[go: up one dir, main page]

WO2025153369A1 - Positionneur parallèle à six degrés de liberté - Google Patents

Positionneur parallèle à six degrés de liberté

Info

Publication number
WO2025153369A1
WO2025153369A1 PCT/EP2025/050351 EP2025050351W WO2025153369A1 WO 2025153369 A1 WO2025153369 A1 WO 2025153369A1 EP 2025050351 W EP2025050351 W EP 2025050351W WO 2025153369 A1 WO2025153369 A1 WO 2025153369A1
Authority
WO
WIPO (PCT)
Prior art keywords
support
support plate
movement
assemblies
freedom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/EP2025/050351
Other languages
English (en)
Inventor
Eric Durand
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micro Controle Spectra Physics SAS
Original Assignee
Micro Controle Spectra Physics SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micro Controle Spectra Physics SAS filed Critical Micro Controle Spectra Physics SAS
Publication of WO2025153369A1 publication Critical patent/WO2025153369A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Definitions

  • the present invention relates to a system and a corresponding method for moving a support plate in a treatment environment, for example in a treatment environment for manufacturing electronic devices.
  • the manufacture of electronic devices involves numerous treatment steps and requires moving components from one treatment step to another or placing the electronic device in a particular location for a particular tool. This is especially useful when handling semiconductor wafers and the like.
  • the support system comprises three support assemblies connected to the support plate.
  • the support assemblies each comprise a first motion unit imparting movement along a Z axis relative to the default position and a second motion unit imparting movement in a plane of the support plate relative to the default position.
  • FIG. 1 is a simplified diagram of a support platform for a workpiece to be treated (or "processed") according to one aspect of the present invention
  • FIG. 3a] and FIG. 3b] respectively show the first and second coupler in Figures 1 and 2;
  • the support system 100 is shown in three dimensions (3D) in Figure 1 .
  • the system 100 comprises a plate or a platform 102 for carrying or conveying a workpiece (not shown) from one position to another in various workpiece treatment steps or for any other purpose.
  • the support platform is generally circular in shape, with a center point C and a radius r.
  • the support platform can have any other shape, size or orientation required for different applications.
  • the exact size and shape of the platform is known by the system, so that the relative movements of the platform can be programmed and executed.
  • the ability to precisely know the position of the workpiece and to move it to a new position for the next treatment step, or for any other use, relies on the precise knowledge of the position of the workpiece at any given time.
  • the workpiece position is known in six degrees of freedom and the movements of the support plate 102 are also based on the programming of the movement in these six degrees of freedom and by conventional positional tracking devices.
  • platform 102 is in a known plane.
  • the XY plane comprises an X direction (or longitudinal direction) and a Y direction (or lateral direction).
  • the X and Y directions are part of an S (or XYZ) coordinate system which is illustrated in Figure 1 , but which is understood to apply to all of the other figures although it is not shown.
  • This S coordinate system comprises the X and Y directions forming the XY plane and the Z (or vertical) direction which is orthogonal to said XY plane.
  • the system 100 is designed to be able to move the plate 102 in at least some of the six degrees of freedom.
  • the six degrees of freedom comprise a translation Xi along the X direction; a rotation 9X around the X direction; a translation Yi along the Y direction; a rotation 0Y around the Y direction; a translation Zi along the Z direction; and a rotation 0Z around the Z direction.
  • each leg 104 there are three legs 104 (a), 104(b) and 104(c) and these legs are spaced in a triangular orientation, each leg being substantially 120° from the other two, measured in the XY plane and at the same distance from the center point C between the legs 104.
  • the system 100 is designed to be carried or supported by a robot from which the legs 104 extend.
  • the legs 104 extend from the robot through a support structure 106 which ensures that the legs (104) do not move relative to the support plate 102 other than by the action of one or more motors 108a-c corresponding to each leg 104.
  • a first coupling 116 is oriented in the plane of the support plate 102 and perpendicular to a radius r of a circle centered on C.
  • the first coupling 116 is attached to the base of the support plate 102 on the edge of its circumference.
  • a second connector 118 is coupled to the first connector 1 16 and to the joint 110.
  • the second connector 118 is perpendicular to the first connector 116 and extends along the radius r of the circle in the same plane as the support plate 102.
  • the robot comprises at least one motion unit or motor 108d-f for moving the support plate 102 from one position to another in one or more of the six degrees of freedom.
  • each leg can comprise a motor 108a, 108b, 108c above the end 120 closest to the robot.
  • Each of these motors can move the respective leg in a positive or negative direction or Z axis.
  • three additional motors are associated with the connectors 116 and 118 and are capable of moving the support platform relative to the respective legs in the X and Y directions.
  • the three motors 108d-f are associated with the connectors 116 and 118 and are capable of moving the support platform relative to the respective legs in the X, Y and theta Z directions respectively.
  • the size of the workpiece may have changed as a result of the previous treatment step, and this is taken into account when determining the next required position. For example, during a deposition step, the wafer thickness can change and the subsequent treatment step adjusts to this change. The controller identifies such a change and calculates the required position for the next step accordingly.
  • the legs 104 are each equipped with a motor 108a-c and each is controlled to move separately relative to the support 106 in which the motors 108a- c are located.
  • the illustrated orientation of the system indicates that the motors 108a-c move the support plate in the Z direction (up and down).
  • the position of the joint 110 and therefore of the support plate 102 can be moved in varying proportions, in varying directions, or not moved at all. The combination of these movements results in a corresponding movement of the support plate 102.
  • the support plate 102 can be moved to any height in the system’s Z axis or Theta X or Theta Y rotation.
  • each leg 104 is determined by the controller in order to position the workpiece at the precise location required.
  • the exact movement imparted by the motors 108a-c is determined by the controller and generated in combination with other movements in the XY plane, as described below.
  • any movement imparted by other motors in the system will generate a corresponding movement of the support plate 102 relative to the second coupling 118 of each support assembly 200.
  • Any movement carried out by the first coupling 116 or the second coupling 118 as a result of movements induced by other motors will result in a movement of the support plate 102 in at least one degree of freedom of the system.
  • there are six motors each of which is associated with a translational movement in at least one of the six degrees of freedom of the support plate and of the corresponding workpiece in use. With six motors 108a-f the full range of movements in the six degrees of freedom is possible.
  • the spring 500 is extended or retracted by known amounts after the leg has moved to take the load after one leg has completed its movement. In both cases, the spring can be disengaged whenever necessary to allow the movement to continue. In another option, the Z-wise movement is completed and the spring is deployed within a certain tolerance, in anticipation of the subsequent movement in the XY plane.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Machine Tool Units (AREA)

Abstract

L'invention concerne un système de support (100) pour générer un mouvement d'une plaque de support (102) conçue, lors de l'utilisation, pour transporter une pièce à travailler à déplacer vers une position spatiale prédéterminée par rapport à une position par défaut connue, le système comprenant : une pluralité d'ensembles de support (200) dont chacun est conçu pour se déplacer librement et tourner librement autour de tous les axes (XYZ) et qui est relié à la plaque de support (102) pour translater le mouvement de la plaque de support (102) selon plusieurs degrés de liberté parmi six degrés de liberté, sur la base de la position prédéterminée ; une ou plusieurs unités de mouvement (108a-f) associées chacune à chacun de la pluralité d'ensembles de support (200) ; un dispositif de commande conçu pour entraîner une ou plusieurs des unités de mouvement (108a-f) de façon à amener la plaque de support (102) à se déplacer vers la position prédéterminée, le nombre d'unités de mouvement (108a-f) conçues pour être entraînées étant égal au nombre de degrés de liberté requis par le mouvement pour déplacer la plaque de support (102) vers la position prédéterminée.
PCT/EP2025/050351 2024-01-19 2025-01-08 Positionneur parallèle à six degrés de liberté Pending WO2025153369A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FRFR2400560 2024-01-19
FR2400560A FR3158464A1 (fr) 2024-01-19 2024-01-19 Système et méthode associée pour déplacer une plaque de support dans un environnement de traitement

Publications (1)

Publication Number Publication Date
WO2025153369A1 true WO2025153369A1 (fr) 2025-07-24

Family

ID=90720958

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2025/050351 Pending WO2025153369A1 (fr) 2024-01-19 2025-01-08 Positionneur parallèle à six degrés de liberté

Country Status (2)

Country Link
FR (1) FR3158464A1 (fr)
WO (1) WO2025153369A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6196081B1 (en) * 1998-02-03 2001-03-06 Hexel Corporation Systems and methods employing a rotary track for machining and manufacturing
US20080019817A1 (en) * 2004-11-30 2008-01-24 Kabushiki Kaisha Yaskawa Denki Alignment Apparatus
US20190024842A1 (en) * 2016-01-06 2019-01-24 Micro-Contrôle - Spectra-Physics Sas System for generating the movement of a support plate in six degrees of freedom
CN116766142A (zh) * 2023-08-23 2023-09-19 中国科学院长春光学精密机械与物理研究所 一种多自由度并联调整平台

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6196081B1 (en) * 1998-02-03 2001-03-06 Hexel Corporation Systems and methods employing a rotary track for machining and manufacturing
US20080019817A1 (en) * 2004-11-30 2008-01-24 Kabushiki Kaisha Yaskawa Denki Alignment Apparatus
US20190024842A1 (en) * 2016-01-06 2019-01-24 Micro-Contrôle - Spectra-Physics Sas System for generating the movement of a support plate in six degrees of freedom
CN116766142A (zh) * 2023-08-23 2023-09-19 中国科学院长春光学精密机械与物理研究所 一种多自由度并联调整平台

Also Published As

Publication number Publication date
FR3158464A1 (fr) 2025-07-25

Similar Documents

Publication Publication Date Title
US8467901B2 (en) Calibration of a base coordinate system for an industrial robot
KR100801381B1 (ko) 로봇들의 자동 교정을 위한 방법 및 장치
CN109153125B (zh) 用于定向工业机器人的方法和工业机器人
US10580681B2 (en) Robotic apparatus and method for transport of a workpiece
US10786910B2 (en) Extending robotic arm
KR101025017B1 (ko) 로봇의 타겟 위치 검출 장치
TWI556924B (zh) 基板處理系統、基板處理方法及材料裝卸裝置用的驅動系統
EP2350750B1 (fr) Procédé et appareil d'étalonnage d'un système robotique industriel
KR20000064731A (ko) 다중자유도를가지는로보트
US20150363935A1 (en) Robot, robotic system, and control device
CN101681863A (zh) 基板传送装置
US11472023B2 (en) Robotic apparatus
WO2025153369A1 (fr) Positionneur parallèle à six degrés de liberté
JP2021048270A (ja) 基板搬送装置および基板搬送装置のハンドの位置補正方法
JP5529920B2 (ja) ロボットのターゲット位置検出装置、半導体装置およびターゲット位置検出方法
JP7739453B2 (ja) ロボットセル
JP7731996B2 (ja) ロボットセル
US11964379B2 (en) Asymmetric dual end effector robot arm
CN213646526U (zh) 高精度装配装置
KR101770178B1 (ko) 병렬로봇형 정밀위치 제어장치
CN112276942B (zh) 用于机器人机械臂的一致性补偿方法
CN116067302A (zh) 基于激光扫描的管件三维尺寸全域扫描检测系统及方法
CN209503415U (zh) 位置调整机构及定位装置
CN114248085A (zh) 基于机器视觉的中心定位装配装置及装配方法
JP2013056420A (ja) ロボットのターゲット位置検出装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 25700334

Country of ref document: EP

Kind code of ref document: A1