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WO2025124947A1 - Transducteur de courant avec conducteurs de grille de connexion et puce de capteur pour montage de carte de circuit imprimé - Google Patents

Transducteur de courant avec conducteurs de grille de connexion et puce de capteur pour montage de carte de circuit imprimé Download PDF

Info

Publication number
WO2025124947A1
WO2025124947A1 PCT/EP2024/084223 EP2024084223W WO2025124947A1 WO 2025124947 A1 WO2025124947 A1 WO 2025124947A1 EP 2024084223 W EP2024084223 W EP 2024084223W WO 2025124947 A1 WO2025124947 A1 WO 2025124947A1
Authority
WO
WIPO (PCT)
Prior art keywords
primary conductor
magnetic field
current transducer
sensor die
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/EP2024/084223
Other languages
English (en)
Inventor
Federico Ziglioli
Xavier VERNERET
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LEM International SA
Original Assignee
LEM International SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LEM International SA filed Critical LEM International SA
Publication of WO2025124947A1 publication Critical patent/WO2025124947A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G01R15/207—Constructional details independent of the type of device used
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G01R33/091—Constructional adaptation of the sensor to specific applications
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/022—Measuring gradient
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00—Arrangements or instruments for measuring magnetic variables
    • G01R33/02—Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06—Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09—Magnetoresistive devices
    • G01R33/098—Magnetoresistive devices comprising tunnel junctions, e.g. tunnel magnetoresistance sensors

Definitions

  • the present invention relates to a single package current transducer for surface mount connection on a circuit board, the current transducer including primary and secondary conductors formed from a leadframe and a sensor die in an overmold housing.
  • a magnetic field sensor die is mounted over a portion of the primary conductor.
  • the magnetically sensitive portions of the sensor die it is advantageous for the magnetically sensitive portions of the sensor die to be positioned close to the primary conductor.
  • the sensor die should be separated from the primary conductor by an insulation layer that is sufficient to avoid any electrical breakdown or creepage between the primary conductor and the sensor die, this requirement depending on the voltage of the primary current to be measured.
  • the cost of transducers is an important factor as well.
  • sensor dies with different magnetic field sensing technologies for instance Hall effect sensors, tunnel magneto resistance (TMR) sensors and others may be implemented.
  • the configuration of the sensor die may require a different layout of the primary conductor portion that is positioned proximate the sensing elements of the magnetic field sensor.
  • leadframe stamping tool needs to have a dedicated configuration as well as the assembly processes of the sensor die on the leadframe arrangement.
  • an object of the invention is to provide a single package current transducer for mounting and connection on a circuit board that is compact, and economical to manufacture for different versions.
  • a current transducer configured for surface mount connection to a circuit board comprising :
  • a magnetic field sensor die having one or more magnetic field sensing portions and connection points interconnected via interconnects to the secondary conductor terminals
  • a primary conductor having a first terminal portion, a second terminal portion and a bridging portion
  • the first terminal portion is mounted on and electrically connected to the first primary conductor pad and the second terminal portion mounted on and electrically connected to the second primary conductor pad, the first and second primary conductor pads separated by an insulating gap.
  • a thickness of the primary conductor is greater than a thickness of the leadframe arrangement.
  • the magnetic field sensor die is mounted on a top surface of the primary conductor module. Edges of the magnetic field sensor die are separated from the primary conductor terminals of the leadframe arrangement by a spacing extending across a surface of the primary conductor module.
  • the primary conductor module comprises an insulating layer mounted on top of the primary conductor overmold, the insulating layer made of a material having a higher electrical breakdown resistance than a material forming the primary conductor overmold.
  • the insulating layer is selected from a group of materials comprising glass or polyimide.
  • the insulating layer is assembled on a top surface of the primary conductor overmold with an insulating adhesive layer.
  • the primary conductor terminals of the leadframe arrangement each span over more than 30% of a width of the current transducer.
  • the primary conductor of the primary conductor module comprises a recess along the bridging portion, the recess extending into the primary conductor from a mounting side.
  • a width of the connection portions of the primary conductor of the primary conductor module is more than 80% of a width of the primary conductor terminals, said width being measured in a direction orthogonal to a direction of flow of primary current between the first connection terminal and second connection terminal.
  • first connection portion and second connection portion of the primary conductor of the primary conductor module are connected to the respective primary conductor terminals by a solder connection.
  • the magnetic field sensor die is surrounded on at least three edges by a spacing extending across a top wall of the primary conductor module to an edge of the primary conductor module.
  • the primary conductor module comprises an overhang such that the top surface of the primary conductor module has a larger surface area than a mounting surface area of the primary conductor module positioned against the primary conductor terminal.
  • the overhang is formed by the primary conductor overmold or by an insulating layer mounted on a top wall of the primary conductor overmold.
  • the magnetic field sensor die comprises at least two magnetic field sensing portions spaced apart overhead the bridging portion of the primary conductor of the primary conductor module for measuring a differential magnetic field or an inplane magnetic field gradient.
  • the sensor die comprises two or at least two tunnel magneto resistance (TMR) portions.
  • TMR tunnel magneto resistance
  • the interconnects between the magnetic field sensor die and the secondary conductor terminals consist of bond wires.
  • Also disclosed herein is a method of manufacturing a current transducer according to any of the preceding embodiments, comprising the steps of :
  • the leadframe arrangement comprising the primary conductor terminals and the secondary terminals;
  • the primary conductor module including stamping and forming the primary conductor out of a second sheet of metal, overmolding the primary conductor with an insulating material, bonding an insulating layer on a top surface of the primary conductor overmold, bonding the magnetic field sensor die on top of the insulating layer,
  • the primary conductor module is mounted on the primary conductor terminals by soldering the primary conductor pads of the primary conductor module to the primary conductor terminals of the leadframe arrangement.
  • the overmold housing is molded while the leadframe arrangement is attached to the primary conductor terminals and secondary conductor terminals.
  • Figure 1 b is a perspective view of a mounting side of the current transducer of figure 1a;
  • Figure 1c is a cross-sectional view through lines 1c-1c of figure 1a;
  • Figure 2 is a view similar to figure 1a, of a variant, in particular a variant having a different primary conductor arrangement compared to the variant of figure 1a;
  • a current transducer 1 comprises a leadframe arrangement 6, a primary conductor module 5, a magnetic field sensor die 2, and an overmold housing 4 encapsulating the magnetic field sensor die, primary conductor module 5 and leadframe arrangement 6 except for contact regions and sectioned edges.
  • the leadframe arrangement 6 comprises primary conductor terminals 7 and secondary conductor terminals 8, the primary conductor terminals for connection to a conductor carrying the current to be measured, and the secondary conductor terminals 8 for connection to terminals supplying power to the sensor die 2 and for receiving measurement signals from the sensor die 2.
  • the configuration of primary conductor terminals and secondary conductor terminals 8 and their connection to corresponding circuitry of a circuit board are per se well known to those skilled in the art and do not need to be described in detail herein.
  • the primary conductor terminals and secondary conductor terminals 8 are cut out of the same strip of sheet metal commonly termed a leadframe, such leadframe technology for forming primary and secondary conductors being per se well known in the art.
  • the leadframe has a maximum thickness that is defined by the thickness of the strip of sheet metal. Certain portions of the leadframe may have a reduced thickness that may be formed by a stamping operation or by a subtractive manufacturing operation such as etching, such technologies also being well known in the art.
  • the leadframe passes through a stamping and forming die and may also have portions that are bent out of the original plane of sheet metal, although in the embodiments illustrated this is not the case, but could be as needed.
  • the secondary conductor terminals 8 are arranged along one edge of the transducer and the primary conductor arranged adjacent an opposed opposite edge of the square or rectangular transducer.
  • the primary conductor may be at a high voltage (up to a few hundred volts) compared to the secondary conductors which are only at a few volts, there is an advantage in maintaining a large spacing between the secondary conductors and primary conductor.
  • the secondary conductor terminals 8 may be interconnected to secondary connection points on the sensor die 2 via bond wires 9 as per se well known in the art.
  • the bond wires may also be connected to conductive traces formed on a substrate on which the sensor die is mounted, whereby the connection points or pads on the sensor die may be connected to those conductive traces via a perse known flip-chip connection arrangement.
  • the magnetic field sensor die 2 may typically be in the form of an integrated circuit, made of a semiconductor with magnetic field sensing portions 3a, 3b thereon.
  • magnetic field sensing technologies formed with integrated circuits, for instance Hall effect sensors and tunnel magneto resistance (TMR) sensors. These may be arranged to measure a magnetic field intensity orthogonal to the surface of the integrated circuit or in-plane with the surface of the magnetic field sensor, depending on the technology employed.
  • the sheet material forming the primary conductor 14 may be selected to have a thickness and geometric configuration that is optimized for the parameters of the current to be measured and the magnetic field sensor die characteristics, while the leadframe arrangement 6 may be a standard invariable component to which different primary conductor modules may be assembled.
  • the magnetic field sensor die 2 may be mounted on the insulating layer 18 with a die attach film comprising an adhesive as perse known in the art of die attach films.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)

Abstract

Transducteur de courant configuré pour une connexion de montage en surface à une carte de circuit imprimé comprenant : - un agencement de grille de connexion (6) comportant des bornes de conducteur primaire (7) avec une première plage de connexion (7a) et une seconde plage de connexion (7b) et des bornes de conducteur secondaire (8), formées d'une seule bande commune de tôle, - une puce de capteur de champ magnétique (2) avec une ou plusieurs parties de détection de champ magnétique (3a, 3b) et des points de connexion interconnectés par l'intermédiaire d'interconnexions (9) aux bornes de conducteur secondaire (8), - un surmoulage de matériau isolant (4) encapsulant l'agencement de puce de capteur de champ magnétique et de grille de connexion (6) à l'exception de parties de contact, et - un module de conducteur primaire (5) comprenant un conducteur primaire (14) et un surmoulage de conducteur primaire isolant (16) encapsulant le conducteur primaire à l'exception des surfaces de parties de borne sur un côté de montage du module de conducteur primaire.
PCT/EP2024/084223 2023-12-14 2024-12-02 Transducteur de courant avec conducteurs de grille de connexion et puce de capteur pour montage de carte de circuit imprimé Pending WO2025124947A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP23216930.0 2023-12-14
EP23216930 2023-12-14

Publications (1)

Publication Number Publication Date
WO2025124947A1 true WO2025124947A1 (fr) 2025-06-19

Family

ID=89222889

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2024/084223 Pending WO2025124947A1 (fr) 2023-12-14 2024-12-02 Transducteur de courant avec conducteurs de grille de connexion et puce de capteur pour montage de carte de circuit imprimé

Country Status (1)

Country Link
WO (1) WO2025124947A1 (fr)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160377689A1 (en) * 2015-06-23 2016-12-29 Infineon Technologies Ag Multi-Functional Interconnect Module and Carrier with Multi-Functional Interconnect Module Attached Thereto
US20210175326A1 (en) * 2019-12-09 2021-06-10 Texas Instruments Incorporated Integrated Circuit Package for Isolation Dies

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160377689A1 (en) * 2015-06-23 2016-12-29 Infineon Technologies Ag Multi-Functional Interconnect Module and Carrier with Multi-Functional Interconnect Module Attached Thereto
US20210175326A1 (en) * 2019-12-09 2021-06-10 Texas Instruments Incorporated Integrated Circuit Package for Isolation Dies

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