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WO2025097684A1 - Ensemble d'atomisation et son procédé de fabrication, atomiseur et appareil de génération d'aérosol - Google Patents

Ensemble d'atomisation et son procédé de fabrication, atomiseur et appareil de génération d'aérosol Download PDF

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Publication number
WO2025097684A1
WO2025097684A1 PCT/CN2024/091700 CN2024091700W WO2025097684A1 WO 2025097684 A1 WO2025097684 A1 WO 2025097684A1 CN 2024091700 W CN2024091700 W CN 2024091700W WO 2025097684 A1 WO2025097684 A1 WO 2025097684A1
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WO
WIPO (PCT)
Prior art keywords
electrode
heating
heating circuit
substrate
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/091700
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English (en)
Chinese (zh)
Inventor
严鑫洋
陈志超
陈政
陈柳城
付尧
海涛
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Humble Grace Ltd
Original Assignee
Humble Grace Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Humble Grace Ltd filed Critical Humble Grace Ltd
Publication of WO2025097684A1 publication Critical patent/WO2025097684A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/46—Shape or structure of electric heating means
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A24F40/48—Fluid transfer means, e.g. pumps
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/50—Control or monitoring
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/70—Manufacture

Definitions

  • the present application relates to the technical field of electronic atomization, and in particular to an atomization component and a manufacturing method thereof, an atomizer and an aerosol generating device.
  • Electronic heating atomization components are usually based on cotton cores and ceramic cores.
  • cotton core atomization components are assembled by combining rigid mesh cores and flexible oil-conducting cotton.
  • Traditional manual production lines have low production efficiency and poor assembly consistency, resulting in poor taste consistency of electronic atomization devices.
  • the mesh core is prone to bending and breaking during the winding process, causing short circuits and open circuits.
  • the local heating temperature of the mesh core is high, and direct contact with various types of organic cotton is prone to burnt, dry burning and other undesirable phenomena.
  • Ceramic atomization components are subject to defects in the molding process of the material itself, and the precision control of material size and porosity is poor. In addition, the surface roughness of the ceramic substrate is relatively high. When printing the heating electrode in the later stage, various electrode morphology defects are easily generated, affecting the electrode resistance value, reducing the service life of the atomization component, and the defective rate is relatively high.
  • MEMS atomizer assembly a silicon-based semiconductor heating atomizer assembly device solution based on micro-nano manufacturing technology
  • MEMS atomizer assemblies mainly control power by changing the output voltage of the atomizer assembly power supply to achieve a variety of suction experiences, but the maximum battery voltage is often limited and the power adjustment range is small.
  • the atomizer assembly and its manufacturing method, atomizer and aerosol generating device of the present application can solve the problem that the atomizer assembly cannot change the suction taste over a large range.
  • an atomization assembly including a substrate, at least two heating circuits and an electrode group.
  • the heating circuit is arranged on the substrate, and the heating circuit can generate heat after being energized; the number of the electrode groups is at least two, and the electrode groups are connected to the heating circuits, and the electrode groups are used to selectively be electrically connected to an external circuit, so that when at least one of the electrode groups is electrically connected to the external circuit, the corresponding heating circuit generates heat, so that the atomization assembly generates different heating powers.
  • each electrode group includes a first electrode and a second electrode, and each heating circuit is connected to a first electrode and a second electrode.
  • the second electrodes connected to at least two different heating circuits share a common contact plate, or at least two different heating circuits share the same second electrode.
  • At least one heating circuit comprises a plurality of selectively connectable contacts, the first electrode and/or the second electrode can be selectively electrically connected to the contacts, and at least a portion of the heating circuit is electrically connected to an external circuit.
  • the heating circuit is a ring coil
  • the substrate is provided with a mounting surface for mounting the heating circuit
  • the heating circuits are nested in sequence on the mounting surface, and two adjacent heating circuits are insulated from each other.
  • the projections of the outer wall of the heating circuit located on the inner side and the inner wall of the heating circuit located on the outer side within the installation surface are adjacent; and/or the projections of at least two heating circuits on the central axis of the substrate are staggered along the central axis.
  • the heights of at least two heating circuits increase sequentially from the inside to the outside or from the outside to the inside in the direction of the central axis.
  • an insulating layer is provided between at least one heating circuit and the substrate, and the insulating layers of the heating circuits adjacent to each other have different heights, so that the two adjacent heating circuits are located at different heights.
  • the side wall of the first electrode contacts the side wall of the heating circuit; the height of the first electrode away from the substrate is consistent with the height of the heating circuit connected to the first electrode away from the substrate.
  • an insulating layer is provided between two adjacent heating circuits along the direction of the plane where the mounting surface is located.
  • the present application also provides a method for manufacturing an atomizer assembly, comprising:
  • Step S1 depositing a previous heating circuit and an electrode group connected to the previous heating circuit on a substrate;
  • Step S2 after depositing the previous heating circuit, depositing the next heating circuit on the periphery of the previous heating circuit, and depositing an electrode group connected to the next heating circuit;
  • Step S3 Repeat step S2 until a predetermined number of heating circuits and electrode groups are deposited on the substrate.
  • the deposited electrode group includes a first electrode and a second electrode, and in steps S1 and S2, only the first electrode in the electrode group is deposited.
  • step S3 after a predetermined number of heating circuits and first electrodes are deposited in step S3, a second electrode connecting all heating circuits is deposited.
  • an insulating layer is first deposited at a location where the next heating circuit is predetermined to be deposited; and then the next heating circuit is deposited on a surface of the insulating layer away from the substrate.
  • the height of the insulation layer corresponding to the previous heating circuit is different from the height of the insulation layer corresponding to the next heating circuit.
  • the present application also provides an atomizer, comprising: an atomization assembly of any of the above embodiments, and an air channel arranged inside the atomizer, wherein air holes are arranged on the substrate, and the air holes pass through the substrate and are connected to the air channel.
  • an aerosol generating device comprising: an atomization assembly of any of the above embodiments, and a power supply mechanism for connecting the electrode group of the atomization assembly.
  • the present application provides an atomization assembly, including a substrate, at least two heating circuits, and an electrode group.
  • the heating circuit is arranged on the substrate, and the heating circuit can generate heat after being energized; the number of the electrode groups is at least two, and the electrode groups are connected to the heating circuit, and the electrode groups are used to selectively connect to an external circuit, so that when at least one of the electrode groups is electrically connected to the external circuit, the corresponding heating circuit generates heat, so that the atomization assembly generates different heating powers.
  • the atomization assembly can selectively connect to the external circuit through the electrode group to produce different atomization effects, there is no need to change the suction taste by adjusting the battery power range, and the adjustable resistance range is large, so the suction taste can be changed over a wide range.
  • FIG1 is a schematic structural diagram of an atomization assembly provided in one embodiment of the present application.
  • FIG2 is a schematic structural diagram of FIG1 from another perspective
  • FIG3 is a cross-sectional view of an atomization assembly provided in one embodiment of the present application.
  • FIG4 is a schematic structural diagram of an atomization assembly provided in another embodiment of the present application.
  • FIG5 is a schematic structural diagram of FIG4 from another perspective
  • FIG6 is a schematic diagram of a method for manufacturing an atomization assembly provided in an embodiment of the present application.
  • FIG7 is a schematic diagram of the structure of an atomizer provided in one embodiment of the present application.
  • FIG. 8 is a schematic diagram of the structure of a base provided in an embodiment of the present application.
  • Atomizer assembly 10, substrate: 11, mounting surface: 111, air hole: 112, heating circuit: 12, first annular coil: 121, second annular coil: 122, third annular coil: 123, fourth annular coil: 124, fifth annular coil: 125, electrode group: 13, first electrode: 131, first electrode circuit: 1311, first electrode contact disc: 1312, first sub-electrode circuit: 13111, second sub-electrode circuit: 13112, third sub-electrode circuit: 13113, fourth sub-electrode circuit: 13114, fifth sub-electrode circuit: 13115, first sub-electrode contact disc: 13121, second sub-electrode contact disc: 13122, third sub-electrode circuit: 13113, fourth sub-electrode circuit: 13114, fifth sub-electrode circuit: 13115, first sub-electrode contact disc: 13121, second sub-electrode contact disc: 13122, third sub-electrode circuit: 13115, first sub-electrod
  • connection and “coupling” mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings).
  • the present application provides an atomization assembly 10 .
  • the atomization assembly 10 includes a substrate 11 , a heating circuit 12 , and an electrode group 13 .
  • the substrate 11 is a silicon-based material, for example, it can be a single crystal silicon or polycrystalline silicon material. In some embodiments, the substrate 11 does not have the ability to conduct electricity.
  • a mounting surface 111 is provided on the substrate 11, and the heating circuit 12 and the electrode group 13 are both arranged on the mounting surface 111. In the present application, the heating circuit 12 and the electrode group 13 can be deposited on the mounting surface 111 of the substrate 11 by vapor deposition or electromagnetic sputtering deposition process.
  • the material of the heating circuit 12 can be a metal material with a certain resistance value and high temperature resistance, for example, it can include at least one of nickel-chromium alloy, stainless steel material, and iron-chromium-aluminum alloy; the material of the electrode group 13 can be a metal or alloy material with high electrical conductivity, for example, it can include at least one of gold, silver, and copper.
  • the heating circuit 12 is disposed on the substrate 11, and the heating circuit 12 can generate heat after being powered on.
  • the number of the heating circuits 12 is at least two. In some embodiments, in order to meet the situation where multiple heating circuits 12 are simultaneously connected to an external circuit, each heating circuit 12 is insulated from each other.
  • the number of the electrode groups 13 is at least two, and the electrode groups 13 are connected to the heating circuits 12 in a one-to-one correspondence, that is, the number of the electrode groups 13 can be the same as the number of the heating circuits 12.
  • At least two electrode groups 13 are used to selectively electrically connect to an external circuit, so that when at least one of the electrode groups 13 is electrically connected to the external circuit, the corresponding heating circuit 12 generates heat, so that the atomizer assembly 10 generates different heating powers. At least two electrode groups 13 are used to selectively electrically connect to an external circuit, which means that any one of the electrode groups 13 can be electrically connected to the external circuit, so that any one of the heating circuits 12 generates heat; any multiple electrode groups 13 can be electrically connected to the external electrode at the same time, so that any multiple heating circuits 12 generate heat at the same time; any one of the electrode groups 13 can be electrically connected to the external circuit, so that any multiple heating circuits 12 generate heat. Moreover, when a certain heating circuit 12 generates heat, it can be that all of the heating circuit 12 generates heat, or it can be that part of the heating circuit 12 generates heat.
  • each electrode group 13 includes a first electrode 131 and a second electrode 132, and each heating circuit 12 is connected to a group of first electrodes 131 and second electrodes 132.
  • the first electrode 131 is a positive electrode or a negative electrode
  • the second electrode 132 is an electrode with opposite polarity to the first electrode 131.
  • the first electrode 131 may include a first electrode circuit 1311 and a first electrode contact pad 1312, and the two ends of the first electrode circuit 1311 are respectively connected to the heating circuit 12 and the first electrode contact pad 1312.
  • the first electrode contact pad 1312 is arranged at the edge of the substrate 11 so that the heating circuit 12 on the substrate 11 is connected to the external circuit as a whole;
  • the second electrode 132 includes a second electrode circuit 1321 and a second electrode contact pad 1322, and the two ends of the second electrode circuit 1321 are respectively connected to the heating circuit 12 and the second electrode contact pad 1322, and the second electrode contact pad 1322 is arranged at the edge of the substrate 11.
  • At least one heating circuit 12 may include a plurality of selectively connectable contacts. When the first electrode 131 and/or the second electrode 132 are connected to a heating circuit 12, they may be selectively electrically connected to the contacts on the heating circuit 12 so that a portion of the heating circuit 12 is electrically connected to an external circuit, or the entire heating circuit 12 is electrically connected to an external circuit.
  • the heating circuit 12 is a ring-shaped coil, for example, a circular ring-shaped coil, or a polygonal ring-shaped coil.
  • the heating circuit 12 may also be an open arc shape.
  • the heating circuit 12 is a circular ring-shaped coil, and the shape of the circular ring-shaped coil is conducive to the uniform distribution of heat and prevents heat concentration at the inflection point of the shape of the heating circuit 12.
  • the shape of the heating circuit 12 may not be a ring-shaped coil, but may be other shapes.
  • the heating circuit 12 adopts an annular coil
  • at least two annular coils are nested in sequence on the mounting surface 111, and two adjacent heating circuits 12 are insulated from each other.
  • the central axes of at least two annular coils may coincide with each other, that is, at least two annular coils have a common central axis.
  • at least two annular coils may also be eccentrically nested.
  • Such an arrangement in which multiple annular coils are nested in sequence can reduce the size of the entire atomization assembly 10.
  • the inner diameters of at least two annular coils are different, and the outer diameters of at least two annular coils are different.
  • the thickness of the annular coils may be the same, thereby making the lengths of the at least two annular coils in the circumferential direction different, so that the resistances of each annular coil are different.
  • an insulating layer may be provided between two adjacent heating circuits 12 along the direction of the plane where the mounting surface 111 is located.
  • the insulating layer is also roughly annular, forming a structure of a ring of heating circuit, a ring of insulating layer, and a ring of heating circuit in sequence, thereby insulating the heating circuits 12 in the direction of the plane where the mounting surface 111 is located.
  • the projections of the outer wall of the heating circuit 12 located on the inner side and the inner wall of the heating circuit 12 located on the outer side in the mounting surface 111 are adjacent, that is, the projections of the outer wall of the heating circuit 12 located on the inner side and the inner wall of the heating circuit 12 located on the outer side in the mounting surface 111 overlap, so that the arrangement of at least two heating circuits 12 is more compact.
  • the projections of at least two heating circuits 12 on the central axis of the substrate 11 are staggered along the central axis.
  • the central axis of the substrate 11 extends approximately in the vertical direction.
  • the projections staggered along the central axis can also refer to different heights in the vertical direction, so that there is no direct contact part between the two adjacent annular coils, and mutual insulation is achieved.
  • the projections of at least two annular coils on the central axis of the substrate 11 are staggered along the central axis, which means that the two adjacent projections can be completely separated, or the boundaries of the two adjacent projections can overlap, but the two adjacent projection parts do not overlap.
  • the height of at least two heating circuits 12 increases successively from the inside to the outside or from the outside to the inside in the direction of the central axis.
  • the height in the present application refers to: the distance away from the mounting surface 111 is defined as the height, with the mounting surface 111 as the reference surface.
  • the heating circuit 12 has a predetermined thickness, for the case where the heating circuits 12 are directly adjacent, the height of one heating circuit 12 higher than the height of another heating circuit 12 can be defined as: the height of the lower surface of the heating circuit 12 with a higher height away from the mounting surface 111 is higher than the height of the upper surface of the other heating circuit 12 with a lower height away from the mounting surface 111.
  • the height of one heating circuit 12 higher than the height of the other heating circuit 12 can also be defined as: the height of the upper surface of the heating circuit 12 with a higher height away from the mounting surface 111 is higher than the height of the upper surface of the other heating circuit 12 with a lower height away from the mounting surface 111. Then, on the basis of satisfying this condition, the lower surface of the higher heating circuit 12 in the height direction can be lower than the upper surface of the lower heating circuit 12.
  • an insulating layer 14 is provided between at least one heating circuit 12 and the substrate 11.
  • the material of the insulating layer 14 may be, for example, silicon dioxide.
  • At least two first electrode lines 1311 may be arranged in parallel and spaced apart, and the extension direction of the first electrode lines 1311 is parallel to two opposite edges of the substrate 11, and at least two first electrode contact pads 1312 are arranged in spaced apart on the same edge of the substrate 11.
  • the external circuit may be electrically connected only to the electrode contact pads located at the same edge of the substrate 11 to prevent the wiring from being chaotic or affecting the heating circuit 12.
  • the side wall of the first electrode 131 contacts the side wall of the heating circuit 12 to achieve the connection between the first electrode 131 and the heating circuit 12.
  • the height of the side of the first electrode 131 away from the substrate 11 is consistent with the height of the side of the heating circuit 12 connected to the first electrode 131 away from the substrate 11, thereby improving the connection stability between the heating circuit 12 and the first electrode 131.
  • the side of the first electrode 131 close to the substrate 11 contacts the substrate 11, and the first electrode 131 and the heating circuit 12 not connected to the first electrode 121 are isolated by the insulating layer 14.
  • the second electrode 132 has a surface close to the substrate 11 in contact with each heating circuit 12 , and a surface away from the substrate 11 is a plane.
  • the height of the surface away from the substrate 11 can be flush with the height of the surface of the highest heating circuit 12 away from the substrate 11 .
  • the atomizer assembly 10 includes a heating circuit area and an electrode area, wherein the heating circuit area is the area where all heating circuits 12 are located, and the electrode area is the area excluding the heating circuits 12.
  • the atomizer assembly 10 also includes a packaging layer 15.
  • the packaging layer 15 covers the substrate 11 in the electrode area and the upper layer of the first electrode circuit 1311 and the second electrode circuit 1321, and exposes the first electrode contact pad 1312 and the second electrode contact pad 1322.
  • the side of the packaging layer 15 away from the substrate 11 may be a plane.
  • the packaging layer 15 is used to prevent the external environment from corroding the electrode circuit, and at the same time can reduce the heat loss of the atomizer assembly 10.
  • the material of the packaging layer 15 may be a non-conductive material with low thermal conductivity, for example, the material of the packaging layer 15 may be silicon nitride.
  • the substrate 11 is provided with air holes 112, and the air holes 112 penetrate the substrate 11.
  • the air holes 112 are provided on the substrate 11 to facilitate the aerosol after atomization on the surface of the heating circuit 12 to flow under the action of the gas passing through the air holes 112.
  • the present application also provides a method for manufacturing an atomizer assembly, wherein the deposition in the method for manufacturing an atomizer assembly may refer to a vapor deposition process or an electromagnetic sputtering deposition process.
  • the method for manufacturing an atomizer assembly includes:
  • Step S1 depositing a previous heating circuit and an electrode group 13 connected to the previous heating circuit on a substrate 11;
  • the method may further include step S0 : chemically etching pores 112 on the substrate 11 .
  • Step S2 after depositing the previous heating circuit, depositing the next heating circuit on the periphery of the previous heating circuit, and depositing the electrode group 13 connected to the next heating circuit.
  • Step S3 repeat step S2 until a predetermined number of heating circuits 12 and electrode groups are deposited on the substrate 11 .
  • the deposited electrode group 13 includes a first electrode 131 and a second electrode 132 . In one embodiment, only the first electrode 131 in the electrode group 13 is deposited in steps S1 and S2 .
  • step S3 after a predetermined number of heating circuits 12 and first electrodes 131 are deposited in step S3 , a second electrode 132 connecting all heating circuits is deposited.
  • an insulating layer 14 is first deposited at a location where the next heating circuit is predetermined to be deposited, and then the next heating circuit is deposited on a surface of the insulating layer 14 away from the substrate 11 .
  • the height of the insulating layer 14 corresponding to the previous heating circuit is different from the height of the insulating layer 14 corresponding to the next heating circuit.
  • the insulating layer 14 corresponding to the heating circuit 12 refers to the insulating layer 14 between the heating circuit 12 and the substrate 11 .
  • FIG. 6 is a diagram of chemically etching the pores 112 on the substrate 11.
  • FIG. 6 (b) is a diagram of depositing the first ring coil 121 on the substrate 11 and the first sub-electrode circuit 13111 (not shown in FIG. 6 ) and the first sub-electrode contact pad 13121 (not shown in FIG. 6 ) corresponding to the first ring coil 121.
  • FIG6(c) shows a first insulating layer 141 being deposited on the substrate 11 and the first sub-electrode line 13111 on the periphery of the first annular coil 121.
  • FIG6(d) shows a second annular coil 122 being deposited on the side of the first insulating layer 141 away from the substrate 11, and a second sub-electrode line 13112 (not shown in FIG6 ) and a second sub-electrode contact pad 13122 (not shown in FIG6 ) connected to the second annular coil 122 being deposited on the substrate 11 on the outside of the second annular coil 122.
  • FIG6(e) shows a plurality of insulating layers 14, a plurality of annular coils, a plurality of sub-electrode lines, and a plurality of second sub-electrode contact pads 13122, as well as a second electrode line 1321 and a second electrode contact pad 1322.
  • the specific process of Figure 6(e) is as follows:
  • the second annular coil 122, the second sub-electrode line 13112 and the second sub-electrode contact pad 13122 are deposited as shown in Figure 6(d), a circle of second insulating layer 142 is first deposited on the substrate 11 outside the second annular coil 122 and the first sub-electrode line 13111 and the second sub-electrode line 13112, and the third annular coil 123 is deposited on the side of the second insulating layer 142 away from the substrate 11, and the third sub-electrode line 13113 and the third sub-electrode contact pad 13123 connected to the third annular coil 123 are deposited on the substrate 11 outside the third annular coil 123.
  • a circle of third insulating layer 143 is deposited on the substrate 11 and the first sub-electrode line 13111, the second sub-electrode line 13112 and the third sub-electrode line 13113 outside the third annular coil 123, the fourth annular coil 124 is deposited on the side of the third insulating layer 143 away from the substrate 11, and the fourth sub-electrode line 13114 and the fourth sub-electrode contact pad 13124 connected to the fourth annular coil 124 are deposited on the substrate 11 outside the fourth annular coil 124.
  • a circle of fourth insulating layer 144 is deposited on the substrate 11 outside the fourth annular coil 124 and the first sub-electrode line 13111, the second sub-electrode line 13112, the third sub-electrode line 13113 and the fourth sub-electrode line 13114, the fifth annular coil 125 is deposited on the side of the fourth insulating layer 144 away from the substrate 11, and the fifth sub-electrode line 13115 and the fifth sub-electrode contact pad 13125 connected to the fifth annular coil 125 are deposited on the substrate 11 outside the fifth annular coil 125.
  • a second electrode line 1321 connected to the first annular coil 121 , the second annular coil 122 , the third annular coil 123 , the fourth annular coil 124 , and the fifth annular coil 125 is deposited, and a second electrode contact pad 1322 connected to the second electrode line 1321 is deposited on the substrate 11 .
  • Figure 3 can also be used to simultaneously form an unpackaged atomization component 10 after depositing the second electrode contact pad 1322, and deposit a covering packaging layer 15 on the surface of the unpackaged atomization component 10 except for the annular coil, the sub-electrode contact pad and the second electrode contact pad 1322.
  • the manufacturing method of the atomizer component of the present application can be based on conventional semiconductor processes such as deposition to design a molding process flow of the resistance-adjustable atomizer component, thereby solving the feasibility problem of producing resistance-adjustable MEMS atomizer components and facilitating large-scale production of resistance-adjustable MEMS atomizer components.
  • the atomizer assembly 10 is provided with an air hole 112. Specifically, the air hole 112 passes through the substrate 11. The two ends of the air hole 112 are connected to the air inlet channel 213 and the atomization channel 214. The gas entering from the air inlet channel 213 passes through the air hole 112, and can carry the aerosol generated by the heating circuit 12 around the air hole 112 and flow out of the atomizer 20 from the atomization channel 214, so that the user can inhale the aerosol.
  • the atomizer assembly 10 has the same or similar structure as the atomizer assembly 10 described in any of the above embodiments, and can achieve the same or similar effects, which will not be repeated here.
  • the housing assembly 21 includes a housing 216 and a base 217, wherein the housing 216 is provided with an oil storage tank 211 and an atomization channel 214.
  • the base 217 is provided with an air inlet channel 213, and the base 217 is mounted on the bottom of the housing 216 and cooperates with the housing 216 to form a mounting cavity 212.
  • the atomizer 20 also includes a conductive column 22, one end of which is connected to the electrode group 13 of the atomizer assembly 10, and the other end passes through the base 217 and is exposed from the end surface of the base 217 away from the oil storage tank 211, so that the base 217 of the atomizer 20 is convenient for direct electrical contact and electrical connection with an external power supply assembly.
  • the conductive column 22 may include a first conductive column 221 and a second conductive column 222, the first conductive column 221 is used to be electrically connected to the first electrode contact disc 1312, and the second conductive column 222 is used to be electrically connected to the second electrode contact disc 1322.
  • the number of first conductive columns 221 is the same as the number of first electrode contact discs 1312
  • the number of second conductive columns 222 is the same as the number of second electrode contact discs 1322.
  • the atomizer 20 further includes an oil guide 23 and an oil suction member 24.
  • the oil guide 23 is disposed in the oil inlet channel 215 and in contact with the heating circuit 12 of the atomizer assembly 10.
  • the oil guide 23 can guide the oil and prevent leakage, and is conducive to transferring the substrate to be atomized in the oil storage bin 211 to the surface of the atomizer assembly 10 for atomization.
  • the oil suction member 24 is disposed in the air hole 112. The oil suction member 24 can prevent the oil from leaking from the air flow channel, and can also absorb the aerosol that is not completely atomized.
  • the present application also proposes an aerosol generating device, which includes the atomizing assembly 10, and also includes a power supply mechanism connected to the electrode group of the atomizing assembly 10, so as to be connected to the corresponding optional electrode group, so as to supply power to the heating circuit 12 to generate different heating areas or heating powers.
  • the power supply mechanism included in the aerosol generating device can also be a case where the output voltage can be adjusted, for example, it can be in the form of multiple gradient voltage outputs, then ordinary technicians in this field can combine the adjustable power supply mechanism with the adjustable number of heating circuits 12 connected according to the content disclosed in this application to form more output power situations.

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Abstract

L'invention concerne un ensemble d'atomisation (10) et son procédé de fabrication, un atomiseur (20) et un appareil de génération d'aérosol. L'ensemble d'atomisation (10) comprend un substrat (11), et au moins deux circuits de chauffage (12) et des ensembles électrodes (13). Les circuits de chauffage (12) sont disposés sur le substrat (10), et les circuits de chauffage (12) peuvent générer de la chaleur après avoir été mis sous tension. Il y a au moins deux ensembles électrodes (13), chaque ensemble électrode (13) étant connecté à un circuit de chauffage (12), et les ensembles électrodes (13) sont utilisés pour se connecter électriquement de manière sélective à un circuit externe, de telle sorte que lorsqu'au moins l'un des ensembles électrodes (13) soit électriquement connecté à un circuit externe, le circuit de chauffage correspondant génère de la chaleur, de telle sorte que l'ensemble d'atomisation (10) génère différentes puissances de chauffage.
PCT/CN2024/091700 2023-11-10 2024-05-08 Ensemble d'atomisation et son procédé de fabrication, atomiseur et appareil de génération d'aérosol Pending WO2025097684A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202311498464.5 2023-11-10
CN202311498464.5A CN117547067A (zh) 2023-11-10 2023-11-10 雾化组件及其制造方法、雾化器和气溶胶生成装置

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CN117547067A (zh) * 2023-11-10 2024-02-13 谦逊恩典有限公司 雾化组件及其制造方法、雾化器和气溶胶生成装置

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