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WO2025121909A1 - Antenne encapsulée dans un boîtier et dispositif électronique la comprenant - Google Patents

Antenne encapsulée dans un boîtier et dispositif électronique la comprenant Download PDF

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Publication number
WO2025121909A1
WO2025121909A1 PCT/KR2024/019844 KR2024019844W WO2025121909A1 WO 2025121909 A1 WO2025121909 A1 WO 2025121909A1 KR 2024019844 W KR2024019844 W KR 2024019844W WO 2025121909 A1 WO2025121909 A1 WO 2025121909A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
antenna
package
paragraph
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/KR2024/019844
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English (en)
Korean (ko)
Inventor
김희영
이영주
김용연
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Doosan Corp
Original Assignee
Doosan Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doosan Corp filed Critical Doosan Corp
Publication of WO2025121909A1 publication Critical patent/WO2025121909A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart

Definitions

  • the present invention relates to an antenna-in-package and an electronic device including the same.
  • high-band frequency signals can include millimeter waves with a frequency band of 20 GHz to 300 GHz.
  • the wavelength is short, so antennas and devices can be made smaller and lighter.
  • Electronic devices use high-band frequencies, which allows for a relatively large number of antennas to be mounted on the same area due to the short wavelength.
  • the straightness of radio waves increases, and the loss of the radio path becomes more severe, which may deteriorate the propagation characteristics.
  • a communication module using a millimeter band of 20 GHz or higher includes a small-sized antenna, and around a device where the antenna is placed, an antenna mounting unit and other device structures may be placed in connection with the antenna, or a structure that may affect the antenna may be placed in a form that blocks the signal radiation direction of the antenna. Accordingly, there is a demand for the development of an antenna-in-package that can provide excellent radiation performance by minimizing propagation path loss in a limited space.
  • the problem to be solved by the present invention is to provide an antenna-in-package having excellent radiation performance in a limited space and a communication device including the same.
  • the present invention provides an antenna-in-package including a first substrate on which a radio frequency integrated circuit (RFIC) is mounted; a second substrate on which a plurality of antenna elements are arranged; and an adhesive layer arranged between the first substrate and the second substrate.
  • RFIC radio frequency integrated circuit
  • a third substrate may be additionally arranged between at least one of the plurality of antenna elements and the second substrate.
  • the present invention provides an electronic device including the antenna-in-package described above.
  • the antenna-in-package according to the present invention is excellent in mass production because RF characteristics are easy to predict, and has excellent communication coverage in a limited space.
  • FIG. 1 is a cross-sectional view schematically showing an antenna-in-package according to a first embodiment of the present invention.
  • Figure 2 is an enlarged cross-sectional view of the dotted box area (X) in Figure 1.
  • FIG. 3 is a cross-sectional view schematically showing an antenna-in-package according to a second embodiment of the present invention.
  • 200 Second substrate, 200A: First flat surface,
  • 200B bend section
  • 200C second flat section
  • Second copper layer 300: Adhesive layer
  • 700A, 700B Third board
  • the terms “above” or “on” mean not only the case where the target part is located above or below, but also the case where there is another part in between, and does not necessarily mean the position above with respect to the direction of gravity.
  • FIGS. 1 and 2 a first embodiment of the present invention will be described with reference to FIGS. 1 and 2.
  • FIG. 1 is a cross-sectional view schematically showing an antenna-in-package according to a first embodiment of the present invention
  • FIG. 2 is an enlarged cross-sectional view of a dotted box portion (X) of FIG. 1.
  • the antenna-in-package (AiP) of the present invention includes a first substrate (100); a second substrate (200) and an adhesive layer (300) interposed therebetween.
  • the first substrate (100) is a substrate on which a radio frequency integrated circuit (RFIC) (400) is placed. Not only the RFIC, but also BFIC, active and passive components can be mounted on the first substrate (100) through package balls (e.g., BGA, LGA), and a connector (600) can also be placed on the first substrate (100).
  • RFIC radio frequency integrated circuit
  • the first substrate may be a multilayer printed circuit board (PCB), specifically a multilayer printed circuit board for radio frequency, more specifically a multilayer printed circuit board for mmWAVE.
  • PCB printed circuit board
  • the first substrate (100) may be a multilayer printed circuit board including, although not illustrated, a first core layer; a plurality of first insulating layers built up on one or both surfaces of the core layer; a plurality of first circuit pattern layers arranged between the first core layer and the first insulating layer and between the first insulating layers; and a first via formed through the first insulating layer and electrically connecting between the first circuit pattern layers.
  • the first circuit pattern layer may be arranged on the first insulating layer as the outermost layer.
  • the first core layer may be replaced with the first insulating layer.
  • the material forming the first circuit pattern layer is not particularly limited as long as it is a conductive material commonly known in the art, and examples thereof include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof.
  • the first circuit pattern layer can perform various functions depending on the design of the layer, and can be, for example, a power supply line, a ground line, a ground electrode, etc.
  • the first circuit pattern layer (e.g., a power supply line) can be electrically connected to a radio frequency integrated circuit (RFIC) (400) disposed on a first substrate (100).
  • RFIC radio frequency integrated circuit
  • an end of any one of the plurality of first circuit pattern layers can be electrically connected to a connector (600) disposed on the first substrate (100).
  • the first core layer and the first insulating layer may be insulating materials commonly known in the art, and may be, for example, polymers such as epoxy resin, polyimide, polyester, polypropylene oxide, polyphenylene oxide, phenol resin, liquid crystal polymer, fluorine resin, or the like, or may be a prepreg formed by mixing the polymer with an inorganic filler, or impregnating the polymer and the inorganic filler into a core material such as glass fiber.
  • the first core layer is a prepreg layer
  • the first insulating layer may be an epoxy resin layer or a phenol resin layer.
  • the first substrate (100) may be a rigid printed circuit board, specifically, a rigid multilayer printed circuit board. If the first substrate is a flexible printed circuit board, warpage of the substrate may occur or reliability may be reduced, so it is appropriate for the first substrate to be a rigid printed circuit board.
  • the first substrate (100) may be a printed circuit board, specifically a multilayer printed circuit board, made of a material having a relatively higher dielectric constant (Dk) and dielectric tangent (Df) than the second substrate (200) and having an overall thickness at least three times thicker than the second substrate (200) in order to secure rigidity.
  • the difference in dielectric constant (Dk) between the first substrate and the second substrate may be in the range of about 1 to 1.5
  • the difference in dielectric tangent (Df) between the first substrate and the second substrate may be in the range of about 0.001 to 0.0014.
  • the first substrate may have a relative permittivity (Dk) of about 3 to 4 and a dielectric loss factor (Df) of about 0.001 to 0.005
  • the second substrate may have a relative permittivity (Dk) of about 2 to less than 3 and a dielectric loss factor (Df) of about 0.0002 to 0.0003.
  • the relative permittivity and the dielectric loss factor are each measured by a probe station in a 28 GHz band.
  • the second substrate (200) is an antenna substrate on which a plurality of antenna elements (500) are arranged and is electrically connected to the antenna elements (500).
  • the second substrate (200) may be a single-layer or multi-layer substrate.
  • the second substrate (200) when it is a multi-layer substrate, although not shown, it may include: a second core layer; a plurality of second insulating layers built up on one side or both sides of the second core layer; a plurality of second circuit pattern layers arranged between the second core layer and the second insulating layer and between the second insulating layers; and a second via formed through the second insulating layer and electrically connecting the second circuit pattern layers.
  • the second circuit pattern layer may be arranged on the second insulating layer as the outermost layer.
  • the second core layer may be replaced with the second insulating layer.
  • the second circuit pattern layer can perform various functions depending on the design of the corresponding layer, and can be, for example, a feed line, a ground line, a ground electrode, etc.
  • This second circuit pattern layer e.g., a feed line
  • the second core layer and the second insulating layer may be insulating materials commonly known in the art. Since the description of the insulating material is the same as that described with respect to the first substrate, the description is omitted. However, the second core layer and the second insulating layer may be made of a material different from at least one of the first core layer and the first insulating layer of the first substrate (100). According to one example, the second core layer and the second insulating layer may each be a resin layer formed of a material selected from the group consisting of a polyimide resin, a polyester, and a fluorine-based resin.
  • the second core layer, the second insulating layer, or both of them may be a resin layer formed of a resin having a high curing temperature, such as about 250 to 350° C. (e.g., a fluorine-based resin, etc.).
  • a resin having a high curing temperature such as about 250 to 350° C. (e.g., a fluorine-based resin, etc.).
  • This second substrate (200) is a substrate composed of a different material from the first substrate (100), and may be, for example, a flexible substrate, specifically, a flexible multilayer printed circuit board.
  • the second substrate (200) is a flexible substrate that is longer than the first substrate and has excellent bending characteristics, it can radiate signals in two different directions, such as horizontal and vertical directions.
  • the second substrate (200) may be a flexible substrate having a flexural strength of about 500 to 1000 times according to the JIS C 6471 test method.
  • the flexural strength was tested according to the JIS C 6471 test method, and the test conditions were a load of 0.5 kgf at a thickness of 50 ⁇ m, a speed of 175 cpm (cycles per minute), an angle of 135 °, and a radius of 0.38 mm.
  • the second substrate (200) may be L-shaped including non-linear or curved portions.
  • the antenna-in-package of the present invention can radiate signals in two different directions, such as horizontal and vertical directions, thereby improving communication coverage characteristics.
  • the second substrate (200) may include a first flat portion (200A) having a portion of one surface overlapping the first substrate (100) and having one or more first antenna elements (500) arranged thereon; a bent portion (200B) extending and bent from the first flat portion (200A); and a second flat portion (200C) extending from the bent portion (200B) and having one or more second antenna elements arranged thereon.
  • the bending angle of the bent portion (200B) may be about 45 to 90°.
  • the first flat portion (200A) and the second flat portion (200C) are arranged at positions orthogonal to each other, signals can be radiated in two directions that are 90° apart.
  • the adhesive layer (300) is disposed between the first substrate (100) and the second substrate (200) to attach (bond) the first substrate (100) and the second substrate (200), thereby integrating the first substrate (100) and the second substrate (200).
  • the present invention mounts the second substrate (200) on the first substrate (100) through the adhesive layer (300), so that the bonding area is larger compared to the case of applying a package ball (e.g., BGA), and thus, it is superior in terms of reliability, and thus, mass productivity can be improved.
  • a package ball e.g., BGA
  • the adhesive usable in the present invention is not particularly limited as long as it is an adhesive known in the art, and may be, for example, a bonding sheet, and can be bonded at a temperature of about 150 to 190° C.
  • the bonding sheet may include a substrate layer; and an adhesive resin layer laminated on both sides of the substrate layer.
  • the substrate layer may be polyimide (PI), polyethylene terephthalate (PET), polyethylene (PE), or the like, and may be polyimide (PI) as an example.
  • the main resin of the adhesive resin layer may be an epoxy resin, an acrylic resin, or the like.
  • the bonding sheet may include first and second release substrates, and an adhesive resin layer interposed therebetween.
  • the first and second release substrates may be polyethylene terephthalate (PET), etc.
  • the main resin of the adhesive resin layer may be an epoxy resin, an acrylic resin, etc.
  • the thickness of the adhesive layer (100) is not particularly limited.
  • the dielectric constant (Df) may vary depending on the thickness of the adhesive layer (100), and the thinner the adhesive layer (100), the more the antenna-in-package can be miniaturized and lightened. Therefore, it is appropriate to adjust the thickness of the adhesive layer (100) to a range of about 10 to 50 ⁇ m.
  • the adhesive layer (300) may include a plurality of vias (310) formed to penetrate in the thickness direction. Through each of the vias (310), the first substrate (100) and the second substrate (200) may be electrically connected, and ultimately, the RFIC (400) on the first substrate (100) and the antenna element (500) on the second substrate (200) may be electrically connected. Meanwhile, in the present invention, even in a portion where the via (310) does not exist, the first substrate (100) and the second substrate (200) may transmit a signal through electrical mutual coupling, and thus, the RFIC (400) and the antenna element (500) may be electrically connected.
  • the above via (310) can be formed through a via formation process commonly known in the art.
  • a via hole such as a PTH (Plating Through Hole) or an LVH (Laser Via Hole) can be formed by using a method such as etching or laser drilling, and then plating the inner wall of the via hole to form the via.
  • the first substrate (100) may additionally include a first copper foil (110) disposed on a surface in contact with the adhesive layer (300), and the second substrate (200) may additionally include a second copper foil (210) disposed on a surface in contact with the adhesive layer (300).
  • the first and second copper foils (110, 210) may be arranged in the form of a circuit pattern by etching a portion (e.g., a portion around a power supply portion). In this case, the present invention can minimize a delamination phenomenon at an adhesive interface.
  • both the first and second copper foils (110, 210) may be low-contrast copper foils.
  • the first and second copper foils (110, 210) may each have a 10-point average roughness (Rz) in the range of about 1 to 2 ⁇ m.
  • the antenna-in-package of the present invention may additionally include a radio frequency integrated circuit (RFIC) (400), as illustrated in FIG. 1.
  • RFIC radio frequency integrated circuit
  • the RFIC (400) is a circuit that generates an RF signal to be radiated through the antenna element (500), and may be one or more.
  • the RFIC (400) is placed (mounted) on the first substrate (100) through a package ball (e.g., BGA, LGA), and is electrically connected to the first substrate (100).
  • the first substrate (100) may be connected to the second substrate (200) in a direct power supply manner through the via (310) of the adhesive layer (300), as described above, or may be connected to the second substrate (200) in a coupling power supply manner to transmit a signal.
  • the RFIC (400) may be electrically connected to each antenna element (500) through each power supply line in the first and second substrates (100, 200), or may be electrically connected to each antenna element (500) through a coupling power supply manner to transmit a high-frequency signal.
  • the antenna-in-package of the present invention may additionally include a beamforming integrated circuit (BFIC) when the antenna is a beamforming antenna in which a plurality of antenna elements are arranged to implement beamforming.
  • BFIC beamforming integrated circuit
  • One or more BFICs are placed (mounted) on the first substrate (100) through a package ball (e.g., BGA, LGA) and electrically connected to the first substrate (100).
  • a package ball e.g., BGA, LGA
  • These BFICs (not shown) may be electrically connected to each antenna element (500) through each feed line in the first and second substrates (100, 200), or may be electrically connected to each antenna element (500) through a coupling feed method.
  • the antenna-in-package of the present invention may further include a connector (600) disposed on the first substrate (100) and electrically connected to the first substrate (100), as illustrated in FIG. 1.
  • the connector (600) may be connected to a coaxial cable or a flexible printed circuit board (FPCB: Flexible PCB), etc., to provide a physical and/or electrical connection path with other components in the communication device.
  • FPCB Flexible PCB
  • the material or shape of the connector (600) is not particularly limited, and those commonly known in the art may be applied.
  • the antenna-in-package of the present invention may include a plurality of antenna elements (500), as illustrated in FIG. 1.
  • the antenna element (500) transmits and/or receives an RF (radio frequency) signal, and may transmit and receive, for example, a signal having a millimeter wavelength (mmWave).
  • the antenna element (500) includes at least one antenna pattern, a feed line for transmitting a signal to the antenna pattern, and a ground.
  • the antenna pattern may be referred to as a radiating unit.
  • the feed line may have a strip-line structure, a microstrip structure, or an embedded coplanar waveguide line structure.
  • the antenna element (500) is electrically connected to the RFIC (400) through the feed line in the first and second substrates (100, 200), and may receive a signal from the RFIC (400) and radiate the signal, or transmit the received signal to the RFIC (400).
  • the plurality of antenna elements (500) may include one or more first antenna elements (500A) arranged on a first flat portion (200A) of the second substrate (200); and one or more second antenna elements (500B) arranged on a second flat portion (200C) of the second substrate (200).
  • the first flat portion (200A) is arranged to extend along a main surface of the first substrate (100)
  • the second flat portion (200C) is arranged to extend along a side surface of the first substrate (100). Therefore, since the first antenna element (500A) and the second antenna element (500B) can radiate signals in two different directions, such as a vertical direction and a horizontal direction, respectively, the antenna-in-package of the present invention can have improved communication coverage.
  • An antenna-in-package includes a first substrate (100); a second substrate (200); an adhesive layer (300) interposed therebetween; and one or more third substrates (700) disposed on the second substrate.
  • the antenna-in-package of the present invention may further include an RFIC (400) disposed on the first substrate (100), a plurality of antenna elements (500) disposed on the second substrate (200), and a connector (600) disposed on the first substrate, as illustrated in FIG. 3.
  • the antenna-in-package of the present invention may further include a BFIC (not illustrated) disposed on the first substrate (100).
  • the first substrate (100), second substrate (200), adhesive layer (300), RFIC (400), antenna element (500), connector (600), and BFIC are each the same as those described in the first embodiment, and therefore are omitted.
  • the third substrate (700) is a substrate that is placed between at least one of the plurality of antenna elements (500) and the second substrate (200), and may be a single-layer or multi-layer substrate.
  • the distance between the antenna element (500) and the ground electrode (not shown) in the second substrate (200) increases, so that the frequency bandwidth of the antenna element can be widened, and thus the antenna-in-package of the present invention can implement wideband characteristics.
  • the material of the third substrate may be a rigid substrate, a flexible substrate, or a rigid-flexible substrate.
  • the third substrate (700) when the third substrate (700) is a rigid substrate, the third substrate (700) can be mounted on the second substrate (200) through a package ball (e.g., BGA, LGA).
  • a package ball e.g., BGA, LGA
  • the third substrate (700) when the third substrate (700) is a rigid substrate, the third substrate (700) may be mounted on the second substrate (200) through a second adhesive layer (not shown). Since the description of the second adhesive layer is the same as that described for the adhesive layer of the first embodiment, it is omitted.
  • the third substrate (700) when the third substrate (700) is a flexible substrate, the third substrate (700) may be mounted by being directly attached to the surface of the second substrate (200).
  • the method of mounting the third substrate may include stacking the third substrate (700) on the second substrate (200) and then attaching the third substrate (700) on the second substrate (200) through a high temperature and high pressure press process.
  • the high temperature and high pressure press process may be performed by thermally compressing the laminate of the second substrate and the third substrate at a temperature of about 150 to 190° C. and a pressure of about 25 to 40 kgf/cm 2 for about 2 to 5 hours to integrate the laminate.
  • the third substrate (700) can transmit a signal through a via formed at the interface with the second substrate (200). In addition, the third substrate (700) can also transmit a signal through electrical mutual coupling with the second substrate (200).
  • the present invention provides an electronic device including the above-described antenna-in-package.
  • Examples of the electronic devices may include portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliance devices.
  • portable communication devices e.g., smartphones
  • computer devices e.g., smartphones
  • portable multimedia devices e.g., portable medical devices, cameras, wearable devices, or home appliance devices.
  • a portable communication device may include a BBIC (Baseband Integrated Circuit) that constitutes the aforementioned antenna-in-package and a baseband signal processing circuit.
  • the portable communication device may up-convert a signal transmitted from the BBIC to the antenna-in-package into a high-frequency signal and radiate the signal from the antenna element, and down-convert a high-frequency signal received from the antenna element and perform signal processing in the BBIC.
  • BBIC Baseband Integrated Circuit

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Abstract

La présente invention concerne une antenne encapsulée dans un boîtier et un dispositif de communication la comprenant, l'antenne encapsulée dans un boîtier comprenant : un premier substrat sur lequel est monté un circuit intégré à radiofréquence (RFIC) ; un second substrat sur lequel sont disposés une pluralité d'éléments d'antenne ; et une couche adhésive disposée entre le premier substrat et le second substrat. La présente invention offre d'excellentes performances de rayonnement dans un espace limité et facilite la prévision des caractéristiques RF, ce qui permet d'obtenir une excellente productivité de masse.
PCT/KR2024/019844 2023-12-06 2024-12-05 Antenne encapsulée dans un boîtier et dispositif électronique la comprenant Pending WO2025121909A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2023-0175974 2023-12-06
KR1020230175974A KR20250086379A (ko) 2023-12-06 2023-12-06 안테나-인-패키지 및 이를 포함하는 전자 장치

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WO2025121909A1 true WO2025121909A1 (fr) 2025-06-12

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190080699A (ko) * 2017-12-28 2019-07-08 삼성전기주식회사 안테나 모듈
KR20200007377A (ko) * 2018-07-13 2020-01-22 삼성전자주식회사 안테나 구조체 및 안테나를 포함하는 전자 장치
KR20210018052A (ko) * 2019-08-05 2021-02-17 삼성전기주식회사 안테나 모듈 및 이를 포함하는 전자기기
KR20220025093A (ko) * 2019-07-02 2022-03-03 비아셋, 인크 낮은 프로파일 안테나 장치
KR20230144796A (ko) * 2022-04-08 2023-10-17 동우 화인켐 주식회사 안테나 구조체 및 이를 포함하는 디스플레이 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190080699A (ko) * 2017-12-28 2019-07-08 삼성전기주식회사 안테나 모듈
KR20200007377A (ko) * 2018-07-13 2020-01-22 삼성전자주식회사 안테나 구조체 및 안테나를 포함하는 전자 장치
KR20220025093A (ko) * 2019-07-02 2022-03-03 비아셋, 인크 낮은 프로파일 안테나 장치
KR20210018052A (ko) * 2019-08-05 2021-02-17 삼성전기주식회사 안테나 모듈 및 이를 포함하는 전자기기
KR20230144796A (ko) * 2022-04-08 2023-10-17 동우 화인켐 주식회사 안테나 구조체 및 이를 포함하는 디스플레이 장치

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