WO2025115233A1 - Method for separating and recovering rare earth component and metal component from post-calcination waste of multilayer ceramic capacitor - Google Patents
Method for separating and recovering rare earth component and metal component from post-calcination waste of multilayer ceramic capacitor Download PDFInfo
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- WO2025115233A1 WO2025115233A1 PCT/JP2024/000874 JP2024000874W WO2025115233A1 WO 2025115233 A1 WO2025115233 A1 WO 2025115233A1 JP 2024000874 W JP2024000874 W JP 2024000874W WO 2025115233 A1 WO2025115233 A1 WO 2025115233A1
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B1/00—Preliminary treatment of ores or scrap
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B1/00—Preliminary treatment of ores or scrap
- C22B1/02—Roasting processes
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B23/00—Obtaining nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/04—Extraction of metal compounds from ores or concentrates by wet processes by leaching
- C22B3/06—Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic acid solutions, e.g. with acids generated in situ; in inorganic salt solutions other than ammonium salt solutions
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/04—Extraction of metal compounds from ores or concentrates by wet processes by leaching
- C22B3/12—Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic alkaline solutions
- C22B3/14—Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic alkaline solutions containing ammonia or ammonium salts
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B59/00—Obtaining rare earth metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
Definitions
- This invention relates to a method for separating and recovering rare earth and metal components from post-sintering waste from multilayer ceramic capacitors.
- a multilayer ceramic capacitor includes a laminate having an internal electrode layer and a ceramic layer, and an external electrode.
- the internal electrode layer contains a metal component such as Ni, and the ceramic layer is formed of BaTiO 3 , etc.
- Patent documents 1 to 4 disclose a method for recovering Ni, which is mainly used in the internal electrode layer, and also disclose that BaTiO 3 contained in the ceramic layer is separated in the process of recovering Ni.
- Patent documents 1 to 4 disclose the recovery of Ni, but do not disclose the recovery of rare earth components. However, it is desirable to be able to recover not only metal components such as Ni, but also rare earth components.
- the main object of this invention is to provide a method for separating and recovering rare earth and metal components from post-sintering waste of multilayer ceramic capacitors.
- the method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors comprises the steps of: (A) preparing sintered waste of a multilayer ceramic capacitor, the multilayer ceramic capacitor comprising a laminate including a ceramic layer and an internal electrode layer, and a fired electrode layer disposed on the laminate as an outermost layer and connected to the internal electrode layer, the ceramic layer having an aggregate of a plurality of ceramic particles, a rare earth-containing material including a rare earth component is contained in grain boundaries between the plurality of ceramic particles, the internal electrode layer includes a first metal component which is a magnetic base metal, the fired electrode layer includes a second metal component which is a non-magnetic precious metal, and the ceramic layer, the internal electrode layer, and the fired electrode layer are sintered; (B) A step of obtaining a ceramic fine-particle having a fine ceramic layer, a rare earth-containing material, a first metal fine-particle having a fine internal electrode layer, and a second metal fine-particle having a
- rare earth components and metal components can be separated and recovered from the post-sintering waste.
- metal components a first metal component contained in the internal electrode layer and a second metal component contained in the external electrode can be separated and recovered.
- the method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors comprises the steps of: (A) a step of preparing fired waste of a multilayer ceramic capacitor, the fired waste comprising a laminate including a ceramic layer and an internal electrode layer, a fired electrode layer disposed on the laminate and connected to the internal electrode layer, and a first-stage plating layer disposed on the fired electrode layer as an outermost layer, the ceramic layer having an aggregate of a plurality of ceramic particles, rare earth-containing matter containing a rare earth component is contained in grain boundaries between the plurality of ceramic particles, the internal electrode layer contains a first metal component which is a magnetic base metal, the fired electrode layer contains a second metal component which is a non-magnetic precious metal, the first-stage plating layer contains the first metal component, and the ceramic layer, the internal electrode layer, and the fired electrode layer are sintered; (B) A step of pulverizing the fired waste to obtain a ceramic micro-fine product having a fine ceramic layer,
- rare earth components and metal components can be separated and recovered from the post-sintering waste.
- metal components a first metal component contained in the internal electrode layer and a second metal component contained in the external electrode can be separated and recovered.
- the method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors comprises the steps of: (A) a step of preparing sintered waste of a multilayer ceramic capacitor, the multilayer ceramic capacitor comprising: a laminate including a ceramic layer and an internal electrode layer; a fired electrode layer disposed on the laminate and connected to the internal electrode layer; a first-stage plating layer disposed on the fired electrode layer; and a second-stage plating layer disposed on the first-stage plating layer as an outermost layer, the ceramic layer having an aggregate of a plurality of ceramic particles, a rare earth-containing material containing a rare earth component is contained in grain boundaries between the plurality of ceramic particles; the internal electrode layer includes a first metal component which is a base metal having magnetism; the fired electrode layer includes a second metal component which is a precious metal having no magnetism; the first-stage plating layer includes the first metal component; the second-stage plating layer includes a third metal component; and the ceramic layer, the
- rare earth components and metal components can be separated and recovered from the post-sintering waste.
- metal components a first metal component contained in the internal electrode layer and a second metal component contained in the external electrode can be separated and recovered.
- This invention provides a method for separating and recovering rare earth and metal components from post-sintering waste from multilayer ceramic capacitors.
- FIG. 1 is a flow diagram showing a method for separating and recovering rare earth components and metal components from waste after firing of a multilayer ceramic capacitor (firing for firing electrode layers), according to a first embodiment of the present invention.
- 1 is an external perspective view showing an example of a multilayer ceramic capacitor according to a first embodiment of the present invention
- 3 is a cross-sectional view taken along line III-III in FIG. 2.
- 2 is a schematic diagram showing the state of unsintered ceramic layers and unsintered internal electrode layers in a cross section parallel to a plane including the longitudinal direction and stacking direction in a laminated chip.
- FIG. FIG. 4 is an enlarged view of a portion ⁇ in FIG. 3, and is a schematic diagram showing the state of each layer after firing for a fired electrode layer.
- FIG. 6 is a partial enlarged view of the ceramic layer of FIG. 5 .
- 1 is a cross-sectional view (1) of a multilayer ceramic capacitor according to a second embodiment of the present invention, taken along a plane including the length direction and lamination direction.
- FIG. 11 is a cross-sectional view (2) of another aspect of the multilayer ceramic capacitor according to the second embodiment of the present invention, taken along a plane including the length direction and lamination direction.
- FIG. 1 is a flow diagram showing a method for separating and recovering rare earth components and metal components from waste after firing of a multilayer ceramic capacitor (firing for firing electrode layers), the method including a plating removal step.
- First Embodiment 1 Separation and Recovery Method A method for separating and recovering rare earth components and metal components (first metal components and second metal components) from post-sintering waste of multilayer ceramic capacitors (sintering for fired electrode layers) according to a first embodiment of the present invention will be described.
- FIG. 1 is a flow diagram showing a method for separating and recovering rare earth components and metal components from post-sintering waste (sintering for fired electrode layers) of multilayer ceramic capacitors according to a first embodiment of the present invention.
- post-sintering waste sining for fired electrode layers
- FIG. 1 is a flow diagram showing a method for separating and recovering rare earth components and metal components from post-sintering waste (sintering for fired electrode layers) of multilayer ceramic capacitors according to a first embodiment of the present invention.
- post-sintering waste sining for fired electrode layers
- the post-sintering waste will now be described.
- FIG. 2 is an external perspective view showing an example of a multilayer ceramic capacitor according to a first embodiment of the present invention.
- Fig. 3 is a cross-sectional view taken along line III-III in Fig. 2.
- a two-terminal multilayer ceramic capacitor will be described as an example of the multilayer ceramic capacitor 10.
- the multilayer ceramic capacitor 10 includes, for example, a rectangular parallelepiped laminate 12 and external electrodes 30 arranged on both ends of the laminate 12.
- the laminate 12 has a plurality of stacked ceramic layers 14 and a plurality of internal electrode layers 16 stacked on the ceramic layers 14. Furthermore, the laminate 12 has a first main surface 12a and a second main surface 12b that face each other in a height direction (stacking direction) x, a first side surface 12c and a second side surface 12d that face each other in a width direction y perpendicular to the height direction x, and a first end surface 12e and a second end surface 12f that face each other in a length direction z perpendicular to the height direction x and the width direction y.
- the ceramic layers 14 and the internal electrode layers 16 are stacked in the height direction x.
- the first internal electrode layer 16a and the second internal electrode layer 16b can be made of, for example, a conductive material containing a magnetic base metal, and the magnetic base metal can be a simple metal or an alloy.
- magnetic base metals include Ni and Fe. Note that, here, a metal that has a higher ionization tendency than hydrogen is referred to as a base metal.
- the ceramic layer 14 has an aggregate of a plurality of ceramic particles (each BT in FIG. 5 described later, also called a ceramic sintered body). Each ceramic particle can be formed, for example, by a dielectric material as the ceramic material.
- a dielectric material for example, a dielectric ceramic having a perovskite structure with a perovskite type compound containing a component such as BaTiO 3 , CaTiO 3 , SrTiO 3 , or CaZrO 3 as the main component can be used.
- a rare earth component is added to the dielectric material as an additive according to the desired characteristics of the laminate 12.
- the rare earth component to be added for example, at least one of Dy, Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Ho, Er, Tm, Yb, and Lu can be mentioned.
- the above-mentioned dielectric material may be used with the addition of a minor component, such as a Mn compound, an Fe compound, a Cr compound, a Co compound, or a Ni compound, in a content less than that of the main component.
- a minor component such as a Mn compound, an Fe compound, a Cr compound, a Co compound, or a Ni compound, in a content less than that of the main component.
- At least one of Si, Mg, Ba, and Mn may be added as an additional additive to the above-mentioned main component.
- these minor components and additives may cause a deterioration in the quality of the rare earth components during the separation and recovery of the rare earth components, these minor components and additives may be omitted.
- external electrodes 30 are arranged on the first end face 12e side and the second end face 12f side of the laminate 12.
- the external electrode 30 has a first external electrode 30a and a second external electrode 30b.
- the first external electrode 30a is connected to the first internal electrode layer 16a and is disposed on at least the surface of the first end face 12e.
- the second external electrode 30b is connected to the second internal electrode layer 16b and is disposed on at least the surface of the second end face 12f.
- the external electrode 30 includes a baked electrode layer 32.
- the first external electrode 30a includes a first baked electrode layer 32a.
- the second external electrode 30b includes a second baked electrode layer 32b.
- the baked electrode layer 32 is the outermost layer of the multilayer ceramic capacitor 10. In other words, the baked electrode layer 32 is the outermost layer of the layers disposed on the laminate 12.
- the baked electrode layer 32 may be formed from a baked layer containing a glass component and a second metal component which is a non-magnetic precious metal.
- the second metal component of the baked layer includes at least one selected from Cu, Ag, etc.
- the glass component of the baked layer includes an oxide containing at least one element selected from B, Si, Ba, Mg, Al, Li, etc.
- a metal that has a lower ionization tendency than hydrogen is referred to as a precious metal.
- Step 1 a dielectric sheet for the ceramic layer and a conductive paste for the internal electrode layer are prepared.
- the dielectric sheet for the ceramic layer is formed from a dielectric slurry containing, but not limited to, BaTiO3 as a main component and Dy as an additive.
- the conductive paste for the internal electrode layer is formed from, but not limited to, Ni as a main component.
- the dielectric sheet and the conductive paste for the internal electrode layer include a binder and a solvent.
- the binder and the solvent are composed of a resin component, and the resin component can be, for example, various known thermosetting resins such as epoxy resin, phenoxy resin, phenol resin, urethane resin, and polyimide resin.
- Step 2 a conductive paste for the internal electrode layers is printed in a predetermined pattern on the dielectric sheet, for example by screen printing or gravure printing. This prepares a dielectric sheet on which the pattern of the first internal electrode layer is formed, and a dielectric sheet on which the pattern of the second internal electrode layer is formed.
- outer layer dielectric sheets that do not have the internal electrode layer pattern printed on them are also prepared.
- a predetermined number of dielectric sheets for the outer layers, on which the pattern of the internal electrode layer is not printed, are stacked.
- a dielectric sheet on which the pattern of the first internal electrode layer is printed, and a dielectric sheet on which the pattern of the second internal electrode layer is printed are stacked in order on top of the dielectric sheets to form an inner layer portion.
- a predetermined number of dielectric sheets for the outer layers, on which the pattern of the internal electrode layer is not printed, are stacked on top of the inner layer portion.
- the dielectric sheets are sometimes referred to as the ceramic layers when unfired, that is, the ceramic layers before the laminated chip is fired.
- the pattern of the internal electrode layers is sometimes referred to as the internal electrode layers when unfired, that is, the internal electrode layers before the laminated chip is fired.
- Step 3 the laminated sheet is pressed in the stacking direction using a means such as a hydrostatic press to produce a laminated block.
- FIG. 4 is a schematic diagram showing the state of the unfired ceramic layers and the unfired internal electrode layers in a cross section parallel to a plane including the length direction and the lamination direction in the laminated chip.
- FIG. 4 shows a cross section of the laminated chip on which the external electrodes 30 have not yet been formed.
- the laminated chip in FIG. 4 is in a state prior to degreasing (step 5) and firing of the laminated chip (step 6). However, the resin component contained in the laminated chip is not shown.
- the laminated chip is formed by alternately stacking the unfired internal electrode layers 16_U and the unfired ceramic layers 14_U.
- the laminated chip as a whole contains a first metal powder (Ni_P in FIG. 4), ceramic powders (BT 1 _P, BT 2 _P in FIG. 4), rare earth powder (Dy_P in FIG. 4), and a resin component.
- the first metal powder mainly constitutes the internal electrode layer 16_U when unsintered.
- the ceramic powder mainly constitutes the ceramic layer 14_U when unsintered.
- the first metal powder is, for example, an aggregate of first metal atoms, which is the first metal component.
- the first metal powder can be made of a conductive material containing a magnetic base metal, and the magnetic base metal can be either an elemental metal or an alloy. Examples of magnetic base metals include Ni and Fe.
- the ceramic powder is an aggregate of dielectric materials.
- examples of the dielectric materials include BaTiO 3 , CaTiO 3 , SrTiO 3 , and CaZrO 3 .
- the ceramic powder includes a first ceramic powder and a second ceramic powder. The second ceramic powder has a smaller particle size than the first ceramic powder.
- Rare earth powder is an aggregate of rare earth atoms, which are rare earth components.
- the rare earth atoms can be at least one of Dy, Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Ho, Er, Tm, Yb, and Lu.
- the resin components are binders and solvents for producing conductive pastes for the dielectric sheets and internal electrode layers.
- the binders and solvents are composed of resin components, and various known thermosetting resins such as epoxy resins, phenoxy resins, phenolic resins, urethane resins, and polyimide resins can be used as the resin components.
- FIG. 4 shows the state of various powders contained in the laminated chip before the degreasing in (step 5) and the firing of the laminated chip in (step 6).
- the resin component is omitted.
- the ceramic layer 14_U when unfired is mainly composed of the first ceramic powder (BT 1 _P in FIG. 4).
- the first ceramic powder and the rare earth powder (Dy_P in FIG. 4) are at least partially attached to each other.
- the rare earth powder is mainly attached to the surface of the first ceramic powder, and basically, the rare earth powder does not penetrate into the inside of the first ceramic powder and is not chemically bonded.
- the internal electrode layer 16_U when unfired is mainly composed of the first metal powder (Ni_P in FIG. 4).
- the first metal powder and the second ceramic powder (BT 2 _P in FIG. 4) are at least partially attached to each other.
- the second ceramic powder is mainly attached to the surface of the first metal powder, and the second ceramic powder is not basically chemically bonded to the inside of the first metal powder.
- the meaning of "attached” may include that the powders such as the first metal powder, the ceramic powder, and the rare earth powder are partially chemically bonded to each other.
- the chemical bond is a bond in which a plurality of atoms are attracted to each other by positive and negative charges, such as an ionic bond, a covalent bond, or a metallic bond.
- Step 5 the resin components in the laminated chip are removed.
- the removal of the resin components in step 5 is a degreasing step in the manufacturing process.
- the degreasing temperature in the degreasing step 5 is, for example, higher than 800° C. and equal to or lower than 1000° C.
- Step 6 the laminated chip is fired to produce the laminate 12.
- the firing temperature for the laminated chip depends on the materials of the ceramic layers and internal electrode layers, which are dielectrics, but is preferably higher than 1000°C and lower than 1400°C, for example.
- Steps 1 to 6 are the laminate formation process. Note that the firing in step 6 is sometimes called firing the laminated chip. This firing turns the unfired laminated chip into the laminate 12. Furthermore, the unfired internal electrode layer 16_U and the unfired ceramic layer 14_U are fired to become the internal electrode layer 16 and the ceramic layer 14.
- a baked electrode layer paste containing a plurality of second metal powders (e.g., Cu powder) is applied to the first and second end faces 12e, 12f of the laminate 12 and fired to form a baked electrode layer 32, which is an external electrode 30.
- the second metal powder is, for example, an aggregate of second metal atoms, which is a second metal component.
- Each second metal powder in the baked electrode layer paste is dispersed alone in the baked electrode layer paste, or is dispersed by adhering to other powders including other second metal powders. In other words, in the baked electrode layer paste, each second metal powder is not chemically bonded to other second metal powders or powders such as other additives.
- the baked electrode layer paste is fired, so that the second metal powders are in a sintered state.
- the firing temperature of the baked electrode layer paste is preferably 700°C or higher and 900°C or lower.
- the firing in step 7 may be referred to as firing for the baked electrode layer.
- FIG. 5 is an enlarged view of the ⁇ portion of Figure 3, and is a schematic diagram showing the state of each layer after firing for the fired electrode layers.
- Figure 6 is a partial enlarged view of the ceramic layers in Figure 5. After firing for the fired electrode layers, the multilayer ceramic capacitor 10 is in a sintered state with each part, such as the ceramic layer 14, the internal electrode layer 16, and the external electrode 30.
- the ceramic powder (BT 1 _P, BT 2 _P in FIG. 4 ) is fired to become ceramic particles BT (BT in FIG. 5 ) in a sintered state as shown in FIG. 5 .
- the ceramic powder (BT 1 _P, BT 2 _P in FIG. 4 ) is fired, for example, in the stacked chip (step 6 ), to form the fired ceramic particles BT.
- the ceramic particles BT in a sintered state may be called a ceramic sintered body BT.
- the ceramic powder is fired to develop the contact between the ceramic particles from point contact to surface contact. This causes the chemical bonding between the ceramic powders to progress, forming integrated ceramic particles BT (ceramic sintered body BT).
- each ceramic particle BT is formed by a core shell 40 shown in FIG. 6.
- the core shell 40 has a core portion 42 including a central portion of the core shell 40, and a shell portion 44 covering the surface of the core portion 42.
- the core portion 42 is mainly formed of a ceramic material.
- the shell portion 44 is formed by incorporating, for example, a rare earth component, which is an additive, into the ceramic material.
- the shell portion 44 may also incorporate other subcomponents such as Mn compounds.
- a grain boundary 50 exists at the boundary between the ceramic particles BT.
- the grain boundary 50 contains a rare earth inclusion.
- the rare earth inclusion contains the rare earth component in the form of, for example, an oxide.
- An example of the oxide of the rare earth component is dysprosium oxide (Dy 2 O 3 ).
- the rare earth inclusion may also contain, for example, silicon dioxide (SiO 2 ), manganese dioxide (MnO 2 ), etc.
- SiO 2 silicon dioxide
- MnO 2 manganese dioxide
- each ceramic particle BT has a core-shell structure.
- each ceramic particle BT may have a structure in which the rare earth component or the like is incorporated up to the center of the ceramic particle BT.
- ceramic particles BT having such a structure and ceramic particles BT having a core-shell structure may be mixed in the ceramic layer 14.
- the internal electrode layer 16 is formed by firing the first metal powder (Ni_P in FIG. 4) to form the first metal particles (Ni in FIG. 5) in a sintered state as shown in FIG. 5.
- the first metal powder (Ni_P in FIG. 4) forms the fired internal electrode layer 16, for example, by firing the stacked chip in (step 6).
- the Ni powder which is the first metal powder, is sintered to form Ni particles (first metal particles).
- the first metal particles in a sintered state may also be called a first metal sintered body.
- the first metal powder is heated by firing, and the contact between the first metal powder particles develops from point contact to surface contact. As a result, the bonding between the first metal powder particles progresses to form integrated first metal particles (first metal sintered body).
- the internal electrode layer 16 includes an aggregate of multiple first metal particles.
- the baked electrode layer 32 is formed by firing the second metal powder (e.g., Cu powder) for the baked electrode layer, and is turned into second metal particles (Cu in FIG. 5) in a sintered state as shown in FIG. 5.
- the Cu powder which is the second metal powder
- the second metal particles in a sintered state may be called a second metal sintered body.
- the second metal powder is heated by firing for the baked electrode layer, and the contact between the second metal powder develops from point contact to surface contact. As a result, the bonding between the second metal powder progresses to form integrated second metal particles (second metal sintered body).
- the baked electrode layer 32 includes an aggregate of multiple second metal particles.
- the multilayer ceramic capacitor 10 is manufactured through the above-mentioned manufacturing process.
- the post-firing waste is waste after the firing for the fired electrode layer in (step 7) when the multilayer ceramic capacitor 10 is manufactured by the manufacturing method for the multilayer ceramic capacitor 10 described above.
- the separation and recovery method in Fig. 1 includes a common separation and recovery route, a rare earth component separation and recovery route, a first metal component separation and recovery route, and a second metal component separation and recovery route.
- the rare earth component separation and recovery route and the first metal component separation and recovery route branch off from the common separation and recovery route.
- the second metal component separation and recovery route branches off from the rare earth component separation and recovery route.
- the common separation and recovery route includes, for example, preparation of post-calcination waste in step (A), pulverization in step (B), and magnetic separation in step (C).
- the process branches into a rare earth component separation and recovery route and a first metal component separation and recovery route.
- the rare earth component separation and recovery route can include, for example, dissolution of the second separated material in step (D), and can further include filtration in step (F), and neutralization in step (G).
- the second metal component separation and recovery route branches off from the rare earth component separation and recovery route.
- the second metal component separation and recovery route can include, for example, dissolution of the undissolved material in step (E), and can further include filtration in step (H).
- the first metal component separation and recovery route can include, for example, dissolution of the first separated material in step (I), and can further include filtration in step (J).
- post-sintering waste of a multilayer ceramic capacitor sintered electrode layers
- the post-sintering waste is as described above.
- the post-sintering waste includes a laminate 12 including ceramic layers 14 and internal electrode layers 16, and a sintered electrode layer 32.
- the ceramic layers 14, the internal electrode layers 16, and the sintered electrode layer 32 are in a sintered state.
- step (B) the fired waste is pulverized.
- the fired waste is pulverized by crushing.
- the pulverization is performed, but not limited to, for example, by a method of applying a pulverizing force by vibration to the object using a vibration mill or the like, a method of grinding the object, a method of applying a pulverizing force by impact to the object, and the like. It is preferable to pulverize the fired waste to an extent that it is easy to separate in the magnetic separation in step (C) described later.
- the ceramic pulverized product includes, for example, a ceramic material such as BaTiO 3 , CaTiO 3 , SrTiO 3 , or CaZrO 3 .
- the rare earth-containing material may include, for example, dysprosium oxide ( Dy2O3 ), and may also include, for example, silicon dioxide ( SiO2 ), manganese dioxide ( MnO2 ), etc.
- the first finely divided metal material may include, for example, a first metal component such as Ni and Fe.
- the second finely divided metal material may include, for example, a second metal component such as Cu.
- the average particle size of the post-calcination waste after being finely divided is not limited. The average particle size may be determined, for example, by using a sieve.
- the post-calcination waste after being pulverized in step (B) is magnetically separated using a magnet. That is, the post-calcination waste is separated into a first separated matter and a second separated matter by magnetic separation and recovered.
- the first separated material contains a first metal microparticle (Ni in FIG. 1) and a ceramic microparticle (BT in FIG. 1).
- the first metal microparticle contains a first metal component, which is a magnetic base metal.
- the ceramic microparticle does not have magnetic properties.
- the first separated material is separated as a magnetic material by magnetic separation. Specifically, in the first separated material, when the magnetic first metal microparticle is separated as a magnetic material, the non-magnetic ceramic microparticle is entangled with this first metal microparticle.
- the second separated material includes a second metal fine particle (Cu in FIG. 1), a rare earth-containing material ( Dy2O3 in FIG. 1), and a ceramic fine particle (BT in FIG. 1).
- the second metal fine particle includes a second metal component that is a noble metal having no magnetism. Furthermore, the rare earth-containing material and the ceramic fine particle have no magnetism. Therefore, the second metal fine particle, the rare earth-containing material, and the ceramic fine particle are separated as non-magnetic materials by magnetic separation.
- the second separated material is removed from the post-sintering waste, and the first separated material containing the first metal fine particles can be separated and recovered as the first metal component.
- the first metal fine particles are fine particles of sintered Ni (first metal component) that constitutes the internal electrode layer 16.
- the separation and recovery of the first metal component includes not only the separation and recovery of the first metal component itself, but also the separation and recovery of the first separated material containing the first metal fine particles as the first metal component.
- the first metal component includes the first metal atom itself, a first metal component compound which is a reaction product of the first metal atom chemically reacting with other atoms, a solution of the first metal atom, a solution of the first metal component compound, and the like.
- the state of the first metal component may be any of a liquid state, a solid state, and a mixed state of liquid and solid.
- the first metal component may be any of an amorphous state, a crystalline state, and a mixed state of amorphous and crystalline.
- this magnetic separation makes it possible to separate and recover the second metal fine particles and rare earth-containing material from the post-sintering waste after removing the first separated material.
- step (B) it is preferable to mix and disperse the post-calcination waste after it has been pulverized in step (B) with an aqueous solvent such as water to create a mixed state, and then separate it using a magnet.
- an aqueous solvent such as water
- step (C) When the finely divided calcined waste is mixed with an aqueous solvent to form a mixed state, i.e., a slurry state, the ceramic fine particles, rare earth-containing material, first metal fine particles, and second metal fine particles contained in the finely divided calcined waste can be dispersed. Therefore, in step (C), the first separated material and the second separated material can be easily separated using a magnet.
- the first separated material and the second separated material tend to be less dispersed than when in a slurry state. Therefore, for example, when the first separated material is attracted to a magnet, the second separated material is caught in the first separated material and attracted to the magnet, making it difficult to separate the first separated material and the second separated material.
- the second separated product separated and recovered in step (C) is dissolved in a mineral acid having no oxidizing power.
- a rare earth component-containing solution to be generated in which the rare earth components in the rare earth-containing material contained in the second separated product are dissolved.
- the rare earth component-containing solution can be separated and recovered as a rare earth component.
- the ceramic fine particles and the second metal fine particles in the second separated product are precipitated. The ceramic fine particles react with the mineral acid having no oxidizing power to become undissolved and precipitate.
- the second metal fine particles such as Cu have a smaller ionization tendency than the hydrogen ions contained in the mineral acid having no oxidizing power, and therefore do not dissolve in the mineral acid having no oxidizing power.
- the mineral acid having no oxidizing power is, for example, at least one selected from the group including dilute sulfuric acid and hydrochloric acid.
- the rare earth components are separated and recovered as a rare earth component-containing solution.
- the separation and recovery of rare earth components includes not only the separation and recovery of the rare earth components themselves, but also the separation and recovery of the rare earth component-containing solution as rare earth components.
- the rare earth components include rare earth atoms themselves, rare earth component compounds which are reaction products in which rare earth atoms have chemically reacted with other atoms, solutions of rare earth atoms, solutions of rare earth component compounds, etc.
- the state of the rare earth components may be any of a liquid state, a solid state, or a mixed state of liquid and solid.
- the rare earth components may be any of an amorphous state, a crystalline state, or a mixed state of amorphous and crystalline.
- step (D) it is preferable to adjust the pH of the rare earth component-containing solution to 1.5 or more and 2.5 or less by adding a mineral acid that has no oxidizing power.
- step (D) by adjusting the rare earth component-containing solution to a pH of 1.5 or more and 2.5 or less using a mineral acid with no oxidizing power, it is possible to dissolve mainly the rare earth components in the rare earth-containing material in the mineral acid with no oxidizing power. Furthermore, if the pH is adjusted to a stronger acid than the above range, ceramic fine particles and the like may dissolve in the mineral acid with no oxidizing power, so it is preferable to adjust the pH to within the above range. More preferably, the rare earth component-containing solution is adjusted to a pH of 2 by adding a mineral acid with no oxidizing power.
- the separated second separated material is in a slurry state with a pH of about 7.
- a mineral acid with no oxidizing power to this slurry, it is also possible to produce a rare earth component-containing solution adjusted to a pH of 1.5 or more and 2.5 or less.
- the second separated material after magnetic separation does not need to be in a slurry state and may be in a dry state.
- the ceramic fine particles contained in the second separated product are, for example, BaTiO 3
- dilute sulfuric acid is preferably used.
- insoluble BaSO 4 is formed on the surface of the ceramic fine particles, which are BaTiO 3 , so that the ceramic fine particles can be precipitated.
- the second metal fine particles, such as Cu do not dissolve in the mineral acid having no oxidizing power because they have a smaller ionization tendency than the hydrogen ions contained in the mineral acid having no oxidizing power.
- rare earth powder can be dissolved in dilute sulfuric acid.
- the rare earth-containing material such as Dy 2 O 3
- the ceramic fine particles which are BaTiO 3
- Dy in which the rare earth-containing material is dissolved in dilute sulfuric acid
- a dysprosium sulfate (Dy 2 (SO 4 ) 3 ) solution in which Dy in the rare earth-containing material is dissolved in dilute sulfuric acid is generated as a rare earth component-containing solution.
- hydrochloric acid or the like can be used as the mineral acid having no oxidizing power.
- soluble BaCl 2 is formed on the surface of the ceramic fine particles, BaTiO 3. Therefore, it is preferable to accurately adjust the pH of hydrochloric acid or the like so as to precipitate the ceramic fine particles and dissolve the rare earth-containing material while not dissolving the second metal fine particles.
- the rare earth component-containing solution containing the precipitated ceramic fine particles and the undissolved second metal fine particles produced in step (D) is filtered to separate the undissolved ceramic fine particles and the second metal fine particles from the rare earth component-containing solution. This solid-liquid separation allows the rare earth component-containing solution from which the undissolved ceramic fine particles and the second metal fine particles have been removed to be separated and recovered as rare earth components.
- step (D) BaTiO3 is precipitated, and second metal fine particles such as Cu are not dissolved, and a dysprosium sulfate (Dy2( SO4 ) 3 ) solution in which Dy is dissolved in dilute sulfuric acid is generated as a rare earth component- containing solution.
- the dysprosium sulfate solution from which BaTiO3 and Cu have been removed can be separated and recovered as rare earth components by the filtration in step (F).
- Filtration can be performed using filter paper (filter cloth). It is preferable that the mesh size of the filter paper (filter cloth) is such that the undissolved ceramic microparticles and the second metal microparticles do not pass through the filter paper (filter cloth).
- the rare earth component-containing solution containing the undissolved ceramic fine particles and the second metal fine particles produced in step (D) can be separated into solid and liquid, and the solid-liquid separation is not limited to filtration, but can be performed by any known method appropriately selected, such as decantation or centrifugation. Filtration is more preferable.
- the rare earth component-containing solution obtained in step (F) is neutralized to precipitate and recover the rare earth component.
- the precipitated rare earth component is separated and recovered, for example, by filtering the neutralized rare earth component-containing solution.
- the rare earth component is separated and recovered as a rare earth component compound (e.g., Dy(OH) 3 , etc.) by neutralization.
- the separation and recovery of the rare earth component includes not only the separation and recovery of the rare earth component itself, but also the separation and recovery of the rare earth component compound, which is a reaction product of the rare earth component chemically reacted, as the rare earth component.
- alkali is used for neutralization.
- alkalis include sodium hydroxide and potassium hydroxide.
- the rare earth components are recovered by adjusting the pH of the rare earth component-containing solution to between pH 6 and pH 9. This allows the precipitate resulting from the neutralization reaction to be efficiently separated and recovered as rare earth components. More preferably, the rare earth component-containing solution is adjusted to pH 8 by adding an alkali.
- dysprosium hydroxide (Dy(OH) 3 ) is obtained as a rare earth component compound by neutralization with sodium hydroxide. That is, since the dysprosium sulfate solution is acidic, the rare earth component dysprosium can be precipitated as dysprosium hydroxide (Dy(OH) 3 ) by neutralizing it with an alkali, and separated and recovered.
- dysprosium hydroxide (Dy(OH) 3 ) can be separated and recovered by filtering the solution obtained by neutralizing the dysprosium sulfate solution with an alkali. In addition to filtration, known methods such as decantation and centrifugation can be used.
- the rare earth component-containing solution produced in the dissolution of the second separated product in step (D) may contain metal components that are contaminants. These metal components are, for example, Ti, Mn, Ni, etc.
- an alkali is added to the rare earth component-containing solution to adjust the pH to, for example, from 3 to 5, preferably about pH 4, so that Ti, Mn, etc. can be separated and recovered.
- Ti precipitates as, for example, Ti(OH) 4
- Mn precipitates as, for example, Mn(OH) 2. Therefore, the rare earth component-containing solution adjusted to about pH 4 is filtered to recover Ti(OH) 4 , Mn(OH) 2 , etc.
- the rare earth components are separated and recovered by adding an alkali to the solution containing the rare earth components from which Ti, Mn, etc. have been separated and adjusted to a pH of 6 or more and 9 or less, preferably about pH 8, as described above.
- Ni and the like can be separated and recovered by adding an alkali to the solution from which Ti, Mn, rare earth components, etc. have been separated, for example, to a pH of more than 9 to a pH of 11 or less, preferably about pH 10.
- Ni precipitates as, for example, Ni(OH) 2 .
- the solution adjusted to about pH 10 is filtered to recover Ni(OH) 2 and the like.
- the rare earth component-containing solution is neutralized to a pH of 3 or more and a pH of 5 or less, preferably about pH 4, before the rare earth components are separated. Therefore, it is possible to first remove contaminants such as Ti and Mn from the rare earth component-containing solution. Since contaminants such as Ti and Mn have been removed from the rare earth component-containing solution in this way, it is possible to further facilitate separation of the rare earth components using the rare earth component-containing solution from which these contaminants have been removed.
- step (E) the ceramic fine particles and the second metal fine particles taken out by filtration in step (F) are dissolved in ammonia water. This produces a second metal solution in which the second metal component contained in the second metal fine particles is dissolved. Thus, the second metal solution can be separated and recovered as the second metal component. At this time, the ceramic fine particles are precipitated.
- a second metal fine particle containing a second metal component such as Cu and a ceramic fine particle of BaTiO3 are dissolved in ammonia water, thereby obtaining a second metal solution containing an ammine copper complex such as [Cu( NH3 ) 4 ] 2+ .
- BaTiO3 precipitates in the second metal solution.
- the second metal component is separated and recovered as a second metal solution.
- the separation and recovery of the second metal component includes not only the separation and recovery of the second metal component itself, but also the separation and recovery of the second metal component solution as the second metal component.
- the second metal component includes the second metal component itself, a second metal component compound which is a reaction product of the second metal component chemically reacting with other atoms, etc., a solution of the second metal component, a solution of the second metal component compound, etc.
- the state of the second metal component may be any of a liquid state, a solid state, and a mixed state of liquid and solid.
- the second metal component may be any of an amorphous state, a crystalline state, and a mixed state of amorphous and crystalline.
- step (E) it is preferable to adjust the second metal solution to a pH of 9 or more and a pH of 10 or less by adding ammonia water.
- the second metal solution can be efficiently separated and recovered as the second metal component. More preferably, the second metal solution is adjusted to a pH of 9.5 by adding ammonia water.
- an ammonium salt such as ammonium sulfate to the ammonia water.
- the ammonia water is a source of ammonia for forming the second metal component such as Cu as an ammine complex such as a copper ammine complex.
- the ammonium salt provides a counter ion to the ammine complex such as the copper ammine complex.
- an ammonium salt such as ammonium sulfate supplies SO 4 2- as a counter ion to the copper ammine complex which is [Cu(NH 3 ) 4 ] 2+ .
- the concentration of ammonia decreases, it forms a salt such as CuSO 4 to suppress the precipitation of Cu ions.
- the second metal solution containing the precipitated ceramic fine particles produced in step (E) is filtered to separate the precipitated ceramic fine particles from the second metal solution.
- the second metal solution from which the precipitated ceramic fine particles have been removed can be separated and recovered as a second metal component from the second metal solution containing the precipitated ceramic fine particles.
- step (E) a second metal solution is generated in which a second metal component such as Cu is dissolved in ammonia water while BaTiO3 is precipitated.
- the second metal solution contains a copper ammine complex such as [Cu( NH3 ) 4 ] 2+ .
- the second metal solution containing the copper ammine complex from which BaTiO3 has been removed can be separated and recovered as the second metal component by filtration in step (H).
- Filtration can be performed using filter paper (filter cloth).
- the mesh size of the filter paper (filter cloth) is preferably such that the precipitated ceramic fine particles do not pass through the filter paper (filter cloth).
- the solid-liquid separation of the second metal solution containing the precipitated ceramic fine particles produced in step (E) need only be performed, and the solid-liquid separation is not limited to filtration, and can be performed by any known method appropriately selected, such as decantation or centrifugation. Filtration is more preferable.
- the first separated product separated and recovered in step (C) is dissolved in a mineral acid.
- the first separated product includes a first metal fine product and a ceramic fine product.
- the ceramic fine product contained in the first separated product is precipitated as an undissolved product, and a first metal solution in which the first metal fine product in the first separated product is dissolved is generated.
- the first metal component contained in the first metal fine product is separated and recovered as a first metal solution.
- the separation and recovery of the first metal component includes not only the separation and recovery of the first metal component itself, but also the separation and recovery of the first metal solution as the first metal component.
- the mineral acid is, for example, at least one selected from the group including sulfuric acid, nitric acid, and hydrochloric acid.
- the mineral acid may be either a mineral acid that does not have oxidizing power or a mineral acid that has oxidizing power.
- when simply saying mineral acid it is meant to include both a mineral acid that does not have oxidizing power and a mineral acid that has oxidizing power.
- step (I) it is preferable to adjust the pH of the first metal solution to 1.5 or more and 2.5 or less by adding a mineral acid.
- the first metal solution is adjusted to a pH of 1.5 or more and 2.5 or less using a mineral acid, so that the first metal component in the first metal fine particles can be dissolved in the mineral acid.
- the pH is adjusted to a stronger acid than the above range, the ceramic fine particles and the like may dissolve in the mineral acid, so it is preferable to adjust the pH to within the above range. More preferably, the first metal solution is adjusted to a pH of 2 by adding a mineral acid.
- the separated first separated material is in a slurry state with a pH of about 7.
- a first metal solution adjusted to a pH of 1.5 or more and 2.5 or less can be produced.
- the first separated material after magnetic separation does not need to be in a slurry state and may be in a dry state.
- the ceramic fine particles contained in the first separation product are, for example, BaTiO 3
- sulfuric acid it is preferable to use sulfuric acid.
- insoluble BaSO 4 is formed on the surface of the ceramic fine particles, which are BaTiO 3 , so that the ceramic fine particles can be precipitated.
- the first metal fine particles, such as Ni can be dissolved in sulfuric acid.
- the first separation product which mainly contains the first metal fine particles, Ni and the ceramic fine particles, which are BaTiO 3 , in sulfuric acid
- BaTiO 3 is precipitated, and a nickel sulfate (NiSO 4 ) solution in which Ni is dissolved in sulfuric acid is generated as the first metal solution.
- NiSO 4 nickel sulfate
- hydrochloric acid or the like can be used as the mineral acid other than sulfuric acid.
- hydrochloric acid when hydrochloric acid is used as the mineral acid, soluble BaCl2 is formed on the surface of BaTiO3 , which is the ceramic fine particle. Therefore, it is preferable to precisely adjust the pH of hydrochloric acid or the like so as to precipitate the ceramic fine particle and dissolve the first metal fine particle.
- the first metal solution containing the precipitated ceramic fine particles produced in step (I) is filtered to separate the precipitated ceramic fine particles from the first metal solution.
- the first metal solution from which the precipitated ceramic fine particles have been removed can be separated and recovered as a first metal component from the first metal solution containing the precipitated ceramic fine particles.
- step (I) BaTiO3 is precipitated and a nickel sulfate ( NiSO4 ) solution in which Ni is dissolved in sulfuric acid is generated as the first metal solution.
- NiSO4 nickel sulfate
- the nickel sulfate solution from which BaTiO3 has been removed can be obtained by filtration.
- Filtration can be performed using filter paper (filter cloth).
- the mesh size of the filter paper (filter cloth) is preferably such that the precipitated ceramic fine particles do not pass through the filter paper (filter cloth).
- the solid-liquid separation of the first metal solution containing the precipitated ceramic fine particles produced in step (I) need only be performed, and is not limited to solid-liquid separation by filtration, and solid-liquid separation can be performed by an appropriate selection from known methods such as decantation and centrifugation. Filtration is more preferable.
- the separation and recovery of the first metal component includes not only the separation and recovery of the first metal component itself, but also the separation and recovery of the first metal component compound, which is a reaction product of the chemical reaction of the first metal component, as the first metal component.
- the first metal component constituting the internal electrode layer 16, the second metal component constituting the external electrode 30, and the rare earth component contained in the ceramic layer 14 can be separated and recovered from the fired waste of the multilayer ceramic capacitor. The details are explained below.
- the inventors of the present application have considered the effective use of various components contained in waste after firing of a multilayer ceramic capacitor (firing for firing electrode layers).
- various components are in a sintered state due to the firing process.
- the internal electrode layer is formed including first metal particles (first metal sintered body) obtained by sintering a first metal powder such as Ni by firing.
- the ceramic layer is formed including ceramic particles (ceramic sintered body) obtained by sintering a ceramic powder such as BaTiO 3 by firing.
- the external electrode is formed including second metal particles (second metal sintered body) obtained by sintering a second metal powder such as Cu by firing.
- the post-sintered waste after pulverization can be separated into a first separated material and a second separated material by separating the finely pulverized post-sintered waste using a magnet in step (C).
- the first separated material includes the ceramic microparticles and the first metal microparticles.
- the second separated material includes the ceramic microparticles, rare earth-containing materials, and second metal microparticles. Therefore, by separating and recovering the first separated material in step (C), it is possible to remove the second separated material from the post-sintered waste, and to separate and recover the first separated material including the first metal microparticles as the first metal component.
- step (D) the second separated material is dissolved in a mineral acid that has no oxidizing power, thereby producing a rare earth component-containing solution in which the rare earth components in the rare earth powder-containing material are dissolved.
- a rare earth component-containing solution in which the rare earth components in the rare earth powder-containing material are dissolved.
- the ceramic fine particles and the second metal fine particles in the second separated material have precipitated.
- the ceramic fine particles react with the mineral acid that has no oxidizing power, and become undissolved and precipitate.
- the second metal fine particles, such as Cu do not dissolve in the mineral acid that has no oxidizing power, because they have a smaller ionization tendency than the hydrogen ions contained in the mineral acid that has no oxidizing power.
- a second metal solution can be produced in which the second metal components, such as Cu, in the second metal fine particles are dissolved. This makes it possible to separate and recover the second metal components from the second metal solution. At this time, the ceramic fine particles in the second separated product do not dissolve in the ammonia water but precipitate.
- the rare earth components can be separated and recovered as a rare earth component-containing solution from the post-firing waste after micronization, and the second metal solution can be separated and recovered as a second metal component. Then, in the process of going through each step, the ratio of the rare earth components in the material containing the rare earth components and the ratio of the second metal components in the material containing the second metal components increase. Therefore, for example, rare earth components such as Dy and second metal components such as Cu can be recovered at high quality.
- the separation and recovery method of the above embodiment further includes step (I).
- step (I) the first separated material is dissolved in a mineral acid to produce a first metal solution in which the first metal component contained in the first metal fine particles is dissolved.
- step (I) the ceramic fine particles contained in the first separated material react with the mineral acid to become undissolved and precipitate, so that the ceramic fine particles and the first metal component contained in the first separated material are separated.
- the first metal solution can be separated and recovered as the first metal component from the post-firing waste after micronization. And, as each step goes through, the proportion of the first metal component in the material containing the first metal component increases. Therefore, the first metal component, such as Ni, can be recovered in high quality.
- the first metal component, second metal component, rare earth component, etc. are separated and recovered from the fired waste of multilayer ceramic capacitors, so the fired waste is not discarded as waste but can be used as a resource, reducing the burden on the environment.
- Example 10 g of the fired waste was prepared.
- the 10 g of fired waste contained 35 mass % (3.5 g) of Ni, which is the first metal component, 7 mass % (0.7 g) of Cu, which is the second metal component, 54 mass % (5.4 g) of ceramic particles (ceramic sintered body) which is BaTiO 3 , 2 mass % (0.2 g) of Dy, which is a rare earth component, and 2 mass % (0.2 g) of contaminants such as Mg, Mn, and SiO 2 (step (A)).
- the fired waste was pulverized and finely divided (step (B)).
- the fired waste after pulverization and finely divided was mixed with 100 ml of water to prepare a slurry.
- the slurry was magnetically separated using a magnet.
- 4.5 g of the first separated product was separated and recovered, and 4.6 g of the second separated product was separated and recovered (step (C)).
- 100 ml of water was added to 4.6 g of the second separated product, and 1 mol% sulfuric acid was added little by little to adjust the pH to 2.
- the ceramic fine particles (BaTiO 3 ) and the second metal fine particles (Cu) in the second separated product were precipitated, and the Dy contained in the rare earth-containing material was dissolved in the sulfuric acid solution (step (D)).
- step (F) 100 ml of water and 2 g of ammonium sulfate were added to 4.1 g of the filtrate of the ceramic fine particles (BaTiO 3 ) and the second metal fine particles (Cu) recovered in step (F), and 1 mol% ammonia water was added little by little to adjust the pH to 9.5. This caused the ceramic fine particles (BaTiO 3 ) to precipitate, and the second metal fine particles (Cu) to dissolve in ammonia water (step (E)). This solution was filtered to separate and recover 90 ml of ammine copper complexes such as [Cu(NH 3 ) 4 ] 2+ . Thus, by passing through this step, approximately 60% of the Cu contained in the waste after firing was recovered.
- step (J) 100 ml of water was added to 4.5 g of the first separated product recovered in step (C), and 1 mol % sulfuric acid was added little by little to adjust the pH to 2.
- the ceramic fine particles (BaTiO 3 ) in the first separated product were precipitated, and the first metal fine particles (Ni) were dissolved in the sulfuric acid solution (step (I)).
- the solution in which the ceramic fine particles (BaTiO 3 ) were precipitated and the first metal fine particles (Ni) were dissolved in the sulfuric acid solution was filtered to obtain 90 ml of nickel sulfate (Ni(SO 4 )) solution (step (J)).
- the separation and recovery method according to the present embodiment uses fired multilayer ceramic capacitor waste as a starting material, and by going through processes such as magnetic separation and leaching by neutralization, it is possible to easily separate and refine high-quality rare earth components such as Dy, Ni, and Cu, a first metal component, and a second metal component.
- the external electrode 30 includes a fired electrode layer 32.
- the fired electrode layer 32 is the outermost layer of the multilayer ceramic capacitor 10 (FIG. 3).
- the form of the external electrode 30 is not limited to this.
- the external electrode 30 includes a fired electrode layer 32 and a plating layer.
- the plating layer is the outermost layer of the multilayer ceramic capacitor. Descriptions of the same content as in the first embodiment will be omitted or simplified.
- FIG. 7 is a cross-sectional view (1) parallel to a plane including the length direction and stacking direction of a multilayer ceramic capacitor according to a second embodiment of the present invention.
- FIG. 8 is a cross-sectional view (2) parallel to a plane including the length direction and stacking direction of another type of multilayer ceramic capacitor according to the second embodiment of the present invention.
- the multilayer ceramic capacitors 10A (FIG. 7) and 10B (FIG. 8) according to the second embodiment include a laminate 12 similar to that of the first embodiment, and further include an external electrode 30 arranged on the laminate 12.
- the external electrode 30 includes a baked electrode layer 32 and a plating layer 34 arranged on the baked electrode layer 32.
- the plating layer 34 is the outermost layer of the multilayer ceramic capacitors 10A and 10B.
- the configuration other than the plating layer 34 is the same as that of the first embodiment.
- the plating layer 34 is formed by including at least one selected from, for example, Ni, Sn, Cu, Ag, etc. Note that the multilayer ceramic capacitor 10 according to the first embodiment does not include a plating layer (FIG. 3).
- the multilayer ceramic capacitors 10A and 10B according to the second embodiment are formed through the steps (step 1) to (step 7) of the first embodiment described above, followed by a step (step 8) of disposing a plating layer 34 on the baked electrode layer 32.
- a plating process is performed to form a first plating layer 34a (first lower plating layer 34a 1 , first upper plating layer 34a 2 ) on the first baked electrode layer 32a, and a second plating layer 34b (second lower plating layer 34b 1 , second upper plating layer 34b 2 ) on the second baked electrode layer 32b.
- the plating layer 34 is formed, for example, by barrel plating. Either electrolytic plating or electroless plating may be used for the plating process.
- electroless plating has the disadvantage that a pretreatment using a catalyst or the like is required to improve the plating deposition speed, which complicates the process. Therefore, it is usually preferable to use electrolytic plating.
- the multilayer ceramic capacitors 10A and 10B having the plating layer 34 according to the second embodiment are also included in the post-sintering (sintering for fired electrode layers) waste, similar to the multilayer ceramic capacitor 10 according to the first embodiment (sometimes called the multilayer ceramic capacitor 10 without the plating layer 34).
- the multilayer ceramic capacitors 10A and 10B having the plating layer 34 may be introduced into the separation and recovery method shown in FIG. 1 described above, or into the separation and recovery method shown in FIG. 9 described below.
- the separation and recovery method in FIG. 1 does not include a step of removing the plating layer 34, but the separation and recovery method in FIG. 9 includes a step of removing the plating layer 34 (step (K)).
- the plating layer 34 may be formed from a single plating layer (FIG. 7) or may be formed by stacking multiple plating layers (FIG. 8).
- FIG. 7 we will explain a multilayer ceramic capacitor 10A in which the plating layer 34 is a single plating layer, and a multilayer ceramic capacitor 10B in which the plating layer 34 is a multiple plating layer.
- an external electrode 30 includes a baked electrode layer 32 and a plating layer 34 disposed on the baked electrode layer 32.
- the plating layer 34 is formed of a single-layer plating layer.
- the plating layer 34 includes a first lower-layer plating layer (first first-stage plating layer) 34a 1 and a second lower-layer plating layer 34b 1 (second first-stage plating layer).
- the first external electrode 30a includes a first baked electrode layer 32a and a first lower-layer plating layer 34a 1 on the first baked electrode layer 32a.
- the second external electrode 30b includes a second baked electrode layer 32b and a second lower-layer plating layer 34b 1 on the second baked electrode layer 32b.
- the first and second lower plating layers 34a1 , 34b1 are the outermost layers among the layers disposed on the laminate 12.
- the baked electrode layer 32 serves as a base for the plating layer 34, and is therefore sometimes referred to as a base electrode layer.
- the multilayer ceramic capacitor 10A having the plating layer 34 is included in the post-sintering waste (sintering for the fired electrode layer) as in the first embodiment. Therefore, the multilayer ceramic capacitor 10A having the plating layer 34 can be input to the separation and recovery method of FIG. 1 described in the first embodiment. That is, in the preparation of the post-sintering waste in step (A), the multilayer ceramic capacitor 10A having the plating layer 34 can be prepared as the post-sintering waste. Thereafter, the first metal component, the second metal component, and the rare earth component can be separated and recovered from the multilayer ceramic capacitor 10A having the plating layer 34 by going through the separation and recovery method described in FIG. 1.
- FIG. 9 is a flow diagram showing a method for separating and recovering rare earth components and metal components from waste after firing of a multilayer ceramic capacitor (firing for firing electrode layers), including a plating removal step.
- the separation and recovery method of FIG. 9 is the same as the separation and recovery method of FIG. 1, except for the inclusion of step (K).
- the method of separation and recovery shown in FIG. 1, which does not include a plating removal step, or the method of separation and recovery shown in FIG. 9, which includes a plating removal step can be used, for example, as follows:
- the metal components contained in both the first and second lower plating layers 34a 1 , 34b 1 are the same as at least one of the first metal component contained in the internal electrode layer 16 and the second metal component contained in the fired electrode layer 32.
- the laminated ceramic capacitor 10A having the plating layer 34 is prepared as a waste product after firing in step (A) of FIG. 1, and is further treated in each step after step (B) of the separation and recovery method shown in FIG. 1.
- the first metal component of the plating layer 34 can be separated and recovered together with the first metal component contained in the internal electrode layer 16.
- the second metal component of the plating layer 34 can be separated and recovered together with the second metal component contained in the baked electrode layer 32. It is possible to separate and recover the rare earth component from the ceramic layer 14.
- both the first and second lower plating layers 34a 1 and 34b 1 are plating layers mainly composed of Ni. It is also assumed that the internal electrode layer 16 contains Ni as the first metal component.
- the multilayer ceramic capacitor 10A is prepared as a post-sintering waste in step (A) of FIG. 1 without removing the first and second lower plating layers 34a 1 and 34b 1. Thereafter, by going through each step from step (B) onward in the separation and recovery method of FIG. 1, it is possible to separate and recover Ni, which is the first metal component, from the first and second lower plating layers 34a 1 and 34b 1 and the internal electrode layer 16. It is possible to separate and recover the second metal component from the fired electrode layer 32, and the rare earth component from the ceramic layer 14.
- both the first and second lower plating layers 34a 1 and 34b 1 are plating layers mainly composed of Cu.
- the baked electrode layer 32 contains Cu as the second metal component.
- the multilayer ceramic capacitor 10A is prepared as waste after firing in step (A) of FIG. 1 without removing the first and second lower plating layers 34a 1 and 34b 1.
- the second metal component, Cu can be separated and recovered from the first and second lower plating layers 34a 1 and 34b 1 and the baked electrode layer 32.
- the first metal component can be separated and recovered from the internal electrode layer 16, and the rare earth component can be separated and recovered from the ceramic layer 14.
- the metal components contained in both the first and second lower plating layers 34a 1 and 34b 1 are different from both the first metal component contained in the internal electrode layer 16 and the second metal component contained in the fired electrode layer 32.
- the metal component (third metal component) contained in the first and second lower plating layers 34a 1 and 34b 1 is different from both the first metal component and the second metal component.
- the multilayer ceramic capacitor 10A having the plating layer 34 is prepared as a post-sintering waste in step (A) of FIG. 9. Then, the first and second lower plating layers 34a 1 and 34b 1 are removed by plating removal in step (K).
- the multilayer ceramic capacitor 10A from which the plating layer 34 has been removed is further processed by each step after step (B) of the separation and recovery method shown in FIG. 9. This makes it possible to separate and recover the first metal component constituting the internal electrode layer 16, the second metal component constituting the fired electrode layer 32, and the rare earth component contained in the ceramic layer 14 from the multilayer ceramic capacitor 10A from which the plating layer 34 has been removed.
- both the first and second lower plating layers 34a 1 and 34b 1 are plating layers mainly composed of Sn (an example of a third metal component). It is also assumed that the internal electrode layer 16 contains Ni as the first metal component, and the fired electrode layer 32 contains Cu as the second metal component.
- the multilayer ceramic capacitor 10A having the plating layer 34 is prepared as waste after firing in step (A) of FIG. 9. Then, in step (K) of FIG. 9, the first and second lower plating layers 34a 1 and 34b 1 mainly composed of Sn are removed.
- the first and second lower plating layers 34a 1 and 34b 1 mainly composed of Sn can be removed by immersing the multilayer ceramic capacitor 10A having the plating layer 34 in an alkaline solution other than ammonia water, such as sodium hydroxide and potassium hydroxide.
- an alkaline solution other than ammonia water such as sodium hydroxide and potassium hydroxide.
- the baked electrode layer 32 mainly composed of Cu is exposed to the alkaline solution by removing the plating layer 34.
- the baked electrode layer 32 mainly composed of Cu is not easily corroded by the alkaline solution.
- the alkaline solution other than ammonia water is adjusted to, for example, about pH 12.
- step (B) of the separation and recovery method of Figure 9 Thereafter, by going through each step from step (B) of the separation and recovery method of Figure 9 onwards, the first metal component constituting the internal electrode layer 16, the second metal component constituting the baked electrode layer 32, and the rare earth component contained in the ceramic layer 14 can be separated and recovered.
- the plating layer 34 which is mainly composed of Sn
- the plating layer 34 is removed with an alkaline solution other than ammonia water.
- the plating layer 34 which is mainly composed of Sn
- the baked electrode layer 32 which is mainly composed of Cu
- the acidic solution is adjusted to, for example, about pH 2.
- the multilayer ceramic capacitor 10A having the plating layer 34 may be prepared as waste after firing in step (A) of Fig. 9. Then, the first and second lower plating layers 34a1 , 34b1 may be removed by plating removal in step (K).
- both the first and second lower plating layers 34a 1 and 34b 1 are plating layers mainly composed of Ni. It is also assumed that the internal electrode layer 16 contains Ni as the first metal component, and the baked electrode layer 32 contains Cu as the second metal component.
- the multilayer ceramic capacitor 10A having the plating layer 34 is prepared as waste after firing in step (A) of FIG. 9. Then, in step (K) of FIG. 9, the first and second lower plating layers 34a 1 and 34b 1 mainly composed of Ni are removed.
- the first and second lower plating layers 34a 1 and 34b 1 mainly composed of Ni can be removed by immersing the multilayer ceramic capacitor 10A having the plating layer 34 in an acidic solution that does not have oxidizing power, such as hydrochloric acid and dilute sulfuric acid.
- the baked electrode layer 32 mainly composed of Cu is exposed to the acidic solution by removing the plating layer 34.
- the baked electrode layer 32 which is mainly composed of Cu, is not easily corroded by the acidic solution.
- the acidic solution is adjusted to, for example, a pH of about 2.
- the first metal component constituting the internal electrode layer 16, the second metal component constituting the baked electrode layer 32, and the rare earth component contained in the ceramic layer 14 can be separated and recovered.
- an external electrode 30 includes a baked electrode layer 32 and a plating layer 34 disposed on the baked electrode layer 32.
- the plating layer 34 is formed of multiple plating layers.
- the plating layer 34 is formed of two plating layers.
- the plating layer 34 includes a first lower plating layer (first first-stage plating layer) 34a1 and a second lower plating layer (second first-stage plating layer) 34b1 , a first upper plating layer (first second-stage plating layer) 34a2 and a second upper plating layer (second second-stage plating layer) 34b2 .
- the first external electrode 30a includes a first baked electrode layer 32a, a first lower-layer plating layer 34a1 on the first baked electrode layer 32a, and a first upper-layer plating layer 34a2 on the first lower-layer plating layer 34a1 .
- the second external electrode 30b includes a second baked electrode layer 32b, a second lower-layer plating layer 34b1 on the second baked electrode layer 32b , and a second upper-layer plating layer 34b2 on the second lower-layer plating layer 34b1 .
- the first upper-layer plating layer 34a2 and the second upper-layer plating layer 34b2 are the outermost layers among the layers arranged on the laminate 12.
- the multilayer ceramic capacitor 10B having the plating layer 34 is formed through the steps (step 1) to (step 7) of the first embodiment described above, followed by a step (step 8) of disposing the plating layer 34 on the baked electrode layer 32.
- step 8 a plating process is performed to sequentially form a first lower-layer plating layer 34a1 and a first upper-layer plating layer 34a2 on the first baked electrode layer 32a, and a second upper-layer plating layer 34b2 on the second lower-layer plating layer 34b1 on the second baked electrode layer 32b .
- the multilayer ceramic capacitor 10B having the plating layer 34 is included in the post-sintering waste (sintering for the fired electrode layer) as in the first embodiment. Therefore, the multilayer ceramic capacitor 10B having the plating layer 34 can be input to the separation and recovery method of FIG. 1 described in the first embodiment. That is, in the preparation of the post-sintering waste in step (A), the multilayer ceramic capacitor 10B having the plating layer 34 can be prepared as the post-sintering waste. Thereafter, the first metal component, the second metal component, and the rare earth component can be separated and recovered from the multilayer ceramic capacitor 10B having the plating layer 34 by going through the separation and recovery method described in FIG. 1.
- the method of separation and recovery shown in FIG. 1, which does not include a plating removal step, or the method of separation and recovery shown in FIG. 9, which includes a plating removal step can be used, for example, as follows:
- the metal components contained in the first and second lower plating layers 34a 1 , 34b 1 and the first and second upper plating layers 34a 2 , 34b 2 are the same as at least one of the first metal component contained in the internal electrode layer 16 and the second metal component contained in the baked electrode layer 32.
- the laminated ceramic capacitor 10B having the plating layer 34 is prepared as waste after firing in step (A) of FIG. 1, and is treated by the separation and recovery method shown in FIG. 1.
- the metal components of the first and second lower plating layers 34a 1 , 34b 1 may be the same as the first metal component contained in the internal electrode layer 16.
- the metal components of the first and second upper plating layers 34a 2 , 34b 2 may be the same as the second metal component contained in the baked electrode layer 32.
- the metal components of the first and second lower plating layers 34a1 , 34b1 may be the same as the second metal component contained in the baked electrode layer 32.
- the metal components of the first and second upper plating layers 34a2 , 34b2 may be the same as the first metal component contained in the internal electrode layer 16.
- the first and second metal components of the plating layer 34 can be separated and recovered together with the first metal component contained in the internal electrode layer 16 and the second metal component contained in the baked electrode layer 32. It is to be noted that rare earth components can be separated and recovered from the ceramic layer 14.
- the first and second lower plating layers 34a1 , 34b1 are plating layers mainly composed of Ni (or Cu).
- the first and second upper plating layers 34a2 , 34b2 are plating layers mainly composed of Cu (or Ni).
- the internal electrode layer 16 contains Ni as a first metal component.
- the baked electrode layer 32 contains Cu as a second metal component.
- the multilayer ceramic capacitor 10B is prepared as waste after firing in step (A) of FIG. 1 without removing the first and second lower plating layers 34a1 , 34b1 and the first and second upper plating layers 34a2 , 34b2 .
- the first metal component Ni and the second metal component Cu can be separated and recovered from the first and second lower plating layers 34a1 , 34b1 and the first and second upper plating layers 34a2 , 34b2 , the internal electrode layer 16, and the baked electrode layer 32.
- Rare earth components can be separated and recovered from the ceramic layer 14.
- step (K) the first and second lower plating layers 34a 1 , 34b 1 and the first and second upper plating layers 34a 2 , 34b 2 are removed by plating removal in step (K).
- step (B) of the separation and recovery method shown in FIG. 9. This makes it possible to separate and recover the first metal component constituting the internal electrode layer 16, the second metal component constituting the fired electrode layer 32, and the rare earth component contained in the ceramic layer 14 from the multilayer ceramic capacitor 10B from which the plating layer 34 has been removed.
- the (third metal component) contained in the first and second upper plating layers 34a 2 , 34b 2 is different from both the first metal component contained in the internal electrode layer 16 and the second metal component contained in the baked electrode layer 32.
- the metal components contained in the first and second lower plating layers 34a 1 , 34b 1 are the same as either the first metal component contained in the internal electrode layer 16 or the second metal component contained in the baked electrode layer 32.
- the laminated ceramic capacitor 10B having the plating layer 34 is prepared as waste after firing in step (A) of FIG. 9. Then, the first and second upper plating layers 34a 2 , 34b 2 are removed by plating removal in step (K).
- the multilayer ceramic capacitor 10B from which the first and second upper plating layers 34a2 , 34b2 have been removed is further processed by each step subsequent to step (B) of the separation and recovery method shown in Fig. 9.
- the metal components (first metal component or second metal component) contained in the first and second lower plating layers 34a1 , 34b1 , the first metal component constituting the internal electrode layer 16 , the second metal component constituting the fired electrode layer 32, and the rare earth components contained in the ceramic layer 14 can be separated and recovered from the multilayer ceramic capacitor 10B from which the first and second upper plating layers 34a2, 34b2 have been removed.
- the metal component contained in the first and second upper plating layers 34a 2 , 34b 2 is a plating layer mainly composed of Sn (an example of a third metal component).
- the metal component contained in the first and second lower plating layers 34a 1 , 34b 1 is a plating layer mainly composed of Ni (or Cu).
- the internal electrode layer 16 contains Ni as the first metal component
- the fired electrode layer 32 contains Cu as the second metal component.
- the multilayer ceramic capacitor 10B having the plating layer 34 is prepared as waste after firing in step (A) of FIG. 9. Then, in step (K) of FIG.
- the first and second upper plating layers 34a 2 , 34b 2 mainly composed of Sn are removed.
- the first and second upper plating layers 34a 2 , 34b 2 mainly composed of Sn can be removed by immersing the laminated ceramic capacitor 10B having the plating layer 34 in an alkaline solution other than ammonia water, such as sodium hydroxide and potassium hydroxide.
- the first and second lower plating layers 34a 1 , 34b 1 mainly composed of Ni (or Cu) are exposed to the alkaline solution by removing the first and second upper plating layers 34a 2 , 34b 2.
- the first and second lower plating layers 34a 1 , 34b 1 mainly composed of Ni (or Cu ) are not easily corroded by the alkaline solution.
- the baked electrode layer 32 mainly composed of Cu is also not easily corroded by the alkaline solution.
- the alkaline solution other than ammonia water is adjusted to, for example, about pH 12. 9
- the first metal component Ni and the second metal component Cu can be separated and recovered from the first and second lower plating layers 34a1 , 34b1 , the internal electrode layer 16, and the baked electrode layer 32.
- Rare earth components can be separated and recovered from the ceramic layer 14.
- the metal component contained in the first and second upper plating layers 34a 2 , 34b 2 is a plating layer mainly composed of Sn (an example of a third metal component).
- the metal component contained in the first and second lower plating layers 34a 1 , 34b 1 is a plating layer mainly composed of Ni, not Cu.
- the internal electrode layer 16 contains Ni as the first metal component
- the fired electrode layer 32 contains Cu as the second metal component.
- the multilayer ceramic capacitor 10B having the plating layer 34 is prepared as a post-sintering waste in the step (A) of FIG. 9. 9, the first and second upper plating layers 34a 2 , 34b 2 mainly composed of Sn and the first and second lower plating layers 34a 1 , 34b 1 mainly composed of Ni are removed.
- the first and second upper plating layers 34a 2 , 34b 2 mainly composed of Sn and the first and second lower plating layers 34a 1 , 34b 1 mainly composed of Ni can be removed by immersing the laminated ceramic capacitor 10B having the plating layer 34 in an acidic solution that does not have oxidizing power , such as hydrochloric acid or dilute sulfuric acid.
- the baked electrode layer 32 mainly composed of Cu is exposed to the acidic solution by removing the plating layer 34.
- the baked electrode layer 32 mainly composed of Cu is not easily corroded by the acidic solution.
- the acidic solution is adjusted to, for example, about pH 2. 9, the first metal component Ni and the second metal component Cu can be separated and recovered from the internal electrode layer 16 and the fired electrode layer 32.
- the rare earth component can be separated and recovered from the ceramic layer 14.
- the first and second upper plating layers 34a2 , 34b2 mainly composed of Sn and the first and second lower plating layers 34a1 , 34b1 mainly composed of Ni are removed at the same time by the non-oxidizing acidic solution. However, they may be removed in order.
- the multilayer ceramic capacitor 10B is immersed in an alkaline solution (e.g., about pH 12) other than ammonia water, such as sodium hydroxide and potassium hydroxide, to remove the first and second upper plating layers 34a2 , 34b2 mainly composed of Sn.
- an alkaline solution e.g., about pH 12
- ammonia water such as sodium hydroxide and potassium hydroxide
- the multilayer ceramic capacitor 10B is immersed in an acidic solution (e.g., about pH 2) other than ammonia water, such as hydrochloric acid and dilute sulfuric acid, to remove the first and second lower plating layers 34a1 , 34b1 mainly composed of Ni. 9, the first metal component Ni and the second metal component Cu can be separated and recovered from the internal electrode layer 16 and the fired electrode layer 32.
- the rare earth component can be separated and recovered from the ceramic layer 14.
- the first metal component constituting the internal electrode layer 16, the second metal component constituting the external electrode 30, and the rare earth component contained in the ceramic layer 14 can be separated and recovered by the separation and recovery method shown in Fig. 1 or 9. Furthermore, by employing a separation and recovery method suitable for separating and recovering the metal components from the plating layer 34, the first metal component and the second metal component can also be recovered from the plating layer 34 in some cases.
- the calcination waste is pulverized and refined in step (B).
- the calcination waste may be refined by dispersing it in a solvent (e.g., an aqueous solvent or other solvent) in addition to the refinement in step (B) (particularly, refinement by pulverization), or instead of the refinement in step (B) (particularly, refinement by pulverization), in the slurry state.
- a solvent e.g., an aqueous solvent or other solvent
- wet refinement the refinement in which the calcination waste is mixed with a solvent to form a slurry.
- the refinement in which the calcination waste is pulverized in the slurry generated by mixing the calcination waste with a solvent is called wet grinding.
- the aqueous solvent for example, water can be used.
- the calcined waste after being pulverized in step (B) can be mixed with an aqueous solvent such as water and dispersed to form a slurry state.
- an aqueous solvent such as water
- the calcined waste in this slurry state can be magnetically separated in step (C). In other words, the effort of generating a slurry state in the magnetic separation in step (C) can be omitted.
- the post-calcination waste into a slurry using an organic solvent.
- a process for removing the organic solvent is required in the separation and recovery method. Therefore, it is preferable to make the post-calcination waste into a slurry using an aqueous solvent such as water.
- the waste after firing is waste after firing for the fired electrode layer in (step 7).
- the waste after firing is not limited to this.
- the waste after firing may include waste that has not been fired for the fired electrode layer and has been fired before being input to the separation and recovery method of FIG. 1 and FIG. 9.
- the firing is preferably performed at the firing temperature for the fired electrode layer.
- Waste before firing for the baked electrode layer includes, for example, waste discharged in (step 1) to (step 6).
- waste before firing for the baked electrode layer may include waste after the paste for the baked electrode layer is applied to the laminate 12 in (step 7) but before firing for the baked electrode layer.
- waste before firing for the baked electrode layer includes, for example, waste of dielectric slurry and conductive paste for the internal electrode layer in (step 1), waste of dielectric sheets on which the pattern of the internal electrode layer is formed in (step 2), dielectric sheets on which the pattern of the internal electrode layer is not printed, excess laminate blocks such as scraps of laminate blocks discharged after the laminate blocks are cut in (step 4), defective laminate chips after cutting, waste after degreasing in (step 5), and waste after firing of laminate chips in (step 6).
- a two-terminal multilayer ceramic capacitor having two terminals, the first external electrode 30a and the second external electrode 30b, has been described as a multilayer ceramic capacitor to be manufactured.
- the scope of application of the present invention is not limited to the post-firing waste of a two-terminal multilayer ceramic capacitor.
- the subject of application of the present invention is the post-firing waste of a multilayer ceramic capacitor having an internal electrode layer containing a first metal component such as Ni, an external electrode containing a second metal component such as Cu, and a ceramic layer containing a dielectric material such as BaTiO3 and a rare earth component that is an additive such as Dy. Therefore, the present invention may be applied to, for example, the post-firing waste of a three-terminal multilayer ceramic capacitor.
- a three-terminal multilayer ceramic capacitor has a laminate 12 similar to those of the first and second embodiments described above, and first to fourth external electrodes.
- the internal electrode layer 16 has a first internal electrode layer extended to the first end face 12e and the second end face 12f, and a second internal electrode layer extended to the first side face 12c and the second side face 12d.
- a first external electrode is disposed on the first end face 12e of the laminate 12. The first external electrode is electrically connected to the first internal electrode layer exposed at the first end face 12e of the laminate 12.
- a second external electrode is disposed on the second end face 12f of the laminate 12. The second external electrode is electrically connected to the first internal electrode layer exposed at the second end face 12f of the laminate 12.
- a third external electrode is disposed on the first side face 12c of the laminate 12.
- the third external electrode is electrically connected to the second internal electrode layer exposed at the first side surface 12c of the laminate 12.
- a fourth external electrode is disposed on the second side surface 12d of the laminate 12.
- the fourth external electrode is electrically connected to the second internal electrode layer exposed at the second side surface 12d of the laminate 12.
- the first to fourth external electrodes may include only a baked electrode layer, or may include a baked electrode layer and a plating layer.
- step (F) When the second separated material is dissolved in a mineral acid having no oxidizing power in step (D), the ceramic fine particles contained in the second separated material react with the mineral acid having no oxidizing power to become undissolved and precipitate.
- the second metal fine particles such as Cu have a smaller ionization tendency than the hydrogen ions contained in the mineral acid having no oxidizing power, so they do not dissolve in the mineral acid having no oxidizing power.
- the rare earth components in the rare earth-containing material dissolve to produce a rare earth component-containing solution.
- the rare earth component-containing solution containing the undissolved materials can also be recovered as the rare earth components.
- the solid-liquid separation step (F) such as filtration can be omitted.
- step (G) Omission of neutralization in step (G)
- the rare earth components in dissolving the second separated product in step (D), the rare earth components can be separated and recovered as a rare earth component-containing solution. Therefore, the neutralization in step (G) can be omitted.
- step (C) Omission of various treatments in steps (I) and (J)
- the first separated material containing the first metal fine particles in the magnetic separation in step (C), the first separated material containing the first metal fine particles can be separated and recovered as the first metal component. Therefore, steps (I) and (J) can be omitted.
- the first metal solution in the dissolution of the first separated material in step (I), the first metal solution can be separated and recovered as the first metal component. Therefore, the filtration in step (J) can be omitted.
- rare earth component compounds such as Dy(OH) 3 are separated and recovered as rare earth components in the neutralization step (G).
- the method for separating and recovering rare earth components is not limited to this.
- the rare earth components can be recovered as follows.
- step (a) The rare earth component compound obtained by neutralization in step (G) is heat-treated to produce an oxide, and the oxide can be recovered as the rare earth component.
- the rare earth component compound obtained after the neutralization in step (G) is Dy(OH) 3
- dysprosium oxide (Dy 2 O 3 ) can be recovered as the rare earth component by heat treating Dy(OH) 3 .
- the rare earth component compound obtained by neutralization in step (G) is dissolved in hydrochloric acid to produce a chloride, and the chloride can be recovered as the rare earth component.
- the rare earth component compound obtained after the neutralization in step (G) is Dy(OH) 3
- Dy(OH) 3 is dissolved in hydrochloric acid to produce a dysprosium chloride ( DyCl3 ) solution.
- the dysprosium chloride solution is distilled to evaporate the solvent, and dysprosium chloride hexahydrate ( DyCl3.6H2O ) can be recovered as the rare earth component.
- the rare earth component compound Dy(OH) 3 obtained after neutralization in step (G) is dissolved in hydrochloric acid to produce a dysprosium chloride solution, which is then further purified to recover high-purity rare earth components.
- the dysprosium chloride solution produced as described above can be purified by solvent extraction, and a high-purity dysprosium chloride solution can be recovered as a rare earth component.
- Solvent extraction is a separation and purification method that utilizes the partitioning of solutes, in which a solute dissolved in one of the oil phase and the water phase, which are immiscible liquids, is transferred to the other phase.
- an ion exchange resin method can be used as a method other than solvent extraction.
- high-purity dysprosium oxide can be recovered from the high-purity dysprosium chloride solution obtained by the solvent extraction in (c) above.
- oxalic acid is added to the high-purity dysprosium chloride solution to precipitate dysprosium oxalate.
- high-purity dysprosium oxalate hexahydrate Dy2 ( C2O4 ) 3.6H2O ) is recovered .
- high-purity dysprosium oxide ( Dy2O3 ) can be recovered as a rare earth component.
- high-purity dysprosium chloride hexahydrate can be recovered from the high-purity dysprosium chloride solution obtained by the solvent extraction in (c) above.
- high-purity dysprosium chloride hexahydrate is recovered by distilling off the high-purity dysprosium chloride solution and evaporating the solvent.
- the state of the recovered rare earth component may be any of a liquid state, a solid state, and a mixed state of liquid and solid.
- the crystal lattice of the rare earth component may be any of an amorphous state, a crystalline state, and a mixed state of amorphous and crystalline.
- the first metal fine particles are dissolved in a mineral acid in the dissolution of the first separated product in step (I).
- the first metal solution is then separated and recovered as the first metal component.
- the first metal solution containing the precipitated ceramic fine particles is filtered, and the first metal solution from which the ceramic fine particles have been removed is separated and recovered as the first metal component.
- the separation and recovery of the first metal component is not limited to this.
- the first metal component can be recovered as follows.
- the first metal solution obtained after dissolving the first metal fine particles in step (I) can be purified by a method other than the above-mentioned (b) to recover a high-purity first metal component.
- a nickel sulfate solution which is a first metal solution
- solid high-purity Ni can be precipitated by a method of precipitating a solid dissolved in the solution, such as electrolytic deposition, and recovered as the first metal component.
- the first metal solution obtained after dissolving the finely divided first metal product in step (I) is neutralized to generate a chloride, and the chloride can be recovered as the first metal component.
- a nickel sulfate solution which is a first metal solution
- the precipitated nickel hydroxide (Ni(OH) 2 ) is separated and recovered, for example, by filtration.
- nickel hydroxide is dissolved in hydrochloric acid to produce a nickel chloride ( NiCl2 ) solution.
- nickel chloride hexahydrate NiCl2.6H2O
- the state of the recovered metal component may be any of a liquid state, a solid state, and a mixed state of liquid and solid.
- the crystal lattice of the metal component may be any of an amorphous state, a crystalline state, and a mixed state of amorphous and crystalline.
- the manufacturing method of the multilayer ceramic capacitor 10 includes the formation of a laminated block (step 3), cutting into laminated chips (step 4), degreasing (step 5), firing of the laminated chips (step 6), and application and firing of the baked electrode layer paste (step 7) in that order.
- the manufacturing method of the multilayer ceramic capacitor 10 is not limited to this, and for example, before the degreasing in step 5 and before the firing (firing of the laminated chips) in step 6, the baked electrode layer paste may be applied to the unfired laminated chips, and then the degreasing and firing of the baked electrode layers may be performed.
- the baked electrode layer paste containing Ni, glass components, resin components, etc. is applied to the laminated chips before the degreasing in step 5.
- the laminated chips to which the baked electrode layer paste has been applied are degreased, and then the baked electrode layers are fired.
- the temperature during degreasing is preferably, for example, higher than 800° C. and lower than 1000° C.
- the firing temperature for the fired electrode layer is preferably, for example, higher than 1000° C. and not higher than 1400° C.
- step (C) the finely divided post-sintering waste material in the step (B) is mixed with an aqueous solvent to generate a slurry, and then the first separated matter and the second separated matter are respectively recovered using the magnet.
- ⁇ 6> The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors according to any one of ⁇ 1> to ⁇ 5>, wherein the first metal component is Ni.
- ⁇ 7> The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors according to any one of ⁇ 1> to ⁇ 6>, wherein the second metal component is Cu.
- ⁇ 8> The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors according to any one of ⁇ 1> to ⁇ 7>, wherein the ceramic particles are BaTiO 3 .
- ⁇ 9> The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors according to any one of ⁇ 1> to ⁇ 8>, wherein the rare earth components are at least one of Dy, Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Ho, Er, Tm, Yb, and Lu.
- Multilayer ceramic capacitor 12 Laminate 12a: First main surface 12b: Second main surface 12c: First side surface 12d: Second side surface 12e: First end surface 12f: Second end surface 14: Ceramic layer 14_U: Unfired ceramic layer 16: Internal electrode layer 16_U: Unfired internal electrode layer 16a: First internal electrode layer 16b: Second internal electrode layer 30: External electrode 30a: First external electrode 30b: Second external electrode 32: Baked electrode layer 32a: First baked electrode layer 32b: Second baked electrode layer 34: Plating layer 34a: First plating layer 34b : Second plating layer 34a1 : First lower plating layer 34a2: First upper plating layer 34b1 : second lower plating layer 34b2 : second upper plating layer x: height direction y: width direction z: length direction
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Abstract
Description
この発明は、積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法に関する。 This invention relates to a method for separating and recovering rare earth and metal components from post-sintering waste from multilayer ceramic capacitors.
自動車に車載される電子部品、携帯電話の電子部品等として積層セラミックコンデンサ(MLCC:MultiLayer Ceramic Capacitor)の大幅な需要が見込まれている。積層セラミックコンデンサは、内部電極層及びセラミック層を有する積層体と、外部電極と、を含む。内部電極層には例えばNi等の金属成分が含まれており、セラミック層は例えばBaTiO3等から形成されている。特許文献1~4には、内部電極層に主として用いられているNiを回収する方法が開示されているとともに、Niを回収する過程でセラミック層に含まれるBaTiO3を分離していることが開示されている。 A large demand is expected for multilayer ceramic capacitors (MLCCs) as electronic components mounted on automobiles, electronic components for mobile phones, etc. A multilayer ceramic capacitor includes a laminate having an internal electrode layer and a ceramic layer, and an external electrode. The internal electrode layer contains a metal component such as Ni, and the ceramic layer is formed of BaTiO 3 , etc. Patent documents 1 to 4 disclose a method for recovering Ni, which is mainly used in the internal electrode layer, and also disclose that BaTiO 3 contained in the ceramic layer is separated in the process of recovering Ni.
ここで、積層セラミックコンデンサを製造するために用いられる原料には、Niだけでなく、希土類成分も含まれているものがある。特許文献1~4では、Niを回収することは開示されているものの、希土類成分の回収についてまでは開示されていない。しかし、Ni等の金属成分だけでなく、希土類成分も回収できることが望ましい。 Some of the raw materials used to manufacture multilayer ceramic capacitors contain not only Ni but also rare earth components. Patent documents 1 to 4 disclose the recovery of Ni, but do not disclose the recovery of rare earth components. However, it is desirable to be able to recover not only metal components such as Ni, but also rare earth components.
それゆえに、この発明の主たる目的は、積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法を提供することである。 Therefore, the main object of this invention is to provide a method for separating and recovering rare earth and metal components from post-sintering waste of multilayer ceramic capacitors.
この発明にかかる積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法は、
(A)セラミック層及び内部電極層を含む積層体と、最外層として積層体上に配置され内部電極層と接続されている焼付電極層と、を備える積層セラミックコンデンサの焼成後廃棄物であって、セラミック層は複数のセラミック粒子の集合体を有し、複数のセラミック粒子どうしの粒界には希土類成分を含む希土類含有物が含まれており、内部電極層は磁性を有する卑金属である第1の金属成分を含み、焼付電極層は磁性を有さない貴金属である第2の金属成分を含み、セラミック層、内部電極層及び焼付電極層は焼結されている、積層セラミックコンデンサの焼成後廃棄物を準備する工程と、
(B)焼成後廃棄物を微細化することにより、セラミック層が微細化されたセラミック微細化物、希土類含有物、内部電極層が微細化された第1の金属微細化物及び焼付電極層が微細化された第2の金属微細化物を得る工程と、
(C)工程(B)を経た後の焼成後廃棄物を、磁石を用いて、セラミック微細化物及び第1の金属微細化物を含む第1の分離物と、セラミック微細化物、希土類含有物及び第2の金属微細化物を含む第2の分離物と、に分離して回収する工程と、
(D)工程(C)を経た後の第2の分離物を希硫酸及び塩酸を含む群から選ばれる少なくとも1種の酸化力を持たない鉱酸に溶解することにより、第2の分離物中のセラミック微細化物及び第2の金属微細化物を沈殿させるとともに希土類含有物中の希土類成分が溶解した希土類成分含有溶液を生成する工程と、
(E)工程(D)において沈殿している第2の分離物中のセラミック微細化物及び第2の金属微細化物をアンモニア水に溶解することにより、第2の分離物中のセラミック微細化物を沈殿させるとともに第2の金属微細化物に含まれる第2の金属成分が溶解した第2の金属溶液を生成する工程と、
を備える。
The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors according to the present invention comprises the steps of:
(A) preparing sintered waste of a multilayer ceramic capacitor, the multilayer ceramic capacitor comprising a laminate including a ceramic layer and an internal electrode layer, and a fired electrode layer disposed on the laminate as an outermost layer and connected to the internal electrode layer, the ceramic layer having an aggregate of a plurality of ceramic particles, a rare earth-containing material including a rare earth component is contained in grain boundaries between the plurality of ceramic particles, the internal electrode layer includes a first metal component which is a magnetic base metal, the fired electrode layer includes a second metal component which is a non-magnetic precious metal, and the ceramic layer, the internal electrode layer, and the fired electrode layer are sintered;
(B) A step of obtaining a ceramic fine-particle having a fine ceramic layer, a rare earth-containing material, a first metal fine-particle having a fine internal electrode layer, and a second metal fine-particle having a fine baked electrode layer by pulverizing the fired waste material;
(C) a step of separating and recovering the fired waste after the step (B) into a first separated matter containing the ceramic fine particles and the first fine metal particles, and a second separated matter containing the ceramic fine particles, the rare earth-containing matter, and the second fine metal particles, using a magnet;
(D) dissolving the second separated product after the step (C) in at least one mineral acid having no oxidizing power selected from the group consisting of dilute sulfuric acid and hydrochloric acid, thereby precipitating the ceramic fine particles and the second fine particles of the metal in the second separated product and generating a rare earth component-containing solution in which the rare earth component in the rare earth-containing product is dissolved;
(E) dissolving the ceramic fine particles and the second metal fine particles in the second separated product precipitated in the step (D) in ammonia water to precipitate the ceramic fine particles in the second separated product and generate a second metal solution in which the second metal component contained in the second metal fine particles is dissolved;
Equipped with.
この発明によれば、焼成後廃棄物から、希土類成分及び金属成分を分離回収することができる。特に、金属成分としては、内部電極層に含まれる第1の金属成分と、外部電極に含まれる第2の金属成分と、を分離回収することができる。 According to this invention, rare earth components and metal components can be separated and recovered from the post-sintering waste. In particular, as metal components, a first metal component contained in the internal electrode layer and a second metal component contained in the external electrode can be separated and recovered.
この発明にかかる積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法は、
(A)セラミック層及び内部電極層を含む積層体と、積層体上に配置され内部電極層と接続されている焼付電極層と、最外層として焼付電極層上に配置されている1段目めっき層と、を備える積層セラミックコンデンサの焼成後廃棄物であって、セラミック層は複数のセラミック粒子の集合体を有し、複数のセラミック粒子どうしの粒界には希土類成分を含む希土類含有物が含まれており、内部電極層は磁性を有する卑金属である第1の金属成分を含み、焼付電極層は磁性を有さない貴金属である第2の金属成分を含み、1段目めっき層は第1の金属成分を含み、セラミック層、内部電極層及び焼付電極層は焼結されている、積層セラミックコンデンサの焼成後廃棄物を準備する工程と、
(B)焼成後廃棄物を微細化することにより、セラミック層が微細化されたセラミック微細化物、希土類含有物、内部電極層及び1段目めっき層が微細化された第1の金属微細化物及び焼付電極層が微細化された第2の金属微細化物を得る工程と、
(C)工程(B)を経た後の焼成後廃棄物を、磁石を用いて、セラミック微細化物及び第1の金属微細化物を含む第1の分離物と、セラミック微細化物、希土類含有物及び第2の金属微細化物を含む第2の分離物と、に分離して回収する工程と、
(D)工程(C)を経た後の第2の分離物を希硫酸及び塩酸を含む群から選ばれる少なくとも1種の酸化力を持たない鉱酸に溶解することにより、第2の分離物中のセラミック微細化物及び第2の金属微細化物を沈殿させるとともに希土類含有物中の希土類成分が溶解した希土類成分含有溶液を生成する工程と、
(E)工程(D)において沈殿している第2の分離物中のセラミック微細化物及び第2の金属微細化物をアンモニア水に溶解することにより、第2の分離物中のセラミック微細化物を沈殿させるとともに第2の金属微細化物に含まれる第2の金属成分が溶解した第2の金属溶液を生成する工程と、
を備える。
The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors according to the present invention comprises the steps of:
(A) a step of preparing fired waste of a multilayer ceramic capacitor, the fired waste comprising a laminate including a ceramic layer and an internal electrode layer, a fired electrode layer disposed on the laminate and connected to the internal electrode layer, and a first-stage plating layer disposed on the fired electrode layer as an outermost layer, the ceramic layer having an aggregate of a plurality of ceramic particles, rare earth-containing matter containing a rare earth component is contained in grain boundaries between the plurality of ceramic particles, the internal electrode layer contains a first metal component which is a magnetic base metal, the fired electrode layer contains a second metal component which is a non-magnetic precious metal, the first-stage plating layer contains the first metal component, and the ceramic layer, the internal electrode layer, and the fired electrode layer are sintered;
(B) A step of pulverizing the fired waste to obtain a ceramic micro-fine product having a fine ceramic layer, a rare earth-containing material, a first metal micro-fine product having a fine internal electrode layer and a fine first-stage plating layer, and a second metal micro-fine product having a fine baked electrode layer;
(C) a step of separating and recovering the fired waste after the step (B) into a first separated matter containing the ceramic fine particles and the first fine metal particles, and a second separated matter containing the ceramic fine particles, the rare earth-containing matter, and the second fine metal particles, using a magnet;
(D) dissolving the second separated product after the step (C) in at least one mineral acid having no oxidizing power selected from the group consisting of dilute sulfuric acid and hydrochloric acid, thereby precipitating the ceramic fine particles and the second fine particles of the metal in the second separated product and generating a rare earth component-containing solution in which the rare earth component in the rare earth-containing product is dissolved;
(E) dissolving the ceramic fine particles and the second metal fine particles in the second separated product precipitated in the step (D) in ammonia water to precipitate the ceramic fine particles in the second separated product and generate a second metal solution in which the second metal component contained in the second metal fine particles is dissolved;
Equipped with.
この発明によれば、焼成後廃棄物から、希土類成分及び金属成分を分離回収することができる。特に、金属成分としては、内部電極層に含まれる第1の金属成分と、外部電極に含まれる第2の金属成分と、を分離回収することができる。 According to this invention, rare earth components and metal components can be separated and recovered from the post-sintering waste. In particular, as metal components, a first metal component contained in the internal electrode layer and a second metal component contained in the external electrode can be separated and recovered.
この発明にかかる積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法は、
(A)セラミック層及び内部電極層を含む積層体と、積層体上に配置され内部電極層と接続されている焼付電極層と、焼付電極層上に配置されている1段目めっき層と、最外層として1段目めっき層上に配置されている2段目めっき層と、を備える積層セラミックコンデンサの焼成後廃棄物であって、セラミック層は複数のセラミック粒子の集合体を有し、複数のセラミック粒子どうしの粒界には希土類成分を含む希土類含有物が含まれており、内部電極層は磁性を有する卑金属である第1の金属成分を含み、焼付電極層は磁性を有さない貴金属である第2の金属成分を含み、1段目めっき層は第1の金属成分を含み、2段目めっき層は第3の金属成分を含み、セラミック層、内部電極層及び焼付電極層は焼結されている、積層セラミックコンデンサの焼成後廃棄物を準備する工程と、
(K)焼成後廃棄物において1段目めっき層及び2段目めっき層のうち少なくとも2段目めっき層を除去する工程と、
(B)工程(K)を経ることにより少なくとも2段目めっき層が除去された焼成後廃棄物を微細化することにより、セラミック層が微細化されたセラミック微細化物、希土類含有物、内部電極層及び1段目めっき層が微細化された第1の金属微細化物及び焼付電極層が微細化された第2の金属微細化物を得る工程と、
(C)工程(B)を経た後の焼成後廃棄物を、磁石を用いて、セラミック微細化物及び第1の金属微細化物を含む第1の分離物と、セラミック微細化物、希土類含有物及び第2の金属微細化物を含む第2の分離物と、に分離して回収する工程と、
(D)工程(C)を経た後の第2の分離物を希硫酸及び塩酸を含む群から選ばれる少なくとも1種の酸化力を持たない鉱酸に溶解することにより、第2の分離物中のセラミック微細化物及び第2の金属微細化物を沈殿させるとともに希土類含有物中の希土類成分が溶解した希土類成分含有溶液を生成する工程と、
(E)工程(D)において沈殿している第2の分離物中のセラミック微細化物及び第2の金属微細化物をアンモニア水に溶解することにより、第2の分離物中のセラミック微細化物を沈殿させるとともに第2の金属微細化物に含まれる第2の金属成分が溶解した第2の金属溶液を生成する工程と、
を備える。
The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors according to the present invention comprises the steps of:
(A) a step of preparing sintered waste of a multilayer ceramic capacitor, the multilayer ceramic capacitor comprising: a laminate including a ceramic layer and an internal electrode layer; a fired electrode layer disposed on the laminate and connected to the internal electrode layer; a first-stage plating layer disposed on the fired electrode layer; and a second-stage plating layer disposed on the first-stage plating layer as an outermost layer, the ceramic layer having an aggregate of a plurality of ceramic particles, a rare earth-containing material containing a rare earth component is contained in grain boundaries between the plurality of ceramic particles; the internal electrode layer includes a first metal component which is a base metal having magnetism; the fired electrode layer includes a second metal component which is a precious metal having no magnetism; the first-stage plating layer includes the first metal component; the second-stage plating layer includes a third metal component; and the ceramic layer, the internal electrode layer, and the fired electrode layer are sintered;
(K) removing at least the second-stage plating layer from the first-stage plating layer and the second-stage plating layer in the fired waste;
(B) a step of pulverizing the fired waste from which at least the second-stage plating layer has been removed through the step (K) to obtain a ceramic micro-particle having a micro-particle of the ceramic layer, a rare earth-containing material, a first metal micro-particle having a micro-particle of the internal electrode layer and the first-stage plating layer, and a second metal micro-particle having a micro-particle of the baked electrode layer;
(C) a step of separating and recovering the fired waste after the step (B) into a first separated matter containing the ceramic fine particles and the first fine metal particles, and a second separated matter containing the ceramic fine particles, the rare earth-containing material, and the second fine metal particles, using a magnet;
(D) dissolving the second separated product after the step (C) in at least one mineral acid having no oxidizing power selected from the group consisting of dilute sulfuric acid and hydrochloric acid, thereby precipitating the ceramic fine particles and the second fine particles of the metal in the second separated product and generating a rare earth component-containing solution in which the rare earth component in the rare earth-containing product is dissolved;
(E) dissolving the ceramic fine particles and the second metal fine particles in the second separated product precipitated in the step (D) in ammonia water to precipitate the ceramic fine particles in the second separated product and generate a second metal solution in which the second metal component contained in the second metal fine particles is dissolved;
Equipped with.
この発明によれば、焼成後廃棄物から、希土類成分及び金属成分を分離回収することができる。特に、金属成分としては、内部電極層に含まれる第1の金属成分と、外部電極に含まれる第2の金属成分と、を分離回収することができる。 According to this invention, rare earth components and metal components can be separated and recovered from the post-sintering waste. In particular, as metal components, a first metal component contained in the internal electrode layer and a second metal component contained in the external electrode can be separated and recovered.
この発明によれば、積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法を提供することができる。 This invention provides a method for separating and recovering rare earth and metal components from post-sintering waste from multilayer ceramic capacitors.
この発明の上述の目的、その他の目的、特徴及び利点は、図面を参照して行う以下の発明を実施するための形態の説明から一層明らかとなろう。 The above and other objects, features, and advantages of the present invention will become more apparent from the following detailed description of the invention, which refers to the drawings.
<第1の実施の形態>
1.分離回収方法
この発明の第1の実施の形態にかかる、積層セラミックコンデンサの焼成(焼付電極層用の焼成)後廃棄物からの希土類成分及び金属成分(第1の金属成分及び第2の金属成分)の分離回収方法について説明する。
First Embodiment
1. Separation and Recovery Method A method for separating and recovering rare earth components and metal components (first metal components and second metal components) from post-sintering waste of multilayer ceramic capacitors (sintering for fired electrode layers) according to a first embodiment of the present invention will be described.
図1は、この発明の第1の実施の形態に係る、積層セラミックコンデンサの焼成(焼付電極層用の焼成)後廃棄物からの希土類成分及び金属成分の分離回収方法を示すフロー図である。この発明の第1の実施の形態に係る分離回収方法では、分離回収の出発点として積層セラミックコンデンサの焼成(焼付電極層用の焼成)後廃棄物を用いる。焼成後廃棄物について説明する。 FIG. 1 is a flow diagram showing a method for separating and recovering rare earth components and metal components from post-sintering waste (sintering for fired electrode layers) of multilayer ceramic capacitors according to a first embodiment of the present invention. In the separation and recovery method according to the first embodiment of the present invention, post-sintering waste (sintering for fired electrode layers) of multilayer ceramic capacitors is used as the starting point for separation and recovery. The post-sintering waste will now be described.
(1)焼成後廃棄物
焼成後廃棄物を説明する前に、まず積層セラミックコンデンサの製造工程により製造される積層セラミックコンデンサ及びその製造工程について以下に説明する。
(1) Post-Firing Waste Before describing the post-firing waste, a multilayer ceramic capacitor manufactured in a manufacturing process for a multilayer ceramic capacitor and the manufacturing process for the multilayer ceramic capacitor will be described below.
(1-1)積層セラミックコンデンサ
図2は、この発明の第1の実施の形態に係る積層セラミックコンデンサの一例を示す外観斜視図である。図3は、図2の線III-IIIにおける断面図である。ここでは、積層セラミックコンデンサ10の一例として2端子型積層セラミックコンデンサを例に挙げて説明する。
(1-1) Multilayer Ceramic Capacitor Fig. 2 is an external perspective view showing an example of a multilayer ceramic capacitor according to a first embodiment of the present invention. Fig. 3 is a cross-sectional view taken along line III-III in Fig. 2. Here, a two-terminal multilayer ceramic capacitor will be described as an example of the multilayer ceramic capacitor 10.
図2、図3に示すように、積層セラミックコンデンサ10は、例えば直方体状の積層体12と、積層体12の両端部に配置される外部電極30と、を含む。 As shown in Figures 2 and 3, the multilayer ceramic capacitor 10 includes, for example, a rectangular parallelepiped laminate 12 and external electrodes 30 arranged on both ends of the laminate 12.
積層体12は、積層された複数のセラミック層14と、セラミック層14上に積層された複数の内部電極層16とを有する。さらに、積層体12は、高さ方向(積層方向)xに相対する第1の主面12a及び第2の主面12bと、高さ方向xに直交する幅方向yに相対する第1の側面12c及び第2の側面12dと、高さ方向x及び幅方向yに直交する長さ方向zに相対する第1の端面12e及び第2の端面12fとを有する。セラミック層14と内部電極層16は、高さ方向xに積層される。 The laminate 12 has a plurality of stacked ceramic layers 14 and a plurality of internal electrode layers 16 stacked on the ceramic layers 14. Furthermore, the laminate 12 has a first main surface 12a and a second main surface 12b that face each other in a height direction (stacking direction) x, a first side surface 12c and a second side surface 12d that face each other in a width direction y perpendicular to the height direction x, and a first end surface 12e and a second end surface 12f that face each other in a length direction z perpendicular to the height direction x and the width direction y. The ceramic layers 14 and the internal electrode layers 16 are stacked in the height direction x.
第1の内部電極層16a及び第2の内部電極層16bは、たとえば、磁性を有する卑金属を含む導電材料から構成することができ、磁性を有する卑金属は単体金属でも合金でもよい。磁性を有する卑金属としては、例えばNi及びFeを挙げることができる。なお、ここでは、水素と比較してイオン化傾向が高い金属を卑金属というものとする。 The first internal electrode layer 16a and the second internal electrode layer 16b can be made of, for example, a conductive material containing a magnetic base metal, and the magnetic base metal can be a simple metal or an alloy. Examples of magnetic base metals include Ni and Fe. Note that, here, a metal that has a higher ionization tendency than hydrogen is referred to as a base metal.
セラミック層14は、複数のセラミック粒子(後述の図5の各BTであり、セラミック焼結体ともいう)の集合体を有している。各セラミック粒子は、たとえば、セラミック材料として、誘電体材料により形成することができる。このような誘電体材料としては、たとえば、BaTiO3、CaTiO3、SrTiO3、又はCaZrO3などの成分を含むペロブスカイト型化合物を主成分とし、ペロブスカイト構造を備える誘電体セラミックを用いることができる。上記の誘電体材料を主成分として含む場合、所望する積層体12の特性に応じて、希土類成分が添加剤として誘電体材料に添加されている。添加される希土類成分としては、例えば、Dy、Sc、Y、La、Ce、Pr、Nd、Pm、Sm、Eu、Gd、Tb、Ho、Er、Tm、Yb、Luのうち少なくとも1種を挙げることができる。また、上記の誘電体材料には、たとえば、Mn化合物、Fe化合物、Cr化合物、Co化合物、Ni化合物などの、主成分よりも含有量の少ない副成分を添加したものを用いてもよい。また、上記の主成分に、Si、Mg及びBa、Mnのうちの少なくとも一種がさらなる添加剤として加えられてもよい。ただし、これらの副成分及び添加剤が希土類成分の分離回収において希土類成分の品質低下を引き起こす可能性があるため、これらの副成分及び添加剤は省略されてもよい。 The ceramic layer 14 has an aggregate of a plurality of ceramic particles (each BT in FIG. 5 described later, also called a ceramic sintered body). Each ceramic particle can be formed, for example, by a dielectric material as the ceramic material. As such a dielectric material, for example, a dielectric ceramic having a perovskite structure with a perovskite type compound containing a component such as BaTiO 3 , CaTiO 3 , SrTiO 3 , or CaZrO 3 as the main component can be used. When the dielectric material is contained as the main component, a rare earth component is added to the dielectric material as an additive according to the desired characteristics of the laminate 12. As the rare earth component to be added, for example, at least one of Dy, Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Ho, Er, Tm, Yb, and Lu can be mentioned. The above-mentioned dielectric material may be used with the addition of a minor component, such as a Mn compound, an Fe compound, a Cr compound, a Co compound, or a Ni compound, in a content less than that of the main component. At least one of Si, Mg, Ba, and Mn may be added as an additional additive to the above-mentioned main component. However, since these minor components and additives may cause a deterioration in the quality of the rare earth components during the separation and recovery of the rare earth components, these minor components and additives may be omitted.
積層体12の第1の端面12e側及び第2の端面12f側には、図2、図3に示されるように、外部電極30が配置される。 As shown in Figures 2 and 3, external electrodes 30 are arranged on the first end face 12e side and the second end face 12f side of the laminate 12.
外部電極30は、第1の外部電極30a及び第2の外部電極30bを有する。第1の外部電極30aは、第1の内部電極層16aに接続され、少なくとも第1の端面12eの表面に配置されている。第2の外部電極30bは、第2の内部電極層16bに接続され、少なくとも第2の端面12fの表面に配置されている。 The external electrode 30 has a first external electrode 30a and a second external electrode 30b. The first external electrode 30a is connected to the first internal electrode layer 16a and is disposed on at least the surface of the first end face 12e. The second external electrode 30b is connected to the second internal electrode layer 16b and is disposed on at least the surface of the second end face 12f.
外部電極30は、焼付電極層32を含む。第1の外部電極30aは、第1の焼付電極層32aを含む。第2の外部電極30bは、第2の焼付電極層32bを含む。本実施の形態では、焼付電極層32は、積層セラミックコンデンサ10の最外層である。つまり、焼付電極層32は、積層体12上に配置された層のうち最外層である。 The external electrode 30 includes a baked electrode layer 32. The first external electrode 30a includes a first baked electrode layer 32a. The second external electrode 30b includes a second baked electrode layer 32b. In this embodiment, the baked electrode layer 32 is the outermost layer of the multilayer ceramic capacitor 10. In other words, the baked electrode layer 32 is the outermost layer of the layers disposed on the laminate 12.
焼付電極層32は、ガラス成分と磁性を有さない貴金属である第2の金属成分とを含む焼付け層から形成されてもよい。焼付け層の第2の金属成分としては、例えば、Cu、Ag等から選ばれる少なくとも1つを含む。焼付け層のガラス成分としては、例えばB、Si、Ba、Mg、Al、Li等から選ばれる少なくとも1つの元素を含む酸化物を含む。なお、ここでは、水素と比較してイオン化傾向が低い金属を貴金属というものとする。 The baked electrode layer 32 may be formed from a baked layer containing a glass component and a second metal component which is a non-magnetic precious metal. The second metal component of the baked layer includes at least one selected from Cu, Ag, etc. The glass component of the baked layer includes an oxide containing at least one element selected from B, Si, Ba, Mg, Al, Li, etc. Here, a metal that has a lower ionization tendency than hydrogen is referred to as a precious metal.
(1-2)積層セラミックコンデンサの製造方法
次に、積層セラミックコンデンサ10の製造方法について説明する。
(1-2) Method for Manufacturing the Multilayer Ceramic Capacitor Next, a method for manufacturing the multilayer ceramic capacitor 10 will be described.
(工程1)まず、セラミック層用の誘電体シート及び内部電極層用の導電性ペーストが準備される。セラミック層用の誘電体シートは、これに限定されないが、例えばBaTiO3を主成分としており、添加剤としてDyが添加された誘電体スラリーから形成されている。内部電極層用の導電性ペーストは、これに限定されないが、例えばNiを主成分として形成されている。誘電体シート及び内部電極層用の導電性ペーストは、バインダ及び溶剤を含む。バインダ及び溶剤は、樹脂成分を含んで構成されるものであり、樹脂成分としては、例えば、エポキシ樹脂、フェノキシ樹脂、フェノール樹脂、ウレタン樹脂、ポリイミド樹脂などの公知の種々の熱硬化性樹脂を使用することができる。 (Step 1) First, a dielectric sheet for the ceramic layer and a conductive paste for the internal electrode layer are prepared. The dielectric sheet for the ceramic layer is formed from a dielectric slurry containing, but not limited to, BaTiO3 as a main component and Dy as an additive. The conductive paste for the internal electrode layer is formed from, but not limited to, Ni as a main component. The dielectric sheet and the conductive paste for the internal electrode layer include a binder and a solvent. The binder and the solvent are composed of a resin component, and the resin component can be, for example, various known thermosetting resins such as epoxy resin, phenoxy resin, phenol resin, urethane resin, and polyimide resin.
(工程2)そして、誘電体シート上に、内部電極層用の導電性ペーストが、たとえば、スクリーン印刷やグラビア印刷などにより所定のパターンで印刷される。これにより、第1の内部電極層のパターンが形成された誘電体シート、及び第2の内部電極層のパターンが形成された誘電体シートが準備される。 (Step 2) Then, a conductive paste for the internal electrode layers is printed in a predetermined pattern on the dielectric sheet, for example by screen printing or gravure printing. This prepares a dielectric sheet on which the pattern of the first internal electrode layer is formed, and a dielectric sheet on which the pattern of the second internal electrode layer is formed.
また、誘電体シートに関しては、内部電極層のパターンが印刷されていない外層用の誘電体シートも準備される。 In addition, with regard to the dielectric sheets, outer layer dielectric sheets that do not have the internal electrode layer pattern printed on them are also prepared.
内部電極層のパターンが印刷されていない外層用の誘電体シートが所定枚数積層される。その上に、第1の内部電極層のパターンが印刷された誘電体シート、及び第2の内部電極層のパターンが印刷された誘電体シートが順次積層されることにより内層部となる部分が形成される。この内層部となる部分の上に、内部電極層のパターンが印刷されてない外層用の誘電体シートが所定枚数積層される。これにより、内層部及び外層部を有する積層シートが形成される。なお、誘電体シートは未焼成時のセラミック層、つまり積層チップの焼成を経る前のセラミック層という場合がある。内部電極層のパターンは、未焼成時の内部電極層、つまり積層チップの焼成を経る前の内部電極層という場合がある。 A predetermined number of dielectric sheets for the outer layers, on which the pattern of the internal electrode layer is not printed, are stacked. A dielectric sheet on which the pattern of the first internal electrode layer is printed, and a dielectric sheet on which the pattern of the second internal electrode layer is printed are stacked in order on top of the dielectric sheets to form an inner layer portion. A predetermined number of dielectric sheets for the outer layers, on which the pattern of the internal electrode layer is not printed, are stacked on top of the inner layer portion. This forms a laminated sheet having an inner layer portion and an outer layer portion. The dielectric sheets are sometimes referred to as the ceramic layers when unfired, that is, the ceramic layers before the laminated chip is fired. The pattern of the internal electrode layers is sometimes referred to as the internal electrode layers when unfired, that is, the internal electrode layers before the laminated chip is fired.
(工程3)次に、積層シートが静水圧プレスなどの手段により積層方向にプレスされることにより、積層ブロックが作製される。 (Step 3) Next, the laminated sheet is pressed in the stacking direction using a means such as a hydrostatic press to produce a laminated block.
(工程4)そして、積層ブロックが所定のサイズにカットされることにより、積層チップが切り出される。図4は、積層チップにおける、長さ方向及び積層方向を含む面に平行な断面での未焼成時のセラミック層及び未焼成時の内部電極層の状態を示す模式図である。図4では、外部電極30がまだ形成されていない積層チップの断面図が示されている。また、図4の積層チップは、(工程5)の脱脂及び(工程6)の積層チップの焼成を経る前の状態である。ただし、積層チップに含まれる樹脂成分については図示を省略している。図4に示すように、未焼成時の内部電極層16_Uと未焼成時のセラミック層14_Uとが交互に積層されることにより、積層チップが形成されている。 (Step 4) The laminated block is then cut to a predetermined size to cut out the laminated chip. FIG. 4 is a schematic diagram showing the state of the unfired ceramic layers and the unfired internal electrode layers in a cross section parallel to a plane including the length direction and the lamination direction in the laminated chip. FIG. 4 shows a cross section of the laminated chip on which the external electrodes 30 have not yet been formed. The laminated chip in FIG. 4 is in a state prior to degreasing (step 5) and firing of the laminated chip (step 6). However, the resin component contained in the laminated chip is not shown. As shown in FIG. 4, the laminated chip is formed by alternately stacking the unfired internal electrode layers 16_U and the unfired ceramic layers 14_U.
積層チップは、全体として、第1の金属粉末(図4中のNi_P)と、セラミック粉末(図4中のBT1_P、BT2_P)と、希土類粉末(図4中のDy_P)と、樹脂成分と、を含む。第1の金属粉末は主として未焼成時の内部電極層16_Uを構成している。セラミック粉末は主として未焼成時のセラミック層14_Uを構成している。 The laminated chip as a whole contains a first metal powder (Ni_P in FIG. 4), ceramic powders (BT 1 _P, BT 2 _P in FIG. 4), rare earth powder (Dy_P in FIG. 4), and a resin component. The first metal powder mainly constitutes the internal electrode layer 16_U when unsintered. The ceramic powder mainly constitutes the ceramic layer 14_U when unsintered.
第1の金属粉末は、例えば第1の金属成分である第1の金属原子の集合体である。第1の金属粉末としては、前述の通り、磁性を有する卑金属を含む導電材料から構成することができ、磁性を有する卑金属は単体金属でも合金でもよい。磁性を有する卑金属としては、例えばNi及びFeを挙げることができる。 The first metal powder is, for example, an aggregate of first metal atoms, which is the first metal component. As described above, the first metal powder can be made of a conductive material containing a magnetic base metal, and the magnetic base metal can be either an elemental metal or an alloy. Examples of magnetic base metals include Ni and Fe.
セラミック粉末は、誘電体材料の集合体である。誘電体材料としては、前述の通りBaTiO3、CaTiO3、SrTiO3、又はCaZrO3などを挙げることができる。また、セラミック粉末は、第1のセラミック粉末と、第2のセラミック粉末と、を含む。第2のセラミック粉末は第1のセラミック粉末よりも粒径が小さい。 The ceramic powder is an aggregate of dielectric materials. As described above, examples of the dielectric materials include BaTiO 3 , CaTiO 3 , SrTiO 3 , and CaZrO 3 . The ceramic powder includes a first ceramic powder and a second ceramic powder. The second ceramic powder has a smaller particle size than the first ceramic powder.
希土類粉末は、希土類成分である希土類原子の集合体である。希土類原子は、前述の通り、Dy、Sc、Y、La、Ce、Pr、Nd、Pm、Sm、Eu、Gd、Tb、Ho、Er、Tm、Yb、Luのうち少なくとも1種を挙げることができる。 Rare earth powder is an aggregate of rare earth atoms, which are rare earth components. As mentioned above, the rare earth atoms can be at least one of Dy, Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Ho, Er, Tm, Yb, and Lu.
樹脂成分は、誘電体シート及び内部電極層用の導電性ペーストを生成するためのバインダ及び溶剤である。バインダ及び溶剤は、樹脂成分を含んで構成されるものであり、樹脂成分としては、例えば、エポキシ樹脂、フェノキシ樹脂、フェノール樹脂、ウレタン樹脂、ポリイミド樹脂などの公知の種々の熱硬化性樹脂を使用することができる。 The resin components are binders and solvents for producing conductive pastes for the dielectric sheets and internal electrode layers. The binders and solvents are composed of resin components, and various known thermosetting resins such as epoxy resins, phenoxy resins, phenolic resins, urethane resins, and polyimide resins can be used as the resin components.
図4を用いて積層チップにおける粉末の状態についてさらに説明する。図4の模式図には、(工程5)の脱脂及び(工程6)の積層チップの焼成を経る前の積層チップに含まれる各種粉末の状態が表されている。なお、図4では樹脂成分の図示を省略している。図4に示すように、本実施の形態では、未焼成時のセラミック層14_Uは第1のセラミック粉末(図4中のBT1_P)を主として含んで構成されている。そして、未焼成時のセラミック層14_Uでは、第1のセラミック粉末と希土類粉末(図4中のDy_P)とが少なくとも部分的に互いに付着し合っている。図4の例に示すように、第1のセラミック粉末の表面に希土類粉末が主として付着した状態となっており、基本的には第1のセラミック粉末の内部に希土類粉末が入り込んで化学的に結合した状態ではない。また、本実施の形態では、未焼成時の内部電極層16_Uは第1の金属粉末(図4中のNi_P)を主として含んで構成されている。そして、未焼成時の内部電極層16_Uでは、第1の金属粉末と第2のセラミック粉末(図4中のBT2_P)とが少なくとも部分的に互いに付着し合っている。図4の例に示すように、第1の金属粉末の表面に第2のセラミック粉末が主として付着した状態となっており、基本的には第1の金属粉末の内部に第2のセラミック粉末が入り込んで化学的に結合した状態ではない。付着しているの意味には、第1の金属粉末、セラミック粉末及び希土類粉末等の粉末どうしの一部が化学的に結合していることが含まれていてもよい。なお、化学的な結合とは、イオン結合、共有結合、金属結合など、複数の原子どうしが正の電荷及び負の電荷により互いに引き付けられて結びついている結合である。 The state of the powder in the laminated chip will be further explained using FIG. 4. The schematic diagram of FIG. 4 shows the state of various powders contained in the laminated chip before the degreasing in (step 5) and the firing of the laminated chip in (step 6). In FIG. 4, the resin component is omitted. As shown in FIG. 4, in this embodiment, the ceramic layer 14_U when unfired is mainly composed of the first ceramic powder (BT 1 _P in FIG. 4). In the ceramic layer 14_U when unfired, the first ceramic powder and the rare earth powder (Dy_P in FIG. 4) are at least partially attached to each other. As shown in the example of FIG. 4, the rare earth powder is mainly attached to the surface of the first ceramic powder, and basically, the rare earth powder does not penetrate into the inside of the first ceramic powder and is not chemically bonded. In this embodiment, the internal electrode layer 16_U when unfired is mainly composed of the first metal powder (Ni_P in FIG. 4). In the unfired internal electrode layer 16_U, the first metal powder and the second ceramic powder (BT 2 _P in FIG. 4) are at least partially attached to each other. As shown in the example of FIG. 4, the second ceramic powder is mainly attached to the surface of the first metal powder, and the second ceramic powder is not basically chemically bonded to the inside of the first metal powder. The meaning of "attached" may include that the powders such as the first metal powder, the ceramic powder, and the rare earth powder are partially chemically bonded to each other. The chemical bond is a bond in which a plurality of atoms are attracted to each other by positive and negative charges, such as an ionic bond, a covalent bond, or a metallic bond.
(工程5)
次に、積層チップ中の樹脂成分を除去する。以下、工程5での樹脂成分の除去は製造工程上の脱脂である。工程5の脱脂における脱脂温度は、例えば、800℃より高く1000℃以下である。
(Step 5)
Next, the resin components in the laminated chip are removed. Hereinafter, the removal of the resin components in step 5 is a degreasing step in the manufacturing process. The degreasing temperature in the degreasing step 5 is, for example, higher than 800° C. and equal to or lower than 1000° C.
(工程6)次に、積層チップが焼成されることにより、積層体12が作製される。積層チップの焼成温度は、誘電体であるセラミック層や内部電極層の材料にもよるが、例えば、1000℃より高く1400℃以下であることが好ましい。工程1~工程6が積層体形成工程である。なお、工程6における焼成を積層チップの焼成という場合がある。この焼成により未焼成時の積層チップは積層体12となる。また、未焼成時の内部電極層16_U及び未焼成時のセラミック層14_Uが焼成され、内部電極層16及びセラミック層14となる。 (Step 6) Next, the laminated chip is fired to produce the laminate 12. The firing temperature for the laminated chip depends on the materials of the ceramic layers and internal electrode layers, which are dielectrics, but is preferably higher than 1000°C and lower than 1400°C, for example. Steps 1 to 6 are the laminate formation process. Note that the firing in step 6 is sometimes called firing the laminated chip. This firing turns the unfired laminated chip into the laminate 12. Furthermore, the unfired internal electrode layer 16_U and the unfired ceramic layer 14_U are fired to become the internal electrode layer 16 and the ceramic layer 14.
(工程7)次に、複数の第2の金属粉末(例えばCu粉末)を含む焼付電極層用ペーストが積層体12の第1、第2の端面12e、12fに塗布されて焼成されることにより、外部電極30である焼付電極層32が形成される。第2の金属粉末は、例えば第2の金属成分である第2の金属原子の集合体である。焼付電極層用ペースト中の各第2の金属粉末は、焼付電極層用ペースト中において単独で分散しているか、また、他の第2金属粉末を含む他の粉末と互いに付着し合って分散している。つまり、焼付電極層用ペースト中においては、各第2の金属粉末は他の第2の金属粉末又は他の添加物等の粉末と化学的に結合していない。そして、焼付電極層用ペーストが焼成されることにより、第2の金属粉末等が焼結状態となる。焼付電極層用ペーストの焼成温度は、700℃以上900℃以下であることが好ましい。なお、工程7における焼成を焼付電極層用の焼成という場合がある。 (Step 7) Next, a baked electrode layer paste containing a plurality of second metal powders (e.g., Cu powder) is applied to the first and second end faces 12e, 12f of the laminate 12 and fired to form a baked electrode layer 32, which is an external electrode 30. The second metal powder is, for example, an aggregate of second metal atoms, which is a second metal component. Each second metal powder in the baked electrode layer paste is dispersed alone in the baked electrode layer paste, or is dispersed by adhering to other powders including other second metal powders. In other words, in the baked electrode layer paste, each second metal powder is not chemically bonded to other second metal powders or powders such as other additives. Then, the baked electrode layer paste is fired, so that the second metal powders are in a sintered state. The firing temperature of the baked electrode layer paste is preferably 700°C or higher and 900°C or lower. The firing in step 7 may be referred to as firing for the baked electrode layer.
次に、(工程7)の焼付電極層用の焼成を経た後の積層セラミックコンデンサ10の各層の状態について説明する。図5は、図3のα部分の拡大図であり、焼付電極層用の焼成後の各層の状態を示す模式図である。図6は、図5のセラミック層の部分拡大図である。焼付電極層用の焼成を経た後の積層セラミックコンデンサ10は、セラミック層14、内部電極層16及び外部電極30等の各部が焼結した状態となっている。 Next, the state of each layer of the multilayer ceramic capacitor 10 after firing for the fired electrode layers in (step 7) will be described. Figure 5 is an enlarged view of the α portion of Figure 3, and is a schematic diagram showing the state of each layer after firing for the fired electrode layers. Figure 6 is a partial enlarged view of the ceramic layers in Figure 5. After firing for the fired electrode layers, the multilayer ceramic capacitor 10 is in a sintered state with each part, such as the ceramic layer 14, the internal electrode layer 16, and the external electrode 30.
セラミック層14において、セラミック粉末(図4中のBT1_P、BT2_P)が焼成を経ることにより、図5に示すように焼結した状態であるセラミック粒子BT(図5中のBT)となっている。なお、セラミック粉末(図4中のBT1_P、BT2_P)が例えば(工程6)の積層チップの焼成を経ることにより、焼成されたセラミック粒子BTが形成される。焼結した状態であるセラミック粒子BTをセラミック焼結体BTという場合もある。例えば、セラミック粉末は、焼成されることによりセラミック粉末間の接触が点接触から面接触に発展する。これにより、セラミック粉末間の化学的な結合が進行して一体化したセラミック粒子BT(セラミック焼結体BT)が形成される。セラミック粒子BTは、セラミック粉末が部分的に希土類粉末と化学的に結合して形成されている場合もある。図5の例では、セラミック層14は複数のセラミック粒子BTの集合体を含む。なお、第1のセラミック粉末(図4中のBT1_P)の大部分は、例えば(工程6)の積層チップの焼成を経ることによりセラミック層14を形成する。また、第1の金属粉末(図4中のNi_P)に付着している第2のセラミック粉末(図4中のBT1_P)の大部分は、例えば(工程6)の積層チップの焼成を経ることによりセラミック層14を形成する。このとき、第2のセラミック粉末(図4中のBT1_P)の大部分は、焼成された内部電極層16とは基本的には結合せず焼成された内部電極層16から押し出され、第1のセラミック粉末とともに焼成されてセラミック層14を形成する。 In the ceramic layer 14, the ceramic powder (BT 1 _P, BT 2 _P in FIG. 4 ) is fired to become ceramic particles BT (BT in FIG. 5 ) in a sintered state as shown in FIG. 5 . The ceramic powder (BT 1 _P, BT 2 _P in FIG. 4 ) is fired, for example, in the stacked chip (step 6 ), to form the fired ceramic particles BT. The ceramic particles BT in a sintered state may be called a ceramic sintered body BT. For example, the ceramic powder is fired to develop the contact between the ceramic particles from point contact to surface contact. This causes the chemical bonding between the ceramic powders to progress, forming integrated ceramic particles BT (ceramic sintered body BT). The ceramic particles BT may be formed by partially chemically bonding the ceramic powder with the rare earth powder. In the example of FIG. 5 , the ceramic layer 14 includes an aggregate of a plurality of ceramic particles BT. Most of the first ceramic powder (BT 1 _P in FIG. 4 ) forms the ceramic layer 14, for example, by firing the laminated chip in (step 6). Most of the second ceramic powder (BT 1 _P in FIG. 4 ) adhering to the first metal powder (Ni_P in FIG. 4 ) forms the ceramic layer 14, for example, by firing the laminated chip in (step 6). At this time, most of the second ceramic powder (BT 1 _P in FIG. 4 ) is pushed out from the fired internal electrode layer 16 without basically bonding with the fired internal electrode layer 16, and is fired together with the first ceramic powder to form the ceramic layer 14.
セラミック層14についてさらに説明すると、各セラミック粒子BTは図6に示すコアシェル40により形成されている。コアシェル40は、コアシェル40の中央部を含むコア部42と、コア部42の表面を覆うシェル部44と、を有する。コア部42は主としてセラミック材料から形成されている。シェル部44は、セラミック材料に例えば添加剤である希土類成分等が取り込まれることにより形成されている。シェル部44には、その他、Mn化合物などの副成分が取り込まれていてもよい。セラミック粒子BTどうしの境界には粒界50が存在している。粒界50には希土類含有物が含まれている。希土類含有物には、希土類成分が例えば酸化物の形態となって含まれている。希土類成分の酸化物としては例えば酸化ジスプロシウム(Dy2O3)が挙げられる。希土類含有物には、その他、例えば二酸化ケイ素(SiO2)、二酸化マンガン(MnO2)等が含まれていてもよい。なお、上記では各セラミック粒子BTがコアシェル構造を有する点について説明した。しかし、各セラミック粒子BTは、希土類成分等がセラミック粒子BTの中央部まで取り込まれているような構造となっていてもよい。また、そのような構造のセラミック粒子BTとコアシェル構造のセラミック粒子BTとがセラミック層14内に混在していてもよい。 Further explaining the ceramic layer 14, each ceramic particle BT is formed by a core shell 40 shown in FIG. 6. The core shell 40 has a core portion 42 including a central portion of the core shell 40, and a shell portion 44 covering the surface of the core portion 42. The core portion 42 is mainly formed of a ceramic material. The shell portion 44 is formed by incorporating, for example, a rare earth component, which is an additive, into the ceramic material. The shell portion 44 may also incorporate other subcomponents such as Mn compounds. A grain boundary 50 exists at the boundary between the ceramic particles BT. The grain boundary 50 contains a rare earth inclusion. The rare earth inclusion contains the rare earth component in the form of, for example, an oxide. An example of the oxide of the rare earth component is dysprosium oxide (Dy 2 O 3 ). The rare earth inclusion may also contain, for example, silicon dioxide (SiO 2 ), manganese dioxide (MnO 2 ), etc. In the above, it has been described that each ceramic particle BT has a core-shell structure. However, each ceramic particle BT may have a structure in which the rare earth component or the like is incorporated up to the center of the ceramic particle BT. Moreover, ceramic particles BT having such a structure and ceramic particles BT having a core-shell structure may be mixed in the ceramic layer 14.
内部電極層16は、第1の金属粉末(図4中のNi_P)が焼成を経ることにより、図5に示すように焼結した状態である第1の金属粒子(図5中のNi)となっている。なお、第1の金属粉末(図4中のNi_P)は、例えば(工程6)の積層チップの焼成を経ることにより、焼成された内部電極層16を形成する。図5においては、第1の金属粉末であるNi粉末が焼結してNi粒子(第1の金属粒子)となっている。焼結した状態である第1の金属粒子を第1の金属焼結体という場合もある。例えば、第1の金属粉末は、焼成により加熱されることにより第1の金属粉末間の接触が点接触から面接触に発展する。これにより、第1の金属粉末間の結合が進行して一体化した第1の金属粒子(第1の金属焼結体)が形成される。図5の例では、内部電極層16は複数の第1の金属粒子の集合体を含む。 The internal electrode layer 16 is formed by firing the first metal powder (Ni_P in FIG. 4) to form the first metal particles (Ni in FIG. 5) in a sintered state as shown in FIG. 5. The first metal powder (Ni_P in FIG. 4) forms the fired internal electrode layer 16, for example, by firing the stacked chip in (step 6). In FIG. 5, the Ni powder, which is the first metal powder, is sintered to form Ni particles (first metal particles). The first metal particles in a sintered state may also be called a first metal sintered body. For example, the first metal powder is heated by firing, and the contact between the first metal powder particles develops from point contact to surface contact. As a result, the bonding between the first metal powder particles progresses to form integrated first metal particles (first metal sintered body). In the example of FIG. 5, the internal electrode layer 16 includes an aggregate of multiple first metal particles.
焼付電極層32(外部電極30)は、第2の金属粉末(例えばCu粉末)が焼付電極層用の焼成を経ることにより、図5に示すように焼結した状態である第2の金属粒子(図5中のCu)となっている。図5においては、第2の金属粉末であるCu粉末が焼結してCu粒子(第2の金属粒子)となっている。焼結した状態である第2の金属粒子を第2の金属焼結体という場合もある。例えば、第2の金属粉末は、焼付電極層用の焼成により加熱されることにより第2の金属粉末間の接触が点接触から面接触に発展する。これにより、第2の金属粉末間の結合が進行して一体化した第2の金属粒子(第2の金属焼結体)が形成される。図5の例では、焼付電極層32は複数の第2の金属粒子の集合体を含む。 The baked electrode layer 32 (external electrode 30) is formed by firing the second metal powder (e.g., Cu powder) for the baked electrode layer, and is turned into second metal particles (Cu in FIG. 5) in a sintered state as shown in FIG. 5. In FIG. 5, the Cu powder, which is the second metal powder, is sintered into Cu particles (second metal particles). The second metal particles in a sintered state may be called a second metal sintered body. For example, the second metal powder is heated by firing for the baked electrode layer, and the contact between the second metal powder develops from point contact to surface contact. As a result, the bonding between the second metal powder progresses to form integrated second metal particles (second metal sintered body). In the example of FIG. 5, the baked electrode layer 32 includes an aggregate of multiple second metal particles.
上述の製造工程により、積層セラミックコンデンサ10が製造される。 The multilayer ceramic capacitor 10 is manufactured through the above-mentioned manufacturing process.
ここで、本実施の形態における焼成後廃棄物は、上記の積層セラミックコンデンサ10の製造方法により積層セラミックコンデンサ10が製造される場合には、(工程7)の焼付電極層用の焼成を経た後の廃棄物である。 In this embodiment, the post-firing waste is waste after the firing for the fired electrode layer in (step 7) when the multilayer ceramic capacitor 10 is manufactured by the manufacturing method for the multilayer ceramic capacitor 10 described above.
(2)分離回収方法のフロー
図1を参照してこの発明の第1の実施の形態に係る分離回収方法のフローについて説明する。図1の分離回収方法は、共通の分離回収ルートと、希土類成分の分離回収ルートと、第1の金属成分の分離回収ルートと、第2の金属成分の分離回収ルートと、を含む。希土類成分の分離回収ルート及び第1の金属成分の分離回収ルートは、共通の分離回収ルートから分岐する。第2の金属成分の分離回収ルートは、希土類成分の分離回収ルートから分岐する。
(2) Flow of the separation and recovery method The flow of the separation and recovery method according to the first embodiment of the present invention will be described with reference to Fig. 1. The separation and recovery method in Fig. 1 includes a common separation and recovery route, a rare earth component separation and recovery route, a first metal component separation and recovery route, and a second metal component separation and recovery route. The rare earth component separation and recovery route and the first metal component separation and recovery route branch off from the common separation and recovery route. The second metal component separation and recovery route branches off from the rare earth component separation and recovery route.
共通の分離回収ルートは、例えば、工程(A)の焼成後廃棄物の準備と、工程(B)の微細化と、工程(C)の磁性分離と、を含む。工程(C)の磁性分離の後、希土類成分の分離回収ルートと第1の金属成分の分離回収ルートとに分岐する。希土類成分の分離回収ルートは、例えば、工程(D)の第2の分離物の溶解を含み、さらに工程(F)のろ過と、工程(G)の中和と、を含むことができる。また、工程(F)のろ過の後、第2の金属成分の分離回収ルートが希土類成分の分離回収ルートから分岐する。第2の金属成分の分離回収ルートは、例えば、工程(E)の未溶解物の溶解を含み、さらに工程(H)のろ過を含むことができる。第1の金属成分の分離回収ルートは、例えば、工程(I)の第1の分離物の溶解を含み、さらに工程(J)のろ過を含むことができる。 The common separation and recovery route includes, for example, preparation of post-calcination waste in step (A), pulverization in step (B), and magnetic separation in step (C). After magnetic separation in step (C), the process branches into a rare earth component separation and recovery route and a first metal component separation and recovery route. The rare earth component separation and recovery route can include, for example, dissolution of the second separated material in step (D), and can further include filtration in step (F), and neutralization in step (G). After filtration in step (F), the second metal component separation and recovery route branches off from the rare earth component separation and recovery route. The second metal component separation and recovery route can include, for example, dissolution of the undissolved material in step (E), and can further include filtration in step (H). The first metal component separation and recovery route can include, for example, dissolution of the first separated material in step (I), and can further include filtration in step (J).
(工程(A):焼成後廃棄物の準備)
工程(A)では、積層セラミックコンデンサの焼成(焼付電極層用の焼成)後廃棄物を準備する。焼成後廃棄物は前述した通りである。焼成後廃棄物は、セラミック層14及び内部電極層16を含む積層体12と、焼付電極層32と、を含む。セラミック層14、内部電極層16及び焼付電極層32は焼結状態である。
(Step (A): Preparation of post-firing waste)
In step (A), post-sintering waste of a multilayer ceramic capacitor (sintering for sintered electrode layers) is prepared. The post-sintering waste is as described above. The post-sintering waste includes a laminate 12 including ceramic layers 14 and internal electrode layers 16, and a sintered electrode layer 32. The ceramic layers 14, the internal electrode layers 16, and the sintered electrode layer 32 are in a sintered state.
(工程(B):微細化)
工程(B)では、焼成後廃棄物を微細化する。例えば、これに限定されないが、焼成後廃棄物を粉砕することにより微細化する。粉砕は、これに限定されないが、例えば振動ミル等を用いて対象物に振動による粉砕力を与える方法、対象物をすり潰す方法、対象物に打撃による粉砕力を与える方法等により行われる。後述の工程(C)の磁性分離において分離し易い程度に焼成後廃棄物を微細化することが好ましい。焼成後廃棄物が微細化されることにより、焼結状態のセラミック層14が微細化されたセラミック微細化物と、焼結状態の希土類含有物と、焼結状態の内部電極層16が微細化された第1の金属微細化物と、焼結状態の焼付電極層32が微細化された第2の金属微細化物と、を得ることができる。セラミック微細化物は、たとえば、BaTiO3、CaTiO3、SrTiO3、又はCaZrO3などのセラミック材料を含む。希土類含有物は、例えば酸化ジスプロシウム(Dy2O3)を含み、その他例えば二酸化ケイ素(SiO2)、二酸化マンガン(MnO2)等を含むことができる。第1の金属微細化物は、たとえば、例えばNi及びFeなどの第1の金属成分を含む。第2の金属微細化物は、たとえば、例えばCuなどの第2の金属成分を含む。微細化された後の焼成後廃棄物の平均粒径は限定されない。平均粒径は、例えばふるいを用いて求めることができる。
(Process (B): Refinement)
In step (B), the fired waste is pulverized. For example, but not limited to, the fired waste is pulverized by crushing. The pulverization is performed, but not limited to, for example, by a method of applying a pulverizing force by vibration to the object using a vibration mill or the like, a method of grinding the object, a method of applying a pulverizing force by impact to the object, and the like. It is preferable to pulverize the fired waste to an extent that it is easy to separate in the magnetic separation in step (C) described later. By pulverizing the fired waste, it is possible to obtain a ceramic pulverized product in which the sintered ceramic layer 14 is pulverized, a rare earth-containing material in the sintered state, a first metal pulverized product in which the sintered internal electrode layer 16 is pulverized, and a second metal pulverized product in which the sintered baked electrode layer 32 is pulverized. The ceramic pulverized product includes, for example, a ceramic material such as BaTiO 3 , CaTiO 3 , SrTiO 3 , or CaZrO 3 . The rare earth-containing material may include, for example, dysprosium oxide ( Dy2O3 ), and may also include, for example, silicon dioxide ( SiO2 ), manganese dioxide ( MnO2 ), etc. The first finely divided metal material may include, for example, a first metal component such as Ni and Fe. The second finely divided metal material may include, for example, a second metal component such as Cu. The average particle size of the post-calcination waste after being finely divided is not limited. The average particle size may be determined, for example, by using a sieve.
(工程(C):磁性分離)
工程(C)の磁性分離では、工程(B)において微細化された後の焼成後廃棄物を、磁石を用いて磁性分離する。つまり、磁性分離により、焼成後廃棄物を第1の分離物と第2の分離物とに分離して回収する。
(Step (C): Magnetic separation)
In the magnetic separation of step (C), the post-calcination waste after being pulverized in step (B) is magnetically separated using a magnet. That is, the post-calcination waste is separated into a first separated matter and a second separated matter by magnetic separation and recovered.
第1の分離物は、第1の金属微細化物(図1中のNi)とセラミック微細化物(図1中のBT)とを含む。第1の金属微細化物は、磁性を有する卑金属である第1の金属成分を含む。一方、セラミック微細化物は磁性を有さない。磁性分離により、第1の分離物は磁着物として分離される。具体的には、第1の分離物においては、磁性を有する第1の金属微細化物が磁着物として分離される際に、この第1の金属微細化物に磁性を有さないセラミック微細化物が巻き込まれた状態となっている。 The first separated material contains a first metal microparticle (Ni in FIG. 1) and a ceramic microparticle (BT in FIG. 1). The first metal microparticle contains a first metal component, which is a magnetic base metal. On the other hand, the ceramic microparticle does not have magnetic properties. The first separated material is separated as a magnetic material by magnetic separation. Specifically, in the first separated material, when the magnetic first metal microparticle is separated as a magnetic material, the non-magnetic ceramic microparticle is entangled with this first metal microparticle.
第2の分離物は、第2の金属微細化物(図1中のCu)と希土類含有物(図1中のDy2O3)とセラミック微細化物(図1中のBT)とを含む。第2の金属微細化物は、磁性を有さない貴金属である第2の金属成分を含む。また、希土類含有物及びセラミック微細化物は磁性を有さない。よって、磁性分離により、第2の金属微細化物、希土類含有物及びセラミック微細化物は非磁着物として分離される。 The second separated material includes a second metal fine particle (Cu in FIG. 1), a rare earth-containing material ( Dy2O3 in FIG. 1), and a ceramic fine particle (BT in FIG. 1). The second metal fine particle includes a second metal component that is a noble metal having no magnetism. Furthermore, the rare earth-containing material and the ceramic fine particle have no magnetism. Therefore, the second metal fine particle, the rare earth-containing material, and the ceramic fine particle are separated as non-magnetic materials by magnetic separation.
よって、この磁性分離により、焼成後廃棄物から第2の分離物が除去されているとともに、第1の金属微細化物を含む第1の分離物を第1の金属成分として分離回収することができる。例えば、第1の金属微細化物は、内部電極層16を構成する焼結状態のNi(第1の金属成分)等が微細化されたものである。なお、本発明では、第1の金属成分の分離回収には、第1の金属成分そのものを分離回収することだけでなく、第1の金属微細化物を含む第1の分離物を第1の金属成分として分離回収することが含まれる。 Therefore, by this magnetic separation, the second separated material is removed from the post-sintering waste, and the first separated material containing the first metal fine particles can be separated and recovered as the first metal component. For example, the first metal fine particles are fine particles of sintered Ni (first metal component) that constitutes the internal electrode layer 16. Note that in the present invention, the separation and recovery of the first metal component includes not only the separation and recovery of the first metal component itself, but also the separation and recovery of the first separated material containing the first metal fine particles as the first metal component.
なお、第1の金属成分には、第1の金属原子そのもの、第1の金属原子が他の原子等と化学的に反応した反応物である第1の金属成分化合物、第1の金属原子の溶液、第1の金属成分化合物の溶液等が含まれる。また、第1の金属成分の状態は、液体状態、固体状態、液体及び固体の混合状態のいずれであってもよい。また、第1の金属成分は、非晶質の状態、結晶質の状態、非晶質及び結晶質が混在した状態のいずれであってもよい。 The first metal component includes the first metal atom itself, a first metal component compound which is a reaction product of the first metal atom chemically reacting with other atoms, a solution of the first metal atom, a solution of the first metal component compound, and the like. The state of the first metal component may be any of a liquid state, a solid state, and a mixed state of liquid and solid. The first metal component may be any of an amorphous state, a crystalline state, and a mixed state of amorphous and crystalline.
また言い換えれば、この磁性分離により、焼成後廃棄物から第1の分離物が除去された第2の金属微細化物及び希土類含有物を分離回収することができる。 In other words, this magnetic separation makes it possible to separate and recover the second metal fine particles and rare earth-containing material from the post-sintering waste after removing the first separated material.
なお、磁性分離の際に、工程(B)において微細化された後の焼成後廃棄物を水等の水系溶媒と混合して分散することにより混合状態とした後、磁石を用いて分離することが好ましい。 In addition, during magnetic separation, it is preferable to mix and disperse the post-calcination waste after it has been pulverized in step (B) with an aqueous solvent such as water to create a mixed state, and then separate it using a magnet.
微細化された後の焼成後廃棄物を水系溶媒と混合して混合状態、つまりスラリー状態とすると、微細化された後の焼成後廃棄物に含まれるセラミック微細化物、希土類含有物、第1の金属微細化物及び第2の金属微細化物を分散した状態とすることができる。よって、工程(C)において、第1の分離物と第2の分離物とを磁石を用いて分離し易い。微細化された後の焼成後廃棄物が乾燥した状態であると、第1の分離物と第2の分離物とは、スラリー状態の場合よりも分散状態が低い傾向にある。よって、例えば、第1の分離物が磁石に引き付けられる際に第2の分離物が第1の分離物に巻き込まれて磁石に引き付けられ、第1の分離物と第2の分離物との分離が困難な場合がある。 When the finely divided calcined waste is mixed with an aqueous solvent to form a mixed state, i.e., a slurry state, the ceramic fine particles, rare earth-containing material, first metal fine particles, and second metal fine particles contained in the finely divided calcined waste can be dispersed. Therefore, in step (C), the first separated material and the second separated material can be easily separated using a magnet. When the finely divided calcined waste is in a dry state, the first separated material and the second separated material tend to be less dispersed than when in a slurry state. Therefore, for example, when the first separated material is attracted to a magnet, the second separated material is caught in the first separated material and attracted to the magnet, making it difficult to separate the first separated material and the second separated material.
(工程(D):第2の分離物の溶解)
工程(D)では、工程(C)において分離回収された第2の分離物を酸化力を持たない鉱酸に溶解する。これにより、第2の分離物に含まれる希土類含有物中の希土類成分が溶解した希土類成分含有溶液を生成することができる。よって、希土類成分含有溶液を希土類成分として分離回収することができる。このとき、第2の分離物中のセラミック微細化物及び第2の金属微細化物は沈殿している。セラミック微細化物は酸化力を持たない鉱酸と反応することにより未溶解物となり沈殿する。また、Cu等の第2の金属微細化物は、酸化力を持たない鉱酸に含まれる水素イオンよりもイオン化傾向が小さいため酸化力を持たない鉱酸には溶解しない。酸化力を持たない鉱酸は、例えば、希硫酸及び塩酸を含む群から選ばれる少なくとも1種である。
(Step (D): Dissolution of the second separated product)
In step (D), the second separated product separated and recovered in step (C) is dissolved in a mineral acid having no oxidizing power. This allows a rare earth component-containing solution to be generated in which the rare earth components in the rare earth-containing material contained in the second separated product are dissolved. Thus, the rare earth component-containing solution can be separated and recovered as a rare earth component. At this time, the ceramic fine particles and the second metal fine particles in the second separated product are precipitated. The ceramic fine particles react with the mineral acid having no oxidizing power to become undissolved and precipitate. In addition, the second metal fine particles such as Cu have a smaller ionization tendency than the hydrogen ions contained in the mineral acid having no oxidizing power, and therefore do not dissolve in the mineral acid having no oxidizing power. The mineral acid having no oxidizing power is, for example, at least one selected from the group including dilute sulfuric acid and hydrochloric acid.
なお、上記の通り希土類成分は希土類成分含有溶液として分離回収される。本発明では、希土類成分の分離回収には、希土類成分そのものを分離回収することだけでなく、希土類成分含有溶液を希土類成分として分離回収することが含まれる。つまり、希土類成分には、希土類原子そのもの、希土類原子が他の原子等と化学的に反応した反応物である希土類成分化合物、希土類原子の溶液、希土類成分化合物の溶液等が含まれる。また、希土類成分の状態は、液体状態、固体状態、液体及び固体の混合状態のいずれであってもよい。また、希土類成分は、非晶質の状態、結晶質の状態、非晶質及び結晶質が混在した状態のいずれであってもよい。 As described above, the rare earth components are separated and recovered as a rare earth component-containing solution. In the present invention, the separation and recovery of rare earth components includes not only the separation and recovery of the rare earth components themselves, but also the separation and recovery of the rare earth component-containing solution as rare earth components. In other words, the rare earth components include rare earth atoms themselves, rare earth component compounds which are reaction products in which rare earth atoms have chemically reacted with other atoms, solutions of rare earth atoms, solutions of rare earth component compounds, etc. The state of the rare earth components may be any of a liquid state, a solid state, or a mixed state of liquid and solid. The rare earth components may be any of an amorphous state, a crystalline state, or a mixed state of amorphous and crystalline.
工程(D)において、酸化力を持たない鉱酸の添加により希土類成分含有溶液がpH1.5以上pH2.5以下となるように調整することが好ましい。 In step (D), it is preferable to adjust the pH of the rare earth component-containing solution to 1.5 or more and 2.5 or less by adding a mineral acid that has no oxidizing power.
工程(D)において酸化力を持たない鉱酸を用いて希土類成分含有溶液をpH1.5以上pH2.5以下に調整することにより、主として希土類含有物中の希土類成分を酸化力を持たない鉱酸に溶解することができる。また、pHを上記範囲よりも強酸に調整するとセラミック微細化物等が酸化力を持たない鉱酸に溶解してしまう場合があるため、上記範囲にpHを調整することが好ましい。より好ましくは、希土類成分含有溶液が酸化力を持たない鉱酸の添加によりpH2となるように調整する。 In step (D), by adjusting the rare earth component-containing solution to a pH of 1.5 or more and 2.5 or less using a mineral acid with no oxidizing power, it is possible to dissolve mainly the rare earth components in the rare earth-containing material in the mineral acid with no oxidizing power. Furthermore, if the pH is adjusted to a stronger acid than the above range, ceramic fine particles and the like may dissolve in the mineral acid with no oxidizing power, so it is preferable to adjust the pH to within the above range. More preferably, the rare earth component-containing solution is adjusted to a pH of 2 by adding a mineral acid with no oxidizing power.
なお、工程(C)においてスラリー状態である焼成後廃棄物を磁性分離した場合、分離された第2の分離物は約pH7のスラリー状態である。このスラリーに酸化力を持たない鉱酸を添加することによりpH1.5以上pH2.5以下に調整された希土類成分含有溶液を生成することもできる。ただし、磁性分離後の第2の分離物はスラリー状態である必要はなく、乾燥状態であってもよい。 When the post-calcination waste, which is in a slurry state, is magnetically separated in step (C), the separated second separated material is in a slurry state with a pH of about 7. By adding a mineral acid with no oxidizing power to this slurry, it is also possible to produce a rare earth component-containing solution adjusted to a pH of 1.5 or more and 2.5 or less. However, the second separated material after magnetic separation does not need to be in a slurry state and may be in a dry state.
酸化力を持たない鉱酸としては、第2の分離物に含まれるセラミック微細化物が例えばBaTiO3である場合、希硫酸を用いることが好ましい。希硫酸を用いた場合、BaTiO3であるセラミック微細化物の表面に不溶性のBaSO4が形成されるため、セラミック微細化物を沈殿させることができる。なお、Cu等の第2の金属微細化物は、酸化力を持たない鉱酸に含まれる水素イオンよりもイオン化傾向が小さいため酸化力を持たない鉱酸には溶解しない。一方、希土類粉末は希硫酸に溶解させることができる。具体的に、例えば、Cuの第2の金属微細化物、Dy2O3等の希土類含有物、BaTiO3であるセラミック微細化物を主として含む第2の分離物を希硫酸に溶解すると、BaTiO3が沈殿するとともにCuが溶解しない。一方、希土類含有物中のDyが希硫酸に溶解した硫酸ジスプロシウム(Dy2(SO4)3)溶液が希土類成分含有溶液として生成される。 As the mineral acid having no oxidizing power, when the ceramic fine particles contained in the second separated product are, for example, BaTiO 3 , dilute sulfuric acid is preferably used. When dilute sulfuric acid is used, insoluble BaSO 4 is formed on the surface of the ceramic fine particles, which are BaTiO 3 , so that the ceramic fine particles can be precipitated. In addition, the second metal fine particles, such as Cu, do not dissolve in the mineral acid having no oxidizing power because they have a smaller ionization tendency than the hydrogen ions contained in the mineral acid having no oxidizing power. On the other hand, rare earth powder can be dissolved in dilute sulfuric acid. Specifically, for example, when the second separated product mainly containing the second metal fine particles, the rare earth-containing material such as Dy 2 O 3 , and the ceramic fine particles, which are BaTiO 3, is dissolved in dilute sulfuric acid, BaTiO 3 precipitates and Cu does not dissolve. On the other hand, a dysprosium sulfate (Dy 2 (SO 4 ) 3 ) solution in which Dy in the rare earth-containing material is dissolved in dilute sulfuric acid is generated as a rare earth component-containing solution.
なお、酸化力を持たない鉱酸としては前述の通り希硫酸以外の塩酸等を用いることもできる。ただし、例えば、酸化力を持たない鉱酸として塩酸を用いた場合は、セラミック微細化物あるBaTiO3の表面に溶解性であるBaCl2が形成される。よって、セラミック微細化物を沈殿させ、かつ第2の金属微細化物が溶解しない状態で、希土類含有物を溶解させるように塩酸等のpH調整を精度よく行うことが好ましい。 As described above, hydrochloric acid or the like can be used as the mineral acid having no oxidizing power. However, for example, when hydrochloric acid is used as the mineral acid having no oxidizing power, soluble BaCl 2 is formed on the surface of the ceramic fine particles, BaTiO 3. Therefore, it is preferable to accurately adjust the pH of hydrochloric acid or the like so as to precipitate the ceramic fine particles and dissolve the rare earth-containing material while not dissolving the second metal fine particles.
(工程(F):ろ過)
工程(F)では、工程(D)において生成された、沈殿しているセラミック微細化物及び溶解していない第2の金属微細化物を含む希土類成分含有溶液をろ過することにより、未溶解物であるセラミック微細化物及び第2の金属微細化物と希土類成分含有溶液とを固液分離する。この固液分離により、未溶解物であるセラミック微細化物及び第2の金属微細化物を含む希土類成分含有溶液から、未溶解物であるセラミック微細化物及び第2の金属微細化物が除去された希土類成分含有溶液を希土類成分として分離回収することができる。
(Step (F): Filtration)
In step (F), the rare earth component-containing solution containing the precipitated ceramic fine particles and the undissolved second metal fine particles produced in step (D) is filtered to separate the undissolved ceramic fine particles and the second metal fine particles from the rare earth component-containing solution. This solid-liquid separation allows the rare earth component-containing solution from which the undissolved ceramic fine particles and the second metal fine particles have been removed to be separated and recovered as rare earth components.
例えば、工程(D)において、BaTiO3が沈殿し、Cu等の第2の金属微細化物が溶解していない状態で、希土類成分含有溶液としてDyが希硫酸に溶解した硫酸ジスプロシウム(Dy2(SO4)3)溶液が生成されているとする。この場合、工程(F)のろ過により、BaTiO3及びCu等が除去された硫酸ジスプロシウム溶液を希土類成分として分離回収することができる。 For example, in step (D), BaTiO3 is precipitated, and second metal fine particles such as Cu are not dissolved, and a dysprosium sulfate (Dy2( SO4 ) 3 ) solution in which Dy is dissolved in dilute sulfuric acid is generated as a rare earth component- containing solution. In this case, the dysprosium sulfate solution from which BaTiO3 and Cu have been removed can be separated and recovered as rare earth components by the filtration in step (F).
ろ過は、ろ紙(ろ布)を用いて行うことができる。ろ紙(ろ布)のメッシュの程度は、未溶解物であるセラミック微細化物及び第2の金属微細化物がろ紙(ろ布)を通過しない程度であると好ましい。 Filtration can be performed using filter paper (filter cloth). It is preferable that the mesh size of the filter paper (filter cloth) is such that the undissolved ceramic microparticles and the second metal microparticles do not pass through the filter paper (filter cloth).
工程(D)において生成された、未溶解物であるセラミック微細化物及び第2の金属微細化物を含む希土類成分含有溶液を固液分離できればよく、ろ過による固液分離に限定されず、デカンテーション、遠心分離など、公知の方法から適宜選択することにより固液分離することができる。なお、ろ過がより好ましい。 It is sufficient that the rare earth component-containing solution containing the undissolved ceramic fine particles and the second metal fine particles produced in step (D) can be separated into solid and liquid, and the solid-liquid separation is not limited to filtration, but can be performed by any known method appropriately selected, such as decantation or centrifugation. Filtration is more preferable.
(工程(G):中和)
工程(G)では、工程(F)で得た希土類成分含有溶液を中和することにより、希土類成分を沈殿させて回収する。沈殿した希土類成分は、中和された希土類成分含有溶液を例えばろ過することにより分離回収される。このとき希土類成分は中和により希土類成分化合物(例えばDy(OH)3等)として分離回収される。本発明では、希土類成分の分離回収には、希土類成分そのものを分離回収することだけでなく、希土類成分が化学的に反応した反応物である希土類成分化合物を希土類成分として分離回収することが含まれる。
(Step (G): Neutralization)
In step (G), the rare earth component-containing solution obtained in step (F) is neutralized to precipitate and recover the rare earth component. The precipitated rare earth component is separated and recovered, for example, by filtering the neutralized rare earth component-containing solution. At this time, the rare earth component is separated and recovered as a rare earth component compound (e.g., Dy(OH) 3 , etc.) by neutralization. In the present invention, the separation and recovery of the rare earth component includes not only the separation and recovery of the rare earth component itself, but also the separation and recovery of the rare earth component compound, which is a reaction product of the rare earth component chemically reacted, as the rare earth component.
中和には、アルカリを用いる。アルカリとしては、例えば、水酸化ナトリウム、水酸化カリウムなどを挙げることができる。酸化還元電位が変化すると希土類成分が沈殿するpHの範囲が変化し得るが、アルカリとしてこれらを用いることにより希土類成分が沈殿するpHの範囲を安定にすることができる。 An alkali is used for neutralization. Examples of alkalis include sodium hydroxide and potassium hydroxide. When the redox potential changes, the pH range in which rare earth components precipitate can change, but by using these as alkalis, the pH range in which rare earth components precipitate can be stabilized.
また、工程(G)の中和では、希土類成分含有溶液をpH6以上pH9以下に調整することにより希土類成分を回収する。これにより、中和反応による沈殿物を希土類成分として効率よく分離回収することができる。より好ましくは、希土類成分含有溶液がアルカリの添加によりpH8となるように調整する。 In addition, in the neutralization step (G), the rare earth components are recovered by adjusting the pH of the rare earth component-containing solution to between pH 6 and pH 9. This allows the precipitate resulting from the neutralization reaction to be efficiently separated and recovered as rare earth components. More preferably, the rare earth component-containing solution is adjusted to pH 8 by adding an alkali.
例えば、工程(F)のろ過において、BaTiO3及びCu等が除去された硫酸ジスプロシウム溶液を得ている場合、水酸化ナトリウムによる中和により水酸化ジスプロシウム(Dy(OH)3)が希土類成分化合物として得られる。つまり、硫酸ジスプロシウム溶液が酸性であるため、アルカリにより中和することにより希土類成分であるジスプロシウムを水酸化ジスプロシウム(Dy(OH)3)として沈殿させて分離回収することができる。ここで、硫酸ジスプロシウム溶液をアルカリにより中和した溶液をろ過することにより水酸化ジスプロシウム(Dy(OH)3)を分離回収することができる。ろ過以外にもデカンテーション、遠心分離など、公知の方法を用いることができる。 For example, in the filtration of step (F), when a dysprosium sulfate solution from which BaTiO3 , Cu, etc. have been removed is obtained, dysprosium hydroxide (Dy(OH) 3 ) is obtained as a rare earth component compound by neutralization with sodium hydroxide. That is, since the dysprosium sulfate solution is acidic, the rare earth component dysprosium can be precipitated as dysprosium hydroxide (Dy(OH) 3 ) by neutralizing it with an alkali, and separated and recovered. Here, dysprosium hydroxide (Dy(OH) 3 ) can be separated and recovered by filtering the solution obtained by neutralizing the dysprosium sulfate solution with an alkali. In addition to filtration, known methods such as decantation and centrifugation can be used.
なお、工程(C)の磁性分離で第1の分離物として分離されず、第2の分離物に巻き込まれた状態の金属成分(いわゆるコンタミ)がある。よって、工程(D)の第2の分離物の溶解において生成された希土類成分含有溶液にコンタミである金属成分が含まれる場合がある。この金属成分は、例えばTi、Mn、Ni等である。そして、工程(G)において希土類成分含有溶液にアルカリを加えて例えばpH3以上pH5以下、好ましくは約pH4に調整することにより、Ti及びMn等を分離回収することができる。この場合、Tiは例えばTi(OH)4として沈殿し、Mnは例えばMn(OH)2として沈殿する。よって、約pH4に調整された希土類成分含有溶液をろ過してTi(OH)4及びMn(OH)2等を回収する。 In addition, there are metal components (so-called contaminants) that are not separated as the first separated product in the magnetic separation in step (C) and are caught in the second separated product. Therefore, the rare earth component-containing solution produced in the dissolution of the second separated product in step (D) may contain metal components that are contaminants. These metal components are, for example, Ti, Mn, Ni, etc. Then, in step (G), an alkali is added to the rare earth component-containing solution to adjust the pH to, for example, from 3 to 5, preferably about pH 4, so that Ti, Mn, etc. can be separated and recovered. In this case, Ti precipitates as, for example, Ti(OH) 4 , and Mn precipitates as, for example, Mn(OH) 2. Therefore, the rare earth component-containing solution adjusted to about pH 4 is filtered to recover Ti(OH) 4 , Mn(OH) 2 , etc.
その後、Ti及びMn等が分離された希土類成分含有溶液にさらにアルカリを加えて上記のようにpH6以上pH9以下、好ましくは約pH8に調整することにより、希土類成分を分離回収する。 Then, the rare earth components are separated and recovered by adding an alkali to the solution containing the rare earth components from which Ti, Mn, etc. have been separated and adjusted to a pH of 6 or more and 9 or less, preferably about pH 8, as described above.
その後、Ti及びMn、希土類成分等が分離された溶液にさらにアルカリを加えて例えばpH9を超えてpH11以下、好ましくは約pH10に調整することにより、Ni等を分離回収することができる。この場合、Niは例えばNi(OH)2として沈殿する。約pH10に調整された溶液をろ過してNi(OH)2等を回収する。 Thereafter, Ni and the like can be separated and recovered by adding an alkali to the solution from which Ti, Mn, rare earth components, etc. have been separated, for example, to a pH of more than 9 to a pH of 11 or less, preferably about pH 10. In this case, Ni precipitates as, for example, Ni(OH) 2 . The solution adjusted to about pH 10 is filtered to recover Ni(OH) 2 and the like.
このように段階的な中和及びろ過を繰り返すことにより、希土類成分含有溶液中に含まれる各種成分(コンタミ及び希土類成分等)を分離回収することができる。 By repeating this step-by-step neutralization and filtration process, it is possible to separate and recover the various components (contaminants, rare earth components, etc.) contained in the rare earth component-containing solution.
また、上記のような希土類成分含有溶液の段階的な中和においては、希土類成分を分離する前に希土類成分含有溶液をpH3以上pH5以下、好ましくは約pH4に中和する。よって、希土類成分含有溶液からまずTi及びMn等のコンタミを除去することができる。このように希土類成分含有溶液からTi及びMn等のコンタミが除去されているため、これらのコンタミが除去された状態の希土類成分含有溶液を用いて希土類成分の分離をさらに容易にすることができる。 Furthermore, in the stepwise neutralization of the rare earth component-containing solution as described above, the rare earth component-containing solution is neutralized to a pH of 3 or more and a pH of 5 or less, preferably about pH 4, before the rare earth components are separated. Therefore, it is possible to first remove contaminants such as Ti and Mn from the rare earth component-containing solution. Since contaminants such as Ti and Mn have been removed from the rare earth component-containing solution in this way, it is possible to further facilitate separation of the rare earth components using the rare earth component-containing solution from which these contaminants have been removed.
(工程(E):未溶解物の溶解)
工程(E)では、工程(F)においてろ過により取り出されたセラミック微細化物及び第2の金属微細化物をアンモニア水に溶解する。これにより、第2の金属微細化物に含まれる第2の金属成分が溶解した第2の金属溶液を生成することができる。よって、第2の金属溶液を第2の金属成分として分離回収することができる。このとき、セラミック微細化物は沈殿している。
(Step (E): Dissolving undissolved matter)
In step (E), the ceramic fine particles and the second metal fine particles taken out by filtration in step (F) are dissolved in ammonia water. This produces a second metal solution in which the second metal component contained in the second metal fine particles is dissolved. Thus, the second metal solution can be separated and recovered as the second metal component. At this time, the ceramic fine particles are precipitated.
具体的に、Cu等の第2の金属成分を含む第2金属微細化物とBaTiO3であるセラミック微細化物とをアンモニア水に溶解する。これにより、例えば[Cu(NH3)4]2+等のアンミン銅錯体を含む第2の金属溶液を得ることができる。BaTiO3は第2金属溶液の中で沈殿する。 Specifically, a second metal fine particle containing a second metal component such as Cu and a ceramic fine particle of BaTiO3 are dissolved in ammonia water, thereby obtaining a second metal solution containing an ammine copper complex such as [Cu( NH3 ) 4 ] 2+ . BaTiO3 precipitates in the second metal solution.
なお、上記の通り第2の金属成分は第2の金属溶液として分離回収される。本発明では、第2の金属成分の分離回収には、第2の金属成分そのものを分離回収することだけでなく、第2の金属成分溶液を第2の金属成分として分離回収することが含まれる。ここで、第2の金属成分には、第2の金属成分そのもの、第2の金属成分が他の原子等と化学的に反応した反応物である第2の金属成分化合物、第2の金属成分の溶液、第2の金属成分化合物の溶液等が含まれる。また、第2の金属成分の状態は、液体状態、固体状態、液体及び固体の混合状態のいずれであってもよい。また、第2の金属成分は、非晶質の状態、結晶質の状態、非晶質及び結晶質が混在した状態のいずれであってもよい。 As described above, the second metal component is separated and recovered as a second metal solution. In the present invention, the separation and recovery of the second metal component includes not only the separation and recovery of the second metal component itself, but also the separation and recovery of the second metal component solution as the second metal component. Here, the second metal component includes the second metal component itself, a second metal component compound which is a reaction product of the second metal component chemically reacting with other atoms, etc., a solution of the second metal component, a solution of the second metal component compound, etc. The state of the second metal component may be any of a liquid state, a solid state, and a mixed state of liquid and solid. The second metal component may be any of an amorphous state, a crystalline state, and a mixed state of amorphous and crystalline.
工程(E)において、アンモニア水の添加により第2の金属溶液がpH9以上pH10以下となるように調整することが好ましい。このように工程(E)において第2の金属溶液をpH9以上pH10以下に調整することにより、第2の金属溶液を第2の金属成分として効率よく分離回収することができる。より好ましくは、第2の金属溶液がアンモニア水の添加によりpH9.5となるように調整する。 In step (E), it is preferable to adjust the second metal solution to a pH of 9 or more and a pH of 10 or less by adding ammonia water. In this way, by adjusting the second metal solution to a pH of 9 or more and a pH of 10 or less in step (E), the second metal solution can be efficiently separated and recovered as the second metal component. More preferably, the second metal solution is adjusted to a pH of 9.5 by adding ammonia water.
また、工程(F)で取り出された未溶解物であるセラミック微細化物及び第2の金属微細化物をアンモニア水に溶解する場合、アンモニア水に例えば硫酸アンモニウムなどのアンモニウム塩を添加することが好ましい。ここで、アンモニア水は、Cu等の第2の金属成分を銅アンミン錯体等のアンミン錯体として構成するためのアンモニアの供給源である。また、アンモニウム塩は、銅アンミン錯体等のアンミン錯体に対イオンを提供する。例えば、硫酸アンモニウムであるアンモニウム塩は、[Cu(NH3)4]2+である銅アンミン錯体に対イオンとしてSO4 2-を供給する。そして、アンモニアの濃度が低下した場合でもCuSO4などの塩を形成し、Cuイオンの析出を抑制する。 In addition, when the undissolved ceramic fine particles and the second metal fine particles taken out in step (F) are dissolved in ammonia water, it is preferable to add an ammonium salt such as ammonium sulfate to the ammonia water. Here, the ammonia water is a source of ammonia for forming the second metal component such as Cu as an ammine complex such as a copper ammine complex. In addition, the ammonium salt provides a counter ion to the ammine complex such as the copper ammine complex. For example, an ammonium salt such as ammonium sulfate supplies SO 4 2- as a counter ion to the copper ammine complex which is [Cu(NH 3 ) 4 ] 2+ . And even if the concentration of ammonia decreases, it forms a salt such as CuSO 4 to suppress the precipitation of Cu ions.
(工程(H):ろ過)
工程(H)では、工程(E)において生成された、沈殿しているセラミック微細化物を含む第2の金属溶液をろ過することにより、沈殿しているセラミック微細化物と第2の金属溶液とを固液分離する。この固液分離により、沈殿しているセラミック微細化物を含む第2の金属溶液から、沈殿しているセラミック微細化物が除去された第2の金属溶液を第2の金属成分として分離回収することができる。
(Step (H): Filtration)
In step (H), the second metal solution containing the precipitated ceramic fine particles produced in step (E) is filtered to separate the precipitated ceramic fine particles from the second metal solution. By this solid-liquid separation, the second metal solution from which the precipitated ceramic fine particles have been removed can be separated and recovered as a second metal component from the second metal solution containing the precipitated ceramic fine particles.
例えば、工程(E)において、BaTiO3が沈殿している状態で、第2の金属溶液としてCu等の第2の金属成分がアンモニア水に溶解した第2の金属溶液が生成されているとする。第2の金属溶液は、例えば[Cu(NH3)4]2+等の銅アンミン錯体を含む。この場合、工程(H)のろ過により、BaTiO3が除去された、銅アンミン錯体を含む第2の金属溶液を第2の金属成分として分離回収することができる。 For example, in step (E), a second metal solution is generated in which a second metal component such as Cu is dissolved in ammonia water while BaTiO3 is precipitated. The second metal solution contains a copper ammine complex such as [Cu( NH3 ) 4 ] 2+ . In this case, the second metal solution containing the copper ammine complex from which BaTiO3 has been removed can be separated and recovered as the second metal component by filtration in step (H).
ろ過は、ろ紙(ろ布)を用いて行うことができる。ろ紙(ろ布)のメッシュの程度は、沈殿しているセラミック微細化物がろ紙(ろ布)を通過しない程度であると好ましい。また、工程(E)において生成された、沈殿しているセラミック微細化物を含む第2の金属溶液を固液分離できればよく、ろ過による固液分離に限定されず、デカンテーション、遠心分離など、公知の方法から適宜選択することにより固液分離することができる。なお、ろ過がより好ましい。 Filtration can be performed using filter paper (filter cloth). The mesh size of the filter paper (filter cloth) is preferably such that the precipitated ceramic fine particles do not pass through the filter paper (filter cloth). In addition, the solid-liquid separation of the second metal solution containing the precipitated ceramic fine particles produced in step (E) need only be performed, and the solid-liquid separation is not limited to filtration, and can be performed by any known method appropriately selected, such as decantation or centrifugation. Filtration is more preferable.
(工程(I):第1の分離物の溶解)
工程(I)では、工程(C)において分離回収された第1の分離物を鉱酸に溶解する。第1の分離物は、第1の金属微細化物とセラミック微細化物とを含む。鉱酸への第1の分離物の溶解により、第1の分離物に含まれるセラミック微細化物を未溶解物として沈殿させるとともに、第1の分離物中の第1の金属微細化物が溶解した第1の金属溶液を生成する。このとき第1の金属微細化物に含まれる第1の金属成分は第1の金属溶液として分離回収される。本発明では、第1の金属成分の分離回収には、第1の金属成分そのものを分離回収することだけでなく、第1の金属溶液を第1の金属成分として分離回収することが含まれる。鉱酸は、例えば、硫酸、硝酸及び塩酸を含む群から選ばれる少なくとも1種である。前記鉱酸は、酸化力を持たない鉱酸及び酸化力を持つ鉱酸のいずれであってもよい。また、本実施の形態では、単に鉱酸と言う場合は、酸化力を持たない鉱酸及び酸化力を持つ鉱酸のいずれも含むものとする。
(Step (I): Dissolution of the first separated product)
In step (I), the first separated product separated and recovered in step (C) is dissolved in a mineral acid. The first separated product includes a first metal fine product and a ceramic fine product. By dissolving the first separated product in a mineral acid, the ceramic fine product contained in the first separated product is precipitated as an undissolved product, and a first metal solution in which the first metal fine product in the first separated product is dissolved is generated. At this time, the first metal component contained in the first metal fine product is separated and recovered as a first metal solution. In the present invention, the separation and recovery of the first metal component includes not only the separation and recovery of the first metal component itself, but also the separation and recovery of the first metal solution as the first metal component. The mineral acid is, for example, at least one selected from the group including sulfuric acid, nitric acid, and hydrochloric acid. The mineral acid may be either a mineral acid that does not have oxidizing power or a mineral acid that has oxidizing power. In addition, in the present embodiment, when simply saying mineral acid, it is meant to include both a mineral acid that does not have oxidizing power and a mineral acid that has oxidizing power.
工程(I)において、鉱酸の添加により第1の金属溶液がpH1.5以上pH2.5以下となるように調整することが好ましい。 In step (I), it is preferable to adjust the pH of the first metal solution to 1.5 or more and 2.5 or less by adding a mineral acid.
工程(I)において鉱酸を用いて第1の金属溶液をpH1.5以上pH2.5以下に調整することにより、主として第1の金属微細化物中の第1の金属成分を鉱酸に溶解することができる。また、pHを上記範囲よりも強酸に調整するとセラミック微細化物等が鉱酸に溶解してしまう場合があるため、上記範囲にpHを調整することが好ましい。より好ましくは、第1の金属溶液が鉱酸の添加によりpH2となるように調整する。 In step (I), the first metal solution is adjusted to a pH of 1.5 or more and 2.5 or less using a mineral acid, so that the first metal component in the first metal fine particles can be dissolved in the mineral acid. In addition, if the pH is adjusted to a stronger acid than the above range, the ceramic fine particles and the like may dissolve in the mineral acid, so it is preferable to adjust the pH to within the above range. More preferably, the first metal solution is adjusted to a pH of 2 by adding a mineral acid.
なお、工程(C)においてスラリー状態の焼成後廃棄物を磁性分離した場合、分離された第1の分離物は約pH7のスラリー状態である。このスラリーに鉱酸を添加することによりpH1.5以上pH2.5以下に調整された第1の金属溶液を生成することもできる。ただし、磁性分離後の第1の分離物はスラリー状態である必要はなく、乾燥状態であってもよい。 When the post-calcination waste in a slurry state is magnetically separated in step (C), the separated first separated material is in a slurry state with a pH of about 7. By adding a mineral acid to this slurry, a first metal solution adjusted to a pH of 1.5 or more and 2.5 or less can be produced. However, the first separated material after magnetic separation does not need to be in a slurry state and may be in a dry state.
鉱酸としては、第1の分離物に含まれるセラミック微細化物が例えばBaTiO3である場合、硫酸を用いることが好ましい。硫酸を用いた場合、BaTiO3であるセラミック微細化物の表面に不溶性のBaSO4が形成されるため、セラミック微細化物を沈殿させることができる。一方、Ni等の第1の金属微細化物を硫酸に溶解させることができる。具体的に、例えば、Niの第1の金属微細化物、BaTiO3であるセラミック微細化物を主として含む第1の分離物を硫酸に溶解することにより、BaTiO3が沈殿するとともに、Niが硫酸に溶解した硫酸ニッケル(NiSO4)溶液が第1の金属溶液として生成される。 As the mineral acid, when the ceramic fine particles contained in the first separation product are, for example, BaTiO 3 , it is preferable to use sulfuric acid. When sulfuric acid is used, insoluble BaSO 4 is formed on the surface of the ceramic fine particles, which are BaTiO 3 , so that the ceramic fine particles can be precipitated. On the other hand, the first metal fine particles, such as Ni, can be dissolved in sulfuric acid. Specifically, for example, by dissolving the first separation product, which mainly contains the first metal fine particles, Ni and the ceramic fine particles, which are BaTiO 3 , in sulfuric acid, BaTiO 3 is precipitated, and a nickel sulfate (NiSO 4 ) solution in which Ni is dissolved in sulfuric acid is generated as the first metal solution.
なお、鉱酸としては前述の通り硫酸以外の塩酸等を用いることもできる。ただし、例えば、鉱酸として塩酸を用いた場合は、セラミック微細化物であるBaTiO3の表面に溶解性であるBaCl2が形成される。よって、セラミック微細化物を沈殿させるとともに第1の金属微細化物を溶解させるように塩酸等のpH調整を精度よく行うことが好ましい。 As described above, hydrochloric acid or the like can be used as the mineral acid other than sulfuric acid. However, for example, when hydrochloric acid is used as the mineral acid, soluble BaCl2 is formed on the surface of BaTiO3 , which is the ceramic fine particle. Therefore, it is preferable to precisely adjust the pH of hydrochloric acid or the like so as to precipitate the ceramic fine particle and dissolve the first metal fine particle.
(工程(J):ろ過)
工程(J)では、工程(I)において生成された、沈殿しているセラミック微細化物を含む第1の金属溶液をろ過することにより、沈殿しているセラミック微細化物と第1の金属溶液とを固液分離する。この固液分離により、沈殿しているセラミック微細化物を含む第1の金属溶液から、沈殿しているセラミック微細化物が除去された第1の金属溶液を第1の金属成分として分離回収することができる。
(Step (J): Filtration)
In step (J), the first metal solution containing the precipitated ceramic fine particles produced in step (I) is filtered to separate the precipitated ceramic fine particles from the first metal solution. By this solid-liquid separation, the first metal solution from which the precipitated ceramic fine particles have been removed can be separated and recovered as a first metal component from the first metal solution containing the precipitated ceramic fine particles.
例えば、工程(I)において、BaTiO3が沈殿するとともに、第1の金属溶液としてNiが硫酸に溶解した硫酸ニッケル(NiSO4)溶液が生成されているとする。この場合、ろ過により、BaTiO3が除去された硫酸ニッケル溶液を得ることができる。 For example, in step (I), BaTiO3 is precipitated and a nickel sulfate ( NiSO4 ) solution in which Ni is dissolved in sulfuric acid is generated as the first metal solution. In this case, the nickel sulfate solution from which BaTiO3 has been removed can be obtained by filtration.
ろ過は、ろ紙(ろ布)を用いて行うことができる。ろ紙(ろ布)のメッシュの程度は、沈殿しているセラミック微細化物がろ紙(ろ布)を通過しない程度であると好ましい。また、工程(I)において生成された、沈殿しているセラミック微細化物を含む第1の金属溶液を固液分離できればよく、ろ過による固液分離に限定されず、デカンテーション、遠心分離など、公知の方法から適宜選択することにより固液分離することができる。なお、ろ過がより好ましい。 Filtration can be performed using filter paper (filter cloth). The mesh size of the filter paper (filter cloth) is preferably such that the precipitated ceramic fine particles do not pass through the filter paper (filter cloth). In addition, the solid-liquid separation of the first metal solution containing the precipitated ceramic fine particles produced in step (I) need only be performed, and is not limited to solid-liquid separation by filtration, and solid-liquid separation can be performed by an appropriate selection from known methods such as decantation and centrifugation. Filtration is more preferable.
その他、工程(J)のろ過の代わり又はろ過とともに、晶析及び中和等の処理を行うことができる。そして、前述のろ過で得た第1の金属溶液を処理することにより、例えば第1の金属成分化合物(例えばNiSO4、NiCl2等)として第1の金属成分を分離回収できる。本発明では、第1の金属成分の分離回収には、第1の金属成分そのものを分離回収することだけでなく、第1の金属成分が化学的に反応した反応物である第1の金属成分化合物を第1の金属成分として分離回収することが含まれる。 In addition, instead of or together with the filtration in step (J), treatments such as crystallization and neutralization can be performed. The first metal solution obtained by the above-mentioned filtration can be treated to separate and recover the first metal component, for example, as a first metal component compound (e.g., NiSO4 , NiCl2 , etc.). In the present invention, the separation and recovery of the first metal component includes not only the separation and recovery of the first metal component itself, but also the separation and recovery of the first metal component compound, which is a reaction product of the chemical reaction of the first metal component, as the first metal component.
(3)作用効果
上記の分離回収方法によれば、積層セラミックコンデンサの焼成後廃棄物から、内部電極層16を構成する第1の金属成分、外部電極30を構成する第2の金属成分、セラミック層14に含まれている希土類成分を分離回収することができる。具体的に以下に説明する。
(3) Effects and Effects According to the above separation and recovery method, the first metal component constituting the internal electrode layer 16, the second metal component constituting the external electrode 30, and the rare earth component contained in the ceramic layer 14 can be separated and recovered from the fired waste of the multilayer ceramic capacitor. The details are explained below.
本願の発明者らは、積層セラミックコンデンサの焼成(焼付電極層用の焼成)後廃棄物に含まれる各種成分を有効利用することを考えた。焼成後廃棄物においては、焼成を経ていることにより各種成分が焼結した状態にある。例えば、内部電極層は、Ni等の第1の金属粉末が焼成により焼結された第1の金属粒子(第1の金属焼結体)を含んで形成されている。また、例えば、セラミック層は、BaTiO3等のセラミック粉末が焼成により焼結されたセラミック粒子(セラミック焼結体)を含んで形成されている。また、例えば、外部電極は、Cu等の第2の金属粉末が焼成により焼結された第2の金属粒子(第2の金属焼結体)を含んで形成されている。このように積層セラミックコンデンサの各部が焼結した状態であっても、分離回収方法を工夫することにより積層セラミックコンデンサに含まれる各種成分を分離回収できることを見出した。 The inventors of the present application have considered the effective use of various components contained in waste after firing of a multilayer ceramic capacitor (firing for firing electrode layers). In the waste after firing, various components are in a sintered state due to the firing process. For example, the internal electrode layer is formed including first metal particles (first metal sintered body) obtained by sintering a first metal powder such as Ni by firing. Also, for example, the ceramic layer is formed including ceramic particles (ceramic sintered body) obtained by sintering a ceramic powder such as BaTiO 3 by firing. Also, for example, the external electrode is formed including second metal particles (second metal sintered body) obtained by sintering a second metal powder such as Cu by firing. Thus, even when each part of the multilayer ceramic capacitor is in a sintered state, it has been found that various components contained in the multilayer ceramic capacitor can be separated and recovered by devising a separation and recovery method.
また、工程(B)において焼成後廃棄物を微細化することにより、セラミック微細化物、希土類含有物、第1の金属微細化物及び第2の金属微細化物を得ることができる。そして、微細化された後の焼成後廃棄物を、工程(C)において磁石を用いて分離することにより第1の分離物と第2の分離物とに分離することができる。第1の分離物には、セラミック微細化物及び第1の金属微細化物が含まれる。第2の分離物には、セラミック微細化物、希土類含有物及び第2の金属微細化物が含まれる。よって、工程(C)により、第1の分離物を分離回収することにより、焼成後廃棄物から第2の分離物を除去できるとともに第1の金属微細化物を含む第1の分離物を第1の金属成分として分離回収することができる。 Furthermore, by pulverizing the post-sintered waste in step (B), it is possible to obtain ceramic microparticles, rare earth-containing materials, first metal microparticles, and second metal microparticles. Then, the post-sintered waste after pulverization can be separated into a first separated material and a second separated material by separating the finely pulverized post-sintered waste using a magnet in step (C). The first separated material includes the ceramic microparticles and the first metal microparticles. The second separated material includes the ceramic microparticles, rare earth-containing materials, and second metal microparticles. Therefore, by separating and recovering the first separated material in step (C), it is possible to remove the second separated material from the post-sintered waste, and to separate and recover the first separated material including the first metal microparticles as the first metal component.
その後、工程(D)において第2の分離物を酸化力を持たない鉱酸に溶解することにより、希土類粉末含有物中の希土類成分が溶解した希土類成分含有溶液を生成することができる。これにより、希土類成分含有溶液を希土類成分として分離回収することができる。このとき、第2の分離物中のセラミック微細化物及び第2の金属微細化物は沈殿している。セラミック微細化物は酸化力を持たない鉱酸と反応することにより未溶解物となり沈殿する。また、Cu等の第2の金属微細化物は、酸化力を持たない鉱酸に含まれる水素イオンよりもイオン化傾向が小さいため酸化力を持たない鉱酸には溶解しない。 Then, in step (D), the second separated material is dissolved in a mineral acid that has no oxidizing power, thereby producing a rare earth component-containing solution in which the rare earth components in the rare earth powder-containing material are dissolved. This allows the rare earth component-containing solution to be separated and recovered as rare earth components. At this time, the ceramic fine particles and the second metal fine particles in the second separated material have precipitated. The ceramic fine particles react with the mineral acid that has no oxidizing power, and become undissolved and precipitate. In addition, the second metal fine particles, such as Cu, do not dissolve in the mineral acid that has no oxidizing power, because they have a smaller ionization tendency than the hydrogen ions contained in the mineral acid that has no oxidizing power.
その後、工程(D)において取り出した第2の分離物中のセラミック微細化物及び第2の金属微細化物をアンモニア水に溶解することにより、第2の金属微細化物中のCu等の第2の金属成分が溶解した第2の金属溶液を生成することができる。これにより、第2の金属溶液を第2の金属成分として分離回収することができる。このとき、第2の分離物中のセラミック微細化物はアンモニア水には溶解せず沈殿している。 Then, by dissolving the ceramic fine particles and the second metal fine particles in the second separated product extracted in step (D) in ammonia water, a second metal solution can be produced in which the second metal components, such as Cu, in the second metal fine particles are dissolved. This makes it possible to separate and recover the second metal components from the second metal solution. At this time, the ceramic fine particles in the second separated product do not dissolve in the ammonia water but precipitate.
これら工程(C)、工程(D)及び工程(E)を含む分離回収方法を経ることにより、微細化後の焼成後廃棄物から希土類成分を希土類成分含有溶液として分離回収することができ、第2の金属溶液を第2の金属成分として分離回収することができる。そして、各工程を経ていく過程において希土類成分を含む材料における希土類成分の割合及び第2の金属成分を含む材料における第2の金属成分の割合が増加する。よって、例えばDy等の希土類成分及びCu等の第2の金属成分を高品位で回収することができる。 By going through the separation and recovery method including steps (C), (D) and (E), the rare earth components can be separated and recovered as a rare earth component-containing solution from the post-firing waste after micronization, and the second metal solution can be separated and recovered as a second metal component. Then, in the process of going through each step, the ratio of the rare earth components in the material containing the rare earth components and the ratio of the second metal components in the material containing the second metal components increase. Therefore, for example, rare earth components such as Dy and second metal components such as Cu can be recovered at high quality.
また、上記の実施の形態の分離回収方法には、さらに工程(I)が含まれている。この工程(I)において第1の分離物を鉱酸に溶解することにより、第1の金属微細化物に含まれる第1の金属成分が溶解した第1の金属溶液を生成することができる。なお、工程(I)において第1の分離物に含まれるセラミック微細化物は鉱酸と反応することにより未溶解物となり沈殿するため、第1の分離物に含まれるセラミック微細化物と第1の金属成分とは分離される。 The separation and recovery method of the above embodiment further includes step (I). In step (I), the first separated material is dissolved in a mineral acid to produce a first metal solution in which the first metal component contained in the first metal fine particles is dissolved. In step (I), the ceramic fine particles contained in the first separated material react with the mineral acid to become undissolved and precipitate, so that the ceramic fine particles and the first metal component contained in the first separated material are separated.
よって、工程(C)及び工程(I)を含む分離回収方法を経ることにより、微細化後の焼成後廃棄物から第1の金属溶液を第1の金属成分として分離回収することができる。そして、各工程を経ていく過程において第1の金属成分を含む材料における第1の金属成分の割合が増加する。よって、例えばNi等の第1の金属成分を高品位で回収することができる。 Therefore, by going through the separation and recovery method including steps (C) and (I), the first metal solution can be separated and recovered as the first metal component from the post-firing waste after micronization. And, as each step goes through, the proportion of the first metal component in the material containing the first metal component increases. Therefore, the first metal component, such as Ni, can be recovered in high quality.
上述の通り積層セラミックコンデンサの焼成後廃棄物を利用して第1の金属成分、第2の金属成分及び希土類成分等の分離回収を行うため、焼成後廃棄物を廃棄物として廃棄するのではなく、資源として利用することができ環境負荷を抑制することができる。 As described above, the first metal component, second metal component, rare earth component, etc. are separated and recovered from the fired waste of multilayer ceramic capacitors, so the fired waste is not discarded as waste but can be used as a resource, reducing the burden on the environment.
2.実験例
以下に、実験例として、焼成後廃棄物から金属成分及び希土類成分を回収した実施例を説明する。
2. Experimental Example Hereinafter, an experimental example will be described in which metal components and rare earth components were recovered from post-burning waste.
[実施例]
焼成後廃棄物を10g準備した。10gの焼成後廃棄物は、第1の金属成分であるNiを35質量%(3.5g)、第2の金属成分であるCuを7質量%(0.7g)、BaTiO3であるセラミック粒子(セラミック焼結体)を54質量%(5.4g)、希土類成分であるDyを2質量%(0.2g)、Mg、Mn、SiO2等のコンタミを2質量%(0.2g)含む(工程(A))。この焼成後廃棄物を粉砕して微細化した(工程(B))。粉砕による微細化後の焼成後廃棄物を100mlの水と混合してスラリーを作成した。このスラリーを磁石を用いて磁性分離した。この磁性分離により、第1の分離物を4.5g分離回収し、第2の分離物を4.6g分離回収した(工程(C))。その後、4.6gの第2の分離物に100mlの水を加え、1mol%の硫酸を少しずつ添加してpH2になるまで調整した。これにより第2の分離物中のセラミック微細化物(BaTiO3)と第2の金属微細化物(Cu)とを沈殿させ、希土類含有物に含まれるDyを硫酸溶液に溶解した(工程(D))。セラミック微細化物(BaTiO3)及び第2の金属微細化物(Cu)が沈殿し、Dyが硫酸溶液に溶解した状態の溶液をろ過し、90mlの硫酸ジスプロシウム(Dy2(SO4)3)溶液を得た(工程(F))。90mlの硫酸ジスプロシウム溶液にアルカリとして1mol%の苛性ソーダ溶液を少しずつ添加してpH8になるまで調整した(工程(G))。この溶液をろ過して、0.1gのDy(OH)3を分離回収した。よって、本工程を経ることで焼成後廃棄物中に含まれるDyのうちおよそ40%のDyを回収した。
[Example]
10 g of the fired waste was prepared. The 10 g of fired waste contained 35 mass % (3.5 g) of Ni, which is the first metal component, 7 mass % (0.7 g) of Cu, which is the second metal component, 54 mass % (5.4 g) of ceramic particles (ceramic sintered body) which is BaTiO 3 , 2 mass % (0.2 g) of Dy, which is a rare earth component, and 2 mass % (0.2 g) of contaminants such as Mg, Mn, and SiO 2 (step (A)). The fired waste was pulverized and finely divided (step (B)). The fired waste after pulverization and finely divided was mixed with 100 ml of water to prepare a slurry. The slurry was magnetically separated using a magnet. By this magnetic separation, 4.5 g of the first separated product was separated and recovered, and 4.6 g of the second separated product was separated and recovered (step (C)). Then, 100 ml of water was added to 4.6 g of the second separated product, and 1 mol% sulfuric acid was added little by little to adjust the pH to 2. As a result, the ceramic fine particles (BaTiO 3 ) and the second metal fine particles (Cu) in the second separated product were precipitated, and the Dy contained in the rare earth-containing material was dissolved in the sulfuric acid solution (step (D)). The solution in which the ceramic fine particles (BaTiO 3 ) and the second metal fine particles (Cu) were precipitated and Dy was dissolved in the sulfuric acid solution was filtered to obtain 90 ml of dysprosium sulfate (Dy 2 (SO 4 ) 3 ) solution (step (F)). 1 mol% caustic soda solution was added little by little as an alkali to the 90 ml dysprosium sulfate solution to adjust the pH to 8 (step (G)). This solution was filtered to separate and recover 0.1 g of Dy(OH) 3 . Therefore, by going through this process, approximately 40% of the Dy contained in the waste after firing was recovered.
また、工程(F)において回収した、セラミック微細化物(BaTiO3)及び第2の金属微細化物(Cu)のろ過物4.1gに、100mlの水と、硫酸アンモニウム2gを加え、1mol%のアンモニア水を少しずつ添加してpH9.5になるまで調整した。これによりセラミック微細化物(BaTiO3)を沈殿させ、第2の金属微細化物(Cu)をアンモニア水に溶解した(工程(E))。この溶液をろ過して、90mlの[Cu(NH3)4]2+等のアンミン銅錯体を分離回収した。よって、本工程を経ることで焼成後廃棄物中に含まれるCuのうちおよそ60%のCuを回収した。 In addition, 100 ml of water and 2 g of ammonium sulfate were added to 4.1 g of the filtrate of the ceramic fine particles (BaTiO 3 ) and the second metal fine particles (Cu) recovered in step (F), and 1 mol% ammonia water was added little by little to adjust the pH to 9.5. This caused the ceramic fine particles (BaTiO 3 ) to precipitate, and the second metal fine particles (Cu) to dissolve in ammonia water (step (E)). This solution was filtered to separate and recover 90 ml of ammine copper complexes such as [Cu(NH 3 ) 4 ] 2+ . Thus, by passing through this step, approximately 60% of the Cu contained in the waste after firing was recovered.
また、工程(C)において回収した4.5gの第1の分離物に100mlの水を加え、1mol%の硫酸を少しずつ添加してpH2になるまで調整した。これにより第1の分離物中のセラミック微細化物(BaTiO3)を沈殿させ、第1の金属微細化物(Ni)を硫酸溶液に溶解した(工程(I))。セラミック微細化物(BaTiO3)が沈殿し、第1の金属微細化物(Ni)が硫酸溶液に溶解した状態の溶液をろ過し、90mlの硫酸ニッケル(Ni(SO4))溶液を得た(工程(J))。90mlの硫酸ニッケル溶液にアルカリとして1mol%の苛性ソーダ溶液を少しずつ添加してpH10になるまで調整した。この溶液をろ過して、4.4gのNi(OH)2を分離回収した。よって、本工程を経ることで焼成後廃棄物中に含まれるNiのうちおよそ80%のNiを回収した。 In addition, 100 ml of water was added to 4.5 g of the first separated product recovered in step (C), and 1 mol % sulfuric acid was added little by little to adjust the pH to 2. As a result, the ceramic fine particles (BaTiO 3 ) in the first separated product were precipitated, and the first metal fine particles (Ni) were dissolved in the sulfuric acid solution (step (I)). The solution in which the ceramic fine particles (BaTiO 3 ) were precipitated and the first metal fine particles (Ni) were dissolved in the sulfuric acid solution was filtered to obtain 90 ml of nickel sulfate (Ni(SO 4 )) solution (step (J)). 1 mol % caustic soda solution was added little by little as an alkali to the 90 ml nickel sulfate solution to adjust the pH to 10. This solution was filtered, and 4.4 g of Ni(OH) 2 was separated and recovered. Therefore, by going through this process, approximately 80% of the Ni contained in the waste after firing was recovered.
[実験結果]
上記の実験から、本実施の形態に係る分離回収方法によれば、積層セラミックコンデンサの焼成後廃棄物を出発原料とした上で、磁性分離及び中和による浸出等の工程を経ることにより簡易に高品位のDy、Ni及びCu等の希土類成分、第1の金属成分及び第2の金属成分を分離精製することができる。
[Experimental Results]
From the above experiments, it has been found that the separation and recovery method according to the present embodiment uses fired multilayer ceramic capacitor waste as a starting material, and by going through processes such as magnetic separation and leaching by neutralization, it is possible to easily separate and refine high-quality rare earth components such as Dy, Ni, and Cu, a first metal component, and a second metal component.
<第2の実施の形態>
上記の第1の実施の形態では、外部電極30は焼付電極層32を含む。そして、焼付電極層32が積層セラミックコンデンサ10の最外層である(図3)。しかし、外部電極30の態様はこれに限定されない。第2の実施の形態では、外部電極30が焼付電極層32とめっき層とを含む。そして、めっき層が積層セラミックコンデンサの最外層である。第1の実施の形態と同様の内容については説明を省略するか、簡略化する。
Second Embodiment
In the first embodiment described above, the external electrode 30 includes a fired electrode layer 32. The fired electrode layer 32 is the outermost layer of the multilayer ceramic capacitor 10 (FIG. 3). However, the form of the external electrode 30 is not limited to this. In the second embodiment, the external electrode 30 includes a fired electrode layer 32 and a plating layer. The plating layer is the outermost layer of the multilayer ceramic capacitor. Descriptions of the same content as in the first embodiment will be omitted or simplified.
図7は、この発明の第2の実施の形態に係る、積層セラミックコンデンサの長さ方向及び積層方向を含む面に平行な断面図(1)である。図8は、この発明の第2の実施の形態に係る、別の態様の積層セラミックコンデンサの長さ方向及び積層方向を含む面に平行な断面図(2)である。 FIG. 7 is a cross-sectional view (1) parallel to a plane including the length direction and stacking direction of a multilayer ceramic capacitor according to a second embodiment of the present invention. FIG. 8 is a cross-sectional view (2) parallel to a plane including the length direction and stacking direction of another type of multilayer ceramic capacitor according to the second embodiment of the present invention.
第2の実施の形態に係る積層セラミックコンデンサ10A(図7)、10B(図8)は、第1の実施の形態と同様の積層体12を含むとともに、さらに積層体12上に配置された外部電極30を含む。当該外部電極30は、焼付電極層32と、焼付電極層32上に配置されためっき層34と、を含む。めっき層34は、積層セラミックコンデンサ10A、10Bの最外層である。めっき層34以外の構成は第1の実施の形態と同様である。めっき層34は、例えば、Ni、Sn、Cu、Ag等から選ばれる少なくとも1つを含んで形成される。なお、第1の実施の形態に係る積層セラミックコンデンサ10はめっき層を含まない(図3)。 The multilayer ceramic capacitors 10A (FIG. 7) and 10B (FIG. 8) according to the second embodiment include a laminate 12 similar to that of the first embodiment, and further include an external electrode 30 arranged on the laminate 12. The external electrode 30 includes a baked electrode layer 32 and a plating layer 34 arranged on the baked electrode layer 32. The plating layer 34 is the outermost layer of the multilayer ceramic capacitors 10A and 10B. The configuration other than the plating layer 34 is the same as that of the first embodiment. The plating layer 34 is formed by including at least one selected from, for example, Ni, Sn, Cu, Ag, etc. Note that the multilayer ceramic capacitor 10 according to the first embodiment does not include a plating layer (FIG. 3).
第2の実施の形態に係る積層セラミックコンデンサ10A、10Bは、上記の第1の実施の形態の(工程1)~(工程7)の工程の後、焼付電極層32上にめっき層34を配置する工程(工程8)を経て形成される。(工程8)では、めっき処理を施すことにより第1の焼付電極層32a上に第1のめっき層34a(第1の下層めっき層34a1、第1の上層めっき層34a2)を形成し、第2の焼付電極層32b上に第2のめっき層34b(第2の下層めっき層34b1、第2の上層めっき層34b2)を形成する。めっき層34は、たとえばバレルめっき法により形成される。めっき処理を行うにあたっては、電解めっき、無電解めっきのどちらを採用してもよい。ただし、無電解めっきはめっき析出速度を向上させるために、触媒などによる前処理が必要となり、工程が複雑化するというデメリットがある。従って、通常は、電解めっきを採用することが好ましい。 The multilayer ceramic capacitors 10A and 10B according to the second embodiment are formed through the steps (step 1) to (step 7) of the first embodiment described above, followed by a step (step 8) of disposing a plating layer 34 on the baked electrode layer 32. In step 8, a plating process is performed to form a first plating layer 34a (first lower plating layer 34a 1 , first upper plating layer 34a 2 ) on the first baked electrode layer 32a, and a second plating layer 34b (second lower plating layer 34b 1 , second upper plating layer 34b 2 ) on the second baked electrode layer 32b. The plating layer 34 is formed, for example, by barrel plating. Either electrolytic plating or electroless plating may be used for the plating process. However, electroless plating has the disadvantage that a pretreatment using a catalyst or the like is required to improve the plating deposition speed, which complicates the process. Therefore, it is usually preferable to use electrolytic plating.
第2の実施の形態に係るめっき層34を有する積層セラミックコンデンサ10A、10Bもまた、第1の実施の形態に係る積層セラミックコンデンサ10(めっき層34無しの積層セラミックコンデンサ10という場合もある)と同様に、焼成(焼付電極層用の焼成)後廃棄物に含まれる。また、めっき層34を有する積層セラミックコンデンサ10A、10Bは、めっき層34を構成する材料に応じて、前述の図1に示す分離回収方法に投入される場合と、後述の図9に示す分離回収方法に導入される場合と、がある。図1の分離回収方法ではめっき層34を除去する工程が含まれていないが、図9の分離回収方法ではめっき層34を除去する工程(工程(K))が含まれている。 The multilayer ceramic capacitors 10A and 10B having the plating layer 34 according to the second embodiment are also included in the post-sintering (sintering for fired electrode layers) waste, similar to the multilayer ceramic capacitor 10 according to the first embodiment (sometimes called the multilayer ceramic capacitor 10 without the plating layer 34). Depending on the material that constitutes the plating layer 34, the multilayer ceramic capacitors 10A and 10B having the plating layer 34 may be introduced into the separation and recovery method shown in FIG. 1 described above, or into the separation and recovery method shown in FIG. 9 described below. The separation and recovery method in FIG. 1 does not include a step of removing the plating layer 34, but the separation and recovery method in FIG. 9 includes a step of removing the plating layer 34 (step (K)).
また、めっき層34は、単層のめっき層から形成されてもよいし(図7)、複数層のめっき層を積層することにより形成されてもよい(図8)。以下に、めっき層34が単層のめっき層である積層セラミックコンデンサ10A及びめっき層34が複数層のめっき層である積層セラミックコンデンサ10Bをそれぞれ説明する。また、積層セラミックコンデンサ10A、10Bそれぞれについて、焼成後廃棄物からの希土類成分及び金属成分の分離回収方法を説明する。 The plating layer 34 may be formed from a single plating layer (FIG. 7) or may be formed by stacking multiple plating layers (FIG. 8). Below, we will explain a multilayer ceramic capacitor 10A in which the plating layer 34 is a single plating layer, and a multilayer ceramic capacitor 10B in which the plating layer 34 is a multiple plating layer. We will also explain a method for separating and recovering rare earth components and metal components from post-sintering waste for each of the multilayer ceramic capacitors 10A and 10B.
1.単層のめっき層を含む積層セラミックコンデンサ
(1)構成
図7に示す積層セラミックコンデンサ10Aは、外部電極30が焼付電極層32と焼付電極層32上に配置されためっき層34とを含む。めっき層34は、単層のめっき層から形成されている。図7の例では、めっき層34は、第1の下層めっき層(第1の1段目めっき層)34a1及び第2の下層めっき層34b1(第2の1段目めっき層)を含む。そして、第1の外部電極30aは、第1の焼付電極層32aと第1の焼付電極層32a上の第1の下層めっき層34a1とを含む。第2の外部電極30bは、第2の焼付電極層32bと第2の焼付電極層32b上の第2の下層めっき層34b1とを含む。そして、第1、第2の下層めっき層34a1、34b1は、積層体12上に配置された層のうち最外層である。焼付電極層32は、めっき層34の下地となることから、下地電極層とも言われる場合がある。
1. Structure of a Multilayer Ceramic Capacitor (1) Including a Single-Layer Plating Layer In a multilayer ceramic capacitor 10A shown in FIG. 7, an external electrode 30 includes a baked electrode layer 32 and a plating layer 34 disposed on the baked electrode layer 32. The plating layer 34 is formed of a single-layer plating layer. In the example of FIG. 7, the plating layer 34 includes a first lower-layer plating layer (first first-stage plating layer) 34a 1 and a second lower-layer plating layer 34b 1 (second first-stage plating layer). The first external electrode 30a includes a first baked electrode layer 32a and a first lower-layer plating layer 34a 1 on the first baked electrode layer 32a. The second external electrode 30b includes a second baked electrode layer 32b and a second lower-layer plating layer 34b 1 on the second baked electrode layer 32b. The first and second lower plating layers 34a1 , 34b1 are the outermost layers among the layers disposed on the laminate 12. The baked electrode layer 32 serves as a base for the plating layer 34, and is therefore sometimes referred to as a base electrode layer.
(2)分離回収方法
(2-1)分離回収方法の概要
めっき層34を有する積層セラミックコンデンサ10Aは、第1の実施の形態と同様に焼成(焼付電極層用の焼成)後廃棄物に含まれる。よって、めっき層34を有する積層セラミックコンデンサ10Aは、第1の実施の形態で説明した図1の分離回収方法に投入されることができる。つまり、工程(A)の焼成後廃棄物の準備において、めっき層34を有する積層セラミックコンデンサ10Aを焼成後廃棄物として準備することができる。その後、図1で説明した分離回収方法を経ることにより、めっき層34を有する積層セラミックコンデンサ10Aから第1の金属成分、第2の金属成分、希土類成分を分離回収することができる。
(2) Separation and Recovery Method (2-1) Overview of Separation and Recovery Method The multilayer ceramic capacitor 10A having the plating layer 34 is included in the post-sintering waste (sintering for the fired electrode layer) as in the first embodiment. Therefore, the multilayer ceramic capacitor 10A having the plating layer 34 can be input to the separation and recovery method of FIG. 1 described in the first embodiment. That is, in the preparation of the post-sintering waste in step (A), the multilayer ceramic capacitor 10A having the plating layer 34 can be prepared as the post-sintering waste. Thereafter, the first metal component, the second metal component, and the rare earth component can be separated and recovered from the multilayer ceramic capacitor 10A having the plating layer 34 by going through the separation and recovery method described in FIG. 1.
ただし、めっき層34を有する積層セラミックコンデンサ10Aのめっき層34を除去した上で、積層セラミックコンデンサ10Aから第1の金属成分、第2の金属成分、希土類成分を回収することもできる。図9は、めっき除去工程を含む、積層セラミックコンデンサの焼成(焼付電極層用の焼成)後廃棄物からの希土類成分及び金属成分の分離回収方法を示すフロー図である。図9の分離回収方法では、図1の分離回収方法に比べて工程(A)の焼成後廃棄物の準備と工程(B)の微細化との間において、めっき層34を除去するめっき除去の工程(K)が含まれている。図9の分離回収方法は、工程(K)が含まれている点を除いて、図1の分離回収方法と同じである。 However, it is also possible to recover the first metal component, the second metal component, and the rare earth component from the multilayer ceramic capacitor 10A after removing the plating layer 34 from the multilayer ceramic capacitor 10A having the plating layer 34. FIG. 9 is a flow diagram showing a method for separating and recovering rare earth components and metal components from waste after firing of a multilayer ceramic capacitor (firing for firing electrode layers), including a plating removal step. The separation and recovery method of FIG. 9, unlike the separation and recovery method of FIG. 1, includes a plating removal step (K) for removing the plating layer 34 between the preparation of the post-firing waste in step (A) and the refining in step (B). The separation and recovery method of FIG. 9 is the same as the separation and recovery method of FIG. 1, except for the inclusion of step (K).
めっき層34を有する積層セラミックコンデンサ10Aからの各種成分の分離回収において、めっき除去工程を含まない図1の分離回収方法を用いるか、あるいは、めっき除去工程を含む図9の分離回収方法を用いるかは、例えば一例であるが次のように分けることができる。 When separating and recovering various components from a multilayer ceramic capacitor 10A having a plating layer 34, the method of separation and recovery shown in FIG. 1, which does not include a plating removal step, or the method of separation and recovery shown in FIG. 9, which includes a plating removal step, can be used, for example, as follows:
(2-2)めっき除去工程を含まない分離回収方法(図1)を用いる場合
めっき層34を有する積層セラミックコンデンサ10Aにおいて、第1、第2の下層めっき層34a1、34b1の両方に含まれる金属成分が、内部電極層16に含まれる第1の金属成分及び焼付電極層32に含まれる第2の金属成分の少なくともいずれかと同じであるとする。この場合、めっき層34を有する積層セラミックコンデンサ10Aは、図1の工程(A)の焼成後廃棄物として準備され、図1に示す分離回収方法の工程(B)以降の各工程によりさらに処理される。例えば、第1、第2の下層めっき層34a1、34b1の両方に第1の金属成分が含まれている場合、めっき層34の第1の金属成分は内部電極層16に含まれる第1の金属成分とともに分離回収することができる。また、例えば、第1、第2の下層めっき層34a1、34b1の両方に第2の金属成分が含まれている場合、めっき層34の第2の金属成分は焼付電極層32に含まれる第2の金属成分とともに分離回収することができる。なお、セラミック層14からは希土類成分を分離回収することができる。
(2-2) In the case of using a separation and recovery method (FIG. 1) that does not include a plating removal step In a laminated ceramic capacitor 10A having a plating layer 34, the metal components contained in both the first and second lower plating layers 34a 1 , 34b 1 are the same as at least one of the first metal component contained in the internal electrode layer 16 and the second metal component contained in the fired electrode layer 32. In this case, the laminated ceramic capacitor 10A having the plating layer 34 is prepared as a waste product after firing in step (A) of FIG. 1, and is further treated in each step after step (B) of the separation and recovery method shown in FIG. 1. For example, when the first metal component is contained in both the first and second lower plating layers 34a 1 , 34b 1 , the first metal component of the plating layer 34 can be separated and recovered together with the first metal component contained in the internal electrode layer 16. Furthermore, for example, when the second metal component is contained in both the first and second lower plating layers 34a1 , 34b1 , the second metal component of the plating layer 34 can be separated and recovered together with the second metal component contained in the baked electrode layer 32. It is possible to separate and recover the rare earth component from the ceramic layer 14.
さらに具体例を挙げて説明する。例えば、一例として、第1、第2の下層めっき層34a1、34b1の両方がNiを主成分とするめっき層であるとする。また、内部電極層16が第1の金属成分としてNiを含むとする。この場合、第1、第2の下層めっき層34a1、34b1が除去されない状態で積層セラミックコンデンサ10Aが、図1の工程(A)の焼成後廃棄物として準備される。その後、図1の分離回収方法における工程(B)以降の各工程を経ることにより、第1、第2の下層めっき層34a1、34b1と内部電極層16とから、第1の金属成分であるNiを分離回収することができる。なお、焼付電極層32からは第2の金属成分を分離回収することができ、セラミック層14からは希土類成分を分離回収することができる。 Further, a specific example will be given. For example, it is assumed that both the first and second lower plating layers 34a 1 and 34b 1 are plating layers mainly composed of Ni. It is also assumed that the internal electrode layer 16 contains Ni as the first metal component. In this case, the multilayer ceramic capacitor 10A is prepared as a post-sintering waste in step (A) of FIG. 1 without removing the first and second lower plating layers 34a 1 and 34b 1. Thereafter, by going through each step from step (B) onward in the separation and recovery method of FIG. 1, it is possible to separate and recover Ni, which is the first metal component, from the first and second lower plating layers 34a 1 and 34b 1 and the internal electrode layer 16. It is possible to separate and recover the second metal component from the fired electrode layer 32, and the rare earth component from the ceramic layer 14.
また、例えば、別の一例として、第1、第2の下層めっき層34a1、34b1の両方がCuを主成分とするめっき層であるとする。また、焼付電極層32が第2の金属成分としてCuを含むとする。この場合、第1、第2の下層めっき層34a1、34b1が除去されない状態で積層セラミックコンデンサ10Aが、図1の工程(A)の焼成後廃棄物として準備される。その後、図1の分離回収方法における工程(B)以降の各工程を経ることにより、第1、第2の下層めっき層34a1、34b1と焼付電極層32とから、第2の金属成分であるCuを分離回収することができる。なお、内部電極層16からは第1の金属成分を分離回収することができ、セラミック層14からは希土類成分を分離回収することができる。 As another example, assume that both the first and second lower plating layers 34a 1 and 34b 1 are plating layers mainly composed of Cu. Also assume that the baked electrode layer 32 contains Cu as the second metal component. In this case, the multilayer ceramic capacitor 10A is prepared as waste after firing in step (A) of FIG. 1 without removing the first and second lower plating layers 34a 1 and 34b 1. Thereafter, by going through each step from step (B) onward in the separation and recovery method of FIG. 1, the second metal component, Cu, can be separated and recovered from the first and second lower plating layers 34a 1 and 34b 1 and the baked electrode layer 32. Note that the first metal component can be separated and recovered from the internal electrode layer 16, and the rare earth component can be separated and recovered from the ceramic layer 14.
(2-3)めっき除去工程を含む分離回収方法(図9)
めっき層34を有する積層セラミックコンデンサ10Aにおいて、第1、第2の下層めっき層34a1、34b1の両方に含まれる金属成分が、内部電極層16に含まれる第1の金属成分及び焼付電極層32に含まれる第2の金属成分のいずれとも異なるとする。つまり、第1、第2の下層めっき層34a1、34b1に含まれる金属成分(第3の金属成分)は、第1の金属成分及び第2の金属成分のいずれとも異なる。この場合、めっき層34を有する積層セラミックコンデンサ10Aは、図9の工程(A)の焼成後廃棄物として準備される。そして、工程(K)のめっき除去により第1、第2の下層めっき層34a1、34b1が除去される。その後、めっき層34が除去された積層セラミックコンデンサ10Aは、図9に示す分離回収方法の工程(B)以降の各工程によりさらに処理される。これにより、めっき層34が除去された積層セラミックコンデンサ10Aから、内部電極層16を構成する第1の金属成分、焼付電極層32を構成する第2の金属成分、セラミック層14に含まれている希土類成分を分離回収することができる。
(2-3) Separation and recovery method including plating removal process (Figure 9)
In the multilayer ceramic capacitor 10A having the plating layer 34, the metal components contained in both the first and second lower plating layers 34a 1 and 34b 1 are different from both the first metal component contained in the internal electrode layer 16 and the second metal component contained in the fired electrode layer 32. In other words, the metal component (third metal component) contained in the first and second lower plating layers 34a 1 and 34b 1 is different from both the first metal component and the second metal component. In this case, the multilayer ceramic capacitor 10A having the plating layer 34 is prepared as a post-sintering waste in step (A) of FIG. 9. Then, the first and second lower plating layers 34a 1 and 34b 1 are removed by plating removal in step (K). Thereafter, the multilayer ceramic capacitor 10A from which the plating layer 34 has been removed is further processed by each step after step (B) of the separation and recovery method shown in FIG. 9. This makes it possible to separate and recover the first metal component constituting the internal electrode layer 16, the second metal component constituting the fired electrode layer 32, and the rare earth component contained in the ceramic layer 14 from the multilayer ceramic capacitor 10A from which the plating layer 34 has been removed.
さらに具体例を挙げて説明する。例えば、第1、第2の下層めっき層34a1、34b1の両方がSn(第3の金属成分の一例)を主成分とするめっき層であるとする。また、内部電極層16が第1の金属成分としてNiを含み、焼付電極層32が第2の金属成分としてCuを含むとする。この場合、めっき層34を有する積層セラミックコンデンサ10Aは、図9の工程(A)の焼成後廃棄物として準備される。そして、図9の工程(K)においてSnを主成分とする第1、第2の下層めっき層34a1、34b1を除去する。Snを主成分とする第1、第2の下層めっき層34a1、34b1は、めっき層34を有する積層セラミックコンデンサ10Aを例えば水酸化ナトリウム及び水酸化カリウム等のアンモニア水以外のアルカリ性の溶液に浸漬することにより除去することができる。この場合、Cuを主成分とする焼付電極層32は、めっき層34が除去されることにより当該アルカリ性の溶液に晒される。しかし、Cuを主成分とする焼付電極層32は当該アルカリ性の溶液により浸食され難い。ここで、アンモニア水以外のアルカリ性の溶液は例えば約pH12に調整される。その後、図9の分離回収方法の工程(B)以降の各工程を経ることにより、内部電極層16を構成する第1の金属成分、焼付電極層32を構成する第2の金属成分、セラミック層14に含まれている希土類成分を分離回収することができる。 Further, a specific example will be given for explanation. For example, it is assumed that both the first and second lower plating layers 34a 1 and 34b 1 are plating layers mainly composed of Sn (an example of a third metal component). It is also assumed that the internal electrode layer 16 contains Ni as the first metal component, and the fired electrode layer 32 contains Cu as the second metal component. In this case, the multilayer ceramic capacitor 10A having the plating layer 34 is prepared as waste after firing in step (A) of FIG. 9. Then, in step (K) of FIG. 9, the first and second lower plating layers 34a 1 and 34b 1 mainly composed of Sn are removed. The first and second lower plating layers 34a 1 and 34b 1 mainly composed of Sn can be removed by immersing the multilayer ceramic capacitor 10A having the plating layer 34 in an alkaline solution other than ammonia water, such as sodium hydroxide and potassium hydroxide. In this case, the baked electrode layer 32 mainly composed of Cu is exposed to the alkaline solution by removing the plating layer 34. However, the baked electrode layer 32 mainly composed of Cu is not easily corroded by the alkaline solution. Here, the alkaline solution other than ammonia water is adjusted to, for example, about pH 12. Thereafter, by going through each step from step (B) of the separation and recovery method of Figure 9 onwards, the first metal component constituting the internal electrode layer 16, the second metal component constituting the baked electrode layer 32, and the rare earth component contained in the ceramic layer 14 can be separated and recovered.
前記ではSnを主成分とするめっき層34をアンモニア水以外のアルカリ性の溶液により除去している。しかし、Snを主成分とするめっき層34を塩酸及び希硫酸等の酸化力を持たない酸性の溶液により除去することができる。この場合、Cuを主成分とする焼付電極層32は、めっき層34が除去されることにより当該酸性の溶液に晒される。しかし、Cuを主成分とする焼付電極層32は当該酸性の溶液により浸食され難い。ここで、酸性の溶液は例えば約pH2に調整される。 In the above, the plating layer 34, which is mainly composed of Sn, is removed with an alkaline solution other than ammonia water. However, the plating layer 34, which is mainly composed of Sn, can be removed with an acidic solution that does not have oxidizing power, such as hydrochloric acid or dilute sulfuric acid. In this case, the baked electrode layer 32, which is mainly composed of Cu, is exposed to the acidic solution when the plating layer 34 is removed. However, the baked electrode layer 32, which is mainly composed of Cu, is not easily corroded by the acidic solution. Here, the acidic solution is adjusted to, for example, about pH 2.
なお、第1、第2の下層めっき層34a1、34b1の両方に含まれる金属成分が、内部電極層16に含まれる第1の金属成分及び焼付電極層32に含まれる第2の金属成分の少なくともいずれかと同じである場合でも、めっき層34を有する積層セラミックコンデンサ10Aを、図9の工程(A)の焼成後廃棄物として準備してもよい。そして、工程(K)のめっき除去により第1、第2の下層めっき層34a1、34b1を除去してもよい。 Incidentally, even when the metal components contained in both the first and second lower plating layers 34a1 , 34b1 are the same as at least one of the first metal component contained in the internal electrode layer 16 and the second metal component contained in the fired electrode layer 32, the multilayer ceramic capacitor 10A having the plating layer 34 may be prepared as waste after firing in step (A) of Fig. 9. Then, the first and second lower plating layers 34a1 , 34b1 may be removed by plating removal in step (K).
例えば、第1、第2の下層めっき層34a1、34b1の両方がNiを主成分とするめっき層であるとする。また、内部電極層16が第1の金属成分としてNiを含み、焼付電極層32が第2の金属成分としてCuを含むとする。この場合、めっき層34を有する積層セラミックコンデンサ10Aは、図9の工程(A)の焼成後廃棄物として準備される。そして、図9の工程(K)においてNiを主成分とする第1、第2の下層めっき層34a1、34b1を除去する。Niを主成分とする第1、第2の下層めっき層34a1、34b1は、めっき層34を有する積層セラミックコンデンサ10Aを例えば塩酸及び希硫酸等の酸化力を持たない酸性の溶液に浸漬することにより除去することができる。この場合、Cuを主成分とする焼付電極層32は、めっき層34が除去されることにより当該酸性の溶液に晒される。しかし、Cuを主成分とする焼付電極層32は当該酸性の溶液により浸食され難い。ここで、酸性の溶液は例えば約pH2に調整される。その後、図9の分離回収方法の工程(B)以降の各工程を経ることにより、内部電極層16を構成する第1の金属成分、焼付電極層32を構成する第2の金属成分、セラミック層14に含まれている希土類成分を分離回収することができる。 For example, it is assumed that both the first and second lower plating layers 34a 1 and 34b 1 are plating layers mainly composed of Ni. It is also assumed that the internal electrode layer 16 contains Ni as the first metal component, and the baked electrode layer 32 contains Cu as the second metal component. In this case, the multilayer ceramic capacitor 10A having the plating layer 34 is prepared as waste after firing in step (A) of FIG. 9. Then, in step (K) of FIG. 9, the first and second lower plating layers 34a 1 and 34b 1 mainly composed of Ni are removed. The first and second lower plating layers 34a 1 and 34b 1 mainly composed of Ni can be removed by immersing the multilayer ceramic capacitor 10A having the plating layer 34 in an acidic solution that does not have oxidizing power, such as hydrochloric acid and dilute sulfuric acid. In this case, the baked electrode layer 32 mainly composed of Cu is exposed to the acidic solution by removing the plating layer 34. However, the baked electrode layer 32, which is mainly composed of Cu, is not easily corroded by the acidic solution. Here, the acidic solution is adjusted to, for example, a pH of about 2. Thereafter, by going through each step from step (B) of the separation and recovery method of Fig. 9 onwards, the first metal component constituting the internal electrode layer 16, the second metal component constituting the baked electrode layer 32, and the rare earth component contained in the ceramic layer 14 can be separated and recovered.
2.複数層のめっき層を含む積層セラミックコンデンサ
(1)構成
図8に示す積層セラミックコンデンサ10Bは、外部電極30が焼付電極層32と焼付電極層32上に配置されためっき層34とを含む。めっき層34は、複数層のめっき層から形成されている。図8の例では、めっき層34は2層のめっき層から形成されている。具体的に、めっき層34は、第1の下層めっき層(第1の1段目めっき層)34a1及び第2の下層めっき層(第2の1段目めっき層)34b1と、第1の上層めっき層(第1の2段目めっき層)34a2及び第2の上層めっき層(第2の2段目めっき層)34b2と、を含む。そして、第1の外部電極30aは、第1の焼付電極層32aと、第1の焼付電極層32a上の第1の下層めっき層34a1と、第1の下層めっき層34a1上の第1の上層めっき層34a2と、を含む。第2の外部電極30bは、第2の焼付電極層32bと、第2の焼付電極層32b上の第2の下層めっき層34b1と、第2の下層めっき層34b1上の第2の上層めっき層34b2と、を含む。そして、第1の上層めっき層34a2及び第2の上層めっき層34b2は、積層体12上に配置された層のうち最外層である。
2. Structure of a multilayer ceramic capacitor (1) including multiple plating layers In a multilayer ceramic capacitor 10B shown in FIG. 8, an external electrode 30 includes a baked electrode layer 32 and a plating layer 34 disposed on the baked electrode layer 32. The plating layer 34 is formed of multiple plating layers. In the example of FIG. 8, the plating layer 34 is formed of two plating layers. Specifically, the plating layer 34 includes a first lower plating layer (first first-stage plating layer) 34a1 and a second lower plating layer (second first-stage plating layer) 34b1 , a first upper plating layer (first second-stage plating layer) 34a2 and a second upper plating layer (second second-stage plating layer) 34b2 . The first external electrode 30a includes a first baked electrode layer 32a, a first lower-layer plating layer 34a1 on the first baked electrode layer 32a, and a first upper-layer plating layer 34a2 on the first lower-layer plating layer 34a1 . The second external electrode 30b includes a second baked electrode layer 32b, a second lower-layer plating layer 34b1 on the second baked electrode layer 32b , and a second upper-layer plating layer 34b2 on the second lower-layer plating layer 34b1 . The first upper-layer plating layer 34a2 and the second upper-layer plating layer 34b2 are the outermost layers among the layers arranged on the laminate 12.
めっき層34を有する積層セラミックコンデンサ10Bは、上記の第1の実施の形態の(工程1)~(工程7)の工程の後、焼付電極層32上にめっき層34を配置する工程(工程8)を経て形成される。(工程8)では、めっき処理を施すことにより第1の焼付電極層32a上に第1の下層めっき層34a1及び第1の上層めっき層34a2を順に形成し、第2の焼付電極層32b上に第2の下層めっき層34b1上の第2の上層めっき層34b2を順に形成する。 The multilayer ceramic capacitor 10B having the plating layer 34 is formed through the steps (step 1) to (step 7) of the first embodiment described above, followed by a step (step 8) of disposing the plating layer 34 on the baked electrode layer 32. In (step 8), a plating process is performed to sequentially form a first lower-layer plating layer 34a1 and a first upper-layer plating layer 34a2 on the first baked electrode layer 32a, and a second upper-layer plating layer 34b2 on the second lower-layer plating layer 34b1 on the second baked electrode layer 32b .
(2)分離回収方法
(2-1)分離回収方法の概要
めっき層34を有する積層セラミックコンデンサ10Bは、第1の実施の形態と同様に焼成(焼付電極層用の焼成)後廃棄物に含まれる。よって、めっき層34を有する積層セラミックコンデンサ10Bは、第1の実施の形態で説明した図1の分離回収方法に投入されることができる。つまり、工程(A)の焼成後廃棄物の準備において、めっき層34を有する積層セラミックコンデンサ10Bを焼成後廃棄物として準備することができる。その後、図1で説明した分離回収方法を経ることにより、めっき層34を有する積層セラミックコンデンサ10Bから第1の金属成分、第2の金属成分、希土類成分を分離回収することができる。
(2) Separation and Recovery Method (2-1) Overview of Separation and Recovery Method The multilayer ceramic capacitor 10B having the plating layer 34 is included in the post-sintering waste (sintering for the fired electrode layer) as in the first embodiment. Therefore, the multilayer ceramic capacitor 10B having the plating layer 34 can be input to the separation and recovery method of FIG. 1 described in the first embodiment. That is, in the preparation of the post-sintering waste in step (A), the multilayer ceramic capacitor 10B having the plating layer 34 can be prepared as the post-sintering waste. Thereafter, the first metal component, the second metal component, and the rare earth component can be separated and recovered from the multilayer ceramic capacitor 10B having the plating layer 34 by going through the separation and recovery method described in FIG. 1.
ただし、めっき層34を有する積層セラミックコンデンサ10Bのめっき層34を除去した上で、積層セラミックコンデンサ10Bから第1の金属成分、第2の金属成分、希土類成分を回収することもできる。 However, it is also possible to remove the plating layer 34 from the multilayer ceramic capacitor 10B having the plating layer 34, and then recover the first metal component, the second metal component, and the rare earth component from the multilayer ceramic capacitor 10B.
めっき層34を有する積層セラミックコンデンサ10Bからの各種成分の分離回収において、めっき除去工程を含まない図1の分離回収方法を用いるか、あるいは、めっき除去工程を含む図9の分離回収方法を用いるかは、例えば一例であるが次のように分けることができる。 When separating and recovering various components from a multilayer ceramic capacitor 10B having a plating layer 34, the method of separation and recovery shown in FIG. 1, which does not include a plating removal step, or the method of separation and recovery shown in FIG. 9, which includes a plating removal step, can be used, for example, as follows:
(2-2)めっき除去工程を含まない分離回収方法(図1)を用いる場合
めっき層34を有する積層セラミックコンデンサ10Bにおいて、第1、第2の下層めっき層34a1、34b1及び第1、第2の上層めっき層34a2、34b2に含まれる金属成分が、内部電極層16に含まれる第1の金属成分及び焼付電極層32に含まれる第2の金属成分の少なくともいずれかと同じであるとする。この場合、めっき層34を有する積層セラミックコンデンサ10Bは、図1の工程(A)の焼成後廃棄物として準備され、図1に示す分離回収方法により処理される。例えば、第1、第2の下層めっき層34a1、34b1の金属成分が内部電極層16に含まれる第1の金属成分と同じであり得る。さらに、第1、第2の上層めっき層34a2、34b2の金属成分が焼付電極層32に含まれる第2の金属成分と同じであり得る。あるいは、例えば、第1、第2の下層めっき層34a1、34b1の金属成分が焼付電極層32に含まれる第2の金属成分と同じであり得る。さらに、第1、第2の上層めっき層34a2、34b2の金属成分が内部電極層16に含まれる第1の金属成分と同じであり得る。この場合、めっき層34の第1及び第2の金属成分は、内部電極層16に含まれる第1の金属成分及び焼付電極層32に含まれる第2の金属成分とともに分離回収することができる。なお、セラミック層14からは希土類成分を分離回収することができる。
(2-2) In the case of using a separation and recovery method (FIG. 1) that does not include a plating removal step In a laminated ceramic capacitor 10B having a plating layer 34, the metal components contained in the first and second lower plating layers 34a 1 , 34b 1 and the first and second upper plating layers 34a 2 , 34b 2 are the same as at least one of the first metal component contained in the internal electrode layer 16 and the second metal component contained in the baked electrode layer 32. In this case, the laminated ceramic capacitor 10B having the plating layer 34 is prepared as waste after firing in step (A) of FIG. 1, and is treated by the separation and recovery method shown in FIG. 1. For example, the metal components of the first and second lower plating layers 34a 1 , 34b 1 may be the same as the first metal component contained in the internal electrode layer 16. Furthermore, the metal components of the first and second upper plating layers 34a 2 , 34b 2 may be the same as the second metal component contained in the baked electrode layer 32. Alternatively, for example, the metal components of the first and second lower plating layers 34a1 , 34b1 may be the same as the second metal component contained in the baked electrode layer 32. Furthermore, the metal components of the first and second upper plating layers 34a2 , 34b2 may be the same as the first metal component contained in the internal electrode layer 16. In this case, the first and second metal components of the plating layer 34 can be separated and recovered together with the first metal component contained in the internal electrode layer 16 and the second metal component contained in the baked electrode layer 32. It is to be noted that rare earth components can be separated and recovered from the ceramic layer 14.
さらに具体例を挙げて説明する。例えば、第1、第2の下層めっき層34a1、34b1がNi(又はCu)を主成分とするめっき層であるとする。また、第1、第2の上層めっき層34a2、34b2がCu(又はNi)を主成分とするめっき層であるとする。また、内部電極層16が第1の金属成分としてNiを含むとする。また、焼付電極層32が第2の金属成分としてCuを含むとする。この場合、第1、第2の下層めっき層34a1、34b1及び第1、第2の上層めっき層34a2、34b2が除去されない状態で積層セラミックコンデンサ10Bが、図1の工程(A)の焼成後廃棄物として準備される。その後、図1の分離回収方法における工程(B)以降の各工程を経ることにより、第1、第2の下層めっき層34a1、34b1及び第1、第2の上層めっき層34a2、34b2と内部電極層16と焼付電極層32とから、第1の金属成分であるNi及び第2の金属成分であるCuを分離回収することができる。なお、セラミック層14からは希土類成分を分離回収することができる。 Further, a specific example will be given for explanation. For example, the first and second lower plating layers 34a1 , 34b1 are plating layers mainly composed of Ni (or Cu). The first and second upper plating layers 34a2 , 34b2 are plating layers mainly composed of Cu (or Ni). The internal electrode layer 16 contains Ni as a first metal component. The baked electrode layer 32 contains Cu as a second metal component. In this case, the multilayer ceramic capacitor 10B is prepared as waste after firing in step (A) of FIG. 1 without removing the first and second lower plating layers 34a1 , 34b1 and the first and second upper plating layers 34a2 , 34b2 . 1, the first metal component Ni and the second metal component Cu can be separated and recovered from the first and second lower plating layers 34a1 , 34b1 and the first and second upper plating layers 34a2 , 34b2 , the internal electrode layer 16, and the baked electrode layer 32. Rare earth components can be separated and recovered from the ceramic layer 14.
(2-3)めっき除去工程を含む分離回収方法(図9)
一例として、めっき層34を有する積層セラミックコンデンサ10Bにおいて、第1、第2の下層めっき層34a1、34b1及び第1、第2の上層めっき層34a2、34b2に含まれる金属成分(第3の金属成分)が、内部電極層16に含まれる第1の金属成分及び焼付電極層32に含まれる第2の金属成分のいずれとも異なるとする。この場合、めっき層34を有する積層セラミックコンデンサ10Bは、図9の工程(A)の焼成後廃棄物として準備される。そして、工程(K)のめっき除去により第1、第2の下層めっき層34a1、34b1及び第1、第2の上層めっき層34a2、34b2が除去される。その後、めっき層34が除去された積層セラミックコンデンサ10Bは、図9に示す分離回収方法の工程(B)以降の各工程によりさらに処理される。これにより、めっき層34が除去された積層セラミックコンデンサ10Bから、内部電極層16を構成する第1の金属成分、焼付電極層32を構成する第2の金属成分、セラミック層14に含まれている希土類成分を分離回収することができる。
(2-3) Separation and recovery method including plating removal process (Figure 9)
As an example, in a multilayer ceramic capacitor 10B having a plating layer 34, the metal component (third metal component) contained in the first and second lower plating layers 34a 1 , 34b 1 and the first and second upper plating layers 34a 2 , 34b 2 is different from both the first metal component contained in the internal electrode layer 16 and the second metal component contained in the fired electrode layer 32. In this case, the multilayer ceramic capacitor 10B having the plating layer 34 is prepared as a post-sintering waste in step (A) of FIG. 9. Then, the first and second lower plating layers 34a 1 , 34b 1 and the first and second upper plating layers 34a 2 , 34b 2 are removed by plating removal in step (K). Thereafter, the multilayer ceramic capacitor 10B from which the plating layer 34 has been removed is further processed by each step after step (B) of the separation and recovery method shown in FIG. 9. This makes it possible to separate and recover the first metal component constituting the internal electrode layer 16, the second metal component constituting the fired electrode layer 32, and the rare earth component contained in the ceramic layer 14 from the multilayer ceramic capacitor 10B from which the plating layer 34 has been removed.
また、別の一例として、めっき層34を有する積層セラミックコンデンサ10Bにおいて、第1、第2の上層めっき層34a2、34b2に含まれる(第3の金属成分)が、内部電極層16に含まれる第1の金属成分及び焼付電極層32に含まれる第2の金属成分のいずれとも異なるとする。一方、第1、第2の下層めっき層34a1、34b1に含まれる金属成分が、内部電極層16に含まれる第1の金属成分及び焼付電極層32に含まれる第2の金属成分のいずれかと同じであるとする。この場合、めっき層34を有する積層セラミックコンデンサ10Bは、図9の工程(A)の焼成後廃棄物として準備される。そして、工程(K)のめっき除去により第1、第2の上層めっき層34a2、34b2が除去される。その後、第1、第2の上層めっき層34a2、34b2が除去された積層セラミックコンデンサ10Bは、図9に示す分離回収方法の工程(B)以降の各工程によりさらに処理される。これにより、第1、第2の上層めっき層34a2、34b2が除去された積層セラミックコンデンサ10Bから、第1、第2の下層めっき層34a1、34b1に含まれる金属成分(第1の金属成分又は第2の金属成分)、内部電極層16を構成する第1の金属成分、焼付電極層32を構成する第2の金属成分、セラミック層14に含まれている希土類成分を分離回収することができる。 As another example, in a laminated ceramic capacitor 10B having a plating layer 34, the (third metal component) contained in the first and second upper plating layers 34a 2 , 34b 2 is different from both the first metal component contained in the internal electrode layer 16 and the second metal component contained in the baked electrode layer 32. On the other hand, the metal components contained in the first and second lower plating layers 34a 1 , 34b 1 are the same as either the first metal component contained in the internal electrode layer 16 or the second metal component contained in the baked electrode layer 32. In this case, the laminated ceramic capacitor 10B having the plating layer 34 is prepared as waste after firing in step (A) of FIG. 9. Then, the first and second upper plating layers 34a 2 , 34b 2 are removed by plating removal in step (K). Thereafter, the multilayer ceramic capacitor 10B from which the first and second upper plating layers 34a2 , 34b2 have been removed is further processed by each step subsequent to step (B) of the separation and recovery method shown in Fig. 9. As a result, the metal components (first metal component or second metal component) contained in the first and second lower plating layers 34a1 , 34b1 , the first metal component constituting the internal electrode layer 16 , the second metal component constituting the fired electrode layer 32, and the rare earth components contained in the ceramic layer 14 can be separated and recovered from the multilayer ceramic capacitor 10B from which the first and second upper plating layers 34a2, 34b2 have been removed.
前記の別の一例についてさらに具体例を挙げて説明する。例えば、第1、第2の上層めっき層34a2、34b2に含まれる金属成分がSn(第3の金属成分の一例)を主成分とするめっき層であるとする。また、第1、第2の下層めっき層34a1、34b1に含まれる金属成分がNi(又はCu)を主成分とするめっき層であるとする。また、内部電極層16が第1の金属成分としてNiを含み、焼付電極層32が第2の金属成分としてCuを含むとする。この場合、めっき層34を有する積層セラミックコンデンサ10Bは、図9の工程(A)の焼成後廃棄物として準備される。そして、図9の工程(K)においてSnを主成分とする第1、第2の上層めっき層34a2、34b2を除去する。Snを主成分とする第1、第2の上層めっき層34a2、34b2は、めっき層34を有する積層セラミックコンデンサ10Bを例えば水酸化ナトリウム及び水酸化カリウム等のアンモニア水以外のアルカリ性の溶液に浸漬することにより除去することができる。この場合、Ni(又はCu)を主成分とする第1、第2の下層めっき層34a1、34b1は、第1、第2の上層めっき層34a2、34b2が除去されることにより当該アルカリ性の溶液に晒される。しかし、Ni(又はCu)を主成分とする第1、第2の下層めっき層34a1、34b1は当該アルカリ性の溶液により浸食され難い。また、Cuを主成分とする焼付電極層32も当該アルカリ性の溶液により浸食され難い。ここで、アンモニア水以外のアルカリ性の溶液は例えば約pH12に調整される。その後、図9の分離回収方法の工程(B)以降の各工程を経ることにより、第1、第2の下層めっき層34a1、34b1と内部電極層16と焼付電極層32とから、第1の金属成分であるNi及び第2の金属成分であるCuを分離回収することができる。なお、セラミック層14からは希土類成分を分離回収することができる。 The above-mentioned other example will be described with a further specific example. For example, the metal component contained in the first and second upper plating layers 34a 2 , 34b 2 is a plating layer mainly composed of Sn (an example of a third metal component). Also, the metal component contained in the first and second lower plating layers 34a 1 , 34b 1 is a plating layer mainly composed of Ni (or Cu). Also, the internal electrode layer 16 contains Ni as the first metal component, and the fired electrode layer 32 contains Cu as the second metal component. In this case, the multilayer ceramic capacitor 10B having the plating layer 34 is prepared as waste after firing in step (A) of FIG. 9. Then, in step (K) of FIG. 9, the first and second upper plating layers 34a 2 , 34b 2 mainly composed of Sn are removed. The first and second upper plating layers 34a 2 , 34b 2 mainly composed of Sn can be removed by immersing the laminated ceramic capacitor 10B having the plating layer 34 in an alkaline solution other than ammonia water, such as sodium hydroxide and potassium hydroxide. In this case, the first and second lower plating layers 34a 1 , 34b 1 mainly composed of Ni (or Cu) are exposed to the alkaline solution by removing the first and second upper plating layers 34a 2 , 34b 2. However, the first and second lower plating layers 34a 1 , 34b 1 mainly composed of Ni (or Cu ) are not easily corroded by the alkaline solution. In addition, the baked electrode layer 32 mainly composed of Cu is also not easily corroded by the alkaline solution. Here, the alkaline solution other than ammonia water is adjusted to, for example, about pH 12. 9, the first metal component Ni and the second metal component Cu can be separated and recovered from the first and second lower plating layers 34a1 , 34b1 , the internal electrode layer 16, and the baked electrode layer 32. Rare earth components can be separated and recovered from the ceramic layer 14.
上記の別の一例の具体例では、工程(K)において第1、第2の上層めっき層34a2、34b2のみを除去している。しかし、第1、第2の上層めっき層34a2、34b2及び第1、第2の下層めっき層34a1、34b1の両方を除去してもよい。例えば、第1、第2の上層めっき層34a2、34b2に含まれる金属成分がSn(第3の金属成分の一例)を主成分とするめっき層であるとする。また、第1、第2の下層めっき層34a1、34b1に含まれる金属成分がCuではなくNiを主成分とするめっき層であるとする。また、内部電極層16が第1の金属成分としてNiを含み、焼付電極層32が第2の金属成分としてCuを含むとする。この場合、めっき層34を有する積層セラミックコンデンサ10Bは、図9の工程(A)の焼成後廃棄物として準備される。そして、図9の工程(K)においてSnを主成分とする第1、第2の上層めっき層34a2、34b2及びNiを主成分とする第1、第2の下層めっき層34a1、34b1を除去する。Snを主成分とする第1、第2の上層めっき層34a2、34b2及びNiを主成分とする第1、第2の下層めっき層34a1、34b1は、めっき層34を有する積層セラミックコンデンサ10Bを例えば塩酸及び希硫酸等の酸化力を持たない酸性の溶液に浸漬することにより除去することができる。この場合、Cuを主成分とする焼付電極層32は、めっき層34が除去されることにより当該酸性の溶液に晒される。しかし、Cuを主成分とする焼付電極層32は当該酸性の溶液により浸食され難い。ここで、酸性の溶液は例えば約pH2に調整される。その後、図9の分離回収方法の工程(B)以降の各工程を経ることにより、内部電極層16と焼付電極層32とから、第1の金属成分であるNi及び第2の金属成分であるCuを分離回収することができる。なお、セラミック層14からは希土類成分を分離回収することができる。 In the specific example of the above-mentioned other example, only the first and second upper plating layers 34a 2 , 34b 2 are removed in the step (K). However, both the first and second upper plating layers 34a 2 , 34b 2 and the first and second lower plating layers 34a 1 , 34b 1 may be removed. For example, the metal component contained in the first and second upper plating layers 34a 2 , 34b 2 is a plating layer mainly composed of Sn (an example of a third metal component). Also, the metal component contained in the first and second lower plating layers 34a 1 , 34b 1 is a plating layer mainly composed of Ni, not Cu. Also, the internal electrode layer 16 contains Ni as the first metal component, and the fired electrode layer 32 contains Cu as the second metal component. In this case, the multilayer ceramic capacitor 10B having the plating layer 34 is prepared as a post-sintering waste in the step (A) of FIG. 9. 9, the first and second upper plating layers 34a 2 , 34b 2 mainly composed of Sn and the first and second lower plating layers 34a 1 , 34b 1 mainly composed of Ni are removed. The first and second upper plating layers 34a 2 , 34b 2 mainly composed of Sn and the first and second lower plating layers 34a 1 , 34b 1 mainly composed of Ni can be removed by immersing the laminated ceramic capacitor 10B having the plating layer 34 in an acidic solution that does not have oxidizing power , such as hydrochloric acid or dilute sulfuric acid. In this case, the baked electrode layer 32 mainly composed of Cu is exposed to the acidic solution by removing the plating layer 34. However, the baked electrode layer 32 mainly composed of Cu is not easily corroded by the acidic solution. Here, the acidic solution is adjusted to, for example, about pH 2. 9, the first metal component Ni and the second metal component Cu can be separated and recovered from the internal electrode layer 16 and the fired electrode layer 32. The rare earth component can be separated and recovered from the ceramic layer 14.
前記においては、Snを主成分とする第1、第2の上層めっき層34a2、34b2及びNiを主成分とする第1、第2の下層めっき層34a1、34b1は、酸化力を持たない酸性の溶液により一度に除去される。しかし、これらを順に除去してもよい。まず、積層セラミックコンデンサ10Bを例えば水酸化ナトリウム及び水酸化カリウム等のアンモニア水以外のアルカリ性の溶液(例えば約pH12)に浸漬することにより、Snを主成分とする第1、第2の上層めっき層34a2、34b2を除去する。その後、積層セラミックコンデンサ10Bを例えば塩酸及び希硫酸等の酸化力を持たない酸性の溶液(例えば約pH2)に浸漬することにより、Niを主成分とする第1、第2の下層めっき層34a1、34b1を除去する。その後、図9の分離回収方法の工程(B)以降の各工程を経ることにより、内部電極層16と焼付電極層32とから、第1の金属成分であるNi及び第2の金属成分であるCuを分離回収することができる。なお、セラミック層14からは希土類成分を分離回収することができる。 In the above, the first and second upper plating layers 34a2 , 34b2 mainly composed of Sn and the first and second lower plating layers 34a1 , 34b1 mainly composed of Ni are removed at the same time by the non-oxidizing acidic solution. However, they may be removed in order. First, the multilayer ceramic capacitor 10B is immersed in an alkaline solution (e.g., about pH 12) other than ammonia water, such as sodium hydroxide and potassium hydroxide, to remove the first and second upper plating layers 34a2 , 34b2 mainly composed of Sn. Then, the multilayer ceramic capacitor 10B is immersed in an acidic solution (e.g., about pH 2) other than ammonia water, such as hydrochloric acid and dilute sulfuric acid, to remove the first and second lower plating layers 34a1 , 34b1 mainly composed of Ni. 9, the first metal component Ni and the second metal component Cu can be separated and recovered from the internal electrode layer 16 and the fired electrode layer 32. The rare earth component can be separated and recovered from the ceramic layer 14.
3.作用効果
めっき層34を有する第2の実施の形態に係る積層セラミックコンデンサ10A、10Bからも、第1の実施の形態と同様に、図1又は図9に示す分離回収方法により内部電極層16を構成する第1の金属成分、外部電極30を構成する第2の金属成分、セラミック層14に含まれている希土類成分を分離回収することができる。また、めっき層34からの金属成分の分離回収に適した分離回収方法を採用することにより、めっき層34からも第1の金属成分及び第2の金属成分を回収できる場合がある。
3. Effects As in the first embodiment, from the multilayer ceramic capacitors 10A and 10B according to the second embodiment having the plating layer 34, the first metal component constituting the internal electrode layer 16, the second metal component constituting the external electrode 30, and the rare earth component contained in the ceramic layer 14 can be separated and recovered by the separation and recovery method shown in Fig. 1 or 9. Furthermore, by employing a separation and recovery method suitable for separating and recovering the metal components from the plating layer 34, the first metal component and the second metal component can also be recovered from the plating layer 34 in some cases.
なお、以上のように、本発明の実施の形態は、前記記載で開示されているが、本発明は、これに限定されるものではない。
すなわち、本発明の技術的思想及び目的の範囲から逸脱することなく、以上説明した実施の形態に対し、機序、形状、材質、数量、位置又は配置等に関して、様々の変更を加えることができるものであり、それらは、本発明に含まれるものである。
As described above, the embodiment of the present invention has been disclosed in the above description, but the present invention is not limited thereto.
In other words, various modifications can be made to the above-described embodiments in terms of mechanism, shape, material, quantity, position, arrangement, etc. without departing from the scope of the technical idea and purpose of the present invention, and these are included in the present invention.
<その他の変形例> <Other variations>
(1)工程(B)における水系溶媒によるスラリーの生成
上記の第1及び第2の実施の形態では、工程(B)において焼成後廃棄物を粉砕して微細化している。しかし、焼成後廃棄物を微細化できればよく、工程(B)の微細化(特に、粉砕による微細化)とともに、又は工程(B)の微細化(特に、粉砕による微細化)の代わりに、焼成後廃棄物を溶媒(例えば水系溶媒等の溶媒)により分散したスラリー状態とすることにより微細化してもよい。ここで、焼成後廃棄物と溶媒とを混合してスラリー状とする微細化を湿式微細化という。また、湿式微細化の中でも、焼成後廃棄物と溶媒とを混合して生成したスラリーの中で粉砕する微細化を湿式粉砕というものとする。なお、水系溶媒としては、例えば水を用いることができる。
(1) Generation of slurry by aqueous solvent in step (B) In the above-mentioned first and second embodiments, the calcination waste is pulverized and refined in step (B). However, as long as the calcination waste can be refined, the calcination waste may be refined by dispersing it in a solvent (e.g., an aqueous solvent or other solvent) in addition to the refinement in step (B) (particularly, refinement by pulverization), or instead of the refinement in step (B) (particularly, refinement by pulverization), in the slurry state. Here, the refinement in which the calcination waste is mixed with a solvent to form a slurry is called wet refinement. In addition, among the wet refinement, the refinement in which the calcination waste is pulverized in the slurry generated by mixing the calcination waste with a solvent is called wet grinding. In addition, as the aqueous solvent, for example, water can be used.
また、上記の第1及び第2の実施形態では、工程(C)の磁性分離の際に、工程(B)において微細化された後の焼成後廃棄物を水等の水系溶媒と混合して分散することによりスラリー状態とすることもできる。しかし、前述のように工程(B)の微細化とともに、又は工程(B)の微細化の代わりに、焼成後廃棄物を水系溶媒を用いてスラリー状態とした場合には、このスラリー状態となった焼成後廃棄物を工程(C)において磁性分離してもよい。つまり、工程(C)の磁性分離においてスラリー状態を生成する手間を省略することができる。 In addition, in the first and second embodiments described above, during magnetic separation in step (C), the calcined waste after being pulverized in step (B) can be mixed with an aqueous solvent such as water and dispersed to form a slurry state. However, as described above, when the calcined waste is made into a slurry state using an aqueous solvent in addition to or instead of the pulverization in step (B), the calcined waste in this slurry state can be magnetically separated in step (C). In other words, the effort of generating a slurry state in the magnetic separation in step (C) can be omitted.
なお、焼成後廃棄物を有機溶媒を用いてスラリー状とすることも考えられる。しかし、有機溶媒を用いて焼成後廃棄物をスラリー状とした場合には、分離回収方法において有機溶媒を除去する工程が必要がある。よって、焼成後廃棄物を水等の水系溶媒を用いてスラリー状とすることが好ましい。 It is also possible to make the post-calcination waste into a slurry using an organic solvent. However, if the post-calcination waste is made into a slurry using an organic solvent, a process for removing the organic solvent is required in the separation and recovery method. Therefore, it is preferable to make the post-calcination waste into a slurry using an aqueous solvent such as water.
(2)焼成後廃棄物に含まれるその他の例
上記の第1及び第2の実施の形態では、焼成後廃棄物は、(工程7)の焼付電極層用の焼成を経た後の廃棄物である。しかし、焼成後廃棄物はこれに限定されない。焼成後廃棄物には、焼付電極層用の焼成が行われる前の廃棄物が、図1、図9の分離回収方法に投入される前に焼成されたものが含まれてもよい。この場合の焼成は、焼付電極層用の焼成における焼成温度で行われていることが好ましい。
(2) Other examples of waste after firing In the first and second embodiments described above, the waste after firing is waste after firing for the fired electrode layer in (step 7). However, the waste after firing is not limited to this. The waste after firing may include waste that has not been fired for the fired electrode layer and has been fired before being input to the separation and recovery method of FIG. 1 and FIG. 9. In this case, the firing is preferably performed at the firing temperature for the fired electrode layer.
焼付電極層用の焼成が行われる前の廃棄物としては、例えば(工程1)~(工程6)において排出された廃棄物が挙げられる。また、焼付電極層用の焼成が行われる前の廃棄物としては、(工程7)において焼付電極層用ペーストが積層体12に塗布された後であって、未だ焼付電極層用の焼成が行われていない廃棄物が含まれていてもよい。具体的に、焼付電極層用の焼成が行われる前の廃棄物としては、例えば、(工程1)では誘電体スラリー、内部電極層用の導電性ペーストの廃棄物、(工程2)では内部電極層のパターンが形成された誘電体シートの廃棄物、内部電極層のパターンが印刷されていない誘電体シート、(工程4)では積層ブロックがカットされた後に排出される、積層ブロックの端切れなどの余分な積層ブロック、カットされた後の積層チップの不良品、(工程5)の脱脂後の廃棄物、(工程6)の積層チップの焼成後の廃棄物等を挙げることができる。 Waste before firing for the baked electrode layer includes, for example, waste discharged in (step 1) to (step 6). In addition, waste before firing for the baked electrode layer may include waste after the paste for the baked electrode layer is applied to the laminate 12 in (step 7) but before firing for the baked electrode layer. Specifically, waste before firing for the baked electrode layer includes, for example, waste of dielectric slurry and conductive paste for the internal electrode layer in (step 1), waste of dielectric sheets on which the pattern of the internal electrode layer is formed in (step 2), dielectric sheets on which the pattern of the internal electrode layer is not printed, excess laminate blocks such as scraps of laminate blocks discharged after the laminate blocks are cut in (step 4), defective laminate chips after cutting, waste after degreasing in (step 5), and waste after firing of laminate chips in (step 6).
(3)焼成後廃棄物が排出されるその他の積層セラミックコンデンサ
上記の第1及び第2の実施の形態では、製造する積層セラミックコンデンサとして、第1の外部電極30a及び第2の外部電極30bの2つの端子を有する2端子型積層セラミックコンデンサを説明した。しかし、本発明の適用範囲は、2端子型積層セラミックコンデンサの焼成後廃棄物に限定されない。本発明の適用対象は、Ni等の第1の金属成分を含む内部電極層と、Cu等の第2の金属成分を含む外部電極と、BaTiO3等の誘電体材料及びDy等の添加剤である希土類成分を含むセラミック層と、を有する積層セラミックコンデンサの焼成後廃棄物である。よって、本発明は、例えば、3端子型積層セラミックコンデンサの焼成後廃棄物に適用されてもよい。
(3) Other Multilayer Ceramic Capacitors Discharged with Post-Firing Waste In the above first and second embodiments, a two-terminal multilayer ceramic capacitor having two terminals, the first external electrode 30a and the second external electrode 30b, has been described as a multilayer ceramic capacitor to be manufactured. However, the scope of application of the present invention is not limited to the post-firing waste of a two-terminal multilayer ceramic capacitor. The subject of application of the present invention is the post-firing waste of a multilayer ceramic capacitor having an internal electrode layer containing a first metal component such as Ni, an external electrode containing a second metal component such as Cu, and a ceramic layer containing a dielectric material such as BaTiO3 and a rare earth component that is an additive such as Dy. Therefore, the present invention may be applied to, for example, the post-firing waste of a three-terminal multilayer ceramic capacitor.
例えば、3端子型積層セラミックコンデンサは、上記の第1及び第2の実施の形態と同様の積層体12と、第1~第4の外部電極と、を有する。内部電極層16は、第1の端面12e及び第2の端面12fに引き出される第1の内部電極層と、第1の側面12c及び第2の側面12dに引き出される第2の内部電極層と、を有する。積層体12の第1の端面12eには第1の外部電極が配置される。第1の外部電極は、積層体12の第1の端面12eにおいて露出している第1の内部電極層に電気的に接続されている。積層体12の第2の端面12fには第2の外部電極が配置される。第2の外部電極は、積層体12の第2の端面12fにおいて露出している第1の内部電極層に電気的に接続されている。積層体12の第1の側面12cには第3の外部電極が配置される。第3の外部電極は、積層体12の第1の側面12cにおいて露出している第2の内部電極層に電気的に接続されている。積層体12の第2の側面12dには、第4の外部電極が配置される。第4の外部電極は、積層体12の第2の側面12dにおいて露出している第2の内部電極層に電気的に接続されている。第1~第4の外部電極は、焼付電極層のみを含んでいてもよいし、焼付電極層及びめっき層を含んでいてもよい。 For example, a three-terminal multilayer ceramic capacitor has a laminate 12 similar to those of the first and second embodiments described above, and first to fourth external electrodes. The internal electrode layer 16 has a first internal electrode layer extended to the first end face 12e and the second end face 12f, and a second internal electrode layer extended to the first side face 12c and the second side face 12d. A first external electrode is disposed on the first end face 12e of the laminate 12. The first external electrode is electrically connected to the first internal electrode layer exposed at the first end face 12e of the laminate 12. A second external electrode is disposed on the second end face 12f of the laminate 12. The second external electrode is electrically connected to the first internal electrode layer exposed at the second end face 12f of the laminate 12. A third external electrode is disposed on the first side face 12c of the laminate 12. The third external electrode is electrically connected to the second internal electrode layer exposed at the first side surface 12c of the laminate 12. A fourth external electrode is disposed on the second side surface 12d of the laminate 12. The fourth external electrode is electrically connected to the second internal electrode layer exposed at the second side surface 12d of the laminate 12. The first to fourth external electrodes may include only a baked electrode layer, or may include a baked electrode layer and a plating layer.
(4)工程(F)のろ過について
工程(D)において第2の分離物を酸化力を持たない鉱酸に溶解すると、第2の分離物に含まれるセラミック微細化物は酸化力を持たない鉱酸と反応することにより未溶解物となり沈殿する。また、Cu等の第2の金属微細化物は、酸化力を持たない鉱酸に含まれる水素イオンよりもイオン化傾向が小さいため酸化力を持たない鉱酸には溶解しない。一方、希土類含有物中の希土類成分は溶解して希土類成分含有溶液が生成される。この未溶解物を含む希土類成分含有溶液を希土類成分として回収することもできる。この場合、ろ過等の固液分離の工程(F)を省略可能である。
(4) Filtration in step (F) When the second separated material is dissolved in a mineral acid having no oxidizing power in step (D), the ceramic fine particles contained in the second separated material react with the mineral acid having no oxidizing power to become undissolved and precipitate. In addition, the second metal fine particles such as Cu have a smaller ionization tendency than the hydrogen ions contained in the mineral acid having no oxidizing power, so they do not dissolve in the mineral acid having no oxidizing power. On the other hand, the rare earth components in the rare earth-containing material dissolve to produce a rare earth component-containing solution. The rare earth component-containing solution containing the undissolved materials can also be recovered as the rare earth components. In this case, the solid-liquid separation step (F) such as filtration can be omitted.
(5)工程(G)の中和の省略
上記の第1及び第2の実施の形態では、工程(D)第2の分離物の溶解において、希土類成分は希土類成分含有溶液として分離回収することができる。よって、工程(G)の中和を省略可能である。
(5) Omission of neutralization in step (G) In the first and second embodiments described above, in dissolving the second separated product in step (D), the rare earth components can be separated and recovered as a rare earth component-containing solution. Therefore, the neutralization in step (G) can be omitted.
(6)工程(I)、工程(J)の各種処理の省略
上記の第1及び第2の実施の形態では、工程(C)の磁性分離において、第1の金属微細化物を含む第1の分離物を第1の金属成分として分離回収することができる。よって、工程(I)、工程(J)を省略可能である。また、工程(I)の第1の分離物の溶解において、第1の金属溶液を第1の金属成分として分離回収することができる。よって、工程(J)のろ過を省略可能である。
(6) Omission of various treatments in steps (I) and (J) In the above first and second embodiments, in the magnetic separation in step (C), the first separated material containing the first metal fine particles can be separated and recovered as the first metal component. Therefore, steps (I) and (J) can be omitted. Also, in the dissolution of the first separated material in step (I), the first metal solution can be separated and recovered as the first metal component. Therefore, the filtration in step (J) can be omitted.
(7)希土類成分のその他の分離回収方法
上記の第1及び第2の実施の形態では、工程(G)の中和においてDy(OH)3等の希土類成分化合物が希土類成分として分離回収される。しかし、希土類成分の分離回収はこれに限定されない。例えば、一例であるが、希土類成分は次のように回収することができる。
(7) Other methods for separating and recovering rare earth components In the first and second embodiments described above, rare earth component compounds such as Dy(OH) 3 are separated and recovered as rare earth components in the neutralization step (G). However, the method for separating and recovering rare earth components is not limited to this. For example, the rare earth components can be recovered as follows.
(a)
工程(G)の中和により得られた希土類成分化合物を熱処理して酸化物を生成することにより当該酸化物を希土類成分として回収することができる。
例えば、工程(G)の中和を経た後に得られる希土類成分化合物がDy(OH)3である場合、Dy(OH)3を熱処理することにより酸化ジスプロシウム(Dy2O3)を希土類成分として回収することができる。
(a)
The rare earth component compound obtained by neutralization in step (G) is heat-treated to produce an oxide, and the oxide can be recovered as the rare earth component.
For example, when the rare earth component compound obtained after the neutralization in step (G) is Dy(OH) 3 , dysprosium oxide (Dy 2 O 3 ) can be recovered as the rare earth component by heat treating Dy(OH) 3 .
(b)
工程(G)の中和により得られた希土類成分化合物を塩酸に溶解して塩化物を生成することにより当該塩化物を希土類成分として回収することができる。
例えば、工程(G)の中和を経た後に得られる希土類成分化合物がDy(OH)3である場合、Dy(OH)3を塩酸に溶解することにより塩化ジスプロシウム(DyCl3)溶液を生成する。塩化ジスプロシウム溶液を留去して溶媒を蒸発させることにより、塩化ジスプロシウム6水和物(DyCl3・6H2O)を希土類成分として回収することができる。
(b)
The rare earth component compound obtained by neutralization in step (G) is dissolved in hydrochloric acid to produce a chloride, and the chloride can be recovered as the rare earth component.
For example, when the rare earth component compound obtained after the neutralization in step (G) is Dy(OH) 3 , Dy(OH) 3 is dissolved in hydrochloric acid to produce a dysprosium chloride ( DyCl3 ) solution. The dysprosium chloride solution is distilled to evaporate the solvent, and dysprosium chloride hexahydrate ( DyCl3.6H2O ) can be recovered as the rare earth component.
(c)
また、前述の(b)と同様に工程(G)の中和を経た後に得られる希土類成分化合物であるDy(OH)3を塩酸に溶解することにより塩化ジスプロシウム溶液を生成する。その後、さらに精製することにより高純度の希土類成分を回収することができる。
例えば、前述のように生成された塩化ジスプロシウム溶液を溶媒抽出により精製し、高純度の塩化ジスプロシウム溶液を希土類成分として回収することができる。溶媒抽出とは、互いに混ざり合わない液体である油相及び水相の一方に溶解している溶質を他方へ移動させる、溶質の分配を利用した分離精製法である。溶媒抽出以外の方法としては、例えばイオン交換樹脂法等を用いることができる。
(c)
Similarly to the above (b), the rare earth component compound Dy(OH) 3 obtained after neutralization in step (G) is dissolved in hydrochloric acid to produce a dysprosium chloride solution, which is then further purified to recover high-purity rare earth components.
For example, the dysprosium chloride solution produced as described above can be purified by solvent extraction, and a high-purity dysprosium chloride solution can be recovered as a rare earth component. Solvent extraction is a separation and purification method that utilizes the partitioning of solutes, in which a solute dissolved in one of the oil phase and the water phase, which are immiscible liquids, is transferred to the other phase. As a method other than solvent extraction, for example, an ion exchange resin method can be used.
(d)
また、前述の(c)の溶媒抽出により得られた高純度の塩化ジスプロシウム溶液から高純度の酸化ジスプロシウム(Dy2O3)を回収することができる。この場合、例えば、まず高純度の塩化ジスプロシウム溶液にシュウ酸を添加してシュウ酸ジスプロシウムを沈殿させる。これをろ過することにより、高純度のシュウ酸ジスプロシウム6水和物(Dy2(C2O4)3・6H2O)を回収する。この高純度のシュウ酸ジスプロシウム6水和物を熱処理することにより、高純度の酸化ジスプロシウム(Dy2O3)を希土類成分として回収することができる。
(d)
Also, high-purity dysprosium oxide ( Dy2O3 ) can be recovered from the high-purity dysprosium chloride solution obtained by the solvent extraction in (c) above. In this case, for example , first, oxalic acid is added to the high-purity dysprosium chloride solution to precipitate dysprosium oxalate. By filtering this, high-purity dysprosium oxalate hexahydrate ( Dy2 ( C2O4 ) 3.6H2O ) is recovered . By heat-treating this high-purity dysprosium oxalate hexahydrate, high-purity dysprosium oxide ( Dy2O3 ) can be recovered as a rare earth component.
(e)
また、前述の(c)の溶媒抽出により得られた高純度の塩化ジスプロシウム溶液から高純度の塩化ジスプロシウム6水和物を回収することができる。この場合、例えば、高純度の塩化ジスプロシウム溶液を留去して溶媒を蒸発させることにより高純度の塩化ジスプロシウム6水和物を回収する。
(e)
Also, high-purity dysprosium chloride hexahydrate can be recovered from the high-purity dysprosium chloride solution obtained by the solvent extraction in (c) above. In this case, for example, high-purity dysprosium chloride hexahydrate is recovered by distilling off the high-purity dysprosium chloride solution and evaporating the solvent.
(f)希土類成分の状態
回収した希土類成分の状態は、液体状態、固体状態、液体及び固体の混合状態のいずれであってもよい。また、希土類成分の結晶格子は、非晶質の状態、結晶質の状態、非晶質及び結晶質が混在した状態のいずれであってもよい。
(f) State of the rare earth component The state of the recovered rare earth component may be any of a liquid state, a solid state, and a mixed state of liquid and solid. In addition, the crystal lattice of the rare earth component may be any of an amorphous state, a crystalline state, and a mixed state of amorphous and crystalline.
(8)第1の金属成分のその他の分離回収方法
上記の第1及び第2の実施の形態では、工程(I)の第1の分離物の溶解において第1の金属微細化物を鉱酸に溶解している。そして、第1の金属溶液を第1の金属成分として分離回収している。また、続く工程(J)のろ過において、沈殿しているセラミック微細化物を含む第1の金属溶液をろ過することにより、セラミック微細化物が除去された第1の金属溶液が第1の金属成分として分離回収される。しかし、第1の金属成分の分離回収はこれに限定されない。例えば、一例であるが、第1の金属成分は次のように回収することができる。
(8) Other methods for separating and recovering the first metal component In the first and second embodiments described above, the first metal fine particles are dissolved in a mineral acid in the dissolution of the first separated product in step (I). The first metal solution is then separated and recovered as the first metal component. In the subsequent filtering step (J), the first metal solution containing the precipitated ceramic fine particles is filtered, and the first metal solution from which the ceramic fine particles have been removed is separated and recovered as the first metal component. However, the separation and recovery of the first metal component is not limited to this. For example, the first metal component can be recovered as follows.
(a)
第1の金属溶液を晶析することにより第1の金属成分化合物を第1の金属成分として回収することができる。
例えば、工程(I)の第1の金属微細化物の溶解を経た後に得られる第1の金属溶液が硫酸ニッケル(NiSO4)溶液である場合、硫酸ニッケル溶液を晶析させるとともにろ過することにより硫酸ニッケル六水和物(NiSO4・6H2O)を第1の金属成分として回収することができる。
(a)
The first metal component compound can be recovered as the first metal component by crystallizing the first metal solution.
For example, when the first metal solution obtained after dissolving the first metal fine particles in step (I) is a nickel sulfate ( NiSO4 ) solution, nickel sulfate hexahydrate ( NiSO4.6H2O ) can be recovered as the first metal component by crystallizing and filtering the nickel sulfate solution.
(b)
工程(I)の第1の金属微細化物の溶解を経た後に得られる第1の金属溶液を精製することにより高純度の第1の金属成分を回収することができる。
例えば、第1の金属溶液である硫酸ニッケル(NiSO4)溶液をイオン交換樹脂法、溶媒抽出法等により精製し、高純度の硫酸ニッケル溶液を第1の金属成分として回収することができる。
(b)
The first metal solution obtained after dissolving the finely divided first metal product in step (I) can be purified to recover a high-purity first metal component.
For example, a nickel sulfate (NiSO 4 ) solution, which is the first metal solution, can be purified by an ion exchange resin method, a solvent extraction method, or the like, and a high-purity nickel sulfate solution can be recovered as the first metal component.
(c)
前述の(b)で回収された高純度の硫酸ニッケル溶液を晶析させるとともにろ過することにより硫酸ニッケル六水和物(NiSO4・6H2O)を第1の金属成分として回収することができる。
(c)
The high-purity nickel sulfate solution recovered in the above-mentioned (b) is crystallized and filtered, whereby nickel sulfate hexahydrate (NiSO 4 .6H 2 O) can be recovered as the first metal component.
(d)
工程(I)の第1の金属微細化物の溶解を経た後に得られる第1の金属溶液を前述の(b)とは異なる方法で精製することにより高純度の第1の金属成分を回収することができる。
例えば、第1の金属溶液である硫酸ニッケル溶液から、例えば電解析出法等の溶液から当該溶液に溶解している固体を析出させる方法により固体の高純度のNiを析出させて第1の金属成分として回収することができる。
(d)
The first metal solution obtained after dissolving the first metal fine particles in step (I) can be purified by a method other than the above-mentioned (b) to recover a high-purity first metal component.
For example, from a nickel sulfate solution, which is a first metal solution, solid high-purity Ni can be precipitated by a method of precipitating a solid dissolved in the solution, such as electrolytic deposition, and recovered as the first metal component.
(e)
前述の(d)で回収された高純度のNiを処理することにより塩化ニッケル六水和物(NiCl2・6H2O)を第1の金属成分として回収することができる。例えば、前述の(d)で回収された高純度のNiを塩酸に溶解することにより高純度の塩化ニッケル(NiCl2)溶液を生成する。塩化ニッケル溶液を噴霧乾燥することにより、高純度の塩化ニッケル六水和物を生成する。さらに高純度の塩化ニッケル六水和物を熱風乾燥することによりさらに高純度の塩化ニッケル六水和物を第1の金属成分として回収することができる。
(e)
By treating the high-purity Ni recovered in the above (d) , nickel chloride hexahydrate ( NiCl2.6H2O ) can be recovered as the first metal component. For example, by dissolving the high-purity Ni recovered in the above (d) in hydrochloric acid, a high-purity nickel chloride ( NiCl2 ) solution is produced. By spray-drying the nickel chloride solution, high-purity nickel chloride hexahydrate is produced. By further drying the high-purity nickel chloride hexahydrate with hot air, even higher purity nickel chloride hexahydrate can be recovered as the first metal component.
(f)
工程(I)の第1の金属微細化物の溶解を経た後に得られる第1の金属溶液を中和して塩化物を生成することにより当該塩化物を第1の金属成分として回収することができる。
例えば、第1の金属溶液である硫酸ニッケル溶液を水酸化ナトリウム、水酸化カリウムなどのアルカリにより例えば約pH10(pH9以上pH11以下)となるように調整して中和し、水酸化ニッケル(Ni(OH)2)を沈殿させる。沈殿した水酸化ニッケル(Ni(OH)2)は例えばろ過することにより分離回収される。さらに、水酸化ニッケルを塩酸に溶解することにより、塩化ニッケル(NiCl2)溶液を生成する。次に、塩化ニッケル溶液を留去して溶媒を蒸発させることにより、塩化ニッケル6水和物(NiCl2・6H2O)を第1の金属成分として回収することができる。
(f)
The first metal solution obtained after dissolving the finely divided first metal product in step (I) is neutralized to generate a chloride, and the chloride can be recovered as the first metal component.
For example, a nickel sulfate solution, which is a first metal solution, is neutralized by adjusting the pH to, for example, about 10 (pH 9 or more and pH 11 or less) with an alkali such as sodium hydroxide or potassium hydroxide, and nickel hydroxide (Ni(OH) 2 ) is precipitated. The precipitated nickel hydroxide (Ni(OH) 2 ) is separated and recovered, for example, by filtration. Furthermore, nickel hydroxide is dissolved in hydrochloric acid to produce a nickel chloride ( NiCl2 ) solution. Next, nickel chloride hexahydrate ( NiCl2.6H2O ) can be recovered as the first metal component by distilling off the nickel chloride solution and evaporating the solvent.
(g)第1の金属成分の状態
回収した金属成分の状態は、液体状態、固体状態、液体及び固体の混合状態のいずれであってもよい。また、金属成分の結晶格子は、非晶質の状態、結晶質の状態、非晶質及び結晶質が混在した状態のいずれであってもよい。
(g) State of the first metal component The state of the recovered metal component may be any of a liquid state, a solid state, and a mixed state of liquid and solid. In addition, the crystal lattice of the metal component may be any of an amorphous state, a crystalline state, and a mixed state of amorphous and crystalline.
(9)積層セラミックコンデンサのその他の製造工程
上記の第1及び第2の実施の形態では、積層セラミックコンデンサ10の製造方法には、(工程3)の積層ブロックの形成、(工程4)の積層チップへのカット、(工程5)の脱脂、(工程6)の積層チップの焼成、(工程7)の焼付電極層用ペーストの塗布及び焼成が順に含まれている。しかし、積層セラミックコンデンサ10の製造方法はこれに限定されず、例えば、工程5の脱脂前であり、工程6の焼成(積層チップの焼成)前の未焼成の積層チップに対して焼付電極層用ペーストを塗布した後に脱脂、及び、焼付電極層の焼成を行う場合がある。つまり、まず、工程5の脱脂前の積層チップに対して、Ni、ガラス成分、樹脂成分等を含む焼付電極層用ペーストを塗布する。次に、焼付電極層用ペーストが塗布された積層チップを脱脂し、さらにその後に焼付電極層用の焼成が行われる。脱脂時の温度は、例えば、800℃より高く、1000℃以下であることが好ましい。焼付電極層用の焼成温度は、例えば、1000℃より高く、1400℃以下であることが好ましい。これらの工程は、上記の製造方法の工程4の積層チップへのカットの後であり工程8のめっき工程の前に行われる。そして、これらの工程では、上記の工程6の積層チップの焼成と工程7の焼付電極層用ペーストの焼成とを一度の焼成で行っている。
(9) Other manufacturing steps of the multilayer ceramic capacitor In the above first and second embodiments, the manufacturing method of the multilayer ceramic capacitor 10 includes the formation of a laminated block (step 3), cutting into laminated chips (step 4), degreasing (step 5), firing of the laminated chips (step 6), and application and firing of the baked electrode layer paste (step 7) in that order. However, the manufacturing method of the multilayer ceramic capacitor 10 is not limited to this, and for example, before the degreasing in step 5 and before the firing (firing of the laminated chips) in step 6, the baked electrode layer paste may be applied to the unfired laminated chips, and then the degreasing and firing of the baked electrode layers may be performed. That is, first, the baked electrode layer paste containing Ni, glass components, resin components, etc. is applied to the laminated chips before the degreasing in step 5. Next, the laminated chips to which the baked electrode layer paste has been applied are degreased, and then the baked electrode layers are fired. The temperature during degreasing is preferably, for example, higher than 800° C. and lower than 1000° C. The firing temperature for the fired electrode layer is preferably, for example, higher than 1000° C. and not higher than 1400° C. These steps are performed after cutting into laminated chips in step 4 of the above-mentioned manufacturing method and before the plating step in step 8. In these steps, the firing of the laminated chips in step 6 and the firing of the paste for the fired electrode layer in step 7 are performed in a single firing.
<1>
(A)セラミック層及び内部電極層を含む積層体と、最外層として前記積層体上に配置され前記内部電極層と接続されている焼付電極層と、を備える積層セラミックコンデンサの焼成後廃棄物であって、前記セラミック層は複数のセラミック粒子の集合体を有し、前記複数のセラミック粒子どうしの粒界には希土類成分を含む希土類含有物が含まれており、前記内部電極層は磁性を有する卑金属である第1の金属成分を含み、前記焼付電極層は磁性を有さない貴金属である第2の金属成分を含み、前記セラミック層、前記内部電極層及び前記焼付電極層は焼結されている、積層セラミックコンデンサの焼成後廃棄物を準備する工程と、
(B)前記焼成後廃棄物を微細化することにより、前記セラミック層が微細化されたセラミック微細化物、前記希土類含有物、前記内部電極層が微細化された第1の金属微細化物及び前記焼付電極層が微細化された第2の金属微細化物を得る工程と、
(C)前記工程(B)を経た後の前記焼成後廃棄物を、磁石を用いて、前記セラミック微細化物及び前記第1の金属微細化物を含む第1の分離物と、前記セラミック微細化物、前記希土類含有物及び前記第2の金属微細化物を含む第2の分離物と、に分離して回収する工程と、
(D)前記工程(C)を経た後の前記第2の分離物を希硫酸及び塩酸を含む群から選ばれる少なくとも1種の酸化力を持たない鉱酸に溶解することにより、前記第2の分離物中の前記セラミック微細化物及び前記第2の金属微細化物を沈殿させるとともに前記希土類含有物中の前記希土類成分が溶解した希土類成分含有溶液を生成する工程と、
(E)前記工程(D)において沈殿している前記第2の分離物中の前記セラミック微細化物及び前記第2の金属微細化物をアンモニア水に溶解することにより、前記第2の分離物中の前記セラミック微細化物を沈殿させるとともに前記第2の金属微細化物に含まれる前記第2の金属成分が溶解した第2の金属溶液を生成する工程と、
を備える、積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法。
<1>
(A) preparing post-sintering waste of a multilayer ceramic capacitor, the post-sintering waste comprising a laminate including a ceramic layer and an internal electrode layer, and a fired electrode layer disposed on the laminate as an outermost layer and connected to the internal electrode layer, the ceramic layer having an aggregate of a plurality of ceramic particles, a rare earth-containing material including a rare earth component is contained in grain boundaries between the plurality of ceramic particles, the internal electrode layer includes a first metal component which is a magnetic base metal, the fired electrode layer includes a second metal component which is a non-magnetic precious metal, and the ceramic layer, the internal electrode layer, and the fired electrode layer are sintered;
(B) obtaining a ceramic fine-particle having the ceramic layer finely divided, the rare earth-containing material, a first metal fine-particle having the internal electrode layer finely divided, and a second metal fine-particle having the fired electrode layer finely divided by pulverizing the fired waste material;
(C) a step of separating and recovering the fired waste after the step (B) into a first separated material containing the ceramic fine particles and the first fine metal particles, and a second separated material containing the ceramic fine particles, the rare earth-containing material, and the second fine metal particles, using a magnet;
(D) dissolving the second separated product after the step (C) in at least one mineral acid having no oxidizing power selected from the group consisting of dilute sulfuric acid and hydrochloric acid, thereby precipitating the ceramic fine particles and the second metal fine particles in the second separated product and generating a rare earth component-containing solution in which the rare earth components in the rare earth-containing product are dissolved;
(E) dissolving the ceramic fine particles and the second metal fine particles in the second separation product precipitated in the step (D) in ammonia water to precipitate the ceramic fine particles in the second separation product and generate a second metal solution in which the second metal component contained in the second metal fine particles is dissolved;
The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors comprises the steps of:
<2>
(I)前記工程(C)を経た後の記第1の分離物を硫酸、硝酸及び塩酸を含む群から選ばれる少なくとも1種の鉱酸に溶解することにより、前記第1の分離物中の前記セラミック微細化物を沈殿させるとともに前記第1の分離物中の前記第1の金属微細化物に含まれる前記第1の金属成分が溶解した第1の金属溶液を生成する工程をさらに備える、<1>に記載の積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法。
<2>
(I) The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors according to <1>, further comprising a step of dissolving the first separation product after the step (C) in at least one mineral acid selected from the group consisting of sulfuric acid, nitric acid, and hydrochloric acid, thereby precipitating the ceramic fine particles in the first separation product and generating a first metal solution in which the first metal component contained in the first metal fine particles in the first separation product is dissolved.
<3>
前記工程(C)では、前記工程(B)において微細化された焼成後廃棄物と水系溶媒とを混合してスラリーを生成した後、前記磁石を用いて前記第1の分離物及び前記第2の分離物をそれぞれ回収する、<1>又は<2>に記載の積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法。
<3>
In the step (C), the finely divided post-sintering waste material in the step (B) is mixed with an aqueous solvent to generate a slurry, and then the first separated matter and the second separated matter are respectively recovered using the magnet.
<4>
前記工程(D)では、前記酸化力を持たない鉱酸を添加することにより前記希土類成分含有溶液がpH1.5以上pH2.5以下となるように調整する、<1>乃至<3>のいずれかに記載の積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法。
<4>
The method for separating and recovering rare earth components and metal components from waste after firing of a multilayer ceramic capacitor according to any one of <1> to <3>, wherein in the step (D), the rare earth component-containing solution is adjusted to a pH of 1.5 or more and 2.5 or less by adding the mineral acid having no oxidizing power.
<5>
前記工程(E)では、前記アンモニア水を添加することにより前記第2の金属溶液がpH9以上pH10以下となるように調整する、<1>乃至<4>のいずれかに記載の積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法。
<5>
The method for separating and recovering rare earth components and metal components from waste after firing of a multilayer ceramic capacitor according to any one of <1> to <4>, wherein in the step (E), the second metal solution is adjusted to a pH of 9 or more and 10 or less by adding the ammonia water.
<6>
前記第1の金属成分はNiである、<1>乃至<5>のいずれかに記載の積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法。
<6>
The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors according to any one of <1> to <5>, wherein the first metal component is Ni.
<7>
前記第2の金属成分はCuである、<1>乃至<6>のいずれかに記載の積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法。
<7>
The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors according to any one of <1> to <6>, wherein the second metal component is Cu.
<8>
前記セラミック粒子はBaTiO3である、<1>乃至<7>のいずれかに記載の積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法。
<8>
The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors according to any one of <1> to <7>, wherein the ceramic particles are BaTiO 3 .
<9>
前記希土類成分は、Dy、Sc、Y、La、Ce、Pr、Nd、Pm、Sm、Eu、Gd、Tb、Ho、Er、Tm、Yb、Luのうち少なくとも1種である、<1>乃至<8>のいずれかに記載の積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法。
<9>
The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors according to any one of <1> to <8>, wherein the rare earth components are at least one of Dy, Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Ho, Er, Tm, Yb, and Lu.
<10>
(A)セラミック層及び内部電極層を含む積層体と、前記積層体上に配置され前記内部電極層と接続されている焼付電極層と、最外層として前記焼付電極層上に配置されている1段目めっき層と、を備える積層セラミックコンデンサの焼成後廃棄物であって、前記セラミック層は複数のセラミック粒子の集合体を有し、前記複数のセラミック粒子どうしの粒界には希土類成分を含む希土類含有物が含まれており、前記内部電極層は磁性を有する卑金属である第1の金属成分を含み、前記焼付電極層は磁性を有さない貴金属である第2の金属成分を含み、前記1段目めっき層は前記第1の金属成分を含み、前記セラミック層、前記内部電極層及び前記焼付電極層は焼結されている、積層セラミックコンデンサの焼成後廃棄物を準備する工程と、
(B)前記焼成後廃棄物を微細化することにより、前記セラミック層が微細化されたセラミック微細化物、前記希土類含有物、前記内部電極層及び前記1段目めっき層が微細化された第1の金属微細化物及び前記焼付電極層が微細化された第2の金属微細化物を得る工程と、
(C)前記工程(B)を経た後の前記焼成後廃棄物を、磁石を用いて、前記セラミック微細化物及び前記第1の金属微細化物を含む第1の分離物と、前記セラミック微細化物、前記希土類含有物及び前記第2の金属微細化物を含む第2の分離物と、に分離して回収する工程と、
(D)前記工程(C)を経た後の前記第2の分離物を希硫酸及び塩酸を含む群から選ばれる少なくとも1種の酸化力を持たない鉱酸に溶解することにより、前記第2の分離物中の前記セラミック微細化物及び前記第2の金属微細化物を沈殿させるとともに前記希土類含有物中の前記希土類成分が溶解した希土類成分含有溶液を生成する工程と、
(E)前記工程(D)において沈殿している前記第2の分離物中の前記セラミック微細化物及び前記第2の金属微細化物をアンモニア水に溶解することにより、前記第2の分離物中の前記セラミック微細化物を沈殿させるとともに前記第2の金属微細化物に含まれる前記第2の金属成分が溶解した第2の金属溶液を生成する工程と、
を備える、積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法。
<10>
(A) preparing sintered waste of a multilayer ceramic capacitor, the multilayer ceramic capacitor comprising: a laminate including a ceramic layer and an internal electrode layer; a fired electrode layer disposed on the laminate and connected to the internal electrode layer; and a first-stage plating layer disposed on the fired electrode layer as an outermost layer, the ceramic layer having an aggregate of a plurality of ceramic particles, a rare earth-containing material containing a rare earth component is contained in grain boundaries between the plurality of ceramic particles, the internal electrode layer contains a first metal component which is a magnetic base metal, the fired electrode layer contains a second metal component which is a non-magnetic precious metal, the first-stage plating layer contains the first metal component, and the ceramic layer, the internal electrode layer, and the fired electrode layer are sintered;
(B) obtaining a ceramic micro-fine product in which the ceramic layer is micro-fine, the rare earth-containing material, the internal electrode layer and the first-stage plating layer are micro-fine, and a second metal micro-fine product in which the baked electrode layer is micro-fine, by micro-fine-refining the fired waste;
(C) a step of separating and recovering the fired waste after the step (B) into a first separated material containing the ceramic fine particles and the first fine metal particles, and a second separated material containing the ceramic fine particles, the rare earth-containing material, and the second fine metal particles, using a magnet;
(D) dissolving the second separated product after the step (C) in at least one mineral acid having no oxidizing power selected from the group consisting of dilute sulfuric acid and hydrochloric acid, thereby precipitating the ceramic fine particles and the second metal fine particles in the second separated product and generating a rare earth component-containing solution in which the rare earth components in the rare earth-containing product are dissolved;
(E) dissolving the ceramic fine particles and the second metal fine particles in the second separation product precipitated in the step (D) in ammonia water to precipitate the ceramic fine particles in the second separation product and generate a second metal solution in which the second metal component contained in the second metal fine particles is dissolved;
The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors comprises the steps of:
<11>
(A)セラミック層及び内部電極層を含む積層体と、前記積層体上に配置され前記内部電極層と接続されている焼付電極層と、前記焼付電極層上に配置されている1段目めっき層と、最外層として前記1段目めっき層上に配置されている2段目めっき層と、を備える積層セラミックコンデンサの焼成後廃棄物であって、前記セラミック層は複数のセラミック粒子の集合体を有し、前記複数のセラミック粒子どうしの粒界には希土類成分を含む希土類含有物が含まれており、前記内部電極層は磁性を有する卑金属である第1の金属成分を含み、前記焼付電極層は磁性を有さない貴金属である第2の金属成分を含み、前記1段目めっき層は前記第1の金属成分を含み、前記2段目めっき層は第3の金属成分を含み、前記セラミック層、前記内部電極層及び前記焼付電極層は焼結されている、積層セラミックコンデンサの焼成後廃棄物を準備する工程と、
(K)前記焼成後廃棄物において前記1段目めっき層及び前記2段目めっき層のうち少なくとも前記2段目めっき層を除去する工程と、
(B)前記工程(K)を経ることにより少なくとも前記2段目めっき層が除去された前記焼成後廃棄物を微細化することにより、前記セラミック層が微細化されたセラミック微細化物、前記希土類含有物、前記内部電極層及び前記1段目めっき層が微細化された第1の金属微細化物及び前記焼付電極層が微細化された第2の金属微細化物を得る工程と、
(C)前記工程(B)を経た後の前記焼成後廃棄物を、磁石を用いて、前記セラミック微細化物及び前記第1の金属微細化物を含む第1の分離物と、前記セラミック微細化物、前記希土類含有物及び前記第2の金属微細化物を含む第2の分離物をと、に分離して回収する工程と、
(D)前記工程(C)を経た後の前記第2の分離物を希硫酸及び塩酸を含む群から選ばれる少なくとも1種の酸化力を持たない鉱酸に溶解することにより、前記第2の分離物中の前記セラミック微細化物及び前記第2の金属微細化物を沈殿させるとともに前記希土類含有物中の前記希土類成分が溶解した希土類成分含有溶液を生成する工程と、
(E)前記工程(D)において沈殿している前記第2の分離物中の前記セラミック微細化物及び前記第2の金属微細化物をアンモニア水に溶解することにより、前記第2の分離物中の前記セラミック微細化物を沈殿させるとともに前記第2の金属微細化物に含まれる前記第2の金属成分が溶解した第2の金属溶液を生成する工程と、
を備える、積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法。
<11>
(A) a step of preparing sintered waste of a multilayer ceramic capacitor, the multilayer ceramic capacitor comprising: a laminate including a ceramic layer and an internal electrode layer; a fired electrode layer disposed on the laminate and connected to the internal electrode layer; a first-stage plating layer disposed on the fired electrode layer; and a second-stage plating layer disposed on the first-stage plating layer as an outermost layer, the ceramic layer having an aggregate of a plurality of ceramic particles, a rare earth-containing material containing a rare earth component is contained in grain boundaries between the plurality of ceramic particles; the internal electrode layer contains a first metal component which is a magnetic base metal; the fired electrode layer contains a second metal component which is a non-magnetic precious metal; the first-stage plating layer contains the first metal component; the second-stage plating layer contains a third metal component; and the ceramic layer, the internal electrode layer, and the fired electrode layer are sintered;
(K) removing at least the second-stage plating layer from the first-stage plating layer and the second-stage plating layer in the fired waste;
(B) a step of pulverizing the fired waste from which at least the second-stage plating layer has been removed by the step (K) to obtain a ceramic micro-particle in which the ceramic layer has been micro-particled, the rare earth-containing material, the internal electrode layer and the first-stage plating layer have been micro-particled, and a second metal micro-particle in which the baked electrode layer has been micro-particled;
(C) a step of separating and recovering the fired waste after the step (B) into a first separated matter containing the ceramic fine particles and the first fine metal particles, and a second separated matter containing the ceramic fine particles, the rare earth-containing material, and the second fine metal particles, using a magnet;
(D) dissolving the second separated product after the step (C) in at least one mineral acid having no oxidizing power selected from the group consisting of dilute sulfuric acid and hydrochloric acid, thereby precipitating the ceramic fine particles and the second metal fine particles in the second separated product and generating a rare earth component-containing solution in which the rare earth components in the rare earth-containing product are dissolved;
(E) dissolving the ceramic fine particles and the second metal fine particles in the second separation product precipitated in the step (D) in ammonia water to precipitate the ceramic fine particles in the second separation product and generate a second metal solution in which the second metal component contained in the second metal fine particles is dissolved;
The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors comprises the steps of:
10 :積層セラミックコンデンサ
12 :積層体
12a :第1の主面
12b :第2の主面
12c :第1の側面
12d :第2の側面
12e :第1の端面
12f :第2の端面
14 :セラミック層
14_U :未焼成時のセラミック層
16 :内部電極層
16_U :未焼成時の内部電極層
16a :第1の内部電極層
16b :第2の内部電極層
30 :外部電極
30a :第1の外部電極
30b :第2の外部電極
32 :焼付電極層
32a :第1の焼付電極層
32b :第2の焼付電極層
34 :めっき層
34a :第1のめっき層
34b :第2のめっき層
34a1 :第1の下層めっき層
34a2 :第1の上層めっき層
34b1 :第2の下層めっき層
34b2 :第2の上層めっき層
x :高さ方向
y :幅方向
z :長さ方向
10: Multilayer ceramic capacitor 12: Laminate 12a: First main surface 12b: Second main surface 12c: First side surface 12d: Second side surface 12e: First end surface 12f: Second end surface 14: Ceramic layer 14_U: Unfired ceramic layer 16: Internal electrode layer 16_U: Unfired internal electrode layer 16a: First internal electrode layer 16b: Second internal electrode layer 30: External electrode 30a: First external electrode 30b: Second external electrode 32: Baked electrode layer 32a: First baked electrode layer 32b: Second baked electrode layer 34: Plating layer 34a: First plating layer 34b : Second plating layer 34a1 : First lower plating layer 34a2: First upper plating layer 34b1 : second lower plating layer 34b2 : second upper plating layer x: height direction y: width direction z: length direction
Claims (11)
(B)前記焼成後廃棄物を微細化することにより、前記セラミック層が微細化されたセラミック微細化物、前記希土類含有物、前記内部電極層が微細化された第1の金属微細化物及び前記焼付電極層が微細化された第2の金属微細化物を得る工程と、
(C)前記工程(B)を経た後の前記焼成後廃棄物を、磁石を用いて、前記セラミック微細化物及び前記第1の金属微細化物を含む第1の分離物と、前記セラミック微細化物、前記希土類含有物及び前記第2の金属微細化物を含む第2の分離物と、に分離して回収する工程と、
(D)前記工程(C)を経た後の前記第2の分離物を希硫酸及び塩酸を含む群から選ばれる少なくとも1種の酸化力を持たない鉱酸に溶解することにより、前記第2の分離物中の前記セラミック微細化物及び前記第2の金属微細化物を沈殿させるとともに前記希土類含有物中の前記希土類成分が溶解した希土類成分含有溶液を生成する工程と、
(E)前記工程(D)において沈殿している前記第2の分離物中の前記セラミック微細化物及び前記第2の金属微細化物をアンモニア水に溶解することにより、前記第2の分離物中の前記セラミック微細化物を沈殿させるとともに前記第2の金属微細化物に含まれる前記第2の金属成分が溶解した第2の金属溶液を生成する工程と、
を備える、積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法。 (A) preparing post-sintering waste of a multilayer ceramic capacitor, the post-sintering waste comprising a laminate including a ceramic layer and an internal electrode layer, and a fired electrode layer disposed on the laminate as an outermost layer and connected to the internal electrode layer, the ceramic layer having an aggregate of a plurality of ceramic particles, a rare earth-containing material including a rare earth component is contained in grain boundaries between the plurality of ceramic particles, the internal electrode layer includes a first metal component which is a magnetic base metal, the fired electrode layer includes a second metal component which is a non-magnetic precious metal, and the ceramic layer, the internal electrode layer, and the fired electrode layer are sintered;
(B) obtaining a ceramic fine-particle having the ceramic layer finely divided, the rare earth-containing material, a first metal fine-particle having the internal electrode layer finely divided, and a second metal fine-particle having the fired electrode layer finely divided by pulverizing the fired waste material;
(C) a step of separating and recovering the fired waste after the step (B) into a first separated material containing the ceramic fine particles and the first fine metal particles, and a second separated material containing the ceramic fine particles, the rare earth-containing material, and the second fine metal particles, using a magnet;
(D) dissolving the second separated product after the step (C) in at least one mineral acid having no oxidizing power selected from the group consisting of dilute sulfuric acid and hydrochloric acid, thereby precipitating the ceramic fine particles and the second metal fine particles in the second separated product and generating a rare earth component-containing solution in which the rare earth components in the rare earth-containing product are dissolved;
(E) dissolving the ceramic fine particles and the second metal fine particles in the second separation product precipitated in the step (D) in ammonia water to precipitate the ceramic fine particles in the second separation product and generate a second metal solution in which the second metal component contained in the second metal fine particles is dissolved;
The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors comprises the steps of:
(B)前記焼成後廃棄物を微細化することにより、前記セラミック層が微細化されたセラミック微細化物、前記希土類含有物、前記内部電極層及び前記1段目めっき層が微細化された第1の金属微細化物及び前記焼付電極層が微細化された第2の金属微細化物を得る工程と、
(C)前記工程(B)を経た後の前記焼成後廃棄物を、磁石を用いて、前記セラミック微細化物及び前記第1の金属微細化物を含む第1の分離物と、前記セラミック微細化物、前記希土類含有物及び前記第2の金属微細化物を含む第2の分離物と、に分離して回収する工程と、
(D)前記工程(C)を経た後の前記第2の分離物を希硫酸及び塩酸を含む群から選ばれる少なくとも1種の酸化力を持たない鉱酸に溶解することにより、前記第2の分離物中の前記セラミック微細化物及び前記第2の金属微細化物を沈殿させるとともに前記希土類含有物中の前記希土類成分が溶解した希土類成分含有溶液を生成する工程と、
(E)前記工程(D)において沈殿している前記第2の分離物中の前記セラミック微細化物及び前記第2の金属微細化物をアンモニア水に溶解することにより、前記第2の分離物中の前記セラミック微細化物を沈殿させるとともに前記第2の金属微細化物に含まれる前記第2の金属成分が溶解した第2の金属溶液を生成する工程と、
を備える、積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法。 (A) preparing sintered waste of a multilayer ceramic capacitor, the multilayer ceramic capacitor comprising: a laminate including a ceramic layer and an internal electrode layer; a fired electrode layer disposed on the laminate and connected to the internal electrode layer; and a first-stage plating layer disposed on the fired electrode layer as an outermost layer, the ceramic layer having an aggregate of a plurality of ceramic particles, a rare earth-containing material containing a rare earth component is contained in grain boundaries between the plurality of ceramic particles, the internal electrode layer contains a first metal component which is a magnetic base metal, the fired electrode layer contains a second metal component which is a non-magnetic precious metal, the first-stage plating layer contains the first metal component, and the ceramic layer, the internal electrode layer, and the fired electrode layer are sintered;
(B) obtaining a ceramic micro-fine product in which the ceramic layer is micro-fine, the rare earth-containing material, the internal electrode layer and the first-stage plating layer are micro-fine, and a second metal micro-fine product in which the baked electrode layer is micro-fine, by micro-fine-refining the fired waste;
(C) a step of separating and recovering the fired waste after the step (B) into a first separated material containing the ceramic fine particles and the first fine metal particles, and a second separated material containing the ceramic fine particles, the rare earth-containing material, and the second fine metal particles, using a magnet;
(D) dissolving the second separated product after the step (C) in at least one mineral acid having no oxidizing power selected from the group consisting of dilute sulfuric acid and hydrochloric acid, thereby precipitating the ceramic fine particles and the second metal fine particles in the second separated product and generating a rare earth component-containing solution in which the rare earth components in the rare earth-containing product are dissolved;
(E) dissolving the ceramic fine particles and the second metal fine particles in the second separation product precipitated in the step (D) in ammonia water to precipitate the ceramic fine particles in the second separation product and generate a second metal solution in which the second metal component contained in the second metal fine particles is dissolved;
The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors comprises the steps of:
(K)前記焼成後廃棄物において前記1段目めっき層及び前記2段目めっき層のうち少なくとも前記2段目めっき層を除去する工程と、
(B)前記工程(K)を経ることにより少なくとも前記2段目めっき層が除去された前記焼成後廃棄物を微細化することにより、前記セラミック層が微細化されたセラミック微細化物、前記希土類含有物、前記内部電極層及び前記1段目めっき層が微細化された第1の金属微細化物及び前記焼付電極層が微細化された第2の金属微細化物を得る工程と、
(C)前記工程(B)を経た後の前記焼成後廃棄物を、磁石を用いて、前記セラミック微細化物及び前記第1の金属微細化物を含む第1の分離物と、前記セラミック微細化物、前記希土類含有物及び前記第2の金属微細化物を含む第2の分離物をと、に分離して回収する工程と、
(D)前記工程(C)を経た後の前記第2の分離物を希硫酸及び塩酸を含む群から選ばれる少なくとも1種の酸化力を持たない鉱酸に溶解することにより、前記第2の分離物中の前記セラミック微細化物及び前記第2の金属微細化物を沈殿させるとともに前記希土類含有物中の前記希土類成分が溶解した希土類成分含有溶液を生成する工程と、
(E)前記工程(D)において沈殿している前記第2の分離物中の前記セラミック微細化物及び前記第2の金属微細化物をアンモニア水に溶解することにより、前記第2の分離物中の前記セラミック微細化物を沈殿させるとともに前記第2の金属微細化物に含まれる前記第2の金属成分が溶解した第2の金属溶液を生成する工程と、
を備える、積層セラミックコンデンサの焼成後廃棄物からの希土類成分及び金属成分の分離回収方法。 (A) a step of preparing sintered waste of a multilayer ceramic capacitor, the multilayer ceramic capacitor comprising: a laminate including a ceramic layer and an internal electrode layer; a fired electrode layer disposed on the laminate and connected to the internal electrode layer; a first-stage plating layer disposed on the fired electrode layer; and a second-stage plating layer disposed on the first-stage plating layer as an outermost layer, the ceramic layer having an aggregate of a plurality of ceramic particles, a rare earth-containing material containing a rare earth component is contained in grain boundaries between the plurality of ceramic particles; the internal electrode layer contains a first metal component which is a magnetic base metal; the fired electrode layer contains a second metal component which is a non-magnetic precious metal; the first-stage plating layer contains the first metal component; the second-stage plating layer contains a third metal component; and the ceramic layer, the internal electrode layer, and the fired electrode layer are sintered;
(K) removing at least the second-stage plating layer from the first-stage plating layer and the second-stage plating layer in the fired waste;
(B) a step of pulverizing the fired waste from which at least the second-stage plating layer has been removed by the step (K) to obtain a ceramic micro-particle in which the ceramic layer has been micro-particled, the rare earth-containing material, the internal electrode layer and the first-stage plating layer have been micro-particled, and a second metal micro-particle in which the baked electrode layer has been micro-particled;
(C) a step of separating and recovering the fired waste after the step (B) into a first separated matter containing the ceramic fine particles and the first fine metal particles, and a second separated matter containing the ceramic fine particles, the rare earth-containing material, and the second fine metal particles, using a magnet;
(D) dissolving the second separated product after the step (C) in at least one mineral acid having no oxidizing power selected from the group consisting of dilute sulfuric acid and hydrochloric acid, thereby precipitating the ceramic fine particles and the second metal fine particles in the second separated product and generating a rare earth component-containing solution in which the rare earth components in the rare earth-containing product are dissolved;
(E) dissolving the ceramic fine particles and the second metal fine particles in the second separation product precipitated in the step (D) in ammonia water to precipitate the ceramic fine particles in the second separation product and generate a second metal solution in which the second metal component contained in the second metal fine particles is dissolved;
The method for separating and recovering rare earth components and metal components from post-sintering waste of multilayer ceramic capacitors comprises the steps of:
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