[go: up one dir, main page]

WO2025105491A1 - Dissipateur thermique en forme d'ailette en tige, son procédé de fabrication, et dispositif de refroidissement sur lequel un dissipateur thermique est monté - Google Patents

Dissipateur thermique en forme d'ailette en tige, son procédé de fabrication, et dispositif de refroidissement sur lequel un dissipateur thermique est monté Download PDF

Info

Publication number
WO2025105491A1
WO2025105491A1 PCT/JP2024/040720 JP2024040720W WO2025105491A1 WO 2025105491 A1 WO2025105491 A1 WO 2025105491A1 JP 2024040720 W JP2024040720 W JP 2024040720W WO 2025105491 A1 WO2025105491 A1 WO 2025105491A1
Authority
WO
WIPO (PCT)
Prior art keywords
rod
fin
shaped
cooling
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2024/040720
Other languages
English (en)
Japanese (ja)
Inventor
博茂 新保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maruei
Maruei Co ltd
Original Assignee
Maruei
Maruei Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maruei, Maruei Co ltd filed Critical Maruei
Publication of WO2025105491A1 publication Critical patent/WO2025105491A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a rod-shaped fin heat sink and a manufacturing method thereof, as well as a cooling device incorporating the heat sink, and in particular to a rod-shaped fin heat sink that is equipped with rod-shaped fins and forcibly cools electronic elements that generate heat during operation, as well as a manufacturing method thereof, and a cooling device incorporating the heat sink.
  • Semiconductor packages play such an important role that a natural or forced cooling heat sink is used in contact with the semiconductor package as a mechanism for suppressing temperature rise caused by heat generation during operation through heat exchange.
  • a natural or forced cooling heat sink is used in contact with the semiconductor package as a mechanism for suppressing temperature rise caused by heat generation during operation through heat exchange.
  • Patent Document 1 JP Patent Publication No. 2020-92250.
  • Patent Document 1 shows a heat sink that uses pin fins with an approximately diamond-shaped cross section, in which three semiconductor units are arranged in parallel, such as a three-phase inverter with U, V, and W phases, and a refrigerant is supplied and passed through from the same cooling source.
  • the circuit boards of the three-phase semiconductor modules (units) of U-phase, V-phase, and W-phase are mounted in contact with one surface of the base plate, and a fin area is set on the other surface large enough to encompass the combined area of the three circuit boards.
  • Rod-shaped cooling pin fins with a diamond-shaped cross section and long in the vertical direction are integrally erected on the surface of the base plate at a predetermined uniform density throughout this fin area.
  • the space in which the multiple cooling pin fins are erected is closed off by a wall in the shape of a thin, roughly rectangular parallelepiped.
  • the refrigerant is sent in from an input port provided on one side at one end of the closed space in the longitudinal direction, flows inside, and is discharged from an output port provided on the other side at the other end of the longitudinal direction.
  • the heat sink described in Patent Document 1 above has a refrigerant inlet and outlet set at positions diagonally opposite each other with respect to a single rectangular collection of evenly-spaced pin fins in a plan view.
  • the refrigerant that flows in from the inlet at a specified pressure seeps through between the multiple pin fins and flows out from the outlet, but it takes a long time for this passage to reach a steady state. In other words, the time constant until a state of thermal equilibrium is reached is large, and the thermal energy also increases accordingly.
  • the heat sink according to the present disclosure is provided as a rod-shaped fin heat sink that dissipates heat generated from a package enclosing an electronic element such as a power semiconductor in association with the operation of the electronic element through heat exchange with a forcibly supplied cooling fluid.
  • This rod-shaped fin heat sink comprises a first rod-shaped fin and a second rod-shaped fin that are thermally conductive, and a thermally conductive base portion on which the first rod-shaped fin and the second rod-shaped fin are erected.
  • the base portion is capable of contacting the multiple packages and has a first surface that absorbs the heat generated by the electronic elements and a second surface that faces back to back with the first surface and to which the heat is transferred.
  • a plurality of cooling areas for cooling each of the plurality of packages are arranged in a vertical row along a predetermined direction in which the input cooling fluid flows.
  • a fin assembly consisting of a plurality of the first rod-shaped fins is erected based on the cooling capacity required for each of the packages. Furthermore, on the second surface, side areas adjacent to the cooling areas are set on both sides in the lateral direction intersecting with the passing direction.
  • the feature is that in each of the side areas on both sides, a plurality of the second rod-shaped fins are erected to control the flow of the cooling fluid so that the cooling fluid input through the inlet area is directed toward the plurality of cooling areas.
  • a cooling device equipped with this rod-shaped fin-shaped heat sink is also provided.
  • a fluid circulation means is provided for circulating the cooling fluid through the rod-shaped fin-shaped heat sink to perform heat exchange between the rod-shaped fins of the heat sink and the cooling fluid.
  • This manufacturing method includes a first step of setting a pin alignment jig, which has a plurality of through holes formed therein that correspond to the diameters and erected positions of the plurality of rod-shaped fins, on the base portion so as to face the second surface, and inserting the plurality of rod-shaped fins into the plurality of through holes so that one end of each of the plurality of rod-shaped fins protrudes from the plurality of through holes; a second step of setting a pressure jig that applies pressure between the first surface of the base portion and one end of each of the rod-shaped fins protruding from the through holes of the pin alignment jig; a third step of diffusion-bonding or brazing the other end of each of the pins to the second surface of the base portion while applying pressure with the pressure jig; a fourth step of removing the pin alignment jig from the plurality of rod-shaped fins after the third step;
  • the present invention is characterized by having the following.
  • the present disclosure provides a rod-shaped fin heat sink that dissipates heat generated from a package enclosing an electronic element as the electronic element operates by heat exchange between a forcedly supplied cooling fluid and thermally conductive rod-shaped fins, as well as a method for manufacturing the same and a cooling device equipped with the rod-shaped fin heat sink.
  • FIG. 1 is a schematic diagram showing a rod-shaped fin heat sink according to a first embodiment and a cooling device equipped with the rod-shaped fin heat sink.
  • FIG. 2 is a plan view showing a schematic configuration of the upper surface of the heat sink as viewed along the line AA' in FIG.
  • FIG. 3 is a plan view showing a schematic configuration of the lower surface of the heat sink as viewed along the line BB' in FIG.
  • FIG. 4 is an enlarged partial view of a local portion Gin in FIG. 3 for explaining the shape, size, positional relationship, etc. of the rod-like fins.
  • FIG. 5 is a system configuration diagram of the cooling device.
  • FIG. 5 is a system configuration diagram of the cooling device.
  • FIG. 6 is a graph conceptually illustrating the cooling capacity consumed by each cooling area in a rod-shaped fin type heat sink according to the present disclosure, which has a plurality of cooling areas arranged in a vertical row.
  • FIG. 7 is a plan view illustrating a schematic configuration of the lower surface (one surface) of the rod-shaped fin heat sink according to the second embodiment.
  • FIG. 8 is a plan view illustrating a schematic configuration of the lower surface (one surface) of the rod-shaped fin heat sink according to the first modification.
  • FIG. 9 is a plan view illustrating a schematic configuration of the lower surface (one surface) of the rod-shaped fin heat sink according to the second modification.
  • FIG. 7 is a plan view illustrating a schematic configuration of the lower surface (one surface) of the rod-shaped fin heat sink according to the second embodiment.
  • FIG. 8 is a plan view illustrating a schematic configuration of the lower surface (one surface) of the rod-shaped fin heat sink according to the first modification.
  • FIG. 9 is a plan view illustrating
  • FIG. 10 is a plan view showing a schematic configuration of the lower surface (one surface) of the rod-shaped fin heat sink according to the third modification, illustrating how two semiconductor packages are arranged in a vertical line.
  • FIG. 11 is a diagram illustrating the schematic configuration of a rod-shaped fin-type heat sink relating to variant example 4 (FIG. 11A), a schematic plan view taken along line A-A' (FIG. 11B), and a schematic plan view taken along line B-B' (FIG. 11C).
  • FIG. 12 is a plan view illustrating a schematic configuration of the lower surface (one surface) of the rod-shaped fin heat sink according to the fifth modification.
  • FIG. 13 shows Modification 6, and in particular illustrates the inverted trapezoidal fin cross sections taken along lines CC' and DD' shown in FIG.
  • FIG. 14 shows a seventh modified example, and in particular illustrates a different positional relationship between the input and output ports and a configuration in which the flow paths are not linear.
  • FIG. 15 shows an eighth modification, and is a diagram for explaining an example of an arrangement of rod-like fins with a change in the flow path direction.
  • FIG. 16 shows a ninth modified example, and is another diagram for explaining an example of an arrangement of rod-like fins with a change in the flow path direction.
  • FIG. 17 is a flow chart outlining a method for manufacturing a rod-fin heat sink according to the third embodiment.
  • FIG. 18 is a diagram illustrating members required in each step of the manufacturing method.
  • FIG. 19 is a diagram for explaining each step of the manufacturing method.
  • FIG. 20 illustrates the corrosion protection structure according to the modified example 10, and also illustrates corrosion protection of the base plate and rod-shaped fins.
  • Figure 1 shows the basic structure of the rod-shaped fin heat sink according to the first embodiment.
  • the configuration shown in Figure 1 is a schematic view from the side perspective, focusing on the cooling device 1 that cools three semiconductor packages PK1, PK2, and PK3 (also simply called packages, and sometimes called modules), which are packages of three power semiconductors used in the control circuit of a drive motor mounted on an EV or the like.
  • PK1, PK2, and PK3 also simply called packages, and sometimes called modules
  • the three semiconductor packages PK1, PK2, PK3 may be, for example, packages of inverter circuits for the U, V, and W phases that control a single three-phase AC motor.
  • the cooling capacity required to dissipate the heat generated from the electric circuits (including power semiconductors (electronic elements) that switch large currents) of the three semiconductor packages PK1, PK2, PK3 is usually the same.
  • the three semiconductor packages PK1, PK2, and PK3 may be semiconductor packages mounted on different types of electronic circuits. In that case, at least a portion of the cooling capacity required for the three semiconductor packages PK1, PK2, and PK3 described above may differ from that of the remaining ones. When the cooling capacities are different, the three semiconductor packages may be expressed as three "types" of semiconductor packages.
  • the rod-shaped fin heat sink disclosed herein is intended for a structure in which multiple packages containing electrical elements such as semiconductor elements (including power semiconductors) that need to be cooled to release heat during operation are arranged in a vertical row, and its basic feature is that it can cool multiple packages "all at once" with a single heat sink.
  • the number of packages mounted on one heat sink is two or more; here, three semiconductor packages are given as a representative example, but it goes without saying that it may be two semiconductor packages or four or more semiconductor packages, such as power semiconductor packages.
  • This cooling device 1 employs a forced cooling method that forcibly circulates a cooling fluid, such as cooling water, cooling air, or a refrigerant (e.g., freon gas). Note that the structures for such forced cooling are known, so the explanation of such structures is simplified.
  • a cooling fluid such as cooling water, cooling air, or a refrigerant (e.g., freon gas).
  • this cooling device 1 includes a rod-shaped fin-type heat sink 12 (hereinafter also referred to simply as a heat sink, including a heat sink main body 30 described later) on which multiple (types) of power semiconductor packages (hereinafter also referred to simply as semiconductor packages) PK1, PK2, PK3 are mounted in contact with one surface of the heat sink.
  • the cooling device 1 includes a substantially box-shaped cover 14 disposed to enclose and face the rod-shaped fin-shaped heat sink 12 and to define a cooling space SP through which a cooling fluid FL flows.
  • the cooling device 1 further includes an input port 16A and an output port 16B for allowing the cooling fluid FL to flow in and out on both sides of a side surface 14A of the cover 14 that face each other in the fluid flow direction (the Y-axis direction in FIG. 1), a pipe 18 connecting the ports 16A and 16B, and a fluid supply device (fluid source) 19 inserted in the middle of the pipe 18.
  • the heat sink 12 has a function of receiving heat from the semiconductor packages PK1, PK2, and PK3, and includes a base plate (base portion) 20 that is rectangular in plan view (e.g., rectangular: see Figures 2 and 3), and a number of rod-shaped fins 22 (also called pin fins) that are classified as long, thin, rod-shaped cooling fins and are erected on the base plate 20.
  • a base plate base portion 20 that is rectangular in plan view (e.g., rectangular: see Figures 2 and 3)
  • rod-shaped fins 22 also called pin fins
  • the unit is referred to as the heat sink main body.
  • the rod-shaped fins 22 used are two types of rod-shaped fins with different cross-sectional shapes, the first rod-shaped fin 221 and the second rod-shaped fin 222, whose cross-sectional shapes in the horizontal direction (direction of the XY plane) intersecting with the length direction (Z-axis direction (height direction) when erected: see FIG. 1) are elliptical, rectangular, and circular.
  • these first to second rod-shaped fins 221, 222 are also collectively referred to simply as rod-shaped fins 22 (: 221, 222).
  • the base plate 20 and the rod-shaped fins 22 (221, 222) are both made of a metal material with high thermal conductivity, such as aluminum or an aluminum alloy (hereinafter simply referred to as “aluminum” or “aluminum”), or copper or a copper alloy (hereinafter simply referred to as “copper”).
  • aluminum aluminum alloy
  • copper copper alloy
  • the base plate 20 and the multiple rod-shaped fins 22 are each prepared as separate parts, and the two are joined together, for example, by brazing or diffusion bonding, to form the main part of the heat sink 12.
  • the base plate 20 and the rod-shaped fins 22 are both made of copper or a copper alloy and the cover 14 is made of aluminum, from the standpoint of corrosion prevention, at least the portion of the base plate 20 that abuts the cover 14, the rod-shaped fins 22, and the surface of the aluminum cover 14 that is exposed to the cooling space SP are subjected to a corrosion prevention surface treatment, for example nickel plating.
  • a corrosion prevention surface treatment for example nickel plating.
  • the base plate 20 and the rod-shaped fins 22 may be made of different materials (e.g., aluminum and copper, aluminum and brass, etc.).
  • the short side direction of the rectangular base plate 20 is taken as the X-axis, and the Y-axis and Z-axis perpendicular to this X-axis are set as shown in Figures 1 to 3.
  • the long direction of the base plate 20 is the Y-axis direction, which corresponds to the direction in which the cooling fluid FL flows through the cooling space SP (passing direction (defined as a specified direction)), and the height (thickness) direction corresponds to the Z-axis direction.
  • the flow of the cooling fluid FL does not necessarily coincide with these physical directions.
  • a structure in which multiple cooling areas are arranged vertically is adopted, and it is intended that the fluid FL passes in the vertical direction.
  • the flow direction Y roughly corresponding to the Y-axis direction
  • the board longitudinal direction Y but both are intended to mean the same direction.
  • the horizontal direction X roughly corresponding to the X-axis direction
  • the "vertical row” mentioned in this embodiment means that the areas and fins are lined up vertically in one direction (vertical row), similar to vertical parking of a vehicle.
  • the Z-axis direction is taken in the direction from the upper surface of the base plate 20 (the surface on which the semiconductor package is abutted and placed) to the lower surface (the surface on which the multiple rod-shaped fins 22 are erected).
  • the rod-shaped fins 22 (221, 222) are classified as "fins that are elongated in the vertical direction compared to the size of the horizontal cross section of the fin” (they are also simply called pin fins).
  • the rod-shaped fins 22 themselves have both ends in the longitudinal direction LE (Z-axis direction) (tip end 22T and bottom end 22R in the Z-axis direction in FIG. 1).
  • “rod-shaped” means “elongated and straight, or almost straight", and is the usual concept of "elongated and straight”.
  • the shape of the horizontal cross section does not have to be a perfect rod, and even if the shape is somewhat irregular, it is understood to be “rod-shaped” as long as it is close to "elongated and straight, or almost straight”.
  • the size of the cross section in the horizontal direction (direction along the XY plane) perpendicular to the longitudinal direction LE may be constant regardless of the position in the height direction of the cross section, or conversely, it may be formed so that the closer the cross section position is to the tip end 22T, the larger it becomes. In the latter case, in the upright state, the tip end 22T has a thicker inverted triangular cross section than the lower end 22R.
  • the shape of the rod-like fin 22 may be a round rod shape for the entire fin, or may be a prism shape with a square (rectangular) cross section, or a triangular prism shape with a triangular cross section. Similarly, it may be a polygonal prism shape with pentagons or more.
  • the above-mentioned heat sink 12 has the following basic configuration.
  • the base plate 20, which functions as a base portion, has an upper surface 20U (first surface) that abuts against the three semiconductor packages PK1, PK2, PK3 and allows the arrangement of the semiconductor packages PK1, PK2, PK3, and a lower surface 20L (second surface) that faces the upper surface 20U and faces back to back.
  • the lower surface 20L is covered by the above-mentioned cover 14 so as to leave a space.
  • This space functions as a cooling space SP that contains rod-shaped fins 22, which will be described later, and through which a cooling fluid FL, which will be described later, flows while being in contact with the surfaces of the rod-shaped fins 22.
  • multiple cooling areas C1, C2, C3 that require the same or different amounts of heat exchange to cool each of the three packages PK1, PK2, PK3 are arranged vertically along the flow direction of the cooling fluid FL (Y-axis direction (predetermined direction), hereinafter sometimes simply referred to as "Y").
  • These multiple cooling areas C1, C2, C3 are back-to-back and directly facing the occupied areas of each of the multiple packages PK1, PK2, PK3 arranged on the upper side 20U of the base plate 20.
  • each of the multiple cooling areas C1, C2, C3 may be set to be larger than the occupied area by a predetermined margin.
  • this heat sink 12 is that, as shown in FIG. 3, three cooling areas C1, C2, C3, each having the same (or different) amount of heat exchange required for cooling, are arranged vertically along the flow direction Y of the cooling fluid FL, and first to third fin assemblies G1, G2, G3 are provided in each of the cooling areas C1, C2, C3, each of which is made up of rod-shaped fins 22 (first rod-shaped fins 221) that provide a cooling capacity according to the amount of heat exchange required for that area.
  • each first rod-shaped fin 221 is aligned along the flow direction Y of the cooling fluid FL (see Figures 3 and 4).
  • the fluid FL flows along the streamlined side surfaces SF of each first rod-shaped fin 221 (see arrows F11 and F12 in Figure 4).
  • the area of these fin side surfaces SF can be made larger than the side surface (part of the circumferential surface) of a normal round bar fin.
  • the first rod-shaped fin 221 has a larger contact area with the fluid FL than a round bar fin, making it possible to increase the amount of heat exchange.
  • the second feature is the fin arrangement of each of the first to third fin assemblies G1, G2, G3.
  • the first rod-shaped fins 221 are arranged in fin columns J1 to Jn (n is a positive integer in this embodiment) in which a plurality of first rod-shaped fins 221 are arranged in a vertical line in the flow direction Y (Y-axis direction) with a certain gap GP between them.
  • These fin columns J1 to Jn are arranged in the flow direction Y at horizontal positions x1, x2, x3, ..., xn positioned at a certain pitch PT (see FIG.
  • each fin column J1 (to Jn) is arranged in a vertical line with a certain gap GP (see FIG. 4) between the first rod-shaped fins 221 and the length L in the long axis LG direction in each cooling area C1 (C2, C3).
  • the odd-numbered fin columns J1...Jn-1 are composed of an odd number (e.g., seven) of first rod-shaped fins 221, while the even-numbered fin columns J2...Jn are composed of an even number (e.g., six) of first rod-shaped fins 221, which is one less than the odd-numbered fin columns J1...Jn.
  • every other fin from the first fin column J1 is arranged so that the leading first rod-shaped fin 221 1 (221 3 7) protrudes upstream in the flow direction Y by a length HF of approximately half a fin (see FIGS. 3 and 4).
  • the first rod-shaped fins 221 are arranged in a staggered manner when viewed both in the horizontal direction (X-axis direction) and in the flow direction (Y-axis direction).
  • this staggered fin arrangement has the first rod-shaped fins 221 1 , 221 3 , ... protruding in the flow direction Y. Therefore, the cooling fluid can easily flow into the gaps CS in the horizontal direction X between these leading first rod-shaped fins 221 1 , 221 3 , ... (see FIGS. 3 and 4).
  • the fluid components that flow into this gap CS are diverted to both sides in the horizontal direction X while heading toward each of the first rod-shaped fins 221 2 , 221 4 , ... at the head of the even-numbered fin columns J2, J4, ....
  • the diverted flow components then become a flow that is almost laminar and flow along the Y-axis direction between the fin columns J1 to Jn (see arrow F1).
  • the first rod-shaped fin 221 with an elliptical cross section at the head of the fin columns J1 to Jn produces a straightening effect, converting the subsequent flow into a flow that is almost laminar.
  • this "near-laminar flow” refers to a state in which the fluid FL flows along a thin flow path PA formed between multiple fin columns J1-Jn, in the board longitudinal direction Y, and while contacting the streamlined surface of each rod-shaped fin 221 (see arrows F11 and F12).
  • this near-laminar flow is represented by the directions of the arrows F11 and F12 slightly deflecting in the horizontal direction X for each fin.
  • the fluid flowing through the flow path PA can flow at a high speed while regularly deflecting slightly left and right (in the horizontal direction X).
  • an arrangement structure is formed in which the first rod-shaped fins 221 protrude downstream by approximately the length HF of half a fin, as described above, for every other fin column J1 to Jn.
  • This protruding fin structure also has the effect of urging (pushing) the fluid FL toward the downstream area. This can contribute to the creation of a flow close to laminar flow in the second and third cooling areas C2 and C3 on the downstream side, as described above.
  • This flow close to laminar flow of the cooling fluid FL can further reduce pressure loss when the fluid flows sequentially through the three cooling areas C1, C2, and C3.
  • the staggered vertical arrangement of the fins and the protruding arrangement of every other leading fin of the fin columns J1 to Jn in the flow direction Y are the same in the multiple cooling areas C1, C2, and C3.
  • factors such as the size, number, and arrangement density of the first rod-shaped fins 221 can be changed as appropriate while maintaining the basic fin arrangement described above.
  • first and second separation areas S1, S2 are set on the lower surface 20L of the base plate 20, which spatially separate two adjacent cooling areas C1, C2 (C2, C3) among the three cooling areas C1, C2, C3 in the flow direction Y by a distance Yx.
  • the three cooling areas C1, C2, and C3 may be arranged adjacent to each other with only a small gap of a predetermined width so that they are substantially adjacent to each other in the flow direction Y.
  • an inlet area IT is provided that is connected to the input port 16A and allows the cooling fluid to flow in upstream in the flow direction Y
  • an outlet area ET is provided that is connected to the output port 16B and allows the cooling fluid to flow out downstream in the flow direction Y.
  • the inlet area IT may be omitted and the input port 16A may be directly connected to the first stage cooling area C1.
  • the flow direction Y (predetermined direction) is a linear direction from the entrance area IT to the exit area ET, and the entrance area IT and the exit area ET are formed directly opposite each other in the flow direction Y on the lower surface 20L of the base plate 20.
  • the input port 16A and the output port 16B described above are also directly opposite each other in the flow direction Y.
  • no rod-shaped fins are provided in the two separation areas S1, S2, the entrance area IT, and the exit area ET.
  • the cooling fluid FL flows along the area (i.e., the lower surface 20L) without resistance from the fins.
  • the underside 20L of the base plate 20 is the area in the cooling space SP that cooperates with the rod-shaped fins 22 to exchange heat with the fluid FL.
  • the cooling areas C1, C2, and C3 where heat exchange is desired to occur, in reality, in the continuous base plate 20 (metal plate), it is not possible to distribute the transmitted heat to only localized areas. For this reason, the fluid FL also passes around the periphery of the cooling areas C1, C2, and C3, which promotes the heat exchange action.
  • side areas ER and EL of a constant width Xf are set along the longitudinal direction (Y-axis direction: fluid flow direction) on both the outsides of the cooling areas C1, C2, and C3, the separation areas S1 and S2, the entrance area IT, and the exit area ET in the short-side direction (X-axis direction) of the base plate 20.
  • Y-axis direction fluid flow direction
  • the widths of the short-side direction (X-axis direction) of both side areas ER and EL may be different from each other.
  • multiple rod-shaped fins 22 (second rod-shaped fins 222) with a rectangular cross section are arranged in both side areas ER and EL.
  • These rod-shaped fins 22 have a rectangular horizontal cross section (XY cross section) perpendicular to the height direction LE (Z-axis direction), but are composed of so-called plate-shaped fins.
  • XY cross section rectangular horizontal cross section
  • LE Z-axis direction
  • plate-shaped fins are also formed within a range in which the aspect ratio of the cross section described above can be considered rod-shaped.
  • These multiple rod-shaped fins 22 therefore have flat sides SD, but are arranged so that the sides SD are angled at a constant angle ⁇ with respect to the flow direction Y (sink longitudinal direction).
  • This angled arrangement is the same in both side areas ER, EL.
  • the density of the angled arrangement of the fins in the flow direction Y is constant, as can be seen from Figure 3.
  • the multiple second rod-shaped fins 222 in each of the side areas ER and EL function to urge (push) the cooling fluid FL flowing in from the input port IT from both sides toward the center in the short direction X with their side surfaces SD.
  • This urging exerts a control function of directing the flow of the fluid FL toward the center (see arrows OQ in FIG. 3).
  • there are gaps between the multiple second rod-shaped fins 222 so there are also fluid components (not shown) that pass through (seep out) the gaps, and these fluid components provide supplemental cooling capacity by heat exchange via the second rod-shaped fins 222 in each of the side areas ER and EL.
  • the flowing cooling fluid FL is concentrated in the central region in the horizontal direction (X-axis direction), i.e., on the side of the cooling areas C1, C2, and C3, due to the flow control function of the second rod-shaped fins 222, and a part of the fluid FL is used to perform auxiliary heat exchange in both side areas ER and EL, contributing to cooling.
  • the side areas ER and EL retain auxiliary cooling capacity, thereby assisting the cooling areas C1, C2, and C3 to have the desired cooling capacity, and by concentrating the cooling capacity as much as possible in the cooling areas C1, C2, and C3, the cooling areas C1, C2, and C3 can provide the desired cooling capacity more quickly (i.e., with a smaller time constant until thermal equilibrium).
  • the cooling energy can be efficiently concentrated in the area that requires it.
  • the flow of the cooling fluid FL which is close to a rectified laminar flow, can reduce the pressure loss of the flow.
  • the arrangement density of the second rod-shaped fins 222 may be formed to decrease continuously or in steps as it moves downstream in the sink longitudinal direction Y (flow direction). This is because the degree of convergence of the fluid toward the output port 16B increases as it moves downstream, and the flow control function may become weaker.
  • the cooling fluid FL discharged from the fluid source 19 flows into the cooling space SP from the input port 16A, and flows therein, i.e., through the cooling space SP, along the sink longitudinal direction Y according to the thermal resistance of the entire fluid system.
  • the fluid FL passes in order from the rod-shaped fin (pin fin) assembly G1 located on the most upstream side to the rod-shaped fin (pin fin) assembly G3 located on the most downstream side, and exits from the output port 16B and returns to the fluid source 19.
  • the circulation of the fluid FL is continuous throughout the heat sink 12 as a whole, with a flow velocity and flow rate according to the discharge pressure P (i.e., flow velocity (m/s)) of the fluid source 19 and the thermal resistance K (°C/W) of the fluid system of the heat sink 12, as shown in FIG. 5.
  • P discharge pressure
  • K thermal resistance
  • the first rod-shaped fin 221 has an elliptical cross section, and as shown in Figs. 3 and 4, its long axis LG is oriented along the flow direction Y of the cooling fluid FL. Moreover, the first rod-shaped fins 221 are arranged in a vertical line along the flow direction Y (Y-axis direction). For this reason, the flow F1 between every other vertical line of the first rod-shaped fins 221 in the short direction X has less resistance than the flow between the rows of round rod-shaped fins similarly arranged in a vertical line, and is therefore faster and closer to laminar.
  • the surface area R of each of the first rod-shaped fins 221 in the flow direction Y is larger than that of, for example, a round rod fin.
  • the multiple vertical lines J1 made up of the first rod-shaped fins 221 have less resistance to the fluid FL, and can have a larger surface area R in contact with the fluid FL.
  • the fluid FL flows faster while coming into contact with each fin 221 more.
  • the arrangement of the first rod-shaped fins 221 in the short direction X i.e., the arrangement of the multiple vertical rows J1
  • the leading first rod-shaped fins 221 1 , 221 2 , ... are staggered in the flow direction Y.
  • a flow straightening effect for guiding the fluid flow to a flow close to a laminar flow can be imparted between the staggered leading first rod-shaped fins 221 1 , 221 2 , ....
  • the flow of the cooling fluid FL in the first fin assembly G1 can be converted more reliably into a flow close to laminar flow, and the pressure loss of the flow is also reduced, so that the high-speed flow F1 allows for more heat exchange and provides efficient cooling capacity.
  • the fluid FL that has cooled the first stage in the above manner passes through the fin assembly G2 located in the next stage (see arrow F2). During this passage, it comes into contact with the surfaces of each rod-shaped fin 22, and thus the cooling area C2, i.e., the semiconductor package PK2, is cooled through the same heat exchange as described above (heat exchange amount QS2). The fluid after this cooling is set so that it still has a certain amount of cooling capacity (heat exchange amount) remaining (see Figure 6). For this reason, the fluid FL that has cooled further passes through the fin assembly G3 located in the final stage (see arrow F3).
  • cooling area C3, i.e., the semiconductor package PK3, is cooled through the same heat exchange as described above (heat exchange amount QS3) (see Figure 6).
  • heat exchange amount QS3 heat exchange amount
  • the cooling fluid FL passing through the second and third fin assemblies G2, G3 that line the cooling areas C2, C3 can also obtain the same more efficient cooling capacity as the first fin assembly G1 that lines the first-stage cooling area C1 described above.
  • multiple cooling areas C1, C2, C3 are arranged in a vertical row along the flow direction (sink longitudinal direction) Y of the cooling fluid FL discharged from one fluid source.
  • multiple packages PK1, PK2, PK3 with the same (or different) heat exchange amounts QS1, QS2, QS3 required for cooling can be arranged in a vertical row on the upper surface 20U of the base plate 20.
  • the three semiconductor packages PK1, PK2, PK3 are packages of switching semiconductors for the U, V, and W phases, and typically the cooling capacity required for the U, V, and W phases is the same for these semiconductor packages PK1, PK2, PK3.
  • the first semiconductor package PK1 is used to control a three-phase inverter of a motor
  • the second and third semiconductor packages PK2 and PK3 are used for a DC-DC converter, DC-AC converter, etc.
  • the cooling capacities required for the semiconductor packages PK1, PK2, and PK3 often differ from one another.
  • two types of rod-shaped fins 221, 222 with different cross sections in the lateral direction are arranged in rows on the underside 20L of the base plate 20 facing the cooling space SP in the target cooling areas C1, C2, C3 and their two side areas FL, FR. This allows the cooling effect to be exerted from the entire underside 20L of the base plate 20, which facilitates cooling that meets the requirements for the cooling areas C1, C2, C3.
  • the cooling energy of the cooling fluid discharged from one fluid supply device 19 can be consumed for each cooling area, starting from the first cooling area C1, while cooling three semiconductor packages PK1, PK2, and K3 simultaneously (in parallel) with heat exchange amounts QS1, QS2, and QS3 that match the cooling demand.
  • this embodiment can exert control over the flow direction of the fluid FL by arranging the second rod-shaped fins 222 with rectangular cross sections at an angle, as described above. This allows the cooling energy to be concentrated more in the cooling areas C1, C2, and C3 that require cooling, and can also improve the cooling efficiency of the entire heat sink.
  • the second rod-shaped fins 222 do not necessarily have to have a rectangular or circular cross section, and may have, for example, a diamond or triangular cross section as long as they can exert similar control and function. Also, it is possible to adopt only the oblique arrangement of the second rod-shaped fins 222 so as to achieve flow direction control of the second rod-shaped fins 222.
  • the shape of the rod-like fins (also called pin fins) that stand in each cooling area is, for example, a circular, diamond, elliptical, triangular or more polygonal cross section that intersects with the fin height direction. Therefore, the heat exchange amount is appropriately set according to the required heat exchange amount by design factors such as the cross-sectional shape, size (size of the cross section), height, and pin arrangement density.
  • the flow direction control described above can be obtained, and a high-speed fluid flow close to laminar flow can be obtained. Therefore, in addition to the simple cooling structure using one fluid circulation means for the vertical arrangement structure of multiple semiconductor packages described above, the transition to a thermal equilibrium state is also quicker, reducing the pressure loss of the flow and reducing the overall cooling energy. Therefore, for the same cooling conditions, the capacity required for the fluid supply device 19 is smaller, making it possible to miniaturize the entire system.
  • the flow direction Y (sink longitudinal direction) of the fluid FL is linear, and the inlet area IT and the outlet area ET face each other along the flow direction Y. Therefore, the areas and pin arrangements can be designed symmetrically in the horizontal direction (X-axis direction) perpendicular to the flow direction Y, which makes the design easier.
  • a rod fin heat sink according to a second embodiment of the present disclosure will be described with reference to FIG.
  • FIG. 7 shows a schematic example of the arrangement of the rod-shaped fins 22 of the rod-shaped fin heat sink 12A according to the second embodiment. This FIG. 7 shows the arrangement example shown in the same plan view as FIG. 3 described in the first embodiment above.
  • This rod-shaped fin heat sink 12A differs from the first embodiment in the fin arrangement to enhance the aforementioned straightening effect.
  • the rest of the configuration is the same as that of the first embodiment.
  • guide fin rows B3 to Bn -1 that provide a straightening effect are arranged in the entrance area IT and the first and second separation areas S1 and S2, respectively.
  • no guide fin row is arranged in the exit area ET.
  • this guide fin row is arranged only in the empty areas prior to the cooling areas C1, C2, and C3 in the next stage.
  • the row positions in the horizontal direction (X-axis direction) of the multiple fin columns J1, J2, ... aligned in the flow direction Y (Y-axis direction) are defined as x1 , x2 , x3 , ... and xn .
  • a plurality of first rod-shaped fins 221 are vertically arranged along the flow direction Y with a predetermined gap between each other. This arrangement itself is the same as that described in the first embodiment.
  • guide fin rows B 3 , B 5 , ..., B n-1 are respectively arranged upstream of the third fin columns J 3 , J 5 , ..., J n-1 .
  • Each of these guide fin rows B 3 , B 5 , ... B n-1 is composed of third rod-shaped fins 22 (223) having a circular cross section in the horizontal direction (XY plane direction) arranged in pairs (fins 223 1 , 223 2 ) with a predetermined gap between them along the flow direction Y.
  • the radius r a of the third rod-shaped fin 223 (fins 223 1 , 223 2 ) is formed to be equal to or smaller than the length S of the first rod-shaped fin 221 in the direction of the minor axis TG (r a ⁇ S).
  • Each guide fin row B3 ( B5 , ...) may be composed of three or more rod-shaped fins with circular cross sections arranged in a vertical row at a distance from each other, or may be rod-shaped fins with elliptical cross sections, rhombic cross sections, or even triangular cross sections.
  • Each guide fin row B3 ( B5 , ...) may be composed of a single rod-shaped fin, in which case an elongated rod-shaped fin with an elliptical cross section is more convenient.
  • guide fin rows may also be arranged in row positions P1 and Pn at both ends.
  • the guide fin rows B3 , B5 , ..., Bn -1 are disposed on the upstream side of the cooling areas C1, C2, C3 in the flow direction Y.
  • the rod-shaped fin heat sink 12B according to this modification, an alternative structure to the guide fin rows B 3 , B 5 , ..., B n-1 described in the second embodiment is adopted. Specifically, as shown in FIG. 7, the cross-sectional elliptical shape of the leading rod-shaped fin 221 h of each of the third fin columns J 3 , J 5 , ..., J n-1 arranged at row positions x 3 , x 5 , ..., x n-1 in the horizontal direction (X-axis direction ) is made more elongated.
  • the ratio of the length R' in the major axis direction LG to the length S in the minor axis direction TG of only this leading rod-shaped fin 221 h is within the category of a rod-shaped fin (pin fin) called 5:1, for example. That is, the length R' of this leading rod-shaped fin 221 h has a relationship of R'>R with the length R of the other rod-shaped fins 221.
  • This structure of the elongated rod-shaped fin 221h is adopted in each of the first, second and third fin assemblies G1, G2 and G3.
  • the flowing cooling fluid FL of the elongated rod-shaped fins 221h is diverted further upstream by the gaps between the leading portions of the adjacent rod-shaped fins 221h , thereby providing the aforementioned straightening effect.
  • the structure and effects other than those described above are the same as those of the second embodiment.
  • the structure is simpler because it only requires extending some of the rod-shaped fins located at the leading ends of the first, second, and third fin assemblies G1, G2, and G3.
  • Modification 2 relates to a modification of the rod-shaped fin type heat sink according to the second embodiment described above.
  • Figure 9 shows a schematic example of the arrangement of the rod-shaped fins 22 of the rod-shaped fin heat sink 12C according to this modified example 2.
  • This Figure 9 shows the arrangement example shown in the same plan view as Figure 7 described in the second embodiment above.
  • the rod-shaped fins arranged in each (or one) of the side areas ER and EL are rod-shaped fins 22 (223) with a circular horizontal cross section.
  • These round rod-shaped fins 223 are arranged in place of the rod-shaped fins 22 (222) with a rectangular cross section described above, and, as described above, perform the flow control function of biasing the flow of the fluid FL towards the cooling areas C1, C2, and C3.
  • the arrangement density of the round bar fins 223 is set to decrease the further downstream. This is because the flow of the fluid FL converges more strongly toward the exit area ET (output port 16B) the further downstream it goes.
  • This is set by changing the size and arrangement density (number of arrangements) of the first rod-shaped fins 221, which have an elliptical cross-sectional shape. The heights of the fins may be different from each other.
  • this modified example also provides the same effects as the second embodiment described above.
  • the rod-shaped fins 223 have a relatively large contact area with the fluid FL and provide a moderate flow rate, making them ideal for filling areas other than the cooling area.
  • the cooling capacity may be set to QS2>QS3 (or QS2 ⁇ QS3) by varying factors such as the size, arrangement density (number of fins arranged), and height of the first rod-shaped fins 221.
  • a combination of fins with a round bar shape and fins with a rectangular shape may be arranged in either or both of the side areas ER and EL.
  • fins of any shape may be additionally arranged in the exit area ET.
  • the rod-shaped fin heat sink 12D may have two cooling areas C1, C2, that is, two semiconductor packages PK1, PK2 to be cooled.
  • the number of semiconductor packages to be cooled that can be implemented in the vertical arrangement structure of semiconductor packages according to the present disclosure may be three, as described above, or four or more.
  • the rod-shaped fin heat sink 12E according to this embodiment is shown in Figures 11(A), (B), and (C) as schematic diagrams of a side view, a top view, and a bottom view, respectively.
  • the basic configuration of this rod-shaped fin heat sink 12E is different from the heat sink 12A using the base plate 20 and rod-shaped pins 22 described in the second embodiment above, particularly in the arrangement of the rod-shaped pins erected in the entrance area IT and separation areas S1 and S2, and the arrangement density of the rod-shaped pins arranged in both side areas EL and ER.
  • the rest of the structure is the same as that of the second embodiment.
  • rod-shaped fins 22A, 22B, and 22C with an elliptical cross section for cooling are arranged with the size and arrangement density of the fins adjusted so that the cooling capacities QS1, QS2, and QS3 are different from each other.
  • rod-shaped fins 22D with a rectangular cross section similar to the previously described rectangular rod-shaped fins 22 are erected so that the arrangement density decreases the further downstream in the flow direction Y.
  • rod-shaped fins 22D (22) are also arranged in the entrance area IT and separation areas S1 and S2, which are located before and after the flow direction Y (predetermined direction) of the three cooling areas C1, C2, and C3, which are the areas directly targeted for cooling.
  • These rod-shaped fins 22D are round rod-shaped fins.
  • Rod-shaped fins may also be arranged in the exit area ET.
  • These rod-shaped fins 22D have a relatively large contact area with the fluid FL and are arranged to ensure a moderate flow rate and fluid retention time.
  • the flow rate of the cooling fluid can be adjusted appropriately. For example, in the inlet area IT, the flow rate of the cooling fluid FL is suppressed, and the time it takes to pass through the rod-shaped fins 22D that line the inlet area IT is lengthened. At the same time, in a steady flow state, the fluid FL flowing from the inlet area IT into the first cooling area C1 is biased.
  • the placement density and placement positions of the rod-shaped fins 22D are adjusted so as not to generate turbulence in each area.
  • the cooling capacity required by the first semiconductor package PK1 i.e., the cooling capacity to be exerted by the first fin assembly G1
  • the cooling capacity required by the second and third semiconductor packages PK2, PK3 i.e., the cooling capacity to be exerted by the second and third fin assemblies G2, G3
  • QS1>QS2, QS3 the cooling capacity to be exerted by the second and third fin assemblies G2, G3
  • QS2 ⁇ QS3 is maintained. It is designed to stipulate the above magnitude relationship between the fluid discharge capacity of the fluid supply device 18 and the cooling capacity exhibited by the assemblies G1, G2, G3 of the base plate 20 and the rod-shaped fins (pin fins) 22.
  • the cooling fluid (water, air, refrigerant) supplied from one fluid supply device 18 can be used in a cascade system.
  • the semiconductor package PK1 which requires the highest cooling capacity, is cooled first at an upstream position, and then the semiconductor packages PK2 and PK3, which require lower cooling capacity, are cooled downstream with the cooled fluid, thereby cooling the multiple semiconductor packages PK1, PK2, and PK3 in sequence along the flow direction Y.
  • the round bar-shaped fins 22D exert an appropriate flow suppression function and cooling function, making it easy to meet the diversification of design conditions and allowing each of the multiple cooling areas arranged in a vertical row to exert an appropriate cooling capacity.
  • the entire cooling device system can be made more compact.
  • the multiple (types) of semiconductor packages PK1, PK2, PK3 can be arranged together in one location closer to the target device (such as a motor), which is also convenient in terms of implementation.
  • a heat sink 112F according to the fourth embodiment shown in Fig. 12 is a more precisely formed pin arrangement than the schematic pin arrangement shown in Fig. 11(C) . Note that components having the same or equivalent functions as the components described above are given the same reference numerals, and descriptions thereof will be omitted or simplified.
  • the rod-shaped fins 22D (with a circular cross section) arranged in the entrance area IT and the first and second separation areas S1 and S2 have a diameter of 1.8 mm
  • the rod-shaped fins 22A with an elliptical cross section arranged in the first cooling area C1 have a length in the major axis direction of 4 mm and a length in the minor axis direction of 1.2 mm
  • the rod-shaped fins 22B and 22C with an elliptical cross section arranged in the second and third cooling areas C2 and C3 have a length in the major axis direction of 3 mm and a length in the minor axis direction of 1.2 mm.
  • rod-shaped fins 22E with a rectangular cross section arranged in the fluid energizing areas ER and EL on both sides have a size of 2 mm x 1.2 mm.
  • the height of each rod-shaped fin is appropriately selected between about 3 mm and 5 cm.
  • This fine forest of pins structure is produced by, for example, brazing or diffusion bonding the bottom surface of the base of each pin 22 to the underside 20L of the base plate 20.
  • This variant example 6 also relates to a configuration applicable to all of the basic configurations and variant examples of the embodiments described above, and relates to the shape in the height direction (Z-axis direction) of the rod-shaped fins erected in all areas C1, C2, C3, S1, S2, IT, ET, and ER, EL, or some of the areas C1, C2, C3.
  • FIG. 13 is a schematic diagram of a cross section taken along the cross section CC' line (FIG. 13(A)) and the cross section D-D' line (FIG. 13(B)) in FIG. 7.
  • the third rod-shaped fins 223 arranged in the inlet area IT are formed such that, when viewed along the flow direction Y of the fluid FL, the side shape of the third rod-shaped fins 223 in the standing state is gradually increased in the horizontal cross section shape toward the fin tip in the fin longitudinal direction LE, as shown by the inclination angles (negative draft gradients) ⁇ A and ⁇ B ( ⁇ A > ⁇ B ) from the upper end to the vertical direction.
  • the fin surface area increases and the distance between the fins 223 becomes narrower as the fins move toward the tip side in the longitudinal direction LE.
  • the mutual distance Dr of the root portion 22R (portion close to the lower surface 20L) of the third rod-shaped fins 223 is larger than the mutual distance Dt of the tip portion 22T (Dr > Dt).
  • the flow resistance of the fluid FL at the base side of the fin is smaller than that at the tip side of the fin. Therefore, the spatial region along the lower surface 20L of the base plate 20 exhibits a relatively smaller flow resistance than the region at the tip side. As a result, more fluid FL flows in the portion along the lower surface 20L, and a larger amount of heat is absorbed from the lower surface 20L, thereby enhancing the heat absorption effect.
  • This approximately inverted triangular structure with an inclination angle ⁇ can also be applied to all or part of the separation areas S1 and S2.
  • the flow direction Y of the cooling fluid FL is linear in the base plate 20.
  • the inlet area IT and the outlet area ET are directly opposite each other in the Y-axis direction, but this is not necessarily limited to such an arrangement.
  • the cooling fluid FL flows in from an inlet area IT connected to an input port 16A, turns in a crank shape at the inlet area IT, passes through two predetermined cooling areas Cm, Cn and a separation area Sm, and flows out from an output port 16B via an outlet area ET, as shown by an arrow YJ1 . That is, the input port 16A and the output port 16B are offset from each other in the short side direction X of the board.
  • rod-shaped fins are erected in each area to form a fin assembly, as described above.
  • the entrance area IT and exit area ET each include direction-changing areas Acon1 and Acon2, in which the plate fins (rod-shaped fins) described above are arranged diagonally, for example at angles of 0 to 90 degrees.
  • a direction-changing flow path Parc is formed with a fin arrangement in which the angle is gradually changed between 0 and 45 degrees, as shown in Figure 15 (variation 8) described below.
  • the input port 16A and the output port 16B are arranged at positions shifted from each other in the horizontal direction (X-axis direction), unlike in FIG. 14(A), and the flow path of the fluid FL may be cranked in the horizontal direction in a crank shape (see arrow YJ2 ).
  • ⁇ Modification 8> a fin arrangement applicable to the direction change area Acon1 described in a part of the inlet area IT described in Fig. 14 (B) above is illustrated.
  • the inlet area IT is located at the end of the longitudinal direction (Y-axis direction) of the base plate 20, and the direction of the fluid inflow and outflow is bent by 90 degrees with respect to the outlet area ET. Therefore, in the direction change area Acon located on the back side of the inlet area IT in the fluid inflow direction, rod-shaped fins 22G with an elliptical cross section are arranged at an angle ⁇ with respect to the flow direction Y (board longitudinal direction).
  • the cooling fluid FL that flows into the inlet area IT then flows along multiple direction-changing flow paths Parc formed in the direction-changing area Acon, and successively comes into contact with the rod-shaped fins 22G whose oblique angle ⁇ gradually changes from a deep angle (45°) to a shallow angle (0°).
  • the inflow direction is gradually bent by 90° and flows into the first cooling area C1 through the flow-straightening rod-shaped fins 22H.
  • heat exchange occurs through the fin assembly G1 provided in the cooling area C1.
  • the fluid FL then passes through another flow-straightening rod-shaped fin 22I and passes through the fin assembly G2 of the next cooling area C2 to exchange heat.
  • the fluid FT can reliably change direction.
  • a rear area A BK is formed, and in this rear area A BK , a plurality of rod-shaped fins 22H with a rectangular cross section are arranged which do not require heat exchange and are used to cool the base plate 20.
  • the first-stage semiconductor package PK1 can be cooled while the cooling capacity is high, the first-stage semiconductor package PK1 can be given a higher cooling capacity even if they are the same type, size, shape, and arrangement density.
  • the cooling capacity for the next-stage semiconductor package PK2 may be adjusted by incorporating design factors such as reducing the pin size (cross-sectional area).
  • the structure of the diagonal arrangement of rod-shaped fins 22G arranged in this direction change area Acon can be applied to the direction change area Acon2 on the output port side shown in FIG. 14(B). Furthermore, it can also be deployed to the direction change areas Acon1 and Acon2 on the input port side and output port side shown in FIG. 14(A).
  • rows of rod-shaped fins 22G are arranged along the longitudinal direction Y of the board, but the angle of a line virtually passing through the entire row itself may be set at a constant angle with respect to the longitudinal direction Y of the board.
  • the further downstream each row is in the longitudinal direction Y of the board the closer it can be to the back of the board in the short direction X. This allows for a variety of designs for the fin arrangement to change the flow direction of the fluid FL.
  • this modification 8 shows another example of a fin arrangement that can be implemented or deployed in each of the direction change areas Acon1 and Acon2 shown in FIGS. 14(A) and 14(B), respectively.
  • multiple imaginary arch-shaped trajectories ARC are set in the direction change area Acon along which the fluid FL is desired to change direction by 90 degrees, i.e., from the board short side direction X to the board long side direction Y.
  • Multiple rod-shaped fins 22J with elliptical cross sections are erected at a fixed distance along each of these trajectories ARC.
  • the fluid FL that flows into the inlet area IT further flows into multiple arch-shaped direction change channels Parc.
  • the fluid FL is subjected to a rectifying effect and smoothly changes direction by 90 degrees, passing through the rectifying fins 22H and entering the cooling area C1.
  • the multiple arched trajectories ARC may be set to draw virtual concentric arcs. This allows the arched direction-changing flow passages Parc to also become concentric flow passages, making the direction of the fluid FL smoother and more reliably suppressing pressure loss associated with the flow.
  • the third embodiment relates to a method for manufacturing a rod-shaped fin heat sink according to each of the above-mentioned embodiments and their modified examples. This will be described with reference to Figures 17 to 19, focusing only on the rod-shaped fins 22, their assembly FIN, and the base plate 20 that supports them, as a heat sink body 30 (see Figure 19(D)).
  • Figure 17 shows an outline of the manufacturing procedure.
  • the rod-shaped fin heat sink to which this manufacturing method is applied is the heat sink described in the various embodiments and their modified examples described above.
  • a number of rod-shaped fins 22 made of aluminum or copper, a base plate 20 made of aluminum or copper which is a separate part from the rod-shaped fins 22, a carbon pin alignment jig 40, and a pair of plate-shaped carbon clamping jigs 50 are prepared (Figure 17, step S101).
  • the rod-shaped fins 22 here represent the multiple types of rod-shaped fins having the various cross-sectional shapes described above.
  • the pin alignment jig 40 has a rectangular plate-like portion 40A with the same area as the second surface 20L of the base plate 20 described above, and has multiple pin insertion holes 40B drilled in positions that match the two-dimensional pin arrangement position P (see FIG. 19(A)) required by the design specifications.
  • This pin alignment jig 40 also has wall portions 40C extending downward from two (or four) opposing edges of the plate-like portion 40A. As will be described later, the size of these wall portions 40C is set so that when placed over the base plate 20, they abut and fit into two opposing side surfaces of the base plate 20.
  • the pin alignment jig 40 is positioned relative to the base plate 20 simply by placing the pin alignment jig 40 over the base plate 20 and abutting and fitting the wall portion 40C against the side of the base plate 20.
  • the multiple pin insertion holes 40B of the pin alignment jig 40 correspond to directly below in the Z-axis direction
  • the position of the second surface 20U of the base plate 20 corresponds to the arrangement position P of the rod-shaped fins (pin fins) 22.
  • the assembled heat sink body 30 is pressurized from above and below in the Z-axis direction as described below.
  • the clamping jig 50 is a pair of pressure plates 50L, 50U (see Figures 19(C) and (D)).
  • the pressure plates 50L, 50U each clamp the tip portions 22T of the rod-shaped fins 22 of the heat sink body 30, the lower end surface of the wall portion 4C of the pin alignment jig 40, and the upper surface 20U of the base plate 20, applying pressure from both sides.
  • the pin alignment jig 40 is placed over the base plate 20 as shown in FIG. 19(A), and the rod-shaped fins 22 are inserted into the pin insertion holes 40B as shown by the dashed lines in FIG. 19(B) to set them on the pin alignment jig 40 (FIG. 17, step S102).
  • the pin alignment jig 40 is set on the base plate 20 as shown by the solid lines in FIG. 19(B) (FIG. 17, step S103).
  • each of the rod-shaped fins 22 is supported by the pin alignment jig 40 and stands at the pin arrangement position P on the lower surface 20L of the base plate 20.
  • step S104 as described above, the pair of the pin alignment jig 40 on which the multiple rod-shaped fins 22 are aligned and the base plate 20 is clamped from above and below with a pair of clamping jigs 50 (50L, 50R) (or a pressure device, not shown) that function as a pressure means to set up for pressure application (see FIG. 19(C)).
  • a pair of clamping jigs 50 50L, 50R
  • a pressure device not shown
  • This pressurization is performed, for example, in a vacuum chamber VR (see FIG. 19(D)).
  • the heat sink body 30 housed in the chamber VR is pressurized while being heated at a temperature that causes a diffusion phenomenon in an atmosphere of a predetermined vacuum degree, thereby performing metal bonding (see FIG. 19(D)).
  • the heat source for heating may be placed inside or outside the chamber VR.
  • This metal bonding includes diffusion bonding (thermal diffusion bonding, microwave bonding) as well as brazing.
  • the atoms of the rod-shaped fins 22 and the surface (lower surface 20L) of the base plate 20 come into contact with each other, and the metals (in this embodiment, aluminum or aluminum alloy, or copper or copper alloy) at the interface between the two metals cause a diffusion phenomenon, and the rod-shaped fins 22 are bonded (thermocompressed) to each other at the pin arrangement position P to be integrated.
  • the bonding portion may be layered when the above-mentioned bonding is performed, and some voids may occur in the layer.
  • the rod-shaped fins 22 and the base plate 20 are made of the same material (aluminum or aluminum alloy), so that such voids can be reduced and a more reliable bond can be achieved at the atomic level.
  • a rod-shaped fin assembly stands out from the underside 20L of the base plate 20, and the heat sink body 30 is formed in which the two elements of the rod-shaped fins and the base plate are integrated with each other.
  • This rod-shaped fin assembly protrudes toward the cooling space SP through which the refrigerant passes.
  • an example of the bonding conditions for the thermal diffusion bonding in step S105 when the base plate 20 and the rod-shaped fins 22 are made of aluminum, is a pressure of 0.05 to 40 MPa, a vacuum degree of 10 -4 to 10 -5 Torr, a heating temperature of 264 to 396° C., and a heating time of 60 to 400 min.
  • other bonding conditions may be set.
  • step S106 the integrated heat sink body 30 is removed from the chamber VR, and undergoes an inspection process (not shown) before the cooling device 1 is assembled.
  • the base plate 20 and the rod-shaped fins 22 are both made of copper or a copper alloy and the cover 14 is made of aluminum
  • the heat sink body 30 is subjected to a corrosion-resistant surface treatment, for example, nickel plating, after the above-mentioned removal.
  • This plating layer provides corrosion protection against rust caused by dissolution of copper ions into the fluid (coolant) and natural electrode potential difference.
  • the portion of the base plate 20 that contacts the cover 14, the lower surface 20L of the base plate 20 exposed to the cooling space SP, the rod-shaped fins 22, and the surface of the aluminum cover 14 exposed to the cooling space SP are plated with nickel, for example.
  • the heat sink body 30 is formed by, for example, diffusion bonding (thermocompression bonding) a plurality of pre-prepared rod-shaped fins (pin fins) 22 and the base plate 20.
  • diffusion bonding thermocompression bonding
  • pin fins pre-prepared rod-shaped fins 22 and the base plate 20.
  • This makes it easier to form a simple integrated structure consisting of the rod-shaped fins 22 and the base plate 20.
  • the design specifications required to achieve sufficient cooling performance such as the shape and height of the rod-shaped fins 22 and their arrangement density on the base plate 20, can be realized more easily and at lower cost than with conventional processing methods such as die casting.
  • ⁇ Modification 10> A tenth modification applicable to the above-described embodiments and their modifications will be described with reference to Fig. 20.
  • This embodiment relates to a corrosion prevention structure for a rod-fin type heat sink.
  • pin fin or plate fin type heat sinks have been manufactured using forging, casting, or a combination of these methods with machining.
  • the natural electrode potential E also called corrosion potential or natural potential
  • elements such as ZN (zinc), SN (tin), and LN (lanthanoid) are added to the aluminum material (AL) of the rod-shaped fins 22 to manufacture the rod-shaped fins 22 as an aluminum alloy.
  • the base plate 20 is formed of aluminum or an aluminum alloy.
  • the natural electrode potential EF of the rod-shaped fins 22 (aluminum alloy) is electrochemically made lower than the natural electrode potential EP of the base plate 20 (EF ⁇ EP: less noble).
  • the natural electrode potential of the rod-shaped fins 22 is set to be less noble than the natural electrode potential of the base plate 20 by a potential (e.g., 100 mV) selected from a predetermined potential range (e.g., 20 to 200 mV).
  • the rod-shaped fins 22 and the base plate 20 are prepared separately and then integrated by bonding, making it easy to set the above-mentioned relationship of EF ⁇ EP.
  • the speed of corrosion of the base plate 20 is slower than that of the rod-shaped fins 22. Since a large number of rod-shaped fins 22 are usually installed upright, even if corrosion occurs in a small number of them, the cooling performance is unlikely to be significantly reduced. Instead, by sacrificially corroding the rod-shaped fins 22 while delaying the occurrence of corrosion pits CO in the base plate 20, the life of the base plate 20 against the occurrence of corrosion pits can be extended and the high cooling performance of the rod-shaped fin heat sink 12 can be maintained for a long period of time. In addition, anti-corrosion surface treatment (e.g., anodizing) can be omitted.
  • anti-corrosion surface treatment e.g., anodizing
  • Cooling device 12A to 12J Pin fin type heat sink as a rod-shaped fin type heat sink 14: Cover 18: Piping 19: Fluid source (fluid supply device) 20 Base plate (base part) 20U: upper surface 20L: lower surface 22, 221, 221h, 222, 223, 22D to 22J: rod-shaped fin 22T: tip portion 22R: lower end portion 30: heat sink body (part of pin fin type heat sink)
  • PK1 to PK3 electronic element packages
  • C1 to C3 cooling area S1, S2: separation area IT: entrance area ET: exit area EL, ER: side area FL: cooling fluid Y: Y-axis direction (flow direction of the fluid FL)
  • X X-axis direction (horizontal direction)

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Le but de la présente invention est de fournir un dissipateur thermique en forme d'ailette en tige capable de collecter de manière plus rapide et intensive une capacité de refroidissement nécessaire pour refroidir une pluralité de boîtiers d'éléments électroniques dans une zone où cela est nécessaire, et d'économiser de l'énergie.　Ce dissipateur thermique en forme d'ailette en tige (12) est pourvu d'une première ailette en tige (221) et d'une seconde ailette en tige (222), ainsi que d'une partie de base (20) de laquelle les ailettes en tige sont érigées. La partie de base (20) présente une seconde surface (20L) faisant face à une première surface (20U) en contact dorsal avec la pluralité de boîtiers d'éléments électroniques. Dans la seconde surface (20L), une pluralité de zones de refroidissement (C1-C3) destinées à refroidir chaque boîtier de la pluralité de boîtiers d'éléments électroniques sont définies dans une colonne dans une direction prédéterminée (Y) dans laquelle s'écoule un fluide de refroidissement (FL). Dans chacune de la pluralité de zones de refroidissement (C1-C3), des ensembles ailettes (G1-G3) comprenant la première ailette en tige (221) sont érigés sur la base de la capacité de refroidissement requise pour chacun de la pluralité de boîtiers d'éléments électroniques. Une zone latérale (EL, ER) est placée des deux côtés de la seconde surface (20U) dans une direction latérale (X) et la seconde ailette en tige (222), pour exciter et commander l'écoulement du fluide (FL) de telle sorte que le fluide de refroidissement (FL) entré par l'intermédiaire d'une zone d'entrée (IT) est dirigé vers les zones de refroidissement (C1-C3), est érigée dans chaque zone latérale.
PCT/JP2024/040720 2023-11-17 2024-11-15 Dissipateur thermique en forme d'ailette en tige, son procédé de fabrication, et dispositif de refroidissement sur lequel un dissipateur thermique est monté Pending WO2025105491A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023196246 2023-11-17
JP2023-196246 2023-11-17

Publications (1)

Publication Number Publication Date
WO2025105491A1 true WO2025105491A1 (fr) 2025-05-22

Family

ID=95742763

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2024/040720 Pending WO2025105491A1 (fr) 2023-11-17 2024-11-15 Dissipateur thermique en forme d'ailette en tige, son procédé de fabrication, et dispositif de refroidissement sur lequel un dissipateur thermique est monté

Country Status (1)

Country Link
WO (1) WO2025105491A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009152455A (ja) * 2007-12-21 2009-07-09 Denso Corp 半導体冷却構造
JP2013197178A (ja) * 2012-03-16 2013-09-30 Ihi Corp 冷却装置
JP2016039202A (ja) * 2014-08-06 2016-03-22 スズキ株式会社 インバータ装置
WO2018055923A1 (fr) * 2016-09-23 2018-03-29 住友精密工業株式会社 Dispositif de refroidissement
JP2021197397A (ja) * 2020-06-10 2021-12-27 尼得科超▲しゅう▼科技股▲ふん▼有限公司 ヒートシンクの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009152455A (ja) * 2007-12-21 2009-07-09 Denso Corp 半導体冷却構造
JP2013197178A (ja) * 2012-03-16 2013-09-30 Ihi Corp 冷却装置
JP2016039202A (ja) * 2014-08-06 2016-03-22 スズキ株式会社 インバータ装置
WO2018055923A1 (fr) * 2016-09-23 2018-03-29 住友精密工業株式会社 Dispositif de refroidissement
JP2021197397A (ja) * 2020-06-10 2021-12-27 尼得科超▲しゅう▼科技股▲ふん▼有限公司 ヒートシンクの製造方法

Similar Documents

Publication Publication Date Title
JP7300992B2 (ja) 半導体冷却配置装置
US10214109B2 (en) Method for manufacturing cooler for semiconductor-module, cooler for semiconductor-module, semiconductor-module and electrically-driven vehicle
JP5381561B2 (ja) 半導体冷却装置
US9237676B2 (en) Semiconductor module cooler and semiconductor module
JP5565459B2 (ja) 半導体モジュール及び冷却器
US7859103B2 (en) Semiconductor module and inverter device
JP4284625B2 (ja) 三相インバータ装置
US10879782B2 (en) Semiconductor device having switching element suppressing potential variation
JPWO2004076952A1 (ja) ヒートシンク、レーザモジュール、レーザ装置及びレーザ加工装置
WO2013054887A1 (fr) Refroidisseur pour module à semiconducteur, et module à semiconducteur
JP2005332863A (ja) パワースタック
JP2018190901A (ja) 電力変換装置
JP2013197178A (ja) 冷却装置
JP2006310363A (ja) パワー半導体装置
WO2025105491A1 (fr) Dissipateur thermique en forme d'ailette en tige, son procédé de fabrication, et dispositif de refroidissement sur lequel un dissipateur thermique est monté
JP7205662B2 (ja) 半導体モジュール
JP4471823B2 (ja) 電力半導体装置
JP5402778B2 (ja) 半導体モジュールを備えた半導体装置
JP2009194038A (ja) 冷却器及びこれを用いた電力変換装置
KR102495489B1 (ko) 냉각 장치
US7529091B2 (en) Power semiconductor module and method for cooling a power semiconductor module
JP4626555B2 (ja) ヒートシンク並びにパワーモジュール用部材およびパワーモジュール
CN118266074B (zh) 转流器和功率半导体部件
US20240381569A1 (en) Cooler for cooling power electronics
JP2019161872A (ja) 電力変換装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 24891526

Country of ref document: EP

Kind code of ref document: A1