WO2025196500A1 - Optical module cold plate-based liquid cooling assembly and network switching device - Google Patents

Abstract

The present disclosure relates to the technical field of heat dissipation in network devices, and provides an optical module cold plate-based liquid cooling assembly and a network switching device. The optical module cold plate-based liquid cooling assembly comprises: a cold plate main body extending in a first direction and comprising a first side and a second side which are opposite one another; a plurality of floating heat conduction blocks connected to the first side of the cold plate main body and floating in a second direction perpendicular to the first direction, the floating heat conduction blocks being arranged spaced apart in the first direction and configured to come into contact with optical modules sequentially arranged in the first direction; a heat conduction pad, which is arranged between the cold plate main body and the floating heat conduction blocks, and comes into contact with the cold plate main body and the floating heat conduction blocks; and at least one liquid cooling tube arranged on the second side of the cold plate main body. The optical module cold plate-based liquid cooling assembly of the present disclosure closely contacts with the optical modules inserted into connectors of a network switching device, and is capable of smoothly and promptly exporting heat generated during the operation of the optical modules, resulting in high heat dissipation efficiency and a good heat dissipation effect.

Description

Optical Module Cold Plate Liquid Cooling Assembly and Network Switching Device TECHNICAL FIELD The present disclosure relates to the field of network device heat dissipation technology, and more particularly to an optical module cold plate liquid cooling assembly and network switching device. Background: Optical modules are optoelectronic devices that perform photoelectric and electro-optical conversion and are critical components of 4G/5G communication equipment and data centers. With the continuous increase in communication speeds and loads, the power consumption and number of installed optical modules are also increasing, making heat dissipation of optical modules particularly important. In related art, air cooling is commonly used to dissipate heat from optical modules. This is achieved by installing the optical module in an optical module connector and creating a window at the top of the connector, allowing the optical module to partially contact a heat sink. Heat is transferred from the optical module to the heat sink's fins, where air flow across the fins dissipates the heat to the external environment. However, air cooling of optical modules suffers from low heat dissipation efficiency and poor heat dissipation effectiveness. SUMMARY OF THE INVENTION The present disclosure provides an optical module cold plate liquid cooling assembly and a network switching device. The optical module cold plate liquid cooling assembly closely contacts an optical module inserted into a connector of the network switching device, thereby smoothly and promptly dissipating heat generated by the optical module during operation, achieving high heat dissipation efficiency and excellent heat dissipation effect. One aspect of the present disclosure provides an optical module cold plate liquid cooling assembly, comprising: a cold plate main body extending along a first direction, comprising a first case and a second case 1 opposite to each other; a plurality of floating heat conductive blocks connected to the first case of the cold plate main body and capable of floating along a second direction perpendicular to the first direction; each floating heat conductive block is arranged at intervals along the first direction and is used to contact each optical module arranged sequentially along the first direction; a thermal pad is arranged between the cold plate main body and the floating heat conductive blocks, and is in contact with the cold plate main body and the floating heat conductive blocks; at least one liquid cooling pipe is arranged on the second case 1 of the cold plate main body. The optical module cold plate liquid cooling assembly provided by the present disclosure comprises a cold plate main body, a plurality of floating heat conductive blocks, a thermal pad and at least one liquid cooling pipe, the cold plate main body extending along the first direction, each floating heat conductive block is arranged on the first case of the cold plate main body and is arranged at intervals along the first direction, the thermal pad is attached between the floating heat conductive blocks and the cold plate main body, and the liquid cooling pipe is arranged on the second case 1 of the cold plate main body. Through the floating heat-conducting blocks contacting each optical module, the heat generated by the optical module is transferred to the cold plate body through the floating heat-conducting blocks and the thermal pads. The heat is then carried away by the coolant in the liquid cooling tube to dissipate the heat from the optical module. The floating heat-conducting blocks can float in a second direction perpendicular to the first direction, and the thermal pads can deform with the movement of the floating heat-conducting blocks, always closely fitting with the floating heat-conducting blocks and the cold plate body. In this way, when using liquid cooling for optical modules, Based on module heat dissipation, this ensures that the floating thermally conductive blocks maintain close contact with the optical module, reducing the contact thermal resistance between the optical module cold plate liquid cooling assembly and the optical module, thereby improving heat dissipation efficiency and effectiveness. In one possible embodiment, the optical module cold plate liquid cooling assembly further includes an elastic member connected between each floating thermally conductive block and the cold plate body, capable of extending and contracting in a second direction. By disposing the elastic member between the floating thermally conductive block and the cold plate body, the elastic member drives the floating thermally conductive block to float in the second direction. The elastic member has a strong elastic force and elastic deformation capability, reliably driving the floating thermally conductive block to move and increasing the pressure between the floating thermally conductive block and the optical module, ensuring close contact between the floating thermally conductive block and the optical module. In one possible embodiment, two elastic members are connected between the floating thermally conductive block and the cold plate body, one at each end of the floating thermally conductive block, with a thermal pad located between the two elastic members. By connecting two elastic members at both ends of the floating heat conductive block, the elastic members exert a strong and balanced elastic force on the floating heat conductive block, ensuring good contact between the floating heat conductive block and the cold plate body. Furthermore, by placing the thermal pad between the two elastic members, the thermal pad occupies sufficient space and conforms to the main body of the floating heat conductive block, thereby improving the thermal pad's thermal conductivity and effectiveness. In one possible embodiment, the cold plate body includes: a main support plate extending in a first direction; a floating heat conductive block located on a first side of the support plate; and a liquid cooling tube located on a second side of the main support plate; a stopper assembly connected to an outer side of the main support plate and, together with the main support plate, forming a floating groove; the floating groove is located on two sides of the main support plate, with the notches of the two floating grooves facing each other, and the two ends of the floating heat conductive block are inserted into the two floating grooves. The stopper assembly and the main support plate together form the cold plate body. The floating groove formed between the two forms the mounting base for the floating heat conductive block, securing the floating heat conductive block to the cold plate body and limiting its travel. This design also facilitates the processing and design of the main support plate and the assembly of the liquid cold plate, reducing the costs of processing and assembly. In one possible embodiment, the stopper assembly includes stoppers connected to two opposing sides of the main support plate, with the second side of the main support plate exposed. The stoppers are provided on opposing sides of the main support plate, and together with the main support plate, they form two floating grooves to secure and limit the floating heat conductive block. Furthermore, the exposure of the second side of the main support plate facilitates the installation of the liquid cooling tube, resulting in a short heat transfer path and high heat transfer efficiency for the entire liquid cooling assembly. In one possible embodiment, the stopper includes a main body and a stopper connected to each other, the main body being connected to the main support plate, and the stopper being positioned at the end of the floating heat conductive block. In one possible embodiment, multiple stoppers are spaced apart along the first direction, each stopper blocking at least one floating heat conductive block. In one possible embodiment, there is one liquid cooling tube, and the liquid cooling tube passes through both ends of the cold plate body along the first direction. In one possible embodiment, the liquid cooling tube extends from one end of the cold plate body along a wavy line to the other end of the liquid cooling plate. Another aspect of the present disclosure provides a network switching device, comprising: at least one board; at least one connector group, each connector group comprising a plurality of connectors arranged sequentially along a first direction, each connector electrically connected to the board; wherein each connector in at least one connector group has a contact window located at the mounting edge of the connector group; and at least one optical module cold plate liquid cooling assembly as described above, the optical module cold plate liquid cooling assembly being disposed at the mounting edge 1 of the connector group, with each floating thermal block of the optical module cold plate liquid cooling assembly being configured to pass through the contact window and contact an optical module inserted into the connector. The network switching device provided by the present disclosure comprises at least one board, at least one connector group, and at least one optical module cold plate liquid cooling assembly. Each connector in the connector group is arranged sequentially along the first direction and electrically connected to the board; each connector in at least one connector group has a contact window at the mounting edge; and the optical module cold plate liquid cooling assembly is disposed at the mounting edge 1 of the connector group. The optical module cold plate liquid cooling assembly includes a cold plate body, multiple floating thermally conductive blocks, a thermal pad, and at least one liquid cooling tube. The cold plate body extends along a first direction. The floating thermally conductive blocks are disposed on a first side of the cold plate body and spaced apart along the first direction. The thermal pad is positioned between the floating thermally conductive blocks and the cold plate body, and the liquid cooling tube is positioned on a second side of the cold plate body. Each floating thermally conductive block contacts the optical module through the contact windows of the connectors. Heat generated by the optical module is transferred to the cold plate body via the floating thermally conductive blocks and the thermal pads, where it is removed by coolant in the liquid cooling tube, dissipating heat from the optical module. The floating thermally conductive blocks can float in a second direction perpendicular to the first direction, and the thermal pad can deform with the movement of the floating thermally conductive blocks, maintaining a tight fit with the floating thermally conductive blocks and the cold plate body. This ensures that the floating thermally conductive blocks maintain close contact with the optical module while dissipating heat from the optical module through liquid cooling. This reduces the contact thermal resistance between the optical module cold plate liquid cooling assembly and the optical module, improving heat dissipation efficiency and effectiveness. In one possible implementation, at least two connector groups are spaced apart along a second direction perpendicular to the first direction. Each connector in each connector group has a contact window, and each connector group is correspondingly provided with an optical module cold plate liquid cooling assembly. When at least two connector groups are spaced apart along the second direction, each connector group is provided with an optical module cold plate liquid cooling assembly, and each connector in each connector group is provided with a contact window. The liquid cooling assembly passes through the contact windows of each connector in the corresponding connector group and contacts the optical modules inserted into each connector. This allows for timely and rapid heat removal from all optical modules, achieving effective heat dissipation for each optical module. In one possible embodiment, there is one board, and the connector group includes two inner connector groups and two outer connector groups. The two inner connector groups are connected to two outer surfaces of the board, respectively. The two outer connector groups are located on one side of the inner connector groups facing away from the board, and both outer connector groups are electrically connected to the board. There are four optical module cold plate liquid cooling assemblies, each of which is located on one side of the board. Connector group installation examples. By electrically connecting four connector groups on a single board, the optoelectronic connection module is equipped with a larger number of connectors, allowing for a greater number of optical modules to be plugged in, thereby increasing the module's capacity and transmission power. Furthermore, since only one board is used, the control of the optoelectronic connection module is simplified, resulting in higher signal transmission efficiency. In one possible embodiment, each connector group installation example is one in which the connector group faces away from the board. The optical module cold plate liquid cooling assembly includes two inner liquid cooling assemblies and two outer liquid cooling assemblies. The two inner liquid cooling assemblies are located between the inner and outer connector groups of each example, and the inner liquid cooling plates are configured to contact the optical modules plugged into the inner connector groups. The two outer liquid cooling assemblies are located in one of the examples in which the outer connector group faces away from the board, and the outer liquid cooling assemblies are configured to contact the optical modules plugged into the outer connector groups. By using the connector assembly installation pattern with each connector group facing away from the board as the connector assembly installation pattern, the contact window of each connector is located on the side of the connector group facing away from the board, and each liquid cooling assembly is installed on the side of the corresponding connector group facing away from the board. This prevents the board from interfering with the connector contact windows or the installation space for the liquid cooling assembly, ensuring stable contact between the liquid cooling assembly and the optical module inserted into the connector. Furthermore, two inner liquid cooling assemblies are sandwiched between the inner and outer connector groups in each pattern, while two outer liquid cooling assemblies are located on opposite outer sides of the outer connector groups in each pattern. Each liquid cooling assembly generates pressure toward the board, ensuring reliable contact between the liquid cooling assembly and the optical module inserted into the connector group. The pressure generated by the liquid cooling assemblies in the two patterns is balanced, ensuring balanced force across the entire optoelectronic connection module. In one possible embodiment, each connector in the outer connector group has a bracket that extends toward and connects to the board, and the outer liquid cooling assembly covers at least a portion of the bracket. Each connector in the outer connector group is connected to the board via a bracket, which increases the surface area of each connector in the outer connector group. By having the outer liquid cooling assembly cover at least a portion of the bracket, the outer liquid cooling assembly has a larger heat conduction area, resulting in higher heat dissipation efficiency and better heat dissipation. Furthermore, the outer liquid cooling assembly has a larger contact area with the outer connector group, exerting greater pressure on the outer connector group, thereby improving the overall stability and reliability of the optoelectronic connection module. In addition to the technical problems solved by the embodiments of the present disclosure, the technical features that constitute the technical solutions, and the beneficial effects brought about by these technical features described above, other technical problems solved by the network switching device provided by the embodiments of the present disclosure, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the detailed description. BRIEF DESCRIPTION OF THE DRAWINGS To more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art description. Obviously, the drawings described below represent some embodiments of the present disclosure. Those skilled in the art can derive other drawings based on these drawings without inventive effort. Figure 1 is a schematic structural diagram of a network switching device provided in an embodiment of the present disclosure; Figure 2 is an exploded structural diagram of the network switching device in Figure 1; Figure 3 is a partial structural diagram of the network switching device in Figure 1; Figure 4 is a schematic structural diagram of an optoelectronic connection module provided in an embodiment of the present disclosure; Figure 5 is a schematic structural diagram of an optoelectronic connection module provided in an embodiment of the present disclosure after removing the mounting frame; Figure 6 is an exploded structural diagram of the optoelectronic connection module in Figure 5 from one perspective; Figure 7 is an exploded structural diagram of the optoelectronic connection module in Figure 5 from another perspective; Figure 8 is a schematic structural diagram of an outer layer liquid cooling assembly provided in an embodiment of the present disclosure from one perspective; Figure 9 is a schematic structural diagram of the outer layer liquid cooling assembly in Figure 8 from another perspective; Figure 10 is a partial cross-sectional structural diagram of the outer layer liquid cooling assembly in Figure 8; Figure 11 is a schematic structural diagram of an inner layer liquid cooling assembly provided in an embodiment of the present disclosure from one perspective; Figure 12 is a schematic structural diagram of the inner layer liquid cooling assembly in Figure 11 from another perspective; Figure 13 is a partial cross-sectional structural diagram of the inner layer liquid cooling assembly in Figure 11. Explanation of the accompanying drawings:

]0-Network switching equipment;

100-chassis;

110-installation port;

200 - optoelectronic connection module;

210 - Board; 220 - Connector assembly; 220a - Inner connector assembly; 220b - Outer connector assembly; 230 - Liquid cooling assembly; 230a - Inner liquid cooling assembly; 230b - Outer liquid cooling assembly; 240 - Mounting rack;

221 - Connector; 231 - Liquid cooling tube; 232 - Cold plate body; 233 - Floating heat conducting block; 234 - Thermal pad; 235 - Elastic member; 241 - Main frame; 242 - Front frame;

2211 - Contact window; 2212 - Bracket; 2321 - Main support plate; 2322 - Stop assembly; 2322a - Stop member; 2323 - Floating groove; 2421 - Grip;

23221 - Main body; 23222 - Stopper;

300 - control module;

310 - control board; 320 - baseboard management controller; 330 - bus;

400 - heat dissipation module;

410 - Fan. The terms used in the embodiments of this disclosure are intended only to explain the specific embodiments of this disclosure and are not intended to limit this disclosure. An optical module consists of optoelectronic devices, functional circuits, and optical interfaces. It is a device that performs photoelectric and electro-optical conversion. The optical module includes two parts: a transmitter and a receiver. The transmitter converts electrical signals into optical signals. After transmission via optical fiber, the optical signal is converted into an electrical signal at the receiving end. As described in related art, air cooling is currently commonly used to dissipate heat from optical modules. A window is provided at the top of the optical module connector on the switch, allowing the optical module inserted into the optical module connector to partially contact the heat sink. This allows heat from the optical module to be transferred to the heat sink's fins, where air flowing over the fins dissipates the heat to the outside environment. However, with the increasing power consumption and number of installed optical modules, air cooling, with its overall thermal resistance reaching its limit, is gradually failing to meet the heat dissipation requirements of optical modules. Furthermore, because the optical module and heat sink are fixedly mated and have a small contact area, the thermal resistance between the optical module and the heat sink is high, resulting in temperature rise. Furthermore, when there are a large number of optical modules and the installation space is relatively tight, especially when optical modules are arranged in multiple rows, the limited space available for the heat sink results in low heat dissipation efficiency and poor heat dissipation. In light of this, embodiments of the present disclosure provide an optical module cold plate liquid cooling assembly and a network switching device. The optical module cold plate liquid cooling assembly includes a cold plate body, multiple floating thermally conductive blocks, a thermal pad, and at least one liquid cooling tube. The cold plate body extends along a first direction. The floating thermally conductive blocks are disposed on a first side of the cold plate body and spaced apart along the first direction. The thermal pad is positioned between the floating thermally conductive blocks and the cold plate body. The liquid cooling tube is positioned on a second side of the cold plate body. Each floating thermally conductive block contacts each optical module. Heat generated by the optical module is transferred to the cold plate body via the floating thermally conductive blocks and the thermal pad. The heat is then removed by coolant in the liquid cooling tube, dissipating heat from the optical module. The floating thermally conductive blocks can float in a second direction perpendicular to the first direction, and the thermal pad can deform with the movement of the floating thermally conductive blocks, maintaining a tight fit with the floating thermally conductive blocks and the cold plate body. In this way, while using liquid cooling to dissipate heat from the optical module, the floating thermal block can be ensured to always be in close contact with the optical module, reducing the contact thermal resistance between the optical module cold plate liquid cooling assembly and the optical module, thereby improving heat dissipation efficiency and effectiveness. To further clarify the objectives, technical solutions, and advantages of the embodiments of the present disclosure, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments represent only a portion of the embodiments of the present disclosure, but are not exhaustive. All other embodiments devised by persons of ordinary skill in the art without inventive effort based on the embodiments of the present disclosure are within the scope of protection of the present disclosure. The embodiments of the present disclosure provide a network switching device. The network switching device can be any type of switch, such as an access layer switch, an aggregation layer switch, or a core layer switch. Exemplarily, the network switching device can be a switch with a height of 4U. Where U is a unit representing external dimensions, 1U equals 4.445 centimeters, and 4U equals 17.78 centimeters. Furthermore, the network switching device of the embodiments of the present disclosure can be applied to any scenario requiring a network system, such as a data center. The following describes in detail the network switching device and optical module cold plate liquid cooling assembly according to embodiments of the present disclosure, using a data center aggregation layer switch as an example. Figure 1 is a schematic diagram of the network switching device according to embodiments of the present disclosure. Figure 2 is an exploded view of the network switching device in Figure 1. Figure 3 is a partial structural diagram of the network switching device in Figure 1. As shown in Figures 1 and 2, the network switching device 10 according to an embodiment of the present disclosure may include a chassis 100 and an optical/electrical connection module 200. The chassis 100 serves as the mounting base, upon which all other components of the network switching device 10 can be mounted. This allows the network switching device 10 to be assembled into a single unit, facilitating its movement and placement within a data center. The optical/electrical connection module 200 is mounted within the chassis 100 and is used to connect an optical module (not shown) to the network switching device 10, enabling data transmission between the network switching device 10 and other network devices (e.g., servers or transceivers). The optical/electrical connection module 200 includes at least one board 210 and several connectors 221, all located on the surface of the board 210. The connectors 221 are configured to receive optical modules, enabling connection to the network switching device 10. The board 210 serves as a supporting base for the connector 221, securing the connector 221 and providing electrical signals to the connector 221. The end of the connector 221 facing the outside of the chassis 100 serves as the interface end. The optical module is inserted into the interface end of the connector 221 to establish an electrical connection between the optical module and the optoelectronic connection module 200. The board 210 may be equipped with a chip and provided with electrical channels. The electrical channels are electrically connected to the chip, and the connectors 221 on the board 210 are electrically connected to the electrical channels. This allows signals to be transmitted between the chip and the connectors 221 via the electrical channels. When the optical module is inserted into the connector 221, signals can be transmitted between the optical module and the optoelectronic connection module 200. For example, the optoelectronic connection module 200 may include a board 210, with the multiple connectors 221 each provided on the board 210, and the electrical channels connected to the multiple connectors 221 each provided on the board 210. Alternatively, the optoelectronic connection module 200 may include two or more boards 210, with the multiple connectors 221 disposed on each board 210, and electrical pathways connected to each connector 221 disposed on the corresponding board 210. The board 210 may be a printed circuit board (PCB), which may include a metal conductive layer that forms an electrical pathway between the chip and the connector 221. The metal conductive layer may be formed of, but is not limited to, conductive materials such as copper, aluminum, copper alloy, and aluminum alloy, and this embodiment does not impose specific limitations on this. As shown in FIG. 2 , in this embodiment, the optoelectronic connection module 200 may be configured as a removable switch module (RSM). The optoelectronic connection module 200 as a whole may function as a standalone module and be removably mounted on the chassis 100. With this configuration, the network switching device 10 may be designed with a universal chassis 100 that accommodates different types of optoelectronic connection modules 200. Different optical/electrical connection modules 200 can be replaced for the network switching device 10 based on different application scenarios without the need to design and produce additional chassis 100, thereby reducing the design, production, and testing costs of the chassis 100. Different types of optical/electrical connection modules 200 may refer to modules with different numbers and models of connectors 221. Different optical/electrical connection modules 200 may have different transmission powers. One end of the chassis 100 may be open, forming a mounting opening 110 for the optical/electrical connection module 200. The optical/electrical connection module 200 can be installed within the chassis 100 through this mounting opening 110, with the interface ends of the connectors 221 on the optical/electrical connection module 200 exposed outside the chassis 100, facilitating plugging of the optical module with the interface ends of the connectors 221. Taking the chassis 100 as a rectangular parallelepiped structure as an example, the mounting opening 110 of the chassis 100 can be located at one end of the chassis 100 in its longitudinal direction, and the optical/electrical connection module 200 can be mounted at one end of the chassis 100 in its longitudinal direction. As shown in FIG3 , the network switching device 10 may further include a control module 300, which may be disposed within the chassis 100. The optical/electrical connection module 200 may be electrically connected to the control module 300 so that the control module 300 controls its operation. The board 210 of the optical/electrical connection module 200 may be electrically connected to the control module 300, enabling signal transmission between the control module 300 and the connectors 221 via the board 210. The control module 300 may include a control board 310, and components such as a baseboard management controller (BMC) 320 and a bus 330 disposed on the control board 310. The control board 310 may be, for example, a printed circuit board. The network switching device 10 may also include a heat dissipation module 400. The heat dissipation module 400 is primarily used to dissipate heat from heat-generating components within the chassis 100 and may also be used to dissipate heat from the optoelectronic connection module 200 to ensure proper operation of the network switching device 10. Exemplarily, the heat dissipation module 400 may include at least one fan 410. For example, as shown in FIG3 , the heat dissipation module 400 includes three fans 410. The high-speed rotation of the fans 410 dissipates heat from the network switching device 10 to the outside environment in a timely and effective manner. The heat dissipation module 400 may be positioned near an edge of the chassis 100, or in other words, at an edge of the chassis 100. This facilitates communication between the heat dissipation module 400 and the outside environment, dissipating heat from the network switching device 10. Furthermore, since the heat dissipation module 400 is located at the edge of the chassis 100, a larger space is left inside the chassis 100, facilitating the layout of the interior of the chassis 100. Illustratively, the heat dissipation module 400 can be positioned opposite the optoelectronic connection module 200, with the heat dissipation module 400 and the optoelectronic connection module 200 respectively located at opposite ends of the chassis 100. Figure 4 is a schematic structural diagram of an optoelectronic connection module according to an embodiment of the present disclosure. As shown in Figure 4 , in the optoelectronic connection module 200 of this embodiment, the connectors 221 are regularly arranged in connector groups 220. The optoelectronic connection module 200 includes at least one connector group 220, each connector group 220 comprising a plurality of connectors 221 arranged sequentially along a first direction (the Y direction in the figure), with each connector 221 electrically connected to a board 210. When the optoelectronic connection module 200 includes two or more connector groups 220, the connector groups 220 are spaced apart and arranged along a second direction (the Z direction in the figure), which is perpendicular to the first direction. Taking the example of an optoelectronic connection module 200 installed at one end of the chassis 100 in the longitudinal direction, the first direction in which the connectors 221 in each connector group 220 are arranged sequentially can be the width direction of the chassis 100, and the second direction in which the connector groups 220 are arranged at intervals can be the height direction of the chassis 100. When the optoelectronic connection module 200 includes multiple connector groups 220 spaced apart along the second direction, the optoelectronic connection module 200 can include only one board 210, with all connector groups 220 connected to this board 210; alternatively, the optoelectronic connection module 200 can include two or more board 210, with all connector groups 220 connected to different board 210. Continuing with FIG. 4 , to form the optoelectronic connection module 200 as an independent, detachable module, the optoelectronic connection module 200 can further include a mounting bracket 240, to which the aforementioned board 210 can be fixedly connected. The board 210, the connector 221 on the board 210, and the mounting bracket 240 are assembled together to form the optoelectronic connection module 200. The mounting bracket 240 allows the optoelectronic connection module 200 to be assembled into a standalone structure. In particular, when the optoelectronic connection module 200 includes multiple boards 210, the mounting bracket 240 can assemble the multiple boards 210 into a single unit. Furthermore, the mounting bracket 240 can be used to assemble the optoelectronic connection module 200 with the chassis 100. In other words, by connecting the mounting bracket 240 to the mounting opening 110 of the chassis 100, the optoelectronic connection module 200 is mounted on the chassis 100 to form the network switching device 10. For example, the mounting bracket 240 can be provided with a gripping portion 2421, which, for example, extends from a surface of the optoelectronic connection module 200 facing away from the interior of the chassis 100. An operator can move the optoelectronic connection module 200 by gripping the gripping portion 2421 on the mounting frame 240, facilitating installation and removal of the optoelectronic connection module 200 from the chassis 100. For example, the mounting frame 240 may include a main frame 241 and a front frame 242. The main frame 241 may be positioned corresponding to the board 210, and the board 210 may be fixedly connected to the main frame 241. When the optoelectronic connection module 200 includes multiple boards 210, the main frame 241 secures the multiple boards 210 together to form a monolithic structure. The front frame 242 may be connected to a portion of the main frame 241 facing away from the interior of the chassis 100 and exposed within the mounting opening 110 of the chassis 100. The interface end of each connector 221 may extend beyond the front end of the board 210 and be received within a mounting slot (not shown) formed in the front frame 242. The front frame 242 can be positioned at the front end of the board 210 to protect it. The front frame 242 surrounds the periphery of the interface ends of each connector 221, shielding and protecting them and enhancing the appearance of the optoelectronic connection module 200. The grip 2421 can be provided on the front frame 242. Figure 5 illustrates the structure of the optoelectronic connection module, excluding the mounting bracket, according to an embodiment of the present disclosure. Figure 6 illustrates an exploded structural view of the optoelectronic connection module in Figure 5 from one perspective. Figure 7 illustrates an exploded structural view of the optoelectronic connection module in Figure 5 from another perspective. As shown in Figure 5, to maintain a suitable operating temperature for the optical module, in addition to the heat dissipation module 400 installed in the chassis 100, this embodiment also utilizes liquid cooling to dissipate heat from the optical module, thereby removing heat generated by the module and maintaining its operating temperature within a suitable range. Liquid cooling is used to dissipate heat from the optical module. When the optical module is inserted into the connector 221 of the optoelectronic connection module 200, coolant is used to remove heat generated by the optical module, thereby dissipating heat and reducing the temperature of the optical module. Specifically, the optoelectronic connection module 200 also includes at least one optical module cold plate liquid cooling assembly (hereinafter referred to as the liquid cooling assembly). The liquid cooling assembly 230 is provided in correspondence with the connector group 220 and dissipates heat from each connector 221 in the corresponding connector group 220. For the connector group 220 equipped with the liquid cooling assembly 230, when the optical module is inserted into the connector 221 of the connector group 220, the liquid cooling assembly 230 can contact the optical module. Heat generated by the optical module is transferred to the liquid cooling assembly 230 and removed by the coolant flowing in the liquid cooling assembly 230, thereby dissipating heat from the optical module. The liquid cooling assembly 230 is provided in a direction extending from the connector group 220 and can be... The liquid cooling assembly 230 extends along the extension direction of the connector assembly 220. When the connectors 221 in the connector assembly 220 are arranged sequentially along the first direction, it is equivalent to the connector assembly 220 extending along the first direction. In this case, the liquid cooling assembly 230 can also extend along the first direction. For example, if the optoelectronic connection module 200 is disposed at one end of the chassis 100 in the longitudinal direction, when the connector assembly 220 extends along the width direction of the chassis 100, the liquid cooling assembly 230 can also extend along the width direction of the chassis 100. Furthermore, the liquid cooling assembly 230 is disposed at the connector assembly 220 in the height direction of the chassis 100. It should be noted that to reserve sufficient installation space for the liquid cooling assembly 230 and ensure that the liquid cooling assembly 230 can be installed in one side of the connector assembly 220, in this embodiment, the connector 221 can be mounted on the board 210 along the board surface of the board 210. In other words, the extension direction of the connector 221 can be parallel to the board surface of the board 210, and the insertion and removal direction of the optical module is parallel to the board surface of the board 210. In this way, the board 210 does not limit the space on both sides of the connector assembly 220, and the side of the connector assembly 220 has sufficient space to install the liquid cooling assembly 230. For ease of description, this embodiment defines the side where the liquid cooling assembly 230 is located as the installation side of the connector assembly 220. As shown in FIG6 or FIG7 , for a connector group 220 equipped with a liquid cooling assembly 230, each connector 221 in the connector group 220 may have a contact window 2211, located on the mounting surface of the connector group 220, to ensure that the liquid cooling assembly 230 can contact the optical module inserted into the connector 221. The contact window 2211 is located on the mounting surface of the connector group 220. The liquid cooling assembly 230 passes through the contact window 2211 of each connector 221 and contacts the optical module inserted into the connector 221. When the optoelectronic connection module 200 has multiple connector groups 220, a liquid cooling assembly 230 may be provided for each connector group 220, with each liquid cooling assembly 230 contacting the optical module inserted into each connector group 220. In this way, all optical modules inserted into the optoelectronic connection module 200 are directly in contact with the liquid cooling assembly 230, which can promptly and quickly remove heat from the optical modules and provide effective heat dissipation for each optical module. Specifically, when two or more connector groups 220 are spaced apart along the second direction in the optoelectronic connection module 200, a liquid cooling assembly 230 is provided on the mounting surface of each connector group 220. Each connector 221 in each connector group 220 has a contact window 2211 located on the mounting surface of the connector group 220. The liquid cooling assembly 230 passes through the contact window 2211 of each connector 221 and contacts the optical module inserted into each connector 221. Continuing with FIG. 6 or FIG. 7 , in a specific embodiment, the optoelectronic connection module 200 may include one board 210 and four connector groups 220. The four connector groups 220 may include two inner connector groups 220a and two outer connector groups 220b. The two inner connector groups 220a are connected to two surfaces of the board 210, respectively. The two outer connector groups 220b are located on one side of the inner connector groups 220a facing away from the board 210. Both outer connector groups 220b are electrically connected to the board 210. By electrically connecting four connector groups 220 to a single board 210, a larger number of connectors 221 can be provided in the optoelectronic connection module 200. This allows for a greater number of optical modules to be plugged into the optoelectronic connection module 200, thereby increasing the capacity and transmission power of the optoelectronic connection module 200. Furthermore, since only one board 210 is provided, control of the optoelectronic connection module 200 by the control module 300 only needs to be electrically connected to the board 210. This simplifies the control method and improves signal transmission efficiency. Since the outer connector group 220b is located in the case 1 of the inner connector group 220a away from the board 210, in order to achieve The outer connector assembly 220b is connected to the board 210 via a bracket 2212. Each connector 221 in the outer connector assembly 220b has a bracket 2212. The bracket 2212 of each connector 221 extends toward the board 210, and the connector 221 is connected to the board 210 via the bracket 2212. Since the end of the connector 221 that extends outward from the board 210 is the interface end, to prevent the bracket 2212 from obstructing the interface end of the connector 221, the bracket 2212 can be attached to the end of the connector 221 that faces the board 210. In this case, when a liquid cooling assembly 230 is provided between the outer connector group 220b and the inner connector group 220a, the liquid cooling assembly 230 can be positioned at the front end of the bracket 2212 of each connector 221 in the outer connector group 220b, so that the liquid cooling assembly 230 corresponds to the main portion of the connector 221, ensuring contact between the liquid cooling assembly 230 and the optical module inserted into the connector 221. The number of liquid cooling assemblies 230 corresponding to the connector group 220 can be four. Each liquid cooling assembly 230 is positioned at the mounting point 1 of each connector group 220, and the liquid cooling assembly 230 can be in close contact with the corresponding connector group 220, so that the liquid cooling assembly 230 can contact the optical module inserted into each connector 221 of the connector group 220. For a single connector set 220 of a board 210, a gap exists between the outer connector set 220b and the inner connector set 220a to facilitate installation of the liquid cooling assembly 230 between the outer connector set 220b and the inner connector set 220a. In some examples, each connector set 220 can be installed in a position where the connector set 220 faces away from the board 210. In other words, the contact windows 2211 on the connectors 221 in each connector set 220 are located in the position where the connector set 220 faces away from the board 210. The contact windows 2211 on the connectors 221 of the two inner connector sets 220a face away from each other and are both located in the position where the connector set 220 faces away from the board 210. In this way, the liquid cooling assemblies 230 corresponding to the two inner connector groups 220a can be installed on both sides of the board 210. The board 210 does not interfere with the liquid cooling assemblies 230, and sufficient space can be reserved between the inner connector group 220a and the outer connector group 220b in the same example for the liquid cooling assemblies 230. Furthermore, the board 210 does not interfere with the contact windows 2211 on the connectors 221 of the inner connector group 220a. The contact windows 2211 are fully exposed on the side of the connector 221 facing away from the board 210, ensuring stable contact between the liquid cooling assemblies 230 and the optical module inserted into the connector 221. The contact windows 2211 on the connectors 221 of the two outer connector groups 220b face away from each other. The contact windows 2211 on the connectors 221 of the outer connector group 220b face the same direction as the contact windows 2211 on the connector 221 of the inner connector group 220a in the same embodiment. Thus, the liquid cooling assembly 230 corresponding to the two outer connector groups 220b can be installed in each embodiment, where the outer connector group 220b faces away from the board 210. For ease of explanation, in this embodiment, the liquid cooling assembly 230 corresponding to the inner connector group 220a is defined as the inner liquid cooling assembly 230a. The inner liquid cooling assembly 230a is located between the inner connector group 220a and the outer connector group 220b in the same embodiment. The liquid cooling assembly 230 corresponding to the outer connector group 220b is defined as an outer liquid cooling assembly 230b. The outer liquid cooling assembly 230b is located in one portion of the outer connector group 220b, facing away from the inner connector group 220a of the same portion. In this arrangement, the two inner liquid cooling assemblies 230a are sandwiched between the inner connector group 220a and the outer connector group 220b of each portion, and the two outer liquid cooling assemblies 230b are located on opposite sides of the outer connector groups 220b of the two portions. For the external example, the inner liquid cooling assembly 230a can be clamped between the inner connector assembly 220a and the outer connector assembly 220b of the same example, while the outer liquid cooling assembly 230b can be in close contact with the outer connector assembly 220b. Both the inner and outer liquid cooling assemblies 230a and 230b of the same example generate pressure toward the board 210, ensuring reliable contact between the liquid cooling assembly 230 and the optical module inserted into the corresponding connector assembly 220. Furthermore, the pressure generated by the two liquid cooling assemblies 230 is balanced, ensuring balanced force across the entire optoelectronic connection module 200 and improving its stability and reliability. When the connectors 221 in the outer connector assembly 220b are connected to the board 210 via the brackets 2212, the outer liquid cooling assembly 230b can cover at least a portion of the brackets 2212. Because the bracket 2212 is an additional component of the connector 221, it increases the surface area of each connector 221 in the outer connector group 220b. Consequently, the outer liquid-cooling assembly 230b can be larger than the inner liquid-cooling assembly 230a. This provides a larger heat-conducting area for the outer liquid-cooling assembly 230b, resulting in higher heat dissipation efficiency and effectiveness. Furthermore, the outer liquid-cooling assembly 230b, located in the outermost layer, has a larger contact area with the outer connector group 220b, exerting greater pressure on the outer connector group 220b. This allows for closer contact between the outer liquid-cooling assembly 230b and the optical module inserted into the connector 221, resulting in greater overall stability and reliability for the optoelectronic connection module 200. The following describes the liquid-cooling assembly 230 in the optoelectronic connection module 200 in detail. Figure 8 is a schematic structural diagram of the outer liquid-cooling assembly according to an embodiment of the present disclosure from one perspective. Figure 9 is a schematic structural diagram of the outer liquid cooling assembly in Figure 8 from another perspective. Figure 10 is a partial cross-sectional structural diagram of the outer liquid cooling assembly in Figure 8. As shown in Figures 8 and 9, the outer liquid cooling assembly 230b includes a liquid cooling plate and at least one liquid cooling tube 231. One surface of the liquid cooling plate faces the corresponding outer connector group 220b and is configured to contact the optical modules inserted into the connectors 221 in the outer connector group 220b. Liquid cooling tubes 231 are provided on the other surface of the liquid cooling plate to provide space for the flow of coolant. Heat generated by the optical module is transferred to the liquid cooling plate, which then transfers the heat to the liquid cooling tubes 231. The coolant in the liquid cooling tubes 231 exchanges heat with the liquid cooling plate, absorbing the heat and dissipating heat from the optical module. As shown in Figure 9 , in some embodiments, the outer liquid-cooling assembly 230b may include a liquid-cooling tube 231. This liquid-cooling tube 231 may extend along the first direction of extension of the liquid-cooling plate and pass through both ends of the liquid-cooling plate. This allows the liquid-cooling tube 231 to pass through all regions along the extension direction of the liquid-cooling plate, allowing heat from each region of the liquid-cooling plate to be quickly transferred to the liquid-cooling tube 231. This improves the heat dissipation efficiency of the liquid-cooling assembly 230 and ensures uniform heat dissipation within the liquid-cooling assembly 230. For example, the liquid-cooling tube 231 may extend along a wavy line from one end of the liquid-cooling plate to the other end of the liquid-cooling plate in the first direction of extension. This allows the liquid-cooling tube 231 to extend further along the liquid-cooling plate and evenly cover the center and edges of the liquid-cooling plate. This results in higher and more uniform heat transfer between the liquid-cooling plate and the liquid-cooling tube 231, improving the heat dissipation efficiency and effectiveness of the outer liquid-cooling assembly 230b. In other embodiments, the outer liquid cooling assembly 230b may include two or more liquid cooling tubes 231, and the liquid cooling tubes 231 may be arranged in sequence so that all liquid cooling tubes 231 can cover all areas in the first direction in which the liquid cooling plate extends, thereby ensuring the heat dissipation effect of the outer liquid cooling assembly 230b. As shown in Figure 10 , the liquid cold plate includes a cold plate body 232, multiple floating thermal blocks 233, and a thermal pad 234. The cold plate body 232 serves as the main support structure of the liquid cold plate. The cold plate body 232 extends along a first direction, which is the direction in which the connector assembly 220 extends. The two sides of the cold plate body 232 in the thickness direction are respectively a first side and a second side. The multiple floating thermal blocks 233 are disposed on the first side of the cold plate body 232, and are spaced apart along the first direction. Each floating thermal block 233 corresponds to a connector 221 in the connector assembly 220. The floating thermal blocks 233 are designed to pass through the contact windows 2211 of the connectors 221 and contact the optical modules inserted into the connectors 221. The thermal pad 234 is disposed between the cold plate body 232 and the floating thermal blocks 233. Two surfaces of the thermal pad 234 contact the cold plate body 232 and the floating thermal blocks 233, respectively. The liquid cooling tube 231 is positioned on the second side of the cold plate body 232. The floating heat conductive block 233 can float in a second direction, perpendicular to the first direction, which can be the thickness direction of the liquid cold plate. The thermal pad 234, positioned between the floating heat conductive block 233 and the cold plate body 232, is elastic and deforms with the movement of the floating heat conductive block 233, ensuring that both sides of the thermal pad 234 remain in close contact with the cold plate body 232 and the floating heat conductive block 233. This configuration creates a high pressure between the floating heat conductive block 233 and the optical module inserted into the connector 221, ensuring close contact between the floating heat conductive block 233 and the optical module, reducing the contact thermal resistance between the liquid cold plate and the optical module, and improving the heat dissipation efficiency and effectiveness of the liquid cooling assembly 230. Furthermore, because the floating heat conductive block 233 can float up and down, the liquid cooling plate can accommodate optical modules of different models and sizes, expanding the application range of the liquid cooling assembly 230 and enhancing its versatility. Furthermore, by providing a compressible thermal pad 234 between the floating heat conductive block 233 and the cold plate body 232, the floating heat conductive block 233, the thermal pad 234, and the cold plate body 232 are in close contact with each other, forming a stable and reliable heat conduction path. This ensures that the heat generated by the optical module is transferred sequentially through the floating heat conductive block 233 and the thermal pad 234 to the cold plate body 232, and then from the cold plate body 232 to the liquid cooling tube 231, where it is ultimately carried away by the coolant within the liquid cooling tube 231. By placing a floating thermal block 233 in contact with the optical module within the connector 221 and positioning the thermal pad 234 between the cold plate body 232 and the floating thermal block 233, the floating thermal block 233 possesses a high structural strength. This ensures stable and reliable contact between the floating thermal block 233 and the optical module, even with repeated insertion and removal of the optical module. Furthermore, the cold plate body 232 and the floating thermal block 233 enclose the thermal pad 234, protecting it and extending its service life. In one embodiment, the liquid cold plate may include a single, integral thermal pad 234, with which all floating thermal blocks 233 are in contact. The movement of each floating thermal block 233 causes deformation of the corresponding portion of the thermal pad 234. As another embodiment, the liquid cold plate may include multiple thermal pads 234, each thermal pad 234 corresponding to a floating heat conductive block 233, with a thermal pad 234 disposed between each floating heat conductive block 233 and the cold plate body 232. In this embodiment, the cold plate body 232 and the floating heat conductive blocks 233 may be metal parts to ensure the thermal conductivity of the cold plate body 232 and the floating heat conductive blocks 233, meet the overall structural strength requirements of the liquid cold plate, and ensure the liquid Reliability of the cold plate. Exemplarily, the cold plate body 232 can be made of a metal material such as aluminum, aluminum alloy, titanium, titanium alloy, or alloy steel. The floating heat conductive block 233 can be made of a metal material such as copper or aluminum. For example, the floating heat conductive block 233 can be a copper plate, which can improve the thermal conductivity of the floating heat conductive block 233. The liquid cooling tube 231 can also be made of a metal material to improve the thermal conductivity between the cold plate body 232 and the liquid cooling tube 231. The liquid cooling tube 231 also has high structural strength and good reliability. Exemplarily, the liquid cooling tube 231 can be a metal tube such as a copper tube or an aluminum tube. Since the thermal pad 234 needs to be elastic and compressible, it can be a flexible pad and made of a flexible material. For example, the material of the thermal pad 234 can be polyamide (PA) or polypropylene (PP). Continuing with Figure 10 , in addition to providing thermal pads 234 between the floating heat conductive blocks 233 and the cold plate body 232, the liquid cold plate may further include elastic members 235 connected between each floating heat conductive block 233 and the cold plate body 232. The elastic members 235 can expand and contract along the aforementioned second direction to drive the floating heat conductive blocks 233 to float in the second direction. The elastic members 235 have a strong elastic force and elastic deformation capability. Using the elastic members 235 as the primary driving mechanism, they can reliably drive the floating heat conductive blocks 233 to float. Furthermore, the elastic force of the elastic members 235 acts on the optical module through the floating heat conductive blocks 233, increasing the pressure between the floating heat conductive blocks 233 and the optical module, ensuring close contact between the floating heat conductive blocks 233 and the optical module, reducing the contact thermal resistance between the floating heat conductive blocks 233 and the optical module, and improving the heat dissipation efficiency and effectiveness of the liquid cooling assembly 230. In some examples, two elastic members 235 can be connected between the floating thermal block 233 and the cold plate body 232. The two elastic members 235 are located at either end of the floating thermal block 233. This allows the two elastic members 235 to exert a strong elastic force on the floating thermal block 233, increasing the pressure between the floating thermal block 233 and the optical module, ensuring close contact between the floating thermal block 233 and the optical module. Furthermore, the two elastic members 235 exert pressure on both ends of the floating thermal block 233, ensuring the balance of the floating thermal block 233 and good contact between the floating thermal block 233 and the optical module. In this case, a thermal pad 234 can be positioned between the two elastic members 235. The larger space between the two elastic members 235 at either end of the floating thermal block 233 allows for sufficient space for the thermal pad 234, ensuring that the pad 234 has a sufficient surface area. Furthermore, the thermal pad 234 is in close contact with the main body of the floating thermal block 233. In this way, the thermal pad 234 can quickly and completely transfer heat from the floating heat conductive block 233 to the cold plate body 232. Continuing with FIG10 , in some embodiments, the cold plate body 232 may include a main support plate 2321 and a stopper assembly 2322. The main support plate 2321 is the main structure of the cold plate body 232 and can extend along the aforementioned first direction. The floating heat conductive block 233 is located on a first side of the main support plate 2321, and the liquid cooling tube 231 is located on a second side of the main support plate 2321. The stopper assembly 2322 is connected to the outer edge of the main support plate 2321. The stopper assembly 2322 and the main support plate 2321 together form a floating groove 2323. The floating grooves 2323 can be located on both sides of the main support plate 2321, and the notches of the two floating grooves 2323 are opposite to each other. The two ends of the floating heat conductive block 233 are inserted into the two floating grooves 2323 to limit the movement of the floating heat conductive block 233. The stopper assembly 2322 and the main support plate 2321 together form the cold plate body 232, and the two are surrounded by a The floating groove 2323 forms the mounting base for the floating heat conductive block 233, securing the floating heat conductive block 233 to the cold plate body 232 and limiting its travel range. This allows the main support plate 2321 to be generally flat, facilitating its production and processing. This also facilitates assembly of the liquid cooling plate, reducing costs for processing and assembly. The stopper assembly 2322 may include two opposing stoppers 2322a connected to the main support plate 2321. The stopper assembly 2322 does not cover the second side of the main support plate 2321, leaving it exposed. Together, the two stoppers 2322a and the main support plate 2321 define two floating grooves 2323, allowing both ends of the floating heat conductive block 233 to be inserted into the two floating grooves 2323. Furthermore, the second embodiment facilitates installation of the liquid cooling tube 231 on the main support plate 2321, shortens the overall heat conduction path of the liquid cooling assembly 230, and improves heat conduction efficiency. For example, taking the stopper 2322a of the main support plate 2321 as an example, multiple stoppers 2322a can be spaced apart along the first direction in which the main support plate 2321 extends (see FIG8 ), with each stopper 2322a corresponding to at least one floating heat conductive block 233. Multiple stoppers 2322a can be provided along the first direction in which the main support plate 2321 extends to support and secure all floating heat conductive blocks 233, with one stopper 2322a corresponding to only some of the floating heat conductive blocks 233. This facilitates assembly of the floating heat conductive blocks 233 and the stoppers 2322a on the main support plate 2321, and facilitates removal and replacement of each floating heat conductive block 233. Referring to Figure 10 , the stopper 2322a may include a main body 23221 and a stopper 23222. The main body 23221 is the main structure of the stopper 2322a, and the stopper 2322a is connected to the main support plate 2321 via the main body 23221. The stopper 23222 may be located at the end of the main body 23221, with a gap between the stopper 23222 and the main support plate 2321. The stopper 23222, the main body 23221, and the main support plate 2321 collectively form a floating groove 2323. The stopper 23222 is preferably located at the end of the floating heat conductive block 233. As for the outer liquid-cooling assembly 230b, due to the larger area, specifically the width, of the liquid cooling plate of the outer liquid-cooling assembly 230b, the side of the main support plate 2321 facing the board 210 can extend beyond the floating heat conductive block 233. In this case, the stopper 2322a located on the side of the main support plate 2321 facing away from the board 210 can be connected to the outer wall of the main support plate 2321. The main body 23221 of the stopper 2322a extends along the outer wall of the main support plate 2321, and the stopper 23222 of the stopper 2322a can be perpendicular to the main body 23221. A stopper 2322a located on the main support plate 2321 facing the board 210 can be connected to the surface of the main support plate 2321. The main body 23221 of the stopper 2322a extends along the surface of the main support plate 2321, and the stopper 23222 of the stopper 2322a can be parallel to the main body 23221. Figure 11 is a schematic structural diagram of the inner liquid cooling assembly provided by an embodiment of the present disclosure from one perspective. Figure 12 is a schematic structural diagram of the inner liquid cooling assembly in Figure 11 from another perspective. Figure 13 is a partial cross-sectional structural diagram of the inner liquid cooling assembly in Figure 11. As shown in Figures 11 and 12, similar to the outer liquid cooling assembly 230b, the inner liquid cooling assembly 230a can also include a liquid cooling plate and at least one liquid cooling tube 231. One surface of the liquid cooling plate faces the corresponding inner connector group 220a. This surface of the liquid cooling plate is used to connect to the optical modules inserted into the connectors 221 in the inner connector group 220a. Liquid cooling tubes 231 are provided on another surface of the liquid cooling plate, providing space for the coolant to flow. As shown in Figure 13 , similar to the liquid cooling plate of the outer liquid cooling assembly 230b, the liquid cooling plate of the inner liquid cooling assembly 230a also includes a cold plate body 232, multiple floating heat conductive blocks 233, and a thermal pad 234. The multiple floating heat conductive blocks 233 are all provided on the first side of the cold plate body 232, and are spaced apart along the first direction. Each floating heat conductive block 233 corresponds to a connector 221 in the connector assembly 220. The floating heat conductive blocks 233 are designed to pass through the contact windows 2211 of the connectors 221 and contact the optical modules inserted into the connectors 221. The thermal pad 234 is provided between the cold plate body 232 and the floating heat conductive blocks 233, with two surfaces of the thermal pad 234 contacting the cold plate body 232 and the floating heat conductive blocks 233, respectively. The liquid cooling tube 231 is disposed on the second side of the cold plate body 232. The floating heat conductive block 233 can float in the second direction. The thermal pad 234 disposed between the floating heat conductive block 233 and the cold plate body 232 is elastic and deforms with the movement of the floating heat conductive block 233, ensuring that both sides of the thermal pad 234 are always in close contact with the cold plate body 232 and the floating heat conductive block 233. Furthermore, the liquid cooling plate of the inner liquid cooling assembly 230a may also include an elastic member 235 connected between each floating heat conductive block 233 and the cold plate body 232. For example, two elastic members 235 may be connected between the floating heat conductive block 233 and the cold plate body 232, one at each end of the floating heat conductive block 233. The thermal pad 234 may be disposed between the two elastic members 235. This description will not be repeated here. Continuing with FIG13 , similar to the cold plate body 232 of the outer liquid-cooling assembly 230b, the cold plate body 232 of the inner liquid-cooling assembly 230a may also include a main support plate 2321 and a stopper assembly 2322. The stopper assembly 2322 is connected to the outer edge of the main support plate 2321, and together with the main support plate 2321, the stopper assembly 2322 and the main support plate 2321 define a floating groove 2323. The stopper assembly 2322 may include stoppers 2322a connected to two opposing sides of the main support plate 2321, with the second side of the main support plate 2321 exposed. For example, a single stopper 2322a of the main support plate 2321 may be spaced apart along the first direction in which the main support plate 2321 extends (see FIG11 ), with each stopper 2322a corresponding to at least one floating heat conductive block 233. The stopper 2322a may include a main body 23221 and a stopper 23222 connected to each other. The stopper 23222, the main body 23221, and the main support plate 2321 collectively form a floating groove 2323. The stopper 23222 is preferably located at the end of the floating heat conductive block 233. Unlike the outer liquid cooling assembly 230b, the inner liquid cooling assembly 230a has a smaller liquid cooling plate area, specifically a smaller width. Therefore, the width of the main support plate 2321 and the width of the floating heat conductive block 233 can be roughly equivalent. At this time, the stoppers 2322a located on both sides of the main support plate 2321 can be connected to the side walls of the main support plate 2321, the main bodies 23221 of the two stoppers 2322a can extend along the corresponding side walls of the main support plate 2321, and the stoppers 23222 of the two stoppers 2322a can be perpendicular to the main body 23221. In the description of the embodiments of the present disclosure, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between the two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present disclosure can be understood according to specific circumstances. The terms "first", "second", and "third" in the specification and claims of the embodiments of the present disclosure and the above-mentioned drawings are used in a broad sense. "Third,""fourth," and so on (if present) are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Furthermore, the terms "including,""having," and any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, product, or device comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such process, method, product, or device. Finally, it should be noted that the above embodiments are merely illustrative of the technical solutions of the embodiments of the present disclosure, and are not intended to limit them. Although the embodiments of the present disclosure have been described in detail with reference to the foregoing embodiments, persons of ordinary skill in the art will understand that modifications may be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions may be made for some or all of the technical features therein. Such modifications or substitutions do not deviate from the essence of the corresponding technical solutions within the scope of the technical solutions of the embodiments of the present disclosure.

Claims

Claims 1. A cold plate liquid cooling assembly for an optical module, comprising: a cold plate body extending along a first direction and including a first side and a second side opposite to each other; a plurality of floating heat conductive blocks connected to the first side of the cold plate body and capable of floating in a second direction perpendicular to the first direction; the floating heat conductive blocks spaced apart along the first direction and configured to contact optical modules sequentially arranged along the first direction; a thermal pad disposed between the cold plate body and the floating heat conductive blocks and in contact with the cold plate body and the floating heat conductive blocks; and at least one liquid cooling tube disposed on the second side of the cold plate body. 2. The optical module cold plate liquid cooling assembly according to claim 1, further comprising: an elastic member connected between each of the floating heat conductive blocks and the cold plate body, and capable of stretching and contracting along the second direction. 3. The optical module cold plate liquid cooling assembly according to claim 2, wherein two elastic members are connected between the floating heat conductive block and the cold plate body, the two elastic members are respectively located at two ends of the floating heat conductive block, and the thermal pad is located between the two elastic members. 4. The optical module cold plate liquid cooling assembly according to any one of claims 1 to 3, wherein the cold plate body comprises: a main support plate extending along the first direction; the floating heat conductive block is located on a first side of the support plate, and the liquid cooling pipe is located on a second side of the main support plate; a stopper assembly connected to an outer side of the main support plate and forming a floating groove together with the main support plate; the floating groove is located on both sides of the main support plate, with the notches of the floating groove facing each other, and both ends of the floating heat conductive block are inserted into the floating grooves on both sides. 5. The optical module cold plate liquid cooling assembly according to claim 4, wherein the stop assembly comprises stoppers connected to two opposite sides of the main support plate, and the second side of the main support plate is exposed to the outside. 6. The optical module cold plate liquid cooling assembly according to claim 5, wherein the stopper comprises a main body portion and a stopper portion connected to each other, the main body portion is connected to the main support plate, and the stopper portion is disposed at an end portion of the floating heat conductive block. 7. The optical module cold plate liquid cooling assembly according to claim 5, wherein a plurality of the stoppers are spaced apart along the first direction, and each of the stoppers stops at least one of the floating heat conductive blocks. 8. The optical module cold plate liquid cooling assembly according to any one of claims 1 to 3, wherein the number of the liquid cooling tube is one, and the liquid cooling tube passes through both ends of the cold plate body along the first direction. 9. The optical module cold plate liquid cooling assembly according to claim 8, wherein the liquid cooling pipe extends from one end of the cold plate body along a wavy line to the other end of the liquid cooling plate. 10. A network switching device, comprising: at least one board; at least one connector group, each connector group comprising a plurality of connectors arranged sequentially along a first direction, each connector being electrically connected to the board; wherein each connector in at least one connector group has a contact window, the contact window being located on a mounting portion 1 of the connector group; and at least one optical module cold plate liquid cooling assembly according to any one of claims 1 to 9, the optical module cold plate liquid cooling assembly being located on a mounting portion 1 of the connector group, and each floating thermal block of the optical module cold plate liquid cooling assembly being configured to pass through the contact window and contact an optical module inserted into the connector. 11. The network switching device according to claim 10, wherein at least two connector groups are spaced apart along a second direction perpendicular to the first direction, each connector in each connector group has the contact window, and each connector group is correspondingly provided with one optical module cold plate liquid cooling assembly. 12. The network switching device according to claim 11, wherein the number of the board is one, the connector group includes two inner connector groups and two outer connector groups, the two inner connector groups are respectively connected to two surfaces of the board, the two outer connector groups are respectively located on one side of the two inner connector groups facing away from the board, and both outer connector groups are electrically connected to the board; and the number of the optical module cold plate liquid cooling assemblies is four, each optical module cold plate liquid cooling assembly is respectively disposed on a mounting side of each connector group. 13. The network switching device according to claim 12, wherein each of the connector groups is installed at one side of the connector group facing away from the board; the optical module cold plate liquid cooling assembly includes two inner liquid cooling assemblies and two outer liquid cooling assemblies; the two inner liquid cooling assemblies are respectively located between the inner connector group and the outer connector group in each case, and the inner liquid cooling plate is used to contact the optical module inserted in the inner connector group; the two outer liquid cooling assemblies are respectively located at one side of the outer connector group facing away from the board, and the outer liquid cooling assembly is used to contact the optical module inserted in the outer connector group. 14. The network switching device according to claim 13, wherein each connector of the outer connector group has a bracket, the bracket extends toward the board and is connected to the board, and the outer liquid cooling assembly covers At least part of the bracket.