WO2025183220A1 - Separation membrane, membrane separation device, and separation method - Google Patents
Separation membrane, membrane separation device, and separation methodInfo
- Publication number
- WO2025183220A1 WO2025183220A1 PCT/JP2025/007328 JP2025007328W WO2025183220A1 WO 2025183220 A1 WO2025183220 A1 WO 2025183220A1 JP 2025007328 W JP2025007328 W JP 2025007328W WO 2025183220 A1 WO2025183220 A1 WO 2025183220A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- separation
- functional layer
- main surface
- separation membrane
- atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/22—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by diffusion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
- B01D69/10—Supported membranes; Membrane supports
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D69/00—Semi-permeable membranes for separation processes or apparatus characterised by their form, structure or properties; Manufacturing processes specially adapted therefor
- B01D69/12—Composite membranes; Ultra-thin membranes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D71/00—Semi-permeable membranes for separation processes or apparatus characterised by the material; Manufacturing processes specially adapted therefor
- B01D71/06—Organic material
- B01D71/70—Polymers having silicon in the main chain, with or without sulfur, nitrogen, oxygen or carbon only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/08—Processes employing the direct application of electric or wave energy, or particle radiation; Apparatus therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
- H05H1/46—Generating plasma using applied electromagnetic fields, e.g. high frequency or microwave energy
Definitions
- the present invention relates to a separation membrane, a membrane separation device, and a separation method.
- Membrane separation which uses separation membranes, has been developed as a method for separating target substances from mixed fluids such as mixed liquids and mixed gases. For example, when it comes to liquid separation, which separates the target liquid from a mixed liquid, membrane separation requires less energy than separation by distillation, which requires a heating process, and can also reduce the generation of carbon dioxide. In this way, membrane separation is an excellent separation technology that uses less energy and has a smaller environmental impact.
- separation membranes When it comes to gas or liquid separation, separation membranes are typically used in which the part with the separation function is made of an organic material such as polyimide.
- separation membranes in which the part with the separation function is made of an inorganic material, such as zeolite separation membranes and hollow fiber membranes, have been proposed.
- Patent Document 1 discloses a gas separation membrane with excellent gas permeability, abrasion resistance, and bending resistance.
- the separation membrane disclosed in Patent Document 1 has a configuration in which a resin layer with a specific configuration is formed by performing plasma treatment on a resin layer precursor containing a compound with a siloxane bond, and a protective layer containing a silicone resin and a porous layer are further disposed on top of the resin layer.
- the present invention provides a separation membrane with a configuration suitable for improving separation performance. Furthermore, the present invention also provides a membrane separation device equipped with a separation membrane with a configuration suitable for improving separation performance, and a separation method using such a separation membrane.
- a separation membrane is provided.
- the present invention provides A device equipped with the above separation membrane A membrane separation device is provided.
- the present invention provides A separation method using the above separation membrane, A mixed fluid containing two or more fluids including a fluid to be separated is brought into contact with one side of the separation membrane, and the mixed fluid is separated into a first fluid containing the fluid to be separated and a second fluid.
- a separation method is provided.
- the present invention provides a separation membrane having a configuration suitable for improving separation performance. Furthermore, the present invention also provides a membrane separation device equipped with a separation membrane having a configuration suitable for improving separation performance, and a separation method using such a separation membrane.
- FIG. 1 is a cross-sectional view schematically showing a separation membrane according to one embodiment of the present invention.
- FIG. 2 is a structural diagram showing an example of organosilica having a cyclic structure that can be contained in a separation functional layer in a separation membrane according to one embodiment of the present invention.
- FIG. 2 is a cross-sectional view showing a modified example of a porous support in a separation membrane according to an embodiment of the present invention.
- 1 is a schematic cross-sectional view of a membrane separation device equipped with a separation membrane of the present invention.
- FIG. 10 is a perspective view schematically showing a modified example of a membrane separation device provided with a separation membrane of the present invention.
- FIG. 2 is a perspective view showing the positional relationship between a low-inductance antenna and an object to be plasma processed in a plasma processing chamber used in the examples.
- FIG. 2 is a cross-sectional view showing the positional relationship between a low-inductance antenna and an object to be plasma processed in a plasma processing chamber used in the examples.
- the ratio of the number of O atoms to the number of Si atoms, O/Si, on the first main surface of the separation functional layer is 1.2 or greater.
- the ratio of the number of C atoms to the total number of C atoms, N atoms, O atoms, and Si atoms on the first main surface of the separation functional layer is 17 at. % or more.
- the ratio of the number of O atoms to the total number of C atoms, N atoms, O atoms, and Si atoms on the first main surface of the separation functional layer is 54 at. % or less.
- a separation membrane according to any one of the first to fifth aspects further comprises a porous support that supports the separation functional layer and is arranged on the second main surface side of the separation functional layer, opposite the first main surface.
- the separation functional layer contains a compound containing a siloxane bond.
- the first main surface of the separation functional layer contains organosilica having siloxane bonds, Si-C bonds, and C-O bonds.
- the first main surface of the separation functional layer contains a second compound obtained by modifying a first compound constituting the interior of the separation functional layer by plasma treatment.
- the first compound contains a siloxane bond.
- the first compound is a silicone resin.
- the plasma treatment is a treatment using inductively coupled plasma using a low-inductance antenna.
- a portion of the first main surface of the separation functional layer is exposed on the surface of the separation membrane.
- a separation method comprises: A separation method using a separation membrane according to any one of the first to thirteenth aspects, The method includes bringing a mixed fluid containing two or more fluids including a fluid to be separated into a first fluid containing the fluid to be separated and a second fluid into contact with one side of the separation membrane.
- the mixed fluid is a mixed gas containing two or more gases including the gas to be separated.
- the gas to be separated is H 2
- H 2 of the mixed gas is preferentially allowed to permeate the separation membrane.
- the mixed fluid is a mixed liquid containing two or more liquids, including the liquid to be separated.
- the liquid to be separated is H 2 O
- H 2 O in the mixed liquid is preferentially allowed to permeate the separation membrane.
- the separation membrane 10 of this embodiment includes a separation functional layer 1.
- the separation functional layer 1 contains Si, O, and C.
- the separation functional layer 1 further has a specific configuration in which, in an analysis of the chemical bonding state of C by C1s spectrum of the first main surface 1a of the separation functional layer 1 using X-ray photoelectron spectroscopy (XPS), the ratio of the peak area derived from C-H bonds to the total peak area derived from C-H, C-O, C ⁇ O, and COO bonds is 92 area% or less.
- XPS X-ray photoelectron spectroscopy
- the separation functional layer 1 can improve its separation performance.
- the separation functional layer 1 can have pores on the first main surface 1a that are miniaturized to a size appropriate for a molecular sieve, thereby improving its separation performance.
- the chemical bonding state of C in the separation functional layer 1 using XPS is analyzed by performing waveform analysis on the C1s spectrum obtained by XPS analysis using monochrome AlK ⁇ radiation as the X-ray source. At this time, the peak derived from the C-H bond in the C1s spectrum is charge corrected to 284.6 eV.
- the separation membrane 10 further includes, for example, a porous support 2.
- the porous support 2 is arranged on the second main surface 1b side opposite the first main surface 1a of the separation functional layer 1, and supports the separation functional layer 1.
- the porous support 2 may be arranged in direct contact with the second main surface 1b of the separation functional layer 1, as shown in FIG. 1, or another layer (intermediate layer) may be further provided between the separation functional layer 1 and the porous support 2.
- the separation membrane 10 may not include the porous support 2, and may be a free-standing membrane (single-layer membrane) equipped only with the separation functional layer 1.
- first main surface 1a of the separation function layer 1 may be exposed on the surface of the separation membrane 10. This configuration allows the separation membrane 10 to effectively exhibit the separation performance of the separation function layer 1. Substantially the entire first main surface 1a of the separation function layer 1 may be exposed on the surface of the separation membrane 10. In this case, “substantially the entire first main surface 1a” means 90% or more of the area of the first main surface 1a, and may be 95% or more. The entire first main surface 1a of the separation function layer 1 may be exposed on the surface of the separation membrane 10.
- a resin layer that functions as a protective layer may be provided on the first main surface 1a of the separation functional layer 1. It is desirable that such a protective layer does not interfere with the separation performance of the separation functional layer 1 as much as possible, and it is more desirable that it be provided partially on the first main surface 1a in areas where protection is desired.
- the separation membrane 10 may be installed within the device in a folded or rolled state, for example. Therefore, taking such installation conditions into consideration, a protective layer may be provided only in areas where reinforcement is desired.
- the separation functional layer 1 is a layer that separates a substance to be separated (hereinafter referred to as "fluid to be separated") from a mixed fluid such as a mixed liquid and a mixed gas.
- the separation functional layer 1 may be a layer that preferentially allows the fluid to be separated contained in the mixed fluid to permeate, or may be a layer that does not allow the fluid to be separated to permeate but allows fluids other than the fluid to be separated to permeate.
- the separation function layer 1 can separate H 2 O from the mixed liquid by preferentially allowing H 2 O to permeate.
- the separation functional layer 1 can separate H 2 from the mixed gas by preferentially allowing H 2 to permeate.
- C-H ratio on the first main surface 1a of the separation functional layer 1 or simply “C-H ratio.”
- the lower limit of the C-H ratio on the first main surface 1a of the separation functional layer 1 is not particularly limited, but the C-H ratio is, for example, 50 area% or more, or may be 60 area% or more, 70 area% or more, or 75 area% or more.
- C-O ratio on the first main surface 1a of the separation functional layer 1 or simply “C-O ratio.”
- the separation functional layer 1 is more likely to have pores that are miniaturized to a size appropriate for molecular sieving, thereby achieving higher separation performance.
- the C-O ratio on the first main surface 1a of the separation functional layer 1 is more preferably 6 area% or more.
- the upper limit of the C-O ratio on the first main surface 1a of the separation functional layer 1 is not particularly limited, but the C-O ratio is, for example, 40 area% or less, or may be 30 area% or less, or may be 20 area% or less.
- the upper limit of the COO ratio on the first main surface 1a of the separation functional layer 1 is not particularly limited, but the COO ratio may be, for example, 20 area% or less, or may be 15 area% or less, or may be 10 area% or less, or may be 5 area% or less.
- the ratio of the peak area derived from the Si(-O) 4 bond to the total peak area derived from the Si(-O) 2 , Si(-O) 3 , and Si(-O) 4 bonds is preferably 3 area% or more, more preferably 5 area% or more, and even more preferably 10 area% or more.
- the ratio of the peak area derived from the Si(-O)4 bond to the total peak area derived from the Si(-O) 2 , Si(-O) 3 , and Si(-O) 4 bonds in an analysis of the chemical bonding state of Si by XPS using a Si2p spectrum on the first main surface 1a will be referred to as "Si(-O) 4 ratio on the first main surface 1a of the separation functional layer 1" or simply "Si(-O) 4 ratio.”
- Si(-O) 4 ratio on the first main surface 1a of the separation functional layer 1 or simply “Si(-O) 4 ratio.”
- the upper limit of the Si(—O) 4 ratio in the first main surface 1a of the separation functional layer 1 is not particularly limited, but the Si(—O) 4 ratio is, for example, 90 area % or less, and may be 80 area % or less.
- the chemical bonding state of Si in the separation functional layer 1 using XPS is analyzed by performing waveform analysis on the Si2p spectrum obtained by XPS analysis using monochrome AlK ⁇ radiation as the X-ray source. At this time, the peak derived from the C-H bond in the C1s spectrum is charge corrected to 284.6 eV.
- the ratio of the peak area derived from the Si(-O) 3 bond to the total peak area derived from Si(-O) 2 , Si(-O) 3 , and Si(-O) 4 bonds is preferably 15 area% or more, and more preferably 20 area% or more.
- the ratio of the peak area derived from the Si(-O)3 bond to the total peak area derived from the Si(-O) 2 , Si(-O) 3 , and Si(-O) 4 bonds in an analysis of the chemical bonding state of Si by XPS using a Si2p spectrum on the first main surface 1a will be referred to as "Si(-O) 3 ratio in the first main surface 1a of the separation functional layer 1 " or simply "Si(-O) 3 ratio.”
- Si(-O) 3 ratio in the first main surface 1a of the separation functional layer 1 or simply "Si(-O) 3 ratio.
- the upper limit of the Si(—O) 3 ratio in the first main surface 1a of the separation functional layer 1 is not particularly limited, but the Si(—O) 3 ratio is, for example, 90 area % or less, and may be 85 area % or less.
- the ratio of the peak area derived from the Si(-O) 2 bond to the total peak area derived from the Si(-O) 2 , Si(-O) 3 , and Si(-O) 4 bonds is preferably 80 area% or less, more preferably 70 area% or less, and even more preferably 50 area% or less.
- the ratio of the peak area derived from the Si(-O)2 bond to the total peak area derived from the Si(-O) 2 , Si(-O) 3 , and Si(-O) 4 bonds in an analysis of the chemical bonding state of Si by XPS using a Si2p spectrum on the first main surface 1a will be referred to as "Si(-O) 2 ratio on the first main surface 1a of the separation functional layer 1" or simply "Si(-O) 2 ratio.”
- Si(-O) 2 ratio on the first main surface 1a of the separation functional layer 1 or simply “Si(-O) 2 ratio.”
- the lower limit of the Si(—O) 2 ratio in the first main surface 1a of the separation functional layer 1 is not particularly limited, but the Si(—O) 2 ratio is, for example, 1 area % or more.
- the "ratio of the peak area attributable to the Si(-O)4 bond to the sum of the peak areas attributable to the Si(-O) 2 and Si(-O) 3 bonds in an analysis of the chemical bonding state of Si by XPS using the Si2p spectrum of the first main surface 1a" will be referred to as the "Si(-O) 4 ratio at the first main surface 1a of the separation functional layer 1" or simply as the “Si(-O) 4 ratio.”
- the separation functional layer 1 is more likely to have pores that are miniaturized to a size appropriate for, for example, a molecular sieve, thereby achieving higher separation performance.
- the upper limit of the Si(—O) 4 ratio in the first main surface 1a of the separation functional layer 1 is not particularly limited, but the Si(—O) 4 ratio is, for example, 30 or less, or may be 5 or less, or may be 4 or less.
- the upper limit of the Si(—O) 2 ratio in the first main surface 1a of the separation functional layer 1 is not particularly limited, but the Si(—O) 2 ratio is, for example, 5 or less, and may be 4 or less.
- the ratio of the number of O atoms to the number of Si atoms, O/Si is preferably 1.2 or greater, more preferably 1.4 or greater, and even more preferably 1.7 or greater.
- the O/Si value on the first main surface 1a of the separation functional layer 1 can be determined by composition analysis of the first main surface 1a of the separation functional layer 1 using XPS.
- the upper limit of the O/Si ratio on the first main surface 1a of the separation functional layer 1 is not particularly limited, but the O/Si ratio is, for example, 3.0 or less, and may be 2.5 or less.
- the ratio of the number of C atoms to the total number of C atoms, N atoms, O atoms, and Si atoms is preferably 17 at. % or more, and more preferably 20 at. % or more.
- the upper limit of the proportion of the number of C atoms on the first main surface 1a of the separation functional layer 1 is not particularly limited, but may be, for example, 52 at. % or less, or 50 at. % or less.
- the ratio of the number of O atoms to the total number of C atoms, N atoms, O atoms, and Si atoms is preferably 54 at. % or less.
- the lower limit of the proportion of O atoms on the first main surface 1a of the separation functional layer 1 is not particularly limited, but may be, for example, 25 at. % or more, 30 at. % or more, or 35 at. % or more.
- the separation functional layer 1 is composed of a material containing Si, O, and C.
- Materials containing Si, O, and C include, for example, organosilicon compounds containing Si, O, and C.
- organosilicon compounds containing Si, O, and C include alkoxysilanes such as alkylsilicon alkoxides, and compounds containing siloxane bonds (Si-O-Si).
- alkylsilicon alkoxides include methyltriethoxysilane (MTES) and dimethyldiethoxysilane.
- the separation functional layer 1 preferably contains a compound containing a siloxane bond (Si-O-Si).
- the first main surface 1a of the separation functional layer 1 may contain organosilica having siloxane bonds, Si-C bonds, and C-O bonds. That is, on the first main surface 1a of the separation functional layer 1, the compound containing the siloxane bonds may be, for example, organosilica having siloxane bonds, Si-C bonds, and C-O bonds.
- organosilica By including the organosilica on the first main surface 1a of the separation functional layer 1, it becomes easier to form pores on the first main surface 1a of the separation functional layer 1 that are miniaturized to a size appropriate for a molecular sieve. This allows the separation functional layer 1 to have higher separation performance.
- the inclusion of such organosilica makes it easier for pores that have been miniaturized to a size appropriate for molecular sieving to be formed on the first main surface 1a of the separation function layer 1. This allows the separation function layer 1 to have higher separation performance.
- the organosilica may include, for example, organosilica having a cyclic structure.
- FIG. 2 is a structural diagram showing an example of organosilica having the above-mentioned cyclic structure that can be contained on the first main surface 1a of the separation functional layer 1.
- the structure of the organosilica contained on the first main surface 1a of the separation functional layer 1 is not limited to the structure shown in FIG. 2.
- the separation functional layer 1 may contain a silicone resin as a compound containing a siloxane bond in a portion of the separation functional layer 1 excluding the first principal surface 1a or in a portion excluding the first principal surface 1a and the region adjacent to the first principal surface 1a.
- the portion of the separation functional layer 1 excluding the first principal surface 1a or the portion excluding the first principal surface 1a and the region adjacent to the first principal surface 1a is referred to as the interior of the separation functional layer 1.
- Silicone resins have excellent properties such as heat resistance, water resistance, acid resistance, and flexibility, and can impart these excellent properties to the separation functional layer 1.
- the silicone resin contained in the separation functional layer 1 is not particularly limited, and various silicone resins can be used.
- the reaction type of the silicone resin is also not particularly limited, and it may be an addition reaction type silicone resin or a condensation reaction type silicone resin.
- the organic substituents contained in the silicone resin are also not particularly limited, and a silicone resin having a substituent that can exhibit appropriate properties depending on the application of the separation membrane 10 can be appropriately selected.
- the first main surface 1a of the separation functional layer 1 contains, for example, a second compound obtained by modifying a first compound that constitutes the interior of the separation functional layer 1 through plasma treatment. That is, in a precursor layer of the separation functional layer 1 that contains the first compound, the first compound contained in the precursor layer's main surface may be modified by plasma treating the main surface of the precursor layer that corresponds to the first main surface 1a of the separation functional layer 1, and the material of the first main surface 1a of the separation functional layer 1 may be made up of the second compound formed thereby.
- the plasma treatment here is, for example, treatment using inductively coupled plasma using a low-inductance antenna. Details of treatment using inductively coupled plasma using a low-inductance antenna will be described later.
- the first compound may contain a siloxane bond and may be, for example, a silicone resin.
- the second compound is a compound formed by modifying the silicone resin through plasma treatment.
- the thickness of the separation functional layer 1 is not particularly limited and may be, for example, 200 ⁇ m or less, 100 ⁇ m or less, 50 ⁇ m or less, 10 ⁇ m or less, 4 ⁇ m or less, 2 ⁇ m or less, or even 1.5 ⁇ m or less.
- the thickness of the separation functional layer 1 may be 0.05 ⁇ m or more, or 0.1 ⁇ m or more.
- the porous support 2 is a member that supports the separation function layer 1.
- the porous support 2 include nonwoven fabrics, porous polytetrafluoroethylene, aromatic polyamide fibers, porous metals, sintered metals, porous ceramics, porous polyesters, porous nylons, activated carbon fibers, latex, silicone, silicone rubber, polyvinyl fluoride, polyvinylidene fluoride (PVDF), polyurethane, polypropylene, polyethylene, polycarbonate, polysulfone, polyether ether ketone, polyacrylonitrile, polyimide, polyolefins, and polyphenylene oxides.
- Permeable (porous) polymers containing at least one selected from the group consisting of metal foams having open or closed cells, polymer foams having open or closed cells, silica, porous glass, and mesh screens.
- the porous support 2 may be a combination of two or more of these.
- the porous support 2 has an average surface pore diameter of, for example, 5 to 100 nm.
- the thickness of the porous support 2 is not particularly limited, and is, for example, 10 ⁇ m or more, preferably 20 ⁇ m or more, and more preferably 50 ⁇ m or more.
- the thickness of the porous support 2 is, for example, 300 ⁇ m or less, preferably 200 ⁇ m or less, and more preferably 150 ⁇ m or less.
- Figure 3 is a cross-sectional view showing a modified porous support body.
- the modified porous support body 2A may be, for example, a laminate including a main body portion 3 and a microporous layer 4.
- the main body 3 is, for example, a fiber structure such as a woven fabric or a nonwoven fabric, and is typically a nonwoven fabric.
- fibers contained in the fiber structure include natural fibers such as wood pulp, cotton, and hemp (e.g., Manila hemp); and chemical fibers (synthetic fibers) such as polyester fiber, rayon, vinylon, acetate fiber, polyvinyl alcohol (PVA) fiber, polyamide fiber, polyolefin fiber, and polyurethane fiber.
- the main body 3 is, for example, a nonwoven fabric made of polyester fiber.
- the main body 3 has an average pore size of, for example, 1 ⁇ m to 50 ⁇ m.
- microporous layer 4 examples include fluororesins such as polyvinylidene fluoride and polytetrafluoroethylene; polyarylethersulfones such as polysulfone and polyethersulfone; and polyimides.
- the microporous layer 4 has an average pore size of, for example, 0.01 ⁇ m to 0.4 ⁇ m.
- the thickness of the porous support 2 and the porous support 2A is not particularly limited and may be, for example, 10 ⁇ m or more, 50 ⁇ m or more, or even 100 ⁇ m or more.
- the thickness of the porous support 2 and the porous support 2A may be, for example, 300 ⁇ m or less, or 200 ⁇ m or less.
- the separation membrane 10 is typically a flat membrane.
- the separation membrane 10 may have a shape other than a flat membrane, for example, a hollow fiber membrane.
- the separation membrane 10 as a hollow fiber membrane includes a separation function layer 1 and a porous support 2 (or a porous support 2A).
- the separation membrane 10 can be produced, for example, by the following method.
- a precursor (precursor layer) of the separation functional layer 1 is prepared.
- a coating liquid containing a material including Si, O, and C is prepared, and the coating liquid is applied to a substrate to form a coating film, which is then dried. If necessary, this coating film is subjected to, for example, a heat treatment.
- the materials constituting the coating liquid are not particularly limited; they can be selected appropriately taking into account the material of the separation functional layer 1 to be prepared.
- the precursor layer when preparing a separation functional layer 1 containing a silicone resin, can be prepared by using a coating liquid containing a silicone resin composition containing polyorganosiloxane and a curing catalyst, and then heat-treating and curing the coating film.
- the silicone resin composition and curing catalyst are not particularly limited and can be selected appropriately. In this manner, the precursor layer is prepared.
- the porous support 2 (or porous support 2A) can be used as the substrate.
- This plasma treatment is, for example, treatment using inductively coupled plasma (ICP).
- ICP inductively coupled plasma
- the ICP used is preferably an ICP that uses a low-inductance antenna.
- the plasma treatment performed on the surface of the precursor layer is preferably treatment using ICP that is generated by applying high-frequency power to a low-inductance antenna.
- the method of plasma treatment is not particularly limited, but the plasma treatment may be performed while the precursor layer is being transported using a roll-to-roll method, or may be performed using a batch method.
- a low-inductance antenna refers to an antenna that has a low inductance of 7.5 ⁇ H or less and is capable of generating inductively coupled plasma by applying high-frequency power.
- high-frequency power refers to power from a high-frequency power source (RF power source) used to excite plasma discharge.
- Inductively coupled plasma treatment using a low-inductance antenna can easily form the specific configuration of the first main surface 1a of the separation functional layer 1, i.e., a first main surface 1a having the above-mentioned configuration in which the C-H ratio is 92 area% or less. Furthermore, ICP plasma treatment using a low-inductance antenna can also achieve the other configurations described above for the first main surface 1a (e.g., C-O ratio range, O/Si value, etc.).
- the precursor layer contains a compound with siloxane bonds such as silicone resin
- ICP plasma treatment using a low-inductance antenna tends to cleave C-H bonds without cleaving many Si-C bonds, and more likely to generate C-O bonds.
- organosilica containing siloxane bonds, Si-C bonds, and C-O bonds can be formed as described above while minimizing excessive damage to the first main surface 1a of the separation functional layer 1.
- general plasma treatment refers to treatment using capacitively coupled plasma (CCP).
- the frequency of the high-frequency power applied during plasma treatment is preferably 1 MHz or higher, more preferably 5 MHz or higher, and even more preferably 10 MHz or higher, and preferably 100 MHz or lower, more preferably 80 MHz or lower, and even more preferably 60 MHz or lower.
- the frequency is above the lower limit, the plasma current density can be increased while stabilizing the plasma discharge.
- the antenna potential can be suppressed, thereby suppressing damage to the separation functional membrane 1 caused by the plasma.
- the high-frequency power is preferably 0.1 kW or higher, more preferably 0.3 kW or higher, and even more preferably 1.0 kW or higher, and is preferably 10 kW or lower, more preferably 8 kW or lower, and even more preferably 6 kW or lower.
- the high-frequency power is above the lower limit, a high-density plasma environment can be formed in the plasma treatment chamber during plasma treatment using ICP.
- the high-frequency power is below the upper limit, excessive damage to the separation functional layer 1 caused by the plasma can be suppressed.
- the plasma treatment gas used to form the first main surface 1a of the separation functional layer 1 is, for example, at least one selected from the group consisting of argon, oxygen, and nitrogen.
- the plasma treatment gas preferably contains argon, and more preferably also contains oxygen (i.e., a mixed gas containing argon and oxygen). This effectively modifies the compounds contained in the precursor layer, allowing the formation of a separation functional layer 1 with higher separation performance.
- the pressure in the plasma treatment chamber is preferably 0.05 Pa or more, more preferably 0.1 Pa or more, even more preferably 0.2 Pa or more, and preferably 10 Pa or less, more preferably 7 Pa or less, even more preferably 5 Pa or less, particularly preferably 3 Pa or less, and even more preferably 1 Pa or less.
- a plasma environment of sufficient density for surface modification treatment for forming the first main surface 1a of the separation functional layer 1 can be created in the plasma treatment chamber during the plasma treatment.
- the pressure can be adjusted, for example, by the amount of gas supplied to the plasma treatment chamber.
- the plasma treatment time is preferably 5 seconds or more, more preferably 10 seconds or more, even more preferably 30 seconds or more, particularly preferably 40 seconds or more, even more preferably 50 seconds or more, and preferably 200 seconds or less, more preferably 150 seconds or less, and even more preferably 120 seconds or less.
- the plasma treatment time is equal to or greater than the above lower limit, sufficient surface modification for forming the first main surface 1a of the separation functional layer 1 by plasma treatment can be achieved.
- the plasma treatment time is equal to or less than the above upper limit, thermal damage to the first main surface 1a of the separation functional layer 1 caused by excessively high-density plasma can be suppressed during the plasma treatment, and thermal deformation of the separation functional layer 1 can also be suppressed.
- the separation membrane 10 of this embodiment is suitable for separating a mixed fluid containing two or more fluids, including a fluid to be separated, into a first fluid containing the fluid to be separated and a second fluid.
- the fluid may be a liquid or a gas.
- the separation method to which the separation membrane 10 is applied is not particularly limited.
- the separation membrane 10 can be used in various separation methods, such as reverse osmosis (RO), nanofiltration (NF), pervaporation (PV), and vapor permeation (VP).
- RO reverse osmosis
- NF nanofiltration
- PV pervaporation
- VP vapor permeation
- a separation method using the separation membrane 10 includes, for example, contacting a mixed fluid containing two or more fluids including a fluid to be separated with one surface of the separation membrane 10 (for example, the surface of the separation membrane 10 on the first main surface 1a side of the separation functional layer 1 (the first main surface of the separation membrane 10)), and separating the mixed fluid into a first fluid containing the fluid to be separated and a second fluid.
- the first fluid may consist only of the fluid to be separated.
- the second fluid may also contain a small amount of the fluid to be separated.
- the mixed fluid is separated into a first fluid containing a larger amount of the fluid to be separated, or a first fluid consisting of the fluid to be separated, and a second fluid having a small content of the fluid to be separated, or a second fluid not containing the fluid to be separated.
- the first fluid may be a fluid that has permeated the separation membrane 10, and the second fluid may not have permeated the separation membrane 10, or the first fluid may not have permeated the separation membrane 10, and the second fluid may be a fluid that has permeated the separation membrane 10.
- the mixed fluid is a mixed gas containing two or more gases including a gas to be separated.
- the gas to be separated is H 2
- the H 2 in the mixed gas is preferentially permeated through the separation membrane 10. This allows H 2 to be separated from the mixed gas.
- the separation membrane 10 of this embodiment can separate H 2 from a mixed gas of H 2 and another gas (e.g., CO 2 ), for example.
- the mixed fluid is a mixed liquid containing two or more liquids including a liquid to be separated.
- the liquid to be separated is H 2 O
- the H 2 O in the mixed liquid is preferentially permeated through the separation membrane 10. This allows H 2 O to be separated from the mixed liquid.
- the separation membrane 10 of this embodiment can separate H 2 O from, for example, a mixed liquid of H 2 O and another liquid (e.g., an organic solvent such as alcohol).
- the membrane separation apparatus 100 of this embodiment includes a separation membrane 10 and a tank 20.
- the tank 20 includes a first chamber 21 and a second chamber 22.
- the first chamber 21 functions as a supply space to which a supply fluid L (i.e., a mixed fluid L containing two or more fluids including a fluid to be separated) is supplied.
- the second chamber 22 functions as a permeation space to which a permeated fluid L1 is supplied.
- the permeated fluid L1 is obtained by the permeation of the mixed fluid L through the separation membrane 10.
- the separation membrane 10 is disposed inside the tank 20. Inside the tank 20, the separation membrane 10 separates the first chamber 21 and the second chamber 22. The separation membrane 10 extends from one to the other of a pair of walls of the tank 20.
- the first chamber 21 has an inlet 21a and an outlet 21b.
- the second chamber 22 has an outlet 22a.
- the inlet 21a is an opening for supplying the mixed fluid L to the supply space (first chamber 21).
- the outlet 22a is an opening for discharging the permeated fluid L1 from the permeated space (second chamber 22).
- the outlet 21b is an opening for discharging the mixed fluid L (non-permeated fluid L2) that has not permeated the separation membrane 10 from the supply space (first chamber 21).
- the inlet 21a, outlet 21b, and outlet 22a are each formed, for example, on the wall surface of the tank 20.
- the membrane separation device 100 is suitable for flow-through (continuous) membrane separation methods. However, the membrane separation device 100 may also be used for batch-type membrane separation methods.
- the membrane separation device 100 is operated, for example, as follows: First, the mixed fluid L is supplied to the first chamber 21 of the membrane separation device 100 through the inlet 21 a. This allows the mixed fluid L to come into contact with one surface of the separation membrane 10 (for example, the first main surface of the separation membrane 10).
- the temperature of the mixed fluid L is, for example, 25°C or higher, preferably 40°C or higher, and more preferably 60°C or higher.
- the temperature of the mixed fluid L may be 75°C or lower.
- the membrane separation device 100 may further include a pump (not shown) for reducing the pressure inside the second chamber 22.
- the second chamber 22 is depressurized so that the pressure inside the second chamber 22 is, for example, 10 kPa or more, preferably 50 kPa or more, and more preferably 100 kPa or more lower than the atmospheric pressure in the measurement environment.
- permeated fluid L1 By reducing the pressure inside the second chamber 22, permeated fluid L1 can be obtained on the other side of the separation membrane 10. In other words, permeated fluid L1 is supplied to the second chamber 22. Permeated fluid L1 is discharged to the outside of the membrane separation device 100 through the outlet 22a.
- the mixed fluid L (non-permeated fluid L2) treated in the first chamber 21 is discharged outside the membrane separation device 100 through the outlet 21b.
- the membrane separation device 100 may be a spiral-wound membrane element, a hollow fiber membrane element, a disk-tube membrane element in which multiple separation membranes are stacked, a plate-and-frame membrane element, or the like.
- Fig. 5 shows a spiral-wound membrane element.
- the membrane separation device 110 in Fig. 5 includes a central tube 41 and a stack 42.
- the stack 42 includes separation membranes 10.
- the central tube 41 has a cylindrical shape. A plurality of holes or slits are formed on the surface of the central tube 41 to allow the permeating fluid L1 to flow into the interior of the central tube 41.
- materials for the central tube 41 include resins such as acrylonitrile butadiene styrene copolymer resin (ABS resin), polyphenylene ether resin (PPE resin), and polysulfone resin (PSF resin); and metals such as stainless steel and titanium.
- the inner diameter of the central tube 41 is, for example, in the range of 20 to 100 mm.
- the laminate 42 further includes a feed-side flow path material 43 and a permeate-side flow path material 44.
- the laminate 42 is wound around the central tube 41.
- the membrane separation device 110 may further include an exterior material (not shown).
- the feed-side flow path material 43 and the permeate-side flow path material 44 can be, for example, a resin net made of polyethylene, polypropylene, polyethylene terephthalate (PET), polyphenylene sulfide (PPS), or ethylene-chlorotrifluoroethylene copolymer (ECTFE).
- PET polyethylene terephthalate
- PPS polyphenylene sulfide
- ECTFE ethylene-chlorotrifluoroethylene copolymer
- the membrane separation device 110 can be operated, for example, in the following manner. First, mixed fluid L is supplied to one end of the wound stack 42, and the space inside the central tube 41 is depressurized. As a result, permeated fluid L1 that has permeated the separation membrane 10 of the stack 42 moves into the interior of the central tube 41. Permeated fluid L1 is discharged to the outside through the central tube 41. The mixed fluid L (non-permeated fluid L2) that has been treated in the membrane separation device 110 is discharged to the outside from the other end of the wound stack 42.
- Example 1 First, RS-50 (a laminate of a PVDF microporous layer and a PET nonwoven fabric) manufactured by Nitto Denko Corporation was prepared as a porous support. Next, 2 g of a curing catalyst (SRX212 manufactured by Dow Toray) was added to 100 g of a silicone resin composition (LTC-1051L manufactured by Dow Toray) to prepare an addition reaction type silicone resin composition as a coating liquid. This coating liquid was a solventless type that did not contain a solvent. Next, a coating film was obtained by applying the coating liquid onto the microporous layer of the porous support. Next, the coating film was heated at 150°C for 10 minutes and cured to prepare a precursor layer, which is a precursor of the separation functional layer. At this time, the precursor layer was prepared so that its dry thickness was 15 ⁇ m or less.
- SRX212 SRX212 manufactured by Dow Toray
- the surface of the prepared precursor layer was plasma-treated.
- a laminate plasma-treated object in which a precursor layer was formed on a porous support was transported by roll-to-roll, while a plasma treatment was performed on the surface of the precursor layer by ICP using a low-inductance antenna.
- the apparatus included a payout chamber, a plasma treatment chamber, and a winding chamber, which were arranged in this order and connected to each other.
- the payout chamber was equipped with a payout roller.
- a roll of general-purpose PET film was set on the payout roller as a carrier film for transporting the laminate.
- the plasma treatment chamber was equipped with a temperature-adjustable transport roller and four low-inductance antennas.
- Figure 6 is a perspective view showing the positional relationship between the low-inductance antenna and the plasma-treated object in the plasma treatment chamber used in this example.
- Figure 7 is a cross-sectional view showing the positional relationship between the low-inductance antenna and the plasma-treated object in the plasma treatment chamber used in this example.
- Each low-inductance antenna 71 had an extension 71a parallel to the object 70 to be plasma processed.
- the four low-inductance antennas 71 had an extension length d1 of 88 mm, a maximum length d2 (length of the extension) of 100 mm, a separation distance d3 of 112 mm, a center-to-center distance d4 of 290 mm, and a center-to-center distance d5 of 280 mm.
- Each low-inductance antenna 71 was electrically connected to a high-frequency power source (RF power source, frequency 13.56 MHz) via an impedance matching box outside the plasma processing chamber.
- 72 denotes a fixture
- 74 denotes a field-through
- the low-inductance antenna 71 was fixed to the fixture 72 via the field-through 74.
- the laminate of the porous support and precursor layer which was the object to be plasma treated, was cut to A4 size and attached using tape so that the porous support was in contact with the general-purpose PET film carrier film.
- This raw roll was set in the unwinding chamber, and while the carrier film was transported from the unwinding chamber to the winding chamber using the roll-to-roll method, the surface of the precursor layer was plasma treated in the plasma treatment chamber.
- the plasma treatment conditions were as follows: The apparatus was evacuated until the ultimate vacuum of the plasma treatment chamber reached 1.0 ⁇ 10 -4 Pa, and then argon (Ar) gas was introduced into the plasma treatment chamber, setting the pressure inside the plasma treatment chamber to 0.2 Pa. An inductively coupled plasma of argon-containing gas was formed around the four low-inductance antennas by applying 5.0 kW of power to the four low-inductance antennas using a 13.56 MHz high-frequency power source (RF power source). The running speed of the carrier film was changed according to the treatment time (80 seconds in Example 1). The temperature of the temperature-controlled transport roller was set to 20°C. Table 2 shows the plasma treatment conditions.
- the surface of the precursor layer that had been subjected to the above plasma treatment became the first main surface of the separation functional layer, and the separation membrane of Example 1 was produced.
- Example 2 A separation membrane of Example 2 was produced in the same manner as in Example 1, except that the plasma treatment conditions were changed as shown in Table 2.
- Example 3 First, a Nitto Denko SWC (a laminate of a polysulfone microporous layer and a PET nonwoven fabric) was prepared as a porous support and dried overnight in a draft. Next, 30 g of a silicone resin composition (Wacker DEHESIVE (registered trademark) 944) was added with 3 g of a crosslinker (Wacker CROSSLINKER V 24) and 0.6 g of a curing catalyst (Wacker CATALYST OL), and dissolved in 100 mL of a hydrocarbon solvent (Wacker EXXSOL D40) and stirred for 30 minutes to prepare a condensation reaction type silicone resin composition as a coating liquid.
- a silicone resin composition (Wacker DEHESIVE (registered trademark) 944) was added with 3 g of a crosslinker (Wacker CROSSLINKER V 24) and 0.6 g of a curing catalyst (Wacker CATALYST OL), and dissolved in 100 mL of
- the coating liquid was applied onto the microporous layer of the porous support to obtain a coating film. After drying the coating film for 2 hours in a draft, the coating liquid was again applied onto the microporous layer of the porous support. Next, the coating film was dried overnight in a draft and then heated at 100° C. for 30 minutes to be cured, thereby producing a precursor layer, which is a precursor of the separation functional layer. At this time, the precursor layer was produced so that its dry thickness was 15 ⁇ m or less.
- the plasma treatment of the precursor layer surface was carried out in the same manner as in Example 1, except that the plasma treatment conditions were changed as shown in Table 2.
- the separation membrane of Example 3 was produced using the above method.
- Example 4 The separation membrane of Example 4 was produced in the same manner as in Example 1, except that the plasma treatment conditions were changed as shown in Table 2.
- Example 4 a mixed gas of argon gas and oxygen gas was used, and the flow rates of the argon gas and oxygen gas were adjusted so that the volume ratio of the argon gas to the oxygen gas was 1:1.
- Example 5 A separation membrane of Example 5 was produced in the same manner as in Example 3, except that the plasma treatment conditions were changed as shown in Table 2.
- Example 6 A separation membrane of Example 6 was produced in the same manner as in Example 3, except that the plasma treatment conditions were changed as shown in Table 2.
- Example 7 A separation membrane of Example 6 was produced in the same manner as in Example 3, except that the plasma treatment conditions were changed as shown in Table 2.
- Example 1 The precursor layer produced in Example 3 was used as a separation functional layer without being subjected to plasma treatment. That is, the laminate of the porous support and the precursor layer produced in Example 3 was used as the separation membrane of Comparative Example 1.
- Example 2 The precursor layer produced in Example 1 was used as a separation functional layer without being subjected to plasma treatment. That is, the laminate of the porous support and the precursor layer produced in Example 1 was used as the separation membrane of Comparative Example 2.
- Comparative Example 3 A separation membrane of Comparative Example 3 was produced in the same manner as in Example 1, except that the plasma treatment using ICP was changed to plasma treatment using CCP.
- the plasma treatment using CCP carried out in Comparative Example 3 was as follows.
- a cathode electrode and an anode electrode were installed as flat plate electrodes and used as a plasma treatment chamber.
- the pair of planar electrodes were spaced 50 mm apart and positioned parallel to the laminate (object to be plasma-treated), which was a porous support on which a precursor layer was formed.
- the anode electrode was positioned 35 mm away from the laminate and grounded outside the plasma treatment chamber.
- the cathode electrode was positioned facing the surface of the precursor layer, which was the plasma treatment surface, and was electrically connected to an RF power supply (high-frequency power supply, 13.56 MHz) via an impedance matcher.
- RF power supply high-frequency power supply, 13.56 MHz
- Argon gas was introduced into the plasma treatment chamber, and the flow rate was adjusted to a pressure of 0.5 Pa.
- CCP was generated by applying 0.2 kW from the high-frequency power supply between the planar electrodes, and treatment was performed.
- the surface size of each planar electrode facing the laminate was 110 mm x 430 mm.
- the apparatus used was a "Quantera SXM” manufactured by ULVAC-PHI, and a monochromatic AlK ⁇ was used as the X-ray source.
- the results of the XPS analysis of the first main surface of the separation functional layer are shown in Tables 3 and 4.
- the separation membrane was cut into a size of 74 mm in diameter to create a flat membrane test piece.
- This test piece was placed in a batch-type membrane separation device (cell).
- a mixed liquid consisting of IPA and water was supplied to the supply space of this cell.
- the IPA content in the mixed liquid was 50% by mass.
- the cell was immersed in a water bath and the temperature of the mixed liquid was adjusted to 40°C.
- the pressure in the permeation space was reduced to 15 hPa while stirring the mixed liquid using a stirrer placed inside the cell. This allowed the mixed liquid to permeate the separation membrane, yielding a gaseous permeation fluid.
- the gaseous permeating fluid was cooled and condensed using a cold trap using liquid nitrogen.
- the composition of the liquid permeating fluid was analyzed using gas chromatography, and the separation factor ⁇ was calculated based on the results. The results are shown in Table 3.
- the separation membrane was cut into a size of 64 mm in diameter to prepare a flat membrane-shaped test piece.
- This test piece was set in a batch-type membrane separation device (cell). H2 gas and CO2 gas were simultaneously supplied to the supply space of this cell.
- the cell was set in an oven chamber, and the temperature was adjusted to 150 ° C. As a result, the mixed gas permeated the separation membrane, and a permeated gas was obtained.
- the composition of the permeated gas was analyzed using gas chromatography, and the gas permeation rate [GPU] of each gas was determined based on the results obtained.
- the separation membranes of the examples showed improved separation performance in both liquid and gas separation.
- the separation membrane of this embodiment has improved separation performance and is particularly suitable for separating water from mixed liquids and hydrogen from mixed gases.
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Abstract
Description
本発明は、分離膜、膜分離装置、及び分離方法に関する。 The present invention relates to a separation membrane, a membrane separation device, and a separation method.
現在、カーボンニュートラルな社会が求められており、様々な機能の製品開発が加速している。例えば、半導体、アルコール製造等の業界では、製品の製造に多量の水が使用されている。そのため、水の再利用に向けて、水とアルコール等の有機溶媒とを含む混合液体から水を分離するための分離技術の開発が行われている。また、地球温暖化の問題と関連し、火力発電所、セメントプラント、製鉄所高炉等において、排ガスから二酸化炭素を分離回収する技術開発が行われている。 Currently, there is a demand for a carbon-neutral society, and the development of products with a variety of functions is accelerating. For example, in industries such as semiconductors and alcohol production, large amounts of water are used in the manufacture of products. As a result, separation technologies are being developed to separate water from mixed liquids containing water and organic solvents such as alcohol, with the aim of reusing water. Also, in relation to the issue of global warming, technology is being developed to separate and capture carbon dioxide from exhaust gases at thermal power plants, cement plants, steelworks blast furnaces, and other facilities.
混合液体及び混合ガスなどの混合流体から目的の物質を分離する方法として、分離膜を用いた膜分離法が開発されている。例えば、混合液体から目的の液体を分離する液分離については、膜分離法は、加熱工程が必要な蒸留による分離に比べて低エネルギーでの分離が可能であり、かつ二酸化炭素の発生も抑えることができる。このように、膜分離法は、低エネルギーで環境負荷の小さい分離技術として優れている。 Membrane separation, which uses separation membranes, has been developed as a method for separating target substances from mixed fluids such as mixed liquids and mixed gases. For example, when it comes to liquid separation, which separates the target liquid from a mixed liquid, membrane separation requires less energy than separation by distillation, which requires a heating process, and can also reduce the generation of carbon dioxide. In this way, membrane separation is an excellent separation technology that uses less energy and has a smaller environmental impact.
ガス分離又は液分離に関しては、通常、分離機能を有する部分がポリイミド等の有機系材料で形成された分離膜が使用されることが多い。一方、分離機能を有する部分が無機系材料で形成された分離膜として、例えばゼオライトを用いた分離膜や中空糸膜が提案されている。 When it comes to gas or liquid separation, separation membranes are typically used in which the part with the separation function is made of an organic material such as polyimide. On the other hand, separation membranes in which the part with the separation function is made of an inorganic material, such as zeolite separation membranes and hollow fiber membranes, have been proposed.
従来、分離膜については、混合流体から目的の物質を分離するための分離機能の向上(例えば、流体の透過性能や分離選択性の向上)、あるいは耐曲げ性等の機械的強度の向上のために、様々な材料及び様々な構成の分離膜が提案されている。例えば、特許文献1には、ガス透過性能、耐摩擦性、及び耐曲げ性に優れたガス分離膜が開示されている。具体的には、特許文献1に開示されている分離膜は、シロキサン結合を有する化合物を含む樹脂層前駆体に対してプラズマ処理を施すことによって特定の構成を有する樹脂層が形成され、その樹脂層の上にシリコーン樹脂を含む保護層と、多孔質層とがさらに配置された構成を有している。 Conventionally, various materials and configurations of separation membranes have been proposed to improve the separation function for separating target substances from mixed fluids (for example, improving fluid permeability or separation selectivity) or to improve mechanical strength such as bending resistance. For example, Patent Document 1 discloses a gas separation membrane with excellent gas permeability, abrasion resistance, and bending resistance. Specifically, the separation membrane disclosed in Patent Document 1 has a configuration in which a resin layer with a specific configuration is formed by performing plasma treatment on a resin layer precursor containing a compound with a siloxane bond, and a protective layer containing a silicone resin and a porous layer are further disposed on top of the resin layer.
特許文献1に開示されているような、プラズマ処理によって分離性能を発現させている従来の分離膜には、分離性能について改善の余地がある。そこで、本発明は、分離性能の改善に適した構成を有する分離膜を提供する。さらに、本発明は、分離性能の改善に適した構成を有する分離膜を備えた膜分離装置、及びそのような分離膜を用いる分離方法も提供する。 Conventional separation membranes, such as those disclosed in Patent Document 1, which achieve separation performance through plasma treatment, have room for improvement in terms of separation performance. Therefore, the present invention provides a separation membrane with a configuration suitable for improving separation performance. Furthermore, the present invention also provides a membrane separation device equipped with a separation membrane with a configuration suitable for improving separation performance, and a separation method using such a separation membrane.
本発明は、
Si、O、及びCを含む分離機能層を備え、
X線光電子分光法による前記分離機能層の第1主面についてのC1sスペクトルによるCの化学結合状態の解析において、C-H、C-O、C=O、及びCOOの結合に由来するピーク面積の合計に対する前記C-Hの結合に由来するピーク面積の割合が、92area%以下である、
分離膜を提供する。
The present invention provides
A separation functional layer containing Si, O, and C is provided,
In an analysis of the chemical bonding state of C by C1s spectrum of the first main surface of the separation functional layer by X-ray photoelectron spectroscopy, the ratio of the peak area derived from the C-H bond to the total peak area derived from C-H, C-O, C=O, and COO bonds is 92 area% or less.
A separation membrane is provided.
さらに、本発明は、
上記の分離膜を備えた、
膜分離装置を提供する。
Furthermore, the present invention provides
A device equipped with the above separation membrane
A membrane separation device is provided.
さらに、本発明は、
上記の分離膜を用いる分離方法であって、
分離対象流体を含む2種以上の流体を含む混合流体を、前記分離膜の一方の面に接触させて、前記混合流体を、前記分離対象流体を含む第1流体と、第2流体とに分離すること、を含む、
分離方法を提供する。
Furthermore, the present invention provides
A separation method using the above separation membrane,
A mixed fluid containing two or more fluids including a fluid to be separated is brought into contact with one side of the separation membrane, and the mixed fluid is separated into a first fluid containing the fluid to be separated and a second fluid.
A separation method is provided.
本発明によれば、分離性能の改善に適した構成を有する分離膜を提供できる。さらに、本発明によれば、分離性能の改善に適した構成を有する分離膜を備えた膜分離装置、及びそのような分離膜を用いる分離方法も提供できる。 The present invention provides a separation membrane having a configuration suitable for improving separation performance. Furthermore, the present invention also provides a membrane separation device equipped with a separation membrane having a configuration suitable for improving separation performance, and a separation method using such a separation membrane.
本発明の第1態様にかかる分離膜は、
Si、O、及びCを含む分離機能層を備え、
X線光電子分光法による前記分離機能層の第1主面についてのC1sスペクトルによるCの化学結合状態の解析において、C-H、C-O、C=O、及びCOOの結合に由来するピーク面積の合計に対する前記C-Hの結合に由来するピーク面積の割合が、92area%以下である。
The separation membrane according to the first aspect of the present invention comprises:
A separation functional layer containing Si, O, and C is provided,
In an analysis of the chemical bonding state of C by C1s spectrum on the first main surface of the separation functional layer by X-ray photoelectron spectroscopy, the ratio of the peak area derived from the C-H bond to the total peak area derived from C-H, C-O, C=O, and COO bonds is 92 area% or less.
本発明の第2態様において、例えば、第1態様にかかる分離膜では、X線光電子分光法による前記分離機能層の前記第1主面についてのC1sスペクトルによるCの化学結合状態の解析において、C-H、C-O、C=O、及びCOOの結合に由来するピーク面積の合計に対する前記C-Oの結合に由来するピーク面積の割合が、5area%以上である。 In the second aspect of the present invention, for example, in the separation membrane according to the first aspect, when the chemical bonding state of C is analyzed by X-ray photoelectron spectroscopy using a C1s spectrum on the first main surface of the separation functional layer, the ratio of the peak area due to the C-O bond to the total peak area due to C-H, C-O, C=O, and COO bonds is 5 area% or more.
本発明の第3態様において、例えば、第1又は第2態様にかかる分離膜では、前記分離機能層の前記第1主面において、Si原子の数に対するO原子の数の比であるO/Siが、1.2以上である。 In a third aspect of the present invention, for example, in a separation membrane according to the first or second aspect, the ratio of the number of O atoms to the number of Si atoms, O/Si, on the first main surface of the separation functional layer is 1.2 or greater.
本発明の第4態様において、例えば、第1~第3態様のいずれか1つにかかる分離膜では、前記分離機能層の前記第1主面において、C原子、N原子、O原子、及びSi原子の数の合計に対するC原子の数の割合が、17at.%以上である。 In a fourth aspect of the present invention, for example, in a separation membrane according to any one of the first to third aspects, the ratio of the number of C atoms to the total number of C atoms, N atoms, O atoms, and Si atoms on the first main surface of the separation functional layer is 17 at. % or more.
本発明の第5態様において、例えば、第1~第4態様のいずれか1つにかかる分離膜では、前記分離機能層の前記第1主面において、C原子、N原子、O原子、及びSi原子の数の合計に対するO原子の数の割合が、54at.%以下である。 In a fifth aspect of the present invention, for example, in a separation membrane according to any one of the first to fourth aspects, the ratio of the number of O atoms to the total number of C atoms, N atoms, O atoms, and Si atoms on the first main surface of the separation functional layer is 54 at. % or less.
本発明の第6態様において、例えば、第1~第5態様のいずれか1つにかかる分離膜は、前記分離機能層の前記第1主面に対向する第2主面側に配置された、前記分離機能層を支持する多孔性支持体をさらに備える。 In a sixth aspect of the present invention, for example, a separation membrane according to any one of the first to fifth aspects further comprises a porous support that supports the separation functional layer and is arranged on the second main surface side of the separation functional layer, opposite the first main surface.
本発明の第7態様において、例えば、第1~第6態様のいずれか1つにかかる分離膜では、前記分離機能層は、シロキサン結合を含む化合物を含む。 In a seventh aspect of the present invention, for example, in a separation membrane according to any one of the first to sixth aspects, the separation functional layer contains a compound containing a siloxane bond.
本発明の第8態様において、例えば、第7態様にかかる分離膜では、前記分離機能層の前記第1主面は、シロキサン結合、Si-C結合、及びC-O結合を有するオルガノシリカを含む。 In an eighth aspect of the present invention, for example, in the separation membrane according to the seventh aspect, the first main surface of the separation functional layer contains organosilica having siloxane bonds, Si-C bonds, and C-O bonds.
本発明の第9態様において、例えば、第1~第8態様のいずれか1つにかかる分離膜では、前記分離機能層の前記第1主面は、前記分離機能層の内部を構成する第1化合物がプラズマ処理によって改質された第2化合物を含む。 In a ninth aspect of the present invention, for example, in a separation membrane according to any one of the first to eighth aspects, the first main surface of the separation functional layer contains a second compound obtained by modifying a first compound constituting the interior of the separation functional layer by plasma treatment.
本発明の第10態様において、例えば、第9態様にかかる分離膜では、前記第1化合物は、シロキサン結合を含む。 In a tenth aspect of the present invention, for example, in the separation membrane according to the ninth aspect, the first compound contains a siloxane bond.
本発明の第11態様において、例えば、第10態様にかかる分離膜では、前記第1化合物は、シリコーン樹脂である。 In an eleventh aspect of the present invention, for example, in the separation membrane according to the tenth aspect, the first compound is a silicone resin.
本発明の第12態様において、例えば、第9又は第10態様にかかる分離膜では、前記プラズマ処理は、低インダクタンスアンテナを用いた誘導結合プラズマによる処理である。 In a twelfth aspect of the present invention, for example, in a separation membrane according to the ninth or tenth aspect, the plasma treatment is a treatment using inductively coupled plasma using a low-inductance antenna.
本発明の第13態様において、例えば、第1~第12態様のいずれか1つにかかる分離膜は、前記分離機能層の前記第1主面の少なくとも一部は、前記分離膜の表面に露出している。 In a thirteenth aspect of the present invention, for example, in a separation membrane according to any one of the first to twelfth aspects, at least a portion of the first main surface of the separation functional layer is exposed on the surface of the separation membrane.
本発明の第14態様にかかる膜分離装置は、
第1~第13態様のいずれか1つにかかる分離膜を備える。
A membrane separation device according to a fourteenth aspect of the present invention comprises:
The separator includes a separation membrane according to any one of the first to thirteenth aspects.
本発明の第15態様にかかる分離方法は、
第1~第13態様のいずれか1つにかかる分離膜を用いる分離方法であって、
分離対象流体を含む2種以上の流体を含む混合流体を、前記分離膜の一方の面に接触させて、前記混合流体を、前記分離対象流体を含む第1流体と、第2流体とに分離すること、を含む。
A separation method according to a fifteenth aspect of the present invention comprises:
A separation method using a separation membrane according to any one of the first to thirteenth aspects,
The method includes bringing a mixed fluid containing two or more fluids including a fluid to be separated into a first fluid containing the fluid to be separated and a second fluid into contact with one side of the separation membrane.
本発明の第16態様において、例えば、第15態様にかかる分離方法では、前記混合流体は、分離対象ガスを含む2種以上のガスを含む混合ガスである。 In a sixteenth aspect of the present invention, for example, in the separation method according to the fifteenth aspect, the mixed fluid is a mixed gas containing two or more gases including the gas to be separated.
本発明の第17態様において、例えば、第16態様にかかる分離方法では、前記分離対象ガスがH2であり、前記混合ガスのうちH2を前記分離膜に優先的に透過させる。 In a seventeenth aspect of the present invention, for example, in the separation method according to the sixteenth aspect, the gas to be separated is H 2 , and H 2 of the mixed gas is preferentially allowed to permeate the separation membrane.
本発明の第18態様において、例えば、第15態様にかかる分離方法では、前記混合流体は、分離対象液体を含む2種以上の液体を含む混合液体である。 In an 18th aspect of the present invention, for example, in the separation method according to the 15th aspect, the mixed fluid is a mixed liquid containing two or more liquids, including the liquid to be separated.
本発明の第19態様において、例えば、第18態様にかかる分離方法では、前記分離対象液体がH2Oであり、前記混合液体のうちH2Oを前記分離膜に優先的に透過させる。 In a nineteenth aspect of the present invention, for example, in the separation method according to the eighteenth aspect, the liquid to be separated is H 2 O, and H 2 O in the mixed liquid is preferentially allowed to permeate the separation membrane.
以下、本発明の詳細を説明するが、以下の説明は、本発明を特定の実施形態に制限する趣旨ではない。 The present invention will be described in detail below, but the following description is not intended to limit the present invention to any particular embodiment.
<分離膜の実施形態>
図1に示すように、本実施形態の分離膜10は、分離機能層1を備える。分離機能層1は、Si、O、及びCを含む。分離機能層1は、さらに、X線光電子分光法(XPS)による分離機能層1の第1主面1aについてのC1sスペクトルによるCの化学結合状態の解析において、C-H、C-O、C=O、及びCOOの結合に由来するピーク面積の合計に対するC-Hの結合に由来するピーク面積の割合が92area%以下である、との特定の構成を有する。このような特定の構成を有する第1主面1aを備えることにより、分離機能層1は、分離性能を改善することができる。例えば、分離機能層1は、上記の特定の構成を有することにより、第1主面1aに分子ふるいに適切なサイズに微小化された細孔を有することができるので、分離性能を改善することができる。
<Embodiments of Separation Membranes>
As shown in FIG. 1 , the separation membrane 10 of this embodiment includes a separation functional layer 1. The separation functional layer 1 contains Si, O, and C. The separation functional layer 1 further has a specific configuration in which, in an analysis of the chemical bonding state of C by C1s spectrum of the first main surface 1a of the separation functional layer 1 using X-ray photoelectron spectroscopy (XPS), the ratio of the peak area derived from C-H bonds to the total peak area derived from C-H, C-O, C═O, and COO bonds is 92 area% or less. By providing the first main surface 1a with such a specific configuration, the separation functional layer 1 can improve its separation performance. For example, by having the above-described specific configuration, the separation functional layer 1 can have pores on the first main surface 1a that are miniaturized to a size appropriate for a molecular sieve, thereby improving its separation performance.
ここで、XPSによる分離機能層1のCの化学結合状態の解析では、X線源としてモノクロAlKα線を用いるXPS分析によって取得されたC1sスペクトルに対し、波形解析を行うことによってCの化学結合状態が解析される。この際、C1sスペクトルのC-H結合由来のピークを、284.6eVに帯電補正する。 In analyzing the chemical bonding state of C in the separation functional layer 1 using XPS, the chemical bonding state of C is analyzed by performing waveform analysis on the C1s spectrum obtained by XPS analysis using monochrome AlKα radiation as the X-ray source. At this time, the peak derived from the C-H bond in the C1s spectrum is charge corrected to 284.6 eV.
分離膜10は、例えば、多孔性支持体2をさらに備えている。多孔性支持体2は、分離機能層1の第1主面1aに対向する第2主面1b側に配置されて、分離機能層1を支持している。なお、多孔性支持体2は、図1に示すように分離機能層1の第2主面1bに直接接して配置されていてもよいし、分離機能層1と多孔性支持体2との間に他の層(中間層)がさらに設けられていてもよい。なお、分離膜10は、場合によっては、多孔性支持体2を備えておらず、分離機能層1のみを備えた自立膜(単層膜)であってもよい。 The separation membrane 10 further includes, for example, a porous support 2. The porous support 2 is arranged on the second main surface 1b side opposite the first main surface 1a of the separation functional layer 1, and supports the separation functional layer 1. The porous support 2 may be arranged in direct contact with the second main surface 1b of the separation functional layer 1, as shown in FIG. 1, or another layer (intermediate layer) may be further provided between the separation functional layer 1 and the porous support 2. In some cases, the separation membrane 10 may not include the porous support 2, and may be a free-standing membrane (single-layer membrane) equipped only with the separation functional layer 1.
分離機能層1の第1主面1aの少なくとも一部が、分離膜10の表面に露出していてもよい。この構成によれば、分離膜10に、分離機能層1が有する分離性能を効果的に発揮させることができる。分離機能層1の第1主面1aは、実質的に全面が分離膜10の表面に露出していてもよい。この場合、実質的に第1主面1aの全面とは、第1主面1aの面積の90%以上を意味し、95%以上であってもよい。分離機能層1の第1主面1aは、全面が分離膜10の表面に露出していてもよい。 At least a portion of the first main surface 1a of the separation function layer 1 may be exposed on the surface of the separation membrane 10. This configuration allows the separation membrane 10 to effectively exhibit the separation performance of the separation function layer 1. Substantially the entire first main surface 1a of the separation function layer 1 may be exposed on the surface of the separation membrane 10. In this case, "substantially the entire first main surface 1a" means 90% or more of the area of the first main surface 1a, and may be 95% or more. The entire first main surface 1a of the separation function layer 1 may be exposed on the surface of the separation membrane 10.
分離機能層1の第1主面1a上には、例えば、保護層として機能する樹脂層が設けられていてもよい。このような保護層は、分離機能層1の分離性能をできるだけ妨げないものであることが望ましく、第1主面1aにおいて保護することが望ましい箇所に部分的に設けることがより望ましい。分離膜10は、例えば、折り曲げられたり、巻回されたりした状態で装置内に設置されることがある。したがって、そのような設置状態を考慮して、補強することが望ましい部分にのみ保護層が設けられてもよい。 For example, a resin layer that functions as a protective layer may be provided on the first main surface 1a of the separation functional layer 1. It is desirable that such a protective layer does not interfere with the separation performance of the separation functional layer 1 as much as possible, and it is more desirable that it be provided partially on the first main surface 1a in areas where protection is desired. The separation membrane 10 may be installed within the device in a folded or rolled state, for example. Therefore, taking such installation conditions into consideration, a protective layer may be provided only in areas where reinforcement is desired.
(分離機能層)
分離機能層1は、混合液体及び混合気体等の混合流体から、分離目的の物質(以下、「分離対象流体」という。)を分離させる層である。分離機能層1は、混合流体に含まれる分離対象流体を優先的に透過させる層であってもよいし、分離対象流体を透過させずに分離対象流体を除く流体を透過させる層であってもよい。
(separation functional layer)
The separation functional layer 1 is a layer that separates a substance to be separated (hereinafter referred to as "fluid to be separated") from a mixed fluid such as a mixed liquid and a mixed gas. The separation functional layer 1 may be a layer that preferentially allows the fluid to be separated contained in the mixed fluid to permeate, or may be a layer that does not allow the fluid to be separated to permeate but allows fluids other than the fluid to be separated to permeate.
例えば、混合流体が水(H2O)と有機溶媒とを含む混合液体であり、その混合液体からH2Oを分離対象液体として分離する場合、分離機能層1は、H2Oを優先的に透過させることによって混合液体からH2Oを分離することができる。 For example, when the mixed fluid is a mixed liquid containing water (H 2 O) and an organic solvent, and H 2 O is to be separated from the mixed liquid as the liquid to be separated, the separation function layer 1 can separate H 2 O from the mixed liquid by preferentially allowing H 2 O to permeate.
例えば、混合流体が水素(H2)と、二酸化炭素(CO2)等の他のガスとを含む混合ガスであり、その混合ガスからH2を分離対象ガスとして分離する場合、分離機能層1は、H2を優先的に透過させることによって混合ガスからH2を分離することができる。 For example, when the mixed fluid is a mixed gas containing hydrogen (H 2 ) and other gases such as carbon dioxide (CO 2 ), and H 2 is to be separated from the mixed gas as the gas to be separated, the separation functional layer 1 can separate H 2 from the mixed gas by preferentially allowing H 2 to permeate.
分離機能層1は、Si、O、及びCを含み、かつ、上述のとおり、XPSによる第1主面1aについてのC1sスペクトルによるCの化学結合状態の解析において、C-H、C-O、C=O、及びCOOの結合に由来するピーク面積の合計に対するC-Hの結合に由来するピーク面積の割合が92area%以下であるとの構成を有する。以下、「XPSによる第1主面1aについてのC1sスペクトルによるCの化学結合状態の解析において、C-H、C-O、C=O、及びCOOの結合に由来するピーク面積の合計に対するC-Hの結合に由来するピーク面積の割合」を、「分離機能層1の第1主面1aにおけるC-H割合」あるいは単に「C-H割合」と記載する。このような特定の構成、すなわち特定のC-H割合を有する第1主面1aを備えることにより、分離機能層1は、改善された分離性能を実現することができる。より高い分離性能を実現するために、分離機能層1の第1主面1aにおけるC-H割合は、90area%以下であることが好ましい。 The separation functional layer 1 contains Si, O, and C, and as described above, in an analysis of the chemical bonding state of C by XPS C1s spectrum of the first main surface 1a, the ratio of the peak area attributable to C-H bonds to the total peak area attributable to C-H, C-O, C=O, and COO bonds is 92 area% or less. Hereinafter, "the ratio of the peak area attributable to C-H bonds to the total peak area attributable to C-H, C-O, C=O, and COO bonds in an analysis of the chemical bonding state of C by XPS C1s spectrum of the first main surface 1a" will be referred to as "C-H ratio on the first main surface 1a of the separation functional layer 1" or simply "C-H ratio." By having this specific configuration, i.e., a first main surface 1a with a specific C-H ratio, the separation functional layer 1 can achieve improved separation performance. To achieve even higher separation performance, the C-H ratio on the first main surface 1a of the separation functional layer 1 is preferably 90 area% or less.
分離機能層1の第1主面1aにおけるC-H割合の下限値は、特には限定されないが、C-H割合は、例えば50area%以上であり、60area%以上であってもよく、70area%以上であってもよく、75area%以上であってもよい。 The lower limit of the C-H ratio on the first main surface 1a of the separation functional layer 1 is not particularly limited, but the C-H ratio is, for example, 50 area% or more, or may be 60 area% or more, 70 area% or more, or 75 area% or more.
XPSによる分離機能層1の第1主面1aについてのC1sスペクトルによるCの化学結合状態の解析において、C-H、C-O、C=O、及びCOOの結合に由来するピーク面積の合計に対するC-Oの結合に由来するピーク面積の割合は、5area%以上であることが好ましい。以下、「XPSによる第1主面1aについてのC1sスペクトルによるCの化学結合状態の解析において、C-H、C-O、C=O、及びCOOの結合に由来するピーク面積の合計に対するC-Oの結合に由来するピーク面積の割合」を、「分離機能層1の第1主面1aにおけるC-O割合」あるいは単に「C-O割合」と記載する。分離機能層1の第1主面1aが上記のようなC-O割合を満たすことにより、分離機能層1は、例えば、分子ふるいに適切なサイズに微小化された細孔をより有しやすくなるので、より高い分離性能を実現することができる。より高い分離性能を実現するために、分離機能層1の第1主面1aにおけるC-O割合は、6area%以上であることがより好ましい。 In analyzing the chemical bonding state of C by XPS C1s spectroscopy of the first main surface 1a of the separation functional layer 1, the ratio of the peak area attributable to C-O bonds to the total peak area attributable to C-H, C-O, C=O, and COO bonds is preferably 5 area% or more. Hereinafter, "the ratio of the peak area attributable to C-O bonds to the total peak area attributable to C-H, C-O, C=O, and COO bonds in analyzing the chemical bonding state of C by XPS C1s spectroscopy of the first main surface 1a" will be referred to as "C-O ratio on the first main surface 1a of the separation functional layer 1" or simply "C-O ratio." By having the first main surface 1a of the separation functional layer 1 satisfy the above-described C-O ratio, the separation functional layer 1 is more likely to have pores that are miniaturized to a size appropriate for molecular sieving, thereby achieving higher separation performance. To achieve higher separation performance, the C-O ratio on the first main surface 1a of the separation functional layer 1 is more preferably 6 area% or more.
分離機能層1の第1主面1aにおけるC-O割合の上限値は、特には限定されないが、C-O割合は、例えば40area%以下であり、30area%以下であってもよく、20area%以下であってもよい。 The upper limit of the C-O ratio on the first main surface 1a of the separation functional layer 1 is not particularly limited, but the C-O ratio is, for example, 40 area% or less, or may be 30 area% or less, or may be 20 area% or less.
分離機能層1の第1主面1aに、C=OおよびCOOからなる群より選択される少なくとも1つが存在していてもよい。XPSによる分離機能層1の第1主面1aについてのC1sスペクトルによるCの化学結合状態の解析において、C-H、C-O、C=O、及びCOOの結合に由来するピーク面積の合計に対するC=Oの結合に由来するピーク面積の割合及びCOOの結合に由来するピーク面積の割合からなる群より選択される少なくとも1つが、0.1area%以上であってもよく、1area%以上であってもよい。以下、「XPSによる第1主面1aについてのC1sスペクトルによるCの化学結合状態の解析において、C-H、C-O、C=O、及びCOOの結合に由来するピーク面積の合計に対するC=Oの結合に由来するピーク面積の割合」を、「分離機能層1の第1主面1aにおけるC=O割合」あるいは単に「C=O割合」と記載する。また、「XPSによる第1主面1aについてのC1sスペクトルによるCの化学結合状態の解析において、C-H、C-O、C=O、及びCOOの結合に由来するピーク面積の合計に対するCOOの結合に由来するピーク面積の割合」を、「分離機能層1の第1主面1aにおけるCOO割合」あるいは単に「COO割合」と記載する。分離機能層1の第1主面1aが上記のようなC=O割合及び/又はCOO割合を満たすことにより、分離機能層1は、例えば、分子ふるいに適切なサイズに微小化された細孔をより有しやすくなるので、より高い分離性能を実現することができる。 At least one selected from the group consisting of C=O and COO may be present on the first main surface 1a of the separation functional layer 1. In an XPS analysis of the chemical bonding state of C on the first main surface 1a of the separation functional layer 1 using a C1s spectrum, at least one selected from the group consisting of the ratio of the peak area derived from C=O bonds and the ratio of the peak area derived from COO bonds to the total peak area derived from C-H, C-O, C=O, and COO bonds may be 0.1 area% or more, or may be 1 area% or more. Hereinafter, "the ratio of the peak area derived from C=O bonds to the total peak area derived from C-H, C-O, C=O, and COO bonds in an XPS analysis of the chemical bonding state of C on the first main surface 1a using a C1s spectrum" will be referred to as "C=O ratio on the first main surface 1a of the separation functional layer 1" or simply "C=O ratio." Furthermore, "the ratio of the peak area attributable to COO bonds to the total peak area attributable to C-H, C-O, C=O, and COO bonds in an XPS C1s spectrum analysis of the chemical bonding state of C on the first main surface 1a" is referred to as "COO ratio on the first main surface 1a of the separation functional layer 1" or simply "COO ratio." When the first main surface 1a of the separation functional layer 1 satisfies the above-described C=O ratio and/or COO ratio, the separation functional layer 1 is more likely to have pores that are miniaturized to a size appropriate for molecular sieving, for example, thereby achieving higher separation performance.
分離機能層1の第1主面1aに、C=Oが存在していてもよい。分離機能層1の第1主面1aにおけるC=O割合が、0.1area%以上であってもよく、1area%以上であってもよい。 C=O may be present on the first major surface 1a of the separation functional layer 1. The C=O ratio on the first major surface 1a of the separation functional layer 1 may be 0.1 area% or more, or may be 1 area% or more.
分離機能層1の第1主面1aにおけるC=O割合の上限値は、特には限定されないが、C=O割合は、例えば20area%以下であり、15area%以下であってもよく、10area%以下であってもよい。また、分離機能層1の第1主面1aにおけるCOO割合の上限値は、特には限定されないが、COO割合は、例えば20area%以下であり、15area%以下であってもよく、10area%以下であってもよく、5area%以下であってもよい。 The upper limit of the C=O ratio on the first main surface 1a of the separation functional layer 1 is not particularly limited, but the C=O ratio may be, for example, 20 area% or less, or may be 15 area% or less, or may be 10 area% or less. Furthermore, the upper limit of the COO ratio on the first main surface 1a of the separation functional layer 1 is not particularly limited, but the COO ratio may be, for example, 20 area% or less, or may be 15 area% or less, or may be 10 area% or less, or may be 5 area% or less.
分離機能層1は、XPSによる第1主面1aについてのSi2pスペクトルによるSiの化学結合状態の解析において、Si(-O)2、Si(-O)3、及びSi(-O)4の結合に由来するピーク面積の合計に対するSi(-O)4の結合に由来するピーク面積の割合が3area%以上であることが好ましく、5area%以上であることがより好ましく、10area%以上であることがさらに好ましい。以下、「XPSによる第1主面1aについてのSi2pスペクトルによるSiの化学結合状態の解析において、Si(-O)2、Si(-O)3、及びSi(-O)4の結合に由来するピーク面積の合計に対するSi(-O)4の結合に由来するピーク面積の割合」を、「分離機能層1の第1主面1aにおけるSi(-O)4割合」あるいは単に「Si(-O)4割合」と記載する。分離機能層1の第1主面1aが上記のようなSi(-O)4割合を満たすことにより、分離機能層1は、例えば、分子ふるいに適切なサイズに微小化された細孔をより有しやすくなるので、より高い分離性能を実現することができる。 In the separation functional layer 1, in an analysis of the chemical bonding state of Si by XPS using a Si2p spectrum on the first main surface 1a, the ratio of the peak area derived from the Si(-O) 4 bond to the total peak area derived from the Si(-O) 2 , Si(-O) 3 , and Si(-O) 4 bonds is preferably 3 area% or more, more preferably 5 area% or more, and even more preferably 10 area% or more. Hereinafter, "the ratio of the peak area derived from the Si(-O)4 bond to the total peak area derived from the Si(-O) 2 , Si(-O) 3 , and Si(-O) 4 bonds in an analysis of the chemical bonding state of Si by XPS using a Si2p spectrum on the first main surface 1a " will be referred to as "Si(-O) 4 ratio on the first main surface 1a of the separation functional layer 1" or simply "Si(-O) 4 ratio." When the first main surface 1a of the separation function layer 1 satisfies the above-described Si(—O) 4 ratio, the separation function layer 1 is more likely to have pores that are miniaturized to a size appropriate for a molecular sieve, for example, thereby achieving higher separation performance.
分離機能層1の第1主面1aにおけるSi(-O)4割合の上限値は、特には限定されないが、Si(-O)4割合は、例えば90area%以下であり、80area%以下であってもよい。 The upper limit of the Si(—O) 4 ratio in the first main surface 1a of the separation functional layer 1 is not particularly limited, but the Si(—O) 4 ratio is, for example, 90 area % or less, and may be 80 area % or less.
ここで、XPSによる分離機能層1のSiの化学結合状態の解析では、X線源としてモノクロAlKα線を用いるXPS分析によって取得されたSi2pスペクトルに対し、波形解析を行うことによってSiの化学結合状態が解析される。この際、C1sスペクトルのC-H結合由来のピークを、284.6eVに帯電補正する。 In analyzing the chemical bonding state of Si in the separation functional layer 1 using XPS, the chemical bonding state of Si is analyzed by performing waveform analysis on the Si2p spectrum obtained by XPS analysis using monochrome AlKα radiation as the X-ray source. At this time, the peak derived from the C-H bond in the C1s spectrum is charge corrected to 284.6 eV.
分離機能層1は、XPSによる第1主面1aについてのSi2pスペクトルによるSiの化学結合状態の解析において、Si(-O)2、Si(-O)3、及びSi(-O)4の結合に由来するピーク面積の合計に対するSi(-O)3の結合に由来するピーク面積の割合が15area%以上であることが好ましく、20area%以上であることがより好ましい。以下、「XPSによる第1主面1aについてのSi2pスペクトルによるSiの化学結合状態の解析において、Si(-O)2、Si(-O)3、及びSi(-O)4の結合に由来するピーク面積の合計に対するSi(-O)3の結合に由来するピーク面積の割合」を、「分離機能層1の第1主面1aにおけるSi(-O)3割合」あるいは単に「Si(-O)3割合」と記載する。分離機能層1の第1主面1aが上記のようなSi(-O)3割合を満たすことにより、分離機能層1は、例えば、分子ふるいに適切なサイズに微小化された細孔をより有しやすくなるので、より高い分離性能を実現することができる。 In the separation functional layer 1, in an analysis of the chemical bonding state of Si by XPS using a Si2p spectrum on the first main surface 1a, the ratio of the peak area derived from the Si(-O) 3 bond to the total peak area derived from Si(-O) 2 , Si(-O) 3 , and Si(-O) 4 bonds is preferably 15 area% or more, and more preferably 20 area% or more. Hereinafter, "the ratio of the peak area derived from the Si(-O)3 bond to the total peak area derived from the Si(-O) 2 , Si(-O) 3 , and Si(-O) 4 bonds in an analysis of the chemical bonding state of Si by XPS using a Si2p spectrum on the first main surface 1a" will be referred to as "Si(-O) 3 ratio in the first main surface 1a of the separation functional layer 1 " or simply "Si(-O) 3 ratio." When the first main surface 1a of the separation function layer 1 satisfies the above-described Si(—O) 3 ratio, the separation function layer 1 is more likely to have pores that are miniaturized to a size appropriate for a molecular sieve, for example, thereby achieving higher separation performance.
分離機能層1の第1主面1aにおけるSi(-O)3割合の上限値は、特には限定されないが、Si(-O)3割合は、例えば90area%以下であり、85area%以下であってもよい。 The upper limit of the Si(—O) 3 ratio in the first main surface 1a of the separation functional layer 1 is not particularly limited, but the Si(—O) 3 ratio is, for example, 90 area % or less, and may be 85 area % or less.
分離機能層1は、XPSによる第1主面1aについてのSi2pスペクトルによるSiの化学結合状態の解析において、Si(-O)2、Si(-O)3、及びSi(-O)4の結合に由来するピーク面積の合計に対するSi(-O)2の結合に由来するピーク面積の割合が80area%以下であることが好ましく、70area%以下であることがより好ましく、50area%以下であることがさらに好ましい。以下、「XPSによる第1主面1aについてのSi2pスペクトルによるSiの化学結合状態の解析において、Si(-O)2、Si(-O)3、及びSi(-O)4の結合に由来するピーク面積の合計に対するSi(-O)2の結合に由来するピーク面積の割合」を、「分離機能層1の第1主面1aにおけるSi(-O)2割合」あるいは単に「Si(-O)2割合」と記載する。分離機能層1の第1主面1aが上記のようなSi(-O)2割合を満たすことにより、分離機能層1は、例えば、分子ふるいに適切なサイズに微小化された細孔をより有しやすくなるので、より高い分離性能を実現することができる。 In the separation functional layer 1, in an analysis of the chemical bonding state of Si by XPS using a Si2p spectrum on the first main surface 1a, the ratio of the peak area derived from the Si(-O) 2 bond to the total peak area derived from the Si(-O) 2 , Si(-O) 3 , and Si(-O) 4 bonds is preferably 80 area% or less, more preferably 70 area% or less, and even more preferably 50 area% or less. Hereinafter, "the ratio of the peak area derived from the Si(-O)2 bond to the total peak area derived from the Si(-O) 2 , Si(-O) 3 , and Si(-O) 4 bonds in an analysis of the chemical bonding state of Si by XPS using a Si2p spectrum on the first main surface 1a " will be referred to as "Si(-O) 2 ratio on the first main surface 1a of the separation functional layer 1" or simply "Si(-O) 2 ratio." When the first main surface 1a of the separation functional layer 1 satisfies the above-described Si(—O) 2 ratio, the separation functional layer 1 is more likely to have pores that are miniaturized to a size appropriate for a molecular sieve, for example, thereby achieving higher separation performance.
分離機能層1の第1主面1aにおけるSi(-O)2割合の下限値は、特には限定されないが、Si(-O)2割合は、例えば1area%以上である。 The lower limit of the Si(—O) 2 ratio in the first main surface 1a of the separation functional layer 1 is not particularly limited, but the Si(—O) 2 ratio is, for example, 1 area % or more.
分離機能層1は、XPSによる第1主面1aについてのSi2pスペクトルによるSiの化学結合状態の解析において、Si(-O)2及びSi(-O)3の結合に由来するピーク面積の合計に対するSi(-O)4の結合に由来するピーク面積の比率が0.1以上であることが好ましく、0.15以上であることがより好ましい。以下、「XPSによる第1主面1aについてのSi2pスペクトルによるSiの化学結合状態の解析において、Si(-O)2及びSi(-O)3の結合に由来するピーク面積の合計に対するSi(-O)4の結合に由来するピーク面積の比率」を、「分離機能層1の第1主面1aにおけるSi(-O)4比率」あるいは単に「Si(-O)4比率」と記載する。分離機能層1の第1主面1aが上記のようなSi(-O)4比率を満たすことにより、分離機能層1は、例えば、分子ふるいに適切なサイズに微小化された細孔をより有しやすくなるので、より高い分離性能を実現することができる。 In the separation functional layer 1, in an analysis of the chemical bonding state of Si by XPS using the Si2p spectrum of the first main surface 1a, the ratio of the peak area attributable to the Si(-O) 4 bond to the sum of the peak areas attributable to the Si(-O) 2 and Si(-O) 3 bonds is preferably 0.1 or greater, and more preferably 0.15 or greater. Hereinafter, the "ratio of the peak area attributable to the Si(-O)4 bond to the sum of the peak areas attributable to the Si(-O) 2 and Si(-O) 3 bonds in an analysis of the chemical bonding state of Si by XPS using the Si2p spectrum of the first main surface 1a" will be referred to as the "Si(-O) 4 ratio at the first main surface 1a of the separation functional layer 1" or simply as the "Si(-O) 4 ratio." When the first main surface 1a of the separation functional layer 1 satisfies the above-described Si(-O) 4 ratio, the separation functional layer 1 is more likely to have pores that are miniaturized to a size appropriate for, for example, a molecular sieve, thereby achieving higher separation performance.
分離機能層1の第1主面1aにおけるSi(-O)4比率の上限値は、特には限定されないが、Si(-O)4比率は、例えば30以下であり、5以下であってもよく、4以下であってもよい。 The upper limit of the Si(—O) 4 ratio in the first main surface 1a of the separation functional layer 1 is not particularly limited, but the Si(—O) 4 ratio is, for example, 30 or less, or may be 5 or less, or may be 4 or less.
分離機能層1の第1主面1aにおけるSi(-O)2割合の上限値は、特には限定されないが、Si(-O)2割合は、例えば5以下であり、4以下であってもよい。 The upper limit of the Si(—O) 2 ratio in the first main surface 1a of the separation functional layer 1 is not particularly limited, but the Si(—O) 2 ratio is, for example, 5 or less, and may be 4 or less.
分離機能層1の第1主面1aにおいて、Si原子の数に対するO原子の数の比であるO/Siは、1.2以上であることが好ましく、1.4以上であることがより好ましく、1.7以上であることがさらに好ましい。分離機能層1の第1主面1aにおけるO/Siの値が上記範囲を満たすことにより、分離機能層1は、より高い分離性能を実現することができる。 On the first main surface 1a of the separation functional layer 1, the ratio of the number of O atoms to the number of Si atoms, O/Si, is preferably 1.2 or greater, more preferably 1.4 or greater, and even more preferably 1.7 or greater. By ensuring that the O/Si value on the first main surface 1a of the separation functional layer 1 satisfies the above range, the separation functional layer 1 can achieve even higher separation performance.
分離機能層1の第1主面1aにおけるO/Siの値は、XPSによる分離機能層1の第1主面1aについての組成分析によって求めることができる。 The O/Si value on the first main surface 1a of the separation functional layer 1 can be determined by composition analysis of the first main surface 1a of the separation functional layer 1 using XPS.
分離機能層1の第1主面1aにおけるO/Siの上限値は、特には限定されないが、O/Siは、例えば3.0以下であり、2.5以下であってもよい。 The upper limit of the O/Si ratio on the first main surface 1a of the separation functional layer 1 is not particularly limited, but the O/Si ratio is, for example, 3.0 or less, and may be 2.5 or less.
分離機能層1の第1主面1aにおいて、C原子、N原子、O原子、及びSi原子の数の合計に対するC原子の数の割合は、17at.%以上であることが好ましく、20at.%以上であることがより好ましい。分離機能層1の第1主面1aにおけるC原子の数の割合が上記範囲を満たすことにより、分離機能層1は、より高い分離性能を実現することができる。 On the first main surface 1a of the separation functional layer 1, the ratio of the number of C atoms to the total number of C atoms, N atoms, O atoms, and Si atoms is preferably 17 at. % or more, and more preferably 20 at. % or more. By ensuring that the ratio of the number of C atoms on the first main surface 1a of the separation functional layer 1 satisfies the above range, the separation functional layer 1 can achieve higher separation performance.
分離機能層1の第1主面1aにおけるC原子の数の割合の上限値は、特には限定されないが、例えば52at.%以下であり、50at.%以下であってもよい。 The upper limit of the proportion of the number of C atoms on the first main surface 1a of the separation functional layer 1 is not particularly limited, but may be, for example, 52 at. % or less, or 50 at. % or less.
分離機能層1の第1主面1aにおいて、C原子、N原子、O原子、及びSi原子の数の合計に対するO原子の数の割合は、54at.%以下であることが好ましい。分離機能層1の第1主面1aにおけるO原子の数の割合が上記範囲を満たすことにより、分離機能層1は、より高い分離性能を実現することができる。 In the first main surface 1a of the separation functional layer 1, the ratio of the number of O atoms to the total number of C atoms, N atoms, O atoms, and Si atoms is preferably 54 at. % or less. By ensuring that the ratio of the number of O atoms in the first main surface 1a of the separation functional layer 1 satisfies the above range, the separation functional layer 1 can achieve even higher separation performance.
分離機能層1の第1主面1aにおけるO原子の数の割合の下限値は、特には限定されないが、例えば25at.%以上であってもよいし、30at.%以上であってもよいし、35at.%以上であってもよい。 The lower limit of the proportion of O atoms on the first main surface 1a of the separation functional layer 1 is not particularly limited, but may be, for example, 25 at. % or more, 30 at. % or more, or 35 at. % or more.
分離機能層1は、上述のとおり、Si、O、及びCを含む材料によって構成されている。Si、O、及びCを含む材料は、例えば、Si、O、及びCを含む有機ケイ素化合物を含む。Si、O、及びCを含む有機ケイ素化合物は、例えば、アルキルケイ素アルコキシド等のアルコキシシランや、シロキサン結合(Si-O-Si)を含む化合物等が挙げられる。アルキルケイ素アルコキシドとしては、例えば、メチルトリエトキシシラン(MTES)、ジメチルジエトキシシラン等が挙げられる。 As described above, the separation functional layer 1 is composed of a material containing Si, O, and C. Materials containing Si, O, and C include, for example, organosilicon compounds containing Si, O, and C. Examples of organosilicon compounds containing Si, O, and C include alkoxysilanes such as alkylsilicon alkoxides, and compounds containing siloxane bonds (Si-O-Si). Examples of alkylsilicon alkoxides include methyltriethoxysilane (MTES) and dimethyldiethoxysilane.
分離機能層1は、シロキサン結合(Si-O-Si)を含む化合物を含むことが好ましい。 The separation functional layer 1 preferably contains a compound containing a siloxane bond (Si-O-Si).
分離機能層1の第1主面1aは、シロキサン結合、Si-C結合、及びC-O結合を有するオルガノシリカを含んでいてもよい。すなわち、分離機能層1の第1主面1aにおいて、上記のシロキサン結合を含む化合物は、例えば、シロキサン結合、Si-C結合、及びC-O結合を有するオルガノシリカであってもよい。分離機能層1の第1主面1aに上記オルガノシリカが含まれることにより、分離機能層1の第1主面1aに、分子ふるいに適切なサイズに微小化された細孔が形成されやすくなる。これにより、分離機能層1は、より高い分離性能を有することができる。 The first main surface 1a of the separation functional layer 1 may contain organosilica having siloxane bonds, Si-C bonds, and C-O bonds. That is, on the first main surface 1a of the separation functional layer 1, the compound containing the siloxane bonds may be, for example, organosilica having siloxane bonds, Si-C bonds, and C-O bonds. By including the organosilica on the first main surface 1a of the separation functional layer 1, it becomes easier to form pores on the first main surface 1a of the separation functional layer 1 that are miniaturized to a size appropriate for a molecular sieve. This allows the separation functional layer 1 to have higher separation performance.
上記オルガノシリカは、C=O結合及び/又はCOO結合をさらに有していてもよい。このようなオルガノシリカが含まれることにより、分離機能層1の第1主面1aに、分子ふるいに適切なサイズに微小化された細孔がより形成されやすくなる。これにより、分離機能層1は、より高い分離性能を有することができる。 The organosilica may further have a C=O bond and/or a COO bond. The inclusion of such organosilica makes it easier for pores that have been miniaturized to a size appropriate for molecular sieving to be formed on the first main surface 1a of the separation function layer 1. This allows the separation function layer 1 to have higher separation performance.
上記オルガノシリカは、例えば環状構造を有するオルガノシリカを含んでいてもよい。 The organosilica may include, for example, organosilica having a cyclic structure.
図2は、分離機能層1の第1主面1aに含まれうる、上記環状構造を有するオルガノシリカの一例を示す構造図である。ただし、分離機能層1の第1主面1aに含まれるオルガノシリカの構造は、図2に示される構造に限定されない。 FIG. 2 is a structural diagram showing an example of organosilica having the above-mentioned cyclic structure that can be contained on the first main surface 1a of the separation functional layer 1. However, the structure of the organosilica contained on the first main surface 1a of the separation functional layer 1 is not limited to the structure shown in FIG. 2.
分離機能層1において第1主面1aを除く部分、あるいは第1主面1aと第1主面1aの近傍領域とを除く部分において、分離機能層1は、シロキサン結合を含む化合物としてシリコーン樹脂を含んでいてもよい。なお、本明細書においては、分離機能層1において第1主面1aを除く部分、あるいは第1主面1aと第1主面1aの近傍領域とを除く部分を、分離機能層1の内部という。シリコーン樹脂は、耐熱性、耐水性、耐酸性、柔軟性等の様々な性質に優れており、分離機能層1にそれらの優れた性質を付与することが可能となる。分離機能層1に含まれるシリコーン樹脂は、特には限定されず、種々のシリコーン樹脂を使用することができる。シリコーン樹脂は、反応のタイプも特には限定されず、付加反応型シリコーン樹脂であってもよいし、縮合反応型シリコーン樹脂であってもよい。また、シリコーン樹脂に含まれる有機置換基も、特には限定されず、分離膜10の用途に応じて適切な性質を発現できるような置換基を有するシリコーン樹脂を適宜選択することができる。 The separation functional layer 1 may contain a silicone resin as a compound containing a siloxane bond in a portion of the separation functional layer 1 excluding the first principal surface 1a or in a portion excluding the first principal surface 1a and the region adjacent to the first principal surface 1a. In this specification, the portion of the separation functional layer 1 excluding the first principal surface 1a or the portion excluding the first principal surface 1a and the region adjacent to the first principal surface 1a is referred to as the interior of the separation functional layer 1. Silicone resins have excellent properties such as heat resistance, water resistance, acid resistance, and flexibility, and can impart these excellent properties to the separation functional layer 1. The silicone resin contained in the separation functional layer 1 is not particularly limited, and various silicone resins can be used. The reaction type of the silicone resin is also not particularly limited, and it may be an addition reaction type silicone resin or a condensation reaction type silicone resin. The organic substituents contained in the silicone resin are also not particularly limited, and a silicone resin having a substituent that can exhibit appropriate properties depending on the application of the separation membrane 10 can be appropriately selected.
分離機能層1の第1主面1aは、例えば、分離機能層1の内部を構成する第1化合物がプラズマ処理によって改質された第2化合物を含む。すなわち、第1化合物を含む分離機能層1の前駆体層において、分離機能層1の第1主面1aに相当する前駆体層の主面をプラズマ処理することによって、前駆体層の上記主面に含まれる第1化合物が改質され、それによって形成された第2化合物によって分離機能層1の第1主面1aの材料が構成されていてもよい。ここでのプラズマ処理は、例えば、低インダクタンスアンテナを用いた誘導結合プラズマによる処理である。なお、低インダクタンスアンテナを用いた誘導結合プラズマによる処理についての詳細は、後述する。 The first main surface 1a of the separation functional layer 1 contains, for example, a second compound obtained by modifying a first compound that constitutes the interior of the separation functional layer 1 through plasma treatment. That is, in a precursor layer of the separation functional layer 1 that contains the first compound, the first compound contained in the precursor layer's main surface may be modified by plasma treating the main surface of the precursor layer that corresponds to the first main surface 1a of the separation functional layer 1, and the material of the first main surface 1a of the separation functional layer 1 may be made up of the second compound formed thereby. The plasma treatment here is, for example, treatment using inductively coupled plasma using a low-inductance antenna. Details of treatment using inductively coupled plasma using a low-inductance antenna will be described later.
第1化合物は、シロキサン結合を含んでいてもよく、例えばシリコーン樹脂であってもよい。第1化合物がシリコーン樹脂である場合、第2化合物は、シリコーン樹脂がプラズマ処理によって改質されることによって形成される化合物である。 The first compound may contain a siloxane bond and may be, for example, a silicone resin. When the first compound is a silicone resin, the second compound is a compound formed by modifying the silicone resin through plasma treatment.
分離機能層1の厚さは、特に限定されず、例えば200μm以下であり、100μm以下、50μm以下、10μm以下、4μm以下、2μm以下、さらには1.5μm以下であってもよい。分離機能層1の厚さは、0.05μm以上であってもよく、0.1μm以上であってもよい。 The thickness of the separation functional layer 1 is not particularly limited and may be, for example, 200 μm or less, 100 μm or less, 50 μm or less, 10 μm or less, 4 μm or less, 2 μm or less, or even 1.5 μm or less. The thickness of the separation functional layer 1 may be 0.05 μm or more, or 0.1 μm or more.
(多孔性支持体)
多孔性支持体2は、分離機能層1を支持する部材である。多孔性支持体2としては、例えば、不織布;多孔質ポリテトラフルオロエチレン;芳香族ポリアミド繊維;多孔質金属;焼結金属;多孔質セラミック;多孔質ポリエステル;多孔質ナイロン;活性化炭素繊維;ラテックス;シリコーン;シリコーンゴム;ポリフッ化ビニル、ポリフッ化ビニリデン(PVDF)、ポリウレタン、ポリプロピレン、ポリエチレン、ポリカーボネート、ポリスルホン、ポリエーテルエーテルケトン、ポリアクリロニトリル、ポリイミド、ポリオレフィン及びポリフェニレンオキシドからなる群より選ばれる少なくとも1つを含む透過性(多孔質)ポリマー;連続気泡又は独立気泡を有する金属発泡体;連続気泡又は独立気泡を有するポリマー発泡体;シリカ;多孔質ガラス;メッシュスクリーンなどが挙げられる。多孔性支持体2は、これらのうちの2種以上を組み合わせたものであってもよい。
(Porous support)
The porous support 2 is a member that supports the separation function layer 1. Examples of the porous support 2 include nonwoven fabrics, porous polytetrafluoroethylene, aromatic polyamide fibers, porous metals, sintered metals, porous ceramics, porous polyesters, porous nylons, activated carbon fibers, latex, silicone, silicone rubber, polyvinyl fluoride, polyvinylidene fluoride (PVDF), polyurethane, polypropylene, polyethylene, polycarbonate, polysulfone, polyether ether ketone, polyacrylonitrile, polyimide, polyolefins, and polyphenylene oxides. Permeable (porous) polymers containing at least one selected from the group consisting of metal foams having open or closed cells, polymer foams having open or closed cells, silica, porous glass, and mesh screens. The porous support 2 may be a combination of two or more of these.
多孔性支持体2は、例えば5~100nmの平均表面孔径を有する。多孔性支持体2の厚さは、特に限定されず、例えば10μm以上であり、好ましくは20μm以上であり、より好ましくは50μm以上である。多孔性支持体2の厚さは、例えば300μm以下であり、好ましくは200μm以下であり、より好ましくは150μm以下である。 The porous support 2 has an average surface pore diameter of, for example, 5 to 100 nm. The thickness of the porous support 2 is not particularly limited, and is, for example, 10 μm or more, preferably 20 μm or more, and more preferably 50 μm or more. The thickness of the porous support 2 is, for example, 300 μm or less, preferably 200 μm or less, and more preferably 150 μm or less.
図3は、多孔性支持体の変形例を示す断面図である。図3に示すように、変形例の多孔性支持体2Aは、例えば、本体部3及び微多孔層4を備えた積層体であってもよい。 Figure 3 is a cross-sectional view showing a modified porous support body. As shown in Figure 3, the modified porous support body 2A may be, for example, a laminate including a main body portion 3 and a microporous layer 4.
本体部3は、例えば、織布、不織布などの繊維構造体であり、典型的には不織布である。繊維構造体に含まれる繊維としては、例えば、木材パルプ、綿、麻(例えばマニラ麻)などの天然繊維;ポリエステル繊維、レーヨン、ビニロン、アセテート繊維、ポリビニルアルコール(PVA)繊維、ポリアミド繊維、ポリオレフィン繊維、ポリウレタン繊維などの化学繊維(合成繊維)が挙げられる。本体部3は、例えば、ポリエステル繊維で構成された不織布である。本体部3は、例えば1μm~50μmの平均孔径を有する。 The main body 3 is, for example, a fiber structure such as a woven fabric or a nonwoven fabric, and is typically a nonwoven fabric. Examples of fibers contained in the fiber structure include natural fibers such as wood pulp, cotton, and hemp (e.g., Manila hemp); and chemical fibers (synthetic fibers) such as polyester fiber, rayon, vinylon, acetate fiber, polyvinyl alcohol (PVA) fiber, polyamide fiber, polyolefin fiber, and polyurethane fiber. The main body 3 is, for example, a nonwoven fabric made of polyester fiber. The main body 3 has an average pore size of, for example, 1 μm to 50 μm.
微多孔層4の材料としては、例えば、ポリフッ化ビニリデン、ポリテトラフルオロエチレンなどのフッ素樹脂;ポリスルホン、ポリエーテルスルホンなどのポリアリールエーテルスルホン;ポリイミドなどが挙げられる。微多孔層4は、例えば0.01μm~0.4μmの平均孔径を有する。 Examples of materials for the microporous layer 4 include fluororesins such as polyvinylidene fluoride and polytetrafluoroethylene; polyarylethersulfones such as polysulfone and polyethersulfone; and polyimides. The microporous layer 4 has an average pore size of, for example, 0.01 μm to 0.4 μm.
多孔性支持体2及び多孔性支持体2Aの厚さは、特に限定されず、例えば10μm以上であり、50μm以上、さらには100μm以上であってもよい。多孔性支持体2及び多孔性支持体2Aの厚さは、例えば300μm以下であり、200μm以下であってもよい。 The thickness of the porous support 2 and the porous support 2A is not particularly limited and may be, for example, 10 μm or more, 50 μm or more, or even 100 μm or more. The thickness of the porous support 2 and the porous support 2A may be, for example, 300 μm or less, or 200 μm or less.
(分離膜の形状)
本実施形態において、分離膜10は、典型的には平膜である。ただし、分離膜10は、平膜以外の形状であってもよく、例えば、中空糸膜であってもよい。一例として、中空糸膜としての分離膜10は、分離機能層1及び多孔性支持体2(又は多孔性支持体2A)を備えている。
(Shape of separation membrane)
In this embodiment, the separation membrane 10 is typically a flat membrane. However, the separation membrane 10 may have a shape other than a flat membrane, for example, a hollow fiber membrane. As an example, the separation membrane 10 as a hollow fiber membrane includes a separation function layer 1 and a porous support 2 (or a porous support 2A).
(分離膜の製造方法)
分離膜10は、例えば、次の方法によって作製することができる。
(Method for producing separation membrane)
The separation membrane 10 can be produced, for example, by the following method.
まず、分離機能層1の前駆体(前駆体層)を作製する。例えば、Si、O、及びCを含む材料を含む塗布液を準備し、その塗布液を基材の上に塗布して塗布膜を作製し、塗布膜を乾燥させる。この塗布膜に対し、必要に応じて例えば加熱処理を実施する。塗布液を構成する材料は、作製目的の分離機能層1の材料を考慮して適宜選択すればよいため、特には限定されない。例えば、シリコーン樹脂を含む分離機能層1を作製する場合は、例えばポリオルガノシロキサンを含むシリコーン樹脂組成物と硬化触媒とを含む塗布液を用い、塗布膜を加熱処理して硬化させることによって、前駆体層を作製してもよい。なお、シリコーン樹脂組成物及び硬化触媒は、特に限定されず、適宜選択することができる。このようにして、前駆体層が作製される。分離機能層1が多孔性支持体2(又は多孔性支持体2A)によって支持される場合、基材として多孔性支持体2(又は多孔性支持体2A)が用いられてもよい。 First, a precursor (precursor layer) of the separation functional layer 1 is prepared. For example, a coating liquid containing a material including Si, O, and C is prepared, and the coating liquid is applied to a substrate to form a coating film, which is then dried. If necessary, this coating film is subjected to, for example, a heat treatment. The materials constituting the coating liquid are not particularly limited; they can be selected appropriately taking into account the material of the separation functional layer 1 to be prepared. For example, when preparing a separation functional layer 1 containing a silicone resin, the precursor layer can be prepared by using a coating liquid containing a silicone resin composition containing polyorganosiloxane and a curing catalyst, and then heat-treating and curing the coating film. The silicone resin composition and curing catalyst are not particularly limited and can be selected appropriately. In this manner, the precursor layer is prepared. When the separation functional layer 1 is supported by a porous support 2 (or porous support 2A), the porous support 2 (or porous support 2A) can be used as the substrate.
次に、前駆体層の表面に対し、プラズマ処理を施す。これにより、第1主面1aを有する分離機能層1を形成することができる。このプラズマ処理は、例えば、誘導結合プラズマ(ICP)による処理である。用いられるICPは、低インダクタンスアンテナを用いたICPであることが好ましい。すなわち、前駆体層の表面に対して実施されるプラズマ処理は、低インダクタンスアンテナに対する高周波電力の印加によって発生するICPによる処理であることが好ましい。プラズマ処理の方式は特に限定されないが、ロールトゥロール方式で前駆体層を搬送しながらプラズマ処理してもよく、またバッチ方式でプラズマ処理してもよい。 Next, the surface of the precursor layer is subjected to plasma treatment. This allows the formation of a separation functional layer 1 having a first main surface 1a. This plasma treatment is, for example, treatment using inductively coupled plasma (ICP). The ICP used is preferably an ICP that uses a low-inductance antenna. In other words, the plasma treatment performed on the surface of the precursor layer is preferably treatment using ICP that is generated by applying high-frequency power to a low-inductance antenna. The method of plasma treatment is not particularly limited, but the plasma treatment may be performed while the precursor layer is being transported using a roll-to-roll method, or may be performed using a batch method.
ここで、低インダクタンスアンテナとは、7.5μH以下の低いインダクタンスを有し、かつ高周波電力の印加によって誘導結合プラズマを発生できる、アンテナを意味する。また、高周波電力とは、プラズマ放電の励起用として用いられる高周波電源(RF電源)による電力である。 Here, a low-inductance antenna refers to an antenna that has a low inductance of 7.5 μH or less and is capable of generating inductively coupled plasma by applying high-frequency power. Furthermore, high-frequency power refers to power from a high-frequency power source (RF power source) used to excite plasma discharge.
低インダクタンスアンテナを用いたICPによるプラズマ処理によれば、分離機能層1の第1主面1aの特定の構成、すなわち上述のC-H割合が92area%以下である構成を有する第1主面1aを、容易に形成することができる。また、低インダクタンスアンテナを用いたICPによるプラズマ処理によれば、第1主面1aについて上述した他の構成(例えば、C-O割合の範囲、O/Siの値等)についても実現することが可能である。例えば、前駆体層がシリコーン樹脂のようなシロキサン結合を有する化合物を含む場合、低インダクタンスアンテナを用いたICPによるプラズマ処理によれば、一般的なプラズマ処理と比較すると、Si-C結合は多くは切断されずにC-H結合で結合が切断され、さらにC-O結合が生成されやすい。このような化合物の改質により、分離機能層1の第1主面1aに、過度のダメージを与えることを抑えつつ、上述したようなシロキサン結合、Si-C結合、及びC-O結合を含むオルガノシリカを形成することができる。なお、一般的なプラズマ処理とは、容量結合プラズマ(CCP)による処理を意味する。 Inductively coupled plasma treatment using a low-inductance antenna can easily form the specific configuration of the first main surface 1a of the separation functional layer 1, i.e., a first main surface 1a having the above-mentioned configuration in which the C-H ratio is 92 area% or less. Furthermore, ICP plasma treatment using a low-inductance antenna can also achieve the other configurations described above for the first main surface 1a (e.g., C-O ratio range, O/Si value, etc.). For example, if the precursor layer contains a compound with siloxane bonds such as silicone resin, ICP plasma treatment using a low-inductance antenna, compared to general plasma treatment, tends to cleave C-H bonds without cleaving many Si-C bonds, and more likely to generate C-O bonds. By modifying such compounds, organosilica containing siloxane bonds, Si-C bonds, and C-O bonds can be formed as described above while minimizing excessive damage to the first main surface 1a of the separation functional layer 1. Note that general plasma treatment refers to treatment using capacitively coupled plasma (CCP).
プラズマ処理中に印加される高周波電力の周波数は、好ましくは1MHz以上、より好ましくは5MHz以上、さらに好ましくは10MHz以上であり、また、好ましくは100MHz以下、より好ましくは80MHz以下、さらに好ましくは60MHz以下である。周波数が上記下限値以上である場合、プラズマ電流密度を高めつつ、プラズマ放電を安定化できる。周波数が上記上限値以下である場合、アンテナ電位を抑制できるので、プラズマによる分離機能膜1へのダメージを抑制できる。また、高周波電力は、好ましくは0.1kW以上、より好ましくは0.3kW以上、さらに好ましくは1.0kW以上であり、また、好ましくは10kW以下、より好ましくは8kW以下、さらに好ましくは6kW以下である。高周波電力が上記下限値以上である場合、ICPによるプラズマ処理において、高密度のプラズマ環境をプラズマ処理室内に形成できる。高周波電力が上記上限値以下である場合、プラズマによる分離機能層1への過度のダメージを抑制できる。 The frequency of the high-frequency power applied during plasma treatment is preferably 1 MHz or higher, more preferably 5 MHz or higher, and even more preferably 10 MHz or higher, and preferably 100 MHz or lower, more preferably 80 MHz or lower, and even more preferably 60 MHz or lower. When the frequency is above the lower limit, the plasma current density can be increased while stabilizing the plasma discharge. When the frequency is below the upper limit, the antenna potential can be suppressed, thereby suppressing damage to the separation functional membrane 1 caused by the plasma. The high-frequency power is preferably 0.1 kW or higher, more preferably 0.3 kW or higher, and even more preferably 1.0 kW or higher, and is preferably 10 kW or lower, more preferably 8 kW or lower, and even more preferably 6 kW or lower. When the high-frequency power is above the lower limit, a high-density plasma environment can be formed in the plasma treatment chamber during plasma treatment using ICP. When the high-frequency power is below the upper limit, excessive damage to the separation functional layer 1 caused by the plasma can be suppressed.
分離機能層1の第1主面1aの形成のためのプラズマ処理のガスには、例えば、アルゴン、酸素、及び窒素からなる群より選択される少なくとも1つが用いられる。プラズマ処理のガスは、アルゴンを含むことが好ましく、さらに酸素を含むこと(すなわち、アルゴンと酸素とを含む混合ガス)がより好ましい。これにより、前駆体層に含まれる化合物を効果的に改質して、より高い分離性能を有する分離機能層1を形成することができる。 The plasma treatment gas used to form the first main surface 1a of the separation functional layer 1 is, for example, at least one selected from the group consisting of argon, oxygen, and nitrogen. The plasma treatment gas preferably contains argon, and more preferably also contains oxygen (i.e., a mixed gas containing argon and oxygen). This effectively modifies the compounds contained in the precursor layer, allowing the formation of a separation functional layer 1 with higher separation performance.
分離機能層1の第1主面1aの形成のためのプラズマ処理において、プラズマ処理室の圧力は、好ましくは0.05Pa以上、より好ましくは0.1Pa以上、さらに好ましくは0.2Pa以上であり、また、好ましくは10Pa以下、より好ましくは7Pa以下、さらに好ましくは5Pa以下、特に好ましくは3Pa以下であり、より一層好ましくは1Pa以下である。圧力が上記下限値以上である場合、プラズマ処理において、分離機能層1の第1主面1a形成のための表面改質処理に十分な密度のプラズマ環境をプラズマ処理室内に形成できる。圧力が上記上限値以下である場合、プラズマ処理において、過度に高密度のプラズマに起因する分離機能層1の第1主面1aへの熱ダメージを抑制でき、また、分離機能層1の熱変形を抑制できる。圧力は、例えば、プラズマ処理室内へのガスの供給量によって調整できる。 In the plasma treatment for forming the first main surface 1a of the separation functional layer 1, the pressure in the plasma treatment chamber is preferably 0.05 Pa or more, more preferably 0.1 Pa or more, even more preferably 0.2 Pa or more, and preferably 10 Pa or less, more preferably 7 Pa or less, even more preferably 5 Pa or less, particularly preferably 3 Pa or less, and even more preferably 1 Pa or less. When the pressure is above the above lower limit, a plasma environment of sufficient density for surface modification treatment for forming the first main surface 1a of the separation functional layer 1 can be created in the plasma treatment chamber during the plasma treatment. When the pressure is below the above upper limit, thermal damage to the first main surface 1a of the separation functional layer 1 caused by excessively high-density plasma can be suppressed during the plasma treatment, and thermal deformation of the separation functional layer 1 can also be suppressed. The pressure can be adjusted, for example, by the amount of gas supplied to the plasma treatment chamber.
分離機能層1の第1主面1aの形成のためのプラズマ処理において、プラズマ処理の時間は、好ましくは5秒以上であり、より好ましくは10秒以上であり、さらに好ましくは30秒以上であり、特に好ましくは40秒以上であり、さらに好ましくは50秒以上であり、また、好ましくは200秒以下であり、より好ましくは150秒以下であり、さらに好ましくは120秒以下である。プラズマ処理の時間が上記下限値以上である場合、プラズマ処理による分離機能層1の第1主面1a形成のための十分な表面改質を生じさせることができる。プラズマ処理の時間が上記上限値以下である場合、プラズマ処理において、過度に高密度のプラズマに起因する分離機能層1の第1主面1aへの熱ダメージを抑制でき、また、分離機能層1の熱変形を抑制できる。 In the plasma treatment for forming the first main surface 1a of the separation functional layer 1, the plasma treatment time is preferably 5 seconds or more, more preferably 10 seconds or more, even more preferably 30 seconds or more, particularly preferably 40 seconds or more, even more preferably 50 seconds or more, and preferably 200 seconds or less, more preferably 150 seconds or less, and even more preferably 120 seconds or less. When the plasma treatment time is equal to or greater than the above lower limit, sufficient surface modification for forming the first main surface 1a of the separation functional layer 1 by plasma treatment can be achieved. When the plasma treatment time is equal to or less than the above upper limit, thermal damage to the first main surface 1a of the separation functional layer 1 caused by excessively high-density plasma can be suppressed during the plasma treatment, and thermal deformation of the separation functional layer 1 can also be suppressed.
(分離膜の用途)
本実施形態の分離膜10は、分離対象流体を含む2種以上の流体を含む混合流体を、分離対象流体を含む第1流体と、第2流体とに分離する用途に適している。なお、流体は、液体であってもよいし、気体であってもよい。分離膜10が適用される分離方式は、特には限定されない。分離膜10は、逆浸透(RO)、ナノろ過(NF)、浸透気化(PV)、蒸気透過(VP)などの種々の分離方式で用いることができる。
(Uses of separation membranes)
The separation membrane 10 of this embodiment is suitable for separating a mixed fluid containing two or more fluids, including a fluid to be separated, into a first fluid containing the fluid to be separated and a second fluid. The fluid may be a liquid or a gas. The separation method to which the separation membrane 10 is applied is not particularly limited. The separation membrane 10 can be used in various separation methods, such as reverse osmosis (RO), nanofiltration (NF), pervaporation (PV), and vapor permeation (VP).
(分離膜を用いる分離方法)
分離膜10を用いる分離方法は、例えば、分離対象流体を含む2種以上の流体を含む混合流体を、分離膜10の一方の面(例えば、分離膜10における分離機能層1の第1主面1a側の面(分離膜10の第1主面))に接触させて、混合流体を、分離対象流体を含む第1流体と、第2流体とに分離すること、を含む。第1流体は、分離対象流体のみからなっていてもよい。なお、第2流体に少量の分離対象流体が含まれていてもよい。混合流体は、分離対象流体をより多く含む第1流体、あるいは分離対象流体からなる第1流体と、分離対象流体の含有量が少ない第2流体、あるいは分離対象流体が含まれない第2流体とに分離される。第1流体が分離膜10を透過した流体であり、かつ第2流体が分離膜10を透過しなかった流体であってもよいし、第1流体が分離膜10を透過しなかった流体であり、かつ第2流体が分離膜10を透過した流体であってもよい。
(Separation method using a separation membrane)
A separation method using the separation membrane 10 includes, for example, contacting a mixed fluid containing two or more fluids including a fluid to be separated with one surface of the separation membrane 10 (for example, the surface of the separation membrane 10 on the first main surface 1a side of the separation functional layer 1 (the first main surface of the separation membrane 10)), and separating the mixed fluid into a first fluid containing the fluid to be separated and a second fluid. The first fluid may consist only of the fluid to be separated. The second fluid may also contain a small amount of the fluid to be separated. The mixed fluid is separated into a first fluid containing a larger amount of the fluid to be separated, or a first fluid consisting of the fluid to be separated, and a second fluid having a small content of the fluid to be separated, or a second fluid not containing the fluid to be separated. The first fluid may be a fluid that has permeated the separation membrane 10, and the second fluid may not have permeated the separation membrane 10, or the first fluid may not have permeated the separation membrane 10, and the second fluid may be a fluid that has permeated the separation membrane 10.
分離膜10がガス分離に用いられる場合、上記混合流体は、分離対象ガスを含む2種以上のガスを含む混合ガスである。例えば、分離対象ガスがH2である場合、混合ガスのうちH2を分離膜10に優先的に透過させる。これにより、混合ガスからH2を分離することができる。このように、本実施形態の分離膜10によれば、例えば、H2と他のガス(例えば、CO2)との混合ガスから、H2を分離することができる。 When the separation membrane 10 is used for gas separation, the mixed fluid is a mixed gas containing two or more gases including a gas to be separated. For example, when the gas to be separated is H 2 , the H 2 in the mixed gas is preferentially permeated through the separation membrane 10. This allows H 2 to be separated from the mixed gas. In this way, the separation membrane 10 of this embodiment can separate H 2 from a mixed gas of H 2 and another gas (e.g., CO 2 ), for example.
分離膜10が液分離に用いられる場合、上記混合流体は、分離対象液体を含む2種以上の液体を含む混合液体である。例えば、分離対象液体がH2Oである場合、混合液体のうちH2Oを分離膜10に優先的に透過させる。これにより、混合液体からH2Oを分離することができる。このように、本実施形態の分離膜10によれば、例えば、H2Oと他の液体(例えば、アルコール等の有機溶媒)との混合液体から、H2Oを分離することができる。 When the separation membrane 10 is used for liquid separation, the mixed fluid is a mixed liquid containing two or more liquids including a liquid to be separated. For example, when the liquid to be separated is H 2 O, the H 2 O in the mixed liquid is preferentially permeated through the separation membrane 10. This allows H 2 O to be separated from the mixed liquid. In this way, the separation membrane 10 of this embodiment can separate H 2 O from, for example, a mixed liquid of H 2 O and another liquid (e.g., an organic solvent such as alcohol).
<膜分離装置の実施形態>
図4に示すとおり、本実施形態の膜分離装置100は、分離膜10を備え、さらにタンク20を備えている。タンク20は、第1室21及び第2室22を備えている。第1室21は、供給流体L(すなわち、分離対象流体を含む2種以上の流体を含む混合流体L)が供給される供給空間として機能する。第2室22は、透過流体L1が供給される透過空間として機能する。透過流体L1は、混合流体Lが分離膜10を透過することによって得られる。
<Embodiment of Membrane Separation Device>
As shown in Figure 4, the membrane separation apparatus 100 of this embodiment includes a separation membrane 10 and a tank 20. The tank 20 includes a first chamber 21 and a second chamber 22. The first chamber 21 functions as a supply space to which a supply fluid L (i.e., a mixed fluid L containing two or more fluids including a fluid to be separated) is supplied. The second chamber 22 functions as a permeation space to which a permeated fluid L1 is supplied. The permeated fluid L1 is obtained by the permeation of the mixed fluid L through the separation membrane 10.
分離膜10は、タンク20の内部に配置されている。タンク20の内部において、分離膜10は、第1室21と第2室22とを隔てている。分離膜10は、タンク20の1対の壁面の一方から他方まで延びている。 The separation membrane 10 is disposed inside the tank 20. Inside the tank 20, the separation membrane 10 separates the first chamber 21 and the second chamber 22. The separation membrane 10 extends from one to the other of a pair of walls of the tank 20.
第1室21は、入口21a及び出口21bを有する。第2室22は、出口22aを有する。入口21aは、混合流体Lを供給空間(第1室21)に供給するための開口である。出口22aは、透過流体L1を透過空間(第2室22)から排出するための開口である。出口21bは、分離膜10を透過しなかった混合流体L(非透過流体L2)を供給空間(第1室21)から排出するための開口である。入口21a、出口21b及び出口22aのそれぞれは、例えば、タンク20の壁面に形成されている。 The first chamber 21 has an inlet 21a and an outlet 21b. The second chamber 22 has an outlet 22a. The inlet 21a is an opening for supplying the mixed fluid L to the supply space (first chamber 21). The outlet 22a is an opening for discharging the permeated fluid L1 from the permeated space (second chamber 22). The outlet 21b is an opening for discharging the mixed fluid L (non-permeated fluid L2) that has not permeated the separation membrane 10 from the supply space (first chamber 21). The inlet 21a, outlet 21b, and outlet 22a are each formed, for example, on the wall surface of the tank 20.
膜分離装置100は、流通式(連続式)の膜分離方法に適している。ただし、膜分離装置100は、バッチ式の膜分離方法に用いられてもよい。 The membrane separation device 100 is suitable for flow-through (continuous) membrane separation methods. However, the membrane separation device 100 may also be used for batch-type membrane separation methods.
(膜分離装置の運転方法)
膜分離装置100の運転方法は、例えば、次のように実施される。まず、入口21aを通じて、混合流体Lを膜分離装置100の第1室21に供給する。これにより、分離膜10の一方の面(例えば、分離膜10の第1主面)に混合流体Lを接触させることができる。
(Method of operating a membrane separation device)
The membrane separation device 100 is operated, for example, as follows: First, the mixed fluid L is supplied to the first chamber 21 of the membrane separation device 100 through the inlet 21 a. This allows the mixed fluid L to come into contact with one surface of the separation membrane 10 (for example, the first main surface of the separation membrane 10).
混合流体Lの温度は、例えば25℃以上であり、好ましくは40℃以上であり、より好ましくは60℃以上である。混合流体Lの温度は、75℃以下であってもよい。 The temperature of the mixed fluid L is, for example, 25°C or higher, preferably 40°C or higher, and more preferably 60°C or higher. The temperature of the mixed fluid L may be 75°C or lower.
次に、分離膜10の一方の面に混合流体Lを接触させた状態で、分離膜10の他方の面(例えば、分離膜10の第2主面)に隣接する空間を減圧する。詳細には、出口22aを通じて、第2室22内を減圧する。膜分離装置100は、第2室22内を減圧するためのポンプ(図示せず)をさらに備えていてもよい。第2室22は、第2室22内の空間が測定環境における大気圧に対して、例えば10kPa以上、好ましくは50kPa以上、より好ましくは100kPa以上小さくなるように減圧される。 Next, with the mixed fluid L in contact with one surface of the separation membrane 10, the space adjacent to the other surface of the separation membrane 10 (e.g., the second main surface of the separation membrane 10) is depressurized. Specifically, the pressure inside the second chamber 22 is reduced through the outlet 22a. The membrane separation device 100 may further include a pump (not shown) for reducing the pressure inside the second chamber 22. The second chamber 22 is depressurized so that the pressure inside the second chamber 22 is, for example, 10 kPa or more, preferably 50 kPa or more, and more preferably 100 kPa or more lower than the atmospheric pressure in the measurement environment.
第2室22内を減圧することによって、分離膜10の他方の面側において、透過流体L1を得ることができる。言い換えると、透過流体L1が第2室22に供給される。透過流体L1は、出口22aを通じて、膜分離装置100の外部に排出される。 By reducing the pressure inside the second chamber 22, permeated fluid L1 can be obtained on the other side of the separation membrane 10. In other words, permeated fluid L1 is supplied to the second chamber 22. Permeated fluid L1 is discharged to the outside of the membrane separation device 100 through the outlet 22a.
一方、第1室21で処理された混合流体L(非透過流体L2)は、出口21bを通じて、膜分離装置100の外部に排出される。 Meanwhile, the mixed fluid L (non-permeated fluid L2) treated in the first chamber 21 is discharged outside the membrane separation device 100 through the outlet 21b.
<膜分離装置の変形例>
膜分離装置100は、スパイラル型の膜エレメント、中空糸膜エレメント、複数の分離膜が積層されたディスクチューブ型の膜エレメント、プレートアンドフレーム型の膜エレメントなどであってもよい。図5は、スパイラル型の膜エレメントを示している。図5の膜分離装置110は、中心管41及び積層体42を備えている。積層体42が分離膜10を含んでいる。
<Modification of Membrane Separation Device>
The membrane separation device 100 may be a spiral-wound membrane element, a hollow fiber membrane element, a disk-tube membrane element in which multiple separation membranes are stacked, a plate-and-frame membrane element, or the like. Fig. 5 shows a spiral-wound membrane element. The membrane separation device 110 in Fig. 5 includes a central tube 41 and a stack 42. The stack 42 includes separation membranes 10.
中心管41は、円筒形状を有している。中心管41の表面には、中心管41の内部に透過流体L1を流入させるための複数の孔又はスリットが形成されている。中心管41の材料としては、例えば、アクリロニトリル・ブタジエン・スチレン共重合樹脂(ABS樹脂)、ポリフェニレンエーテル樹脂(PPE樹脂)、ポリサルフォン樹脂(PSF樹脂)などの樹脂;ステンレス鋼、チタンなどの金属が挙げられる。中心管41の内径は、例えば20~100mmの範囲にある。 The central tube 41 has a cylindrical shape. A plurality of holes or slits are formed on the surface of the central tube 41 to allow the permeating fluid L1 to flow into the interior of the central tube 41. Examples of materials for the central tube 41 include resins such as acrylonitrile butadiene styrene copolymer resin (ABS resin), polyphenylene ether resin (PPE resin), and polysulfone resin (PSF resin); and metals such as stainless steel and titanium. The inner diameter of the central tube 41 is, for example, in the range of 20 to 100 mm.
積層体42は、分離膜10の他に、供給側流路材43及び透過側流路材44をさらに含む。積層体42は、中心管41の周囲に巻回されている。膜分離装置110は、外装材(図示せず)をさらに備えていてもよい。 In addition to the separation membrane 10, the laminate 42 further includes a feed-side flow path material 43 and a permeate-side flow path material 44. The laminate 42 is wound around the central tube 41. The membrane separation device 110 may further include an exterior material (not shown).
供給側流路材43及び透過側流路材44としては、例えばポリエチレン、ポリプロピレン、ポリエチレンテレフタレート(PET)、ポリフェニレンサルファイド(PPS)又はエチレン-クロロトリフルオロエチレン共重合体(ECTFE)からなる樹脂製ネットを用いることができる。 The feed-side flow path material 43 and the permeate-side flow path material 44 can be, for example, a resin net made of polyethylene, polypropylene, polyethylene terephthalate (PET), polyphenylene sulfide (PPS), or ethylene-chlorotrifluoroethylene copolymer (ECTFE).
膜分離装置110は、例えば、次の方法で運転できる。まず、巻回された積層体42の一端に混合流体Lを供給し、中心管41の内部の空間を減圧する。これにより、積層体42の分離膜10を透過した透過流体L1が中心管41の内部に移動する。透過流体L1は、中心管41を通じて外部に排出される。膜分離装置110で処理された混合流体L(非透過流体L2)は、巻回された積層体42の他端から外部に排出される。 The membrane separation device 110 can be operated, for example, in the following manner. First, mixed fluid L is supplied to one end of the wound stack 42, and the space inside the central tube 41 is depressurized. As a result, permeated fluid L1 that has permeated the separation membrane 10 of the stack 42 moves into the interior of the central tube 41. Permeated fluid L1 is discharged to the outside through the central tube 41. The mixed fluid L (non-permeated fluid L2) that has been treated in the membrane separation device 110 is discharged to the outside from the other end of the wound stack 42.
以下に、実施例及び比較例により本発明をさらに詳細に説明するが、本発明はこれに限定されるものではない。 The present invention will be explained in more detail below using examples and comparative examples, but the present invention is not limited to these.
(分離膜の作製)
(実施例1)
まず、多孔性支持体として、日東電工社製のRS-50(PVDF微多孔層とPET不織布との積層体)を準備した。次に、シリコーン樹脂組成物(ダウ・東レ製、LTC-1051L)100gに、硬化触媒(ダウ・東レ製、SRX212)2gを添加し、塗布液として付加反応型シリコーン樹脂組成物を作製した。この塗布液は、溶剤を含まない無溶剤型であった。次に、塗布液を多孔性支持体の微多孔層の上に塗布することによって塗布膜を得た。次に、塗布膜を150℃で10分間加熱し、硬化させることによって、分離機能層の前駆体である前駆体層を作製した。この際、前駆体層は、Dry厚で15μm以下となるように作製された。
(Preparation of separation membrane)
Example 1
First, RS-50 (a laminate of a PVDF microporous layer and a PET nonwoven fabric) manufactured by Nitto Denko Corporation was prepared as a porous support. Next, 2 g of a curing catalyst (SRX212 manufactured by Dow Toray) was added to 100 g of a silicone resin composition (LTC-1051L manufactured by Dow Toray) to prepare an addition reaction type silicone resin composition as a coating liquid. This coating liquid was a solventless type that did not contain a solvent. Next, a coating film was obtained by applying the coating liquid onto the microporous layer of the porous support. Next, the coating film was heated at 150°C for 10 minutes and cured to prepare a precursor layer, which is a precursor of the separation functional layer. At this time, the precursor layer was prepared so that its dry thickness was 15 μm or less.
次に、作製された前駆体層の表面をプラズマ処理した。本実施例では、多孔性支持体上に前駆体層が形成された積層体(プラズマ処理対象物)をロールトゥロール方式で搬送しながら、前駆体層の表面に対する低インダクタンスアンテナを用いたICPによるプラズマ処理を実施した。具体的には、上記積層体に対してロールトゥロール方式のプロセスを実施できる装置を使用した。同装置は、繰出し室と、プラズマ処理室と、巻取り室とを備えており、繰出し室、プラズマ処理室、及び巻取り室はこの順で配置され、かつ連通していた。繰出し室は、繰出しローラーを備えていた。繰出しローラーには、上記積層体を搬送するためのキャリアフィルムとして、汎用PETフィルムのロールがセットされた。プラズマ処理室は、温度調節機能付き搬送ローラーと、4つの低インダクタンスアンテナとを備えていた。図6は、本実施例で使用したプラズマ処理室における低インダクタンスアンテナとプラズマ処理対象物との位置関係を表す斜視図である。図7は、本実施例で使用したプラズマ処理室における低インダクタンスアンテナとプラズマ処理対象物との位置関係を表す断面図である。各低インダクタンスアンテナ71は、プラズマ処理対象物70に対して平行な延び部71aを有していた。4つの低インダクタンスアンテナ71において、延出長さd1は88mmであり、最大長さd2(延び部の長さ)は100mmであり、離隔距離d3は112mmであり、中心間距離d4は290mmであり、中心間距離d5は280mmであった。各低インダクタンスアンテナ71は、プラズマ処理室外において、インピーダンス整合器を介して高周波電源(RF電源、周波数13.56MHz)と電気的に接続されていた。なお、図6及び図7において、72は取付具であり、74はフィールドスルーであり、低インダクタンスアンテナ71は、フィールドスルー74を介して取付具72に固定されていた。 Next, the surface of the prepared precursor layer was plasma-treated. In this example, a laminate (plasma-treated object) in which a precursor layer was formed on a porous support was transported by roll-to-roll, while a plasma treatment was performed on the surface of the precursor layer by ICP using a low-inductance antenna. Specifically, an apparatus capable of performing a roll-to-roll process on the laminate was used. The apparatus included a payout chamber, a plasma treatment chamber, and a winding chamber, which were arranged in this order and connected to each other. The payout chamber was equipped with a payout roller. A roll of general-purpose PET film was set on the payout roller as a carrier film for transporting the laminate. The plasma treatment chamber was equipped with a temperature-adjustable transport roller and four low-inductance antennas. Figure 6 is a perspective view showing the positional relationship between the low-inductance antenna and the plasma-treated object in the plasma treatment chamber used in this example. Figure 7 is a cross-sectional view showing the positional relationship between the low-inductance antenna and the plasma-treated object in the plasma treatment chamber used in this example. Each low-inductance antenna 71 had an extension 71a parallel to the object 70 to be plasma processed. The four low-inductance antennas 71 had an extension length d1 of 88 mm, a maximum length d2 (length of the extension) of 100 mm, a separation distance d3 of 112 mm, a center-to-center distance d4 of 290 mm, and a center-to-center distance d5 of 280 mm. Each low-inductance antenna 71 was electrically connected to a high-frequency power source (RF power source, frequency 13.56 MHz) via an impedance matching box outside the plasma processing chamber. In FIGS. 6 and 7, 72 denotes a fixture, 74 denotes a field-through, and the low-inductance antenna 71 was fixed to the fixture 72 via the field-through 74.
プラズマ処理対象物である、多孔性支持体と前駆体層との積層体については、A4サイズにカットして、多孔性支持体がキャリアフィルムである汎用PETフィルムに接するようにテープを用いて貼合した。この原反を繰出し室にセットし、繰出し室から巻取り室までロールトゥロール方式でキャリアフィルムを搬送させながら、プラズマ処理室において、前駆体層の表面に対してプラズマ処理を行った。 The laminate of the porous support and precursor layer, which was the object to be plasma treated, was cut to A4 size and attached using tape so that the porous support was in contact with the general-purpose PET film carrier film. This raw roll was set in the unwinding chamber, and while the carrier film was transported from the unwinding chamber to the winding chamber using the roll-to-roll method, the surface of the precursor layer was plasma treated in the plasma treatment chamber.
プラズマ処理条件は、次のとおりであった。プラズマ処理室の到達真空度が1.0×10-4Paに至るまで装置内を真空排気した後、プラズマ処理室内に、アルゴン(Ar)ガスを導入し、プラズマ処理室内の気圧を0.2Paとした。4本の低インダクタンスアンテナに対して13.56MHzの高周波電源(RF電源)によって5.0kWの電力を印加することにより、4本の低インダクタンスアンテナの周辺に、アルゴン含有ガスの誘導結合プラズマを形成した。キャリアフィルムの走行速度は処理時間(実施例1では80秒)に合わせて変更した。温度調節機能付き搬送ローラーの温度は、20℃とした。なお、表2に、プラズマ処理条件が示されている。 The plasma treatment conditions were as follows: The apparatus was evacuated until the ultimate vacuum of the plasma treatment chamber reached 1.0 × 10 -4 Pa, and then argon (Ar) gas was introduced into the plasma treatment chamber, setting the pressure inside the plasma treatment chamber to 0.2 Pa. An inductively coupled plasma of argon-containing gas was formed around the four low-inductance antennas by applying 5.0 kW of power to the four low-inductance antennas using a 13.56 MHz high-frequency power source (RF power source). The running speed of the carrier film was changed according to the treatment time (80 seconds in Example 1). The temperature of the temperature-controlled transport roller was set to 20°C. Table 2 shows the plasma treatment conditions.
以上のプラズマ処理が施された前駆体層の表面が分離機能層の第1主面となり、実施例1の分離膜が作製された。 The surface of the precursor layer that had been subjected to the above plasma treatment became the first main surface of the separation functional layer, and the separation membrane of Example 1 was produced.
(実施例2)
プラズマ処理の条件を表2に示すように変更した点を除き、実施例1と同様の方法で実施例2の分離膜を作製した。
Example 2
A separation membrane of Example 2 was produced in the same manner as in Example 1, except that the plasma treatment conditions were changed as shown in Table 2.
(実施例3)
まず、多孔性支持体として、日東電工社製のSWC(ポリスルホン製の微多孔層とPET不織布との積層体)を準備し、一晩ドラフト内で乾燥した。次に、シリコーン樹脂組成物(ワッカー製、DEHESIVE(登録商標) 944)30gに、架橋剤(ワッカー製、CROSSLINKER V 24)3g、硬化触媒(ワッカー製、CATALYST OL)0.6gを添加し、炭化水素溶剤(ワッカー製、EXXSOL D40)100mLに溶解させ30分攪拌し、塗布液として縮合反応型シリコーン樹脂組成物を作製した。次に、塗布液を多孔性支持体の微多孔層の上に塗布することによって塗布膜を得た。塗布膜をドラフト内で2時間乾燥後、再度塗布液を多孔性支持体の微多孔層の上に塗布した。次に、塗布膜をドラフト内で一晩乾燥させ、100℃で30分間加熱し、硬化させることによって、分離機能層の前駆体である前駆体層を作製した。この際、前駆体層は、Dry厚で15μm以下となるように作製された。
Example 3
First, a Nitto Denko SWC (a laminate of a polysulfone microporous layer and a PET nonwoven fabric) was prepared as a porous support and dried overnight in a draft. Next, 30 g of a silicone resin composition (Wacker DEHESIVE (registered trademark) 944) was added with 3 g of a crosslinker (Wacker CROSSLINKER V 24) and 0.6 g of a curing catalyst (Wacker CATALYST OL), and dissolved in 100 mL of a hydrocarbon solvent (Wacker EXXSOL D40) and stirred for 30 minutes to prepare a condensation reaction type silicone resin composition as a coating liquid. Next, the coating liquid was applied onto the microporous layer of the porous support to obtain a coating film. After drying the coating film for 2 hours in a draft, the coating liquid was again applied onto the microporous layer of the porous support. Next, the coating film was dried overnight in a draft and then heated at 100° C. for 30 minutes to be cured, thereby producing a precursor layer, which is a precursor of the separation functional layer. At this time, the precursor layer was produced so that its dry thickness was 15 μm or less.
前駆体層の表面に対するプラズマ処理は、プラズマ処理の条件を表2に示すように変更した点を除き、実施例1と同様の方法で実施された。 The plasma treatment of the precursor layer surface was carried out in the same manner as in Example 1, except that the plasma treatment conditions were changed as shown in Table 2.
以上の方法により、実施例3の分離膜が作製された。 The separation membrane of Example 3 was produced using the above method.
(実施例4)
プラズマ処理の条件を表2に示すように変更した点を除き、実施例1と同様の方法で実施例4の分離膜を作製した。なお、実施例4では、ガスとしてアルゴンガスと酸素ガスとの混合ガスが用いられたが、アルゴンガスと酸素ガスとの体積比が1:1となるように、アルゴンガスと酸素ガスとの流量調整が行われた。
Example 4
The separation membrane of Example 4 was produced in the same manner as in Example 1, except that the plasma treatment conditions were changed as shown in Table 2. In Example 4, a mixed gas of argon gas and oxygen gas was used, and the flow rates of the argon gas and oxygen gas were adjusted so that the volume ratio of the argon gas to the oxygen gas was 1:1.
(実施例5)
プラズマ処理の条件を表2に示すように変更した点を除き、実施例3と同様の方法で実施例5の分離膜を作製した。
Example 5
A separation membrane of Example 5 was produced in the same manner as in Example 3, except that the plasma treatment conditions were changed as shown in Table 2.
(実施例6)
プラズマ処理の条件を表2に示すように変更した点を除き、実施例3と同様の方法で実施例6の分離膜を作製した。
Example 6
A separation membrane of Example 6 was produced in the same manner as in Example 3, except that the plasma treatment conditions were changed as shown in Table 2.
(実施例7)
プラズマ処理の条件を表2に示すように変更した点を除き、実施例3と同様の方法で実施例6の分離膜を作製した。
Example 7
A separation membrane of Example 6 was produced in the same manner as in Example 3, except that the plasma treatment conditions were changed as shown in Table 2.
(比較例1)
実施例3で作製された前駆体層に対してプラズマ処理を施すことなく、前駆体層をそのまま分離機能層として用いた。すなわち、実施例3で作製された多孔性支持体と前駆体層との積層体を、比較例1の分離膜とした。
(Comparative Example 1)
The precursor layer produced in Example 3 was used as a separation functional layer without being subjected to plasma treatment. That is, the laminate of the porous support and the precursor layer produced in Example 3 was used as the separation membrane of Comparative Example 1.
(比較例2)
実施例1で作製された前駆体層に対してプラズマ処理を施すことなく、前駆体層をそのまま分離機能層として用いた。すなわち、実施例1で作製された多孔性支持体と前駆体層との積層体を、比較例2の分離膜とした。
(Comparative Example 2)
The precursor layer produced in Example 1 was used as a separation functional layer without being subjected to plasma treatment. That is, the laminate of the porous support and the precursor layer produced in Example 1 was used as the separation membrane of Comparative Example 2.
(比較例3)
ICPによるプラズマ処理をCCPによるプラズマ処理に変更した点を除き、実施例1と同様の方法で比較例3の分離膜を作製した。比較例3で実施したCCPによるプラズマ処理は、以下のとおりであった。
(Comparative Example 3)
A separation membrane of Comparative Example 3 was produced in the same manner as in Example 1, except that the plasma treatment using ICP was changed to plasma treatment using CCP. The plasma treatment using CCP carried out in Comparative Example 3 was as follows.
低インダクタンスアンテナを設置したプラズマ処理室の代わりに、平面平板電極としてカソード電極およびアノード電極(SUS304製の矩形電極)を設置し、プラズマ処理室として用いた。1対の平面電極は、50mmの間隔を設け、プラズマ処理を施す、多孔性支持体上に前駆体層が形成された積層体(プラズマ処理対象物)に対して平行に配置されていた。アノード電極は、上記積層体から35mm離れた位置に配置され、プラズマ処理室外で接地されている。カソード電極はプラズマ処理面である前駆体層の表面に対向するように配置され、インピーダンス整合器を介してRF電源(高周波電源、13.56MHz)に電気的に接続されていた。プラズマ処理室内にアルゴンガスを導入し、圧力が0.5Paになるように流量を調整した。平面電極間に対して高周波電源から0.2kW印加することにより、CCPを発生させ、処理を施した。各平面電極について、上記積層体と対向する平面サイズは110mm×430mmであった。 Instead of a plasma treatment chamber equipped with a low-inductance antenna, a cathode electrode and an anode electrode (rectangular electrodes made of SUS304 stainless steel) were installed as flat plate electrodes and used as a plasma treatment chamber. The pair of planar electrodes were spaced 50 mm apart and positioned parallel to the laminate (object to be plasma-treated), which was a porous support on which a precursor layer was formed. The anode electrode was positioned 35 mm away from the laminate and grounded outside the plasma treatment chamber. The cathode electrode was positioned facing the surface of the precursor layer, which was the plasma treatment surface, and was electrically connected to an RF power supply (high-frequency power supply, 13.56 MHz) via an impedance matcher. Argon gas was introduced into the plasma treatment chamber, and the flow rate was adjusted to a pressure of 0.5 Pa. CCP was generated by applying 0.2 kW from the high-frequency power supply between the planar electrodes, and treatment was performed. The surface size of each planar electrode facing the laminate was 110 mm x 430 mm.
(分離機能層の第1主面の分析)
実施例1~7及び比較例1~3の分離膜について、分離機能層の第1主面に対しXPS分析を行った。分離機能層の第1主面、すなわち分離機能層の最表面についてワイドスキャン測定し、定性分析を行った。各元素に対してナロースキャン測定を行い、元素比率(atomic%)を算出した。Si2p、C1sスペクトルに対して、波形解析を行うことにより、化学結合状態を分析した。この際、C1sスペクトルのC-H結合由来のピークを284.6eVに帯電補正した(表1参照)。使用した装置は、アルバック・ファイ製の「Quantera SXM」であり、X線源にはモノクロAlKαが用いられた。分離機能層の第1主面のXPS分析の結果は、表3及び表4に示されている。
(Analysis of the first principal surface of the separation functional layer)
For the separation membranes of Examples 1 to 7 and Comparative Examples 1 to 3, XPS analysis was performed on the first main surface of the separation functional layer. Wide scan measurement was performed on the first main surface of the separation functional layer, i.e., the outermost surface of the separation functional layer, and qualitative analysis was performed. Narrow scan measurement was performed on each element, and the element ratio (atomic%) was calculated. The chemical bond state was analyzed by performing waveform analysis on the Si2p and C1s spectra. At this time, the peak derived from the C-H bond in the C1s spectrum was charge corrected to 284.6 eV (see Table 1). The apparatus used was a "Quantera SXM" manufactured by ULVAC-PHI, and a monochromatic AlKα was used as the X-ray source. The results of the XPS analysis of the first main surface of the separation functional layer are shown in Tables 3 and 4.
(液分離の評価)
実施例1~4及び比較例1~3の分離膜について、液分離の評価を行った。具体的には、以下の方法によって、イソプロパノール(IPA)に対する水の分離係数α(α=H2O/IPA)を測定した。
(Evaluation of liquid separation)
Liquid separation was evaluated for the separation membranes of Examples 1 to 4 and Comparative Examples 1 to 3. Specifically, the separation coefficient α (α=H 2 O/IPA) of water relative to isopropanol (IPA) was measured by the following method.
まず、分離膜を直径74mmのサイズに切り出し、平膜状の試験片とした。この試験片をバッチ式の膜分離装置(セル)にセットした。このセルの供給空間に、IPA及び水からなる混合液体を供給した。混合液体におけるIPAの含有率は、50質量%であった。 First, the separation membrane was cut into a size of 74 mm in diameter to create a flat membrane test piece. This test piece was placed in a batch-type membrane separation device (cell). A mixed liquid consisting of IPA and water was supplied to the supply space of this cell. The IPA content in the mixed liquid was 50% by mass.
次に、セルをウォーターバスに浸漬させ、混合液体の温度を40℃に調節した。次に、セル内に配置された攪拌子を用いて、混合液体を攪拌しながら、透過空間内の圧力を15hPaまで減圧した。これにより、混合液体が分離膜を透過し、気体の透過流体が得られた。 Next, the cell was immersed in a water bath and the temperature of the mixed liquid was adjusted to 40°C. Next, the pressure in the permeation space was reduced to 15 hPa while stirring the mixed liquid using a stirrer placed inside the cell. This allowed the mixed liquid to permeate the separation membrane, yielding a gaseous permeation fluid.
液体窒素を利用した冷却トラップによって、気体の透過流体を冷却し、透過流体を凝縮させた。ガスクロマトグラフィーを用いて、液体の透過流体の組成を分析し、得られた結果に基づいて、分離係数αを算出した。結果は、表3に示されている。 The gaseous permeating fluid was cooled and condensed using a cold trap using liquid nitrogen. The composition of the liquid permeating fluid was analyzed using gas chromatography, and the separation factor α was calculated based on the results. The results are shown in Table 3.
(ガス分離の評価)
実施例3~7及び比較例1~3の分離膜について、ガス分離の評価を行った。具体的には、以下の方法によって、CO2に対するH2の分離係数α(α=H2/CO2)を測定した。
(Gas Separation Evaluation)
Gas separation was evaluated for the separation membranes of Examples 3 to 7 and Comparative Examples 1 to 3. Specifically, the separation factor α of H 2 relative to CO 2 (α=H 2 /CO 2 ) was measured by the following method.
まず、分離膜を直径64mmのサイズに切り出し、平膜状の試験片とした。この試験片をバッチ式の膜分離装置(セル)にセットした。このセルの供給空間に、H2ガスとCO2ガスを同時に供給した。次に、セルをオーブン庫内にセットし、温度を150℃に調節した。これにより、混合ガスが分離膜を透過し、透過ガスが得られた。 First, the separation membrane was cut into a size of 64 mm in diameter to prepare a flat membrane-shaped test piece. This test piece was set in a batch-type membrane separation device (cell). H2 gas and CO2 gas were simultaneously supplied to the supply space of this cell. Next, the cell was set in an oven chamber, and the temperature was adjusted to 150 ° C. As a result, the mixed gas permeated the separation membrane, and a permeated gas was obtained.
ガスクロマトグラフィーを用いて、透過ガスの組成を分析し、得られた結果に基づいて各ガスの透過速度[GPU]を求めた。各ガスの透過速度[GPU]から以下の式によってガスの分離係数αを算出した。
ガスの分離係数α=H2[GPU]/CO2[GPU]
The composition of the permeated gas was analyzed using gas chromatography, and the gas permeation rate [GPU] of each gas was determined based on the results obtained. The gas separation factor α was calculated from the permeation rate [GPU] of each gas using the following formula.
Gas separation factor α=H 2 [GPU]/CO 2 [GPU]
表3及び表4に示されているように、実施例の分離膜では、液分離及びガス分離の両方において分離性能が改善されていた。 As shown in Tables 3 and 4, the separation membranes of the examples showed improved separation performance in both liquid and gas separation.
本実施形態の分離膜は、改善された分離性能を有し、特に、混合液体からの水の分離及び混合気体からの水素の分離等に適している。 The separation membrane of this embodiment has improved separation performance and is particularly suitable for separating water from mixed liquids and hydrogen from mixed gases.
Claims (19)
X線光電子分光法による前記分離機能層の第1主面についてのC1sスペクトルによるCの化学結合状態の解析において、C-H、C-O、C=O、及びCOOの結合に由来するピーク面積の合計に対する前記C-Hの結合に由来するピーク面積の割合が、92area%以下である、
分離膜。 A separation functional layer containing Si, O, and C is provided,
In an analysis of the chemical bonding state of C by C1s spectrum of the first main surface of the separation functional layer by X-ray photoelectron spectroscopy, the ratio of the peak area derived from the C-H bond to the total peak area derived from C-H, C-O, C=O, and COO bonds is 92 area% or less.
Separation membrane.
請求項1に記載の分離膜。 In an analysis of the chemical bonding state of C by C1s spectrum of the first main surface of the separation functional layer by X-ray photoelectron spectroscopy, the ratio of the peak area derived from the C-O bond to the total peak area derived from C-H, C-O, C=O, and COO bonds is 5 area% or more.
The separation membrane according to claim 1 .
請求項1に記載の分離膜。 In the first main surface of the separation functional layer, the ratio of the number of O atoms to the number of Si atoms, O/Si, is 1.2 or more.
The separation membrane according to claim 1 .
請求項1に記載の分離膜。 In the first main surface of the separation functional layer, the ratio of the number of C atoms to the total number of C atoms, N atoms, O atoms, and Si atoms is 17 at. % or more.
The separation membrane according to claim 1 .
請求項1に記載の分離膜。 In the first main surface of the separation functional layer, the ratio of the number of O atoms to the total number of C atoms, N atoms, O atoms, and Si atoms is 54 at. % or less.
The separation membrane according to claim 1 .
請求項1に記載の分離膜。 The porous support member further includes a porous support member for supporting the separation functional layer, the porous support member being arranged on a second main surface side opposite to the first main surface of the separation functional layer.
The separation membrane according to claim 1 .
請求項1に記載の分離膜。 The separation functional layer contains a compound containing a siloxane bond.
The separation membrane according to claim 1 .
請求項7に記載の分離膜。 the first main surface of the separation functional layer contains organosilica having a siloxane bond, a Si—C bond, and a C—O bond;
The separation membrane according to claim 7.
請求項1に記載の分離膜。 the first main surface of the separation functional layer contains a second compound obtained by modifying a first compound constituting the interior of the separation functional layer by plasma treatment;
The separation membrane according to claim 1 .
請求項9に記載の分離膜。 the first compound contains a siloxane bond;
The separation membrane according to claim 9.
請求項10に記載の分離膜。 The first compound is a silicone resin.
The separation membrane according to claim 10.
請求項9に記載の分離膜。 The plasma treatment is an inductively coupled plasma treatment using a low inductance antenna.
The separation membrane according to claim 9.
請求項1に記載の分離膜。 At least a portion of the first main surface of the separation functional layer is exposed on the surface of the separation membrane.
The separation membrane according to claim 1 .
膜分離装置。 A separation membrane according to any one of claims 1 to 13,
Membrane separation equipment.
分離対象流体を含む2種以上の流体を含む混合流体を、前記分離膜の一方の面に接触させて、前記混合流体を、前記分離対象流体を含む第1流体と、第2流体とに分離すること、を含む、
分離方法。 A separation method using the separation membrane according to any one of claims 1 to 13,
A mixed fluid containing two or more fluids including a fluid to be separated is brought into contact with one side of the separation membrane, and the mixed fluid is separated into a first fluid containing the fluid to be separated and a second fluid.
Separation method.
請求項15に記載の分離方法。 The mixed fluid is a mixed gas containing two or more gases including a gas to be separated.
The separation method according to claim 15.
請求項16に記載の分離方法。 The gas to be separated is H 2 , and H 2 of the mixed gas is preferentially permeated through the separation membrane.
The separation method according to claim 16.
請求項15に記載の分離方法。 The mixed fluid is a mixed liquid containing two or more liquids including a liquid to be separated.
The separation method according to claim 15.
請求項18に記載の分離方法。 the liquid to be separated is H 2 O, and H 2 O in the mixed liquid is preferentially allowed to permeate the separation membrane;
The separation method according to claim 18.
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