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WO2025002513A1 - Procédé de création de structures optiques dans une couche adhésive plane - Google Patents

Procédé de création de structures optiques dans une couche adhésive plane Download PDF

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Publication number
WO2025002513A1
WO2025002513A1 PCT/DE2024/100582 DE2024100582W WO2025002513A1 WO 2025002513 A1 WO2025002513 A1 WO 2025002513A1 DE 2024100582 W DE2024100582 W DE 2024100582W WO 2025002513 A1 WO2025002513 A1 WO 2025002513A1
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WO
WIPO (PCT)
Prior art keywords
adhesive layer
radiation
selective partial
radiation source
optical structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/DE2024/100582
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German (de)
English (en)
Inventor
Christian Kirchhof
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Heliatek GmbH
Original Assignee
Heliatek GmbH
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Filing date
Publication date
Application filed by Heliatek GmbH filed Critical Heliatek GmbH
Publication of WO2025002513A1 publication Critical patent/WO2025002513A1/fr
Anticipated expiration legal-status Critical
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/80—Encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/42—Optical elements or arrangements directly associated or integrated with photovoltaic cells, e.g. light-reflecting means or light-concentrating means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/322—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of solar panels
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/21—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being formed by alternating adhesive areas of different nature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/10—Organic photovoltaic [PV] modules; Arrays of single organic PV cells
    • H10K39/12—Electrical configurations of PV cells, e.g. series connections or parallel connections

Definitions

  • the invention relates to a method for producing optical structures in a planar, radiation-curable adhesive layer, as well as a use for such a method.
  • Adhesive layers that can be cured by means of radiation are known from the prior art.
  • US 7,046,904 B2 discloses UV-curable resin compositions for encasing optical fibers or waveguides. Due to a different refractive index after curing compared to the optical fiber, the resin compositions allow the production of waveguides that transmit almost losslessly.
  • DE 10 2021 103 404 Al discloses a carrier layer with a volume hologram, which is bonded to a substrate by means of a UV-curable adhesive layer.
  • Radiation-curable adhesive layers are also used in the field of optoelectronic components, whereby the optoelectronic components are enclosed by means of an encapsulation bonded to them.
  • Such an encapsulation is particularly common in organic optoelectronic components in order to protect organic layers, which are preferably vapor-deposited in a vacuum or processed from a solution, from direct contact with air, in particular oxygen and/or moisture.
  • EP 1 611 484 B1 discloses a photoactive component consisting of organic layers of one or more pi, ni, nip and/or pin diodes stacked on top of one another in which light traps are used to extend the optical path of the incident light in the photoactive layer.
  • optical elements can be applied to components using an additional film to change the light incidence and/or light emission.
  • films comprise an adhesive layer and a functional layer with the optical element, with the film being laminated to the component using the adhesive layer.
  • EP 54157 B1 discloses the application of light-guiding elements to improve the efficiency of solar cells, whereby grooves are introduced at regular intervals on the surface of a solar cell by means of laser ablation, which are then filled with a strongly scattering but non-absorbing material. This material scatters incident sunlight onto the photoactive layers of the solar cell.
  • optical structures in particular labels or light-guiding elements
  • laminates or film composites with reduced technical effort, in particular directly during their manufacture, whereby the durability of the optical structures should also be largely unaffected by external influences.
  • the invention is therefore based on the object of providing a method in which optical structures are introduced directly into a flat adhesive layer of a laminate or film composite as an integrated process step during the production of the laminate or film composite.
  • the optical structures should in particular have a high level of resilience to external influences.
  • the invention is based on the object of providing a method in which optical structures in a protective layer or an encapsulation of an optoelectronic component for guiding light and/or light scattering, particularly to improve efficiency.
  • the object is achieved in particular by providing a method for producing optical structures in a flat adhesive layer, wherein the adhesive layer can be cured by means of radiation, comprising the following steps: a) providing a first protective layer; b) applying an adhesive layer to the first protective layer; c) pre-curing a selective partial region of the adhesive layer by irradiating the selective partial region by means of radiation from a first radiation source over a first period of time with a first surface energy density, wherein the selective partial region of the adhesive layer is not completely cured; d) curing the adhesive layer by irradiating the entire region of the adhesive layer by means of radiation from the first radiation source and/or a second radiation source over a second period of time with a second surface energy density; and e) obtaining a cured adhesive layer with the optical structures, wherein the selective partial region with the optical structures has a different refractive index to a region of the adhesive layer lying outside the selective partial region.
  • the use of the singular for the selective partial region of the adhesive layer also includes a discontinuous selective partial region; the selective partial region can therefore also comprise a plurality of partial regions spatially separated from one another within the adhesive layer.
  • a protective layer is understood to mean in particular a layer for protecting an element arranged behind or under the protective layer, preferably a layer for increasing the mechanical protection, in particular scratch resistance, a Filter layer, preferably a layer with a UV filter, and/or a layer, in particular a barrier, against chemical compounds, contaminants, moisture and/or air, in particular oxygen.
  • the protective layer is preferably a film, a film composite or a thin plate.
  • a radiation-curable adhesive layer is understood to be a material, preferably an adhesive, or a layer made of this material, by means of which a first element can be fixed, in particular glued, to a second element, in particular two layers can be glued to one another so that they are bonded to one another, the bonding between the first element and the second element being brought about by irradiation with rays, in particular electromagnetic radiation or particle beams.
  • the material of the radiation-curable adhesive layer is applied to the first and/or the second element in a liquid or pasty state and then pre-hardened and/or cured by irradiation with radiation so that a bonding between the first element and the second element is created.
  • a flat adhesive layer is understood to mean in particular an adhesive layer which extends essentially two-dimensionally over a predetermined surface area, in particular over a surface area of the first protective layer.
  • a radiation source is understood to be a device that is set up to generate or emit radiation of a predetermined type, in particular electromagnetic radiation or particle beams.
  • the radiation is preferably emitted in a directed manner, in particular the radiation is emitted as a beam of rays with a defined cross-section.
  • the first and/or the second radiation source are preferably a light source, preferably a lamp, an LED or a laser, or a particle beam-emitting device, preferably an electron gun.
  • the material of the radiation-curable adhesive layer is applied to the first protective layer in a liquid or pasty state; preferably, the radiation-curable adhesive layer to be applied to the first protective layer is formed from a liquid or pasty material.
  • step c ) the optical structures are introduced by selectively pre - curing , in particular not completely curing , those partial areas of the adhesive layer which correspond to the optical structures to be produced by irradiating them with radiation from the first radiation source over a first period of time with a first surface energy density .
  • the pre-curing in step c) creates a selective partial area within the adhesive layer with a different refractive index than an area of the adhesive layer outside the selective partial area that has not yet been irradiated in this process step.
  • a change in the refractive index is possible in particular through the formation of microbubbles in the irradiated areas of the adhesive layer.
  • the microbubbles display a diffusely scattering behavior of incident ambient light, whereby the optical structures created are visible. Due to uneven polymerization through irradiation with radiation from the first radiation source, microbubbles are formed in the adhesive layer, in particular disordered polymers are formed in liquid or pasty areas of the adhesive layer.
  • the entire adhesive layer is cured over the entire surface, in particular completely. During this curing over the entire surface, in particular completely, differences in the refractive indices between the pre-cured selective partial area and the area of the adhesive layer lying outside the selective partial area, i.e. the remaining area of the adhesive layer, are maintained.
  • the method according to the invention for producing optical structures in a flat adhesive layer has advantages in Comparison to the prior art.
  • the optical structures are integrated directly into the adhesive layer as a component thereof.
  • the creation of the optical structures is an integral part of the process for producing the adhesive layer. Additional processing of separate elements containing these optical structures, as well as their application to the adhesive layer or the first or second protective layer can therefore be omitted.
  • the optical structures are protected from the effects of the weather and mechanical damage.
  • the optical structures due to their integration directly into the adhesive layer, have a service life corresponding to that of the adhesive layer. Phenomena such as flaking or fading are eliminated, and the optical structures are protected in particular from the effects of UV radiation from sunlight and/or weathering processes due to the effects of the weather.
  • the radiation from the first radiation source and/or the radiation from the second radiation source is electromagnetic radiation in the visible or in the UV (ultraviolet) range, or electron radiation.
  • the radiation from the first radiation source in step c) and/or the radiation from the first radiation source and/or the second radiation source in step d) is UV radiation in a wavelength range from 350 nm to 410 nm, and/or the first and/or the second surface energy density is in a range from 10 mJ/cm2 to 1000 mJ/cm2.
  • step c) UV radiation in a wavelength range from 370 nm to 390 nm is used, while in step d) preferably electromagnetic radiation in a wavelength range from 390 nm to 410 nm is used.
  • the wavelength range of the electromagnetic radiation can be adapted to the requirements of the material of the adhesive layer for curing.
  • the first time period for irradiating the selective partial area of the adhesive layer in step c) is shorter than the second time period for irradiating the entire area of the adhesive layer in step d).
  • the first surface energy density of the radiation for irradiating the selective partial region of the adhesive layer in step c) is lower than the second surface energy density of the radiation for irradiating the entire region of the adhesive layer in step d), preferably the first surface energy density of the radiation in step c) is 10 mJ/cm 2 to 50 mJ/cm 2 and the second surface energy density of the radiation in step d) is 100 mJ/cm 2 to 1000 mJ/cm 2 .
  • the selective partial region is cured homogeneously, in particular there is no gradient of the refractive index within the selective partial region.
  • the density and/or the diameter of the microbubbles formed in the selective partial region during pre-curing are largely evenly distributed over the entire selective partial region.
  • the first time period and/or the first surface energy density is varied when irradiating individual areas within the selective partial area of the adhesive layer in step c).
  • shading can be generated within the selective partial area by a specifically adapted spatial distribution of areas with different refractive indices.
  • step f) during or after step c), or during or after step d), preferably after step d), the adhesive layer is cured by means of thermal treatment.
  • step c during the irradiation of the selective partial area of the adhesive layer by means of radiation in step c), areas of the adhesive layer lying outside the selective partial area are covered, preferably with a shadow mask, or the selective partial area of the adhesive layer is irradiated with radiation by means of a projection, in particular using a projector, or the selective partial area of the adhesive layer is irradiated with a focused or defocused beam of the first radiation source, is preferably scanned.
  • the selective partial area of the adhesive layer is scanned in particular by guiding the beam, e.g. a laser beam, along a predetermined path by means of suitable beam deflection devices, a so-called scanner, over the surface of the adhesive layer.
  • the adhesive layer is formed from a material selected from the group consisting of acrylates, in particular cyanoacrylates, epoxy resins, silicones, and polyurethanes, in particular acrylate and/or urethane photopolymers; preferably, the adhesive layer has a photoinitiator for polymerizing the adhesive layer.
  • the radiation from the first radiation source in step c) is radiated into the adhesive layer from a first direction, preferably from a side of the adhesive layer facing away from the first protective layer, or preferably from a direction substantially perpendicular to the flat adhesive layer
  • the radiation from the second radiation source in step d) is radiated into the adhesive layer from a second direction, preferably from a side of the adhesive layer facing the first protective layer.
  • the second direction can essentially correspond to the first direction, but the second direction is preferably opposite to the first direction.
  • the first protective layer preferably has a transmittance of at least 50%, preferably of at least 80%, or preferably at least 90%, at least for the radiation from the second radiation source, wherein the radiation is preferably radiated into the adhesive layer from a side of the adhesive layer facing the first protective layer, through which at least a proportion of at least 50% of the radiation from the second radiation source passes.
  • the optical structures contain visual information, preferably a logo, an image, a lettering, a number and/or a code, and/or an optically functional structure for guiding light and/or Light scattering, preferably an area with a different optical scattering effect compared to the area of the adhesive layer lying outside the optical structures.
  • visual information preferably a logo, an image, a lettering, a number and/or a code, and/or an optically functional structure for guiding light and/or Light scattering, preferably an area with a different optical scattering effect compared to the area of the adhesive layer lying outside the optical structures.
  • the adhesive layer is transparent in the visible range of light, preferably in a wavelength range from 400 nm to 800 nm.
  • a second protective layer is arranged, preferably laminated, on the side of the adhesive layer opposite the first protective layer between step b) and step d), wherein the adhesive layer is arranged between the first protective layer and the second protective layer and connects them to one another in a materially bonded manner.
  • an element in particular a layer, which is applied, arranged or formed on another element, in particular another layer, is understood to mean a direct contact of the one element with the other element or an indirect contact, in particular by means of at least one further layer arranged therebetween.
  • the adhesive layer between step b) and c) or during step c) is bonded directly to the side facing away from the first protective layer, or to a second protective layer arranged therebetween and a further Adhesive layer is applied to an optoelectronic component, preferably a photovoltaic element, wherein the optoelectronic component is formed from an arrangement of cells connected in series, wherein when the selective partial region of the adhesive layer is irradiated in step c), the radiation from the first radiation source is radiated from a side of the optoelectronic component facing away from the adhesive layer through the arrangement between the cells connected in series onto the adhesive layer, wherein regions of the adhesive layer lying outside the selective partial region of the adhesive layer are covered, i.e.
  • the selective partial region of the adhesive layer which is pre-cured in step c) is determined by the arrangement of the cells connected in series and/or by those regions of the arrangement of the cells connected in series which do not absorb, or only absorb to an insignificant extent, the radiation from the first radiation source used in step c), in particular the trenches obtained through the structuring.
  • Irradiation of radiation through the arrangement between the cells connected in series is understood in particular to mean irradiation of radiation through the structuring, i.e. trenches, in particular the P3 trenches, of the cells connected in series.
  • the trenches, in particular the P3 trenches are transparent, i.e. at least partially or completely translucent for the wavelength range of the radiation.
  • the method for producing optical structures in an adhesive layer can be used in the production of flexible photovoltaic elements, whereby the optical structures for light guidance and/or light scattering are introduced into the photovoltaic elements even in a continuous roll-to-roll (R2R) production process.
  • R2R roll-to-roll
  • a reflector is arranged to reflect the radiation from the first radiation source back into the adhesive layer, preferably to reflect the radiation in a certain angular range, whereby the optical structures in the adhesive layer are additionally formed by means of the radiation reflected by the reflector.
  • the photovoltaic element comprises a plurality of photovoltaic cells arranged next to one another and connected in series.
  • optical structures for deflecting light are created which, during regular operation of the photovoltaic element, deflect the sunlight incident on the front side towards the photoactive layers of the photovoltaic cells.
  • the optical structures are formed in the adhesive layer in a region between the photovoltaic cells which are inactive for the photovoltaic conversion of light into electrical current.
  • optical structures are obtained in the adhesive layer by means of reflected radiation.
  • the optical structures for directing light are preferably arranged in the areas of the photovoltaic element that are inactive for photovoltaic conversion. Elements trained .
  • the object of the present invention is also achieved by providing a use of the optical structures of an adhesive layer formed according to a method according to the invention for light guidance and/or light scattering in an optoelectronic component, preferably a photovoltaic element, particularly preferably a solar cell, in particular according to one of the previously described embodiments.
  • an optoelectronic component preferably a photovoltaic element, particularly preferably a solar cell
  • the optoelectronic component is a flexible optoelectronic component, in particular a flexible photovoltaic element.
  • a flexible optoelectronic component is understood to be in particular an optoelectronic component that is bendable and/or stretchable in a certain region.
  • the use of the photovoltaic cells of a flexible photovoltaic element in the roll-to-roll process as a shadow mask is particularly advantageous since in the roll-to-roll process an alignment of the laminate within a processing system is associated with a high technical outlay. Due to the method according to the invention, the optical structures to be formed are produced in a self-aligning manner in the adhesive layer, so that an alignment of the laminate before the optical structures are introduced can be omitted.
  • the object of the present invention is also achieved by providing an optoelectronic component with optical structures for light guidance and/or light scattering produced in a flat adhesive layer according to the method according to the invention, in particular according to one of the previously described embodiments.
  • the optoelectronic component has in particular the advantages which have already been achieved in connection with the method for producing optical structures in a flat adhesive layer and in the use of the optical structures produced according to a Optical structures of an adhesive layer for guiding light and/or scattering light in an optoelectronic component formed by the method according to the invention have been described.
  • Fig. 1 is a schematic representation of an embodiment of a method for producing optical structures in a planar, radiation-curable adhesive layer on a protective layer in cross section;
  • Fig. 2 is a schematic representation of an embodiment of a method for producing optical structures in a flat, radiation-curable adhesive layer between two protective layers in cross section;
  • Fig. 3 is a schematic representation of an embodiment of a method for producing optical structures in an adhesive layer arranged between photovoltaic cells and a protective layer of an optoelectronic component in cross section.
  • Fig. 1 shows a schematic representation of an embodiment of a method for producing optical structures 11. 4 in a flat, radiation-curable adhesive layer 11 on a protective layer 12.
  • the method for producing optical structures in a flat adhesive layer 11, wherein the adhesive layer 11 is curable by means of radiation 14, comprises the following steps: a) providing a first protective layer 12 (Fig. 1a); b) applying an adhesive layer 11 to the first protective layer 12 (Fig. 1b); c) pre-curing a selective partial region 11.2 of the adhesive layer 11 by irradiating the selective partial region 11.2 by means of radiation 14 from a first radiation source 24 over a first period of time with a first surface energy density, wherein the selective partial region 11.2 of the adhesive layer 11 is not completely cured (Fig.
  • the pre-curing of the selective partial area 11.2 of the adhesive layer 11 takes place in step c) over a first period of time of 2 s with a first surface energy density by means of radiation 14 from a UV laser as the first radiation source 24 with a wavelength of 380 nm, wherein the focused laser beam is guided, i.e. scanned, over the surface of the selective partial area 11.2 of the adhesive layer 11 by means of a galvano scanner (Fig. 1c).
  • the power of the UV laser and/or the scanning speed of the radiation 14 is regulated such that the first surface energy density is always in the range between 10 mJ/cm 2 and 50 mJ/cm 2 .
  • the selective partial area 11.2 of the adhesive layer 11 is not completely cured due to the choice of the parameters mentioned for irradiating the selective partial area 11.2 with the radiation 14 from the first radiation source.
  • the material of the adhesive layer 11 in this example is an acrylate, but other acrylates, in particular cyanoacrylates, epoxy resins, silicones or polyurethanes can also be used.
  • the adhesive layer 11 has a photoinitiator for polymerizing the adhesive layer 11 when irradiated with UV light.
  • the first time period and/or the first surface energy density is varied when irradiating individual areas within the selective partial area 11.2 of the adhesive layer 11 during pre-curing. This results in areas with different densities of the pre-cured adhesive layer 11, particularly within the selective partial area 11.2. In the present embodiment, areas different density in the selective subarea 11.2 due to the microbubbles formed by irradiation (not shown).
  • the entire adhesive layer 11 is cured by irradiating the entire surface by sweeping over it with the radiation 14 with the laser radiation set to a wavelength of 400 nm from the UV laser used as the first radiation source 24 over a second period of 10 s, the first radiation source 24 being used for the pre-curing in step c) and for the subsequent curing in step d).
  • the surface energy density introduced into the adhesive layer 11 is approximately a factor of 20 greater than during the pre-curing in step c), in particular the surface energy density is in the range between 200 mJ/cm 2 and 1000 mJ/cm 2 .
  • Fig. 2 shows a schematic representation of a further embodiment of a method for producing optical structures 11.4 in a flat, radiation-curable adhesive layer 11 between two protective layers 12, 13. Identical and functionally identical elements are provided with the same reference numerals, so that reference is made to the previous description.
  • a second protective layer 13 is applied to the adhesive layer 11 (Fig. 2 II).
  • the adhesive layer 11 is arranged for the material connection between the first protective layer 12 and the second protective layer 13.
  • the selective partial area 11.2 is not scanned by means of a laser, but by irradiation by means of a lamp as the first Radiation source 24 is pre-cured, the regions of the adhesive layer 11 lying outside the selective partial region 11.2 being covered.
  • a shadow mask 15 on the second protective layer 13, an opening 10 is defined for a selective partial region 11.2 of the adhesive layer 11 to be pre-cured.
  • the adhesive layer 11 is pre-cured in the region of the selective partial region 11.2 for a first period of time of 2s with a first surface energy density of 20 mJ/ cm2 , the selective partial region 11.2 of the adhesive layer 11 not being completely cured.
  • the refractive index in the selective partial region 11 . 2 is changed, while the remaining region 11 . 1 of the adhesive layer 11 remains untreated ( Fig. 2 I TT ).
  • the shadow mask 15 is removed and the entire adhesive layer 11 is cured by irradiating the entire surface with radiation 14 from the first radiation source 24 with a wavelength of 380 nm from a light-emitting diode (LED) or, alternatively, UV radiation filtered by a UV filter and a surface energy density of 500 mJ/cm 2 over a second period of 10 s. This creates the optical structures 11 . 4 within the fully cured adhesive layer 11 . 3 .
  • LED light-emitting diode
  • step f) in addition to the curing in step d), during or after step c), or during or after step d), preferably after step d), the adhesive layer (11) is cured by means of thermal treatment.
  • the optical structures 11. 4 represent visual information, preferably a logo, an image, a lettering, a number, and/or a code and/or the optical structures 11. 4 are optically functional structures for guiding light and/or scattering light, preferably an area with a different optical scattering effect compared to the area 11 . 3 of the adhesive layer 11 . lying outside the optical structures 11 . 4
  • Fig. 3 shows a schematic representation of an embodiment of a method for producing optical structures 11. 4 in an adhesive layer 11 arranged between photovoltaic cells 21 and a protective layer 12 of an optoelectronic component 20 in cross section.
  • the optoelectronic component 20 is a photovoltaic element 20 comprising photovoltaic cells 21 connected in series.
  • the optical structures 11.4 are produced in comparison to the previous embodiments in the adhesive layer 11 of an optoelectronic component 20, in particular an adhesive layer 11 between a protective layer 12 and photovoltaic cells 21 of the optoelectronic component 20.
  • the adhesive layer 11 is applied directly to the photovoltaic cells 21 between steps b) and c) or during step c) with the side facing away from the first protective layer 12.
  • the photovoltaic element 20 comprises the photovoltaic cells 21 arranged on a substrate 18, each of which has a base electrode 17, a cover electrode 16 and a photoactive layer 22 arranged between the base electrode 17 and the cover electrode 16.
  • Adjacent photovoltaic cells 21 are connected in series via the base electrode 17 and the cover electrode 16, the base electrodes 17 of adjacent photovoltaic cells 21 being electrically separated from one another by a structure, the so-called Pl trench.
  • Adjacent photovoltaic cells 21 are electrically separated from one another by means of a structure, the so-called P3 trench 23, at their cover electrodes 16. This structure, i.e. the P3 trench 23, is largely transparent to the radiation 14 of the first radiation source 24.
  • the photoactive layers are connected by means of a Structuring, the so-called P2 trench, electrically separated from each other, via which adjacent base electrodes 17 are connected to cover electrodes 16.
  • the photovoltaic cells 21 are not active. Sunlight falling on the photovoltaic element 20 in this area is absorbed or reflected and is not accessible for the absorption of light and thus for the generation of electricity (in Fig. 3, the protective layer 12 defines the side facing the sun, from which the sun shines when the photovoltaic element 20 is in normal operation).
  • the protective layer 12 defines the side facing the sun, from which the sun shines when the photovoltaic element 20 is in normal operation).
  • optical structures 11.4 are created on the front side, i.e. the side of the photovoltaic element 20 that is intended to face the sun.
  • a selective partial region 11.2 of the adhesive layer 11 is pre-cured by irradiation using the radiation 14 of a first radiation source (24), the cover electrodes 16 of the photovoltaic cells 21 being used as a shadow mask to cover the region 11.1 of the adhesive layer lying outside the selective partial region 11.2.
  • Regions 11.1 of the adhesive layer 11 lying outside the selective partial region 11.2 of the adhesive layer 11 are covered by the arrangement of the cells 21 connected in series, so that the selective partial region 11.2 2 of the adhesive layer 11, which is accessible for the radiation 14 through the arrangement between the cells 21, is pre-cured.
  • the radiation 14 is radiated from the direction of the side of the photovoltaic element 20 facing away from the sun during normal operation of the photovoltaic element 20. As a result, the radiation 14 only reaches the areas of the adhesive layer 11 (facing the sun during normal operation of the photovoltaic element 20) through the P3 trenches 23, which are in the area of the P3 Trenches 23 are arranged opposite the photovoltaic cells 21 with respect to the substrate 18.
  • the radiation 14 of the first radiation source 24 emerging from the photovoltaic element 20 via the first protective layer 12 is directed back through the first protective layer 12 into the adhesive layer 11. Due to the angular arrangement of the reflector 19 in this embodiment in relation to the photovoltaic element 20, the radiation 14 reflected back into the adhesive layer 11 is directed into a region of the adhesive layer 11 that is directly adjacent to the region of the adhesive layer 11 that is directly irradiated by the radiation 14 radiating into the adhesive layer 11 through the P3 trench and the base electrode 17 and substrate 18 (Fig. 3a "below" the connection of the cover electrode 16 to the base electrode 17 of the adjacent photovoltaic cell 21), whereby the selective partial region 11.2 of the adhesive layer 11 also includes this region.
  • the incident sunlight is scattered or deflected into the photoactive layers of the photovoltaic cells 21 during active operation of the photovoltaic element 20 and can thus be absorbed by the photoactive layer 22 and can be used to generate electricity.
  • these optical structures 11.4 to be effective are, their precise alignment with the photovoltaic cells 21 or the P3 trenches 23 is necessary.
  • the invention uses the existing structure of the photovoltaic element 20, namely in this embodiment the P3 trenches 23 of the photovoltaic element 20, with the cover electrodes 16 mainly acting as a shadow mask.
  • This embodiment relates in particular to an optoelectronic component 20 produced in a roll-to-roll process, in particular an organic photovoltaic element 20.

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne un procédé de création de structures optiques dans une couche adhésive plane durcissable par rayonnement (11), ledit procédé comprenant les étapes suivantes : (a) fournir une première couche de protection (12); (b) appliquer une couche adhésive (11) sur la première couche de protection (12); (c) pré-durcir une sous-région sélective (11.2) de la couche adhésive (11) par irradiation de la sous-région sélective (11.2) avec un rayonnement (14) provenant d'une première source de rayonnement (24) sur une première période de temps avec une première densité d'énergie surfacique, la sous-région sélective (11.2) de la couche adhésive (11) n'étant pas complètement durcie; (d) durcir la couche adhésive (11) en irradiant la totalité de la couche adhésive (11) avec un rayonnement (14) provenant de la première source de rayonnement (24) et/ou d'une seconde source de rayonnement (25) sur une seconde période de temps avec une seconde densité d'énergie surfacique; et (e) obtenir une couche adhésive durcie (11.3) ayant les structures optiques (11.4), la sous-région sélective (11.2) avec structures optiques (11.4) présentant un indice de réfraction différent par rapport à une région de la couche adhésive durcie (11.3) à l'extérieur de la sous-région sélective.
PCT/DE2024/100582 2023-06-30 2024-06-28 Procédé de création de structures optiques dans une couche adhésive plane Pending WO2025002513A1 (fr)

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DE102023117335.9 2023-06-30
DE102023117335.9A DE102023117335A1 (de) 2023-06-30 2023-06-30 Verfahren zur Erzeugung von optischen Strukturen in einer flächig ausgebildeten Klebeschicht

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WO2025002513A1 true WO2025002513A1 (fr) 2025-01-02

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WO2001084544A1 (fr) * 2000-05-04 2001-11-08 Basf Aktiengesellschaft Utilisation de compositions polymeres reticulables sous rayonnement comme support d'enregistrement de donnees
US7046904B2 (en) 2002-09-10 2006-05-16 Sscp Co., Ltd. UV-curable resin composition for cladding optical fiber
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EP1611484B1 (fr) 2003-03-19 2021-11-10 Heliatek GmbH Composant photo-actif presentant des couches organiques
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DE102009007779C5 (de) * 2009-02-04 2017-07-27 Bundesdruckerei Gmbh Verfahren zur Herstellung eines ohne technische Hilfsmittel visuell wahrnehmbaren Sicherheitsmerkmals, Sicherheitsmerkmal für kunststoffbasierendes Wert- oder Sicherheitsdokument sowie Dokument mit wenigstens einem solchen Sicherheitsmerkmal
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EP0054157B1 (fr) 1980-12-16 1985-10-02 Siemens Aktiengesellschaft Cellule solaire à rendement élevé
EP0904853A2 (fr) * 1997-09-29 1999-03-31 Basf Aktiengesellschaft Procédé de réticulation de couches d'adhésifs réticulables aux rayonnements
EP1130047A1 (fr) * 2000-02-25 2001-09-05 Beiersdorf Aktiengesellschaft Durcissement d'adhésifs polyacryliques avec des rayons d'électrons
WO2001084544A1 (fr) * 2000-05-04 2001-11-08 Basf Aktiengesellschaft Utilisation de compositions polymeres reticulables sous rayonnement comme support d'enregistrement de donnees
US7046904B2 (en) 2002-09-10 2006-05-16 Sscp Co., Ltd. UV-curable resin composition for cladding optical fiber
EP1611484B1 (fr) 2003-03-19 2021-11-10 Heliatek GmbH Composant photo-actif presentant des couches organiques
US10385210B2 (en) 2017-06-20 2019-08-20 Momentive Performance Materials Inc. Curable silicone composition and applications and uses thereof
DE102021103404A1 (de) 2021-02-12 2022-08-18 Bundesdruckerei Gmbh Dokument mit Volumenhologramm zum Speichern eines Sicherheitsmerkmals

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