WO2025170854A1

WO2025170854A1 - Dispensing system configured with an acoustic device to manipulate dispensing fluid and processes of implementing the dispensing system

Info

Publication number: WO2025170854A1
Application number: PCT/US2025/014278
Authority: WO
Inventors: Cutler Crowell
Original assignee: Nordson Corp
Current assignee: Nordson Corp
Priority date: 2024-02-05
Filing date: 2025-02-03
Publication date: 2025-08-14
Anticipated expiration: 2026-08-05

Abstract

A fluid dispensing system includes a dispenser that includes a nozzle configured to dispense a fluid material to form an initial fluid portion for placement in and/or on a dispense location; and an acoustic processing system configured to manipulate the initial fluid portion to form a modified fluid material and/or a displaced fluid material. The fluid dispensing system moreover includes where the dispenser and/or the acoustic processing system are configured to place the modified fluid material and/or a displaced fluid material at the dispense location and form a deposited fluid material and/or to form a distributed fluid portion.

Description

DISPENSING SYSTEM CONFIGURED WITH AN ACOUSTIC DEVICE TO MANIPULATE DISPENSING FLUID AND PROCESSES OF IMPLEMENTING THE DISPENSING SYSTEM

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001 ] This application claims the benefit from U.S. Provisional Application No. 63/549,768 filed on February 5, 2024, which is hereby incorporated by reference in its entirety for all purposes as if fully set forth herein.

FIELD OF THE DISCLOSURE

[0002] The disclosure relates to a dispensing system configured with an acoustic device to manipulate dispensing fluid. Further, the disclosure relates to processes for implementing a dispensing system configured with an acoustic device to manipulate dispensing fluid. The disclosure further relates to a dispensing system configured with an acoustic device to provide thin-stream high-flowrate dispensing. Further, the disclosure relates to processes for implementing a dispensing system configured with an acoustic device to provide thin-stream high-flowrate dispensing.

BACKGROUND OF THE DISCLOSURE

[0003] Manufacturer of numerous devices require dispensing of materials such as underfill materials, adhesive materials, coating materials, potting materials, encapsulation materials, and/or the like. For example, electronic devices may implement such materials during manufacture to hold components together and provide resistance to moisture, corrosive agents, shock, vibration, and/or the like. In this regard, these materials are typically applied by a dispensing device in the manufacture of the electronic devices.

[0004] However, there is a trend to reduce the size of the electronic devices and/or increasing a size of the components of the electronic devices. This results in the need to apply the materials in smaller areas. However, there are physical limitations to dispensing the materials in smaller areas while still being able to quickly dispense the materials.

[0005] Accordingly, there is a need for a device and process to quickly dispense materials in smaller areas of components and/or between components.

SUMMARY OF THE DISCLOSURE [0006] The foregoing needs are met, to a great extent, by the disclosure, wherein a dispensing system configured with an acoustic device to provide manipulation of dispensing fluid and processes of implementing a dispensing system configured with an acoustic device to provide manipulation of dispensing fluid are provided. The foregoing needs are further met, to a great extent, by the disclosure, wherein a dispensing system configured with an acoustic device to provide thin-stream high-flowrate dispensing and processes of implementing the same is provided.

[0007] In one aspect, a fluid dispensing system includes a dispenser that includes a nozzle configured to dispense a fluid material to form an initial fluid portion for placement in and/or on a dispense location. The fluid dispensing system in addition includes an acoustic processing system configured to manipulate the initial fluid portion to form a modified fluid material. The fluid dispensing system moreover includes where the dispenser and/or the acoustic processing system are configured to place the modified fluid material at the dispense location and form a deposited fluid material.

[0008] In one aspect, a fluid dispensing system includes a dispenser that includes a nozzle configured to dispense a fluid material to form an initial fluid portion for placement in and/or on a dispense location. The fluid dispensing system in addition includes an acoustic processing system configured to manipulate the initial fluid portion to form a modified fluid material and/or a displaced fluid portion. The system moreover includes where the dispenser and/or the acoustic processing system are configured to place the modified fluid material and/or the displaced fluid portion at the dispense location and form a deposited fluid material.

[0009] In one aspect, a process includes configuring a dispenser with a nozzle to dispense a fluid material to form an initial fluid portion for placement in and/or on a dispense location. The process in addition includes configuring an acoustic processing system to manipulate the initial fluid portion to form a modified fluid material and/or a displaced fluid portion. The process moreover includes where the dispenser and/or the acoustic processing system are configured to place the modified fluid material and/or the displaced fluid portion at the dispense location and form a deposited fluid material.

[0010] In one aspect, a process includes configuring a dispenser with a nozzle to dispense a fluid material to form an initial fluid portion for placement in and/or on a dispense location. The process in addition includes configuring an acoustic processing system to manipulate the initial fluid portion to form a modified fluid material. The process moreover includes where the dispenser and/or the acoustic processing system are configured to place the modified fluid material at the dispense location and form a deposited fluid material.

[0011 ] There has thus been outlined, rather broadly, certain aspects of the disclosure in order that the detailed description thereof herein may be better understood, and in order that the present contribution to the art may be better appreciated. There are, of course, additional aspects of the disclosure that will be described below and which will form the subject matter of the claims appended hereto.

[0012] In this respect, before explaining at least one aspect of the disclosure in detail, it is to be understood that the disclosure is not limited in its application to the details of construction and to the arrangements of the components set forth in the following description or illustrated in the drawings. The disclosure is capable of aspects in addition to those described and of being practiced and carried out in various ways. Also, it is to be understood that the phraseology and terminology employed herein, as well as the abstract, are for the purpose of description and should not be regarded as limiting.

[0013] As such, those skilled in the art will appreciate that the conception upon which this disclosure is based may readily be utilized as a basis for the designing of other structures, methods and systems for carrying out the several purposes of the disclosure. It is important, therefore, that the claims be regarded as including such equivalent constructions insofar as they do not depart from the spirit and scope of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 illustrates a perspective view of a fluid dispensing system according to aspects of the disclosure.

[0015] Figure 2 illustrates a further partial perspective view of a fluid dispensing system according to Figure 1 .

[0016] Figure 3 illustrates a further partial perspective view of a fluid dispensing system according to Figure 1 . [0017] Figure 4 illustrates a further partial perspective view of a fluid dispensing system according to Figure 1 .

[0018] Figure 5 illustrates a partial view of the acoustic processing system according to aspects of the disclosure.

[0019] Figure 6 illustrates a partial view of the acoustic processing system according to aspects of the disclosure.

[0020] Figure 7 illustrates further aspects of the acoustic processing system according to the disclosure.

[0021 ] Figure 8 illustrates further aspects of the acoustic processing system according to the disclosure.

[0022] Figure 9 illustrates further aspects of the acoustic processing system 300 according to the disclosure.

[0023] Figure 10 illustrates further aspects of the acoustic processing system according to the disclosure.

[0024] Figure 11 illustrates further aspects of the acoustic processing system according to the disclosure.

[0025] Figure 12 illustrates a perspective view of a fluid dispensing system according to aspects of the disclosure.

[0026] Figure 13 illustrates a perspective view of a fluid dispensing system according to aspects of the disclosure.

[0027] Figure 14 illustrates further aspects of the acoustic processing system according to the disclosure.

[0028] Figure 15 illustrates further aspects of the acoustic processing system according to the disclosure.

[0029] Figure 16 further illustrates exemplary details of the fluid dispensing system according to aspects of the disclosure.

[0030] Figure 17 illustrates a process for dispensing a fluid according to aspects of the disclosure.

[0031 ] Figure 18 illustrates a process for dispensing a fluid according to aspects of the disclosure. [0032] Figure 19 illustrates a process modifying a fluid according to aspects of the disclosure.

[0033] Figure 20 illustrates an exemplary implementation of the dispenser according to aspects of the disclosure.

DETAILED DESCRIPTION

[0034] The disclosure will now be described with reference to the drawing figures, in which like reference numerals refer to like parts throughout. Aspects of the disclosure advantageously provide a dispensing system configured with an acoustic device to provide thin-stream high-flowrate dispensing and processes of implementing the same.

[0035] Manufacturers are looking to increase a size of components, such as chip packages, that they are dispensing material on while simultaneously reducing a gap between the components, such as the chip packages. Functionally, that means that to underfill these components, a material dispenser would need to dispense a much thinner stream of fluid (<100 microns, down as low as 50 microns) with a very high placement accuracy.

[0036] Further, in order to dispense a sufficient amount of material to maintain a desired manufacturing speed, a manufacture may need to dispense the material with, for example, ten times more dispensers or dispense the material ten times faster in order to achieve a flowrate needed to apply the material to the components, such as applying underfill to these large chip packages.

[0037] The disclosed dispensing system and dispensing process may be configured to compress wide streams of fluid dispensing material into thin streams fluid dispensing material (or even thin sheets of fluid dispensing material) to fit between narrow gaps between components, such as the chip packages, while trying to maintain a higher flowrate.

[0038] For example, the disclosed dispensing system and dispensing process may be configured as an add-on to various dispensing devices, for use in the dispensing of fluid dispensing material onto components, such as underfill epoxy onto and/or under semiconductor packages.

[0039] The disclosed dispensing system and dispensing process may be implemented in the dispensing of fluid dispensing material in more complex three dimensional chip packages. In current dispensing devices, there are challenges when it comes to accessing parts with current nozzle types. The disclosed dispensing system and dispensing process may be implemented to support using longer stinger-type nozzles on the dispensing device, squeezing the streams to fit into narrow gaps between the components, potentially even altering a trajectory of the streams to hit their target.

[0040] The disclosed dispensing system and dispensing process may implement an acoustic device. In particular, the acoustic device may generate standing sound waves nodes to manipulate, capture, move and/or the like small particles or droplets of a dispensing material. Further, the acoustic device may be attached to a dispensing device. The dispensing device can dispense a drop of material through one of the standing sound waves nodes. By adjusting an amplitude of the sound waves, the acoustic device may generate a pressure gradient across the droplet. Accordingly, the acoustic device and associated pressure gradient may manipulate the droplet of material, such as to squish out the droplet of material into a thin disk of material. By doing this, a dot that would otherwise be too wide, could now fit into a narrow gap between chip packages.

[0041 ] Figure 1 illustrates a perspective view of a fluid dispensing system according to aspects of the disclosure.

[0042] In particular, Figure 1 illustrates a fluid dispensing system 100 that may include a dispenser 102 that includes a nozzle 106. The dispenser 102 and the nozzle 106 may be configured to dispense a fluid material 400. In particular, the dispenser 102 and the nozzle 106 may be configured to dispense the fluid material 400 to form an initial fluid portion 401 for placement in and/or on a dispense location 200. In aspects, the dispense location 200 may be on or between components 202. For example, the dispense location 200 may be a gap between the components 202, an area on the components 202, an area under the components 202, and/or the like. As illustrated in Figure 1 , the dispense location 200 is a gap between the components 202.

[0043] Further, the fluid dispensing system 100 may include an acoustic processing system 300. The dispenser 102 and the nozzle 106 may dispense the initial fluid portion 401 through and/or adjacent the acoustic processing system 300. Further, the acoustic processing system 300 may be configured to manipulate the initial fluid portion 401 . In aspects, the initial fluid portion 401 may be too large to be placed in the dispense location 200 in a manufacturing setting. Accordingly, the dispenser 102 and the nozzle 106 may dispense the initial fluid portion 401 through the acoustic processing system 300 to manipulate the initial fluid portion 401 so as to be shaped to be placed in the dispense location 200 in a manufacturing setting.

[0044] Additionally, the dispenser 102 may include a dispensing mechanism 130 and a fluid supply 120. The dispensing mechanism 130 may receive the fluid material 400 from the fluid supply 120. Thereafter, the dispensing mechanism 130 may generate the initial fluid portion 401. In particular, the dispensing mechanism 130 may receive the fluid material 400 and forcibly eject the fluid material 400 from the nozzle 106 to form the initial fluid portion 401. In aspects, the dispensing mechanism 130 may be an electromagnetically operated valve dispenser, a pneumatically operated valve dispenser, and/or the like.

[0045] In aspects, the dispenser 102 may dispense the initial fluid portion 401 along the Z-axis toward the dispense location 200 and/or the components 202. Further, the acoustic processing system 300 may be arranged between the nozzle 106 and the dispense location 200 and/or the components 202. Accordingly, the dispenser 102 may dispense the initial fluid portion 401 along the Z-axis, the initial fluid portion 401 may travel along the Z-axis past and/or through the acoustic processing system 300 to be manipulated, and may travel along the Z-axis toward the dispense location 200 and/or the components 202, and may be placed on and/or in the dispense location 200.

[0046] The fluid supply 120 may be arranged within the dispenser 102, attached to the dispenser 102, arranged in fluid communication with the dispenser 102, arranged in fluid communication with the dispensing mechanism 130, and/or the like.

[0047] In aspects, the dispenser 102 may be a jetting device and/or may implement a jetting valve to jet the initial fluid portion 401 as dots, droplets, streams, and/or discrete volumes in or onto the dispense location 200 and/or the components 202. A "jetting valve" or "jetting device" may be a device which ejects, or "jets" the initial fluid portion 401 so as to be "in-flight" between the dispenser 102 and the dispense location 200 and/or the components 202 and not in contact with either the dispenser 102 or the dispense location 200 and/or the components 202, for at least a part of the distance between the dispenser 102 and the dispense location 200 and/or the components 202.

[0048] In aspects, the fluid material 400 may be utilized to form a dot of material, a droplet of material, a stream of material, a flow of material, and/or the like. Further, the fluid material 400 may be an underfill material, an adhesive, a coating material, a potting material, a mold material, a surface mount adhesive material, a solder paste material, a conductive adhesive material, a solder mask material, a flux material, a thermal compound, an encapsulation material, an epoxy material, a thermosetting plastic, a silicone material, a silicone rubber material, a silicone rubber gel material, and/or the like.

[0049] In aspects, the components 202 may be a substrate, a semiconductor, a semiconductor chip, a semiconductor package, an electronic device, an electronic chip, an electronic package, a circuit board, a printed circuit board, a printed wire board, and/or the like. In aspects, the dispense location 200 may be a surface, a gap, a location, a component, and/or the like on, under, and/or in the components 202 or between two of the components 202.

[0050] Figure 2 illustrates a further partial perspective view of a fluid dispensing system according to Figure 1 .

[0051 ] Figure 3 illustrates a further partial perspective view of a fluid dispensing system according to Figure 1 .

[0052] Figure 4 illustrates a further partial perspective view of a fluid dispensing system according to Figure 1 .

[0053] The acoustic processing system 300 may include an acoustic device 301 that may be configured to generate sound waves 311 . Further, the acoustic processing system 300 may include a secondary acoustic device 302. In aspects, the secondary acoustic device 302 may reflect the sound waves 311 from the acoustic device 301 to generate second sound waves 312. In aspects, the secondary acoustic device 302 may generate the second sound waves 312.

[0054] Additionally, the sound waves 311 and the second sound waves 312 may interact to generate standing sound waves 314. In this regard, the standing sound waves 314 may be a combination of the sound waves 311 and the second sound waves 312 waves that are moving in opposite directions. In aspects, the standing sound waves 314 may be formed where the sound waves 311 may be directed toward the secondary acoustic device 302; and the second sound waves 312 may be directed toward the acoustic device 301 . In aspects, the standing sound waves 314 may be formed where the sound waves 311 and the second sound waves 312 are bouncing back and forth in the acoustic processing system 300 to generate a constructive interference and form the standing sound waves 314.

[0055] It should be noted that the sound waves 311 , the second sound waves 312, and the standing sound waves 314 are schematically illustrated in the various drawings at a high level for ease of understanding and illustration. In this regard, each of the sound waves 311 , the second sound waves 312, and the standing sound waves 314 may exist and extend between the acoustic device 301 and the secondary acoustic device 302. Thus, the sound waves 311 , the second sound waves 312, and the standing sound waves 314 are only partially and schematically illustrated at a high level for ease of understanding and illustration.

[0056] In aspects, the acoustic device 301 may be implemented as an electromagnetic acoustic transducer, a piezoelectric acoustic transducer, and/or the like. In aspects, the acoustic device 301 may be configured for acoustic wave generation. In particular, the acoustic device 301 may be configured for acoustic wave generation of the sound waves 311.

[0057] In aspects, the acoustic device 301 may be configured for generation of the sound waves 311 having a frequency of more than 5 kHz, 10 kHz, 15 kHz, 20 kHz, 25 kHz, 30 kHz, 35 kHz, 40 kHz, 45 kHz, or 50 kHz. In aspects, the acoustic device 301 may be configured for generation of the sound waves 311 having a frequency of less than 10 kHz, 15 kHz, 20 kHz, 25 kHz, 30 kHz, 35 kHz, 40 kHz, 45 kHz, 50 kHz, or 55 kHz. In aspects, the acoustic device 301 may be configured for generation of the sound waves 311 having a frequency of 5 kHz - 55 kHz, 5 kHz - 10 kHz, 5 kHz - 15 kHz, 5 kHz - 20 kHz, 20 kHz - 25 kHz, 20 kHz - 30 kHz, 20 kHz - 35 kHz, 20 kHz - 40 kHz, 30 kHz - 45 kHz, or 30 kHz - 50 kHz. [0058] In some aspects, the secondary acoustic device 302 may be implemented as a sound reflective surface, a sound reflective structure, a flat surface that reflects sound, and/or the like. In aspects, the secondary acoustic device 302 may be configured reflect the sound waves 311 and generate the second sound waves 312.

[0059] In other aspects, the secondary acoustic device 302 may be implemented as an electromagnetic acoustic transducer, a piezoelectric acoustic transducer, and/or the like. In aspects, the secondary acoustic device 302 may be configured for acoustic wave generation. In particular, the secondary acoustic device 302 may be configured for acoustic wave generation of the second sound waves 312.

[0060] In aspects, the secondary acoustic device 302 may be configured for generation of the second sound waves 312 having a frequency of more than 5 kHz, 10 kHz, 15 kHz, 20 kHz, 25 kHz, 30 kHz, 35 kHz, 40 kHz, 45 kHz, or 50 kHz. In aspects, the secondary acoustic device 302 may be configured for generation of the second sound waves 312 having a frequency of less than 10 kHz, 15 kHz, 20 kHz, 25 kHz, 30 kHz, 35 kHz, 40 kHz, 45 kHz, 50 kHz, or 55 kHz. In aspects, the secondary acoustic device 302 may be configured for generation of the second sound waves 312 having a frequency of 5 kHz - 55 kHz, 5 kHz - 10 kHz, 5 kHz - 15 kHz, 5 kHz - 20 kHz, 20 kHz - 25 kHz, 20 kHz - 30 kHz, 20 kHz - 35 kHz, 20 kHz - 40 kHz, 30 kHz - 45 kHz, or 30 kHz - 50 kHz.

[0061 ] The dispenser 102 and the nozzle 106 may dispense the initial fluid portion 401 through and/or adjacent the acoustic processing system 300 as illustrated in Figure 2. Further, the acoustic processing system 300, and/or the like may be configured to manipulate the initial fluid portion 401 as it travels toward the dispense location 200 and/or the components 202 to form a modified fluid material 402 as illustrated in Figure 3. In this regard, the initial fluid portion 401 may be too large to be placed in the dispense location 200 in a manufacturing setting. Accordingly, the dispenser 102 and the nozzle 106 may dispense the initial fluid portion 401 through the standing sound waves 314 to manipulate the initial fluid portion 401 to form the modified fluid material 402.

[0062] The modified fluid material 402 may be sized so as to be placed in the dispense location 200 in a manufacturing setting. In particular, the modified fluid material 402 may be placed by the dispenser 102 at the dispense location 200 and form a deposited fluid material 403 as illustrated in Figure 4.

[0063] In aspects, the modified fluid material 402 may be a squished, squashed, pinched, narrowed, thinned, and/or the like dot of material, droplet of material, stream of material, flow of material, and/or the like of the initial fluid portion 401 . In particular, the acoustic processing system 300, and/or the like may be configured to modify the initial fluid portion 401 to be the modified fluid material 402 as described herein.

[0064] The acoustic processing system 300, and/or the like may be configured to compress the initial fluid portion 401 , such as wide streams of fluid dispensing material, into the modified fluid material 402. In particular, the acoustic processing system 300, and/or the like may be configured to compress the initial fluid portion 401 into the modified fluid material 402, such as thin streams fluid dispensing material, thin sheets of fluid dispensing material, and/or the like to fit into the dispense location 200, such as between narrow gaps between the components 202, such as the chip packages, while maintaining a higher flowrate of the fluid material 400.

[0065] For example, the acoustic processing system 300 may be configured as an add-on device to any type of dispensing devices, such as the dispenser 102, for use forming the modified fluid material 402 and the deposited fluid material 403. In particular, forming the deposited fluid material 403 in, under, and/or onto the components 202 or in, under, and/or onto the dispense location 200 between the components 202.

[0066] The acoustic processing system 300 may be implemented in the dispensing of the fluid material 400 and/or forming the deposited fluid material 403 in more complex three dimensional implementations of the components 202, such as three dimensional chip packages.

[0067] The fluid dispensing system 100, the dispenser 102, and/or the acoustic processing system 300 may be configured to support using longer stinger-type nozzle implementations of the nozzle 106 on the dispenser 102. Further, the fluid dispensing system 100, the dispenser 102, and/or the acoustic processing system 300 may be configured manipulate the initial fluid portion 401 , squeezing streams of the initial fluid portion 401 to fit into the dispense location 200 or other narrow gaps between the components 202. Additionally, the fluid dispensing system 100, the dispenser 102, and/or the acoustic processing system 300 may be configured to alter a trajectory of the initial fluid portion 401 and/or the modified fluid material 402 to hit a target on the components 202, between the components 202, the dispense location 200 between the components 202, and/or the like.

[0068] Further, the acoustic processing system 300 may include a support structure for attachment of the acoustic processing system 300 to the dispenser 102 or another portion of the fluid dispensing system 100. There may be separate support structures for the acoustic device 301 and the secondary acoustic device 302. In other aspects, the acoustic device 301 and the secondary acoustic device 302 may be supported by a combined separate structure. In other aspects, the acoustic processing system 300 may be integrated into the dispenser 102 and/or another portion of the fluid dispensing system 100.

[0069] Further, the acoustic device 301 and the secondary acoustic device 302 may be movably mounted to the support structure with a movement system (not shown). In this regard, the acoustic device 301 may be configured to be moved in the y- axis, the x-axis, and/or the z-axis by one or more motors, linear actuators, gearing mechanisms, and/or the like. Likewise, the secondary acoustic device 302 may be configured to be moved in the y-axis, the x-axis, and/or the z-axis by one or more motors, linear actuators, gearing mechanisms, and/or the like.

[0070] The movement system may move the acoustic device 301 and/or the secondary acoustic device 302 in response to the fluid dispensing system 100, a controller 936 (as described herein), and/or the like. In particular, the movement system may move the acoustic device 301 and/or the secondary acoustic device 302 to control a phase, a location, and/or the like of the sound waves 311 , the second sound waves 312, the standing sound waves 314, and/or the like.

[0071 ] Figure 5 illustrates a partial view of the acoustic processing system according to aspects of the disclosure.

[0072] Figure 6 illustrates a partial view of the acoustic processing system according to aspects of the disclosure. [0073] In particular, Figure 5 illustrates a partial view of the acoustic processing system 300 with the initial fluid portion 401 ; and Figure 6 illustrates a partial view of the acoustic processing system 300 forming the modified fluid material 402. In this regard, Figure 5 and Figure 6 partially illustrate the sound waves 311 , the second sound waves 312, and the standing sound waves 314.

[0074] In aspects, the standing sound waves 314 may be a stationary wave, a wave that oscillates in time but whose peak amplitude profile does not move in space. The peak amplitude of wave oscillations of the standing sound waves 314 at any point in space may be constant with respect to time, and the oscillations at different points throughout the standing sound waves 314 may be in phase. In particular, locations of the standing sound waves 314 at which an absolute value of an amplitude is minimum may be standing sound wave nodes 320, and locations of the standing sound waves 314 where an absolute value of the amplitude is maximum may be standing sound wave antinodes 321.

[0075] The acoustic processing system 300, the acoustic device 301 , the secondary acoustic device 302, and/or the like may generate the standing sound waves 314 that include the standing sound wave nodes 320 to manipulate, capture, move, and/or the like small particles or droplets of the initial fluid portion 401 . In particular, the acoustic processing system 300 may form the modified fluid material 402.

[0076] Further, the acoustic processing system 300 may be attached to the dispenser 102, integrated into the dispenser 102, integrated into the fluid dispensing system 100, added on the fluid dispensing system 100, added on the dispenser 102, implemented separately, and/or the like.

[0077] The dispenser 102 can dispense the initial fluid portion 401 through one of the standing sound waves 314. By adjusting an amplitude of the sound waves 311 and the second sound waves 312, the acoustic device 301 may generate a pressure gradient adjacent, across, around, and/or the like the initial fluid portion 401. Accordingly, the acoustic processing system 300 and associated pressure gradient generated by the standing sound waves 314 may manipulate the initial fluid portion 401 into the modified fluid material 402. For example, such as to squish out the initial fluid portion 401 into a thin disk of material to form the modified fluid material 402. By doing this, the initial fluid portion 401 , such as a dot that would otherwise be too wide fit into the dispense location 200, may now fit into the dispense location 200 between the components 202. In particular, the acoustic processing system 300 may manipulate the initial fluid portion 401 to form the modified fluid material 402; thereafter the modified fluid material 402 may form the deposited fluid material 403.

[0078] Figure 7 illustrates further aspects of the acoustic processing system according to the disclosure.

[0079] Figure 8 illustrates further aspects of the acoustic processing system according to the disclosure.

[0080] In particular, Figure 7 illustrates further aspects of the acoustic processing system 300 that may include a plurality of the acoustic device 301 . In this regard, the plurality of the acoustic device 301 may be configured in an array 341 with multiple implementations of the acoustic device 301 . Each implementation of the acoustic device

301 may generate the sound waves 311 . The array 341 may include any number of implementations of the acoustic device 301 along the y-axis; and the array 341 may include any number of implementations of the acoustic device 301 along the z-axis.

[0081 ] Figure 8 illustrates further aspects of the acoustic processing system 300 that may include a plurality of the secondary acoustic device 302. In this regard, the plurality of the secondary acoustic device 302 may be configured in an array 342 with multiple implementations of the secondary acoustic device 302. Each implementation of the secondary acoustic device 302 may generate the second sound waves 312. The array 342 may include any number of implementations of the secondary acoustic device

302 along the y-axis; and the array 342 may include any number of implementations of secondary acoustic device 302 along the z-axis.

[0082] Accordingly, the array 342 of the acoustic device 301 illustrated in Figure 7 may generate an array of the sound waves 311 and the array 342 of the secondary acoustic device 302 illustrated in Figure 8 may generate an array of the second sound waves 312 and together the array 341 of the acoustic device 301 and the array 342 of the secondary acoustic device 302 may generate an array of the standing sound waves [0083] In aspects, the fluid dispensing system 100 may be configured to use phased arrays of the acoustic device 301 and the secondary acoustic device 302 to apply fluid to a substrate. A typical system may implement multiple discrete number of end effectors (valves). For example, multiple discrete number of end effectors to a cartesian robot.

[0084] In a particular aspect, the fluid dispensing system 100 may be configured in implementations to reduce a number of implementations of the dispenser 102. In this regard, reduce a number of implementations of the dispenser 102 through implementation of the acoustic processing system 300 implementing the array 341 and the array 342. In particular, the array 341 and the array 342 may be configured as phased arrays of multiple implementations of the acoustic device 301 and multiple implementations of the secondary acoustic device 302 that can trap and manipulate multiple portions of the initial fluid portion 401 , independently, at once, in three- dimensional space.

[0085] In aspects, there may be n number of implementations of the dispenser 102 (where n is an integer) that together with the acoustic processing system 300 may be configured to move multiple portions of the initial fluid portion 401 around each other within the fluid dispensing system 100.

[0086] In aspects, the array 341 and the array 342 may be configured as phased arrays of multiple implementations of the acoustic device 301 and multiple implementations of the secondary acoustic device 302 that may generate the standing sound waves 314 to trap droplets of the initial fluid portion 401 within a three- dimensional space. Then, by manipulating the amplitude and phase of individual implementations of the acoustic device 301 and the secondary acoustic device 302 in a calculated way, those trapped droplets of the initial fluid portion 401 can be moved around the three-dimensional space in a highly controlled fashion. Additionally, multiple droplets of the initial fluid portion 401 can be trapped and moved (a displaced fluid portion 404 described below) at the same time, independently of each other.

[0087] In aspects, implementations of the array 341 and the array 342 may be configured as phased arrays of the acoustic device 301 and the secondary acoustic device 302 operating in response to the controller 936 (described below) that may implement drop velocities as high as 1 m/s (meter per second). In aspects, the fluid dispensing system 100 may implement one or more implementations of the dispenser 102 fixed in place to supply the initial fluid portion 401 into moving pressure nodes of the standing sound waves 314. Thereafter, the acoustic processing system 300 may deliver the displaced fluid portion 404 to their intended targets on the substrate such as the dispense location 200 on the components 202.

[0088] Additionally, tuning individual implementations of the acoustic device 301 and the secondary acoustic device 302 and calibration of the array 341 and the array 342 may be performed in order to optimize placement accuracy of the fluid droplets, such as the deposited fluid material 403.

[0089] In aspects, the acoustic processing system 300 may implement a constantly rotating ring of pressure nodes into which multiple portions of the initial fluid portion 401 are dispensed from the multiple implementations of the dispenser 102 and from which multiple portions of the displaced fluid portion 404 are sent to their target destinations to form the deposited fluid material 403. In this aspect, implementations of the fluid dispensing system 100 may greatly simplify the mechanics of the fluid dispensing system 100, by eliminating the need to move heavy end-effectors around at high speeds and accuracy, while potentially increasing the flowrate and throughput.

[0090] Figure 9 illustrates further aspects of the acoustic processing system according to the disclosure.

[0091 ] In particular, Figure 9 illustrates further aspects of the acoustic processing system 300 that may include a circular acoustic device arrangement 350. In this regard, a plurality of the acoustic device 301 may be arranged in the circular acoustic device arrangement 350. In this regard, the acoustic device 301 may be configured in the circular acoustic device arrangement 350 with multiple implementations of the acoustic device 301 . Each implementation of the acoustic device 301 may generate the sound waves 311 . Further, the circular acoustic device arrangement 350 may implement any number of the acoustic device 301 .

[0092] Additionally, Figure 9 illustrates a plurality of the secondary acoustic device 302 may be arranged in the circular acoustic device arrangement 350. In this regard, the secondary acoustic device 302 may be configured in the circular acoustic device arrangement 350 with multiple implementations of the secondary acoustic device 302. Each implementation of the secondary acoustic device 302 may generate the second sound waves 312. Further, the circular acoustic device arrangement 350 may implement any number of the secondary acoustic device 302.

[0093] Accordingly, the acoustic device 301 held in the circular acoustic device arrangement 350 may generate the sound waves 311 toward the nozzle 106 and/or below the nozzle where the initial fluid portion 401 may be located; and the secondary acoustic device 302 held in the circular acoustic device arrangement 350 may generate the second sound waves 312 toward the nozzle 106 and/or below the nozzle where the initial fluid portion 401 may be located; and together the acoustic device 301 and the secondary acoustic device 302 may generate the standing sound waves 314 toward the nozzle 106 and/or below the nozzle where the initial fluid portion 401 may be located.

[0094] Further, additional implementations of the circular acoustic device arrangement 350 of the acoustic device 301 and the secondary acoustic device 302 may be arranged in the z-axis. In this regard, the circular acoustic device arrangement 350 may form an array of the acoustic device 301 and the secondary acoustic device 302.

[0095] Figure 10 illustrates further aspects of the acoustic processing system according to the disclosure.

[0096] Figure 11 illustrates further aspects of the acoustic processing system according to the disclosure.

[0097] In particular, Figure 10 and Figure 11 Illustrate further aspects of the acoustic processing system 300 configured for displacement of the initial fluid portion 401. In this regard, the acoustic processing system 300 may be configured to displace the initial fluid portion 401 to obtain a displaced fluid portion 404 as illustrated in Figure 11.

[0098] In particular, the acoustic processing system 300 may generate the sound waves 311 , the second sound waves 312, and the standing sound waves 314 to move the initial fluid portion 401 along the x-axis, along the y-axis, and/or along the z-axis to obtain the displaced fluid portion 404. Additionally or alternatively, the acoustic processing system 300 may generate the sound waves 311 , the second sound waves 312, and the standing sound waves 314 to change a trajectory of the initial fluid portion 401 along the x-axis, along the y-axis, and/or along the z-axis to obtain a changed trajectory of the displaced fluid portion 404.

[0099] Moreover, the acoustic processing system 300 may generate the sound waves 311 , the second sound waves 312, and the standing sound waves 314 to change a velocity of the initial fluid portion 401 along the x-axis, along the y-axis, and/or along the z-axis to obtain a changed velocity of the displaced fluid portion 404.

[0100] Figure 12 illustrates a perspective view of a fluid dispensing system according to aspects of the disclosure.

[0101 ] In particular, Figure 12 illustrates an implementation of the fluid dispensing system 100 implementing the array 341 and the array 342. In aspects, upper implementations of the acoustic device 301 and the secondary acoustic device 302 may generate upper implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314. In aspects, the upper implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314 may capture the initial fluid portion 401 and manipulate the initial fluid portion 401 to form the displaced fluid portion 404.

[0102] In aspects, lower implementations of the acoustic device 301 and the secondary acoustic device 302 may generate lower implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314. In aspects, the lower implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314 may capture the displaced fluid portion 404 and manipulate the displaced fluid portion 404 to form the modified fluid material 402.

[0103] Accordingly, the implementation of the fluid dispensing system 100 illustrated in Figure 12 may displace the initial fluid portion 401 and form the displaced fluid portion 404; and the implementation of the fluid dispensing system 100 illustrated in Figure 12 may manipulate the displaced fluid portion 404 and form the modified fluid material 402.

[0104] In further aspects of the disclosure, the array 341 and the array 342 may have n implementations of the acoustic device 301 and the secondary acoustic device 302 that may generate n implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314. In this regard, n may be an integer.

[0105] In aspects, the array 341 and the array 342 may have a subset of the n implementations of the acoustic device 301 and the secondary acoustic device 302 extending along the z-axis (illustrated in Figure 7 and Figure 8); and the array 341 and the array 342 may have a subset of the n implementations of the acoustic device 301 and the secondary acoustic device 302 extending along the y-axis (illustrated in Figure 7 and Figure 8).

[0106] In aspects, the n implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314 may form the displaced fluid portion 404, the modified fluid material 402, combinations of the displaced fluid portion 404 and the modified fluid material 402, and/or the like. In aspects, a subset of the n implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314 may form the displaced fluid portion 404, the modified fluid material 402, combinations of the displaced fluid portion 404 and the modified fluid material 402, and/or the like.

[0107] In particular aspects, one or more of the n implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314 may capture the initial fluid portion 401 and manipulate the initial fluid portion 401 to form the displaced fluid portion 404. Additionally, other of the n implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314 may provide further manipulations on fluid portions.

[0108] In particular aspects, one or more of the n implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314 may capture the displaced fluid portion 404 and displace the displaced fluid portion 404 to form further displaced portions of the displaced fluid portion 404. Additionally, other of the n implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314 may provide further manipulations on fluid portions.

[0109] In aspects, one or more of the n implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314 may manipulate the initial fluid portion 401 to form the modified fluid material 402. Additionally, other of the n implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314 may provide further manipulations on fluid portions.

[0110] In particular aspects, one or more of the n implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 31 may manipulate the displaced fluid portion 404 to form manipulated portions of the displaced fluid portion 404 and/or displaced portions of the modified fluid material 402. Additionally, other of the n implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314 may provide further manipulations on fluid portions.

[0111 ] Figure 13 illustrates a perspective view of a fluid dispensing system according to aspects of the disclosure.

[0112] In particular, Figure 13 illustrates an implementation of the fluid dispensing system 100 implementing the array 341 and the array 342. Additionally, Figure 13 illustrates an implementation of the fluid dispensing system 100 having two implementations of the dispenser 102. In aspects, each implementation of the dispenser 102 may generate a respective one of the initial fluid portion 401 .

[0113] In aspects, upper implementations of the acoustic device 301 and the secondary acoustic device 302 may generate upper implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314. In aspects, the upper implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314 may capture respective ones of the initial fluid portion 401 and displace respective ones of the initial fluid portion 401 to form respective ones of the displaced fluid portion 404.

[0114] In aspects, lower implementations of the acoustic device 301 and the secondary acoustic device 302 may generate lower implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314. In aspects, the lower implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314 may further displace respective ones of the displaced fluid portion 404.

[0115] Accordingly, the implementation of the fluid dispensing system 100 illustrated in Figure 13 may displace respective ones of the initial fluid portion 401 and form respective ones of the displaced fluid portion 404; and the implementation of the fluid dispensing system 100 illustrated in Figure 13 may further displace respective ones of the displaced fluid portion 404.

[0116] In further aspects of the disclosure, the fluid dispensing system 100 may have m implementations of the dispenser 102. In this regard, m may be an integer. In aspects, the m implementations of the dispenser 102 may generate m portions of the initial fluid portion 401.

[0117] In further aspects of the disclosure, the array 341 and the array 342 may have n implementations of the acoustic device 301 and the secondary acoustic device 302 that may generate n implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314.

[0118] In aspects, the n implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314 may form m of portions of the displaced fluid portion 404, the modified fluid material 402, combinations of the displaced fluid portion 404 and the modified fluid material 402, and/or the like. In aspects, a subset of the n implementations of the sound waves 311 , the second sound waves 312, and the standing sound waves 314 may form m of portions of the displaced fluid portion 404, the modified fluid material 402, combinations of the displaced fluid portion 404 and the modified fluid material 402, and/or the like.

[0119] Figure 14 illustrates further aspects of the acoustic processing system according to the disclosure.

[0120] Figure 15 illustrates further aspects of the acoustic processing system according to the disclosure.

[0121 ] In particular, Figure 14 and Figure 15 illustrate further aspects of the acoustic processing system 300 configured for manipulation of the deposited fluid material 403. In this regard, the acoustic processing system 300 may be configured to manipulate the deposited fluid material 403 to obtain a distributed fluid portion 405 as illustrated in Figure 15.

[0122] In particular, the acoustic processing system 300 may implement the acoustic device 301 such that the sound waves 311 are focused on the components 202, the dispense location 200, and/or the deposited fluid material 403. Further, the acoustic device 301 may generate the sound waves 311 to obtain the distributed fluid portion 405. More specifically, the sound waves 311 may vibrate the components 202, the dispense location 200, and/or the deposited fluid material 403 to ensure that the deposited fluid material 403 spreads, distributes, flows, and/or the like the deposited fluid material 403 to form the distributed fluid portion 405. For example, the sound waves 311 may vibrate the components 202, the dispense location 200, and/or the deposited fluid material 403 to ensure that the deposited fluid material 403 spreads, distributes, flows, and/or the like the deposited fluid material 403 to ensure that the deposited fluid material 403 spreads under the components 202 to form the distributed fluid portion 405.

[0123] In this respect, the acoustic processing system 300 may be configured for application assistance of the deposited fluid material 403. For example, the acoustic processing system 300 may be configured for application assistance of the deposited fluid material 403 using focused ultrasound for capillary action assistance.

[0124] In aspects, the acoustic processing system 300 may be configured as a mechanism for assisting the capillary action of the deposited fluid material 403, such as an underfill epoxy, by applying a localized positive pressure with the acoustic device 301 to a surface of the deposited fluid material 403 as illustrated in Figure 14. In particular, applying a localized positive pressure with the acoustic device 301 may allow the deposited fluid material 403 to flow out faster to form the distributed fluid portion 405 as illustrated in Figure 15.

[0125] In aspects, the acoustic device 301 may generate the sound waves 311 . Further, the acoustic device 301 may be tuned and directed towards the dispense location 200, the components 202, the deposited fluid material 403, and/or the like. Further, the acoustic device 301 may generate a localized higher-pressure region just above the dispense location 200, the components 202, the deposited fluid material 403, and/or the like. This higher-pressure region may then be used to assist with formation of the distributed fluid portion 405, such as encouraging, promoting, and/or the like underfill capillary action after fluid has been dispensed onto the substrate.

[0126] In aspects, the acoustic processing system 300 and/or the acoustic device 301 may be mounted to the dispenser 102. In other aspects, the acoustic processing system 300 and/or the acoustic device 301 may be mounted to another part of the fluid dispensing system 100, located in a staging area downstream of the fluid dispensing system 100, built into a staging area downstream of the fluid dispensing system 100, and/or the like.

[0127] Figure 16 further illustrates exemplary details of the fluid dispensing system according to aspects of the disclosure.

[0128] In particular, the fluid dispensing system 100 may include a cabinet 912, a positioner 925, and a sensor system 902. The sensor system 902 may include a light source and a light sensor assembly. The light sensor assembly may be a sensor, a camera, an optical sensor, and/or the like. The light sensor assembly and the light source may be arranged in opposing alignment of a flight path of the initial fluid portion 401 , the modified fluid material 402, the displaced fluid portion 404, and/or the like dispensed from the dispenser 102. The sensor system 902 may include one or more mirrors to reflect the light beam from the light source and/or the light sensor assembly.

[0129] The sensor system 902 and/or the light sensor assembly may sense a trajectory, position, velocity, shape, and/or the like of the initial fluid portion 401 , the modified fluid material 402, the displaced fluid portion 404, and/or the like and generate data on a trajectory, position, velocity, shape, and/or the like of the initial fluid portion 401 , the modified fluid material 402, the displaced fluid portion 404, and/or the like.

[0130] The fluid dispensing system 100 and/or the controller 936 may receive the data on a trajectory, position, velocity, shape, and/or the like of the initial fluid portion 401 , the modified fluid material 402, the displaced fluid portion 404, and/or the like. Thereafter, the fluid dispensing system 100 and/or the controller 936 may control operation of the acoustic processing system 300 based on the sensor system 902.

[0131 ] In particular, the acoustic device 301 and the secondary acoustic device 302 may be controlled with feedback from the sensor system 902 by the fluid dispensing system 100 and/or the controller 936. In particular, the fluid dispensing system 100 and/or the controller 936 may control a phase, amplitude, frequency, location, and/or the like of the acoustic device 301 , the secondary acoustic device 302, the sound waves 311 , the second sound waves 312, the standing sound waves 314, and/or the like. [0132] The dispenser 102 may be coupled to the positioner 925. Further, the positioner 925 may be configured to selectively position the dispenser 102 above a production area 926 and a service station 928 (i.e. , a service area) of the cabinet 912. In aspects, the production area 926 may be a location of the dispenser 102, the dispense location 200, and/or the components 202 during formation of the initial fluid portion 401 , the modified fluid material 402, the deposited fluid material 403, the displaced fluid portion 404, and/or he distributed fluid portion 405. In aspects, the service station 928 may be a location where the dispenser 102 is serviced and/or cleaned.

[0133] The positioner 925 may be a three-axis positioner that includes independently controllable x-axis and y-axis drives configured to move the dispenser 102 and/or the acoustic processing system 300 in a horizontal plane above the production area 926 and/or the service station 928, and adjust the height of the dispenser 102, the acoustic processing system 300, and/or the nozzle 106 relative to the surface of the production area 926 and/or the service station 928. The positioner 925 may thereby provide three substantially perpendicular axes of motion for the dispenser 102. Although the dispenser 102 is shown in the illustrated embodiment as being coupled to an x-y positioner by a z-axis drive 934, persons having ordinary skill in the art will understand that other mechanisms could be used to position the dispenser 102.

[0134] The fluid dispensing system 100 may also include the controller 936, which may be mounted in the cabinet 912 or may be remote. The controller 936 may be configured to provide overall control of the fluid dispensing system 100, such as coordinating movements of the dispenser 102, actuating the dispensing mechanism 130, operating the acoustic processing system 300, and/or actuating components of the service station 928.

[0135] In particular, the controller 936 may receive the data on a trajectory, position, velocity, shape, and/or the like of the initial fluid portion 401 , the modified fluid material 402, the displaced fluid portion 404, and/or the like. Thereafter, the controller 936 may control operation of the acoustic processing system 300 based on the sensor system 902. In particular, the controller 936 may control a phase, amplitude, frequency, location, and/or the like of the acoustic device 301 , the secondary acoustic device 302, the sound waves 311 , the second sound waves 312, the standing sound waves 314, and/or the like.

[0136] In particular, the controller 936 may implement artificial intelligence and/or machine learning to learn manipulations of the acoustic processing system 300 and/or the dispenser 102 on a trajectory, position, velocity, shape, and/or the like of the initial fluid portion 401 , the modified fluid material 402, the displaced fluid portion 404, and/or the like. Thereafter, the controller 936 may implement the artificial intelligence and/or the machine learning to control operation of the acoustic processing system 300 and/or the dispenser 102 based on the sensor system 902. In particular, the controller 936 may implement the artificial intelligence and/or the machine learning to control a phase, amplitude, frequency, location, and/or the like of the acoustic device 301 , the secondary acoustic device 302, the sound waves 311 , the second sound waves 312, the standing sound waves 314, and/or the like.

[0137] The controller 936 may include a processor, a memory, and an input/output (I/O) interface. The processor may include one or more devices selected from microprocessors, micro-controllers, digital signal processors, microcomputers, central processing units, field programmable gate arrays, programmable logic devices, state machines, logic circuits, analog circuits, digital circuits, and/or any other devices that manipulate signals (analog or digital) based on operational instructions that are stored in the memory. The memory may be a single memory device or a plurality of memory devices including but not limited to read-only memory (ROM), random access memory (RAM), volatile memory, non-volatile memory, static random access memory (SRAM), dynamic random access memory (DRAM), flash memory, cache memory, and/or any other device capable of storing digital information. The memory may also include a mass storage device (not shown) such as a hard drive, optical drive, tape drive, non-volatile solid state device and/or any other device capable of storing digital information. The processor may operate under the control of an operating system that resides in memory.

[0138] A user interface 938 and/or a control panel 940 may be communicatively connected to the controller 936 to allow a system operator to interact with the controller 936. The user interface 938 may include a video monitor, alphanumeric displays, a touch screen, a speaker, and/or any other suitable audio and/or visual indicators capable of providing information to the system operator. The control panel 940 may include one or more input devices capable of accepting commands and/or input from the operator, such as an alphanumeric keyboard, a pointing device, keypads, pushbuttons, control knobs, microphones, touchscreens, and/or the like. In this way, the user interface 938 and/or the control panel 940 may enable manual initiation and/or control of system functions, for example, during set-up, calibration, inspection, cleaning, operation, and/or the like.

[0139] Figure 17 illustrates a process for dispensing a fluid according to aspects of the disclosure.

[0140] In particular, Figure 17 illustrates a process for dispensing a fluid 500. In particular, it should be noted that the process for dispensing a fluid 500 is merely exemplary and may be modified consistent with the various aspects disclosed herein. It should be noted that the process for dispensing a fluid 500 may be performed in a different order consistent with the aspects described above. Moreover, the process for dispensing a fluid 500 may be modified to have more or fewer process steps consistent with the various aspects disclosed herein.

[0141 ] The process for dispensing a fluid 500 of the disclosure may include dispensing an initial fluid portion with a dispenser 502. In this regard, the dispensing an initial fluid portion with a dispenser 502 may include dispensing the initial fluid portion 401 with the dispenser 102 as disclosed herein.

[0142] The process for dispensing a fluid 500 of the disclosure may include generating standing sound waves with sound waves generated by an acoustic device and second sound waves generated by a secondary acoustic device 504. In this regard, the generating standing sound waves with sound waves generated by an acoustic device and second sound waves generated by a secondary acoustic device 504 may include generating the standing sound waves 314 with the sound waves 311 generated by the acoustic device 301 and the second sound waves 312 generated by the secondary acoustic device 302 as disclosed herein. [0143] The process for dispensing a fluid 500 of the disclosure may include modifying the initial fluid portion to be a modified fluid material with the standing sound waves 506. In this regard, the modifying the initial fluid portion to be a modified fluid material with the standing sound waves 506 may include modifying the initial fluid portion 401 to be the modified fluid material 402 with the standing sound waves 314 as disclosed herein.

[0144] The process for dispensing a fluid 500 of the disclosure may include forming a deposited fluid material in a dispense location from the modified fluid material 508. In this regard, the forming a deposited fluid material in a dispense location from the modified fluid material 508 may include forming the deposited fluid material 403 in the dispense location 200 from the modified fluid material 402.

[0145] Figure 18 illustrates a process for dispensing a fluid according to aspects of the disclosure.

[0146] In particular, Figure 18 illustrates a process for dispensing a fluid 600. In particular, it should be noted that the process for dispensing a fluid 600 is merely exemplary and may be modified consistent with the various aspects disclosed herein. It should be noted that the process for dispensing a fluid 600 may be performed in a different order consistent with the aspects described above. Moreover, the process for dispensing a fluid 600 may be modified to have more or fewer process steps consistent with the various aspects disclosed herein.

[0147] The process for dispensing a fluid 600 of the disclosure may include dispensing an initial fluid portion with a dispenser 602. In this regard, the dispensing an initial fluid portion with a dispenser 602 may include dispensing the initial fluid portion 401 with the dispenser 102 as disclosed herein.

[0148] The process for dispensing a fluid 600 of the disclosure may include generating standing sound waves with sound waves generated by an acoustic device and second sound waves generated by a secondary acoustic device 604. In this regard, the generating standing sound waves with sound waves generated by an acoustic device and second sound waves generated by a secondary acoustic device 604 may include generating the standing sound waves 314 with the sound waves 311 generated by the acoustic device 301 and the second sound waves 312 generated by the secondary acoustic device 302 as disclosed herein.

[0149] The process for dispensing a fluid 600 of the disclosure may include displacing the initial fluid portion to be a displaced fluid portion with the standing sound waves 606. In this regard, the displacing the initial fluid portion to be a displaced fluid portion with the standing sound waves 606 may include displacing the initial fluid portion 401 to be the displaced fluid portion 404 with the standing sound waves 314 as disclosed herein.

[0150] The process for dispensing a fluid 600 of the disclosure may include forming a deposited fluid material in a dispense location from the displaced fluid portion 608. In this regard, the forming a deposited fluid material in a dispense location from the displaced fluid portion 608 may include forming the deposited fluid material 403 in the dispense location 200 from the displaced fluid portion 404 as disclosed herein.

[0151 ] Figure 19 illustrates a process modifying a fluid according to aspects of the disclosure.

[0152] In particular, Figure 19 illustrates a process for modifying a fluid 700. In particular, it should be noted that the process for modifying a fluid 700 is merely exemplary and may be modified consistent with the various aspects disclosed herein. It should be noted that the process for modifying a fluid 700 may be performed in a different order consistent with the aspects described above. Moreover, the process for modifying a fluid 700 may be modified to have more or fewer process steps consistent with the various aspects disclosed herein.

[0153] The process for modifying a fluid 700 of the disclosure may include dispensing an initial fluid portion with a dispenser 702. In this regard, the dispensing an initial fluid portion with a dispenser 702 may include dispensing the initial fluid portion 401 with the dispenser 102 as disclosed herein.

[0154] The process for modifying a fluid 700 of the disclosure may include forming a deposited fluid material in a dispense location from the displaced fluid portion 704. In this regard, the forming a deposited fluid material in a dispense location from the displaced fluid portion 704 may include forming the deposited fluid material 403 in the dispense location 200 from the displaced fluid portion 404 as disclosed herein. [0155] The process for modifying a fluid 700 of the disclosure may include generating sound waves with an acoustic device 706. In this regard, the generating sound waves with an acoustic device 706 may include generating the sound waves 311 with the acoustic device 301 as disclosed herein.

[0156] The process for modifying a fluid 700 of the disclosure may include forming a distributed fluid portion in the dispense location from the displaced fluid portion 708. In this regard, the forming a distributed fluid portion in the dispense location from the displaced fluid portion 708 may include forming the distributed fluid portion 405 in the dispense location 200 from the displaced fluid portion 404 as disclosed herein.

[0157] In aspects, the process for dispensing a fluid 500 may include the displacing the initial fluid portion to be a displaced fluid portion with the standing sound waves 606, the generating sound waves with an acoustic device 706, and/or the forming a distributed fluid portion in the dispense location from the displaced fluid portion 708.

[0158] In aspects, the process for dispensing a fluid 600 may include the modifying the initial fluid portion to be a modified fluid material with the standing sound waves 506, the generating sound waves with an acoustic device 706, and/or the forming a distributed fluid portion in the dispense location from the displaced fluid portion 708.

[0159] In aspects, the process for modifying a fluid 700 may include the modifying the initial fluid portion to be a modified fluid material with the standing sound waves 506 and/or the displacing the initial fluid portion to be a displaced fluid portion with the standing sound waves 606.

[0160] Figure 20 illustrates an exemplary implementation of the dispenser according to aspects of the disclosure.

[0161 ] In particular, Figure 20 illustrates an exemplary implementation of the dispenser 102 according to aspects of the disclosure. The dispenser 102 may include a fluid module 212 having a fluid connection interface 220, a valve element 214, a piezoelectric drive module 216, a movable needle or drive pin 236 coupled with the piezoelectric drive module 216, and an outer cover (not shown) housing the piezoelectric drive module 216. However, the piezoelectric drive module 216 may be implemented using other types of drive technology. The dispenser 102 may operate as a jetting dispenser that intermittently jets volumes of a fluid material, such as the initial fluid portion 401 .

[0162] The fluid module 212 may include a fluid module body 230, a fluid chamber 238, and/or the like in communication with the fluid connection interface 220. A first section or portion of the fluid module body 230 may include a fluid inlet 242 and a passageway 247 that couples the fluid inlet 242 in fluid communication with the fluid chamber 238. A fluid conduit (not shown) may extend from the fluid supply 120 to the fluid inlet 242 for placing the fluid module 212 in fluid communication with the fluid material contained inside the fluid supply 120 and for supplying the fluid material 400 under pressure from the fluid supply 120 to the fluid connection interface 220. In this embodiment, the fluid conduit is typically a length of tubing directly connecting the outlet of the fluid supply 120 with the fluid connection interface 220 without any intervening structure. In one embodiment, the fluid connection interface 220 includes a Luer fitting.

[0163] A second portion 245 of the fluid module body 230 may be configured to support the nozzle 106. A centering piece 246 may align a fluid outlet 248 in the nozzle 106 with a passageway 250 extending through the second portion 245 of the fluid module body 230. A valve seat 252 is disposed between the fluid inlet 242 and the fluid outlet 248. The valve seat 252 may have an opening 256 in fluid communication with the fluid outlet 248. The centering piece 246 maintains the fluid outlet 248 in the nozzle 106, the passageway 250 in the second portion 245 of the fluid module body 230, and the opening 256 in the valve seat 252 in a concentric alignment.

[0164] The dispenser 102 may further include a strike plate in the form of a wall 262 of a movable element 260. A biasing element 268, which peripherally contacts the movable element 260, may be configured to apply an axial spring force to the movable element 260.

[0165] A sealing ring 264 may be utilized to implement a sealing engagement between an insert 263 and the exterior of the movable element 260. The part of the movable element 260 which is below the sealing ring, or O-ring, 264 defines a part of the boundary of the fluid chamber 238. The movable element 260 may include the valve element 214. The valve element 214 is located inside the fluid chamber 238 at a location between the wall 262 of the movable element 260 and the valve seat 252.

[0166] The drive pin 236 may project through a bore 266 in a third portion 232 of the fluid module body 230. The tip 234 of the drive pin 236 may be located adjacent to the wall 262 of the movable element 260 and on an opposite side of the wall 262 from the valve element 214. While the valve element 214 is exposed to the fluid material contained inside the fluid chamber 238, the bore 266 containing the drive pin 236 may be isolated from the fluid material in fluid chamber 238 so that the drive pin 236 is not wetted by the fluid material. As a result, the construction of the dispenser 102 can omit the conventional fluid seals that permit powered motion of the drive pin 236 while isolating the driving or actuation mechanism (e.g., the piezoelectric drive module 216) for the drive pin 236 from the fluid material in the fluid chamber 238.

[0167] The drive pin 236 may be indirectly coupled with the valve element 214 and may operate as a component of the piezoelectric drive module 216 or other drive module. The drive pin 236 and valve element 214 may jointly cooperate to dispense fluid material by jetting from the dispenser 102. When the drive pin 236 is moved to cause the valve element 214 to contact the valve seat 252, the tip 234 of the drive pin 236 may operate much like the operation of a hammer by striking the wall 262 of the movable element 260 to transfer its force and momentum to the wall 262, which in turn causes the valve element 214 to rapidly strike the valve seat 252 and jet a droplet, stream, and/or discrete volume of material from the jetting device. Specifically, the valve element 214, which is not directly connected with the drive pin 236, may be configured to be moved into contact with the valve seat 252 by an impulse imparted by the tip 234 of the actuated drive pin 236 to the wall 262 of the movable element 260. As a result, the drive pin 236 is actuated and a volume of fluid material is jetted from the fluid chamber 238 without any portion of the drive pin 236, including but not limited to the tip 234, being wetted by the jetted fluid material. When contact between the drive pin 236 and wall 262 is removed, the axial spring force applied by the biasing element 268 acts to move the valve element 214 and movable element 260 away from the valve seat 252 in a direction aligned with the longitudinal axis of the drive pin 236. Each reciprocating cycle of the drive pin 236 and valve element 214 jets a droplet, stream, or discrete volume of the fluid material. The cycle is repeated to jet sequential droplets of fluid material as required.

[0168] The surface of the valve element 214 facing the valve seat 252 may have a curvature to match the shape of the surface of the valve seat 252 encircling an opening. As a result of the shape matching, a fluid seal is temporarily formed when the valve element 214 has a contacting relationship with valve seat 252 during jetting. Establishment of the fluid seal during motion of the valve element 214 halts the flow of fluid material from the fluid chamber 238 past the valve seat 252.

[0169] The piezoelectric drive module 216 may be used to actuate the valve element 214 of the fluid module 212. The piezoelectric drive module 216 may operate according to control signals from the controller 936. In the present embodiment, the piezoelectric drive module 216 includes a piezoelectric stack, a plunger 293, and an asymmetrical flexure 294. The asymmetrical flexure 294 may be an integral part of actuator body 274 and may include a coupling element 297 that connects the asymmetrical flexure 294 to the plunger 293. A spring may be implemented to apply a spring force to the plunger 293 and the piezoelectric stacks to keep them in compression.

[0170] The plunger 293 may function as a mechanical interface connecting the piezoelectric stack with the asymmetrical flexure 294. The spring may be compressed in the assembly such that the spring force generated by the spring applies a constant load on piezoelectric stack, which preloads the piezoelectric stack. The asymmetrical flexure 294, which may be comprised of a metal, has an arm that is physically secured with an end of the drive pin 236 opposite to the tip 234 of drive pin 236. The asymmetrical flexure 294 functions as a mechanical amplifier that may convert the relatively small displacement of the piezoelectric stack into a useful displacement for the drive pin 236 that is significantly larger than the displacement of the piezoelectric stack.

[0171 ] The piezoelectric stack of the piezoelectric drive module 216 may be a laminate comprised of layers of a piezoelectric ceramic that alternate with layers of a conductor as is conventional in the art. The spring force from the spring maintains the laminated layers of the piezoelectric stack in a steady state of compression. The conductors in the piezoelectric stack are electrically coupled with a driver circuit, which supplies current-limited output signals, in a manner well known in the art, with pulse width modulation, frequency modulation, or a combination thereof. When power is periodically supplied from a driver circuit, electric fields are established that change the dimensions of the piezoelectric ceramic layers in the piezoelectric stack.

[0172] The dimensional changes experienced by the piezoelectric stack, which are mechanically amplified by the asymmetrical flexure 294, move the drive pin 236 linearly in a direction parallel to its longitudinal axis. When the piezoelectric ceramic layers of the piezoelectric stack expand, the spring is compressed by the force of the expansion and the asymmetrical flexure 294 pivots about a fixed pivot axis to cause movement of the tip 234 of the drive pin 236 upward and away from the wall 262 of the movable element 260. This allows the biasing element 268 to move the valve element 214 away from the valve seat 252. When the actuation force is removed and the piezoelectric ceramic layers of the piezoelectric stack are permitted to contract, the spring expands and the asymmetrical flexure 294 pivots to move the drive pin 236 downward so that the tip 234 moves into contact with the wall 262, causing the valve element 214 to contact the valve seat 252 and jet a droplet, stream, and/or discrete volume of material. Thus, in the de-energized state, the piezoelectric drive module 216 maintains the valve in a normally closed position. In normal operation, the asymmetrical flexure 294 intermittently rocks in opposite directions about a fixed pivot axis as the piezoelectric stacks are energized and de-energized to move the tip 234 of drive pin 236 into and out of contact with the wall 262 of the movable element 260 to jet droplets of material at a rapid rate.

[0173] Accordingly, the disclosure has set forth a dispensing system configured with an acoustic device to provide manipulation of dispensing fluid and processes of implementing a dispensing system configured with an acoustic device to provide manipulation of dispensing fluid are provided. Further, the disclosure has set forth a dispensing system configured with an acoustic device to provide thin-stream high- flowrate dispensing and processes of implementing the same is provided.

[0174] The following are a number of nonlimiting EXAMPLES of aspects of the disclosure. [0175] One EXAMPLE: a fluid dispensing system includes a dispenser that includes a nozzle configured to dispense a fluid material to form an initial fluid portion for placement in and/or on a dispense location. The fluid dispensing system in addition includes an acoustic processing system configured to manipulate the initial fluid portion to form a modified fluid material. The fluid dispensing system moreover includes where the dispenser and/or the acoustic processing system are configured to place the modified fluid material at the dispense location and form a deposited fluid material.

[0176] One EXAMPLE: a fluid dispensing system includes a dispenser that includes a nozzle configured to dispense a fluid material to form an initial fluid portion for placement in and/or on a dispense location. The fluid dispensing system in addition includes an acoustic processing system configured to manipulate the initial fluid portion to form a modified fluid material and/or a displaced fluid portion. The system moreover includes where the dispenser and/or the acoustic processing system are configured to place the modified fluid material and/or the displaced fluid portion at the dispense location and form a deposited fluid material.

[0177] The above-noted EXAMPLES may further include any one or a combination of more than one of the following EXAMPLES: The fluid dispensing system of the above-noted EXAMPLE where the dispenser and the nozzle are configured to dispense the initial fluid portion through and/or adjacent the acoustic processing system. The fluid dispensing system of the above-noted EXAMPLE where the dispenser and the nozzle are configured to dispense the initial fluid portion through standing sound waves to manipulate the initial fluid portion to form the modified fluid material. The fluid dispensing system of the above-noted EXAMPLE where the dispense location is on or between components. The fluid dispensing system of the above-noted EXAMPLE where the dispense location is a gap between the components, an area on the components, and/or an area under the components. The fluid dispensing system of the above-noted EXAMPLE where the components comprises a substrate, a semiconductor, a semiconductor chip, a semiconductor package, electronic device, an electronic chip, an electronic package, a circuit board, a printed circuit board, and/or a printed wire board. The fluid dispensing system of the above-noted EXAMPLE where the initial fluid portion is too large to be placed in the dispense location and the acoustic processing system is configured to manipulate the initial fluid portion so as to be shaped to be placed in the dispense location. The fluid dispensing system of the above-noted EXAMPLE includes: a dispensing mechanism and a fluid supply; and the dispensing mechanism is configured forcibly eject the fluid material from the nozzle to form the initial fluid portion. The fluid dispensing system of the above-noted EXAMPLE where the dispensing mechanism comprises an electromagnetically operated valve dispenser and/or a pneumatically operated valve dispenser. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is arranged between the nozzle and the dispense location; and where the dispenser is configured to dispense the initial fluid portion past and/or through the acoustic processing system to be manipulated and thereafter placed on and/or in the dispense location. The fluid dispensing system of the above-noted EXAMPLE where the fluid material comprises an underfill material, an adhesive, a coating material, a potting material, a mold material, a surface mount adhesive material, a solder paste material, a conductive adhesive material, a solder mask material, a flux material, a thermal compound, an encapsulation material, an epoxy material, a thermosetting plastic, and/or a silicone rubber gel. The fluid dispensing system of the above-noted EXAMPLE where the dispense location comprises a surface, a gap, a location, and/or a component on, under, and/or in the components or between two of the components. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system comprises: an acoustic device that is configured to generate sound waves; and a secondary acoustic device that is configured to generate second sound waves. The fluid dispensing system of the above-noted EXAMPLE where the sound waves and the second sound waves interact to generate standing sound waves. The fluid dispensing system of the above-noted EXAMPLE where the standing sound waves comprises a combination of the sound waves and the second sound waves that are moving in opposite directions. The fluid dispensing system of the above-noted EXAMPLE where the dispenser and the nozzle are configured to dispense the initial fluid portion through the standing sound waves to manipulate the initial fluid portion to form the modified fluid material. The fluid dispensing system of the above-noted EXAMPLE where the acoustic device and the secondary acoustic device are movably mounted to a support structure with a movement system. The fluid dispensing system of the above-noted EXAMPLE where the acoustic device is configured to be moved in a y-axis, an x-axis, and/or a z-axis by one or more motors, linear actuators, and/or gearing mechanisms; and where the secondary acoustic device is configured to be moved in the y-axis, the x-axis, and/or the z-axis by one or more motors, linear actuators, and/or gearing mechanisms. The fluid dispensing system of the above-noted EXAMPLE where the movement system is configured to move the acoustic device and/or the secondary acoustic device in response to the fluid dispensing system and/or a controller. The fluid dispensing system of the above-noted EXAMPLE where the movement system is configured to move the acoustic device and/or the secondary acoustic device to control a phase and/or a location of the sound waves, the second sound waves, and/or the standing sound waves. The fluid dispensing system of the above-noted EXAMPLE where the acoustic device and the secondary acoustic device are configured to generate the standing sound waves that include standing sound wave nodes to manipulate, capture, and/or move the initial fluid portion. The fluid dispensing system of the above-noted EXAMPLE where the acoustic device and the secondary acoustic device are configured to generate the standing sound waves that include standing sound wave nodes to form the modified fluid material. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system produces a pressure gradient generated by the standing sound waves that is configured to manipulate the initial fluid portion into the modified fluid material. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system comprises a plurality of implementations of the acoustic device configured in an array; and where the acoustic processing system that comprises a plurality of implementations of the secondary acoustic device configured in an array. The fluid dispensing system of the above-noted EXAMPLE where the array of the acoustic device are configured to generate an array of the sound waves; where the array of the secondary acoustic device are configured to generate an array of the second sound waves; and where the array of the acoustic device and the array of the secondary acoustic device are configured to generate an array of the standing sound waves. The fluid dispensing system of the above-noted EXAMPLE where the fluid dispensing system is configured to reduce a number of implementations of the dispenser through implementation of the acoustic processing system implementing the array of multiple implementations of the acoustic device and the array of multiple implementations of the secondary acoustic device. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system implementing the array of multiple implementations of the acoustic device and the array of multiple implementations of the secondary acoustic device is configured to trap and manipulate multiple portions of the initial fluid portion, independently, at once, in three-dimensional space. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system implementing the array of multiple implementations of the acoustic device and the array of multiple implementations of the secondary acoustic device is configured to move multiple portions of the initial fluid portion. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system comprises a circular acoustic device arrangement; where a plurality of the acoustic device are arranged in the circular acoustic device arrangement; and where a plurality of the secondary acoustic device are arranged in the circular acoustic device arrangement. The fluid dispensing system of the above-noted EXAMPLE where the plurality of the acoustic device held in the circular acoustic device arrangement are configured to generate the sound waves toward the initial fluid portion; and where the plurality of the secondary acoustic device held in the circular acoustic device arrangement are configured to generate the second sound waves toward the initial fluid portion. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is configured generate the sound waves, the second sound waves, and the standing sound waves to change a trajectory of the initial fluid portion along an x-axis, along a y-axis, and/or along a z-axis to obtain a changed trajectory of a displaced fluid portion. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is configured to generate the sound waves, the second sound waves, and the standing sound waves to change a velocity of the initial fluid portion along an x-axis, along a y-axis, and/or along a z-axis to obtain a changed velocity of a displaced fluid portion. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is configured for manipulation of the deposited fluid material to obtain a distributed fluid portion. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is configured to implement the acoustic device such that the sound waves are focused on components, the dispense location, and/or the deposited fluid material; and where the acoustic device is configured to generate the sound waves to obtain a distributed fluid portion. The fluid dispensing system of the above-noted EXAMPLE where the sound waves vibrate components, the dispense location, and/or the deposited fluid material to ensure that the deposited fluid material spreads under the components to form the distributed fluid portion. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is configured for application assistance of the deposited fluid material using focused ultrasound for capillary action assistance. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is configured as a mechanism for assisting a capillary action of the deposited fluid material. The fluid dispensing system of the above-noted EXAMPLE where the acoustic device is configured to generate the sound waves directed towards the dispense location, components, and/or the deposited fluid material. The fluid dispensing system of the above-noted EXAMPLE includes: a sensor system configured to sense a trajectory, a position, a velocity, and/or a shape of the initial fluid portion, the modified fluid material, and/or a displaced fluid portion; and the sensor system is configured to generate data on a trajectory, a position, a velocity, and/or a shape of the initial fluid portion, the modified fluid material, and/or the displaced fluid portion. The fluid dispensing system of the above-noted EXAMPLE includes: a controller configured to receive the data on the trajectory, the position, velocity, and/or the shape of the initial fluid portion, the modified fluid material, and/or a displaced fluid portion, where the controller is configured control operation of the acoustic processing system based on the sensor system. The fluid dispensing system of the above-noted EXAMPLE where the controller is configured to control a phase, amplitude, frequency, and/or location of the acoustic device, the secondary acoustic device, the sound waves, the second sound waves, and/or the standing sound waves. The fluid dispensing system of the abovenoted EXAMPLE where the controller is configured implement artificial intelligence and/or machine learning to learn manipulations of the acoustic processing system on a trajectory, a position, a velocity, and/or a shape, of the initial fluid portion, the modified fluid material, and/or a displaced fluid portion. The fluid dispensing system of the abovenoted EXAMPLE where the controller is configured to implement the artificial intelligence and/or the machine learning to control operation of the acoustic processing system based on the sensor system. The fluid dispensing system of the above-noted EXAMPLE where the controller is configured to implement the artificial intelligence and/or the machine learning to control a phase, an amplitude, a frequency, and/or a location of the acoustic device, the secondary acoustic device, the sound waves, the second sound waves, and/or the standing sound waves. The fluid dispensing system of the above-noted EXAMPLE where the acoustic device is implemented as an electromagnetic acoustic transducer and/or a piezoelectric acoustic transducer. The fluid dispensing system of the above-noted EXAMPLE where the secondary acoustic device comprises a sound reflective surface, a sound reflective structure, and/or a flat surface configured to reflect sound. The fluid dispensing system of the above-noted EXAMPLE where the secondary acoustic device comprises a sound reflective surface, a sound reflective structure, and/or a flat surface configured to reflect the sound waves. The fluid dispensing system of the above-noted EXAMPLE where the secondary acoustic device comprises an electromagnetic acoustic transducer and/or a piezoelectric acoustic transducer configured to generate the second sound waves. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system comprises a plurality of implementations of the acoustic device. The fluid dispensing system of the above-noted EXAMPLE where the modified fluid material is sized so as to be placed in the dispense location. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is configured to modify the initial fluid portion to be the modified fluid material. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is configured to compress the initial fluid portion into the modified fluid material. The fluid dispensing system of the above-noted EXAMPLE where an implementation of the acoustic processing system is configured to support using longer stinger-type nozzle implementations of the nozzle on the dispenser. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is attached to the dispenser, integrated into the dispenser, integrated into the fluid dispensing system, added on the fluid dispensing system, added on the dispenser, and/or implemented separately. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is configured to be attached to the dispenser. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is configured to be integrated into the fluid dispensing system. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is configured to be added on the fluid dispensing system. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is configured to be added on the dispenser. The fluid dispensing system of the abovenoted EXAMPLE where the acoustic processing system is configured to be implemented separately. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is configured to implement a constantly rotating ring of pressure nodes into which multiple portions of the initial fluid portion are dispensed from multiple implementations of the dispenser and from which multiple portions of a displaced fluid portion are sent to their target destinations to form the deposited fluid material. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is configured for displacement of the initial fluid portion to obtain a displaced fluid portion. The fluid dispensing system of the abovenoted EXAMPLE where the acoustic processing system is mounted to the dispenser. The fluid dispensing system of the above-noted EXAMPLE where the acoustic processing system is mounted to a staging area. The fluid dispensing system of the above-noted EXAMPLE includes: a positioner configured to selectively position the dispenser above a production area. The fluid dispensing system of the above-noted EXAMPLE where the positioner comprises a three-axis positioner that includes independently controllable x-axis and y-axis drives configured to move the dispenser and/or the acoustic processing system in a horizontal plane above the production area.

[0178] One EXAMPLE: a process includes configuring a dispenser with a nozzle to dispense a fluid material to form an initial fluid portion for placement in and/or on a dispense location. The process in addition includes configuring an acoustic processing system to manipulate the initial fluid portion to form a modified fluid material. The process moreover includes where the dispenser and/or the acoustic processing system are configured to place the modified fluid material at the dispense location and form a deposited fluid material.

[0179] One EXAMPLE: a process includes configuring a dispenser with a nozzle to dispense a fluid material to form an initial fluid portion for placement in and/or on a dispense location. The process in addition includes configuring an acoustic processing system to manipulate the initial fluid portion to form a modified fluid material and/or a displaced fluid portion. The process moreover includes where the dispenser and/or the acoustic processing system are configured to place the modified fluid material and/or the displaced fluid portion at the dispense location and form a deposited fluid material.

[0180] The above-noted EXAMPLES may further include any one or a combination of more than one of the following EXAMPLES: The process of the abovenoted EXAMPLE where the dispenser and the nozzle are configured to dispense the initial fluid portion through and/or adjacent the acoustic processing system. The process of the above-noted EXAMPLE where the dispenser and the nozzle are configured to dispense the initial fluid portion through standing sound waves to manipulate the initial fluid portion to form the modified fluid material. The process of the above-noted EXAMPLE where the dispense location is on or between components. The process of the above-noted EXAMPLE where the dispense location is a gap between the components, an area on the components, and/or an area under the components. The process of the above-noted EXAMPLE where the components comprises a substrate, a semiconductor, a semiconductor chip, a semiconductor package, electronic device, an electronic chip, an electronic package, a circuit board, a printed circuit board, and/or a printed wire board. The process of the above-noted EXAMPLE where the initial fluid portion is too large to be placed in the dispense location and the acoustic processing system is configured to manipulate the initial fluid portion so as to be shaped to be placed in the dispense location. The process of the above-noted EXAMPLE includes: providing a dispensing mechanism and a fluid supply; and configuring the dispensing mechanism to forcibly eject the fluid material from the nozzle to form the initial fluid portion. The process of the above-noted EXAMPLE where the dispensing mechanism comprises an electromagnetically operated valve dispenser and/or a pneumatically operated valve dispenser. The process of the above-noted EXAMPLE where the acoustic processing system is arranged between the nozzle and the dispense location; and where the dispenser is configured to dispense the initial fluid portion past and/or through the acoustic processing system to be manipulated and thereafter placed on and/or in the dispense location. The process of the above-noted EXAMPLE where the fluid material comprises an underfill material, an adhesive, a coating material, a potting material, a mold material, a surface mount adhesive material, a solder paste material, a conductive adhesive material, a solder mask material, a flux material, a thermal compound, an encapsulation material, an epoxy material, a thermosetting plastic, and/or a silicone rubber gel. The process of the above-noted EXAMPLE where the dispense location comprises a surface, a gap, a location, and/or a component on, under, and/or in the components or between two of the components. The process of the above-noted EXAMPLE where the acoustic processing system comprises: an acoustic device that is configured to generate sound waves; and a secondary acoustic device that is configured to generate second sound waves. The process of the above-noted EXAMPLE where the sound waves and the second sound waves interact to generate standing sound waves. The process of the above-noted EXAMPLE where the standing sound waves comprises a combination of the sound waves and the second sound waves that are moving in opposite directions. The process of the above-noted EXAMPLE where the dispenser and the nozzle are configured to dispense the initial fluid portion through the standing sound waves to manipulate the initial fluid portion to form the modified fluid material. The process of the above-noted EXAMPLE where the acoustic device and the secondary acoustic device are movably mounted to a support structure with a movement system. The process of the above-noted EXAMPLE where the acoustic device is configured to be moved in a y-axis, an x-axis, and/or a z-axis by one or more motors, linear actuators, and/or gearing mechanisms; and where the secondary acoustic device is configured to be moved in the y-axis, the x-axis, and/or the z-axis by one or more motors, linear actuators, and/or gearing mechanisms. The process of the above-noted EXAMPLE where the movement system is configured to move the acoustic device and/or the secondary acoustic device in response to the fluid dispensing system and/or a controller. The process of the above-noted EXAMPLE where the movement system is configured to move the acoustic device and/or the secondary acoustic device to control a phase and/or a location of the sound waves, the second sound waves, and/or the standing sound waves. The process of the abovenoted EXAMPLE where the acoustic device and the secondary acoustic device are configured to generate the standing sound waves that include standing sound wave nodes to manipulate, capture, and/or move the initial fluid portion. The process of the above-noted EXAMPLE where the acoustic device and the secondary acoustic device are configured to generate the standing sound waves that include standing sound wave nodes to form the modified fluid material. The process of the above-noted EXAMPLE where the acoustic processing system produces a pressure gradient generated by the standing sound waves that is configured to manipulate the initial fluid portion into the modified fluid material. The process of the above-noted EXAMPLE where the acoustic processing system comprises a plurality of implementations of the acoustic device configured in an array; and where the acoustic processing system that comprises a plurality of implementations of the secondary acoustic device configured in an array. The process of the above-noted EXAMPLE where the array of the acoustic device are configured to generate an array of the sound waves; where the array of the secondary acoustic device are configured to generate an array of the second sound waves; and where the array of the acoustic device and the array of the secondary acoustic device are configured to generate an array of the standing sound waves. The process of the above-noted EXAMPLE where the fluid dispensing system is configured to reduce a number of implementations of the dispenser through implementation of the acoustic processing system implementing the array of multiple implementations of the acoustic device and the array of multiple implementations of the secondary acoustic device. The process of the above-noted EXAMPLE where the acoustic processing system implementing the array of multiple implementations of the acoustic device and the array of multiple implementations of the secondary acoustic device is configured to trap and manipulate multiple portions of the initial fluid portion, independently, at once, in three- dimensional space. The process of the above-noted EXAMPLE where the acoustic processing system implementing the array of multiple implementations of the acoustic device and the array of multiple implementations of the secondary acoustic device is configured to move multiple portions of the initial fluid portion. The process of the above-noted EXAMPLE where the acoustic processing system comprises a circular acoustic device arrangement; where a plurality of the acoustic device are arranged in the circular acoustic device arrangement; and where a plurality of the secondary acoustic device are arranged in the circular acoustic device arrangement. The process of the above-noted EXAMPLE where the plurality of the acoustic device held in the circular acoustic device arrangement are configured to generate the sound waves toward the initial fluid portion; and where the plurality of the secondary acoustic device held in the circular acoustic device arrangement are configured to generate the second sound waves toward the initial fluid portion. The process of the above-noted EXAMPLE where the acoustic processing system is configured generate the sound waves, the second sound waves, and the standing sound waves to change a trajectory of the initial fluid portion along an x-axis, along a y-axis, and/or along a z-axis to obtain a changed trajectory of a displaced fluid portion. The process of the above-noted EXAMPLE where the acoustic processing system is configured to generate the sound waves, the second sound waves, and the standing sound waves to change a velocity of the initial fluid portion along an x-axis, along a y-axis, and/or along a z-axis to obtain a changed velocity of a displaced fluid portion. The process of the above-noted EXAMPLE where the acoustic processing system is configured for manipulation of the deposited fluid material to obtain a distributed fluid portion. The process of the above-noted EXAMPLE where the acoustic processing system is configured to implement the acoustic device such that the sound waves are focused on components, the dispense location, and/or the deposited fluid material; and where the acoustic device is configured to generate the sound waves to obtain a distributed fluid portion. The process of the above-noted EXAMPLE where the sound waves vibrate components, the dispense location, and/or the deposited fluid material to ensure that the deposited fluid material spreads under the components to form the distributed fluid portion. The process of the above-noted EXAMPLE where the acoustic processing system is configured for application assistance of the deposited fluid material using focused ultrasound for capillary action assistance. The process of the above-noted EXAMPLE where the acoustic processing system is configured as a mechanism for assisting a capillary action of the deposited fluid material. The process of the above-noted EXAMPLE where the acoustic device is configured to generate the sound waves directed towards the dispense location, components, and/or the deposited fluid material. The process of the above-noted EXAMPLE includes: configuring a sensor system to sense a trajectory, a position, a velocity, and/or a shape of the initial fluid portion, the modified fluid material, and/or a displaced fluid portion; and the sensor system is configured to generate data on a trajectory, a position, a velocity, and/or a shape of the initial fluid portion, the modified fluid material, and/or the displaced fluid portion. The process of the above-noted EXAMPLE includes: configuring a controller to receive the data on the trajectory, the position, velocity, and/or the shape of the initial fluid portion, the modified fluid material, and/or a displaced fluid portion, where the controller is configured control operation of the acoustic processing system based on the sensor system. The process of the abovenoted EXAMPLE where the controller is configured to control a phase, amplitude, frequency, and/or location of the acoustic device, the secondary acoustic device, the sound waves, the second sound waves, and/or the standing sound waves. The process of the above-noted EXAMPLE where the controller is configured implement artificial intelligence and/or machine learning to learn manipulations of the acoustic processing system on a trajectory, a position, a velocity, and/or a shape, of the initial fluid portion, the modified fluid material, and/or a displaced fluid portion. The process of the abovenoted EXAMPLE where the controller is configured to implement the artificial intelligence and/or the machine learning to control operation of the acoustic processing system based on the sensor system. The process of the above-noted EXAMPLE where the controller is configured to implement the artificial intelligence and/or the machine learning to control a phase, an amplitude, a frequency, and/or a location of the acoustic device, the secondary acoustic device, the sound waves, the second sound waves, and/or the standing sound waves. The process of the above-noted EXAMPLE where the acoustic device is implemented as an electromagnetic acoustic transducer and/or a piezoelectric acoustic transducer. The process of the above-noted EXAMPLE where the secondary acoustic device comprises a sound reflective surface, a sound reflective structure, and/or a flat surface configured to reflect sound. The process of the abovenoted EXAMPLE where the secondary acoustic device comprises a sound reflective surface, a sound reflective structure, and/or a flat surface configured to reflect the sound waves. The process of the above-noted EXAMPLE where the secondary acoustic device comprises an electromagnetic acoustic transducer and/or a piezoelectric acoustic transducer configured to generate the second sound waves. The process of the above-noted EXAMPLE where the acoustic processing system comprises a plurality of implementations of the acoustic device. The process of the above-noted EXAMPLE where the modified fluid material is sized so as to be placed in the dispense location. The process of the above-noted EXAMPLE where the acoustic processing system is configured to modify the initial fluid portion to be the modified fluid material. The process of the above-noted EXAMPLE where the acoustic processing system is configured to compress the initial fluid portion into the modified fluid material. The process of the above-noted EXAMPLE where an implementation of the acoustic processing system is configured to support using longer stinger-type nozzle implementations of the nozzle on the dispenser. The process of the above-noted EXAMPLE where the acoustic processing system is attached to the dispenser, integrated into the dispenser, integrated into the fluid dispensing system, added on the fluid dispensing system, added on the dispenser, and/or implemented separately. The process of the above-noted EXAMPLE where the acoustic processing system is configured to be attached to the dispenser. The process of the above-noted EXAMPLE where the acoustic processing system is configured to be integrated into the fluid dispensing system. The process of the abovenoted EXAMPLE where the acoustic processing system is configured to be added on the fluid dispensing system. The process of the above-noted EXAMPLE where the acoustic processing system is configured to be added on the dispenser. The process of the above-noted EXAMPLE where the acoustic processing system is configured to be implemented separately. The process of the above-noted EXAMPLE where the acoustic processing system is configured to implement a constantly rotating ring of pressure nodes into which multiple portions of the initial fluid portion are dispensed from multiple implementations of the dispenser and from which multiple portions of a displaced fluid portion are sent to their target destinations to form the deposited fluid material. The process of the above-noted EXAMPLE where the acoustic processing system is configured for displacement of the initial fluid portion to obtain a displaced fluid portion. The process of the above-noted EXAMPLE where the acoustic processing system is mounted to the dispenser. The process of the above-noted EXAMPLE where the acoustic processing system is mounted to a staging area. The process of the abovenoted EXAMPLE includes: configuring a positioner to selectively position the dispenser above a production area. The process of the above-noted EXAMPLE where the positioner comprises a three-axis positioner that includes independently controllable x- axis and y-axis drives configured to move the dispenser and/or the acoustic processing system in a horizontal plane above the production area.

[0181 ] It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the disclosure. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

[0182] It will be understood that when an element such as a layer, region, or substrate is referred to as being "on" or extending "onto" another element, it can be directly on or extend directly onto another element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or extending "directly onto" another element, there are no intervening elements present. Likewise, it will be understood that when an element such as a layer, region, or substrate is referred to as being "over" or extending "over" another element, it can be directly over or extend directly over another element or intervening elements may also be present. In contrast, when an element is referred to as being "directly over" or extending "directly over" another element, there are no intervening elements present. It will also be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to another element or intervening elements may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present.

[0183] Relative terms such as "below" or "above" or "upper" or "lower" or "horizontal" or "vertical" may be used herein to describe a relationship of one element, layer, or region to another element, layer, or region as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures.

[0184] The terminology used herein is for the purpose of describing particular aspects only and is not intended to be limiting of the disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes," and/or "including" when used herein specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

[0185] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning that is consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0186] It should also be noted that the software implementations of the disclosure as described herein are optionally stored on a tangible storage medium, such as: a magnetic medium such as a disk or tape; a magneto-optical or optical medium such as a disk; or a solid state medium such as a memory card or other package that houses one or more read-only (non-volatile) memories, random access memories, or other rewritable (volatile) memories. A digital file attachment to email or other self-contained information archive or set of archives is considered a distribution medium equivalent to a tangible storage medium. Accordingly, the disclosure is considered to include a tangible storage medium or distribution medium, as listed herein and including art- recognized equivalents and successor media, in which the software implementations herein are stored.

[0187] Additionally, the various aspects of the disclosure may be implemented in a non-generic computer implementation. Moreover, the various aspects of the disclosure set forth herein improve the functioning of the system as is apparent from the disclosure hereof. Furthermore, the various aspects of the disclosure involve computer hardware that it specifically programmed to solve the complex problem addressed by the disclosure. Accordingly, the various aspects of the disclosure improve the functioning of the system overall in its specific implementation to perform the process set forth by the disclosure and as defined by the claims.

[0188] The artificial intelligence and/or machine learning may utilize any number of approaches including one or more of cybernetics and brain simulation, symbolic, cognitive simulation, logic-based, anti-logic, knowledge-based, sub-symbolic, embodied intelligence, computational intelligence and soft computing, machine learning and statistics, and the like.

[0189] The many features and advantages of the disclosure are apparent from the detailed specification, and, thus, it is intended by the appended claims to cover all such features and advantages of the disclosure which fall within the true spirit and scope of the disclosure. Further, since numerous modifications and variations will readily occur to those skilled in the art, it is not desired to limit the disclosure to the exact construction and operation illustrated and described, and, accordingly, all suitable modifications and equivalents may be resorted to that fall within the scope of the disclosure.

Claims

CLAIMS:

1 . A fluid dispensing system comprising: a dispenser that includes a nozzle configured to dispense a fluid material to form an initial fluid portion for placement in and/or on a dispense location; and an acoustic processing system configured to manipulate the initial fluid portion to form a modified fluid material and/or a displaced fluid portion, wherein the dispenser and/or the acoustic processing system are configured to place the modified fluid material and/or the displaced fluid portion at the dispense location and form a deposited fluid material.

2. The fluid dispensing system according to claim 1 wherein the dispenser and the nozzle are configured to dispense the initial fluid portion through and/or adjacent the acoustic processing system.

3. The fluid dispensing system according to claim 1 wherein the dispenser and the nozzle are configured to dispense the initial fluid portion through standing sound waves to manipulate the initial fluid portion to form the modified fluid material.

4. The fluid dispensing system according to claim 1 wherein the dispense location is on or between components.

5. The fluid dispensing system according to claim 4 wherein the dispense location is a gap between the components, an area on the components, and/or an area under the components.

6. The fluid dispensing system according to claim 1 wherein the initial fluid portion is too large to be placed in the dispense location and the acoustic processing system is configured to manipulate the initial fluid portion so as to be shaped to be placed in the dispense location.

7. The fluid dispensing system according to claim 1 further comprising: a dispensing mechanism and a fluid supply; and the dispensing mechanism is configured forcibly eject the fluid material from the nozzle to form the initial fluid portion.

8. The fluid dispensing system according to claim 7 wherein the dispensing mechanism comprises an electromagnetically operated valve dispenser and/or a pneumatically operated valve dispenser.

9. The fluid dispensing system according to claim 1 wherein the acoustic processing system is arranged between the nozzle and the dispense location; and wherein the dispenser is configured to dispense the initial fluid portion past and/or through the acoustic processing system to be manipulated and thereafter placed on and/or in the dispense location.

10. The fluid dispensing system according to claim 1 wherein the fluid material comprises an underfill material, an adhesive, a coating material, a potting material, a mold material, a surface mount adhesive material, a solder paste material, a conductive adhesive material, a solder mask material, a flux material, a thermal compound, an encapsulation material, an epoxy material, a thermosetting plastic, and/or a silicone rubber gel.

11 . The fluid dispensing system according to claim 4 wherein the components comprises a substrate, a semiconductor, a semiconductor chip, a semiconductor package, electronic device, an electronic chip, an electronic package, a circuit board, a printed circuit board, and/or a printed wire board.

12. The fluid dispensing system according to claim 1 wherein the dispense location comprises a surface, a gap, a location, and/or a component on, under, and/or in the components or between two of the components.

13. The fluid dispensing system according to claim 1 wherein the acoustic processing system comprises: an acoustic device that is configured to generate sound waves; and a secondary acoustic device that is configured to generate second sound waves.

14. The fluid dispensing system according to claim 13 wherein the sound waves and the second sound waves interact to generate standing sound waves.

15. The fluid dispensing system according to claim 14 wherein the standing sound waves comprises a combination of the sound waves and the second sound waves that are moving in opposite directions.

16. The fluid dispensing system according to claim 13 wherein the acoustic device is implemented as an electromagnetic acoustic transducer and/or a piezoelectric acoustic transducer.

17. The fluid dispensing system according to claim 13 wherein the secondary acoustic device comprises a sound reflective surface, a sound reflective structure, and/or a flat surface configured to reflect sound.

18. The fluid dispensing system according to claim 13 wherein the secondary acoustic device comprises a sound reflective surface, a sound reflective structure, and/or a flat surface configured to reflect the sound waves.

19. The fluid dispensing system according to claim 13 wherein the secondary acoustic device comprises an electromagnetic acoustic transducer and/or a piezoelectric acoustic transducer configured to generate the second sound waves.

20. The fluid dispensing system according to claim 1 wherein the dispenser and the nozzle are configured to dispense the initial fluid portion through the standing sound waves to manipulate the initial fluid portion to form the modified fluid material.

21 . The fluid dispensing system according to claim 1 wherein the modified fluid material is sized so as to be placed in the dispense location.

22. The fluid dispensing system according to claim 1 wherein the acoustic processing system is configured to modify the initial fluid portion to be the modified fluid material.

23. The fluid dispensing system according to claim 1 wherein the acoustic processing system is configured to compress the initial fluid portion into the modified fluid material.

24. The fluid dispensing system according to claim 1 wherein an implementation of the acoustic processing system is configured to support using longer stinger-type nozzle implementations of the nozzle on the dispenser.

25. The fluid dispensing system according to claim 14 wherein the acoustic device and the secondary acoustic device are movably mounted to a support structure with a movement system.

26. The fluid dispensing system according to claim 25 wherein the acoustic device is configured to be moved in a y-axis, an x-axis, and/or a z-axis by one or more motors, linear actuators, and/or gearing mechanisms; and wherein the secondary acoustic device is configured to be moved in the y-axis, the x-axis, and/or the z-axis by one or more motors, linear actuators, and/or gearing mechanisms.

27. The fluid dispensing system according to claim 25 wherein the movement system is configured to move the acoustic device and/or the secondary acoustic device in response to the fluid dispensing system and/or a controller.

28. The fluid dispensing system according to claim 25 wherein the movement system is configured to move the acoustic device and/or the secondary acoustic device to control a phase and/or a location of the sound waves, the second sound waves, and/or the standing sound waves.

29. The fluid dispensing system according to claim 14 wherein the acoustic device and the secondary acoustic device are configured to generate the standing sound waves that include standing sound wave nodes to manipulate, capture, and/or move the initial fluid portion.

30. The fluid dispensing system according to claim 14 wherein the acoustic device and the secondary acoustic device are configured to generate the standing sound waves that include standing sound wave nodes to form the modified fluid material.

31 . The fluid dispensing system according to claim 1 wherein the acoustic processing system is attached to the dispenser, integrated into the dispenser, integrated into the fluid dispensing system, added on the fluid dispensing system, added on the dispenser, and/or implemented separately.

32. The fluid dispensing system according to claim 1 wherein the acoustic processing system is configured to be attached to the dispenser.

33. The fluid dispensing system according to claim 1 wherein the acoustic processing system is configured to be integrated into the fluid dispensing system.

34. The fluid dispensing system according to claim 1 wherein the acoustic processing system is configured to be added on the fluid dispensing system.

35. The fluid dispensing system according to claim 1 wherein the acoustic processing system is configured to be added on the dispenser.

36. The fluid dispensing system according to claim 1 wherein the acoustic processing system is configured to be implemented separately.

37. The fluid dispensing system according to claim 14 wherein the acoustic processing system produces a pressure gradient generated by the standing sound waves that is configured to manipulate the initial fluid portion into the modified fluid material.

38. The fluid dispensing system according to claim 13 wherein the acoustic processing system comprises a plurality of implementations of the acoustic device.

39. The fluid dispensing system according to claim 14 wherein the acoustic processing system comprises a plurality of implementations of the acoustic device configured in an array; and wherein the acoustic processing system that comprises a plurality of implementations of the secondary acoustic device configured in an array.

40. The fluid dispensing system according to claim 39 wherein the array of the acoustic device are configured to generate an array of the sound waves; wherein the array of the secondary acoustic device are configured to generate an array of the second sound waves; and wherein the array of the acoustic device and the array of the secondary acoustic device are configured to generate an array of the standing sound waves.

41 . The fluid dispensing system according to claim 39 wherein the fluid dispensing system is configured to reduce a number of implementations of the dispenser through implementation of the acoustic processing system implementing the array of multiple implementations of the acoustic device and the array of multiple implementations of the secondary acoustic device.

42. The fluid dispensing system according to claim 39 wherein the acoustic processing system implementing the array of multiple implementations of the acoustic device and the array of multiple implementations of the secondary acoustic device is configured to trap and manipulate multiple portions of the initial fluid portion, independently, at once, in three-dimensional space.

43. The fluid dispensing system according to claim 39 wherein the acoustic processing system implementing the array of multiple implementations of the acoustic device and the array of multiple implementations of the secondary acoustic device is configured to move multiple portions of the initial fluid portion.

44. The fluid dispensing system according to claim 1 wherein the acoustic processing system is configured to implement a constantly rotating ring of pressure nodes into which multiple portions of the initial fluid portion are dispensed from multiple implementations of the dispenser and from which multiple portions of the displaced fluid portion are sent to their target destinations to form the deposited fluid material.

45. The fluid dispensing system according to claim 14 wherein the acoustic processing system comprises a circular acoustic device arrangement; wherein a plurality of the acoustic device are arranged in the circular acoustic device arrangement; and wherein a plurality of the secondary acoustic device are arranged in the circular acoustic device arrangement.

46. The fluid dispensing system according to claim 45 wherein the plurality of the acoustic device held in the circular acoustic device arrangement are configured to generate the sound waves toward the initial fluid portion; and wherein the plurality of the secondary acoustic device held in the circular acoustic device arrangement are configured to generate the second sound waves toward the initial fluid portion.

47. The fluid dispensing system according to claim 1 wherein the acoustic processing system is configured for displacement of the initial fluid portion to obtain the displaced fluid portion.

48. The fluid dispensing system according to claim 14 wherein the acoustic processing system is configured generate the sound waves, the second sound waves, and the standing sound waves to change a trajectory of the initial fluid portion along an x-axis, along a y-axis, and/or along a z-axis to obtain a changed trajectory of the displaced fluid portion.

49. The fluid dispensing system according to claim 14 wherein the acoustic processing system is configured to generate the sound waves, the second sound waves, and the standing sound waves to change a velocity of the initial fluid portion along an x-axis, along a y-axis, and/or along a z-axis to obtain a changed velocity of the fluid portion.

50. The fluid dispensing system according to claim 14 wherein the acoustic processing system is configured for manipulation of the deposited fluid material to obtain a distributed fluid portion.

51 . The fluid dispensing system according to claim 50 wherein the acoustic processing system is configured to implement the acoustic device such that the sound waves are focused on components, the dispense location, and/or the deposited fluid material; and wherein the acoustic device is configured to generate the sound waves to obtain a distributed fluid portion.

52. The fluid dispensing system according to claim 50 wherein the sound waves vibrate components, the dispense location, and/or the deposited fluid material to ensure that the deposited fluid material spreads under the components to form the distributed fluid portion.

53. The fluid dispensing system according to claim 50 wherein the acoustic processing system is configured for application assistance of the deposited fluid material using focused ultrasound for capillary action assistance.

54. The fluid dispensing system according to claim 50 wherein the acoustic processing system is configured as a mechanism for assisting a capillary action of the deposited fluid material.

55. The fluid dispensing system according to claim 50 wherein the acoustic device is configured to generate the sound waves directed towards the dispense location, components, and/or the deposited fluid material.

56. The fluid dispensing system according to claim 1 wherein the acoustic processing system is mounted to the dispenser.

57. The fluid dispensing system according to claim 1 wherein the acoustic processing system is mounted to a staging area.

58. The fluid dispensing system according to claim 14 further comprising: a sensor system configured to sense a trajectory, a position, a velocity, and/or a shape of the initial fluid portion, the modified fluid material, and/or the displaced fluid portion; and the sensor system is configured to generate data on a trajectory, a position, a velocity, and/or a shape of the initial fluid portion, the modified fluid material, and/or the displaced fluid portion.

59. The fluid dispensing system according to claim 58 further comprising: a controller configured to receive the data on the trajectory, the position, velocity, and/or the shape of the initial fluid portion, the modified fluid material, and/or the displaced fluid portion, wherein the controller is configured control operation of the acoustic processing system based on the sensor system.

60. The fluid dispensing system according to claim 59 wherein the controller is configured to control a phase, amplitude, frequency, and/or location of the acoustic device, the secondary acoustic device, the sound waves, the second sound waves, and/or the standing sound waves.

61 . The fluid dispensing system according to claim 1 further comprising: a positioner configured to selectively position the dispenser above a production area.

62. The fluid dispensing system according to claim 61 wherein the positioner comprises a three-axis positioner that includes independently controllable x-axis and y- axis drives configured to move the dispenser and/or the acoustic processing system in a horizontal plane above the production area.

63. The fluid dispensing system according to claim 59 wherein the controller is configured implement an artificial intelligence and/or a machine learning to learn manipulations of the acoustic processing system on a trajectory, a position, a velocity, and/or a shape, of the initial fluid portion, the modified fluid material, and/or the displaced fluid portion.

64. The fluid dispensing system according to claim 63 wherein the controller is configured to implement the artificial intelligence and/or the machine learning to control operation of the acoustic processing system based on the sensor system.

65. The fluid dispensing system according to claim 63 wherein the controller is configured to implement the artificial intelligence and/or the machine learning to control a phase, an amplitude, a frequency, and/or a location of the acoustic device, the secondary acoustic device, the sound waves, the second sound waves, and/or the standing sound waves.

66. A process of implementing a fluid dispensing system comprising: configuring a dispenser with a nozzle to dispense a fluid material to form an initial fluid portion for placement in and/or on a dispense location; and configuring an acoustic processing system to manipulate the initial fluid portion to form a modified fluid material and/or a displaced fluid portion, wherein the dispenser and/or the acoustic processing system are configured to place the modified fluid material and/or the displaced fluid portion at the dispense location and form a deposited fluid material.

67. The process of implementing a fluid dispensing system according to claim 66 wherein the dispenser and the nozzle are configured to dispense the initial fluid portion through and/or adjacent the acoustic processing system.

68. The process of implementing a fluid dispensing system according to claim 66 wherein the dispenser and the nozzle are configured to dispense the initial fluid portion through standing sound waves to manipulate the initial fluid portion to form the modified fluid material.

69. The process of implementing a fluid dispensing system according to claim 66 wherein the dispense location is on or between components.

70. The process of implementing a fluid dispensing system according to claim 69 wherein the dispense location is a gap between the components, an area on the components, and/or an area under the components.

71 . The process of implementing a fluid dispensing system according to claim 66 wherein the initial fluid portion is too large to be placed in the dispense location and the acoustic processing system is configured to manipulate the initial fluid portion so as to be shaped to be placed in the dispense location.

72. The process of implementing a fluid dispensing system according to claim 66 further comprising: providing a dispensing mechanism and a fluid supply; and configuring the dispensing mechanism to forcibly eject the fluid material from the nozzle to form the initial fluid portion.

73. The process of implementing a fluid dispensing system according to claim 72 wherein the dispensing mechanism comprises an electromagnetically operated valve dispenser and/or a pneumatically operated valve dispenser.

74. The process of implementing a fluid dispensing system according to claim 66 wherein the acoustic processing system is arranged between the nozzle and the dispense location; and wherein the dispenser is configured to dispense the initial fluid portion past and/or through the acoustic processing system to be manipulated and thereafter placed on and/or in the dispense location.

75. The process of implementing a fluid dispensing system according to claim 66 wherein the fluid material comprises an underfill material, an adhesive, a coating material, a potting material, a mold material, a surface mount adhesive material, a solder paste material, a conductive adhesive material, a solder mask material, a flux material, a thermal compound, an encapsulation material, an epoxy material, a thermosetting plastic, and/or a silicone rubber gel.

76. The process of implementing a fluid dispensing system according to claim 69 wherein the components comprises a substrate, a semiconductor, a semiconductor chip, a semiconductor package, electronic device, an electronic chip, an electronic package, a circuit board, a printed circuit board, and/or a printed wire board.

77. The process of implementing a fluid dispensing system according to claim 66 wherein the dispense location comprises a surface, a gap, a location, and/or a component on, under, and/or in the components or between two of the components.

78. The process of implementing a fluid dispensing system according to claim 66 wherein the acoustic processing system comprises: an acoustic device that is configured to generate sound waves; and a secondary acoustic device that is configured to generate second sound waves.

79. The process of implementing a fluid dispensing system according to claim

78 wherein the sound waves and the second sound waves interact to generate standing sound waves.

80. The process of implementing a fluid dispensing system according to claim

79 wherein the standing sound waves comprises a combination of the sound waves and the second sound waves that are moving in opposite directions.

81 . The process of implementing a fluid dispensing system according to claim 78 wherein the acoustic device is implemented as an electromagnetic acoustic transducer and/or a piezoelectric acoustic transducer.

82. The process of implementing a fluid dispensing system according to claim 78 wherein the secondary acoustic device comprises a sound reflective surface, a sound reflective structure, and/or a flat surface configured to reflect sound.

83. The process of implementing a fluid dispensing system according to claim 78 wherein the secondary acoustic device comprises a sound reflective surface, a sound reflective structure, and/or a flat surface configured to reflect the sound waves.

84. The process of implementing a fluid dispensing system according to claim

78 wherein the secondary acoustic device comprises an electromagnetic acoustic transducer and/or a piezoelectric acoustic transducer configured to generate the second sound waves.

85. The process of implementing a fluid dispensing system according to claim

79 wherein the dispenser and the nozzle are configured to dispense the initial fluid portion through the standing sound waves to manipulate the initial fluid portion to form the modified fluid material.

86. The process of implementing a fluid dispensing system according to claim 66 wherein the modified fluid material is sized so as to be placed in the dispense location.

87. The process of implementing a fluid dispensing system according to claim 66 wherein the acoustic processing system is configured to modify the initial fluid portion to be the modified fluid material.

88. The process of implementing a fluid dispensing system according to claim 66 wherein the acoustic processing system is configured to compress the initial fluid portion into the modified fluid material.

89. The process of implementing a fluid dispensing system according to claim 66 wherein an implementation of the acoustic processing system is configured to support using longer stinger-type nozzle implementations of the nozzle on the dispenser.

90. The process of implementing a fluid dispensing system according to claim 79 wherein the acoustic device and the secondary acoustic device are movably mounted to a support structure with a movement system.

91 . The process of implementing a fluid dispensing system according to claim 90 wherein the acoustic device is configured to be moved in a y-axis, an x-axis, and/or a z-axis by one or more motors, linear actuators, and/or gearing mechanisms; and wherein the secondary acoustic device is configured to be moved in the y-axis, the x-axis, and/or the z-axis by one or more motors, linear actuators, and/or gearing mechanisms.

92. The process of implementing a fluid dispensing system according to claim 90 wherein the movement system is configured to move the acoustic device and/or the secondary acoustic device in response to the fluid dispensing system and/or a controller.

93. The process of implementing a fluid dispensing system according to claim 90 wherein the movement system is configured to move the acoustic device and/or the secondary acoustic device to control a phase and/or a location of the sound waves, the second sound waves, and/or the standing sound waves.

94. The process of implementing a fluid dispensing system according to claim 79 wherein the acoustic device and the secondary acoustic device are configured to generate the standing sound waves that include standing sound wave nodes to manipulate, capture, and/or move the initial fluid portion.

95. The process of implementing a fluid dispensing system according to claim 79 wherein the acoustic device and the secondary acoustic device are configured to generate the standing sound waves that include standing sound wave nodes to form the modified fluid material.

96. The process of implementing a fluid dispensing system according to claim 66 wherein the acoustic processing system is attached to the dispenser, integrated into the dispenser, integrated into the fluid dispensing system, added on the fluid dispensing system, added on the dispenser, and/or implemented separately.

97. The process of implementing a fluid dispensing system according to claim 66 wherein the acoustic processing system is configured to be attached to the dispenser.

98. The process of implementing a fluid dispensing system according to claim 66 wherein the acoustic processing system is configured to be integrated into the fluid dispensing system.

99. The process of implementing a fluid dispensing system according to claim 66 wherein the acoustic processing system is configured to be added on the fluid dispensing system.

100. The process of implementing a fluid dispensing system according to claim 66 wherein the acoustic processing system is configured to be added on the dispenser.

101. The process of implementing a fluid dispensing system according to claim 66 wherein the acoustic processing system is configured to be implemented separately.

102. The process of implementing a fluid dispensing system according to claim 79 wherein the acoustic processing system produces a pressure gradient generated by the standing sound waves that is configured to manipulate the initial fluid portion into the modified fluid material.

103. The process of implementing a fluid dispensing system according to claim 78 wherein the acoustic processing system comprises a plurality of implementations of the acoustic device.

104. The process of implementing a fluid dispensing system according to claim 79 wherein the acoustic processing system comprises a plurality of implementations of the acoustic device configured in an array; and wherein the acoustic processing system that comprises a plurality of implementations of the secondary acoustic device configured in an array.

105. The process of implementing a fluid dispensing system according to claim 104 wherein the array of the acoustic device are configured to generate an array of the sound waves; wherein the array of the secondary acoustic device are configured to generate an array of the second sound waves; and wherein the array of the acoustic device and the array of the secondary acoustic device are configured to generate an array of the standing sound waves.

106. The process of implementing a fluid dispensing system according to claim 104 wherein the fluid dispensing system is configured to reduce a number of implementations of the dispenser through implementation of the acoustic processing system implementing the array of multiple implementations of the acoustic device and the array of multiple implementations of the secondary acoustic device.

107. The process of implementing a fluid dispensing system according to claim 104 wherein the acoustic processing system implementing the array of multiple implementations of the acoustic device and the array of multiple implementations of the secondary acoustic device is configured to trap and manipulate multiple portions of the initial fluid portion, independently, at once, in three-dimensional space.

108. The process of implementing a fluid dispensing system according to claim 104 wherein the acoustic processing system implementing the array of multiple implementations of the acoustic device and the array of multiple implementations of the secondary acoustic device is configured to move multiple portions of the initial fluid portion.

109. The process of implementing a fluid dispensing system according to claim 66 wherein the acoustic processing system is configured to implement a constantly rotating ring of pressure nodes into which multiple portions of the initial fluid portion are dispensed from multiple implementations of the dispenser and from which multiple portions of the displaced fluid portion are sent to their target destinations to form the deposited fluid material.

110. The process of implementing a fluid dispensing system according to claim 79 wherein the acoustic processing system comprises a circular acoustic device arrangement; wherein a plurality of the acoustic device are arranged in the circular acoustic device arrangement; and wherein a plurality of the secondary acoustic device are arranged in the circular acoustic device arrangement.

111. The process of implementing a fluid dispensing system according to claim

110 wherein the plurality of the acoustic device held in the circular acoustic device arrangement are configured to generate the sound waves toward the initial fluid portion; and wherein the plurality of the secondary acoustic device held in the circular acoustic device arrangement are configured to generate the second sound waves toward the initial fluid portion.

112. The process of implementing a fluid dispensing system according to claim 66 wherein the acoustic processing system is configured for displacement of the initial fluid portion to obtain the displaced fluid portion.

113. The process of implementing a fluid dispensing system according to claim 79 wherein the acoustic processing system is configured generate the sound waves, the second sound waves, and the standing sound waves to change a trajectory of the initial fluid portion along an x-axis, along a y-axis, and/or along a z-axis to obtain a changed trajectory of the displaced fluid portion.

114. The process of implementing a fluid dispensing system according to claim 79 wherein the acoustic processing system is configured to generate the sound waves, the second sound waves, and the standing sound waves to change a velocity of the initial fluid portion along an x-axis, along a y-axis, and/or along a z-axis to obtain a changed velocity of the displaced fluid portion.

115. The process of implementing a fluid dispensing system according to claim 79 wherein the acoustic processing system is configured for manipulation of the deposited fluid material to obtain a distributed fluid portion.

116. The process of implementing a fluid dispensing system according to claim 115 wherein the acoustic processing system is configured to implement the acoustic device such that the sound waves are focused on components, the dispense location, and/or the deposited fluid material; and wherein the acoustic device is configured to generate the sound waves to obtain a distributed fluid portion.

117. The process of implementing a fluid dispensing system according to claim 115 wherein the sound waves vibrate components, the dispense location, and/or the deposited fluid material to ensure that the deposited fluid material spreads under the components to form the distributed fluid portion.

118. The process of implementing a fluid dispensing system according to claim 115 wherein the acoustic processing system is configured for application assistance of the deposited fluid material using focused ultrasound for capillary action assistance.

119. The process of implementing a fluid dispensing system according to claim 115 wherein the acoustic processing system is configured as a mechanism for assisting a capillary action of the deposited fluid material.

120. The process of implementing a fluid dispensing system according to claim 115 wherein the acoustic device is configured to generate the sound waves directed towards the dispense location, components, and/or the deposited fluid material.

121. The process of implementing a fluid dispensing system according to claim 66 wherein the acoustic processing system is mounted to the dispenser.

122. The process of implementing a fluid dispensing system according to claim 66 wherein the acoustic processing system is mounted to a staging area.

123. The process of implementing a fluid dispensing system according to claim

79 further comprising: configuring a sensor system to sense a trajectory, a position, a velocity, and/or a shape of the initial fluid portion, the modified fluid material, and/or the displaced fluid portion; and the sensor system is configured to generate data on a trajectory, a position, a velocity, and/or a shape of the initial fluid portion, the modified fluid material, and/or the displaced fluid portion.

124. The process of implementing a fluid dispensing system according to claim

123 further comprising: configuring a controller to receive the data on the trajectory, the position, velocity, and/or the shape of the initial fluid portion, the modified fluid material, and/or the displaced fluid portion, wherein the controller is configured control operation of the acoustic processing system based on the sensor system.

125. The process of implementing a fluid dispensing system according to claim

124 wherein the controller is configured to control a phase, amplitude, frequency, and/or location of the acoustic device, the secondary acoustic device, the sound waves, the second sound waves, and/or the standing sound waves.

126. The process of implementing a fluid dispensing system according to claim 66 further comprising: configuring a positioner to selectively position the dispenser above a production area.

127. The process of implementing a fluid dispensing system according to claim 126 wherein the positioner comprises a three-axis positioner that includes independently controllable x-axis and y-axis drives configured to move the dispenser and/or the acoustic processing system in a horizontal plane above the production area.

128. The process of implementing a fluid dispensing system according to claim 124 wherein the controller is configured implement an artificial intelligence and/or a machine learning to learn manipulations of the acoustic processing system on a trajectory, a position, a velocity, and/or a shape, of the initial fluid portion, the modified fluid material, and/or the displaced fluid portion.

129. The process of implementing a fluid dispensing system according to claim 128 wherein the controller is configured to implement the artificial intelligence and/or the machine learning to control operation of the acoustic processing system based on the sensor system.

130. The process of implementing a fluid dispensing system according to claim 128 wherein the controller is configured to implement the artificial intelligence and/or the machine learning to control a phase, an amplitude, a frequency, and/or a location of the acoustic device, the secondary acoustic device, the sound waves, the second sound waves, and/or the standing sound waves.