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WO2025009948A1 - Dispositif de sonde - Google Patents

Dispositif de sonde Download PDF

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Publication number
WO2025009948A1
WO2025009948A1 PCT/KR2024/095240 KR2024095240W WO2025009948A1 WO 2025009948 A1 WO2025009948 A1 WO 2025009948A1 KR 2024095240 W KR2024095240 W KR 2024095240W WO 2025009948 A1 WO2025009948 A1 WO 2025009948A1
Authority
WO
WIPO (PCT)
Prior art keywords
contact
slot
probe pin
probe
contact portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/KR2024/095240
Other languages
English (en)
Korean (ko)
Inventor
이용구
이맹열
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WITHWAVE CO Ltd
Original Assignee
WITHWAVE CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WITHWAVE CO Ltd filed Critical WITHWAVE CO Ltd
Priority to CN202480000451.7A priority Critical patent/CN119563112A/zh
Publication of WO2025009948A1 publication Critical patent/WO2025009948A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes

Definitions

  • the present invention relates to a probe device, and more specifically, to a probe device in which the upper contact portion of a probe pin that contacts a terminal of an electronic component and the lower contact portion of the probe pin that contacts a terminal of a substrate do not influence each other in terms of contact force, so that the upper contact portion and the lower contact portion of the probe pin can operate independently.
  • a probe device In the manufacturing process of electronic components, a probe device is used to test the electrical characteristics of the electronic components.
  • the probe device is a device that electrically connects the electronic components and the substrate that operates the electronic components to test the electrical characteristics of the electronic components.
  • the probe pin of the probe device has one end in contact with a terminal of an electronic component and the other end in contact with a terminal of a board. In order to achieve stable electrical contact, one end of the probe pin is pressed to a certain level by contacting the terminal of the electronic component, and the other end of the probe pin is pressed to a certain level by contacting the terminal of the board.
  • Probe pins of various structures have been proposed to improve terminal contact with the probe pins of the probe device.
  • Korean Patent Registration No. 2152230 presents a technology for a probe pin and an inspection unit using the same, and Fig. 1 illustrates the probe pin presented in the above-mentioned prior art.
  • a first contact point (11) is provided on one side of the probe pin (10), and a second contact point (12) is provided on the other side.
  • the movable pin (20) of the probe pin (10) is configured with a first curved portion (21), a straight portion (22), and a second curved portion (23) that are successively and repeatedly formed.
  • a zigzag-shaped elastic portion is configured at the end of the probe pin (10).
  • This contact force does not simply affect the probe pin (10), but there is a problem in that the combined contact force applied to the first contact point (11) and the second contact point (12) affects the electronic components and the substrate that come into contact with the probe pin (10).
  • the contact resistance for the first contact (11) and the contact resistance for the second contact (12) of the probe pin (10) must be lowered to enable more accurate testing of electronic components, and the contact resistance for the entire probe pin (10) can be reduced by controlling the contact resistance by adjusting the contact force applied to each contact.
  • the contact force for the first contact (11) and the contact force for the second contact (12) of the probe pin (10) influence each other, there is a problem that the contact resistance of each contact cannot be easily controlled, and this makes it difficult to adjust the overall contact resistance of the probe pin (10) to an optimal level.
  • the present invention has been made to solve the problems of the prior art as described above, and proposes a technology in which each contact point of a probe pin can operate independently by applying a structure in which the contact force generated when a probe pin comes into contact with an electronic component and the contact force generated when a probe pin comes into contact with a substrate do not affect each other.
  • the contact resistance of each contact point must be reduced to enable more accurate testing of electronic components.
  • the contact force of each contact point affects each other, the contact resistance of each contact point cannot be easily controlled, and thus it is difficult to adjust the overall contact resistance of the probe pin to an optimal level. This is an attempt to solve this problem.
  • One embodiment of a probe device comprises: a probe pin including an upper contact portion, a lower contact portion, and a contact force control portion connecting the upper contact portion and the lower contact portion; and a guide block on which the probe pin is secured and supported, and which supports the contact force control portion while providing a deformable bending space with respect to upper and lower portions of the contact force control portion, wherein transmission of contact force between the upper contact portion and the lower contact portion of the probe pin is blocked through the guide block, so that the upper contact portion and the lower contact portion of the probe pin are independently operated, thereby controlling contact resistance of the upper contact portion and the lower contact portion.
  • the upper contact portion may have one end that contacts a terminal of an electronic component
  • the lower contact portion may have one end that contacts a terminal of a substrate
  • the contact force control portion may have an upper portion that is bent and connected to the other side of the upper contact portion to impart elasticity
  • a lower portion that is bent and connected to the other side of the lower contact portion to impart elasticity
  • a bending portion that is bent between the upper portion and the lower portion
  • the guide block may include a body portion that includes an upper region that provides an upper bending space so that the upper portion of the contact force control portion can be deformed, a lower region that provides a lower bending space so that the lower portion of the contact force control portion can be deformed, and a support region into which the bending portion of the contact force control portion is fitted and fixed.
  • a part of the side surface of the guide block supporting the contact force control portion of the probe pin may be inserted, and a support block may be further included that comes into contact with at least a part of the outer surface of the contact force control portion to limit movement.
  • the guide block may include an upper slot portion having an upper slot that extends to the upper portion of the body portion and has an insertion space into which a part of the upper contact portion of the probe pin is inserted and supported; and a lower slot portion having a lower slot that extends to the lower portion of the body portion and has an insertion space into which a part of the lower contact portion of the probe pin is inserted and supported.
  • the contact force control portion of the probe pin may include an upper portion bent in the width direction from the upper contact portion, a lower portion bent in the width direction from the lower contact portion, and a bending portion bent in the width direction between the upper portion and the lower portion and connected to the upper portion and the lower portion, and an upper slot of the upper slot portion and a lower slot of the lower slot portion may be provided with a slot space having one open side and a width corresponding to the thickness length of the probe pin and a depth corresponding to the width length of the probe pin.
  • the contact force control portion of the probe pin may include an upper portion bent in the thickness direction from the upper contact portion, a lower portion bent in the thickness direction from the lower contact portion, and a bending portion bent in the thickness direction between the upper portion and the lower portion and connected to the upper portion and the lower portion, and an upper slot of the upper slot portion and a lower slot of the lower slot portion may be provided with a slot space having one open side and a width corresponding to the width length of the probe pin and a depth corresponding to the thickness length of the probe pin.
  • the guide block may be provided with an intermediate slot extending from an upper slot of the upper slot portion and a lower slot of the lower slot portion in the upper region, the lower region, and the support region, and the upper bending space and the lower bending space may be provided inside the intermediate slot.
  • the upper slot portion may have a first upper slot on one side, a second upper slot on the other side spaced apart from the first upper slot and opposite
  • the lower slot portion may have a first lower slot on one side, a second lower slot on the other side spaced apart from the first lower slot and opposite
  • a plurality of probe pins may be mounted facing each other on both sides of the guide block, wherein upper contact portions of the probe pins facing each other may be spaced apart from each other by the first distance, and lower contact portions of the probe pins facing each other may be spaced apart from each other by the second distance.
  • the lower slot portion of the guide block can control the amount of movement of the lower contact portion end of the probe pin according to the contact pressure with the terminal of the substrate by adjusting at least one of the size of the insertion space of the lower slot or the size of the lower bending space of the guide block.
  • it further includes a floating plate provided with a guide hole corresponding to an upper contact end of the probe pin and arranged on an upper portion of the probe pin, and by adjusting at least one of the size or position of the guide hole or the size of the lower bending space of the guide block, the amount of movement of the upper contact end of the probe pin according to the contact pressure with the terminal of the electronic component can be controlled.
  • each contact point of the probe pin can be operated independently by applying a structure in which the contact force generated when the probe pin comes into contact with an electronic component and the contact force generated when the probe pin comes into contact with a substrate do not affect each other.
  • the degree to which the probe device comes into contact with and pressurizes the electronic component and the substrate can be easily and independently controlled.
  • the upper and lower contacts can be operated independently, making it easy to control the contact resistance of the upper and lower contacts, thereby adjusting the overall contact resistance of the probe pin to an optimal level, enabling more accurate testing of electronic components.
  • Figure 1 illustrates a probe pin according to the prior art.
  • FIGS. 2 to 4 illustrate one embodiment of a probe device according to the present invention.
  • FIGS 5 to 7 illustrate one embodiment of a probe pin assembly in the present invention.
  • FIGS 8 to 11 illustrate the operation of one embodiment of a probe device according to the present invention.
  • Figures 12 to 14 illustrate an example of independently operating the upper contact portion and the lower contact portion in one embodiment of a probe device according to the present invention.
  • Figure 15 shows the results of testing contact resistance according to the contact force of each contact point.
  • FIGS 16 to 18 illustrate another embodiment of the probe pin assembly in the present invention.
  • FIGS. 19 and 20 illustrate another embodiment of the probe pin assembly in the present invention.
  • FIGS. 21 and 22 illustrate another embodiment of a probe pin assembly according to the present invention.
  • FIG. 23 illustrates another embodiment of a probe pin assembly according to the present invention.
  • the present invention is a probe device for testing electrical characteristics of electronic components, wherein the probe device adopts a structure in which contact forces between an upper contact portion of a probe pin that contacts a terminal of an electronic component and a lower contact portion of the probe pin that contacts a terminal of a substrate do not affect each other, thereby enabling the upper contact portion and the lower contact portion of the probe pin to operate independently.
  • FIGS. 2 to 4 illustrate one embodiment of a probe device according to the present invention.
  • the probe device (100) may include a probe pin assembly (200), a support block (110), a floating plate (130), an upper cover (140), etc.
  • the probe pin assembly (200) can be configured by mounting a probe pin (250) on a guide block (210).
  • the probe device (100) is an example for testing an electronic component with terminals arranged in two rows
  • the probe pin assembly (200) can be configured in a form in which probe pins (250) are mounted on the left and right sides of the guide block (210) corresponding to the terminal arrangement on the left and right sides of the electronic component.
  • the support block (110) is provided with a support space (111) into which parts of both sides of the probe pin assembly (200) are inserted, and a part of the side of the probe pin assembly (200) is inserted into the support space (111) of the support block (110) so that the support block (110) and the probe pin assembly (200) can be fastened.
  • the probe pin (250) of the probe pin assembly (200) can come into contact with the inner wall of the support space (111) of the support block (110).
  • the support block (110) restricts movement of the probe pin (250) according to the contact force, which will be described in detail through examples below.
  • the support block (110) may be composed of a first support block (110a) and a second support block (110b) corresponding to the left and right sides of the probe pin assembly (200).
  • the probe pin assembly (200) may be positioned in the center, and the first support block (110a) and the second support block (110b) may be coupled to each other on the left and right sides, so that the support block (110) and the probe pin assembly (200) may be fastened.
  • the first support block (110a) and the second support block (110b) may be provided with a fastening protrusion (115) and a fastening groove (117) on their sides so that they may be fastened to each other correspondingly.
  • An upper cover (140) is placed on the upper part of the support block (110), and a floating plate (130) can be placed on the upper part of the probe pin assembly (200) between the upper cover (140) and the support block (110).
  • the upper cover (140) may be provided with a through hole (141) into which a part of the floating plate (130) can be inserted.
  • the floating plate (130) is fastened to the through hole (141) of the upper cover (140) and can be lowered by an external force or raised to the height of the upper cover (140) by the elastic force of the elastic member (150).
  • a guide hole (131) may be formed in the floating plate (130) corresponding to the upper contact portion of the probe pin (250). As the floating plate (130) descends, the guide hole (131) guides the upper contact portion of the probe pin (250) so that the end of the upper contact portion of the probe pin (250) may be exposed to the outside.
  • the guide hole (131) of the floating plate (130) may be variously modified corresponding to the number and size of the probe pins (250) of the probe pin assembly (200) and their positions.
  • the floating plate (130) can be lowered by being pressed by an electronic component to be tested by the probe device (100). As the floating plate (130) is lowered, the probe pin (250) of the probe pin assembly (200) can come into contact with the terminal of the electronic component through the guide hole (131) of the floating plate (130).
  • the floating plate (130) can be restored to its position by the elastic force of the elastic member (150).
  • the elastic member (150) can have one side connected to the lower surface of the floating plate (130) and the other side connected to the support block (110).
  • An elastic member fastening portion (not shown) into which one side of the elastic member (150) is inserted and fastened is provided on the lower surface of the floating plate (130), and an elastic member mounting hole (113) into which the other side of the elastic member (150) is inserted can be provided on the support block (110).
  • the floating plate (130) When an electronic component to be tested is placed on a floating plate (130), the floating plate (130) is pushed downward by pressure from the electronic component and an external force is applied to the elastic member (150), and when the electronic component is removed from the floating plate (130), the floating plate (130) can be pushed upward by the restoring force of the elastic member (150).
  • a catch (135) that comes into contact with the upper cover (140) may be provided on the outer periphery of the floating plate (130).
  • the catch (135) of the floating plate (130) comes into contact with the lower surface of the area around the through hole (141) of the upper cover (140), thereby limiting the rise of the floating plate (130), so that the rising position of the floating plate (130) can be maintained.
  • FIGS. 5 to 7 illustrate an embodiment of a probe pin assembly in the present invention. Referring to FIGS. 5 to 7, the probe pin assembly (200) will be examined in more detail.
  • the probe pin (250) may include an upper contact portion (251), a lower contact portion (253), and a contact force control portion (255).
  • the upper contact portion (251) is vertically erected so that one end can come into contact with a terminal of an electronic component.
  • the lower contact portion (253) is vertically erected so that one end can come into contact with a terminal of a substrate.
  • the contact force control unit (255) can connect the upper contact unit (251) and the lower contact unit (253).
  • the contact force control unit (255) can include an upper portion (256), a bending portion (257), and a lower portion (258).
  • the upper portion (256) of the contact force control portion (255) extends from the other end of the upper contact portion (251) and can be bent outwardly to provide elasticity to the upper contact portion (251). For example, when the upper contact portion (251) is lowered by an external force, the upper portion (256) of the contact force control portion (255) bends downward and provides elasticity, and when the external force applied to the upper contact portion (251) is removed, the upper portion (256) of the contact force control portion (255) rises upward as a restoring force and pushes the upper contact portion (251), so that the position of the upper contact portion (251) can be restored.
  • the lower portion (258) of the contact force control portion (255) extends from the other end of the lower contact portion (253) and can be bent outwardly to provide elasticity to the lower contact portion (253). For example, when the lower contact portion (253) is raised by an external force, the lower portion (258) of the contact force control portion (255) bends upward to provide elasticity, and when the external force applied to the lower contact portion (253) is removed, the lower portion (258) of the contact force control portion (255) moves downward as a restoring force to push the lower contact portion (253), so that the position of the lower contact portion (253) can be restored.
  • the bending portion (257) of the contact force control unit (255) has one side connected to the upper portion (256) and bent downward, and the other side connected to the lower portion (258) and bent upward, and can connect between the upper portion (256) and the lower portion (258).
  • the probe pin (250) is formed in a shape in which the upper portion (256), the bending portion (257), and the lower portion (258) of the contact force control portion (255) are bent in the thickness direction.
  • the guide block (210) on which the probe pin (250) is mounted may include a body part (220), an upper slot part (230), a lower slot part (240), etc.
  • the body part (220), the upper slot part (230), and the lower slot part (240) may be combined as separate individual components to manufacture the guide block (210), or may be formed integrally to manufacture as one block.
  • the body part (220) may include an upper region (221), a support region (222), a lower region (223), etc.
  • the present embodiment is an example in which probe pins (250) are arranged in two rows facing each other, and correspondingly, an upper region (221), a support region (222), and a lower region (223) may be provided on each of the left and right sides of the body part (220) of the guide block (210).
  • the upper region (221) of the body portion (220) can provide an upper bending space (224) so that the upper portion (256) of the contact force control portion (255) of the probe pin (250) can be deformed.
  • the upper contact portion (251) of the probe pin (250) is pressed, the upper portion (256) of the contact force control portion (255) is pushed downward and deformed in a bending shape, and a curved sunken space can be formed in the upper region (221) of the body portion (220), and the sunken space can be provided as an upper bending space (224).
  • the upper region (221) of the body portion (220) may be provided with an upper bending space (224) whose depth decreases from the upper slot portion (230) to the support region (222).
  • the lower region (223) of the body portion (220) can provide a lower bending space (225) so that the lower portion (258) of the contact force control portion (255) of the probe pin (250) can be deformed.
  • the lower contact portion (253) of the probe pin (250) is pressed, the lower portion (258) of the contact force control portion (255) is pushed upward and deformed in a bending shape, and a curved sunken space can be formed in the lower region (223) of the body portion (220), and the sunken space can be provided as the lower bending space (225).
  • the lower region (223) of the body portion (220) may be provided with a lower bending space (225) whose depth decreases from the lower slot portion (240) to the support region (222).
  • the support area (222) of the body part (220) can support by fixing the bending portion (257) of the contact force control portion (255) of the probe pin (250).
  • the support area (222) of the body part (220) is formed with a thickness corresponding to the bending portion (257) of the contact force control portion (255) of the probe pin (250), so that the contact force control portion (255) of the probe pin (250) can be inserted and fitted into the support area (222) of the body part (220).
  • the upper slot portion (230) extends upward from the upper surface of the body portion (220) and may be formed with a height corresponding to the length of the upper contact portion (251) of the probe pin (250).
  • the upper slot portion (230) may be formed with a height lower than the length of the upper contact portion (251) of the probe pin (250) so that the upper contact portion (251) of the probe pin (250) may be exposed to the outside through the guide hole (131) of the floating plate (130).
  • the height of the upper slot portion (230) may be adjusted to control the degree to which the upper contact portion (251) of the probe pin (250) is pushed and moved in one direction while making contact with the terminal of the electronic component.
  • the lower slot portion (240) extends downward from the lower end of the body portion (220), and the height of the lower slot portion (240) can be adjusted so that the lower contact portion (253) of the probe pin (250) can contact the terminal of the substrate.
  • the lower slot portion (240) can be formed with a height lower than the length of the lower contact portion (253) of the probe pin (250) so that the lower contact portion (253) of the probe pin (250) can contact the terminal of the substrate and be sufficiently scribed.
  • the height of the lower slot portion (240) can be adjusted to control the degree to which the lower contact portion (253) of the probe pin (250) is pushed and moved in one direction while making contact with the terminal of the substrate.
  • the upper slot portion (230) may be provided with an upper slot (237) into which a part of the upper contact portion (251) of the probe pin (250) is inserted and supported on both left and right sides.
  • the lower slot portion (240) may be provided with a lower slot (247) into which a part of the lower contact portion (253) of the probe pin (250) is inserted and supported on both left and right sides.
  • a middle slot (227) may be provided across the upper region (221), the support region (222), and the lower region (223) of the body part (220).
  • the upper slot (237), the middle slot (227), and the lower slot (247) are formed as open spaces on one side and can be connected to each other.
  • the probe pin (250) can be inserted and mounted in the thickness direction on the upper slot (237), the middle slot (227), and the lower slot (247) provided in the guide block (210). That is, the probe pin (250) can be mounted in a form in which the thickness direction is inserted into the slot of the guide block (210) and the width direction surface is exposed.
  • the upper slot (237) and the lower slot (247) may be formed as slot spaces having a width corresponding to the width of the probe pin (250) and a depth corresponding to the thickness of the probe pin (250).
  • an insertion space may be formed with a width that is longer by a set length than the width of the probe pin (250) and a depth that is longer by a set length than the thickness of the probe pin (250).
  • the middle or lower portion of the upper contact portion (251) of the probe pin (250) may be inserted into the upper slot (237) of the upper slot portion (230).
  • the width-wise bending deformation of the upper contact portion (251) of the probe pin (250) may be limited by the upper slot (237).
  • the thickness-wise backward bending deformation of the upper contact portion (251) of the probe pin (250) may be limited by the upper slot (237).
  • the middle or upper portion of the lower contact portion (253) of the probe pin (250) may be inserted into the lower slot (247) of the lower slot portion (240).
  • the widthwise bending deformation of the lower contact portion (253) of the probe pin (250) may be limited by the lower slot (247).
  • the thicknesswise backward bending deformation of the lower contact portion (253) of the probe pin (250) may be limited by the lower slot (247).
  • the contact force control unit (255) of the probe pin (250) may be inserted into the middle slot (227) of the body part (220).
  • the upper bending space (224) and the lower bending space (225) of the body part (220) described above may be provided inside the middle slot (227). That is, the middle slot (227) provided in the upper region (221) of the body part (220) may be formed as a curved sunken space corresponding to the shape in which the upper portion (256) of the contact force control unit (255) of the probe pin (250) is pushed downward and bent.
  • the middle slot (227) provided in the lower region (223) of the body part (220) may be formed as a curved sunken space corresponding to the shape in which the lower portion (258) of the contact force control unit (255) of the probe pin (250) is pushed upward and bent.
  • the middle slot (227) provided in the support area (222) of the body part (220) can have its width and depth adjusted so that the bending portion (257) of the contact force control portion (255) of the probe pin (250) can be inserted and fixed in a forced fit manner.
  • the probe device according to the present invention has a mutual contact force between the upper contact portion and the lower contact portion, so that the upper contact portion and the lower contact portion of the probe pin can operate independently.
  • the operation of the probe device according to the present invention will be described through examples.
  • FIGS. 8 to 13 illustrate the operation of one embodiment of a probe device according to the present invention.
  • An electronic component (P) whose electrical characteristics are to be tested is placed on a floating plate (130) of a probe device (100), and the floating plate (130) is lowered downward by an external force applied by the electronic component (P).
  • the upper contact portion (251) of the probe pin (250) passes through the guide hole (131) of the floating plate (130) and is exposed to the outside, so that the end of the upper contact portion (251) can come into contact with the terminal (CT) of the electronic component (P).
  • the upper portion (256) of the contact force control portion (255) of the probe pin (250) is bent and deformed on the upper bending space (224) provided in the upper region (221) of the body portion (220) of the guide block (210).
  • the bending deformation of the upper portion (256) of the contact force control portion (255) of the probe pin (250) changes in response to the contact force applied to the upper contact portion (251).
  • the contact force according to the external force applied to the upper contact portion (251) of the probe pin (250) appears as a bending deformation of the upper portion (256) of the contact force control portion (255) of the probe pin (250), and since the movement of the bending portion (257) is restricted by the guide block (210) and the support block (110), the contact force of the upper contact portion (251) is not transmitted to the lower contact portion (253).
  • the scribe can be controlled by controlling the amount of movement of the upper contact portion (251) with respect to the terminal (CT) of the electronic component (P), and this will be described with reference to (c) of the above-described FIG. 8.
  • FIG. 8 is an enlarged view of the position A1 of the upper contact portion (251) of the probe pin (250) in (a) of the above Fig. 8 and the position B1 of the upper contact portion (251) of the probe pin (250) in (b) of the above Fig. 8.
  • the upper contact portion (251) of the probe pin (250) comes into contact with the terminal (CT) of the electronic component (P) and is pressed, it is pushed to a certain degree and moves, thereby generating a scribe, thereby further improving the contact reliability between the upper contact portion (251) and the terminal (CT).
  • the amount of movement of the tip of the upper contact portion (251) of the probe pin (250) by adjusting the size or position of the guide hole (131) provided in the floating plate (130), the amount of scribe generated by the upper contact portion (251) coming into contact with the terminal (CT) of the electronic component (P) can be controlled.
  • the amount of movement L1 of the end of the upper contact portion (251) can be controlled by adjusting the hole size of the guide hole (131), and accordingly, the scribe generated when the upper contact portion (251) comes into contact with the terminal (CT) of the electronic component (P) can be controlled.
  • the scribe generated when the upper contact portion (251) comes into contact with the terminal (CT) of the electronic component (P) can also be controlled by adjusting the position of the guide hole (131) based on the vertical extension line of the probe pin (250) to the upper contact portion (251).
  • the contact resistance of the upper contact portion (251) can be more easily controlled.
  • the contact resistance of the upper contact portion (251) can be controlled to a desired level.
  • the probe device (100) is mounted on a substrate that drives an electronic component, so that the lower contact portion (253) of the probe pin (250) comes into contact with the terminal (ST) of the substrate (S). An external force applied by the substrate is transmitted to the lower contact portion (253) of the probe pin (250), so that the lower contact portion (253) of the probe pin (250) can be pressed upward.
  • the lower portion (258) of the contact force control portion (255) of the probe pin (250) is bent and deformed on the lower bending space (225) provided in the lower region (223) of the body portion (220) of the guide block (210).
  • the bending deformation of the lower portion (258) of the contact force control portion (255) of the probe pin (250) changes in response to the contact force applied to the lower contact portion (253).
  • the contact force according to the external force applied to the lower contact portion (253) of the probe pin (250) appears as a bending deformation of the lower portion (258) of the contact force control portion (255) of the probe pin (250), and since the movement of the bending portion (257) is restricted by the guide block (210) and the support block (110), the contact force of the lower contact portion (253) is not transmitted to the upper contact portion (251).
  • the scribe can be controlled by controlling the amount of movement of the lower contact portion (253) with respect to the terminal (ST) of the substrate (S), and this will be described with reference to (c) of the above-described FIG. 10.
  • FIG. 10 is an enlarged view of the position A2 of the lower contact portion (253) of the probe pin (250) in (a) of the above Fig. 10 and the position B2 of the lower contact portion (253) of the probe pin (250) in (b) of the above Fig. 10.
  • the lower contact portion (253) of the probe pin (250) comes into contact with the terminal (ST) of the substrate (S) and is pressed, it is pushed to a certain degree and moves, thereby generating a scribe, thereby further improving the contact reliability between the lower contact portion (253) and the terminal (ST).
  • the amount of movement of the end of the lower contact portion (253) of the probe pin (250) can be controlled, thereby controlling the amount of scribe generated when the lower contact portion (253) comes into contact with the terminal (ST) of the substrate (S).
  • the range of movement of the end of the lower contact portion (253) may vary in proportion to the size of the lower slot (247) of the lower slot portion (240), and the range of movement of the end of the lower contact portion (253) may vary in proportion to the degree to which the lower contact portion (253) is inserted into the lower bending space (225) of the guide block (210). Therefore, in the present invention, the amount of movement L2 of the end of the lower contact portion (253) can be controlled by adjusting the size of the lower slot (247) or the size of the lower bending space (225) of the guide block (210), and accordingly, the scribe generated when the lower contact portion (253) comes into contact with the terminal (ST) of the substrate (S) can be adjusted.
  • the contact resistance of the lower contact portion (253) can be more easily controlled.
  • the present invention adopts a structure in which the contact force of the upper contact part (251) and the contact force of the lower contact part (253) do not affect each other, so that the contact force of the upper contact part (251) and the contact force of the lower contact part (253) can be controlled differently by independently operating the upper contact part (251) and the lower contact part (253).
  • the scribing degree can be controlled by controlling the amount of movement of the end of the upper contact part (251) and the amount of movement of the end of the lower contact part (253).
  • the contact resistance of each contact can be easily controlled by adjusting the contact force and scribing of the upper contact part (251) and the lower contact part (253).
  • the contact resistance according to the contact with the terminal of the electronic component can be easily controlled.
  • FIGS. 12 to 14 illustrate an example of independently operating the upper contact portion (251) and the lower contact portion (253) of the probe pin (250) in the probe device (100).
  • the probe device (100) according to the present invention was mounted on a substrate (S), and the lower contact portion (253) of the probe pin (250) was brought into contact with the terminal (ST) of the substrate (S) and gradually pressurized, thereby controlling the contact force according to an external force of the magnitude F1. Then, while maintaining the contact force of the lower contact portion (253), an electronic component (P) was mounted on the upper portion of the probe device (100), and the upper contact portion (251) of the probe pin (250) was brought into contact with the terminal (CT) of the electronic component (P) and gradually pressurized, thereby controlling the contact force according to an external force of the magnitude F2 in various different cases. As described above, the contact force of the lower contact portion (253) and the contact force of the upper contact portion (215) were controlled, thereby testing the contact force for the contact portion of the probe device (100).
  • T1 is a time period during which an external force of magnitude F1 is applied to the lower contact portion (253) of the probe pin (250) in the probe device (100) to operate the lower contact portion (253)
  • T2 is a time period during which an external force of magnitude F2 is applied to the upper contact portion (251) of the probe pin (250) while the contact force of the lower contact portion (253) of the probe pin (250) is maintained to operate the upper contact portion (251).
  • Force-B represents a reaction force against the lower contact portion (253) of the probe pin (250)
  • Force-T represents a reaction force against the upper contact portion (251) of the probe pin (250).
  • Figure 14 (a) shows the case where F1 and F2 are the same size
  • Figure 14 (b) shows the case where F1 is larger than F2
  • Figure 14 (c) shows the case where F2 is larger than F1.
  • the lower contact portion (253) of the probe pin (250) is brought into contact with the terminal (ST) of the substrate (S) and an external force is applied up to F1, the contact force of the lower contact portion (253) of the probe pin (250) increases, but the contact force of the lower contact portion (253) is not transmitted to the upper contact portion (251) of the probe pin (250).
  • the upper contact part (251) of the probe pin (250) is brought into contact with the terminal (CT) of the electronic component (P) and an external force is applied up to F2.
  • the contact force for the upper contact part (251) of the probe pin (250) increases, but is not transmitted to the lower contact part (253) of the probe pin (250), so the contact force for the lower contact part (253) of the probe pin (250) remains at F1.
  • the probe device (100) according to the present invention maintains the contact force of the lower contact part (253) without changing even when the contact force of the upper contact part (251) is variously adjusted, so that the contact force of the upper contact part can be adjusted by changing the external force applied to the upper contact part (251) according to various required situations.
  • the probe device (100) according to the present invention adopts a structure in which the contact force between the upper contact portion of the probe pin that contacts the terminal of the electronic component and the lower contact portion of the probe pin that contacts the terminal of the board does not affect each other, thereby controlling the external force applied to the lower contact portion of the probe pin and the external force applied to the upper contact portion of the probe pin differently, so that the upper contact portion and the lower contact portion of the probe pin can operate independently.
  • Figure 15 shows the results of testing contact resistance according to the contact force of each contact point.
  • the probe device according to the present invention can maintain a certain level of contact force by providing sufficient contact force to the lower contact point, and even if the contact force of the upper contact point is gradually changed, the contact force of the lower contact point can be maintained constant without change.
  • the probe device In contrast, looking at (b) of the above-described Fig. 15, the probe device according to the prior art applies a certain level of contact force to the lower contact point, and then, as the contact force is applied to the upper contact point, the contact force of the upper contact point is transmitted to the lower contact point, so that the contact force of the lower contact point also increases.
  • the contact force of the lower contact point since the contact force of the lower contact point is transmitted to the upper contact point at the start point of applying the contact force to the upper contact point, it can be seen that the contact force of the upper contact point increases rapidly for a certain period of time while the contact force of the lower contact point is reflected to the upper contact point.
  • the present invention sufficient contact force can be applied to the lower contact first before applying contact force to the upper contact, so that the contact resistance of each contact can be easily controlled by adjusting the contact force.
  • the contact force between the upper contact and the lower contact is transmitted to each other, there is a problem in that the contact force of each contact cannot be easily adjusted to a desired level. Accordingly, the contact resistance according to the contact force of each contact cannot be controlled to a level suitable for the conditions.
  • the graph (c) of the above Fig. 15 shows the results of measuring the total contact resistance of the probe pin for the upper and lower contacts by setting the time point at which contact force begins to be applied to the upper contact point in the above Fig. 15 (a) and Fig. 15 (b) as time 0.
  • the contact force of the lower contact affects the upper contact, so the contact force of the upper contact increases rapidly from the time the terminal of the electronic component is brought into contact with the upper contact.
  • the contact force of the lower contact does not affect the upper contact, so only the external force applied to the upper contact is reflected as the contact force of the upper contact. Accordingly, it can be seen that the contact resistance of the prior art is lower than the contact resistance of the present invention in the initial certain time range.
  • the contact force of each contact point cannot be individually controlled, so the overall contact resistance cannot be controlled.
  • the contact force of each contact point can be individually controlled to control the overall contact resistance to a desired level, so that the contact resistance can be further reduced or the contact resistance can be maintained at a required level depending on the situation.
  • the degree to which the probe device comes into contact with and is pressurized by the electronic component and the substrate can be easily and independently designed to control the contact resistance of the upper and lower contact parts.
  • the support blocks (110) are coupled to both sides of the probe pin assembly (200) so that the probe pin (250) comes into contact with the inner wall of the support space (111) of the support block (110) and its movement is restricted.
  • the support blocks (110) may be omitted and the movement of the probe pin (250) may be restricted by only the probe pin assembly (200), thereby independently operating the upper and lower contact portions of the probe pin (250).
  • the contact force control portion (255) of the probe pin (250) may be inserted in a force-fit manner, thereby restricting the movement of the contact force control portion (255) of the probe pin (250) by the middle slot (227), thereby independently operating the upper and lower contact portions of the probe pin (250).
  • the probe device according to the present invention can be modified in various ways. Hereinafter, various modified examples of the probe device according to the present invention will be examined.
  • FIGS 16 to 18 illustrate another embodiment of the probe pin assembly in the present invention.
  • the probe pin (350) can be modified in various ways, and the guide block (310) can also be modified accordingly.
  • the probe pin (350) is in a form that is bent in the width direction, such that the upper portion (356) of the contact force control portion (355) can be bent in the width direction from the end of the upper contact portion (351), and the lower portion (358) of the contact force control portion (355) can be bent in the width direction from the end of the lower contact portion (353).
  • the bending portion (357) of the contact force control portion (355) can be bent in the width direction from each of the upper portion (356) and the lower portion (358) of the contact force control portion (355) to connect the upper portion (356) and the lower portion (358).
  • the upper slot (337), middle slot (327) and lower slot (347) provided in the body portion (320), upper slot portion (330) and lower slot portion (340) of the guide block (310) may also be modified to correspond to the shape of the probe pin (350).
  • a probe pin (350) can be inserted and mounted in the width direction in the guide block (310).
  • the upper slot (337) of the upper slot portion (330) and the lower slot (347) of the lower slot portion (340) can be formed as slot spaces having a width corresponding to the thickness length of the probe pin (350) and a depth corresponding to the width length of the probe pin (350).
  • a contact force control unit (355) of a probe pin (350) is inserted into the middle slot (327) of the body part (320), and an upper bending space (324) and a lower bending space (325) can be formed as corresponding sunken spaces in the middle slot (327) provided in the upper region (321) of the body part (320) and the middle slot (327) provided in the lower region (323) of the body part (320) so that the probe pin (350) can be bent and deformed in the width direction.
  • the middle slot (327) provided in the support area (322) of the body part (320) can be formed as a space having a width corresponding to the thickness of the probe pin (350) and a depth corresponding to the width of the probe pin (350) so that the bending part (357) of the contact force control part (355) of the probe pin (350) can be inserted and fixed in a forced fit manner.
  • the probe pins may be mounted with the probe pins arranged in the width direction or may be mounted with the probe pins arranged in the length direction.
  • FIGS. 19 and 20 illustrate another embodiment of the probe pin assembly in the present invention.
  • the guide block (410) of the probe pin assembly (400) can be modified in various ways, and this embodiment is an example in which a slot into which a probe pin (450) is inserted and mounted is selectively formed in the guide block (410).
  • the guide block (410) on which the probe pin (450) is mounted may include a body part (420), an upper slot part (430), a lower slot part (440), etc.
  • the upper slot portion (430) may be provided with an upper slot (437) into which a part of the upper contact portion of the probe pin (450) is inserted and supported, and the lower slot portion (440) may be provided with a lower slot (447) into which a part of the lower contact portion of the probe pin (450) is inserted and supported.
  • the body part (420) may not be provided with a slot into which a probe pin (450) is inserted.
  • the upper region (421) of the body portion (420) can provide an upper bending space (424) so that the upper portion (456) of the contact force control portion of the probe pin (450) can be deformed.
  • the upper bending space (424) can be formed in the entire region where the upper portion (456) of the contact force control portion (455) of the probe pin (450) is arranged in the upper region (421) of the body portion (420).
  • the upper bending space (424) of the upper region (421) of the body portion (420) can be provided in a form in which the depth thereof gradually decreases from the upper slot portion (430) toward the support region (427).
  • a lower bending space (425) may be provided in the lower region (423) of the body portion (420) so that the lower portion (458) of the contact force control portion of the probe pin (450) can be deformed.
  • the lower bending space (425) may be formed in the entire region where the lower portion (458) of the contact force control portion of the probe pin (450) is arranged in the lower region (423) of the body portion (420).
  • the lower bending space (425) of the lower region (423) of the body portion (420) may be provided in a form in which the depth thereof gradually decreases from the lower slot portion (440) toward the support region (427).
  • the support area (422) of the body part (420) is not provided with a separate slot, and is formed with a thickness corresponding to the bending portion of the contact force control part of the probe pin (450), so that the contact force control part of the probe pin (450) can be inserted and fitted onto the surface of the support area (422) of the body part (420).
  • Space Transformer is a technology that converts the distance between narrow terminals into a wide one to connect them.
  • FIGS. 21 and 22 illustrate an embodiment of a probe pin assembly according to the present invention.
  • the probe pin assembly (500) is an example of applying the configuration of the space transformer to the embodiment of FIG. 5 described above, but is not limited thereto, and the configuration of the space transformer can be applied to other embodiments described above.
  • upper slots (537a, 537b) are provided on each of the left and right sides of the upper slot portion (530) of the guide block (510), and a first separation distance (UD) may be formed between the upper slots (537a, 537b) on the left and right sides.
  • lower slots (547a, 547b) are provided on each of the left and right sides of the lower slot portion (540) of the guide block (510), and a second separation distance (DD) may be formed between the lower slots (547a, 547b) on the left and right sides.
  • first upper slot (537a) and the second upper slot (537b) may be formed with a first separation distance (UD) so as to have a separation distance corresponding to the spacing between terminal rows of an electronic component having two rows of terminals.
  • first lower slot (547a) and the second lower slot (547b) may be formed with a second separation distance (DD) so as to have a separation distance corresponding to the spacing between the terminal rows of the substrate.
  • the first separation distance (UD) between the upper slots (537a, 537b) may be a relatively narrow distance corresponding to the narrow distance between the terminal rows of the electronic component
  • the second separation distance (DD) between the lower slots (547a, 547b) may be spaced at a sufficiently wide distance so as to facilitate the design and manufacture of the substrate.
  • the two rows of probe pins (550) are mounted opposite each other on the guide block (510), so that the upper contact point separation distance and the lower contact point separation distance between the rows of probe pins (550) can be adjusted differently from each other.
  • the upper contact portion (551a) of the first row probe pin may be inserted and seated in the first upper slot (537a) of the upper slot portion (530), and the upper contact portion (551b) of the second row probe pin may be inserted and seated in the second upper slot (537b).
  • the upper contact portions (551a, 551b) of the probe pins seated in the first upper slot (537a) and the second upper slot (537b) of the upper slot portion (530) may be spaced apart from each other by a first separation distance (UD).
  • the lower contact portion (553a) of the first row probe pin may be inserted and seated in the first lower slot (547a) of the lower slot portion (540), and the lower contact portion (553b) of the second row probe pin may be inserted and seated in the second lower slot (547b).
  • the lower contact portions (553a, 553b) of the probe pins seated in the first lower slot (547a) and the second lower slot (547b) of the lower slot portion (540) may be spaced apart from each other by a second separation distance (DD).
  • a space transformer can be achieved by implementing a lower contact point by expanding the upper contact point corresponding to the narrow gap between the terminal rows of the electronic component to the wide gap between the terminal rows of the substrate through the probe pin assembly (500) according to the present invention.
  • the embodiments of the probe device according to the present invention described above have been described as having a structure corresponding to an electronic component in which terminals are arranged in two arrays on the left and right sides, but the probe device according to the present invention can be modified in various ways depending on the shape of the electronic component and the terminal arrangement.
  • FIG. 23 illustrates another embodiment of a probe pin assembly according to the present invention.
  • This embodiment illustrates a probe pin assembly applied to a probe device for testing electronic components having terminals in four directions: forward, backward, left, and right.
  • the guide block (610) may have an upper slot portion (630) protruded upwardly from the center at a predetermined distance from the front, back, left, and right outer peripheries of the upper surface of the body portion (620), and a lower slot portion (640) protruded downwardly from the center at a predetermined distance from the front, back, left, and right outer peripheries of the rear surface of the body portion (620).
  • slots in which probe pins (650) are mounted can be provided in each of the four directions of the front, back, left, and right of the guide block (610), and the probe pins (650) can be mounted on the slots provided in each direction.
  • This embodiment of the above-described Fig. 23 can be modified by applying various embodiments described above.
  • the above-described embodiment 19 can be applied to selectively form a slot, or the above-described embodiment of the above-described Fig. 21 can be applied to implement a space transformer.
  • each contact point of the probe pin can be operated independently by applying a structure in which the contact force generated when the probe pin comes into contact with an electronic component and the contact force generated when the probe pin comes into contact with a substrate do not affect each other.
  • the degree to which the probe device contacts and presses the electronic component and the substrate can be easily and independently controlled. Through the independent operation of each of these contact points, the contact resistance can be easily controlled.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)

Abstract

L'invention concerne un dispositif de sonde dont la structure permet aux forces élastiques d'une partie de contact supérieure d'une broche de sonde en contact avec une borne d'un composant électronique et d'une partie de contact inférieure de la broche de sonde en contact avec une borne d'un substrat de ne pas s'influencer mutuellement, ce qui permet à la partie de contact supérieure et à la partie de contact inférieure de la broche de sonde de fonctionner indépendamment l'une de l'autre.
PCT/KR2024/095240 2023-07-03 2024-02-15 Dispositif de sonde Pending WO2025009948A1 (fr)

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KR102743913B1 (ko) * 2023-09-26 2024-12-19 주식회사 메카텍시스템즈 반도체 집적회로 테스트 수율 향상을 위한 소켓 장치
KR102792330B1 (ko) * 2023-11-22 2025-04-08 주식회사 엔티에스 핀블록 조립체 및 이를 포함하는 테스트 소켓

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