WO2025171741A1 - Atomization chamber and atomization device - Google Patents

Abstract

An atomization chamber (100) and an atomization device (1000). The atomization chamber (100) comprises a chamber bottom (10) and a chamber wall (30), wherein the chamber wall (30) and the chamber bottom (10) define an accommodating cavity (50). The chamber bottom (10) comprises a substrate (11) and a functional film layer (13); a heating electrode layer (131) of the functional film layer (13) comprises heating bodies (1311) and electrodes (1313); in a depth direction (Y) of the accommodating cavity (50), the heating bodies (1311) are located between the substrate (11) and the chamber wall (30); the heating bodies (1311) each have a mounting surface (13111); the mounting surface (13111) is exposed to the outside; and the electrodes (1313) are arranged outside the substrate (11) and are connected to the mounting surfaces (13111).

Description

Atomizing pot and atomizing device

Priority information

This application claims priority and benefits of patent application No. 2024202956199 filed with the State Intellectual Property Office of China on February 18, 2024, and the entire text of which is incorporated herein by reference.

Technical Field

The present application relates to the field of atomization technology, and more specifically, to an atomizing pot and an atomizing device.

Background Art

An atomizer is a small device that uses heat-not-burn (HNB) technology to act on an aerosol-generating substrate and generate aerosol. Currently, some atomizers use an atomizer pot to heat the aerosol-generating substrate. The heating circuit is typically located on the inner surface of the pot bottom, and electrodes located on the inner surface of the pot bottom are connected by drilling holes in the pot bottom. However, this requires additional holes in the pot bottom to connect the electrodes, making the atomizer pot manufacturing process more complex. For example, drilling and alignment steps are required, further complicating the manufacturing process of the atomizer device.

Summary of the Invention

Embodiments of the present application provide an atomizing pot and an atomizing device.

The atomizer provided in the embodiment of the present application includes a pot bottom and a pot wall, the pot wall extends from the periphery of the pot bottom and together with the pot bottom forms a accommodating cavity, the accommodating cavity is used to accommodate an aerosol generating matrix; the pot bottom includes a base and a functional film layer arranged on the base, the functional film layer includes a heating electrode layer, the heating electrode layer includes a heating element and an electrode, in the depth direction of the accommodating cavity, the heating element is located between the base and the pot wall, the heating element is provided with a mounting surface, the mounting surface is exposed to the outside world, the electrode is arranged on the outside of the base and connected to the mounting surface.

In certain embodiments, the heating element protrudes relative to at least one of the base and the pot wall to form a protrusion, and the mounting surface is any surface of the protrusion exposed to the outside.

In certain embodiments, the outer side surface of the heating element is flush with the outer side surface of the base and the outer side surface of the pot wall, and the mounting surface is the outer side surface of the heating element.

In certain embodiments, the functional film layer includes at least two layers, and the thickness of each functional film layer is in the range of [5 μm, 200 μm].

In certain embodiments, the pot wall is made of ceramic material.

In some embodiments, the functional film layer further includes a protective layer. In the depth direction of the accommodating cavity, the protective layer is located between the heating element and the pot wall, and the protective layer covers the heating element.

In certain embodiments, the substrate is made of a ceramic material.

In some embodiments, the thickness of the substrate ranges from [0.3 mm to 3 mm].

In some embodiments, the substrate is made of a metal material, and the functional film layer further includes a first insulating layer and a second insulating layer. In the depth direction of the accommodating cavity, the first insulating layer, the substrate, the second insulating layer, the heating element, the protective layer and the pot wall are arranged in sequence.

In some embodiments, the thickness of the substrate ranges from [0.1 mm, 1 mm].

The atomization device provided in the embodiments of the present application includes the atomization pot described in any one of the above embodiments.

The pot bottom of the atomizing pot and the atomizing device of the present application includes a substrate and a functional film layer, the functional film layer includes a heating electrode layer, the heating electrode layer includes a heating element and an electrode, and in the depth direction of the accommodating cavity, the heating element is located between the substrate and the pot wall, so that compared with the atomizing pot in which the substrate is located between the heating element and the pot wall, the atomizing pot of the present application can reduce the distance between the heating element and the aerosol generating matrix to reduce heat loss during heat transfer, thereby improving thermal efficiency. At the same time, the heating element is provided with a mounting surface exposed to the outside world, and the electrode is arranged on the outside of the substrate and connected to the mounting surface, so that the electrode can be led out to the outside world without passing through any components. In this way, the electrode can be led out without drilling holes in the bottom of the pot, which can simplify the manufacturing process of the atomizing pot and thus simplify the manufacturing process of the atomizing device.

Additional aspects and advantages of the embodiments of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the embodiments of the present application.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and/or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

FIG1 is a perspective schematic diagram of an atomizing pot according to some embodiments of the present application;

FIG2 is a schematic cross-sectional view of the atomizing pot shown in FIG1 ;

FIG3 is a cross-sectional schematic diagram of an atomizing pot according to certain embodiments of the present application;

FIG4 is a cross-sectional schematic diagram of an atomizing pot according to certain embodiments of the present application;

FIG5 is a cross-sectional schematic diagram of an atomizing pot according to certain embodiments of the present application;

FIG6 is a schematic cross-sectional view of an atomizing pot according to certain embodiments of the present application;

FIG7 is a perspective schematic diagram of an atomization device according to some embodiments of the present application.

DETAILED DESCRIPTION

The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions from beginning to end. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the embodiments of the present application, and should not be understood as limiting the embodiments of the present application.

In the description of the present application, it should be understood that the terms "thickness", "upper", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.

In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. In an example, it can be a fixed connection, or a detachable connection, or an integral connection; it can be a mechanical connection, or an electrical connection, or can communicate with each other; it can be a direct connection, or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements.

In the embodiments of the present application, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

Referring to FIG. 1 , an atomizer 100 provided in an embodiment of the present application includes a base 10 and a wall 30 . The wall 30 extends from the periphery of the base 10 and, together with the base 10, forms a housing 50 for accommodating an aerosol-generating substrate. The base 10 includes a substrate 11 and a functional film layer 13 disposed on the substrate 11 . The functional film layer 13 includes a heating electrode layer 131 . The heating electrode layer 131 includes a heating element 1311 and an electrode 1313 . In the depth direction Y of the housing 50 , the heating element 1311 is located between the substrate 11 and the wall 30 . The heating element 1311 is provided with a mounting surface 13111 , which is exposed to the outside world. The electrode 1313 is disposed on the outside of the substrate 11 and connected to the mounting surface 13111 .

Specifically, an aerosol-generating substrate is an element capable of generating an aerosol. Specifically, the aerosol-generating substrate can be converted into fine particles by heating or ultrasonic vibration and mixed with air to form an aerosol. The aerosol-generating substrate can be in a solid or liquid state. Aerosols can be visible or invisible and can include vapor (e.g., fine particulate matter in a gaseous state, which is typically liquid or solid at room temperature) and liquid droplets of gas and condensed vapor.

The atomizing pot 100 is a structure having a cavity (i.e., a accommodating cavity 50) for accommodating other components. For example, an aerosol generating matrix can be provided in the accommodating cavity 50 so that the atomizing pot 100 can heat the aerosol generating matrix. The atomizing pot 100 includes a pot bottom 10 and a pot wall 30. The pot wall 30 and the pot bottom 10 together form a accommodating cavity 50 so that the aerosol generating matrix can be soluted in the accommodating cavity 50. The cross-sectional shape of the pot bottom 10 can be square, circular, triangular, etc. The cross-sectional shape of the pot bottom 10 will affect the shape of the accommodating cavity 50. When the cross-sectional shape of the pot bottom 10 is square, the shape of the accommodating cavity 50 is a cube or a cuboid; when the cross-sectional shape of the pot bottom 10 is circular, the shape of the accommodating cavity 50 is a cylinder; when the cross-sectional shape of the pot bottom 10 is triangular, the shape of the accommodating cavity 50 is a triangular prism.

In some embodiments, the pot wall 30 and pot bottom 10 can be formed separately, that is, the pot wall 30 and pot bottom 10 are manufactured separately and then sintered into a single piece via a bonding layer at the contact point between the pot wall 30 and the pot bottom 10. In other embodiments, the pot wall 30 and pot bottom 10 can be manufactured by first forming the pot bottom 10, and then forming the pot wall 30 on the pot bottom 10 based on the pot bottom 10; or first forming the pot wall 30, and then forming the pot bottom 10 on the pot wall 30 based on the pot wall 30.

The pot bottom 10 comprises a base 11 and a functional film layer 13 disposed on the base 11. The base 11 is the main body of the pot bottom 10 and is responsible for bearing the primary load. The functional film layer 13 can include one, two, or multiple layers, each with a specific function, enabling the pot bottom 10 to achieve a specific effect.

The functional film layer 13 includes a heating electrode layer 131, and the heating electrode layer 131 includes a heating element 1311 and an electrode 1313. The heating element 1311 can convert electrical energy into thermal energy when working, and transfer the thermal energy outward mainly in the form of radiation to heat the aerosol generating matrix. For example, the heating element 1311 includes a substrate 13115 and a heating film 13117, and the heating film 13117 is covered on the substrate 13115, and the heating film 13117 is used to generate heat. The electrode 1313 is used to electrically connect the heating element 1311 to the battery so that the battery provides electrical energy to the heating element 1311 to make it generate heat, wherein the electrode 1313 can be welded to the heating element 1311 to ensure that the electrode 1313 and the heating element 1311 can be stably connected, thereby improving the stability of the electrical conduction between the heating element 1311 and the battery. In addition, the upper and lower surfaces of the base 11 and the heating element 1311 are both flat, and no uneven structure will be formed after the two are combined, which can ensure that the aerosol generating matrix can be spread out completely and fully contact the heating element 1311 or the transmission source through the heating element 1311.

At least one end of the electrode 1313 needs to be exposed to the outside world so that the electrode 1313 can be connected to the outside world, for example, the electrode 1313 can be connected to a battery so that the electrode 1313 can supply power to the heating element 1311. Therefore, the heating element 1311 is provided with a mounting surface 13111 exposed to the outside world, for example, the outer side surface of the heating element 1311 serves as the mounting surface 13111, or the heating element 1311 protrudes from the base 11, and the surface exposed to the outside world in the protruding structure can serve as the mounting surface 13111. One end of the electrode 1313 is connected to the mounting surface 13111, and the entire electrode 1313 is arranged outside the base 11, so that the electrode 1313 can be led to the outside world without passing through any components.

Please refer to Figure 7. The electrode 1313 exposed to the outside world can be directly connected to the external power supply device 500, such as a battery. When the power supply device 500 is started, the electrical energy enters the heating element 1311 through the electrode 1313. Then, the heating element 1311 can convert the electrical energy into thermal energy and transfer the generated heat to the aerosol generating matrix. In the depth direction Y of the accommodating cavity 50, the heating element 1311 is located between the base 11 and the pot wall 30. Therefore, compared with the atomizer in which the base is located between the heating element and the pot wall, the heating element 1311 of the atomizer 100 of the present application can be closer to the aerosol generating matrix, so that the heat energy generated by the heating element 1311 can act on the aerosol generating matrix faster, reducing heat loss during the heat energy transfer process and improving thermal efficiency.

At present, there are two main types of atomizers used to heat aerosol-generating substrates. In one type of atomizer, the substrate is located between the heating element and the pot wall, and in another type of atomizer, the heating element is located between the substrate and the pot wall.

For an atomizer with a base located between the heating element and the pot wall, the atomizer can be divided into an integrated ceramic-based atomizer or an integrated metal-based atomizer. However, ceramic-based atomizers have problems such as low thermal efficiency and easy cracking of the pot body. A lot of heat in metal-based atomizers will be transferred to the pot wall through the bottom of the pot and dissipated by the pot wall and wasted. There is also the problem of low thermal efficiency. In addition, the preparation process of the metal-based atomizer is complicated (in order to pass the salt spray test, the inner and outer walls of the metal-based atomizer need to be fully coated). The heating element 1311 of the atomizer 100 of the present application is located between the base 11 and the pot wall 30, which can reduce the distance between the heating element 1311 and the aerosol generating matrix. The heat generated by the heating element 1311 can be quickly transferred to the aerosol generating matrix, thereby reducing heat loss during heat transfer to improve thermal efficiency.

For an atomizer pot in which the heating element is located between the base and the pot wall, the electrode is usually led out by punching a through hole in the bottom of the pot, but this additional punching operation will make the manufacturing process of the atomizer pot more complicated. For example, in the case where the heating element is bent and passes through the through hole, it is also necessary to realize the positioning of the heating element and the through hole to ensure that the heating element can be bent at the appropriate position so that the bent heating element can pass through the through hole smoothly. At the same time, when the heating element is a bent structure, the bent structure will cause the structure of the heating element to be less stable, which may easily cause the heating element to break and affect the normal operation of the heating element. When the heating element is a flat structure, the electrode is welded to the heating element through the through hole. At this time, it is necessary to realize the positioning of the electrode and the through hole, and weld the electrode to the heating element after the positioning is completed, which makes the manufacturing process of the atomizer pot more complicated.

In the atomizer pot 100 of the present application, the heating element 1311 is provided with a mounting surface 13111 exposed to the outside world. The electrode 1313 can be connected to the mounting surface 13111 without passing through any components. This ensures that the atomizer pot 100 can function normally without drilling holes in the pot bottom 10 of the present application, thereby simplifying the manufacturing process of the atomizer pot 100. At the same time, because the mounting surface 13111 of the heating element 1311 is exposed to the outside world, the heating element 1311 can be a flat structure, that is, the heating element 1311 does not need to be bent, making the structure of the heating element 1311 of the present application more stable. The manufacturing process of the flat heating element 1311 is simpler than that of the bent heating element 1311. Therefore, the manufacturing process of the atomizer pot 100 can be further simplified.

The pot bottom 10 of the atomizer pot 100 of the embodiment of the present application includes a base 11 and a functional film layer 13. The functional film layer 13 includes a heating electrode layer 131. The heating electrode layer 131 includes a heating element 1311 and an electrode 1313. In the depth direction Y of the accommodating cavity 50, the heating element 1311 is located between the base 11 and the pot wall 30. Compared with the atomizer pot in which the base is located between the heating element and the pot wall, the atomizer pot 100 of the present application can reduce the distance between the heating element 1311 and the aerosol generating matrix, thereby reducing heat loss during heat transfer and improving thermal efficiency. At the same time, the heating element 1311 is provided with a mounting surface 13111 exposed to the outside world. The electrode 1313 is arranged on the outside of the base 11 and connected to the mounting surface 13111, so that the electrode 1313 can be led to the outside world without passing through any components. In this way, the electrode 1313 can be led out without drilling a hole in the pot bottom 10 , which can simplify the manufacturing process of the atomizing pot 100 and thus simplify the manufacturing process of the atomizing device 1000 .

In certain embodiments, the mounting surface 13111 may have a variety of structures. In some embodiments, the heating element 1311 protrudes relative to at least one of the base 11 and the pot wall 30 to form a protrusion 13113, and the mounting surface 13111 is any surface of the protrusion 13113 exposed to the outside. For example, referring to FIG3 , the heating element 1311 protrudes relative to the base 11 to form the protrusion 13113. In this case, the outer side surface of the protrusion 13113 and the surface facing the base 11 can both serve as the mounting surface 13111. For another example, referring to FIG4 , the heating element 1311 protrudes relative to the pot wall 30 to form the protrusion 13113. In this case, the outer side surface of the protrusion 13113 and the surface facing the pot wall 30 can both serve as the mounting surface 13111. For another example, referring to FIG. 2 , the heating element 1311 protrudes from the base 11 and the pot wall 30 to form a protrusion 13113 . At this time, the outer side surface of the protrusion 13113 , the surface facing the pot wall 30 and the surface facing the base 11 can both serve as the mounting surface 13111 .

In other embodiments, please refer to Figure 5, the outer side surface of the heating element 1311 is flush with the outer side surface of the base 11 and the outer side surface of the pot wall 30, the mounting surface 13111 is the outer side surface of the heating element 1311, and the electrode 1313 can be directly installed on the outer side surface of the heating element 1311, so that the manufacturing process of the atomizer pot 10 can be further simplified.

In this way, the heating element 1311 can be exposed to the outside world in various forms with the mounting surface 13111, ensuring that the electrode 1313 can be exposed to the outside world without passing through any components, thereby simplifying the manufacturing process. In addition, whether the heating element 1311 forms a protrusion 13113 or the outer side of the heating element 1311 is flush with the outer side of the base 11 and the outer side of the pot wall 30, the heating element 1311 does not need to be bent, and the heating element 1311 has a flat structure, making the structure of the heating element 1311 more stable than a bent heating element 1311.

Referring to Figures 1 and 7 , in certain embodiments, the pot wall 30 is made of a ceramic material, such as silicon oxide or zirconium oxide. It will be appreciated that ceramic has lower thermal conductivity than metal, and heat energy generated by the pot bottom 10 can be conducted to the pot wall 30. A metal pot wall 30 would cause the heat energy generated by the pot bottom 10 to be rapidly conducted to other locations, such as other components of the atomization device 1000. Therefore, compared to a metal pot wall 30, a ceramic pot wall 30 can reduce the amount of heat energy conducted to other components, thereby reducing heat loss.

Please refer to Figure 2. In some embodiments, the functional film layer 13 includes at least two layers. The thickness of each functional film layer 13 is in the range of [5μm, 200μm]. For example, the thickness of each functional film layer 13 may be 5μm, 17μm, 45μm, 72μm, 100μm, 132μm, 157μm, 179μm, 195μm or 200μm. If the thickness of a layer is less than 5μm, it means that the layer is too thin. When the functional film layer 13 is too thin, it is easy to cause the layer to have a partial area missing, making it difficult to form a preset shape. If the thickness of a layer is greater than 200μm, it means that the layer is too thick. When the functional film layer 13 is too thick, it will cause heat to have difficulty passing through the functional film layer 13 and acting on the aerosol generating matrix, resulting in a low thermal efficiency of the atomizer 100. In this way, the thickness of each functional film layer 13 is limited to a reasonable range of [5 μm, 200 μm]. On the one hand, it can ensure that the functional film layer 13 can form a preset shape, and on the other hand, it can reduce heat loss during heat transfer, so that the heat generated by the heating element 1311 can be quickly transferred to the aerosol generating matrix.

More specifically, in some embodiments, the functional film layer 13 further includes a protective layer 133. In the depth direction Y of the accommodating cavity 50, the protective layer 133 is located between the heating element 1311 and the pot wall 30, and the protective layer 133 covers the heating element 1311. The protective layer 133 is used to prevent the heating element 1311 from directly contacting the aerosol generating matrix, thereby preventing products generated after heating the aerosol generating matrix, such as residues, from damaging the heating element 1311. The protective layer 133 can be made of a material with a low friction coefficient, such as polytetrafluoroethylene, to form a non-stick layer on the surface of the heating element 1311, thereby facilitating the cleaning of the atomizer pot 100. For another example, the protective layer 133 can be made of an insulating material, such as a glass protective glaze layer, to prevent the electrical energy provided by the electrode 1313 from being transmitted to the pot wall 30, thereby ensuring electrical safety. For another example, the protective layer 133 may be made of an anti-corrosion material, such as polyurethane, to prevent corrosive substances in the product generated after heating the aerosol-generating matrix from damaging the heating element 1311, while also facilitating the atomizer 100 to pass the salt spray test.

If the protective layer 133 is too thin, the protective layer 133 will not be able to completely cover the heating element 1311, which may cause the product produced after heating the aerosol generating matrix to damage the heating element 1311. If the protective layer 133 is too thick, it may cause the heat energy generated by the heating element 1311 to have difficulty passing through the protective layer 133, resulting in a large amount of heat energy loss. Therefore, the thickness of the protective layer 133 can also be in the range of [5μm, 200μm]. For example, the thickness of the protective layer 133 can be 5μm, 39μm, 60μm, 87μm, 105μm, 128μm, 146μm, 186μm, 193μm or 200μm. In this way, on the one hand, it can ensure that the protective layer 133 can cover the entire heating element 1311, and on the other hand, it can reduce heat loss.

In certain embodiments, the substrate 11 may be made of a ceramic material, such as silicon oxide, or a metal material, such as 430 stainless steel. When the substrate 11 is made of metal, the substrate 11 has a high structural strength, is not easily damaged, and has a long service life. When the substrate 11 is made of ceramic, the substrate 11 has a high hardness, is not easily deformed, has good corrosion resistance, and has a long service life.

Referring to Figure 2 , when the base 11 is made of a ceramic material, the base 11, heating element 1311, protective layer 133, and pot wall 30 are arranged in sequence along the depth direction Y of the accommodating cavity 50. The heat energy generated by the heating element 1311 can heat the aerosol-generating matrix within the accommodating cavity 50 via the protective layer 133. Due to the low thermal conductivity of ceramic materials, only a small portion of the heat energy generated by the heating element 1311 is transferred to the outside world through the ceramic material. The majority of the heat energy is transferred to the protective layer 133 and ultimately to the aerosol-generating matrix, thus ensuring minimal heat loss. Furthermore, since ceramic materials are non-conductive, the electrical energy provided by the electrode 1313 is not transferred to the outside world via the base 11. Therefore, an insulating layer is not required within the base 11 to ensure electrical safety. Thus, when the base 11 is made of a ceramic material, the structure of the functional film layer 13 can be relatively simple, consisting only of the protective layer 133 and the heating electrode layer 131, greatly simplifying the manufacturing process of the pot bottom 10.

In addition, when the substrate 11 is made of ceramic material, the thickness of the substrate 11 has a value range of [0.3mm, 3mm]. For example, the thickness of the substrate 11 may be 0.3mm, 0.48mm, 0.83mm, 1.05mm, 1.27mm, 1.64mm, 1.88mm, 2.0mm, 2.35mm, 2.76mm or 3mm. When the thickness of the substrate 11 is less than 0.3mm, for example, 0.21mm, it means that the substrate 11 is too thin, and too thin ceramics are more likely to crack. When the thickness of the substrate 11 is greater than 3mm, for example, 3.6mm, it means that the substrate 11 is too thick, and too thick ceramics are more likely to lead to lower thermal efficiency. In this way, limiting the thickness of the ceramic substrate 11 to within a reasonable range of [0.3mm, 3mm] can ensure the safety of the substrate 11 on the one hand, and ensure that the thermal efficiency of the atomizer 100 is not low on the other hand.

Referring to Figure 6 , when the substrate 11 is made of a metal material, the functional film layer 13 further includes a first insulating layer 135 and a second insulating layer 137 . In the depth direction Y of the accommodating cavity 50, the first insulating layer 135, substrate 11, second insulating layer 137, heating element 1311, protective layer 133, and pot wall 30 are sequentially arranged. The heat energy generated by the heating element 1311 can pass through the protective layer 133 to heat the aerosol-generating substrate within the accommodating cavity 50. Metal materials absorb and dissipate heat quickly, and the use of a metal substrate 11 ensures that the heat energy generated by the heating element 1311 is quickly transferred to the protective layer 133 and ultimately to the aerosol-generating substrate. The metal substrate 11 is conductive. In the depth direction Y of the accommodating cavity 50, the insulating layers provided on both sides of the substrate 11 prevent the electrical energy provided by the electrodes 1313 from being transmitted into the substrate 11 and thus to the outside of the atomizer pot 100. With the dual protection of the two insulating layers, the entire surface of the atomizer pot 100 is guaranteed to be free of electrical charge, thereby ensuring the safe use of the atomizer pot 100. Therefore, when the substrate 11 is made of metal, the functional film layer 13 also needs to include an insulating layer to ensure the normal operation of the atomizer pot 100 while improving its safety.

At the same time, when the base 11 is made of metal material, the thickness of the base 11 has a value range of [0.1mm, 1mm]. For example, the thickness of the base 11 may be 0.1mm, 0.16mm, 0.23mm, 0.35mm, 0.44mm, 0.58mm, 0.67mm, 0.72mm, 0.88mm, 0.93mm or 1mm. When the thickness of the base 11 is less than 0.1mm, for example, 0.05mm, it means that the base 11 is too thin, and too thin metal is more likely to deform and bend, causing the bottom of the pot 10 to deform easily, thereby affecting the normal operation of the atomizer pot 100. When the thickness of the base 11 is greater than 3mm, for example, 3.6mm, it means that the base 11 is too thick, and too thick metal leads to lower thermal efficiency. In this way, limiting the thickness of the metal substrate 11 to a reasonable range of [0.1 mm, 1 mm] can ensure the structural stability of the substrate 11 on the one hand, and ensure that the thermal efficiency of the atomizer 100 is not low on the other hand.

In this manner, the heating element 1311 is positioned between the base 11 and the pot wall 30. The thickness and laminated structure of the functional film layer 13 allow the heat generated by the heating element 1311 to be more effectively applied to the aerosol-generating matrix. Furthermore, the heating element 1311 covers the entire base 11, creating a relatively uniform temperature field and ensuring uniform heating of all parts of the aerosol-generating matrix. Furthermore, the base 11 can be made of metal or ceramic, and the pot wall 30 is made of ceramic, making the atomizer 100 relatively strong, thus enhancing thermal shock resistance and reliability.

1 and 7 , the atomization device 1000 provided in the embodiment of the present application includes the atomization pot 100 described in any one of the above embodiments.

Specifically, the atomizing device 1000 is a structure capable of generating aerosol by acting on an aerosol-generating substrate through resistance heating, electromagnetic heating, microwave heating, laser irradiation, infrared light irradiation, ultrasound or mechanical vibration.

The atomizing device 1000 may further include a housing 300, which houses the atomizing pot 100. The aerosol-generating substrate is placed within the atomizing pot 100. The electrodes 1313 of the atomizing pot 100 are exposed to the outside world. Connecting the electrodes 1313 to the power supply 500 allows the atomizing pot 100 to heat the aerosol-generating substrate to generate an aerosol. Of course, the atomizing device 1000 may further include a power supply 500, which is connected to the electrodes 1313 and is used to provide electrical energy to the heating element 1311, thereby facilitating the atomizing pot 100 to heat the aerosol-generating substrate and generate an aerosol. The material of the housing 300 may be, but is not limited to, metal, plastic, or ceramic. When the material of the shell 300 is metal, the structural strength of the shell 300 is high, it is not easy to be damaged, and the service life is long; when the material of the shell 300 is plastic, the weight of the shell 300 is light, it is easy to carry, and the cost is low; when the material of the shell 300 is ceramic, the hardness of the shell 300 is high, it is not easy to deform, and it has good corrosion resistance and a long service life.

Since the mounting surface 13111 of the heating element 1311 is exposed to the outside world, one end of the electrode 1313 is connected to the mounting surface 13111, and the entire electrode 1313 is located outside the substrate 11, the electrode 1313 can be connected to the power supply device 500 without passing through any components. When the power supply device 500 starts to supply power, the electric energy can reach the heating element 1311 through the electrode 1313, so that the heating element 1311 can start to generate heat. The heat generated by the heating element 1311 will pass through the functional film layer 13 and heat the aerosol generating matrix. In this way, on the one hand, it can ensure that the electrode 1313 and the power supply device 500 can be smoothly connected, thereby ensuring the normal operation of the atomizer 100, and on the other hand, it simplifies the manufacturing process of the atomizer 100, thereby simplifying the manufacturing process of the atomizer 1000.

Among them, the heating element 1311 is located between the base 11 and the pot wall 30 in the depth direction Y of the accommodating cavity 50. It can be understood that if the base is located between the heating element and the pot wall, that is, the heating element is exposed to the outside world, then part of the heat energy generated by the heating element 1311 will be directly transferred to other components of the atomization device, such as to the battery, resulting in a large amount of heat loss, and the heat transferred to other components may also affect the safety of use of other components. In this way, compared with the atomization pot in which the base is located between the heating element and the pot wall, the heating element 1311 of the atomization pot 100 of the present application is not exposed to the outside world, so that more of the heat energy generated by the heating element 1311 is transferred to the aerosol generating matrix, reducing the heat transferred to other components and reducing heat loss, while also ensuring the safety of use of other components.

The pot bottom 10 of the atomizing pot 100 of the atomizing device 1000 of the embodiment of the present application includes a base 11 and a functional film layer 13, the functional film layer 13 includes a heating electrode layer 131, and the heating electrode layer 131 includes a heating element 1311 and an electrode 1313. In the depth direction Y of the accommodating cavity 50, the heating element 1311 is located between the base 11 and the pot wall 30. Compared with the atomizing pot 100 in which the base 11 is located between the heating element 1311 and the pot wall 30, the atomizing pot 100 of the present application can reduce the distance between the heating element 1311 and the aerosol generating matrix to reduce heat loss during heat transfer. At the same time, the heating element 1311 is provided with a mounting surface 13111 exposed to the outside world, and the electrode 1313 is arranged on the outside of the base 11 and connected to the mounting surface 13111, so that the electrode 1313 can be led to the outside world without passing through any components. In this way, the electrode 1313 can be led out without drilling a hole in the pot bottom 10 , which can simplify the manufacturing process of the atomizing pot 100 and thus simplify the manufacturing process of the atomizing device 1000 .

Throughout this specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with an embodiment or example is included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Thus, a feature specified as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, "plurality" means at least two, for example, two or three, unless otherwise specifically defined.

Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are illustrative and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims (10)

An atomizing pot, comprising: pot bottom; and The pot wall extends from the periphery of the pot bottom and together with the pot bottom forms a receiving cavity, and the receiving cavity is used to receive an aerosol generating matrix; the pot bottom includes a substrate and a functional film layer arranged on the substrate, the functional film layer includes a heating electrode layer, and the heating electrode layer includes a heating element and an electrode. In the depth direction of the receiving cavity, the heating element is located between the substrate and the pot wall, and the heating element is provided with a mounting surface, which is exposed to the outside world. The electrode is arranged on the outside of the substrate and connected to the mounting surface. The atomizer according to claim 1, wherein the heating element protrudes relative to at least one of the base and the pot wall to form a protrusion, and the mounting surface is any surface of the protrusion exposed to the outside; or The outer side surface of the heating element is flush with the outer side surface of the base and the outer side surface of the pot wall, and the mounting surface is the outer side surface of the heating element. The atomizing pot according to claim 1, wherein the functional film layer comprises at least two layers, and the thickness of each functional film layer is in the range of [5 μm, 200 μm]. The atomizing pot according to claim 1, wherein the pot wall is made of ceramic material. The atomizing pot according to claim 1, wherein the functional film layer further comprises a protective layer, and in the depth direction of the accommodating cavity, the protective layer is located between the heating element and the pot wall, and the protective layer covers the heating element. The atomizing pot according to claim 5, wherein the base is made of ceramic material. The atomizing pot according to claim 6, wherein the thickness of the substrate is in the range of [0.3 mm, 3 mm]. The atomizing pot according to claim 5, wherein the base is made of a metal material, the functional film layer further comprises a first insulating layer and a second insulating layer, and in the depth direction of the accommodating cavity, the first insulating layer, the base, the second insulating layer, the heating element, the protective layer and the pot wall are arranged in sequence. The atomizing pot according to claim 8, wherein the thickness of the substrate is in the range of [0.1 mm, 1 mm]. An atomizing device, comprising: The atomizer according to any one of claims 1 to 9.