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WO2025110382A1 - Film de polyester et composant le comprenant - Google Patents

Film de polyester et composant le comprenant Download PDF

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Publication number
WO2025110382A1
WO2025110382A1 PCT/KR2024/008707 KR2024008707W WO2025110382A1 WO 2025110382 A1 WO2025110382 A1 WO 2025110382A1 KR 2024008707 W KR2024008707 W KR 2024008707W WO 2025110382 A1 WO2025110382 A1 WO 2025110382A1
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WIPO (PCT)
Prior art keywords
polyester film
paragraph
chemical formula
group
weight
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Pending
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PCT/KR2024/008707
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English (en)
Korean (ko)
Inventor
김재훈
고명준
박홍민
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Toray Advanced Materials Korea Inc
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Toray Advanced Materials Korea Inc
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Priority to CN202480008331.1A priority Critical patent/CN120584147A/zh
Publication of WO2025110382A1 publication Critical patent/WO2025110382A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C55/00—Shaping by stretching, e.g. drawing through a die; Apparatus therefor
    • B29C55/02—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets
    • B29C55/10—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial
    • B29C55/12—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial biaxial
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
    • C08J2483/04—Polysiloxanes

Definitions

  • the present disclosure relates to a polyester film and a component comprising the same.
  • a release film is a film that has a release property that does not adhere well to an adhesive component, and is used as a protective film for adhesive films or adhesive tapes.
  • a release film is used to prevent an adhesive from unintentionally adhering to an adherend before use, or to prevent contamination by foreign substances, etc.
  • a release film is also used to prevent a mold and a molded product from adhering to each other during a heating and pressurizing molding process, or as a carrier film for molding thin ceramic sheets such as dielectrics for multilayer ceramic capacitors.
  • Polyester film is mainly used as a substrate for the release film.
  • a release layer is formed on a polyester substrate film using a silicone-based release composition containing a silicone-based resin, a curing agent, a catalyst, etc.
  • the adhesive is directly applied to the polyester film coated with this silicone-based release composition for use. At this time, depending on the type of solvent used in the adhesive or the coating thickness, defects such as orange peel and pinholes may occur, which may lower the quality.
  • polyester films and components comprising the same that have low pinholes, excellent adhesive wettability, low peel strength and improved residual adhesion.
  • One aspect is to provide a polyester film having excellent adhesive wettability, low peel strength and improved residual adhesion while having almost no pinholes.
  • Another aspect is to provide a component comprising the polyester film.
  • a cured layer of a silicone emulsion composition located on at least one side of the polyester substrate;
  • the above silicone emulsion composition comprises two or more silicone resins and a surfactant
  • At least one of the above silicone resins has a weight average molecular weight of 3,000 to 7,000 daltons
  • a polyester film is provided, wherein the surface energy of the cured layer is 15 dyne/cm to 20 dyne/cm.
  • the above silicone resin includes first particles and second particles, and the average particle diameter (D50) of the first particles and second particles may be from 0.1 nm to 300 nm.
  • the above silicone resin may be selected from polysiloxane containing an alkenyl group having 2 to 6 carbon atoms, polysiloxane containing an alkyl group having 1 to 10 carbon atoms, hydrogen polysiloxane, and combinations thereof.
  • the above silicone resin may include an alkenyl group-containing polysiloxane represented by the following chemical formula 1:
  • n and n can be integers from 10 to 500, respectively.
  • R 1 , R 2 , and R 3 can independently be a C1 to C3 alkyl group, a C2 to C6 alkenyl group, or a combination thereof,
  • R 1 , R 2 , and R 3 may be an alkenyl group having C2 to C6.
  • the above silicone resin may include an alkyl group-containing polysiloxane represented by the following chemical formula 2:
  • a and b can each be integers from 1 to 100,
  • R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , R 10 , R 11 , R 12 , R 13 can independently be a hydrogen atom, a C1 to C10 alkyl group, or a combination thereof,
  • R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , R 10 , R 11 , R 12 , and R 13 may be a C1 to C10 alkyl group.
  • the solid content of the above silicone resin may be 0.1 to 9 parts by weight based on 100 parts by weight of the entire silicone emulsion composition.
  • the above surfactant may include a diol-based compound, a succinate-based compound, a salt thereof, or a combination thereof.
  • the above surfactant may include a diol compound represented by the following chemical formula 3:
  • p, q, r, s can be 0 to 20, respectively.
  • R 2 and R 3 can independently be a hydrogen atom, a substituted or unsubstituted C1 to C5 alkyl group, or a combination thereof.
  • the surfactant may include sodium dioctyl 2-(sulfoethyl)succinate, sodium dioctyl 2-(phosphoethyl)succinate, dioctyl 2-(hydroxyethyl)succinate, or a combination thereof.
  • the content of the above surfactant may be 0.01 to 0.2 parts by weight based on 100 parts by weight of the entire silicone emulsion composition.
  • the above silicone emulsion composition may further include at least one of a silane coupling agent, a curing agent, and a catalyst.
  • the above silane coupling agent may include an alkoxy-based silane compound.
  • the above catalyst may include a metal catalyst.
  • the thickness of the above-mentioned hardened layer can be 0.01 ⁇ m to 10 ⁇ m.
  • the above-mentioned material may be a biaxially oriented polyester film.
  • the thickness of the above-mentioned substrate may be from 10 ⁇ m to 300 ⁇ m.
  • the above film may be a release film.
  • a component comprising the aforementioned polyester film is provided.
  • a polyester film comprises a polyester substrate and a cured layer of a silicone emulsion composition positioned on at least one surface of the polyester substrate, wherein the silicone emulsion composition comprises two or more silicone resins and a surfactant, wherein at least one of the silicone resins has a weight average molecular weight of 3000 to 7000 daltons, and the surface energy of the cured layer is 15 to 20 dyne/cm.
  • the polyester film hardly generates pinholes, has excellent adhesive wettability, low peel strength, and improved residual adhesive ratio.
  • Figure 1 is a cross-sectional schematic diagram of a polyester film according to one embodiment.
  • the term “and/or” is meant to include any and all combinations of one or more of the items described herein.
  • the term “or” means “and/or.”
  • the expression “at least one” or “one or more” preceding an element in this specification may supplement the entire list of elements and not necessarily supplement individual elements of the description.
  • ⁇ -based resin ⁇ -based polymer
  • ⁇ -based copolymer ⁇ -based copolymer
  • each component is a concept that includes both singular and plural.
  • the units “parts by weight” and “weight %” refer to the weight ratio between each component, and the units “parts by mass” and “mass %” refer to the weight ratio between each component converted into solid content.
  • “about” means within an acceptable range of deviation for a particular value as determined by one of ordinary skill in the art, taking into account the error associated with the measurement and measurement of the particular quantity, including the stated value (i.e., the limits of the measurement system). For example, “about” can mean within one or more standard deviations, or within ⁇ 30%, 20%, 10%, or 5% of the stated value.
  • a release film coated with a silicone-based release composition is used for bonding purposes.
  • various types of tapes are being made thinner by directly applying a thin adhesive to the release film and transferring the formed adhesive layer to a substrate.
  • the adhesive may not be applied properly or the coating quality may deteriorate, such as pinholes or orange peel, after drying.
  • the inventors of the present invention propose an invention for the following polyester film.
  • Figure 1 is a cross-sectional schematic diagram of a polyester film according to one embodiment.
  • a polyester film according to one embodiment has a substrate (20) and a curing layer (or a release layer) (10) disposed on both sides of the substrate (20).
  • a polyester film according to one embodiment may have a substrate (20) and a curing layer (or a release layer) (10) disposed on one side of the substrate (20).
  • the substrate (20), curing layer (or release layer) (10), and components constituting the polyester film are specifically described as follows.
  • the substrate (20) used in the present invention may use a polyester film or sheet.
  • a polyester film may be used as the substrate (20).
  • the polyester film may be a polyester film disclosed in Korean Patent Registration No. 10-1268584, Korean Patent Publication No. 2012-45213, and Korean Patent Publication No. 2012-99546.
  • a polyester film is described without limitation, but it should be understood that it includes technical features related to a known polyester film.
  • the polyester film may include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, or polycarbonate.
  • the polyester film can be a polyethylene terephthalate (PET) film.
  • PET polyethylene terephthalate
  • the polyethylene terephthalate (PET) film has excellent physical stability over a wide temperature range from low to high temperatures, and has excellent chemical resistance, mechanical strength, and surface properties.
  • the polyethylene terephthalate (PET) film has good thickness uniformity and excellent adaptability to process conditions for various applications.
  • the polyester resin forming the base film of the present invention may be a polyester obtained by polycondensing dicarboxylic acid and glycol.
  • dicarboxylic acids may include aromatic dicarboxylic acids such as isophthalic acid, phthalic acid, terephthalic acid, 2,6-naphthalenedicarboxylic acid, p-oxybenzoic acid, diphenylcarboxylic acid, diphenylsulfonic dicarboxylic acid, diphenoxyethanedicarboxylic acid, and 5-sodiumsulfonic dicarboxylic acid; aliphatic dicarboxylic acids such as succinic acid, adipic acid, sebacic acid, dimer acid, maleic acid, and fumaric acid; alicyclic dicarboxylic acids such as cyclohexanedicarboxylic acid; and oxycarboxylic acids such as p-hydroxybenzoic acid; etc.
  • aromatic dicarboxylic acids such as isophthalic acid, phthalic acid, terephthalic acid, 2,6-naphthalenedicarboxylic acid, p-oxybenzoic acid, di
  • glycols may include aliphatic glycols such as ethylene glycol, propanediol, diethylene glycol, propylene glycol, butanediol, pentanediol, hexanediol, and neopentyl glycol; polyalkylene glycols such as polydiethylene glycol, polyethylene glycol, and polypropylene glycol; alicyclic glycols such as cyclohexane dimethanol; and aromatic glycols such as bisphenol A and bisphenol S.
  • aliphatic glycols such as ethylene glycol, propanediol, diethylene glycol, propylene glycol, butanediol, pentanediol, hexanediol, and neopentyl glycol
  • polyalkylene glycols such as polydiethylene glycol, polyethylene glycol, and polypropylene glycol
  • alicyclic glycols such as cyclohexan
  • Polyester film can use a uniaxial or biaxially oriented film that has high transparency and excellent productivity and processability.
  • polyester film can use a biaxially oriented film.
  • Corona treatment, etc. can be performed on the surface of the substrate (20).
  • the surface tension of the substrate (20) may be 1.0 to 1.5 times that of the silicone emulsion composition. If the surface tension of the substrate (20) is less than 1.0 times, the adhesive wettability is reduced, making it impossible to obtain a uniform cured layer (10), and if the surface tension is more than 1.5 times, coagulation of the silicone emulsion composition may occur, resulting in appearance defects such as pinholes.
  • the polyester film may contain particles to impart excellent roll-to-roll running properties; any particles added may be used without limitation as long as they exhibit excellent sliding properties.
  • Such particles may include particles of silica, silicon oxide, calcium carbonate, calcium sulfate, calcium phosphate, magnesium carbonate, magnesium phosphate, barium carbonate, kaolin, aluminum oxide, titanium oxide, etc., and the shape of the particles used is not limited, but for example, any of spherical, block-shaped, rod-shaped, and plate-shaped particles may be used.
  • the average particle diameter of the particles used may be 0.1 to 5 ⁇ m, and for example, particles in the range of 0.1 to 2 ⁇ m may be used. At this time, if the average particle diameter of the particles is less than 0.1 ⁇ m, agglomeration between particles may occur, resulting in poor dispersion, and if the average particle diameter of the particles exceeds 5 ⁇ m, the surface roughness characteristics of the film may deteriorate, resulting in poor coating during post-processing.
  • the content of the particles may be 0.01 to 5 wt% based on the total weight of the polyester film, for example, 0.01 to 3 wt%.
  • the content of the particles is less than 0.01 wt%, the slip properties of the polyester film may deteriorate, resulting in deteriorated running properties between rolls, and when the content of the particles exceeds 5 wt%, the surface smoothness of the film may deteriorate.
  • the thickness of the polyester film is not limited, but may be from 10 ⁇ m to 300 ⁇ m.
  • polyester film If the polyester film is too thin, less than 10 ⁇ m, it may become deformed by heat treatment during processing, and is therefore not suitable as a carrier film. If it is too thick, exceeding 300 ⁇ m, heat may not be sufficiently transferred, which may cause problems with curing and reduce cost efficiency.
  • the cured layer or release layer (10) may be a cured layer of a silicone emulsion composition.
  • the silicone emulsion composition can be obtained by blending each component by a conventional method.
  • the silicone emulsion composition may contain two or more silicone resins and a surfactant.
  • the weight average molecular weight of at least one silicone resin may be from 3,000 to 7,000 daltons. If the weight average molecular weight of at least one silicone resin is within the above range, compatibility with various polar solvents of the adhesive applied on the cured layer (10) is high, so that adhesive wettability is excellent, and thus pinhole defects on the surface of the polyester film may hardly occur.
  • the silicone-based resin includes first particles and second particles, and the average particle diameter (D50) of the first particles and the second particles may be 0.1 nm to 300 nm.
  • the first particles may be alkenyl group-containing polysiloxane particles represented by the chemical formula 1 described below
  • the second particles may be alkyl group-containing polysiloxane particles represented by the chemical formula 2 described below.
  • the first particles may be alkyl group-containing polysiloxane particles represented by the chemical formula 2 described below
  • the second particles may be alkenyl group-containing polysiloxane particles represented by the chemical formula 1 described below.
  • the average particle diameter (D50) of the first particles and the second particles of the silicone-based resin is within the above range, compatibility with various polar solvents of the adhesive applied on the curing layer (10) is high, so that adhesive wettability is excellent, and thus pinhole defects on the surface of the polyester film may hardly occur.
  • the shape of the first particle and the second particle of the silicone resin is not limited, but may be, for example, spherical, elliptical, etc.
  • the average particle diameter (D50) of the first particle and the second particle of the silicone resin refers to the particle size or median particle size corresponding to 50% in a distribution curve of particles accumulated in order of particle diameter from the smallest particle to the largest particle, where the total number of accumulated particles is 100%.
  • the average particle diameter (D50) of the first particle and the second particle of the silicone resin can be measured by a method known to those skilled in the art, for example, using a laser diffraction particle-size analyzer.
  • the median particle size can closely correspond to the arithmetic mean particle diameter calculated from an electron microscope image.
  • the silicone resin may be selected from polysiloxanes containing alkenyl groups having 2 to 6 carbon atoms, polysiloxanes containing alkyl groups having 1 to 10 carbon atoms, hydrogen polysiloxanes, and combinations thereof.
  • the silicone resin may include an alkenyl group-containing polysiloxane represented by the following chemical formula 1:
  • n and n can be integers from 10 to 500, respectively.
  • R 1 , R 2 , and R 3 can independently be a C1 to C3 alkyl group, a C2 to C6 alkenyl group, or a combination thereof,
  • R 1 , R 2 , and R 3 may be an alkenyl group having C2 to C6.
  • each structural unit can be randomly bonded or block bonded.
  • R 1 , R 2 , and R 3 can be alkenyl groups having C2 to C6.
  • the silicone resin may include an alkyl group-containing polysiloxane represented by the following chemical formula 2:
  • a and b can each be integers from 1 to 100,
  • R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , R 10 , R 11 , R 12 , R 13 can independently be a hydrogen atom, a C1 to C10 alkyl group, or a combination thereof,
  • R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , R 10 , R 11 , R 12 , and R 13 may be a C1 to C10 alkyl group.
  • each structural unit can be randomly bonded or block bonded.
  • the content of the alkyl group-containing polysiloxane represented by chemical formula 2 may be 2 to 10 parts by weight based on 100 parts by weight of the alkenyl group-containing polysiloxane represented by chemical formula 1.
  • the content of the alkyl group-containing polysiloxane represented by chemical formula 2 may be 4 to 6 parts by weight based on 100 parts by weight of the alkenyl group-containing polysiloxane represented by chemical formula 1.
  • unreacted alkenyl group-containing polysiloxane represented by chemical formula 1 may be transferred to another layer, such as the back surface or the adhesive layer of the polyester film, which may cause process contamination. If the content of the alkyl group-containing polysiloxane represented by chemical formula 2 exceeds 10 parts by weight, unreacted polysiloxane may remain in the cured layer (10), which may increase the peeling strength, and the peeling strength may also increase over time, making it difficult to have stable release properties.
  • alkenyl group-containing polysiloxane represented by chemical formula 1 and the alkyl group-containing polysiloxane represented by chemical formula 2 may be at least one of linear, branched, radial and cyclic.
  • the solid content of the silicone resin may be 0.1 to 9 parts by weight based on 100 parts by weight of the entire silicone emulsion composition. If the solid content of the silicone resin is less than 0.1 parts by weight, the minimum release characteristics required for peeling after laminating with the substrate (20) are not implemented. If the solid content of the silicone resin is more than 9 parts by weight, the silicone component on the surface of the cured layer (10) is transferred to the other side, so a winding problem occurs due to the slippage of the back side, and the physical properties may be deteriorated due to the silicone component transferred to the substrate (20) after laminating with the substrate (20).
  • the surfactant may include a diol compound, a succinate compound, a salt thereof, or a combination thereof.
  • the surfactant may include a diol compound represented by the following chemical formula 3:
  • p, q, r, s can be 0 to 20, respectively.
  • R 2 and R 3 can independently be a hydrogen atom, a substituted or unsubstituted C1 to C5 alkyl group, or a combination thereof.
  • the surfactant may include sodium dioctyl 2-(sulfoethyl)succinate, sodium dioctyl 2-(phosphoethyl)succinate, dioctyl 2-(hydroxyethyl)succinate, or a combination thereof.
  • the content of the surfactant may be 0.01 part by weight to 0.2 part by weight based on 100 parts by weight of the entire silicone emulsion composition.
  • the content of the surfactant may be 0.01 part by weight to 5 parts by weight or 0.05 part by weight to 1 part by weight based on 100 parts by weight of the alkenyl group-containing polysiloxane represented by the chemical formula 1. If the content of the surfactant is less than 0.01 part by weight, the content as a surfactant is not sufficient, making it difficult to exhibit the effect of improving the appearance of the polyester film coating. If the content of the surfactant exceeds 5 parts by weight, the peeling strength may increase.
  • the silicone emulsion composition may further include at least one of a silane coupling agent, a curing agent, and a catalyst.
  • the silane coupling agent may be used as an adhesion improver.
  • the silane coupling agent is not limited, but may include an alkoxy silane compound. Examples of the alkoxy silane compound include [3-(2,3-epoxypropoxy)propyl]trimethoxysilane, but the present invention is not limited thereto, and all known alkoxy silane compounds may be used.
  • the content of the silane coupling agent may be 0.1 to 30 parts by weight based on 100 parts by weight of the entire silicone emulsion composition. Accordingly, the aging stability of the cured layer (10) of the polyester film can be secured.
  • the catalyst may include a metal catalyst.
  • the catalyst may use one or more metals or metalloids selected from elements in groups 4 to 14 of the periodic table, and for example, one or more selected from Rh, Pt, Sn, Ti, Pd, Ir, W, and Co.
  • the catalyst may use a platinum chelate catalyst.
  • the cured layer (10) may further include one or more of organic and inorganic particles, an antistatic agent, a conductivity improver, a pH regulator, and an antifouling agent.
  • the inorganic particles may be inorganic particles selected from natural minerals; oxides, hydroxides, sulfides, nitrides, or halides of elements of groups 1 to 4, 11 to 12, 14, and 16 to 18; carbonates, sulfates, acetates, phosphates, phosphites, carboxylates, silicates, titanates, borates, or hydrates thereof; and complex compounds thereof.
  • the organic particles may be organic particles selected from fluorine-based resins, melamine-based resins, styrene-based resins, acrylic-based resins, silicone-based resins, styrene-divinylbenzene-based copolymer resins, and polymers or copolymers crosslinked with these resins.
  • the shape of the inorganic particles is not particularly limited, and may be spherical, block-shaped, rod-shaped, or flat.
  • the hardness, specific gravity, color, etc. of the inorganic particles are not limited, and, if necessary, these inorganic particles may be used alone or in combination of two or more.
  • the antistatic agent may be a known antistatic agent widely used in the field of the polyester film, but may be selected from, for example, PEDOT (Poly(3,4-ethylenedioxythiophene)), PEDOT:PSS (poly(3,4-ethylenedioxythiophene) polystyrene sulfonate), polyaniline, polypyrrole, quaternary ammonium salts, sulfonates, phosphates, and combinations thereof.
  • the content of the antistatic agent may be 1 part by weight to 20 parts by weight based on 100 parts by weight of the entire silicone emulsion composition.
  • the conductivity improver may be a known conductivity improver widely used in the field of the polyester film, and may be selected from, for example, ethylene glycol, dimethyl sulfoxide, N-methyl-2-pyrrolidone, propylene glycol, butyl glycol, dipropylene glycol dimethyl ether, gamma-butyrolactone, sulfolane, dimethyl carbonate, sorbitol, and combinations thereof.
  • the content of the conductivity improver may be 1 part by weight to 20 parts by weight based on 100 parts by weight of the entire silicone emulsion composition.
  • the pH regulator may be a known pH regulator widely used in the field of the polyester film, but may be selected from, for example, sodium hydroxide, potassium hydroxide, calcium hydroxide, ammonia water, and combinations thereof.
  • the content of the conductivity improver may be 0.05 to 0.3 parts by weight based on 100 parts by weight of the entire silicone emulsion composition.
  • the antifouling agent may be a known antifouling agent widely used in the field of the polyester film, but may be selected from, for example, fluorine, a fluorine-containing silane compound, a fluorine-containing organic compound, self-emulsifying silicone, and combinations thereof.
  • the content of the antifouling agent may be 0.1 to 0.3 parts by weight based on 100 parts by weight of the entire silicone emulsion composition.
  • the silicone emulsion composition is prepared with water at a solid content of 0.5 wt% to 15 wt%.
  • the cured layer (10) of the polyester film can be formed by applying it to the substrate (20) at least once using a known method such as a bar coat method, a reverse roll coat method, or a gravure roll coat method. If the solid content of the silicone emulsion composition is less than 0.5 wt%, uniform coating is difficult and at the same time, peeling force may increase, and if it exceeds 15 wt%, the coating appearance may be poor and at the same time, adhesion between the cured layer (10) and the substrate (20) may decrease.
  • the silicone emulsion composition may further contain 0.01 wt% to 10 wt%, for example 0.01 wt% to 5 wt%, of an organic solvent based on the total weight of the silicone emulsion composition to improve applicability or transparency. If the content of the organic solvent exceeds 10 wt%, there is a risk of explosion during the drying, stretching, and heat treatment processes when using an inline coating method.
  • the organic solvent may be used without limitation as long as it can disperse the solid content of the silicone emulsion composition and apply it onto a substrate, and examples thereof include: aromatic hydrocarbon solvents such as toluene and xylene; aliphatic hydrocarbon solvents such as hexane, heptane, octane, isooctane, decane, cyclohexane, methyl cyclohexane, and isoparaffin; hydrocarbon solvents such as industrial gasoline (rubber gasoline, etc.), petroleum benzene, and solvent naphtha; ketone solvents such as acetone, methyl ethyl ketone, 2-pentanone, 3-pentanone, 2-hexanone, 2-heptanone, 4-heptanone, methyl isobutyl ketone, diisobutyl ketone, acetonylacetone, and cyclohexanone; ester solvents such as ethyl
  • the surface energy of the cured layer (10) may be 15 dyne/cm to 20 dyne/cm. Within the above range of surface energy of the cured layer (10), pinholes are hardly generated, adhesive wettability is excellent, and low peel strength and improved residual adhesion rate are achieved.
  • the thickness of the hardened layer (10) may be 0.01 ⁇ m to 10 ⁇ m. If the thickness of the hardened layer (10) is less than 0.01 ⁇ m, a uniform hardened layer (10) cannot be formed. If the thickness of the hardened layer (10) exceeds 10 ⁇ m, blocking may occur between one side and the back side of the substrate (20).
  • the polyester film according to one embodiment may be a release film.
  • a polyester film according to one embodiment may have a peel strength of 20 gf/cm or less at room temperature and a residual adhesion rate of 90% or more.
  • a polyester film according to one embodiment has almost no pinhole defects.
  • a component according to another embodiment of the present invention may include the polyester film described above.
  • Examples of the component may include, but are not limited to, a mobile tape, a foam tape, or a window.
  • the "substituted" in the "substituted” of the alkyl group, alkoxy group, alkenyl group, alkynyl group, and aryl group means a halogen atom, a C1-C10 alkyl group substituted with a halogen atom (e.g., CCF 3 , CHCF 2 , CH 2 F, CCl 3 , etc.), a hydroxy group, a nitro group, a cyano group, an amino group, an amidino group, a hydrazine, a hydrazone, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, or a C1-C10 alkyl group, a C2-C10 alkenyl group, a C2-C10 alkynyl group, a C1-C20 heteroalkyl group, a C6-C20
  • C1-C10 alkyl group used in the chemical formula described above include methyl, ethyl, propyl, isobutyl, sec-butyl, ter-butyl, neo-butyl, iso-amyl, hexyl, etc., and one or more hydrogen atoms in the alkyl group can be substituted with a substituent as defined in the "substitution" described above.
  • C1-C10 alkoxy group used in the chemical formula described above include methoxy, ethoxy, propoxy, etc., and at least one hydrogen atom in the alkoxy group can be substituted with a substituent as defined in the “substitution” described above.
  • C2-C10 alkenyl group used in the chemical formula described above include vinylene, allylene, etc., and at least one hydrogen atom in the alkenyl group can be substituted with a substituent as defined in the “substitution” described above.
  • C2-C10 alkynyl group used in the chemical formula described above include acetylene, and at least one hydrogen atom in the alkynyl group can be substituted with a substituent as defined in the “substitution” described above.
  • the C6-C20 aryl group used in the chemical formula described above is used alone or in combination to mean an aromatic system containing one or more rings, and examples thereof include phenyl, naphthyl, tetrahydronaphthyl, etc.
  • one or more hydrogen atoms in the aryl group may be substituted with a substituent as defined in the "substitution" described above.
  • PET film Excell-50 ⁇ m, Toray Advanced Materials
  • n 60 each
  • R 1 , R 2 , and R 3 are each ethenyl groups.
  • a and b are each 50
  • R 4 , R 5 , R 7 , R 8 , R 9 , R 10 , R 11 , R 12 , R 13 are methyl groups, and R 6 is a hydrogen atom.
  • R 1 , R 2 , R 3 , and R 4 are each hydrogen atoms.
  • a polyester film was produced in the same manner as in Example 1, except that a silicone emulsion composition was produced using 0.8 parts by weight of sodium dioctyl 2-(sulfoethyl) succinate surfactant instead of the diol compound surfactant represented by the above chemical formula 3-1.
  • a polyester film was produced in the same manner as in Example 1, except that a silicone emulsion composition was produced using 0.8 parts by weight of sodium dioctyl 2-(phosphoethyl) succinate surfactant instead of the diol compound surfactant represented by the above chemical formula 3-1.
  • a polyester film was produced in the same manner as in Example 1, except that a silicone emulsion composition was produced using 0.8 parts by weight of dioctyl 2-(hydroxyethyl) succinate surfactant instead of the diol compound surfactant represented by the above chemical formula 3-1.
  • a polyester film was manufactured in the same manner as in Example 1, except that a silicone emulsion composition was manufactured using 0.03 parts by weight instead of 0.8 parts by weight of the diol compound surfactant represented by the chemical formula 3-1.
  • a polyester film was manufactured in the same manner as in Example 1, except that a silicone emulsion composition was manufactured using 3.0 parts by weight instead of 0.8 parts by weight of the diol compound surfactant represented by the chemical formula 3-1.
  • a polyester film was produced in the same manner as in Example 1, except that a silicone emulsion composition was produced using 100 parts by weight of alkenyl group-containing polysiloxane particles represented by the chemical formula 1-1 (Wacker, Dow Corning, D(50): about 400 nm, Mw: about 5,000 Daltons) and 5 parts by weight of alkyl group-containing polysiloxane particles represented by the chemical formula 2-1 (Wacker, Dow Corning, D(50): about 400 nm, Mw: about 5,000 Daltons).
  • a silicone emulsion composition was produced using 100 parts by weight of alkenyl group-containing polysiloxane particles represented by the chemical formula 1-1 (Wacker, Dow Corning, D(50): about 400 nm, Mw: about 5,000 Daltons) and 5 parts by weight of alkyl group-containing polysiloxane particles represented by the chemical formula 2-1 (Wacker, Dow Corning, D(50): about 400 nm, Mw: about
  • a polyester film was produced in the same manner as in Example 1, except that a silicone emulsion composition was produced using 100 parts by weight of alkenyl group-containing polysiloxane particles represented by the chemical formula 1-1 (Wacker, Dow Corning, D(50): about 700 nm, Mw: about 10,000 Daltons, in chemical formula 1-1, m and n are 120) and 5 parts by weight of alkyl group-containing polysiloxane particles represented by the chemical formula 2-1 (Wacker, Dow Corning, D(50): about 700 nm, Mw: about 10,000 Daltons, in chemical formula 2-1, a and b are 100).
  • alkenyl group-containing polysiloxane particles represented by the chemical formula 1-1 (Wacker, Dow Corning, D(50): about 700 nm, Mw: about 10,000 Daltons, in chemical formula 1-1, m and n are 120)
  • alkyl group-containing polysiloxane particles represented by the chemical formula 2-1 (Wacker,
  • a polyester film was produced in the same manner as in Example 1, except that a silicone emulsion composition was produced using 100 parts by weight of alkenyl group-containing polysiloxane particles represented by the chemical formula 1-1 (Wacker, Dow Corning, D(50): about 100 nm, Mw: about 2,500 Daltons, in chemical formula 1-1, m and n are 30) and 5 parts by weight of alkyl group-containing polysiloxane particles represented by the chemical formula 2-1 (Wacker, Dow Corning, D(50): about 100 nm, Mw: about 2,500 Daltons, in chemical formula 2-1, a and b are 25).
  • alkenyl group-containing polysiloxane particles represented by the chemical formula 1-1 (Wacker, Dow Corning, D(50): about 100 nm, Mw: about 2,500 Daltons, in chemical formula 1-1, m and n are 30) and 5 parts by weight of alkyl group-containing polysiloxane particles represented by the chemical formula
  • Each polyester film was attached to a cold-rolled stainless steel plate with a double-sided adhesive tape so that the cured layer was on top.
  • TESA7475 acrylic adhesive tape was attached on the cured layer, pressed with a 2 kg roller, and left at room temperature for 7 days, and then the peeling strength was measured. The peeling strength was measured 5 times using the following measuring device and measuring method, and the average value was used as the peeling strength.
  • Each polyester film was cut to a size of 50 mm x 250 mm to prepare a sample.
  • the prepared sample was stored at 25°C, 65% RH for 24 hours.
  • TESA7475 acrylic adhesive tape was attached to the surface of the cured layer and pressed at a load of 20 g/cm 2 at room temperature for 24 hours.
  • the TESA7475 acrylic adhesive tape attached to the surface of the cured layer was collected without contamination.
  • the collected TESA7475 acrylic adhesive tape was attached to the surface of a flat and clean polyethylene terephthalate (PET) substrate film and pressed once with a 2 kg roller (ASTMD-1000-55T).
  • the TESA7475 acrylic adhesive tape was peeled from the PET substrate film, and the peeling force was measured using the following measuring device and measuring method.
  • TESA7475 acrylic adhesive tape was attached to the surface of a polyethylene terephthalate (PET) substrate film with a flat and clean surface, and the tape was pressed once with a 2 kg roller (ASTMD-1000-55T) and the peel strength was measured using the following measuring device and method. Each measured peel strength was substituted into Equation 1 below to obtain the residual adhesion ratio (%).
  • Residual adhesion rate (%) [(Peel strength of acrylic adhesive tape peeled from the cured layer) / (Peel strength of unused acrylic adhesive tape) x 100]
  • Equation 2 The surface tension and liquid penetration depth of water and diiodomethane were measured for the cured layer of each polyester film. These measured values were substituted into Equation 2 to calculate the surface energy using the Owens-Wendt model.
  • E s is the surface energy (J/m 2 )
  • ⁇ 1 is the surface tension of the liquid (N/m)
  • k is the penetration coefficient (dimensionless)
  • h is the liquid penetration depth (m).
  • Each polyester film was cut to a size of 10 cm x 10 cm to prepare a sample.
  • An acrylic adhesive was applied to the surface of the cured layer of the prepared sample with a thickness of approximately 10 ⁇ m, and then the number of pinholes per unit area generated on the applied surface was observed with the naked eye.
  • the polyester films manufactured by Examples 1 to 6 had almost no pinhole defects, excellent adhesive wetting properties, and exhibited a peel strength of 20 gf/cm or less and a residual adhesion rate of 93% or more.
  • the polyester film manufactured by Comparative Example 1 had a large average particle size (D50) of the silicone resin, so there was a problem with the compatibility of the acrylic adhesive with the polar solvent, which resulted in a rapid increase in the number of pinholes.
  • the polyester films manufactured by Comparative Examples 2 and 3 had an excessively low or high weight average molecular weight (Mw) of the silicone resin, which resulted in an increase in the peel strength, and there was a problem with the compatibility of the acrylic adhesive with the polar solvent, which resulted in a rapid increase in the number of pinholes.
  • Mw weight average molecular weight

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Abstract

La présente invention concerne un film de polyester et un composant le comprenant. Le film de polyester comprend un substrat de polyester ; et une couche durcie d'une composition d'émulsion de silicone située sur au moins une surface du substrat de polyester, la composition d'émulsion de silicone comprenant au moins deux types de résines à base de silicone et un tensioactif, la masse moléculaire moyenne en poids d'au moins un type des résines à base de silicone étant de 3000 à 7000 daltons, et l'énergie de surface de la couche durcie pouvant être de 15 à 20 dyne/cm. Des trous de broche ne sont sensiblement pas générés à l'intérieur du film de polyester, et le film de polyester présente une faible résistance au pelage et une adhérence résiduelle améliorée tout en présentant une excellente mouillabilité adhésive.
PCT/KR2024/008707 2023-11-21 2024-06-24 Film de polyester et composant le comprenant Pending WO2025110382A1 (fr)

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CN202480008331.1A CN120584147A (zh) 2023-11-21 2024-06-24 聚酯膜和包含所述聚酯膜的组件

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014024206A (ja) * 2012-07-25 2014-02-06 Dexerials Corp 帯電防止性剥離フィルム
KR20140082029A (ko) * 2012-12-21 2014-07-02 도레이첨단소재 주식회사 실리콘 경화도가 우수하고 전사율이 낮은 실리콘 이형필름
JP2021046467A (ja) * 2019-09-17 2021-03-25 アイカ工業株式会社 剥離性シリコーン樹脂組成物及びこれを塗布した剥離フィルム
KR20220125576A (ko) * 2021-03-05 2022-09-14 도레이첨단소재 주식회사 이형필름
KR20220143494A (ko) * 2021-04-16 2022-10-25 도레이첨단소재 주식회사 양면 대전방지 실리콘 이형필름

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014024206A (ja) * 2012-07-25 2014-02-06 Dexerials Corp 帯電防止性剥離フィルム
KR20140082029A (ko) * 2012-12-21 2014-07-02 도레이첨단소재 주식회사 실리콘 경화도가 우수하고 전사율이 낮은 실리콘 이형필름
JP2021046467A (ja) * 2019-09-17 2021-03-25 アイカ工業株式会社 剥離性シリコーン樹脂組成物及びこれを塗布した剥離フィルム
KR20220125576A (ko) * 2021-03-05 2022-09-14 도레이첨단소재 주식회사 이형필름
KR20220143494A (ko) * 2021-04-16 2022-10-25 도레이첨단소재 주식회사 양면 대전방지 실리콘 이형필름

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