WO2025016600A1

WO2025016600A1 - Wafer-level optics manufacturing with embedded microlens array in the wafer

Info

Publication number: WO2025016600A1
Application number: PCT/EP2024/064597
Authority: WO
Inventors: Sonja Gantner; Oezkan AHISHALI; Sylvain GROSSMANN
Original assignee: Ams Osram Asia Pacific Pte Ltd
Current assignee: Ams Osram Asia Pacific Pte Ltd
Priority date: 2023-07-14
Filing date: 2024-05-28
Publication date: 2025-01-23
Anticipated expiration: 2026-01-14
Also published as: TW202506394A

Abstract

A method of manufacturing an optical component is provided, The method including providing a liquid polymer into each of a first cavity and a second cavity of a mold having at least the first cavity and the second cavity adjacent to each other; and forming a semi-finished optical component by pressing a stamp into the liquid polymer in each of the first cavity and the second cavity. Any one of tthhee stamp and the mold comprises a reservoir portion arranged between the first cavity and second cavity and a canal structure connecting each of the first cavity and the second cavity with the reservoir portion. The amount of liquid polymer filled into each of the first cavity and the second cavity is selected that at least a portion of the liquid polymer fills a part of the reservoir portion while forming the semi-finished optical component.

Description

WAFER-LEVEL OPTICS MANUFACTURING WITH EMBEDDED MICROLENS ARRAY IN THE WAFER

Description

This disclosure generally relates to optical metalens components .

A known method to form optical components , e . g . lens , used j etting a liquid polymer into a mold having a plurality of cavities to form multiple optical components at the same time and adj acent to each other . The j etted liquid polymer is than pressed by a stamp wherein a portion of the liquid polymer leaks out of the mold in an arbitrary amount , and hardened . The leaked out portion of the liquid polymer is an excess part , and a portion of the excess part is removed while cutting the optical component into its final shape .

The used amount of the liquid polymer per optical component is adj usted that the excess portions of adj acent optical components do not contact each other . The separation of the excess portions of adj acent optical components avoids any mechanical stress in the liquid polymer during the hardening of the liquid polymer .

However, to provide space for the separation of the excess portions of the liquid polymer, cavities for adj acent components the mold have to be placed in a larger lateral distance from each other .

It is an obj ective of the invention to provide an improved method and apparatus to form optical components .

In one aspect , a method of manufacturing an optical component is provided . The method includes providing a liquid polymer into each of a first cavity and a second cavity of a mold having at least the first cavity and the second cavity adj acent to each other . The method further includes forming a semifinished optical component by pressing a stamp into the liquid polymer in each of the first cavity and the second cavity . Any one of the stamp and the mold includes a reservoir portion arranged between the first cavity and second cavity and a canal structure connecting each of the first cavity and the second cavity with the reservoir portion . The amount of liquid polymer filled into each of the first cavity and the second cavity is selected that at least a portion of the liquid polymer fills a part of the reservoir portion while forming the semi- finished optical component .

In another aspect , a stamp for manufacturing an optical component is provided . The stamp including a reservoir portion arranged between a first stamping portion and a second stamping portion of the stamp and a canal structure connecting each of the first stamping portion and the second stamping portion with the reservoir portion . The first stamping portion is configured to form a portion of a first optical component and the second stamping portion is configured to form a portion of a second optical component .

In another aspect , a recombination master structure for providing a stamp for manufacturing an optical component is provided . The recombination master structure including a reservoir portion arranged between a first stamping portion and a second stamping portion of the stamp and a canal structure connecting each of the first stamping portion and the second stamping portion with the reservoir portion . The first stamping portion is configured to form a portion of a first optical component and the second stamping portion is configured to form a portion of a second optical component .

In another aspect , a mold for manufacturing an optical component is provided . The mold including a reservoir portion arranged between a first cavity and a second cavity of the mold and a canal structure connecting each of the first cavity and the second cavity with the reservoir portion, wherein the first cavity is configured to form a portion of a first optical component and the second cavity is configured to form a portion of a second optical component . In another aspect, a lens component is provided having a substrate including a cavity extending from a first surface of the substrate towards a second surface of the substrate opposite to the first surface. A lens element is arranged in the cavity. The lens element includes a microlens array including a plurality of lenslets. The microlens array is arranged in the cavity such that the lenslets do not exceed at least one of the first surface and the second surface.

In the drawings, like reference characters generally refer to the same parts throughout the different views. The drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention. In the following description, various aspects of the invention are described with reference to the following drawings, in which:

FIG.1 is a flow diagram of a method to manufacture an optical component;

FIG.2A to FIG.2B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component;

FIG.3A to FIG.3B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component;

FIG.4 illustrates a schematic cross-sectional view of an optical component;

FIG.5 illustrates a schematic perspective view of an optical component;

FIG.6A to FIG.6D illustrate schematic cross-sectional views of a component in a method to manufacture an optical component; FIG.7A to FIG.7D illustrate schematic cross-sectional views of a component in a method to manufacture an optical component;

FIG.8A to FIG.8D illustrate schematic views of an optical component ;

FIG.9A illustrates a schematic cross-sectional view of a comparative optical component;

FIG.9B illustrates a schematic cross-sectional view of an optical component;

FIG.10 illustrates a schematic cross-sectional view of an optical component;

FIG.11 is a flow diagram of a method to manufacture an optical component;

FIG.12 is a flow diagram of a method to manufacture an optical component;

FIG.13A to FIG.13B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component;

FIG.14A to FIG.14B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component;

FIG.15A to FIG.15B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component;

FIG.16A to FIG.16B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component; FIG . 17A to FIG 17B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component ;

FIG . 18A to FIG 18B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component ;

FIG . 19A to FIG 19B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component ;

FIG . 20 illustrates a schematic cross-sectional view of a component in a method to manufacture an optical component ;

FIG . 21 illustrates a schematic cross-sectional view of a component in a method to manufacture an optical component ;

FIG . 22A to FIG 22B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component ;

FIG . 23A to FIG 23B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component ;

FIG . 24A to FIG 24B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component ; and

FIG . 25A to FIG 25C illustrate schematic cross-sectional views of a component in a method to manufacture an optical component .

The following detailed description refers to the accompanying drawings that show, by way of illustration, speci fic details and aspects i which the disclosure may be practiced . One or more aspects are described in suf ficient detail to enable those skilled in the art to practice the disclosure . Other aspects may be utili zed and structural , logical , and electrical changes may be made without departing from the scope of the disclosure . The various aspects described herein are not necessarily mutually exclusive , as some aspects can be combined with one or more other aspects to form new aspects . Various aspects are described in connection with methods and various aspects are described in connection with devices . However, it may be understood that aspects described in connection with methods may similarly apply to the devices , and vice versa . Throughout the drawings , it should be noted that like reference numbers are used to depict the same or similar elements , features , and structures . Throughout the drawings , it should be noted that proportions are not necessary to scale and that the si ze of features may be emphasi zed for ease of illustration .

Throughout this speci fication, methods to form optical components are described based on a liquid polymer, a mold and a stamp . Note that shape of the optical component is formed by a cavity formed at least by a first part provided from the mold and a second part provided by the stamp by shaping the liquid polymer . The liquid polymer is provided into the cavity to take up the shape of at least a part of the cavity .

Note that the term liquid polymer refers to any kind of liquid polymer including any one of a polymer solution including a volatile solvent , a resin or polymer melt . The liquid polymer can be any kind of fluid or flowable polymer .

Further, the liquid polymer is configured to be hardened using any one of chemical cross-linking, e . g . thermally or ultraviolet (UV) cross-linking, e . g . polymeri zation, evaporation of volatile components , physical entanglement of polymer chains , e . g . cooling of polymer melts etc .

Further, throughout this speci fication, the mold denotes a component receiving the liquid polymer and the stamp denotes a component pressing into the liquid polymer positioned in the mold . Liquid polymer may be provided to a cavity in the mold using a j etting method . The stamp includes a stamping portion pressing into liquid polymer arranged in the cavity of the mold . The liquid polymer takes up, due to the pressing, the shaped and topographical features of the surfaces of the cavity in the mold and the stamping portion of the stamp .

The liquid polymer may be compressible or substantially incompressible depending on the application . Excess liquid polymer in the mold that exceeds the volume of the cavity formed by the mold and the stamp in the fully pressed

( inserted) state extends into the reservoir portion through a canal structure provided by any one of the stamp and the mold . The reservoir portion allows reduce the footprint per optical component and increases the number density of optical components formed at the same time .

Compared to comparative example using a replicated microlens array (MLA) on a glass wafer, the method to manufacture an optical component can provide MLAs of increased si ze for a given glass footprint and module footprint . Note that the footprint may be defined by a used copper lead frame . Further, the method allows that no yard removal is needed or becomes optional to increase the size of the MLA. Further, the method may allow using a larger variety of substrates , e . g . an epoxy wafer as an alternative to glass wafer .

In a comparative example , MLAs are formed on a surface of a glass wafer . I llustratively, the method can replicate MLAs below a surface of a wafer arranged in the mold, and the MLA is formed inside a cavity in the wafer . I llustratively, the wafer may act as a spacer ( also denoted as spacing element ) between the mold and the stamp . Further, the increased si ze of the MLA formed using the method avoid a beam clipping by a black Cr aperture that may cause a transmission loss , or a light leakage in the field of illumination ( FOI ) by light passing by the MLA active area . The comparative example requires a large glass footprint or small MLA si ze since maximum epoxy overflow has to fit in the lead frame cavity given the manufacturing and assembly tolerances . Optical power may be lost due to small MLA si ze , e . g . by beam clipping by a black Or aperture . Further, the comparative example may incur added cost to remove a replication yard, by e . g . laser ablation .

Further, in the comparative example , a glass spacer may be required between substrates of stacked optical components of an optical device . This generates added cost . Further, in the comparative example , a side wall coating of the substrate may be required to block outside light .

In comparison, the optical component manufactured using the method described below, e . g . a lens component inside a cavity in the wafer ( in other words : a lens component below a wafer surface ) provides a small glass footprint with large lens component si ze and without the requirement of yard removal . Further, the manufacturing method provides a large choice of wafers to be used as substrates for the lens component , e . g . epoxy wafer, optical filter glass , transparent glass wafer . Further, the optical component formed using the manufacturing method enables a potentially lower air gap tolerance between a lens component and a VCSEL emission area in an optical device using the lens component and the VCSEL . For example , there may be no base layer height (BLH) tolerance in the tolerance analysis , a tolerance may be driven mainly driven by a lithomold ( LM) height tolerance . Further, a thin layer of replicated epoxy may be formed between a glass wafer and a bonding material .

Further, a lens component arranged in the cavity of the wafer provides that the lens component cannot fall of f the substrate carrying the lens component . This way, eye safety of an optical device using the optical component can be improved .

Further, having the lens component arranged inside the cavity of the wafer, provides that no bonding material is spilled out on the lens component since the lens component is recessed in the wafer.

Further, a lens component arranged in the cavity of the wafer provides more design freedom in layout design of optical devices, e.g. thin double convex lens, meniscus lens. Further, a spacer wafer between substrates of stacked optical components may become optional depending on the selection of the used materials for the substrates.

Further, a side wall coating of the lens component or substrate carrying the lens component may become optional, e.g. by using a non-transparent substrate.

Further, a lens component arranged in the cavity of the wafer enables "pick & place" methods in device manufacturing, e.g. using a flat vacuum tool.

FIG.l illustrates a flow diagram to manufacture an optical component. FIG.2A-2B and FIG.3A-3B illustrate schematic crosssections illustrating the method. FIG.4 illustrates an optical component 400 formed using the method 100.

The method 100 of manufacturing an optical component 400 may include providing 102 a liquid polymer 126 into each of a first cavity 124-1 and a second cavity 124-2 of a mold 120 having at least the first cavity 124-1 and the second cavity 124-2 adjacent to each other, as illustrated in FIG.2A and FIG.2B.

The method 100 further includes forming 104 a semi-finished optical component by pressing 130 (in FIG.2A and FIG.3a illustrated by the arrow) a stamp 110 into the liquid polymer 126 in each of the first cavity 124-1 and the second cavity 124-2.

Any one of the stamp 110 and the mold 120 may include a reservoir portion 114 arranged between the first cavity 124-1 and second cavity 124-2 and a canal structure 132 connecting each of the first cavity 124-1 and the second cavity 124-2 with the reservoir portion 114, as illustrated in FIG.2A and FIG.3A. The amount of liquid polymer 126 filled into each of the first cavity 124-1 and the second cavity 124-2 may be selected that at least a portion of the liquid polymer 126 fills a part of the reservoir portion 114 while forming the semi-finished optical component, as illustrated in FIG.2B and FIG.3B (in FIG.2B and FIG.3B indicated as excess portion 134) .

Illustratively, the amount of liquid polymer 126 may be selected that liquid polymer 126 filled into first cavity 124-1 mixes in the reservoir portion 114 with liquid polymer 126 filled into second cavity 124-2.

The method 100 further may include a hardening of liquid polymer of the semi-finished optical component.

The method 100 further may include a dicing at least through a portion of the canal structure 132 to form at least a first optical component 400 and a second optical component 400. Thus, the optical component may be manufactured.

At least a portion 414 of the polymer corresponding to liquid polymer 126 in the canal structure 132 may remain in the optical component 400 after the dicing, as illustrated in FIG.4. The dicing may be a singulation of optical components 400.

The reservoir portion 114 may be formed completely in the stamp 110, as illustrated in FIG.2A and FIG.2B. Alternatively, the reservoir portion 114 may be formed completely in the mold 120, as illustrated in FIG.3A and FIG.3B. Alternatively, the reservoir portion 114 may be formed by a first part and a second part, wherein the first part of the reservoir portion 114 may be formed in the stamp 110 and the second part of the reservoir portion 114 may be formed in the mold 120 (not illustrated) .

The stamp 110 may include at least one cavity forming at least a portion of the reservoir portion 114, as illustrated in FIG.2A. At least one of the cavities may include or may be formed as a groove . At least one of the cavities may include or may be formed as a recess . A portion of at least one of the cavities may include a concave-shaped bottom .

For example , as illustrated in FIG . 2A, the stamp 110 may include a reservoir portion 114 arranged between a first stamping portion 116- 1 and a second stamping portion 116-2 of the stamp 110 . A canal structure 132 may connect each of the first stamping portion 116- 1 and the second stamping portion 116-2 with the reservoir portion 114 . The first stamping portion 116- 1 may be configured to form a portion of a first optical component 400 and the second stamping portion 116-2 may be configured to form a portion of a second optical component 400 .

The mold 120 may include at least one cavity forming at least a portion of the reservoir portion 114 , as illustrated in FIG . 3A. At least one of the cavities may include or may be formed as a groove . At least one of the cavities may include or may be formed as a recess . A portion of at least one of the cavities may include a concave-shaped bottom .

The first stamping portion 116- 1 and the second stamping portion 116-2 may be arranged adj acent on a shared stamp 110 carrier .

The canal structure 132 may be formed completely in the shared stamp 110 carrier .

A spacer configured that the stamp 110 may be arranged in a distance above a mold 120 such that a spacing may be formed between the mold 120 and the stamp 110 , wherein the spacing may include or may form at least a portion of the canal structure 132 .

At least one of the first stamping portion 116- 1 and the second stamping portion 116-2 may include a microlens array master structure configured to form a corresponding microlens array of the lens component in a liquid polymer 126 .

The canal structure 132 may be formed completely in the stamp 110 . Alternatively, the canal structure 132 may be formed completely in the mold 120 . Alternatively, the canal structure 132 may be formed by a first part and a second part , wherein the first part of the canal structure 132 may be formed in the stamp 110 and the second part of the canal structure 132 may be formed in the mold 120 .

The stamp 110 may be arranged in a distance above the mold 120 such that a spacing may be formed between the mold 120 and the stamp 110 . The spacing may include or may form at least a portion of the canal structure 132 .

The mold 120 may include a substrate 420 arranged on a carrier . The substrate 420 may include at least the first cavity 124- 1 and the second cavity 124-2 . The carrier may form a bottom of any one of the first cavity 124- 1 and the second cavity 124-2 , e . g . while manufacturing the optical component .

The mold 120 may include at least one cavity forming at least a portion of the reservoir portion 114 , as illustrated in FIG . 3A. The at least one cavity may include or may be formed as a groove . The at least one cavity may include or may be formed as a recess . A portion of the at least one of cavity may include a concave-shaped bottom .

The mold 120 may include a reservoir portion 114 arranged between a first cavity 124- 1 and a second cavity 124-2 of the mold 120 and a canal structure 132 connecting each of the first cavity 124- 1 and the second cavity 124-2 with the reservoir portion 114 , wherein the first cavity 124- 1 may be configured to form a portion of a first optical component 400 and the second cavity 124-2 may be configured to form a portion of a second optical component 400 . The first cavity 124- 1 and the second cavity 124-2 may be arranged adj acent on a shared carrier .

The canal structure 132 may be formed completely in the shared mold 120 carrier .

A spacer configured that the mold 120 may be arranged in a distance above a stamp 110 such that a spacing may be formed between the mold 120 and the stamp 110 , wherein the spacing may include or may form at least a portion of the canal structure 132 .

At least one reservoir cavity may form at least a portion of the reservoir portion 114 . The at least one reservoir cavity may include or may be formed as a groove . The at least one reservoir cavity may include or may be formed as a recess . A portion of the at least one reservoir cavity may include a concave-shaped bottom .

Any one of at least one of the first cavity 124- 1 and the second cavity 124-2 may include a base structure 412 configured to form a recess in a liquid polymer 126 filled in to the respective cavity .

The mold 120 may include a substrate 420 arranged on the shared carrier, wherein the substrate 420s may include at least the first cavity 124- 1 and the second cavity 124-2 .

The shared carrier may form a bottom of any one of the first cavity 124- 1 and the second cavity 124-2 .

The substrate 420 may include any one of a glass substrate 420 , a polymer substrate 420 , a lead frame , and a semiconductor substrate 420 .

Any one of at least one of the first stamping portion 116- 1 and the second stamping portion 116-2 may include a base structure 412 configured to form a recess in a liquid polymer 126 . The method 100 further may include a dicing at least through a portion of the canal structure 132 and through the substrate

420 between the first cavity 124- 1 and the second cavity 124-2 to form at least a first optical component 400 and a second optical component 400 . At least a portion of the polymer corresponding to liquid polymer 126 in the canal structure 132 may remain on the substrate 420 in the optical component 400 after the dicing .

The optical component 400 may be a lens component , as illustrated in FIG . 4 . However, the optical component formed using the method 100 may be any one of a prism, a grating, a grism, an optical tap, a wavelength converter, a microlens array, a lens system, or any combination thereof . The lens component 400 may have a substrate 420 . The substrate 420 may include any one of a glass substrate 420 , a polymer substrate 420 , a lead frame , and a semiconductor substrate 420 . The substrate 420 may include a cavity 406 extending from a first surface 402 of the substrate 420 towards a second surface 404 of the substrate 420 opposite to the first surface 402 . A lens element 428 may be arranged in the cavity 406 . The lens element 428 may include a first curved surface 408 and a second curved surface 410 opposite to the first curved surface 408 . At least one of the first curved surface 408 and the second curved surface 410 of the lens element 428 does not exceed at least one of the first surface 402 and the second surface 404 of the substrate 420 .

For example , the lens element 428 may include a microlens array that includes a plurality of lenslets . The microlens array may be arranged in the cavity 406 such that the lenslets do not exceed at least one of the first surface 402 and the second surface 404 . Each of the lenslets may include a curved surface , and none of the curved surfaces exceed one of the first surface 402 and the second surface 404 . In other words , each of the lenslets may include a first curved surface and a second curved surface opposite to the first curved surface . At least one of the first curved surface and the second curved surface of the lenslets does not exceed at least one of the first surface and the second surface of the substrate 420 .

Any one of at least one of the first cavity 124- 1 and the second cavity 124-2 and the stamp 110 may include a base structure 412 configured to form a recess in the polymer structure the respective cavity formed by the liquid polymer 126 . The base structure 412 may any one of a mounting structure , a bezel , and a light shielding structure .

The microlens array may include a plurality of lenslets arranged in an array . The microlens array master may include at least a portion of the canal structure 132 . The stamp 110 may be formed using a master structure using an embossing method 100 . For example , to manufacture the microlens array, the stamp 110 may include a microlens array master structure configured to form a corresponding microlens array in the liquid polymer 126s in each of the first cavity 124- 1 and second cavity 124-2 . The microlens array may include a plurality of lenslets arranged in an array . The microlens array master may include at least a portion of the canal structure 132 . The stamp 110 may be formed using a master structure using an embossing method 100 .

The mold 120 may include a substrate 420 having a first side and a second side , and may include at least the first cavity 124- 1 and the second cavity 124-2 . The second side may be arranged on a carrier and the stamp 110 may be pressed towards the first side , wherein the stamp 110 may be a first stamp 110 and the process as described above may be repeated using a second stamp 110 pressing 130 towards the second side , when the substrate 420 may be arranged with its first side on the carrier .

The carrier may be a first carrier, and a second carrier may be attached to the first side of the substrate 420 before the first carrier may be removed from the second side of the substrate 420 . FIG.5 illustrates a schematic perspective view of an optical component. Here, the optical component 400 may include a replicated MLA 428-1 in a substrate 420 on a thin layer 428-2 of replicated epoxy (e.g. having a thickness of equal or less than 10 pm for example) . The substrate 420 may be a wafer formed of glass or epoxy, for example. The substrate 420 may include a base layer 412.

The optical component 400 illustrated in FIG.4 is an example for a wafer-level optics manufacturing of a MLA using the method described above. The MLA 428-1 may be replicated inside a cavity in the substrate 420. In other words, the MLA 428-1 may be formed below a surface level of the substrate 420. This way, the size of the MLA 428-1 can be maximized for a given footprint. The MLA 428-1 may be formed using a lithomold on a master as described in detail below.

FIG.6A to FIG.6D illustrate schematic cross-sectional views of a component in a method to manufacture an optical component. FIG.6A to FIG.6D illustrate high level process steps of an exemplary lithomold to form the MLA 428-1 described before.

FIG.6A illustrates a master structure 600 to form a stamp 110 illustrated in FIG.6B.

The master structure 600 may include a recombination master carrier 606 with a stamping master portion 610 having a recombined MLA 608, a first lithomold layer 604, e.g. having a height of 100 pm, and a second lithomold layer 602 configured for venting and including a reservoir portion as described above .

A fluid Polydimethylsiloxan (PDMS) may be filled into the master structure 600 to form the stamp 110 replicating a surface topography corresponding to a surface topography of the master structure 600. The mold 120 may include a substrate 420, e.g. a borosilicate substrate having a thickness of about 300 gm. The substrate 420 may be arranged on a carrier 428-2, as described above. Cavities in the substrate 420 may be filled, e.g. overfilled, with a liquid polymer 126 for forming the optical component. The cavities may be filled with liquid polymer 126 using a jetting process. The stamp 110 with its stamping portions may be pressed into the liquid polymer 126 arranged in the cavities of the mold 120, as illustrated in FIG.6B and FIG.6C. As illustrated in FIG.6C, the amount of liquid polymer 126 is set that an excess amount of polymer 136 fills at least a portion of the reservoir 114. The liquid polymer 126 may replicate a surface topography of the stamping portion of the stamp 110. This way, the liquid polymer 126 may have a surface topography corresponding to a surface topography of any one of the master structure 600 and the stamp 110.

The optical components 620 may be defined by the cavities in mold. The optical components 620 may be separated, e.g. diced, after hardening the liquid polymer 126, e.g. after solidifying the liquid polymer 126. The separation may be a dicing for example. The separation may be performed along separation lines 618. The reservoir and at least a part of the channel structure (as described above) may be arranged in the separation lines. Thus, the reservoir and at least a part of the channel structure may be removed by the separation process, and may not be part of the finished optical component. For example, the separation process, e.g. dicing, may be based on a sawing using a 200 gm blade, for example. The blade may cut through the glass substrate 420 and very thin epoxide layer 428-2 as described above.

FIG.7A to FIG.7D illustrate schematic cross-sectional views of a component in a method to manufacture an optical component. The method illustrated in FIG.7A to FIG.7D illustrates a method without using a lithomold as in the method illustrated in FIG.6A to FIG.6D. Thus, instead of lithomold layers 602, 604 forming the master structure 600, the recombination master structure 700 may be formed by a single patterned layer on the recombination master carrier 606. The recombination master structure 700 may include a reservoir portion master structure 704 forming the reservoir portion in the stamp. A stamping master portion 710 may be arranged between adjacent reservoir portion master structures 704. A stamping master portion 710 may include an optical element master structure 708 and a channel master structure 706.

The further method may correspond to the method as described before and illustrated in FIG.6B to FIG.6D (see FIG.7B to FIG.7D) .

FIG.8A to FIG.8D illustrate schematic views of an optical component. FIG.8A illustrates a perspective view of an example of a finished optical component having a replicated MLA on a glass that has been manufactured on a wafer-level as described above (see also FIG.4) . FIG.8B shows a cross-section of the optical component illustrated in FIG.8A in a first direction, and FIG.8C shows a cross-section of the optical component illustrated in FIG.8A and FIG.8B in a second direction (orthogonal to the first direction) .

The optical component may be arranged in a VCSEL 1000 on or above a light source 1008 arranged on a lead frame 1010 using a bonding layer 1006, as illustrated in FIG.8D.

A portion of the cavity in the substrate 420 may be filled with an epoxy 1002 (see FIG.80B) . Alternatively, or in addition, a portion 1004 of the cavity of the substrate 420 may be hollow, e.g. an air gap 1004 (see FIG.8C) .

FIG.9A illustrates a schematic cross-sectional view of a comparative optical component. FIG.9B illustrates a schematic cross-sectional view of an optical component manufactured using the method described above. Illustratively, using reservoir portions, the manufacturing method allows increasing the size of the stamping portion of the stamp, e.g. increasing the size of the MLA per glass size (e.g. glass footprint, e.g. clear aperture on A-side of the substrate) in the optical component. In other words, the reservoir portion allows reducing the boundary region of the optical component without optical function (e.g. bezel region) per glass footprint.

FIG.10 illustrates a schematic cross-sectional view of an optical component 1200. The optical component 1200 includes a first optical component 400-1 and a second optical component 400-2. Any one of the first optical component 400-1 and the second optical component 400-2 may be formed using a method described above.

The first optical component 400-1 may be arranged on or above the second optical component 400-2. The first optical component 400-1 (at its B-side) may be attached to the second optical component 400-2 (at its C-side) using an adhesive layer 1204 arranged there between. Any of the first optical component 400- 1 and the second optical component 400-4 may include a lens component 1202, 1208, e.g. a converging lens 1202 or diverging lens. The lens component 1202, 1208 may be arranged at least with on surface below a surface of the respective substrate, e.g. inside a cavity of the substrate. An air gap 1206 may be arranged between the optical components 1202, 1208.

Note that the base structure 412 may increase the structural stability of a lens component. Alternatively, or in addition, the base structure 412 may have optical functionality, e.g. acting as a bezel, for beam shaping.

Thus, the optical component manufactured using the above described method allows forming the lens component inside a cavity of the substrate, e.g. wafer, on a wafer level. This way, a compact and low-cost optical stack can be provided due to the low footprint provided by using the reservoir portion.

In the following, variations of the manufacturing method described above are illustrated to form the optical component 1200 illustrated in FIG.10. FIG.11 is a flow diagram of a method to manufacture an optical component corresponding to the method illustrated in FIG.6A to FIG.6D.

For each optical component, the method may include a layout process including a Single Point Diamond Turning (SPDT) SPDT 1302 to provide a recombination tool (also denoted as Reco- tool) 1304 for generating a recombination master structure (Iso denoted as Reco-master) 1306. A first lithomold (also denoted as lithomold 1) 1308 is provided on a carrier. A second lithomold (also denoted as lithomold 2) 1310 is provided on or above the first lithomold. A stamp is formed 1312 filling the Reco-master e.g. with PDMS.

Note, a lithomold may be any kind of layer used persistent regarding a material forming the stamp, e.g. persistent regarding PDMS, e.g. an epoxy.

The stamp may be used for double-sided replication 1314 (see also below) of a topography of the stamp defined by the first and second lithomolds in a liquid polymer arranged in a cavity of a mold, e.g. by pressing the stamp into the liquid polymer. This way, at least a part of the liquid polymer fills the channel structure and the reservoir portion in any one of the stamp, the mold, and the interspace between the stamp and the mold. The liquid polymer may be solidified afterwards.

The method may further include a trench dicing 1316 (optional) , a screen printing 1318, a wafer stacking 1320 and a final dicing 1322.

FIG.12 is a flow diagram of a method to manufacture an optical component corresponding to the method illustrated in FIG.7A to FIG.7D.

Alternatively to FIG.11, for each optical component, the method may include a SPDT 1402, a Reco-tool 1404, a Reco-master 1406, a filling 1408 of the cavities formed in the topography of the Reco-master, e.g. with PDMS, to form 1410 the stamp. The stamp may be used for double-sided replication 1412 to form the optical element of the optical component as described before .

The method may further include a trench dicing 1414 (optional) , a screen printing 1416, a wafer stacking 1418, and a final dicing 1420 to form the finished optical component.

FIG.13A to FIG.13B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component corresponding to the method illustrated in FIG.11. FIG.13A to FIG.13B illustrate a Reco-master convex lens and lithomold layer 1. In particular, FIG.13A illustrates a Reco-master with recombined wafer level optics lens 1502 and a lithomold on a submaster 1504 using a spacer 1508 having height of e.g. about 100 pm. FIG.13B illustrates the Reco-master with lithomold 1506.

FIG.14A to FIG.14B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component corresponding to the method illustrated in FIG.11. FIG.14A to FIG.14B illustrate a Reco-master convex lens with lithomold 1 and lithomold 2. In particular, FIG.14A illustrates a Reco- master with recombined wafer level optics lens 1602 and a lithomold on a submaster 1604 using a spacer 1608 having height of e.g. about 100 pm. FIG.14B illustrates the Reco-master with lithomold 1606.

FIG.15A to FIG.15B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component corresponding to the method illustrated in FIG.12.

FIG.15A to FIG.15B illustrate a Reco-master convex lens. In 55particular , FIG.15A illustrates a Reco-master for a recombined convex lens and filling for venting and as reservoir portion, and FIG.15B illustrates a Reco-master for a recombined concave lens and filling for venting and as reservoir portion (see also FIG .7 ) . FIG.16A to FIG.16B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component corresponding to the method illustrated in FIG.11. FIG.16A to FIG.16B illustrate a Reco-master convex lens and lithomold layer 1. In particular, FIG.16A illustrates a Reco-master with recombined wafer level optics lens 1802 and a lithomold on a submaster 1804 using a spacer 1808 having height of e.g. about 100 pm. FIG.16B illustrates the Reco-master with lithomold 1806.

FIG.17A to FIG.17B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component corresponding to the method illustrated in FIG.11. FIG.17A to FIG.17B illustrate a Reco-master convex lens with lithomold 1 and lithomold 2. In particular, FIG.17A illustrates a Reco- master with recombined wafer level optics lens 1902 and a lithomold on a submaster 1904 using a spacer 1908 having height of e.g. about 200 pm. FIG.17B illustrates the Reco-master with lithomold 1906.

FIG.18A to FIG.18B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component corresponding to the method illustrated in FIG.11. FIG.18A to FIG.18B illustrate a Reco-master convex lens with lithomold 1 and lithomold 2. In particular, FIG.18A illustrates a Reco- master with recombined wafer level optics lens 2002 and a lithomold on a submaster 2004 using a spacer 2008 having height of e.g. about 200 pm. FIG.18B illustrates the Reco-master with lithomold 2006.

FIG.19A to FIG.19B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component corresponding to FIG.6C, and in particular a replication of a double convex lens component. FIG.19A illustrates a thick double convex lens and FIG.19B illustrates a thin double convex lens. Note that for manufacturing a thin double convex lens different stamps 110-1, 110-2 may be used for the opposing sides of the lens component. Further, note that the stamps illustrated in FIG.19A to FIG.19B may be as illustrated in any one of FIG.13A to FIG.18B. Further, note that two stamps 110-1, 110-2 may be used in conjunction with a shared mold 120. Further, at least one of the stamps 110-1, 110-2 includes a channel structure 132 and reservoir portion 114.

FIG.20 illustrates a schematic cross-sectional view of a component a method to manufacture an optical component corresponding to FIG.6C, and in particular a replication of a double concave lens component. Note that the stamps illustrated in FIG.20 may be corresponding to any one of FIG.13A to FIG.18B. Further, note that two stamps 110-1, 110-2 may be used in conjunction with a shared mold 120. Further, at least one of the stamps 110-1, 110-2 includes a channel structure 132 and reservoir portion 114.

FIG.21 illustrates a schematic cross-sectional view of a component in a method to manufacture an optical component corresponding to FIG.6C, and in particular a replication of a double meniscus lens component. Note that for manufacturing a thin meniscus lens different stamps 110-1, 110-2 may be used for the opposing sides of the lens component Note that the stamps illustrated in FIG.21 may be corresponding to any one of FIG.13A to FIG.18B. Further, note that two stamps 110-1, 110-2 may be used in conjunction with a shared mold 120. Further, at least one of the stamps 110-1, 110-2 includes a channel structure 132 and reservoir portion 114.

FIG.22A to FIG.22B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component. As another example, using the manufacturing method described above, an alignment mark, e.g. a global alignment mark, may be formed. FIG.22B shows the global alignment mark 2400 after trench dicing in the finished optical component.

FIG.23A to FIG.23B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component. FIG.23A illustrates a screen printing of adhesive layer 1204 on any one surface of a first optical component 400-1 and a second optical component 400-2, and a stacking of the first and second optical components 400-1, 400-2, (see also FIG.11 and FIG.12) .

FIG.23B shows the optical component after final dicing, e.g. a final optical component after final dicing (see also FIG.11 and FIG.12) .

FIG.24A to FIG.24B illustrate schematic cross-sectional views of a component in a method to manufacture an optical component, and in particular a replication of a double convex lens on an aperture stop, e.g. base structure 412. FIG.24A illustrates a replication of a first convex lens of the double convex lens, and a wafer separation. Note that there may be an air gab between the substrate 420 and the second stamp 1102- or carrier. FIG.24B illustrates a replication of the second convex lens of the double convex lens and a wafer separation. Note that there may be a reservoir portion 114 in each of the first and second stamps 110-1, 110-2.

FIG.25A to FIG.25C illustrate schematic cross-sectional views of a component in a method to manufacture an optical component . FIG .25A illustrates a first optical component 1202 including a trench dicing on both sides of the substrate 420, e.g. a removal of excess liquid polymer in the reservoir portion and at least in part from the channel structure. Further, a bonding layer, e.g. adhesive layer 1204 may be formed on a side of the first optical component, e.g. using a screen printing method. FIG.25B illustrates a stacking of the first optical component 1202 on a second optical component 1208. FIG.25C shows the finished optical component after a final dicing.

In the following some examples are described, which relate to what is described herein and shown in the figures.

Example 1 is a method of manufacturing an optical component, the method including: providing a liquid polymer into each of a first cavity and a second cavity of a mold having at least the first cavity and the second cavity adjacent to each other; and forming a semi-finished optical component by pressing a stamp into the liquid polymer in each of the first cavity and the second cavity; wherein any one of the stamp and the mold includes a reservoir portion arranged between the first cavity and second cavity and a canal structure connecting each of the first cavity and the second cavity with the reservoir portion; and wherein the amount of liquid polymer filled into each of the first cavity and the second cavity is selected that at least a portion of the liquid polymer fills a part of the reservoir portion while forming the semi- finished optical component .

In Example 2 , the subj ect matter of Example 1 can optionally include that the amount of liquid polymer is selected that liquid polymer filled into first cavity mixes in the reservoir portion with liquid polymer filled into second cavity .

In Example 3 , the subj ect matter of Example 1 or 2 can optionally include that the method further includes a hardening of liquid polymer of the semi- finished optical component .

In Example 4 , the subj ect matter of any one of Examples 1 to 3 can further optionally include a dicing at least through a portion of the canal structure to form at least a first optical component and a second optical component .

In Example 5 , the subj ect matter of Example 4 can optionally include that at least a portion of the polymer corresponding to liquid polymer in the canal structure remains in the optical component after the dicing .

In Example 6 , the subj ect matter of Example 4 or 5 can optionally include that the dicing is a singulation of optical components .

In Example 7 , the subj ect matter of any one of Examples 1 to 6 can optionally include that the reservoir portion is formed completely in the stamp . In Example 8 , the subj ect matter of any one of Examples 1 to 6 can optionally include that the reservoir portion is formed completely in the mold .

In Example 9 , the subj ect matter of any one of Examples 1 to 6 can optionally include that the reservoir portion is formed by a first part and a second part , wherein the first part of the reservoir portion is formed in the stamp and the second part of the reservoir portion is formed in the mold .

In Example 10 , the subj ect matter of any one of Examples 1 to 9 can optionally include that the canal structure is formed completely in the stamp .

In Example 11 , the subj ect matter of any one of Examples 1 to 9 can optionally include that the canal structure is formed completely in the mold .

In Example 12 , the subj ect matter of any one of Examples 1 to 9 can optionally include that the canal structure is formed by a first part and a second part , wherein the first part of the canal structure is formed in the stamp and the second part o f the canal structure is formed in the mold .

In Example 13 , the subj ect matter of Example 1 can optionally include that the stamp is arranged in a distance above the mold such that a spacing is formed between the mold and the stamp .

In Example 14 , the subj ect matter of Example 13 can optionally include that the spacing includes or forms at least a portion of the canal structure .

In Example 15 , the subj ect matter of any one of Examples 1 to 14 can optionally include that the mold includes a substrate arranged on a carrier, wherein the substrate includes at least the first cavity and the second cavity . In Example 16 , the subj ect matter of Example 15 can optionally include that the carrier forms a bottom of any one of the first cavity and the second cavity .

In Example 17 , the subj ect matter of any one of Examples 1 to 16 can optionally further include a dicing at least through a portion of the canal structure and through the substrate between the first cavity and the second cavity to form at least a first optical component and a second optical component .

In Example 18 , the subj ect matter of Example 17 can optionally include that at least a portion of the polymer corresponding to liquid polymer in the canal structure remains on the substrate in the optical component after the dicing .

In Example 19 , the subj ect matter of any one of Examples 15 to

18 can optionally include that the substrate includes any one of a glass substrate , a polymer substrate , a lead frame , and a semiconductor substrate .

In Example 20 , the subj ect matter of any one of Examples 1 to

19 can optionally include that the optical component is a lens component .

In Example 21 , the subj ect matter of any one of Examples 1 to 21 can optionally include that the stamp includes a microlens array master structure configured to form a corresponding microlens array in the liquid polymers in each of the first cavity and second cavity .

In Example 22 , the subj ect matter of Example 21 can optionally include that the microlens array includes a plurality of lenslets arranged in an array .

In Example 23 , the subj ect matter of Example 20 or 21 can optionally include that the microlens array master includes at least a portion of the canal structure . In Example 24 , the subj ect matter of any one of Examples 1 to 23 can optionally include that the stamp is formed using a master structure using an embossing method .

In Example 25 , the subj ect matter of any one of Examples 1 to 7 or 9 to 24 can optionally include that the stamp includes at least one cavity forming at least a portion of the reservoir portion .

In Example 26 , the subj ect matter of any one of Examples 1 to 6 or 8 to 24 can optionally include that the mold includes at least one cavity forming at least a portion of the reservoir portion .

In Example 27 , the subj ect matter of Example 25 or 26 can optionally include that at least one of the cavities includes or is formed as a groove .

In Example 28 , the subj ect matter of any one of Examples 25 to

27 can optionally include that at least one of the cavities includes or is formed as a recess .

In Example 29 , the subj ect matter of any one of Examples 25 to

28 can optionally include that a portion of at least one of the cavities includes a concave-shaped bottom .

In Example 30 , the subj ect matter of any one of Examples 1 to

29 can optionally include that any one of at least one of the first cavity and the second cavity and the stamp includes a base structure configured to form a recess in the polymer structure the respective cavity formed by the liquid polymer .

In Example 31 , the subj ect matter of any one of Examples 1 to

30 can optionally include that the mold includes a substrate having a first side and a second side , and including at least the first cavity and the second cavity, wherein the second side is arranged on a carrier and the stamp is pressed towards the first side , wherein the stamp is a first stamp and the process according to any one of Examples 1 to 30 is repeated using a second stamp pressing towards the second side , when the substrate is arranged with its first side on the carrier .

In Example 32 , the subj ect matter of Example 31 can optionally include that the carrier in any one of Examples 1 to 30 is a first carrier, and the carrier in Example 31 is a second carrier .

In Example 33 , the subj ect matter of Example 32 can optionally include that the second carrier is attached to the first side of the substrate before the first carrier is removed from the second side of the substrate .

Example 34 is a lens component having a substrate including a cavity extending from a first surface of the substrate towards a second surface of the substrate opposite to the first surface , and a lens element arranged in the cavity, wherein the lens element includes a microlens array including a plurality of lenslets , wherein the microlens array is arranged in the cavity such that the lenslets do not exceed at least one of the first surface and the second surface .

In Example 35 , the subj ect matter of Example 34 can optionally include that each of the lenslets includes a curved surface , and wherein none of the curved surfaces exceed one of the first surface and the second surface .

In Example 36 , the subj ect matter of Example 34 or 35 can optionally include that each of the lenslets includes a first curved surface and a second curved surface opposite to the first curved surface , wherein at least one of the first curved surface and the second curved surface of the lenslets does not exceed at least one of the first surface and the second surface of the substrate .

Example 37 is a stamp for manufacturing an optical component , the stamp including a reservoir portion arranged between a first stamping portion and a second stamping portion of the stamp and a canal structure connecting each of the first stamping portion and the second stamping portion with the reservoir portion, wherein the first stamping portion is configured to form a portion of a first optical component and the second stamping portion is configured to form a portion of a second optical component .

In Example 38 , the subj ect matter of Example 37 can optionally include that the first stamping portion and the second stamping portion are arranged adj acent on a shared stamp carrier .

In Example 39 , the subj ect matter of Example 38 can optionally include that the canal structure is formed completely in the shared stamp carrier .

In Example 40 , the subj ect matter of any one of Examples 37 to

39 can further optionally include a spacer configured that the stamp is arranged in a distance above a mold such that a spacing is formed between the mold and the stamp, wherein the spacing includes or forms at least a portion of the canal structure .

In Example 41 , the subj ect matter of any one of Examples 37 to

40 can optionally include that at least one of the first stamping portion and the second stamping portion includes a microlens array master structure configured to form a corresponding microlens array of the lens component in a liquid polymer .

In Example 42 , the subj ect matter of Example 41 can optionally include that the microlens array includes a plurality of lenslets arranged in an array .

In Example 43 , the subj ect matter of Example 42 can optionally include that the microlens array master includes at least a portion of the canal structure .

In Example 44 , the subj ect matter of any one of Examples 37 to 43 can optionally include that the stamp is formed using a master structure using an embossing method . In Example 45 , the subj ect matter of any one of Examples 37 to 44 can optionally include at least one cavity forming at least a portion of the reservoir portion .

In Example 46 , the subj ect matter of Example 45 can optionally include that the at least one cavity includes or is formed as a groove .

In Example 47 , the subj ect matter of any one of Examples 37 to

46 can optionally include that the at least one cavity includes or is formed as a recess .

In Example 48 , the subj ect matter of any one of Examples 37 to

47 can optionally include that a portion of the at least one of cavity includes a concave-shaped bottom .

In Example 49 , the subj ect matter of any one of Examples 37 to

48 can optionally include that any one of at least one of the first stamping portion and the second stamping portion includes a base structure configured to form a recess in a liquid polymer .

Example 50 is a mold for manufacturing an optical component , the mold including a reservoir portion arranged between a first cavity and a second cavity of the mold and a canal structure connecting each of the first cavity and the second cavity with the reservoir portion, wherein the first cavity is configured to form a portion of a first optical component and the second cavity is configured to form a portion of a second optical component .

In Example 51 , the subj ect matter of Example 50 can optionally include that the first cavity and the second cavity are arranged adj acent on a shared carrier .

In Example 52 , the subj ect matter of Example 50 or 51 can optionally include that the canal structure is formed completely in the shared mold carrier . In Example 53 , the subj ect matter of any one of Examples 50 to 52 can further optionally include a spacer configured that the mold is arranged in a distance above a stamp such that a spacing is formed between the mold and the stamp, wherein the spacing includes or forms at least a portion of the canal structure .

In Example 54 , the subj ect matter of any one of Examples 50 to 53 can optionally include at least one reservoir cavity forming at least a portion of the reservoir portion .

In Example 55 , the subj ect matter of Example 53 can optionally include that the at least one reservoir cavity includes or is formed as a groove .

In Example 56 , the subj ect matter of any one of Examples 54 to

55 can optionally include that the at least one reservoir cavity includes or is formed as a recess .

In Example 57 , the subj ect matter of any one of Examples 54 to

56 can optionally include that a portion of the at least one reservoir cavity includes a concave-shaped bottom .

In Example 58 , the subj ect matter of any one of Examples 54 to

57 can optionally include that any one of at least one of the first cavity and the second cavity includes a base structure configured to form a recess in a liquid polymer filled in to the respective cavity .

In Example 59 , the subj ect matter of any one of Examples 50 to

58 can optionally include that the mold includes a substrate arranged on the shared carrier, wherein the substrate includes at least the first cavity and the second cavity .

In Example 60 , the subj ect matter of Example 59 can optionally include that the shared carrier forms a bottom of any one of the first cavity and the second cavity . In Example 61, the subject matter of Example 59 or 60 can optionally include that the substrate includes any one of a glass substrate, a polymer substrate, a lead frame, and a semiconductor substrate.

The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any example or design described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other examples or designs .

The words "plurality" and "multiple" in the description or the claims expressly refer to a quantity greater than one. The terms "group (of) ", "set [of] ", "collection (of) ", "series (of)", "sequence (of)", "grouping (of)", etc., and the like in the description or in the claims refer to a quantity equal to or greater than one, i.e. one or more. Any term expressed in plural form that does not expressly state "plurality" or "multiple" likewise refers to a quantity equal to or greater than one .

The term "connected" can be understood in the sense of a (e.g. mechanical, optical and/or electrical) , e.g. direct or indirect, connection and/or interaction. For example, several elements can be connected together mechanically such that they are physically retained (e.g., a plug connected to a socket) and electrically such that they have an electrically conductive path (e.g., signal paths exist along a communicative chain) .

While the above descriptions and connected figures may depict optical device components as separate elements, skilled persons will appreciate the various possibilities to combine or integrate discrete optical functions into a single element. Such may include combining two or more components from a single component. Conversely, skilled persons will recognize the possibility to separate a single element into two or more discrete elements, such as splitting a single component into two or more separate component. It is appreciated that implementations of methods detailed herein are exemplary in nature , and are thus understood as capable of being implemented in a corresponding device . Likewise , it is appreciated that implementations of devices detailed herein are understood as capable o f being implemented as a corresponding method . It is thus understood that a device corresponding to a method detailed herein may include one or more components configured to perform each aspect of the related method .

All acronyms defined in the above description additionally hold in all claims included herein .

While the disclosure has been particularly shown and described with reference to speci fic embodiments , it should be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the disclosure as defined by the appended claims . The scope of the disclosure is thus indicated by the appended claims and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced .

Reference Numeral List

100 , 102 , 104 method and method steps

110 st amp

112 stamp carrier

114 reservoir

116- 1 , 116-2 stamping portion

120 mold

122 substrate

124- 1 , 124-2 cavity

126 liquid polymer

130 direction of movement

132 canal structure

134 excess portion of liquid polymer

400 optical component , e . g . lens component

402 first surface of substrate

404 second surface of substrate

406 cavity

408 first curved surface

410 second curved surface

412 base structure

414 excess portion of polymer

420 substrate

428 lens body

600 master structure

602 , 604 lithomold layers

606 recombination master carrier

608 MLA

610 stamping master portion

618 separation lines

620 optical components

700 recombination master structure

704 reservoir portion master structure

706 channel master structure

708 optical element master structure

710 stamping master portions

1000 VCSEL 1002 epoxy

1004 cavity portion

1006 bonding layer

1008 light source

1010 lead frame

1200 optical component

1202 1208 lens component

1204 adhesive layer

1206 air gap

1302 1304, 1306, 1308, 1310, 1312, 1314, 1316, 1318, 1320,

1322 1402, 1404, 1406, 1408, 1410, 1412, 1414, 1416, 1418,

1420 process steps

1502 1602, 1802, 1902, 2002 recombined wafer level optics lens

1504 1604, 1804, 1904, 2004 submaster

1506 1606, 1806, 1906, 2006 lithomold

1508 1608, 1808, 1908, 2008 spacer

Claims

1 . A method of manufacturing an optical component , the method comprising : providing a liquid polymer into each of a first cavity and a second cavity of a mold having at least the first cavity and the second cavity adj acent to each other ; and forming a semi- finished optical component by pressing a stamp into the liquid polymer in each of the first cavity and the second cavity; wherein any one of the stamp and the mold comprises a reservoir portion arranged between the first cavity and second cavity and a canal structure connecting each of the first cavity and the second cavity with the reservoir portion; and wherein the amount of liquid polymer filled into each of the first cavity and the second cavity is selected that at least a portion of the liquid polymer fills a part of the reservoir portion while forming the semi- finished optical component .

2 . The method of claim 1 , wherein the reservoir portion is formed completely in any one of the stamp and the mold .

3 . The method of claim 1 , wherein the canal structure is formed completely in any one of the stamp and the mold .

4 . The method of claim 1 , wherein the reservoir portion is formed by a first part and a second part , wherein the first part of reservoir portion is formed in the stamp and the second part of reservoir portion is formed in the mold .

5 . The method of claim 1 , wherein the canal structure is formed by a first part and a second part , wherein the first part of canal structure is formed in the stamp and the second part of canal structure is formed in the mold .

6 . The method of claim 1 , wherein the stamp is arranged in a distance above the mold such that a spacing is formed between the mold and the stamp, wherein the spacing comprises or forms at least a portion of the canal structure .

7 . The method of claim 1 , wherein the mold comprises a substrate arranged on a carrier, wherein the substrate comprises at least the first cavity and the second cavity; wherein the carrier forms a bottom of any one of the first cavity and the second cavity; and wherein the substrate comprises any one of a glass substrate , a polymer substrate , a lead frame , and a semiconductor substrate .

8 . The method of any one of claims 1 to 7 , wherein the stamp comprises a microlens array master structure configured to form a corresponding microlens array in the liquid polymers in each of the first cavity and second cavity .

9 . The method of any one of claims 1 to 8 , wherein the stamp is formed using a master structure using an embossing method .

10 . The method of claim 9 , wherein the stamp comprises at least one cavity forming at least a portion of the reservoir portion .

11 . The method of any one of claims 1 to 10 , wherein at least one of the first cavity and the second cavity comprises a base structure configured to form a recess in the polymer structure the respective cavity formed by the liquid polymer in the respective cavity .

12 . The method of any one of claims 1 to 11 , wherein the mold comprises a substrate having a first side and a second side , and comprising at least the first cavity and the second cavity, wherein the second side is arranged on a carrier and the stamp is pressed towards the first side , wherein the stamp is a first stamp and the process according to claim 1 is repeated using a second stamp pressing towards the second side , when the substrate is arranged with its first side on the carrier .

13 . The method of claim 12 , wherein the carrier in claim 1 is a first carrier, and the carrier in claim 12 is a second carrier .

14 . The method of claim 13 , wherein the second carrier is attached to the first side of the substrate before the first carrier is removed from the second side of the substrate .

15 . A lens component having a substrate comprising a cavity extending from a first surface of the substrate towards a second surface of the substrate opposite to the first surface , and a lens element arranged in the cavity, wherein the lens element comprises a microlens array comprising a plurality of lenslets , wherein the microlens array is arranged in the cavity such that the lenslets do not exceed at least one of the first surface and the second surface .

16 . The lens component of claim 15 , wherein the each of the lenslets comprises a first curved surface and a second curved surface opposite to the first curved surface , wherein at least one of the first curved surface and the second curved surface of the lenslets does not exceed at least one of the first surface and the second surface of the substrate .

17 . A stamp for manuf cturing an optical component , the stamp including a reservoir portion arranged between a first stamping portion and a second stamping portion of the stamp and a canal structure connecting each of the first stamping portion and the second stamping portion with the reservoir portion, wherein the first stamping portion is configured to form a portion of a first optical component and the second stamping portion is configured to form a portion of a second optical component .

18 . The stamp of claim 17 , wherein at least one of the first cavity and the second cavity comprises a base structure configured to form a recess in the polymer structure the respective cavity formed by the liquid polymer in the respective cavity .

19 . A mold for manufacturing an optical component, the mold including a reservoir portion arranged between a first cavity and a second cavity of the mold and a canal structure connecting each of the first cavity and the second cavity with the reservoir portion, wherein the first cavity is configured to form a portion of a first optical component and the second cavity is configured to form a portion of a second optical component .

20 . The mold of claim 19 , wherein the substrate comprises any one of a glass substrate , a polymer substrate , a lead frame , and a semiconductor substrate .