WO2025029297A1

WO2025029297A1 - Probes with modulating mechanical properties by using nano-fibers, corresponding probe arrays and methods of forming probe arrays

Info

Publication number: WO2025029297A1
Application number: PCT/US2023/071574
Authority: WO
Inventors: Onnik Yaglioglu
Original assignee: Microfabrica Inc
Current assignee: Microfabrica Inc
Priority date: 2023-08-03
Filing date: 2023-08-03
Publication date: 2025-02-06
Anticipated expiration: 2026-02-03

Abstract

Probe structures, probe arrays and methods for making such structures include incorporation of nano-fibers and metal composites to provide structures with improved material properties. Nano-fiber incorporation may occur by co-deposition of fibers and metal, selective placement of fibers followed by deposition of metal, or general placement of fibers followed by selective deposition of a metal. All portions, or only selected portions, of a structure may include composites of metal and nano-fibers.

Description

PROBES WITH MODULATING MECHANICAL PROPERTIES BY USING NANO-FIBERS, CORRESPONDING PROBE ARRAYS AND METHODS OF FORMING PROBE ARRAYS

Field of the Invention:

[01 ] The present invention relates generally to the field of plated metal structures and more particularly, in some embodiments, to methods of forming probe arrays or subarrays for testing (e.g. wafer level testing or socket testing) of electronic components (e.g. integrated circuits), and even more particularly, the formation of such arrays or subarrays to allow independent modulation of selected material properties by incorporating nano-fibers during plating into at least some portions of the probe structures.

Background of the Invention:

[02] Probes:

[03] Numerous electrical contact probe and pin configurations as well as array formation methods have been commercially used or proposed, some of which may be prior art while others are not.

[04] As the pitch requirements of probing applications get more demanding, i.e. as pitches get smaller, achieving the required contact force without exceeding the yield stress of the material used becomes increasingly challenging, and as such, a need exists for methods for creating probe arrays allowing independent control of material properties so that such requirements can be met.

Summary of the Invention:

[05] It is a first object of some embodiments of the invention to provide an improved method of forming a probe array incorporating probes that have selected mechanical properties independently manipulated during formation of at least portions of the probes.

[06] It is a second object of some embodiments of the invention to provide an improved method of forming probe arrays that incorporate nano-fibers into at least portions of the probes as they are formed.

[07] It is a third object of some embodiments of the invention to provide improved probes and probe arrays.

[08] Other objects and advantages of various embodiments of the invention will be apparent to those of skill in the art upon review of the teachings herein. The various embodiments of the invention, set forth explicitly herein or otherwise ascertained from the teachings herein, may address one or more of the above objects alone or in combination, or alternatively may address some other object ascertained from the teachings herein. It is not intended that all objects, or even multiple objects, be addressed by any single aspect or embodiment of the invention even though that may be the case regarding some aspects.

[09] In a first aspect of the invention, a probe is provided, including: (a) an elastically deformable body portion having a first end and a second end; (b) a first contact region connected directly or indirectly to the first end,; and (c) a second contact region connected directly or indirectly to the second end, wherein the elastically deformable body portions comprises a plurality of nanofibers embedded in a structural metal to form a composite material.

[10] Numerous variations of the first aspect of the invention are possible and include, for example: (1 ) the nano-fibers including a material selected from a group consisting of: (i) metal nanorods, (ii) nanotubes, and (iii) carbon nanotubes; (2) the probe additionally including a plurality of adhered layers; (3) the first contact region is configured for a function selected from a group consisting of: (a) making temporary pressure based electrical contact to a first electronic component upon elastically biasing the elastically deformable body portion with the first contact region against the first electronic component, and (b) bonding to the first electronic component for making permanent contact; (4) the first contact region being configured for bonding to the first electronic component for making permanent contact; (5) the first contact region being configured for making temporary contact; and (6) the second contact region is configured for making temporary pressure based electrical contact to a second electronic component upon elastically biasing the elastically deformable body portion with the second contact region against the second electronic component.

[11 ] In a second aspect of the invention, a probe array is provided, including: (a) a plurality of probes, comprising: (i) an elastically deformable body portion having a first end and a second end; (ii) a first contact region connected directly or indirectly to the first end, and (iii) a second contact region connected directly or indirectly to the second end, wherein the elastically deformable body portion comprises a plurality of nano-fibers embedded in a structural metal, and (b) at least one probe array retention structure to held the probes in a desired probe array configuration.

[12] Numerous variations of the second aspect of the invention are possible and include, for example: (1 ) the at least one probe array retention structure may be selected from a group consisting of: (i) a substrate to which the first contact regions of the probes are bonded at a plurality of bonding locations; (ii) a substrate to which the first contact regions of the probes are bonded along with at least one guide plate having a plurality of holes which engage the probes are inserted wherein the holes in the guide plate are laterally aligned with bonding locations on the substrate; (iii) a substrate to which the first contact regions of the probes are bonded along with at least one guide plate having a plurality of holes which engage the probes wherein the holes in at least one of the at least one guide plate are laterally shifted relative to the bonding locations on the substrate; (iv) a plurality of guide plates) each having a plurality of holes which engage the probes; (v) a plurality of guide plates each having a plurality of holes which engage the probes, wherein at least two of the plurality of guide plates have holes that engage probes that are laterally aligned; and (vi) a plurality of guide plates each having a plurality of holes which engage the probes, wherein at least two of the plurality of guide plates have holes engaging probes that are laterally shifted with respect to one another; and (vii) a retention plate having a plurality of retention holes into which the probes are inserted; (2) wherein the at least one probe array retention structure may be a retention plate which has thickness selected from a group consisting of: (a) at least % of a longitudinal length of the probes from first contact region to second contact region; (b) at least ¹Z> of a longitudinal length of the probes from first contact region to second contact region; (c) at least % of a longitudinal length of the probes from first contact region to second contact region; (3) the nano-fibers in the elastically deformable body portion of the probes may comprise a material selected from a group consisting of: (a) metal nanorods, (b) nanotubes, and (c) carbon nanotubes; (4) the probes may comprise a plurality of adhered layers; (5) the first contact region of the probes may be configured for a function selected from a group consisting of: (a) making temporary pressure based electrical contact to a first electronic component upon elastically biasing the elastically deformable body portion with the first contact region against the first electronic component, and (b) bonding to the first electronic component for making permanent contact; (6) the first contact region of the probes may be configured for bonding to the first electronic component for making permanent contact; (7) the first contact region of the probes may be configured for bonding to the first electronic component for making temporary contact; and (8) the second contact region of the probes may be configured for making temporary pressure based electrical contact to a second electronic component upon elastically biasing the elastically deformable body portion with the second contact region against the second electronic component..

[13] In a third aspect of the invention, a method of forming a probe is provided, including: (a) forming a plurality of probes, each having an elastically deformable body portion, a first contact region and a second contact region, the elastically deformable body portion having a first end and a second end connected directly or indirectly to the first contact region and the second contact region, respectively; (b) providing an array substrate; (c) providing at least one probe array retention structure to held the probes in a desired configuration of the probe array; wherein forming of the probes comprises forming the elastically deformable body (of each probe by a composite material comprising a plurality of nano-fibers and at least one structural metal.

[14] Numerous variations of the third aspect of the invention are possible and include, for example: forming the plurality of probes may comprise (i) providing a probe substrate; (ii) forming a plating template with a plurality of openings wherein the probes are formed, and (iii) forming the composite material of the probes selected from a group consisting of: (A) simultaneously codepositing a plurality of nano-fibers and at least one structural metal into the plurality of openings; (B) simultaneously co-depositing a plurality of nano-fibers and at least one structural metal into the plurality of openings of the plating template, wherein fiber properties within a plating solution are maintained at an uniform level during the co-depositing to provide uniform properties to the resulting composite material; (C) simultaneously co-depositing a plurality of nano-fibers and at least one structural metal into the plurality of openings of the plating template, wherein fiber properties within a plating solution are varied during the co-depositing to cause varying properties within the resulting composite material; (D) locating a plurality of nano-fibers into the plurality of openings of the plating template and thereafter depositing at least one structural metal into the plurality of openings of the plating template; (E) locating a plurality of longitudinally oriented nanofibers into the plurality of openings of the plating template and thereafter depositing at least one structural metal into the plurality of openings of the plating template; (F) growing a plurality of nano-fibers in the plurality of openings of the plating template and thereafter depositing at least one structural metal into the plurality of openings of the plating template; (G) growing a plurality of longitudinally oriented nano-fibers in the plurality of openings of the plating template and thereafter depositing at least one structural metal into the plurality of openings of the plating template; (2) further comprising (H) planarizing the deposited material; (3) forming the plurality of probes may comprise (i) providing a probe substrate; (ii) providing a plurality of nano-fibers directly or indirectly on the probe substrate; (iii) forming a patterned plating template with a plurality of openings that contains the plurality of nano-fibers; (iv) depositing at least one structural metal into the plurality of openings of the plating template, and (v) removing the plating template along with at least a portion of any nano-fibers that are not held by the structural metal as deposited; (4) providing the plurality of nano-fibers may be selected from a group consisting of: (A) locating a plurality of nano-fibers directly or indirectly on a probe substrate; (B) locating a plurality of longitudinally oriented nanofibers directly or indirectly on the probe substrate; (C) growing a plurality of nano-fibers directly or indirectly on the probe substrate; and (D) growing a plurality of longitudinally oriented nano-fibers directly or indirectly on the probe substrate; (6) further comprising (E) planarizing the deposited material; (7) providing at least one probe array retention structure may be selected from a group consisting of: (i) bonding the first contact region of the probes at a plurality of boding location of the array substrate, wherein the array substrate comprises the probe substrate being a build substrate; and (ii) bonding the first contact regions of the probes at a plurality of boding location of the array substrate, wherein the array substrate and the probe substrate being a build substrate are different; (9) further comprising a step that may be selected from a group consisting of: (iii) providing at least one guide plate having a plurality of holes that engage the probes; (iv) providing at least one guide plate having a plurality of holes and inserting the probes into the plurality of holes that are laterally aligned with bonding locations on the array substrate; (vi) providing at least one guide plate having a plurality of holes and inserting the probes into the plurality of holes, and laterally shifting the at least one guide plate and the array substrate so that the plurality of holes in the at least one guide plate are laterally shifted with respect to bonding locations on the array substrate; (vii) providing a plurality of guide plates, each having a plurality of holes which engage the probes; (viii) providing a plurality of guide plates, each having a plurality of holes which engage the probes, wherein at least one of the plurality of guide plates has a plurality of holes engaging probes that are laterally aligned; (ix) providing a plurality of guide plates, each having a plurality of holes which engage the probes, wherein at least two of the plurality of guide plates have respective plurality of holes engaging probes that are laterally aligned with respect to one another; (ix) providing a plurality of guide plates, each having a plurality of holes which engage the probes, wherein at least two of the plurality of guide plates have respective plurality of holes engaging probes that are laterally shifted with respect to one another; (x) providing a retention plate with a plurality of retention holes for receiving probes and inserting the probes into the plurality of retention holes; (xi) providing a retention plate with a plurality of retention holes for receiving probes and inserting the probes into the plurality of retention holes, wherein the retention plate has a thickness selected from a group consisting of: (1 ) at least % of a longitudinal length of the probes; (2) at least ! of a longitudinal length of the probes; (3) at least % of a longitudinal length of the probes, the longitudinal length of the probes being a length from the first contact region to the second contact region thereof; and (10) nano-fibers may be provided selected from a group consisting of: (a) metal nanorods, (b) nanotubes, and (c) carbon nanotubes.

[15] Other aspects of the invention will be understood by those of skill in the art upon review of the teachings herein and for example may include alternatives in the configurations or processes set forth herein, decision branches noted in those processes or configurations, or partial or complete exclusion of such alternatives and/or decision branches in favor of explicitly setting forth process steps or features along with orders to be used in performing such steps or connections between such features. Some aspects may provide device counterparts to method of formation aspects, some aspects may provide method of formation counterparts to device aspects, and other aspects may provide for methods of use for the probe arrays provided herein. Brief Description of the Drawings:

[16] FIGS. 1 A - 1 F schematically depict the formation of a first layer of a structure using adhered mask plating where the blanket deposition of a second material overlays both the openings between deposition locations of a first material and the first material itself.

[17] FIG. 1 G depicts the completion of formation of the first layer resulting from planarizing the deposited materials to a desired level.

[18] FIGS. 1 H and 11 respectively depict the state of the process after formation of the multiple layers of the structure and after release of the structure from the sacrificial material.

[19] FIG. 2A provides a cut view of multiple openings in a photoresist that forms a plating template while FIG. 2B provides a cut view of the openings in the plating template and a composite material including co-plated metal and nano-fibers that form composite structures or portions of a composite structures (e.g., probes).

[20] FIGS. 2C1 - 2C5 illustrate side views of example probe arrays including probes of the type shown in FIG. 2B using different types of guides and/or mounting structures.

[21 ] FIG. 3A provides a view of multiple openings in a photoresist template that have received or have had created therein strands of fibers while FIG. 3B provides a view of the same opening after they have received an electroplated metal to form a plurality of composite structures or portions of a plurality of structures.

[22] FIGS. 3C1 - 3C5 illustrate side views of example probe arrays including probes of the type shown in FIG. 3B using different types of guides and/or mounting structures.

Detailed Description of Preferred Embodiments:

[23] Electrochemical Fabrication in General

[24] Various implementations of the present invention may use single or multi-layer electrochemical deposition processes.

[25] FIGS. 1 A - 11 are provided to illustrate techniques that may be useful. FIGS. 1 A - 11 illustrate side views of various states in an example multi-layer, multi-material electrochemical fabrication process. FIGS. 1 A - 1 G illustrate various stages in the formation of a single layer of a multi-layer fabrication process where a second metal is deposited on a first metal as well as in openings in the first metal so that the first and second metals form part of the layer. In FIG. 1 A, a side view of a substrate 182 having a surface 188 is shown, onto which patternable photoresist 184 is deposited, spread, or cast as shown in FIG. 1 B. In FIG. 10, a pattern of resist is shown that results from the curing, exposing, and developing of the resist. The patterning of the photoresist 184 results in openings or apertures 192(a) - 192(c) extending from a surface 186 of the photoresist through the thickness of the photoresist to surface 188 of the substrate 182. In FIG. 1 D, a metal 194 (e.g., nickel) is shown as having been electroplated into the openings 192(a) - 192(c). In FIG. 1 E, the photoresist has been removed (i.e., chemically stripped) from the substrate to expose regions of the substrate 182 which are not covered with the first metal 194. In FIG. 1 F, a second metal 196 (e.g., silver) is shown as having been blanket electroplated over the entire exposed portions of the substrate 182 (which is conductive) and over the first metal 194 (which is also conductive). FIG. 1 G depicts the completed first layer of the structure which has resulted from the planarization of the first and second metals down to a height that exposes the first metal and sets a thickness for the first layer. In FIG. 1 H, the result of repeating the process steps shown in FIGS. 1 B - 1 G several times to form a multi-layer structure is shown where each layer consists of two materials. For most applications, one of these materials is removed as shown in FIG. 11 to yield a desired 3-D structure 198 (e.g., component or device).

[26] Some Definitions

[27] Definitions of various terms and concepts that may be used in understanding the embodiments of the invention (either for the devices or structures themselves, certain methods for making the devices or structures, or certain methods for using the devices or structures) will be understood by those of skill in the art.

[28] The term “longitudinal” as used herein refers to a long dimension of a probe, an end-to-end dimension of the probe, or a tip-to-tip dimension. Longitudinal may refer to a generally straight line that extends from one end of the probe to another end of the probe or it may refer to a curved or stair-stepped path that has a sloped or even changing direction along a height of the probe. When referring to probe arrays, the longitudinal dimension may refer to a particular direction the probes in the array point or extend but it may also simply refer to the overall height of the array that starts at a plane containing a first end, tip, or base of a plurality of probes and extends perpendicular thereto to a plane containing a second end, tip, or top of the probes. The context of use typically makes clear what is meant especially to those of skill in the art. It is intended that the interpretation to be applied to the term herein be as narrow as warranted by the details of the description provided or the context in which the term is used. If, however, no such narrow interpretation is warranted, it is intended that the broadest reasonable scope of interpretation apply.

[29] The term “lateral” as used herein is related to the term longitudinal. In terms of the stacking of layers, lateral refers to a direction within each layer, or two perpendicular directions within each layer (i.e., one or more directions that lie within a plane of a layer that are substantially perpendicular to the longitudinal direction). When referring to probe arrays laterally generally has a similar meaning in that a lateral dimension is generally a dimension that lies in a plane that is parallel to a plane of the top or bottom of the array (i.e., substantially perpendicular to the longitudinal dimension. When referring to probes themselves, the lateral dimensions may be those that are perpendicular to an overall longitudinal axis of the probe, a local longitudinal axis of the probe (that is local lateral dimensions), or simply the dimensions similar to those noted for arrays or layers. The context of use typically makes clear what is meant especially to those of skill in the art. It is intended that the interpretation to be applied to the term herein be as narrow as warranted by the details of the description provided or the context in which the term is used. If no such narrow interpretation is warranted, it is intended that the broadest reasonable scope of interpretation apply.

[30] When referring to longitudinal or lateral, the term substantially means within a particular angular orientation of the longitudinal or a lateral direction wherein the angle may be within 1 °, within 2°, within 5°, or in some cases, within 10° depending on the context.

[31 ] Probe and Probe Array Formation Embodiments:

[32] Embodiments of the invention include reinforcement of plated metal structures using nano-fibers (e.g., metal nanorods, nanotubes, carbon nanotubes, metal oxide nanofibers (e.g., ZnO or TigO), conductive nanofibers, insulating nanofibers, semiconductor nanofibers, etc.). In some embodiments, the nano-fibers or nanotubes can be formed as part of the plating process while in others, they can be fabricated before the plating step.

[33] According to some embodiments, probes may be formed vertically or on their sides with plating occurring using a plating solution with nano-fibers dispersed therein. In particular, step one includes dispersing nano-fibers into one or more plating solutions that will be used in forming the structural portions of the probes and, in particular, used in the spring portions of the probes. Step two involves the co-deposition of metal and the nano-fiber using the plating solution, either in a blanket manner or in selectively manner such that the nano-fibers and plated metal will be incorporated into the structures, probes, or springs. In addition to incorporating nano-fibers to aid in setting probe properties, deposition parameters may be by changing one or more of (1) fiber material, (2) average fiber length, (3) average fiber diameter, (4) the mix of fiber sizes, (5) the standard deviation of fiber size distribution that are available for deposition, and (6) the quantity of fibers in solution that are available for co-deposition. In some embodiments, dispersion agents may be added to a co-deposition plating bath to inhibit entanglement and agglomeration of nanofibers so as to improve uniformity of nano-fiber distribution. In some embodiments, functionalization of the fibers may be used to modify the fiber-metal interface and to improve suspension properties of the fibers while in solution and thus to improve co-deposition rates of the fibers.

[34] Modulation or changing of these parameters may occur in different ways. For example, different plating baths with different fiber properties may be used during formation of different layers or different portions of a single layer. Different amounts, or locations, of agitation or stirring of the plating solution may be used to provide a desired level of fiber suspension in a region of the plating solution from which deposition will occur. Performing plating operations during or after movement of a substrate, or partially formed part, on to which plating will occur, to different locations in a plating bath that have different amounts of suspended fibers or different types of suspended fibers may be used to cause different amounts of co-deposition or co-deposition that results in different properties in the deposited materials. In some embodiments, co-deposition may provide a nano-fiber to metal mass ratio ranging from 0.4% or less to 7% or more or a nano-fiber to metal volume ratio ranging from about 3% to about 70%.

[35] Even further modulation of material properties at different heights of a probe, probe preform, probes of a probe array, or preforms of a preform array, or other structure may occur by use of different plating parameters, current densities, temperatures, and the like, to achieve different co-deposition rates or combinations of co-deposition rates and grain size formation at different locations. Different material properties at different height levels of a plated material may be achieved by using different plating variations:

(1 ) Direct current plating with a current density that is fixed at any given time but is made to change from one value to another in a substantially discontinuous manner to cause relatively abrupt changes in grain size formation of deposited metals and thus changes in yield strength of the deposited metal at a given height of deposition. Times between current density changes may range from seconds to tens of seconds or even to minutes such that deposit thickness at any given current density ranges from tenths of microns, to microns, to tens of microns.

(2) Direct current plating with relatively slow transitions in current density from one value to another (i.e., from a local temporal minimum value to a local temporal maximum value, and vice-a-versa) where such transitions may occur over seconds, to tens of seconds, to even minutes uniformly in the transition between values.

(3) Pulsed current plating which has a first fast oscillation rate associated with the pulsing but a slower rate of change between changes to one or both of minimum and/or maximum current densities, or even duty cycle, to produce changes in material properties similar to those noted in (1 ) and (2) above. The fast oscillations may occur with a frequency range of 1 hz to 100 hz, or faster, and a duty cycle ranging from 5% to 95% with material property variations in resulting depositions occurring based on different frequencies and duties cycles which may deviate from properties resulting from a direct current deposition at a similar averaged current density. Though such high frequency pulsing variations may be used in some implementations of the present invention, since the variations of primary interest in the present application are those related to different regions of material that are each microns to tens of microns in height, it is the slower of rates of change between at least one of maximum current density, minimum current density and even applied duty cycle that may bring the types of changes in material properties that are of interest herein.

(4) Slow variations in reversed pulse plating parameters.

(5) Plating bath temperature.

[36] FIG. 2A provides a cut view of multiple openings in a photoresist that forms a plating template while FIG. 2B provides a cut view of the openings in the plating template and a composite material including co-plated metal and nano-fibers that form composite structures or portions of a composite structures (e.g. probes) wherein the plated material includes nano-fibers with a nominal diameter “d” and a length “L”. More particularly, as shown in FIG. 2A, a probe substrate 110 is provided and a plating template 120 is formed thereon, being a deposition mask of photoresist having been subjected to process realizing multiple openings 130 therein, corresponding to a an initial step of a method of forming a probe array according to an embodiment of the invention. Moreover, as shown in FIG: 2B, the multiple openings 130 are filled in with a composite material 140 including co-plated metal 150 and nano-fibers 160 to form a plurality of probes 100 according to a first embodiment of the invention. Each probe 100 has a first contact region 100A and a second contact region 100B, as well as an elastically deformable body portion 100C which extend between the first and second contact region 100A, 100B. More particularly, the elastically deformable body portion 100C has a first end 100C1 and a second end 100C2, the first contact region 100A of the probe 100 being connected directly or indirectly to the first end 100C1 of the elastically deformable body portion 100C and the second contact region 100B of the probe 100 being connected directly or indirectly to the second end 100C2 of the elastically deformable body portion 100C.

[37] According to this first embodiment of the invention, the elastically deformable body portion 100C comprises a plurality of nano-fibers 160 embedded in a structural metal 150, the elastically deformable body portion 100C being thus formed by the composite material 140. The nano-fibers 160 may comprise a material selected from a group consisting of: (1) metal nanorods, (2) nanotubes, and (3) carbon nanotubes.

[38] FIGS. 2C1 - 2C5 illustrate side views of an exemplary probe array or array configuration 200 including probes 100 of the type shown in FIG. 2B using different types of guides and/or mounting structures.

[39] More particularly, FIG. 2C1 shows a plurality of exemplary probes 100 held in an array configuration 200 by an array substrate, in particular a permanent array substrate 210 that may or may not be a build substrate, in particular the probe substrate 110 where the plating template 120 is formed onto. The probes 100 may be bonded to the array substrate 210 at a plurality of bonding location 21 OA, so that the array substrate 210 is a probe array retention structure. FIG. 2C2 shows a plurality of exemplary probes 100 held in the array configuration 200 by a combination of the array substrate 210 and a guide plate 220 as a probe array retention structure. The guide plate 200 comprises a plurality of holes 240 which engage the probes 100 that are inserted wherein the holes 240 in the guide plate 240 are laterally aligned with bonding locations 210A on the array substrate 210. Even if not shown in the figure, the probes 100 may have a not straight configuration, the bonding locations 210 on the array substrate 210 being thus laterally shifted with respect to the holes 240 in the guide plate 220 so as to correctly held the probes 100 in the desired probe array configuration 200.

[40] FIG. 2C3 shows exemplary probes 100 held in the array configuration 200 by a plurality of guide plates 220A, 220B, two in the example, having respective plurality of holes 240A, 240B that are laterally aligned and held the probes 100, being straight pins, in a desired probe array configuration 200. FIG. 2C4 shows example probes 100 that have a not straight configuration, either been pre-shaped or shaped by relative lateral movement of the two guide plates 220A, 220B of FIG. 2C3. The two guide plates 220A, 220B comprises respective holes 240A, 240B being laterally shifted so as to correctly held the probes 100 in the desired probe array configuration 200.

[41 ] FIG. 2C5 shows a plurality of probes 100 held in an array configuration 200 by a retention or alignment structure or plate 230 having a plurality of retention holes 250. The retention plate 230 has a thickness Th that may be selected from a group consisting of: (1 ) at least ! of a longitudinal length of the probes 100; (2) at least ¹/z of the longitudinal length of the probes ; (3) at least % of the longitudinal length of the probes 100, the longitudinal length of the probes 100 being the length from the first contact region 100A to the second contact region 100B. As shown in the figure, the thickness of the retention plate 230 is the length of the retention holes 250 provided therein.

[42] Other example array embodiments are possible and will be apparent to those of skill in the art upon review of the teachings herein.

[43] According to a second embodiment of the invention, nano-fibers 160 are first grown or positioned within an opening 130 in a photoresist 120 and a structural metal 150 is plated into the opening 130 to surround and encapsulate the fibers 160 as shown in FIGS. 3A and 3B. In particular, FIG. 3A shows nano-particles 160 created within openings 130 in a mask 120 formed on a probe substrate 110 corresponding to an initial step of a method of forming a probe array according to an embodiment of the invention while FIG. 3B shows the state of the probe array after depositing metal 150 (e.g. via electroplating) into the opening 130 containing the nano-fibers 160, corresponding to a further step of a method of forming a probe array according to an embodiment of the invention, the multiple openings 130 filled in with a composite material 140 including the depositing metal 150 and nano-fibers 160 thus form a plurality of probes 100 according to the second embodiment of the invention. As previously, the nano-fibers 160 may comprise a material selected from a group consisting of: (1) metal nanorods, (2) nanotubes, and (3) carbon nanotubes.

[44] Each probe 100 has a first contact region 100A and a second contact region 100B, as well as an elastically deformable body portion 100C which extend between the first and second contact region 100A, 100B. More particularly, the elastically deformable body portion 100C has a first end 100C1 and a second end 100C2, the first contact region 100A of the probe 100 being connected directly or indirectly to the first end 100C1 of the elastically deformable body portion 100C and the second contact region 100B of the probe 100 being connected directly or indirectly to the second end 100C2 of the elastically deformable body portion 100C.

[45] It should be remarked that, according to the first and second embodiments, tuning of material properties may be controlled by modulating the plating parameters and/or by controlling or modulating the fiber material or its properties (including, for example, the average fiber diameter, the density of the fibers, and the porosity between the fibers). Moreover, the probes 100 may additionally include a plurality of adhered layers.

[46] In some embodiments, the photoresist template or deposition mask 120 may be replaced by a different template material (e.g., a metallic sacrificial material). In some variations the nano-fibers may be located prior to formation of the masking material in either a selective manner or in a blank fashion with some of the fibers becoming hidden or buried by the masking material wherein such fibers may be removed along with the masking material after deposition of the structural metal.

[47] FIGS. 3C1 - 3C5 illustrate side views of exemplary probe arrays or array configurations 200 including probes 100 of the type shown in FIG. 3B using different types of guides and/or mounting structures. More particularly, FIG. 3C1 shows a plurality of exemplary probes 100 held in an array configuration 200 by a permanent array substrate 210 that may or may not be a build substrate, in particular the probe substrate 110. The probes 100 may be bonded to the array substrate 210 at a plurality of bonding location 210A, so that the array substrate 210 is a probe array retention structure. FIG. 3C2 shows a plurality of exemplary probes 100 held in an array configuration 200 by a combination of a permanent array substrate 210 and a guide plate 220. The guide plate 200 comprises a plurality of holes 240 which engage the probes 100 that are inserted wherein the holes 240 in the guide plate 240 are laterally aligned with bonding locations 210A on the array substrate 210. The probes 100 may have a not straight configuration (not shown), the bonding locations 210 on the array substrate 210 being thus laterally shifted with respect to the holes 240 in the guide plate 220 so as to correctly held the probes 100 in the desired probe array configuration 200.

[48] FIG. 3C3 shows exemplary probes 100 held in an array configuration 200 by a plurality of guide plates, in particular a first guide plate 220A and a second guide plate 22B having respective plurality of holes 240A, 240B that are laterally aligned and held the probes 100, being straight pins, in the array configuration 200. FIG. 3C4 shows exemplary probes 100 that have a not straight configuration, either been pre-shaped or shaped by relative lateral movement of the two guide plates 220A, 220B of FIG. 3C3. The two guide plates 220A, 220B comprises respective holes 240A, 240B being laterally shifted so as to correctly held the probes 100 in the desired probe array configuration 200.

[49] FIG. 3C5 shows a plurality of exemplary probes 100 held in an array configuration 200 by a thick retention or alignment structure or plate 230 having a plurality of retention holes 250. Also in this case, the retention or alignment plate 230 has a thickness Th that may be selected from a group consisting of: (1) at least % of a longitudinal length of the probes 100; (2) at least ¹/z of the longitudinal length of the probes 100; (3) at least % of the longitudinal length of the probes 100, the longitudinal length of the probes 100 being the length from the first contact region 100A to the second contact region 100B. As shown in the figure, the thickness of the retention plate 230 is the length of the retention holes 250 provided therein.

[50] Other example array embodiments are possible and will be apparent to those of skill in the art upon review of the teachings herein.

[51 ] Variations of these first two embodiments are possible. In some embodiments, the deposited material may be planarized alone, as a combination of both metal and nano-fibers, or in combination with the photoresist or other masking or sacrificial material. In some embodiments, structures may be formed from single layers of combined nano-fibers and metal. In other embodiments, metal and nano-fiber structures may also include regions or metal without nanofibers, dielectrics without nanofibers, and/or dielectrics with nanofibers.

[52] In other alternatives, a single layer may form only a portion of a structure to be completed. In such alternatives, additional portions of the structure may be added or attached to the initial layer in any appropriate manner. For example, one or more additional portions of the structure may be formed by forming one or more additional layers on an already formed layer. The formation of the additional layer or layers may involve the use of the same or different structural materials, repeated use of the same cross-sectional configuration or different cross-sectional configurations, use of the same formation process or use of different formation processes. In some variations, the metal being deposited and/or the fiber located, created, or co-deposited may be modified one or more times prior to completing formation of the layer. [53] In some embodiments, only a portion of the layers may include fibers as one of the structural materials or as part of the structural material. In some embodiments, the fibers may be part of layers that include structural dielectrics as opposed to or in addition to electroplated metals.

[54] In some embodiments, metal deposition may occur by a process other than electrodeposition (e.g., electroless deposition, vacuum or vapor deposition, and the like). In some alternatives, the fiber inclusion process of FIG. 2B may be used on one or more layers while the fiber inclusion process of FIGS. 3A & 3B may be used during the formation of one or more other layers. In some variations, after formation of a layer of the structure, portions of the plated structural metal (e.g. from the top 1 - 20% of the layer) may be removed by chemical or electrochemical etching leaving portions of the fiber exposed which can then be interlaced with fibers or metal or dielectrics forming part of a next portion of the structure (e.g. a next layer). In embodiments where planarization of layers is not to occur, instead of removing metal from one layer to allow interlacing to occur with a next layer, the fibers from the preceding layer may simply not be fully covered by metal deposited during formation of that layer leaving fibers available for interlacing with formation of a next layer.

[55] In some alternatives, the photoresist material of the deposition mask 120 may be replaced with a different material prior to creating or locating the fibers and depositing the structural material(s) or co-depositing the fibers and other structural materials. In such cases, the original openings in the photoresist may be provided with a complementary pattern to that shown such that the photoresist openings receive a sacrificial material which is provided with second openings by removal of the photoresist which are of the desired pattern for receiving structural material. In some alternatives, the structure(s) may be formed on a permanent array substrate (i.e. a substrate that will be included in the final product) or on a temporary array substrate overlaid with a sacrificial or release layer or the temporary substrate may be a sacrificial substrate that will be destroyed when separated from the structure or structures. In some alternatives, the initial layer as illustrated might actually be something other than a first layer.

[56] Numerous other variations of the above two embodiment groups are possible and include for example: (1 ) growing the vertically aligned fibers on a separate substrate and then transferring them into patterned areas of the probe substrate to be plated, (2) growing the vertically aligned fibers as a continuous film on a probe substrate, followed by photoresist application and patterning, then plating, and then removal of the fibers that are not encapsulated by structural material.

[57] Embodiments of this invention can enable the use and implementation of selected plated materials for specific applications, such as very small pitch probing applications, by enabling the modulation of some of the material properties independently (e.g., elastic modulus independently of yield strength).

[58] According to the disclosure, a method of forming a probe array 200 is provided. The method comprises:

(a) forming a plurality of probes 100, each having an elastically deformable body portion 100C, a first contact region 100A and a second contact region 100B, the elastically deformable body portion 100C having a first end 100C1 and a second end 100C2 connected directly or indirectly to the first contact region 100A and the second contact region 100B, respectively;

(b) providing an array substrate 210;

(c) providing at least one probe array retention structure to hold the probes 100 in a desired configuration of the probe array 200.

[59] The forming of the probe 100 comprises forming the elastically deformable body 100C by a composite material 140 comprising a plurality of nano-fibers 160 and at least one structural metal 150.

[60] More particularly, according to an embodiment, forming a plurality of probes 100 may include:

(i) providing a probe substrate 110, that may be a build substrate; and

(ii) forming a plating template 120 with a plurality of openings 130 wherein the probes 100 are formed.

[61 ] The method may further comprise a subsequent step of (iii) forming the composite material 140 of the probes 100 selected from a group consisting of:

(A) simultaneously co-depositing a plurality of nano-fibers 160 and at least one structural metal 150 into the plurality of openings 130 of the plating template 120;

(B) simultaneously co-depositing a plurality of nano-fibers 160 and at least one structural metal 150 into the plurality of openings 130 of the plating template 120, wherein fiber properties (e.g. distribution, average size, size distribution, and/or material composition) within a plating solution are maintained at a substantially uniform level during the co-depositing to provide uniform properties to the resulting composite material 140;

(C) simultaneously co-depositing a plurality of nano-fibers 160 and at least one structural metal 150 into the plurality of openings 130 of the plating template 120, wherein fiber properties within a plating solution are varied during the co-depositing to cause varying properties within the resulting composite material 140;

(D) locating a plurality of nano-fibers 160 into the plurality of openings 130 of the plating template 120 and thereafter depositing at least one structural metal 150 into the plurality of openings 130 of the plating template 120; (E) locating a plurality of longitudinally oriented nano-fibers 160 into the plurality of openings 130 of the plating template 120 and thereafter depositing at least one structural metal 150 into the plurality of openings 130 of the plating template 120;

(F) growing a plurality of nano-fibers 160 in the plurality of openings 130 of the plating template 120 and thereafter depositing at least one structural metal 150 into the plurality of openings 130 of the plating template 120;

(G) growing a plurality of longitudinally oriented nano-fibers 160 in the plurality of openings 130 of the plating template 120 and thereafter depositing at least one structural metal 150 into the plurality of openings 130 of the plating template 120.

[62] The method may further comprise (H) planarizing the deposited material.

[63] According to an alternative embodiment, forming a plurality of probes 100 may include:

(i) providing a probe substrate 110, that may be a build substrate;

(ii) providing a plurality of nano-fibers 160 directly or indirectly on the probe substrate 110;

(iii) forming a patterned plating template 120 with a plurality of openings 130 that contains the plurality of nano-fibers 160;

(iv) depositing at least one structural metal 150 into the plurality of openings 130 of the plating template 120, and

(v) removing the plating template 120 along with at least a portion of any nanofibers 160 that are not held by the deposited structural metal 140 as deposited.

[64] More particularly, providing the plurality of nano-fibers 160 may be selected from a group consisting of:

(A) locating a plurality of nano-fibers 160 directly or indirectly on a probe substrate 1 10;

(B) locating a plurality of longitudinally oriented nano-fibers 160 directly or indirectly on the probe substrate 110;

(C) growing a plurality of nano-fibers 160 directly or indirectly on the probe substrate 110; and

(D) growing a plurality of longitudinally oriented nano-fibers 160 directly or indirectly on the probe substrate 110.

[65] Also, according to this alternative embodiment, the method may further comprise (E) planarizing the deposited material.

[66] Furthermore, providing at least one probe array retention structure may be selected from a group consisting of: (i) bonding the first contact region 100A of the probes 100 at a plurality of boding location 21 OA of the array substrate 220, wherein the array substrate 220 comprises the probe substrate 1 10 being a build substrate; and

(ii) bonding the first contact regions 100A of the probes 100 at a plurality of boding location 21 OA of the array substrate 220, wherein the array substrate 220 and the probe substrate 110 being a build substrate are different.

[67] Furthermore, providing at least one probe array retention structure may further comprise a step selected from a group consisting of:

(iii) providing at least one guide plate 220 having a plurality of holes 240 that engage the probes 100;

(iv) providing at least one guide plate 220 having a plurality of holes 240 and inserting the probes 100 into the plurality of holes 240 that are laterally aligned with bonding locations 210A on the array substrate 210;

(vi) providing at least one guide plate 220 having a plurality of holes 240 and inserting the probes 100 into the plurality of holes 240, and laterally shifting the at least one guide plate 220 and the array substrate 210 so that the plurality of holes 240 in the at least one guide plate 220 are laterally shifted with respect to bonding locations 21 OA on the array substrate 210;

(vii) providing a plurality of guide plates 220A, 220B each having a plurality of holes 240A, 240B which engage the probes 100;

(viii) providing a plurality of guide plates 220A, 220B, each having a plurality of holes 240A, 240B which engage the probes 100, wherein at least one of the plurality of guide plates 220A, 220B has a plurality of holes 240A, 240B that engage probes 100;

(ix) providing a plurality of guide plates 220A, 220B, each having a plurality of holes 240A, 240B which engage the probes 100, wherein at least two of the plurality of guide plates 220A, 220B have respective plurality of holes 240A, 240B engaging probes that are laterally aligned with respect to one another;

(ix) providing a plurality of guide plates 220A, 220B, each having a plurality of holes 240A, 240B which engage the probes 100, wherein at least two of the plurality of guide plates 220A, 220B have respective plurality of holes 240A, 240B engaging probes that are laterally shifted with respect to one another;

(x) providing a retention or alignment structure or plate 230 with a plurality of retention holes 250 for receiving probes and inserting the probes 100 into the plurality of retention holes 250;

(xi) providing a retention plate 230 with a plurality of retention holes 250 for receiving probes 100 and inserting the probes 100 into the plurality of retention holes 250, wherein the retention plate 230 has a thickness Th selected from a group consisting of: (1 ) at least 14 of a longitudinal length of the probes 100; (2) at least ¹/z of a longitudinal length of the probes 100; (3) at least % of a longitudinal length of the probes 100, the longitudinal length of the probes 100 being a length from the first contact region 100A to the second contact region 100B thereof.

[68] The method may in particular comprise providing nano-fibers 160 selected from a group consisting of: (1) metal nanorods, (2) nanotubes, and (3) carbon nanotubes.

[69] Further Comments and Conclusions

[70] Various other embodiments of the present invention exist. Some of these embodiments may be based on a combination of the teachings herein.

[71 ] Some fabrication embodiments may not use any blanket deposition process. Some embodiments may use selective deposition processes or blanket deposition processes on some layers that are not electrodeposition processes. Some embodiments may use nickel or nickelcobalt as a structural material while other embodiments may use different materials. For example, preferred spring materials include nickel (Ni), copper (Cu), beryllium copper (BeCu), nickel phosphorous (Ni-P), tungsten (W), aluminum copper (Al-Cu), steel, P7 alloy, palladium, palladiumcobalt, silver, molybdenum, manganese, brass, chrome, chromium copper (Cr-Cu), and combinations of these. Some embodiments may use copper as the structural material with or without a sacrificial material. Some embodiments, for example, may use nickel, nickelphosphorous, nickel-cobalt, palladium, palladium-cobalt, gold, copper, tin, silver, zinc, solder, rhodium, rhenium as structural materials while other embodiments may use different materials. Some embodiments, for example, may use copper, tin, zinc, solder or other materials as sacrificial materials. Some embodiments may use different structural materials on different layers or on different portions of single layers. Some embodiments may remove a sacrificial material while other embodiments may not. Some embodiments may use photoresist, polyimide, glass, ceramics, other polymers, and the like as dielectric structural materials.

[72] Structural or sacrificial dielectric materials may be incorporated into embodiments of the present invention in a variety of different ways. Such materials may form a third material or higher deposited material on selected layers or may form one of the first two materials deposited on some layers.

[73] Some embodiments may employ diffusion bonding or the like to enhance adhesion between successive layers of material.

[74] It will be understood by those of skill in the art that additional operations may be used in variations of the above presented method of making embodiments. These additional operations may, for example, perform cleaning functions (e.g., between the primary operations discussed herein or discussed in the various materials incorporated herein by reference, they may perform activation functions and monitoring functions, and the like.

[75] It will also be understood that the probe elements of some aspects of the invention may be formed with processes which are very different from the processes set forth herein and it is not intended that structural aspects of the invention need to be formed by only those processes taught herein or by processes made obvious by those taught herein.

[76] Though various portions of this specification have been provided with headers, it is not intended that the headers be used to limit the application of teachings found in one portion of the specification from applying to other portions of the specification. For example, alternatives acknowledged in association with one embodiment, are intended to apply to all embodiments to the extent that the features of the different embodiments make such applications functional and do not otherwise contradict or remove all benefits of the adopted embodiment. Various other embodiments of the present invention exist. Some of these embodiments may be based on a combination of the teachings set forth herein with various teachings incorporated herein by reference.

[77] It is intended that any aspects of the invention set forth herein represent independent invention descriptions which Applicant contemplates as full and complete invention descriptions that Applicant believes may be set forth as independent claims without need of importing additional limitations or elements, from other embodiments or aspects set forth herein, for interpretation or clarification other than when explicitly set forth in such independent claims once written. It is also understood that any variations of the aspects set forth herein represent individual and separate features that may form separate independent claims, be individually added to independent claims, or added as dependent claims to further define an invention being claimed by those respective dependent claims should they be written.

[78] In view of the teachings herein, many further embodiments, alternatives in design and uses of the embodiments of the instant invention will be apparent to those of skill in the art. As such, it is not intended that the invention be limited to the particular illustrative embodiments, alternatives, and uses described above but instead that it be solely limited by the claims presented hereafter.

Claims

CLAIMS What is claimed is:

1. A probe (100), comprising:

(a) an elastically deformable body portion (100C) having a first end (100C1 ) and a second end (100C2);

(b) a first contact region (110A) connected directly or indirectly to the first end (100C1 ); and

(c) a second contact region (100B) connected directly or indirectly to the second end (100C2), wherein the elastically deformable body portion (100C) comprises a plurality of nano-fibers (160) embedded in a structural metal (150) to form a composite material (140).

2. The probe of claim 1 wherein the nano-fibers (160) comprise a material selected from a group consisting of: (1) metal nanorods, (2) nanotubes, and (3) carbon nanotubes.

3. The probe of claim 1 comprising a plurality of adhered layers.

4. The probe of claim 1 wherein the first contact region (110A) is configured for a function selected from a group consisting of: (1 ) making temporary pressure based electrical contact to a first electronic component upon elastically biasing the elastically deformable body portion (100C) with the first contact region (100A) against the first electronic component, and (2) bonding to the first electronic component for making permanent contact.

5. The probe of claim 4 wherein the first contact region (100A) is configured for bonding to the first electronic component for making permanent contact.

6. The probe of claim 4 wherein the first contact region (100A) is configured for making temporary contact.

7. The probe of claim 1 wherein the second contact region (100B) is configured for making temporary pressure based electrical contact to a second electronic component upon elastically biasing the elastically deformable body portion (100C) with the second contact region (100B) against the second electronic component.

8. A probe array (200), comprising:

(a) a plurality of probes (100), comprising:

(i) an elastically deformable body portion (100C) having a first end (100C1) and a second end (100C2);

(ii) a first contact region (100A) connected directly or indirectly to the first end (100C1 ); and

(iii) a second contact region (100B) connected directly or indirectly to the second end (100C2), wherein the elastically deformable body portion (100C) comprises a plurality of nano-fibers (160) embedded in a structural metal (150), and

(b) at least one probe array retention structure to hold the probes (100) in a desired probe array configuration.

9. The probe array (200) of claim 8, wherein the at least one probe array retention structure is selected from a group consisting of:

(i) a substrate (210) to which the first contact regions (100A) of the probes (100) are bonded at a plurality of bonding locations (210A);

(ii) a substrate (210) to which the first contact regions (100A) of the probes (100) are bonded along with at least one guide plate (220) having a plurality of holes (240) which engage the probes (100) wherein the holes (240) in the guide plate (220) are laterally aligned with bonding locations (210A) on the substrate (210);

(iii) a substrate (210) to which the first contact regions (100A) of the probes (100) are bonded along with at least one guide plate (220) having a plurality of holes (240) which engage the probes (100) wherein the holes (240) in at least one of the at least one guide plate (220) are laterally shifted relative to the bonding locations (210A) on the substrate (210);

(iv) a plurality of guide plates (220A, 220B), each having a plurality of holes (240A, 240B) which engage the probes (100);

(v) a plurality of guide plates (220A, 220B), each having a plurality of holes (240A, 240B) which engage the probes (100), wherein at least two of the plurality of guide plates (220A, 220B) have holes (240A, 240B) engaging probes that are laterally aligned;

(vi) a plurality of guide plates (220A, 220B), each having a plurality of holes (240A, 240B) which engage the probes (100), wherein at least two of the plurality of guide plates (220A, 220B) have holes (240A, 240B) engaging probes that are laterally shifted with respect to one another; and

(vii) a retention plate (230) having a plurality of retention holes (250) into which the probes (100) are inserted.

10. The probe array (200) of claim 9, wherein the at least one probe array retention structure is a retention plate (230) which has thickness (Th) selected from a group consisting of: (1 ) at least % of a longitudinal length of the probes (100) from first contact region (100A) to second contact region (100B); (2) at least ¹/2 of a longitudinal length of the probes (100) from first contact region (100A) to second contact region (100B) ; (3) at least % of a longitudinal length of the probes (100) from first contact region (100A) to second contact region (100B).

11 . The probe array of claim 8 wherein the nano-fibers (160) in the elastically deformable body portion (100C) of the probes (100) comprise a material selected from a group consisting of: (1 ) metal nanorods, (2) nanotubes, and (3) carbon nanotubes.

12. The probe array of claim 8, wherein the probes (100) comprise a plurality of adhered layers.

13. The probe array of claim 8 wherein the first contact region (100A) of the probes (100) is configured for a function selected from a group consisting of: (1 ) making temporary pressure based electrical contact to a first electronic component upon elastically biasing the elastically deformable body portion (100C) with the first contact region (100A) against the first electronic component, and (2) bonding to the first electronic component for making permanent contact.

14. The probe array of claim 12 wherein the first contact region (100A) of the probes (100) is configured for bonding to the first electronic component for making permanent contact.

15. The probe array of claim 12 wherein the first contact region (100A) of the probes (100) is configured for making temporary contact.

16. The probe array of claim 8 wherein the second contact region (100B) of the probes (100) is configured for making temporary pressure based electrical contact to a second electronic component upon elastically biasing the elastically deformable body portion (100C) with the second contact region (100B) against the second electronic component.

17. A method of forming a probe array (200), comprising:

(a) forming a plurality of probes (100), each having an elastically deformable body portion (100C), a first contact region (100A) and a second contact region (100B), the elastically deformable body portion (100C) having a first end (100C1 ) and a second end (100C2) connected directly or indirectly to the first contact region (100A) and the second contact region (100B), respectively;

(b) providing an array substrate (210);

(c) providing at least one probe array retention structure to hold the probes (100) in a desired configuration of the probe array (200); wherein forming of the probes (100) comprises forming the elastically deformable body (100C) of each probe by a composite material (140) comprising a plurality of nano-fibers (160) and at least one structural metal (150).

18. The method of claim 17, wherein forming the plurality of probes (100) comprises:

(i) providing a probe substrate (110); and

(ii) forming a plating template (120) with a plurality of openings (130) wherein the probes (100) are formed,

(iii) forming the composite material (140) of the probes (100) selected from a group consisting of:

(A) simultaneously co-depositing a plurality of nano-fibers (160) and at least one structural metal (150) into the plurality of openings (130);

(B) simultaneously co-depositing a plurality of nano-fibers (160) and at least one structural metal (150) into the plurality of openings (130) of the plating template (120), wherein fiber properties within a plating solution are maintained at a uniform level during the codepositing to provide uniform properties to the resulting composite material (140);

(C) simultaneously co-depositing a plurality of nano-fibers (160) and at least one structural metal (150) into the plurality of openings (130) of the plating template (120), wherein fiber properties within a plating solution are varied during the co-depositing to cause varying properties within the resulting composite material (140);

(D) locating a plurality of nano-fibers (160) into the plurality of openings (130) of the plating template (120) and thereafter depositing at least one structural metal (150) into the plurality of openings (130) of the plating template (120); (E) locating a plurality of longitudinally oriented nano-fibers (160) into the plurality of openings (130) of the plating template (120) and thereafter depositing at least one structural metal (150) into the plurality of openings (130) of the plating template (120);

(F) growing a plurality of nano-fibers (160) in the plurality of openings (130) of the plating template (120) and thereafter depositing at least one structural metal (150) into the plurality of openings (130) of the plating template (120);

(G) growing a plurality of longitudinally oriented nano-fibers (160) in the plurality of openings (130) of the plating template (120) and thereafter depositing at least one structural metal (150) into the plurality of openings (130) of the plating template (120).

19. The method of claim 18, further comprising (H) planarizing the deposited material.

20. The method of claim 17, wherein forming the plurality of probes (100) comprises:

(i) providing a probe substrate (110);

(ii) providing a plurality of nano-fibers (160) directly or indirectly on the probe substrate (110);

(iii) forming a patterned plating template (120) with a plurality of openings (130) that contains the plurality of nano-fibers (160);

(iv) depositing at least one structural metal (150) into the plurality of openings (130) of the plating template (120), and

(v) removing the plating template (120) along with at least a portion of any nanofibers (160) that are not held by the structural metal (140) as deposited.

21 . The method of claim 20, wherein providing the plurality of nano-fibers (160) is selected from a group consisting of:

(A) locating a plurality of nano-fibers (160) directly or indirectly on a probe substrate (110);

(B) locating a plurality of longitudinally oriented nano-fibers (160) directly or indirectly on the probe substrate (110);

(C) growing a plurality of nano-fibers (160) directly or indirectly on the probe substrate (110); and

(D) growing a plurality of longitudinally oriented nano-fibers (160) directly or indirectly on the probe substrate (110).

22. The method of claim 20, further comprising (E) planarizing the deposited material.

23. The method of claim 18, wherein providing at least one probe array retention structure is selected from a group consisting of:

(i) bonding the first contact region (100A) of the probes (100) at a plurality of boding location (210A) of the array substrate (220), wherein the array substrate (220) comprises the probe substrate (110) being a build substrate; and

(ii) bonding the first contact regions (100A) of the probes (100) at a plurality of boding location (210A) of the array substrate (220), wherein the array substrate (220) and the probe substrate (110) being a build substrate are different.

24. The method of claim 23, further comprising a step selected from a group consisting of:

(iii) providing at least one guide plate (220) having a plurality of holes (240) that engage the probes (100);

(iv) providing at least one guide plate (220) having a plurality of holes (240) and inserting the probes (100) into the plurality of holes (240) that are laterally aligned with bonding locations (210A) on the array substrate (210);

(vi) providing at least one guide plate (220) having a plurality of holes (240) and inserting the probes (100) into the plurality of holes (240), and laterally shifting the at least one guide plate (220) and the array substrate (210) so that the plurality of holes (240) in the at least one guide plate (220) are laterally shifted with respect to bonding locations (210A) on the array substrate (210);

(vii) providing a plurality of guide plates (220A, 220B), each having a plurality of holes (240A, 240B) which engage the probes (100);

(viii) providing a plurality of guide plates (220A, 220B), each having a plurality of holes (240A, 240B) which engage the probes (100), wherein at least one of the plurality of guide plates (220A, 220B) has a plurality of holes (240A, 240B) engaging probes that are laterally aligned;

(ix) providing a plurality of guide plates (220A, 220B), each having a plurality of holes (240A, 240B) which engage the probes (100), wherein at least two of the plurality of guide plates (220A, 220B) have respective plurality of holes (240A, 240B) engaging probes that are laterally aligned with respect to one another;

(ix) providing a plurality of guide plates (220A, 220B), each having a plurality of holes (240A, 240B) which engage the probes (100), wherein at least two of the plurality of guide plates (220A, 220B) have respective plurality of holes (240A, 240B) engaging probes that are laterally shifted with respect to one another;

(x) providing a retention plate (230) with a plurality of retention holes (250) for receiving probes and inserting the probes (100) into the plurality of retention holes (250);

(xi) providing a retention plate (230) with a plurality of retention holes (250) for receiving probes and inserting the probes (100) into the plurality of retention holes (250), wherein the retention plate (230) has a thickness (Th) selected from a group consisting of: (1 ) at least ¹, of a longitudinal length of the probes (100); (2) at least ¹/2 of a longitudinal length of the probes (100); (3) at least % of a longitudinal length of the probes (100), the longitudinal length of the probes (100) being a length from the first contact region (100A) to the second contact region (100B) thereof.

25. The method of claim 18, wherein nano-fibers (160) are provided selected from a group consisting of: (1) metal nanorods, (2) nanotubes, and (3) carbon nanotubes.