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WO2025249467A1 - Reflectarray - Google Patents

Reflectarray

Info

Publication number
WO2025249467A1
WO2025249467A1 PCT/JP2025/019253 JP2025019253W WO2025249467A1 WO 2025249467 A1 WO2025249467 A1 WO 2025249467A1 JP 2025019253 W JP2025019253 W JP 2025019253W WO 2025249467 A1 WO2025249467 A1 WO 2025249467A1
Authority
WO
WIPO (PCT)
Prior art keywords
reflection
angle
reflectarray
incident
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2025/019253
Other languages
French (fr)
Japanese (ja)
Inventor
大輝 西村
順平 今井
慎平 近藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Holdings Inc
Original Assignee
Toppan Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Holdings Inc filed Critical Toppan Holdings Inc
Publication of WO2025249467A1 publication Critical patent/WO2025249467A1/en
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q15/00Devices for reflection, refraction, diffraction or polarisation of waves radiated from an antenna, e.g. quasi-optical devices
    • H01Q15/14Reflecting surfaces; Equivalent structures

Definitions

  • the present invention relates to a reflectarray.
  • millimeter-wave radar sensors
  • sensors which use high-frequency electromagnetic waves to measure distances and detect moving objects with high precision
  • millimeter-wave radar is being used in a variety of fields, including mobility, robotics, security, and healthcare.
  • millimeter-wave radar is used in onboard radars for advanced driver assistance systems and autonomous driving technology, accurately measuring the position, speed, and distance of other vehicles and pedestrians, enabling safe following distances and obstacle avoidance.
  • millimeter-wave sensors are used in non-contact sensors for monitoring and medical monitoring, enabling them to detect human movement, falls, and subtle changes in heart rate and breathing, even in dark places and through obstacles.
  • a reflectarray is a component that reflects electromagnetic waves, and includes not only those that perform symmetrical reflection where the angle of incidence and the angle of reflection are equal, but also those that perform asymmetrical reflection where the angle of incidence and the angle of reflection are different, those that retroreflect electromagnetic waves in the direction of incidence, those that scatter electromagnetic waves in multiple directions, and those that concentrate electromagnetic waves at a specific location.
  • Patent Document 1 discloses a frequency-selective reflector (reflector array) that reflects electromagnetic waves of a specific frequency band in a direction different from the direction of specular reflection, and that can widen or narrow the reflected beam of a plane wave incident from a uniform incident direction by arranging a main region and multiple sub-regions with different reflection directions.
  • Patent Document 2 also discloses a reflectarray that enables communication at multiple incident and reflection angles without reducing directional gain by arranging multiple supercells, each of which has one first element and one second element arranged in a row.
  • 5G and 6G communications face issues where communication stability can be compromised if the angle of incidence or reflection of the reflectarray's incident or reflected beam deviates from the design, such as (a) a deviation in the installation position or angle of the reflectarray, (b) a deviation in the terminal position, or (c) the terminal being unable to obtain sufficient reception power if an obstacle such as a person or object temporarily exists in the incident or reflected beam.
  • Millimeter-wave radar sensors
  • motion detection stability can be compromised for similar reasons.
  • Patent Document 1 discloses a function for adjusting the reflected beam profile of a frequency selective reflector to widen the beam width of a reflected wave for a plane wave incident from a predetermined design angle of incidence, but does not explain how a similar function can be provided for a plane wave incident from an angle other than the design angle of incidence.
  • Patent Document 1 also discloses a function for widening the reflected beam of a spherical wave for a spherical wave incident, but this is done by correcting the difference in the incident direction vector of the spherical incident wave, which is uniquely determined for each divided region, and setting the reflection direction vector for each divided region to be different, and does not explain the effect of the incident from a direction deviated from the uniquely determined incident direction vector.
  • Patent Document 2 describes that communication is possible using a plurality of incident and reflection angles, it does not recognize the problem of ensuring communication stability when the incident angle or reflection angle of the incident or reflected beam deviates from the design. Therefore, an object of the present invention is to provide a technology that enables stable communication and moving object detection even when the angle of incidence or angle of reflection of the incident or reflected beam of the reflectarray deviates from the design.
  • one representative reflectarray of the present invention has a plurality of types of reflection control regions that most strongly reflect a plane wave from an arbitrary design incident angle ⁇ i that satisfies Equation (1) to an arbitrary design reflection angle ⁇ r that satisfies Equation (2) for an electromagnetic wave in a specific frequency band
  • a plane wave incident within an angle range of ⁇ degrees (hereinafter referred to as the "downstream incident angle range ⁇ ") that satisfies formula ( 3 ) around the design central incident angle [ ⁇ i 0 ]d is strongly reflected within the downstream reflection angle range ⁇ so that the average value of the reflection intensity (bistatic RCS) within the angle range of ⁇ degrees (hereinafter referred to as the "downstream reflection angle range ⁇ ") around the design central reflection angle [ ⁇ r 0 ]d is 5 dB or more higher than the average value of the reflection intensity within the angle range of -90 degrees to 90 degrees excluding the downstream reflection angle range ⁇ ,
  • FIG. 1 is a cross-sectional view showing an example of a layer structure of a reflect array.
  • FIG. 2 is a diagram showing an example of an element pattern shape.
  • FIG. 3 is an example of a schematic diagram showing an enlarged reflection control area portion.
  • FIG. 4 is a schematic diagram illustrating characteristic 1 of a single reflectarray.
  • FIG. 5 is a schematic diagram illustrating characteristic 2 of a single reflectarray.
  • FIG. 6 is a schematic diagram illustrating characteristic 3 of a single reflectarray.
  • FIG. 7 is a schematic diagram showing an example of a failure in radio wave relay using a single reflectarray.
  • FIG. 8 is a schematic diagram illustrating the function realized by the reflect array according to this embodiment.
  • FIG. 8 is a schematic diagram illustrating the function realized by the reflect array according to this embodiment.
  • FIG. 9A is a schematic diagram showing an overall image of incident and reflected downstream communication radio waves (or radiation waves) in the reflect array of the first embodiment.
  • FIG. 9B is a schematic diagram showing an overall image of incident and reflected upstream communication radio waves (or received waves) in the reflect array of the second embodiment.
  • FIG. 10 is a schematic diagram of an arrangement of reflection control regions (groups) in the reflect array of Example 1.
  • FIG. 11 is a graph showing reflection patterns (bistatic RCS) of the reflectarrays of Example 1 and Comparative Examples 1 and 2.
  • FIG. 12 is a graph showing the reflection patterns (bistatic RCS) of the reflectarrays of Example 2 and Comparative Example 3.
  • an xyz coordinate system is applied, and the reflectarray is formed on the xy plane.
  • the positive direction of the z axis is sometimes referred to as upward, and the negative direction as downward.
  • a view of the xy plane viewed from above the z axis (planar view) is called a plan view, and a view of a plane cut by a plane parallel to the z axis viewed from the perpendicular direction (cross-section view) is called a cross-sectional view.
  • the shape of the reflectarray in the xy plane is arbitrary, but in the following description, the reflectarray is assumed to be the simplest rectangle, and is formed so that each side of the reflectarray is parallel to the x-axis and y-axis, respectively.
  • surface may refer not only to the surface of a plate-shaped member, but also to the interface of a layer contained in a plate-shaped member that is approximately parallel to the surface of the plate-shaped member.
  • upper surface and lower surface refer to the surface shown at the top or bottom of a drawing of a plate-shaped member or a layer contained in a plate-shaped member.
  • electromagnetic waves are assumed to be plane waves, but when referring to plane waves, this also includes electromagnetic waves whose wavefronts can be considered to be virtually flat at far-field distances.
  • electromagnetic waves are sometimes simply referred to as plane waves.
  • the wavefront theoretically extends infinitely, in practice, the wavefront can be considered to be virtually flat at far-field distances. This property is used in various fields of physics and engineering, and its application is also possible within the scope of this disclosure.
  • Fig. 1 is a cross-sectional view showing an example of the layer configuration of a reflectarray.
  • the reflectarrays 4 and 40 have a configuration in which at least an element pattern 1, a dielectric layer 2, and a ground layer 3 are layered in a direction from the +z-axis direction to the -z-axis direction.
  • the configuration consisting of the three layers of the element pattern 1, the dielectric layer 2, and the ground layer 3 will be referred to as the "basic configuration.”
  • the reflectarray have one or more layers (additional function layers 5) having various functions laminated on the element pattern 1 side of the basic configuration, the ground layer 3 side, or both.
  • the lamination method on the element pattern 1 side may be to completely fill the gaps between the elements, or to cover the upper surfaces of the elements while leaving the gaps between the elements.
  • the additional function layers 5 include a design layer that takes the scenery into consideration, an installation layer that makes it easy to install the electromagnetic wave reflector on a wall, ceiling, support, etc., a protective layer that protects the basic configuration, and a functional layer that imparts various functions.
  • an adhesion improving layer may be formed between the element pattern 1 and the dielectric layer 2, between the ground layer 3 and the dielectric layer 2, and between the dielectric layer 2 and the element pattern 1 and the additional function layer 5 in order to improve the adhesion between the elements.
  • the adhesion improving layer is made of an adhesive.
  • the adhesive may be a water-dispersion adhesive, a solution-based adhesive, a solventless adhesive, or a solid-based adhesive.
  • the aforementioned additional functional layer and adhesion improving layer are sometimes collectively referred to as functional layers.
  • the element pattern 1 is provided to asymmetrically reflect the incident electromagnetic wave in a direction different from that of the symmetric reflection.
  • the thickness of the element pattern is, for example, 10 nm to 105 ⁇ m.
  • the element pattern 1 preferably has a surface resistance of 100 ⁇ / ⁇ or less.
  • the material used for the element pattern 1 may be, for example, a conductive material.
  • the same material as that used for the ground layer 3 may be used.
  • a film of a conductive inorganic or organic material may be formed on the dielectric layer. From the viewpoints of flexibility, film-forming properties, stability, sheet resistance, and low cost, it is preferable to use a film formed by vapor deposition, which is a formation method described below, as the element pattern 1.
  • the shape of the element pattern 1 can be, but is not limited to, a cross patch.
  • Figure 2 is a diagram showing an example of the element pattern shape.
  • a reflectarray may be formed using element patterns 1 of any shape that reflects radio waves, such as a continuous film, a mesh, or a punched shape.
  • element pattern 1 is a cross patch.
  • a cross patch refers to a shape in the xy plane where two rectangular patches intersect at right angles.
  • the length of the cross patch element pattern is called the element length
  • the width of the cross patch element pattern is called the element width.
  • the reflection phase of the unit cell is controlled by varying either the element length or the element width, or both.
  • the element length is fixed, it is desirable to set the element length value as large as possible within the unit cell. Setting it large makes it easier to obtain the desired reflection phase characteristics.
  • the element width is fixed, it is desirable to set the element width value as large as possible within the unit cell. Setting the element width value large makes the slope of the reflection phase gentler, thereby improving processing accuracy.
  • the element length is not limited to being set for cross patch element patterns, but can also be set for element patterns with other shapes.
  • the element length can be set to a common length within the reflection control region, or it can be set to a different length for each element pattern included in the reflection control region.
  • the method of forming the element pattern 1 can be a method of forming a conductive material over the entire surface of the dielectric layer 2 to form a continuous film, and then forming the element pattern by processing, or a method of forming an element pattern layer directly on the dielectric layer.
  • a method for forming a continuous film of a conductive material over the entire surface of the dielectric layer 2 for metals, dry coating such as sputtering or vapor deposition, plating or gravure coating using metallic ink, wet coating such as die coating, etc. can be selected. Alternatively, a rolled metal plate can be attached to the dielectric layer.
  • a continuous film can be formed by dry coating for inorganic oxide materials, or wet coating for organic materials. Painting or spraying methods can also be used.
  • the continuous film thus formed is subjected to removal processing such as dry etching, wet etching, or cutting to remove unnecessary portions, thereby forming an element pattern.
  • removal processing such as dry etching, wet etching, or cutting to remove unnecessary portions, thereby forming an element pattern.
  • the edges of the element patterns that make up the reflect array may become rounded (in other words, they may become rounded), pinholes may occur, the cross-sectional shape may become forward or reverse tapered, or undercut or over-etching may occur. While such shape changes are expected to occur during the etching process, as long as the direction of the main beam of the reflected electromagnetic waves in the basic configuration is within a range of about ⁇ 5° of the designed reflection angle, this is considered to be an acceptable reflection phase characteristic. Formation by cutting, printing, dry coating, plating, painting, or spraying is also acceptable.
  • Methods for directly forming an element pattern on a dielectric layer include printing using letterpress printing, lithographic printing, intaglio printing, stencil printing, transfer printing, etc., or masking the dielectric layer except for the element pattern area with masking tape or a masking agent, etc., and then forming the element pattern using dry coating, plating, painting, or spraying.
  • the cross-sectional shape of the element pattern is preferably a forward tapered shape that widens from the top to the bottom. The forward tapered shape increases the surface area of the element pattern, which increases the adhesion to the functional layer when the functional layer is laminated, as described below, and makes it possible to suppress the inclusion of air bubbles.
  • the material of the element pattern 1 may be the same as that of the ground layer 3, or a different material may be used.
  • at least one of the ground layer and element pattern layers may be made of Cu or Al.
  • Cu has excellent conductivity, which reduces conductor loss.
  • Al has a low density, is lightweight, and is inexpensive, making it possible to form a lightweight and inexpensive reflect array.
  • the line width of the mesh is preferably 5 ⁇ m or more and 30 ⁇ m or less, and more preferably 6 ⁇ m or more and 15 ⁇ m or less.
  • the line spacing of the mesh is preferably 50 ⁇ m or more and 500 ⁇ m or less, and more preferably 100 ⁇ m or more and 300 ⁇ m or less.
  • the line spacing of the mesh is preferably 0.5 ⁇ ⁇ or less, more preferably 0.1 ⁇ ⁇ or less, and even more preferably 0.01 ⁇ ⁇ or less. If the line spacing of the mesh is 0.5 ⁇ ⁇ or less, performance can be ensured.
  • the line spacing of the mesh may be 0.001 ⁇ ⁇ or more.
  • the reflect array exhibits visible light transparency, making it possible to maintain the appearance after installation.
  • the element pattern is mesh-shaped or when a transparent conductive material is used, the reflect array exhibits visible light transparency, making it possible to maintain the appearance after installation.
  • the thickness thereof is preferably greater than the skin depth calculated from the following equation (9): where d is the skin depth, ⁇ is the angular frequency, ⁇ is the magnetic permeability of the material, and ⁇ is the electrical conductivity of the material.
  • equation (9) the skin depth calculated from the following equation (9): where d is the skin depth, ⁇ is the angular frequency, ⁇ is the magnetic permeability of the material, and ⁇ is the electrical conductivity of the material.
  • dielectric in addition to a simple resin, composite materials such as paper, glass fiber, or carbon fiber impregnated with resin can be used.
  • ⁇ r indicates the relative dielectric constant.
  • PS polyethylene
  • PET polyethylene terephthalate
  • COP cycloolefin polymer
  • the dielectric layer can be a single layer or multiple layers.
  • the dielectric layer may also be made of foamed materials made from the above materials. As the foam, a foam with high flexibility is preferably used.
  • composite materials include composite materials of paper/phenol resin, paper/epoxy resin, glass/epoxy resin, and glass/fluororesin.
  • Another example is the use of a mixture containing resin components or a dielectric compound and a resin component, from the viewpoint of adjusting the dielectric constant.
  • the relative dielectric constant of the mixture can be adjusted by selecting the dielectric compound and its content.
  • the dielectric constant of a mixture can be predicted, for example, by using the Maxwell-Garnett law.
  • the dielectric constant ⁇ m of the mixture is expressed by the following relational expression (10):
  • the reflectarray exhibits visible light transmittance, making it possible to maintain the appearance after installation.
  • the relative dielectric constant of the dielectric layer 2 is preferably in the range of 1 or more and 20 or less, more preferably in the range of 1 or more and 10 or less, and even more preferably in the range of 2 or more and 4 or less. If the relative dielectric constant is within the above range, it tends to be easier to obtain the desired reflection phase characteristics in the reflectarray. Furthermore, the dielectric loss tangent is preferably in the range of 0.00005 or more and 0.01 or less, and more preferably in the range of 0.00005 or more and 0.001 or less. If it is within the above range, a reflectarray with low dielectric loss can be produced.
  • the dielectric layer 2 can be formed using, for example, wet coating such as die coating, comma coating, or gravure coating; melt extrusion methods such as the T-die method or inflation method; calendar film formation; solution casting; or heat pressing. Co-extrusion, in which multiple resins are extruded in multiple layers to form a film, may also be used.
  • the thickness of the dielectric layer 2 is selected appropriately depending on the design frequency.
  • the design frequency is 28 GHz, it is preferably 40 ⁇ m or more and 250 ⁇ m or less, and more preferably 50 ⁇ m or more and 200 ⁇ m or less. If it is too thin, it becomes difficult to ensure the reflection phase, making the design of the reflectarray difficult. On the other hand, if it is too thick, it tends to become difficult to ensure the reflection phase, the flexibility will be lost, and the total thickness of the reflectarray will increase, making it difficult to save space. For this reason, the thickness of the dielectric layer is preferably 250 ⁇ m or less. When the design frequency is 60 GHz, the thickness of the dielectric layer is preferably 10 ⁇ m or more and 250 ⁇ m or less. When the design frequency is 100 GHz or more, a thickness of the dielectric layer of several ⁇ m or more and 100 ⁇ m or less will make it easier to design the reflectarray.
  • the ground layer 3 is provided to reflect electromagnetic waves that reach the reflect array 4. It is also used to support and protect the dielectric layer 2.
  • the ground layer is made of a conductive material such as an inorganic oxide material, a metal material, or a conductive organic material.
  • the thickness of the ground layer is, for example, 10 nm to 105 ⁇ m.
  • inorganic oxide materials and metal materials include indium tin oxide (ITO), indium zinc oxide (IZO), zinc aluminum oxide (AZO), gallium zinc oxide (GZO), antimony tin oxide, Ag, Al, Au, Pt, Pd, Cu, Co, Cr, In, Ag—Cu, Cu—Au, and Ni. Nanoparticles or nanowires containing at least one of these materials may also be used.
  • Conductive organic materials include polythiophene derivatives, polyacetylene derivatives, polyaniline derivatives, polypyrrole derivatives, carbon nanotubes, and graphene. Cu and Al are particularly preferred from the standpoints of material cost, conductivity, and film formation.
  • a transparent reflect array can also be fabricated using ITO or a mixture of polyethylenedioxythiophene (PEDOT) and polystyrene sulfonic acid (PSS) (PEDOT/PSS).
  • PEDOT polyethylenedioxythiophene
  • PSS polystyrene sulfonic acid
  • the above materials can be used in the form of a continuous film, a mesh, a punched shape, or a periodic structure.
  • mesh refers to a state in which a conductor has a mesh-like opening (opening) on its plane.
  • the mesh may be rectangular or diamond-shaped.
  • the mesh is preferably square. Square meshes provide good design. They may also be randomly shaped by a self-organizing method. Making the mesh randomly can prevent moire.
  • methods such as punching a metal plate or etching a metal plate can be used.
  • the ground layer 3 is mesh-shaped or when a transparent conductive material is used, the reflect array exhibits visible light transparency, making it possible to maintain the appearance after installation.
  • the line width of the mesh is preferably 5 ⁇ m to 30 ⁇ m, more preferably 6 ⁇ m to 15 ⁇ m.
  • the line spacing of the mesh is preferably 50 ⁇ m to 500 ⁇ m, more preferably 100 ⁇ m to 300 ⁇ m.
  • the line spacing of the mesh is preferably 0.5 ⁇ or less, more preferably 0.1 ⁇ or less, and even more preferably 0.01 ⁇ or less. If the line spacing of the mesh is 0.5 ⁇ or less, performance can be ensured. Furthermore, the line spacing of the mesh may be 0.001 ⁇ or more.
  • the ground layer 3 can be formed by dry coating such as sputtering or vapor deposition, wet coating such as gravure coating or die coating by turning the metal material into ink, or surface treatment such as plating. Alternatively, a rolled metal plate can be used as the ground layer.
  • dry coating can be selected as the ground layer formation method.
  • wet coating can be selected as the ground layer formation method.
  • the ground layer can be formed by painting or spraying. If the ground layer 3 is in the form of a thin film formed by plating or vapor deposition, the flexibility of the reflect array can be improved, making it possible to use it on curved surfaces or to implement a roll-to-roll production process.
  • the ground layer 3 When the ground layer 3 is in the form of a thin film, its thickness is preferably larger than the skin depth calculated from equation (9) in the same manner as the element pattern. Furthermore, in order to increase the reflection efficiency of electromagnetic waves, it is also necessary to reduce loss due to the ground layer, so it is preferable that the surface roughness of the ground layer is small.
  • the ground layer 3 has a periodic structure, it can exhibit the function of selectively reflecting or transmitting specific frequencies. For example, if a structure with periodically arranged patch-like conductive patterns is used as the ground layer, it will be possible to reflect only specific frequencies, thereby providing the ability to transmit frequencies other than the operating frequency. Furthermore, if a structure is used in which holes are periodically arranged where no conductive material is present, it will be possible to design a reflect array that asymmetrically reflects the operating frequency while transmitting only specific frequencies.
  • surface resistance measurements are performed in accordance with JIS-K-7194.
  • Surface resistance measurement methods can be selected appropriately, including the four-terminal method, two-terminal method, four-probe method, dielectric method, and eddy current method.
  • the surface resistance of the ground layer can be measured, for example, using the Loresta GP MCP-T610 (product name, manufactured by Mitsubishi Chemical Analytech Co., Ltd.).
  • the function of the additional functional layer 5 can be selected as needed.
  • functions that can be added include deterioration prevention, design, protection/scratch resistance, waterproofing, gas/water vapor barrier properties, flame retardancy, non-combustibility, self-extinguishing, weather resistance, stain resistance, antibacterial/antiviral properties, chemical resistance, deodorizing properties, and adhesiveness/bonding properties.
  • One of these functions may be added, or multiple functions may be combined.
  • the thickness of the additional functional layer is, for example, 5 ⁇ m or more and 6 mm or less.
  • Methods for laminating a sheet-like additional functional layer include bonding using lamination, extrusion lamination, etc., and methods for applying a liquid additional functional layer include, but are not limited to, printing, coating, dry lamination, wet lamination, etc. Furthermore, if the additional functional layer does not have tackiness or adhesiveness, there is a method for adhering it to the reflectarray using an adhesion improving layer (adhesive).
  • Possible causes of reflectarray deterioration include oxidation and water vapor absorption due to exposure to the atmosphere, and alteration due to light (ultraviolet rays) such as sunlight.
  • a layer with excellent gas barrier properties such as a barrier film
  • the oxygen permeability of the functional layer be 500 cc/ m2 ⁇ atm ⁇ day or less. If this condition can be met, a film may be laminated, or an overcoat layer may be provided by dry coating or wet coating. These layers may be single layers, or multiple layers may be combined or laminated.
  • barrier films include a single film such as an ethylene-vinyl alcohol copolymer resin, a coextruded multilayer nylon (Ny) film, and a wet-coated film coated with vinylidene chloride (PVDC) or polyvinyl alcohol (PVA).
  • PVDC vinylidene chloride
  • PVA polyvinyl alcohol
  • an antioxidant, anti-deterioration agent, or antioxidant material may be added when forming the dielectric layer.
  • a layer with a water vapor permeability of 300 g/ m2 ⁇ day or less To protect against light from sunlight, etc., it is possible to provide a film with UV protection or a layer with light-blocking properties.
  • an ultraviolet scattering agent, an ultraviolet absorber, or a light stabilizer may be added.
  • UV-blocking films include vinyl chloride resins and polyolefin resins.
  • Design When a reflectarray is installed on the exterior or interior of a building, for example, it is possible to impart a design to it so that it harmonizes with the space. Specifically, the design can be imparted by bonding a designed sheet-like material to the reflectarray using an adhesive, or by welding and attaching the sheet-like material to the reflectarray by applying heat and pressure.
  • Examples of such decorative sheets include a decorative sheet in which a printed pattern and an embossed surface pattern are harmonized by laminating a base sheet, a base pattern layer, and a transparent thermoplastic resin layer in this order, and a decorative sheet in which a color similar to that of real wood or stone is achieved by laminating a pattern layer, a transparent resin layer, and a surface protection layer in this order.
  • Protection and scratch resistance refers to the function of preventing scratches on the reflectarray and preventing deterioration of the reflectarray itself. Methods for imparting such functions include coating the reflectarray to increase its surface hardness or laminating a synthetic resin film. Protection and scratch resistance are evaluated by a pencil hardness test based on JIS K5600-5-4, and the hardness is preferably H or higher. Furthermore, when rubbed with steel wool (#0000) at a load of 1,000 gf/ cm2 , it is preferable that scratches do not occur until the number of reciprocating strokes exceeds 1,000.
  • Examples of synthetic resins include polyethylene terephthalate, cycloolefin polymer, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polymethyl methacrylate, polyester, polyformaldehyde, polyamide, polyphenylene ether, vinylidene chloride, polyvinyl acetate, polyvinyl acetal, AS resin, ABS resin, acrylic resin, fluororesin, nylon resin, polyacetal resin, polycarbonate resin, polyamide resin, and polyurethane resin.
  • a method of imparting flame retardancy or non-combustibility to a reflectarray is to layer non-combustible, quasi-non-combustible, or flame-retardant materials that have been certified as fireproof under the Building Standards Act. Examples include flame-retardant fibers, flame-retardant plastics, non-combustible paints, and flame-retardant paints. Flame-retardant fibers include halogen-based compounds, phosphorus-based compounds, vinylon fibers, polyetherimide fibers, aramid fibers, polyester fibers, and vinylon fibers.
  • Flame-retardant plastics include plastic materials to which halogen-based, phosphorus-based, or inorganic flame retardants such as aluminum hydroxide and magnesium hydroxide have been added.
  • Self-extinguishing materials include nylon, polycarbonate, and polyvinyl chloride.
  • One method of imparting antifouling properties to a reflectarray is to laminate or coat it with a hydrophilic or water-repellent substrate.
  • Photocatalytic materials, silica-based materials, and the like can be used as hydrophilic materials.
  • Fluorocarbon resin-based, silicone-based, and other materials can be used as water-repellent materials.
  • Photocatalytic materials, chlorine-based materials, organic materials containing cationic polymers, and materials containing metals such as silver and zinc can be used as antibacterial and antiviral materials. These materials can be laminated as films or used in coating processes, or mixed when forming a dielectric layer, for example.
  • the adhesion improving layer is a layer that has adhesive strength to bond layers together.
  • the adhesion improving layer may be composed of two or more layers or may be composed of a combination of multiple materials.
  • the adhesion improving layer bonds the ground layer and the dielectric layer, or the dielectric layer and the element pattern, or the dielectric layer, the element pattern, and the additional function layer, and is composed of an adhesive.
  • the adhesive may be a water-dispersion adhesive, a solution-based adhesive, a solventless adhesive, or a solid-based adhesive.
  • adhesives examples include epoxy resin-based adhesives, polyvinyl acetate-based adhesives, nitrile rubber-based adhesives, phenolic resin-based adhesives, vinyl acetate-based adhesives, chloroprene rubber-based adhesives, acrylic resin-based adhesives, polyvinyl alcohol resin-based adhesives, silicone rubber-based adhesives, styrene-butadiene rubber-based adhesives, and urethane-based adhesives.
  • the adhesion improving layer may also contain any synthetic resin or other material or any other component. The thickness of the adhesion improving layer is, for example, 5 ⁇ m to 500 ⁇ m.
  • the functional layer is a general term including a single or multiple additional functional layer, a single or multiple adhesion improving layer, or a layer in which a single or multiple additional functional layer and an adhesion improving layer are stacked.
  • the mounting layer is a layer used to fix the reflectarray to the support.
  • an adhesive layer, a sticky layer, or a magnet can be used if the support is made of metal. When a magnet is used, the position and angle of the reflectarray can be easily changed.
  • the reflectarray is installed on a support.
  • the support may be a newly installed panel or pole, or an existing signboard, wall, ceiling, etc. It is also possible to use such an existing support.
  • the support preferably has a mechanism that can adjust the angle of the reflectarray in the vertical or horizontal direction, and more preferably has a mechanism that can move the position of the reflectarray up, down, left, and right.
  • the reflectarray is installed on the support and used as a reflectarray device.
  • the reflectarray may also be attached to human skin, clothing, or wearable equipment using an installation layer.
  • the reflection control area is the smallest area that can reflect electromagnetic waves incident on that area in a predetermined direction.
  • the reflection control area includes not only a two-dimensional area parallel to the area where the electromagnetic waves are incident, but also a layer structure formed in a direction perpendicular to the area.
  • a unit cell refers to an area obtained by dividing a reflection control area.
  • a unit cell contains one element pattern.
  • Two or more unit cells exist within one reflection control area.
  • the size of the side of only one unit cell in the x-axis direction is defined as Ux, and the size of the side in the y-axis direction is defined as Uy.
  • the size (length) of a side where multiple unit cells are lined up in the x-axis direction is defined as Sx.
  • Figure 3 is an example of a schematic diagram showing an enlarged portion of the reflection control region.
  • Figure 3(a) is a perspective view of the reflection control region 6.
  • Figure 3(b) is a cross-sectional view of the reflection control region 6 in the xz plane taken along the y direction Uy/2 ( Figure 3(b-1)), and a schematic diagram showing the design angle of incidence ⁇ i and the design angle of reflection ⁇ r ( Figure 3(b-2)).
  • Figure 3(c) is a cross-sectional view of an arbitrary unit cell of the reflection control region 6 taken along the x direction Ux/2 in the yz plane.
  • An element pattern 1 having an element side surface is formed on one xy plane of the dielectric layer 2, and a ground layer 3 is formed on the other xy plane.
  • Ux is Sx/n, where n is an integer greater than or equal to 2 (in the example of Figure 3, the reflection control region is made up of three rectangular unit cells whose long side in the x-axis direction is divided into thirds).
  • the reflection control area is designed according to the following procedure.
  • Sx is the length of the long side of the reflection control area
  • is the wavelength of the electromagnetic wave applied to the reflectarray (hereinafter also referred to as the "wavelength at the operating (design) frequency")
  • ⁇ i is the angle of incidence
  • ⁇ r is the angle of reflection.
  • the angle of incidence ⁇ i and the angle of reflection ⁇ r are values measured in the xz plane.
  • Zs(x) is a function of the surface impedance in the x-direction in the xy plane of the reflection control area, and represents the case where lossless reflection is realized.
  • 120 ⁇ is the impedance of the incident wave.
  • ⁇ r(x) represents the reflection phase, which is the phase of the reflection coefficient, as shown in the following equation (14).
  • the element shape is determined for each position of the unit cell so as to satisfy the reflection phase (deflection angle of R) shown in the following equation (15).
  • the reflection phase is calculated by the above method
  • the shape of the element pattern is changed so as to satisfy the reflection phase in each unit cell, and a simulation is performed to optimize the shape of the element pattern.
  • the relationship between the shape of the element pattern and the reflection phase can be calculated by a simulation using, for example, an electromagnetic analysis tool (High Frequency Structure Simulator: HFSS) or the like.
  • HFSS High Frequency Structure Simulator
  • Reflection control area group A group of reflection control areas is called a reflection control area group.
  • Reflection control area groups include those composed of a group of single reflection control areas (hereinafter also referred to as a "single reflection control area group", although this also includes a single reflection control area), and those composed of a combination of multiple types of single reflection control area groups (hereinafter also referred to as a "composite reflection control area group”).
  • the reflectarray 40 that is the subject of this embodiment is composed of composite reflection control areas, and is distinguished from the reflectarray 4 composed of a single reflection control area group (hereinafter also referred to as a "single reflectarray").
  • each of the single reflection control region groups constituting the composite reflection control region group is arranged parallel to at least one or both of the x-axis and y-axis.
  • ⁇ Characteristics of reflectarray> The following describes the characteristics exhibited when an electromagnetic wave is incident on and reflected from a single reflectarray. As described above, the reflectarray is designed to have an incident angle ⁇ i and a reflection angle ⁇ r (such a single reflectarray is sometimes written as R( ⁇ i, ⁇ r)).
  • the propagation direction of an electromagnetic wave incident on a reflectarray of R( ⁇ i, ⁇ r) at an incident angle ⁇ i and reflected at a reflection angle ⁇ r is referred to as the forward direction (downstream communication/radiated wave), and the propagation direction of an electromagnetic wave incident at an incident angle ⁇ r and reflected at a reflection angle ⁇ i is referred to as the reverse direction (upstream communication/received wave).
  • the subscripts d and u may be added to the former, such as [ ⁇ i]d, and the latter, such as [ ⁇ i]u.
  • ⁇ r is the reflection angle for downstream communication (radiated wave) or the incident angle for upstream communication (received wave)
  • the forward direction generally refers to radio waves propagating from the base station to the reflectarray to the terminal
  • the reverse direction generally refers to radio waves propagating from the terminal to the reflectarray to the base station.
  • the forward direction generally refers to radio waves propagating from the radio wave transmitter to the reflectarray to the target
  • the reverse direction generally refers to radio waves propagating from the target to the reflectarray to the radio wave receiver.
  • the "design incident angle design reflection angle.”
  • Figure 4 is a schematic diagram illustrating characteristic 1 of a single reflectarray.
  • a reflectarray 4 of R( ⁇ i, ⁇ r) radio waves incident at an incident angle [ ⁇ i]d in downstream communications are reflected most strongly in the direction of reflection angle [ ⁇ r]d
  • Figure 4(b) radio waves incident at an incident angle [ ⁇ r]u in upstream communications are reflected most strongly in the direction of reflection angle [ ⁇ i]u (characteristic 1 of a reflectarray).
  • Figure 5 is a schematic diagram illustrating characteristic 2 of a single reflectarray.
  • a reflectarray 4 of R( ⁇ i, ⁇ r) radio waves incident at an incident angle [ ⁇ i - ⁇ ]d that is a few degrees ( ⁇ degrees) off from ⁇ i in downstream communications are most strongly reflected in the direction of a reflection angle [ ⁇ r + ⁇ ]d that is a few degrees ( ⁇ degrees) off from ⁇ r.
  • radio waves incident at an incident angle [ ⁇ r + ⁇ ]u that is a few degrees ( ⁇ degrees) off from ⁇ r in upstream communications are strongly reflected in the direction of a reflection angle [ ⁇ i - ⁇ ]u that is a few degrees ( ⁇ degrees) off from ⁇ i (characteristic 2 of a reflectarray).
  • Figure 6 is a schematic diagram illustrating characteristic 3 of a single reflectarray.
  • Figure 6(a) shows how radio waves are incident on and reflected from a conventional reflectarray 4 measuring several tens of centimeters square.
  • reflectarrays 4 generally use sizes larger than the conventional size of several tens of centimeters square. In this case, the gain increases in principle, and the reflected beam from the reflectarray exhibits the characteristic of becoming sharper (reflectarray characteristic 3).
  • FIG 7 is a schematic diagram showing an example of a failure in radio wave relay using a single reflectarray in 5G/6G communications. Due to characteristics 2 and 3 of a single reflectarray, in downstream communications, the terminal cannot obtain sufficient reception power if (a) the installation position or installation angle of the reflectarray is shifted (see Figure 7(a)), (b) the terminal position is shifted (see Figure 7(b)), or (c) an obstacle such as a person or object temporarily exists on the incoming reflected beam (see Figure 7(c)). Furthermore, due to the characteristic 1 of a single reflectarray, communication failure occurs in the upstream communication as well as the downstream communication, in that the base station is unable to obtain sufficient reception power.
  • FIG. 8 is a schematic diagram illustrating the functions realized by the reflectarray according to this embodiment.
  • the reflectarray 40 has a function of widening the allowable angle range (described below) of the incident beam for downstream communication (function 1).
  • the reflectarray 40 has a function of widening the width of the reflected beam for downstream communication (function 2).
  • the reflectarray 40 has a function of achieving functions 1 and 2 in both uplink and downlink communication (function 3). These functions 1 to 3 make it possible to provide terminal users with an extremely stable communication environment.
  • millimeter-wave radar sensor
  • millimeter-wave radar also makes it possible to provide sensor users with extremely stable moving object detection.
  • the reflectarray 40 of this embodiment has a composite reflection control area group formed by combining multiple types of single reflection control area groups that most strongly reflect plane waves from an arbitrary design angle of incidence ⁇ i that satisfies formula (1) to an arbitrary design angle of reflection ⁇ r that satisfies formula (2) for electromagnetic waves in a specific frequency band.
  • the composite reflection control area group is preferably formed by juxtaposing three or more single reflection control area groups with different design angles of incidence or design reflection angles in the x-axis direction, and the manner in which they are juxtaposed may be formed by arranging separate single reflectarrays or may be formed integrally on a common dielectric layer, and is not particularly limited.
  • FIG. 9A is a schematic diagram showing an overall image of the incident and reflected downstream communication radio waves (radiated waves) in the reflectarray of embodiment 1.
  • the reflectarray 40 which is a composite reflection control region group
  • the design incident and reflection angles of the centrally located single reflection control region group 4-0 are the design central incident angle ⁇ i 0 and the design central reflection angle ⁇ r 0
  • it is preferable that the design incident and reflection angles of the surrounding single reflection control region groups are both shifted by the same amount from the design central incident and reflection angle. For example, as shown in FIG.
  • the reflection control region group 4-0 of R( ⁇ i 0 , ⁇ r 0 ) is located at the center of the reflectarray 40, and the reflection control region group 4-1 of ( ⁇ i 0 - ⁇ , ⁇ r 0 - ⁇ ) and the reflection control region group 4-2 of R( ⁇ i + ⁇ , ⁇ r 0 + ⁇ ) are located on either side of it, respectively.
  • the positions of the reflection control region group 4-1 and the reflection control region group 4-2 may be reversed.
  • a plane wave incident at a design central incident angle [ ⁇ i 0 ]d is incident on all of the reflection control area groups (4-0, 4-1, 4-2) constituting the reflectarray 40 at the incident angle [ ⁇ i 0 ]d and is asymmetrically reflected by each reflection control area group. Then, at the far-field distance, the reflected waves from each reflection control area group are combined to form a plane wave having a beam width of ⁇ degrees centered on the design central reflection angle [ ⁇ r 0 ]d (described later).
  • the reflectarray 40 of embodiment 1-1 strongly reflects, in downstream communication (radiated waves), plane waves incident within an angle range of ⁇ ⁇ degrees (“downstream incident angle range ⁇ ") that satisfies the following formula (3) around the design central incident angle [ ⁇ i 0 ]d, to the angle range of ⁇ degrees (“downstream reflection angle range ⁇ ") around the design central reflection angle [ ⁇ r 0 ]d.
  • strong reflection means that when radio waves incident within the downstream incident angle range ⁇ are reflected, the average value of the reflection intensity (bistatic RCS [sm]) within the downstream reflection angle range ⁇ is 5 dB or more higher than the average value of the reflection intensity within the angle range of -90 degrees to 90 degrees excluding the downstream reflection angle range ⁇ .
  • the reflectarray 40 of embodiment 1-1 is characterized in that, when the reflection intensity (RCS[sm]) of a plane wave from an incident angle [ ⁇ i]d of downstream communication (radiated wave) to a reflection angle [ ⁇ r]d is ⁇ [ ⁇ i]d[ ⁇ r]d, the variation coefficient C [ ⁇ r]d of the reflection intensity at any reflection angle [ ⁇ r]d within the downstream reflection angle range ⁇ , calculated from the following equation (4), is 0.6 or less.
  • the variation coefficient is an index indicating the relative variation in data, and is calculated as the value obtained by dividing the standard deviation of the reflection intensity at each reflection angle within the downstream reflection angle range ⁇ for an incident wave from the downstream incident angle range ⁇ by the average, thereby deriving the degree of variation in the reflection intensity at each reflection angle due to a shift in the incident angle.
  • j is a variable corresponding to each analysis angle when the incident angle range of - ⁇ to ⁇ degrees is divided by 1 degree, and the number of analysis angles is 2 ⁇ + 1. It is also possible to derive the variation coefficient by using j as a continuous variable and replacing equation (4) with an integral. The smaller the coefficient of variation, the smaller the degree of variation in reflection intensity due to differences in the angle of incidence.
  • the reflectarray 40 of embodiment 1-1 plane wave radio waves incident within the downstream incident angle range ⁇ are strongly reflected within the downstream reflection angle range ⁇ , and the coefficient of variation, which indicates the degree of variation in the reflection intensity reflected within the downstream reflection angle range ⁇ for all radio waves incident within the downstream incident angle range ⁇ , is kept at 0.6 or less.
  • the angle range ⁇ in this case is called the allowable incident angle range. Therefore, it can be said that the reflectarray 40 of embodiment 1-1 has the function of expanding the allowable incident angle range for downstream communication (radiated waves) to any value of ⁇ that satisfies equation (3) (see Function 1, Figure 8(a), etc.).
  • the reflectarray 40 of embodiment 1-2 can reflect, in downstream communication (radiated waves), any plane wave incident at a downstream incident angle range ⁇ with a spread over an angle range of ⁇ ⁇ degrees (hereinafter referred to as the "downstream reflection angle range ⁇ ") that satisfies the following equation (6) around the design central reflection angle [ ⁇ r 0 ]d (see FIG. 9A ).
  • the diffusivity d[ ⁇ i]d of the reflection pattern (bistatic RCS[sm]) derived from the following equation (7) is 0.6 or more in the downstream reflection angle range ⁇ .
  • the uniformity of the reflection directional characteristics of radio waves in a metamaterial diffuse reflector is defined as the diffusion coefficient.
  • the autocorrelation coefficient of the RCS for each reflection direction for an incident wave from a certain direction is derived.
  • k is a variable corresponding to each analysis angle when the reflection angle range of - ⁇ to ⁇ degrees is divided by 1 degree, and the number of analysis angles is 2 ⁇ + 1.
  • the reflect array 40 of embodiment 1-2 has the function of uniformly spreading the width of the reflected beam in downstream communication (radiated wave) within the downstream reflection angle range ⁇ (function 2, see Figure 8(b) etc.).
  • FIG. 9B is a schematic diagram showing an overall image of the incident and reflected waves of upstream communication radio waves (received waves) in the reflectarray of embodiment 2.
  • the reflectarray 40 is the same as the one used for downstream communication (radiated waves).
  • upstream communication received waves
  • a plane wave incident at the design central reflection angle [ ⁇ r 0 ]u is incident on all of the reflection control area groups (4-0, 4-1, 4-2) constituting the reflectarray 40 at an incident angle [ ⁇ r 0 ]u and is asymmetrically reflected by each reflection control area group.
  • the reflected waves from each reflection control area group are combined to form a plane wave with a beam width of ⁇ degrees centered around the design central incident angle [ ⁇ i 0 ]u.
  • any other plane wave incident from within the downstream reflection angle range ⁇ becomes a plane wave with a beam width of ⁇ degrees centered around the design central incident angle [ ⁇ i 0 ]u.
  • the reflectarray 40 of embodiment 2-1 strongly reflects a plane wave incident within the downstream reflection angle range ⁇ to the downstream incident angle range ⁇ in upstream communication (received wave).
  • strong reflection means that, similar to downstream communication (radiated wave), when a radio wave incident within the downstream reflection angle range ⁇ is reflected, the average value of the reflection intensity (bistatic RCS) within the downstream incident angle range ⁇ is 5 dB or more higher than the average value of the reflection intensity within the angle range from -90 degrees to 90 degrees excluding the downstream incident angle range ⁇ .
  • the reflectarray 40 of embodiment 2-1 is characterized in that, when the reflection intensity (RCS[sm]) of a plane wave at a reflection angle [ ⁇ i]u from an incident angle [ ⁇ r]u of upstream communication (received wave) to a reflection angle [ ⁇ i]u is ⁇ [ ⁇ r]u[ ⁇ i]u, the variation coefficient C[ ⁇ i]u of the reflection intensity, derived from the following equation (5), at any reflection angle [ ⁇ i]u within a downstream incident angle range ⁇ is 0.6 or less.
  • the meaning of the variation coefficient is the same as in the case of downstream communication (radiated wave), so details will be omitted.
  • the reflect array 40 of embodiment 2-1 can be said to have the function of expanding the allowable incident angle range in upstream communication (received waves) to any value of ⁇ that satisfies equation (3) (function 3, see Figure 8 (c) etc.).
  • the reflectarray 40 of embodiment 2-2 can reflect, in upstream communication (received waves), any plane wave incident within a downstream reflection angle range ⁇ with a spread over an angle range of ⁇ degrees (hereinafter referred to as the "upstream reflection angle range ⁇ ") that satisfies equation ( 6 ) around the design central incident angle [ ⁇ i 0 ]u (see FIG. 9B ).
  • the reflect array 40 of embodiment 2-2 has the function of uniformly widening the width of the reflected beam in upstream communication (received wave) within the upstream reflection angle range ⁇ (function 3, see Figure 8 (c) etc.).
  • Example 1 is a schematic diagram of the arrangement of reflection control region(s) in the reflectarray of Example 1.
  • Reflectarray 40 in Example 1 has three types of reflection control region groups 4-0, 4-1, and 4-2 arranged parallel to the x-axis direction such that reflection control region groups 4-1 and 4-2 are arranged on both sides of reflection control region group 4-0, and each reflection control region group has a plurality of reflection control regions (6-0, 6-1, 6-2) arranged parallel to the x-axis and y-axis directions.
  • reflection control regions 6-0, 6-1, and 6-2 have different designed incident reflection angles, ( ⁇ i0 , ⁇ r0 ), R( ⁇ i0 - ⁇ , ⁇ r0 - ⁇ ), and ( ⁇ i0 + ⁇ , ⁇ r0 + ⁇ ), respectively, and therefore also have different long side lengths Sx of the reflection control regions.
  • the lengths of the short sides of the reflection control regions 6-0, 6-1, and 6-2 are unified to the longest length Uy, which makes it easier to process the reflect array.
  • the reflect array was constructed using 0.018 mm (18 ⁇ m) thick copper for the element pattern and ground layer, and a 0.764 mm thick glass/fluororesin composite for the dielectric.
  • the conductivity of the copper was 5.8 ⁇ 10 siemens/m, the real part of the dielectric constant of the dielectric was 2.6, and tan ⁇ was 0.0025.
  • the operating frequency was set to 28 GHz, the design incident reflection angle was set for each reflection control area group, and the size Sx of the reflection control area in the x-axis direction was determined using equation (11).
  • the shape of the element was a cross patch in which two square patches intersected at right angles in the xy plane.
  • the element lengths of the element patterns in the reflection control region were the same and only the element widths were different.
  • Each of reflection control region groups 4-0, 4-1, 4-2 has four reflection control regions 6-0, 6-1, 6-2 arranged in the x-axis direction, and an optimum number arranged in the y-axis direction. Specific specifications are shown in Table 1.
  • the coefficient of variation C ⁇ of the reflection intensity (bistatic RCS) derived from equation (4) at each reflection angle when this angle range is divided in 1 degree increments was 0.6 or less at all analysis angles.
  • the coefficient of variation C ⁇ of the reflection intensity (bistatic RCS) derived from equation (5) at each reflection angle when the angle range is divided in 1-degree increments was 0.6 or less at all analysis angles.
  • the diffusivity in downstream communication (radiated wave) and upstream communication (received wave) in Example 1 is shown in Table 3.
  • the coefficient of variation C ⁇ was greater than 0.6 at some analysis angles for both uplink and downlink communication. Furthermore, when the diffusion degree d ⁇ of the reflection pattern (bistatic RCS) in uplink and downlink communication was derived using the same method as in Example 1, it was found to be smaller than 0.6 at some incident angles in uplink communication (received waves) and at all incident angles in downlink communication (emitted waves), as shown in Table 3.
  • Table 1 shows the specifications of the reflect arrays in Example 1, Comparative Example 1, and Comparative Example 2.
  • Table 2 shows the coefficient of variation C ⁇ of the reflect arrays in Example 1, Comparative Example 1, and Comparative Example 2.
  • Table 3 shows the diffusivity d ⁇ of the reflect arrays in Example 1, Comparative Example 1, and Comparative Example 2.
  • FIG. 11 is a graph showing reflection patterns (bistatic RCS) in the reflectarrays of Example 1 and Comparative Examples 1 and 2.
  • radio waves are asymmetrically reflected with directivity in the 45-degree direction in downstream communications (radiated waves), and the analysis results show that the reflection intensity in the ⁇ 5-degree range is 5 dB or more higher than the reflection intensity in other reflection directions.
  • upstream communications radio waves are asymmetrically reflected with directivity in the 0-degree direction, and the analysis results show that the reflection intensity in the ⁇ 5-degree range is 5 dB or more higher than the reflection intensity in other reflection directions.
  • the width of the asymmetric reflected beam in Comparative Example 1 is narrow, and the reflection intensity clearly varies depending on the incident angle.
  • the width of the asymmetric reflected beam in Comparative Example 2 is relatively wide, but the reflection intensity clearly varies depending on the incident angle, as in Comparative Example 1. Furthermore, it can be seen that the spread width of the reflected beam is smaller in upstream communication (received wave) compared to downstream communication (emitted wave) in both Comparative Examples 1 and 2. In contrast, it can be seen that the width of the asymmetric reflected beam is wide in both uplink and downlink communication in Example 1, and the degree of variation in reflection intensity depending on the incident angle is also small.
  • Example 2 Similar to Example 1, reflectarray 40 of Example 2 has three types of reflection control region groups 4-0, 4-1, 4-2 arranged parallel to the x-axis direction with reflection control region groups 4-1, 4-2 arranged on either side of reflection control region group 4-0, as shown in the schematic diagram of the arrangement of reflection control region(s) in Figure 10, and each reflection control region group has a plurality of reflection control regions (6-0, 6-1, 6-2) arranged parallel to the x-axis direction and y-axis direction.
  • reflection control regions 6-0, 6-1, 6-2 have different designed incident reflection angles, ( ⁇ i0 , ⁇ r0 ), R( ⁇ i0 - ⁇ , ⁇ r0 - ⁇ ), and ( ⁇ i0 + ⁇ , ⁇ r0 + ⁇ ), respectively, and therefore also have different long side lengths Sx of the reflection control regions.
  • the reflect array was constructed using 0.035 mm (35 ⁇ m) thick copper for the element pattern and ground layer, and 0.600 mm thick epoxy resin for the dielectric.
  • the conductivity of the copper was 5.8 ⁇ 10 siemens/m
  • the real part of the dielectric constant of the dielectric was 4.175
  • tan ⁇ was 0.014.
  • the operating frequency was set to 24.15 GHz
  • the design incident reflection angle was set for each reflection control area group, and the size Sx of the reflection control area in the x-axis direction was determined using equation (11).
  • the shape of the element was a cross patch in which two square patches intersected at right angles in the xy plane.
  • the element lengths of the element patterns in the reflection control region were the same and only the element widths were different.
  • Each of reflection control region groups 4-0, 4-1, 4-2 has four reflection control regions 6-0, 6-1, 6-2 arranged in the x-axis direction, and an optimum number arranged in the y-axis direction. Specific specifications are shown in Table 4.
  • Example 2 The coefficient of variation for Example 2 is shown in Table 5.
  • the design central incident angle [ ⁇ i 0 ]d and the design central reflection angle [ ⁇ r 0 ]u are equal, and radio waves are retroreflected.
  • the plane waves are strongly reflected in the angle range of -5 to +5 degrees centered on the design central reflection angle [ ⁇ r 0 ]d of -45 degrees.
  • the coefficient of variation C ⁇ of the reflection intensity (bistatic RCS) derived from Equation (4) at each reflection angle when the angle range is divided by 1 degree was 0.6 or less at all analysis angles.
  • the reflectarray had 12 x 36 reflection control regions arranged in the x-axis and y-axis directions, for a total of 432 regions. Specific specifications are shown in Table 4.
  • the coefficient of variation C ⁇ of the reflection intensity (bistatic RCS) was calculated using the same method as in Example 2, and as shown in Table 5, it was greater than 0.6 at some analysis angles.
  • the diffusivity d ⁇ of the reflection pattern (bistatic RCS) was calculated using the same method as in Example 2, it was found to be smaller than 0.6 at all angles of incidence, as shown in Table 6.
  • Table 4 shows the specifications of the reflect arrays in Example 2 and Comparative Example 3.
  • Table 5 shows the coefficient of variation C ⁇ of the reflectarrays in Example 2 and Comparative Example 3.
  • Table 6 shows the diffusion degree d ⁇ of the reflect arrays in Example 2 and Comparative Example 3.
  • Example 12 is a graph showing the reflection patterns (bistatic RCS) of the reflectarrays of Example 2 and Comparative Example 3.
  • Example 2 and Comparative Example 3 retroreflect radio waves with directionality in the -45 degree direction, and the analysis results show that the reflection intensity in the ⁇ 5 degree range is 5 dB or more higher than the reflection intensity in other reflection directions.
  • the width of the asymmetric reflected beam in Comparative Example 3 is narrow, and the reflection intensity varies clearly depending on the angle of incidence.
  • the width of the retroreflected beam in Example 2 is wide, and the degree of variation in reflection intensity depending on the angle of incidence is also small.
  • the reflector has a plurality of types of reflection control regions that most strongly reflect a plane wave from an arbitrary design incident angle ⁇ i that satisfies Equation (1) to an arbitrary design reflection angle ⁇ r that satisfies Equation (2),
  • a plane wave incident within an angle range of ⁇ degrees (hereinafter referred to as the "downward incident angle range ⁇ ") that satisfies Equation (3) with the design central incident angle [ ⁇ i 0 ]d as the center is:
  • the beam is strongly reflected in the downward reflection angle range ⁇ ⁇ so that the average value of the reflection intensity (bistatic RCS) in the angle range of ⁇ degrees (hereinafter referred to as the "downward reflection angle range ⁇ ") centered on the design central reflection angle [ ⁇ r 0 ]d is 5 dB or more higher than the average value of the reflection intensity in
  • a reflectarray. In upstream communication (received waves), The plane wave incident within the downward reflection angle range ⁇ is The downlink incident angle range ⁇ is strongly reflected so that the average value of the reflection intensity (bistatic RCS) in the downlink incident angle range ⁇ is 5 dB or more higher than the average value of the reflection intensity in the angle range from ⁇ 90 degrees to 90 degrees excluding the downlink incident angle range ⁇ , and
  • Aspect 6 Aspect 6.
  • the reflectarray according to aspect 5 characterized in that it is configured by the reflection control region group including three types of reflection control regions, whose design angles of incidence and design reflection angles are the design central incident angle ⁇ i 0 and the design central reflection angle ⁇ r 0 , the design incident angle ⁇ i 0 - ⁇ degrees and the design reflection angle ⁇ r 0 - ⁇ , and the design incident angle ⁇ i 0 + ⁇ degrees and the design reflection angle ⁇ r 0 + ⁇ degrees, respectively.
  • Aspect 7 It has a layer structure in which an element pattern, a dielectric layer, and a ground layer are laminated in this order,
  • the reflection control region has the same length of a short side Uy in each reflection control region group and has at least two unit cells,
  • the shape of the element pattern includes a cross patch;
  • the dielectric layer has a relative dielectric constant of 1 or more and 20 or less.
  • Aspect 14 The reflectarray according to any one of Aspects 1 to 13, wherein the reflectarray is disposed on a support.
  • Aspect 15 The reflectarray according to any one of aspects 1 to 13, wherein the reflectarray is attached to human skin, clothing, or a wearing tool by an installation layer.

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Abstract

The purpose of the present invention is to provide a technology that makes stable communication and motion detection possible even when the incidence angle or reflection angle with respect to an incident or reflected beam of a reflectarray deviates from design. For this purpose, a reflectarray according to the present invention is characterized by having multiple types of reflection control regions in which a plane wave from a design incidence angle θi satisfying formula (1) is most strongly reflected at a design reflection angle θr satisfying formula (2), wherein, in downlink communication (radiation wave), the plane wave incident in an angular range of ±α degrees satisfying formula (3) around a design center incidence angle [θi0]d is reflected such that the average value of reflection intensity in an angular range of ±α degrees around a design center reflection angle [θr0]d is higher by 5 dB or more than the average value of reflection intensity in an angular range of -90 to 90 degrees excluding the angular range, and a variation coefficient C[θr]d of reflection intensity derived from formula (4) for an arbitrary reflection angle [θr]d within the angular range is 0.6 or less.

Description

リフレクトアレイReflectarray

 本発明は、リフレクトアレイに関する。 The present invention relates to a reflectarray.

 社会におけるデジタル化の進展により、無線通信におけるデータ通信速度が飛躍的に向上し、それに伴う電磁波(以下、「電波」ともいう)の高周波化が進んでいる。しかし、電磁波は周波数が高くなるにつれて直進性が高くなるため、建物の影等に電磁波が回り込まず、通信ができない領域である不感地帯が生じやすい。
 こうした理由から、広範囲における5G・6G通信を実現するためには、基地局数を増やす必要がある。しかし、基地局を増やすためには多額のコストを要するため、基地局の数を早急に増やすのは難しいといった課題が存在する。
また、高周波帯域の電磁波を使用し、高精度な距離測定や対象物の動体検知が可能なミリ波レーダー(センサー)は、モビリティや、ロボティクス、セキュリティ、ヘルスケア等の様々な分野で活用されている。例えば、モビリティにおいては、先進運転支援システムや自動運転技術における車載レーダーにミリ波レーダーが活用されており、他車や歩行者の位置、速度、距離を正確に測定し、安全な車間距離の維持や障害物回避を可能とする。ヘルスケアにおいては、見守りセンサーや医療モニタリングにおける非接触センサーにミリ波センサーが活用されており、人の動きの有無や転倒の検知、心拍や呼吸等の微細な変化を暗所や障害物越しでも検知可能とする。これらの用途に対し、ミリ波レーダー(センサー)の性能向上が求められる中で、ビームの指向性や障害物、マルチパス干渉による検知精度の悪化といった課題が存在する。
近年、5G・6G通信やミリ波レーダー(センサー)のこれら課題を解決すべく、電磁波の方向を制御する技術としてリフレクトアレイが提案されている。
 リフレクトアレイ(電磁波反射板)は、電磁波を反射させる部材であり、入射角と反射角が等しい対称反射をさせるものに限らず、入射角と反射角が異なる非対称反射をさせるものや、入射方向に電磁波を再帰性反射させるものや、複数の方向に電磁波を散乱させるものや、特定の箇所に電磁波を集めるものを含む。
With the advancement of digitalization in society, data communication speeds in wireless communications have increased dramatically, and the accompanying increase in the frequency of electromagnetic waves (hereinafter also referred to as "radio waves"). However, as the frequency of electromagnetic waves increases, they tend to travel in a more directional manner, which means that they cannot bend around buildings and other obstacles, often resulting in blind zones where communication is not possible.
For these reasons, it is necessary to increase the number of base stations in order to realize 5G and 6G communications over a wide area. However, increasing the number of base stations requires a large amount of cost, which makes it difficult to increase the number of base stations quickly.
Furthermore, millimeter-wave radar (sensors), which use high-frequency electromagnetic waves to measure distances and detect moving objects with high precision, are being used in a variety of fields, including mobility, robotics, security, and healthcare. For example, in mobility, millimeter-wave radar is used in onboard radars for advanced driver assistance systems and autonomous driving technology, accurately measuring the position, speed, and distance of other vehicles and pedestrians, enabling safe following distances and obstacle avoidance. In healthcare, millimeter-wave sensors are used in non-contact sensors for monitoring and medical monitoring, enabling them to detect human movement, falls, and subtle changes in heart rate and breathing, even in dark places and through obstacles. While improved performance of millimeter-wave radar (sensors) is required for these applications, challenges remain, including beam directionality, obstacles, and reduced detection accuracy due to multipath interference.
In recent years, reflectarrays have been proposed as a technology for controlling the direction of electromagnetic waves in order to solve these issues with 5G and 6G communications and millimeter-wave radar (sensors).
A reflectarray (electromagnetic wave reflector) is a component that reflects electromagnetic waves, and includes not only those that perform symmetrical reflection where the angle of incidence and the angle of reflection are equal, but also those that perform asymmetrical reflection where the angle of incidence and the angle of reflection are different, those that retroreflect electromagnetic waves in the direction of incidence, those that scatter electromagnetic waves in multiple directions, and those that concentrate electromagnetic waves at a specific location.

 特許文献1には、特定の周波数帯の電磁波を正反射方向とは異なる方向に反射する周波数選択反射板(リフレクトアレイ)であって、均一の入射方向から入射する平面波に対し、反射方向の異なるメイン領域と複数のサブ領域を並べることで平面波の反射ビームを広げることも狭めることも可能とするものが開示されている。
 また特許文献2には、第一の素子および第二の素子を一つずつ並べたスーパーセルを複数配置することで、指向性利得を低下させずに、複数の入反射角度の通信を可能とするリフレクトアレイが開示されている。
Patent Document 1 discloses a frequency-selective reflector (reflector array) that reflects electromagnetic waves of a specific frequency band in a direction different from the direction of specular reflection, and that can widen or narrow the reflected beam of a plane wave incident from a uniform incident direction by arranging a main region and multiple sub-regions with different reflection directions.
Patent Document 2 also discloses a reflectarray that enables communication at multiple incident and reflection angles without reducing directional gain by arranging multiple supercells, each of which has one first element and one second element arranged in a row.

国際公開第2023/027195号International Publication No. 2023/027195 特開2023-22427号公報Japanese Patent Application Laid-Open No. 2023-22427

 しかしながら従来のリフレクトアレイは、設計入射角で入射する特定の周波数帯の電磁波に対して、正反射方向とは異なる設計反射角方向に反射させる機能を有するが、設計入射角以外の入射波に対しては、正常に機能しないことが多い。また、リフレクトアレイはサイズが大きくなると反射ビームが鋭くなり、反射ビームの照射エリアは狭くなる。こうしたリフレクトアレイの特性から、5G・6G通信においては(a)リフレクトアレイの設置位置または設置角度がずれる、(b)端末位置がずれる、(c)入反射ビーム上に人や物などの障害物が一時的に存在する場合に端末が十分な受信電力を得ることができない等、リフレクトアレイの入射または反射ビームに対する入射角または反射角が設計からずれた場合に通信の安定性が損なわれるという課題がある。ミリ波レーダー(センサー)においても同様の理由から動体検知の安定性が損なわれるという課題がある。 However, while conventional reflectarrays function to reflect electromagnetic waves of a specific frequency band incident at a designed angle of incidence in a direction different from the specular reflection direction, they often do not function properly for incident waves at angles other than the designed angle of incidence. Furthermore, as the size of a reflectarray increases, the reflected beam becomes sharper and the area illuminated by the reflected beam becomes narrower. Due to these characteristics of reflectarrays, 5G and 6G communications face issues where communication stability can be compromised if the angle of incidence or reflection of the reflectarray's incident or reflected beam deviates from the design, such as (a) a deviation in the installation position or angle of the reflectarray, (b) a deviation in the terminal position, or (c) the terminal being unable to obtain sufficient reception power if an obstacle such as a person or object temporarily exists in the incident or reflected beam. Millimeter-wave radar (sensors) also face issues where motion detection stability can be compromised for similar reasons.

 特許文献1は、周波数選択反射板の反射ビームプロファイルを調整することで、所定の設計入射角から入射する平面波に対して反射波のビーム幅を広げる機能に関し開示はあるが、設計入射角以外から入射する平面波に対して同様の機能をもたせることに関し説明がない。また球面波の入射に対して球面波の反射ビームを広げる機能についても開示はあるが、各分割領域ごとに一意に定まる球面入射波の入射方向ベクトルの相違を補正しつつ、各分割領域の反射方向ベクトルを異なるように設定するもので、一意に定まる入射方向ベクトルからずれた方向からの入射に関する作用効果に関する説明はない。
 特許文献2は、複数の入反射角度による通信を可能とする旨の記載はあるが、入射または反射ビームの入射角または反射角の設計からのずれに対する通信の安定性確保に関する課題認識はない。
 そこで本発明は、リフレクトアレイの入射または反射ビームに対する入射角または反射角が設計からずれた場合でも安定した通信・動体検知を可能にする技術の提供を目的とする。
Patent Document 1 discloses a function for adjusting the reflected beam profile of a frequency selective reflector to widen the beam width of a reflected wave for a plane wave incident from a predetermined design angle of incidence, but does not explain how a similar function can be provided for a plane wave incident from an angle other than the design angle of incidence. Patent Document 1 also discloses a function for widening the reflected beam of a spherical wave for a spherical wave incident, but this is done by correcting the difference in the incident direction vector of the spherical incident wave, which is uniquely determined for each divided region, and setting the reflection direction vector for each divided region to be different, and does not explain the effect of the incident from a direction deviated from the uniquely determined incident direction vector.
Although Patent Document 2 describes that communication is possible using a plurality of incident and reflection angles, it does not recognize the problem of ensuring communication stability when the incident angle or reflection angle of the incident or reflected beam deviates from the design.
Therefore, an object of the present invention is to provide a technology that enables stable communication and moving object detection even when the angle of incidence or angle of reflection of the incident or reflected beam of the reflectarray deviates from the design.

 上記の課題を解決するために、代表的な本発明のリフレクトアレイの一つは、特定の周波数帯の電磁波に対して、式(1)を満たす任意の設計入射角θiからの平面波を式(2)を満たす任意の設計反射角θrに最も強く反射する複数種類の反射制御領域を有し、
 
 下り通信(または放射波)において、設計中心入射角[θi]dを中心として式(3)を満たす±α度の角度範囲(以下、「下り入射角度範囲±α」という。)で入射した平面波が、設計中心反射角[θr]dを中心として前記±α度の角度範囲(以下、「下り反射角度範囲±α」という。)における反射強度(バイスタティックRCS)の平均値が、前記下り反射角度範囲±αを除く-90度から90度の角度範囲における反射強度の平均値よりも5dB以上高くなるように、前記下り反射角度範囲±αに強く反射し、かつ、入射角[θi]dからの平面波の反射角[θr]dへの反射強度をσ[θi]d[θr]dとするとき、前記下り反射角度範囲±α内の任意の反射角[θr]dについて式(4)から導出される反射強度の変動係数C[θr]dが0.6以下になることを特徴とするものである。
In order to solve the above problems, one representative reflectarray of the present invention has a plurality of types of reflection control regions that most strongly reflect a plane wave from an arbitrary design incident angle θi that satisfies Equation (1) to an arbitrary design reflection angle θr that satisfies Equation (2) for an electromagnetic wave in a specific frequency band,

In downstream communication (or radiation wave), a plane wave incident within an angle range of ±α degrees (hereinafter referred to as the "downstream incident angle range ±α") that satisfies formula ( 3 ) around the design central incident angle [θi 0 ]d is strongly reflected within the downstream reflection angle range ±α so that the average value of the reflection intensity (bistatic RCS) within the angle range of ±α degrees (hereinafter referred to as the "downstream reflection angle range ±α") around the design central reflection angle [θr 0 ]d is 5 dB or more higher than the average value of the reflection intensity within the angle range of -90 degrees to 90 degrees excluding the downstream reflection angle range ±α, and when the reflection intensity of the plane wave from the incident angle [θi]d to the reflection angle [θr]d is σ[θi]d[θr]d, the coefficient of variation C [θr]d of the reflection intensity derived from formula (4) for any reflection angle [θr]d within the downstream reflection angle range ±α is 0.6 or less.

 本発明によれば、リフレクトアレイの入射または反射ビームに対する入射角または反射角が設計からずれた場合でも安定した通信・動体検知を可能にすることができる。
 上記した以外の課題、構成および効果は、以下の実施をするための形態における説明により明らかにされる。
According to the present invention, stable communication and moving object detection can be achieved even if the angle of incidence or angle of reflection of the incident or reflected beam on the reflectarray deviates from the design.
Problems, configurations, and effects other than those described above will become apparent from the following description of the preferred embodiments.

図1は、リフレクトアレイの層構成の一例を示す断面図である。FIG. 1 is a cross-sectional view showing an example of a layer structure of a reflect array. 図2は、素子パターン形状の例を示す図である。FIG. 2 is a diagram showing an example of an element pattern shape. 図3は、反射制御領域部分を拡大して示した模式図の一例である。FIG. 3 is an example of a schematic diagram showing an enlarged reflection control area portion. 図4は、単一リフレクトアレイの特性1を説明する模式図である。FIG. 4 is a schematic diagram illustrating characteristic 1 of a single reflectarray. 図5は、単一リフレクトアレイの特性2を説明する模式図である。FIG. 5 is a schematic diagram illustrating characteristic 2 of a single reflectarray. 図6は、単一リフレクトアレイの特性3を説明する模式図である。FIG. 6 is a schematic diagram illustrating characteristic 3 of a single reflectarray. 図7は、単一リフレクトアレイによる電波中継の障害例を示す模式図である。FIG. 7 is a schematic diagram showing an example of a failure in radio wave relay using a single reflectarray. 図8は、本実施形態に係るリフレクトアレイが実現する機能を説明する模式図である。FIG. 8 is a schematic diagram illustrating the function realized by the reflect array according to this embodiment. 図9Aは、実施形態1のリフレクトアレイにおける、下り通信電波(または放射波)の入反射の全体像を示す模式図である。FIG. 9A is a schematic diagram showing an overall image of incident and reflected downstream communication radio waves (or radiation waves) in the reflect array of the first embodiment. 図9Bは、実施形態2のリフレクトアレイにおける、上り通信電波(または受信波)の入反射の全体像を示す模式図である。FIG. 9B is a schematic diagram showing an overall image of incident and reflected upstream communication radio waves (or received waves) in the reflect array of the second embodiment. 図10は、実施例1のリフレクトアレイにおける反射制御領域(群)の並びの模式図である。FIG. 10 is a schematic diagram of an arrangement of reflection control regions (groups) in the reflect array of Example 1. 図11は、実施例1および比較例1、比較例2のリフレクトアレイにおける反射パターン(バイスタティックRCS)を示すグラフである。FIG. 11 is a graph showing reflection patterns (bistatic RCS) of the reflectarrays of Example 1 and Comparative Examples 1 and 2. 図12は、実施例2および比較例3のリフレクトアレイにおける反射パターン(バイスタティックRCS)を示すグラフである。FIG. 12 is a graph showing the reflection patterns (bistatic RCS) of the reflectarrays of Example 2 and Comparative Example 3.

 以下、図面を参照して、本発明の実施形態について説明する。なお、この実施形態により本発明が限定されるものではない。また、図面の記載において、同一部分には同一の符号を付して示している。 Below, an embodiment of the present invention will be described with reference to the drawings. Note that the present invention is not limited to this embodiment. In addition, in the drawings, identical parts are denoted by the same reference numerals.

 以下の説明において、xyz座標系を適用し、リフレクトアレイはxy平面上に形成するものとする。z軸の正の向きを上方、負の向きを下方ということもある。z軸上からxy平面を見た(平面視した)ときの図を平面図、z軸に平行な面で切った面をその垂直方向から見た(断面視した)ときの図を断面図という。
 リフレクトアレイのxy平面における形状は任意であるが、以下の説明ではリフレクトアレイは最も単純な四角形を仮定し、リフレクトアレイの各辺がそれぞれx軸、y軸に平行となるよう形成される。
In the following description, an xyz coordinate system is applied, and the reflectarray is formed on the xy plane. The positive direction of the z axis is sometimes referred to as upward, and the negative direction as downward. A view of the xy plane viewed from above the z axis (planar view) is called a plan view, and a view of a plane cut by a plane parallel to the z axis viewed from the perpendicular direction (cross-section view) is called a cross-sectional view.
The shape of the reflectarray in the xy plane is arbitrary, but in the following description, the reflectarray is assumed to be the simplest rectangle, and is formed so that each side of the reflectarray is parallel to the x-axis and y-axis, respectively.

 以下の説明において、「面」とは、板状部材の面のみならず、板状部材に含まれる層について、板状部材の面と略平行な層の界面も指すことがある。また、「上面」、「下面」とは、板状部材や板状部材に含まれる層を図示した場合の、図面上の上方または下方に示される面を意味する。 In the following description, "surface" may refer not only to the surface of a plate-shaped member, but also to the interface of a layer contained in a plate-shaped member that is approximately parallel to the surface of the plate-shaped member. Furthermore, "upper surface" and "lower surface" refer to the surface shown at the top or bottom of a drawing of a plate-shaped member or a layer contained in a plate-shaped member.

 以下の説明において、電磁波(電波)は平面波を想定しているが、平面波というときは、実用上、遠方界距離において波面が事実上平面とみなし得る電磁波も含む。本開示において電磁波(電波)のことを単に平面波ということもある。理論的には波面は無限に広がるものの、実用上、遠方界距離において波面は事実上平面であるとみなされる。この性質は物理学や工学の様々な分野で使用されており、本開示の範囲内においてもその応用が可能とされている。 In the following description, electromagnetic waves (radio waves) are assumed to be plane waves, but when referring to plane waves, this also includes electromagnetic waves whose wavefronts can be considered to be virtually flat at far-field distances. In this disclosure, electromagnetic waves (radio waves) are sometimes simply referred to as plane waves. Although the wavefront theoretically extends infinitely, in practice, the wavefront can be considered to be virtually flat at far-field distances. This property is used in various fields of physics and engineering, and its application is also possible within the scope of this disclosure.

<リフレクトアレイの構成>
 まずリフレクトアレイの構成について説明する。図1は、リフレクトアレイの層構成の一例を示す断面図である。図1に示すように、リフレクトアレイ4、40は、少なくとも素子パターン1、誘電体層2、グランド層3が+z軸方向から-z軸方向に向かう向きに積層された構成を有している。以下の説明において、素子パターン1、誘電体層2、グランド層3の3層からなる構成を「基本構成」という。
<Reflectarray configuration>
First, the configuration of the reflectarray will be described. Fig. 1 is a cross-sectional view showing an example of the layer configuration of a reflectarray. As shown in Fig. 1, the reflectarrays 4 and 40 have a configuration in which at least an element pattern 1, a dielectric layer 2, and a ground layer 3 are layered in a direction from the +z-axis direction to the -z-axis direction. In the following description, the configuration consisting of the three layers of the element pattern 1, the dielectric layer 2, and the ground layer 3 will be referred to as the "basic configuration."

 実用上、リフレクトアレイは基本構成の素子パターン1側あるいはグランド層3側、もしくは両方に各種機能性を有する層(付加機能層5)を単数あるいは複数積層させることが好ましい。素子パターン1側への積層方式は、素子間の空隙を完全に埋めるよう積層してもよいし、素子の空隙を残したまま素子の上面を覆うよう積層してもよい。付加機能層5としては例えば、景観に考慮するための意匠層や、電磁波反射板を壁や天井、支持体等に容易に設置できるようにするための設置層や、基本構成を保護するための保護層や、各種機能性を付与するための機能層などが挙げられる。
 また、必要に応じて、素子パターン1と誘電体層2の間、グランド層3と誘電体層2の間、誘電体層2および素子パターン1と付加機能層5の間に、それぞれの密着力を向上させるための密着向上層が形成されていてもよい。密着向上層は接着剤から構成される。接着剤は、水分散系接着剤であってもよく、溶液系接着剤であってもよく、無溶剤系接着剤であってもよく、固体系接着剤であってもよい。
 前述の付加機能層と密着向上層をまとめて機能層ということがある。
In practice, it is preferable that the reflectarray have one or more layers (additional function layers 5) having various functions laminated on the element pattern 1 side of the basic configuration, the ground layer 3 side, or both. The lamination method on the element pattern 1 side may be to completely fill the gaps between the elements, or to cover the upper surfaces of the elements while leaving the gaps between the elements. Examples of the additional function layers 5 include a design layer that takes the scenery into consideration, an installation layer that makes it easy to install the electromagnetic wave reflector on a wall, ceiling, support, etc., a protective layer that protects the basic configuration, and a functional layer that imparts various functions.
Furthermore, if necessary, an adhesion improving layer may be formed between the element pattern 1 and the dielectric layer 2, between the ground layer 3 and the dielectric layer 2, and between the dielectric layer 2 and the element pattern 1 and the additional function layer 5 in order to improve the adhesion between the elements. The adhesion improving layer is made of an adhesive. The adhesive may be a water-dispersion adhesive, a solution-based adhesive, a solventless adhesive, or a solid-based adhesive.
The aforementioned additional functional layer and adhesion improving layer are sometimes collectively referred to as functional layers.

(素子パターン)
 素子パターン1は、入射してきた電磁波を非対称反射させ、対称反射とは異なる方向へ反射させるために設けられる。素子パターンの厚みは、例えば、10nm以上105μm以下である。
 素子パターン1は、表面抵抗値が100Ω/□以下であることが好ましい。素子パターン1に用いる材料としては、例えば、導電性を有する材料で構成されている。係る材料としては、グランド層3に用いられる材料と同じ材料を用いることが可能である。導電性を有する無機材料または有機材料を誘電体層上に製膜してもよい。柔軟性、成膜性、安定性、シート抵抗値および低コストの観点から、後述する形成方法として、蒸着法により製膜されたものを素子パターン1として用いることが好ましい。
(Element pattern)
The element pattern 1 is provided to asymmetrically reflect the incident electromagnetic wave in a direction different from that of the symmetric reflection. The thickness of the element pattern is, for example, 10 nm to 105 μm.
The element pattern 1 preferably has a surface resistance of 100 Ω/□ or less. The material used for the element pattern 1 may be, for example, a conductive material. The same material as that used for the ground layer 3 may be used. A film of a conductive inorganic or organic material may be formed on the dielectric layer. From the viewpoints of flexibility, film-forming properties, stability, sheet resistance, and low cost, it is preferable to use a film formed by vapor deposition, which is a formation method described below, as the element pattern 1.

 素子パターン1の形状としてはクロスパッチが挙げられるがこれに限られるものではない。図2は、素子パターン形状の例を示す図である。図2に示すように、連続膜、メッシュ状、パンチング形状に代表される電波を反射する任意の形状の素子パターン1でリフレクトアレイが形成されてよい。例えば、クロスパッチ(図2(a))の代わりに、立方体パッチ(図2(b))、円柱パッチ(図2(c))、三角柱パッチ(図2(d))、エルサレムクロスパッチ(図2(e))、並列的な複数の導電性パターン(図2(f))、リング状の導電性パターン(図2(g))、またはこれらを複数組合せた素子パターン(図2(h))が使用されてよい。 The shape of the element pattern 1 can be, but is not limited to, a cross patch. Figure 2 is a diagram showing an example of the element pattern shape. As shown in Figure 2, a reflectarray may be formed using element patterns 1 of any shape that reflects radio waves, such as a continuous film, a mesh, or a punched shape. For example, instead of a cross patch (Figure 2(a)), a cubic patch (Figure 2(b)), a cylindrical patch (Figure 2(c)), a triangular prism patch (Figure 2(d)), a Jerusalem cross patch (Figure 2(e)), multiple parallel conductive patterns (Figure 2(f)), a ring-shaped conductive pattern (Figure 2(g)), or an element pattern that combines multiple of these (Figure 2(h)) may be used.

 素子パターン1がクロスパッチの場合を説明する。クロスパッチは、xy平面において、2つの方形パッチが直交した形状を指す。クロスパッチの素子パターンの長さを素子長、クロスパッチの素子パターンの幅を素子幅とする。素子長および素子幅のどちらか、または両方を変化させ、単位セルの反射位相を制御する。素子長を固定する場合、素子長の値を単位セル内においてできるだけ大きく設定することが望ましい。大きく設定することにより、所望の反射位相特性を得ることが容易になる。また、素子幅を固定する場合、素子幅の値を単位セル内においてできるだけ大きく設定することが望ましい。素子幅の値を大きく設定することにより、反射位相の傾きが緩やかになる為、加工時の加工精度が広がる。なお、素子長は、クロスパッチの素子パターンに限定して設定されるものではなく、他の形状を有する素子パターンにも設定され得る。また、素子長は、反射制御領域において共通の長さを設定することも可能であるし、反射制御領域に含まれる素子パターンごとに異なる長さを設定することも可能である。 The following describes the case where element pattern 1 is a cross patch. A cross patch refers to a shape in the xy plane where two rectangular patches intersect at right angles. The length of the cross patch element pattern is called the element length, and the width of the cross patch element pattern is called the element width. The reflection phase of the unit cell is controlled by varying either the element length or the element width, or both. When the element length is fixed, it is desirable to set the element length value as large as possible within the unit cell. Setting it large makes it easier to obtain the desired reflection phase characteristics. When the element width is fixed, it is desirable to set the element width value as large as possible within the unit cell. Setting the element width value large makes the slope of the reflection phase gentler, thereby improving processing accuracy. Note that the element length is not limited to being set for cross patch element patterns, but can also be set for element patterns with other shapes. The element length can be set to a common length within the reflection control region, or it can be set to a different length for each element pattern included in the reflection control region.

 素子パターン1の形成方法として、誘電体層2上に、導電性を有する材料を全面に形成し連続膜としたのち、加工により、素子パターンを形成する方法、または、直接、誘電体層上に素子パターン層を形成する方法をとることができる。
 誘電体層2上に、導電性を有する材料を全面に連続膜として形成する方法として、金属であれば、スパッタ法や蒸着法などのドライコーティング、めっき処理や金属インキを用いるグラビアコーティング、ダイコーティングなどのウェットコーティング、等から選択することが可能である。または、金属板を圧延したものを誘電体層に貼り合せることができる。同様に無機酸化物材料であればドライコーティング、有機系材料であれば、ウェットコーティングにより、連続膜を形成することができる。また、塗装やスプレー法を用いてもよい。
The method of forming the element pattern 1 can be a method of forming a conductive material over the entire surface of the dielectric layer 2 to form a continuous film, and then forming the element pattern by processing, or a method of forming an element pattern layer directly on the dielectric layer.
As a method for forming a continuous film of a conductive material over the entire surface of the dielectric layer 2, for metals, dry coating such as sputtering or vapor deposition, plating or gravure coating using metallic ink, wet coating such as die coating, etc. can be selected. Alternatively, a rolled metal plate can be attached to the dielectric layer. Similarly, a continuous film can be formed by dry coating for inorganic oxide materials, or wet coating for organic materials. Painting or spraying methods can also be used.

 形成した連続膜に対しては、ドライエッチングやウェットエッチング、切削などの除去加工を用いて不要部分を取り除くことにより、素子パターンが形成される。
 エッチング法にて除去加工を行う場合、リフレクトアレイを構成する素子パターンの端部にRがついたり(言い換えると、丸みを帯びた状態になったり)、ピンホールの発生、断面形状が順テーパー形状や逆テーパー形状となったり、アンダーカットまたはオーバーエッチングの発生などが起こりうる。こうした、エッチングの加工で形状変化が起きることが想定されるが、基本構成において反射した電磁波のうちメインビームの方向が設計した反射角度の±5°程度の範囲であれば反射位相特性として許容されるものとする。切削や印刷法、ドライコーティング、めっき処理、塗装やスプレー法で形成した場合も同様に許容される。
The continuous film thus formed is subjected to removal processing such as dry etching, wet etching, or cutting to remove unnecessary portions, thereby forming an element pattern.
When etching is used for removal processing, the edges of the element patterns that make up the reflect array may become rounded (in other words, they may become rounded), pinholes may occur, the cross-sectional shape may become forward or reverse tapered, or undercut or over-etching may occur. While such shape changes are expected to occur during the etching process, as long as the direction of the main beam of the reflected electromagnetic waves in the basic configuration is within a range of about ±5° of the designed reflection angle, this is considered to be an acceptable reflection phase characteristic. Formation by cutting, printing, dry coating, plating, painting, or spraying is also acceptable.

 なお、誘電体層上に素子パターンを直接形成する方法として、凸版印刷、平版印刷、凹版印刷、孔版印刷、転写印刷などを用いて印刷する方法や、誘電体層にマスキングテープやマスキング剤等で素子パターン部分以外をマスキング処理し、素子パターンをドライコーティングやめっき処理、塗装やスプレー法を用いることで、形成することもできる。
素子パターンの断面形状は、上面から下面にかけて裾が広がるような形状である順テーパー形状であることが好ましい。順テーパー形状であることにより、素子パターンの表面積が大きくなり、後述する機能層の積層時に機能層との密着力を大きくし、気泡の混入を抑制することが可能となる。
Methods for directly forming an element pattern on a dielectric layer include printing using letterpress printing, lithographic printing, intaglio printing, stencil printing, transfer printing, etc., or masking the dielectric layer except for the element pattern area with masking tape or a masking agent, etc., and then forming the element pattern using dry coating, plating, painting, or spraying.
The cross-sectional shape of the element pattern is preferably a forward tapered shape that widens from the top to the bottom. The forward tapered shape increases the surface area of the element pattern, which increases the adhesion to the functional layer when the functional layer is laminated, as described below, and makes it possible to suppress the inclusion of air bubbles.

 素子パターン1の材料は、グランド層3と同一のものを用いてもよいし、異なる材料を用いてもよい。なお、例えば、グランド層または素子パターンの少なくとも一方の層がCuもしくはAlによって形成されることとすることも可能である。Cuは導電性に優れるため、導体損失を低減することができる。Alは密度が小さく軽量でありまたコストが低いため、軽量かつ安価なリフレクトアレイを形成できる。 The material of the element pattern 1 may be the same as that of the ground layer 3, or a different material may be used. For example, at least one of the ground layer and element pattern layers may be made of Cu or Al. Cu has excellent conductivity, which reduces conductor loss. Al has a low density, is lightweight, and is inexpensive, making it possible to form a lightweight and inexpensive reflect array.

 素子パターン1がメッシュ状である場合、メッシュの線幅は、5μm以上30μm以下が好ましく、6μm以上15μm以下がより好ましい。メッシュの線間隔は、50μm以上500μm以下が好ましく、100μm以上300μm以下がより好ましい。また、メッシュの線間隔は、動作周波数における波長をλとしたとき、0.5×λ以下であることが好ましく、0.1×λ以下であることがより好ましく、0.01×λ以下であることがさらに好ましい。メッシュの線間隔が0.5×λ以下であれば性能を担保することができる。また、メッシュの線間隔は、0.001×λ以上であってもよい。金属メッシュや透明導電材料を使用した場合、リフレクトアレイが可視光透過性を示し、設置後の景観を保つことを可能にする。
 素子パターンがメッシュ状である場合や、透明導電材料を使用した場合、リフレクトアレイが可視光透過性を示し、設置後の景観を保つことを可能にする。
When the element pattern 1 is in a mesh shape, the line width of the mesh is preferably 5 μm or more and 30 μm or less, and more preferably 6 μm or more and 15 μm or less. The line spacing of the mesh is preferably 50 μm or more and 500 μm or less, and more preferably 100 μm or more and 300 μm or less. Furthermore, when the wavelength at the operating frequency is λ, the line spacing of the mesh is preferably 0.5 × λ or less, more preferably 0.1 × λ or less, and even more preferably 0.01 × λ or less. If the line spacing of the mesh is 0.5 × λ or less, performance can be ensured. Furthermore, the line spacing of the mesh may be 0.001 × λ or more. When a metal mesh or a transparent conductive material is used, the reflect array exhibits visible light transparency, making it possible to maintain the appearance after installation.
When the element pattern is mesh-shaped or when a transparent conductive material is used, the reflect array exhibits visible light transparency, making it possible to maintain the appearance after installation.

 素子パターン1の形態が薄膜の場合、付加機能層および密着向上層との密着が向上する他、リフレクトアレイの可撓性を向上させることが可能であり、それにより曲面での使用やロールtoロールでの生産プロセスを実施することが可能となる。
 素子パターンを薄膜を用いて形成する場合、その厚みは以下の式(9)から算出される表皮深さよりも大きいことが好ましい。ただし、dは表皮深さ、ωは角周波数、μは材料の透磁率、σは材料の導電率である。
 電波の反射効率を高めるため、素子による電波損失を低減させることが挙げられる。そのため、素子の表面粗さは小さいほうが好ましい。
When the element pattern 1 is in the form of a thin film, adhesion with the additional functional layer and the adhesion improving layer is improved, and the flexibility of the reflect array can be improved, making it possible to use it on curved surfaces and to carry out a roll-to-roll production process.
When the element pattern is formed using a thin film, the thickness thereof is preferably greater than the skin depth calculated from the following equation (9): where d is the skin depth, ω is the angular frequency, μ is the magnetic permeability of the material, and σ is the electrical conductivity of the material.
In order to increase the reflection efficiency of radio waves, it is necessary to reduce radio wave loss caused by the element, and therefore it is preferable that the surface roughness of the element is small.

(誘電体)
 誘電体には、単体の樹脂の他に、紙やガラス繊維や炭素繊維などに樹脂を含侵させた複合材料の使用が挙げられる。
 単体の樹脂には例えば、ポリエチレン(εr=2.2~2.4)、ポリプロピレン(εr=2.0~2.6)、ポリスチレン(εr=2.4~2.6)、ポリ塩化ビニル(εr=2.8~8.0)、AS樹脂(εr=2.6~3.1)、ABS樹脂(εr=2.4~4.1)、ポリエチレンテレフタレート(εr=2.9~3.0)、アクリル樹脂(εr=2.7~4.5)、ウレタン樹脂(εr=4.0~7.1)、エポキシ樹脂(εr=2.5~6.0)、ナイロン(εr=3.0~5.0)、ポリイミド(εr=2.4~2.7)、フッ素樹脂(εr=2.0~2.6)、ポリカーボネート(εr=2.9~8.9)、ポリフェニレンエーテル(εr=2.8~8.2)、ポリフェニレンサルファイド(εr=3.2~4.6)、ポリフッ化ビニリデン(εr=6.4~10.0)、ポリエチレンナフタレート(εr=2.9)、フェノール樹脂(εr=3.0~12.0)、シクロオレフィンポリマー(εr=2.3~2.5)等が挙げられる。ここで、εrは比誘電率を示す。とりわけ、安価で汎用性に優れている点から、ポリエチレン(PS)やポリエチレンテレフタレ一卜(PET)、シクロオレフィンポリマー(COP)などを用いることが好ましい。また、誘電体層は、単層あるいは複層とすることもできる。また、誘電体層は、上記材料を発泡化した発泡体を使用してもよい。また、発泡体としては、柔軟性の高い発泡体が好ましく用いられる。
(Dielectric)
As the dielectric, in addition to a simple resin, composite materials such as paper, glass fiber, or carbon fiber impregnated with resin can be used.
Examples of simple resins include polyethylene (εr=2.2 to 2.4), polypropylene (εr=2.0 to 2.6), polystyrene (εr=2.4 to 2.6), polyvinyl chloride (εr=2.8 to 8.0), AS resin (εr=2.6 to 3.1), ABS resin (εr=2.4 to 4.1), polyethylene terephthalate (εr=2.9 to 3.0), acrylic resin (εr=2.7 to 4.5), urethane resin (εr=4.0 to 7.1), epoxy resin (εr=2.5 to 6.0), nylon (εr Examples of suitable dielectric materials include polyimide (εr = 2.4 to 2.7), fluororesin (εr = 2.0 to 2.6), polycarbonate (εr = 2.9 to 8.9), polyphenylene ether (εr = 2.8 to 8.2), polyphenylene sulfide (εr = 3.2 to 4.6), polyvinylidene fluoride (εr = 6.4 to 10.0), polyethylene naphthalate (εr = 2.9), phenolic resin (εr = 3.0 to 12.0), and cycloolefin polymer (εr = 2.3 to 2.5). Here, εr indicates the relative dielectric constant. In particular, polyethylene (PS), polyethylene terephthalate (PET), and cycloolefin polymer (COP) are preferred due to their low cost and versatility. The dielectric layer can be a single layer or multiple layers. The dielectric layer may also be made of foamed materials made from the above materials. As the foam, a foam with high flexibility is preferably used.

 複合材料には例えば、紙/フェノール樹脂、紙/エポキシ樹脂、ガラス/エポキシ樹脂、ガラス/フッ素樹脂の複合材料等が挙げられる。
 他にも、誘電率調整の観点から、樹脂成分同士、あるいは誘電性化合物と樹脂成分とを含有する混合物の使用が挙げられる。混合物における比誘電率は誘電性化合物の選択及びその含有量に応じて調整可能である。
 混合物の比誘電率は例えば、Maxwell-Garnett則を用いて予測可能である。比誘電率εaの誘電体Aと、比誘電率εbの誘電体Bの混合物において、誘電体Aの体積分率がδaである場合、混合物の比誘電率εmは以下の式(10)の関係式によって示される。
 誘電性化合物としては、例えばチタン酸バリウム(εr=250~20000)、酸化チタン(εr=83~183)、ジルコン酸チタン酸鉛、タンタル酸ビスマス酸ストロンチウム、ビスマスフェライト等が挙げられる。
 透明性を有する誘電体を使用した場合、リフレクトアレイが可視光透過性を示し、設置後の景観を保つことを可能にする。
Examples of composite materials include composite materials of paper/phenol resin, paper/epoxy resin, glass/epoxy resin, and glass/fluororesin.
Another example is the use of a mixture containing resin components or a dielectric compound and a resin component, from the viewpoint of adjusting the dielectric constant. The relative dielectric constant of the mixture can be adjusted by selecting the dielectric compound and its content.
The dielectric constant of a mixture can be predicted, for example, by using the Maxwell-Garnett law. In a mixture of a dielectric A having a dielectric constant εa and a dielectric B having a dielectric constant εb, when the volume fraction of the dielectric A is δa, the dielectric constant εm of the mixture is expressed by the following relational expression (10):
Examples of the dielectric compound include barium titanate (εr=250 to 20,000), titanium oxide (εr=83 to 183), lead zirconate titanate, strontium tantalate bismuthate, and bismuth ferrite.
When a transparent dielectric is used, the reflectarray exhibits visible light transmittance, making it possible to maintain the appearance after installation.

 誘電体層2の比誘電率は、1以上20以下の範囲にあることが好ましく、1以上10以下の範囲にあることがより好ましく、2以上4以下の範囲にあることがさらに好ましい。比誘電率が上記範囲内であると、リフレクトアレイにおいて所望の反射位相特性を得やすい傾向にある。また、誘電正接は0.00005以上0.01以下の範囲にあることが好ましく、0.00005以上0.001以下の範囲にあることが好ましい。上記範囲内であると、誘電損失の少ないリフレクトアレイを作製できる。 The relative dielectric constant of the dielectric layer 2 is preferably in the range of 1 or more and 20 or less, more preferably in the range of 1 or more and 10 or less, and even more preferably in the range of 2 or more and 4 or less. If the relative dielectric constant is within the above range, it tends to be easier to obtain the desired reflection phase characteristics in the reflectarray. Furthermore, the dielectric loss tangent is preferably in the range of 0.00005 or more and 0.01 or less, and more preferably in the range of 0.00005 or more and 0.001 or less. If it is within the above range, a reflectarray with low dielectric loss can be produced.

 誘電体層2は、例えば、ダイコーティングやコンマコーティング、グラビアコーティングなどのウェットコーティング、Tダイ法やインフレーション法などの溶融押出法、カレンダー製膜法、溶液流延法、熱プレス法などを用いて形成することができる。また、複数の樹脂を多層に押し出してフィルムを製膜する共押出法を用いてもよい。 The dielectric layer 2 can be formed using, for example, wet coating such as die coating, comma coating, or gravure coating; melt extrusion methods such as the T-die method or inflation method; calendar film formation; solution casting; or heat pressing. Co-extrusion, in which multiple resins are extruded in multiple layers to form a film, may also be used.

 誘電体層2の厚みは、設計周波数により適宜選択される。設計周波数を28GHzとした場合、40μm以上250μm以下であることが好ましく、50μm以上200μm以下であることがより好ましい。薄すぎると反射位相の確保が困難となり、リフレクトアレイの設計が難しくなる。一方で、厚すぎても、反射位相の確保が困難となる、可撓性がなくなる、リフレクトアレイの総厚が厚くなるなどの傾向があり、省スペース化が難しくなる。このため、誘電体層の厚みは、250μm以下が好ましい。設計周波数を60GHzとした場合、誘電体層の厚みは10μm以上250μm以下であることが好ましい。設計周波数が100GHz以上になる場合、誘電体層の厚みを数μm以上100μm以下程度にすると、リフレクトアレイを設計しやすい。 The thickness of the dielectric layer 2 is selected appropriately depending on the design frequency. When the design frequency is 28 GHz, it is preferably 40 μm or more and 250 μm or less, and more preferably 50 μm or more and 200 μm or less. If it is too thin, it becomes difficult to ensure the reflection phase, making the design of the reflectarray difficult. On the other hand, if it is too thick, it tends to become difficult to ensure the reflection phase, the flexibility will be lost, and the total thickness of the reflectarray will increase, making it difficult to save space. For this reason, the thickness of the dielectric layer is preferably 250 μm or less. When the design frequency is 60 GHz, the thickness of the dielectric layer is preferably 10 μm or more and 250 μm or less. When the design frequency is 100 GHz or more, a thickness of the dielectric layer of several μm or more and 100 μm or less will make it easier to design the reflectarray.

(グランド層)
 グランド層3は、リフレクトアレイ4に到達する電磁波を反射させるために設けられる。また、誘電体層2を支持および保護するために用いられる。グランド層の材料として、無機酸化物材料、金属材料や導電性を有する有機材料など、導電性を有する材料が用いられる。グランド層の厚みは、例えば、10nm以上105μm以下である。
(Ground layer)
The ground layer 3 is provided to reflect electromagnetic waves that reach the reflect array 4. It is also used to support and protect the dielectric layer 2. The ground layer is made of a conductive material such as an inorganic oxide material, a metal material, or a conductive organic material. The thickness of the ground layer is, for example, 10 nm to 105 μm.

 例えば、無機酸化物材料および金属材料としては、酸化インジウムスズ(ITO)、酸化インジウム亜鉛(IZO)、酸化亜鉛アルミニウム(AZO)、酸化ガリウム亜鉛(GZO)、酸化スズアンチモン、Ag、Al、Au、Pt、Pd、Cu、Co、Cr、In、Ag-Cu、Cu-AuおよびNiなどが用いられる。また、これらの材料のうちの少なくとも1つを含むナノ粒子、またはナノワイヤーを用いてもよい。導電性を有する有機材料としては、ポリチオフェン誘導体、ポリアセチレン誘導体、ポリアニリン誘導体、ポリピロール誘導体、カーボンナノチューブ、グラフェン等が挙げられる。特に材料コスト、導電性、製膜性の観点から、CuやAlが好ましい。また、電磁波を反射させるためにはグランド層の表面抵抗値が100Ω/□以下であることが望ましく、この条件を満たすことができればITOやポリエチレンジオキシチオフェン(PEDOT)とポリスチレンスルホン酸(PSS)との混合物(PEDOT/PSS)などを用いることによって、透明性を有するリフレクトアレイを作製することもできる。
 上記材料を用いる形態としては連続膜、メッシュ状、パンチング形状、周期性構造が挙げられる。
For example, inorganic oxide materials and metal materials include indium tin oxide (ITO), indium zinc oxide (IZO), zinc aluminum oxide (AZO), gallium zinc oxide (GZO), antimony tin oxide, Ag, Al, Au, Pt, Pd, Cu, Co, Cr, In, Ag—Cu, Cu—Au, and Ni. Nanoparticles or nanowires containing at least one of these materials may also be used. Conductive organic materials include polythiophene derivatives, polyacetylene derivatives, polyaniline derivatives, polypyrrole derivatives, carbon nanotubes, and graphene. Cu and Al are particularly preferred from the standpoints of material cost, conductivity, and film formation. Furthermore, to reflect electromagnetic waves, it is desirable for the surface resistance of the ground layer to be 100 Ω/□ or less. If this condition can be met, a transparent reflect array can also be fabricated using ITO or a mixture of polyethylenedioxythiophene (PEDOT) and polystyrene sulfonic acid (PSS) (PEDOT/PSS).
The above materials can be used in the form of a continuous film, a mesh, a punched shape, or a periodic structure.

 ここで、メッシュとは、導体の平面に網目状の透孔(開口)が空いた状態をいう。導体がメッシュ状に形成される場合、メッシュの目は方形であってもよく、菱形であってもよい。メッシュの目を方形に形成する場合、メッシュの目は正方形であることが好ましい。メッシュの目が正方形であれば、意匠性がよい。また、自己組織化法によるランダム形状でもよい。ランダム形状にすることでモアレを防ぐことができる。金属をメッシュ状に加工する場合、金属板のパンチング加工、金属板のエッチング等の方法を採用することが可能である。
 グランド層3がメッシュ状である場合や、透明導電材料を使用した場合、リフレクトアレイが可視光透過性を示し、設置後の景観を保つことを可能にする。
 グランド層3がメッシュ状である場合、メッシュの線幅は、5μm以上30μm以下が好ましく、6μm以上15μm以下がより好ましい。メッシュの線間隔は、50μm以上500μm以下が好ましく、100μm以上300μm以下がより好ましい。また、メッシュの線間隔は、動作周波数における波長をλとしたとき、0.5×λ以下であることが好ましく、0.1×λ以下であることがより好ましく、0.01×λ以下であることがさらに好ましい。メッシュの線間隔が0.5×λ以下であれば性能を担保することができる。また、メッシュの線間隔は、0.001×λ以上であってもよい。
Here, mesh refers to a state in which a conductor has a mesh-like opening (opening) on its plane. When the conductor is formed in a mesh shape, the mesh may be rectangular or diamond-shaped. When the mesh is formed in a rectangular shape, the mesh is preferably square. Square meshes provide good design. They may also be randomly shaped by a self-organizing method. Making the mesh randomly can prevent moire. When processing metal into a mesh shape, methods such as punching a metal plate or etching a metal plate can be used.
When the ground layer 3 is mesh-shaped or when a transparent conductive material is used, the reflect array exhibits visible light transparency, making it possible to maintain the appearance after installation.
When the ground layer 3 is mesh-shaped, the line width of the mesh is preferably 5 μm to 30 μm, more preferably 6 μm to 15 μm. The line spacing of the mesh is preferably 50 μm to 500 μm, more preferably 100 μm to 300 μm. Furthermore, when the wavelength at the operating frequency is λ, the line spacing of the mesh is preferably 0.5×λ or less, more preferably 0.1×λ or less, and even more preferably 0.01×λ or less. If the line spacing of the mesh is 0.5×λ or less, performance can be ensured. Furthermore, the line spacing of the mesh may be 0.001×λ or more.

 グランド層3の形成方法として、金属材料を用いる場合であれば、スパッタ法や蒸着法などのドライコーティング、金属材料をインキ化することによりグラビアコーティング、ダイコーティングなどのウェットコーティング、めっき処理などの表面処理、等から選択することが可能である。または、グランド層として、金属板を圧延したものを用いてもよい。無機酸化物材料を用いる場合であれば、グランド層の形成方法として、ドライコーティングを選択することができる。有機材料を用いる場合であれば、グランド層の形成方法として、ウェットコーティングを選択することができる。また、塗装やスプレー法で形成してもよい。
 グランド層3の形態がめっき処理や蒸着法等で形成された薄膜の場合、リフレクトアレイの可撓性を向上させることが可能であり、それにより曲面での使用やロールtoロールでの生産プロセスを実施することが可能となる。
 グランド層3の形態が薄膜の場合、その厚みは素子パターンと同様に式(9)から算出される表皮深さよりも大きいことが好ましい。
 また、電磁波の反射効率を高めるため、グランド層による損失を低減させることが挙げられる。そのため、グランド層の表面粗さは小さいほうが好ましい。
When a metal material is used, the ground layer 3 can be formed by dry coating such as sputtering or vapor deposition, wet coating such as gravure coating or die coating by turning the metal material into ink, or surface treatment such as plating. Alternatively, a rolled metal plate can be used as the ground layer. When an inorganic oxide material is used, dry coating can be selected as the ground layer formation method. When an organic material is used, wet coating can be selected as the ground layer formation method. Alternatively, the ground layer can be formed by painting or spraying.
If the ground layer 3 is in the form of a thin film formed by plating or vapor deposition, the flexibility of the reflect array can be improved, making it possible to use it on curved surfaces or to implement a roll-to-roll production process.
When the ground layer 3 is in the form of a thin film, its thickness is preferably larger than the skin depth calculated from equation (9) in the same manner as the element pattern.
Furthermore, in order to increase the reflection efficiency of electromagnetic waves, it is also necessary to reduce loss due to the ground layer, so it is preferable that the surface roughness of the ground layer is small.

 グランド層3の形態が周期性構造である場合、特定の周波数を選択的に反射または透過させる機能が発現し得る。例えば、パッチ状の導電パターンが周期的に配置された構造をグランド層として使用した場合、特定の周波数のみを反射させることが可能となるため、動作周波数以外の周波数を透過させる機能を付与することができる。また、導電材料が存在しない箇所をホールとして周期的に設けた構造を使用した場合、動作周波数を非対称反射させつつ、特定の周波数のみを透過させるリフレクトアレイを設計することが可能である。 If the ground layer 3 has a periodic structure, it can exhibit the function of selectively reflecting or transmitting specific frequencies. For example, if a structure with periodically arranged patch-like conductive patterns is used as the ground layer, it will be possible to reflect only specific frequencies, thereby providing the ability to transmit frequencies other than the operating frequency. Furthermore, if a structure is used in which holes are periodically arranged where no conductive material is present, it will be possible to design a reflect array that asymmetrically reflects the operating frequency while transmitting only specific frequencies.

 本開示においては、JIS-K-7194に準拠し、表面抵抗測定を行う。表面抵抗測定方法としては、四端子法、二端子法、四探針法、誘電体法、渦電流法など、測定法を適宜選択しうる。グランド層の表面抵抗値は、例えばロレスターGP MCP-T610(商品名、株式会社三菱化学アナリテック製)を用いて測定することができる。 In this disclosure, surface resistance measurements are performed in accordance with JIS-K-7194. Surface resistance measurement methods can be selected appropriately, including the four-terminal method, two-terminal method, four-probe method, dielectric method, and eddy current method. The surface resistance of the ground layer can be measured, for example, using the Loresta GP MCP-T610 (product name, manufactured by Mitsubishi Chemical Analytech Co., Ltd.).

(付加機能層)
 付加機能層5は、必要に応じてその機能を選択することができる。付加される機能として、例えば、劣化防止性、意匠性、保護・耐擦傷性、防水性、ガス・水蒸気バリア性、難燃性、不燃性、自己消火性、耐候性、防汚、抗菌・抗ウィルス、耐薬品、消臭性、粘着・接着性などが挙げられる。これらの機能を1つ付加させてもよいし、複数を組み合わせてもよい。付加機能層の厚みは、例えば、5μm以上6mm以下である。
 シート状の付加機能層を積層する方法としては、ラミネート、押出ラミネートなどを用いることでの貼り合わせが挙げられ、液状の付加機能層を塗布する方法としては、印刷、コーティング、ドライラミネート、ウェットラミネートなどが挙げられるが、これに限るものではない。また、付加機能層に粘着性や接着性がない場合、密着向上層(接着剤)を用いてリフレクトアレイに密着させる方法がある。
(additional functional layer)
The function of the additional functional layer 5 can be selected as needed. Examples of functions that can be added include deterioration prevention, design, protection/scratch resistance, waterproofing, gas/water vapor barrier properties, flame retardancy, non-combustibility, self-extinguishing, weather resistance, stain resistance, antibacterial/antiviral properties, chemical resistance, deodorizing properties, and adhesiveness/bonding properties. One of these functions may be added, or multiple functions may be combined. The thickness of the additional functional layer is, for example, 5 μm or more and 6 mm or less.
Methods for laminating a sheet-like additional functional layer include bonding using lamination, extrusion lamination, etc., and methods for applying a liquid additional functional layer include, but are not limited to, printing, coating, dry lamination, wet lamination, etc. Furthermore, if the additional functional layer does not have tackiness or adhesiveness, there is a method for adhering it to the reflectarray using an adhesion improving layer (adhesive).

[耐候性]
 リフレクトアレイの劣化の原因として、大気中に曝したことによる酸化や水蒸気の吸収、太陽光などの光(紫外線)による変質、が考えられる。酸素や水蒸気による劣化を防ぐために、リフレクトアレイの表面にバリアフィルム等のガスバリア性に優れた層を付与することが考えられる。また、特に酸素による劣化を防ぐには、機能層の酸素透過度が500cc/m・atm・day以下であることが好ましい。この条件を満たすことができれば、フィルムを積層してもよいし、オーバーコート層をドライコーティングまたはウェットコーティングにより付与してもよい。またこれらの層は単層でもよいし、複数を組み合わせたり、積層したりしてもよい。バリアフィルムとしては、例えば、エチレンビニルアルコール共重合樹脂などの単体フィルム、共押出多層ナイロン(Ny)フィルム、塩化ビニリデン(PVDC)コートやポリビニルアルコール(PVA)コートのウェットコートフィルムなどが挙げられる。
 また、誘電体層の劣化を防ぐために、誘電体層の形成時に酸化防止剤や劣化防止剤、抗酸化素材を添加してもよい。同様に水蒸気による劣化を防ぐ場合、水蒸気透過度が300g/m・day以下である層を設けることが好ましい。太陽光などからの光を防ぐ場合、はUVカット性を有するフィルムや遮光性を有する層を付与することが考えられる。また、紫外線散乱剤、紫外線吸収剤や光安定剤を添加してもよい。UVカットフィルムとしては、例えば、塩化ビニル系樹脂やポリオレフィン系樹脂などが挙げられる。
[Weather resistance]
Possible causes of reflectarray deterioration include oxidation and water vapor absorption due to exposure to the atmosphere, and alteration due to light (ultraviolet rays) such as sunlight. To prevent deterioration due to oxygen and water vapor, it is possible to provide a layer with excellent gas barrier properties, such as a barrier film, on the surface of the reflectarray. Furthermore, to prevent deterioration due to oxygen in particular, it is preferable that the oxygen permeability of the functional layer be 500 cc/ ·atm·day or less. If this condition can be met, a film may be laminated, or an overcoat layer may be provided by dry coating or wet coating. These layers may be single layers, or multiple layers may be combined or laminated. Examples of barrier films include a single film such as an ethylene-vinyl alcohol copolymer resin, a coextruded multilayer nylon (Ny) film, and a wet-coated film coated with vinylidene chloride (PVDC) or polyvinyl alcohol (PVA).
Furthermore, to prevent deterioration of the dielectric layer, an antioxidant, anti-deterioration agent, or antioxidant material may be added when forming the dielectric layer. Similarly, to prevent deterioration due to water vapor, it is preferable to provide a layer with a water vapor permeability of 300 g/ m2 ·day or less. To protect against light from sunlight, etc., it is possible to provide a film with UV protection or a layer with light-blocking properties. Furthermore, an ultraviolet scattering agent, an ultraviolet absorber, or a light stabilizer may be added. Examples of UV-blocking films include vinyl chloride resins and polyolefin resins.

[意匠性]
 リフレクトアレイを例えば建物の外装または内装に設置する場合、空間との調和を持たせるために、意匠性を付与することが考えられる。具体的には、意匠を施したシート状の素材を接着剤を用いてリフレクトアレイに貼り合せる、または、シート状の素材を熱・圧力をかけてリフレクトアレイに溶着させて貼り付ける、等によって意匠性を付与することができる。例えば、基材シート、下地絵柄層、透明熱可塑性樹脂層をこの順に積層することにより印刷絵柄と表面エンボス模様が同調した化粧シートや、絵柄層、透明樹脂層および表面保護層をこの順に積層することにより本物の木材や石材に近い色味とした化粧シートなどが挙げられる。
[Design]
When a reflectarray is installed on the exterior or interior of a building, for example, it is possible to impart a design to it so that it harmonizes with the space. Specifically, the design can be imparted by bonding a designed sheet-like material to the reflectarray using an adhesive, or by welding and attaching the sheet-like material to the reflectarray by applying heat and pressure. Examples of such decorative sheets include a decorative sheet in which a printed pattern and an embossed surface pattern are harmonized by laminating a base sheet, a base pattern layer, and a transparent thermoplastic resin layer in this order, and a decorative sheet in which a color similar to that of real wood or stone is achieved by laminating a pattern layer, a transparent resin layer, and a surface protection layer in this order.

[保護・耐擦傷性]
 保護・耐擦傷性とは、リフレクトアレイに傷がつくことを防止したり、リフレクトアレイそのものの劣化を防止したりする機能のことである。このような機能を付与する方法として、リフレクトアレイにコーティング加工を施して表面硬度を高めたり、合成樹脂フィルムを積層したりすることができる。保護・耐擦傷性の評価として、JIS K5600-5-4にもとづく鉛筆硬度試験にて実施し、H以上であることが好ましい。また、スチールウール(#0000)を用いて荷重1,000gf/cmで擦った時に、往復摺動回数が1000回を超えるまでは傷が生じないことが好ましい。合成樹脂としては、例えば、ポリエチレンテレフタレート、シクロオレフィンポリマー、ポリエチレン、ポリプロピレン、ポリ塩化ビニル、ポリスチレン、ポリメチルメタクリレート、ポリエステル、ポリフォルムアルデヒド、ポリアミド、ポリフェニレンエーテル、塩化ビニリデン、ポリ酢酸ビニル、ポリビニルアセタール、AS樹脂、ABS樹脂、アクリル樹脂、フッ素樹脂、ナイロン樹脂、ポリアセタール樹脂、ポリカーボネート樹脂、ポリアミド樹脂、ポリウレタン樹脂などが挙げられる。
[Protection/scratch resistance]
Protection and scratch resistance refers to the function of preventing scratches on the reflectarray and preventing deterioration of the reflectarray itself. Methods for imparting such functions include coating the reflectarray to increase its surface hardness or laminating a synthetic resin film. Protection and scratch resistance are evaluated by a pencil hardness test based on JIS K5600-5-4, and the hardness is preferably H or higher. Furthermore, when rubbed with steel wool (#0000) at a load of 1,000 gf/ cm2 , it is preferable that scratches do not occur until the number of reciprocating strokes exceeds 1,000. Examples of synthetic resins include polyethylene terephthalate, cycloolefin polymer, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polymethyl methacrylate, polyester, polyformaldehyde, polyamide, polyphenylene ether, vinylidene chloride, polyvinyl acetate, polyvinyl acetal, AS resin, ABS resin, acrylic resin, fluororesin, nylon resin, polyacetal resin, polycarbonate resin, polyamide resin, and polyurethane resin.

[難燃性、不燃性、自己消火性]
 リフレクトアレイに難燃性、不燃性を付与する方法として、建築基準法に規定される防火認定が適用された不燃材料、準不燃材料、難燃材料を積層することにより付与できる。例えば難燃繊維や難燃プラスチック、不燃塗料、難燃塗料などがある。難燃繊維としてハロゲン系化合物、リン系化合物、ビニロン繊維、ポリエーテルイミド繊維、アラミド繊維、ポリエステル繊維、ビニロン繊維、などがある。難燃プラスチックとして、プラスチック材料にハロゲン系、リン系、水酸化アルミニウムや水酸化マグネシウムなどの無機系難燃剤を添加したものがある。また、自己消火性を有する材料として、ナイロン、ポリカーボネート、塩化ビニルなどが挙げられる。
[Flame retardant, non-flammable, self-extinguishing]
A method of imparting flame retardancy or non-combustibility to a reflectarray is to layer non-combustible, quasi-non-combustible, or flame-retardant materials that have been certified as fireproof under the Building Standards Act. Examples include flame-retardant fibers, flame-retardant plastics, non-combustible paints, and flame-retardant paints. Flame-retardant fibers include halogen-based compounds, phosphorus-based compounds, vinylon fibers, polyetherimide fibers, aramid fibers, polyester fibers, and vinylon fibers. Flame-retardant plastics include plastic materials to which halogen-based, phosphorus-based, or inorganic flame retardants such as aluminum hydroxide and magnesium hydroxide have been added. Self-extinguishing materials include nylon, polycarbonate, and polyvinyl chloride.

[防汚、抗菌、抗ウィルス性]
 リフレクトアレイに防汚性を付与する方法として、親水性や撥水性を有する基材を積層したりコーティングしたりすることが感がられる。親水性を有する材料として、光触媒材料やシリカ系材料などを用いることができる。撥水性を有する材料として、フッ素樹脂系、シリコーン系などの材料を用いることができる。抗菌、抗ウィルス性材料として光触媒材料、塩素系、カチオンポリマーを成分とする有機系、銀や亜鉛など金属担持系などが含まれた材料を用いることができる。形成方法としては、これら材料フィルムとして積層するまたはコーティング加工に用いる、誘電体層の形成時に混合する、等の方法を採用することができる。
[Anti-fouling, antibacterial, anti-viral]
One method of imparting antifouling properties to a reflectarray is to laminate or coat it with a hydrophilic or water-repellent substrate. Photocatalytic materials, silica-based materials, and the like can be used as hydrophilic materials. Fluorocarbon resin-based, silicone-based, and other materials can be used as water-repellent materials. Photocatalytic materials, chlorine-based materials, organic materials containing cationic polymers, and materials containing metals such as silver and zinc can be used as antibacterial and antiviral materials. These materials can be laminated as films or used in coating processes, or mixed when forming a dielectric layer, for example.

(密着向上層)
 密着向上層は、層同士を接着する接着力をもつ層である。密着向上層は、2層以上の層によって構成されるものでもよいし、複数材料を組み合わせた構成であってもよい。本実施形態において密着向上層は、グランド層と誘電体層、または誘電体層と素子パターン、または誘電体層および素子パターンと付加機能層を接着させるものであり、接着剤から構成される。接着剤は、水分散系接着剤であってもよく、溶液系接着剤であってもよく、無溶剤系接着剤であってもよく、固体系接着剤であってもよい。接着剤としては、エポキシ樹脂系接着剤、ポリ酢酸ビニル系接着剤、ニトリルゴム系接着剤、フェノール樹脂接着剤、酢酸ビニル系接着剤、クロロプレンゴム系接着剤、アクリル樹脂系接着剤、ポリビニルアルコール樹脂系接着剤、シリコーンゴム系接着剤、スチレンブタジエンゴム系接着剤、ウレタン系接着剤などが挙げられる。なお、密着向上層は接着剤に加え、任意の合成樹脂等の物質や任意の部材を含んでいてもよい。密着向上層の厚みは、例えば、5μm以上500μm以下である。
 付加機能層に粘着性や接着性がない場合、密着向上層を用いてリフレクトアレイに貼り合せることができる。
 また機能層は、単層または複層の付加機能層、単層または複層の密着向上層、もしくは付加機能層と密着向上層を単数あるいは複数重ねた層を含む総称である。
(Adhesion improving layer)
The adhesion improving layer is a layer that has adhesive strength to bond layers together. The adhesion improving layer may be composed of two or more layers or may be composed of a combination of multiple materials. In this embodiment, the adhesion improving layer bonds the ground layer and the dielectric layer, or the dielectric layer and the element pattern, or the dielectric layer, the element pattern, and the additional function layer, and is composed of an adhesive. The adhesive may be a water-dispersion adhesive, a solution-based adhesive, a solventless adhesive, or a solid-based adhesive. Examples of adhesives include epoxy resin-based adhesives, polyvinyl acetate-based adhesives, nitrile rubber-based adhesives, phenolic resin-based adhesives, vinyl acetate-based adhesives, chloroprene rubber-based adhesives, acrylic resin-based adhesives, polyvinyl alcohol resin-based adhesives, silicone rubber-based adhesives, styrene-butadiene rubber-based adhesives, and urethane-based adhesives. In addition to the adhesive, the adhesion improving layer may also contain any synthetic resin or other material or any other component. The thickness of the adhesion improving layer is, for example, 5 μm to 500 μm.
If the additional function layer does not have tackiness or adhesiveness, it can be attached to the reflectarray using an adhesion improving layer.
The functional layer is a general term including a single or multiple additional functional layer, a single or multiple adhesion improving layer, or a layer in which a single or multiple additional functional layer and an adhesion improving layer are stacked.

(設置層)
 設置層はリフレクトアレイを支持体と固定するための層である。例えば、接着層や粘着層、支持体が金属製の場合マグネットの使用が挙げられる。マグネットを使用した場合、リフレクトアレイの位置や角度を容易に変えることができる。
(installation layer)
The mounting layer is a layer used to fix the reflectarray to the support. For example, an adhesive layer, a sticky layer, or a magnet can be used if the support is made of metal. When a magnet is used, the position and angle of the reflectarray can be easily changed.

(支持体)
 リフレクトアレイは支持体に設置される。支持体としては、新規にパネルやポールを設置しても構わないし、既存の看板や壁、天井等を用いても構わない。支持体には、リフレクトアレイの角度を上下あるいは左右方向に調節することができる機構を有することが好ましく、さらに、リフレクトアレイの位置を上下左右に動かす機構を有することがより好ましい。支持体にリフレクトアレイを設置し、リフレクトアレイ装置として用いられる。
(Support)
The reflectarray is installed on a support. The support may be a newly installed panel or pole, or an existing signboard, wall, ceiling, etc. It is also possible to use such an existing support. The support preferably has a mechanism that can adjust the angle of the reflectarray in the vertical or horizontal direction, and more preferably has a mechanism that can move the position of the reflectarray up, down, left, and right. The reflectarray is installed on the support and used as a reflectarray device.

 また、リフレクトアレイは設置層により人の肌や服、装着具などに貼付けて使用されてもよい。 The reflectarray may also be attached to human skin, clothing, or wearable equipment using an installation layer.

<リフレクトアレイの設計>
 次にリフレクトアレイの設計について説明する。
(反射制御領域)
 反射制御領域は、その領域に入射した電磁波を所定の方向へ反射させることができる最小の領域である。反射制御領域という場合、電磁波が入射する領域に平行な方向にある2次元の領域に加えて、領域に垂直な方向に形成される層構造をも含むものとする。
<Reflectarray design>
Next, the design of the reflectarray will be explained.
(Reflection control area)
The reflection control area is the smallest area that can reflect electromagnetic waves incident on that area in a predetermined direction. The reflection control area includes not only a two-dimensional area parallel to the area where the electromagnetic waves are incident, but also a layer structure formed in a direction perpendicular to the area.

 また、単位セルは、反射制御領域を区分した領域を指す。単位セルには1つの素子パターンが含まれる。単位セルは、1つの反射制御領域内に2つ以上存在する。1つの単位セルのみの辺のx軸方向のサイズをUx、y軸方向のサイズをUyと定義する。1つの反射制御領域内において、複数の単位セルがx軸方向に並んでいる辺のサイズ(長さ)をSxと定義する。 Furthermore, a unit cell refers to an area obtained by dividing a reflection control area. A unit cell contains one element pattern. Two or more unit cells exist within one reflection control area. The size of the side of only one unit cell in the x-axis direction is defined as Ux, and the size of the side in the y-axis direction is defined as Uy. Within one reflection control area, the size (length) of a side where multiple unit cells are lined up in the x-axis direction is defined as Sx.

 図3は、反射制御領域部分を拡大して示した模式図の一例である。図3(a)は反射制御領域6の斜視図である。図3(b)は反射制御領域6をy方向Uy/2で切ったxz平面における断面図(図3(b-1))と、設計入射角θi、設計反射角θrを示す模式図である(図3(b-2))。そして図3(c)は反射制御領域6の任意の単位セルをx方向Ux/2で切ったyz平面における断面図である。誘電体層2の一方のxy平面上には素子側面を有する素子パターン1が形成されており、他方のxy平面上にグランド層3が形成されている。単位セルが、反射制御領域を所定方向に沿って等間隔にn分割したものである場合、UxはSx/nである。ただし、nは2以上の整数である(図3の例ではx軸方向の長辺が3分割された3つの四角形の単位セルで反射制御領域が構成されている。)。 Figure 3 is an example of a schematic diagram showing an enlarged portion of the reflection control region. Figure 3(a) is a perspective view of the reflection control region 6. Figure 3(b) is a cross-sectional view of the reflection control region 6 in the xz plane taken along the y direction Uy/2 (Figure 3(b-1)), and a schematic diagram showing the design angle of incidence θi and the design angle of reflection θr (Figure 3(b-2)). Figure 3(c) is a cross-sectional view of an arbitrary unit cell of the reflection control region 6 taken along the x direction Ux/2 in the yz plane. An element pattern 1 having an element side surface is formed on one xy plane of the dielectric layer 2, and a ground layer 3 is formed on the other xy plane. When the unit cells are obtained by dividing the reflection control region into n equal parts along a predetermined direction, Ux is Sx/n, where n is an integer greater than or equal to 2 (in the example of Figure 3, the reflection control region is made up of three rectangular unit cells whose long side in the x-axis direction is divided into thirds).

 反射制御領域の設計は以下の手順に従って実施する。まず、反射制御領域の長辺の長さSxを以下の式(11)にて決定する。ここで、Sxは反射制御領域の長辺の長さ、λはリフレクトアレイに適用される電磁波の波長(以下、「動作(設計)周波数における波長」ともいう。)、θiは入射角、θrは反射角である。なお、入射角θiおよび反射角θrは、xz面において測定される値である。ここで、z軸と平行な方向をθi=θr=0°とし、x軸の正の方向に回転する角度をθi=θr=0~90°、負の方向に回転する角度をθi=θr=0~-90°とする(図3(b-2)参照)。
 次いで、各反射制御領域において要求される反射位相を以下の式(12)で求める。
 ここでZs(x)は、反射制御領域のxy平面におけるx方向の表面インピーダンスの関数であり、損失のない反射を実現する場合を示す。また、120πは入射波のインピーダンスである。表面インピーダンスの式は以下の式(13)のとおりである。
 ここで、Φr(x)は、以下の式(14)で示される、反射係数の位相である反射位相を示す。
 各式から以下の式(15)に示される反射位相(Rの偏角)を満たすよう、単位セルの位置ごとに素子形状を決定する。つまり、入射角θi、反射角θr、電磁波の波長λを決定すれば、反射制御領域の長辺方向にある座標における反射位相の値を算出することができる。
 上記方法によって反射位相を求めた後、各単位セルにおける反射位相を満たすよう、素子パターンの形状を変化させ、シミュレーションを行い、素子パターンの形状の最適化を行う。素子パターンに電磁波が入射した場合に、素子パターンの形状と反射位相との間の関係は、例えば電磁解析ツール(High Frequency Structure Simulator:HFSS)等を用いたシミュレーションにより求めることができる。
The reflection control area is designed according to the following procedure. First, the length Sx of the long side of the reflection control area is determined by the following formula (11). Here, Sx is the length of the long side of the reflection control area, λ is the wavelength of the electromagnetic wave applied to the reflectarray (hereinafter also referred to as the "wavelength at the operating (design) frequency"), θi is the angle of incidence, and θr is the angle of reflection. The angle of incidence θi and the angle of reflection θr are values measured in the xz plane. Here, the direction parallel to the z axis is defined as θi = θr = 0°, the angle of rotation in the positive direction of the x axis is defined as θi = θr = 0 to 90°, and the angle of rotation in the negative direction is defined as θi = θr = 0 to -90° (see FIG. 3(b-2)).
Next, the reflection phase required in each reflection control area is calculated using the following equation (12).
Here, Zs(x) is a function of the surface impedance in the x-direction in the xy plane of the reflection control area, and represents the case where lossless reflection is realized. Also, 120π is the impedance of the incident wave. The equation for the surface impedance is as follows:
Here, Φr(x) represents the reflection phase, which is the phase of the reflection coefficient, as shown in the following equation (14).
From each equation, the element shape is determined for each position of the unit cell so as to satisfy the reflection phase (deflection angle of R) shown in the following equation (15). In other words, by determining the angle of incidence θi, the angle of reflection θr, and the wavelength λ of the electromagnetic wave, it is possible to calculate the value of the reflection phase at the coordinate in the long side direction of the reflection control region.
After the reflection phase is calculated by the above method, the shape of the element pattern is changed so as to satisfy the reflection phase in each unit cell, and a simulation is performed to optimize the shape of the element pattern. When an electromagnetic wave is incident on the element pattern, the relationship between the shape of the element pattern and the reflection phase can be calculated by a simulation using, for example, an electromagnetic analysis tool (High Frequency Structure Simulator: HFSS) or the like.

(反射制御領域群)
 反射制御領域の集まりを反射制御領域群という。反射制御領域群は、単一の反射制御領域の集まりで構成されるもの(以下、「単一反射制御領域群」ということもある。ただし、単体の反射制御領域も含まれるものとする。)と、複数種類の単一反射制御領域群の組み合わせで構成されるもの(以下、「複合反射制御領域群」ということもある。)がある。本実施形態の対象となるリフレクトアレイ40は複合反射制御領域で構成され、単一反射制御領域群からなるリフレクトアレイ4(以下、「単一リフレクトアレイ」ということもある。)と区別される。
 リフレクトアレイ40が複合反射制御領域群によって構成されている場合には、複合反射制御領域群を構成する各単一反射制御領域群をx軸とy軸の少なくとも一方もしくは両方に並行となるように並べる。
(Reflection control area group)
A group of reflection control areas is called a reflection control area group. Reflection control area groups include those composed of a group of single reflection control areas (hereinafter also referred to as a "single reflection control area group", although this also includes a single reflection control area), and those composed of a combination of multiple types of single reflection control area groups (hereinafter also referred to as a "composite reflection control area group"). The reflectarray 40 that is the subject of this embodiment is composed of composite reflection control areas, and is distinguished from the reflectarray 4 composed of a single reflection control area group (hereinafter also referred to as a "single reflectarray").
When the reflect array 40 is composed of a composite reflection control region group, each of the single reflection control region groups constituting the composite reflection control region group is arranged parallel to at least one or both of the x-axis and y-axis.

<リフレクトアレイの特性>
 単一リフレクトアレイに対し電磁波が入反射する際に示す特性について説明する。リフレクトアレイは上述したように入射角θi、反射角θrとなるように設計されるものとする(係る単一リフレクトアレイをR(θi、θr)と表記することもある。)。
 以下の説明において、R(θi、θr)のリフレクトアレイに対し、入射角θiで入射し反射角θrで反射する電磁波の伝搬方向を順方向(下り通信/放射波)といい、入射角θrで入射し反射角θiで反射する電磁波の伝搬方向を逆方向(上り通信/受信波)ということとする。すなわち下り通信(放射波)では「入射角=設計入射角」「反射角=設計反射角」となり、上り通信(受信波)では「入射角=設計反射角」「反射角=設計入射角」となる。ある設計入射角θiが下り(downward)通信の入射角か、上り(upward)通信の反射角か明確にしたい場合に、前者に対し[θi]d、後者に対し[θi]uのように添字d、uを付すことがある。同様にある設計反射角θrが下り通信(放射波)の反射角か、上り通信(受信波)の入射角か明確にしたい場合に、前者に対し[θr]d、後者に対し[θr]uのように表記することがある。
 5G・6G通信において一般に順方向(下り通信)は、基地局→リフレクトアレイ→端末の方向に伝搬する電波を想定しており、逆方向(上り通信)は、端末→リフレクトアレイ→基地局の方向に伝搬する電波を想定している。また、ミリ波レーダー(センサー)において一般に順方向(放射波)は、電波発信部→リフレクトアレイ→対象物の方向に伝搬する電波を想定しており、逆方向(受信波)は、対象物→リフレクトアレイ→電波受信部の方向に伝搬する電波を想定している。受信波を強めることを目的として対象物に再帰性反射特性を有するリフレクトアレイを設置した場合、「設計入射角=設計反射角」となる。本開示において、電波の伝搬において通信やセンサー等の用途を特段区別する必要のない限り、下り通信(放射波)、上り通信(受信波)等と表記する。
<Characteristics of reflectarray>
The following describes the characteristics exhibited when an electromagnetic wave is incident on and reflected from a single reflectarray. As described above, the reflectarray is designed to have an incident angle θi and a reflection angle θr (such a single reflectarray is sometimes written as R(θi, θr)).
In the following description, the propagation direction of an electromagnetic wave incident on a reflectarray of R(θi, θr) at an incident angle θi and reflected at a reflection angle θr is referred to as the forward direction (downstream communication/radiated wave), and the propagation direction of an electromagnetic wave incident at an incident angle θr and reflected at a reflection angle θi is referred to as the reverse direction (upstream communication/received wave). That is, for downstream communication (radiated wave), the "incident angle = designed incident angle" and "reflection angle = designed reflection angle," and for upstream communication (received wave), the "incident angle = designed reflection angle" and "reflection angle = designed incident angle." When it is desired to clarify whether a certain design incident angle θi is the incident angle for downstream communication or the reflection angle for upstream communication, the subscripts d and u may be added to the former, such as [θi]d, and the latter, such as [θi]u. Similarly, when it is desired to clarify whether a design reflection angle θr is the reflection angle for downstream communication (radiated wave) or the incident angle for upstream communication (received wave), it may be expressed as [θr]d for the former and [θr]u for the latter.
In 5G and 6G communications, the forward direction (downstream communications) generally refers to radio waves propagating from the base station to the reflectarray to the terminal, while the reverse direction (upstream communications) generally refers to radio waves propagating from the terminal to the reflectarray to the base station. Furthermore, in millimeter-wave radar (sensors), the forward direction (radiated waves) generally refers to radio waves propagating from the radio wave transmitter to the reflectarray to the target, while the reverse direction (received waves) generally refers to radio waves propagating from the target to the reflectarray to the radio wave receiver. When a reflectarray with retroreflection properties is installed on a target to enhance the received waves, the "design incident angle = design reflection angle." In this disclosure, unless there is a need to distinguish between applications such as communications and sensors in radio wave propagation, the terms "downstream communications" (radiated waves), "upstream communications" (received waves), etc. will be used.

 図4は、単一リフレクトアレイの特性1を説明する模式図である。図4(a)に示すように、R(θi、θr)のリフレクトアレイ4に対し、下り通信で入射角[θi]dで入射した電波は反射角[θr]dの方向に最も強く反射するとともに、図4(b)に示すように、上り通信で入射角[θr]uで入射する電波は反射角[θi]uの方向に最も強く反射する特性を示す(リフレクトアレイの特性1)。 Figure 4 is a schematic diagram illustrating characteristic 1 of a single reflectarray. As shown in Figure 4(a), for a reflectarray 4 of R(θi, θr), radio waves incident at an incident angle [θi]d in downstream communications are reflected most strongly in the direction of reflection angle [θr]d, while as shown in Figure 4(b), radio waves incident at an incident angle [θr]u in upstream communications are reflected most strongly in the direction of reflection angle [θi]u (characteristic 1 of a reflectarray).

 図5は、単一リフレクトアレイの特性2を説明する模式図である。図5(a)に示すように、R(θi、θr)のリフレクトアレイ4に対し、下り通信でθiから数度(α度)ずれた入射角[θi―α]dで入射する電波はθrから数度(α度)ずれた反射角[θr+α]dの方向に電波を最も強く反射するとともに、図5(b)に示すように、上り通信でθrから数度(α度)ずれた入射角[θr+α]uで入射する電波はθiから数度(α度)ずれた反射角[θi―α]uの方向に電波を強く反射する特性を示す(リフレクトアレイの特性2)。 Figure 5 is a schematic diagram illustrating characteristic 2 of a single reflectarray. As shown in Figure 5(a), for a reflectarray 4 of R(θi, θr), radio waves incident at an incident angle [θi - α]d that is a few degrees (α degrees) off from θi in downstream communications are most strongly reflected in the direction of a reflection angle [θr + α]d that is a few degrees (α degrees) off from θr. Also, as shown in Figure 5(b), radio waves incident at an incident angle [θr + α]u that is a few degrees (α degrees) off from θr in upstream communications are strongly reflected in the direction of a reflection angle [θi - α]u that is a few degrees (α degrees) off from θi (characteristic 2 of a reflectarray).

 図6は、単一リフレクトアレイの特性3を説明する模式図である。図6(a)は数十センチ角の従来サイズのリフレクトアレイ4に対し電波が入反射する様子を示しているが、5Gに使用される高周波帯の電波の場合、図6(b)に示すように一般的にリフレクトアレイ4のサイズは従来の数十センチ角よりも大きいサイズのものが使用され、この場合原理的に利得が増加し、リフレクトアレイによる反射ビームは鋭くなる特性を示す(リフレクトアレイの特性3)。 Figure 6 is a schematic diagram illustrating characteristic 3 of a single reflectarray. Figure 6(a) shows how radio waves are incident on and reflected from a conventional reflectarray 4 measuring several tens of centimeters square. However, in the case of radio waves in the high frequency band used for 5G, as shown in Figure 6(b), reflectarrays 4 generally use sizes larger than the conventional size of several tens of centimeters square. In this case, the gain increases in principle, and the reflected beam from the reflectarray exhibits the characteristic of becoming sharper (reflectarray characteristic 3).

 こうした単一リフレクトアレイの示す特性により、電波を中継する際に障害が発生する問題が生ずる。図7は、単一リフレクトアレイによる5G・6G通信での電波中継の障害例を示す模式図である。単一リフレクトアレイの特性2および特性3により、下り通信において、(a)リフレクトアレイの設置位置または設置角度がずれる場合(図7(a)参照)、(b)端末位置がずれる場合(図7(b)参照)、(c)入反射ビーム上に人や物などの障害物が一時的に存在する場合(図7(c)参照)、端末は十分な受信電力を得ることができない。
 また単一リフレクトアレイの特性1により、上り通信においても下り通信と同様に基地局は十分な受信電力を得ることができない通信障害が発生する。
These characteristics of a single reflectarray cause problems when relaying radio waves. Figure 7 is a schematic diagram showing an example of a failure in radio wave relay using a single reflectarray in 5G/6G communications. Due to characteristics 2 and 3 of a single reflectarray, in downstream communications, the terminal cannot obtain sufficient reception power if (a) the installation position or installation angle of the reflectarray is shifted (see Figure 7(a)), (b) the terminal position is shifted (see Figure 7(b)), or (c) an obstacle such as a person or object temporarily exists on the incoming reflected beam (see Figure 7(c)).
Furthermore, due to the characteristic 1 of a single reflectarray, communication failure occurs in the upstream communication as well as the downstream communication, in that the base station is unable to obtain sufficient reception power.

<実施形態のリフレクトアレイの機能>
 本実施形態に係るリフレクトアレイは、上記実情に鑑みてなされたものである。図8は、本実施形態に係るリフレクトアレイが実現する機能を説明する模式図である。第一に、図8(a)に示すように、リフレクトアレイ40における下り通信の入射ビームの許容角度範囲(後述)を広げる機能を有する(機能1)。第二に、図8(b)に示すように、リフレクトアレイ40における下り通信の反射ビームの幅を広げる機能を有する(機能2)。第三に、図8(c)に示すように、上下通信の双方にて機能1と機能2を実現する機能を有する(機能3)。これら機能1~3により極めて安定した通信環境を端末利用者に提供することを可能とする。同様にして、ミリ波レーダー(センサー)においても極めて安定した動体検知をセンサー利用者に提供することを可能とする。
<Function of Reflect Array According to Embodiment>
The reflectarray according to this embodiment has been developed in consideration of the above-described circumstances. FIG. 8 is a schematic diagram illustrating the functions realized by the reflectarray according to this embodiment. First, as shown in FIG. 8( a), the reflectarray 40 has a function of widening the allowable angle range (described below) of the incident beam for downstream communication (function 1). Second, as shown in FIG. 8( b), the reflectarray 40 has a function of widening the width of the reflected beam for downstream communication (function 2). Third, as shown in FIG. 8( c), the reflectarray 40 has a function of achieving functions 1 and 2 in both uplink and downlink communication (function 3). These functions 1 to 3 make it possible to provide terminal users with an extremely stable communication environment. Similarly, millimeter-wave radar (sensor) also makes it possible to provide sensor users with extremely stable moving object detection.

<実施形態のリフレクトアレイの構成>
 次に上記機能を実現する本実施形態のリフレクトアレイ40の構成について説明する。本実施形態のリフレクトアレイ40は、特定の周波数帯の電磁波に対して、式(1)を満たす任意の設計入射角θiからの平面波を式(2)を満たす任意の設計反射角θrに最も強く反射する単一反射制御領域群を複数種類組み合わせてなる複合反射制御領域群を有する。複合反射制御領域群は、設計入射角または設計反射角の互いに異なる単一反射制御領域群をx軸方向に3個以上並置することが好ましく、並置する態様は別体の単一リフレクトアレイを並べることで形成してもよいし、共通の誘電体層上に一体的に形成されるものであってもよく特段限定されない。
<Configuration of Reflect Array According to Embodiment>
Next, the configuration of the reflectarray 40 of this embodiment that realizes the above-mentioned functions will be described. The reflectarray 40 of this embodiment has a composite reflection control area group formed by combining multiple types of single reflection control area groups that most strongly reflect plane waves from an arbitrary design angle of incidence θi that satisfies formula (1) to an arbitrary design angle of reflection θr that satisfies formula (2) for electromagnetic waves in a specific frequency band. The composite reflection control area group is preferably formed by juxtaposing three or more single reflection control area groups with different design angles of incidence or design reflection angles in the x-axis direction, and the manner in which they are juxtaposed may be formed by arranging separate single reflectarrays or may be formed integrally on a common dielectric layer, and is not particularly limited.

[実施形態1]
 図9Aは、実施形態1のリフレクトアレイにおける、下り通信電波(放射波)の入反射の全体像を示す模式図である。複合反射制御領域群であるリフレクトアレイ40において、中心に位置する単一反射制御領域群4-0の設計入反射角を設計中心入射角θiと設計中心反射角θrとしたときに、その周囲に配置される単一反射制御領域群は、設計入反射角が設計中心入反射角から共に同じだけずれていることが好ましい。例えば、図9Aに示すように、リフレクトアレイ40の中心位置にR(θi、θr)の反射制御領域群4-0を配置し、その両側にそれぞれ(θi-α、θr-α)の反射制御領域群4-1とR(θi+α、θr+α)の反射制御領域群4-2を配置する。反射制御領域群4-1と反射制御領域群4-2の位置は逆でもよい。
[Embodiment 1]
9A is a schematic diagram showing an overall image of the incident and reflected downstream communication radio waves (radiated waves) in the reflectarray of embodiment 1. In the reflectarray 40, which is a composite reflection control region group, when the design incident and reflection angles of the centrally located single reflection control region group 4-0 are the design central incident angle θi 0 and the design central reflection angle θr 0 , it is preferable that the design incident and reflection angles of the surrounding single reflection control region groups are both shifted by the same amount from the design central incident and reflection angle. For example, as shown in FIG. 9A , the reflection control region group 4-0 of R(θi 0 , θr 0 ) is located at the center of the reflectarray 40, and the reflection control region group 4-1 of (θi 0 -α, θr 0 -α) and the reflection control region group 4-2 of R(θi +α, θr 0 +α) are located on either side of it, respectively. The positions of the reflection control region group 4-1 and the reflection control region group 4-2 may be reversed.

 実施形態1のリフレクトアレイ40は、下り通信(放射波)において、図9Aに示すように設計中心入射角[θi]dにて入射した平面波は、リフレクトアレイ40を構成する全ての反射制御領域群(4-0、4-1、4-2)に入射角[θi]dで入射しそれぞれの反射制御領域群において非対称反射される。そして遠方界距離において各反射制御領域群での反射波は合成され、設計中心反射角[θr]dを中心に±β度のビーム幅を持つ平面波となる(後述)。同様に、設計中心入射角[θi]dを中心に±α度の角度範囲から入射した他の平面波は設計中心反射角[θr]dを中心に±β度のビーム幅を持つ平面波となる(後述)。 In the reflectarray 40 of embodiment 1, in downstream communication (radiated wave), as shown in FIG. 9A , a plane wave incident at a design central incident angle [θi 0 ]d is incident on all of the reflection control area groups (4-0, 4-1, 4-2) constituting the reflectarray 40 at the incident angle [θi 0 ]d and is asymmetrically reflected by each reflection control area group. Then, at the far-field distance, the reflected waves from each reflection control area group are combined to form a plane wave having a beam width of ±β degrees centered on the design central reflection angle [θr 0 ]d (described later). Similarly, other plane waves incident from an angle range of ±α degrees centered on the design central incident angle [θi 0 ]d become plane waves having a beam width of ±β degrees centered on the design central reflection angle [θr 0 ]d (described later).

(実施形態1-1)
 実施形態1―1のリフレクトアレイ40は、下り通信(放射波)において、設計中心入射角[θi]dを中心として以下の式(3)を満たす±α度の角度範囲(「下り入射角度範囲±α」)で入射した平面波を、設計中心反射角[θr]dを中心として前記±α度の角度範囲(「下り反射角度範囲±α」)に強く反射させる。ここに「強く反射」するとは、下り入射角度範囲±αで入射した電波が反射する際に、下り反射角度範囲±αにおける反射強度(バイスタティックRCS[sm])の平均値が、下り反射角度範囲±αを除く-90度から90度の角度範囲における反射強度の平均値よりも5dB以上高くなることをいう。
 さらに実施形態1―1のリフレクトアレイ40は、下り通信(放射波)の入射角[θi]dからの平面波の反射角[θr]dへの反射強度(RCS[sm])をσ[θi]d[θr]dとするとき、前記下り反射角度範囲±α内の任意の反射角[θr]dにおける以下の式(4)から導出される反射強度の変動係数C[θr]dが0.6以下になることを特徴とする。ここで、変動係数とは、データの相対的なばらつきを示す指標であり、下り入射角度範囲±αからの入射波に対する下り反射角度範囲±αの各反射角における反射強度の標準偏差を同平均にて割った値として、入射角のずれによる各反射角の反射強度のばらつき度合いを導出している。式(4)のjは-α~α度の入射角度範囲を1度で分割したときの各解析角度に対応する変数であり、解析角度数は2α+1となる。jを連続変数として式(4)を積分に置き換えて変動係数を導出することも可能である。変動係数が小さいほど入射角の違いによる反射強度のばらつき度合いが小さいことを意味する。
(Embodiment 1-1)
The reflectarray 40 of embodiment 1-1 strongly reflects, in downstream communication (radiated waves), plane waves incident within an angle range of ± α degrees ("downstream incident angle range ±α") that satisfies the following formula (3) around the design central incident angle [θi 0 ]d, to the angle range of ±α degrees ("downstream reflection angle range ±α") around the design central reflection angle [θr 0 ]d. Here, "strong reflection" means that when radio waves incident within the downstream incident angle range ±α are reflected, the average value of the reflection intensity (bistatic RCS [sm]) within the downstream reflection angle range ±α is 5 dB or more higher than the average value of the reflection intensity within the angle range of -90 degrees to 90 degrees excluding the downstream reflection angle range ±α.
Furthermore, the reflectarray 40 of embodiment 1-1 is characterized in that, when the reflection intensity (RCS[sm]) of a plane wave from an incident angle [θi]d of downstream communication (radiated wave) to a reflection angle [θr]d is σ[θi]d[θr]d, the variation coefficient C [θr]d of the reflection intensity at any reflection angle [θr]d within the downstream reflection angle range ±α, calculated from the following equation (4), is 0.6 or less. Here, the variation coefficient is an index indicating the relative variation in data, and is calculated as the value obtained by dividing the standard deviation of the reflection intensity at each reflection angle within the downstream reflection angle range ±α for an incident wave from the downstream incident angle range ±α by the average, thereby deriving the degree of variation in the reflection intensity at each reflection angle due to a shift in the incident angle. In equation (4), j is a variable corresponding to each analysis angle when the incident angle range of -α to α degrees is divided by 1 degree, and the number of analysis angles is 2α + 1. It is also possible to derive the variation coefficient by using j as a continuous variable and replacing equation (4) with an integral. The smaller the coefficient of variation, the smaller the degree of variation in reflection intensity due to differences in the angle of incidence.

 このように実施形態1-1のリフレクトアレイ40においては、下り入射角度範囲±αで入射する平面波の電波が、下り反射角度範囲±α内に強く反射し、かつ下り入射角度範囲±α内で入射する全ての電波に対する下り反射角度範囲±α内に反射する反射強度のばらつき度合いを示す変動係数が0.6以下で抑えられる。このときの角度範囲±αを許容入射角度範囲と呼ぶ。したがって実施形態1―1のリフレクトアレイ40は、下り通信(放射波)における許容入射角度範囲を、式(3)を満たす任意のαの値に広げる機能を有するということができる(機能1、図8(a)等参照)。 In this way, in the reflectarray 40 of embodiment 1-1, plane wave radio waves incident within the downstream incident angle range ±α are strongly reflected within the downstream reflection angle range ±α, and the coefficient of variation, which indicates the degree of variation in the reflection intensity reflected within the downstream reflection angle range ±α for all radio waves incident within the downstream incident angle range ±α, is kept at 0.6 or less. The angle range ±α in this case is called the allowable incident angle range. Therefore, it can be said that the reflectarray 40 of embodiment 1-1 has the function of expanding the allowable incident angle range for downstream communication (radiated waves) to any value of α that satisfies equation (3) (see Function 1, Figure 8(a), etc.).

(実施形態1-2)
 実施形態1-2のリフレクトアレイ40は、実施形態1-1の機能に加え、下り通信(放射波)において、下り入射角度範囲±αで入射した任意の平面波を、設計中心反射角[θr]dを中心として以下の式(6)を満たす±β度の角度範囲(以下、「下り反射角度範囲±β」という。)に広がりをもって反射させることができる(図9A参照)。ここに「広がりをもって反射」するとは、下り入射角度範囲±α内の任意の入射角[θi]dで入射した電波が反射する際に、下り反射角度範囲±βにおいて、以下の式(7)から導出される反射パターン(バイスタティックRCS[sm])の拡散度d[θi]dが0.6以上になることを意味する。
 ここでは、メタマテリアル拡散反射板における電波の反射指向特性の均一性を拡散度(Diffusion Coeffcient)として定義している。具体的には、ある方向からの入射波に対する反射方向別のRCSの自己相関係数を導出している。kは-β~β度の反射角度範囲を1度で分割したときの各解析角度に対応する変数であり、解析角度数は2β+1となる。kを連続変数として式(7)を積分に置き換えて拡散度を導出することも可能である。一般に全ての方向に均一な完全拡散反射ではdθ=1、完全鏡面反射ではdθ=0となる。
 したがって拡散度が大きいほど反射強度が広範囲に均等に広がることを意味することから、実施形態1-2のリフレクトアレイ40は、下り通信(放射波)における反射ビームの幅を下り反射角度範囲±βに均一に広げる機能を有する(機能2、図8(b)等参照)。
(Embodiment 1-2)
In addition to the functions of embodiment 1-1, the reflectarray 40 of embodiment 1-2 can reflect, in downstream communication (radiated waves), any plane wave incident at a downstream incident angle range ±α with a spread over an angle range of ± β degrees (hereinafter referred to as the "downstream reflection angle range ±β") that satisfies the following equation (6) around the design central reflection angle [θr 0 ]d (see FIG. 9A ). Here, "reflecting with a spread" means that when a radio wave incident at any incident angle [θi ]d within the downstream incident angle range ±α is reflected, the diffusivity d[θi]d of the reflection pattern (bistatic RCS[sm]) derived from the following equation (7) is 0.6 or more in the downstream reflection angle range ±β .
Here, the uniformity of the reflection directional characteristics of radio waves in a metamaterial diffuse reflector is defined as the diffusion coefficient. Specifically, the autocorrelation coefficient of the RCS for each reflection direction for an incident wave from a certain direction is derived. k is a variable corresponding to each analysis angle when the reflection angle range of -β to β degrees is divided by 1 degree, and the number of analysis angles is 2β + 1. It is also possible to derive the diffusion coefficient by replacing equation (7) with an integral using k as a continuous variable. Generally, for perfect diffuse reflection that is uniform in all directions, dθ = 1, and for perfect specular reflection, dθ = 0.
Therefore, since a higher degree of diffusion means that the reflection intensity is spread evenly over a wider area, the reflect array 40 of embodiment 1-2 has the function of uniformly spreading the width of the reflected beam in downstream communication (radiated wave) within the downstream reflection angle range ±β (function 2, see Figure 8(b) etc.).

[実施形態2]
 図9Bは、実施形態2のリフレクトアレイにおける、上り通信電波(受信波)の入反射の全体像を示す模式図である。リフレクトアレイ40は下り通信(放射波)で使用したものと同様である。上り通信(受信波)においても、図9Bに示すように設計中心反射角[θr]uにて入射した平面波はリフレクトアレイ40を構成する全ての反射制御領域群(4-0、4-1、4-2)に入射角[θr]uで入射し、それぞれの反射制御領域群において非対称反射される。そして遠方界距離において各反射制御領域群での反射波は合成され、設計中心入射角[θi]uを中心に±β度のビーム幅を持つ平面波となる。同様に、下り反射角度範囲±αから入射した他の任意の平面波は設計中心入射角[θi]uを中心に±β度のビーム幅を持つ平面波となる。
[Embodiment 2]
9B is a schematic diagram showing an overall image of the incident and reflected waves of upstream communication radio waves (received waves) in the reflectarray of embodiment 2. The reflectarray 40 is the same as the one used for downstream communication (radiated waves). In upstream communication (received waves), as shown in FIG. 9B, a plane wave incident at the design central reflection angle [θr 0 ]u is incident on all of the reflection control area groups (4-0, 4-1, 4-2) constituting the reflectarray 40 at an incident angle [θr 0 ]u and is asymmetrically reflected by each reflection control area group. At the far-field distance, the reflected waves from each reflection control area group are combined to form a plane wave with a beam width of ±β degrees centered around the design central incident angle [θi 0 ]u. Similarly, any other plane wave incident from within the downstream reflection angle range ±α becomes a plane wave with a beam width of ±β degrees centered around the design central incident angle [θi 0 ]u.

(実施形態2-1)
 実施形態2-1のリフレクトアレイ40は、実施形態1-1の機能に加え、上り通信(受信波)において、下り反射角度範囲±αで入射した平面波を、下り入射角度範囲±αに強く反射させる。ここに「強く反射」するとは下り通信(放射波)と同様に、下り反射角度範囲±αで入射した電波が反射する際に、下り入射角度範囲±αにおける反射強度(バイスタティックRCS)の平均値が、下り入射角度範囲±αを除く-90度から90度の角度範囲内における反射強度の平均値よりも5dB以上高くなることをいう。
 さらに実施形態2-1のリフレクトアレイ40は、上り通信(受信波)の入射角[θr]uからの平面波の反射角[θi]uへの反射強度(RCS[sm])をσ[θr]u[θi]uとするとき、下り入射角度範囲±α内の任意の反射角[θi]uにおける以下の式(5)から導出される反射強度の変動係数C[θi]uが0.6以下になることを特徴とする。変動係数の意味は下り通信(放射波)の場合と同様であるので詳細は省略する。
 下り通信(放射波)と同様に、実施形態2-1のリフレクトアレイ40は、上り通信(受信波)における許容入射角度範囲を、式(3)を満たす任意のαの値に広げる機能を有するということができる(機能3、図8(c)等参照)。
(Embodiment 2-1)
In addition to the functions of embodiment 1-1, the reflectarray 40 of embodiment 2-1 strongly reflects a plane wave incident within the downstream reflection angle range ±α to the downstream incident angle range ±α in upstream communication (received wave). Here, "strong reflection" means that, similar to downstream communication (radiated wave), when a radio wave incident within the downstream reflection angle range ±α is reflected, the average value of the reflection intensity (bistatic RCS) within the downstream incident angle range ±α is 5 dB or more higher than the average value of the reflection intensity within the angle range from -90 degrees to 90 degrees excluding the downstream incident angle range ±α.
Furthermore, the reflectarray 40 of embodiment 2-1 is characterized in that, when the reflection intensity (RCS[sm]) of a plane wave at a reflection angle [θi]u from an incident angle [θr]u of upstream communication (received wave) to a reflection angle [θi]u is σ[θr]u[θi]u, the variation coefficient C[θi]u of the reflection intensity, derived from the following equation (5), at any reflection angle [θi]u within a downstream incident angle range ±α is 0.6 or less. The meaning of the variation coefficient is the same as in the case of downstream communication (radiated wave), so details will be omitted.
Similar to downstream communication (radiated waves), the reflect array 40 of embodiment 2-1 can be said to have the function of expanding the allowable incident angle range in upstream communication (received waves) to any value of α that satisfies equation (3) (function 3, see Figure 8 (c) etc.).

(実施形態2-2) 
 実施形態2-2のリフレクトアレイ40は、実施形態1-1の機能に加え、上り通信(受信波)において、下り反射角度範囲±αで入射した任意の平面波を、設計中心入射角[θi]uを中心として式(6)を満たす±β度の角度範囲(以下、「上り反射角度範囲±β」という。)に広がりをもって反射させることができる(図9B参照)。ここに「広がりをもって反射」するとは、下り反射角度範囲±α内の任意の入射角[θr]uで入射した電波が反射する際に、上り反射角度範囲±βにおいて、以下の式(8)から導出される反射パターン(バイスタティックRCS)の拡散度d[θr]uが0.6以上になることを意味する。拡散度の意味は下り通信(放射波)の場合と同様であるので詳細は省略する。
 
 このように実施形態2-2のリフレクトアレイ40は、上り通信(受信波)における反射ビームの幅を上り反射角度範囲±βに均一に広げる機能を有する(機能3、図8(c)等参照)。
(Embodiment 2-2)
In addition to the functions of embodiment 1-1, the reflectarray 40 of embodiment 2-2 can reflect, in upstream communication (received waves), any plane wave incident within a downstream reflection angle range ±α with a spread over an angle range of ±β degrees (hereinafter referred to as the "upstream reflection angle range ±β") that satisfies equation ( 6 ) around the design central incident angle [θi 0 ]u (see FIG. 9B ). Here, "reflecting with a spread" means that when a radio wave incident at any incident angle [θr]u within the downstream reflection angle range ±α is reflected, the diffusion degree d[θr]u of the reflection pattern (bistatic RCS) derived from the following equation (8) is 0.6 or greater within the upstream reflection angle range ±β. The meaning of the diffusion degree is the same as in the case of downstream communication (radiated waves), and therefore details will be omitted.

In this way, the reflect array 40 of embodiment 2-2 has the function of uniformly widening the width of the reflected beam in upstream communication (received wave) within the upstream reflection angle range ±β (function 3, see Figure 8 (c) etc.).

<実施例>
 入射角と反射角が異なる非対称反射をさせるリフレクトアレイに関する実施例(実施例1)および比較例(比較例1、比較例2)と、入射方向に電磁波を再帰性反射させるリフレクトアレイに関する実施例(実施例2)および比較例(比較例3)について説明する。実施例、比較例において記載した反射特性の結果は、Ansys製の有限要素法解析ソフトウェア(HFSS)を用いて解析した。
(実施例1)
 図10は、実施例1のリフレクトアレイにおける反射制御領域(群)の並びの模式図である。実施例1におけるリフレクトアレイ40は3種類の反射制御領域群4-0、4-1、4-2を、反射制御領域群4-0の両側に反射制御領域群4-1、4-2が配置するようにx軸方向に並行に配列したものであり、各反射制御領域群は複数の反射制御領域(6-0、6-1、6-2)をx軸方向とy軸方向に並行に配列してある。ここで、反射制御領域6-0、6-1、6-2は、設計入反射角がそれぞれ(θi、θr)、R(θi―α、θr―α)、(θi+α、θr+α)と異なるため、反射制御領域の長辺の長さSxも異なる。一方で、素子パターンのy軸方向のずれを防ぐために、反射制御領域6-0、6-1、6-2の短辺の長さ(=単位セルの一辺の長さ)は最長のUyで統一する。これにより、リフレクトアレイの加工を容易にすることができる。
<Example>
An example (Example 1) and comparative examples (Comparative Example 1 and Comparative Example 2) relating to a reflectarray that causes asymmetric reflection in which the angle of incidence and the angle of reflection are different, and an example (Example 2) and comparative example (Comparative Example 3) relating to a reflectarray that retroreflects electromagnetic waves in the incident direction will be described. The results of the reflection characteristics described in the examples and comparative examples were analyzed using finite element analysis software (HFSS) made by Ansys.
Example 1
10 is a schematic diagram of the arrangement of reflection control region(s) in the reflectarray of Example 1. Reflectarray 40 in Example 1 has three types of reflection control region groups 4-0, 4-1, and 4-2 arranged parallel to the x-axis direction such that reflection control region groups 4-1 and 4-2 are arranged on both sides of reflection control region group 4-0, and each reflection control region group has a plurality of reflection control regions (6-0, 6-1, 6-2) arranged parallel to the x-axis and y-axis directions. Here, reflection control regions 6-0, 6-1, and 6-2 have different designed incident reflection angles, ( θi0 , θr0 ), R( θi0 -α, θr0 -α), and ( θi0 +α, θr0 +α), respectively, and therefore also have different long side lengths Sx of the reflection control regions. On the other hand, in order to prevent deviation of the element pattern in the y-axis direction, the lengths of the short sides of the reflection control regions 6-0, 6-1, and 6-2 (= the length of one side of the unit cell) are unified to the longest length Uy, which makes it easier to process the reflect array.

 素子パターンおよびグランド層に厚み0.018mm(18μm)の銅を、誘電体に厚み0.764mmのガラス/フッ素樹脂の複合材料を用いてリフレクトアレイを構成した。ただし、銅の導電率は5.8×10^7siemens/mとし、誘電体の比誘電率の実部は2.6、tanδは0.0025とした。
 動作周波数を28GHzとし、設計入反射角を各反射制御領域群にて設定し、式(11)を使用して反射制御領域のx軸方向のサイズSxを決定した。反射制御領域の分割数を3とし、反射制御領域群4-0、4-1、4-2内の反射制御領域のy軸方向のサイズUy(=Sx/3)を最も大きい値に統一した。
 素子の形状は、xy平面において、2つの方形パッチが直交したクロスパッチとした。ここで、反射制御領域内の各素子パターンの素子長は同じであり素子幅のみが異なる。
 各反射制御領域群4-0、4-1、4-2は、反射制御領域6-0、6-1、6-2をx軸方向に4個配置し、y軸方向には適宜最適な数を配置した。具体的な仕様に関しては表1に示した。
The reflect array was constructed using 0.018 mm (18 μm) thick copper for the element pattern and ground layer, and a 0.764 mm thick glass/fluororesin composite for the dielectric. The conductivity of the copper was 5.8 × 10 siemens/m, the real part of the dielectric constant of the dielectric was 2.6, and tan δ was 0.0025.
The operating frequency was set to 28 GHz, the design incident reflection angle was set for each reflection control area group, and the size Sx of the reflection control area in the x-axis direction was determined using equation (11). The number of divisions of the reflection control area was set to 3, and the size Uy (= Sx/3) of the reflection control area in the y-axis direction within the reflection control area groups 4-0, 4-1, and 4-2 was unified to the largest value.
The shape of the element was a cross patch in which two square patches intersected at right angles in the xy plane. Here, the element lengths of the element patterns in the reflection control region were the same and only the element widths were different.
Each of reflection control region groups 4-0, 4-1, 4-2 has four reflection control regions 6-0, 6-1, 6-2 arranged in the x-axis direction, and an optimum number arranged in the y-axis direction. Specific specifications are shown in Table 1.

 実施例1の下り通信(放射波)および上り通信(受信波)における変動係数を表2に示す。下り通信(放射波)において、設計中心入射角[θi]dである0度を中心として、-5~+5度の入射角度範囲(α=5)を1度で分割したときの各解析角度(解析角度数11)で入射する全ての平面波に関し、設計中心反射角[θr]dである45度を中心として-5~+5度の角度範囲に強く反射した。さらに表2に示すように、当該角度範囲を1度で分割したときの各反射角における式(4)から導出される反射強度(バイスタティックRCS)の変動係数Cθは全ての解析角度において0.6以下となった。
 上り通信(受信波)においても同様に、設計中心反射角[θr]uである45度を中心として、-5~+5度の入射角度範囲(α=5)を1度で分割したときの各解析角度(解析角度数11)で入射する全ての平面波に関し、設計中心入射角[θi]uである0度を中心として-5~+5度の角度範囲に強く反射した。さらに表2に示すように、当該角度範囲を1度で分割したときの各反射角における式(5)から導出される反射強度(バイスタティックRCS)の変動係数Cθは全ての解析角度において0.6以下となった。
The coefficients of variation for downstream communication (radiated wave) and upstream communication (received wave) in Example 1 are shown in Table 2. In downstream communication (radiated wave), for all plane waves incident at each analysis angle ( 11 analysis angles) when the incident angle range (α = 5) of -5 to +5 degrees, centered on 0 degrees which is the design central incident angle [θi 0 ]d, is divided in 1 degree increments, were strongly reflected in the angle range of -5 to +5 degrees centered on 45 degrees which is the design central reflection angle [θr 0 ]d. Furthermore, as shown in Table 2, the coefficient of variation Cθ of the reflection intensity (bistatic RCS) derived from equation (4) at each reflection angle when this angle range is divided in 1 degree increments was 0.6 or less at all analysis angles.
Similarly, for uplink communications (received waves), all plane waves incident at each analysis angle (11 analysis angles) when the incident angle range (α = 5) of -5 to +5 degrees, centered on the design central reflection angle [θr 0 ]u of 45 degrees, is divided in 1-degree increments, were strongly reflected in the angle range of -5 to +5 degrees centered on 0 degrees, the design central incident angle [θi 0 ]u. Furthermore, as shown in Table 2, the coefficient of variation Cθ of the reflection intensity (bistatic RCS) derived from equation (5) at each reflection angle when the angle range is divided in 1-degree increments was 0.6 or less at all analysis angles.

 実施例1の下り通信(放射波)および上り通信(受信波)における拡散度を表3に示す。表3に示すように、下り通信(放射波)において、設計中心入射角[θi]dである0度を中心として、-5~+5度の許容角度範囲を1度で分割した各入射角で入射する平面波に関し、設計中心反射角[θr]dである45度を中心として-10~+10度の反射角度範囲(β=10)を1度で分割したときの解析角度(解析角度数21)により式(7)から導出される反射パターン(バイスタティックRCS)の拡散度dθは全ての入射角において0.6以上となった。
 表3に示すように、上り通信(受信波)においても同様に、設計中心反射角[θr]uである45度を中心として、-5~+5度の許容角度範囲を1度で分割した各入射角で入射する平面波に関し、設計中心入射角[θi]uである0度を中心として-10~+10度の反射角度範囲(β=10)を1度で分割したときの解析角度(解析角度数21)により式(8)から導出される反射パターン(バイスタティックRCS)の拡散度dθは全ての入射角において0.6以上となった。
The diffusivity in downstream communication (radiated wave) and upstream communication (received wave) in Example 1 is shown in Table 3. As shown in Table 3, in downstream communication (radiated wave), for plane waves incident at each incident angle obtained by dividing the allowable angle range of -5 to +5 degrees in increments of 1 degree, with 0 degrees being the design central incident angle [θi 0 ]d as the center, the diffusivity dθ of the reflection pattern (bistatic RCS) derived from equation (7) using the analysis angle (analysis angle number 21) obtained by dividing the reflection angle range of -10 to +10 degrees (β = 10) in increments of 1 degree, with 45 degrees being the design central reflection angle [θr 0 ]d as the center, was 0.6 or more at all incident angles.
As shown in Table 3, for uplink communication (received wave), similarly, for plane waves incident at each incident angle obtained by dividing the allowable angle range of -5 to +5 degrees in increments of 1 degree, with the design central reflection angle [ θr 0 ]u being 45 degrees as the center, the divergence dθ of the reflection pattern (bistatic RCS) derived from equation (8) using the analysis angle (analysis angle number 21) when the reflection angle range of -10 to +10 degrees (β = 10) is divided in increments of 1 degree, with the design central incidence angle [θi 0 ]u being 0 degrees as the center, was 0.6 or more at all incident angles.

(比較例1)
 比較例1のリフレクトアレイは単一反射制御領域群からなり、実施例1と同様に反射制御領域の分割数を3として反射制御領域のy軸方向のサイズUy(=Sx/3)を決定した。また比較例1では、リフレクトアレイは反射制御領域をx軸方向およびy軸方向に12個×36個で計432個配置した。具体的な仕様に関しては表1に示した。
 実施例1と同様の手法で上下通信における反射強度(バイスタティックRCS)の変動係数Cθを導出したところ、表2に示すように上下通信とも全ての解析角度において0.6より大きかった。
 また実施例1と同様の手法で上下通信における反射パターン(バイスタティックRCS)の拡散度dθを導出したところ、表3に示すように上下通信とも全ての入射角において0.6より小さかった。
(Comparative Example 1)
The reflectarray of Comparative Example 1 consists of a single reflection control region group, and as in Example 1, the number of divisions of the reflection control region was set to 3, and the size of the reflection control region in the y-axis direction, Uy (= Sx/3), was determined. Furthermore, in Comparative Example 1, the reflectarray had 12 x 36 reflection control regions arranged in the x-axis and y-axis directions, for a total of 432 regions. Specific specifications are shown in Table 1.
The coefficient of variation Cθ of the reflection intensity (bistatic RCS) in uplink and downlink communication was derived using the same method as in Example 1, and as shown in Table 2, it was greater than 0.6 at all analysis angles for both uplink and downlink communication.
Furthermore, when the diffusivity dθ of the reflection pattern (bistatic RCS) in uplink and downlink communication was derived using the same method as in Example 1, it was found to be smaller than 0.6 at all incident angles for both uplink and downlink communication, as shown in Table 3.

(比較例2)
 比較例2のリフレクトアレイは複合反射制御領域群からなるが各反射制御領域群4-0、4-1、4-2の設計入反射角度が実施例1と異なる。ただし実施例1と同様に反射制御領域の分割数を3とし、反射制御領域群4-0、4-1、4-2内の反射制御領域のy軸方向のサイズUy(=Sx/3)を最も大きい値に統一した。具体的な仕様に関しては表1に示した。
 実施例1と同様の手法で上下通信における反射強度(バイスタティックRCS)の変動係数Cθを導出したところ、表2に示すように上下通信とも一部の解析角度において0.6より大きかった。
 また実施例1と同様の手法で上下通信における反射パターン(バイスタティックRCS)の拡散度dθを導出したところ、表3に示すように上り通信(受信波)では一部、下り通信(放射波)では全ての入射角において0.6より小さかった。
(Comparative Example 2)
The reflectarray of Comparative Example 2 is made up of composite reflection control region groups, but the designed incident and reflection angles of each of the reflection control region groups 4-0, 4-1, and 4-2 are different from those of Example 1. However, as in Example 1, the number of divisions of the reflection control region is set to 3, and the size Uy (= Sx/3) of the reflection control region in the y-axis direction within the reflection control region groups 4-0, 4-1, and 4-2 is unified to the largest value. Specific specifications are shown in Table 1.
The coefficient of variation Cθ of the reflection intensity (bistatic RCS) in uplink and downlink communication was derived using the same method as in Example 1. As shown in Table 2, the coefficient of variation Cθ was greater than 0.6 at some analysis angles for both uplink and downlink communication.
Furthermore, when the diffusion degree dθ of the reflection pattern (bistatic RCS) in uplink and downlink communication was derived using the same method as in Example 1, it was found to be smaller than 0.6 at some incident angles in uplink communication (received waves) and at all incident angles in downlink communication (emitted waves), as shown in Table 3.

 表1は、実施例1および比較例1、比較例2におけるリフレクトアレイの仕様を示す表である。
Table 1 shows the specifications of the reflect arrays in Example 1, Comparative Example 1, and Comparative Example 2.

 表2は、実施例1および比較例1、比較例2におけるリフレクトアレイの変動係数Cθを示す表である。
Table 2 shows the coefficient of variation Cθ of the reflect arrays in Example 1, Comparative Example 1, and Comparative Example 2.

 表3は、実施例1および比較例1、比較例2におけるリフレクトアレイの拡散度dθを示す表である。
Table 3 shows the diffusivity dθ of the reflect arrays in Example 1, Comparative Example 1, and Comparative Example 2.

 図11は、実施例1および比較例1、比較例2のリフレクトアレイにおける反射パターン(バイスタティックRCS)を示すグラフである。下り通信(放射波)の右側のグラフは設計中心反射角[θr]d(45度)を中心とする±β(β=10)の角度範囲の反射パターンの拡大図であり、上り通信(受信波)の右側のグラフは設計中心入射角[θi]u(0度)を中心とする±β(β=10)の角度範囲の反射パターンの拡大図である。
 図11に示すように、実施例1と比較例1と比較例2は、下り通信(放射波)において45度方向に指向性をもって電波を非対称反射しており、その±5度の範囲における反射強度は他の反射方向の反射強度と比較して5dB以上高いことが解析結果からわかる。上り通信(受信波)においても同様に0度方向に指向性をもって電波を非対称反射しており、その±5度の範囲における反射強度は他の反射方向の反射強度と比較して5dB以上高いことが解析結果からわかる。
 また、比較例1の非対称反射ビームの幅は狭く、入射角によって反射強度が明確にばらついていることがわかる。比較例2の非対称反射ビームの幅は比較的広いが比較例1と同様に入射角によって反射強度が明確にばらついていることがわかる。さらに、比較例1、2ともに下り通信(放射波)と比較して上り通信(受信波)では反射ビームの広がり幅が小さくなっていることがわかる。これに対し、実施例1においては上下通信とも非対称反射ビームの幅は広く、入射角による反射強度のばらつき度合いも少ないことがわかる。
11 is a graph showing reflection patterns (bistatic RCS) in the reflectarrays of Example 1 and Comparative Examples 1 and 2. The graph on the right for downstream communication (radiated wave) is an enlarged view of the reflection pattern in the angular range of ±β (β=10) centered on the design central reflection angle [θr 0 ]d (45 degrees), and the graph on the right for upstream communication (received wave) is an enlarged view of the reflection pattern in the angular range of ±β (β=10) centered on the design central incident angle [θi 0 ]u (0 degrees).
11, in Example 1 and Comparative Examples 1 and 2, radio waves are asymmetrically reflected with directivity in the 45-degree direction in downstream communications (radiated waves), and the analysis results show that the reflection intensity in the ±5-degree range is 5 dB or more higher than the reflection intensity in other reflection directions. Similarly, in upstream communications (received waves), radio waves are asymmetrically reflected with directivity in the 0-degree direction, and the analysis results show that the reflection intensity in the ±5-degree range is 5 dB or more higher than the reflection intensity in other reflection directions.
It can also be seen that the width of the asymmetric reflected beam in Comparative Example 1 is narrow, and the reflection intensity clearly varies depending on the incident angle. It can also be seen that the width of the asymmetric reflected beam in Comparative Example 2 is relatively wide, but the reflection intensity clearly varies depending on the incident angle, as in Comparative Example 1. Furthermore, it can be seen that the spread width of the reflected beam is smaller in upstream communication (received wave) compared to downstream communication (emitted wave) in both Comparative Examples 1 and 2. In contrast, it can be seen that the width of the asymmetric reflected beam is wide in both uplink and downlink communication in Example 1, and the degree of variation in reflection intensity depending on the incident angle is also small.

(実施例2)
 実施例2のリフレクトアレイ40は実施例1と同様、図10の反射制御領域(群)の並びの模式図のように3種類の反射制御領域群4-0、4-1、4-2を、反射制御領域群4-0の両側に反射制御領域群4-1、4-2が配置するようにx軸方向に並行に配列したものであり、各反射制御領域群は複数の反射制御領域(6-0、6-1、6-2)をx軸方向とy軸方向に並行に配列してある。ここで、反射制御領域6-0、6-1、6-2は、設計入反射角がそれぞれ(θi、θr)、R(θi―α、θr―α)、(θi+α、θr+α)と異なるため、反射制御領域の長辺の長さSxも異なる。一方で、素子パターンのy軸方向のずれを防ぐために、反射制御領域6-0、6-1、6-2の短辺の長さ(=単位セルの一辺の長さ)は最長のUyで統一する。これにより、リフレクトアレイの加工を容易にすることができる。
Example 2
Similar to Example 1, reflectarray 40 of Example 2 has three types of reflection control region groups 4-0, 4-1, 4-2 arranged parallel to the x-axis direction with reflection control region groups 4-1, 4-2 arranged on either side of reflection control region group 4-0, as shown in the schematic diagram of the arrangement of reflection control region(s) in Figure 10, and each reflection control region group has a plurality of reflection control regions (6-0, 6-1, 6-2) arranged parallel to the x-axis direction and y-axis direction. Here, reflection control regions 6-0, 6-1, 6-2 have different designed incident reflection angles, ( θi0 , θr0 ), R( θi0 -α, θr0 -α), and ( θi0 +α, θr0 +α), respectively, and therefore also have different long side lengths Sx of the reflection control regions. On the other hand, in order to prevent deviation of the element pattern in the y-axis direction, the lengths of the short sides of the reflection control regions 6-0, 6-1, and 6-2 (= the length of one side of the unit cell) are unified to the longest length Uy, which makes it easier to process the reflect array.

 素子パターンおよびグランド層に厚み0.035mm(35μm)の銅を、誘電体に厚み0.600mmのエポキシ樹脂を用いてリフレクトアレイを構成した。ただし、銅の導電率は5.8×10^7siemens/mとし、誘電体の比誘電率の実部は4.175、tanδは0.014とした。
 動作周波数を24.15GHzとし、設計入反射角を各反射制御領域群にて設定し、式(11)を使用して反射制御領域のx軸方向のサイズSxを決定した。反射制御領域の分割数を3とし、反射制御領域群4-0、4-1、4-2内の反射制御領域のy軸方向のサイズUy(=Sx/3)を最も大きい値に統一した。
 素子の形状は、xy平面において、2つの方形パッチが直交したクロスパッチとした。ここで、反射制御領域内の各素子パターンの素子長は同じであり素子幅のみが異なる。
 各反射制御領域群4-0、4-1、4-2は、反射制御領域6-0、6-1、6-2をx軸方向に4個配置し、y軸方向には適宜最適な数を配置した。具体的な仕様に関しては表4に示した。
The reflect array was constructed using 0.035 mm (35 μm) thick copper for the element pattern and ground layer, and 0.600 mm thick epoxy resin for the dielectric. The conductivity of the copper was 5.8 × 10 siemens/m, the real part of the dielectric constant of the dielectric was 4.175, and tan δ was 0.014.
The operating frequency was set to 24.15 GHz, the design incident reflection angle was set for each reflection control area group, and the size Sx of the reflection control area in the x-axis direction was determined using equation (11). The number of divisions of the reflection control area was set to 3, and the size Uy (= Sx/3) of the reflection control area in the y-axis direction within the reflection control area groups 4-0, 4-1, and 4-2 was unified to the largest value.
The shape of the element was a cross patch in which two square patches intersected at right angles in the xy plane. Here, the element lengths of the element patterns in the reflection control region were the same and only the element widths were different.
Each of reflection control region groups 4-0, 4-1, 4-2 has four reflection control regions 6-0, 6-1, 6-2 arranged in the x-axis direction, and an optimum number arranged in the y-axis direction. Specific specifications are shown in Table 4.

 実施例2の変動係数を表5に示す。実施例2において、設計中心入射角[θi]dと設計中心反射角[θr]uは等しく、電波は再帰性反射する。設計中心入射角[θi]dである-45度を中心として、-5~+5度の入射角度範囲(α=5)を1度で分割したときの各解析角度(解析角度数11)で入射する全ての平面波に関し、設計中心反射角[θr]dである-45度を中心として-5~+5度の角度範囲に強く反射した。さらに表5に示すように、当該角度範囲を1度で分割したときの各反射角における式(4)から導出される反射強度(バイスタティックRCS)の変動係数Cθは全ての解析角度において0.6以下となった。 The coefficient of variation for Example 2 is shown in Table 5. In Example 2, the design central incident angle [θi 0 ]d and the design central reflection angle [θr 0 ]u are equal, and radio waves are retroreflected. For all plane waves incident at each analysis angle (analysis angle number 11) when the incident angle range (α = 5) of -5 to +5 degrees, centered on the design central incident angle [θi 0 ]d of -45 degrees, is divided by 1 degree, the plane waves are strongly reflected in the angle range of -5 to +5 degrees centered on the design central reflection angle [θr 0 ]d of -45 degrees. Furthermore, as shown in Table 5, the coefficient of variation Cθ of the reflection intensity (bistatic RCS) derived from Equation (4) at each reflection angle when the angle range is divided by 1 degree was 0.6 or less at all analysis angles.

 実施例2の拡散度を表6に示す。表6に示すように、設計中心入射角[θi]dである-45度を中心として、-5~+5度の許容角度範囲を1度で分割した各入射角で入射する平面波に関し、設計中心反射角[θr0]dである-45度を中心として-10~+10度の反射角度範囲(β=10)を1度で分割したときの解析角度(解析角度数21)により式(7)から導出される反射パターン(バイスタティックRCS)の拡散度dθは全ての入射角において0.6以上となった。 The diffusivity of Example 2 is shown in Table 6. As shown in Table 6, for plane waves incident at each incident angle obtained by dividing the allowable angle range of -5 to +5 degrees in increments of 1 degree, with -45 degrees being the design central incident angle [θi 0 ]d as the center, the diffusivity dθ of the reflection pattern (bistatic RCS) derived from equation (7) using the analysis angle (number of analysis angles: 21) when the reflection angle range of -10 to +10 degrees (β=10) is divided in increments of 1 degree, with -45 degrees being the design central reflection angle [θr0]d as the center. was 0.6 or more at all incident angles.

(比較例3)
 比較例3のリフレクトアレイは単一反射制御領域群からなり、実施例2と同様に反射制御領域の分割数を3として反射制御領域のy軸方向のサイズUy(=Sx/3)を決定した。また比較例3では、リフレクトアレイは反射制御領域をx軸方向およびy軸方向に12個×36個で計432個配置した。具体的な仕様に関しては表4に示した。
 実施例2と同様の手法で反射強度(バイスタティックRCS)の変動係数Cθを導出したところ、表5に示すように一部の解析角度において0.6より大きかった。
 また実施例2と同様の手法で反射パターン(バイスタティックRCS)の拡散度dθを導出したところ、表6に示すように全ての入射角において0.6より小さかった。
(Comparative Example 3)
The reflectarray of Comparative Example 3 consists of a single reflection control region group, and the size of the reflection control region in the y-axis direction, Uy (= Sx/3), was determined by dividing the reflection control region into three, as in Example 2. In Comparative Example 3, the reflectarray had 12 x 36 reflection control regions arranged in the x-axis and y-axis directions, for a total of 432 regions. Specific specifications are shown in Table 4.
The coefficient of variation Cθ of the reflection intensity (bistatic RCS) was calculated using the same method as in Example 2, and as shown in Table 5, it was greater than 0.6 at some analysis angles.
Furthermore, when the diffusivity dθ of the reflection pattern (bistatic RCS) was calculated using the same method as in Example 2, it was found to be smaller than 0.6 at all angles of incidence, as shown in Table 6.

 表4は、実施例2および比較例3におけるリフレクトアレイの仕様を示す表である。
Table 4 shows the specifications of the reflect arrays in Example 2 and Comparative Example 3.

 表5は、実施例2および比較例3におけるリフレクトアレイの変動係数Cθを示す表である。
Table 5 shows the coefficient of variation Cθ of the reflectarrays in Example 2 and Comparative Example 3.

 表6は、実施例2および比較例3におけるリフレクトアレイの拡散度dθを示す表である。
Table 6 shows the diffusion degree dθ of the reflect arrays in Example 2 and Comparative Example 3.

 図12は、実施例2および比較例3のリフレクトアレイにおける反射パターン(バイスタティックRCS)を示すグラフである。グラフは設計中心反射角[θr]d(-45度)を中心とする±β(β=10)の角度範囲の反射パターンの拡大図である。
 図12に示すように、実施例2と比較例3は、-45度方向に指向性をもって電波を再帰性反射しており、その±5度の範囲における反射強度は他の反射方向の反射強度と比較して5dB以上高いことが解析結果からわかる。
 また、比較例3の非対称反射ビームの幅は狭く、入射角によって反射強度が明確にばらついていることがわかる。これに対し、実施例2においては再帰性反射ビームの幅は広く、入射角による反射強度のばらつき度合いも少ないことがわかる。
12 is a graph showing the reflection patterns (bistatic RCS) of the reflectarrays of Example 2 and Comparative Example 3. The graph is an enlarged view of the reflection patterns in the angle range of ±β (β=10) centered on the design central reflection angle [θr 0 ]d (−45 degrees).
As shown in Figure 12, Example 2 and Comparative Example 3 retroreflect radio waves with directionality in the -45 degree direction, and the analysis results show that the reflection intensity in the ±5 degree range is 5 dB or more higher than the reflection intensity in other reflection directions.
It can also be seen that the width of the asymmetric reflected beam in Comparative Example 3 is narrow, and the reflection intensity varies clearly depending on the angle of incidence. In contrast, it can be seen that the width of the retroreflected beam in Example 2 is wide, and the degree of variation in reflection intensity depending on the angle of incidence is also small.

 以上、本発明の実施の形態について説明したが、本発明は、上述した実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更が可能である。例えば実施態様1-1~2-2の組み合わせが可能であることは言うまでもない。 Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention. It goes without saying that, for example, combinations of embodiments 1-1 to 2-2 are possible.

 本発明の内容となり得る態様を以下に述べる、ただしこれに限られるものではない。
(態様1)
 特定の周波数帯の電磁波に対して、式(1)を満たす任意の設計入射角θiからの平面波を式(2)を満たす任意の設計反射角θrに最も強く反射する複数種類の反射制御領域を有し、
 下り通信(放射波)において、
 設計中心入射角[θi]dを中心として式(3)を満たす±α度の角度範囲(以下、「下り入射角度範囲±α」という)で入射した平面波が、
 設計中心反射角[θr]dを中心として前記±α度の角度範囲(以下、「下り反射角度範囲±α」という。)における反射強度(バイスタティックRCS)の平均値が、前記下り反射角度範囲±αを除く-90度から90度の角度範囲における反射強度の平均値よりも5dB以上高くなるように、前記下り反射角度範囲±αに強く反射し、かつ、
 入射角[θi]dからの平面波の反射角[θr]dへの反射強度をσ[θi]d[θr]dとするとき、前記下り反射角度範囲±α内の任意の反射角[θr]dについて式(4)から導出される反射強度の変動係数C[θr]dが0.6以下になることを特徴とする、リフレクトアレイ。
(態様2)
 上り通信(受信波)において、
 前記下り反射角度範囲±αで入射した平面波が、
 前記下り入射角度範囲±αにおける反射強度(バイスタティックRCS)の平均値が、前記下り入射角度範囲±αを除く-90度から90度の角度範囲における反射強度の平均値よりも5dB以上高くなるように、前記下り入射角度範囲±αに強く反射し、かつ、
 入射角[θr]uからの平面波の反射角[θi]uへの反射強度をσ[θr]u[θi]uとするとき、前記下り入射角度範囲±α内の任意の反射角[θi]uについて式(5)から導出される反射強度(バイスタティックRCS)の変動係数C[θi]uが0.6以下になることを特徴とする、態様1に記載のリフレクトアレイ。
(態様3)
 下り通信(放射波)において、
 前記下り入射角度範囲±α内の任意の入射角[θi]dで入射した平面波が、設計中心反射角[θr]dを中心として式(6)を満たす±β度の角度範囲において、式(7)から導出される反射パターン(バイスタティックRCS)の拡散度d[θi]dが0.6以上になる広がりをもって反射することを特徴とする、態様1または2に記載のリフレクトアレイ。
(態様4)
 上り通信(受信波)において、
 前記下り反射角度範囲±α内の任意の入射角[θr]uで入射した平面波が、設計中心入射角[θi]uを中心として式(6)を満たす±β度の角度範囲において、式(8)から導出される反射パターン(バイスタティックRCS)の拡散度d[θr]uが0.6以上になる広がりをもって反射することを特徴とする、態様1~3のいずれか一つに記載のリフレクトアレイ。
(態様5)
 設計入射角θiおよび設計反射角θrが異なる少なくとも3種類の反射制御領域を含む反射制御領域群で構成されることを特徴とする、態様1~4のいずれか一つに記載のリフレクトアレイ。
(態様6)
 設計入射角および設計反射角が、それぞれ前記設計中心入射角θiかつ前記設計中心反射角θr、設計入射角θi-α度かつ設計反射角θr-α、設計入射角θi+α度かつ設計反射角θr+α度、である3種類の反射制御領域を含む前記反射制御領域群で構成されることを特徴とする、態様5に記載のリフレクトアレイ。
(態様7)
 素子パターン、誘電体層、グランド層をこの順に積層した層構成を有し、
 前記反射制御領域は、いずれの反射制御領域群においても短辺Uyの長さが等しく、かつ少なくとも2つの単位セルを有し、
 前記単位セルには前記素子パターンが1つ配置されることを特徴とする、態様5または6に記載のリフレクトアレイ。
(態様8)
 密着向上層をさらに含むことを特徴とする、態様7に記載のリフレクトアレイ。
(態様9)
 機能層をさらに含むことを特徴とする、態様7または8に記載のリフレクトアレイ。
(態様10)
前記素子パターンの形状がクロスパッチであることを特徴とする、態様7~9のいずれか一つに記載のリフレクトアレイ。
(態様11)
 前記素子パターンの形状はクロスパッチを含み、
 前記反射制御領域内において、前記素子パターンのx軸方向の素子幅または/かつy軸方向の素子幅は、少なくとも2つの単位セルそれぞれに配置される素子パターン毎に異なることを特徴とする、態様7~9のいずれか一つに記載のリフレクトアレイ。
(態様12)
前記グランド層の形態が、連続膜、メッシュ状、パンチング形状、または周期性構造のいずれかであることを特徴とする、態様7~11のいずれか一つに記載のリフレクトアレイ。
(態様13)
前記誘電体層の比誘電率が1以上20以下であることを特徴とする、態様7~12のいずれか一つに記載のリフレクトアレイ。
(態様14)
 前記リフレクトアレイが、支持体上に配置されていることを特徴とする、態様1~13のいずれか一つに記載のリフレクトアレイ。
(態様15)
 前記リフレクトアレイが、設置層により人の肌、服または装着具に貼付されていることを特徴とする、態様1~13のいずれか一つに記載のリフレクトアレイ。
The following are examples of possible embodiments of the present invention, but the present invention is not limited to these.
(Aspect 1)
For electromagnetic waves in a specific frequency band, the reflector has a plurality of types of reflection control regions that most strongly reflect a plane wave from an arbitrary design incident angle θi that satisfies Equation (1) to an arbitrary design reflection angle θr that satisfies Equation (2),
In downstream communication (radiated waves),
A plane wave incident within an angle range of ±α degrees (hereinafter referred to as the "downward incident angle range ±α") that satisfies Equation (3) with the design central incident angle [θi 0 ]d as the center is:
The beam is strongly reflected in the downward reflection angle range ± α so that the average value of the reflection intensity (bistatic RCS) in the angle range of ±α degrees (hereinafter referred to as the "downward reflection angle range ±α") centered on the design central reflection angle [θr 0 ]d is 5 dB or more higher than the average value of the reflection intensity in the angle range from -90 degrees to 90 degrees excluding the downward reflection angle range ±α, and
When the reflection intensity of a plane wave from an incident angle [θi]d to a reflection angle [θr]d is σ[θi]d[θr]d, the coefficient of variation C[θr]d of reflection intensity derived from equation (4) for any reflection angle [θr] d within the downward reflection angle range ±α is 0.6 or less. A reflectarray.
(Aspect 2)
In upstream communication (received waves),
The plane wave incident within the downward reflection angle range ±α is
The downlink incident angle range ±α is strongly reflected so that the average value of the reflection intensity (bistatic RCS) in the downlink incident angle range ±α is 5 dB or more higher than the average value of the reflection intensity in the angle range from −90 degrees to 90 degrees excluding the downlink incident angle range ±α, and
The reflectarray according to aspect 1, wherein when the reflection intensity of a plane wave from an incident angle [θr]u to a reflection angle [θi]u is σ[θr]u[θi]u, the coefficient of variation C [θi]u of the reflection intensity (bistatic RCS) derived from Equation (5) for any reflection angle [θi]u within the downward incident angle range ±α is 0.6 or less.
(Aspect 3)
In downstream communication (radiated waves),
The reflectarray according to aspect 1 or 2, characterized in that a plane wave incident at an arbitrary incident angle [ θi ]d within the downward incident angle range ±α is reflected with a spread such that the diffusivity d [θi]d of the reflection pattern (bistatic RCS) derived from equation (7) is 0.6 or more within an angular range of ±β degrees centered on the design central reflection angle [θr 0 ]d that satisfies equation (6).
(Aspect 4)
In upstream communication (received waves),
The reflectarray according to any one of aspects 1 to 3, characterized in that a plane wave incident at an arbitrary incident angle [ θr ]u within the downward reflection angle range ±α is reflected with a spread such that the diffusivity d[θr]u of the reflection pattern (bistatic RCS) derived from equation (8) is 0.6 or more within an angle range of ±β degrees centered on the design central incident angle [θi 0 ]u so as to satisfy equation (6).
(Aspect 5)
The reflect array according to any one of aspects 1 to 4, characterized in that it is constituted by a reflection control region group including at least three types of reflection control regions having different design angles of incidence θi and design reflection angles θr.
(Aspect 6)
Aspect 6. The reflectarray according to aspect 5 , characterized in that it is configured by the reflection control region group including three types of reflection control regions, whose design angles of incidence and design reflection angles are the design central incident angle θi 0 and the design central reflection angle θr 0 , the design incident angle θi 0 -α degrees and the design reflection angle θr 0 -α, and the design incident angle θi 0 +α degrees and the design reflection angle θr 0 +α degrees, respectively.
(Aspect 7)
It has a layer structure in which an element pattern, a dielectric layer, and a ground layer are laminated in this order,
The reflection control region has the same length of a short side Uy in each reflection control region group and has at least two unit cells,
The reflect array according to aspect 5 or 6, wherein one element pattern is arranged in the unit cell.
(Aspect 8)
A reflect array according to aspect 7, further comprising an adhesion improving layer.
(Aspect 9)
The reflect array according to aspect 7 or 8, further comprising a functional layer.
(Aspect 10)
The reflect array according to any one of aspects 7 to 9, wherein the element pattern has a cross patch shape.
(Aspect 11)
the shape of the element pattern includes a cross patch;
The reflectarray according to any one of aspects 7 to 9, wherein, in the reflection control region, the element width in the x-axis direction and/or the element width in the y-axis direction of the element pattern differs for each of the element patterns arranged in at least two unit cells.
(Aspect 12)
The reflect array according to any one of aspects 7 to 11, wherein the ground layer has a form of a continuous film, a mesh, a punching shape, or a periodic structure.
(Aspect 13)
13. The reflect array according to any one of aspects 7 to 12, wherein the dielectric layer has a relative dielectric constant of 1 or more and 20 or less.
(Aspect 14)
The reflectarray according to any one of Aspects 1 to 13, wherein the reflectarray is disposed on a support.
(Aspect 15)
The reflectarray according to any one of aspects 1 to 13, wherein the reflectarray is attached to human skin, clothing, or a wearing tool by an installation layer.

1…素子パターン、2…誘電体層、3…グランド層、4、40…リフレクトアレイ
5…付加機能層、6…反射制御領域
1...element pattern, 2...dielectric layer, 3...ground layer, 4, 40...reflect array, 5...additional function layer, 6...reflection control area

Claims (16)

 特定の周波数帯の電磁波に対して、式(1)を満たす任意の設計入射角θiからの平面波を式(2)を満たす任意の設計反射角θrに最も強く反射する複数種類の反射制御領域を有し、
 下り通信(放射波)において、
 設計中心入射角[θi]dを中心として式(3)を満たす±α度の角度範囲(以下、「下り入射角度範囲±α」という。)で入射した平面波が、
 設計中心反射角[θr]dを中心として前記±α度の角度範囲(以下、「下り反射角度範囲±α」という。)における反射強度(バイスタティックRCS)の平均値が、前記下り反射角度範囲±αを除く-90度から90度の角度範囲における反射強度の平均値よりも5dB以上高くなるように、前記下り反射角度範囲±αに強く反射し、かつ、
 入射角[θi]dからの平面波の反射角[θr]dへの反射強度をσ[θi]d[θr]dとするとき、前記下り反射角度範囲±α内の任意の反射角[θr]dについて式(4)から導出される反射強度の変動係数C[θr]dが0.6以下になることを特徴とする、リフレクトアレイ。
For electromagnetic waves in a specific frequency band, the reflector has a plurality of types of reflection control regions that most strongly reflect a plane wave from an arbitrary design incident angle θi that satisfies Equation (1) to an arbitrary design reflection angle θr that satisfies Equation (2),
In downstream communication (radiated waves),
A plane wave incident within an angle range of ±α degrees (hereinafter referred to as the "downward incident angle range ±α") that satisfies Equation (3) with the design central incident angle [θi 0 ]d as the center is:
The beam is strongly reflected in the downward reflection angle range ± α so that the average value of the reflection intensity (bistatic RCS) in the angle range of ±α degrees (hereinafter referred to as the "downward reflection angle range ±α") centered on the design central reflection angle [θr 0 ]d is 5 dB or more higher than the average value of the reflection intensity in the angle range from -90 degrees to 90 degrees excluding the downward reflection angle range ±α, and
When the reflection intensity of a plane wave from an incident angle [θi]d to a reflection angle [θr]d is σ[θi]d[θr]d, the coefficient of variation C[θr]d of reflection intensity derived from equation (4) for any reflection angle [θr] d within the downward reflection angle range ±α is 0.6 or less. A reflectarray.
 上り通信(受信波)において、
 前記下り反射角度範囲±αで入射した平面波が、
 前記下り入射角度範囲±αにおける反射強度(バイスタティックRCS)の平均値が、前記下り入射角度範囲±αを除く-90度から90度の角度範囲における反射強度の平均値よりも5dB以上高くなるように、前記下り入射角度範囲±αに強く反射し、かつ、
 入射角[θr]uからの平面波の反射角[θi]uへの反射強度をσ[θr]u[θi]uとするとき、前記下り入射角度範囲±α内の任意の反射角[θi]uについて式(5)から導出される反射強度(バイスタティックRCS)の変動係数C[θi]uが0.6以下になることを特徴とする、請求項1に記載のリフレクトアレイ。
In upstream communication (received waves),
The plane wave incident within the downward reflection angle range ±α is
The downlink incident angle range ±α is strongly reflected so that the average value of the reflection intensity (bistatic RCS) in the downlink incident angle range ±α is 5 dB or more higher than the average value of the reflection intensity in the angle range from −90 degrees to 90 degrees excluding the downlink incident angle range ±α, and
2. The reflectarray according to claim 1, wherein, when the reflection intensity of a plane wave from an incident angle [θr]u to a reflection angle [θi]u is σ[θr]u[θi]u, the coefficient of variation C [θi]u of the reflection intensity (bistatic RCS) derived from Equation (5) for any reflection angle [θi]u within the downward incident angle range ±α is 0.6 or less.
 下り通信(放射波)において、
 前記下り入射角度範囲±α内の任意の入射角[θi]dで入射した平面波が、設計中心反射角[θr]dを中心として式(6)を満たす±β度の角度範囲において、式(7)から導出される反射パターン(バイスタティックRCS)の拡散度d[θi]dが0.6以上になる広がりをもって反射することを特徴とする、請求項1に記載のリフレクトアレイ。
In downstream communication (radiated waves),
2. The reflectarray according to claim 1, wherein a plane wave incident at an arbitrary incident angle [θi]d within the downward incident angle range ±α is reflected with a spread such that the diffusivity d[θi]d of the reflection pattern (bistatic RCS) derived from equation (7) is 0.6 or more within an angular range of ±β degrees centered on a design central reflection angle [θr 0 ]d that satisfies equation (6).
 上り通信(受信波)において、
 前記下り反射角度範囲±α内の任意の入射角[θr]uで入射した平面波が、設計中心入射角[θi]uを中心として式(6)を満たす±β度の角度範囲において、式(8)から導出される反射パターン(バイスタティックRCS)の拡散度d[θr]uが0.6以上になる広がりをもって反射することを特徴とする、請求項1に記載のリフレクトアレイ。
In upstream communication (received waves),
2. The reflectarray according to claim 1, wherein a plane wave incident at an arbitrary incident angle [θr]u within the downward reflection angle range ±α is reflected with a spread such that the diffusivity d[θr]u of the reflection pattern (bistatic RCS) derived from equation (8) is 0.6 or more within an angular range of ±β degrees centered on a design central incident angle [θi 0 ]u that satisfies equation (6).
 下り通信(放射波)において、
 前記下り入射角度範囲±α内の任意の入射角[θi]dで入射した平面波が、設計中心反射角[θr]dを中心として式(6)を満たす±β度の角度範囲において、式(7)から導出される反射パターン(バイスタティックRCS)の拡散度d[θi]dが0.6以上になる広がりをもって反射することを特徴とし、かつ、
 上り通信(受信波)において、
 前記下り反射角度範囲±α内の任意の入射角[θr]uで入射した平面波が、設計中心入射角[θi]uを中心として式(6)を満たす±β度の角度範囲において、式(8)から導出される反射パターン(バイスタティックRCS)の拡散度d[θr]uが0.6以上になる広がりをもって反射することを特徴とする、請求項2に記載のリフレクトアレイ。
In downstream communication (radiated waves),
A plane wave incident at an arbitrary incident angle [θi]d within the downward incident angle range ±α is reflected with a spread such that the diffusivity d[θi] d of the reflection pattern (bistatic RCS) derived from equation (7) is 0.6 or more within an angle range of ±β degrees centered on the design central reflection angle [θr 0 ]d, which satisfies equation (6), and
In upstream communication (received waves),
3. The reflectarray according to claim 2, wherein a plane wave incident at an arbitrary incident angle [θr]u within the downward reflection angle range ±α is reflected with a spread such that the diffusivity d[θr]u of the reflection pattern (bistatic RCS) derived from equation (8) is 0.6 or more within an angular range of ±β degrees centered on a design central incident angle [θi 0 ]u that satisfies equation (6).
 設計入射角θiおよび設計反射角θrが異なる少なくとも3種類の反射制御領域を含む反射制御領域群で構成されることを特徴とする、請求項1~5のいずれか一つに記載のリフレクトアレイ。 The reflectarray described in any one of claims 1 to 5, characterized in that it is composed of a reflection control region group including at least three types of reflection control regions with different design angles of incidence θi and design reflection angles θr.  設計入射角および設計反射角が、それぞれ前記設計中心入射角θiかつ前記設計中心反射角θr、設計入射角θi-α度かつ設計反射角θr-α、設計入射角θi+α度かつ設計反射角θr+α度、である3種類の反射制御領域を含む前記反射制御領域群で構成されることを特徴とする、請求項6に記載のリフレクトアレイ。 7. The reflectarray according to claim 6, wherein the reflectarray is configured with the reflection control region group including three types of reflection control regions , whose design angles of incidence and design reflection angles are the design central incident angle θi 0 and the design central reflection angle θr 0 , the design incident angle θi 0 −α degrees and the design reflection angle θr 0 −α, and the design incident angle θi 0 +α degrees and the design reflection angle θr 0 +α degrees, respectively.  素子パターン、誘電体層、グランド層をこの順に積層した層構成を有し、
 前記反射制御領域は、いずれの反射制御領域群においても短辺Uyの長さが等しく、かつ少なくとも2つの単位セルを有し、
 前記単位セルには前記素子パターンが1つ配置されることを特徴とする、請求項6に記載のリフレクトアレイ。
It has a layer structure in which an element pattern, a dielectric layer, and a ground layer are laminated in this order,
The reflection control region has the same length of a short side Uy in each reflection control region group and has at least two unit cells,
The reflect array according to claim 6 , wherein one element pattern is arranged in the unit cell.
 密着向上層をさらに含むことを特徴とする、請求項8に記載のリフレクトアレイ。 The reflectarray according to claim 8, further comprising an adhesion improving layer.  機能層をさらに含むことを特徴とする、請求項8に記載のリフレクトアレイ。 The reflectarray according to claim 8, further comprising a functional layer. 前記素子パターンの形状がクロスパッチであることを特徴とする、請求項8に記載のリフレクトアレイ。 The reflect array according to claim 8, characterized in that the shape of the element pattern is a cross patch.  前記素子パターンの形状はクロスパッチを含み、
 前記反射制御領域内において、前記素子パターンのx軸方向の素子幅または/かつy軸方向の素子幅は、少なくとも2つの単位セルそれぞれに配置される素子パターン毎に異なることを特徴とする、請求項8に記載のリフレクトアレイ。
the shape of the element pattern includes a cross patch;
9. The reflectarray according to claim 8, wherein, in the reflection control region, an element width in the x-axis direction and/or an element width in the y-axis direction of the element pattern differs for each of the element patterns arranged in at least two unit cells.
前記グランド層の形態が、連続膜、メッシュ状、パンチング形状、または周期性構造のいずれかであることを特徴とする、請求項8に記載のリフレクトアレイ。 The reflect array of claim 8, wherein the ground layer is in the form of a continuous film, a mesh, a punched shape, or a periodic structure. 前記誘電体層の比誘電率が1以上20以下であることを特徴とする、請求項8に記載のリフレクトアレイ。 The reflect array described in claim 8, characterized in that the dielectric layer has a relative dielectric constant of 1 or more and 20 or less.  前記リフレクトアレイが、支持体上に配置されていることを特徴とする、請求項1~5のいずれか一つに記載のリフレクトアレイ。 The reflectarray described in any one of claims 1 to 5, characterized in that the reflectarray is disposed on a support.  前記リフレクトアレイが、設置層により人の肌、服または装着具に貼付されていることを特徴とする、請求項1~5のいずれか一つに記載のリフレクトアレイ。 The reflectarray described in any one of claims 1 to 5, characterized in that the reflectarray is attached to human skin, clothing, or a wearing device by an installation layer.
PCT/JP2025/019253 2024-05-30 2025-05-28 Reflectarray Pending WO2025249467A1 (en)

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JP2021048465A (en) * 2019-09-18 2021-03-25 電気興業株式会社 Metasurface reflector and traffic light with the metasurface
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020509687A (en) * 2017-02-21 2020-03-26 スリーエム イノベイティブ プロパティズ カンパニー Passive repeater, microwave network, and method for designing repeater
JP2021048465A (en) * 2019-09-18 2021-03-25 電気興業株式会社 Metasurface reflector and traffic light with the metasurface
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