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WO2025158750A1 - Varnish for insulated flat electric wire, insulated flat electric wire, and method for manufacturing insulated flat electric wire - Google Patents

Varnish for insulated flat electric wire, insulated flat electric wire, and method for manufacturing insulated flat electric wire

Info

Publication number
WO2025158750A1
WO2025158750A1 PCT/JP2024/039999 JP2024039999W WO2025158750A1 WO 2025158750 A1 WO2025158750 A1 WO 2025158750A1 JP 2024039999 W JP2024039999 W JP 2024039999W WO 2025158750 A1 WO2025158750 A1 WO 2025158750A1
Authority
WO
WIPO (PCT)
Prior art keywords
varnish
rectangular
rectangular insulated
electric wire
insulated electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2024/039999
Other languages
French (fr)
Japanese (ja)
Inventor
昂大 岩本
晋吾 中島
博紹 持田
秀明 齋藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Sumitomo Electric Wintec Inc
Original Assignee
Sumitomo Electric Industries Ltd
Sumitomo Electric Wintec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Wintec Inc filed Critical Sumitomo Electric Industries Ltd
Publication of WO2025158750A1 publication Critical patent/WO2025158750A1/en
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/02Disposition of insulation

Definitions

  • This disclosure relates to a varnish for rectangular insulated wire, rectangular insulated wire, and a method for manufacturing rectangular insulated wire.
  • Patent Document 1 describes an insulating varnish that is applied to the surface of a conductor, then passes through a die to remove excess applied insulating varnish, and is then dried and baked to form an insulating coating on the surface of the conductor, and has a viscosity of 10 Pa ⁇ s or more at 30°C.
  • a varnish for rectangular insulated electric wire contains a polyimide precursor, which is a reaction product of an aromatic tetracarboxylic dianhydride and an aromatic diamine, and an organic solvent, wherein the organic solvent contains 50% by mass or more of an amide-based solvent having a boiling point of 150°C or higher and 190°C or lower, and has a viscosity at 30°C of 5 Pa ⁇ s or higher and 25 Pa ⁇ s or lower.
  • FIG. 1 is a cross-sectional view of a rectangular insulated electric wire according to one embodiment of the present disclosure.
  • the problem to be solved by the present disclosure is to provide a varnish for rectangular insulated electric wires that can form an insulating coating with a highly uniform thickness on rectangular insulated electric wires.
  • the varnish for a rectangular insulated electric wire can form an insulating coating with a highly uniform thickness on a rectangular insulated electric wire.
  • a varnish for a rectangular insulated electric wire comprising: a polyimide precursor that is a reaction product of an aromatic tetracarboxylic dianhydride and an aromatic diamine; and an organic solvent, wherein the organic solvent contains 50 mass % or more of an amide solvent having a boiling point of 150°C or more and 190°C or less; and the varnish has a viscosity at 30°C of 5 Pa s or more and 25 Pa s or less.
  • Item 2. The varnish for a rectangular insulated electric wire according to Item 1, wherein the boiling point of the amide-based solvent is 150° C. or higher and 170° C. or lower.
  • Section 7. The varnish for a rectangular insulated electric wire according to any one of items 1 to 6, having a viscosity at 30° C. of 10 Pa ⁇ s or more and 20 Pa ⁇ s or less.
  • Section 8. 8. The varnish for a rectangular insulated electric wire according to any one of items 1 to 7, which does not contain a filler.
  • a rectangular insulated electric wire comprising a rectangular conductor and an insulating coating covering the rectangular conductor, the insulating coating being formed from the varnish for rectangular insulated electric wire according to any one of items 1 to 9.
  • Item 11. A method for producing a rectangular insulated wire according to item 10, comprising the steps of: applying the varnish for a rectangular insulated wire according to any one of items 1 to 9 to the outer peripheral surface of the rectangular conductor; and heating the varnish for a rectangular insulated wire applied in the applying step.
  • the varnish for rectangular insulated electric wire contains a polyimide precursor, which is a reaction product of an aromatic tetracarboxylic dianhydride and an aromatic diamine, and an organic solvent, the organic solvent containing 50 mass % or more of an amide-based solvent having a boiling point of 150°C or more and 190°C or less, and having a viscosity at 30°C of 5 Pa s or more and 25 Pa s or less.
  • This varnish for rectangular insulated electric wires contains a specific amount of the specific amide solvent as an organic solvent and has a specific range of viscosity at 30°C, thereby achieving the effect of forming an insulating coating with a highly uniform thickness on rectangular insulated electric wires.
  • the upper limit of the variation rate may be 11.5%, 11.0%, 10.5%, 10.0%, or 9.5%.
  • the lower limit of the variation rate is not particularly limited and may be 0%, 0.5%, or 1.0%.
  • the viscosity of the varnish for rectangular insulated electric wires at 30°C is 5 Pa ⁇ s or more and 25 Pa ⁇ s or less.
  • the viscosity is a value measured using a B-type viscometer.
  • the lower limit of the viscosity is 5 Pa ⁇ s, and may be 7 Pa ⁇ s or 10 Pa ⁇ s.
  • the upper limit of the viscosity is 25 Pa ⁇ s, and may be 22 Pa ⁇ s or 20 Pa ⁇ s.
  • the viscosity of this rectangular insulated wire varnish at 30°C can be adjusted by changing the degree of polymerization (weight average molecular weight) of the polyimide precursor, which will be described later.
  • a common method for adjusting the viscosity of a varnish is to add a solid material such as a filler.
  • adjusting the viscosity by adding a filler or the like can result in a decrease in the elongation of the insulating coating. Therefore, if the rectangular insulated wire varnish does not contain a filler, it is possible to prevent a decrease in the elongation of the insulating coating.
  • This varnish for rectangular insulated electric wires can be suitably used as a varnish for forming an insulating coating on rectangular insulated electric wires.
  • Rectangular insulated wire refers to an insulated wire with a rectangular cross-sectional shape.
  • “Rectangle” generally refers to a quadrilateral with all corners being right angles, but in this specification, “rectangular” is a broader concept that includes any shape that is roughly recognizable as a rectangle.
  • a polyimide precursor is a reaction product obtained by a condensation polymerization reaction between an aromatic tetracarboxylic dianhydride and an aromatic diamine.
  • the polyimide precursor is a compound also known as a polyamic acid (polyamic acid).
  • the polyimide precursor undergoes a dehydration cyclization reaction (imidization reaction) to form a cyclic imide, resulting in a polyimide.
  • aromatic tetracarboxylic dianhydride contains pyromellitic dianhydride (PMDA), the heat resistance of the insulating coating can be improved. This is because PMDA has a rigid and linear molecular structure.
  • the aromatic tetracarboxylic dianhydride may also contain aromatic tetracarboxylic dianhydrides other than PMDA (hereinafter also referred to as "other aromatic tetracarboxylic dianhydrides").
  • Examples of the other aromatic tetracarboxylic dianhydrides include 3,3',4,4'-biphenyltetracarboxylic dianhydride (s-BPDA), 2,3,3',4'-biphenyltetracarboxylic dianhydride (a-BPDA), 2,2',3,3'-biphenyltetracarboxylic dianhydride (i-BPDA), 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 4,4'-oxydiphthalic dianhydride, 2,2',3,3'-benzophenonetetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride,
  • Examples of other aromatic tetracarboxylic acid dianhydrides include bis(2,3-dicarboxyphenyl)propane dian
  • BPDA biphenyltetracarboxylic dianhydride
  • the lower limit of the PMDA content relative to 100 mol% of the aromatic tetracarboxylic dianhydride may be 10 mol%, 20 mol%, or 30 mol%.
  • the upper limit of the PMDA content relative to 100 mol% of the aromatic tetracarboxylic dianhydride may be 100 mol%, 90 mol%, 80 mol%, or 70 mol%. Good film elongation can be achieved by using 10 mol% or more of PMDA.
  • the content of the other aromatic tetracarboxylic dianhydride relative to 100 mol% of the aromatic tetracarboxylic dianhydride can be determined appropriately within a range that does not impair the effects of the present disclosure.
  • the upper limit of the content may be 30 mol% or 20 mol%.
  • the lower limit of the content of the other aromatic tetracarboxylic dianhydride may be 0 mol% or 10 mol%.
  • the aromatic diamine containing diaminodiphenyl ether can improve the heat resistance of the insulating coating. This is because ODA has a rigid, linear molecular structure.
  • ODA include 4,4'-diaminodiphenyl ether (4,4'-ODA), 3,4'-diaminodiphenyl ether (3,4'-ODA), 3,3'-diaminodiphenyl ether (3,3'-ODA), 2,4'-diaminodiphenyl ether (2,4'-ODA), and 2,2'-diaminodiphenyl ether (2,2'-ODA).
  • 4,4'-diaminodiphenyl ether (4,4'-ODA) can favorably improve the elongation of the insulating coating.
  • the lower limit of the ODA content relative to 100 mol% of the aromatic diamine may be 50 mol%, 60 mol%, or 70 mol%.
  • the upper limit of the ODA content relative to 100 mol% of the aromatic diamine may be 100 mol% or 90 mol%.
  • the aromatic diamine may further contain an aromatic diamine other than ODA (hereinafter also referred to as "other aromatic diamine”).
  • the other aromatic diamine include 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP), 4,4'-bis(4-aminophenoxy)biphenyl (BAPB), 4,4'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 3,3'-diaminodiphenylmethane, 2,4'-diaminodiphenylmethane, 2,2'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 3,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, 2,4'-diaminodiphenylsulfone, 2,2'-diamino
  • aromatic diamines such as 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP) or 4,4'-bis(4-aminophenoxy)biphenyl (BAPB), can lower the dielectric constant of the insulating film.
  • the content of the other aromatic diamine relative to 100 mol% of the aromatic diamine can be determined appropriately within a range that does not impair the effects of the present disclosure.
  • the upper limit of the content may be 40 mol% or 30 mol%.
  • the lower limit of the content may be 0 mol% or 10 mol%.
  • the lower limit of the concentration of the polyimide precursor in the rectangular insulated wire varnish may be 10% by mass or 20% by mass.
  • the upper limit of the concentration of the polyimide precursor in the rectangular insulated wire varnish may be 50% by mass or 40% by mass.
  • the molar ratio of the aromatic tetracarboxylic dianhydride to the aromatic diamine (aromatic tetracarboxylic dianhydride:aromatic diamine) used as raw materials for the polyimide precursor may be, for example, 95:105 or more and 105:95 or less, 97:103 or more and 103:97 or less, or 99:101 or more and 101:99 or less.
  • the aromatic tetracarboxylic dianhydride and the aromatic diamine may be substantially equimolar amounts. In this case, it is easy to increase the molecular weight of the polyimide precursor.
  • Substantially equimolar amounts refers to a molar ratio of the aromatic tetracarboxylic dianhydride to the aromatic diamine (aromatic tetracarboxylic dianhydride:aromatic diamine) in the range of 99:101 or more and 101:99 or less.
  • the polyimide precursor can be obtained by a condensation polymerization reaction between the aromatic tetracarboxylic dianhydride and the aromatic diamine described above.
  • the condensation polymerization reaction can be carried out by a method similar to conventional methods for synthesizing polyimide precursors.
  • a specific example of the condensation polymerization reaction is a method in which the aromatic tetracarboxylic dianhydride and the aromatic diamine are mixed in an organic solvent. This method allows the aromatic tetracarboxylic dianhydride and the aromatic diamine to polymerize, thereby obtaining a solution in which the polyimide precursor is dissolved in the organic solvent.
  • the degree of polymerization can be controlled by carrying out the condensation polymerization reaction in the presence of a reaction inhibitor.
  • reaction inhibitors include water (H 2 O) and alcohols having 1 to 15 carbon atoms.
  • alcohols having 1 to 15 carbon atoms include monohydric alcohols such as ethanol, methanol, propanol, butanol, and pentanol; and polyhydric alcohols such as ethylene glycol, propylene glycol, and glycerin.
  • the reaction conditions for the condensation polymerization can be set appropriately depending on the raw materials used, etc.
  • the reaction temperature can be set to 10°C or higher and 100°C or lower
  • the reaction time can be set to 0.5 hours or higher and 24 hours or lower.
  • the organic solvent used in the condensation polymerization reaction may be similar to the organic solvents described below.
  • organic solvent contains 50% by mass or more of an amide-based solvent having a boiling point of 150° C. to 190° C.
  • the organic solvents may be used alone or in combination of two or more.
  • the lower limit of the boiling point of the amide solvent is 150°C, and may be 153°C.
  • the upper limit of the boiling point of the amide solvent is 190°C, and may be 180°C, or 170°C.
  • the boiling point of the amide solvent is 150°C or higher and 170°C or lower, the uniformity of the thickness of the insulating coating on the rectangular insulated electric wire can be further improved.
  • amide solvent examples include N,N-dimethylacetamide (DMAc, boiling point: 165°C), N,N-dimethylformamide (DMF, boiling point: 153°C), and N,N-diethylformamide (DEF, boiling point: 177°C).
  • DMAc N,N-dimethylacetamide
  • DMF N,N-dimethylformamide
  • DEF N,N-diethylformamide
  • the uniformity of the film thickness of the rectangular insulated electric wire can be further improved.
  • the content of the amide solvent in the organic solvent is 50% by mass or more.
  • the lower limit of the content of the amide solvent is 50% by mass, and may be 55% by mass, 60% by mass, 65% by mass, 70% by mass, 75% by mass, 80% by mass, or 85% by mass.
  • the upper limit of the content of the amide solvent is not particularly limited, and may be 100% by mass, 99% by mass, 98% by mass, 97% by mass, 96% by mass, or 95% by mass.
  • the organic solvent may contain a solvent other than the amide-based solvent.
  • the solvent other than the amide-based solvent is not particularly limited as long as it is a solvent that can be used in the synthesis of a polyimide precursor, and examples thereof include aprotic solvents.
  • An "aprotic solvent” refers to an organic solvent that does not have a group that releases a proton.
  • aprotic solvent examples include amide solvents such as N-methyl-2-pyrrolidone (NMP, boiling point: 202°C); sulfur-containing solvents such as dimethyl sulfoxide (boiling point: 189°C); and lactone solvents such as gamma-butyrolactone (boiling point: 204°C).
  • NMP N-methyl-2-pyrrolidone
  • sulfur-containing solvents such as dimethyl sulfoxide
  • lactone solvents such as gamma-butyrolactone (boiling point: 204°C).
  • the organic solvent contains 85% by mass or more and 95% by mass or less of N,N-dimethylacetamide and 5% by mass or more and 15% by mass or less of N-methyl-2-pyrrolidone, it is possible to further improve the uniformity of the thickness of the insulating coating on the rectangular insulated electric wire, and to form an insulating coating with strong interlayer adhesion.
  • the content of the organic solvent in the varnish for rectangular insulated electric wire is not particularly limited, as long as it is an amount that can uniformly dissolve and disperse the aromatic tetracarboxylic dianhydride and aromatic diamine.
  • the content of the organic solvent can be, for example, 100 parts by mass or more and 1,000 parts by mass or less per 100 parts by mass of the aromatic tetracarboxylic dianhydride and aromatic diamine combined.
  • the varnish for a rectangular insulated electric wire may contain a pore-forming agent.
  • an insulating coating having a plurality of pores can be formed.
  • the pore-forming agent can be any known additive used to form insulating coatings with pores, and is not particularly limited.
  • pore-forming agents include chemical foaming agents, thermally expandable microcapsules, particles containing thermally decomposable resins, and high-boiling-point solvents.
  • the pore-forming agent is thermally decomposable resin-containing particles
  • an insulating coating with a good appearance can be formed even when the porosity is high.
  • the thermally decomposable resin-containing particles are gasified by thermal decomposition, and pores are formed in the areas of the insulating coating where the thermally decomposable resin-containing particles were present.
  • the thermally decomposable resin-containing particles can be evenly distributed as islands of fine particles in the resin portion that makes up the insulating coating (the sea phase of the resin matrix), forming independent pores in the insulating coating.
  • the thermally decomposable resin contained in the thermally decomposable resin-containing particles may be a resin that thermally decomposes at a temperature lower than the baking temperature of the polyimide that makes up the insulating coating.
  • the baking temperature of the polyimide is set appropriately depending on the type of material that makes up the polyimide precursor, but is usually approximately 200°C or higher and 600°C or lower.
  • “Thermal decomposition temperature” refers to the temperature at which a mass loss rate of 50% occurs when the temperature is increased from room temperature at a rate of 10°C/min in an air atmosphere.
  • the thermal decomposition temperature can be measured by measuring the thermogravimetry using a thermogravimetry-differential thermal analyzer ("TG/DTA" from SII Nanotechnology, Inc.).
  • thermally decomposable resin contained in the thermally decomposable resin-containing particles include compounds such as polyethylene glycol and polypropylene glycol in which one, both, or a portion of the terminals are alkylated, (meth)acrylated, or epoxidized; polymers of (meth)acrylic acid esters having an alkyl group of 1 to 6 carbon atoms, such as polymethyl(meth)acrylate, polyethyl(meth)acrylate, polypropyl(meth)acrylate, and polybutyl(meth)acrylate; urethane oligomers, urethane polymers, polymers of modified (meth)acrylates such as urethane (meth)acrylate, epoxy (meth)acrylate, and ⁇ -caprolactone (meth)acrylate; poly(meth)acrylic acid; crosslinked products thereof; polystyrene; and crosslinked polystyrene.
  • (meth)acrylic acid esters having an alkyl group of 1 to 6 carbon atoms are prone to thermal decomposition at the baking temperature of the polyimide, easily forming voids in the insulating coating.
  • An example of the (meth)acrylic acid ester polymer is polymethyl methacrylate (PMMA).
  • PMMA polymethyl methacrylate
  • (meth)acrylic acid” is a general term for "acrylic acid” and “methacrylic acid,” and refers to either or both of them.
  • (meth)acrylate” is a general term for "acrylate” and “methacrylate,” and refers to either or both of them.
  • the thermally decomposable resin-containing particles may be particles consisting solely of the thermally decomposable resin, or may be particles with a core-shell structure having a core whose main component is the thermally decomposable resin and a shell whose main component is a resin whose thermal decomposition temperature is higher than that of the thermally decomposable resin.
  • a varnish containing particles with a core-shell structure is heated, only the core is thermally decomposed to form pores, with the shell remaining on the outer periphery of these pores.
  • Particles with a core-shell structure can reduce interconnected pores and reduce variation in pore size.
  • the main component of the shell is not particularly limited as long as it has a higher thermal decomposition temperature than the core, and may be a synthetic resin with a low dielectric constant and high heat resistance. Examples include polystyrene, silicone, fluororesin, and polyimide.
  • the main component of the shell is silicone, it is easy to increase elasticity, which results in good dispersion of pores in the insulating coating. This reduces interconnection of pores and reduces variation in pore size.
  • An insulating coating with this configuration has excellent conductivity and heat resistance.
  • the content of the pore-forming agent in the varnish for rectangular insulated electric wires can be determined appropriately depending on, for example, the type of pore-forming agent and the target porosity of the insulating coating.
  • the varnish for rectangular insulated electric wire may contain other components in addition to the above-mentioned components.
  • the other components are not particularly limited as long as they are blended into varnishes for forming insulating coatings on general insulated electric wires.
  • examples of the other components include antioxidants, leveling agents, curing agents, and adhesion promoters.
  • Curing agents include, for example, imidazole, titanium-based curing agents, isocyanate compounds, blocked isocyanates, urea or melamine compounds, amino resins, acetylene derivatives, and methyltetrahydrophthalic anhydride.
  • the varnish for rectangular insulated electric wire contains a curing agent, it can further improve the uniformity of the film thickness on the rectangular insulated electric wire.
  • the rectangular insulated wire includes a rectangular conductor and an insulating coating covering the rectangular conductor.
  • the rectangular insulated wire 1 shown in Fig. 1 includes a rectangular conductor 2 and an insulating coating 3 covering the rectangular conductor 2.
  • This rectangular insulated wire is rectangular (flat wire). Because it is a flat wire, it can be wound at high density during coil processing.
  • This rectangular insulated wire can be suitably used as coil winding wire (magnet wire).
  • the material of the rectangular conductor may be a metal with high conductivity and mechanical strength.
  • metals include copper, copper alloys, aluminum, nickel, silver, mild steel, steel, and stainless steel.
  • the rectangular conductor can be made of a wire-shaped material made from the above metal, or a multilayer structure in which a wire-shaped material is coated with another metal, such as nickel-coated copper, silver-coated copper, copper-coated aluminum, or copper-coated steel.
  • the lower limit of the average cross-sectional area of the rectangular conductor may be 0.01 mm2 or 0.1 mm2 .
  • the volume of the insulating coating relative to the rectangular conductor in the rectangular insulated electric wire can be made appropriate, thereby improving the volumetric efficiency of coils and the like formed using the rectangular insulated electric wire.
  • the upper limit of the average cross-sectional area of the rectangular conductor may be 20 mm2 or 10 mm2 . In this case, the need to form a thick insulating coating to sufficiently reduce the dielectric constant can be reduced, and unnecessary increases in the diameter of the rectangular insulated electric wire can be avoided.
  • the insulating film is laminated on the outer surface of the rectangular conductor so as to cover the conductor.
  • the insulating film is composed of one or more layers.
  • the insulating film is formed by the method described below (a method in which varnish is applied and baked multiple times)
  • the insulating film has a laminated structure composed of multiple layers formed using varnish.
  • the insulating coating contains a resin matrix.
  • the insulating coating is formed from the above-mentioned varnish for rectangular insulated electric wire. Therefore, the resin matrix is primarily composed of polyimide.
  • the average thickness of the insulating coating there are no particular restrictions on the average thickness of the insulating coating, and it can usually be between 2 ⁇ m and 200 ⁇ m.
  • the insulating coating may contain multiple voids. In this case, the dielectric constant of the insulating coating can be reduced. When the insulating coating contains multiple voids, the multiple voids are dispersed throughout the resin matrix in the insulating coating.
  • the porosity of the insulating coating may be 20% by volume or more and 60% by volume or less. A porosity of 20% by volume or more can further reduce the dielectric constant of the insulating coating.
  • the porosity of the insulating coating may be 40% by volume or more.
  • the upper limit of the porosity of the insulating coating may be 60% by volume or 50% by volume. "Porosity” refers to the percentage (unit: volume %) of the volume of pores relative to the volume of the resin matrix and the insulating coating containing pores.
  • the porosity is measured as follows: The porosity is calculated using the formula (W1 - W2) x 100/W1, where W1 is the mass when there are no pores, calculated by multiplying the apparent volume V1 calculated from the outer diameter of the insulating coating by the density ⁇ 1 of the insulating coating material, and W2 is the actual mass of the insulating coating.
  • the voids may be derived from thermally decomposable resin-containing particles.
  • the thermally decomposable resin-containing particles are gasified by thermal decomposition, and voids are formed in the insulating coating at the locations where the thermally decomposable resin-containing particles were present.
  • the thermally decomposable resin-containing particles can be uniformly distributed as islands of fine particles in the sea phase of the resin matrix that constitutes the insulating coating, and independent voids are formed in the insulating coating.
  • the average diameter is a value obtained by measuring the cross section of the rectangular insulated electric wire using a pore diameter distribution measuring device (for example, Porous Materials' "Automatic Pore Diameter Distribution Measuring System for Porous Materials").
  • the rectangular insulated wire may have a configuration other than that described above.
  • the rectangular insulated wire may have an adhesion layer containing an additive such as an adhesion improver between the rectangular conductor and the insulating coating.
  • adhesion improvers include mercaptans such as 2-mercaptoimidazole and 5-amino-1,3,4-thiadiazole-2-thiol.
  • the rectangular insulated electric wire may have a surface friction adjusting layer as its outermost layer.
  • surface friction adjusting layers include polyamide-imide, self-lubricating amide-imide, polyimide, and self-lubricating polyimide layers.
  • the "outermost layer” refers to the layer located outermost in the laminate structure that makes up the rectangular insulated electric wire, with the conductor side facing inward.
  • the rectangular insulated wire may have an outermost adhesive layer containing an additive such as a foaming agent.
  • foaming agents include azo-based foaming agents such as azodicarbonamide and azobisisobutyronitrile, nitroso-based foaming agents such as dinitrosopentamethylenetetramine and N,N'-dinitroso-N,N'-dimethylterephthalamide, hydrazide-based foaming agents such as p-toluenesulfonylhydrazide, p,p'-oxybisbenzenesulfonylhydrazide and benzenesulfonylhydrazide, and trihydrazinotriazine.
  • the rectangular insulated wire may have, as its outermost layer, a surge-resistant layer containing an inorganic filler.
  • inorganic fillers include silica, alumina, magnesia, beryllium oxide, silicon carbide, titanium carbide, boron carbide, tungsten carbide, boron nitride, and silicon nitride.
  • the inorganic filler may be surface-treated. Examples of surface treatment agents include silane coupling agents.
  • the method for manufacturing the rectangular insulated wire includes a step of applying the above-mentioned rectangular insulated wire varnish to the outer surface of the rectangular conductor (coating step), and a step of heating the rectangular insulated wire varnish applied in the coating step (heating step).
  • the rectangular insulated wire varnish described above is applied to the outer surface of the rectangular conductor.
  • One method for applying the rectangular insulated wire varnish to the outer surface of the rectangular conductor is to use a coating device equipped with a liquid composition tank that stores the rectangular insulated wire varnish and a coating die. With the coating device, the rectangular conductor passes through the liquid composition tank, causing the rectangular insulated wire varnish to adhere to the outer surface of the conductor. The rectangular conductor then passes through the coating die, coating the rectangular insulated wire varnish to a uniform thickness.
  • the varnish for rectangular insulated electric wires that was applied to the conductor in the application step is heated. This heating volatilizes the organic solvent in the varnish for rectangular insulated electric wires and hardens the polyimide precursor, forming polyimide.
  • the equipment used in the heating step is not particularly limited, and for example, a cylindrical baking furnace that is long in the direction in which the conductor travels can be used.
  • the heating method is not particularly limited, and can be any conventionally known method such as hot air heating, infrared heating, or high-frequency heating.
  • the heating temperature can be, for example, 300°C or higher and 800°C or lower.
  • the heating time can be, for example, 5 seconds or higher and 1 minute or lower.
  • the coating and heating processes are typically repeated multiple times. By repeating the process multiple times, the thickness of the insulating coating can be increased.
  • the hole diameter of the coating die can be adjusted appropriately depending on the number of repetitions.
  • Varnishes No. 2 to No. 20 were prepared in the same manner as No. 1, except that the types and amounts of each component shown in Table 1 below were used, and rectangular insulated wires No. 2 to No. 20 were produced.
  • Varnish No. 21 was prepared in the same manner as No. 1, except that the types and amounts of each component shown in Table 1 below were used and imidazole was added so as to give 1 mass %, and rectangular insulated wire No. 21 was produced.
  • the average thickness of the insulating coating was determined for the rectangular insulated wires No. 1 to No. 21 produced above.
  • the average thickness of the insulating coating was determined as follows: The thickness was measured at 16 points on each of 30 cross sections of the insulating coating. The 30 cross sections of the insulating coating were arranged at 50 cm intervals along the longitudinal axis of the rectangular insulated wire.
  • the average thickness of the insulating coating was determined by averaging the thicknesses at 480 points (16 points x 30 surfaces).
  • the deviation 4 ⁇ of the measured values ( ⁇ is the standard deviation) was also determined. Even if the average thicknesses were similar, a large deviation 4 ⁇ could be considered to indicate a large variation.
  • Variation rate (%) (4 ⁇ /average film thickness) ⁇ 100
  • the film thickness uniformity was evaluated as "good” when the variation rate was 12.0% or less, and as “poor” when the variation rate was more than 12.0%, because when the variation rate is more than 12.0%, a so-called dog-bone shaped insulating film is likely to be formed.
  • Table 1 shows that No. 2 to No. 21 have superior film thickness uniformity compared to No. 1.

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Abstract

This varnish for an insulated flat electric wire contains an organic solvent and a polyimide precursor which is a reaction product between an aromatic tetracarboxylic acid dianhydride and an aromatic diamine. The organic solvent contains at least 50 mass% of an amide-based solvent having a boiling point of 150-190°C, and has a viscosity of 5-25 Pa·s at 30°C.

Description

平角絶縁電線用ワニス、平角絶縁電線および平角絶縁電線の製造方法Varnish for rectangular insulated electric wire, rectangular insulated electric wire, and method for manufacturing rectangular insulated electric wire

 本開示は、平角絶縁電線用ワニス、平角絶縁電線および平角絶縁電線の製造方法に関する。本出願は、2024年1月22日出願の日本出願第2024-007622号に基づく優先権を主張し、前記日本出願に記載された全ての記載内容を援用するものである。 This disclosure relates to a varnish for rectangular insulated wire, rectangular insulated wire, and a method for manufacturing rectangular insulated wire. This application claims priority to Japanese Application No. 2024-007622, filed January 22, 2024, and incorporates by reference all of the contents of that Japanese application.

 特許文献1には、導体表面に塗布した後、ダイスの通過により、塗布された余分な絶縁ワニスが除去され、次いで、乾燥、焼き付けすることにより、導体表面に絶縁被膜を形成する絶縁ワニスであって、30℃における粘度が10Pa・s以上である絶縁ワニスが記載されている。 Patent Document 1 describes an insulating varnish that is applied to the surface of a conductor, then passes through a die to remove excess applied insulating varnish, and is then dried and baked to form an insulating coating on the surface of the conductor, and has a viscosity of 10 Pa·s or more at 30°C.

国際公開第2013/073397号International Publication No. 2013/073397

 本開示の一態様に係る平角絶縁電線用ワニスは、芳香族テトラカルボン酸二無水物と芳香族ジアミンとの反応生成物であるポリイミド前駆体と、有機溶媒とを含有し、前記有機溶媒が沸点150℃以上190℃以下のアミド系溶媒を50質量%以上含み、30℃における粘度が5Pa・s以上25Pa・s以下である。 A varnish for rectangular insulated electric wire according to one embodiment of the present disclosure contains a polyimide precursor, which is a reaction product of an aromatic tetracarboxylic dianhydride and an aromatic diamine, and an organic solvent, wherein the organic solvent contains 50% by mass or more of an amide-based solvent having a boiling point of 150°C or higher and 190°C or lower, and has a viscosity at 30°C of 5 Pa·s or higher and 25 Pa·s or lower.

図1は、本開示の一態様に係る平角絶縁電線の断面図である。FIG. 1 is a cross-sectional view of a rectangular insulated electric wire according to one embodiment of the present disclosure.

[本開示が解決しようとする課題]
 本開示が解決しようとする課題は、平角絶縁電線において膜厚の均一性の高い絶縁皮膜を形成することができる平角絶縁電線用ワニスを提供することである。
[Problem to be solved by the present disclosure]
The problem to be solved by the present disclosure is to provide a varnish for rectangular insulated electric wires that can form an insulating coating with a highly uniform thickness on rectangular insulated electric wires.

[本開示の効果]
 本開示の一態様に係る平角絶縁電線用ワニスは、平角絶縁電線において膜厚の均一性の高い絶縁皮膜を形成することができる。 
[Effects of the present disclosure]
The varnish for a rectangular insulated electric wire according to one embodiment of the present disclosure can form an insulating coating with a highly uniform thickness on a rectangular insulated electric wire.

[本開示の実施形態の説明]
 最初に本開示の実施態様を列記して説明する。
項1.
 芳香族テトラカルボン酸二無水物と芳香族ジアミンとの反応生成物であるポリイミド前駆体と、有機溶媒とを含有し、前記有機溶媒が沸点150℃以上190℃以下のアミド系溶媒を50質量%以上含み、30℃における粘度が5Pa・s以上25Pa・s以下である平角絶縁電線用ワニス。
項2.
 前記アミド系溶媒の沸点が150℃以上170℃以下である前記項1に記載の平角絶縁電線用ワニス。
項3.
 前記アミド系溶媒がN,N-ジメチルアセトアミド、N,N-ジメチルホルムアミドまたはこれらの組み合わせである前記項1または前記項2に記載の平角絶縁電線用ワニス。
項4.
 前記有機溶媒における前記アミド系溶媒の含有量が70質量%以上である前記項1から前記項3のいずれか1項に記載の平角絶縁電線用ワニス。
項5.
 前記有機溶媒における前記アミド系溶媒の含有量が95質量%以下である前記項1から前記項4のいずれか1項に記載の平角絶縁電線用ワニス。
項6.
 前記有機溶媒がN,N-ジメチルアセトアミドを85質量%以上95質量%以下含み、かつN-メチル-2-ピロリドンを5質量%以上15質量%以下含む前記項1から前記項5のいずれか1項に記載の平角絶縁電線用ワニス。
項7.
 30℃における粘度が10Pa・s以上20Pa・s以下である前記項1から前記項6のいずれか1項に記載の平角絶縁電線用ワニス。
項8.
 フィラーを含有しない前記項1から前記項7のいずれか1項に記載の平角絶縁電線用ワニス。
項9.
 前記項1から前記項8のいずれか1項に記載の平角絶縁電線用ワニスを用いて平角導体上に絶縁皮膜を形成した際に、前記絶縁皮膜の長手方向50cm間隔で30個の断面について、各断面での16点の膜厚の平均(16点×30面=480点の平均膜厚)に対して、下記式で表されるバラツキ割合が12.0%以下である前記項1から前記項8のいずれか1項に記載の平角絶縁電線用ワニス。
  バラツキ割合(%)=(4σ/平均膜厚)×100
  (式中、σは、標準偏差を示す。)
項10.
 平角導体と、前記平角導体を被覆する絶縁皮膜とを備え、前記絶縁皮膜が前記項1から前記項9のいずれか1項に記載の平角絶縁電線用ワニスにより形成されている平角絶縁電線。
項11.
 前記項10に記載の平角絶縁電線の製造方法であって、前記平角導体の外周面に前記項1から前記項9のいずれか1項に記載の平角絶縁電線用ワニスを塗工する工程と、前記塗工する工程で塗工された前記平角絶縁電線用ワニスを加熱する工程とを備える平角絶縁電線の製造方法。
Description of the embodiments of the present disclosure
First, embodiments of the present disclosure will be listed and described.
Item 1.
A varnish for a rectangular insulated electric wire comprising: a polyimide precursor that is a reaction product of an aromatic tetracarboxylic dianhydride and an aromatic diamine; and an organic solvent, wherein the organic solvent contains 50 mass % or more of an amide solvent having a boiling point of 150°C or more and 190°C or less; and the varnish has a viscosity at 30°C of 5 Pa s or more and 25 Pa s or less.
Item 2.
2. The varnish for a rectangular insulated electric wire according to Item 1, wherein the boiling point of the amide-based solvent is 150° C. or higher and 170° C. or lower.
Item 3.
3. The varnish for a rectangular insulated electric wire according to Item 1 or 2, wherein the amide solvent is N,N-dimethylacetamide, N,N-dimethylformamide, or a combination thereof.
Item 4.
4. The varnish for a rectangular insulated electric wire according to any one of items 1 to 3, wherein the content of the amide solvent in the organic solvent is 70 mass % or more.
Item 5.
5. The varnish for a rectangular insulated electric wire according to any one of items 1 to 4, wherein the content of the amide solvent in the organic solvent is 95% by mass or less.
Item 6.
Item 6. The varnish for a rectangular insulated electric wire according to any one of items 1 to 5, wherein the organic solvent contains 85% by mass or more and 95% by mass or less of N,N-dimethylacetamide and 5% by mass or more and 15% by mass or less of N-methyl-2-pyrrolidone.
Section 7.
7. The varnish for a rectangular insulated electric wire according to any one of items 1 to 6, having a viscosity at 30° C. of 10 Pa·s or more and 20 Pa·s or less.
Section 8.
8. The varnish for a rectangular insulated electric wire according to any one of items 1 to 7, which does not contain a filler.
Item 9.
Item 10. The varnish for a rectangular insulated electric wire according to any one of items 1 to 8, wherein when an insulating coating is formed on a rectangular conductor using the varnish for a rectangular insulated electric wire according to any one of items 1 to 8, the variation rate, expressed by the following formula, is 12.0% or less with respect to the average film thickness at 16 points on 30 cross sections at 50 cm intervals in the longitudinal direction of the insulating coating (average film thickness at 16 points x 30 surfaces = 480 points):
Variation rate (%) = (4σ/average film thickness) × 100
(wherein σ represents the standard deviation.)
Item 10.
Item 10. A rectangular insulated electric wire comprising a rectangular conductor and an insulating coating covering the rectangular conductor, the insulating coating being formed from the varnish for rectangular insulated electric wire according to any one of items 1 to 9.
Item 11.
Item 11. A method for producing a rectangular insulated wire according to item 10, comprising the steps of: applying the varnish for a rectangular insulated wire according to any one of items 1 to 9 to the outer peripheral surface of the rectangular conductor; and heating the varnish for a rectangular insulated wire applied in the applying step.

[本開示の実施形態の詳細]
 以下、本開示の一態様に係る平角絶縁電線用ワニス、平角絶縁電線および平角絶縁電線の製造方法について説明する。
[Details of the embodiment of the present disclosure]
Hereinafter, a varnish for a rectangular insulated electric wire, a rectangular insulated electric wire, and a method for producing a rectangular insulated electric wire according to one embodiment of the present disclosure will be described.

<平角絶縁電線用ワニス>
 当該平角絶縁電線用ワニスは、芳香族テトラカルボン酸二無水物と芳香族ジアミンとの反応生成物であるポリイミド前駆体と、有機溶媒とを含有し、前記有機溶媒が沸点150℃以上190℃以下のアミド系溶媒を50質量%以上含み、30℃における粘度が5Pa・s以上25Pa・s以下である。
<Varnish for rectangular insulated wire>
The varnish for rectangular insulated electric wire contains a polyimide precursor, which is a reaction product of an aromatic tetracarboxylic dianhydride and an aromatic diamine, and an organic solvent, the organic solvent containing 50 mass % or more of an amide-based solvent having a boiling point of 150°C or more and 190°C or less, and having a viscosity at 30°C of 5 Pa s or more and 25 Pa s or less.

 当該平角絶縁電線用ワニスは、有機溶媒として前記特定のアミド系溶媒を特定量含み、かつ30℃における粘度が特定の範囲であることにより、平角絶縁電線において膜厚の均一性の高い絶縁皮膜を形成することができるという効果を発揮する。 This varnish for rectangular insulated electric wires contains a specific amount of the specific amide solvent as an organic solvent and has a specific range of viscosity at 30°C, thereby achieving the effect of forming an insulating coating with a highly uniform thickness on rectangular insulated electric wires.

 限定的な解釈を望むものではないが、低粘度(30℃における粘度が25Pa・s以下)であるワニスは、導体表面に塗布し、ダイスに通過させた後、乾燥するまでに表面張力の影響を受けてダイスを通過させたときの形状を維持することができず形状が変化してしまうおそれがある。そこで、有機溶媒として前記特定のアミド系溶媒を特定量含むことによりダイスを通過させたときの形状を維持することができる。その結果、平角絶縁電線において膜厚の均一性の高い絶縁皮膜を形成することができると考えられる。 While not wishing to be limiting, when a varnish with a low viscosity (viscosity of 25 Pa·s or less at 30°C) is applied to the surface of a conductor and passed through a die, it is subject to the influence of surface tension before drying, and is unable to maintain the shape it had when passed through the die, which could result in the shape changing. Therefore, by including a specific amount of the above-mentioned specific amide-based solvent as the organic solvent, it is possible to maintain the shape it had when passed through the die. As a result, it is believed that an insulating coating with a highly uniform thickness can be formed on rectangular insulated electric wires.

 本明細書において「平角絶縁電線において膜厚の均一性の高い絶縁皮膜を形成することができる」とは、当該平角絶縁電線用ワニスを用いて平角導体上に絶縁皮膜を形成した際に、前記絶縁皮膜の長手方向50cm間隔で30個の断面について、各断面での16点の膜厚の平均(16点×30面=480点の平均膜厚)に対して、下記式で表されるバラツキ割合が12.0%以下であることを意味する。
  バラツキ割合(%)=(4σ/平均膜厚)×100
  (式中、σは、標準偏差を示す。)
In this specification, "an insulating coating with a high uniformity in thickness can be formed on a rectangular insulated wire" means that when the insulating coating is formed on a rectangular conductor using the varnish for rectangular insulated wire, the variation rate, expressed by the following formula, is 12.0% or less relative to the average thickness of 16 points on 30 cross sections spaced 50 cm apart in the longitudinal direction of the insulating coating (average thickness at 16 points x 30 surfaces = 480 points).
Variation rate (%) = (4σ/average film thickness) × 100
(wherein σ represents the standard deviation.)

 前記バラツキ割合の上限は、11.5%であってもよく、11.0%であってもよく、10.5%であってもよく、10.0%であってもよく、9.5%であってもよい。前記バラツキ割合の下限は特に制限されず、0%であってもよく、0.5%であってもよく、1.0%であってもよい。 The upper limit of the variation rate may be 11.5%, 11.0%, 10.5%, 10.0%, or 9.5%. The lower limit of the variation rate is not particularly limited and may be 0%, 0.5%, or 1.0%.

 当該平角絶縁電線用ワニスの30℃における粘度は、5Pa・s以上25Pa・s以下である。前記粘度はB型粘度計で測定した値である。前記粘度の下限は、5Pa・sであり、7Pa・sであってもよく、10Pa・sであってもよい。前記粘度の上限は、25Pa・sであり、22Pa・sであってもよく、20Pa・sであってもよい。前記平角絶縁電線用ワニスの30℃における粘度が10Pa・s以上20Pa・s以下であると、平角絶縁電線における膜厚の均一性をより高めることができる。 The viscosity of the varnish for rectangular insulated electric wires at 30°C is 5 Pa·s or more and 25 Pa·s or less. The viscosity is a value measured using a B-type viscometer. The lower limit of the viscosity is 5 Pa·s, and may be 7 Pa·s or 10 Pa·s. The upper limit of the viscosity is 25 Pa·s, and may be 22 Pa·s or 20 Pa·s. When the viscosity of the varnish for rectangular insulated electric wires at 30°C is 10 Pa·s or more and 20 Pa·s or less, the uniformity of the film thickness of the rectangular insulated electric wire can be further improved.

 当該平角絶縁電線用ワニスの30℃における粘度は、後述するポリイミド前駆体の重合度(重量平均分子量)を変えることで調整することができる。一般的には、ワニスの粘度の調整方法として、フィラー等の固形物を添加する方法も挙げられる。しかし、フィラー等の添加による粘度の調整を行うと、絶縁皮膜の伸びが低下するおそれがある。よって、当該平角絶縁電線用ワニスはフィラーを含有しない態様であると、絶縁皮膜の皮膜伸びを低下しにくくすることができる。 The viscosity of this rectangular insulated wire varnish at 30°C can be adjusted by changing the degree of polymerization (weight average molecular weight) of the polyimide precursor, which will be described later. A common method for adjusting the viscosity of a varnish is to add a solid material such as a filler. However, adjusting the viscosity by adding a filler or the like can result in a decrease in the elongation of the insulating coating. Therefore, if the rectangular insulated wire varnish does not contain a filler, it is possible to prevent a decrease in the elongation of the insulating coating.

 当該平角絶縁電線用ワニスは、平角絶縁電線の絶縁皮膜を形成するためのワニスとして好適に用いることができる。 This varnish for rectangular insulated electric wires can be suitably used as a varnish for forming an insulating coating on rectangular insulated electric wires.

 「平角絶縁電線」とは、断面形状が長方形状である絶縁電線をいう。「長方形」とは、一般的には、すべての角が直角の四辺形をいうが、本明細書においては、「長方形状」とは、おおよそ長方形と認識出る形状を含む広い概念である。 "Rectangular insulated wire" refers to an insulated wire with a rectangular cross-sectional shape. "Rectangle" generally refers to a quadrilateral with all corners being right angles, but in this specification, "rectangular" is a broader concept that includes any shape that is roughly recognizable as a rectangle.

 以下、当該平角絶縁電線用ワニスが含有する各成分について説明する。 The following explains each component contained in this varnish for rectangular insulated electric wire.

(ポリイミド前駆体)
 ポリイミド前駆体は、芳香族テトラカルボン酸二無水物と芳香族ジアミンとの縮合重合反応によって得られる反応生成物である。ポリイミド前駆体は、ポリアミック酸(ポリアミド酸)とも称される化合物である。ポリイミド前駆体は、脱水環化反応(イミド化反応)により環状イミドを形成し、ポリイミドとなる。
(Polyimide precursor)
A polyimide precursor is a reaction product obtained by a condensation polymerization reaction between an aromatic tetracarboxylic dianhydride and an aromatic diamine. The polyimide precursor is a compound also known as a polyamic acid (polyamic acid). The polyimide precursor undergoes a dehydration cyclization reaction (imidization reaction) to form a cyclic imide, resulting in a polyimide.

 前記芳香族テトラカルボン酸二無水物はピロメリット酸二無水物(PMDA)を含むと絶縁皮膜の耐熱性を向上できる。PMDAは、剛直かつ直線的な分子構造を有するためである。前記芳香族テトラカルボン酸二無水物はPMDA以外の芳香族テトラカルボン酸二無水物(以下、「他の芳香族テトラカルボン酸二無水物」ともいう)を含んでいてもよい。 If the aromatic tetracarboxylic dianhydride contains pyromellitic dianhydride (PMDA), the heat resistance of the insulating coating can be improved. This is because PMDA has a rigid and linear molecular structure. The aromatic tetracarboxylic dianhydride may also contain aromatic tetracarboxylic dianhydrides other than PMDA (hereinafter also referred to as "other aromatic tetracarboxylic dianhydrides").

 前記他の芳香族テトラカルボン酸二無水物としては、例えば3,3’,4,4’-ビフェニルテトラカルボン酸二無水物(s-BPDA)、2,3,3’,4’-ビフェニルテトラカルボン酸二無水物(a-BPDA)、2,2’,3,3’-ビフェニルテトラカルボン酸二無水物(i-BPDA)、3,3’,4,4’-ベンゾフェノンテトラカルボン酸二無水物、4,4’-オキシジフタル酸二無水物、2,2’,3,3’-ベンゾフェノンテトラカルボン酸二無水物、2,2-ビス(3,4-ジカルボキシフェニル)プロパン二無水物、2,2-ビス(2,3-ジカルボキシフェニル)プロパン二無水物、1,1-ビス(3,4-ジカルボキシフェニル)エタン二無水物、1,1-ビス(2,3-ジカルボキシフェニル)エタン二無水物、ビス(3,4-ジカルボキシフェニル)メタン二無水物、ビス(2,3-ジカルボキシフェニル)メタン二無水物、ビス(3,4-ジカルボキシフェニル)スルホン二無水物、ビス(3,4-ジカルボキシフェニル)エーテル二無水物、1,2,5,6-ナフタレンテトラカルボン酸二無水物、2,3,6,7-ナフタレンテトラカルボン酸二無水物が挙げられる。前記他の芳香族テトラカルボン酸二無水物は、1種単独で用いてもよいし、2種以上を併用してもよい。 Examples of the other aromatic tetracarboxylic dianhydrides include 3,3',4,4'-biphenyltetracarboxylic dianhydride (s-BPDA), 2,3,3',4'-biphenyltetracarboxylic dianhydride (a-BPDA), 2,2',3,3'-biphenyltetracarboxylic dianhydride (i-BPDA), 3,3',4,4'-benzophenonetetracarboxylic dianhydride, 4,4'-oxydiphthalic dianhydride, 2,2',3,3'-benzophenonetetracarboxylic dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, 2,2-bis(3,4-dicarboxyphenyl)propane dianhydride, Examples of other aromatic tetracarboxylic acid dianhydrides include bis(2,3-dicarboxyphenyl)propane dianhydride, 1,1-bis(3,4-dicarboxyphenyl)ethane dianhydride, 1,1-bis(2,3-dicarboxyphenyl)ethane dianhydride, bis(3,4-dicarboxyphenyl)methane dianhydride, bis(2,3-dicarboxyphenyl)methane dianhydride, bis(3,4-dicarboxyphenyl)sulfone dianhydride, bis(3,4-dicarboxyphenyl)ether dianhydride, 1,2,5,6-naphthalenetetracarboxylic acid dianhydride, and 2,3,6,7-naphthalenetetracarboxylic acid dianhydride. These other aromatic tetracarboxylic acid dianhydrides may be used alone or in combination of two or more.

 他の芳香族テトラカルボン酸二無水物としてビフェニルテトラカルボン酸二無水物(BPDA)を用いると、ポリイミド前駆体の耐加水分解性を好適に向上させることができる。 Using biphenyltetracarboxylic dianhydride (BPDA) as another aromatic tetracarboxylic dianhydride can favorably improve the hydrolysis resistance of the polyimide precursor.

 前記芳香族テトラカルボン酸二無水物100モル%に対するPMDAの含有量の下限は、10モル%であってもよく、20モル%であってもよく、30モル%であってもよい。前記芳香族テトラカルボン酸二無水物100モル%に対するPMDAの含有量の上限は、100モル%であってもよく、90モル%であってもよく、80モル%であってもよく、70モル%であってもよい。PMDAを10モル%以上使用することで良好な皮膜伸びが得られる。 The lower limit of the PMDA content relative to 100 mol% of the aromatic tetracarboxylic dianhydride may be 10 mol%, 20 mol%, or 30 mol%. The upper limit of the PMDA content relative to 100 mol% of the aromatic tetracarboxylic dianhydride may be 100 mol%, 90 mol%, 80 mol%, or 70 mol%. Good film elongation can be achieved by using 10 mol% or more of PMDA.

 前記芳香族テトラカルボン酸二無水物100モル%に対する前記他の芳香族テトラカルボン酸二無水物の含有量は、本開示の効果を損なわない範囲において適宜決定することができる。前含有量の上限は、30モル%であってもよく、20モル%であってもよい。前記他の芳香族テトラカルボン酸二無水物の含有量の下限は、0モル%であってもよく、10モル%であってもよい。 The content of the other aromatic tetracarboxylic dianhydride relative to 100 mol% of the aromatic tetracarboxylic dianhydride can be determined appropriately within a range that does not impair the effects of the present disclosure. The upper limit of the content may be 30 mol% or 20 mol%. The lower limit of the content of the other aromatic tetracarboxylic dianhydride may be 0 mol% or 10 mol%.

 前記芳香族ジアミンはジアミノジフェニルエーテル(ODA)を含むと絶縁皮膜の耐熱性を向上できる。ODAは、剛直かつ直線的な分子構造を有するためである。ODAとしては、4,4’-ジアミノジフェニルエーテル(4,4’-ODA)、3,4’-ジアミノジフェニルエーテル(3,4’-ODA)、3,3’-ジアミノジフェニルエーテル(3,3’-ODA)、2,4’-ジアミノジフェニルエーテル(2,4’-ODA)、および2,2’-ジアミノジフェニルエーテル(2,2’-ODA)が挙げられる。この中で、4,4’-ジアミノジフェニルエーテル(4,4’-ODA)を用いると、絶縁皮膜の皮膜伸びを好適に向上させることができる。 The aromatic diamine containing diaminodiphenyl ether (ODA) can improve the heat resistance of the insulating coating. This is because ODA has a rigid, linear molecular structure. Examples of ODA include 4,4'-diaminodiphenyl ether (4,4'-ODA), 3,4'-diaminodiphenyl ether (3,4'-ODA), 3,3'-diaminodiphenyl ether (3,3'-ODA), 2,4'-diaminodiphenyl ether (2,4'-ODA), and 2,2'-diaminodiphenyl ether (2,2'-ODA). Of these, using 4,4'-diaminodiphenyl ether (4,4'-ODA) can favorably improve the elongation of the insulating coating.

 前記芳香族ジアミン100モル%に対するODAの含有量の下限は、50モル%であってもよく、60モル%であってもよく、70モル%であってもよい。前記芳香族ジアミン100モル%に対するODAの含有量の上限は、100モル%であってもよく、90モル%であってもよい。 The lower limit of the ODA content relative to 100 mol% of the aromatic diamine may be 50 mol%, 60 mol%, or 70 mol%. The upper limit of the ODA content relative to 100 mol% of the aromatic diamine may be 100 mol% or 90 mol%.

 前記芳香族ジアミンはODA以外の芳香族ジアミン(以下、「他の芳香族ジアミン」ともいう)をさらに含んでいてもよい。前記他の芳香族ジアミンとしては、例えば2,2-ビス[4-(4-アミノフェノキシ)フェニル]プロパン(BAPP)、4,4’-ビス(4-アミノフェノキシ)ビフェニル(BAPB)、4,4’-ジアミノジフェニルメタン、3,4’-ジアミノジフェニルメタン、3,3’-ジアミノジフェニルメタン、2,4’-ジアミノジフェニルメタン、2,2’-ジアミノジフェニルメタン、4,4’-ジアミノジフェニルスルホン、3,4’-ジアミノジフェニルスルホン、3,3’-ジアミノジフェニルスルホン、2,4’-ジアミノジフェニルスルホン、2,2’-ジアミノジフェニルスルホン、4,4’-ジアミノジフェニルスルフィド、3,4’-ジアミノジフェニルスルフィド、3,3’-ジアミノジフェニルスルフィド、2,4’-ジアミノジフェニルスルフィド、2,2’-ジアミノジフェニルスルフィド、パラフェニレンジアミン、メタフェニレンジアミン、p-キシリレンジアミン、m-キシリレンジアミン、2,2’-ジメチル-4,4’-ジアミノビフェニル(mTBHG)、1,5-ジアミノナフタレン、4,4’-ベンゾフェノンジアミン、3,3’-ジメチル-4,4’-ジアミノジフェニルメタン、3,3’,5,5’-テトラメチル-4,4’-ジアミノジフェニルメタンが挙げられる。前記他の芳香族ジアミンは、1種単独で用いてもよいし、2種以上を併用してもよい。 The aromatic diamine may further contain an aromatic diamine other than ODA (hereinafter also referred to as "other aromatic diamine"). Examples of the other aromatic diamine include 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP), 4,4'-bis(4-aminophenoxy)biphenyl (BAPB), 4,4'-diaminodiphenylmethane, 3,4'-diaminodiphenylmethane, 3,3'-diaminodiphenylmethane, 2,4'-diaminodiphenylmethane, 2,2'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 3,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, 2,4'-diaminodiphenylsulfone, 2,2'-diaminodiphenylsulfone, 4,4' Examples of other aromatic diamines include 4,4'-diaminodiphenyl sulfide, 3,4'-diaminodiphenyl sulfide, 3,3'-diaminodiphenyl sulfide, 2,4'-diaminodiphenyl sulfide, 2,2'-diaminodiphenyl sulfide, paraphenylenediamine, metaphenylenediamine, p-xylylenediamine, m-xylylenediamine, 2,2'-dimethyl-4,4'-diaminobiphenyl (mTBHG), 1,5-diaminonaphthalene, 4,4'-benzophenonediamine, 3,3'-dimethyl-4,4'-diaminodiphenylmethane, and 3,3',5,5'-tetramethyl-4,4'-diaminodiphenylmethane. These other aromatic diamines may be used alone or in combination of two or more.

 他の芳香族ジアミンとして2,2-ビス[4-(4-アミノフェノキシ)フェニル]プロパン(BAPP)または4,4’-ビス(4-アミノフェノキシ)ビフェニル(BAPB)を用いると、絶縁皮膜の比誘電率を低くすることができる。 Other aromatic diamines, such as 2,2-bis[4-(4-aminophenoxy)phenyl]propane (BAPP) or 4,4'-bis(4-aminophenoxy)biphenyl (BAPB), can lower the dielectric constant of the insulating film.

 前記芳香族ジアミン100モル%に対する前記他の芳香族ジアミンの含有量は、本開示の効果を損なわない範囲において適宜決定することができる。前記含有量の上限は、40モル%であってもよく、30モル%であってもよい。前記含有量の下限は、0モル%であってもよく、10モル%であってもよい。 The content of the other aromatic diamine relative to 100 mol% of the aromatic diamine can be determined appropriately within a range that does not impair the effects of the present disclosure. The upper limit of the content may be 40 mol% or 30 mol%. The lower limit of the content may be 0 mol% or 10 mol%.

 前記ポリイミド前駆体の当該平角絶縁電線用ワニス中の濃度の下限は、10質量%であってもよく、20質量%であってもよい。前記ポリイミド前駆体の当該平角絶縁電線用ワニス中の濃度の上限は、50質量%であってもよく、40質量%であってもよい。前記ポリイミド前駆体の当該平角絶縁電線用ワニス中の濃度を前記下限以上とすることで、当該平角絶縁電線用ワニスを用いて絶縁皮膜を形成する際に所望の厚さの絶縁皮膜を得るために製造工程全体で必要となるワニス量を低下させることができ、塗工工程および加熱工程の回数を低減させることができる。前記濃度を前記上限以下とすることで、良好な皮膜特性を維持しつつ当該平角絶縁電線用ワニスの粘度を適度に調整することができ、塗工性を向上させることができる。 The lower limit of the concentration of the polyimide precursor in the rectangular insulated wire varnish may be 10% by mass or 20% by mass. The upper limit of the concentration of the polyimide precursor in the rectangular insulated wire varnish may be 50% by mass or 40% by mass. By setting the concentration of the polyimide precursor in the rectangular insulated wire varnish at or above the lower limit, the amount of varnish required throughout the entire manufacturing process to obtain an insulating coating of the desired thickness when forming an insulating coating using the rectangular insulated wire varnish can be reduced, and the number of coating and heating steps can be reduced. By setting the concentration at or below the upper limit, the viscosity of the rectangular insulated wire varnish can be appropriately adjusted while maintaining good coating properties, thereby improving coatability.

 前記ポリイミド前駆体の原料として用いる芳香族テトラカルボン酸二無水物と芳香族ジアミンとのモル比(芳香族テトラカルボン酸二無水物:芳香族ジアミン)は、ポリイミド前駆体の合成容易性の観点から、例えば95:105以上105:95以下であってもよく、97:103以上103:97以下であってもよく、99:101以上101:99以下であってもよい。芳香族テトラカルボン酸二無水物と芳香族ジアミンとは実質的に当モル量であってもよい。この場合、ポリイミド前駆体の分子量を大きくすることが容易である。「実質的に当モル量」とは、芳香族テトラカルボン酸二無水物と芳香族ジアミンとのモル比(芳香族テトラカルボン酸二無水物:芳香族ジアミン)が99:101以上101:99以下の範囲をいう。 From the perspective of ease of synthesis of the polyimide precursor, the molar ratio of the aromatic tetracarboxylic dianhydride to the aromatic diamine (aromatic tetracarboxylic dianhydride:aromatic diamine) used as raw materials for the polyimide precursor may be, for example, 95:105 or more and 105:95 or less, 97:103 or more and 103:97 or less, or 99:101 or more and 101:99 or less. The aromatic tetracarboxylic dianhydride and the aromatic diamine may be substantially equimolar amounts. In this case, it is easy to increase the molecular weight of the polyimide precursor. "Substantially equimolar amounts" refers to a molar ratio of the aromatic tetracarboxylic dianhydride to the aromatic diamine (aromatic tetracarboxylic dianhydride:aromatic diamine) in the range of 99:101 or more and 101:99 or less.

(ポリイミド前駆体の合成方法)
 前記ポリイミド前駆体は、上述した芳香族テトラカルボン酸二無水物と芳香族ジアミンとの縮合重合反応により得ることができる。前記縮合重合反応の方法としては、従来のポリイミド前駆体の合成方法と近しい方法が挙げられる。前記縮合重合反応の具体的な方法としては、例えば芳香族テトラカルボン酸二無水物と芳香族ジアミンとを有機溶媒中で混合する方法が挙げられる。この方法により、芳香族テトラカルボン酸二無水物と芳香族ジアミンとが重合し、ポリイミド前駆体が有機溶媒に溶解した溶液を得ることができる。例えば、前記縮合重合反応を反応制御剤の存在下で行うことにより、重合度(重量平均分子量)を制御することができる。
(Method for synthesizing polyimide precursor)
The polyimide precursor can be obtained by a condensation polymerization reaction between the aromatic tetracarboxylic dianhydride and the aromatic diamine described above. The condensation polymerization reaction can be carried out by a method similar to conventional methods for synthesizing polyimide precursors. A specific example of the condensation polymerization reaction is a method in which the aromatic tetracarboxylic dianhydride and the aromatic diamine are mixed in an organic solvent. This method allows the aromatic tetracarboxylic dianhydride and the aromatic diamine to polymerize, thereby obtaining a solution in which the polyimide precursor is dissolved in the organic solvent. For example, the degree of polymerization (weight-average molecular weight) can be controlled by carrying out the condensation polymerization reaction in the presence of a reaction inhibitor.

 反応制御剤としては、例えば水(HO)、炭素数1~15のアルコールが挙げられる。炭素数1~15のアルコールとしては、例えばエタノール、メタノール、プロパノール、ブタノール、ペンタノールなどの1価アルコール;エチレングリコール、プロピレングリコール、グリセリンなどの多価アルコールが挙げられる。 Examples of reaction inhibitors include water (H 2 O) and alcohols having 1 to 15 carbon atoms. Examples of alcohols having 1 to 15 carbon atoms include monohydric alcohols such as ethanol, methanol, propanol, butanol, and pentanol; and polyhydric alcohols such as ethylene glycol, propylene glycol, and glycerin.

 前記縮合重合の反応条件は、使用する原料等により適宜設定できる。例えば反応温度を10℃以上100℃以下、反応時間を0.5時間以上24時間以下とすることができる。 The reaction conditions for the condensation polymerization can be set appropriately depending on the raw materials used, etc. For example, the reaction temperature can be set to 10°C or higher and 100°C or lower, and the reaction time can be set to 0.5 hours or higher and 24 hours or lower.

 前記縮合重合反応に用いる有機溶媒としては、後述する有機溶媒と近しいものが挙げられる。 The organic solvent used in the condensation polymerization reaction may be similar to the organic solvents described below.

(有機溶媒)
 有機溶媒は、沸点150℃以上190℃以下のアミド系溶媒を50質量%以上含む。前記有機溶媒は、1種単独または2種以上を組み合わせて用いることができる。
(organic solvent)
The organic solvent contains 50% by mass or more of an amide-based solvent having a boiling point of 150° C. to 190° C. The organic solvents may be used alone or in combination of two or more.

 前記アミド系溶媒の沸点の下限は、150℃であり、153℃であってもよい。前記アミド系溶媒の沸点の上限は、190℃であり、180℃であってもよく、170℃であってもよい。前記アミド系溶媒の沸点が150℃以上170℃以下であると、平角絶縁電線における絶縁皮膜の膜厚の均一性をより高めることができる。 The lower limit of the boiling point of the amide solvent is 150°C, and may be 153°C. The upper limit of the boiling point of the amide solvent is 190°C, and may be 180°C, or 170°C. When the boiling point of the amide solvent is 150°C or higher and 170°C or lower, the uniformity of the thickness of the insulating coating on the rectangular insulated electric wire can be further improved.

 前記アミド系溶媒としては、例えばN,N-ジメチルアセトアミド(DMAc、沸点:165℃)、N,N-ジメチルホルムアミド(DMF、沸点:153℃)、N,N-ジエチルホルムアミド(DEF、沸点:177℃)が挙げられる。 Examples of the amide solvent include N,N-dimethylacetamide (DMAc, boiling point: 165°C), N,N-dimethylformamide (DMF, boiling point: 153°C), and N,N-diethylformamide (DEF, boiling point: 177°C).

 前記アミド系溶媒がN,N-ジメチルアセトアミド、N,N-ジメチルホルムアミドまたはこれらの組み合わせであると、平角絶縁電線における膜厚の均一性をより高めることができる。 If the amide solvent is N,N-dimethylacetamide, N,N-dimethylformamide, or a combination thereof, the uniformity of the film thickness of the rectangular insulated electric wire can be further improved.

 前記有機溶媒における前記アミド系溶媒の含有量は50質量%以上である。前記アミド系溶媒の含有量の下限としては、50質量%であり、55質量%であってもよく、60質量%であってもよく、65質量%であってもよく、70質量%であってもよく、75質量%であってもよく、80質量%であってもよく、85質量%であってもよい。前記アミド系溶媒の含有量の上限としては特に制限されず、100質量%であってもよく、99質量%であってもよく、98質量%であってもよく、97質量%であってもよく、96質量%であってもよく、95質量%であってもよい。 The content of the amide solvent in the organic solvent is 50% by mass or more. The lower limit of the content of the amide solvent is 50% by mass, and may be 55% by mass, 60% by mass, 65% by mass, 70% by mass, 75% by mass, 80% by mass, or 85% by mass. The upper limit of the content of the amide solvent is not particularly limited, and may be 100% by mass, 99% by mass, 98% by mass, 97% by mass, 96% by mass, or 95% by mass.

 前記有機溶媒は、前記アミド系溶媒以外の溶媒を含んでいてもよい。前記アミド系溶媒以外の溶媒としては、ポリイミド前駆体の合成に用いられる溶媒であれば特に制限されず、例えば非プロトン性溶媒が挙げられる。「非プロトン性溶媒」とは、プロトンを放出する基を持たない有機溶媒をいう。 The organic solvent may contain a solvent other than the amide-based solvent. The solvent other than the amide-based solvent is not particularly limited as long as it is a solvent that can be used in the synthesis of a polyimide precursor, and examples thereof include aprotic solvents. An "aprotic solvent" refers to an organic solvent that does not have a group that releases a proton.

 前記非プロトン性溶媒としては、例えばN-メチル-2-ピロリドン(NMP、沸点:202℃)などのアミド系溶媒;ジメチルスルホキシド(沸点:189℃)などの含硫黄系溶媒;γ-ブチロラクトン(沸点:204℃)などのラクトン系溶媒が挙げられる。 Examples of the aprotic solvent include amide solvents such as N-methyl-2-pyrrolidone (NMP, boiling point: 202°C); sulfur-containing solvents such as dimethyl sulfoxide (boiling point: 189°C); and lactone solvents such as gamma-butyrolactone (boiling point: 204°C).

 前記有機溶媒は、N,N-ジメチルアセトアミドを85質量%以上95質量%以下含み、かつN-メチル-2-ピロリドンを5質量%以上15質量%以下含む場合、平角絶縁電線における絶縁皮膜の膜厚の均一性をより高めることができることに加え、層間の密着性の高い絶縁皮膜を形成することができる。 When the organic solvent contains 85% by mass or more and 95% by mass or less of N,N-dimethylacetamide and 5% by mass or more and 15% by mass or less of N-methyl-2-pyrrolidone, it is possible to further improve the uniformity of the thickness of the insulating coating on the rectangular insulated electric wire, and to form an insulating coating with strong interlayer adhesion.

 当該平角絶縁電線用ワニスにおける前記有機溶媒の含有量は、芳香族テトラカルボン酸二無水物および芳香族ジアミンを均一に溶解、分散させることができる量であれば特に制限されない。しかし、あまりに多量であると絶縁皮膜を形成する際、多量の有機溶媒を揮発させる必要があり、絶縁皮膜の形成に時間を要するおそれがある。そのため、前記有機溶媒の含有量は、例えば芳香族テトラカルボン酸二無水物および芳香族ジアミンの合計100質量部に対し、100質量部以上1,000質量部以下とすることができる。 The content of the organic solvent in the varnish for rectangular insulated electric wire is not particularly limited, as long as it is an amount that can uniformly dissolve and disperse the aromatic tetracarboxylic dianhydride and aromatic diamine. However, if the amount is too large, a large amount of organic solvent will need to be volatilized when forming the insulating coating, which may take a long time to form the insulating coating. Therefore, the content of the organic solvent can be, for example, 100 parts by mass or more and 1,000 parts by mass or less per 100 parts by mass of the aromatic tetracarboxylic dianhydride and aromatic diamine combined.

(空孔形成剤)
 当該平角絶縁電線用ワニスは空孔形成剤を含有していてもよい。当該平角絶縁電線用ワニスが空孔形成剤を含有する場合、複数の空孔を有する絶縁皮膜を形成することができる。
(pore-forming agent)
The varnish for a rectangular insulated electric wire may contain a pore-forming agent. When the varnish for a rectangular insulated electric wire contains a pore-forming agent, an insulating coating having a plurality of pores can be formed.

 空孔形成剤は、空孔を有する絶縁皮膜を形成するために用いられる添加剤として知られているものであれば特に制限されず用いることができる。空孔形成剤としては、例えば化学発泡剤、熱膨張性マイクロカプセル、熱分解性樹脂含有粒子、高沸点溶媒が挙げられる。 The pore-forming agent can be any known additive used to form insulating coatings with pores, and is not particularly limited. Examples of pore-forming agents include chemical foaming agents, thermally expandable microcapsules, particles containing thermally decomposable resins, and high-boiling-point solvents.

 空孔形成剤が熱分解性樹脂含有粒子であると、空孔率が高い場合であっても外観が良好な絶縁皮膜を形成することができる。前記熱分解性樹脂含有粒子は、熱分解によりガス化し、絶縁皮膜内の熱分解性樹脂含有粒子が存在していた部分に空孔が形成される。この場合、前記熱分解性樹脂含有粒子が絶縁皮膜を構成する樹脂の部分(樹脂マトリックスの海相)に微小粒子の島相となって均等分布でき、絶縁皮膜に独立空孔を形成することができる。 When the pore-forming agent is thermally decomposable resin-containing particles, an insulating coating with a good appearance can be formed even when the porosity is high. The thermally decomposable resin-containing particles are gasified by thermal decomposition, and pores are formed in the areas of the insulating coating where the thermally decomposable resin-containing particles were present. In this case, the thermally decomposable resin-containing particles can be evenly distributed as islands of fine particles in the resin portion that makes up the insulating coating (the sea phase of the resin matrix), forming independent pores in the insulating coating.

 熱分解性樹脂含有粒子が含有する熱分解性樹脂は、絶縁皮膜を構成するポリイミドの焼付温度よりも低い温度で熱分解する樹脂であってもよい前記ポリイミドの焼付温度は、ポリイミド前駆体を構成する材料の種類に応じて適宜設定されるが、通常200℃以上600℃以下程度である。「熱分解温度」とは、空気雰囲気下で室温から10℃/分で昇温し、質量減少率が50%となるときの温度を意味する。熱分解温度は、熱重量測定-示差熱分析装置(エスアイアイ・ナノテクノロジー(株)の「TG/DTA」)を用いて熱重量を測定することにより測定できる。 The thermally decomposable resin contained in the thermally decomposable resin-containing particles may be a resin that thermally decomposes at a temperature lower than the baking temperature of the polyimide that makes up the insulating coating. The baking temperature of the polyimide is set appropriately depending on the type of material that makes up the polyimide precursor, but is usually approximately 200°C or higher and 600°C or lower. "Thermal decomposition temperature" refers to the temperature at which a mass loss rate of 50% occurs when the temperature is increased from room temperature at a rate of 10°C/min in an air atmosphere. The thermal decomposition temperature can be measured by measuring the thermogravimetry using a thermogravimetry-differential thermal analyzer ("TG/DTA" from SII Nanotechnology, Inc.).

 前記熱分解性樹脂含有粒子が含有する熱分解性樹脂としては、例えばポリエチレングリコール、ポリプロピレングリコールなどの片方の末端、両方の末端または一部をアルキル化、(メタ)アクリレート化またはエポキシ化した化合物、ポリ(メタ)アクリル酸メチル、ポリ(メタ)アクリル酸エチル、ポリ(メタ)アクリル酸プロピル、ポリ(メタ)アクリル酸ブチルなどの炭素数1~6のアルキル基を有する(メタ)アクリル酸エステルの重合体、ウレタンオリゴマー、ウレタンポリマー、ウレタン(メタ)アクリレート、エポキシ(メタ)アクリレート、ε-カプロラクトン(メタ)アクリレートなどの変性(メタ)アクリレートの重合物、ポリ(メタ)アクリル酸、これらの架橋物、ポリスチレン、架橋ポリスチレンが挙げられる。炭素数1~6のアルキル基を有する(メタ)アクリル酸エステルの重合体であると、前記ポリイミドの焼付温度で熱分解しやすく絶縁皮膜に空孔を形成させやすい。前記(メタ)アクリル酸エステルの重合体として、例えばポリメチルメタクリレート(PMMA)が挙げられる。「(メタ)アクリル酸」との表記は、「アクリル酸」および「メタクリル酸」の総称であり、そのいずれか一方又は両方を指す。また、「(メタ)アクリレート」の表記は、「アクリレート」および「メタクリレート」の総称であり、そのいずれか一方又は両方を指す。 Examples of the thermally decomposable resin contained in the thermally decomposable resin-containing particles include compounds such as polyethylene glycol and polypropylene glycol in which one, both, or a portion of the terminals are alkylated, (meth)acrylated, or epoxidized; polymers of (meth)acrylic acid esters having an alkyl group of 1 to 6 carbon atoms, such as polymethyl(meth)acrylate, polyethyl(meth)acrylate, polypropyl(meth)acrylate, and polybutyl(meth)acrylate; urethane oligomers, urethane polymers, polymers of modified (meth)acrylates such as urethane (meth)acrylate, epoxy (meth)acrylate, and ε-caprolactone (meth)acrylate; poly(meth)acrylic acid; crosslinked products thereof; polystyrene; and crosslinked polystyrene. Polymers of (meth)acrylic acid esters having an alkyl group of 1 to 6 carbon atoms are prone to thermal decomposition at the baking temperature of the polyimide, easily forming voids in the insulating coating. An example of the (meth)acrylic acid ester polymer is polymethyl methacrylate (PMMA). The term "(meth)acrylic acid" is a general term for "acrylic acid" and "methacrylic acid," and refers to either or both of them. Additionally, the term "(meth)acrylate" is a general term for "acrylate" and "methacrylate," and refers to either or both of them.

 前記熱分解性樹脂含有粒子は、前記熱分解性樹脂のみからなる粒子であってもよいし、前記熱分解性樹脂を主成分とするコアと、前記熱分解性樹脂の熱分解温度よりも高い熱分解温度を有する樹脂を主成分とするシェルとを有するコアシェル構造の粒子であってもよい。コアシェル構造の粒子を含むワニスを加熱すると、コアのみが熱分解されて空孔が形成され、この空孔の外周面にシェルが残留した形状となる。コアシェル構造の粒子であると、空孔の連通を少なくすることができ、空孔の大きさのばらつきを小さくすることができる。 The thermally decomposable resin-containing particles may be particles consisting solely of the thermally decomposable resin, or may be particles with a core-shell structure having a core whose main component is the thermally decomposable resin and a shell whose main component is a resin whose thermal decomposition temperature is higher than that of the thermally decomposable resin. When a varnish containing particles with a core-shell structure is heated, only the core is thermally decomposed to form pores, with the shell remaining on the outer periphery of these pores. Particles with a core-shell structure can reduce interconnected pores and reduce variation in pore size.

 前記シェルの主成分は、前記コアよりも熱分解温度が高い材料であれば特に制限されず、誘電率が低く、耐熱性が高い合成樹脂であってもよい。例えばポリスチレン、シリコーン、フッ素樹脂、ポリイミドが挙げられる。とりわけ、前記シェルの主成分がシリコーンであると、弾性を高めやすく、これにより絶縁皮膜中の空孔の分散性がよい。そのため、空孔の連通を少なくすることができ、空孔の大きさのばらつきを小さくすることができる。この構成の絶縁皮膜は縁性および耐熱性に優れる。 The main component of the shell is not particularly limited as long as it has a higher thermal decomposition temperature than the core, and may be a synthetic resin with a low dielectric constant and high heat resistance. Examples include polystyrene, silicone, fluororesin, and polyimide. In particular, when the main component of the shell is silicone, it is easy to increase elasticity, which results in good dispersion of pores in the insulating coating. This reduces interconnection of pores and reduces variation in pore size. An insulating coating with this configuration has excellent conductivity and heat resistance.

 当該平角絶縁電線用ワニスにおける前記空孔形成剤の含有量は、例えば空孔形成剤の種類、絶縁皮膜の目標とする空孔率などに応じて適宜決定することができる。 The content of the pore-forming agent in the varnish for rectangular insulated electric wires can be determined appropriately depending on, for example, the type of pore-forming agent and the target porosity of the insulating coating.

(その他の成分)
 当該平角絶縁電線用ワニスは、上述の前記各成分以外のその他の成分を含有していてもよい。その他の成分は、一般的な絶縁電線の絶縁皮膜を形成するためのワニスに配合されるものであれば特に制限されない。例えば酸化防止剤、レベリング剤、硬化剤、接着助剤が挙げられる。
(Other ingredients)
The varnish for rectangular insulated electric wire may contain other components in addition to the above-mentioned components. The other components are not particularly limited as long as they are blended into varnishes for forming insulating coatings on general insulated electric wires. Examples of the other components include antioxidants, leveling agents, curing agents, and adhesion promoters.

 硬化剤としては、例えばイミダゾール、チタン系硬化剤、イソシアネート系化合物、ブロックイソシアネート、尿素やメラミン化合物、アミノ樹脂、アセチレン誘導体、メチルテトラヒドロ無水フタル酸が挙げられる。当該平角絶縁電線用ワニスが硬化剤を含有する場合、平角絶縁電線における膜厚の均一性をより高めることができる。 Curing agents include, for example, imidazole, titanium-based curing agents, isocyanate compounds, blocked isocyanates, urea or melamine compounds, amino resins, acetylene derivatives, and methyltetrahydrophthalic anhydride. When the varnish for rectangular insulated electric wire contains a curing agent, it can further improve the uniformity of the film thickness on the rectangular insulated electric wire.

<平角絶縁電線>
 当該平角絶縁電線は、平角導体と、前記平角導体を被覆する絶縁皮膜とを備える。図1に示す平角絶縁電線1は、平角導体2と、上記平角導体2を被覆する絶縁皮膜3とを備える。
<Rectangular insulated wire>
The rectangular insulated wire includes a rectangular conductor and an insulating coating covering the rectangular conductor. The rectangular insulated wire 1 shown in Fig. 1 includes a rectangular conductor 2 and an insulating coating 3 covering the rectangular conductor 2.

 当該平角絶縁電線の断面形状は長方形状(平角線)である。平角線であることで、コイル加工の際に当該平角絶縁電線を高密度に巻き付けることができる。 The cross-sectional shape of this rectangular insulated wire is rectangular (flat wire). Because it is a flat wire, it can be wound at high density during coil processing.

 当該平角絶縁電線は、コイル用巻線(マグネットワイヤ)として好適に用いることができる。 This rectangular insulated wire can be suitably used as coil winding wire (magnet wire).

(平角導体)
 平角導体の断面形状は長方形状である。
(Rectangular conductor)
The cross section of the rectangular conductor is rectangular.

 平角導体の材質は、導電率が高くかつ機械的強度が大きい金属であってもよい。前記金属としては、例えば銅、銅合金、アルミニウム、ニッケル、銀、軟鉄、鋼、ステンレス鋼が挙げられる。平角導体は、前記金属を線状に形成した材料や、線状の材料にさらに別の金属を被覆した多層構造のもの、例えばニッケル被覆銅、銀被覆銅、銅被覆アルミニウム、銅被覆鋼を用いることができる。 The material of the rectangular conductor may be a metal with high conductivity and mechanical strength. Examples of such metals include copper, copper alloys, aluminum, nickel, silver, mild steel, steel, and stainless steel. The rectangular conductor can be made of a wire-shaped material made from the above metal, or a multilayer structure in which a wire-shaped material is coated with another metal, such as nickel-coated copper, silver-coated copper, copper-coated aluminum, or copper-coated steel.

 平角導体の平均断面積の下限は、0.01mmであってもよく、0.1mmであってもよい。この場合、当該平角絶縁電線における平角導体に対する絶縁皮膜の体積を適度なものとすることができ、当該平角絶縁電線を用いて形成されるコイル等の体積効率を向上させることができる。平角導体の平均断面積の上限は、20mmであってもよく、10mmであってもよい。この場合、比誘電率を十分に低下させるために絶縁皮膜を厚く形成する必要性を低くすることができ、当該平角絶縁電線の不必要な大径化を回避することができる。 The lower limit of the average cross-sectional area of the rectangular conductor may be 0.01 mm2 or 0.1 mm2 . In this case, the volume of the insulating coating relative to the rectangular conductor in the rectangular insulated electric wire can be made appropriate, thereby improving the volumetric efficiency of coils and the like formed using the rectangular insulated electric wire. The upper limit of the average cross-sectional area of the rectangular conductor may be 20 mm2 or 10 mm2 . In this case, the need to form a thick insulating coating to sufficiently reduce the dielectric constant can be reduced, and unnecessary increases in the diameter of the rectangular insulated electric wire can be avoided.

(絶縁皮膜)
 絶縁皮膜は、平角導体を被覆するように平角導体の外周面に積層される。絶縁皮膜は、1または複数の層から構成される。例えば、絶縁皮膜を後述する方法(ワニスの塗工および焼き付けを複数回繰り返す方法)で形成する場合、絶縁皮膜はワニスを用いて形成した複数の層から構成される積層構造を有する。
(insulating film)
The insulating film is laminated on the outer surface of the rectangular conductor so as to cover the conductor. The insulating film is composed of one or more layers. For example, when the insulating film is formed by the method described below (a method in which varnish is applied and baked multiple times), the insulating film has a laminated structure composed of multiple layers formed using varnish.

 絶縁皮膜は、樹脂マトリックスを含有する。絶縁皮膜は、上述の当該平角絶縁電線用ワニスにより形成されている。したがって、前記樹脂マトリックスはポリイミドを主成分とする。 The insulating coating contains a resin matrix. The insulating coating is formed from the above-mentioned varnish for rectangular insulated electric wire. Therefore, the resin matrix is primarily composed of polyimide.

 絶縁皮膜の平均厚みは特に制限されず、通常2μm以上200μm以下とすることができる。 There are no particular restrictions on the average thickness of the insulating coating, and it can usually be between 2 μm and 200 μm.

 絶縁皮膜は、複数の空孔を含有していてもよい。この場合、絶縁皮膜の低誘電率化を図ることができる。絶縁皮膜が複数の空孔を含有する場合、絶縁皮膜において前記複数の空孔は前記樹脂マトリックス中に散在している。 The insulating coating may contain multiple voids. In this case, the dielectric constant of the insulating coating can be reduced. When the insulating coating contains multiple voids, the multiple voids are dispersed throughout the resin matrix in the insulating coating.

 絶縁皮膜が複数の空孔を含有する場合、絶縁皮膜の空孔率は20体積%以上60体積%以下であってもとよい。絶縁皮膜の空孔率が20体積%以上であると絶縁皮膜の低誘電率化をより図ることができる。絶縁皮膜の空孔率は40体積%以上であってもよい。絶縁皮膜の空孔率の上限は、60体積%であってもよいし、50体積%であってもよい。「空孔率」とは、樹脂マトリックスおよび空孔を有する絶縁皮膜の体積に対する空孔の体積の百分率(単位:体積%)を意味する。空孔率は、具体的には以下の方法で測定される。絶縁皮膜の外径から算出される見かけの体積V1に絶縁皮膜の材質の密度ρ1を乗じて求められる空孔がない場合の質量W1と、絶縁皮膜の実際の質量W2とから、式:(W1-W2)×100/W1により空孔率を算出する。 When the insulating coating contains multiple pores, the porosity of the insulating coating may be 20% by volume or more and 60% by volume or less. A porosity of 20% by volume or more can further reduce the dielectric constant of the insulating coating. The porosity of the insulating coating may be 40% by volume or more. The upper limit of the porosity of the insulating coating may be 60% by volume or 50% by volume. "Porosity" refers to the percentage (unit: volume %) of the volume of pores relative to the volume of the resin matrix and the insulating coating containing pores. Specifically, the porosity is measured as follows: The porosity is calculated using the formula (W1 - W2) x 100/W1, where W1 is the mass when there are no pores, calculated by multiplying the apparent volume V1 calculated from the outer diameter of the insulating coating by the density ρ1 of the insulating coating material, and W2 is the actual mass of the insulating coating.

(空孔)
 前記空孔は、熱分解性樹脂含有粒子に由来するとよい。前記熱分解性樹脂含有粒子の熱分解によりガス化し、絶縁皮膜内の熱分解性樹脂含有粒子が存在していた部分に空孔が形成される。この場合、前記熱分解性樹脂含有粒子が絶縁皮膜を構成する樹脂マトリックスの海相に微小粒子の島相となって均等分布でき、絶縁皮膜に独立空孔を形成される。
(vacancy)
The voids may be derived from thermally decomposable resin-containing particles. The thermally decomposable resin-containing particles are gasified by thermal decomposition, and voids are formed in the insulating coating at the locations where the thermally decomposable resin-containing particles were present. In this case, the thermally decomposable resin-containing particles can be uniformly distributed as islands of fine particles in the sea phase of the resin matrix that constitutes the insulating coating, and independent voids are formed in the insulating coating.

 前記複数の空孔の平均径の下限は0.1μmであると絶縁皮膜の機械特性を向上できる。前記平均径の上限は10μmであると絶縁皮膜の絶縁性を向上できる。前記平均径は、細孔直径分布測定装置(例えばPorous Materials社の「多孔質材料自動細孔径分布測定システム」)により平角絶縁電線の断面を測定することにより得られる値である。 If the lower limit of the average diameter of the plurality of pores is 0.1 μm, the mechanical properties of the insulating coating can be improved. If the upper limit of the average diameter is 10 μm, the insulating properties of the insulating coating can be improved. The average diameter is a value obtained by measuring the cross section of the rectangular insulated electric wire using a pore diameter distribution measuring device (for example, Porous Materials' "Automatic Pore Diameter Distribution Measuring System for Porous Materials").

 当該平角絶縁電線は、上述の構成以外の構成を備えていてもよい。例えば、当該平角絶縁電線は、平角導体と絶縁皮膜との間に密着性向上剤等の添加剤を含有した密着層を有していてもよい。密着性向上剤は、例えば2-メルカプトイミダゾール、5-アミノ-1,3,4-チアジアゾール-2-チオール等のメルカプタン類が挙げられる。 The rectangular insulated wire may have a configuration other than that described above. For example, the rectangular insulated wire may have an adhesion layer containing an additive such as an adhesion improver between the rectangular conductor and the insulating coating. Examples of adhesion improvers include mercaptans such as 2-mercaptoimidazole and 5-amino-1,3,4-thiadiazole-2-thiol.

 当該平角絶縁電線は、最外層として、表面摩擦調整層を有していてもよい。表面摩擦調整層としては、例えばポリアミドイミド、自己潤滑アミドイミド、ポリイミド、自己潤滑ポリイミド層が挙げられる。「最外層」とは、当該平角絶縁電線を構成する積層構造のうち、導体側を内側としたときに最も外側に位置する層を意味する。 The rectangular insulated electric wire may have a surface friction adjusting layer as its outermost layer. Examples of surface friction adjusting layers include polyamide-imide, self-lubricating amide-imide, polyimide, and self-lubricating polyimide layers. The "outermost layer" refers to the layer located outermost in the laminate structure that makes up the rectangular insulated electric wire, with the conductor side facing inward.

 当該平角絶縁電線は、最外層に発泡剤等の添加剤を含有した融着層を有していてもよい。発泡剤としては、例えばアゾジカルボンアミド、アゾビスイソブチロニトリル等のアゾ系発泡剤、ジニトロソペンタメチレンテトラミン、N,N’ジニトロソ-N,N’-ジメチルテレフタルアミド等のニトロソ系発泡剤、p-トルエンスルホニルヒドラジド、p,p’-オキシビスベンゼンスルホニルヒドラジド、ベンゼンスルホニルヒドラジド等のヒドラジド系発泡剤、トリヒドラジノトリアジンが挙げられる。 The rectangular insulated wire may have an outermost adhesive layer containing an additive such as a foaming agent. Examples of foaming agents include azo-based foaming agents such as azodicarbonamide and azobisisobutyronitrile, nitroso-based foaming agents such as dinitrosopentamethylenetetramine and N,N'-dinitroso-N,N'-dimethylterephthalamide, hydrazide-based foaming agents such as p-toluenesulfonylhydrazide, p,p'-oxybisbenzenesulfonylhydrazide and benzenesulfonylhydrazide, and trihydrazinotriazine.

 当該平角絶縁電線は、最外層に、無機フィラーを含有した耐サージ層を有していてもよい。無機フィラーとしては、例えばシリカ、アルミナ、マグネシア、酸化ベリリウム、炭化ケイ素、炭化チタン、炭化ホウ素、タングステンカーバイド、窒化ホウ素、窒化ケイ素が挙げられる。無機フィラーは、表面処理されているものを使用してもよい。表面処理剤としては、例えばシランカップリング剤が挙げられる。 The rectangular insulated wire may have, as its outermost layer, a surge-resistant layer containing an inorganic filler. Examples of inorganic fillers include silica, alumina, magnesia, beryllium oxide, silicon carbide, titanium carbide, boron carbide, tungsten carbide, boron nitride, and silicon nitride. The inorganic filler may be surface-treated. Examples of surface treatment agents include silane coupling agents.

<平角絶縁電線の製造方法>
 当該平角絶縁電線の製造方法は、平角導体の外周面に上述の当該平角絶縁電線用ワニスを塗工する工程(塗工工程)と、前記塗工工程で塗工された前記平角絶縁電線用ワニスを加熱する工程(加熱工程)とを備える。
<Method of manufacturing rectangular insulated wire>
The method for manufacturing the rectangular insulated wire includes a step of applying the above-mentioned rectangular insulated wire varnish to the outer surface of the rectangular conductor (coating step), and a step of heating the rectangular insulated wire varnish applied in the coating step (heating step).

 前記塗工工程では、上述の当該平角絶縁電線用ワニスを平角導体の外周面に塗工する。上述の当該平角絶縁電線用ワニスを平角導体の外周面に塗工する方法としては、例えば平角絶縁電線用ワニスを貯留した液状組成物槽と塗工ダイスとを備える塗工装置を用いた方法が挙げられる。前記塗工装置によれば、平角導体が液状組成物槽内を挿通することで平角絶縁電線用ワニスが平角導体の外周面に付着し、その後塗工ダイスを通過することで平角絶縁電線用ワニスが均一な厚みに塗工される。 In the coating process, the rectangular insulated wire varnish described above is applied to the outer surface of the rectangular conductor. One method for applying the rectangular insulated wire varnish to the outer surface of the rectangular conductor is to use a coating device equipped with a liquid composition tank that stores the rectangular insulated wire varnish and a coating die. With the coating device, the rectangular conductor passes through the liquid composition tank, causing the rectangular insulated wire varnish to adhere to the outer surface of the conductor. The rectangular conductor then passes through the coating die, coating the rectangular insulated wire varnish to a uniform thickness.

 前記加熱工程では、前記塗工工程で導体に塗工された上述の当該平角絶縁電線用ワニスを加熱する。この加熱により、当該平角絶縁電線用ワニス中の有機溶媒が揮発すると共に、ポリイミド前駆体が硬化し、ポリイミドが形成される。 In the heating step, the varnish for rectangular insulated electric wires that was applied to the conductor in the application step is heated. This heating volatilizes the organic solvent in the varnish for rectangular insulated electric wires and hardens the polyimide precursor, forming polyimide.

 前記加熱工程で用いる装置は特に限定されず、例えば導体の走行方向に長い筒状の焼付炉を用いることができる。加熱方法は特に限定されず、例えば熱風加熱、赤外線加熱、高周波加熱などの従来公知の方法により行うことができる。 The equipment used in the heating step is not particularly limited, and for example, a cylindrical baking furnace that is long in the direction in which the conductor travels can be used. The heating method is not particularly limited, and can be any conventionally known method such as hot air heating, infrared heating, or high-frequency heating.

 加熱温度は、例えば300℃以上800℃以下とすることができる。加熱時間は、例えば5秒以上1分以下とすることができる。 The heating temperature can be, for example, 300°C or higher and 800°C or lower. The heating time can be, for example, 5 seconds or higher and 1 minute or lower.

 前記塗工工程と前記加熱工程とは、通常、複数回繰り返される。複数回繰り返すことで絶縁皮膜の厚みを増加させていくことができる。塗工ダイスの孔径は繰り返し回数にあわせて適宜調整することができる。 The coating and heating processes are typically repeated multiple times. By repeating the process multiple times, the thickness of the insulating coating can be increased. The hole diameter of the coating die can be adjusted appropriately depending on the number of repetitions.

 以下、実験例によって本発明をさらに詳細に説明する。本発明はこれらの実験例に限定されるものではない。 The present invention will be explained in more detail below using experimental examples. The present invention is not limited to these experimental examples.

<平角絶縁電線用ワニスの調製および平角絶縁電線の作製>
 平角絶縁電線用ワニスの調製に用いた各種成分を以下に示す。
(芳香族テトラカルボン酸二無水物)
 PMDA:ピロメリット酸二無水物
(芳香族ジアミン)
 ODA:4,4’-ジアミノジフェニルエーテル
(有機溶媒)
 DMAc:N,N-ジメチルアセトアミド(沸点:166℃)
 DMF:N,N-ジメチルホルムアミド(沸点:153℃)
 NMP:N-メチル-2-ピロリドン(沸点:202℃)
<Preparation of Varnish for Rectangular Insulated Wire and Production of Rectangular Insulated Wire>
The various components used in preparing the varnish for rectangular insulated electric wire are shown below.
(Aromatic tetracarboxylic dianhydride)
PMDA: Pyromellitic dianhydride (aromatic diamine)
ODA: 4,4'-diaminodiphenyl ether (organic solvent)
DMAc: N,N-dimethylacetamide (boiling point: 166°C)
DMF: N,N-dimethylformamide (boiling point: 153°C)
NMP: N-methyl-2-pyrrolidone (boiling point: 202°C)

[No.1]
(平角絶縁電線用ワニスの調製)
 芳香族ジアミンとしてのODAをNMPに溶解させた。芳香族テトラカルボン酸二無水物としてのPMDAを、芳香族テトラカルボン酸二無水物と芳香族ジアミンとの混合比(モル比)が100:100となるように加えた。窒素雰囲気下で攪拌しながら30℃で3時間反応させ、ポリイミド前駆体を合成し、NMPを溶媒とするポリイミド前駆体溶液としてワニスNo.1(固形分濃度:28質量%)を得た。
[No. 1]
(Preparation of varnish for rectangular insulated wire)
ODA as an aromatic diamine was dissolved in NMP. PMDA as an aromatic tetracarboxylic dianhydride was added so that the molar ratio of the aromatic tetracarboxylic dianhydride to the aromatic diamine was 100:100. The mixture was allowed to react at 30°C for 3 hours with stirring under a nitrogen atmosphere to synthesize a polyimide precursor. Varnish No. 1 (solids concentration: 28% by mass) was obtained as a polyimide precursor solution containing NMP as a solvent.

(平角絶縁電線の作製)
 平角導体として、断面形状が3mm×2mmの長方形状の銅線を用いた。ワニスNo.1を前記平角導体の表面に塗工し、前記ワニスNo.1を塗工した平角導体を、導体と相似形状のダイスを通過させた後、加熱炉の入口温度400℃、出口温度500℃、線速6.0m/分の条件で加熱する工程を13回繰り返し行うことで平均厚さ40μmの絶縁皮膜を形成し、平角絶縁電線No.1を作製した。
(Production of rectangular insulated wire)
A rectangular copper wire with a cross section of 3 mm × 2 mm was used as the rectangular conductor. Varnish No. 1 was applied to the surface of the rectangular conductor, and the rectangular conductor coated with Varnish No. 1 was passed through a die similar in shape to the conductor. The conductor was then heated in a heating furnace at an inlet temperature of 400°C, an outlet temperature of 500°C, and a wire speed of 6.0 m/min. This process was repeated 13 times to form an insulating coating with an average thickness of 40 μm, producing rectangular insulated electric wire No. 1.

[No.2からNo.20]
 下記表1に示す種類および使用量の各成分を用いたこと以外はNo.1と同じ方法で、ワニスNo.2からNo.20を調製し、平角絶縁電線No.2からNo.20を作製した。
[No. 2 to No. 20]
Varnishes No. 2 to No. 20 were prepared in the same manner as No. 1, except that the types and amounts of each component shown in Table 1 below were used, and rectangular insulated wires No. 2 to No. 20 were produced.

[No.21]
 下記表1に示す種類および使用量の各成分を用い、イミダゾールを1質量%となるように添加したこと以外はNo.1と同じ方法で、ワニスNo.21を調製し、平角絶縁電線No.21を作製した。
[No. 21]
Varnish No. 21 was prepared in the same manner as No. 1, except that the types and amounts of each component shown in Table 1 below were used and imidazole was added so as to give 1 mass %, and rectangular insulated wire No. 21 was produced.

<評価>
 前記調製したワニスNo.1からNo.21について、下記の方法に従い、粘度の測定を行った。さらに、前記作製した平角絶縁電線No.1からNo.21について、下記の方法に従い、膜厚の均一性の評価を行った。
<Evaluation>
The viscosity of each of the prepared varnishes No. 1 to No. 21 was measured according to the following method. Furthermore, the uniformity of the film thickness of each of the prepared rectangular insulated electric wires No. 1 to No. 21 was evaluated according to the following method.

[粘度]
 前記調製したワニスNo.1からNo.21について、B型粘度計(東機産業(株)の「RB-80L」)を用いて調製時点の30℃における粘度を測定した。結果を下記表1の「粘度」の列に示す。
[viscosity]
The viscosity of each of the prepared varnishes No. 1 to No. 21 at 30°C at the time of preparation was measured using a Brookfield viscometer (RB-80L manufactured by Toki Sangyo Co., Ltd.). The results are shown in the "Viscosity" column in Table 1 below.

[膜厚の均一性]
 前記作製した平角絶縁電線No.1からNo.21について、絶縁皮膜の平均膜厚を求めた。絶縁皮膜の平均膜厚は次のようにして求める。絶縁皮膜の30個の断面のそれぞれで、16点の膜厚を測定する。30個の絶縁皮膜の断面は、平角絶縁電線の長手軸に沿って50cm間隔で並ぶものとする。480点(16点×30面)の膜厚の平均が、絶縁皮膜の平均膜厚である。また、測定値の偏差4σ(σは標準偏差)を求めた。平均膜厚が同程度であっても偏差4σの値が大きいものは、バラツキが大きいと判断できる。
[Film thickness uniformity]
The average thickness of the insulating coating was determined for the rectangular insulated wires No. 1 to No. 21 produced above. The average thickness of the insulating coating was determined as follows: The thickness was measured at 16 points on each of 30 cross sections of the insulating coating. The 30 cross sections of the insulating coating were arranged at 50 cm intervals along the longitudinal axis of the rectangular insulated wire. The average thickness of the insulating coating was determined by averaging the thicknesses at 480 points (16 points x 30 surfaces). The deviation 4σ of the measured values (σ is the standard deviation) was also determined. Even if the average thicknesses were similar, a large deviation 4σ could be considered to indicate a large variation.

 さらに、前記平均膜厚および前記偏差4σから、下記式で表されるバラツキ割合を求めた。
  バラツキ割合(%)=(4σ/平均膜厚)×100
 膜厚の均一性は、バラツキ割合が12.0%以下のものを「良好」と、バラツキ割合が12.0%超のものを「不良」と評価した。バラツキ割合が12.0%超である場合、いわゆるドッグボーン形状の絶縁皮膜が形成されやすいといえるためである。
Furthermore, the rate of variation expressed by the following formula was calculated from the average film thickness and the deviation 4σ.
Variation rate (%) = (4σ/average film thickness) × 100
The film thickness uniformity was evaluated as "good" when the variation rate was 12.0% or less, and as "poor" when the variation rate was more than 12.0%, because when the variation rate is more than 12.0%, a so-called dog-bone shaped insulating film is likely to be formed.

 下記表1中、「酸無水物」は「芳香族テトラカルボン酸二無水物」を意味する。「ジアミン」は「芳香族ジアミン」を意味する。「有機溶媒」の列における「特定アミド系溶媒」は沸点150℃以上190℃以下のアミド系溶媒に該当する溶媒を意味する。「その他の溶媒」は、前記特定アミド系溶媒に該当しない溶媒を意味する。「-」は該当する成分を使用していないことを示す。 In Table 1 below, "acid anhydride" means "aromatic tetracarboxylic dianhydride." "Diamine" means "aromatic diamine." In the "organic solvent" column, "specific amide solvent" means a solvent that falls under the category of amide solvents with a boiling point of 150°C or higher and 190°C or lower. "Other solvent" means a solvent that does not fall under the category of the specific amide solvents. "-" indicates that the corresponding component is not used.

 表1から、No.2からNo.21は、No.1と比較して、膜厚の均一性に優れることが分かる。 Table 1 shows that No. 2 to No. 21 have superior film thickness uniformity compared to No. 1.

今回開示された実施の形態は全ての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、前記実施形態の構成に限定されるものではなく、請求の範囲によって示され、請求の範囲と均等の意味および範囲内での全ての変更が含まれることが意図される。 The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is not limited to the configuration of the above-described embodiments, but is indicated by the claims, and is intended to include all modifications within the meaning and scope of the claims.

 1 平角絶縁電線
 2 平角導体
 3 絶縁皮膜
1. Flat insulated wire 2. Flat conductor 3. Insulating coating

Claims (11)

 芳香族テトラカルボン酸二無水物と芳香族ジアミンとの反応生成物であるポリイミド前駆体と、
 有機溶媒と
 を含有し、
 前記有機溶媒が沸点150℃以上190℃以下のアミド系溶媒を50質量%以上含み、
 30℃における粘度が5Pa・s以上25Pa・s以下である平角絶縁電線用ワニス。
a polyimide precursor which is a reaction product of an aromatic tetracarboxylic dianhydride and an aromatic diamine;
an organic solvent and
the organic solvent contains 50% by mass or more of an amide-based solvent having a boiling point of 150° C. or higher and 190° C. or lower,
A varnish for rectangular insulated electric wires having a viscosity at 30°C of 5 Pa·s or more and 25 Pa·s or less.
 前記アミド系溶媒の沸点が150℃以上170℃以下である請求項1に記載の平角絶縁電線用ワニス。 The varnish for rectangular insulated electric wires according to claim 1, wherein the boiling point of the amide-based solvent is 150°C or higher and 170°C or lower.  前記アミド系溶媒がN,N-ジメチルアセトアミド、N,N-ジメチルホルムアミドまたはこれらの組み合わせである請求項1または請求項2に記載の平角絶縁電線用ワニス。 The varnish for rectangular insulated electric wires according to claim 1 or 2, wherein the amide solvent is N,N-dimethylacetamide, N,N-dimethylformamide, or a combination thereof.  前記有機溶媒における前記アミド系溶媒の含有量が70質量%以上である請求項1から請求項3のいずれか1項に記載の平角絶縁電線用ワニス。 The varnish for rectangular insulated electric wire according to any one of claims 1 to 3, wherein the content of the amide solvent in the organic solvent is 70 mass% or more.  前記有機溶媒における前記アミド系溶媒の含有量が95質量%以下である請求項1から請求項4のいずれか1項に記載の平角絶縁電線用ワニス。 The varnish for rectangular insulated electric wire according to any one of claims 1 to 4, wherein the content of the amide solvent in the organic solvent is 95 mass% or less.  前記有機溶媒がN,N-ジメチルアセトアミドを85質量%以上95質量%以下含み、かつN-メチル-2-ピロリドンを5質量%以上15質量%以下含む請求項1から請求項5のいずれか1項に記載の平角絶縁電線用ワニス。 The varnish for rectangular insulated electric wire according to any one of claims 1 to 5, wherein the organic solvent contains 85% by mass or more and 95% by mass or less of N,N-dimethylacetamide and 5% by mass or more and 15% by mass or less of N-methyl-2-pyrrolidone.  30℃における粘度が10Pa・s以上20Pa・s以下である請求項1から請求項6のいずれか1項に記載の平角絶縁電線用ワニス。 The varnish for rectangular insulated electric wires according to any one of claims 1 to 6, having a viscosity at 30°C of 10 Pa·s or more and 20 Pa·s or less.  フィラーを含有しない請求項1から請求項7のいずれか1項に記載の平角絶縁電線用ワニス。 The varnish for rectangular insulated electric wires according to any one of claims 1 to 7, which does not contain a filler.  請求項1に記載の平角絶縁電線用ワニスを用いて平角導体上に絶縁皮膜を形成した際に下記式で表されるバラツキ割合が12.0%以下である請求項1に記載の平角絶縁電線用ワニス。
  バラツキ割合(%)=(4σ/絶縁皮膜の平均膜厚)×100
  (式中、σは、絶縁皮膜の膜厚の標準偏差を示す。)
2. The varnish for rectangular insulated wire according to claim 1, wherein when an insulating coating is formed on a rectangular conductor using the varnish for rectangular insulated wire according to claim 1, the variation rate represented by the following formula is 12.0% or less.
Variation rate (%) = (4σ/average thickness of insulating film) x 100
(where σ represents the standard deviation of the thickness of the insulating coating.)
 平角導体と、
 前記平角導体を被覆する絶縁皮膜と
 を備え、
 前記絶縁皮膜が請求項1から請求項9のいずれか1項に記載の平角絶縁電線用ワニスにより形成されている平角絶縁電線。
A rectangular conductor;
and an insulating coating that covers the rectangular conductor.
A rectangular insulated electric wire, wherein the insulating coating is formed from the varnish for a rectangular insulated electric wire according to any one of claims 1 to 9.
 請求項10に記載の平角絶縁電線の製造方法であって、
 前記平角導体の外周面に請求項1から請求項9のいずれか1項に記載の平角絶縁電線用ワニスを塗工する工程と、
 前記塗工する工程で塗工された前記平角絶縁電線用ワニスを加熱する工程と
 を備える平角絶縁電線の製造方法。
The method for producing a rectangular insulated electric wire according to claim 10,
A step of applying the varnish for a rectangular insulated wire according to any one of claims 1 to 9 to an outer peripheral surface of the rectangular conductor;
a step of heating the varnish for a rectangular insulated electric wire applied in the application step.
PCT/JP2024/039999 2024-01-22 2024-11-11 Varnish for insulated flat electric wire, insulated flat electric wire, and method for manufacturing insulated flat electric wire Pending WO2025158750A1 (en)

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