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WO2025018082A1 - Structure de support pour substrat en forme de disque - Google Patents

Structure de support pour substrat en forme de disque Download PDF

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Publication number
WO2025018082A1
WO2025018082A1 PCT/JP2024/022126 JP2024022126W WO2025018082A1 WO 2025018082 A1 WO2025018082 A1 WO 2025018082A1 JP 2024022126 W JP2024022126 W JP 2024022126W WO 2025018082 A1 WO2025018082 A1 WO 2025018082A1
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WO
WIPO (PCT)
Prior art keywords
disk
shaped substrate
support
support structure
supported
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2024/022126
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English (en)
Japanese (ja)
Inventor
勝 赤松
洋平 古田
洸人 西田
奈生 米田
綾 日野
元隆 越智
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobelco Research Institute Inc
Original Assignee
Kobelco Research Institute Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobelco Research Institute Inc filed Critical Kobelco Research Institute Inc
Publication of WO2025018082A1 publication Critical patent/WO2025018082A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/80—Turntables carrying articles or materials to be transferred, e.g. combined with ploughs or scrapers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Definitions

  • the present invention relates to a support structure for a disk-shaped substrate.
  • a mechanism for supporting the wafer is required for transporting the wafer.
  • a mechanism for supporting the wafer is a mechanism that holds the peripheral portion of the wafer, the so-called edge portion, which is the portion that is not subject to device manufacturing.
  • Patent Document 1 requires a gripping mechanism that brings each gripping part closer to the center of the wafer. This makes the aligner device's configuration complex.
  • each gripping part holds the wafer by applying force to the edge of the wafer. This can result in excessive force being applied to the edge of the wafer, which can damage the edge.
  • the object of the present invention is to provide a support structure for a disk-shaped substrate that is capable of supporting the disk-shaped substrate with a simple configuration and that can prevent damage to the disk-shaped substrate.
  • the present invention provides a support structure for supporting a disk-shaped substrate.
  • the support structure includes a support portion having a support surface that is arranged around a center line extending in the vertical direction and inclines downward toward the center line, and that abuts against the circumferential portion of the disk-shaped substrate from below to support the weight of the disk-shaped substrate.
  • FIG. 1 is a cross-sectional view of a support structure according to one embodiment of the present invention.
  • FIG. 2 is an enlarged side view of a disk-shaped substrate according to one embodiment of the present invention.
  • FIG. 3 is a top view of the periphery of a support portion of a support structure according to an embodiment of the present invention.
  • FIG. 4 is a top view of a body portion of a support structure in accordance with one embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of a body portion of a support structure according to one embodiment of the present invention.
  • FIG. 6 is an enlarged cross-sectional view of region VI in FIG.
  • Fig. 1 is a cross-sectional view of the support structure 1.
  • Fig. 2 is an enlarged side view of a disk-shaped substrate D. Note that, below, the Z direction in each figure is referred to as the up-down direction, and in particular, the +Z direction is referred to as the up direction and the -Z direction is referred to as the down direction.
  • the support structure 1 in this embodiment supports a disk-shaped substrate D that is transported in a predetermined direction (here, the X direction).
  • the disk-shaped substrate D is, for example, a wafer made of silicone, which is the raw material for semiconductor chips.
  • the disk-shaped substrate D has, on its circumferential portion D1, an upper inclined surface facing upward and a lower inclined surface D11 (an example of a supported surface) facing downward.
  • the upper inclined surface is a plane that inclines upward (as it approaches) toward the center O of the disk-shaped substrate D.
  • the lower inclined surface D11 is a plane that inclines downward (as it approaches) toward the center O of the disk-shaped substrate D.
  • the lower inclined surface inclination angle ⁇ 1 of the disk-shaped substrate D is set to 22.5°.
  • the lower inclined surface inclination angle ⁇ 1 is the exterior angle formed by the lower inclined surface D11 and a functional surface D12 used in device manufacturing that intersects with the lower inclined surface D11.
  • the upper and lower inclined surfaces D11 are formed by chamfering the circumferential portion D1.
  • the support structure 1 has a table unit 10, a support part 20 that is removably fixed to the table unit 10 and supports a disk-shaped substrate D, and a transport mechanism 40 that transports the table unit 10 in the X direction.
  • the table unit 10 raises, lowers and rotates the disk-shaped substrate D supported by the support part 20.
  • the table unit 10 has a table body 11, a weight part 12, a table support part 13, a drive part 14 and a casing 15.
  • Figure 3 is a top view of the support structure 1 around the support portion 20.
  • the table body 11 has a circular plate shape and is a rotating table that can rotate around a center line C1.
  • the table body 11 has an upper surface that faces upward, and the support portion 20 and weight portion 12 are removably fixed to this upper surface. Note that the weight portion 12 is not shown on the left side of the paper in Figure 3.
  • the weight section 12 is disposed on the upper surface of the table body 11 and adjusts the rotational balance of the table body 11.
  • the weight section 12 is made of a circular flat plate and is fixed to the table body 11 via a number of weight fasteners 31.
  • the number of weight fasteners 31 are, for example, dowel pins or bolts.
  • the weight section 12 has a number of cutouts 12A cut out along the radial direction of the table body 11.
  • the table support 13 supports the table body 11 in a state in which it can rotate and rise and fall.
  • the table support 13 has an upper end and a lower end. The upper end is connected to the lower surface of the table body 11 that faces downward. The lower end is connected to the drive unit 14 and is driven by the drive unit 14.
  • the table support 13 passes through the ceiling of the casing 15 and extends in the vertical direction between the table body 11 and the drive unit 14.
  • the drive unit 14 is disposed inside the casing 15 and generates a drive force for raising and lowering the table body 11 and a drive force for rotating the table body 11.
  • the drive unit 14 includes a servo motor (not shown) and a pneumatic cylinder (not shown).
  • the support portion 20 is arranged on the upper surface of the table body 11 around a center line C1 that extends in the vertical direction, and horizontally supports the disk-shaped substrate D. As shown in FIG. 3, the support portion 20 according to this embodiment has three support members 200. In other embodiments, the support portion 20 may have two support members 200, or four or more support members 200.
  • the three support members 200 are arranged at equal intervals around the center line C1 so that the center line C1 of the support part 20 and the center O of the disk-shaped substrate D are concentric, and support the disk-shaped substrate D. Specifically, each of the three support members 200 is arranged so that the distance between the center O and each of the support members 200 is equal in the radial direction of a circle (virtual circle) centered on the center line C1. This configuration makes it possible for each support member 200 to support the disk-shaped substrate D horizontally. It is preferable to use a material for each support member 200 that does not damage the disk-shaped substrate D and does not contaminate the disk-shaped substrate D. For example, it is preferable to use a resin material such as polyether ether ketone or polyacetal.
  • Figure 4 is a top view of the main body 220 of the support member 200.
  • Figure 4 is a top view of the main body 220 of the support member 200 shown in the upper center of the three support members 200 shown in Figure 3.
  • Figure 5 is a cross-sectional view of the main body 220.
  • Figure 5 is a cross-sectional view of the main body 220 shown in the upper center of Figure 3, as viewed in a cross section including the center line C1.
  • Figure 6 is a cross-sectional view of an enlarged area VI shown in Figure 5.
  • the three support members 200 have the same configuration. Therefore, the configuration of one support member 200 will be described below, and the remaining support members 200 will not be described.
  • the support member 200 has a connection portion 210 and a main body portion 220 that is detachably fixed to the connection portion 210.
  • connection part 210 is removably fixed to the table body 11 and supports the body part 220.
  • connection part 210 has a connection base part 211 and an extension part 212.
  • connection base 211 is disposed in an area surrounded by the cutout portion 12A on the table body 11.
  • the connection base 211 is fixed to the table body 11 by a plurality of connection base fasteners 32. That is, the connection base 211 is fixed directly to the table body 11 without going through the weight portion 12.
  • This configuration makes it easy to remove the connection base 211 or the weight portion 12 from the table body 11. That is, it is easy to remove the weight portion 12 when the connection base 211 is fixed to the table body 11, and to remove the connection base 211 when the weight portion 12 is fixed to the table body 11.
  • the plurality of connection base fasteners 32 are, for example, bolts having a head and a shaft portion (not shown). As shown in FIG. 3, the plurality of connection base fasteners 32 are arranged so as to be aligned along the radial direction.
  • the extension portion 212 extends radially outward from the connection base 211 to support the main body portion 220. Specifically, the extension portion 212 extends from the connection base 211 so that its radially outer end is positioned radially outward from the outer edge of the table main body 11.
  • the main body 220 is removably fixed to the extension 212 and supports the disk-shaped substrate D. As shown in Figures 4 and 5, the main body 220 has a base 221 and a support 222.
  • the base 221 is fixed to the outer end of the extension 212 in the radial direction.
  • the base 221 is a base having a substantially rectangular parallelepiped shape and has a number of base fixing holes H.
  • Each base fixing hole H can be connected to a fixing hole (not shown) formed in the upper part of the extension 212.
  • Each base fixing hole H has a countersunk shape and allows the base fastener 33 (Fig. 3) to be inserted in the vertical direction.
  • the base fastener 33 is, for example, a bolt having a head and a shaft.
  • each of the base fasteners 33 is arranged in a line along the radial direction.
  • Each of the base fasteners 33 passes through the base fixing hole H in the vertical direction and is screwed into the fixing hole to fasten the base 221 and the extension 212.
  • the support 222 is a substantially triangular prism-shaped structure connected to the base 221 and has an upper surface 222a. Specifically, a plane facing radially inward of the support 222 constitutes the upper surface 222a.
  • the upper surface 222a is arranged around the center line C1 and abuts against the lower inclined surface D11 of the disk-shaped substrate D from below to constitute a support surface that supports the weight of the disk-shaped substrate D.
  • the upper surface 222a is inclined downward toward the center line C1.
  • the upper surface inclination angle ⁇ 2 (see Figure 5) of the upper surface 222a with respect to the radial direction (horizontal plane) is set to be 15° or more and 30° or less.
  • the upper surface inclination angle ⁇ 2 is set to 22.5°.
  • the upper surface 222a is inclined so as to extend parallel to the lower inclined surface D11 of the disk-shaped substrate D. 1 and 5, when the disk-shaped substrate D is supported by the support portion 20, the portions of the support portion 20 other than the upper surface 222a are disposed at a distance from the disk-shaped substrate D.
  • the support members 200 are disposed so that the lengths of the imaginary lines extending radially from the center line C1 toward the upper surface 222a of each support member 200 are the same.
  • the upper surface 222a includes an anti-slip portion K that prevents the disk-shaped substrate D from slipping.
  • the anti-slip portion K according to this embodiment has an uneven shape consisting of steps as shown in FIG. 6.
  • the anti-slip portion K has the function of increasing the static friction coefficient between the upper surface 222a and the lower inclined surface D11. The end of the disk-shaped substrate D may be caught in the uneven shape to prevent slipping.
  • the anti-slip portion K may be formed by subjecting the upper surface 222a to processing such as embossing or graining, or may be formed by subjecting the upper surface 222a to a so-called hairline processing in which a large number of thin linear grooves are formed.
  • the transport mechanism 40 has a function of transporting the disk-shaped substrate D supported by the support portion 20 in a predetermined direction (here, the X direction).
  • the transport mechanism 40 according to this embodiment has a roller portion 41 and a cylinder portion 42.
  • the roller unit 41 is positioned below the table unit 10 and supports the table unit 10 in a state in which it can guide the movement of the table unit 10 in the X direction.
  • the cylinder section 42 includes an air cylinder that expands and contracts in the X direction in response to the supply of air discharged from an air pump (not shown) and presses the casing 15, thereby moving the table unit 10 (casing 15) in the expansion/contraction direction.
  • the circumferential portion D1 of the disk-shaped substrate D is supported from below by the upper surface 222a that constitutes the support surface of the support portion 20. Therefore, compared to the case of using a device that grips the disk-shaped substrate D using, for example, a plurality of gripping portions that engage with the circumferential portion D1 of the disk-shaped substrate D and a gripping mechanism that moves each gripping portion toward the center O of the disk-shaped substrate D, the disk-shaped substrate D can be supported with a simple configuration. That is, the disk-shaped substrate D can be supported without requiring a complex mechanism.
  • the disk-shaped substrate D is supported by the upper surface 222a supporting the disk-shaped substrate D's own weight, a force greater than the own weight is prevented from acting on the disk-shaped substrate D. That is, an excessive force is prevented from acting on the disk-shaped substrate D. Therefore, the disk-shaped substrate D can be supported with a simple configuration, and damage to the disk-shaped substrate D can be prevented.
  • the disk-shaped substrate D is supported with the position of the center O of the disk-shaped substrate D aligned with the center line C1 of the support part 20, and the disk-shaped substrate D can be prevented from moving horizontally on the support part 20.
  • the disk-shaped substrate D is chamfered and the supported surface (lower inclined surface D11) of the circumferential portion D1 that is supported by the upper surface 222a is inclined, in this embodiment, since the upper surface 222a is inclined, the upper surface 222a and the supported surface can be in surface contact. This allows the upper surface 222a to stably support the supported surface.
  • the space above the disk-shaped substrate D is opened up compared to when a mechanism for holding the disk-shaped substrate D is provided above the disk-shaped substrate D. This makes it easier to inspect the quality of the disk-shaped substrate D, for example by imaging the disk-shaped substrate D from above.
  • the disk-shaped substrate D can be stably supported even if the shape of the disk-shaped substrate D is somewhat deformed.
  • the disk-shaped substrate D is not flat but warped, specifically, that the circumferential portion D1 of the disk-shaped substrate D has a partially wavy shape.
  • the support structure 1 supports the weight of the disk-shaped substrate D from below, and therefore can stably support the disk-shaped substrate D regardless of the shape of the disk-shaped substrate D.
  • the upper surface 222a includes an anti-slip portion K, which prevents the circumferential portion D1 of the disk-shaped substrate D from slipping relative to the upper surface 222a.
  • the disk-shaped substrate D can be supported with the attitude of the disk-shaped substrate D stable.
  • the uneven shape improves the surface roughness of the non-slip portion K. This increases the static friction coefficient between the upper surface 222a and the circumferential portion D1 compared to when the non-slip portion K does not have an uneven shape, and therefore further prevents the circumferential portion D1 from slipping against the upper surface 222a.
  • the lower inclined surface inclination angle ⁇ 1 which is the exterior angle between the functional surface D12 used in device manufacturing and the lower inclined surface D11, is often set within the range of 15° to 30°.
  • the upper surface inclination angle ⁇ 2 of the upper surface 222a is set to be 15° or more and 30° or less, so that the above-mentioned lower inclined surface D11 is used as the supported surface and is supported by each upper surface 222a, thereby making it possible to increase the contact area between the upper surface 222a and the lower inclined surface D11. As a result, it becomes possible for the lower inclined surface D11 to be stably supported by the upper surface 222a.
  • the inclination angle ⁇ 1 of the lower inclined surface is set to less than 15°, it is difficult to sufficiently restrain the disk-shaped substrate D in the horizontal direction because the angle is shallow. In this case, the center O of the disk-shaped substrate D is likely to shift in position due to the impact generated when transporting the disk-shaped substrate D. Furthermore, if the inclination angle ⁇ 1 of the lower inclined surface is set to more than 30°, the disk-shaped substrate D may become tightly stuck in the support part 20, making it difficult to remove the disk-shaped substrate D from the support part 20. In contrast, according to this embodiment, the position of the center O of the disk-shaped substrate D can be aligned with the center line C1 of the support part 20, and the disk-shaped substrate D can be suitably removed from the support part 20.
  • the inclination angles of the upper surface 222a of the main body 220 and the lower inclined surface D11 of the disk-shaped substrate D match, so that the contact area between the upper surface 222a and the lower inclined surface D11 can be increased. This makes it possible for the lower inclined surface D11 to be stably supported by the upper surface 222a.
  • the table body 11 and the support portion 20 are configured to be detachable. Specifically, the table body 11 and the connection portion 210 (connection base portion 211) of each support member 200 are fastened by the connection base fastener 32. With this configuration, the support member 200 can be replaced according to the size (diameter) of the disk-shaped substrate D. That is, when supporting a disk-shaped substrate D having a relatively small diameter, a support member having a relatively short radial length can be fixed to the table body 11, and when supporting a disk-shaped substrate D having a relatively large diameter, a support member having a relatively long radial length can be fixed to the table body 11.
  • the versatility of the support structure 1 is improved by making the support member 200 replaceable.
  • a support member having a relatively short radial length for example, a support member having a relatively short radial distance from the base fixing hole H located on the radial outer side to the upper surface 222a can be used.
  • a support member with a relatively long radial length for example, a support member with a relatively long radial distance from the base fixing hole H located on the radial outside to the upper surface 222a can be used.
  • connection part 210 and the main body part 220 are configured to be detachable. Specifically, in this embodiment, the extension part 212 of the connection part 210 and the base part 221 of the main body part 220 are fastened by the base part fastener 33. With this configuration, the main body part 220 can be replaced so that the upper surface inclination angle ⁇ 2 of the upper surface 222a is adjusted according to the lower inclined surface inclination angle ⁇ 1 of the lower inclined surface D11. For example, assume that the type of the disk-shaped substrate D transported by the support structure 1 is changed and the lower inclined surface inclination angle ⁇ 1 of the lower inclined surface D11 is changed to 30°.
  • the worker can remove the main body part 220 attached to the connection part 210 and fix a new main body part that can suitably support the disk-shaped substrate D after the type change to the connection part 210. That is, the worker can re-fix a new main body part having an upper surface with an upper surface inclination angle ⁇ 2 set to 30° or an angle close to this to the connection part 210. This increases the contact area between the lower inclined surface D11 and the upper surface, making it possible to support the disk-shaped substrate D more stably.
  • a space is formed between each of the support members 200, and this space can be used to place devices such as sensors. In other words, the degree of freedom in designing the support structure 1 is improved.
  • the disk-shaped substrate D can be stably supported even if the disk-shaped substrate D does not have a flat shape. For example, even if the disk-shaped substrate D partially has a bending portion having a bending shape, the disk-shaped substrate D can be stably supported by the support portion 20 with the bending portion released into the space.
  • the disk-shaped substrate D can be supported in a more balanced manner than when the disk-shaped substrate D is supported at two points. This makes it possible to prevent the disk-shaped substrate D from falling off the support members 200 when, for example, the posture of the disk-shaped substrate D becomes distorted.
  • the circumferential portion D1 is supported by three support members 200 that are arranged at equal intervals from each other, so that the disk-shaped substrate D can be supported in a well-balanced manner.
  • the portions of the support portion 20 other than the upper surface 222a are positioned at a distance from the disk-shaped substrate D.
  • the portions of the disk-shaped substrate D other than the circumferential portion D1 are prevented from being supported by the support portion 20.
  • the functional surface D12 is prevented from being supported. This prevents foreign matter and the like from adhering to the functional surface D12.
  • the support unit 20 may have a single support member having a mortar shape with the diameter at the top set to be approximately the same as the diameter of the disk-shaped substrate D.
  • the support unit 20 may have a pair of support members facing each other in the radial direction and each of which has an approximately U-shape. In other words, the support unit 20 may have two support members.
  • the upper surface 222a has a flat shape, but the shape of the upper surface 222a is not limited to this, and it may have a curved shape that bulges downward or upward.
  • the present invention provides a support structure for supporting a disk-shaped substrate, the support structure comprising a support part having a support surface arranged around a center line extending in the vertical direction and inclined downward toward the center line, the support surface abutting the circumferential portion of the disk-shaped substrate from below to support the weight of the disk-shaped substrate.
  • the circumferential portion of the disk-shaped substrate is supported from below by the support surface of the support portion, so that the disk-shaped substrate can be supported without the need for a complex mechanism. Furthermore, because the support surface supports the disk-shaped substrate's own weight, the disk-shaped substrate is supported, thereby preventing a force greater than the disk-shaped substrate's own weight from acting on the disk-shaped substrate. In other words, the application of excessive force to the disk-shaped substrate is prevented. Therefore, the disk-shaped substrate can be supported with a simple configuration, and damage to the disk-shaped substrate can be prevented.
  • the disk-shaped substrate is supported with its center position aligned with the center line of the support portion, and the disk-shaped substrate can be prevented from moving horizontally on the support portion.
  • the supporting surface is inclined, so the supporting surface and the supported surface can be in surface contact. This allows the supporting surface to stably support the supported surface.
  • the support surface may include an anti-slip portion that prevents the disk-shaped substrate from slipping.
  • This configuration prevents the circumferential portion of the disk-shaped substrate from slipping against the support surface. This allows the disk-shaped substrate to be supported with its posture stable.
  • the anti-slip portion may have an uneven shape formed on the support surface when viewed in a cross section including the center line.
  • the uneven shape improves the surface roughness of the non-slip portion. This increases the static friction coefficient between the support surface and the circumferential portion compared to when the non-slip portion does not have an uneven shape, further preventing the circumferential portion from slipping against the support surface.
  • the inclination angle of the support surface relative to the radial direction of a circle centered on the center line may be 15° or more and 30° or less.
  • the exterior angle between the functional surface used in device manufacturing and the inclined surface is often set within the range of 15° to 30°. Therefore, with the above configuration, the inclined surface is used as the supported surface and is supported by the supporting surface, thereby making it possible to increase the contact area between the supporting surface and the supported surface. As a result, it becomes possible for the supporting surface to stably support the supported surface.
  • the circumferential portion of the disk-shaped substrate has a supported surface that is inclined downward toward the center of the disk-shaped substrate and can be supported by the supporting surface, and the supporting surface may be inclined so as to extend parallel to the supported surface.
  • the support portion may have a plurality of support members spaced apart around the center line, and each of the plurality of support members may include an upper surface that constitutes the support surface.
  • the plurality of support members may include at least three support members.
  • the disk-shaped substrate can be supported in a more balanced manner than when the disk-shaped substrate is supported at two points. This makes it possible to prevent the disk-shaped substrate from falling off the support member when the disk-shaped substrate loses its position.
  • the multiple support members may be arranged at equal intervals around the center line.
  • the circumferential portion is supported by multiple support members that are evenly spaced from one another, allowing the disk-shaped substrate to be supported in a well-balanced manner.
  • the portion of the support portion other than the support surface may be positioned at a distance from the disk-shaped substrate.
  • the disk-shaped substrate is prevented from being supported by the support portion except for the circumferential portion. Specifically, the functional surface of the disk-shaped substrate used for device manufacturing is prevented from being supported. This makes it possible to suppress adhesion of foreign matter to the functional surface.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Specific Conveyance Elements (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

Une structure de support (1) pour un substrat en forme de disque (D) est pourvue d'une partie de support (20) ayant une surface de support qui : est disposée autour d'une ligne centrale s'étendant verticalement (C1) ; est inclinée vers le bas vers la ligne centrale (C1) ; et vient en butée contre la partie circonférentielle (D1) du substrat en forme de disque (D) par le dessous pour supporter le propre poids du substrat en forme de disque (D).
PCT/JP2024/022126 2023-07-18 2024-06-18 Structure de support pour substrat en forme de disque Pending WO2025018082A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023117080A JP2025014488A (ja) 2023-07-18 2023-07-18 円板状基板の支持構造
JP2023-117080 2023-07-18

Publications (1)

Publication Number Publication Date
WO2025018082A1 true WO2025018082A1 (fr) 2025-01-23

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Application Number Title Priority Date Filing Date
PCT/JP2024/022126 Pending WO2025018082A1 (fr) 2023-07-18 2024-06-18 Structure de support pour substrat en forme de disque

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JP (1) JP2025014488A (fr)
TW (1) TW202510188A (fr)
WO (1) WO2025018082A1 (fr)

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JP2004273847A (ja) * 2003-03-10 2004-09-30 Tokyo Electron Ltd 基板搬送装置
KR20100054243A (ko) * 2008-11-14 2010-05-25 주성엔지니어링(주) 반도체 소자 제조용 로드락 챔버와 이를 이용한 반도체 소자의 제조장치
JP2020503674A (ja) * 2016-12-20 2020-01-30 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 半導体処理のための円錐形ウエハセンタリングおよび保持装置
JP2020088171A (ja) * 2018-11-26 2020-06-04 住友金属鉱山株式会社 基板載置台

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