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WO2025126328A1 - Dispositif optique et procédé de fabrication de dispositif optique - Google Patents

Dispositif optique et procédé de fabrication de dispositif optique Download PDF

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Publication number
WO2025126328A1
WO2025126328A1 PCT/JP2023/044484 JP2023044484W WO2025126328A1 WO 2025126328 A1 WO2025126328 A1 WO 2025126328A1 JP 2023044484 W JP2023044484 W JP 2023044484W WO 2025126328 A1 WO2025126328 A1 WO 2025126328A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical device
optical
laser light
emitting element
subassemblies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2023/044484
Other languages
English (en)
Japanese (ja)
Inventor
壮嗣 澤村
和彦 鹿島
永井　京子
ニティデット タッサリングカンサクン
ラッタナポーン スクソンブーン
ノッパワン ジョンカムヌン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to PCT/JP2023/044484 priority Critical patent/WO2025126328A1/fr
Publication of WO2025126328A1 publication Critical patent/WO2025126328A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management

Definitions

  • the present invention relates to an optical device and a method for manufacturing an optical device.
  • optical devices have been known that include a laser light-emitting element and an optical fiber to which the output light of the laser light-emitting element is coupled (for example, Patent Document 1).
  • the optical device disclosed in Patent Document 1 includes only one combination of a laser light-emitting element and an optical fiber.
  • optical devices that have multiple combinations of laser light-emitting elements and optical fibers are being developed for use in data centers, for example.
  • one of the objectives of the present invention is to provide an improved new optical device and a method for manufacturing an optical device that can reduce or avoid problems associated with, for example, having multiple combinations of laser light-emitting elements and optical fibers.
  • the optical fibers of each of the subassemblies may extend substantially along a first direction on the base and be spaced apart in a second direction that intersects with the first direction.
  • the positions of the subassemblies on the base in the first direction may be non-uniform.
  • the optical device may include two subassemblies adjacent to each other with a gap therebetween as the two subassemblies adjacent to each other in the second direction.
  • the optical device may include a first cover that covers at least the laser light-emitting element and has light-blocking properties.
  • the first cover may have a higher thermal conductivity than the gas surrounding the laser light-emitting element.
  • the first cover may be thermally connected to the submount.
  • the optical device may include a housing that houses the plurality of subassemblies.
  • the subassembly may be fixed onto a surface of the base, a wiring portion made of a conductor may be provided on the surface, and the wiring portion and the conductor of the subassembly may be electrically connected via a wire made of a conductor.
  • the wiring portion may have a portion that extends substantially along the first direction on the surface.
  • the optical device may include a plurality of wires of different lengths as the wires.
  • the optical device may include a second cover that covers the wire.
  • the laser light-emitting element may output the output light in a first direction
  • the submount may have a first portion adjacent to the laser light-emitting element and joined to the base, and a second portion extending from the first portion away from the base and supporting at least the optical fiber.
  • the submount and the base may have a higher thermal conductivity than the gas surrounding the laser light-emitting element.
  • the optical fiber may be a polarization-maintaining optical fiber.
  • the manufacturing method of the optical device of the present invention includes, for example, a first step of producing a plurality of subassemblies each having a laser light-emitting element, an optical fiber to which the output light of the laser light-emitting element is coupled, and a submount to which the laser light-emitting element and the optical fiber are attached, and a second step of attaching the plurality of subassemblies to a base.
  • the method for manufacturing the optical device may include a third step, after the first step and before the second step, of fixing ends of a plurality of optical fibers, including the optical fiber extending from the plurality of subassemblies, to a connector body.
  • the method for manufacturing the optical device may include a fourth step in which the optical fibers are polarization-maintaining optical fibers, and the fourth step is performed after the first step and before the third step, to adjust the angle of the end portion relative to the connector body around the central axis.
  • FIG. 1 is an exemplary schematic perspective view of a communication device including an optical device according to a first embodiment.
  • FIG. 2 is an exemplary schematic perspective view showing the internal configuration of the optical device according to the first embodiment.
  • FIG. 3 is an exemplary schematic plan view showing the internal configuration of the optical device according to the first embodiment.
  • FIG. 4 is an exemplary schematic perspective view of the IV-IV cross section of FIG.
  • FIG. 5 is an exemplary schematic plan view of a portion of a subassembly included in the optical device of the first embodiment.
  • FIG. 6 is a flowchart showing an example of a procedure of a method for manufacturing the optical device according to the first embodiment.
  • FIG. 7 is an exemplary front view showing a portion of an array of optical fibers at an end of a connector of the optical device of the first embodiment.
  • FIG. 8 is an exemplary schematic perspective view of a cross section of an optical device according to the second embodiment taken at a position equivalent to that in FIG.
  • FIG. 9 is an exemplary schematic perspective view of a cross section of an optical device according to a third embodiment taken at a position equivalent to that in FIG.
  • the X direction is represented by an arrow X
  • the Y direction is represented by an arrow Y
  • the Z direction is represented by an arrow Z.
  • the X direction, Y direction, and Z direction intersect with each other and are perpendicular to each other.
  • the X direction can also be called the longitudinal direction or extension direction
  • the Y direction can also be called the transverse direction or width direction
  • the Z direction can also be called the thickness direction or height direction.
  • FIG. 1 is a perspective view of a communication device 10 according to a first embodiment.
  • the communication device 10 includes an optical module 100, a connector module 200, and an optical fiber cable 300.
  • the communication device 10 may also be referred to as an optical communication device.
  • the connector module 200 has a connector body 201.
  • a plurality of optical fibers 301 are fixed to the connector body 201, for example, via an adhesive.
  • FIGS. 2 and 3 show the internal configuration of the portion of the optical module 100 shown in FIG. 1, with FIG. 2 being a perspective view of that portion and FIG. 3 being a plan view of that portion.
  • FIG. 4 is a perspective view showing a cross section taken along the line IV-IV in FIG. 3.
  • the subassembly 110A (110) has a submount 111, a laser light emitting element 112, a lens 115, an isolator 116, a support member 117 that supports the optical fiber 301, and a photodiode 120.
  • the laser light-emitting element 112 is, for example, a semiconductor laser element.
  • An electrode 113 is provided on the submount 111.
  • the laser light-emitting element 112 and the electrode 113 are electrically connected via a wire 114a made of a conductor.
  • a plurality of wirings 101a1 made of a conductor and an insulating region 101a2 between the wirings 101a1 are provided on the surface 101a of the base 101.
  • the electrode 113 and the wiring 101a1 are electrically connected via a wire 114b made of a conductor.
  • the wiring 101a1 is electrically connected to a wiring (not shown) provided on the FPC 103, and the wiring of the FPC 103 is electrically connected to a power source (not shown).
  • the laser light-emitting element 112 emits light in response to the supply of power from the power source via the wiring of the FPC 103, the wiring 101a1 on the surface 101a of the base 101, the wire 114b, the electrode 113, and the wire 114a.
  • Wiring 101a1 is an example of a wiring portion.
  • the laser light (output light) output from the laser light-emitting element 112 is transmitted to the end 301e1 of the optical fiber 301 via the lens 115 and the isolator 116, and is coupled to the end 301e1.
  • the lens 115 and the isolator 116 are examples of optical components. Note that optical components other than the lens 115 and the isolator 116 may be provided between the laser light-emitting element 112 and the optical fiber 301. Also, instead of providing the lens 115, the optical fiber 301 may be configured as a lensed fiber. In this case, the isolator 116 may not be provided.
  • the photodiode 120 detects the intensity of the output light from the laser light emitting element 112.
  • the intensity signal detected by the photodiode 120 is transmitted to the controller via the wire 114b, the wiring 101a1, and the wiring of the FPC 103.
  • the submount 111 extends in the X direction with a substantially constant width in the Y direction.
  • the height of the submount 111 in the Z direction varies depending on the position in the X direction. In other words, the submount 111 has a step.
  • the submount 111 is made of a ceramic (material) with a relatively high thermal conductivity, such as aluminum nitride.
  • the submount 111 may also be configured as a silicon optical bench (SiOB), for example.
  • the laser light-emitting element 112, lens 115, isolator 116, and support member 117 are attached to the submount 111 via adhesive 119.
  • the optical fiber 301 is attached to the support member 117 via adhesive (not shown). That is, the optical fiber 301 is attached to the submount 111 via the support member 117, etc.
  • the laser light-emitting element 112 and photodiode 120 are attached to the submount 111 via, for example, solder. Adhesive and solder are examples of bonding materials.
  • the subassembly 110 also has a cover 130.
  • the cover 130 covers the components of the subassembly 110 other than the cover 130, such as the laser light emitting element 112, the lens 115, the isolator 116, a portion of the optical fiber 301 including the end 301e1, the photodiode 120, and the wires 114a and 114b.
  • the cover 130 is attached to the submount 111.
  • the cover 130 has multiple members, specifically a first member 131, a second member 132, and a boot 133.
  • the first member 131 covers the laser light emitting element 112, the lens 115, the isolator 116, the optical fiber 301, the wire 114a, and the photodiode 120 on the surface 101a of the base 101. Openings are provided in the X-direction and the end opposite the X-direction of the first member 131.
  • the second member 132 covers the opening at the end opposite the X-direction of the first member 131 and also covers the wire 114b.
  • the boot 133 closes the opening at the end opposite the X-direction of the first member 131.
  • the optical fiber 301 passes through the boot 133.
  • the wire 114b and the wiring 101a1 can be bonded while avoiding interference with the cover 130 of a bonding device (not shown). If the cover 130 were made of a single member, at least during the bonding operation, the entire cover 130 would have to be removed from the submount 111 to expose the components, which could reduce the protection of the components.
  • the bonding operation can be performed with the first member 131 and the boot 133 attached to the submount 111 to cover the components and the second member 132 not attached to the submount 111 to expose the wire 114a.
  • the wire 114b and the wiring 101a1 can be bonded smoothly while avoiding interference with the cover 130 of the bonding device, while ensuring the protection of the components.
  • the boot 133 can be made of an elastic material that is softer and more flexible than the first member 131. This allows the first member 131, which has higher rigidity than the boot 133, to ensure higher protection for the components while ensuring higher sealing in the gap between the boot 133 and the optical fiber 301.
  • the first member 131 and the boot 133 are an example of a first cover
  • the second member 132 is an example of a second cover.
  • a resin material with a relatively low elastic modulus may be provided to seal the openings at both ends of the first member 131. In this case, the resin material is an example of a second cover.
  • the cover 130 is made of a material having a higher thermal conductivity than at least the gas (e.g., air, inert gas, etc.) surrounding the laser light-emitting element 112 and the submount 111 so as to be a heat transfer path (heat dissipation path) for heat generated by the laser light-emitting element 112 as a heat generating element, and at least a part of the cover 130 is thermally connected to the submount 111 and the laser light-emitting element 112.
  • the gas e.g., air, inert gas, etc.
  • the first member 131 and the second member 132 are made of a metal material having a relatively high thermal conductivity, such as an aluminum-based material such as pure aluminum or an aluminum alloy, or a copper-based material such as oxygen-free copper or a copper alloy.
  • the first member 131 is attached to the submount 111 by a bonding material or a fixing tool
  • the second member 132 is attached to the first member 131 or the submount 111 by a bonding material or a fixing tool.
  • the submount 111 is thermally connected to the laser light-emitting element 112.
  • the first member 131 is thermally connected to the submount 111, and is therefore thermally connected to the laser light emitting element 112.
  • the second member 132 is thermally connected to the first member 131 or the submount 111, and is therefore thermally connected to the laser light emitting element 112.
  • a thermally conductive sheet 140 is interposed between the cover 130 and the outer cover.
  • the thermally conductive sheet 140 is made of a material that is softer, more flexible, and more elastic than the cover 130 and the outer cover, and is in close contact with both the cover 130 and the outer cover.
  • the outer cover is also made of a material that has a higher thermal conductivity than at least the gas surrounding the laser light-emitting element 112 and the submount 111, and is specifically made of a metal material with a relatively high thermal conductivity, such as an aluminum-based material such as pure aluminum or an aluminum alloy, or a copper-based material such as oxygen-free copper or a copper alloy.
  • the heat generated by the laser light-emitting element 112 is transferred to the outer cover via the cover 130 and the thermally conductive sheet 140, and is released from the outer cover. Therefore, according to this embodiment, the heat dissipation from the subassembly 110 is improved, so that it is possible to suppress the temperature of the laser light-emitting element 112 or other components from rising, making it difficult to obtain the desired optical characteristics and reliability.
  • the thermally conductive sheet 140 is an example of a heat transfer member.
  • the outer cover may also be provided with a heat dissipation structure, such as a heat sink that includes multiple fins or multiple pins.
  • the entire cover 130 i.e., the first member 131, the second member 132, and the boot 133, are made of a material that has light blocking properties against the output light of the laser light emitting element 112. This makes it possible to prevent unwanted light (stray light) from leaking outside the subassembly 110.
  • the wiring 101a1 extends long in the X direction on the surface 101a of the base 101. Therefore, as shown in Figure 4, within a predetermined range in which the wiring 101a1 extends, the wire 114b can be joined to any position of the wiring 101a1. Therefore, within the predetermined range in which the wiring 101a1 extends, it is relatively easy to ensure electrical connection between the wiring 101a1 and the laser light-emitting element 112 or the photodiode 120 by the wire 114b of a predetermined length, regardless of the position of the subassembly 110 in the X direction.
  • FIG. 5 is a plan view of a portion of the optical module 100, showing only the first member 131 of the cover 130.
  • the first members 131 adjacent to each other in the Y direction, and therefore the subassemblies 110 are not in contact with each other, but are separated by a gap g.
  • a heat insulating material having a lower thermal conductivity than the gas surrounding the first member 131 and the submount 111 may be interposed between the two first members 131, i.e., between the two subassemblies 110.
  • Optical module manufacturing method 6 is a flowchart showing an example of a manufacturing procedure for the optical module 100. Here, the manufacturing procedure is illustrated for the case where the optical fiber 301 is a polarization-maintaining optical fiber.
  • the subassembly 110 is fabricated (S1).
  • S1 each of the above-mentioned subassemblies 110 (see FIGS. 2 to 4, but not yet attached to the base 101) is fabricated.
  • the fixed position of the optical fiber 301 relative to the support member 117 and the fixed position of the lens 115 relative to the submount 111 are adjusted for each subassembly 110 so that the required coupling efficiency of the light output from the laser light emitting element 112 to the end 301e1 of the optical fiber 301 is obtained.
  • the rotation angle around the optical axis (center axis) of the optical fiber 301 is also adjusted. Specifically, for example, the angle around the optical axis of the end 301e1 of the optical fiber 301 is adjusted so that the direction of the tensile stress applied in the cross section is approximately aligned with the slow axis direction of the laser light.
  • S1 is an example of the first step.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un dispositif optique comprenant, par exemple : une pluralité de sous-ensembles, dont chacun a un élément électroluminescent laser, une fibre optique à laquelle la lumière de sortie de l'élément électroluminescent laser est couplée, et un sous-support auquel l'élément électroluminescent laser et la fibre optique sont fixés ; et une base à laquelle la pluralité de sous-ensembles sont fixés. Le dispositif optique peut en outre comprendre : un câble qui a une pluralité de fibres optiques s'étendant à partir de la pluralité de sous-ensembles, et un tube entourant la pluralité de fibres optiques ; et un connecteur auquel des parties d'extrémité de la pluralité de fibres optiques sont fixées.
PCT/JP2023/044484 2023-12-12 2023-12-12 Dispositif optique et procédé de fabrication de dispositif optique Pending WO2025126328A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/044484 WO2025126328A1 (fr) 2023-12-12 2023-12-12 Dispositif optique et procédé de fabrication de dispositif optique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/044484 WO2025126328A1 (fr) 2023-12-12 2023-12-12 Dispositif optique et procédé de fabrication de dispositif optique

Publications (1)

Publication Number Publication Date
WO2025126328A1 true WO2025126328A1 (fr) 2025-06-19

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PCT/JP2023/044484 Pending WO2025126328A1 (fr) 2023-12-12 2023-12-12 Dispositif optique et procédé de fabrication de dispositif optique

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002131590A (ja) * 2000-10-26 2002-05-09 Furukawa Electric Co Ltd:The 半導体レーザモジュール、その製造方法及びラマン増幅器
JP2009529156A (ja) * 2006-03-03 2009-08-13 ホーヤ コーポレイション ユーエスエイ 回路基盤に取付けられたファイバ結合式光学デバイス
JP2009230032A (ja) * 2008-03-25 2009-10-08 Sumitomo Electric Ind Ltd 光モジュール
WO2012114785A1 (fr) * 2011-02-24 2012-08-30 株式会社フジクラ Dispositif de montage de fibres, module optique l'utilisant et procédé de fabrication du module optique
JP2014013309A (ja) * 2012-07-04 2014-01-23 Sumitomo Electric Ind Ltd 多心光コネクタの製造方法、及び多心光コネクタ
WO2018097241A1 (fr) * 2016-11-25 2018-05-31 古河電気工業株式会社 Dispositif laser et dispositif de source de lumière
US20180309264A1 (en) * 2017-04-24 2018-10-25 Nlight, Inc. Low swap two-phase cooled diode laser package

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002131590A (ja) * 2000-10-26 2002-05-09 Furukawa Electric Co Ltd:The 半導体レーザモジュール、その製造方法及びラマン増幅器
JP2009529156A (ja) * 2006-03-03 2009-08-13 ホーヤ コーポレイション ユーエスエイ 回路基盤に取付けられたファイバ結合式光学デバイス
JP2009230032A (ja) * 2008-03-25 2009-10-08 Sumitomo Electric Ind Ltd 光モジュール
WO2012114785A1 (fr) * 2011-02-24 2012-08-30 株式会社フジクラ Dispositif de montage de fibres, module optique l'utilisant et procédé de fabrication du module optique
JP2014013309A (ja) * 2012-07-04 2014-01-23 Sumitomo Electric Ind Ltd 多心光コネクタの製造方法、及び多心光コネクタ
WO2018097241A1 (fr) * 2016-11-25 2018-05-31 古河電気工業株式会社 Dispositif laser et dispositif de source de lumière
US20180309264A1 (en) * 2017-04-24 2018-10-25 Nlight, Inc. Low swap two-phase cooled diode laser package

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