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WO2025149599A1 - Composition pour jet d'encre durcissable pour la fabrication de cartes de circuit imprimé - Google Patents

Composition pour jet d'encre durcissable pour la fabrication de cartes de circuit imprimé

Info

Publication number
WO2025149599A1
WO2025149599A1 PCT/EP2025/050497 EP2025050497W WO2025149599A1 WO 2025149599 A1 WO2025149599 A1 WO 2025149599A1 EP 2025050497 W EP2025050497 W EP 2025050497W WO 2025149599 A1 WO2025149599 A1 WO 2025149599A1
Authority
WO
WIPO (PCT)
Prior art keywords
curable inkjet
inkjet composition
meth
acrylate
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/EP2025/050497
Other languages
English (en)
Inventor
Mitch MATTHYS
Hubertus Van Aert
Marion Sauvageot
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agfa Gevaert NV
Original Assignee
Agfa Gevaert NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agfa Gevaert NV filed Critical Agfa Gevaert NV
Publication of WO2025149599A1 publication Critical patent/WO2025149599A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/10—Printing inks based on artificial resins
    • C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/32—Inkjet printing inks characterised by colouring agents
    • C09D11/322—Pigment inks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/30—Inkjet printing inks
    • C09D11/38—Inkjet printing inks characterised by non-macromolecular additives other than solvents, pigments or dyes

Definitions

  • the present invention relates to a curable composition for use as an ink jet composition in the manufacturing of electronic devices.
  • the invention also relates to a cured product of said composition.
  • PCBs Printed Circuit Boards
  • PCBs are traditionally manufactured in an extensive process including multiple photolithographic and etching steps, thereby generating a lot of waste.
  • PCB manufacturing workflow In order to reduce the amount of process steps, production costs, and waste, there is an increased interest in digitalizing the PCB manufacturing workflow.
  • Inkjet printing is a preferred digital manufacturing technology for several PCB production steps, such as the application of the etch resist and the solder mask, or printing of the legend.
  • W02020/109769 discloses an inkjet ink for solder mask printing comprising a reactive monomer, an oligomer of prepolymer containing at least one epoxy or oxetane functional group, a free radical polymerizable compound, a thermal cross-linking agent and a radical initiator.
  • EP-A 4215551 discloses an inkjet ink for solder mask printing containing a (meth)acrylic monomer, a photopolymerization initiator, a thermosetting compound, and a gelling agent. This ink is improving adhesiveness and heat resistance and has a low relative dielectric constant.
  • monofunctional in e.g. monofunctional polymerizable compound means that the polymerizable compound includes one polymerizable group.
  • difunctional in e.g. difunctional polymerizable compound means that the polymerizable compound includes two polymerizable groups.
  • polyfunctional or “multifunctional” in e.g. polyfunctional polymerizable compound means that the polymerizable compound includes more than two polymerizable groups.
  • alkyl means all variants possible for each number of carbon atoms in the alkyl group i.e. methyl, ethyl, for three carbon atoms: n-propyl and isopropyl; for four carbon atoms: n-butyl, isobutyl and tertiary-butyl; for five carbon atoms: n-pentyl, 1,1-dimethyl-propyl, 2,2-dimethylpropyl and 2- methyl-butyl, etc.
  • a substituted or unsubstituted alkyl group is preferably a C x to C 6 -alkyl group.
  • a substituted or unsubstituted alkenyl group is preferably a C 2 to C 6 -alkenyl group.
  • a substituted or unsubstituted alkynyl group is preferably a C 2 to C 6 -alkynyl group.
  • a substituted or unsubstituted alkaryl group is preferably a phenyl or naphthyl group including one, two, three or more C x to C 6 -alkyl groups.
  • a substituted or unsubstituted aralkyl group is preferably a C 7 to C 20 -alkyl group including a phenyl group or naphthyl group.
  • a substituted alkyl group, a substituted alkenyl group, a substituted alkynyl group, a substituted aralkyl group, a substituted alkaryl group, a substituted aryl and a substituted heteroaryl group are preferably substituted by one or more constituents selected from the group consisting of methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl and tertiary- butyl, ester, amide, amine, ether, thioether, ketone, aldehyde, sulfoxide, sulfone, sulfonate ester, sulphonamide, -Cl, -Br, -I, -OH, -SH, -CN and -NO 2 .
  • an alkyl, a cycloalkyl or an aryl interrupted by a heteroatom means that a heteroatom in present in the carbon chain of said group, for example -C-O-C-C- or -C-S-C-C-.
  • the composition according to the present invention comprises a mixture of UV-curable compounds and thermal crosslinking agents. Therefore, the curable composition according to the present invention is preferably also a thermally curable composition. Any type of heat source may be used for the thermal curing step, but preferably the thermal curing is performed in an oven. The two curing processes, thermal and UV, can take place simultaneously or sequentially.
  • the curable composition according to the invention is preferably applied as an inkjet ink.
  • the curable composition according to the present invention comprises two or more (meth)acrylates, of which at least one (meth)acrylate comprises a tricyclic aliphatic group.
  • the (meth)acrylates may be monomers, oligomers and/or prepolymers. These monomers, oligomers and/or prepolymers may possess different degrees of functionality, i.e. a different amount of free radical polymerizable groups. A mixture including combinations of mono-, di-, tri-and higher functional monomers, oligomers and/or prepolymers may be used. The viscosity of the curable inkjet ink may be adjusted by varying the ratio between the monomers and oligomers.
  • At least one (meth)acrylate of the curable inkjet composition comprises a tricyclic aliphatic group.
  • a tricyclic aliphatic group is characterized in that three aliphatic rings together form a fused ring system, a bridged ring system, or a bridged fused ring system.
  • a (meth)acrylate comprising a tricyclic aliphatic group is less flexible and has a higher structural rigidity because the atoms being part of the ring system are hindered in their movement by being joint to other rings, compared to conventional (meth)acrylate groups used in curable inkjet compositions for a printed circuit board.
  • a tricyclic aliphatic group is also considered a ‘bulky’ group, meaning that they are possibly affecting the structure of the cured polymer network by controlling polymer chain length and by creating distance in the polymer network.
  • examples of (meth)acrylates comprising a tricyclic aliphatic group are tricyclodecanedimethanol diacrylate (CAS registry number 42594-17-2), dicyclopentanyl acrylate (CAS registry number: 7398- 56-3), tricylodecanedimethanol dimethacrylate (CAS registry number 43048- 08-4), tricyclodecanemethanol acrylate (CAS registry number 93962-84-6), dihydrodicyclopentadienyl acrylate (CAS registry number 903574-98-1), adamantyl (meth)acrylate, (Octahydro-4, 7-methano-lH-inden-5-yl)methyl 2- methyl-2-propenoate (CAS registry number 127823-23-8), (Octahydro-4, 7- methano-lH-inden-5-yl)methyl 2-propenoate (CAS registry number 127823- 21-6), tricyclodecy
  • the curable inkjet composition of the invention comprises from 5 to 30 wt% of multi-functional acrylate relative to the total weight of the curable inkjet composition, more preferably from 10 to 30 wt%, even more preferably from 7.5 to 25 wt%, most preferably from 10 to 20 wt%.
  • the curable inkjet composition according to the invention comprises at least one monofunctional (meth)acrylate comprising a tricyclic aliphatic group and at least one multifunctional (meth)acrylate comprising a tricyclic aliphatic group.
  • the total amount of multi-functional acrylates may not be higher than 30 wt% relative to the total weight of the curable inkjet composition and the total amount of (meth)acrylates comprising a tricyclic aliphatic group must be at least 40 wt%.
  • Preferred examples of polymerizable compounds containing a vinylether group or an N-vinylamide group are those listed in paragraphs [0047] to [0056] in EP-A 3686251.
  • Particularly preferred vinylamide containing polymerizable compounds are N- vinyl-2-py rrol idone and N-vinylcaprolactam as they combine a high Tg with a good ink curability and a good adhesion of a cured ink layer to a recording medium.
  • the polymerizable compound containing an N-vinyl carbamate group is preferably a cyclic compound represented by General Formula I,
  • R4, R5, R6 and R7 independently from each other represent hydrogen, alkyl, cycloalkyl, or aryl and combinations thereof, any of which may be interrupted by heteroatoms. Any of R4 to R7 may represent the necessary atoms for forming a five-or six-membered ring.
  • R4, R5, R6 and R7 independently from each other represent hydrogen or a substituted or unsubstituted C x to C 10 alkyl group.
  • Preferred compounds are disclosed in WO 2015/022228 (BASF) and US 4831153 (DOW CHEMICAL).
  • Cyclic compounds according to General Formula I are often referred to as oxazolidinones, such as N-vinyl-5-ethyl-2-oxazolidinone or 3-methyl-5-vinyl- 2-oxazolidinone and N-vinyl-5-methyl-2-oxazolidinone.
  • oxazolidinones such as N-vinyl-5-ethyl-2-oxazolidinone or 3-methyl-5-vinyl- 2-oxazolidinone and N-vinyl-5-methyl-2-oxazolidinone.
  • a particularly preferred oxazolidinone is N-vinyl-5-methyl-2-oxazolidinone, also referred to as vinyl methyl oxazolidinone, or VMOX.
  • VMOX improves the hardness and increases the Tg of the cured ink layer, especially when it is used in an amount from 1 to 25 wt%, preferably from 2.5 to 15 wt%, and most preferably from 5 to 10 wt% based on the total weight of the curable inkjet composition.
  • VMOX has a low viscosity and a more preferred toxicological profile compared to other N-vinyl compounds, which makes it especially suitable for ink jet printing.
  • the amount of VMOX in the ink can be adjusted such that the viscosity of the inkjet ink is optimized.
  • the polymerizable compound including a vinylether, an N-vinylamide or an N- vinyl carbamate may be used singly or in a combination of one or more polymerizable compounds including a vinylether, an N-vinylamide or an N- vinyl carbamate.
  • the curable composition of the present invention comprises one or more thermal cross-linking agent selected from the group consisting of unblocked isocyanates, blocked isocyanates and triazine compounds.
  • the presence of a thermal cross-linking agent may improve the adhesion after soldering or ENIG plating and the EN IG resistance of the obtained coating.
  • the thermal crosslinking agent may be monofunctional, difunctional or multifunctional.
  • the inkjet composition may comprise a mixture of different thermal crosslinking agents.
  • Thermal cross-linking agents are for example oxiranes, oxetanes, melamineformaldehyde resins, urea-formaldehyde resins, benzoguanamine- formaldehyde resins, cyclic carbonate compounds, carbodiimides, isocyanates, blocked isocyanates, and combinations thereof.
  • Preferred thermal cross-linking agents are isocyanate compounds.
  • Isocyanate compounds are preferably used in combination with a compound comprising active hydrogen functionalities, including, without limitation, alcohols, thiols, amines, water, or combinations thereof. Atmospheric moisture may also cause isocyanate cross-linking. When atmospheric moisture is reacting with an isocyanate, it may not be necessary to prepare an ink combining the isocyanate compound with a compound comprising active hydrogen functionalities.
  • the isocyanate compound may be an aliphatic, an alicyclic or an aromatic isocyanate.
  • the isocyanate compound may comprise a combination of aliphatic, alicyclic or aromatic isocyanate functionalities.
  • aliphatic isocyanates include, without limitation, 1,6- hexamethylene diisocyanate (HDI or HMDI), isophorone diisocyanate (IPDI), l,3-(isocyanatomethyl)cyclohexane (hydrogenated XDI), lysine diisocyanate (LDI), 2,2,4-trimethyl hexamethylene diisocyanate (TMDI), and dimeryl diisocyanate (DDI).
  • HDI or HMDI 1,6- hexamethylene diisocyanate
  • IPDI isophorone diisocyanate
  • hydroxDI lysine diisocyanate
  • TMDI 2,2,4-trimethyl hexamethylene diisocyanate
  • DDI dimeryl diisocyanate
  • alicyclic isocyanates include, without limitation, isophorone diisocyanate (IPDI), methylcyclohexane 2,4-(2,6)-diisocyanate (hydrogenated TDI), and 4,4'-methylenebis(cyclohexylisocyanate) (hydrogenated MDI).
  • IPDI isophorone diisocyanate
  • TDI methylcyclohexane 2,4-(2,6)-diisocyanate
  • MDI 4,4'-methylenebis(cyclohexylisocyanate)
  • aromatic isocyanates include, without limitation, toluene diisocyanate (TDI), 1,5-naphthalene diisocyanate (NDI), 4,4'-di-phenyl- methanediisocyanate (MDI) and xylylene diisocyanate (XDI).
  • a blocked isocyanate can be obtained by reacting an isocyanate with a blocking agent of choice.
  • a blocking agent is a protective group, which is cleaved off at elevated temperatures, for example during a thermal curing process.
  • the blocking agent can be chosen such that it will cleave off at a certain temperature, the so-called de-blocking temperature.
  • Using a blocked isocyanate typically improves the storage stability of the inkjet ink.
  • Particularly preferred blocked isocyanate compounds are Trixene Bl 7960, a HDI biuret blocked with 3,5-dimethylpyrazole, commercially available from Lanxess and Trixene BI7982, a HDI trimer blocked with 3,5-dimethylpyrazole, commercially available from Lanxess.
  • a preferred triazine compound has a chemical structure according to General Formula II,
  • R5, R6 and R7 independently from each other represent a substituted or unsubstituted alkyl group
  • the amount of the triazine compound is preferably from 0.1 to 5 wt%, more preferably from 0.5 to 4 wt%, most preferably from 1 to 3 wt%, all relative to the total weight of the inkjet ink.
  • a preferred amount of photoinitiator is from 0.2 to 20 wt%, more preferably from 0.5 to 10 wt%, most preferably from 1 to 8 wt%, particularly preferred from 1.5 to 6 wt%, all relative to the total weight of the curable inkjet composition.
  • Preferred commercial silicone surfactants include BYKTM 333, BYKTM 347 and BYKTM UV3510 from BYK Chemie.
  • the (meth)acrylated silicone surfactant is a polyether modified (meth)acrylated polydimethylsiloxane or a polyester modified (meth)acrylated polydimethylsiloxane.
  • the method of manufacturing an electronic device according to the present invention includes at least one step wherein a curable inkjet composition as described above is jetted and cured on a substrate.
  • the electronic device is a Printed Circuit Board (PCB).
  • the substrate is preferably a dielectric substrate containing an electrically conductive pattern, which typically comprises conductive pads electrically connected with each other using traces.
  • the dielectric substrate of the electronic device may be any non-conductive material.
  • the substrate is typically a paper/resin composite or a resin/fibre glass composite, a ceramic substrate, a polyester or a polyimide.
  • FR-4 is an example of a material frequently used as dielectric substrate.
  • the electrically conductive pattern is typically made from any metal or alloy which is conventionally used for preparing electronic devices such as gold, silver, palladium, nickel/gold, nickel, tin, tin/lead, aluminium, tin/aluminium and copper.
  • the electrically conductive pattern is preferably made from copper.
  • the substrate Before applying the solder mask composition, the substrate is preferably subjected to one or more pre-treatment processes. These processes can be mechanical or chemical, or a combination thereof.
  • a preferred pre-treatment process is chemical micro-etching, which typically results in micro-roughness on the substrate.
  • a so-called anti-bleeding treatment can be additionally applied to the micro-etched surface to prevent bleeding of the ink into the micro-pores and to improve print quality.
  • This anti-bleeding treatment typically comprises applying a coating layer on the substrate in order to adjust its surface energy, resulting in sharper contact angles and minimal bleeding of ink into micro-pores. Anti-bleeding treatments are preferably used when printing low-viscous compositions.
  • the process of inkjet printing the solder mask layer on a dielectric substrate with an electrically conductive pattern preferably comprises one or more printing steps as listed below.
  • the printing of so-called “dams” is usually done to indicate the contours of the entire solder mask layer. These dams are usually cured with higher curing energies to provide precise features and lines.
  • the thickness of the dams is preferably at least the same as the thickness of the full solder mask layer.
  • the thickness of the dams is more preferably higher than the thickness of the full solder mask layer, in order to avoid possible ink flow towards the open pad.
  • the dams preferably have a thickness of 5 to 75 pm, more preferably from 10 to 60 pm, most preferably from 20 to 40 pm.
  • a heat treatment is preferably applied to the jetted and UV-cured curable inkjet composition.
  • the heat treatment is preferably carried out at a temperature of from 80 ° C and 250 ° C.
  • the temperature is preferably not less than 100° C, more preferably not less than 120 ° C.
  • the temperature is preferably not higher than 200 ° C, more preferably not higher than 160 ° C.
  • the inkjet print head normally scans back and forth in a transversal direction across the moving ink-receiving surface (substrate). Often the inkjet print head does not print on the way back. Bi-directional printing is preferred for obtaining a high areal throughput.
  • Another preferred printing method is by a “ single pass printing process”, which can be performed by using page wide inkjet print heads or multiple staggered inkjet print heads which cover the entire width of the ink-receiving surface. In a single pass printing process, the inkjet print heads usually remain stationary and the ink-receiving surface is transported under the inkjet print heads.
  • SR789 is tricyclodecanemethanol acrylate available as SartomerTM SR789 from ARKEMA with CAS registry number 93962-84-6.
  • FA513AS is dicyclopentanyl acrylate with CAS number 79637-74-4 available from Resonac.
  • DETX is a 2,4-diethylthioxanthone photoinitiator available as Genocure DETX from Rahn.
  • Trixene BI7960 is a DMP-blocked isocyanate cross-linking agent commercially available from LANXESS.
  • Cymel N F2000A is a triazine cross-linking agent commercially available from ALLN EX.
  • Yellow is CROMOPHTAL YELLOW D 1085J, a yellow pigment from BASF.
  • the boards were dipped in 2.5 wt% aqueous H 2 SO 4 solution at RT during 30 seconds after which they were removed and rinsed in DW at RT during 90 seconds. They were then dipped again in the same solution during 60 seconds.
  • the boards were dipped in a palladium activator bath (Accemulta MKN 4) at a temperature around 30 ° C for 90 s followed by dipping in a 5 wt% aqueous H 2 SO 4 solution at RT during 75 seconds. The boards were then removed and dipped in a rinsing bath of DW at RT during 90 seconds.
  • a palladium activator bath Accelemulta MKN 4
  • Inks containing at least 40 wt% of a tricycloalkane acrylate monomer such as SR789 have a good IR reflow resistance. When there is less than 40 wt% SR789, the IR reflow resistance becomes worse. It is also clear that an increasing amount of difunctional acrylate has a positive impact on LED sensitivity.
  • the curable inkjet composition Ex-4 to Ex-10 and the comparative curable inkjet composition Comp-3 to Comp-4 were prepared according to Table 5. The weight percentages are based on the total weight of the curable inkjet composition.
  • inks comprising tricycloalkane acrylate monomers such as SR833s and SR789 have a good IR reflow resistance.
  • the amount of diacrylate SR833s increases above 30.0 wt% (Comp-3 and Comp-4), the IR reflow resistance becomes worse. It is believed that above 30.0 wt% of diacrylates, in this case SR833s, the curing results in a high shrinkage stress, resulting in a reduced adhesion, having a negative impact on the IR reflow resistance.
  • the ink does not contain more than 30 wt% diacrylates.
  • the inks have a good curability after 1 or 2 passes. It is clear from the table that when there is no SR833s (Ex-4) or only 5 wt% SR833s (Ex-5), the LED sensitivity is less good than when there is more SR833s present.
  • the inks have a viscosity of between 6 and 12 mPa.s.
  • the viscosity is higher than 15 mPa.s.
  • the curable inkjet composition Ex-11 to Ex-15 and the comparative curable inkjet compositions Comp-5 to Comp-9 were prepared according to Table 7. The weight percentages are based on the total weight of the curable inkjet composition.
  • SR833s was replaced by HDDA, a linear diacrylate also commonly known and used in inks for printed circuit boards.
  • SR833s was replaced by CHDMDA, a diacrylate having a single aliphatic ring in its skeleton.
  • thermal crosslinkers are varied within the compositions, to verify that the IR reflow resistance results are only related to the presence of acrylates comprising a tricyclic aliphatic group.
  • Ex-16, Ex-20, Comp-10, and Comp-11 the amount of bifunctional SR833s is increased, while the amount of monofunctional SR789 is decreased accordingly. All other compounds are kept constant.
  • Ex-17 to Ex-19 two types of thermal crosslinkers were added separately or together.
  • the inkjet inks were printed using a MicroCraft CPS2013D (Printhead Konica Minolta KM1024iS, UV LED 395 12 W total output of the lamp) on a checkerboard (copper plated on FR4) substrate from Eurocircuits to obtain a soldermask layer having a final thickness of +/- 22 pm.
  • the checkerboards include a 35 pm copper layer that was roughened by chemical etching.
  • the substrate was transported through a Bungard Sprint 3000 Conveyorized Spray Etch machine at a speed of 0.4 m/min while spraying with the chemical etchant CZ2001 (available from MEC) heated at 30° C.
  • Print-1 An image having a resolution 1440 dpi in the x-direction and 1440 dpi in the y-direction was printed and cured.
  • the UV energy applied corresponded to 10 % of the total power of the 12 W lamp.
  • a final cure was applied to further cure the printed solder mask layer (4 passes at full energy of the 12 W lamp).
  • Print-2 (P2): Compared to Print 1, the image was printed in the same resolution but the UV energy applied corresponded to 100 % of the total power of the 12 W lamp. A final cure was then carried out as described for Print-1.

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)

Abstract

L'invention concerne une composition pour jet d'encre durcissable pour une carte de circuit imprimé comprenant un photoinitiateur et au moins deux (méth)acrylates, au moins un (méth)acrylate comprenant un groupe aliphatique tricyclique, caractérisée en ce que : - la quantité totale de (méth)acrylates comprenant un groupe aliphatique tricyclique est d'au moins 40 % en poids par rapport au poids total de la composition pour jet d'encre durcissable ; et - la quantité totale d'acrylates multifonctionnels est de 0 à 30 % en poids par rapport au poids total de la composition pour jet d'encre durcissable.
PCT/EP2025/050497 2024-01-11 2025-01-10 Composition pour jet d'encre durcissable pour la fabrication de cartes de circuit imprimé Pending WO2025149599A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP24151338 2024-01-11
EP24151338.1 2024-01-11

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WO2025149599A1 true WO2025149599A1 (fr) 2025-07-17

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