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WO2025117250A1 - Résine à base de poly(vinylformal) et son utilisation pour le revêtement de fils - Google Patents

Résine à base de poly(vinylformal) et son utilisation pour le revêtement de fils Download PDF

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Publication number
WO2025117250A1
WO2025117250A1 PCT/US2024/056513 US2024056513W WO2025117250A1 WO 2025117250 A1 WO2025117250 A1 WO 2025117250A1 US 2024056513 W US2024056513 W US 2024056513W WO 2025117250 A1 WO2025117250 A1 WO 2025117250A1
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WO
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Prior art keywords
aromatic
vinylformal
poly
epoxy compound
composition
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English (en)
Inventor
Thomas Murray
David Vines
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Elantas PDG Inc
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Elantas PDG Inc
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Publication of WO2025117250A1 publication Critical patent/WO2025117250A1/fr
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D129/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Coating compositions based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Coating compositions based on derivatives of such polymers
    • C09D129/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols

Definitions

  • the present invention relates to a poly(vinylformal) composition that can be applied to a conductor or substrate as electrical insulation substantially without solvent.
  • Poly(vinylformal) (Formvar or PVF) magnet wire coatings are one of the oldest product lines used in electrical insulation. Poly(vinylformal) is known for its oil and moisture resistance on copper or aluminium conductors in oil filled transformers. The coating is able to withstand hydrolysis and chemical attack for over 50 years of continuous use. Due to this long history and high performance, it is hard to replace this technology with other coatings that are more cost effective.
  • Poly(vinylformal) coatings suffer from a number of issues on application to magnet wire or other solid substrates.
  • the first is that poly(vinylformal) polymer is mainly soluble in cresylic acid or phenolic solvents. Cresylic/phenol solvents are classified as hazardous to the environment. They are also dangerous to work with causing severe chemical burns and are toxic to the liver.
  • Poly(vinylformal) solutions are normally used in very low solids content otherwise the viscosity is too high to enable the application of the composition to a substrate.
  • Poly(vinylformal) is applied to a substrate typically at 20-30% solids content.
  • Solvents are used at 70-80% to the manage viscosity to an acceptable range. The solvents are then traditionally burned as a source of high-cost fuel which adds to additional environmental emissions. Also due to the low solids content, it is costly to ship the material around the world where 70-80% of the material is flammable and not adding value to the final product.
  • CN 114634740 A relates to the technical field of functional electronic chemicals, in particular to a preparation method of polyvinyl acetal enamelled wire insulating paint and addresses the issues that in its self-reported prior art, acetal paint can generate a large amount of volatile toxic, heavy-pollution and corrosive substances in the production and use processes.
  • the service life of the acetal paint is described to be prolonged.
  • the material comprises the following components: NMP (N-Methyl Pyrrolidone), PMA (Polymethyl Alcohol), ethyl acetate, polyvinyl formal resin and bisphenol A epoxy resin.
  • the polyvinyl formal resin is used as a main film forming substance.
  • Heat resistance and chemical resistance are described to be further improved by adopting the heat-resistant novolac epoxy resin F-44, and meanwhile, by utilizing the effects of electronic and chemical materials of the phenolic resin and the epoxy resin, the heat resistance and the chemical resistance are described to be improved. Lastly the yield and reliability of the insulating paint are described to be improved.
  • US 3,058,951 discloses a composition of matter comprising (1 ) an epoxy resin comprising the reaction product of a polyhydric phenol and an epihalohydrin, (2) a polyvinyl acetal resin, and (3) a polyacrylate resin selected from the group consisting of homopolymers and copolymers of esters selected from the group consisting of methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, isobutyl acrylate, butyl methacrylate, and isobutyl methacrylate.
  • an article of manufacture comprising a metal part having on the surface thereof an intimately adherent, hard, tough electrically insulating coating comprising the reaction product of (1 ) 25-94% by weight of an epoxy resin comprising a reaction product of a polyhydric phenol and an epihalohydrin, (2) 1-25% of a polyvinyl acetal resin, and (3) 5-70% of a poly acrylate resin selected from the group consisting of homopolymers and copolymers of esters selected from the group consisting of methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, isobutyl acrylate, butyl methacrylate, and isobutyl methacrylate.
  • US 3,239,598 concerns an insulated wire comprising a metallic conductor and a dry, tack-free coating over said conductor comprising 100 parts by weight of polyvinyl acetal, 0.1-40 parts by weight of a resinous material selected from the group consisting of urea formaldehyde, melamine, and phenol formaldehyde, and 5-1 ,000 parts by weight of an epoxy resin.
  • compositions that can replace poly(vinylformal) solutions and still provides mechanical and chemical resistance properties that are equivalent to the solvent-based poly(vinylformal) coating.
  • the solvent from the known poly(vinylformal) solution is replaced by a low melting mixture prepolymer that acts as solvent during the preparation of the composition, for example in an extruder, but then, after application of the composition to a substrate, reacts to make a polymer integrated into the final thermoset coating.
  • the present invention therefore relates to a composition
  • a composition comprising: a. a poly(vinylformal) resin; b. an aromatic diol compound; c. an aromatic or aliphatic epoxy compound; d. a catalyst for the reaction between the aromatic diol compound and the aromatic or aliphatic epoxy compound; e. a crosslinker for reacting the poly(vinylformal) resin with the reaction product obtained by reacting the aromatic diol compound with the aromatic or aliphatic epoxy compound.
  • the present invention also relates to a process to prepare the above novel composition.
  • poly(vinylformal) grades available on the market ranging in molecular weight distributions and reactive functional hydroxyl groups. The higher the molecular weight the better the chemical resistance but this also increases the viscosity of the resulting coating. The molecular weight ranges from 15,000-80,000 Daltons as measured by GPC.
  • Poly(vinylformal) with a viscosity in the range from 6 to 12 cps would be classified as low viscosity poly(vinylformal)
  • poly(vinylformal) with a viscosity in the range from 12 to 20 cps would be classified as medium viscosity poly(vinylformal)
  • None of the grades have a melting point due to decomposition prior to melting.
  • Poly(vinylformal) materials that can be used in the composition according to the present invention include various grades of poly(vinylformal) produced by DorfKetal Chemicals, Suketu Organics or JNC Corporation.
  • Poly(vinylformal) of medium and low viscosity are used in one embodiment of the composition of the present invention.
  • Loading of poly(vinylformal) as high as 50 wt.% can be achieved in the aromatic or aliphatic epoxy/aromatic diol mixture and as low as 5 wt.%. Most preferred is 10-25 wt.% poly(vinylformal) to aromatic or aliphatic epoxy/aromatic diol mixture.
  • Suitable aromatic diol compounds include 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), bis(4-hydroxyphenyl) sulphone (bisphenol S), bis(4- hydroxydiphenyl)methane (bisphenol F), hydroquinone, resorcinol, or catechol and their derivatives (e.g. toluhydroquinone, t-butylcatechol).
  • Suitable aromatic or aliphatic epoxy compounds include the diglycidyl-ethers of the above aromatic diol compounds, aliphatic diglycidyl ethers derived from aliphatic diols like for example butanediol, hexanediol, or neopentylglycol, or cycloaliphatic epoxy resins, such as the commercially available Uvicure S105.
  • the epoxy compound is an aromatic epoxy compound. It was found that the best results are obtained when the aromatic diol compound is reacted with an equivalent amount of the aromatic or aliphatic epoxy compound leading to chain extension. To obtain certain desired properties it may be beneficial to either use a slight molar excess of the aromatic diol compound or a slight molar excess of the aromatic or aliphatic epoxy compound.
  • a catalyst is used to promote the reaction of the aromatic diol compound with the aromatic or aliphatic epoxy compound.
  • Amines such as dicyandiamide or hydrazides are very useful in reaction catalysis. Tetramethyl ammonium hydroxide or chloride also work at low temperature.
  • an aryl phosphonium salt catalyst can be used.
  • Other Lewis acid catalysts work as well.
  • the catalyst is such that the reaction between the aromatic diol compound and the aromatic or aliphatic epoxy compound starts at a temperature of at least 50 °C.
  • crosslinkers are known that can be used for reacting the poly(vinylformal) resin with the reaction product obtained by reacting the aromatic diol compound with the aromatic or aliphatic epoxy compound.
  • Suitable crosslinkers include phenolic resins, blocked isocyanates, melamine formaldehyde resins and Lewis acid catalysts.
  • the crosslinker enables the preparation of the composition according to the present invention at elevated temperatures.
  • the crosslinker is such that the reaction between the poly(vinylformal) resin and the reaction product obtained by reacting the aromatic diol compound with the aromatic or aliphatic epoxy compound starts at a temperature of at least 150 °C.
  • Alkoxylated amine, typically melamine or urea, formaldehyde resins also are excellent crosslinkers of hydroxyl functional polymers such as poly(vinylformal).
  • Melamine formaldehyde (MF) or urea formaldehyde (UF) resins can be either methylated, butylated or contain various amounts of imino groups. Methylated melamine formaldehyde resins are most preferred due to low cost and high reactivity.
  • Crosslinkers can be added at 2 to 25% on the total mixture. Also, mixtures of different type of crosslinkers can be used, for example a mixture of methylated melamine formaldehyde in combination with blocked isocyanates.
  • flow agents can be added to the formulation to improve the surface of the coating and to reduce pinhole formation.
  • An example of a flow agent is Modaflow product line supplied by Allnex. Loading levels, if present, are typically between 0.1- 2% based upon the total weight of the composition. The amount of flow agent depends on the flow characteristics needed.
  • the invention relates to a composition
  • a composition comprising: from 5 to 50 wt.% of a poly(vinylformal) resin; from 2 to 15 wt.% of an aromatic diol compound; from 40 to 85 wt.% of an aromatic or aliphatic epoxy compound. from 0.1 to 4 wt. % of catalyst from 3 to 30 wt.% of a crosslinking agent wherein the wt.% are based upon the total content of the composition.
  • the composition of the present invention can be applied to wire or a solid substrate via electrostatic powder coating. After application of the composition to a substrate, in a first step heat is applied to melt the mixture allowing for uniform flow, in a second step the heat is increased to initiate the reaction between the aromatic diol and aromatic or aliphatic epoxy compound, and thereafter the heat is further increased to start the crosslinking reaction of the poly(vinylformal) resin.
  • the composition of the present invention can be prepared in an extruder or similar mixing device.
  • the ingredients are thoroughly mixed at a temperature where the aromatic diol and/or the aromatic or aliphatic epoxy are flowable, but do not react with each other. Normally, this is done at a temperature below 50°C.
  • the obtained composition can be collected at the end of the extruder and then being pulverized to obtain a powder that can be applied to a substrate via electrostatic spraying.
  • the flowable material is directly applied to a wire or any other substrate.
  • the composition is collected at the exit of the extruder and directly mixed with an appropriate solvent to form a solution. This solution can then be applied to a wire or any other suitable substrate.
  • the extruder that can be used in such process can have a single screw design, a twin screw design or a planetary design.
  • the present invention also relates to a process for the preparation of a poly(vinylformal) composition that can be used for coating wires.
  • a crosslinker for reacting the poly(vinylformal) resin with the reaction product obtained by reacting the aromatic diol compound with the aromatic or aliphatic epoxy compound is added and the obtained mixture is collected.
  • This mixture can be applied to a wire directly, or this mixture can be combined with a suitable solvent, and then the solution can be applied to a wire.
  • an aromatic diol compound and an aromatic or aliphatic epoxy compound are mixed in an extruder at a temperature where at least one of the components is flowable, but where no reaction occurs between the aromatic diol compound and the aromatic or aliphatic epoxy compound.
  • a catalyst for the reaction between the aromatic diol compound and the aromatic or aliphatic epoxy compound is added, and the temperature is raised to a temperature where the reaction between the diol compound and the epoxy compound starts and propagates.
  • a poly(vinylformal) resin and a crosslinker for reacting the poly(vinylformal) resin with the reaction product obtained by reacting the aromatic diol compound with the aromatic or aliphatic epoxy compound is added and the obtained mixture is collected.
  • This mixture can be applied to a wire directly, or this mixture can be combined with a suitable solvent, and then the solution can be applied to a wire.
  • an aromatic diol compound and an aromatic or aliphatic epoxy compound are mixed in an extruder at a temperature where at least one of the components is flowable, but where no reaction occurs between the aromatic diol compound and the aromatic or aliphatic epoxy compound.
  • a catalyst for the reaction between the aromatic diol compound and the aromatic or aliphatic epoxy compound and is added and a poly(vinylformal) resin is added and a poly(vinylformal) resin, and the temperature is raised to a temperature where the reaction between the diol compound and the epoxy compound starts and propagates.
  • a crosslinker for reacting the poly(vinylformal) resin with the reaction product obtained by reacting the aromatic diol compound with the aromatic or aliphatic epoxy compound is added and the obtained mixture is collected.
  • This mixture can be applied to a wire directly, or this mixture can be combined with a suitable solvent, and then the solution can be applied to a wire.
  • Flexibility or Mandrel Test was performed according to the procedure IEC EN 60851-3. Therein it is described the Mandrel winding test. Coated wires were taken as such and pre-stretched at 5%, 10%, 15%, 20%, 25%, 30%. For each measurement point three probes were prepared. Each wire was wound around a polished mandrel, a piece of steel having the same diameter as the wire. Once the wire was on the mandrel, the presence of cracks was checked. The absence of cracks gives the flexibility of the coated wire.
  • Tan delta was measured using Dansk tangent delta instrument.
  • FT-IR spectra were measured using Thermoscientific Nicolet FT-IR using ATR attachment.
  • Viscosity was measured using a 5 wt.% solution in ethylene dichloride at 20°C.
  • the extruder contained 4 heating zones, a die adapter heating zone and a die heating zone. If not otherwise specified, the first heating zone is the feeding zone, and the remaining zones are reaction zones.
  • the screw design contained forward and reverse conveying elements, forward and reverse kneading blocks, and teeth elements. The various materials were fed through either a twin concave screw volumetric feeder or a single auger screw volumetric feeder.
  • EPON 1001 F was an epoxy resin derived from a liquid epoxy resin (2.2-bis(p- glycidyloxyphenyl) propane condensation product with 2.2-bis(p- hydroxyphenyl)propane and similar isomers) and bisphenol A. Its datasheet specifies a viscosity at 25°C (40 weight-% solution in methyl ethyl ketone, ASTM D445) of 7 to 9.6 cP, a weight per epoxide (ASTM D1652) of 525 to 550 g/eq and a melting point (ASTM D3461 ) of 75 to 80 °C.
  • the blocked isocyanate resin was a commercially available phenol blocked TDI resin.
  • the methylated melamine was a commercially available methylated melamine formaldehyde resin.
  • the defoamer was a commercially available acrylic flow modifier.
  • Part 1 The ingredients of Part 1 were dry blended and fed through the extruder at 175°C at 25 rpm to form a homogeneous clear solid. This material was then powdered and mixed with Part 2. This mixture of part 1 and part 2 was then fed through an extruder at 100°C at 200 rpm to achieve uniform mixing without any pre-reaction between the Bisphenol A and the epoxy material. This material was then milled to achieve a 20-40 micron particle size.
  • Part 1 The ingredients of Part 1 were dry blended and fed through the extruder at 175°C at 25 rpm to form a homogeneous clear solid. This material was then powdered and mixed with Part 2. This mixture of part 1 and part 2 was then fed through an extruder at 100°C at 200 rpm to achieve uniform mixing without any pre-reaction between the Bisphenol A and the epoxy material. This material was then milled to achieve a 20-40 micron particle size.
  • Part 1 was dry blended and fed through extruder at 175°C at 25 rpm to form a homogeneous clear solid. This material was then milled to achieve a 20- 40 micron particle size. Part 1
  • Part 1 was dry blended and fed through extruder at 175C at 25 rpm to form a homogeneous clear solid. This material was then milled to achieve a 20-40 micron particle size.
  • the material obtained in Powder Example 1 was electrostatically applied to 1 mm pre-annealed copper wire.
  • the wire was cured in an oven at 200°C for 20 minutes to achieve final cure.
  • the wire coating was smooth and uniform with no pinholes or observed defects.
  • Sample was measured for flexibility by performing a 20% stretch followed by 1x mandrel wrap. Visual observation showed no delamination or cracking.
  • the wire was also flattened 5:1 in a post roll test. Flat wire was then wrapped around 1 mm mandrel and observed visually for cracks or loss of adhesion. No cracks were observed.
  • NEMA MW1000 3.53 alcohol toluene boil test was also performed without any issue. No swelling or blistering was observed.
  • the material obtained in Powder Example 2 was electrostatically applied to 1 mm pre-annealed copper wire.
  • the wire was cured in an oven at 200°C for 20 minutes to achieve final cure.
  • the wire coating was smooth and uniform with no pinholes or observed defects.
  • Sample was measured for flexibility by performing a 20% stretch followed by 1x mandrel wrap. Visual observation showed no delamination or cracking.
  • the wire was also flattened 5:1 in a post roll test. Flat wire was then wrapped around 1 mm mandrel and observed visually for cracks or loss of adhesion. No cracks were observed.
  • NEMA MW1000 3.53 alcohol toluene boil test was also performed without any issue. No swelling or blistering was observed.
  • Comparative Powder Example 1 The material obtained in Comparative Powder Example 1 was electrostatically applied to 1 mm pre-annealed copper wire.
  • the wire was cured in an oven at 200°C for 20 minutes to achieve final cure.
  • the wire coating was smooth and uniform with no pinholes or observed defects.
  • the Sample showed poor flexibility by performing a 20% stretch followed by 1x mandrel wrap. Visual observation showed cracking.
  • the wire was also flattened 5:1 in a post roll test. Flat wire was then wrapped around 1 mm mandrel and observed visually for cracks or loss of adhesion. Cracks were observed.
  • Comparative Powder Example 2 The material obtained in Comparative Powder Example 2 was electrostatically applied to 1 mm pre-annealed copper wire. The wire was cured in an oven at 200°C for 20 minutes to achieve final cure. The wire coating was rough and had pinholes and did not form a good film.
  • the material obtained in Powder Example 1 was extruded onto 1 mm pre-annealed copper wire at 110°C. Coating thickness of 30 microns was achieved.
  • the wire was cured in an oven at 200°C for 20 minutes to achieve final cure.
  • the wire coating was smooth and uniform with no pinholes or observed defects.
  • Sample was measured for flexibility by performing a 20% stretch followed by 1x mandrel wrap. Visual observation showed no delamination or cracking.
  • the wire was also flattened 5:1 in a post roll test. Flat wire was then wrapped around 1 mm mandrel and observed visually for cracks or loss of adhesion. No cracks were observed.
  • NEMA MW1000 3.53 alcohol toluene boil test was also performed without any issue. No swelling or blistering was observed.
  • the material obtained in Powder Example 2 was extruded onto 1 mm pre-annealed copper wire at 110°C. Coating thickness of 30 microns was achieved.
  • the wire was cured in an oven at 200°C for 20 minutes to achieve final cure.
  • the wire coating was smooth and uniform with no pinholes or observed defects.
  • Sample was measured for flexibility by performing a 20% stretch followed by 1x mandrel wrap. Visual observation showed no delamination or cracking.
  • the wire was also flattened 5:1 in a post roll test. Flat wire was then wrapped around 1 mm mandrel and observed visually for cracks or loss of adhesion. No cracks were observed.
  • NEMA MW1000 3.53 alcohol toluene boil test was also performed without any issue. No swelling or blistering was observed. Tangent delta was measured using Dansk tester and a tangent delta of 108 was observed signaling sufficient cure.
  • Comparative Powder Example 1 The material obtained in Comparative Powder Example 1 was extruded onto 1 mm pre-annealed copper wire at 110°C. Coating thickness of 30 microns was achieved. The wire was cured in an oven at 200°C for 20 minutes to achieve final cure. The wire coating was poor. No further testing was performed.
  • Comparative Powder Example 2 The material obtained in Comparative Powder Example 2 was extruded onto 1 mm pre-annealed copper wire at 110°C. Coating thickness of 30 microns was achieved. The wire was cured in an oven at 200°C for 20 minutes to achieve final cure. The wire coating was rough and had pinholes and did not form a good film. No further testing was performed.
  • Examples A01 and A02 demonstrate properties very similar to the control poly(vinylformal) coating used in wire enamel coatings.
  • Examples 3 and 4 include only an aromatic or aliphatic epoxy compound, no aromatic diol compound, at 50% mass while Examples 5 and 6 are at 75% epoxy and 25% poly(vinylformal). None of the samples show adequate physical properties compared to the control sample. All of the samples are either catalyzed by tetramethyl ammonium hydroxide or dicyandiamide. Table 1. Compositions and tensile testing results:
  • Table 2 are the ingredients of some fully formulated compositions. Two levels of polyvinyl formal were examined. The polyvinyl formal was also of low and medium molecular weight.
  • the aromatic diol compound, the aromatic or aliphatic epoxy compound and the PVF-compound were dry blended and fed through the extruder at 175°C at 25 rpm to form a homogeneous clear solid. This material was then powdered and mixed with the other ingredients. This mixture was then fed through an extruder at 100°C at 200 rpm to achieve uniform mixing without any pre-reaction between the Bisphenol A and the epoxy material.
  • the material was applied on a PET film at a thickness of 10 mil, heated at 125°C for 15 minutes and thereafter the temperature was increased to 200°C, and kept at that temperature for 60 minutes All formulations gave good physical properties for modulus, tensile strength and elongation. Testing after immersion in transformer oil also showed little change after 7 days at 50°C. Dielectric properties were also examined before and after oil immersion. Again, all samples compared favorably to the control C8359 Poly(vinylformal) used on a magnet wire.
  • Table 2B Results tensile testing after oil bath (7 days at 50°C)
  • Table 2C Results of dielectric properties before and after oil bath (7 days at 50°C)
  • the dielectric properties were measured as the dielectric breakdown (V/mil) in a standard dielectric breakdown test.
  • V/mil dielectric breakdown

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)

Abstract

La présente invention concerne une composition comprenant : une résine poly(vinylformal) ; un composé diol aromatique ; un composé époxy aromatique ou aliphatique ; un catalyseur pour la réaction entre le composé diol aromatique et le composé époxy aromatique ou aliphatique ; un agent de réticulation pour faire réagir la résine poly(vinylformal) avec le produit de réaction obtenu par réaction du composé diol aromatique avec le composé époxy aromatique ou aliphatique. Cette composition peut être utilisée comme émail pour fil.
PCT/US2024/056513 2023-11-27 2024-11-19 Résine à base de poly(vinylformal) et son utilisation pour le revêtement de fils Pending WO2025117250A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US202363602708P 2023-11-27 2023-11-27
US63/602,708 2023-11-27
EP23217398 2023-12-18
EPEP23217398 2023-12-18

Publications (1)

Publication Number Publication Date
WO2025117250A1 true WO2025117250A1 (fr) 2025-06-05

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB919549A (en) * 1960-01-12 1963-02-27 Rubber And Asbestos Corp Improvements in structural adhesives
CN1908096A (zh) * 2006-08-02 2007-02-07 江苏兰陵化工集团有限公司 电磁线和漆包线用静电喷涂粉末涂料及其制备工艺
WO2017104771A1 (fr) * 2015-12-16 2017-06-22 Jnc株式会社 Feuille composite et dispositif électronique
US20180163101A1 (en) * 2015-08-31 2018-06-14 Henkel Ag & Co. Kgaa Curable composition, especially for rubber to substrate bonding

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB919549A (en) * 1960-01-12 1963-02-27 Rubber And Asbestos Corp Improvements in structural adhesives
CN1908096A (zh) * 2006-08-02 2007-02-07 江苏兰陵化工集团有限公司 电磁线和漆包线用静电喷涂粉末涂料及其制备工艺
US20180163101A1 (en) * 2015-08-31 2018-06-14 Henkel Ag & Co. Kgaa Curable composition, especially for rubber to substrate bonding
WO2017104771A1 (fr) * 2015-12-16 2017-06-22 Jnc株式会社 Feuille composite et dispositif électronique

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