WO2025193020A1 - Refrigerator and method of controlling refrigerator - Google Patents
Refrigerator and method of controlling refrigeratorInfo
- Publication number
- WO2025193020A1 WO2025193020A1 PCT/KR2025/099089 KR2025099089W WO2025193020A1 WO 2025193020 A1 WO2025193020 A1 WO 2025193020A1 KR 2025099089 W KR2025099089 W KR 2025099089W WO 2025193020 A1 WO2025193020 A1 WO 2025193020A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling
- temperature
- refrigerator
- storage room
- condition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D15/00—Devices not covered by group F25D11/00 or F25D13/00, e.g. non-self-contained movable devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/04—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors with more than one refrigeration unit
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
Definitions
- the present disclosure relates to a refrigerator having a thermoelectric element and a compressor for cooling a storage room and a method for controlling the refrigerator.
- a refrigerator is a home appliance that has a main body with a storage compartment and a cold air supply device that supplies cold air to the storage compartment to keep food fresh.
- thermoelectric cooling device that generates heat and cooling through the Peltier effect can be used as a cooling device in a refrigerator.
- the thermoelectric cooling device may include a thermoelectric element.
- the thermoelectric element has a heating element formed on one side and a cooling element formed on the opposite side. When current is applied to the thermoelectric element, heat generation occurs in the heating element and heat absorption occurs in the cooling element.
- the thermoelectric cooling device may be equipped with a heat sink, a cooling sink, a heat sink fan, a cooling fan, a heat duct, and a cooling duct to increase the efficiency of cooling the storage room through the thermoelectric cooling device.
- One aspect of the present disclosure provides a refrigerator and a method of controlling the refrigerator that can cool a storage room more efficiently under overload conditions or rapid cooling conditions.
- a refrigerator may include: a main body forming a storage compartment; a first cooling device including a compressor and an evaporator and cooling the storage compartment; a second cooling device including a thermoelectric element and cooling the storage compartment; a first temperature sensor detecting an outside temperature outside the main body; a second temperature sensor detecting a temperature of the storage compartment; and at least one processor configured to simultaneously perform first cooling by cooling the storage compartment by the first cooling device based on whether the outside temperature is within a preset temperature range and second cooling by cooling the storage compartment by the second cooling device under an overload condition in which the temperature of the storage compartment is higher than a set temperature of the storage compartment by a predetermined temperature or more, and to perform only the first cooling based on whether the outside temperature is not within the preset temperature range.
- a control method for a refrigerator includes: a first cooling device including a compressor and an evaporator and cooling a storage compartment; a second cooling device including a thermoelectric element and cooling the storage compartment; wherein, in an overload condition in which the temperature of the storage compartment is higher than a set temperature of the storage compartment by a predetermined temperature or more, first cooling for cooling the storage compartment by the first cooling device and second cooling for cooling the storage compartment by the second cooling device are performed together based on the outside temperature of the refrigerator being within a preset temperature range, and only the first cooling is performed based on the outside temperature not being within the preset temperature range.
- FIG. 1 is a drawing illustrating a refrigerator according to one embodiment of the present disclosure.
- FIG. 2 is a drawing showing the doors of a refrigerator in an open state according to one embodiment of the present disclosure.
- FIG. 3 is a drawing of the upper part of a storage compartment of a refrigerator according to one embodiment of the present disclosure, viewed from below.
- FIG. 4 is a schematic cross-sectional side view of a refrigerator according to one embodiment of the present disclosure.
- Figure 5 is a cross-sectional view taken along line I-I of Figure 2.
- FIG. 6 is an exploded view of a thermoelectric cooling device according to one embodiment.
- FIG. 7 is a block diagram illustrating an example of a configuration of a refrigerator according to one embodiment.
- Figure 8 illustrates an example of a flowchart of a method for controlling a refrigerator according to one embodiment.
- FIG. 9 illustrates an operation of cooling a storage compartment according to an outside temperature in a control method of a refrigerator according to one embodiment.
- FIG. 10 illustrates an operation of cooling a storage compartment when the outside temperature is in a first temperature range in a control method of a refrigerator according to one embodiment.
- FIG. 11 illustrates an operation of cooling a storage compartment when the outside temperature is in a second temperature range in a control method of a refrigerator according to one embodiment.
- Fig. 12 illustrates an example of an operation for cooling a storage room under rapid cooling conditions in a control method of a refrigerator according to one embodiment.
- Fig. 13 illustrates another example of an operation for cooling a storage compartment under rapid cooling conditions in a control method of a refrigerator according to one embodiment.
- each of the phrases “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B, or C”, “at least one of A, B, and C”, and “at least one of A, B, or C” may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.
- a refrigerator may include a cabinet.
- a “cabinet” may include an inner case, an outer case placed on the outside of the inner case, and insulation provided between the inner case and the outer case.
- the “inner case” may include at least one of a case, plate, panel, or liner forming a storage compartment.
- the inner case may be formed as a single body or may be formed by assembling multiple plates.
- the “outer case” may form the exterior of the cabinet and may be joined to the exterior of the inner case so that insulation is placed between the inner case and the outer case.
- the insulation can insulate the interior and exterior of a storage room so that the temperature inside the storage room can be maintained at a set temperature without being affected by the external environment.
- the insulation can include foam insulation.
- the foam insulation can be formed by injecting and foaming urethane foam, a mixture of polyurethane and a foaming agent, between the inner and outer layers.
- the insulation may include a vacuum insulation material in addition to the foam insulation, or the insulation may consist solely of the vacuum insulation material instead of the foam insulation.
- the vacuum insulation material may include a core material and an outer shell material that accommodates the core material and seals the interior under a vacuum or near-vacuum pressure.
- the insulation material is not limited to the foam insulation or vacuum insulation material described above, and may include various materials that can be used for insulation.
- a "storage room” may include a space defined by an interior wall.
- the storage room may further include an interior wall defining a corresponding space.
- the storage room may store various items, such as food, medicine, and cosmetics, and the storage room may be configured to be open on at least one side for the entry and exit of items.
- a refrigerator may include one or more storage compartments.
- each compartment may have a different purpose and be maintained at different temperatures.
- each storage compartment may be separated from the others by a partition wall containing insulation.
- the storage room may be provided to be maintained at an appropriate temperature range depending on the intended use, and may include a "refrigerator,” a “freezer,” or a “variable temperature room,” which are distinguished according to the intended use and/or temperature range.
- the refrigerator room may be maintained at a temperature appropriate for refrigerating items, and the freezer room may be maintained at a temperature appropriate for freezing items.
- “Refrigeration” may mean cooling items to a temperature that does not freeze them, and for example, a refrigerator room may be maintained at a temperature ranging from 0 degrees Celsius to +7 degrees Celsius.
- Freezing may mean cooling items to freeze them or keep them in a frozen state, and for example, a freezer room may be maintained at a temperature ranging from -20 degrees Celsius to -1 degree Celsius.
- the variable temperature room may be used as either a refrigerator room or a freezer room, at the user's option or not.
- a storage room may also be called by various other names such as “vegetable room,” “fresh room,” “cooling room,” and “ice room.”
- the terms “refrigerator,” “freezer,” and “variable temperature room” used hereinafter should be understood to encompass storage rooms having corresponding uses and temperature ranges.
- the refrigerator may include at least one door configured to open and close an open side of a storage compartment.
- the door may be configured to open and close one or more storage compartments, or a single door may be configured to open and close multiple storage compartments.
- the door may be installed on the front of the cabinet in a pivotal or sliding manner.
- the “door” may be configured to seal the storage compartment when the door is closed.
- the door may include insulation, similar to a cabinet, to insulate the storage compartment when the door is closed.
- the door may include a door outer panel forming the front of the door, a door inner panel forming the back of the door and facing the storage compartment, an upper cap, a lower cap, and door insulation provided on the interior of these.
- the door inner panel may be provided with a gasket that seals the storage compartment by pressing against the front of the cabinet when the door is closed.
- the door inner panel may include a dyke that protrudes rearward to accommodate a door basket for storing items.
- the door may include a door body and a front panel detachably coupled to the front side of the door body and forming the front of the door.
- the door body may include a door outer panel forming the front of the door body, a door inner panel forming the rear of the door body and facing the storage compartment, an upper cap, a lower cap, and door insulation provided inside these.
- refrigerators can be classified into French door type, side-by-side type, bottom mounted freezer (BMF), top mounted freezer (TMF), or single-door refrigerator.
- BMF bottom mounted freezer
- TMF top mounted freezer
- the refrigerator may include a cold air supply device configured to supply cold air to the storage compartment.
- a “cold air supply device” may include a system of machines, devices, electronic devices and/or combinations thereof that can generate cold air and guide the cold air to cool a storage room.
- the cold air supply device can generate cold air through a refrigeration cycle that includes the processes of compression, condensation, expansion, and evaporation of a refrigerant.
- the cold air supply device can include a refrigeration cycle device having a compressor, a condenser, an expansion device, and an evaporator capable of driving the refrigeration cycle.
- the cold air supply device can include a semiconductor, such as a thermoelectric element. The thermoelectric element can cool a storage compartment by generating heat and cooling through the Peltier effect.
- the refrigerator may include a machine room in which at least some components belonging to the cold air supply device are arranged.
- the "machine room” may be designed to be partitioned and insulated from the storage room to prevent heat generated by components placed within the machine room from being transferred to the storage room.
- the interior of the machine room may be configured to communicate with the exterior of the cabinet to dissipate heat from components placed within the machine room.
- the refrigerator may include a dispenser provided on the door to provide water and/or ice.
- the dispenser may be provided on the door so that it is accessible to a user without having to open the door.
- a refrigerator may include an ice-making device configured to produce ice.
- the ice-making device may include an ice-making tray configured to store water, an ice-separating device configured to separate ice from the ice-making tray, and an ice bucket configured to store ice produced in the ice-making tray.
- the refrigerator may include a control unit for controlling the refrigerator.
- the “control unit” may include a memory that stores or memorizes a program and/or data for controlling the refrigerator, and a processor that outputs a control signal for controlling a cold air supply device, etc. according to the program and/or data memorized in the memory.
- Memory stores or records various information, data, commands, programs, etc. necessary for the operation of the refrigerator.
- Memory can store temporary data generated during the generation of control signals for controlling components within the refrigerator.
- Memory may include at least one of volatile memory and non-volatile memory, or a combination thereof.
- the processor controls the overall operation of the refrigerator.
- the processor can control the components of the refrigerator by executing programs stored in memory.
- the processor may include a separate NPU that performs the operations of an artificial intelligence model.
- the processor may also include a central processing unit (CPU), a graphics processing unit (GPU), or the like.
- the processor may generate control signals to control the operation of the cooling system.
- the processor may receive temperature information about the storage compartment from a temperature sensor and generate a cooling control signal to control the operation of the cooling system based on the temperature information.
- the processor may process user input of the user interface and control the operation of the user interface based on programs and/or data stored/stored in the memory.
- the user interface may be provided using an input interface and an output interface.
- the processor may receive user input from the user interface. Additionally, the processor may transmit display control signals and image data to the user interface for displaying an image on the user interface in response to the user input.
- the processor and memory may be provided as a single unit or separately.
- the processor may include one or more processors.
- the processor may include a main processor and at least one subprocessor.
- the memory may include one or more memories.
- a refrigerator may include a processor and memory that control all components within the refrigerator, and may include multiple processors and multiple memories that individually control the components within the refrigerator.
- the refrigerator may include a processor and memory that control the operation of a cooling device based on the output of a temperature sensor.
- the refrigerator may separately include a processor and memory that control the operation of a user interface based on user input.
- the communication module can communicate with external devices, such as servers, mobile devices, and other home appliances, via a nearby access point (AP).
- the AP can connect the local area network (LAN) to which the refrigerator or user device is connected to the wide area network (WAN) to which the server is connected.
- the refrigerator or user device can then connect to the server via the WAN.
- LAN local area network
- WAN wide area network
- the input interface may include keys, a touchscreen, a microphone, etc.
- the input interface may receive user input and transmit it to the processor.
- the output interface may include a display, a speaker, etc.
- the output interface may output various notifications, messages, information, etc. generated by the processor.
- FIG. 1 is a drawing illustrating a refrigerator according to one embodiment of the present disclosure.
- FIG. 2 is a drawing illustrating a state in which a door of a refrigerator according to one embodiment of the present disclosure is opened.
- FIG. 3 is a drawing illustrating the upper portion of a storage compartment of a refrigerator according to one embodiment of the present disclosure as viewed from below.
- FIG. 4 is a schematic side cross-sectional view of a refrigerator according to one embodiment of the present disclosure.
- FIG. 5 is a cross-sectional view taken along line I-I of FIG. 2.
- a refrigerator (1) may include a main body (100), storage chambers (11, 12, 13) formed inside the main body (100), and doors (21, 22, 23, 24) provided to open and close the storage chambers (11, 12, 13).
- the main body (100) may include an inner case (170), an outer case (180) coupled to the outer side of the inner case (170), and an insulating material (190) provided between the inner case (170) and the outer case (180) (see FIG. 6).
- the inner case (170) may form a storage chamber (11, 12, 13), and the outer case (180) may form the outer appearance of the main body (100).
- the main body (100) may include an upper wall (110), a lower wall (120), a left wall (130), a right wall (140), and a rear wall (150).
- the upper wall (110), the lower wall (120), the left wall (130), the right wall (140), and the rear wall (150) may form an upper surface, a lower surface, a left surface, a right surface, and a rear wall of the main body (100), respectively.
- Each of the upper wall (110), the lower wall (120), the left wall (130), the right wall (140), and the rear wall (150) may be formed of an inner surface (170), an outer surface (180), and an insulating material (190).
- the upper surface of the upper wall (110) may be formed by the outer surface (180)
- the lower surface of the upper wall (110) may be formed by the inner surface (170)
- an insulating material (190) may be provided on the inside of the upper wall (110).
- the storage compartments (11, 12, 13) can accommodate items.
- the storage compartments (11, 12, 13) can be formed to have an open front side so that items can be put in or taken out.
- the main body (100) can include a horizontal partition wall (160) that divides the first storage compartment (11) from the second storage compartment (12) and the third storage compartment (13), and a vertical partition wall (161) that divides the second storage compartment (12) from the third storage compartment (13).
- the first storage compartment (11) can be provided at the upper part of the main body (100), and the second storage compartment (12) and the third storage compartment (13) can be provided at the lower part of the main body (100).
- the first storage compartment (11) can be a refrigerator compartment
- the second storage compartment (12) can be a freezer compartment
- the third storage compartment (13) can be a variable temperature compartment.
- the first storage room (11) can be maintained at a first set temperature
- the second storage room (12) can be maintained at a second set temperature
- the third storage room (13) can be maintained at a third set temperature.
- the second set temperature may be set lower than the first set temperature and the third set temperature.
- the second set temperature, the first set temperature, and the third set temperature may be settable by the user.
- Doors (21, 22, 23, 24) can open and close storage rooms (11, 12, 13).
- the first door (21) and the second door (22) can open and close the first storage room (11)
- the third door (23) can open and close the second storage room (12)
- the fourth door (24) can open and close the third storage room (13).
- the doors (21, 22, 23, 24) can be rotatably coupled to the main body (100).
- the doors (21, 22, 23, 24) may be rotatably coupled to the main body (100) by hinges.
- the first door (21) and the second door (22) may be rotatably coupled to the main body (100) by a hinge (31) provided on the upper portion of the main body (100) and a hinge provided in the middle of the main body (100), respectively.
- the hinge (31) may include a hinge pin that protrudes vertically to form a rotational axis of the door.
- the hinge (31) may be covered by a top cover (300) provided to cover the upper front portion of the main body (100).
- a rotating bar (40) may be provided on either the first door (21) or the second door (22) to cover the gap formed between the first door (21) and the second door (22) when the first door (21) and the second door (22) are closed.
- the rotating bar (40) may be provided rotatably on either the first door (21) or the second door (22).
- the rotating bar (40) may have a rod shape that is formed long in a vertical direction.
- the rotating bar (40) may also be referred to as a pillar, a mullion, or the like.
- a guide protrusion (46) may be provided at the top of the rotating bar (40), and a rotation guide (119) that guides the rotation of the guide protrusion (46) may be provided at the top of the main body (100).
- the doors (21, 22, 23, 24) may include a gasket (51).
- the gasket (51) may be pressed against the front of the body (100) when the doors (21, 22, 23, 24) are closed.
- the doors (21, 22, 23, 24) may include a ditch (52) that protrudes rearward.
- a door shelf (53) capable of storing items may be mounted on the ditch (52).
- a rotating bar (40) may be rotatably installed on the ditch (52).
- the refrigerator (1) may include a thermoelectric cooling device (400) arranged to cool the storage compartment (11).
- thermoelectric cooling device (400) may be provided on the upper side of the storage room (11) to cool the storage room (11). That is, the thermoelectric cooling device (400) may be provided on the upper wall (110) of the main body (100).
- thermoelectric cooling device (400) may include a thermoelectric element (530).
- the thermoelectric element (530) may be a semiconductor element that converts thermal energy into electrical energy or electrical energy into thermal energy using the thermoelectric effect, and may also be referred to as a thermoelectric semiconductor element, a Peltier element, or the like.
- thermoelectric element (530) includes a heating element (531) and a cooling element (532). When current is applied to the thermoelectric element (530), a heating action may occur in the heating element (531) and a heat absorption action may occur in the cooling element (532).
- the thermoelectric element (530) may have a thin hexahedral shape.
- a heating element (531) may be provided on one surface of the thermoelectric element (530) and a cooling element (532) may be provided on the opposite surface.
- thermoelectric element (530) may be provided on the upper wall (110) such that the heating portion (531) faces above the thermoelectric element (530) and the cooling portion (532) faces below the thermoelectric element (530). That is, the heating portion (531) may face the outside of the main body (100) and the cooling portion (532) may face the inside of the storage chamber (11). Accordingly, air that has been warmed through heat exchange with the heating portion (531) may be discharged to the outside of the main body (100), and air that has been cooled through heat exchange with the cooling portion (532) may be supplied to the storage chamber (11).
- the thermoelectric cooling device (400) may include a heat sink (520) that contacts the heat generating unit (531) so that heat exchange between the heat generating unit (531) and the air outside the main body (100) is efficiently performed.
- a heat sink (520) may be located outside the main body (100).
- the heat sink (520) may contact the heat generating portion (531) to absorb heat from the heat generating portion (531) and release heat to the outside of the main body (100).
- the heat sink (520) may also be referred to as a hot sink, a heat dissipation heat sink, a hot heat sink, etc.
- the heat sink (520) may be formed of a metal material with good thermal conductivity.
- the heat sink (520) may be formed of aluminum or copper.
- the heat sink (520) may include a heat sink base (521) that contacts the heat generating portion (531) and a plurality of heat dissipation fins (525) that protrude from the heat sink base (521) to expand the heat transfer area.
- the plurality of heat dissipation fins (525) may protrude upward from the heat sink base (521).
- thermoelectric cooling device (400) may include a cooling sink (570) in contact with the cooling unit (532) so that heat exchange between the cooling unit (532) and the air inside the storage chamber (11) is efficiently performed.
- a cooling sink (570) may be located inside the storage compartment (11).
- the cooling sink (570) may cool the storage compartment (11) by taking away heat from the storage compartment (11) and transferring it to the cooling unit (532).
- the cooling sink (570) may also be referred to as a cold sink, a cooling sink, a cooling heat sink, a cold heat sink, a cooling heat sink, etc.
- the cooling sink (570) may be formed of a metal material with good thermal conductivity.
- the cooling sink (570) may be formed of aluminum or copper.
- the cooling sink (570) may include a cooling sink base (571) that contacts the cooling unit (532) and a plurality of cooling fins (575) that protrude from the cooling sink base (571) to expand the heat transfer area.
- the plurality of cooling fins (525) may protrude downward from the cooling sink base (571).
- the cooling sink base (571) and the plurality of cooling fins (575) may be formed integrally.
- thermoelectric cooling device (400) may include a heat dissipation fan (600) that circulates air to ensure efficient heat exchange between the heat dissipation sink (520) and the air outside the main body (100).
- a heat dissipation fan (600) that circulates air to ensure efficient heat exchange between the heat dissipation sink (520) and the air outside the main body (100).
- the heat dissipation fan (600) may be arranged to blow air toward the heat dissipation sink (520).
- the heat dissipation fan (600) may be arranged to be positioned horizontally with respect to the heat dissipation sink (520).
- the heat dissipation fan (600) may be arranged on the outside of the main body (100).
- the heat dissipation fan (600) may be arranged on the upper side of the upper wall (110).
- the heat dissipation fan (600) may be a centrifugal fan that draws in air in an axial direction and discharges it in radial directions.
- the centrifugal fan may include a blower fan.
- the rotation axis (610) of the heat dissipation fan (600) may be arranged perpendicular to the upper surface of the upper wall (110).
- the thermoelectric cooling device (400) may include a heat dissipation duct (700) provided to guide air flowing by a heat dissipation fan (600).
- the heat dissipation duct (700) may guide air from outside the main body (100) to exchange heat with the heat dissipation sink (520), and may discharge the air that has exchanged heat with the heat dissipation sink (520) back to the outside of the main body (100).
- the heat dissipation duct (700) can draw in air from the external space on the upper side of the main body (100).
- the heat dissipation duct (700) can discharge air that has exchanged heat with the heat dissipation sink (520) to the external space on the upper side of the main body (100).
- the heat dissipation fan (600) can be located inside the heat dissipation duct (700).
- the heat dissipation sink (520) can be located inside the heat dissipation duct (700).
- the heat dissipation duct (700) can be provided on the upper surface of the upper wall (110).
- the heat dissipation duct (700) may include an outside air intake port (751) that draws air outside the main body (100) into the inside of the heat dissipation duct (700), and an outside air exhaust port (782) that discharges air that has exchanged heat with the heat dissipation sink (520) to the outside of the main body (100).
- thermoelectric cooling device (400) may include a cooling fan (800) that circulates air to ensure efficient heat exchange between the cooling sink (570) and the air inside the storage chamber (11).
- the cooling fan (800) may be arranged to blow air toward the cooling sink (570).
- the cooling fan (800) may be positioned horizontally with respect to the cooling sink (570).
- the cooling fan (800) may be arranged inside the storage compartment (11).
- the cooling fan (800) may be arranged on the lower side of the upper wall (110).
- the cooling fan (800) may be a centrifugal fan that sucks in air in an axial direction and discharges it in radial directions.
- the rotation axis (810) of the cooling fan (800) may be arranged perpendicular to the bottom surface of the upper wall (110).
- the thermoelectric cooling device (400) may include a cooling duct (900) provided to guide air flowing by a cooling fan (800).
- the cooling duct (700) may guide air inside the storage chamber (11) to exchange heat with the cooling sink (570), and may discharge the air that has exchanged heat with the cooling sink (570) back into the storage chamber (11).
- the cooling fan (800) may be located inside the cooling duct (900).
- the cooling sink (570) may be located inside the cooling duct (900).
- the cooling duct (900) may be provided on the lower surface of the upper wall (110).
- the cooling duct (900) may include an intake port (991) for drawing air inside the storage room (11) into the interior of the cooling duct (900), and an exhaust port (992) for discharging air that has exchanged heat with the cooling sink (570) into the interior of the storage room (11).
- the refrigerator (1) may include a refrigeration cycle device to cool the storage compartment through a refrigeration cycle.
- the refrigeration cycle device may include a compressor (2), a condenser (not shown), an expansion device (not shown), and an evaporator (3).
- the evaporator (3) may be provided at the rear of the storage compartment (12, 13).
- the evaporator may not be provided at the rear side of the first storage compartment (11). That is, the refrigerator (1) according to one embodiment may include only one evaporator (3), and the evaporator (3) may be provided at the rear side of the second storage compartment (12). In addition, the evaporator (3) may be provided at the lower side based on the horizontal bulkhead (160).
- the refrigerator (1) may include a defrost sensor (111) for measuring the temperature of the evaporator (3).
- the defrost sensor (111) can measure the temperature of the evaporator (3). Measuring the temperature of the evaporator (3) may include measuring the temperature of the air surrounding the evaporator (3) and measuring the temperature of the evaporator (3) itself.
- the defrost sensor (111) may be provided in the evaporator (3) or in the evaporator ducts (60, 70).
- the refrigerator (1) may include evaporator ducts (60, 70) that guide cold air generated in the evaporator (3).
- the first evaporator duct (60) may be provided at the rear side of the second storage compartment (12) and the third storage compartment (13).
- the second evaporator duct (70) may be provided at the rear side of the first storage compartment (11).
- the cold air generated in the evaporator (3) can be sucked into the interior of the first evaporator duct (60) by the evaporator fan (80).
- the cold air sucked into the interior of the first evaporator duct (60) can be discharged to the second storage chamber (12) or the third storage chamber (13) through a cold air discharge port (not shown) formed on the front.
- the cold air sucked into the interior of the first evaporator duct (60) can be guided to the internal passage (78) of the second evaporator duct (70).
- the first evaporator duct (60) may be provided with a damper (61) that controls the supply of the cold air inside the first evaporator duct (60) to the second evaporator duct (70).
- a connecting duct (90) may be provided between the first evaporator duct (60) and the second evaporator duct (70) to connect the first evaporator duct (60) and the second evaporator duct (70).
- the internal flow path (78) of the second evaporator duct (70) can guide the cold air generated in the evaporator (3) to the first storage chamber (11).
- the damper (61) can open or close the internal flow path (78).
- the cold air generated in the evaporator (3) may be blocked by the damper (61) and may not be guided to the first storage chamber (11).
- Cold air introduced into the internal passage (78) of the second evaporator duct (70) can be supplied to the first storage chamber (11) through the cold air discharge port (72) formed on the front of the second evaporator duct (70).
- the cold air generated in the evaporator (3) may be supplied directly to the second evaporator duct (70) without passing through the first evaporator duct (60).
- a separate evaporator (3) may be provided at the rear side of the first storage chamber (11) and configured to supply cold air to the second evaporator duct (70).
- a refrigerator (1) may include a thermoelectric cooling device (400) and a refrigeration cycle device for cooling a storage compartment.
- the storage compartment may be cooled using at least one of the thermoelectric cooling device (400) and the refrigeration cycle device.
- the storage compartment may be cooled by supplying only the cold air generated by the refrigeration cycle device.
- the storage compartment may be cooled by supplying the cold air generated by the thermoelectric cooling device (400) together with the cold air generated by the refrigeration cycle device to the storage compartment.
- the refrigerator (1) can supply cold air to the storage compartment (11) depending on external and internal conditions. For example, if the outside temperature of the refrigerator (1) is higher or lower than a preset temperature range, cooling by a refrigeration cycle device is more efficient than cooling by a thermoelectric cooling device (400). Therefore, if the outside temperature of the refrigerator (1) is higher or lower than a preset temperature range, the storage compartment (11) can be cooled only by cold air generated by the refrigeration cycle device.
- the storage compartment (11) can be quickly cooled by simultaneously supplying cold air generated by the refrigeration cycle device and cold air generated by the thermoelectric cooling device (400) to the storage compartment (11).
- thermoelectric cooling device (400) is provided on the upper wall (110) of the main body (100), the location of the thermoelectric cooling device (400) is not limited thereto.
- thermoelectric cooling device (400) may be provided on at least one of the upper wall (110), the lower wall (120), the left wall (130), the right wall (140), and the rear wall (150).
- FIG. 6 is an exploded view of a thermoelectric cooling device according to one embodiment.
- thermoelectric cooling device (400) may include a thermoelectric module (500).
- thermoelectric element (530), heat sink (520), and cooling sink (570) described above can be assembled integrally to form a thermoelectric module (500). That is, the thermoelectric module (500) can include a thermoelectric element (530), a heat sink (520), a cooling sink (570), and a module plate (550).
- the module plate (550) can serve as a skeleton of the thermoelectric module (500).
- the module plate (550) can be formed of a resin material having low thermal conductivity.
- the module plate (550) can maintain a gap between the heat dissipation sink (520) and the cooling sink (570) and support the heat dissipation sink (520) and the cooling sink (570).
- the module plate (550) can be formed integrally with a fan case (650) to be described later. However, the module plate (550) can also be provided separately from the fan case (650).
- the module plate (550) may include a heat sink support (552) that supports a heat sink (520).
- the module plate (550) may include a module plate opening (551).
- the thermoelectric element (530) may be arranged inside the module plate opening (551).
- the vertical length of the module plate opening (551) may be greater than the vertical length of the thermoelectric element (530), and the thermoelectric element (530) may be arranged on the upper side of the module plate opening (551).
- the reason why the thermoelectric element (530) is arranged on the upper side inside the module plate opening (551) is because the heat generation amount of the thermoelectric element (530) is typically higher than the heat absorption amount, and the positioning of the thermoelectric element (530) on the upper side of the module plate opening (551) is advantageous for heat dissipation of the heating unit (531).
- the cooling sink (570) may include a cooling conductive portion (574) protruding from the cooling sink base (571) for contact with the cooling portion (532) of the thermoelectric element (530).
- the thermoelectric module (500) may include a module plate (550) and an element insulation material (540) that insulates the thermoelectric element (530).
- the element insulation material (540) may be placed in the module plate opening (551) to prevent a side of the thermoelectric element (530) from contacting the module plate (550).
- the element insulation material (540) includes an element insulation opening (541), and the thermoelectric element (530) may be accommodated in the element insulation opening (541).
- the thermoelectric module (500) may include a sink insulation (580) provided between the module plate (550) and the cooling sink (570).
- the sink insulation (580) may prevent heat from being transferred between the heat dissipation sink (520) and the cooling sink (570) through the module plate (550).
- the sink insulation (580) may include a sink insulation opening (581). However, the sink insulation (580) may be omitted, in which case the heat dissipation sink (520) may be supported on the upper surface of the module plate (550) and the cooling sink (570) may be supported on the lower surface of the module plate (550).
- the thermoelectric cooling device (400) may include a fan case (650) in which a heat dissipation fan (600) is installed and which guides the air blown by the heat dissipation fan (600).
- the fan case (650) may be formed integrally with the module plate (550) or may be provided separately.
- the fan case (650) may include a case bottom (650) on which a heat dissipation fan (600) is rotatably installed, and a case scroll part (670) extending upward from the edge of the case bottom (650) to guide air blown from the heat dissipation fan (600) toward a heat dissipation sink (520).
- the heat dissipation fan (600) is a centrifugal fan, and may be installed on the case bottom (650) so that the rotation axis (610) is perpendicular to the case bottom (650).
- the heat dissipation sink (520) may be positioned in one radial direction of the heat dissipation fan (600). With this structure, the overall vertical length of the thermoelectric cooling device (400) can be made compact.
- the case scroll portion (670) may be formed to surround the heat dissipation fan (600).
- the case scroll portion (670) may have a scroll portion opening (673) open toward the heat dissipation sink (520).
- the case scroll portion (670) may include a downstream end (671) along the rotational direction (R) of the heat dissipation fan (600) and an upstream end (672) along the rotational direction (R).
- the fan case (650) may include a case guide (680) provided to guide air flowing from the heat dissipation fan (600) to the area around the downstream end (671) of the case scroll section (670).
- the heat sink (520) may include a plurality of heat dissipation fins (525).
- the plurality of heat dissipation fins (525) may protrude from the upper surface (522) of the heat dissipation sink base (521).
- the plurality of heat dissipation fins (525) may protrude in a direction perpendicular to the upper surface (522) of the heat dissipation sink base (521).
- Heat dissipation channels may be formed between the plurality of heat dissipation fins (525).
- the heat dissipation fan (600) can blow air toward the heat dissipation sink (520), and the air flowing by the heat dissipation fan (600) can pass through the heat dissipation channels and exchange heat with a plurality of heat dissipation fins (525).
- the cooling sink (570) may include a plurality of cooling fins (575).
- the plurality of cooling fins (575) may be formed to extend in a direction parallel to the lower surface of the cooling sink base (571).
- Cooling channels may be formed between the plurality of cooling fins (575).
- Air flowing by the cooling fan (800) can pass through the cooling channels and exchange heat with a plurality of cooling fins (575).
- FIG. 7 is a block diagram illustrating an example of a configuration of a refrigerator according to one embodiment.
- a refrigerator (1) may include a defrost sensor (111), an internal sensor (112), an external sensor (113), a user interface (200), a communication interface (250), a first cooling device (450), a second cooling device (400), and a control unit (350).
- the defrost sensor (111) can measure the temperature of the evaporator (3).
- the defrost sensor (111) can transmit information about the temperature of the evaporator (3) to the control unit (350).
- a refrigerator (1) may include an internal sensor (112) for measuring the temperature of a storage compartment (11) and an external sensor (113) for measuring the ambient temperature outside the main body (100).
- the external sensor (113) may be referred to as a first temperature sensor, and the internal sensor (112) may be referred to as a second temperature sensor.
- the internal sensor (112) may include a first internal temperature sensor for measuring the temperature of the first storage chamber (11) and a second internal temperature sensor for measuring the temperature of the second storage chamber (12). According to various embodiments, the internal sensor (112) may further include a third internal temperature sensor for measuring the temperature of the third storage chamber (13).
- Information acquired from the internal sensor (112) can be transmitted to the control unit (350).
- the external sensor (113) may include an external temperature sensor for measuring the external temperature outside the main body (100).
- Information acquired from the external sensor (113) can be transmitted to the control unit (350).
- the refrigerator (1) may include a user interface (200).
- the user interface (200) can convert sensory information received from the user into an electrical signal.
- the user interface (200) may include a power button, an operation button, a menu selection button, a freezing/refrigeration setting button, a rapid cooling setting button, etc.
- a tact switch a push switch, a slide switch, a toggle switch, a micro switch, a touch switch, a touch pad, a touch screen, a jog dial, and/or a microphone.
- the user interface (200) can visually or audibly convey information related to the operation of the refrigerator (1) to the user.
- Information related to the operation of the refrigerator can be output through a screen, indicator, voice, etc.
- it can include a liquid crystal display (LCD) panel, a light emitting diode (LED) panel, a speaker, etc.
- LCD liquid crystal display
- LED light emitting diode
- the refrigerator (1) may include a communication interface (250) for communicating with an external device (e.g., a server, a user device) via wires and/or wirelessly.
- an external device e.g., a server, a user device
- the communication interface (250) may include at least one of a short-range communication module or a long-range communication module.
- the communication interface (250) can transmit data to an external device (e.g., a server, a user device, a temperature probe), or receive data from an external device.
- the communication interface (250) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between external devices, and the performance of communication through the established communication channel.
- the communication interface (250) can include a wireless communication module (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (e.g., a local area network (LAN) communication module, or a power line communication module).
- GNSS global navigation satellite system
- any of these communication modules may communicate with an external device via a first network (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)).
- a first network e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)
- a second network e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)
- a first network e.g., a short-range communication network
- the short-range wireless communication module may include, but is not limited to, a Bluetooth communication module, a BLE (Bluetooth Low Energy) communication module, a near field communication module, a WLAN (Wi-Fi) communication module, a Zigbee communication module, an infrared (IrDA, infrared Data Association) communication module, a WFD (Wi-Fi Direct) communication module, an UWB (ultrawideband) communication module, an Ant+ communication module, a microwave (uWave) communication module, etc.
- the remote communication module may include a communication module that performs various types of remote communication and may include a mobile communication interface.
- the mobile communication interface transmits and receives wireless signals with at least one of a base station, an external terminal, and a server on a mobile communication network.
- the communication interface (250) can communicate with external devices via a peripheral access point (AP).
- the access point (AP) can connect a local area network (LAN) to which the refrigerator (1) is connected to a wide area network (WAN) to which the server is connected.
- the refrigerator (1) can be connected to the server via the wide area network (WAN).
- the refrigerator (1) can receive various signals (e.g., weather information, remote instructions) from an external device (e.g., server, user device) through a communication interface (250).
- signals e.g., weather information, remote instructions
- an external device e.g., server, user device
- a communication interface 250
- the refrigerator (1) can transmit various signals to an external device through a communication interface (250).
- the refrigerator (1) may include a first cooling device (450) configured to supply cold air to a first storage compartment (11) and/or a second storage compartment (12).
- a first cooling device (450) configured to supply cold air to a first storage compartment (11) and/or a second storage compartment (12).
- the first cooling device (450) may include a compressor (2) and an evaporator fan (80).
- the compressor (2) can compress the refrigerant and supply the compressed refrigerant to a heat exchanger (e.g., a condenser (not shown), an expansion device (not shown), and an evaporator (3)).
- a heat exchanger e.g., a condenser (not shown), an expansion device (not shown), and an evaporator (3).
- the control unit (350) can control the temperature of the cold air generated in the evaporator (3) by controlling the compressor (2).
- the control unit (350) can control the compressor (2) so that the temperature measured by the internal sensor (112) maintains a predetermined target temperature.
- Controlling the compressor (2) may include controlling the on/off of the compressor (2) or controlling the operating frequency of the compressor (2).
- the control unit (350) can blow the cold air generated in the evaporator (3) to the second storage room (12) by controlling the evaporator fan (80).
- control unit (350) can drive the evaporator fan (80) while driving the compressor (2).
- control unit (350) can control the compressor (2) in cooling mode to maintain the temperature of the first storage chamber (11) at a first set temperature.
- control unit (350) may or may not drive the evaporator fan (80) when driving the compressor (2) to maintain the temperature of the first storage chamber (11) at the first set temperature.
- control unit (350) may not drive the evaporator fan (80) when driving the compressor (2) to maintain the temperature of the first storage chamber (11) at the first set temperature when the temperature of the second storage chamber (12) is lower than the second set temperature.
- control unit (350) may drive the evaporator fan (80) when driving the compressor (2) to maintain the temperature of the first storage chamber (11) at the first set temperature while the temperature of the second storage chamber (12) is higher than the second set temperature.
- control unit (350) can control the compressor (2) in cooling mode to maintain the temperature of the second storage chamber (12) at the set temperature of the second storage chamber (12) (hereinafter, “second set temperature”).
- control unit (350) may drive the evaporator fan (80) when driving the compressor (2) to maintain the temperature of the second storage chamber (12) at the second set temperature.
- the refrigerator (1) may include a defrost heater (3h) configured to defrost the evaporator (3).
- Defrosting the evaporator (3) may include removing frost formed on the evaporator (3).
- the evaporator heater (3h) may include an electric heater and/or a sheath heater, and may be provided around (e.g., on the lower side) the evaporator (3).
- the temperature of the evaporator (3) measured by the defrost sensor (111) drops below a predetermined temperature.
- the frost formed on the evaporator (3) melts, and accordingly, the temperature of the evaporator (3) measured by the defrost sensor (111) increases.
- the control unit (350) can drive the defrosting heater (3h) to defrost the evaporator (3), and can turn off the defrosting heater (3h) when it is determined that the defrosting of the evaporator (3) is complete.
- the refrigerator (1) may include a damper (61) that opens or closes a passage (78) for guiding cold air generated by the first cooling device (450) to the first storage chamber (11).
- the cold air generated by the first cooling device (450) may be cold air generated by the evaporator (3).
- the damper (61) may be replaced with various configurations that can open or close the flow path (78).
- the damper (61) may be an electronically controlled damper and/or a mechanically controlled damper.
- the damper (61) may be implemented in various forms, such as a rotary damper, a valve-type damper, or a sliding damper.
- the control unit (350) can control the damper (61) to drive the first cooling device (450) to lower the temperature of the first storage room (11) and to open the duct (78).
- Driving the first cooling device (450) may include driving the compressor (2).
- the control unit (350) can control the damper (61) to close the passage (78) in the defrost mode of the evaporator (3).
- the control unit (350) can control the damper (61) to close the passage (78) before driving the defrost heater (3h).
- the temperature of the first storage room (11) can be prevented from rising due to the driving of the defrost heater (3h) by closing the passage (78) that connects the space heated by the defrost heater (3h) and the first storage room (11).
- the control unit (350) can control the damper (61) to open the passage (78) to cool the first storage chamber (11) in the cooling mode.
- the control unit (350) can control the damper (61) to open the passage (78) after driving the compressor (2) or before driving the compressor (2).
- the control unit (350) can control the damper (61) to close the passage (78) to maintain the temperature of the first storage chamber (11) in the cooling mode. For example, when the temperature of the first storage chamber (11) is maintained at the first set temperature and the second storage chamber (12) needs to be cooled, the control unit (350) can control the damper (61) to close the passage (78) to prevent the temperature of the first storage chamber (11) from falling below the first set temperature.
- the cooling mode can be a mode for maintaining the temperature of the first storage chamber (11) at the first set temperature and maintaining the temperature of the second storage chamber (12) at the second set temperature.
- the control unit (350) can independently perform an operation to maintain the temperature of the first storage room (11) at the first set temperature in the cooling mode and an operation to maintain the temperature of the second storage room (12) at the second set temperature.
- the control unit (350) When the control unit (350) is performing the cooling mode, if the defrosting condition of the evaporator (3) is satisfied, the control unit (350) can start the defrosting mode of the evaporator (3).
- the defrosting mode of the evaporator (3) is a mode for removing frost formed on the evaporator (3), and may be a mode in which the defrosting heater (3h) is driven.
- the control unit (350) can drive the defrosting heater (3h) in the defrosting mode of the evaporator (3), and may not drive the compressor (2) even if the temperature of the first storage chamber (11) and/or the second storage chamber (12) rises.
- the refrigerator (1) can cool the storage compartment by supplying cold air generated by the first cooling device (450) to the storage compartment. Cooling the storage compartment (11) by supplying cold air generated by the first cooling device (450) to the storage compartment (11) is referred to as first cooling.
- the refrigerator (1) may include a second cooling device (400) configured to cool the first storage compartment (11).
- the second cooling device (400) may be the thermoelectric cooling device (400) described above.
- thermoelectric cooling device (400) may include a thermoelectric element (530), a heat dissipation fan (600), and/or a cooling fan (800).
- thermoelectric element (530) When power is supplied to the thermoelectric element (530), heat exchange can occur between the cooling sink (570) and the heat sink (520). For example, the thermoelectric element (530) can convert electrical energy into thermal energy, thereby causing a heat generation process in the heating element (531) and an absorption process in the cooling element (532).
- the control unit (350) can control the thermoelectric element (530). Controlling the thermoelectric element (530) may include controlling the on/off of the thermoelectric element (530). Controlling the thermoelectric element (530) may include controlling a drive circuit that supplies power to the thermoelectric element (530).
- Driving the thermoelectric element (530) may include supplying electrical energy to the thermoelectric element (530), i.e., supplying power to the thermoelectric element (530).
- Supplying power to the thermoelectric element (530) may include applying voltage and/or current to the thermoelectric element (530).
- Driving the thermoelectric element (530) may include PWM controlling the thermoelectric element (530).
- thermoelectric element (530) may include not supplying electrical energy to the thermoelectric element (530), i.e., not supplying power to the thermoelectric element (530). Not supplying power to the thermoelectric element (530) may include not applying voltage and/or current to the thermoelectric element (530). Not supplying power to the thermoelectric element (530) may include not PWM controlling the thermoelectric element (530).
- turning off the thermoelectric element (530) may not include intermittently not supplying power to the thermoelectric element (530) according to the on/off duty ratio while PWM controlling the thermoelectric element (530). That is, even if power is not intermittently supplied to the thermoelectric element (530) according to the on/off duty ratio while PWM controlling the thermoelectric element (530), there is no change in the fact that the thermoelectric element (530) is being driven.
- the heat sink (520) can contact the heating element (531) to absorb the heat of the heating element (531) and release the heat to the outside of the main body (100).
- the cooling sink (570) can cool the first storage room (11) by taking away the heat from the storage room (11) and transferring it to the cooling unit (532).
- control unit (350) may control the thermoelectric element (530) in the cooling mode to maintain the temperature of the first storage compartment (11) at a set temperature (hereinafter referred to as the “first set temperature”) of the first storage compartment (11).
- the set temperature of the first storage compartment (11) may be set via the user interface (200) of the refrigerator (1) or may be remotely set from an external device via the communication interface (250).
- the heat dissipation fan (600) guides air from outside the main body (100) to exchange heat with the heat dissipation sink (520), and can discharge the air that has exchanged heat with the heat dissipation sink (520) back to the outside of the main body (100).
- the control unit (350) can control the heat dissipation fan (600).
- Controlling the heat dissipation fan (600) may include controlling the fan motor of the heat dissipation fan (600).
- Controlling the heat dissipation fan (600) may include driving the heat dissipation fan (600) and turning off the heat dissipation fan (600).
- Driving the heat dissipation fan (600) may include rotating the heat dissipation fan (600) at a predetermined speed. Turning off the heat dissipation fan (600) may include stopping the rotation of the heat dissipation fan (600).
- the fan motor of the heat dissipation fan (600) may include a BLDC motor whose speed can be controlled.
- the heat dissipation fan (600) operates, the air that has exchanged heat with the heat dissipation sink (520) flows, allowing the heat dissipation sink (520) to quickly dissipate heat. As the heat dissipation sink (520) quickly dissipates heat, the heat generation action in the heating part (531) and the heat absorption action in the cooling part (532) can occur smoothly.
- the cooling fan (800) can suck in air inside the storage room (11), exchange heat with the cooling sink (570), and discharge the air that has exchanged heat with the cooling sink (570) back into the storage room (11).
- the control unit (350) can control the cooling fan (800).
- Controlling the cooling fan (800) may include controlling the fan motor of the cooling fan (800).
- Controlling the cooling fan (800) may include driving the cooling fan (800) and turning off the cooling fan (800).
- Driving the cooling fan (800) may include rotating the cooling fan (800) at a predetermined speed. Turning off the cooling fan (800) may include stopping the rotation of the cooling fan (800).
- the fan motor of the cooling fan (800) may include a BLDC motor whose speed can be controlled.
- the cooling fan (800) operates, the air that has exchanged heat with the cooling sink (570) flows, thereby rapidly cooling the interior of the storage chamber (11). As the air that has exchanged heat with the cooling sink (570) flows, the heat generation action in the heating unit (531) and the heat absorption action in the cooling unit (532) can occur smoothly.
- control unit (350) can operate the cooling fan (800) and the heat dissipation fan (600) based on the thermoelectric element (530) being turned on.
- the control unit (350) can turn off the cooling fan (800) and the heat dissipation fan (600) based on the thermoelectric element (530) being turned off.
- control unit (350) may drive the cooling fan (800) and the heat dissipation fan (600) based on the fact that the thermoelectric element (530) is turned off in the defrosting mode of the thermoelectric element (530).
- the defrosting mode of the thermoelectric element (530) may be a mode in which the heat dissipation fan (600) and the cooling fan (800) are driven while the thermoelectric element (530) is not driven, in order to defrost the thermoelectric element (530). That is, the control unit (350) may turn off the thermoelectric element (530) and drive the cooling fan (800) and the heat dissipation fan (600) in order to defrost the thermoelectric element (530).
- the refrigerator (1) can cool the storage compartment by supplying the cold air generated by the second cooling device (400) to the storage compartment. Cooling the storage compartment (11) by supplying the cold air generated by the second cooling device (400) to the storage compartment (11) is referred to as second cooling.
- the control unit (350) may include at least one processor (351) that controls the operation of the refrigerator (1) and at least one memory (352) that stores a program and data for controlling the operation of the refrigerator (1).
- At least one memory (352) can store data required for various embodiments.
- the memory (352) may be implemented as a memory embedded in the refrigerator (1) or as a memory detachable from the refrigerator (1) depending on the purpose of data storage.
- data for operating the refrigerator (1) may be stored in a memory embedded in the refrigerator (1)
- data for expanding the functions of the refrigerator (1) may be stored in a memory detachable from the refrigerator (1).
- memory embedded in the refrigerator (1) it may be implemented as at least one of volatile memory (e.g., DRAM (dynamic RAM), SRAM (static RAM), or SDRAM (synchronous dynamic RAM)), non-volatile memory (e.g., OTPROM (one time programmable ROM), PROM (programmable ROM), EPROM (erasable and programmable ROM), EEPROM (electrically erasable and programmable ROM), mask ROM, flash ROM, flash memory (e.g., NAND flash or NOR flash), hard drive, or solid state drive (SSD)).
- volatile memory e.g., DRAM (dynamic RAM), SRAM (static RAM), or SDRAM (synchronous dynamic RAM)
- non-volatile memory e.g., OTPROM (one time programmable ROM), PROM (programmable ROM), EPROM (erasable and programmable ROM), EEPROM (electrically erasable and programmable ROM), mask ROM, flash ROM, flash memory (e.g., NAND
- memory that can be attached or detached to the refrigerator (1)
- it may be implemented in the form of a memory card (e.g., CF (compact flash), SD (secure digital), Micro-SD (micro secure digital), Mini-SD (mini secure digital), xD (extreme digital), MMC (multi-media card)), external memory that can be connected to a USB port (e.g., USB memory), etc.
- CF compact flash
- SD secure digital
- Micro-SD micro secure digital
- Mini-SD mini secure digital
- xD extreme digital
- MMC multi-media card
- At least one processor (351) controls the overall operation of the refrigerator (1).
- at least one processor (351) is connected to each component of the refrigerator (1) (defrost sensor (111), internal sensor (112), external sensor (113), user interface (200), communication interface (250), first cooling device (450), second cooling device (400), defrost heater (3h), and/or damper (61), etc.) to control the overall operation of the refrigerator (1).
- at least one processor (351) is electrically connected to a memory (352) to control the overall operation of the refrigerator (1).
- the processor (351) may be composed of one or more processors.
- At least one processor (351) can perform operations of the refrigerator (1) according to various embodiments by executing at least one instruction stored in the memory (352).
- At least one processor (351) may include one or more of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an APU (Accelerated Processing Unit), an MIC (Many Integrated Core), a DSP (Digital Signal Processor), an NPU (Neural Processing Unit), a hardware accelerator, or a machine learning accelerator. At least one processor (351) may control one or any combination of other components of the refrigerator (1), and may perform operations related to communication or data processing. At least one processor (351) may execute at least one program or instruction stored in the memory (352). For example, at least one processor (351) may perform a method according to at least one embodiment of the present disclosure by executing at least one instruction stored in the memory (352).
- a refrigerator (1) includes a first cooling device (450) and a second cooling device (400) for cooling a storage compartment (11), and can cool the storage compartment (11) using at least one of the first cooling device (450) and the second cooling device (400). For example, only the first cooling by the first cooling device (450) may be performed for cooling the storage compartment (11), or both the first cooling by the first cooling device (450) and the second cooling by the second cooling device (400) may be performed simultaneously.
- a method for cooling the storage compartment (11) in the refrigerator (1) may include a first method for cooling the storage compartment (11) by performing only the first cooling, and a second method for cooling the storage compartment (11) by performing both the first cooling and the second cooling.
- the refrigerator (1) can supply cold air to the storage compartment (11) in an appropriate manner depending on external and internal conditions.
- first cooling and second cooling can be performed together based on the outside temperature being within a preset temperature range.
- only first cooling can be performed.
- Figure 8 illustrates an example of a flowchart of a method for controlling a refrigerator according to one embodiment.
- control unit (350) can determine whether an overload condition or a rapid cooling condition is satisfied (1000).
- the overload condition may be an overload condition of the storage room (11, 12, 13).
- the overload condition may be a temperature condition in that it is a condition related to the temperature of the storage room (11, 12, 13).
- the overload condition may be an overload condition of the storage room (11).
- the overload condition of the storage room (11) may include the temperature of the storage room (11) being higher than a set temperature of the storage room (11) by a predetermined temperature or more.
- the control unit (350) can determine that the overload condition is satisfied based on the temperature of the storage room (11) being higher than the overload temperature, which is a predetermined temperature higher than the set temperature of the storage room (11).
- Rapid cooling conditions may include receiving a rapid cooling command via the user interface (200).
- the control unit (350) can determine that the rapid cooling condition is satisfied based on the rapid cooling command received through the user interface (200).
- the rapid cooling conditions may include initial cooling conditions.
- the initial cooling conditions may be conditions related to the initial start-up of the refrigerator (1).
- the initial cooling conditions may be conditions related to the temperature of the storage compartment (11) and the temperature of the evaporator (3).
- the control unit (350) can determine that the initial cooling condition is satisfied if the temperature of the storage room (11) is higher than the first temperature and the temperature of the evaporator (3) is higher than the second temperature.
- the control unit (350) can determine that the rapid cooling condition is satisfied based on the initial cooling condition being satisfied.
- the control unit (350) may perform only the first cooling (1300) in response to the overload condition or rapid cooling condition not being satisfied (1000, No). Performing only the first cooling may include driving only the compressor (2) among the compressor (2) and the thermoelectric element (530).
- the control unit (350) can determine whether the outside temperature condition is satisfied (1100) in response to the overload condition or rapid cooling condition being satisfied (1000, example).
- the outside temperature condition may be a condition related to the temperature range of the outside temperature of the refrigerator.
- the outside temperature condition may include the outside temperature being within a preset temperature range.
- the control unit (350) can determine that the outside temperature condition is satisfied based on the outside temperature detected through the external sensor (113) being within a preset temperature range.
- the control unit (350) can perform first cooling and second cooling together (1200) in response to the outside temperature condition being satisfied (1100, example).
- Performing the first cooling and the second cooling together may include driving the compressor (2) and the thermoelectric element (530) together.
- the control unit (350) can perform only the first cooling in response to the outside temperature condition not being satisfied (1100, no) (1300).
- Conventional refrigerators utilize only one cooling method: primary or secondary cooling.
- Primary cooling uses a smaller compressor for greater efficiency, but to accommodate peak loads, conventional refrigerators employ larger compressors.
- Secondary cooling can be implemented in smaller units, but its efficiency is lower than primary cooling, so it's only used in small refrigerators like wine cellars.
- the first cooling method's maximum cooling capacity is determined by the compressor displacement, a compressor with a large displacement must be used in a high-load range. In this case, the use of a high-displacement compressor reduces efficiency.
- the second cooling method is inefficient for application to general refrigerators because the efficiency of the thermoelectric element itself is lower than that of the first cooling method.
- a refrigerator (1) according to one embodiment of the present disclosure is a hybrid refrigerator that can compensate for the shortcomings of the first cooling method by using two cooling sources (a compressor and a thermoelectric element) in combination to cool the refrigerator (1).
- a refrigerator (1) can use the first cooling method and the second cooling method in combination, and can implement the first cooling method with a low-displacement compressor.
- a refrigerator (1) according to one embodiment of the present disclosure can cool a storage room using only the first cooling in a low-load region, thereby enabling high-efficiency operation even with a low-displacement compressor.
- a refrigerator (1) can respond to overload or required load by performing first cooling and second cooling together in an overload condition or a condition requiring instantaneous high cooling capacity. That is, in a low-load area, by performing first cooling, the efficiency of the first cooling method can be maximized by using a low-displacement compressor, and in an overload area or a rapid cooling area, by performing first cooling and second cooling together, the disadvantage of the first cooling method using a low-displacement compressor, which is a decrease in load response capability, can be supplemented by using second cooling together.
- FIG. 9 illustrates an operation of cooling a storage compartment according to an outside temperature in a control method of a refrigerator according to one embodiment.
- control unit (350) can detect the outside temperature of the refrigerator (1) through the external sensor (113) (2000).
- the control unit (350) can determine whether the outside temperature is above a predetermined temperature (2100).
- the predetermined temperature may include the upper limit of the ambient temperature range at which the thermoelectric element (530) of the second cooling device (400) can generate the optimal Peltier effect. Since the thermoelectric element (530) operates based on the temperature difference between the cooling side and the heat dissipation side, if the ambient temperature is too high, the heat dissipation side may not be able to effectively dissipate heat, resulting in a decrease in cooling efficiency.
- the predetermined temperature may be 40°C.
- the control unit (350) can perform only the first cooling (2200) in response to the outside temperature being higher than a predetermined temperature (2100, example). For example, if the outside temperature is higher than 40°C, only the first cooling can be performed.
- the control unit (350) can determine whether the outside temperature is within a preset temperature range (2300) in response to the outside temperature not being higher than a predetermined temperature (2100, no).
- the preset temperature range may include an ambient temperature range in which the thermoelectric element (530) can exhibit the optimal Peltier effect.
- the preset temperature range may be 22°C to 39°C.
- the control unit (350) can perform only the first cooling in response to the outside temperature not being within the preset temperature range (2300, No). For example, if the outside temperature is 21°C or lower, only the first cooling can be performed.
- the control unit (350) may perform only the first cooling or perform both the first cooling and the second cooling in response to the outside temperature being within a preset temperature range (2300, example) (2400). For example, if the outside temperature is between 22°C and 39°C and an overload condition related to the temperature of the storage room is satisfied, the first cooling and the second cooling may be performed together. If the overload condition is not satisfied even when the outside temperature is between 22°C and 39°C, only the first cooling may be performed.
- the second cooling may be terminated based on the satisfaction of a subcooling condition of the storage compartment.
- the subcooling condition may include detecting a temperature higher than the subcooling temperature after continuously detecting a temperature below the subcooling temperature related to the set temperature of the storage compartment for a predetermined period of time.
- the second cooling may be terminated until the refrigerator off temperature is detected to be higher than the refrigerator off temperature (e.g., the refrigerator set temperature - 1.0°C) after continuously detecting a temperature below -1.0°C for 10 minutes.
- the second cooling may be terminated under conditions of excessive condensate generation, such as when an error in the cooling load (fan, compressor, etc.) occurs continuously for a predetermined period of time, or when the door of the storage room is opened continuously for a predetermined period of time until the door is detected to be closed.
- an error in the cooling load fan, compressor, etc.
- FIG. 10 illustrates an operation of cooling a storage compartment when the outside temperature is in a first temperature range in a control method of a refrigerator according to one embodiment.
- control unit (350) can detect the temperature of the storage room (11) through the internal sensor (112) when the outside temperature is in the first temperature range (3000).
- the first temperature range may be 34°C to 39°C.
- the control unit (350) can detect the temperature of the storage room (11) when the outside temperature is within 34°C to 39°C.
- the control unit (350) can determine whether an overload condition related to the temperature of the storage room (11) is satisfied (3100).
- the control unit (350) can perform first cooling and second cooling together (3200) based on whether an overload condition related to the temperature of the storage room (11) is satisfied (3100, example).
- the control unit (350) can perform only the first cooling (3300) based on the fact that the overload condition related to the temperature of the storage room (11) is not satisfied (3100, No).
- the overload condition related to the temperature of the storage room (11) may include a first start condition and a first end condition corresponding to a first temperature range.
- the overload condition related to the temperature of the storage room (11) may include a condition in which the first end condition is satisfied after the first start condition is satisfied.
- the first starting condition may include that the temperature of the storage room (11) is higher than or equal to a first starting temperature (T1 ON) related to the set temperature of the storage room (11).
- the first starting temperature (T1 ON) related to the set temperature of the storage room (11) may be a temperature determined based on the storage room on-temperature temperature (for example, the storage room set temperature + 1°C).
- T1 ON may be the storage room on-temperature temperature + 4°C.
- the first termination condition may include that the temperature of the storage room (11) is lower than or equal to a first termination temperature (T1 OFF) related to the set temperature of the storage room (11).
- the first termination temperature (T1 OFF) related to the set temperature of the storage room (11) may be a temperature determined based on the storage room temperature (for example, the storage room set temperature + 1°C).
- T1 OFF may be the storage room temperature - 2°C.
- the control unit (350) can start the second cooling when the first start condition is satisfied, and can end the second cooling when the first end condition is satisfied. For example, if the temperature of the storage room (11) is equal to or higher than the storage room temperature + 4°C, the second cooling can be started to be performed together with the first cooling that is being performed, and if the temperature of the storage room (11) is quickly lowered to or lower than the storage room temperature - 2°C due to the additional performance of the second cooling, the second cooling can be ended and only the first cooling can be performed.
- FIG. 11 illustrates an operation of cooling a storage compartment when the outside temperature is in a second temperature range in a control method of a refrigerator according to one embodiment.
- control unit (350) can detect the temperature of the storage room (11) through the internal sensor (112) when the outside temperature is in the second temperature range (4000).
- the second temperature range may be 22°C to 33°C.
- the control unit (350) can detect the temperature of the storage room (11) when the outside temperature is within 22°C to 33°C.
- the control unit (350) can determine whether an overload condition related to the temperature of the storage room (11) is satisfied (4100).
- the control unit (350) can perform the first cooling and the second cooling together (4200) based on whether an overload condition related to the temperature of the storage room (11) is satisfied (4100, example).
- the control unit (350) can perform only the first cooling (4300) based on the fact that the overload condition related to the temperature of the storage room (11) is not satisfied (4100, No).
- the overload condition related to the temperature of the storage room (11) may include a second start condition and a second end condition corresponding to a second temperature range.
- the overload condition related to the temperature of the storage room (11) may include a condition in which the second end condition is satisfied after the second start condition is satisfied.
- the second starting condition may include that the temperature of the storage compartment (11) is higher than or equal to a second starting temperature (T2 ON) related to the set temperature of the storage compartment (11).
- the second starting temperature (T2 ON) related to the set temperature of the storage compartment (11) may be a temperature determined based on the storage compartment temperature (for example, the storage compartment set temperature + 1°C).
- T2 ON may be the storage compartment temperature + 6°C.
- T2 ON may be the storage compartment temperature + 10°C.
- the second termination condition may include that the temperature of the storage room (11) is lower than or equal to a second termination temperature (T2 OFF) related to the set temperature of the storage room (11).
- the second termination temperature (T2 OFF) related to the set temperature of the storage room (11) may be a temperature determined based on the storage room on-temperature temperature (for example, the storage room set temperature + 1°C).
- T2 OFF may be the storage room on-temperature temperature.
- the control unit (350) can start the second cooling when the second start condition is satisfied, and can end the second cooling when the second end condition is satisfied. For example, if the temperature of the storage room (11) is equal to or higher than the storage room temperature + 6°C, the second cooling can be started to be performed together with the first cooling that is being performed, and if the temperature of the storage room (11) is quickly lowered to below the storage room temperature due to the additional performance of the second cooling, the second cooling can be ended and only the first cooling can be performed.
- the overload condition related to the storage room temperature in which the first cooling and the second cooling are performed simultaneously may vary depending on the outside temperature.
- the second cooling can be started to be performed together with the first cooling that is already being performed. If the first end condition (storage room temperature - 2°C or lower) is satisfied, the second cooling can be terminated and only the first cooling can be performed.
- the second cooling can be started to be performed together with the first cooling that is already being performed. If the second end condition (storage room temperature or lower) is satisfied, the second cooling can be terminated and only the first cooling can be performed.
- the start time of the second cooling is relatively advanced and the end time is relatively delayed, allowing the second cooling to begin quickly and last longer, effectively responding to overload. Furthermore, in temperature ranges where the outside temperature is low, the start time of the second cooling is relatively delayed and the end time is relatively advanced, allowing the second cooling to begin later and last shorter, effectively responding to overload.
- Fig. 12 illustrates an example of an operation for cooling a storage room under rapid cooling conditions in a control method of a refrigerator according to one embodiment.
- control unit (350) can detect the outside temperature of the refrigerator (1) through the external sensor (113) (5000).
- the control unit (350) can determine whether the outside temperature is above a predetermined temperature (5100).
- the predetermined temperature may be 40°C.
- the control unit (350) can perform only the first cooling (5200) in response to the outside temperature being higher than a predetermined temperature (5100, example). For example, if the outside temperature is higher than 40°C, only the first cooling can be performed.
- the control unit (350) can determine whether a rapid cooling command is received through the user interface (200) in response to the outside temperature not being higher than a predetermined temperature (5100, No) (5300). If a rapid cooling command is received, it can be determined that the rapid cooling condition is satisfied.
- the control unit (350) can perform only the first cooling (5200) based on the fact that a rapid cooling command is not received (5300, No) via the user interface (200).
- the control unit (350) may perform the first cooling and the second cooling together (5400) based on the receipt of a rapid cooling command (5300, example) through the user interface (200). At this time, the control unit (350) may perform the first cooling and the second cooling together regardless of whether an overload condition related to the temperature of the storage room is satisfied based on the receipt of the rapid cooling command.
- the control unit (350) can detect the temperature of the storage room (11) through the internal sensor (112) (5500).
- the control unit (350) can determine whether the temperature of the storage room (11) satisfies the third termination condition (T3 OFF or lower) (5600).
- T3 OFF is the termination temperature for terminating the second cooling performed by the rapid cooling command, and may be the temperature at which the temperature of the storage room (11) first reaches the storage room off temperature after performing the first cooling and the second cooling together.
- the control unit (350) can perform the first cooling and the second cooling together (5400) in response to the third termination condition (T3 OFF or lower) not being satisfied (5600, No).
- the control unit (350) can terminate the second cooling and perform only the first cooling in response to the third termination condition (T3 OFF or lower) being satisfied (5600, example) (5200).
- control unit (350) can only perform the first cooling even if a rapid cooling command is received when the outside temperature is above a predetermined temperature. If the outside temperature is above 40°C, cold air according to the second cooling is not normally generated, so only the first cooling can be performed regardless of whether a rapid cooling command is received.
- Fig. 13 illustrates another example of an operation for cooling a storage compartment under rapid cooling conditions in a control method of a refrigerator according to one embodiment.
- control unit (350) can determine whether the initial cooling conditions related to the storage room temperature and the evaporator temperature are satisfied (6000).
- the initial cooling conditions may be conditions related to the initial operation of the refrigerator (1).
- the initial cooling conditions may be conditions related to the temperature of the storage compartment (12), which is a freezer compartment, and the temperature of the evaporator (3).
- the control unit (350) can determine that the initial cooling condition is satisfied if the temperature of the freezer (12) is higher than the first temperature and the temperature of the evaporator (3) is higher than the second temperature. For example, if the internal temperature of the freezer (12) is higher than 10°C and the temperature of the evaporator (3) is higher than 10°C after the refrigerator (1) is turned on, it can be determined that the initial startup has occurred and the initial cooling condition is satisfied. If the initial cooling condition is satisfied, it can be determined that the rapid cooling condition is satisfied.
- the control unit (350) can perform only the first cooling (6100) in response to the initial cooling condition being satisfied (6000, example). For example, only the first cooling can be performed for 5 minutes after the refrigerator (1) is turned on. During this 5-minute period, temperature information can be collected through each temperature sensor of the refrigerator (1).
- the control unit (350) can determine whether a predetermined time has elapsed since the first cooling was performed (6200). For example, it can determine whether 5 minutes have elapsed.
- the control unit (350) can detect the outside temperature using the external sensor (113) (6300) when a predetermined time has elapsed (6200, for example).
- the control unit (350) can determine whether the outside temperature is higher than a predetermined temperature (6400).
- the control unit (350) can perform only the first cooling (6500) in response to the outside temperature being higher than a predetermined temperature (6400, example). For example, if the outside temperature is higher than 40°C, only the first cooling can be performed.
- the control unit (350) can perform the first cooling and the second cooling simultaneously (6600) in response to the outside temperature not being higher than a predetermined temperature (6400, No). For example, if the outside temperature is lower than 40°C, the first cooling and the second cooling can be performed simultaneously. By performing the first cooling and the second cooling simultaneously, the storage room (11) can be quickly cooled from the initial cooling condition.
- the control unit (350) can detect the temperature of the storage room (11) through the internal sensor (112) (6700).
- the control unit (350) can determine whether the temperature of the storage room (11) satisfies the fourth termination condition (T4 OFF or lower) (6800).
- T4 OFF is the termination temperature for terminating the second cooling performed under the initial cooling condition, and may be the storage room off temperature + 4°C.
- the control unit (350) can maintain the performance of the first cooling and the second cooling in response to the fourth termination condition (T4 OFF or lower) not being satisfied (6800, No).
- the control unit (350) can terminate the second cooling and perform only the first cooling in response to the satisfaction of the fourth termination condition (T4 OFF or lower) (5600, No) (6900).
- control unit (350) can perform only the first cooling even if the initial cooling condition is satisfied if the outside temperature is higher than a predetermined temperature.
- the first cooling method using a compressor and the second cooling method using a thermoelectric element can be used in combination, so that in a low-load area, the storage room can be cooled by the first cooling method alone, thereby enabling high-efficiency operation even with a low-displacement compressor, and in an overload condition or a rapid cooling condition, when the outside temperature is in a preset temperature range, the storage room can be cooled by the first cooling and the second cooling, thereby enabling response to an overload or a required load.
- the efficiency of the first cooling method can be maximized by using a low-displacement compressor by performing the first cooling, and in an overload area or a rapid cooling area, the first cooling and the second cooling are performed together, thereby complementing the disadvantage of the first cooling method using a low-displacement compressor, which is a reduced load response capability, by using the second cooling together.
- a refrigerator (1) comprises: a main body (100) forming a storage compartment (11); a first cooling device (450) including a compressor (2) and an evaporator (3) and cooling the storage compartment (11); a second cooling device (400) including a thermoelectric element (530) and cooling the storage compartment (11); a first temperature sensor (113) detecting an external temperature outside the main body; a second temperature sensor (112) detecting a temperature of the storage compartment; And in an overload condition where the temperature of the storage room (11) is higher than the set temperature of the storage room (11) by a predetermined temperature or more, the first cooling for cooling the storage room (11) by the first cooling device (450) and the second cooling for cooling the storage room (11) by the second cooling device (400) are performed together based on the outside temperature being in a preset temperature range, and at least one processor (351) for performing only the first cooling based on the outside temperature not being in a preset temperature range.
- the preset temperature range may include a first temperature range and a second temperature range lower than the first temperature range.
- the overload condition may include a first start condition and a second end condition corresponding to the first temperature range, and a second start condition and a second end condition corresponding to the second temperature range.
- At least one processor (351) may start second cooling when the first start condition is satisfied and end second cooling when the first end condition is satisfied if the outside temperature corresponds to the first temperature range, and may start second cooling when the second start condition is satisfied and end second cooling when the second end condition is satisfied if the outside temperature corresponds to the second temperature range.
- the first starting condition may include that the temperature of the storage room (11) is higher than or equal to a first temperature related to the set temperature of the storage room (11), and the second starting condition may include that the temperature of the storage room (11) is higher than the first temperature and higher than or equal to a second temperature related to the set temperature of the storage room (11).
- the first termination condition may include that the temperature of the storage room (11) is lower than or equal to a first temperature related to the set temperature of the storage room (11), and the second termination condition may include that the temperature of the storage room is higher than the first temperature and lower than or equal to a second temperature related to the set temperature of the storage room (11).
- At least one processor (351) can perform the first cooling and the second cooling together regardless of whether the overload condition is satisfied based on a rapid cooling command received through the user interface (200).
- At least one processor (351) can perform only the first cooling even if a rapid cooling command is received when the outside temperature is higher than a predetermined temperature.
- At least one processor (351) can determine whether the initial cooling condition is satisfied based on the temperature of the storage chamber (12) and the temperature of the evaporator (3), and perform the first cooling and the second cooling together based on the initial cooling condition being satisfied.
- At least one processor (351) may perform only the first cooling for a preset time from the time when the initial cooling condition is satisfied, start the second cooling to be performed simultaneously with the first cooling being performed based on the elapsed preset time, and end the second cooling based on the temperature of the storage room (11) being reduced to a preset temperature related to the set temperature of the storage room (11).
- At least one processor (351) can perform only the first cooling even if the initial cooling condition is satisfied when the outside temperature is higher than a predetermined temperature.
- a control method of a refrigerator (1) includes: a first cooling device (450) including a compressor (2) and an evaporator (3) and cooling a storage compartment (11); a second cooling device (400) including a thermoelectric element (530) and cooling the storage compartment (11);
- first cooling for cooling the storage compartment (11) by the first cooling device (450) and second cooling for cooling the storage compartment (11) by the second cooling device (400) may be performed together based on the fact that the outside temperature of the refrigerator is in a preset temperature range, and only the first cooling may be performed based on the fact that the outside temperature is not in a preset temperature range.
- the preset temperature range may include a first temperature range and a second temperature range lower than the first temperature range.
- the overload condition may include a first start condition and a second end condition corresponding to the first temperature range, and a second start condition and a second end condition corresponding to the second temperature range.
- Performing the first cooling and the second cooling together may include starting the second cooling when the first start condition is satisfied when the outside temperature corresponds to the first temperature range, and ending the second cooling when the first end condition is satisfied when the outside temperature corresponds to the second temperature range, starting the second cooling when the second start condition is satisfied, and ending the second cooling when the second end condition is satisfied.
- the first starting condition may include that the temperature of the storage room (11) is higher than or equal to a first temperature related to the set temperature of the storage room (11), and the second starting condition may include that the temperature of the storage room (11) is higher than the first temperature and higher than or equal to a second temperature related to the set temperature of the storage room (11).
- the first termination condition may include that the temperature of the storage room (11) is lower than or equal to a first temperature related to the set temperature of the storage room (11), and the second termination condition may include that the temperature of the storage room (11) is higher than the first temperature and lower than or equal to a second temperature related to the set temperature of the storage room (11).
- It may further include determining whether the initial cooling condition is satisfied based on the temperature of the storage room (12) and the temperature of the evaporator (3), and performing the first cooling and the second cooling together based on the initial cooling condition being satisfied.
- Performing the first cooling and the second cooling together may include performing only the first cooling for a preset time from the time when the initial cooling condition is satisfied, starting the second cooling to be performed simultaneously with the first cooling being performed based on the elapsed time of the preset time, and terminating the second cooling based on the temperature of the storage chamber (11) being reduced to a preset temperature related to the set temperature of the storage chamber (11).
- the disclosed embodiments may be implemented in the form of a recording medium storing computer-executable instructions.
- the instructions may be stored in the form of program code, and when executed by a processor, may generate program modules to perform the operations of the disclosed embodiments.
- the recording medium may be implemented as a computer-readable recording medium.
- Computer-readable storage media include all types of storage media that store instructions that can be deciphered by a computer. Examples include read-only memory (ROM), random access memory (RAM), magnetic tape, magnetic disks, flash memory, and optical data storage devices.
- ROM read-only memory
- RAM random access memory
- magnetic tape magnetic tape
- magnetic disks magnetic disks
- flash memory optical data storage devices
- a computer-readable recording medium may be provided in the form of a non-transitory storage medium.
- non-transitory storage medium simply means a tangible device that does not contain signals (e.g., electromagnetic waves). This term does not distinguish between cases where data is permanently stored in the storage medium and cases where data is temporarily stored.
- a “non-transitory storage medium” may include a buffer in which data is temporarily stored.
- the method according to various embodiments disclosed in the present document may be provided as included in a computer program product.
- the computer program product may be traded as a product between a seller and a buyer.
- the computer program product may be distributed in the form of a machine-readable recording medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play StoreTM) or directly between two user devices (e.g., smartphones).
- a machine-readable recording medium e.g., compact disc read only memory (CD-ROM)
- CD-ROM compact disc read only memory
- an application store e.g., Play StoreTM
- smartphones directly between two user devices
- At least a portion of the computer program product may be temporarily stored or temporarily generated on a machine-readable recording medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.
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Abstract
Description
본 개시는 저장실을 냉각하기 위한 열전소자와 압축기를 갖는 냉장고 및 냉장고의 제어방법에 관한 것이다.The present disclosure relates to a refrigerator having a thermoelectric element and a compressor for cooling a storage room and a method for controlling the refrigerator.
냉장고는 저장실을 갖는 본체와, 저장실에 냉기를 공급하도록 마련되는 냉기 공급 장치를 구비하여 신선하게 보관하는 가전 기기이다.A refrigerator is a home appliance that has a main body with a storage compartment and a cold air supply device that supplies cold air to the storage compartment to keep food fresh.
냉장고의 냉기 공급 장치로 펠티어 효과를 통해 발열 및 냉각 작용을 일으키는 열전 냉각 장치가 이용될 수 있다. 열전 냉각 장치는 열전소자를 포함할 수 있다. 열전소자는 일 측에 형성된 발열부와 반대 측에 형성된 냉각부를 갖고, 열전소자에 전류가 가해지면 발열부에서 발열 작용이 발생하고 냉각부에서 흡열 작용이 발생할 수 있다.A thermoelectric cooling device that generates heat and cooling through the Peltier effect can be used as a cooling device in a refrigerator. The thermoelectric cooling device may include a thermoelectric element. The thermoelectric element has a heating element formed on one side and a cooling element formed on the opposite side. When current is applied to the thermoelectric element, heat generation occurs in the heating element and heat absorption occurs in the cooling element.
열전 냉각 장치는 열전 냉각 장치를 통한 저장실 냉각의 효율을 증대시키기 위해 방열 싱크, 냉각 싱크, 방열팬, 냉각팬, 방열 덕트 및 냉각 덕트 등을 구비할 수 있다.The thermoelectric cooling device may be equipped with a heat sink, a cooling sink, a heat sink fan, a cooling fan, a heat duct, and a cooling duct to increase the efficiency of cooling the storage room through the thermoelectric cooling device.
본 개시의 일 측면은, 과부하 조건 또는 급속 냉각 조건에서 저장실을 보다 효율적으로 냉각시킬 수 있는 냉장고 및 냉장고의 제어방법을 제공한다.One aspect of the present disclosure provides a refrigerator and a method of controlling the refrigerator that can cool a storage room more efficiently under overload conditions or rapid cooling conditions.
본 문서에서 이루고자 하는 기술적 과제는 이상에서 언급한 기술적 과제로 제한되지 않으며, 언급되지 않은 또 다른 기술적 과제들은 아래의 기재로부터 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 명확하게 이해될 수 있을 것이다.The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by a person having ordinary skill in the technical field to which the present invention belongs from the description below.
본 개시의 일 실시예에 따른 냉장고는, 저장실을 형성하는 본체; 압축기와 증발기를 포함하고, 상기 저장실을 냉각시키는 제1 냉각장치; 열전소자를 포함하고, 상기 저장실을 냉각시키는 제2 냉각장치; 상기 본체 외부의 외기온도를 감지하는 제1 온도센서; 상기 저장실의 온도를 감지하는 제2 온도센서; 및 상기 저장실의 온도가 상기 저장실의 설정온도보다 소정의 온도 이상 높은 과부하 조건에서는 상기 외기온도가 미리 설정된 온도구간인 것에 기초하여 상기 제1 냉각장치에 의해 상기 저장실을 냉각시키는 제1 냉각 및 상기 제2 냉각장치에 의해 상기 저장실을 냉각시키는 제2 냉각을 함께 수행하고, 상기 외기온도가 상기 미리 설정된 온도구간이 아닌 것에 기초하여 상기 제1 냉각만을 수행하는 적어도 하나의 프로세서;를 포함할 수 있다.According to one embodiment of the present disclosure, a refrigerator may include: a main body forming a storage compartment; a first cooling device including a compressor and an evaporator and cooling the storage compartment; a second cooling device including a thermoelectric element and cooling the storage compartment; a first temperature sensor detecting an outside temperature outside the main body; a second temperature sensor detecting a temperature of the storage compartment; and at least one processor configured to simultaneously perform first cooling by cooling the storage compartment by the first cooling device based on whether the outside temperature is within a preset temperature range and second cooling by cooling the storage compartment by the second cooling device under an overload condition in which the temperature of the storage compartment is higher than a set temperature of the storage compartment by a predetermined temperature or more, and to perform only the first cooling based on whether the outside temperature is not within the preset temperature range.
본 개시의 일 실시예에 따른 냉장고의 제어방법은, 압축기와 증발기를 포함하고 저장실을 냉각시키는 제1 냉각장치; 열전소자를 포함하고 상기 저장실을 냉각시키는 제2 냉각장치; 를 포함하는 냉장고의 제어방법에 있어서, 상기 저장실의 온도가 상기 저장실의 설정온도보다 소정의 온도 이상 높은 과부하 조건에서는 상기 냉장고의 외기온도가 미리 설정된 온도구간인 것에 기초하여 상기 제1 냉각장치에 의해 상기 저장실을 냉각시키는 제1 냉각 및 상기 제2 냉각장치에 의해 상기 저장실을 냉각시키는 제2 냉각을 함께 수행하고, 상기 외기온도가 상기 미리 설정된 온도구간이 아닌 것에 기초하여 상기 제1 냉각만을 수행하는 것을 포함할 수 있다.According to one embodiment of the present disclosure, a control method for a refrigerator includes: a first cooling device including a compressor and an evaporator and cooling a storage compartment; a second cooling device including a thermoelectric element and cooling the storage compartment; wherein, in an overload condition in which the temperature of the storage compartment is higher than a set temperature of the storage compartment by a predetermined temperature or more, first cooling for cooling the storage compartment by the first cooling device and second cooling for cooling the storage compartment by the second cooling device are performed together based on the outside temperature of the refrigerator being within a preset temperature range, and only the first cooling is performed based on the outside temperature not being within the preset temperature range.
도 1은 본 개시의 일 실시예에 따른 냉장고를 도시한 도면이다. FIG. 1 is a drawing illustrating a refrigerator according to one embodiment of the present disclosure.
도 2는 본 개시의 일 실시예에 따른 냉장고의 도어들이 개방된 상태를 도시한 도면이다. FIG. 2 is a drawing showing the doors of a refrigerator in an open state according to one embodiment of the present disclosure.
도 3은 본 개시의 일 실시예에 따른 냉장고의 저장실의 상부를 아래에서 바라본 도면이다. FIG. 3 is a drawing of the upper part of a storage compartment of a refrigerator according to one embodiment of the present disclosure, viewed from below.
도 4는 본 개시의 일 실시예에 따른 냉장고의 개략적인 측단면도이다. FIG. 4 is a schematic cross-sectional side view of a refrigerator according to one embodiment of the present disclosure.
도 5는 도 2의 I-I선에 따른 단면도이다. Figure 5 is a cross-sectional view taken along line I-I of Figure 2.
도 6은 일 실시예에 따른 열전 냉각 장치를 분해하여 도시한 도면이다. FIG. 6 is an exploded view of a thermoelectric cooling device according to one embodiment.
도 7은 일 실시예에 따른 냉장고의 구성의 일 예를 도시한 블록도이다. FIG. 7 is a block diagram illustrating an example of a configuration of a refrigerator according to one embodiment.
도 8은 일 실시예에 따른 냉장고의 제어방법의 순서도의 일 예를 도시한다. Figure 8 illustrates an example of a flowchart of a method for controlling a refrigerator according to one embodiment.
도 9는 일 실시예에 따른 냉장고의 제어방법에서, 외기온도에 따라 저장실을 냉각하는 동작을 도시한다.FIG. 9 illustrates an operation of cooling a storage compartment according to an outside temperature in a control method of a refrigerator according to one embodiment.
도 10은 일 실시예에 따른 냉장고의 제어방법에서, 외기온도가 제1 온도구간일 때 저장실을 냉각하는 동작을 도시한다.FIG. 10 illustrates an operation of cooling a storage compartment when the outside temperature is in a first temperature range in a control method of a refrigerator according to one embodiment.
도 11은 일 실시예에 따른 냉장고의 제어방법에서, 외기온도가 제2 온도구간일 때 저장실을 냉각하는 동작을 도시한다.FIG. 11 illustrates an operation of cooling a storage compartment when the outside temperature is in a second temperature range in a control method of a refrigerator according to one embodiment.
도 12는 일 실시예에 따른 냉장고의 제어방법에서, 급속 냉각 조건에서 저장실을 냉각하는 동작의 일 예를 도시한다.Fig. 12 illustrates an example of an operation for cooling a storage room under rapid cooling conditions in a control method of a refrigerator according to one embodiment.
도 13은 일 실시예에 따른 냉장고의 제어방법에서, 급속 냉각 조건에서 저장실을 냉각하는 동작의 다른 예를 도시한다.Fig. 13 illustrates another example of an operation for cooling a storage compartment under rapid cooling conditions in a control method of a refrigerator according to one embodiment.
본 문서의 다양한 실시예들 및 이에 사용된 용어들은 본 문서에 기재된 기술적 특징들을 특정한 실시예들로 한정하려는 것이 아니며, 해당 실시예의 다양한 변경, 균등물, 또는 대체물을 포함하는 것으로 이해되어야 한다.It should be understood that the various embodiments and terms used in this document are not intended to limit the technical features described in this document to specific embodiments, but rather to include various modifications, equivalents, or substitutes of the embodiments.
도면의 설명과 관련하여, 유사한 또는 관련된 구성요소에 대해서는 유사한 참조 부호가 사용될 수 있다.In connection with the description of the drawings, similar reference numerals may be used for similar or related components.
아이템에 대응하는 명사의 단수 형은 관련된 문맥상 명백하게 다르게 지시하지 않는 한, 상기 아이템 한 개 또는 복수 개를 포함할 수 있다.The singular form of a noun corresponding to an item may include one or more of said items, unless the relevant context clearly indicates otherwise.
본 개시에서, "A 또는 B", "A 및 B 중 적어도 하나", "A 또는 B 중 적어도 하나", "A, B 또는 C", "A, B 및 C 중 적어도 하나", 및 "A, B, 또는 C 중 적어도 하나"와 같은 문구들 각각은 그 문구들 중 해당하는 문구에 함께 나열된 항목들 중 어느 하나, 또는 그들의 모든 가능한 조합을 포함할 수 있다.In this disclosure, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.
“및/또는"이라는 용어는 복수의 관련된 기재된 구성요소들의 조합 또는 복수의 관련된 기재된 구성요소들 중의 어느 구성요소를 포함한다.The term “and/or” includes any combination of a plurality of related described elements or any one of a plurality of related described elements.
"제1", "제2", 또는 "첫째" 또는 "둘째"와 같은 용어들은 단순히 해당 구성요소를 다른 해당 구성요소와 구분하기 위해 사용될 수 있으며, 해당 구성요소들을 다른 측면(예: 중요성 또는 순서)에서 한정하지 않는다.Terms such as "first," "second," or "first" or "second" may be used simply to distinguish one component from another and do not qualify the components in any other respect (e.g., importance or order).
또한, 본 개시에서 사용한 '전면', '후면', '상면', '하면', '측면', '좌측', '우측', '상부', '하부' 등의 용어는 도면을 기준으로 정의한 것이며, 이 용어에 의해 각 구성요소의 형상 및 위치가 제한되는 것은 아니다.In addition, terms such as 'front', 'rear', 'top', 'bottom', 'side', 'left', 'right', 'upper', and 'lower' used in the present disclosure are defined based on the drawings, and the shape and position of each component are not limited by these terms.
“포함하다” 또는 "가지다"등의 용어는 본 개시에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는다.The terms “include” or “have” are intended to specify the presence of a feature, number, step, operation, component, part or combination thereof described in the present disclosure, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts or combinations thereof.
어떤 구성요소가 다른 구성요소와 "연결", "결합", "지지" 또는 "접촉"되어 있다고 할 때, 이는 구성요소들이 직접적으로 연결, 결합, 지지 또는 접촉되는 경우뿐 아니라, 제3 구성요소를 통하여 간접적으로 연결, 결합, 지지 또는 접촉되는 경우를 포함한다.When a component is said to be “connected,” “coupled,” “supported,” or “in contact with” another component, this includes not only cases where the components are directly connected, coupled, supported, or in contact, but also cases where the components are indirectly connected, coupled, supported, or in contact through a third component.
어떤 구성요소가 다른 구성요소 "상에" 위치하고 있다고 할 때, 이는 어떤 구성요소가 다른 구성요소에 접해 있는 경우뿐 아니라 두 구성요소 사이에 또 다른 구성요소가 존재하는 경우도 포함한다.When we say that a component is "on" another component, this includes not only cases where the component is in contact with the other component, but also cases where there is another component between the two components.
일 실시 예에 따른 냉장고는 캐비닛을 포함할 수 있다.A refrigerator according to one embodiment may include a cabinet.
“캐비닛”은 내상과, 내상의 외측에 배치되는 외상과, 내상과 외상의 사이에 마련되는 단열재를 포함할 수 있다.A “cabinet” may include an inner case, an outer case placed on the outside of the inner case, and insulation provided between the inner case and the outer case.
“내상”은 저장실을 형성하는 케이스(case), 플레이트(plate), 패널(panel) 또는 라이너(liner) 중 적어도 하나를 포함할 수 있다. 내상은 하나의 몸체로 형성될 수도 있으며 또는 복수의 플레이트들이 조립되어 형성될 수 있다. "외상"은 캐비닛의 외관을 형성할 수 있으며, 내상과 외상의 사이에 단열재가 배치되도록 내상의 외측에 결합될 수 있다.The "inner case" may include at least one of a case, plate, panel, or liner forming a storage compartment. The inner case may be formed as a single body or may be formed by assembling multiple plates. The "outer case" may form the exterior of the cabinet and may be joined to the exterior of the inner case so that insulation is placed between the inner case and the outer case.
“단열재”는 저장실 내부의 온도가 저장실 외부 환경에 의해 영향을 받지 않고 설정된 적정 온도로 유지될 수 있도록 저장실 내부와 저장실 외부를 단열할 수 있다. 일 실시예에 따르면 단열재는 발포 단열재를 포함할 수 있다. 내상과 외상의 사이에 폴리우레탄과 발포제가 혼합된 우레탄폼을 주입 및 발포시킴으로써 발포 단열재를 성형할 수 있다."Insulation" can insulate the interior and exterior of a storage room so that the temperature inside the storage room can be maintained at a set temperature without being affected by the external environment. In one embodiment, the insulation can include foam insulation. The foam insulation can be formed by injecting and foaming urethane foam, a mixture of polyurethane and a foaming agent, between the inner and outer layers.
일 실시예에 따르면 단열재는 발포 단열재 이외에 추가로 진공 단열재를 포함하거나, 단열재는 발포 단열재 대신 진공 단열재만으로 구성될 수도 있다. 진공 단열재는 심재와, 심재를 수용하고 내부를 진공 또는 진공에 가까운 압력으로 밀봉하는 외피재를 포함할 수 있다. 다만, 단열재는 상기한 발포 단열재 또는 진공 단열재에 한정되는 것은 아니고 단열을 위해 사용될 수 있는 다양한 소재를 포함할 수 있다.In one embodiment, the insulation may include a vacuum insulation material in addition to the foam insulation, or the insulation may consist solely of the vacuum insulation material instead of the foam insulation. The vacuum insulation material may include a core material and an outer shell material that accommodates the core material and seals the interior under a vacuum or near-vacuum pressure. However, the insulation material is not limited to the foam insulation or vacuum insulation material described above, and may include various materials that can be used for insulation.
"저장실"은 내상에 의해 한정되는 공간을 포함할 수 있다. 저장실은 저장실에 대응되는 공간을 한정하는 내상을 더 포함할 수 있다. 저장실에는 식품, 약품, 화장품 등 다양한 물품이 저장될 수 있으며, 저장실은 물품을 출납하기 위해 적어도 일측이 개방되도록 형성될 수 있다.A "storage room" may include a space defined by an interior wall. The storage room may further include an interior wall defining a corresponding space. The storage room may store various items, such as food, medicine, and cosmetics, and the storage room may be configured to be open on at least one side for the entry and exit of items.
냉장고는 한 개 또는 그 이상의 저장실을 포함할 수 있다. 냉장고에 2 개 이상의 저장실이 형성될 때 각각의 저장실은 서로 다른 용도를 가질 수 있으며 서로 다른 온도로 유지될 수 있다. 이를 위해 각각의 저장실은 단열재를 포함하는 격벽에 의해 서로 구획될 수 있다.A refrigerator may include one or more storage compartments. When a refrigerator includes two or more storage compartments, each compartment may have a different purpose and be maintained at different temperatures. To achieve this, each storage compartment may be separated from the others by a partition wall containing insulation.
저장실은 용도에 따라 적정한 온도 범위에서 유지되도록 마련될 수 있으며, 그 용도 및/또는 온도 범위에 따라 구분되는"냉장실", "냉동실"또는 "변온실"을 포함할 수 있다. 냉장실은 물품을 냉장 보관하기에 적정한 온도로 유지될 수 있고, 냉동실은 물품을 냉동 보관하기에 적정한 온도로 유지될 수 있다. "냉장"은 물품을 얼지 않는 한도에서 차갑게 냉각하는 것을 의미할 수 있으며, 일례로 냉장실은 섭씨 0도에서 섭씨 영상 7도 범위에서 유지될 수 있다. "냉동”은 물품을 얼리거나 언 상태로 유지되도록 냉각하는 것을 의미할 수 있으며, 일례로 냉동실은 섭씨 영하 20도 내지 섭씨 영하 1도 범위에서 유지될 수 있다. 변온실은 사용자의 선택 또는 이와 무관하게 냉장실 또는 냉동실 중 어느 하나로 사용될 수 있다.The storage room may be provided to be maintained at an appropriate temperature range depending on the intended use, and may include a "refrigerator," a "freezer," or a "variable temperature room," which are distinguished according to the intended use and/or temperature range. The refrigerator room may be maintained at a temperature appropriate for refrigerating items, and the freezer room may be maintained at a temperature appropriate for freezing items. "Refrigeration" may mean cooling items to a temperature that does not freeze them, and for example, a refrigerator room may be maintained at a temperature ranging from 0 degrees Celsius to +7 degrees Celsius. "Freezing" may mean cooling items to freeze them or keep them in a frozen state, and for example, a freezer room may be maintained at a temperature ranging from -20 degrees Celsius to -1 degree Celsius. The variable temperature room may be used as either a refrigerator room or a freezer room, at the user's option or not.
저장실은 "냉장실", "냉동실" 및 "변온실" 등의 명칭 이외에도 "야채실", "신선실", "쿨링실" 및 "제빙실" 등 다양한 명칭으로 불릴 수 있으며, 이하에서 사용되는 "냉장실", "냉동실" 및 "변온실" 등의 용어는 각각 대응되는 용도 및 온도 범위를 갖는 저장실을 포괄하는 의미로 이해되어야 할 것이다.In addition to names such as "refrigerator," "freezer," and "variable temperature room," a storage room may also be called by various other names such as "vegetable room," "fresh room," "cooling room," and "ice room." The terms "refrigerator," "freezer," and "variable temperature room" used hereinafter should be understood to encompass storage rooms having corresponding uses and temperature ranges.
일 실시예에 따르면 냉장고는 저장실의 개방된 일측을 개폐하도록 구성되는 적어도 하나의 도어를 포함할 수 있다. 도어는 한 개 또는 그 이상의 저장실 각각을 개폐하도록 구비되거나, 도어 하나가 복수의 저장실을 개폐하도록 구비될 수 있다. 도어는 캐비닛의 전면에 회전 또는 슬라이딩 가능하게 설치될 수 있다.In one embodiment, the refrigerator may include at least one door configured to open and close an open side of a storage compartment. The door may be configured to open and close one or more storage compartments, or a single door may be configured to open and close multiple storage compartments. The door may be installed on the front of the cabinet in a pivotal or sliding manner.
“도어”는 도어가 닫힐 시에 저장실을 밀폐하도록 구성될 수 있다. 도어는 도어가 닫힐 시에 저장실을 단열하도록 캐비닛과 마찬가지로 단열재를 포함할 수 있다.The “door” may be configured to seal the storage compartment when the door is closed. The door may include insulation, similar to a cabinet, to insulate the storage compartment when the door is closed.
일 실시예에 따르면 도어는 도어의 전면을 형성하는 도어 외판과, 도어의 후면을 형성하고 저장실을 마주보는 도어 내판과, 상부 캡과, 하부 캡 및 이들의 내부에 마련되는 도어 단열재를 포함할 수 있다.According to one embodiment, the door may include a door outer panel forming the front of the door, a door inner panel forming the back of the door and facing the storage compartment, an upper cap, a lower cap, and door insulation provided on the interior of these.
도어 내판의 테두리에는 도어가 닫혔을 때 캐비닛의 전면에 밀착됨으로써 저장실을 밀폐하는 가스켓이 마련될 수 있다. 도어 내판은 물품을 보관할 수 있는 도어 바스켓이 장착되도록 후방으로 돌출되는 다이크(dyke)를 포함할 수 있다.The door inner panel may be provided with a gasket that seals the storage compartment by pressing against the front of the cabinet when the door is closed. The door inner panel may include a dyke that protrudes rearward to accommodate a door basket for storing items.
일 실시예에 따르면 도어는 도어 바디와, 도어 바디의 전측에 분리 가능하게 결합되고 도어의 전면을 형성하는 전방 패널을 포함할 수 있다. 도어 바디는 도어 바디의 전면을 형성하는 도어 외판, 도어 바디의 후면을 형성하고 저장실을 마주보는 도어 내판, 상부 캡, 하부 캡 및 이들의 내부에 마련되는 도어 단열재를 포함할 수 있다.In one embodiment, the door may include a door body and a front panel detachably coupled to the front side of the door body and forming the front of the door. The door body may include a door outer panel forming the front of the door body, a door inner panel forming the rear of the door body and facing the storage compartment, an upper cap, a lower cap, and door insulation provided inside these.
냉장고는 도어 및 저장실의 배치에 따라 프렌치 도어 타입(French Door Type), 사이드 바이 사이드 타입(Side-by-side Type), BMF(Bottom Mounted Freezer), TMF(Top Mounted Freezer) 또는 1도어 냉장고 등으로 구별될 수 있다.Depending on the arrangement of the door and storage compartment, refrigerators can be classified into French door type, side-by-side type, bottom mounted freezer (BMF), top mounted freezer (TMF), or single-door refrigerator.
일 실시예에 따르면 냉장고는 저장실에 냉기를 공급하도록 마련되는 냉기 공급 장치를 포함할 수 있다.According to one embodiment, the refrigerator may include a cold air supply device configured to supply cold air to the storage compartment.
“냉기 공급 장치"는 냉기를 생성하고 냉기를 안내하여 저장실을 냉각할 수 있는 기계, 기구, 전자 장치 및/또는 이들을 조합한 시스템을 포함할 수 있다.A “cold air supply device” may include a system of machines, devices, electronic devices and/or combinations thereof that can generate cold air and guide the cold air to cool a storage room.
일 실시예에 따르면 냉기 공급 장치는 냉매의 압축, 응축, 팽창 및 증발 과정을 포함하는 냉동 사이클을 통해 냉기를 생성할 수 있다. 이를 위해 냉기 공급 장치는 냉동 사이클을 구동시킬 수 있는 압축기, 응축기, 팽창 장치 및 증발기를 갖는 냉동 사이클 장치를 포함할 수 있다. 일 실시예에 따르면 냉기 공급 장치는 열전소자와 같은 반도체를 포함할 수 있다. 열전소자는 펠티어 효과를 통한 발열 및 냉각 작용으로 저장실을 냉각할 수 있다.In one embodiment, the cold air supply device can generate cold air through a refrigeration cycle that includes the processes of compression, condensation, expansion, and evaporation of a refrigerant. To this end, the cold air supply device can include a refrigeration cycle device having a compressor, a condenser, an expansion device, and an evaporator capable of driving the refrigeration cycle. In one embodiment, the cold air supply device can include a semiconductor, such as a thermoelectric element. The thermoelectric element can cool a storage compartment by generating heat and cooling through the Peltier effect.
일 실시예에 따르면 냉장고는 냉기 공급 장치에 속한 적어도 일부 부품들이 배치되도록 마련되는 기계실을 포함할 수 있다.According to one embodiment, the refrigerator may include a machine room in which at least some components belonging to the cold air supply device are arranged.
“기계실”은 기계실에 배치되는 부품에서 발생되는 열이 저장실에 전달되는 것을 방지하기 위해 저장실과 구획 및 단열되도록 마련될 수 있다. 기계실 내부에 배치된 부품을 방열하도록 기계실 내부는 캐비닛의 외부와 연통되도록 구성될 수 있다.The "machine room" may be designed to be partitioned and insulated from the storage room to prevent heat generated by components placed within the machine room from being transferred to the storage room. The interior of the machine room may be configured to communicate with the exterior of the cabinet to dissipate heat from components placed within the machine room.
일 실시예에 따르면 냉장고는 물 및/또는 얼음을 제공하도록 도어에 마련되는 디스펜서를 포함할 수 있다. 디스펜서는 사용자가 도어를 개방하지 않고 접근 가능하도록 도어에 마련될 수 있다.In one embodiment, the refrigerator may include a dispenser provided on the door to provide water and/or ice. The dispenser may be provided on the door so that it is accessible to a user without having to open the door.
일 실시예에 따르면 냉장고는 얼음을 생성하도록 마련되는 제빙 장치를 포함할 수 있다. 제빙 장치는 물을 저수하는 제빙 트레이와, 제빙 트레이로부터 얼음을 분리시키는 이빙 장치와, 제빙 트레이에서 생성된 얼음을 저장하는 아이스 버킷을 포함할 수 있다.In one embodiment, a refrigerator may include an ice-making device configured to produce ice. The ice-making device may include an ice-making tray configured to store water, an ice-separating device configured to separate ice from the ice-making tray, and an ice bucket configured to store ice produced in the ice-making tray.
일 실시예에 따르면 냉장고는 냉장고를 제어하기 위한 제어부를 포함할 수 있다.According to one embodiment, the refrigerator may include a control unit for controlling the refrigerator.
“제어부”는 냉장고를 제어하기 위한 프로그램 및/또는 데이터를 저장 또는 기억하는 메모리와, 메모리에 기억된 프로그램 및/또는 데이터에 따라 냉기 공급 장치 등을 제어하기 위한 제어 신호를 출력하는 프로세서를 포함할 수 있다.The “control unit” may include a memory that stores or memorizes a program and/or data for controlling the refrigerator, and a processor that outputs a control signal for controlling a cold air supply device, etc. according to the program and/or data memorized in the memory.
메모리는 냉장고의 동작에 필요한 다양한 정보, 데이터, 명령어, 프로그램 등을 저장 또는 기록한다. 메모리는 냉장고에 포함된 구성들을 제어하기 위한 제어 신호를 생성하는 중에 발생하는 임시 데이터를 기억할 수 있다. 메모리는 휘발성 메모리 또는 비휘발성 메모리 중 적어도 하나 또는 이들의 조합을 포함할 수 있다.Memory stores or records various information, data, commands, programs, etc. necessary for the operation of the refrigerator. Memory can store temporary data generated during the generation of control signals for controlling components within the refrigerator. Memory may include at least one of volatile memory and non-volatile memory, or a combination thereof.
프로세서는 냉장고 전반의 동작을 제어한다. 프로세서는 메모리에 저장된 프로그램을 실행하여, 냉장고의 구성 요소들을 제어할 수 있다. 프로세서는 인공지능 모델의 동작을 수행하는 별도의 NPU를 포함할 수 있다. 또한 프로세서는 중앙 처리부, 그래픽 전용 프로세서(GPU) 등을 포함할 수 있다. 프로세서는 냉기 공급 방치의 동작을 제어하기 위한 제어 신호를 생성할 수 있다. 예를 들어, 프로세서는 온도 센서로부터 저장실의 온도 정보를 수신하고, 저장실의 온도 정보에 기초하여 냉기 공급 장치의 동작을 제어하기 위한 냉각 제어 신호를 생성할 수 있다.The processor controls the overall operation of the refrigerator. The processor can control the components of the refrigerator by executing programs stored in memory. The processor may include a separate NPU that performs the operations of an artificial intelligence model. The processor may also include a central processing unit (CPU), a graphics processing unit (GPU), or the like. The processor may generate control signals to control the operation of the cooling system. For example, the processor may receive temperature information about the storage compartment from a temperature sensor and generate a cooling control signal to control the operation of the cooling system based on the temperature information.
또한, 프로세서는 메모리에 기억/저장된 프로그램 및/또는 데이터에 따라 사용자 인터페이스의 사용자 입력을 처리하고, 사용자 인터페이스의 동작을 제어할 수 있다. 사용자 인터페이스는 입력 인터페이스와 출력 인터페이스를 이용하여 제공될 수 있다. 프로세서는 사용자 인터페이스로부터 사용자 입력을 수신할 수 있다. 또한, 프로세서는 사용자 입력에 응답하여 사용자 인터페이스에 영상을 표시하기 위한 표시 제어 신호 및 영상 데이터를 사용자 인터페이스에 전달할 수 있다.Additionally, the processor may process user input of the user interface and control the operation of the user interface based on programs and/or data stored/stored in the memory. The user interface may be provided using an input interface and an output interface. The processor may receive user input from the user interface. Additionally, the processor may transmit display control signals and image data to the user interface for displaying an image on the user interface in response to the user input.
프로세서와 메모리는 일체로 마련되거나 또는 별도로 마련될 수 있다. 프로세서는 하나 이상의 프로세서를 포함할 수 있다. 예를 들어, 프로세서는 메인 프로세서와 적어도 하나의 서브 프로세서를 포함할 수 있다. 메모리는 하나 이상의 메모리를 포함할 수 있다.The processor and memory may be provided as a single unit or separately. The processor may include one or more processors. For example, the processor may include a main processor and at least one subprocessor. The memory may include one or more memories.
일 실시예에 따르면 냉장고는 냉장고에 포함된 구성들을 모두 제어하는 프로세서 및 메모리를 포함하고 냉장고의 구성들을 개별 제어하는 복수의 프로세서들과 복수의 메모리들을 포함할 수 있다. 예를 들어, 냉장고는 온도센서의 출력에 따라 냉기 공급 장치의 동작을 제어하는 프로세서 및 메모리를 포함할 수 있다. 또한, 냉장고는 사용자 입력에 따라 사용자 인터페이스의 동작을 제어하는 프로세서와 메모리를 별도로 구비할 수 있다.In one embodiment, a refrigerator may include a processor and memory that control all components within the refrigerator, and may include multiple processors and multiple memories that individually control the components within the refrigerator. For example, the refrigerator may include a processor and memory that control the operation of a cooling device based on the output of a temperature sensor. Additionally, the refrigerator may separately include a processor and memory that control the operation of a user interface based on user input.
통신모듈은 주변의 접속 중계기(AP: Access Point)를 통해 서버, 모바일 장치, 다른 가전 기기 등의 외부 장치와 통신할 수 있다. 접속 중계기(AP)는 냉장고 또는 사용자 기기가 연결된 지역 네트워크(LAN)를 서버가 연결된 광역 네트워크(WAN)에 연결시킬 수 있다. 냉장고 또는 사용자 기기는 광역 네트워크(WAN)를 통해 서버에 연결될 수 있다.The communication module can communicate with external devices, such as servers, mobile devices, and other home appliances, via a nearby access point (AP). The AP can connect the local area network (LAN) to which the refrigerator or user device is connected to the wide area network (WAN) to which the server is connected. The refrigerator or user device can then connect to the server via the WAN.
입력 인터페이스는 키, 터치스크린, 마이크로폰 등을 포함할 수 있다. 입력 인터페이스는 사용자 입력을 수신하여 프로세서로 전달할 수 있다.The input interface may include keys, a touchscreen, a microphone, etc. The input interface may receive user input and transmit it to the processor.
출력 인터페이스는 디스플레이, 스피커 등을 포함할 수 있다. 출력 인터페이스는 프로세서에서 생성된 다양한 알림, 메시지, 정보 등을 출력할 수 있다.The output interface may include a display, a speaker, etc. The output interface may output various notifications, messages, information, etc. generated by the processor.
이하에서 첨부된 도면을 참조하여 다양한 실시예에 따른 냉장고를 구체적으로 설명한다.Hereinafter, refrigerators according to various embodiments will be specifically described with reference to the attached drawings.
도 1은 본 개시의 일 실시예에 따른 냉장고를 도시한 도면이다. 도 2는 본 개시의 일 실시예에 따른 냉장고의 도어가 개방된 상태를 도시한 도면이다. 도 3은 본 개시의 일 실시예에 따른 냉장고의 저장실의 상부를 아래에서 바라본 도면이다. 도 4는 본 개시의 일 실시예에 따른 냉장고의 개략적인 측단면도이다. 도 5는 도 2의 I-I선에 따른 단면도이다.FIG. 1 is a drawing illustrating a refrigerator according to one embodiment of the present disclosure. FIG. 2 is a drawing illustrating a state in which a door of a refrigerator according to one embodiment of the present disclosure is opened. FIG. 3 is a drawing illustrating the upper portion of a storage compartment of a refrigerator according to one embodiment of the present disclosure as viewed from below. FIG. 4 is a schematic side cross-sectional view of a refrigerator according to one embodiment of the present disclosure. FIG. 5 is a cross-sectional view taken along line I-I of FIG. 2.
도 1 내지 도 5를 참조하면, 냉장고(1)는 본체(100)와, 본체(100)의 내부에 형성된 저장실들(11, 12, 13)과, 저장실들(11, 12, 13)을 개폐하도록 마련된 도어들(21, 22, 23, 24)을 포함할 수 있다. Referring to FIGS. 1 to 5, a refrigerator (1) may include a main body (100), storage chambers (11, 12, 13) formed inside the main body (100), and doors (21, 22, 23, 24) provided to open and close the storage chambers (11, 12, 13).
본체(100)는 내상(170)과 내상(170)의 외측에 결합된 외상(180)과, 내상(170)과 외상(180)의 사이에 마련된 단열재(190)를 포함할 수 있다(도 6 참조). 내상(170)은 저장실(11, 12, 13)을 형성하고 외상(180)은 본체(100)의 외관을 형성할 수 있다. The main body (100) may include an inner case (170), an outer case (180) coupled to the outer side of the inner case (170), and an insulating material (190) provided between the inner case (170) and the outer case (180) (see FIG. 6). The inner case (170) may form a storage chamber (11, 12, 13), and the outer case (180) may form the outer appearance of the main body (100).
다른 측면에서, 본체(100)는 상부벽(110)과, 하부벽(120)과, 좌측벽(130)과, 우측벽(140)과, 후벽(150)을 포함할 수 있다. 상부벽(110)과, 하부벽(120)과, 좌측벽(130)과, 우측벽(140)과, 후벽(150)은 각각 본체(100)의 상면과, 하면과, 좌측면과, 우측면과, 후벽을 형성할 수 있다. In another aspect, the main body (100) may include an upper wall (110), a lower wall (120), a left wall (130), a right wall (140), and a rear wall (150). The upper wall (110), the lower wall (120), the left wall (130), the right wall (140), and the rear wall (150) may form an upper surface, a lower surface, a left surface, a right surface, and a rear wall of the main body (100), respectively.
상부벽(110)과, 하부벽(120)과, 좌측벽(130)과, 우측벽(140)과, 후벽(150) 각각은 내상(170)과, 외상(180)과, 단열재(190)로 이루어질 수 있다. 일례로, 상부벽(110)의 상면은 외상(180)에 의해 형성되고 상부벽(110)의 하면은 내상(170)에 의해 형성되며, 상부벽(110)의 내부에는 단열재(190)가 마련될 수 있다. Each of the upper wall (110), the lower wall (120), the left wall (130), the right wall (140), and the rear wall (150) may be formed of an inner surface (170), an outer surface (180), and an insulating material (190). For example, the upper surface of the upper wall (110) may be formed by the outer surface (180), the lower surface of the upper wall (110) may be formed by the inner surface (170), and an insulating material (190) may be provided on the inside of the upper wall (110).
저장실들(11, 12, 13)은 물품을 수용할 수 있다. 저장실들(11, 12, 13)은 물품을 넣거나 뺄 수 있도록 앞 측이 개방되게 형성될 수 있다. 본체(100)는 제1 저장실(11)을 제2 저장실(12) 및 제3 저장실(13)과 구획하는 수평 격벽(160)과, 제2 저장실(12)을 제3 저장실(13)과 구획하는 수직 격벽(161)을 포함할 수 있다. 제1 저장실(11)은 본체(100)의 상부에 마련되고, 제2 저장실(12)과 제3 저장실(13)은 본체(100)의 하부에 마련될 수 있다. 제1 저장실(11)은 냉장실일 수 있으며, 제2 저장실(12)은 냉동실일 수 있고, 제3 저장실(13)은 변온실일 수 있다. The storage compartments (11, 12, 13) can accommodate items. The storage compartments (11, 12, 13) can be formed to have an open front side so that items can be put in or taken out. The main body (100) can include a horizontal partition wall (160) that divides the first storage compartment (11) from the second storage compartment (12) and the third storage compartment (13), and a vertical partition wall (161) that divides the second storage compartment (12) from the third storage compartment (13). The first storage compartment (11) can be provided at the upper part of the main body (100), and the second storage compartment (12) and the third storage compartment (13) can be provided at the lower part of the main body (100). The first storage compartment (11) can be a refrigerator compartment, the second storage compartment (12) can be a freezer compartment, and the third storage compartment (13) can be a variable temperature compartment.
제1 저장실(11)은 제1 설정온도로 유지될 수 있으며, 제2 저장실(12)은 제2 설정온도로 유지될 수 있으며, 제3 저장실(13)은 제3 설정온도로 유지될 수 있다.The first storage room (11) can be maintained at a first set temperature, the second storage room (12) can be maintained at a second set temperature, and the third storage room (13) can be maintained at a third set temperature.
제2 설정온도는 제1 설정온도 및 제3 설정온도보다 낮게 설정될 수 있다. 제2 설정온도, 제1 설정온도 및 제3 설정온도는 사용자에 의해 설정 가능할 수 있다.The second set temperature may be set lower than the first set temperature and the third set temperature. The second set temperature, the first set temperature, and the third set temperature may be settable by the user.
도어들(21, 22, 23, 24)은 저장실들(11, 12, 13)을 개폐할 수 있다. 제1 도어(21)와 제2 도어(22)는 제1 저장실(11)을 개폐하고, 제3 도어(23)는 제2 저장실(12)을 개폐하며, 제4 도어(24)는 제3 저장실(13)을 개폐할 수 있다. 도어들(21, 22, 23, 24)은 본체(100)에 회전 가능하게 결합될 수 있다. Doors (21, 22, 23, 24) can open and close storage rooms (11, 12, 13). The first door (21) and the second door (22) can open and close the first storage room (11), the third door (23) can open and close the second storage room (12), and the fourth door (24) can open and close the third storage room (13). The doors (21, 22, 23, 24) can be rotatably coupled to the main body (100).
도어들(21, 22, 23, 24)은 힌지에 의해 본체(100)에 회전 가능하게 결합될 수 있다. 예를 들어, 제1 도어(21)와 제2 도어(22)는 각각 본체(100)의 상부에 마련된 힌지(31)와 본체(100)의 중간에 마련된 힌지에 의해 본체(100)에 회전 가능하게 결합될 수 있다. 힌지(31)는 도어의 회전축을 형성하도록 수직 방향으로 돌출되는 힌지 핀을 포함할 수 있다. 힌지(31)는 본체(100)의 상면 앞 부분을 커버하도록 마련된 탑 커버(300)에 의해 커버될 수 있다. The doors (21, 22, 23, 24) may be rotatably coupled to the main body (100) by hinges. For example, the first door (21) and the second door (22) may be rotatably coupled to the main body (100) by a hinge (31) provided on the upper portion of the main body (100) and a hinge provided in the middle of the main body (100), respectively. The hinge (31) may include a hinge pin that protrudes vertically to form a rotational axis of the door. The hinge (31) may be covered by a top cover (300) provided to cover the upper front portion of the main body (100).
제1 도어(21)와 제2 도어(22) 중 어느 하나의 도어에는 제1 도어(21)와 제2 도어(22)가 닫힌 때 제1 도어(21)와 제2 도어(22) 사이에 형성되는 갭을 커버하기 위한 회전 바(40)가 마련될 수 있다. 회전 바(40)는 제1 도어(21)와 제2 도어(22) 중에 어느 하나의 도어에 회전 가능하게 마련될 수 있다. 회전 바(40)는 수직 방향으로 길게 형성된 막대 형상을 가질 수 있다. 회전 바(40)는 필러(pillar), 멀리언(mullion) 등으로 지칭될 수도 있다. A rotating bar (40) may be provided on either the first door (21) or the second door (22) to cover the gap formed between the first door (21) and the second door (22) when the first door (21) and the second door (22) are closed. The rotating bar (40) may be provided rotatably on either the first door (21) or the second door (22). The rotating bar (40) may have a rod shape that is formed long in a vertical direction. The rotating bar (40) may also be referred to as a pillar, a mullion, or the like.
회전 바(40)의 상단에는 가이드 돌기(46)가 마련되고 본체(100)의 상부에는 가이드 돌기(46)의 회전을 안내하는 회전 가이드(119)가 마련될 수 있다. A guide protrusion (46) may be provided at the top of the rotating bar (40), and a rotation guide (119) that guides the rotation of the guide protrusion (46) may be provided at the top of the main body (100).
도어들(21, 22, 23, 24)은 가스켓(51)을 포함할 수 있다. 가스켓(51)은 도어들(21, 22, 23, 24)이 닫힌 때 본체(100)의 전면에 밀착될 수 있다. 도어들(21, 22, 23, 24)은 후방으로 돌출되는 다이크(52)를 포함할 수 있다. 다이크(52)에는 물품을 저장할 수 있는 도어 선반(53)이 장착될 수 있다. 회전 바(40)는 다이크(52)에 회전 가능하게 설치될 수 있다. The doors (21, 22, 23, 24) may include a gasket (51). The gasket (51) may be pressed against the front of the body (100) when the doors (21, 22, 23, 24) are closed. The doors (21, 22, 23, 24) may include a ditch (52) that protrudes rearward. A door shelf (53) capable of storing items may be mounted on the ditch (52). A rotating bar (40) may be rotatably installed on the ditch (52).
이상에서 저장실의 개수 및 배치와, 도어의 개수 및 배치에 대해 설명하였으나, 본 개시의 일 실시예에 따른 냉장고의 저장실의 개수 및 배치와, 도어의 개수 및 배치에 제한이 있는 것은 아니다. Although the number and arrangement of storage compartments and the number and arrangement of doors have been described above, there is no limitation on the number and arrangement of storage compartments and the number and arrangement of doors of a refrigerator according to one embodiment of the present disclosure.
냉장고(1)는 저장실(11)을 냉각하도록 마련된 열전 냉각 장치(400)를 포함할 수 있다. The refrigerator (1) may include a thermoelectric cooling device (400) arranged to cool the storage compartment (11).
열전 냉각 장치(400)는 저장실(11)을 냉각시키도록 저장실(11)의 상측에 마련될 수 있다. 즉, 열전 냉각 장치(400)는 본체(100)의 상부벽(110)에 마련될 수 있다. A thermoelectric cooling device (400) may be provided on the upper side of the storage room (11) to cool the storage room (11). That is, the thermoelectric cooling device (400) may be provided on the upper wall (110) of the main body (100).
열전 냉각 장치(400)는 열전소자(530)를 포함할 수 있다. 열전소자(530)는 열전 효과를 이용해 열 에너지를 전기 에너지로, 전기 에너지를 열 에너지로 변환하는 반도체 소자일 수 있으며, 열전 반도체 소자, 펠티어 소자 등으로 지칭될 수도 있다. A thermoelectric cooling device (400) may include a thermoelectric element (530). The thermoelectric element (530) may be a semiconductor element that converts thermal energy into electrical energy or electrical energy into thermal energy using the thermoelectric effect, and may also be referred to as a thermoelectric semiconductor element, a Peltier element, or the like.
열전소자(530)는 발열부(531)와 냉각부(532)를 포함한다. 열전소자(530)에 전류가 가해지면 발열부(531)에서 발열 작용이 일어나고 냉각부(532)에서 흡열 작용이 일어날 수 있다. 열전소자(530)는 얇은 육면체 형상을 가질 수 있다. 열전소자(530)의 일면에 발열부(531)가 마련되고 반대면에 냉각부(532)가 마련될 수 있다.A thermoelectric element (530) includes a heating element (531) and a cooling element (532). When current is applied to the thermoelectric element (530), a heating action may occur in the heating element (531) and a heat absorption action may occur in the cooling element (532). The thermoelectric element (530) may have a thin hexahedral shape. A heating element (531) may be provided on one surface of the thermoelectric element (530) and a cooling element (532) may be provided on the opposite surface.
열전소자(530)는 발열부(531)가 열전소자(530)의 위를 향하고 냉각부(532)가 열전소자(530)의 아래를 향하도록 상부벽(110)에 마련될 수 있다. 즉, 발열부(531)가 본체(100)의 외부를 향하고 냉각부(532)는 저장실(11) 내부를 향할 수 있다. 따라서, 발열부(531)와 열교환하여 따듯해진 공기는 본체(100)의 외부로 배출되고 냉각부(532)와 열교환하여 차가워진 공기는 저장실(11)에 공급될 수 있다. The thermoelectric element (530) may be provided on the upper wall (110) such that the heating portion (531) faces above the thermoelectric element (530) and the cooling portion (532) faces below the thermoelectric element (530). That is, the heating portion (531) may face the outside of the main body (100) and the cooling portion (532) may face the inside of the storage chamber (11). Accordingly, air that has been warmed through heat exchange with the heating portion (531) may be discharged to the outside of the main body (100), and air that has been cooled through heat exchange with the cooling portion (532) may be supplied to the storage chamber (11).
열전 냉각 장치(400)는 발열부(531)와 본체(100) 외부의 공기의 열교환이 효율적으로 이루어지도록 발열부(531)에 접촉하는 방열 싱크(520)를 포함할 수 있다. The thermoelectric cooling device (400) may include a heat sink (520) that contacts the heat generating unit (531) so that heat exchange between the heat generating unit (531) and the air outside the main body (100) is efficiently performed.
방열 싱크(520)는 본체(100)의 외부에 위치할 수 있다. 방열 싱크(520)는 발열부(531)에 접촉하여 발열부(531)의 열을 흡수하고 본체(100) 외부로 열을 방출할 수 있다. 방열 싱크(520)는 핫 싱크, 방열 히트 싱크, 핫 히트 싱크 등으로 지칭될 수도 있다. A heat sink (520) may be located outside the main body (100). The heat sink (520) may contact the heat generating portion (531) to absorb heat from the heat generating portion (531) and release heat to the outside of the main body (100). The heat sink (520) may also be referred to as a hot sink, a heat dissipation heat sink, a hot heat sink, etc.
방열 싱크(520)는 열전도율이 좋은 금속 재질로 형성될 수 있다. 예를 들어 방열 싱크(520)는 알루미늄이나 구리 재질로 형성될 수 있다. The heat sink (520) may be formed of a metal material with good thermal conductivity. For example, the heat sink (520) may be formed of aluminum or copper.
방열 싱크(520)는 발열부(531)에 접촉하는 방열 싱크 베이스(521)와, 전열 면적을 확대하도록 방열 싱크 베이스(521)에서 돌출되는 복수의 방열 핀들(525)을 포함할 수 있다. 복수의 방열 핀들(525)은 방열 싱크 베이스(521)에서 위로 돌출될 수 있다. The heat sink (520) may include a heat sink base (521) that contacts the heat generating portion (531) and a plurality of heat dissipation fins (525) that protrude from the heat sink base (521) to expand the heat transfer area. The plurality of heat dissipation fins (525) may protrude upward from the heat sink base (521).
열전 냉각 장치(400)는 냉각부(532)와 저장실(11) 내부의 공기의 열교환이 효율적으로 이루어지도록 냉각부(532)에 접촉하는 냉각 싱크(570)를 포함할 수 있다.The thermoelectric cooling device (400) may include a cooling sink (570) in contact with the cooling unit (532) so that heat exchange between the cooling unit (532) and the air inside the storage chamber (11) is efficiently performed.
냉각 싱크(570)는 저장실(11)의 내부에 위치할 수 있다. 냉각 싱크(570)는 저장실(11)의 열을 빼앗아 냉각부(532)로 전달함으로써 저장실(11)을 냉각시킬 수 있다. 냉각 싱크(570)는 콜드 싱크, 쿨링 싱크, 냉각 히트 싱크, 콜드 히트 싱크, 쿨링 히트 싱크 등으로 지칭될 수도 있다. A cooling sink (570) may be located inside the storage compartment (11). The cooling sink (570) may cool the storage compartment (11) by taking away heat from the storage compartment (11) and transferring it to the cooling unit (532). The cooling sink (570) may also be referred to as a cold sink, a cooling sink, a cooling heat sink, a cold heat sink, a cooling heat sink, etc.
냉각 싱크(570)는 열전도율이 좋은 금속 재질로 형성될 수 있다. 예를 들어 냉각 싱크(570)는 알루미늄이나 구리 재질로 형성될 수 있다. The cooling sink (570) may be formed of a metal material with good thermal conductivity. For example, the cooling sink (570) may be formed of aluminum or copper.
냉각 싱크(570)는 냉각부(532)에 접촉하는 냉각 싱크 베이스(571)와, 전열 면적을 확대하도록 냉각 싱크 베이스(571)에서 돌출되는 복수의 냉각 핀들(575)을 포함할 수 있다. 복수의 냉각 핀들(525)은 냉각 싱크 베이스(571)에서 아래로 돌출될 수 있다. 냉각 싱크 베이스(571)와 복수의 냉각 핀들(575)은 일체로 형성될 수 있다. The cooling sink (570) may include a cooling sink base (571) that contacts the cooling unit (532) and a plurality of cooling fins (575) that protrude from the cooling sink base (571) to expand the heat transfer area. The plurality of cooling fins (525) may protrude downward from the cooling sink base (571). The cooling sink base (571) and the plurality of cooling fins (575) may be formed integrally.
열전 냉각 장치(400)는 방열 싱크(520)와 본체(100) 외부의 공기의 열교환이 효율적으로 이루어지도록 하기 위해 공기를 유동시키는 방열팬(600)을 포함할 수 있다. The thermoelectric cooling device (400) may include a heat dissipation fan (600) that circulates air to ensure efficient heat exchange between the heat dissipation sink (520) and the air outside the main body (100).
방열팬(600)은 방열 싱크(520)를 향해 송풍하도록 마련될 수 있다. 방열팬(600)은 방열 싱크(520)의 수평 방향에 위치하도록 마련될 수 있다. 방열팬(600)의 본체(100)의 외부에 마련될 수 있다. 방열팬(600)은 상부벽(110)의 상측에 마련될 수 있다.The heat dissipation fan (600) may be arranged to blow air toward the heat dissipation sink (520). The heat dissipation fan (600) may be arranged to be positioned horizontally with respect to the heat dissipation sink (520). The heat dissipation fan (600) may be arranged on the outside of the main body (100). The heat dissipation fan (600) may be arranged on the upper side of the upper wall (110).
방열팬(600)은 축방향으로 공기를 흡입하여 반경 방향들로 토출하는 원심팬일 수 있다. 원심팬은 블로워 팬을 포함할 수 있다. 방열팬(600)의 회전축(610)은 상부벽(110)의 상면에 수직하게 배치될 수 있다. The heat dissipation fan (600) may be a centrifugal fan that draws in air in an axial direction and discharges it in radial directions. The centrifugal fan may include a blower fan. The rotation axis (610) of the heat dissipation fan (600) may be arranged perpendicular to the upper surface of the upper wall (110).
열전 냉각 장치(400)는 방열팬(600)에 의해 유동하는 공기를 안내하도록 마련되는 방열 덕트(700)를 포함할 수 있다. 방열 덕트(700)는 본체(100) 외부의 공기를 흡입하여 방열 싱크(520)와 열교환하도록 안내하고, 방열 싱크(520)와 열교환한 공기를 다시 본체(100) 외부로 배출할 수 있다. The thermoelectric cooling device (400) may include a heat dissipation duct (700) provided to guide air flowing by a heat dissipation fan (600). The heat dissipation duct (700) may guide air from outside the main body (100) to exchange heat with the heat dissipation sink (520), and may discharge the air that has exchanged heat with the heat dissipation sink (520) back to the outside of the main body (100).
방열 덕트(700)는 본체(100) 상측의 외부 공간에서 공기를 흡입할 수 있다. 방열 덕트(700)는 방열 싱크(520)와 열교환한 공기를 본체(100) 상측의 외부 공간으로 배출할 수 있다. 방열팬(600)은 방열 덕트(700)의 내부에 위치할 수 있다. 방열 싱크(520)는 방열 덕트(700)의 내부에 위치할 수 있다. 방열 덕트(700)는 상부벽(110)의 상면에 마련될 수 있다.The heat dissipation duct (700) can draw in air from the external space on the upper side of the main body (100). The heat dissipation duct (700) can discharge air that has exchanged heat with the heat dissipation sink (520) to the external space on the upper side of the main body (100). The heat dissipation fan (600) can be located inside the heat dissipation duct (700). The heat dissipation sink (520) can be located inside the heat dissipation duct (700). The heat dissipation duct (700) can be provided on the upper surface of the upper wall (110).
방열 덕트(700)는 본체(100) 외부의 공기를 방열 덕트(700)의 내부로 흡입하는 외기 흡입구(751)와, 방열 싱크(520)와 열교환한 공기를 본체(100) 외부로 배출하는 외기 배출구(782)를 포함할 수 있다. The heat dissipation duct (700) may include an outside air intake port (751) that draws air outside the main body (100) into the inside of the heat dissipation duct (700), and an outside air exhaust port (782) that discharges air that has exchanged heat with the heat dissipation sink (520) to the outside of the main body (100).
열전 냉각 장치(400)는 냉각 싱크(570)와 저장실(11) 내부의 공기의 열교환이 효율적으로 이루어지도록 하기 위해 공기를 유동시키는 냉각팬(800)을 포함할 수 있다. The thermoelectric cooling device (400) may include a cooling fan (800) that circulates air to ensure efficient heat exchange between the cooling sink (570) and the air inside the storage chamber (11).
냉각팬(800)은 냉각 싱크(570)를 향해 송풍하도록 마련될 수 있다. 냉각팬(800)은 냉각 싱크(570)의 수평 방향에 위치할 수 있다. 냉각팬(800)은 저장실(11)의 내부에 마련될 수 있다. 냉각팬(800)은 상부벽(110)의 하측에 마련될 수 있다. The cooling fan (800) may be arranged to blow air toward the cooling sink (570). The cooling fan (800) may be positioned horizontally with respect to the cooling sink (570). The cooling fan (800) may be arranged inside the storage compartment (11). The cooling fan (800) may be arranged on the lower side of the upper wall (110).
냉각팬(800)은 축방향으로 공기를 흡입하여 반경 방향들로 토출하는 원심팬일 수 있다. 냉각팬(800)의 회전축(810)은 상부벽(110)의 저면에 수직하게 배치될 수 있다. The cooling fan (800) may be a centrifugal fan that sucks in air in an axial direction and discharges it in radial directions. The rotation axis (810) of the cooling fan (800) may be arranged perpendicular to the bottom surface of the upper wall (110).
열전 냉각 장치(400)는 냉각팬(800)에 의해 유동하는 공기를 안내하도록 마련되는 냉각 덕트(900)를 포함할 수 있다. 냉각 덕트(700)는 저장실(11) 내부의 공기를 흡입하여 냉각 싱크(570)와 열교환하도록 안내하고, 냉각 싱크(570)와 열교환한 공기를 다시 저장실(11) 내부로 배출할 수 있다. The thermoelectric cooling device (400) may include a cooling duct (900) provided to guide air flowing by a cooling fan (800). The cooling duct (700) may guide air inside the storage chamber (11) to exchange heat with the cooling sink (570), and may discharge the air that has exchanged heat with the cooling sink (570) back into the storage chamber (11).
냉각팬(800)은 냉각 덕트(900)의 내부에 위치할 수 있다. 냉각 싱크(570)는 냉각 덕트(900)의 내부에 위치할 수 있다. 냉각 덕트(900)는 상부벽(110)의 하면에 마련될 수 있다.The cooling fan (800) may be located inside the cooling duct (900). The cooling sink (570) may be located inside the cooling duct (900). The cooling duct (900) may be provided on the lower surface of the upper wall (110).
냉각 덕트(900)는 저장실(11) 내부의 공기를 냉각 덕트(900)의 내부로 흡입하는 내기 흡입구(991)와, 냉각 싱크(570)와 열교환한 공기를 저장실(11) 내부로 배출하는 내기 배출구(992)를 포함할 수 있다. The cooling duct (900) may include an intake port (991) for drawing air inside the storage room (11) into the interior of the cooling duct (900), and an exhaust port (992) for discharging air that has exchanged heat with the cooling sink (570) into the interior of the storage room (11).
도 4를 참조하면, 냉장고(1)는 냉동 사이클을 통해 저장실을 냉각하도록 냉동 사이클 장치를 포함할 수 있다. 냉동 사이클 장치는 압축기(2)와, 응축기(미도시)와, 팽창 장치(미도시)와, 증발기(3)를 포함할 수 있다. 증발기(3)는 저장실(12, 13)의 후측에 마련될 수 있다.Referring to FIG. 4, the refrigerator (1) may include a refrigeration cycle device to cool the storage compartment through a refrigeration cycle. The refrigeration cycle device may include a compressor (2), a condenser (not shown), an expansion device (not shown), and an evaporator (3). The evaporator (3) may be provided at the rear of the storage compartment (12, 13).
다양한 실시예에 따라, 제1 저장실(11)의 후측에는 증발기가 마련되지 않을 수 있다. 즉, 일 실시예에 따른 냉장고(1)는 하나의 증발기(3)만을 포함할 수 있으며, 증발기(3)는 제2 저장실(12)의 후측에 마련될 수 있다. 또한, 증발기(3)는 수평 격벽(160)을 기준으로 하측에 마련될 수 있다.According to various embodiments, the evaporator may not be provided at the rear side of the first storage compartment (11). That is, the refrigerator (1) according to one embodiment may include only one evaporator (3), and the evaporator (3) may be provided at the rear side of the second storage compartment (12). In addition, the evaporator (3) may be provided at the lower side based on the horizontal bulkhead (160).
냉장고(1)는 증발기(3)의 온도를 측정하기 위한 제상센서(111)를 포함할 수 있다.The refrigerator (1) may include a defrost sensor (111) for measuring the temperature of the evaporator (3).
제상센서(111)는 증발기(3)의 온도를 측정할 수 있다. 증발기(3)의 온도를 측정하는 것은, 증발기(3)의 주변 공기에 온도를 측정하는 것, 증발기(3) 그 자체의 온도를 측정하는 것을 포함할 수 있다.The defrost sensor (111) can measure the temperature of the evaporator (3). Measuring the temperature of the evaporator (3) may include measuring the temperature of the air surrounding the evaporator (3) and measuring the temperature of the evaporator (3) itself.
제상센서(111)는 증발기(3)에 마련될 수도 있고, 증발기 덕트들(60, 70)에 마련될 수도 있다.The defrost sensor (111) may be provided in the evaporator (3) or in the evaporator ducts (60, 70).
냉장고(1)는 증발기(3)에서 생성된 냉기를 안내하는 증발기 덕트들(60, 70)를 포함할 수 있다. 제1 증발기 덕트(60)는 제2 저장실(12) 및 제3 저장실(13)의 후측에 마련될 수 있다. 제2 증발기 덕트(70)는 제1 저장실(11)의 후측에 마련될 수 있다. The refrigerator (1) may include evaporator ducts (60, 70) that guide cold air generated in the evaporator (3). The first evaporator duct (60) may be provided at the rear side of the second storage compartment (12) and the third storage compartment (13). The second evaporator duct (70) may be provided at the rear side of the first storage compartment (11).
증발기(3)에서 생성된 냉기는 증발기 팬(80)에 의해 제1 증발기 덕트(60)의 내부로 흡입될 수 있다. 제1 증발기 덕트(60)의 내부로 흡입된 냉기는 전면에 형성된 냉기 배출구(미도시)를 통해 제2 저장실(12) 또는 제3 저장실(13)로 토출될 수 있다. 또한, 제1 증발기 덕트(60)의 내부로 흡입된 냉기는 제2 증발기 덕트(70)의 내부 유로(78)로 안내될 수 있다. 제1 증발기 덕트(60)에는 제1 증발기 덕트(60)의 내부의 냉기가 제2 증발기 덕트(70)로 공급되는 것을 제어하는 댐퍼(61)가 마련될 수 있다. 제1 증발기 덕트(60)와 제2 증발기 덕트(70)를 연결하도록 제1 증발기 덕트(60)와 제2 증발기 덕트(70)의 사이에 연결 덕트(90)가 구비될 수도 있다. The cold air generated in the evaporator (3) can be sucked into the interior of the first evaporator duct (60) by the evaporator fan (80). The cold air sucked into the interior of the first evaporator duct (60) can be discharged to the second storage chamber (12) or the third storage chamber (13) through a cold air discharge port (not shown) formed on the front. In addition, the cold air sucked into the interior of the first evaporator duct (60) can be guided to the internal passage (78) of the second evaporator duct (70). The first evaporator duct (60) may be provided with a damper (61) that controls the supply of the cold air inside the first evaporator duct (60) to the second evaporator duct (70). A connecting duct (90) may be provided between the first evaporator duct (60) and the second evaporator duct (70) to connect the first evaporator duct (60) and the second evaporator duct (70).
제2 증발기 덕트(70)의 내부 유로(78)는 증발기(3)에서 생성된 냉기를 제1 저장실(11)로 안내할 수 있다.The internal flow path (78) of the second evaporator duct (70) can guide the cold air generated in the evaporator (3) to the first storage chamber (11).
댐퍼(61)는 내부 유로(78)를 개방하거나 폐쇄할 수 있다.The damper (61) can open or close the internal flow path (78).
댐퍼(61)에 의해 내부 유로(78)가 개방되면 증발기(3)에서 생성된 냉기가 제1 저장실(11)로 안내될 수 있다.When the internal passage (78) is opened by the damper (61), the cold air generated in the evaporator (3) can be guided to the first storage chamber (11).
댐퍼(61)에 의해 내부 유로(78)가 폐쇄되면 증발기(3)에서 생성된 냉기가 댐퍼(61)에 가로막혀 제1 저장실(11)로 안내되지 못할 수 있다.When the internal passage (78) is closed by the damper (61), the cold air generated in the evaporator (3) may be blocked by the damper (61) and may not be guided to the first storage chamber (11).
제2 증발기 덕트(70)의 내부 유로(78)로 유입된 냉기는 제2 증발기 덕트(70)의 전면에 형성된 냉기 배출구(72)를 통해 제1 저장실(11)로 공급될 수 있다. Cold air introduced into the internal passage (78) of the second evaporator duct (70) can be supplied to the first storage chamber (11) through the cold air discharge port (72) formed on the front of the second evaporator duct (70).
다만, 상기 실시예와 달리, 증발기(3)에서 생성된 냉기는 제1 증발기 덕트(60)를 거치지 않고 바로 제2 증발기 덕트(70)로 공급될 수도 있다. 또한, 제1 저장실(11)의 후측에 별도의 증발기(3)가 마련되어 제2 증발기 덕트(70)로 냉기를 공급하도록 구성될 수도 있다. However, unlike the above embodiment, the cold air generated in the evaporator (3) may be supplied directly to the second evaporator duct (70) without passing through the first evaporator duct (60). In addition, a separate evaporator (3) may be provided at the rear side of the first storage chamber (11) and configured to supply cold air to the second evaporator duct (70).
이와 같이, 본 개시의 일 실시예에 따른 냉장고(1)는 저장실의 냉각을 위해 열전 냉각 장치(400)와 냉동 사이클 장치를 포함할 수 있다. 따라서, 열전 냉각 장치(400)와 냉동 사이클 장치 중 적어도 하나를 이용하여 저장실을 냉각시킬 수 있다. 예를 들어, 냉동 사이클 장치에 의해 생성된 냉기만을 공급하여 저장실을 냉각시킬 수 있다. 또한, 냉동 사이클 장치에 의해 생성된 냉기와 함께 열전 냉각 장치(400)에 의해 생성된 냉기를 저장실에 공급하여 저장실을 냉각시킬 수 있다.As such, a refrigerator (1) according to one embodiment of the present disclosure may include a thermoelectric cooling device (400) and a refrigeration cycle device for cooling a storage compartment. Accordingly, the storage compartment may be cooled using at least one of the thermoelectric cooling device (400) and the refrigeration cycle device. For example, the storage compartment may be cooled by supplying only the cold air generated by the refrigeration cycle device. Additionally, the storage compartment may be cooled by supplying the cold air generated by the thermoelectric cooling device (400) together with the cold air generated by the refrigeration cycle device to the storage compartment.
냉장고(1)는 외부 조건 및 내부 조건에 따라 저장실(11)에 냉기를 공급할 수 있다. 예를 들어, 냉장고(1)의 외기 온도가 미리 설정된 온도 구간보다 높거나 낮으면, 열전 냉각 장치(400)에 의한 냉각 보다 냉동 사이클 장치에 의한 냉각이 더 효율이 높다. 따라서, 냉장고(1)의 외기온도가 미리 설정된 온도 구간보다 높거나 낮은 경우, 냉동 사이클 장치를 통해 생성된 냉기만으로 저장실(11)을 냉각시킬 수 있다. The refrigerator (1) can supply cold air to the storage compartment (11) depending on external and internal conditions. For example, if the outside temperature of the refrigerator (1) is higher or lower than a preset temperature range, cooling by a refrigeration cycle device is more efficient than cooling by a thermoelectric cooling device (400). Therefore, if the outside temperature of the refrigerator (1) is higher or lower than a preset temperature range, the storage compartment (11) can be cooled only by cold air generated by the refrigeration cycle device.
냉장고(1)의 외기온도가 미리 설정된 온도구간이고, 저장실(11)이 과부하 상태이거나 저장실(11)을 급속 냉각시킬 필요가 있는 경우, 냉동 사이클 장치를 통해 생성된 냉기 및 열전 냉각 장치(400)에 의해 생성된 냉기를 동시에 저장실(11)에 공급하여 저장실(11)을 빠르게 냉각시킬 수 있다. When the outside temperature of the refrigerator (1) is within a preset temperature range and the storage compartment (11) is overloaded or the storage compartment (11) needs to be rapidly cooled, the storage compartment (11) can be quickly cooled by simultaneously supplying cold air generated by the refrigeration cycle device and cold air generated by the thermoelectric cooling device (400) to the storage compartment (11).
한편, 열전 냉각 장치(400)가 본체(100)의 상부벽(110)에 마련되는 것으로 설명하였으나, 열전 냉각 장치(400)의 위치는 이에 제한되지 않는다.Meanwhile, although it has been described that the thermoelectric cooling device (400) is provided on the upper wall (110) of the main body (100), the location of the thermoelectric cooling device (400) is not limited thereto.
다양한 실시예에 따라, 열전 냉각 장치(400)는 상부벽(110)과, 하부벽(120)과, 좌측벽(130)과, 우측벽(140)과, 후벽(150) 중 적어도 하나에 마련될 수 있다.According to various embodiments, the thermoelectric cooling device (400) may be provided on at least one of the upper wall (110), the lower wall (120), the left wall (130), the right wall (140), and the rear wall (150).
도 6은 일 실시예에 따른 열전 냉각 장치를 분해하여 도시한 도면이다.FIG. 6 is an exploded view of a thermoelectric cooling device according to one embodiment.
도 6을 참조하면, 열전 냉각 장치(400)는 열전 모듈(500)을 포함할 수 있다.Referring to FIG. 6, the thermoelectric cooling device (400) may include a thermoelectric module (500).
전술한 열전소자(530)와, 방열 싱크(520)와, 냉각 싱크(570)가 일체로 조립되어 열전 모듈(500)을 구성할 수 있다. 즉, 열전 모듈(500)은 열전소자(530)와, 방열 싱크(520)와, 냉각 싱크(570)와, 모듈 플레이트(550)를 포함할 수 있다.The thermoelectric element (530), heat sink (520), and cooling sink (570) described above can be assembled integrally to form a thermoelectric module (500). That is, the thermoelectric module (500) can include a thermoelectric element (530), a heat sink (520), a cooling sink (570), and a module plate (550).
모듈 플레이트(550)는 열전 모듈(500)의 뼈대 역할을 할 수 있다. 모듈 플레이트(550)는 열전도율이 낮은 수지 재질로 형성될 수 있다. 모듈 플레이트(550)는 방열 싱크(520)와 냉각 싱크(570) 사이의 간격을 유지하고, 방열 싱크(520)와 냉각 싱크(570)를 지지할 수 있다. 모듈 플레이트(550)는 후술할 팬 케이스(650)와 일체로 형성될 수 있다. 그러나, 모듈 플레이트(550)가 팬 케이스(650)와 별개로 마련되는 것도 가능하다.The module plate (550) can serve as a skeleton of the thermoelectric module (500). The module plate (550) can be formed of a resin material having low thermal conductivity. The module plate (550) can maintain a gap between the heat dissipation sink (520) and the cooling sink (570) and support the heat dissipation sink (520) and the cooling sink (570). The module plate (550) can be formed integrally with a fan case (650) to be described later. However, the module plate (550) can also be provided separately from the fan case (650).
모듈 플레이트(550)는 방열 싱크(520)를 지지하는 방열 싱크 지지부(552)를 포함할 수 있다.The module plate (550) may include a heat sink support (552) that supports a heat sink (520).
모듈 플레이트(550)는 모듈 플레이트 개구(551)를 포함할 수 있다. 열전소자(530)는 모듈 플레이트 개구(551)의 내부에 배치될 수 있다. 모듈 플레이트 개구(551)의 상하 방향의 길이는 열전소자(530)의 상하 방향 길이 보다 클 수 있으며, 열전소자(530)는 모듈 플레이트 개구(551)의 상단부 측에 배치될 수 있다. 이와 같이 열전소자(530)가 모듈 플레이트 개구(551) 내부의 상단부 측에 배치되는 이유는 통상적으로 열전소자(530)의 발열량이 흡열량 보다 높으며, 열전소자(530)가 모듈 플레이트 개구(551)의 상단부 측에 위치하는 것이 발열부(531)의 방열에 유리하기 때문이다. The module plate (550) may include a module plate opening (551). The thermoelectric element (530) may be arranged inside the module plate opening (551). The vertical length of the module plate opening (551) may be greater than the vertical length of the thermoelectric element (530), and the thermoelectric element (530) may be arranged on the upper side of the module plate opening (551). The reason why the thermoelectric element (530) is arranged on the upper side inside the module plate opening (551) is because the heat generation amount of the thermoelectric element (530) is typically higher than the heat absorption amount, and the positioning of the thermoelectric element (530) on the upper side of the module plate opening (551) is advantageous for heat dissipation of the heating unit (531).
이와 같이, 열전소자(530)가 모듈 플레이트 개구(551)의 상단부 측에 배치되므로, 냉각 싱크(570)는 열전소자(530)의 냉각부(532)와의 접촉을 위해 냉각 싱크 베이스(571)에서 돌출되는 냉각 전도부(574)를 포함할 수 있다.In this way, since the thermoelectric element (530) is placed on the upper side of the module plate opening (551), the cooling sink (570) may include a cooling conductive portion (574) protruding from the cooling sink base (571) for contact with the cooling portion (532) of the thermoelectric element (530).
열전 모듈(500)은 모듈 플레이트(550)와 열전소자(530)를 단열하는 소자 단열재(540)를 포함할 수 있다. 소자 단열재(540)는 모듈 플레이트 개구(551)에 배치되어 열전소자(530)의 측면이 모듈 플레이트(550)에 접촉하지 않도록 할 수 있다. 소자 단열재(540)는 소자 단열재 개구(541)를 포함하고, 소자 단열재 개구(541)에 열전소자(530)가 수용될 수 있다. The thermoelectric module (500) may include a module plate (550) and an element insulation material (540) that insulates the thermoelectric element (530). The element insulation material (540) may be placed in the module plate opening (551) to prevent a side of the thermoelectric element (530) from contacting the module plate (550). The element insulation material (540) includes an element insulation opening (541), and the thermoelectric element (530) may be accommodated in the element insulation opening (541).
열전 모듈(500)은 모듈 플레이트(550)와 냉각 싱크(570)의 사이에 마련되는 싱크 단열재(580)를 포함할 수 있다. 싱크 단열재(580)는 모듈 플레이트(550)를 통해 방열 싱크(520)와 냉각 싱크(570) 사이에 열이 전달되는 것을 방지할 수 있다. 싱크 단열재(580)는 싱크 단열재 개구(581)를 포함할 수 있다. 다만, 싱크 단열재(580)는 생략될 수 있으며 이 경우 방열 싱크(520)는 모듈 플레이트(550)의 상면에 지지되고 냉각 싱크(570)는 모듈 플레이트(550)의 저면에 지지될 수 있다.The thermoelectric module (500) may include a sink insulation (580) provided between the module plate (550) and the cooling sink (570). The sink insulation (580) may prevent heat from being transferred between the heat dissipation sink (520) and the cooling sink (570) through the module plate (550). The sink insulation (580) may include a sink insulation opening (581). However, the sink insulation (580) may be omitted, in which case the heat dissipation sink (520) may be supported on the upper surface of the module plate (550) and the cooling sink (570) may be supported on the lower surface of the module plate (550).
열전 냉각 장치(400)는 방열팬(600)이 설치되고 방열팬(600)이 송풍하는 공기를 안내하는 팬 케이스(650)를 포함할 수 있다.The thermoelectric cooling device (400) may include a fan case (650) in which a heat dissipation fan (600) is installed and which guides the air blown by the heat dissipation fan (600).
팬 케이스(650)는 모듈 플레이트(550)와 일체로 형성될 수도 있고, 별개로 마련될 수도 있다.The fan case (650) may be formed integrally with the module plate (550) or may be provided separately.
팬 케이스(650)는 방열팬(600)이 회전 가능하게 설치되는 케이스 바닥(650)과, 방열팬(600)으로부터 송풍되는 공기를 방열 싱크(520)를 향해 안내하도록 케이스 바닥(650)의 테두리에서 상측으로 연장된 케이스 스크롤부(670)를 포함할 수 있다. 방열팬(600)은 원심팬이며, 회전축(610)이 케이스 바닥(650)에 수직하도록 케이스 바닥(650)에 설치될 수 있다. 또한, 방열팬(600)의 일 반경 방향에 방열 싱크(520)가 위치하도록 마련될 수 있다. 이러한 구조로써, 열전 냉각 장치(400)의 전체의 수직 방향의 길이가 컴팩트해질 수 있다.The fan case (650) may include a case bottom (650) on which a heat dissipation fan (600) is rotatably installed, and a case scroll part (670) extending upward from the edge of the case bottom (650) to guide air blown from the heat dissipation fan (600) toward a heat dissipation sink (520). The heat dissipation fan (600) is a centrifugal fan, and may be installed on the case bottom (650) so that the rotation axis (610) is perpendicular to the case bottom (650). In addition, the heat dissipation sink (520) may be positioned in one radial direction of the heat dissipation fan (600). With this structure, the overall vertical length of the thermoelectric cooling device (400) can be made compact.
케이스 스크롤부(670)는 방열팬(600)을 에워싸도록 형성될 수 있다. 케이스 스크롤부(670)는 방열 싱크(520)를 향해 개방된 스크롤부 개구(673)를 가질 수 있다. 케이스 스크롤부(670)는 방열팬(600)의 회전 방향(R)에 따른 하류측 단부(671)와, 회전 방향(R)에 따른 상류측 단부(672)를 포함할 수 있다.The case scroll portion (670) may be formed to surround the heat dissipation fan (600). The case scroll portion (670) may have a scroll portion opening (673) open toward the heat dissipation sink (520). The case scroll portion (670) may include a downstream end (671) along the rotational direction (R) of the heat dissipation fan (600) and an upstream end (672) along the rotational direction (R).
팬 케이스(650)는 방열팬(600)으로부터 케이스 스크롤부(670)의 하류측 단부(671) 주변으로 유동하는 공기를 안내하기 위해 마련되는 케이스 가이드(680)를 포함할 수 있다.The fan case (650) may include a case guide (680) provided to guide air flowing from the heat dissipation fan (600) to the area around the downstream end (671) of the case scroll section (670).
방열 싱크(520)는 복수의 방열 핀들(525)을 포함할 수 있다. 복수의 방열 핀들(525)은 방열 싱크 베이스(521)의 상면(522)에서 돌출될 수 있다. 복수의 방열 핀들(525)은 방열 싱크 베이스(521)의 상면(522)에 수직한 방향으로 돌출될 수 있다.The heat sink (520) may include a plurality of heat dissipation fins (525). The plurality of heat dissipation fins (525) may protrude from the upper surface (522) of the heat dissipation sink base (521). The plurality of heat dissipation fins (525) may protrude in a direction perpendicular to the upper surface (522) of the heat dissipation sink base (521).
복수의 방열 핀들(525) 사이에는 방열 채널들이 형성될 수 있다.Heat dissipation channels may be formed between the plurality of heat dissipation fins (525).
방열팬(600)은 방열 싱크(520)를 향해 송풍할 수 있으며, 방열팬(600)에 의해 유동하는 공기는 방열 채널들을 통과하며 복수의 방열 핀들(525)과 열교환할 수 있다. The heat dissipation fan (600) can blow air toward the heat dissipation sink (520), and the air flowing by the heat dissipation fan (600) can pass through the heat dissipation channels and exchange heat with a plurality of heat dissipation fins (525).
냉각 싱크(570)는 복수의 냉각 핀들(575)을 포함할 수 있다. 복수의 냉각 핀들(575)은 냉각 싱크 베이스(571)의 하면에 평행한 방향으로 연장되도록 형성될 수 있다.The cooling sink (570) may include a plurality of cooling fins (575). The plurality of cooling fins (575) may be formed to extend in a direction parallel to the lower surface of the cooling sink base (571).
복수의 냉각 핀들(575) 사이에는 냉각 채널들이 형성될 수 있다.Cooling channels may be formed between the plurality of cooling fins (575).
냉각팬(800)에 의해 유동하는 공기는 냉각 채널들을 통과하며 복수의 냉각 핀들(575)과 열교환할 수 있다.Air flowing by the cooling fan (800) can pass through the cooling channels and exchange heat with a plurality of cooling fins (575).
도 7은 일 실시예에 따른 냉장고의 구성의 일 예를 도시한 블록도이다.FIG. 7 is a block diagram illustrating an example of a configuration of a refrigerator according to one embodiment.
도 7을 참조하면, 일 실시예에 따른 냉장고(1)는 제상센서(111), 고내센서(112), 고외센서(113), 사용자 인터페이스(200), 통신 인터페이스(250), 제1 냉각장치(450), 제2 냉각장치(400) 및 제어부(350)를 포함할 수 있다.Referring to FIG. 7, a refrigerator (1) according to one embodiment may include a defrost sensor (111), an internal sensor (112), an external sensor (113), a user interface (200), a communication interface (250), a first cooling device (450), a second cooling device (400), and a control unit (350).
제상센서(111)는 증발기(3)의 온도를 측정할 수 있다. 제상센서(111)는 증발기(3)의 온도에 관한 정보를 제어부(350)로 전달할 수 있다.The defrost sensor (111) can measure the temperature of the evaporator (3). The defrost sensor (111) can transmit information about the temperature of the evaporator (3) to the control unit (350).
냉장고(1)는 저장실(11)의 온도를 측정하기 위한 고내센서(112)와 본체(100) 외부의 외기온도를 측정하기 위한 고외센서(113)를 포함할 수 있다. 고외센서(113)는 제1 온도센서로 명명하고, 고내센서(112)는 제2 온도센서로 명명할 수 있다.A refrigerator (1) may include an internal sensor (112) for measuring the temperature of a storage compartment (11) and an external sensor (113) for measuring the ambient temperature outside the main body (100). The external sensor (113) may be referred to as a first temperature sensor, and the internal sensor (112) may be referred to as a second temperature sensor.
고내센서(112)는 제1 저장실(11)의 온도를 측정하기 위한 제1 고내온도센서, 제2 저장실(12)의 온도를 측정하기 위한 제2 고내온도센서를 포함할 수 있다. 다양한 실시예에 따라, 고내센서(112)는 제3 저장실(13)의 온도를 측정하기 위한 제3 고내온도센서를 더 포함할 수도 있다.The internal sensor (112) may include a first internal temperature sensor for measuring the temperature of the first storage chamber (11) and a second internal temperature sensor for measuring the temperature of the second storage chamber (12). According to various embodiments, the internal sensor (112) may further include a third internal temperature sensor for measuring the temperature of the third storage chamber (13).
고내센서(112)에서 획득된 정보는 제어부(350)로 전달될 수 있다.Information acquired from the internal sensor (112) can be transmitted to the control unit (350).
고외센서(113)는 본체(100) 외부의 외기온도를 측정하기 위한 고외온도센서를 포함할 수 있다.The external sensor (113) may include an external temperature sensor for measuring the external temperature outside the main body (100).
고외센서(113)에서 획득된 정보는 제어부(350)로 전달될 수 있다.Information acquired from the external sensor (113) can be transmitted to the control unit (350).
냉장고(1)는 사용자 인터페이스(200)를 포함할 수 있다.The refrigerator (1) may include a user interface (200).
사용자 인터페이스(200)는 사용자로부터 수신된 감각 정보(sensory information)를 전기적인 신호로 전환할 수 있다.The user interface (200) can convert sensory information received from the user into an electrical signal.
사용자 인터페이스(200)는 전원 버튼과, 동작 버튼과, 메뉴 선택 버튼과, 냉동/냉장 설정 버튼과, 급속 냉각 설정 버튼 등을 포함할 수 있다. 예를 들어, 택트 스위치(tact switch), 푸시 스위치, 슬라이드 스위치, 토클 스위치, 마이크로 스위치, 터치 스위치, 터치 패드, 터치 스크린, 조그 다이얼, 및/또는 마이크로폰 등을 포함할 수 있다.The user interface (200) may include a power button, an operation button, a menu selection button, a freezing/refrigeration setting button, a rapid cooling setting button, etc. For example, it may include a tact switch, a push switch, a slide switch, a toggle switch, a micro switch, a touch switch, a touch pad, a touch screen, a jog dial, and/or a microphone.
사용자 인터페이스(200)는 사용자에게 냉장고(1)의 동작에 관련된 정보를 시각적으로 또는 청각적으로 전달할 수 있다. 냉장고 동작에 관한 정보는 스크린, 인디케이터, 음성 등으로 출력될 수 있다. 예를 들어, 액정 디스플레이(Liquid Crystal Display, LCD) 패널, 발광 다이오드(Light Emitting Diode, LED) 패널, 스피커 등을 포함할 수 있다.The user interface (200) can visually or audibly convey information related to the operation of the refrigerator (1) to the user. Information related to the operation of the refrigerator can be output through a screen, indicator, voice, etc. For example, it can include a liquid crystal display (LCD) panel, a light emitting diode (LED) panel, a speaker, etc.
냉장고(1)는 외부장치(예: 서버, 사용자 기기)와 유선 및/또는 무선으로 통신하기 위한 통신 인터페이스(250)를 포함할 수 있다.The refrigerator (1) may include a communication interface (250) for communicating with an external device (e.g., a server, a user device) via wires and/or wirelessly.
통신 인터페이스(250)는 근거리 통신 모듈 또는 원거리 통신 모듈 중 적어도 하나를 포함할 수 있다.The communication interface (250) may include at least one of a short-range communication module or a long-range communication module.
통신 인터페이스(250)는 외부장치(예: 서버, 사용자 기기, 온도 프로브)에 데이터를 전송하거나, 외부장치로부터 데이터를 수신할 수 있다. 이를 위해, 통신 인터페이스(250)는 외부장치 간의 직접(예: 유선) 통신 채널 또는 무선 통신 채널의 수립, 및 수립된 통신 채널을 통한 통신 수행을 지원할 수 있다. 일 실시예에 따르면, 통신 인터페이스(250)는 무선 통신 모듈(예: 셀룰러 통신 모듈, 근거리 무선 통신 모듈, 또는 GNSS(global navigation satellite system) 통신 모듈) 또는 유선 통신 모듈(예: LAN(local area network) 통신 모듈, 또는 전력선 통신 모듈)을 포함할 수 있다. 이들 통신 모듈 중 해당하는 통신 모듈은 제 1 네트워크(예: 블루투스, WiFi(wireless fidelity) direct 또는 IrDA(infrared data association)와 같은 근거리 통신 네트워크) 또는 제 2 네트워크(예: 레거시 셀룰러 네트워크, 5G 네트워크, 차세대 통신 네트워크, 인터넷, 또는 컴퓨터 네트워크(예: LAN 또는 WAN)와 같은 원거리 통신 네트워크)를 통하여 외부장치와 통신할 수 있다. 이런 여러 종류의 통신 모듈들은 하나의 구성요소(예: 단일 칩)로 통합되거나, 또는 서로 별도의 복수의 구성요소들(예: 복수 칩들)로 구현될 수 있다.The communication interface (250) can transmit data to an external device (e.g., a server, a user device, a temperature probe), or receive data from an external device. To this end, the communication interface (250) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between external devices, and the performance of communication through the established communication channel. According to one embodiment, the communication interface (250) can include a wireless communication module (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external device via a first network (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips).
근거리 통신 모듈(short-range wireless communication module)은 블루투스 통신 모듈, BLE(Bluetooth Low Energy) 통신 모듈, 근거리 무선 통신 모듈(Near Field Communication module), WLAN(와이파이) 통신 모듈, 지그비(Zigbee) 통신 모듈, 적외선(IrDA, infrared Data Association) 통신 모듈, WFD(Wi-Fi Direct) 통신 모듈, UWB(ultrawideband) 통신 모듈, Ant+ 통신 모듈, 마이크로 웨이브(uWave) 통신 모듈 등을 포함할 수 있으나, 이에 한정되는 것은 아니다. The short-range wireless communication module may include, but is not limited to, a Bluetooth communication module, a BLE (Bluetooth Low Energy) communication module, a near field communication module, a WLAN (Wi-Fi) communication module, a Zigbee communication module, an infrared (IrDA, infrared Data Association) communication module, a WFD (Wi-Fi Direct) communication module, an UWB (ultrawideband) communication module, an Ant+ communication module, a microwave (uWave) communication module, etc.
원거리 통신 모듈은, 다양한 종류의 원거리 통신을 수행하는 통신 모듈을 포함할 수 있으며, 이동 통신 인터페이스를 포함할 수 있다. 이동 통신 인터페이스는 이동 통신망 상에서 기지국, 외부의 단말, 서버 중 적어도 하나와 무선 신호를 송수신한다.The remote communication module may include a communication module that performs various types of remote communication and may include a mobile communication interface. The mobile communication interface transmits and receives wireless signals with at least one of a base station, an external terminal, and a server on a mobile communication network.
일 실시예에서, 통신 인터페이스(250)는 주변의 접속 중계기(AP: Access point)를 통해 외부장치와 통신할 수 있다. 접속 중계기(AP)는 냉장고(1)가 연결된 지역 네트워크(LAN)를 서버가 연결된 광역 네트워크(WAN)에 연결시킬 수 있다. 냉장고(1)는 광역 네트워크(WAN)를 통해 서버에 연결될 수 있다.In one embodiment, the communication interface (250) can communicate with external devices via a peripheral access point (AP). The access point (AP) can connect a local area network (LAN) to which the refrigerator (1) is connected to a wide area network (WAN) to which the server is connected. The refrigerator (1) can be connected to the server via the wide area network (WAN).
냉장고(1)는 통신 인터페이스(250)를 통해 외부장치(예: 서버, 사용자 기기)로부터 각종 신호(예: 날씨 정보, 원격 지시)를 수신할 수 있다.The refrigerator (1) can receive various signals (e.g., weather information, remote instructions) from an external device (e.g., server, user device) through a communication interface (250).
냉장고(1)는 통신 인터페이스(250)를 통해 외부장치에게 각종 신호를 전송할 수 있다.The refrigerator (1) can transmit various signals to an external device through a communication interface (250).
냉장고(1)는 제1 저장실(11) 및/또는 제2 저장실(12)에 냉기를 공급하도록 구성된 제1 냉각장치(450)를 포함할 수 있다.The refrigerator (1) may include a first cooling device (450) configured to supply cold air to a first storage compartment (11) and/or a second storage compartment (12).
제1 냉각장치(450)는 압축기(2)와 증발기 팬(80)을 포함할 수 있다.The first cooling device (450) may include a compressor (2) and an evaporator fan (80).
압축기(2)는 냉매를 압축하여, 압축된 냉매를 열교환기(예: 응축기(미도시)와, 팽창 장치(미도시)와, 증발기(3))로 공급할 수 있다.The compressor (2) can compress the refrigerant and supply the compressed refrigerant to a heat exchanger (e.g., a condenser (not shown), an expansion device (not shown), and an evaporator (3)).
제어부(350)는 압축기(2)를 제어함으로써 증발기(3)에서 생성된 냉기의 온도를 조절할 수 있다. 예를 들어, 제어부(350)는 고내센서(112)에 의해 측정된 온도가 소정의 타겟 온도를 유지하도록 압축기(2)를 제어할 수 있다.The control unit (350) can control the temperature of the cold air generated in the evaporator (3) by controlling the compressor (2). For example, the control unit (350) can control the compressor (2) so that the temperature measured by the internal sensor (112) maintains a predetermined target temperature.
압축기(2)를 제어하는 것은, 압축기(2)의 온/오프를 제어하거나, 압축기(2)의 동작 주파수를 제어하는 것을 포함할 수 있다.Controlling the compressor (2) may include controlling the on/off of the compressor (2) or controlling the operating frequency of the compressor (2).
제어부(350)는 증발기 팬(80)을 제어함으로써 증발기(3)에서 생성된 냉기를 제2 저장실(12)로 송풍할 수 있다.The control unit (350) can blow the cold air generated in the evaporator (3) to the second storage room (12) by controlling the evaporator fan (80).
일 실시예에서, 제어부(350)는 압축기(2)를 구동하는 중에 증발기 팬(80)을 구동할 수 있다.In one embodiment, the control unit (350) can drive the evaporator fan (80) while driving the compressor (2).
일 실시예에서, 제어부(350)는 냉각모드에서, 제1 저장실(11)의 온도를 제1 설정온도로 유지하기 위해 압축기(2)를 제어할 수 있다.In one embodiment, the control unit (350) can control the compressor (2) in cooling mode to maintain the temperature of the first storage chamber (11) at a first set temperature.
일 실시예에서, 제어부(350)는 제1 저장실(11)의 온도를 제1 설정온도로 유지하기 위해 압축기(2)를 구동하는 경우, 증발기 팬(80)을 구동할 수도 있으며, 구동하지 않을 수도 있다. 예를 들어, 제어부(350)는 제2 저장실(12)의 온도가 제2 설정온도 이하인 상태에서 제1 저장실(11)의 온도를 제1 설정온도로 유지하기 위해 압축기(2)를 구동하는 경우에는 증발기 팬(80)을 구동하지 않을 수 있다.In one embodiment, the control unit (350) may or may not drive the evaporator fan (80) when driving the compressor (2) to maintain the temperature of the first storage chamber (11) at the first set temperature. For example, the control unit (350) may not drive the evaporator fan (80) when driving the compressor (2) to maintain the temperature of the first storage chamber (11) at the first set temperature when the temperature of the second storage chamber (12) is lower than the second set temperature.
또 다른 예로, 제어부(350)는 제2 저장실(12)의 온도가 제2 설정온도보다 높은 상태에서 제1 저장실(11)의 온도를 제1 설정온도로 유지하기 위해 압축기(2)를 구동하는 경우에는 증발기 팬(80)을 구동할 수도 있다.As another example, the control unit (350) may drive the evaporator fan (80) when driving the compressor (2) to maintain the temperature of the first storage chamber (11) at the first set temperature while the temperature of the second storage chamber (12) is higher than the second set temperature.
일 실시예에서, 제어부(350)는 냉각모드에서, 제2 저장실(12)의 온도를 제2 저장실(12)의 설정온도(이하 '제2 설정온도')로 유지하기 위해 압축기(2)를 제어할 수 있다.In one embodiment, the control unit (350) can control the compressor (2) in cooling mode to maintain the temperature of the second storage chamber (12) at the set temperature of the second storage chamber (12) (hereinafter, “second set temperature”).
일 실시예에서, 제어부(350)는 제2 저장실(12)의 온도를 제2 설정온도로 유지하기 위해 압축기(2)를 구동하는 경우, 증발기 팬(80)을 구동할 수 있다.In one embodiment, the control unit (350) may drive the evaporator fan (80) when driving the compressor (2) to maintain the temperature of the second storage chamber (12) at the second set temperature.
냉장고(1)는 증발기(3)를 제상하도록 구성된 제상히터(3h)를 포함할 수 있다.The refrigerator (1) may include a defrost heater (3h) configured to defrost the evaporator (3).
증발기(3)를 제상하는 것은, 증발기(3)에 착상된 성에를 제거하는 것을 포함할 수 있다.Defrosting the evaporator (3) may include removing frost formed on the evaporator (3).
제상히터(3h)는 전기 히터 및/또는 시즈 히터를 포함할 수 있으며, 증발기(3)의 주변(예: 하측)에 마련될 수 있다.The evaporator heater (3h) may include an electric heater and/or a sheath heater, and may be provided around (e.g., on the lower side) the evaporator (3).
증발기(3)에 성에가 착상되면 제상센서(111)에 의해 측정된 증발기(3)의 온도가 소정의 온도 이하로 떨어지게 된다.When frost is formed on the evaporator (3), the temperature of the evaporator (3) measured by the defrost sensor (111) drops below a predetermined temperature.
제상히터(3h)가 구동되면 증발기(3)에 착상된 성에가 녹게되고, 이에 따라, 제상센서(111)에 의해 측정된 증발기(3)의 온도가 높아지게 된다.When the defrost heater (3h) is operated, the frost formed on the evaporator (3) melts, and accordingly, the temperature of the evaporator (3) measured by the defrost sensor (111) increases.
제어부(350)는 증발기(3)의 제상을 위해 제상히터(3h)를 구동할 수 있으며, 증발기(3)의 제상이 완료된 것으로 결정되면 제상히터(3h)를 오프할 수 있다.The control unit (350) can drive the defrosting heater (3h) to defrost the evaporator (3), and can turn off the defrosting heater (3h) when it is determined that the defrosting of the evaporator (3) is complete.
냉장고(1)는 제1 냉각장치(450)에 의해 생성된 냉기를 제1 저장실(11)로 안내하기 위한 유로(78)를 개방하거나 폐쇄하는 댐퍼(61)를 포함할 수 있다.The refrigerator (1) may include a damper (61) that opens or closes a passage (78) for guiding cold air generated by the first cooling device (450) to the first storage chamber (11).
제1 냉각장치(450)에 의해 생성된 냉기는 증발기(3)에 의해 생성된 냉기일 수 있다.The cold air generated by the first cooling device (450) may be cold air generated by the evaporator (3).
댐퍼(61)가 유로(78)를 개방하거나 폐쇄할 수 있는 다양한 구성으로 대체될 수 있다. 일 실시예에서, 댐퍼(61)는 전자 제어식 댐퍼 및/또는 기계 제어식 댐퍼일 수 있다. 댐퍼(61)는 회전형 댐퍼, 밸브형 댐퍼, 슬라이딩 댐퍼 등 다양한 형태로 구현될 수 있다.The damper (61) may be replaced with various configurations that can open or close the flow path (78). In one embodiment, the damper (61) may be an electronically controlled damper and/or a mechanically controlled damper. The damper (61) may be implemented in various forms, such as a rotary damper, a valve-type damper, or a sliding damper.
제어부(350)는 제1 저장실(11)의 온도를 낮추기 위해 제1 냉각장치(450)를 구동하고, 유로(78)를 개방하도록 댐퍼(61)를 제어할 수 있다. 제1 냉각장치(450)를 구동하는 것은 압축기(2)를 구동하는 것을 포함할 수 있다.The control unit (350) can control the damper (61) to drive the first cooling device (450) to lower the temperature of the first storage room (11) and to open the duct (78). Driving the first cooling device (450) may include driving the compressor (2).
제어부(350)는 증발기(3)의 제상모드에서 유로(78)를 폐쇄하도록 댐퍼(61)를 제어할 수 있다. 예를 들어, 제어부(350)는 제상히터(3h)를 구동하기 이전에 유로(78)를 폐쇄하도록 댐퍼(61)를 제어할 수 있다.The control unit (350) can control the damper (61) to close the passage (78) in the defrost mode of the evaporator (3). For example, the control unit (350) can control the damper (61) to close the passage (78) before driving the defrost heater (3h).
본 개시에 따르면, 제상히터(3h)를 구동하는 경우 제상히터(3h)에 의해 가열되는 공간과 제1 저장실(11)을 연통하는 유로(78)를 폐쇄함으로써, 제상히터(3h)의 구동에 따라 제1 저장실(11)의 온도가 상승하는 것을 방지할 수 있다.According to the present disclosure, when the defrost heater (3h) is driven, the temperature of the first storage room (11) can be prevented from rising due to the driving of the defrost heater (3h) by closing the passage (78) that connects the space heated by the defrost heater (3h) and the first storage room (11).
제어부(350)는 냉각모드에서 제1 저장실(11)을 냉각하기 위해 유로(78)를 개방하도록 댐퍼(61)를 제어할 수 있다. 예를 들어, 제어부(350)는 압축기(2)를 구동한 후 또는 압축기(2)를 구동하기 이전에 유로(78)를 개방하도록 댐퍼(61)를 제어할 수 있다.The control unit (350) can control the damper (61) to open the passage (78) to cool the first storage chamber (11) in the cooling mode. For example, the control unit (350) can control the damper (61) to open the passage (78) after driving the compressor (2) or before driving the compressor (2).
제어부(350)는 냉각모드에서 제1 저장실(11)의 온도를 유지하기 위해 유로(78)를 폐쇄하도록 댐퍼(61)를 제어할 수 있다. 예를 들어, 제어부(350)는 제1 저장실(11)의 온도가 제1 설정온도로 유지되고 있는 상태에서 제2 저장실(12)을 냉각하여야 하는 경우 유로(78)를 폐쇄하도록 댐퍼(61)를 제어하여 제1 저장실(11)의 온도가 제1 설정온도보다 더 낮아지는 것을 방지할 수 있다. 냉각모드는 제1 저장실(11)의 온도를 제1 설정온도로 유지하고 제2 저장실(12)의 온도를 제2 설정온도로 유지하기 위한 모드일 수 있다.The control unit (350) can control the damper (61) to close the passage (78) to maintain the temperature of the first storage chamber (11) in the cooling mode. For example, when the temperature of the first storage chamber (11) is maintained at the first set temperature and the second storage chamber (12) needs to be cooled, the control unit (350) can control the damper (61) to close the passage (78) to prevent the temperature of the first storage chamber (11) from falling below the first set temperature. The cooling mode can be a mode for maintaining the temperature of the first storage chamber (11) at the first set temperature and maintaining the temperature of the second storage chamber (12) at the second set temperature.
제어부(350)는 냉각모드에서 제1 저장실(11)의 온도를 제1 설정온도로 유지하기 위한 동작과, 제2 저장실(12)의 온도를 제2 설정온도로 유지하기 위한 동작을 각각 독립적으로 수행할 수 있다.The control unit (350) can independently perform an operation to maintain the temperature of the first storage room (11) at the first set temperature in the cooling mode and an operation to maintain the temperature of the second storage room (12) at the second set temperature.
제어부(350)는 냉각모드를 수행하는 중에, 증발기(3)의 제상 조건이 만족되면 제어부(350)는 증발기(3)의 제상모드를 시작할 수 있다. 증발기(3)의 제상모드는 증발기(3)에 착상된 성에를 제거하기 위한 모드로, 제상히터(3h)가 구동되는 모드일 수 있다. 제어부(350)는 증발기(3)의 제상모드에서 제상히터(3h)를 구동할 수 있으며, 제1 저장실(11) 및/또는 제2 저장실(12)의 온도가 상승하더라도 압축기(2)를 구동하지 않을 수 있다.When the control unit (350) is performing the cooling mode, if the defrosting condition of the evaporator (3) is satisfied, the control unit (350) can start the defrosting mode of the evaporator (3). The defrosting mode of the evaporator (3) is a mode for removing frost formed on the evaporator (3), and may be a mode in which the defrosting heater (3h) is driven. The control unit (350) can drive the defrosting heater (3h) in the defrosting mode of the evaporator (3), and may not drive the compressor (2) even if the temperature of the first storage chamber (11) and/or the second storage chamber (12) rises.
이와 같이, 본 개시의 일 실시예에 따른 냉장고(1)는 제1 냉각장치(450)에 의해 생성된 냉기를 저장실에 공급하여 저장실을 냉각시킬 수 있다. 제1 냉각장치(450)에 의해 생성된 냉기를 저장실(11)에 공급하여 저장실(11)을 냉각시키는 것을 제1 냉각으로 명명한다.In this way, the refrigerator (1) according to one embodiment of the present disclosure can cool the storage compartment by supplying cold air generated by the first cooling device (450) to the storage compartment. Cooling the storage compartment (11) by supplying cold air generated by the first cooling device (450) to the storage compartment (11) is referred to as first cooling.
한편, 냉장고(1)는 제1 저장실(11)을 냉각하도록 구성된 제2 냉각장치(400)를 포함할 수 있다. 제2 냉각장치(400)는 앞서 설명한 열전 냉각 장치(400)일 수 있다.Meanwhile, the refrigerator (1) may include a second cooling device (400) configured to cool the first storage compartment (11). The second cooling device (400) may be the thermoelectric cooling device (400) described above.
열전 냉각 장치(400)는 열전소자(530), 방열팬(600) 및/또는 냉각팬(800)을 포함할 수 있다.A thermoelectric cooling device (400) may include a thermoelectric element (530), a heat dissipation fan (600), and/or a cooling fan (800).
열전소자(530)는 전원을 인가 받으면 냉각 싱크(570)와 방열 싱크(520) 사이의 열 교환이 이루어지도록 할 수 있다. 예를 들어, 열전소자(530)는 전기 에너지를 열 에너지로 변환하여 발열부(531)에서 발열 작용이 일어나고 냉각부(532)에서 흡열 작용이 일어나도록 할 수 있다.When power is supplied to the thermoelectric element (530), heat exchange can occur between the cooling sink (570) and the heat sink (520). For example, the thermoelectric element (530) can convert electrical energy into thermal energy, thereby causing a heat generation process in the heating element (531) and an absorption process in the cooling element (532).
발열부(531)에서 발열 작용이 일어나면, 발열부(531)와 접촉된 방열 싱크(520)에 의해 따뜻해진 공기는 본체(100)의 외부로 배출되고, 냉각부(532)와 접촉된 냉각 싱크(570)에 의해 차가워진 공기는 제1 저장실(11)에 공급될 수 있다.When heat generation occurs in the heating unit (531), air warmed by the heat sink (520) in contact with the heating unit (531) is discharged to the outside of the main body (100), and air cooled by the cooling sink (570) in contact with the cooling unit (532) can be supplied to the first storage room (11).
제어부(350)는 열전소자(530)를 제어할 수 있다. 열전소자(530)를 제어하는 것은, 열전소자(530)의 온/오프를 제어하는 것을 포함할 수 있다. 열전소자(530)를 제어하는 것은, 열전소자(530)에 전원을 인가하는 구동회로를 제어하는 것을 포함할 수 있다.The control unit (350) can control the thermoelectric element (530). Controlling the thermoelectric element (530) may include controlling the on/off of the thermoelectric element (530). Controlling the thermoelectric element (530) may include controlling a drive circuit that supplies power to the thermoelectric element (530).
열전소자(530)를 구동하는 것은, 열전소자(530)에게 전기 에너지를 공급하는 것, 즉, 열전소자(530)에게 전원을 공급하는 것을 포함할 수 있다. 열전소자(530)에게 전원을 공급하는 것은 열전소자(530)에게 전압 및/또는 전류를 인가하는 것을 포함할 수 있다.Driving the thermoelectric element (530) may include supplying electrical energy to the thermoelectric element (530), i.e., supplying power to the thermoelectric element (530). Supplying power to the thermoelectric element (530) may include applying voltage and/or current to the thermoelectric element (530).
열전소자(530)를 구동하는 것은, 열전소자(530)를 PWM 제어하는 것을 포함할 수 있다.Driving the thermoelectric element (530) may include PWM controlling the thermoelectric element (530).
열전소자(530)를 오프시키는 것은, 열전소자(530)에게 전기 에너지를 공급하지 않는 것, 즉, 열전소자(530)에게 전원을 공급하지 않는 것을 포함할 수 있다. 열전소자(530)에게 전원을 공급하지 않는 것은 열전소자(530)에게 전압 및/또는 전류를 인가하지 않는 것을 포함할 수 있다. 열전소자(530)에게 전원을 공급하지 않는 것은 열전소자(530)를 PWM 제어하지 않는 것을 포함할 수 있다.Turning off the thermoelectric element (530) may include not supplying electrical energy to the thermoelectric element (530), i.e., not supplying power to the thermoelectric element (530). Not supplying power to the thermoelectric element (530) may include not applying voltage and/or current to the thermoelectric element (530). Not supplying power to the thermoelectric element (530) may include not PWM controlling the thermoelectric element (530).
본 개시에서, 열전소자(530)를 오프시키는 것은 열전소자(530)를 PWM 제어하는 중에 온/오프 듀티비에 따라 열전소자(530)에 간헐적으로 전원을 공급하지 않는 것을 포함하지 않을 수 있다. 즉, 열전소자(530)를 PWM 제어하는 중에 온/오프 듀티비에 따라 열전소자(530)에 간헐적으로 전원이 공급되지 않더라도, 열전소자(530)를 구동하는 중임에는 변함이 없다.In the present disclosure, turning off the thermoelectric element (530) may not include intermittently not supplying power to the thermoelectric element (530) according to the on/off duty ratio while PWM controlling the thermoelectric element (530). That is, even if power is not intermittently supplied to the thermoelectric element (530) according to the on/off duty ratio while PWM controlling the thermoelectric element (530), there is no change in the fact that the thermoelectric element (530) is being driven.
열전소자(530)가 구동되면 방열 싱크(520)는 발열부(531)에 접촉하여 발열부(531)의 열을 흡수하고 본체(100) 외부로 열을 방출할 수 있다.When the thermoelectric element (530) is driven, the heat sink (520) can contact the heating element (531) to absorb the heat of the heating element (531) and release the heat to the outside of the main body (100).
열전소자(530)가 구동되면 냉각 싱크(570)는 저장실(11)의 열을 빼앗아 냉각부(532)로 전달함으로써 제1 저장실(11)을 냉각시킬 수 있다.When the thermoelectric element (530) is driven, the cooling sink (570) can cool the first storage room (11) by taking away the heat from the storage room (11) and transferring it to the cooling unit (532).
일 실시예에서, 제어부(350)는 냉각모드에서, 제1 저장실(11)의 온도를 제1 저장실(11)의 설정 온도(이하 '제1 설정온도')로 유지하기 위해 열전소자(530)를 제어할 수 있다. 제1 저장실(11)의 설정온도는 냉장고(1)의 사용자 인터페이스(200)를 통해 설정되거나, 통신 인터페이스(250)를 통해 외부장치로부터 원격으로 설정될 수도 있다.In one embodiment, the control unit (350) may control the thermoelectric element (530) in the cooling mode to maintain the temperature of the first storage compartment (11) at a set temperature (hereinafter referred to as the “first set temperature”) of the first storage compartment (11). The set temperature of the first storage compartment (11) may be set via the user interface (200) of the refrigerator (1) or may be remotely set from an external device via the communication interface (250).
방열팬(600)은 본체(100) 외부의 공기를 흡입하여 방열 싱크(520)와 열교환하도록 안내하고, 방열 싱크(520)와 열교환한 공기를 다시 본체(100) 외부로 배출할 수 있다.The heat dissipation fan (600) guides air from outside the main body (100) to exchange heat with the heat dissipation sink (520), and can discharge the air that has exchanged heat with the heat dissipation sink (520) back to the outside of the main body (100).
제어부(350)는 방열팬(600)을 제어할 수 있다. 방열팬(600)을 제어하는 것은, 방열팬(600)의 팬 모터를 제어하는 것을 포함할 수 있다. 방열팬(600)을 제어하는 것은, 방열팬(600)을 구동하는 것과 방열팬(600)을 오프시키는 것을 포함할 수 있다. 방열팬(600)을 구동하는 것은 방열팬(600)을 소정의 속도로 회전시키는 것을 포함할 수 있다. 방열팬(600)을 오프시키는 것을 방열팬(600)의 회전을 정지시키는 것을 포함할 수 있다.The control unit (350) can control the heat dissipation fan (600). Controlling the heat dissipation fan (600) may include controlling the fan motor of the heat dissipation fan (600). Controlling the heat dissipation fan (600) may include driving the heat dissipation fan (600) and turning off the heat dissipation fan (600). Driving the heat dissipation fan (600) may include rotating the heat dissipation fan (600) at a predetermined speed. Turning off the heat dissipation fan (600) may include stopping the rotation of the heat dissipation fan (600).
방열팬(600)의 팬 모터는 속도가 제어 가능한 BLDC 모터를 포함할 수 있다.The fan motor of the heat dissipation fan (600) may include a BLDC motor whose speed can be controlled.
방열팬(600)이 동작함에 따라 방열 싱크(520)와 열교환한 공기가 유동함으로써 방열 싱크(520)가 빠르게 방열할 수 있다. 방열 싱크(520)가 빠르게 방열함에 따라 발열부(531)에서의 발열 작용과 냉각부(532)에서의 흡열 작용이 원활히 일어날 수 있다.As the heat dissipation fan (600) operates, the air that has exchanged heat with the heat dissipation sink (520) flows, allowing the heat dissipation sink (520) to quickly dissipate heat. As the heat dissipation sink (520) quickly dissipates heat, the heat generation action in the heating part (531) and the heat absorption action in the cooling part (532) can occur smoothly.
냉각팬(800)은 저장실(11) 내부의 공기를 흡입하여 냉각 싱크(570)와 열교환시키고, 냉각 싱크(570)와 열교환한 공기를 다시 저장실(11) 내부로 배출할 수 있다.The cooling fan (800) can suck in air inside the storage room (11), exchange heat with the cooling sink (570), and discharge the air that has exchanged heat with the cooling sink (570) back into the storage room (11).
제어부(350)는 냉각팬(800)을 제어할 수 있다. 냉각팬(800)을 제어하는 것은, 냉각팬(800)의 팬 모터를 제어하는 것을 포함할 수 있다. 냉각팬(800)을 제어하는 것은, 냉각팬(800)을 구동하는 것과 냉각팬(800)을 오프시키는 것을 포함할 수 있다. 냉각팬(800)을 구동하는 것은 냉각팬(800)을 소정의 속도로 회전시키는 것을 포함할 수 있다. 냉각팬(800)을 오프시키는 것을 냉각팬(800)의 회전을 정지시키는 것을 포함할 수 있다.The control unit (350) can control the cooling fan (800). Controlling the cooling fan (800) may include controlling the fan motor of the cooling fan (800). Controlling the cooling fan (800) may include driving the cooling fan (800) and turning off the cooling fan (800). Driving the cooling fan (800) may include rotating the cooling fan (800) at a predetermined speed. Turning off the cooling fan (800) may include stopping the rotation of the cooling fan (800).
냉각팬(800)의 팬 모터는 속도가 제어 가능한 BLDC 모터를 포함할 수 있다.The fan motor of the cooling fan (800) may include a BLDC motor whose speed can be controlled.
냉각팬(800)이 동작함에 따라 냉각 싱크(570)와 열교환한 공기가 유동함으로써 저장실(11) 내부를 빠르게 냉각할 수 있다. 냉각 싱크(570)와 열교환한 공기가 유동함에 따라 발열부(531)에서의 발열 작용과 냉각부(532)에서의 흡열 작용이 원활히 일어날 수 있다.As the cooling fan (800) operates, the air that has exchanged heat with the cooling sink (570) flows, thereby rapidly cooling the interior of the storage chamber (11). As the air that has exchanged heat with the cooling sink (570) flows, the heat generation action in the heating unit (531) and the heat absorption action in the cooling unit (532) can occur smoothly.
일 실시예에서, 제어부(350)는 열전소자(530)가 온된 것에 기초하여 냉각팬(800)과 방열팬(600)을 동작시킬 수 있다. 제어부(350)는 열전소자(530)가 오프된 것에 기초하여 냉각팬(800)과 방열팬(600)을 오프시킬 수 있다. In one embodiment, the control unit (350) can operate the cooling fan (800) and the heat dissipation fan (600) based on the thermoelectric element (530) being turned on. The control unit (350) can turn off the cooling fan (800) and the heat dissipation fan (600) based on the thermoelectric element (530) being turned off.
일 실시예에서, 제어부(350)는 열전소자(530)의 제상모드에서 열전소자(530)가 오프된 것에 기초하여 냉각팬(800)과 방열팬(600)을 구동할 수 있다. 열전소자(530)의 제상모드는 냉각 싱크(570)에 착상된 성에를 제거하기 위한 모드로, 열전소자(530)가 구동되지 않는 채로 방열팬(600)과 냉각팬(800)이 구동되는 모드일 수 있다. 즉, 제어부(350)는 열전소자(530)를 제상하기 위해 열전소자(530)를 오프시키고, 냉각팬(800)과 방열팬(600)을 구동할 수 있다. In one embodiment, the control unit (350) may drive the cooling fan (800) and the heat dissipation fan (600) based on the fact that the thermoelectric element (530) is turned off in the defrosting mode of the thermoelectric element (530). The defrosting mode of the thermoelectric element (530) may be a mode in which the heat dissipation fan (600) and the cooling fan (800) are driven while the thermoelectric element (530) is not driven, in order to defrost the thermoelectric element (530). That is, the control unit (350) may turn off the thermoelectric element (530) and drive the cooling fan (800) and the heat dissipation fan (600) in order to defrost the thermoelectric element (530).
이와 같이, 본 개시의 일 실시예에 따른 냉장고(1)는 제2 냉각장치(400)에 의해 생성된 냉기를 저장실에 공급하여 저장실을 냉각시킬 수 있다. 제2 냉각장치(400)에 의해 생성된 냉기를 저장실(11)에 공급하여 저장실(11)을 냉각시키는 것을 제2 냉각으로 명명한다. In this way, the refrigerator (1) according to one embodiment of the present disclosure can cool the storage compartment by supplying the cold air generated by the second cooling device (400) to the storage compartment. Cooling the storage compartment (11) by supplying the cold air generated by the second cooling device (400) to the storage compartment (11) is referred to as second cooling.
제어부(350)는 냉장고(1)의 동작을 제어하는 적어도 하나의 프로세서(351) 및 냉장고(1)의 동작을 제어하기 위한 프로그램 및 데이터가 저장된 적어도 하나의 메모리(352)를 포함할 수 있다.The control unit (350) may include at least one processor (351) that controls the operation of the refrigerator (1) and at least one memory (352) that stores a program and data for controlling the operation of the refrigerator (1).
적어도 하나의 메모리(352)는 다양한 실시예를 위해 필요한 데이터를 저장할 수 있다. 메모리(352)는 데이터 저장 용도에 따라 냉장고(1)에 임베디드된 메모리 형태로 구현되거나, 냉장고(1)에 탈부착이 가능한 메모리 형태로 구현될 수도 있다. 예를 들어, 냉장고(1)의 구동을 위한 데이터의 경우 냉장고(1)에 임베디드된 메모리에 저장되고, 냉장고(1)의 확장 기능을 위한 데이터의 경우 냉장고(1)에 탈부착이 가능한 메모리에 저장될 수 있다. 한편, 냉장고(1)에 임베디드된 메모리의 경우 휘발성 메모리(예: DRAM(dynamic RAM), SRAM(static RAM), 또는 SDRAM(synchronous dynamic RAM) 등), 비휘발성 메모리(non-volatile Memory)(예: OTPROM(one time programmable ROM), PROM(programmable ROM), EPROM(erasable and programmable ROM), EEPROM(electrically erasable and programmable ROM), mask ROM, flash ROM, 플래시 메모리(예: NAND flash 또는 NOR flash 등), 하드 드라이브, 또는 솔리드 스테이트 드라이브(solid state drive(SSD)) 중 적어도 하나로 구현될 수 있다. 또한, 냉장고(1)에 탈부착이 가능한 메모리의 경우 메모리 카드(예를 들어, CF(compact flash), SD(secure digital), Micro-SD(micro secure digital), Mini-SD(mini secure digital), xD(extreme digital), MMC(multi-media card) 등), USB 포트에 연결가능한 외부 메모리(예를 들어, USB 메모리) 등과 같은 형태로 구현될 수 있다.At least one memory (352) can store data required for various embodiments. The memory (352) may be implemented as a memory embedded in the refrigerator (1) or as a memory detachable from the refrigerator (1) depending on the purpose of data storage. For example, data for operating the refrigerator (1) may be stored in a memory embedded in the refrigerator (1), and data for expanding the functions of the refrigerator (1) may be stored in a memory detachable from the refrigerator (1). Meanwhile, in the case of memory embedded in the refrigerator (1), it may be implemented as at least one of volatile memory (e.g., DRAM (dynamic RAM), SRAM (static RAM), or SDRAM (synchronous dynamic RAM)), non-volatile memory (e.g., OTPROM (one time programmable ROM), PROM (programmable ROM), EPROM (erasable and programmable ROM), EEPROM (electrically erasable and programmable ROM), mask ROM, flash ROM, flash memory (e.g., NAND flash or NOR flash), hard drive, or solid state drive (SSD)). In addition, in the case of memory that can be attached or detached to the refrigerator (1), it may be implemented in the form of a memory card (e.g., CF (compact flash), SD (secure digital), Micro-SD (micro secure digital), Mini-SD (mini secure digital), xD (extreme digital), MMC (multi-media card)), external memory that can be connected to a USB port (e.g., USB memory), etc.
적어도 하나의 프로세서(351)는 냉장고(1)의 동작을 전반적으로 제어한다. 구체적으로, 적어도 하나의 프로세서(351)는 냉장고(1)의 각 구성(제상센서(111), 고내센서(112), 고외센서(113), 사용자 인터페이스(200), 통신 인터페이스(250), 제1 냉각장치(450), 제2 냉각장치(400), 제상히터(3h), 및/또는 댐퍼(61) 등)과 연결되어 냉장고(1)의 동작을 전반적으로 제어할 수 있다. 예를 들어, 적어도 하나의 프로세서(351)는 메모리(352)와 전기적으로 연결되어 냉장고(1)의 전반적인 동작을 제어할 수 있다. 프로세서(351)는 하나 또는 복수의 프로세서로 구성될 수 있다.At least one processor (351) controls the overall operation of the refrigerator (1). Specifically, at least one processor (351) is connected to each component of the refrigerator (1) (defrost sensor (111), internal sensor (112), external sensor (113), user interface (200), communication interface (250), first cooling device (450), second cooling device (400), defrost heater (3h), and/or damper (61), etc.) to control the overall operation of the refrigerator (1). For example, at least one processor (351) is electrically connected to a memory (352) to control the overall operation of the refrigerator (1). The processor (351) may be composed of one or more processors.
적어도 하나의 프로세서(351)는 메모리(352)에 저장된 적어도 하나의 인스트럭션(instruction)을 실행함으로써, 다양한 실시예에 따른 냉장고(1)의 동작을 수행할 수 있다.At least one processor (351) can perform operations of the refrigerator (1) according to various embodiments by executing at least one instruction stored in the memory (352).
적어도 하나의 프로세서(351)는 CPU (Central Processing Unit), GPU (Graphics Processing Unit), APU (Accelerated Processing Unit), MIC (Many Integrated Core), DSP (Digital Signal Processor), NPU (Neural Processing Unit), 하드웨어 가속기 또는 머신 러닝 가속기 중 하나 이상을 포함할 수 있다. 적어도 하나의 프로세서(351)는 냉장고(1)의 다른 구성요소 중 하나 또는 임의의 조합을 제어할 수 있으며, 통신에 관한 동작 또는 데이터 처리를 수행할 수 있다. 적어도 하나의 프로세서(351)는 메모리(352)에 저장된 적어도 하나의 프로그램 또는 명령어(instruction)를 실행할 수 있다. 예를 들어, 적어도 하나의 프로세서(351)는 메모리(352)에 저장된 적어도 하나의 명령어를 실행함으로써, 본 개시의 적어도 하나의 실시예에 따른 방법을 수행할 수 있다.At least one processor (351) may include one or more of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an APU (Accelerated Processing Unit), an MIC (Many Integrated Core), a DSP (Digital Signal Processor), an NPU (Neural Processing Unit), a hardware accelerator, or a machine learning accelerator. At least one processor (351) may control one or any combination of other components of the refrigerator (1), and may perform operations related to communication or data processing. At least one processor (351) may execute at least one program or instruction stored in the memory (352). For example, at least one processor (351) may perform a method according to at least one embodiment of the present disclosure by executing at least one instruction stored in the memory (352).
본 개시의 일 실시예에 따른 냉장고(1)는 저장실(11)의 냉각을 위해 제1 냉각장치(450) 및 제2 냉각장치(400)를 포함하고, 제1 냉각장치(450) 및 제2 냉각장치(400) 중 적어도 하나를 이용하여 저장실(11)을 냉각시킬 수 있다. 예를 들어, 저장실(11)의 냉각을 위해 제1 냉각장치(450)에 의한 제1 냉각만을 수행하거나, 제1 냉각장치(450)에 의한 제1 냉각 및 제2 냉각장치(400)에 의한 제2 냉각을 동시에 수행할 수 있다. 이와 같이, 냉장고(1)에서 저장실(11)을 냉각시키는 방법은 제1 냉각만을 수행하여 저장실(11)을 냉각시키는 제1 방법과 제1 냉각 및 제2 냉각을 함께 수행하여 저장실(11)을 냉각시키는 제2 방법을 포함할 수 있다.A refrigerator (1) according to one embodiment of the present disclosure includes a first cooling device (450) and a second cooling device (400) for cooling a storage compartment (11), and can cool the storage compartment (11) using at least one of the first cooling device (450) and the second cooling device (400). For example, only the first cooling by the first cooling device (450) may be performed for cooling the storage compartment (11), or both the first cooling by the first cooling device (450) and the second cooling by the second cooling device (400) may be performed simultaneously. In this way, a method for cooling the storage compartment (11) in the refrigerator (1) may include a first method for cooling the storage compartment (11) by performing only the first cooling, and a second method for cooling the storage compartment (11) by performing both the first cooling and the second cooling.
냉장고(1)는 외부 조건 및 내부 조건에 따라 적절한 방법으로 저장실(11)에 냉기를 공급할 수 있다. 저장실(11)의 과부하 조건 또는 급속 냉각 조건에서는 외기온도가 미리 설정된 온도구간인 것에 기초하여 제1 냉각 및 제2 냉각을 함께 수행할 수 있다. 저장실(11)의 과부하 조건 또는 급속 냉각 조건이 아닌 경우에는 제1 냉각만을 수행할 수 있다.The refrigerator (1) can supply cold air to the storage compartment (11) in an appropriate manner depending on external and internal conditions. In an overload condition or rapid cooling condition of the storage compartment (11), first cooling and second cooling can be performed together based on the outside temperature being within a preset temperature range. In a condition other than an overload condition or rapid cooling condition of the storage compartment (11), only first cooling can be performed.
도 8은 일 실시예에 따른 냉장고의 제어방법의 순서도의 일 예를 도시한다.Figure 8 illustrates an example of a flowchart of a method for controlling a refrigerator according to one embodiment.
도 8을 참조하면, 제어부(350)는 과부하 조건 또는 급속 냉각 조건이 만족되었는지 여부를 판단할 수 있다(1000).Referring to FIG. 8, the control unit (350) can determine whether an overload condition or a rapid cooling condition is satisfied (1000).
과부하 조건은 저장실(11, 12, 13)의 과부하 조건일 수 있다. 과부하 조건은 저장실(11, 12, 13)의 온도와 관련된 조건이라는 점에서 온도 조건일 수 있다. 예를 들어, 과부하 조건은 저장실(11)의 과부하 조건일 수 있다. 저장실(11)의 과부하 조건은 저장실(11)의 온도가 저장실(11)의 설정온도보다 소정의 온도 이상 높은 것을 포함할 수 있다.The overload condition may be an overload condition of the storage room (11, 12, 13). The overload condition may be a temperature condition in that it is a condition related to the temperature of the storage room (11, 12, 13). For example, the overload condition may be an overload condition of the storage room (11). The overload condition of the storage room (11) may include the temperature of the storage room (11) being higher than a set temperature of the storage room (11) by a predetermined temperature or more.
제어부(350)는 저장실(11)의 온도가 저장실(11)의 설정온도보다 소정의 온도 이상 높은 과부하 온도보다 높은 것에 기초하여 과부하 조건이 만족된 것으로 판단할 수 있다.The control unit (350) can determine that the overload condition is satisfied based on the temperature of the storage room (11) being higher than the overload temperature, which is a predetermined temperature higher than the set temperature of the storage room (11).
급속 냉각 조건은 사용자 인터페이스(200)를 통해 급속 냉각 명령이 수신된 것을 포함할 수 있다.Rapid cooling conditions may include receiving a rapid cooling command via the user interface (200).
제어부(350)는 사용자 인터페이스(200)를 통해 급속 냉각 명령이 수신된 것에 기초하여 급속 냉각 조건이 만족된 것으로 결정할 수 있다.The control unit (350) can determine that the rapid cooling condition is satisfied based on the rapid cooling command received through the user interface (200).
급속 냉각 조건은 초기 냉각 조건을 포함할 수 있다. 초기 냉각 조건은 냉장고(1)의 초기 기동과 관련된 조건일 수 있다. 초기 냉각 조건은 저장실(11)의 온도 및 증발기(3)의 온도와 관련된 조건일 수 있다.The rapid cooling conditions may include initial cooling conditions. The initial cooling conditions may be conditions related to the initial start-up of the refrigerator (1). The initial cooling conditions may be conditions related to the temperature of the storage compartment (11) and the temperature of the evaporator (3).
제어부(350)는 저장실(11)의 온도가 제1 온도이상이고, 증발기(3)의 온도가 제2 온도이상이면, 초기 냉각 조건이 만족된 것으로 결정할 수 있다.The control unit (350) can determine that the initial cooling condition is satisfied if the temperature of the storage room (11) is higher than the first temperature and the temperature of the evaporator (3) is higher than the second temperature.
제어부(350)는 초기 냉각 조건이 만족된 것에 기초하여 급속 냉각 조건이 만족된 것으로 결정할 수 있다.The control unit (350) can determine that the rapid cooling condition is satisfied based on the initial cooling condition being satisfied.
제어부(350)는 과부하 조건 또는 급속 냉각 조건이 만족되지 않은 것(1000, 아니오)에 응답하여 제1 냉각만을 수행할 수 있다(1300). 제1 냉각만을 수행하는 것은, 압축기(2)와 열전소자(530) 중에서 압축기(2)만을 구동하는 것을 포함할 수 있다.The control unit (350) may perform only the first cooling (1300) in response to the overload condition or rapid cooling condition not being satisfied (1000, No). Performing only the first cooling may include driving only the compressor (2) among the compressor (2) and the thermoelectric element (530).
제어부(350)는 과부하 조건 또는 급속 냉각 조건이 만족된 것(1000, 예)에 응답하여 외기온도 조건이 만족되었는지 여부를 판단할 수 있다(1100).The control unit (350) can determine whether the outside temperature condition is satisfied (1100) in response to the overload condition or rapid cooling condition being satisfied (1000, example).
외기온도 조건은 냉장고의 외기온도의 온도구간과 관련된 조건일 수 있다. 외기온도 조건은 외기온도가 미리 설정된 온도구간인 것을 포함할 수 있다.The outside temperature condition may be a condition related to the temperature range of the outside temperature of the refrigerator. The outside temperature condition may include the outside temperature being within a preset temperature range.
제어부(350)는 고외센서(113)를 통해 감지된 외기온도가 미리 설정된 온도구간인 것에 기초하여 외기온도 조건이 만족된 것으로 결정할 수 있다.The control unit (350) can determine that the outside temperature condition is satisfied based on the outside temperature detected through the external sensor (113) being within a preset temperature range.
제어부(350)는 외기온도 조건이 만족된 것(1100, 예)에 응답하여 제1 냉각 및 제2 냉각을 함께 수행할 수 있다(1200).The control unit (350) can perform first cooling and second cooling together (1200) in response to the outside temperature condition being satisfied (1100, example).
제1 냉각 및 제2 냉각을 함께 수행하는 것은, 압축기(2)와 열전소자(530)를 함께 구동하는 것을 포함할 수 있다.Performing the first cooling and the second cooling together may include driving the compressor (2) and the thermoelectric element (530) together.
제어부(350)는 외기온도 조건이 만족되지 않은 것(1100, 아니오)에 응답하여 제1 냉각만을 수행할 수 있다(1300).The control unit (350) can perform only the first cooling in response to the outside temperature condition not being satisfied (1100, no) (1300).
기존의 냉장고는 제1 냉각 또는 제2 냉각 중 어느 하나의 냉각방식만을 적용하였다. 제1 냉각방식에서는 소형 압축기일수록 효율이 높으나 최대 부하 대응을 위하여 기존의 냉장고는 대형 압축기를 채용하였다. 제2 냉각방식은 소형으로 구현 가능하나 효율이 제1 냉각방식에 대비하여 떨어지기 때문에 와인셀러 등 소형 냉장고에만 사용되었다.Conventional refrigerators utilize only one cooling method: primary or secondary cooling. Primary cooling uses a smaller compressor for greater efficiency, but to accommodate peak loads, conventional refrigerators employ larger compressors. Secondary cooling can be implemented in smaller units, but its efficiency is lower than primary cooling, so it's only used in small refrigerators like wine cellars.
제1 냉각방식은 압축기 배기량에 의하여 최대 냉력이 결정되기 때문에 과 부하영역에서 사용하기 위해서는 배기량이 큰 압축기를 사용할 수 밖에 없다. 이 경우 고배기량 압축기를 사용함으로 인해 효율이 떨어지게 된다.Since the first cooling method's maximum cooling capacity is determined by the compressor displacement, a compressor with a large displacement must be used in a high-load range. In this case, the use of a high-displacement compressor reduces efficiency.
제2 냉각방식은 열전소자 자체의 효율이 제1 냉각방식보다 낮아 일반 냉장고에 적용하기에는 비효율적이다.The second cooling method is inefficient for application to general refrigerators because the efficiency of the thermoelectric element itself is lower than that of the first cooling method.
본 개시의 일 실시예에 따른 냉장고(1)는, 하이브리드 냉장고로서 냉장고(1)의 냉각을 위해 2가지 냉각원(압축기와 열전소자)을 복합적으로 사용하여 제1 냉각방식의 단점을 보완할 수 있다.A refrigerator (1) according to one embodiment of the present disclosure is a hybrid refrigerator that can compensate for the shortcomings of the first cooling method by using two cooling sources (a compressor and a thermoelectric element) in combination to cool the refrigerator (1).
본 개시의 일 실시예에 따른 냉장고(1)는, 제1 냉각방식과 제2 냉각방식을 복합적으로 사용 가능하여 저배기량 압축기로 제1 냉각방식을 구현할 수 있다.A refrigerator (1) according to one embodiment of the present disclosure can use the first cooling method and the second cooling method in combination, and can implement the first cooling method with a low-displacement compressor.
본 개시의 일 실시예에 따른 냉장고(1)는, 저부하 영역에서는 제1 냉각만으로 저장실을 냉각할 수 있어 저배기량 압축기로도 고효율 운전이 가능하다. A refrigerator (1) according to one embodiment of the present disclosure can cool a storage room using only the first cooling in a low-load region, thereby enabling high-efficiency operation even with a low-displacement compressor.
본 개시의 일 실시예에 따른 냉장고(1)는, 과부하 조건 또는 순간적으로 높은 냉력이 필요한 조건에서는 제1 냉각 및 제2 냉각을 함께 수행함으로써 과부하 또는 필요 부하에 대한 대응이 가능하다. 즉, 저부하 영역에서는 제1 냉각을 수행함으로써 저배기량 압축기의 사용으로 제1 냉각방식의 효율을 극대화할 수 있고, 과부하 영역 또는 급속 냉각 영역에서는 제1 냉각과 제2 냉각을 함께 수행함으로써 저배기량 압축기를 사용하는 제1 냉각의 단점인 부하대응 능력저하를 제2 냉각을 함께 사용하여 보완할 수 있다.According to one embodiment of the present disclosure, a refrigerator (1) can respond to overload or required load by performing first cooling and second cooling together in an overload condition or a condition requiring instantaneous high cooling capacity. That is, in a low-load area, by performing first cooling, the efficiency of the first cooling method can be maximized by using a low-displacement compressor, and in an overload area or a rapid cooling area, by performing first cooling and second cooling together, the disadvantage of the first cooling method using a low-displacement compressor, which is a decrease in load response capability, can be supplemented by using second cooling together.
도 9는 일 실시예에 따른 냉장고의 제어방법에서, 외기온도에 따라 저장실을 냉각하는 동작을 도시한다.FIG. 9 illustrates an operation of cooling a storage compartment according to an outside temperature in a control method of a refrigerator according to one embodiment.
도 9를 참조하면, 제어부(350)는 고외센서(113)를 통해 냉장고(1)의 외기온도를 감지할 수 있다(2000).Referring to Fig. 9, the control unit (350) can detect the outside temperature of the refrigerator (1) through the external sensor (113) (2000).
제어부(350)는 외기온도가 소정의 온도이상인지 여부를 판단할 수 있다(2100).The control unit (350) can determine whether the outside temperature is above a predetermined temperature (2100).
소정의 온도는 제2 냉각장치(400)의 열전소자(530)가 최적의 펠티어 효과를 발생할 수 있는 외기온도범위의 상한온도를 포함할 수 있다. 열전소자(530)는 냉각 측과 방열 측의 온도 차이에 의해 작동하기 때문에 외기온도가 너무 높으면 방열측이 효과적으로 열을 배출하지 못해 냉각 효율이 떨어질 수 있다. 예를 들어, 소정의 온도는 40℃일 수 있다.The predetermined temperature may include the upper limit of the ambient temperature range at which the thermoelectric element (530) of the second cooling device (400) can generate the optimal Peltier effect. Since the thermoelectric element (530) operates based on the temperature difference between the cooling side and the heat dissipation side, if the ambient temperature is too high, the heat dissipation side may not be able to effectively dissipate heat, resulting in a decrease in cooling efficiency. For example, the predetermined temperature may be 40°C.
제어부(350)는 외기온도가 소정의 온도이상인 것(2100, 예)에 응답하여 제1 냉각만을 수행할 수 있다(2200). 예를 들어, 외기온도가 40℃ 이상이면, 제1 냉각만을 수행할 수 있다.The control unit (350) can perform only the first cooling (2200) in response to the outside temperature being higher than a predetermined temperature (2100, example). For example, if the outside temperature is higher than 40°C, only the first cooling can be performed.
제어부(350)는 외기온도가 소정의 온도이상이 아닌 것(2100, 아니오)에 응답하여 외기온도가 미리 설정된 온도구간인지 여부를 판단할 수 있다(2300).The control unit (350) can determine whether the outside temperature is within a preset temperature range (2300) in response to the outside temperature not being higher than a predetermined temperature (2100, no).
미리 설정된 온도구간은 열전소자(530)가 최적의 펠티어 효과를 발휘할 수 있는 외기온도범위를 포함할 수 있다. 예를 들어, 미리 설정된 온도구간은 22℃ 내지 39℃일 수 있다.The preset temperature range may include an ambient temperature range in which the thermoelectric element (530) can exhibit the optimal Peltier effect. For example, the preset temperature range may be 22°C to 39°C.
제어부(350)는 외기온도가 미리 설정된 온도구간이 아닌 것(2300, 아니오)에 응답하여 제1 냉각만을 수행할 수 있다. 예를 들어, 외기온도가 21℃ 이하이면, 제1 냉각만을 수행할 수 있다.The control unit (350) can perform only the first cooling in response to the outside temperature not being within the preset temperature range (2300, No). For example, if the outside temperature is 21°C or lower, only the first cooling can be performed.
제어부(350)는 외기온도가 미리 설정된 온도구간인 것(2300, 예)에 응답하여 제1 냉각만을 수행하거나, 제1 냉각 및 제2 냉각을 함께 수행할 수 있다(2400). 예를 들어, 외기온도가 22℃ 내지 39℃이고 저장실의 온도와 관련된 과부하 조건이 만족되면, 제1 냉각 및 제2 냉각을 함께 수행할 수 있다. 외기온도가 22℃ 내지 39℃이더라도 과부하 조건이 만족되지 않으면, 제1 냉각만을 수행할 수 있다.The control unit (350) may perform only the first cooling or perform both the first cooling and the second cooling in response to the outside temperature being within a preset temperature range (2300, example) (2400). For example, if the outside temperature is between 22°C and 39°C and an overload condition related to the temperature of the storage room is satisfied, the first cooling and the second cooling may be performed together. If the overload condition is not satisfied even when the outside temperature is between 22°C and 39°C, only the first cooling may be performed.
다른 실시예에서, 저장실의 과냉 조건이 만족된 것에 기초하여 제2 냉각을 종료할 수 있다. 과냉 조건은 저장실의 설정온도와 관련된 과냉온도 미만을 소정시간 연속 감지 후 과냉온도보다 높은 온도가 감지된 것을 포함할 수 있다. 예를 들어, 냉장실 오프온도(일예로, 냉장실 설정온도 - 1.0℃) - 1.0℃ 미만 10분 연속 감지 후 냉장실 오프온도 이상 감지시 까지 제2 냉각을 종료할 수 있다.In another embodiment, the second cooling may be terminated based on the satisfaction of a subcooling condition of the storage compartment. The subcooling condition may include detecting a temperature higher than the subcooling temperature after continuously detecting a temperature below the subcooling temperature related to the set temperature of the storage compartment for a predetermined period of time. For example, the second cooling may be terminated until the refrigerator off temperature is detected to be higher than the refrigerator off temperature (e.g., the refrigerator set temperature - 1.0°C) after continuously detecting a temperature below -1.0°C for 10 minutes.
다른 실시예에서, 냉각부하(팬, 압축기 등)의 에러가 소정시간 동안 연속 발생하거나, 저장실의 도어 개방이 연속 소정시간 경과시 도어 폐쇄가 감지될 때까지 등의 응축수 과다 발생 조건에서 제2 냉각을 종료할 수 있다.In another embodiment, the second cooling may be terminated under conditions of excessive condensate generation, such as when an error in the cooling load (fan, compressor, etc.) occurs continuously for a predetermined period of time, or when the door of the storage room is opened continuously for a predetermined period of time until the door is detected to be closed.
도 10은 일 실시예에 따른 냉장고의 제어방법에서, 외기온도가 제1 온도구간일 때 저장실을 냉각하는 동작을 도시한다.FIG. 10 illustrates an operation of cooling a storage compartment when the outside temperature is in a first temperature range in a control method of a refrigerator according to one embodiment.
도 10을 참조하면, 제어부(350)는 외기온도가 제1 온도구간일 때 고내센서(112)를 통해 저장실(11)의 온도를 감지할 수 있다(3000).Referring to FIG. 10, the control unit (350) can detect the temperature of the storage room (11) through the internal sensor (112) when the outside temperature is in the first temperature range (3000).
예를 들어, 제1 온도구간은 34℃ 내지 39℃일 수 있다.For example, the first temperature range may be 34°C to 39°C.
제어부(350)는 외기온도가 34℃ 내지 39℃ 이내이면, 저장실(11)의 온도를 감지할 수 있다.The control unit (350) can detect the temperature of the storage room (11) when the outside temperature is within 34°C to 39°C.
제어부(350)는 저장실(11)의 온도와 관련된 과부하 조건이 만족되는지 여부를 판단할 수 있다(3100).The control unit (350) can determine whether an overload condition related to the temperature of the storage room (11) is satisfied (3100).
제어부(350)는 저장실(11)의 온도와 관련된 과부하 조건이 만족된 것(3100, 예)에 기초하여 제1 냉각 및 제2 냉각을 함께 수행할 수 있다(3200).The control unit (350) can perform first cooling and second cooling together (3200) based on whether an overload condition related to the temperature of the storage room (11) is satisfied (3100, example).
제어부(350)는 저장실(11)의 온도와 관련된 과부하 조건이 만족되지 않은 것(3100, 아니오)에 기초하여 제1 냉각만을 수행할 수 있다(3300).The control unit (350) can perform only the first cooling (3300) based on the fact that the overload condition related to the temperature of the storage room (11) is not satisfied (3100, No).
저장실(11)의 온도와 관련된 과부하 조건은 제1 온도구간에 대응하는 제1 시작조건과 제1 종료조건을 포함할 수 있다. 저장실(11)의 온도와 관련된 과부하 조건은 제1 시작조건이 만족된 후 제1 종료조건이 만족되는 조건을 포함할 수 있다.The overload condition related to the temperature of the storage room (11) may include a first start condition and a first end condition corresponding to a first temperature range. The overload condition related to the temperature of the storage room (11) may include a condition in which the first end condition is satisfied after the first start condition is satisfied.
제1 시작조건은, 저장실(11)의 온도가 저장실(11)의 설정온도와 관련된 제1 시작온도(T1 ON) 이상인 것을 포함할 수 있다. 저장실(11)의 설정온도와 관련된 제1 시작온도(T1 ON)는 저장실 온 온도(일예로, 저장실 설정온도 + 1℃)를 기준으로 정해진 온도일 수 있다. 예를 들면, T1 ON는 저장실 온 온도 + 4℃ 일 수 있다.The first starting condition may include that the temperature of the storage room (11) is higher than or equal to a first starting temperature (T1 ON) related to the set temperature of the storage room (11). The first starting temperature (T1 ON) related to the set temperature of the storage room (11) may be a temperature determined based on the storage room on-temperature temperature (for example, the storage room set temperature + 1°C). For example, T1 ON may be the storage room on-temperature temperature + 4°C.
제1 종료조건은, 저장실(11)의 온도가 저장실(11)의 설정온도와 관련된 제1 종료온도(T1 OFF) 이하인 것을 포함할 수 있다. 저장실(11)의 설정온도와 관련된 제1 종료온도(T1 OFF)는 저장실 온 온도(일예로, 저장실 설정온도 + 1℃)를 기준으로 정해진 온도일 수 있다. 예를 들면, T1 OFF는 저장실 온 온도 - 2℃ 일 수 있다.The first termination condition may include that the temperature of the storage room (11) is lower than or equal to a first termination temperature (T1 OFF) related to the set temperature of the storage room (11). The first termination temperature (T1 OFF) related to the set temperature of the storage room (11) may be a temperature determined based on the storage room temperature (for example, the storage room set temperature + 1°C). For example, T1 OFF may be the storage room temperature - 2°C.
제어부(350)는 제1 시작조건이 만족된 경우 제2 냉각을 시작하고, 제1 종료조건이 만족된 경우 제2 냉각을 종료할 수 있다. 예를 들면, 저장실(11)의 온도가 저장실 온 온도 + 4℃ 이상이면, 수행 중인 제1 냉각과 함께 수행되도록 제2 냉각을 시작하고, 제2 냉각의 추가 수행으로 인해 저장실(11)의 온도가 저장실 온 온도 - 2℃ 이하까지 빠르게 낮아지면 제2 냉각을 종료하고 제1 냉각만을 수행할 수 있다.The control unit (350) can start the second cooling when the first start condition is satisfied, and can end the second cooling when the first end condition is satisfied. For example, if the temperature of the storage room (11) is equal to or higher than the storage room temperature + 4°C, the second cooling can be started to be performed together with the first cooling that is being performed, and if the temperature of the storage room (11) is quickly lowered to or lower than the storage room temperature - 2°C due to the additional performance of the second cooling, the second cooling can be ended and only the first cooling can be performed.
도 11은 일 실시예에 따른 냉장고의 제어방법에서, 외기온도가 제2 온도구간일 때 저장실을 냉각하는 동작을 도시한다.FIG. 11 illustrates an operation of cooling a storage compartment when the outside temperature is in a second temperature range in a control method of a refrigerator according to one embodiment.
도 11을 참조하면, 제어부(350)는 외기온도가 제2 온도구간일 때 고내센서(112)를 통해 저장실(11)의 온도를 감지할 수 있다(4000).Referring to Fig. 11, the control unit (350) can detect the temperature of the storage room (11) through the internal sensor (112) when the outside temperature is in the second temperature range (4000).
예를 들어, 제2 온도구간은 22℃ 내지 33℃일 수 있다.For example, the second temperature range may be 22°C to 33°C.
제어부(350)는 외기온도가 22℃ 내지 33℃ 이내이면, 저장실(11)의 온도를 감지할 수 있다.The control unit (350) can detect the temperature of the storage room (11) when the outside temperature is within 22°C to 33°C.
제어부(350)는 저장실(11)의 온도와 관련된 과부하 조건이 만족되는지 여부를 판단할 수 있다(4100).The control unit (350) can determine whether an overload condition related to the temperature of the storage room (11) is satisfied (4100).
제어부(350)는 저장실(11)의 온도와 관련된 과부하 조건이 만족된 것(4100, 예)에 기초하여 제1 냉각 및 제2 냉각을 함께 수행할 수 있다(4200).The control unit (350) can perform the first cooling and the second cooling together (4200) based on whether an overload condition related to the temperature of the storage room (11) is satisfied (4100, example).
제어부(350)는 저장실(11)의 온도와 관련된 과부하 조건이 만족되지 않은 것(4100, 아니오)에 기초하여 제1 냉각만을 수행할 수 있다(4300).The control unit (350) can perform only the first cooling (4300) based on the fact that the overload condition related to the temperature of the storage room (11) is not satisfied (4100, No).
저장실(11)의 온도와 관련된 과부하 조건은 제2 온도구간에 대응하는 제2 시작조건과 제2 종료조건을 포함할 수 있다. 저장실(11)의 온도와 관련된 과부하 조건은 제2 시작조건이 만족된 후 제2 종료조건이 만족되는 조건을 포함할 수 있다.The overload condition related to the temperature of the storage room (11) may include a second start condition and a second end condition corresponding to a second temperature range. The overload condition related to the temperature of the storage room (11) may include a condition in which the second end condition is satisfied after the second start condition is satisfied.
제2 시작조건은, 저장실(11)의 온도가 저장실(11)의 설정온도와 관련된 제2 시작온도(T2 ON) 이상인 것을 포함할 수 있다. 저장실(11)의 설정온도와 관련된 제2 시작온도(T2 ON)는 저장실 온 온도(일예로, 저장실 설정온도 + 1℃)를 기준으로 정해진 온도일 수 있다. 예를 들면, T2 ON는 저장실 온 온도 + 6℃ 일 수 있다. 참고로, 제상 후 첫 냉동 사이클인 경우에는 T2 ON는 저장실 온 온도 + 10℃ 일 수 있다.The second starting condition may include that the temperature of the storage compartment (11) is higher than or equal to a second starting temperature (T2 ON) related to the set temperature of the storage compartment (11). The second starting temperature (T2 ON) related to the set temperature of the storage compartment (11) may be a temperature determined based on the storage compartment temperature (for example, the storage compartment set temperature + 1°C). For example, T2 ON may be the storage compartment temperature + 6°C. For reference, in the case of the first refrigeration cycle after defrosting, T2 ON may be the storage compartment temperature + 10°C.
제2 종료조건은, 저장실(11)의 온도가 저장실(11)의 설정온도와 관련된 제2 종료온도(T2 OFF) 이하인 것을 포함할 수 있다. 저장실(11)의 설정온도와 관련된 제2 종료온도(T2 OFF)는 저장실 온 온도(일예로, 저장실 설정온도 + 1℃)를 기준으로 정해진 온도일 수 있다. 예를 들면, T2 OFF는 저장실 온 온도 일 수 있다.The second termination condition may include that the temperature of the storage room (11) is lower than or equal to a second termination temperature (T2 OFF) related to the set temperature of the storage room (11). The second termination temperature (T2 OFF) related to the set temperature of the storage room (11) may be a temperature determined based on the storage room on-temperature temperature (for example, the storage room set temperature + 1°C). For example, T2 OFF may be the storage room on-temperature temperature.
제어부(350)는 제2 시작조건이 만족된 경우 제2 냉각을 시작하고, 제2 종료조건이 만족된 경우 제2 냉각을 종료할 수 있다. 예를 들면, 저장실(11)의 온도가 저장실 온 온도 + 6℃ 이상이면, 수행 중인 제1 냉각과 함께 수행되도록 제2 냉각을 시작하고, 제2 냉각의 추가 수행으로 인해 저장실(11)의 온도가 저장실 온 온도 이하까지 빠르게 낮아지면 제2 냉각을 종료하고 제1 냉각만을 수행할 수 있다.The control unit (350) can start the second cooling when the second start condition is satisfied, and can end the second cooling when the second end condition is satisfied. For example, if the temperature of the storage room (11) is equal to or higher than the storage room temperature + 6°C, the second cooling can be started to be performed together with the first cooling that is being performed, and if the temperature of the storage room (11) is quickly lowered to below the storage room temperature due to the additional performance of the second cooling, the second cooling can be ended and only the first cooling can be performed.
이상과 같이, 본 개시의 일 측면에 따른 냉장고(1)는, 외기온도에 따라 제1 냉각 및 제2 냉각이 동시에 수행되는 저장실 온도와 관련된 과부하 조건이 달라질 수 있다.As described above, in a refrigerator (1) according to one aspect of the present disclosure, the overload condition related to the storage room temperature in which the first cooling and the second cooling are performed simultaneously may vary depending on the outside temperature.
외기온도가 제1 온도구간(34℃ 내지 39℃)이고, 저장실(11)의 온도가 과부하 조건의 제1 시작조건(저장실 온 온도 + 4℃ 이상)이 만족된 경우 이미 수행 중인 제1 냉각과 함께 수행되도록 제2 냉각을 시작할 수 있다. 제1 종료조건(저장실 온 온도 - 2℃ 이하)이 만족된 경우 제2 냉각을 종료하고 제1 냉각만을 수행할 수 있다. If the outside temperature is in the first temperature range (34°C to 39°C) and the temperature of the storage room (11) satisfies the first start condition (storage room temperature + 4°C or higher) of the overload condition, the second cooling can be started to be performed together with the first cooling that is already being performed. If the first end condition (storage room temperature - 2°C or lower) is satisfied, the second cooling can be terminated and only the first cooling can be performed.
외기온도가 제2 온도구간(22℃ 내지 33℃)이고, 저장실(11)의 온도가 과부하 조건의 제2 시작조건(저장실 온 온도 + 6℃ 이상)이 만족된 경우 이미 수행 중인 제1 냉각과 함께 수행되도록 제2 냉각을 시작할 수 있다. 제2 종료조건(저장실 온 온도 이하)이 만족된 경우 제2 냉각을 종료하고 제1 냉각만을 수행할 수 있다.If the outside temperature is in the second temperature range (22°C to 33°C) and the temperature of the storage room (11) satisfies the second start condition (storage room temperature + 6°C or higher) of the overload condition, the second cooling can be started to be performed together with the first cooling that is already being performed. If the second end condition (storage room temperature or lower) is satisfied, the second cooling can be terminated and only the first cooling can be performed.
이와 같이, 외기온도가 높은 온도구간인 경우 상대적으로 제2 냉각의 시작시점은 앞당겨지고 종료시점은 늦춰져 제2 냉각을 빨리 시작하고 오래 지속할 수 있어 효율적인 과부하 대응이 가능하다. 또한, 외기온도가 낮은 온도구간인 경우 상대적으로 제2 냉각의 시작시점은 늦춰지고, 종료시점은 앞당겨져 제2 냉각을 늦게 시작하고 짧게 지속할 수 있어 효율적인 과부하 대응이 가능하다.Thus, in temperature ranges where the outside temperature is high, the start time of the second cooling is relatively advanced and the end time is relatively delayed, allowing the second cooling to begin quickly and last longer, effectively responding to overload. Furthermore, in temperature ranges where the outside temperature is low, the start time of the second cooling is relatively delayed and the end time is relatively advanced, allowing the second cooling to begin later and last shorter, effectively responding to overload.
이하에서는 저장실(11)의 급속 냉각 조건에서 제1 냉각 및 제2 냉각을 함께 수행하는 것을 설명한다.Below, the first cooling and second cooling are performed together under rapid cooling conditions in the storage room (11).
도 12는 일 실시예에 따른 냉장고의 제어방법에서, 급속 냉각 조건에서 저장실을 냉각하는 동작의 일 예를 도시한다. Fig. 12 illustrates an example of an operation for cooling a storage room under rapid cooling conditions in a control method of a refrigerator according to one embodiment.
도 12를 참조하면, 제어부(350)는 고외센서(113)를 통해 냉장고(1)의 외기온도를 감지할 수 있다(5000).Referring to Fig. 12, the control unit (350) can detect the outside temperature of the refrigerator (1) through the external sensor (113) (5000).
제어부(350)는 외기온도가 소정의 온도이상인지 여부를 판단할 수 있다(5100). 예를 들어, 소정의 온도는 40℃일 수 있다.The control unit (350) can determine whether the outside temperature is above a predetermined temperature (5100). For example, the predetermined temperature may be 40°C.
제어부(350)는 외기온도가 소정의 온도이상인 것(5100, 예)에 응답하여 제1 냉각만을 수행할 수 있다(5200). 예를 들어, 외기온도가 40℃ 이상이면, 제1 냉각만을 수행할 수 있다.The control unit (350) can perform only the first cooling (5200) in response to the outside temperature being higher than a predetermined temperature (5100, example). For example, if the outside temperature is higher than 40°C, only the first cooling can be performed.
제어부(350)는 외기온도가 소정의 온도이상이 아닌 것(5100, 아니오)에 응답하여 사용자 인터페이스(200)를 통해 급속 냉각 명령이 수신되는지를 판단할 수 있다(5300). 급속 냉각 명령이 수신되면 급속 냉각 조건이 만족된 것으로 결정할 수 있다.The control unit (350) can determine whether a rapid cooling command is received through the user interface (200) in response to the outside temperature not being higher than a predetermined temperature (5100, No) (5300). If a rapid cooling command is received, it can be determined that the rapid cooling condition is satisfied.
제어부((350)는 사용자 인터페이스(200)를 통해 급속 냉각 명령이 수신되지 않은 것(5300, 아니오)에 기초하여 제1 냉각만을 수행할 수 있다(5200).The control unit ((350) can perform only the first cooling (5200) based on the fact that a rapid cooling command is not received (5300, No) via the user interface (200).
제어부(350)는 사용자 인터페이스(200)를 통해 급속 냉각 명령이 수신된 것(5300, 예)에 기초하여 제1 냉각 및 제2 냉각을 함께 수행할 수 있다(5400). 이때, 제어부(350)는 급속 냉각 명령이 수신된 것에 기초하여 저장실의 온도와 관련된 과부하 조건의 만족 여부와 무관하게 제1 냉각 및 제2 냉각을 함께 수행할 수 있다.The control unit (350) may perform the first cooling and the second cooling together (5400) based on the receipt of a rapid cooling command (5300, example) through the user interface (200). At this time, the control unit (350) may perform the first cooling and the second cooling together regardless of whether an overload condition related to the temperature of the storage room is satisfied based on the receipt of the rapid cooling command.
제어부(350)는 고내센서(112)를 통해 저장실(11)의 온도를 감지할 수 있다(5500).The control unit (350) can detect the temperature of the storage room (11) through the internal sensor (112) (5500).
제어부(350)는 저장실(11)의 온도가 제3 종료조건(T3 OFF 이하)을 만족하는지 여부를 판단할 수 있다(5600). T3 OFF는 급속 냉각 명령에 의해 수행된 제2 냉각을 종료하기 위한 종료온도로서, 제1 냉각 및 제2 냉각을 함께 수행한 후 저장실(11)의 온도가 저장실 오프온도에 처음 도달한 온도일 수 있다.The control unit (350) can determine whether the temperature of the storage room (11) satisfies the third termination condition (T3 OFF or lower) (5600). T3 OFF is the termination temperature for terminating the second cooling performed by the rapid cooling command, and may be the temperature at which the temperature of the storage room (11) first reaches the storage room off temperature after performing the first cooling and the second cooling together.
제어부(350)는 제3 종료조건(T3 OFF 이하)이 만족되지 않은 것(5600, 아니오)에 응답하여 제1 냉각 및 제2 냉각을 함께 수행할 수 있다(5400).The control unit (350) can perform the first cooling and the second cooling together (5400) in response to the third termination condition (T3 OFF or lower) not being satisfied (5600, No).
제어부(350)는 제3 종료조건(T3 OFF 이하)이 만족된 것(5600, 예)에 응답하여 제2 냉각을 종료하고 제1 냉각만을 수행할 수 있다(5200).The control unit (350) can terminate the second cooling and perform only the first cooling in response to the third termination condition (T3 OFF or lower) being satisfied (5600, example) (5200).
한편, 제어부(350)는 외기온도가 소정의 온도 이상이면 급속 냉각 명령을 수신하더라도 제1 냉각만을 수행할 수 있다. 외기온도가 40℃ 이상이면, 제2 냉각에 따른 냉기가 정상적으로 생성되지 않으므로 급속 냉각 명령의 수신 여부에 무관하게 제1 냉각만을 수행할 수 있다.Meanwhile, the control unit (350) can only perform the first cooling even if a rapid cooling command is received when the outside temperature is above a predetermined temperature. If the outside temperature is above 40°C, cold air according to the second cooling is not normally generated, so only the first cooling can be performed regardless of whether a rapid cooling command is received.
도 13은 일 실시예에 따른 냉장고의 제어방법에서, 급속 냉각 조건에서 저장실을 냉각하는 동작의 다른 예를 도시한다.Fig. 13 illustrates another example of an operation for cooling a storage compartment under rapid cooling conditions in a control method of a refrigerator according to one embodiment.
도 13을 참조하면, 제어부(350)는 저장실 온도와 증발기 온도와 관련된 초기 냉각 조건이 만족되는지 여부를 판단할 수 있다(6000).Referring to FIG. 13, the control unit (350) can determine whether the initial cooling conditions related to the storage room temperature and the evaporator temperature are satisfied (6000).
초기 냉각 조건은 냉장고(1)의 초기 기동과 관련된 조건일 수 있다. 예를 들어, 초기 냉각 조건은 냉동실인 저장실(12)의 온도 및 증발기(3)의 온도와 관련된 조건일 수 있다.The initial cooling conditions may be conditions related to the initial operation of the refrigerator (1). For example, the initial cooling conditions may be conditions related to the temperature of the storage compartment (12), which is a freezer compartment, and the temperature of the evaporator (3).
제어부(350)는 냉동실(12)의 온도가 제1 온도이상이고, 증발기(3)의 온도가 제2 온도이상이면, 초기 냉각 조건이 만족된 것으로 결정할 수 있다. 예를 들어, 냉장고(1)의 전원이 온 된 후 냉동실(12)의 고내온도가 10℃ 이상이고, 증발기(3)의 온도가 10℃ 이상이면, 초기 기동으로 판단하여 초기 냉각 조건이 만족된 것으로 결정할 수 있다. 초기 냉각 조건이 만족되면, 급속 냉각 조건이 만족된 것으로 결정할 수 있다.The control unit (350) can determine that the initial cooling condition is satisfied if the temperature of the freezer (12) is higher than the first temperature and the temperature of the evaporator (3) is higher than the second temperature. For example, if the internal temperature of the freezer (12) is higher than 10°C and the temperature of the evaporator (3) is higher than 10°C after the refrigerator (1) is turned on, it can be determined that the initial startup has occurred and the initial cooling condition is satisfied. If the initial cooling condition is satisfied, it can be determined that the rapid cooling condition is satisfied.
제어부(350)는 초기 냉각 조건이 만족된 것(6000, 예)에 응답하여 제1 냉각만을 수행할 수 있다(6100). 예를 들어, 냉장고(1)의 전원이 온 된 후 5분 동안은 제1 냉각만을 수행할 수 있다. 이 5분 동안 냉장고(1)의 각종 온도센서를 통해 각각의 온도정보를 수집할 수 있다. The control unit (350) can perform only the first cooling (6100) in response to the initial cooling condition being satisfied (6000, example). For example, only the first cooling can be performed for 5 minutes after the refrigerator (1) is turned on. During this 5-minute period, temperature information can be collected through each temperature sensor of the refrigerator (1).
제어부(350)는 제1 냉각만을 수행한 시점으로부터 소정시간이 경과하였는지 여부를 판단할 수 있다(6200). 예를 들어, 5분이 경과하였는지를 판단할 수 있다.The control unit (350) can determine whether a predetermined time has elapsed since the first cooling was performed (6200). For example, it can determine whether 5 minutes have elapsed.
제어부(350)는 소정시간이 경과하면(6200, 예), 고외센서(113)를 외기온도를 감지할 수 있다(6300). The control unit (350) can detect the outside temperature using the external sensor (113) (6300) when a predetermined time has elapsed (6200, for example).
제어부(350)는 외기온도가 소정의 온도 이상인지 여부를 판단할 수 있다(6400). The control unit (350) can determine whether the outside temperature is higher than a predetermined temperature (6400).
제어부(350)는 외기온도가 소정의 온도이상인 것(6400, 예)에 응답하여 제1 냉각만을 수행할 수 있다(6500). 예를 들어, 외기온도가 40℃ 이상이면, 제1 냉각만을 수행할 수 있다.The control unit (350) can perform only the first cooling (6500) in response to the outside temperature being higher than a predetermined temperature (6400, example). For example, if the outside temperature is higher than 40°C, only the first cooling can be performed.
제어부(350)는 외기온도가 소정의 온도이상이 아닌 것(6400, 아니오)에 응답하여 제1 냉각 및 제2 냉각을 함께 수행할 수 있다(6600). 예를 들어, 외기온도가 40℃ 미만이면, 제1 냉각 및 제2 냉각을 함께 수행할 수 있다. 제1 냉각 및 제2 냉각을 함께 수행함으로써 초기 냉각 조건에서 저장실(11)을 빠르게 냉각시킬 수 있다.The control unit (350) can perform the first cooling and the second cooling simultaneously (6600) in response to the outside temperature not being higher than a predetermined temperature (6400, No). For example, if the outside temperature is lower than 40°C, the first cooling and the second cooling can be performed simultaneously. By performing the first cooling and the second cooling simultaneously, the storage room (11) can be quickly cooled from the initial cooling condition.
제어부(350)는 고내센서(112)를 통해 저장실(11)의 온도를 감지할 수 있다(6700).The control unit (350) can detect the temperature of the storage room (11) through the internal sensor (112) (6700).
제어부(350)는 저장실(11)의 온도가 제4 종료조건(T4 OFF 이하)을 만족하는지 여부를 판단할 수 있다(6800). T4 OFF는 초기 냉각 조건에서 수행된 제2 냉각을 종료하기 위한 종료온도로서, 저장실 오프온도 + 4℃ 일 수 있다.The control unit (350) can determine whether the temperature of the storage room (11) satisfies the fourth termination condition (T4 OFF or lower) (6800). T4 OFF is the termination temperature for terminating the second cooling performed under the initial cooling condition, and may be the storage room off temperature + 4°C.
제어부(350)는 제4 종료조건(T4 OFF 이하)이 만족되지 않은 것(6800, 아니오)에 응답하여 제1 냉각 및 제2 냉각의 수행을 유지할 수 있다.The control unit (350) can maintain the performance of the first cooling and the second cooling in response to the fourth termination condition (T4 OFF or lower) not being satisfied (6800, No).
제어부(350)는 제4 종료조건(T4 OFF 이하)이 만족된 것(5600, 아니오)에 응답하여 제2 냉각을 종료하고 제1 냉각만을 수행할 수 있다(6900).The control unit (350) can terminate the second cooling and perform only the first cooling in response to the satisfaction of the fourth termination condition (T4 OFF or lower) (5600, No) (6900).
한편, 제어부(350)는 외기온도가 소정의 온도 이상이면 초기 냉각 조건이 만족되더라도 제1 냉각만을 수행할 수 있다.Meanwhile, the control unit (350) can perform only the first cooling even if the initial cooling condition is satisfied if the outside temperature is higher than a predetermined temperature.
본 개시에 따르면, 압축기에 의한 제1 냉각방식과 열전소자에 의한 제2 냉각방식을 복합적으로 사용 가능하여 저부하 영역에서는 제1 냉각만으로 저장실을 냉각할 수 있어 저배기량 압축기로도 고효율 운전이 가능하고, 과부하 조건 또는 급속 냉각 조건에서는 외기온도가 미리 설정된 온도구간인 경우 제1 냉각 및 제2 냉각으로 저장실을 냉각할 수 있어 과부하 또는 필요 부하에 대한 대응이 가능하다. 즉, 저부하 영역에서는 제1 냉각을 수행함으로써 저배기량 압축기의 사용으로 제1 냉각방식의 효율을 극대화할 수 있고, 과부하 영역 또는 급속 냉각 영역에서는 제1 냉각과 제2 냉각을 함께 수행함으로써 저배기량 압축기를 사용하는 제1 냉각의 단점인 부하대응 능력저하를 제2 냉각을 함께 사용하여 보완할 수 있다.According to the present disclosure, the first cooling method using a compressor and the second cooling method using a thermoelectric element can be used in combination, so that in a low-load area, the storage room can be cooled by the first cooling method alone, thereby enabling high-efficiency operation even with a low-displacement compressor, and in an overload condition or a rapid cooling condition, when the outside temperature is in a preset temperature range, the storage room can be cooled by the first cooling and the second cooling, thereby enabling response to an overload or a required load. That is, in a low-load area, the efficiency of the first cooling method can be maximized by using a low-displacement compressor by performing the first cooling, and in an overload area or a rapid cooling area, the first cooling and the second cooling are performed together, thereby complementing the disadvantage of the first cooling method using a low-displacement compressor, which is a reduced load response capability, by using the second cooling together.
본 개시의 일 실시예에 따른 냉장고(1)는, 저장실(11)을 형성하는 본체(100); 압축기(2)와 증발기(3)를 포함하고, 저장실(11)을 냉각시키는 제1 냉각장치(450); 열전소자(530)를 포함하고, 저장실(11)을 냉각시키는 제2 냉각장치(400); 본체 외부의 외기온도를 감지하는 제1 온도센서(113); 저장실의 온도를 감지하는 제2 온도센서(112); 및 저장실(11)의 온도가 상기 저장실(11)의 설정온도보다 소정의 온도 이상 높은 과부하 조건에서는 외기온도가 미리 설정된 온도구간인 것에 기초하여 제1 냉각장치(450)에 의해 저장실(11)을 냉각시키는 제1 냉각 및 제2 냉각장치(400)에 의해 저장실(11)을 냉각시키는 제2 냉각을 함께 수행하고, 외기온도가 미리 설정된 온도구간이 아닌 것에 기초하여 제1 냉각만을 수행하는 적어도 하나의 프로세서(351);를 포함할 수 있다.A refrigerator (1) according to one embodiment of the present disclosure comprises: a main body (100) forming a storage compartment (11); a first cooling device (450) including a compressor (2) and an evaporator (3) and cooling the storage compartment (11); a second cooling device (400) including a thermoelectric element (530) and cooling the storage compartment (11); a first temperature sensor (113) detecting an external temperature outside the main body; a second temperature sensor (112) detecting a temperature of the storage compartment; And in an overload condition where the temperature of the storage room (11) is higher than the set temperature of the storage room (11) by a predetermined temperature or more, the first cooling for cooling the storage room (11) by the first cooling device (450) and the second cooling for cooling the storage room (11) by the second cooling device (400) are performed together based on the outside temperature being in a preset temperature range, and at least one processor (351) for performing only the first cooling based on the outside temperature not being in a preset temperature range.
미리 설정된 온도 구간은, 제1 온도구간 및 상기 제1 온도구간보다 낮은 제2 온도구간을 포함할 수 있다. 과부하 조건은, 제1 온도구간에 대응하는 제1 시작조건과 제2 종료조건; 및 제2 온도구간에 대응하는 제2 시작조건과 제2 종료조건을 포함할 수 있다. The preset temperature range may include a first temperature range and a second temperature range lower than the first temperature range. The overload condition may include a first start condition and a second end condition corresponding to the first temperature range, and a second start condition and a second end condition corresponding to the second temperature range.
적어도 하나의 프로세서(351)는, 외기온도가 제1 온도구간에 해당하면, 제1 시작조건이 만족된 경우 제2 냉각을 시작하고, 제1 종료조건이 만족된 경우 제2 냉각을 종료하며, 외기온도가 제2 온도구간에 해당하면, 제2 시작조건이 만족된 경우 제2 냉각을 시작하고, 제2 종료조건이 만족된 경우 제2 냉각을 종료할 수 있다.At least one processor (351) may start second cooling when the first start condition is satisfied and end second cooling when the first end condition is satisfied if the outside temperature corresponds to the first temperature range, and may start second cooling when the second start condition is satisfied and end second cooling when the second end condition is satisfied if the outside temperature corresponds to the second temperature range.
제1 시작조건은, 저장실(11)의 온도가 저장실(11)의 설정온도와 관련된 제1 온도 이상인 것을 포함하고, 제2 시작조건은, 저장실(11)의 온도가 제1 온도보다 높고 저장실(11)의 설정온도와 관련된 제2 온도 이상인 것을 포함할 수 있다.The first starting condition may include that the temperature of the storage room (11) is higher than or equal to a first temperature related to the set temperature of the storage room (11), and the second starting condition may include that the temperature of the storage room (11) is higher than the first temperature and higher than or equal to a second temperature related to the set temperature of the storage room (11).
제1 종료조건은, 저장실(11)의 온도가 저장실(11)의 설정온도와 관련된 제1 온도 이하인 것을 포함하고, 제2 종료조건은, 저장실의 온도가 제1 온도보다 높고 저장실(11)의 설정온도와 관련된 제2 온도 이하인 것을 포함할 수 있다.The first termination condition may include that the temperature of the storage room (11) is lower than or equal to a first temperature related to the set temperature of the storage room (11), and the second termination condition may include that the temperature of the storage room is higher than the first temperature and lower than or equal to a second temperature related to the set temperature of the storage room (11).
적어도 하나의 프로세서(351)는, 사용자 인터페이스(200)를 통해 급속 냉각 명령이 수신된 것에 기초하여 과부하 조건의 만족 여부와 무관하게 제1 냉각 및 상기 제2 냉각을 함께 수행할 수 있다.At least one processor (351) can perform the first cooling and the second cooling together regardless of whether the overload condition is satisfied based on a rapid cooling command received through the user interface (200).
적어도 하나의 프로세서(351)는, 외기온도가 소정의 온도 이상이면 급속 냉각 명령을 수신하더라도 제1 냉각만을 수행할 수 있다.At least one processor (351) can perform only the first cooling even if a rapid cooling command is received when the outside temperature is higher than a predetermined temperature.
적어도 하나의 프로세서(351)는, 저장실(12)의 온도 및 증발기(3)의 온도에 기초하여 초기 냉각 조건이 만족되는지 여부를 결정하고, 초기 냉각 조건이 만족된 것에 기초하여 제1 냉각 및 제2 냉각을 함께 수행할 수 있다.At least one processor (351) can determine whether the initial cooling condition is satisfied based on the temperature of the storage chamber (12) and the temperature of the evaporator (3), and perform the first cooling and the second cooling together based on the initial cooling condition being satisfied.
적어도 하나의 프로세서(351)는, 초기 냉각 조건이 만족된 시점부터 미리 설정된 시간 동안 제1 냉각만을 수행하고, 미리 설정된 시간이 경과된 것에 기초하여 수행 중인 제1 냉각과 동시 수행하도록 제2 냉각을 시작하고, 저장실(11)의 온도가 저장실(11)의 설정온도와 관련된 미리 설정된 온도까지 감소된 것에 기초하여 제2 냉각을 종료할 수 있다.At least one processor (351) may perform only the first cooling for a preset time from the time when the initial cooling condition is satisfied, start the second cooling to be performed simultaneously with the first cooling being performed based on the elapsed preset time, and end the second cooling based on the temperature of the storage room (11) being reduced to a preset temperature related to the set temperature of the storage room (11).
적어도 하나의 프로세서(351)는, 외기온도가 소정의 온도 이상이면 초기 냉각 조건이 만족되더라도 제1 냉각만을 수행할 수 있다.At least one processor (351) can perform only the first cooling even if the initial cooling condition is satisfied when the outside temperature is higher than a predetermined temperature.
본 개시의 일 실시예에 따른 냉장고(1)의 제어방법은, 압축기(2)와 증발기(3)를 포함하고 저장실(11)을 냉각시키는 제1 냉각장치(450); 열전소자(530)를 포함하고 저장실(11)을 냉각시키는 제2 냉각장치(400); 를 포함하는 냉장고의 제어방법에 있어서, 저장실(11)의 온도가 저장실(11)의 설정온도보다 소정의 온도 이상 높은 과부하 조건에서는 상기 냉장고의 외기온도가 미리 설정된 온도구간인 것에 기초하여 제1 냉각장치(450)에 의해 저장실(11)을 냉각시키는 제1 냉각 및 제2 냉각장치(400)에 의해 저장실(11)을 냉각시키는 제2 냉각을 함께 수행하고, 외기온도가 미리 설정된 온도구간이 아닌 것에 기초하여 제1 냉각만을 수행하는 것을 포함할 수 있다.A control method of a refrigerator (1) according to one embodiment of the present disclosure includes: a first cooling device (450) including a compressor (2) and an evaporator (3) and cooling a storage compartment (11); a second cooling device (400) including a thermoelectric element (530) and cooling the storage compartment (11); In the control method of a refrigerator, in an overload condition in which the temperature of the storage compartment (11) is higher than a set temperature of the storage compartment (11) by a predetermined temperature or more, first cooling for cooling the storage compartment (11) by the first cooling device (450) and second cooling for cooling the storage compartment (11) by the second cooling device (400) may be performed together based on the fact that the outside temperature of the refrigerator is in a preset temperature range, and only the first cooling may be performed based on the fact that the outside temperature is not in a preset temperature range.
미리 설정된 온도 구간은, 제1 온도구간 및 제1 온도구간보다 낮은 제2 온도구간을 포함할 수 있다. 과부하 조건은, 제1 온도구간에 대응하는 제1 시작조건과 제2 종료조건; 및 제2 온도구간에 대응하는 제2 시작조건과 제2 종료조건을 포함할 수 있다. The preset temperature range may include a first temperature range and a second temperature range lower than the first temperature range. The overload condition may include a first start condition and a second end condition corresponding to the first temperature range, and a second start condition and a second end condition corresponding to the second temperature range.
제1 냉각 및 제2 냉각을 함께 수행하는 것은, 외기온도가 제1 온도구간에 해당하면, 제1 시작조건이 만족된 경우 제2 냉각을 시작하고, 제1 종료조건이 만족된 경우 제2 냉각을 종료하며, 외기온도가 제2 온도구간에 해당하면, 제2 시작조건이 만족된 경우 제2 냉각을 시작하고, 제2 종료조건이 만족된 경우 제2 냉각을 종료하는 것을 포함할 수 있다.Performing the first cooling and the second cooling together may include starting the second cooling when the first start condition is satisfied when the outside temperature corresponds to the first temperature range, and ending the second cooling when the first end condition is satisfied when the outside temperature corresponds to the second temperature range, starting the second cooling when the second start condition is satisfied, and ending the second cooling when the second end condition is satisfied.
제1 시작조건은, 저장실(11)의 온도가 저장실(11)의 설정온도와 관련된 제1 온도 이상인 것을 포함하고, 제2 시작조건은, 저장실(11)의 온도가 제1 온도보다 높고 저장실(11)의 설정온도와 관련된 제2 온도 이상인 것을 포함할 수 있다.The first starting condition may include that the temperature of the storage room (11) is higher than or equal to a first temperature related to the set temperature of the storage room (11), and the second starting condition may include that the temperature of the storage room (11) is higher than the first temperature and higher than or equal to a second temperature related to the set temperature of the storage room (11).
제1 종료조건은, 저장실(11)의 온도가 저장실(11)의 설정온도와 관련된 제1 온도 이하인 것을 포함하고, 제2 종료조건은, 저장실(11)의 온도가 제1 온도보다 높고 저장실(11)의 설정온도와 관련된 제2 온도 이하인 것을 포함할 수 있다.The first termination condition may include that the temperature of the storage room (11) is lower than or equal to a first temperature related to the set temperature of the storage room (11), and the second termination condition may include that the temperature of the storage room (11) is higher than the first temperature and lower than or equal to a second temperature related to the set temperature of the storage room (11).
사용자 인터페이스(200)를 통해 급속 냉각 명령이 수신된 것에 기초하여 과부하 조건의 만족 여부와 무관하게 제1 냉각 및 제2 냉각을 함께 수행하는 것을 더 포함할 수 있다.It may further include performing the first cooling and the second cooling together regardless of whether the overload condition is satisfied based on the rapid cooling command received through the user interface (200).
외기온도가 소정의 온도 이상이면 급속 냉각 명령을 수신하더라도 제1 냉각만을 수행하는 것을 더 포함할 수 있다.It may further include performing only the first cooling even if a rapid cooling command is received when the outside temperature is higher than a predetermined temperature.
저장실(12)의 온도 및 증발기(3)의 온도에 기초하여 초기 냉각 조건이 만족되는지 여부를 결정하고, 초기 냉각 조건이 만족된 것에 기초하여 제1 냉각 및 제2 냉각을 함께 수행하는 것을 더 포함할 수 있다.It may further include determining whether the initial cooling condition is satisfied based on the temperature of the storage room (12) and the temperature of the evaporator (3), and performing the first cooling and the second cooling together based on the initial cooling condition being satisfied.
제1 냉각 및 제2 냉각을 함께 수행하는 것은, 초기 냉각 조건이 만족된 시점부터 미리 설정된 시간 동안 제1 냉각만을 수행하고, 미리 설정된 시간이 경과된 것에 기초하여 수행 중인 제1 냉각과 동시 수행하도록 제2 냉각을 시작하고, 저장실(11)의 온도가 저장실(11)의 설정온도와 관련된 미리 설정된 온도까지 감소된 것에 기초하여 제2 냉각을 종료하는 것을 포함할 수 있다.Performing the first cooling and the second cooling together may include performing only the first cooling for a preset time from the time when the initial cooling condition is satisfied, starting the second cooling to be performed simultaneously with the first cooling being performed based on the elapsed time of the preset time, and terminating the second cooling based on the temperature of the storage chamber (11) being reduced to a preset temperature related to the set temperature of the storage chamber (11).
외기온도가 소정의 온도 이상이면 초기 냉각 조건이 만족되더라도 제1 냉각만을 수행하는 것을 더 포함할 수 있다.It may further include performing only the first cooling even if the initial cooling condition is satisfied when the outside temperature is higher than a predetermined temperature.
한편, 개시된 실시예들은 컴퓨터에 의해 실행 가능한 명령어를 저장하는 기록매체의 형태로 구현될 수 있다. 명령어는 프로그램 코드의 형태로 저장될 수 있으며, 프로세서에 의해 실행되었을 때, 프로그램 모듈을 생성하여 개시된 실시예들의 동작을 수행할 수 있다. 기록매체는 컴퓨터로 읽을 수 있는 기록매체로 구현될 수 있다.Meanwhile, the disclosed embodiments may be implemented in the form of a recording medium storing computer-executable instructions. The instructions may be stored in the form of program code, and when executed by a processor, may generate program modules to perform the operations of the disclosed embodiments. The recording medium may be implemented as a computer-readable recording medium.
컴퓨터가 읽을 수 있는 기록매체로는 컴퓨터에 의하여 해독될 수 있는 명령어가 저장된 모든 종류의 기록 매체를 포함한다. 예를 들어, ROM(read only memory), RAM(random access memory), 자기 테이프, 자기 디스크, 플래쉬 메모리, 광 데이터 저장장치 등이 있을 수 있다.Computer-readable storage media include all types of storage media that store instructions that can be deciphered by a computer. Examples include read-only memory (ROM), random access memory (RAM), magnetic tape, magnetic disks, flash memory, and optical data storage devices.
또한, 컴퓨터가 읽을 수 있는 기록매체는, 비일시적(non-transitory) 저장매체의 형태로 제공될 수 있다. 여기서, '비일시적 저장매체'는 실재(tangible)하는 장치이고, 신호(signal)(예: 전자기파)를 포함하지 않는다는 것을 의미할 뿐이며, 이 용어는 데이터가 저장매체에 반영구적으로 저장되는 경우와 임시적으로 저장되는 경우를 구분하지 않는다. 예로, '비일시적 저장매체'는 데이터가 임시적으로 저장되는 버퍼를 포함할 수 있다.Additionally, a computer-readable recording medium may be provided in the form of a non-transitory storage medium. Here, the term "non-transitory storage medium" simply means a tangible device that does not contain signals (e.g., electromagnetic waves). This term does not distinguish between cases where data is permanently stored in the storage medium and cases where data is temporarily stored. For example, a "non-transitory storage medium" may include a buffer in which data is temporarily stored.
일 실시예에 따르면, 본 문서에 개시된 다양한 실시예들에 따른 방법은 컴퓨터 프로그램 제품(computer program product)에 포함되어 제공될 수 있다. 컴퓨터 프로그램 제품은 상품으로서 판매자 및 구매자 간에 거래될 수 있다. 컴퓨터 프로그램 제품은 기기로 읽을 수 있는 기록 매체(예: compact disc read only memory (CD-ROM))의 형태로 배포되거나, 또는 어플리케이션 스토어(예: 플레이 스토어TM)를 통해 또는 두 개의 사용자 장치들(예: 스마트폰들) 간에 직접, 온라인으로 배포(예: 다운로드 또는 업로드)될 수 있다. 온라인 배포의 경우에, 컴퓨터 프로그램 제품(예: 다운로더블 앱(downloadable app))의 적어도 일부는 제조사의 서버, 어플리케이션 스토어의 서버, 또는 중계 서버의 메모리와 같은 기기로 읽을 수 있는 기록 매체에 적어도 일시 저장되거나, 임시적으로 생성될 수 있다.According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable recording medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product (e.g., a downloadable app) may be temporarily stored or temporarily generated on a machine-readable recording medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.
이상에서와 같이 첨부된 도면을 참조하여 개시된 실시예들을 설명하였다. 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고도, 개시된 실시예들과 다른 형태로 본 발명이 실시될 수 있음을 이해할 것이다. 개시된 실시예들은 예시적인 것이며, 한정적으로 해석되어서는 안 된다.The disclosed embodiments have been described with reference to the attached drawings as described above. Those skilled in the art will understand that the present invention can be implemented in forms other than the disclosed embodiments without altering the technical spirit or essential features of the present invention. The disclosed embodiments are illustrative and should not be construed as limiting.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002162143A (en) * | 2000-11-21 | 2002-06-07 | Matsushita Electric Ind Co Ltd | Freezer refrigerator |
| JP2009008332A (en) * | 2007-06-28 | 2009-01-15 | Sharp Corp | Freezer refrigerator |
| KR101220488B1 (en) * | 2006-07-03 | 2013-01-10 | 주식회사 대우일렉트로닉스 | Refrigerator with air curtain of temperature changing room |
| CN103828500A (en) * | 2011-09-22 | 2014-05-28 | 古河电气工业株式会社 | Cooling device for box |
| CN110671851B (en) * | 2018-07-02 | 2022-12-20 | 海尔智家股份有限公司 | Refrigerator |
-
2025
- 2025-01-17 WO PCT/KR2025/099089 patent/WO2025193020A1/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002162143A (en) * | 2000-11-21 | 2002-06-07 | Matsushita Electric Ind Co Ltd | Freezer refrigerator |
| KR101220488B1 (en) * | 2006-07-03 | 2013-01-10 | 주식회사 대우일렉트로닉스 | Refrigerator with air curtain of temperature changing room |
| JP2009008332A (en) * | 2007-06-28 | 2009-01-15 | Sharp Corp | Freezer refrigerator |
| CN103828500A (en) * | 2011-09-22 | 2014-05-28 | 古河电气工业株式会社 | Cooling device for box |
| CN110671851B (en) * | 2018-07-02 | 2022-12-20 | 海尔智家股份有限公司 | Refrigerator |
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