WO2025142383A1 - Exciter module and method for manufacturing exciter module - Google Patents

Abstract

This exciter module comprises: a support member; a plurality of semiconductor elements; a resin member; and a first terminal (any of a power terminal, an output terminal, and a dummy terminal). The support member has an insulating substrate, and a conductor layer disposed on one side in the thickness direction of the insulating substrate. The plurality of semiconductor elements are bonded to the conductor layer. The resin member covers the plurality of semiconductor elements and the conductor layer. The first terminal protrudes from the resin member in a first direction. The plurality of semiconductor elements include a switching element and a diode.

Description

Exciter module and method for manufacturing the exciter module

This disclosure relates to an exciter module and a method for manufacturing an exciter module.

Traditionally, permanent magnet synchronous motors have been mainly used as motors for electric vehicles. However, there is a problem that the supply of rare earths used in permanent magnets is unstable. In the future, there is a possibility that wound magnetic field type synchronous motors that do not use rare earths will become more widespread. A wound magnetic field type synchronous motor generates a rotating magnetic field by passing a three-phase AC current through the stator winding, and generates magnetic flux in the rotor by passing an excitation current through the rotor winding. The magnetic flux generated in the rotor can be directly controlled by controlling the excitation current. Patent Document 1 discloses a rotating electric machine equipped with a motor and a control device. The motor includes a stator fixed to a housing and a rotor that rotates relative to the stator. The rotor includes a rotor core and a field winding. DC power is supplied to the field winding from a control board. The control board is equipped with field switching elements and the like. There is a demand for miniaturization of components installed in electric vehicles, and there is also a demand for miniaturization of the exciter that passes an excitation current through the rotor's field winding.

JP 2019-83661 A

[overview]
An object of the present disclosure is to provide an exciter module that is an improvement over conventional exciter modules. In particular, in view of the above circumstances, an object of the present disclosure is to provide an exciter module that modularizes an exciter that passes an excitation current through a field winding of a rotor of a wound-field-type synchronous motor.

The exciter module provided by the first aspect of the present disclosure includes an insulating substrate, a support member having a conductive layer disposed on one side of the insulating substrate in the thickness direction, a plurality of semiconductor elements bonded to the conductive layer, a resin member covering the semiconductor elements and the conductive layer, and a first terminal protruding from the resin member in a first direction perpendicular to the thickness direction. The plurality of semiconductor elements include a first switching element, a second switching element, a first diode, and a second diode.

The method for manufacturing an exciter module provided by the second aspect of the present disclosure includes the steps of forming a conductive layer on an insulating substrate, joining a lead frame to the conductive layer, joining a plurality of semiconductor elements to the conductive layer, forming a resin member that covers the plurality of semiconductor elements and the conductive layer, and cutting the lead frame.

Other features and advantages of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings.

FIG. 1 is a perspective view showing an exciter module according to a first embodiment of the present disclosure. FIG. 2 is a plan view of the exciter module shown in FIG. FIG. 3 is a plan view corresponding to FIG. 2, seen through the resin member. FIG. 4 is a right side view of the exciter module shown in FIG. FIG. 5 is a bottom view of the exciter module shown in FIG. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. FIG. 9 is a circuit diagram showing a circuit configuration of the exciter module shown in FIG. FIG. 10 is a block diagram for explaining an example of use of the exciter module shown in FIG. FIG. 11 is a flowchart showing an example of a method for manufacturing the exciter module shown in FIG. 12A to 12C are cross-sectional views showing steps according to an example of a method for manufacturing the exciter module shown in FIG. 13A to 13C are cross-sectional views showing steps according to an example of a method for manufacturing the exciter module shown in FIG. 14A to 14C are cross-sectional views showing steps according to an example of a method for manufacturing the exciter module shown in FIG. 15A to 15C are cross-sectional views showing steps according to an example of a method for manufacturing the exciter module shown in FIG. 16A to 16C are cross-sectional views showing steps according to an example of a method for manufacturing the exciter module shown in FIG. 17A to 17C are cross-sectional views showing steps according to an example of a method for manufacturing the exciter module shown in FIG. FIG. 18 is a cross-sectional view showing an exciter module according to a first modified example of the first embodiment of the present disclosure. FIG. 19 is a cross-sectional view showing an exciter module according to a second modified example of the first embodiment of the present disclosure. FIG. 20 is a perspective view showing an exciter module according to the second embodiment of the present disclosure. FIG. 21 is a plan view of the exciter module shown in FIG. 20, seen through the resin member. FIG. 22 is a cross-sectional view taken along line XXII-XXII in FIG. FIG. 23 is a plan view showing an exciter module according to a first modified example of the second embodiment of the present disclosure, seen through a resin member. FIG. 24 is a perspective view showing an exciter module according to a third embodiment of the present disclosure. FIG. 25 is a plan view of the exciter module shown in FIG. 24, seen through the resin member. FIG. 26 is a perspective view showing an exciter module according to a first modified example of the third embodiment of the present disclosure. FIG. 27 is a plan view of the exciter module shown in FIG. 26, seen through the resin member. FIG. 28 is a circuit diagram showing a circuit configuration of an exciter module according to a fourth embodiment of the present disclosure. FIG. 29 is a perspective view showing an exciter module according to a fifth embodiment of the present disclosure. FIG. 30 is a plan view of the exciter module shown in FIG. 29, seen through the resin member.

Detailed Description
A preferred embodiment of the exciter module of the present disclosure will be described below with reference to the drawings. In the following, identical or similar components are given the same reference numerals and repeated explanations will be omitted. Terms such as "first", "second", "third" and the like in this disclosure are used merely as labels and are not necessarily intended to assign any order to their objects.

In this disclosure, "an object A is formed on an object B" and "an object A is formed on (an object B)" include "an object A is formed directly on an object B" and "an object A is formed on an object B with another object interposed between the object A and the object B" unless otherwise specified. Similarly, "an object A is disposed on an object B" and "an object A is disposed on (an object B)" include "an object A is disposed directly on an object B" and "an object A is disposed on (an object B) with another object interposed between the object A and the object B" unless otherwise specified. Similarly, "an object A is located on (an object B)" includes "an object A is in contact with an object B and is located on (an object B)" and "an object A is located on (an object B) with another object interposed between the object A and the object B". In addition, "when viewed in a certain direction, an object A overlaps an object B" includes "an object A overlaps the entire object B" and "an object A overlaps a part of an object B" unless otherwise specified. In addition, "an object A (its material) contains a certain material C" includes "an object A (its material) is made of a certain material C" and "an object A (its material) is mainly composed of a certain material C." In addition, "a certain surface A faces a certain direction B (one side or the other side)" includes, unless otherwise specified, the angle of surface A with respect to direction B is not limited to 90°, and includes the case where surface A is inclined with respect to direction B. In addition, "a certain surface A is perpendicular to a certain surface B" includes, unless otherwise specified, the angle of surface A with respect to surface B is not limited to 90°, and includes the case where surface A is inclined with respect to surface B.

First embodiment:
1 to 10, an exciter module A10 according to a first embodiment of the present disclosure will be described. The exciter module A10 includes two switching elements 11, 12, four diodes 13 to 16, a thermistor 10, a support member 2, a plurality of terminals 3, a plurality of connection members 4, and a resin member 5. The plurality of terminals 3 include power terminals 31a, 31b, output terminals 32a, 32b, signal terminals 33a, 33b, and detection terminals 34a, 34b, 35a, 35b. The switching elements 11, 12 and the diodes 13 to 16 may be referred to as semiconductor elements 11 to 16, respectively.

FIG. 1 is a perspective view showing the exciter module A10. FIG. 2 is a plan view of the exciter module A10. FIG. 3 is a plan view corresponding to FIG. 2, and for ease of understanding, the outer shape of the resin member 5 is shown by an imaginary line (two-dot chain line) through the resin member 5. FIG. 4 is a right side view showing the exciter module A10. FIG. 5 is a bottom view showing the exciter module A10. FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. 3. FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 3. FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 3. FIG. 9 is a circuit diagram showing the circuit configuration of the exciter module A10. FIG. 10 is a block diagram for explaining an example of use of the exciter module shown in FIG. 1.

The shape of the part of the exciter module A10 covered with the resin member 5 when viewed in the thickness direction is rectangular. For ease of explanation, the thickness direction (direction when viewed in a plane) of the exciter module A10 is the thickness direction z, the protruding direction of the power terminals 31a, 31b and the output terminals 32a, 32b of the exciter module A10 perpendicular to the thickness direction z (the up-down direction in FIG. 2) is the first direction x, and the direction perpendicular to the thickness direction z and the first direction x (the left-right direction in FIG. 2) is the second direction y. In addition, one side of the thickness direction z (the right side in FIG. 4) is the first side z1, and the other side (the left side in FIG. 4) is the second side z2. One side of the first direction x (the upper side in FIG. 2 and FIG. 3) is the first side x1, and the other side (the lower side in FIG. 2 and FIG. 3) is the second side x2. One side of the second direction y (the right side in Figures 2 and 3) is the first side y1, and the other side (the left side in Figures 2 and 3) is the second side y2. Note that the shape and dimensions of the exciter module A10 are not limited.

The exciter module A10 is a module for exciting the rotor's field winding by passing a DC current through it in a winding magnetic field type synchronous motor. As shown in FIG. 10, the winding magnetic field type synchronous motor C includes a stator C1 and a rotor C2. The winding magnetic field type synchronous motor C generates a rotating magnetic field by passing three-phase AC current supplied from the three-phase inverter module B through the winding (not shown) of the stator C1. The winding magnetic field type synchronous motor C also generates magnetic flux by passing DC current supplied from the exciter module A10 through the field winding (not shown) of the rotor C2. The exciter module A10 controls the magnetic flux generated in the rotor C2 by controlling the DC current (excitation current) output in response to a drive signal input from a drive circuit (not shown). The three-phase inverter module B and the exciter module A10 receive DC power from the battery D, which is converted to an appropriate voltage by a transformer (not shown) and input to them.

The multiple semiconductor elements 11-16 are elements that perform the electrical functions of the exciter module A10. Each of the semiconductor elements 11-16 is constructed using a semiconductor material that is primarily made of, for example, Si (silicon). Note that the semiconductor material is not limited to Si, and may be SiC (silicon carbide), GaAs (gallium arsenide), GaN (gallium nitride), etc. The multiple semiconductor elements 11-16 are bonded to the conductor layer 22 (described below) of the support member 2 by a conductive bonding material (not shown). The conductive bonding material is, for example, solder, silver paste, or sintered metal.

In this embodiment, the switching elements 11 and 12 are IGBTs (Insulated Gate Bipolar Transistors). Note that the switching elements 11 and 12 are not limited to IGBTs and may be field effect transistors including MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors) and MISFETs (Metal-Insulator-Semiconductor FETs).

The switching element 11 has an element principal surface 11a and an element rear surface 11b. The element principal surface 11a and the element rear surface 11b face in opposite directions in the thickness direction z. The element principal surface 11a faces the second side z2. The element rear surface 11b faces the first side z1. The element rear surface 11b faces the support member 2.

The switching element 11 also has a first electrode 111, a second electrode 112, and a third electrode 113. The first electrode 111 and the second electrode 112 are arranged on the element main surface 11a. The first electrode 111 is larger than the second electrode 112 in a plan view. The third electrode 113 is arranged on the element back surface 11b. The third electrode 113 covers almost the entire surface of the element back surface 11b. In the switching element 11, which is an IGBT, the first electrode 111 is an emitter electrode from which a current is output, the second electrode 112 is a gate electrode to which a drive signal is input, and the third electrode 113 is a collector electrode to which a current is input. The third electrode 113 is conductively joined to a part of the conductor layer 22 of the support member 2 (the conductor layer 221 described later) via a conductive bonding material.

The switching element 12 has an element principal surface 12a and an element rear surface 12b. The element principal surface 12a and the element rear surface 12b face in opposite directions in the thickness direction z. The element principal surface 12a faces the second side z2. The element rear surface 12b faces the first side z1. The element rear surface 12b faces the support member 2.

The switching element 12 also has a first electrode 121, a second electrode 122, and a third electrode 123. The first electrode 121 and the second electrode 122 are arranged on the element main surface 12a. The first electrode 121 is larger than the second electrode 122 in a plan view. The third electrode 123 is arranged on the element back surface 12b. The third electrode 113 covers almost the entire element back surface 12b. In the switching element 12, which is an IGBT, the first electrode 121 is an emitter electrode, the second electrode 122 is a gate electrode, and the third electrode 123 is a collector electrode. The third electrode 123 is conductively joined to a part of the conductor layer 22 of the support member 2 (the conductor layer 224 described later) via a conductive bonding material.

Diodes 13 to 16 are diodes. Diodes 13 and 14 are connected in series in the reverse direction to switching elements 11 and 12, respectively. Diodes 13 and 14 are freewheel diodes for circulating current due to a flyback voltage generated in the coil of the motor, which is the load, when switching elements 11 and 12 are turned off. Diodes 15 and 16 are connected in reverse parallel to switching elements 11 and 12, respectively. Diodes 15 and 16 are freewheel diodes for preventing reverse voltage from being applied to switching elements 11 and 12 when switching elements 11 and 12 are turned off.

The diode 13 has an element principal surface 13a and an element rear surface 13b. The element principal surface 13a and the element rear surface 13b face opposite each other in the thickness direction z. The element principal surface 13a faces the second side z2. The element rear surface 13b faces the first side z1. The element rear surface 13b faces the support member 2. The diode 13 has an anode electrode 131 to which a current is input and a cathode electrode 132 to which a current is output. The anode electrode 131 is disposed on the element principal surface 13a. The cathode electrode 132 is disposed on the element rear surface 13b. The cathode electrode 132 is conductively joined to a part of the conductor layer 22 of the support member 2 (the conductor layer 223 described later) via a conductive bonding material.

The diode 14 has an element principal surface 14a and an element rear surface 14b. The element principal surface 14a and the element rear surface 14b face in opposite directions in the thickness direction z. The element principal surface 14a faces the second side z2. The element rear surface 14b faces the first side z1. The element rear surface 14b faces the support member 2. The diode 14 has an anode electrode 141 and a cathode electrode 142. The anode electrode 141 is disposed on the element principal surface 14a. The cathode electrode 142 is disposed on the element rear surface 14b. The cathode electrode 142 is conductively joined to a part of the conductor layer 22 of the support member 2 (the conductor layer 221 described below) via a conductive bonding material.

The diode 15 has an element principal surface 15a and an element rear surface 15b. The element principal surface 15a and the element rear surface 15b face in opposite directions in the thickness direction z. The element principal surface 15a faces the second side z2. The element rear surface 15b faces the first side z1. The element rear surface 15b faces the support member 2. The diode 15 has an anode electrode 151 and a cathode electrode 152. The anode electrode 151 is disposed on the element principal surface 15a. The cathode electrode 152 is disposed on the element rear surface 15b. The cathode electrode 152 is conductively joined to a part of the conductor layer 22 of the support member 2 (the conductor layer 221 described below) via a conductive bonding material.

The diode 16 has a main surface 16a and a back surface 16b. The main surface 16a and the back surface 16b face opposite each other in the thickness direction z. The main surface 16a faces the second side z2. The back surface 16b faces the first side z1. The back surface 16b faces the support member 2. The diode 16 has an anode electrode 161 and a cathode electrode 162. The anode electrode 161 is disposed on the main surface 16a. The cathode electrode 162 is disposed on the back surface 16b. The cathode electrode 162 is conductively joined to a part of the conductor layer 22 of the support member 2 (the conductor layer 224 described later) via a conductive bonding material.

The thermistor 10 is disposed in the center of the support member 2 when viewed in the thickness direction z, and is used as a temperature detection sensor for the exciter module A10. One electrode of the thermistor 10 is conductively joined to a part of the conductor layer 22 of the support member 2 (conductor layer 227a described below) via a conductive bonding material, and the other electrode is conductively joined to a part of the conductor layer 22 of the support member 2 (conductor layer 227b described below) via a conductive bonding material. Note that the exciter module A10 does not need to include the thermistor 10.

The support member 2 is a member that supports the multiple semiconductor elements 11-16, and also forms a conductive path between each of the semiconductor elements 11-16 and the multiple terminals 3. In this embodiment, the support member 2 is composed of a DBC (Direct Bonded Copper) substrate. The support member 2 includes an insulating substrate 21, a conductive layer 22, and a backside metal layer 23.

The insulating substrate 21 is, for example, flat and electrically insulating. The constituent material of the insulating substrate 21 is, for example, ceramics with excellent thermal conductivity, and in this embodiment, is Al2O3 (aluminum oxide). The constituent material of the insulating substrate 21 is not limited, and may be other ceramics such as AlN (aluminum nitride) and SiN (silicon nitride). The constituent material of the insulating substrate 21 is also not limited to ceramics, and may be Si or synthetic resin. The constituent material of the insulating substrate 21 may be any material that is insulating and can withstand the heat generated by the semiconductor elements 11-16.

The insulating substrate 21 has a principal surface 211 and a rear surface 212. The principal surface 211 and the rear surface 212 face opposite each other in the thickness direction z. The principal surface 211 faces the second side z2. The rear surface 212 faces the first side z1.

The conductive layer 22 is disposed on the main surface 211 of the insulating substrate 21. The constituent material of the conductive layer 22 is, for example, a metal containing Cu. However, the constituent material is not limited. The conductive layer 22 does not protrude from the insulating substrate 21 when viewed in the thickness direction z, but is contained within the insulating substrate 21 when viewed in the thickness direction z. Furthermore, the conductive layer 22 is entirely covered by the resin member 5 and is not exposed from the resin member 5.

The conductive layer 22 includes conductive layers 221-224, 225a, 225b, 226a, 226b, 227a, and 227b. As shown in FIG. 3, the conductive layers 221-224, 225a, 225b, 226a, 226b, 227a, and 227b are spaced apart from one another. Note that in FIG. 3, the conductive layer 22 is hatched for ease of understanding.

The conductor layer 221 is disposed on the main surface 211 of the insulating substrate 21 on the second side y2 in the second direction y of the first side x1 in the first direction x, and extends in the first direction x. The switching element 11 and the diodes 14 and 15 are joined to the conductor layer 221, and a part of the power terminal 31a is joined to the conductor layer 221. The conductor layer 221 has a recess recessed from the second side y2 to the first side y1 in the second direction y. As shown in FIG. 6, the conductor layer 221 is electrically connected to the third electrode 113 (collector electrode) of the switching element 11, the cathode electrode 142 of the diode 14, and the cathode electrode 152 of the diode 15. In other words, the third electrode 113 (collector electrode) of the switching element 11, the cathode electrode 142 of the diode 14, and the cathode electrode 152 of the diode 15 are electrically connected via the conductor layer 221.

The conductive layer 222 is disposed on the main surface 211 of the insulating substrate 21 on a first side x1 in the first direction x and a first side y1 in the second direction y. A part of the power terminal 31b is joined to the conductive layer 222.

The conductor layer 223 is disposed on the main surface 211 of the insulating substrate 21 on the second side x2 in the first direction x and the second side y2 in the second direction y. The conductor layer 223 is joined to the diode 13 and a part of the output terminal 32a. The conductor layer 223 is electrically connected to the cathode electrode 132 of the diode 13, as shown in FIG. 7.

The conductor layer 224 is disposed on the main surface 211 of the insulating substrate 21 on the first side y1 in the second direction y of the second side x2 in the first direction x, and extends in the first direction x. The switching element 12 and the diode 16 are joined to the conductor layer 224, and a part of the output terminal 32b is also joined to the conductor layer 224. The conductor layer 224 has a recess recessed from the first side y1 to the second side y2 in the second direction y. As shown in Figures 7 and 8, the conductor layer 224 is electrically connected to the third electrode 123 (collector electrode) of the switching element 12 and the cathode electrode 162 of the diode 16. In other words, the third electrode 123 (collector electrode) of the switching element 12 and the cathode electrode 162 of the diode 16 are electrically connected via the conductor layer 224.

The conductive layers 225a and 225b are arranged side by side in the first direction x in the recess of the conductive layer 221 on the main surface 211 of the insulating substrate 21. A signal terminal 33a is joined to the conductive layer 225a. A detection terminal 34a is joined to the conductive layer 225b.

The conductive layers 226a and 226b are arranged side by side in the first direction x in the recess of the conductive layer 224 on the main surface 211 of the insulating substrate 21. The detection terminal 34b is joined to the conductive layer 226a. The signal terminal 33b is joined to the conductive layer 226b.

The conductive layers 227a and 227b are arranged side by side in the first direction x, surrounded by the conductive layers 221, 223, and 224, approximately in the center on the main surface 211 of the insulating substrate 21. A detection terminal 35a is joined to the conductive layer 227a. A detection terminal 35b is joined to the conductive layer 227b. Different electrodes of the thermistor 10 are joined to the conductive layers 227a and 227b, respectively. In other words, the thermistor 10 is arranged across the conductive layers 227a and 227b.

The arrangement and shape of each of the conductive layers 221-224, 225a, 225b, 226a, 226b, 227a, and 227b are not limited to those described above, but are designed appropriately depending on the arrangement position of each terminal 3, etc.

The back metal layer 23 is disposed on the back surface 212 of the insulating substrate 21. The constituent material of the back metal layer 23 is, for example, a metal containing Cu. However, the constituent material is not limited. The back metal layer 23 does not protrude from the insulating substrate 21 when viewed in the thickness direction z, but is contained within the insulating substrate 21 when viewed in the thickness direction z. As shown in Figures 5 to 7, the surface of the back metal layer 23 facing the first side z1 in the thickness direction z is exposed from the resin member 5.

The support member 2 is not limited to being made of a DBC substrate, and the method of forming the support member 2 is not limited. The support member 2 may be an insulating substrate 21 on which a conductor layer 22 and a back metal layer 23 are formed, for example, by plating.

Each terminal 3 is joined to the conductive layer 22 inside the resin member 5. A portion of each terminal 3 is exposed from the resin member 5. Each terminal 3 serves as a conduction path for the input/output current or the input/output signal of the exciter module A10.

The power terminals 31a, 31b and the output terminals 32a, 32b each protrude from the insulating substrate 21 when viewed in the thickness direction z, and protrude from the resin member 5 in the first direction x. The power terminals 31a, 31b and the output terminals 32a, 32b are each a plate-shaped member and are formed from the same lead frame. The lead frame is made of metal, preferably either Cu or Ni, or an alloy thereof, or 42 alloy. The power terminals 31a, 31b are terminals for applying a DC voltage to the exciter module A10. The output terminals 32a, 32b are terminals for outputting a DC voltage from the exciter module A10.

The power terminal 31a is one of the terminals for applying a DC voltage and is a positive terminal. The power terminal 31a is conductively joined to the conductor layer 221 via a conductive bonding material. The joining method is not limited and may be laser joining or ultrasonic joining. The power terminal 31a is conductively connected to the third electrode 113 (collector electrode) of the switching element 11, the cathode electrode 142 of the diode 14, and the cathode electrode 152 of the diode 15 via the conductor layer 221. The power terminal 31a is partially covered by the resin member 5 and partially protrudes from the resin member 5 to the first side x1 in the first direction x, extending in the first direction x.

The power terminal 31b is the other terminal for applying a DC voltage and is a negative terminal. The power terminal 31b is conductively joined to the conductor layer 222 via a conductive bonding material. The joining method is not limited. The power terminal 31b is conductively connected to the first electrode 121 (emitter electrode) of the switching element 12 via the conductor layer 222 and a connection member 4 (connection member 45 described later). The power terminal 31b is partially covered by a resin member 5 and partially protrudes from the resin member 5 to the first side x1 in the first direction x, extending in the first direction x.

The output terminal 32a is one of the terminals for outputting the excitation current and is a positive terminal. The output terminal 32a is conductively joined to the conductor layer 223 via a conductive bonding material. The joining method is not limited. The output terminal 32a is conductive to the cathode electrode 132 of the diode 13 via the conductor layer 223. The output terminal 32a is partially covered by the resin member 5 and partially protrudes from the resin member 5 to the second side x2 in the first direction x, extending in the first direction x.

The output terminal 32b is the other terminal for outputting the excitation current and is a negative terminal. The output terminal 32b is conductively joined to the conductor layer 224 via a conductive bonding material. The joining method is not limited. The output terminal 32b is conductively connected to the third electrode 123 (collector electrode) of the switching element 12 and the cathode electrode 162 of the diode 16 via the conductor layer 224. The output terminal 32b is partially covered by the resin member 5 and partially protrudes from the resin member 5 to the second side x2 in the first direction x, extending in the first direction x.

The signal terminals 33a, 33b and the detection terminals 34a, 34b, 35a, 35b are all press-fit terminals that protrude from the resin member 5 to the second side z2 in the thickness direction z. As shown in FIG. 8, the signal terminals 33a, 33b and the detection terminals 34a, 34b, 35a, 35b each include a holder 3a and a metal pin 3b. The holder 3a is made of a conductive material and has a cylindrical shape extending in the thickness direction z. The holder 3a is joined to the conductive layer 22 via a conductive bonding material. The joining method is not limited. The metal pin 3b is made of a conductive material and is a rod-shaped member extending in the thickness direction z. The metal pin 3b is supported by being pressed into the holder 3a along its inner circumferential surface. The metal pin 3b is electrically connected to the conductive layer 22 via the holder 3a and the conductive bonding material.

The signal terminal 33a is a terminal to which a drive signal for driving the switching element 11 is input. The signal terminal 33a is electrically connected to the second electrode 112 (gate electrode) of the switching element 11 via the conductive layer 225a and the connection member 4 (connection member 41a described later). A drive signal for controlling the on/off of the switching element 11 is input to the signal terminal 33a. For example, a drive circuit is connected to the signal terminal 33a. The drive circuit generates a drive signal that controls the switching operation of the switching element 11. A drive signal is input from the drive circuit to the signal terminal 33a.

The signal terminal 33b is a terminal to which a drive signal for driving the switching element 12 is input. The signal terminal 33b is electrically connected to the second electrode 122 (gate electrode) of the switching element 12 via the conductive layer 226b and the connection member 4 (connection member 41b described later). A drive signal for controlling the on/off of the switching element 12 is input to the signal terminal 33b. For example, a drive circuit is connected to the signal terminal 33b. The drive circuit generates a drive signal that controls the switching operation of the switching element 12. The drive signal is input to the signal terminal 33b from the drive circuit. The drive signal input to the signal terminal 33b may be the same as the drive signal input to the signal terminal 33a, or may be different. For example, drive signals with a phase shift between them may be input to the signal terminals 33a and 33b.

The detection terminal 34a is an emitter sense terminal of the switching element 11. The detection terminal 34a is electrically connected to the first electrode 111 (emitter electrode) of the switching element 11 via the conductive layer 225b and the connection member 4 (connection member 42a described later). A drive circuit, for example, is connected to the detection terminal 34a. The voltage applied to the detection terminal 34a is input to the drive circuit as a feedback signal.

The detection terminal 34b is an emitter sense terminal of the switching element 12. The detection terminal 34b is electrically connected to the first electrode 121 (emitter electrode) of the switching element 12 via the conductive layer 226a and the connection member 4 (connection member 42b described later). A drive circuit, for example, is connected to the detection terminal 34b. The voltage applied to the detection terminal 34b is input to the drive circuit as a feedback signal.

Detection terminals 35a and 35b are temperature detection terminals of the exciter module A10. Detection terminal 35a is electrically connected to one electrode of thermistor 10 via conductive layer 227a. Detection terminal 35b is electrically connected to the other electrode of thermistor 10 via conductive layer 227b. A drive circuit, for example, is connected to detection terminals 35a and 35b. The drive circuit detects overheating abnormality based on the potential difference between detection terminals 35a and 35b, i.e., the potential difference between the two electrodes of thermistor 10, which is a potential difference corresponding to the ambient temperature of thermistor 10. When the detected potential difference becomes equal to or greater than the potential difference corresponding to the threshold temperature, the drive circuit stops outputting the drive signal, thereby stopping the drive of exciter module A10.

The signal terminal 33a and the detection terminal 34a are arranged side by side in the first direction x. The signal terminal 33b and the detection terminal 34b are arranged side by side in the first direction x. The detection terminals 35a and 35b are arranged side by side in the first direction x. The arrangement of the signal terminals 33a and 33b and the detection terminals 34a, 34b, 35a and 35b is not limited.

Each of the multiple connection members 4 provides electrical continuity between two separated portions. Each connection member 4 is a so-called bonding wire. The constituent material of each connection member 4 is, for example, Al, Au, Cu, or an alloy containing any of these. The multiple connection members 4 include connection members 41a, 41b, 42a, 42b, 43a, 43b, and 44 to 46.

The connection member 41a has one end joined to the second electrode 112 (gate electrode) of the switching element 11, and the other end joined to the conductive layer 225a. The connection member 41a provides electrical continuity between the second electrode 112 and the conductive layer 225a. The connection member 41b has one end joined to the second electrode 122 (gate electrode) of the switching element 12, and the other end joined to the conductive layer 226b. The connection member 41b provides electrical continuity between the second electrode 122 and the conductive layer 226b.

The connection member 42a has one end joined to the first electrode 111 (emitter electrode) of the switching element 11, and the other end joined to the conductive layer 225b. The connection member 42a provides electrical continuity between the first electrode 111 and the conductive layer 225b. The connection member 42b has one end joined to the first electrode 121 (emitter electrode) of the switching element 12, and the other end joined to the conductive layer 226a. The connection member 42b provides electrical continuity between the first electrode 121 and the conductive layer 226a.

The connection member 43a has one end joined to the first electrode 111 (emitter electrode) of the switching element 11, and the other end joined to the anode electrode 151 of the diode 15. The connection member 43a provides electrical continuity between the first electrode 111 and the anode electrode 151. The connection member 43b has one end joined to the first electrode 121 (emitter electrode) of the switching element 12, and the other end joined to the anode electrode 161 of the diode 16. The connection member 43b provides electrical continuity between the first electrode 121 and the anode electrode 161.

One end of the connection member 44 is joined to the first electrode 111 (emitter electrode) of the switching element 11, and the other end is joined to the conductive layer 223. The connection member 44 provides electrical continuity between the first electrode 111 and the conductive layer 223.

One end of the connection member 45 is joined to the first electrode 121 (emitter electrode) of the switching element 12, and the other end is joined to the conductive layer 222. The connection member 45 provides electrical continuity between the first electrode 121 and the conductive layer 222.

One end of the connection member 46 is joined to the first electrode 121 (emitter electrode) of the switching element 12, and the other end is joined to the anode electrode 131 of the diode 13. The connection member 46 provides electrical continuity between the first electrode 121 and the anode electrode 131.

One end of the connection member 47 is joined to the anode electrode 141 of the diode 14, and the other end is joined to the conductive layer 224. The connection member 47 provides electrical continuity between the anode electrode 141 and the conductive layer 224.

The resin member 5 is an electrically insulating semiconductor encapsulant. The resin member 5 covers the entire semiconductor elements 11-16, insulating substrate 21, conductive layer 22, and multiple connection members 4, as well as a portion of each terminal 3. The constituent material of the resin member 5 is, for example, epoxy resin. Note that there are no limitations on the constituent material of the resin member 5. The resin member 5 is formed, for example, by transfer molding using a mold. Note that there are no limitations on the method of forming the resin member 5. The resin member 5 has a resin main surface 51, a resin back surface 52, and multiple resin side surfaces 531-534.

The resin main surface 51 and the resin back surface 52 face opposite each other in the thickness direction z. The resin main surface 51 faces the second side z2, and the resin back surface 52 faces the first side z1. The back surface metal layer 23 is exposed from the resin back surface 52, and the resin back surface 52 and the surface of the back surface metal layer 23 facing the first side z1 in the thickness direction z are flush with each other. Each of the multiple resin side surfaces 531 to 534 is connected to both the resin main surface 51 and the resin back surface 52 and is sandwiched between them. As shown in FIG. 2, the two resin side surfaces 531, 532 face opposite each other in the first direction x. The resin side surface 531 is a surface that is arranged on the first side x1 in the first direction x and faces the first side x1. The resin side surface 532 is a surface that is arranged on the second side x2 in the first direction x and faces the second side x2. The two resin side surfaces 533, 534 face in opposite directions in the second direction y. The resin side surface 533 is a surface that is disposed on a first side y1 in the second direction y and faces the first side y1. The resin side surface 534 is a surface that is disposed on a second side y2 in the second direction y and faces the second side y2.

The resin side surfaces 531 to 534 are each connected to the resin main surface 51 and have surfaces that are inclined so as to approach each other toward the resin main surface 51. In other words, the portion of the resin member 5 that is surrounded by the inclined surfaces that are connected to these resin main surfaces 51 has a tapered shape in which the cross-sectional area in the xy plane decreases toward the resin main surface 51. The resin side surfaces 531 to 534 are each connected to the resin back surface 52 and have surfaces that are inclined so as to approach each other toward the resin back surface 52. In other words, the portion of the resin member 5 that is surrounded by the inclined surfaces that are connected to these resin back surfaces 52 has a tapered shape in which the cross-sectional area in the xy plane decreases toward the resin back surface 52. Note that the shapes of the resin member 5 shown in Figures 1 to 8 are examples. The shape of the resin member 5 is not limited to the exemplified shapes.

The circuit configuration of the exciter module A10 is as shown in the circuit diagram in Figure 9.

The first electrode 111 (emitter electrode) of the switching element 11 and the cathode electrode 132 of the diode 13 are electrically connected via the connection member 44 and the conductive layer 222. The third electrode 123 (collector electrode) of the switching element 12 and the anode electrode 141 of the diode 14 are electrically connected via the conductive layer 224 and the connection member 47. The third electrode 113 (collector electrode) of the switching element 11 and the cathode electrode 142 of the diode 14 are electrically connected via the conductive layer 221. The anode electrode 131 of the diode 13 and the first electrode 121 (emitter electrode) of the switching element 12 are electrically connected via the connection member 46. The diode 15 is connected in reverse parallel to the switching element 11 by the connection member 43a and the conductive layer 221. The diode 16 is connected in reverse parallel to the switching element 12 by the connection member 43b and the conductive layer 224.

A power terminal 31a is joined to the conductor layer 221, which electrically connects the third electrode 113 (collector electrode) of the switching element 11 and the cathode electrode 142 of the diode 14. The first electrode 121 (emitter electrode) of the switching element 12, which electrically connects the anode electrode 131 of the diode 13, is electrically connected to the conductor layer 222 via a connecting member 45, and a power terminal 31b is joined to the conductor layer 222. An output terminal 32a is joined to the conductor layer 223, which electrically connects the first electrode 111 (emitter electrode) of the switching element 11 and the cathode electrode 132 of the diode 13. An output terminal 32b is joined to the conductor layer 224, which electrically connects the third electrode 123 (collector electrode) of the switching element 12 and the anode electrode 141 of the diode 14.

The second electrode 112 (gate electrode) of the switching element 11 is conductively connected to the signal terminal 33a via the connection member 41a and the conductive layer 225a. The second electrode 122 (gate electrode) of the switching element 12 is conductively connected to the signal terminal 33b via the connection member 41b and the conductive layer 226b. The first electrode 111 (emitter electrode) of the switching element 11 is conductively connected to the detection terminal 34a via the connection member 42a and the conductive layer 225b. The first electrode 121 (emitter electrode) of the switching element 12 is conductively connected to the detection terminal 34b via the connection member 42b and the conductive layer 226a.

In the exciter module A10, a DC voltage is applied from the outside between the power terminals 31a and 31b, and a voltage is output between the output terminals 32a and 32b. The drive circuit receives a feedback signal from the detection terminals 34a and 34b, and outputs a drive signal to the signal terminals 33a and 33b. The exciter module A10 outputs a DC current controlled according to the drive signal input from the drive circuit as an excitation current to the field winding of the rotor C2 of the wound magnetic field type synchronous motor C, which is connected between the output terminals 32a and 32b.

Furthermore, one electrode of the thermistor 10 is conductively connected to the detection terminal 35a via the conductive layer 227a. The other electrode of the thermistor 10 is conductively connected to the detection terminal 35b via the conductive layer 227b. The drive circuit detects an overheating abnormality based on the potential difference between the detection terminals 35a and 35b.

Next, an example of a method for manufacturing the exciter module A10 will be described below with reference to Figures 11 to 17. Note that the manufacturing method described below is one means for realizing the exciter module A10, and is not limited to this. Figure 11 is a flowchart showing an example of a method for manufacturing the exciter module A10. Figures 12 to 17 are diagrams showing steps in an example of a method for manufacturing the exciter module A10. Figures 12 to 17 are cross-sectional views, and correspond to Figure 6. Note that the first direction x, second direction y, and thickness direction z shown in Figures 12 to 17 indicate the same directions as Figures 1 to 8.

As shown in FIG. 11, the manufacturing method for the exciter module A10 includes a support member forming process (S1), a lead frame joining process (S2), a semiconductor element mounting process (S3), a wire connection process (S4), a resin forming process (S5), a metal pin insertion process (S6), and a frame cutting process (S7).

The support member forming process (S1) is a process for forming the support member 2. In the support member forming process, the Cu foil on one side of the DBC substrate, which has Cu foil bonded to both sides of the insulating substrate 91, is patterned to form a conductor layer 22 on the insulating substrate 91. The Cu foil on the other side of the DBC substrate is patterned to form a back metal layer 23 on the insulating substrate 91. The conductor layer 22 and the back metal layer 23 may be formed on both sides of the insulating substrate 91 by plating or the like. Next, the DBC substrate is cut to form the support member 2 in which the conductor layer 22 is disposed on the main surface 211 of the insulating substrate 21 and the back metal layer 23 is disposed on the back surface 212 (see FIG. 12).

In the lead frame bonding process (S2), first, a lead frame 94 that will become the power terminals 31a, 31b and the output terminals 32a, 32b is prepared. The lead frame 94 includes the parts that will become the power terminals 31a, 31b and the output terminals 32a, 32b, and further has a frame to which the power terminals 31a, 31b and the output terminals 32a, 32b are connected. The shape of the lead frame 94 is not limited in any way. Next, a conductive bonding paste is placed at the positions of the conductor layer 22 where the power terminals 31a, 31b and the output terminals 32a, 32b are bonded, and the parts of the lead frame 94 that will become the power terminals 31a, 31b and the output terminals 32a, 32b are bonded to the conductor layer 22 as shown in FIG. 13. For example, the parts of the lead frame 94 that will become the power terminals 31a are bonded to the conductor layer 221, and the parts of the lead frame 94 that will become the output terminals 32a are bonded to the conductor layer 223. The method for joining the lead frame 94 is not limited.

In the semiconductor element mounting process (S3), first, a conductive bonding paste is placed in the area of the conductor layer 22 where the semiconductor elements 11 to 16 are to be placed. Next, as shown in FIG. 14, the semiconductor elements 11 to 16 are attached to the conductive bonding paste, heated, and then cooled. As a result, the semiconductor elements 11 to 16 are bonded to the conductor layer 22 via the conductive bonding material. For example, the semiconductor elements 11, 14, and 15 are bonded to the conductor layer 221. At this time, the holders 3a of the signal terminals 33a and 33b and the detection terminals 34a, 34b, 35a, and 35b are also bonded to the conductor layer 22 via the conductive bonding material.

In the wire connection step (S4), multiple connection members 4 are connected. For example, as shown in FIG. 15, the connection member 43a is formed to connect the first electrode 111 of the switching element 11 and the anode electrode 151 of the diode 15.

In the resin forming process (S5), a part of the lead frame 94, a part of the support member 2, the semiconductor elements 11 to 16, and the multiple connection members 4 are enclosed in a mold. Next, a liquid resin material is injected into the space defined by the mold. Next, the resin material is hardened to obtain the resin member 5 (see FIG. 16).

In the metal pin insertion process (S6), as shown in FIG. 17, each metal pin 3b of the signal terminals 33a, 33b and the detection terminals 34a, 34b, 35a, 35b is individually inserted into the corresponding holder 3a.

In the frame cutting process (S7), as shown in FIG. 17, the lead frame 94 is cut at appropriate locations of the portions exposed from the resin member 5. This separates the power terminals 31a, 31b and the output terminals 32a, 32b from each other. In this manner, the exciter module A10 described above is obtained.

Next, we will explain the effects of the exciter module A10.

In this embodiment, the exciter module A10 includes two switching elements 11, 12, four diodes 13 to 16, a thermistor 10, a support member 2, multiple terminals 3, multiple connection members 4, and a resin member 5. The exciter module A10 configures an exciter circuit in which the two switching elements 11, 12 and the four diodes 13 to 16 are connected as shown in the circuit diagram in FIG. 9, with the conductive layer 22 arranged on the main surface 211 of the insulating substrate 21 and the multiple connection members 4 serving as conduction paths. In other words, the exciter module A10 is a modularized exciter, and is smaller in size than conventional exciters.

Furthermore, according to this embodiment, the power terminals 31a, 31b and the output terminals 32a, 32b are joined as part of the same lead frame 94 in the lead frame joining step (S2) in the manufacturing process. Therefore, the exciter module A10 is easy to handle during manufacturing. Also, since multiple exciter modules A10 can be manufactured using a common lead frame 94, manufacturing efficiency is improved.

Furthermore, in this embodiment, the power terminals 31a, 31b and the output terminals 32a, 32b are plate-shaped members made of lead frames. Therefore, the power terminals 31a, 31b and the output terminals 32a, 32b are capable of passing a larger current than when they are made of press-fit terminals with a smaller cross-sectional area than the lead frames.

Furthermore, according to this embodiment, the surface of the back metal layer 23 of the support member 2 facing the first side z1 in the thickness direction z is exposed from the resin member 5. This allows the exciter module A10 to improve its heat dissipation efficiency. Furthermore, the exciter module A10 can further improve its heat dissipation effect by attaching a heat dissipation member or cooler to the exposed surface of the back metal layer 23.

In this embodiment, the case where all of the multiple connection members 4 are bonding wires has been described, but this is not limited to the case. Instead of any of the multiple connection members 4, a connection member other than a bonding wire (such as a metal plate member or metal ribbon) may be used.

In addition, in this embodiment, the case where the power terminals 31a, 31b and the output terminals 32a, 32b are all joined to the conductive layer 22 has been described, but this is not limited to the case. Either the power terminals 31a, 31b or the output terminals 32a, 32b may be joined to the insulating substrate 21 at a distance from the conductive layer 22. In this case, the terminal is conductively connected to the conductive layer 22 by a connecting member such as a bonding wire.

In addition, in this embodiment, the signal terminals 33a, 33b and the detection terminals 34a, 34b, 35a, 35b are all press-fit terminals, but this is not limited to the above. Any of the signal terminals 33a, 33b and the detection terminals 34a, 34b, 35a, 35b may be formed from the same lead frame as the power terminals 31a, 31b and the output terminals 32a, 32b.

FIGS. 18 and 19 show modified examples of the support member 2 according to the first embodiment. In these figures, elements that are the same as or similar to those in the above embodiment are given the same reference numerals as in the above embodiment, and redundant explanations will be omitted.

First modified example:
Fig. 18 is a diagram for explaining an exciter module A11 according to a first modified example of the first embodiment. Fig. 18 is a cross-sectional view showing the exciter module A11 and corresponds to Fig. 6. The exciter module A11 differs from the exciter module A10 in that the support member 2 is entirely covered with the resin member 5.

Second Modification:
Fig. 19 is a diagram for explaining an exciter module A12 according to a second modified example of the first embodiment. Fig. 19 is a cross-sectional view showing the exciter module A12, and corresponds to Fig. 6. The exciter module A12 differs from the exciter module A10 in that the support member 2 does not include a back surface metal layer 23. Note that the back surface 212 of the insulating substrate 21 may be exposed from the resin back surface 52 of the resin member 5.

FIGS. 20 to 30 show other embodiments of the present disclosure. In these figures, elements that are the same as or similar to those in the above embodiment are given the same reference numerals as in the above embodiment, and duplicated descriptions will be omitted.

Second embodiment:
20 to 22 are diagrams for explaining the exciter module A20 according to the second embodiment of the present disclosure. FIG. 20 is a perspective view showing the exciter module A20, and corresponds to FIG. 1. FIG. 21 is a plan view showing the exciter module A20, with the resin member 5 being seen through. FIG. 21 is a diagram corresponding to FIG. 3. FIG. 22 is a cross-sectional view taken along line XXII-XXII in FIG. 21. The exciter module A20 according to this embodiment differs from the exciter module A10 according to the first embodiment in that the power terminals and the output terminals are configured as press-fit terminals. The configuration and operation of the other parts of this embodiment are similar to those of the first embodiment. Note that the respective parts of the first embodiment and the modified examples described above may be combined in any manner.

The exciter module A20 in this embodiment has a plurality of power terminals 36a, 36b and output terminals 36c, 36d, instead of the power terminals 31a, 31b and the output terminals 32a, 32b. The power terminals 36a, 36b and the output terminals 36c, 36d are all press-fit terminals, and protrude from the resin member 5 to the second side z2 in the thickness direction z. The plurality of power terminals 36a are one terminal for applying a DC voltage, and are positive terminals. The plurality of power terminals 36a are conductively joined to the conductor layer 221 in the second direction y. The plurality of power terminals 36b are the other terminal for applying a DC voltage, and are negative terminals. The plurality of power terminals 36b are conductively joined to the conductor layer 222 in the second direction y. The plurality of output terminals 36c are one terminal for outputting an excitation current, and are positive terminals. The multiple output terminals 36c are lined up in the second direction y and conductively joined to the conductive layer 223. The multiple output terminals 36d are the other terminals for outputting the excitation current and are negative terminals. The multiple output terminals 36d are lined up in the second direction y and conductively joined to the conductive layer 224.

The excitation current passed through the field winding of the rotor of a wound magnetic field type synchronous motor is sufficiently small compared to the three-phase AC current passed through the stator winding. Therefore, even if the power terminals 36a, 36b and the output terminals 36c, 36d are press-fit terminals with smaller cross-sectional areas than the power terminals 31a, 31b and the output terminals 32a, 32b made of lead frames, it is possible to pass current by arranging multiple terminals of each. In this embodiment, the exciter module A20 has four power terminals 36a, 36b and four output terminals 36c, 36d. The number of power terminals 36a, 36b and output terminals 36c, 36d is not limited.

The conductor layer 22 in this embodiment further includes conductor layers 228a, 228b, 228c, and 228d. The conductor layer 228a is disposed on a first side x1 of the conductor layer 221 in the first direction x, and extends in the second direction y. The conductor layer 228b is disposed on a first side x1 of the conductor layer 222 in the first direction x, and extends in the second direction y. The conductor layer 228c is disposed on a second side x2 of the conductor layer 223 in the first direction x, and extends in the second direction y. The conductor layer 228d is disposed on a second side x2 of the conductor layer 224 in the first direction x, and extends in the second direction y. None of the conductor layers 228a, 228b, 228c, and 228d is electrically connected to the semiconductor elements 11 to 16 or the thermistor 10.

The exciter module A20 in this embodiment further includes dummy terminals 37a, 37b, 38a, and 38b. The dummy terminals 37a, 37b, 38a, and 38b each protrude from the insulating substrate 21 when viewed in the thickness direction z, and protrude from the resin member 5 in the first direction x. The dummy terminals 37a, 37b, 38a, and 38b are each a plate-shaped member and are formed from the same lead frame. The dummy terminals 37a, 37b, 38a, and 38b are each conductively joined to the conductor layers 228a, 228b, 228c, and 228d via a conductive bonding material. The bonding method is not limited. None of the dummy terminals 37a, 37b, 38a, and 38b are conductive to any of the semiconductor elements 11 to 16 or the thermistor 10. Dummy terminals 37a, 37b, 38a, and 38b are the remaining parts that remain after cutting the lead frame during a manufacturing process that uses a lead frame.

In this embodiment, the exciter module A20 also comprises an exciter circuit in which two switching elements 11, 12 and four diodes 13 to 16 are connected as shown in the circuit diagram in FIG. 9, with the conductive layer 22 arranged on the main surface 211 of the insulating substrate 21 and multiple connection members 4 as the conductive paths. In other words, the exciter module A20 is a modularized exciter, and is smaller than conventional exciters.

Furthermore, according to this embodiment, the dummy terminals 37a, 37b, 38a, and 38b are joined as part of the same lead frame in the lead frame joining step (S2) in the manufacturing process. Therefore, the exciter module A20 is easy to handle during manufacturing. In addition, multiple exciter modules A20 can be manufactured using a common lead frame, improving manufacturing efficiency.

In addition, the exciter module A20 has a configuration in common with the exciter module A10, and thus achieves the same effects as the exciter module A10. Furthermore, according to this embodiment, the multiple power terminals 36a, 36b and the output terminals 36c, 36d are all press-fit terminals and protrude from the resin member 5 to the second side z2 in the thickness direction z. Therefore, the exciter module A20 can input the power supply and output the excitation current using only press-fit terminals.

First modified example:
Fig. 23 is a diagram for explaining an exciter module A21 according to a first modified example of the second embodiment. Fig. 23 is a plan view showing the exciter module A21, and is seen through the resin member 5. Fig. 23 is a diagram corresponding to Fig. 21. In Fig. 23, elements that are the same as or similar to those in the above embodiment are given the same reference numerals as those in the above embodiment, and duplicated descriptions are omitted. The exciter module A21 differs from the exciter module A20 in that the conductor layer 22 does not include the conductor layers 228a, 228b, 228c, and 228d, and the dummy terminals 37a, 37b, 38a, and 38b are directly bonded to the main surface 211 of the insulating substrate 21 of the support member 2.

Third embodiment:
24 and 25 are diagrams for explaining an exciter module A30 according to a third embodiment of the present disclosure. FIG. 24 is a perspective view showing the exciter module A30, and corresponds to FIG. 1. FIG. 25 is a plan view showing the exciter module A30, with the resin member 5 being seen through. FIG. 25 corresponds to FIG. 3. The exciter module A30 according to this embodiment differs from the exciter module A10 according to the first embodiment in that the output terminals are configured as press-fit terminals. The configurations and operations of other parts of this embodiment are similar to those of the first embodiment. Note that the parts of the first and second embodiments and the modified examples may be combined in any desired manner.

The exciter module A30 according to this embodiment has multiple output terminals 36c, 36d instead of the output terminals 32a, 32b. The output terminals 36c, 36d are press-fit terminals and protrude from the resin member 5 to the second side z2 in the thickness direction z. The multiple output terminals 36c are one terminal for outputting the excitation current and are positive terminals. The multiple output terminals 36c are conductively joined to the conductor layer 223 in the second direction y. The multiple output terminals 36d are the other terminal for outputting the excitation current and are negative terminals. The multiple output terminals 36d are conductively joined to the conductor layer 224 in the second direction y. In this embodiment, the exciter module A30 has four output terminals 36c, 36d. The number of output terminals 36c, 36d is not limited.

The conductive layer 22 in this embodiment further includes a conductive layer 229. The conductive layer 22 is disposed on the second side x2 of the conductive layers 223 and 224 in the first direction x, and extends in the second direction y. The conductive layer 229 is not electrically connected to any of the semiconductor elements 11-16 or the thermistor 10.

The exciter module A30 according to this embodiment further includes a dummy terminal 39. The dummy terminal 39 protrudes from the insulating substrate 21 when viewed in the thickness direction z, and protrudes from the resin member 5 in the first direction x. The dummy terminal 39 is a plate-shaped member and is formed from the same lead frame as the power terminals 31a, 31b. The dummy terminal 39 is conductively joined to the conductor layer 229 via a conductive bonding material. The joining method is not limited. The dummy terminal 39 is not conductive to any of the semiconductor elements 11-16 or the thermistor 10.

In this embodiment, the exciter module A30 also constitutes an exciter circuit in which two switching elements 11, 12 and four diodes 13 to 16 are connected as shown in the circuit diagram in FIG. 9, with the conductive layer 22 arranged on the main surface 211 of the insulating substrate 21 and multiple connection members 4 as the conductive paths. In other words, the exciter module A30 is a modularized exciter, and is smaller in size than conventional exciters.

Furthermore, according to this embodiment, the power terminals 31a, 31b and the dummy terminal 39 are joined as part of the same lead frame in the lead frame joining step (S2) in the manufacturing process. Therefore, the exciter module A30 is easy to handle during manufacturing. Also, since multiple exciter modules A30 can be manufactured using a common lead frame, manufacturing efficiency is improved.

In addition, the exciter module A30 has a configuration common to the exciter module A10, and thus provides the same effects as the exciter module A10.

First modified example:
26 and 27 are diagrams for explaining an exciter module A31 according to a first modified example of the third embodiment. FIG. 26 is a perspective view showing the exciter module A31, and corresponds to FIG. 24. FIG. 27 is a plan view showing the exciter module A31, seen through the resin member 5. FIG. 27 corresponds to FIG. 25. In these diagrams, elements that are the same as or similar to those in the above embodiment are given the same reference numerals as those in the above embodiment, and duplicated descriptions are omitted. The exciter module A31 differs from the exciter module A30 in the layout of the conductor layer 22 and the arrangement positions of the press-fit terminals.

In the first modified example, the conductor layer 221 extends in the first direction x to near the end of the second side x2 of the main surface 211 of the insulating substrate 21, and has two recesses recessed from the second side y2 to the first side y1 in the second direction y. The conductor layers 225a and 225b are arranged side by side in the first direction x in the recess on the second side x2 of the two recesses of the conductor layer 221. The conductor layers 226b and 226a are arranged side by side in the first direction x in the recess on the first side x1 of the two recesses of the conductor layer 221. The conductor layer 223 is arranged on the second side x2 of the conductor layer 224 in the first direction x. The conductor layers 227a and 227b are arranged side by side in the second direction y on the first side y1 of the conductor layer 221 in the second direction y on the second side x2 of the conductor layer 223 in the first direction x.

The output terminals 36c are lined up in the first direction x and conductively joined to the conductive layer 223. The output terminals 36d are lined up in the second direction y and conductively joined to the conductive layer 224. In this embodiment, there are three output terminals 36c and three output terminals 36d. The number of output terminals 36c and three output terminals 36d is not limited. The detection terminal 34b, the signal terminal 33b, the signal terminal 33a, and the detection terminal 34a are lined up in a row in this order from the first side x1 to the second side x2 in the first direction x near the end of the second side y2 in the second direction y of the resin main surface 51. The output terminals 36c are lined up in a row in the first direction x near the end of the first side y1 in the second direction y of the resin main surface 51. The detection terminals 35a and 35b are arranged in a row in the second direction y near the end of the resin main surface 51 on the second side x2 in the first direction x. The multiple output terminals 36d are arranged in a row in the second direction y near the end of the resin main surface 51 on the first side x1 in the first direction x.

Fourth embodiment:
Fig. 28 is a diagram for explaining an exciter module A40 according to a fourth embodiment of the present disclosure. Fig. 28 is a circuit diagram showing a circuit configuration of the exciter module A40, and is a diagram corresponding to Fig. 9. The exciter module A40 according to this embodiment differs from the exciter module A10 according to the first embodiment in that it further includes a switching element 17 and diodes 18 and 19. The configuration and operation of other parts of this embodiment are similar to those of the first embodiment. Note that the respective parts of the above first to third embodiments and the modified examples may be combined in any desired manner.

The exciter module A40 in this embodiment further includes a switching element 17 and diodes 18 and 19. Switching element 17 has the same configuration as switching elements 11 and 12. Diodes 18 and 19 have the same configuration as diodes 13 to 16. Diode 18 is connected in series to switching element 17 in the forward direction, and the anode electrode is conductively connected to the emitter electrode of switching element 17. Diode 19 is connected in inverse parallel to switching element 17, and the anode electrode is conductively connected to the emitter electrode of switching element 17, and the cathode electrode is conductively connected to the collector electrode of switching element 17. The collector electrode of switching element 17 is conductively connected to the conductive path between the first electrode 111 (emitter electrode) of switching element 11 and the cathode electrode 132 of diode 13. The cathode electrode of the diode 18 is conductively connected to the conductive path between the third electrode 123 (collector electrode) of the switching element 12 and the anode electrode 141 of the diode 14. In other words, the exciter module A40 is a circuit consisting of the switching element 17 and the diodes 18 and 19 connected in parallel between the output terminals 32a and 32b, i.e., the load connected to the output terminals 32a and 32b. The load can be short-circuited by turning on the drive signal input to the signal terminal 33b connected to the gate electrode of the switching element 17.

In this embodiment, the exciter module A40 configures an exciter circuit in which three switching elements 11, 12, 17 and six diodes 13-16, 18, 19 are connected as shown in the circuit diagram in FIG. 28, with the conductive layer 22 arranged on the main surface 211 of the insulating substrate 21 and multiple connection members 4 as the conductive paths. In other words, the exciter module A40 is a modularized exciter, and is smaller than conventional exciters.

Also, the exciter module A40 has a common configuration with the exciter module A10, and thus exerts the same effect as the exciter module A10. Furthermore, the exciter module A40 has a circuit consisting of a switching element 17 and diodes 18 and 19 connected between the output terminals 32a and 32b, i.e., in parallel with the load connected to the output terminals 32a and 32b. The exciter module A40 can short-circuit the load when the drive signal input to the signal terminal 33b connected to the gate electrode of the switching element 17 is turned on.

Fifth embodiment:
29 to 30 are diagrams for explaining an exciter module A50 according to a fifth embodiment of the present disclosure. FIG. 29 is a perspective view showing the exciter module A50, and corresponds to FIG. 1. FIG. 30 is a plan view showing the exciter module A50, seen through the resin member 5. FIG. 30 corresponds to FIG. 3. The exciter module A50 according to this embodiment differs from the exciter module A10 according to the first embodiment in that a part of the signal terminals and the detection terminals is made of a lead frame. The configuration and operation of the other parts of this embodiment are the same as those of the first embodiment. Note that the parts of the first to fourth embodiments and the modified examples may be combined in any combination.

The exciter module A50 of this embodiment has signal terminals 33a', 33b' instead of the signal terminals 33a, 33b, and has detection terminals 34a', 34b' instead of the detection terminals 34a, 34b. The signal terminals 33a', 33b' and the detection terminals 34a', 34b' are all rod-shaped members and are formed from the same lead frame as the power terminals 31a, 31b and the output terminals 32a, 32b. The signal terminal 33a' is conductively joined to the conductor layer 225a via a conductive bonding material. The signal terminal 33b' is conductively joined to the conductor layer 226b via a conductive bonding material. The detection terminal 34a' is conductively joined to the conductor layer 225b via a conductive bonding material. The detection terminal 34b' is conductively joined to the conductor layer 226a via a conductive bonding material. The joining method is not limited. The signal terminals 33a', 33b' and the detection terminals 34a', 34b' all protrude from the resin member 5 in the second direction y, bend to the second side z2 in the thickness direction z, and extend in the thickness direction z.

In this embodiment, the exciter module A50 also constitutes an exciter circuit in which two switching elements 11, 12 and four diodes 13 to 16 are connected as shown in the circuit diagram in FIG. 9, with the conductive layer 22 arranged on the main surface 211 of the insulating substrate 21 and multiple connection members 4 as the conductive paths. In other words, the exciter module A50 is a modularized exciter, and is smaller than conventional exciters.

Furthermore, according to this embodiment, the power terminals 31a, 31b, the output terminals 32a, 32b, the signal terminals 33a', 33b', and the detection terminals 34a', 34b' are joined as part of the same lead frame in the lead frame joining step (S2) in the manufacturing process. Therefore, the exciter module A50 is easy to handle during manufacturing. Also, since multiple exciter modules A50 can be manufactured using a common lead frame, manufacturing efficiency is improved.

Furthermore, the exciter module A50 has a configuration in common with the exciter module A10, and thereby achieves the same effects as the exciter module A10. Note that, in this embodiment, a case has been described in which some of the signal terminals and detection terminals are configured from lead frames, but this is not limited to this. For example, the exciter module A50 may have all of the signal terminals and detection terminals (i.e., all terminals 3) configured from lead frames.

This disclosure is not limited to the embodiments described above. The specific configuration of each part of this disclosure can be freely designed in various ways.

The present disclosure includes the embodiments described in the appended claims below.
Appendix 1.
A support member (2) having an insulating substrate (21) and a conductive layer (22) disposed on one side (z1) in a thickness direction (z) of the insulating substrate;
A plurality of semiconductor elements (11 to 16) bonded to the conductive layer;
a resin member (5) covering the semiconductor elements and the conductive layer;
first terminals (31a, 31b, 32a, 32b, 37a, 37b, 38a, 38b, 39) protruding from the resin member in a first direction (x) perpendicular to the thickness direction;
Equipped with
The plurality of semiconductor elements include a first switching element (11), a second switching element (12), a first diode (13), and a second diode (14).
Exciter module.
Appendix 2.
The terminal further includes a second terminal (32a) protruding from the resin member on a side opposite to a direction in which the first terminal protrudes in the first direction.
2. The exciter module of claim 1.
Appendix 3.
The conductive layers include a first conductive layer (221), a second conductive layer (224), and a third conductive layer (223) that are spaced apart from each other;
the first switching element and the second diode are joined to the first conductive layer,
the second switching element is bonded to the second conductive layer;
the first diode is bonded to the third conductive layer;
3. The exciter module of claim 1 or 2.
Appendix 4.
The first terminal (31a) is bonded to the first conductive layer.
4. The exciter module of claim 3.
Appendix 5.
The first terminal (32b) is bonded to the second conductive layer.
4. The exciter module of claim 3.
Appendix 6.
The first terminal (32a) is bonded to the third conductive layer.
4. The exciter module of claim 3.
Appendix 7.
The conductive layer further includes a fourth conductive layer (222) that is electrically connected to the second switching element,
The first terminal (31b) is bonded to the fourth conductive layer.
4. The exciter module of claim 3.
Supplementary Note 8. (FIG. 21, second embodiment)
The conductive layer further includes a fifth conductive layer (228a) that is not electrically connected to any of the plurality of semiconductor elements;
The first terminal (37a) is bonded to the fifth conductive layer.
4. The exciter module of claim 3.
Supplementary Note 9. (FIG. 23, First Modification of Second Embodiment)
The first terminal (37a) is bonded to the insulating substrate.
4. The exciter module of claim 3.
Appendix 10. (Figure 9)
The first switching element has a first input electrode (111) to which a current is input and a first output electrode (112) to which a current is output,
The second switching element has a second input electrode (121) to which a current is input and a second output electrode (122) to which a current is output,
The first diode has a first anode electrode (131) to which a current is input and a first cathode electrode (132) to which a current is output,
The second diode has a second anode electrode (141) to which a current is input and a second cathode electrode (142) to which a current is output,
the first output electrode and the first cathode electrode are conductively connected, the second input electrode and the second anode electrode are conductively connected, the first input electrode and the second cathode electrode are conductively connected, and the first anode electrode and the second output electrode are conductively connected,
A DC voltage is applied between the first input electrode and the first anode electrode from the outside, and a voltage is output between the first output electrode and the second input electrode.
10. An exciter module according to any one of claims 1 to 9.
Supplementary Note 11 (FIG. 28, fourth embodiment)
The plurality of semiconductor elements further includes a third switching element (17) and a third diode (18);
the third switching element has a third input electrode to which a current is input and a third output electrode from which a current is output,
the third diode has a third anode electrode to which a current is input and a third cathode electrode to which a current is output;
the third output electrode and the third anode electrode are conductively connected, the first output electrode and the third input electrode are conductively connected, and the second input electrode and the third cathode electrode are conductively connected.
11. The exciter module of claim 10.
Appendix 12.
The semiconductor device further includes third terminals (33a, 33b, 34a, 34b, 35a, 35b, 36a, 36b, 36c, 36d) protruding from the resin member in the thickness direction.
12. An exciter module according to any one of claims 1 to 11.
Appendix 13.
the third terminal is electrically connected to the first switching element or the second switching element;
13. The exciter module of claim 12.
Appendix 14. (Figure 8)
The third terminal is
a holder (3a) having a cylindrical shape extending in the thickness direction and joined to the conductive layer;
A metal pin (3b) press-fitted along the inner peripheral surface of the holder;
Equipped with
14. The exciter module of claim 12 or 13.
Supplementary Note 14-1. (FIG. 29, fifth embodiment)
The semiconductor device further includes fourth terminals (33a', 33b', 34a', 34b') protruding from the resin member in a second direction perpendicular to the thickness direction and the first direction.
12. An exciter module according to any one of claims 1 to 11.
Appendix 14-2.
The support member further has a back surface facing the other side in the thickness direction,
The back surface is exposed from the resin member.
15. An exciter module according to any one of claims 1 to 14.
Appendix 15. (Figure 11)
A step (S1) of forming a conductive layer on an insulating substrate;
A step (S2) of bonding a lead frame to the conductive layer;
A step (S3) of bonding a plurality of semiconductor elements to the conductive layer;
a step (S5) of forming a resin member covering the plurality of semiconductor elements and the conductive layer;
A step (S7) of cutting the lead frame;
Equipped with
A method for manufacturing an exciter module.

A10 to A12, A20, A21, A30, A31, A40: Exciter 11, 12, 17: Switching element 11a, 12a: Element main surface 11b, 12b: Element back surface 111, 121: First electrode 112, 122: Second electrode 113, 123: Third electrode 13 to 16, 18, 19: Diode 13a to 16a: Element main surface 13b, 14b, 15b, 16b: Element back surface 131, 141, 151, 161: Anode electrode 132, 142, 152, 162: Cathode electrode 10: Thermistor 2: Support member 21: Insulating substrate 211: Principal surface 212: Back surface 22, 221 to 224, 225a, 225b, 226a, 226b, 227
a, 227b, 228a, 228b, 228c, 228d, 229: Conductive layer 23: Back metal layer 3: Terminals 31a, 31b, 36a, 36b: Power terminals 32a, 32b, 36c, 36d: Output terminals 33a, 33b, 33a', 33b': Signal terminals 34a, 34b, 35a, 35b, 34a', 34b': Detection terminals 37a, 37b, 38a, 38b, 39: Dummy terminals 3a: Holder 3b: Metal pin 4: Connection members 41a, 41b, 42a, 42b, 43a, 43b, 44-47: Connection members 5: Resin member 51: Resin main surface 52: Resin back surface 531, 532, 533, 534: Resin side surface 91: Insulating substrate 94: Lead frame B: Three-phase inverter module C: Wound magnetic field type synchronous motor C1: Stator C2: Rotor D: Battery

Claims (15)

a support member having an insulating substrate and a conductive layer disposed on one side of the insulating substrate in a thickness direction;
a plurality of semiconductor elements bonded to the conductive layer;
a resin member covering the semiconductor elements and the conductor layer;
a first terminal protruding from the resin member in a first direction perpendicular to the thickness direction;
Equipped with
the plurality of semiconductor elements include a first switching element, a second switching element, a first diode, and a second diode;
Exciter module. a second terminal protruding from the resin member on a side opposite to a direction in which the first terminal protrudes in the first direction;
2. The exciter module of claim 1. the conductive layer includes a first conductive layer, a second conductive layer, and a third conductive layer spaced apart from one another;
the first switching element and the second diode are joined to the first conductive layer;
the second switching element is bonded to the second conductive layer;
the first diode is bonded to the third conductive layer;
3. An exciter module according to claim 1 or 2. The first terminal is bonded to the first conductive layer.
4. The exciter module of claim 3. The first terminal is bonded to the second conductive layer.
4. The exciter module of claim 3. the first terminal is bonded to the third conductive layer;
4. The exciter module of claim 3. the conductive layer further includes a fourth conductive layer that is electrically connected to the second switching element,
the first terminal is bonded to the fourth conductive layer;
4. The exciter module of claim 3. the conductive layer further includes a fifth conductive layer not conductive to any of the plurality of semiconductor elements;
the first terminal is bonded to the fifth conductive layer;
4. The exciter module of claim 3. The first terminal is bonded to the insulating substrate.
4. The exciter module of claim 3. The first switching element has a first input electrode to which a current is input and a first output electrode to which a current is output,
the second switching element has a second input electrode to which a current is input and a second output electrode from which a current is output,
the first diode has a first anode electrode to which a current is input and a first cathode electrode to which a current is output;
the second diode has a second anode electrode to which a current is input and a second cathode electrode to which a current is output;
the first output electrode and the first cathode electrode are conductively connected, the second input electrode and the second anode electrode are conductively connected, the first input electrode and the second cathode electrode are conductively connected, and the first anode electrode and the second output electrode are conductively connected,
A DC voltage is applied between the first input electrode and the first anode electrode from the outside, and a voltage is output between the first output electrode and the second input electrode.
10. An exciter module according to any one of claims 1 to 9. the plurality of semiconductor elements further includes a third switching element and a third diode;
the third switching element has a third input electrode to which a current is input and a third output electrode from which a current is output,
the third diode has a third anode electrode to which a current is input and a third cathode electrode to which a current is output;
the third output electrode and the third anode electrode are conductively connected, the first output electrode and the third input electrode are conductively connected, and the second input electrode and the third cathode electrode are conductively connected;
11. The exciter module of claim 10. The semiconductor device further includes a third terminal protruding from the resin member in the thickness direction.
12. An exciter module according to any preceding claim. the third terminal is electrically connected to the first switching element or the second switching element;
13. The exciter module of claim 12. The third terminal is
a holder having a cylindrical shape extending in the thickness direction and joined to the conductive layer;
a metal pin press-fitted along an inner peripheral surface of the holder;
Equipped with
14. An exciter module according to claim 12 or 13. forming a conductive layer on an insulating substrate;
bonding a lead frame to the conductive layer;
bonding a plurality of semiconductor elements to the conductive layer;
forming a resin member covering the semiconductor elements and the conductive layer;
cutting the lead frame;
Equipped with
A method for manufacturing an exciter module.

Images