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WO2025189002A1 - Casque de surveillance biomédicale - Google Patents

Casque de surveillance biomédicale

Info

Publication number
WO2025189002A1
WO2025189002A1 PCT/US2025/018748 US2025018748W WO2025189002A1 WO 2025189002 A1 WO2025189002 A1 WO 2025189002A1 US 2025018748 W US2025018748 W US 2025018748W WO 2025189002 A1 WO2025189002 A1 WO 2025189002A1
Authority
WO
WIPO (PCT)
Prior art keywords
strap
sensor
housing
cutouts
flexible circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/US2025/018748
Other languages
English (en)
Other versions
WO2025189002A8 (fr
Inventor
Thomas F. Collura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Brainmaster Technologies Inc
Original Assignee
Brainmaster Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brainmaster Technologies Inc filed Critical Brainmaster Technologies Inc
Publication of WO2025189002A1 publication Critical patent/WO2025189002A1/fr
Publication of WO2025189002A8 publication Critical patent/WO2025189002A8/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/25—Bioelectric electrodes therefor
    • A61B5/279—Bioelectric electrodes therefor specially adapted for particular uses
    • A61B5/291—Bioelectric electrodes therefor specially adapted for particular uses for electroencephalography [EEG]
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/24—Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
    • A61B5/316—Modalities, i.e. specific diagnostic methods
    • A61B5/369—Electroencephalography [EEG]
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/68—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient
    • A61B5/6801—Arrangements of detecting, measuring or recording means, e.g. sensors, in relation to patient specially adapted to be attached to or worn on the body surface
    • A61B5/6802—Sensor mounted on worn items
    • A61B5/6803—Head-worn items, e.g. helmets, masks, headphones or goggles
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/16—Details of sensor housings or probes; Details of structural supports for sensors
    • A61B2562/164—Details of sensor housings or probes; Details of structural supports for sensors the sensor is mounted in or on a conformable substrate or carrier

Definitions

  • aspects described herein relate to a wearable biomedical device and, more particularly, a headset for capturing transcranial neural electrical activity.
  • a neural electrical activity headset such as an EEG (electroencephalogram) headset, is an apparatus for noninvasively recording and measuring electrical impulses generated by a brain.
  • the headset includes a head-wearable structure with sensors positioned across the scalp to record transcranial brainwave patterns. Captured electrical signals are amplified, processed, and converted into meaningful data, providing insights into brain activity for clinical diagnoses, therapy, and neurological research.
  • EEG electroencephalogram
  • Free electrodes and most electrode caps are time-consuming and messy to apply and remove.
  • Free electrodes, electrode caps, and wired headsets are subject to artifacts due to movement or cable sway and electromagnetic interference.
  • Wireless headsets typically include a power supply (e.g., battery) and electronic circuits including amplifiers, processors, and wireless transceivers, which introduce weight, cost, and electromagnetic noise emissions that may potentially interfere with brain functions and degrade signal quality.
  • active sensors are utilized instead of passive sensors. Active sensors make electrical contact and actively amplify and process signals.
  • Active sensors reduce sensitivity to ambient noise and cable sway but are more susceptible to pulse artifacts including cardio- ballistic and piezo-induced artifacts.
  • sensors need to be maintained and replaced periodically.
  • Existing headsets may require return to the factory for most repair or replacement, incurring a cost and delay in usage.
  • a biomedical monitoring apparatus including sensors, flexible circuit boards, straps, and housings.
  • the sensors may be configured to detect neural electrical brain activity.
  • the flexible circuit boards are communicatively coupled with sensors and, among other things, enable aggregation and transmission of sensor data for further processing.
  • Straps couple sensors to a flexible circuit board and facilitate sensor positioning on the head of a subject.
  • a strap may include apertures configured to allow a flexible circuit board to be inserted and positioned.
  • the strap and the flexible circuit board may include sensor apertures for inserting and connecting sensors. Manually removable sensor fasteners may be employed to hold the sensors in place relative to the strap and flexible circuit board sensor apertures.
  • the apparatus may also include two housings for positioning around an ear on the sides of a head.
  • Each housing may include connectors that enable communicative connection with the flexible circuit boards. Further, each housing may include a fastener component that allows a strap including fasteners at each end to be removably attached to each housing. At least one of the two housings may also include a connector or port that enables output of data from all sensors to external processing devices or equipment.
  • a modular sensor assembly included in a biomedical monitoring apparatus includes a flexible circuit board, and a strap that overlays the flexible circuit board in a normal direction, defines a first set of cutouts, and defines a second set of cutouts, where the flexible circuit board forms a loop extended through the second set of cutouts.
  • the modular sensor assembly also includes a sensor inserted through the first set of cutouts in the normal direction, where the sensor engages the strap and is communicatively coupled to the flexible circuit board.
  • aspects described herein provide apparatuses, methods, processing systems, and computer-readable mediums associated with a neural electrical activity headset, an apparatus for noninvasive recording and measuring electrical impulses generated by a brain.
  • the subject headset may be modular with easily replaceable active sensors, allowing components to be removed or replaced in the field.
  • the headset may be easily upgraded or downgraded by adding or removing a variety of sensors from bands or straps with a removable fastener device. Benefits include ease of use, field modification and field repair without return to the factory due to a modular design, and washability.
  • the subject headset foregoes extensive on-head electronic devices. Rather, active shielding and amplification/impedance matching are provided on the head, while other electronic functions such as digitization, filtering, encoding, and transmission are performed on external devices.
  • the headset need not include any electromagnetically emitting circuits, thereby reducing noise emissions that may interfere with brain function and degrade signal quality.
  • An additional benefit is weight reduction.
  • flexible circuit boards may be employed, which further reduce weight and improve space efficiency, reliability, durability, and signal integrity', among other things.
  • the headset may support a choice of dry, moist, or wet gel usage without modifications. Therefore, the benefits of a moist or wet connection may be achieved in combination with an active sensor.
  • the headset is also configured to support integration of near infrared hemoencephalography (nIR HEG), passive infrared hemoencephalograph (pIR HEG), photobiomodulation (PBM), and pulsed electromagnetic field (pEMF) therapy, or other neuromonitoring or neuromodulation capabilities.
  • nIR HEG near infrared hemoencephalography
  • pIR HEG passive infrared hemoencephalograph
  • PBM photobiomodulation
  • pEMF pulsed electromagnetic field
  • FIG. 1 is a left perspective view of an example headset.
  • FIG. 2 is a front perspective view of the headset of FIG. 1.
  • FIG. 3A depicts side views of a first housing portion and a second housing portion included in the headset of FIG. 1.
  • FIG. 3B is a side view of a printed circuit board included in the headset of FIG. 1.
  • FIG. 4A depicts a left perspective view of the first housing portion.
  • FIG. 4B depicts a right perspective view of the first housing portion.
  • FIG. 4C depicts a partial, enlarged, top perspective view' of the first housing portion.
  • FIG. 4D depicts a partial, enlarged, bottom perspective view' of the first housing portion.
  • FIG. 5A is a partial, enlarged, top left perspective view of a strap and a strap fastener included in the headset of FIG. 1.
  • FIG. 5B is a top right perspective view of the strap fastener.
  • FIG. 5C is a bottom right perspective view of the strap fastener.
  • FIG. 5D is a partial, enlarged left view of the headset including the first housing portion.
  • FIG. 6B is a back right perspective view of the strap fastener.
  • FIG. 7A is a front view of straps included in the headset of FIG. 1.
  • FIG. 7B is a front view of the straps, retainers, sensor fasteners, and strap fasteners included in the headset of FIG. 1.
  • FIG. 8 A is a front view of a flexible circuit board included in the headset of FIG. 1 .
  • FIG. 8B is a back view of the flexible circuit board.
  • FIG. 8C is a front view of the strap and the strap fasteners, according to another aspect.
  • FIG. 8D is a front view of the flexible circuit board looped through the strap of FIG. 8C.
  • FIG. 8E is a top right view of the flexible circuit board looped through the strap.
  • FIG. 9A is a bottom right view of one of the sensor fasteners.
  • FIG. 9B is a bottom right view of a sensor.
  • FIG. 9C is a bottom view of one of the sensor fasteners.
  • FIG. 9D is a right view of one of the sensor fasteners.
  • FIG. 10A is a process flow of engaging one of the sensors with one of the sensor fasteners, according to another aspect.
  • FIG. 10B is a process flow of engaging one of the sensors with one of the sensor fasteners, according to another aspect.
  • FIG. 10C is a process flow of engaging one of the sensors with one of the sensor fasteners, according to another aspect.
  • FIG. 10D is a process flow of engaging one of the sensors with one of the sensor fasteners, according to another aspect.
  • FIG. 11 A is a bottom left perspective view of one of the retainers.
  • FIG. 1 IB is a bottom front perspective view of one of the retainers.
  • FIG. 11C is a top left perspective view of one of the retainers.
  • FIG. 1 ID is a top perspective view of one of the retainers.
  • FIG. 12 is a flow chart diagram of an example headset assembly method.
  • FIG. 13 is a block diagram of an operating environment within which aspects of the subject disclosure may be performed.
  • FIG. 14A is a left perspective view of the first housing portion, according to another aspect.
  • FIG. 14B is a right perspective view of the first housing portion in FIG. 14A.
  • FIG. 15A is a left view of the first housing portion in FIG. 14A.
  • FIG. 15B is a right view of the first housing portion in FIG. 14A.
  • FIG. 15C is a bottom perspective view of the first housing portion in FIG. 14A.
  • FIG. 15D is a top perspective view of the first housing portion in FIG. 14A.
  • FIG. 15E is a back perspective view of the first housing portion in FIG. 14A.
  • FIG. 15F is a front perspective view of the first housing portion in FIG. 14A.
  • FIG. 16A is a back right perspective view of the first housing portion, according to another aspect.
  • FIG. 16B is a back left perspective view of the first housing portion in FIG. 16A.
  • FIG. 17 is an exploded back right perspective view of the first housing portion in FIG.
  • FIG. 18 is an exploded back left perspective view of the first housing portion in FIG.
  • FIG. 19A is a top perspective view of a strap according to another aspect.
  • FIG. 19B is a top view of the strap in FIG. 19A.
  • FIG. 19C is a side view of the strap in FIG. 19A.
  • FIG. 20A is a top perspective view of a strap according to another aspect.
  • FIG. 20B is a top view of the strap in FIG. 20A.
  • FIG. 20C is a side view of the strap in FIG. 20 A.
  • FIG. 21 A is a bottom perspective view of the sensor.
  • FIG. 21B is a top perspective view of the sensor.
  • FIG. 21C is a top perspective view of a snap fastener included in one of the sensor fasteners.
  • FIG. 21 D is a bottom perspective view of a snap fastener included in one of the sensor fasteners.
  • FIG. 21E is a top perspective view of one of the sensors, according to another aspect.
  • FIG. 21F is a bottom perspective view of the sensor in FIG. 21E.
  • FIG. 22A is a top perspective view of one of the sensor fasteners.
  • FIG. 22B is a bottom perspective view of one of the sensor fasteners.
  • FIG. 22C is a side view of one of the sensor fasteners.
  • FIG. 23A is a top perspective view of one of the retainers.
  • FIG. 23B is a bottom perspective view of one of the retainers.
  • FIG. 23C is a cross-section side view of one of the retainers.
  • FIG. 24 is an exploded top perspective view of a modular sensor assembly included in the headset.
  • FIG. 25 is an exploded botom perspective view of the modular sensor assembly.
  • FIG. 26A is a top perspective view of the modular sensor assembly.
  • FIG. 27A is a top perspective view of the modular sensor assembly, articulated in an arc.
  • FIG. 28A is a cross-sectional side view of the modular sensor assembly.
  • FIG. 29B is a top front perspective view of the headset.
  • FIG. 30B is a top view diagram of the electrode placement system for performing EEG.
  • identical reference numerals have been used, where possible, to designate identical elements common to the drawings. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.
  • FIG. 1 depicts a high-level overview of an example headset 100.
  • the headset 100 includes a housing 102, straps 104, sensor fasteners 110, flexible circuit boards 112, retainers 114, and a harness 120.
  • the straps 104 include strap fasteners 122 that each respectively fix an end of one of the straps to the housing 102.
  • the strap fasteners 122 each respectively include a tag 124 that is a pull loop extended from an interface 130 between the strap 104 and the strap fastener 122.
  • the tags 124 are grip features that may be pulled by a user removing the strap fasteners 122 from the housing 102. With this construction, the strap fasteners 122 are configured for toolless removal from the housing 102. Also, the tags 124 are fixed with the strap fasteners 122 at locations spaced from where the strap fasteners 122 are fixed with the housing 102.
  • the tags 124 avoid interfering with each other, adjacent strap fasteners 122, and other components fixed with adjacent straps 104 at the housing 102. While, as depicted, the tags 124 are loops of fabric fixed to the strap fasteners 122 at the interfaces 130 between the strap fasteners 122 and the straps 104, the tags 124 may additionally or alternatively include various grip features such as, for example, tabs, latches, or straps extended from various portions of the strap fasteners 122 without departing from the scope of the present disclosure.
  • the housing 102 provides physical connection and support of the straps 104 on the headset 100.
  • the housing 102 may include a pair of housing portions respectively provided on a right side of a head 132 of a user 134, and a left side of the head 132, providing connection points for the straps 104.
  • the housing 102 is rigid as compared to the straps 104, the flexible circuit boards 112, and the harness 120.
  • the strap fasteners 122 removably couple the straps 104 and the flexible circuit boards 112 to the housing 102.
  • the strap fasteners 122 define apertures 140 for insertion of screws 142 that respectively fix the straps 104 and the flexible circuit boards 112 to the housing 102.
  • the apertures 140 respectively receive the screws 142, where the screws 142 engage the housing 102 and fix the strap fasteners 122 to the housing 102.
  • the strap fasteners 122 are fixed to the housing 102 by the screws 142, the strap fasteners 122 may be additionally or alternatively be removably fixed to the housing 102 by various fasteners including bolts, threaded inserts, clips, pins, latches, cam locks, hook and loop mechanisms, or magnets without departing from the scope of the present disclosure.
  • the strap fasteners 122 may additionally or alternatively include a locking pin that engages a post on the housing 102 and may be released by pulling a tab, pressing a button, or other disengagement action.
  • the tags 124 may be gripped and pulled by a user to release the strap fasteners 122.
  • the strap fasteners 122 may each include a button, and the tags 124 may facilitate positioning the strap fasteners 122 into engagement with the button.
  • FIG. 2 depicts the headset 100 on the user 134 from a different angle, providing a front perspective view. As shown in FIG.
  • each of the straps 104 may define a first set of cutouts 144 that are apertures which receive sensors 150, where each sensor 150 is respectively connected with one of the sensor fasteners 110.
  • the straps 104 also each define a second set of cutouts 152 that are slit apertures which receive one of the flexible circuit boards 112.
  • Data generated by the sensors 150 may be communicated from the sensors 150 through the flexible circuit boards 112.
  • the housing 102 enables electronic communication of sensor data through the flexible circuit boards 112 through connectors, interfaces, or ports at the ends and undersides of the straps 104.
  • the data from all of the sensors 150 may be communicated externally through such connectors, interfaces, or ports, as described in greater detail below.
  • electronic functions including digitization, filtering, encoding, and transmission, may be performed on external devices, reducing the weight of the example headset 100 and electromagnetic noise emission that degrades the signal quality'.
  • FIG 3A illustrates the first housing portion 300 and the second housing portion 302 (e.g., right and left).
  • Each of the first housing portion 300 and the second housing portion 302 includes input connectors 304 that are ports which receive input from the sensors 150 at the straps 104, for example, through the flexible circuit board 112.
  • the input connectors 304 are five-to-twelve-pin connectors that engage complementary outlets of the flexible circuit boards 112.
  • each modular sensor assembly 164 is independently connected to the housing 102, where each modular sensor assembly 164 transmits data generated at the sensors 150 to the housing 102 via the flexible circuit boards 112 and the input connectors 304.
  • the first housing portion 300 or the second housing portion 302 may also include an output connector 310 or port to provide output to one or more external devices or computers for further processing.
  • the output connector 310 may engage to a thirty - four-pin connector that connects to a ribbon cable.
  • Both the first housing portion 300 and the second housing portion 302 may also include first fastener components 312 complementary to the strap fasteners 122 for removably fixing the straps 104 to the housing 102. While, as depicted, the first fastener components 312 are discorectangle shaped posts extended from outer surfaces of the first housing portion 300 and the second housing portion 302 in the left-right direction, the first fastener components 312 may additionally or alternatively include a variety of extruded portions, complementary to the strap fasteners 122 for removably fixing the straps 104 to the housing 102. Furthermore, the first housing portion 300 and the second housing portion 302 may additionally or alternatively define recesses or apertures complementary to the strap fasteners 122 for removably fixing the straps 104 to the housing 102.
  • the strap fasteners 122 each respectively form a perimeter of the modular sensor assemblies 164 that is angled or rounded from the aperture 500 toward the strap 104 at an outer edge of the housing 102 in the front-back direction.
  • the first housing portion 300 may independently accommodate a relatively large number of the modular sensor assemblies 164 in the arc pattern, on the headset 100, with minimal increase in an overall size or surface area of the first housing portion 300, and while maintaining a required structural integrity of the strap fasteners 122 and the straps 104.
  • the first housing portion 300 and the second housing portion 302 each include an ear sensor 314.
  • the ear sensors 314 may respectively detect positioning of the first housing portion 300 and the second housing portion 302 with respect to the ears of the user 134.
  • the ear sensors 314 are made of metal and function as a ground for electronic components in the headset 100.
  • FIG. 3B illustrates an example circuit board 320 associated with the housing 102.
  • the circuit board 320 is associated with the first housing portion 300. corresponding to the right side of the head 132 of the user 134.
  • the circuit board 320 supports the input connectors 304 and the output connector 310 in the first housing portion 300.
  • the circuit board 320 may be enclosed within the housing 102, as shown in FIG. 3 A.
  • the first sensor 402 and the second sensor 404 are dry active electrodes made of silicon. While, as depicted, the first housing portion 300 includes two dry active electrode sensors as the first sensor 402 and the second sensor 404, the first housing portion 300 may additionally or alternatively include other types of sensors, more or fewer sensors, and various positioning arrangements of the sensors about the top portion 410 and the bottom portion 412 without departing from the scope of the present disclosure.
  • the housing 102 may include an additional fastener component 414 that fixes the harness 120 to the housing 102.
  • the fastener component 414 is a peg integrally formed with an extended outw ard in the left-right direction from the bottom portion 412 of the first housing portion 300.
  • the harness 120 defines an aperture 420 that receives and engages the fastener component 414, fixing the harness 120 under the chin 154 of the user 134.
  • the harness 120 may extend behind the head 132, around the back side 160, further securing the headset 100 to the head 132, improving stability of the headset 100 on the head 132, reducing movement of the sensors 150, the ear sensors 314, the first sensor 402, and the second sensor 404 relative to the head 132.
  • the harness 120 includes a separate strap around the back side 160 of the head 132, such a separate strap may be fixed with the harness 120 so as to not need additional apertures or components for fixing the harness 120 to the user 134.
  • FIG. 5A depicts an example strap 104, including the strap fastener 122.
  • FIG. 5B depicts a top perspective view of the strap fastener 122
  • FIG. 5C depicts a bottom perspective view- of the strap fastener 122
  • FIG. 5D depicts an example configuration of the straps 104 and the housing 102.
  • the strap fastener 122 defines an aperture 500 at an end of the strap 104.
  • FIG. 5D illustrates attachment of the straps 104 to the housing 102 in a hub and spoke distribution shape.
  • the aperture 500 defined in each strap fastener 122 accepts one of the first fastener components 312 of the housing 102.
  • the aperture 500 may be wider at one end to accept one of the first fastener components 312 and narrower at another end to lock the first fastener component 312 into the aperture 500.
  • the aperture 500 is a second fastener component complementary with one of the first fastener components 312 of the housing 102 in a manner that removably fixes the modular sensor assemblies 164 to the housing 102. While, as depicted, the aperture 500 is an opening that receives and engages the first fastener components 312, the aperture 500 may be a variety of mechanical attachment mechanisms complementary to the first fastener components 312 for removably fixing the strap fastener 122 to the housing 102, such as, for example, pins, clips, rods, or screws without departing from the scope of the present disclosure.
  • the strap fasteners 122 each include an elastic strap 502 extended from a side of the aperture 500 opposite the strap 104.
  • the first fastener component 312 on the housing 102 is a post
  • the aperture 500 defined by the strap fastener 122 is an eyelet such that the straps 104 engage the housing 102 in snap fit assembly.
  • the aperture 500 is an eyelet that snap fits the first fastener component 312
  • various fastener mechanisms may be utilized between the strap fastener 122 and the housing 102 without departing from the scope of the present disclosure.
  • the strap fastener 122 may additionally or alternatively include a locking pin that engages with an aperture defined in the housing 102, where the locking pin may be released by pulling a tab, pressing a button, or other disengagement action.
  • FIG. 7A depicts a top view of the straps 104 in accordance with an embodiment.
  • the straps 104 are constructed of an elastic material that is easy to connect to the housing 102. supports the flexible circuit boards 112, and is washable and reusable.
  • the straps 104 may be elastic, offering many benefits including stretchability to accommodate different head sizes and shapes, comfort, security in that the tension holds items in place, durability', and resistance to deformation, among other things. Head sizes may vary’ significantly from an infant to an adult. Accordingly, different-size straps may be employed as the straps 104.
  • the straps 104 each include a set of apertures 700 at opposite ends 702 of the strap 104.
  • the apertures 700 respectively receive the first screw 612 and the second screw 614 in the socket 620, fixing the strap 104 with one of the strap fasteners 122.
  • the straps 104 also each define the first set of cutouts 144 as additional circular openings along a length of the straps 104 between the sets of apertures 700.
  • the first set of cutouts 144 receive and engage the sensors 150, fixing the sensors 150 in the straps 104.
  • the second set of cutouts 152 are also present along the length of the straps 104 for positioning and holding the flexible circuit boards 112 in place along the straps 104.
  • FIG. 7B illustrates example straps 104 including additional components. Similar to FIG. 7A, straps of various sizes are depicted. With continued reference to FIG. 7B, each strap 104 includes two of the strap fasteners 122 attached through the sets of apertures 700 at the opposite ends 702. The sensors 150 are inserted through the first set of cutouts 144 and secured in the first set of cutouts 144, on the straps 104, by the sensor fasteners 1 10. Lengths of the flexible circuit boards 112 are inserted through the second set of cutouts 152. In embodiments, the flexible circuit board 112 is threaded up and back down through the cutouts 152, forming a loop that provides an extra length of the flexible circuit board 112 that may accommodate stretching of the strap 104. additional room for circuitry, or both.
  • the flexible circuit board 112 may be held in place by retainers 114.
  • the retainers 114 overlay the second set of cutouts 152, where the retainers 114 frictionally engage loops of the flexible circuit boards 112 extended through the second set of cutouts 152.
  • the retainers 114 inhibit movement of the flexible circuit boards 112 through the second set of cutouts 152, retaining the loops of the flexible circuit boards 112 at the second set of cutouts 152.
  • the retainers 114 squeeze the loops of the flexible circuit boards 112, generating a predetermined amount of frictional force. With this construction, the loops in the flexible circuit boards 112 provide added length along the straps 104 when the straps 104 are deformed by a force exceeding the frictional force generated by the retainers 114.
  • the connectors 802 engage connection points of the housing 102 for power and data communication, among other things.
  • the flexible circuit board 112 may be utilized with respect to the strap 104. More particularly, the flexible circuit board 112 may be threaded through pairs 804 of the second set of cutouts 152 such that the third set of cutouts 800 of the flexible circuit board 112 align with the first set of cutouts 144 in the strap 104.
  • the third set of cutouts 800 in the flexible circuit board 112 may be smaller than the first set of cutouts 144 in the strap 104. With this construction, the flexible circuit board 112 contacts and communicates with the sensors 150 through the strap 104.
  • FIGS. 8D and 8E depict integration of the flexible circuit board 112 with the strap 104.
  • the flexible circuit board 112 extends underneath the strap 104, along the strap 104, between the opposite ends 702 of the strap 104. Further, the flexible circuit board 112 is threaded up through a first one of the second set of cutouts 152 and dow n through a second one of the second set of cutouts 152 of one of the pairs 804 of the second set of cutouts 152. As a result, an additional length of flexible circuit board 112 may extend beyond the strap 104 and form a loop 810.
  • the third set of cutouts 800 of the flexible circuit board 112 are also lined up with the first set of cutouts 144 of the strap 104. More specifically, the third set of cutouts 800 of the flexible circuit board 1 12 are coaxial with the first set of cutouts 144 of the strap 104. With this construction, the flexible circuit board 112 and the strap 104 receive the sensors 150 through the first set of cutouts 144 and the third set of cutouts 800.
  • the strap 104 overlays the flexible circuit board 112 in a direction normal to an exterior surface of the head 132, hereinafter referred to as the normal direction.
  • the sensors 150 may be inserted through the first set of cutouts 144 and the third set of cutouts 800 in the normal direction. In this manner, the sensors 150 are accessible from a side of the strap 104 opposite the flexible circuit board 112 and the head 132 in the normal direction, and may be retained against the head 132 in the normal direction through the first set of cutouts 144 and the third set of cutouts 800 by the sensor fastener 110. [0130] Threading the flexible circuit board 112 with the strap 104, and subsequently fastening the loops 810 and the sensors 150 may removably attach the flexible circuit board 112 to the strap 104.
  • connection by the connectors 802 to the housing 102 through the strap fasteners 122 provides a modular design that may be assembled, disassembled, and reassembled in the field without specialized tools, improving ease of use as compared to a configuration of the headset 100 where the flexible circuit board 112 is permanently affixed to the strap 104.
  • FIGS. 9A-D illustrate an example of the sensor fastener 110 and the sensor 150 in accordance with an embodiment of the headset 100.
  • the sensor fastener 110 includes a first end portion 900 and a second end portion 902 extended in a direction opposite the first end portion 900.
  • the first end portion 900 and the second end portion 902 are curved, forming hooks in the sensor fastener 110.
  • the first end portion 900 and the second end portion 902 extend around opposite edges of the straps 104 and the flexible circuit board 112 in the normal direction.
  • the first end portion 900 and the second end portion 902 accept and aid positioning and attachment to the straps 104 and the flexible circuit board 112 by fastening or engaging the opposite sides.
  • the sensor fastener 110 includes a snap fastener 904 that is integrally formed with, interposed between, and separates the first end portion 900 and the second end portion 902 in a front-back direction perpendicular to the normal direction and the left-right direction.
  • the snap fastener 904 is occupies a middle position along the sensor fastener 110 that is equidistant from the first end portion 900 and the second end portion 902 in the front-back direction.
  • the snap fastener 904 may correspond to a dome or female portion of a snap fastener pair.
  • a stud portion 910 of the sensor 150 is extended in the normal direction and may be snapped into the snap fastener 904, removably connecting the sensor fastener 110 to the sensor 150.
  • the stud portion 910 of the sensor 150 may also be inserted through the third set of cutouts 800 in the flexible circuit board 112 and the first set of cutouts 144 in the strap 104. In this manner, the sensor 150 is connected to the flexible circuit board 112 and strap 104 by way of the sensor fastener 1 10.
  • FIGS. 10A-D depict an example of the sensor 150 and various other sensor attachment embodiments.
  • FIG. 10A depicts the sensor 150.
  • the sensor 150 corresponds to an EEG electrode that detects neural electrical activity.
  • the sensor 150 may be an active dry EEG electrode.
  • a dry electrode is a type of electrode that does not require a conductive gel or paste to operate.
  • a dry electrode increases user comfort, reduces setup time, enhances reusability or durability, and requires less maintenance.
  • a dry electrode, such as the sensor 150 depicted in FIG. 10A may have multiple contact points 1000 (e.g., spikes) that improve signal quality and reduce noise from the sensor 150 to the housing 102.
  • An active electrode incorporates signal amplification.
  • the flexible circuit board may connect with an electrode and boost weak signals, reducing the impact of electrical noise and movement artifacts and providing more reliable data.
  • the subject disclosure is not limited to active dry EEG electrodes.
  • the electrodes may be passive, dry, or both.
  • the benefits of a moist or wet connection may be achieved in combination with an active sensor.
  • the sensor may differ to support various neuro monitoring or neuromodulation capabilities including, but not limited to, near infrared hemoencephalography (nIR HEG), passive infrared hemoencephalograph (pIR HEG), photobiomodulation (PBM), and pulsed electromagnetic field (pEMF) therapy, or other neuromonitoring or neuromodulation capabilities.
  • nIR HEG near infrared hemoencephalography
  • pIR HEG passive infrared hemoencephalograph
  • PBM photobiomodulation
  • pEMF pulsed electromagnetic field
  • the sensor 150 may correspond to a tall sensor ty pe, the sensor 150 may
  • FIG. 10A also illustrates an example of the sensor fastener 110 and a combination of the sensor fastener 110 and the sensor 150.
  • the sensor fastener 110 may be manually operated by applying opposing forces at fingers 1002 that are rotatably connected portions which selectively engage the sensor 150. The fingers 1002 portions may engage with an extended portion of the sensor 150 to hold the sensor.
  • FIG. 10B depicts an embodiment of the sensor fastener 110 that operates similar to the sensor fastener 110 of FIG. 10A.
  • FIG. 10C and FIG. 10D depict different embodiments of the sensor fastener 110 that provide a rotational connection in which an extended portion of the sensor 150 is inserted, and the sensor fastener 110 is rotated or twisted to lock the sensor 150 in place.
  • this disclosure is not meant to limit the fasteners to those depicted, as other fasteners are possible and contemplated for use with the disclosed straps and headset.
  • the example retainer 114 includes a bottom portion 1102, a middle portion 1104, and a top portion 1110.
  • the bottom portion 1102 is a U-shaped piece that is smaller than the middle portion 1104 and the top portion 11 10 in the left-right direction and the front-back direction.
  • the bottom portion 1102 may be positioned on a back side 1112 of one of the straps 104, the back side 1112 being closest to the head 132 in the normal direction as compared to a front side 1114.
  • the top portion 1110 may be positioned on the front side 1114 of the strap 104, obstructing movement of the retainer 114 in the normal direction relative to the strap 104.
  • the first set of cutouts 144 and the second set of cutouts 152 are apertures that extend through the strap 104, each aperture being a discrete hole fully enclosed by the strap 104 at the front side 1114 and the opposing back side 1112 of the strap 104.
  • the middle portion 1104 is also U-shaped, and smaller in size than the bottom portion 1102 and top portion 1110 in the front-back direction and the left-right direction.
  • the bottom portion 1102 and the top portion 1110 extend farther in the front-back direction and the left-right direction than the middle portion 1104.
  • the middle portion 1104 has a smaller footprint than the bottom portion 1 102 and the top portion 1110, and is entirely overlapped by the bottom portion 1102 and the top portion 1110 in the normal direction.
  • the middle portion 1104 may be positioned in one of the second set of cutouts 152 defined by the strap 104, where the retainer 114 receives the flexible circuit board 112. Further, the middle portion 1 104 includes a divider 1120 that divides at least a portion of the middle portion 1104 into two parts that receive the flexible circuit board 112 threaded therethrough, as shown in FIG. 2. With this construction, the loop 810 is obstructed from receding entirely underneath the strap 104, at the back side 1 112, and is prevented from separating from the strap 104 at the second set of cutouts 152.
  • the top portion 1110 is also U-shaped and is larger than the bottom portion 1102 and middle portion 1104.
  • FIG. 12 is a flow chart diagram depicting an example headset assembly method 1200.
  • the method 1200 may be employed to assemble the headset 100 in accordance with aspects of this disclosure. Further, the method 1200 may be substantially reversed to disassemble the headset 100.
  • the modular design permits easy replacement of individual components of the headset 100, including whole modular sensor assemblies 164 or individual components thereof, in some embodiments without tools.
  • the method 1200 proceeds to block 1220, where the sensors 150 are inserted through the first set of cutouts 144 in the strap 104 and the third set of cutouts 800 in the flexible circuit board 112.
  • the third set of cutouts 800 defined in the flexible circuit board 112 may be smaller than the first set of cutouts 144 in the strap 104. In this manner, the sensors 150 may contact a portion of the flexible circuit board 112, enabling communication of data from the sensor 150 to the flexible circuit board 112.
  • the method 1200 continues to block 1230. where the sensors 150 are attached with the sensor fasteners 110.
  • the sensors 150 may each include a stud portion 910 that extends through the strap 104 and the flexible circuit board 112.
  • the sensor fasteners 110 may interact with the stud portions 910 to hold the sensors 150 in place with respect to the straps 104 and the flexible circuit boards 112.
  • the sensors 150 may be snapped into the sensor fasteners 110 at the snap fasteners 904, as shown in FIG. 2 and FIG. 9.
  • the method 1200 proceeds to block 1240, plugging the flexible circuit board 112 into one of the input connectors 304.
  • One end of the flexible circuit board 112 may have one of the connectors 802 that is operable to connect with one of the input connectors 304.
  • the input connectors 304 may be formed in the first housing portion 300, the second housing portion 302, or both.
  • the method 1200 continues to block 1250.
  • the strap 104 may include the strap fastener 122 at an end associated with the connector 802 of the flexible circuit board 1 12. Further, the strap fastener 122 may interact with a first fastener component 312 on the first housing portion 300 to removably attach one end of the strap 104 to the housing 102.
  • the strap fastener 122 may include an aperture 600 that receives a post on the housing 102, connecting the strap 104 to the housing 102.
  • the post may be threaded, and the screw 602 may be inserted to removably affix the strap 104 to the housing 102.
  • the method 1200 proceeds to block 1260, where the flexible circuit board 112 is plugged into another one of the input connectors 304.
  • the flexible circuit board 112 may have the connector 802. which is operable to connect with the input connector 304.
  • the method 1200 continues to block 1270, where the strap is attached to the second housing portion 302.
  • the strap 104 may include the strap fastener 122 at the end associated with the connector 802.
  • the strap fastener 122 may interact with one of the first fastener components 312 on the second housing portion 302 to removably attach one end of the strap 104 to the housing 102.
  • the strap fastener 122 may define the aperture 600 positioned through a post on the housing 102 to connect the strap 104 to the housing 102.
  • the method 1200 proceeds to block 1280, where a decision is made as to whether all straps are connected and attached to the housings. If there are additional straps that have not been connected and attached to the housings (“NO”), the method 1200 loops back to block 1240. If all straps have been connected and attached (“YES”),” the method 1200 continues to block 1290.
  • the right housing may include the output connector 310 that may be connected to a computing device or other processor-based device through a cable. The computing device may then perform operations to interpret and analyze the data from the headset sensors.
  • FIG. 12 is just one example of a method, and other methods including fewer, additional, or alternative steps are possible consistent with this disclosure.
  • FIG. 13 depicts an example processing system 1300 configured to perform various aspects described herein, including, for example, external processing of sensor data.
  • processing system 1300 includes one or more processors 1302, one or more input/output devices 1304, one or more display devices 1306, and one or more network interfaces 1308 through which processing system 1300 is connected to one or more networks (e.g.. a local network, an intranet, the Internet, or any other group of processing systems communicatively connected to each other), and computer-readable medium 1312.
  • networks e.g.. a local network, an intranet, the Internet, or any other group of processing systems communicatively connected to each other
  • bus 1310 which may generally be configured for data or power exchange amongst the components.
  • Bus 1310 may be representative of multiple buses, while only one is depicted for simplicity.
  • Processor(s) 1302 are generally configured to retrieve and execute instructions stored in one or more memories, including local memories like the computer-readable medium 1312, as well as remote memories and data stores. Similarly, processor(s) 1302 are configured to retrieve and store application data residing in local memories like the computer-readable medium 1312. as well as remote memories and data stores. More generally, bus 1310 is configured to transmit programming instructions and application data among the processor(s) 1302, display device(s) 1306, network interface(s) 1308, and computer-readable medium 1312. In certain embodiments, processor(s) 1302 are included to be representative of one or more central processing units (CPUs), graphics processing units (GPUs), tensor processing units (TPUs), accelerators, and other processing devices.
  • CPUs central processing units
  • GPUs graphics processing units
  • TPUs tensor processing units
  • Display device(s) 1306 may generally include any device configured to display data, information, graphics, user interface elements, and the like to a user.
  • display device(s) 1306 may include internal and external displays, such as an internal display of atablet computer or an external display for a sen’ er computer or a projector.
  • Display device(s) 1306 may further include displays for devices, such as augmented, virtual, or extended reality devices.
  • Network interface(s) 1308 provide processing system 1300 access to external networks and processing systems.
  • Network interface(s) 1308 may generally be any device capable of transmitting or receiving data through a wired or wireless network connection.
  • network interface(s) 1308 may include a transceiver for sending or receiving wired or wireless communication.
  • Network interface(s) 1308 may include an antenna, a modem, a LAN port, a Wi-Fi card, a WiMAX card, cellular communications hardware, near-field communication (NFC) hardware, satellite communication hardware, or any wired or wireless hardware for communicating with other networks or devices/systems.
  • network interface(s) 1308 includes hardware configured to operate in accordance with the Bluetooth® wireless communication protocol.
  • Computer-readable medium 1312 may be a volatile memory, such as a random access memory (RAM), or anon-volatile memory', such as non-volatile random access memory, phase change random access memory', or the like.
  • computer-readable medium 1312 includes sensor data analysis logic 1314.
  • the sensor data analysis logic 1314 may be performed by the flexible circuit board or external processing device.
  • FIG. 13 is just one example of a processing system consistent with aspects described herein, and other processing systems having additional, alternative, or fewer components are possible consistent with this disclosure.
  • FIGS. 14A-15F depict various perspective views of the first housing portion 300, which corresponds to a right housing portion that is secured to a right side of the head 132 of the user 134.
  • the first housing portion 300 includes input connectors 1400 that are sockets with receive and operatively connect the first sensor 402 and the second sensor 404 to the first housing portion.
  • the second housing portion 302 includes similar features and functions in a similar manner as the first housing portion 300, further description of which is omitted for the sake of brevity.
  • FIGS. 16A and 16B depict the first housing portion 300 fixed with a bracket 1600 included in the harness 120.
  • the bracket 1600 receives a strap that extends under the chin 154 and secures the headset 100 to the head 132 of the user 134, as shown in FIG. 2.
  • FIGS. 17 and 18 depicts exploded views of the first housing portion 300 assembled with the first sensor 402, the second sensor 404, and the bracket 1600.
  • the first sensor 402, the second sensor 404, and the bracket 1600 are respectively fixed to the first housing portion by fasteners 1700.
  • the fasteners 1700 also fix the first housing portion 300 to encase the printed circuit board 320. While, as depicted, the fasteners 1700 are screws, the fasteners may additionally or alternatively include pins, bolts, clips, rivets, studs, anchors, threaded press-fit inserts, and various other removable mechanical fasteners without departing from the scope of the present disclosure.
  • FIGS. 19A-20C depict various views and embodiments of one of the straps 104.
  • the straps 104 may have various lengths between the opposite ends 702, and define the first set of cutouts 144 and the second set of cutouts 152 with various spacing and numerosity without departing from the scope of the present disclosure.
  • FIGS. 21A and 21B depict one of the sensors 150 in an embodiment including the contact points 1000.
  • the stud portion 910 extends in the normal direction, opposite the spikes forming the contact points 1000.
  • the stud portion 910 extends through the strap 104 and the flexible circuit board 112 in the normal direction while the contact points 1000 are directed toward and contacts the head 132 of the user 134.
  • FIGS. 21 C and 21D depict one of the snap fasteners 904 included in one of the sensor fasteners 110.
  • the depicted snap fastener 904 forms a recess 2100 complementary to the sensors 150, including the stud portion 910, for removably fixing the sensor fastener 110 and the sensor 150 in a snap fit connection on one of the straps 104.
  • FIGS. 22A-22C depict various views of one of the sensor fasteners 110, including the first end portion 900. the second end portion 902, and the snap fastener 904.
  • the snap fastener 904 is positioned at a middle portion of the sensor fastener 110 between the first end portion 900 and the second end portion 902 in the front-back direction.
  • the snap fastener 904 may be integrally formed with the first end portion 900 and the second end portion 902.
  • the first end portion 900 and the second end portion 902 extend in opposite directions from the snap fastener 904, in the front-back direction.
  • the first end portion 900 and the second end portion 902 center the snap fastener on the strap 104 in the front-back direction, aligning the snap fastener 904 with one of the first set of cutouts 144 and one of the third set of cutouts 800, through which the sensor 150, including the stud portion 910 is inserted and received by the snap fastener 904.
  • FIGS. 23A-23C depicts various views of the retainer 114, including the bottom portion 1102, the middle portion 1104, the top portion 1110, and the divider 1120.
  • the divider 1120 extends partially through the retainer 114 in the front-back direction. More specifically, the divider 1120 extends from a first retainer end 2300 toward a second retainer end 2302, beyond a midpoint between the first retainer end 2300 and the second retainer end 2302 in the front-back direction.
  • a loop 810 formed at the divider 1120 is retained by the divider 1120 when the strap 104 is articulated or stretched, but may be removed by a user without removing the flexible circuit board 112 from the strap 104.
  • the retainer 1 14 may be directly removed from the strap 104 and the flexible circuit board 112 without further disassembling any other components of the headset 100.
  • FIGS. 24-27B depict various views of one of the modular sensor assemblies 164 in a flat configuration.
  • the loops 810 are interposed between and separate consecutive cutouts in the third set of cutouts 800, along the flexible circuit board 112 in the left-right direction.
  • the flexible circuit board 112 includes slack material between consecutive cutouts in the third set of cutouts 800, and may individually accommodate variable spacing among the third set of cutouts 800, avoiding becoming taut in the headset 100, along the length of the strap 104 between the opposite ends 702. This includes circumstances where the strap 104 flexes and articulates during assembly and use, including the flexing shown in FIGS. 27A and 27B.
  • FIGS. 28A and 28B depicts cross sectional views of one of the modular sensor assemblies 164.
  • the stud portion 910 is smaller in size than the cutout in the third set of cutouts 800 in the front-back direction and the left-right direction.
  • the contact surface 2102 of the sensor 150 is larger in size than the cutout in the third set of cutouts 800 in the front-back direction and the left-right direction.
  • the contact surface 2102 of the sensor 150 obstructs the sensor 150 from further motion through the flexible circuit board 112 when the stud portion 910 is inserted through the flexible circuit board 112 in the normal direction, maintaining the contact surface 2102 as an exterior surface of the modular sensor assembly 164 that engages the head 132 of the user 134.
  • FIGS. 29A and 29B depicts the headset 100 in a worn configuration, wear the headset 100 may articulate around and engage the head 132 of the user 134, generating associated sensor data at the modular sensor assemblies 164.
  • the modular sensor assemblies 164 may be sized, shaped, and equipped with various configurations of the sensors 150 as described above to engage the head 132 of the user 134 at the node positions 3000, generating targeted sensor data.
  • an apparatus may be implemented, or a method may be practiced using any number of the aspects set forth herein.
  • the scope of the disclosure is intended to cover such an apparatus or method practiced using other structure, functionality, or structure and functionality in addition to, or other than, the various aspects of the disclosure set forth herein. It should be understood that any aspect of the disclosure disclosed herein may be embodied by one or more elements of a claim.
  • a phrase referring to “at least one of’ a list of items refers to any combination of those items, including single members.
  • “at least one of: a, b, or c” is intended to cover a, b, c. a-b, a-c, b-c, and a-b-c. as well as any combination with multiples of the same element (e.g., a-a, a-a-a. a-a-b, a-a-c, a-b-b. a-c-c, b-b, b-b-b. b-b-c, c-c, and c-c-c or any other ordering of a, b, and c).
  • determining encompasses a wide variety of actions. For example, “determining” may include calculating, computing, processing, deriving, investigating, looking up (e.g., looking up in a table, a database, or another data structure), ascertaining, and the like. Also, “determining” may include receiving (e.g., receiving information), accessing (e.g., accessing data in a memory ), and the like. Also, “determining” may include resolving, selecting, choosing, establishing, and the like.
  • first”, “second”, or the like are not intended to imply a temporal aspect, a spatial aspect, an ordering, etc. Rather, such terms are merely used as identifiers, names, etc. for features, elements, items, etc.
  • a first channel and a second channel generally correspond to channel A and channel B or two different or two identical channels or the same channel.
  • “comprising”, “comprises”, “including”, “includes”, or the like generally means comprising or including, but not limited thereto.
  • the methods disclosed herein include one or more steps or actions for achieving the methods.
  • the method steps or actions may be interchanged with one another without departing from the scope of the claims.
  • the order or use of specific steps or actions may be modified without departing from the scope of the claims.
  • the various operations of methods described above may be performed by any suitable means capable of performing the corresponding functions.
  • the means may include various hardware or software component(s) or module(s), including, but not limited to a circuit, an application specific integrated circuit (ASIC), or processor.
  • ASIC application specific integrated circuit
  • those operations may have corresponding counterpart means-plus-function components with similar numbering.

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Abstract

Un ensemble capteur modulaire comprend une carte de circuit imprimé souple, et une sangle qui recouvre la carte de circuit imprimé souple dans une direction normale, définit un premier ensemble de découpes, et définit un second ensemble de découpes, la carte de circuit imprimé souple formant une boucle qui s'étend à travers le second ensemble de découpes. L'ensemble capteur modulaire comprend également un capteur inséré à travers le premier ensemble de découpes dans la direction normale, le capteur venant en prise avec la sangle et étant couplé en communication à la carte de circuit imprimé souple.
PCT/US2025/018748 2024-03-06 2025-03-06 Casque de surveillance biomédicale Pending WO2025189002A1 (fr)

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Citations (5)

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US6574513B1 (en) * 2000-10-03 2003-06-03 Brainmaster Technologies, Inc. EEG electrode assemblies
US20090099473A1 (en) * 2005-11-10 2009-04-16 William James Ross Dunseath Apparatus and Method for Acquiring a Signal
US20120066238A1 (en) * 2010-09-10 2012-03-15 Fadem Kalford C Biomarker fusion system and method
US20180343741A1 (en) * 2015-10-21 2018-11-29 Adventive Ipbank Method Of Fabricating 3D Bendable Printed Circuit Board
US20230346295A1 (en) * 2021-08-05 2023-11-02 Zeto, Inc. Flexible electroencephalography headset

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6574513B1 (en) * 2000-10-03 2003-06-03 Brainmaster Technologies, Inc. EEG electrode assemblies
US20090099473A1 (en) * 2005-11-10 2009-04-16 William James Ross Dunseath Apparatus and Method for Acquiring a Signal
US20120066238A1 (en) * 2010-09-10 2012-03-15 Fadem Kalford C Biomarker fusion system and method
US20180343741A1 (en) * 2015-10-21 2018-11-29 Adventive Ipbank Method Of Fabricating 3D Bendable Printed Circuit Board
US20230346295A1 (en) * 2021-08-05 2023-11-02 Zeto, Inc. Flexible electroencephalography headset

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