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WO2025183333A1 - Silicon negative electrode material comprising secondary particles formed by aggregating primary particles, and method for manufacturing same - Google Patents

Silicon negative electrode material comprising secondary particles formed by aggregating primary particles, and method for manufacturing same

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Publication number
WO2025183333A1
WO2025183333A1 PCT/KR2024/095450 KR2024095450W WO2025183333A1 WO 2025183333 A1 WO2025183333 A1 WO 2025183333A1 KR 2024095450 W KR2024095450 W KR 2024095450W WO 2025183333 A1 WO2025183333 A1 WO 2025183333A1
Authority
WO
WIPO (PCT)
Prior art keywords
silicon
particles
secondary particles
primary particles
anode material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/KR2024/095450
Other languages
French (fr)
Korean (ko)
Inventor
지은지
정좌영
이오정
이은상
손형준
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
S Graphene Co Ltd
Original Assignee
S Graphene Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by S Graphene Co Ltd filed Critical S Graphene Co Ltd
Priority claimed from KR1020240027030A external-priority patent/KR20250130926A/en
Priority claimed from KR1020240027034A external-priority patent/KR20250130928A/en
Priority claimed from KR1020240027037A external-priority patent/KR20250130930A/en
Publication of WO2025183333A1 publication Critical patent/WO2025183333A1/en
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/02Silicon
    • C01B33/021Preparation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00Secondary cells; Manufacture thereof
    • H01M10/05Accumulators with non-aqueous electrolyte
    • H01M10/052Li-accumulators
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/13Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
    • H01M4/134Electrodes based on metals, Si or alloys
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/36Selection of substances as active materials, active masses, active liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01MPROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00Electrodes
    • H01M4/02Electrodes composed of, or comprising, active material
    • H01M4/36Selection of substances as active materials, active masses, active liquids
    • H01M4/38Selection of substances as active materials, active masses, active liquids of elements or alloys
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Definitions

  • the present invention relates to a silicon negative electrode material including secondary particles formed by agglomeration of primary particles and a method for manufacturing the same.
  • Lithium secondary batteries are widely used in a wide range of applications, from portable electronic devices to electric vehicles, due to their high energy density, long lifespan, and high voltage.
  • research to increase the capacity of lithium secondary batteries primarily focused on cathode active materials.
  • cathode active materials As capacity enhancement through cathode active materials has reached its limits, research on anode active materials has recently become increasingly active.
  • interest is growing in silicon anode materials, which have a theoretical capacity approximately 10 times higher than that of graphite, the traditional anode material.
  • Silicon anode materials possess a theoretical capacity approximately 10 times higher than that of graphite (approximately 4,200 mAh/g), making them a promising anode material for lithium secondary batteries.
  • silicon anode materials suffer from a serious problem: their volume expands by more than 300% during charging and discharging, hindering their commercialization. This volume expansion during charging and discharging causes the silicon particles to become finer, leading to the continuous destruction and rebuilding of the surface Solid Electrolyte Interphase (SEI), which increases lithium consumption and shortens the battery's lifespan.
  • SEI Solid Electrolyte Interphase
  • One object of the present invention according to the first embodiment is to provide a silicon negative electrode material including silicon secondary particles formed by agglomeration of silicon primary particles, and having a bridge connecting adjacent silicon primary particles within the silicon secondary particles.
  • another object of the present invention according to the first embodiment is to provide a method for manufacturing a silicon anode material, which can form silicon primary particles by pulverizing silicon raw material powder in a one-step process, and form silicon secondary particles by agglomerating the formed silicon primary particles and having bridges connecting adjacent silicon primary particles.
  • One object of the present invention according to the second embodiment is to provide a silicon anode material comprising silicon secondary particles formed by agglomeration of silicon primary particles and a conductive material, wherein the silicon secondary particles have a bridge connecting adjacent silicon primary particles, and the conductive material provides an electrical conduction path, thereby solving the problem of low conductivity, which is a disadvantage of conventional silicon anode materials.
  • another object of the present invention according to the second embodiment is to provide a method for manufacturing a silicon anode material, which can form silicon primary particles by pulverizing a conductive material and silicon raw material powder, and coagulating the formed silicon primary particles and the pulverized conductive material, thereby forming silicon secondary particles having a bridge connecting adjacent silicon primary particles.
  • One object of the present invention according to the third embodiment is to provide a silicon anode material comprising silicon secondary particles formed by agglomeration of silicon primary particles and silicon oxide particles, wherein the silicon secondary particles have bridges connecting adjacent silicon primary particles, and the silicon oxide particles can improve long-life stability.
  • another object of the present invention according to the third embodiment is to provide a method for manufacturing a silicon anode material capable of forming silicon primary particles by crushing silicon oxide particles and silicon raw material powder, agglomerating the formed silicon primary particles and the crushed silicon oxide particles, and forming silicon secondary particles having bridges connecting adjacent silicon primary particles.
  • the solution for the first embodiment is as follows.
  • a silicon anode material includes silicon secondary particles formed by agglomeration of silicon primary particles, and has a bridge connecting adjacent silicon primary particles within the silicon secondary particles.
  • the bridge may be formed by cold welding.
  • a carbon coating layer may be formed on the surface of the silicon secondary particle.
  • the carbon coating layer may be crystalline carbon or amorphous carbon.
  • Crystalline carbon has relatively high conductivity compared to amorphous carbon, and for example, the crystalline carbon may be at least one selected from the group consisting of artificial graphite, natural graphite, and graphene.
  • the amorphous carbon may be at least one selected from the group consisting of hard carbon, soft carbon, petroleum pitch, coal pitch, mesophase pitch, and calcined coke.
  • the silicon secondary particles may be such that the silicon primary particles are more densely aggregated from the periphery to the center.
  • a method for manufacturing a silicon anode material comprises: using a milling machine to pulverize silicon raw material powder to form silicon primary particles, while simultaneously agglomerating the silicon primary particles to form silicon secondary particles; and forming bridges connecting adjacent silicon primary particles within the silicon secondary particles by heat and pressure generated during the pulverization process of the silicon primary particles.
  • the grinding of the silicon raw material powder and the formation of silicon secondary particles can be performed in an air atmosphere.
  • the grinding of the silicon raw material powder and the formation of silicon secondary particles can be performed in an inert gas atmosphere.
  • the milling machine may be at least one selected from the group consisting of a planetary mill, an attrition mill, and a beads mill.
  • the grinding of the silicon raw material powder can be performed in the presence of a milling ball.
  • the grinding of the silicon raw material powder can be performed at 1 to 6000 rpm for 1 second to 60 hours.
  • a step of forming a carbon coating layer on the surface of the silicon secondary particles may be further included.
  • the solution for the second embodiment is as follows.
  • a silicon anode material includes silicon secondary particles formed by agglomeration of silicon primary particles and a conductive material, and has a bridge connecting adjacent silicon primary particles within the silicon secondary particles.
  • the conductive material may be at least one selected from the group consisting of graphene, carbon nanotubes, carbon nanofibers, graphite, and graphite-like material.
  • the conductive material may be included in an amount of 1 to 15 wt% based on the silicon secondary particles.
  • a carbon coating layer may be formed on the surface of the silicon secondary particle.
  • the carbon coating layer may be crystalline carbon or amorphous carbon.
  • Crystalline carbon has relatively high conductivity compared to amorphous carbon, and for example, the crystalline carbon may be at least one selected from the group consisting of artificial graphite, natural graphite, and graphene.
  • the amorphous carbon may be at least one selected from the group consisting of hard carbon, soft carbon, petroleum pitch, coal pitch, mesophase pitch, and calcined coke.
  • pores may also be formed in the central portion of the silicon secondary particle.
  • a method for manufacturing a silicon anode material comprises: using a milling machine to pulverize a conductive material and silicon raw material powder to form silicon primary particles; simultaneously, agglomerating the silicon primary particles and the pulverized conductive material to form silicon secondary particles; and forming bridges connecting adjacent silicon primary particles within the silicon secondary particles by heat and pressure generated during the pulverization process of the silicon primary particles.
  • the conductive material may be at least one selected from the group consisting of graphene, carbon nanotubes, carbon nanofibers, graphite, and graphite-like material.
  • the conductive material may be included in an amount of 1 to 15 wt% based on the silicon secondary particles.
  • the grinding of the silicon raw material powder and the formation of silicon secondary particles can be performed in an air atmosphere.
  • the milling machine may be at least one selected from the group consisting of a planetary mill, an attrition mill, and a beads mill.
  • the grinding of the silicon raw material powder can be performed in the presence of a milling ball.
  • the grinding of the silicon raw material powder can be performed at 1 to 6000 rpm for 1 second to 60 hours.
  • a step of forming a carbon coating layer on the surface of the silicon secondary particles may be further included.
  • the solution for the third embodiment is as follows.
  • a silicon anode material includes silicon primary particles and silicon secondary particles formed by agglomeration of silicon oxide SiO x (where 0 ⁇ X ⁇ 2) particles, and has a bridge connecting adjacent silicon primary particles within the silicon secondary particles.
  • the content of the silicon oxide particles may be 2 to 50 wt% based on the silicon secondary particles.
  • a carbon coating layer may be formed on the surface of the silicon secondary particle.
  • the carbon coating layer may be crystalline carbon or amorphous carbon.
  • Crystalline carbon has relatively high conductivity compared to amorphous carbon, and for example, the crystalline carbon may be at least one selected from the group consisting of artificial graphite, natural graphite, and graphene.
  • the amorphous carbon may be at least one selected from the group consisting of hard carbon, soft carbon, petroleum pitch, coal pitch, mesophase pitch, and calcined coke.
  • a method for manufacturing a silicon anode material comprises: using a milling machine to pulverize silicon raw material powder and silicon oxide SiO x (wherein 0 ⁇ X ⁇ 2) particles to form silicon primary particles; simultaneously, agglomerating the silicon primary particles and the pulverized silicon oxide to form silicon secondary particles; and forming bridges connecting adjacent silicon primary particles within the silicon secondary particles by heat and pressure generated during the pulverization process of the silicon primary particles.
  • the content of the silicon oxide particles may be 2 to 50 wt% based on the silicon secondary particles.
  • the grinding of the silicon raw material powder and the formation of silicon secondary particles can be performed in an air atmosphere.
  • the milling machine may be at least one selected from the group consisting of a planetary mill, an attrition mill, and a beads mill.
  • the grinding of the silicon raw material powder can be performed in the presence of a milling ball.
  • the grinding of the silicon raw material powder can be performed at 1 to 6000 rpm for 1 second to 60 hours.
  • a step of forming a carbon coating layer on the surface of the silicon secondary particles may be further included.
  • the invention according to the first embodiment has the following effects.
  • a silicon anode material of a first embodiment includes silicon secondary particles formed by agglomeration of silicon primary particles, and has bridges connecting adjacent silicon primary particles within the silicon secondary particles.
  • the silicon anode material of the first embodiment has excellent durability by dispersing stress caused by repeated volume expansion and contraction of the silicon secondary particles during the charge and discharge process of a secondary battery due to pores formed by agglomeration of the silicon primary particles.
  • the silicon anode material of the first embodiment can prevent micronization by maintaining the bridges connecting adjacent silicon primary particles within the silicon secondary particles even when the repeated volume expansion and contraction of the silicon secondary particles occurs during the charge and discharge process of a secondary battery.
  • the method for manufacturing the silicon anode material of the first embodiment is very simple because the pulverization of silicon raw material powder and the formation of silicon secondary particles are performed in a single process, and is an environmentally friendly process because no organic solvent is used.
  • the invention according to the second embodiment has the following effects.
  • the invention according to the second embodiment also has the effects of the first embodiment, and any duplicate explanations thereof will be omitted.
  • the silicon anode material of the second embodiment solves the problem of low conductivity, which is a shortcoming of conventional silicon anode materials, by providing an electrical conduction path with a conductive material aggregated together with silicon primary particles. Meanwhile, the method for manufacturing the silicon anode material of the second embodiment has the effect of inducing amorphousness of silicon primary particles by mixing a conductive material during the process of grinding silicon raw material powder and forming silicon secondary particles, and forming an internal porous structure in the central portion of the silicon secondary particles.
  • the invention according to the third embodiment has the following effects.
  • the invention according to the second embodiment also has the effects of the first embodiment, and any duplicate explanations thereof will be omitted.
  • the silicon anode material of the third embodiment comprises silicon oxide particles aggregated with silicon primary particles, which serve as a buffer to suppress the repetitive volume expansion and contraction of the silicon secondary particles during the charge and discharge process of the secondary battery.
  • silicon particles having a size of several to several tens of nanometers are formed inside, thereby developing capacity. Accordingly, the silicon anode material of the third embodiment can improve the long-life characteristics of the secondary battery.
  • the first through third embodiments described above can be combined with each other, and when combined, each can have its own unique effects. Furthermore, even if an effect is not explicitly mentioned herein, it should be noted that the effects and potential effects described in the following specification, expected by the technical features of the present invention, are treated as if they were described in the specification of the present invention.
  • Figure 1 is a schematic flow chart of a method for manufacturing a silicon negative electrode material of the present invention.
  • FIG. 2 is an electron microscope photograph of silicon secondary particles included in the silicon negative electrode material of the present invention, including (a) an electron microscope photograph of micron silicon before the pulverization-welding process and (b) an electron microscope photograph of silicon particles after the pulverization-welding process.
  • Figure 3 is a scanning electron microscope image of silicon secondary particles included in the silicon negative electrode material of the present invention, and shows silicon primary particles and bridges connecting them.
  • FIG. 4 is an electron microscope photograph of a cross-section of a silicon particle after a grinding-welding process according to a method for manufacturing a silicon anode material of the present invention, including (a) an electron microscope photograph of a cross-section of a silicon particle, (b) an electron microscope photograph of a central portion of a silicon particle, and (c) an electron microscope photograph of an edge of a silicon particle.
  • FIG 5 shows the results of BET analysis of silicon raw material powder (Bare Si) and silicon secondary particles (BMSi).
  • FIG. 6 is an electron microscope photograph of silicon particles after a grinding-welding process according to a method for manufacturing a silicon anode material of the present invention, showing (left) a case where the grinding-welding process was performed in an inert gas (Ar) atmosphere and (right) a case where the grinding-welding process was performed in an air atmosphere.
  • Ar inert gas
  • Figure 7 shows the results of particle size (D50) analysis according to the time (500 to 1500 min) of the grinding-welding process according to the method for manufacturing a silicon negative electrode material of the present invention.
  • Figure 8 is an electron microscope photograph after forming a carbon coating layer (graphene) on a silicon secondary particle included in the silicon negative electrode material of the present invention, including (a) an electron microscope photograph of the entire surface and (b) an electron microscope photograph of a cross-section.
  • Figure 9 is an electron microscope photograph of a carbon coating layer according to the carbon precursor reaction time of the chemical vapor deposition method used in the silicon anode material of the present invention.
  • Figure 10 shows the results of Raman spectroscopy measurements of silicon secondary particles coated with a carbon coating layer (graphene), with (top) the results when the carbon precursor reaction time is 4 hours and (bottom) the results when the carbon precursor reaction time is 1 hour.
  • Figure 11 shows the results of measuring the discharge capacity according to the number of repeated charge and discharge cycles of a lithium-ion negative electrode half-cell using a negative electrode material controlled to a capacity of 500 mAh/g by mixing graphite with silicon secondary particles (BMSi@Gr) coated with a carbon coating layer (graphene).
  • Figure 12 shows the Coulombic efficiency according to the number of repeated charge/discharge cycles of a lithium-ion negative electrode half-cell using a negative electrode material controlled to a capacity of 500 mAh/g by mixing graphite with silicon secondary particles (BMSi@Gr) coated with a carbon coating layer (graphene).
  • BMSi@Gr silicon secondary particles coated with a carbon coating layer
  • Figure 13 is an electron microscope photograph of the surface of a silicon secondary particle coated with a carbon coating layer (pitch shell).
  • Figure 14 is a schematic diagram of a silicon secondary particle formed by mixing silicon primary particles and pulverized conductive material.
  • FIG. 15 is an electron microscope photograph of a silicon secondary particle included in a silicon negative electrode material of the present invention, and relates to a silicon secondary particle formed by mixing silicon primary particles and a pulverized conductive material.
  • Fig. 16 is an electron microscope photograph of a cross-section of a silicon secondary particle included in a silicon negative electrode material of the present invention, and relates to a silicon secondary particle formed by mixing silicon primary particles and a pulverized conductive material.
  • Fig. 17 is XRD data of a cross-section of a silicon secondary particle included in a silicon negative electrode material of the present invention, and relates to a silicon secondary particle formed by mixing silicon primary particles and a pulverized conductive material.
  • Fig. 18 is an electron microscope photograph of a cross-section of a silicon secondary particle included in a silicon negative electrode material of the present invention, in which a carbon coating layer (pitch) is formed on a silicon secondary particle formed by mixing silicon primary particles and a pulverized conductive material.
  • a carbon coating layer pitch
  • Figure 19 shows the capacity and coulombic efficiency according to the number of repeated charge/discharge cycles of a lithium ion negative electrode half-cell using a negative electrode material that was mixed with graphite and controlled to a capacity of 500 mAh/g, and formed by mixing silicon primary particles and pulverized conductive materials (BMSi-G@Gr, Example 2-2) coated with a carbon coating layer (pitch).
  • Figure 20 illustrates Nyquist plots of Example 2-1, Comparative Example 2-1, and Comparative Example 2-2.
  • Fig. 22 is an electron microscope photograph of a silicon secondary particle included in a silicon negative electrode material of the present invention, and relates to a silicon secondary particle formed by mixing silicon primary particles and pulverized silicon oxide particles.
  • Fig. 23 is an electron microscope photograph of a cross-section of a silicon secondary particle included in a silicon negative electrode material of the present invention, and relates to a silicon secondary particle formed by mixing silicon primary particles and pulverized silicon oxide particles.
  • Figure 24 shows the capacity and coulombic efficiency measured according to the number of repeated charge and discharge cycles of a lithium ion negative electrode half-cell using a negative electrode material including silicon secondary particles formed by mixing silicon primary particles and pulverized silicon oxide particles.
  • Figure 25 shows the XRD measurement results of silicon secondary particles formed by mixing silicon primary particles and pulverized silicon oxide particles according to the pulverization time (when the weight ratio of silicon raw material powder and silicon oxide particles is 20:1).
  • Figure 26 shows the XRD measurement results of silicon secondary particles formed by mixing silicon primary particles and pulverized silicon oxide particles according to the pulverization time (when the weight ratio of silicon raw material powder and silicon oxide particles is 1:1).
  • Figure 27 shows the capacity and coulombic efficiency according to the number of repeated charge and discharge cycles of a lithium ion negative electrode half-cell using a negative electrode material including silicon secondary particles (BMSi-SOx@Pitch, Example 3-3) coated with a carbon coating layer (pitch) and formed by mixing silicon primary particles and pulverized silicon oxide particles.
  • a negative electrode material including silicon secondary particles (BMSi-SOx@Pitch, Example 3-3) coated with a carbon coating layer (pitch) and formed by mixing silicon primary particles and pulverized silicon oxide particles.
  • micro silicon means silicon having an average particle size range of several to several hundred micrometers
  • nano silicon means silicon having an average particle size of several to several hundred nanometers.
  • the present invention relates to a silicon anode material comprising secondary particles formed by agglomeration of primary particles, and a method for manufacturing the same.
  • a silicon anode material comprising secondary particles formed by agglomeration of primary particles, and a method for manufacturing the same.
  • various embodiments are described separately below, but the embodiments can be combined with each other.
  • Figure 1 is a schematic flow chart of a method for manufacturing a silicon negative electrode material of the present invention.
  • the silicon anode material of the present invention includes silicon secondary particles formed by agglomeration of silicon primary particles, and has a bridge connecting adjacent silicon primary particles within the silicon secondary particles.
  • the silicon primary particles may be formed by milling silicon raw material powder using a milling machine.
  • Submicron and micro silicon powders can be used as the silicon raw material powder, and when silicon raw material powder is milled, nano silicon is formed, and this nano silicon is the silicon primary particle.
  • silicon secondary particles having a size of several to several tens of micrometers are formed by agglomerating silicon primary particles having a size of several to several hundred nanometers (see Fig. 2), and bridges connecting adjacent silicon primary particles are formed within the silicon secondary particles by heat and pressure generated during the process of pulverizing the silicon primary particles.
  • Fig. 3 it can be confirmed that adjacent silicon primary particles are not simply in contact, but bridges are formed by cold welding.
  • the method for manufacturing the silicon anode material of the invention may use a ball mill such as a planetary mill, an attrition mill, or a bead mill. Silicon raw material powder and milling balls are placed together in a container, and milling can be performed at 1 to 6,000 rpm for 1 second to 60 hours in an air atmosphere or an inert gas atmosphere. The speed and time of the milling can be adjusted to control the size of the silicon primary particles and silicon secondary particles, and to form bridges. Milling balls made of carbon steel, stainless steel, zirconium dioxide, or the like, having a diameter of 0.3 to 100 cm, can be used.
  • the inert gas can be at least one selected from the group consisting of helium, neon, argon, krypton, and xenon.
  • a three-dimensional network is formed by connecting silicon primary particles to some or all of adjacent silicon primary particles by bridges, and thus the silicon secondary particles have a porous structure.
  • the silicon secondary particles may be densely aggregated from the outer periphery to the center.
  • pores are mainly formed on the outer side of the silicon secondary particles.
  • the silicon anode material undergoes repeated volume expansion and contraction.
  • the porous structure formed within the silicon secondary particles disperses the stress resulting from this expansion and contraction. Furthermore, the porous structure formed within the silicon secondary particles facilitates the movement of lithium and electrons through the pores, thereby enhancing high-speed charge and discharge efficiency.
  • a step of coating the silicon secondary particles with a carbon coating layer can be performed. Once the carbon coating layer is formed, the pores of the silicon secondary particles are filled with the carbon coating layer, and the carbon coating layer can act as a buffer to suppress volume expansion and contraction of the silicon anode material during the charge and discharge process of the secondary battery.
  • the carbon coating layer may be crystalline carbon or amorphous carbon.
  • Crystalline carbon has relatively high conductivity compared to amorphous carbon, and for example, the crystalline carbon may be at least one selected from the group consisting of artificial graphite, natural graphite, and graphene.
  • the amorphous carbon may be at least one selected from the group consisting of hard carbon, soft carbon, petroleum pitch, coal pitch, mesophase pitch, and calcined coke.
  • the carbon coating layer may be composed of a primary coating layer and a secondary coating layer that covers the surface of the silicon secondary particle on which the primary coating layer is formed.
  • the primary coating layer may be crystalline carbon or amorphous carbon
  • the secondary coating layer may be crystalline carbon or amorphous carbon.
  • the primary coating layer and the secondary coating layer may be of the same material or different materials.
  • a carbon coating layer composed of crystalline carbon can be formed through a chemical vapor deposition reaction.
  • the chemical vapor deposition reaction includes a temperature-raising step, a constant temperature step, and a temperature-lowering step.
  • the temperature-raising step can be performed in an atmosphere of hydrogen, nitrogen, argon, etc.
  • the gas flow rate can be 10 to 300 mL/min
  • the temperature-raising rate can be 1 to 100°C.
  • the constant temperature can be 600 to 1500°C
  • the constant temperature time can be 1 to 1000 min.
  • the temperature-lowering step is performed in an atmosphere of an inert gas such as nitrogen or argon
  • the gas flow rate can be 10 to 300 mL/min
  • the temperature-lowering rate can be 1 to 100°C
  • natural cooling can be performed after the temperature-lowering step.
  • a carbon coating layer composed of amorphous carbon can be formed using an amorphous carbon heat treatment reaction process.
  • Heat treatment is performed by mixing silicon secondary particles with at least one amorphous carbon particle selected from the group consisting of hard carbon, soft carbon, petroleum pitch, coal pitch, mesophase pitch, and calcined coke.
  • wet coating the pitch is dissolved in an organic solvent, mixed with the silicon secondary particles, and then dried.
  • the organic solvent can be at least one of acetone, ethanol, tetrahydrofuran (THF), toluene, n-hexane, or quinoline.
  • High-temperature heat treatment includes a temperature-raising step, a constant temperature step, and a temperature-lowering step.
  • the temperature-raising step is performed in an atmosphere such as nitrogen or argon, the gas flow rate is 10 to 300 mL/min, and the temperature-raising rate is 1 to 100°C.
  • the constant temperature is 100 to 1500°C, and the constant temperature time is 1 to 1000 min.
  • the temperature-lowering step is performed in an inert gas atmosphere such as nitrogen or argon, the gas flow rate is 10 to 300 mL/min, the temperature-lowering rate is 1 to 100°C, and natural cooling is performed after the temperature-lowering step.
  • a chemical vapor deposition reaction was used to form a carbon coating layer on the silicon secondary particle (BMSi) produced in Example 1-1.
  • a tube furnace was used, and the furnace atmosphere was maintained as an inert atmosphere with argon gas during heating, and then heat treatment was performed at 1000 degrees for 1 hour in a methane (CH 4 ) gas atmosphere.
  • CH 4 methane
  • a pitch heat treatment reaction was used to form a pitch shell coating layer on the surface of the silicon secondary particles (BMSi) manufactured in Example 1-4.
  • the silicon secondary particles and pitch particles were mixed in a solvent (THF) and then heat treated.
  • the heat treatment was performed using a tube furnace, and the furnace atmosphere was maintained as an inert atmosphere with argon gas from the temperature rise to the heat treatment.
  • the heat treatment of the pitch-coated silicon secondary particles (BMSi) was performed in two stages, more specifically, heat treatment was performed at 300°C for 2 hours and at 1000°C for 1 hour.
  • a chemical vapor deposition reaction was used to form a carbon coating layer on the silicon secondary particles (BMSi) produced in Example 1-2.
  • a tube furnace was used, and the furnace atmosphere was maintained as an inert atmosphere with argon gas during heating, and then heat treatment was performed at 1000 degrees for 1 hour in a methane (CH 4 ) gas atmosphere.
  • CH 4 methane
  • FIG. 2 is an electron microscope photograph of silicon secondary particles included in the silicon anode material of Example 1-1, including (a) an electron microscope photograph of micron silicon before the pulverization-welding process and (b) an electron microscope photograph of silicon particles after the pulverization-welding process
  • FIG. 3 is an electron microscope photograph of silicon secondary particles included in the silicon anode material of Example 1-1, observing silicon primary particles and bridges connecting them
  • FIG. 1 is an electron microscope photograph of silicon secondary particles included in the silicon anode material of Example 1-1, observing silicon primary particles and bridges connecting them
  • Example 4 is an electron microscope photograph of a cross-section of silicon particles after the pulverization-welding process according to the method for manufacturing the silicon anode material of Example 1-1, including (a) an electron microscope photograph of a cross-section of silicon particles, (b) an electron microscope photograph of a central portion of silicon particles, and (c) an electron microscope photograph of an edge of silicon particles.
  • silicon secondary particles are formed in a spherical shape. Silicon primary particles have a particle size of several to several hundred nanometers. These nano-sized silicon primary particles aggregate to form silicon secondary particles, which have a particle size of several to several tens of micrometers.
  • adjacent silicon primary particles are connected to each other by bridges. That is, no binder or the like was added to bind the silicon primary particles together other than the silicon raw material powder and milling balls, and without any separate heat treatment, bridges were formed between the silicon primary particles by cold welding due to the heat and pressure generated during the milling process of the silicon raw material powder.
  • pores are formed as silicon primary particles aggregate.
  • silicon secondary particles are formed as the silicon primary particles aggregate more densely from the periphery to the center. In other words, pores are mainly distributed on the periphery of silicon secondary particles.
  • Figure 5 shows the results of BET analysis of silicon raw material powder (Bare Si) and silicon secondary particles (BMSi) of Example 1-1.
  • the silicon secondary particles of Example 1-1 have a significantly larger specific surface area than the silicon raw material powder, confirming that pores were formed in the silicon secondary particles.
  • FIG. 6 is an electron microscope photograph of silicon particles after a grinding-welding process according to a method for manufacturing a silicon anode material of the present invention, showing (left) a case where the grinding-welding process was performed in an inert gas (Ar) atmosphere (Example 1-2) and (right) a case where the grinding-welding process was performed in an air atmosphere (Example 1-1).
  • Figure 7 shows the results of particle size (D50) analysis according to the time (500 to 1500 min) of the grinding-welding process according to the method for manufacturing a silicon negative electrode material of the present invention, and the results are summarized in Table 1.
  • particle size is controlled by milling time. As the milling time increases, the particle size ( D50 ) decreases, converging to 3.6 to 3.8 ⁇ m for the silicon secondary particles. Furthermore, as shown in Fig. 7, spheroidization becomes less effective as the milling time increases. Therefore, a milling time of 300 to 1,000 minutes is preferable based on 300 rpm. However, it should be noted that the milling time may vary depending on the milling speed.
  • Figure 8 is an electron microscope photograph of a silicon secondary particle included in a silicon anode material of Example 1-4 after forming a carbon coating layer (graphene), including (a) an electron microscope photograph of the entire surface and (b) a cross-sectional electron microscope photograph.
  • FIG. 9 is an electron microscope photograph of a carbon coating layer according to the carbon precursor reaction time of the chemical vapor deposition method used in the silicon anode material of the present invention
  • FIG. 10 is a Raman spectroscopy measurement result of a silicon secondary particle coated with a carbon coating layer (graphene), showing the measurement results when (top) the carbon precursor reaction time is 4 hours and (bottom) the carbon precursor reaction time is 1 hour.
  • the shape of the carbon coating layer varies depending on the carbon precursor reaction time of the chemical vapor deposition method, and as the reaction time increases, the thickness and length of the graphene increase. Furthermore, as shown in Figure 10, the Raman spectroscopy measurement results also showed excellent crystallinity.
  • Fig. 11 shows the results of measuring the discharge capacity according to the number of repeated charge/discharge cycles of a lithium-ion negative electrode half-cell using a negative electrode material mixed with graphite and controlled to a capacity of 500 mAh/g in a silicon secondary particle (BMSi@Gr) coated with a carbon coating layer (graphene)
  • Fig. 12 shows the results of measuring the coulombic efficiency according to the number of repeated charge/discharge cycles of a lithium-ion negative electrode half-cell using a negative electrode material mixed with graphite and controlled to a capacity of 500 mAh/g in a silicon secondary particle (BMSi@Gr) coated with a carbon coating layer (graphene).
  • Table 2 summarizes the discharge capacity and coulombic efficiency.
  • Example 1-4 the discharge capacity according to the number of silicon charge/discharge cycles of Example 1-4 was maintained more stably, and high Coulombic efficiency was shown.
  • Example 1-6 where the grinding-welding process was performed in an inert gas atmosphere, high capacity retention and Coulombic efficiency were shown.
  • the technology proposed in the present invention can solve the problem of volume expansion-contraction, which is a chronic problem of silicon anode materials, and can provide long-life characteristics.
  • Comparative Example 1-1 the capacity tended to decrease as the cycle progressed, and in the case of Comparative Example 1-2, there was a problem of low Coulombic efficiency.
  • Figure 13 is an electron microscope photograph of the surface of a silicon secondary particle coated with a carbon coating layer (pitch shell) of Example 1-5.
  • a peach shell is smoothly coated on a silicon secondary particle having a graphene coating layer, filling the porous structure of the surface.
  • a peach shell coating layer is formed in this way, the surface pores are filled, reducing the specific surface area and preventing excessive inflow of electrolyte.
  • Figure 14 is a schematic diagram of a silicon secondary particle formed by mixing silicon primary particles and pulverized conductive material.
  • the silicon anode material is produced by milling silicon raw material powder while the silicon raw material powder and conductive material are added together.
  • the silicon anode material of the second embodiment includes silicon secondary particles formed by agglomeration of silicon primary particles and conductive materials, and has a bridge connecting adjacent silicon primary particles within the silicon secondary particles.
  • the conductive material may be at least one selected from the group consisting of graphene, carbon nanotubes, carbon nanofibers, graphite, and earth graphite, and the conductive material may be included in an amount of 1 to 15 wt% based on the silicon secondary particles.
  • silicon raw material powder is pulverized in the presence of a conductive material to form silicon primary particles and then silicon secondary particles are assembled.
  • a conductive material particularly, a carbon-based conductive material
  • the conductive material coagulated within the silicon secondary particles with the silicon primary particles provides an electrical conduction path, thereby resolving the low conductivity problem of conventional silicon anode materials without the need for a separate carbon coating layer.
  • Example 2-1 4.8 g of silicon raw material powder and 0.2 g of graphene powder were placed together with 100 g of SUS balls in a planetary milling container and milled at 300 rpm for 500 minutes in the air. The milled sample was taken out of the container and separated from the balls to obtain a silicon anode material sample.
  • a carbon coating layer was formed on the silicon secondary particles (BMSi-G) manufactured in Example 2-1.
  • a tube furnace was used to form the carbon coating layer.
  • the furnace atmosphere was maintained as an inert atmosphere with argon gas from the temperature rise to the heat treatment.
  • 1 g of the silicon secondary particles (BMSi-G) of Example 2-1 and 0.7 g of petroleum pitch were mixed using a spherical coater and then heat treated.
  • the heat treatment of the pitch-coated silicon secondary particles (BMSi-G@Pitch) was performed in two stages: at 300 degrees for 2 hours and at 1000 degrees for 1 hour.
  • a carbon coating layer was formed on the silicon secondary particles (BMSi-G) manufactured in Example 2-1.
  • a tube furnace was used to form the carbon coating layer.
  • the furnace atmosphere was maintained as an inert atmosphere with argon gas from the heating to the heat treatment.
  • 1 g of the silicon secondary particles (BMSi-G) of Example 2-1 and 1, 0.8, and 0.6 g of petroleum pitch were each dissolved in tetrahydrofuran (THF), mixed, and then heat-treated.
  • the heat treatment of the pitch-coated silicon secondary particles (BMSi-G@Pitch) was performed in two stages: at 300 degrees for 2 hours and at 1000 degrees for 1 hour.
  • the manufactured silicon secondary particles (BMSi) were coated with a carbon coating layer (pitch).
  • 1 g of the manufactured silicon secondary particles (BMSi) and 0.7 g of petroleum pitch were mixed using a spherical coater and then heat-treated.
  • the heat treatment of the pitch-coated silicon secondary particles (BMSi @Pitch) was performed in two stages: at 300°C for 2 hours and at 1000°C for 1 hour.
  • FIG. 15 is an electron microscope photograph of a silicon secondary particle included in a silicon negative electrode material of Example 2-1, and relates to a silicon secondary particle formed by mixing silicon primary particles and a pulverized conductive material
  • FIG. 16 is an electron microscope photograph of a cross-section of a silicon secondary particle included in a silicon negative electrode material of Example 2-1, and relates to a silicon secondary particle formed by mixing silicon primary particles and a pulverized conductive material.
  • silicon secondary particles are formed in a spherical shape.
  • Silicon primary particles have a particle size of several to several hundred nanometers. These nano-sized silicon primary particles and pulverized conductive materials aggregate to form silicon secondary particles, which have a particle size of several to several tens of micrometers.
  • Figure 17 is XRD data of a cross-section of a silicon secondary particle included in a silicon negative electrode material of the present invention, and is the result of measuring the silicon secondary particle by forming it in the same manner as Example 2-1 but changing the content of a conductive material (graphene).
  • the conductive material (graphene) increases, the crystalline state of silicon changes to an amorphous state. That is, the conductive material (graphene) induces amorphousness of the particles when the silicon raw material powder is pulverized and induces the formation of a porous structure in the central portion.
  • Fig. 18 is an electron microscope photograph of a cross-section of a silicon secondary particle included in a silicon negative electrode material of Example 2-2, and relates to a carbon coating layer (pitch) formed on a silicon secondary particle formed by mixing silicon primary particles and a pulverized conductive material.
  • the outer and central pores formed by the silicon primary particles and the pulverized conductive material are evenly filled with pitch.
  • the pore-filled pitch enhances the conductivity of the silicon secondary particles and acts as a protective layer.
  • Figure 19 shows the capacity and coulombic efficiency according to the number of repeated charge/discharge cycles of a lithium ion negative electrode half-cell using a negative electrode material that was mixed with graphite and controlled to a capacity of 500 mAh/g, and formed by mixing silicon primary particles and pulverized conductive materials (BMSi-G@Gr, Example 2-2) coated with a carbon coating layer (pitch).
  • Figure 20 shows Nyquist plots after 10 cycles of Example 2-1, Comparative Example 2-1, and Comparative Example 2-2.
  • Example 2-1 in which silicon primary particles and pulverized conductive material (graphene) are aggregated to form silicon secondary particles, has a lower resistance value than Comparative Examples 2-1 and 2-2.
  • the capacity can be controlled by adjusting the pitch amount.
  • the milling process of the silicon raw material powder is performed in a state where the silicon raw material powder and silicon oxide SiO x (where 0 ⁇ X ⁇ 2) particles are input together.
  • the silicon anode material of the third embodiment includes silicon secondary particles formed by agglomeration of silicon primary particles and silicon oxide particles, and has a bridge connecting adjacent silicon primary particles within the silicon secondary particles.
  • the content of the silicon oxide particles may be 2 to 50 wt% based on the silicon secondary particles.
  • the silicon anode material of the third embodiment comprises silicon oxide particles aggregated with silicon primary particles, which serve as a buffer to suppress the repetitive volume expansion and contraction of the silicon secondary particles during the charge and discharge process of the secondary battery.
  • silicon particles having a size of several to several tens of nanometers are formed inside, thereby developing capacity. Accordingly, the silicon anode material of the third embodiment can improve the long-life characteristics of the secondary battery.
  • FIG. 22 is an electron microscope photograph of a silicon secondary particle included in a silicon anode material of the present invention, and relates to a silicon secondary particle formed by mixing silicon primary particles and pulverized silicon oxide particles
  • FIG. 23 is an electron microscope photograph of a cross-section of a silicon secondary particle included in a silicon anode material of the present invention, and relates to a silicon secondary particle formed by mixing silicon primary particles and pulverized silicon oxide particles.
  • silicon secondary particles are formed in a spherical shape.
  • Silicon primary particles have a particle size of several to several hundred nanometers. These nano-sized silicon primary particles and pulverized silicon oxide particles aggregate to form silicon secondary particles, which have a particle size of several to several tens of micrometers.
  • pores are formed as the silicon primary particles aggregate.
  • the silicon oxide particles are larger than the silicon primary particles.
  • the size of the silicon oxide particles can range from tens to hundreds of nanometers.
  • Figure 24 shows the capacity and coulombic efficiency measured according to the number of repeated charge/discharge cycles of a lithium ion negative electrode half-cell using a negative electrode material including silicon secondary particles of Examples 3-1 and 3-2.
  • Example 3-2 which has a long milling time
  • the capacity is expressed by about 250 mAh/g more than in Example 3-1, and the long-life efficiency is also higher than in Example 3-1.
  • Fig. 25 shows the XRD measurement results of silicon secondary particles formed by mixing silicon primary particles and pulverized silicon oxide particles according to the pulverization time (when the weight ratio of silicon raw material powder and silicon oxide particles is 20:1)
  • Fig. 26 shows the XRD measurement results of silicon secondary particles formed by mixing silicon primary particles and pulverized silicon oxide particles according to the pulverization time (when the weight ratio of silicon raw material powder and silicon oxide particles is 1:1).
  • Fig. 25 relates to Example 3-3
  • Fig. 26 relates to Example 3-4.
  • Figure 27 shows the capacity and coulombic efficiency measured according to the number of repeated charge and discharge cycles of a lithium ion negative electrode half-cell using a negative electrode material including silicon secondary particles (BMSi-SOx@Pitch, Example 3-5) coated with a carbon coating layer (pitch) and formed by mixing silicon primary particles and pulverized silicon oxide particles.
  • a negative electrode material including silicon secondary particles (BMSi-SOx@Pitch, Example 3-5) coated with a carbon coating layer (pitch) and formed by mixing silicon primary particles and pulverized silicon oxide particles.
  • the silicon anode material of Example 3-5 has a higher capacity retention rate and better Coulombic efficiency than Comparative Examples 3-1 and 3-2.

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Abstract

The present invention relates to a silicon negative electrode material comprising silicon secondary particles formed by aggregating silicon primary particles, wherein the silicon negative electrode material has a bridge connecting adjacent silicon primary particles in the silicon secondary particles.

Description

일차 입자가 응집되어 형성된 이차 입자를 포함하는 실리콘 음극재 및 이의 제조방법Silicon negative electrode material comprising secondary particles formed by agglomeration of primary particles and method for manufacturing the same

본 발명은 일차 입자가 응집되어 형성된 이차 입자를 포함하는 실리콘 음극재 및 이의 제조방법에 관한 것이다. The present invention relates to a silicon negative electrode material including secondary particles formed by agglomeration of primary particles and a method for manufacturing the same.

리튬이차전지는 고에너지 밀도, 긴 수명, 높은 전압 등의 특성으로 인해 휴대용 전자기기부터 전기자동차에 이르기까지 다양한 분야에서 널리 사용되고 있다. 종래 리튬이차전지의 용량을 높이기 위한 연구는 주로 양극 활물질에 집중되어 왔다. 하지만 양극활물질에 의한 용량 증가가 한계에 도달하면서, 최근에는 음극 활물질에 대한 연구가 활발해지고 있다. 특히, 기존에 음극 활물질로 이용되던 흑연보다 이론용량이 약 10배 이상 높은 실리콘 음극재에 대한 관심이 크게 증가하고 있다.Lithium secondary batteries are widely used in a wide range of applications, from portable electronic devices to electric vehicles, due to their high energy density, long lifespan, and high voltage. Previously, research to increase the capacity of lithium secondary batteries primarily focused on cathode active materials. However, as capacity enhancement through cathode active materials has reached its limits, research on anode active materials has recently become increasingly active. In particular, interest is growing in silicon anode materials, which have a theoretical capacity approximately 10 times higher than that of graphite, the traditional anode material.

실리콘 음극재는 흑연 대비 약 10배 높은 이론용량(약 4200mAh/g)을 가지고 있어 리튬 이차전지의 음극재로서 큰 가능성을 지니고 있다. 그러나 실리콘 음극재는 충전과 방전 과정에서 300% 이상 부피가 팽창하는 심각한 문제를 가지고 있어 상용화가 쉽지 않다. 충방전 과정에서 발생하는 부피 팽창은 실리콘 입자의 미분화를 유발하며, 이는 표면 SEI(Solid Electrolyte Interphase)층의 지속적인 파괴와 재구축으로 이어져 리튬 소모를 증가시키고 전지의 수명을 단축시킨다. Silicon anode materials possess a theoretical capacity approximately 10 times higher than that of graphite (approximately 4,200 mAh/g), making them a promising anode material for lithium secondary batteries. However, silicon anode materials suffer from a serious problem: their volume expands by more than 300% during charging and discharging, hindering their commercialization. This volume expansion during charging and discharging causes the silicon particles to become finer, leading to the continuous destruction and rebuilding of the surface Solid Electrolyte Interphase (SEI), which increases lithium consumption and shortens the battery's lifespan.

따라서 실리콘 음극재의 성능 향상을 위해서는 이러한 문제들을 극복하는 새로운 연구와 기술 개발이 필요하다.Therefore, new research and technological development to overcome these problems are necessary to improve the performance of silicon anode materials.

제1실시형태에 따른 본 발명의 일 목적은 실리콘 일차 입자가 응집되어 형성된 실리콘 이차 입자를 포함하되, 상기 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 가지는 실리콘 음극재를 제공하는 것이다.One object of the present invention according to the first embodiment is to provide a silicon negative electrode material including silicon secondary particles formed by agglomeration of silicon primary particles, and having a bridge connecting adjacent silicon primary particles within the silicon secondary particles.

또한, 제1실시형태에 따른 본 발명의 다른 목적은 한 단계의 공정으로 실리콘 원료 분말을 분쇄하여 실리콘 일차 입자를 형성하면서, 형성된 실리콘 일차 입자들을 응집시키며 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 가지도록 실리콘 이차입자를 형성할 수 있는 실리콘 음극재의 제조방법을 제공하는 것이다.In addition, another object of the present invention according to the first embodiment is to provide a method for manufacturing a silicon anode material, which can form silicon primary particles by pulverizing silicon raw material powder in a one-step process, and form silicon secondary particles by agglomerating the formed silicon primary particles and having bridges connecting adjacent silicon primary particles.

제2실시형태에 따른 본 발명의 일 목적은 실리콘 일차 입자와 전도성 물질이 응집되어 형성된 실리콘 이차 입자를 포함하되, 상기 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 가지며, 상기 전도성 물질이 전기전도 경로를 제공하여 종래 실리콘 음극재의 단점인 낮은 전도도 문제를 해결할 수 있는 실리콘 음극재를 제공하는 것이다.One object of the present invention according to the second embodiment is to provide a silicon anode material comprising silicon secondary particles formed by agglomeration of silicon primary particles and a conductive material, wherein the silicon secondary particles have a bridge connecting adjacent silicon primary particles, and the conductive material provides an electrical conduction path, thereby solving the problem of low conductivity, which is a disadvantage of conventional silicon anode materials.

또한, 제2실시형태에 따른 본 발명의 다른 목적은 전도성 물질과 실리콘 원료 분말을 분쇄하여 실리콘 일차 입자를 형성하면서, 형성된 실리콘 일차 입자들과 분쇄된 전도성 물질을 응집시키며, 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 가지도록 실리콘 이차입자를 형성할 수 있는 실리콘 음극재의 제조방법을 제공하는 것이다.In addition, another object of the present invention according to the second embodiment is to provide a method for manufacturing a silicon anode material, which can form silicon primary particles by pulverizing a conductive material and silicon raw material powder, and coagulating the formed silicon primary particles and the pulverized conductive material, thereby forming silicon secondary particles having a bridge connecting adjacent silicon primary particles.

제3실시형태에 따른 본 발명의 일 목적은 실리콘 일차 입자와 산화 실리콘 입자가 응집되어 형성된 실리콘 이차 입자를 포함하되, 상기 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 가지며, 상기 산화 실리콘 입자가 장수명 안정성을 향상시킬 수 있는 실리콘 음극재를 제공하는 것이다. One object of the present invention according to the third embodiment is to provide a silicon anode material comprising silicon secondary particles formed by agglomeration of silicon primary particles and silicon oxide particles, wherein the silicon secondary particles have bridges connecting adjacent silicon primary particles, and the silicon oxide particles can improve long-life stability.

또한, 제3실시형태에 따른 본 발명의 다른 목적은 산화 실리콘 입자와 실리콘 원료 분말을 분쇄하여 실리콘 일차 입자를 형성하면서, 형성된 실리콘 일차 입자들과 분쇄된 산화 실리콘 입자를 응집시키며, 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 가지도록 실리콘 이차입자를 형성할 수 있는 실리콘 음극재의 제조방법을 제공하는 것이다.In addition, another object of the present invention according to the third embodiment is to provide a method for manufacturing a silicon anode material capable of forming silicon primary particles by crushing silicon oxide particles and silicon raw material powder, agglomerating the formed silicon primary particles and the crushed silicon oxide particles, and forming silicon secondary particles having bridges connecting adjacent silicon primary particles.

한편, 본 발명의 명시되지 않은 또 다른 목적들은 하기의 상세한 설명 및 그 효과로부터 용이하게 추론할 수 있는 범위 내에서 추가적으로 고려될 것이다.Meanwhile, other unspecified purposes of the present invention will be additionally considered within the scope that can be easily inferred from the detailed description and effects thereof below.

이상에서 제안한 목적을 달성하기 위해 다음과 같은 다양한 실시형태의 해결수단을 제안한다. To achieve the purpose proposed above, we propose solutions in various embodiments as follows.

제1실시형태의 해결수단은 다음과 같다. The solution for the first embodiment is as follows.

본 발명의 일 실시예에 따른 실리콘 음극재는 실리콘 일차 입자가 응집되어 형성된 실리콘 이차 입자를 포함하되, 상기 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 가진다. A silicon anode material according to one embodiment of the present invention includes silicon secondary particles formed by agglomeration of silicon primary particles, and has a bridge connecting adjacent silicon primary particles within the silicon secondary particles.

일 실시예에 있어서, 상기 브릿지는 냉간 용접에 의해 형성된 것일 수 있다. In one embodiment, the bridge may be formed by cold welding.

일 실시예에 있어서, 상기 실리콘 이차입자의 표면에는 탄소 코팅층이 형성될 수 있다. In one embodiment, a carbon coating layer may be formed on the surface of the silicon secondary particle.

일 실시예에 있어서, 상기 탄소 코팅층은 결정질 탄소 또는 비결정질 탄소일 수 있다. 결정질 탄소는 비결정질 탄소에 비해 상대적으로 전도성이 높으며, 예를 들어 결정질 탄소로는 인조 흑연, 천연 흑연 및 그래핀으로 이루어진 군에서 선택되는 적어도 어느 하나일 수 있다. 비결정질 탄소는 하드 카본, 소프트 카본, 석유계 피치, 석탄계 피치, 메조페이스 피치 및 소성 코크스로 이루어진 군에서 선택되는 적어도 어느 하나 일 수 있다. In one embodiment, the carbon coating layer may be crystalline carbon or amorphous carbon. Crystalline carbon has relatively high conductivity compared to amorphous carbon, and for example, the crystalline carbon may be at least one selected from the group consisting of artificial graphite, natural graphite, and graphene. The amorphous carbon may be at least one selected from the group consisting of hard carbon, soft carbon, petroleum pitch, coal pitch, mesophase pitch, and calcined coke.

일 실시예에 있어서, 상기 실리콘 이차입자는 외곽에서 중심부로 갈수록 상기 실리콘 일차입자가 조밀하게 응집되어 있는 것일 수 있다. In one embodiment, the silicon secondary particles may be such that the silicon primary particles are more densely aggregated from the periphery to the center.

본 발명의 다른 실시예에 따른 실리콘 음극재의 제조방법은 밀링기를 이용하여 실리콘 원료 분말을 분쇄하여 실리콘 일차 입자를 형성하면서, 동시에 상기 실리콘 일차 입자를 응집하여 실리콘 이차 입자를 형성하고, 상기 실리콘 일차 입자의 분쇄 과정에서 발생한 열과 압력에 의해 상기 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 형성한다. A method for manufacturing a silicon anode material according to another embodiment of the present invention comprises: using a milling machine to pulverize silicon raw material powder to form silicon primary particles, while simultaneously agglomerating the silicon primary particles to form silicon secondary particles; and forming bridges connecting adjacent silicon primary particles within the silicon secondary particles by heat and pressure generated during the pulverization process of the silicon primary particles.

다른 실시예에 있어서, 실리콘 원료 분말의 분쇄 및 실리콘 이차 입자의 형성은 공기 분위기에서 수행될 수 있다. In another embodiment, the grinding of the silicon raw material powder and the formation of silicon secondary particles can be performed in an air atmosphere.

다른 실시예에 있어서, 실리콘 원료 분말의 분쇄 및 실리콘 이차 입자의 형성은 비활성 기체 분위기에서 수행될 수 있다. In another embodiment, the grinding of the silicon raw material powder and the formation of silicon secondary particles can be performed in an inert gas atmosphere.

다른 실시예에 있어서, 상기 밀링기는 플라나터리(Planetary) 밀, 어트리션(Attrition) 밀 및 비드(Beads) 밀로 이루어진 군에서 선택되는 적어도 어느 하나일 수 있다. In another embodiment, the milling machine may be at least one selected from the group consisting of a planetary mill, an attrition mill, and a beads mill.

다른 실시예에 있어서, 상기 실리콘 원료 분말의 분쇄는 밀링볼의 존재하에 수행될 수 있다. In another embodiment, the grinding of the silicon raw material powder can be performed in the presence of a milling ball.

다른 실시예에 있어서, 상기 실리콘 원료 분말의 분쇄는 1 내지 6000 rpm으로 1초 내지 60 시간 동안 수행될 수 있다. In another embodiment, the grinding of the silicon raw material powder can be performed at 1 to 6000 rpm for 1 second to 60 hours.

다른 실시예에 있어서, 상기 실리콘 이차 입자를 형성한 후에 상기 실리콘 이차 입자의 표면에 탄소 코팅층을 형성하는 단계를 더 포함할 수 있다. In another embodiment, after forming the silicon secondary particles, a step of forming a carbon coating layer on the surface of the silicon secondary particles may be further included.

제2실시형태의 해결수단은 다음과 같다. The solution for the second embodiment is as follows.

본 발명의 일 실시예에 따른 실리콘 음극재는 실리콘 일차 입자 및 전도성 물질이 응집되어 형성된 실리콘 이차 입자를 포함하되, 상기 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 가진다. A silicon anode material according to one embodiment of the present invention includes silicon secondary particles formed by agglomeration of silicon primary particles and a conductive material, and has a bridge connecting adjacent silicon primary particles within the silicon secondary particles.

일 실시예에 있어서, 상기 전도성 물질은 그래핀, 카본 나노 튜브, 카본 나노 섬유, 인상흑연 및 토상흑연로 이루어진 군에서 선택되는 적어도 어느 하나일 수 있다. In one embodiment, the conductive material may be at least one selected from the group consisting of graphene, carbon nanotubes, carbon nanofibers, graphite, and graphite-like material.

일 실시예에 있어서, 상기 전도성 물질은 실리콘 이차입자를 기준으로 1 내지 15 wt% 포함될 수 있다. In one embodiment, the conductive material may be included in an amount of 1 to 15 wt% based on the silicon secondary particles.

일 실시예에 있어서, 상기 실리콘 이차입자의 표면에는 탄소 코팅층이 형성될 수 있다. In one embodiment, a carbon coating layer may be formed on the surface of the silicon secondary particle.

일 실시예에 있어서, 상기 탄소 코팅층은 결정질 탄소 또는 비결정질 탄소일 수 있다. 결정질 탄소는 비결정질 탄소에 비해 상대적으로 전도성이 높으며, 예를 들어 결정질 탄소로는 인조 흑연, 천연 흑연 및 그래핀으로 이루어진 군에서 선택되는 적어도 어느 하나일 수 있다. 비결정질 탄소는 하드 카본, 소프트 카본, 석유계 피치, 석탄계 피치, 메조페이스 피치 및 소성 코크스로 이루어진 군에서 선택되는 적어도 어느 하나 일 수 있다. In one embodiment, the carbon coating layer may be crystalline carbon or amorphous carbon. Crystalline carbon has relatively high conductivity compared to amorphous carbon, and for example, the crystalline carbon may be at least one selected from the group consisting of artificial graphite, natural graphite, and graphene. The amorphous carbon may be at least one selected from the group consisting of hard carbon, soft carbon, petroleum pitch, coal pitch, mesophase pitch, and calcined coke.

일 실시예에 있어서, 상기 실리콘 이차입자의 중앙부에도 기공이 형성되어 있을 수 있다. In one embodiment, pores may also be formed in the central portion of the silicon secondary particle.

본 발명의 다른 실시예에 따른 실리콘 음극재의 제조방법은 밀링기를 이용하여 전도성 물질 및 실리콘 원료 분말을 분쇄하여 실리콘 일차 입자를 형성하면서, 동시에 상기 실리콘 일차 입자와 분쇄된 전도성 물질을 응집하여 실리콘 이차 입자를 형성하고, 상기 실리콘 일차 입자의 분쇄 과정에서 발생한 열과 압력에 의해 상기 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 형성한다. A method for manufacturing a silicon anode material according to another embodiment of the present invention comprises: using a milling machine to pulverize a conductive material and silicon raw material powder to form silicon primary particles; simultaneously, agglomerating the silicon primary particles and the pulverized conductive material to form silicon secondary particles; and forming bridges connecting adjacent silicon primary particles within the silicon secondary particles by heat and pressure generated during the pulverization process of the silicon primary particles.

다른 실시예에 있어서, 상기 전도성 물질은 그래핀, 카본 나노 튜브, 카본 나노 섬유, 인상흑연 및 토상흑연로 이루어진 군에서 선택되는 적어도 어느 하나일 수 있다. In another embodiment, the conductive material may be at least one selected from the group consisting of graphene, carbon nanotubes, carbon nanofibers, graphite, and graphite-like material.

다른 실시예에 있어서, 상기 전도성 물질은 실리콘 이차입자를 기준으로 1 내지 15 wt% 포함될 수 있다. In another embodiment, the conductive material may be included in an amount of 1 to 15 wt% based on the silicon secondary particles.

다른 실시예에 있어서, 실리콘 원료 분말의 분쇄 및 실리콘 이차 입자의 형성은 공기 분위기에서 수행될 수 있다. In another embodiment, the grinding of the silicon raw material powder and the formation of silicon secondary particles can be performed in an air atmosphere.

다른 실시예에 있어서, 상기 밀링기는 플라나터리(Planetary) 밀, 어트리션(Attrition) 밀 및 비드(Beads) 밀로 이루어진 군에서 선택되는 적어도 어느 하나일 수 있다. In another embodiment, the milling machine may be at least one selected from the group consisting of a planetary mill, an attrition mill, and a beads mill.

다른 실시예에 있어서, 상기 실리콘 원료 분말의 분쇄는 밀링볼의 존재하에 수행될 수 있다. In another embodiment, the grinding of the silicon raw material powder can be performed in the presence of a milling ball.

다른 실시예에 있어서, 상기 실리콘 원료 분말의 분쇄는 1 내지 6000 rpm으로 1초 내지 60 시간 동안 수행될 수 있다. In another embodiment, the grinding of the silicon raw material powder can be performed at 1 to 6000 rpm for 1 second to 60 hours.

다른 실시예에 있어서, 상기 실리콘 이차 입자를 형성한 후에 상기 실리콘 이차 입자의 표면에 탄소 코팅층을 형성하는 단계를 더 포함할 수 있다. In another embodiment, after forming the silicon secondary particles, a step of forming a carbon coating layer on the surface of the silicon secondary particles may be further included.

제3실시형태의 해결수단은 다음과 같다. The solution for the third embodiment is as follows.

본 발명의 일 실시예에 따른 실리콘 음극재는 실리콘 일차 입자 및 산화 실리콘 SiOx(단, 0<X≤2) 입자가 응집되어 형성된 실리콘 이차 입자를 포함하되, 상기 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 가진다. A silicon anode material according to one embodiment of the present invention includes silicon primary particles and silicon secondary particles formed by agglomeration of silicon oxide SiO x (where 0<X≤2) particles, and has a bridge connecting adjacent silicon primary particles within the silicon secondary particles.

일 실시예에 있어서, 상기 산화 실리콘 입자의 함량은 실리콘 이차입자를 기준으로 2 내지 50 wt%일 수 있다. In one embodiment, the content of the silicon oxide particles may be 2 to 50 wt% based on the silicon secondary particles.

일 실시예에 있어서, 상기 실리콘 이차입자의 표면에는 탄소 코팅층이 형성될 수 있다. In one embodiment, a carbon coating layer may be formed on the surface of the silicon secondary particle.

일 실시예에 있어서, 상기 탄소 코팅층은 결정질 탄소 또는 비결정질 탄소일 수 있다. 결정질 탄소는 비결정질 탄소에 비해 상대적으로 전도성이 높으며, 예를 들어 결정질 탄소로는 인조 흑연, 천연 흑연 및 그래핀으로 이루어진 군에서 선택되는 적어도 어느 하나일 수 있다. 비결정질 탄소는 하드 카본, 소프트 카본, 석유계 피치, 석탄계 피치, 메조페이스 피치 및 소성 코크스로 이루어진 군에서 선택되는 적어도 어느 하나 일 수 있다. In one embodiment, the carbon coating layer may be crystalline carbon or amorphous carbon. Crystalline carbon has relatively high conductivity compared to amorphous carbon, and for example, the crystalline carbon may be at least one selected from the group consisting of artificial graphite, natural graphite, and graphene. The amorphous carbon may be at least one selected from the group consisting of hard carbon, soft carbon, petroleum pitch, coal pitch, mesophase pitch, and calcined coke.

본 발명의 다른 실시예에 따른 실리콘 음극재의 제조방법은 밀링기를 이용하여 실리콘 원료 분말 및 산화 실리콘 SiOx(단, 0<X≤2) 입자를 분쇄하여 실리콘 일차 입자를 형성하면서, 동시에 상기 실리콘 일차 입자와 분쇄된 산화 실리콘을 응집하여 실리콘 이차 입자를 형성하고, 상기 실리콘 일차 입자의 분쇄 과정에서 발생한 열과 압력에 의해 상기 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 형성한다. According to another embodiment of the present invention, a method for manufacturing a silicon anode material comprises: using a milling machine to pulverize silicon raw material powder and silicon oxide SiO x (wherein 0<X≤2) particles to form silicon primary particles; simultaneously, agglomerating the silicon primary particles and the pulverized silicon oxide to form silicon secondary particles; and forming bridges connecting adjacent silicon primary particles within the silicon secondary particles by heat and pressure generated during the pulverization process of the silicon primary particles.

다른 실시예에 있어서, 상기 산화 실리콘 입자의 함량은 실리콘 이차입자를 기준으로 2 내지 50 wt%일 수 있다. In another embodiment, the content of the silicon oxide particles may be 2 to 50 wt% based on the silicon secondary particles.

다른 실시예에 있어서, 실리콘 원료 분말의 분쇄 및 실리콘 이차 입자의 형성은 공기 분위기에서 수행될 수 있다. In another embodiment, the grinding of the silicon raw material powder and the formation of silicon secondary particles can be performed in an air atmosphere.

다른 실시예에 있어서, 상기 밀링기는 플라나터리(Planetary) 밀, 어트리션(Attrition) 밀 및 비드(Beads) 밀로 이루어진 군에서 선택되는 적어도 어느 하나일 수 있다. In another embodiment, the milling machine may be at least one selected from the group consisting of a planetary mill, an attrition mill, and a beads mill.

다른 실시예에 있어서, 상기 실리콘 원료 분말의 분쇄는 밀링볼의 존재하에 수행될 수 있다. In another embodiment, the grinding of the silicon raw material powder can be performed in the presence of a milling ball.

다른 실시예에 있어서, 상기 실리콘 원료 분말의 분쇄는 1 내지 6000 rpm으로 1초 내지 60 시간 동안 수행될 수 있다. In another embodiment, the grinding of the silicon raw material powder can be performed at 1 to 6000 rpm for 1 second to 60 hours.

다른 실시예에 있어서, 상기 실리콘 이차 입자를 형성한 후에 상기 실리콘 이차 입자의 표면에 탄소 코팅층을 형성하는 단계를 더 포함할 수 있다.In another embodiment, after forming the silicon secondary particles, a step of forming a carbon coating layer on the surface of the silicon secondary particles may be further included.

제1실시형태에 따른 발명은 다음과 같은 효과를 가진다. The invention according to the first embodiment has the following effects.

제1실시형태의 실리콘 음극재는 실리콘 일차 입자가 응집되어 형성된 실리콘 이차 입자를 포함하되, 상기 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 가진다. 제1실시형태의 실리콘 음극재는 실리콘 일차입자가 응집되면서 형성된 기공에 의해 이차전지의 충방전 과정동안 실리콘 이차입자의 반복적인 부피 팽창-수축에 의한 응력을 분산시켜 우수한 내구성을 가진다. 특히, 제1실시형태의 실리콘 음극재는 이차전지의 충방전 과정동안 실리콘 이차입자의 반복적인 부피 팽창-수축이 일어나는 동안에도 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지가 유지되어 미분화를 막을 수 있다. 한편, 제1실시형태의 실리콘 음극재의 제조방법은 실리콘 원료 분말의 분쇄와 실리콘 이차입자의 형성이 하나의 공정으로 이루어져 매우 간단하며, 유기용매를 사용하지 않아 친환경적인 공정이다. A silicon anode material of a first embodiment includes silicon secondary particles formed by agglomeration of silicon primary particles, and has bridges connecting adjacent silicon primary particles within the silicon secondary particles. The silicon anode material of the first embodiment has excellent durability by dispersing stress caused by repeated volume expansion and contraction of the silicon secondary particles during the charge and discharge process of a secondary battery due to pores formed by agglomeration of the silicon primary particles. In particular, the silicon anode material of the first embodiment can prevent micronization by maintaining the bridges connecting adjacent silicon primary particles within the silicon secondary particles even when the repeated volume expansion and contraction of the silicon secondary particles occurs during the charge and discharge process of a secondary battery. Meanwhile, the method for manufacturing the silicon anode material of the first embodiment is very simple because the pulverization of silicon raw material powder and the formation of silicon secondary particles are performed in a single process, and is an environmentally friendly process because no organic solvent is used.

제2실시형태에 따른 발명은 다음과 같은 효과를 가진다. 참고로 제2실시형태에 따른 발명은 제1실시형태의 효과도 가지고 있으며, 이에 중복되는 설명은 생략한다. The invention according to the second embodiment has the following effects. For reference, the invention according to the second embodiment also has the effects of the first embodiment, and any duplicate explanations thereof will be omitted.

제2실시형태의 실리콘 음극재는 실리콘 일차 입자와 함께 응집된 전도성 물질이 전기전도 경로를 제공하여 종래 실리콘 음극재의 단점인 낮은 전도도 문제를 해결한다. 한편, 제 2실시형태의 실리콘 음극재의 제조방법은 실리콘 원료 분말의 분쇄와 실리콘 이차입자의 형성과정에서 전도성 물질의 혼입에 따라 실리콘 일차 입자의 비결정성이 유도되고, 실리콘 이차 입자의 중앙부에도 내부 기공 구조가 형성되는 효과가 있다. The silicon anode material of the second embodiment solves the problem of low conductivity, which is a shortcoming of conventional silicon anode materials, by providing an electrical conduction path with a conductive material aggregated together with silicon primary particles. Meanwhile, the method for manufacturing the silicon anode material of the second embodiment has the effect of inducing amorphousness of silicon primary particles by mixing a conductive material during the process of grinding silicon raw material powder and forming silicon secondary particles, and forming an internal porous structure in the central portion of the silicon secondary particles.

제3실시형태에 따른 발명은 다음과 같은 효과를 가진다. 참고로 제2실시형태에 따른 발명은 제1실시형태의 효과도 가지고 있으며, 이에 중복되는 설명은 생략한다. The invention according to the third embodiment has the following effects. For reference, the invention according to the second embodiment also has the effects of the first embodiment, and any duplicate explanations thereof will be omitted.

제3실시형태의 실리콘 음극재는 실리콘 일차 입자와 함께 응집된 산화 실리콘 입자는 이차전지의 충방전 과정동안 실리콘 이차입자의 반복적인 부피 팽창-수축을 억제하는 버퍼의 역할을 수행한다. 또한, 산화실리콘 입자 이차전지의 충방전 과정이 반복되는 동안 내부에 수 내지 수십 나노미터 크기의 실리콘이 형성되어 용량이 발현된다. 이에 따라 제3실시형태의 실리콘 음극재는 이차전지의 장수명 특성을 향상시킬 수 있다. The silicon anode material of the third embodiment comprises silicon oxide particles aggregated with silicon primary particles, which serve as a buffer to suppress the repetitive volume expansion and contraction of the silicon secondary particles during the charge and discharge process of the secondary battery. In addition, during the repeated charge and discharge process of the silicon oxide particle secondary battery, silicon particles having a size of several to several tens of nanometers are formed inside, thereby developing capacity. Accordingly, the silicon anode material of the third embodiment can improve the long-life characteristics of the secondary battery.

이상에서 설명한 제1실시형태 내지 제3실시형태는 서로 조합될 수 있으며, 조합될 경우 각각의 효과를 함께 가질 수 있다. 한편, 여기에서 명시적으로 언급되지 않은 효과라 하더라도, 본 발명의 기술적 특징에 의해 기대되는 이하의 명세서에서 기재된 효과 및 그 잠정적인 효과는 본 발명의 명세서에 기재된 것과 같이 취급됨을 첨언한다.The first through third embodiments described above can be combined with each other, and when combined, each can have its own unique effects. Furthermore, even if an effect is not explicitly mentioned herein, it should be noted that the effects and potential effects described in the following specification, expected by the technical features of the present invention, are treated as if they were described in the specification of the present invention.

도 1은 본 발명의 실리콘 음극재의 제조방법의 개략적 플로우 차트이다. Figure 1 is a schematic flow chart of a method for manufacturing a silicon negative electrode material of the present invention.

도 2는 본 발명의 실리콘 음극재에 포함된 실리콘 이차입자의 전자 현미경 사진으로서, (가) 분쇄-웰딩 공정 전 마이크론 실리콘의 전자 현미경 사진과 (나) 분쇄-웰딩 공정 후 실리콘 입자의 전자 현미경 사진에 관한 것이다. FIG. 2 is an electron microscope photograph of silicon secondary particles included in the silicon negative electrode material of the present invention, including (a) an electron microscope photograph of micron silicon before the pulverization-welding process and (b) an electron microscope photograph of silicon particles after the pulverization-welding process.

도 3은 본 발명의 실리콘 음극재에 포함된 실리콘 이차입자를 주사 전자 현미경으로 관측한 것으로서, 실리콘 일차입자와 그 사이를 연결하는 브릿지를 관측한 것이다. Figure 3 is a scanning electron microscope image of silicon secondary particles included in the silicon negative electrode material of the present invention, and shows silicon primary particles and bridges connecting them.

도 4는 본 발명의 실리콘 음극재의 제조방법에 따른 분쇄-웰딩 공정 후 실리콘 입자 단면의 전자 현미경 사진으로서, (가) 실리콘 입자 단면의 전자 현미경 사진, (나) 실리콘 입자 중심 부분의 전자 현미경 사진, 및 (다) 실리콘 입자 가장자리의 전자 현미경 사진에 관한 것이다. FIG. 4 is an electron microscope photograph of a cross-section of a silicon particle after a grinding-welding process according to a method for manufacturing a silicon anode material of the present invention, including (a) an electron microscope photograph of a cross-section of a silicon particle, (b) an electron microscope photograph of a central portion of a silicon particle, and (c) an electron microscope photograph of an edge of a silicon particle.

도 5은 실리콘 원료 분말(Bare Si)과 실리콘 이차입자 (BMSi)의 BET를 분석한 결과이다.Figure 5 shows the results of BET analysis of silicon raw material powder (Bare Si) and silicon secondary particles (BMSi).

도 6은 본 발명의 실리콘 음극재의 제조방법에 따른 분쇄-웰딩 공정 후 실리콘 입자의 전자 현미경 사진으로서, (좌) 비활성 기체(Ar) 분위기에서 분쇄-웰딩 공정이 수행된 경우와 (우) 대기 분위기에서 분쇄-웰딩 공정이 수행된 경우를 나타낸 것이다. FIG. 6 is an electron microscope photograph of silicon particles after a grinding-welding process according to a method for manufacturing a silicon anode material of the present invention, showing (left) a case where the grinding-welding process was performed in an inert gas (Ar) atmosphere and (right) a case where the grinding-welding process was performed in an air atmosphere.

도 7은 본 발명의 실리콘 음극재의 제조방법에 따른 분쇄-웰딩 공정의 수행 시간별 (500 ~ 1500 min) 입도크기 (D50) 분석을 한 결과이다. Figure 7 shows the results of particle size (D50) analysis according to the time (500 to 1500 min) of the grinding-welding process according to the method for manufacturing a silicon negative electrode material of the present invention.

도 8은 본 발명의 실리콘 음극재에 포함된 실리콘 이차입자에 탄소 코팅층(그래핀)을 형성한 후의 전자 현미경 사진으로서, (가) 전체적인 표면의 전자 현미경 사진과 (나) 단면의 전자 현미경 사진이다. Figure 8 is an electron microscope photograph after forming a carbon coating layer (graphene) on a silicon secondary particle included in the silicon negative electrode material of the present invention, including (a) an electron microscope photograph of the entire surface and (b) an electron microscope photograph of a cross-section.

도 9는 본 발명의 실리콘 음극재에서 이용한 화학기상 증착법의 탄소 전구체 반응시간에 따른 탄소 코팅층의 전자 현미경 사진이다.Figure 9 is an electron microscope photograph of a carbon coating layer according to the carbon precursor reaction time of the chemical vapor deposition method used in the silicon anode material of the present invention.

도 10은 탄소 코팅층(그래핀)이 코팅된 실리콘 이차 입자의 라만 분광 측정 결과로서, (위) 탄소 전구체 반응시간이 4시간인 경우와 (아래) 탄소 전구체 반응시간이 1시간인 경우의 측정 결과이다. Figure 10 shows the results of Raman spectroscopy measurements of silicon secondary particles coated with a carbon coating layer (graphene), with (top) the results when the carbon precursor reaction time is 4 hours and (bottom) the results when the carbon precursor reaction time is 1 hour.

도 11은 탄소 코팅층(그래핀)이 코팅된 실리콘 이차입자(BMSi@Gr)에 흑연에 섞어 용량 500mAh/g로 제어한 음극재를 이용한 리튬이온 음극 반쪽전지의 반복 충방전 횟수에 따른 방전용량을 측정한 결과이다. Figure 11 shows the results of measuring the discharge capacity according to the number of repeated charge and discharge cycles of a lithium-ion negative electrode half-cell using a negative electrode material controlled to a capacity of 500 mAh/g by mixing graphite with silicon secondary particles (BMSi@Gr) coated with a carbon coating layer (graphene).

도 12는 탄소 코팅층(그래핀)이 코팅된 실리콘 이차입자(BMSi@Gr)에 흑연에 섞어 용량 500mAh/g로 제어한 음극재를 이용한 리튬이온 음극 반쪽전지의 반복 충방전 횟수에 따른 쿨롱 효율을 측정한 것이다. Figure 12 shows the Coulombic efficiency according to the number of repeated charge/discharge cycles of a lithium-ion negative electrode half-cell using a negative electrode material controlled to a capacity of 500 mAh/g by mixing graphite with silicon secondary particles (BMSi@Gr) coated with a carbon coating layer (graphene).

도 13은 탄소 코팅층(피치쉘)이 코팅된 실리콘 이차 입자 표면의 전자 현미경 사진이다. Figure 13 is an electron microscope photograph of the surface of a silicon secondary particle coated with a carbon coating layer (pitch shell).

도 14는 실리콘 일차입자와 분쇄된 전도성 물질이 혼합되어 형성된 실리콘 이차입자의 개략적 모식도이다. Figure 14 is a schematic diagram of a silicon secondary particle formed by mixing silicon primary particles and pulverized conductive material.

도 15는 본 발명의 실리콘 음극재에 포함된 실리콘 이차입자의 전자 현미경 사진으로서, 실리콘 일차입자와 분쇄된 전도성 물질이 혼합되어 형성된 실리콘 이차입자에 관한 것이다. FIG. 15 is an electron microscope photograph of a silicon secondary particle included in a silicon negative electrode material of the present invention, and relates to a silicon secondary particle formed by mixing silicon primary particles and a pulverized conductive material.

도 16은 본 발명의 실리콘 음극재에 포함된 실리콘 이차입자의 단면의 전자 현미경 사진으로서, 실리콘 일차입자와 분쇄된 전도성 물질이 혼합되어 형성된 실리콘 이차입자에 관한 것이다.Fig. 16 is an electron microscope photograph of a cross-section of a silicon secondary particle included in a silicon negative electrode material of the present invention, and relates to a silicon secondary particle formed by mixing silicon primary particles and a pulverized conductive material.

도 17은 본 발명의 실리콘 음극재에 포함된 실리콘 이차입자의 단면의 XRD 데이터로서, 실리콘 일차입자와 분쇄된 전도성 물질이 혼합되어 형성된 실리콘 이차입자에 관한 것이다.Fig. 17 is XRD data of a cross-section of a silicon secondary particle included in a silicon negative electrode material of the present invention, and relates to a silicon secondary particle formed by mixing silicon primary particles and a pulverized conductive material.

도 18은 본 발명의 실리콘 음극재에 포함된 실리콘 이차입자의 단면의 전자 현미경 사진으로서, 실리콘 일차입자와 분쇄된 전도성 물질이 혼합되어 형성된 실리콘 이차입자에 탄소 코팅층(피치)이 형성된 것에 관한 것이다.Fig. 18 is an electron microscope photograph of a cross-section of a silicon secondary particle included in a silicon negative electrode material of the present invention, in which a carbon coating layer (pitch) is formed on a silicon secondary particle formed by mixing silicon primary particles and a pulverized conductive material.

도 19는 탄소 코팅층(피치)이 코팅되었으며 실리콘 일차입자와 분쇄된 전도성 물질이 혼합되어 형성된 실리콘 이차입자(BMSi-G@Gr, 실시예 2-2)에 흑연에 섞어 용량 500mAh/g로 제어한 음극재를 이용한 리튬이온 음극 반쪽전지의 반복 충방전 횟수에 따른 용량 및 쿨롱 효율을 측정한 것이다.Figure 19 shows the capacity and coulombic efficiency according to the number of repeated charge/discharge cycles of a lithium ion negative electrode half-cell using a negative electrode material that was mixed with graphite and controlled to a capacity of 500 mAh/g, and formed by mixing silicon primary particles and pulverized conductive materials (BMSi-G@Gr, Example 2-2) coated with a carbon coating layer (pitch).

도 20은 실시예 2-1, 비교예 2-1 및 비교예 2-2의 Nyquist plots를 도시한 것이다. Figure 20 illustrates Nyquist plots of Example 2-1, Comparative Example 2-1, and Comparative Example 2-2.

도 21은 탄소 코팅층(피치)이 코팅되었으며 실리콘 일차입자와 분쇄된 전도성 물질이 혼합되어 형성된 실리콘 이차입자(BMSi-G@Gr, 실시예 2-3)를 포함하는 음극재를 이용한 리튬이온 음극 반쪽전지의 반복 충방전 횟수에 따른 용량 및 쿨롱 효율을 측정한 것으로서, 피치 비율에 따른 음극 반쪽전지의 반복 충방전 횟수에 따른 용량 및 쿨롱 효율을 도시한 것이다 (빨간색 그래프 BMSi-G : Pitch = 1 : 1, 보라색 그래프 BMSi-G : Pitch = 1 : 0.8, 파란색 그래프 BMSi-G : Pitch = 1 : 0.6). Figure 21 shows the capacity and coulombic efficiency according to the number of repeated charge/discharge cycles of a lithium ion negative electrode half-cell using a negative electrode material including silicon secondary particles (BMSi-G@Gr, Example 2-3) coated with a carbon coating layer (pitch) and formed by mixing silicon primary particles and pulverized conductive materials, and shows the capacity and coulombic efficiency according to the number of repeated charge/discharge cycles of the negative electrode half-cell according to the pitch ratio (red graph BMSi-G: Pitch = 1:1, purple graph BMSi-G: Pitch = 1:0.8, blue graph BMSi-G: Pitch = 1:0.6).

도 22는 본 발명의 실리콘 음극재에 포함된 실리콘 이차입자의 전자 현미경 사진으로서, 실리콘 일차입자와 분쇄된 산화 실리콘 입자가 혼합되어 형성된 실리콘 이차입자에 관한 것이다.Fig. 22 is an electron microscope photograph of a silicon secondary particle included in a silicon negative electrode material of the present invention, and relates to a silicon secondary particle formed by mixing silicon primary particles and pulverized silicon oxide particles.

도 23은 본 발명의 실리콘 음극재에 포함된 실리콘 이차입자의 단면의 전자 현미경 사진으로서, 실리콘 일차입자와 분쇄된 산화 실리콘 입자가 혼합되어 형성된 실리콘 이차입자에 관한 것이다.Fig. 23 is an electron microscope photograph of a cross-section of a silicon secondary particle included in a silicon negative electrode material of the present invention, and relates to a silicon secondary particle formed by mixing silicon primary particles and pulverized silicon oxide particles.

도 24는 실리콘 일차입자와 분쇄된 산화 실리콘 입자가 혼합되어 형성된 실리콘 이차입자를 포함하는 음극재를 이용한 리튬이온 음극 반쪽전지의 반복 충방전 횟수에 따른 용량 및 쿨롱 효율을 측정한 것이다. Figure 24 shows the capacity and coulombic efficiency measured according to the number of repeated charge and discharge cycles of a lithium ion negative electrode half-cell using a negative electrode material including silicon secondary particles formed by mixing silicon primary particles and pulverized silicon oxide particles.

도 25는 분쇄 시간에 따른 실리콘 일차입자와 분쇄된 산화 실리콘 입자가 혼합(실리콘 원료 분말 및 산화 실리콘 입자의 중량비가 20:1인 경우)되어 형성된 실리콘 이차입자의 XRD 측정 결과이다. Figure 25 shows the XRD measurement results of silicon secondary particles formed by mixing silicon primary particles and pulverized silicon oxide particles according to the pulverization time (when the weight ratio of silicon raw material powder and silicon oxide particles is 20:1).

도 26은 분쇄 시간에 따른 실리콘 일차입자와 분쇄된 산화 실리콘 입자가 혼합(실리콘 원료 분말 및 산화 실리콘 입자의 중량비가 1:1인 경우)되어 형성된 실리콘 이차입자의 XRD 측정 결과이다. Figure 26 shows the XRD measurement results of silicon secondary particles formed by mixing silicon primary particles and pulverized silicon oxide particles according to the pulverization time (when the weight ratio of silicon raw material powder and silicon oxide particles is 1:1).

도 27은 탄소 코팅층(피치)이 코팅되었으며 실리콘 일차입자와 분쇄된 산화 실리콘 입자가 혼합되어 형성된 실리콘 이차입자(BMSi-SOx@Pitch, 실시예 3-3)를 포함하는 음극재를 이용한 리튬이온 음극 반쪽전지의 반복 충방전 횟수에 따른 용량 및 쿨롱 효율을 측정한 것이다. Figure 27 shows the capacity and coulombic efficiency according to the number of repeated charge and discharge cycles of a lithium ion negative electrode half-cell using a negative electrode material including silicon secondary particles (BMSi-SOx@Pitch, Example 3-3) coated with a carbon coating layer (pitch) and formed by mixing silicon primary particles and pulverized silicon oxide particles.

첨부된 도면은 본 발명의 기술사상에 대한 이해를 위하여 참조로서 예시된 것임을 밝히며, 그것에 의해 본 발명의 권리범위가 제한되지는 아니한다.It is to be understood that the attached drawings are provided for reference only to help understand the technical concept of the present invention, and the scope of the present invention is not limited thereby.

이하, 도면을 참조하여 본 발명의 다양한 실시예가 안내하는 본 발명의 구성과 그 구성으로부터 비롯되는 효과에 대해 살펴본다. 본 발명을 설명함에 있어서 관련된 공지기능에 대하여 이 분야의 기술자에게 자명한 사항으로서 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명을 생략한다.Hereinafter, with reference to the drawings, the configuration of the present invention, guided by various embodiments thereof, and the effects resulting from such configurations will be examined. In describing the present invention, detailed descriptions of related, well-known functions that are obvious to those skilled in the art and that may unnecessarily obscure the gist of the present invention will be omitted.

본 특허문서에서 마이크로 실리콘은 수 내지 수백 마이크로미터의 평균 입자 크기 범위를 가지는 실리콘을 의미하며, 나노 실리콘은 수 내지 수백 나노미터의 평균 입자 크기를 가지는 실리콘을 의미한다. In this patent document, micro silicon means silicon having an average particle size range of several to several hundred micrometers, and nano silicon means silicon having an average particle size of several to several hundred nanometers.

본 발명은 일차 입자가 응집되어 형성된 이차 입자를 포함하는 실리콘 음극재 및 이의 제조방법에 관한 것이다. 아래에서는 설명의 명확성을 위하여 다양한 실시형태를 나누어 각각 설명하지만, 각각의 실시형태는 서로 조합될 수 있다. The present invention relates to a silicon anode material comprising secondary particles formed by agglomeration of primary particles, and a method for manufacturing the same. For clarity, various embodiments are described separately below, but the embodiments can be combined with each other.

먼저, 제1실시형태부터 살펴보도록 한다 First, let's look at the first embodiment.

도 1은 본 발명의 실리콘 음극재의 제조방법의 개략적 플로우 차트이다. Figure 1 is a schematic flow chart of a method for manufacturing a silicon negative electrode material of the present invention.

본 발명의 실리콘 음극재는 실리콘 일차 입자가 응집되어 형성된 실리콘 이차 입자를 포함하되, 상기 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 가진다. The silicon anode material of the present invention includes silicon secondary particles formed by agglomeration of silicon primary particles, and has a bridge connecting adjacent silicon primary particles within the silicon secondary particles.

여기서 실리콘 일차 입자는 실리콘 원료 분말을 밀링기로 분쇄하여 형성된 것일 수 있다. 실리콘 원료 분말로는 서브 마이크론 및 마이크로 실리콘 분말을 이용할 수 있으며, 실리콘 원료 분말을 분쇄하면 나노 실리콘이 형성되는데, 이 나노 실리콘이 실리콘 일차 입자이다. Here, the silicon primary particles may be formed by milling silicon raw material powder using a milling machine. Submicron and micro silicon powders can be used as the silicon raw material powder, and when silicon raw material powder is milled, nano silicon is formed, and this nano silicon is the silicon primary particle.

다만, 본 발명에서는 실리콘 원료 분말을 분쇄하는 과정에서 실리콘 일차 입자만 형성되는 것이 아니라, 수 내지 수백 나노미터 크기의 실리콘 일차 입자를 응집하여 수 내지 수십 마이크로미터 크기의 실리콘 이차 입자를 형성(도 2 참조)하면서, 상기 실리콘 일차 입자의 분쇄 과정에서 발생한 열과 압력에 의해 상기 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지가 형성되는 것을 특징으로 한다. 도 3을 보면, 서로 인접하는 실리콘 일차 일차입자 사이가 단순히 접촉하는 것이 아니라 냉간 용접에 의해 브릿지가 형성되어 확인할 수 있다. However, in the present invention, in the process of pulverizing silicon raw material powder, not only silicon primary particles are formed, but silicon secondary particles having a size of several to several tens of micrometers are formed by agglomerating silicon primary particles having a size of several to several hundred nanometers (see Fig. 2), and bridges connecting adjacent silicon primary particles are formed within the silicon secondary particles by heat and pressure generated during the process of pulverizing the silicon primary particles. As shown in Fig. 3, it can be confirmed that adjacent silicon primary particles are not simply in contact, but bridges are formed by cold welding.

발명의 실리콘 음극재의 제조방법은 밀링기로 플라나터리(Planetary) 밀, 어트리션(Attrition) 밀 또는 비드(Beads) 밀 등의 볼 밀링기를 이용할 수 있다. 실리콘 원료 분말과 밀링볼을 용기에 함께 장입하고, 공기 분위기 또는 비활성기체 분위기에서 분쇄는 1 내지 6000 rpm으로 1초 내지 60 시간 동안 수행할 수 있다. 분쇄의 속도와 시간은 실리콘 일차입자와 실리콘 이차입자의 크기 제어, 그리고 브릿지의 형성을 위해 조절될 수 있다. 밀링볼로는 지름이 0.3 내지 100 cm인 탄소강, 스테인리스강, 지르코늄디옥사이드 등의 밀링볼을 이용할 수 있다. 비활성 기체로는 헬륨, 네온, 아르곤, 크립톤 및 제논으로 이루어진 군에서 선택되는 적어도 어느 하나를 이용할 수 있다. The method for manufacturing the silicon anode material of the invention may use a ball mill such as a planetary mill, an attrition mill, or a bead mill. Silicon raw material powder and milling balls are placed together in a container, and milling can be performed at 1 to 6,000 rpm for 1 second to 60 hours in an air atmosphere or an inert gas atmosphere. The speed and time of the milling can be adjusted to control the size of the silicon primary particles and silicon secondary particles, and to form bridges. Milling balls made of carbon steel, stainless steel, zirconium dioxide, or the like, having a diameter of 0.3 to 100 cm, can be used. The inert gas can be at least one selected from the group consisting of helium, neon, argon, krypton, and xenon.

본 발명의 실리콘 음극재는 실리콘 일차입자가 인접하는 다른 실리콘 일차입자 중 일부 또는 전부와 브릿지에 의해 연결되어 3차원 네트워크가 형성되며, 이에 따라 실리콘 이차입자는 기공 구조를 가지게 된다. In the silicon anode material of the present invention, a three-dimensional network is formed by connecting silicon primary particles to some or all of adjacent silicon primary particles by bridges, and thus the silicon secondary particles have a porous structure.

특히, 제1실시형태의 경우 도 5에서 보는 바와 같이 실리콘 이차입자는 외곽에서 중심부로 갈수록 실리콘 일차입자가 조밀하게 응집되어 있을 수 있다. 즉, 기공이 주로 실리콘 이차입자의 외곽측에 형성된다. In particular, in the case of the first embodiment, as shown in Fig. 5, the silicon secondary particles may be densely aggregated from the outer periphery to the center. In other words, pores are mainly formed on the outer side of the silicon secondary particles.

이차전지의 충방전 과정에서 실리콘 음극재는 부피 팽창-수축을 반복하게 되는데, 실리콘 이차입자에 형성된 기공구조는 부피 팽창-수축에 따른 응력을 분산한다. 또한, 실리콘 이차입자에 형성된 기공구조는 기공을 통한 리튬과 전자의 이동을 용이하게 하여 고속 충방전 효율을 향상시킨다. During the charge and discharge process of a secondary battery, the silicon anode material undergoes repeated volume expansion and contraction. The porous structure formed within the silicon secondary particles disperses the stress resulting from this expansion and contraction. Furthermore, the porous structure formed within the silicon secondary particles facilitates the movement of lithium and electrons through the pores, thereby enhancing high-speed charge and discharge efficiency.

한편, 이차전지의 충방전 과정에서 실리콘 음극재의 부피 팽창-수축 반복은 실리콘 음극재의 미분화를 유발한다. 특히, 본 발명과 같이 실리콘 일차입자가 응집되어 형성된 실리콘 이차입자에서는 미분화 문제가 더욱 심각하다. 하지만 본 발명의 실리콘 음극재는 실리콘 일차입자는 인접하는 다른 실리콘 일차입자와 브릿지로 연결되어 있어, 이차전지의 충방전 과정에서 실리콘 음극재는 부피 팽창-수축을 하더라도 미분화 문제에 강건하다. Meanwhile, repeated volume expansion and contraction of the silicon anode material during the charge and discharge process of the secondary battery causes the silicon anode material to become undifferentiated. In particular, the problem of undifferentiation is more serious in silicon secondary particles formed by agglomeration of silicon primary particles, as in the present invention. However, in the silicon anode material of the present invention, the silicon primary particles are connected to adjacent silicon primary particles by bridges, so that the silicon anode material is robust against the problem of undifferentiation even when it undergoes volume expansion and contraction during the charge and discharge process of the secondary battery.

실리콘 이차입자를 형성한 후에는 실리콘 이차입자에 탄소 코팅층을 코팅하는 단계를 수행할 수 있다. 탄소 코팅층이 형성되면, 실리콘 이차입자의 기공에 탄소 코팅층이 충전되며, 탄소 코팅층이 이차전지의 충방전 과정에서 실리콘 음극재의 부피 팽창-수축을 억제하는 버퍼역할을 할 수 있다. After forming the silicon secondary particles, a step of coating the silicon secondary particles with a carbon coating layer can be performed. Once the carbon coating layer is formed, the pores of the silicon secondary particles are filled with the carbon coating layer, and the carbon coating layer can act as a buffer to suppress volume expansion and contraction of the silicon anode material during the charge and discharge process of the secondary battery.

탄소 코팅층은 결정질 탄소 또는 비결정질 탄소일 수 있다. 결정질 탄소는 비결정질 탄소에 비해 상대적으로 전도성이 높으며, 예를 들어 결정질 탄소로는 인조 흑연, 천연 흑연 및 그래핀으로 이루어진 군에서 선택되는 적어도 어느 하나일 수 있다. 비결정질 탄소는 하드 카본, 소프트 카본, 석유계 피치, 석탄계 피치, 메조페이스 피치 및 소성 코크스로 이루어진 군에서 선택되는 적어도 어느 하나 일 수 있다. The carbon coating layer may be crystalline carbon or amorphous carbon. Crystalline carbon has relatively high conductivity compared to amorphous carbon, and for example, the crystalline carbon may be at least one selected from the group consisting of artificial graphite, natural graphite, and graphene. The amorphous carbon may be at least one selected from the group consisting of hard carbon, soft carbon, petroleum pitch, coal pitch, mesophase pitch, and calcined coke.

또한, 탄소 코팅층은 1차 코팅층과 1차 코팅층이 형성된 실리콘 이차입자의 표면을 감싸는 2차 코팅층으로 구성될 수 있다. 1차 코팅층은 결정질 탄소 또는 비결정질 탄소 일 수 있으며, 2차 코팅층은 결정질 탄소 또는 비결정질 탄소 일 수 있다. 1차 코팅층과 2차코팅층은 서로 같은 물질이거나, 서로 다른 물질일 수 있다. Additionally, the carbon coating layer may be composed of a primary coating layer and a secondary coating layer that covers the surface of the silicon secondary particle on which the primary coating layer is formed. The primary coating layer may be crystalline carbon or amorphous carbon, and the secondary coating layer may be crystalline carbon or amorphous carbon. The primary coating layer and the secondary coating layer may be of the same material or different materials.

결정질 탄소로 이루어진 탄소 코팅층은 화학 기상 증착 반응을 통해 형성될 수 있다. 화학 기상 증착 반응은 승온 단계, 항온 단계 및 강온 단계를 포함한다. 승온은 수소, 질소, 아르곤 등의 분위기에서 수행될 수 있으며, 가스 유량은 10 ~ 300 mL/min이고, 승온 속도는 1 ~ 100 ℃일 수 있다. 항온 온도는 600 ~ 1500 ℃이고, 항온 시간은 1 ~ 1000 min일 수 있다. 상기 강온 단계는 질소, 아르곤 등의 비활성 가스 분위기에서 수행되며, 상기 가스의 유량은 10 ~ 300 mL/min이고, 강온 속도는 1 ~ 100 ℃이며, 강온 후엔 자연 냉각할 수 있다. A carbon coating layer composed of crystalline carbon can be formed through a chemical vapor deposition reaction. The chemical vapor deposition reaction includes a temperature-raising step, a constant temperature step, and a temperature-lowering step. The temperature-raising step can be performed in an atmosphere of hydrogen, nitrogen, argon, etc., the gas flow rate can be 10 to 300 mL/min, and the temperature-raising rate can be 1 to 100°C. The constant temperature can be 600 to 1500°C, and the constant temperature time can be 1 to 1000 min. The temperature-lowering step is performed in an atmosphere of an inert gas such as nitrogen or argon, the gas flow rate can be 10 to 300 mL/min, the temperature-lowering rate can be 1 to 100°C, and natural cooling can be performed after the temperature-lowering step.

비결정질 탄소로 이루어진 탄소 코팅층은 비결정질 탄소 열처리 반응 공정을 이용해 형성될 수 있다. 하드 카본, 소프트 카본, 석유계 피치, 석탄계 피치, 메조페이스 피치 및 소성 코크스로 이루어진 군에서 선택되는 적어도 어느 하나의 비결정질 탄소 입자와 실리콘 이차입자를 혼합하여 열처리를 진행한다. 혼합하는 방법은 크게 두가지로 습식 또는 건식 혼합법이 적용될 수 있다. 습식코팅의 경우에는 피치를 유기용매에 녹인 후 실리콘 이차입자와 혼합해 섞어준 후 건조한다. 유기용매로는 아세톤, 에탄올, Tetrahydrofuran (THF), Toluene, n-hexane, Quinoline 중 적어도 하나를 선택할 수 있다. 건식 혼합법은 실리콘 이차입자와 비결정질 탄소 입자를 혼합기에 장입하여 100 ~ 7000 RPM 범위에서 10초 ~ 1시간으로 처리 시간을 설정한 후 혼합해 준다. 실리콘 이차입자에 비결정질 탄소 입자가 코팅 또는 혼합되면 열처리를 수행한다. 고온 열처리는 승온 단계, 항온 단계 및 강온 단계를 포함하며, 승온은 질소, 아르곤 등의 분위기에서 수행되며, 가스 유량은 10 ~ 300 mL/min이고, 승온 속도는 1 ~ 100 ℃이다. 항온 온도는 100 ~ 1500 ℃이고, 항온 시간은 1 ~ 1000 min으로 한다. 강온 단계는 질소, 아르곤 등의 비활성 가스 분위기에서 수행되며, 가스의 유량은 10 ~ 300 mL/min이고, 강온 속도는 1 ~ 100 ℃이며, 강온 후엔 자연 냉각한다. A carbon coating layer composed of amorphous carbon can be formed using an amorphous carbon heat treatment reaction process. Heat treatment is performed by mixing silicon secondary particles with at least one amorphous carbon particle selected from the group consisting of hard carbon, soft carbon, petroleum pitch, coal pitch, mesophase pitch, and calcined coke. There are two main mixing methods: wet or dry. For wet coating, the pitch is dissolved in an organic solvent, mixed with the silicon secondary particles, and then dried. The organic solvent can be at least one of acetone, ethanol, tetrahydrofuran (THF), toluene, n-hexane, or quinoline. For dry mixing, the silicon secondary particles and amorphous carbon particles are placed in a mixer and mixed at a speed of 100 to 7,000 RPM for a processing time of 10 seconds to 1 hour. Once the amorphous carbon particles are coated or mixed with the silicon secondary particles, heat treatment is performed. High-temperature heat treatment includes a temperature-raising step, a constant temperature step, and a temperature-lowering step. The temperature-raising step is performed in an atmosphere such as nitrogen or argon, the gas flow rate is 10 to 300 mL/min, and the temperature-raising rate is 1 to 100°C. The constant temperature is 100 to 1500°C, and the constant temperature time is 1 to 1000 min. The temperature-lowering step is performed in an inert gas atmosphere such as nitrogen or argon, the gas flow rate is 10 to 300 mL/min, the temperature-lowering rate is 1 to 100°C, and natural cooling is performed after the temperature-lowering step.

실시예 1-1Example 1-1

실리콘 원료 분말 5g 과 SUS 재질의 밀링볼 100g을 플라나터리(Planatery) 밀링기 용기에 장입하고 대기중에서 300 rpm으로 500분 동안 밀링을 수행하였다. 용기에서 밀링된 시료를 꺼내어 볼과 분리하여 실리콘 음극재 샘플을 얻었다.5 g of silicon raw material powder and 100 g of SUS milling balls were placed in a planetary milling container and milled at 300 rpm for 500 minutes in air. The milled sample was taken out of the container and separated from the balls to obtain a silicon anode material sample.

실시예 1-2Example 1-2

실리콘 원료 분말 5g 과 SUS 재질의 밀링볼 100g을 플라나터리(Planatery) 밀링기 용기에 장입하고 비활성 기체(Ar) 분위기에서 300 rpm으로 500분 동안 밀링을 수행하였다. 용기에서 밀링된 시료를 꺼내어 볼과 분리하여 실리콘 음극재 샘플을 얻었다.5 g of silicon raw material powder and 100 g of SUS milling balls were placed in a planetary milling container and milled at 300 rpm for 500 minutes in an inert gas (Ar) atmosphere. The milled sample was taken out of the container and separated from the balls to obtain a silicon anode material sample.

실시예 1-3Example 1-3

실리콘 원료 분말 5g 과 SUS 재질의 밀링볼 100g을 플라나터리(Planatery) 밀링기 용기에 장입하고 대기중에서 300 rpm으로 750분 동안 밀링을 수행하였다. 용기에서 밀링된 시료를 꺼내어 볼과 분리하여 실리콘 음극재 샘플을 얻었다.5 g of silicon raw material powder and 100 g of SUS milling balls were placed in a planetary milling container and milled at 300 rpm for 750 minutes in air. The milled sample was taken out of the container and separated from the balls to obtain a silicon anode material sample.

실시예 1-4Example 1-4

실시예 1-1 에서 제작한 실리콘 이차입자 (BMSi)에 탄소 코팅층을 형성 하기 위해 화학 기상 증착 반응을 이용하였다. 튜브로를 이용하였고 승온시는 아르곤 가스로 로내 분위기를 비활성 분위기 잡아주고, 이후 메탄 (CH4)가스 분위기하에서 1000도 에서 1시간동안 열처리하였다.A chemical vapor deposition reaction was used to form a carbon coating layer on the silicon secondary particle (BMSi) produced in Example 1-1. A tube furnace was used, and the furnace atmosphere was maintained as an inert atmosphere with argon gas during heating, and then heat treatment was performed at 1000 degrees for 1 hour in a methane (CH 4 ) gas atmosphere.

실시예 1-5Example 1-5

실시예 1-4에서 제작한 실리콘 이차입자(BMSi)의 표면에 피치쉘 코팅층을 형성하기 위해 피치 열처리 반응을 이용하였다. 실리콘 이차입자와 피치 입자를 용매(THF)에 혼합한 후 열처리를 수행하였다. 열처리는 튜브로를 이용하였고, 승온부터 열처리까지 아르곤 가스로 로내 분위기를 비활성 분위기 잡아주었다. 피치가 코팅된 실리콘 이차입자(BMSi) 열처리는 두가지 단계로 수행되었으며, 보다 구체적으로는 300도에서 2시간, 1000도에서 1시간 동안 열처리하였다.A pitch heat treatment reaction was used to form a pitch shell coating layer on the surface of the silicon secondary particles (BMSi) manufactured in Example 1-4. The silicon secondary particles and pitch particles were mixed in a solvent (THF) and then heat treated. The heat treatment was performed using a tube furnace, and the furnace atmosphere was maintained as an inert atmosphere with argon gas from the temperature rise to the heat treatment. The heat treatment of the pitch-coated silicon secondary particles (BMSi) was performed in two stages, more specifically, heat treatment was performed at 300°C for 2 hours and at 1000°C for 1 hour.

실시예 1-6Example 1-6

실시예 1-2 에서 제작한 실리콘 이차입자 (BMSi)에 탄소 코팅층을 형성 하기 위해 화학 기상 증착 반응을 이용하였다. 튜브로를 이용하였고 승온시는 아르곤 가스로 로내 분위기를 비활성 분위기 잡아주고, 이후 메탄 (CH4)가스 분위기하에서 1000도 에서 1시간동안 열처리하였다.A chemical vapor deposition reaction was used to form a carbon coating layer on the silicon secondary particles (BMSi) produced in Example 1-2. A tube furnace was used, and the furnace atmosphere was maintained as an inert atmosphere with argon gas during heating, and then heat treatment was performed at 1000 degrees for 1 hour in a methane (CH 4 ) gas atmosphere.

비교예 1-1Comparative Example 1-1

실리콘 원료 분말 5g 과 SUS 재질의 밀링볼 100g을 플라나터리(Planatery) 밀링기 용기에 장입하고 대기중에서 300 rpm으로 1250분 동안 밀링을 수행하였다. 용기에서 밀링된 시료를 꺼내어 볼과 분리하여 실리콘 음극재 샘플을 얻었다. 제조한 실리콘 음극재의 표면에 탄소 코팅층을 형성하였다. 탄소 코팅층을 형성 하기 위해 화학 기상 증착 반응을 이용하였다. 튜브로를 이용하였고 승온시는 아르곤 가스로 로내 분위기를 비활성 분위기 잡아주고, 이후 메탄 (CH4)가스 분위기하에서 1000도 에서 1시간동안 열처리하였다.5g of silicon raw material powder and 100g of SUS milling balls were placed in a planetary milling machine container and milled at 300 rpm for 1250 minutes in the air. The milled sample was taken out of the container and separated from the balls to obtain a silicon anode sample. A carbon coating layer was formed on the surface of the manufactured silicon anode material. A chemical vapor deposition reaction was used to form the carbon coating layer. A tube furnace was used, and the furnace atmosphere was made inert with argon gas during heating, and then heat treatment was performed at 1000 degrees for 1 hour in a methane (CH 4 ) gas atmosphere.

비교예 1-2Comparative Example 1-2

실리콘 원료 분말 5g 과 SUS 재질의 밀링볼 100g을 플라나터리(Planatery) 밀링기 용기에 장입하고 대기중에서 300 rpm으로 1500분 동안 밀링을 수행하였다. 용기에서 밀링된 시료를 꺼내어 볼과 분리하여 실리콘 음극재 샘플을 얻었다. 제조한 실리콘 음극재의 표면에 탄소 코팅층을 형성하였다. 탄소 코팅층을 형성 하기 위해 화학 기상 증착 반응을 이용하였다. 튜브로를 이용하였고 승온시는 아르곤 가스로 로내 분위기를 비활성 분위기 잡아주고, 이후 메탄 (CH4)가스 분위기하에서 1000도 에서 1시간동안 열처리하였다.5g of silicon raw material powder and 100g of SUS milling balls were placed in a planetary milling machine container and milled at 300 rpm for 1500 minutes in the air. The milled sample was taken out of the container and separated from the balls to obtain a silicon anode sample. A carbon coating layer was formed on the surface of the manufactured silicon anode material. A chemical vapor deposition reaction was used to form the carbon coating layer. A tube furnace was used, and the atmosphere inside the furnace was made inert with argon gas during heating, and then heat treatment was performed at 1000 degrees for 1 hour in a methane (CH 4 ) gas atmosphere.

실험예 1Experimental Example 1

도 2는 실시예 1-1의 실리콘 음극재에 포함된 실리콘 이차입자의 전자 현미경 사진으로서, (가) 분쇄-웰딩 공정 전 마이크론 실리콘의 전자 현미경 사진과 (나) 분쇄-웰딩 공정 후 실리콘 입자의 전자 현미경 사진에 관한 것이며, 도 3은 실시예 1-1의 실리콘 음극재에 포함된 실리콘 이차입자를 주사 전자 현미경으로 관측한 것으로서, 실리콘 일차입자와 그 사이를 연결하는 브릿지를 관측한 것이고, 도 4는 실시예 1-1의 실리콘 음극재의 제조방법에 따른 분쇄-웰딩 공정 후 실리콘 입자 단면의 전자 현미경 사진으로서, (가) 실리콘 입자 단면의 전자 현미경 사진, (나) 실리콘 입자 중심 부분의 전자 현미경 사진, 및 (다) 실리콘 입자 가장자리의 전자 현미경 사진에 관한 것이다. FIG. 2 is an electron microscope photograph of silicon secondary particles included in the silicon anode material of Example 1-1, including (a) an electron microscope photograph of micron silicon before the pulverization-welding process and (b) an electron microscope photograph of silicon particles after the pulverization-welding process, FIG. 3 is an electron microscope photograph of silicon secondary particles included in the silicon anode material of Example 1-1, observing silicon primary particles and bridges connecting them, and FIG. 4 is an electron microscope photograph of a cross-section of silicon particles after the pulverization-welding process according to the method for manufacturing the silicon anode material of Example 1-1, including (a) an electron microscope photograph of a cross-section of silicon particles, (b) an electron microscope photograph of a central portion of silicon particles, and (c) an electron microscope photograph of an edge of silicon particles.

도 2 에서 보는 바와 같이 실리콘 이차 입자는 구형으로 형성된다. 실리콘 일차입자는 수 내지 수백 나노미터 정도의 입자 크기를 가진다. 이와 같은 나노 사이즈의 실리콘 일차입자가 응집되어 실리콘 이차입자가 형성되며, 실리콘 이차입자는 수 내지 수십 마이크로 미터 정도의 입자 크기를 가진다. As shown in Fig. 2, silicon secondary particles are formed in a spherical shape. Silicon primary particles have a particle size of several to several hundred nanometers. These nano-sized silicon primary particles aggregate to form silicon secondary particles, which have a particle size of several to several tens of micrometers.

또한, 도 3에서는 보는 바와 같이 인접하는 실리콘 일차입자들은 브릿지에 의해 서로 연결되어 있음을 확인할 수 있다. 즉, 실리콘 원료 분말과 밀링볼 외에 실리콘 일차 입자를 서로 결합시키기 위한 바인더 등이 첨가된 바 없으며, 별도의 열처리도 없이, 실리콘 원료 분말을 밀링하는 과정에서 발생한 열과 압력에 의해 실리콘 일차입자들 사이에 냉간 용접에 의한 브릿지가 형성된 것이다. In addition, as can be seen in Fig. 3, adjacent silicon primary particles are connected to each other by bridges. That is, no binder or the like was added to bind the silicon primary particles together other than the silicon raw material powder and milling balls, and without any separate heat treatment, bridges were formed between the silicon primary particles by cold welding due to the heat and pressure generated during the milling process of the silicon raw material powder.

한편, 도 4에서 보는 것처럼, 실리콘 일차입자가 응집되면서 기공이 형성된다. 이때, 실리콘 이차입자는 외곽에서 중심부로 갈수록 상기 실리콘 일차입자가 조밀하게 응집되어 형성된다. 즉, 기공이 주로 실리콘 이차입자의 외곽에 분포된다. Meanwhile, as shown in Figure 4, pores are formed as silicon primary particles aggregate. At this time, silicon secondary particles are formed as the silicon primary particles aggregate more densely from the periphery to the center. In other words, pores are mainly distributed on the periphery of silicon secondary particles.

도 5는 실리콘 원료 분말(Bare Si)과 실시예 1-1의 실리콘 이차입자 (BMSi)의 BET를 분석한 결과이다. 도 5에서 보는 것처럼 실시예 1-1의 실리콘 이차입자가 실리콘 원료 분말에 비해 확연히 비표면적이 넓은 바, 실리콘 이차입자에 기공이 형성되었음을 확인할 수 있다. Figure 5 shows the results of BET analysis of silicon raw material powder (Bare Si) and silicon secondary particles (BMSi) of Example 1-1. As seen in Figure 5, the silicon secondary particles of Example 1-1 have a significantly larger specific surface area than the silicon raw material powder, confirming that pores were formed in the silicon secondary particles.

도 6은 본 발명의 실리콘 음극재의 제조방법에 따른 분쇄-웰딩 공정 후 실리콘 입자의 전자 현미경 사진으로서, (좌) 비활성 기체(Ar) 분위기에서 분쇄-웰딩 공정이 수행된 경우(실시예 1-2)와 (우) 대기 분위기에서 분쇄-웰딩 공정이 수행된 경우(실시예 1-1)를 나타낸 것이다. FIG. 6 is an electron microscope photograph of silicon particles after a grinding-welding process according to a method for manufacturing a silicon anode material of the present invention, showing (left) a case where the grinding-welding process was performed in an inert gas (Ar) atmosphere (Example 1-2) and (right) a case where the grinding-welding process was performed in an air atmosphere (Example 1-1).

비활성 기체 분위기에서 분쇄-웰딩을 수행한 실시예 1-1과 실시예 1-2를 비교해보면, 비활성기체 분위기에서 분쇄-웰딩이 수행된 경우에도 실리콘 일차입자가 응집이 이루어졌음을 확인할 수 있다. Comparing Examples 1-1 and 1-2, in which grinding-welding was performed in an inert gas atmosphere, it can be confirmed that silicon primary particles were aggregated even when grinding-welding was performed in an inert gas atmosphere.

도 7은 본 발명의 실리콘 음극재의 제조방법에 따른 분쇄-웰딩 공정의 수행 시간별 (500 ~ 1500 min) 입도크기 (D50) 분석을 한 결과이며, 이를 표 1에 정리하였다. Figure 7 shows the results of particle size (D50) analysis according to the time (500 to 1500 min) of the grinding-welding process according to the method for manufacturing a silicon negative electrode material of the present invention, and the results are summarized in Table 1.

조건condition 밀링 시간 (min.)Milling time (min.) D50 (μm)D 50 (μm) 실시예 1-1Example 1-1 500500 5.295.29 실시예 1-3Example 1-3 750750 3.613.61 비교예 1-1Comparative Example 1-1 12501250 3.723.72 비교예 1-2Comparative Example 1-2 15001500 3.813.81

표 1에서 확인할 수 있듯이, 밀링 시간에 따라 입자 크기가 제어된다. 밀링시간이 증가할수록 입도크기(D50)가 작아져 실리콘 이차입자의 크기가 3.6 ~ 3.8 μm로 수렴하게 된다. 또한, 도 7에서 확인할 수 있듯이, 밀링 시간이 증가하면 구형화도 제대로 되지 않는다. 따라서 300 rpm을 기준으로 밀링시간은 300 분 내지 1,000 분이 바람직하다. 다만, 밀링 속도가 달라지면 시간이 달라질 수 있음은 당연하다. As shown in Table 1, particle size is controlled by milling time. As the milling time increases, the particle size ( D50 ) decreases, converging to 3.6 to 3.8 μm for the silicon secondary particles. Furthermore, as shown in Fig. 7, spheroidization becomes less effective as the milling time increases. Therefore, a milling time of 300 to 1,000 minutes is preferable based on 300 rpm. However, it should be noted that the milling time may vary depending on the milling speed.

도 8은 실시예 1-4의 실리콘 음극재에 포함된 실리콘 이차입자에 탄소 코팅층(그래핀)을 형성한 후의 전자 현미경 사진으로서, (가) 전체적인 표면의 전자 현미경 사진과 (나) 단면의 전자 현미경 사진이다. Figure 8 is an electron microscope photograph of a silicon secondary particle included in a silicon anode material of Example 1-4 after forming a carbon coating layer (graphene), including (a) an electron microscope photograph of the entire surface and (b) a cross-sectional electron microscope photograph.

도 8에서 알 수 있듯이, 화학 기상 증착법에 의해 실리콘 이차입자의 표면에 그래핀이 형성된 것을 확인할 수 있다. 특히, 화학 기상 증착법을 이용할 경우 실리콘 이차입자의 표면과 외부 기공 뿐만아니라 내부 기공에서도 그래핀이 균일하게 성장되었음을 알 수 있다. 따라서 탄소 코팅층에 의해 실리콘 이차 입자 내부에도 3차원의 전도성 네트워크가 형성된다. 또한, 기공에 충전된 탄소 코팅층은 이차전지의 충방전 과정에서 실리콘 음극재의 부피 팽창-수축 거동을 억제하는 버퍼역할을 한다. As can be seen in Fig. 8, it can be confirmed that graphene was formed on the surface of the silicon secondary particle by chemical vapor deposition. In particular, when chemical vapor deposition was used, it can be seen that graphene was uniformly grown not only on the surface and external pores of the silicon secondary particle but also in the internal pores. Therefore, a three-dimensional conductive network is formed inside the silicon secondary particle by the carbon coating layer. In addition, the carbon coating layer filled in the pores acts as a buffer to suppress the volume expansion-contraction behavior of the silicon anode material during the charge-discharge process of the secondary battery.

도 9는 본 발명의 실리콘 음극재에서 이용한 화학기상 증착법의 탄소 전구체 반응시간에 따른 탄소 코팅층의 전자 현미경 사진이고, 도 10은 탄소 코팅층(그래핀)이 코팅된 실리콘 이차 입자의 라만 분광 측정 결과로서, (위) 탄소 전구체 반응시간이 4시간인 경우와 (아래) 탄소 전구체 반응시간이 1시간인 경우의 측정 결과이다. FIG. 9 is an electron microscope photograph of a carbon coating layer according to the carbon precursor reaction time of the chemical vapor deposition method used in the silicon anode material of the present invention, and FIG. 10 is a Raman spectroscopy measurement result of a silicon secondary particle coated with a carbon coating layer (graphene), showing the measurement results when (top) the carbon precursor reaction time is 4 hours and (bottom) the carbon precursor reaction time is 1 hour.

도 9에서 보는 바와 같이, 화학기상 증착법의 탄소 전구체 반응시간에 따라 탄소 코팅층의 형상이 달라지며, 반응 시간이 증가할수록 그래핀의 두께와 길이가 길어진다. 또한, 도 10에서 보는 것처럼, 라만 분광 측정결과에도 우수한 결정을 보였다. As shown in Figure 9, the shape of the carbon coating layer varies depending on the carbon precursor reaction time of the chemical vapor deposition method, and as the reaction time increases, the thickness and length of the graphene increase. Furthermore, as shown in Figure 10, the Raman spectroscopy measurement results also showed excellent crystallinity.

도 11은 탄소 코팅층(그래핀)이 코팅된 실리콘 이차입자(BMSi@Gr)에 흑연에 섞어 용량 500mAh/g로 제어한 음극재를 이용한 리튬이온 음극 반쪽전지의 반복 충방전 횟수에 따른 방전용량을 측정한 결과이며, 도 12는 탄소 코팅층(그래핀)이 코팅된 실리콘 이차입자(BMSi@Gr)에 흑연에 섞어 용량 500mAh/g로 제어한 음극재를 이용한 리튬이온 음극 반쪽전지의 반복 충방전 횟수에 따른 쿨롱 효율을 측정한 것이다. 아래의 표 2에는 방전 용량과 쿨롱효율을 정리 하였다. Fig. 11 shows the results of measuring the discharge capacity according to the number of repeated charge/discharge cycles of a lithium-ion negative electrode half-cell using a negative electrode material mixed with graphite and controlled to a capacity of 500 mAh/g in a silicon secondary particle (BMSi@Gr) coated with a carbon coating layer (graphene), and Fig. 12 shows the results of measuring the coulombic efficiency according to the number of repeated charge/discharge cycles of a lithium-ion negative electrode half-cell using a negative electrode material mixed with graphite and controlled to a capacity of 500 mAh/g in a silicon secondary particle (BMSi@Gr) coated with a carbon coating layer (graphene). Table 2 below summarizes the discharge capacity and coulombic efficiency.

용량
(mAh/g)
volume
(mAh/g)
ICE
(%)
ICE
(%)
Retention
(%, @40cycle)
Retention
(%, @40cycle)
비교예 1-1Comparative Example 1-1 547547 87.087.0 76.176.1 비교예 1-2Comparative Example 1-2 541541 87.387.3 95.395.3 실시예 1-4Example 1-4 546546 85.985.9 95.495.4 실시예 1-6Example 1-6 529529 82.082.0 93.493.4

도 11, 도 12 및 표 1을 참조하면, 실시예 1-4의 실리콘 충/방전 횟수에 따른 방전용량이 더욱 안정적으로 유지되고 있으며, 높은 쿨롱 효율을 보였다. 또한, 비활성 기체 분위기에서 분쇄-웰딩 공정이 수행된 실시예 1-6의 경우에도 높은 용량유지율과 쿨롱효율을 보였다. 이는 본 발명에서 제시하는 기술을 통해 실리콘 음극재의 고질적인 문제인 부피팽창-수축에 따른 문제를 해결하고 장기수명 특성을 할 수 있음을 의미한다. 비교예 1-1의 경우 싸이클이 진행됨에 따라 용량이 감소하는 경향을 보였고, 비교예 1-2의 경우에는 쿨롱효율이 낮다는 문제가 있다. Referring to FIGS. 11 and 12 and Table 1, the discharge capacity according to the number of silicon charge/discharge cycles of Example 1-4 was maintained more stably, and high Coulombic efficiency was shown. In addition, even in the case of Example 1-6, where the grinding-welding process was performed in an inert gas atmosphere, high capacity retention and Coulombic efficiency were shown. This means that the technology proposed in the present invention can solve the problem of volume expansion-contraction, which is a chronic problem of silicon anode materials, and can provide long-life characteristics. In the case of Comparative Example 1-1, the capacity tended to decrease as the cycle progressed, and in the case of Comparative Example 1-2, there was a problem of low Coulombic efficiency.

도 13은 실시예 1-5의 탄소 코팅층(피치쉘)이 코팅된 실리콘 이차 입자 표면의 전자 현미경 사진이다. Figure 13 is an electron microscope photograph of the surface of a silicon secondary particle coated with a carbon coating layer (pitch shell) of Example 1-5.

도 13을 참조하면, 그래핀 코팅층을 가지는 실리콘 이차입자에 피치쉘이 매끈하게 코팅되어, 표면의 다공성 구조를 메웠음을 알 수 있다. 이처럼 피치쉘 코팅층을 형성할 경우 표면의 기공을 메워서 비표면적을 낮춤으로써 전해질의 과다 유입을 막을 수 있다. Referring to Figure 13, it can be seen that a peach shell is smoothly coated on a silicon secondary particle having a graphene coating layer, filling the porous structure of the surface. When a peach shell coating layer is formed in this way, the surface pores are filled, reducing the specific surface area and preventing excessive inflow of electrolyte.

다음으로 제2실시형태에 대해 살펴보도록 한다. 제1실시형태와 중복되는 부분은 일부 설명이 생략될 수 있음을 밝힌다. Next, let's examine the second embodiment. It should be noted that some parts that overlap with the first embodiment may be omitted.

도 14는 실리콘 일차입자와 분쇄된 전도성 물질이 혼합되어 형성된 실리콘 이차입자의 개략적 모식도이다. Figure 14 is a schematic diagram of a silicon secondary particle formed by mixing silicon primary particles and pulverized conductive material.

제2실시형태의 실리콘 음극재는 실리콘 원료 분말의 밀링 과정이 실리콘 원료 분말과 전도성 물질을 함께 투입된 상태에서 수행된다.In the second embodiment, the silicon anode material is produced by milling silicon raw material powder while the silicon raw material powder and conductive material are added together.

따라서, 제2실시형태의 실리콘 음극재는 실리콘 일차 입자 및 전도성 물질이 응집되어 형성된 실리콘 이차 입자를 포함하되, 상기 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 가진다. Accordingly, the silicon anode material of the second embodiment includes silicon secondary particles formed by agglomeration of silicon primary particles and conductive materials, and has a bridge connecting adjacent silicon primary particles within the silicon secondary particles.

전도성 물질은 그래핀, 카본 나노 튜브, 카본 나노 섬유, 인상흑연 및 토상흑연로 이루어진 군에서 선택되는 적어도 어느 하나일 수 있으며, 전도성 물질은 실리콘 이차입자를 기준으로 1 내지 15 wt% 포함될 수 있다. The conductive material may be at least one selected from the group consisting of graphene, carbon nanotubes, carbon nanofibers, graphite, and earth graphite, and the conductive material may be included in an amount of 1 to 15 wt% based on the silicon secondary particles.

본 발명의 실리콘 음극재의 제조방법을 수행함에 있어서, 전도성 물질의 존재하에서 실리콘 원료 분말을 분쇄하여 실리콘 일차입자를 형성하고 실리콘 이차입자를 조립한다. 그 과정에서 전도성 물질(특히, 탄소계 전도성 물질)이 추가됨에 따라 제1실시형태와 달리 실리콘 이차입자의 중앙부에도 외곽과 비슷한 수준으로 기공이 형성된다. In carrying out the method for manufacturing a silicon anode material of the present invention, silicon raw material powder is pulverized in the presence of a conductive material to form silicon primary particles and then silicon secondary particles are assembled. During this process, the addition of a conductive material (particularly, a carbon-based conductive material) results in the formation of pores in the central portion of the silicon secondary particles at a level similar to that of the peripheral portion, unlike the first embodiment.

한편, 실리콘 이차입자 내에서 실리콘 일차입자와 함께 응집되어 있는 전도성 물질은 전기전도 경로를 제공하며, 이에 따라 별도의 탄소 코팅층 없이도 종래 실리콘 음극재의 단점인 낮은 전도도 문제가 해결된다. 별도의 탄소 코팅층이 없이도 전도도 문제를 해결할 수 있다는 것이지, 추가적인 탄소 코팅층의 형성을 배제하는 것은 아니다. Meanwhile, the conductive material coagulated within the silicon secondary particles with the silicon primary particles provides an electrical conduction path, thereby resolving the low conductivity problem of conventional silicon anode materials without the need for a separate carbon coating layer. This suggests that the conductivity issue can be resolved without a separate carbon coating layer, but this does not preclude the formation of an additional carbon coating layer.

실시예 2-1Example 2-1

실시예2-1 실리콘 원료 분말 4.8g 과 그래핀 파우더 0.2g을 sus 볼 100g을 함께 플라나터리(Planatery) 밀링기 용기에 잠입하고 대기중에서 300 rpm에서 500분 동안 밀링하였다. 용기에서 밀링된 시료를 꺼내어 볼과 분리하여 실리콘 음극재 샘플을 얻었다. Example 2-1 4.8 g of silicon raw material powder and 0.2 g of graphene powder were placed together with 100 g of SUS balls in a planetary milling container and milled at 300 rpm for 500 minutes in the air. The milled sample was taken out of the container and separated from the balls to obtain a silicon anode material sample.

실시예 2-2Example 2-2

실시예 2-1에서 제작한 실리콘 이차입자(BMSi-G)에 탄소 코팅층을 형성하였다. 탄소 코팅층의 형성을 위해 튜브로를 이용하였다. 승온부터 열처리까지 아르곤 가스로 로내 분위기를 비활성 분위기 잡아주었다. 실시예 2-1의 실리콘 이차입자(BMSi-G) 1g과 석유계 피치 0.7g을 스페릭코터 (Spheric coater)를 이용해 혼합한 뒤 열처리를 진행하였다. 피치가 코팅된 실리콘 이차입자(BMSi-G@Pitch)의 열처리는 두 단계로 300도에서 2시간, 1000도에서 1시간동안 수행되었다. A carbon coating layer was formed on the silicon secondary particles (BMSi-G) manufactured in Example 2-1. A tube furnace was used to form the carbon coating layer. The furnace atmosphere was maintained as an inert atmosphere with argon gas from the temperature rise to the heat treatment. 1 g of the silicon secondary particles (BMSi-G) of Example 2-1 and 0.7 g of petroleum pitch were mixed using a spherical coater and then heat treated. The heat treatment of the pitch-coated silicon secondary particles (BMSi-G@Pitch) was performed in two stages: at 300 degrees for 2 hours and at 1000 degrees for 1 hour.

실시예 2-3Example 2-3

실시예 2-1에서 제작한 실리콘 이차입자(BMSi-G)에 탄소 코팅층을 형성하였다. 탄소 코팅층의 형성을 위해 튜브로를 이용하였다. 승온부터 열처리까지 아르곤 가스로 로내 분위기를 비활성 분위기 잡아주었다. 실시예 2-1의 실리콘 이차입자 (BMSi-G) 1g과 석유계 피치 1, 0.8, 0.6g을 테트라하이드로퓨란 (THF)에 각각 녹인 후 혼합한 뒤 열처리를 진행하였다. 피치가 코팅된 실리콘 이차입자 (BMSi-G@Pitch)의 열처리는 두 단계로 300도에서 2시간, 1000도에서 1시간 동안 수행되었다. A carbon coating layer was formed on the silicon secondary particles (BMSi-G) manufactured in Example 2-1. A tube furnace was used to form the carbon coating layer. The furnace atmosphere was maintained as an inert atmosphere with argon gas from the heating to the heat treatment. 1 g of the silicon secondary particles (BMSi-G) of Example 2-1 and 1, 0.8, and 0.6 g of petroleum pitch were each dissolved in tetrahydrofuran (THF), mixed, and then heat-treated. The heat treatment of the pitch-coated silicon secondary particles (BMSi-G@Pitch) was performed in two stages: at 300 degrees for 2 hours and at 1000 degrees for 1 hour.

비교예 2-1Comparative Example 2-1

베어(Bare) 실리콘을 이용하였다.Bare silicone was used.

비교예 2-2Comparative Example 2-2

실리콘 원료 분말 5g 과 SUS 재질의 밀링볼 100g을 플라나터리(Planatery) 밀링기 용기에 장입하고 대기중에서 300 rpm으로 500분 동안 밀링을 수행하였다. 용기에서 밀링된 시료를 꺼내어 볼과 분리하여 실리콘 음극재 샘플을 얻었다. 5 g of silicon raw material powder and 100 g of SUS milling balls were placed in a planetary milling container and milled at 300 rpm for 500 minutes in air. The milled sample was taken out of the container and separated from the balls to obtain a silicon anode material sample.

그 다음 제조한 실리콘 이차입자(BMSi) 탄소 코팅층(피치)을 코팅하였다. 제조한 실리콘 이차입자(BMSi) 1g과 석유계 피치 0.7g을 스페릭코터 (Spheric coater)를 이용해 혼합한 뒤 열처리를 진행하였다. 피치가 코팅된 실리콘 이차입자(BMSi @Pitch)의 열처리는 두 단계로 300도에서 2시간, 1000도에서 1시간동안 수행되었다.Next, the manufactured silicon secondary particles (BMSi) were coated with a carbon coating layer (pitch). 1 g of the manufactured silicon secondary particles (BMSi) and 0.7 g of petroleum pitch were mixed using a spherical coater and then heat-treated. The heat treatment of the pitch-coated silicon secondary particles (BMSi @Pitch) was performed in two stages: at 300°C for 2 hours and at 1000°C for 1 hour.

실험예 2Experimental Example 2

도 15는 실시예 2-1의 실리콘 음극재에 포함된 실리콘 이차입자의 전자 현미경 사진으로서, 실리콘 일차입자와 분쇄된 전도성 물질이 혼합되어 형성된 실리콘 이차입자에 관한 것이며, 도 16은 실시예 2-1의 실리콘 음극재에 포함된 실리콘 이차입자의 단면의 전자 현미경 사진으로서, 실리콘 일차입자와 분쇄된 전도성 물질이 혼합되어 형성된 실리콘 이차입자에 관한 것이다.FIG. 15 is an electron microscope photograph of a silicon secondary particle included in a silicon negative electrode material of Example 2-1, and relates to a silicon secondary particle formed by mixing silicon primary particles and a pulverized conductive material, and FIG. 16 is an electron microscope photograph of a cross-section of a silicon secondary particle included in a silicon negative electrode material of Example 2-1, and relates to a silicon secondary particle formed by mixing silicon primary particles and a pulverized conductive material.

도 15 에서 보는 바와 같이 실리콘 이차 입자는 구형으로 형성된다. 실리콘 일차입자는 수 내지 수백 나노미터 정도의 입자 크기를 가진다. 이와 같은 나노 사이즈의 실리콘 일차입자와 분쇄된 전도성 물질이 응집되어 실리콘 이차입자 형성되며, 실리콘 이차입자는 수 내지 수십 마이크로 미터 정도의 입자 크기를 가진다. As shown in Fig. 15, silicon secondary particles are formed in a spherical shape. Silicon primary particles have a particle size of several to several hundred nanometers. These nano-sized silicon primary particles and pulverized conductive materials aggregate to form silicon secondary particles, which have a particle size of several to several tens of micrometers.

한편, 도 16 에서 보는 것처럼, 실리콘 일차입자가 응집되면서 기공이 형성된다. 이때, 실시예 2-1의 실리콘 이차입자는 실시예 1-1의 실리콘 이차입자와 달리 중앙부에도 기공이 발달되어 있음을 확인할 수 있다. Meanwhile, as seen in Fig. 16, pores are formed as the silicon primary particles aggregate. At this time, it can be confirmed that the silicon secondary particles of Example 2-1 have pores developed even in the central portion, unlike the silicon secondary particles of Example 1-1.

도 17은 본 발명의 실리콘 음극재에 포함된 실리콘 이차입자의 단면의 XRD 데이터로서, 실시예 2-1 과 동일한 방법으로 실리콘 이차입자를 형성하되 전도성 물질(그래핀)의 함량을 변화시키며 측정한 결과이다. Figure 17 is XRD data of a cross-section of a silicon secondary particle included in a silicon negative electrode material of the present invention, and is the result of measuring the silicon secondary particle by forming it in the same manner as Example 2-1 but changing the content of a conductive material (graphene).

도 17을 참조하면, 전도성 물질(그래핀)의 비율이 증가할수록 실리콘의 결정질이 비결정질로 변함을 알 수 있다. 즉, 전도성 물질(그래핀)이 실리콘 원료 분말의 분쇄 시 입자의 비결정성을 유도하고 중앙부에도 기공 구조 형성을 유도하는 것이다. Referring to Figure 17, it can be seen that as the proportion of the conductive material (graphene) increases, the crystalline state of silicon changes to an amorphous state. That is, the conductive material (graphene) induces amorphousness of the particles when the silicon raw material powder is pulverized and induces the formation of a porous structure in the central portion.

도 18은 실시예 2-2의 실리콘 음극재에 포함된 실리콘 이차입자의 단면의 전자 현미경 사진으로서, 실리콘 일차입자와 분쇄된 전도성 물질이 혼합되어 형성된 실리콘 이차입자에 탄소 코팅층(피치)이 형성된 것에 관한 것이다.Fig. 18 is an electron microscope photograph of a cross-section of a silicon secondary particle included in a silicon negative electrode material of Example 2-2, and relates to a carbon coating layer (pitch) formed on a silicon secondary particle formed by mixing silicon primary particles and a pulverized conductive material.

도 18을 참조하면, 실리콘 일차입자와 분쇄된 전도성 물질에 의해 형성된 외곽부 및 중앙부 기공에 피치가 고르게 충전되어 있음을 확인할 수 있다. 기공이 충전된 피치는 실리콘 이차입자의 전도성을 향상시키고, 보호층의 역할을 한다. Referring to Figure 18, it can be confirmed that the outer and central pores formed by the silicon primary particles and the pulverized conductive material are evenly filled with pitch. The pore-filled pitch enhances the conductivity of the silicon secondary particles and acts as a protective layer.

도 19는 탄소 코팅층(피치)이 코팅되었으며 실리콘 일차입자와 분쇄된 전도성 물질이 혼합되어 형성된 실리콘 이차입자(BMSi-G@Gr, 실시예 2-2)에 흑연에 섞어 용량 500mAh/g로 제어한 음극재를 이용한 리튬이온 음극 반쪽전지의 반복 충방전 횟수에 따른 용량 및 쿨롱 효율을 측정한 것이다.Figure 19 shows the capacity and coulombic efficiency according to the number of repeated charge/discharge cycles of a lithium ion negative electrode half-cell using a negative electrode material that was mixed with graphite and controlled to a capacity of 500 mAh/g, and formed by mixing silicon primary particles and pulverized conductive materials (BMSi-G@Gr, Example 2-2) coated with a carbon coating layer (pitch).

도 19를 참조하면, 실리콘 이차 입자의 내부에 전도성 물질이 포함되어 도전성을 부여하였을 때 충/방전 횟수에 따른 방전용량이 매우 안정적으로 유지되고 있으며, 동시에 높은 쿨롱 효율을 보이고 있음을 확인할 수 있다. 이는 본 발명에서 제시하는 기술을 통해 실리콘 음극재의 고질적인 문제인 부피팽창-수축에 따른 문제를 해결하고 장기수명 특성을 할 수 있음을 의미한다.Referring to Fig. 19, it can be confirmed that when a conductive material is incorporated into the interior of a silicon secondary particle to impart conductivity, the discharge capacity is maintained very stably according to the number of charge/discharge cycles, and at the same time, high Coulombic efficiency is exhibited. This means that the technology proposed in the present invention can solve the problem of volume expansion and contraction, which is a chronic problem of silicon anode materials, and can achieve long-term life characteristics.

도 20은 실시예 2-1, 비교예 2-1 및 비교예 2-2의 10 cycle 이후의 Nyquist plots를 도시한 것이다. Figure 20 shows Nyquist plots after 10 cycles of Example 2-1, Comparative Example 2-1, and Comparative Example 2-2.

도 20을 참조하면, 실리콘 일차입자와 분쇄된 전도성 물질(그래핀)이 응집하여 실리콘 이차입자가 형성된 실시예 2-1이 비교예 2-1 및 비교예 2-2보다 낮은 저항값을 가짐을 알 수 있다. Referring to FIG. 20, it can be seen that Example 2-1, in which silicon primary particles and pulverized conductive material (graphene) are aggregated to form silicon secondary particles, has a lower resistance value than Comparative Examples 2-1 and 2-2.

도 21은 탄소 코팅층(피치)이 코팅되었으며 실리콘 일차입자와 분쇄된 전도성 물질이 혼합되어 형성된 실리콘 이차입자(BMSi-G@Gr, 실시예 2-3)를 포함하는 음극재를 이용한 리튬이온 음극 반쪽전지의 반복 충방전 횟수에 따른 용량 및 쿨롱 효율을 측정한 것으로서, 피치 비율에 따른 음극 반쪽전지의 반복 충방전 횟수에 따른 용량 및 쿨롱 효율을 도시한 것이다 (빨간색 그래프 BMSi-G : Pitch = 1 : 1, 보라색 그래프 BMSi-G : Pitch = 1 : 0.8, 파란색 그래프 BMSi-G : Pitch = 1 : 0.6). Figure 21 shows the capacity and coulombic efficiency according to the number of repeated charge/discharge cycles of a lithium ion negative electrode half-cell using a negative electrode material including silicon secondary particles (BMSi-G@Gr, Example 2-3) coated with a carbon coating layer (pitch) and formed by mixing silicon primary particles and pulverized conductive materials, and shows the capacity and coulombic efficiency according to the number of repeated charge/discharge cycles of the negative electrode half-cell according to the pitch ratio (red graph BMSi-G: Pitch = 1:1, purple graph BMSi-G: Pitch = 1:0.8, blue graph BMSi-G: Pitch = 1:0.6).

도 21을 참조하면, 피치 양이 줄어들수록 용량이 증가하게 된다. 다만, 쿨롱 효율의 경우에는 피치 양과 무관하다. 따라서 본 발명의 경우 피치의 양을 조절하여 용량을 제어할 수 있다. Referring to Figure 21, as the pitch amount decreases, the capacity increases. However, Coulomb efficiency is unrelated to the pitch amount. Therefore, in the present invention, the capacity can be controlled by adjusting the pitch amount.

다음으로 제3실시형태에 대해 살펴보도록 한다. 제1실시형태와 중복되는 부분은 일부 설명이 생략될 수 있음을 밝힌다. Next, let's examine the third embodiment. It should be noted that some parts that overlap with the first embodiment may be omitted.

제3실시형태의 실리콘 음극재는 실리콘 원료 분말의 밀링 과정이 실리콘 원료 분말과 산화 실리콘 SiOx(단, 0<X≤2) 입자를 함께 투입된 상태에서 수행된다. In the silicon anode material of the third embodiment, the milling process of the silicon raw material powder is performed in a state where the silicon raw material powder and silicon oxide SiO x (where 0<X≤2) particles are input together.

따라서, 제3실시형태의 실리콘 음극재는 실리콘 일차 입자 및 산화 실리콘 입자가 응집되어 형성된 실리콘 이차 입자를 포함하되, 상기 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 가진다. Accordingly, the silicon anode material of the third embodiment includes silicon secondary particles formed by agglomeration of silicon primary particles and silicon oxide particles, and has a bridge connecting adjacent silicon primary particles within the silicon secondary particles.

산화 실리콘 입자의 함량은 실리콘 이차입자를 기준으로 2 내지 50 wt%일 수 있다.The content of the silicon oxide particles may be 2 to 50 wt% based on the silicon secondary particles.

제3실시형태의 실리콘 음극재는 실리콘 일차 입자와 함께 응집된 산화 실리콘 입자는 이차전지의 충방전 과정동안 실리콘 이차입자의 반복적인 부피 팽창-수축을 억제하는 버퍼의 역할을 수행한다. 또한, 산화실리콘 입자 이차전지의 충방전 과정이 반복되는 동안 내부에 수 내지 수십 나노미터 크기의 실리콘이 형성되어 용량이 발현된다. 이에 따라 제3실시형태의 실리콘 음극재는 이차전지의 장수명 특성을 향상시킬 수 있다. The silicon anode material of the third embodiment comprises silicon oxide particles aggregated with silicon primary particles, which serve as a buffer to suppress the repetitive volume expansion and contraction of the silicon secondary particles during the charge and discharge process of the secondary battery. In addition, during the repeated charge and discharge process of the silicon oxide particle secondary battery, silicon particles having a size of several to several tens of nanometers are formed inside, thereby developing capacity. Accordingly, the silicon anode material of the third embodiment can improve the long-life characteristics of the secondary battery.

실시예3-1 Example 3-1

실리콘 원료 분말 4.8g 과 SiO2 (D50 ~ 1μm) 0.2g을 sus 볼 100g을 대기중에서 플라나터리(Planatery) 밀링기 용기에 잠입하고 300 rpm에서 250분 동안 밀링하였다. 용기에서 밀링된 시료를 꺼내어 볼과 분리하여 실리콘 음극재 샘플을 얻었다.4.8 g of silicon raw material powder and 0.2 g of SiO 2 (D 50 ~ 1 μm) were placed in a planetary milling vessel with 100 g of SUS balls in the air and milled at 300 rpm for 250 minutes. The milled sample was taken out of the vessel and separated from the balls to obtain a silicon anode material sample.

실시예3-2 Example 3-2

실리콘 원료 분말 4.8g 과 SiO2 (D50 ~ 1μm) 0.2g을 sus 볼 100g을 대기중에서 플라나터리(Planatery) 밀링기 용기에 잠입하고 300 rpm에서 750분 동안 밀링하였다. 용기에서 밀링된 시료를 꺼내어 볼과 분리하여 실리콘 음극재 샘플을 얻었다.4.8 g of silicon raw material powder and 0.2 g of SiO 2 (D 50 ~ 1 μm) were placed in a planetary milling vessel with 100 g of SUS balls in the air and milled at 300 rpm for 750 minutes. The milled sample was taken out of the vessel and separated from the balls to obtain a silicon anode material sample.

실시예3-3 Example 3-3

실리콘 원료 분말 4.76g 과 SiO2 (D50 ~ 1μm) 0.24g을 sus 볼 100g을 대기중에서 플라나터리(Planatery) 밀링기 용기에 잠입하고 300 rpm에서 500분, 750분, 1000분, 1250분 동안 밀링하였다. 용기에서 밀링된 시료를 꺼내어 볼과 분리하여 실리콘 음극재 샘플을 얻었다.4.76 g of silicon raw material powder and 0.24 g of SiO 2 (D 50 ~ 1 μm) were placed in a planetary milling vessel with 100 g of SUS balls in the air and milled at 300 rpm for 500, 750, 1000, and 1250 minutes. The milled sample was taken out of the vessel and separated from the balls to obtain a silicon anode material sample.

실시예3-4 Example 3-4

실리콘 원료 분말 2.5g 과 SiO2 (D50 ~ 1μm) 2.5g을 sus 볼 100g을 대기중에서 플라나터리(Planatery) 밀링기 용기에 잠입하고 300 rpm에서 500분, 750분, 1000분, 1250분 동안 밀링하였다. 용기에서 밀링된 시료를 꺼내어 볼과 분리하여 실리콘 음극재 샘플을 얻었다.2.5 g of silicon raw material powder and 2.5 g of SiO 2 (D 50 ~ 1 μm) were placed in a planetary milling vessel with 100 g of SUS balls in the air and milled at 300 rpm for 500, 750, 1000, and 1250 minutes. The milled sample was taken out of the vessel and separated from the balls to obtain a silicon anode material sample.

실시예 3-5Example 3-5

실리콘 원료 분말 4.5g 과 SiOx (0<X<2) 0.5g을 sus 볼 100g을 대기중에서 플라나터리(Planatery) 밀링기 용기에 잠입하고 300 rpm에서 500분 동안 밀링하였다. 용기에서 밀링된 시료를 꺼내어 볼과 분리하여 시료를 얻었다. 실리콘 파우더와 SiOx (0<X<2)가 함께 밀링된 이차입자 (BMSi-SOx)에 탄소 코팅 하기 위해 튜브로를 이용하였고 승온부터 열처리까지 아르곤 가스로 로내 분위기를 비활성 분위기 잡아주었다. 실리콘과 SiOx (0<X<2)가 함께 밀링된 이차입자 (BMSi-SOx) 1g과 석유계 피치 0.7g을 스페릭코터 (Spheric coater)를 이용해 혼합한 뒤 열처리를 진행하였다. 피치가 코팅된 실리콘과 SiOx (0<X<2)가 함께 밀링된 이차입자 (BMSi- SOx@Pitch)의 열처리는 두 단계로 300도에서 2시간, 1000도에서 1시간 열처리하였다. 4.5 g of silicon raw material powder and 0.5 g of SiOx (0<X<2) were placed in a planetary milling vessel with 100 g of SUS balls in the air and milled at 300 rpm for 500 min. The milled sample was taken out of the vessel and separated from the balls to obtain a sample. A tube furnace was used to carbon-coat the secondary particles (BMSi-SOx) milled with silicon powder and SiOx (0<X<2), and the furnace atmosphere was kept inert with argon gas from the temperature rising to the heat treatment. 1 g of the secondary particles (BMSi-SOx) milled with silicon and SiOx (0<X<2) and 0.7 g of petroleum pitch were mixed using a spherical coater and then heat treated. The heat treatment of the secondary particles (BMSi-SOx@Pitch) milled together with pitch-coated silicon and SiOx (0<X<2) was performed in two steps: at 300°C for 2 hours and at 1000°C for 1 hour.

비교예 3-1Comparative Example 3-1

실리콘 원료 분말 4.55g 과 SiOx (0<X<2) 0.35g을 sus 볼 100g을 대기중에서 플라나터리(Planatery) 밀링기 용기에 잠입하고 300 rpm에서 500분 동안 밀링하였다. 용기에서 밀링된 시료를 꺼내어 볼과 분리하여 시료를 얻었다. 실리콘 파우더와 SiOx (0<X<2)가 함께 밀링된 이차입자 (BMSi-SOx)에 탄소 코팅 하기 위해 튜브로를 이용하였고 승온부터 열처리까지 아르곤 가스로 로내 분위기를 비활성 분위기 잡아주었다. 실리콘과 SiOx (0<X<2)가 함께 밀링된 이차입자 (BMSi-SOx) 1g과 석유계 피치 0.7g을 스페릭코터 (Spheric coater)를 이용해 혼합한 뒤 열처리를 진행하였다. 피치가 코팅된 실리콘과 SiOx (0<X<2)가 함께 밀링된 이차입자 (BMSi- SOx@Pitch)의 열처리는 두 단계로 300도에서 2시간, 1000도에서 1시간 열처리하였다. 4.55 g of silicon raw material powder and 0.35 g of SiOx (0<X<2) were placed in a planetary milling vessel with 100 g of SUS balls in the air and milled at 300 rpm for 500 min. The milled sample was taken out of the vessel and separated from the balls to obtain a sample. A tube furnace was used to carbon-coat the secondary particles (BMSi-SOx) milled with silicon powder and SiOx (0<X<2), and the furnace atmosphere was kept inert with argon gas from the temperature rising to the heat treatment. 1 g of the secondary particles (BMSi-SOx) milled with silicon and SiOx (0<X<2) and 0.7 g of petroleum pitch were mixed using a spherical coater and then heat treated. The heat treatment of the secondary particles (BMSi-SOx@Pitch) milled together with pitch-coated silicon and SiOx (0<X<2) was performed in two steps: at 300°C for 2 hours and at 1000°C for 1 hour.

비교예 3-2Comparative Example 3-2

실리콘 원료 분말 4.8g 과 SiOx (0<X<2) 0.2g을 sus 볼 100g을 대기중에서 플라나터리(Planatery) 밀링기 용기에 잠입하고 300 rpm에서 500분 동안 밀링하였다. 용기에서 밀링된 시료를 꺼내어 볼과 분리하여 시료를 얻었다. 실리콘 파우더와 SiOx (0<X<2)가 함께 밀링된 이차입자 (BMSi-SOx)에 탄소 코팅 하기 위해 튜브로를 이용하였고 승온부터 열처리까지 아르곤 가스로 로내 분위기를 비활성 분위기 잡아주었다. 실리콘과 SiOx (0<X<2)가 함께 밀링된 이차입자 (BMSi-SOx) 1g과 석유계 피치 0.7g을 스페릭코터 (Spheric coater)를 이용해 혼합한 뒤 열처리를 진행하였다. 피치가 코팅된 실리콘과 SiOx (0<X<2)가 함께 밀링된 이차입자 (BMSi- SOx@Pitch)의 열처리는 두 단계로 300도에서 2시간, 1000도에서 1시간 열처리하였다. 4.8 g of silicon raw material powder and 0.2 g of SiOx (0<X<2) were placed in a planetary milling vessel with 100 g of SUS balls in the air and milled at 300 rpm for 500 min. The milled sample was taken out of the vessel and separated from the balls to obtain a sample. A tube furnace was used to carbon-coat the secondary particles (BMSi-SOx) milled with silicon powder and SiOx (0<X<2), and the furnace atmosphere was kept inert with argon gas from the temperature rising to the heat treatment. 1 g of the secondary particles (BMSi-SOx) milled with silicon and SiOx (0<X<2) and 0.7 g of petroleum pitch were mixed using a spherical coater and then heat treated. The heat treatment of the secondary particles (BMSi-SOx@Pitch) milled together with pitch-coated silicon and SiOx (0<X<2) was performed in two steps: at 300°C for 2 hours and at 1000°C for 1 hour.

실험예 3Experimental Example 3

도 22는 본 발명의 실리콘 음극재에 포함된 실리콘 이차입자의 전자 현미경 사진으로서, 실리콘 일차입자와 분쇄된 산화 실리콘 입자가 혼합되어 형성된 실리콘 이차입자에 관한 것이며, 도 23은 본 발명의 실리콘 음극재에 포함된 실리콘 이차입자의 단면의 전자 현미경 사진으로서, 실리콘 일차입자와 분쇄된 산화 실리콘 입자가 혼합되어 형성된 실리콘 이차입자에 관한 것이다.FIG. 22 is an electron microscope photograph of a silicon secondary particle included in a silicon anode material of the present invention, and relates to a silicon secondary particle formed by mixing silicon primary particles and pulverized silicon oxide particles, and FIG. 23 is an electron microscope photograph of a cross-section of a silicon secondary particle included in a silicon anode material of the present invention, and relates to a silicon secondary particle formed by mixing silicon primary particles and pulverized silicon oxide particles.

도 22 에서 보는 바와 같이 실리콘 이차 입자는 구형으로 형성된다. 실리콘 일차입자는 수 내지 수백 나노미터 정도의 입자 크기를 가진다. 이와 같은 나노 사이즈의 실리콘 일차입자와 분쇄된 산화 실리콘 입자가 응집되어 실리콘 이차입자 형성되며, 실리콘 이차입자는 수 내지 수십 마이크로 미터 정도의 입자 크기를 가진다. As shown in Fig. 22, silicon secondary particles are formed in a spherical shape. Silicon primary particles have a particle size of several to several hundred nanometers. These nano-sized silicon primary particles and pulverized silicon oxide particles aggregate to form silicon secondary particles, which have a particle size of several to several tens of micrometers.

한편, 도 23에서 보는 것처럼, 실리콘 일차입자가 응집되면서 기공이 형성된다. 이때, 산화 실리콘 입자는 실리콘 일차입자보다 입자 크기가 더 크다. 산화 실리콘 입자의 크기는 수십 내지 수백 나노미터일 수 있다. Meanwhile, as shown in Figure 23, pores are formed as the silicon primary particles aggregate. At this time, the silicon oxide particles are larger than the silicon primary particles. The size of the silicon oxide particles can range from tens to hundreds of nanometers.

도 24는 실시예 3-1 및 실시예 3-2의 실리콘 이차입자를 포함하는 음극재를 이용한 리튬이온 음극 반쪽전지의 반복 충방전 횟수에 따른 용량 및 쿨롱 효율을 측정한 것이다. Figure 24 shows the capacity and coulombic efficiency measured according to the number of repeated charge/discharge cycles of a lithium ion negative electrode half-cell using a negative electrode material including silicon secondary particles of Examples 3-1 and 3-2.

도 24를 참조하면, 밀링 시간이 긴 실시예 3-2의 경우에 실시예 3-1에 비해 용량이 약 250mAh/g 정도 더 발현되었고, 장 수명 효율면에서도 실시예 3-1에 비해 더 높다.Referring to Fig. 24, in the case of Example 3-2, which has a long milling time, the capacity is expressed by about 250 mAh/g more than in Example 3-1, and the long-life efficiency is also higher than in Example 3-1.

도 25는 분쇄 시간에 따른 실리콘 일차입자와 분쇄된 산화 실리콘 입자가 혼합(실리콘 원료 분말 및 산화 실리콘 입자의 중량비가 20:1인 경우)되어 형성된 실리콘 이차입자의 XRD 측정 결과이며, 도 26은 분쇄 시간에 따른 실리콘 일차입자와 분쇄된 산화 실리콘 입자가 혼합(실리콘 원료 분말 및 산화 실리콘 입자의 중량비가 1:1인 경우)되어 형성된 실리콘 이차입자의 XRD 측정 결과이다. 도 25는 실시예 3-3에 관한 것이고, 도 26인 실시예 3-4에 관한 것이다. Fig. 25 shows the XRD measurement results of silicon secondary particles formed by mixing silicon primary particles and pulverized silicon oxide particles according to the pulverization time (when the weight ratio of silicon raw material powder and silicon oxide particles is 20:1), and Fig. 26 shows the XRD measurement results of silicon secondary particles formed by mixing silicon primary particles and pulverized silicon oxide particles according to the pulverization time (when the weight ratio of silicon raw material powder and silicon oxide particles is 1:1). Fig. 25 relates to Example 3-3, and Fig. 26 relates to Example 3-4.

도 25 및 도 26을 참조하면, 실리콘과 SiO2 (D50 ~ 1μm)를 함께 밀링할 경우, 이종물질의 비율에 따라 XRD 결과가 달라짐을 알 수 있다. SiO2 (D50 ~ 1μm)분말 비율이 높을 수록, 밀링시간이 길어질수록 실리콘 결정질의 반가폭 (FWHM)이 늘어나고 이는 Crystal domain이 감소함을 의미한다. Crystal domain이 감소할수록 실리콘 음극재 장수명 효율에 유리하다.Referring to FIGS. 25 and 26, it can be seen that when silicon and SiO 2 (D 50 ~ 1 μm) are milled together, the XRD results vary depending on the ratio of the heterogeneous materials. As the ratio of SiO 2 (D 50 ~ 1 μm) powder increases and the milling time increases, the full width at half maximum (FWHM) of the silicon crystal increases, which means that the crystal domain decreases. As the crystal domain decreases, it is advantageous for the longevity efficiency of the silicon anode material.

도 27은 탄소 코팅층(피치)이 코팅되었으며 실리콘 일차입자와 분쇄된 산화 실리콘 입자가 혼합되어 형성된 실리콘 이차입자(BMSi-SOx@Pitch, 실시예 3-5)를 포함하는 음극재를 이용한 리튬이온 음극 반쪽전지의 반복 충방전 횟수에 따른 용량 및 쿨롱 효율을 측정한 것이다. Figure 27 shows the capacity and coulombic efficiency measured according to the number of repeated charge and discharge cycles of a lithium ion negative electrode half-cell using a negative electrode material including silicon secondary particles (BMSi-SOx@Pitch, Example 3-5) coated with a carbon coating layer (pitch) and formed by mixing silicon primary particles and pulverized silicon oxide particles.

도 27에서 알 수 있듯이, 실시예 3-5의 실리콘 음극재가 비교예 3-1 및 비교예 3-2에 비해 용량유지율이 높고 쿨롱 효율도 우수함을 알 수 있다. As can be seen in Fig. 27, the silicon anode material of Example 3-5 has a higher capacity retention rate and better Coulombic efficiency than Comparative Examples 3-1 and 3-2.

본 발명의 보호범위가 이상에서 명시적으로 설명한 실시예의 기재와 표현에 제한되는 것은 아니다. 또한, 본 발명이 속하는 기술분야에서 자명한 변경이나 치환으로 말미암아 본 발명이 보호범위가 제한될 수도 없음을 다시 한번 첨언한다.The scope of protection of the present invention is not limited to the description and expression of the embodiments explicitly described above. Furthermore, it should be noted that the scope of protection of the present invention may not be limited by obvious modifications or substitutions within the technical field to which the present invention pertains.

Claims (14)

실리콘 일차 입자가 응집되어 형성된 실리콘 이차 입자를 포함하되, 상기 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지를 가지는 실리콘 음극재.A silicon anode material comprising silicon secondary particles formed by agglomeration of silicon primary particles, wherein the silicon secondary particles have bridges connecting adjacent silicon primary particles. 제1항에 있어서, In the first paragraph, 상기 실리콘 이차 입자는 상기 실리콘 일차입자와 전도성 물질이 함께 응집되어 형성된 것인 실리콘 음극재. The above silicon secondary particles are silicon negative electrode materials formed by coagulating the silicon primary particles and a conductive material. 제2항에 있어서, In the second paragraph, 상기 상기 전도성 물질은 그래핀, 카본 나노 튜브, 카본 나노 섬유, 인상흑연 및 토상흑연로 이루어진 군에서 선택되는 적어도 어느 하나인 실리콘 음극재. The above conductive material is a silicon anode material selected from the group consisting of graphene, carbon nanotubes, carbon nanofibers, graphite, and graphite. 제1항에 있어서, In the first paragraph, 상기 상기 실리콘 이차 입자는 상기 실리콘 일차입자와 산화 실리콘 SiOx(단, 0<X≤2) 입자가 함께 응집되어 형성된 것인 실리콘 음극재. The above silicon secondary particles are silicon negative electrode materials formed by coagulating silicon primary particles and silicon oxide SiO x (where 0<X≤2) particles. 제1항에 있어서, In the first paragraph, 상기 브릿지는 냉간 용접에 의해 형성된 것인 실리콘 음극재. The above bridge is a silicon anode material formed by cold welding. 제1항에 있어서,In the first paragraph, 상기 실리콘 이차입자의 표면에는 탄소 코팅층이 형성되는 실리콘 음극재. A silicon anode material having a carbon coating layer formed on the surface of the above silicon secondary particle. 제6항에 있어서,In paragraph 6, 상기 탄소 코팅층은 결정질 탄소 또는 비결정질 탄소인 실리콘 음극재.The above carbon coating layer is a silicon anode material which is crystalline carbon or amorphous carbon. 밀링기를 이용하여 실리콘 원료 분말을 분쇄하여 실리콘 일차 입자를 형성하면서, 동시에 상기 실리콘 일차 입자를 응집하여 실리콘 이차 입자를 형성하고, 상기 실리콘 일차 입자의 분쇄 과정에서 발생한 열과 압력에 의해 상기 실리콘 이차 입자 내에서 인접하는 실리콘 일차 입자 사이를 연결하는 브릿지가 형성되는 실리콘 음극재의 제조방법.A method for manufacturing a silicon anode material, wherein silicon primary particles are formed by crushing silicon raw material powder using a milling machine, and at the same time, the silicon primary particles are aggregated to form silicon secondary particles, and bridges connecting adjacent silicon primary particles are formed within the silicon secondary particles by heat and pressure generated during the crushing process of the silicon primary particles. 제8항에 있어서,In paragraph 8, 실리콘 원료 분말의 분쇄 및 실리콘 이차 입자의 형성은 공기 분위기에서 수행되는 실리콘 음극재의 제조방법.A method for manufacturing a silicon anode material, wherein the crushing of silicon raw material powder and the formation of silicon secondary particles are performed in an air atmosphere. 제8항에 있어서,In paragraph 8, 실리콘 원료 분말의 분쇄 및 실리콘 이차 입자의 형성은 비활성 기체 분위기에서 수행되는 실리콘 음극재의 제조방법.A method for manufacturing a silicon anode material, wherein the crushing of silicon raw material powder and the formation of silicon secondary particles are performed in an inert gas atmosphere. 제8항에 있어서, In paragraph 8, 상기 실리콘 원료 분말과 전도성 물질을 혼합한 후 밀링기로 상기 실리콘 원료 분말과 상기 전도성 물질의 혼합물을 분쇄하는 실리콘 음극재의 제조방법.A method for manufacturing a silicon anode material, comprising mixing the silicon raw material powder and the conductive material and then grinding the mixture of the silicon raw material powder and the conductive material using a milling machine. 제8항에 있어서, In paragraph 8, 상기 실리콘 원료 분말과 산화 실리콘 SiOx(단, 0<X≤2) 입자를 혼합한 후 밀링기로 상기 실리콘 원료 분말과 상기 산화 실리콘 SiOx(단, 0<X≤2) 입자의 혼합물을 분쇄하는 실리콘 음극재의 제조방법.A method for manufacturing a silicon anode material, comprising mixing the above silicon raw material powder and silicon oxide SiO x (provided that 0<X≤2) particles and then grinding the mixture of the silicon raw material powder and silicon oxide SiO x (provided that 0<X≤2) particles using a milling machine. 제8항에 있어서,In paragraph 8, 상기 실리콘 원료 분말의 분쇄는 1 내지 6000 rpm으로 1초 내지 60 시간 동안 수행되는 실리콘 음극재의 제조방법.A method for manufacturing a silicon anode material, wherein the above silicon raw material powder is ground at 1 to 6000 rpm for 1 second to 60 hours. 제8항에 있어서,In paragraph 8, 상기 실리콘 이차 입자를 형성한 후에 상기 실리콘 이차 입자의 표면에 탄소 코팅층을 형성하는 단계를 더 포함하는 실리콘 음극재의 제조방법.A method for manufacturing a silicon negative electrode material, further comprising the step of forming a carbon coating layer on the surface of the silicon secondary particles after forming the silicon secondary particles.
PCT/KR2024/095450 2024-02-26 2024-02-26 Silicon negative electrode material comprising secondary particles formed by aggregating primary particles, and method for manufacturing same Pending WO2025183333A1 (en)

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