WO2025035467A1 - Implantation assistance apparatus - Google Patents

Abstract

An implantation assistance apparatus. The implantation assistance apparatus comprises: a base (100); and at least two implantation assistance members (200), wherein the implantation assistance members (200) each have a first end (210) and a second end (220) opposite to each other, the first ends (210) are arranged on the base (100), and the second ends (220) are used for being connected to flexible neural electrodes (10) in a one-to-one correspondence manner, so as to drive the flexible neural electrodes (10) to be inserted into a preset position. According to the implantation assistance apparatus, the implantation assistance members (200) drive the flexible neural electrodes (10) to be inserted into the preset position, so that the implantation of the flexible neural electrodes (10) is achieved; in addition, the number of the implantation assistance members (200) is two or more, and the multiple implantation assistance members (200) can be preassembled with the flexible neural electrodes (10), thereby reducing the time required for implanting multiple flexible neural electrodes.

Description

Implant assist device Technical Field

The present application relates to brain-computer interface technology, and in particular to an implant assisting device.

Background Art

At present, the collection of neuroelectrophysiological signals mainly relies on brain-computer interfaces. According to the way of information collection, it is usually divided into two types: implantable and non-implantable. Non-implantable electrodes generally refer to electroencephalograms, which can observe and record brain activities non-invasively; implantable electrodes mostly refer to cortical electroencephalograms and puncturing intracortical electrodes, which need to pierce brain tissue to obtain stronger and higher quality EEG signals. Therefore, implantable electrodes have broad application prospects in the detection of EEG signals and brain science research.

Since the bending stiffness of flexible neural electrodes is much smaller than that of rigid neural electrodes, existing invasive brain-computer interfaces usually use flexible neural electrodes for neural signal collection, thereby preventing the electrodes from causing damage to the surrounding nervous system, reducing neural signal attenuation caused by immune response, and thus increasing the stable working time of invasive brain-computer interfaces in the human body. However, since the Young's modulus and bending stiffness of flexible neural electrodes are much smaller than those of rigid neural electrodes, the flexible neural electrodes cannot be implanted based on their own stiffness. Therefore, in the prior art, flexible neural electrodes are usually bonded to hard needles made of alloys to complete implantation.

However, for larger arrays of flexible neural electrodes, the flexible neural electrodes need to be implanted one by one during the implantation process, which consumes a lot of time.

Summary of the invention

The present application provides an implantation assisting device to solve the problem of taking too long during the implantation process.

The present application provides an implantation assisting device for implanting a flexible neural electrode, the implantation assisting device comprising:

Pedestal;

At least two implantation auxiliary parts, each of which has a first end and a second section opposite to each other, each of the first ends is arranged on the base, and the second ends are used to be connected to the flexible neural electrodes one by one to drive the flexible neural electrodes to be inserted into a preset position.

In an optional embodiment of an implantation assisting device provided in the present application, at least two mounting portions are provided on the base, and the implantation assisting parts are connected to the mounting portions one by one to fix the implantation assisting parts to the base.

In an optional embodiment of an implantation assist device provided in the present application, a through hole is provided on the mounting portion, the implantation assist component is inserted into the base through the through hole, the first end and the second end are respectively located on both sides of the base, and the first end is connected to the base.

In an optional embodiment of an implantation assisting device provided in the present application, the implantation assisting device further comprises a fixing member, wherein the first end is bent toward the base and abuts against a surface of the base;

The fixing member is covered on the base to press the first end tightly onto the base.

In an optional embodiment of an implantation assisting device provided in the present application, the fixing member is bonded and fixed to the base.

In an optional embodiment of an implantation assist device provided in the present application, the implantation assist component is arranged on the end surface of the base, each of the implantation assist components is arranged side by side, and the implantation assist component is flush with one of the two opposite surfaces of the base.

In an optional embodiment of an implantation assist device provided in the present application, there are multiple implantation assist components, and the multiple implantation assist components are arranged in an array on the surface of the base.

In an optional embodiment of an implant assist device provided in the present application, the implant assist component and the base are integrally formed or cut into one piece through a micro-electromechanical system processing process.

In an optional embodiment of an implantation assist device provided in the present application, a cross-section of the implantation assist component gradually decreases from the first end to the second end.

In an optional embodiment of an implantation assist device provided in the present application, the implantation assist component has a first surface and a second surface relative to each other, and the first surface and the second surface are electroplated surfaces, polished surfaces or chemically corroded surfaces.

In an optional embodiment of an implantation assist device provided in the present application, the implantation assist device further includes a gripping member, and the gripping member is disposed on the base.

In an optional embodiment of an implant assisting device provided in the present application, the gripping member is integrally formed with the base;

Alternatively, the gripping member is detachably connected to the base.

The implantation auxiliary device provided by the present application includes an implantation auxiliary part arranged on a base, wherein the implantation auxiliary part has a first end and a second end opposite to each other, the first end is arranged on the base, and the second end is connected to the flexible neural electrode, and the flexible neural electrode is driven to be inserted into a preset position by the implantation auxiliary part, thereby realizing the implantation of the flexible neural electrode. And the number of implantation auxiliary parts can be multiple, and the second end of each implantation auxiliary part is connected to multiple flexible neural electrodes in a one-to-one correspondence. By pre-assembling the implantation auxiliary part and the flexible neural electrode together, at least two flexible neural electrodes can be directly implanted into the preset position at the same time by using the implantation auxiliary device during implantation, thereby greatly reducing the time required for implanting multiple flexible neural electrodes, improving the implantation efficiency, and thus ensuring the safety of the implantation of the flexible neural electrode.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a structural schematic diagram of an implant assisting device provided in an embodiment of the present application;

FIG2 is a second structural schematic diagram of an implant assisting device provided in an embodiment of the present application;

FIG3 is a third structural schematic diagram of an implant assisting device provided in an embodiment of the present application;

FIG4 is a schematic diagram of the structure of an implant assisting device provided in an embodiment of the present application assembled with a single flexible neural electrode;

FIG5 is a partial enlarged view of point I in FIG4;

FIG6 is a fourth structural schematic diagram of an implant assisting device provided in an embodiment of the present application;

FIG7 is a fifth structural diagram of an implant assisting device provided in an embodiment of the present application;

FIG8 is a schematic diagram of a base provided in an embodiment of the present application;

FIG9 is a sixth structural diagram of an implant assisting device provided in an embodiment of the present application;

FIG10 is a seventh structural diagram of an implant assisting device provided in an embodiment of the present application;

FIG11 is a processing schematic diagram 1 of the implant assisting device provided in an embodiment of the present application;

FIG. 12 is a second processing schematic diagram of the implant assisting device provided in an embodiment of the present application.

Description of reference numerals:
100-base; 110-installation portion;
200 - implantation aid; 210 - first end; 220 - second end; 230 - first surface; 240 - second surface;
300-fixing parts;
400- gripping piece;
500-first surface;
600- second surface;
10-Flexible neural electrodes.

DETAILED DESCRIPTION

In order to make the purpose, technical scheme and advantages of the present application clearer, the technical scheme in the embodiment of the present application will be described in more detail below in conjunction with the drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals throughout represent the same or similar parts or parts with the same or similar functions. The described embodiments are part of the embodiments of the present application, not all of the embodiments. The embodiments described below with reference to the drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application. The embodiments of the present application are described in detail below in conjunction with the drawings.

In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are orientations or positional relationships based on the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

The terms "first", "second", "third" (if any) in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the application described herein can be implemented in an order other than those illustrated or described herein, for example.

In addition, the terms "include", "have" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or display that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include steps or units not explicitly listed. Other steps or elements inherent to or inherent to these processes, methods, products or displays.

As described in the background technology, existing invasive brain-computer interfaces usually use flexible neural electrodes for neural signal acquisition to prevent the electrodes from causing damage to the surrounding nervous system, reduce neural signal attenuation caused by immune response, and thus increase the stable working time of the invasive brain-computer interface in the human body. However, since the Young's modulus and bending stiffness of the flexible neural electrodes are much smaller than those of the rigid neural electrodes, the flexible neural electrodes cannot be implanted solely based on their own stiffness. Therefore, in the prior art, the flexible neural electrodes are usually bonded to hard needles made of alloys to complete the implantation. However, for arrays composed of large-scale flexible neural electrodes, the flexible neural electrodes need to be implanted one by one during the implantation process, which consumes a lot of time, thereby exposing the brain tissue for a long time, greatly increasing the surgical risk and infection risk.

In response to the above technical problems, the present application proposes an implantation auxiliary device, which includes a base and at least two implantation auxiliary parts arranged on the base, wherein the implantation auxiliary parts have a first end and a second end, each first end is arranged on the base, and the second end is used to connect with the flexible neural electrode one by one, so that the flexible neural electrode is driven to be inserted into a preset position through the implantation auxiliary parts. When the scale of the flexible neural electrode is large, the implantation auxiliary parts and the flexible neural electrode can be preassembled together first, so that when implanted, multiple flexible neural electrodes can be directly implanted at the same time using the implantation auxiliary device, thereby greatly reducing the time required to implant multiple flexible neural electrodes, improving the implantation efficiency, and thus ensuring the safety of the flexible neural electrode implantation.

The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

Fig. 1 is a schematic diagram of the structure of the implantation assisting device provided in the embodiment of the present application, Fig. 2 is a schematic diagram of the structure of the implantation assisting device provided in the embodiment of the present application, and Fig. 6 is a schematic diagram of the structure of the implantation assisting device provided in the embodiment of the present application. Please refer to Fig. 1, Fig. 2, and Fig. 6.

This embodiment provides an implantation assisting device, which includes a base 100 and at least two implantation assisting parts 200. When the implantation assisting device needs to be implanted, the base 100 can be manually or mechanically held, thereby improving the convenience of implantation. The implantation assisting parts 200 have a first end 210 and a second end 220 that are relatively arranged, each first end 210 is arranged on the base 100, and the second end 220 is used to be connected to the flexible neural electrode 10 in a one-to-one correspondence, thereby driving the flexible neural electrode 10 to be inserted into a preset position.

Since the implantation auxiliary components 200 provided in this embodiment can be two or more, correspondingly, the number of the flexible neural electrodes 10 is less than or equal to the number of the implantation auxiliary components 200. When the number of flexible neural electrodes 10 is too large, it will take a lot of time to implant the flexible neural electrodes 10 one by one. The implantation auxiliary device provided in this embodiment can connect each flexible neural electrode 10 to the second end 220 of the implantation auxiliary component 200 one by one before implantation, so as to pre-assemble the flexible neural electrode 10 and the implantation auxiliary component 200 together, so that multiple flexible neural electrodes 10 can be directly implanted at the same time by using the implantation auxiliary device during implantation, which greatly reduces the time spent on implanting multiple flexible neural electrodes 10, improves the implantation efficiency, and further ensures the safety of the implantation of the flexible neural electrodes 10.

Specifically, the flexible neural electrode 10 and the implantation auxiliary component 200 are fixed by a soluble biocompatible adhesive. When the implantation auxiliary device drives the flexible neural electrode 10 to be inserted into the preset position, the soluble biocompatible adhesive is dissolved, and the flexible neural electrode 10 is separated from the implantation auxiliary component 200. The implantation auxiliary device can be pulled out, thereby completing the implantation of the flexible neural electrode 10.

Exemplarily, the soluble biocompatible adhesive is fibrin. It is understandable that the specific components of the soluble biocompatible adhesive are not limited here, and other suitable adhesives can be selected for bonding and fixing according to needs.

Furthermore, in this embodiment, a plurality of implantation aids 200 are arranged side by side on the end face of the base 100, and one of the two opposite surfaces of the implantation aid 200 and the base 100 is flush, thereby ensuring that the flexible neural electrode 10 is in the same plane during implantation, thereby achieving smooth implantation of the flexible neural electrode 10.

It should be noted that the plurality of implantation aids 200 can be arranged on the same surface or different surfaces of the base 100, and according to the requirements, the plurality of implantation aids 200 can be arranged in any number and manner to meet different implantation requirements. For example, the plurality of implantation aids 200 are arranged on the surface of the base 100 in an array.

Furthermore, the implantation auxiliary part 200 can be made of a rigid material to enhance the bending rigidity of the implantation auxiliary part 200, thereby avoiding the implantation auxiliary part 200 from bending during the implantation process, resulting in the problem that the flexible neural electrode 10 cannot be accurately implanted to the preset position, or deviates from the preset route during the implantation process, thereby damaging the blood vessels in the brain area. Exemplarily, the material of the implantation auxiliary part 200 is tungsten alloy, and the implantation auxiliary device made of the implantation auxiliary part 200 using the above material can effectively drive the flexible neural electrode 10 to be inserted into the preset position.

It should be noted that the specific material of the implantation auxiliary component 200 is not limited here. In other embodiments, the implantation auxiliary component 200 can be made of other suitable materials according to requirements.

FIG. 11 is a schematic diagram of the processing of the implant assisting device provided in the embodiment of the present application, and FIG. 12 is a schematic diagram of the processing of the implant assisting device provided in the embodiment of the present application. Figure 12. Specifically, in this embodiment, the base 100 and the implant auxiliary component 200 are integrally formed by a micro-electromechanical system (MEMS) process (hereinafter described as MEMS process).

The MEMS process includes a bulk silicon MEMS process. The following is a brief description of the steps of processing the implant assisting device provided in this embodiment by the bulk silicon MEMS process:

S1: Cleaning (for example, wet cleaning, RCA cleaning or dilute chemical cleaning) the workpiece to be processed (in this embodiment, the workpiece to be processed is a silicon wafer) to remove impurities on its surface.

S2: coating a layer of photoresist on the first surface 500 of the workpiece to be processed, and performing a pre-baking operation to volatilize the organic solvent in the photoresist.

S3: Use a photolithography machine and a corresponding first mask to sequentially expose, post-bake, develop and rinse the workpiece coated with photoresist.

S4: etching (dry etching) the rinsed workpiece to be processed, and then removing the remaining photoresist to form a groove on the workpiece to be processed, thereby obtaining the structure shown in FIG. 12 .

S5: Turn over the workpiece, place the notch of the groove downward, apply a layer of photoresist on the second surface 600 of the workpiece opposite to the first surface 500, and then perform pre-baking to volatilize the organic solvent in the photoresist.

S6: Use a photolithography machine and a corresponding second mask to sequentially expose, post-bake, develop and rinse the workpiece coated with photoresist.

S7: dry-etching the rinsed workpiece to be processed to form an implantation auxiliary member 200 on the workpiece to be processed corresponding to the groove, and then removing the remaining photoresist to obtain the structure shown in FIG. 1 .

S8: Cut the workpiece processed in the previous step (if the workpiece has a suitable shape and size, cutting is not necessary) to obtain an implant assisting device.

It should be noted that when the implant assist device is manufactured using the MEMS processing technology, it is not limited to the bulk silicon MEMS processing technology. For example, the implant assist device can also be integrally formed by the surface silicon MEMS processing technology.

It is understandable that the processing technology of the base 100 and the implant auxiliary component 200 is not limited to the above-mentioned MEMS process, and other suitable processes can be adopted according to needs. For example, the base 100 and the implant auxiliary component 200 can be integrally formed by cutting.

For example, the base 100 and the implant assisting member 200 can be manufactured by an electrospark process. When using the electrospark process to manufacture the implant assisting device, a piece of workpiece to be processed can be placed on a workbench, and then a cutting device can be used to process a groove on the workpiece to obtain the structure shown in FIG. 12, and then the workpiece can be turned over. Turn the workpiece to be processed, with the notch of the groove facing downward, and use a cutting device to cut the workpiece to be processed corresponding to the groove to form an implantation auxiliary part 200.

It should be noted that when using the electric spark process to manufacture the implantation auxiliary device, the cutting equipment can also be used to directly cut the implantation auxiliary part 200 and the base 100 on the workpiece to be processed. The specific method is not limited to the above steps, and this embodiment does not impose any restrictions on this.

FIG3 is a third structural schematic diagram of the implantation assisting device provided in the embodiment of the present application, FIG4 is a structural schematic diagram of the implantation assisting device provided in the embodiment of the present application assembled with a single flexible neural electrode, and FIG5 is a partial enlarged view of point I in FIG4. Please refer to FIG3 to FIG5.

In an optional exemplary embodiment, the implantation aid also includes a gripping member 400, which is disposed on the base 100 for easy holding, so that the implantation aid device and the flexible neural electrode 10 can be implanted into a preset position manually or mechanically.

Specifically, in an optional exemplary embodiment, the gripping member 400 and the base 100 are integrally formed, and the connection strength between the gripping member 400 and the base 100 is ensured through the integral molding process, thereby preventing the gripping member 400 or the base 100 from falling off during the implantation process. The overall structure is processed using a bulk silicon MEMS process. At the same time, it is understood that the processing technology of the gripping member 400 and the base 100 is not limited to the above-mentioned bulk silicon MEMS process, and other suitable processes can be used according to requirements.

In an optional exemplary embodiment, the holding member 400 and the base 100 may also be detachably connected. When the space that the implantation path can accommodate is small during the implantation process, the holding member 400 may be disassembled to ensure the smooth implantation of the implantation assisting device. It should be noted that this embodiment does not limit the connection method and processing technology of the holding member 400 and the base 100.

Specifically, in an optional exemplary embodiment, a receiving hole is opened at one end of the flexible neural electrode 10, and the second end 220 of the implant auxiliary component 200 can be inserted into the receiving hole. At this time, the second end 220 can be selectively connected to the flexible neural electrode 10 through a soluble biocompatible adhesive, which will greatly improve the reliability of the connection between the implant auxiliary component 200 and the flexible neural electrode 10, thereby avoiding the problem of the flexible neural electrode 10 falling off during implantation and affecting the implantation effect.

FIG6 is a fourth structural diagram of an implant assisting device provided in an embodiment of the present application, FIG7 is a fifth structural diagram of an implant assisting device provided in an embodiment of the present application, FIG8 is a schematic diagram of a base provided in an embodiment of the present application, FIG9 is a sixth structural diagram of an implant assisting device provided in an embodiment of the present application, and FIG10 is a seventh structural diagram of an implant assisting device provided in an embodiment of the present application. Please refer to FIGS. 6 to 10.

In an optional exemplary embodiment, the base 100 is detachably connected to the implant aid 200. At least two mounting parts 110 are provided on the seat 100 , and the implantation auxiliary parts 200 are connected to the mounting parts 110 in a one-to-one correspondence, thereby fixing the implantation auxiliary parts 200 to the base 100 .

By providing the mounting portion 110, the implantation aid 200 is detachably connected to the base 100, so that the number and installation position of the implantation aid 200 can be freely adjusted according to demand, thereby improving the adaptability of the implantation aid device provided in this embodiment, thereby eliminating the need to process implantation aids 200 of different numbers and positions, thereby reducing production costs.

It should be noted that the structure of the mounting portion 110 can be selected according to the requirements, and no limitation is imposed on the mounting portion 110. For example, the mounting portion 110 can be a mounting hole or a mounting seat.

It should be noted that the mounting portion 100 can be integrally formed with the base 100 or detachably connected. For example, when the mounting portion 110 is a mounting hole, a hole can be directly opened on the base 100; when the mounting portion 110 is a mounting seat, the mounting portion 110 can be detachably connected to the base 100 or fixedly connected by bonding or the like. This embodiment does not impose any restrictions on the connection method between the mounting portion 110 and the base 100.

Specifically, in an optional exemplary embodiment, a through hole is opened on the mounting portion 110, and the through hole passes through the mounting portion 110 and the base 100. The implant auxiliary component 200 can be inserted into the base 100 through the through hole, and the first end 210 and the second end 220 are respectively located on both sides of the base 100, the first end 210 is connected to the base 100, and the second end is connected to the flexible neural electrode 10.

Specifically, in an optional exemplary embodiment, the implantation assisting device further includes a fixing member 300, the first end 210 of the implantation assisting member 200 is bent toward the base 100 and abuts against the surface of the base 100, and the fixing member 300 is covered on the base 100, thereby pressing the first end 210 against the base 100. By providing the fixing member 300 to press the first end 210, the connection strength between the implantation assisting member 200 and the base 100 is further enhanced.

It should be noted that, in an optional exemplary embodiment, the fixing member 300 can press the implantation auxiliary member 200 onto the base 100 in other ways according to the needs, and there is no restriction on the fixing method of the implantation auxiliary member 200 and the base 100. Exemplarily, the cross-sectional area of the first end 210 is larger than the cross-sectional area of the second end 220, and the size of the first end 210 is larger than the size of the through hole, so that the first end 210 can be snapped into the through hole to fix the implantation auxiliary member 200 on the base 100.

Specifically, in this embodiment, the shape and size of the fixing member 300 are the same as the base 100, thereby compressing the first end 210 of the implantation auxiliary member 200 and reducing the processing cost. It should be noted that in the optional exemplary embodiment, the fixing member 300 can also be adaptively adjusted according to its own needs. The shape and size of the fixing member 300 are not limited in this embodiment.

Specifically, in this embodiment, the fixing member 300 is bonded and fixed to the base 100. By bonding the fixing member 300 to the base 100, the connection strength between the fixing member 300 and the base 100 is ensured, and the fixing member 300 or the base 100 is prevented from falling off during the implantation process. It should be noted that in the optional exemplary embodiment, the fixing method between the fixing member 300 and the base 100 can also be adaptively adjusted according to its own needs, and this embodiment does not impose any restrictions on the fixing method between the fixing member 300 and the base 100.

In an optional exemplary embodiment, the fixing member 300 is detachably connected to the base 100, so that when it is necessary to adjust the number or installation position of the implant auxiliary components 200, the fixing member 300 can be removed, and the number or installation position of the implant auxiliary components 200 can be further adjusted, thereby improving the adaptability of the implant auxiliary device provided in this embodiment, thereby eliminating the need to process implant auxiliary components 200 of different numbers and positions, thereby reducing production costs.

By opening a through hole on the mounting portion 110, the implantation auxiliary component 200 can be set through the base 100. Compared with directly connecting the implantation auxiliary component 200 to the base 100 through the mounting portion 110, the connection strength between the implantation auxiliary component 200 and the base 100 is higher, further preventing the implantation auxiliary component 200 from falling off due to force during the implantation process.

Specifically, in an optional exemplary embodiment, the implantation auxiliary member 200 is a tungsten wire. At the same time, it is understood that the material of the implantation auxiliary member 200 is not limited to the above tungsten wire, and can be made of other suitable materials according to requirements.

Specifically, in an optional exemplary embodiment, the cross-sectional area of the implantation auxiliary component 200 is gradually reduced from the first end 210 to the second end 220, thereby facilitating the fixation of the flexible neural electrode 10 to the second end 220. And the cross-sectional area of the implantation auxiliary component 200 is gradually reduced, which can improve the smoothness of the surface of the implantation auxiliary component 200, thereby improving the safety of implantation, reducing the resistance during the implantation process, and further enhancing the implantation effect of the flexible neural electrode 10.

Specifically, in an optional exemplary embodiment, the implant aid 200 has a first surface 230 and a second surface 240 relative to each other, and the first surface 230 and the second surface 240 can be electroplated surfaces, polished surfaces or chemically corroded surfaces, that is, by electroplating, polishing or chemically corroding the first surface 230 and the second surface 240, the cross-sectional area of the implant aid 200 gradually decreases from the first end 210 to the second end 220.

It is understandable that this embodiment does not affect the processing method of the first surface 230 and the second surface 240. There are no restrictions on the method, and you can adaptively choose the appropriate processing method according to your own needs.

The following is a brief description of the process of making an implant assisting device using an assembly method provided in this embodiment:

S1: Take a workpiece of suitable size, drill two or more through holes in the workpiece, obtain the structure shown in FIG. 8 , and form a base 100 .

S2: Select a tungsten wire (other materials may also be used) that matches the size of the through hole and cut it into a suitable length, and pass it through the through hole. The two ends of the tungsten wire form a first end 210 and a second end 220 respectively.

S3: applying pressure to the first end 210 so that the first end 210 abuts against the base 100 to obtain the structure shown in FIG. 7 .

S4: Apply adhesive to the surface of the base 100 where the first end 210 abuts against the first end 210 in the previous step, take another piece of original material of suitable size and press it on the adhesive to complete the assembly of the implant assisting device and obtain the structure shown in FIG. 9 .

Furthermore, in an optional exemplary embodiment, a plurality of implant assisting devices may be combined in any manner to form an implant assisting module, each implant assisting module containing a plurality of implant assisting devices of the same or different specifications, thereby jointly completing the implantation of the flexible neural electrode 10.

It should be noted that different implant assisting devices may be selectively packaged for easy transportation.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims (12)

An implantation auxiliary device for implanting a flexible neural electrode, characterized in that the implantation auxiliary device comprises: Pedestal; At least two implantation auxiliary parts, each of which has a first end and a second end relative to each other, each of the first ends is arranged on the base, and the second ends are used to be connected to the flexible neural electrodes one by one to drive the flexible neural electrodes to be inserted into a preset position. The implantation assisting device according to claim 1 is characterized in that at least two mounting parts are provided on the base, and the implantation assisting parts are connected to the mounting parts one by one to fix the implantation assisting parts to the base. The implantation assisting device according to claim 2 is characterized in that a through hole is opened on the mounting portion, the implantation assisting component is inserted into the base through the through hole, the first end and the second end are respectively located on both sides of the base, and the first end is connected to the base. The implantation assisting device according to claim 2, characterized in that the implantation assisting device further comprises a fixing member, wherein the first end is bent toward the base and abuts against a surface of the base; The fixing member is covered on the base to press the first end tightly onto the base. The implantation assisting device according to claim 4 is characterized in that the fixing member is adhesively fixed to the base. The implantation assisting device according to claim 1 is characterized in that the implantation assisting member is arranged on the end surface of the base, each of the implantation assisting members is arranged side by side, and the implantation assisting member is flush with one of the two opposite surfaces of the base. The implantation assisting device according to any one of claims 1 to 5 is characterized in that there are multiple implantation assisting parts, and the multiple implantation assisting parts are arranged in an array on the surface of the base. The implantation assisting device according to claim 7 is characterized in that the implantation assisting part and the base are integrally formed or cut into one piece through a micro-electromechanical system processing process. The implantation assist device according to any one of claims 1 to 5 is characterized in that the cross-section of the implantation assist component gradually decreases from the first end to the second end. The implantation assisting device according to claim 9, characterized in that the implantation assisting member has a first surface and a second surface opposite to each other, the first surface and the second surface are electroplated surfaces, Polished or chemically etched surfaces. The implantation assisting device according to any one of claims 1 to 5 is characterized in that the implantation assisting device further comprises a holding piece, and the holding piece is arranged on the base. The implantation assisting device according to claim 11, characterized in that the gripping member and the base are integrally formed; Alternatively, the gripping member is detachably connected to the base.