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WO2025135119A1 - Light radiation device - Google Patents

Light radiation device Download PDF

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Publication number
WO2025135119A1
WO2025135119A1 PCT/JP2024/044980 JP2024044980W WO2025135119A1 WO 2025135119 A1 WO2025135119 A1 WO 2025135119A1 JP 2024044980 W JP2024044980 W JP 2024044980W WO 2025135119 A1 WO2025135119 A1 WO 2025135119A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
irradiation device
light emitting
support
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2024/044980
Other languages
French (fr)
Japanese (ja)
Inventor
忠明 宮田
俊彦 塚本
聖史 榎本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illumi Medical Inc
Nichia Corp
Original Assignee
Illumi Medical Inc
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illumi Medical Inc, Nichia Corp filed Critical Illumi Medical Inc
Publication of WO2025135119A1 publication Critical patent/WO2025135119A1/en
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N5/00Radiation therapy
    • A61N5/06Radiation therapy using light
    • A61N5/067Radiation therapy using light using laser light

Definitions

  • This disclosure relates to a light irradiation device.
  • Patent Document 1 discloses a light irradiation device that has a radiopaque marker portion and can selectively irradiate light to a specific position within a biological lumen.
  • One aspect of the present disclosure aims to provide a light irradiation device that can indicate the direction of light irradiation.
  • the light irradiation device is an elongated light irradiation device having a longitudinal direction, and includes a light emitting section and a radiopaque marker member that is directly or indirectly connected to the light emitting section, and the marker member viewed from a first direction perpendicular to the longitudinal direction has at least one of a shape and a position different from that of the marker member viewed from a second direction perpendicular to the longitudinal direction, the second direction being different from the first direction, and the light emitted from the light emitting section can be irradiated in a predetermined direction intersecting the longitudinal direction.
  • the light irradiation device is an elongated light irradiation device having a longitudinal direction, and includes a light emitting section, a support to which the light emitting section is fixed, and a radiopaque marker section, in which the marker section viewed from a first direction perpendicular to the longitudinal direction differs in at least one of shape and position from the marker section viewed from a second direction perpendicular to the longitudinal direction that is different from the first direction, and the marker section is provided on the support, and is capable of irradiating light emitted from the light emitting section in a predetermined direction intersecting the longitudinal direction.
  • FIG. 2 is a schematic perspective view showing a configuration example of the light irradiation device according to the first embodiment.
  • FIG. 2 is a schematic cross-sectional view showing a first example of the configuration of the light irradiation device according to the first embodiment.
  • FIG. 4 is a schematic cross-sectional view showing a second example of the configuration of the light irradiation device according to the first embodiment.
  • 3 is a diagram showing a marker member included in the light irradiation device of the first embodiment, viewed from a first direction.
  • FIG. 13 is a diagram showing the marker member included in the light irradiation device of the first embodiment as viewed from a second direction.
  • FIG. 11 is a schematic cross-sectional view showing a configuration example of a light irradiation device according to a second embodiment.
  • FIG. 13 is a schematic bottom view showing a configuration example of a light irradiation device according to a second embodiment.
  • 4B is a schematic cross-sectional view showing a state in which the light irradiation device is rotated 180 degrees from the state shown in FIG. 4A around a central axis of the light irradiation device parallel to the longitudinal direction as a rotation axis.
  • FIG. FIG. 13 is a schematic cross-sectional view showing a configuration example of a light irradiation device according to a third embodiment.
  • FIG. 13 is a schematic cross-sectional view showing a configuration example of a light irradiation device according to a fourth embodiment.
  • FIG. 13 is a schematic cross-sectional view showing a configuration example of a light irradiation device according to a fifth embodiment.
  • FIG. 13 is a schematic bottom view showing a configuration example of a light irradiation device according to a fifth embodiment.
  • FIG. 13 is a schematic cross-sectional view showing a configuration example of a light irradiation device according to a sixth embodiment.
  • FIG. 13 is a schematic perspective view showing a configuration example of a light irradiation device according to a seventh embodiment.
  • FIG. 13 is a schematic cross-sectional view showing a configuration example of a light irradiation device according to a fourth embodiment.
  • FIG. 13 is a schematic cross-sectional view showing a configuration example of a light irradiation device according to a fifth embodiment.
  • FIG. 13 is a schematic bottom
  • FIG. 23 is a diagram showing an example of an in vivo light irradiation assembly using the light irradiation device of the eighth embodiment.
  • FIG. 13 is a schematic diagram showing a configuration example of a light irradiation device according to an eighth embodiment. 13 is a schematic diagram showing another configuration example of the light irradiation device according to the eighth embodiment.
  • FIG. FIG. 2 is a perspective view of the light irradiation device body before being sealed with an insulating layer.
  • FIG. 13 is a diagram showing an example of an in vivo light irradiation assembly using the light irradiation device of the ninth embodiment.
  • 13A to 13C are diagrams illustrating an example of the arrangement of optical elements in a light irradiation device according to a ninth embodiment.
  • FIG. 23 is a schematic diagram of a light irradiation device according to a tenth embodiment.
  • FIG. 23 is a schematic diagram showing an example of a light-emitting element used in the tenth embodiment.
  • FIG. 23 is a perspective view of a light-emitting element mounting surface side of a support body used in a tenth embodiment.
  • FIG. 23 is a perspective view of the rear surface side of a support body used in the tenth embodiment.
  • FIG. 5A and 5B are diagrams illustrating electrical characteristics and optical output characteristics of the light irradiation device according to the embodiment.
  • FIG. 4 is a diagram showing thermal resistance of the light irradiation device according to the embodiment.
  • FIG. 23 is a schematic cross-sectional view showing a first example of the configuration of a light irradiation device according to an eleventh embodiment.
  • FIG. 23 is a schematic cross-sectional view showing a second example of the configuration of the light irradiation device according to the eleventh embodiment.
  • FIG. 23 is a schematic cross-sectional view showing a third example of the configuration of the light irradiation device according to the eleventh embodiment.
  • the configuration of the light irradiation device of the first embodiment will be described with reference to Figs. 1, 2A, 2B, 3A, and 3B.
  • the light irradiation device 10C is, for example, inserted into a catheter and introduced into a living body.
  • the light irradiation device 10C is inserted into the vicinity of a target site such as an affected part in a living body using a catheter, so that it is possible to directly irradiate light onto an affected part such as a tumor, or to inspect or confirm a target site for diagnosis, sensing, or the like.
  • Fig. 1 is a schematic perspective view showing an example of the configuration of the light irradiation device 10C of the first embodiment.
  • FIG. 2A is a schematic cross-sectional view showing a first example of the configuration of the light irradiation device 10C.
  • Fig. 2B is a schematic cross-sectional view showing a second example of the configuration of the light irradiation device 10C.
  • Figs. 2A and 2B show a cross section including a central axis C0 along the longitudinal direction P of the elongated light irradiation device 10C having the longitudinal direction P.
  • Fig. 3A is a view of the marker member 20A provided in the light irradiation device 10C shown in Figs. 1 and 2A as viewed from a first direction Q1.
  • FIG. 3B is a diagram of the marker member 20A included in the light irradiation device 10C shown in FIGS. 1 and 2A, viewed from the second direction Q2.
  • the central axis C0 is an axis parallel to the longitudinal direction P, passing through the center of the cross section of the light irradiation device 10C perpendicular to the axis parallel to the longitudinal direction P.
  • the center refers to the center of the circumscribed circle when the light irradiation device 10C is viewed from the +Z direction.
  • the light irradiation device 10C has an outer shape of an approximately rectangular parallelepiped with the longitudinal direction P as the long direction, in which the housing 30A and the marker member 20A are joined.
  • the cross section of the light irradiation device 10C perpendicular to the axis parallel to the longitudinal direction P is approximately rectangular.
  • the center of the cross section of the light irradiation device 10C perpendicular to the axis parallel to the longitudinal direction P corresponds to the center of the cross section of the rectangular parallelepiped perpendicular to the axis parallel to the longitudinal direction P.
  • the cross section of the light irradiation device 10C perpendicular to the axis parallel to the longitudinal direction P is not limited to being approximately rectangular, and may be any shape.
  • the center of the cross section of the light irradiation device 10C perpendicular to an axis parallel to the longitudinal direction P may be approximately the center of any shape perpendicular to an axis parallel to the longitudinal direction P.
  • the light irradiation device 10C includes a light emitting section 60 and a marker member 20A that is directly or indirectly connected to the light emitting section 60 and has radiopaque properties.
  • the marker member 20A viewed from a first direction Q1 perpendicular to the longitudinal direction P differs in at least one of the shape and position from the marker member 20A viewed from a second direction Q2 perpendicular to the longitudinal direction P, which is different from the first direction Q1.
  • the light irradiation device 10C is capable of irradiating light emitted from the light emitting element 11 in a predetermined direction R that intersects with the longitudinal direction P.
  • the light irradiation device 10C has a marker member 20A that is opaque to radiation such as X-rays and has at least one of a shape and a position different when viewed from a first direction Q1 and a second direction Q2.
  • the members of the light irradiation device 10C other than the marker member 20A are transparent to radiation.
  • the image of the marker member 20A can be confirmed in the photographed image.
  • the orientation of the marker member 20A placed in the living body can be confirmed.
  • the orientation of the marker member 20A is known with respect to the longitudinal direction P, and the light irradiation device 10C can irradiate the light emitted from the light emitting element 11 in a predetermined direction R that intersects with the longitudinal direction P.
  • the irradiation direction of light from the light irradiation device 10C can be grasped from the orientation of the marker member 20A confirmed based on the X-ray CT image.
  • the light irradiation device 10C has the marker member 20A, and can indicate the irradiation direction of light from the light irradiation device 10C via X-ray CT or the like.
  • a light irradiation device 10C capable of indicating the irradiation direction of light can be provided.
  • the marker member 20A shown in Figures 1 and 2A has the same shape and position when viewed from above (e.g., the +Y side) and when viewed from below (e.g., the -Y side). Therefore, the direction of light irradiation by the light irradiation device 10C cannot be determined from this image alone.
  • the shape of the marker member 20A differs in at least one of the shape and position when viewed with the naked eye, a slight change in the viewing direction will also cause a change in the radiographic image, making it possible to determine whether it is above or below.
  • the marker member 20A shown in Figures 3A and 3B has a long base 21 and a protrusion 22 provided on the surface of the base 21. This makes it possible to provide a marker member 20A that has a different shape in the first direction Q1 and the second direction Q2.
  • the marker member 20A can be made of a metal material such as platinum that is opaque to radiation.
  • the marker member 20A is not limited to the convex portion 22, and at least one of a convex portion and a concave portion may be provided on the surface of the base portion 21. Furthermore, the marker member 20A is not limited to having the base portion 21 and at least one of a convex portion and a concave portion, and various shapes can be used as long as at least one of the shape and position differs between the first direction Q1 and the second direction Q2. One or more parts of the marker member 20A may be arranged separately from the other parts.
  • the light emitting unit 60 has a light emitting element 11 and a support 12 that supports the light emitting element 11.
  • the support 12 is disposed on the upper surface (e.g., the surface on the +Y side) of the base 21 of the marker member 20A.
  • the light emitting element 11 is disposed on the upper surface of the support 12.
  • the light emitting element 11 can emit light in a direction along the longitudinal direction P from a light emitting surface 111 that intersects with the longitudinal direction P. In the example shown in FIG. 1, the light emitting element 11 emits light in the +Z direction.
  • the light emitting unit 60 has the light emitting element 11 and the support 12, and therefore the support 12 can be used as a heat dissipation member that dissipates heat from the light emitting element 11.
  • the light irradiation device 10C has an optical component 40 that directs the light emitted from the light emitting element 11 in the longitudinal direction P in a direction R intersecting the longitudinal direction P.
  • the optical component 40 is a prism that is disposed on the upper surface of the support 12 and includes a reflecting surface 41 that intersects with the upper surface of the support 12.
  • the optical component 40 directs the light emitted from the light emitting element 11 in the direction R by reflecting it on the reflecting surface 41.
  • the optical component 40 is not limited to a prism, and may be a mirror, a lens, a diffractive optical element, or the like, as long as it is capable of directing light in a predetermined direction.
  • the optical component 40 may be configured to include a resin material, a glass material, a metal material, or the like.
  • the optical component 40 may be formed integrally with the support 12.
  • the entire surface of the light-emitting element 11 is covered with an insulating layer 16. This can prevent the light-emitting element 11 from being damaged by a short circuit between the marker member 20A and the light-emitting element 11 via the support 12.
  • at least one of the light-emitting element 11 and the support 12 may be covered with an insulating layer, not limited to the entire surface of the light-emitting element 11.
  • the light irradiation device 10C has a housing 30A including an opening 31A, in which at least a part of the light emitting element 11 and at least a part of the support 12 can be arranged, and a light-transmitting member 32 that seals the opening 31A of the housing 30A.
  • the light-transmitting member 32 transmits light emitted from the light emitting portion 60 and irradiated in a predetermined direction R that intersects with the longitudinal direction P. With this configuration, the light irradiation device 10C can irradiate light from the light emitting element 11 arranged inside the housing 30A through the light-transmitting member 32.
  • the materials of the support 12, light emitting element 11, optical component 40, insulated wire 14, etc. can be the same as those of the eighth to tenth embodiments described below, and the same applies to the second to seventh embodiments.
  • the support 12 and optical component 40 are integrally formed as in the example shown in FIG. 2B, they may be integrally formed from the same material. They may contain aluminum nitride (AlN) as a main component because of its high thermal conductivity. Examples of methods for integrally forming the support 12 and optical component 40 include injection molding or pressing a ceramic green sheet.
  • Fig. 4A is a schematic cross-sectional view showing an example of the configuration of the light irradiating device 10D of the second embodiment.
  • Fig. 4B is a schematic bottom view showing an example of the configuration of the light irradiating device 10D.
  • Fig. 5 is a schematic cross-sectional view showing a state in which the light irradiating device 10D is rotated 180 degrees from the state shown in Fig. 4A around the central axis C0 of the light irradiating device 10D parallel to the longitudinal direction P as the rotation axis.
  • Figs. 4A and 5 show a cross section including the central axis C0 along the longitudinal direction P of the elongated light irradiating device 10D having the longitudinal direction P.
  • the light irradiation device 10D includes a light emitting element 11, a support 12 to which the light emitting element 11 is fixed, and a radiopaque marker section 20D.
  • the marker section 20D viewed from a first direction Q1 perpendicular to the longitudinal direction P differs in at least one of shape and position from the marker section 20D viewed from a second direction Q2 perpendicular to the longitudinal direction P, which is different from the first direction Q1.
  • the marker section 20D is provided on the support 12.
  • the light irradiation device 10D can irradiate light emitted from the light emitting element 11 in a predetermined direction R intersecting the longitudinal direction.
  • the light emitting element 11 is an example of a light emitting section 60.
  • the light emitting element 11 and the light emitting section 60 are labeled with the same reference numerals in order to indicate that the light emitting element 11 and the light emitting section 60 are the same.
  • the reference numerals may be labeled with the same reference numerals in the same manner.
  • the marker part 20D shown in FIG. 4A, FIG. 4B, and FIG. 5 has the same shape and position when viewed from above (e.g., the +Y side) and when viewed from below (e.g., the -Y side). Therefore, the light irradiation direction by the light irradiation device 10D cannot be grasped from this image alone.
  • the shape of the marker part 20D differs visually in at least one of the shape and position, so if you change the viewing direction slightly, the radiographic image also changes, making it possible to tell whether it is above or below.
  • the marker portion 20D on the first surface 12a has anisotropy when viewed from a direction parallel or perpendicular to the first surface 12a, and the marker portion 20D on the second surface 12b may have anisotropy in a direction different from the first surface 12a.
  • the anisotropy of the marker portion 20D refers to a property in which at least one of the shape and the position of the marker portion 20D is different.
  • the marker portion 20D is made of a metal material, and at least a portion of the marker portion 20D has a thickness of 20 ⁇ m or more and 100 ⁇ m or less.
  • the marker portion 20D is a plate-shaped member with a thickness t1.
  • the thickness t1 is 20 ⁇ m or more and 100 ⁇ m or less.
  • Making the thickness of at least a portion of the marker portion 20D 40 ⁇ m or more is preferable because it improves visibility in radiographic images. Furthermore, making the thickness 100 ⁇ m or less allows for a compact size.
  • the metal material constituting the marker portion 20D may be platinum or the like.
  • the marker portion 20D is provided by, for example, plating platinum on the second surface 12b of the support body 12.
  • the marker portion 20D is not limited to being provided on a part of another member such as the support body 12.
  • the marker portion 20D may be an independent member that is joined to another member such as the support body 12 by an adhesive or the like.
  • the position of the marker part 20D when viewed from the third direction Q3, which is a direction parallel to the first surface 12a differs from the position of the marker part 20D when viewed from the third direction Q3 by rotating the light irradiation device 10D 180 degrees around the central axis C0 of the light irradiation device 10D parallel to the longitudinal direction P as the axis of rotation by more than twice the distance t2 between the first surface 12a and the second surface 12b in the support 12.
  • the first position 20v shown in FIG. 4A represents the position of the marker part 20D when viewed from the third direction Q3, which is a direction parallel to the first surface 12a.
  • the second position 20u shown in FIG. 4A is a virtual representation of the second position 20u in the state shown in FIG. 5, in order to compare it with the first position 20v.
  • the distance d between the first position 20v and the second position 20u is at least twice the distance t2. This configuration makes it easier to see the difference in the position of the marker unit 20D depending on the viewing direction.
  • the marker unit 20D can be used to clearly indicate the direction of light emitted from the light irradiation device 10D via X-ray CT or the like.
  • the light emitting portion is a light emitting element 11.
  • the light emitting element 11 is disposed on a support 12.
  • the optical component 40 of the light irradiation device 10D is placed on the support 12.
  • Fig. 6 is a schematic cross-sectional view showing an example of the configuration of the light irradiating device 10E of the third embodiment.
  • Fig. 6 shows a cross section including a central axis C0 along the longitudinal direction P of the elongated light irradiating device 10E having the longitudinal direction P.
  • the marker section 20D is provided on both the first surface 12a and the second surface 12b.
  • the marker section 20D provided on the first surface 12a differs from the marker section 20D provided on the second surface 12b in at least one of the size and the position of the marker section 20D.
  • This configuration makes it easy to see the difference in the position of the marker section 20D depending on the viewing direction, so that the direction of the light irradiated from the light irradiation device 10E can be clearly indicated via X-ray CT or the like.
  • the marker portion 20D includes a first marker portion 20Da and a second marker portion 20Db.
  • the first marker portion 20Da is provided on the first surface 12a alongside the light-emitting element 11 in the direction along the longitudinal direction P.
  • the second marker portion 20Db is provided on the second surface 12b.
  • the first marker portion 20Da is provided at a position shifted in the longitudinal direction P from the second marker portion 20Db.
  • the first marker portion 20Da is smaller than the second marker portion 20Db. In other words, the first marker portion 20Da differs from the second marker portion 20Db in both size and position.
  • the marker unit 20D shown in FIG. 6 has the same shape and position when viewed from above (e.g., the +Y side) and from below (e.g., the -Y side). Therefore, the direction of light irradiation by the light irradiation device 10E cannot be determined from this image alone.
  • the shape of the marker unit 20D differs visually in at least one of the shape and position, a slight change in the viewing direction also causes a change in the radiographic image, making it possible to determine whether it is above or below. Note that there are two directions that are different to the naked eye but are not different in the radiographic image, as in the fourth to seventh embodiments described below, and therefore a description of this will be omitted in the fourth to seventh embodiments.
  • Fig. 7 is a schematic cross-sectional view showing an example of the configuration of the light irradiating device 10F of the fourth embodiment.
  • Fig. 7 shows a cross section including a central axis C0 along the longitudinal direction P of the elongated light irradiating device 10F having the longitudinal direction P.
  • the light output section is a fiber 18.
  • the fiber 18 is disposed on the support 12.
  • the light irradiation device 10F can guide light from a light source disposed remotely, so there is no need to provide a light source inside the light irradiation device.
  • the configuration of the light output section 60 of the light irradiation device 10F can be simplified.
  • Fig. 8A is a schematic cross-sectional view showing an example of the configuration of the light irradiating device 10G of the fifth embodiment.
  • Fig. 8A shows a cross-section including a central axis C0 along the longitudinal direction P of the elongated light irradiating device 10G having the longitudinal direction P.
  • Fig. 8B is a schematic bottom view showing an example of the configuration of the light irradiating device 10G.
  • the second surface 12b of the support 12 includes a first region 12b1 and a second region 12b2 different from the first region 12b1.
  • a marker portion 20D is provided in the first region 12b1, and an insulated wire 14 is arranged in the second region 12b2.
  • a second insulated wire 14b is arranged in the second region 12b2.
  • the thickness of the light irradiation device 10G can be made thinner than when the insulated electric wire 14 is arranged on the marker portion 20D provided on the second surface 12b.
  • Fig. 9 is a schematic cross-sectional view showing an example of the configuration of the light irradiating device 10H of the sixth embodiment.
  • Fig. 9 shows a cross section including a central axis C0 along the longitudinal direction P of the elongated light irradiating device 10H having the longitudinal direction P.
  • the light irradiation device 10H mainly differs from the above-described embodiment in that it has an optical component 40 that imparts at least one of the optical effects of reflection, refraction, and diffraction to the light emitted from the light emitting section 60, and the marker section 20D is provided on the optical component 40.
  • the light emitting section 60 emits light in a direction along the longitudinal direction P
  • the optical component 40 includes a reflecting surface 41 that reflects the light from the light emitting section 60 in a direction intersecting the longitudinal direction P.
  • the marker section 20D is provided in an area of the optical component 40 other than the area where the reflecting surface 41 is provided.
  • the optical component 40 is disposed on the upper surface of the support 12.
  • the optical component 40 is a prism having a reflecting surface 41 and a surface 42 located on the opposite side of the reflecting surface 41.
  • the marker section 20D is provided on the surface 42 of the optical component 40.
  • the configuration of the light irradiation device can be simplified by providing the marker section 20D on the optical component 40.
  • the marker section 20D may be provided on at least one of the side surfaces intersecting the surface 42 of the optical component 40, for example, the surface on the +X side and the surface on the -X side of the optical component 40.
  • Fig. 10 is a schematic perspective view showing an example of the configuration of a light irradiating device 10J according to the seventh embodiment.
  • the light irradiation device 10J includes a marker portion 20D and a second marker portion 20J in a portion other than the support 12 and the optical component 40.
  • the light irradiation device 10J includes a marker portion 20D provided on the support 12 and a second marker portion 20J arranged on the opposite side of the optical component 40 across the light emission portion 60.
  • the second marker portion 20J is a cylindrical member inside which the insulated electric wire 14 can be arranged.
  • the shape of the second marker portion 20J is not limited to a cylindrical shape and may be any shape.
  • the light irradiation device 10J can make the marker unit that appears in the X-ray CT image larger than when only the marker unit 20D is provided. This improves the visibility of the marker unit, and it is possible to provide a light irradiation device 10J that allows the position of the light irradiation device 10J to be easily confirmed.
  • the second marker unit 20J is not provided and only the marker unit 20D is provided, the exact position and orientation can be confirmed with the marker unit 20D. This makes it possible to provide a light irradiation device 10J that can indicate the light irradiation direction with high accuracy.
  • the eighth to tenth embodiments will be described below.
  • examples are described in which a marker member or marker portion is not provided, but the light irradiation device described in the eighth to tenth embodiments may be provided with the marker member or marker portion described in the first to seventh embodiments.
  • FIG. 11 is a diagram showing an example of an in vivo light irradiation assembly 100 using the light irradiation device 10 of the eighth embodiment.
  • the in vivo light irradiation assembly 100 includes a catheter 50 and a light irradiation device 10 inserted into the catheter 50, and the catheter 50 is filled with a refrigerant 51 at least during use.
  • the in vivo light irradiation assembly 100 is used for treatment, diagnosis, sensing, and the like.
  • the light irradiation device 10 is, for example, inserted into the catheter 50 in the direction indicated by the "insertion direction" of the white arrow in the figure, and introduced into a living body.
  • the refrigerant 51 is supplied into the catheter 50, and the heat generating part is cooled when used. Therefore, the tip side of the light irradiation device 10 is integrally covered by an insulating layer 16.
  • the refrigerant 51 is, for example, physiological saline, blood, lymph, etc., and the refrigerant temperature is, for example, about 10°C to 36°C.
  • the light irradiation device 10 is inserted into the vicinity of the irradiation target site, such as an affected area, inside a living body using a catheter 50, so that it is possible to directly irradiate the affected area, such as a tumor, with light, and to inspect and confirm the target site for diagnosis, sensing, etc., without using an optical fiber.
  • the irradiation target site such as an affected area
  • a catheter 50 so that it is possible to directly irradiate the affected area, such as a tumor, with light, and to inspect and confirm the target site for diagnosis, sensing, etc., without using an optical fiber.
  • FIG. 12A and 12B are schematic diagrams showing an example of the configuration of the light irradiation device 10 of the eighth embodiment shown in FIG. 1.
  • the light emitting element, the support on which the light emitting element is mounted, and the insulated electric wire electrically connected to the light emitting element are integrally covered with an insulating layer, but the covering state of the insulating layer is different.
  • the optical axis direction is the Z direction
  • the mounting direction of the light emitting element on the support is the Y direction
  • the direction perpendicular to the Z direction and the Y direction is the X direction.
  • the light irradiation device 10A of FIG. 12A includes a light emitting element 11 that emits light of a predetermined wavelength, an optical component 17 into which the light emitted from the light emitting element 11 is incident, a support 12 that mounts the light emitting element 11 and the optical component 17, an insulated electric wire 14 electrically connected to the light emitting element 11, and an insulating layer 16A that integrally covers the outer surface of the structure including the light emitting element 11, the optical component 17, the support 12, and the insulated electric wire 14.
  • the insulating layer 16A is a coating (hereinafter referred to as a polysilazane coating) formed by applying a polysilazane solution and silicifying it, and is transparent to the light emitted from the light emitting element 11.
  • the thickness of the insulating layer can be reduced to improve heat dissipation while ensuring insulation.
  • the light emission surface 111 of the light emitting element 11 and the light incidence surface 171 of the optical component 17 face each other with the space 13 in between.
  • the light emitted from the light emission surface 111 passes through the insulating layer 16A, the space 13, and the insulating layer 16A and enters the light incidence surface 171 of the optical component 17.
  • the insulating layer 16A in FIG. 12A seals the stacked structure along the surface shape of the support 12 and the components such as the light emitting element 11 mounted on the support 12.
  • the longitudinal direction of the support 12 is parallel to the Z direction.
  • the light irradiation device 10 of the eighth embodiment is inserted into the catheter 50 in the +Z direction, and the insulated wires 14 including the first insulated wire 14a and the second insulated wire 14b extend in the -Z direction.
  • the support 12 is formed of an insulating material such as silicon (Si), aluminum nitride (AlN), silicon nitride (SiN), alumina (Al 2 O 3 ), glass, quartz, ceramics, etc., and a material with a thermal conductivity of 100 W/m ⁇ K or more is preferable.
  • a metal material such as copper or a resin material may be used. When a metal material is used, an insulation process is performed as appropriate to prevent short circuits and the like.
  • the light emitting element 11 is mounted on the light emitting element mounting surface 121 of the support 12.
  • the optical component 17 is mounted on the light-emitting element mounting surface 121 of the support 12 together with the light-emitting element 11, and the light incident surface 171 of the optical component 17 is inclined with respect to the light-emitting element mounting surface 121.
  • the light incident surface 171 of the optical component 17 functions as a reflecting surface, and the output light Lout of the light irradiation device 10A is extracted in the direction of the dashed arrow.
  • the optical component 17 is a reflecting member that guides the light emitted from the light-emitting element 11 in a direction intersecting with the light-emitting element mounting surface 121 of the support 12 (for example, the +Y direction).
  • the optical component 17 may be a mirror that reflects the light incident on the light incident surface 171.
  • the mirror may have a reflective layer of metal and/or a dielectric multilayer film. This allows the light to be reflected efficiently.
  • the insulated wire 14 includes a first insulated wire 14a electrically connected to one electrode (also called the first electrode) of the light-emitting element 11 on the side of the light-emitting element mounting surface 121, which is the first surface of the support 12 on which the light-emitting element 11 is mounted, and a second insulated wire 14b electrically connected to the other electrode (also called the second electrode) of the light-emitting element 11 on the side of the back surface 122 (also called the second surface) opposite the light-emitting element mounting surface 121.
  • the insulated wire it is possible to pass electricity through the light-emitting element 11.
  • One of the features of the light irradiation device 10A is that the electrical connection parts between the first insulated wire 14a and the second insulated wire 14b and the light-emitting element 11 are sealed together with the support 12, the light-emitting element 11, and the optical component 17 by an insulating layer 16A.
  • the thickness of the insulating layer 16A is thinner than the thickness of the light-emitting element 11.
  • the width of the support 12 in the X direction is such that it can be easily inserted into the catheter 50, but from the viewpoint of widening the cooling area (i.e., heat dissipation area) by the refrigerant 51, it may be set as wide as possible within the range that allows smooth insertion into the catheter 50.
  • the thickness of the support 12 in the Y direction is such that it can stably support the light-emitting element 11 and can be smoothly inserted into the catheter 50 with the light-emitting element 11 mounted. As an example, the thickness of the support 12 is about 0.075 mm to 0.3 mm.
  • the first insulated wire 14a and the second insulated wire 14b are connected to the upper surface of the light emitting element 11 and the back surface 122 of the support 12, respectively, so as not to interfere with the light emission in the Z direction of the light emitting element 11 and the reflection by the optical component 17.
  • a conductive layer 124 is formed on at least a part of the surface of the support 12.
  • the support 12 has a conductive layer 124 formed on at least a part of the light emitting element mounting surface 121, the back surface 122, and the side surface connecting the light emitting element mounting surface 121 and the back surface 122.
  • FIG. 13 is a perspective view of the light irradiation device body before being sealed with the insulating layer 16 (or 16A or 16B).
  • a predetermined space 13 is provided between the light emission surface 111 of the light emitting element 11 and the light incidence surface 171 of the optical component 17. The light emitted from the light emitting element 11 passes through the space 13 and enters the optical component 17, where it is reflected in a predetermined direction.
  • a conductive layer 124 is formed covering at least a part of the light emitting element mounting surface 121 of the support 12, at least a part of the side surface, and at least a part of the back surface 122.
  • the top surface of the light emitting element 11 is connected to the first insulated wire 14a, and the bottom surface of the light emitting element 11 is connected to the conductive layer 124 formed on the light emitting element mounting surface 121.
  • a conductive layer 124 is formed from the light-emitting element mounting surface 121 of the support 12 through the side surface to the back surface 122, and the internal metal wiring of the second insulated wire 14b is connected to the conductive layer 124 on the back surface 122 of the support 12. This provides an electrical connection between the other electrode of the light-emitting element 11 and the second insulated wire 14b.
  • the optical component 17 is mounted on the support 12 and faces the light emission surface 111 of the light emitting element 11.
  • the main body of the optical component 17 is formed of a dielectric material such as glass, and a thin silver film is formed on the light incidence surface 171, but this example is not limited to this.
  • a thin film of aluminum, aluminum alloy, gold, nickel, platinum, etc. may be formed on the light incidence surface (i.e., the reflection surface) of the main body of an insulating material such as plastic, resin, silicon (Si), aluminum nitride (AlN), silicon nitride (SiN), alumina ( Al 2 O 3 ), glass, quartz, ceramics, etc.
  • a dielectric multilayer film may be formed.
  • the support 12, the light emitting element 11, the optical component 17, and a part of the insulated electric wire 14 are covered with a light-transmitting insulating layer 16A or 16B by a dipping method, a spraying method, etc.
  • the light-emitting element 11 is, for example, an edge-emitting laser element having a ridge structure.
  • the light-emitting element 11 has an n-side electrode 113, an n-side semiconductor layer 114, an active layer 115, a p-side semiconductor layer 116, and a p-side electrode 118.
  • the n-side semiconductor layer 114 may include an optical guide layer, a cladding layer, a contact layer, etc., to which an n-type impurity is added.
  • the semiconductor material and its composition of the light-emitting element 11 are designed to emit laser light of a desired wavelength.
  • GaN-based materials such as GaN, InGaN, and AlGaN are used.
  • GaAs-based materials such as GaAs and AlGaAs
  • InP-based materials such as InAlGaP and GaInP are used.
  • the width of the ridge may be formed wide to ensure the gain of the active layer 115.
  • the width of the ridge may be designed to be, for example, 2 ⁇ m to 100 ⁇ m.
  • the transverse mode may be a multimode or a single mode.
  • the light emitted by the light emitting element 11 of this embodiment is linearly polarized, and the direction of the linear polarization after emission can be changed by changing the reflection direction using an optical component 17 such as a mirror.
  • an optical component 17 such as a mirror.
  • This makes it possible to reduce the reflectance when the light enters a living body, and to improve the transmittance through the living body.
  • Even light that is in a specific polarization state when the laser light is emitted may have its polarization state fluctuate or become depolarized while passing through a transmission medium such as an optical fiber.
  • light can be directly irradiated to an affected area inside the body without using an optical fiber, so light can be irradiated to a target location such as an affected area while maintaining a specific polarization state.
  • Figure 15 is a schematic diagram showing an example of stacking of the support 12 and the light-emitting element 11.
  • the light-emitting element 11 is sandwiched between the first support 12-1 and the second support 12-2.
  • the first support 12-1 is in contact with the top surface of the light-emitting element 11, and the second support 12-2 is in contact with the bottom surface of the light-emitting element 11.
  • heat can be efficiently dissipated to the upper and lower sides of the light-emitting element 11, improving the heat dissipation properties of the light irradiation device 10.
  • the rear end of at least one of the support 12-1 and the second support 12-2 may be extended in the -Z direction.
  • the optical component 17 extracts light in a direction (for example, the Y direction) that is not parallel to the optical axis (Z axis), but as described in the second embodiment, if the light is extracted in a direction parallel to the light-emitting element mounting surface 121 of the support 12, the tip sides of the first support 12-1 and the second support 12-2 may be extended long in the +Z direction.
  • the entire structure in FIG. 15 is covered with an insulating layer 16A or 16B.
  • Ninth embodiment 16 is a diagram showing an example of an in vivo light irradiation assembly 200 using the light irradiation device 20 of the ninth embodiment.
  • the in vivo light irradiation assembly 200 includes a catheter 50 and the light irradiation device 20 inserted into the catheter 50, and the catheter 50 is filled with a refrigerant 51 at least during use.
  • the in vivo light irradiation assembly 200 is used for treatment, diagnosis, sensing, and the like.
  • the light irradiation device 20 is inserted into the catheter 50 in the "insertion direction" of the white arrow in the figure, and introduced into the living body.
  • the light irradiation device 20 is used with its heat generating portion cooled.
  • the insulated wires 24 are pulled out from both sides along the optical axis of the insulating layer 26 to enhance heat dissipation.
  • the insulated wires 24 include a first insulated wire 24a and a second insulated wire 14b that are electrically connected to the light emitting element 11.
  • the length of the insulated wire 24 pulled out from the insulating layer 26 in the +Z direction may be shorter than the length of the insulated wire 24 pulled out from the insulating layer 26 in the -Z direction.
  • the light emitted from the light emitting element 11 is guided in a direction parallel to the light emitting element mounting surface or in a direction that is not obstructed by the first insulated wire 24a and the second insulated wire 24b.
  • the covering form of the insulating layer 26 may be a thin covering along the surface shape of the support 12 and the components mounted on the support 12 as shown in FIG. 12A to enhance heat dissipation, or it may be partially thick by filling in the spaces between the components mounted on the support 12 as shown in FIG. 12B, while keeping the overall thickness of the light irradiation device as small as possible to ensure electrical insulation from the refrigerant 51.
  • FIG. 17 is a diagram showing an example of the arrangement of the optical components 27 of the light irradiation device 20.
  • FIG. 17 shows the state before the first insulated wire 24a and the second insulated wire 24b are electrically connected to the light emitting element 11.
  • the light emitted from the light emitting surface 111 of the light emitting element 11 is reflected by the optical components 27 in a direction approximately parallel to the light emitting element mounting surface 121, and the output light Lout of the light irradiation device 20 is extracted in the direction of the dashed arrow.
  • the reflected light from the optical components 27 is not blocked by the first insulated wire 24a and the second insulated wire 24b, the light may be reflected in a non-parallel direction from the light emitting element mounting surface 121.
  • the light emitting element 11, the optical component 27, and the electrical connection parts between the light emitting element 11 and the first insulated wire 24a and the second insulated wire 24b are sealed with the insulating layer 26 integrally with the support 12. At least the part of the insulating layer 26 that exists between the light emitting element 11's light exit surface 111 and the light incident surface 171 of the optical component is translucent to the light emitted from the light emitting element 11.
  • the light-emitting element 11 is, for example, an edge-emitting laser element.
  • the light-emitting element 11 may be a laser element having a wide ridge structure similar to that of the eighth embodiment.
  • the direction parallel to the Z axis of the light-emitting element 11 is the resonance direction.
  • An optical component 27 is disposed on the light-emitting element mounting surface 121 of the support 12, and guides the light emitted from the emission surface of the laser element in a direction parallel to the light-emitting element mounting surface 121 of the support 12.
  • the first insulated electric wire 24a and the second insulated electric wire 24b see FIG.
  • the optical component 27 reflects the light emitted from the light emission surface of the light emitting element 11, for example, in the X direction parallel to the light emitting element mounting surface 121.
  • the "parallel" direction does not need to be strictly parallel to the light emitting element mounting surface 121, and may have an error of about ⁇ 10°, including the surface state of the support 12 and the manufacturing error of the optical component 27.
  • the optical component 27 is preferably as thick as the light emitting element 11 or thinner than the light emitting element 11.
  • the optical component is a flat-processed mirror or prism, or a meta-polarizing element with a metasurface element inserted.
  • the optical component 27 may also be an optical element having a lens function that controls the spread angle of the light emitted from the light emitting element 11.
  • the optical component 27 may be composed of two or more optical elements.
  • the device may have an optical element that has a lens function to control the spread angle of the light emitted from the light-emitting element 11, and an optical element that reflects the light whose spread angle has been controlled by the optical element at a predetermined angle.
  • the insulating layer 26 integrally seals the locations where electrical insulation is required with the first insulated wire 24a and the second insulated wire 24b extended in the +Z and -Z directions from both ends of the optical axis direction of the support 12.
  • the electrical connection between the light emitting element 11 and the first insulated wire 24a and the second insulated wire 24b, and at least the light emission surface 111 of the light emitting element 11 and the light incidence surface 171 of the optical component 17 are sealed by the insulating layer 26 and isolated from the refrigerant 51.
  • the insulating layer 26 is preferably a biocompatible resin with high thermal conductivity.
  • At least one of the two ends in the longitudinal direction (Z direction) of the support 12 may protrude from the insulating layer 26.
  • the support 12 protruding from the insulating layer 26 comes into contact with the refrigerant 51, thereby ensuring the heat dissipation of the light irradiation device 20.
  • the heat dissipation is further improved compared to the eighth embodiment.
  • the overall thickness and width of the light irradiation device 20 are about 0.5 mm, and an ultra-compact light irradiation device 20 that can be mounted on a catheter 50 is realized.
  • the light emitting element 11 may be sandwiched between two supports 12-1 and 12-2 as shown in FIG. 15.
  • the light emitted from the light emitting element 11 is extracted in a direction that is not obstructed by the support 12, so that the heat dissipation of the light irradiation device 20 can be further improved by sandwiching it between two supports 12-1 and 12-2.
  • FIG. 18 is a schematic diagram of a light irradiation device 30 according to a tenth embodiment.
  • the light irradiation device 30 is also mounted on a catheter 50 (see Figs. 11 and 16) for use, and the light irradiation device 30 and the catheter 50 can constitute an in-vivo light irradiation assembly.
  • a vertical cavity surface emitting laser (VCSEL) is used as the light emitting element 31.
  • the light irradiation device 30 has two light emitting elements 31 that emit light of a predetermined wavelength, a support 12 on which the light emitting elements 31 are mounted, and an insulated wire 34 electrically connected to the light emitting elements 31.
  • the insulated wire 34 includes a first insulated wire 34a connected to one electrode of each light emitting element 31 and a second insulated wire 34b connected to the other electrode.
  • the light emitting surface of the light emitting element 31 and the electrical connection portion between the light emitting element 31 and the insulated wire 34 are integrally sealed with the support 12 by an insulating layer 36. At least one of both ends along the longitudinal direction (Z direction) of the support 12 may protrude from the insulating layer 36. At least the portion of the insulating layer 36 that covers the light emitting surface is translucent.
  • the thickness of the insulating layer 36 may be thicker or thinner than the thickness of the light emitting element 31.
  • the light emission surface of the VCSEL used for the light-emitting element 31 is parallel to the light-emitting element mounting surface 121 of the support 12, and the laser light emitted from the VCSEL is emitted in a direction perpendicular to the light-emitting element mounting surface 121, as shown by the white arrow in the figure. With this configuration, no optical components such as mirrors are required.
  • the first insulated wire 34a and the second insulated wire 34b are, for example, two-core enameled wires.
  • the first insulated wire 34a is connected to one electrode of each light-emitting element 31 on the side of the light-emitting element mounting surface 121 of the support 12, and the second insulated wire 34b is connected to the other electrode of each light-emitting element 31 on the back surface of the support 12 (the surface opposite the light-emitting element mounting surface 121).
  • the first insulated wire 34a and the second insulated wire 34b are pulled out of the insulating layer 36 from at least one of both ends of the longitudinal direction of the support 12, with the support 12 sandwiched between them.
  • the VCSEL which is the light-emitting element 31, has a laminated structure in which a semiconductor substrate 401, an n-side reflective film 402, an n-type semiconductor layer 403, an active layer 404, a p-type semiconductor layer 405, and a p-side reflective film 406 are laminated in this order in the -Y direction.
  • the light emission direction is the +Y direction.
  • the p-type and n-type conductivity types may be in an inverse relationship.
  • the semiconductor substrate 401 may be removed.
  • the n-type semiconductor layer 403 has a flat portion and a convex portion protruding from the flat portion in the -Y direction.
  • An active layer 404 is provided on the upper surface of the convex portion of the n-type semiconductor layer 403.
  • a p-type semiconductor layer 405 is provided on the upper surface of the active layer 404, and a p-side reflective film 406 is provided in the upper portion of the p-type semiconductor layer 405 in a region other than the peripheral region.
  • a p-side contact layer may be provided between the p-type semiconductor layer 405 and the p-side reflective film 406.
  • the light-emitting element 31 includes an insulating layer 407 that covers the upper surface of the flat portion and the side surface of the convex portion of the n-type semiconductor layer 403, the side surface of the active layer 404, and the peripheral area of the side surface and upper surface of the p-type semiconductor layer 405.
  • the light-emitting element 31 includes a p-side electrode 408 electrically connected to the p-type semiconductor layer 405, and an n-side electrode 409 electrically connected to the n-type semiconductor layer 403.
  • the side on which the p-side electrode 408 and the n-side electrode 409 are provided is disposed on the light-emitting element mounting surface 121 of the support 12.
  • a conductive connection layer (or bump) connected to the light-emitting element mounting surface 121 of the support 12 may be provided so that the heights of the p-side electrode 408 and the n-side electrode 409 in the -Y direction are aligned.
  • the p-side reflective film 406 does not interfere with the light-emitting element mounting surface of the support 12.
  • the n-side reflective film 402 and the p-side reflective film 406 may each be formed, for example, from a distributed Bragg reflector (DBR).
  • DBR distributed Bragg reflector
  • a DBR has a structure in which multiple high-refractive index layers and multiple low-refractive index layers are alternately stacked.
  • a DBR has a wavelength range of high reflectance called a stop band. The central wavelength and wavelength width of the stop band are determined by the refractive index and thickness of the high-refractive index layer and the refractive index and thickness of the low-refractive index layer.
  • the reflectance in the stop band of a DBR increases with the refractive index difference between the high-refractive index layers and the number of layers stacked.
  • a standing wave is formed between the n-side reflecting film 402 and the p-side reflecting film 406.
  • the wavelength of the standing wave in air is within the stop band of the n-side reflecting film 402 and the p-side reflecting film 406, and this wavelength is the oscillation wavelength of the laser light.
  • An integer multiple of half the oscillation wavelength is equal to the optical distance between the reflective surfaces of the n-side reflecting film 402 and the p-side reflecting film 406, which face each other.
  • the optical distance is the distance obtained by multiplying the distance that light actually propagates through a certain medium by the refractive index of the medium.
  • the VCSEL of this embodiment is assumed to have the p-side electrode 408 and the n-side electrode 409 side as the mounting surface, and to extract laser light from the semiconductor substrate 401 side.
  • the configuration of the VCSEL shown in FIG. 19 is an example.
  • the components included in the VCSEL may be formed from known materials.
  • the shape of some of the components included in the VCSEL may be changed, and other components may also be included.
  • the VCSEL may be configured to extract laser light from the side opposite the semiconductor substrate 401.
  • FIG. 20A is a perspective view of the light-emitting element mounting surface 121 side of the support 12 used in the tenth embodiment
  • FIG. 20B is a perspective view of the back surface 122 side of the support.
  • the surface opposite the light-emitting element mounting surface 121 is referred to as the "back surface”.
  • Conductive layers 124 and 125 are formed on the light-emitting element mounting surface 121 of the support 12.
  • the conductive layer 124 is formed on the light-emitting element mounting surface 121 of the support 12 and is electrically insulated from the conductive layer 125.
  • the conductive layer 124 has a connection region 124c that is connected to one electrode of the light-emitting element 31, and a wide portion 124w that is wider than the connection region 124c at the end of the -Z side of the support 12.
  • the wide portion 124w is used for electrical connection with the first insulated wire 34a.
  • the conductive layer 125 is formed from the side surface of the support 12 to the back surface 122.
  • the p-side electrode 408 and n-side electrode 409 of the light-emitting element 31 are connected to the conductive layers 124 and 125 of the light-emitting element mounting surface 121, respectively, via conductive connection layers (or bumps).
  • the wide portion 124w of the conductive layer 124 is electrically connected to the first insulated wire 34a.
  • a portion of the insulating coating of the first insulated wire 34a is removed, and the internal metal wiring is connected to the conductive layer 124.
  • the conductive layer 125 is electrically connected to the second insulated wire 34b.
  • a portion of the insulating coating of the second insulated wire 34b is removed, and the internal metal wiring is connected to the conductive layer 125.
  • the first insulated wire 34a and the second insulated wire 34b are arranged to sandwich the support 12 and extend in the longitudinal direction (Z direction) of the support, and do not interfere with the light emission of the VCSEL.
  • the second insulated wire 34b connected to the rear surface 122 of the support 12 may be extended to the vicinity of the tip of the support 12 on the +Z side.
  • the first insulated wire 34a and the second insulated wire 34b protruding from the insulating layer 36 in the -Z direction are cooled by contacting the refrigerant.
  • the support 12 may also protrude from the insulating layer 36 at least at one end in the longitudinal direction and be directly cooled by the refrigerant.
  • the conductive layers 124 and 125 formed on the surface of the support 12 also function as a heat sink.
  • the VCSEL chip used as the light-emitting element 31 has a side length and height of 200 ⁇ m or less, is mounted on the support 12, and is sealed with an insulating layer 36.
  • the overall thickness and width of the light-emitting device 30 are about 0.5 mm, realizing an ultra-compact light-emitting device 30 that can be mounted on a catheter 50.
  • the thickness of the insulating layer 36 is thinner than the thickness of the light-emitting element 31.

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Abstract

Provided is a light radiation device with which it is possible to indicate a light radiation direction. The light radiation device has an elongated shape having a longitudinal direction and comprises a light emission part and a marker member that is directly or indirectly connected to the light emission part and is radiopaque. The marker member as viewed from a first direction in a direction orthogonal to the longitudinal direction differs in at least one among shape and position from the marker member as viewed from a second direction differing from the first direction in a direction orthogonal to the longitudinal direction, and it is possible to radiate light emitted from the light emission part in a predetermined direction crossing the longitudinal direction.

Description

光照射デバイスLight Irradiation Device

 本開示は、光照射デバイスに関する。 This disclosure relates to a light irradiation device.

 例えば、特許文献1には、放射線不透過性を有するマーカー部を備え、生体管腔内の特定の位置に対して選択的に光を照射可能な光照射デバイスが開示されている。 For example, Patent Document 1 discloses a light irradiation device that has a radiopaque marker portion and can selectively irradiate light to a specific position within a biological lumen.

特開2020-185259号公報JP 2020-185259 A

 本開示の一つの側面では、光の照射方向を標示可能な光照射デバイスを提供することを目的とする。 One aspect of the present disclosure aims to provide a light irradiation device that can indicate the direction of light irradiation.

 一つの実施形態において、光照射デバイスは、長手方向を有する長尺状の光照射デバイスであって、光出射部と、前記光出射部と直接的または間接的に接続され、放射線不透過性を有するマーカー部材と、を備え、前記長手方向と直交する方向における第1方向から視た前記マーカー部材は、前記長手方向と直交する方向における、前記第1方向とは異なる第2方向から視た前記マーカー部材に対し、形状及び位置の少なくとも一方が異なり、前記光出射部から出射された光を前記長手方向に対して交差する予め定められた方向に照射可能である。 In one embodiment, the light irradiation device is an elongated light irradiation device having a longitudinal direction, and includes a light emitting section and a radiopaque marker member that is directly or indirectly connected to the light emitting section, and the marker member viewed from a first direction perpendicular to the longitudinal direction has at least one of a shape and a position different from that of the marker member viewed from a second direction perpendicular to the longitudinal direction, the second direction being different from the first direction, and the light emitted from the light emitting section can be irradiated in a predetermined direction intersecting the longitudinal direction.

 一つの実施形態において、光照射デバイスは、長手方向を有する長尺状の光照射デバイスであって、光出射部と、前記光出射部が固定される支持体と、放射線不透過性を有するマーカー部と、を備え、前記長手方向と直交する方向における第1方向から視た前記マーカー部は、前記長手方向と直交する方向における、前記第1方向とは異なる第2方向から視た前記マーカー部に対し、形状及び位置の少なくとも一方が異なり、前記マーカー部は、前記支持体に設けられ、前記光出射部から出射された光を前記長手方向に対して交差する予め定められた方向に照射可能である。 In one embodiment, the light irradiation device is an elongated light irradiation device having a longitudinal direction, and includes a light emitting section, a support to which the light emitting section is fixed, and a radiopaque marker section, in which the marker section viewed from a first direction perpendicular to the longitudinal direction differs in at least one of shape and position from the marker section viewed from a second direction perpendicular to the longitudinal direction that is different from the first direction, and the marker section is provided on the support, and is capable of irradiating light emitted from the light emitting section in a predetermined direction intersecting the longitudinal direction.

 光の照射方向を標示可能な光照射デバイスを提供することができる。 It is possible to provide a light irradiation device that can indicate the direction of light irradiation.

第1実施形態の光照射デバイスの構成例を示す模式的斜視図である。FIG. 2 is a schematic perspective view showing a configuration example of the light irradiation device according to the first embodiment. 第1実施形態の光照射デバイスの構成の第1例を示す模式的断面図である。FIG. 2 is a schematic cross-sectional view showing a first example of the configuration of the light irradiation device according to the first embodiment. 第1実施形態の光照射デバイスの構成の第2例を示す模式的断面図である。FIG. 4 is a schematic cross-sectional view showing a second example of the configuration of the light irradiation device according to the first embodiment. 第1実施形態の光照射デバイスが備えるマーカー部材を第1方向から視た図である。3 is a diagram showing a marker member included in the light irradiation device of the first embodiment, viewed from a first direction. FIG. 第1実施形態の光照射デバイスが備えるマーカー部材を第2方向から視た図である。13 is a diagram showing the marker member included in the light irradiation device of the first embodiment as viewed from a second direction. FIG. 第2実施形態の光照射デバイスの構成例を示す模式的断面図である。FIG. 11 is a schematic cross-sectional view showing a configuration example of a light irradiation device according to a second embodiment. 第2実施形態の光照射デバイスの構成例を示す模式的下面図である。FIG. 13 is a schematic bottom view showing a configuration example of a light irradiation device according to a second embodiment. 長手方向に平行な光照射デバイスの中心軸を回転軸として図4Aに示す状態から光照射デバイスを180度回転させた状態を示す模式的断面図である。4B is a schematic cross-sectional view showing a state in which the light irradiation device is rotated 180 degrees from the state shown in FIG. 4A around a central axis of the light irradiation device parallel to the longitudinal direction as a rotation axis. FIG. 第3実施形態の光照射デバイスの構成例を示す模式的断面図である。FIG. 13 is a schematic cross-sectional view showing a configuration example of a light irradiation device according to a third embodiment. 第4実施形態の光照射デバイスの構成例を示す模式的断面図である。FIG. 13 is a schematic cross-sectional view showing a configuration example of a light irradiation device according to a fourth embodiment. 第5実施形態の光照射デバイスの構成例を示す模式的断面図である。FIG. 13 is a schematic cross-sectional view showing a configuration example of a light irradiation device according to a fifth embodiment. 第5実施形態の光照射デバイスの構成例を示す模式的下面図である。FIG. 13 is a schematic bottom view showing a configuration example of a light irradiation device according to a fifth embodiment. 第6実施形態の光照射デバイスの構成例を示す模式的断面図である。FIG. 13 is a schematic cross-sectional view showing a configuration example of a light irradiation device according to a sixth embodiment. 第7実施形態の光照射デバイスの構成例を示す模式的斜視図である。FIG. 13 is a schematic perspective view showing a configuration example of a light irradiation device according to a seventh embodiment. 第8実施形態の光照射デバイスを用いた生体内光照射アセンブリの一例を示す図である。FIG. 23 is a diagram showing an example of an in vivo light irradiation assembly using the light irradiation device of the eighth embodiment. 第8実施形態の光照射デバイスの構成例を示す模式図である。FIG. 13 is a schematic diagram showing a configuration example of a light irradiation device according to an eighth embodiment. 第8実施形態の光照射デバイスの別の構成例を示す模式図である。13 is a schematic diagram showing another configuration example of the light irradiation device according to the eighth embodiment. FIG. 絶縁層で封止される前の光照射デバイス本体の斜視図である。FIG. 2 is a perspective view of the light irradiation device body before being sealed with an insulating layer. 支持体上に搭載された発光素子の模式図である。FIG. 2 is a schematic diagram of a light-emitting element mounted on a support. 支持体と発光素子の積層例を示す模式図である。1 is a schematic diagram showing an example of lamination of a support and a light-emitting element. FIG. 第9実施形態の光照射デバイスを用いた生体内光照射アセンブリの一例を示す図である。FIG. 13 is a diagram showing an example of an in vivo light irradiation assembly using the light irradiation device of the ninth embodiment. 第9実施形態の光照射デバイスの光学素子の配置例を示す図である。13A to 13C are diagrams illustrating an example of the arrangement of optical elements in a light irradiation device according to a ninth embodiment. 第10実施形態の光照射デバイスの模式図である。FIG. 23 is a schematic diagram of a light irradiation device according to a tenth embodiment. 第10実施形態で用いられる発光素子の一例を示す模式図である。FIG. 23 is a schematic diagram showing an example of a light-emitting element used in the tenth embodiment. 第10実施形態で用いられる支持体の発光素子搭載面側の斜視図である。FIG. 23 is a perspective view of a light-emitting element mounting surface side of a support body used in a tenth embodiment. 第10実施形態で用いられる支持体の裏面側の斜視図である。FIG. 23 is a perspective view of the rear surface side of a support body used in the tenth embodiment. 実施形態の光照射デバイスの電気特性と光出力特性を示す図である。5A and 5B are diagrams illustrating electrical characteristics and optical output characteristics of the light irradiation device according to the embodiment. 実施形態の光照射デバイスの熱抵抗を示す図である。FIG. 4 is a diagram showing thermal resistance of the light irradiation device according to the embodiment. 第11実施形態の光照射デバイスの構成の第1例を示す模式的断面図である。FIG. 23 is a schematic cross-sectional view showing a first example of the configuration of a light irradiation device according to an eleventh embodiment. 第11実施形態の光照射デバイスの構成の第2例を示す模式的断面図である。FIG. 23 is a schematic cross-sectional view showing a second example of the configuration of the light irradiation device according to the eleventh embodiment. 第11実施形態の光照射デバイスの構成の第3例を示す模式的断面図である。FIG. 23 is a schematic cross-sectional view showing a third example of the configuration of the light irradiation device according to the eleventh embodiment.

 以下、図面を参照しながら、本開示を実施するための実施形態を説明する。以下の説明は、本開示の技術思想を具体化するためのものであって、特定的な記載がない限り、本開示を以下の記載に限定するものではない。各図面中、同一の機能を有する部材には、同一符号を付している場合がある。要点の説明または理解の容易性を考慮して、便宜上実施形態に分けて示す場合があるが、異なる実施形態や実施例で示した構成の部分的な置換または組み合わせは可能である。後に示す実施形態では、先に示した実施形態との異なる事項について主に説明し、先に示した実施形態と共通の事柄について重複する説明を省略することがある。各図面が示す部材の大きさや位置関係等は、説明を明確にするため、誇張して示している場合がある。 Below, with reference to the drawings, an embodiment for carrying out the present disclosure will be described. The following description is intended to concretize the technical ideas of the present disclosure, and unless otherwise specified, the present disclosure is not limited to the following description. In each drawing, the same reference numerals may be used for components having the same function. In consideration of the explanation of the main points or ease of understanding, the embodiments may be shown separately for convenience, but partial substitution or combination of the configurations shown in different embodiments or examples is possible. In the embodiments shown later, differences from the embodiments shown earlier will be mainly explained, and overlapping explanations of matters common to the embodiments shown earlier may be omitted. The sizes and positional relationships of the components shown in each drawing may be exaggerated to clarify the explanation.

 (第1実施形態)
 図1、図2A、図2B、図3A及び図3Bを参照して、第1実施形態の光照射デバイスの構成について説明する。光照射デバイス10Cは、たとえば、カテーテルに挿入されて、生体内に導入される。光照射デバイス10Cは、カテーテルを用いて生体内の患部等の対象部位の近傍まで挿入されるので、腫瘍等の患部に直接、光照射したり、診断、センシング等の対象部位を検査、確認等したりすることができる。図1は、第1実施形態の光照射デバイス10Cの構成の一例を示す模式的斜視図である。図2Aは、光照射デバイス10Cの構成の第1例を示す模式的断面図である。図2Bは、光照射デバイス10Cの構成の第2例を示す模式的断面図である。図2A及び図2Bは、長手方向Pを有する長尺状の光照射デバイス10Cの、長手方向Pに沿った中心軸C0を含む断面を示している。図3Aは、図1及び図2Aに示す光照射デバイス10Cが備えるマーカー部材20Aを第1方向Q1から視た図である。図3Bは、図1及び図2Aに示す光照射デバイス10Cが備えるマーカー部材20Aを第2方向Q2から視た図である。
First Embodiment
The configuration of the light irradiation device of the first embodiment will be described with reference to Figs. 1, 2A, 2B, 3A, and 3B. The light irradiation device 10C is, for example, inserted into a catheter and introduced into a living body. The light irradiation device 10C is inserted into the vicinity of a target site such as an affected part in a living body using a catheter, so that it is possible to directly irradiate light onto an affected part such as a tumor, or to inspect or confirm a target site for diagnosis, sensing, or the like. Fig. 1 is a schematic perspective view showing an example of the configuration of the light irradiation device 10C of the first embodiment. Fig. 2A is a schematic cross-sectional view showing a first example of the configuration of the light irradiation device 10C. Fig. 2B is a schematic cross-sectional view showing a second example of the configuration of the light irradiation device 10C. Figs. 2A and 2B show a cross section including a central axis C0 along the longitudinal direction P of the elongated light irradiation device 10C having the longitudinal direction P. Fig. 3A is a view of the marker member 20A provided in the light irradiation device 10C shown in Figs. 1 and 2A as viewed from a first direction Q1. FIG. 3B is a diagram of the marker member 20A included in the light irradiation device 10C shown in FIGS. 1 and 2A, viewed from the second direction Q2.

 中心軸C0は、長手方向Pに平行な軸に直交する光照射デバイス10Cの断面の中心を通り、長手方向Pに平行な軸である。ここで、中心とは、光照射デバイス10Cを+Z方向から視たときの外接円の中心のことをいうものとする。図2Aに示す例では、光照射デバイス10Cは、筐体30Aとマーカー部材20Aが結合された、長手方向Pを長手とする略直方体の外形形状を有する。図2Aに示す例では、長手方向Pに平行な軸に直交する光照射デバイス10Cの断面形状は、略矩形である。図2Aに示す例では、長手方向Pに平行な軸に直交する光照射デバイス10Cの断面の中心は、長手方向Pに平行な軸に直交する上記直方体の断面の中心に該当する。但し、長手方向Pに平行な軸に直交する光照射デバイス10Cの断面形状は、略矩形に限定されるものではなく、任意の形状であってよい。長手方向Pに平行な軸に直交する光照射デバイス10Cの断面の中心は、長手方向Pに平行な軸に直交する任意の形状の略中心であってよい。 The central axis C0 is an axis parallel to the longitudinal direction P, passing through the center of the cross section of the light irradiation device 10C perpendicular to the axis parallel to the longitudinal direction P. Here, the center refers to the center of the circumscribed circle when the light irradiation device 10C is viewed from the +Z direction. In the example shown in FIG. 2A, the light irradiation device 10C has an outer shape of an approximately rectangular parallelepiped with the longitudinal direction P as the long direction, in which the housing 30A and the marker member 20A are joined. In the example shown in FIG. 2A, the cross section of the light irradiation device 10C perpendicular to the axis parallel to the longitudinal direction P is approximately rectangular. In the example shown in FIG. 2A, the center of the cross section of the light irradiation device 10C perpendicular to the axis parallel to the longitudinal direction P corresponds to the center of the cross section of the rectangular parallelepiped perpendicular to the axis parallel to the longitudinal direction P. However, the cross section of the light irradiation device 10C perpendicular to the axis parallel to the longitudinal direction P is not limited to being approximately rectangular, and may be any shape. The center of the cross section of the light irradiation device 10C perpendicular to an axis parallel to the longitudinal direction P may be approximately the center of any shape perpendicular to an axis parallel to the longitudinal direction P.

 図1及び図2Aに示すように、光照射デバイス10Cは、光出射部60と、光出射部60と直接的または間接的に接続され、放射線不透過性を有するマーカー部材20Aと、を備える。図3A及び図3Bに示すように、長手方向Pと直交する方向における第1方向Q1から視たマーカー部材20Aは、長手方向Pと直交する方向における、第1方向Q1とは異なる第2方向Q2から視たマーカー部材20Aに対し、形状及び位置の少なくとも一方が異なる。光照射デバイス10Cは、発光素子11から出射された光を長手方向Pに対して交差する予め定められた方向Rに照射可能である。 As shown in Figs. 1 and 2A, the light irradiation device 10C includes a light emitting section 60 and a marker member 20A that is directly or indirectly connected to the light emitting section 60 and has radiopaque properties. As shown in Figs. 3A and 3B, the marker member 20A viewed from a first direction Q1 perpendicular to the longitudinal direction P differs in at least one of the shape and position from the marker member 20A viewed from a second direction Q2 perpendicular to the longitudinal direction P, which is different from the first direction Q1. The light irradiation device 10C is capable of irradiating light emitted from the light emitting element 11 in a predetermined direction R that intersects with the longitudinal direction P.

 例えば、医療用に用いられる光照射デバイスでは、生体内の狙った部分に光を照射すること等を目的として、光照射デバイスが生体内に配置された状態において、光照射デバイスからの光の照射方向を把握することが求められる場合がある。光照射デバイス10Cは、X線等の放射線に対して不透過性を有し、第1方向Q1から視たときと第2方向Q2から視たときとで形状及び位置の少なくとも一方が異なるマーカー部材20Aを有する。また光照射デバイス10Cにおけるマーカー部材20A以外の部材は、放射線に対して透過性を有する。従って、光照射デバイス10Cが内部に配置された生体をX線CT(Computed Tomography)等で撮影すると、マーカー部材20Aの像が撮影画像で確認できる。X線CTによる撮影画像に映るマーカー部材20Aの像の形状及び位置の少なくとも一方を確認することにより、生体内に配置されたマーカー部材20Aの向きを確認できる。マーカー部材20Aの向きは長手方向Pに対して既知であるとともに、光照射デバイス10Cは、発光素子11から出射された光を長手方向Pに対して交差する予め定められた方向Rに照射可能である。従って、本実施形態では、光照射デバイス10Cを用いることにより、X線CTの撮影画像に基づき確認されたマーカー部材20Aの向きから、光照射デバイス10Cからの光の照射方向を把握できる。別の観点では、光照射デバイス10Cは、マーカー部材20Aを有することで、光照射デバイス10Cからの光の照射方向を、X線CT等を介して標示できる。本実施形態では、光の照射方向を標示可能な光照射デバイス10Cを提供することができる。 For example, in a light irradiation device used for medical purposes, it may be necessary to grasp the direction of light irradiation from the light irradiation device when the light irradiation device is placed in a living body, in order to irradiate light to a targeted part in the living body. The light irradiation device 10C has a marker member 20A that is opaque to radiation such as X-rays and has at least one of a shape and a position different when viewed from a first direction Q1 and a second direction Q2. In addition, the members of the light irradiation device 10C other than the marker member 20A are transparent to radiation. Therefore, when a living body in which the light irradiation device 10C is placed is photographed with an X-ray CT (Computed Tomography) or the like, the image of the marker member 20A can be confirmed in the photographed image. By confirming at least one of the shape and the position of the image of the marker member 20A reflected in the photographed image by the X-ray CT, the orientation of the marker member 20A placed in the living body can be confirmed. The orientation of the marker member 20A is known with respect to the longitudinal direction P, and the light irradiation device 10C can irradiate the light emitted from the light emitting element 11 in a predetermined direction R that intersects with the longitudinal direction P. Therefore, in this embodiment, by using the light irradiation device 10C, the irradiation direction of light from the light irradiation device 10C can be grasped from the orientation of the marker member 20A confirmed based on the X-ray CT image. From another perspective, the light irradiation device 10C has the marker member 20A, and can indicate the irradiation direction of light from the light irradiation device 10C via X-ray CT or the like. In this embodiment, a light irradiation device 10C capable of indicating the irradiation direction of light can be provided.

 ここで「形状及び位置の少なくとも一方が異なる」とは、目視において異なっていればよく、放射線での撮影画像において異なることを要しない。放射線での撮影画像において、図1及び図2Aに示すマーカー部材20Aは、上方(例えば+Y側)から視たときと下方(例えば-Y側)から視たときとでは、形状及び位置とも同じになる。したがって、この画像のみでは光照射デバイス10Cによる光の照射方向は把握できない。しかしながら、マーカー部材の20Aの形状は、目視において形状及び位置の少なくとも一方が異なっているため、視る向きを少し変化させれば、放射線での撮影画像においても変化が生じるため、上方であるか下方であるかを把握することができる。 Here, "at least one of the shape and position is different" means that it is different when viewed with the naked eye, and does not have to be different in the radiographic image. In the radiographic image, the marker member 20A shown in Figures 1 and 2A has the same shape and position when viewed from above (e.g., the +Y side) and when viewed from below (e.g., the -Y side). Therefore, the direction of light irradiation by the light irradiation device 10C cannot be determined from this image alone. However, because the shape of the marker member 20A differs in at least one of the shape and position when viewed with the naked eye, a slight change in the viewing direction will also cause a change in the radiographic image, making it possible to determine whether it is above or below.

 図3A及び図3Bに示すマーカー部材20Aは、長尺な基部21と、基部21の表面に設けられた凸部22と、を有する。これにより、第1方向Q1と第2方向Q2とで形状が異なるマーカー部材20Aを提供することができる。マーカー部材20Aは、放射線に対して不透過性を有する白金等の金属材料を含んで構成可能である。 The marker member 20A shown in Figures 3A and 3B has a long base 21 and a protrusion 22 provided on the surface of the base 21. This makes it possible to provide a marker member 20A that has a different shape in the first direction Q1 and the second direction Q2. The marker member 20A can be made of a metal material such as platinum that is opaque to radiation.

 マーカー部材20Aは、凸部22に限られず、基部21の表面に凸部及び凹部の少なくとも一方が設けられてもよい。さらに、マーカー部材20Aは、基部21と凸部及び凹部の少なくとも一方とを有するものに限られず、第1方向Q1と第2方向Q2とで形状及び位置の少なくとも一方が異なるものであれば、様々な形状のものを使用できる。マーカー部材20Aの一以上の部分が他の部分と離隔して配置されてもよい。 The marker member 20A is not limited to the convex portion 22, and at least one of a convex portion and a concave portion may be provided on the surface of the base portion 21. Furthermore, the marker member 20A is not limited to having the base portion 21 and at least one of a convex portion and a concave portion, and various shapes can be used as long as at least one of the shape and position differs between the first direction Q1 and the second direction Q2. One or more parts of the marker member 20A may be arranged separately from the other parts.

 図1及び図2Aに示す例では、光出射部60は、発光素子11と、発光素子11を支持する支持体12と、を有する。支持体12は、マーカー部材20Aの基部21の上面(例えば+Y側の面)に配置されている。発光素子11は、支持体12の上面に配置されている。発光素子11は、長手方向Pと交差する光出射面111から長手方向Pに沿う方向に光を出射できる。図1に示す例では、発光素子11は+Z方向に光を出射する。光照射デバイス10Cは、光出射部60が発光素子11と支持体12とを有することで、支持体12を発光素子11の熱を放熱する放熱部材として利用することができる。 1 and 2A, the light emitting unit 60 has a light emitting element 11 and a support 12 that supports the light emitting element 11. The support 12 is disposed on the upper surface (e.g., the surface on the +Y side) of the base 21 of the marker member 20A. The light emitting element 11 is disposed on the upper surface of the support 12. The light emitting element 11 can emit light in a direction along the longitudinal direction P from a light emitting surface 111 that intersects with the longitudinal direction P. In the example shown in FIG. 1, the light emitting element 11 emits light in the +Z direction. In the light irradiation device 10C, the light emitting unit 60 has the light emitting element 11 and the support 12, and therefore the support 12 can be used as a heat dissipation member that dissipates heat from the light emitting element 11.

 また、図1及び図2Aに示す例では、光照射デバイス10Cは、発光素子11から長手方向Pに沿う方向に出射された光を、長手方向Pに交差する方向Rに向ける光学部品40を有する。図1及び図2Aに示す例では、光学部品40は、支持体12の上面に配置され、支持体12の上面に交差する反射面41を含むプリズムである。光学部品40は、発光素子11から出射された光を反射面41で反射することで方向Rに向ける。なお、光学部品40は、プリズムに限られず、光を所定の方向に向けることが可能であれば、ミラー、レンズ又は回折光学素子等であってもよい。光学部品40は、樹脂材料、ガラス材料又は金属材料等を含んで構成可能である。図2Bに示すように、光学部品40は、支持体12と一体的に形成されていてもよい。 1 and 2A, the light irradiation device 10C has an optical component 40 that directs the light emitted from the light emitting element 11 in the longitudinal direction P in a direction R intersecting the longitudinal direction P. In the example shown in FIG. 1 and 2A, the optical component 40 is a prism that is disposed on the upper surface of the support 12 and includes a reflecting surface 41 that intersects with the upper surface of the support 12. The optical component 40 directs the light emitted from the light emitting element 11 in the direction R by reflecting it on the reflecting surface 41. Note that the optical component 40 is not limited to a prism, and may be a mirror, a lens, a diffractive optical element, or the like, as long as it is capable of directing light in a predetermined direction. The optical component 40 may be configured to include a resin material, a glass material, a metal material, or the like. As shown in FIG. 2B, the optical component 40 may be formed integrally with the support 12.

 図2Aに示す例では、発光素子11の表面全体は、絶縁層16で被覆されている。これにより、支持体12を介してマーカー部材20Aと発光素子11が短絡することで発光素子11が破損することを防止できる。なお、光照射デバイス10Cでは、発光素子11の表面全体に限られず、発光素子11及び支持体12の少なくとも一方が絶縁層で被覆されてもよい。発光素子11及び支持体12の少なくとも一方が絶縁層で被覆されることで、マーカー部材20Aと発光素子11が短絡することによる発光素子11の破損を防止できる。 In the example shown in FIG. 2A, the entire surface of the light-emitting element 11 is covered with an insulating layer 16. This can prevent the light-emitting element 11 from being damaged by a short circuit between the marker member 20A and the light-emitting element 11 via the support 12. Note that in the light irradiation device 10C, at least one of the light-emitting element 11 and the support 12 may be covered with an insulating layer, not limited to the entire surface of the light-emitting element 11. By covering at least one of the light-emitting element 11 and the support 12 with an insulating layer, it is possible to prevent damage to the light-emitting element 11 due to a short circuit between the marker member 20A and the light-emitting element 11.

 図1及び図2Aに示す例では、光照射デバイス10Cは、発光素子11と電気的に接続される絶縁電線14を有し、絶縁電線14とマーカー部材20Aとは電気的に絶縁されている。上述したように、絶縁電線14は、第1絶縁電線14aと第2絶縁電線14bとを含んでいる。光照射デバイス10Cは、発光素子11と電気的に接続される絶縁電線14を有することで、マーカー部材20Aを介して短絡することによる発光素子11の破損を防止することができる。 In the example shown in Figures 1 and 2A, the light irradiation device 10C has an insulated wire 14 electrically connected to the light emitting element 11, and the insulated wire 14 and the marker member 20A are electrically insulated from each other. As described above, the insulated wire 14 includes a first insulated wire 14a and a second insulated wire 14b. By having the insulated wire 14 electrically connected to the light emitting element 11, the light irradiation device 10C can prevent damage to the light emitting element 11 due to a short circuit through the marker member 20A.

 図1及び図2Aに示す例では、光照射デバイス10Cは、開口31Aを含み、発光素子11の少なくとも一部及び支持体12の少なくとも一部のそれぞれを内側に配置可能な筐体30Aと、筐体30Aの開口31Aを封止する透光性部材32と、を有する。透光性部材32は、光出射部60から出射され、長手方向Pに対して交差する予め定められた方向Rに照射される光を透過する。この構成により、光照射デバイス10Cは、筐体30Aの内側に配置された発光素子11から透光性部材32を通して光を照射できる。また、開口31Aを透光性部材32で封止することで、筐体30Aの内部が外部に露出することを低減できる。筐体30Aは、発光素子11から出射される光のピーク波長に対して遮光性又は吸収性を有する樹脂材料又は金属材料等を含んで構成可能である。透光性部材32は、発光素子11から出射される光のピーク波長に対して透光性を有する樹脂材料又はガラス材料等を含んで構成可能である。 1 and 2A, the light irradiation device 10C has a housing 30A including an opening 31A, in which at least a part of the light emitting element 11 and at least a part of the support 12 can be arranged, and a light-transmitting member 32 that seals the opening 31A of the housing 30A. The light-transmitting member 32 transmits light emitted from the light emitting portion 60 and irradiated in a predetermined direction R that intersects with the longitudinal direction P. With this configuration, the light irradiation device 10C can irradiate light from the light emitting element 11 arranged inside the housing 30A through the light-transmitting member 32. In addition, by sealing the opening 31A with the light-transmitting member 32, it is possible to reduce exposure of the inside of the housing 30A to the outside. The housing 30A can be configured to include a resin material or a metal material that has light-shielding or absorbing properties for the peak wavelength of the light emitted from the light emitting element 11. The light-transmitting member 32 can be made of a resin material, glass material, or the like that is translucent to the peak wavelength of the light emitted from the light-emitting element 11.

 また、図1及び図2Aに示す例では、発光素子11は、筐体30Aの内側に配置され、筐体30Aの内側は気密封止されている。これにより、血液等の液体が存在する生体管腔内等に光照射デバイス10Cが配置されたときにも、筐体30Aの内部に液体が進入することを回避でき、液体による短絡で発光素子が破損することを防止することができる。 In the example shown in Fig. 1 and Fig. 2A, the light emitting element 11 is disposed inside the housing 30A, and the inside of the housing 30A is hermetically sealed. This makes it possible to prevent liquid from entering the inside of the housing 30A even when the light irradiation device 10C is disposed inside a biological lumen where liquid such as blood is present, and prevents the light emitting element from being damaged by a short circuit caused by the liquid.

 支持体12、発光素子11、光学部品40、絶縁電線14等の材料は、後述する第8実施形態から第10実施形態と同様の材料を用いることができ、実施形態2から実施形態7についても同様である。図2Bに示す例のように、支持体12と光学部品40を一体的に形成する場合は、同一の材料により一体的に形成されていてもよい。高い熱伝導率を有するという点から窒化アルミニウム(AlN)を主成分として含んでいてもよい。支持体12と光学部品40を一体的に形成する方法の例として、射出成形したり、セラミックスグリーンシートをプレス加工したりすることで形成することができる。 The materials of the support 12, light emitting element 11, optical component 40, insulated wire 14, etc. can be the same as those of the eighth to tenth embodiments described below, and the same applies to the second to seventh embodiments. When the support 12 and optical component 40 are integrally formed as in the example shown in FIG. 2B, they may be integrally formed from the same material. They may contain aluminum nitride (AlN) as a main component because of its high thermal conductivity. Examples of methods for integrally forming the support 12 and optical component 40 include injection molding or pressing a ceramic green sheet.

 (第2実施形態)
 図4A、図4B及び図5を参照して、第2実施形態の光照射デバイスの構成について説明する。図4Aは、第2実施形態の光照射デバイス10Dの構成の一例を示す模式的断面図である。図4Bは、光照射デバイス10Dの構成の一例を示す模式的下面図である。図5は、図4Aに示す状態から長手方向Pに平行な光照射デバイス10Dの中心軸C0を回転軸として光照射デバイス10Dを180度回転させた状態を示す模式的断面図である。なお、図4A及び図5は、長手方向Pを有する長尺状の光照射デバイス10Dの、長手方向Pに沿った中心軸C0を含む断面を示している。
Second Embodiment
The configuration of the light irradiating device of the second embodiment will be described with reference to Fig. 4A, Fig. 4B, and Fig. 5. Fig. 4A is a schematic cross-sectional view showing an example of the configuration of the light irradiating device 10D of the second embodiment. Fig. 4B is a schematic bottom view showing an example of the configuration of the light irradiating device 10D. Fig. 5 is a schematic cross-sectional view showing a state in which the light irradiating device 10D is rotated 180 degrees from the state shown in Fig. 4A around the central axis C0 of the light irradiating device 10D parallel to the longitudinal direction P as the rotation axis. Figs. 4A and 5 show a cross section including the central axis C0 along the longitudinal direction P of the elongated light irradiating device 10D having the longitudinal direction P.

 図4A、図4B及び図5に示すように、光照射デバイス10Dは、発光素子11と、発光素子11が固定される支持体12と、放射線不透過性を有するマーカー部20Dと、を備える。長手方向Pと直交する方向における第1方向Q1から視たマーカー部20Dは、長手方向Pと直交する方向における、第1方向Q1とは異なる第2方向Q2から視たマーカー部20Dに対し、形状及び位置の少なくとも一方が異なる。マーカー部20Dは、支持体12に設けられる。光照射デバイス10Dは、発光素子11から出射された光を長手方向に対して交差する予め定められた方向Rに照射可能である。本実施形態では、発光素子11は光出射部60の一例である。図4Aでは、発光素子11と光出射部60が同じであることを示す目的で、発光素子11と光出射部60の符号を併記している。以降に示す図においても、同様の目的で符号を併記する場合がある。 As shown in Figs. 4A, 4B and 5, the light irradiation device 10D includes a light emitting element 11, a support 12 to which the light emitting element 11 is fixed, and a radiopaque marker section 20D. The marker section 20D viewed from a first direction Q1 perpendicular to the longitudinal direction P differs in at least one of shape and position from the marker section 20D viewed from a second direction Q2 perpendicular to the longitudinal direction P, which is different from the first direction Q1. The marker section 20D is provided on the support 12. The light irradiation device 10D can irradiate light emitted from the light emitting element 11 in a predetermined direction R intersecting the longitudinal direction. In this embodiment, the light emitting element 11 is an example of a light emitting section 60. In Fig. 4A, the light emitting element 11 and the light emitting section 60 are labeled with the same reference numerals in order to indicate that the light emitting element 11 and the light emitting section 60 are the same. In the following figures, the reference numerals may be labeled with the same reference numerals in the same manner.

 本実施形態では、マーカー部20Dを有することで、上述した第1実施形態と同様に、光照射デバイス10Dからの光の照射方向を、X線CT等を介して標示でき、光の照射方向を標示可能な光照射デバイス10Cを提供することができる。また、本実施形態では、マーカー部20Dは支持体12に設けられるため、マーカー部として機能する部材を支持体12以外に設ける場合と比較して、光照射デバイスの構成を簡略化することができる。なお、マーカー部20Dは支持体12に固定されており、支持体12と一体に動くことができる。本実施形態においても「形状及び位置の少なくとも一方が異なる」とは、目視において異なっていればよく、放射線での撮影画像において異なることを要しない。放射線での撮影画像において、図4A、図4B及び図5に示すマーカー部20Dは、上方(例えば+Y側)から視たときと下方(例えば-Y側)から視たときとでは、形状及び位置とも同じになる。したがって、この画像のみでは光照射デバイス10Dによる光の照射方向は把握できない。しかしながら、マーカー部20Dの形状は、目視において形状及び位置の少なくとも一方が異なっているため、視る向きを少し変化させれば、放射線での撮影画像においても変化が生じるため、上方であるか下方であるかを把握することができる。 In this embodiment, by having the marker part 20D, the light irradiation direction from the light irradiation device 10D can be indicated via X-ray CT or the like, as in the first embodiment described above, and a light irradiation device 10C capable of indicating the light irradiation direction can be provided. In addition, in this embodiment, since the marker part 20D is provided on the support 12, the configuration of the light irradiation device can be simplified compared to the case where a member functioning as a marker part is provided outside the support 12. Note that the marker part 20D is fixed to the support 12 and can move integrally with the support 12. In this embodiment, "at least one of the shape and the position is different" only needs to be different to the naked eye, and does not need to be different in the radiographic image. In the radiographic image, the marker part 20D shown in FIG. 4A, FIG. 4B, and FIG. 5 has the same shape and position when viewed from above (e.g., the +Y side) and when viewed from below (e.g., the -Y side). Therefore, the light irradiation direction by the light irradiation device 10D cannot be grasped from this image alone. However, the shape of the marker part 20D differs visually in at least one of the shape and position, so if you change the viewing direction slightly, the radiographic image also changes, making it possible to tell whether it is above or below.

 図4A、図4B及び図5に示す例では、支持体12は、発光素子11が配置される第1面12aと、第1面12aとは反対側に位置する第2面12bと、を含む。マーカー部20Dは、支持体12の第2面12bに設けられる。この構成により、光照射デバイス10Dでは、支持体12において、発光素子11が配置される第1面12aとは反対側の第2面12bにマーカー部20Dを設けることで、支持体12上の領域を有効活用することができる。第1面12aのマーカー部20Dは、第1面12aに平行もしくは垂直な方向から見た場合に異方性を有し、第2面12bのマーカー部20Dは、第1面12aとは異なる方向に対し異方性を有してもよい。なお、マーカー部20Dの異方性とは、マーカー部20Dの形状及び位置の少なくとも一方が異なる性質をいう。 In the example shown in FIG. 4A, FIG. 4B, and FIG. 5, the support 12 includes a first surface 12a on which the light emitting element 11 is arranged, and a second surface 12b located on the opposite side to the first surface 12a. The marker portion 20D is provided on the second surface 12b of the support 12. With this configuration, in the light irradiation device 10D, the marker portion 20D is provided on the second surface 12b of the support 12, which is opposite to the first surface 12a on which the light emitting element 11 is arranged, so that the area on the support 12 can be effectively utilized. The marker portion 20D on the first surface 12a has anisotropy when viewed from a direction parallel or perpendicular to the first surface 12a, and the marker portion 20D on the second surface 12b may have anisotropy in a direction different from the first surface 12a. The anisotropy of the marker portion 20D refers to a property in which at least one of the shape and the position of the marker portion 20D is different.

 また、光照射デバイス10Dでは、マーカー部20Dは、金属材料を含んで構成され、マーカー部20Dの少なくとも一部の厚みが、20μm以上100μm以下である。図4A、図4B及び図5に示す例では、マーカー部20Dは、厚みt1の板状部材である。厚みt1は20μm以上100μm以下である。マーカー部20Dの少なくとも一部の厚みを40μm以上とすることで放射線での撮影画像において視認性を向上させることができるため、好ましい。また、100μm以下にすることにより、小型にすることができる。 Furthermore, in the light irradiation device 10D, the marker portion 20D is made of a metal material, and at least a portion of the marker portion 20D has a thickness of 20 μm or more and 100 μm or less. In the example shown in FIG. 4A, FIG. 4B, and FIG. 5, the marker portion 20D is a plate-shaped member with a thickness t1. The thickness t1 is 20 μm or more and 100 μm or less. Making the thickness of at least a portion of the marker portion 20D 40 μm or more is preferable because it improves visibility in radiographic images. Furthermore, making the thickness 100 μm or less allows for a compact size.

 マーカー部20Dを構成する金属材料には、白金等を使用できる。マーカー部20Dは、支持体12の第2面12bに白金をメッキ加工すること等によって設けられる。但し、マーカー部20Dは、支持体12等の他の部材の一部に設けられた部分に限られない。マーカー部20Dは、支持体12等の他の部材に接着部材等によって接合される、他の部材に対して独立した部材であってもよい。 The metal material constituting the marker portion 20D may be platinum or the like. The marker portion 20D is provided by, for example, plating platinum on the second surface 12b of the support body 12. However, the marker portion 20D is not limited to being provided on a part of another member such as the support body 12. The marker portion 20D may be an independent member that is joined to another member such as the support body 12 by an adhesive or the like.

 光照射デバイス10Dでは、第1面12aと平行な方向である第3方向Q3から視たときのマーカー部20Dの位置は、長手方向Pに平行な光照射デバイス10Dの中心軸C0を回転軸として、光照射デバイス10Dを180度回転させて第3方向Q3から視たときのマーカー部20Dの位置に対し、支持体12における第1面12aと第2面12bとの間の距離t2の2倍以上異なる。図4Aに示す第1位置20vは、第1面12aと平行な方向である第3方向Q3から視たときのマーカー部20Dの位置を表している。一方、図5に示す第2位置20uは、長手方向Pに平行な光照射デバイス10Dの中心軸C0を回転軸として、光照射デバイス10Dを180度回転させて第3方向Q3から視たときのマーカー部20Dの位置を表している。図4Aに示した第2位置20uは、第1位置20vと対比するために、図5に示す状態での第2位置20uを仮想的に表したものである。第1位置20vと第2位置20uとの間の距離dは、距離t2の2倍以上である。この構成により、視る方向に応じたマーカー部20Dの位置の違いが分かり易くなる。視る方向に応じたマーカー部20Dの位置の違いが分かり易くなることで、本実施形態では、マーカー部20Dを用いて、光照射デバイス10Dから照射される光の方向を、X線CT等を介して分かり易く標示することができる。 In the light irradiation device 10D, the position of the marker part 20D when viewed from the third direction Q3, which is a direction parallel to the first surface 12a, differs from the position of the marker part 20D when viewed from the third direction Q3 by rotating the light irradiation device 10D 180 degrees around the central axis C0 of the light irradiation device 10D parallel to the longitudinal direction P as the axis of rotation by more than twice the distance t2 between the first surface 12a and the second surface 12b in the support 12. The first position 20v shown in FIG. 4A represents the position of the marker part 20D when viewed from the third direction Q3, which is a direction parallel to the first surface 12a. On the other hand, the second position 20u shown in FIG. 5 represents the position of the marker part 20D when viewed from the third direction Q3 by rotating the light irradiation device 10D 180 degrees around the central axis C0 of the light irradiation device 10D parallel to the longitudinal direction P as the axis of rotation. The second position 20u shown in FIG. 4A is a virtual representation of the second position 20u in the state shown in FIG. 5, in order to compare it with the first position 20v. The distance d between the first position 20v and the second position 20u is at least twice the distance t2. This configuration makes it easier to see the difference in the position of the marker unit 20D depending on the viewing direction. By making it easier to see the difference in the position of the marker unit 20D depending on the viewing direction, in this embodiment, the marker unit 20D can be used to clearly indicate the direction of light emitted from the light irradiation device 10D via X-ray CT or the like.

 光照射デバイス10Dでは、光出射部は発光素子11である。発光素子11は支持体12に配置されている。この構成により、光照射デバイス10Dは、光源を備えることができるため、光照射デバイス10Dの位置制御等を容易に行うことができる。 In the light irradiation device 10D, the light emitting portion is a light emitting element 11. The light emitting element 11 is disposed on a support 12. With this configuration, the light irradiation device 10D can be provided with a light source, and therefore the position control of the light irradiation device 10D can be easily performed.

 図4A、図4B及び図5に示す例では、光照射デバイス10Dの光学部品40は、支持体12に載置されている。 In the examples shown in Figures 4A, 4B, and 5, the optical component 40 of the light irradiation device 10D is placed on the support 12.

 (第3実施形態)
 図6を参照して、第3実施形態の光照射デバイスの構成について説明する。図6は、第3実施形態の光照射デバイス10Eの構成の一例を示す模式的断面図である。図6は、長手方向Pを有する長尺状の光照射デバイス10Eの、長手方向Pに沿った中心軸C0を含む断面を示している。
Third Embodiment
The configuration of the light irradiating device of the third embodiment will be described with reference to Fig. 6. Fig. 6 is a schematic cross-sectional view showing an example of the configuration of the light irradiating device 10E of the third embodiment. Fig. 6 shows a cross section including a central axis C0 along the longitudinal direction P of the elongated light irradiating device 10E having the longitudinal direction P.

 光照射デバイス10Eでは、マーカー部20Dは、第1面12a及び第2面12bの双方に設けられる。第1面12aに設けられたマーカー部20Dは、第2面12bに設けられたマーカー部20Dと、マーカー部20Dの大きさ及び位置の少なくとも一方が異なる。この構成により、視る方向に応じたマーカー部20Dの位置の違いが分かり易くなるため、光照射デバイス10Eから照射される光の方向を、X線CT等を介して分かり易く標示することができる。 In the light irradiation device 10E, the marker section 20D is provided on both the first surface 12a and the second surface 12b. The marker section 20D provided on the first surface 12a differs from the marker section 20D provided on the second surface 12b in at least one of the size and the position of the marker section 20D. This configuration makes it easy to see the difference in the position of the marker section 20D depending on the viewing direction, so that the direction of the light irradiated from the light irradiation device 10E can be clearly indicated via X-ray CT or the like.

 図6に示す例では、マーカー部20Dは、第1マーカー部20Daと第2マーカー部20Dbとを含む。第1マーカー部20Daは、長手方向Pに沿う方向に発光素子11と並んで第1面12aに設けられている。第2マーカー部20Dbは、第2面12bに設けられている。第1マーカー部20Daは、第2マーカー部20Dbに対して長手方向Pにずれた位置に設けられている。また、第1マーカー部20Daは、第2マーカー部20Dbに対して小さい。換言すると、第1マーカー部20Daは、第2マーカー部20Dbとマーカー部20Dの大きさ及び位置のそれぞれが異なっている。本実施形態においても「形状及び位置の少なくとも一方が異なる」とは、目視において異なっていればよく、放射線での撮影画像において異なることを要しない。放射線での撮影画像において、図6に示すマーカー部20Dは、上方(例えば+Y側)から視たときと下方(例えば-Y側)から視たときとでは、形状及び位置とも同じになる。したがって、この画像のみでは光照射デバイス10Eによる光の照射方向は把握できない。しかしながら、マーカー部20Dの形状は、目視において形状及び位置の少なくとも一方が異なっているため、視る向きを少し変化させれば、放射線での撮影画像においても変化が生じるため、上方であるか下方であるかを把握することができる。なお、目視においては異なるが、放射線での撮影画像において異ならない2方向が存在することは、後述する第4実施形態から第7実施形態でも同様であるため、第4実施形態から第7実施形態においてはこの旨の説明を省略する。 In the example shown in FIG. 6, the marker portion 20D includes a first marker portion 20Da and a second marker portion 20Db. The first marker portion 20Da is provided on the first surface 12a alongside the light-emitting element 11 in the direction along the longitudinal direction P. The second marker portion 20Db is provided on the second surface 12b. The first marker portion 20Da is provided at a position shifted in the longitudinal direction P from the second marker portion 20Db. The first marker portion 20Da is smaller than the second marker portion 20Db. In other words, the first marker portion 20Da differs from the second marker portion 20Db in both size and position. In this embodiment, "at least one of the shape and position is different" means that the marker portions are different to the naked eye, and do not need to be different in a radiological image. In the radiographic image, the marker unit 20D shown in FIG. 6 has the same shape and position when viewed from above (e.g., the +Y side) and from below (e.g., the -Y side). Therefore, the direction of light irradiation by the light irradiation device 10E cannot be determined from this image alone. However, since the shape of the marker unit 20D differs visually in at least one of the shape and position, a slight change in the viewing direction also causes a change in the radiographic image, making it possible to determine whether it is above or below. Note that there are two directions that are different to the naked eye but are not different in the radiographic image, as in the fourth to seventh embodiments described below, and therefore a description of this will be omitted in the fourth to seventh embodiments.

 (第4実施形態)
 図7を参照して、第4実施形態の光照射デバイスの構成について説明する。図7は、第4実施形態の光照射デバイス10Fの構成の一例を示す模式的断面図である。図7は、長手方向Pを有する長尺状の光照射デバイス10Fの、長手方向Pに沿った中心軸C0を含む断面を示している。
Fourth Embodiment
The configuration of the light irradiating device of the fourth embodiment will be described with reference to Fig. 7. Fig. 7 is a schematic cross-sectional view showing an example of the configuration of the light irradiating device 10F of the fourth embodiment. Fig. 7 shows a cross section including a central axis C0 along the longitudinal direction P of the elongated light irradiating device 10F having the longitudinal direction P.

 光照射デバイス10Fでは、光出射部はファイバ18である。ファイバ18は支持体12に配置されている。この構成により、光照射デバイス10Fは、遠隔に配置された光源から光を導光できるため、光源を光照射デバイスの内部に備えなくてよい。光照射デバイス10Fでは、光源を備えないことにより、光照射デバイス10Fの、光出射部60の構成を簡略化することができる。 In the light irradiation device 10F, the light output section is a fiber 18. The fiber 18 is disposed on the support 12. With this configuration, the light irradiation device 10F can guide light from a light source disposed remotely, so there is no need to provide a light source inside the light irradiation device. By not providing a light source in the light irradiation device 10F, the configuration of the light output section 60 of the light irradiation device 10F can be simplified.

 (第5実施形態)
 図8A及び図8Bを参照して、第5実施形態の光照射デバイスの構成について説明する。図8Aは、第5実施形態の光照射デバイス10Gの構成の一例を示す模式的断面図である。図8Aは、長手方向Pを有する長尺状の光照射デバイス10Gの、長手方向Pに沿った中心軸C0を含む断面を示している。図8Bは、光照射デバイス10Gの構成の一例を示す模式的下面図である。
Fifth Embodiment
The configuration of the light irradiating device of the fifth embodiment will be described with reference to Fig. 8A and Fig. 8B. Fig. 8A is a schematic cross-sectional view showing an example of the configuration of the light irradiating device 10G of the fifth embodiment. Fig. 8A shows a cross-section including a central axis C0 along the longitudinal direction P of the elongated light irradiating device 10G having the longitudinal direction P. Fig. 8B is a schematic bottom view showing an example of the configuration of the light irradiating device 10G.

 図8Bに示すように、光照射デバイス10Gでは、支持体12の第2面12bは、第1領域12b1と、第1領域12b1とは異なる第2領域12b2と、を含む。第1領域12b1には、マーカー部20Dが設けられ、第2領域12b2には、絶縁電線14が配置される。図8A及び図8Bに示す例では、第2領域12b2には、第2絶縁電線14bが配置されている。 As shown in FIG. 8B, in the light irradiation device 10G, the second surface 12b of the support 12 includes a first region 12b1 and a second region 12b2 different from the first region 12b1. A marker portion 20D is provided in the first region 12b1, and an insulated wire 14 is arranged in the second region 12b2. In the example shown in FIG. 8A and FIG. 8B, a second insulated wire 14b is arranged in the second region 12b2.

 光照射デバイス10Gでは、支持体12の第2面12bにマーカー部20Dを設けるとともに絶縁電線14を配置することで、第2面12bに設けられたマーカー部20Dの上に絶縁電線14を配置する場合と比較して、光照射デバイス10Gの厚みを薄くすることができる。 In the light irradiation device 10G, by providing a marker portion 20D on the second surface 12b of the support 12 and arranging an insulated electric wire 14, the thickness of the light irradiation device 10G can be made thinner than when the insulated electric wire 14 is arranged on the marker portion 20D provided on the second surface 12b.

 (第6実施形態)
 図9を参照して、第6実施形態の光照射デバイスの構成について説明する。図9は、第6実施形態の光照射デバイス10Hの構成の一例を示す模式的断面図である。図9は、長手方向Pを有する長尺状の光照射デバイス10Hの、長手方向Pに沿った中心軸C0を含む断面を示している。
Sixth Embodiment
The configuration of the light irradiating device of the sixth embodiment will be described with reference to Fig. 9. Fig. 9 is a schematic cross-sectional view showing an example of the configuration of the light irradiating device 10H of the sixth embodiment. Fig. 9 shows a cross section including a central axis C0 along the longitudinal direction P of the elongated light irradiating device 10H having the longitudinal direction P.

 光照射デバイス10Hは、光出射部60から出射された光に対し、反射、屈折及び回折の少なくとも1つの光学作用を付与する光学部品40を有し、マーカー部20Dは、光学部品40に設けられる点が上述した実施形態と主に異なる。 The light irradiation device 10H mainly differs from the above-described embodiment in that it has an optical component 40 that imparts at least one of the optical effects of reflection, refraction, and diffraction to the light emitted from the light emitting section 60, and the marker section 20D is provided on the optical component 40.

 光照射デバイス10Hでは、光出射部60は、長手方向Pに沿う方向に光を出射し、光学部品40は、光出射部60からの光を長手方向Pと交差する方向に反射する反射面41を含む。マーカー部20Dは、光学部品40における反射面41が設けられた領域以外の領域に設けられる。図9に示す例では、光学部品40は、支持体12の上面に配置されている。光学部品40は、反射面41と、反射面41の反対側に位置する面42と、を有するプリズムである。マーカー部20Dは、光学部品40の面42に設けられている。光照射デバイス10Hでは、光学部品40にマーカー部20Dを設けることで、光照射デバイスの構成を簡略化することができる。但し、マーカー部20Dは、光学部品40における面42と交差する側面、例えば、光学部品40の+X側の面及び-X側の面の少なくとも一方に設けられてもよい。 In the light irradiation device 10H, the light emitting section 60 emits light in a direction along the longitudinal direction P, and the optical component 40 includes a reflecting surface 41 that reflects the light from the light emitting section 60 in a direction intersecting the longitudinal direction P. The marker section 20D is provided in an area of the optical component 40 other than the area where the reflecting surface 41 is provided. In the example shown in FIG. 9, the optical component 40 is disposed on the upper surface of the support 12. The optical component 40 is a prism having a reflecting surface 41 and a surface 42 located on the opposite side of the reflecting surface 41. The marker section 20D is provided on the surface 42 of the optical component 40. In the light irradiation device 10H, the configuration of the light irradiation device can be simplified by providing the marker section 20D on the optical component 40. However, the marker section 20D may be provided on at least one of the side surfaces intersecting the surface 42 of the optical component 40, for example, the surface on the +X side and the surface on the -X side of the optical component 40.

 (第7実施形態)
 図10を参照して、第7実施形態の光照射デバイスの構成について説明する。図10は、第7実施形態の光照射デバイス10Jの構成の一例を示す模式的斜視図である。
Seventh Embodiment
The configuration of a light irradiating device according to the seventh embodiment will be described with reference to Fig. 10. Fig. 10 is a schematic perspective view showing an example of the configuration of a light irradiating device 10J according to the seventh embodiment.

 光照射デバイス10Jは、マーカー部20Dに加え、支持体12および光学部品40以外の部分に第2のマーカー部20Jを備える。図10に示す例では、光照射デバイス10Jは、支持体12に設けられたマーカー部20Dと、光出射部60を挟んで光学部品40の反対側に配置された第2のマーカー部20Jを備えている。第2のマーカー部20Jは、絶縁電線14を内側に配置可能な筒状の部材である。但し、第2のマーカー部20Jの形状は、筒状に限定されず、任意の形状であってよい。 The light irradiation device 10J includes a marker portion 20D and a second marker portion 20J in a portion other than the support 12 and the optical component 40. In the example shown in FIG. 10, the light irradiation device 10J includes a marker portion 20D provided on the support 12 and a second marker portion 20J arranged on the opposite side of the optical component 40 across the light emission portion 60. The second marker portion 20J is a cylindrical member inside which the insulated electric wire 14 can be arranged. However, the shape of the second marker portion 20J is not limited to a cylindrical shape and may be any shape.

 光照射デバイス10Jでは、第2のマーカー部20Jを備えることで、マーカー部20Dのみを備える場合と比較して、X線CTの撮影画像に映るマーカー部を大きくすることができる。これにより、マーカー部の視認性を向上できるため、光照射デバイス10Jの位置を容易に確認可能な光照射デバイス10Jを提供することができる。一方、第2のマーカー部20Jを備えず、マーカー部20Dのみを備える場合には、マーカー部20Dで正確な位置と向きを確認することができる。これにより、光の照射方向を高精度に標示可能な光照射デバイス10Jを提供することができる。 By providing the second marker unit 20J, the light irradiation device 10J can make the marker unit that appears in the X-ray CT image larger than when only the marker unit 20D is provided. This improves the visibility of the marker unit, and it is possible to provide a light irradiation device 10J that allows the position of the light irradiation device 10J to be easily confirmed. On the other hand, when the second marker unit 20J is not provided and only the marker unit 20D is provided, the exact position and orientation can be confirmed with the marker unit 20D. This makes it possible to provide a light irradiation device 10J that can indicate the light irradiation direction with high accuracy.

 以下、第8実施形態から第10実施形態について説明する。第8実施形態から第10実施形態ではマーカー部材またはマーカー部を備えていない例について説明しているが、第8実施形態から第10実施形態で説明する光照射デバイスにおいて、第1実施形態から第7実施形態で説明したマーカー部材またはマーカー部を備えていてもよい。 The eighth to tenth embodiments will be described below. In the eighth to tenth embodiments, examples are described in which a marker member or marker portion is not provided, but the light irradiation device described in the eighth to tenth embodiments may be provided with the marker member or marker portion described in the first to seventh embodiments.

 (第8実施形態)
 図11は、第8実施形態の光照射デバイス10を用いた生体内光照射アセンブリ100の一例を示す図である。生体内光照射アセンブリ100は、カテーテル50と、カテーテル50に挿入される光照射デバイス10と、を含み、少なくとも使用時にカテーテル50内は冷媒51で満たされる。生体内光照射アセンブリ100は、治療、診断、センシング等に用いられる。光照射デバイス10は、たとえば、図中の白矢印の「挿入方向」で示される方向にカテーテル50に挿入されて、生体内に導入される。光照射デバイス10は発熱体であるため、カテーテル50内に冷媒51が供給され、発熱部分が冷却された状態で使用される。そのため、光照射デバイス10の先端側は、絶縁層16によって一体的に被覆されている。冷媒51は、たとえば生理食塩水、血液、リンパ液などであり、冷媒温度はたとえば10℃~36℃程度である。光照射デバイス10は、カテーテル50を用いて生体内の患部等の照射対象部位の近傍まで挿入されるので、光ファイバを介さずに、腫瘍等の患部に直接、光照射したり、診断、センシング等の対象部位を検査、確認等したりすることができる。
Eighth embodiment
FIG. 11 is a diagram showing an example of an in vivo light irradiation assembly 100 using the light irradiation device 10 of the eighth embodiment. The in vivo light irradiation assembly 100 includes a catheter 50 and a light irradiation device 10 inserted into the catheter 50, and the catheter 50 is filled with a refrigerant 51 at least during use. The in vivo light irradiation assembly 100 is used for treatment, diagnosis, sensing, and the like. The light irradiation device 10 is, for example, inserted into the catheter 50 in the direction indicated by the "insertion direction" of the white arrow in the figure, and introduced into a living body. Since the light irradiation device 10 is a heat generating body, the refrigerant 51 is supplied into the catheter 50, and the heat generating part is cooled when used. Therefore, the tip side of the light irradiation device 10 is integrally covered by an insulating layer 16. The refrigerant 51 is, for example, physiological saline, blood, lymph, etc., and the refrigerant temperature is, for example, about 10°C to 36°C. The light irradiation device 10 is inserted into the vicinity of the irradiation target site, such as an affected area, inside a living body using a catheter 50, so that it is possible to directly irradiate the affected area, such as a tumor, with light, and to inspect and confirm the target site for diagnosis, sensing, etc., without using an optical fiber.

 図12Aと図12Bは、図1に示した第8実施形態の光照射デバイス10の構成例を示す模式図である。図12Aの光照射デバイス10Aと、図12Bの光照射デバイス10Bのいずれも、発光素子と、発光素子を搭載する支持体と、発光素子に電気的に接続される絶縁電線と、を絶縁層で一体的に被覆しているが、絶縁層の被覆状態が異なる。図12A及び図12Bの座標系で、光軸方向をZ方向、支持体上への発光素子の搭載方向をY方向、Z方向とY方向に直交する方向をX方向とする。図12Aの光照射デバイス10Aは、所定の波長の光を出射する発光素子11と、発光素子11から出射される光が入射する光学部品17と、発光素子11及び光学部品17を搭載する支持体12と、発光素子11と電気的に接続された絶縁電線14と、上記の発光素子11、光学部品17、支持体12、及び絶縁電線14を含む構造体の外表面を一体的に被覆する絶縁層16Aと、を備える。絶縁層16Aは、たとえばポリシラザン溶液を塗布し、シリカ化したコート(以下、ポリシラザンコートという)であり、発光素子11から出射される光に対して透光性である。ポリシラザンコートを採用することにより、絶縁層の厚みを薄くして放熱性を向上させつつ、絶縁性を確保することができる。発光素子11の光出射面111と、光学部品17の光入射面171は、空間13を挟んで対向している。光出射面111から出射された光は、絶縁層16A、空間13、及び絶縁層16Aを通って光学部品17の光入射面171に入射する。図12Aの絶縁層16Aは、支持体12と支持体12に搭載される発光素子11などの部品の表面形状に沿って、積層された構造体を封止している。 12A and 12B are schematic diagrams showing an example of the configuration of the light irradiation device 10 of the eighth embodiment shown in FIG. 1. In both the light irradiation device 10A of FIG. 12A and the light irradiation device 10B of FIG. 12B, the light emitting element, the support on which the light emitting element is mounted, and the insulated electric wire electrically connected to the light emitting element are integrally covered with an insulating layer, but the covering state of the insulating layer is different. In the coordinate system of FIG. 12A and FIG. 12B, the optical axis direction is the Z direction, the mounting direction of the light emitting element on the support is the Y direction, and the direction perpendicular to the Z direction and the Y direction is the X direction. The light irradiation device 10A of FIG. 12A includes a light emitting element 11 that emits light of a predetermined wavelength, an optical component 17 into which the light emitted from the light emitting element 11 is incident, a support 12 that mounts the light emitting element 11 and the optical component 17, an insulated electric wire 14 electrically connected to the light emitting element 11, and an insulating layer 16A that integrally covers the outer surface of the structure including the light emitting element 11, the optical component 17, the support 12, and the insulated electric wire 14. The insulating layer 16A is a coating (hereinafter referred to as a polysilazane coating) formed by applying a polysilazane solution and silicifying it, and is transparent to the light emitted from the light emitting element 11. By adopting a polysilazane coating, the thickness of the insulating layer can be reduced to improve heat dissipation while ensuring insulation. The light emission surface 111 of the light emitting element 11 and the light incidence surface 171 of the optical component 17 face each other with the space 13 in between. The light emitted from the light emission surface 111 passes through the insulating layer 16A, the space 13, and the insulating layer 16A and enters the light incidence surface 171 of the optical component 17. The insulating layer 16A in FIG. 12A seals the stacked structure along the surface shape of the support 12 and the components such as the light emitting element 11 mounted on the support 12.

 この構成例で、支持体12の長手方向はZ方向と平行である。第8実施形態の光照射デバイス10は、カテーテル50の中に+Z方向に挿入され、第1絶縁電線14aと第2絶縁電線14bを含む絶縁電線14は、-Z方向に延びている。支持体12は、シリコン(Si)、窒化アルミニウム(AlN)、窒化ケイ素(SiN)、アルミナ(Al)、ガラス、石英、セラミックスなどの絶縁性材料で形成されており、熱伝導率が100W/m・K以上の材料が好ましい。また絶縁性材料に限らず、銅などの金属材料、或いは樹脂材料を使用してもよい。金属材料を用いる場合は、短絡等が生じないように、適宜、絶縁処理を行う。支持体12の発光素子搭載面121に、発光素子11が搭載されている。 In this configuration example, the longitudinal direction of the support 12 is parallel to the Z direction. The light irradiation device 10 of the eighth embodiment is inserted into the catheter 50 in the +Z direction, and the insulated wires 14 including the first insulated wire 14a and the second insulated wire 14b extend in the -Z direction. The support 12 is formed of an insulating material such as silicon (Si), aluminum nitride (AlN), silicon nitride (SiN), alumina (Al 2 O 3 ), glass, quartz, ceramics, etc., and a material with a thermal conductivity of 100 W/m·K or more is preferable. In addition to the insulating material, a metal material such as copper or a resin material may be used. When a metal material is used, an insulation process is performed as appropriate to prevent short circuits and the like. The light emitting element 11 is mounted on the light emitting element mounting surface 121 of the support 12.

 発光素子11とともに、光学部品17が支持体12の発光素子搭載面121に搭載されており、光学部品17の光入射面171は、発光素子搭載面121に対して傾斜している。これにより、光学部品17の光入射面171は、反射面として機能し、光照射デバイス10Aの出力光Loutが破線の矢印の方向に取り出される。図12Aの構成例で、光学部品17は、発光素子11から出射された光を支持体12の発光素子搭載面121と交差する方向(たとえば、+Y方向)に導く反射部材である。これにより、光照射デバイスの周方向に光を出射させることができる。光学部品17は、光入射面171に入射した光を反射するミラーであってもよい。ミラーは金属、または/および誘電体多層膜の反射層を備えていてもよい。これにより、光を効率的に反射することができる。 The optical component 17 is mounted on the light-emitting element mounting surface 121 of the support 12 together with the light-emitting element 11, and the light incident surface 171 of the optical component 17 is inclined with respect to the light-emitting element mounting surface 121. As a result, the light incident surface 171 of the optical component 17 functions as a reflecting surface, and the output light Lout of the light irradiation device 10A is extracted in the direction of the dashed arrow. In the configuration example of FIG. 12A, the optical component 17 is a reflecting member that guides the light emitted from the light-emitting element 11 in a direction intersecting with the light-emitting element mounting surface 121 of the support 12 (for example, the +Y direction). This allows the light to be emitted in the circumferential direction of the light irradiation device. The optical component 17 may be a mirror that reflects the light incident on the light incident surface 171. The mirror may have a reflective layer of metal and/or a dielectric multilayer film. This allows the light to be reflected efficiently.

 絶縁電線14は、発光素子11を搭載する支持体12の第1の面である発光素子搭載面121の側で発光素子11の一方の電極(第1電極ともいう)と電気的に接続される第1絶縁電線14aと、発光素子搭載面121と反対側の裏面122(第2の面ともいう)の側で発光素子11の他方の電極(第2電極ともいう)と電気的に接続される第2絶縁電線14bとを含む。絶縁電線を使用することにより、発光素子11への通電が可能となる。光照射デバイス10Aの特徴のひとつとして、第1絶縁電線14a及び第2絶縁電線14bと発光素子11との電気的な接続部が、支持体12、発光素子11、及び光学部品17とともに一体的に絶縁層16Aで封止されている。絶縁層16Aの厚さは発光素子11の厚みよりも薄い。光照射デバイス10Aを発光素子11の厚みよりも薄い絶縁層16で一体的に覆うことで、電気的な絶縁性が確保された小型の光照射デバイス10Aが実現され、カテーテル50内への挿入が容易になる。また、絶縁層16Aの厚みを発光素子の厚みよりも薄くすることで、絶縁層16の熱抵抗を低減し、放熱性を高めることができる。 The insulated wire 14 includes a first insulated wire 14a electrically connected to one electrode (also called the first electrode) of the light-emitting element 11 on the side of the light-emitting element mounting surface 121, which is the first surface of the support 12 on which the light-emitting element 11 is mounted, and a second insulated wire 14b electrically connected to the other electrode (also called the second electrode) of the light-emitting element 11 on the side of the back surface 122 (also called the second surface) opposite the light-emitting element mounting surface 121. By using the insulated wire, it is possible to pass electricity through the light-emitting element 11. One of the features of the light irradiation device 10A is that the electrical connection parts between the first insulated wire 14a and the second insulated wire 14b and the light-emitting element 11 are sealed together with the support 12, the light-emitting element 11, and the optical component 17 by an insulating layer 16A. The thickness of the insulating layer 16A is thinner than the thickness of the light-emitting element 11. By integrally covering the light irradiation device 10A with an insulating layer 16 that is thinner than the thickness of the light emitting element 11, a small light irradiation device 10A with ensured electrical insulation is realized, making it easier to insert into the catheter 50. In addition, by making the thickness of the insulating layer 16A thinner than the thickness of the light emitting element, the thermal resistance of the insulating layer 16 can be reduced, and heat dissipation can be improved.

 支持体12のX方向の幅は、カテーテル50内へ容易に挿入される幅であるが、冷媒51による冷却面積(すなわち、放熱面積)を広くする観点から、カテーテル50内に円滑に挿入可能な範囲で、できるだけ広く設定してもよい。支持体12のY方向の厚さは、発光素子11を安定して支持でき、かつ、発光素子11を搭載した状態でカテーテル50内に円滑に挿入され得る厚さである。一例として、支持体12の厚さは0.075mm乃至0.3mm程度である。 The width of the support 12 in the X direction is such that it can be easily inserted into the catheter 50, but from the viewpoint of widening the cooling area (i.e., heat dissipation area) by the refrigerant 51, it may be set as wide as possible within the range that allows smooth insertion into the catheter 50. The thickness of the support 12 in the Y direction is such that it can stably support the light-emitting element 11 and can be smoothly inserted into the catheter 50 with the light-emitting element 11 mounted. As an example, the thickness of the support 12 is about 0.075 mm to 0.3 mm.

 支持体12と、支持体12上の構成部品とを一体的に封止する絶縁層16Aは、ポリシラザンコート、あるいはエポキシ樹脂、シリコーン樹脂、アクリル系樹脂、熱可塑性樹脂などの絶縁樹脂などである。絶縁層により一体的に、すなわち一つの工程で封止することで、工程を簡略化することができる。これらの樹脂を用いる場合、好ましくは、生体適合性、かつ熱伝導率の高い絶縁樹脂で、発光波長に対して透過率の高い樹脂を絶縁層16Aに用いるのが好ましい。このような絶縁樹脂として、成分や組成が調整されて生体に対する悪影響が緩和されたポリカーボネート(PC)、ポリエチレンテレフタレート(PET)、ポリイミド(PI)、ポリウレタン、ポリエステルイミド等を用いることができる。絶縁層16Aは、ポリシラザンコートの表面に生体適合性の樹脂層を設けたものであってもよい。絶縁層16Aによって、発光素子11と第1絶縁電線14a及び第2絶縁電線14bとの間の電気的な接続部分が、冷媒51から隔離される。この封止状態を保ったまま、第1絶縁電線14aと第2絶縁電線14bは、絶縁層16Aから-Z方向に引き出されている。 The insulating layer 16A, which seals the support 12 and the components on the support 12 together, is a polysilazane coat or an insulating resin such as an epoxy resin, a silicone resin, an acrylic resin, or a thermoplastic resin. By sealing the components together with the insulating layer, that is, in one process, the process can be simplified. When using these resins, it is preferable to use an insulating resin that is biocompatible and has high thermal conductivity and high transmittance for the emission wavelength for the insulating layer 16A. As such insulating resins, polycarbonate (PC), polyethylene terephthalate (PET), polyimide (PI), polyurethane, polyesterimide, etc., whose components and compositions are adjusted to reduce adverse effects on living bodies, can be used. The insulating layer 16A may be a biocompatible resin layer provided on the surface of a polysilazane coat. The insulating layer 16A isolates the electrical connection between the light emitting element 11 and the first insulated wire 14a and the second insulated wire 14b from the refrigerant 51. While maintaining this sealed state, the first insulated wire 14a and the second insulated wire 14b are pulled out from the insulating layer 16A in the -Z direction.

 第1絶縁電線14aと第2絶縁電線14bは、冷媒51によって冷却され、放熱材としても機能する。絶縁電線14は、たとえばエナメル線であり、Cu、Ni等の良導体の金属配線が、絶縁被膜であるポリウレタンで絶縁コーティングされている。ポリウレタンに変えて、絶縁樹脂であるポリエステル、ポリエステルイミド、ポリアミドイミド、ポリイミドなどのコーティングがなされていてもよい。絶縁電線14の表面被膜である絶縁被膜を放熱材として用いることで、発光素子11から発生する熱を外部に逃がすことができる。第1絶縁電線14a、及び第2絶縁電線14bとして角型エナメル線を用いる場合は、幅広の配線となり、支持体12との接合面積を大きくすることができる。また、外接円の面積が同じである場合、丸形エナメル線よりも角型エナメル線のほうが外接円の面積を小さくすることができるため、より小型化することができる。 The first insulated wire 14a and the second insulated wire 14b are cooled by the refrigerant 51 and also function as a heat sink. The insulated wire 14 is, for example, an enameled wire, and the metal wiring of a good conductor such as Cu or Ni is insulated and coated with polyurethane, which is an insulating coating. Instead of polyurethane, coating with insulating resin such as polyester, polyesterimide, polyamideimide, or polyimide may be used. By using the insulating coating, which is the surface coating of the insulated wire 14, as a heat sink, the heat generated from the light emitting element 11 can be released to the outside. When a rectangular enameled wire is used as the first insulated wire 14a and the second insulated wire 14b, the wiring becomes wide, and the joint area with the support 12 can be increased. In addition, when the area of the circumscribed circle is the same, the area of the circumscribed circle of the rectangular enameled wire can be made smaller than that of the round enameled wire, so that the size can be reduced.

 発光素子11は、たとえば、端面発光型のレーザ素子であり、Z軸と平行な方向に共振する。端面発光型のレーザ素子を発光素子11として用いる場合、共振方向の一方の端面が光出射面111となる。支持体12の発光素子搭載面121に、発光素子11の光出射面111と対向するように光学部品17が配置され、端面発光型のレーザ素子から出射された光を、発光素子搭載面121と交差する方向に導く。発光素子搭載面121と交差する方向は、発光素子搭載面121と平行な方向を除くすべての方向であるが、発光素子搭載面121に対して、例えば50°~130°の範囲とすることができる。発光素子搭載面121と垂直な方向であってもよい。ここで「垂直」な方向とは、発光素子搭載面121に対して厳密に直角である必要はなく、支持体12や光学部品17の製造誤差や表面状態を考慮して、90°±5°の範囲を含む。発光素子11からの出射光は光学部品17の光入射面171で反射されて、所定の方向に照射される。絶縁層16Aにポリシラザンコートを用いる場合、光はポリシラザンコートでも反射され得る。光学部品17は、発光素子11の光出射面111との間に所定の空間13が維持される限り、発光素子11から出射される光の広がり角の制御を行う第1の光学素子と、反射機能を有する第2の光学素子の組み合わせで構成されていてもよい。 The light-emitting element 11 is, for example, an edge-emitting laser element, which resonates in a direction parallel to the Z-axis. When an edge-emitting laser element is used as the light-emitting element 11, one end face in the resonance direction becomes the light emission surface 111. An optical component 17 is arranged on the light-emitting element mounting surface 121 of the support 12 so as to face the light emission surface 111 of the light-emitting element 11, and guides the light emitted from the edge-emitting laser element in a direction intersecting with the light-emitting element mounting surface 121. The direction intersecting with the light-emitting element mounting surface 121 is all directions except for directions parallel to the light-emitting element mounting surface 121, but can be, for example, in the range of 50° to 130° with respect to the light-emitting element mounting surface 121. It may also be a direction perpendicular to the light-emitting element mounting surface 121. Here, the "perpendicular" direction does not need to be strictly perpendicular to the light-emitting element mounting surface 121, and includes a range of 90°±5° taking into account the manufacturing errors and surface conditions of the support 12 and the optical component 17. The light emitted from the light emitting element 11 is reflected by the light incident surface 171 of the optical component 17 and is irradiated in a predetermined direction. If a polysilazane coating is used for the insulating layer 16A, the light can also be reflected by the polysilazane coating. The optical component 17 may be composed of a combination of a first optical element that controls the spread angle of the light emitted from the light emitting element 11 and a second optical element that has a reflecting function, as long as a predetermined space 13 is maintained between the optical component 17 and the light emitting surface 111 of the light emitting element 11.

 図12Aの構成例で、第1絶縁電線14aと第2絶縁電線14bは、発光素子11のZ方向への光出射と、光学部品17による反射を妨げないように、発光素子11の上面と、支持体12の裏面122にそれぞれ接続されている。支持体12の表面の少なくとも一部に導電層124が形成されている。図12Aの例で、支持体12は、発光素子搭載面121、裏面122、及び、発光素子搭載面121と裏面122を接続する側面の少なくとも一部に形成された導電層124を有する。これにより、第1絶縁電線14aは、支持体12の発光素子搭載面121の側で、発光素子11の一方の電極に直接または間接的に、電気的に接続される。第2絶縁電線14bは、支持体12の裏面122で、支持体12に形成された導電層124を介して発光素子11の他方の電極と直接または間接的に、電気的に接続されている。 In the configuration example of FIG. 12A, the first insulated wire 14a and the second insulated wire 14b are connected to the upper surface of the light emitting element 11 and the back surface 122 of the support 12, respectively, so as not to interfere with the light emission in the Z direction of the light emitting element 11 and the reflection by the optical component 17. A conductive layer 124 is formed on at least a part of the surface of the support 12. In the example of FIG. 12A, the support 12 has a conductive layer 124 formed on at least a part of the light emitting element mounting surface 121, the back surface 122, and the side surface connecting the light emitting element mounting surface 121 and the back surface 122. As a result, the first insulated wire 14a is directly or indirectly electrically connected to one electrode of the light emitting element 11 on the side of the light emitting element mounting surface 121 of the support 12. The second insulated wire 14b is directly or indirectly electrically connected to the other electrode of the light emitting element 11 on the back surface 122 of the support 12 via the conductive layer 124 formed on the support 12.

 図12Bの光照射デバイス10Bの支持体12上に搭載される発光素子11と、発光素子11に電気的に接続される絶縁電線14の構成は光照射デバイス10Aと同じであるが、絶縁層16Bによる被覆状態が図12Aと異なる。絶縁層16Bの厚さは、発光素子11の厚さよりも少なくとも一部において厚くてもよい。この場合、発光素子11の光出射面111と、光学部品17の光入射面171との間の空間は、絶縁層16Bで埋められてもよい。発光素子11の光出射面111から出射された光は、絶縁層16Bを透過して、光学部品17の光入射面171に入射する。絶縁層16Bの材料は、上述した絶縁層16Aと同様の材料を用いることができる。絶縁層16Bを厚くすることで、支持体12、発光素子11、光学部品17、及び絶縁電線14の全体を安定的に保持し、光学的な結合部分と、電気的な接続部分が冷媒と接触することを確実に抑制できる。なお、絶縁層16Bの厚さは、全領域において、発光素子11の厚さよりも厚くてもよい。 The configuration of the light emitting element 11 mounted on the support 12 of the light irradiation device 10B in FIG. 12B and the insulated electric wire 14 electrically connected to the light emitting element 11 is the same as that of the light irradiation device 10A, but the covering state with the insulating layer 16B is different from that of FIG. 12A. The thickness of the insulating layer 16B may be thicker than the thickness of the light emitting element 11 in at least a part. In this case, the space between the light emitting surface 111 of the light emitting element 11 and the light incident surface 171 of the optical component 17 may be filled with the insulating layer 16B. The light emitted from the light emitting surface 111 of the light emitting element 11 passes through the insulating layer 16B and enters the light incident surface 171 of the optical component 17. The material of the insulating layer 16B can be the same as that of the insulating layer 16A described above. By making the insulating layer 16B thick, the support 12, the light emitting element 11, the optical component 17, and the insulated electric wire 14 can be stably held as a whole, and the optical coupling portion and the electrical connection portion can be reliably prevented from contacting the refrigerant. The thickness of the insulating layer 16B may be greater than the thickness of the light-emitting element 11 over the entire area.

 図13は、絶縁層16(または16Aまたは16B)で封止される前の光照射デバイス本体の斜視図である。発光素子11の光出射面111と、光学部品17の光入射面171の間に、所定の空間13が設けられている。発光素子11からの出射光は、空間13を通って光学部品17に入射し、所定の方向に反射される。支持体12の発光素子搭載面121の少なくとも一部と、側面の少なくとも一部と、裏面122の少なくとも一部とを覆って、導電層124が形成されている。発光素子11の上面は、第1絶縁電線14aに接続され、発光素子11の底面は、発光素子搭載面121に形成された導電層124に接続されている。 FIG. 13 is a perspective view of the light irradiation device body before being sealed with the insulating layer 16 (or 16A or 16B). A predetermined space 13 is provided between the light emission surface 111 of the light emitting element 11 and the light incidence surface 171 of the optical component 17. The light emitted from the light emitting element 11 passes through the space 13 and enters the optical component 17, where it is reflected in a predetermined direction. A conductive layer 124 is formed covering at least a part of the light emitting element mounting surface 121 of the support 12, at least a part of the side surface, and at least a part of the back surface 122. The top surface of the light emitting element 11 is connected to the first insulated wire 14a, and the bottom surface of the light emitting element 11 is connected to the conductive layer 124 formed on the light emitting element mounting surface 121.

 第1絶縁電線14aの絶縁被膜の一部が除去されて、内部の金属配線が発光素子11の一方の電極に接続される。第2絶縁電線14bの絶縁被膜の一部が除去されて、内部の金属配線が発光素子11の他方の電極に電気的に接続される。図13の例では、支持体12の発光素子搭載面121から側面を通って裏面122まで導電層124が形成されており、第2絶縁電線14bの内部の金属配線が、支持体12の裏面122で導電層124に接続される。これにより、発光素子11の他方の電極と第2絶縁電線14bとの間に電気的な接続が得られる。支持体12の表面に電気的な接続用の導電層124を設けることで、導電層124を放熱部材として用いることができる。 A part of the insulating coating of the first insulated wire 14a is removed, and the internal metal wiring is connected to one electrode of the light-emitting element 11. A part of the insulating coating of the second insulated wire 14b is removed, and the internal metal wiring is electrically connected to the other electrode of the light-emitting element 11. In the example of FIG. 13, a conductive layer 124 is formed from the light-emitting element mounting surface 121 of the support 12 through the side surface to the back surface 122, and the internal metal wiring of the second insulated wire 14b is connected to the conductive layer 124 on the back surface 122 of the support 12. This provides an electrical connection between the other electrode of the light-emitting element 11 and the second insulated wire 14b. By providing a conductive layer 124 for electrical connection on the surface of the support 12, the conductive layer 124 can be used as a heat dissipation member.

 上述したように、光学部品17は、支持体12に搭載され、発光素子11の光出射面111と対向する。光学部品17の本体はガラス等の誘電体で形成され、光入射面171に銀の薄膜が形成されているが、この例に限定されない。プラスチックや、樹脂、シリコン(Si)、窒化アルミニウム(AlN)、窒化ケイ素(SiN)、アルミナ(Al)、ガラス、石英、セラミックスなどの絶縁性材料の本体の光入射面(すなわち反射面)にアルミニウム、アルミ合金、金、ニッケル、白金等の薄膜を形成してもよい。金属反射膜に替えて、誘電体多層膜を形成してもよい。支持体12、発光素子11、光学部品17、及び絶縁電線14の一部は、ディップ法、スプレー法等によって、透光性の絶縁層16Aまたは16Bで覆われている。 As described above, the optical component 17 is mounted on the support 12 and faces the light emission surface 111 of the light emitting element 11. The main body of the optical component 17 is formed of a dielectric material such as glass, and a thin silver film is formed on the light incidence surface 171, but this example is not limited to this. A thin film of aluminum, aluminum alloy, gold, nickel, platinum, etc. may be formed on the light incidence surface (i.e., the reflection surface) of the main body of an insulating material such as plastic, resin, silicon (Si), aluminum nitride (AlN), silicon nitride (SiN), alumina ( Al 2 O 3 ), glass, quartz, ceramics, etc. Instead of a metal reflection film, a dielectric multilayer film may be formed. The support 12, the light emitting element 11, the optical component 17, and a part of the insulated electric wire 14 are covered with a light-transmitting insulating layer 16A or 16B by a dipping method, a spraying method, etc.

 図14は、支持体12上に搭載された発光素子11の模式図である。発光素子11は、一例として、端面発光型の、リッジ構造を有するレーザ素子である。発光素子11は、n側電極113、n側半導体層114、活性層115、p側半導体層116、及び、p側電極118を有する。n側半導体層114には、n型不純物が添加された光ガイド層、クラッド層、コンタクト層等が含まれてよい。p側半導体層116には、p型不純物が添加された光ガイド層、クラッド層、コンタクト層等が含まれてよい。p側電極118は、第1絶縁電線14aに電気的に接続されている。p側電極118としてITO電極を用いる場合は、p側電極118がクラッド層を兼ねていてもよい。p側電極118は、支持体12に形成された導電層124を介して、第2絶縁電線14bに電気的に接続されている。図14の例では、n側電極113と第1絶縁電線14aが直接的に接続されているが、間接的に接続されていてもよく、たとえば、n側電極113と第1絶縁電線14aの間に第2の支持体が配置されていてもよい。図15を参照して後述するように、発光素子11を、2つの支持体12-1および12-2で挟むことにより、放熱性を向上させることができる。 14 is a schematic diagram of the light-emitting element 11 mounted on the support 12. The light-emitting element 11 is, for example, an edge-emitting laser element having a ridge structure. The light-emitting element 11 has an n-side electrode 113, an n-side semiconductor layer 114, an active layer 115, a p-side semiconductor layer 116, and a p-side electrode 118. The n-side semiconductor layer 114 may include an optical guide layer, a cladding layer, a contact layer, etc., to which an n-type impurity is added. The p-side semiconductor layer 116 may include an optical guide layer, a cladding layer, a contact layer, etc., to which a p-type impurity is added. The p-side electrode 118 is electrically connected to the first insulated wire 14a. When an ITO electrode is used as the p-side electrode 118, the p-side electrode 118 may also serve as the cladding layer. The p-side electrode 118 is electrically connected to the second insulated wire 14b via a conductive layer 124 formed on the support 12. In the example of Figure 14, the n-side electrode 113 and the first insulated wire 14a are directly connected, but they may be indirectly connected, for example, a second support may be disposed between the n-side electrode 113 and the first insulated wire 14a. As will be described later with reference to Figure 15, by sandwiching the light-emitting element 11 between the two supports 12-1 and 12-2, heat dissipation can be improved.

 発光素子11の半導体材料とその組成は、所望の波長のレーザ光を出射するように設計されている。発光素子11を紫外レーザ、紫色レーザ、青色レーザ及び緑色レーザとして用いる場合は、GaN、InGaN、およびAlGaN等のGaN系の材料が用いられる。発光素子11を赤色レーザ、赤外レーザおよび近赤外レーザとして用いる場合は、GaAs、AlGaAs等のGaAs系、またはInAlGaP、GaInP等のInP系の材料が用いられる。発光素子11を支持体12に搭載した状態で、第1絶縁電線14a及び第2絶縁電線14bとともに絶縁層16Aまたは16Bで封止する観点から、リッジの幅を広く形成して、活性層115の利得を確保してもよい。リッジの幅は、たとえば2μm乃至100μmに設計されてもよい。横モードはマルチモードであっても、シングルモードであってもよい。 The semiconductor material and its composition of the light-emitting element 11 are designed to emit laser light of a desired wavelength. When the light-emitting element 11 is used as an ultraviolet laser, a purple laser, a blue laser, or a green laser, GaN-based materials such as GaN, InGaN, and AlGaN are used. When the light-emitting element 11 is used as a red laser, an infrared laser, or a near-infrared laser, GaAs-based materials such as GaAs and AlGaAs, or InP-based materials such as InAlGaP and GaInP are used. In order to seal the light-emitting element 11 together with the first insulated wire 14a and the second insulated wire 14b with the insulating layer 16A or 16B while the light-emitting element 11 is mounted on the support 12, the width of the ridge may be formed wide to ensure the gain of the active layer 115. The width of the ridge may be designed to be, for example, 2 μm to 100 μm. The transverse mode may be a multimode or a single mode.

 光ファイバを介してレーザ光を照射する照射デバイスと異なり、本実施形態の発光素子11が出射する光は直線偏光であり、ミラーなどの光学部品17により反射方向を変えることで、出射後の直線偏光の方向を変えることができる。これにより、例えば生体に入射する際の反射率の低減や、生体に対する透過率の向上を図ることが可能となる。レーザ光が出射された段階では特定の偏光状態にある光も、例えば光ファイバなどの伝送媒体を通過中に偏光状態が変動したり、偏光が解消(depolarize)したりする場合がある。本実施形態では、光ファイバを用いることなく体内の患部に直接光を照射することができるため、特定の偏光状態を保持したまま、患部等の目標の箇所に光を照射することができる。 Unlike irradiation devices that irradiate laser light via optical fibers, the light emitted by the light emitting element 11 of this embodiment is linearly polarized, and the direction of the linear polarization after emission can be changed by changing the reflection direction using an optical component 17 such as a mirror. This makes it possible to reduce the reflectance when the light enters a living body, and to improve the transmittance through the living body. Even light that is in a specific polarization state when the laser light is emitted may have its polarization state fluctuate or become depolarized while passing through a transmission medium such as an optical fiber. In this embodiment, light can be directly irradiated to an affected area inside the body without using an optical fiber, so light can be irradiated to a target location such as an affected area while maintaining a specific polarization state.

 図15は、支持体12と発光素子11の積層例を示す模式図である。この構成例で、発光素子11は、第1の支持体12-1と第2の支持体12-2の間に挟まれている。第1の支持体12-1は、発光素子11の上面と接し、第2の支持体12-2は、発光素子11の底面と接している。第1の支持体12-1と第2の支持体12-2で発光素子11を挟むことで、熱を発光素子11の上側と下側に効率的に逃がし、光照射デバイス10の放熱性を向上することができる。支持体12-1と第2の支持体12-2の少なくとも一方の後端を、-Z方向に伸ばしてもよい。図15では、光学部品17により光を光軸(Z軸)と非平行の方向(たとえばY方向)に取り出すことを想定しているが、第2実施形態で述べるように、光を支持体12の発光素子搭載面121と平行な方向に取り出す場合は、第1の支持体12-1と第2の支持体12-2の先端側を+Z方向に長く伸ばしてもよい。図15の構造体の全体は、絶縁層16Aまたは16Bで被覆される。 Figure 15 is a schematic diagram showing an example of stacking of the support 12 and the light-emitting element 11. In this configuration example, the light-emitting element 11 is sandwiched between the first support 12-1 and the second support 12-2. The first support 12-1 is in contact with the top surface of the light-emitting element 11, and the second support 12-2 is in contact with the bottom surface of the light-emitting element 11. By sandwiching the light-emitting element 11 between the first support 12-1 and the second support 12-2, heat can be efficiently dissipated to the upper and lower sides of the light-emitting element 11, improving the heat dissipation properties of the light irradiation device 10. The rear end of at least one of the support 12-1 and the second support 12-2 may be extended in the -Z direction. In FIG. 15, it is assumed that the optical component 17 extracts light in a direction (for example, the Y direction) that is not parallel to the optical axis (Z axis), but as described in the second embodiment, if the light is extracted in a direction parallel to the light-emitting element mounting surface 121 of the support 12, the tip sides of the first support 12-1 and the second support 12-2 may be extended long in the +Z direction. The entire structure in FIG. 15 is covered with an insulating layer 16A or 16B.

 (第9実施形態)
 図16は、第9実施形態の光照射デバイス20を用いた生体内光照射アセンブリ200の一例を示す図である。生体内光照射アセンブリ200は、カテーテル50と、カテーテル50に挿入される光照射デバイス20とを含み、少なくとも使用時にカテーテル50内は冷媒51で満たされる。生体内光照射アセンブリ200は、治療、診断、センシング等に用いられる。第8実施形態の光照射デバイス10と同様に、光照射デバイス20は、図中の白矢印の「挿入方向」にカテーテル50に挿入され、生体内に導入される。
Ninth embodiment
16 is a diagram showing an example of an in vivo light irradiation assembly 200 using the light irradiation device 20 of the ninth embodiment. The in vivo light irradiation assembly 200 includes a catheter 50 and the light irradiation device 20 inserted into the catheter 50, and the catheter 50 is filled with a refrigerant 51 at least during use. The in vivo light irradiation assembly 200 is used for treatment, diagnosis, sensing, and the like. As with the light irradiation device 10 of the eighth embodiment, the light irradiation device 20 is inserted into the catheter 50 in the "insertion direction" of the white arrow in the figure, and introduced into the living body.

 光照射デバイス20は、その発熱部分が冷却された状態で使用される。第9実施形態では、絶縁電線24を絶縁層26の光軸に沿った両側から引き出して、放熱性を高める。絶縁電線24は、発光素子11と電気的に接続される第1絶縁電線24aと、第2絶縁電線14bとを含む。絶縁層26から+Z方向に引き出されている絶縁電線24の長さは、絶縁層26から-Z方向に引き出されている絶縁電線24の長さよりも短くてもよい。この構成を実現するために、発光素子11から出射された光は、発光素子搭載面と平行な方向、または第1絶縁電線24a及び第2絶縁電線24bによって妨げられない方向に導かれる。絶縁層26の被覆態様は、図12Aのように支持体12と、支持体12上に搭載される部品の表面形状に沿って薄く被覆して放熱性を高めてもよいし、図12Bのように支持体12上に搭載される部品間を埋めて部分的に厚く、かつ光照射デバイス全体の厚みをできるだけ小さくして冷媒51からの電気的な絶縁を確実にしてもよい。 The light irradiation device 20 is used with its heat generating portion cooled. In the ninth embodiment, the insulated wires 24 are pulled out from both sides along the optical axis of the insulating layer 26 to enhance heat dissipation. The insulated wires 24 include a first insulated wire 24a and a second insulated wire 14b that are electrically connected to the light emitting element 11. The length of the insulated wire 24 pulled out from the insulating layer 26 in the +Z direction may be shorter than the length of the insulated wire 24 pulled out from the insulating layer 26 in the -Z direction. To achieve this configuration, the light emitted from the light emitting element 11 is guided in a direction parallel to the light emitting element mounting surface or in a direction that is not obstructed by the first insulated wire 24a and the second insulated wire 24b. The covering form of the insulating layer 26 may be a thin covering along the surface shape of the support 12 and the components mounted on the support 12 as shown in FIG. 12A to enhance heat dissipation, or it may be partially thick by filling in the spaces between the components mounted on the support 12 as shown in FIG. 12B, while keeping the overall thickness of the light irradiation device as small as possible to ensure electrical insulation from the refrigerant 51.

 図17は、光照射デバイス20の光学部品27の配置例を示す図である。図17は、構成をわかりやすく示すために、発光素子11に第1絶縁電線24aと第2絶縁電線24bを電気的に接続する前の状態を示している。発光素子11の光出射面111から出射された光は、光学部品27によって、発光素子搭載面121と略平行な方向に反射され、光照射デバイス20の出力光Loutが破線の矢印の方向に取り出される。光学部品27からの反射光が第1絶縁電線24a及び第2絶縁電線24bに妨げられない限り、光は発光素子搭載面121を非平行な方向に反射されてもよい。 FIG. 17 is a diagram showing an example of the arrangement of the optical components 27 of the light irradiation device 20. In order to clearly show the configuration, FIG. 17 shows the state before the first insulated wire 24a and the second insulated wire 24b are electrically connected to the light emitting element 11. The light emitted from the light emitting surface 111 of the light emitting element 11 is reflected by the optical components 27 in a direction approximately parallel to the light emitting element mounting surface 121, and the output light Lout of the light irradiation device 20 is extracted in the direction of the dashed arrow. As long as the reflected light from the optical components 27 is not blocked by the first insulated wire 24a and the second insulated wire 24b, the light may be reflected in a non-parallel direction from the light emitting element mounting surface 121.

 実際の光照射デバイス20は、発光素子11と、光学部品27と、発光素子11と第1絶縁電線24a及び第2絶縁電線24bとの電気的な接続部分が、支持体12と一体的に絶縁層26で封止される。絶縁層26のうち、少なくとも発光素子11の光出射面111と光学部品の光入射面171との間に存在する部分は、発光素子11から出射される光に対して透光性である。 In the actual light irradiation device 20, the light emitting element 11, the optical component 27, and the electrical connection parts between the light emitting element 11 and the first insulated wire 24a and the second insulated wire 24b are sealed with the insulating layer 26 integrally with the support 12. At least the part of the insulating layer 26 that exists between the light emitting element 11's light exit surface 111 and the light incident surface 171 of the optical component is translucent to the light emitted from the light emitting element 11.

 発光素子11は、たとえば、端面発光型のレーザ素子である。発光素子11は、第8実施形態と同様の幅広のリッジ構造を有するレーザ素子であってもよい。発光素子11のZ軸と平行な方向が共振方向である。支持体12の発光素子搭載面121に光学部品27が配置され、レーザ素子の出射面から出射された光を、支持体12の発光素子搭載面121と平行な方向に導く。第1絶縁電線24aと第2絶縁電線24b(図16参照)は、発光素子11と支持体12を間に挟んで+Z方向と-Z方向に延びるため、発光素子11からの光は、光学部品27によって、第1絶縁電線24a及び第2絶縁電線24bに妨げられない方向に反射される。 The light-emitting element 11 is, for example, an edge-emitting laser element. The light-emitting element 11 may be a laser element having a wide ridge structure similar to that of the eighth embodiment. The direction parallel to the Z axis of the light-emitting element 11 is the resonance direction. An optical component 27 is disposed on the light-emitting element mounting surface 121 of the support 12, and guides the light emitted from the emission surface of the laser element in a direction parallel to the light-emitting element mounting surface 121 of the support 12. The first insulated electric wire 24a and the second insulated electric wire 24b (see FIG. 16) extend in the +Z direction and the -Z direction, sandwiching the light-emitting element 11 and the support 12, so that the light from the light-emitting element 11 is reflected by the optical component 27 in a direction that is not obstructed by the first insulated electric wire 24a and the second insulated electric wire 24b.

 光学部品27は、発光素子11の光出射面から出射された光を、たとえば、発光素子搭載面121と平行なX方向に反射する。ここで「平行」な方向とは、厳密に発光素子搭載面121と平行である必要はなく、支持体12の表面状態、光学部品27の製造誤差等を含め、±10°程度の誤差があってもよい。光学部品27で反射されたレーザ光が第1絶縁電線24a及び第2絶縁電線24bと抵触しない限り、平行以外の角度で取り出されてもよい。光学部品27は、好ましくは、発光素子11と同等の厚さ、または発光素子11よりも薄い。光学部品は、平面加工されたミラーやプリズム、あるいは、メタサーフェス素子を挿入したメタ偏光素子である。また、光学部品27は、発光素子11から出射される光の広がり角の制御を行うレンズ機能を有する光学素子であってもよい。光学部品27は、2以上の光学素子で構成されていてもよい。たとえば、発光素子11から出射される光の広がり角の制御を行うレンズ機能を有する光学素子と、光学素子によって広がり角が制御された光を所定の角度に反射する光学素子を有していてもよい。 The optical component 27 reflects the light emitted from the light emission surface of the light emitting element 11, for example, in the X direction parallel to the light emitting element mounting surface 121. Here, the "parallel" direction does not need to be strictly parallel to the light emitting element mounting surface 121, and may have an error of about ±10°, including the surface state of the support 12 and the manufacturing error of the optical component 27. As long as the laser light reflected by the optical component 27 does not interfere with the first insulated electric wire 24a and the second insulated electric wire 24b, it may be extracted at an angle other than parallel. The optical component 27 is preferably as thick as the light emitting element 11 or thinner than the light emitting element 11. The optical component is a flat-processed mirror or prism, or a meta-polarizing element with a metasurface element inserted. The optical component 27 may also be an optical element having a lens function that controls the spread angle of the light emitted from the light emitting element 11. The optical component 27 may be composed of two or more optical elements. For example, the device may have an optical element that has a lens function to control the spread angle of the light emitted from the light-emitting element 11, and an optical element that reflects the light whose spread angle has been controlled by the optical element at a predetermined angle.

 絶縁層26は、第1絶縁電線24aと第2絶縁電線24bを支持体12の光軸方向の両端から+Z方向と-Z方向に延設した状態で、電気的な絶縁が必要な個所を一体的に封止する。発光素子11と第1絶縁電線24a及び第2絶縁電線24bとの電気的な接続部分と、少なくとも発光素子11の光出射面111と光学部品17の光入射面171は、絶縁層26によって封止されて、冷媒51から隔離されている。絶縁層26は、好ましくは、熱伝導率の高い生体適合性の樹脂である。 The insulating layer 26 integrally seals the locations where electrical insulation is required with the first insulated wire 24a and the second insulated wire 24b extended in the +Z and -Z directions from both ends of the optical axis direction of the support 12. The electrical connection between the light emitting element 11 and the first insulated wire 24a and the second insulated wire 24b, and at least the light emission surface 111 of the light emitting element 11 and the light incidence surface 171 of the optical component 17 are sealed by the insulating layer 26 and isolated from the refrigerant 51. The insulating layer 26 is preferably a biocompatible resin with high thermal conductivity.

 支持体12の長手方向(Z方向)の両端の少なくとも一方が、絶縁層26から突き出ていてもよい。絶縁層26から突き出た支持体12が冷媒51と接触することで、光照射デバイス20の放熱性が確保される。また、第1絶縁電線24aと第2絶縁電線24bを支持体12の長手方向の両側に引き出すことで、第8実施形態と比較して、放熱性がさらに向上する。第8実施形態と同様に、光照射デバイス20の全体の厚みと幅は0.5mm程度であり、カテーテル50に実装可能な超小型の光照射デバイス20が実現される。第9実施形態の構成で、図15のように、発光素子11を2つの支持体12-1と12-2で挟んでもよい。第9実施形態では、発光素子11から出射された光は支持体12に妨げられない方向に取り出されるので、2つの支持体12-1と12-2で挟むことで、光照射デバイス20の放熱性をさらに向上することができる。 At least one of the two ends in the longitudinal direction (Z direction) of the support 12 may protrude from the insulating layer 26. The support 12 protruding from the insulating layer 26 comes into contact with the refrigerant 51, thereby ensuring the heat dissipation of the light irradiation device 20. In addition, by drawing out the first insulated wire 24a and the second insulated wire 24b on both sides in the longitudinal direction of the support 12, the heat dissipation is further improved compared to the eighth embodiment. As in the eighth embodiment, the overall thickness and width of the light irradiation device 20 are about 0.5 mm, and an ultra-compact light irradiation device 20 that can be mounted on a catheter 50 is realized. In the configuration of the ninth embodiment, the light emitting element 11 may be sandwiched between two supports 12-1 and 12-2 as shown in FIG. 15. In the ninth embodiment, the light emitted from the light emitting element 11 is extracted in a direction that is not obstructed by the support 12, so that the heat dissipation of the light irradiation device 20 can be further improved by sandwiching it between two supports 12-1 and 12-2.

 (第10実施形態)
 図18は、第10実施形態の光照射デバイス30の模式図である。第8実施形態、及び第9実施形態と同様に、光照射デバイス30も、カテーテル50(図11、及び図16参照)に実装されて使用され、光照射デバイス30とカテーテル50で生体内光照射アセンブリが構成され得る。第10実施形態では、発光素子31として、垂直共振器型面発光レーザ(VCSEL:Vertical Cavity Surface Emitting Laser)を用いる。
Tenth embodiment
Fig. 18 is a schematic diagram of a light irradiation device 30 according to a tenth embodiment. As in the eighth and ninth embodiments, the light irradiation device 30 is also mounted on a catheter 50 (see Figs. 11 and 16) for use, and the light irradiation device 30 and the catheter 50 can constitute an in-vivo light irradiation assembly. In the tenth embodiment, a vertical cavity surface emitting laser (VCSEL) is used as the light emitting element 31.

 光照射デバイス30は、所定の波長の光を出射する2つの発光素子31と、発光素子31を搭載する支持体12と、発光素子31と電気的に接続された絶縁電線34と、を有する。絶縁電線34は各発光素子31の一方の電極に接続される第1絶縁電線34aと、他方の電極に接続される第2絶縁電線34b、とを含む。発光素子31の光出射面と、発光素子31と絶縁電線34との電気的な接続部分は、絶縁層36により支持体12と一体的に封止されている。支持体12の長手方向(Z方向)に沿った両端のうち少なくとも一方は、絶縁層36から突き出ていてもよい。絶縁層36のうち、少なくとも光出射面を覆う部分は透光性である。絶縁層36の厚さは、発光素子31の厚みよりも厚くてもよいし、薄くてもよい。 The light irradiation device 30 has two light emitting elements 31 that emit light of a predetermined wavelength, a support 12 on which the light emitting elements 31 are mounted, and an insulated wire 34 electrically connected to the light emitting elements 31. The insulated wire 34 includes a first insulated wire 34a connected to one electrode of each light emitting element 31 and a second insulated wire 34b connected to the other electrode. The light emitting surface of the light emitting element 31 and the electrical connection portion between the light emitting element 31 and the insulated wire 34 are integrally sealed with the support 12 by an insulating layer 36. At least one of both ends along the longitudinal direction (Z direction) of the support 12 may protrude from the insulating layer 36. At least the portion of the insulating layer 36 that covers the light emitting surface is translucent. The thickness of the insulating layer 36 may be thicker or thinner than the thickness of the light emitting element 31.

 発光素子31に用いられるVCSELの光出射面は、支持体12の発光素子搭載面121と平行であり、VCSELから出射されたレーザ光は、図中の白矢印で示すように、発光素子搭載面121と垂直な方向に出射される。この構成では、ミラー等の光学部品は不要である。 The light emission surface of the VCSEL used for the light-emitting element 31 is parallel to the light-emitting element mounting surface 121 of the support 12, and the laser light emitted from the VCSEL is emitted in a direction perpendicular to the light-emitting element mounting surface 121, as shown by the white arrow in the figure. With this configuration, no optical components such as mirrors are required.

 第1絶縁電線34aと第2絶縁電線34bは、たとえば、2芯エナメル線である。第1絶縁電線34aは、支持体12の発光素子搭載面121の側で各発光素子31の一方の電極に接続され、第2絶縁電線34bは、支持体12の裏面(発光素子搭載面121と反対側の面)で各発光素子31の他方の電極に接続されている。第1絶縁電線34aと第2絶縁電線34bは、支持体12を間に挟んで、支持体12の長手方向の両端の少なくとも一方から絶縁層36の外に引き出されている。 The first insulated wire 34a and the second insulated wire 34b are, for example, two-core enameled wires. The first insulated wire 34a is connected to one electrode of each light-emitting element 31 on the side of the light-emitting element mounting surface 121 of the support 12, and the second insulated wire 34b is connected to the other electrode of each light-emitting element 31 on the back surface of the support 12 (the surface opposite the light-emitting element mounting surface 121). The first insulated wire 34a and the second insulated wire 34b are pulled out of the insulating layer 36 from at least one of both ends of the longitudinal direction of the support 12, with the support 12 sandwiched between them.

 図19は、第10実施形態で用いられる発光素子31の一例を示す模式図である。発光素子31であるVCSELは、半導体基板401と、n側反射膜402と、n型半導体層403と、活性層404と、p型半導体層405と、p側反射膜406とをこの順に-Y方向に積層した積層構造を備える。光出射方向は+Y方向である。p型およびn型の導電型は逆の関係であってもよい。半導体基板401は除去してもよい。n型半導体層403は平板部およびそこから-Y方向に突出する凸部を有する。n型半導体層403の凸部の上面には活性層404が設けられている。活性層404の上面にはp型半導体層405が設けられており、p型半導体層405の上部のうち、周縁領域以外の領域にp側反射膜406が設けられている。p型半導体層405とp側反射膜406の間に、p側コンタクト層が設けられていてもよい。 19 is a schematic diagram showing an example of a light-emitting element 31 used in the tenth embodiment. The VCSEL, which is the light-emitting element 31, has a laminated structure in which a semiconductor substrate 401, an n-side reflective film 402, an n-type semiconductor layer 403, an active layer 404, a p-type semiconductor layer 405, and a p-side reflective film 406 are laminated in this order in the -Y direction. The light emission direction is the +Y direction. The p-type and n-type conductivity types may be in an inverse relationship. The semiconductor substrate 401 may be removed. The n-type semiconductor layer 403 has a flat portion and a convex portion protruding from the flat portion in the -Y direction. An active layer 404 is provided on the upper surface of the convex portion of the n-type semiconductor layer 403. A p-type semiconductor layer 405 is provided on the upper surface of the active layer 404, and a p-side reflective film 406 is provided in the upper portion of the p-type semiconductor layer 405 in a region other than the peripheral region. A p-side contact layer may be provided between the p-type semiconductor layer 405 and the p-side reflective film 406.

 発光素子31は、n型半導体層403のうち、平板部の上面および凸部の側面、活性層404の側面、ならびにp型半導体層405の側面および上面の周縁領域を覆う絶縁層407を備える。発光素子31は、p型半導体層405に電気的に接続されるp側電極408と、n型半導体層403に電気的に接続されるn側電極409とを備える。p側電極408とn側電極409が設けられる側が、支持体12の発光素子搭載面121に配置される。p側電極408とn側電極409の-Y方向の高さが揃うように、支持体12の発光素子搭載面121に接続される導電性の接続層(またはバンプ)が設けられてもよい。発光素子31が、p側電極408とn側電極409に接続される導電性の接続層で支持体12にフリップチップ実装される場合、p側反射膜406は支持体12の発光素子搭載面と抵触しない。 The light-emitting element 31 includes an insulating layer 407 that covers the upper surface of the flat portion and the side surface of the convex portion of the n-type semiconductor layer 403, the side surface of the active layer 404, and the peripheral area of the side surface and upper surface of the p-type semiconductor layer 405. The light-emitting element 31 includes a p-side electrode 408 electrically connected to the p-type semiconductor layer 405, and an n-side electrode 409 electrically connected to the n-type semiconductor layer 403. The side on which the p-side electrode 408 and the n-side electrode 409 are provided is disposed on the light-emitting element mounting surface 121 of the support 12. A conductive connection layer (or bump) connected to the light-emitting element mounting surface 121 of the support 12 may be provided so that the heights of the p-side electrode 408 and the n-side electrode 409 in the -Y direction are aligned. When the light-emitting element 31 is flip-chip mounted on the support 12 with the conductive connection layer connected to the p-side electrode 408 and the n-side electrode 409, the p-side reflective film 406 does not interfere with the light-emitting element mounting surface of the support 12.

 n側反射膜402およびp側反射膜406はそれぞれ、例えばDBR(Distributed Bragg Reflector)から形成され得る。DBRは、複数の高屈折率層と複数の低屈折率層とが交互に積層された構造を有する。DBRは、ストップバンドと呼ばれる高反射率の波長域を有する。ストップバンドの中心波長および波長幅は、高屈折率層の屈折率および厚さならびに低屈折率層の屈折率および厚さによって決まる。DBRのストップバンドにおける反射率は、高屈折率層および低屈折率層の屈折率差ならびに積層数とともに増加する。 The n-side reflective film 402 and the p-side reflective film 406 may each be formed, for example, from a distributed Bragg reflector (DBR). A DBR has a structure in which multiple high-refractive index layers and multiple low-refractive index layers are alternately stacked. A DBR has a wavelength range of high reflectance called a stop band. The central wavelength and wavelength width of the stop band are determined by the refractive index and thickness of the high-refractive index layer and the refractive index and thickness of the low-refractive index layer. The reflectance in the stop band of a DBR increases with the refractive index difference between the high-refractive index layers and the number of layers stacked.

 図19に示す例において、n側反射膜402とp側反射膜406との間では定在波が形成される。定在波の空気中の波長はn側反射膜402およびp側反射膜406のストップバンド内にあり、当該波長がレーザ光の発振波長である。発振波長の半分の整数倍は、n側反射膜402とp側反射膜406とが互いに対向する反射面の間の光学的距離に等しい。光学的距離とは、光が実際にある媒質を伝搬する距離に当該媒質の屈折率を乗算して得られる距離である。p側電極408とn側電極409との間に順電圧を印加することにより、活性層404に電流注入することができる。電流注入によって活性層404では反転分布が生じ、発振波長で誘導放出による光の増幅、すなわちレーザ発振が生じる。上述したように、本実施形態のVCSELは、p側電極408およびn側電極409の側を実装面とし、半導体基板401側からレーザ光を取り出すことを想定している。 In the example shown in FIG. 19, a standing wave is formed between the n-side reflecting film 402 and the p-side reflecting film 406. The wavelength of the standing wave in air is within the stop band of the n-side reflecting film 402 and the p-side reflecting film 406, and this wavelength is the oscillation wavelength of the laser light. An integer multiple of half the oscillation wavelength is equal to the optical distance between the reflective surfaces of the n-side reflecting film 402 and the p-side reflecting film 406, which face each other. The optical distance is the distance obtained by multiplying the distance that light actually propagates through a certain medium by the refractive index of the medium. By applying a forward voltage between the p-side electrode 408 and the n-side electrode 409, a current can be injected into the active layer 404. The current injection causes a population inversion in the active layer 404, and light amplification by stimulated emission at the oscillation wavelength, that is, laser oscillation, occurs. As described above, the VCSEL of this embodiment is assumed to have the p-side electrode 408 and the n-side electrode 409 side as the mounting surface, and to extract laser light from the semiconductor substrate 401 side.

 なお、図19に示すVCSELの構成は例示である。VCSELに含まれる構成要素は公知の材料から形成され得る。VCSELに含まれる構成要素の一部の形状を変更してもよいし、他の構成要素をさらに備えていてもよい。半導体基板401と反対側からレーザ光を取り出す構成としてもよい。 Note that the configuration of the VCSEL shown in FIG. 19 is an example. The components included in the VCSEL may be formed from known materials. The shape of some of the components included in the VCSEL may be changed, and other components may also be included. The VCSEL may be configured to extract laser light from the side opposite the semiconductor substrate 401.

 図20Aは、第10実施形態で用いられる支持体12の発光素子搭載面121側の斜視図、図20Bは、支持体の裏面122側の斜視図である。ここでは、発光素子搭載面121と反対側の面を「裏面」とする。支持体12の発光素子搭載面121に導電層124と125が形成されている。導電層124は、支持体12の発光素子搭載面121に形成されており、導電層125と電気的に絶縁されている。導電層124は、発光素子31の一方の電極に接続される接続領域124cと、支持体12の-Z側の端部で、接続領域124cよりも幅が広い幅広部124wを有する。幅広部124wは、第1絶縁電線34aとの電気接続に用いられる。導電層125は、支持体12の側面から裏面122にかけて形成されている。 20A is a perspective view of the light-emitting element mounting surface 121 side of the support 12 used in the tenth embodiment, and FIG. 20B is a perspective view of the back surface 122 side of the support. Here, the surface opposite the light-emitting element mounting surface 121 is referred to as the "back surface". Conductive layers 124 and 125 are formed on the light-emitting element mounting surface 121 of the support 12. The conductive layer 124 is formed on the light-emitting element mounting surface 121 of the support 12 and is electrically insulated from the conductive layer 125. The conductive layer 124 has a connection region 124c that is connected to one electrode of the light-emitting element 31, and a wide portion 124w that is wider than the connection region 124c at the end of the -Z side of the support 12. The wide portion 124w is used for electrical connection with the first insulated wire 34a. The conductive layer 125 is formed from the side surface of the support 12 to the back surface 122.

 発光素子31のp側電極408とn側電極409は、導電性の接続層(またはバンプ)を介して、発光素子搭載面121の導電層124と125にそれぞれ接続される。導電層124の幅広部124wは、第1絶縁電線34aに電気的に接続されている。第1絶縁電線34aの絶縁被膜の一部が除去され、内部の金属配線が導電層124に接続される。支持体12の裏面122で、導電層125は第2絶縁電線34bに電気的に接続される。第2絶縁電線34bの絶縁被膜の一部が除去され、内部の金属配線が導電層125に接続される。 The p-side electrode 408 and n-side electrode 409 of the light-emitting element 31 are connected to the conductive layers 124 and 125 of the light-emitting element mounting surface 121, respectively, via conductive connection layers (or bumps). The wide portion 124w of the conductive layer 124 is electrically connected to the first insulated wire 34a. A portion of the insulating coating of the first insulated wire 34a is removed, and the internal metal wiring is connected to the conductive layer 124. On the back surface 122 of the support 12, the conductive layer 125 is electrically connected to the second insulated wire 34b. A portion of the insulating coating of the second insulated wire 34b is removed, and the internal metal wiring is connected to the conductive layer 125.

 第1絶縁電線34aと第2絶縁電線34bは、支持体12を間に挟んで支持体の長手方向(Z方向)に延設され、VCSELの光出射を妨げない。図18の配置構成で、支持体12の裏面122に接続される第2絶縁電線34bを支持体12の+Z側の先端近傍まで伸ばしてもよい。絶縁層36から-Z方向に突き出す第1絶縁電線34aと第2絶縁電線34bは、冷媒と接触して冷却される。支持体12も、長手方向の少なくとも一方の端部で絶縁層36から突き出て、冷媒によって直接冷却されてもよい。支持体12の表面に形成された導電層124と125は、ヒートシンクとしても機能する。 The first insulated wire 34a and the second insulated wire 34b are arranged to sandwich the support 12 and extend in the longitudinal direction (Z direction) of the support, and do not interfere with the light emission of the VCSEL. In the arrangement configuration of FIG. 18, the second insulated wire 34b connected to the rear surface 122 of the support 12 may be extended to the vicinity of the tip of the support 12 on the +Z side. The first insulated wire 34a and the second insulated wire 34b protruding from the insulating layer 36 in the -Z direction are cooled by contacting the refrigerant. The support 12 may also protrude from the insulating layer 36 at least at one end in the longitudinal direction and be directly cooled by the refrigerant. The conductive layers 124 and 125 formed on the surface of the support 12 also function as a heat sink.

 発光素子31として用いられるVCSELチップの一辺の長さと高さは200μm以下であり、支持体12に搭載されて絶縁層36で封止される。光照射デバイス30の全体の厚みと幅は0.5mm程度であり、カテーテル50に実装可能な超小型の光照射デバイス30が実現される。図18の例では、絶縁層36の厚さは、発光素子31の厚みよりも薄い。 The VCSEL chip used as the light-emitting element 31 has a side length and height of 200 μm or less, is mounted on the support 12, and is sealed with an insulating layer 36. The overall thickness and width of the light-emitting device 30 are about 0.5 mm, realizing an ultra-compact light-emitting device 30 that can be mounted on a catheter 50. In the example of FIG. 18, the thickness of the insulating layer 36 is thinner than the thickness of the light-emitting element 31.

 図21は、作製した光照射デバイスの電気特性と光出力特性を示す図、図22は熱抵抗を示す図である。この光照射デバイスの特性は、第8実施形態の構成のサンプルを作製して測定されたものである。用いた発光素子11の共振器長(Z方向の長さ)は1.5mm、幅(X方向の長さ)は0.2mm、発振波長は640nmである。支持体12は、厚さ(Y方向の長さ)0.1mmのAlN基板である。ミラーは銀ミラーであり、底面のサイズ(長さ×幅)が0.3mm×0.2mm、高さが0.2mmである。第1絶縁電線14aと第2絶縁電線14bは、直径0.1mm、長さ1.5mのポリウレタン銅線である。絶縁層16は、ポリシラザンコートである。 Figure 21 shows the electrical characteristics and optical output characteristics of the fabricated light irradiation device, and Figure 22 shows the thermal resistance. The characteristics of this light irradiation device were measured by fabricating a sample of the configuration of the eighth embodiment. The light emitting element 11 used had a resonator length (length in the Z direction) of 1.5 mm, a width (length in the X direction) of 0.2 mm, and an oscillation wavelength of 640 nm. The support 12 was an AlN substrate with a thickness (length in the Y direction) of 0.1 mm. The mirror was a silver mirror, with a bottom surface size (length x width) of 0.3 mm x 0.2 mm and a height of 0.2 mm. The first insulated wire 14a and the second insulated wire 14b were polyurethane copper wires with a diameter of 0.1 mm and a length of 1.5 m. The insulating layer 16 was a polysilazane coat.

 図21の横軸は、絶縁電線14を介して印加される電流値[mA]、左側の縦軸は光出力[mW]、右側の縦軸は電圧[V]である。図中の黒マークは電流対光出力特性、白マークは電流対電圧特性を示す。電流の増加に応じて光出力が増大し、100mAの注入電流で、30mWの光パワーが得られる。 The horizontal axis of Figure 21 is the current value [mA] applied through the insulated wire 14, the vertical axis on the left is the optical output [mW], and the vertical axis on the right is the voltage [V]. The black marks in the figure indicate the current vs. optical output characteristics, and the white marks indicate the current vs. voltage characteristics. The optical output increases as the current increases, and an optical power of 30 mW is obtained with an injection current of 100 mA.

 図22の横軸は時間[秒]、縦軸は熱抵抗[K/W]である。熱抵抗は、光照射デバイスの動作がオンにされてから、0.1秒程度で飽和する。光照射デバイスの動作中に冷媒51で冷却することで、支持体12、絶縁電線14、及び絶縁層16から熱を効率よく逃がして、光照射デバイスの動作を安定化できる。 The horizontal axis of FIG. 22 is time [seconds], and the vertical axis is thermal resistance [K/W]. The thermal resistance saturates about 0.1 seconds after the light irradiation device is turned on. By cooling with the refrigerant 51 while the light irradiation device is in operation, heat can be efficiently released from the support 12, the insulated wire 14, and the insulating layer 16, stabilizing the operation of the light irradiation device.

 以上、特定の構成例に基づいて説明してきたが、本開示は上述した構成例に限定されない。たとえば、第8実施形態で、光出射を妨げない第2絶縁電線14bを、支持体12の先端から+Z方向に引き出して、放熱部材として機能させてもよい。第8実施形態または第10実施形態の構成で、支持体12の発光素子搭載面121上に発光素子とともにフォトダイオード等の光検出器を配置して、生体センサとして用いてもよい。第10実施形態の構成では、2つの発光素子31を支持体12に搭載するかわりに、発光素子31と受光素子を1つずつ搭載してもよい。絶縁電線14及び34として2芯エナメル線を用いる場合は、一本の金属配線を発光素子11または31への電気信号の供給に使用し、もう一本の金属配線を光検出器から出力される信号の読み出し配線として使用してもよい。 Although the above description has been based on specific configuration examples, the present disclosure is not limited to the above configuration examples. For example, in the eighth embodiment, the second insulated electric wire 14b that does not interfere with light emission may be drawn out from the tip of the support 12 in the +Z direction to function as a heat dissipation member. In the configuration of the eighth or tenth embodiment, a light detector such as a photodiode may be arranged together with a light emitting element on the light emitting element mounting surface 121 of the support 12 to be used as a biosensor. In the configuration of the tenth embodiment, instead of mounting two light emitting elements 31 on the support 12, one light emitting element 31 and one light receiving element may be mounted. When a two-core enamel wire is used as the insulated electric wires 14 and 34, one metal wiring may be used to supply an electrical signal to the light emitting element 11 or 31, and the other metal wiring may be used as a readout wiring for a signal output from the photodetector.

 第8実施形態から第10実施形態の光照射デバイス10(10A及び10Bを含む)、20、及び30は、内視鏡と組み合わせて用いられてもよい。発光素子11、及び31は、治療用のレーザ光源としてだけでなく、センシング光源や照明光源としても利用可能である。いずれの場合も、発光素子からの熱を外部に放熱可能な放熱性と、冷媒中での絶縁性を確保するのに十分な電気絶縁性を備え、かつ、カテーテルに実装可能な光照射デバイスとしての効果を発揮する。光ファイバと異なり、絶縁被膜を有する絶縁電線は屈曲性に強い。また、発光素子自体を支持体12に搭載する構成は、集積性に優れ、センサへの適用範囲が広い。 The light irradiation devices 10 (including 10A and 10B), 20, and 30 of the eighth to tenth embodiments may be used in combination with an endoscope. The light emitting elements 11 and 31 can be used not only as laser light sources for treatment, but also as sensing light sources and illumination light sources. In either case, they have the heat dissipation properties to dissipate heat from the light emitting elements to the outside, and sufficient electrical insulation to ensure insulation in the refrigerant, and are effective as light irradiation devices that can be mounted on catheters. Unlike optical fibers, insulated electric wires with insulating coatings are resistant to bending. In addition, the configuration in which the light emitting elements themselves are mounted on the support 12 has excellent integration properties and a wide range of applications for sensors.

 本開示は、医療用のカテーテルに挿入される光照射デバイスのみならず、他の医療用途などでも使用できる。また、冷媒と併用した局所的な光照射を必要とするようなセンサなどの用途にも適用可能である。 The present disclosure can be used not only as a light irradiation device inserted into a medical catheter, but also in other medical applications. It can also be applied to applications such as sensors that require localized light irradiation in combination with a refrigerant.

 第1~第7実施形態の光照射デバイスは、医療用途で生体の内部に配置されるものに限定されず、精密機械等の内部の狭小なスペースに配置され、精密機械等の内部を検査するために用いられる照明光源としても利用可能である。 The light irradiation devices of the first to seventh embodiments are not limited to those placed inside living bodies for medical purposes, but can also be placed in small spaces inside precision machinery, etc., and used as illumination light sources for inspecting the inside of precision machinery, etc.

 (第11実施形態)
 図23は、第11実施形態の光照射デバイス10Kの構成の第1例を示す模式的断面図である。図24は、第11実施形態の光照射デバイス10Kの構成の第2例を示す模式的断面図である。図25は、第11実施形態の光照射デバイス10Kの構成の第3例を示す模式的断面図である。図23~図25は、それぞれ長手方向Pを有する長尺状の光照射デバイス10Kの、長手方向Pに沿った中心軸C0を含む断面を示している。
Eleventh Embodiment
Fig. 23 is a schematic cross-sectional view showing a first example of the configuration of the light irradiating device 10K of the 11th embodiment. Fig. 24 is a schematic cross-sectional view showing a second example of the configuration of the light irradiating device 10K of the 11th embodiment. Fig. 25 is a schematic cross-sectional view showing a third example of the configuration of the light irradiating device 10K of the 11th embodiment. Figs. 23 to 25 each show a cross section including a central axis C0 along the longitudinal direction P of an elongated light irradiating device 10K having a longitudinal direction P.

 第8実施形態~第10実施形態と同様に、光照射デバイス10Kも、カテーテル50(図11、及び図16参照)に実装されて使用され、光照射デバイス10Kとカテーテル50で生体内光照射アセンブリが構成され得る。第11実施形態では、光出射部60は、発光素子11と、発光素子11を支持する支持体12-3と、を有する。支持体12-3は、X線等の放射線に対して不透過性を有する部材を含有する。例えば、支持体12-3には、Cu-WまたはCu-Mоが含まれる。支持体12-3が、X線等の放射線に対して不透過性を有する部材を含有することにより、別途マーカー部材を設ける必要がない。支持体12-3は、光出射部60を挟んで光学部品40の反対側に切り欠き12cを有している。支持体12-3自身がマーカー部材またはマーカー部を兼ねることができるため、光照射デバイス10Kを小型化することができる。発光素子11は支持体12-3に固定されており、支持体12-3と光出射面111が近接して配置されていることから、光照射の向きの精度が向上する。支持体12-3は、Cu-WまたはCu-Mоからなるブロックであってもよい。支持体12-3が導電性を有することにより、支持体12-3自身が導電層を兼ねてもよい。 Similar to the eighth to tenth embodiments, the light irradiation device 10K is also mounted on a catheter 50 (see Figures 11 and 16) for use, and the light irradiation device 10K and the catheter 50 can form an in vivo light irradiation assembly. In the eleventh embodiment, the light emitting unit 60 has a light emitting element 11 and a support 12-3 that supports the light emitting element 11. The support 12-3 contains a material that is opaque to radiation such as X-rays. For example, the support 12-3 contains Cu-W or Cu-Mo. Since the support 12-3 contains a material that is opaque to radiation such as X-rays, there is no need to provide a separate marker member. The support 12-3 has a notch 12c on the opposite side of the optical component 40 across the light emitting unit 60. Since the support 12-3 itself can serve as a marker member or marker unit, the light irradiation device 10K can be made smaller. The light emitting element 11 is fixed to the support 12-3, and the support 12-3 and the light emitting surface 111 are arranged close to each other, improving the accuracy of the direction of light irradiation. The support 12-3 may be a block made of Cu-W or Cu-Mo. If the support 12-3 is conductive, the support 12-3 itself may also serve as a conductive layer.

 発光素子11は、支持体12-3の上面である第1面12aに配置されている。発光素子11は、長手方向Pと交差する光出射面111から長手方向Pに沿う方向に光を出射できる。図23に示す例では、発光素子11は+Z方向に光を出射する。光照射デバイス10Kは、光出射部60が発光素子11と支持体12-3とを有することで、支持体12-3を発光素子11の熱を放熱する放熱部材として利用することができる。 The light emitting element 11 is disposed on the first surface 12a, which is the upper surface of the support 12-3. The light emitting element 11 can emit light in a direction along the longitudinal direction P from the light emitting surface 111 that intersects with the longitudinal direction P. In the example shown in FIG. 23, the light emitting element 11 emits light in the +Z direction. In the light irradiation device 10K, the light emitting section 60 includes the light emitting element 11 and the support 12-3, and therefore the support 12-3 can be used as a heat dissipation member that dissipates heat from the light emitting element 11.

 支持体12-3は、X線等の放射線に対して不透過性を有し、かつ、切り欠き12cを有しており、第1方向Q1から視たときと第2方向Q2から視たときとで形状及び位置の少なくとも一方が異なる。従って、光照射デバイス10Kが内部に配置された生体をX線CT等で撮影すると、支持体12-3の像が撮影画像で確認できる。X線CTによる撮影画像に映る支持体12-3の像の形状及び位置の少なくとも一方を確認することにより、生体内に配置された支持体12の向きを確認できる。支持体12-3の向きは長手方向Pに対して既知であるとともに、光照射デバイス10Kは、発光素子11から出射された光を長手方向Pに対して交差する予め定められた方向Rに照射可能である。従って、本実施形態では、光照射デバイス10Kを用いることにより、X線CTの撮影画像に基づき確認された支持体12-3の向きから、光照射デバイス10Kからの光の照射方向を把握できる。 The support 12-3 is opaque to radiation such as X-rays, has a notch 12c, and at least one of the shape and position is different when viewed from the first direction Q1 and the second direction Q2. Therefore, when a living body with the light irradiation device 10K placed inside is photographed by X-ray CT or the like, the image of the support 12-3 can be confirmed in the photographed image. By confirming at least one of the shape and position of the image of the support 12-3 reflected in the photographed image by X-ray CT, the orientation of the support 12 placed in the living body can be confirmed. The orientation of the support 12-3 is known with respect to the longitudinal direction P, and the light irradiation device 10K can irradiate light emitted from the light emitting element 11 in a predetermined direction R that intersects with the longitudinal direction P. Therefore, in this embodiment, by using the light irradiation device 10K, the irradiation direction of light from the light irradiation device 10K can be grasped from the orientation of the support 12-3 confirmed based on the photographed image of the X-ray CT.

 図23に示す第1例では、支持体12-3が切り欠き12cを有していたが、図24に示す第2例のように、支持体12-4は、支持体12-4の上面である第1面12aから+Y方向に突出する突出部12dを有していてもよい。突出部12dを含む支持体12-4は、一体の部材として形成されていてもよいし、異なるサイズの直方体形状の部材を接合することにより形成されていてもよい。支持体12-4は支持体12-3と同様に、X線等の放射線に対して不透過性を有する。 In the first example shown in FIG. 23, the support 12-3 has a notch 12c, but as in the second example shown in FIG. 24, the support 12-4 may have a protrusion 12d that protrudes in the +Y direction from the first surface 12a, which is the upper surface of the support 12-4. The support 12-4 including the protrusion 12d may be formed as an integral member, or may be formed by joining rectangular parallelepiped members of different sizes. Like the support 12-3, the support 12-4 is opaque to radiation such as X-rays.

 あるいは、図25に示す第3例のように、支持体12-5と、光学部品40に設けられるマーカー部20Dを併用してもよい。支持体12-5は支持体12-3と同様に、X線等の放射線に対して不透過性を有する。 Alternatively, as in the third example shown in FIG. 25, the support 12-5 may be used in combination with a marker portion 20D provided on the optical component 40. The support 12-5, like the support 12-3, is opaque to radiation such as X-rays.

 この出願は、2023年12月22日に日本国特許庁に出願された日本国特許出願第2023-217446号、並びに、2023年12月22日に日本国特許庁に出願された日本国特許出願第2023-217447号に基づいて、その優先権を主張するものであり、これらの日本国特許出願の全内容を含む。 This application claims priority based on Japanese Patent Application No. 2023-217446 filed with the Japan Patent Office on December 22, 2023, and Japanese Patent Application No. 2023-217447 filed with the Japan Patent Office on December 22, 2023, and includes the entire contents of these Japanese patent applications.

 本開示の実施形態は、例えば、以下のような構成を含んでよい。
<項1> 長手方向を有する長尺状の光照射デバイスであって、光出射部と、前記光出射部と直接的または間接的に接続され、放射線不透過性を有するマーカー部材と、を備え、前記長手方向と直交する方向における第1方向から視た前記マーカー部材は、前記長手方向と直交する方向における、前記第1方向とは異なる第2方向から視た前記マーカー部材に対し、形状及び位置の少なくとも一方が異なり、前記光出射部から出射された光を前記長手方向に対して交差する予め定められた方向に照射可能な、光照射デバイスである。
<項2> 前記マーカー部材は、長尺な基部と、前記基部の表面に設けられた凸部及び凹部の少なくとも一方と、を有する、前記<項1>に記載の光照射デバイスである。
<項3> 前記光出射部から前記長手方向に沿う方向に出射された光を、前記長手方向に交差する方向に反射する光学部品を有する、前記<項1>又は前記<項2>に記載の光照射デバイスである。
<項4> 前記光出射部は、発光素子と、前記発光素子を支持する支持体と、を有する、前記<項1>から前記<項3>のいずれか1つに記載の光照射デバイスである。
<項5> 前記発光素子及び前記支持体の少なくとも一方は、絶縁層で被覆されている、前記<項4>に記載の光照射デバイスである。
<項6> 前記発光素子と電気的に接続される絶縁電線を有し、前記絶縁電線と前記マーカー部材とは電気的に絶縁されている、前記<項4>又は前記<項5>に記載の光照射デバイスである。
<項7> 開口を含み、前記発光素子の少なくとも一部及び前記支持体の少なくとも一部のそれぞれを内側に配置可能な筐体と、前記筐体の前記開口を封止する透光性部材と、を有し、前記透光性部材は、前記光出射部から出射され、前記長手方向に対して交差する予め定められた方向に照射される光を透過する、前記<項4>から前記<項6>のいずれか1つに記載の光照射デバイスである。
<項8> 前記発光素子は、前記筐体の内側に配置され、前記筐体の内側は気密封止されている、前記<項7>に記載の光照射デバイスである。
<項9> 長手方向を有する長尺状の光照射デバイスであって、光出射部と、前記光出射部が固定される支持体と、放射線不透過性を有するマーカー部と、を備え、前記長手方向と直交する方向における第1方向から視た前記マーカー部は、前記長手方向と直交する方向における、前記第1方向とは異なる第2方向から視た前記マーカー部に対し、形状及び位置の少なくとも一方が異なり、前記マーカー部は、前記支持体に設けられ、前記光出射部から出射された光を前記長手方向に対して交差する予め定められた方向に照射可能な、光照射デバイスである。
<項10> 前記支持体は、前記光出射部が配置される第1面と、前記第1面とは反対側に位置する第2面と、を含み、前記マーカー部は、前記支持体の前記第2面に設けられる、前記<項9>に記載の光照射デバイスである。
<項11> 前記マーカー部の少なくとも一部の厚みが、40μm以上100μm以下である、前記<項9>又は前記<項10>に記載の光照射デバイスである。
<項12> 前記支持体は、前記光出射部が配置される第1面と、前記第1面とは反対側に位置する第2面と、を含み、前記第1面と平行な方向である第3方向から視たときの前記マーカー部の位置は、前記長手方向に平行な前記光照射デバイスの中心軸を回転軸として、前記光照射デバイスを180度回転させて前記第3方向から視たときの前記マーカー部の位置に対し、前記支持体における前記第1面と前記第2面との間の距離の2倍以上異なる、前記<項9>から前記<項11>のいずれか1つに記載の光照射デバイスである。
<項13> 前記支持体は、前記光出射部が配置される第1面と、前記第1面とは反対側に位置する第2面と、を含み、前記マーカー部は、前記第1面及び前記第2面の双方に設けられ、前記第1面に設けられた前記マーカー部は、前記第2面に設けられた前記マーカー部と、前記マーカー部の大きさ及び位置の少なくとも一方が異なる、前記<項9>から前記<項12>のいずれか1つに記載の光照射デバイスである。
<項14> 前記光出射部は発光素子であり、前記発光素子が前記支持体に配置されている、前記<項9>から前記<項13>のいずれか1つに記載の光照射デバイスである。
<項15> 前記光出射部はファイバであり、前記ファイバが前記支持体に配置されている、前記<項9>から前記<項14>のいずれか1つに記載の光照射デバイスである。
<項16> 前記支持体は、前記光出射部が配置される第1面と、前記第1面とは反対側に位置する第2面と、を含み、前記支持体の前記第2面は、第1領域と、前記第1領域とは異なる第2領域と、を含み、前記第1領域には、前記マーカー部が設けられ、前記第2領域には、絶縁電線が配置される、前記<項14>に記載の光照射デバイスである。
<項17> 長手方向を有する長尺状の光照射デバイスであって、光出射部と、前記光出射部が固定される支持体と、前記光出射部から出射された光に対し、反射、屈折及び回折の少なくとも1つの光学作用を付与する光学部品と、放射線不透過性を有するマーカー部と、を備え、前記長手方向と直交する方向における第1方向から視た前記マーカー部は、前記長手方向と直交する方向における、前記第1方向とは異なる第2方向から視た前記マーカー部に対し、形状及び位置の少なくとも一方が異なり、前記マーカー部は、前記光学部品に設けられ、前記光出射部から出射された前記光を前記長手方向に対して交差する予め定められた方向に照射可能な、光照射デバイスである。
<項18> 前記光出射部は、前記長手方向に沿う方向に前記光を出射し、前記光学部品は、前記光出射部からの前記光を前記長手方向と交差する方向に反射する反射面を含み、前記マーカー部は、前記光学部品における前記反射面が設けられた領域以外の領域に設けられる、前記<項17>に記載の光照射デバイスである。
<項19> 前記マーカー部に加え、前記支持体および前記光学部品以外の部分に第2のマーカー部を備える、前記<項17>に記載の光照射デバイスである。
<項20> 前記支持体と前記光学部品が一体的に形成されている、前記<項17>から前記<項19>のいずれか1つに記載の光照射デバイスである。
<項21> 長手方向を有する長尺状の光照射デバイスであって、発光素子と前記発光素子を支持する支持体とを有する光出射部を備え、前記支持体は、放射線不透過性を有する部材を含有し、前記長手方向と直交する方向における第1方向から視た前記支持体は、前記長手方向と直交する方向における、前記第1方向とは異なる第2方向から視た前記支持体に対し、形状及び位置の少なくとも一方が異なり、前記光出射部から出射された光を前記長手方向に対して交差する予め定められた方向に照射可能な、光照射デバイスである。
An embodiment of the present disclosure may include, for example, the following configuration.
<Item 1> An elongated light-irradiation device having a longitudinal direction, comprising: a light-emitting unit; and a marker member that is directly or indirectly connected to the light-emitting unit and has radiopaque properties, wherein the marker member viewed from a first direction in a direction perpendicular to the longitudinal direction has at least one of a shape and a position different from that of the marker member viewed from a second direction perpendicular to the longitudinal direction, the second direction being different from the first direction, and the light-irradiation device is capable of irradiating light emitted from the light-emitting unit in a predetermined direction intersecting the longitudinal direction.
<Item 2> The light irradiation device according to <Item 1>, wherein the marker member has a long base and at least one of a convex portion and a concave portion provided on a surface of the base.
<Item 3> The light irradiation device according to <Item 1> or <Item 2>, further comprising an optical component that reflects light emitted from the light emitting portion in a direction along the longitudinal direction, in a direction intersecting the longitudinal direction.
<Item 4> The light irradiation device according to any one of <Item 1> to <Item 3>, wherein the light output section has a light emitting element and a support body that supports the light emitting element.
<Item 5> The light irradiation device according to <Item 4>, wherein at least one of the light emitting element and the support is covered with an insulating layer.
<Item 6> The light irradiation device according to <Item 4> or <Item 5>, further comprising an insulated wire electrically connected to the light emitting element, the insulated wire being electrically insulated from the marker member.
<Item 7> The light irradiation device according to any one of <Item 4> to <Item 6>, further comprising: a housing including an opening, into which at least a part of the light-emitting element and at least a part of the support body can be disposed; and a light-transmitting member sealing the opening of the housing, wherein the light-transmitting member transmits light that is emitted from the light emitting portion and is irradiated in a predetermined direction intersecting with the longitudinal direction.
<Item 8> The light irradiation device according to <Item 7>, wherein the light emitting element is disposed inside the housing, and the inside of the housing is hermetically sealed.
<Item 9> An elongated light irradiation device having a longitudinal direction, comprising: a light output section; a support to which the light output section is fixed; and a radiopaque marker section, wherein the marker section viewed from a first direction in a direction perpendicular to the longitudinal direction has at least one of a shape and a position different from that of the marker section viewed from a second direction perpendicular to the longitudinal direction, the second direction being different from the first direction; the marker section is provided on the support; and the light irradiation device is capable of irradiating light output from the light output section in a predetermined direction intersecting the longitudinal direction.
<Item 10> The light irradiation device according to <Item 9>, wherein the support includes a first surface on which the light emitting portion is arranged and a second surface located opposite to the first surface, and the marker portion is provided on the second surface of the support.
<Item 11> The light irradiation device according to <Item 9> or <Item 10>, wherein a thickness of at least a part of the marker portion is 40 μm or more and 100 μm or less.
<Item 12> The light irradiation device according to any one of <Item 9> to <Item 11>, wherein the support includes a first surface on which the light emitting portion is arranged and a second surface located opposite to the first surface, and a position of the marker portion when viewed from a third direction that is a direction parallel to the first surface is different from a position of the marker portion when the light irradiation device is rotated 180 degrees around a central axis of the light irradiation device that is parallel to the longitudinal direction as an axis of rotation and viewed from the third direction by twice or more of a distance between the first surface and the second surface of the support.
<Item 13> The light irradiation device described in any one of <Item 9> to <Item 12>, wherein the support includes a first surface on which the light emitting portion is arranged and a second surface located opposite to the first surface, the marker portion is provided on both the first surface and the second surface, and the marker portion provided on the first surface differs from the marker portion provided on the second surface in at least one of a size and a position of the marker portion.
<Item 14> The light irradiation device according to any one of <Item 9> to <Item 13>, wherein the light emitting portion is a light emitting element, and the light emitting element is disposed on the support body.
<Item 15> The light irradiation device according to any one of <Item 9> to <Item 14>, wherein the light emitting portion is a fiber, and the fiber is disposed on the support body.
<Item 16> The light irradiation device described in <Item 14>, wherein the support includes a first surface on which the light emitting portion is arranged and a second surface located opposite to the first surface, the second surface of the support includes a first region and a second region different from the first region, the marker portion is provided in the first region, and an insulated wire is arranged in the second region.
<Item 17> An elongated light irradiation device having a longitudinal direction, comprising: a light emitting section; a support to which the light emitting section is fixed; an optical component that imparts at least one of optical effects of reflection, refraction, and diffraction to light emitted from the light emitting section; and a marker section having radiopacity, wherein the marker section viewed from a first direction in a direction perpendicular to the longitudinal direction has at least one of a shape and a position different from that of the marker section viewed from a second direction perpendicular to the longitudinal direction, the second direction being different from the first direction; the marker section is provided on the optical component; and the light irradiation device is capable of irradiating the light emitted from the light emitting section in a predetermined direction intersecting the longitudinal direction.
<Item 18> The light irradiation device according to <Item 17>, wherein the light emitting portion emits the light in a direction along the longitudinal direction, the optical component includes a reflective surface that reflects the light from the light emitting portion in a direction intersecting the longitudinal direction, and the marker portion is provided in a region of the optical component other than a region where the reflective surface is provided.
<Item 19> The light irradiation device according to <Item 17>, further comprising, in addition to the marker portion, a second marker portion in a portion other than the support body and the optical component.
<Item 20> The light irradiation device according to any one of <Item 17> to <Item 19>, wherein the support body and the optical component are integrally formed.
<Item 21> An elongated light irradiation device having a longitudinal direction, comprising: a light emitting unit having a light emitting element and a support supporting the light emitting element, the support containing a member having radiopaque properties, the support viewed from a first direction in a direction perpendicular to the longitudinal direction differs in at least one of a shape and a position from the support viewed from a second direction perpendicular to the longitudinal direction, the second direction being different from the first direction, and the light irradiation device being capable of irradiating light emitted from the light emitting unit in a predetermined direction intersecting the longitudinal direction.

 10、10A、10B、10C、10D、10E、10F、10G、10H、10J、10K、20、30 光照射デバイス
 11、31 発光素子
 111 光出射面
 12、12-1、12-2、12-3、12-4 支持体
 12a 第1面
 12b 第2面
 12b1 第1領域
 12b2 第2領域
 12c 切り欠き
 12d 突出部
 121 発光素子搭載面
 122 裏面
 124、125 導電層
 14、24、34 絶縁電線
 14a、24a、34a 第1絶縁電線
 14b、24b、34b 第2絶縁電線
 16、16A、16B、26,36 絶縁層
 17、27 光学部品
 18 ファイバ
 20A マーカー部材
 20D マーカー部
 20J 第2のマーカー部
 20v 第1位置
 20u 第2位置
 t1 厚み
 t2、d 距離
 30A 筐体
 31A 開口
 32 透光性部材
 40 光学部品
 41 反射面
 42 面
 50 カテーテル
 51 冷媒
 60 光出射部
 100、200 生体内光照射アセンブリ
 Q1 第1方向
 Q2 第2方向
 Q3 第3方向
 P  長手方向
 R  方向
10, 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H, 10J, 10K, 20, 30 Light irradiation device 11, 31 Light emitting element 111 Light emitting surface 12, 12-1, 12-2, 12-3, 12-4 Support 12a First surface 12b Second surface 12b1 First region 12b2 Second region 12c Notch 12d Protrusion 121 Light emitting element mounting surface 122 Back surface 124, 125 Conductive layer 14, 24, 34 Insulated wire 14a, 24a, 34a First insulated wire 14b, 24b, 34b Second insulated wire 16, 16A, 16B, 26, 36 Insulating layer 17, 27 Optical component 18 Fiber 20A marker member 20D marker portion 20J second marker portion 20v first position 20u second position t1 thickness t2, d distance 30A housing 31A opening 32 light-transmitting member 40 optical component 41 reflecting surface 42 surface 50 catheter 51 refrigerant 60 light emitting portion 100, 200 in-vivo light irradiation assembly Q1 first direction Q2 second direction Q3 third direction P longitudinal direction R direction

Claims (21)

 長手方向を有する長尺状の光照射デバイスであって、
 光出射部と、
 前記光出射部と直接的または間接的に接続され、放射線不透過性を有するマーカー部材と、を備え、
 前記長手方向と直交する方向における第1方向から視た前記マーカー部材は、前記長手方向と直交する方向における、前記第1方向とは異なる第2方向から視た前記マーカー部材に対し、形状及び位置の少なくとも一方が異なり、
 前記光出射部から出射された光を前記長手方向に対して交差する予め定められた方向に照射可能な、光照射デバイス。
An elongated light irradiation device having a longitudinal direction,
A light emitting portion;
A marker member that is directly or indirectly connected to the light emitting portion and has radiopacity;
The marker member viewed from a first direction perpendicular to the longitudinal direction has at least one of a shape and a position different from that of the marker member viewed from a second direction perpendicular to the longitudinal direction, the second direction being different from the first direction;
A light irradiation device capable of irradiating light emitted from the light emitting portion in a predetermined direction intersecting the longitudinal direction.
 前記マーカー部材は、
 長尺な基部と、
 前記基部の表面に設けられた凸部及び凹部の少なくとも一方と、を有する、請求項1に記載の光照射デバイス。
The marker member is
A long base and
The light irradiation device according to claim 1 , further comprising at least one of a convex portion and a concave portion provided on a surface of the base.
 前記光出射部から前記長手方向に沿う方向に出射された光を、前記長手方向に交差する方向に反射する光学部品を有する、請求項1又は請求項2に記載の光照射デバイス。 The light irradiation device according to claim 1 or 2, further comprising an optical component that reflects light emitted from the light emitting portion in a direction along the longitudinal direction in a direction intersecting the longitudinal direction.  前記光出射部は、発光素子と、前記発光素子を支持する支持体と、を有する、請求項1から請求項3のいずれか1項に記載の光照射デバイス。 The light irradiation device according to any one of claims 1 to 3, wherein the light emitting section has a light emitting element and a support that supports the light emitting element.  前記発光素子及び前記支持体の少なくとも一方は、絶縁層で被覆されている、請求項4に記載の光照射デバイス。 The light irradiation device according to claim 4, wherein at least one of the light emitting element and the support is covered with an insulating layer.  前記発光素子と電気的に接続される絶縁電線を有し、
 前記絶縁電線と前記マーカー部材とは電気的に絶縁されている、請求項4又は請求項5に記載の光照射デバイス。
an insulated wire electrically connected to the light-emitting element;
The light irradiation device according to claim 4 or 5, wherein the insulated wire and the marker member are electrically insulated from each other.
 開口を含み、前記発光素子の少なくとも一部及び前記支持体の少なくとも一部のそれぞれを内側に配置可能な筐体と、
 前記筐体の前記開口を封止する透光性部材と、を有し、
 前記透光性部材は、前記光出射部から出射され、前記長手方向に対して交差する予め定められた方向に照射される光を透過する、請求項4から請求項6のいずれか1項に記載の光照射デバイス。
a housing including an opening, in which at least a portion of the light emitting element and at least a portion of the support body can be disposed;
a light-transmitting member that seals the opening of the housing,
The light illumination device according to claim 4 , wherein the light-transmitting member transmits light that is emitted from the light emitting portion and is irradiated in a predetermined direction intersecting the longitudinal direction.
 前記発光素子は、前記筐体の内側に配置され、
 前記筐体の内側は気密封止されている、請求項7に記載の光照射デバイス。
The light emitting element is disposed inside the housing,
The light irradiation device according to claim 7 , wherein the inside of the housing is hermetically sealed.
 長手方向を有する長尺状の光照射デバイスであって、
 光出射部と、
 前記光出射部が固定される支持体と、
 放射線不透過性を有するマーカー部と、を備え、
 前記長手方向と直交する方向における第1方向から視た前記マーカー部は、前記長手方向と直交する方向における、前記第1方向とは異なる第2方向から視た前記マーカー部に対し、形状及び位置の少なくとも一方が異なり、
 前記マーカー部は、前記支持体に設けられ、
 前記光出射部から出射された光を前記長手方向に対して交差する予め定められた方向に照射可能な、光照射デバイス。
An elongated light irradiation device having a longitudinal direction,
A light emitting portion;
A support to which the light emitting portion is fixed;
A marker portion having radiopacity,
The marker portion viewed from a first direction perpendicular to the longitudinal direction has at least one of a shape and a position different from that of the marker portion viewed from a second direction perpendicular to the longitudinal direction, the second direction being different from the first direction;
The marker portion is provided on the support,
A light irradiation device capable of irradiating light emitted from the light emitting portion in a predetermined direction intersecting the longitudinal direction.
 前記支持体は、
  前記光出射部が配置される第1面と、
  前記第1面とは反対側に位置する第2面と、を含み、
 前記マーカー部は、前記支持体の前記第2面に設けられる、請求項9に記載の光照射デバイス。
The support is
A first surface on which the light emitting portion is disposed;
a second surface located opposite the first surface,
The light irradiation device according to claim 9 , wherein the marker portion is provided on the second surface of the support body.
 前記マーカー部の少なくとも一部の厚みが、20μm以上100μm以下である、請求項9又は請求項10に記載の光照射デバイス。 The light irradiation device according to claim 9 or 10, wherein the thickness of at least a portion of the marker portion is 20 μm or more and 100 μm or less.  前記支持体は、
  前記光出射部が配置される第1面と、
  前記第1面とは反対側に位置する第2面と、を含み、
 前記第1面と平行な方向である第3方向から視たときの前記マーカー部の位置は、前記長手方向に平行な前記光照射デバイスの中心軸を回転軸として、前記光照射デバイスを180度回転させて前記第3方向から視たときの前記マーカー部の位置に対し、前記支持体における前記第1面と前記第2面との間の距離の2倍以上異なる、請求項9から請求項11のいずれか1項に記載の光照射デバイス。
The support is
A first surface on which the light emitting portion is disposed;
a second surface located opposite the first surface,
12. The light irradiation device according to claim 9, wherein a position of the marker part when viewed from a third direction that is a direction parallel to the first surface is different from a position of the marker part when the light irradiation device is rotated 180 degrees around a central axis of the light irradiation device that is parallel to the longitudinal direction as an axis of rotation and viewed from the third direction by twice or more of a distance between the first surface and the second surface of the support.
 前記支持体は、
  前記光出射部が配置される第1面と、
  前記第1面とは反対側に位置する第2面と、を含み、
 前記マーカー部は、前記第1面及び前記第2面の双方に設けられ、
 前記第1面に設けられた前記マーカー部は、前記第2面に設けられた前記マーカー部と、前記マーカー部の大きさ及び位置の少なくとも一方が異なる、請求項9から請求項12のいずれか1項に記載の光照射デバイス。
The support is
A first surface on which the light emitting portion is disposed;
a second surface located opposite the first surface,
The marker portion is provided on both the first surface and the second surface,
13. The light irradiation device according to claim 9, wherein the marker portion provided on the first surface is different from the marker portion provided on the second surface in at least one of a size and a position of the marker portion.
 前記光出射部は発光素子であり、
 前記発光素子が前記支持体に配置されている、請求項9から請求項13のいずれか1項に記載の光照射デバイス。
the light emitting unit is a light emitting element,
The light irradiation device according to claim 9 , wherein the light emitting element is disposed on the support.
 前記光出射部はファイバであり、
 前記ファイバが前記支持体に配置されている、請求項9から請求項14のいずれか1項に記載の光照射デバイス。
the light output portion is a fiber;
15. The light emitting device according to any one of claims 9 to 14, wherein the fibre is arranged on the support.
 前記支持体は、
  前記光出射部が配置される第1面と、
  前記第1面とは反対側に位置する第2面と、を含み、
 前記支持体の前記第2面は、第1領域と、前記第1領域とは異なる第2領域と、を含み、
 前記第1領域には、前記マーカー部が設けられ、
 前記第2領域には、絶縁電線が配置される、請求項14に記載の光照射デバイス。
The support is
A first surface on which the light emitting portion is disposed;
a second surface located opposite the first surface,
The second surface of the support includes a first region and a second region different from the first region,
The marker portion is provided in the first region,
The light illumination device of claim 14 , wherein an insulated wire is disposed in the second region.
 長手方向を有する長尺状の光照射デバイスであって、
 光出射部と、
 前記光出射部が固定される支持体と、
 前記光出射部から出射された光に対し、反射、屈折及び回折の少なくとも1つの光学作用を付与する光学部品と、
 放射線不透過性を有するマーカー部と、を備え、
 前記長手方向と直交する方向における第1方向から視た前記マーカー部は、前記長手方向と直交する方向における、前記第1方向とは異なる第2方向から視た前記マーカー部に対し、形状及び位置の少なくとも一方が異なり、
 前記マーカー部は、前記光学部品に設けられ、
 前記光出射部から出射された前記光を前記長手方向に対して交差する予め定められた方向に照射可能な、光照射デバイス。
An elongated light irradiation device having a longitudinal direction,
A light emitting portion;
A support to which the light emitting portion is fixed;
an optical component that imparts at least one optical effect of reflection, refraction, or diffraction to the light emitted from the light emitting portion;
A marker portion having radiopacity,
The marker portion viewed from a first direction perpendicular to the longitudinal direction has at least one of a shape and a position different from that of the marker portion viewed from a second direction perpendicular to the longitudinal direction, the second direction being different from the first direction;
The marker portion is provided on the optical component,
A light irradiation device capable of irradiating the light emitted from the light emitting portion in a predetermined direction intersecting the longitudinal direction.
 前記光出射部は、前記長手方向に沿う方向に前記光を出射し、
 前記光学部品は、前記光出射部からの前記光を前記長手方向と交差する方向に反射する反射面を含み、
 前記マーカー部は、前記光学部品における前記反射面が設けられた領域以外の領域に設けられる、請求項17に記載の光照射デバイス。
The light emitting portion emits the light in a direction along the longitudinal direction,
the optical component includes a reflecting surface that reflects the light from the light emitting portion in a direction intersecting the longitudinal direction,
The light irradiation device according to claim 17 , wherein the marker portion is provided in an area of the optical component other than an area where the reflective surface is provided.
 前記マーカー部に加え、前記支持体および前記光学部品以外の部分に第2のマーカー部を備える、請求項17に記載の光照射デバイス。 The light irradiation device according to claim 17, further comprising, in addition to the marker portion, a second marker portion on a portion other than the support and the optical component.   前記支持体と前記光学部品が一体的に形成されている、請求項17から請求項19のいずれか1つに記載の光照射デバイス。 The light irradiation device according to any one of claims 17 to 19, wherein the support and the optical component are integrally formed.  長手方向を有する長尺状の光照射デバイスであって、
 発光素子と前記発光素子を支持する支持体とを有する光出射部を備え、
 前記支持体は、放射線不透過性を有する部材を含有し、
 前記長手方向と直交する方向における第1方向から視た前記支持体は、前記長手方向と直交する方向における、前記第1方向とは異なる第2方向から視た前記支持体に対し、形状及び位置の少なくとも一方が異なり、
  前記光出射部から出射された光を前記長手方向に対して交差する予め定められた方向に照射可能な、光照射デバイス。
An elongated light irradiation device having a longitudinal direction,
a light emitting portion having a light emitting element and a support for supporting the light emitting element;
The support contains a radiopaque material,
The support as viewed from a first direction perpendicular to the longitudinal direction has at least one of a shape and a position different from that of the support as viewed from a second direction perpendicular to the longitudinal direction, the second direction being different from the first direction;
A light irradiation device capable of irradiating light emitted from the light emitting portion in a predetermined direction intersecting the longitudinal direction.
PCT/JP2024/044980 2023-12-22 2024-12-19 Light radiation device Pending WO2025135119A1 (en)

Applications Claiming Priority (4)

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JP2023-217446 2023-12-22
JP2023217447 2023-12-22
JP2023-217447 2023-12-22
JP2023217446 2023-12-22

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11509436A (en) * 1995-06-07 1999-08-24 アベラ レーザー システムズ,インコーポレイテッド Optical fiber catheter and method
WO2011105631A1 (en) * 2010-02-26 2011-09-01 学校法人慶應義塾 Catheter performing photodynamic ablation of cardiac muscle tissue by photochemical reaction
WO2013049491A1 (en) * 2011-09-30 2013-04-04 Ohio Urologic Research, Llc Medical device and method for internal healing and antimicrobial purposes

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11509436A (en) * 1995-06-07 1999-08-24 アベラ レーザー システムズ,インコーポレイテッド Optical fiber catheter and method
WO2011105631A1 (en) * 2010-02-26 2011-09-01 学校法人慶應義塾 Catheter performing photodynamic ablation of cardiac muscle tissue by photochemical reaction
WO2013049491A1 (en) * 2011-09-30 2013-04-04 Ohio Urologic Research, Llc Medical device and method for internal healing and antimicrobial purposes

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