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WO2025142472A1 - Composition de résine pour guide d'ondes optiques et film sec et guide d'ondes optique utilisant ladite composition - Google Patents

Composition de résine pour guide d'ondes optiques et film sec et guide d'ondes optique utilisant ladite composition Download PDF

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Publication number
WO2025142472A1
WO2025142472A1 PCT/JP2024/043696 JP2024043696W WO2025142472A1 WO 2025142472 A1 WO2025142472 A1 WO 2025142472A1 JP 2024043696 W JP2024043696 W JP 2024043696W WO 2025142472 A1 WO2025142472 A1 WO 2025142472A1
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Prior art keywords
epoxy compound
formula
resin composition
optical waveguide
group
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English (en)
Japanese (ja)
Inventor
潤子 栗副
祐輔 浦岡
津 金
麻稀 黒田
敦史 山口
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind

Definitions

  • the present invention relates to a resin composition for optical waveguides, and a dry film and optical waveguide using the same.
  • the optical waveguide is obtained by forming a clad section and a core section using two types of ultraviolet (UV) curable optical waveguide resin compositions that are highly transparent and have different refractive indices.
  • UV curable optical waveguide resin compositions contain a resin, such as an epoxy resin, an acrylic resin, or a silicone resin, and a curing agent.
  • an electrical circuit is also formed on the substrate on which the optical waveguide is formed, and for example, a light emitting element, a photoelectric conversion element, a semiconductor element, etc. are mounted.
  • the substrate is subjected to a reflow process using, for example, lead-free solder. Since such a reflow process is performed at high temperatures, the epoxy resin, which has the highest heat resistance among the above-mentioned resins, is preferably used as the resin material for the optical waveguide subjected to the reflow process.
  • many resin compositions for optical waveguides containing epoxy resins with higher heat resistance have been developed in order to further mass-produce optical wiring boards on which such optical elements are mounted (see, for example, Patent Document 1).
  • the dry film according to the second aspect of the present invention has a layer containing an uncured or semi-cured product of the resin composition for optical waveguide according to the first aspect.
  • FIG. 1 is a schematic cross-sectional view for explaining an example of a method for forming an optical waveguide using the dry film according to the present embodiment.
  • FIG. 1(a) is a schematic diagram showing a stage in which a clad dry film is laminated on a surface of a substrate.
  • FIG. 1(b) is a schematic diagram showing a stage in which the clad dry film is cured by ultraviolet light irradiation or the like, and an underclad is laminated and formed.
  • FIG. 1(c) is a schematic diagram showing a stage in which a core dry film is exposed to a core pattern.
  • FIG. 1(d) is a schematic diagram showing a stage in which a core portion is formed on the surface of the underclad.
  • FIG. 1(a) is a schematic diagram showing a stage in which a clad dry film is laminated on a surface of a substrate.
  • FIG. 1(b) is a schematic diagram showing a stage in which the clad dry
  • FIG. 1(e) is a schematic diagram showing a stage in which a clad dry film is laminated so as to cover the underclad and the core portion.
  • FIG. 1(f) is a schematic diagram showing a stage in which a clad dry film laminated so as to cover the underclad and the core portion is cured by ultraviolet light irradiation or the like, and an overclad is laminated and formed.
  • the present invention can provide a resin composition for optical waveguides that can suppress optical loss in the 1,310 nm wavelength band before and after reflow processing and has good film handling properties.
  • First epoxy compound (a1) having a norbornane structure By including the first epoxy compound (a1) in the epoxy compound (A) according to the present embodiment, it is possible to obtain a resin composition capable of suppressing optical loss in the 1310 nm wavelength band not only before reflow treatment but also after reflow treatment at high temperatures. This is believed to be because the epoxy compound includes a norbornane structure having rigidity, which suppresses the broadening of the spectrum in the 1310 nm wavelength band derived from the cyclohexane of the epoxy compound, and forms a sharp peak.
  • the first epoxy compound (a1) preferably contains one or more compounds having the structural formulas represented by the following formulas (1) and (2).
  • R 1(a1) to R 36(a1) when an alkyl group and/or an alkoxy group is selected from R 1(a1) to R 36(a1) , it is preferable that the alkyl group and/or the alkoxy group have 1 to 5 carbon atoms, and more preferable that the alkyl group and/or the alkoxy group have 1 to 3 carbon atoms.
  • the alkyl group and the alkoxy group may be linear or branched. It is more preferable that R 1(a1) to R 36(a1) are each independently selected to be hydrogen, and it is particularly preferable that R 1(a1) to R 36(a1) are all hydrogen.
  • the first epoxy compound (a1) may be synthesized by a known method, or a commercially available product may be used.
  • a compound having the structural formula represented by the above formula (1-1) may be "DE102" manufactured by ENEOS Corporation.
  • a compound having the structural formula represented by the above formula (2-1) may be "DE103" manufactured by ENEOS Corporation.
  • Other examples of the first epoxy compound (a1) include "EPICLON HP-7200" manufactured by DIC Corporation and "DCPD-DE” manufactured by Japan Material Technology Co., Ltd.
  • the first epoxy compound (a1) may be used alone or in combination of two or more.
  • the content of the first epoxy compound (a1) is not particularly limited as long as it satisfies the condition of ⁇ (a2)/(a1) ⁇ 100 (parts by mass) described below, but is preferably 40% by mass or more and 95% by mass or less with respect to the total amount of the epoxy compound (A).
  • the content of the first epoxy compound (a1) is 40% by mass or more, the optical loss in the 1310 nm wavelength band before and after the reflow treatment can be better suppressed.
  • the content of the first epoxy compound (a1) is 95% by mass or less, it can be reliably prevented from becoming difficult to form into a film.
  • the epoxy compound (A) according to this embodiment includes not only the first epoxy compound (a1) but also the second epoxy compound (a2).
  • the second epoxy compound (a2) By including the second epoxy compound (a2), the optical loss in the 1310 nm wavelength band before and after the reflow treatment can be suppressed. Furthermore, the rigidity derived from the norbornane structure can be suppressed, and the dry film produced can be given flexibility. As a result, the film can be easily handled. If an epoxy compound having a silicone structure with a Si number of more than 6 is used, it becomes difficult to mix the epoxy compound having a silicone structure uniformly in the resin composition, and as a result, it becomes difficult to form a film.
  • the second epoxy compound (a2) is not particularly limited, but preferably contains an epoxy compound having a liquid silicone structure.
  • an epoxy compound having a liquid silicone structure By containing an epoxy compound having a liquid silicone structure, it is possible to more reliably suppress the optical loss in the 1310 nm wavelength band before and after the reflow treatment, and also to reliably improve the film's handling properties.
  • the second epoxy compound (a2) preferably contains one or more of the compounds having the structural formulas represented by the following formulas (3), (4), and (5). Each formula is explained below.
  • Equation (3) is as follows:
  • R 1(a2) to R 4(a2) are each independently an alkyl group having 1 to 10 carbon atoms.
  • X 1 and X 2 are each independently selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, a group represented by the following formula (3A), and a group represented by the following formula (3B). However, at least one of X 1 and X 2 is a group represented by the following formula (3A) or formula (3B).
  • R1 (a2) to R4 (a2) are each preferably independently an alkyl group having 1 to 5 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms.
  • X1 or X2 is an alkyl group
  • each is preferably independently an alkyl group having 1 to 5 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms.
  • the alkyl group may be linear or branched.
  • R5 (a2) and R6 (a2) are preferably an alkylene group having 1 to 3 carbon atoms, and more preferably a dimethylene group or a trimethylene group.
  • Equation (4) is as follows:
  • R 7(a2) to R 12(a2) are each independently an alkyl group having 1 to 10 carbon atoms.
  • X 3 and X 4 are each independently selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, a group represented by the above formula (3A), and a group represented by the above formula (3B). However, at least one of X 3 and X 4 is a group represented by the above formula (3A) or formula (3B).
  • n is an integer of 1 to 4.
  • R7 (a2) to R12 (a2) are each preferably independently an alkyl group having 1 to 5 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms.
  • X3 and X4 are each independently an alkyl group, they are each preferably independently an alkyl group having 1 to 5 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms.
  • the alkyl group may be linear or branched.
  • R 13(a2) and R 14(a2) are each independently selected from the group consisting of hydrogen, an alkyl group having 1 to 10 carbon atoms, a group represented by the above formula (3A), and a group represented by the above formula (3B) for each repeating unit k.
  • at least one of all R 13(a2) and R 14(a2) in the repeating unit k is a group represented by the above formula (3A) or formula (3B).
  • k is an integer of 3 to 6.
  • the alkyl group or alkoxy group in R 15(a2) and R 16(a2) may be linear or branched.
  • the resin composition may contain an epoxy compound other than the above-mentioned epoxy compound, so long as the effect of suppressing the optical loss before and after the reflow treatment and the effect of good film handling are not impaired.
  • the other epoxy compound may be either a liquid epoxy compound or a solid epoxy compound.
  • epoxy compounds include bisphenol A type epoxy resins, hydrogenated bisphenol A type epoxy resins, bisphenol F type epoxy resins, multifunctional epoxy resins, bisphenol E type epoxy resins, brominated epoxy resins, fluorinated epoxy resins, aromatic epoxy resins, novolac type epoxy resins, biphenyl type epoxy resins, alicyclic epoxy resins, aliphatic epoxy resins, etc.
  • Bisphenol A epoxy resins may be synthesized by known methods, or commercially available products may be used.
  • commercially available solid bisphenol A epoxy resins include “1001", “1002", “1003”, “1055", “1004", “1004AF”, “1003F”, “1004F”, “1005F”, “1004FS”, “1006FS”, and “1007FS” manufactured by Mitsubishi Chemical Group Corporation.
  • commercially available liquid bisphenol A epoxy resins include “Epicron (registered trademark) 850S” manufactured by DIC Corporation and "JER (registered trademark) 825" manufactured by Mitsubishi Chemical Corporation.
  • the other epoxy compounds it is preferable to include a multifunctional epoxy resin, from the viewpoint that the glass transition temperature Tg of the dry film can be improved, and therefore good heat resistance can be imparted to the optical waveguide.
  • the epoxy equivalent of the multifunctional epoxy resin is not particularly limited, but is preferably, for example, about 150 g/eq to 250 g/eq.
  • polyfunctional epoxy resins examples include 2-[4-(2,3-epoxypropoxy)phenyl]-2-[4-[1,1-bis[4-([2,3-epoxypropoxy]phenyl)]ethyl]phenyl]propane, cresol novolac type epoxy resins, and the like.
  • Polyfunctional epoxy resins may be synthesized by known methods, but commercially available products may also be used. Examples of commercially available products include "VG3101M80” manufactured by Printec Co., Ltd., "EHPE-3150” manufactured by Daicel Corporation, and "EPPN-502” manufactured by Nippon Kayaku Co., Ltd.
  • the content of the other epoxy compounds is not particularly limited as long as it satisfies the above-mentioned condition of ⁇ (a2)/(a1) ⁇ x 100 (parts by mass) and does not impair the effects of suppressing light loss before and after the reflow treatment and good film handleability according to this embodiment.
  • the content of the other epoxy compounds relative to the total amount of epoxy compound (A) is preferably 0% by mass or more and 30% by mass or less.
  • the content of the other epoxy compounds is more preferably 25% by mass or less, and even more preferably 20% by mass or less.
  • the resin composition according to the present embodiment may generally contain a curing agent.
  • the type of the curing agent is not particularly limited as long as it can promote photocuring of the resin composition containing the epoxy compound (A).
  • a polymerization initiator that causes ring-opening polymerization of the epoxy group of each epoxy compound (A) can be used.
  • a polymerization initiator is a photoacid generator that can start a reaction by light such as ultraviolet light.
  • the hardener include antimony-based hardeners, gallate-based hardeners, phosphorus-based hardeners, special phosphorus-based hardeners, and borate-based hardeners.
  • Commercially available hardeners can be used.
  • Commercially available hardeners include "CPI-310FG” manufactured by San-Apro Co., Ltd., which is a gallate-based hardener, "CPI-101A” manufactured by San-Apro Co., Ltd., which is an antimony-based hardener, and "SP-170” manufactured by ADEKA Corporation. These hardeners may be used alone or in combination of two or more.
  • the content of the curing agent is not particularly limited as long as it does not impair the effects of suppressing optical loss before and after the reflow treatment according to this embodiment and of providing good film handling properties.
  • the content of the curing agent is preferably 0.1% by mass or more and 5% by mass or less, and more preferably 0.5% by mass or more and 3% by mass or less, based on the total amount of the epoxy compound (A).
  • the resin composition may further contain other additives such as antioxidants, leveling agents, coupling agents (silane coupling agents), flame retardants, and inorganic fillers, as long as the effects of suppressing light loss before and after the reflow treatment according to this embodiment and of good film handleability are not impaired.
  • additives such as antioxidants, leveling agents, coupling agents (silane coupling agents), flame retardants, and inorganic fillers, as long as the effects of suppressing light loss before and after the reflow treatment according to this embodiment and of good film handleability are not impaired.
  • the resin composition further contains an antioxidant.
  • the antioxidant is not particularly limited, and phenol-based antioxidants, phosphite-based antioxidants, sulfur-based antioxidants, etc. can be used. Of these, it is preferable that the antioxidant is a phenol-based antioxidant.
  • phenolic antioxidants can be used. Examples of commercially available phenolic antioxidants include “AO-20”, “AO-30”, “AO-40”, “AO-50”, “AO-60”, and “AO-80” manufactured by Adeka Corporation, and “SUMILIZER GA-80” manufactured by Sumitomo Chemical Co., Ltd.
  • the content of the antioxidant (C) is not particularly limited, but is preferably (0% by mass or more) 5% by mass or less, and more preferably (0% by mass or more) 1% by mass or less, based on the total amount of the epoxy compound (A).
  • the resin composition for optical waveguides according to this embodiment can suppress optical loss in the 1310 nm wavelength band not only before reflow processing, but also after reflow processing at high temperatures. Furthermore, the resin composition for optical waveguides according to this embodiment also has good film handling properties. Therefore, this resin composition can be suitably used as a material for the dry film according to the embodiment described below that is used when manufacturing optical waveguides, particularly optical waveguides in which electrical circuits are also formed and optical elements and the like are also mounted.
  • the resin composition for optical waveguides according to this embodiment may be used for both the core and the cladding. However, since the optical loss at a wavelength of 1310 nm occurs mainly in the core, the resin composition for optical waveguides according to this embodiment can be more effective when used to manufacture a dry film for the core.
  • Dry film The dry film according to this embodiment is not particularly limited as long as it has a layer containing the resin composition for optical waveguide according to the above-mentioned embodiment. Specifically, the dry film has a layer containing an uncured or semi-cured product of the resin composition for optical waveguide according to the above-mentioned embodiment (hereinafter also referred to as "resin composition layer for optical waveguide” or “resin composition layer”). Since the resin composition for optical waveguide according to the above-mentioned embodiment has good film handling properties, the dry film according to this embodiment has excellent film handling properties and excellent adhesion to the film base, film substrate, etc.
  • uncured material or “semi-cured material” refers to a resin composition layer in an uncured or semi-cured state, in which a varnish-like resin composition as described below is applied and then heated and/or dried at an appropriate temperature and time as necessary, so that the solvent and the like are reduced or removed.
  • an "uncured material” or “semi-cured material” is in a state in which the epoxy resin in the resin composition layer can be further cured.
  • the term "cured product" refers to a resin layer in which the curing reaction of an uncured or semi-cured resin composition layer progresses due to irradiation with light such as ultraviolet light, causing the resin to crosslink, resulting in a resin layer that does not melt even when heated.
  • the optical waveguide finally obtained comprises a core portion and/or a clad portion that is a cured product of the resin composition for optical waveguides.
  • the dry film may include a film substrate laminated on at least one side of the resin composition layer. Furthermore, a protective film may be laminated on the other side of the resin composition layer.
  • the dry film may also have other layers in addition to the resin composition layer, the film substrate and/or the protective film. However, the dry film may be composed of a resin composition layer containing an uncured and/or semi-cured product of the resin composition for optical waveguide according to the above-mentioned embodiment.
  • the film substrate is not particularly limited, but examples thereof include polyethylene terephthalate (PET) film, biaxially oriented polypropylene film, polyethylene naphthalate film, polyimide film, etc. Of these, PET film is preferable.
  • PET film is preferable.
  • the protective film is not particularly limited, but examples thereof include polypropylene film, etc.
  • the method for producing the dry film is not particularly limited, but may be, for example, the method described below.
  • a solvent or the like is added to the resin composition for optical waveguides according to the above-mentioned embodiment to form a varnish-like resin composition, and the varnish is applied to the film substrate.
  • This application may be performed using a comma coater or the like.
  • the applied varnish is then dried at an appropriate temperature and time to form a resin composition layer on the film substrate.
  • a protective film is laminated on this resin composition layer. Examples of the method for laminating the protective film include a thermal lamination method.
  • the dry film having the resin composition layer produced in this manner is used as a material for an optical waveguide according to an embodiment described below.
  • the dry film may be used when producing the core portion of the optical waveguide, or may be used when producing the cladding portion.
  • optical loss at a wavelength of 1310 nm occurs mainly in the core portion, so it is preferably used when producing the core portion of the optical waveguide.
  • the resin composition for optical waveguide according to the above-mentioned embodiment does not necessarily have to be used after forming the dry film according to this embodiment when manufacturing an optical waveguide.
  • the resin composition for optical waveguide according to the above-mentioned embodiment may be made into a varnish-like resin composition and used directly when manufacturing the core portion and/or clad portion of the optical waveguide.
  • the optical waveguide according to this embodiment is formed using the resin composition or dry film according to the above-mentioned embodiment. Since the optical waveguide is formed using the resin composition or dry film according to the above-mentioned embodiment, the optical loss at a wavelength of 1310 nm before and after the reflow treatment can be suppressed, and the optical waveguide is very useful for industrial use.
  • the optical waveguide according to this embodiment is an optical waveguide including a core portion and a clad portion that has a lower refractive index than the core portion and is formed so as to cover the core portion, and the core portion or the clad portion is formed using the resin composition or dry film according to the above-mentioned embodiment.
  • the core portion of the optical waveguide is formed using the resin composition or dry film according to the above-mentioned embodiment.
  • the cladding is formed so as to cover the core
  • the undercladding and/or overcladding which is formed by curing a dry film for cladding or the like, is formed so as to embed the core (or substantially covers or surrounds the periphery of the core).
  • Figures 1(a) to 1(f) respectively indicate a clad dry film 1, a core dry film 2, a clad portion 3, an underclad 3a, an overclad 3b, a core portion 4, a substrate 10, an electric circuit 11, a slit 12, a mask 13, and an optical waveguide A.
  • the optical waveguide A is formed by using a clad dry film and a core dry film to form the core portion and the clad portion, respectively.
  • the core dry film is a dry film according to the embodiment described above
  • the clad dry film is a dry film with a lower refractive index than the core film.
  • the clad dry film and the core dry film may both be dry films according to the embodiment described above.
  • a clad dry film 1 is laminated onto the surface of a substrate 10 on which an electric circuit 11 is formed, and then the clad dry film 1 is cured by irradiation with ultraviolet light or other light, heating, or the like.
  • the substrate 10 may be, for example, a flexible printed wiring board with an electric circuit formed on one side of a transparent base material such as a polyimide film, or a printed wiring board such as a glass epoxy.
  • an underclad 3a is laminated and formed on the surface of the substrate 10, as shown in FIG. 1(b).
  • the core dry film 2 is laminated onto the surface of the underclad 3a, and then a mask 13 with slits 12 of the core pattern is placed over it. Then, light capable of photocuring, such as ultraviolet light, is irradiated through the slits 12, thereby exposing the core dry film 2 to the core pattern.
  • the exposure method may be a selective exposure method using a mask 13, or a direct writing method in which a laser beam is scanned and irradiated along the pattern shape.
  • the core dry film 2 is developed using a developer such as an aqueous flux cleaner to remove the resin from the unexposed and uncured parts of the core dry film 2.
  • a core part 4 of a specified core pattern is formed on the surface of the underclad 3a, as shown in Figure 1(d).
  • R 1(a1) to R 36(a1) are each independently selected from the group consisting of hydrogen, an alkyl group having 1 to 10 carbon atoms, and an alkoxy group having 1 to 10 carbon atoms.
  • the resin composition for optical waveguide according to the third aspect of the present invention is the resin composition for optical waveguide according to the first or second aspect, in which the first epoxy compound (a1) includes one or more compounds having the structural formulas represented by the following formulas (1-1) and (2-1).
  • R 1(a2) to R 4(a2) are each independently an alkyl group having 1 to 10 carbon atoms
  • X 1 and X 2 are each independently selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, a group represented by formula (3A) below, and a group represented by formula (3B) below, and at least one of X 1 and X 2 is a group represented by formula (3A) or formula (3B) below.
  • R5 (a2) and R6 (a2) are bonds or alkylene groups having 1 to 6 carbon atoms.
  • R 7(a2 ) to R 12(a2 ) are each independently an alkyl group having 1 to 10 carbon atoms
  • X 3 and X 4 are each independently selected from the group consisting of an alkyl group having 1 to 10 carbon atoms, a group represented by formula (3A) above, and a group represented by formula (3B) above, at least one of X 3 and X 4 is a group represented by formula (3A) or formula (3B) above, and n is an integer of 1 to 4.
  • R 13(a2) and R 14(a2) for each repeating unit k are each independently selected from the group consisting of hydrogen, an alkyl group having 1 to 10 carbon atoms, a group represented by formula (3A) above, and a group represented by formula (3B) above, at least one of R 13(a2) and R 14(a2) for each repeating unit k is a group represented by formula (3A) or formula (3B) above, and k is an integer of 3 to 6.
  • the resin composition for optical waveguide according to the fifth aspect of the present invention is the resin composition for optical waveguide according to any one of the first to fourth aspects, in which the second epoxy compound (a2) includes one or more compounds having the structural formulas represented by the following formulas (3-1) and (5-1).
  • R 15(a2) and R 16(a2) are each independently selected from the group consisting of an alkyl group having 1 to 10 carbon atoms and an alkoxy group having 1 to 10 carbon atoms.
  • the dry film according to the sixth aspect of the present invention has a layer containing an uncured or semi-cured product of the resin composition for optical waveguide according to any one of the first to fifth aspects.
  • the optical waveguide according to the seventh aspect of the present invention is an optical waveguide having a core portion and a cladding portion that has a lower refractive index than the core portion and is formed so as to cover the core portion, and the core portion is formed using the resin composition for optical waveguides according to any one of the first to fifth aspects (or the dry film according to the sixth aspect).
  • various epoxy compounds having norbornane structures and epoxy compounds having silicone structures were used, and their content ratios were varied to prepare various resin compositions for optical waveguides, which were then used to manufacture dry films. Furthermore, the dry films manufactured were used to evaluate the film handleability, and the glass transition temperature Tg was measured for some of the dry films. Various waveguide samples were also manufactured, and the optical loss in the 1310 nm wavelength band before and after reflow processing was measured and evaluated.
  • DE102 is the first epoxy compound (a1) having the structural formula represented by the above formula (1-1).
  • DE103 is the first epoxy compound (a1) having the structural formula represented by the above formula (2-1).
  • EPICLON HP-7200 is the first epoxy compound (a1) having the structural formula represented by the following formula (6).
  • m is an integer from 0 to 5.
  • X-40-2669 is a second epoxy compound (a2) having the structural formula represented by formula (3-1) described above.
  • X-40-2678 is a second epoxy compound (a2) having the structural formula represented by formula (5-1) described above.

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Abstract

L'invention concerne une composition de résine pour un guide d'ondes optique qui contient un composé époxy (A). Le composé époxy (A) contient un premier composé époxy (a1) ayant une structure norbornane et un second composé époxy (a2) ayant une structure de silicium ayant de 1 à 6 Si. La teneur du second composé époxy (a2) est de 5 à 60 parties en masse pour 100 parties en masse du premier composé époxy (a1).
PCT/JP2024/043696 2023-12-27 2024-12-10 Composition de résine pour guide d'ondes optiques et film sec et guide d'ondes optique utilisant ladite composition Pending WO2025142472A1 (fr)

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Publication number Priority date Publication date Assignee Title
JP2019099651A (ja) * 2017-11-30 2019-06-24 三菱エンジニアリングプラスチックス株式会社 光学部材用ポリカーボネート樹脂組成物
JP2022161390A (ja) * 2021-04-09 2022-10-21 信越化学工業株式会社 感光性樹脂組成物、感光性樹脂皮膜、感光性ドライフィルム及びパターン形成方法
JP2023181911A (ja) * 2022-06-13 2023-12-25 株式会社Adeka 組成物及び硬化物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019099651A (ja) * 2017-11-30 2019-06-24 三菱エンジニアリングプラスチックス株式会社 光学部材用ポリカーボネート樹脂組成物
JP2022161390A (ja) * 2021-04-09 2022-10-21 信越化学工業株式会社 感光性樹脂組成物、感光性樹脂皮膜、感光性ドライフィルム及びパターン形成方法
JP2023181911A (ja) * 2022-06-13 2023-12-25 株式会社Adeka 組成物及び硬化物

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