WO2025011344A1 - Optical module - Google Patents

Abstract

An optical module (10), comprising a PCB (11), a light-emitting module (12) and a first light-shaping module (13), wherein the light-emitting module (12) comprises at least two base blocks (121) and at least one chip (122); each base block (121) is directly fixed to the PCB (11); the chip (122) and the base blocks (121) are spaced apart from each other; two sides of each chip (122) are clamped by the base blocks (121); the light-emergent direction of the light-emitting module (12) is not parallel to a plane where the PCB (11) is located; there is at least one light-emitting module (12); and the first light-shaping module (13) is fixed on the light-emergent side of the light-emitting module (12) and is used for performing shaping processing on a light ray emerging from the light-emitting module (12). By means of providing the light-shaping module (13) and the light-emitting module (12) on the same substrate, the impact of the PCB (11) on the light-shaping module (13) is reduced and the light-emergent direction of the light-emitting module (12) is not parallel to the plane where the PCB (11) is located, thereby reducing optical index changes caused by relative displacement between the light-emitting module (12) and the light-shaping module (13) at high and low temperatures.

Description

An optical module Technical Field

The present invention relates to the field of lasers, and in particular to an optical module.

Background Art

In the current technological context, the application demand for lasers is increasing, especially in some specific fields, such as optical communications, laser medical treatment and lithography, which have higher requirements for the stability and accuracy of lasers. In high or low temperature environments, the thermal expansion coefficients of different materials may be different, which will cause changes in stress and deformation between the light source module and the light shaping module. These stresses and deformations will cause relative displacement between the light source module and the light shaping module, thereby affecting the stability and accuracy of optical indicators.

In addition, the supporting structures of the light source module and the light shaping module are asymmetric, which means that they may differ in shape and size. Such irregularities may be caused by factors such as processing errors during the manufacturing process, inaccurate assembly, or differences in material properties. Due to the asymmetry of the supporting structures, the light source module and the light shaping module may experience stress and deformation at different temperatures.

During temperature changes, due to the asymmetry of the supporting structure, the thermal expansion or contraction between different components may be unevenly transmitted to the entire structure. This will cause different stress distributions and deformations inside the structure. Especially in the case of rapid temperature changes or large temperature differences, this stress and deformation inhomogeneity may be more significant. The stress and deformation caused by the special shape of the supporting structure further increase the relative displacement between the light source module and the light shaping module. This relative displacement may cause a mismatch between the light source and the optical module, disrupting the transmission and shaping process of the optical signal. In addition, the relative displacement may also cause the optical element to shift or tilt, further affecting the focusing performance and wavelength stability of the light beam.

Summary of the invention

In order to solve the above technical problems, the embodiment of the present invention is expected to provide an optical module, by The shape module and the light source are arranged in the same plane, thereby reducing the relative displacement between the two and ensuring the stability of the optical indicators.

The technical solution of the present invention is achieved in this way:

An embodiment of the present invention provides an optical module, the optical module includes a PCB board, a light emitting module and a first light shaping module, the light emitting module includes at least two substrate blocks and at least one chip, the substrate block is directly fixed to the PCB board, the chip and the substrate block are arranged at intervals, both sides of each chip are clamped by the substrate blocks, the light emitting direction of the light emitting module is not parallel to the plane where the PCB board is located, and the number of the light emitting module is at least one; the first light shaping module is fixed to the light emitting side of the light emitting module, and is used for shaping the light emitted by the light emitting module.

Preferably, the first light shaping module includes a first support structure and a first lens, wherein the first support structure is arranged on both sides of the light emitting module and supports the first lens on the light emitting path of the light emitting module, so that the first lens is fixed in relative position to the light emitting surface of the chip and receives the emitted light of the chip. The first support structure arranged on both sides of the light emitting module can securely fix the first lens on the light emitting side of the light emitting module, and the first lens is located in the same optical axis as the light beam emitted by the corresponding chip, and the relative positions of the two are fixed, so as to prevent the directivity of the light emitted by the light emitting module and the stability of the divergence angle from being affected in the case of deformation caused by inconsistent thermal matching coefficients between the chip and the PCB board.

Preferably, the first light shaping module is fixed to the light emitting module in a manner that the first supporting structure clamps the two outermost substrate blocks of the light emitting module. Fixing the shaping module directly to the light emitting module can further reduce the relative displacement between the two caused by PCB board deformation and other reasons.

Preferably, the optical module further comprises a second light shaping module, the second light shaping module comprises a second supporting structure and a second lens, and the second light shaping module is configured such that the second supporting structure supports the second lens so that the second lens shapes all light passing through the first light shaping module.

Preferably, the second light shaping module is fixed to the first light shaping module in a manner that the second supporting structure clamps the first supporting structure. Directly fixing the second light shaping module to the first light shaping module can reduce the relative displacement caused by the relative movement of the two light shaping modules, thereby further reducing the relative displacement with the light source.

Preferably, the light emitting direction of the light emitting module is perpendicular to the plane where the PCB board is located. By configuring the light emitting module perpendicular to the PCB board, the occupied area of the light emitting module on the PCB board can be reduced, and the flexibility of PCB board layout and routing is improved.

Preferably, the chip is an edge-emitting laser chip. The edge-emitting laser chip has high power density and high pulse peak power. When the light-emitting module includes multiple chips, an edge-emitting laser stack can be formed to flexibly configure the power of the light-emitting module. In addition, by selecting an edge-emitting laser chip, the existing edge-emitting laser chip light shaping solution can be reused, directly replacing the existing edge-emitting laser as a light source of similar products.

Preferably, through grooves are provided on the PCB board below the chip and/or on both sides of the chip, and the internal stress of the PCB board can be reduced through the configuration of the through grooves.

Preferably, the substrate block is constructed into a multi-layer structure, wherein the two outermost layers of the substrate block are copper layers, and the middle layer is a molybdenum-copper layer or a molybdenum layer, thereby reducing the CTE coefficient difference between the chip and the substrate block and reducing stress.

In the optical module, the light-emitting module is directly mounted on the PCB board, and the light-shaping module and the light-emitting module are symmetrically located on the same substrate, which can reduce the stress of the light-shaping module and the light source at high and low temperatures, and the displacement generated during the overall deformation is the same-direction displacement, which generates a small relative displacement, ensures that the relative position is fixed, thereby preventing the directivity and divergence angle of the light-emitting module from being affected. At the same time, the structural selection of the PCB board in the optical module is more free, and there is no need to consider the installation and matching issues of the structure required by the light-emitting module, thereby reducing the influence of the PCB board structure on the light-emitting module structure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of an optical module 10 according to an embodiment of the present invention;

FIG2 is a schematic diagram of an optical module 10 according to another embodiment of the present invention;

FIG3 is a schematic diagram of an optical module 20 according to another embodiment of the present invention;

FIG4 is a schematic diagram of an optical module 30 according to another embodiment of the present invention;

FIG5 is a schematic diagram of an optical module 40 according to another embodiment of the present invention;

FIG6 is a schematic diagram of an optical module 50 according to another embodiment of the present invention;

FIG7 is a schematic diagram of an optical module 10 according to another embodiment of the present invention;

FIG. 8 is a schematic structural diagram of a substrate block of an optical module according to an embodiment of the present invention.

DETAILED DESCRIPTION

The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

In the current technical context, the CTE mismatch between the light source module and the light shaping module and the irregular shape of the supporting structure of the light source module and the light shaping module are key challenges in existing laser technology. These problems lead to certain stresses and deformations in high and low temperature environments, which increase the relative displacement between the light source and the optical module, and then lead to significant changes in optical indicators, which is particularly prominent in the use requirements of some specific fields, such as the automotive lidar field.

In the field of automotive LiDAR, the performance and stability of the laser are crucial to achieving high-precision target detection and tracking. However, since vehicles work in different environments, the temperature changes greatly, and the CTE mismatch between the light source module and the light shaping module and the irregular shape of the supporting structure pose challenges to the stability and accuracy of the laser. In a high-temperature environment, the CTE mismatch between the light source module and the light shaping module may lead to stress accumulation and increased deformation between optical components, thereby causing changes in optical indicators. On the contrary, in a low-temperature environment, due to CTE mismatch, the relative displacement between the light source module and the light shaping module may increase, thereby affecting the focusing performance and wavelength stability of the laser beam. These changes may cause the detection distance, resolution and accuracy of the automotive LiDAR system to be affected significantly, making it unable to meet the requirements of high-precision target detection and tracking.

For example, in the prior art, the laser light source is arranged at the edge of the PCB, that is, the light emitting direction of the light source is parallel to the PCB, and the optical component is arranged on the light emitting side of the laser light source. Under high and low temperature conditions, due to the deformation of the PCB, the light source produces a displacement of Δd relative to the optical component (for example, fast axis collimation). Assuming that the focal length of the optical component is f, the pointing angle of the light spot in the fast axis direction will be deflected by an angle θ, and the relationship is shown in the following formula: tan(θ)=△d/f, so that the optical indicators of the entire laser module do not meet actual needs.

In addition, with the above structure, even if the laser light source and the optical components are fixed by bonding or bonding, Connected to the PCB, the above packaging methods all have problems due to the bottom circuit board and/or mechanical structure. The thermal expansion coefficients of the laser light source chip and the optical components are different. During the temperature cycle, alternating stress will be generated, causing deformation of the circuit board and/or mechanical structure, thereby causing relative displacement and/or rotation between the chip and the optical components, which reduces the reliability of the chip and causes the risk of cracking and detachment of the glue between the optical components and the mechanical structure. In addition, due to the relative displacement between the chip and the optical components, the divergence angle or directivity of the entire optical module does not meet actual needs.

In order to solve the above technical problems, an embodiment of the present invention provides an optical module, the optical module includes a PCB board, a light-emitting module and a light-shaping module, the light-shaping module includes a first light-shaping module, and the laser light emitted by the light-emitting module is shaped into a light spot by the light-shaping module. The light-emitting module is directly mounted on the PCB board, so that the light-shaping module and the light-emitting module are on the same substrate, thereby reducing the change of optical indicators caused by the relative displacement between the light-emitting module and the light-shaping module under high and low temperatures. Compared with the structure in the prior art in which the light source is mounted on the edge of the PCB and the optical shaping module is mounted on other structural parts, the optical module can reduce the stress of the light-shaping module and the light source under high and low temperatures, and the displacement generated during the overall deformation is the same direction displacement, resulting in a smaller relative displacement, thereby ensuring the stability of the directivity and divergence angle of the light-emitting module. At the same time, the PCB structure of this proposal is more freely selected. Since it is not mounted at the edge of the PCB board, it is not necessary to consider the installation of the structure required for the light-emitting module and the CTE matching problem between the light-shaping modules, thereby reducing the influence of the PCB structure on the structure of the light-emitting module.

Referring to FIG. 1 , an optical module 10 according to an embodiment of the present invention is shown, and the optical module 10 includes a PCB board 11, a light emitting module 12, and a first light shaping module 13. The PCB board 11 is made of insulating material, and a conductive path is printed on the surface thereof for supporting and connecting electronic components. The light emitting module 12 is directly mounted on the PCB board 11 and electrically connected to the conductive path to receive current and generate laser light when excited. The light emitting module 12 is electrically connected to the PCB board 11 by direct fixing, thereby reducing the conductive path and effectively reducing electrical parasitics.

The light emitting module 12 includes at least two substrate blocks 121 and at least one chip 122. The chip 122 is an edge emitting laser chip. The edge emitting laser chip has high power density and high pulse peak power. When the light emitting module includes multiple chips, an edge emitting laser stack can be formed to flexibly configure the power of the light emitting module. In addition, by selecting an edge emitting laser chip, the existing edge emitting laser can be reused. The chip light shaping solution directly replaces the existing edge-emitting laser as a light source of similar products. The substrate block 121 is directly fixed on the PCB board 11 by welding or bonding, and the substrate block 121 is firmly fixed on the PCB board 11 by a simple process. The substrate block 121 and the chip 122 are fixedly electrically connected by welding or conductive adhesive bonding or direct support. Referring to Figure 1, the light-emitting module 12 includes two substrate blocks 121 and a chip 122. The substrate block 121 is directly fixed on the PCB board 11. The substrate block 121 and the printed circuit board on the PCB are electrically connected by the above-mentioned fixing method to supply power to the chip 122 and drive the chip 122 to emit light. The chip 122 and the substrate block 121 are arranged at intervals, and the chip 122 is arranged between the two substrate blocks 121. At the same time, the substrate block 121 is fixedly connected to the side of the chip 122, so that the upper two sides of the chip 122 are clamped and fixed by the two substrate blocks 121. The substrate block 121 is directly connected to the circuit on the PCB board 11 to form a current path. Under the above configuration, the substrate blocks 121 arranged on both sides of the chip 122 serve as the positive and negative electrodes of the chip 122, providing power connection for the chip 122. The substrate block 121 holds the chip 122 by clamping, so that the plane where the chip 122 is located is at an angle with the plane where the PCB board 11 is located. It should be noted that "at an angle" here means that the plane where the chip 122 is located and the plane where the PCB board 11 is located have an angle of 0°-180° (excluding 0° and 180°). It can be understood that the purpose of the above "the plane where the chip 122 is located is at an angle with the plane where the PCB board 11 is located" is to make the light emitting direction of the chip 122 non-parallel to the plane where the PCB board 111 is located. Referring to Figure 1, in the configuration of the optical module 10 shown in Figure 1, the emitting light direction of the light emitting module 12 is shown by the arrow P in the figure, wherein the two substrate blocks 121 are at an angle of 90° with the PCB board 11, and the chip 122 is maintained perpendicular to the PCB board 11, so that the light emitting direction of the chip 122 is perpendicular to the plane where the PCB board 111 is located. The plane where the chip 122 is located is preferably perpendicular to the plane where the PCB board is located. Under this configuration, the freedom of the PCB design can be expanded to the greatest extent, and the assembly of the light-emitting module and the light shaping module is also simpler. In addition, the vertically emitted light is also easier to control.

In order to solve the technical problem that the relative displacement between the light source and the optical module 10 is large, thereby causing a large change in the divergence angle, the present invention arranges all the light shaping modules and the light emitting module 12 on the same substrate, that is, the light shaping modules and the light emitting module 12 are both arranged on the PCB board 11. In this configuration, when the PCB board 11 is deformed, the displacements of the light-emitting module 12 and the light-shaping module are in the same direction, thereby reducing the relative displacement and ensuring the stability of the optical index. In another embodiment of the present invention, referring to FIG8, the first light-shaping module 13 is arranged on the light-emitting path of the light-emitting module 12, and the first light-shaping module 13 is arranged on the PCB board. In this configuration, the first light-emitting module and the light-emitting chip are arranged on the same board plane. When the PCB board is subjected to stress or deformation, the above configuration can reduce the relative displacement between the light-emitting module 12 and the first light-shaping module 13, ensuring the stability of the directivity and divergence angle of the light-emitting module 12. Further, when the PCB board undergoes a greater bending deformation, the light-emitting module 12 is in a more central position than the first light-shaping module 13, so the relative position change between the light-emitting module 12 and the first light-shaping module 13 may affect the stability of its divergence angle. Referring to FIG. 1 , the first light shaping module 13 is disposed above the light emitting module 12 and is used to shape the outgoing light of the light emitting module 12 to achieve light shaping. The light shaping module can select lenses or other optical shaping elements of various structures to focus the light to a specific area or point. Compared with the configuration shown in FIG. 8 , the configuration shown in FIG. 1 further reduces the relative displacement between the first light shaping module 13 and the light emitting module 12, ensures the alignment between the light source and the light shaping device, and prevents the divergence angle of the light emitting module 12 from changing.

The first light shaping module 13 includes a first supporting structure 131 and a first lens 132. The first supporting structure 131 is used to support the first lens 132 above the light emitting module 12, so that the first lens 132 is on the light emitting path of the light emitting module, and the first lens 132 is fixed relative to the light emitting surface of the light emitting module 12. Under this configuration, the outgoing light of the light emitting module 12 can completely pass through the first lens 132, and the first light shaping module 13 and the light emitting module 12 are symmetrical structures. In FIG. 1 , the first support structure 131 is fixed on the two outermost substrate blocks 121 of the light emitting module 12. A first lens 132 fixed relative to the light emitting surface of the chip 122 is fixed on the top of the first support structure 131. Specifically, the first support structure 131 includes two first support members, which are directly fixed to the two outermost substrate blocks 121 of the light emitting module 12 in a non-conductive manner. The two first support members and the two substrate blocks 121 are symmetrical structures, thereby further avoiding the influence of the deformation of the PCB board 11 on the chip 122. The first light shaping module 13 is directly fixed to the light emitting module 12 through the first support structure 131, so that The relative displacement between the first lens 132 and the light emitting module 12 is zero, thereby reducing the relative displacement between the light emitting module 12 and the light shaping module, and fixing their relative positions. In another embodiment of the present invention, the first light shaping module 13 only includes the first lens, and the first lens is directly fixed to the light emitting surface of the light emitting module 12 by bonding, thereby reducing the overall volume of the light shaping module, simplifying the volume of each component on the PCB board, expanding the degree of freedom of PCB board layout design, and reducing mechanical clearance, further ensuring that the relative position of the first lens and the chip is fixed.

The optical module 10 further includes a second light shaping module 14. Specifically, referring to FIG. 1 , the first light shaping module 13 and the second light shaping module 14 are combined into a light shaping module. The light shaping module is arranged above the light emitting module 12 and is used to shape the outgoing light of the light emitting module 12 to achieve light shaping. The light shaping module can select lenses or other optical shaping elements of various structures to focus the light to a specific area or point. After the outgoing light passes through the first light shaping module 13, it moves along the direction after shaping and enters the second light shaping module 14. The second light shaping module 14 includes a second support structure 141 and a second lens 142. The second support structure 141 includes two second support members. The second lens 142 is used to shape all the light. The two second support members are arranged on the outside of the first light shaping module 13. Here, "outside" is relative to the light emitting module 12 located on the inside of the two first support members. In the above configuration, the second supporting structure 141 is arranged above the light-emitting module 12, so that the second lens 142 can cover all the light shaped by the first lens 132. The second light shaping module 14 has the same configuration as the first light shaping module 13, and both support the lens through the supporting structure.

The outgoing light first passes through the first lens 132, and then enters and passes through the second lens 142 to form a light spot. The first lens 132 is fixed to the substrate block 121 through the first supporting structure 131. Therefore, in the solution of the present invention, in order to further reduce the relative displacement between the light source and the optical shaping lens, the optical element with high optical sensitivity can be directly connected to the electrode, thereby further reducing the change in optical indicators caused by the relative displacement between the light source and the optical shaping lens. To ensure the light shaping effect and quality of highly sensitive elements, illustratively, the first lens 132 is a fast-axis collimating lens, and the second lens 142 is a slow-axis collimating lens. The fast-axis collimating lens is more sensitive to alignment with the light source than the slow-axis collimating lens. Setting the fast-axis collimating lens at the position of the first lens 132 can ensure that the collimation effect of the fast-axis collimating lens is not affected. ring.

Based on the above content, fixing the first light shaping module 13 to the light emitting module 12 can further reduce the relative displacement between the first lens 132 and the light source. Based on this concept, referring to FIG2, fixing the second light shaping module 14 to the first light shaping module 13 can further reduce the relative displacement between the overall light shaping module and the light source, thereby further improving the quality of the light spot. Exemplarily, the first support structure 131 includes two first support rods, and the second support structure 141 includes two second support rods. The two first support rods are respectively fixed to the two outermost substrate blocks 121 of the light emitting module 12 by insulating materials or non-conductive methods such as bonding, and the two second support rods are respectively fixed to the two first support rods by bonding or other methods. Under the above configuration, the first lens 132 and the second lens 142 are both fixed relative to the light emitting surface of the chip 122 in the light emitting module 12.

In the optical module of the present invention, the number of the light-emitting modules is at least one, and the multiple light-emitting modules are jointly stimulated to emit light to meet the needs of different irradiation surfaces, thereby increasing the spot size. The light-emitting modules can be modularized into multiple modules, thereby improving the design and simple expansibility of the optical module. The multiple light-emitting modules can be independently controlled or integrated on the PCB board, thereby realizing flexible adjustment and expansion of system functions and performance. For example, referring to FIG3, an optical module 20 of another embodiment of the present invention is shown, and the optical module 20 includes a PCB board 21, three light-emitting modules 22, three first light shaping modules 23 and a second light shaping module 24. It should be noted that in the present invention, the first light shaping module 23 is used to directly shape the emitted light of the light-emitting module 22, so a separate first light shaping module 23 is arranged on the top of each separate light-emitting module 22, for example, to perform collimation processing, and the second light shaping module 24 is used to shape the light corrected by the first light shaping module 23, for example, to perform homogenization processing. Only embodiments requiring two different shaping requirements are listed here. Those skilled in the art can understand that the light shaping module can be flexibly arranged according to different optical system requirements.

In the present invention, the light emitting module includes at least two substrate blocks and at least one chip. By increasing the number of substrate blocks and chips in the light emitting module, the power of the light emitting module can be increased. Referring to FIG. 4, an optical module 30 according to another embodiment of the present invention is shown. The number of substrate blocks 321 is 4, the number of chips 322 is 3, and the substrate blocks 321 and the chips 322 are arranged at intervals so that both sides of each chip 322 are clamped by two substrate blocks 321. In this example, the light emitting module is used to shape the light emitting module. The number of the first light shaping module 33 for blocking the outgoing light is one.

In all the above optical modules, by directly fixing the light emitting module on the PCB board, and its light emitting direction is not parallel to the plane where the PCB is located, the light shaping module can reduce the change of optical index caused by the relative displacement between the light emitting module and the light shaping module under high and low temperature conditions. Under high and low temperature conditions, the PCB board will deform and generate stress, and the large difference in CTE coefficient between the substrate block and the PCB board will also cause stress. The above-mentioned stress will cause the light emission angle of the light emitting module to change. Based on this, the present invention proposes an optical module 40 of another embodiment, wherein a groove is partially opened on the PCB board 41, referring to Figure 5, the groove is arranged on both sides of the light emitting module 42, and the groove is arranged at the bottom thereof to help release stress, thereby reducing the deformation degree of the light emitting module 42. In addition, the grooves arranged on both sides of the light emitting module 42 can reduce the stress of the entire light shaping module and the installation area of the light emitting module 42 and the PCB board 41, thereby reducing the change of optical index caused by deformation under high and low temperature conditions. Exemplarily, the groove may also be provided directly below the chip 422 to further reduce the influence of stress on the PCB board 41 on the light emitting angle of the chip 422 ; the groove may also be provided on both sides of the second supporting structure 441 .

When the substrate block is fixed to the PCB board by welding with bottom bonding, the vertical surface of the substrate block is required to have good flatness and verticality, and it will also cause mutual stress between the substrate block and the PCB board. Therefore, the substrate block is constructed as an insert type. Referring to Figure 6, it shows an optical module 50 of another embodiment proposed by the present invention. The substrate block 521 is inserted into the PCB board 51 and is welded and fixed by welding on both sides and/or spot welding on the bottom as shown by the arrows in the figure, thereby reducing the requirements for the flatness and verticality of the substrate block 521. The above welding process can simplify the operation process and facilitate mass production, and at the same time avoid the phenomenon of short circuit between the two substrate blocks 521 after welding. Preferably, the use of soft solder can further reduce the stress between the substrate block 521 and the PCB board 51.

In another embodiment of the present invention, the substrate block is made of a multilayer structure. Referring to FIG. 7 , the substrate block is constructed of three layers of material. Preferably, the outermost two layers of the substrate block are made of copper, and the middle layer is made of molybdenum copper, which has high electrical conductivity and high thermal conductivity. The molybdenum copper material is a pseudo alloy composed of two immiscible metal phases in structure, which has the characteristics of both constituent metals and can complement each other to obtain good comprehensive performance. The outermost layer of the substrate block with a multilayer configuration is a copper layer, and the transient state of the chip Heat can be effectively released in the copper layer, which is better than the copper-tungsten structure, so it can reduce the junction temperature and increase the power. In addition, the multi-layer substrate block has a CTE close to that of the chip, so no cracks will be generated during bonding with the chip.

It should be noted that the technical solutions described in the embodiments of the present invention can be combined arbitrarily without conflict.

The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims (10)

An optical module, comprising a PCB board, a light-emitting module and a first light shaping module, characterized in that: The light emitting module comprises at least two substrate blocks and at least one chip, wherein the substrate blocks are directly fixed to the PCB board, the chip and the substrate blocks are arranged at intervals, and both sides of each chip are clamped by the substrate blocks, the light emitting direction of the light emitting module is not parallel to the plane where the PCB board is located, and the number of the light emitting module is at least one; The first light shaping module is fixed on the light emitting side of the light emitting module, and is used to shape the light emitted by the light emitting module. The optical module according to claim 1 is characterized in that the first light shaping module includes a first supporting structure and a first lens, and the first supporting structure is arranged on both sides of the light emitting module and supports the first lens on the light emitting path of the light emitting module, so that the first lens is fixed in relative position to the light emitting surface of the chip and receives the output light of the chip. The optical module according to claim 2, characterized in that the first light shaping module is fixed to the light emitting module in a manner that the first supporting structure clamps the two outermost substrate blocks of the light emitting module. The optical module according to claim 2 or 3, characterized in that the optical module further comprises a second light shaping module, the second light shaping module comprises a second supporting structure and a second lens, and the second light shaping module is configured such that the second supporting structure supports the second lens so that the second lens shapes all light passing through the first light shaping module. The optical module according to claim 4, characterized in that the second light shaping module is fixed to the first light shaping module in a manner that the second supporting structure clamps the first supporting structure. The optical module according to claim 1, characterized in that the light emitting direction of the light emitting module is perpendicular to the plane where the PCB board is located. The optical module according to claim 1, characterized in that the chip is an edge-emitting laser chip. The optical module according to claim 1, characterized in that through grooves are formed on the PCB board below the chip and/or on both sides of the chip. The optical module according to claim 1, characterized in that the substrate block is constructed into a multi-layer structure. The optical module according to claim 9 is characterized in that the substrate block is constructed with two outermost layers being copper layers and the middle layer being a molybdenum-copper layer or a molybdenum layer.