WO2025133380A1

WO2025133380A1 - Embedded antenna booster system

Info

Publication number: WO2025133380A1
Application number: PCT/EP2024/088326
Authority: WO
Inventors: Jaume Anguera; Aurora ANDÚJAR; Alejandro FERNÁNDEZ
Original assignee: Ignion SL
Current assignee: Ignion SL
Priority date: 2023-12-22
Filing date: 2024-12-23
Publication date: 2025-06-26
Anticipated expiration: 2026-06-22

Abstract

The present invention relates to a wireless device, able to operate in at least a frequency region and/or frequency band, comprising a radiating system that comprises a radiating structure comprising an embedded structure in a dielectric support that comprises an antenna element, advantageously being in some examples a booster element or radiation booster, a feeding line, typically comprising a conductive strip, a pads layout for allocating a matching network, at least one electrical connection from a first layer to a second layer of the dielectric support, and a dielectric material; the radiating structure also comprising at least one ground plane layer. In some embodiments, one of the at least one ground plane layer of the radiating structure is comprised in the dielectric support that comprises the embedded structure.

Description

EMBEDDED ANTENNA BOOSTER SYSTEM

FIELD OF THE INVENTION

The present invention relates to the field of wireless devices, able to operate in at least a frequency region and/or frequency band.

BACKGROUND OF THE INVENTION

Wireless devices able to operate in at least a frequency region and/or frequency band including non-resonant antenna elements, as it is the case for a wireless device using VAT technology, provide a non-customized solution in view of the antenna element, which can be allocated in small spaces in a PCB. There exists in literature VAT technology solutions, like for example the ones included and described in W02010/015365 A2, WO2014/012842 A1 , which comprise radiation boosters as described in. These solutions are non-customized solutions in view of the radiation booster, but they are not in view of the matching network and the corresponding pads layout since the matching network needs to be designed and tuned for each PCB or device. The WO2023/067196 patent discloses reconfigurable solutions for wireless devices by providing non-customized and versatile matching networks integrated in radiating systems comprising a non-resonant element, a ground plane element and a wireless matching core comprising those matching networks. But in WO2023/067196, a way of fabricating those solutions is not disclosed. In WO2014/012842 A1 , manufacturing methods of radiation booster structures are disclosed, but the solutions proposed are not non-customized solutions. The different designs of the matching network layouts used for each PCB introduce a variable that sometimes makes difficult the integration and design of a VAT solution. If a standard matching network pads layout is used, a client or a VAT pads technology designer will not have to worry about how to implement the matching network pads and layout in the PCB, easing the integration of the technology. So, having a VAT solution where the radiation booster and matching network pads layout are non-customized designs is an advantageous solution and a further step in the VAT technology evolution.

OBJECT AND SUMMARY OF THE INVENTION

The present invention relates to a wireless device, able to operate in at least one frequency region and/or frequency band, comprising a radiating system that comprises a radiating structure comprising an embedded structure in a dielectric support that comprises an antenna element, advantageously being in some examples a booster element or radiation booster, a feeding line, typically comprising a conductive strip, at least one electrical connection from a first layer to a second layer of the dielectric support, and a dielectric material; the radiating structure also comprising at least one ground plane layer. Typically, at least one of the electrical connections from a first layer to a second layer is connected to a transceiver, to ground, to other circuit components or elements, or to an input/output port of the radiating system. A radiating system comprising a radiating structure according to the present invention also comprises at least one input/output port, and a radiofrequency system that comprises a matching network or circuit that is allocated in a pads layout, said matching network connected to one of the input/output ports comprised in the radiating system. In some radiating system embodiments, said pads layout is also comprised in the embedded structure comprised in the radiating structure, so being comprised in a same dielectric support as the one that comprises the embedded structure. And in other embodiments, said pads layout is comprised in a portion of a ground plane layer of the radiating structure, preferably being a ground plane layer comprised in a dielectric support that also comprises the embedded structure. But, there are other radiating system embodiments where the pads layout is comprised in a portion of a ground plane layer that is not comprised in a dielectric support that comprises the embedded structure. So, in some radiating structure embodiments, at least one of the at least one ground plane layer of the radiating structure is comprised in the dielectric support that comprises the embedded structure related to the invention. In some of these last embodiments, the dielectric support comprising the embedded structure and a ground plane layer of the radiating structure is contained in a PCB (printed circuit board). And in other radiating structure embodiments, at least one of the at least one ground plane layer comprised in the radiating structure is not comprised in the same dielectric support as the embedded structure one.

It is interesting to note that a wireless device according to the invention is able to operate at any wireless communication protocol, covered by the corresponding frequency regions and/or frequency bands.

As mentioned before, an embedded structure related to the invention comprises an antenna element, advantageously being a radiation booster or a booster element in some examples. In the context of this invention, a radiation booster or booster element refers to a radiation booster as described and defined in the patent documents WO2010/015365 A2, WO2014/012842 A1 and WO2016/012507 A1 , incorporated by reference herein. The antenna element is in other embodiments an electrically-short antenna. A radiation booster typically features a maximum size smaller than the free-space wavelength over 20 at the smallest frequency of a first frequency region of operation and, according to this invention, an electrically-short antenna features a maximum size being between the free-space wavelength over 20 and the free-space wavelength over 5, also at the smallest frequency of a first frequency region of operation. Some examples of a radiating structure related to the present invention comprise a modular antenna element that provides flexibility on the radiating structure configuration in view of for example the frequency bands of operation. Said modular antenna element comprises, in some examples, more than one section comprising at least a radiation booster. A matching network comprised in a radiofrequency system of a radiating system according to this invention, comprises passive circuit components in some embodiments, like for example capacitors or inductors, and active components in other embodiments, as for example switches or tunable components, diodes, transistors, etc., but the elements or components comprised in a matching network of a radiofrequency system included in a radiating system related to this invention are not limited to the previously mentioned ones. Said matching network elements or components can be combined in different matching network topologies, such as, only having a series component, a T-topology, a TT-topology, these topologies being examples but not a limitation of the topologies that can be implemented for a radiating system embodiment related to this invention. The dielectric material comprised in the embedded structure that comprises the antenna element, the feeding line and the matching network pads layout is the air in some embodiments, FR4 material in other embodiments, or any other dielectric material in other embodiments. A dielectric support comprising an embedded structure related to the invention can feature any thickness. Also, in a radiating system embodiment where the dielectric support comprising the embedded structure and a ground plane layer of the radiating structure is contained in a PCB (printed circuit board), said PCB can feature any shape and dimensions. Also, a ground plane layer comprised in a radiating structure related to this invention can also feature any shape, typically being, in some examples, a polygon of at least three sides and three angles defining any shape. Some radiating structure embodiments comprise a ground plane layer or layers featuring a shape defined by at least one round side, so being a circle in some cases. Regarding the dimensions of the at least one ground plane layer comprised in a radiating structure according to the present invention, there exist radiating structure embodiments comprising at least one of said the at least one ground plane layers being equal to or bigger than 0.1 times lambda at a lowest frequency of a first frequency band of operation, and there exist other embodiments where the at least one of said the at least one ground plane layers are smaller than 0.1 times lambda at a lowest frequency of a first frequency band of operation. So, a characteristic of a radiating system according to this invention is that an embedded structure as the one described and disclosed in this patent provides a proper performance, in terms of radiation or antenna efficiency and input matching, and it is easy to integrate, independently from the shape of the ground plane layer comprised in the radiating structure and of the PCB. Additionally, the dimensions of a ground plane layer comprised in a radiating structure related to this invention can be smaller than 0.1 times lambda at a lowest frequency of a first frequency band of operation.

An antenna element comprised in an embedded structure related to this invention comprises at least one conductive surface comprised in at least one conductive layer. So, some embodiments comprise a single conductive layer antenna element comprising the antenna element conductive surface or surfaces, the antenna element being, in some of these examples, a conductive strip; and, in other embodiments, the conductive surfaces comprised in the antenna element are comprised in more than one conductive layers. Some of these last embodiments comprise conductive layers or conductive surfaces featuring different shapes. Typically, an embedded radiating system embodiment comprising an embedded radiation booster according to the present invention comprises two conductive surfaces comprised in two parallel conductive layers. The shape of the conductive surfaces or of the conductive layers of a radiation booster related to the invention can be different between them or they can feature the same shape and even the same dimensions. And an antenna element, being radiation booster or not, according to this invention can feature any shape.

An antenna element comprised in an embedded structure related to this invention is connected to the feeding line also comprised in the embedded structure, said feeding line also connected to the pads comprised for allocating a matching network. Said matching network is connected to an input/output port of the radiating system or to a transceiver. In some embodiments, said connection between the matching network and the I/O port or the transceiver is done through at least one of the electrical connections comprised in the embedded structure going from a first layer to a second layer.

A characteristic of this invention is that the dielectric material included in the embedded structure fulfills all the embedded structure volume surrounding all the elements comprised in the embedded structure, as well as fulfilling the space between the conductive surfaces comprised in a radiation booster, for the case of embodiments comprising radiation boosters. Some embodiments related to the present invention contain a feeding line connecting the antenna element to the matching network pads wherein said feeding line is a conductive strip at a height above a plane containing the ground plane layer comprised in the radiating structure. Having a conductive strip comprised in the feeding line, the conductive strip comprised on a surface of the embedded structure at a height from the ground plane layer included in the radiating structure, allows obtaining better radiation efficiencies, so contributing to a better radiation performance. In other embodiments of a radiating structure related to this invention where the ground plane layer is not comprised in the dielectric support that comprises the embedded structure related to the invention, like in the embodiments mentioned just before, the performance in terms of input reflection coefficient and antenna efficiency also improves with respect to a prior-art radiating structure. In some of those embodiments, the feeding line comprising a strip connecting the antenna element and the matching network pads is printed on a PCB where the embedded structure is mounted. As already disclosed before, other embodiments according to the present invention comprise an embedded structure comprising an antenna element or a radiation booster integrated in a PCB, the PCB containing a dielectric support comprising the embedded structure and a ground plane layer comprised in the radiating structure. Those embodiments are advantageously cheaper than fabricating and integrating a prior-art chip radiation booster, while preserving a good performance at least in terms of radiation efficiency. Regarding a printed radiation booster integrated in a radiating structure, an embedded radiating structure integrated in a PCB like the one disclosed here provides better radiation efficiency performance and it is as cheap as a printed radiation booster.

Some other radiating structure embodiments according to the present invention contain an embedded structure comprising a matching network pads layout containing pads for allocating an active component, said active component being a switch in some examples. Other radiating structures related to this invention comprise an embedded structure integrated on a PCB containing a ground plane layer so that at least a portion of the projection of the embedded structure onto a plane containing the ground plane layer comprised in the radiating structure overlaps a ground plane rectangle, defined in the context of this document as a smallest parallelepiped that encompasses the ground plane layer comprised in the radiating structure. Typically, in some of these embodiments, the embedded structure is integrated at a corner of the ground plane rectangle. Additionally, some of all those embodiments comprise at least one electrical connection from a first layer to a second layer comprising at least one half-via, said at least one half-via typically connecting the matching network pads layout, and consequently the matching network allocated in it, to ground or to an I/O port, or to a transceiver, or to other circuit components.

A radiating system related to the present invention can be connected to an additional ground plane. Said additional ground plane can be a ground plane comprised in a second PCB or in a device, as for example, but not limited to, a laptop computer, a tablet, a dock station. And the connection between the radiating system and the additional ground plane can be done at any position of said ground plane, being particularly done at the center of an edge, by any means.

The present invention also relates to a method, for example a method for manufacturing a wireless device or arranging a radiating system within a wireless device as previously described. The method comprises arranging a radiating structure within a wireless device. The radiating structure comprises an embedded structure in a dielectric support and at least one ground plane layer. The embedded structure is preferably an embedded structure according to the present disclosure. In this sense, the embedded structure, for example, at least comprises: an antenna element comprising at least one conductive surface comprised in at least one conductive layer, a feeding line, at least one electrical connection from a first layer to a second layer, and a dielectric material. The method also comprises arranging at least one I/O port within the wireless device. The method also comprises arranging, within the wireless device, a radiofrequency system that comprises a matching network or circuit on a pads layout. In some embodiments, the radiating structure is arranged within the wireless device such that at least one layer of the at least one ground plane layer is not comprised in the dielectric support. In some other embodiments, at least one layer of the at least one ground plane layer comprised in the radiating structure is comprised in the dielectric support.

BRIEF DESCRIPTION OF THE DRAWINGS

The mentioned and further features and advantages of the invention become apparent in view of the detailed description which follows with some examples of the invention, referenced by means of the accompanying drawings, given for purposes of illustration only and in no way meant as a definition of the limits of the invention.

Fig. 1 A radiating structure embodiment comprising an embedded structure in a dielectric support including a radiation booster, a feeding line comprising a conductive strip, some pads for allocating a matching network, a dielectric material and at least one electrical connection going through the dielectric material from a first layer to a second layer.

Fig. 2 Input reflection coefficient and antenna efficiency obtained for the two radiating structures provided in the graph: a prior-art radiating structure (dashed lines) and a radiating structure including an embedded structure related to the present invention (solid lines), when matched with the matching network provided in Fig. 3.

Fig. 3 Matching network used to match the radiating structures provided in Fig. 2.

Fig. 4 Radiation efficiency comparison for a radiating structure including an embedded structure related to the present invention where (a) the strip connecting the radiation booster and the matching network pads is printed on the PCB where the embedded structure is mounted, and (b) the strip connecting the radiation booster and the matching network pads is printed at a height from the ground plane layer of the radiating structure on a surface of the embedded structure.

Fig. 5 A radiating structure embodiment related to the present invention where at least a part of the projection of the embedded structure onto a plane containing the ground plane layer comprised in the radiating structure overlaps the ground plane layer.

Fig. 6 Radiating structures embodiments according to a prior-art case (top) and to the present invention (middle and below). The embodiment in the middle contains an embedded radiation booster integrated in the PCB allocating the radiating structure. The embodiment below contains a printed radiation booster, with no volume.

Fig. 7 Radiation efficiency obtained (by simulation) for the three radiating structures provided in Fig. 6.

Fig. 8 Example of an embodiment of a radiating system according to the present invention, containing an embedded structure that comprises an embedded radiation booster integrated in the PCB that comprises the radiating structure. In this example, different sizes of ground plane and PCB are considered.

Fig. 9 Example of a radiating system embodiment according to this invention, comprising an embedded structure that comprises an embedded radiation booster integrated in the PCB that comprises the radiating structure, said radiating system connected to an additional ground plane at the center of an edge. Said additional ground plane can be a ground plane comprised in an additional PCB or in a device, as for example, but not limited to, a laptop computer, a tablet, a dock station. Fig. 10 Input reflection coefficient and antenna efficiency measured for the radiating system embodiment provided in Fig. 9, and compared to the input reflection coefficient and antenna efficiency measured for the radiating system embodiment without being connected to the additional ground plane.

Fig. 11 Another example of a radiating system embodiment comprising an embedded structure that comprises an embedded radiation booster integrated in the PCB that comprises the radiating structure. In this particular example, the top conductive surface of the radiation booster contains a hole in the center, said top conductive surface featuring a closed ring shape.

Fig. 12 Another example of a radiating system embodiment related to the present invention, comprising an embedded structure that comprises an embedded radiation booster integrated in the PCB that comprises the radiating structure, where the PCB and the ground plane comprised in the radiating structure feature a polygonal shape different from a rectangle, with a perforated surface.

DETAILED DESCRIPTION

The mentioned and further features and advantages of the invention become apparent in view of the detailed description, which follows with some examples of the invention, referenced by means of the accompanying drawings, given for purposes of illustration only and in no way meant as a definition of the limits of the invention.

Fig. 1 provides a radiating structure embodiment 100 related to this invention, said radiating structure comprising an embedded structure in a dielectric support 101 that comprises a radiation booster 102, a feeding line 103 comprising a conductive strip, some pads disposed in a pads layout 104 for allocating a matching network, a dielectric material and at least one electrical connection 105 going through the dielectric material from a first layer to a second layer; the radiating structure also comprising a ground plane layer 106. For this embodiment, said embedded structure is located at a corner of a ground plane rectangle on a clearance 107 of a ground plane layer comprised in a PCB, said ground plane rectangle encompassing said ground plane layer. The radiation booster comprised in the embedded structure comprises two conductive surfaces comprised in two parallel layers, the conductive surfaces being connected between them by means of more than one electrical connection, those electrical connections usually being vias. The conductive strip comprised in the feeding line connects the radiation booster to the matching network pads and to the matching network that can be allocated in those pads. The dielectric material included in the embedded structure fulfills all the embedded structure volume surrounding all the elements comprised in the structure as well as fulfilling the space between the conductive surfaces comprised in the radiation booster. Surprisingly, the fact of having a dielectric material surrounding the radiation booster does not worsen the performance achieved, but on the contrary, as seen in Fig. 2, the input reflection coefficient and the antenna efficiency may improve, or at least it is not worse, with respect to the ones obtained for a prior-art radiating structure. The matching network provided in Fig. 3 is the one comprised in a radiating system comprising the radiating structures presented in Fig. 2.

A particular characteristic of the embedded structure provided in Fig. 1 is that the conductive strip comprised in the feeding line is located at a height “h” above the plane containing the ground plane layer comprised in the radiating structure. Fig. 4 provides a comparison of the radiation efficiency obtained for two radiating structures including an embedded structure related to the present invention, comprising a strip that connects a radiation booster to a matching network pads layout. In one of those radiating structures the strip is printed on the PCB where the embedded structure is integrated or mounted, the strip being printed below the embedded structure; and in the other radiating structure the strip connecting the radiation booster and the matching network pads is printed on a surface of the embedded structure, at a height from the ground plane layer included in the radiating structure. As evidenced in Fig. 4, printing the strip on a surface of the embedded structure, at a height from the ground plane layer, allows obtaining better radiation efficiencies, contributing to a better performance.

Fig. 5 provides a radiating structure embodiment 500 according to the present invention where at least a part of the projection of the embedded structure 501 onto a plane containing the ground plane layer comprised in the radiating structure overlaps a ground plane rectangle, defined as a smallest parallelepiped that encompasses the ground plane layer comprised in the radiating structure. In this embodiment, the embedded structure is integrated at a corner of the ground plane rectangle. Additionally, the matching network pads layout 502 included in the embodiment from Fig. 5 allows the integration of a switch, and the embedded structure contains at least one electrical connection from a first layer to a second layer comprising at least one half-via 503, said at least one half-via typically connecting the matching network pads layout, and consequently the matching network allocated in it, to ground or to an I/O port, or to a transceiver, or to other circuit components. Fig. 6 provides some radiating structures according to the present invention. One of them advantageously comprises an embedded structure comprising a radiation booster integrated in a PCB, the PCB containing a dielectric support comprising the embedded structure and a ground plane layer comprised in the radiating structure. In this particular example, said embedded radiation booster features 3mm x 2mm x 1mm dimensions and comprises two conductive surfaces connected between them through vias, the conductive surfaces printed on a clearance of 10mm x 3mm of the PCB. The dielectric material comprised in the PCB is then the one comprised between the conductive surfaces of the embedded radiation booster. The embedded radiation booster, in this particular example, is located at 1mm from an edge of the ground plane layer comprised in the radiating structure. Said ground plane layer features a length of 0.1 times lambda at a lowest frequency of operation, in this example being 2.4GHz, and a width of 10mm. Also in Fig. 6, a radiating structure containing a printed radiation booster is provided, the printed radiation booster comprising a conductive surface that features a two- dimensional shape, so with no volume, and that is printed on a clearance of a PCB containing a dielectric support, the clearance being in this particular example 10mm x 3mm. The printed radiation booster comprised in the example features a 3mm x 2mm size and the ground plane layer comprised in this radiating structure features a length of 0.1 times lambda at a lowest frequency of operation, being 2.4GHz in the example. The printed radiation booster located at 1mm from an edge of the ground plane layer. The embodiments provided in Fig. 6 are configured to operate in a frequency range going from 2.4GHz to 2.5GHz.

Fabricating and integrating an embedded radiation booster in a radiating structure according to the present invention is advantageously cheaper than fabricating and integrating a prior-art chip radiation booster, while preserving a good performance at least in terms of radiation efficiency. Though, a radiating structure comprising a chip radiation booster can provide better performance in terms of radiation efficiency than a radiating structure comprising an embedded radiation booster, as shown in Fig. 7 for the examples provided in Fig. 6. Fabricating a printed radiation booster is also more advantageous regarding cost than fabricating and integrating a chip radiation booster, but it is similar in cost as fabricating an embedded radiation booster. Regarding performance in terms of radiation efficiency, for the particular examples of Fig. 6, a 0.6dB difference in radiation efficiency is observed between a printed radiation booster with respect to an embedded radiation booster, and between an embedded radiation booster with respect to a prior-art radiation booster.

Fig. 8 presents a radiating system embodiment according to this invention, comprising an embedded structure that comprises an embedded radiation booster 801 , the embedded structure and radiation booster integrated in the PCB 802 that comprises the radiating structure. Said PCB contains a dielectric support 803 that comprises the embedded structure and the ground plane 804 comprised in the radiating structure, the ground plane comprising in this example two layers interconnected by vias 805. In this example, different sizes of ground plane and PCB are considered, so different embodiments with different PCB and ground plane sizes can be implemented, more concretely, two embodiments with PCBs of 20mm and 40mm of length by 10mm of width have been fabricated. The radiation booster features 3mm x 2mm x 0.6mm dimensions and comprises two conductive surfaces featuring a same rectangular shape, spaced between them by the dielectric support of 0.6mm thickness contained in the PCB, and connected between them by vias 806, particularly 4 vias placed near the four corners of the radiation booster. The radiation booster is connected to a matching network 807 by means of a conductive strip 808, on a top layer or face of the PCB, the radiation booster and the conductive strip being comprised in a ground plane clearance 809 of 10mm x 6mm on the top ground plane layer. A particular matching network used for providing impedance match to this embodiment in Wifi frequencies, concretely in the 2.4GHz to 2.483GHz band, contains only a series inductance of 6.3nH value. The matching network is comprised on a pads layout that is comprised on a portion of the ground plane layer at the top layer or face of the PCB. Said matching network, which is comprised in the radiofrequency system of the radiating system, is connected to an input/output port 810.

Fig. 9 presents an embodiment of a radiating system 901 related to the present invention connected to an additional ground plane 902, particularly at the center of an edge, and said additional ground plane featuring 190mm x 130mm dimensions. The radiating system embodiment comprises an embedded structure that comprises an embedded radiation booster, the whole embedded structure integrated in the PCB that comprises the radiating structure. Particularly, the radiating system embodiment connected to an additional ground plane in Fig. 9 is the one shown and described in Fig. 8 with a PCB of 20mm long. Said additional ground plane can be a ground plane comprised in a second PCB or in a device, as for example, but not limited to, a laptop computer, a tablet, a dock station. And the connection between the radiating system and the additional ground plane can be done at any position of said ground plane by any means, for this and for other embodiments.

Fig. 10 provides measurements done for the radiating system shown in Fig. 9, and described in more detail in Fig. 8, without being connected (dotted lines) and being connected (solid lines) to an additional ground plane as presented in Fig. 9. The input reflection coefficient and the antenna efficiency obtained are provided and they show that the performance of the radiating system is not getting worse because of connecting it to the additional ground plane, but on the contrary, the antenna efficiency improves at least a 10% in the whole operation band, being in this example from 2.4GHz to 2.483GHz, frequency band comprised in Wifi frequencies. The input reflection coefficient changes but it remains very appropriate, still showing good impedance match in the band of interest.

Fig. 11 provides another radiating system embodiment related to the invention, comprising an embedded structure that comprises an embedded radiation booster, the embedded structure and radiation booster integrated in the PCB that comprises the radiating structure. This embodiment is quite similar to the one described in Fig. 8, but in the particular example from Fig. 11 , the top conductive surface of the embedded radiation booster contains a hole 1101 in the center of the surface, said top conductive surface featuring a closed ring shape then. Said hole features 1 mm (length) x 0.5mm (width) dimensions. The bottom conductive surface of the radiation booster is a rectangle surface without any hole. So, this embodiment is an example of a radiating system according to the present invention, wherein the different conductive layers or surfaces comprised in the embedded radiation booster do not feature the same shape. Also, in this embodiment, the embedded radiation booster and the conductive strip that connects the radiation booster to the matching network of the radiofrequency system comprised in the radiating system, are comprised in a ground plane clearance of 10mm x 4mm. The rest of the features described for the embodiment from Fig. 8 are the same for the embodiment from Fig. 11. An embodiment integrated in a PCB of 40mm x 10mm size has been matched with a matching network comprising only a series inductance of value 6.3nH, and an embodiment integrated in a 20mm long PCB has also been matched with a series inductance, but of value 7nH. Those matching networks are implemented for matching the embodiments in Wifi frequency bands, more concretely from 2.4GHz to 2.483GHz.

It is worth noticing that radiating system embodiments comprising an embedded structure that comprises an embedded radiation booster, the whole embedded structure integrated in the PCB that comprises the radiating structure, like the ones from Fig. 8 and Fig. 11 , perform very well in terms of antenna efficiency, providing around 45% of antenna efficiency average for 20mm x 10mm PCBs and up to 80% of antenna efficiency average for 40mm x 10mm PCBs. Fig. 12 provides an embodiment of a radiating system related to this invention contained in a PCB 1202 that features a polygonal shape, different from a rectangle, and wherein the PCB is perforated 1203. So, the ground plane layer 1204 comprised in this radiating structure features a rare shape. This is another radiating system embodiment comprising an embedded structure that comprises an embedded radiation booster 1201 , of dimensions 0.12mm x 0.08mm, the embedded structure and radiation booster integrated in the PCB that comprises the radiating structure. The radiation booster comprises two conductive surfaces at the top and bottom layers of the PCB, connected by 4 vias near the four corners of the radiation booster. The radiation booster can also be perforated at the center of the top conductive surface, said surface featuring a closed ring shape then. The dimensions of the PCB are 16.3mm x 18.3mm (horizontal diameter x vertical diameter) as shown in the illustration from Fig. 12, and thickness 0.43mm. The embedded radiation booster is connected to a matching network (represented by elements Z1 , Z2 and Z3 in the illustration) through a conductive strip 1205, no straight in shape but following the PCB shape. The embedded radiation booster and conductive strip are comprised in a ground plane clearance 1206.

In this text, the term “includes”, “comprises” and derivations thereof (such as “including”, “comprising”, etc.) should not be understood in an excluding sense, that is, these terms should not be interpreted as excluding the possibility that what is described and defined may include further elements, steps, etc. On the other hand, the disclosure is obviously not limited to the specific embodiment(s) described herein, but also encompasses any variations that may be considered by any person skilled in the art (for example, as regards the choice of materials, dimensions, components, configuration, etc.), within the general scope of the invention as defined in the claims.

Claims

WHAT IS CLAIMED IS:

1. A wireless device comprising a radiating system that comprises: a radiating structure that comprises: an embedded structure in a dielectric support comprising: an antenna element comprising at least one conductive surface comprised in at least one conductive layer; a feeding line; at least one electrical connection from a first layer to a second layer; and a dielectric material; and at least one ground plane layer; at least one I/O port; and a radiofrequency system that comprises a matching network or circuit on a pads layout; wherein at least one layer of the at least one ground plane layer is not comprised in the dielectric support.

2. The wireless device of claim 1 , wherein the dielectric support comprises the pads layout.

3. The wireless device of claim 1 , wherein the pads layout is on a layer of the at least one ground plane layer.

4. The wireless device of any one of the preceding claims, wherein the dielectric support comprises at least one layer of the at least one ground plane layer.

5. The wireless device of claim 1 or claim 4, wherein the pads layout is on a portion of a layer of the at least one ground plane layer not comprised in the dielectric support.

6. The wireless device of any one of the preceding claims, wherein the antenna element is a radiation booster.

7. The wireless device of claim 6, wherein the radiation booster comprises at least two conductive layers.

8. The wireless device of claim 7, wherein at least two of the at least two conductive layers have different shape.

9. The wireless device of any one of the preceding claims, wherein the antenna element is an electrically-short antenna.

10. The wireless device of any one of the preceding claims, wherein the radiating system is configured to make the wireless device operate in a single frequency band.

11. The wireless device of any one of claims 1-9, wherein the radiating system is configured to make the wireless device operate in at least two frequency regions and/or frequency bands.

12. A wireless device comprising a radiating system that comprises: a radiating structure that comprises: an embedded structure in a dielectric support comprising: an antenna element comprising at least one conductive surface comprised in at least one conductive layer; a feeding line; at least one electrical connection from a first layer to a second layer; and a dielectric material; and at least one ground plane layer; at least one I/O port; and a radiofrequency system that comprises a matching network or circuit allocated in a pads layout; wherein at least one layer of the at least one ground plane layer comprised in the radiating structure is comprised in the dielectric support.

13. The wireless device of claim 12, wherein the dielectric support comprises the pads layout.

14. The wireless device of claim 13, wherein the pads layout is on the at least one layer of the at least one ground plane layer.

15. The wireless device of claim 12, wherein the pads layout is on a portion of a layer of the at least one ground plane layer not comprised in the dielectric support.

16. The wireless device of any one of claims 12-15, wherein the antenna element is a radiation booster.

17. The wireless device of claim 16, wherein the radiation booster comprises at least two conductive layers.

18. The wireless device of claim 17, wherein the at least two of the at least two conductive layers have different shape.

19. The wireless device of any one of claims 12-18, wherein the antenna element is an electrically-short antenna.

20. The wireless device of any one of claims 12-19, wherein the radiating system is configured to make the wireless device operate in a single frequency band.

21. The wireless device of any one of claims 12-19, wherein the radiating system is configured to make the wireless device operate in at least two frequency regions and/or frequency bands.

22. A method, comprising: arranging a radiating structure within a wireless device, the radiating structure comprising: an embedded structure in a dielectric support, and at least one ground plane layer; arranging at least one I/O port within the wireless device; arranging, within the wireless device, a radiofrequency system that comprises a matching network or circuit on a pads layout; wherein the embedded structure comprises: an antenna element comprising at least one conductive surface comprised in at least one conductive layer, a feeding line, at least one electrical connection from a first layer to a second layer, and a dielectric material; and wherein the radiating structure is arranged within the wireless device such that at least one layer of the at least one ground plane layer is not comprised in the dielectric support.

23. The method of claim 22, wherein the wireless device is a wireless device according to any one of claims 1-11.

24. A method, comprising: arranging a radiating structure within a wireless device, the radiating structure comprising: an embedded structure in a dielectric support, and at least one ground plane layer; arranging at least one I/O port within the wireless device; arranging, within the wireless device, a radiofrequency system that comprises a matching network or circuit on a pads layout; wherein the embedded structure comprises: an antenna element comprising at least one conductive surface comprised in at least one conductive layer, a feeding line, at least one electrical connection from a first layer to a second layer, and a dielectric material; and wherein at least one layer of the at least one ground plane layer comprised in the radiating structure is comprised in the dielectric support.

25. The method of claim 24, wherein the wireless device is a wireless device according to any one of claims 12-21.