WO2025100914A1 - Electronic device comprising interposer substrate - Google Patents

Abstract

According to one embodiment, an electronic device may include a housing. The electronic device may include a first substrate disposed in the housing and having a first component disposed on at least one surface thereof. The electronic device may include a second substrate disposed to be stacked with the first substrate in the housing and having a second component disposed on at least one surface thereof. The electronic device may include an interposer in contact with the first substrate and the second substrate therebetween such that the first substrate and the second substrate are electrically connected to each other. The electronic device may form a cavity between a first pad and a second pad formed on contact surfaces of the interposer, and at least a portion of a third component may be bonded in the cavity. Various other embodiments are also possible.

Description

Electronic device including interposer substrate

Various embodiments of the present disclosure relate to electronic devices including an interposer substrate.

Due to the advancement of information and communication technology and semiconductor technology, various functions are being integrated into a single portable electronic device. For example, electronic devices can implement not only communication functions, but also entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions for mobile banking, schedule management, and electronic wallet functions. These electronic devices are being miniaturized so that users can conveniently carry them.

As electronic devices become smaller, thinner, and denser, printed circuit boards (PCBs) are also becoming smaller and thinner. In addition, the design of printed circuit boards is becoming more complex and requires more difficult technologies due to the portability of electronic devices and the multi-functionality and high-capacity data transmission and reception.

The above information may be provided as related art for the purpose of assisting in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

According to one embodiment, an electronic device may include a housing. The electronic device may include a first substrate disposed within the housing and having a first component disposed on at least one surface. The electronic device may include a second substrate disposed within the housing and laminated with the first substrate, and having a second component disposed on at least one surface. The electronic device may include an interposer that is in contact between the first substrate and the second substrate so that the first substrate and the second substrate are electrically connected. The electronic device may form a cavity between a first pad and a second pad formed on a contact surface of the interposer, and at least a portion of a third component may be bonded within the cavity.

According to one embodiment, an electronic device may include a housing. The electronic device may include a first substrate disposed within the housing and having a first component disposed on at least one surface thereof. The electronic device may include a second substrate disposed within the housing and laminated with the first substrate, and having a second component disposed on at least one surface thereof. The electronic device may form a cavity between a first pad and a second pad formed on a contact surface of the first substrate that contacts the second substrate, and at least a portion of a third component may be bonded within the cavity.

FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

FIG. 2 is a front perspective view of an electronic device according to various embodiments.

FIG. 3 is a rear perspective view of an electronic device according to various embodiments.

FIG. 4 is an exploded perspective view of an electronic device according to various embodiments.

FIG. 5 is a front perspective view of an interposer substrate having electronic components mounted thereon, according to various embodiments.

FIG. 6 is a rear perspective view of an interposer substrate having electronic components mounted thereon, according to various embodiments.

FIG. 7 is a schematic diagram illustrating electronic components arranged in an interposer of an electronic device according to various embodiments.

FIG. 8 is a front perspective view of a laminated printed circuit board according to various embodiments.

FIG. 9a is a cross-sectional view of an interposer substrate according to various embodiments.

FIG. 9b is a cross-sectional view of an interposer substrate according to various embodiments.

FIG. 10A is a cross-sectional view of an interposer substrate according to various embodiments.

FIG. 10b is a cross-sectional view of an interposer substrate according to various embodiments.

FIG. 11 is a cross-sectional view of an interposer substrate according to various embodiments.

FIG. 12 is a cross-sectional view of an interposer substrate according to various embodiments.

FIG. 13 is a cross-sectional view of an interposer substrate according to various embodiments.

FIG. 14 is a cross-sectional view of an interposer substrate according to various embodiments.

FIG. 15a is a plan view of an interposer substrate according to various embodiments.

FIG. 15b is a plan view of an interposer substrate according to various embodiments.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components. In addition, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments of the present disclosure.

Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may include one or more other components. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

The processor (120) may control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in the volatile memory (132), process the command or data stored in the volatile memory (132), and store result data in the nonvolatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphic processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a given function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

The auxiliary processor (123) may control at least a portion of functions or states associated with at least one of the components of the electronic device (101) (e.g., the display module (160), the sensor module (176), or the communication module (190)), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., the camera module (180) or the communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing device) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. Such learning may be performed, for example, in the electronic device (101) on which artificial intelligence is performed, or may be performed through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may additionally or alternatively include a software structure.

The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or nonvolatile memory (134).

The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

The audio output module (155) can output an audio signal to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive an incoming call. According to one embodiment, the receiver can be implemented separately from the speaker or as a part thereof.

The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) can include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) can include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can obtain sound through an input module (150), or output sound through an audio output module (155), or an external electronic device (e.g., an electronic device (102)) (e.g., a speaker or a headphone) directly or wirelessly connected to the electronic device (101).

The sensor module (176) can detect an operating state (e.g., power or temperature) of the electronic device (101) or an external environmental state (e.g., user state) and generate an electric signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., the electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that a user can perceive through a tactile or kinesthetic sense. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) can include one or more lenses, image sensors, image signal processors, or flashes.

The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery (189) can power at least one component of the electronic device (101). According to one embodiment, the battery (189) can include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module (190) may support establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)), and performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., the application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module can communicate with an external electronic device via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

The wireless communication module (192) can support a 5G network and next-generation communication technology after a 4G network, for example, NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), terminal power minimization and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) may support various requirements specified in an electronic device (101), an external electronic device (e.g., electronic device (104)), or a network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.

The antenna module (197) can transmit or receive signals or power to or from the outside (e.g., an external electronic device). According to one embodiment, the antenna module can include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) can include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), can be selected from the plurality of antennas by, for example, the communication module (190). A signal or power can be transmitted or received between the communication module (190) and the external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) can be additionally formed as a part of the antenna module (197).

According to various embodiments, the antenna module (197) can form a mmWave antenna module. According to one embodiment, the mmWave antenna module can include a printed circuit board, an RFIC positioned on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) positioned on or adjacent a second side (e.g., a top side or a side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

At least some of the above components may be connected to each other and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)).

According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least part of the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result, as is or additionally processed, as at least a part of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an IoT (Internet of Things) device. The server (108) may be an intelligent server using machine learning and/or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199). The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

FIG. 2 is a front perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 3 is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

Referring to FIGS. 2 and 3, an electronic device (200) according to one embodiment may include a housing (210) including a front surface (210A), a back surface (210B), and a side surface (210C) surrounding a space between the front surface (210A) and the back surface (210B). In one embodiment (not shown), the housing (210) may also refer to a structure forming a portion of the front surface (210A) of FIG. 2, the back surface (210B) of FIG. 3, and the side surface (210C). For example, the housing (210) may include a front plate (202) and a back plate (211). According to one embodiment, at least a portion of the front surface (210A) may be formed by a substantially transparent front plate (202) (e.g., a glass plate including various coating layers, or a polymer plate). The back surface (210B) may be formed by the back plate (211). The back plate (211) may be formed of, for example, glass, ceramic, polymer, metal (e.g., titanium (Ti), stainless steel (STS), aluminum (Al) and/or magnesium (Mg)), or a combination of at least two of the above materials. The side surface (210C) may be formed by a side bezel structure (or “side member”) (218) that is coupled with the front plate (202) and the back plate (211) and comprises a metal and/or a polymer. In some embodiments, the back plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as glass, aluminum, or a ceramic). In one embodiment, the front surface (210A) and/or the front plate (202) may be interpreted as a part of the display (220).

According to one embodiment, the electronic device (200) may include at least one of a display (220), an audio module (203, 207, 214) (e.g., the audio module (170) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (205, 206) (e.g., the camera module (180) of FIG. 1), a key input device (217) (e.g., the input module (150) of FIG. 1), and a connector hole (208, 209) (e.g., the connection terminal (178) of FIG. 1). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the connector hole (209)) or may additionally include other components. According to one embodiment, the display (220) may be visually exposed, for example, through a significant portion of the front plate (202).

In one embodiment, the surface (or front plate (202)) of the housing (210) may include a screen display area formed as the display (220) is visually exposed. As an example, the screen display area may include the front surface (210A).

According to one embodiment, the electronic device (200) may include a recess or opening formed in a portion of a screen display area (e.g., a front surface (210A)) of a display (220), and may include at least one of an audio module (214), a sensor module (not shown), a light-emitting element (not shown), and a camera module (205) aligned with the recess or opening. In one embodiment (not shown), at least one of an audio module (214), a sensor module (not shown), a camera module (205), a fingerprint sensor (not shown), and a light-emitting element (not shown) may be included on a back surface of the screen display area of the display (220).

According to one embodiment, the display (220) may be coupled with or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field-type stylus pen.

According to one embodiment, the audio module (203, 207, 214) may include, for example, a microphone hole (203) and a speaker hole (207, 214). The microphone hole (203) may have a microphone disposed inside for acquiring external sound, and in some embodiments, multiple microphones may be disposed so as to detect the direction of the sound. The speaker hole (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In some embodiments, the speaker hole (207, 214) and the microphone hole (203) may be implemented as one hole, or a speaker may be included without the speaker hole (207, 214) (e.g., a piezo speaker).

According to one embodiment, a sensor module (not shown) may generate an electrical signal or a data value corresponding to, for example, an internal operating state of the electronic device (200) or an external environmental state. The sensor module (not shown) may include, for example, a first sensor module (not shown) (e.g., a proximity sensor) and/or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a front side (210A) of the housing (210). The sensor module (not shown) may include a third sensor module (not shown) (e.g., an HRM sensor) and/or a fourth sensor module (not shown) (e.g., a fingerprint sensor) disposed on a rear side (210B) of the housing (210). In some embodiments (not shown), the fingerprint sensor may be disposed on the rear side (210B) as well as the front side (210A) (e.g., the display (220)) of the housing (210). The electronic device (200) may further include at least one of a sensor module (not shown), for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (not shown).

In one embodiment, the camera module (205, 206) may include, for example, a front camera module (205) disposed on the front (210A) of the electronic device (200), a rear camera module (206) disposed on the rear (210B) of the electronic device (200), and/or a flash (204). The camera module (205, 206) may include one or more lenses, an image sensor, and/or an image signal processor. The flash (204) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

In one embodiment, the key input device (217) may be disposed on a side surface (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (220). In one embodiment, at least a portion of the key input devices (217) may be disposed on the side bezel structure (218).

In one embodiment, a light-emitting element (not shown) may be disposed, for example, on the front surface (210A) of the housing (210). The light-emitting element (not shown) may provide, for example, status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element (not shown) may provide, for example, a light source that is linked to the operation of the front camera module (205). The light-emitting element (not shown) may include, for example, an LED, an IR LED, and/or a xenon lamp.

According to one embodiment, the connector holes (208, 209) may include a first connector hole (208) that can accommodate, for example, a connector for transmitting and receiving power and/or data with an external electronic device (e.g., a USB connector) or a connector for transmitting and receiving audio signals with an external electronic device (e.g., an earphone jack), and/or a second connector hole (209) that can accommodate a storage device (e.g., a subscriber identification module (SIM) card). According to one embodiment, the first connector hole (208) and/or the second connector hole (209) may be omitted.

FIG. 4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

Referring to FIG. 4, the electronic device (200) (e.g., the electronic device (200) of FIGS. 2 to 3) may include at least one of a front plate (222) (e.g., the front plate (202) of FIG. 2), a display (220) (e.g., the display (220) of FIG. 2), a bracket (232) (e.g., a front support member), a printed circuit board (240), a battery (250), a rear case (260) (e.g., a rear support member), an antenna (270), and a rear plate (280) (e.g., the rear plate (211) of FIG. 3). According to one embodiment, the electronic device (200) may omit at least one of the components (e.g., the rear case (260)) or may additionally include other components. At least one of the components of the electronic device (200) may be identical or similar to at least one of the components of the electronic device (200) of FIG. 2 or FIG. 3, and any redundant description will be omitted below.

According to one embodiment, the bracket (232) may be disposed inside the electronic device (200) and connected to the side bezel structure (231), or may be formed integrally with the side bezel structure (231). The bracket (232) may be formed of, for example, a metal material and/or a non-metallic (e.g., polymer) material. The bracket (232) may accommodate a display (220) on one surface and a printed circuit board (240) on the other surface. The printed circuit board (240) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and/or an interface (e.g., the interface (177) of FIG. 1).

According to one embodiment, the battery (250) is a device for supplying power to at least one component (e.g., a camera module (212)) of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the printed circuit board (240). The battery (250) may be disposed integrally within the electronic device (200), or may be disposed detachably from the electronic device (200).

In one embodiment, the rear case (260) may be positioned between the printed circuit board (240) and the antenna (270). For example, the rear case (260) may include one surface to which at least one of the printed circuit board (240) or the battery (250) is coupled, and the other surface to which the antenna (270) is coupled.

In one embodiment, the antenna (270) may be disposed between the back plate (280) and the battery (250). The antenna (270) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna (270) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. For example, the antenna (270) may include a coil for wireless charging. In one embodiment, the antenna structure may be formed by a portion or a combination of the side bezel structure (231) and/or the bracket (232).

According to various embodiments, the electronic device (200) may include a camera module (212) disposed within a housing (e.g., the housing (210) of FIG. 2). According to one embodiment, the camera module (212) may be a rear camera module (e.g., the camera module (206) of FIG. 3) disposed on a bracket (232) and capable of acquiring an image of a subject positioned at the rear (e.g., in the -Z direction) of the electronic device (200). According to one embodiment, at least a portion of the camera module (212) may be visually exposed to the outside of the electronic device (200) through an opening (282) formed in a rear plate (280).

The electronic device (200) disclosed in FIGS. 2 to 4 has an exterior of a bar type or a plate type, but the present disclosure is not limited thereto. For example, the illustrated electronic device may be a rollable electronic device or a foldable electronic device. The term "rollable electronic device" may mean an electronic device in which a display (e.g., the display (220) of FIG. 4) is capable of bending deformation, so that at least a portion thereof is wound or rolled or can be accommodated inside a housing (e.g., the housing (210) of FIG. 2). Depending on the needs of a user, the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a wider area of the display to the outside.

FIG. 5 is a front perspective view of an interposer substrate having electronic components mounted thereon, according to various embodiments of the present disclosure. FIG. 6 is a rear perspective view of an interposer substrate having electronic components mounted thereon, according to various embodiments of the present disclosure. FIG. 7 is a schematic diagram illustrating electronic components arranged on an interposer of an electronic device, according to various embodiments of the present disclosure.

Referring to FIGS. 5, 6, and/or 7, the electronic device (200) may include a power management module (410, 420), a communication module (460), a processor (470), a memory (480), and an interposer substrate (300). The configurations of the power management module (410, 420), the communication module (460), the processor (470), and the memory (480) of FIGS. 5, 6, and/or 7 may be all or part of the same as the configurations of the power management module (188), the communication module (190), the processor (120), and the memory (130) of FIG. 1, and the configuration of the interposer substrate (300) of FIGS. 5, 6, and/or 7 may be all or part of the same as the configuration of the printed circuit board (240) of FIG. 4.

According to various embodiments, the interposer substrate (300) can accommodate an electronic component (or components) of the electronic device (200). For example, the interposer substrate (300) can accommodate a first power management module (410), a second power management module (420), a communication module (460), a processor (470), and/or a memory (480). According to one embodiment, the interposer substrate (300) can be disposed within a housing of the electronic device (200) (e.g., the housing (210) of FIG. 3 ).

According to various embodiments, the interposer substrate (300) may include a plurality of substrates. For example, the interposer substrate (300) may include a first substrate (310), a second substrate (320), and an interposer (330) disposed between the first substrate (310) and the second substrate (320). According to one embodiment, the first substrate (310) and the second substrate (320) may be disposed substantially parallel. For example, the first substrate (310) and the second substrate (320) may be positioned along a width (e.g., XY plane) direction of the electronic device (200). According to one embodiment, the first substrate (310) and/or the second substrate (320) may each be a circuit board (e.g., a printed circuit board) including at least one layer. According to one embodiment, the interposer (330) may be a sidewall surrounding at least a portion between the first substrate (310) and the second substrate (320). For example, at least a portion of the interposer (330) may be formed in a closed curve shape. According to various embodiments, at least one of the first substrate (310), the second substrate (320), and the interposer (330) may be a multilayer substrate including a plurality of layers. In the embodiments described below, the interposer (330) may be used in the same or similar sense as the substrate, or may be replaced with the substrate.

According to various embodiments, the first substrate (310) can accommodate a communication module (460). For example, the first substrate (310) can include a first surface (311) and a second surface (312) opposite the first surface (311). The communication module (460) can be disposed on the first surface (311). According to one embodiment, the first substrate (310) can be referred to as a radio frequency (RF) substrate or a master substrate.

According to various embodiments, the communication module (460) may include components for communicating with an external electronic device (e.g., the electronic device (104) of FIG. 1) of the electronic device (200). For example, the communication module (460) may include an amplifier (461) and a transceiver (462). According to one embodiment, the amplifier (461) may be a power amplifier (PAM) and/or a low noise amplifier (LNA). According to one embodiment, the transceiver (462) may transmit a signal to the external electronic device (104) or receive a signal from the external electronic device (104).

According to various embodiments, the first substrate (310) may accommodate a first power management module (410) for controlling power delivered to the communication module (460). For example, the first power management module (410) may be disposed on the second surface (312). According to one embodiment, the first power management module (410) may be disposed on an opposite surface of the same substrate as the communication module (460). For example, the communication module (460) may be disposed on the first surface (311) of the first substrate (310), and the first power management module (410) may be disposed on the second surface (312) of the first substrate (310). According to one embodiment, the first power management module (410) may be surrounded by the first substrate (310), the second substrate (320), and the interposer (330). Since the first power management module (410) is located inside the interposer substrate (300), noise caused by the first power management module (410) can be shielded by the first substrate (310), the second substrate, and/or the interposer (330). According to one embodiment, the first power management module (410) can be referred to as a radio frequency (RF) power management module.

According to various embodiments, the first power management module (410) can be electrically connected to the communication module (460) using the first substrate (310). According to one embodiment, at least a portion of the first power management module (410) can overlap at least a portion of the amplifier (461) and/or at least a portion of the transceiver (462). A portion of the first substrate (310) can be disposed between the first power management module (410) and the communication module (460). For example, when viewing the interposer substrate (300) from above (e.g., in the +Z direction) of the interposer substrate (300), at least a portion of the amplifier (461) and at least a portion of the transceiver (462) can be positioned on the same width direction plane (e.g., the XY plane) as at least a portion of the first power management module (410). In one embodiment, the first power management module (410) can supply power to the communication module (460) (e.g., the amplifier (461)) through the first path (P1). At least a portion of the first path (P1) can be a conductive path of the first substrate (310) located between the communication module (460) and the first power management module (410). The first path (P1) can be referred to as a first electrical path or a first power supply path. In one embodiment, since the first power management module (410) is electrically connected to the communication module (460) through the first substrate (310), a distance over which the first power management module (410) supplies power to the communication module (460) can be reduced. For example, since the length of the electrical path between the first power management module (410) and the communication module (460) is reduced, the stability of the communication module (460) can be increased. For example, noise and/or heat generated in the communication module (460) can be reduced.

According to various embodiments, the second substrate (320) may accommodate a charging circuit (430), a processor (470), and/or a memory (480). For example, the second substrate (320) may include a third surface (321) and a fourth surface (322) opposite the third surface (321). According to one embodiment, the charging circuit (430), the processor (470), and the memory (480) may be disposed on the fourth surface (322). According to one embodiment, the charging circuit (430) may determine a state (e.g., a fully charged state) of a battery (e.g., a battery (250) of FIG. 4) or may control a current supplied to the battery (250).

According to various embodiments, the second substrate (320) can accommodate at least one second power management module (420) for controlling power delivered to the processor (470) and/or the memory (480). For example, the second power management module (420) can be disposed on the third surface (321). According to one embodiment, the second power management module (420) can be surrounded by the first substrate (310), the second substrate (320), and the interposer (330). Since the second power management module (420) is located inside the interposer substrate (300), noise caused by the second power management module (420) can be shielded by the first substrate (310), the second substrate, and/or the interposer (330). In one embodiment, the second power management module (420) may be electrically connected to the processor (470) and/or the memory (480) using the second substrate (320). In one embodiment, the second power management module (420) may be referred to as a processor power management module.

According to various embodiments, the second substrate (320) may be electrically connected to the first substrate (310) using an interposer (330). For example, the interposer (330) may include at least one conductive via structure (e.g., via (807) of FIG. 8), and the at least one conductive via may be formed as at least one conductive pin (331). The wiring of the first substrate (310) may be electrically connected to the second substrate (320) using the pin (331). According to various embodiments, the interposer (330) may be electrically connected to the first substrate (310) or the second substrate (320) through a pad formed on one surface of the interposer (330).

According to various embodiments, a component (e.g., a first power management module (410)) accommodated on a second surface (312) of a first substrate (310) may be arranged to be staggered with a component (e.g., a second power management module (420)) accommodated on a third surface (321) of a second substrate (320). For example, the second substrate (320) may include a first region (323) facing the first power management module (410) and a second region (324) surrounding at least a portion of the first region (323).

In one embodiment, the first region (323) may not accommodate the first power management module (410) and/or the second power management module (420). For example, no electronic components may be arranged on the third side (321) of the first region (323). In one embodiment, since the first power management module (410) is not arranged on the first region (323), the first region (323) does not include wiring used by the first power management module (410), and the available space in the first region (323) of the second substrate (320) may be increased. In one embodiment, the electronic components (e.g., the second power management module (420)) arranged on the third side (321) of the second substrate (320) may be arranged on the second region (324) and not arranged on the first region (323).

According to various embodiments, the electronic device (200) may include an interface (e.g., interface (177) of FIG. 1) mounted on an interposer substrate (300). According to one embodiment, the interface (177) may be disposed on a second surface (312) of the first substrate (310). According to one embodiment, a first area (323) of the second substrate (320) may face the interface (177) together with a first power management module (410). According to one embodiment, the first area (323) of the second substrate (320) may face the interface (177). According to one embodiment, since the interface (177) is not arranged in the first region (323) of the second substrate (320), the first region (323) does not include wiring used in the interface (177), and the available space in the first region (323) of the second substrate (320) can be increased.

FIG. 8 is a front perspective view of a laminated printed circuit board according to various embodiments of the present disclosure.

According to various embodiments, a printed circuit board disposed within an electronic device may be manufactured as a laminated printed circuit board (e.g., a circuit board module) for placement (or mounting) efficiency. The circuit boards disposed within the laminated printed circuit board may be designed to be parallel and have corresponding sizes to each other. An interposer disposed within the laminated printed circuit board may be designed as a single closed loop shape according to the shape of the electronic device/printed circuit board, but is not limited to the above shape.

According to various embodiments, the laminated printed circuit board may include a first substrate (310), a second substrate (e.g., the second substrate (320) of FIGS. 5 to 7) disposed on the first substrate (310), and an interposer (330) disposed between the first substrate (310) and the second substrate (320) to provide a space.

According to various embodiments, the laminated printed circuit boards (e.g., the first substrate (310) and the second substrate (320)) provide spaces on their upper and lower surfaces for arranging components, thereby enabling efficient use of the internal layout space of an electronic device.

According to various embodiments, the first substrate (310) is positioned under a display (e.g., the display (220) of FIG. 4), and a plurality of components may be positioned on one surface of the first substrate (310).

According to various embodiments, the second substrate (320) is disposed between the display (e.g., the display (220) of FIG. 4) and the first substrate (310), and may be spaced apart from the first substrate (310) by a specified distance by an interposer (330). Hereinafter, the configuration of the first substrate (310) will be described, and the configuration of the second substrate (320) may apply the configuration of the first substrate (310).

According to various embodiments, the interposer (330) may be disposed between the first substrate (310) and the second substrate (320) and may be formed to surround at least a portion of surfaces of the plurality of components disposed between the first substrate (310) and the second substrate (320). A plating film (hereinafter, a side plating region (806)) for electromagnetic wave shielding may be formed on a side surface of the interposer (330). For example, the side surface of the interposer (330) may mean an outer wall on which the plating film may be formed. According to one embodiment, the interposer (330) may be configured in a rectangular shape or various other shapes. The interposer (330) may include a via (807) for electrically connecting the first substrate (310) and the second substrate (320).

According to various embodiments, the part where the first substrate (310) and the interposer (330) are joined may be defined as the x-axis, and the thickness direction of the first substrate (310) and the interposer (330) may be defined as the z-axis. The -z-axis direction may refer to a direction toward the bottom of the interposer (330) toward the first substrate (310), and the +z-axis direction may refer to a direction toward the top of the interposer (330) toward the second substrate (320). According to one embodiment, the top of the interposer (330) (the surface facing the +z-axis direction) may be joined to the second substrate (320) using solder, and the bottom of the interposer (330) (the surface facing the -z-axis direction) may be joined to the first substrate (310) using solder. According to one embodiment, a side plating (806) may be formed in the z-axis direction on the outer surface of the interposer (330), and a via (807) may be formed in the z-axis direction on the inside of the interposer (330).

According to various embodiments, the interposer (330) includes a plurality of vias (807) (e.g., vias (807a, 807b) of FIGS. 9A, 9B, 10A, 10B, 11, 12, 13, and 14 described below), and at least one via (807) may include a hole, a plating pad, and an insulating region, etc. The hole may be formed by, for example, drilling through at least a portion of the interposer (330), and the hole may have an inner wall plated to transmit an electrical signal. The plating pad may be formed to surround the outer side of the hole. The plating pad may be made of copper (Cu), gold (Au), or the like, and may prevent corrosion. The above plating pads can surround the outside of the via (807), and can surround the top, bottom, and side surfaces of the via (807) hole. For example, the plating pads on the side surface have a copper thickness of approximately 25 um, and the plating pads on the top and bottom can have a tolerance of approximately 10 um to approximately 20 um.

Hereinafter, various embodiments of arranging (or mounting) components on the aforementioned interposer substrate will be described. In the various embodiments described below, the interposer may be replaced with the substrate or may be understood as being included in the substrate in a broad sense. For example, in the various embodiments described below, the interposer (330) bonded to the first substrate (310) may be replaced with the second substrate (320).

FIG. 9A is a cross-sectional view of an interposer substrate according to various embodiments of the present disclosure.

Referring to FIG. 9a, as described above in the description of FIGS. 7 and 8, the first substrate (310) may be bonded to the interposer (330). For example, the first substrate (310) may be bonded to the interposer (330) using a bonding member (e.g., solder) or a bonding means.

According to various embodiments, the interposer (330) may include a plurality of vias (807), as illustrated in FIG. 8. For example, the interposer (330) may include a first hole (807a) corresponding to a first via among the plurality of vias (807) and a second hole (807b) corresponding to a second via. The inner wall of the first hole (807a) may be plated with a first plating surface (901b) to transmit an electrical signal. An upper end of the first plating surface (901b) may form a first pad (901a) to electrically connect with the first substrate (310). The first pad (901a) may be formed on a first surface (332) of the interposer (330) facing the first substrate (310). The lower end of the first plating surface (901b) may form a fifth pad (901c) for electrical connection with the second substrate (320). The inner wall of the second hole (807b) may be plated with a second plating surface (902b) for transmitting an electrical signal. The upper end of the second plating surface (902b) may form a second pad (902a) for electrical connection with the first substrate (310). The second pad (902a) may be formed on the first surface (332) of the interposer (330) facing the first substrate (310). The lower end of the second plating surface (902b) may form a sixth pad (902c) for electrical connection with the second substrate (320).

According to various embodiments, the first substrate (310) may include a third plating portion (or third plating surface (903)) and a fourth plating portion (or fourth plating surface (904)). A lower end of the third plating surface (903) may form a third pad (903a) to be electrically connected to the interposer (330). A lower end of the fourth plating surface (904) may form a fourth pad (904a) to be electrically connected to the interposer (330). The third pad (903a) and the fourth pad (904a) may be formed on a second surface (312) of the first substrate (310) facing the interposer (330). A photo imageable solder resist (PSR) (905) may be further arranged on the second surface (312) of the first substrate (310) to separate the third pad (903a) and the fourth pad (904a). The PSR (905) can prevent a bridging phenomenon from occurring when the third pad (903a) and the fourth pad (904a) are soldered.

FIG. 9b is a cross-sectional view of an interposer substrate according to various embodiments of the present disclosure.

Referring to FIG. 9b, according to various embodiments, the first pad (901a) of the interposer (330) described above in FIG. 9a and the third pad (903a) of the first substrate (310) may be bonded by a first bonding member (910a) (e.g., solder). The second pad (902a) of the interposer (330) and the fourth pad (904a) of the first substrate (310) may be bonded by a second bonding member (910b) (e.g., solder). The interposer (330) and the first substrate (310) may be bonded to each other by the first bonding member (910a) and the second bonding member (910b). The first bonding member (910a) and the second bonding member (910b) may be prevented from bridging each other by the PSR (905).

As described above in FIGS. 9A and 9B, the portion where the first substrate (310) and the second substrate (320) are bonded to the interposer (330) may have difficulty in arranging components due to pads or grounding areas. There may be insufficient space to arrange a large number of components in a PBA (printed board assembly) where electronic devices are gradually becoming smaller and thinner. In various embodiments described below, a space for arranging components can be secured by forming a cavity in the area where the interposer and the substrate are bonded or in the area where the substrates are bonded and additionally arranging components. Accordingly, miniaturization of the PBA can be made possible. In addition, by additionally arranging and bonding components in the area where the interposer and the substrate are bonded or in the area where the substrates are bonded, the bonding strength can be strengthened.

Hereinafter, with reference to FIGS. 10a, 10b, 11, 12, 13, and 14, various embodiments of forming a cavity in a bonding area of an interposer and/or a substrate and placing a component within the formed cavity will be described.

FIG. 10A is a cross-sectional view of an interposer substrate according to various embodiments of the present disclosure.

Referring to FIG. 10a, according to various embodiments, a first pad (1001a) and a second pad (1002a) may be formed on the first surface (332) of the interposer (330) facing the first substrate (310) as described above. As illustrated in FIG. 10a, the pads formed inside the interposer (330) may form a structure in which two layers are laminated on each of the upper and lower layers. According to various embodiments, as illustrated in FIGS. 9a and 9b described above, the pads formed inside the interposer (330) may be formed in a single layer only on the lower layer; however, the pad lamination form inside the interposer (330) is not limited to a specific form and may be variously modified. For example, as illustrated in FIGS. 12 and 14 described below, the pads formed inside the interposer (330) may be formed in a single layer on each of the upper and lower layers.

According to various embodiments, a cavity (1000) may be formed between the first pad (1001a) and the second pad (1002a). At least a portion of the third component (1010) may be bonded to the inside of the cavity (1000) within the cavity (1000). According to various embodiments, at least a portion of the third component (1010) may be bonded to the inside of the cavity (1000) by the first bonding member (1021) and/or the second bonding member (1022). According to various embodiments, an upper portion (1001) of the first plating surface (901b) and an upper portion (1002) of the second plating surface (902b) may define the cavity (1000). The upper end of the first plating surface (901b) may form a first pad (1001a) for electrical connection with the first substrate (310). The first pad (1001a) may be formed on the first surface (332) of the interposer (330) facing the first substrate (310). The upper end of the second plating surface (902b) may form a second pad (1002a) for electrical connection with the first substrate (310). The second pad (1002a) may be formed on the first surface (332) of the interposer (330) facing the first substrate (310).

FIG. 10b is a cross-sectional view of an interposer substrate according to various embodiments of the present disclosure.

Referring to FIG. 10B, according to various embodiments, after at least a portion of the third component (1010) is bonded by the first bonding member (1021) and/or the second bonding member (1022) within the cavity (1000) formed in the interposer (330), as illustrated in FIG. 10A, the interposer (330) and the first substrate (310) may be bonded. As described above, at least a portion of the third component (1010) may be bonded to the inner side of the cavity (1000) by the first bonding member (1021) and/or the second bonding member (1022). The first bonding member (1021) and/or the second bonding member (1022) may bond the interposer (330) and the first substrate (310). The first bonding member (1021) and/or the second bonding member (1022) can bond at least a portion of the third component (1010) and the first substrate (310).

According to various embodiments, the first substrate (310) may include a third plating surface (1003) and a fourth plating surface (1004). A lower end of the third plating surface (1003) may form a third pad (1003a) for electrical connection with the interposer (330). A lower end of the fourth plating surface (1004) may form a fourth pad (1004a) for electrical connection with the interposer (330). The third pad (1003a) and the fourth pad (1004a) may be formed on a second surface (312) of the first substrate (310) facing the interposer (330).

According to various embodiments, the first part (1021a) of the first bonding member (1021) can bond the left side of the third component (1010) and the upper part (1001) of the first plating surface (901b). The second part (1021b) of the first bonding member (1021) can bond the first pad (1001a) formed on the upper end of the first plating surface (901b) and at least a part of the third pad (1003a) of the first substrate (310). The second part (1021b) of the first bonding member (1021) can bond at least a part of the upper part of the third component (1010) and at least a part of the third pad (1003a) of the first substrate (310).

According to various embodiments, the first portion (1022a) of the second bonding member (1022) can bond the right portion of the third component (1010) and the upper portion (1002) of the second plating surface (902b). The second portion (1022b) of the second bonding member (1022) can bond the second pad (1002a) formed on the upper portion of the second plating surface (902b) and at least a portion of the fourth pad (1004a) of the first substrate (310). The second portion (1022b) of the second bonding member (1022) can bond at least a portion of the upper portion of the third component (1010) and at least a portion of the fourth pad (1004a) of the first substrate (310).

According to various embodiments, the lower portion of the third component (1010) may be bonded to at least a portion of the bonding member.

According to various embodiments, after bonding a third component (1010) to a cavity (1000) formed in the interposer (330), a first substrate (310) may be bonded to the interposer (330) to which the third component (1010) is bonded. According to various embodiments, the interposer (330), the third component (1010), and the first substrate (310) may be simultaneously bonded by the first bonding member (1021) and/or the second bonding member (1022).

According to various embodiments, referring to FIG. 10b, compared to FIG. 9b, a cavity (1000) is formed in an area where an interposer (330) and a substrate (e.g., a first substrate (310)) are bonded, and a component (e.g., a third component (1010)) is additionally placed, thereby securing additional component placement space. Accordingly, miniaturization of the PBA can be enabled. In addition, by additionally placing and bonding a component in an area where an interposer (330) and a substrate (e.g., a first substrate (310)) are bonded, the bonding strength between the interposer (330) and the substrate (310) can be strengthened.

According to various embodiments, although the aforementioned FIGS. 10A and 10B describe a bonding structure between an interposer (330) and a first substrate (310), as described above, the interposer (330) may be replaced with a second substrate (320). For example, in a structure where the first substrate (310) and the second substrate (320) are bonded without an interposer, a cavity may be formed in an area where the second substrate (320) is bonded to the first substrate (310), and a third component may be placed in the formed cavity.

FIG. 11 is a cross-sectional view of an interposer substrate according to various embodiments of the present disclosure.

Referring to FIG. 11, according to various embodiments, the second portion (1021b) of the first bonding member (1021) can be soldered with a relatively smaller amount of solder compared to FIG. 10b. The second portion (1022b) of the second bonding member (1022) can be soldered with a relatively smaller amount of solder compared to FIG. 10b. According to various embodiments, the bonding strength can be adjusted by controlling the amount of the first bonding member (1021) and/or the second bonding member (1022) or the size of the bonding area. For example, when the amount of the first bonding member (1021) and/or the second bonding member (1022) or the size of the bonding area is relatively increased, the bonding strength can be relatively strengthened. When the amount of the first bonding member (1021) and/or the second bonding member (1022) or the size of the bonding area is relatively decreased, the amount of the bonding member used can be reduced. According to various embodiments, the side portions of the first pad (1001a), the second pad (1002a), the third pad (1003a), and/or the fourth pad (1004a) may not have a bonding member added. For example, referring to FIG. 11, only at least a portion of the first pad (1001a), the second pad (1002a), the third pad (1003a), the fourth pad (1004a), and the third component (1010) may be bonded with a bonding member. According to various embodiments, only at least a portion of the lower portion of the third component (1010) may be bonded with a bonding member.

FIG. 12 is a cross-sectional view of an interposer substrate according to various embodiments of the present disclosure.

Referring to FIG. 12, according to various embodiments, a first cavity (e.g., cavity (1000) of FIG. 10a) may be formed between the first pad (1001a) and the second pad (1002a) formed on the first surface (332) of the interposer (330) facing the first substrate (310). A second cavity (e.g., cavity (1000) of FIG. 10a) may be formed between the third pad (1003a) and the fourth pad (1004a) formed on the second surface (312) of the interposer (330) facing the first substrate (310).

According to various embodiments, a first portion (e.g., a lower portion) of the third component (1010) may be joined within the first cavity, and a second portion (e.g., an upper portion) of the third component (1010) may be joined within the second cavity.

According to various embodiments, the first bonding member (1203a) can bond at least a portion (e.g., a left portion) of the third component (1010), the first pad (1001a), and the third pad (1003a). The second bonding member (1203b) can bond at least a portion (e.g., a right portion) of the third component (1010), the second pad (1002a), and the fourth pad (1004a).

According to various embodiments, referring to FIG. 12, compared to FIG. 9b, a first cavity and a second cavity are formed in an area where an interposer (330) and a substrate (e.g., a first substrate (310)) are bonded (e.g., a first cavity is formed in the interposer (330) and a second cavity is formed in the first substrate (310)), and a component (e.g., a third component (1010)) is additionally placed in the first cavity and the second cavity, thereby securing additional component placement space. Accordingly, miniaturization of the PBA can be enabled. In addition, by additionally placing and bonding a component in an area where the interposer (330) and a substrate (e.g., the first substrate (310)) are bonded, the bonding strength between the interposer and the substrate can be strengthened.

According to various embodiments, although the aforementioned FIG. 12 describes a bonding structure between an interposer (330) and a first substrate (310), as described above, the interposer (330) may be replaced with a second substrate (320). For example, in a structure in which the first substrate (310) and the second substrate (320) are bonded without an interposer, a first cavity and a second cavity may be formed in an area where the second substrate (320) is bonded to the first substrate (310), and a third component may be placed in the first cavity and the second cavity.

FIG. 13 is a cross-sectional view of an interposer substrate according to various embodiments of the present disclosure.

Referring to FIG. 13, according to various embodiments, the first bonding member (1301) can bond the upper portion (1001) of the first plating surface (901b) and the lower portion of the third component (1010). The second bonding member (1302) can bond the upper portion (1002) of the second plating surface (902b) and the lower portion of the third component (1010). For example, the third bonding member (1303) can bond at least a portion of the first pad (1001a) and the third pad (1003a). For example, the third bonding member (1303) can bond at least a portion of the third component (1010) and the third pad (1003a). The fourth bonding member (1304) can bond at least a portion of the second pad (1002a) and the fourth pad (1004a). For example, the fourth bonding member (1304) can bond at least a portion of the third component (1010) and the fourth pad (1004a).

According to various embodiments, FIG. 13 can reduce costs by not adding a joining member to either or both sides of the third component (1010) as compared to FIG. 10b. According to various embodiments, referring to FIG. 13, the both sides of the third component (1010) are illustrated as being spaced apart from the upper portion (1001) of the first plating surface (901b) or the upper portion (1002) of the second plating surface (902b), respectively, but the both sides of the third component (1010) and the upper portions (1001, 1002) of each plating surface can also be manufactured without the space so that they are in contact.

FIG. 14 is a cross-sectional view of an interposer substrate according to various embodiments of the present disclosure.

Referring to FIG. 14, according to various embodiments, the amount of bonding material can be reduced by not soldering the side surface of the third component (1010) compared to FIG. 12.

In various embodiments, the first bonding member (1401) can bond at least a portion of the lower portion of the third component (1010) and the upper portion (1001) of the first plating surface (901b). The second bonding member (1402) can bond at least a portion of the lower portion of the third component (1010) and the upper portion (1002) of the second plating surface (902b). The third bonding member (1403) can bond at least a portion of the upper portion of the third component (1010) and the third plating surface (1003). The fourth bonding member (1003) can bond at least a portion of the upper portion of the third component (1010) and the fourth plating surface (1404). In various embodiments, FIG. 14 can reduce costs by reducing the amount of bonding members compared to FIG. 12 or FIG. 10b.

FIGS. 15A and 15B are plan views of an interposer substrate according to various embodiments of the present disclosure.

Referring to FIG. 15a, a third component (1010) may be placed in a cavity (e.g., cavity (1000) of FIG. 10a) formed between the first hole (807a) and the second hole (807b). Referring to FIG. 15b, a fourth component (1011) may be placed in a cavity (e.g., cavity (1000) of FIG. 10a) formed between the third hole (807c) and the fourth hole (807d). According to various embodiments, the fourth component (1011) may be a component having a relatively large size compared to the third component (1010). For example, the third component (1010) may be a 0402 type component having a horizontal length of approximately 0.4 mm and a vertical length of approximately 0.2 mm. The fourth component (1011) may be a 0603 type component having a horizontal length of approximately 0.6 mm and a vertical length of approximately 0.3 mm. For example, the arrangement between pads or the arrangement between pins on the substrate (310, 320) or the interposer (330) may be optimized in consideration of the size of the third component (1010) or the fourth component (1011). According to various embodiments, the third component (1010) or the fourth component (1011) may be arranged in a cavity formed in a space between pads in a horizontal, vertical, or diagonal shape on the substrate (310, 320) or the interposer (330). According to various embodiments, the third component (1010) or the fourth component (1011) may include a passive component. For example, the third component (1010) or the fourth component (1011) may include at least one of a resistor, a coil, and a capacitor.

According to one embodiment, an electronic device may include a housing. The electronic device may include a first substrate disposed within the housing and having a first component disposed on at least one surface. The electronic device may include a second substrate disposed within the housing and laminated with the first substrate, and having a second component disposed on at least one surface. The electronic device may include an interposer that is in contact between the first substrate and the second substrate so that the first substrate and the second substrate are electrically connected. The electronic device may form a cavity between a first pad and a second pad formed on a contact surface of the interposer, and at least a portion of a third component may be bonded within the cavity.

According to one embodiment, a first cavity is formed between the first pad and the second pad of the interposer, a second cavity is formed between the third pad and the fourth pad formed on a second surface of the first substrate facing the interposer, a first part of the third part can be bonded within the first cavity, and a second part of the third part can be bonded within the second cavity.

In one embodiment, the third component can be soldered to a plating surface within the cavity.

In one embodiment, the third component can be bonded to a side surface within the cavity.

According to one embodiment, the third component may be joined to a portion of an upper surface or a portion of a lower surface within the cavity.

According to one embodiment, at least a portion of the interposer may be formed in a closed curve shape.

According to one embodiment, the third component may include a passive component.

According to one embodiment, the passive component may include at least one of a resistor, a coil, and a capacitor.

According to one embodiment, the passive component may have a first terminal electrically connected to the first pad (1001a).

According to one embodiment, the passive component may have a second terminal electrically connected to the second pad (1002a).

According to one embodiment, the third component can be electrically connected via a plated pad included in an inner wall of a via formed within the interposer.

According to one embodiment, the interposer may include a via for electrical connection with the first substrate under the first pad or the second pad.

According to one embodiment, the via may include a hole formed through at least a portion of the interposer; and a plating pad surrounding an outer side of the hole for transmitting an electrical signal through the hole.

According to one embodiment, the upper end of the plating pad can form the first pad or the second pad.

According to one embodiment, the upper end of the plating pad can be soldered to a third pad or a fourth pad formed on the first substrate (310).

According to one embodiment, an electronic device may include a housing. The electronic device may include a first substrate disposed within the housing and having a first component disposed on at least one surface thereof. The electronic device may include a second substrate disposed within the housing and laminated with the first substrate, and having a second component disposed on at least one surface thereof. The electronic device may form a cavity between a first pad and a second pad formed on a contact surface of the first substrate that contacts the second substrate, and at least a portion of a third component may be bonded within the cavity.

According to one embodiment, a first cavity is formed between the first pad and the second pad of the second substrate, a second cavity is formed between the third pad and the fourth pad formed on a first surface of the first substrate facing the second substrate, a first part of the third component can be joined within the first cavity, and a second part of the third component can be joined within the second cavity.

In one embodiment, the third component can be soldered to a plating surface within the cavity.

In one embodiment, the third component can be bonded to a side surface within the cavity.

According to one embodiment, the third component may be joined to a portion of an upper surface or a portion of a lower surface within the cavity.

The electronic device including the interposer substrate of the present disclosure described above is not limited to the above-described embodiments and drawings, and it will be apparent to a person skilled in the art to which the present disclosure pertains that various substitutions, modifications, and changes are possible within the technical scope of the present disclosure.

The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary knowledge in the technical field to which the present disclosure belongs.

The effects obtainable from the present disclosure are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs.

The electronic device according to the embodiments disclosed in this document may be a variety of devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiments of this document is not limited to the above-described devices. For example, the various embodiments described above may be applied to any electronic device in which a plurality of stacked boards (e.g., printed circuit boards (PCBs)) are accommodated (or arranged) within a housing.

The embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly dictates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first) is referred to as "coupled" or "connected" to another (e.g., a second) component, with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

The term "module" used in the embodiments of this document may include a unit implemented in hardware, software or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be an integrally configured component or a minimum unit of the component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

One embodiment of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., the electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

According to one embodiment, the method according to one embodiment disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded between a seller and a buyer as a commodity. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play StoreTM) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a part of the computer program product may be at least temporarily stored or temporarily generated in a machine-readable storage medium, such as a memory of a manufacturer's server, a server of an application store, or an intermediary server.

According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and arranged in another component. According to one embodiment, one or more of the components or operations of the above-described components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, the plurality of components (e.g., a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each of the components of the plurality of components identically or similarly to those performed by the corresponding component of the plurality of components before the integration. According to one embodiment, the operations performed by the module, the program, or another component may be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims (15)

In an electronic device (200), Housing (210); A first substrate (310) disposed within the housing (210) and having a first component disposed on at least one surface thereof; A second substrate (320) arranged in a stacked manner with the first substrate within the housing (210) and having a second component arranged on at least one surface; and It includes an interposer (330) that is in contact between the first substrate (310) and the second substrate (320) so that the first substrate (310) and the second substrate (320) are electrically connected; An electronic device in which a cavity (1000) is formed between a first pad (1001a) and a second pad (1002a) formed on a first surface (332) facing the first substrate (310) of the interposer (330), and at least a part of a third component (1010) is bonded within the cavity (1000). In the first paragraph, A first cavity is formed between the first pad and the second pad of the interposer (330), A second cavity is formed between the third pad (1003a) and the fourth pad (1004a) formed on the second surface (312) facing the interposer (330) of the first substrate (310), An electronic device, wherein a first part of the third component (1010) is joined within the first cavity, and a second part of the third component is joined within the second cavity. In claim 1 or 2, the third component, An electronic device soldered to a plated surface within the cavity. In any one of claims 1 to 3, the third component is: An electronic device bonded to a side surface within the cavity. In any one of claims 1 to 4, the third component, An electronic device bonded to a portion of the upper surface or a portion of the lower surface within the cavity. In any one of claims 1 to 5, An electronic device wherein at least a portion of the interposer is formed in a closed curve shape. In any one of claims 1 to 6, the third component, An electronic device containing passive components. In any one of claims 1 to 7, the passive element, An electronic device comprising at least one of a resistor, a coil, and a capacitor. In any one of claims 1 to 8, the passive component, An electronic device, wherein a first terminal is electrically connected to the first pad (1001a). In any one of claims 1 to 9, the passive component, An electronic device, wherein a second terminal is electrically connected to the second pad (1002a). In any one of claims 1 to 10, the third component, An electronic device electrically connected through a plated pad included in an inner wall of a via formed within the interposer. In any one of claims 1 to 11, the interposer, An electronic device comprising a via for electrical connection with the first substrate at a lower portion of the first pad or the second pad. In any one of claims 1 to 12, the via, a hole formed through at least a portion of the interposer; and An electronic device comprising a plated pad surrounding the outside of the hole for transmitting an electrical signal through the hole. In any one of claims 1 to 13, An electronic device wherein the upper end of the plating pad forms the first pad or the second pad. In electronic devices, Housing (210); A first substrate (310) disposed within the housing (210) and having a first component disposed on at least one surface thereof; A second substrate (320) is disposed in a stacked manner with the first substrate within the housing (210) and has a second component disposed on at least one surface thereof; An electronic device in which a cavity is formed between a first pad and a second pad formed on a first surface of the second substrate (320) facing the first substrate (310), and at least a part of a third component is bonded within the cavity.

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