device 40 is a device that captures an image of the illumination light Lb (described below) projected onto the test object A by the projection device 60. The first imaging device 40 is arranged on the side in a direction perpendicular to the Z direction with respect to the lens barrel 20 (the optical axis AX1 of the second imaging device 30 arranged within the lens barrel 20). In this embodiment, the first imaging device 40 is arranged on the -Y direction side of the lens barrel 20 (optical axis AX1). However, the position at which the first imaging device 40 is provided, in other words, the relative position of the first imaging device 40 with respect to the lens barrel 20 (optical axis AX1), is not limited to this and may be arbitrary.

 投影装置60は、設置領域ST上の第1照射領域と、設置領域ST上の第1照射領域とは異なる位置の第2照射領域に照明光Lbを投影する装置である。すなわち、投影装置60は、同じ期間中に、互いに異なる位置にある複数の領域(照射領域)に、照明光Lbを投影する。詳しくは後述するが、本実施形態においては、投影装置60は、照明光Lbとして、明暗パターンを有する照明光(構造化照明光)を投影する。第1撮像装置40は、投影装置60によって被検物A上の異なる位置(照射領域)に投影された、明暗パターンを有する照明光Lbの像を撮像する。 The projection device 60 is a device that projects illumination light Lb onto a first irradiation area on the installation area ST and a second irradiation area that is located at a different position from the first irradiation area on the installation area ST. In other words, the projection device 60 projects illumination light Lb onto multiple areas (irradiation areas) that are located at different positions during the same period. As will be described in more detail below, in this embodiment, the projection device 60 projects illumination light having a light and dark pattern (structured illumination light) as the illumination light Lb. The first imaging device 40 captures an image of the illumination light Lb having a light and dark pattern projected by the projection device 60 onto different positions (irradiation areas) on the test object A.

 投影装置60は、鏡筒20(光軸AX1)に対して、Z方向に直交する方向側に配置される。本実施形態では、投影装置60は、鏡筒20(光軸AX1)のX方向側に、言い換えればスキャン方向であるY方向に直交する方向側に、配置される。より詳しくは、本実施形態では、投影装置60として、第1投影装置60a及び第2投影装置60bが設けられる。第1投影装置60aは、鏡筒20(光軸AX1)の-X方向側に配置され、第2投影装置60bは、鏡筒20(光軸AX1)の+X方向側に配置される。さらに言えば、本実施形態では、投影装置60(本実施形態では第1投影装置60a及び第2投影装置60b)は、照明装置50の外側(光軸AX1を軸方向とした場合の径方向外側)に位置している。投影装置60(第1投影装置60a及び第2投影装置60b)の設置位置はこれに限られず任意であってよいが、第1投影装置60a及び第2投影装置60bは、第2撮像装置30の光軸AX1が、第1投影装置60a及び第2投影装置60bの間に位置するように、設けられることが好ましい。また、第1投影装置60a及び第2投影装置60bは、後述する第1撮像装置40の光軸AX2が、第1投影装置60a及び第2投影装置60bの間に位置するように、設けられることが好ましい。なお、投影装置60は、2つの投影装置を有する構成に限られず、1つの投影装置(第1投影装置60a及び第2投影装置60bのいずれか一方)のみを有する構成であってもよいし、3つ以上の投影装置を有する構成であってもよい。 The projection device 60 is arranged on the side perpendicular to the Z direction relative to the lens barrel 20 (optical axis AX1). In this embodiment, the projection device 60 is arranged on the X direction side of the lens barrel 20 (optical axis AX1), in other words, on the side perpendicular to the Y direction, which is the scanning direction. More specifically, in this embodiment, a first projection device 60a and a second projection device 60b are provided as the projection device 60. The first projection device 60a is arranged on the -X direction side of the lens barrel 20 (optical axis AX1), and the second projection device 60b is arranged on the +X direction side of the lens barrel 20 (optical axis AX1). Furthermore, in this embodiment, the projection devices 60 (in this embodiment, the first projection device 60a and the second projection device 60b) are located outside the illumination device 50 (radially outside when the optical axis AX1 is the axial direction). The installation positions of the projection devices 60 (first projection device 60a and second projection device 60b) are not limited to this and may be arbitrary. However, it is preferable that the first projection device 60a and the second projection device 60b be installed so that the optical axis AX1 of the second image capture device 30 is located between the first projection device 60a and the second projection device 60b. It is also preferable that the first projection device 60a and the second projection device 60b be installed so that the optical axis AX2 of the first image capture device 40 (described below) is located between the first projection device 60a and the second projection device 60b. Note that the projection device 60 is not limited to a configuration having two projection devices, and may be a configuration having only one projection device (either the first projection device 60a or the second projection device 60b), or a configuration having three or more projection devices.

 落射照明装置70は、設置領域ST上に照明光Laを照射する装置である。落射照明装置70は、第2撮像装置30の光軸AX1に沿った方向に、照明光Laを照射する。落射照明装置70は、鏡筒20(光軸AX1)に対して、Z方向に直交する方向側に配置される。本実施形態では、落射照明装置70は、Z方向から見て、鏡筒20(第2撮像装置30の光軸AX1)に対して、+X方向と+Y方向との間の方向(第1斜め方向)に配置される。言い換えれば、Z方向から見て、鏡筒20の中心(光軸AX1)から+X方向に沿う方向を0°とし、鏡筒20の中心(光軸AX1)から+Y方向に沿う方向を90°とすると、落射照明装置70は、鏡筒20(光軸AX1)に対して、0°より高く90°未満の第1斜め方向側に配置される。例えば、落射照明装置70は、鏡筒20(光軸AX1)に対して、45°の第1斜め方向側に配置されてよい。ただし、落射照明装置70が設けられる位置は、言い換えれば、落射照明装置70の鏡筒20(光軸AX1)に対する相対位置は、これに限られず任意であってよい。また、落射照明装置70は必須ではなく、設けられなくてもよい。 The incident-light illumination device 70 is a device that irradiates illumination light La onto the installation area ST. The incident-light illumination device 70 irradiates illumination light La in a direction along the optical axis AX1 of the second image capture device 30. The incident-light illumination device 70 is arranged on the side of the lens barrel 20 (optical axis AX1) in a direction perpendicular to the Z direction. In this embodiment, the incident-light illumination device 70 is arranged in a direction between the +X direction and the +Y direction (first diagonal direction) with respect to the lens barrel 20 (optical axis AX1 of the second image capture device 30) when viewed from the Z direction. In other words, when viewed from the Z direction, if the direction along the +X direction from the center (optical axis AX1) of the lens barrel 20 along the +Y direction from the center (optical axis AX1) of the lens barrel 20 is defined as 0°, and the direction along the +Y direction from the center (optical axis AX1) of the lens barrel 20 is defined as 90°, the incident-light illumination device 70 is arranged on the first diagonal direction side that is higher than 0° and less than 90° with respect to the lens barrel 20 (optical axis AX1). For example, the epi-illumination device 70 may be disposed on the first diagonal direction side at an angle of 45° with respect to the lens barrel 20 (optical axis AX1). However, the position at which the epi-illumination device 70 is provided, in other words, the relative position of the epi-illumination device 70 with respect to the lens barrel 20 (optical axis AX1), is not limited to this and may be arbitrary. Furthermore, the epi-illumination device 70 is not essential and does not have to be provided.

 照明装置50は、設置領域ST上に照明光Laを照射する装置である。照明装置50は、第2撮像装置30の光軸AX1と交差する方向に、照明光Laを照射する。照明装置50は、鏡筒20のZ方向側の端部の外周面の周囲に設けられる、環状の照明装置である。照明装置50からの照明光Laにより、第2撮像装置30の撮像範囲を照射する。照明装置50は、径方向の内側に向けて照明光Laを照射する。照明装置50の径方向の内側に向けて照射する照明装置50の光源部は、Z方向に複数配置され、光源部が配置される位置はZ方向の位置により異なる。Z方向において、被検物Aから遠ざかるに従い、光源部と光軸AX1の距離は、短くなり、それぞれの光源部から被検物Aに対して斜めに照明光Laが照射される。なお、照明装置50は必須ではなく、設けられなくてもよい。照明装置50の詳細な配置位置については後述する。 The illumination device 50 is a device that irradiates illumination light La onto the installation area ST. The illumination device 50 irradiates illumination light La in a direction intersecting the optical axis AX1 of the second imaging device 30. The illumination device 50 is an annular illumination device that is provided around the outer peripheral surface of the end of the lens barrel 20 on the Z direction side. The illumination light La from the illumination device 50 illuminates the imaging range of the second imaging device 30. The illumination device 50 irradiates illumination light La radially inward. Multiple light source units of the illumination device 50 that irradiate radially inward of the illumination device 50 are arranged in the Z direction, and the positions at which the light source units are arranged vary depending on the position in the Z direction. In the Z direction, the distance between the light source unit and the optical axis AX1 becomes shorter as one moves away from the test object A, and illumination light La is irradiated obliquely from each light source unit onto the test object A. Note that the illumination device 50 is not required and need not be provided. The detailed arrangement position of the illumination device 50 will be described later.

 (基部)
 基部123は121Yに対してZ軸121ZをY方向に移動可能に取り付ける部材である。基部120Aは撮像ユニット11をZ軸121Zに取り付ける部材である。基部120Aは、撮像ユニット11(本実施形態では鏡筒20)に対する相対位置が固定されるように、撮像ユニット11に取り付けられ、Z軸121Zに対するZ方向における相対位置が変化可能に、Z軸121Zに取り付けられる。本実施形態では、基部120Aは、撮像ユニット11のうちの鏡筒20に取り付けられる。基部120Aは、撮像ユニット11のうちの鏡筒20以外の部材に取り付けられてもよい。
(base)
The base 123 is a member that mounts the Z-axis 121Z to the imaging unit 11 so that it can move in the Y direction relative to the base 123Y. The base 120A is a member that mounts the imaging unit 11 to the Z-axis 121Z. The base 120A is mounted to the imaging unit 11 so that its relative position with respect to the imaging unit 11 (the lens barrel 20 in this embodiment) is fixed, and is mounted to the Z-axis 121Z so that its relative position in the Z direction with respect to the Z-axis 121Z is changeable. In this embodiment, the base 120A is mounted to the lens barrel 20 of the imaging unit 11. The base 120A may also be mounted to a member of the imaging unit 11 other than the lens barrel 20.

 なお、基部120Aは、Z軸121Zに対するY方向における相対位置が固定されるように、Z軸121Zに取り付けられ、基部120Aが取り付けられるZ軸121Zは、基部123によりY方向に移動可能にY軸121Yに取り付けられる。従って、基部120Aは、Y軸121Y(第1軸部材)に対してY方向に移動可能に、撮像ユニット11をY軸121Yに取り付けているといえる。すなわち、基部120Aは、Y軸121Yに対するY方向における相対位置が変化可能に、Y軸121Yに取り付けられる。同様に、Y軸121Yは、X方向に移動可能にX軸121Xに取り付けられる。従って、基部120Aは、X軸121Xに対してX方向に移動可能に、撮像ユニット11をX軸121Xに取り付けているといえる。すなわち、基部120Aは、X軸121Xに対するX方向における相対位置が変化可能に、X軸121Xに取り付けられる。 Note that base 120A is attached to Z-axis 121Z so that its position in the Y direction relative to Z-axis 121Z is fixed, and Z-axis 121Z to which base 120A is attached is attached to Y-axis 121Y by base 123 so that it can move in the Y direction. Therefore, it can be said that base 120A attaches imaging unit 11 to Y-axis 121Y so that it can move in the Y direction relative to Y-axis 121Y (first axis member). In other words, base 120A is attached to Y-axis 121Y so that its position in the Y direction relative to Y-axis 121Y can change. Similarly, Y-axis 121Y is attached to X-axis 121X so that it can move in the X direction. Therefore, it can be said that base 120A attaches imaging unit 11 to X-axis 121X so that it can move in the X direction relative to X-axis 121X. In other words, the base 120A is attached to the X-axis 121X so that its position in the X direction relative to the X-axis 121X can be changed.

 基部120Aは、鏡筒20(光軸AX1)に対して、Z方向に交差(本例では直交)する方向側に配置される。基部120Aは、周方向(Z方向(光軸AX1に沿った方向)を軸方向とした場合の周方向)において、第1撮像装置40と投影装置60(第1投影装置60a)との間に配置される。すなわち本実施形態では、基部120Aは、Z方向から見て、鏡筒20(光軸AX1)に対して、-X方向(第1方向)と-Y方向(第2方向)との間の第3方向に配置される。言い換えれば、Z方向から見て、鏡筒20の中心(光軸AX1)から-X方向に沿う方向を0°とし、鏡筒20の中心(光軸AX1)から-Y方向に沿う方向を90°とすると、基部120Aは、鏡筒20(光軸AX1)に対して、0°より高く90°未満の第3方向側に配置される。例えば、基部120Aは、鏡筒20(光軸AX1)に対して、45°の第3方向側に配置されてよい。言い換えれば、鏡筒20の中心(光軸AX1)を通り-X方向に沿う方向と、鏡筒20の中心(光軸AX1)を通り、第3方向に沿う方向とのなす角度を、第3方向の傾斜角度とする。この場合、第3方向は、-X方向に対して-Y方向側に傾斜しており、第3方向の傾斜角度は、0°より高く90°未満であり、45°が好ましいといえる。 The base 120A is positioned on the side of the lens barrel 20 (optical axis AX1) that intersects with the Z direction (orthogonal in this example). The base 120A is positioned between the first image capture device 40 and the projection device 60 (first projection device 60a) in the circumferential direction (the circumferential direction when the Z direction (direction along the optical axis AX1) is the axial direction). That is, in this embodiment, the base 120A is positioned in a third direction between the -X direction (first direction) and the -Y direction (second direction) with respect to the lens barrel 20 (optical axis AX1) when viewed from the Z direction. In other words, when viewed from the Z direction, if the direction along the -X direction from the center (optical axis AX1) of the lens barrel 20 is defined as 0° and the direction along the -Y direction from the center (optical axis AX1) of the lens barrel 20 is defined as 90°, the base 120A is positioned on the third direction side that is higher than 0° but less than 90° with respect to the lens barrel 20 (optical axis AX1). For example, base 120A may be positioned 45° toward the third direction relative to lens barrel 20 (optical axis AX1). In other words, the angle between the direction passing through the center of lens barrel 20 (optical axis AX1) and along the -X direction and the direction passing through the center of lens barrel 20 (optical axis AX1) and along the third direction is the tilt angle of the third direction. In this case, the third direction is tilted toward the -Y direction relative to the -X direction, and the tilt angle of the third direction is greater than 0° and less than 90°, with 45° being preferable.

 また、基部120Aは、+X方向側の端部が鏡筒20に取り付けられ、+X方向の端部から-X方向の端部に向けて第3方向に延在し、-X方向側の端部がZ軸121Zに取り付けられる形状となっている。 Furthermore, the base 120A has a shape in which its end on the +X direction is attached to the lens barrel 20, extends in the third direction from the end on the +X direction to the end on the -X direction, and has its end on the -X direction attached to the Z axis 121Z.

 基部123、121Z、120Aは、-X方向と-Y方向との間の第3方向に配置される。これにより、鏡筒20(光軸AX1)を、Y軸121Yに近い側に配置することができる。また、撮像時に鏡筒20を適切に-Y方向に移動させることができる。ただし、基部123、121Z、120Aが設けられる位置は、言い換えれば、基部123、121Z、120Aの鏡筒20(光軸AX1)に対する相対位置は、これに限られず任意であってよい。 The bases 123, 121Z, and 120A are arranged in a third direction between the -X and -Y directions. This allows the lens barrel 20 (optical axis AX1) to be positioned closer to the Y axis 121Y. Furthermore, the lens barrel 20 can be moved appropriately in the -Y direction during imaging. However, the positions at which the bases 123, 121Z, and 120A are provided, in other words, the relative positions of the bases 123, 121Z, and 120A to the lens barrel 20 (optical axis AX1), are not limited to this and may be arbitrary.

 (光学部材の構成)
 次に、撮像ユニット11が有する光学部材の構成について説明する。図3は、撮像ユニットが有する光学部材の構成を示す模式図である。
(Configuration of optical members)
Next, a description will be given of the configuration of the optical members included in the imaging unit 11. Fig. 3 is a schematic diagram showing the configuration of the optical members included in the imaging unit.

 (照明装置)
 図3に示すように、本実施形態においては、鏡筒20のZ方向側の端部20Aの外周面の周囲に、照明装置50が設けられる。照明装置50は、設置領域STに向けて照明光Laを照射する装置である。照明光Laは、例えば400nm以上700nm以下の波長帯の光である。照明光Laは、例えば、435nm以上700nm以下の波長帯の光でも構わない。照明装置50は、取付部51を介して端部20Aの外周面の周囲に取り付けられている。照明装置50は、基部50Aと、光源部50Bとを有する。基部50Aは、取付部51を介して端部20Aの外周面の周囲に取り付けられる、環状の部材である。基部50Aの内周面は、内周面50A1と内周面50A2とを含む。内周面50A1は、基部50Aの内周面の全体のうちの、Z方向と反対側に位置する面である。内周面50A1は、例えば、径が一定の面である。内周面50A2は、基部50Aの内周面の全体のうちで、内周面50A1に接続されて、内周面50A1のZ方向側に位置する面である。内周面50A2は、Z方向に向かうに従って、径が大きくなる形状となっている。言い換えれば、内周面50A2は、Z方向に向かうに従って、径方向外側に傾斜している。光源部50Bは、この内周面50A2に設けられる。本実施形態では、光源部50Bは、照明光Laを照射する構成であり、例えば、LED(Light Emitting Diode)等の光源および制御回路を備える。制御回路は、PWM(Pulse Width Modulation)制御等により異なる明るさの光を光源に照射させる。なお、本実施形態では、光源部50Bは、内周面50A2の全域に亘って複数設けられることが好ましい。また、照明装置50の基部50Aには、照明装置50よりも外側に配置される投影装置60の照明光Lbが通過可能な、スリットが形成されていてもよい。
(Lighting equipment)
As shown in FIG. 3 , in this embodiment, an illumination device 50 is provided around the outer circumferential surface of the end portion 20A of the lens barrel 20 on the Z-direction side. The illumination device 50 is a device that irradiates illumination light La toward the installation area ST. The illumination light La is, for example, light in a wavelength band of 400 nm to 700 nm. The illumination light La may be, for example, light in a wavelength band of 435 nm to 700 nm. The illumination device 50 is attached to the outer circumferential surface of the end portion 20A via an attachment portion 51. The illumination device 50 includes a base portion 50A and a light source portion 50B. The base portion 50A is an annular member attached to the outer circumferential surface of the end portion 20A via the attachment portion 51. The inner circumferential surface of the base portion 50A includes an inner circumferential surface 50A1 and an inner circumferential surface 50A2. The inner circumferential surface 50A1 is the surface of the entire inner circumferential surface of the base portion 50A that is located on the opposite side of the Z-direction. The inner circumferential surface 50A1 is, for example, a surface with a constant diameter. The inner circumferential surface 50A2 is connected to the inner circumferential surface 50A1 and is located on the Z-direction side of the inner circumferential surface 50A1 within the entire inner circumferential surface of the base 50A. The inner circumferential surface 50A2 has a shape in which the diameter increases in the Z-direction. In other words, the inner circumferential surface 50A2 is inclined radially outward in the Z-direction. The light source unit 50B is provided on this inner circumferential surface 50A2. In this embodiment, the light source unit 50B is configured to emit illumination light La and includes a light source such as an LED (Light Emitting Diode) and a control circuit. The control circuit controls the light source to emit light of different brightness levels using PWM (Pulse Width Modulation) control or the like. In this embodiment, it is preferable that a plurality of light source units 50B be provided throughout the entire inner circumferential surface 50A2. Furthermore, a slit may be formed in the base 50A of the lighting device 50, through which the illumination light Lb from the projection device 60 disposed outside the lighting device 50 can pass.

 (投影装置)
 投影装置60(本実施形態では第1投影装置60a及び第2投影装置60b)は、設置領域STに照明光Lbを投影(照射)する装置である。照明光Lbは、照明光La(後述する照明光La1及び照明光La2)と異なる波長帯の光であり、例えば500nm以上650nm以下の波長帯の光である。ただしそれに限られず、照明光Lbは、照明光Laと同じ波長帯の光でもよい。本実施形態においては、第1投影装置60aは、鏡筒20(光軸AX1)の-X方向側に配置され、第2投影装置60bは、鏡筒20(光軸AX1)の+X方向側に配置されている。第1投影装置60a及び第2投影装置60bの詳細な構成については後述する。
(projection device)
The projection devices 60 (first projection device 60a and second projection device 60b in this embodiment) are devices that project (irradiate) illumination light Lb onto the installation area ST. The illumination light Lb is light in a wavelength band different from that of the illumination light La (illumination light La1 and illumination light La2 described below), for example, light in a wavelength band of 500 nm or more and 650 nm or less. However, the illumination light Lb is not limited to this, and may be light in the same wavelength band as the illumination light La. In this embodiment, the first projection device 60a is disposed on the −X direction side of the lens barrel 20 (optical axis AX1), and the second projection device 60b is disposed on the +X direction side of the lens barrel 20 (optical axis AX1). The detailed configurations of the first projection device 60a and the second projection device 60b will be described later.

 (鏡筒内の光学部材)
 図3に示すように、本実施形態においては、鏡筒20内に、第2撮像装置30、第1撮像装置40、落射照明装置70、偏光子201、光分岐器202、集光光学系203、1/4波長板204、結像光学系205、偏光子206、及び光分岐器207が設けられる。鏡筒20内においてこれらの部材が配置される位置は任意であるが、以下に本実施形態における配置例を説明する。
(Optical components inside the lens barrel)
3, in this embodiment, a second image capturing device 30, a first image capturing device 40, an epi-illumination device 70, a polarizer 201, an optical splitter 202, a focusing optical system 203, a quarter-wave plate 204, an imaging optical system 205, a polarizer 206, and an optical splitter 207 are provided inside the lens barrel 20. These components may be arranged at any position inside the lens barrel 20, but an example of arrangement in this embodiment will be described below.

 (第2撮像装置)
 第2撮像装置30は、被検物Aに投影された照明光Laの像を、被検物Aとして撮像する装置である。本実施形態では、第2撮像装置30は、撮像素子であり、受光面に結像した像に基づいて、画像を生成する。第2撮像装置30は、例えばCMOS(Complementary Metal Oxide Semiconductor)またはCCD(Charge Coupled Device)型のイメージセンサであってよい。
(Second imaging device)
The second imaging device 30 is a device that captures an image of the illumination light La projected onto the test object A as the test object A. In this embodiment, the second imaging device 30 is an imaging element that generates an image based on an image formed on a light receiving surface. The second imaging device 30 may be, for example, a CMOS (Complementary Metal Oxide Semiconductor) or CCD (Charge Coupled Device) type image sensor.

 本実施形態では、第2撮像装置30は、光軸AX1がZ方向に沿うように、鏡筒20内に配置される。例えば、第2撮像装置30は、受光面がZ方向に垂直となるように、鏡筒20内に配置される。 In this embodiment, the second imaging device 30 is disposed within the lens barrel 20 so that the optical axis AX1 is aligned with the Z direction. For example, the second imaging device 30 is disposed within the lens barrel 20 so that the light receiving surface is perpendicular to the Z direction.

 (第1撮像装置)
 第1撮像装置40は、被検物Aに投影された照明光Lbの像を撮像する装置である。本実施形態では、第1撮像装置40は、撮像素子であり、受光面に結像した像に基づいて、画像を生成する。第1撮像装置40は、例えばCMOSまたはCCD型のイメージセンサであってよい。
(First imaging device)
The first imaging device 40 is a device that captures an image of the illumination light Lb projected onto the test object A. In this embodiment, the first imaging device 40 is an imaging element that generates an image based on an image formed on a light receiving surface. The first imaging device 40 may be, for example, a CMOS or CCD type image sensor.

 本実施形態では、第1撮像装置40は、受光面が径方向内側(光軸AX1に沿った方向を軸方向とした場合の径方向外側)を向くように、配置される。すなわち、第1撮像装置40は、照明光Laを受光する位置(第1撮像装置40と光分岐器207との間の区間)における光軸AX2が径方向内側に沿うように、配置される。なお、図3では、説明の便宜上、第1撮像装置40は、光軸AX1に対して+X方向側に位置しているが、本実施形態では上述で説明した通り、-Y方向側に配置されることが好ましい。そして、図3では、第1撮像装置40の受光面は、説明の便宜上、+X方向に垂直となるように配置されているが、-Y方向に垂直となるように配置されることが好ましい。すなわち、照明光Laを受光する位置(第1撮像装置40と光分岐器207との間の区間)における光軸AX2は、-Y方向に沿うことが好ましい。また、本実施形態では、第1撮像装置40は、Z方向において、第2撮像装置30と載置面STとの間に配置される。 In this embodiment, the first image capture device 40 is positioned so that its light receiving surface faces radially inward (radially outward when the direction along the optical axis AX1 is the axial direction). That is, the first image capture device 40 is positioned so that the optical axis AX2 at the position where the illumination light La is received (the section between the first image capture device 40 and the optical splitter 207) is aligned radially inward. Note that in Figure 3, for convenience of explanation, the first image capture device 40 is positioned on the +X side of the optical axis AX1, but as explained above, in this embodiment, it is preferable to position it on the -Y side. Also, in Figure 3, for convenience of explanation, the light receiving surface of the first image capture device 40 is positioned so that it is perpendicular to the +X direction, but it is preferable to position it so that it is perpendicular to the -Y direction. That is, it is preferable that the optical axis AX2 at the position where the illumination light La is received (the section between the first image capture device 40 and the optical splitter 207) is aligned along the -Y direction. In addition, in this embodiment, the first imaging device 40 is disposed between the second imaging device 30 and the placement surface ST in the Z direction.

 (落射照明装置)
 落射照明装置70は、設置領域STに向けて照明光Laを照射する装置である。本実施形態では、落射照明装置70は、照明光Laを照射する構成であり、例えば、LED(Light Emitting Diode)等の光源および制御回路を備える。制御回路は、PWM(Pulse Width Modulation)制御等により異なる明るさの光を光源に照射させる。
(Epi-illumination device)
The epi-illumination device 70 is a device that irradiates illumination light La toward the installation area ST. In this embodiment, the epi-illumination device 70 is configured to irradiate illumination light La and includes a light source such as an LED (Light Emitting Diode) and a control circuit. The control circuit controls the light source to irradiate light of different brightness levels using PWM (Pulse Width Modulation) control or the like.

 本実施形態では、落射照明装置70は、照明装置50と同じ波長帯の照明光Laを照射する。以降において、落射照明装置70が照射する照明光Laと照明装置50が照射する照明光Laとを区別する場合には、落射照明装置70が照射する照明光Laを照明光La1、照明装置50が照射する照明光Laを照明光La2と記載する。なお、照明光La1と照明光La2とは、波長帯が異なっていてもよい。 In this embodiment, the epi-illumination device 70 emits illumination light La in the same wavelength band as the illumination device 50. Hereinafter, when distinguishing between the illumination light La emitted by the epi-illumination device 70 and the illumination light La emitted by the illumination device 50, the illumination light La emitted by the epi-illumination device 70 will be referred to as illumination light La1, and the illumination light La emitted by the illumination device 50 will be referred to as illumination light La2. Note that illumination light La1 and illumination light La2 may have different wavelength bands.

 本実施形態では、落射照明装置70は、照明光La1が出射された位置(落射照明装置70と光分岐器202との間の区間)における光軸AX3が径方向内側(第2撮像装置30の光軸AX1に沿った方向を軸方向とした場合の径方向内側)に沿うように、配置される。なお、図3では、説明の便宜上、落射照明装置70は、第2撮像装置30の光軸AX1に対して+X方向側に位置しているが、本実施形態では上述で説明した通り、光軸AX1に対して第1斜め方向側に配置され、照明光La1が出射された位置(落射照明装置70と光分岐器202との間の区間)における光軸AX3が、第1斜め方向側に沿うことが好ましい。また、本実施形態では、落射照明装置70は、Z方向において、第2撮像装置30と載置面STとの間に配置される。さらに言えば、本実施形態では、落射照明装置70は、Z方向において、第1撮像装置40と載置面STとの間に配置される。 In this embodiment, the epi-illumination device 70 is positioned so that the optical axis AX3 at the position where the illumination light La1 is emitted (the section between the epi-illumination device 70 and the optical splitter 202) is aligned radially inward (the radially inward when the direction along the optical axis AX1 of the second image capture device 30 is taken as the axial direction). Note that in Figure 3, for the sake of convenience, the epi-illumination device 70 is positioned on the +X side of the optical axis AX1 of the second image capture device 30; however, as explained above, in this embodiment, it is preferably positioned on the first diagonal side of the optical axis AX1, so that the optical axis AX3 at the position where the illumination light La1 is emitted (the section between the epi-illumination device 70 and the optical splitter 202) is aligned along the first diagonal side. Furthermore, in this embodiment, the epi-illumination device 70 is positioned between the second image capture device 30 and the mounting surface ST in the Z direction. Furthermore, in this embodiment, the epi-illumination device 70 is disposed between the first imaging device 40 and the placement surface ST in the Z direction.

 (偏光子)
 偏光子201は、落射照明装置70と光分岐器202の間に配置され、所定の方向に沿った透過軸を有し、落射照明装置70から出射した照明光La1を透過軸の方向に沿った偏光面を有する直線偏光に変換して透過させる。
(Polarizer)
The polarizer 201 is disposed between the incident illumination device 70 and the optical splitter 202, has a transmission axis along a predetermined direction, and converts the illumination light La1 emitted from the incident illumination device 70 into linearly polarized light having a polarization plane along the direction of the transmission axis and transmits it.

 (光分岐器)
 光分岐器202は、集光光学系203の第1レンズ群203aと、結像光学系205の第2レンズ群205aとの間に配置される。また、光分岐器202は、第1レンズ群203aの光軸(本例ではZ方向)に対して直交する方向において、偏光子201を介して落射照明装置70と対向するように配置される。光分岐器202は、偏光子201を透過した照明光La1を第1レンズ群203aに反射させる。また、光分岐器202は、載置面STに載置された被検物Aで反射されて第1レンズ群203aを透過した光(すなわち被検物Aに照射された照明光La及び照明光Lbの反射光)を、第2レンズ群205aに透過させる。光分岐器202は、ハーフミラー等の偏光ビームスプリッタ(PBS)である。
(Optical splitter)
The optical splitter 202 is disposed between the first lens group 203a of the focusing optical system 203 and the second lens group 205a of the imaging optical system 205. The optical splitter 202 is disposed so as to face the epi-illumination device 70 via the polarizer 201 in a direction perpendicular to the optical axis of the first lens group 203a (the Z direction in this example). The optical splitter 202 reflects the illumination light La1 transmitted through the polarizer 201 to the first lens group 203a. The optical splitter 202 also transmits light reflected by the test object A placed on the mounting surface ST and transmitted through the first lens group 203a (i.e., the reflected light of the illumination light La and illumination light Lb irradiated on the test object A) to the second lens group 205a. The optical splitter 202 is a polarizing beam splitter (PBS) such as a half mirror.

 (集光光学系)
 集光光学系203は、落射照明装置70から発して光分岐器202により載置面ST(Z方向)へ向けられた照明光La1を載置面STに載置された被検物Aに照射する。また、集光光学系203は、被検物Aで反射された光(すなわち被検物Aに照射された照明光La及び照明光Lbの反射光)を集光する。集光光学系203は、第1レンズ群203aおよび第1絞り203bを有する。第1レンズ群203aは、Z方向において、落射照明装置70と載置面STとの間に配置され、より詳しくは光分岐器202と載置面STとの間に配置される。第1レンズ群203aは、光軸がZ方向(第2撮像装置30の光軸AX1)に沿うように配置される。第1レンズ群203aは、落射照明装置70から照射されて第1レンズ群203aを通って載置面STへ向かう照明光Laの主光線が光軸と平行となるテレセントリック光学系を構成する。第1絞り203bは、落射照明装置70と光分岐器202との間に配置され、集光光学系203の開口数を調節するための構成である。
(Light-collecting optical system)
The light collecting optical system 203 irradiates the test object A placed on the mounting surface ST with illumination light La1 emitted from the epi-illumination device 70 and directed toward the mounting surface ST (Z direction) by the light splitter 202. The light collecting optical system 203 also collects light reflected by the test object A (i.e., the reflected light of the illumination light La and illumination light Lb irradiated on the test object A). The light collecting optical system 203 has a first lens group 203a and a first diaphragm 203b. The first lens group 203a is disposed between the epi-illumination device 70 and the mounting surface ST in the Z direction, more specifically, between the light splitter 202 and the mounting surface ST. The first lens group 203a is disposed so that its optical axis is aligned with the Z direction (the optical axis AX1 of the second image capture device 30). The first lens group 203a constitutes a telecentric optical system in which the chief ray of illumination light La that is emitted from the epi-illumination device 70 and passes through the first lens group 203a toward the mounting surface ST is parallel to the optical axis. The first aperture 203b is disposed between the epi-illumination device 70 and the optical splitter 202, and is configured to adjust the numerical aperture of the focusing optical system 203.

 (1/4波長板)
 1/4波長板204は、第1レンズ群203aと載置面STとの間に配置され、透過する光の偏光状態を変化させる平板状の光学部材である。1/4波長板204は、偏光子201および第1レンズ群203aを透過した直線偏光の照明光La1を円偏光に変換して透過させる。また、1/4波長板204は、被検物Aで反射された円偏光(すなわち被検物Aに投影された照明光La)を、偏光子201を透過した光の偏光面に直交する偏光面を有する直線偏光に変換して透過させる。
(1/4 wavelength plate)
The quarter-wave plate 204 is a flat optical member disposed between the first lens group 203a and the mounting surface ST, and changes the polarization state of light passing through it. The quarter-wave plate 204 converts the linearly polarized illumination light La1 that has passed through the polarizer 201 and the first lens group 203a into circularly polarized light and transmits the light. The quarter-wave plate 204 also converts the circularly polarized light reflected by the test object A (i.e., the illumination light La projected onto the test object A) into linearly polarized light having a polarization plane perpendicular to the polarization plane of the light that has passed through the polarizer 201 and transmits the light.

 1/4波長板204は、集光光学系203の物体面、すなわち第1レンズ群203aの光軸に垂直な面に対して所定の鋭角だけ傾いて配置される。これにより、1/4波長板204で反射された光が結像光学系205に入射しにくくなる。 The quarter-wave plate 204 is positioned at a predetermined acute angle relative to the object plane of the focusing optical system 203, i.e., the plane perpendicular to the optical axis of the first lens group 203a. This makes it difficult for light reflected by the quarter-wave plate 204 to enter the imaging optical system 205.

 (結像光学系)
 結像光学系205は、被検物Aで反射された光(すなわち被検物Aに照射された照明光La及び照明光Lbの反射光)を結像する。結像光学系205は、第2レンズ群205aおよび第2絞り205bを有する。第2レンズ群205aは、Z方向において、第1撮像装置40(第2撮像装置30)と載置面STとの間に配置され、より詳しくは光分岐器202と第1撮像装置40(第2撮像装置30)との間に配置される。第2レンズ群205aは、光軸が第1レンズ群203aの光軸(本例ではZ方向)に沿うように配置される。第2レンズ群205aは、被検物Aで反射され、かつ、第1レンズ群203a及び光分岐器202を通った光を、第1撮像装置40及び第2撮像装置30が有する受光面に結像する。第2絞り205bは、結像光学系205の開口数を調節するための構成である。第2絞り205bと第1絞り203bとは、光分岐器202に関して光学的に等価の位置に配置される。例えば、第2絞り205bと光分岐器202との距離は、第1絞り203bと光分岐器202との間の距離に等しい。
(Imaging optical system)
The imaging optical system 205 forms an image of light reflected by the test object A (i.e., reflected light of the illumination light La and illumination light Lb irradiated on the test object A). The imaging optical system 205 has a second lens group 205a and a second diaphragm 205b. The second lens group 205a is disposed between the first image capturing device 40 (second image capturing device 30) and the mounting surface ST in the Z direction, more specifically, between the optical splitter 202 and the first image capturing device 40 (second image capturing device 30). The second lens group 205a is disposed such that its optical axis is aligned with the optical axis of the first lens group 203a (in this example, the Z direction). The second lens group 205a forms an image of the light reflected by the test object A and passing through the first lens group 203a and the optical splitter 202 on the light receiving surfaces of the first image capturing device 40 and the second image capturing device 30. The second diaphragm 205b is a component for adjusting the numerical aperture of the imaging optical system 205. The second diaphragm 205b and the first diaphragm 203b are disposed at optically equivalent positions with respect to the optical splitter 202. For example, the distance between the second diaphragm 205b and the optical splitter 202 is equal to the distance between the first diaphragm 203b and the optical splitter 202.

 (偏光子)
 偏光子206は、第2レンズ群205aと第1撮像装置40(第2撮像装置30)との間に配置される。偏光子206は、偏光子201とクロスニコルとなるように配置される。すなわち、偏光子206は、偏光子201を透過した光の偏光面に直交する偏光面を有する直線偏光のみを透過し、他の偏光成分を有する光を遮光する。1/4波長板204を透過することなく偏光子206に到達した光は偏光子201の透過軸の方向に沿った偏光面を有する直線偏光であるから、偏光子206により、被検物A以外で反射された光が、第1撮像装置40及び第2撮像装置30に到達しにくくなる。
(Polarizer)
The polarizer 206 is disposed between the second lens group 205a and the first image capturing device 40 (second image capturing device 30). The polarizer 206 is disposed so as to be in a crossed Nicol state with the polarizer 201. That is, the polarizer 206 transmits only linearly polarized light having a polarization plane orthogonal to the polarization plane of the light transmitted through the polarizer 201, and blocks light having other polarization components. Since the light that reaches the polarizer 206 without transmitting through the quarter-wave plate 204 is linearly polarized light having a polarization plane aligned with the direction of the transmission axis of the polarizer 201, the polarizer 206 makes it difficult for light reflected by areas other than the test object A to reach the first image capturing device 40 and the second image capturing device 30.

 (分岐器)
 分岐器207は、第2レンズ群205aの光軸上であって、偏光子206と第1撮像装置40(第2撮像装置30)との間に配置される。分岐器207は、被検物Aで反射された光の一部を反射して第1撮像装置40に導き、残部を透過させて第2撮像装置30に導く。本実施形態では、分岐器207は、照明光Laの波長帯の光を透過し、照明光Lbの波長帯の光を反射する。従って、本実施形態では、分岐器207は、被検物Aで反射された照明光Lbを反射して第1撮像装置40に導き、被検物Aで反射された照明光Laを透過させて第2撮像装置30に導く。ただし、分岐器207は、被検物Aで反射された照明光Lbを透過し、被検物Aで反射された照明光Laを反射させる構成であってもよい。この場合、第1撮像装置40と第2撮像装置30との位置を、図3に示すものに対して入れ替えることが好ましい。なお、分岐器207は、ハーフミラー等のビームスプリッタである。
(Turret)
The splitter 207 is disposed on the optical axis of the second lens group 205a, between the polarizer 206 and the first imaging device 40 (second imaging device 30). The splitter 207 reflects a portion of the light reflected by the test object A and guides it to the first imaging device 40, and transmits the remaining portion and guides it to the second imaging device 30. In this embodiment, the splitter 207 transmits light in the wavelength band of the illumination light La and reflects light in the wavelength band of the illumination light Lb. Therefore, in this embodiment, the splitter 207 reflects the illumination light Lb reflected by the test object A and guides it to the first imaging device 40, and transmits the illumination light La reflected by the test object A and guides it to the second imaging device 30. However, the splitter 207 may be configured to transmit the illumination light Lb reflected by the test object A and reflect the illumination light La reflected by the test object A. In this case, it is preferable to exchange the positions of the first imaging device 40 and the second imaging device 30 with respect to those shown in Fig. 3. The splitter 207 is a beam splitter such as a half mirror.

 (照明光)
 撮像ユニット11の光学部材は、以上のような構成となっている。従って、落射照明装置70から照射された照明光La1は、Z方向と直交する方向(図3では-X方向)に進行し、偏光子201を通って光分岐器202で反射され、Z方向に進行する。光分岐器202で反射されてZ方向に進行する照明光La1は、第1レンズ群203a及び1/4波長板204を通って、鏡筒20の端部20Aから鏡筒20の外部に出射され、載置面STに載置された被検物Aに照射される。すなわち、落射照明装置70の光軸AX3は、落射照明装置70から光分岐器202までの区間では、第2撮像装置30の光軸AX1(Z方向)に直交する方向(本例では第1斜め方向)に沿っており、光分岐器202から載置面ST(被検物A)までの区間では、光軸AX1と同軸となる。なお、鏡筒20の端部20Aは、照明光La、Lbを通過可能になっており、照明光La、Lbを透過可能な部材が設けられていてもよいし、部材が設けられず開口していてもよい。
(Illumination light)
The optical members of the imaging unit 11 are configured as described above. Accordingly, illumination light La1 emitted from the epi-illumination device 70 travels in a direction perpendicular to the Z direction (the −X direction in FIG. 3 ), passes through the polarizer 201, is reflected by the optical splitter 202, and travels in the Z direction. The illumination light La1 reflected by the optical splitter 202 and traveling in the Z direction passes through the first lens group 203a and the quarter-wave plate 204, is emitted from the end 20A of the lens barrel 20 to the outside of the lens barrel 20, and is irradiated onto the test object A placed on the mounting surface ST. That is, the optical axis AX3 of the epi-illumination device 70 runs along a direction perpendicular to the optical axis AX1 (Z direction) of the second imaging device 30 (the first oblique direction in this example) in the section from the epi-illumination device 70 to the optical splitter 202, and is coaxial with the optical axis AX1 in the section from the optical splitter 202 to the mounting surface ST (test object A). The end 20A of the lens barrel 20 is capable of passing the illumination lights La and Lb, and may be provided with a member that is transparent to the illumination lights La and Lb, or may be an opening without any member.

 また、照明装置50から照射された照明光La2は、載置面STに載置された被検物Aに照射される。 Furthermore, the illumination light La2 emitted from the illumination device 50 is irradiated onto the test object A placed on the placement surface ST.

 被検物Aに照射された照明光La(照明光La1及びLa2)は、被検物Aで反射されて、鏡筒20の端部20Aから鏡筒20内に入射する。鏡筒20内に入射した照明光Laの反射光は、Z方向と反対方向に進行し、1/4波長板204、第1レンズ群203a、光分岐器202、第2レンズ群205a、偏光子206、及び分岐器207を通って、第2撮像装置30に入射する。第2撮像装置30は、入射した照明光Laの反射光を、被検物Aの像(被検物Aに投影された照明光Laの像)として撮像する。従って、第2撮像装置30の光軸AX1は、Z方向に沿う。なお、照明光Laを照射しない構成の場合、被検物Aで反射された照明光La及び照明光Lb以外の光(自然光や他の光源からの光)が、鏡筒20内に入射し、1/4波長板204、第1レンズ群203a、光分岐器202、第2レンズ群205a、偏光子206、及び分岐器207を通って、第1撮像装置40に入射する。この場合、第1撮像装置40は、被検物Aで反射された照明光La及び照明光Lb以外の光を、被検物Aの像(被検物Aに投影された光の像)として撮像する。 The illumination light La (illumination light La1 and La2) irradiated onto the test object A is reflected by the test object A and enters the tube 20 from the end 20A of the tube 20. The reflected light of the illumination light La that entered the tube 20 travels in the opposite direction to the Z direction, passes through the quarter-wave plate 204, the first lens group 203a, the optical splitter 202, the second lens group 205a, the polarizer 206, and the splitter 207, and enters the second imaging device 30. The second imaging device 30 captures the reflected light of the incident illumination light La as an image of the test object A (an image of the illumination light La projected onto the test object A). Therefore, the optical axis AX1 of the second imaging device 30 is along the Z direction. In a configuration in which illumination light La is not emitted, light other than illumination light La and illumination light Lb reflected by the test object A (natural light and light from other light sources) enters the lens barrel 20, passes through the quarter-wave plate 204, the first lens group 203a, the optical splitter 202, the second lens group 205a, the polarizer 206, and the splitter 207, and enters the first imaging device 40. In this case, the first imaging device 40 captures the light other than illumination light La and illumination light Lb reflected by the test object A as an image of the test object A (an image of light projected onto the test object A).

 また、投影装置60から照射された照明光Lbは、載置面STに載置された被検物Aに照射される。被検物Aに照射された照明光Lbは、被検物Aで反射されて、鏡筒20の端部20Aから鏡筒20内に入射する。なお、被検物Aに照射された照明光Lbは被検物Aで散乱し、端部20Aから鏡筒20内に入射しても構わない。鏡筒20内に入射した照明光Lbの反射光は、Z方向と反対方向に進行し、1/4波長板204、第1レンズ群203a、光分岐器202、第2レンズ群205a、及び偏光子206を通って分岐器207に入射する。分岐器207に入射した照明光Lbの反射光は、+X方向に進行して、第1撮像装置40に入射する。第1撮像装置40は、入射した照明光Lbの反射光を、被検物Aに投影された照明光Lbの像として撮像する。第1撮像装置40の光軸AX2は、載置面ST(被検物A)から光分岐器207からまでの区間では、光軸AX1と同軸となり、光分岐器207から第1撮像装置40までの区間では、第2撮像装置30の光軸AX1(Z方向)に直交する方向(本例では-Y方向)に沿う。 Furthermore, the illumination light Lb emitted from the projection device 60 is irradiated onto the test object A placed on the mounting surface ST. The illumination light Lb irradiated onto the test object A is reflected by the test object A and enters the lens barrel 20 from the end 20A of the lens barrel 20. Note that the illumination light Lb irradiated onto the test object A may be scattered by the test object A and enter the lens barrel 20 from the end 20A. The reflected light of the illumination light Lb that enters the lens barrel 20 travels in the direction opposite to the Z direction, passes through the quarter-wave plate 204, the first lens group 203a, the optical splitter 202, the second lens group 205a, and the polarizer 206, and enters the splitter 207. The reflected light of the illumination light Lb that enters the splitter 207 travels in the +X direction and enters the first imaging device 40. The first imaging device 40 captures the reflected light of the incident illumination light Lb as an image of the illumination light Lb projected onto the test object A. The optical axis AX2 of the first imaging device 40 is coaxial with the optical axis AX1 in the section from the placement surface ST (test object A) to the optical splitter 207, and is aligned along a direction (in this example, the -Y direction) perpendicular to the optical axis AX1 (Z direction) of the second imaging device 30 in the section from the optical splitter 207 to the first imaging device 40.

 (投影装置の詳細)
 次に、投影装置60の詳細構成について説明する。図4は、Z方向から見た際の投影装置の位置を示す模式図である。
(Details of the projection device)
Next, a detailed configuration of the projection device 60 will be described below. Fig. 4 is a schematic diagram showing the position of the projection device when viewed from the Z direction.

 上述のように、本実施形態においては、第1投影装置60aと第2投影装置60bとは、鏡筒20(光軸AX1)の、-X方向側及びX方向側(スキャン方向であるY方向に直交する方向側)に配置される。さらに言えば、本実施形態では、図4に示すように、第1投影装置60aと第2投影装置60bとは、Y方向(スキャン方向)における位置が異なる。すなわち、Z方向から見た際の第1投影装置60aの中心軸AX4(後述の第1光源装置601Aから第1レンズ群602Aまでの区間における第1光源装置601Aの光軸)と、Z方向から見た際の第2投影装置60bの中心軸AX4(後述の第1光源装置601Aから第1レンズ群602Aまでの区間における第1光源装置601Aの光軸)とは、Y方向にオフセットしている。 As described above, in this embodiment, the first projection device 60a and the second projection device 60b are disposed on the -X and X directions (sides perpendicular to the Y direction, which is the scanning direction) of the lens barrel 20 (optical axis AX1). Furthermore, in this embodiment, as shown in FIG. 4, the first projection device 60a and the second projection device 60b are positioned at different positions in the Y direction (scanning direction). That is, the central axis AX4 of the first projection device 60a when viewed from the Z direction (the optical axis of the first light source device 601A in the section from the first light source device 601A to the first lens group 602A, which will be described later) and the central axis AX4 of the second projection device 60b when viewed from the Z direction (the optical axis of the first light source device 601A in the section from the first light source device 601A to the first lens group 602A, which will be described later) are offset in the Y direction.

 より詳しくは、Z方向から見て、第1投影装置60aの中心軸AX4は、鏡筒20の光軸AX1に対してY方向のうちの一方側に位置し、第2投影装置60bの中心軸AX4は、鏡筒20の光軸AX1に対してY方向のうちの他方側に位置する。図4の例では、第1投影装置60aの中心軸AX4が光軸AX1の-Y方向側に位置し、第2投影装置60bの中心軸AX4が光軸AX1の+Y方向側に位置する。ただしそれに限られず、第1投影装置60aの中心軸AX4が光軸AX1の+Y方向側に位置し、第2投影装置60bの中心軸AX4が光軸AX1の-Y方向側に位置してもよい。なお、Z方向から見て、第1投影装置60a及び第2投影装置60bは、鏡筒20の外周面からY方向側にはみ出していないことが好ましい。すなわち、第1投影装置60a及び第2投影装置60bは、Y方向において、鏡筒20の外周面のうちの最も+Y方向側の位置20Y1と、鏡筒20の外周面のうちの最も-Y方向側の位置20Y2との間に位置していることが好ましい。 More specifically, when viewed from the Z direction, the central axis AX4 of the first projection device 60a is located on one side in the Y direction with respect to the optical axis AX1 of the lens barrel 20, and the central axis AX4 of the second projection device 60b is located on the other side in the Y direction with respect to the optical axis AX1 of the lens barrel 20. In the example of FIG. 4, the central axis AX4 of the first projection device 60a is located on the -Y side of the optical axis AX1, and the central axis AX4 of the second projection device 60b is located on the +Y side of the optical axis AX1. However, this is not limited to this, and the central axis AX4 of the first projection device 60a may be located on the +Y side of the optical axis AX1, and the central axis AX4 of the second projection device 60b may be located on the -Y side of the optical axis AX1. Note that when viewed from the Z direction, it is preferable that the first projection device 60a and the second projection device 60b do not protrude from the outer circumferential surface of the lens barrel 20 in the Y direction. In other words, it is preferable that the first projection device 60a and the second projection device 60b are located between the position 20Y1 on the outer circumferential surface of the lens barrel 20 that is closest to the +Y direction and the position 20Y2 on the outer circumferential surface of the lens barrel 20 that is closest to the -Y direction.

 このように、第1投影装置60aと第2投影装置60bとがY方向にオフセットすることで、第1投影装置60aからの照明光Lbの載置面ST(被検物A)への照射領域と、第2投影装置60bからの照明光Lbの載置面ST(被検物A)への照射領域との位置を、適切にY方向にずらすことができる。なお、照射領域については後述する。 In this way, by offsetting the first projection device 60a and the second projection device 60b in the Y direction, the positions of the irradiation area of the illumination light Lb from the first projection device 60a onto the mounting surface ST (test object A) and the irradiation area of the illumination light Lb from the second projection device 60b onto the mounting surface ST (test object A) can be appropriately shifted in the Y direction. The irradiation areas will be described later.

 (投影装置の光学部材)
 次に、投影装置60の光学部材について説明する。図5は、投影装置の光学部材の構成を説明する模式図である。以降においては、投影装置60として、第1投影装置60aを例にして構造を説明するが、第2投影装置60bも、第1投影装置60aと同様の構造となっている。ただし、第2投影装置60bは、Y方向から見て、第1投影装置60aと第2投影装置60bとの間のZ方向に沿った線を基準として、線対称の構造となっている。例えば、図5の例では、第1投影装置60aの、後述する第2光源装置601B、第2レンズ群602B、第2光学素子603B及び1/2波長板604は、後述する第1光源装置601Aに対して-X方向側にあるが、第2投影装置60bの第2光源装置601B、第2レンズ群602B、第2光学素子603B及び1/2波長板604は、第1光源装置601Aに対して+X方向側に位置することになる。
(Optical components of the projection device)
Next, the optical members of the projection device 60 will be described. FIG. 5 is a schematic diagram illustrating the configuration of the optical members of the projection device. Hereinafter, the structure of the projection device 60 will be described using the first projection device 60a as an example, but the second projection device 60b also has a similar structure to the first projection device 60a. However, when viewed from the Y direction, the second projection device 60b has a structure that is line-symmetrical with respect to a line extending in the Z direction between the first projection device 60a and the second projection device 60b. For example, in the example of FIG. 5, the second light source device 601B, second lens group 602B, second optical element 603B, and half-wave plate 604 (described later) of the first projection device 60a are located on the −X direction side with respect to the first light source device 601A (described later), while the second light source device 601B, second lens group 602B, second optical element 603B, and half-wave plate 604 of the second projection device 60b are located on the +X direction side with respect to the first light source device 601A.

 図5に示すように、投影装置60(第1投影装置60a)は、光源装置601と、レンズ群602と、光学素子603と、1/2波長板604と、合成部605と、投影光学系606と、を有する。本実施形態においては、投影装置60は、複数の光源装置601を有する。具体的には、投影装置60は、光源装置601として、第1光源装置601A及び第2光源装置601Bを有する。そして、投影装置60は、レンズ群602として、第1光源装置601Aに対応する第1レンズ群602Aと、第2光源装置601Bに対応する第2レンズ群602Bとを有し、光学素子603として、第1光源装置601Aに対応する第1光学素子603Aと、第2光源装置601Bに対応する第2光学素子603Bとを有する。ただし、投影装置60が有する光源装置601の数は2つに限られず、3つ以上であってもよいし1つであってもよい。投影装置60が有する光源装置601の数が1つである場合には、投影装置60の数は2つ以上であることが好ましい。これにより、異なる照射領域に照明光Lbを照射できる。 As shown in FIG. 5, the projection device 60 (first projection device 60a) has a light source device 601, a lens group 602, an optical element 603, a half-wave plate 604, a combining unit 605, and a projection optical system 606. In this embodiment, the projection device 60 has multiple light source devices 601. Specifically, the projection device 60 has a first light source device 601A and a second light source device 601B as the light source devices 601. The projection device 60 also has a first lens group 602A corresponding to the first light source device 601A and a second lens group 602B corresponding to the second light source device 601B as the lens group 602, and a first optical element 603A corresponding to the first light source device 601A and a second optical element 603B corresponding to the second light source device 601B as the optical element 603. However, the number of light source devices 601 that the projection device 60 has is not limited to two, and may be three or more, or may be one. If the projection device 60 has one light source device 601, it is preferable that the number of projection devices 60 is two or more. This allows the illumination light Lb to be irradiated onto different irradiation areas.

 (光源装置)
 光源装置601は、照明光Lbを照射する光源であり、本実施形態ではレーザダイオードである。すなわち、本実施形態に係る照明光Lbは、レーザ光である。ここで、光源装置601から出射される照明光Lbの光軸に直交する一方向を第1配向方向とし、光軸及び第1配向方向に直交する方向を第2配向方向とする。この場合、光源装置601から出射される照明光Lbは、より詳しくは光源装置601とレンズ群602との間の区間における照明光Lbは、第1配向方向における照明光Lbの広がる角度を示す半値角(指向角)が、第2配向方向における照明光Lbの広がる角度を示す半値角よりも大きい。ただし、照明光Lbの半値角は、このように不均一であることに限られず、例えば第1配向方向における半値角と第2配向における半値角とが同一であってもよい。以降において、第1光源装置601Aが照射する照明光Lbと第2光源装置601Bが照射する照明光Lbとを区別する場合には、第1光源装置601Aが照射する照明光Lbを照明光Lb1、第2光源装置601Bが照射する照明光Lbを照明光Lb2とする。第1光源装置601Aと第2光源装置601Bの波長は同じである。なお、第1光源装置601Aと第2光源装置601Bの波長は異なっていても構わない。
(Light source device)
The light source device 601 is a light source that emits illumination light Lb, and in this embodiment, is a laser diode. That is, the illumination light Lb in this embodiment is laser light. Here, a direction perpendicular to the optical axis of the illumination light Lb emitted from the light source device 601 is defined as a first alignment direction, and a direction perpendicular to the optical axis and the first alignment direction is defined as a second alignment direction. In this case, the illumination light Lb emitted from the light source device 601, more specifically, the illumination light Lb in the section between the light source device 601 and the lens group 602, has a half-value angle (directivity angle) indicating the angle at which the illumination light Lb spreads in the first alignment direction that is larger than the half-value angle indicating the angle at which the illumination light Lb spreads in the second alignment direction. However, the half-value angle of the illumination light Lb is not limited to being nonuniform in this manner; for example, the half-value angle in the first alignment direction and the half-value angle in the second alignment direction may be the same. Hereinafter, when distinguishing between the illumination light Lb emitted by the first light source device 601A and the illumination light Lb emitted by the second light source device 601B, the illumination light Lb emitted by the first light source device 601A will be referred to as illumination light Lb1, and the illumination light Lb emitted by the second light source device 601B will be referred to as illumination light Lb2. The wavelengths of the first light source device 601A and the second light source device 601B are the same. However, the wavelengths of the first light source device 601A and the second light source device 601B may be different.

 本実施形態では、第1光源装置601Aは、第1光源装置601Aから第1レンズ群602Aまでの区間における光軸がZ方向に沿うように、すなわちZ方向に向けて照明光Lb1を照射するように、配置されている。また、第1光源装置601Aは、半値角が大きい第1配向方向が、X方向となるように配置されている。一方、第2光源装置601Bは、第2光源装置601Bから第2レンズ群602Bまでの区間における光軸がZ方向に直交する方向に沿うように、すなわちZ方向に直交する方向に向けて照明光Lb2を照射するように、配置されている。図5の例では、第2光源装置601Bは、光軸が+X方向に沿うように配置されている。また、図5の例では、第1光源装置601Aは、半値角が大きい第1配向方向が、Z方向となるように配置されている。 In this embodiment, the first light source device 601A is arranged so that the optical axis in the section from the first light source device 601A to the first lens group 602A is along the Z direction, i.e., so that the illumination light Lb1 is emitted in the Z direction. The first light source device 601A is also arranged so that the first orientation direction in which the half-value angle is large is the X direction. On the other hand, the second light source device 601B is arranged so that the optical axis in the section from the second light source device 601B to the second lens group 602B is along a direction perpendicular to the Z direction, i.e., so that the illumination light Lb2 is emitted in a direction perpendicular to the Z direction. In the example of FIG. 5, the second light source device 601B is arranged so that the optical axis is along the +X direction. In the example of FIG. 5, the first light source device 601A is also arranged so that the first orientation direction in which the half-value angle is large is the Z direction.

 (レンズ群)
 レンズ群602は、光源装置601と光学素子603との間に設けられる。レンズ群602は、光軸方向に並ぶ複数のレンズで構成される。レンズ群602は、光源装置601から照射された照明光Lbを、光軸に直交する方向に拡大する。本実施形態では、レンズ群602は、光源装置601から照射された照明光Lbを、第2配向方向側よりも第1配向方向側に大きく拡大する。すなわち、レンズ群602は、照明光Lbを、照明光Lbの半値角の大きい角度のほうに(すなわち第1配向方向側に)、拡げる。これにより、照明光Lbの配向方向を利用して、照明光Lbの照射領域を適切に横長にできる。なお、本実施形態では、レンズ群602は、照明光Lbを第2配向方向側には拡げないが、第2配向方向側にも拡げてよい。
(Lens group)
The lens group 602 is disposed between the light source device 601 and the optical element 603. The lens group 602 is composed of a plurality of lenses arranged in the optical axis direction. The lens group 602 expands the illumination light Lb emitted from the light source device 601 in a direction perpendicular to the optical axis. In this embodiment, the lens group 602 expands the illumination light Lb emitted from the light source device 601 more toward the first alignment direction than toward the second alignment direction. That is, the lens group 602 expands the illumination light Lb toward an angle with a larger half-value angle of the illumination light Lb (i.e., toward the first alignment direction). This allows the illumination light Lb's irradiation area to be appropriately elongated horizontally by utilizing the alignment direction of the illumination light Lb. Note that in this embodiment, the lens group 602 does not expand the illumination light Lb toward the second alignment direction, but may also expand the illumination light Lb toward the second alignment direction.

 レンズ群602は、第1配向方向側に広げられた照明光Lbを、平行光となるように絞る。従って、レンズ群602から出射された照明光Lbは、第1配向方向における半値全幅が、第2配向方向における半値全幅よりも長くなる。 The lens group 602 narrows the illumination light Lb, which has been spread toward the first alignment direction, to become parallel light. Therefore, the full width at half maximum of the illumination light Lb emitted from the lens group 602 in the first alignment direction is longer than the full width at half maximum in the second alignment direction.

 レンズ群602は、光源装置601の光軸に沿って並ぶ凸レンズ602a、凹レンズ602b、及び凸レンズ602cを含む。凸レンズ602aは、光源装置601からの照明光Lbを絞って平行光とする。凹レンズ602bは、凸レンズ602aよりも光源装置601から離れる側に設けられており、凸レンズ602aから出射された照明光Lbを、光軸に直交する方向に拡大する。具体的には、凹レンズ602bは、光源装置601から照射された照明光Lbを、照明光Lbの半値角の大きい角度のほうに(すなわち第1配向方向側に)拡げるレンズである。凸レンズ602cは、凹レンズ602bよりも光源装置601から離れる側に設けられており、凹レンズ602bから出射された照明光Lbを絞って平行光とする。ただし、レンズ群602の構成は、これに限られず、照明光Lbを照明光Lbの半値角の大きい角度のほうに拡げる任意の構成であってよい。 The lens group 602 includes a convex lens 602a, a concave lens 602b, and a convex lens 602c aligned along the optical axis of the light source device 601. The convex lens 602a focuses the illumination light Lb from the light source device 601 to form parallel light. The concave lens 602b is located further away from the light source device 601 than the convex lens 602a, and expands the illumination light Lb emitted from the convex lens 602a in a direction perpendicular to the optical axis. Specifically, the concave lens 602b expands the illumination light Lb emitted from the light source device 601 toward an angle larger than the half-value angle of the illumination light Lb (i.e., toward the first orientation direction). The convex lens 602c is located further away from the light source device 601 than the concave lens 602b, and focuses the illumination light Lb emitted from the concave lens 602b to form parallel light. However, the configuration of the lens group 602 is not limited to this, and any configuration that expands the illumination light Lb toward an angle greater than the half-value angle of the illumination light Lb may be used.

 本実施形態では、第1レンズ群602Aは、第1光源装置601Aと第1光学素子603Aとの間に設けられる。第1レンズ群602Aは、第1光源装置601Aの光軸(Z方向)に沿って並ぶ凸レンズ602a、凹レンズ602b、及び凸レンズ602cを含む。第1レンズ群602Aは、第1光源装置601Aから出射された照明光Lb1を第1配向方向側(本例ではX方向側)に拡げ、第1配向方向側(本例ではX方向側)に拡げた照明光Lb1を絞って、第1配向方向(本例ではX方向)における半値全幅が、第2配向方向(本例ではY方向)における半値全幅よりも長い平行光として、照明光Lb1をZ方向に出射する。 In this embodiment, the first lens group 602A is provided between the first light source device 601A and the first optical element 603A. The first lens group 602A includes a convex lens 602a, a concave lens 602b, and a convex lens 602c aligned along the optical axis (Z direction) of the first light source device 601A. The first lens group 602A expands the illumination light Lb1 emitted from the first light source device 601A toward the first alignment direction (X direction in this example), narrows the illumination light Lb1 expanded toward the first alignment direction (X direction in this example), and emits the illumination light Lb1 in the Z direction as parallel light whose full width at half maximum in the first alignment direction (X direction in this example) is longer than the full width at half maximum in the second alignment direction (Y direction in this example).

 また、第2レンズ群602Bは、第2光源装置601Bと第2光学素子603Bとの間に設けられる。第2レンズ群602Bは、第2光源装置601Bの光軸(+X方向)に沿って並ぶ凸レンズ602a、凹レンズ602b、及び凸レンズ602cを含む。第2レンズ群602Bは、第2光源装置601Bから出射された照明光Lb2を第1配向方向側(本例ではZ方向とZ方向の反対方向側)に拡げ、第1配向方向側(本例ではZ方向とZ方向の反対方向側)に拡げた照明光Lb1を絞って、第1配向方向(本例ではZ方向とZ方向の反対方向側)における半値全幅が、第2配向方向(本例ではY方向)における半値全幅よりも長い平行光として、照明光Lb1を+X方向に出射する。 The second lens group 602B is disposed between the second light source device 601B and the second optical element 603B. The second lens group 602B includes a convex lens 602a, a concave lens 602b, and a convex lens 602c aligned along the optical axis (+X direction) of the second light source device 601B. The second lens group 602B expands the illumination light Lb2 emitted from the second light source device 601B toward the first alignment direction (in this example, the Z direction and the opposite side of the Z direction) and narrows the illumination light Lb1 expanded toward the first alignment direction (in this example, the Z direction and the opposite side of the Z direction), emitting the illumination light Lb1 in the +X direction as parallel light whose full width at half maximum in the first alignment direction (in this example, the Z direction and the opposite side of the Z direction) is longer than the full width at half maximum in the second alignment direction (in this example, the Y direction).

 (光学素子)
 図6は、光学素子の模式図な斜視図であり、図7は、光学素子をY方向から見た際の模式図である。図5に示すように、光学素子603は、光源装置601と合成部605との間に、より詳しくはレンズ群602と合成部605との間に、設けられる。光学素子603(より詳しくは後述の回折格子603a)は、後述する絞り部606Bに関して、被検物A(載置面ST)と共役な位置に配置される。
(Optical elements)
Fig. 6 is a schematic perspective view of the optical element, and Fig. 7 is a schematic view of the optical element as viewed from the Y direction. As shown in Fig. 5, the optical element 603 is provided between the light source device 601 and the combining unit 605, more specifically, between the lens group 602 and the combining unit 605. The optical element 603 (more specifically, a diffraction grating 603a described below) is disposed at a position conjugate with the test object A (mounting surface ST) with respect to the diaphragm unit 606B described below.

 図6及び図7に示すように、光学素子603は、回折格子603aと、マスク部603bとを有する。回折格子603aは、入射した光を回折させて、回折角の異なる複数の次数の光に分離する回折格子である。すなわち、回折格子603aは、入射した光を、第1回折光と、第1回折光とは角度が異なる第2回折光とに分離する。回折格子603aは、任意の構造の回折格子であってよいが、例えば、複数のスリットが形成される部材であってよい。本実施形態において、回折格子603Aaと回折格子603Aaは同じである。例えば、回折格子にパターンが配置されている場合にそのパターン周期は、回折格子603aと回折格子603bで同じである。なお、回折格子603Aaと回折格子603Aaは異なっていても構わない。例えば、回折格子にパターンが配置されている場合にそのパターン周期は、回折格子603aと回折格子603bで異なる。 6 and 7, the optical element 603 has a diffraction grating 603a and a mask portion 603b. The diffraction grating 603a is a diffraction grating that diffracts incident light and separates it into multiple orders of light with different diffraction angles. That is, the diffraction grating 603a separates the incident light into a first diffracted light and a second diffracted light having an angle different from that of the first diffracted light. The diffraction grating 603a may be a diffraction grating of any structure, and may, for example, be a member having multiple slits formed therein. In this embodiment, the diffraction gratings 603Aa and 603B are the same. For example, if a pattern is arranged on the diffraction grating, the pattern period is the same for the diffraction gratings 603a and 603b. Note that the diffraction gratings 603Aa and 603B may be different. For example, if a pattern is arranged on the diffraction grating, the pattern period is different for the diffraction gratings 603a and 603b.

 マスク部603bは、照明光Lb1を遮蔽する部材である。マスク部603bは、照明光Lb1を遮断する任意の部材であってよい。マスク部603bは、一部の領域に開口OPが形成されている。マスク部603bは、開口OPが形成されていない領域において、照明光Lb1を遮断(吸収又は反射)し、開口OPが形成されている領域において、照明光Lb1を透過する。なお、開口OPには、マスク部603bや他の部材などの部材が設けられないが、照明光Lb1を透過する部材が設けられていてもよい。 The mask portion 603b is a member that blocks the illumination light Lb1. The mask portion 603b may be any member that blocks the illumination light Lb1. An opening OP is formed in a partial area of the mask portion 603b. The mask portion 603b blocks (absorbs or reflects) the illumination light Lb1 in areas where the opening OP is not formed, and transmits the illumination light Lb1 in areas where the opening OP is formed. Note that the opening OP does not include the mask portion 603b or other members, but may include a member that transmits the illumination light Lb1.

 開口OPの形状は任意であってよいが、本実施形態においては、被検物A(載置面ST)において照明光Lb1が照射される照射領域(後述)の所望の形状に、合わせた形状に設定される。詳しくは後述するが、照射領域は、一方向の長さがその一方向に直交する他方向の長さよりも長い横長形状となっているため、同様に、開口OPは、一方向の長さがその一方向に直交する他方向の長さよりも長い横長形状となっている。具体的には、開口OPは、第1配向方向(照明光Lbを広げた方向)の長さが、第2配向方向の長さよりも長い形状となっている。図6の例では、開口OPは第1配向方向に長い長方形であるが、長方形に限られず、楕円形、長方形の角が曲線となる形状、多角形など、任意の形状であってよい。 The opening OP may have any shape, but in this embodiment, it is set to a shape that matches the desired shape of the irradiation area (described below) on the test object A (mounting surface ST) onto which the illumination light Lb1 is irradiated. As will be described in more detail below, the irradiation area has a horizontally elongated shape with one direction longer than the other direction perpendicular to that direction. Similarly, the opening OP has a horizontally elongated shape with one direction longer than the other direction perpendicular to that one direction. Specifically, the length of the opening OP in the first orientation direction (the direction in which the illumination light Lb is spread) is longer than the length in the second orientation direction. In the example of Figure 6, the opening OP is a rectangle that is long in the first orientation direction, but is not limited to a rectangle and may be any shape, such as an ellipse, a rectangle with curved corners, or a polygon.

 マスク部603bは、回折格子603aの、光源装置601側とは反対側の表面に設けられている。ただし、マスク部603bが設けられる位置はこれに限られない。例えば、マスク部603bは、回折格子603aに対して、光源装置601側とは反対側に離れた位置に設けられてもよい。また、マスク部603bは、回折格子603aの光源装置601側の表面に設けられてもよいし、回折格子603aに対して、光源装置601側に離れた位置に設けられてもよい。 Mask portion 603b is provided on the surface of diffraction grating 603a opposite the light source device 601 side. However, the position at which mask portion 603b is provided is not limited to this. For example, mask portion 603b may be provided at a position away from diffraction grating 603a on the opposite side from light source device 601 side. Furthermore, mask portion 603b may be provided on the surface of diffraction grating 603a facing the light source device 601, or at a position away from diffraction grating 603a on the light source device 601 side.

 光学素子603は、以上のような構造を有するため、光学素子603に入射した照明光Lbは、回折格子603aにおいて第1回折光と第2回折光とに分離され、第1回折光と第2回折光との一部が、開口OPを通って光学素子603から出射される。 Because the optical element 603 has the above-described structure, the illumination light Lb incident on the optical element 603 is separated into first diffracted light and second diffracted light by the diffraction grating 603a, and a portion of the first diffracted light and second diffracted light passes through the opening OP and exits the optical element 603.

 第1光学素子603Aは、第1光源装置601Aと合成部605との間に、より詳しくは第1レンズ群602Aと合成部605との間に、設けられる。第1光学素子603Aは、回折格子603aとしての回折格子603Aaと、マスク部603bとしてのマスク部603Abとを有する。マスク部603Abの開口OPは、第1配向方向であるX方向における長さが、第2配向方向であるY方向における長さよりも長くなっている。第1光学素子603Aに入射した照明光Lb1は、回折格子603Aaにおいて、第1回折光である照明光Lb1aと第2回折光である照明光Lb1bとに分離される。照明光Lb1aと照明光Lb1bとの一部は、開口OPを通って第1光学素子603AからZ方向に出射される。照明光Lb1aと照明光Lb1bとは、互いに異なる光路でZ方向に向けて進行する。なお、回折格子603Aaにおいては、第1回折光(照明光Lb1a)及び第2回折光(照明光Lb1b)以外の回折光も出射される場合があるが、この回折光は、後述の絞り部606Bで遮断される。 The first optical element 603A is arranged between the first light source device 601A and the combining unit 605, more specifically between the first lens group 602A and the combining unit 605. The first optical element 603A has a diffraction grating 603Aa as the diffraction grating 603a and a mask unit 603Ab as the mask unit 603b. The length of the opening OP of the mask unit 603Ab in the X direction, which is the first alignment direction, is longer than the length in the Y direction, which is the second alignment direction. The illumination light Lb1 incident on the first optical element 603A is separated by the diffraction grating 603Aa into illumination light Lb1a, which is the first diffracted light, and illumination light Lb1b, which is the second diffracted light. Portions of the illumination light Lb1a and illumination light Lb1b pass through the opening OP and are emitted from the first optical element 603A in the Z direction. Illumination light Lb1a and illumination light Lb1b travel along different optical paths in the Z direction. Note that diffraction grating 603Aa may also emit diffracted light other than the first diffracted light (illumination light Lb1a) and the second diffracted light (illumination light Lb1b), but this diffracted light is blocked by diaphragm section 606B, which will be described later.

 第2光学素子603Bは、第2光源装置601Bと合成部605との間に、より詳しくは第2レンズ群602Bと合成部605との間に、設けられる。第2光学素子603Bは、回折格子603aとしての回折格子603Baと、マスク部603bとしてのマスク部603Bbとを有する。マスク部603Bbの開口OPは、第1配向方向であるZ方向における長さが、第2配向方向であるY方向における長さよりも長くなっている。第2光学素子603Bに入射した照明光Lb2は、回折格子603Baにおいて、第1回折光である照明光Lb2aと第2回折光である照明光Lb2bとに分離される。照明光Lb2aと照明光Lb2bとの一部は、開口OPを通って第2光学素子603Bから+X方向に出射される。なお、照明光Lb2aと照明光Lb2bとは、互いに異なる光路で+X方向に向けて進行する。なお、回折格子603Baにおいては、第1回折光(照明光Lb2a)及び第2回折光(照明光Lb2b)以外の回折光も出射される場合があるが、この回折光は、後述の絞り部606Bで遮断される。 The second optical element 603B is provided between the second light source device 601B and the combining unit 605, more specifically between the second lens group 602B and the combining unit 605. The second optical element 603B has a diffraction grating 603Ba as the diffraction grating 603a and a mask unit 603Bb as the mask unit 603b. The length of the opening OP of the mask unit 603Bb in the Z direction, which is the first alignment direction, is longer than the length in the Y direction, which is the second alignment direction. The illumination light Lb2 incident on the second optical element 603B is separated by the diffraction grating 603Ba into illumination light Lb2a, which is the first diffracted light, and illumination light Lb2b, which is the second diffracted light. Portions of the illumination light Lb2a and illumination light Lb2b pass through the opening OP and are emitted from the second optical element 603B in the +X direction. Illumination light Lb2a and illumination light Lb2b travel in the +X direction along different optical paths. Diffraction grating 603Ba may also emit diffracted light other than the first diffracted light (illumination light Lb2a) and the second diffracted light (illumination light Lb2b), but this diffracted light is blocked by diaphragm section 606B, which will be described later.

 ここで、第2光学素子603B(マスク部603Bb)の開口OPは、第1光学素子603A(マスク部603Ab)の開口OPに対して、Y方向(スキャン方向)において異なる位置にある。さらに言えば、第2光学素子603Bの開口OPの周縁を+X方向に投影して形成される仮想の軌跡は、第1光学素子603Aの開口OPの周縁をZ方向に投影して形成される仮想の軌跡と、重ならない。図6及び図7の例では、第2光学素子603Bの開口OPは、第1光学素子603Aの開口OPよりも、-Y方向側に位置している。そして、第2光学素子603Bの開口OPの最も+Y方向側の端部は、第1光学素子603Aの開口OPの最も-Y方向側の端部よりも、-Y方向側に位置する。言い換えれば、第2光学素子603Bの開口OPと第1光学素子603Aの開口OPとは、Y方向において離れている。ただし、位置関係が逆であってよく、例えば第2光学素子603Bの開口OPが、第1光学素子603Aの開口OPよりも、+Y方向側に位置してもよい。 Here, the opening OP of the second optical element 603B (mask portion 603Bb) is located at a different position in the Y direction (scanning direction) relative to the opening OP of the first optical element 603A (mask portion 603Ab). Furthermore, the virtual locus formed by projecting the periphery of the opening OP of the second optical element 603B in the +X direction does not overlap with the virtual locus formed by projecting the periphery of the opening OP of the first optical element 603A in the Z direction. In the examples of Figures 6 and 7, the opening OP of the second optical element 603B is located on the -Y direction side of the opening OP of the first optical element 603A. Furthermore, the end of the opening OP of the second optical element 603B closest to the +Y direction is located on the -Y direction side of the end of the opening OP of the first optical element 603A closest to the -Y direction. In other words, the opening OP of the second optical element 603B and the opening OP of the first optical element 603A are spaced apart in the Y direction. However, the positional relationship may be reversed; for example, the opening OP of the second optical element 603B may be located on the +Y direction side of the opening OP of the first optical element 603A.

 このように、第1光学素子603Aと第2光学素子603Bとで、開口OPの位置をY方向に異ならせることで、第1光学素子603Aの開口OPを通る照明光Lb1a、Lb1bの光路と、第2光学素子603Bの開口OPを通る照明光Lb2a、Lb2bの光路とを、Y方向にずらすことができる。本実施形態の例では、照明光Lb2a、Lb2bの光路が、照明光Lb1a、Lb1bの光路よりも、-Y方向側に位置する。このように、照明光Lb1a、Lb1bの光路と照明光Lb2a、Lb2bの光路とを、重ならせずY方向にずらすことで、照明光Lb1による被検物A(載置面ST)での照射領域と、照明光Lb2による被検物A(載置面ST)での照射領域とを、Y方向にずらして重ならせないことが可能となる。 In this way, by differentiating the positions of the openings OP in the Y direction between the first optical element 603A and the second optical element 603B, the optical paths of the illumination lights Lb1a and Lb1b that pass through the opening OP of the first optical element 603A and the optical paths of the illumination lights Lb2a and Lb2b that pass through the opening OP of the second optical element 603B can be shifted in the Y direction. In this embodiment, the optical paths of the illumination lights Lb2a and Lb2b are located on the -Y direction side of the optical paths of the illumination lights Lb1a and Lb1b. In this way, by shifting the optical paths of the illumination lights Lb1a and Lb1b and the optical paths of the illumination lights Lb2a and Lb2b in the Y direction without overlapping, it is possible to shift the illumination area on the test object A (mounting surface ST) illuminated by the illumination light Lb1 and the illumination area on the test object A (mounting surface ST) illuminated by the illumination light Lb2 in the Y direction so that they do not overlap.

 (1/2波長板)
 図5に示すように、1/2波長板604は、第2光学素子603Bと合成部605との間に設けられる。1/2波長板604は、透過する光の偏光状態を変化させる平板状の光学部材であり、より詳しくは、直線偏光の偏光方向を回転して透過させる。第2光学素子603Bから出射した照明光Lb2a、Lb2bは、1/2波長板604で偏光方向が回転された状態で、1/2波長板604から出射される。このように、第2光学素子603Bと合成部605との間に1/2波長板604を設けることで、後段の合成部605において、照明光Lb2a、Lb2bを適切に反射させて、被検物Aに照射される照明光Lb2a、Lb2bの強度が低下することを抑制できる。なお、1/2波長板604は、第2光学素子603Bと合成部605との間に設けなくもよい。1/2波長板604は、第2光源装置601Bと合成部605の間のいずれかに配置すれば構わない。例えば、1/2波長板604は、第2光学素子603Bと第2光源装置602Bの間に設けても構わない。また、例えば、1/2波長板604は、凸レンズ602aと凹レンズ602bの間に設けても構わない。また、1/2波長板604は、第1光源装置601A側に配置しても構わない。また、1/2波長板604は、第1光源装置601Aと合成部605の間のいずれかに配置すれば構わない。例えば、1/2波長板604は、第1光学素子603Aと第1光源装置601Aの間に設けても構わない。また、例えば、1/2波長板604は、凸レンズ602aと凹レンズ602bの間に設けても構わない。また、第1光源装置601Aと第2光源装置601Bから照射される光の偏光方向が異なる場合には、1/2波長板は設けなくても構わない。
(1/2 wavelength plate)
As shown in FIG. 5 , the half-wave plate 604 is provided between the second optical element 603B and the combining unit 605. The half-wave plate 604 is a flat optical element that changes the polarization state of transmitted light. More specifically, it rotates the polarization direction of linearly polarized light before transmitting it. The illumination light beams Lb2a and Lb2b emitted from the second optical element 603B are emitted from the half-wave plate 604 with their polarization direction rotated by the half-wave plate 604. By providing the half-wave plate 604 between the second optical element 603B and the combining unit 605 in this manner, the illumination light beams Lb2a and Lb2b can be appropriately reflected in the subsequent combining unit 605, thereby preventing a decrease in the intensity of the illumination light beams Lb2a and Lb2b irradiated onto the test object A. Note that the half-wave plate 604 does not necessarily have to be provided between the second optical element 603B and the combining unit 605. The half-wave plate 604 may be disposed anywhere between the second light source device 601B and the combining unit 605. For example, the half-wave plate 604 may be disposed between the second optical element 603B and the second light source device 602B. For example, the half-wave plate 604 may be disposed between the convex lens 602a and the concave lens 602b. For example, the half-wave plate 604 may be disposed on the first light source device 601A side. For example, the half-wave plate 604 may be disposed anywhere between the first light source device 601A and the combining unit 605. For example, the half-wave plate 604 may be disposed between the first optical element 603A and the first light source device 601A. For example, the half-wave plate 604 may be disposed between the convex lens 602a and the concave lens 602b. Furthermore, if the polarization directions of the light emitted from the first light source device 601A and the second light source device 601B are different, the half-wave plate does not need to be provided.

 (合成部)
 図5に示すように、合成部605は、光学素子603と投影光学系606との間に設けられる。合成部605は、入射した第1光源装置601Aから照射された照明光Lb1(より詳しくは第1光学素子603Aから出射された照明光Lb1a、Lb1b)と、入射した第2光源装置601Bから照射された照明光Lb2(より詳しくは第2光学素子603Bから出射された照明光Lb2a、Lb2b)とを、合成して、Z方向に出射する。すなわち、合成部605は、照明光Lb1(照明光Lb1a、Lb1b)と照明光Lb2(照明光Lb2a、Lb2b)とを、Z方向に出射する。本実施形態では、合成部605は、Z方向に進行してきた照明光Lb1(照明光Lb1a、Lb1b)を透過してZ方向に出射し、+X方向に進行してきた照明光Lb2(照明光Lb2a、Lb2b)を反射してZ方向に出射する。本実施形態では、合成部605は、偏光ビームスプリッタ(PBS)である。
(Synthesis section)
5, the combining unit 605 is provided between the optical element 603 and the projection optical system 606. The combining unit 605 combines the incident illumination light Lb1 irradiated from the first light source device 601A (more specifically, illumination light Lb1a, Lb1b emitted from the first optical element 603A) and the incident illumination light Lb2 irradiated from the second light source device 601B (more specifically, illumination light Lb2a, Lb2b emitted from the second optical element 603B), and emits the combined light in the Z direction. That is, the combining unit 605 emits the illumination light Lb1 (illumination light Lb1a, Lb1b) and the illumination light Lb2 (illumination light Lb2a, Lb2b) in the Z direction. In this embodiment, the combining unit 605 transmits illumination light Lb1 (illumination light Lb1a, Lb1b) traveling in the Z direction and emits it in the Z direction, and reflects illumination light Lb2 (illumination light Lb2a, Lb2b) traveling in the +X direction and emits it in the Z direction. In this embodiment, the combining unit 605 is a polarizing beam splitter (PBS).

 (投影光学系)
 投影光学系606は、合成部605と載置面STとの間に設けられる。投影光学系606は、合成部605で合成された光を、すなわち合成部605から出射された照明光Lb1a、Lb1b、Lb2a、Lb2bを、載置面ST上の被検物Aに投影する。投影光学系606は、集光部606A、絞り部606B、集光部606C、反射部606D、及び1/2波長板606Eを有する。集光部606A、絞り部606B、集光部606C、反射部606D、及び1/2波長板606Eは、Z方向に並んで配置される。
(Projection optical system)
The projection optical system 606 is provided between the combining unit 605 and the placement surface ST. The projection optical system 606 projects the light combined by the combining unit 605, i.e., the illumination lights Lb1a, Lb1b, Lb2a, and Lb2b emitted from the combining unit 605, onto the test object A on the placement surface ST. The projection optical system 606 has a condenser 606A, an aperture unit 606B, a condenser 606C, a reflector 606D, and a half-wave plate 606E. The condenser 606A, the aperture unit 606B, the condenser 606C, the reflector 606D, and the half-wave plate 606E are arranged side by side in the Z direction.

 集光部606Aは、合成部605から出射された照明光Lb1a、Lb1b、Lb2a、Lb2bを集光して(絞って)、集光された照明光Lb1a、Lb1b、Lb2a、Lb2bをZ方向に出射する。集光部606Aは、例えば凸レンズである。 The light-collecting unit 606A collects (narrows) the illumination light Lb1a, Lb1b, Lb2a, and Lb2b emitted from the combining unit 605, and emits the collected illumination light Lb1a, Lb1b, Lb2a, and Lb2b in the Z direction. The light-collecting unit 606A is, for example, a convex lens.

 絞り部606Bは、集光部606AのZ方向側に配置される。絞り部606Bは、集光部606Aから出射された光の焦点位置に設けられる。絞り部606Bは、集光部606Aから出射された光のうちで、照明光Lb1a、Lb1b、Lb2a、Lb2bのみを透過する。すなわち、絞り部606Bは、照明光Lb1a、Lb1b、Lb2a、Lb2b以外の次数の光を遮断する。絞り部606Bは、照明光Lb1a、Lb1b、Lb2a、Lb2b以外の回折角の光を遮断する。上述のように、回折格子603bにおいては、第1回折光(照明光Lb1a、Lb2a)及び第2回折光(照明光Lb1b、Lb2b)以外の回折光も出射される場合があり、絞り部606Bは、この回折光を遮断して、照明光Lb1a、Lb1b、Lb2a、Lb2bのみを透過する。第1光源装置601Aからの照明光が集光される位置と、第2光源装置601Bからの照明光が集光される位置とが、図5に示すように絞る部606BのY方向において異なる。後述の通り、絞り部606Bからの光は、反射部606Dで反射し、被検物A(載置面ST)に導かれる。絞り部606BにおいてY方向の異なる位置から、第1光源装置601Aからの照明光と、第2光源装置601Bからの照明光が、それぞれ反射部606Dに照射されるので、それぞれの被検物A(載置面ST)への入射角度が異なる。本実施形態においては、回折格子603aと回折格子603bは同じであり、それぞれの明暗パターンの間隔は同じであるものの、第1光源装置601Aからの照明光と、第2光源装置601Bからの照明光との、被検物A(載置面ST)への入射角度が異なるので、被検物Aに照査される明暗パターンの間隔を異ならせることができる。なお、回折格子603aと回折格子603bとで異なる回折格子を用い、絞り部606BのY方向において異なる位置に焦点位置を設けても構わない。また、回折格子603aと回折格子603bとで異なる回折格子を用い、絞り部606BのY方向の同じ位置に焦点位置を設けても構わない。 Aperture section 606B is positioned on the Z-direction side of condenser section 606A. Aperture section 606B is provided at the focal position of the light emitted from condenser section 606A. Aperture section 606B transmits only illumination light Lb1a, Lb1b, Lb2a, and Lb2b out of the light emitted from condenser section 606A. In other words, aperture section 606B blocks light of orders other than illumination light Lb1a, Lb1b, Lb2a, and Lb2b. Aperture section 606B blocks light of diffraction angles other than illumination light Lb1a, Lb1b, Lb2a, and Lb2b. As described above, the diffraction grating 603b may emit diffracted light other than the first diffracted light (illumination light Lb1a, Lb2a) and the second diffracted light (illumination light Lb1b, Lb2b), and the diaphragm unit 606B blocks this diffracted light and transmits only the illumination light Lb1a, Lb1b, Lb2a, and Lb2b. The position where the illumination light from the first light source device 601A is condensed and the position where the illumination light from the second light source device 601B is condensed are different in the Y direction of the diaphragm unit 606B, as shown in FIG. 5 . As will be described later, the light from the diaphragm unit 606B is reflected by the reflector 606D and guided to the test object A (mounting surface ST). The illumination light from the first light source device 601A and the illumination light from the second light source device 601B are irradiated onto the reflector 606D from different positions in the Y direction in the aperture section 606B, resulting in different angles of incidence on the test object A (mounting surface ST). In this embodiment, the diffraction gratings 603a and 603b are the same, and the spacing between their light and dark patterns is the same. However, the angles of incidence on the test object A (mounting surface ST) of the illumination light from the first light source device 601A and the illumination light from the second light source device 601B are different, allowing the spacing between the light and dark patterns irradiated onto the test object A to be different. Different diffraction gratings may be used for the diffraction gratings 603a and 603b, and focal positions may be set at different positions in the Y direction of the aperture section 606B. Different diffraction gratings may be used for the diffraction gratings 603a and 603b, and focal positions may be set at the same position in the Y direction of the aperture section 606B.

 集光部606Cは、絞り部606BのZ方向側に配置される。集光部606Cは、絞り部606Bから出射された照明光Lb1a、Lb1b、Lb2a、Lb2bを集光して(絞って)、集光された照明光Lb1a、Lb1b、Lb2a、Lb2bをZ方向に出射する。集光部606Cは、例えば凸レンズである。 The light-collecting unit 606C is arranged on the Z-direction side of the aperture unit 606B. The light-collecting unit 606C collects (stops down) the illumination light Lb1a, Lb1b, Lb2a, and Lb2b emitted from the aperture unit 606B, and emits the collected illumination light Lb1a, Lb1b, Lb2a, and Lb2b in the Z direction. The light-collecting unit 606C is, for example, a convex lens.

 反射部606Dは、集光部606CのZ方向側に配置される。反射部606Dは、集光部606Cから出射された照明光Lb1a、Lb1b、Lb2a、Lb2bを反射し、照明光Lb1a、Lb1b、Lb2a、Lb2bを被検物A(載置面ST)に導く。反射部606Dは、例えばミラーである。ここで、Z方向に沿って進行する光が反射部606Dで反射された場合の、その反射光の進行方向に沿った軸を、光軸AX5とする。光軸AX5の方向は、反射部606Dの反射面の向きにより決まる。この場合、反射部606Dは、光軸AX5が、第1撮像装置40の光軸AX2(Z方向)に対して傾斜するように、配置される。さらに言えば、光軸AX5は、Z方向に向かうに従って、径方向内側(光軸AX1を軸方向とした場合の径方向内側)に傾斜するように設定される。すなわち、光軸AX1と光軸AX5とのなす角度θ1は、0°より大きく90°未満であることが好ましく、45°以上75°以下であることがより好ましい。 The reflecting unit 606D is arranged on the Z direction side of the focusing unit 606C. The reflecting unit 606D reflects the illumination light Lb1a, Lb1b, Lb2a, and Lb2b emitted from the focusing unit 606C and guides the illumination light Lb1a, Lb1b, Lb2a, and Lb2b to the test object A (mounting surface ST). The reflecting unit 606D is, for example, a mirror. Here, when light traveling along the Z direction is reflected by the reflecting unit 606D, the axis along the traveling direction of the reflected light is defined as the optical axis AX5. The direction of the optical axis AX5 is determined by the orientation of the reflecting surface of the reflecting unit 606D. In this case, the reflecting unit 606D is arranged so that the optical axis AX5 is inclined with respect to the optical axis AX2 (Z direction) of the first imaging device 40. Furthermore, the optical axis AX5 is set so as to tilt radially inward (radially inward when the optical axis AX1 is the axial direction) as it approaches the Z direction. In other words, the angle θ1 between the optical axes AX1 and AX5 is preferably greater than 0° and less than 90°, and more preferably between 45° and 75°.

 (1/2波長板)
 1/2波長板606Eは、集光部606Aと絞り部606Bとの間に設けられる。1/2波長板604は、透過する光の偏光状態を変化させる平板状の光学部材であり、より詳しくは、直線偏光の偏光方向を回転して透過させる。第2光学素子603Bから出射した照明光Lb2a、Lb2bは、1/2波長板604で偏光方向が回転された状態で、1/2波長板606Eから出射される。これにより、照明光Lb2a、Lb2b、照明光Lb1a、Lb1bの散乱光を撮像する場合に、撮像画像におけるそれぞれの散乱光の画像の輝度の差が大きくなることを抑制することができる。ただし、1/2波長板606Eは必須でなく設けなくてもよい。
(1/2 wavelength plate)
The half-wave plate 606E is provided between the focusing unit 606A and the aperture unit 606B. The half-wave plate 604 is a flat optical element that changes the polarization state of transmitted light; more specifically, it rotates the polarization direction of linearly polarized light before transmitting it. The illumination light beams Lb2a and Lb2b emitted from the second optical element 603B are emitted from the half-wave plate 606E with their polarization direction rotated by the half-wave plate 604. This prevents a large difference in brightness between the images of the scattered light beams Lb2a and Lb2b and the scattered light beams Lb1a and Lb1b in the captured image. However, the half-wave plate 606E is not essential and need not be provided.

 (照明光Lb1a、Lb1b、Lb2a、Lb2b)
 投影装置60は、以上のような構成となっている。従って、第1光源装置601Aから出射された照明光Lb1は、第1レンズ群602Aにおいて第1配向方向(X方向)における半値全幅が長くなるように拡げられ、第1光学素子603Aにおいて、照明光Lb1aと照明光Lb1bとに分離される。また、第2光源装置601Bから出射された照明光Lb2は、第2レンズ群602Bにおいて第1配向方向(Z方向)における半値全幅が長くなるように拡げられ、第2光学素子603Bにおいて、照明光Lb2aと照明光Lb2bとに分離される。照明光Lb1a、Lb1bと、照明光Lb2a、Lb2bとは、合成部605で合成されて、Z方向に進行する。Z方向に進行する照明光Lb1a、Lb1b、Lb2a、Lb2bは、集光部606A、絞り部606B、及び集光部606Cを通り、反射部606Dで反射されて、載置面ST上に配置された被検物Aに照射(投影)される。
(Illumination light Lb1a, Lb1b, Lb2a, Lb2b)
The projection device 60 is configured as described above. Accordingly, illumination light Lb1 emitted from the first light source device 601A is expanded by the first lens group 602A so that its full width at half maximum in the first alignment direction (X direction) is increased, and is then separated into illumination light Lb1a and illumination light Lb1b by the first optical element 603A. Furthermore, illumination light Lb2 emitted from the second light source device 601B is expanded by the second lens group 602B so that its full width at half maximum in the first alignment direction (Z direction) is increased, and is then separated into illumination light Lb2a and illumination light Lb2b by the second optical element 603B. The illumination light Lb1a, Lb1b and the illumination light Lb2a, Lb2b are combined by the combining unit 605 and travel in the Z direction. The illumination light Lb1a, Lb1b, Lb2a, and Lb2b traveling in the Z direction pass through the focusing section 606A, the aperture section 606B, and the focusing section 606C, are reflected by the reflecting section 606D, and are irradiated (projected) onto the test object A placed on the mounting surface ST.

 反射部606Dで反射された照明光Lb1a、Lb1bは、合成されて、被検物A上の同じ照射領域に照射される。照明光Lb1a、Lb1bは、互いに干渉することで、被検物A上の同じ照射領域において、X方向に明るさもしくは強度が変化する明暗パターン(縞)を有する構造化照明光として投影される。同様に、反射部606Dで反射された照明光Lb2a、Lb2bは、合成されて、被検物A上の同じ照射領域に照射される。照明光Lb2a、Lb2bは、互いに干渉することで、被検物A上の同じ照射領域において、X方向に明るさもしくは強度が変化する明暗パターンを有する構造化照明光として投影される。被検物Aに投影(照射)された照明光Lb1a、Lb1bの構造化照明光と、照明光Lb2a、Lb2bの構造化照明光とは、被検物Aで散乱されて、鏡筒20の端部20Aから鏡筒20内に入射し、第1撮像装置40に入射される。これにより、第1撮像装置40は、被検物Aに投影された照明光Lb1a、Lb1b(構造化照明光)の像と、被検物Aに投影された照明光Lb2a、Lb2b(構造化照明光)の像とを、撮像する。 The illumination lights Lb1a and Lb1b reflected by the reflecting unit 606D are combined and irradiated onto the same irradiation area on the test object A. The illumination lights Lb1a and Lb1b interfere with each other and are projected onto the same irradiation area on the test object A as structured illumination light having a light-dark pattern (stripes) whose brightness or intensity varies in the X direction. Similarly, the illumination lights Lb2a and Lb2b reflected by the reflecting unit 606D are combined and irradiated onto the same irradiation area on the test object A. The illumination lights Lb2a and Lb2b interfere with each other and are projected onto the same irradiation area on the test object A as structured illumination light having a light-dark pattern whose brightness or intensity varies in the X direction. The structured illumination light of illumination lights Lb1a and Lb1b projected (irradiated) onto the test object A and the structured illumination light of illumination lights Lb2a and Lb2b are scattered by the test object A, enter the lens barrel 20 from the end 20A of the lens barrel 20, and are then incident on the first imaging device 40. As a result, the first imaging device 40 captures an image of the illumination lights Lb1a and Lb1b (structured illumination light) projected onto the test object A and an image of the illumination lights Lb2a and Lb2b (structured illumination light) projected onto the test object A.

 (照射領域)
 次に、投影装置60からの照明光Lbが照射される被検物A(載置面ST)上の照射領域について説明する。図8は、照射領域の一例を説明する模式図である。図8は、Z方向から照射領域を見た場合の例を示している。
(irradiation area)
Next, an explanation will be given of the irradiation area on the test object A (mounting surface ST) that is irradiated with the illumination light Lb from the projection device 60. Fig. 8 is a schematic diagram for explaining an example of the irradiation area. Fig. 8 shows an example of the irradiation area when viewed from the Z direction.

 (1つの投影装置からの照明光の照射領域)
 上述のように、投影装置60は、照明光Lbとしての照明光Lb1a、Lb1bが合成された構造化照明光を、被検物A(載置面ST)上の同じ照射領域に照射し、照明光Lbとしての照明光Lb2a、Lb2bが合成された構造化照明光を、被検物A(載置面ST)上の同じ照射領域に照射する。以下、照明光Lb1a、Lb1bが照射される照射領域(照明光Lb1a、Lb1bの像が投影される領域)を、言い換えれば、第1光学素子603Aの開口OPを透過した照明光Lb1a、Lb1bが照射される照射領域を、照射領域ARAとする。一方、照明光Lb2a、Lb2bが照射される照射領域(照明光Lb2a、Lb2bの像が投影される領域)を、言い換えれば、第2光学素子603Bの開口OPを透過した照明光Lb2a、Lb2bが照射される照射領域を、照射領域ARBとする。照射領域ARAに投影された構造化照明光による明暗パターンの縞の向きは、Y方向(スキャン方向)に対して傾斜している。照射領域ARAに投影された構造化照明光による明暗パターンの縞の向きは、回折格子603aのパターンの向きにより定まる。従って、本実施形態では、回折格子603aのパターンの向きにより、照射領域ARAに投影された構造化照明光による明暗パターンの縞の向きがY方向(スキャン方向)に対して傾斜させる。同様に、照射領域ARBに投影された構造化照明光による明暗パターンの縞の向きは、Y方向に対して傾斜している。本実施形態では、照射領域ARAに投影された構造化照明光による明暗パターンの縞の向きは、照射領域ARBに投影された構造化照明光による明暗パターンの縞の向きに対して傾斜している。
(Illumination area of illumination light from one projection device)
As described above, the projection device 60 irradiates the same irradiation area on the test object A (mounting surface ST) with structured illumination light obtained by combining the illumination lights Lb1a and Lb1b as the illumination light Lb, and irradiates the same irradiation area on the test object A (mounting surface ST) with structured illumination light obtained by combining the illumination lights Lb2a and Lb2b as the illumination light Lb. Hereinafter, the irradiation area irradiated with the illumination lights Lb1a and Lb1b (the area onto which the images of the illumination lights Lb1a and Lb1b are projected), in other words, the irradiation area irradiated with the illumination lights Lb1a and Lb1b that have transmitted through the opening OP of the first optical element 603A, will be referred to as the irradiation area ARA. On the other hand, the illumination area irradiated with the illumination lights Lb2a and Lb2b (the area onto which the images of the illumination lights Lb2a and Lb2b are projected), in other words, the illumination area irradiated with the illumination lights Lb2a and Lb2b that have passed through the opening OP of the second optical element 603B, is referred to as the illumination area ARB. The orientation of the stripes of the light and dark pattern formed by the structured illumination light projected onto the illumination area ARA is inclined with respect to the Y direction (scanning direction). The orientation of the stripes of the light and dark pattern formed by the structured illumination light projected onto the illumination area ARA is determined by the orientation of the pattern of the diffraction grating 603a. Therefore, in this embodiment, the orientation of the stripes of the light and dark pattern formed by the structured illumination light projected onto the illumination area ARA is inclined with respect to the Y direction (scanning direction) depending on the orientation of the pattern of the diffraction grating 603a. Similarly, the orientation of the stripes of the light and dark pattern formed by the structured illumination light projected onto the illumination area ARB is inclined with respect to the Y direction. In this embodiment, the direction of the stripes of the light and dark pattern formed by the structured illumination light projected onto the illumination area ARA is tilted relative to the direction of the stripes of the light and dark pattern formed by the structured illumination light projected onto the illumination area ARB.

 照射領域ARAと照射領域ARBとは、異なる位置にある。言い換えれば、投影装置60は、照射領域ARA(第1照射領域)と、照射領域ARAとは異なる照射領域ARB(第2照射領域)とに、照明光Lbを照射するといえる。本実施形態においては、上述のように、照明光Lb1a、Lb1が透過する第1光学素子603Aの開口OPと、照明光Lb2a、Lb2が透過する第2光学素子603Bの開口OPとが、異なる位置に形成されることで、照射領域ARAと照射領域ARBとも、異なる位置となる。 Illumination area ARA and illumination area ARB are located in different positions. In other words, the projection device 60 irradiates illumination light Lb onto illumination area ARA (first illumination area) and illumination area ARB (second illumination area) different from illumination area ARA. In this embodiment, as described above, the opening OP of the first optical element 603A through which illumination light Lb1a and Lb1 passes and the opening OP of the second optical element 603B through which illumination light Lb2a and Lb2 pass are formed in different positions, so that illumination area ARA and illumination area ARB are also located in different positions.

 より詳しくは、照明光Lb1a、Lb1が透過する第1光学素子603Aの開口OPと、照明光Lb2a、Lb2が透過する第2光学素子603Bの開口OPとは、Y方向において異なる位置にある。従って、照射領域ARAと照射領域ARBとも、Y方向(第1方向;スキャン方向)において、異なる位置となり、言い換えれば、照射領域ARAと照射領域ARBとは、被検物A(載置面ST)上において、Y方向に並ぶ。本実施形態の例では、照射領域ARAの-Y方向側に、照射領域ARBが位置する。さらに言えば、第1光学素子603Aの開口OPと、照明光Lb2a、Lb2が透過する第2光学素子603Bの開口OPとは、Y方向において離れている。従って、照射領域ARAと照射領域ARBとも、被検物A(載置面ST)上において、Y方向に離れた位置に形成される。 More specifically, the opening OP of the first optical element 603A through which the illumination lights Lb1a and Lb1 pass and the opening OP of the second optical element 603B through which the illumination lights Lb2a and Lb2 pass are located at different positions in the Y direction. Therefore, the irradiation areas ARA and ARB are also located at different positions in the Y direction (first direction; scanning direction). In other words, the irradiation areas ARA and ARB are aligned in the Y direction on the test object A (mounting surface ST). In this embodiment, the irradiation area ARB is located on the -Y direction side of the irradiation area ARA. Furthermore, the opening OP of the first optical element 603A and the opening OP of the second optical element 603B through which the illumination lights Lb2a and Lb2 pass are spaced apart in the Y direction. Therefore, the irradiation areas ARA and ARB are formed at positions spaced apart in the Y direction on the test object A (mounting surface ST).

 なお、照射領域ARAと照射領域ARBとを異なる位置としたり離れた位置としたりするための構成は、開口OPの位置をずらすことに限られない。例えば、第1光源装置601Aと第2光源装置601Bとの位置をずらすことなどにより、照射領域ARAと照射領域ARBとを異なる位置としたり離れた位置としたりしてよい。 Note that the configuration for positioning the irradiation areas ARA and ARB at different or distant positions is not limited to shifting the position of the opening OP. For example, the irradiation areas ARA and ARB may be positioned at different or distant positions by shifting the positions of the first light source device 601A and the second light source device 601B.

 このように、照射領域ARAと照射領域ARBとが異なる位置に形成されることで、異なる明暗パターンを被検物A上の異なる領域に同時に投影することができ、被検物Aの3次元形状を適切に測定できる。さらに言えば、照射領域ARAと照射領域ARBとを、スキャン方向であるY方向に異なる位置とすることで、被検物Aの3次元形状を適切に測定できる。さらに言えば、照射領域ARAと照射領域ARBとを、Y方向に離れた位置に設定することで、例えば被検物Aの形状により照射領域ARA、ARBの大きさが変化した場合にも、照射領域ARAと照射領域ARBとが重なることを抑制できる。さらに言えば、投影装置60からの照明光Lbは、被検物A(載置面ST)に対して、第1撮像装置40の光軸AX2から傾斜した方向で照射される。これにより、照明光Lbがぼけてしまい、照射領域ARA及び照射領域ARBが想定より大きくなる可能性がある。それに対して、照射領域ARAと照射領域ARBとを、Y方向に離れた位置に設定することで、照射領域ARAと照射領域ARBとが重なることを抑制できる。 In this way, by forming the irradiation areas ARA and ARB at different positions, different light and dark patterns can be simultaneously projected onto different areas on the test object A, allowing the three-dimensional shape of the test object A to be properly measured. Furthermore, by positioning the irradiation areas ARA and ARB at different positions in the Y direction, which is the scanning direction, the three-dimensional shape of the test object A can be properly measured. Furthermore, by setting the irradiation areas ARA and ARB at positions separated in the Y direction, overlap between the irradiation areas ARA and ARB can be prevented, even if the sizes of the irradiation areas ARA and ARB change depending on the shape of the test object A, for example. Furthermore, the illumination light Lb from the projection device 60 is irradiated onto the test object A (mounting surface ST) in a direction tilted from the optical axis AX2 of the first imaging device 40. This can cause the illumination light Lb to be blurred, potentially resulting in the irradiation areas ARA and ARB becoming larger than expected. In response to this, by setting the irradiation areas ARA and ARB at positions separated in the Y direction, it is possible to prevent the irradiation areas ARA and ARB from overlapping.

 ここで、照射領域ARAは、Y方向における長さD1Aよりも、X方向における長さD2Aの方が長い。同様に、照射領域ARBは、Y方向における長さD1Bよりも、X方向における長さD2Bの方が長い。すなわち、照射領域ARA、ARBは、Y方向よりもX方向に長い横長の形状となっている。図8の例では、照射領域ARA、ARBは、照明光Lbの像が投影される被検物A(載置面ST)の表面がZ方向に垂直な平面である場合に、X方向に長い長方形となっているが、それに限られず、長方形に限られず、楕円形、長方形の角が曲線となる形状、多角形など、任意の形状であってよい。このように、照射領域ARA、ARBをY方向(スキャン方向)に短くすることで、フレームレートを適切な範囲に保ちつつ被検物Aの3次元形状を高精度に測定できる。また、照射領域ARA、ARBをX方向に長くすることで、1回の照明光Lbの照射で広い領域の3次元形状を測定できる。 Here, the length D2A of the irradiation area ARA in the X direction is longer than the length D1A in the Y direction. Similarly, the length D2B of the irradiation area ARB in the X direction is longer than the length D1B in the Y direction. That is, the irradiation areas ARA and ARB have a horizontally elongated shape that is longer in the X direction than in the Y direction. In the example of FIG. 8, the irradiation areas ARA and ARB are rectangular with their long sides in the X direction when the surface of the test object A (mounting surface ST) onto which the image of the illumination light Lb is projected is a plane perpendicular to the Z direction. However, this is not limited to rectangular shapes, and they may be any shape, such as an ellipse, a rectangle with curved corners, or a polygon. In this way, by shortening the irradiation areas ARA and ARB in the Y direction (scanning direction), the three-dimensional shape of the test object A can be measured with high accuracy while maintaining the frame rate within an appropriate range. Furthermore, by lengthening the irradiation areas ARA and ARB in the X direction, the three-dimensional shape of a wide area can be measured with a single irradiation of the illumination light Lb.

 本実施形態では、被検物A(載置面ST)の表面がZ方向に垂直な平面である場合における、照射領域ARAの長さD2Aと照射領域ARBの長さD2Bとは、同じとなっている。同様に、被検物A(載置面ST)の表面がZ方向に垂直な平面である場合における、照射領域ARAの長さD1Aと照射領域ARBの長さD1Bとは、同じとなっている。このように照射領域ARA、ARBのX方向及びY方向の長さが同じであることで、被検物Aの形状を適切に算出できる。ただしそれに限られず、長さD2Aと長さD2Bとを異ならせてもよいし、長さD1Aと長さD1Bとを異ならせてもよい。 In this embodiment, when the surface of the test object A (mounting surface ST) is a plane perpendicular to the Z direction, the length D2A of the irradiation area ARA and the length D2B of the irradiation area ARB are the same. Similarly, when the surface of the test object A (mounting surface ST) is a plane perpendicular to the Z direction, the length D1A of the irradiation area ARA and the length D1B of the irradiation area ARB are the same. In this way, the lengths of the irradiation areas ARA and ARB in the X and Y directions are the same, so that the shape of the test object A can be calculated appropriately. However, this is not limited to this, and the length D2A and the length D2B may be different, or the length D1A and the length D1B may be different.

 また、Y方向における、照射領域ARAと照射領域ARBとの間の距離を距離D3Aとする。この場合、距離D3Aは、照射領域ARA、ARBの長さD2A、D2Bよりも短い。また、距離D3Aは、照射領域ARA、ARBの長さD1A、D1Bよりも短い。このように距離D3Aの長さを短くすることで、1回の照明光の照射における、複数の照射領域の全体がY方向に長くなり過ぎることを抑制して、フレームレートを適切な範囲に保ちつつ被検物Aの3次元形状を高精度に測定できる。 Furthermore, the distance in the Y direction between irradiation area ARA and irradiation area ARB is distance D3A. In this case, distance D3A is shorter than the lengths D2A and D2B of irradiation areas ARA and ARB. Distance D3A is also shorter than the lengths D1A and D1B of irradiation areas ARA and ARB. By shortening the length of distance D3A in this way, it is possible to prevent the total length of multiple irradiation areas in a single irradiation of illumination light from becoming too long in the Y direction, and the three-dimensional shape of test object A can be measured with high accuracy while maintaining the frame rate within an appropriate range.

 (複数の投影装置からの照明光の照射領域)
 上述のように、本実施形態においては、投影装置60として、第1投影装置60aと第2投影装置60bとが設けられている。第1投影装置60aと第2投影装置60bは、被検物A(載置面ST)に対して、互いに異なる方向から照明光を照射する。本実施形態では、第1投影装置60aは、鏡筒20(第1撮像装置40の光軸AX2)の+X方向側に設けられ、被検物A(載置面ST)に対して、+X方向側から照明光を照射する。一方、第2投影装置60bは、鏡筒20(第1撮像装置40の光軸AX2)の-X方向側に設けられ、被検物A(載置面ST)に対して、-X方向側から照明光を照射する。
(Illumination area of illumination light from multiple projection devices)
As described above, in this embodiment, the projection device 60 includes a first projection device 60a and a second projection device 60b. The first projection device 60a and the second projection device 60b irradiate the test object A (mounting surface ST) with illumination light from different directions. In this embodiment, the first projection device 60a is provided on the +X direction side of the lens barrel 20 (the optical axis AX2 of the first image pickup device 40) and irradiates the test object A (mounting surface ST) with illumination light from the +X direction side. On the other hand, the second projection device 60b is provided on the −X direction side of the lens barrel 20 (the optical axis AX2 of the first image pickup device 40) and irradiates the test object A (mounting surface ST) with illumination light from the −X direction side.

 第1投影装置60aから照射された照明光Lb(構造化照明光)の照射領域と、第2投影装置60bから照射された照明光Lb(構造化照明光)の照射領域とは、異なる位置にある。言い換えれば、投影装置60は、第1照射領域に照明光Lbを投影する第1投影装置60aと、第1照射領域とは異なる第2照射領域に照明光Lbを投影する第2投影装置60bと、を有する。本実施形態においては、第1投影装置60aと第2投影装置60bとが異なる位置に配置されることで、第1投影装置60aの照射領域と第2投影装置60bの照射領域とが異なる位置となる。 The irradiation area of the illumination light Lb (structured illumination light) emitted from the first projection device 60a and the irradiation area of the illumination light Lb (structured illumination light) emitted from the second projection device 60b are located in different positions. In other words, the projection device 60 has a first projection device 60a that projects illumination light Lb onto a first irradiation area, and a second projection device 60b that projects illumination light Lb onto a second irradiation area different from the first irradiation area. In this embodiment, the first projection device 60a and the second projection device 60b are arranged in different positions, so that the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b are located in different positions.

 より詳しくは、第1投影装置60aと第2投影装置60bとは、Y方向において異なる位置にある。従って、第1投影装置60aの照射領域と第2投影装置60bの照射領域とも、Y方向(第1方向;スキャン方向)において異なる位置となり、言い換えれば、第1投影装置60aの照射領域と第2投影装置60bの照射領域とは、被検物A(載置面ST)上において、Y方向に並ぶ。本実施形態の例では、第1投影装置60aの照射領域の-Y方向側に、第2投影装置60bの照射領域が位置する。さらに言えば、第1投影装置60aの照射領域と第2投影装置60bの照射領域とは、被検物A(載置面ST)上において、Y方向に離れた位置に形成される。 More specifically, the first projection device 60a and the second projection device 60b are located at different positions in the Y direction. Therefore, the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b are also located at different positions in the Y direction (first direction; scanning direction). In other words, the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b are aligned in the Y direction on the test object A (mounting surface ST). In this embodiment, the irradiation area of the second projection device 60b is located on the -Y direction side of the irradiation area of the first projection device 60a. Furthermore, the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b are formed at positions separated in the Y direction on the test object A (mounting surface ST).

 なお、第1投影装置60aの照射領域と第2投影装置60bの照射領域とを異なる位置としたり離れた位置としたりするための構成は、第1投影装置60aの位置と第2投影装置60bの位置をずらすことに限られない。例えば、第1投影装置60aの光学素子603の開口OPと第2投影装置60bの光学素子603の開口OPとの位置をずらしたり、第1投影装置60aの光源装置601と第2投影装置60bの光源装置601との位置をずらしたりすることで、第1投影装置60aの照射領域と第2投影装置60bの照射領域とを異なる位置離れた位置としたりしてよい。 Note that the configuration for positioning the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b at different or distant positions is not limited to shifting the positions of the first projection device 60a and the second projection device 60b. For example, the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b may be positioned at different or distant positions by shifting the position of the opening OP of the optical element 603 of the first projection device 60a and the opening OP of the optical element 603 of the second projection device 60b, or by shifting the position of the light source device 601 of the first projection device 60a and the light source device 601 of the second projection device 60b.

 このように、異なる方向から照明光Lbを照射する第1投影装置60a及び第2投影装置60bを設けることで、例えば第1投影装置60aからの照明光Lbが、被検物Aの一部分に遮られて、被検物Aの他の部分に投影されない場合でも、その部分に第2投影装置60bからの照明光Lbを投影できるため、三次元形状を適切に測定できる。さらに、第1投影装置60aの照射領域と第2投影装置60bの照射領域を異なる位置とすることで、異なる方向から投影された照明光Lbを被検物A上の異なる領域に同時に投影することができ、被検物Aの3次元形状を適切に測定できる。さらに言えば、第1投影装置60aの照射領域と第2投影装置60bの照射領域とを、スキャン方向であるY方向に異なる位置とすることで、被検物Aの3次元形状を適切に測定できる。さらに言えば、第1投影装置60aの照射領域と第2投影装置60bの照射領域とを、Y方向に離れた位置に設定することで、照射領域ARAと照射領域ARBとが重なることを抑制できる。 In this way, by providing the first projection device 60a and the second projection device 60b that irradiate illumination light Lb from different directions, even if, for example, the illumination light Lb from the first projection device 60a is blocked by a portion of the test object A and is not projected onto another portion of the test object A, the illumination light Lb from the second projection device 60b can be projected onto that portion, allowing for appropriate measurement of the three-dimensional shape. Furthermore, by positioning the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b at different positions, the illumination light Lb projected from different directions can be simultaneously projected onto different areas on the test object A, allowing for appropriate measurement of the three-dimensional shape of the test object A. Furthermore, by positioning the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b at different positions in the Y direction, which is the scanning direction, the three-dimensional shape of the test object A can be appropriately measured. Furthermore, by setting the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b at positions separated in the Y direction, it is possible to prevent the irradiation area ARA and the irradiation area ARB from overlapping.

 本実施形態では、照明光Lbの像が投影される被検物A(載置面ST)の表面がZ方向に垂直な平面である場合における、第1投影装置60aの照射領域と第2投影装置60bの照射領域との、X方向における長さ(長さD2A同士、及び長さD2B同士)は、同じとなっている。同様に、被検物A(載置面ST)の表面がZ方向に垂直な平面である場合における、第1投影装置60aの照射領域と第2投影装置60bの照射領域との、Y方向における長さ(長さD1A同士、及び長さD1B同士)は、同じとなっている。このように第1投影装置60aの照射領域と第2投影装置60bの照射領域とのX方向及びY方向の長さが同じであることで、被検物Aの形状を適切に算出できる。ただしそれに限られず、照射領域同士のX方向における長さやY方向における長さを、異ならせてもよい。 In this embodiment, when the surface of the test object A (mounting surface ST) onto which the image of the illumination light Lb is projected is a plane perpendicular to the Z direction, the lengths in the X direction of the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b (lengths D2A and D2B) are the same. Similarly, when the surface of the test object A (mounting surface ST) is a plane perpendicular to the Z direction, the lengths in the Y direction of the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b (lengths D1A and D1B) are the same. In this way, the lengths in the X direction and the Y direction of the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b are the same, so that the shape of the test object A can be appropriately calculated. However, this is not limited to this, and the lengths in the X direction and the Y direction of the irradiation areas may be different.

 また、Y方向における、第1投影装置60aの照射領域と第2投影装置60bの照射領域との間の距離(第1投影装置60aの照射領域ARAaと第2投影装置60bの照射領域ARAbとの間の距離、及び、第1投影装置60aの照射領域ARBaと第2投影装置60bの照射領域ARBbとの間の距離)を、距離D3Bとする。この場合、距離D3Bは、第1投影装置60a及び第2投影装置60bの照射領域のX方向における長さよりも、短い。また、距離D3Bは、第1投影装置60a及び第2投影装置60bの照射領域のY方向における長さよりも、短い。このように距離D3Bの長さを短くすることで、1回の照明光の照射における、複数の照射領域の全体がY方向に長くなり過ぎることを抑制して、フレームレートを適切な範囲に保ちつつ被検物Aの3次元形状を高精度に測定できる。 Furthermore, the distance in the Y direction between the irradiation area of the first projection device 60a and the irradiation area of the second projection device 60b (the distance between the irradiation area ARAa of the first projection device 60a and the irradiation area ARAb of the second projection device 60b, and the distance between the irradiation area ARBa of the first projection device 60a and the irradiation area ARBb of the second projection device 60b) is defined as distance D3B. In this case, distance D3B is shorter than the length in the X direction of the irradiation areas of the first projection device 60a and the second projection device 60b. Distance D3B is also shorter than the length in the Y direction of the irradiation areas of the first projection device 60a and the second projection device 60b. By shortening the length of distance D3B in this way, it is possible to prevent the total length of multiple irradiation areas in a single irradiation of illumination light from becoming too long in the Y direction, and the three-dimensional shape of test object A can be measured with high accuracy while maintaining the frame rate within an appropriate range.

 本実施形態においては、第1投影装置60a及び第2投影装置60bのそれぞれが、照射領域ARA及び照射領域ARBに照明光を投影する。すなわち、第1投影装置60aは、照明光Lb1a、Lb1bの像を照射領域ARAaに投影し、照明光Lb2a、Lb2bの像を照射領域ARBaに投影する。同様に、第2投影装置60bは、照明光Lb1a、Lb1bの像を照射領域ARAbに投影し、照明光Lb2a、Lb2bの像を照射領域ARBbに投影する。照射領域ARAa、照射領域ARBa、照射領域ARAb、及び照射領域ARBbは、Y方向に並び、互いにY方向において離れて位置している。本実施形態の例では、-Y方向に向けて、照射領域ARAa、照射領域ARBa、照射領域ARAb、及び照射領域ARBbの順で並んでいる。本実施形態においては、照射領域ARAa、照射領域ARBa、照射領域ARAb、及び照射領域ARBbは、Z方向から見て、第1撮像装置40の光軸AX2と重ならない位置にある。より詳しくは、Z方向から見て、照射領域ARBaと照射領域ARAbとの間に、光軸AX2が位置する。これにより、光軸AX2を中心に各照射領域を均等に配置できるため、各照射領域を適切に撮像できる。なお、本実施形態では、-Y方向に向けて、照射領域ARAa、照射領域ARBa、照射領域ARAb、及び照射領域ARBbの順で並んでいるが、これに限られない。例えば、-Y方向に向けて、照射領域ARAa、照射領域ARBa、照射領域ARBb、照射領域ARAbの順でも構わない。 In this embodiment, the first projection device 60a and the second projection device 60b each project illumination light onto the irradiation area ARA and the irradiation area ARB. That is, the first projection device 60a projects an image of illumination light Lb1a and Lb1b onto the irradiation area ARAa, and projects an image of illumination light Lb2a and Lb2b onto the irradiation area ARBa. Similarly, the second projection device 60b projects an image of illumination light Lb1a and Lb1b onto the irradiation area ARAb, and projects an image of illumination light Lb2a and Lb2b onto the irradiation area ARBb. The illumination areas ARAa, ARBa, ARAb, and ARBb are aligned in the Y direction and are spaced apart from each other in the Y direction. In this embodiment, the irradiation areas ARAa, ARBa, ARAb, and ARBb are arranged in this order in the -Y direction. In this embodiment, the irradiation areas ARAa, ARBa, ARAb, and ARBb are positioned so as not to overlap with the optical axis AX2 of the first imaging device 40 when viewed from the Z direction. More specifically, the optical axis AX2 is located between the irradiation areas ARBa and ARAb when viewed from the Z direction. This allows each irradiation area to be evenly arranged around the optical axis AX2, so that each irradiation area can be properly imaged. Note that, in this embodiment, the irradiation areas ARAa, ARBa, ARAb, and ARBb are arranged in this order in the -Y direction, but this is not limited thereto. For example, the order in the -Y direction may be irradiation area ARAa, irradiation area ARBa, irradiation area ARBb, and irradiation area ARAb.

 また、投影装置60により1回の照射により照明光Lbが投影される全ての照射領域を含む領域のY方向における長さを、長さD4とする。この場合、長さD4は、照射領域のX方向における長さ(本実施形態では長さD2A、D2B)よりも、短い。これにより、照射領域の全域がY方向に長くなり過ぎることを抑制して、フレームレートを適切な範囲に保ちつつ被検物Aの3次元形状を高精度に測定できる。なお、長さD4は、最も-Y方向に位置する照射領域の最も-Y方向側の端部から、最も+Y方向に位置する照射領域の最も+Y方向側の端部までの、Y方向における長さを指す。すなわち本実施形態では、長さD4は、照射領域ARBbの最も-Y方向側の端部から、照射領域ARAaの最も+Y方向側の端部までの、長さを指す。 Furthermore, the length in the Y direction of the area including all of the irradiation areas onto which illumination light Lb is projected by the projection device 60 in a single irradiation is defined as length D4. In this case, length D4 is shorter than the length in the X direction of the irradiation area (lengths D2A and D2B in this embodiment). This prevents the entire irradiation area from becoming too long in the Y direction, allowing the three-dimensional shape of test object A to be measured with high accuracy while maintaining the frame rate within an appropriate range. Note that length D4 refers to the length in the Y direction from the end of the irradiation area located furthest in the -Y direction on the -Y side to the end of the irradiation area located furthest in the +Y direction on the +Y side. That is, in this embodiment, length D4 refers to the length from the end of irradiation area ARBb furthest in the -Y direction to the end of irradiation area ARAa furthest in the +Y direction on the +Y side.

 ここで、第1撮像装置40の撮像領域を、撮像領域AR0とする。撮像領域AR0は、1回の撮像で第1撮像装置40によって撮像される範囲(撮像範囲)である。この場合、投影装置60により1回の照射により照明光Lbが投影される全ての照射領域は、撮像領域AR0内に位置する。すなわち本実施形態では、照射領域ARAa、照射領域ARBa、照射領域ARAb、及び照射領域ARBbの全域が、撮像領域AR0内に位置している。本実施形態においては、被検物A(載置面ST)の表面がZ方向に垂直な平面である場合における、撮像領域AR0のX方向における長さは、投影装置60の照射領域のX方向における長さ(本実施形態では長さD2A、D2B)と同じである。また、被検物A(載置面ST)の表面がZ方向に垂直な平面である場合における、長さD4は、撮像領域AR0のY方向における長さD5よりも、短い。このように撮像領域AR0を設定することで、1回の撮像で全ての照射領域を適切に撮像できる。また、第1撮像装置40としてラインセンサではなくエリアセンサを用いることが可能となる。 Here, the imaging area of the first imaging device 40 is referred to as imaging area AR0. The imaging area AR0 is the range (imaging range) imaged by the first imaging device 40 in one imaging. In this case, all of the irradiation areas onto which the illumination light Lb is projected by the projection device 60 in one irradiation are located within the imaging area AR0. That is, in this embodiment, the entire irradiation areas ARAa, ARBa, ARAb, and ARBb are located within the imaging area AR0. In this embodiment, when the surface of the test object A (mounting surface ST) is a plane perpendicular to the Z direction, the length of the imaging area AR0 in the X direction is the same as the length of the irradiation area of the projection device 60 in the X direction (lengths D2A and D2B in this embodiment). Furthermore, when the surface of the test object A (mounting surface ST) is a plane perpendicular to the Z direction, the length D4 is shorter than the length D5 of the imaging area AR0 in the Y direction. By setting the imaging area AR0 in this way, it is possible to properly capture the entire irradiation area in a single imaging session. It is also possible to use an area sensor instead of a line sensor as the first imaging device 40.

 なお、本実施形態では、第2撮像装置30の撮像領域は、第1撮像装置40の撮像領域AR0と一致しているが、それに限られない。例えば、第2撮像装置30の撮像領域の一部が、第1撮像装置40の撮像領域AR0の外側に位置していてもよいし、第1撮像装置40の撮像領域AR0の一部が、第2撮像装置30の撮像領域の外側に位置していてもよい。 Note that in this embodiment, the imaging area of the second imaging device 30 coincides with the imaging area AR0 of the first imaging device 40, but this is not limited to this. For example, part of the imaging area of the second imaging device 30 may be located outside the imaging area AR0 of the first imaging device 40, or part of the imaging area AR0 of the first imaging device 40 may be located outside the imaging area of the second imaging device 30.

 以上のように、本実施形態では、第1投影装置60a及び第2投影装置60bのそれぞれが、照射領域ARA及び照射領域ARBに照明光を投影するが、それに限られない。例えば、第1投影装置60a及び第2投影装置60bが、照射領域ARA及び照射領域ARBの一方のみに対して、照明光を投影してもよい。また、1つの投影装置60のみを設け、1つの投影装置60に、照射領域ARA及び照射領域ARBへ照明光を投影させてもよい。 As described above, in this embodiment, the first projection device 60a and the second projection device 60b each project illumination light onto the irradiation area ARA and the irradiation area ARB, but this is not limited to this. For example, the first projection device 60a and the second projection device 60b may project illumination light onto only one of the irradiation area ARA and the irradiation area ARB. Alternatively, only one projection device 60 may be provided, and the single projection device 60 may project illumination light onto the irradiation area ARA and the irradiation area ARB.

 (形状測定システムのシステム構成)
 次に、形状測定システム1のシステム構成と、演算装置19の機能について説明する。図9は、本実施形態に係る形状システムのブロック図であり、図10は、本実施形態に係る演算装置の機能ブロック図である。図9に示すように、本実施形態に係る形状測定システム1は、上述のように、撮像ユニット11、支持装置12、操作装置13、表示装置14、駆動装置15、メモリ17、通信装置18、演算装置19、及び投影装置60を有する。
(System configuration of shape measurement system)
Next, the system configuration of the shape measurement system 1 and the function of the arithmetic device 19 will be described. Fig. 9 is a block diagram of the shape system according to this embodiment, and Fig. 10 is a functional block diagram of the arithmetic device according to this embodiment. As shown in Fig. 9, the shape measurement system 1 according to this embodiment includes the imaging unit 11, the support device 12, the operation device 13, the display device 14, the drive device 15, the memory 17, the communication device 18, the arithmetic device 19, and the projection device 60, as described above.

 (演算装置)
 演算装置19は、第1撮像装置40で撮像される第1照射領域の像及び第2照射領域の像に基づいて、被検物Aの形状を算出する。本実施形態では、第1照射領域及び第2照射領域には、明暗パターンを有する照明光Lbの像が投影されるため、演算装置19は、第1撮像装置40で撮像された照明光Lbの像を用いて、位相シフト法により、被検物Aの三次元形状を算出する。
(computing device)
The calculation device 19 calculates the shape of the test object A based on the image of the first irradiation area and the image of the second irradiation area captured by the first imaging device 40. In this embodiment, since an image of the illumination light Lb having a light and dark pattern is projected onto the first irradiation area and the second irradiation area, the calculation device 19 calculates the three-dimensional shape of the test object A by a phase shift method using the image of the illumination light Lb captured by the first imaging device 40.

 演算装置19は、少なくとも一つのプロセッサ(つまり、一つのプロセッサ又は複数のプロセッサ)をハードウェアとして含む。プロセッサは、例えば、ノイマン型のコンピュータアーキテクチャに準拠したプロセッサを含んでいてもよい。ノイマン型のコンピュータアーキテクチャに準拠したプロセッサは、CPU(Central Processing Unit)及びGPU(Graphics Processing Unit)の少なくとも一つを含んでいてもよい。プロセッサは、例えば、非ノイマン型のコンピュータアーキテクチャに準拠したプロセッサを含んでいてもよい。非ノイマン型のコンピュータアーキテクチャに準拠したプロセッサは、FPGA(Field Programmable Gate Array)及びASIC(Application Specific Circuit)のうちの少なくとも一つを含んでいてもよい。プロセッサは、回路群(circuity)と称されてもよい。 The arithmetic device 19 includes at least one processor (i.e., one processor or multiple processors) as hardware. The processor may include, for example, a processor conforming to a von Neumann computer architecture. A processor conforming to a von Neumann computer architecture may include at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The processor may include, for example, a processor conforming to a non-von Neumann computer architecture. A processor conforming to a non-von Neumann computer architecture may include at least one of an FPGA (Field Programmable Gate Array) and an ASIC (Application Specific Circuit). A processor may also be referred to as a group of circuits.

 演算装置19は、コンピュータプログラムコード及びコンピュータプログラム指令の少なくとも一つを含むコンピュータプログラム171を読み込む。例えば、演算装置19は、メモリ17が記憶しているコンピュータプログラム171を読み込んでもよい。例えば、演算装置19は、コンピュータで読み取り可能であって且つ一時的でない記録媒体が記憶しているコンピュータプログラム171を、形状測定システム1が備える図示しない記録媒体読み取り装置を用いて読み込んでもよい。記録媒体から読み取られたコンピュータプログラム171は、メモリ17に記憶されてもよい。演算装置19は、通信装置18(或いは、その他の通信装置)を介して、形状測定システム1の外部に配置される不図示の装置からコンピュータプログラム171を取得してもよい(つまり、ダウンロードしてもよい又は読み込んでもよい)。ダウンロードされたコンピュータプログラム171は、メモリ17に記憶されてもよい。 The arithmetic unit 19 reads a computer program 171 including at least one of computer program code and computer program instructions. For example, the arithmetic unit 19 may read the computer program 171 stored in the memory 17. For example, the arithmetic unit 19 may read the computer program 171 stored in a computer-readable, non-transitory recording medium using a recording medium reading device (not shown) provided in the shape measurement system 1. The computer program 171 read from the recording medium may be stored in the memory 17. The arithmetic unit 19 may acquire (i.e., download or read) the computer program 171 from a device (not shown) located outside the shape measurement system 1 via the communication device 18 (or another communication device). The downloaded computer program 171 may be stored in the memory 17.

 演算装置19は、読み込んだコンピュータプログラム171を実行する。その結果、演算装置19内には、形状測定システム1が行うべき処理(例えば後述の被検物Aの三次元形状を算出する処理)を実行するための論理的な機能ブロックが実現される。言い換えれば、演算装置19は、コンピュータプログラム171が記録されたメモリ17等と共に(言い換えれば、メモリ17とメモリ17等に記録されたコンピュータプログラム171と共に)、形状測定システム1が行うべき処理を実行するための論理的な機能ブロックを実現するためのコントローラ又はコンピュータとして機能可能である。つまり、演算装置31が備える少なくとも一つのプロセッサと共に、メモリ17等が備え(例えば後述の被検物Aの三次元形状を算出する処理)を形状測定システム1が行うように構成されている。 The arithmetic unit 19 executes the loaded computer program 171. As a result, logical functional blocks are realized within the arithmetic unit 19 for executing the processing to be performed by the shape measurement system 1 (for example, the processing to calculate the three-dimensional shape of the test object A described below). In other words, the arithmetic unit 19, together with the memory 17 etc. in which the computer program 171 is recorded (in other words, together with the memory 17 and the computer program 171 recorded in the memory 17 etc.), can function as a controller or computer for realizing logical functional blocks for executing the processing to be performed by the shape measurement system 1. In other words, the shape measurement system 1 is configured to perform the processing (for example, the processing to calculate the three-dimensional shape of the test object A described below) provided by the memory 17 etc. together with at least one processor provided in the arithmetic unit 31.

 メモリ17は、所望のデータを記憶可能な少なくとも一つのメモリを含む。言い換えれば、メモリ17は、所望のデータを含む少なくとも一つのメモリを含む。例えば、メモリ17は、演算装置19が実行するコンピュータプログラム171を記憶していてもよい。この場合、メモリ17は、演算装置19が実行するコンピュータプログラム171を記録する上述した記録媒体として用いられてもよい。メモリ17は、演算装置19がコンピュータプログラム171を実行している場合に演算装置19が一時的に使用するデータを一時的に記憶してもよい。メモリ17は、形状測定システム1が長期的に保存するデータを記憶してもよい。尚、メモリ17は、RAM(Random Access Memory)、ROM(Read Only Memory)、ハードディスク装置、光磁気ディスク装置、SSD(Solid State Drive)及びディスクアレイ装置のうちの少なくとも一つを含んでいてもよい。つまり、メモリ17は、一時的でない記録媒体を含んでいてもよい。 Memory 17 includes at least one memory capable of storing desired data. In other words, memory 17 includes at least one memory containing desired data. For example, memory 17 may store computer program 171 executed by calculation device 19. In this case, memory 17 may be used as the above-mentioned recording medium for recording computer program 171 executed by calculation device 19. Memory 17 may temporarily store data used by calculation device 19 when calculation device 19 is executing computer program 171. Memory 17 may also store data that shape measurement system 1 stores long-term. Note that memory 17 may include at least one of RAM (Random Access Memory), ROM (Read Only Memory), a hard disk device, a magneto-optical disk device, an SSD (Solid State Drive), and a disk array device. In other words, memory 17 may include a non-temporary recording medium.

 図10に示すように、演算装置19は、駆動制御部191と、照射制御部192と、撮像制御部193と、合成部194と、推定部195とを含む。演算装置19は、メモリ17からコンピュータプログラム171(ソフトウェア)を読み出して実行することで、駆動制御部191と照射制御部192と撮像制御部193と合成部194と推定部195とを実現して、それらの処理を実行する。すなわち、駆動制御部191と、照射制御部192と、撮像制御部193と、合成部194と、推定部195とは、形状測定システム1が行うべき処理(例えば後述の被検物Aの三次元形状を算出する処理)を実行するための論理的な機能ブロックである。なお、演算装置19は、1つのCPUによってこれらの処理を実行してもよいし、複数のCPUを備えて、それらの複数のCPUで、処理を実行してもよい。また、駆動制御部191と照射制御部192と撮像制御部193と合成部194と推定部195との少なくとも一部を、ハードウェアで実現してもよい。すなわち、駆動制御部191をハードウェアで実現する場合、駆動制御部191を駆動制御装置と呼ぶことができ、照射制御部192をハードウェアで実現する場合、照射制御部192を照射制御装置と呼ぶことができ、撮像制御部193をハードウェアで実現する場合、撮像制御部193を撮像制御装置と呼ぶことができ、合成部194をハードウェアで実現する場合、合成部194を合成装置と呼ぶことができ、推定部195をハードウェアで実現する場合、推定部195を推定装置と呼ぶことができる。 As shown in FIG. 10, the arithmetic device 19 includes a drive control unit 191, an irradiation control unit 192, an imaging control unit 193, a synthesis unit 194, and an estimation unit 195. The arithmetic device 19 realizes the drive control unit 191, the irradiation control unit 192, the imaging control unit 193, the synthesis unit 194, and the estimation unit 195 by reading and executing a computer program 171 (software) from the memory 17. In other words, the drive control unit 191, the irradiation control unit 192, the imaging control unit 193, the synthesis unit 194, and the estimation unit 195 are logical functional blocks for executing the processing to be performed by the shape measurement system 1 (for example, the processing to calculate the three-dimensional shape of the test object A described below). The arithmetic device 19 may execute these processes using a single CPU, or may be equipped with multiple CPUs and execute the processing using the multiple CPUs. Furthermore, at least some of the drive control unit 191, the irradiation control unit 192, the imaging control unit 193, the synthesis unit 194, and the estimation unit 195 may be implemented in hardware. That is, when the drive control unit 191 is implemented in hardware, the drive control unit 191 can be called a drive control device; when the irradiation control unit 192 is implemented in hardware, the irradiation control unit 192 can be called an irradiation control device; when the imaging control unit 193 is implemented in hardware, the imaging control unit 193 can be called an imaging control device; when the synthesis unit 194 is implemented in hardware, the synthesis unit 194 can be called a synthesis device; and when the estimation unit 195 is implemented in hardware, the estimation unit 195 can be called an estimation device.

 駆動制御部191は、駆動装置15を制御して、駆動装置15により、撮像ユニット11を、被検物A(載置面ST)に対して相対移動させる。照射制御部192は、照明装置50を制御して、照明装置50に照明光Laを照射させる。照射制御部192は、落射照明装置70を制御して、落射照明装置70に照明光Laを照射させる。照射制御部192は、投影装置60を制御して、投影装置60に照明光Lbを照射させる。撮像制御部193は、第1撮像装置40を制御して、投影装置60によって被検物A上の照射領域に投影された照明光Lbの像を、第1撮像装置40に撮像させる。撮像制御部193は、第2撮像装置30を制御して、被検物Aを第2撮像装置30に撮像させる。合成部194は、第2撮像装置30が撮像した撮像画像に基づいて、被検物Aの形状(2次元形状)を算出する。推定部195は、第1撮像装置40が撮像した照射領域に投影された照明光Lbの像に基づき、被検物Aの形状(3次元形状)を算出する。 The drive control unit 191 controls the drive device 15, which causes the drive device 15 to move the imaging unit 11 relative to the test object A (mounting surface ST). The irradiation control unit 192 controls the illumination device 50 to cause the illumination device 50 to emit illumination light La. The irradiation control unit 192 controls the epi-illumination device 70 to cause the epi-illumination device 70 to emit illumination light La. The irradiation control unit 192 controls the projection device 60 to cause the projection device 60 to emit illumination light Lb. The imaging control unit 193 controls the first imaging device 40 to cause the first imaging device 40 to capture an image of the illumination light Lb projected by the projection device 60 onto the irradiation area on the test object A. The imaging control unit 193 controls the second imaging device 30 to cause the second imaging device 30 to capture an image of the test object A. The synthesis unit 194 calculates the shape (two-dimensional shape) of the test object A based on the image captured by the second imaging device 30. The estimation unit 195 calculates the shape (three-dimensional shape) of the test object A based on the image of the illumination light Lb projected onto the irradiation area captured by the first imaging device 40.

 以上のように、本実施形態では、演算装置19は、形状測定システム1の各部を制御する機能と、被検物Aの形状を算出する機能とを兼ね備えている。ただしそれに限られず、演算装置19は、形状測定システム1の各部を制御する機能を有さず、被検物Aの形状を算出する機能を有するものであってもよい。すなわわち、形状測定システム1は、形状測定システム1の各部を制御する機能を有する装置と、被検物Aの形状を算出する機能を有する演算装置19とを、備えていてもよい。 As described above, in this embodiment, the arithmetic device 19 has both the function of controlling each part of the shape measurement system 1 and the function of calculating the shape of the test object A. However, this is not limited to this, and the arithmetic device 19 may not have the function of controlling each part of the shape measurement system 1, but may have the function of calculating the shape of the test object A. In other words, the shape measurement system 1 may include a device with the function of controlling each part of the shape measurement system 1, and a arithmetic device 19 with the function of calculating the shape of the test object A.

 (撮像処理)
 次に、演算装置19による、形状測定システム1の撮像処理について説明する。本実施形態においては、演算装置19は、駆動制御部191により、撮像ユニット11を、被検物A(載置面ST)に対してY方向に相対移動させながら、撮像制御部193により撮像を実行させる。具体的には、演算装置19は、撮像ユニット11が被検物A(載置面ST)に対してY方向に相対移動している最中に、照明装置50及び落射照明装置70の少なくとも一方に照明光Laを照射させた状態で、第2撮像装置30に被検物A(被検物Aに投影された照明光Laの像)を撮像させる。その後、演算装置19は、撮像ユニット11が被検物A(載置面ST)に対してY方向に相対移動している最中に、照明装置50及び落射照明装置70による照明光Laの照射を停止させて投影装置60に照明光Lbを照射させた状態で、第1撮像装置40に、被検物Aの照射領域に投影された照明光Lbの像を撮像させる。演算装置19は、この処理を繰り返して、被検物Aの測定すべき領域(例えば全域)を、第2撮像装置30及び第1撮像装置40に撮像させる。
(Image capture processing)
Next, the imaging process of the shape measurement system 1 performed by the arithmetic device 19 will be described. In this embodiment, the arithmetic device 19 causes the imaging control unit 193 to perform imaging while the drive control unit 191 moves the imaging unit 11 relative to the test object A (mounting surface ST) in the Y direction. Specifically, while the imaging unit 11 is moving relative to the test object A (mounting surface ST) in the Y direction, the arithmetic device 19 causes the second imaging device 30 to image the test object A (an image of the illumination light La projected onto the test object A) in a state where at least one of the illumination device 50 and the epi-illumination device 70 is irradiated with the illumination light La. Thereafter, while the imaging unit 11 is moving in the Y direction relative to the test object A (mounting surface ST), the computing device 19 stops the illumination light La from the illumination device 50 and the epi-illumination device 70 and causes the projection device 60 to emit illumination light Lb, and causes the first imaging device 40 to capture an image of the illumination light Lb projected onto the illuminated area of the test object A. The computing device 19 repeats this process, causing the second imaging device 30 and the first imaging device 40 to capture an image of the area to be measured (for example, the entire area) of the test object A.

 図11は、形状測定システムの制御処理を説明するフローチャートである。図11に示すフローは、演算装置19によって実行される。より詳しくは、本実施形態では、図11に示すフローは、演算装置19がコンピュータプログラム171(ソフトウェア)を読み出して実行することにより、言い換えれば、駆動制御部191、照射制御部192、撮像制御部193、合成部194及び推定部195などの論理的な機能ブロックにより、実行される。なお、上述のように、これらの機能ブロックの少なくとも一部は、ハードウェアにより実行されてもよいため、図11の処理は、ハードウェアにより実行されてもよいし、ハードウェアとコンピュータプログラム171(ソフトウェア)とを組み合わせて実行されてもよい。 FIG. 11 is a flowchart illustrating the control processing of the shape measurement system. The flow shown in FIG. 11 is executed by the arithmetic unit 19. More specifically, in this embodiment, the flow shown in FIG. 11 is executed by the arithmetic unit 19 reading and executing the computer program 171 (software), in other words, by logical functional blocks such as the drive control unit 191, irradiation control unit 192, imaging control unit 193, synthesis unit 194, and estimation unit 195. As mentioned above, at least some of these functional blocks may be executed by hardware, and therefore the processing in FIG. 11 may be executed by hardware, or may be executed by a combination of hardware and the computer program 171 (software).

 図11に示すように、駆動制御部191は、駆動装置15を制御して、撮像ユニット11を、被検物A(載置面ST)に対してY方向(本例では+Y方向)に相対移動させる制御を開始する(ステップS10)。駆動制御部191は、撮像ユニット11をY方向に所定の速度で移動させるための制御信号を駆動装置15に供給する。 As shown in FIG. 11, the drive control unit 191 controls the drive device 15 to start control to move the imaging unit 11 relative to the specimen A (mounting surface ST) in the Y direction (+Y direction in this example) (step S10). The drive control unit 191 supplies a control signal to the drive device 15 to move the imaging unit 11 in the Y direction at a predetermined speed.

 次に、撮像ユニット11が被検物Aの撮像位置に位置しているか否かを判定する(ステップS11)。例えば、撮像制御部193は、位置測定部122の撮像ユニット11の位置情報および載置面STにおける被検物Aの載置位置に基づいて、撮像ユニット11が被検物Aのどの位置に位置しているのかを算出することで、撮像ユニット11が撮像の開始を予定している位置かを判定する。算出しした位置とメモリ17に記憶されている位置をと比較し、撮像ユニット11が被検物Aの撮像位置に位置しているか否かを判定する。 Next, it is determined whether the imaging unit 11 is located at the imaging position of the test object A (step S11). For example, the imaging control unit 193 calculates the position of the imaging unit 11 on the test object A based on the position information of the imaging unit 11 from the position measurement unit 122 and the placement position of the test object A on the placement surface ST, and thereby determines whether the imaging unit 11 is at the position where imaging is scheduled to begin. The calculated position is compared with the position stored in memory 17, and it is determined whether the imaging unit 11 is located at the imaging position of the test object A.

 次に、照射制御部192は、照明装置50及び落射照明装置70の少なくとも一方に、被検物A(載置面ST)に向けて照明光Laを照射させる(ステップS12)。 Next, the illumination control unit 192 causes at least one of the illumination device 50 and the epi-illumination device 70 to irradiate the illumination light La toward the test object A (mounting surface ST) (step S12).

 次に、撮像制御部193は、撮像時刻が到来したか否かを判定する(ステップS14)。例えば、撮像制御部193は、撮像ユニット11のY方向への移動が開始してから、または直前の撮影タイミングから所定時間が経過した場合に、撮像タイミングが到来したと判定する。撮像制御部193は、撮像時刻が到来していない場合(ステップS14;No)、ステップS14に戻り、撮像時刻が到来するまで待機する。 Next, the imaging control unit 193 determines whether the imaging time has arrived (step S14). For example, the imaging control unit 193 determines that the imaging time has arrived when a predetermined time has elapsed since the imaging unit 11 started moving in the Y direction or since the previous imaging timing. If the imaging time has not arrived (step S14; No), the imaging control unit 193 returns to step S14 and waits until the imaging time arrives.

 撮像時刻が到来した場合(ステップS14;Yes)、撮像制御部193は、撮像ユニット11が移動している間に、第2撮像装置30の撮像領域を撮像するように、第2撮像装置30を制御する(ステップS16)。撮像制御部193は、制御信号を第2撮像装置30に供給することにより、第2撮像装置30に撮像画像を生成させる。撮像制御部193は、第2撮像装置30が撮像した撮像画像(被検物Aの画像)を、第2撮像装置30から取得して、撮像時刻と関連付けてメモリ17に記憶する。 When the imaging time arrives (Step S14; Yes), the imaging control unit 193 controls the second imaging device 30 to capture an image of its imaging area while the imaging unit 11 is moving (Step S16). The imaging control unit 193 supplies a control signal to the second imaging device 30, causing the second imaging device 30 to generate an image. The imaging control unit 193 acquires the image (image of test object A) captured by the second imaging device 30 from the second imaging device 30 and stores it in memory 17 in association with the imaging time.

 また、撮像制御部193は、撮像時刻における撮像ユニット11の位置を示す情報を位置測定部122から取得する。撮像制御部193は、撮像ユニット11の情報を、撮像画像と関連付けてメモリ17に記憶する。照射制御部192は、撮像画像が生成された後に(第2撮像装置30による撮像が終了した後に)、照明装置50及び落射照明装置70の少なくとも一方を制御して、照明装置50及び落射照明装置70からの照明光Laの照射を停止する。 The imaging control unit 193 also acquires information indicating the position of the imaging unit 11 at the time of imaging from the position measurement unit 122. The imaging control unit 193 stores the information about the imaging unit 11 in association with the captured image in the memory 17. After the captured image has been generated (after imaging by the second imaging device 30 has ended), the illumination control unit 192 controls at least one of the illumination device 50 and the epi-illumination device 70 to stop the emission of illumination light La from the illumination device 50 and the epi-illumination device 70.

 次に、照射制御部192は、投影装置60を制御して、投影装置60に、第1照射領域及び第2照射領域に照明光Lbを照射させる(ステップS18)。すなわち、照射制御部192は、撮像ユニット11が移動している間であって、照明装置50及び落射照明装置70により照明光Laが照射されていない時間に、照明光Lbを照射するように投影装置60を制御する。照射制御部192は、投影装置60に、第1照射領域及び第2照射領域に、照明光Lbを同時に投影させる。本実施形態では、照射制御部192は、第1投影装置60a及び第2投影装置60bを制御して、第1投影装置60a及び第2投影装置60bに、照射領域ARAa、照射領域ARBa、照射領域ARAb、及び照射領域ARBbへ、同時に照明光Lbを照射させる。これにより、照射領域ARAa、照射領域ARBa、照射領域ARAb、及び照射領域ARBbに、明暗パターンを有する照明光Lb(構造化照明光)の像が、同時に投影される。 Next, the illumination control unit 192 controls the projection device 60 to irradiate the first illumination area and the second illumination area with illumination light Lb (step S18). That is, the illumination control unit 192 controls the projection device 60 to irradiate the illumination light Lb while the imaging unit 11 is moving and during times when the illumination light La is not being irradiated by the illumination device 50 and the epi-illumination device 70. The illumination control unit 192 causes the projection device 60 to simultaneously project the illumination light Lb onto the first illumination area and the second illumination area. In this embodiment, the illumination control unit 192 controls the first projection device 60a and the second projection device 60b to simultaneously irradiate the illumination light Lb onto the illumination area ARAa, the illumination area ARBa, the illumination area ARAb, and the illumination area ARBb. As a result, images of illumination light Lb (structured illumination light) having a light and dark pattern are simultaneously projected onto illumination areas ARAa, ARBa, ARAb, and ARBb.

 次に、撮像制御部193は、3次元撮像時刻が到来したか否かを判定する(ステップS20)。例えば、撮像制御部193は、直近のステップS14で到来した撮像時刻から所定時間が経過した場合に、3次元撮像時刻が到来したと判定する。 Next, the imaging control unit 193 determines whether the 3D imaging time has arrived (step S20). For example, the imaging control unit 193 determines that the 3D imaging time has arrived if a predetermined time has passed since the imaging time arrived in the most recent step S14.

 撮像制御部193は、3次元撮像時刻が到来していない場合(ステップS20;No)、ステップS20に戻り、3次元撮像時刻が到来するまで待機する。 If the 3D imaging time has not arrived (step S20; No), the imaging control unit 193 returns to step S20 and waits until the 3D imaging time arrives.

 3次元撮像時刻が到来した場合(ステップS20;Yes)、撮像制御部193は、撮像ユニット11が移動している間に、第1撮像装置40の撮像領域AR0を撮像するように、第1撮像装置40を制御する(ステップS22)。本実施形態では、撮像制御部193は、撮像ユニット11が移動している間に、第1撮像装置40の撮像領域AR0を複数回撮像するように、第1撮像装置40を制御する。撮像制御部193は、制御信号を第1撮像装置40に供給することにより、第1撮像装置40にパターン画像(被検物A上に投影された照明光Lb(構造化照明光)の像を撮像した画像)を生成させる。撮像制御部193は、複数のパターン画像を第1撮像装置40から取得して、撮像時刻と関連付けてメモリ17に記憶する。また、撮像制御部193は、それぞれのパターン画像の撮像時刻における撮像ユニット11の位置を、パターン画像と関連付けてメモリ17に記憶する。 When the three-dimensional imaging time arrives (Step S20; Yes), the imaging control unit 193 controls the first imaging device 40 to image the imaging area AR0 of the first imaging device 40 while the imaging unit 11 is moving (Step S22). In this embodiment, the imaging control unit 193 controls the first imaging device 40 to image the imaging area AR0 of the first imaging device 40 multiple times while the imaging unit 11 is moving. The imaging control unit 193 supplies a control signal to the first imaging device 40, causing the first imaging device 40 to generate a pattern image (an image obtained by capturing an image of the illumination light Lb (structured illumination light) projected onto the test object A). The imaging control unit 193 acquires multiple pattern images from the first imaging device 40 and stores them in memory 17 in association with the imaging times. The imaging control unit 193 also stores the position of the imaging unit 11 at the imaging time of each pattern image in memory 17 in association with the pattern image.

 一般に、位相シフト法を用いた3次元構造の推定においては、相互に異なる位相シフトを含む明暗パターンを有する複数の構造化照明光を被検物に順次照射して、各明暗パターンについての画像を取得する必要がある。位相シフト法を用いた形状計測として、例えば、特開2011-21970号、特開2012-93235号、特開2014-35198号、特開2008-170280号、特開2000-9444号に記載がある。しかしながら、本実施形態においては、第1撮像装置40は、投影装置60とともに移動している間に、複数回撮像する。本実施形態においては、構造化照明光のパターンの向きがY方向(スキャン方向)に対して傾斜している。したがって、スキャン方向での撮像タイミングを異ならせることにより、相互に異なる位相を有する光が被検物Aの特定の位置に照射された複数のパターン画像が生成される。このように生成された複数のパターン画像に基づいて、被検物Aの3次元形状を推定することができる。したがって、被検物Aの3次元形状を推定するために、投影装置60が照射する構造化照明光の明暗の位相を変更しなくても構わない。なお、上述の実施形態では、回折格子を用い明暗のパターンを作成したが、明暗パターンを作成する方法はこれに限られない。明暗パターンを投影するプロジェクターを用いても構わない。明暗パターンに投影するプロジェクターを用いる場合、例えば、第1投影装置60aに複数の投影プロジェクターを用いても構わないし、一つの投影プロジェクターで複数のパターンを投影しても構わない。 Generally, when estimating a three-dimensional structure using the phase shift method, it is necessary to sequentially irradiate the test object with multiple structured illumination light beams having light and dark patterns with mutually different phase shifts, and acquire images for each light and dark pattern. Shape measurement using the phase shift method is described, for example, in Japanese Patent Application Publication Nos. 2011-21970, 2012-93235, 2014-35198, 2008-170280, and 2000-9444. However, in this embodiment, the first imaging device 40 captures images multiple times while moving together with the projection device 60. In this embodiment, the orientation of the structured illumination light pattern is inclined with respect to the Y direction (scanning direction). Therefore, by varying the imaging timing in the scanning direction, multiple pattern images are generated in which light beams with mutually different phases are irradiated at specific positions on the test object A. The three-dimensional shape of the test object A can be estimated based on the multiple pattern images generated in this manner. Therefore, in order to estimate the three-dimensional shape of the test object A, it is not necessary to change the light-dark phase of the structured illumination light emitted by the projection device 60. In the above embodiment, a diffraction grating is used to create a light-dark pattern, but the method for creating a light-dark pattern is not limited to this. A projector that projects a light-dark pattern may also be used. When using a projector that projects a light-dark pattern, for example, multiple projectors may be used in the first projection device 60a, or multiple patterns may be projected by a single projector.

 次に、駆動制御部191は、撮像ユニット11がY方向の端部に到達したか否かを判定する(ステップS24)。例えば、駆動制御部191は、撮像ユニット11がY方向の一端から他端に到達するために必要な時間が経過した場合に、撮像ユニット11がY方向の端部に到達したと判定する。駆動制御部191は、位置測定部122から撮像ユニット11の位置を示す情報を取得することにより、撮像ユニット11がY方向の端部に到達したか否かを判定してもよい。 Next, the drive control unit 191 determines whether the imaging unit 11 has reached the end in the Y direction (step S24). For example, the drive control unit 191 determines that the imaging unit 11 has reached the end in the Y direction when the time required for the imaging unit 11 to reach from one end to the other in the Y direction has elapsed. The drive control unit 191 may also determine whether the imaging unit 11 has reached the end in the Y direction by obtaining information indicating the position of the imaging unit 11 from the position measurement unit 122.

 撮像ユニット11がY方向の端部に到達していない場合(ステップS24;No)、演算装置19は、第1撮像装置40の撮像及び投影装置60の照射を停止させて、ステップS12に戻り、制御を継続する。 If the imaging unit 11 has not reached the end in the Y direction (step S24; No), the calculation device 19 stops the imaging by the first imaging device 40 and the irradiation by the projection device 60, returns to step S12, and continues control.

 撮像ユニット11がY方向の端部に到達した場合(ステップS24;Yes)、演算装置19は、第1撮像装置40の撮像及び投影装置60の照射を停止させて、駆動装置15を制御して撮像ユニット11を停止させる(ステップS26)。駆動制御部191は、撮像ユニット11を停止させるための制御信号を駆動装置15に供給する。 If the imaging unit 11 reaches the end in the Y direction (step S24; Yes), the calculation device 19 stops the imaging of the first imaging device 40 and the irradiation of the projection device 60, and controls the drive device 15 to stop the imaging unit 11 (step S26). The drive control unit 191 supplies a control signal to the drive device 15 to stop the imaging unit 11.

 次に、駆動制御部191は、撮像ユニット11がX方向の端部に到達し、全ての撮像が終了したか否かを判定する(ステップS28)。撮像ユニット11がX方向の端部に到達していない場合(ステップS28;No)、駆動制御部191は、撮像ユニット11をX方向に移動させ(ステップS30)、ステップS10に戻って処理を継続する。駆動制御部191は、撮像ユニット11をX方向に移動させるための制御信号を駆動装置15に供給する。なお、この場合、撮像ユニット11は+Y方向の端部に到達しているので、駆動制御部191は、ステップS12において、撮像ユニット11を-Y方向に移動させてよい。又は、駆動制御部191は、ステップS30において、撮像ユニット11を、X方向に移動させるとともに-Y方向の端部に移動させて、ステップS10の処理を続けてよい。 Next, the drive control unit 191 determines whether the imaging unit 11 has reached the end in the X direction and all imaging has been completed (step S28). If the imaging unit 11 has not reached the end in the X direction (step S28; No), the drive control unit 191 moves the imaging unit 11 in the X direction (step S30) and returns to step S10 to continue processing. The drive control unit 191 supplies a control signal to the drive device 15 to move the imaging unit 11 in the X direction. Note that in this case, since the imaging unit 11 has reached the end in the +Y direction, the drive control unit 191 may move the imaging unit 11 in the -Y direction in step S12. Alternatively, the drive control unit 191 may move the imaging unit 11 in the X direction and to the end in the -Y direction in step S30, and continue processing in step S10.

 撮像ユニット11がX方向の端部に到達した場合(ステップS28;Yes)、演算装置19は、撮像処理を終了する。 If the imaging unit 11 reaches the end in the X direction (step S28; Yes), the calculation device 19 ends the imaging process.

 なお、本実施形態においては、撮像する時刻は、所定位置での撮像時刻を基準とすることができる。例えば、被検物Aの撮像を開始する開始位置を撮像した時刻を基準時間として、撮像時刻を管理する。 In this embodiment, the time of imaging can be based on the time of imaging at a specified position. For example, the time of imaging the starting position for imaging the test object A is used as the reference time to manage the imaging time.

 (合成画像の生成処理)
 次に、合成部194による、第2撮像装置30が撮像した複数の撮像画像に基づき、合成画像を生成する処理について説明する。合成部194は、メモリ17に記憶された、第2撮像装置30が撮像した複数の撮像画像と、撮像画像毎の、撮像時刻における撮像ユニット11の位置を示す情報(位置情報)と、を取得する。合成部194は、複数の撮像画像と位置情報とに基づき、複数の撮像画像を合成して、合成画像を生成する。合成画像は、被検物Aの、第2撮像装置30により移動しつつ撮像された領域における、二次元画像である。
(Synthetic image generation process)
Next, a process of generating a composite image by the synthesis unit 194 based on multiple captured images captured by the second imaging device 30 will be described. The synthesis unit 194 acquires multiple captured images captured by the second imaging device 30 and information (position information) indicating the position of the imaging unit 11 at the time of capture for each captured image, which are stored in the memory 17. The synthesis unit 194 synthesizes the multiple captured images based on the multiple captured images and the position information to generate a composite image. The composite image is a two-dimensional image of a region of the test object A that is imaged while the second imaging device 30 is moving.

 図12は、合成画像生成処理を説明するフローチャートである。図12に示すフロー(合成画像を生成する処理)は、演算装置19によって実行される。より詳しくは、本実施形態では、図12に示すフローは、演算装置19がコンピュータプログラム171(ソフトウェア)を読み出して実行することにより、言い換えれば、論理的な機能ブロックである合成部194により、実行される。なお、上述のように、機能ブロックの少なくとも一部は、ハードウェアにより実行されてもよいため、図12の処理は、ハードウェアにより実行されてもよいし、ハードウェアとコンピュータプログラム171(ソフトウェア)とを組み合わせて実行されてもよい。また、図12に示すフローは、ASICなど画像処理専用のプロセッサにより実行されてもよい。合成画像を生成する処理は、撮像処理のステップS16において撮像画像がメモリ17に記憶されるたびに、撮像処理と並行して実行される。ただしそれに限られず、合成画像を生成する処理は、撮像処理が終了した後に、実行されてもよい。 12 is a flowchart illustrating the composite image generation process. The flow shown in FIG. 12 (processing for generating a composite image) is executed by the arithmetic unit 19. More specifically, in this embodiment, the flow shown in FIG. 12 is executed by the arithmetic unit 19 reading and executing the computer program 171 (software), in other words, by the synthesis unit 194, which is a logical functional block. As described above, at least a portion of the functional block may be executed by hardware, and therefore the process of FIG. 12 may be executed by hardware or by a combination of hardware and the computer program 171 (software). The flow shown in FIG. 12 may also be executed by a processor dedicated to image processing, such as an ASIC. The process for generating a composite image is executed in parallel with the imaging process each time a captured image is stored in memory 17 in step S16 of the imaging process. However, this is not limited to this, and the process for generating a composite image may be executed after the imaging process is completed.

 合成部194は、撮像処理のステップS16においてメモリ17に記憶された撮像画像を取得する(ステップS40)。合成部194は、取得した撮像画像を、例えば撮像ユニット11の環境温度に基づき補正してもよい。 The composition unit 194 acquires the captured image stored in the memory 17 in step S16 of the imaging process (step S40). The composition unit 194 may correct the acquired captured image based on, for example, the ambient temperature of the imaging unit 11.

 次に、合成部194は、直近の合成画像生成処理で生成された合成画像の連結対象となる撮像画像が存在するか否かを判定する(ステップS42)。直近のステップS40で取得された撮像画像が、撮像ユニット11のY方向への移動が開始されてから3回目以降の撮像時刻に撮像された撮像画像である場合には、直近のステップS44で生成された合成画像(撮像画像の連結により生成された画像)と、その直前のステップS44で生成された合成画像とが存在する。直前のステップS44で生成された合成画像が、直近のステップS44で生成された合成画像の連結対象の画像となる。したがって、直近のステップS40で取得された撮像画像が、撮像ユニット11のY方向への移動が開始されてから3回目以降の撮像時刻に撮像された撮像画像である場合には、合成部194は、連結対象となる撮像画像が存在すると判定する。 Next, the composition unit 194 determines whether there are any captured images to be linked to the composite image generated in the most recent composite image generation process (step S42). If the captured image acquired in the most recent step S40 is an image captured at the third or subsequent imaging time after the imaging unit 11 began moving in the Y direction, then the composite image generated in the most recent step S44 (an image generated by linking captured images) and the composite image generated in the immediately preceding step S44 exist. The composite image generated in the immediately preceding step S44 is the image to be linked to the composite image generated in the most recent step S44. Therefore, if the captured image acquired in the most recent step S40 is an image captured at the third or subsequent imaging time after the imaging unit 11 began moving in the Y direction, the composition unit 194 determines that there are any captured images to be linked.

 連結対象となる画像が存在しない場合(ステップS42;No)、合成部194は、ステップS40に戻って処理を続ける。 If there are no images to be combined (step S42: No), the composition unit 194 returns to step S40 and continues processing.

 連結対象となる画像が存在する場合(ステップS42;Yes)、合成部194は、直近のステップS44において生成された合成画像を連結対象の画像に連結(Stitch)する(ステップS44)。合成部194は、合成画像の位置関係に基づいて、合成画像を連結する。 If there are images to be linked (step S42: Yes), the compositing unit 194 stitches the composite image generated in the most recent step S44 to the images to be linked (step S44). The compositing unit 194 stitches the composite images based on their positional relationships.

 次に、合成部194は、撮像処理において生成されるべき全ての撮像画像が取得されたか否かを判定する(ステップS46)。例えば、合成部194は、あらかじめ設定された所定数の撮像画像が取得された場合に、撮像処理において生成されるべき全ての撮像画像が取得されたと判定する。 Next, the composition unit 194 determines whether all captured images to be generated in the imaging process have been acquired (step S46). For example, the composition unit 194 determines that all captured images to be generated in the imaging process have been acquired when a predetermined number of captured images have been acquired.

 全ての撮像画像が取得されていない場合(ステップS46;No)、合成部194は、ステップS40に戻って処理を続ける。 If not all captured images have been acquired (step S46; No), the synthesis unit 194 returns to step S40 and continues processing.

 全ての撮像画像が取得された場合(ステップS46;Yes)、合成部194は、全ての合成画像が連結された被検物Aの画像を出力する(ステップS48)。例えば、合成部194は、通信装置18を介して被検物の画像を他の装置に送信することにより出力する。合成部194は、被検物の画像を表示装置14に表示することにより出力してもよい。合成部194は、全ての合成画像が連結された被検物Aの画像に基づき、被検物Aの2次元形状を算出してもよい。以上で、合成処理が終了する。 When all captured images have been acquired (Step S46; Yes), the synthesis unit 194 outputs an image of the test object A in which all the synthesized images have been concatenated (Step S48). For example, the synthesis unit 194 outputs the image of the test object by transmitting it to another device via the communication device 18. The synthesis unit 194 may also output the image of the test object by displaying it on the display device 14. The synthesis unit 194 may also calculate the two-dimensional shape of the test object A based on the image of the test object A in which all the synthesized images have been concatenated. This completes the synthesis process.

 (被検物の形状の算出処理)
 次に、推定部195による、第1撮像装置40が撮像した複数のパターン画像に基づいた、被検物Aの形状(三次元形状)の算出処理について説明する。図13は、被検物の形状の算出処理を説明するフローチャートである。図13に示すフロー(被検物Aの形状の算出処理)は、演算装置19によって実行される。より詳しくは、本実施形態では、図13に示すフローは、演算装置19がコンピュータプログラム171(ソフトウェア)を読み出して実行することにより、言い換えれば、論理的な機能ブロックである推定部195により、実行される。なお、上述のように、機能ブロックの少なくとも一部は、ハードウェアにより実行されてもよいため、図13の処理は、ハードウェアにより実行されてもよいし、ハードウェアとコンピュータプログラム171(ソフトウェア)とを組み合わせて実行されてもよい。本実施形態では、被検物Aの形状の算出処理は、撮像処理のステップS22においてパターン画像がメモリ17に記憶されるたびに、撮像処理と並行して実行される。ただしそれに限られず、被検物Aの形状の算出処理は、撮像処理が終了した後に、実行されてもよい。
(Calculation process of the shape of the test object)
Next, the calculation process of the shape (three-dimensional shape) of the test object A by the estimation unit 195 based on multiple pattern images captured by the first imaging device 40 will be described. FIG. 13 is a flowchart illustrating the calculation process of the shape of the test object A. The flow shown in FIG. 13 (calculation process of the shape of the test object A) is executed by the arithmetic unit 19. More specifically, in this embodiment, the flow shown in FIG. 13 is executed by the arithmetic unit 19 reading and executing the computer program 171 (software), in other words, by the estimation unit 195, which is a logical functional block. As described above, at least a portion of the functional block may be executed by hardware. Therefore, the process of FIG. 13 may be executed by hardware or by a combination of hardware and the computer program 171 (software). In this embodiment, the calculation process of the shape of the test object A is executed in parallel with the imaging process every time a pattern image is stored in the memory 17 in step S22 of the imaging process. However, this is not limited thereto, and the calculation process of the shape of the test object A may be executed after the imaging process is completed.

 図13に示すように、推定部195は、撮像処理のステップS22においてメモリ17に記憶された複数のパターン画像を取得する(ステップS50)。推定部195は、取得したパターン画像を、例えば撮像ユニット11の環境温度に基づき補正してもよい。 As shown in FIG. 13, the estimation unit 195 acquires multiple pattern images stored in the memory 17 in step S22 of the imaging process (step S50). The estimation unit 195 may correct the acquired pattern images based on, for example, the environmental temperature of the imaging unit 11.

 次に、推定部195は、複数のパターン画像の撮像領域AR0間の位置関係を算出する(ステップS52)。推定部195は、それぞれのパターン画像の撮像時刻における撮像ユニット11の位置をメモリ17から取得する。なお、撮像ユニット11の位置を、例えば撮像ユニット11の環境温度に基づき補正してもよい。推定部195は、取得した撮像ユニット11の位置に基づいて、複数のパターン画像の撮像領域AR0間の位置関係を算出する。 Next, the estimation unit 195 calculates the positional relationship between the imaging areas AR0 of the multiple pattern images (step S52). The estimation unit 195 acquires from the memory 17 the position of the imaging unit 11 at the time each pattern image was captured. Note that the position of the imaging unit 11 may be corrected based on, for example, the ambient temperature of the imaging unit 11. The estimation unit 195 calculates the positional relationship between the imaging areas AR0 of the multiple pattern images based on the acquired position of the imaging unit 11.

 次に、推定部195は、算出された位置関係および複数のパターン撮像画像のそれぞれに含まれる複数の画素の輝度値に基づいて、被検物Aの形状を推定する(ステップS54)。例えば、推定部195は、位相シフト法により被検物Aの3次元形状を推定する。この場合、推定部195は、算出された位置関係に基づいて、各パターン画像において、全てのパターン画像の撮像領域AR0が重なる領域を特定する。推定部195は、特定された領域に含まれる複数の画素のそれぞれについて、画素の輝度値を各パターン画像から取得する。推定部195は、取得した輝度値の組合せに基づいて、各画素の位置における被検物Aの高さを算出することにより、被検物の3次元形状を推定する。輝度値の組合せと被検物Aの高さとの関係は、あらかじめメモリ17に記憶されていてもよく、所定の数式に従って算出されてもよい。 Next, the estimation unit 195 estimates the shape of the test object A based on the calculated positional relationship and the brightness values of multiple pixels included in each of the multiple pattern captured images (step S54). For example, the estimation unit 195 estimates the three-dimensional shape of the test object A using a phase shift method. In this case, the estimation unit 195 identifies an area in each pattern image where the captured areas AR0 of all pattern images overlap based on the calculated positional relationship. The estimation unit 195 acquires the brightness values of each of the multiple pixels included in the identified area from each pattern image. The estimation unit 195 estimates the three-dimensional shape of the test object by calculating the height of the test object A at the position of each pixel based on the combination of the acquired brightness values. The relationship between the combination of brightness values and the height of the test object A may be stored in advance in the memory 17, or may be calculated according to a predetermined formula.

 推定部195は、算出した被検物Aの形状の情報を出力する(ステップS56)。例えば、推定部195は、通信装置18を介して推定部195の情報を他の装置に送信することにより出力する。合成部194は、推定部195の情報を表示装置14に表示することにより出力してもよい。以上で、推定処理が終了する。 The estimation unit 195 outputs information about the calculated shape of the test object A (step S56). For example, the estimation unit 195 outputs the information by transmitting it to another device via the communication device 18. The synthesis unit 194 may output the information from the estimation unit 195 by displaying it on the display device 14. This completes the estimation process.

 図14は、撮像画像が生成される撮像時刻とパターン画像が生成される3次元撮像時刻との関係について説明するための模式的なタイミングチャートである。図14に示すように、撮像時刻が到来すると、期間T1において、第2撮像装置30が被検物Aを撮像して撮像画像を生成する。生成された撮像画像は、期間T2においてメモリ17に記憶される。並行して、記憶された撮像画像についての合成処理が実行される。撮像画像がメモリ17に記憶されている間に、3次元撮像時刻が到来し、期間T3において、第1撮像装置40が被検物を複数回撮像し、複数のパターン画像を生成する。生成された複数のパターン画像は、期間T4においてメモリ17に記憶される。並行して、記憶された複数のパターン画像についての推定処理が実行される。複数のパターン画像がメモリ17に記憶されると、再び撮像時刻が到来し、期間T5において、第2撮像装置30が被検物を生成し、撮像画像が生成される。 FIG. 14 is a schematic timing chart illustrating the relationship between the imaging time at which an image is generated and the three-dimensional imaging time at which a pattern image is generated. As shown in FIG. 14, when the imaging time arrives, the second imaging device 30 images the test object A and generates an image during period T1. The generated image is stored in memory 17 during period T2. In parallel, a synthesis process is performed on the stored image. While the image is being stored in memory 17, the three-dimensional imaging time arrives, and in period T3, the first imaging device 40 images the test object multiple times and generates multiple pattern images. The generated multiple pattern images are stored in memory 17 during period T4. In parallel, an estimation process is performed on the stored multiple pattern images. Once the multiple pattern images have been stored in memory 17, the imaging time arrives again, and in period T5, the second imaging device 30 images the test object and generates an image.

 このように、第1撮像装置40は、第2撮像装置30によって生成された撮像画像がメモリ17に記憶されている間、または撮像画像についての合成処理が実行されている間に被検物Aを撮像し、パターン画像を生成する。一般に、撮像画像を生成するための時間は撮像ユニット11が移動するための時間よりも短いため、撮像時刻の間には撮像が行われない時間が生じる。形状測定システム1は、このような撮像時刻の間に3次元計測を行うことにより、効率的に被検物の3次元構造を推定することを可能とする。 In this way, the first imaging device 40 captures an image of the test object A and generates a pattern image while the captured image generated by the second imaging device 30 is being stored in memory 17 or while a synthesis process is being performed on the captured image. Generally, the time required to generate a captured image is shorter than the time required for the imaging unit 11 to move, so there is a period of time between imaging times when no imaging is performed. By performing three-dimensional measurements during these imaging times, the shape measurement system 1 makes it possible to efficiently estimate the three-dimensional structure of the test object.

 以上のように、形状測定システム1は、撮像ユニット11が移動している間であって、照明光Laが照射されていない時間に照明光Lbを照射するように投影装置60を制御し、照明光Lbが照射されている間に撮像するように第1撮像装置40を制御して、被検物Aの部位ごとに複数のパターン画像を取得し、部位ごとの複数のパターン画像に基づいて被検物Aの三次元形状を推定する。これにより、形状測定システム1は、短時間で被検物の3次元構造を推定することを可能とする。 As described above, the shape measurement system 1 controls the projection device 60 to emit illumination light Lb while the imaging unit 11 is moving and during times when illumination light La is not being emitted, and controls the first imaging device 40 to capture images while illumination light Lb is being emitted, thereby acquiring multiple pattern images for each region of the test object A and estimating the three-dimensional shape of the test object A based on the multiple pattern images for each region. This enables the shape measurement system 1 to estimate the three-dimensional structure of the test object in a short period of time.

 なお、形状測定システム1に安全カバーを設けても構わない。図15は、形状測定システムの一例を示す図である。例えば形状測定システム1に用いるレーザクラスが高い場合には、安全カバー150を配置する。安全カバー150は、形状測定システム1を覆う(例えば内部に形状測定システム1を収納する)カバーである。図15の例では、安全カバー150は、形状測定システム1のうちで、操作装置13、表示装置14、メモリ17、通信装置18、及び演算装置19以外の装置を覆っている。安全カバー150には、内部の形状測定システム1を確認するための窓151が設けられている。また、安全カバー150の外面には、操作装置13、表示装置14、メモリ17、通信装置18、及び演算装置19が取り付けられている。ただし、操作装置13、表示装置14、メモリ17、通信装置18、及び演算装置19のうち、操作装置13及び表示装置14のみが安全カバー150の外面に設けられ、他の装置は安全カバー150内に収納されていてもよい。安全カバー150には、安全カバー150を開閉する際に、レーザが照射されていない場合にのみ開閉するための、インターロック153が設けられている。すなわち、インターロック153は、レーザが照射されている期間中には、安全カバー150を開く(内部の形状測定システム1を露出する)ことことができないよう、安全カバー150をロックする。また、インターロック153は、レーザが照射されていない期間中には、安全カバー150のロックを解除する。また、安全カバー150には、被検物Aを外部より安全カバー150内に搬送するために搬送窓152を設けても構わない。搬送窓152には、搬送窓152の開閉を切り替える開閉機構が設けられてもよく、被検物Aを搬送する時に搬送窓152を開き、搬送後に搬送窓152がを閉じることが可能になっていても構わない。 15 、 信楽造型 ... The safety cover 150 is provided with an interlock 153 that opens and closes only when a laser is not being emitted. That is, the interlock 153 locks the safety cover 150 so that it cannot be opened (exposing the shape measurement system 1 inside) while a laser is being emitted. The interlock 153 also unlocks the safety cover 150 while a laser is not being emitted. The safety cover 150 may also be provided with a transport window 152 for transporting the test object A from the outside into the safety cover 150. The transport window 152 may be provided with an opening/closing mechanism that switches the opening and closing of the transport window 152, and the transport window 152 may be opened when transporting the test object A and closed after transport.

 なお、形状測定システム1に、安全カバーを設けなくても構わない。図16は、形状測定システムの一例を示す図である。例えば、形状測定システム1に用いるレーザクラスが低く、安全カバーが必要ない場合には、安全カバーを設けなくても構わない。この場合に、図16に例示するように、形状測定システム1に、操作装置13、表示装置14、メモリ17、通信装置18、演算装置19を設けても構わない。 It should be noted that a safety cover need not be provided in the shape measurement system 1. Figure 16 is a diagram showing an example of a shape measurement system. For example, if the laser class used in the shape measurement system 1 is low and a safety cover is not necessary, a safety cover may not be provided. In this case, as shown in Figure 16, the shape measurement system 1 may be provided with an operation device 13, a display device 14, a memory 17, a communication device 18, and a calculation device 19.

 (システムの例)
 上記実施形態の形状測定システム1は、1台の装置で処理を行ったが複数組み合わせてもよい。図17は、形状測定システムを有するシステムの構成を示す模式図である。次に、図17を用いて、形状測定システム1を有する製造システム300について説明する。製造システム300は、複数台(図17では3台)の形状測定システム1と、プログラム作成装置302とを、有する。形状測定システム1、プログラム作成装置302は、有線または無線の通信回線で接続されている。プログラム作成装置302は、上述した形状測定システム1の演算装置19で作成する種々の設定やプログラムを作成する。プログラム作成装置302は、作成したプログラムや、形状測定システム1に出力する。形状測定システム1は、領域及び範囲の情報や形状測定プログラムを、プログラム作成装置302から取得し、取得したデータ、プログラムを用いて、処理を行う。製造システム300は、プログラム作成装置302で作成したデータ、プログラムを用いて、形状測定システム1で形状測定を実行することで、作成したデータ、プログラムを有効活用することができる。
(System example)
Although the shape measurement system 1 in the above embodiment performs processing using a single device, multiple devices may be combined. FIG. 17 is a schematic diagram showing the configuration of a system including a shape measurement system. Next, a manufacturing system 300 including the shape measurement system 1 will be described using FIG. 17 . The manufacturing system 300 includes multiple shape measurement systems 1 (three in FIG. 17 ) and a program creation device 302. The shape measurement systems 1 and the program creation device 302 are connected via a wired or wireless communication line. The program creation device 302 creates various settings and programs to be created by the arithmetic device 19 of the shape measurement system 1. The program creation device 302 outputs the created programs and the shape measurement system 1. The shape measurement system 1 acquires area and range information and shape measurement programs from the program creation device 302 and performs processing using the acquired data and programs. The manufacturing system 300 performs shape measurement using the shape measurement system 1 using the data and programs created by the program creation device 302, thereby making effective use of the created data and programs.

 次に、上述した形状測定システム1を備えた製造システムについて、図18を参照して説明する。図18は、製造システムのブロック構成図である。本実施形態の製造システム200は、上記の実施形態において説明したような形状測定システム1と、設計装置202と、製造装置204と、リペア装置206とを備える。 Next, a manufacturing system equipped with the shape measurement system 1 described above will be described with reference to FIG. 18. FIG. 18 is a block diagram of the manufacturing system. The manufacturing system 200 of this embodiment includes the shape measurement system 1 described in the above embodiment, a design device 202, a manufacturing device 204, and a repair device 206.

 設計装置202は、被検物Aの形状や組成に関する設計情報を作成し、作成した設計情報を製造装置204に送信する。 The design device 202 creates design information regarding the shape and composition of the test object A and transmits the created design information to the manufacturing device 204.

 製造装置204は、設計装置202から入力された設計情報に基づいて、被検物Aを作成する。形状測定システム1は、作成された被検物Aの形状を測定し、作成された被検物Aが良品であるか否かを判定する。形状測定システム1は、被検物Aが良品でない場合に、被検物Aが修復可能であるか否か判定する。形状測定システム1は、被検物Aが修復できる場合、被検物Aの形状の測定結果に基づいて不良部位と修復内容を算出し、リペア装置206に不良部位を示す情報と修復内容を示す情報とを送信する。 The manufacturing device 204 creates the test object A based on the design information input from the design device 202. The shape measurement system 1 measures the shape of the created test object A and determines whether the created test object A is a non-defective product. If the test object A is not a non-defective product, the shape measurement system 1 determines whether the test object A can be repaired. If the test object A can be repaired, the shape measurement system 1 calculates the defective parts and repair details based on the measurement results of the shape of the test object A, and sends information indicating the defective parts and repair details to the repair device 206.

 リペア装置206は、形状測定システム1から受信した不良部位を示す情報と修復内容を示す情報とに基づき、被検物Aの不良部位を修復する。 The repair device 206 repairs the defective portion of the test object A based on the information indicating the defective portion and the information indicating the repair details received from the shape measurement system 1.

 図19は、製造システムによる処理の流れを示したフローチャートである。製造システム200は、まず、設計装置202が被検物Aに関する設計情報を作成する(ステップS101)。次に、製造装置204は、設計情報に基づいて被検物Aを作成する(ステップS102)。次に、形状測定システム1は、作成された被検物Aを検査(形状を測定)する(ステップS103)。次に、形状測定システム1は、被検物Aが良品であるかを判断する(ステップS104)。例えば、形状測定システム1は、被検物Aの形状が所定の設計値の範囲内である場合に、被検物Aが良品と判断し、設計値の範囲外である場合、良品でないと判断する。 Figure 19 is a flowchart showing the processing flow by the manufacturing system. In the manufacturing system 200, the design device 202 first creates design information for the test object A (step S101). Next, the manufacturing device 204 creates the test object A based on the design information (step S102). Next, the shape measurement system 1 inspects (measures the shape of) the created test object A (step S103). Next, the shape measurement system 1 determines whether the test object A is a good product (step S104). For example, if the shape of the test object A is within a predetermined design value range, the shape measurement system 1 determines that the test object A is a good product, and if it is outside the design value range, the shape measurement system 1 determines that the test object A is a bad product.

 形状測定システム1は、作成された被検物Aが良品であると判定した場合(ステップS105;Yes)、その処理を終了する。また、形状測定システム1は、作成された被検物Aが良品でないと判定した場合(ステップS105;No)、作成された被検物Aが修復できるか否か判定する(ステップS106)。 If the shape measurement system 1 determines that the created test object A is a non-defective product (step S105; Yes), it terminates the process. If the shape measurement system 1 determines that the created test object A is not a non-defective product (step S105; No), it determines whether the created test object A can be repaired (step S106).

 製造システム200は、作成された被検物Aが修復できると判定した場合(ステップS106でYes)、リペア装置206が被検物Aの修復を実施し(ステップS107)、ステップS103の処理に戻る。製造システム200は、作成された被検物Aが修復できないと判定した場合(ステップS106でNo)、その処理を終了し、不良品を回収する。以上で、製造システム200は、図19に示すフローチャートの処理を終了する。 If the manufacturing system 200 determines that the created specimen A can be repaired (Yes in step S106), the repair device 206 repairs the specimen A (step S107), and the process returns to step S103. If the manufacturing system 200 determines that the created specimen A cannot be repaired (No in step S106), the process ends and the defective product is collected. With this, the manufacturing system 200 ends the process of the flowchart shown in FIG. 19.

 本実施形態の製造システム200は、上記の実施形態における形状測定システム1が被検物Aの形状を高精度に検査することができるので、作成された被検物Aが良品であるか否か判定することができる。また、製造システム200は、被検物Aが良品でない場合、被検物Aを修復することができる。 The manufacturing system 200 of this embodiment is capable of determining whether the created test object A is a non-defective product because the shape measurement system 1 in the above embodiment can inspect the shape of the test object A with high accuracy. Furthermore, the manufacturing system 200 can repair the test object A if it is not a non-defective product.

 なお、本実施形態におけるリペア装置206が実行するリペア工程は、製造装置204が製造工程を再実行する工程に置き換えられてもよい。その際には、形状測定システム1が修復できると判定した場合、製造装置204は、製造工程を再実行する。 Note that the repair process performed by the repair device 206 in this embodiment may be replaced by a process in which the manufacturing device 204 re-executes the manufacturing process. In that case, if the shape measurement system 1 determines that the product can be repaired, the manufacturing device 204 re-executes the manufacturing process.

 (効果)
 本開示に係る形状測定システム1は、第1照射領域に照明光Lbを投影する第1投影装置60aと、第1照射領域とは異なる第2照射領域に照明光Lbを投影する第2投影装置60bと、を有する投影装置60と、被検物Aに形成される、第1照射領域及び第2照射領域に投影された照明光Lbの像を撮像する第1撮像装置40と、第1撮像装置40で撮像される第1照射領域及び第2照射領域の像に基づいて、被検物Aの形状を算出する演算装置19と、を備える。本開示によると、異なる照射領域に投影された照明光Lbの像を撮像することで、被検物Aの形状を適切に算出できる。
(effect)
A shape measurement system 1 according to the present disclosure includes a projection device 60 having a first projection device 60a that projects illumination light Lb onto a first irradiation area and a second projection device 60b that projects illumination light Lb onto a second irradiation area different from the first irradiation area, a first imaging device 40 that captures images of the illumination light Lb projected onto the first irradiation area and the second irradiation area formed on the test object A, and a calculation device 19 that calculates the shape of the test object A based on the images of the first irradiation area and the second irradiation area captured by the first imaging device 40. According to the present disclosure, the shape of the test object A can be appropriately calculated by capturing images of the illumination light Lb projected onto different irradiation areas.

 第1撮像装置40の光軸AX2は、第1投影装置60aと第2投影装置60bの間に位置する。本開示によると、第1投影装置60aと第2投影装置60bとが互いに異なる方向から照明光Lbを照射するため、被検物Aの形状を適切に算出できる。 The optical axis AX2 of the first imaging device 40 is located between the first projection device 60a and the second projection device 60b. According to the present disclosure, the first projection device 60a and the second projection device 60b emit illumination light Lb from different directions, allowing the shape of the test object A to be calculated appropriately.

 本開示に係る形状測定システム1は、第1照射領域(照射領域ARA)と、第1照射領域とは異なる位置の第2照射領域(照射領域ARB)に照明光Lbを投影する投影装置60と、被検物Aに形成される、第1照射領域及び第2照射領域に投影された照明光Lbの像を撮像する第1撮像装置40と、第1撮像装置40で撮像される第1照射領域及び第2照射領域の像に基づいて、被検物Aの形状を算出する演算装置19と、を備える。本開示によると、異なる照射領域に投影された照明光Lbの像を撮像することで、被検物Aの形状を適切に算出できる。 The shape measurement system 1 according to the present disclosure comprises a projection device 60 that projects illumination light Lb onto a first irradiation area (irradiation area ARA) and a second irradiation area (irradiation area ARB) that is located differently from the first irradiation area; a first imaging device 40 that captures images of the illumination light Lb projected onto the first irradiation area and the second irradiation area formed on the test object A; and a calculation device 19 that calculates the shape of the test object A based on the images of the first irradiation area and the second irradiation area captured by the first imaging device 40. According to the present disclosure, the shape of the test object A can be appropriately calculated by capturing images of the illumination light Lb projected onto different irradiation areas.

 投影装置60は、第1光源装置601Aと、第1光源装置601Aからの光の一部を透過する第1開口(開口OP)が形成されている第1光学素子603Aと、第2光源装置601Bと、第2光源装置601Bからの光の一部を透過する第2開口(開口OP)が形成されている第2光学素子603Bと、第1開口を通った光と第2開口を通った光とを合成する合成部605と、合成部605で合成された光を、投影する投影光学系606と、を有する。投影光学系606は、合成部で合成された光のうちで、第1開口を透過した光(照明光Lb1a、Lb1b)を第1照射領域に投影し、合成部で合成された光のうちで、第2開口を透過した光(照明光Lb2a、Lb2b)を第2照射領域に投影する。本開示によると、照明光Lbの像を異なる位置に適切に投影できる。 Projection device 60 includes a first light source device 601A, a first optical element 603A having a first opening (opening OP) formed therein that transmits a portion of the light from first light source device 601A, a second light source device 601B, a second optical element 603B having a second opening (opening OP) formed therein that transmits a portion of the light from second light source device 601B, a combining unit 605 that combines the light that has passed through the first opening and the light that has passed through the second opening, and a projection optical system 606 that projects the light combined by the combining unit 605. Projection optical system 606 projects the light that has passed through the first opening (illumination light Lb1a, Lb1b) of the light combined by the combining unit onto a first illumination region, and projects the light that has passed through the second opening (illumination light Lb2a, Lb2b) of the light combined by the combining unit onto a second illumination region. According to the present disclosure, an image of illumination light Lb can be appropriately projected at different positions.

 第1光学素子603A及び第2光学素子603Bは、入射した光を第1回折光と第2回折光とに分離する回折格子603aを含む。本開示によると、照明光Lbを適切に分離でき、被検物Aの3次元形状を適切に算出できる。 The first optical element 603A and the second optical element 603B include a diffraction grating 603a that separates the incident light into a first diffracted light and a second diffracted light. According to the present disclosure, the illumination light Lb can be properly separated, and the three-dimensional shape of the test object A can be properly calculated.

 第1光源装置601Aと第1光学素子603Aとの間には、第1光源装置601Aから照射される光を、その光の半値角の大きい角度のほうに拡げるレンズ(凹レンズ602b)が設けられ、第2光源装置601Bと第2光学素子603Bとの間には、第2光源装置601Bから照射される光を、その光の半値角の大きい角度のほうに拡げるレンズ(凹レンズ602b)が設けられる。本開示によると、光源装置601からの光を、半値角の大きい角度の方に拡げることで、元々の光の広がり角度を利用して、例えば横長(X方向に長い)照射領域を適切に設定できる。 A lens (concave lens 602b) is provided between first light source device 601A and first optical element 603A, which expands the light emitted from first light source device 601A toward the angle with the larger half-value angle of that light, and a lens (concave lens 602b) is provided between second light source device 601B and second optical element 603B, which expands the light emitted from second light source device 601B toward the angle with the larger half-value angle of that light. According to the present disclosure, by expanding the light from light source device 601 toward the angle with the larger half-value angle, it is possible to appropriately set, for example, a horizontally elongated (long in the X direction) illumination area by utilizing the original light expansion angle.

 形状測定システム1は、第1照射領域と第2照射領域とが第1方向(Y方向)に並ぶように設定される。本開示によると、Y方向に異なる照射領域に投影された照明光Lbの像を撮像することで、被検物Aの形状を適切に算出できる。 The shape measurement system 1 is set so that the first illumination area and the second illumination area are aligned in the first direction (Y direction). According to the present disclosure, the shape of the test object A can be appropriately calculated by capturing images of the illumination light Lb projected onto different illumination areas in the Y direction.

 投影装置60は、第1照射領域と第2照射領域とが第1方向(Y方向)に離れて設定される。本開示によると、第1照射領域と第2照射領域とが重なることを抑制でき、被検物Aの形状を適切に算出できる。 In the projection device 60, the first and second irradiation areas are set apart in the first direction (Y direction). According to the present disclosure, it is possible to prevent the first and second irradiation areas from overlapping, thereby enabling the shape of the test object A to be calculated appropriately.

 投影装置60は、第1照射領域と第2照射領域との間の距離が、第1照射領域及び第2照射領域の第1方向(Y方向)における長さよりも短くなるように、照明光Lbを投影する。本開示によると、複数の照射領域を含む全体の領域がY方向に長くなり過ぎることを抑制できる。 The projection device 60 projects the illumination light Lb so that the distance between the first and second illumination areas is shorter than the length of the first and second illumination areas in the first direction (Y direction). According to the present disclosure, it is possible to prevent the entire area including multiple illumination areas from becoming too long in the Y direction.

 投影装置60は、第1照射領域と第2照射領域の、第1方向(Y方向)における長さよりも、第1方向と直交する第2方向(X方向)における長さが長くなるように、照明光Lbを投影する。本開示によると、このようにX方向に長い照射領域を設定することで、フレームレートを適切な範囲に保ちつつ被検物Aの3次元形状を高精度に測定でき、1回の照明光Lbの照射で広い領域の形状を測定できる。 The projection device 60 projects the illumination light Lb so that the length of the first and second illumination areas in the second direction (X direction) perpendicular to the first direction (Y direction) is longer than the length of the first and second illumination areas in the first direction (Y direction). According to the present disclosure, by setting an illumination area that is long in the X direction in this manner, the three-dimensional shape of the test object A can be measured with high accuracy while maintaining the frame rate within an appropriate range, and the shape of a wide area can be measured with a single irradiation of the illumination light Lb.

 形状測定システム1は、第2方向(X方向)における、第1照射領域と第2照射領域の長さが同じである。本開示によると、被検物Aの形状を適切に算出できる。 In the shape measurement system 1, the lengths of the first and second irradiation areas in the second direction (X direction) are the same. According to the present disclosure, the shape of the test object A can be calculated appropriately.

 形状測定システム1は、第2方向(X方向)における、第1照射領域と第2照射領域の長さと、第1撮像装置40の撮像領域AR0一方の長さが同じである。本開示によると、第1照射領域と第2照射領域とを一度に適切に撮像できる。 In the shape measurement system 1, the lengths of the first and second irradiation areas in the second direction (X direction) are the same as the length of one of the imaging areas AR0 of the first imaging device 40. According to the present disclosure, the first and second irradiation areas can be properly imaged at the same time.

 形状測定システム1は、投影装置60と第1撮像装置40を含む撮像ユニット11と被検物Aを第1方向(Y方向)に相対移動させ、第1撮像装置40は被検物Aを撮像する。本開示によると、被検物Aの形状を適切に算出できる。 The shape measurement system 1 moves the imaging unit 11, which includes the projection device 60 and the first imaging device 40, and the test object A relative to each other in a first direction (Y direction), and the first imaging device 40 captures an image of the test object A. According to the present disclosure, the shape of the test object A can be appropriately calculated.

 形状測定システム1は、撮像ユニット11と被検物AをY方向に相対移動させ、第1照射領域で被検物Aを撮像したのちに、第2照射領域で被検物Aを撮像する。本開示によると、被検物Aの形状を適切に算出できる。 The shape measurement system 1 moves the imaging unit 11 and the test object A relative to each other in the Y direction, and after imaging the test object A in the first irradiation area, it images the test object A in the second irradiation area. According to the present disclosure, the shape of the test object A can be calculated appropriately.

 形状測定システム1は、被検物Aを撮像する第2撮像装置30を更に備え、演算装置19は、第2撮像装置30で撮像される被検物Aの像に基づいて、被検物Aの形状を算出する。本開示によると、被検物Aの形状を適切に算出できる。 The shape measurement system 1 further includes a second imaging device 30 that captures an image of the test object A, and the calculation device 19 calculates the shape of the test object A based on the image of the test object A captured by the second imaging device 30. According to the present disclosure, the shape of the test object A can be calculated appropriately.

 本開示に係る構造物の製造方法は、構造物(被検物A)の形状に関する設計情報を作成する設計工程と、設計情報に基づいて構造物を作製する成形工程と、作製された構造物の形状を形状測定システム1を用いて計測する計測工程と、計測工程で得られた形状情報と設計情報とを比較する検査工程と、を有する。本開示によると、構造物を適切に製造できる。 The method for manufacturing a structure according to the present disclosure comprises a design process for creating design information regarding the shape of the structure (test object A), a molding process for manufacturing the structure based on the design information, a measurement process for measuring the shape of the manufactured structure using shape measurement system 1, and an inspection process for comparing the shape information obtained in the measurement process with the design information. According to the present disclosure, structures can be manufactured appropriately.

 本開示に係る構造物の製造方法は、検査工程の比較結果に基づいて実行され、構造物の加工を実施するリペア工程を有する。本開示によると、構造物を適切にリペアできる。 The method for manufacturing a structure according to the present disclosure includes a repair process that is carried out based on the comparison results of the inspection process and processes the structure. According to the present disclosure, the structure can be appropriately repaired.

 本開示に係る製造システム200は、構造物(被検物A)の形状に関する設計情報を作成する設計装置202と、設計装置202に基づいて構造物を作製する成形装置204と、作製された前記構造物の形状を測定する形状測定システム1と、形状測定システム1によって得られた構造物の形状に関する形状情報と設計情報とを比較する制御装置(演算装置19)と、を含む。本開示によると、構造物を適切に製造できる。 The manufacturing system 200 according to the present disclosure includes a design device 202 that creates design information regarding the shape of a structure (subject A), a molding device 204 that creates the structure based on the design device 202, a shape measurement system 1 that measures the shape of the created structure, and a control device (arithmetic device 19) that compares the shape information regarding the shape of the structure obtained by the shape measurement system 1 with the design information. According to the present disclosure, structures can be appropriately manufactured.

 本開示に係る形状測定方法は、第1投影装置60aで第1照射領域に照明光Lbを投影することと、第2投影装置60bで第1照射領域とは異なる第2照射領域に照明光Lbを投影することと、被検物Aに形成される、第1照射領域及び第2照射領域に投影された照明光Lbの像を撮像することと、撮像される第1照射領域及び第2照射領域の像に基づいて、被検物の形状を算出することと、を含む。本開示によると、被検物Aの形状を適切に算出できる。 The shape measurement method according to the present disclosure includes projecting illumination light Lb onto a first irradiation area using a first projection device 60a, projecting illumination light Lb onto a second irradiation area different from the first irradiation area using a second projection device 60b, capturing images of the illumination light Lb projected onto the first irradiation area and the second irradiation area formed on the test object A, and calculating the shape of the test object based on the captured images of the first irradiation area and the second irradiation area. According to the present disclosure, the shape of the test object A can be calculated appropriately.

 本開示に係る形状測定方法は、投影装置60により、第1照射領域と、第1照射領域とは異なる位置の第2照射領域に照明光Lbを投影することと、被検物Aに形成される、第1照射領域及び第2照射領域に投影された照明光Lbの像を撮像することと、撮像される第1照射領域及び第2照射領域の像に基づいて、被検物の形状を算出することと、を含む。本開示によると、被検物Aの形状を適切に算出できる。 The shape measurement method according to the present disclosure includes projecting illumination light Lb onto a first irradiation area and a second irradiation area located differently from the first irradiation area using a projection device 60, capturing images of the illumination light Lb projected onto the first irradiation area and the second irradiation area formed on the test object A, and calculating the shape of the test object based on the captured images of the first irradiation area and the second irradiation area. According to the present disclosure, the shape of the test object A can be calculated appropriately.

 以上、添付図面を参照しながら本発明に係る好適な実施形態について説明したが、本発明は係る例に限定されないことは言うまでもない。上述した例において示した各構成部材の諸形状や組み合わせ等は一例であって、本発明の主旨から逸脱しない範囲において設計要求等に基づき種々変更可能である。前述の実施形態の各構成要素は、適宜組み合わせることができる。また、一部の構成要素を用いない場合もある。また、法令が許容される限りにおいて、前述の各実施形態で引用した検査装置などに関するすべての公開公報の開示を援用して本文の記載の一部とする。前述した実施形態に基づいて当業者等によりなされる他の実施形態及び運用技術等は、すべて本実施形態の範囲に含まれる。 Although preferred embodiments of the present invention have been described above with reference to the accompanying drawings, it goes without saying that the present invention is not limited to these examples. The shapes and combinations of the components shown in the above examples are merely examples, and various modifications can be made based on design requirements, etc., without departing from the spirit of the present invention. The components of the above-described embodiments can be combined as appropriate. Also, some components may not be used. Furthermore, to the extent permitted by law, the disclosures of all published patent applications relating to the inspection devices, etc. cited in the above-described embodiments are incorporated by reference into this description. All other embodiments and operational techniques, etc., made by those skilled in the art based on the above-described embodiments are included within the scope of this embodiment.

 1 形状測定システム
 11 撮像ユニット
 19 演算装置
 20 鏡筒
 30 第2撮像装置
 40 第1撮像装置
 50 照明装置
 60 投影装置
 60a 第1投影装置
 60b 第2投影装置
 70 落射照明装置
REFERENCE SIGNS LIST 1 Shape measurement system 11 Imaging unit 19 Computing device 20 Lens barrel 30 Second imaging device 40 First imaging device 50 Illumination device 60 Projection device 60a First projection device 60b Second projection device 70 Epi-illumination device

Claims (20)

 第1照射領域に照明光を投影する第1投影装置と、前記第1照射領域とは異なる第2照射領域に照明光を投影する第2投影装置と、を有する投影装置と、
 被検物に形成される、前記第1照射領域及び前記第2照射領域に投影された前記照明光の像を撮像する第1撮像装置と、
 前記第1撮像装置で撮像される前記第1照射領域及び前記第2照射領域の像に基づいて、前記被検物の形状を算出する演算装置と、
 を備える、形状測定システム。
a projection device including a first projection device that projects illumination light onto a first illumination area and a second projection device that projects illumination light onto a second illumination area different from the first illumination area;
a first imaging device that captures an image of the illumination light projected onto the first illumination region and the second illumination region formed on the test object;
a computing device that calculates a shape of the test object based on images of the first irradiation region and the second irradiation region captured by the first imaging device;
A shape measurement system comprising:
 前記第1撮像装置の光軸は、前記第1投影装置と前記第2投影装置の間に位置する、請求項1に記載の形状測定システム。 The shape measurement system of claim 1, wherein the optical axis of the first imaging device is located between the first projection device and the second projection device.  第1照射領域と、前記第1照射領域とは異なる位置の第2照射領域に照明光を投影する投影装置と、
 被検物に形成される、前記第1照射領域及び前記第2照射領域に投影された前記照明光の像を撮像する第1撮像装置と、
 前記第1撮像装置で撮像される前記第1照射領域及び前記第2照射領域の像に基づいて、前記被検物の形状を算出する演算装置 と、
 を備える、形状測定システム。
a projection device that projects illumination light onto a first illumination area and a second illumination area that is located at a position different from the first illumination area;
a first imaging device that captures an image of the illumination light projected onto the first illumination region and the second illumination region formed on the test object;
a computing device that calculates a shape of the test object based on images of the first irradiation area and the second irradiation area captured by the first imaging device;
A shape measurement system comprising:
 前記投影装置は、
 第1光源装置と、
 前記第1光源装置からの光の一部を透過する第1開口が形成されている第1光学素子と、
 第2光源装置と、
 前記第2光源装置からの光の一部を透過する第2開口が形成されている第2光学素子と、
 前記第1開口を通った光と前記第2開口を通った光とを合成する合成部と、
 前記合成部で合成された光を、投影する投影光学系と、
 を有し、
 前記投影光学系は、前記合成部で合成された光のうちで、前記第1開口を透過した光を前記第1照射領域に投影し、前記合成部で合成された光のうちで、前記第2開口を透過した光を前記第2照射領域に投影する、請求項3に記載の形状測定システム。
The projection device is
a first light source device;
a first optical element having a first opening formed therein that transmits a portion of the light from the first light source device;
a second light source device;
a second optical element having a second opening formed therein that transmits a portion of the light from the second light source device;
a combining unit that combines the light that has passed through the first opening and the light that has passed through the second opening;
a projection optical system that projects the light combined by the combining unit;
and
4. The shape measurement system according to claim 3, wherein the projection optical system projects, from the light combined by the combining unit, light that has passed through the first opening onto the first illumination area, and projects, from the light combined by the combining unit, light that has passed through the second opening onto the second illumination area.
 前記第1光学素子及び前記第2光学素子は、入射した光を第1回折光と第2回折光とに分離する回折格子を含む、請求項4に記載の形状測定システム。 The shape measurement system of claim 4, wherein the first optical element and the second optical element include a diffraction grating that separates incident light into a first diffracted light and a second diffracted light.  前記第1光源装置と前記第1光学素子との間には、前記第1光源装置から照射される光を、前記光の半値角の大きい角度のほうに拡げるレンズが設けられ、
 前記第2光源装置と前記第2光学素子との間には、前記第2光源装置から照射される光を、前記光の半値角の大きい角度のほうに拡げるレンズが設けられる、請求項4または5に記載の形状測定システム。
a lens that expands the light emitted from the first light source device toward a larger half-value angle of the light is provided between the first light source device and the first optical element;
6. The shape measurement system according to claim 4, wherein a lens is provided between the second light source device and the second optical element, the lens expanding the light emitted from the second light source device toward a larger half-value angle of the light.
 前記投影装置は、前記第1照射領域と前記第2照射領域とが第1方向に並ぶように設定される、請求項1から6のいずれか一項に記載の形状測定システム。 The shape measurement system described in any one of claims 1 to 6, wherein the projection device is configured so that the first illumination area and the second illumination area are aligned in a first direction.  前記投影装置は、前記第1照射領域と前記第2照射領域とが、前記第1方向に離れて設定される、請求項7に記載の形状測定システム。 The shape measurement system of claim 7, wherein the projection device sets the first illumination area and the second illumination area apart in the first direction.  前記投影装置は、前記第1照射領域と前記第2照射領域との間の距離が、前記第1照射領域及び前記第2照射領域の前記第1方向における長さよりも短くなるように、前記照明光を投影する、請求項8に記載の形状測定システム。 The shape measurement system of claim 8, wherein the projection device projects the illumination light so that the distance between the first illumination area and the second illumination area is shorter than the length of the first illumination area and the second illumination area in the first direction.  前記投影装置は、前記第1照射領域と前記第2照射領域の、前記第1方向における長さよりも、前記第1方向と直交する第2方向における長さが長くなるように、前記照明光を投影する、請求項7から請求項9のいずれか一項に記載の形状測定システム。 The shape measurement system described in any one of claims 7 to 9, wherein the projection device projects the illumination light so that the length of the first illumination area and the second illumination area in a second direction perpendicular to the first direction is longer than the length in the first direction.  前記第2方向における、前記第1照射領域と前記第2照射領域の長さが同じである、請求項10に記載の形状測定システム。 The shape measurement system of claim 10, wherein the lengths of the first illumination area and the second illumination area in the second direction are the same.  前記第2方向における、前記第1照射領域と前記第2照射領域の長さと、前記第1撮像装置の撮像領域の一方の長さが同じである、請求項11に記載の形状測定システム。 The shape measurement system of claim 11, wherein the lengths of the first and second illumination areas in the second direction are the same as the length of one of the imaging areas of the first imaging device.  前記投影装置と前記第1撮像装置を含む撮像ユニットと前記被検物を前記第1方向に相対移動させ、前記第1撮像装置は前記被検物を撮像する、請求項7から請求項12のいずれか一項に記載の形状測定システム。 The shape measurement system described in any one of claims 7 to 12, wherein an imaging unit including the projection device and the first imaging device and the test object are moved relative to each other in the first direction, and the first imaging device images the test object.  前記撮像ユニットと前記被検物を前記第1方向に相対移動させ、前記第1照射領域で前記被検物を撮像したのちに、前記第2照射領域で前記被検物を撮像する、請求項13に記載の形状測定システム。 The shape measurement system of claim 13, wherein the imaging unit and the test object are moved relative to each other in the first direction, and after imaging the test object in the first irradiation area, the test object is imaged in the second irradiation area.  前記被検物を撮像する第2撮像装置を更に備え、
 前記演算装置は、前記第2撮像装置で撮像される前記被検物の像に基づいて、前記被検物の形状を算出する、請求項1から14のいずれか一項に記載の形状測定システム。
further comprising a second imaging device that images the test object;
The shape measurement system according to claim 1 , wherein the arithmetic unit calculates the shape of the test object based on an image of the test object captured by the second imaging device.
 構造物の形状に関する設計情報を作成する設計工程と、
 前記設計情報に基づいて前記構造物を作製する成形工程と、
 作製された前記構造物の形状を請求項1から15のいずれか一項に記載の形状測定システムを用いて計測する計測工程と、
 前記計測工程で得られた形状情報と前記設計情報とを比較する検査工程と、を有する、
 構造物の製造方法。
a design process for creating design information regarding the shape of a structure;
a molding process of fabricating the structure based on the design information;
a measuring step of measuring the shape of the fabricated structure using the shape measurement system according to any one of claims 1 to 15;
an inspection step of comparing the shape information obtained in the measurement step with the design information,
Methods for manufacturing structures.
 前記検査工程の比較結果に基づいて実行され、前記構造物の加工を実施するリペア工程を有する、請求項16に記載の構造物の製造方法。 The method for manufacturing a structure described in claim 16, further comprising a repair process that is performed based on the comparison results of the inspection process and processes the structure.  構造物の形状に関する設計情報を作成する設計装置と、
 前記設計装置に基づいて前記構造物を作製する成形装置と、
 作製された前記構造物の形状を測定する請求項1から14のいずれか一項に記載の形状測定システムと、
 前記形状測定システムによって得られた前記構造物の形状に関する形状情報と前記設計情報とを比較する制御装置と、を含む、構造物製造システム。
a design device that creates design information related to the shape of a structure;
a molding device that produces the structure based on the design device;
a shape measurement system according to any one of claims 1 to 14, which measures a shape of the fabricated structure;
a control device that compares shape information regarding the shape of the structure obtained by the shape measurement system with the design information.
 第1投影装置で第1照射領域に照明光を投影することと、
 第2投影装置で前記第1照射領域とは異なる第2照射領域に照明光を投影することと、
 被検物に形成される、前記第1照射領域及び前記第2照射領域に投影された前記照明光の像を撮像することと、
 撮像される前記第1照射領域及び前記第2照射領域の像に基づいて、前記被検物の形状を算出することと、
 を含む、形状測定方法。
projecting illumination light onto a first illumination area using a first projection device;
projecting illumination light onto a second illumination area different from the first illumination area using a second projection device;
capturing an image of the illumination light projected onto the first illumination region and the second illumination region formed on the test object;
calculating a shape of the test object based on the captured images of the first irradiation region and the second irradiation region;
A shape measurement method comprising:
 投影装置により、第1照射領域と、前記第1照射領域とは異なる位置の第2照射領域に照明光を投影することと、
 被検物に形成される、前記第1照射領域及び前記第2照射領域に投影された前記照明光の像を撮像することと、
 撮像される前記第1照射領域及び前記第2照射領域の像に基づいて、前記被検物の形状を算出することと、
 を含む、形状測定方法。
projecting illumination light onto a first illumination area and a second illumination area located at a position different from the first illumination area using a projection device;
capturing an image of the illumination light projected onto the first illumination region and the second illumination region formed on the test object;
calculating a shape of the test object based on the captured images of the first irradiation region and the second irradiation region;
A shape measurement method comprising:
PCT/JP2024/012508 2024-03-27 2024-03-27 Shape measurement system, structure manufacturing method, structure manufacturing system, and shape measurement method Pending WO2025203395A1 (en)

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JP2009098044A (en) * 2007-10-18 2009-05-07 Nikon Corp Shape measuring device
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Publication number Priority date Publication date Assignee Title
JP2002191058A (en) * 2000-12-20 2002-07-05 Olympus Optical Co Ltd Three-dimensional image acquisition device and three- dimensional image acquisition method
JP2009098044A (en) * 2007-10-18 2009-05-07 Nikon Corp Shape measuring device
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