WO2025034230A1

WO2025034230A1 - Method for making improved buckling beam probe arrays including forming probes with lateral positions matching guide plate hole positions

Info

Publication number: WO2025034230A1
Application number: PCT/US2023/071709
Authority: WO
Inventors: Michael S. Lockard; Stefano Felici; Uri Frodis; Dennis R. Smalley
Original assignee: Microfabrica Inc
Current assignee: Microfabrica Inc
Priority date: 2023-08-04
Filing date: 2023-08-04
Publication date: 2025-02-13
Anticipated expiration: 2026-02-04

Abstract

Embodiments are directed to the formation of buckling beam probe arrays having MEMS probes that are engaged with guide plates during formation or after formation of the probes while the probes are held in the array configuration in which they were formed. In other embodiments, probes may be formed in, or laterally aligned with, guide plate through holes. Guide plate engagement may occur by longitudinally locating guide plates on probes that are partially formed or fully formed with exposed ends, by forming probes within guide plate through holes, by forming guide plates around probes, or forming guide plates in lateral alignment with arrayed probes and then longitudinally engaging the probes and the through holes of the guide plates. Final arrays may include probes and a substrate to which the probes are bonded along with one or more guide plates.

Description

METHOD FOR MAKING IMPROVED BUCKLING BEAM PROBE ARRAYS INCLUDING

FORMING PROBES WITH LATERAL POSITIONS MATCHING GUIDE PLATE HOLE

POSITIONS

Field of the Present disclosure

[01] The present disclosure relates generally to the field of buckling beam probe arrays or subarrays for testing (e.g., wafer level testing or socket testing) of electronic components (e.g., integrated circuits), more particularly formation of such arrays or subarrays including vertical MEMS probes fabricated with probe-to-probe lateral positions matching guide plate through hole positions.

Background of the Present disclosure

Probes:

[02] Numerous electrical contact probe and pin configurations as well as array formation methods have been commercially used or proposed, some of which may be prior art while others are not.

Electrochemical Fabrication:

[03] Electrochemical fabrication techniques for forming three-dimensional structures from a plurality of adhered layers have been, and are being, commercially pursued by Microfabrica Inc. (formerly MEMGen Corporation) of Van Nuys, California under the process names EFAB and MICA FREEFORM®.

[04] For a better understanding of the present disclosure, it would be suitable to consider the enclosed FIGS. 1A - 11 that illustrate side views of various states in an example multi-layer, multi-material electrochemical fabrication process. FIGS. 1A - 1G illustrate various stages in the formation of a single layer of a multi-layer fabrication process where a second metal is deposited on a first metal as well as in openings in the first metal so that the first and second metals form part of the layer. In FIG. 1 A, a side view of a substrate 182 having a surface 188 is shown, onto which patternable photoresist 184 is deposited, spread, or cast as shown in FIG. 1 B. In FIG. 1 C, a pattern of resist is shown that results from the curing, exposing, and developing of the resist. The patterning of the photoresist 184 results in openings or apertures 192(a) - 192(c) extending from a surface 186 of the photoresist through the thickness of the photoresist to surface 188 of the substrate 182. In FIG. 1 D, a metal 194 (e.g., nickel) is shown as having been electroplated into the openings 192(a) - 192(c). In FIG. 1 E, the photoresist has been removed (i.e., chemically stripped) from the substrate to expose regions of the substrate 182 which are not covered with the first metal 194. In FIG. 1 F, a second metal 196 (e.g., silver) is shown as having been blanket electroplated over the entire exposed portions of the substrate 182 (which is conductive) and over the first metal 194 (which is also conductive). FIG. 1 G depicts the completed first layer of the structure which has resulted from the planarization of the first and second metals down to a height that exposes the first metal and sets a thickness for the first layer. In FIG. 1 H, the result of repeating the process steps shown in FIGS. 1 B - 1 G several times to form a multi-layer structure is shown where each layer consists of two materials. For most applications, one of these materials is removed as shown in FIG. 11 to yield a desired 3-D structure 198 (e.g., component or device).

[05] Also known are electrochemical extrusion (or ELEX) methods that may be used to form elongated structures with vertical, curved, or even stair-stepped configurations.

[06] A first example of such an ELEX method is illustrated in FIGS. 2A - 2F wherein a relatively thin mask (i.e., much thinner than the masks used in LIGA) is provided that can be moved independently of the substrate during deposition of material so as to form a structure by what may be considered electrochemical extrusion. FIG. 2A illustrates a mask 202 that includes a support portion 204 (e.g. a rigid or dimensionally stable structure) and a conformable portion 206, an electrode 208 that may function as an anode, a substrate 210, and a bellows 220 and bellows chamber 212 that are located within a deposition tank 214 that can hold an electrolyte 216 (shown in FIG. 2B). The open side of the bellows 220 connects to and seals with a perimeter region of the mask 202. This sealing makes the openings through the mask the only paths between the inside and outside of the bellows. Next, as shown in FIG. 2B, the substrate 210 and the mask 202 are pressed against each other, and the tank 214 is filled with electrolyte 216 in such a manner that the electrolyte does not become located in the region 212 between the substrate and the bellows. As shown in FIG. 2C, a potential is applied between the anode 208 and the substrate 210 (which acts as a cathode) via power source 222 and wires 224 and 226. The potential is supplied with a polarity and current that allows a deposition 238 to begin forming on the substrate at an appropriate rate. The primary source of the deposition material is preferably the anode 208 with potentially some deposition material being supplied directly by the electrolyte. [07] After the deposition thickens to a desired height, the substrate and the mask begin to separate at a desired rate. The average rate of separation is preferably approximately equal to the average rate of deposition such that a deposition zone and a location on the mask surface stay in the same approximate position throughout the deposition operation with the exception of the initial portion of the deposition that occurs before movement begins. During separation, the sidewalls 232 of the mask seal with the sidewalls 234 of the growing deposit 238 such that the electrolyte does not enter the bellows chamber 212. In one embodiment, the deposition rate and the movement occur in such a manner that the position of the deposition stays at a position 240 relative to the face surface 236 of the mask resulting in a separation of “L”. In other embodiments though, the average deposition rate and the separation rate are approximately equal, and actual separation may occur in discrete and discontinuous steps while the deposition may occur in a continuous manner or in a discontinuous manner. Deposition and movement may occur in an alternating manner at different times. In some embodiments, the working surface may extend into the support region of the mask.

[08] FIG. 2D depicts the state of deposition after the deposit thickness has grown to several times the thickness of the original mask and even more times the thickness of the conformable material portion 206 of the mask. FIG. 2E depicts the state of the process after the deposit 238 has grown to become the completed structure 242. FIG. 2F depicts the combined substrate 210 and structure 242 after being removed from the apparatus of FIGS. 2A - 2E.

[09] A second example of an ELEX method is set forth in FIG. 3 which illustrates a side view of a structure 342 formed by electrochemical extrusion of material onto substrate 310 via mask 302. During the formation of the structure 342, not only was there a perpendicular separation of the planes of the mask 302 and substrate 310 surfaces but there was also motion that had a component parallel to the planes of the mask and substrate surfaces. The parallel component of motion may include translational motion or may include rotational motion around an axis that has a component that is perpendicular to a plane of the mask surface (i.e. , the face of the conformable material) or of a contact face of the substrate surface.

[10] Electrochemical fabrication provides the ability to form prototypes and commercial quantities of miniature objects, parts, structures, devices, and the like, at reasonable costs and in reasonable times. In fact, electrochemical fabrication is an enabler for the formation of many structures that were hitherto impossible to produce. Electrochemical fabrication opens the spectrum for new designs and products in many industrial fields. Even though electrochemical fabrication offers this new capability, and it is understood that electrochemical fabrication techniques can be combined with designs and structures known within various fields to produce new structures, certain uses for electrochemical fabrication provide designs, structures, capabilities and/or features not known or obvious in view of the state of the art.

[1 1] A need exists in various fields for miniature devices having improved characteristics, improved operational capabilities, reduced fabrication times, reduced fabrication costs, simplified fabrication processes, greater versatility in device design, improved selection of materials, improved material properties, more cost effective and less risky production of such devices, and/or more independence between geometric configuration and the selected fabrication process.

Summary of the Present disclosure

[12] It is a first object of some embodiments of the present disclosure to provide an improved method of forming buckling beam probe arrays with MEMS probes that are built up with lateral positions of probes, at one or more longitudinal heights, corresponding to through holes associated with guide plates that may be engaged with the probes during formation of the probes or after formation of the probes.

[13] It is a second object of some embodiments of the present disclosure to provide one or more guide plates directly or indirectly on a build substrate and thereafter to form an array of probes in lateral alignment with the one or more guide plates wherein: (1) one longitudinal end of each of the probes extends into, or possibly completely through, the holes in the one or more guide plates when those ends are formed, or (2) the probes do not extend into the holes in the one or more guide plates upon formation but extend into the holes after at least partial or complete formation of the probes (e.g. upon removal of a portion of a material that holds the probes in their relative lateral positions which could be followed by relative movement of the guide plate with respect to a local longitudinal axis of the probes or a longitudinal axis of the probe array as a whole).

[14] It is an object of some embodiments of the present disclosure to laterally align one or more guide plates and MEMS probes after only partial longitudinal formation of the probes in an array configuration; and then after such lateral alignment, finishing the longitudinal formation of the probes wherein: (1 ) a portion of a masking or sacrificial material is removed after the lateral alignment of the one or more guide plates to the probes which in turn allows the one or more guide plates to be moved longitudinally so that probes extend at least partially into the through holes, if not completely through the holes, of the one or more guide plates, and thereafter continuing longitudinal formation of the probes, or (2) prior to laterally aligning the partially formed probes and the one or more guide plates, exposing the ends of the probes so that they may be engaged with one or more guide plates, and then laterally and longitudinally aligning the probes and the guide plates such that the ends of the partially formed probes extend at least part way into the holes, if not completely through holes, and thereafter continuing longitudinal formation of the probes.

[15] It is an object of some embodiments of the present disclosure to laterally and longitudinally align one or more guide plates with a plurality of completed MEMS probes that were formed together with positions corresponding to holes existing in guide plates or that will be made to exist in guide plates wherein: (1 ) a portion of a masking or sacrificial material is removed after the lateral alignment of the one or more guide plates to the probes which in turn allows the one or more guide plates to be relatively moved longitudinally so that probes extend at least partially into the through holes, after which, if necessary, further removal of masking or sacrificial material may occur to allow further longitudinal engagement of probes with the one or more guide plates, or (2) prior to laterally aligning the formed probes and the one or more guide plates, exposing the ends of the probes so that they may be engaged with one or more guide plates, and then laterally and longitudinally aligning the probes and the guide plates such that the ends of the probes extend at least part way into the holes, if not completely through holes, and thereafter, if necessary, continuing the removal of masking or sacrificial material to allow further longitudinal engagement of the probes with the one or more guide plates.

[16] It is an object of some embodiments of the present disclosure to form one or more guide plates while in lateral alignment with probe arrays where: (1) one or more guide plates are formed directly or indirectly on a probe substrate prior to the formation of the probes, (2) one or more guide plates are formed in lateral alignment with partially formed probes and are then moved longitudinally such that ends of the partially formed probes at least partially extend into the through holes of the one or more guide plates, (3) one or more guide plates are formed in lateral alignment and longitudinal alignment with the partially formed probes such that the ends of the partially formed probes at least partially extend into the through holes of the one or more guide plates, (4) one or more guide plates are formed in lateral alignment with completed probes and are then moved longitudinally such that ends of the formed probes extend through the through holes of the one or more guide plates, or (5) one or more guide plates are formed in lateral alignment and longitudinal alignment with the completed probes such that the ends of the partially formed probes extend through the through holes of the one or more guide plates as the guide plates are formed.

[17] It is an object of some embodiments of the present disclosure to form one or more guide plates while in lateral alignment with probe arrays where the formation of the one or more guide plates includes: (1 ) locating a plate of material relative to the probes and then forming through holes in the plate in lateral alignment with the locations of the probes in the probe array, (2) providing coating over the end of completed or partially formed probes to provide a temporary expansion of probe cross-section in the longitudinal position of the probes where guide plate formation is to occur, locating at least one guide plate material in depositable, flowable, spreadable, or sprayable form around at least part of the expanded cross-sectional portions of the probes; solidifying the guide plate material if not solidified upon deposition; and possibly planarizing the guide plate material before or after solidification, or (3) at a longitudinal level not occupied by probes or partially formed probes, locating a masking material in locations where through holes of a guide plate are to exist; locating at least one guide plate material in depositable, flowable, spreadable, or sprayable form around the sides of the masking material; solidifying the guide plate material if not solidified upon deposition; and possibly planarizing the guide plate material before or after solidification and thereafter removing the masking material and positioning the guide plate longitudinally to engage the partially, or completely, formed probes.

[18] It is an object of some embodiments of the present disclosure to provide improved methods of simultaneously engaging a plurality of partially formed or fully formed probes with one or more guide plates having through holes set in an intended array configuration.

[19] It is an object of some embodiments of the present disclosure to ensure that completely formed probes or partially formed probes are in an intended array configuration at the time of engaging one or more guide plates having that configuration.

[20] It is an object of some embodiments of the present disclosure to provide probe arrays having (1 ) at least one substrate to which a plurality of probes are bonded and at least one guide plate through which the plurality of probes extend and which together define an array configuration for the probes, or (2) at least a plurality of guide plates through which a plurality of probes extend to set an array configuration for the plurality of probes; and wherein the probes and the at least one guide plate have an interface that provides both lateral positioning of the probes and controlled longitudinal movement of the probes in at least one direction and, in some cases, in both directions.

[21] It is an object of some embodiments of the present disclosure to provide probe arrays having (1 ) at least one substrate to which a plurality of probes are bonded and at least one guide plate through which the plurality of probes extend and which together define an array configuration for the probes, or (2) at least a plurality of guide plates through which a plurality of probes extend to set an array configuration for the plurality of probes, wherein the probes extend, at least in part, longitudinally in a direction of layer stacking and wherein interfaces between the probes and the one or more guide plates are configured so that no layer-to-layer offset, or variation in layer-to-layer configuration unintentionally inhibits smooth motion of the probes through the one or more guide plates over a working range of motion where (1 ) the multi-layer probe is configured to have no layer boundary that would move past the edge of a guide plate over a working range of motion; or (2) the multi-layer probe has no layer boundary that moves past an edge of the guide plate where a lateral step in motion would occur (e.g. any portion moving from inside the hole to outside the hole would not have any significant step or the step would be inward so that the portion would not contact the guide plate when moving longitudinally in and out).

[22] It is an object of some embodiments of the present disclosure to provide lateral alignment and then simultaneous and longitudinal engagement of at least one guide plate with a plurality of MEMS probes or partially formed M MS probes, where the probes are formed in a lateral array configuration, and thereafter, if required, causing a lateral movement of at least one guide plate with respect to another guide plate or with respect to a substrate so as to provide a desired lateral shifting of opposite ends of the probes compared to their initial positions, and then fixing or retaining the guide plate or plates and/or substrate in final lateral configurations.

[23] It is an object of some embodiments of the present disclosure to reduce errors in probe placement prior to engaging probes and guide plates.

[24] It is an object of some embodiments of the present disclosure to reduce the time and/or effort of producing buckling beam probe arrays. [25] It is an object of some embodiments of the present disclosure to reduce the cost of production of forming buckling beam probe arrays or probe heads.

[26] It is an object of some embodiments of the present disclosure to provide improved methods of fabricating probe arrays. Some such methods may include use of only (i.e., be limited to) multi-layer, multi-material electrochemical fabrication methods that fabricate the entire probe arrays in fully configured states. Other methods may combine separately formed arrays (or subarrays) laterally with other arrays (or subarrays) to formed large, tiled arrays where lateral subarray combining may occur after sacrificial material release prior to sacrificial material release, before or after lateral shifting of guide plates relative to other guide plates or substrates. Other methods may include in situ steps or operations or post layer steps or operations that provide for conformable coating of specialized materials over probe elements, selected portions of probes or entire probes (e.g. dielectrics for isolation of probes from one another, dielectrics for electrical isolation of a portion of one probe from another portion of the same probe, e.g. for coaxial configurations, contact materials, bonding materials, adhesion enhancement materials, barrier materials, and the like). Other methods may include formation of intentionally extended single layer contact surfaces that allow uninhibited movement of slidable probe components even in the presence of unintended layer features (e.g., layer-to-layer offsets or non-perpendicular intra-layer wall configurations). Still other methods may include setting probe orientation relative to layer planes and layer stacking directions to allow optimal creation of probe and array features. Other steps or operations may be provided or features formed in probes, probe arrays, or guide plates that provide features of opposed slidable, or otherwise movable, probe elements in build locations that allow minimum feature size gaps to exist which are larger than gaps desired when the probes are in operational configurations along with formation of spring loaded stops, snap-together features, or other structures that allow enforcement of working locations or working regions that are distinct from build locations.

[27] Other objects and advantages of various embodiments of the present disclosure will be apparent to those of skill in the art upon review of the teachings herein. The various embodiments of the present disclosure, set forth explicitly herein or otherwise ascertained from the teachings herein, may address one or more of the above objects alone or in combination, or alternatively may address some other object ascertained from the teachings herein. It is not intended that all objects, or even multiple objects, be addressed by any single aspect or embodiment of the present disclosure even though that may be the case regarding some aspects.

[28] In an aspect of the present disclosure, a method of forming a probe array, comprises: (A) forming a plurality of probes on a substrate with each probe having two ends, and at least one intermediate elastically compliant portion, wherein at least one of the ends is configured as a contact end for making electric contact to a second electrical circuit element while an other end is selected from a group consisting of: (1 ) a contact end for making pressure based contact to a first electric element, and (2) an attachment end for making a fixed contact to the first circuit element, wherein the plurality of probes are formed with probe-to-probe spacings corresponding to contact elements on the second circuit element, wherein the formation of the plurality of probes comprises: forming a layered structure comprising a plurality of multi-material layers, with each multi-material layer comprising at least two materials, wherein at least one of the at least two materials is at least one structural material and at least one other of the at least two materials is at least one sacrificial material, wherein each multimaterial layer defines a cross-section of the plurality of probes; (B) providing at least one guide plate having a plurality of openings to engage the plurality of probes; and (C) after formation of all multi-material layers of the probes and after providing and engaging the at least one guide plate, separating the probes from unremoved sacrificial material; wherein (B) providing at least one guide plate is selected from a group consisting of: (i) after forming the probes but prior to the removal of all sacrificial material from the plurality of multi-material layers, positioning the at least one guide plate laterally and longitudinally over and around end portions of the probes with the end portions of the probes extending from unremoved sacrificial material; (ii) prior to forming a first layer of the plurality of multi-material layers of the probes forming the at least one guide plate over the substrate, in direct or indirect contact therewith, and then forming the probes through the openings in the at least one guide plate, wherein an end portion of the probes extends from unremoved sacrificial material; (iii) after forming the probes to have only a partial length, positioning the at least one guide plate laterally and longitudinally over and around the end portions of the partial length probes, then completing formation of the length of the probes, wherein at the time of positioning of the at least one guide plate, an end portion of the partially formed probes extends from unremoved sacrificial material; (iv) after forming the probes to have a full length, forming the at least one guide plate with the openings aligned laterally with the probes and positioned longitudinally with the openings at least partially surrounding portions of the probes while other portions of the probes remain covered with unremoved sacrificial material; and (v) after forming the probes to at least partial length, forming at least one guide plate with the openings aligned laterally with the probes but longitudinally above end portions of the probes, and thereafter exposing the end portions of the probes by removing a portion of the sacrificial material, and lowering the at least one guide plate longitudinally over and around the end portions of the probes.

[29] Numerous variations of this aspect of the invention are possible and include, for example: (1 ) forming of each multi-material layer may comprise: (a) depositing at least a first of the at least two materials; (b) depositing at least a second of the at least two materials; (c) planarizing at least two of the at least two deposited materials, including planarizing at least one structural material and at least one sacrificial material; (2) each successively formed multimaterial layer of the plurality of multi-material layers may be adhered to a previously formed multi-material layer or a non-multi-material layer that in turn may be adhered directly or indirectly to a previously formed multi-material layer; (3) the probes with a full length may be formed with an end portion extending from unremoved sacrificial material by an amount selected from a group consisting of: (a) less than a lateral dimension of an individual probe; (b) less than a lateral dimension of a spacing between adjacent probes; (c) less than a fraction of a height of a probe where the fraction is selected from a group consisting of (1 ) 1/2, (2) 1/3, (3) 1/4, (4) 1/5, (5) 1/10, and (6) 1/20; (d) less than N thicknesses of the guide plate, wherein N is selected from a group consisting of (1) 4, (2) 3, (3) 2, (4) 1 , (5) 1/2, (6) 1/3, and (7) 1/4; (e) less than an amount selected from a group consisting of 500 microns, 200 microns, 100 microns, 50, microns, 20 microns, 10 microns, and 5 microns; (4) the at least one guide plate may be positioned with the openings at least partially surrounding the probes with a full length wherein only a end portion of a longitudinal length of the probes extend from unremoved sacrificial material at the time of guide plate formation, wherein the end portion may be selected from a group consisting of: (a) less than a lateral dimension of an individual probe; (b) less than a lateral dimension of a closest spacing between adjacent probes; (c) less than a fraction of a height of a probe where the fraction is selected from a group consisting of (1) 1/2, (2) 1/3, (3) 1/4, (4) 1/5, (5) 1/10, and (6) 1/20; (d) less than N thicknesses of the guide plate, wherein N is selected from a group consisting of (1) 4, (2) 3, (3) 2, (4) 1 , (5) 1/2, (6) 1/3, and (7) 1/4; (e) less than an amount selected from a group consisting of (1 ) 500 microns, (2) 200 microns (3) 100 microns, (4) 50, microns, (5) 20 microns, (6) 10 microns, and (7) 5 microns; (5) the probes formed to at least partial length may have an end portion extending from unremoved sacrificial material by an amount selected from a group consisting of: (a) less than a lateral dimension of an individual probe; (b) less than a lateral dimension of a spacing between adjacent probes; (c) less than a fraction of a height of a probe where the fraction is selected from a group consisting of (1 ) 1/2, (2) 1/3, (3) 1/4, (4) 1/5, (5) 1/10, and (6) 1/20; (d) less than N thicknesses of the guide plate, wherein N is selected from a group consisting of (1 ) 4, (2) 3, (3) 2, (4) 1 , (5) 1/2, (6) 1/3, and (7) 1/4; (e) less than an amount selected from a group consisting of (1 ) 500 microns, (2) 200 microns (3) 100 microns, (4) 50, microns, (5) 20 microns, (6) 10 microns, and (7) 5 microns; (6) the method may further comprise, after separating the probes from unremoved sacrificial material: relative lateral shifting of the at least one guide plate with respect to the substrate to provide the probes with a desired placement, shape, and/or configuration due to lateral offsetting; (7) the method may further comprise, before separating the probes from unremoved sacrificial material: remove the substrate and a portion of the sacrificial material exposing further end portions of the probes; and positioning a further guide plate with further openings at least partially surrounding the further end portions of the probes extending from unremoved sacrificial material ; (8) the method may further comprise, after separating the probes from unremoved sacrificial material: relative lateral shifting of the at least one guide plate with respect to the further guide plate to provide the probes with a desired placement, shape, and/or configuration due to lateral offsetting; (9) forming the at least one guide plate over the substrate prior to forming a first layer of the plurality of multi-material layers of the probes may comprise: forming a masking material with opening at the desired probe locations for the probes with a required probe-to-probe spacing; positioning the at least one guide plate with openings coated by a coating material aligned with the openings of masking material; forming a patterned masking material over the at least one guide plate; and depositing structural material into the openings of the masking materials and of the at least one guide plate to partially form the probes; (10) the method may further comprise: after partial formation of the probes, removing the masking material and exposing respective end portions of the probes; depositing a sacrificial material to surround the respective end portions and fill in at least part of the gaps around the probes and the at leas one guide plate; and planarizing the sacrificial material and the structural material forming the probes to set a planar surface for a subsequent layer formation; (11) the method may further comprise: after planarizing the sacrificial material and the structural material forming the probes, forming additional layers on the planar surface, each additional layer comprising the structural material forming the probe and the sacrificial material; forming a last layer of masking material; removing the masking material to expose further end portions of the probes; and positioning a further guide plate with further openings at least partially surrounding the exposed further end portions of the probes; (12) the method may further comprise, after positioning the further guide plate and before separating the probes from unremoved sacrificial material: forming one or more additional probe layers which include structural material and sacrificial material to complete the probes; (13) the method may further comprise, after separating the probes from unremoved sacrificial material: relative lateral shifting of the at least one guide plate with respect to the further guide plate to provide the probes with a desired placement, shape, and/or configuration due to lateral offsetting; (14) the method may further comprise, before positioning the further guide plate: coating the exposed further end portions of the probes with a coating material to provide a spacing between the probes and side walls of the openings of the further guide plate; and (15) the probe array may be a two-dimensional probe array.

[30] Other aspects of the present disclosure will be understood by those of skill in the art upon review of the teachings herein and for example may include alternatives in the configurations or processes set forth herein, decision branches noted in those processes or configurations, or partial or complete exclusion of such alternatives and/or decision branches in favor of explicitly setting forth process steps or features along with orders to be used in performing such steps or connections between such features. Some aspects may provide device counterparts to method of formation aspects, some aspects may provide method of formation counterparts to device aspects, and other aspects may provide for methods of use for the probe arrays providing herein.

Brief Description of the Drawings:

[31] FIGS. 1 A - 1 F schematically depict the formation of a first layer of a structure using adhered mask plating where the blanket deposition of a second material overlays both the openings between deposition locations of a first material and the first material itself.

[32] FIG. 1G depicts the completion of formation of the first layer resulting from planarizing the deposited materials to a desired level.

[33] FIGS. 1 H and 11 respectively depict the state of the process after formation of the multiple layers of the structure and after release of the structure from the sacrificial material. [34] FIGS. 2A - 2F provide illustrations of an example set up and operation of an ELEX process for forming a plurality of longitudinally extended structures.

[35] FIG. 3 provides an illustration of an ELEX formation process that provides a structure with varying cross-sectional formation offsets (or lateral offsets) that may be generated during the formation of a longitudinally elongated structure.

[36] FIG. 4 provides a generalized flowchart for fabricating probe arrays that include a plurality of probes formed with lateral positions corresponding to an array pattern, one or more guide plates formed or positioned to engage the probes, and possibly a substrate on which the probes are formed or attached after formation.

[37] FIGS. 5A - 5J set forth a number of example probe configurations that may be used in the probe arrays of the various embodiments of the present disclosure.

[38] FIGS. 6A-1 , 6A-2, 6B-1 , 6B-2 and 6C-6H provide examples illustrating the various interfaces set forth in the block diagram of FIG. 9.

[39] FIGS. 7A - 7G provide cut side views of example results of the steps of the method according to a first embodiment.

[40] FIGS. 8A, 8B-1 , 8B-2 and 8C - 8F provide cut side views of example results of the steps of the method according to a second embodiment.

[41] FIGS. 9A, 9B, 9C-1 , 9C-2, 9C-3, 9C-4, 9D - 9H provide cut side views of example results of the steps of the method according to a third embodiment, including incorporation of a first guide plate during formation of the layers and a second guide plate from below after formation of the layers.

[42] FIGS. 10A-10C, 10E-1 , 10E-2, 10E-3, 10E-4, 10E-5, 10F, 10G-1 , 10G-2, 10G- 3 and 10H provide cut side views of example results of the steps of the method according to a fourth embodiment.

[43] FIGS. 11 A - 11 F, 11 G-1 , 11 G-2, 11 G-3, 1 1 H-1 , 11 H-2, 111 and 1 1 J provide cut side views of example results of the steps of the method according to a fifth embodiment wherein a second guide plate is added from below after release of the probe array from the build substrate.

[44] FIGS. 12A - 12H provide cut side views of example results of the steps of the steps of the method according to a sixth embodiment.

[45] FIGS. 13A - 13F provide cut side views of example results of the steps of the steps of the method according to a seventh embodiment. Detailed Description of Preferred Embodiments:

Electrochemical Fabrication in General

[46] An example of a multi-layer, multi-material electrochemical fabrication process was provided above in conjunction with the illustrations of FIGS. 1 A - 11. In some variations, the structure may be separated from the substrate. For example, release of the structure (or multiple structures if formed in a batch process) from the substrate may occur when releasing the structure from the sacrificial material particularly when a layer of sacrificial material is positioned between the first layer of the structure and the substrate. Alternative methods may involve, for example, the use of a dissolvable substrate that may be separated before, during or after removal of the sacrificial material, machining off the substrate before or after removal of the sacrificial material, or use of a different intermediate material that can be dissolved, melted or otherwise used to separate the structure(s) from the substrate before, during, or after removal of the sacrificial material that surround the structure(s).

[47] Various embodiments of various aspects of the present disclosure are directed to formation of three-dimensional structures from materials, some, or all, of which may be electrodeposited or electroless deposited (as illustrated in FIGS. 1A - 11). Some of these structures may be formed from a single build level (e.g., a planarized layer) that is formed from one or more deposited materials while others are formed from a plurality of build levels, each generally including at least two materials (e.g., two or more layers, five or more layers, and even ten or more layers). In some embodiments, layer thicknesses may be as small as one micron or as large as one hundred to two hundred microns. In still other embodiments, layers may be up to five hundred microns, one millimeter, even multiple millimeters, or more. In other embodiments, thinner layers may be used. In still other embodiments, layer thickness may be varied during formation of different levels of the same structure. In some embodiments, microscale structures have lateral features positioned with 0.1 - 10 micron level precision and minimum feature sizes on the order of microns to tens of microns. In other embodiments, structures with less precise feature placement and/or larger minimum features may be formed. In still other embodiments, higher precision and smaller minimum feature sizes may be desirable. In the present application, meso-scale and millimeter-scale have the same meaning and refer to devices that may have one or more dimensions that may extend into the 0.1 - 50 millimeter range, or somewhat larger, and features positioned with a precision in the micron to 100 micron range and with minimum feature sizes on the order of several microns to hundreds of microns.

[48] The various embodiments, alternatives, and techniques disclosed herein may form multi-layer structures using a single patterning technique on all layers or using different patterning techniques on different layers. For example, various embodiments of the present disclosure may perform selective patterning operations using conformable contact masks and masking operations (i.e. operations that use masks which are contacted to but not adhered to a substrate), proximity masks and masking operations (i.e. operations that use masks that at least partially selectively shield a substrate by their proximity to the substrate even if contact is not made), non-conformable masks and masking operations (i.e. masks and operations based on masks whose contact surfaces are not significantly conformable), adhered masks and masking operations (masks and operations that use masks that are adhered to a substrate onto which selective deposition or etching is to occur as opposed to only being contacted to it), and/or selective patterned deposition of materials (e.g. via extrusion, jetting, or controlled electrodeposition) as opposed to masked patterned deposition. Conformable contact masks, proximity masks, and non-conformable contact masks share the property that they are preformed and brought to, or in proximity to, a surface which is to be treated (i.e., the exposed portions of the surface are to be treated). These masks can generally be removed (for one or more reuses) without damaging the mask or the surface that received treatment to which they were contacted or located in proximity to. Adhered masks are generally formed on the surface to be treated (i.e., the portion of that surface that is to be masked) and bonded to that surface such that they cannot be separated from that surface without being completely destroyed or damaged beyond any point of reuse. Adhered masks may be formed in a number of ways, including: (1) by application of a photoresist, selective exposure of the photoresist, and then development of the photoresist; (2) selective transfer of pre-patterned masking material; (3) direct formation of masks from computer-controlled depositions of material; and/or (4) laser ablation of a deposited material. In some embodiments, or during the formation of some layers, structural material may be deposited directly into mask openings as illustrated in FIGS. 1 A - 1 F while in other embodiments, the sacrificial material may be deposited into mask openings, followed by removal of masking material which in turn is followed by deposition of structural material and then by planarization. [49] Patterning operations may be used in selectively depositing material and/or may be used in the selective etching of material. Selectively etched regions may be selectively filled in or filled in via blanket deposition, or the like, with a different desired material. In some embodiments, the layer-by-layer build up may involve the simultaneous formation of portions of multiple layers. In some embodiments, depositions made in association with some layer levels may result in depositions to regions associated with other layer levels (i.e., regions that lie within the top and bottom boundary levels that define a different layer’s geometric configuration).

[50] Temporary substrates on which structures may be formed may be of the sacrificial-type (i.e. destroyed or damaged during separation of deposited materials to the extent they cannot be reused), non-sacrificial-type (i.e. not destroyed or excessively damaged, i.e. not damaged to the extent they may not be reused, e.g. with a sacrificial or release layer located between the substrate and the initial layers of a structure that is formed). Non-sacrificial substrates may be considered reusable, with little or no rework (e.g., replanarizing one or more selected surfaces or applying a release layer, and the like) though they may or may not be reused for a variety of reasons.

[51] Definitions of various terms and concepts that may be used in understanding the embodiments of the present disclosure (either for the devices themselves, certain methods for making the devices, or certain methods for using the devices) will be understood by those of skill in the art.

[52] The term “longitudinal” as used herein refers to a long dimension of a probe, an end-to-end dimension of the probe, or a tip-to-tip dimension. Longitudinal may refer to a generally straight line that extends from one end of the probe to another end of the probe or it may refer to a curved or stair-stepped path that has a sloped or even changing direction along a height of the probe. When referring to probe arrays, the longitudinal dimension may refer to a particular direction the probes in the array point or extend, but it may also simply refer to the overall height of the array that starts at a plane containing a first end, tip, or base of a plurality of probes and extends perpendicular thereto to a plane containing a second end, tip, or top of the probes. The context of use typically makes clear what is meant especially to those of skill in the art. It is intended that the interpretation to be applied to the term herein be as narrow as warranted by the details of the description provided or the context in which the term is used. If, however, no such narrow interpretation is warranted, it is intended that the broadest reasonable scope of interpretation apply.

[53] The term “lateral” as used herein is related to the term longitudinal. In terms of the stacking of layers, lateral refers to a direction within each layer, or two perpendicular directions within each layer (i.e., one or more directions that lie within a plane of a layer that are substantially perpendicular to the longitudinal direction). When referring to probe arrays, laterally generally has a similar meaning in that a lateral dimension is generally a dimension that lies in a plane that is parallel to a plane of the top or bottom of the array (i.e., substantially perpendicular to the longitudinal dimension). When referring to probes themselves, the lateral dimensions may be those that are perpendicular to an overall longitudinal axis of the probe, a local longitudinal axis of the probe (that is local lateral dimensions), or simply the dimensions similar to those noted for arrays or layers. The context of use typically makes clear what is meant especially to those of skill in the art. It is intended that the interpretation to be applied to the term herein be as narrow as warranted by the details of the description provided or the context in which the term is used. If no such narrow interpretation is warranted, it is intended that the broadest reasonable scope of interpretation apply.

Generalized Probe Array and Probe Array Formation Embodiments:

[54] Probe arrays, methods of making probe arrays, and methods of using probe arrays can take on different forms in different embodiments of the present disclosure.

[55] FIG. 4 provides a generalized flowchart for fabricating probe arrays that include a plurality of probes formed with lateral positions corresponding to an array pattern, one or more guide plates formed or positioned to engage the probes, and possibly a substrate on which the probes are formed or attached after formation. The flowchart 400 of FIG. 4 includes blocks (A) - (V) with blocks (C), (D), (G), (J), (M), (P), and (S) representing enquires or decision blocks and blocks (B), (E), (H), (K), (N), (Q), and (T) representing process steps or groups of steps that may be performed, while (A) and (V) represent process initiation and termination blocks. More particularly, according to the flowchart 400, a method for fabricating probe arrays comprises one or more of the steps to

(A) define an order of operations including at least one guide plate formation or positioning operation;

(B) provide a substrate on which to directly or indirectly form arrays of probes;

(E) form a release layer on the substrate; (H) form a guide plate;

(K) position the guide plate;

(N) form the probes or portions of the probes (e.g., one or more layers) using a single layer or multi-layer electrochemical fabrication process or using a different fabrication process of choice;

(Q) remove selected material from selected regions;

(T) loop back to perform or repeat one or more processing steps or perform one or more additional processing steps (e.g. diffusion bonding, sacrificial material removal, vertical repositioning of guide plates, lateral repositioning of guide plates relative to other guide plates and/or to a sub, securing guide plate positions, cleaning, soldering or other bonding operations, probe tip shaping, layer discontinuities smoothing (e.g. by electrochemical etching or alternating etching and plating), attachment to other subs, structures or assemblies, and the like).

[56] Though not specifically indicated, at some point during the one or more loops through the process, a guide plate is to be formed or positioned with the placement or formation occurring prior to the removal of all of the sacrificial material that forms part of the layers and most preferably where sacrificial material that remains in place helps hold the probes or partially formed probes in fixed positions so that the probes are in known relative positions during guide plate formation or placement. It is not intended that the process of FIG. 4 represent a single process with all the indicated steps and enquires being made or performed, but instead it is intended to provide a framework which may be used in defining numerous alternative processes. Some such alternatives may include most of the process steps and/or decision operations while others may include a much smaller subset of the process steps along with only some or even none of the decision operations. In actual implementations, process operations, decisions, and/or processing order may be manually implemented, implemented under machine control, programmed computer or microprocessor control, or be implemented by a combination of one or more of these. Depending on the order in which process steps are to be executed, a first loop through some or all of blocks (A) - (T) may result in one or more steps being performed while one or more subsequent loops may repeat one or more steps, perform one or more other steps, or result in the performance of a combination of the two. During implementation, numerous process steps and decisions not explicitly noted in the flowchart may be performed including, for example, cleaning steps, activation steps, inspection or testing steps and outcome based decisions, removal and rework steps, and the like. In some embodiments, some steps may be split into sub-steps and only a portion of those sub-steps actually performed.

[57] A number of alternative processes may be used in forming probes. In particular, six examples of process variations (A1 ) - (A6) for forming probes according to step (N) of FIG. 4 are as follows:

(A1 ) Multi-layer, multi-material, batch, electrochemical fabrication of a plurality of probes while laterally positioned relative to one another with an array spacing (e.g. a two-dimensional area configuration) with at least one conductive sacrificial material and at least one conductive structural material forming each of a plurality of layers and with one end of the probes formed as part of an initial layer, the opposite end of the probe formed as part of a final layer, and with an intermediate portion of the probe formed as part of one or more intermediate layers, i.e. multi-layer, multi-material process including use of conductive structural material and sacrificial material(s);

(A2) Formation similar to that of (A1) but instead of using at least one sacrificial material per layer, the process uses at least one dielectric sacrificial material on at least some layers, if not on all layers, wherein the sacrificial material may be a masking material (e.g. a photoresist or other material that is located and then patterned to allow deposition of another material into openings formed therein) or some other dielectric material that is spread, deposited, sprayed, or otherwise applied or located, i.e. using a multi-layer, multi-material process including use of a conductive structural material and dielectric sacrificial material.

(A3) Multi-layer, batch, electrochemical fabrication of a plurality of probes while laterally positioned relative to one another with an array spacing with at least one conductive material forming each layer (e.g. without use of a conductive sacrificial material forming part of each layer but perhaps with a dielectric material, e.g. a masking material which may be a photoresist, not being removed as part of forming some layers and perhaps with a conductive seed layer material formed in preparation for creating some layers where the seed layers have relatively small thicknesses, e.g. < 20%, 10%, 5%, and perhaps even 1%, or less of the respective layer thicknesses) with one end of the probes formed as part of an initial layer, and the opposite end of the probe formed as part of a final layer with an intermediate portion of the probe formed as part of one or more intermediate layers, i.e. using a multi-layer process including use of a conductive structural material, possibly an unremoved masking material, and possibly one or more seed layers during the formation of layers.

(A4) Single-layer, batch, electrochemical fabrication of a plurality of probes while laterally positioned relative to one another with an array spacing and with the probes formed from at least one conductive material (e.g. with or without use of a surrounding conductive sacrificial material but perhaps with a dielectric material, e.g. a photoresist, temporarily surrounding and bridging the spaces between individual probes) with one end of the probes formed at the bottom of the layer, the opposite end formed at the top of the layer and an intermediate portion of the probe formed as part of an intermediate portion of the layer, i.e. using a single layer process.

(A5) Single-mask or multi-mask, batch electrochemical fabrication of a plurality of probes while laterally positioned relative to one another with an array spacing using electrochemical deposition into openings in the mask, or series of successively used masks, that are translated longitudinally relative to the probes at a rate substantially corresponding to the electrodeposition rate of build up of the probes from one end to the other (e.g. according to an ELEX process), i.e. a single or multi-mask process involving longitudinal translation of the mask during probe formation.

(A6) A combination of two or more of the processes of (A1 ) - (A5) as applied to different vertical or longitudinal regions of the probes (e.g. to form a probe in a two layer process, or using a combination of layers and ELEX produced structures), i.e. a combination of two or more of the processes of (1 ) - (5) in forming different longitudinal portions of the probe.

[58] More specifics concerning the above listed various alternative processes, other potential features, alternatives, and other modifications will be understood by those of skill in the art upon review of the above examples and other teachings herein. Other embodiments may use other processes for forming probes while in sub-array or array configurations.

[59] A number of example alternative examples of different build substrates on which probes may be formed may be used in step (B) of FIG. 4. In particular, four examples of built substrate variations (B1 ) - (B4) are as follows:

(B1 ) Sacrificial substrate (e.g., ceramic, metal, or semiconductor) possibly with a seed layer and/or an adhesion layer on which probes may be directly or indirectly formed.

(B2) Reusable ceramic substrate (e.g., ceramic, metal, or semiconductor) with a release layer on which probes may be directly or indirectly formed. (B3) Space transformer, interposer, or other patterned substrate on which probes may be directly or indirectly formed and permanently attached.

(B4) Conductive, dielectric, or patterned guide plate with through holes, potentially with a sacrificial backing material with blind holes or through holes, and potentially with guide plate through holes having a thin coating of a sacrificial material or non-stick material through which portions of probes may be formed or positioned.

[60] More specifics concerning the above listed various alternative substrates (B1 )- (B4), other potential features, alternatives, and other modifications will be understood by those of skill in the art upon review of the above examples and other teachings herein. Other embodiments may use other substrates for forming probes while in subarray or array configurations.

[61] A number of alternative examples of substrate transfer and/or release may be considered. In particular, six examples of relating to substrate transfer or release (C1) - (C6) that may be used in association with steps (Q) and/or (T) of FIG. 4 are as follows:

(C1 ) No transfer or release as the substrate becomes a permanent part of the array structure.

(C2) After formation and engagement of probes and possibly guide plates, removing any remaining sacrificial material and/or masking material and then separating the probes from the substrate by removing a release layer or by destructive removal of the substrate itself, e.g. after release of sacrificial material, the substrate is removed by removing a release layer or by the destructive removal of the substrate.

(C3) After formation and engagement of probes and possibly guide plates, separating the probes from the substrate by removing a release layer or by destructive removal of the substrate itself and thereafter removing any remaining sacrificial material and/or masking material, e.g. before release of sacrificial material, the substrate is removed by removing a release layer or by the destructive removal of the substrate itself which is then followed by removal of the sacrificial material.

(C4) After formation and engagement of probes and possibly guide plates, separating the probes from the substrate and removing the sacrificial material at the same time, e.g., the substrate and sacrificial material and/or masking material are removed at the same time.

(05) Prior to executing any removal operations of any of process (01 ) - (04), bond or otherwise attach a temporary or permanent substrate to some or all of the probes or to a material connected to the probes, e.g. before any removal operations, attaching the opposite ends of the probes, or a material joined to the probes, to a temporary or permanent substrate.

(C6) After removal of the substrate according to any of process (C2) - (C5), bond or otherwise attach a temporary or permanent substrate to probes or to a material connected to the probes.

[62] More specifics concerning the transfer and release examples as above listed (C1)-(C6), other potential features, alternatives, and other modifications will be understood by those of skill in the art upon review of the above examples and other teachings herein.

[63] A number of alternative examples related to tiling of subarrays to one another to form larger probe arrays may be considered. In particular, two examples of tiling variations (D1 ) - (D2) are as follows:

(D1 ) No tiling as arrays as formed from the combination of simultaneously formed probes and engaged guide plates are complete probe arrays.

(D2) Formed probes and engaged guide plates form subarrays that are laterally engaged with other subarrays to form full arrays.

[64] The above indicated second example, wherein subarrays are formed of probes and guide plates that are then laterally engaged with other subarrays to form full arrays, can comprise the following seven alternatives (DA)-(DG):

(DA) Tiling occurs after release of subarrays from their formation substrate(s) but prior to release of all sacrificial material connecting the probes.

(DB) Tiling occurs after release of subarrays from their formation substrate(s) and after release of the probes within individual subarrays from surrounding sacrificial material(s).

(DC) Tiling occurs prior to release of subarrays from their formation substrate(s) but after release of the probes within individual subarrays from surrounding sacrificial material(s).

(DD) Tiling occurs using guidance, alignment, or contact between longitudinal features or lateral features formed on, as part of, or engaged with one more of the guide plates that are being positioned relative to one another.

(DE) Tiled guide plates are held one-to-another by one or more frame structures, that as a whole, engage at least one guide plate of each subarray.

(DF) Tiled guide plates are held one-to-another by a bonding material that joins adjacent guide plates.

(DG) Tiling is implemented using a combination of two or more of (DA) - (DE). [65] In other embodiments, tiling may occur using other methods, structures, and/or components and will be apparent to those of skill in the art.

[66] A number of alternative examples of how guide plates (GPs) may be positioned relative to probes that have been formed or are being formed and alternatively how guide plates may be formed relative to probes that have been formed or are being formed may be considered. In particular, two primary placement examples (F1 ) and (F2) that may be part of steps (H) and/or (K) of FIG. 4. are as follows:

(F1) Positioning a preformed conductive, dielectric, or composite GP (e.g., a dielectric ceramic GP, a dielectric ceramic GP with selective areas provided with a metal coating, a metal GP with selective areas provided with a dielectric coating).

(F2) Positioning a preformed GP like that of (1) but with the through holes having a sacrificial material coating or non-stick material coating the surface(s) thereof.

[67] The positioning may comprise the two alternatives (FA)-(FB):

(FA) A GP is aligned with and slid longitudinally over exposed portions of probes which are held in relatively fixed lateral positions by only a relatively short distance (e.g., less than 10% to 50% of probe length) that extends beyond a substrate, sacrificial material, or a previously positioned GP that fixes the probe positions. If probe formation is not completed at the time of GP placement, it may be continued after placement.

(FB) A GP is aligned with lateral positions of probes. It is then placed longitudinally against an existing layer or substrate surface with longitudinal portions of the probes being formed potentially below the holes, through the holes, and above the holes.

[68] Moreover, two primary formation examples (G1) and (G2) that may be part of steps (H) and/or (K) of FIG. 4. are as follows:

(G1 ) A GP is formed around protruding ends of completed or of partially formed probes, e.g., prior to surrounding the ends with a sacrificial material or after removal of one or more layers of sacrificial material.

(G2) A GP is formed on a substrate or previously formed layer where the GP has been aligned with its through holes laterally positioned with respect to probe locations but without probes extending through the through holes at the time of formation.

[69] The formation methods may comprise the three alternatives (GA)-(GC):

(GA) Depositing or applying a ceramic material, e.g., as a powder liquid, or slurry (by dispensing, spraying, spreading, electrophoretic deposition, and the like), and then solidifying it or allowing it to solidify, for example, high or low temperature firing, by electrochemical means, by application of pressure, and the like.

(GB) Depositing a non-ceramic dielectric in powder or liquid form and solidifying it to form the GP by, for example: (GB1 ) applying radiation, pressure, temperature, electric currents or fields, catalysts, or other components to induce solidification or bonding, and/or (GB2) removal of solvent or other solidification or reaction inhibitors.

(GO) Optionally depositing a relatively thin conductive structural material to selected regions, e.g., by electrodeposition or PVD, depositing or applying a dielectric material and solidifying it and optionally selectively depositing a conductive structural material to the surface of the solidified dielectric to form a hybrid GP with conductive and dielectric regions.

[70] Other alternatives are possible and include, for example, placement or formation of guide plates prior to probe formation and then forming probes on them or engaged with them.

[71] A number of alternative examples of how guide plates and probes may be laterally aligned may be considered. In particular, two examples of alignment methods (H1) - (H2) are as follows:

(H1 ) During the formation of probes, alignment marks may be included on the substrate or in material forming successive layers and such alignment marks may be used to ensure layer-to-layer alignment. During formation of guide plates, in addition to forming through holes for accepting probes, additional through or blind hole patterns, or other markings, may be provided that can be aligned with alignment marks associated with the probe substrate or probe layers. The alignment marks may be identifiable in a variety of different ways such as optically, tactilely, magnetically, etc. A series of relative, longitudinal and lateral movements of the probe layers with respect to the guide plate or guide plates may be used to achieve registration and aligned mating. Other marks or indicators may additionally be used for a preliminary or rough alignment.

(H2) One or more elongated, curved or tapering structures may be used to provide alignment of probe layers with guide plates. During the formation of probe layers and guide plates, holes or notches may be formed that align with their counterparts on the opposing component(s). Elongated, curved or tapering structures may be inserted into the counterpart holes or notches in the opposing structures while the components are separated. Then as the components are brought into longitudinal proximity, any lateral misalignment will be reduced to the point that as longitudinal contact is made, lateral placement will be within a desired tolerance. The tolerance in alignment may be based in whole, or in part, on hole size compared to alignment structure size. Alternatively, angled guides in combination with an elastic bending of the guide structures can provide for spring loaded biasing that may provide enhanced or more consistent alignment.

[72] Other alignment alternatives are possible and will be apparent to those of skill in the art.

[73] In summary, the general process flow of FIG. 4 may be executed using different combinations of steps, different orders of steps, different repetitions of steps, and using different alternative implementations of steps or groups of steps as specifically set forth in the above listed examples.

[74] Here and below, relative terms like “top”, “bottom, “upper” “lower” and similar ones are intended as referring to the illustrations given in the drawings, for sake of conciseness. Similarly, terms like “left” and “right will be used still with reference to the drawings.

[75] FIGS. 5A - 5J set forth a number of example probe configurations that may be used in the probe arrays of the various embodiments of the present disclosure. More particularly, FIG. 5A depicts a straight probe formed as a single layer, FIG. 5B depicts a straight probe formed from multiple layers, FIG. 5C depicts a straight probe with a notch (e.g., for preferential bending). Moreover, FIG. 5D depicts a straight probe with a notch (e.g., for preferential bending) and with dielectric regions laterally at least partially or totally covering the probe for engaging conductive guide plate regions (e.g., in regions away from preferential bending) and FIG. 5E depicts an angled multi-layer probe with straight or vertical ends.

[76] Furthermore, FIG. 5F and 5G depict curved probes, namely narrow (C) or narrow (S) probes, FIG. 5H depicts a probe formed from multiple materials including an elastic body, tip, and a core material, FIG. 51 depicts a probe with parallel elastic beams and end tips and FIG. 5J depicts a probe with guide plate stops or stoppers and an intermediate dielectric spacer for inhibiting excessive movement or shorting of the probe.

[77] Many other probe configurations are possible and may be used in the probe arrays of the various embodiments of the present disclosure. In different embodiments, probes may include additional materials, combinations of different metals, combinations of one or more metals with one or more dielectrics, single beam structures, multiple spaced beam structures, coaxial or other shielded structures. Probes may be formed from different numbers of layers or be formed with different layer stacking orientations relative to a longitudinal axis or bending axis.

[78] A number of example probe-to-guide plate interfaces may exist in some embodiments of the present disclosure. A step of forming probes and/or positioning pins and either position or form guide plates during or after probe formation such that the probes and/or positioning pins have configurations that engage guide plate through holes to provide longitudinal guide plate positioning limits or improved plate/probe movement can be considered.

[79] In particular, eight interface variations (IA) - (IH) ranging from straight single layer probes to multi-layer probes having layer boundaries or lateral configurations that are intended to engage or avoid engagement with the guide plates in controlled ways can be realized as follows:

(IA) Form an upper end of probes or pins to have widths that can extend into the through holes of an upper guide plate while other portions of the probes have wider dimensions than corresponding dimensions of the through holes such that the configuration limits downward motion of an upper guide plate.

(IB) Form a lower end of probes or pins that have widths that can extend into the through holes of a lower guide plate while other portions of the probes have wider dimensions than corresponding dimensions of the through holes such that the configuration limits upward motion of a lower guide plate.

(IC) Form probes or pins with wider feature(s) than corresponding dimensions of a through hole in an upper guide plate that is to be formed or placed, then form or place the guide plate, then continue forming the probes or pins with regions extending through the through holes and with at least one or more having a wider feature than a corresponding dimension of a through hole in an upper guide plate that was previously formed or placed such that the upper guide plate has its longitudinal motion limited from both above and below.

(ID) Form probes or pins with wider feature(s) than corresponding dimensions of a through hole in a lower guide plate that is to be formed or placed, then form or place the guide plate, then continue forming the probes or pins with at least one or more having a wider feature than a corresponding dimension of a through hole in the lower guide plate that was previously formed or placed such that the lower guide plate has its longitudinal motion limited from both above and below. (IE) Form one or more probes or pins in a manner analogous to any of (A) - (D) but where the guide plate or plates are intermediate guide plates.

(IF) Form probes from a single layer or at least critical portions of the probes from a single layer (e.g., so that any presence of layer discontinuities do not interfere with probe movement through the guide plate(s).

(IG) Form probes so a layer-to-layer interface region remains within the through holes of a guide plate and thus does not go from below or above the guide plate to within the through holes.

(IH) Forming probes where layer-to-layer interface regions that can transition from inside-to-outside or outside-to-inside of through holes are configured such that such transitions do not result in a movement interfering stair step transition.

[80] Other variations are possible and will be apparent to those of skill in the art upon review of the teachings herein.

[81] FIGS. 6A-1 , 6A-2, 6B-1 , 6B-2 and 6C-6H provide examples illustrating the various interfaces, in particular probe-to-guide-plate interfaces. In particular, FIG. 6A-1 depicts a probe formed with wider bodies than upper tips (e.g., to act as upper stops for probe movement through an upper guide plate) and FIG 6A-2 depicts a probe formed with wider body portions than upper tips (e.g., to act as upper stops for probe movement through an upper guide plate). FIGS. 6B-1 and 6B-2 depict probes formed with wider bodies than lower tips (e.g., to act as lower stops for probe movement through a lower guide plate). FIG. 60 depicts probes with one or more laterally expanded or narrowed regions (or both) to provide upper or lower motion stops (with different configurations in lateral X and Y directions) and FIG. 6D depicts a probe with narrowed and expanded regions and guide plates formed or located during formation of probes to provide for limited range of longitudinal motion in one or both directions, where the expanded regions ER could be narrow in perpendicular dimension to provide preferential bending.

[82] Moreover, FIG. 6E depicts a probe which is formed from a single layer, FIG. 6F depicts a probe having guide plate interface regions, through the entire range of longitudinal motion, that are effectively constrained to movement within a single layer, the portions P1 and P2 Hof the probe being involved in movement between the highest range of motion H1 for a top and lowest range of motion L1 for a bottom of a first guide plate, and the highest range of motion H2 for a top and lowest range of motion L2 for a bottom of a second guide plate, respectively, being made of a single layer. Furthermore, FIG. 6G depicts a probes having guide plate interface locations, through an entire range of longitudinal motion, constructively limited to movement of the guide plate such that a layer-to-layer interface is limited to a range and does not travel from below the guide plate to a bottom edge of the guide plate, from above the guide plate to an upper edge of the guide plate (i.e. the layer-to-layer interface remains above, below, or within the thickness of the guide plate) and FIG. 6H depicts a probe with a guide plate-to-probe interface region formed with a transition in structural size from larger to smaller (to provide an inward offset on each side) such that (1 ) the larger region is always located within an opening in the guide plate and (2) such that an edge of the guide plate never encounters a motion inhibiting stair step transition (if the probe moves through the guide plate at an angle, it may only be necessary for one side of the probe to have an inward offset), PL indicating in the figure the position of the layer interface that is movable through the range.

[83] The above described variations may be mixed and matched, and mixed and matched to selected steps and/or process examples, to provide numerous probe array configurations, probe array formation methods, and/or probe array usage embodiments.

Specific Embodiment Examples:

[84] To further enhance understanding of the scope of the generalized embodiments discussed above, specific illustrative examples are set forth below.

[85] According to a first specific embodiment of the present disclosure, a method for forming a probe array with guide plate(s) inserted from above after probe formation and after partial removal of a sacrificial material comprises the following steps (E1 A) - (E1G):

(E1 A) providing a substrate onto which probes may be formed;

(EI B) forming probes (e.g., vertical probes) on the substrate using a multi-layer, multimaterial electrochemical fabrication process (including use of at least one structural material and one sacrificial material per layer) where the probes have lateral probe-to-probe positions that correspond to intended array positions;

(EI C) removing sacrificial material from one or more of the upper most layers of sacrificial material to expose an upper portion of the probes while still leaving a majority of each of the plurality of probes encased in sacrificial material;

(EI D) laterally positioning at least one guide plate over the upper most tips of the probes such that probe tips are aligned with through holes in the guide plates;

(EI E) lowering the at least one guide plate over the upper ends of the probes; (EI F) removing the remaining sacrificial material from the array of probes (and possibly heat treating probes); and

(EI G) performing any additional processing steps (e.g., those noted in FIG. 1 ), e.g., optionally laterally offsetting the guide plate and the substrate.

[86] Numerous variations of this embodiment are possible, for example: (1 ) additional steps may be added; (2) alternative steps may be used; (3) alternative step orders may be used; (4) steps may be sub-divided into more focused tasks or operations; (5) alternative probe materials, sacrificial materials, and or masking materials may be used in the formation of one or more layers or portions of layers to allow, for example, enhanced probes to be formed or more controlled or even staged material removal to provide more controlled or reliable guide plate insertion and positioning; (6) alternative probe configurations may be used for some or all probes, (7) some probes may have different longitudinal starting positions or ending positions, (8) probes may have contact tips or mounting ends formed with specific configurations for contact specific surfaces, to provide specific functionality, and/or be formed from specific material, e.g. abrasion resistant materials, low contact resistant materials, and the like; (9) both ends of the probe may have contact tips as opposed to one contact tip and one mounting end; (10) bottoms of probes may not only remain attached to a substrate but have their bottom ends remain encased in a dielectric support material; (1 1 ) regions between probes may be partially or completely filled with compressible dielectric material, for example, to aid in providing elastic force or to aid in ensuring non-shorting between closely spaced probes upon deflection; (12) probe arrays may have uniform spacings between all probes; (13) probe arrays may have gaps in probe positions; (14) probe arrays may include probes with non-uniform spacings, e.g. varying pitch; (15) probe arrays may have probe tips configured in onedimensional configurations (N x 1); (16) probe arrays may have probe tips configured in two- dimensional arrays (N x M); (17) one or two dimensional arrays may have tips located at more than one longitudinal plane; (18) arrays may have only a small number of probes, e.g. under 10, a moderate number of probes, e.g. tens to hundreds, a large number of probes, e.g. hundreds to thousands, or even a very large number of probes, e.g. from thousands to tens- of-thousands or more; (19) probes may be formed from as little as one layer or as many as tens of layers, or more; (20) probes may be formed from planarized layers or non-planarized layers; (21 ) layers may include sacrificial material of a variety of types or may use no sacrificial material; (22) more than one guide plate may be inserted; (23) more than one guide plate may be used and inserted and initially located at final longitudinal levels or they may be initially located and thereafter moved to final longitudinal positions, for example after further removal of sacrificial material or lateral shifting of other guide plates; (24) the substrate may be removed in favor of insertion of, or formation of, one or more additional guide plates, prior to probe formation, during probe formation or after probe formation, where insertion may occur from above or below and formation may occur while probes are engaged or before engagement occurs; (25) lateral alignment and longitudinal alignment of guide plates and probes may be separated by a variety of intermediate steps or operations; and/or (26) some or all single guide plates may be replaced by composite or paired guide plates that are laterally and/or longitudinally positionable relative to one another, or that are held in fixed lateral and/or longitudinal positions relative to one another at the time of positioning (e.g. due to fixturing or due to a material located at least in part therebetween which may be removed or retained after positioning and which in the case of retention may provide, in addition to configurational stability, general conductive and or dielectric properties to the guide plate assembly and associated probes and/or specific electrical connection or isolation of selected probes relative to the guide plates or to one another). Other possible variations include those allowed in the generalized flowchart of FIG. 4 and/or the steps set forth in the other specific embodiments.

[87] FIGS. 7A - 7G provide cut side views of example results of the above indicated steps (E1 A) - (E1 G). In particular, in this example, the formation of an array of probes 200 (exemplified with five probes 100) occurs via the formation of a layered structure 150 comprising multiple layers (exemplified with five layers L1-L5) and where the probes are to be held at their lower ends, or contact tip 100A, by a substrate 120 at suitable probe locations 120A and laterally positioned near their upper ends, or contact heads 100B, by a guide plate 220 that will allow elastic compression of a body 100C of the probes 100, the body 100C extending between the upper and lower ends, 100B and 100A of the probe 100, when the probes 100 are made to contact an electronic component, such as a device under test DUT and an interface element to a test circuity such as a space transformer, an interposer or a FOB connected thereto (not shown).

[88] Suitably, the probe locations 120A are established so that the probes have a lateral probe-to-probe spacing PS corresponding to an intended array spacing, and thus corresponding to contact elements on the circuit element to be contacted. Moreover, each layer L1 -L5 of the layered structure 150 is a multi-material layer and comprised at least a structural material 130, in particular adapted to form the probes 100, and a sacrificial material 140. Furthermore, each successively formed multi-material layer L1 -L5 is adhered to a previously formed multi-material layer or a non-multi-material layer that in turn is adhered directly or indirectly to a previously formed multi-material layer.

[89] In particular, the following states of the process can be seen with each being associated with a corresponding step (E1A)(E1G): (1 ) a substrate 120 after being supplied (FIG. 7A), (2) probes 100 and surrounding sacrificial material 140 after buildup of a number of multi-material layers L1 -L5 on the substrate 100 at the plurality of probe locations 120A (FIG. 7B), (3) some upper layers without sacrificial material 140 due to removal of a portion of the sacrificial material at a top or upper portion 100U of the probes 100 including the upper end 100B leaving unremoved sacrificial material 140B (FIG. 7C), for example by dissolving or ablation, (4) a guide plate 220 after lateral placement above the probes 100, the guide plate 200 having through holes or openings 220A in correspondence of the upper ends 100B of the probes 100 (FIG. 7D), (5) the guide plate 220 after longitudinal placement around the probe upper ends 100A in particular around the topo portion 100U thereof (FIG. 7E), (6) a completed or partially completed array 200 without sacrificial material due to the removal of the unremoved sacrificial material 140B (FIG. 7F), and (7) the probe array 200 in an uncompressed operational state after an optional relative lateral shifting SH that provides the probes 100 with a desired placement, shape, and/or configuration (FIG. 7G), for instance by a lateral shifting of the guide plate 220. In other variations (not shown), for example, the shaping of the probes 100 by displacement of the guide plate 220 may provide only elastic deformation or possibly some amount of plastic deformation; the lateral displacement of the probes 100 may be at an initial level that is greater than a final level such that elastic deformation is reduced or even eliminated; structures may be used to hold the guide plate 220 at a desired longitudinal height above the substrate 120; structures may be used to hold the guide plate 220 and the substrate 120 at intended lateral offsets; and any additional support structures may located laterally beyond the probes 100 and/or may be located laterally intermediate to the probes 100.

[90] According to a second specific embodiment of the present disclosure a method for forming a probe array with a guide plate 220 inserted from above after probe formation but without initial removal of sacrificial material 140 since no sacrificial material was used in the formation of one or more of the final layers of the probe comprises the following steps (E2A) - (E2F) for forming probes and engaging the guide plate: (E2A) providing a substrate onto which probes may be formed;

(E2B) forming probes (e.g. vertical probes) on the substrate using a multi-layer, multimaterial electrochemical fabrication process (including use of at least one structural material and at least one sacrificial material per layer where the sacrificial material on one or more final layers may be different from that on prior layers, e.g. a masking material such as a photoresist may be retained on the final layers while a conductive sacrificial material may be used on prior layers) where the probes have a lateral probe-to-probe spacing corresponding to an intended array spacing;

(E2C) laterally positioning at least one guide plate over the upper most tips of the probes such that probe tips are aligned with through holes in the guide plates;

(E2D) lowering the at least one guide plate over the upper ends of the probes,

(E2E) removing remaining sacrificial material from the array of probes; and

(E2F) performing any additional processing steps.

[91] FIGS. 8A, 8B-1 , 8B-2 and 8C - 8F provide cut side views of example results of the above listed steps (E2A)-(E2F). In particular, in this example, the formation of an array of probes 200 (exemplified with five visible probes 100) occurs via the formation of a layered structure 150 comprising a plurality of layers (exemplified with five layers L1-L5) where the probes 100 are to be held at their lower ends, or contact tips 100A by a substrate 120 at suitable probe locations 120A and laterally positioned near their upper ends, or contact heads 100B, by a guide plate 220 that allows elastic compression of the probes 100 when the probes 100 are made to contact an electronic component (not shown).

[92] Suitably, the probe locations 120A are established so that the probes have a lateral probe-to-probe spacing PS corresponding to an intended array spacing, and thus corresponding to contact elements on the circuit element to be contacted. Moreover, each layer L1 -L5 of the layered structure 150 is a multi-material layer and comprised at least a structural material 130, in particular adapted to form the probes 100, and a sacrificial material 140. Furthermore, each successively formed multi-material layer L1 -L5 is adhered to a previously formed multi-material layer or a non-multi-material layer that in turn is adhered directly or indirectly to a previously formed multi-material layer.

[93] In particular, the following states of the process can be seen and with each being associated with a corresponding step (E2A)-(E2F): (1) a substrate 120 after being supplied (FIG. 8A), (2) probes 100 with surrounding material 140, in particular unremoved sacrificial material 140B (i.e., part of the lower three layers L3-L5 of the example) or masking material 142 (i.e., part of the upper two layers L1 -L2 of the example) after the formation of a number of multi-material layers L1 -L5 on the substrate 120 (FIG. 8B-1 ), where layers formed with structural material 130 and unremoved sacrificial material 140B on lower layers L3-L5 or masking material 142 (e.g. photoresist) on upper layers L1 -L1 are still retained, (3) probes 100 having exposed ends, in particular top or upper portions 100U due to the removal of masking material 142 from the two upper layers L1 -L2 (FIG. 8B-2), (4) a guide plate 220 having through holes or openings 220A with after lateral placement above the probes 100, the through holes or openings 220A being in correspondence of the upper ends 100B of the probes 100 (FIG. 8C), (5) the guide plate 220 after longitudinal placement around the upper portions 100U of the probes 100 (FIG. 8D), (6) the completed, or partially completed, probe array 200 without sacrificial material 140 due to the removal of the unremoved sacrificial material OB (and possibly heat treating) (FIG. 8E), and (7) the probe array 200 in an uncompressed operational state (i.e. without longitudinal compression) after an optional relative lateral shifting SH that provides the probes 100 with a desired placement, shape, and/or configuration due to lateral offsetting of the guide plate 220 relative to substrate 120 (FIG. 8F).

[94] According to a third specific embodiment of the present disclosure, a method for forming a probe array with a guide plate(s) inserted from below after probe formation comprises the following steps (E3A) - (E3H):

(E3A) providing a substrate onto which probes will be formed (which may include a release layer);

(E3B) forming probes (e.g., vertical probes) on the substrate using a multi-layer, multimaterial electrochemical fabrication process (including use of at least one structural material and one sacrificial material per layer) where the probes have a lateral probe-to-probe positioning corresponding to holes in a guide plate;

(E3C) removing the substrate from the probe array (may or may not be preceded by attaching a permanent substrate (e.g. a space transformer), temporary substrate, or carrier to the upper portion of the probe layers or insertion of an upper guide plate) and may or may not involve the destructive removal of the substrate or removal of a release layer between the substrate and the first layer of probes; (E3D) removing sacrificial material from one or more of the lower most layers of sacrificial material (if not already removed) to expose a lower portion of the probes while still leaving a majority of each of the plurality of probes encased in sacrificial material;

(E3E) laterally positioning a guide plate under the lower most portion of the probes such that probe tips are aligned with through holes in the guide plates;

(E3F) raising the at least one guide plate over the lower ends of the probes;

(E3G) removing remaining sacrificial material from the array of probes, and

(E3H) performing any additional processing steps.

[95] FIGS. 9A, 9B, 9C-1 , 9C-2, 9C-3, 9C-4, 9D-9H provide cut side views of example results of the above indicated steps along with more specific implementation examples of step (E3C) via the illustrations of FIG. 9C-1 to FIG. 9C-4 which provide for incorporation of an additional guide plate 240. In this example, the formation of an array 220 of probes 100 (exemplified by five visible probes) occurs via the formation of a layered structure 150 comprising a plurality of layers L1-L5 realized at suitable probe locations 120A on a substrate 120, where the probes 100 are to be held at their lower ends 100B by the additional or lower guide plate 240 and at their upper ends 100B by an upper guide plate 220 that will allow elastic compression of the probes 100 from both the top and the bottom when the probes 100 are made to contact upper and lower electronic components (not shown) directly or indirectly (e.g. through connections to such components, e.g. via interposers or space transformer) wherein states of the process associated with each of the previously indicated steps or groups of steps can be seen: (1 ) a substrate 120 after being supplied (FIG. 9A), (2) probes 100 and surrounding sacrificial material 140 after buildup of a number of multi-material layers L1 -L5 on the substrate 120 at location 120A (FIG. 9B), (3) probes 100 with top or upper portions 100U exposed due to the removal of an upper portion of the sacrificial material, unremoved sacrificial material 140B (FIG. 9C-1 ), (4) an upper guide plate 220 with trough holes or openings 220A after lateral placement above the probes 100 (in the shown example, a single upper guide plate is provided but in alternative embodiments, multiple guide plates could be inserted and thereafter longitudinally positioned with desired longitudinal spacing) (FIG. 9C-2), (5) the upper guide plate 220 engaging the upper portions 100U of the probes 100 after longitudinal placement with the through holes or openings 220A around the upper portions 100U (FIG. 9C-3), (6) partially completed probe array 200 after removal of the substrate 120, being a build substrate, partially completed probe array 200 comprising the probes 100, the upper guide plate 220 and the unremoved sacrificial material 140B (FIG. 9C-4), (7) the partially completed probe array 200 after removal of a lower portion of the unremoved sacrificial material MOB exposing the lower ends 100A of the probe and leaving a reduced portion 140C of the unremoved sacrificial material 140B (FIG. 9D), (8) a lower guide plate 240 with through holes or openings 240A after lateral placement below the probes 100 (in the shown example, a single lower guide plate is provided but in alternative embodiments, multiple guide plates could be inserted and thereafter longitudinally positioned with desired longitudinal spacing) (FIG. 9E), (9) the lower guide plate 240 with through holes or openings 240A around bottom or lower portions 100L of the probes 100 comprising the lower ends 100A after longitudinal placement (FIG. 9F), (10) the completed or partially completed probe array 200 after removal of the reduced portion 140C of the unremoved sacrificial material MOB and possibly performing other operations (like heat treating) (FIG. 9G), and (11 ) the probe array in an uncompressed operational state after an optional relative lateral shifting that provides the probes 100 with a desired placement, shape, and/or configuration due to the lateral offsetting SH1 , SH2 of one or both guide plates 220, 240 (FIG. 9H).

[96] As previously, the probe locations 120A are established so that the probes have a lateral probe-to-probe spacing PS corresponding to an intended array spacing, and thus corresponding to contact elements on the circuit element to be contacted. Moreover, each layer L1 -L5 of the layered structure 150 is a multi-material layer and comprised at least a structural material 130, in particular adapted to form the probes 100, and a sacrificial material 140. Furthermore, each successively formed multi-material layer L1 -L5 is adhered to a previously formed multi-material layer or a non-multi-material layer that in turn is adhered directly or indirectly to a previously formed multi-material layer.

[97] A fourth specific embodiment of the present disclosure related to a method for forming a probe array with a guide plate inserted prior to probe formation so that the probes may be formed while engaged with the guide plate comprising the following steps (E4A) - (E4H):

(E4A) providing a substrate onto which probes are to be formed;

(E4B) forming a release layer on the substrate (under the assumption that the substrate will be removed). In some alternative embodiments, the substrate could be retained as part of the array with the inserted guide plate functioning as something other than a lower guide plate, e.g., a stabilizing guide plate, an intermediate guide plate or an upper guide plate; (E4C) forming probe tip holes partially into the release layer or into a layer of masking material on the release layer;

(E4D) inserting a guide plate on the release layer or on the patterned masking material layer and ensuring attachment of the guide to the layer and potentially providing guide plate through holes with a coating of sacrificial material or masking material having a desired width to form a space or gap of desired dimension to allow relative movement of the probes through the guide plate once the sacrificial material is removed. In other alternative embodiments, multiple guide plates could be initially inserted and then longitudinally spaced after probe formation and removal of sacrificial material. In still other embodiments, the coating on through hole surfaces may be formed from a photoresist that is patterned. In still other embodiments, the order of steps (E4C) and (E4D) could be reversed;

(E4E) forming probe tips in the probe tip holes through the through holes in the guide plate (and potentially through any overlaying masking material which may thereafter be replaced by sacrificial material which may then be planarized);

(E4F) forming the remaining portions of the probes (e.g., vertical probes) using one or more selected electrochemical fabrication processes;

(E4G) removing the substrate from the probe array (may or may not be preceded by attaching a permanent substrate (e.g., a space transformer), temporary substrate, or carrier to the upper portion of the probe layers or insertion of an upper guide plate) and removing sacrificial material from the array of probes; and

(E4H) performing any additional processing steps.

[98] FIGS. 10A-10C, 10E-1 , 10E-2, 10E-3, 10E-4, 10E-5, 10F, 10G-1 , 10G-2, 10G- 3 and 10H provide cut side views of example results of the steps set forth in steps (E4A) - (E4H) along with more specific examples in implementing block (E4E) via illustrations of FIG. 10E-1 to FIG. 10E-5 which provide for structural material deposition preparation and completion of formation of a planar layer and more specific examples for implementing block (E4G) via illustrations of FIG. 10G-1 to FIG. 10G-3 including operations for incorporating an additional lower guide plate 240 and removing the build substrate 120. In this example, the formation of an array 200 of a plurality of probes 100 (exemplified by five probes) occurs via the formation of a layered structure 150 comprising multiple layers L1 -L4 (exemplified by four build layers formed above a planarized base structure) which engage upper and lower guide plates 220, 240 such that elastic compression of the probes 100 from both the top and the bottom can occur when the probes 100 are made to contact upper and lower electronic components (not shown) directly or indirectly and wherein the following process states, associated with the steps, or groups of steps (E4A) - (E4H) can be seen: (1) a substrate 120 after being supplied (FIG. 10A), (2) a sacrificial layer 122 formed or applied to the substrate 120 (FIG. 10B), (3) a masking material 142 after being supplied and patterned so the holes or openings 142A can be formed in a layer of the masking material 142 and eventually receive a probe material, the opening 142A of the masking material 142 thus defining probe locations 122A on the sacrificial layer 122 where the probes 100 will be formed, as explained below (FIG. 10C), (4) a guide plate, in particular a lower guide plate 240, with through holes or openings 240A suitably coated by a coating material 144 after lateral and longitudinal positioning of the lower guide plate 240 in such a way that the through holes or openings 240A of the lower guide plate 240 are aligned with the openings 142A of the layer of masking material 142 (FIG. 10D), (5) a patterned masking material 142 after formation over the lower guide plate 240, the masking material 142 comprising a first layer 142’ positioned under the lower guide plate 240 and a second layer 142” positioned above the plate and having correspondingly aligned openings, still indicated as 142A (in some alternative embodiments, the patterning of all layers of masking material 142 could have occurred simultaneously) (FIG. 10E-1 ), (6) probe/tip material after being deposited into the openings 142A in the masking materials 142 and into the through holes or openings 240A of the lower guide plate 240 to partially form the probes 100 (FIG. 10E-2), (7) the partially formed probe array 200 after masking material 142 is removed, in particular from lower portions 100L and upper portions 100U of the probes 100 (FIG. 10E-3), (8) sacrificial material 140 after being deposited to fill in at least part of the gaps around the upper and lower portions 100U, 100L of the partially formed probes 100 and the lower guide plate 240 (FIG. 10E-4), (9) the structural material of the probes 100 and the sacrificial material 140 after planarization to set a planar surface 200U of the partially formed probe array 200 comprising a planarized portion 140D of sacrificial material 140 for a subsequent layer formation (FIG. 10E-5), (10) the partially formed probe array 200 after additional probe layers L1 -L4 have been formed onto the planarized portion 140D of the sacrificial material 140 with all layers but the last or upper layer L1 including in turn sacrificial material 140 (different from a masking material 142) on lower layers L2-L6 and masking material 142 retained on last layer L1 , (FIG. 10F), (11) the partially formed probe array 200 after masking material 142 has been removed from the last layer L1 , leaving unremoved sacrificial material 140B, to prepare the upper portions 100U of the probes 100 for receiving a further guide plate, in particular an upper guide plate 220, while the lower portions 100L of the probes 100 remain held in place by the sacrificial material 140, in particular by its planarized portion 140D (FIG. 10G-1 ), (12) the upper guide plate 220 with through holes or openings 220A after lateral and longitudinal positioning to engage with the upper portions 1001) of the probes 100 (FIG. 10G-2), (13) the completed or partially completed probe array 200 after the substrate 120, the sacrificial layer 122 and unremoved sacrificial material OB and planarized portion 140D have been removed (and possible other processing steps performed, such as heat treating) (FIG. 10G-3), and (14) the probe array 200 in an uncompressed operational state after an optional relative lateral shifting that provides the probes 100 with a desired placement, shape, and/or configuration due to the upper and lower guide plates 220, 240 which are optionally laterally offset SH1 , SH2 (FIG. 10H).

[99] Suitably, the probe locations 122A are established so that the probes have a lateral probe-to-probe spacing PS corresponding to an intended array spacing, and thus corresponding to contact elements on the circuit element to be contacted. Moreover, each layer L1 -L5 of the layered structure 150 is a multi-material layer and comprised at least a structural material 130, in particular adapted to form the probes 100, and a sacrificial material 140. Furthermore, each successively formed multi-material layer L1 -L5 is adhered to a previously formed multi-material layer or a non-multi-material layer that in turn is adhered directly or indirectly to a previously formed multi-material layer.

[100] A fifth specific embodiment of the present disclosure relates to a method for forming a probe array with guide plate(s) inserted from above and after partial formation of the probes followed by completion of the probes and removal of a build substrate which may in turn be followed by addition of further stabilizing elements according to steps (E5A) - (E5J) as follows:

(E5A) providing a substrate onto which probes are to be formed;

(E5B) forming a release layer on the substrate;

(E5C) forming part of the longitudinal length of the probes using one or more selected electrochemical fabrication processes where the probes have a lateral probe-to-probe positioning corresponding to positions of through holes in a guide plate;

(E5D) optionally removing a portion of the sacrificial material surrounding an upper most portion of the partially formed probes. If a sufficient portion of the partially formed probes was never surrounded by sacrificial material (e.g., only masking material was present), this step need not be performed;

(E5E) laterally positioning one or more guide plates for insertion onto the partially formed probes;

(E5F) longitudinally moving the guide plate(s), relative to the partially formed probes, to locate at least part of the partially formed probes into the through holes of the one or more guide plates;

(E5G) gorming the remaining portions of the probes which may start with deposition of a sacrificial material and planarization of both the sacrificial material and the ends of the partially formed probes that extend above the upper surface of the one or more guide plates;

(E5H) removing the substrate from the probe array along with some of the sacrificial material around the bottom of the probes (may or may not be preceded by attaching a permanent substrate (e.g., a space transformer), temporary substrate, or carrier to the upper portion of the probe layers or insertion of an upper guide plate);

(E5I) removing remaining sacrificial material from the array of probes; and

(E5J) performing any additional processing steps.

[101 ] FIGS. 11 A — 11 F, 11 G-1 , 11G-2, 11G-3, 11 H-1 , 11 H-2, 1 11 and 11 J provide cut side views of example results of the steps set forth in steps (E5A) - (E5J) along with more specific examples for implementing step (E5G) via the illustrations of FIG. 11 G-1 to FIG. 1 1G- 3 wherein additional steps are provided to create a planar surface for formation of additional probe layers, and with more specific examples for implementing block (E5H) via the illustrations of FIG. 11 H-1 to FIG. 11 H-2 wherein a lower guide plate is provided. In particular, in this example, the formation of an array 200 of a plurality of probes 10 (exemplified with five probes) occurs via the formation of a layered structure 150 comprising multiple layers (exemplified with five layers L1 -L4,L+) and where the probes 100 are to be held at their lower portions by a lower guide plate 240 and their upper portions by an upper guide plate 220 that will allow elastic compression of the probes from both the top and the bottom when the probes 100 are made to contact upper and lower electronic components directly or indirectly wherein the following states of the process can be seen with each being associated with a corresponding step, or groups of steps, set forth in steps (E5A)-(E5J): (1 ) a substrate 120 after being supplied (FIG. 11 A), (2) a sacrificial layer 122 after formation on the substrate 120 (FIG. 11 B), (3) probes 100 and surrounding sacrificial material 140 after buildup of a number of multi-material layers L1 - L4, the probe 100 being provided at suitable probe locations 122A on the sacrificial layer 122 (FIG. 1 1C), (4) exposed upper portions 100U of the probes 100 after removal of an upper portion, in particular the upper layer L1 , of the sacrificial material 140 (FIG. 1 1 D), (5) an upper guide plate 220 after lateral placement above the probes 100, with the upper guide plate 220 having through holes or openings 220A in correspondence of the upper portions 100U of the probes 100 (FIG. 1 1 E), (6) the upper guide plate 220 engaging the upper portions 100U of the probes 100 after longitudinal placement with the through holes or openings 220A of the upper guide plate 220 surrounding the upper portions 100U of the probes 100 (FIG. 11 F), (7) sacrificial material filling in, at least in part, the gaps around the upper portions 100U of the partially formed probes 100 and the upper guide plate 220 forming a top portion OT of the sacrificial material 140 (including depositing of a seed layer if necessary). (FIG. 11 G-1 ), (8) the structural material of the probes 100 and the sacrificial material 140 after planarization to set a planar surface 200U of the partially formed probe array 200 for a subsequent layer formation (FIG. 11 G-2), (9) the partially formed array 200 with one or more additional probe layers (one L+ in this example) which include structural material and sacrificial material to complete the probes 100 (FIG. 11 G-3), (10) the partially formed array 200 after removal of the build substrate 120 and sacrificial layer 122 (retaining at least a portion of unremoved sacrificial material 1406, e.g. to hold the probes together) (FIG. 11 H-1 ), (11 ) the partially formed array 200 after removal of a lower portion of the unremoved sacrificial material 1406, in particular in correspondence of the lower portions 100U of the probes 100, along with lateral and longitudinal placement of a lower guide plate 240 (optional step) (FIG. 11 H-2), (12) the completed, or partially formed, probe array 200 after removal of the unremoved sacrificial material 1408 (and possibly performing other operations like heat treating) (FIG. 111), and (11) the probe array 200 in an uncompressed operational state after an optional relative lateral shifting that provides the probes 100 with a desired placement, shape, and/or configuration by laterally offsetting SH1 , SH2 the upper and lower guide plates 220, 240 (and lock them into place - not shown) (FIG. 11 J).

[102] Suitably, the probe locations 120A are established so that the probes have a lateral probe-to-probe spacing PS corresponding to an intended array spacing, and thus corresponding to contact elements on the circuit element to be contacted. Moreover, each layer L1 -L5 of the layered structure 150 is a multi-material layer and comprised at least a structural material 130, in particular adapted to form the probes 100, and a sacrificial material 140. Furthermore, each successively formed multi-material layer L1 -L4,L+ is adhered to a previously formed multi-material layer or a non-multi-material layer that in turn is adhered directly or indirectly to a previously formed multi-material layer.

[103] A sixth specific embodiment of the present disclosure relates to a method for forming a probe array including the formation of a guide plate around a selected longitudinal portion of the probes according to steps, (E6A) - (E6H) as follows:

(E6A) providing a substrate onto which probes may be formed;

(E6B) forming part of the longitudinal length of the probes using one or more selected electrochemical fabrication processes where the probes have a lateral probe-to-probe positioning corresponding to positions intended for probes in the array;

(E6C) optionally removing a portion of the sacrificial material surrounding an upper most portion of the partially formed probes;

(E6D) coating the exposed probe ends with a coating of a conductive or dielectric sacrificial material;

(E6E) forming a guide plate with portions of the partially formed probes extending through the guide plate through holes (e.g., according to one of the variations noted in FIG. 4A (3));

(E6F) removing the probe end coating material;

(E6G) as necessary, forming the remaining portions of the probes which may start with deposition of a sacrificial material and planarization of both sacrificial material and ends of the partially formed probes that extend above the upper surface of the one or more guide plates so that a planarized layer exists on which to start formation of additional layers; and

(E6H) removing remaining sacrificial material from the array of probes and performing any additional processing steps.

[104] FIGS. 12A - 12H provide cut side views of example results of the steps set forth in the above listed steps (E6A) - (E6H). In particular, in this example, the formation of an array 200 of probes 100 (exemplified by five probes) occurs via the formation of a plurality of layers (exemplified by four layers L1 -L4) where the probes 100 are to be held at their lower ends by a substrate 120 and laterally positioned near their upper ends, or contact ends, by a guide plate, in particular a upper guide plate 220, that is formed around the probes 100 near their upper ends which allows elastic deformation of the probes when made to directly or indirectly contact an electronic component wherein the following states of the process associated with a corresponding one step or group of steps (E6A) - (E6H) can be seen: (1) a substrate 120 after being supplied (FIG. 12A), (2) a plurality of layers located on the substrate 120 after formation of a plurality of multi-material layers L1-L4 including a surrounding sacrificial material 140 on all layers but a last or upper layer L1 which retains a masking material 142 used in the deposition of its structural material, e.g. layers formed with sacrificial material 140 on lower layers L2-L4 and masking material 142 (e.g. photoresist) remaining on the last formed layer L1 (FIG. 12B), (3) exposed upper portions 100U of the probes 100 after masking material 142 is removed from the final layer L1 (FIG. 12C), (4) sacrificial material, or mask coatings 146, formed around the upper previously exposed portions 100U of the probes 100 (FIG. 12D) to provide a spacing between the probes 100 and side walls of through holes of a guide plate, in particular an upper guide plate 220 which may be formed by direct patterning of masking material or by depositing sacrificial material into openings within mask material, (5) an upper guide plate 220 located around the upper portions 100U of the probes 100 after formation of the upper guide plate 200 with the through holes or openings 220A around the coating material 146 covering the upper portions 100U of the probes 100 (FIG. 12E) which may have been formed by deposition or spreading of slurry (infiltration) and then forcing or allowing solidification, (6) the partially formed array 200 after coating material 146 around the upper portions 100U of the probes 100 is removed (FIG. 12F), (7) the probe array 200 with additional layers of probes (none shown) (FIG. 12G), and (8) the probe array 200 in an uncompressed operational state after an optional relative lateral shifting that provides the probes 100 with a desired placement, shape, and/or configuration, e.g. by removing the sacrificial material 140 and optionally laterally shifting SH the upper guide plate 220 and the substrate 120. (FIG. 12H).

[105] Suitably, the probe locations 120A are established so that the probes have a lateral probe-to-probe spacing PS corresponding to an intended array spacing, and thus corresponding to contact elements on the circuit element to be contacted. Moreover, each layer L1 -L5 of the layered structure 150 is a multi-material layer and comprised at least a structural material 130, in particular adapted to form the probes 100, and a sacrificial material 140. Furthermore, each successively formed multi-material layer L1 -L5 is adhered to a previously formed multi-material layer or a non-multi-material layer that in turn is adhered directly or indirectly to a previously formed multi-material layer.

[106] A seventh specific embodiment of the present disclosure relates to a method for forming a probe array including the formation of a guide plate in lateral alignment with an array of partially formed probes followed by longitudinally co-locating the guide and partially formed probes, and thereafter continuing fabrication of the probes according to steps (E7A) - (E7F) and in particular:

(E7A) providing a substrate onto which probes are to be formed;

(E7B) forming at least part of the longitudinal length of the probes using one or more selected electrochemical fabrication processes where the probes have a lateral probe-to-probe positioning corresponding to positions intended for the probes in the array;

(E7C) on top of the at least partially formed probes, forming a guide plate with its through holes laterally aligned with partially formed probes wherein masking material is first patterned to exist where through holes are to be located, then guide plate material is applied and cured, and then the masking material is removed. In some alternative embodiments, multiple spaced apart guide plates could be formed;

(E7D) removing a portion of the sacrificial or masking material surrounding an upper most portion of the partially formed probes (i.e., the material immediately below the guide plate). Longitudinally moving guide plate, relative to the partially formed probes, to locate at least part of the partially formed probes into the through holes of the guide plate. In some alternative embodiments, multiple guide plates may be longitudinally positioned;

(E7E) forming any remaining portions of the probes (if necessary) which may start with deposition of a sacrificial material and planarization of both the sacrificial material and the ends of the partially formed probes that extend above the upper surface of the one or more guide plates; and

(E7F) removing remaining sacrificial material from the array of probes and performing any additional processing steps.

[107] Numerous variations of this embodiment are possible and include, for example, (1 ) many of the alternatives discussed above, (2) other variations allowed in the generalized flowchart of FIG. 4, (3) variations of set forth in the previous examples and (4) the steps set forth in the other specific embodiments.

[108] FIGS. 13A - 13F provide cut side views of example results of the steps (E7A) - (E7F). In this example, the formation of an array 200 is exemplified by five probes 100 formed as part of a layered structure 150 comprising four layers L1 -L4 where the probes 100 are to be held at their lower ends by a substrate 120 and laterally positioned near their upper ends, or contact ends, by a guide plate, in particular an upper guide plate 220, that is formed above the upper ends of the probes 100 and is then lowered (i.e. longitudinally translated) so the probes 100 extend at least partially through the through holes or openings 220A in the guide plate 220 and potentially beyond the through holes or openings 220A in the guide plate 220, after which probe formation may continue as appropriate with the eventual result being an array 200 of probes 100 that can undergo elastic compression when made to contact an electronic component. The following states of the process can be seen in FIGS. 13A- 13F: (1) a supplied substrate 120 (FIG. 13A), (2) probes 100 formed from a plurality of multi-material layers L1 -L4 including a surrounding sacrificial material 140 on all but the last or upper layer L1 which retains a masking material 142 (e.g. photoresist) used in the deposition of the structural material forming the probes 100 at suitable probe locations 120A on the substrate 120 (FIG. 13B), (3) formation of a patterned masking material 142’ and creation of a guide plate, in particular an upper guide plate 220 having through holes or openings 220A positioned around the patterned masking material 142’ wherein the patterned masking material 142’ has a thickness H3 greater than a thickness H1 of the upper guide plate 220 and is located in regions to eventually be occupied by probes 100, e.g., the upper guide plate 220 is formed with through holes or openings 220A created by a pre-patterned masking material 142 (FIG. 13C), (4) the partially formed array 200 after removal of the patterned masking material 142’ defining the through holes or openings 220A and removal of the masking material 142 from around the last or upper layer L1 of the probes 100, and lowering of the upper guide plate 220 to engage the probes 100 at their upper portions 100U (FIG. 13D), (5) the probe array 200 after formation of any additional longitudinal portions of the probes 100 by additional layers (none shown) (FIG. 13E), and (6) the probe array 200 in an uncompressed operational state after removal of the sacrificial material 140 and an optional relative lateral shifting SH that provides the probes 100 with a desired placement, shape, and/or configuration, by optionally relatively shifting the upper guide plate 220 and the substrate 120 and lock them into position (locking is not shown). (FIG. 13F).

[109] As previously, the probe locations 120A are established so that the probes have a lateral probe-to-probe spacing PS corresponding to an intended array spacing, and thus corresponding to contact elements on the circuit element to be contacted. Moreover, each layer L1 -L5 of the layered structure 150 is a multi-material layer and comprised at least a structural material 130, in particular adapted to form the probes 100, and a sacrificial material 140. Furthermore, each successively formed multi-material layer L1 -L5 is adhered to a previously formed multi-material layer or a non-multi-material layer that in turn is adhered directly or indirectly to a previously formed multi-material layer.

[1 10] Numerous variations of the above specific embodiments are possible and include, intra alia, for example, (1 ) many of the alternatives discussed above, (2) other variations allowed in the generalized flowchart of FIG. 4, (3) variations of set forth in the previous examples and (4) the steps set forth in the other specific embodiments.

[1 11 ] The probe array 200 can be a two-dimensional array, wherein the probes are disposed along two perpendicular directions.

Further Comments and Conclusions

[1 12] Various other embodiments of the present disclosure exist. For example, some fabrication embodiments may not use any blanket deposition process. Some embodiments may use selective deposition processes or blanket deposition processes on some layers that are not electrodeposition processes. Some embodiments may use nickel or nickel-cobalt as a structural material while other embodiments may use different materials. For example, preferred spring materials include nickel (Ni), copper (Cu), beryllium copper (BeCu), nickel phosphorous (Ni-P), tungsten (W), aluminum copper (Al-Cu), steel, P7 alloy, palladium, palladium-cobalt, silver, molybdenum, manganese, brass, chrome, chromium copper (Cr-Cu), and combinations of these. Some embodiments may use copper as the structural material with or without a sacrificial material. Some embodiments, for example, may use nickel, nickelphosphorous, nickel-cobalt, palladium, palladium-cobalt, gold, copper, tin, silver, zinc, solder, rhodium, rhenium as structural materials while other embodiments may use different materials. Some embodiments, for example, may use copper, tin, zinc, solder, or other materials as sacrificial materials. Some embodiments may use different structural materials on different layers or on different portions of single layers. Some embodiments may remove a sacrificial material while other embodiments may not. Some embodiments may use photoresist, polyimide, glass, ceramics, other polymers, and the like as dielectric structural materials.

[1 13] Structural or sacrificial dielectric materials may be incorporated into embodiments of the present disclosure in a variety of different ways. Such materials may form a third material or higher deposited material on selected layers or may form one of the first two materials deposited on some layers.

[1 14] It will be understood by those of skill in the art that additional operations may be used in variations of the above presented method of making embodiments. These additional operations may, for example, perform cleaning functions (e.g., between the primary operations discussed herein), perform activation functions and monitoring functions, and the like.

[1 15] It will also be understood that the probe elements of some aspects of the present disclosure may be formed with processes which are very different from the processes set forth herein, and it is not intended that structural aspects of the present disclosure need to be formed by only those processes taught herein or by processes made obvious by those taught herein.

[1 16] Though various portions of this specification have been provided with headers, it is not intended that the headers be used to limit the application of teachings found in one portion of the specification from applying to other portions of the specification. For example, alternatives acknowledged in association with one embodiment are intended to apply to all embodiments to the extent that the features of the different embodiments make such applications functional and do not otherwise contradict or remove all benefits of the adopted embodiment. Various other embodiments of the present disclosure exist.

[1 17] It is intended that any aspects of the present disclosure set forth herein represent independent present disclosure descriptions which Applicant contemplates as full and complete present disclosure descriptions that Applicant believes may be set forth as independent claims without need of importing additional limitations or elements, from other embodiments or aspects set forth herein, for interpretation or clarification other than when explicitly set forth in such independent claims once written. It is also understood that any variations of the aspects set forth herein represent individual and separate features that may form separate independent claims, be individually added to independent claims, or be added as dependent claims to further define the present disclosure being claimed by those respective dependent claims should they be written.

[1 18] In view of the teachings herein, many further embodiments, alternatives in design and uses of the embodiments of the instant present disclosure will be apparent to those of skill in the art. As such, it is not intended that the present disclosure be limited to the particular illustrative embodiments, alternatives, and uses described above but instead that it be solely limited by the claims presented hereafter.

Claims

CLAIMS What is claimed is:

1 . A method of forming a probe array (200), comprising:

(A) forming a plurality of probes (100) on a substrate (120) with each probe having two ends (100A, 100B), and at least one intermediate elastically compliant portion (100C), wherein at least one of the ends (100A) is configured as a contact end for making electric contact to a second electrical circuit element while an other end (100B) is selected from a group consisting of: (1 ) a contact end for making pressure based contact to a first electric element, and (2) an attachment end for making a fixed contact to the first circuit element, wherein the plurality of probes (100) are formed with probe-to-probe spacings (PS) corresponding to contact elements on the second circuit element, wherein the formation of the plurality of probes (100), comprises: forming a layered structure (150) comprising a plurality of multi-material layers (L1 -L5), with each multi-material layer (L1 -L5) comprising at least two materials, wherein at least one of the at least two materials (130, 140) is at least one structural material (130) and at least one other of the at least two materials is at least one sacrificial material (140), wherein each multi-material layer (L1-L5) defines a cross-section of the plurality of probes (100);

(B) providing at least one guide plate (220) having a plurality of openings (220A) to engage the plurality of probes (100); and

(C) after formation of all multi-material layers (L1 -L5) of the probes (100) and after providing and engaging the at least one guide plate (220), separating the probes (100) from unremoved sacrificial material (1406); wherein (B) providing at least one guide plate (220) is selected from a group consisting of:

(i) after forming the probes (100) but prior to the removal of all sacrificial material (140) from the plurality of multi-material layers (L1 -L5), positioning the at least one guide plate (220) laterally and longitudinally over and around end portions (100U) of the probes (100) with the end portions (100U) of the probes (100) extending from unremoved sacrificial material (MOB);

(ii) prior to forming a first layer of the plurality of multi-material layers of the probes (100) forming the at least one guide plate (240) over the substrate (120), in direct or indirect contact therewith, and then forming the probes (100) through the openings (240A) in the at least one guide plate (240), wherein an end portion (100U) of the probes (100) extends from unremoved sacrificial material (140B);

(iii) after forming the probes (100) to have only a partial length, positioning the at least one guide plate (220) laterally and longitudinally over and around the end portions (100U) of the partial length probes (100), then completing formation of the length of the probes (100), wherein at the time of positioning of the at least one guide plate (240), an end portion (100U) of the partially formed probes extends from unremoved sacrificial material (140B);

(iv) after forming the probes (100) to have a full length, forming the at least one guide plate (220) with the openings (220A) aligned laterally with the probes (100) and positioned longitudinally with the openings (220A) at least partially surrounding portions (100U) of the probes (100) while other portions (100L) of the probes remain covered with unremoved sacrificial material (140B); and

(v) after forming the probes (100) to at least partial length, forming at least one guide plate (220) with the openings (220A) aligned laterally with the probes (100) but longitudinally above end portions (100U) of the probes (100), and thereafter exposing the end portions (100U) of the probes (100) by removing a portion of the sacrificial material (140), and lowering the at least one guide plate (220) longitudinally over and around the end portions (100U) of the probes (100).

2. The method of claim 1 wherein forming of each multi-material layer comprises:

(a) depositing at least a first of the at least two materials (130, 140);

(b) depositing at least a second of the at least two materials (130, 140);

(c) planarizing at least two of the at least two deposited materials (130, 140), including planarizing at least one structural material (130) and at least one sacrificial material (140) and wherein each successively formed multi-material layer (L1 -L5) of the plurality of multimaterial layers is adhered to a previously formed multi-material layer or a non-multi-material layer that in turn was adhered directly or indirectly to a previously formed multi-material layer.

3. The method of claim 1 wherein the probes with a full length are formed with an end portion (100U) extending from unremoved sacrificial material (140B) by an amount selected from a group consisting of: (a) less than a lateral dimension of an individual probe;

(b) less than a lateral dimension of a spacing between adjacent probes;

(c) less than a fraction of a height of a probe where the fraction is selected from a group consisting of (1) 1/2, (2) 1/3, (3) 1/4, (4) 1/5, (5) 1/10, and (6) 1/20;

(d) less than N thicknesses of the guide plate, wherein N is selected from a group consisting of (1 ) 4, (2) 3, (3) 2, (4) 1 , (5) 1/2, (6) 1/3, and (7) 1/4;

(e) less than an amount selected from a group consisting of 500 microns, 200 microns, 100 microns, 50, microns, 20 microns, 10 microns, and 5 microns.

4. The method of claim 1 wherein the at least one guide plate (220) is positioned with the openings (220A) at least partially surrounding the probes (100) with a full length wherein only a end portion (100U) of a longitudinal length of the probes extend from unremoved sacrificial material (140B) at the time of guide plate (220) formation, wherein the end portion (100U) is selected from a group consisting of:

(a) less than a lateral dimension of an individual probe;

(b) less than a lateral dimension of a closest spacing between adjacent probes;

(e) less than an amount selected from a group consisting of (1 ) 500 microns, (2) 200 microns (3) 100 microns, (4) 50, microns, (5) 20 microns, (6) 10 microns, and (7) 5 microns.

5. The method of claim 1 wherein the probes (100) formed to at least partial length have an end portion (100U) extending from unremoved sacrificial material (140B) by an amount selected from a group consisting of:

(a) less than a lateral dimension of an individual probe;

(b) less than a lateral dimension of a spacing between adjacent probes;

(c) less than a fraction of a height of a probe where the fraction is selected from a group consisting of (1) 1/2, (2) 1/3, (3) 1/4, (4) 1/5, (5) 1/10, and (6) 1/20; (d) less than N thicknesses of the guide plate, wherein N is selected from a group consisting of (1 ) 4, (2) 3, (3) 2, (4) 1 , (5) 1/2, (6) 1/3, and (7) 1/4;

6. The method of claim 1 , further comprising, after separating the probes (100) from unremoved sacrificial material (1406): relative lateral shifting (SH) of the at least one guide plate (220) with respect to the substrate (120) to provide the probes (100) with a desired placement, shape, and/or configuration due to lateral offsetting.

7. The method of claim 1 , further comprising, before separating the probes (100) from unremoved sacrificial material (1406): remove the substrate (120) and a portion of the sacrificial material (140) exposing further end portions (100L) of the probes (100); and positioning a further guide plate (240) with further openings (240A) at least partially surrounding the further end portions (100L) of the probes (100) extending from unremoved sacrificial material (140C).

8. The method of claim 7, further comprising, after separating the probes (100) from unremoved sacrificial material (140C): relative lateral shifting (SH1 , SH2) of the at least one guide plate (220) with respect to the further guide plate (240) to provide the probes (100) with a desired placement, shape, and/or configuration due to lateral offsetting.

9. The method of claim 1 , wherein forming the at least one guide plate (240) over the substrate (120) prior to forming a first layer of the plurality of multi-material layers of the probes (100) comprises: forming a masking material (142) with openings (142A) at the desired probe locations (122A) for the probes (100) with a required probe-to-probe spacing (PS); positioning the at least one guide plate (240) with openings (240A) coated by a coating material (144) aligned with the openings (142A) of masking material (142); forming a patterned masking material (142”) over the at least one guide plate (240); and depositing structural material into the openings (142, 240A) of the masking materials (142, 142”) and of the at least one guide plate (240) to partially form the probes (100).

10. The method of claim 9, further comprising: after partial formation of the probes (100), removing the masking material (142) and exposing respective end portions (100L, 100U) of the probes (100); depositing a sacrificial material (140) to surround the respective end portions (100L, 100U) and fill in at least part of the gaps around the probes (100) and the at least one guide plate (240); and planarizing the sacrificial material (140) and the structural material (130) forming the probes (100) to set a planar surface (200U) for a subsequent layer formation.

11. The method of claim 10, further comprising : after planarizing the sacrificial material (140) and the structural material (130) forming the probes (100), forming additional layers (L2-L4) on the planar surface (200U), each additional layer (L2-L4) comprising the structural material (130) forming the probes (100) and the sacrificial material (140); forming a last layer (L1 ) of masking material (142); removing the masking material (142) to expose further end portions (100U) of the probes (100); and positioning a further guide plate (220) with further openings (220A) at least partially surrounding the exposed further end portions (100U) of the probes (100).

12. The method of claim 11 , further comprising, after positioning the further guide plate (220) and before separating the probes (100) from unremoved sacrificial material (1406): forming one or more additional probe layers (L+) which include structural material (130) and sacrificial material (140) to complete the probes (100).

13. The method of claim 11 , further comprising, after separating the probes (100) from unremoved sacrificial material (1406): relative lateral shifting (SH1 , SH2) of the at least one guide plate (240) with respect to the further guide plate (220) to provide the probes (100) with a desired placement, shape, and/or configuration due to lateral offsetting.

14. The method of claim 11 , further comprising, before positioning the further guide plate (220): coating the exposed further end portions (100U) of the probes (100) with a coating material (146) to provide a spacing between the probes (100) and side walls of the openings (220A) of the further guide plate (220).

15. The method of claim 1 , wherein the probe array (200) is a two-dimensional probe array.