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WO2025176460A1 - Adhésif électroconducteur - Google Patents

Adhésif électroconducteur

Info

Publication number
WO2025176460A1
WO2025176460A1 PCT/EP2025/052870 EP2025052870W WO2025176460A1 WO 2025176460 A1 WO2025176460 A1 WO 2025176460A1 EP 2025052870 W EP2025052870 W EP 2025052870W WO 2025176460 A1 WO2025176460 A1 WO 2025176460A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrically conductive
acid
meth
acrylate
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/EP2025/052870
Other languages
English (en)
Inventor
Fabio Smaniotto
Daniel BUCKLAND
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Henkel AG and Co KGaA
Original Assignee
Henkel AG and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Henkel AG and Co KGaA filed Critical Henkel AG and Co KGaA
Publication of WO2025176460A1 publication Critical patent/WO2025176460A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to an electrically conductive adhesive for attaching solar cells together in a shingled photovoltaic module or in a ribbon-attached photovoltaic module, wherein the adhesive provides the required viscosity, adhesion, and electrical conductivity on non-noble metals such as tin, tin-lead alloy, tin-lead bismuth alloy and copper.
  • non-noble metals such as tin, tin-lead alloy, tin-lead bismuth alloy and copper.
  • a solar cell or photovoltaic cell is an electrical device that converts the energy of light directly into electricity by the photovoltaic effect.
  • Solar cells are the building blocks of the photovoltaic modules, otherwise known as solar panels, in order to increase the voltage delivered by individual solar cells.
  • FIG 1 The general structure of a solar cell is illustrated in figure 1 .
  • Most of the solar cells (1) produced today consist of crystalline silicon.
  • Metal contacts, busbars (2) and fingers (3), are both printed on the silicon wafer. These metallic contacts are necessary to collect the current generated by a solar cell.
  • Figure 1 a illustrates basic configuration with three busbars and figure 1 b illustrates basic configuration with four busbars.
  • Fingers are linear areas of metallization that collect current to deliver it to the busbars, which are connected directly to the external leads, via ribbons (5) for example.
  • a ribbon-attached solar cell, including ribbons (5) is illustrated in figure 2.
  • solar cells can be arranged in series-connected in an overlapping shingle pattern.
  • Shingles are typically made by cutting/dicing crystalline silicon cells along a plurality of lines parallel to a long edge of each wafer to form a plurality of rectangular silicon solar cells each having substantially the same length along its long axis.
  • more shingles typically 5 or 6 for a six-inch wafer (approx. 156 mm)
  • the cells can be full square as well as pseudo-square, in the latter cut-cells with chamfered corners may be obtained.
  • Prior art describes various different kind of electrically conductive adhesives, which can be used in solar cells and to form photovoltaic modules. Many of these electrically conductive adhesives are epoxy, acrylates or silicone-based adhesives. However, a long curing time is often required for some adhesives described in the prior art before the adhesive reaches its full mechanical and electrical properties.
  • the photovoltaic modules are subjected to a temperature changes and high mechanical stresses over their life cycle. These factors have a negative effect on the lifetime of the photovoltaic module, and also set requirements for the electrically conductive adhesive used in the solar cells and/or photovoltaic cells.
  • the adhesives may not have the required thermomechanical properties.
  • Required thermal-elastic properties for the electrically conductive adhesive composition are correct modulus, specified glass transition temperature, and specified coefficient of thermal expansion in order to pass the thermo-mechanical load reliability test designed for the photovoltaic modules. If the adhesive material is too rigid (too high modulus) the power output loss of the photovoltaic module may occur when applying external stresses to the module (eg. after application of mechanical load or after thermal cycling).
  • non-conductive non-noble metal oxide layer present on a surface of non-noble ribbons.
  • the non-conductive non-noble metal oxide layer hinders formation of good and reliable electrical connection with silver containing electrically conductive adhesives.
  • use of fluxing agents causes problems with curing process, and they often lead to reduced conductivity, and issues with viscosity, adhesion and mechanical properties.
  • Figure 1 illustrates a structure of ordinary silicon solar cells.
  • Figure 2 illustrates a ribbon-attached photovoltaic module.
  • Figure 3 illustrates a shingled photovoltaic module.
  • the present invention relates to an electrically conductive composition
  • an electrically conductive composition comprising a) an epoxy (meth)acrylate oligomer; b) an urethane (meth)acrylate oligomer; c) a monofunctional (meth)acrylate monomer; d) a difunctional (meth)acrylate monomer; e) silver flakes and/or particles; f) silver coated glass flakes and/or particles; g) a curing agent; and h) a fluxing agent.
  • the present invention also encompasses a cured product of the electrically conductive composition according to the present invention.
  • the present invention also relates to a photovoltaic module, comprising a series-connected string of two or more solar cells in a shingle pattern having an electrically conductive bonding between said two or more solar cells, or ribbon-attached pattern having an electrically conductive bonding between the ribbon and solar cells, wherein the electrically conductive bonding is formed with an electrically conductive composition according to the present invention.
  • (meth)acrylate covers both acrylate and methacrylate.
  • the present invention relates to an electrically conductive composition
  • an electrically conductive composition comprising a) an epoxy (meth)acrylate oligomer; b) an urethane (meth)acrylate oligomer; c) a monofunctional (meth)acrylate monomer; d) a difunctional (meth)acrylate monomer; e) silver flakes and/or particles; f) silver coated glass flakes and/or particles; g) a curing agent; and h) a fluxing agent.
  • the Applicant has discovered that the electrically conductive composition according to the present invention provides fast curing, stress release, long term bonding strength to metal part of the silicon solar cells, reliable connection and low electrical contact resistance to the metal parts of the solar cell despite of low silver quantity.
  • the Applicant has found out that the flexibility of the adhesive can be modified even further by reducing the quantity of the selected electrically conductive fillers and to increase the quantity of the selected oligomers.
  • the composition according to the present invention is able to overcome the accumulated mechanical stresses in the photovoltaic modules.
  • the composition according to the present invention is capable to remove the non-noble metal oxides from the surface of the non-noble surface to be adhered, and therefore, provides excellent and reliable conductive properties.
  • non-noble metals are meant herein metals such as tin, tin-lead alloy, tin-lead bismuth alloy and copper.
  • the electrically conductive composition according to the present invention comprises an epoxy (meth)acrylate oligomer and an urethane (meth)acrylate oligomer to form a resin matrix.
  • the combination of an epoxy (meth)acrylate oligomer and an urethane (meth)acrylate oligomer has the advantage that they provide required rigidity while being also flexible.
  • Suitable commercially available epoxy (meth)acrylate oligomers for use in the present invention include, but are not limited to CN104, CN131 B/CN, CN132 and CN159 from Arkema and Genomer 2259 from Rahn.
  • the epoxy (meth)acrylate oligomer may be present from 0.1 to 5% by weight of the total weight of the composition, preferably from 0.2 to 3%, and more preferably from 0.4 to 1 .5%
  • Suitable urethane (meth)acrylate oligomer for use in the present invention is preferably an aliphatic or aromatic urethane (meth)acrylate oligomer, more preferably an aliphatic urethane (meth)acrylate oligomer and even more preferably an aliphatic urethane di(meth)acrylate oligomer.
  • Suitable commercially available urethane (meth)acrylate oligomers for use in the present invention include but are not limited to CN966H90, CN1964 and CN981 from Arkema, APEX T from Henkel.
  • Urethane acrylates, and especially aliphatic urethane di(meth)acrylates are preferred because they have low Tg value, preferably Tg less than 15°C, and they can provide the desired flexibility to the composition.
  • the glass transition temperature is the onset temperature at which the cured resin changes from a glassy (solid) state to a soft, rubbery state: it can be considered the point at which a measurable reduction in physical properties occurs resulting from exposure to elevated temperatures.
  • the glass transition temperature is determined by dynamic mechanical thermal analysis (DMTA) using a TA Instruments Q800 DMA. Cured samples of the compositions - having dimensions of length 15.0 mm, width 5.0 mm and thickness 0.25 mm - were evaluated at a temperature range between -20 °C and 200 °C at a heating rate of 2 K/min.
  • a oscillatory force having a frequency of 1 Hz was applied at a controlled strain (0.1 %) to yield measures of stiffness and damping, reported as storage modulus (E’) and tan delta (tan 5).
  • the glass transition (Tg) is observed as a large drop in the storage modulus (E’) when viewed on a log scale against a linear temperature scale: a concurrent peak in the tan delta (tan 5) is also seen.
  • the urethane (meth)acrylate oligomer may be present from 5 to 20% by weight of the total weight of the composition, preferably from 7 to 18%, and more preferably from 9 to 15%.
  • the resulting composition may result in a very low filled formulation regarding electrically conductive filler, and conductivity properties may be negatively affected.
  • too low epoxy (meth)acrylate oligomer quantity may not provide required adhesion strength and this may also compromise damp heat reliability.
  • the electrically conductive composition according to the present invention comprises a monofunctional (meth)acrylate monomer and a difunctional (meth)acrylate monomer. These mono - and difunctional (meth)acrylate monomers act as a reactive diluent.
  • Suitable commercially available monofunctional (meth)acrylate monomers for use in the present invention include, but are not limited to SR256, SR489, SR395, SR440, SR335, SR285, SR423D, SR550 from Arkema; Miramer M170, M1084 from Miwon Specialty Chemical Co., Ltd., IBXA from Osaka Organic Chemical Ind.; Genomer 121 , Genomer 121 M from Rahn; and IBOA from Osaka Organic Chemical ltd.
  • the monofunctional (meth)acrylate monomer may be present from 3 to 15% by weight of the total weight of the composition, preferably from 3 to 14%, and more preferably from 4 to 13%.
  • the quantity of the combined monofunctional (meth)acrylate monomer and difunctional (meth)acrylate monomer is less than 6% there may not be a physical effect to the composition. On the other hand, if the quantity exceeds 30% the composition may be adversely affected: there may be out gassing, bleeding, and the viscosity of the composition may not be ideal. Further, too high monofunctional (meth)acrylate monomer quantity may lead shorter chains and decreased crosslinking, whereas too high quantity may compromise electrical performance.
  • composition according to the present invention may further comprise trifunctional (meth)acrylate monomer and/or a tetrafunctional (meth)acrylate monomer.
  • trifunctional (meth)acrylate monomer and/or a tetrafunctional (meth)acrylate monomer act also as a reactive diluent. Due to their high functionality, they provide higher cross-linking density and lead to an improved electrical performance and improved reliability performance.
  • Suitable trifunctional (meth)acrylate monomer and tetrafunctional (meth)acrylate monomer for use in the present invention may be selected from the group consisting of trimethyl propane triacrylate, trimethylol propane (EO)3 triacrylate, trimethylol propane (EO)g triacrylate, pentaerythritol triacrylate, penta erythritol tetraacrylate, di-trimethylolpropane triacrylate, ethoxylated penta erythritol tetraacrylate, neopentyl glycolpropoxylate diacrylate, polyethylene glycol 400 diacrylate, tetra(ethylene glycol) diacrylate, tripropyleneglycol diacrylate, hydroxyl pivalic neopentyl glycol diacrylate, tricyclodecane dimethanol diacrylate and mixtures thereof, preferably trifunctional (meth)acrylate monomer and tetrafunctional (meth)acrylate monomer is selected from the
  • trifunctional (meth)acrylate monomers and tetrafunctional (meth)acrylate monomers are preferred because they provide good compatibility with the system and improve electrical and reliability performance.
  • Suitable commercially available trifunctional (meth)acrylate monomer and tetrafunctional (meth)acrylate monomer for use in the present invention include but are not limited to SR444F and SR295 from Arkema, APEX T from Henkel.
  • the trifunctional (meth)acrylate monomer and/or tetrafunctional (meth)acrylate monomer may be present from 0.1 to 10% by weight of the total weight of the composition, preferably from 0.3 to 7%, and more preferably from 0.5 to 5%.
  • Silver flake particles are preferred and used because of their good electrical performance, and they provide improved volume packing and thus lower weight fractions are needed to reach percolation.
  • the quantity of the silver coated glass flakes and/or particles is less than 35% percolation threshold may not be achieved, whereas too high quantities may lead to rheology problems due to high-volume fraction.
  • Suitable peroxide for use in the present invention is selected from the group consisting of tert-butyl peroxy 2-ethylhexanoate, di-tert-butyl peroxide, tert-butyl peroxybenzoate, tert-butyl peroxyneodecanoate, 2,5-dimethyl-2,5(tert-butyl peroxy) hexane, dicumyl peroxide, tert-amyl- peroxyneodecanoate di(4-tert-butylcyclohexyl)peroxydicarbonate, di-sec-butyl peroxydicarbonate, diisopropyl peroxydicarbonate, di(2v-ethylhexyl)peroxydicarbonate, dicetyl peroxydicarbonate, dimyristyl peroxydicarbonate), butyl 4,4-di(tert-butylperoxy) valerate, 1 ,1-
  • Tert-butyl peroxyneodecanoate is one preferred peroxide because it has good compatibility with the composition, and it provides ideal fast curing speed.
  • An electrically conductive composition according to the present invention comprises a peroxide from 0.1 to 3% by weight of the total weight of the composition, preferably from 0.2 to 1 .5%.
  • the fluxing agent enables the removal of the non-noble metal oxides from the surface of a non-noble metal substrate, and therefore, improves the electrical connection and conductivity. Further, it prevents its re-formation process over the non-noble material, when the material is stored or used in oxidative environments, e.g. high temperature and/or high humidity.
  • Suitable fluxing agent for use in the present invention may be selected from the group consisting of lactic acid, methacrylic acid, acrylic acid, crotonic acid, fumaric acid, maleic acid trans- 2, 3 dimethylacrylic acid, 2,2-bis(hydroxymethyl)butyrate acid, trans-2-methyl-2-pentenoic acid, 2- methyl-3-butenoic acid, erucic acid, 2-hydroxyethyl methacrylate, 2-pyridinemethanol, 2-hydroxyethyl- 8-quinolinol, 5-hexenoic acid, 3-cyclohexene-1 -carboxylic acid, 1-cyclohexene-1 -carboxylic acid, 3- butenoic acid, trans-3-pentenoic acid, trans-2-pentenoic acid, 2-hydroxyethyl methacrylate phosphate, mono-2-(methacryloyloxy)ethyl maleate, 2-carboxyethyl acrylate, N-(2- hydroxyethyl)acrylamide,
  • Suitable commercially available fluxing agents for use in the present invention include, but are not limited to methacrylic acid, acrylic acid, crotonic acid and 2-methyl-8-quinolinol from Merck.
  • An electrically conductive composition according to the present invention comprises a fluxing agent from 0.1 to 20% by weight of the total weight of the composition, preferably from 0.5 to 12% and more preferably from 0.75 to 7.5%.
  • the quantity of the fluxing agent is less than 0.1 % all non-noble metal oxides may not be removed, whereas too high quantities may be detrimental to adhesion properties, conductivity, pot life, viscosity and mechanical properties.
  • An electrically conductive composition according to the present invention may be applied by using any of the following techniques time pressure dispense, jet dispense, auger dispense, stencil printing and screen printing.
  • the viscosity of the electrically conductive composition according to the present invention needs to be adjusted to be suitable for the selected application method.
  • viscosity tolerated for stencil or screen printing may be slightly higher than viscosity needed in dispensing method.
  • Optimizing rheology to make it suitable for the targeted application can be done by slightly increasing/decreasing the quantity of the acrylate monomers or by using small quantities of rheological additives.
  • the present invention relates to a cured product of the electrically conductive composition according to the present invention.
  • the composition according to the present invention may be cured thermally.
  • the electrically conductive adhesive according to the present invention having the required electrical and mechanical properties can be used in a shingled or ribbon-attached photovoltaic module wherein the crystalline silicon based solar singles are attached to each other by using the electrically conductive adhesive.
  • the present invention encompasses the use of the electrically conductive composition according to the present invention in a shingled photovoltaic module and a ribbon-attached photovoltaic modules.
  • the present invention encompasses the use of cured electrically conductive composition according to the present invention in a shingled photovoltaic module and a ribbon-attached photovoltaic modules.
  • the electrically conductive composition according to the present invention is used as an interconnection material in the photovoltaic module, wherein the solar cells are shingled.
  • a shingled structure is illustrated in figure 3.
  • the electrically conductive composition according to the present invention may be used to bond ribbons to the solar cells as shown in figure 2.
  • the electrically conductive composition according to the present invention can be applied by dispensing, jetting or printing to solar cells.
  • compositions are prepared by mixing all ingredients together to form a homogenous mixture.
  • Viscosity was measured on a Rheometer from TA instruments Rheometer HR-1 or Q-2000 using a plate-plate geometry with a 2 cm in diameter plate at a 200 micron gap and shear rates of 1 .5 s-1 or 15 s-1. Viscosity units are reported in Pa.s.
  • volume resistivity (VR) was measured as follows:
  • Samples were prepared for the compositions according to the examples above and deposited on a glass plate (by drawing down a strip of material onto the surface of a glass slide with strip dimensions of about 5 cm in length, 5 mm in width and about 50 micron in thickness) and cured and dried (according to the requirement for the used resin). Glass plates were cooled to room temperature, before measurement.
  • the electrical resistance of Cu and Ag ribbons was determined by contacting 7 Ag plated Cu tabs (1 mm wide, 1 micron Ag coating) or 7 Cu tabs (0.6 mm wide) to the test layer of a similar setup used for VR measurement, wherein the contact tabs exhibit similar distances between the contact tabs of approx. 5 mm.
  • the resistance between the neighbouring contact tabs was measured by using Keithley four- point probes and a Keithley 2750 multimeter and plotted as a function of the distance.
  • the total resistance value was determined as half of the intercept from the curve obtained from that plot (see Electrical contact resistance section below for graph reference).
  • the average total resistance (arithmetic average of two measurments) is reported in mohm. If no linear relation could be found because of bad ohmic contacts meaning an rsq value of less than 0.9, “no fit” was mentioned.
  • TLM test involves measuring ribbon resistance at different lengths. To determine the specific contact resistance an array of Ag or Cu ribbons was deposited on the surface of printed ECA deposits. The resistance between adjacent pads was measured, increasing accordingly with ribbons distance.
  • Rs is the sheet resistance
  • Z the width of ribbons
  • d is the distance between ribbons
  • Rc is the contact resistance
  • Rm is the resistance due to the contact metal.
  • volume resistivity, viscosity and contact resistance on silver and copper ribbons were tested and measured according to the test methods described above. The results are listed in table 2 below.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)

Abstract

La présente invention concerne un adhésif électroconducteur pour fixer des cellules solaires ensemble dans un module photovoltaïque en panneaux ou dans un module photovoltaïque fixé par ruban, l'adhésif fournissant la viscosité, l'adhérence et la conductivité électrique requises par l'usage de métaux non nobles tels que l'étain, l'alliage étain-plomb, l'alliage étain-plomb-bismuth et le cuivre.
PCT/EP2025/052870 2024-02-22 2025-02-05 Adhésif électroconducteur Pending WO2025176460A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP24159168 2024-02-22
EP24159168.4 2024-02-22

Publications (1)

Publication Number Publication Date
WO2025176460A1 true WO2025176460A1 (fr) 2025-08-28

Family

ID=90054029

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2025/052870 Pending WO2025176460A1 (fr) 2024-02-22 2025-02-05 Adhésif électroconducteur

Country Status (1)

Country Link
WO (1) WO2025176460A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09296158A (ja) * 1996-05-01 1997-11-18 Nippon Handa Kk 導電性接着剤
US6214460B1 (en) * 1995-07-10 2001-04-10 3M Innovative Properties Company Adhesive compositions and methods of use
CN1699492A (zh) * 2005-07-11 2005-11-23 大连轻工业学院 一种光固化导电胶及其制法
KR100972012B1 (ko) * 2009-07-28 2010-07-22 주식회사 동진쎄미켐 태양전지 전극형성방법
CN106531285A (zh) * 2016-11-03 2017-03-22 广州市尤特新材料有限公司 一种紫外光固化导电银浆、其制备方法及应用
US20210139750A1 (en) * 2018-04-26 2021-05-13 Henkel Ag & Co. Kgaa Electrically conductive adhesive for attaching solar cells
CN108610745B (zh) * 2018-05-10 2021-07-16 广东希贵光固化材料有限公司 一种用于pet膜的led固化导电油墨

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6214460B1 (en) * 1995-07-10 2001-04-10 3M Innovative Properties Company Adhesive compositions and methods of use
JPH09296158A (ja) * 1996-05-01 1997-11-18 Nippon Handa Kk 導電性接着剤
CN1699492A (zh) * 2005-07-11 2005-11-23 大连轻工业学院 一种光固化导电胶及其制法
KR100972012B1 (ko) * 2009-07-28 2010-07-22 주식회사 동진쎄미켐 태양전지 전극형성방법
CN106531285A (zh) * 2016-11-03 2017-03-22 广州市尤特新材料有限公司 一种紫外光固化导电银浆、其制备方法及应用
US20210139750A1 (en) * 2018-04-26 2021-05-13 Henkel Ag & Co. Kgaa Electrically conductive adhesive for attaching solar cells
CN108610745B (zh) * 2018-05-10 2021-07-16 广东希贵光固化材料有限公司 一种用于pet膜的led固化导电油墨

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