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WO2025118201A1 - Stratifiés adhésifs sensibles à la pression de silicone - Google Patents

Stratifiés adhésifs sensibles à la pression de silicone Download PDF

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Publication number
WO2025118201A1
WO2025118201A1 PCT/CN2023/136902 CN2023136902W WO2025118201A1 WO 2025118201 A1 WO2025118201 A1 WO 2025118201A1 CN 2023136902 W CN2023136902 W CN 2023136902W WO 2025118201 A1 WO2025118201 A1 WO 2025118201A1
Authority
WO
WIPO (PCT)
Prior art keywords
psa
component
groups
sensitive adhesive
pressure sensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2023/136902
Other languages
English (en)
Inventor
Maki Itoh
Qing Cao
Akihiro Nakamura
Michitaka Suto
Masahiro Saito
Takakazu Hino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Toray Co Ltd
Dow Silicones Corp
Original Assignee
Dow Toray Co Ltd
Dow Silicones Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Toray Co Ltd, Dow Silicones Corp filed Critical Dow Toray Co Ltd
Priority to PCT/CN2023/136902 priority Critical patent/WO2025118201A1/fr
Publication of WO2025118201A1 publication Critical patent/WO2025118201A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes

Definitions

  • the present invention relates to a silicone pressure sensitive adhesive (PSA) laminate, a pressure sensitive adhesive layer for making the laminate and an electronic equipment or electrical device comprising the silicone pressure sensitive adhesive (PSA) laminate.
  • PSA silicone pressure sensitive adhesive
  • silicone pressure sensitive adhesive for assembly applications is growing, which is expected more than masking and protective applications.
  • the assembly applications include an optically clear adhesive (OCA) for displays (automotive display, foldable display etc. ) in which control of rheological properties is an essential requirement in addition to adhesion.
  • OCA optically clear adhesive
  • Many of these applications, particularly foldable electronics, require low modulus at a wide range of service temperatures.
  • existing silicone PSA shows a dynamic shear storage modulus (G’ ) of 3-20 MPa at -20 °C
  • the assembly applications generally require that much below 1 MPa.
  • the inherent low modulus of silicones (at low temperatures) with well-crosslinked elasticity is one of the strong points.
  • the OCA is coated on a release liner, cured, and covered with another release liner to make a liner/OCA/liner laminate.
  • one side of the liner is peeled off to laminate the OCA to a substrate, followed by peeling off another side of the liner to laminate to another substrate to assemble display panel etc.
  • Patent Document 1 describes a Si PSA layer having fine particles of 2-15 ⁇ m in diameter which is able to be handled without a release liner, and no adhesion is observed (with the force below 1 N/cm 2 ) .
  • the modulus of the PSA is not specified, and with the presence of particles, the haze values are ⁇ 5%which is unable to be used as an OCA.
  • Patent Document 2 describes a multi-layer Si PSA of which release force after 46 days at 49°C is ⁇ 195 gf/inch.
  • the release mechanism is stretch release with a first pressure-sensitive adhesive layer facing a release liner and a second comprising an elastomer, and the first pressure-sensitive adhesive comprises a silicone polyurethane block copolymer.
  • the stretch-releasing PSA of Patent document 2 does not refer to a release force from the liner for specific rheology of the PSA, and since the elastomer layer is attached to the PSA layer, the material cannot be used for assembly applications.
  • Patent Document 3 describes laminates of fluoro-silicone release liner/Si PSA/fluoro-silicone release liner with wide composition of the release coating and the PSA.
  • the release force values of 3-15 gf/inch for the easy side and 11-230 gf/inch for the tight side are described and that no OCA damage is observed. However, these are not linked to any rheological property of the PSA.
  • Patent Document 1 WO2017010140A1
  • Patent Document 2 WO2008141004A1
  • the present invention has been created in order to solve such problems, and an objective thereof is to provide a “soft” PSA (with low modulus at small deformation, low stress at large deformation, large creep etc. ) for display applications as OCA including foldable displays and automotive displays. Silicone PSA is advantageous over acrylic PSA in the softness particularly at low temperatures together with good elasticity for recovery function.
  • Another objective of the present invention is to provide use of the pressure sensitive adhesive (PSA) layer as an OCA layer and an electronic equipment or electrical device comprising the silicone pressure sensitive adhesive (PSA) laminate.
  • the easy side of the liner will be peeled off and the PSA is laminated to a designated substrate, followed by peeling off the tight side liner to laminate with another substrate.
  • the release force needs to be sufficiently low so that (1) the easy liner can be peeled off without damaging the PSA (not the PSA film distorted by delamination from the tight side on peeling off the easy side) , and (2) the tight side liner can be peeled off without surface roughening of the PSA to prevent from losing transparency in the assembly.
  • the liner/PSA/liner laminates with low enough release force can be used for assembly applications that require softness.
  • a silicone pressure sensitive adhesive (PSA) laminate comprising:
  • wet/tight side release force between the first release liner and the cured silicone PSA layer (the first interface) is below 100 gf/inch at a peel rate of 0.3 m/min for PSA having a dynamic storage modulus at -20°C lower than 1 MPa and a thickness of 50 ⁇ m.
  • a silicone pressure sensitive adhesive (PSA) laminate comprising:
  • wet/tight side release force between the first release liner and the cured silicone PSA layer (the first interface) is below 100 gf/inch at a peel rate of 0.3 m/min for PSA having a dynamic storage modulus at -20°C lower than 1 MPa, a shear stress at 700%shear strain below 60 kPa and a thickness of 50 ⁇ m.
  • the cured silicone PSA layer is obtained by curing a PSA composition comprising:
  • component (B) wherein the mass ratio of component (B) to component (A) is within a range of 0.5 to 3.5.
  • component (B) is (B1) an organopolysiloxane resin or mixture thereof which consists essentially of R 3 SiO 1/2 units and SiO 4/2 units, where R is a monovalent organic group, and 90 mol %or more of R is an alkyl group having 1 to 6 carbon atoms or a phenyl group; component (C) is present in an amount such that the molar ratio of the amount of SiH groups in component (C) to the total amount of the alkenyl groups in components (A) and (B) is 1 to 100; and
  • component (D) is a platinum-based catalyst and is present in an amount such that the content of a platinum based metal in a solid content of the composition is within a range of 0.1 to 200 ppm in the PSA composition excluding solvents.
  • the PSA composition further comprises (A′) a linear organopolysiloxane which does not contain a carbon-carbon double bond-containing reactive group in the molecule.
  • component (C) is present in an amount such that the molar ratio of the amount of SiH groups in component (C) to the total amount of the alkenyl groups in components (A) and (B) is 10 to 100 or 20 to 80.
  • a pressure sensitive adhesive layer obtained by curing is obtained by curing a PSA composition
  • a PSA composition comprising:
  • component (B) wherein the mass ratio of component (B) to component (A) is within a range of 0.5 to 3.5.
  • PSA pressure sensitive adhesive
  • PSA is used as an optically clear adhesive (OCA) for displays.
  • OCA optically clear adhesive
  • an electronic equipment or electrical device comprising the silicone pressure sensitive adhesive (PSA) laminate.
  • PSA silicone pressure sensitive adhesive
  • the silicone pressure sensitive adhesive (PSA) laminate formed by the PSA layer can exhibit a wet/tight side release force between the first release liner and the cured silicone PSA layer (the first interface) is below 100 gf/inch at a peel rate of 0.3 m/min for PSA having a dynamic storage modulus at -20°C lower than 1 MPa and a thickness of 50 ⁇ m; or a wet/tight side release force between the first release line and the cured silicone PSA layer (the first interface) is below 100 gf/inch at a peel rate of 0.3 m/min for PSA having a dynamic storage modulus at -20°C lower than 1 MPa, a shear stress at 700%shear strain below 60 kPa and a thickness of 50 ⁇ m.
  • PSA silicone pressure sensitive adhesive
  • PSA silicone pressure sensitive adhesive
  • the silicone pressure sensitive adhesive (PSA) composition rapidly cures via a curing reaction containing a hydrosilylation reaction so as to form a pressure sensitive adhesive layer having wet/tight side release force between the first release line and the cured silicone PSA layer (the first interface) is below 100 gf/inch at a peel rate of 0.3 m/min for PSA having a dynamic storage modulus at -20°C lower than 1 MPa and a thickness of 50 ⁇ m.
  • each component in the composition the range of the organopolysiloxane resin, the mass ratio of the organopolysiloxane resin to the linear organopolysiloxane, and the characteristics of the pressure sensitive adhesive layer will be described below.
  • the PSA composition comprising:
  • the silicone PSA composition may further comprise (A′) a linear organopolysiloxane which does not contain a carbon-carbon double bond-containing reactive group in the molecule.
  • the composition may further contain (F) a curing retarder from the perspective of handleability, and may further contain other additives to such an extent that is not at odds with the object of the present invention.
  • component (A) is a linear (i.e., chain-form) organopolysiloxane having alkenyl group in numbers greater than 1 on average per molecule, with a preferable number of alkenyl groups being no less than 1.5 per molecule, with a more preferable number of alkenyl groups being no less than 2.0 per molecule.
  • the number of alkenyl groups on average per molecule may be in range from 1.01 to 5.0, from 1.01 to 4.0, from 1.01 to 3.0, from 1.01 to 2.0, from 1.01 to 1.5, from 1.5 to 5.0, from 1.5 to 4.0, from 1.5 to 3.0, from 1.5 to 2.0, from 2.0 to 5.0, from 2.0 to 4.0, from 2.0 to 3.0, from 3.0 to 5.0, from 3.0 to 4.0 or from 4.0 to 5.0.
  • alkenyl groups in component (A) examples include alkenyl groups having a carbon number of from 2 to 10, such as vinyl groups, allyl groups, butenyl groups, pentenyl groups, hexenyl groups, and heptenyl groups, with vinyl groups or hexenyl groups being particularly preferable.
  • Examples of the bonding position of the alkenyl groups in component (A) include the molecular chain terminals and/or the molecular side chains. Note that component (A) may contain a single component or may be a mixture of two or more different components.
  • Examples of silicon-bonded organic groups other than alkenyl groups in the organopolysiloxane of component (A) include alkyl groups such as methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups and heptyl groups; aryl groups such as phenyl groups, tolyl groups, xylyl groups and naphthyl groups; aralkyl groups such as benzyl groups and phenethyl groups; and halogenated alkyl groups such as chloromethyl groups, 3-chloropropyl groups and 3, 3, 3-trifluoropropyl groups, with methyl groups and phenyl groups being particularly preferable.
  • alkyl groups such as methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups and heptyl groups
  • aryl groups such as phenyl groups, tolyl groups, xyly
  • component (A) is different from component (B) and has a linear organopolysiloxane molecular structure.
  • component (A) is preferably a straight chain or partially branched straight chain and may partially include a cyclic three-dimensional network.
  • the main chain of the organopolysiloxane consists of repeating diorganosiloxane units (i.e., -SiO 2/2 or D units) and is preferably a straight-chain or branched-chain diorganopolysiloxane capped at both molecular terminals with triorganosiloxy groups.
  • the siloxane units that provide a branched-chain organopolysiloxane are T units or Q units described below.
  • the properties of component (A) at room temperature may be those of an oily or raw rubber-like substance, with the viscosity of component (A) being no lower than 50 mPa. s and particularly preferably no lower than 100 mPa. s at 25°C.
  • the linear organopolysiloxane composition according to the present invention is a solvent type
  • at least a portion of component (A) is (A1) a raw rubber-like alkenyl group-containing organopolysiloxane having a viscosity of no less than 100,000 mPa.
  • s at 25°C or having a plasticity number (the thickness when a 1 kgf load applied for 3 minutes to a 4.2 g spherical sample at 25°C was read up to 1/100 mm and this value was multiplied by 100) within a range of from 50 to 200, preferably 80-200, more preferably 100-200, as measured in accordance with the method as prescribed in JIS K6249.
  • volatile or low molecular weight siloxane oligomers such as octamethylcyclotetrasiloxane (D4) , decamethylcyclopentasiloxane (D5) , etc.
  • the degree can be designed as desired, but must be less than 1%by mass of the total component (A) , less than 0.1%by mass for each siloxane oligomer, and must be reduced to the vicinity of the detection limit as required.
  • component (A) having a lower viscosity than that of component (A1) is also available as component (A) of the present invention.
  • component (A2) having a lower viscosity than that of component (A1) is also available as component (A) of the present invention.
  • an organopolysiloxane (A2) containing alkenyl groups having a viscosity of less than 100,000 mPa. s at 25°C is available.
  • examples other than the viscosity of component (A2) are the same as component (A1) .
  • component (A) is preferably an alkenyl group-containing organopolysiloxane with a high degree of polymerization, which is component (A1) , with 75 to 100 mass%thereof being particularly preferably component (A1) .
  • component (A1) an alkenyl group-containing organopolysiloxane with a higher degree of polymerization
  • component (A2) an alkenyl group-containing organopolysiloxane with a lower degree of polymerization
  • the mass ratios of component (A1) to component (A2) range from 50: 50 to 100: 0, preferably 75:25 to 100: 0, more preferably 80: 20 to 100: 0.
  • the organopolysiloxane resin of component (B) is an adhesion imparting component imparting adhesive force to a substrate and simultaneously achieves a storage elastic modulus at low temperatures and a practical adhesive force range, using an organopolysiloxane resin mixture in a constant ratio to component (A) .
  • component (B) is an organopolysiloxane resin having a small average molecular weight, wherein the content of hydroxyl groups or hydrolyzable groups is suppressed, and wherein a hydrolysis/polymerization reaction between components (B) tends not to occur, while the selective use of an organopolysiloxane resin having a small average molecular weights achieves a predetermined storage elastic modulus and practical adhesive force range in the pressure sensitive adhesive layer which is the cured product thereof.
  • component (B) is an organopolysiloxane resin, wherein the total content of hydroxyl groups and hydrolyzable groups with respect to the number of all silicon atoms in the molecule is 9.0 mole%or less, 7.0 mole%or less, 5.0 mole%or less, 3.0 mole%or less or 1.0 mole%or less.
  • the hydroxyl groups or hydrolysable groups are groups which are directly bonded to silicon atoms of T units or Q units, etc. among the siloxane units in the below-mentioned resin structure and obtained by hydrolyzing silanes or silane derivatives. Consequently, the content of hydroxyl groups or hydrolyzable groups can be reduced by hydrolyzing the synthesized organopolysiloxane resin with a silylating agent such as trimethylsilane.
  • component (B) when the amount of the hydroxyl groups or hydrolyzable groups exceeds the abovementioned upper limit, the condensation reaction between the organopolysiloxane resin molecules proceeds, facilitating the formation of an organopolysiloxane resin structure having a large molecular weight in the cured product.
  • Such an organopolysiloxane resin having a high molecular weight tends to impair the curability of the overall composition, the curability of the composition at low temperatures may be insufficient, and the resulting pressure sensitive adhesive layer may not have sufficient storage elastic modulus for practical use.
  • component (B) is an organopolysiloxane resin having a three dimensional structure.
  • examples thereof include a resin consisting of R 2 SiO 2/2 units (D units) and RSiO 3/2 units (T units) (wherein, each R independently represents a monovalent organic group) and having a content of hydroxyl groups or hydrolyzable groups within the abovementioned range, a resin consisting of only T units and having a content of hydroxyl groups or hydrolyzable groups within the abovementioned range, and a resin consisting of R 3 SiO 1/2 units (M units) and SiO 4/2 units (Q units) and having a content of hydroxyl groups or hydrolyzable groups within the abovementioned range.
  • resin also referred to as MQ resin
  • MQ resin which consists of R 3 SiO 1/2 units (M units) and SiO 4/2 units (Q units) , wherein the sum of the content of hydroxyl groups and hydrolyzable groups is preferably within a range of 0.0 to 1.6 mass%when all of these functional groups are converted into hydroxyl groups.
  • the monovalent organic group of R is preferably a monovalent hydrocarbon group having a carbon number of from 1 to 10, with examples thereof including alkyl groups having a carbon number of from 1 to 10, alkenyl groups having a carbon number of from 2 to 10, aryl groups having a carbon number of from 6 to 10, cycloalkyl groups having a carbon number of from 6 to 10, benzyl groups, phenylethyl groups and phenylpropyl groups.
  • 90 mol%or more of R is preferably alkyl groups having 1 to 6 carbon atoms or phenyl groups, while 95 to 100 mol%of R is particularly preferably methyl groups or phenyl groups.
  • component (B) is (B1) an organopolysiloxane resin or mixture thereof which consists essentially of R 3 SiO 1/2 units and SiO 4/2 units, where R is a monovalent organic group and 90 mol %or more of R is an alkyl group having 1 to 6 carbon atoms or a phenyl group.
  • component (B) is a resin consisting of R 3 SiO 1/2 units (M units) and SiO 4/2 units (Q units)
  • the molar ratio of M units to Q units is preferably from 0.5 to 2.0.
  • component (B) may also be included in component (B) to such an extent that does not impair the characteristics of the present invention. Further, in order to prevent contact failure, etc., low molecular weight siloxane oligomer in these organopolysiloxane resins may be reduced or eliminated.
  • the weight average molecular weight (Mw) of said organopolysiloxane resin serving as component (B) is not limited, and at least one organopolysiloxane resin having specific Mw or a mixture of two or more of organopolysiloxane resin having different Mw can be used as component (B) .
  • Mw of component (B) measured in terms of standard polystyrene by gel permeation chromatography (GPC) ranges from 500 to 20,000 (g/mol) , preferably from 1,000 to 17, 500 (g/mol) , most preferably from 2,000 to 16,500 (g/mol) .
  • the pressure sensitive adhesive organopolysiloxane composition according to the present invention characteristically has a mass ratio of component (B) (which is an organopolysiloxane resin) to component (A) (which is a chain reactive siloxane component) within the specific range.
  • the mass ratio of component (B) to component (A) is within a range of 0.5 to 3.5, 0.8 to 3.0, 0.8 to 2.6 or 0.8 to 2.4. If components (A) and (A′) are used at above mass ratio, even if the mass ratio of component (B) to component (A) is within a range of more than 1.8 to 2.4, the technical effects of the present invention can also be achieved.
  • component (C) is an organohydrogenpolysiloxane having two or more Si-H bonds per molecule and is a crosslinking agent in the organopolysiloxane composition of the present invention.
  • the molecular structure of component (C) is not particularly limited, with examples thereof including a straight chain, a partially branched straight chain, a branched chain, a cyclic, or an organopolysiloxane resin structure, and with a straight chain, a partially branched straight chain, or an organopolysiloxane resin structure being preferable.
  • the bonding position of silicon-bonded hydrogen atoms is not particularly limited, with examples thereof including molecular terminals, side chains, or both molecular terminals and side chains.
  • the content of the silicon-bonded hydrogen atoms is from 0.1 to 2.0 mass%preferably from 0.5 to 1.7 mass%.
  • Exemplary silicon-bonded organic groups in component (C) include: alkyl groups having 1 to 8 carbon atoms such as methyl groups, ethyl groups, propyl groups, butyl groups and octyl groups; aryl groups such as phenyl groups and tolyl groups; aralkyl groups such as benzyl groups and phenethyl groups; and halogenated alkyl groups such as 3-chloropropyl groups and 3, 3, 3-trifluoropropyl groups, wherein 50%moles or more of the total number thereof are preferably alkyl groups having 1 to 8 carbon atoms or phenyl groups. From the perspective of ease of manufacture and compatibility with the preferred components (A) and (B) described above, the other organic groups are preferably methyl groups or phenyl groups.
  • component (C) of the present invention is an organohydrogenpolysiloxane, which is an organopolysiloxane resin
  • organopolysiloxane copolymers consisting of siloxane units represented by the general formula: R’ 3 SiO 1/2 , siloxane units represented by the general formula R’ 2 HSiO 1/2 , and siloxane units represented by the formula: SiO 4/2
  • organopolysiloxane copolymers consisting of siloxane units represented by the general formula: R’ 2 HSiO 1/2 and siloxane units represented by the formula: R’SiO 3/2
  • component (C) examples include tris (dimethylhydrogensiloxy) methylsilane, tetra (dimethylhydrogensiloxy) silane, methylhydrogenpolysiloxanes capped at both terminals with trimethylsiloxy groups, dimethylsiloxane/methylhydrogensiloxane copolymers capped at both terminals with trimethylsiloxy groups, dimethylsiloxane/methylhydrogensiloxane copolymers capped at both terminals with dimethylhydrogensiloxy groups, cyclic methylhydrogen oligosiloxanes, cyclic methylhydrogensiloxane/dimethylsiloxane copolymers, methylhydrogensiloxane/diphenylsiloxane copolymers capped at both molecular terminals with trimethylsiloxy groups, methylhydrogensiloxane/diphenylsiloxane/dimethylsiloxane copolymers capped at
  • component (C) may use two or more different types in combination.
  • organosiloxanes may be given as examples.
  • Me and Ph respectively represent a methyl group and a phenyl group
  • m is an integer from 1 to 100
  • n is an integer from 1 to 50
  • b, c, d and e are each positive number, where the sum of b, c, d, and e in one molecule is 1.
  • the composition according to the present invention is hydrosilylation reaction curable and the usage amount of component (C) is not particularly limited as long as the composition can sufficiently cure via a hydrosilylation reaction.
  • the amount of silicon atom-bonded hydrogen atom (SiH) groups in component (C) with respect to the sum of the amount (substance amount) of alkenyl groups in component (A) and the amount (substance amount) of alkenyl groups in component (B) in the composition, that is, the molar ratio is preferably within a range of 1 to 100, 5 to 80, 10 to 70; and may be within a range of 15 to 60, within a range of 20 to 50, or within a range of 30 to 40.
  • the number of SiH groups per molecule can be designed to be 10 or more and 20 or more, is preferably more than 20, and more preferably 22 or more.
  • the substance amount of silicon atom-bonded hydrogen atoms (SiH) groups in component (C) with respect to the sum of the amount (substance amount) of alkenyl groups in component (A) and the amount (substance amount) of alkenyl groups in component (B) in the composition can be designed so as to be in a range of 10 to 60 and a range of 10 to 50.
  • the amount of the SiH groups falls below the abovementioned lower limit, the technical effect of improving adhesion to the substrate may not be achieved.
  • the amount of the SiH groups exceeds the abovementioned upper limit, the amount of unreacted residual curing agent becomes large, which may have adverse effects on curing physical properties such as the brittleness of the cured product or may cause problems such as gas generation.
  • a pressure sensitive adhesive layer can be formed which is sufficient for practical use even when the SiH/Vi ratio of the composition is outside the abovementioned range.
  • the organopolysiloxane composition of the present invention contains a hydrosilylation reaction catalyst.
  • hydrosilylation reaction catalysts include platinum-based catalysts, rhodium-based catalysts, and palladium-based catalysts, with platinum-based catalysts preferable in that they markedly accelerate the curing of the present composition.
  • platinum based catalyst include platinum fine powder, chloroplatinic acid, an alcohol solution of chloroplatinic acid, a platinum-alkenyl siloxane complex, a platinum-olefin complex, and a platinum-carbonyl complex, with a platinum-alkenyl siloxane complex particularly preferable.
  • alkenyl siloxane examples include 1, 3-divinyl-1, 1, 3, 3-tetramethyldisiloxane, 1, 3, 5, 7-tetramethyl-1, 3, 5, 7-tetravinylcyclotetrasiloxane, alkenyl siloxanes in which some of the methyl groups of these alkenyl siloxanes are substituted with groups selected from the group consisting of nitriles, amides, dioxolanes, sulfolanes, ethyl groups, phenyl groups, or the like, and alkenyl siloxanes in which the vinyl groups of these alkenyl siloxanes are substituted with allyl groups, hexenyl groups, or the like.
  • 1, 3-divinyl-1, 1, 3, 3-tetramethyldisiloxane is preferable because the platinum-alkenyl siloxane complex has good stability.
  • a non-platinum based metal catalyst such as iron, ruthenium, iron/cobalt, or the like may be used.
  • the amount of the platinum based metal with respect to the total amount of solids in the composition is within a range of 0.1 to 200 ppm, and may be within a range of 0.1 to 150 ppm, within a range of 0.1 to 100 ppm, or within a range of 0.1 to 50 ppm.
  • the platinum-based metal is a metal element of group VIII consisting of platinum, rhodium, palladium, ruthenium, and iridium; however, in practical use, the content of the platinum metal excluding the ligands of the hydrosilylation catalyst is preferably within the range described above.
  • the solid content is a component that forms the cured layer (primarily a main agent, an adhesion-imparting component, a crosslinking agent, a catalyst, and other non-volatile components) when the organopolysiloxane composition of the present invention is subjected to a curing reaction and does not include volatile components such as solvents that volatilize at the time of heat curing.
  • the content of the platinum based metal in the organopolysiloxane composition according to the present invention is 60 ppm or less, 50 ppm or less, 35 ppm or less, 30 ppm or less, 25 ppm or less, or 20 ppm or less, this may suppress discoloration or coloration of the transparent pressure sensitive adhesive layer, in particular, after curing or when heated or exposed to high energy rays such as UV rays.
  • the content of the platinum-based metal is not lower than 0.1 ppm, as when the content is lower than this lower limit, this may cause curing defects.
  • component (E) include acetylenic compounds, eneyne compounds, organic nitrogen compounds, organic phosphorus compounds, and oxime compounds.
  • Specific examples include: alkyne alcohols such as 3-methyl-1-butyne-3-ol, 3, 5-dimethyl-1-hexyne-3-ol, 3-methyl-1-pentyne-3-ol, 1-ethynyl-1-cyclohexanol, phenyl butanol, and the like; eneyne compounds such as 3-methyl-3-pentene-1-yne, 3, 5-dimethyl-1-hexyne-3-yne, and the like; methylalkenylcyclosiloxanes such as 2-ethynyl-4-methyl-2-pentene, 1, 3, 5, 7-tetramethyl-1, 3, 5, 7-tetravinylcyclotetrasiloxane, 1, 3, 5, 7-tetramethyl-1, 3, 5, 7-tetrahexenylcyclo
  • the pressure sensitive adhesive layer-forming organopolysiloxane composition of the present invention is preferably curable at 80 to 200°C with an increase in viscosity within 1.5-fold after 8 hours at room temperature following the preparation of the composition.
  • the suppression of thickening is important from the perspective of handleability, pot life, and characteristics after curing and contains a large excess of component (C) , wherein, even if the content of the platinum-based metal is optionally low, the curability can be ensured by curing at high temperature of at least a certain temperature (80 to 200°C) .
  • such a composition can be realized by selecting a suitable combination and compounded amounts of each of the components described above, the hydrosilylation catalyst, and component (E) .
  • the organopolysiloxane composition of the present invention may also contain an organic solvent as a solvent.
  • the type and blending amount of the organic solvent can be adjusted taking the coating workability, etc. into consideration.
  • organic solvents include: aromatic hydrocarbon-based solvents such as toluene, xylene and benzene; aliphatic hydrocarbon-based solvents such as heptane, hexane, octane and isoparaffin; ester-based solvents such as ethyl acetate and isobutyl acetate; ether-based solvents such as diisopropyl ether and 1, 4-dioxane; chlorinated aliphatic hydrocarbon-based solvents such as trichloroethylene, perchloroethylene and methylene chloride; and solvent volatile oils; with two or more types capable of being combined in accordance with the wettability of the sheet-like substrate or the like.
  • aromatic hydrocarbon-based solvents such as toluene, xylene and benzene
  • aliphatic hydrocarbon-based solvents such as heptane, hexane, octane and isoparaffin
  • the compounded amount of the organic solvent is preferably an amount such that a mixture of components (A) to (C) can be uniformly applied to a sheet-like substrate surface.
  • the compounded amount may be from 5 to 3000 parts by mass per total amount of 100 parts by mass of components (A) , (B) and (C) .
  • the organopolysiloxane composition of the present invention may optionally contain components other than the components described above to such an extent that does not impair the technical effects of the present invention.
  • the composition may contain: an adhesion promoter; a non-reactive organopolysiloxane such as a polydimethylsiloxane or a polydimethyldiphenylsiloxane; an antioxidant such as a phenol-type, a quinone-type, an amine-type, a phosphorus-type, a phosphite-type, a sulfur-type or a thioether-type antioxidant; a flame retardant such as a phosphate ester-type, a halogen-type, a phosphorus-type or an antimony-type flame retardant; and one or more types of antistatic agents consisting of a cationic surfactant, an anionic surfactant, a non-ionic surfactant or the like.
  • an adhesion promoter such
  • the organopolysiloxane composition according to the present invention can comprise a non-reactive organopolysiloxane such as a polydimethylsiloxane or polydimethyldiphenylsiloxane that does not contain a carbon-carbon double bond-containing reactive group such as an alkenyl group, acryl group or methacryl group.
  • a non-reactive organopolysiloxane such as a polydimethylsiloxane or polydimethyldiphenylsiloxane that does not contain a carbon-carbon double bond-containing reactive group such as an alkenyl group, acryl group or methacryl group.
  • the loss coefficient of the pressure sensitive adhesive layer can be increased using a polydimethyl siloxane having a hydroxyl group terminal, or a polydimethylsiloxane or polydimethyldiphenylsiloxane having a trimethylsiloxy terminal, with such compositions included within the scope of the present invention.
  • component (A′) is (A′1) a raw rubber-like organopolysiloxane having a viscosity of 100,000 mPa. s or more at 25°C or having a plasticity number within a range of 50 to 200 as measured in accordance with a method as described in JIS K6249.
  • component (A) s or more at 25°C or having a plasticity number within a range of 50 to 200 as measured in accordance with a method as described in JIS K6249; and the mass ratio of component (A) to component (A′) ranges from 100: 0 to 40: 60 in the composition.
  • the method of preparing the silicone PSA composition is not particularly limited and is performed by homogeneously mixing the respective components.
  • a solvent may be added as necessary and the composition may be prepared by mixing at a temperature of from 0 to 200°C using a known stirrer or kneader.
  • Aforementioned silicone PSA composition forms a cured adhesive layer when applied to a substrate and forms a cured product by heating under temperature conditions of from 80 to 200°C, preferably under temperature conditions of from 90 to 190°C.
  • application methods include gravure coating, offset coating, offset gravure, roll coating, reverse roll coating, air knife coating, curtain coating and comma coating.
  • the cured adhesive layer from said silicone PSA composition is arranged between the functional layers to bond/assemble the layers in the electronic article of this invention.
  • a pressure sensitive adhesive layer is obtained by curing the PSA composition.
  • the pressure sensitive adhesive layer is utilized in assembly applications, which require a wet/tight side release force below 100 gf/inch at a peel rate of 0.3 m/min for PSA having a dynamic storage modulus at -20°C lower than 1 MPa and a thickness of 50 ⁇ m.
  • the PSA is used as an optically clear adhesive (OCA) for displays.
  • a silicone pressure sensitive adhesive (PSA) laminate comprising:
  • wet/tight side release force between the first release liner and the cured silicone PSA layer (the first interface) is below 100 gf/inch, below 90 gf/inch, below 80 gf/inch, below 70 gf/inch, below 60 gf/inch, or below 50 gf/inch at a peel rate of 0.3 m/min for PSA having a dynamic storage modulus at -20°C lower than 1 MPa and a thickness of 50 ⁇ m.
  • a silicone pressure sensitive adhesive (PSA) laminate comprising:
  • wet/tight side release force between the first release liner and the cured silicone PSA layer (the first interface) is below 100 gf/inch, below 90 gf/inch, below 80 gf/inch, below 70 gf/inch, below 60 gf/inch, or below 50 gf/inch at a peel rate of 0.3 m/min for PSA having a dynamic storage modulus at -20°C lower than 1 MPa, a shear stress at 700%shear strain below 60 kPa and a thickness of 50 ⁇ m.
  • an electronic equipment or electrical device comprising the silicone pressure sensitive adhesive (PSA) laminate
  • the wet/tight side release force can be measure by coating a PSA on a wet/tight side release liner, cure the PSA, and laminate a PET film on the PSA, followed by peeling off the wet/tight side liner to measure the release force.
  • This can be carried out by holding the PET film vertically by laminating to a hard substrate, for example a plastic sheet, and pulling up the release liner in an angle of 180° at a fixed speed, for instance 0.3 m/min.
  • a dry/easy side liner is laminated onto the cured PSA.
  • the dry/easy side release liner is peeled off and the PSA on the wet/tight side release liner is laminated to a PET film, followed by measuring the release force in a same manner as described above..
  • gravure coating, offset coating, offset gravure, roll coating using an offset transfer roll coater, reverse roll coating, air knife coating, curtain coating using a curtain flow coater or the like, comma coating, Meyer bar, or another known method used for the purpose of forming a cured layer may be used without limitation.
  • the coating amount can be designed at a desired thickness in accordance with the application such as a display device, as one example, the thickness of the pressure sensitive adhesive layer after curing may be from 1 to 1000 ⁇ m, from 5 to 900 ⁇ m, or from 10 to 800 ⁇ m; however, there is no limitation thereto.
  • the pressure sensitive adhesive layer according to the present invention may be a single layer or a multilayer structure obtained by laminating two or more pressure sensitive adhesive layers, in accordance with the required characteristics.
  • Multiple pressure sensitive adhesive layer may be formed by bonding the pressure sensitive adhesive films (which are formed film by film) thereto, or the step of applying and curing the pressure sensitive adhesive layer-forming organopolysiloxane composition may be carried out multiple times on a film substrate (including a release layer) , etc.
  • the pressure sensitive adhesive layer according to the present invention may serve as other functional layers selected from a dielectric layer, conductive layer, heat dissipation layer, insulating layer, reinforcing layer, etc., in addition to adhering or sticking functions between members.
  • the silicone-based PSA layer of this invention in addition to adhering or sticking functions between members, can be applied as a damping/shock-absorption layer.
  • the electronic article having the silicone-based PSA layer of this invention need not have further interlayer damping/shock-absorption layer arranged between two functional layers.
  • the electronic article can be constructed without using other interlayer damping/shock-absorption layers other than the interlayer adhesive layer according to the present invention between two functional layers.
  • the electronic article having the silicone-based PSA layer of this invention as its interlayer adhesive layer is LED or OLED type display devices and its module thereof having a structure that transparent displaying unit is directly bonded or assembled to other functional unit with said interlayer adhesive layer, wherein the interlayer adhesive layer is a single adhesive/assembly layer sandwiched between said units in the display device.
  • the display devices having the silicone-based PSA layer can be designed to be substantively free from additional interlayer damping/shock-absorption layer except for said interlayer adhesive layer of the present invention (i.e. omitting thick and multi-layered damping/shock-absorption layer from the devices) , the overall thickness of said display can be thinner and lighter in comparison with conventional devices.
  • the cured layer obtained by curing the organopolysiloxane composition of the present invention is a pressure sensitive adhesive layer, in particular, a pressure sensitive adhesive layer
  • the cured layer is preferably treated as a laminate film that is peelably adhered to a film substrate provided with a release layer having a release-coating capability.
  • the release layer may also be referred to as a release liner, a separator, a release layer, or a release coating layer, and may preferably be a release layer having a release coating ability such as a silicone-based release agent, a fluorine-based release agent, an alkyd-based release agent, or a fluorosilicone-based release agent, or the release layer may be formed as a substrate itself which is not prone to adhering to the resin sheet for a pressure sensitive adhesive layer of the present invention by forming physically fine irregularities in the surface of the substrate.
  • a release layer obtained by curing a fluorosilicone release agent is preferably used as the release layer.
  • the cured product obtained by curing the organopolysiloxane composition according to the present invention has both viscoelasticity and adhesive strength as described above, making it useful as a member of various types of electronic equipment or electrical devices as elastic adhesive members.
  • it is useful as an electronic material, a member for a display device, or a member for a transducer (including sensors, speakers, actuators, and generators) , with a suitable application for the cured product being a member for an electronic part or a display device.
  • the cured product according to the present invention may be transparent or opaque, wherein, in particular, a film-shaped cured product, particularly a substantially transparent pressure sensitive adhesive film, is suitable as a member for a display panel or a display, and is particularly useful in so-called touch panel applications in which a device, particularly an electronic device, can be operated by touching a screen with a fingertip or the like.
  • the opaque elastic adhesive layer is not required to have transparency, making it particularly useful for applications of film-like or sheet-like members used in sensors, speakers, actuators, etc. which require constant elasticity or flexibility in the adhesive layer itself.
  • the pressure sensitive adhesive layer obtained by curing the organopolysiloxane composition according to the present invention is capable of achieving a pressure sensitive adhesive characteristic equivalent to conventional silicone pressure sensitive adhesive layers and can improve adhesion to the substrate of a display device, etc. without causing problems of poor curing or reduced curability.
  • curable organopolysiloxane compositions described in each example and comparative example were prepared using the components shown in Table 1.
  • PSA silicone pressure sensitive adhesive
  • the plasticity was measured in accordance with the method described in JIS K 6249, by measuring the thickness when a 1 kgf load was applied to a 4.2 g spherical sample for 3 minutes at 25°C to 1/100 mm accuracy, and multiplying by 100.
  • the organopolysiloxane composition was coated on a release liner described in Table 2 for the thickness of 50 ⁇ m after cure, followed by curing in a 150°C oven for 3 min. Onto the cured organopolysiloxane composition, another liner was laminated.
  • the release liner side that the organopolysiloxane composition before cure was coated was denoted as the “wet side” and the release liner side that the release liner was laminated onto the cured organopolysiloxane composition was denoted as the “dry side” .
  • the 50 ⁇ m thick organopolysiloxane film in between two release liner films was cut into 20 mm wide strips.
  • the wet side liner film was stuck to a 5 mm thick plastic sheet using a double-sided adhesive tape.
  • the plastic sheet was fixed vertically at the lower part of the tensile tester clamp together with the wet side liner coated with the organopolysiloxane and the dry side liner film was peeled off upwards vertically at the cross head speed of 0.3 m/min at 23°C/50%RH, to measure the dry side release force.
  • the organopolysiloxane on the wet side liner was then laminated to a 50 ⁇ m thick PET film.
  • the PET film was stuck to the plastic sheet in the same way and the wet side liner was peeled off in the same manner. The obtained values in gf/20 mm were converted into gf/inch.
  • Each organopolysiloxane composition was applied to a release liner with the thickness after curing of approximately 100 ⁇ m, followed by curing at 150°C for 5 minutes. Five or more of the cured organopolysiloxane composition films were laminated to obtain a film sample having a thickness of 500 ⁇ m or more, both surface of which were sandwiched between release liners.
  • the organopolysiloxane composition was applied to a release liner with the thickness after curing of approximately 280 ⁇ m, followed by curing at 150°C for 15 minutes.
  • two cured films were laminated to obtain a film sample having a thickness of 500 ⁇ m or more, both surface of which were sandwiched between release liners.
  • the film was cut into a round shape of 8 mm in diameter and was subjected to a dynamic mechanical analysis using a parallel plate measuring system by an Anton Paar model MCR301 rheometer.
  • the measurement conditions were within a range of -70°C. to 200°C at a frequency of 1 Hz and a temperature ramp of 3°C/minute, to provide storage elastic modulus G′, loss modulus G′′, and tan ⁇ , from which the G’ value at -20°C was obtained.
  • composition was coated on liner II-B and cured via the abovementioned method, both for release force and the viscoelasticity measurements via the abovementioned method, with the evaluation results indicated in Table 3.
  • composition was coated on liner II-B and cured via the abovementioned method, both for release force and the viscoelasticity measurements via the abovementioned method, with the evaluation results indicated in Table 3.
  • composition was coated on liner II-A and cured via the abovementioned method, both for release force and the viscoelasticity measurements via the abovementioned method, with the evaluation results indicated in Table 3.
  • Example 3 The same composition as Example 3 was coated on liner II-B and cured via the abovementioned method for release force measurement, with the evaluation results indicated in Table 3.
  • Example 3 The same composition as Example 3 was coated on liner II-C and cured via the abovementioned method for release force measurement, with the evaluation results indicated in Table 3.
  • composition was coated on liner II-B and cured via the abovementioned method, both for release force and the viscoelasticity measurements via the abovementioned method, with the evaluation results indicated in Table 3.
  • composition was coated on liner II-B and cured via the abovementioned method, both for release force and the viscoelasticity measurements via the abovementioned method, with the evaluation results indicated in Table 3.
  • composition was coated on liner II-B and cured via the abovementioned method, both for release force and the viscoelasticity measurements via the abovementioned method, with the evaluation results indicated in Table 3.
  • composition was coated on liner II-B and cured via the abovementioned method, both for release force and the viscoelasticity measurements via the abovementioned method, with the evaluation results indicated in Table 3.
  • Example 3 The same composition as Example 1 was coated on liner I and cured via the abovementioned method for release force measurement, with the evaluation results indicated in Table 3.
  • Example 2 The same composition as Example 2 was coated on liner I and cured via the abovementioned method for release force measurement, with the evaluation results indicated in Table 3.
  • Example 3 The same composition as Example 3 was coated on liner I and cured via the abovementioned method for release force measurement, with the evaluation results indicated in Table 3.
  • Example 6 The same composition as Example 6 was coated on liner I and cured via the abovementioned method for release force measurement, with the evaluation results indicated in Table 3.
  • Example 7 The same composition as Example 7 was coated on liner I and cured via the abovementioned method for release force measurement, with the evaluation results indicated in Table 3.
  • Example 8 The same composition as Example 8 was coated on liner I and cured via the abovementioned method for release force measurement, with the evaluation results indicated in Table 3.
  • Example 9 The same composition as Example 9 was coated on liner I and cured via the abovementioned method for release force measurement, with the evaluation results indicated in Table 3.
  • composition was coated on liner II-B and cured via the abovementioned method, both for release force and the viscoelasticity measurements via the abovementioned method, with the evaluation results indicated in Table 3.
  • the formulations listed in Table 3 were coated on a fluoro-silicone release liner film and cured in a 150°C oven for 3 min to make 50 ⁇ 5 ⁇ m thick PSA films.
  • the curing time at 150°C was 5 min and that was 15 min for a 280 ⁇ m thick PSA films.
  • the 100 ⁇ m thick PSA films (IE1 and RE1) were laminated more than 5 times to make >0.5 mm thick PSA films for DMA temperature profile and 3 times to make a 300 ⁇ m thick film for shear-strain measurement.
  • the 280 ⁇ m thick films (IE2-10) were laminated two times or used as it was.
  • Release force was measured for a 50 ⁇ m thick PSA film in between two release liners with the width of 20 mm using a tensile tester. Firstly, the tight/wet side liner was stuck to a plastic sheet, fixed vertically to the tester, and the easy/dry side liner was peeled off at 180° angle at the peel rate of 0.3 m/min to measure the easy side release force. After laminating the PSA on the tight side liner to a PET film and sticking the PET film to the plastic sheet, the tight side release forced was measured in the same way. The force value was converted into gf/inch.
  • the >0.5 mm thick PSA films were subjected to dynamic mechanical analysis (DMA) in parallel pate mode (8 mm in diameter) , with temperature sweep from -70°C to 200°C at the frequency of 1 Hz.
  • DMA dynamic mechanical analysis
  • shear stress-strain curves were obtained at -20 °C with the shear rate of 200%/min.
  • Examples 1-9 provides the wet (tight) side release force below 30 gf/inch, while in Comparative Examples 1-7, the values are over 200 gf/inch or not measure-able due to severe zipping.
  • the dry (easy) side liner was able to be peeled off without damaging the PSA, and the wet side liner was able to be peeled off without surface roughening of the PSA, after peeling off the dry side and laminating onto a PET film. Therefore, Examples 1-9 provide liner/PSA/liner laminates that can be subjected to display assembly process.
  • the PSAs in Examples 2-9 can be differentiated from that in Example 1 by shear stress at 700%strain being lower than 60 kPa, while that for the PSA in Example 1 shows the value of 69 kPa. Being soft in this way or easy to deform, these PSAs have heavier release force as shown by the dry side release force in Comparative Examples 2-7 compared with those in in Examples 2-9 unexpectedly showing reasonably low release force. Therefore, the laminates shown in IE 1-9 have made it possible to industrially and practically use these low modulus OCA’s that the display market is currently demanding.

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Abstract

L'invention propose un stratifié d'adhésif sensible à la pression de silicone (PSA), comprenant : une première pellicule de protection, une couche PSA de silicone durcie formée sur la première pellicule de protection, et une seconde pellicule de protection sur la couche PSA de silicone durcie ; la force de libération latérale humide/étanche entre la première pellicule de protection et la couche PSA de silicone durcie (la première interface) étant inférieure à 100 gf/pouce à une vitesse de pelage de 0,3 m/min pour le PSA présentant un module de conservation dynamique à -20 °C inférieur à 1 MPa et une épaisseur de 50 µm ; ou la force de libération latérale humide/étanche entre la première pellicule de protection et la couche PSA de silicone durcie (la première interface) est inférieure à 100 gf/pouce à une vitesse de pelage de 0,3 m/min pour le PSA présentant un module de conservation dynamique à -20 °C inférieur à 1 MPa, une contrainte de cisaillement à 700 %, une déformation de cisaillement inférieure à 60 kPa et une épaisseur de 50 µm. Le stratifié PSA selon la présente invention peut présenter un faible module à faible déformation, une faible contrainte à grande déformation, un grand fluage, etc.
PCT/CN2023/136902 2023-12-06 2023-12-06 Stratifiés adhésifs sensibles à la pression de silicone Pending WO2025118201A1 (fr)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210284888A1 (en) * 2018-08-10 2021-09-16 Dow Toray Co., Ltd. Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same
WO2022138349A1 (fr) * 2020-12-25 2022-06-30 ダウ・東レ株式会社 Composition de silicone durcissable, agent de revêtement antiadhésif pour adhésif silicone et contenant ladite composition, film antiadhésif et stratifié
WO2022138348A1 (fr) * 2020-12-25 2022-06-30 ダウ・東レ株式会社 Composition de silicone durcissable, agent de revêtement antiadhésif pour agent adhésif à base de silicone formé à partir d'une composition de silicone durcissable, film antiadhésif et stratifié

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210284888A1 (en) * 2018-08-10 2021-09-16 Dow Toray Co., Ltd. Organopolysiloxane composition for forming pressure sensitive adhesive layer, and use of same
WO2022138349A1 (fr) * 2020-12-25 2022-06-30 ダウ・東レ株式会社 Composition de silicone durcissable, agent de revêtement antiadhésif pour adhésif silicone et contenant ladite composition, film antiadhésif et stratifié
WO2022138348A1 (fr) * 2020-12-25 2022-06-30 ダウ・東レ株式会社 Composition de silicone durcissable, agent de revêtement antiadhésif pour agent adhésif à base de silicone formé à partir d'une composition de silicone durcissable, film antiadhésif et stratifié

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