WO2025021283A1 - Cooling circuit device and heat pump - Google Patents

Abstract

The invention relates to a cooling circuit device (10) for a heat pump, comprising a first cooling circuit module (11) and a second cooling circuit module (12). The cooling circuit modules (11, 12) form at least one part of a heat pump refrigerant circuit in which a refrigerant circulates. The first cooling circuit module (11) comprises a compressor for compressing the refrigerant and flow paths for the refrigerant. The second cooling circuit module (12) comprises an expansion valve (12e, 12f) for expanding the refrigerant and flow paths for the refrigerant. The first cooling circuit module (11) is fluidically connected to the second cooling circuit module (12).

Description

REFRIGERATION CYCLE DEVICE AND HEAT PUMP

field of the invention

The present invention relates to a refrigeration circuit device for a heat pump and a heat pump for heating and/or cooling a building. In particular, a high degree of integration of the individual components of a refrigeration circuit is intended to achieve a particularly compact design of the refrigeration circuit device with as few refrigeration lines as possible. This also makes it possible to achieve particularly safe and low-maintenance operation of the heat pump.

Background of the invention

Modern heat pumps are characterized by a high level of efficiency and can therefore be used in an ecologically and economically attractive way for heating and/or cooling a building, especially a residential building or office building. On the one hand, heating with environmental heat is climate-friendly. On the other hand, many energy suppliers have been offering special heat pump tariffs for several years that are financially more attractive than a normal electricity tariff.

The German patent application DE 10 2018 102 670 A1 describes a heat pump 1 with an integrated buffer storage tank 3, which is shown schematically in Fig. 1. The heat pump system 10 shown in Fig. 1 consists, in a known manner, of a heat pump 1 and a heat sink 2. As an example, a heating circuit 2.1 with a large number of radiators 2.3 and a hot water tank 2.2 are shown as heat sink 2 in Fig. 1. In normal operation or heating operation, ambient heat is transferred from the heat pump 1 to the heat sink 2.

The heat pump system 10 has a heat exchanger 6 which operates as a condenser and through which a heating circuit medium flows. An output 3.2 of the buffer tank 3 is connected upstream of an inlet 6.2 of the heat exchanger 6 in the flow direction of the heating circuit medium. The heating circuit medium flows via a return line RL from the heat sink 2 or from the outlet 3.2 of the buffer tank 3 in the direction of the heat pump 1, which is indicated in Fig. 1 by an arrow pointing to the left. Accordingly, the heating circuit medium flows via a flow line VL from the heat pump to the heat sink 2 or to the inlet 3.1 of the buffer tank 3, which is indicated in Fig. 1 by an arrow pointing to the right.

The heat pump system 10 shown in Fig. 1 consists of two interconnected system parts, one of which is located inside the building and one outside the building. Such a configuration is also referred to as a split heat pump. The two system parts are usually referred to as the outdoor unit (ODU) and the indoor unit (IDU). The coolant circulates between the outdoor unit ODU and the indoor unit IDU. In this design, the buffer tank 3 is also located in the indoor unit IDU. In a known monoblock heat pump, the outdoor unit ODU and the indoor unit IDU are arranged in a common housing.

A heating circuit pump 7 for circulating the heating circuit medium is arranged between the inlet 6.2 of the heat exchanger 6 on the return line RL and the buffer tank 3. Furthermore, a temperature sensor 11 for measuring the return temperature of the heating circuit medium is arranged in the return line RL.

In normal operation, the coolant of the heat pump 1 absorbs ambient heat via the external unit ODU (Fig. 1 shows a schematic of the evaporator with a fan 8). The coolant is then transported via a compressor 9.1 to the heat exchanger 6, which works as a condenser, in order to release the absorbed heat to the heating circuit medium. The coolant is then expanded in a known manner via an expansion valve 9.2 before it returns to the evaporator 5. From the heat exchanger 6, the heating circuit medium first passes through the flow line VL to a valve 4, which is designed as a 4/3-way valve, for example. Depending on requirements, the heating circuit medium is then directed to the heating circuit 2.1 with the radiators 2.3 and/or to the hot water tank 2.2. The cooled heating circuit medium returns to the heat exchanger 6 via the return line RL through the inlet 6.2 to close the circuit.

Furthermore, from the international patent application WO 2010/014878 A1, a refrigeration circuit device is known which consists of several refrigeration circuit components and several refrigeration circuit lines connecting the refrigeration circuit components to one another. At least one part of a refrigeration circuit component and at least one refrigeration circuit line are formed in a monolithic body produced by primary molding, whereby the number and length of lines in the refrigerant circuit are to be reduced.

As in Wikipedia (see https://de.wikipedia.org/wiki/Urformen), here and in the following description, the term "primary forming" is to be understood as a main group of manufacturing processes in which a solid body with a geometrically defined shape is produced from a shapeless material or blank. Primary forming can in particular include a milling process, a casting process, a sintering process, an additive process and the like. As an alternative to primary forming, one-piece or monolithic components can also be manufactured by forming, e.g. by deep drawing a single sheet of metal.

The adjective "monolithic" used above (again as in Wikipedia: https://de.wikipedia.org/wiki/Monolith) means here and in the following in this description something like "compact" or "from a single cast" or "in one piece" or "connected". A monolithic body formed by primary forming can, for example, be a workpiece that is made from a single, connected metal blank by machining such as milling. Another example of a monolithic body formed by primary forming A monolithic body formed by a mold is a workpiece formed from metal powder or plastic powder by additive processes (e.g. laser deposition welding or sintering or 3D printing). Furthermore, for example, a component manufactured by an injection molding process or by a metal casting process can be a monolithic body formed by primary molding.

The refrigerant circuit of a heat pump of the type described above according to the prior art can have a large number of lines, which can be made of copper and/or other metals and/or plastics, for example. These lines can be designed in particular as pipes and/or hoses and can therefore be rigid or movable. Individual pipe sections and/or hose sections can be firmly connected, for example by soldering, pressing or welding or a similar process, or they can be detachably connected to one another using a sealed coupling. There is a risk of leaks occurring, particularly at such detachable connections.

Since copper in particular as a raw material can entail high costs in production, there is a need to achieve the smallest possible total length of all the relevant lines in the refrigeration circuit. Reducing the total length of the lines can also advantageously reduce the amount of refrigerant required. Furthermore, the number of connections between individual line sections should be reduced. This can significantly reduce the risk of leaks. This can be particularly advantageous when using a flammable and/or toxic and/or environmentally harmful refrigerant. In particular, when using the natural refrigerant R290 (propane), it is advantageous if the total amount of refrigerant and the risk of leaks are as small as possible due to its flammability.

Reducing the total length of pipes and the number of connections can also enable a more compact design and thus a lower weight of the heat pump. This can be particularly useful for monoblock Heat pumps can be advantageous. A small size and low weight can be an advantage, for example, when manufacturing and installing heat pumps, and especially when retrofitting a heat pump heating system in an old building.

In addition, reducing the overall length of pipes can also reduce the noise emitted by the heat pump. In residential buildings in particular, it is advantageous if a heat pump can be operated as quietly as possible. This can also make it possible to dispense with relief pipes, which are used in some heat pumps to avoid vibrations.

One approach to reducing lines in a refrigeration circuit is described, for example, in the German patent application DE 102022116 807. The refrigeration circuit device disclosed therein comprises several refrigeration circuit components and several refrigeration circuit lines connecting the refrigeration circuit components to one another. At least one part of a refrigeration circuit component and at least one refrigeration circuit line are formed in a monolithic body produced by primary molding. An interface connected in the body to one part of one refrigeration circuit component or to one refrigeration circuit line is arranged on this body for the external connection of one of the other refrigeration circuit components or one of the other refrigeration circuit lines.

In other words, parts of the refrigeration circuit components and parts of the refrigeration circuit lines are formed in a body which is essentially a monolithic block which is produced by primary molding. This makes it possible to provide a particularly compact device for connecting further circuit components and lines. Such a block can also be produced particularly easily.

The problem underlying the invention Based on the known prior art, it is an object of the present invention to increasingly integrate refrigeration circuit components and refrigerant lines in as small a number of components or assemblies as possible in order to provide an improved heat pump with the lowest possible weight, the smallest possible size and the shortest possible total length of lines in the refrigerant circuit.

Inventive solution

According to a first aspect of the present invention, a refrigeration circuit device for a heat pump according to claim 1 is provided. A second aspect of the present invention relates to a heat pump for heating and/or cooling a building according to claim 20. Such a heat pump is usually also used for hot water preparation. A heat pump according to the invention for heating and/or cooling a building comprises a refrigeration circuit device according to the present invention. Further aspects of the present invention are the subject of the dependent claims, the drawings and the following description of exemplary embodiments.

In order to switch the operation of the heat pump between heating and cooling, the flow direction of the refrigerant in the refrigerant circuit can preferably be reversed, for example by means of a 4/2-way valve or the like. In this case, the condenser and the evaporator each swap their function. In other words, the condenser becomes the evaporator and the evaporator becomes the condenser.

In the present case, a "module" or "refrigeration circuit module" is preferably understood to mean a component or assembly of the refrigerant circuit that comprises several parts or components that are often but not necessarily arranged in a module housing or on or on a carrier in such a way that they are designed to be pre-assembled together in a unit. Generally speaking, in such a modularized structure, the parts or components are assembled into modules along predefined locations. Accordingly, the resulting assembly or component can be transported as a unit and installed in or removed from the refrigeration circuit device.

Preferred embodiments of the invention

Advantageous training and further education, which can be used individually or in combination with each other, are the subject of the dependent claims.

The refrigeration circuit device comprises a first refrigeration circuit module and a second refrigeration circuit module. According to preferred embodiments, the refrigeration circuit device can have more than two refrigeration circuit modules. The refrigeration circuit modules form at least part of a refrigerant circuit of the heat pump. In preferred embodiments, the entire refrigerant circuit of the heat pump can be formed by the refrigeration circuit modules of the refrigeration circuit device.

A refrigeration circuit module combines components of a sub-process of a refrigerant circuit of a heat pump into a compact assembly, so that at least part of the refrigerant circuit or the entire refrigerant circuit of the heat pump can be constructed by combining several refrigeration circuit modules, whereby the individual refrigeration circuit modules can each be exchanged for a similar refrigeration circuit module in order to enable the heat pump to be manufactured and maintained as easily as possible.

In the present case, a "module" or "refrigeration circuit module" is preferably understood to mean a component or assembly of the refrigerant circuit that can be transported as a unit and installed in or removed from the refrigeration circuit device. The individual sub-processes in the refrigerant circuit of a heat pump include, in simplified terms, the compression of the refrigerant, the liquefaction of the refrigerant, the expansion of the refrigerant and the evaporation of the refrigerant. Compression preferably takes place in a compressor. Condensation takes place in a first heat exchanger, known as a condenser, where the refrigerant releases the heat it has absorbed to a heating circuit medium of an external heating circuit. The expansion of the refrigerant takes place in an expansion valve. The evaporation of the refrigerant takes place, for example, in a second heat exchanger, known as an evaporator, where the refrigerant preferably absorbs the ambient heat.

Further preferably, a further circuit carrying heating circuit medium can be connected, which is connected to an evaporator, where the heating circuit medium absorbs ambient heat. Advantageously, both heat exchangers arranged on the refrigerant circuit can be designed as compact plate heat exchangers, while the relatively large evaporator, in the case of an air-water heat pump, for example, can be arranged spatially separate from the installation space of the refrigerant circuit.

Certain subcomponents such as sensors, actuators, drives, electronics and the like can be arranged as external functional assemblies on an outer surface of a refrigeration circuit module and interact with components arranged inside the refrigeration circuit module.

Furthermore, a refrigeration circuit module is characterized in that at least some of the flow paths for the refrigerant for supplying and discharging the refrigerant to and from the relevant sub-process are arranged inside the refrigeration circuit module. This means that conventional lines such as pipes or hoses can be completely or at least partially dispensed with, so that a variety of advantages can be achieved. A refrigeration cycle module can preferably also integrate more than one sub-process in one assembly. By increasing the degree of integration, the refrigeration cycle device can be constructed even more compactly, which saves space and weight and further reduces the overall length of refrigerant lines.

For example, the refrigeration circuit device according to the invention with refrigeration circuit modules can reduce the risk of leaks in which refrigerant escapes. Furthermore, the total amount of refrigerant required in the refrigerant circuit can be reduced. This can contribute to the safe operation of the heat pump, particularly when using a flammable or easily flammable and/or toxic refrigerant.

In addition, by integrating the refrigerant lines into the refrigeration circuit modules, low-vibration operation of the heat pump can be achieved, so that the heat pump can be operated particularly quietly and the service life of the components or the heat pump can be improved.

The first refrigeration circuit module comprises a compressor for compressing a refrigerant and flow paths for the refrigerant. The first refrigeration circuit module can also be referred to as a compressor module. The first refrigeration circuit module thus integrates all components required for the process of compressing the refrigerant, as well as at least some of the flow paths to and from the compressor, i.e. a supply line and a return line of the compressor.

The second refrigeration circuit module comprises an expansion valve for expanding the refrigerant and flow paths for the refrigerant. The second refrigeration circuit module can therefore also be referred to as an expansion module. The expansion valve can in particular be a thermostatic expansion valve, an electronic expansion valve or a throttle. A characteristic curve of the expansion valve can, for example, be linear or equal percentage. The Expansion valves can be controlled unipolarly or bipolarly. One of the tasks of the expansion valve is to keep the refrigerant circuit in balance and to ensure an even distribution of the refrigerant in the circuit.

The first refrigeration circuit module is fluidly connected to the second refrigeration circuit module. Preferably, the first refrigeration circuit module can be connected directly via a suitable interface on an outer surface of the first refrigeration circuit module to a corresponding interface on an outer surface of the second refrigeration circuit module. In particular, openings for connecting the flow paths are arranged in these interfaces. The interfaces of the first refrigeration circuit module and the second refrigeration circuit module can preferably be arranged in one plane.

The first refrigeration circuit module and the second refrigeration circuit module can each have a plurality of connections in order to establish a flow connection between the first refrigeration circuit module and the second refrigeration circuit module. These connections can, for example, be combined in interfaces in order to enable the refrigeration circuit modules to be connected easily and in a time-saving manner. As a result, assembly and maintenance of the refrigeration circuit device can be carried out particularly easily and in a time-saving manner.

The flow paths in the refrigeration circuit modules can preferably have connecting pieces and connection pieces. The connecting pieces are, for example, sections of the flow paths, each of which can be arranged in a plane running through the refrigeration circuit module. The connection pieces are preferably sections of the flow paths, each of which can be arranged perpendicular to the plane, for example. This makes it possible to achieve a particularly simple and space-saving structure that is easy to manufacture.

At the ends of the connectors, connections are preferably arranged as interfaces for connecting to corresponding connections of adjacent refrigeration circuit modules. This advantageously allows Predefined interfaces between the refrigeration circuit modules are implemented, which allow individual refrigeration circuit modules to be replaced with refrigeration circuit modules that have the same function, but which can also be designed differently on the inside. This allows a high level of modularity to be achieved, so that different designs of refrigerant circuits can be implemented by exchanging individual refrigeration circuit modules.

The second refrigeration circuit module preferably comprises a first expansion valve and a second expansion valve. In preferred embodiments, the second refrigeration circuit module can also have a third expansion valve. The expansion valves can each be arranged in different flow paths in the second refrigeration circuit module. For example, by providing changeover valves, the various expansion valves can be integrated into the active circuit depending on the desired configuration, so that different refrigerant circuits can be implemented.

In preferred embodiments, the second refrigeration circuit module can comprise a switching valve or several switching valves for switching between branches of the refrigeration circuit and/or for reversing a flow direction of the refrigeration agent. A switching valve can be designed, for example, as a 4/3-way valve or 4/2-way valve. The second refrigeration circuit module can thus also be referred to as a valve module in which a large number of valves are arranged.

According to a preferred embodiment, in particular the second refrigeration circuit module can have a bypass line instead of a reversing valve or in addition to a reversing valve. The bypass line is a flow path which is provided, for example, to enable hot gas bypass defrosting.

Preferably, the second refrigeration circuit module can have a phase separator. The phase separator can in particular be a refrigerant collector for Collection of the refrigerant. Liquid refrigerant and/or gaseous refrigerant can be tapped from the phase separator.

A phase separator can also be referred to as an accumulator. The refrigerant collector preferably serves as an equalizing tank to regulate a pressure in the refrigerant circuit. The phase separator can alternatively be designed as a liquid separator. In the refrigerant collector, for example, a phase separation between liquid and gaseous refrigerant can take place. A refrigerant collector is usually used in an area of the refrigerant circuit with high pressure. A liquid separator is usually used in an area of the refrigerant circuit with low pressure.

The second refrigeration cycle module may comprise a front part with a flat first connection surface, a rear part with a flat second connection surface and a flat sealing element, wherein the first connection surface is arranged parallel to the second connection surface and the sealing element is arranged between the first connection surface and the second connection surface.

A sealing element according to the invention is preferably a seal for sealing and/or for thermal insulation. Depending on the requirements, it can also have a particularly high thermal conductivity. Depending on the intended use, the sealing element can be made of a suitable material.

The front part and the rear part of the second refrigeration cycle module can each be a monolithic body manufactured by primary molding. The front part and the rear part can each be half-shell-shaped, so that by connecting the front part and the rear part, a plurality of flow paths and/or a refrigerant collector for the refrigerant are formed.

According to an alternative embodiment, the front part and rear part of a refrigeration cycle module according to the invention can be formed by forming. For example, the front part and rear part can be formed by a roll bonding process Particularly preferably, the sealing element can also be formed in between. Further preferably, the front part and rear part can each be formed by deep drawing a single sheet of metal.

The compressor of the first refrigeration circuit module is preferably a reciprocating piston compressor that comprises a crankshaft and at least one piston connected to the crankshaft. A reciprocating piston compressor can be particularly advantageous because it can be operated with little or even no oil, particularly in the working space or at the contact points with the refrigerant or the refrigeration circuit. This can prevent the refrigerant from being mixed with oil. This can increase the longevity of the refrigerant, the refrigerant circuit and the refrigerant-carrying components, so that the heat pump according to the invention can be operated with particularly little maintenance. Furthermore, the use of an additional oil separator in the refrigerant circuit can preferably be dispensed with, which can reduce the complexity of the refrigerant circuit, which in turn can simplify production and reduce costs. In particular, the amount of refrigerant required can be advantageously reduced because it is not bound to oil. Furthermore, particularly safe operation of the heat pump can be ensured because sufficient lubrication does not have to be ensured at operating points, which can be particularly advantageous when starting or switching, for example. The advantages described here can also help to improve the overall energy efficiency of the heat pump or the entire HVAC system (heating, ventilation, air conditioning and refrigeration technology).

The reciprocating piston compressor preferably has an even number of cylinders. For example, the reciprocating piston compressor can have two, four, six or eight cylinders. An even number of cylinders can preferably be arranged in pairs along a common cylinder axis. When cylinders are arranged in pairs, the vibrations generated by the movement of the pistons in the cylinders can be compensated in pairs in a particularly advantageous manner. The pistons of a pair of cylinders can each have a phase shift of 180 degrees. This means that the pistons move in opposite directions so that the vibrations generated compensate for each other. This allows the compressor to operate with particularly low vibrations.

A particularly preferred reciprocating piston compressor has three pairs of cylinders, each arranged at an angle of 60 degrees to one another. Such an arrangement is also referred to as star-shaped. This makes it particularly advantageous to avoid or at least reduce oscillating first and second order mass forces in order to achieve particularly low-vibration operation of the compressor.

The cylinder axes of the three cylinder pairs are preferably in a common plane. The cylinders are particularly preferably arranged in a star shape. This allows a particularly compact and flat design of the compressor to be achieved, so that space can be saved.

The crankshaft is preferably arranged between the cylinders. If the cylinders are arranged in a star shape, the crankshaft can be arranged at a center point between the plurality of cylinders. The forces acting on the crankshaft can thus be compensated and first and second order vibrations can be avoided or at least reduced.

The pistons are preferably driven by the rotating crankshaft in such a way that they move away from the crankshaft in pairs in opposite cylinders in the same phase during compression. In this way, a particularly favorable arrangement can be created in which the oscillating first and second order mass forces that occur can be particularly easily avoided or at least reduced. The flow paths of the first refrigeration circuit module can in particular comprise a supply channel and a return channel. The return channel is located on a low-pressure side and supplies the refrigerant to the compressor, for example via inlet valves. The supply channel is located on a high-pressure side and supplies the compressed refrigerant away from the compressor in the direction of an evaporator in the refrigeration circuit.

The feed channel and the return channel can preferably each be ring-shaped. The feed channel and the return channel are preferably arranged parallel to one another and an axis of symmetry of the feed channel and the return channel is preferably arranged perpendicular to the cylinder axes of the compressor. This makes it possible to achieve a particularly compact design of the reciprocating piston compressor, in particular if the reciprocating piston compressor has three pairs of cylinders arranged in a star shape.

Thermal insulation is preferably arranged between the flow channel and the return channel. The thermal insulation can be achieved, for example, by arranging an insulating material with very low thermal conductivity or by arranging an air gap or a vacuum. With an air gap, heat transfer by convection is very low. Heat can therefore be transferred via an air gap or a vacuum almost exclusively by radiation, which is negligible at the temperatures occurring in a refrigeration circuit. The heat conduction along the surrounding material can also preferably be very small. The thermal insulation can therefore set heat transfer between the flow and return to a negligible level.

The first refrigeration circuit module preferably comprises a drive unit for driving the crankshaft of the compressor. The drive unit can comprise, for example, an electric motor and is preferably arranged on an outer surface of the first refrigeration circuit module. Furthermore, the first refrigeration circuit module can comprise a control unit for controlling the drive unit The drive unit preferably comprises an inverter to control a speed of the compressor and thus a compression power of the compressor.

A preferred refrigeration circuit device comprises a third refrigeration circuit module, which comprises a condenser for transferring heat from the refrigerant to a heating circuit medium of an external heating circuit. The third refrigeration circuit module can thus also be referred to as a condenser module. The condenser can be a heat exchanger with a condenser, where the gaseous refrigerant condenses and thereby transfers heat to the heating circuit medium. Accordingly, the third refrigeration circuit module can also have connections for connecting lines of the external heating circuit.

A preferred refrigeration circuit device comprises a fourth refrigeration circuit module, which comprises an evaporator for transferring heat from an ambient medium to the refrigerant. The fourth refrigeration circuit module can thus also be referred to as an evaporator module. The evaporator can be a heat exchanger at which the refrigerant absorbs heat from the ambient air, whereby the refrigerant evaporates.

According to a preferred embodiment, the evaporator in the fourth refrigeration circuit module can be a plate heat exchanger, as described, for example, in the published patent application No. DE 102010 021692 A2.

Alternatively, the fourth refrigeration circuit module can have a heat exchanger, which is preferably designed as a plate heat exchanger, at which heat is transferred between the coolant and a heat transfer medium of a secondary circuit. This secondary circuit preferably comprises an evaporator, at which heat can be absorbed from an ambient medium, such as the ground in the case of a brine-water heat pump or the ambient air in the case of an air-water heat pump. Brine, for example, can be used as the heat transfer medium in the secondary circuit. which is pumped through a geothermal probe or a flat-plate geothermal collector.

In an air-water heat pump design, a large evaporator with a fan can be used, which can be arranged in the secondary circuit outside the refrigeration circuit device. This means that the refrigeration circuit device can still be manufactured compactly and with a high degree of integration.

In a preferred embodiment of the invention, the fourth refrigeration circuit module can be arranged at a distance from the other refrigeration circuit modules. For this purpose, pipes or hoses can be used as lines for the coolant. These lines include in particular a supply line and a return line. The lines should each be no longer than 100 cm, preferably no longer than 50 cm.

A preferred refrigeration circuit device comprises a fifth refrigeration circuit module which comprises an internal heat exchanger for transferring heat from a first partial circuit of the refrigeration circuit to a second partial circuit of the refrigeration circuit. Preferably, the internal heat exchanger can be used for cooling a converter.

A preferred refrigeration circuit device comprises a sixth refrigeration circuit module with a plurality of flow paths for the refrigerant and a plurality of connections for connecting the flow paths to other refrigeration circuit modules. The sixth refrigeration circuit module can also be referred to as a distributor module and serve as an interface between at least two of the remaining refrigeration circuit modules in order to connect the components in the refrigeration circuit modules to one another according to a preferred embodiment of the refrigerant circuit and to distribute the refrigerant accordingly between the refrigeration circuit modules. For this purpose, two or more of the plurality of flow paths in the distributor module can branch and/or Furthermore, the distribution module can have an expansion tank or refrigerant collector or liquid separator.

The sixth refrigeration circuit module is preferably fluidly connected to the second refrigeration circuit module. Further preferably, the sixth refrigeration circuit module is fluidly connected to the third refrigeration circuit module and/or to the fourth refrigeration circuit module and/or to the fifth refrigeration circuit module.

In a preferred embodiment, part of the refrigerant can be used after liquefaction to generate steam with the help of an additional heat exchanger (for example the internal heat exchanger) and an additional expansion valve, which can be injected directly into the compressor. This additional steam injection can advantageously increase the efficiency. Such steam injection can be used in the reciprocating piston compressor described in more detail later and, in alternative embodiments, in particular in a scroll compressor.

Preferably, thermal insulation can be arranged between the sixth refrigeration circuit module and the second refrigeration circuit module. The thermal insulation serves to prevent or at least minimize heat transfer between the refrigerant in the sixth refrigeration circuit module and the refrigerant in the second refrigeration circuit module. This allows, for example, a hot partial circuit to be thermally separated from a cold partial circuit of the refrigerant circuit.

According to a preferred embodiment, the sixth refrigeration circuit module has a front part with a flat first connection surface, a rear part with a flat second connection surface and a flat sealing element. The first connection surface is preferably arranged parallel to the second connection surface. The sealing element is preferably arranged between the first connection surface and the second connection surface and prevents refrigerant from escaping at the interface between the first and second connecting surfaces.

The front part and the rear part can preferably each be a monolithic body produced by primary molding. The front part and the rear part are also preferably half-shell-shaped, so that a plurality of flow paths and/or a collecting container for the coolant can be formed by connecting the front part and the rear part. The collecting container can preferably take on different functions in the cooling circuit depending on its position in the coolant circuit.

At least one of the plurality of refrigeration cycle modules may comprise at least one of the following components: a refrigerant collector for collecting the refrigerant; a liquid separator; an internal heat exchanger; an economizer; a phase separator; a filter; an oil separator; a dryer; a sensor for measuring a temperature of the refrigerant; a sensor for measuring a pressure of the refrigerant; a sensor for measuring a volume flow of the refrigerant; an actuator for actuating a changeover valve and/or an expansion valve; a safety high-pressure switch; a coil for controlling a valve.

A preferred refrigeration circuit device comprises a housing which surrounds the refrigeration circuit modules, wherein the housing preferably has an opening in which a fan or ventilator for sucking in ambient air Preferably, an evaporator of the refrigeration circuit device is arranged in an air flow generated by the fan.

According to a preferred embodiment, the heat pump can be a monoblock heat pump, which can be designed in particular as an air-water heat pump. Such a monoblock heat pump preferably uses the energy of the ambient air for heating. Unlike air-water heat pumps in a split design, the refrigerant circuit of a monoblock heat pump is in a single unit. In other words, the refrigerant circuit of the monoblock heat pump is arranged in a common housing.

A monoblock heat pump is preferably installed outside a building to be heated (or cooled), for example on a roof of the building or on a plot of land next to the building. However, it is also possible to install the monoblock heat pump inside the building. Due to its compact design, a monoblock heat pump can be used advantageously as a retrofit solution for existing buildings. Compared to a split-design heat pump, the amount of work involved in installing the monoblock heat pump can be less, especially since no refrigerant lines need to be laid between the outdoor unit and the indoor unit. In addition, the maintenance effort for monoblock heat pumps can be lower than for split-design heat pumps.

A further exemplary embodiment of the heat pump according to the invention is a water-water heat pump, a brine-water heat pump or a geothermal heat pump. In such an embodiment, the two heat exchangers (evaporator and condenser) can in particular be designed as plate heat exchangers.

According to a preferred embodiment, the heat pump has no more than two refrigerant-carrying lines arranged outside one of the refrigeration circuit modules. These two lines can be, for example, pipes or These can be hoses that are connected to a heat exchanger in the refrigerant circuit. The two lines are each no longer than 100 cm, more preferably no longer than 50 cm, particularly preferably no longer than 30 cm. Particularly preferred embodiments of the present invention can completely dispense with such lines outside the refrigeration circuit modules. In other words, in such embodiments, all flow paths for the refrigerant are formed in the refrigeration circuit modules.

Particularly preferably, the refrigeration circuit device of the heat pump does not have any lines for the coolant arranged outside the refrigeration circuit modules. In such an embodiment, the refrigeration circuit modules are directly connected to one another. In particular, the third refrigeration circuit module, the fourth refrigeration circuit module and the fifth refrigeration circuit module, each of which preferably has a plate heat exchanger, can be connected directly to the sixth refrigeration circuit module. In this way, a very compact design of the refrigeration circuit device can be achieved.

A preferred heat pump further comprises an inverter thermally coupled to an internal heat exchanger of the refrigeration cycle device to cool the inverter. The inverter can, for example, convert a frequency of an alternating current to drive the compressor. More preferably, the inverter can provide a three-phase current to operate the compressor. An inverter can, for example, convert a supply voltage with a predetermined frequency into an alternating voltage with a different frequency to control a motor speed of the compressor.

Further preferably, a DC motor can be used. Such a motor can, for example, use a DC converter that generates a pulse width modulation signal (PWM signal).

Short description of the drawings Further advantageous embodiments are described in more detail below with reference to an embodiment shown in the drawings, to which the invention is not limited, however. They show schematically:

Figure 1 Fig. 1 illustrates a heat pump heating system according to the state of the art.

Figure 2 Fig. 2 shows a perspective view of a refrigeration circuit device according to the invention.

Figure 3 Fig. 3 shows an exploded view of the refrigeration circuit device from Fig. 2.

Figure 4 Fig. 4 shows a second refrigeration circuit module and a sixth refrigeration circuit module of the refrigeration circuit device from Fig. 2.

Figure 5 Fig.5 illustrates a refrigeration circuit of the refrigeration circuit device of Fig.

2nd

Figure 6 Fig. 6 shows a section through the reciprocating piston compressor from Fig. 2 and 3.

Detailed description of implementation examples

In the following description of a preferred embodiment of the present invention, like reference numerals designate like or comparable components.

Fig. 2 shows a perspective view of a refrigeration circuit device 10 according to the invention for a heat pump. Fig. 3 shows an exploded view of the refrigeration circuit device 10 from Fig. 2. Fig. 4 shows a view of a second refrigeration circuit module 12 and a sixth refrigeration circuit module 16 of the refrigeration circuit device from Fig. 2. In Fig. 2, Fig. 3 and Fig. 4, a right-handed orthogonal coordinate system with axes X, Y and Z is shown.

The refrigeration circuit device 10 in Fig. 2 and Fig. 3 comprises a first refrigeration circuit module 11, a second refrigeration circuit module 12, a third Refrigeration circuit module 13, a fourth refrigeration circuit module 14, a fifth refrigeration circuit module 15, a sixth refrigeration circuit module 16, a motor 17, a control device 18, and coils 19.

The first refrigeration circuit module 11 comprises a reciprocating piston compressor which comprises a crankshaft (not shown in Fig. 3) and six pistons llf connected to the crankshaft. The reciprocating piston compressor comprises six cylinders Ile, each of which is arranged in pairs along a common cylinder axis. A piston llf is mounted in each cylinder Ile. Each cylinder Ile also has a valve flap 11g.

The three cylinder pairs are arranged in a star shape and are each at an angle of 60 degrees to one another. The cylinder axes of the three cylinder pairs lie in a common plane, which is shown here parallel to the XY plane. This allows the compressor to be particularly compact and flat, saving space. The star-shaped arrangement of the pistons means that the compressor can be operated with particularly low vibration and therefore low noise. This also minimizes another cause of leaks and improves the service life or extends the maintenance interval.

The crankshaft (not shown in Fig. 3) is arranged between the cylinders and is driven by an external motor 17. The motor 17 is controlled by the control device 18. For example, an inverter can be used to control the motor 17. Furthermore, the control device 18 can also be used to control the valves of the compressor.

Fig. 6 shows a sectional view of the compressor through a cylinder Ile and through the supply line 11a and the return line 11b. The first refrigeration circuit module 11 comprises an annular supply line 11a and an annular return line 11b. The supply line 11a and the return line 11b are arranged concentrically around the crankshaft 11k and the crankshaft 11k is arranged parallel to the Z axis. The annular feed channel 11a and the annular return channel 11b are arranged parallel to one another and an axis of symmetry of the feed channel 11a and return channel 11b is arranged perpendicular to the cylinder axes of the compressor. This, together with the star-shaped arrangement of the cylinders Ile, makes it possible to achieve a particularly compact design of the reciprocating piston compressor.

A thermal insulation lld is arranged between the supply channel 11a and the return channel 11b in order to minimize heat transfer between the return channel 11b and the supply channel 11a. A compressor housing 11c, which is also ring-shaped, serves as a structural support for the cylinders Ile as well as for the supply channel 11a and the return channel 11b.

The motor 17 is controlled by the control device 18, which drives the crankshaft. Furthermore, coils 19 are controlled via the control device 18 in order to open or close changeover valves or expansion valves in the second refrigeration circuit module 12. In addition, the control device 18 can control inlet and outlet valves 11g in the compressor. The heat output or cooling output of the heat pump can thus be controlled by means of the control device 18. The control device 18 can also receive measured values from sensors, in particular from temperature sensors, pressure sensors and volume flow sensors.

The rotary motion of the crankshaft 11k is transmitted via connecting rods 11h into an up and down motion of the pistons 11f in the cylinders Ile, see Fig. 6. If a piston 11f moves outwards in the cylinder Ile (upwards in Fig. 6), it compresses the gaseous refrigerant contained therein, which is guided to the supply channel 11a by corresponding opening and closing of inlet and outlet valves 11g.

Refrigerant is admitted from the return line 11b into the pistons llf via an inlet valve 11g when the piston llf moves towards the crankshaft 11k. At bottom dead center, the inlet valve 11g is closed and the piston llf compresses the refrigerant in the cylinder Ile. Shortly before the top dead center, the outlet valve 11g is opened towards the supply line 11a in order to release the compressed refrigerant via the compressor housing 11c to the supply line 11a. The thermal insulation lld between the compressor housing 11c and the supply channel 11a minimizes heat transfer between the supply channel 11a and the return channel 11b and can dampen pulsating movements of the refrigeration circuit module 11 that occur during operation due to the pressure difference between the return channel 11b and the supply channel 11a.

The second refrigeration circuit module 12 comprises a first expansion valve 12e and a second expansion valve 12f as well as a plurality of flow channels for the refrigerant. The second refrigeration circuit module 12 also comprises a changeover valve 12g for reversing a flow direction of the refrigerant. The changeover valve 12g can be designed as a 4/2-way valve, for example. The valves 12e, 12f and 12g can be controlled by means of coils 19.

In addition, the second refrigeration circuit module 12 comprises an expansion tank 12d for collecting the refrigerant and for equalizing a pressure in the refrigerant circuit. The expansion tank 12d is arranged here in a middle pressure range of the refrigerant circuit and is designed as a phase separator. In alternative embodiments, the expansion tank can preferably also be designed as a liquid separator.

A return line to the expansion tank 12d (flow path F) is preferably connected to an upper region of the expansion tank 12d in order to supply preferably gaseous refrigerant to the expansion tank 12d. A phase separation between gaseous and liquid can take place in the expansion tank 12d. The outlet of the expansion tank 12d through the flow path with connection G (or supply line of the expansion tank 12d) is preferably connected to a lower region of the expansion tank 12d in order to discharge preferably liquid refrigerant. The second refrigeration cycle module 12 comprises a front part 12a with a flat first connection surface, a rear part 12b with a flat second connection surface and a flat sealing element 12c. The first connection surface is arranged parallel to the second connection surface and the sealing element 12c is arranged between the first connection surface and the second connection surface in order to seal the front part 12a against the rear part 12b.

The front part 12a and the rear part 12b of the second refrigeration cycle module 12 are each monolithic bodies manufactured by primary molding or forming. The front part 12a and the rear part 12b are each half-shell-shaped, so that by assembling and connecting the front part 12a and the rear part 12b with the sealing element 12c therebetween, a plurality of flow paths and the expansion tank 12d for the refrigerant are formed.

Front part 12a, rear part 12b and sealing element 12c can be attached to one another, for example, by gluing them together with an adhesive. In addition or instead, circumferential clamps can be used, which can be attached to the peripheral edge of front part 12a, rear part 12b and sealing element 12c. In addition, the parts can be connected to one another by means of screws or tie rods.

The refrigeration circuit device 10 in Fig. 2 and 3 comprises three heat exchangers. The first heat exchanger is arranged in the third refrigeration circuit module 13 and serves as a condenser, where heat is transferred from the refrigerant to a heating circuit medium of an external heating circuit 8. The second heat exchanger is arranged in the fourth refrigeration circuit module 14 and serves as an evaporator, where ambient heat is transferred to the refrigerant. The third heat exchanger is arranged in the fifth refrigeration circuit module 15 and serves as an internal heat exchanger to increase the efficiency of the system and to realize suction gas superheating. In addition, the internal heat exchanger can be used, for example, to cool an inverter 9 or to cool other components of the heat pump. The heat exchangers can be designed, for example, as plate heat exchangers. Other forms of Heat exchangers are also possible depending on the intended use or requirements of the refrigeration circuit device 10 or the heat pump. For example, the heat exchanger of the evaporator can also be a fin-tube evaporator or finned heat exchanger, which enables direct heat transfer from air to refrigerant without a liquid intermediate medium.

The third refrigeration circuit module 13, the fourth refrigeration circuit module 14 and the fifth refrigeration circuit module 15 are fluidly connected to the second refrigeration circuit module 12 via a sixth refrigeration circuit module 16. The sixth refrigeration circuit module 16 comprises a plurality of flow paths for the refrigerant and serves as a distributor module or as an interface between the refrigeration circuit modules in order to distribute the refrigerant between the refrigeration circuit modules.

Similar to the second refrigeration cycle module 12, the sixth refrigeration cycle module 16 comprises a front part 16a with a flat first connection surface, a rear part 16b with a flat second connection surface and a flat sealing element 16c. The first connection surface is arranged parallel to the second connection surface. The sealing element 16c is arranged between the first connection surface and the second connection surface and prevents refrigerant from leaking out at the interface between the first and second connection surfaces.

When manufacturing the sixth refrigeration circuit module 16, the front part 16a, the sealing element 16c and the rear part 16b can be glued together, for example using an adhesive, so that a multi-layer laminated body is created. The adhesive can be applied, for example, to the large areas between the flow paths or to the peripheral edge. Alternatively or additionally, the three parts of the sixth refrigeration circuit module 16 can be fastened to one another, in particular at its peripheral edge, using clamps or the like. The second refrigeration circuit module 12 can be manufactured in a similar way. The front part 16a and the rear part 16b of the sixth refrigeration cycle module 16 are each monolithic bodies manufactured by primary molding or by forming. In addition, the front part 16a and the rear part 16b are each half-shell-shaped, so that a plurality of flow paths for the refrigerant are formed by connecting the front part 16a and the rear part 16b. The front part 16a and the rear part 16b can be manufactured, for example, by deep drawing metal sheets or by an injection molding process.

The flow paths in the sixth refrigeration circuit module 16 and in the second refrigeration circuit module 12 are described in more detail below with reference to Fig. 4 and the schematic circuit in Fig. 5. In Fig. 5, the refrigeration circuit modules 11, 13, 14 and 15 are each indicated by rectangles made of dashed lines to show that the refrigeration circuit modules 11, 13, 14 and 15 also include flow paths and sensors in addition to a functional component of the refrigerant circuit.

In Fig. 4, the second refrigeration circuit module 12 and the sixth refrigeration circuit module 16 are shown spaced apart from one another, similar to Fig. 3, although the components of the three-part refrigeration circuit modules 12 and 16 are not shown spaced apart from one another as in Fig. 3. For a simplified illustration, the first refrigeration circuit module 11, the third refrigeration circuit module 13, the fourth refrigeration circuit module 14 and the fifth refrigeration circuit module 15 have been omitted in Fig. 4.

In the embodiment of Fig. 4, the flow paths in the second refrigeration circuit module 12 and in the sixth refrigeration circuit module 16 are each aligned along the XY plane. Perpendicular to this, i.e. parallel to the Z axis, connections for connecting the refrigeration circuit modules are provided.

As shown in Fig. 4, all connections of flow paths in the sixth refrigeration cycle module 16 are arranged in a plane parallel to the XY plane. This can enable a particularly compact design when connecting to other refrigeration cycle modules. The connections on the opposite side The connections arranged in the sixth refrigeration circuit module 16 and thus not directly visible in Fig. 4 can be arranged in a plane parallel to the XY plane. All of these connections can preferably be connected directly to another refrigeration circuit module without the need for external lines running outside the refrigeration circuit modules.

For example, clamps and/or tension elements such as screws or tie rods can be used to connect the connections or second refrigeration circuit modules, which exert a force on the refrigeration circuit modules. In order to seal the connections, sealing elements can be arranged between the refrigeration circuit modules. For example, a one-piece, level, flat sealing element (not shown) can be arranged between the second refrigeration circuit module 12 and the sixth refrigeration circuit module 16, which has corresponding cutouts for the openings of the connections. The sealing element can also serve to thermally insulate between refrigeration circuit modules.

According to a preferred embodiment, in particular the second refrigeration circuit module 12 and the sixth refrigeration circuit module 16 can also be connected to one another by gluing. In this case, the adhesive can also advantageously serve as a sealant for sealing the connections between the connections.

As shown in Fig. 4, the sixth refrigeration circuit module 16 has a cutout for the expansion tank 12d of the second refrigeration circuit module 12, which is curved further outwards or parallel to the Z direction than the connections. The cutout in the sixth refrigeration circuit module 16 enables the second refrigeration circuit module 12 to be arranged particularly closely next to or on the sixth refrigeration circuit module 16.

A changeover valve 12g and an expansion valve 12f are formed in a group 12h of connections and flow paths. A single changeover valve or several changeover valves can be arranged in the group 12h. The changeover valves are used, for example, to reverse the flow direction of the refrigerant and/or to switch between sub-circuits of the refrigerant circuit.

Reference symbol A shows the connection where the refrigerant at high pressure from the compressor flow (i.e. from the first refrigeration circuit module 11) enters the second refrigeration circuit module 12. Reference symbol B shows the outlet of the second refrigeration circuit module, where the return flow to the compressor or to the first refrigeration circuit module 11 is connected.

Depending on the setting of the changeover valve 12g, the refrigerant can then flow to the connecting line with reference symbol C in the sixth refrigeration circuit module 16 in order to reach the condenser in the third refrigeration circuit module 13.

From the condenser in the third refrigeration circuit module 13, the refrigerant flows back into the sixth refrigeration circuit module 16 and further through the flow path D to the first expansion valve 12f in the second refrigeration circuit module 12. From the first expansion valve 12f, the refrigerant flows via the inlet E in the sixth refrigeration circuit module to the internal heat exchanger in the fifth refrigeration circuit module 15. The outlet of the internal heat exchanger in the fifth refrigeration circuit module 15 is connected to the connecting line F in the sixth refrigeration circuit module 16.

The internal heat exchanger of the fifth refrigeration circuit module 15 is used here, for example, to increase the overall efficiency of the system or to cool an inverter 9 for driving a motor of the compressor. The return line E to the internal heat exchanger and the flow line F from the internal heat exchanger are defined as the primary circuit of the internal heat exchanger. A return line K to the internal heat exchanger and a flow line J from the internal heat exchanger are defined as the secondary circuit of the internal heat exchanger. The return line K is connected to the changeover valve 12g. The flow line J is connected to the return line B of the compressor 11. As shown in Fig. 5, the flow path F is connected to the expansion tank 12d in the second refrigeration circuit module 12. The outlet of the expansion tank 12d is connected to the second expansion valve 12e, from where the refrigerant flows further via the connections G to the fourth refrigeration circuit module 14 with the evaporator. The flow path with the connections G can thus also be referred to as the return of the evaporator.

The outlet of the fourth refrigeration circuit module 14 is connected to the flow path H in the sixth refrigeration circuit module 16. The flow path H can be referred to as the supply line of the evaporator, which supplies the refrigerant to the changeover valve 12g in the second refrigeration circuit module 12. The evaporator is thus arranged between connection G and flow path H in the sixth refrigeration circuit module 16, see also Fig. 3.

As shown in the schematic refrigeration circuit of Fig. 5, the refrigeration circuit device 10 comprises a plurality of sensors for measuring the temperature of the refrigerant and for measuring the pressure of the refrigerant. Furthermore, the refrigeration circuit device 10 can have sensors (not shown in Fig. 5) for measuring a volume flow of the refrigerant. The temperature sensors in the refrigerant circuit are marked with 0 in Fig. 5 and the pressure sensors are marked with p.

In particular, a temperature sensor 0 is arranged in the return line E to the internal heat exchanger of the fifth refrigeration circuit module. Furthermore, a temperature sensor 0 is arranged in the return line G to the evaporator in the fourth refrigeration circuit module 14. In addition, a temperature sensor 0 is preferably arranged in the return line B to the compressor and in the flow line A from the compressor. A further temperature sensor 0 can be arranged in the flow line of the external heating circuit 8, which absorbs heat from the refrigerant at the condenser of the third refrigeration circuit module 13.

In the present embodiment of Fig. 5, two pressure sensors p are arranged in the supply line A and in the return line B of the compressor. For example, a compression performance of the compressor can be determined from the measured values of the pressure sensors p. In particular, a control device 18 can evaluate the measured values of the pressure sensors p and/or the temperature sensors 0 and control an operating state of the compressor or of a drive motor 17 of the compressor and the two expansion valves 12e and 12.

As shown in Fig. 5, the refrigeration cycle device 10 or the heat pump comprises a fan 20 which generates an air flow in which the fourth refrigeration cycle module 14 with the evaporator is arranged. The fan 20 can be arranged, for example, at an opening in a housing in which the refrigeration cycle device 10 is arranged.

The described embodiment of the refrigeration circuit device 10 according to the invention completely dispenses with lines for coolant arranged outside the refrigeration circuit modules 11 to 16. In other words, all flow paths for the coolant are integrated into the refrigeration circuit modules 11 to 16. This makes it possible to create a very compact refrigeration circuit device 10. The advantages of such an embodiment include, for example, one or more of the following advantages: a particularly low risk of leaks, a particularly small amount of coolant required, a particularly compact and space-saving design, particularly simple production, particularly simple installation, particularly low-maintenance operation, particularly low noise.

The features disclosed in the above description, the claims and the drawings can be important both individually and in any combination for the realization of the invention in its various embodiments.

Claims

1. Refrigeration circuit device (10) for a heat pump, comprising: a first refrigeration circuit module (11) and a second refrigeration circuit module (12), wherein: the refrigeration circuit modules (11, 12) form at least part of a refrigerant circuit of the heat pump in which a refrigerant circulates; the first refrigeration circuit module (11) comprises a compressor for compressing the refrigerant and flow paths for the refrigerant; the second refrigeration circuit module (12) comprises an expansion valve (12e, 12f) for expanding the refrigerant and flow paths for the refrigerant; and the first refrigeration circuit module (11) is fluidly connected to the second refrigeration circuit module (12). 2. Refrigeration circuit device (10) according to claim 1, wherein the first refrigeration circuit module (11) and the second refrigeration circuit module (12) each have a plurality of connections in order to establish a flow connection between the first refrigeration circuit module (11) and the second refrigeration circuit module (12). 3. Refrigeration circuit device (10) according to claim 1 or 2, wherein: the second refrigeration circuit module (12) comprises a first expansion valve (12e) and a second expansion valve (12f); and/or the second refrigeration circuit module (12) comprises a switching valve (12g) for switching between branches of the refrigerant circuit and/or for reversing a flow direction of the refrigerant; and/or the second refrigeration circuit module (12) comprises an expansion tank (12d) for collecting the refrigerant. 4. Refrigeration circuit device (10) according to claim 3, wherein: the second refrigeration circuit module (12) comprises a front part (12a) with a flat first connection surface, a rear part (12b) with a flat second connection surface and a flat sealing element (12c); the first connection surface is arranged parallel to the second connection surface; and the sealing element (12c) is arranged between the first connection surface and the second connection surface. 5. Refrigeration circuit device (10) according to claim 4, wherein: the front part (12a) and the rear part (12b) are each a monolithic body manufactured by primary molding and/or forming; and/or the front part (12a) and the rear part (12b) are each half-shell-shaped, so that by connecting the front part (12a) and the rear part (12b) a plurality of flow paths and/or an expansion tank (12c) for the refrigerant are formed. 6. Refrigeration circuit device (10) according to one of claims 1 to 4, wherein the compressor of the first refrigeration circuit module (11) is a reciprocating piston compressor comprising a crankshaft and at least one piston (llf) connected to the crankshaft. 7. Refrigeration circuit device (10) according to claim 6, wherein: the reciprocating compressor has an even number of cylinders (Ile); the cylinders (Ile) are arranged in pairs along a common cylinder axis; and the pistons (llf) of a cylinder pair each have a phase shift of 180 degrees to one another. 8. Refrigeration cycle device (10) according to claim 7, wherein: the reciprocating compressor has three pairs of cylinders, each arranged at an angle of 60 degrees to each other; and the cylinder axes of the three pairs of cylinders lie in a common plane. 9. Refrigeration cycle device (10) according to claim 7 or 8, wherein: the crankshaft is arranged between the cylinders (Ile); and the pistons (llf) are driven by the crankshaft such that they move away from the crankshaft during compression. 10. Refrigeration circuit device (10) according to one of claims 7 to 9, wherein: the flow paths of the first refrigeration circuit module (11) comprise a supply channel (11a) and a return channel (11b); and the supply channel (11a) and the return channel (11b) are each annular; and/or the supply channel (11a) and the return channel (11b) are arranged parallel to one another; and/or an axis of symmetry of the supply channel (11a) and the return channel (11b) is arranged perpendicular to the cylinder axes of the compressor; and/or thermal insulation (11d) is arranged between the supply channel (11a) and the return channel (11b). 11. The refrigeration cycle device (10) according to any one of claims 6 to 10, wherein: the first refrigeration cycle module (11) comprises a drive unit (17) for driving the crankshaft of the compressor; and the drive unit (17) is arranged on an outer surface of the first refrigeration cycle module (11). 12. Refrigeration circuit device (10) according to claim 11, wherein the first refrigeration circuit module (11) comprises a control unit (18) for controlling the drive unit (17). 13. Refrigeration circuit device (10) according to one of claims 1 to 12, further comprising: a third refrigeration circuit module (13) comprising a condenser for transferring heat from the refrigerant to a heating circuit medium of an external heating circuit; and/or a fourth refrigeration circuit module (14) comprising an evaporator for transferring heat from an ambient medium to the refrigerant; and/or a fourth refrigeration circuit module (14) comprising a heat exchanger which is connected via a secondary circuit in which a heat transfer medium circulates to an external evaporator at which the heat transfer medium absorbs heat from an ambient medium; and/or a fifth refrigeration circuit module (15) comprising an internal heat exchanger for transferring heat from a first partial circuit of the refrigerant circuit to a second partial circuit of the refrigerant circuit. 14. Refrigeration circuit device (10) according to claim 13, further comprising: a sixth refrigeration circuit module (16) having a plurality of flow paths for the refrigerant and a plurality of connections for connecting the flow paths to other refrigeration circuit modules, wherein: the sixth refrigeration circuit module (16) is connected to the second refrigeration circuit module (12) is fluidly connected; and/or the sixth refrigeration circuit module (16) with the third refrigeration circuit module (13) and/or the fourth refrigeration circuit module (14) and/or the fifth refrigeration circuit module (15). 15. The refrigeration cycle device (10) of claim 14, further comprising: a thermal insulation disposed between the sixth refrigeration cycle module (16) and the second refrigeration cycle module (12). 16. Refrigeration circuit device (10) according to claim 14 or 15, wherein: the sixth refrigeration circuit module (16) comprises a front part (16a) with a flat first connection surface, a rear part (16b) with a flat second connection surface and a flat sealing element (16c); the first connection surface is arranged parallel to the second connection surface; and the sealing element (16c) is arranged between the first connection surface and the second connection surface. 17. Refrigeration cycle device (10) according to claim 16, wherein: the front part (16a) and the rear part (16b) are each a monolithic body manufactured by primary molding; and/or the front part (16a) and the rear part (16b) are each half-shell-shaped, so that by connecting the front part (16a) and the rear part (16b) a plurality of flow paths and/or an expansion tank for the refrigerant are formed. 18. Refrigeration circuit device (10) according to one of claims 1 to 17, wherein at least one of the refrigeration circuit modules further comprises at least one of the following components: a phase separator; a refrigerant collector for collecting the refrigerant; a liquid separator; an internal heat exchanger; an economizer; a filter; an oil separator; a dryer; a sensor for measuring a temperature of the refrigerant; a sensor for measuring a pressure of the refrigerant; a sensor for measuring a volume flow of the refrigerant; an actuator for actuating a changeover valve and/or an expansion valve; a coil for controlling a valve; a safety high-pressure switch. 19. Refrigeration circuit device (10) according to one of claims 1 to 18, further comprising: a housing which surrounds the refrigeration circuit modules (11-16), wherein: the housing has an opening in which a fan (20) for sucking in ambient air is arranged; and an evaporator of the refrigeration circuit device (10) is arranged in an air flow generated by the fan (20). 20. Heat pump for heating and/or cooling a building, comprising: a refrigeration circuit device (10) according to one of claims 1 to 19. 21. Heat pump according to claim 20, wherein the heat pump is a monoblock heat pump. 22. Heat pump according to claim 20 or 21, wherein the heat pump has no more than two refrigerant-carrying lines arranged outside one of the refrigeration circuit modules (11-16). 23. Heat pump according to claim 22, wherein the two lines are each pipes or hoses connected to a heat exchanger in the refrigerant circuit. 24. Heat pump according to one of claims 20 to 23, further comprising a converter (9) which is thermally coupled to an internal heat exchanger of the refrigeration circuit device (10) in order to dissipate heat from the converter (9).