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WO2025004320A1 - Module photoélectrique - Google Patents

Module photoélectrique Download PDF

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Publication number
WO2025004320A1
WO2025004320A1 PCT/JP2023/024370 JP2023024370W WO2025004320A1 WO 2025004320 A1 WO2025004320 A1 WO 2025004320A1 JP 2023024370 W JP2023024370 W JP 2023024370W WO 2025004320 A1 WO2025004320 A1 WO 2025004320A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical
wiring board
circuit chip
optical fiber
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2023/024370
Other languages
English (en)
Japanese (ja)
Inventor
芳行 土居
雅之 高橋
清史 菊池
貴 山田
祥吾 山中
悠介 那須
茂昭 関口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NTT Inc
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to PCT/JP2023/024370 priority Critical patent/WO2025004320A1/fr
Publication of WO2025004320A1 publication Critical patent/WO2025004320A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

  • the present invention relates to an opto-electrical module.
  • Non-Patent Documents 1 and 2 Non-Patent Documents 1 and 2. To make this CPO compact, it is necessary to ensure the quality of the optical fiber and optical connections inside the module.
  • Non-Patent Document 1 there is a CPO that includes an electrical IC that combines a digital signal processing circuit chip (Fig. 4 XSR, TRX, CDR), a driver, and a transimpedance amplifier, and a silicon photonics chip (Fig. 4 Si-Photonic IC).
  • This CPO includes multiple silicon photonics chips, as shown in Fig. 6(a) and Fig. 7 in Non-Patent Document 1, and optical fibers for optical input/output are required for each of these silicon photonics chips.
  • the optoelectronic module includes a wiring board 301, an optical circuit chip 302, an electronic circuit chip 303, electronic components 304, an optical fiber 305, and a housing 306.
  • the optical circuit chip 302, the electronic circuit chip 303, and the electronic components 304 are mounted on the wiring board 301. A part of the optical circuit chip 302 protrudes outside the wiring board 301 in a plan view.
  • the optical circuit chip 302 includes an optical transmitter that is composed of an optical modulator, an optical waveguide, a splitter, an optical attenuator, etc., and an optical receiver that is composed of a photodiode, an optical waveguide, an optical attenuator, etc.
  • a signal from the electronic circuit chip 303 is input to the optical transmitter via the wiring board 301, and the optical circuit chip 302 includes a terminal 307 for outputting a received signal from the optical receiver to the TIA of the electronic circuit chip 303.
  • the optical transmitter of the optical circuit chip 302 often uses a traveling-wave electrode Mach-Zehnder modulator (MZM). In conventional technology, it is mounted face-down using a flip chip, and the transmission signal input terminal group, reception signal output terminal group, and MZM electrodes of the optical circuit chip 302 are arranged on the bottom surface of the optical circuit chip 302 (the surface facing the wiring board 301).
  • MZM traveling-wave electrode Mach-Zehnder modulator
  • the electronic circuit chip 303 includes a digital signal processing circuit (DSP), a driver circuit (DRV), and a transimpedance amplifier circuit (TIA). These may be implemented as individual chips, but this example shows them integrated into the electronic circuit chip 303.
  • DSP digital signal processing circuit
  • DRV driver circuit
  • TIA transimpedance amplifier circuit
  • the electronic circuit chip 303 generally has terminals 308 for multiple transmit signal outputs and receive signal inputs on the line side (i.e., the side that outputs signals to the optical transmitter and the side that receives signals from the optical receiver).
  • a digital signal processing circuit chip based on the 400GBASE-DR4 standard has 4 lanes x 8 positive/negative transmit signal output terminals and receive signal input terminals.
  • the electronic components 304 are a group of components necessary for driving the optical circuit chip 302 and the electronic circuit chip 303, and may be capacitors, inductors, resistors, etc.
  • the electronic components 304 may also be a control microcomputer, an AD converter, a DA converter, an electric switch, etc.
  • the wiring board 301 is a build-up board that uses resin as a base material, and can have a multi-layer wiring structure of about 10 layers.
  • Intra-board wiring 309 is formed in each layer of the wiring board 301 and between the layers, and input and output of electrical signals are performed with the outside via input and output electrical terminals 310.
  • the housing 306 surrounds the optical circuit chip 302 and the electronic circuit chip 303 and is fixed to the wiring board 301 to prevent dust from adhering to each chip.
  • the housing 306 also fixes the optical fiber extraction section 312, which will be described later.
  • the housing 306 can be made of, for example, aluminum, stainless steel, copper, etc.
  • the optical fibers 305 are connected to the optical circuit chip 302 for optical input and output.
  • the optical fibers 305 can be arranged in an array of multiple fibers. In the case of 400GBASE-DR4, a minimum of eight optical fibers 305 are required: four for transmission and four for reception. Furthermore, when continuous light for optical transmission is supplied from an external source, at least one more optical fiber is added to these.
  • the optical fibers 305 arranged in an array of multiple fibers are usually fixed to each other with adhesive or a coating using a method called taping or ribbonizing.
  • the optical fibers can be made of quartz glass, plastic, etc.
  • the optical fiber 305 is fixed to one end of the optical circuit chip 302 by a fixing part 311.
  • a fixing part 311 protrudes below the bottom surface of the optical circuit chip 302. Therefore, to prevent interference (contact) between the bottom of the fixing part 311 and the wiring board 301, the end of the optical circuit chip 302 to which the fixing part 311 is fixed protrudes outside the wiring board 301 in a plan view.
  • the fixing part 311 is made of a glass material different from that of the optical fiber 305, and serves to increase the connection strength between the optical fiber 305 and the optical circuit chip 302.
  • the optical fiber 305 also makes an optical connection to the outside of the housing 306 via an optical fiber extraction part 312 installed in the housing 306.
  • the optical fiber extraction part 312 is made of a resin molded part called a boot, which has a through hole for passing the optical fiber 305 through.
  • the optical fiber 305 and the fixed part 311 are connected to the center of the end face of the optical circuit chip 302 using an optically transparent adhesive.
  • the optical fiber 305 is extended horizontally in the optical axis direction to the outside of the housing 306 (module).
  • miniaturizing the module is an important technical issue, and in order to further miniaturize the module (housing 306), it is important to reduce the size of the housing 306 to a size close to that of the wiring board 301. For this reason, it is required to narrow the distance between the fixed part 311 fixed to the optical circuit chip 302 mounted protruding from the wiring board 301 and the optical fiber extraction part 312.
  • the optical fiber 305 between the fixed part 311 and the optical fiber extraction section 312 can bend significantly due to buckling.
  • the optical fiber 305 where such a large bend occurs there are locations where the bending radius is small, and in these locations, as is well known, optical loss within the optical fiber 305 increases. Furthermore, in locations where the bending radius is small, the optical fiber 305 may break.
  • the bending state of the optical fiber 305 described above is determined by the optical axis direction distance (bending length) between each end of the fixed part 311 and the optical fiber extraction part 312, and the height direction distance (bending height) of the housing 306 as viewed from the mounting surface side of the wiring board 301. If the bending radius R of the bent part, determined by the bending length and bending height, becomes smaller than the radius that can guarantee the quality of the optical fiber 305, the leakage of propagating light from the core of the optical fiber 305 or microcracks caused by bending will cause characteristic degradation such as increased loss and increased polarization extinction ratio. Furthermore, if mechanical loads such as stress concentration or vibration and shock are applied or environmental loads are applied, the optical fiber 305 will break and lose its function as an opto-electrical module.
  • a structure such as a constriction 341 may be provided on the exterior of the housing 306' as shown in FIG. 9.
  • the fixing parts 311a, 311b are connected to the optical circuit chips 302a, 302b at positions offset to the inside of the end faces rather than to the center of the end faces. For this reason, the optical fibers 305a, 305b are bent in the optical axis direction in a plan view to reach the optical fiber extraction parts 312a, 312b.
  • the conventional technology had the problem that the optical fiber between the optical circuit chip and the optical fiber extraction section in the module was prone to deterioration of characteristics and breakage.
  • the present invention was made to solve the above problems, and aims to prevent deterioration of the optical fiber characteristics and breakage between the optical circuit chip and the optical fiber extraction section inside the module.
  • the optoelectronic module comprises a housing, a main wiring board accommodated in the housing, a sub-wiring board connected on the main wiring board inside the housing, an optical circuit chip mounted on the sub-wiring board inside the housing, an optical fiber optically connected to an optical input/output end on a side end face of the optical circuit chip, a fixing part for fixing the optical fiber to the optical input/output end, an optical fiber extraction section fixed to the side of the housing facing the optical input/output end for extracting the optical fiber to the outside of the housing, and a protective film removal region in which the protective film on the outermost surface of the main wiring board between the optical circuit chip and the optical fiber extraction section has been removed, and the optical circuit chip is mounted on the sub-wiring board with the optical input/output end side protruding beyond the sub-wiring board.
  • the optoelectronic module comprises a housing, a main wiring board accommodated in the housing, a sub-wiring board connected on the main wiring board inside the housing, an optical circuit chip mounted on the sub-wiring board inside the housing, an optical fiber optically connected to an optical input/output end on a side end face of the optical circuit chip, a fixing part for fixing the optical fiber to the optical input/output end, an optical fiber extraction section fixed to the side of the housing facing the optical input/output end for extracting the optical fiber to the outside of the housing, and a wiring removal region in which the wiring layer on the outermost surface of the main wiring board between the optical circuit chip and the optical fiber extraction section has been removed, and the optical circuit chip is mounted on the sub-wiring board with the optical input/output end side protruding beyond the sub-wiring board.
  • the optoelectronic module comprises a housing, a main wiring board accommodated in the housing, an optical circuit chip mounted on the main wiring board inside the housing, an optical fiber optically connected to an optical input/output end on a side end face of the optical circuit chip, a fixing part for fixing the optical fiber to the optical input/output end, an optical fiber extraction section fixed to the side of the housing facing the optical input/output end for extracting the optical fiber to the outside of the housing, and a recess formed in the main wiring board between the optical circuit chip and the optical fiber extraction section, and the optical circuit chip is mounted on the main wiring board with the optical input/output end side protruding from the main wiring board.
  • an optical circuit chip is mounted on a sub-wiring board connected on a main wiring board, and a protective film removal area or wiring removal area is further provided, so that deterioration of the characteristics and breakage of the optical fiber between the optical circuit chip and the optical fiber extraction section in the module can be suppressed.
  • a recess is formed in the main wiring board between the optical circuit chip and the optical fiber extraction section, so that deterioration of the characteristics and breakage of the optical fiber between the optical circuit chip and the optical fiber extraction section in the module can be suppressed.
  • FIG. 1A is a plan view showing an internal configuration of an opto-electric module according to a first embodiment of the present invention.
  • FIG. 1B is a cross-sectional view showing the configuration of an opto-electric module according to the first embodiment of the present invention.
  • FIG. 2A is a plan view showing an internal configuration of an opto-electric module according to a second embodiment of the present invention.
  • FIG. 2B is a cross-sectional view showing the configuration of an opto-electric module according to the second embodiment of the present invention.
  • FIG. 3A is a plan view showing a partial configuration of the opto-electrical module.
  • FIG. 3B is a cross-sectional view showing a partial configuration of an opto-electric module according to the second embodiment of the present invention.
  • FIG. 4A is a plan view showing an internal configuration of an opto-electric module according to a third embodiment of the present invention.
  • FIG. 4B is a cross-sectional view showing the configuration of an opto-electric module according to the third embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing a configuration of an opto-electric module according to a fourth embodiment of the present invention.
  • FIG. 6A is a plan view showing the internal configuration of an opto-electric module according to a fifth embodiment of the present invention.
  • FIG. 6B is a cross-sectional view showing the configuration of an opto-electric module according to the fifth embodiment of the present invention.
  • FIG. 7A is a plan view showing the internal configuration of another opto-electric module according to an embodiment of the present invention.
  • FIG. 7B is a cross-sectional view showing the configuration of another opto-electric module according to an embodiment of the present invention.
  • FIG. 8A is a plan view showing the internal configuration of a conventional opto-electric module.
  • FIG. 8B is a cross-sectional view showing the configuration of a conventional opto-electric module.
  • FIG. 9 is a plan view showing the internal configuration of a conventional optoelectronic module.
  • Figure 1A shows the inside of the module
  • Figure 1B shows a cross section taken along line xx' in Figure 1A.
  • This opto-electrical module includes a main wiring board 101, an optical circuit chip 102, an electronic circuit chip 103, electronic components 104, an optical fiber 105, a fixed component 111, an optical fiber extraction section 112, a sub-wiring board 121, and a housing 106.
  • This opto-electrical module is, for example, a pigtail type module.
  • an optical connector such as an MPO (Multi-Fiber Push On) connector is connected to the tip of the optical fiber 105 outside the housing 106.
  • This opto-electrical module is compatible with, for example, the 400GBASE-DR4 standard, and the optical fibers 105 can be configured from eight fibers, four for transmission and four for reception, and at least one additional optical fiber can be added to supply continuous light for optical transmission from the outside.
  • the sub-wiring board 121 is connected to the top of the main wiring board 101 inside the housing 106.
  • the optical circuit chip 102 and the electronic circuit chip 103 are mounted on the sub-wiring board 121.
  • Electronic components 104 can also be mounted on the sub-wiring board 121.
  • the optical circuit chip 102 is mounted on the sub-wiring board 121 with the side of the optical input/output terminal 131 protruding beyond the sub-wiring board 121.
  • the main wiring board 101 is a build-up board that uses resin as a base material, and can have a multi-layer wiring structure with a thickness of about 1 mm and about 10 layers.
  • Intra-board wiring 109 is formed on each layer of the main wiring board 101 and between the layers, and input and output of electrical signals are performed with the outside via input and output electrical terminals 110.
  • the intra-board wiring 109 can be, for example, copper wiring.
  • the input and output electrical terminals 110 can be, for example, electrodes for a land grid array (LGA), a ball grid array (BGA), or other structure.
  • Board-to-board terminals 122 are formed on the top of the main wiring board 101, providing electrical connection with the sub-wiring board 121.
  • the sub-wiring board 121 is generally called an interposer.
  • the sub-wiring board 121 can have a multi-layer wiring structure with a thickness of about 0.5 mm and about eight layers.
  • the board-to-board terminals 122 can be made of BGA, copper pillars (CuP), solder, etc.
  • the optical circuit chip 102 has an optical circuit made of an optical waveguide with a silicon core, and has a thickness of, for example, about 1 mm.
  • the optical circuit chip 102 can also be made of a quartz-based material or a compound semiconductor such as InP.
  • the optical circuit chip 302 is, for example, flip-chip (FC) mounted on the sub-wiring board 121 by the optical circuit terminal 107 and electrically connected.
  • the optical circuit chip 102 can include, for example, an optical transmitter that is composed of an optical modulator, an optical waveguide, a splitter, an optical attenuator, etc., and an optical receiver that is composed of a photodiode, an optical waveguide, an optical attenuator, etc.
  • a signal from the electronic circuit chip 103 is input to the optical transmitter via at least the sub-wiring board 121, and a received signal from the optical receiver is output to the TIA of the electronic circuit chip 103.
  • the optical transmitter of the optical circuit chip 102 often uses a traveling-wave electrode Mach-Zehnder modulator (MZM).
  • MZM traveling-wave electrode Mach-Zehnder modulator
  • the electronic circuit chip 103 includes a digital signal processing circuit (DSP), a driver circuit (DRV), and a transimpedance amplifier circuit (TIA). These may be implemented as individual chips, but this example shows them integrated into the electronic circuit chip 103.
  • DSP digital signal processing circuit
  • DRV driver circuit
  • TIA transimpedance amplifier circuit
  • the electronic circuit chip 103 generally has electronic circuit terminals 108 for multiple transmit signal outputs and receive signal inputs on the line side (i.e., the side that outputs signals to the optical transmitter and the side that receives signals from the optical receiver).
  • a digital signal processing circuit chip based on the 400GBASE-DR4 standard has 4 lanes x 8 positive/negative transmit signal output terminals and receive signal input terminals.
  • the electronic components 104 are a group of components necessary for driving the optical circuit chip 102 and the electronic circuit chip 103, and may be capacitors, inductors, resistors, etc.
  • the electronic components 104 may also be a control microcomputer, an AD converter, a DA converter, an electric switch, etc.
  • the electronic components 104 are mainly mounted (implemented) on the main wiring board 101 or the sub-wiring board 121 on the optical input/output terminal 131 side of the optical circuit chip 102.
  • the main wiring board 101 has a protective film removal area 151.
  • the protective film removal area 151 is an area where the protective film on the top surface of the main wiring board 101 between the optical circuit chip 102 and the optical fiber extraction section 112 has been removed.
  • a protective film made of solder resist or the like is formed on the surfaces of mounting boards such as the main wiring board 101 and the sub-wiring board 121. This protective film is generally formed in areas other than the connection terminals, and protects the wiring pattern formed on the surface from corrosion, etc.
  • the housing 106 surrounds the optical circuit chip 102 and the electronic circuit chip 103 and is fixed to the main wiring board 101 to prevent dust from adhering to each chip.
  • the housing 106 also fixes the optical fiber extraction section 112.
  • the housing 106 can be made of, for example, aluminum, stainless steel, copper, etc.
  • the optical fibers 105 are connected to the optical circuit chip 102 for optical input and output.
  • the optical fibers 105 can be arranged in an array of multiple fibers. In the case of 400GBASE-DR4, a minimum of eight optical fibers 105 are required: four for transmission and four for reception. Furthermore, if continuous light for optical transmission is supplied from the outside, at least one more optical fiber is added to these. For ease of handling, the optical fibers 105 arranged in an array of multiple fibers are usually fixed to each other with adhesive or a coating using a method called taping or ribbonizing.
  • the optical fiber 105 is fixed to one end of the optical circuit chip 102 by a fixing part 111.
  • the fixing part 111 protrudes downward from the bottom surface of the optical circuit chip 102.
  • the optical input/output end 131 to which the fixing part 111 of the optical circuit chip 102 is fixed protrudes outside the sub-wiring board 121 in a plan view.
  • the optical circuit chip 102 is mounted on the sub-wiring board 121, for example, even in a configuration in which the optical circuit chip 102 is arranged in the center of the main wiring board 101, there is no interference between the lower part of the fixing part 111 and the main wiring board 101.
  • the fixed component 111 is made of glass of a different material than the optical fiber 105, and serves to increase the connection strength between the optical fiber 105 and the optical circuit chip 102.
  • the optical fiber 105 is optically connected to the outside of the housing 106 via an optical fiber outlet 112 installed in the housing 106.
  • the optical fiber outlet 112 is generally called a boot, and can be a resin molded component with a through hole for passing the optical fiber 105 through.
  • the optical fiber 105 and the fixed part 111 are connected to the center of the end face of the optical circuit chip 102 using an optically transparent adhesive.
  • the optical fiber 105 is extended horizontally in the optical axis direction to the outside of the housing 106 (module).
  • the optical circuit chip 102 is mounted on the sub-wiring board 121, so the lower end of the fixing part 111 can be positioned away from the surface of the main wiring board 101.
  • This allows greater freedom in arranging the optical circuit chip 102 on the main wiring board 101.
  • This allows the distance between the optical input/output end 131 of the optical circuit chip 102 and the optical fiber extraction part 112 to be greater without hindering the miniaturization of the housing 106.
  • the optical fiber 105 between the fixing part 111 and the optical fiber extraction part 112 can be made longer, making it possible to prevent the optical fiber 105 from bending significantly due to buckling.
  • the protective film removal area 151 where the protective film has been removed, in the area below the optical fiber extraction section 112
  • the sub-wiring board 121 thinner it is possible to further miniaturize the module and reduce the propagation loss in the wiring within the board by shortening the length of the electrical signal wiring.
  • This opto-electrical module includes a main wiring board 101, an optical circuit chip 102, an electronic circuit chip 103, electronic components 104, an optical fiber 105, a fixed component 111, an optical fiber extraction section 112, a sub-wiring board 121, and a housing 106.
  • This opto-electrical module is, for example, a pigtail type module.
  • an optical connector such as an MPO (Multi-Fiber Push On) connector is connected to the tip of the optical fiber 105 outside the housing 106.
  • This opto-electrical module is compatible with, for example, the 400GBASE-DR4 standard, and the optical fibers 105 can be configured from eight fibers, four for transmission and four for reception, and at least one additional optical fiber can be added to supply continuous light for optical transmission from the outside.
  • the sub-wiring board 121 is connected to the top of the main wiring board 101 inside the housing 106.
  • the optical circuit chip 102 and the electronic circuit chip 103 are mounted on the sub-wiring board 121.
  • Electronic components 104 can also be mounted on the sub-wiring board 121.
  • the optical circuit chip 102 is mounted on the sub-wiring board 121 with the side of the optical input/output terminal 131 protruding beyond the sub-wiring board 121.
  • the main wiring board 101 is a build-up board that uses resin as a base material, and can have a multi-layer wiring structure with a thickness of about 1 mm and about 10 layers.
  • Intra-board wiring 109 is formed on each layer of the main wiring board 101 and between the layers, and input and output of electrical signals are performed with the outside via input and output electrical terminals 110.
  • the intra-board wiring 109 can be, for example, copper wiring.
  • the input and output electrical terminals 110 can be, for example, electrodes for a land grid array (LGA), a ball grid array (BGA), or other structure.
  • Board-to-board terminals 122 are formed on the top of the main wiring board 101, providing electrical connection with the sub-wiring board 121.
  • the sub-wiring board 121 is generally called an interposer.
  • the sub-wiring board 121 can have a multi-layer wiring structure with a thickness of about 0.5 mm and about eight layers.
  • the board-to-board terminals 122 can be made of BGA, copper pillars (CuP), solder, etc.
  • the optical circuit chip 102 has an optical circuit made of an optical waveguide with a silicon core, and has a thickness of, for example, about 1 mm.
  • the optical circuit chip 102 can also be made of a quartz-based material or a compound semiconductor such as InP.
  • the optical circuit chip 302 is, for example, flip-chip (FC) mounted on the sub-wiring board 121 by the optical circuit terminal 107 and electrically connected.
  • the optical circuit chip 102 can include, for example, an optical transmitter consisting of an optical modulator, an optical waveguide, a splitter, an optical attenuator, etc., and an optical receiver consisting of a photodiode, an optical waveguide, an optical attenuator, etc.
  • a signal from the electronic circuit chip 103 is input to the optical transmitter via the main wiring board 101, and a received signal from the optical receiver is output to the TIA of the electronic circuit chip 103.
  • the optical transmitter of the optical circuit chip 102 often uses a traveling-wave electrode Mach-Zehnder modulator (MZM).
  • MZM traveling-wave electrode Mach-Zehnder modulator
  • the electronic circuit chip 103 includes a digital signal processing circuit (DSP), a driver circuit (DRV), and a transimpedance amplifier circuit (TIA). These may be implemented as individual chips, but this example shows them integrated into the electronic circuit chip 103.
  • DSP digital signal processing circuit
  • DRV driver circuit
  • TIA transimpedance amplifier circuit
  • the electronic circuit chip 103 generally has electronic circuit terminals 108 for multiple transmit signal outputs and receive signal inputs on the line side (i.e., the side that outputs signals to the optical transmitter and the side that receives signals from the optical receiver).
  • a digital signal processing circuit chip based on the 400GBASE-DR4 standard has 4 lanes x 8 positive/negative transmit signal output terminals and receive signal input terminals.
  • the electronic components 104 are a group of components necessary for driving the optical circuit chip 102 and the electronic circuit chip 103, and may be capacitors, inductors, resistors, etc.
  • the electronic components 104 may also be a control microcomputer, an AD converter, a DA converter, an electric switch, etc.
  • the electronic components 104 are mainly mounted (implemented) on the main wiring board 101 or the sub-wiring board 121 on the optical input/output terminal 131 side of the optical circuit chip 102.
  • the main wiring board 101 further includes a wiring removal area 152. This is an area where a portion of the wiring layer on the top surface of the main wiring board 101 between the optical circuit chip 102 and the optical fiber extraction section 112 has been removed.
  • the housing 106 surrounds the optical circuit chip 102 and the electronic circuit chip 103 and is fixed to the main wiring board 101 to prevent dust from adhering to each chip.
  • the housing 106 also fixes the optical fiber extraction section 112.
  • the housing 106 can be made of, for example, aluminum, stainless steel, copper, etc.
  • the optical fibers 105 are connected to the optical circuit chip 102 for optical input and output.
  • the optical fibers 105 can be arranged in an array of multiple fibers. In the case of 400GBASE-DR4, a minimum of eight optical fibers 105 are required: four for transmission and four for reception. Furthermore, if continuous light for optical transmission is supplied from the outside, at least one more optical fiber is added to these. For ease of handling, the optical fibers 105 arranged in an array of multiple fibers are usually fixed to each other with adhesive or a coating using a method called taping or ribbonizing.
  • the optical fiber 105 is fixed to one end of the optical circuit chip 102 by a fixing part 111.
  • the fixing part 111 protrudes downward from the bottom surface of the optical circuit chip 102.
  • the optical input/output end 131 to which the fixing part 111 of the optical circuit chip 102 is fixed protrudes outside the sub-wiring board 121 in a plan view.
  • the optical circuit chip 102 is mounted on the sub-wiring board 121, for example, even in a configuration in which the optical circuit chip 102 is arranged in the center of the main wiring board 101, there is no interference between the lower part of the fixing part 111 and the main wiring board 101.
  • the fixed component 111 is made of glass of a different material than the optical fiber 105, and serves to increase the connection strength between the optical fiber 105 and the optical circuit chip 102.
  • the optical fiber 105 is optically connected to the outside of the housing 106 via an optical fiber outlet 112 installed in the housing 106.
  • the optical fiber outlet 112 is generally called a boot, and can be a resin molded component with a through hole for passing the optical fiber 105 through.
  • the optical fiber 105 and the fixed part 111 are connected to the center of the end face of the optical circuit chip 102 using an optically transparent adhesive.
  • the optical fiber 105 is extended horizontally in the optical axis direction to the outside of the housing 106 (module).
  • the optical circuit chip 102 is mounted on the sub-wiring board 121, so the lower end of the fixing part 111 can be positioned away from the surface of the main wiring board 101.
  • This allows greater freedom in arranging the optical circuit chip 102 on the main wiring board 101.
  • This allows the distance between the optical input/output end 131 of the optical circuit chip 102 and the optical fiber extraction part 112 to be greater without hindering the miniaturization of the housing 106.
  • the optical fiber 105 between the fixing part 111 and the optical fiber extraction part 112 can be made longer, making it possible to prevent the optical fiber 105 from bending significantly due to buckling.
  • main wiring board 101 Furthermore, by providing wiring removal area 152, in which part of the outermost wiring layer has been removed, in the area below optical fiber extraction section 112, it is possible to reduce warping of main wiring board 101.
  • wiring layer 101a on the outermost surface of main wiring board 101 is copper wiring and main wiring board 101 is a resin board, differences in environmental temperature can cause main wiring board 101 to warp toward fixed component 111, as shown in FIG. 3A.
  • warping occurs in main wiring board 101 in this way, contact between fixed component 111 and main wiring board 101 occurs, causing problems.
  • FIG. 4A shows the inside of the module
  • Figure 4B shows a cross section taken along line xx' in Figure 2A.
  • This optoelectronic module includes a main wiring board 101, an optical circuit chip 102, an electronic circuit chip 103, electronic components 104, an optical fiber 105, and a housing 106.
  • the optical circuit chip 102, the electronic circuit chip 103, and the electronic components 104 are mounted on the main wiring board 101.
  • This optical/electrical module is, for example, a pigtail type module.
  • an optical connector such as an MPO (Multi-Fiber Push On) connector is connected to the tip of the optical fiber 105 outside the housing 106.
  • This optical/electrical module is compatible with, for example, the 400GBASE-DR4 standard, and the optical fiber 105 can be configured with eight optical fibers, four for transmission and four for reception, and at least one additional optical fiber can be added to supply continuous light for optical transmission from the outside.
  • the main wiring board 101 is a build-up board that uses resin as a base material, and can have a multi-layer wiring structure with a thickness of about 1 mm and about 10 layers.
  • Intra-board wiring 109 is formed on each layer of the main wiring board 101 and between the layers, and input and output of electrical signals are performed with the outside via input and output electrical terminals 110.
  • the intra-board wiring 109 can be, for example, copper wiring.
  • the input and output electrical terminals 110 can be, for example, electrodes for a land grid array (LGA), a ball grid array (BGA), or other structure.
  • the optical circuit chip 102 has an optical circuit made of an optical waveguide with a silicon core, and has a thickness of, for example, about 1 mm.
  • the optical circuit chip 102 can also be made of a quartz-based material or a compound semiconductor such as InP.
  • the optical circuit chip 102 is, for example, flip-chip (FC) mounted on the main wiring board 101 by the optical circuit terminals 107 and electrically connected.
  • FC flip-chip
  • the optical circuit chip 102 can include, for example, an optical transmitter consisting of an optical modulator, an optical waveguide, a splitter, an optical attenuator, etc., and an optical receiver consisting of a photodiode, an optical waveguide, an optical attenuator, etc.
  • a signal from the electronic circuit chip 103 is input to the optical transmitter via the main wiring board 101, and a received signal from the optical receiver is output to the TIA of the electronic circuit chip 103.
  • the optical transmitter of the optical circuit chip 102 often uses a traveling-wave electrode Mach-Zehnder modulator (MZM).
  • MZM traveling-wave electrode Mach-Zehnder modulator
  • the electronic circuit chip 103 includes a digital signal processing circuit (DSP), a driver circuit (DRV), and a transimpedance amplifier circuit (TIA). These may be implemented as individual chips, but this example shows them integrated into the electronic circuit chip 103.
  • DSP digital signal processing circuit
  • DRV driver circuit
  • TIA transimpedance amplifier circuit
  • the electronic circuit chip 103 generally has electronic circuit terminals 108 for multiple transmit signal outputs and receive signal inputs on the line side (i.e., the side that outputs signals to the optical transmitter and the side that receives signals from the optical receiver).
  • a digital signal processing circuit chip based on the 400GBASE-DR4 standard has 4 lanes x 8 positive/negative transmit signal output terminals and receive signal input terminals.
  • the electronic components 104 are a group of components necessary for driving the optical circuit chip 102 and the electronic circuit chip 103, and may be capacitors, inductors, resistors, etc.
  • the electronic components 104 may also be a control microcomputer, an AD converter, a DA converter, an electric switch, etc.
  • the electronic components 104 are mainly mounted (implemented) on the main wiring board 101 or the sub-wiring board 121 on the optical input/output terminal 131 side of the optical circuit chip 102.
  • the housing 106 surrounds the optical circuit chip 102 and the electronic circuit chip 103 and is fixed to the main wiring board 101 to prevent dust from adhering to each chip.
  • the housing 106 also fixes the optical fiber extraction section 112.
  • the housing 106 can be made of, for example, aluminum, stainless steel, copper, etc.
  • the optical fibers 105 are connected to the optical circuit chip 102 for optical input and output.
  • the optical fibers 105 can be arranged in an array of multiple fibers. In the case of 400GBASE-DR4, a minimum of eight optical fibers 105 are required: four for transmission and four for reception. Furthermore, if continuous light for optical transmission is supplied from the outside, at least one more optical fiber is added to these. For ease of handling, the optical fibers 105 arranged in an array of multiple fibers are usually fixed to each other with adhesive or a coating using a method called taping or ribbonizing.
  • the optical fiber 105 is fixed to one end of the optical circuit chip 102 by a fixing part 111.
  • the fixing part 111 is made of glass of a different material from that of the optical fiber 105, and serves to increase the connection strength between the optical fiber 105 and the optical circuit chip 102.
  • the optical fiber 105 also makes an optical connection to the outside of the housing 106 via an optical fiber extraction part 112 installed in the housing 106.
  • the optical fiber extraction part 112 is generally called a boot, and can be a resin molded part having a through hole for passing the optical fiber 105 through.
  • the optical fiber 105 and the fixed part 111 are connected to the center of the end face of the optical circuit chip 102 using an optically transparent adhesive.
  • the optical fiber 105 is extended horizontally in the optical axis direction to the outside of the housing 106 (module).
  • the fixing part 111 protrudes downward from the bottom surface of the optical circuit chip 102.
  • a recess 153 is provided in order to prevent interference (contact) between the lower part of the fixing part 111 protruding downward and the main wiring board 101.
  • the recess 153 is formed in the main wiring board 101 between the optical circuit chip 102 and the optical fiber extraction part 112.
  • the recess 153 can be formed in an area that includes the position of the fixing part 111 in a plan view.
  • the clearance between the bottom end of the fixed part 111 and the bottom surface of the recess 153 is approximately 0.2 mm.
  • the lower end of the fixed part 111 can be prevented from contacting the main wiring board 101, and the degree of freedom in arranging the optical circuit chip 102 on the main wiring board 101 can be increased.
  • This allows the distance between the optical input/output end 131 of the optical circuit chip 102 and the optical fiber extraction part 112 to be increased without hindering the miniaturization of the housing 106.
  • the optical fiber 105 between the fixed part 111 and the optical fiber extraction part 112 can be made longer, and the optical fiber 105 can be prevented from bending significantly due to buckling.
  • This opto-electrical module includes a main wiring board 101, an optical circuit chip 102, an electronic circuit chip 103, an electronic component 104, an optical fiber 105, a fixed component 111, an optical fiber outlet 112, a sub-wiring board 121, a protective film removal region 151, and a housing 106. These components are similar to those in the first embodiment described above.
  • a reinforcing part 118 is further provided to reinforce the fixed part 111 provided on the protruding part of the optical circuit chip 102.
  • the reinforcing part 118 can be attached and fixed to the back surface of the optical circuit chip 102 and the side surface of the fixed part 111. For example, if the protruding length of the optical circuit chip 102 from the sub-wiring board 121 is 1.5 mm, a reinforcing part 118 with a length of 1 mm in the protruding direction can be used.
  • the optical waveguide of the optical circuit chip 102 and the optical fiber 105 are more firmly fixed, which increases resistance to stress caused by buckling and improves quality.
  • FIG. 6A shows the inside of the module
  • Figure 6B shows a cross section of line xx' in Figure 6A.
  • This opto-electrical module includes a main wiring board 101, an optical circuit chip 102, an electronic circuit chip 103, an electronic component 104, an optical fiber 105, a fixing component 111, a sub-wiring board 121, a housing 106, an optical fiber extraction section 112, and a protective film removal area 151.
  • a wiring removal area can be provided on the main wiring board 101.
  • the device further includes a daughter board 123 connected onto the main wiring board 101.
  • the daughter board 123 is disposed inside the housing 106 between the optical fiber extraction unit 112, which is an optical fiber extraction unit, and the sub-wiring board 121.
  • electronic components 104 are mounted on the daughter board 123.
  • the daughter board 123 can also be mounted with the optical fiber extraction unit 112 side protruding beyond the main wiring board 101.
  • the daughter board 123 can be connected to the main wiring board 101 by a well-known board-to-board connector.
  • the daughter board 123 can also be connected to the main wiring board 101 by an electrical cable made of a flexible printed circuit board.
  • the daughter board 123 can also be positioned above the optical fiber 105 between the fixed part 111 and the optical fiber extraction part 112 when viewed from the main wiring board 101.
  • the optical fiber 105 between the fixed part 111 and the optical fiber extraction part 112 can be made longer. This makes it possible to increase the space between the fixed part 111, where the optical fiber 105 is installed, and the optical fiber extraction part, and makes it easier to install the child board 123.
  • the child board 123 can also be inserted between the main wiring board 101 and the fixed component 111. If the thickness of the sub-wiring board 121 is 0.5 mm, the length from the optical axis center of the optical fiber 105 to the bottom end of the fixed component 111 is 0.3 mm, and the child board 123 is inserted below the fixed component 111, the height clearance can be approximately 0.05 mm. In this way, by appropriately setting the thickness of the sub-wiring board 121, the space between the main wiring board 101 and the optical fiber 105 and the fixed component 111 can be increased, and the child board 123 can be inserted below the fixed component 111, for example, increasing the area of the child board 123.
  • Figures 7A and 7B by providing multiple pairs of optical circuit chips and optical fiber extraction sections, it is possible to ensure a transmission capacity twice that of 400GBASE-DR4. Note that Figure 7A shows the inside of the module, and Figure 7B shows a cross section taken along line xx' in Figure 7A.
  • a plurality of optical circuit chips 102a, 102b and a plurality of electronic circuit chips 103a, 103b are mounted on a sub-wiring board 121.
  • Optical fibers 105a, 105a are connected and fixed to the optical circuit chips 102a, 102b by fixing parts 111a, 111b.
  • the main wiring board 101 also includes a protective film removal area 151, similar to the first embodiment described above.
  • the other ends of the optical fibers 105a and 105a are connected and fixed to the first optical connectors 113a and 113b.
  • the first optical connectors 113a and 113b are connectable to the second optical connectors 114a and 114b.
  • the second optical connectors 114a and 114b are provided with external optical fibers.
  • the optical fiber 105 is optically connected to the outside of the housing 106 via the first optical connector 113a and the first optical connector 113b that are installed (fixed) in the housing 106.
  • One end of the optical fiber 105 is connected to the optical input/output terminal 131 of the optical circuit chip 102, and the other end is fixed to the first optical connector 113a and the first optical connector 113b.
  • the first optical connector 113a and the first optical connector 113b are also connectable to the second optical connector 114a and the second optical connector 114b.
  • the first optical connector 113a and the first optical connector 113b may be, for example, a receptacle, and the second optical connector 114a and the second optical connector 114b may be, for example, a plug.
  • the first optical connector 113a, the first optical connector 113b, the second optical connector 114a and the second optical connector 114b may be, for example, an MT (Mechanically Transferable) ferrule.
  • the first optical connector 113a and the first optical connector 113b that are MT ferrules may be provided with guide pins 116
  • the second optical connector 114a and the second optical connector 114b that are MT ferrules may be provided with guide holes 117 for the guide pins.
  • the first optical connector 113a and the first optical connector 113b are connected to the second optical connector 114a and the second optical connector 114b.
  • a constriction 141 is provided on the outer shape of the housing 106'.
  • the constriction 141 is used to fit the socket used to mount the opto-electrical module without causing misalignment. Even if the housing 106' has the constriction 141 protruding to the inside, the optical circuit chip 102a and the optical circuit chip 102b can be installed at a position away from the first optical connector 113a and the first optical connector 113b, so that the fixing parts 111a and the fixing parts 111b can be connected to the center of the optical input/output ends of the optical circuit chip 102a and the optical circuit chip 302b.
  • the optical fiber 105a and the optical fiber 105b can reach the first optical connector 113a and the first optical connector 113b without bending the optical fiber in the optical axis direction in a plan view.
  • the optical fiber 105 is generally fixed more firmly than in the case of a boot or the like. Even in such a case, as in the above-described first embodiment, the optical fiber 105 between the fixing part 111 and the first optical connector 113a and the first optical connector 113b can be made longer, and the optical fiber 105 can be prevented from bending significantly due to buckling.
  • the first optical connector 113a and the first optical connector 113b as the optical fiber extracting section can be made movable in the optical axis direction.
  • the first optical connector 113a and the first optical connector 113b can be made movable relative to the first optical connector 113a and the first optical connector 113b.
  • the first optical connector 113a and the first optical connector 113b are moved to an appropriate position.
  • the first optical connector 113a and the first optical connector 113b are fixed to the housing 106 using an adhesive or the like.
  • the optical fiber extracting section 112 in the above-mentioned embodiment 1 can be similarly configured as described above.
  • the length of the optical fiber varies due to processing accuracy.
  • the optical fiber length has a median of 30 mm, with a dimensional error of ⁇ 1 mm.
  • the optical fiber extracting section is completely fixed to the housing, it may not be possible to ensure sufficient buckling length and buckling height depending on the dimensional error.
  • the optical fiber can be fixed while ensuring a length that is of good quality.
  • a wiring removal area can be provided as in the second embodiment described above.
  • recesses can be formed in the main wiring board 106' between the optical circuit chips 102a and 102b and the first optical connectors 113a and 113b (optical fiber extraction section) without using the sub-wiring board 121.
  • an optical circuit chip is mounted on a sub-wiring board connected on a main wiring board, and a protective film removal area or wiring removal area is further provided, so that deterioration of the characteristics and breakage of the optical fiber between the optical circuit chip and the optical fiber extraction section in the module can be suppressed.
  • a recess is formed in the main wiring board between the optical circuit chip and the optical fiber extraction section, so that deterioration of the characteristics and breakage of the optical fiber between the optical circuit chip and the optical fiber extraction section in the module can be suppressed.
  • the length of the optical fiber must be shortened, which poses a problem of deterioration in the quality of the module due to buckling of the optical fiber, but this problem can be solved by the present invention.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un module photoélectronique qui est pourvu d'une carte de câblage principale (101), d'une puce de circuit optique (102), d'une puce de circuit électronique (103), d'un composant électronique (104), d'une fibre optique (105), d'une carte de câblage auxiliaire (121) et d'un boîtier (106). La carte de câblage auxiliaire (121) est connectée sur la carte de câblage principale (101) à l'intérieur du boîtier (106), et la puce de circuit optique (102) et la puce de circuit électronique (103) sont montées sur la carte de câblage auxiliaire (121). En outre, la carte de câblage principale (101) est pourvue d'une région de retrait de film protecteur (151). La région de retrait de film protecteur (151) est une région dans laquelle un film protecteur sur la surface la plus à l'extérieur de la carte de câblage principale (101) entre la puce de circuit optique (102) et une partie d'extraction de fibre optique (112) est retiré.
PCT/JP2023/024370 2023-06-30 2023-06-30 Module photoélectrique Pending WO2025004320A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/024370 WO2025004320A1 (fr) 2023-06-30 2023-06-30 Module photoélectrique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/024370 WO2025004320A1 (fr) 2023-06-30 2023-06-30 Module photoélectrique

Publications (1)

Publication Number Publication Date
WO2025004320A1 true WO2025004320A1 (fr) 2025-01-02

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ID=93938020

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2023/024370 Pending WO2025004320A1 (fr) 2023-06-30 2023-06-30 Module photoélectrique

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Country Link
WO (1) WO2025004320A1 (fr)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323649A (ja) * 1999-01-06 2000-11-24 Nippon Telegr & Teleph Corp <Ntt> ハイブリッド集積素子およびその製造方法
JP2012141471A (ja) * 2011-01-04 2012-07-26 Hitachi Ltd 光インターコネクションモジュール
JP2012145743A (ja) * 2011-01-12 2012-08-02 Nippon Telegr & Teleph Corp <Ntt> 光モジュール
US20140203175A1 (en) * 2011-12-30 2014-07-24 Mauro J. Kobrinsky Optical i/o system using planar light-wave integrated circuit
JP2016004224A (ja) * 2014-06-19 2016-01-12 富士通株式会社 光学モジュール、光学モジュールの製造方法及び光学装置
JP2016167005A (ja) * 2015-03-10 2016-09-15 富士通株式会社 光学装置及び光学装置の製造方法
JP2020194019A (ja) * 2019-05-24 2020-12-03 富士通オプティカルコンポーネンツ株式会社 光モジュール
WO2022030001A1 (fr) * 2020-08-07 2022-02-10 日本電信電話株式会社 Module à semi-conducteur optique et son procédé de fabrication

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000323649A (ja) * 1999-01-06 2000-11-24 Nippon Telegr & Teleph Corp <Ntt> ハイブリッド集積素子およびその製造方法
JP2012141471A (ja) * 2011-01-04 2012-07-26 Hitachi Ltd 光インターコネクションモジュール
JP2012145743A (ja) * 2011-01-12 2012-08-02 Nippon Telegr & Teleph Corp <Ntt> 光モジュール
US20140203175A1 (en) * 2011-12-30 2014-07-24 Mauro J. Kobrinsky Optical i/o system using planar light-wave integrated circuit
JP2016004224A (ja) * 2014-06-19 2016-01-12 富士通株式会社 光学モジュール、光学モジュールの製造方法及び光学装置
JP2016167005A (ja) * 2015-03-10 2016-09-15 富士通株式会社 光学装置及び光学装置の製造方法
JP2020194019A (ja) * 2019-05-24 2020-12-03 富士通オプティカルコンポーネンツ株式会社 光モジュール
WO2022030001A1 (fr) * 2020-08-07 2022-02-10 日本電信電話株式会社 Module à semi-conducteur optique et son procédé de fabrication

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