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WO2025201879A1 - Élément de refroidissement et empilement comprenant un tel élément de refroidissement - Google Patents

Élément de refroidissement et empilement comprenant un tel élément de refroidissement

Info

Publication number
WO2025201879A1
WO2025201879A1 PCT/EP2025/056702 EP2025056702W WO2025201879A1 WO 2025201879 A1 WO2025201879 A1 WO 2025201879A1 EP 2025056702 W EP2025056702 W EP 2025056702W WO 2025201879 A1 WO2025201879 A1 WO 2025201879A1
Authority
WO
WIPO (PCT)
Prior art keywords
specific
cooling element
fins
cross
parameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/EP2025/056702
Other languages
English (en)
Inventor
Remco Van Erp
Miguel Angel Salazar De Troya
Athanasios Boutsikakis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corintis Sa
Original Assignee
Corintis Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corintis Sa filed Critical Corintis Sa
Publication of WO2025201879A1 publication Critical patent/WO2025201879A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Definitions

  • a cooling element comprising at least one volume in which, at least in a state in which the cooling element is in heat-transferring contact with another element from which heat is to be dissipated during use, at least in regions a liquid cooling agent can flow, especially from at least one inlet towards at least one outlet, so that heat can be dissipated, wherein within the volume a network of interconnected channels for guiding the cooling agent is provided, wherein within the volume two or more fins are provided, which contribute to the formation of boundaries of the channels of the network of interconnected channels, wherein preferably (i) the number of fins is larger than 10; (ii) there are at least 10 fins which in at least one cross-sectional plane of the cooling element have different cross-sectional shapes; (iii) the fins are at least in part unevenly distributed within the volume; and/or (iv) for each section of at least one, preferably two or more, sections of the network of interconnected channels
  • the another element from which heat is to be dissipated during use is also referred to as the cooled element or as the element to be cooled.
  • the cooled element or the element to be cooled
  • the element to be cooled may be a semiconductor device, i.e. an integrated circuit board (IC).
  • the cooling element may be a microfluidic cooling element.
  • the volume, within which the network of interconnected channels is considered is defined in an arbitrary way.
  • the volume, within which the network of interconnected channels is considered comprises at least one part of a global network of interconnected channels of the cooling element.
  • the flow of the liquid cooling agent can be controlled in a preferred manner, hence, a particular high cooling efficiency can be obtained.
  • Said cross-sectional plane of the cooling element may be a plane which extends parallel to at least two directions of flow of the liquid cooling agent within the network of interconnected channels.
  • said cross-sectional plane of the cooling element may be a horizontal plane.
  • Said cross-sectional plane preferably is parallel to a bottom surface of the cooling element which especially is or can be attached to the element to be cooled.
  • the fins are at least in part unevenly distributed within the volume, a particular efficient flow of the liquid cooling agent is possible.
  • the fins provided within the volume may be regarded as an inhomogeneous cooling structure.
  • two or more such volumes may be defined within which respective inhomogeneous cooling structures of identical or different design may be provided.
  • the cooling element may comprise at least one other volume within which a regular cooling structure is provided.
  • the other volume within which a regular cooling structure is provided is adjacent to and/or in fluidal communication with the volume defined above which comprises said fins.
  • a perimeter can be associated with the respective specific fin, wherein for each specific fin a perimeter parameter P e can be defined which takes the value of the length of its associated perimeter, and wherein preferably for each specific fin a surface can be associated with the respective specific fin, the surface being an area enclosed by the perimeter associated with the respective specific fin, wherein for each specific fin a surface parameter S e can be defined which takes the value of the area of its associated surface
  • Said cross-sectional plane of the cooling element in which the cross section lies may be a plane which extends parallel to at least two directions of flow of the liquid cooling agent within the network of interconnected channels.
  • a normal vector of the cross-sectional plane may be perpendicular to the main flow of the liquid cooling agent within the network of interconnected channels within the volume.
  • said cross-sectional plane of the cooling element may be a horizontal plane.
  • Said cross-sectional plane preferably is parallel to a bottom surface of the cooling element which surface especially is or can be attached to the element to be cooled.
  • the cross-sectional plane is the identical one as described above with respect to the cross-sectional shapes of different fins, but in embodiments the two cross-sectional planes may also be different, especially parallel to each other.
  • Obtaining a perimeter parameter for an individual specific fin is easily possible. For example, within the cross section a length of the perimeter of that specific fin can be determined. The length (e.g. value X) is then the value the perimeter parameter of that specific fin takes for that specific fin.
  • the perimeter of a specific fin is an outer and/or closed perimeter of the specific fin in the cross section.
  • the entire surface (especially the entire outer surface) of the specific fin is considered for this purpose.
  • the surface parameter is a variable which can be used to describe the design of the cooling element in a preferred manner.
  • Obtaining a surface parameter for an individual specific fin is easily possible. For example, once the perimeter of the specific fin is determined, the area enclosed within that perimeter can be determined which is the surface. The area (e.g. value X) is then the value the surface parameter of that specific fin takes for that specific fin.
  • the surface refers to a fully filled area enclosed by the perimeter.
  • the area of the surface also covers the hollow portion lying within the cross section.
  • a process of designing a preferred cooling element may incorporate adjusting the perimeters of the specific fins such that the perimeter parameters and/or surface parameters of the specific fins fulfill one or more constraints, as will be described below in more detail.
  • each equivalent-diameter parameter D e has a value between 1 pm and 1500 pm, especially between 7 pm and 1300 pm,
  • the mean value of the equivalent-diameter parameters of the specific fins is between 100 pm and 700 pm, especially between 150 pm and 500 pm,
  • the median value of the equivalent-diameter parameters of the specific fins is between 150 pm and 700 pm, especially between 177 pm and 447 pm,
  • the mode value of the equivalent-diameter parameters of the specific fins is between 150 pm and 600 pm, especially between 171 pm and 485 pm, and/or
  • the standard deviation of the equivalent-diameter parameters of the specific fins is between 30 pm and 350 pm, especially between 50 pm and 200 pm, and/or is between % and 1 of the mean value of the equivalent-diameter parameters of the specific fins.
  • the equivalent-diameter parameter is a variable which can be used to describe the design of the cooling element in a preferred manner.
  • an equivalent-diameter parameter for an individual specific fin is easily possible. For example, once the surface parameter of that specific fin has been determined, also the equivalent-diameter parameter can be determined in a straightforward manner for that specific fin. The outcome of the right-hand side of the equation (e.g. value X) is then the value the equivalent-diameter parameter of that specific fin takes for that specific fin.
  • the equivalent-diameter parameters of all specific fins are considered.
  • a histogram of the equivalent-diameter parameters of the specific fins can be or is determined and which histogram follows a normal distribution, especially having a skewness between 0 and 2, especially between 0 and 1.7.
  • a process of designing a preferred cooling element may incorporate adjusting the perimeters of the specific fins such that the histogram of the equivalent-diameter parameters of the specific fins is of the respective type of distribution and/or has the respective skewness.
  • each roundness parameter a has a value between 0.00 and 1.0, especially between 0.0 and 0.86
  • the mean value of the roundness parameters of the specific fins is between 0.2 and 0.7, especially between 0.34 and 0.61 ,
  • the median value of the roundness parameters of the specific fins is between 0.2 and 0.8, especially between 0.31 and 0.65,
  • the standard deviation of the roundness parameters of the specific fins is between 0.1 and 0.3, especially between 0.1 and 0.2. It turns out that the roundness parameter is a variable which can be used to describe the design of the cooling element in a preferred manner.
  • Obtaining a roundness parameter for an individual specific fin is easily possible. For example, once the perimeter parameter and the surface parameter of that specific fin have been determined, also the roundness parameter can be determined in a straight-forward manner for that specific fin. The outcome of the right-hand side of the equation (e.g. value X) is then the value the roundness parameter of that specific fin takes for that specific fin.
  • the roundness parameters of all specific fins are considered.
  • a histogram of the roundness parameters of the specific fins can be or is determined and which histogram follows a beta distribution, especially having a skewness between -1.3 and 1.5, especially between 0.25 and 0.5, between 0.5 and 1.5 or between -1.2 and -0.05.
  • the histogram and/or the distribution has a mean value, a median value, a mode value and/or a standard deviation as stated above for the roundness parameters.
  • a mean-diameter parameter s e d 32 4— * e , with P e being the perimeter parameter and S e being the surface parameter, respectively, of the respective specific fin, can be defined, wherein preferably
  • each mean-diameter parameter d 32 has a value between 3 pm and 800 pm, especially between 7 pm and 685 pm,
  • the mean value of the mean-diameter parameters of the specific fins is between 100 pm and 350 pm, especially between 125 pm and 295 pm,
  • the median value of the mean-diameter parameters of the specific fins is between 100 pm and 400 pm, especially between 127 pm and 300 pm,
  • the mode value of the mean-diameter parameters of the specific fins is between 100 pm and 400 pm, especially between 130 pm and 300 pm, and/or
  • the standard deviation of the mean-diameter parameters of the specific fins is between 20 pm and 200 pm, especially between 30 pm and 80 pm, and/or is between % and 1 of the mean value of the mean-diameter parameters of the specific fins.
  • a cooling element with specific fins the mean-diameter parameters d 32 of which result in a histogram of respective type of distribution and/or having a respective skewness turn out to have a particularly high cooling efficiency.
  • the mean-diameter parameters d 32 of all specific fins are considered.
  • the mode value of the channel-width parameters of all pixels within the region of the pixelized representation is between 120 pm and 250 pm, especially between 142 pm and 225 pm, and/or
  • Obtaining a channel-width parameter for an individual pixel of the at least one region of the pixelized representation is easily possible.
  • the channel-width parameter can be determined in a straightforward manner for each of these pixels by calculating the inverse of the density parameter of the respective pixel.
  • the inverse e.g. value X
  • the channel-width parameters of all pixels within the at least one region are considered.
  • the channel-width parameters of all pixels within the at least one region of a preferred cooling element therefore, fulfill one or more of the respective statistical variables.
  • a preferred cooling element fulfills one or more of the statistical variables.
  • a process of designing a preferred cooling element may incorporate adjusting the perimeters of the specific fins such that ultimately the channel-width parameters of all pixels within the at least one region fulfill one or more of the respective statistical variables.
  • a histogram of the channel-width parameters of all pixels within the region of the pixelized representation can be or is determined and which histogram follows a beta distribution, especially having a skewness between 0 and 3, especially between 1 and 3.
  • the channel-width parameters of all pixels within the at least one region are considered.
  • a process of designing a preferred cooling element may incorporate adjusting the perimeters of the specific fins such that the histogram of the channel-width parameters of all pixels within the at least one region is of the respective type of distribution and/or has the respective skewness.
  • the histogram and/or the distribution has a mean value, a median value, a mode value and/or a standard deviation as stated above for the channel-width parameters.
  • the histograms of the parameters equivalentdiameter parameter, roundness parameter, mean-diameter parameter, density parameter and channel-width parameter can be determined, wherein at least two, preferably three or more, of the histograms follow a skewed distribution, at least one, preferably two or more, of which follows a left skewed distribution and at least one of which follows a right skewed distribution, especially the histogram of the equivalent-diameter parameter, mean-diameter parameter, density parameter and/or channel-width parameter follows a left skewed distribution and/or the histogram of the roundness parameters follow a right skewed distribution.
  • a process of designing a preferred cooling element may incorporate adjusting the perimeters of the specific fins such that the histograms of the at least two parameters have a respective skewed distribution.
  • a material with good thermal conductivity can be a material having a thermal conductivity of between 100 W/ (m K) and 2000 W/ (m K), especially between 120 W/ (m K) and 450 W/ (m K).
  • the material may be silicon and/or may have a thermal conductivity of 149 W/ (m K).
  • the material may be copper and/or may have a thermal conductivity of 398 W/ (m K).
  • the number of specific fins is between 2 and 300,000,000.
  • the width of the cross section may be between 1 mm and 100 mm, especially between 5 mm and 40 mm, and/or the height of the cross section may be between 1 mm and 100 mm, especially between 5 mm and 40 mm.
  • the at least one region of the pixelized representation is a rectangular region and/or corresponds to a portion of the cross section of the volume lying within the cross-sectional plane which has an area of at least 10 %, 20 %, 30 %, 50 % or 70 % of the total area of the cross-section of the cooling element.
  • the cooling element is designed as a cooling structure, especially as a microfluidic cooling structure.
  • the cooling structure can be a separate structure from the element to be cooled or a structure built at least in part in one piece with the element to be cooled.
  • the cooling structure can also be a structure which is integrated at least in part in the element to be cooled.
  • the fins can be designed with customized shapes.
  • the volume is enclosed at least in part by a solid frame.
  • the cooling element may be integrated in a semiconductor device.
  • the cooling element may be located on a surface of the chip.
  • the cooling element may be an integral part of the element to be cooled.
  • Fig. 6 shows a histogram of the roundness parameters of all specific fins of the cross section 17 of Fig. 3.
  • the histogram follows a beta distribution with parameter alpha is 1.99 and parameter beta is 2.67.
  • the mean value is 0.36.
  • PDF fit of the distribution
  • Fig. 7 shows a histogram of the mean-diameter parameters of all specific fins of the cross section 17 of Fig. 3.
  • the histogram follows a normal distribution having a mean value of 247.1 pm and a standard deviation of 79.35 pm.
  • PDF fit of the distribution

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un élément de refroidissement. La présente invention concerne également un empilement comprenant un tel élément de refroidissement.
PCT/EP2025/056702 2024-03-27 2025-03-12 Élément de refroidissement et empilement comprenant un tel élément de refroidissement Pending WO2025201879A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
EP24386035.0 2024-03-27
EP24386035 2024-03-27
DE102024109004.9 2024-03-28
DE102024109004 2024-03-28

Publications (1)

Publication Number Publication Date
WO2025201879A1 true WO2025201879A1 (fr) 2025-10-02

Family

ID=94968519

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2025/056702 Pending WO2025201879A1 (fr) 2024-03-27 2025-03-12 Élément de refroidissement et empilement comprenant un tel élément de refroidissement

Country Status (1)

Country Link
WO (1) WO2025201879A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090065178A1 (en) * 2005-04-21 2009-03-12 Nippon Light Metal Company, Ltd. Liquid cooling jacket
US20090145581A1 (en) * 2007-12-11 2009-06-11 Paul Hoffman Non-linear fin heat sink
US20220007542A1 (en) * 2020-07-01 2022-01-06 Pusan National University Industry-University Cooperation Foundation Composite pin fin heat sink with improved heat dissipation performance

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090065178A1 (en) * 2005-04-21 2009-03-12 Nippon Light Metal Company, Ltd. Liquid cooling jacket
US20090145581A1 (en) * 2007-12-11 2009-06-11 Paul Hoffman Non-linear fin heat sink
US20220007542A1 (en) * 2020-07-01 2022-01-06 Pusan National University Industry-University Cooperation Foundation Composite pin fin heat sink with improved heat dissipation performance

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